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A Datasheet Sterling-EWB Version 0.1 Sterling-EWB Datasheet REVISION HISTORY Version Date Notes Contributor(s) 0.1 29 Mar 2019 Approver Jay White https://connectivity.lairdtech.com/wireless-modules 2 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet CONTENTS 1 2 8 7 4.1 5 6 8.1 8.2 7.1 7.2 6.1 6.2 2.1 2.2 2.3 Scope .................................................................................................................................................................................. 4 Introduction .......................................................................................................................................................................... 5 General Description.................................................................................................................................................... 5 Features Summary ..................................................................................................................................................... 5 Applications ................................................................................................................................................................ 6 3 Module Variants ................................................................................................................................................................... 6 Ordering Information ............................................................................................................................................................ 7 4 Module Accessories ................................................................................................................................................... 7 Block Diagram ..................................................................................................................................................................... 9 Base SiP Module Footprint and Pin Definitions ................................................................................................................. 10 Base SiP Module Footprint ....................................................................................................................................... 10 Base SiP Module Pin Descriptions ........................................................................................................................... 11 U.FL/Chip Antenna Module Footprint and Pin Definitions ................................................................................................. 16 U.FL/Chip Antenna Module Footprint ....................................................................................................................... 16 U.FL/Chip Antenna Pin Description .......................................................................................................................... 16 Specifications .................................................................................................................................................................... 19 General Characteristics ............................................................................................................................................ 19 Power Supply Requirements .................................................................................................................................... 20 RF Characteristics .............................................................................................................................................. 20 Maximum Ratings..................................................................................................................................................... 20 WLAN Power Consumption ...................................................................................................................................... 21 Bluetooth Power Consumption ................................................................................................................................. 21 WLAN RF Characteristics ........................................................................................................................................ 22 8.6.1 WLAN Transmitter Characteristics (TA = +25C, VCC = 3.3 V) ......................................................................... 22 8.6.2 WLAN Receiver Characteristics (TA = +25C, VCC = 3.3 V) ............................................................................. 23 Bluetooth RF Characteristics .................................................................................................................................... 24 Bluetooth Transmitter GFSK & EDR Characteristics (TA=25C, VDD=3.3 V) .................................................... 24 Bluetooth Receiver GFSK & EDR Characteristics (TA=25C, VDD=3.3 V) ........................................................ 24 BLE Transmitter Characteristics (TA=25C, VDD=3.3 V) ................................................................................... 24 BLE Receiver Characteristics (TA=25C, VDD=3.3 V) ....................................................................................... 25 9 MCU Interface Characteristics ........................................................................................................................................... 25 DC Characteristics General Input and Output ....................................................................................................... 25 I2C Interface ............................................................................................................................................................. 26 Overview ............................................................................................................................................................ 26 SPI Interface ............................................................................................................................................................ 27 MCU UART Interfaces .............................................................................................................................................. 28 8.7.1 8.7.2 8.7.3 8.7.4 8.3 8.4 8.5 8.6 9.1 9.2 9.2.1 8.2.1 8.7 9.3 10 https://connectivity.lairdtech.com/wireless-modules 3 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 10.3 10.1 10.2 12.1 12.2 12.3 12.4 12.5 12.6 12.7 Overview .................................................................................................................................................................. 28 Soldering Recommendations ................................................................................................................................... 28 10.2.1 Reflow for Lead Free Solder Paste .................................................................................................................... 28 Recommended Reflow Profile for Lead Free Solder ................................................................................................ 28 Wi-Fi MAC IDs/Bluetooth MAC IDs .......................................................................................................................... 29 Mechanical Details ................................................................................................................................................... 29 Base SiP Module Mechanical Data .......................................................................................................................... 29 Base SiP Module PCB Footprint .............................................................................................................................. 30 Base SiP Module Recommended Solder Stencil ..................................................................................................... 31 Base SiP Module Tape and Reel Packaging ............................................................................................................ 32 U.FL and Chip Antenna PCB Footprint .................................................................................................................... 32 U.FL and Chip Antenna Tape and Reel Packaging .................................................................................................. 33 Device Markings ....................................................................................................................................................... 33 12.7.1 SiP Module ......................................................................................................................................................... 33 12.7.2 Antenna Option Modules .................................................................................................................................... 33 Cleaning ................................................................................................................................................................... 33 Optical Inspection ..................................................................................................................................................... 33 Rework ..................................................................................................................................................................... 33 SHIPPING, HANDLING, AND STORAGE ................................................................................................................ 34 Shipping ................................................................................................................................................................... 34 16.1 16.2 Handling ................................................................................................................................................................... 34 16.3 Moisture Sensitivity Level (MSL) .............................................................................................................................. 34 Storage ..................................................................................................................................................................... 34 16.4 16.5 Repeated Reflow Soldering ...................................................................................................................................... 34 Regulatory ................................................................................................................................................................ 35 FCC and IC Regulatory Pending ........................................................................................................................... 35 Europe EU Declaration of Conformity ................................................................................................................... 38 Japan (MIC) Regulatory ........................................................................................................................................... 38 Australia and New Zealand ...................................................................................................................................... 38 Bluetooth SIG Qualification ...................................................................................................................................... 39 Overview .................................................................................................................................................................. 39 Qualification Steps When Referencing a Laird Controller Subsystem Design .......................................................... 39 Additional Assistance ............................................................................................................................................... 40 17.1 17.2 17.3 17.4 18.1 18.2 18.3 11 12 13 14 15 16 17 18 1 SCOPE This document describes key hardware aspects of the Laird Connectivity Sterling-EWB. https://connectivity.lairdtech.com/wireless-modules 4 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 2 INTRODUCTION 2.1 General Description The Laird Connectivity Sterling-EWB is a high performance 2.4 GHz WLAN and Bluetooth combo module based on latest-generation silicon (Cypresss CYW4343W) with an integrated ST Micro STM32F412 Cortex M4 MCU. With an industrial temperature rating, broad country certifications, and the availability of three different package styles, the Sterling-EWB provides significant flexibility to meet various end user application needs. The on-module chip antenna package style for the Sterling-EWB eliminates complexity for design integration, simplifies manufacturing assembly with larger pin outs, and features an advanced chip antenna that offers greater resistance to de-tuning than typical trace or chip antennas. 2.2 Features Summary IEEE 802.11 b/g/n (single stream n) Available with integrated chip antenna or U.FL Bluetooth v4.2 BR/DR/LE Cortex M4 microprocessor Typical WLAN transmit power:
+17.5 dBm, 11 Mbps, CCK (b)
+14.0 dBm, 54 Mbps, OFDM (g)
+12.5 dBm, HT20 MCS7 (n) Typical WLAN sensitivity:
-88 dBm, 8% PER,11 Mbps (b)
-75 dBm, 10% PER, 54 Mbps (g)
-72 dBm, 10% PER, MCS7 (n) WLAN and Bluetooth coexistence Available in two footprint styles:
Easy to Integrate: 16 mm x 21 mm Miniature footprint: 10 mm x 10 mm WLAN IEEE 802.11b/g/n 1x1 2.4 GHz Radio Internal Power Amplifier (PA) Internal T/R Switch connector for external antenna Operating voltage: 3.0V to 3.6V Operating temperature: -40 to +85 C Storage temperature: -40 to +125C Compact design based on Cypress CYW4343W SoC and STM32F412 MCU Worldwide acceptance pending: FCC (USA), IC
(Canada), ETSI (Europe), Giteki (Japan), and RCM
(AU/NZ) BT SIG QDID: TBD REACH and RoHS compliant Physical Layer (PHY) Baseband Processor IEEE 802.11b, 802.11g, 802.11n (single stream) Internal Low Noise Amplifier(LNA) Standards Simultaneous BT/WLAN reception with a single antenna. Media Access Controller (MAC) Bluetooth Class 2 power amplifier with Class 2 capability PCM for Audio Data HCI Interface using High Speed UART Bluetooth v4.2 BR /DR/LE https://connectivity.lairdtech.com/wireless-modules 5 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet Microcontroller STM32 Arm 32-bit Cortex-M4 with a frequency up to SPI, QSPI, USART, PCM ADC, I2C, I2S, GPIO, Timers JTAG WICED Fully compatible WMM-SA WAPI AES (Hardware accelerator) TKIP (host-computed) CKIP (SW support) 100 MHz 1 MB internal flash 256 kB of SRAM 2 MB SPI flash Wireless Security System Features Supported Modes Open (no security) WEP WPA Personal WPA2 Personal WMM WMM-PS (U-APSD) 2.3 Applications Security and building automation Smart Gateways Internet of Things/M2M Connectivity 3 MODULE VARIANTS The Laird Connectivity Sterling-EWB Module is available in three different versions. Depending on your antenna and footprint needs, there is a variant to suit most application requirements. We recommend, for simplicity of both the host PCB design and the manufacturing process, that you use either the chip antenna or RF connector version of the modules. 453-00012 - Base SiP Module This module variant is supplied in a compact, 151 pin, 0.5 mm pitch LGA footprint. Unlike the other module variants, it requires the addition of either an off-module antenna or RF connector, as well as the associated matching components. In order to benefit from the EMC certifications on the module, strictly following the layout in the module application guide is required. This requires adherence to the PCB stack-up and layout around the antenna. The footprint of this module may require additional care during reflow and PCB assembly.
