PRELIMINARY DATA SHEET FreeStar Transceiver Module ZFSM-101-3 Integrated Transceiver Module for ZigBee/IEEE 802.15.4 DESCRIPTION California Eastern Laboratories (CEL)'s FreeStar Module is a small, fully-integrated, drop-in RF transmission solution that is ideal for ZigBee and other low cost, low power IEEE 802.15.4 RF transmission applications. FreeStar incorporates the MC13202 transceiver IC and MC9S08GT60 microprocessor from Freescale with a power amplifier and an Inverted-F PCB antenna. It delivers up to 4,000 feet of range and features a streamlined communications protocol that results in the lowest power consumption in transmit mode of any Module on the market. The FreeStar is also FCC and CE Certified, which eliminates the need for a costly and time-consuming approval process when incorporated into your design. FEATURES Communication Modes:
Point-to-Point, Point-to Multipoint, Mesh Networking 4,000+ feet Line of Sight Performance Small Form Factor:
Integrated PCB Trace Antenna FCC, IC and CE Certified RoHS Compliance Direct Sequence Spread Spectrum CSMA-CA Wireless Boot Loader Flash-Based/Upgradable 10 Bit A/D (2 inputs) General Purpose I/O (8 ports) Microsoft Windows -Based Configuration and Test Tool Simple Serial UART Interface Over 65,000 Network Addresses 1.4 x 1.0 FreeStar ZFSM-101-3 Transmit Power: 100 mW Receive Sensitivity: -91 dBm RF Data Rate: 250 kbps Based on the Freescale MC13202 transceiver IC 8-bit HCS08-based MCU APPLICATIONS Residential and Commercial Automation Lighting Control Security Access Control Heating, Ventilation, Air-Conditioning (HVAC) Automated Meter Reading (AMR) Health Care Patient Monitoring Fitness Monitoring Industrial Controls Asset Tracking and Monitoring Homeland Security Process Management Environmental Monitoring and Control Heating, Ventilation, Air-Conditioning (HVAC) Automated Meter Reading (AMR) Consumer Human Interface Devices
(keyboard, mice, etc.) Remote Control Wireless Toys ORDERING INFORMATION Part Number Order Number Description Mins/Mults Status FreeStar ZFSM-101-3 ZFSM-101-3 FreeStar 100mW transceiver module PCB Trace Antenna with / Freescale MC13202 200 pcs / 200 pcs Not Recommended For New Designs The information in this document is subject to change without notice, please confirm data is current Document No: 0001-00-07-01-000 Date Published: October 26, 2012 TABLE OF CONTENTS 3 1 1 1 1 3 3 Introduction and Overview Description.............................................................................................................................................................................................. Features.................................................................................................................................................................................................. Applications............................................................................................................................................................................................ Ordering Information............................................................................................................................................................................. Module Block Diagram........................................................................................................................................................................... Development Kit..................................................................................................................................................................................... System Level Function Transceiver IC......................................................................................................................................................................................... Electrical Specification Antenna................................................................................................................................................................................................... Absolute Maximum Ratings................................................................................................................................................................... Recommended Operating Conditions................................................................................................................................................... Electrical Characteristics....................................................................................................................................................................... Typical Transmit Power vs. Power Setting.......................................................................................................................................... Pin Signal & Interfaces Pin Definitions........................................................................................................................................................................................ 