MESHTEK-H52E with External Antenna MESHTEK-H52E Bluetooth Module DESCRIPTION With the smartest and most robust Bluetooth Mesh Network technology on the market, ilumis MeshTek provides an elegant and affordable solution for manufacturers looking to quickly and reliably bring BLE enabled IoT products to market. The MESHTEK-H52E Smart Mesh Module with IPX antenna allows users to connect External Antenna which is required for various applications. This complete platform solution includes software drivers, sample applications, API guide, user documentation and a world-class support. The MESHTEK-H52E internal controller can be used for applications up to 64KB flash; without the need for external host MCU or software development tools. . FEATURES Simple & fast integration with development kits and sample iOS & Android API Built-in reliable Connection based mesh to support large data packets, Mesh Network
(Node and Bridge) for Android Long-range, module connectivity up to 100 meters Compact form factor 15.24mm X 17.60mm X 3mm Castellated SMT pads for easy and reliable PCB mounting Over the Air firmware update from one device to an entire network 32-bit ARM Cortex M4F nRF52832 CPU Proximity support for beacon and location based services No. of GPIOs available for user - 11 Configurable I/O mapping for analog and digital Simultaneous master and slave operation
*Certifications: FCC, IC (In progress) RoHS compliant OPERATIONAL Operating voltage range: 1.7V to 3.6VDC Temperature range: -40C to 85C Low-power consumption Interface: SPI, UART, I2C 512KB flash and 64KB RAM APPLICATIONS Lighting fixtures Automotive Home Automation Power plugs, routers Internet of Things (IoT) Industrial Control ilumi Solutions Inc www.ilumisolutions.com P a g e 1 | 13 MESHTEK-H52E TABLE OF CONTENTS DEVICE OVERVIEW ........................................................................................................................ 4 GENERAL SPECIFICATIONS ............................................................................................................ 6 PHYSICAL DIMENSIONS ................................................................................................................. 7 LAYOUT AND MOUTING GUIDELINES ........................................................................................... 7 REGULATORY APPROVAL .............................................................................................................. 9 FCC AND IC COMPLIANCE ............................................................................................................. 9 FCC STATEMENT ............................................................................................................................ 9 IC COMPLIANCE ............................................................................................................................. 9 CONFORMIT AUX NORMS DIC ................................................................................................. 10 OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS ......... 10 OEM LABELING REQUIREMENTS FOR END PRODUCT ................................................................ 10 PRODUCT HANDLING .................................................................................................................. 12 SOLDER REFLOW PROFILE ........................................................................................................... 12 PACKAGING AND LABELLING ...................................................................................................... 13 PACKAGING ................................................................................................................................. 13 PACKAGING LABEL ...................................................................................................................... 13 ORDERING INFORMATION .......................................................................................................... 13 REVISION HISTORY ...................................................................................................................... 13 1. 2. 3. 4. 5. 5.1. 5.1.1. 5.1.2. 5.1.3. 5.1.4. 5.1.5. 6. 6.1. 7. 7.1. 7.2. 8. 9. Table 1: PINOUT DRESCPTION ...................................................................................................................... 5 Table 2: ELECTRICAL SPECIFICATIONS ........................................................................................................... 6 Table 3: MESHTEK-H52E FCC and IC Conformity .......................................................................................... 8 Table 4: ORDERING INFORMATION ............................................................................................................ 