{TBD Sip Module picture}
Figure 1 Sterling-EWB Base SiP Module (453-00012) 453-00013 U.FL Module This module variant integrates the 450-00012 Base SiP Module, a U.FL RF connector, and all associated RF matching components on a PCB. This integrated approach not only provides a U.FL connector for connections to external antennas, but also simplifies and reduces the cost of the end users host board by simplifying the module PCB footprint. Figure 2: Sterling-EWB U.FL Module (453-00013) https://connectivity.lairdtech.com/wireless-modules 6 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 453-00014 - Chip Antenna Module This module variant integrates the 453-00012 Base SiP Module, a chip antenna, and all associated RF matching components on a PCB. This integrated approach not only provides an external antenna solution, but also simplifies and reduces the cost of the end users host board by simplifying the module PCB footprint. Figure 3 Sterling-EWB Chip Antenna Module (453-00014) 4 ORDERING INFORMATION Part Number Description 453-00013C 453-00013R 453-00014C 453-00014R 453-00012C 453-00012R 455-00030 455-00031 Sterling-EWB U.FL module (Cut Tape) Sterling-EWB U.FL module (Tape and Reel, SPQ = 1000) Sterling-EWB chip antenna module (Cut Tape) Sterling-EWB chip antenna module (Tape and Reel, SPQ = 1000) Sterling-EWB base SiP module (Cut Tape) Sterling-EWB base SiP module (Tape and Reel, SPQ = 2000) Sterling-EWB development kit, Chip Antenna Sterling-EWB development kit, FlexPIFA Antenna 4.1 Module Accessories Part Number Description Image 001-0001 2.4 GHz dipole antenna with reverse polarity SMA connector 080-0001 U.FL to reverse polarity SMA bulkhead cable 105 mm https://connectivity.lairdtech.com/wireless-modules 7 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet Part Number Description Image 001-0014 2.4 GHz FlexPIFA antenna 001-0015 2.4 GHz FlexNotch antenna 001-0030 2.4 GHz Metal FlexPIFA antenna w/U.FL cable, 100 mm MAF94045 2.4 GHz NanoBlue Antenna https://connectivity.lairdtech.com/wireless-modules 8 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 5 BLOCK DIAGRAM Figure 4: Sterling-EWB U.FL/chip antenna module block diagram https://connectivity.lairdtech.com/wireless-modules 9 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Laird Sterling-EWBBase SiP ModuleCYW4343WSTM32F412BluetoothWLANLPF32.768kHzRTC2MBFlash26MHzREF CLK37.4MHzREF CLKCLK_REQBT_REG_ONBT_DEV_WAKEBT_HOST_WAKEBT_UARTWLAN_SDIOWL_IRQWLAN_REG_ON32.768kHzI2CI2SSPIQSPITIMERUARTADC/DACUSBCANGPIOJTAGBT_PCMBT_GPIOVDD_MCUVBATVDD_WIFI_IOVDD_WIFIVDD_WIFI_PAMatchMatch2.4GHz ChipAntennaCoaxial ConnectorRF interface option Sterling-EWB Datasheet 6 BASE SIP MODULE FOOTPRINT AND PIN DEFINITIONS Note: The following footprint and pin definitions apply to the Sterling-EWB base SiP module (453-00012). There are two module footprints, depending on which variant of the module is used. It is important to ensure you are using the correct version on your design. 6.1 Base SiP Module Footprint Figure 5: Sterling-EWB base SiP module pinout (top view) https://connectivity.lairdtech.com/wireless-modules 10 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 6.2 Base SiP Module Pin Descriptions Table 1: Sterling-EWB base SiP module pin descriptions Module Pin Name I/O Type Description STM32F412 Port 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 ANT GND VDD_3V3_WIFI_PA VDD_3V3_WIFI_PA GND VDD_3V3_5 GND MICRO_SPI1_MOSI QUADSPI_CLK GND MICRO_SPI4_NSS MICRO_SPI4_SCK MICRO_SPI4_MISO MICRO_SPI4_MOSI GND NC NC GND NC BT_GPIO_3 MICRO_SPI2_MISO MICRO_SPI2_MOSI GND VDD_3V3_3 GND NC GND VDD3V3_WiFi_IO GND MICRO_USART1_TX MICRO_USART1_RX RF RF TRANSMITTER OUTPUT AND RECEIVE INPUT GND PI PI GND PI GND DIO DIO GND DIO DIO DIO DIO GND
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GND
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DIO DIO DIO GND PI GND
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GND PI GND DO DI GROUND WIFI PA POWER SUPPLY WIFI PA POWER SUPPLY GROUND DC SUPPLY FOR MCU AND I/O GROUND SPI1_MOSI QUADSPI_CLK GROUND SPI4_NSS SPI4_SCK SPI4_MISO SPI4_MOSI GROUND NO CONNECT (DO NOT CONNECT) NO CONNECT (DO NOT CONNECT) GROUND NO CONNECT (DO NOT CONNECT) WPT_INTb TO WIRELESS CHARGING PMU SPI4_MOSI SPI2_MOSI GROUND DC SUPPLY FOR MCU AND I/O GROUND NO CONNECT (DO NOT CONNECT) GROUND DC SUPPY FOR WIFI AND I/O GROUND USART1_TX USART1_RX PA7 PB1 PE11 PE12 PE13 PE14 PB14 PB15 PA9 PA10 https://connectivity.lairdtech.com/wireless-modules 11 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet Module Pin Name I/O Type Description 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 MICRO_USART1_CTS MICRO_USART1_RTS GND MICRO_JTAG_TMS GND MICRO_JTAG_TCK MICRO_JTAG_TDI GND NC GND VDD3V3_WIFI VDD3V3_WIFI GND MICRO_JTAG_TDO MICRO_JTAG_TRSTN GND VDD_3V3_2 GND QUADSPI_BK1_IO3 GND NC NC GND BT_PCM_CLK NC BT_HOST_WAKE GND VBAT GND GND NC NC GND DI DO GND DI GND DI DI GND
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GND PI PI GND DO DI GND PI GND DIO GND
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GND DIO
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DO GND PI GND GND
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GND USART1_CTS USART1_RTS GROUND JTAG_TMS GROUND JTAG_TCK JTAG_TDI GROUND NO CONNECT (DO NOT CONNECT) GROUND WIFI POWER SUPPLY WIFI POWER SUPPLY GROUND JTAG_TDO JTAG_TRSTN GROUND DC SUPPLY FOR MCU AND I/O GROUND STM32F412 Port PA11 PA12 PA13 PA14 PA15 PB3 PB4 QUADSPI_BK1_IO3 PF6 GROUND NO CONNECT (DO NOT CONNECT) NO CONNECT (DO NOT CONNECT) GROUND PCM CLOCK; CAN BE MASTER (OUTPUT) OR SLAVE (INPUT) NO CONNECT (DO NOT CONNECT) HOST_WAKE GROUND POWER SUPPLY FOR BACKUP CIRCUIT GROUND GROUND NO CONNECT (DO NOT CONNECT) NO CONNECT (DO NOT CONNECT) GROUND https://connectivity.lairdtech.com/wireless-modules 12 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet Module Pin Name I/O Type Description STM32F412 Port 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 VDD_3V3 GND QUADSPI_BK1_IO1 QUADSPI_BK1_IO2 MICRO_I2S2_SD GND GND GND GND MICRO_SPI1_NSS MICRO_SPI1_SCK MICRO_SPI1_MISO GND QUADSPI_BK2_IO3 BOOT1/QUADSPI_CLK QUADSPI_BK2_IO0 QUADSPI_BK2_IO1 MICRO_I2C2_SCL MICRO_ I2C2_SDA MICRO_SPI2_NSS MICRO_SPI2_SCK MICRO_GPIO27 MICRO_GPIO25 NC NC VDD_USB GND PI GND DIO DIO DIO GND GND GND GND DIO DIO DIO GND DIO DO DIO DIO DIO DIO DIO DIO DIO DIO
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PI DC SUPPLY FOR MCU AND I/O GROUND QUADSPI_BK1_IO1 QUADSPI_BK1_IO2 I2S2_SD GROUND GROUND GROUND GROUND SPI1_NSS SPI1_SCK SPI1_MISO GROUND QUADSPI_BK2_IO3 BOOT1/QUADSPI_CLK QUADSPI_BK2_IO0 QUADSPI_BK2_IO1 I2C2_SCL I2C2_SDA SPI2_NSS SPI2_SCK MICRO_GPIO MICRO_GPIO NO CONNECT (DO NOT CONNECT) NO CONNECT (DO NOT CONNECT) DC SUPPLY FOR USB GND GROUND MICRO_I2S2_MCK/MICRO_USART6_TX DIO I2S2_MCK/USART6_TX MICRO_I2S2_CK/MICRO_USART6_RX DIO I2S2_CK/USART6_RX GND NC NC NC NC GND GROUND
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NO CONNECT (DO NOT CONNECT) NO CONNECT (DO NOT CONNECT) NO CONNECT (DO NOT CONNECT) NO CONNECT (DO NOT CONNECT) PF9 PF7 PC3 PA4 PA5 PA6 PC5 PB2 PE7 PE8 PB10 PB11 PB12 PB13 PD8 PD10 PC6 PC7 https://connectivity.lairdtech.com/wireless-modules 13 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet Module Pin Name I/O Type Description STM32F412 Port 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 GND NC GND MICRO_I2C1_SCL MICRO_I2C1_SDA BOOT0 NC MICRO_GPIO0 QUADSPI_BK2_NCS MICRO_GPIO30 NC NC MICRO_I2S2_DI GND GND GND GND GND MICRO_RST_N QUADSPI_BK1_IO0 MICRO_WKUP GND MICRO_ADC_IN2 MICRO_ADC_IN3 GND QUADSPI_BK2_IO2 MICRO_GPIO5 RF_SW_CTRL NC MICRO_GPIO16 BT_GPIO_4 BT_GPIO_5 NC GND GND
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GND DIO DIO DO
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DIO DIO DIO
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DIO GND GND GND GND GND DI DIO DI GND DI DI GND DIO DIO DIO
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DIO GROUND NO CONNECT (DO NOT CONNECT) GROUND I2C1_SCL I2C1_SDA BOOT0 NO CONNECT (DO NOT CONNECT) MICRO_GPIO QUADSPI_BK2_NCS MICRO_GPIO NO CONNECT (DO NOT CONNECT) NO CONNECT (DO NOT CONNECT) I2S2_DI GROUND GROUND GROUND GROUND GROUND PB6 PB7 BOOT0 PE3 PC11 PE0 PE5 MICRO_RST_N NRST QUADSPI_BK1_IO0 MICRO_WKUP GROUND ADC_IN2 ADC_IN3 GROUND QUADSPI_BK2_IO2 MICRO_GPIO ANTENNA DIVERSITY CONTROL NO CONNECT (DO NOT CONNECT) PF8 PA0 PA2 PA3 PC4 PB0 MICRO_GPIO PE15 DIO BSC_SDA TO/FROM WIRELESS CHARGING PMU DIO BSC_SCL FROM WIRELESS CHARGING PMU.
