Global Intelligent Platform Product Manual Tuya ZS3L Zigbee Module Version: 1.0.1 Date: 2019-12-18 No.: TY-Zigbee-DS022 1. Product Overview ZS3L is a low-power embedded Zigbee module that Tuya has developed. It consists of a highly integrated RF processor chip (EFR32MG21A020F768IM32-B) and several peripheral components, with an embedded 802.15.4 PHY/MAC Zigbee network protocol stack and robust library functions. ZS3L is embedded with a 32-bit low-power Arm Cortex-M33 core, 768 KB flash memory, and 64 KB random-access memory (RAM), and has extensive peripherals. ZS3L is a FreeRTOS platform that integrates all the function libraries of the Zigbee MAC and TCP/IP protocols. You can develop embedded Zigbee products as required. 1.1 Features Embedded low-power 32-bit Arm Cortex-M33 processor, which provides digital signal processor (DSP) instructions and floating-point units (FPUs) and can also function as an application processor Clock rate: 80 MHz Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART), and one analog-to-digital converter (ADC) White ink, black silkscreen; mounted onto a PCB by using an SMT placement machine or through-hole mounted onto the PCB through a pin header Zigbee features Working voltage: 2.0 V to 3.8 V 802.15.4 MAC/PHY Channels 11 to 26 at 2.400 GHz to 2.483 GHz, 250 kbit/s air interface rate Maximum output power: +20 dBm; dynamic output power: > 35 dB Runtime power consumption: 60 A/MHz; current in sleep mode: 5 A Proactive device pairing for terminals Hangzhou Tuya Information Technology Co., Ltd. 1 V1.0.1 ZS3L Datasheet Onboard PCB antenna Working temperature: 20C to +105C AES-128 or AES-256 hardware encryption 1.2 Application Scenarios Intelligent building Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus Hangzhou Tuya Information Technology Co., Ltd. 2 V1.0.1 ZS3L Datasheet Change History No. Date Change Description 2019-12-10 This is the first release. 2019-12-18 Updated pin 3 description and antenna gain. 1 1 Version After Change 1.0.0 1.0.1 Hangzhou Tuya Information Technology Co., Ltd. 3 V1.0.1 ZS3L Datasheet Contents 1. Product Overview ............................................................................................................ 1 1.1 Features .................................................................................................................. 1 1.2 Application Scenarios ............................................................................................. 2 2. Module Interfaces ............................................................................................................ 6 2.1 Dimensions and Footprint ...................................................................................... 6 2.2 Interface Pin Definition ........................................................................................... 6 2.3 Test Pin Definition ................................................................................................... 7 3. Electrical Parameters ....................................................................................................... 9 3.1 Absolute Electrical Parameters .............................................................................. 9 3.2 Working Conditions ................................................................................................ 9 3.3 RF Current Consumption ..................................................................................... 10 3.4 Working Current ................................................................................................... 10 4. RF Features ................................................................................................................... 11 4.1 Basic RF Features ................................................................................................ 11 4.2 TX Performance ................................................................................................... 11 4.3 RX Performance ................................................................................................... 11 5. Antenna Information ....................................................................................................... 12 5.1 Antenna Type ........................................................................................................ 12 5.2 Antenna Interference Reduction ........................................................................... 12 6. Packaging Information and Production Instructions ...................................................... 13 6.1 Mechanical Dimensions ....................................................................................... 13 6.2 Recommended PCB Layout ................................................................................. 14 6.3 Production Instructions ......................................................................................... 15 6.4 Recommended Oven Temperature Curve ........................................................... 16 6.5 Storage Conditions ............................................................................................... 