12 Figure 1: MESHTEK-H52E BLOCK DIAGRAM.................................................................................................. 4 Figure 2: MESHTEK-H52E PINOUT ................................................................................................................ 4 Figure 4: MESHTEK-H52E FOOTPRINT .......................................................................................................... 7 Figure 5: REFLOW PROFILE ........................................................................................................................... 7 ilumi solutions, inc. www.ilumisolutions.com http://www.ilumi.co/ P a g e 2 | 13 MESHTEK-H52E TO OUR VALUED CUSTOMERS It is our intention to provide you, our valued customer, with the best possible documentation to ensure successful use of your MeshTek products. To this end, we will continue to update our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. Please note: images used in the manual are for reference purposes and may be different than the actual product. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via Email at sales@ilumisolutions.com. We welcome your feedback. Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of the document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following:
Contact the MeshTek team Contact your local MeshTek sales representative When contacting a sales office, please specify which device, revision of MeshTek-H52E data sheet (include literature number) you are using. ilumi solutions, inc. www.ilumisolutions.com http://www.ilumi.co/ P a g e 3 | 13 MESHTEK-H52E 1. DEVICE OVERVIEW The MESHTEK-H52E Bluetooth Low Energy RF module integrates Bluetooth radio baseband, 32-bit MCU, digital analog I/O, onboard MeshTek stack. Figure 1 shows the modules Block diagram. Figure 2 shows the modules pinout and the description is shown in Table 1. Figure 1: MESHTEK-H52E BLOCK DIAGRAM Figure 1: MESHTEK-H52 PINOUTFigure 2:MESHTEK-H52 BLOCK DIAGRAM u.FL Connector Band Pass Filter Power Amplifier BLE ARM Cortex M4F CPU VDD (DC 1.7V to 3.6V) SWD (2) Programming Pins I/O I/O (11) 32MHz Xtal GND Figure 2: MESHTEK-H52E PINOUT ilumi solutions, inc. www.ilumisolutions.com http://www.ilumi.co/ P a g e 4 | 13 MESHTEK-H52E Table 1: PINOUT DESCRIPTION Sr. No. Pin out 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 GND VDD P0.26 P0.27 P0.28
(AIN4) P0.29
(AIN5) P0.30
(AIN6) P0.21
(RESET) P0.18
(TRACEDATA[0] /
SWO) P0.17
(MI2C_DATA) SWDCLK SWDIO P0.13 P0.12 P0.11 Pin Function Power Power Digital I/O Digital I/O Digital I/O Analog input Digital I/O Analog input Digital I/O Analog input Digital I/O Description Ground (0 V) Power Supply General purpose I/O pin. General purpose I/O pin. General purpose I/O pin SAADC/COMP/LPCOMP input General purpose I/O pin SAADC/COMP/LPCOMP input General purpose I/O pin SAADC/COMP/LPCOMP input. General purpose I/O pin Configurable as pin reset Digital I/O General purpose I/O pin Digital I/O Digital output Digital input Digital I/O Digital I/O Digital I/O Digital I/O General purpose I/O pin I2C Data out Serial Wire Debug clock input for debug and programming Serial Wire Debug I/O for debug and programming General purpose I/O pin General purpose I/O pin General purpose I/O pin Note: For more details, check out nRF52832 (QFN48) Cortex ARM M4F controller specifications MESHTEK-H52E has u.FL connector present on the module, an external antenna with mating part needs to be connected to the module. ilumi solutions, inc. www.ilumisolutions.com http://www.ilumi.co/ P a g e 5 | 13 MESHTEK-H52E 2. GENERAL SPECIFICATIONS Table 2 provides the general specifications for the module and current consumption. Table 2: ELECTRICAL SPECIFICATIONS ELECTRICAL SPECIFICATIONS Description VDD - Supply Voltage Operating Temperature Range ESD - Human Body Model Class 2 Built-in Crystal Frequency Crystal Frequency Tolerance Reset pin time for successful reset Radio Operating Frequencies Radio On-Air Data Rate Min 1.7V
-40 C 60 msec 2.402GHz Radio Output Power Receiver Sensitivity @ BLE Mode Radio RSSI Accuracy UART Baud Rate SPI Bit Rate TWI Bit Rate Analog-to-Digital Converter (ADC) Range VIH Input High Voltage VIL Input Low Voltage VOH Output High Voltage VOL Output Low Voltage Output standard drive current Pull-up resistance / Pull-down resistance Transmit Current Receive Current System ON, No RAM retention, Wake on any event System ON, Full RAM retention, Wake on any event 0.125 Mbps 100 kbps 0 0.7 * VDD VSS VDD 0.4 VSS 11k Nom 3.0V 32 MHz 1 Mbps
-96 dBm 20 mA 13k 1.2uA 1.5uA Notes RF output power configured to +19dBm using external PA in continuous TX Mode Ideal transmitter 8/10/12-bit ADC Max 3.6V 85 C 4 kV