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GND NO CONNECT (DO NOT CONNECT) GROUND https://connectivity.lairdtech.com/wireless-modules 14 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet Module Pin Name I/O Type Description 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 QUADSPI_BK1_NCS GND GND NC MICRO_GPIO26 NC NC NC NC MICRO_GPIO28 MICRO_I2S2_WS BT_PCM_SYNC BT_PCM_OUT BT_PCM_IN PC13 GND GND MICRO_ADC_IN1 GND DIO GND GND
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DIO
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DIO DIO DIO DO DI DIO GND GND DI GND STM32F412 Port PG6 QUADSPI_BK1_NCS GROUND GROUND NO CONNECT (DO NOT CONNECT) MICRO_GPIO PD1 NO CONNECT (DO NOT CONNECT) NO CONNECT (DO NOT CONNECT) NO CONNECT (DO NOT CONNECT) NO CONNECT (DO NOT CONNECT) MICRO_GPIO I2S2_WS PCM SYNC; CAN BE MASTER (OUTPUT) OR SLAVE (INPUT) PCM DATA OUTPUT PCM DATA INPUT SENSING MICRO_GPIO GROUND GROUND ADC_IN1 GROUND PB8 PB9 PC13 PA1 PI = Power Input DI = Digital Input DO = Digital Output DIO = Bi-directional Digital Port RF = Bi-directional RF Port GND = Ground
* If you want to use the USB interface, pins 30-33 (PA9-PA12) can be configured over USART1 https://connectivity.lairdtech.com/wireless-modules 15 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 7 U.FL/CHIP ANTENNA MODULE FOOTPRINT AND PIN DEFINITIONS Note: The following footprint and pin definitions apply to the Sterling-EWB U.FL and chip antenna variants of the module
(453-00013 and 453-00014). There are two module footprints depending on which variant of the module is being used, so it is important to ensure you are using the correct version on your design. 7.1 U.FL/Chip Antenna Module Footprint Figure 6: Sterling-EWB U.FL and chip antenna module pinout (top view) 7.2 U.FL/Chip Antenna Pin Description Table 2: Sterling-EWB U.FL and chip antenna module pin descriptions Module Pin 1 Name GND1 I/O Type Description GND GROUND https://connectivity.lairdtech.com/wireless-modules 16 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 818386848512345678910111213141516171819202122232425262728293031333537394143454749505132343638404244464853525455565758596061626364656667686970717273747576777879808782 Sterling-EWB Datasheet Module Pin Name I/O Type Description 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 MICRO_ADC_IN2/PA2 MICRO_SPI1_SCK/PA5 MICRO_SPI1_NSS/PA4 MICRO_SPI1_MISO/PA6 MICRO_ADC_IN3/PA3 MICRO_GPIO_5/PB0 QUADSPI_BK2_IO2/PC4 VDD_WIFI_PA GND11 RF_SW_CNTL QUADSPI_BK2_IO3/PC5 MICRO_SPI1_MOSI/PA7 BOOT1/QUADSPI_CLK/PB2 QUADSPI_CLK/PB1 QUADSPI_BK2_IO0/PE7 MICRO_SPI4_NSS/PE11 QUADSPI_BK2_IO1/PE8 MICRO_SPI4_SCK/PE12 MICRO_I2C2_SCL/PB10 MICRO_SPI4_MISO/PE13 MICRO_I2C2_SDA/PB11 MICRO_SPI4_MOSI/PE14 MICRO_GPIO_16/PE15 BT_GPIO_3 MICRO_SPI2_NSS/PB12 MICRO_SPI2_SCK/PB13 MICRO_SPI2_MISO/PB14 GND2 MICRO_SPI2_MOSI/PB15 MICRO_GPIO_27/PD8 MICRO_GPIO_25/PD10 BT_GPIO_4 BT_GPIO_5 DIO DIO DIO DIO DIO DIO DIO PI GND DO DIO DIO DI DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO GND DIO DIO DIO DIO DIO ADC INPUT OR GENERAL-PURPOSE I/O SPI SCK OR GENERAL-PURPOSE I/O SPI NSS OR GENERAL-PURPOSE I/O SPI MISO OR GENERAL-PURPOSE I/O ADC INPUT OR GENERAL-PURPOSE I/O GENERAL-PURPOSE I/O QSPI IO2 OR GENERAL-PURPOSE I/O WIFI AND BLUETOOTH POWER SUPPLY GROUND ANTENNA DIVERSITY CONTROL OUTPUT QSPI IO3 OR GENERAL-PURPOSE I/O SPI MOSI OR GENERAL-PURPOSE I/O BOOT OPTION 1 INPUT QSPI CLK OR GENERAL-PURPOSE I/O QSPI IO0 OR GENERAL-PURPOSE I/O SPI NSS OR GENERAL-PURPOSE I/O QSPI IO1 OR GENERAL-PURPOSE I/O SPI SCK OR GENERAL-PURPOSE I/O I2C SCL OR GENERAL-PURPOSE I/O SPI MISO OR GENERAL-PURPOSE I/O I2C SDAOR GENERAL-PURPOSE I/O SPI MOSI OR GENERAL-PURPOSE I/O GENERAL-PURPOSE I/O BT GENERAL-PURPOSE I/O SPI NSS OR GENERAL-PURPOSE I/O SPI SCK OR GENERAL-PURPOSE I/O SPI MISO OR GENERAL-PURPOSE I/O GROUND SPI MOSI OR GENERAL-PURPOSE I/O GENERAL-PURPOSE I/O GENERAL-PURPOSE I/O BT GENERAL-PURPOSE I/O BT GENERAL-PURPOSE I/O https://connectivity.lairdtech.com/wireless-modules 17 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet Module Pin Name I/O Type Description 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 VDD_USB QUADSPI_BK1_NCS/PG6 VDD_MCU MICRO_I2S2_CK/MICRO_USART6_RX/PC7 MICRO_I2S2_MCK/MICRO_USART6_TX/PC6 PI DIO PI DIO VUSB POWER SUPPLY QSPI NCS OR GENERAL-PURPOSE I/O MCU AND IO POWER SUPPLY I2S CK OR USART RX INPUT OR GENERAL-PURPOSE I/O DIO I2S MCK OR USART TX OUTPUT OR GENERAL-PURPOSE I/O GND12 GND GROUND VDD_WIFI_IO MICRO_USART1_RX/PA10 MICRO_USART1_TX/PA9 MICRO_GPIO_26/PD1 MICRO_GPIO_28/PB8 MICRO_I2C1_SDA/PB7 MICRO_USART1_CTS/PA11 MICRO_I2C1_SCL/PB6 MICRO_USART1_RTS/PA12 MICRO_JTAG_TDI MICRO_JTAG_TMS/SWDIO GND3 BOOT0 MICRO_JTAG_TDO PC13 MICRO_ADC_IN1/PA1 MICRO_JTAG_TCK/SWCLK BT_PCM_IN BT_PCM_OUT MICRO_RSTN BT_PCM_SYNC VDD_WIFI GND4 MICRO_JTAG_TRSTN MICRO_GPIO_0/PE3 PI DI DO DIO DIO DIO DI DIO DO DI DI WIFI AND BLUETOOTH IO POWER SUPPLY MCU USART1 RECEIVE INPUT MCU USART1 TRANSMIT OUTPUT GENERAL-PURPOSE I/O GENERAL-PURPOSE I/O I2C SDA OR GENERAL-PURPOSE I/O MCU USART1 CLEAR-TO-SEND I2C SCL OR GENERAL-PURPOSE I/O MCU USART1 REQUEST-TO-SEND JTAG_TDI JTAG_TMS/SWDIO GND GROUND DI DI DIO DIO DI DI DO DI DIO BOOT OPTION 0 INPUT JTAG_TDO GENERAL-PURPOSE I/O ADC INPUT OR GPIO JTAG_TCK/SWCLK PCM DATA INPUT SENSING PCM DATA OUTPUT MCU RESET INPUT PCM SYNC; CAN BE MASTER (OUTPUT) OR SLAVE (INPUT) PI WIFI AND BLUETOOTH POWER SUPPLY GND DI DIO GROUND JTAG_TRSTN GENERAL-PURPOSE I/O https://connectivity.lairdtech.com/wireless-modules 18 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet Module Pin 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 Name I/O Type Description QUADSPI_BK1_IO0/PF8 QUADSPI_BK2_NCS/PC11 QUADSPI_BK1_IO1/PF9 MICRO_I2S2_WS/PB9 QUADSPI_BK1_IO3/PF6 MICRO_GPIO_30/PE0 OSC_32K_IN MICRO_I2S_DI/PE5 OSC_32K_OUT BT_PCM_CLK MICRO_WKUP/PA0 BT_HOST_WAKE QUADSPI_BK1_IO2/PF7 MICRO_I2S2_SD/PC3 VBAT GND5 GND6 GND7 GND8 GND9 GND10 GND13 DIO DIO DIO DIO DIO DIO DI DIO DO DIO DI DO DIO DIO QSPI IO0 OR GENERAL-PURPOSE I/O QSPI NCS OR GENERAL-PURPOSE I/O QSPI IO1 OR GENERAL-PURPOSE I/O I2S WS OR GENERAL-PURPOSE I/O QSPI IO3 OR GENERAL-PURPOSE I/O GENERAL-PURPOSE I/O EXTERNAL SLEEP CLOCK INPUT (not used) I2S DATA INPUT OR GENERAL-PURPOSE I/O EXTERNAL SLEEP CLOCK INPUT (not used) PCM CLOCK; CAN BE MASTER (OUTPUT) OR SLAVE (INPUT) MCU WAKE INPUT HOST_WAKE OR GENERAL-PURPOSE I/O QSPI IO2 OR GENERAL-PURPOSE I/O I2S DATA OUTPUT OR GENERAL-
PURPOSE I/O PI WIFI AND BLUETOOTH POWER SUPPLY GND GND GND GND GND GND GND GROUND GROUND GROUND GROUND GROUND GROUND GROUND PI = Power Input DI = Digital Input DO = Digital Output DIO = Bi-directional Digital Port GND = Ground 8 SPECIFICATIONS 8.1 General Characteristics Characteristic Description https://connectivity.lairdtech.com/wireless-modules 19 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet Characteristic Model Name Description Sterling-EWB Product Description Wi-Fi and Bluetooth Wireless Module with Cortex-M4 MCU SiP Module Dimensions (W x L x T) mm (in.) 10 x 10 x 1.2 (0.39 x 0.39 x 0.05) Antenna Option Module Dimensions (W x L x T) mm (in.) 16 x 21 x 2.8 (0.63 x 0.83 x 0.11) Operating Temperature C (F)
-40 to +85 (-40 to +185) Storage Temperature C (F)
-40 to +125 (-40 to +257) Weight TBD 8.2 Power Supply Requirements Power Supply Input VDD_MCU VDD_WIFI VDD_WIFI_IO VDD_WIFI_PA VDD_USB(1) VBAT(2)
(1) If USB not used, connect VDD_USB input to VDD_MCU