6 Connector Legend.................................................................................................................................................................................. 7 Connector Configuration....................................................................................................................................................................... 7 Radiation Patterns.................................................................................................................................................................................. 8 Example Interface Diagrams.................................................................................................................................................................. 9 Module Dimensions................................................................................................................................................................................ 10 Module Keepouts.................................................................................................................................................................................... 11 Processing......................................................................................................................................................................................... 12 Shipment, Storage and Handling............................................................................................................................................. 13 Quality.................................................................................................................................................................................................. 13 Agency Certifications................................................................................................................................................................... 14 References and Revision History............................................................................................................................................ 16 4 4 4 5 5 Page 2 FreeStar ZFSM-101-3 MODULE BLOCK DIAGRAM FreeStar Module 16MHz XTAL PA Enable ANT MCU Radio BUS Balun PA LPF Balun DEVELOPMENT KIT No Longer Available. TRANSCEIVER IC The Freestar ZFSM-101-3 Module replaces the ZFSM-101-2 Module. The difference between the two modules is the replacement of the power amplifier. The design was optimized to provide similar output power between the two designs so that there are no perceived changes by existing customers or designs. The ZFSM-101-3 can use the firmware for the ZFSM-
101-2. The power shaping restrictions for FCC/IC and ETSI compliance are listed in the table below for reference. The power setting restrictions must be adhered to. Certification RF Channel FCC/IC ETSI 11 thru 23 24 25 26 11-26 Valid TX Power Typical Output Steps 0-30 0-18 0-14 0-6 6 Power 20 dBm 16.8 dBm 10.8 dBm 2.7 dBm 2.7 dBm Page 3 FreeStar ZFSM-101-3 The position of the module on the host board The position of the ground plane on the host board under the module Overall design of product enclosure ANTENNA FreeStar Modules include an integrated PCB trace antenna. The PCB antenna employs an F-Antenna topology that is com-
pact and supports an omni-directional radiation pattern. To maximize antenna efficiency, an adequate ground plane must be provided on the host PCB. The following will significantly contribute to antenna performance:
Poor design affects radiation patterns and can result in reflection, diffraction and/or scattering of the transmitted signal. The following are a few design guidelines to help ensure antenna performance:
Never place the ground plane or route copper traces directly underneath the antenna portion of the module Never place the antenna close to metallic objects In the overall design, ensure that wiring and other components are not placed near the antenna Do not place the antenna in a metallic or metallized plastic enclosure Keep plastic enclosures 1cm or more from the antenna in any direction ABSOLUTE MAXIMUM RATINGS Rating Power Supply Voltage RF Input Power Storage Temperature Range Value 3.6