18 7. MOQ and Packing Information ...................................................................................... 19 8. Appendix: Statement ...................................................................................................... 20 Hangzhou Tuya Information Technology Co., Ltd. 4 V1.0.1 ZS3L Datasheet Tables Table 2-1 ZS3L interface pins ............................................................................................... 6 Table 2-2 ZS3L test pins ........................................................................................................ 7 Table 3-1 Absolute electrical parameters ............................................................................ 9 Table 3-2 Normal working conditions .................................................................................. 9 Table 3-3 Current consumption during constant transmission and receiving .............. 10 Table 3-4 Working current ................................................................................................... 10 Table 4-1 Basic RF features ............................................................................................... 11 Table 4-2 Performance during constant transmission ..................................................... 11 Table 4-3 RX sensitivity ....................................................................................................... 11 Figures Figure 2-1 ZS3L front and rear views .................................................................................. 6 Figure 6-1 ZS3L mechanical dimensions ......................................................................... 13 Figure 6-2 Side view ............................................................................................................ 13 Figure 6-3 ZS3L pins............................................................................................................ 14 Figure 6-4 ZS3L pin header dimensions ........................................................................... 14 Figure 6-5 Layout of the PCB to which ZS3L applies ..................................................... 15 Figure 6-6 HIC for ZS3L ...................................................................................................... 16 Figure 6-7 Oven temperature curve .................................................................................. 17 Hangzhou Tuya Information Technology Co., Ltd. 5 V1.0.1 ZS3L Datasheet 2. Module Interfaces 2.1 Dimensions and Footprint ZS3L has two rows of pins with a 20.1 mm pin spacing. The ZS3L dimensions (H x W x D) are 2.80.15 mm x 240.35 mm x 160.35 mm. Figure 2-1 shows the ZS3L front and rear views. Figure 2-1 ZS3L front and rear views 1 2 3 4 5 2.2 Interface Pin Definition Table 2-1 ZS3L interface pins Pin No. Symbol I/O Type Function RST Input Hardware reset pin, which is at a high level by default and is active at a low level ADC_PC01 I/O 12-bit SAR ADC pin NC Input Disconnected, which can be used as the reset pin in special scenarios PC00 PA00 I/O I/O Hardware PWM pin, which is connected to PC00 (pin 1) on the internal IC Hardware PWM pin, which is connected to PA00 (pin 17) on Hangzhou Tuya Information Technology Co., Ltd. 6 V1.0.1 ZS3L Datasheet Pin No. Symbol I/O Type Function the internal IC 6 7 8 9 PA03 I/O Hardware PWM pin, which is connected to PA03 (pin 20) on the internal IC PA04 I/O 3V3 GND P P Hardware PWM pin, which is connected to PA04 (pin 21) on the internal IC Power supply pin (typical power supply voltage: 3.3 V) Power supply reference ground pin 10 PD01 I/O Hardware PWM pin, which is connected to PD01 (pin 31) on the internal IC 11 PD00 I/O Hardware PWM pin, which is connected to PD00 (pin 32) on the internal IC 12 PC02 I/O Hardware PWM pin, which is connected to PC02 (pin 3) on the internal IC 13 PB00 I/O Hardware PWM pin, which is connected to PB00 (pin 16) on the internal IC 14 PB01 I/O Hardware PWM pin, which is connected to PB01 (pin 15) on the internal IC 15 RXD I/O UART_RXD, which is connected to PA06 (pin 23) on the internal IC 16 TXD Input UART_TXD, which is connected to PA05 (pin 22) on the internal IC Note:
17 18 19 20 21 P indicates a power supply pin, and I/O indicates an input/output pin. 2.3 Test Pin Definition Table 2-2 ZS3L test pins Pin No. Symbol I/O Type Function 3V3 P Power supply pin (typical power supply voltage: 3.3 V) SWDIO I/O J-Link SWDIO programming pin SWCLK I/O J-Link SWCLK programming pin GND1 RST2 P I/O Power supply reference ground pin Hardware reset pin, which is at a high level by default and is active at a low level Hangzhou Tuya Information Technology Co., Ltd. 7 V1.0.1 ZS3L Datasheet Pin No. Symbol I/O Type Function 22 GND2 P Power supply reference ground pin Note:
Test pins are not recommended. Hangzhou Tuya Information Technology Co., Ltd. 8 V1.0.1 ZS3L Datasheet 3. Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Unit Ts Storage temperature voltage VBAT Power supply 3.0 Value Value 20 105 3.6 2 Static electricity voltage Tamb = 25C N/A
(human body model) Static electricity voltage Tamb = 25C N/A 0.5