(2) If VBAT not used, connect to VDD_MCU 8.2.1 RF Characteristics Min 2.4 3.0 3.0 3.0 3.0 2.4 Typical Max Unit 3.3 3.3 3.3 3.3 3.3 3.3 3.6 3.6 3.6 3.6 3.6 3.6 V V V V V V Parameter RF frequency range RF data rate Min 2400 1 Typical 802.11 b/g/n rates supported Max 2500 65 Unit MHz Mbps 8.3 Maximum Ratings Rating VDD_MCU VDD_WIFI VDD_WIFI_IO VDD_WIFI_PA Value 0 to 4 0 to 6 0 to 4 0 to 6 Unit V V V V https://connectivity.lairdtech.com/wireless-modules 20 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet Rating VDD_USB VBAT Voltage ripple any supply input (not to exceed operating voltage) Output current sunk by any I/O or control pin Output current sourced by any I/O or control pin Total output current sunk by sum of all I/O or control pin Total output current sourced by sum of all I/O or control pin 8.4 WLAN Power Consumption Value 0 to 4 0 to 4 2%
25
-25 120
-120 Unit V V Not to exceed operating voltage mA mA mA mA Parameter Test Conditions Min Typical Max Unit Power Down Mode Tamb = +25C, VDD_MCU = VDD_WIFI = 3.3V Sleep (idle, unassociated) Tamb = +25C, VDD_MCU = VDD_WIFI = 3.3V IEEE Power Save DTIM 1 Tamb = +25C, VDD_MCU = VDD_WIFI = 3.3V 11b TX Current 11g TX Current 11n TX Current 11b RX Current 11g RX Current 11n RX Current 11 Mbps, Tamb = +25C, 3.3V 54 Mbps, Tamb = +25C, 3.3V MCS7, Tamb = +25C, 3.3V 11 Mbps, Tamb = +25C, 3.3V 54 Mbps, Tamb = +25C, 3.3V MCS7, Tamb = +25C, 3.3V 8.5 Bluetooth Power Consumption
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TBD TBD TBD 390 310 290 55 55 55
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uA uA mA mA mA mA mA mA mA Parameter Test Conditions Min Typical Max Unit Power Down Mode Tamb = +25C, VDD_MCU = VDD_WIFI = 3.3V EDR TX Current Constant Transmit, 3DH5, PRBS9 Tamb = +25C, 3.3V EDR RX Current Constant Receive, 3DH5 Tamb = +25C, 3.3V BLE TX Current BLE RX Current Tamb = +25C, 3.3V Tamb = +25C, 3.3V
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TBD 50 30 50 30
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uA mA mA mA mA https://connectivity.lairdtech.com/wireless-modules 21 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 8.6 WLAN RF Characteristics 8.6.1 WLAN Transmitter Characteristics (TA = +25C, VCC = 3.3 V) Parameter Test Conditions Min Typ Max Unit 1 Mbps DSSS (b) TX Output Power 2 Mbps DSSS (b) TX Output Power 5.5 Mbps DSSS (b) TX Output Power 11 Mbps DSSS (b) TX Output Power 6 Mbps OFDM (g) TX Output Power 9 Mbps OFDM (g) TX Output Power 12 Mbps OFDM (g) TX Output Power 18 Mbps OFDM (g) TX Output Power 24 Mbps OFDM (g) TX Output Power 36 Mbps OFDM (g) TX Output Power 48 Mbps OFDM (g) TX Output Power 54 Mbps OFDM (g) TX Output Power MCS0 OFDM (n) TX Output Power MCS1 OFDM (n) TX Output Power MCS2 OFDM (n) TX Output Power MCS3 OFDM (n) TX Output Power MCS4 OFDM (n) TX Output Power 1 Mbps BPSK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet 2 Mbps QPSK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet 5.5 Mbps QPSK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet 11 Mbps CCK 802.11(b) Mask Compliance 35% EVM RMS power over TX packet 6 Mbps BPSK 802.11(g) Mask Compliance
-5 dB EVM RMS power over TX packet 9 Mbps BPSK 802.11(g) Mask Compliance
-8 dB EVM RMS power over TX packet 12 Mbps QPSK 802.11(g) Mask Compliance
-10 dB EVM RMS power over TX packet 18 Mbps QPSK 802.11(g) Mask Compliance
-13 dB EVM RMS power over TX packet 24 Mbps 16-QAM 802.11(g) Mask Compliance
-16 dB EVM RMS power over TX packet 36 Mbps 16-QAM 802.11(g) Mask Compliance
-19 dB EVM RMS power over TX packet 48 Mbps 64-QAM 802.11(g) Mask Compliance
-22 dB EVM RMS power over TX packet 54 Mbps 64-QAM 802.11(g) Mask Compliance
-25 dB EVM RMS power over TX packet 6.5 Mbps BPSK 802.11(n) Mask Compliance
-5 dB EVM RMS power over TX packet 13 Mbps QPSK 802.11(n) Mask Compliance
-10 dB EVM RMS power over TX packet 19.5 Mbps QPSK 802.11(n) Mask Compliance
-13 dB EVM RMS power over TX packet 26 Mbps 16-QAM 802.11(n) Mask Compliance
-16 dB EVM RMS power over TX packet 39 Mbps 16-QAM 802.11(n) Mask Compliance
-19 dB EVM RMS power over TX packet
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17.5 17.5 17.5 17.5 14.0 14.0 14.0 14.0 14.0 14.0 14.0 14.0 12.5 12.5 12.5 12.5 12.5
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dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm https://connectivity.lairdtech.com/wireless-modules 22 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet Parameter Test Conditions Min Typ Max Unit MCS5 OFDM (n) TX Output Power MCS6 OFDM (n) TX Output Power MCS7 OFDM (n) TX Output Power 52 Mbps 64-QAM 802.11(n) Mask Compliance
-22 dB EVM RMS power over TX packet 58.5 Mbps 64-QAM 802.11(n) Mask Compliance
-25 dB EVM RMS power over TX packet 65 Mbps 64-QAM 802.11(n) Mask Compliance
-27 dB EVM RMS power over TX packet
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12.5 12.5 12.5
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dBm dBm dBm 8.6.2 WLAN Receiver Characteristics (TA = +25C, VCC = 3.3 V) Parameter Test Conditions Min Typ Max Unit 1 Mbps DSSS (b) RX Sensitivity 2 Mbps DSSS (b) RX Sensitivity 5.5 Mbps DSSS (b) RX Sensitivity 11 Mbps DSSS (b) RX Sensitivity 6 Mbps OFDM (g) RX Sensitivity 9 Mbps OFDM (g) RX Sensitivity 12 Mbps OFDM (g) RX Sensitivity 18 Mbps OFDM (g) RX Sensitivity 24 Mbps OFDM (g) RX Sensitivity 36 Mbps OFDM (g) RX Sensitivity 48 Mbps OFDM (g) RX Sensitivity 54 Mbps OFDM (g) RX Sensitivity MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity MCS1 (13 Mbps) OFDM (n) RX Sensitivity MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity MCS3 26 Mbps OFDM (n) RX Sensitivity MCS4 39 Mbps OFDM (n) RX Sensitivity MCS5 52 Mbps OFDM (n) RX Sensitivity MCS6 58.5 Mbps OFDM (n) RX Sensitivity MCS7 65 Mbps OFDM (n) RX Sensitivity 8% PER 8% PER 8% PER 8% PER 10% PER 10% PER 10% PER 10% PER 10% PER 10% PER 10% PER 10% PER 10% PER 10% PER 10% PER 10% PER 10% PER 10% PER 10% PER 10% PER
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-93
-91
-89
-86
-88
-87
-85
-83
-80
-78
-74
-72
-87
-84
-82
-80
-77
-72
-71
-70
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dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm https://connectivity.lairdtech.com/wireless-modules 23 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet Parameter Test Conditions Min Typ Max Unit 11b RX Overload Level 11g RX Overload Level 11n RX Overload Level 8% PER, 11 Mbps 10% PER, 54 Mbps 10% PER, MCS7
-10
-20
-20
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dBm dBm dBm 8.7 Bluetooth RF Characteristics 8.7.1 Bluetooth Transmitter GFSK & EDR Characteristics (TA=25C, VDD=3.3 V) Parameter Test Conditions Min Typical Max Bluetooth Spec Unit GFSK RF Output Power EDR RF Output Power Power Control Step Size EDR Relative Power
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2
-4 8.5 4.0 4
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8 1 2-8
-4/+1 dBm dBm dB dB 8.7.2 Bluetooth Receiver GFSK & EDR Characteristics (TA=25C, VDD=3.3 V) Table 3: Bluetooth receiver RF characteristics Parameter Test Conditions Min Typical Max Bluetooth Spec Unit GFSK Sensitivity BER=0.1%
EDR 2 Mbps Sensitivity BER=0.01%
EDR 3 Mbps Sensitivity BER=0.01%
GFSK Maximum Input Level BER=0.1%
EDR 2 Maximum Input Level BER=0.01%
EDR 3 Maximum Input Level BER=0.01%
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-90
-92
-87
-20
-20
-20
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-70
-70
-70
-20
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dBm dBm dBm dBm dBm dBm 8.7.3 BLE Transmitter Characteristics (TA=25C, VDD=3.3 V) Table 4: BLE transmitter RF characteristics Parameter Test Conditions Min Typical Max Bluetooth Spec Unit GFSK RF Output Power Power Control Step Size
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2 7.5 4
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8 2-8 dBm dB https://connectivity.lairdtech.com/wireless-modules 24 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 8.7.4 BLE Receiver Characteristics (TA=25C, VDD=3.3 V) Table 5: BLE receiver RF characteristics Parameter Test Conditions Min Typical Max Bluetooth Spec Unit GFSK Sensitivity PER = 30.8%
GMSK Maximum Input Level PER = 30.8%
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-94