+10
-55 to 125 Unit Vdc dBm C RECOMMENDED OPERATING CONDITIONS Characteristic Power Supply Voltage (Vdd) Input Frequency Ambient Temperature Range Logic Input Low Voltage Logic Input High Voltage Min 2.1 2405
-40 0 70% Vdd Typ 3.3 25 Max 3.6 2480 85 30% Vdd Vdd Unit Vdc MHz C V V Page 4 FreeStar ZFSM-101-3 ELECTRICAL CHARACTERISTICS Parameter General Characteristics RF Frequency Range Output Power (software controlled) Receiver Sensitivity @ 1% PER RF Data Rate Host Data Rate Voltage Operating Range General Purpose Digital I/O (8 Pins) RF Channels (Channels 24, 25, and 26 are set at reduced power levels) DC Electrical Characteristics Transmit Mode 100mW Power Supply Current Receive Mode
(Vdd) = 3.3V, @ 25C Standby Mode Output High Voltage (all digital outputs) Output Low Voltage (all digital outputs) AC Electrical Characteristics Sensitivity for 1% packet error rate (-40 to +85C) Sensitivity for 1% packet error rate (25C) Saturation (maximum input level) Nominal Output Power Output Power Control Range (+20 to 0 dBm) Error Vector Magnitude (RMS EVM) Over the Air Data Rate On-board Antenna Gain (peak) On-board Antenna Gain (average) TyPICAL TRANSMIT POwER VS. POwER SETTING Power Setting Output Power Min 2400 1 2.1 80% Vdd 0 Typ Max Unit 2483.5 100 3.6 8 16 MHz mW dBm kbps kbps V Pins Channels 55 15 Vdd 20% Vdd
-89 35 mA mA uA V V dBm dBm dBm dBm dB
kbps dBi dBi
-91 250 19.2 170 50
-91
-91 10 20 20 250 0.8
-3.1
>= 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 19.8 dBm 19.8 dBm 19.8 dBm 19.2 dBm 17.6 dBm 17.2 dBm 16.8 dBm 16.3 dBm 10.8 dBm 10.4 dBm 9.8 dBm 9.2 dBm 2.7 dBm 2.3 dBm 1.9 dBm 1.5 dBm Page 5 FreeStar ZFSM-101-3 PIN DEFINITIONS PIN ANT2 TPRF1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Note:
TyPE AO/AI AO/AI GND GND GND GND DI/DO DI/DO AI AI PI GND DI DI DI DI/DO DI/DO DI/DO DI DI/DO DI/DO DI/DO DI/DO DI/DO DO DI GND GND GND GND GND GND SIGNAL NAME ANT2 TPRF1 GND GND GND GND PTD3 PTD4 PTB0 PTB1 VCC GND MODE0 MODE1 MODE2 PTA4 PTA5 PTA6 PTA7 ELECTRICAL DESCRIPTION INTEGRATED PBC F-ANTENNA COAXIAL RF TEST POINT 50 OHMS GROUND GROUND GROUND GROUND GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE, PORT D , BIT 3 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE, PORT D , BIT 4 ANALOG TO DIGITAL CONVERTER INPUT, PORT B , INPUT 0 ANALOG TO DIGITAL CONVERTER INPUT, PORT B , INPUT 1 PRIMARY POWER INPUT: VCC = 2.4 TO 3.6 VDC GROUND FCC / PRODUCTION TEST MODE INPUT WORD, BIT 0 FCC / PRODUCTION TEST MODE INPUT WORD, BIT 1 FCC / PRODUCTION TEST MODE INPUT WORD, BIT 2 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT A, BIT 4, KBI1P4 (KEYBOARD INTERRUPT) GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT A, BIT 5, KBI1P5 (KEYBOARD INTERRUPT) GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT A, BIT 6, KBI1P6 (KEYBOARD INTERRUPT) DIGITAL INPUT CONFIGURED TO INTERRUPT ON RISING EDGE OF SIGNAL TO WAKE UP MODULE FROM SLEEP MODE. PORT A, BIT 7, KBI1P7 (KEYBOARD INTERRUPT) PORT G, BIT 0, BKGD/MS (BACKGROUND/MODE SELECT, FOR PROGRAMMING AND FIRMWARE DEBUG) PTGO
/RESET1 MASTER RESET, ACTIVE LOW PTC0 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT C, BIT 0, SCI2 TXD2 (SERIAL COMMUNICATION INTERFACE 2, TRANSMIT DATA) GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT C, BIT 1, SCI2 RXD2 (SERIAL COMMUNICATION INTERFACE 2, RECEIVE DATA) RESERVED APPLICATION TRANSMIT DATA OUTPUT (SCI1, TXD1) APPLICATION RECEIVE DATA INPUT (SCI1, RXD1) GROUND GROUND GROUND GROUND GROUND GROUND PTC1 PTC5 TXD RXD GND GND GND GND GND GND 1 Use an Open Collector Output to Drive the Reset pin or put a 1k Ohm resistor in series with the driving source. Normally the reset pin is an output; however, under brown out and other reset conditions the Freescale microcontroller will drive the pin low. Page 6 FreeStar ZFSM-101-3 CONNECTOR LEGEND TyPE DI DO AI AO PI GND LOGIC INPUT HIGH LOGIC INPUT LOW LOGIC OUTPUT HIGH (VCC 0.8) < VOH < VCC LOGIC OUTPUT LOW 0 < VOL < 0.2 (VCC) DEFINITION DIGITAL INPUT DIGITAL OUTPUT ANALOG INPUT ANALOG OUTPUT POWER INPUT GROUND 0.7 (VCC) < VIH < (VCC) 0 < VIL < 0.3 (VCC) CONNECTOR CONFIGURATION SHD1 GND GND GND GND PDT3 PDT4 PDB0 PDB1 VCC GND MODE0 GND GND GND GND GND GND RXD TXD PTC5 PTC1 PTC0 1 E D O M 2 E D O M 4 A T P 5 A T P 6 A T P 7 A T P 0 G T P T E S E R
Note: The PIN Numbering begins at top left-hand side with pin number 1 and follows counter-clockwise about the perimeter of the module. Page 7 FreeStar ZFSM-101-3 RADIATION PATTERNS FreeStar Rev B 2440 MHz Device Orientation Polarization