+/- 10ppm 2.480 GHz 2 Mbps
+19dBm
+/- 2 dB 1000 kbps 8 Mbps 400 kbps VDD VDD 0.3 * VDD VDD VSS + 0.4 16k 90mA 24.8mA
+19dBm output Power Radio RX Active ilumi solutions, inc. www.ilumisolutions.com http://www.ilumi.co/
P a g e 6 | 13 MESHTEK-H52E 3. PHYSICAL DIMENSIONS Figure 4 shows the size and footprint for MeshTek-H52E module Figure 4: MESHTEK-H52E FOOTPRINT 4. LAYOUT AND MOUTING GUIDELINES We recommend 2 or more layers for the Carrier Board (Host PCB). The top side shall be mostly ground. Signal routing shall be done in the bottom or middle layers. When laying out the Carrier board for the MESHTEK-H52E module, the areas under the antenna and shielding connections should not have signal traces, ground planes or exposed vias. For the best Bluetooth range performance, the antenna area of module shall extend 6.3mm outside the edge of Carrier Board or 6.3mm outside the edge of a ground plane. For the best Bluetooth range performance, keep all external metal away from the antenna area. ilumi solutions, inc. www.ilumisolutions.com http://www.ilumi.co/
P a g e 7 | 13 MESHTEK-H52E ilumi solutions, inc. www.ilumisolutions.com http://www.ilumi.co/
P a g e 8 | 13 MESHTEK-H52E 5. REGULATORY APPROVAL 5.1. FCC and IC Compliance The MESHTEK-H52E module conforms to the product specifications listed in below Table 4. Table 3: MESHTEK-H52E FCC and IC Conformity FCC IC Standard FCC part 15 Subpart C Section 15.249 MESHTEK-H52E FCC ID: 2AEHU-MESHTEK-H52E Industry Canada RSS-210 Industry Canada RSS-Gen MESHTEK-H52E IC: 20059-MESHTEKH52E 5.1.1. FCC Statement This device has been tested and found to comply with part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
This device may not cause harmful interference, and This device must accept any interference received, including interference that may cause undesired operation. FCC CAUTION: Any changes or modifications NOT explicitly APPROVED by ilumi could cause the module to cease to comply with FCC rules part 15, and thus void the user's authority to operate the equipment. 5.1.2. IC compliance This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
1. This device may not cause interference, and 2. This device must accept any interference, including interference that may cause undesired operation of the device. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be chosen in such a way that the equivalent isotropically radiated power (e.i.r.p.) is not more than that is necessary for successful communication. This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body. ilumi solutions, inc. www.ilumisolutions.com http://www.ilumi.co/
P a g e 9 | 13 MESHTEK-H52E 5.1.3. Conformit aux norms dIC Cet appareil est conforme la(aux) norme(s) RSS sans licence dIndustry Canada. Son utilisation est soumise aux deux conditions suivantes:
1. Cet appareil ne doit pas causer dinterfrences et 2. il doit accepter toutes interfrences reues, y compris celles susceptibles davoir des effets indsirables sur son fonctionnement. Conformment aux rglementations dIndustry Canada, cet metteur radio ne peut fonctionner qu laide dune antenne dont le type et le gain maximal (ou minimal) ont t approuvs pour cet metteur par Industry Canada. Pour rduire le risque dinterfrences avec dautres utilisateurs, il faut choisir le type dantenne et son gain de telle sorte que la puissance isotrope rayonne quivalente (p.i.r.e) ne soit pas suprieure celle requise pour obtenir une communication satisfaisante. Cet quipement respecte limites dexposition aux rayonnements IC RSS-102 dfinies pour un environnement non contrl. Il doit tre install et utilis en maintenant une distance minimum de 20 cm entre le radiateur et votre corps. les 5.1.4. OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS The MESHTEK-H52E Module has been certified for integration into products only by OEM integrators under the following conditions:
This device is granted for use in configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization. 5.1.5. OEM Labeling requirements for end product For an end product using the MESHTEK-H52E module there must be a label containing, at least, the following information:
CONTAIN FCC ID: 2AEHU-MESHTEK-H52E CONTAIN IC: 20059-MESHTEKH52E The label must be affixed on an exterior surface of the end product such that it will be visible upon inspection in compliance with the modular approval guidelines developed by the FCC. ilumi solutions, inc. www.ilumisolutions.com http://www.ilumi.co/
P a g e 10 | 13 MESHTEK-H52E In accordance with 47 CFR 15.19, the end product shall bear the following statement in a conspicuous location on the device: "This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions;
1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation."