-20
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-70
-20 dBm dBm 9 MCU INTERFACE CHARACTERISTICS 9.1 DC Characteristics General Input and Output Table 6: DC characteristics MCU I/O Parameter Test Conditions Logic input low, VIL 2.4V VDD_MCU 3.6V Min
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Logic input high, VIH 2.4V VDD_MCU 3.6V 0.7VDD Max Unit 0.3VDD
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BOOT0 Logic input low, VIL 2.4V VDD_MCU 3.6V
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0.1VDD + 0.1 BOOT0 Logic input high, VIH 2.4V VDD_MCU 3.6V 0.17VDD + 0.7 Logic output low, VOL 2.7V VDD_MCU 3.6V CMOS port, IIO = +8mA 2.7V VDD_MCU 3.6V TTL port, IIO = +8mA 2.7V VDD_MCU 3.6V IIO
= +20mA 2.4V VDD_MCU 3.6V IIO
= +6mA 2.4V VDD_MCU 3.6V IIO
= +4mA
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Logic output high, VOH 2.7V VDD_MCU 3.6V CMOS VDD 0.4 port, IIO = +8mA 2.7V VDD_MCU 3.6V TTL 2.4 port, IIO = +8mA 2.7V VDD_MCU 3.6V IIO VDD 1.3
= +20mA 2.4V VDD_MCU 3.6V IIO VDD 0.4
= +6mA 2.4V VDD_MCU 3.6V IIO VDD 0.4
= +4mA
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0.4 0.4 1.3 0.4 0.4
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V V V V V V TTL and CMOS outputs are compatible with JEDEC standards JESD36 and JESD52 https://connectivity.lairdtech.com/wireless-modules 25 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 9.2 I2C Interface 9.2.1 Overview The Sterling-EWB Module MCU section supports Standard and Fast mode I2C communication. Table 7: Signal connections to I2C bus Symbol Parameter Standard Mode(1) Fast Mode(1)(2) Min Max Min Max tw(SCLL) tw(SCLH) tsu(SDA) th(SDA) tr(SDA) tr(SCL) tf(SDA) tf(SCL) th(SDA) tsu(STA) tsu(STO) SCL clock low time SCL clock high time SDA setup time SDA data hold time SDA and SCL rise time SDA and SCL fall time Start condition hold time Repeated Start condition setup time Stop condition setup time tsw(STO:STA) Stop to Start condition time (bus free) 4.7 4.0 250 0
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4.0 4.7 4.0 4.7
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3450(3) 1000 1.3 0.6 100 0
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900(4) 300 ns 300
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300 ns
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0.6 0.6 0.6 1.3
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Unit s s ns ns s s s s s tSP Cb Pulse width of the spikes that are suppressed by the analog filter for 0 50 0 50 standard fast mode Capacitive load for each bus line
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400
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400 pF 1. Guaranteed by design, not tested in production. 2. fPCLK1 must be at least 2 MHz to achieve standard mode I2C frequencies. It must be at least 4MHz to achieve fast mode I2C frequencies, and a multiple of 10MHz to reach the 400 kHz maximum I2C fast mode clock. 3. The device must internally provide a hold time of at least 300ns for the SDA signal in order to bridge the undefined region of the falling edge of SCL. 4. The maximum data hold time has only to be met if the interface does not stretch the low period of SCL signal. https://connectivity.lairdtech.com/wireless-modules 26 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWBSDASCLVDD_MCU100 4.7 k 100 4.7 k {I2C bus Sterling-EWB Datasheet Measurement points are done at 0.3VDD and 0.7VDD 9.3 SPI Interface Table 8: SPI interface characteristics Parameter Test Conditions Min Typical Max Unit SPI Clock Frequency Master full duplex/receiver mode 2.7V
< VDD_MCU <3.6V SPI1/4/5 Master full duplex/receiver mode 3.0V
< VDD_MCU <3.6V SPI1/4/5 Master transmitter mode 2.4V < VDD_MCU <3.6V SPI1/4/5
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Master mode
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2.4V < VDD_MCU <3.6V SPI1/2/3/4/5 Slave transmitter/full duplex mode 2.7V < VDD_MCU <3.6V SPI1/4/5 Slave receiver mode 2.4V < VDD_MCU <3.6V SPI1/4/5
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Slave mode 2.4V < VDD_MCU <3.6V
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42 50 50 25 38(1) 50 25 Duty cycle of SPI Clock SPI1/2/3/4/5 Slave mode 30 50 70 SCK high and low time Master mode, SPI presc = 2 TPCLK - 1.5 TPCLK TPCLK - 1.5 NSS setup time NSS hold time Data input setup time Data input hold time Slave mode, SPI presc = 2 Slave mode, SPI presc = 2 3TPCLK 2TPCLK Master mode Slave mode Master mode Slave mode 4 2.5 7.5 3.5
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MHz
%
ns ns ns ns ns ns ns https://connectivity.lairdtech.com/wireless-modules 27 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 10 MCU UART INTERFACES 10.1 Overview The Sterling-EWB is configurable for up to three UART interfaces for serial communications. The UART is a standard 4-wire interface (RX, TX, RTS, and CTS) with adjustable baud rates from 9600 bps to 4.0 Mbps. The interface features an automatic baud rate detection capability that returns a baud rate selection. The baud rate may also be selected through a vendor-specific UART HCI command. Figure 7: UART connection between Sterling-EWB and external device 10.2 Soldering Recommendations 10.2.1 Reflow for Lead Free Solder Paste Optimal solder reflow profile depends on solder paste properties and should be optimized as part of an overall process development. It is important to provide a solder reflow profile that matches the solder paste supplier's recommendations. Temperature ranges beyond that of the solder paste supplier's recommendation could result in poor solderability. All solder paste suppliers recommend an ideal reflow profile to give the best solderability. 10.3 Recommended Reflow Profile for Lead Free Solder Figure 8: Recommended soldering profile Note: The quality of solder joints on the surface mount pads where they contact the host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.1 Bottom Only Terminations. https://connectivity.lairdtech.com/wireless-modules 28 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB MCU UARTExternal UART Sterling-EWB Datasheet 11 WI-FI MAC IDS/BLUETOOTH MAC IDS Table 9: Example of MAC ID assignments Module 1 Module 2 Module 3 Module 4 Wi-Fi MAC ID Bluetooth MAC ID 00:25:CA:07:00:01 00:25:CA:07:00:02 00:25:CA:07:00:03 00:25:CA:07:00:04 00:25:CA:07:00:05 00:25:CA:07:00:06 00:25:CA:07:00:07 00:25:CA:07:00:08 12 MECHANICAL DETAILS 12.1 Base SiP Module Mechanical Data
[RG1]: The Sterling-EWB uses Lairds OUI not legacy LSRs. It will probably be a good idea to put Lairds OUI in the table so there is no confusion later Figure 9: Base SiP module mechanical dimensions https://connectivity.lairdtech.com/wireless-modules 29 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 12.2 Base SiP Module PCB Footprint Figure 10: Base SiP module footprint (top view) Note:
Pad Sizes Solder Mask Type A mm (in.) 0.424 x 0.424 (0.017 x 0.017) 0.524 x 0.524 mm (0.021 x 0.021) Type B mm (in.) 0.275 x 0.325 (0.011 x 0.013) 0.35 x 0.40 (0.014 x 0.016) Type C mm (in.) 2.7 x 2.7 (0.106 x 0.106) 2.8 x 2.8 (0.110 x 0.110) https://connectivity.lairdtech.com/wireless-modules 30 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 12.3 Base SiP Module Recommended Solder Stencil Figure 11: Base SiP module recommended solder stencil (top view) Note: Solder mask and paste mask to be adjusted according to end-users assembly process. https://connectivity.lairdtech.com/wireless-modules 31 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 12.4 Base SiP Module Tape and Reel Packaging
{Tape Dimensions Diagram}
(Module must be in this Orientation when Feeding Tape) Figure 13 Base SiP Module Tape and Reel Specification 12.5 U.FL and Chip Antenna PCB Footprint
[RG2]: This is ready to add to the datasheet
[SW3]: Where can I grab it from?