(V)
(V)
(H)
(H)
(F)
(F) Vertical Horizontal Vertical Horizontal Vertical Horizontal Gain (dB) Max Avg
-1.72 0.60
-12.37
-7.27
-10.91
-4.00 0.02
-5.90
-13.52
-6.62 0.85
-4.67 Total Average Gain (dB)
-3.15 Vertical Horizontal Flat Page 8 FreeStar ZFSM-101-3 EXAMPLE INTERFACE DIAGRAMS Sample Connection Diagram when Using Serial Interface Sample Connection Diagram when Using Host Processor Interface Page 9 FreeStar ZFSM-101-3 MODULE DIMENSIONS Note: Unless otherwise specified, dimensions are in inches. PCB FOOTPRINT Note: Unless otherwise specified, dimensions are in inches. TOP VIEW PCB COPPER PATTERN FOR REFERENCE ONLY 0.047 Recommended Host PCB Board Edge 0.047 1 30 1.115 0.098
(2.5mm) Pitch Throughout 0.060 TYP 30 Places 0.090 TYP 30 Places 0.098
(2.5mm) Pitch Throughout 0.068 0.068 0.885 Page 10 FreeStar ZFSM-101-3 MODULE KEEPOUTS Note: Unless otherwise specified, dimensions are in inches. Module - Dimensions and Keepouts COPPER AND COMPONENT KEEPOUT 1.425 TOP VIEW 0.975 COPPER KEEPOUT HOST PCB EDGE 30 29 28 27 26 25 24 23 22 21 20 MODULE TOP VIEW 12 13 14 15 16 17 18 19 COMPONENT KEEPOUT 1 2 3 4 5 6 7 8 9 10 11 COPPER AND COMPONENT KEEPOUT 0.265 RECOMMENDED MODULE EXTENSION OVER EDGE OF HOST PCB 0.100 PRIMETER AROUND MODULE
NO COPPER/TRACES ALLOWED ON ANY LAYER OF HOST PCB IN THIS AREA COPPER AND COMPONENT KEEPOUT AREA
NO COMPONENTS ON EITHER TOP OR BOTTOM SIDES OF HOST PCB ALLOWED WITHIN 0.100 OF MODULE COMPONENT KEEPOUT - NO HOST BOARD PERIPHERAL COMPONENTS ALLOWED WITHIN 0.100 OF MODULE
NO COMPONENTS ON EITHER TOP OR BOTTOM SIDES OF HOST PCB ALLOWED IN THIS AREA IF OVER HANG METHOD OF MOUNTING IS NOT USED
NO COPPER/TRACES ALLOWED ON ANY LAYER OF HOST PCB IN THIS AREA Page 11 FreeStar ZFSM-101-3 PROCESSING Recommended Reflow Profile Parameters Values Ramp Up Rate (from Tsoakmax to Tpeak) Minimum Soak Temperature Maximum Soak Temperature Soak Time TLiquidus Time above TL Tpeak Time within 5 of Tpeak Time from 25 to Tpeak Ramp Down Rate 3/sec max 150C 200C 60-120 sec 217C 60-150 sec 250C 20-30 sec 8 min max 6C/sec max Pb-Free Solder Paste Use of No Clean solder paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations (half vias) where they contact the host board should meet the appropriate IPC Specification. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section. Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. The best approach is to consider using a No Clean solder paste and eliminate the post-soldering cleaning step. Optical Inspection After soldering the module to the host board, consider optical inspection to check the following:
Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and neighboring pads. Water could also damage any stickers or labels. Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which Ultrasonic cleaning could damage the module permanently. the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. Proper alignment and centering of the module over the pads. Proper solder joints on all pads. Excessive solder or contacts to neighboring pads or vias. Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards. wave Soldering If a wave soldering process is required on the host boards due to the presence of thru hole components, only a single wave soldering process is encouraged. Page 12 FreeStar ZFSM-101-3 PROCESSING (Continued) Hand Soldering Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711). Rework The module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak reflow temperature of 250 C. Caution If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to thermal shock. Avoid overheating. warning Never attempt a rework on the module itself, (e.g., replacing individual components). Such actions will terminate warranty coverage. Additional Grounding Attempts to improve module or system grounding by soldering braids, wires or cables onto the module RF shield cover is done at the customer's own risk. The numerous ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference. SHIPMENT, HANDLING AND STORAGE Shipment The modules are delivered in trays of 50. Handling The modules are designed and packaged to be processed in an automated assembly line. warning The modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. warning The modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) MSL 3, per J-STD-033. Storage Storage/shelf life in sealed bags is 12 months at <40C and <90% relative humidity. QUALITy CEL modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with the IPC-A-610 specification, Class II. Our modules go through