(machine model) 3.2 Working Conditions Table 3-2 Normal working conditions Parameter Description Minimum Average Maximum Unit Value Value Value
(Typical Value) Ta Working temperature 20 N/A 105 C VBAT Power supply 3.0 3.3 3.6 VIL I/O low-level 0.3 N/A VCC x 0.25 VIH I/O high-level N/A VCC VOL I/O low-level N/A N/A VCC x 0.1 VOH I/O high-level N/A VCC VCC x 0.75 VCC x 0.8 voltage input input output output Imax I/O drive current N/A N/A 12 mA C V kV kV V V V V V Hangzhou Tuya Information Technology Co., Ltd. 9 V1.0.1 ZS3L Datasheet 3.3 RF Current Consumption Table 3-3 Current consumption during constant transmission and receiving Parameter Working Status Mode Rate TX Power/
Receiving Average Value Maximum Value
(Typical Value) 250 kbit/s
+20 dBm 200 206 TX 250 kbit/s
+10 dBm RX 250 kbit/s
+0 dBm 250 kbit/s 250 kbit/s 250 kbit/s Constant receiving Constant receiving Constant receiving 62 26 10 10 10 64 28 12 12 12 Unit mA mA mA mA mA mA 3.4 Working Current Table 3-4 Working current Working Mode Working Status (Ta = 25C) Average Maximum Unit Value Value (Typical Value) EZ The module is in EZ mode. Connected and idle The module is connected to the network. Deep sleep mode The module is in deep sleep mode, with 64 KB flash memory. 10 4.2 5 40 5 mA mA A Hangzhou Tuya Information Technology Co., Ltd. 10 V1.0.1 ZS3L Datasheet 4. RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency range 2.4 GHz to 2.4835 GHz Zigbee standard IEEE 802.15.4 Data transmission rate 250 kbit/s Antenna type PCB antenna with a gain of 1 dBi 4.2 TX Performance Table 4-2 Performance during constant transmission Parameter Minimum Average Value Value Maximum Value
(Typical Value) Maximum output power 250 kbit/s N/A Minimum output power 250 kbit/s 20 30 0.5 31 N/A 1 Output power adjustment step Output spectrum adjacent-channel rejection ratio Unit dBm dBm dBm dBc Frequency error 15 N/A
+15 ppm 4.3 RX Performance Table 4-3 RX sensitivity Parameter Minimum Average Value Value Maximum Value
(Typical Value) Unit PER < 10%, 802.11n OFDM mode 250 kbit/s 102 101 99 dBm Hangzhou Tuya Information Technology Co., Ltd. 11 V1.0.1 ZS3L Datasheet 5. Antenna Information 5.1 Antenna Type ZS3L uses an onboard PCB antenna 5.2 Antenna Interference Reduction To ensure optimal Zigbee performance when the Zigbee module uses an onboard PCB antenna, it is recommended that the antenna be at least 5 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Hangzhou Tuya Information Technology Co., Ltd. 12 V1.0.1 ZS3L Datasheet 6. Packaging Information and Production Instructions 6.1 Mechanical Dimensions The PCB dimensions (H x W x D) are 2.80.15 mm x 240.35 mm x 160.35 mm. Figure 6-1 ZS3L mechanical dimensions Figure 6-2 Side view Hangzhou Tuya Information Technology Co., Ltd. 13 V1.0.1 ZS3L Datasheet 6.2 Recommended PCB Layout Figure 6-3 ZS3L pins ZS3L can be mounted onto a PCB by using an SMT placement machine or through-hole mounted onto the PCB through a pin header. Figure 6-4 shows the pin header dimensions. Figure 6-4 ZS3L pin header dimensions Hangzhou Tuya Information Technology Co., Ltd. 14 V1.0.1 ZS3L Datasheet Figure 6-5 Layout of the PCB to which ZS3L applies 6.3 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.
(1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 70%. Hangzhou Tuya Information Technology Co., Ltd. 15 V1.0.1 ZS3L Datasheet
(2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC). Figure 6-6 HIC for ZS3L package:
hours. 3. Bake a module based on HIC status as follows when you unpack the module
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:
(1) Baking temperature: 1255C
(2) Alarm temperature: 130C
(3) SMT placement ready temperature after natural cooling: < 36C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 6.4 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The Hangzhou Tuya Information Technology Co., Ltd. 16 V1.0.1 ZS3L Datasheet highest temperature is 245C. Figure 6-7 Oven temperature curve Hangzhou Tuya Information Technology Co., Ltd. 17 V1.0.1 ZS3L Datasheet 6.5 Storage Conditions Hangzhou Tuya Information Technology Co., Ltd. 18 V1.0.1 ZS3L Datasheet 7. MOQ and Packing Information MOQ and packing information Product Model MOQ Packing Method Number of Modules in Each Reel Pack Number of Reel Packs in Each Box ZS3L 4000 1000 4 Carrier tape and reel packing Hangzhou Tuya Information Technology Co., Ltd. 19 V1.0.1 ZS3L Datasheet 8. Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Important Note This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional to operating simultaneously with other radio. testing and equipment authorization may be required The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in Hangzhou Tuya Information Technology Co., Ltd. 20 V1.0.1 ZS3L Datasheet this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device have got a FCC ID2ANDL-ZS3L.The final end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID:2ANDL-ZS3L This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Insteadit should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. AT EE IT PT BE FI LV RO BG FR LT SK HR DE LU SI CY EL MT ES CZ HU NL SE DK IE PL UK Hangzhou Tuya Information Technology Co., Ltd. 21 V1.0.1