Figure 15 U.FL and Chip Antenna Host PCB Footprint https://connectivity.lairdtech.com/wireless-modules 32 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
[RG4]: This is ready to add to the datasheet
[SW5]: Where can I grab it from?
[RG6]: This is ready to add to the datasheet
[SW7]: Where can I grab it from?
[RG8]: There are no device markings for the antenna variants. We will place a label over the SiP module for the 453-00013 & 453-
00014 modules Sterling-EWB Datasheet 12.6 U.FL and Chip Antenna Tape and Reel Packaging
{Module Tape and Reel dimensions}
Figure 16 U.FL and Chip Antenna Modules Tape and Reel Specification 12.7 Device Markings 12.7.1 SiP Module The shield on the 453-00012 base module contains the following information:
TBD 12.7.2 Antenna Option Modules The shield on the 453-00013 and 453-00014 modules contains the following information:
TBD 13 CLEANING In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. Ultrasonic cleaning could damage the module permanently. 14 OPTICAL INSPECTION After soldering the module to the host board, consider optical inspection to check the following:
Proper alignment and centering of the module over the pads. Proper solder joints on all pads. Excessive solder or contacts to neighboring pads, or vias. 15 REWORK The Sterling-EWB module can be unsoldered from the host board if the Moisture Sensitivity Level (MSL) requirements are met as described in this datasheet. Note: Never attempt a rework on the module itself, e.g. replacing individual component s. Such actions will terminate warranty coverage. https://connectivity.lairdtech.com/wireless-modules 33 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 16 SHIPPING, HANDLING, AND STORAGE 16.1 Shipping Bulk orders of the Sterling-EWB base module are delivered in reels of 2000. Bulk orders for the antenna option PCBAs are delivered in reels of 1000. 16.2 Handling The Sterling-EWB modules contain a highly sensitive electronic circuitry. Handling without proper ESD protection may damage the module permanently. 16.3 Moisture Sensitivity Level (MSL) Per J-STD-020, devices rated as MSL 4 and not stored in a sealed bag with desicc ant pack should be baked prior to use. Devices are packaged in a Moisture Barrier Bag with a desiccant pack and Humidity Indicator Card (HIC). Devices that will be subjected to reflow should reference the HIC and J-STD-033 to determine if baking is required. If baking is required, refer to J-STD-033 for bake procedure. 16.4 Storage Per J-STD-033, the shelf life of devices in a Moisture Barrier Bag is 12 months at <40C and <90% room humidity (RH). Do not store in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX. Do not store in direct sunlight. The product should not be subject to excessive mechanical shock. 16.5 Repeated Reflow Soldering Only a single reflow soldering process is encouraged for host boards. https://connectivity.lairdtech.com/wireless-modules 34 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 17 REGULATORY 17.1 FCC and IC Regulatory Pending This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, w hich can be determined by turning the equipment off and on, the user is encouraged to try to corre ct the interference by one of the following measures:
Increase the separation between the equipment and receiver. Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. IMPORTANT NOTE:
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Integration instructions for Host Product Manufacturers Applicable FCC Rules to Module FCC Part 15.247 Summarize the specific operational use conditions The module must be installed in mobile devices. This device is intended for OEM integrators under the following conditions:
The antenna must be installed such that 20 centimeters is maintained between the antenna and users, and The transmitter module may not be co-located with any other transmitter or antenna As long as the two conditions above are met, further transmitter testing is not required. However, the OEM integrator is stil l responsible for testing their end-product for any additional compliance requirements with this module installed. IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop configurations or co -location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warnings as shown in this manual. Limited Module Procedures Not applicable Trace Antenna Designs Not applicable https://connectivity.lairdtech.com/wireless-modules 35 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet RF Exposure Considerations 20-centimeter separation distance and co-located issue shall be met at mentioned in Summarize the specific operational use conditions. The product manufacturer shall provide the text below in the end-product manual:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. Antennas Brand Name Model Name Antenna Type Antenna Gain Antenna Connector ACX Laird Laird Laird Laird Laird AT3216-A2R4PAA 001-0001 001-0014 001-0015 001-0030 NanoBlue Chip Dipole FlexPIFA FlexNotch PIFA PCB Dipole 1.5 2.0 2.0 2.0 2.0 2.0 N/A R-SMA U.FL U.FL U.FL U.FL Label and Compliance Information Product manufacturers must provide with the finished product a physical or electronic label stating the following:
Contains FCC ID: SQG-EWB1 Information on Test Modes and Additional Testing Requirements Test tool: Bluetooth Cybluetool,Ver.0.1.78.1 ; Wi-Fi CMD,Ver. 6.1.7601 shall be used to set the module to transmit continuously. Additional Testing Part 15 Subpart B Disclaimer The module is only FCC authorized for the specific rule parts listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Industry Canada Statement This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:
(1) This device may not cause interference
(2) This device must accept any interference, including interference that may cause undesired operation of the device Cet appareil contient des metteurs / rcepteurs exempts de licence qui sont conformes au (x) RSS (s) exempts de licence d'Innovation, Sciences et Dveloppement conomique Canada. L'opration est soumise aux deux conditions suivantes:
(1) Cet appareil ne doit pas causer d'interfrences
(2) Cet appareil doit accepter toute interfrence, y compris les interfrences pouvant provoquer un fonct ionnement indsirable de l'appareil This radio transmitter (IC: 3147A-EWB1) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Le prsent metteur radio (IC: 3147A-EWB1) a t approuv par Industrie Canada pour fonctionner avec les types d'antenne numrs ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est suprieur au gain maximal indiqu, sont strictement interdits pour l'exploitation de l'metteur. Brand Name Model Name Antenna Type Antenna Gain Antenna Connector ACX Laird AT3216-A2R4PAA 001-0001 Chip Dipole 1.5 2.0 N/A R-SMA https://connectivity.lairdtech.com/wireless-modules 36 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet Brand Name Model Name Antenna Type Antenna Gain Antenna Connector Laird Laird Laird Laird 001-0014 001-0015 001-0030 NanoBlue/
EBL2400A1-10MH4L FlexPIFA FlexNotch PIFA PCB Dipole 2.0 2.0 2.0 2.0 U.FL U.FL U.FL U.FL Radiation Exposure Statement:
This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Dclaration d'exposition aux radiations:
Cet quipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrl. Cet quipement doit tre install et utilis distance minimum de 20cm entre le radiateur et votre corps. This device is intended only for OEM integrators under the following condition:
1) The transmitter module may not be co-located with any other transmitter or antenna. As long as the condition above is met, further transmitter testing is not required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes:
1) Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 1 condition ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or co -location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:
Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit fin al (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling The final end product must be labeled in a visible area with the following: Contains IC: 3147A-EWB1 Plaque signaltique du produit final Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: Contient des IC: 3147A-EWB1 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'inst aller ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. https://connectivity.lairdtech.com/wireless-modules 37 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet 17.2 Europe EU Declaration of Conformity This device complies with the essential requirements of the Radio Equipment directive: 2014 / 53 / EU. The following test methods have been applied in order to prove presumption of conformity with the essential requirements o f the Radio Equipment directive: 2014 / 53 / EU:
EN 300 328 V2.1.1 Draft EN 301 489-1 V2.2.0 Draft EN 301 489-17 V3.2.0 EN 50385:2017 EN 62311:2008 EN 60950-1: 2006+A11:2009+A1:2010+A12:2011+A2:2013 2400~2480 MHz: 18.51 dBm, SW version: R1.0 The minimum distance between the user and/or any bystander and the radiating structure of the transmitter is 20cm. 5150 ~ 5350 MHz is limited to indoor used in below countries. BE DK IE FR CY LU NL PT SK UK NO BG DE EL HR LV HU AT RO FI LI CZ EE ES IT LT MT PL SI SE IS TR CH 17.3 Japan (MIC) Regulatory Pending Giteki: CAB ID-Certification Number 17.4 Australia and New Zealand RCM: Pending Compliant to standards EN 300 328 V1.9.1, AS/NZS 4268: 2012-A1:2013, and EN 55022:2010/AC:2011 https://connectivity.lairdtech.com/wireless-modules 38 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet If this device is used in a product, the OEM has responsibility to verify compliance of the final end product to the Australia/New Zealand (RCM) Standards. All end-products require their own certification (SDoc). You will not be able to leverage the module certification and ship product into the country. 18 BLUETOOTH SIG QUALIFICATION 18.1 Overview The Sterling-EWB module is listed on the Bluetooth SIG website as a qualified Controller Subsystem. Table 10: Sterling-EWB declaration ID Design Name Owner Declaration ID Link to listing on the SIG website Laird Laird Laird It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification process, even when referencing a Bluetooth Design that already has its own Declaration ID. The Qualification Process requires each company to register as a member of the Bluetooth SIG www.bluetooth.org The following is a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/