JESD22 qualification processes which includes high temperature operating life tests, mechanical shock, temperature cycling, humidity and reflow testing. CEL modules are 100% factory tested for RF and DC performance. In addition, every production lot is sample tested for compliance with CELs high quality and performance standards. CEL builds quality into our products giving our customers the confidence when integrating our products into their systems. Page 13 FreeStar ZFSM-101-3 AGENCy CERTIFICATIONS FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference 2. This device must accept any interference received, including interference that may cause undesired operation Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
d'en compromettre le fonctionnement 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible warning (Part 15.21) Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation Distance To comply with FCC/IC RF exposure limits for general population/uncontrolled exposure, the antenna(s) used for this trans-
mitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. OEM Responsibility to the FCC Rules and Regulations The FreeStar Module has been certified per FCC Part 15 rules for integration into products without further testing or certifi-
cation. To fulfill the FCC certification requirements, the OEM of the FreeStar Module must ensure that the information provided on the FreeStar Label is placed on the outside of the final product. The FreeStar Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the out-
side of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: TFB-FREESTAR3 or Contains FCC ID:
TFB-FREESTAR3 The OEM of the FreeStar Module must only use the approved antenna, that has been certified with this module. The OEM of the FreeStar Module must test their final product configuration to comply with Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules. IC Certification Industry Canada Statement The term "IC" before the Certification/Registration number only signifies that the Industry Canada technical specifications were met. This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two con-
ditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Certification IC - Dclaration d'Industrie Canada Le terme "IC" devant le numro de certification/d'enregistrement signifie seulement que les spcifications techniques Industrie Canada ont t respectes.-
Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement Page 14 FreeStar ZFSM-101-3 AGENCy CERTIFICATIONS (Continued) Section 14 of RSS-210 The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php L'article 14 du CNR-210 Le programme d'installation de cet quipement radio doit s'assurer que l'antenne est situe ou oriente de telle sorte qu'il ne pas mettre de champ RF au-del des limites de Sant Canada pour la population gnrale. Consulter le Code de scurit 6, disponible sur le site Web de Sant Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/
index-eng.php EMC Certification FCC Part 15.247 Module Certified (Portable) EN 300 328 1 Certified / CE Approved The FreeStar Module has been tested and certified for the European Union. OEM Responsibility to the European Union Compliance Rules If the FreeStar Module is to be incorporated into a product, the OEM must verify compliance of the final product to the Eu-
ropean Harmonized EMC and Low-Voltage/Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to make a submission to the notified body for compliance testing. OEM Labeling Requirements The `CE' mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials CE with the following form:
If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to The CE mark must be a minimum of 5mm in height If the use of the module is subject to restrictions in the end application, the CE marking on the OEM product should also include the alert sign as shown in the picture to the right Australia Certification Number: AS/NZS 4268 Page 15 FreeStar ZFSM-101-3 REFERENCES & REVISION HISTORy Changes to Current Version Initial preliminary datasheet. Updated electrical characteristics, software revisions. Rolled part number to -3, updated power amplifier section Updated FCC information Page(s) N/A 1, 4, 6 1, 2, 3, 5 3 Previous Versions 0001-00-07-01-000
(Issue ES) October 10, 2011 0001-00-07-01-000
(Issue ES) October 26, 2011 0001-00-07-01-000 October 18, 2012 0001-00-07-01-000 October 26, 2012 Disclaimer The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customers equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. Page 16 FreeStar ZFSM-101-3