When the device is so small or for such use that it is not practicable to place the statement above on it, the information shall be placed in a prominent location in the instruction manual or pamphlet supplied to the user or, alternatively, shall be placed on the container in which the device is marketed. In case, where the final product will be installed in locations where the end-user is not able to see the FCC ID and/or this statement, the FCC ID and the statement shall also be included in the end-product manual. ilumi solutions, inc. www.ilumisolutions.com http://www.ilumi.co/
P a g e 11 | 13 MESHTEK-H52E 6. PRODUCT HANDLING 6.1. SOLDER REFLOW PROFILE Soldering Temperature-Time Profile for Reflow Soldering is described below in FIGURE 5. Maximum number of cycles for reflow is 2. No opposite side reflow is allowed due to module weight. Figure 5: REFLOW PROFILE 6.2. MOISTURE SENSITIVITY LEVELS The Moisture Sensitivity Level (MSL) relates to the required packaging and handling precautions. MeshTek-
H52E module is rated for MSL 3, 168-hour floor life after opening. Note: For MSL standards, see IPC/JEDEC J-STD-020, which can be downloaded from www.jedec.org. ilumi solutions, inc. www.ilumisolutions.com http://www.ilumi.co/
P a g e 12 | 13 MESHTEK-H52E 7. PACKAGING AND LABELLING 7.1. PACKAGING MeshTek-H52E modules are deliverable in MPQ of 49pcs/tray. Package Type: antistatic bag/tray Unit weight of the MeshTek-H52E module is 1gm/pc 7.2. PACKAGING LABEL TBD 8. ORDERING INFORMATION Table 4 provides ordering information for the MESHTEK-H52E module. Table 4: ORDERING INFORMATION Part Number Description MESHTEK-H52E Bluetooth High Power Module, Tray Packaging, 49 pcs Note: For custom applications, contact sales@ilumisolutions.com 9. REVISION HISTORY Revision 1.0 1.1 Date March 2019 October 2019 Status / Comments Initial Release
- Updated module images, dimension, pinout, footprint
- Updated Layout and Mounting Guidelines
- Updated reflow profile image FCC Statement FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 Integral antenna with antenna gain 0dBi This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. We will retain control over the final installation of the modular such that compliance of the end product is assured. In such cases, an operating condition on the limit modular approval for the module must be only approved for use when installed in devices produced by a specific manufacturer. If any hardware modify or RF control software modify will be made by host manufacturer,C2PC or new certificate should be apply to get approval,if those change and modification made by host manufacturer not expressly approved by the party responsible for compliance ,then it is illegal. FCC Radiation Exposure Statement The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device.This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID:
2AEHU-MESHTEK-H52E Or Contains FCC ID: 2AEHU-MESHTEK-H52E When the module is installed inside another device, the user manual of the host must contain below warning statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product. Any company of the host device which install this modular with modular approval should perform the test of radiated & conducted emission and spurious emission,etc. according to FCC part 15C : 15.247 and 15.209 & 15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 &
15.207 ,15B Class B requirementthen the host can be sold legally. IC STATEMENT IC standards: RSS-247 ISSUE 2 Integral antenna with antenna gain 0dBi This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:
(1) This device may not cause interference.
(2) This device must accept any interference, including interference that may cause undesired operation of the device Cet appareil contient des metteurs / rcepteurs exempts de licence conformes aux RSS (RSS) d'Innovation, Sciences et Dveloppement conomique Canada. Le fonctionnement est soumis aux deux conditions suivantes :
(1) Cet appareil ne doit pas causer d'interfrences.
(2) Cet appareil doit accepter toutes les interfrences, y compris celles susceptibles de provoquer un fonctionnement indsirable de l'appareil. IC Radiation Exposure Statement The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device .This modular complies with IC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body. Cette modulaire doit tre install et utilis une distance minimum de 20 cm entre le radiateur et le corps de l'utilisateur. If the IC number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains IC: 20059-MESHTEKH52E when the module is installed inside another device, the user manual of this device must contain below warning statements;
1. This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:
(1) This device may not cause interference.
(2) This device must accept any interference, including interference that may cause undesired operation of the device. 2. Cet appareil contient des metteurs / rcepteurs exempts de licence conformes aux RSS (RSS) d'Innovation, Sciences et Dveloppement conomique Canada. Le fonctionnement est soumis aux deux conditions suivantes :
(1) Cet appareil ne doit pas causer d'interfrences.
(2) Cet appareil doit accepter toutes les interfrences, y compris celles susceptibles de provoquer un fonctionnement indsirable de l'appareil. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product ilumi solutions, inc. www.ilumisolutions.com http://www.ilumi.co/
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