For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on your membership status, please refer to the following webpage:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG document,
(login is required to views this document):
https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486 18.2 Qualification Steps When Referencing a Laird Controller Subsystem Design To qualify your product when referencing a Laird Controller Subsystem design, follow these steps:
1. To start a listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm Note: A user name and password are required to access this site. In step 1, select the option, New Listing and Reference a Qualified Design. 2. 3. Enter xxxxx in the Controller Subsystem table entry. 4. Enter your complimentary Host Subsystem and optional Profile Subsystem in the table entry. 5. Select your pre-paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page. Note: Unless the Declaration ID is pre-paid or purchased with a credit card, you cannot proceed until the SIG invoice is paid. 6. Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document accessible from the site. https://connectivity.lairdtech.com/wireless-modules 39 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Sterling-EWB Datasheet Your new design will be listed on the SIG website and you can print your Cert ificate and SDoC. For further information please refer to the following training material:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates 18.3 Additional Assistance Please contact your local sales representative or our support team for further assistance:
Email wireless.support@lairdtech.com Phone Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Web https://connectivity.lairdtech.com/wireless-modules https://connectivity.lairdtech.com/wireless-modules 40 Copyright 2019 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610
1 2 | Ad hoc declaration | Cover Letter(s) | 152.56 KiB | July 22 2019 |
Date: June 30, 2019 Subject: Ad Hoc Mode Function Declaration FCC ID: SQG-EWB1 IC: 3147A-EWB1 To Whom it may concern, We, Laird Connectivity, Inc declare that the device does not support any non-US channels, country code selection in all the operational mode(s), like Ad-Hocetc. for the following product. Also, the client software and associated drivers will not initiate any transmission on DFS frequencies without initiation by a master and the device without support DFS detection capability. This includes restriction on transmissions for beacons and support for ad-hoc peer-to-peer modes. Regards, Bill Steinike Laird Connectivity, Inc Email: bill.steinike@lairdconnect.com Tel: 262-421-4970
1 2 | External Photos | External Photos | 593.45 KiB | July 22 2019 |
Photographs of EUT Connector Type Antenna Project No.: 931402 Page No. : 1 of 11 Printed PCB Antenna Project No.: 931402 Page No. : 2 of 11 Project No.: 931402 Page No. : 3 of 11
1 2 | ID Label/Location Info | ID Label/Location Info | 411.29 KiB | July 22 2019 |
REV DESCRIPTION DRAWN BY DATE REV Rx(5PCBA
`B SSYYWWD(Date code)5
X X X X X () Giteki Cert Number:201-190110(8) 0 39.
Laird M/N:Sterling EWB TM 453-00014 R1 SQG-EWB1 3147A-EWB1 201 190110
9 3
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0215117,XXXXX 453-00014 1.2
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(F ) 10 Part Number, Revision, Date Code, Serial Number
,0113117, X XXX 1
, 3 00014 1 NNA:
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SSYYWWD 2D 2D Barcode Value: 45 -
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. 7 barcode type Date matrix ECC200 8. Giteki ID (201-190110) Century Gothic Bold. 8
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RoHS PFOS REACH P C B
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________ G-LSR78-01 G M 9 2 1 2 9 6 - 0 8 2.2 MM 6 3 0 - 0 2 2 1 - R 2 . 2 D-RD-073-A REV DESCRIPTION DRAWN BY DATE REV Rx(5PCBA
`B SSYYWWD(Date code)5
X X X X X () Giteki Cert Number:201-190110(8) 0 39.
Laird M/N:Sterling EWB TM 453-00013 R1 SQG-EWB1 3147A-EWB1 201 190110
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0215117,XXXXX 453-00013 1.2
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(F ) 10 Part Number, Revision, Date Code, Serial Number
,0113117, X XXX 1
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________ G-LSR78-00 G M 9 2 1 2 9 6 - 0 7 2.2 MM 6 3 0 - 0 2 2 1 - R 2 . 2 D-RD-073-A
1 2 | Internal Photos | Internal Photos | 1.79 MiB | July 22 2019 |
Connector Type Antenna Project No.: 931402 Page No. : 4 of 11 Project No.: 931402 Page No. : 5 of 11 Project No.: 931402 Page No. : 6 of 11 Project No.: 931402 Page No. : 7 of 11 Project No.: 931402 Page No. : 8 of 11 Project No.: 931402 Page No. : 9 of 11 Project No.: 931402 Page No. : 10 of 11 Printed PCB Antenna Project No.: 931402 Page No. : 11 of 11
1 2 | MPE Report | RF Exposure Info | 219.67 KiB | July 22 2019 |
FCC RF Exposure Report FCC ID
: SQG-EWB1 Equipment
: 802.11 b/g/n WLAN, Bluetooth & BLE Module w/Integrated MCU Model No.
Brand Name
: Laird Connectivity Applicant Address
: Laird Connectivity, Inc
: W66N220 Commerce Court, Cedarburg, Wisconsin 53012, USA Standard
: 47 CFR FCC Part 2.1091 Received Date
: Mar. 14, 2019 Tested Date
: Mar. 16 ~ Apr. 03, 2019 We, International Certification Corp., would like to declare that the tested sample has been evaluated and in compliance with the requirement of the above standards. The test results contained in this report refer exclusively to the product. It may be duplicated completely for legal use with the approval of the applicant. It shall not be reproduced except in full without the written approval of our laboratory. Reviewed by:
Approved by:
Along Chen / Assistant Manager Gary Chang / Manager Report No.: FA931402 Report Version: Rev. 01 Page : 1 of 6 Table of Contents MPE EVALUATION OF MOBILE DEVICES ......................................................................................... 4 LIMITS FOR GENERAL POPULATION/UNCONTROLLED EXPOSURE............................................. 4 MPE EVALUATION FORMULA ............................................................................................................. 4 DEVIATION FROM TEST STANDARD AND MEASUREMENT PROCEDURE ................................... 4 MEASUREMENT UNCERTAINTY ......................................................................................................... 4 MPE EVALUATION RESULTS .............................................................................................................. 5 TEST LABORATORY INFORMATION ................................................................................................. 6 1 1.1 1.2 1.3 1.4 1.5 2 Report No.: FA931402 Report Version: Rev. 01 Page : 2 of 6 Release Record Report No. Version Description FA931402 Rev. 01 Initial issue Issued Date May 14, 2019 Report No.: FA931402 Report Version: Rev. 01 Page : 3 of 6 1 MPE EVALUATION OF MOBILE DEVICES Human exposure to RF emissions from mobile devices (47 CFR 2.1091) may be evaluated based on the MPE limits adopted by the FCC for electric and magnetic field strength and/or power density, as appropriate, since exposures are assumed to occur at distances of 20 cm or more from persons. 1.1 LIMITS FOR GENERAL POPULATION/UNCONTROLLED EXPOSURE Frequency Range (MHz) Power Density (mW /cm2) Averaging Time (minutes) 300~1500 1500~100000 F/1500 1.0 30 30 1.2 MPE EVALUATION FORMULA Pd =
Where Pd= Power density in mW/cm2 Pt= EIRP in mW Pi= 3.1416 R= Measurement distance 1.3 DEVIATION FROM TEST STANDARD AND MEASUREMENT PROCEDURE None 1.4 MEASUREMENT UNCERTAINTY ISO/IEC 17025 requires that an estimate of the measurement uncertainties associated with the emissions test results be included in the report. The measurement uncertainties given below are based on a 95% confidence level (based on a coverage factor (k=2) Parameters Conducted power Declaration of Conformity:
Uncertainty 0.808 dB The test results with all measurement uncertainty excluded are presented in accordance with the regulation limits or requirements declared by manufacturers. Comments and Explanations:
The declared values of gain for EUT presented in the report are provided by the manufacturer, and the manufacturer takes all the responsibilities for the accuracy of the gain. Report No.: FA931402 Report Version: Rev. 01 Page : 4 of 6 2**4RPiPt 1.5 MPE EVALUATION RESULTS Frequency Range (MHz) 2400-2483.5
(LE) 2400-2483.5
(EDR) 2412~2462
(Wi-Fi) Maximum Conducted Power
(dBm) 6.22 8.33 20.95 Rated Power
(dBm) Antenna Gain (dBi) Distance
(cm) Power Density
(mW/cm2) Limit
(mW/cm2) 6.5 8.5 21 2 2 2 20 20 20 0.001 0.002 0.040 1 1 1 Report No.: FA931402 Report Version: Rev. 01 Page : 5 of 6 2 Test laboratory information Established in 2012, ICC provides foremost EMC & RF Testing and advisory consultation services by our skilled engineers and technicians. Our services employ a wide variety of advanced edge test equipment and one of the widest certification extents in the business. International Certification Corp (EMC and Wireless Communication Laboratory), it is our definitive objective is to institute long term, trust-based associations with our clients. The expectation we set up with our clients is based on outstanding service, practical expertise and devotion to a certified value structure. Our passion is to grant our clients with best EMC / RF services by oriented knowledgeable and accommodating staff. Our Test sites are located at Linkou District and Kwei Shan District. Location map can be found on our website http://www.icertifi.com.tw. Linkou Kwei Shan Kwei Shan Site II Tel: 886-2-2601-1640 Tel: 886-3-271-8666 Tel: 886-3-271-8640 No. 30-2, Ding Fwu Tsuen, Lin Kou District, New Taipei City, Taiwan, R.O.C. No. 3-1, Lane 6, Wen San 3rd St., Kwei Shan District, Tao Yuan City 333, Taiwan, R.O.C. No. 14-1, Lane 19, Wen San 3rd St., Kwei Shan District, Tao Yuan City 333, Taiwan, R.O.C. If you have any suggestion, please feel free to contact us as below information. Tel: 886-3-271-8666 Fax: 886-3-318-0155 Email: ICC_Service@icertifi.com.tw END Report No.: FA931402 Report Version: Rev. 01 Page : 6 of 6
1 2 | Modular Approval Request Revised | Cover Letter(s) | 210.54 KiB | July 22 2019 |
RF_734_02 04 April 16 Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) FCC ID: SQG-EWB1 Items to be covered by Single modular transmitters. 1. The modular transmitter must have its own RF shielding. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. 3. The modular transmitter must have its own power supply regulation. 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). 8. 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. Answer from applicant The modular has a shielding Case. Please refer to EUT Photo. The component number is CYW4343W The component number is CYW4343W Antenna Connectors are RSMA, U.FL. And no external amplifier will be used with this modular. This modular is tested under stand-alone configuration. Please refer to Test setup photo. The modular transmitter is labeled with its own FCC ID number. Please refer to label sample and label location. The modular complies with this requirement. Please refer to user manual. The device complies with this requirement. Please refer to RF exposure report. RF_734_02 04 April 16 Items to be covered by Split modular transmitters. 1. The modular transmitter must comply with all requirements of a single modular transmitter except for items (1) & (5) of the above single modular approval requirements. 2. Only the radio front end must be shielded. The physical crystal and tuning capacitors may be located external to the shielded radio elements. The interface between the split sections of the modular system must be digital with a minimum signalling amplitude of 150 mV peak-to-peak. 3. Control information and other data may be exchanged between the transmitter control elements and radio front end. 4. The sections of a split modular transmitter must be tested installed in a host device(s) similar to that which is representative of the platform(s) intended for use. 5. Manufacturers must ensure that only transmitter control elements and radio front end components that have been approved together are capable of operating together. The transmitter module must not operate unless it has verified that the installed transmitter control elements and radio front end have been authorized together. Manufacturers may use means including, but not limited to, coding in hardware and electronic signatures in software to meet these requirements, and must describe the methods in their application for equipment authorization. Answer from applicant Note: A limited modular approval (LMA) may be granted for single or split modular transmitters that comply partially with the requirements above. Name and surname of applicant (or authorized representative): __________________ Date: ___19 July 2019____ Signature: ___________________________
1 2 | Power of Attorney Letter | Cover Letter(s) | 139.96 KiB | July 22 2019 |
Date: 2019/6/30 Federal Communications Commission 7435 Oakland Mills Rd Columbia MD 21046-1609 Subject: Product Certification Representative Authorization Letter FCC ID: SQG-EWB1 To whom it may concern:
We the undersigned, hereby authorize following person to act as our agent in the preparation of an application for equipment authorization of model Sterling-EWB to the FCC Rules and Regulations. International Certification Corp. Address
No.3-1, Lane 6, Wen San 3rd St. Kwei Shan Hsiang, Tao Yuan Hsein 333, Taiwan
(R.O.C.) Name
: Gary Chang Job Title
: Manager e-mail
: garychang@icertifi.com.tw Webs We further certify that neither the applicant nor any party to this application, as defined in 47 CFR Ch. 1.2002(b), is subject to a denial to Federal benefits, including FCC benefits, pursuant to section 5301 of the Anti-Drug Abuse Act of 1998, 21 U.S.C. 835(a). This appointment also includes the authority to complete FCC Form 731 on our behalf and sign the application as an authorized agent. Bill Steinike VP of Strategic Business Development Laird Connectivity, Inc Email: bill.steinike@lairdconnect.com Tel: 262-421-4970
1 2 | Test Setup Photos DSS | Test Setup Photos | 1.06 MiB | July 22 2019 |
Photographs of the Test Configuration Conducted Emission Test Report No.: FR931402 Report Version: Rev. 01 Page: : 1 of 8 Conducted Emission Test Report No.: FR931402 Report Version: Rev. 01 Page: : 2 of 8 Conducted Emission Test Report No.: FR931402 Report Version: Rev. 01 Page: : 3 of 8 Radiated Emission Below 1GHz Test Report No.: FR931402 Report Version: Rev. 01 Page: : 4 of 8 Radiated Emission Below 1GHz Test Report No.: FR931402 Report Version: Rev. 01 Page: : 5 of 8 Radiated Emission Above 1GHz Test Report No.: FR931402 Report Version: Rev. 01 Page: : 6 of 8 Radiated Emission Above 1GHz Test Report No.: FR931402 Report Version: Rev. 01 Page: : 7 of 8 Radiated Emission Above 1GHz Test Report No.: FR931402 Report Version: Rev. 01 Page: : 8 of 8
1 2 | confidentiality | Cover Letter(s) | 138.13 KiB | July 22 2019 |
Confidentiality Request Letter Date: 2019/6/30 Federal Communications Commission Authorization and Evaluation Division FCC IDSQG-EWB1 Permanent Confidentiality Request Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, the Applicant Hereby requests confidential treatment of information accompanying this Application As outlined below:
1. Block Diagram 2. Circuit Diagram 3. Operational Description The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the Applicant and provide unjustified benefits to its competitors. The Applicant understands that pursuant to Rule 0.457, disclosure of this Application and all accompanying documentation will not be made before the date of the Grant for this application Sincerely, Bill Steinike VP Strategic Business Development Laird Connectivity, Inc Email: bill.steinike@lairdconnect.com Tel: 262-421-4970
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2019-07-22 | 2402 ~ PowerOutput | DSS - Part 15 Spread Spectrum Transmitter | Original Equipment |
2 | 2412 ~ PowerOutput | DTS - Digital Transmission System |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 2 | Effective |
2019-07-22
|
||||
1 2 | Applicant's complete, legal business name |
Laird Connectivity
|
||||
1 2 | FCC Registration Number (FRN) |
0022590616
|
||||
1 2 | Physical Address |
W66N220 Commerce Court
|
||||
1 2 |
Cedarburg, Wisconsin 53012
|
|||||
1 2 |
United States
|
|||||
app s | TCB Information | |||||
1 2 | TCB Application Email Address |
c******@telefication.com
|
||||
1 2 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
app s | FCC ID | |||||
1 2 | Grantee Code |
SQG
|
||||
1 2 | Equipment Product Code |
EWB1
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 2 | Name |
B******** S********
|
||||
1 2 | Title |
VP Strategic Business Development
|
||||
1 2 | Telephone Number |
262-4********
|
||||
1 2 | Fax Number |
262-3********
|
||||
1 2 |
b******@lairdconnect.com
|
|||||
app s | Technical Contact | |||||
1 2 | Firm Name |
International Certification Corp.
|
||||
1 2 | Name |
G******** C********
|
||||
1 2 | Physical Address |
No.3-1, Lane 6, Wen San 3rd St. Kwei
|
||||
1 2 |
Taiwan
|
|||||
1 2 | Telephone Number |
886-3********
|
||||
1 2 | Fax Number |
886-3********
|
||||
1 2 |
G******@icertifi.com.tw
|
|||||
app s | Non Technical Contact | |||||
1 2 | Firm Name |
International Certification Corp.
|
||||
1 2 | Name |
W******** L******
|
||||
1 2 | Physical Address |
No.3-1, Lane 6, Wen San 3rd St. Kwei
|
||||
1 2 |
Taiwan
|
|||||
1 2 | Telephone Number |
886-3********
|
||||
1 2 |
886-3********
|
|||||
1 2 | Fax Number |
886-3********
|
||||
1 2 |
w******@icertifi.com.tw
|
|||||
app s | Confidentiality (long or short term) | |||||
1 2 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 2 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 2 | Equipment Class | DSS - Part 15 Spread Spectrum Transmitter | ||||
1 2 | DTS - Digital Transmission System | |||||
1 2 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | 802.11 b/g/n WLAN, Bluetooth & BLE Module w/Integrated MCU | ||||
1 2 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 2 | Modular Equipment Type | Single Modular Approval | ||||
1 2 | Purpose / Application is for | Original Equipment | ||||
1 2 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
1 2 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 2 | Grant Comments | Modular Approval. Power output listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. The antennas used for this transmitter as shown in this filing must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-users may not be provided with the module installation instructions.OEM integrators and end-users must be provided with transmitter operating conditions for satisfying RF exposure compliance. | ||||
1 2 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 2 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 2 | Firm Name |
International Certification Corp.
|
||||
1 2 | Name |
F****** C****
|
||||
1 2 | Telephone Number |
886-3******** Extension:
|
||||
1 2 | Fax Number |
886-3********
|
||||
1 2 |
J******@icertifi.com.tw
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | 2402.00000000 | 2480.00000000 | 0.0080000 | ||||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
2 | 1 | 15C | 2402 | 2480 | 0.004 | ||||||||||||||||||||||||||||||||||||
2 | 2 | 15C | 2412 | 2462 | 0.268 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC