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MeiG_SLM320_Hardware Design Manual
Controlled Version Number: V1.2 Release date2021-06-18
MeiG_SLM320_Hardware Design Manual Important Notice Copyright Notice All rights reserved. MeiG Smart Technology Co., Ltd This manual and all its contents are owned by MeiG Smart Technology Co., Ltd and protected by Chinese laws and relevant copyright laws in applicable international conventions. Without the written authorization of MeiG Smart Technology Co., Ltd, no one may copy, disseminate, distribute, modify or use part or all of this manual in any form, and the offenders will be held responsible according to law. Statement of No Guarantee MeiG Smart Technology Co., Ltd makes no representations or guarantees, either express or implied, for any contents in this document, and assumes no responsibility for the merchantability and fitness for a particular purpose or any indirect, extraordinary or consequential losses. Confidentiality Claim The information contained in this document (including any annexes) is confidential. The recipient understands that the document obtained by him is confidential and shall not be used for any purpose other than the stated purpose, and he shall not disclose this document to any third party. Disclaimer The company assumes no responsibility for property damage or personal injury caused by customers improper operation. Customers are requested to develop corresponding products according to the technical specifications and reference designs in the manual. Before the disclaimer, the company has the right to change the contents of this manual according to the needs of technological development, and the version is subject to change without further notice. MeiG Smart Technology Co., Ltd 1/89 MeiG_SLM320_Hardware Design Manual Revision History Revision Date Description V1.0 2020-04-21 First edition V1.1 2021-04-22 Modify file format and correct description V1.2 2021-06-18 Update SLM320-LA performance for B2/B4 frequency information and added RF MeiG Smart Technology Co., Ltd 2/89 MeiG_SLM320_Hardware Design Manual Contents Important Notice ....................................................................................................................................... 1 Revision History ....................................................................................................................................... 2 Contents .................................................................................................................................................... 3 1 Introduction ....................................................................................................................................... 5 1.1 Safety instruction ...................................................................................................................... 6 2 Product Overview ............................................................................................................................. 7 2.1 General Description .................................................................................................................. 7 2.2 Key Features ............................................................................................................................. 7 2.3 Functional block diagram ........................................................................................................ 10 2.4 Evaluation Kit .......................................................................................................................... 11 3 Application Interface ...................................................................................................................... 12 3.1 General Description ................................................................................................................ 12 3.2 Pin Assignment ....................................................................................................................... 13 3.3 PIN Description ....................................................................................................................... 14 3.4 Power source .......................................................................................................................... 22 3.4.1 Power Supply ................................................................................................................ 23 3.4.2 Reduce voltage drop ..................................................................................................... 23 3.4.3 Power Supply Reference Circuit ................................................................................... 24 3.4.4 VDD_EXT voltage output .............................................................................................. 24 3.5 Start up .................................................................................................................................... 25 3.5.1 PWRKEY Pin boot ........................................................................................................ 25 3.5.2 Power off ....................................................................................................................... 26 3.6 Reset Function ........................................................................................................................ 26 3.6.1 Hardware Reset ............................................................................................................ 26 3.6.2 AT command Reset ...................................................................................................... 27 3.7 USIM/SIM Interface ................................................................................................................. 28 3.8 USB port .................................................................................................................................. 30 3.8.1 USB Pin Description ..................................................................................................... 30 3.8.2 USB Reference Circuit .................................................................................................. 30 3.9 Serial Port ............................................................................................................................... 31 3.10 Status indication ..................................................................................................................... 33 3.11 Low Power Mode .................................................................................................................... 35 3.11.1 Flight mode ................................................................................................................. 35 3.11.2 Sleep mode ................................................................................................................. 35 3.11.3 Ultra low power mode ................................................................................................. 36 3.12 ADC Function ......................................................................................................................... 36 3.13 USB_BOOT Port ..................................................................................................................... 37 4 GNSS Receiver ................................................................................................................................ 38 4.1 General Description ................................................................................................................ 38 4.2 GNSS Performance ................................................................................................................ 38 4.3 Layout Guidelines ................................................................................................................... 38 4.4 Antenna connection ................................................................................................................ 38 5 Antenna interface............................................................................................................................ 39 5.1 Introduction to Antenna Interface ........................................................................................... 39 MeiG Smart Technology Co., Ltd 3/89 MeiG_SLM320_Hardware Design Manual 5.2 Radio frequency reference circuit ........................................................................................... 39 5.3 Installation of antenna ............................................................................................................. 40 5.3.1 Antenna requirements ................................................................................................... 40 5.3.2 RF output power ........................................................................................................... 41 5.3.3 RF reception sensitivity ................................................................................................. 42 5.3.4 Working frequency ........................................................................................................ 43 5.3.5 OTA Antenna requirements ....................................................................................... 45 6 Electrical characteristics ............................................................................................................... 46 6.1 Absolute Maximum Ratings .................................................................................................... 46 6.2 Ambient Temperature Range ................................................................................................. 46 6.3 Electrical Characteristics of Interface Working State ............................................................. 46 6.4 Module Power Consumption Range ....................................................................................... 47 6.5 Environmental reliability requirements .................................................................................... 78 6.6 ESD character ......................................................................................................................... 78 7 Mechanical characteristics ............................................................................................................ 80 7.1 Module Mechanical Dimensions ............................................................................................. 80 7.2 Recommended Footprint ........................................................................................................ 81 7.3 Top View of Module ................................................................................................................ 82 7.4 Bottom View of Module ........................................................................................................... 82 8 Storage and production ................................................................................................................. 83 8.1 Storage .................................................................................................................................... 83 8.2 Reflow Profile .......................................................................................................................... 83 8.3 Packaging ............................................................................................................................... 84 9 Appendix A refers to documentation and term abbreviations .................................................. 85 9.1 Reference File ......................................................................................................................... 85 9.2 Symbol Key ............................................................................................................................. 85 10 Appendix B GPRS Coding Scheme .............................................................................................. 89 MeiG Smart Technology Co., Ltd 4/89 MeiG_SLM320_Hardware Design Manual 1 Introduction This document describes SLM320 module air interface and hardware interface that connected to the clients applications. This document can help customers quickly understand SLM320 module interface specification, electrical characteristics, mechanical specifications and related product information. With the help of this document, combined with our application manual and user instructions, customers can quickly apply SLM320 module to wireless IoT applications. SLM320 Wireless module is a wide band wireless terminal product applicable to TDD-LTE/FDD-LTE/GSM, a variety of network standards. SLM320 Supports access rate:
TDD-LTE:8Mbps/2Mbps;
FDD-LTE:10Mbps/5Mbps;
GPRS: 85.6kbps/85.6kbps;
SLM320 not only provides wireless data access, but also provides voice mesdrope and other functions. SLM320 can be widely used in the field of M2M, such as OBD, CPE, router, data card, DTU, security and industrial PDA, etc. MeiG Smart Technology Co., Ltd 5/89 MeiG_SLM320_Hardware Design Manual 1.1 Safety instruction Following below safety principles, user could ensure personal safety and protect products and work environment from potential damage. Driving safety first! Do not use a hand-held mobile terminal while driving, unless it has a hands-free function. Stop before making a call!
Before boarding, please turn off the wireless function of the mobile terminal. It is prohibited to turn on the wireless function of the mobile terminal on the airplane to prevent interference with the airplane communication system. Ignoring this prompt may lead to flight safety or even violate the law. In a hospital or health care setting, be aware that there are mobile terminal devices that may need to be turned off because limited RF interference will cause medical devices to malfunction. The mobile terminal device will not be able to connect effectively under all circumstances. If the mobile device has no phone charge or the SIM is invalid, please remember to make an emergency call when you encounter the above situations in an emergency, and ensure that your device is turned on and in an area with sufficient signal strength. Your mobile terminal device will receive and transmit rf signals when it is turned on. When it is close to TV, radio, computer or other electronic devices, RF interference will be generated. Keep mobile devices away from flammable gases. When you are near a gas station, oil depot, chemical plant or explosion site, turn off mobile terminals. Operating electronic devices in any potentially explosive site is a safety hazard. MeiG Smart Technology Co., Ltd 6/89 MeiG_SLM320_Hardware Design Manual 2 Product Overview 2.1 General Description SLM320 is a wireless communication module that supports TDD-LTE/FDD-LTE/GSM, supports TDD-LTE FDD-LTE GPRS network data connection, and can provide digital voice (PCM) and analog voice, SMS and other functions such as Wi-Fi Scan/BT, GNSS* (GPS/GLONASS/BD). Table 1 SLM320 modules frequency band Internet SLM320-E SLM320-C SLM320-LA TDD-LTE B38/40/41 B34/B38/39/40/41 B40 FDD-LTE B1/B3/B5/B7/B8/B20 B1/B3/B5/B8 B1/B2/B3/B4/B5/B7/B8
/B20/B28 GSM
850/900/1800/1900 850/900/1800 850/900/1800/1900
* GNSS is optional with a specified PN of the SLM320 module SLM320 adopts highly integrated design scheme of the RF and baseband integrated on a single PCB, The baseband signal processing and audio signal processing functions adopt a single-sided layout, and the module structure size is: 32.029.02.4mm. SLM320 can be widely used in field of M2M, for example, OBD, CPE, routers, DTU, security and industrial-grade PDA etc.
2.2 Key Features The following table describes the detailed features of SLM320 module. Table 2 Key features of SLM320 module Features Details Power supply Transmitted power VBAT Supply voltage range3.4V4.5V Typical supply voltage3.8V Class 4 (33dBm2dB) for GSM900 PCL5 Class 1 (30dBm2dB) for DCS1800 PCL0 Class E2 (27dBm3dB) for GPRS900 PCL8 Class E2 (26dBm3dB) for GPRS1800 PCL2 Class 3 (23dBm2.7dB) for FDD-LTE bands Class 3 (23dBm2.7dB) for TDD-LTE bands MeiG Smart Technology Co., Ltd 7/89 LTE Characteristic GSM character Network protocol features Short Message serviceSMS GNSS character USIM Port Audio Features PCM Interface MeiG_SLM320_Hardware Design Manual The maximum supportCAT1 Bis Support 1.4 ~ 20 MHZ radio frequency bandwidth FDDThe maximum UL rate is 5Mbps, and the maximum DL rate is 10Mbps TDDHe maximum UL rate is 2Mbps, and the maximum DL rate is 8Mbps CSD transmission rate: 9.6 KBPS, 14.4 KBPS Support GPRS multi - slot class 12 (the default is 12) Coding formats: / CS-1/CS -2/CS --3 and CS - 4 Maximum 4 RX slots per frame Embedded TCP/IP and UDP/IP protocol stack Text and PDU mode point-to-point MO and MT Short Message storage: stored in the SIM card by default Cell broadcast Cold start time<40S Hot start time<5S Tracking sensitivity-160dBm Acquisition sensitivity-147dBm Position accuracy<3m GNSS Data typeNMEA-0183 Support USIM/SIM1.8Vand3V Support 1 channel digital audio interfacePCM port Support analog MIC signal input interface all the way Support one loudspeaker signal output interface 0.8W@4.2V /D0.6W@4.2V/AB For audio use, external CODEC chip is required Support USB2.0 To the AT command, data transmission, software USB Interface debugging and software upgrades USB driveSupport Windows7Windows 8/8.1 Serial Interface SD Interface AT Commands Network Indicator Windows10 The serial port To AT commands and data transmission Baud rate is default 115200bps Support RTS and CTS hardware flow control DBG Port To develop debug, the log output Baud rate is default115200bps Conforms to SD3.0 protocol Comply with 3GPP TS 27.007, 27.005, and MeiG enhanced AT command NET_STATUSNET_MOD these two pins indicate the state of the network MeiG Smart Technology Co., Ltd 8/89 Antenna Interface Physical Property Te Temperature Range Software Upgrading RoHS Main antenna interfaceANT_MAIN MeiG_SLM320_Hardware Design Manual Size32.029.02.4mm Weight7 gram Normal operating temperature-30+75 Storage temperature-40+85 USB port/FOTA All devices comply fully with EU RoHS standards Environment Humidity 5%~95%
ESD GND:+ 8 KV air discharge, the contact discharge plus or minus 4 KV Antenna interface: air discharge 8KV, contact discharge 4KV Package 144 Pin LGA+LCC port LCC Functional Interface Power interface USB2.0 High-Speed port UART interface USIM/SIM portsupport 3V1.8V PCM interface MIC input interface Speaker output interface Hardware reset interface Indicator interface Keyboard interface Sleep control interface Flight mode control interface ADC interface I2C interface SPI interface SD interface USB_BOOT port MeiG Smart Technology Co., Ltd 9/89 MeiG_SLM320_Hardware Design Manual 2.3 Functional block diagram Following is the functional block diagram of SLM320, illustrating its main functions. PMU BBU The radio frequency part peripheral interface Internal memory Figure 1 Functional block diagram MeiG Smart Technology Co., Ltd 10/89 MeiG_SLM320_Hardware Design Manual 2.4 Evaluation Kit To facilitate testing and use of the SLM320 module, MeiG provides an evaluation Kit to customer. Evaluation Kit includes USB cables, antennas, and other peripherals. Please refer to the specific use method of evaluation board MeiG_SLM320_Mini PCIe_EVB_UGD MeiG Smart Technology Co., Ltd 11/89 MeiG_SLM320_Hardware Design Manual 3 Application Interface 3.1 General Description SLM320 adopts LCC+LGA interface, total 144 pins, including 80 LCC pins and 64 LGA pins, providing the following functional interfaces:
Power port USB2.0 High-Speed port UART port USIM/SIM portsupport 3V1.8V PCM port MIC input interface The speaker output interface Hardware reset interface Pilot light interface Keyboard interface Sleep control interface Flight mode control interface ADC port I2C port SPI port SD port USB_BOOT port MeiG Smart Technology Co., Ltd 12/89 MeiG_SLM320_Hardware Design Manual 3.2 Pin Assignment The following figure shows the pin assignment of SLM320 module. Figure 2 Pin Assignment Note:
The pin name in the pin diagram is the actual wiring name inside the module. MeiG Smart Technology Co., Ltd 13/89 MeiG_SLM320_Hardware Design Manual 3.3 PIN Description The following table shows the definition of each pin in the SLM320 module. Table 3 IO Parameter Definitions Type Description IO DI DO OD AI BOT PI PO I/O two-way signal. Digital input signal. Digital output signal. Open drain output signal. Analog signal input Two-way signal with leaky output. power input power output Table 4 Pin Description Pin number Pin name I/O Electrical level Description Remark 1 2 3 4 WAKEUP_IN I/O VILnom=0V VIHnom=1.8V AP_READY I/O VILnom=0V VIHnom=1.8V SLEEP_IND I/O VOLnom=0V VOHnom=1.8V W_DISABLE#
I/O VILnom=0V VIHnom=1.8V External device wake up module If not, please suspend this pin The module checks whether the host is sleeping If not, please suspend this pin Systematic sleep indicator If not, please suspend this pin Modular flight mode controlIf not, please suspend this pin GPIO29 GPIO30 GPIO8 GPIO31 MeiG Smart Technology Co., Ltd 14/89 5 6 7 8 9 13 14 15 16 17 NET_MODE I/O VOLnom=0V VOHnom=1.8V NET_STATUS I/O VOLnom=0V VOHnom=1.8V VDD_EXT PO 1.8V MeiG_SLM320_Hardware Design Manual GPIO13 GPIO19 Module network mode indication signal If not, please suspend this pin Module network status indicator If not, please suspend this pin Module digital level, 1.8V output, 50mA load capacity If not, please suspend this pin GND GND G G G 10 USIM_GND 11 DBG_RXD I 12 DBG_TXD O VILnom=0V VIHnom=1.8V VOLnom=0V VOHnom=1.8V USIM_PRESEN CE I VILnom=0V VIHnom=1.8V GND GND GND Debug serial port receiving If not, please suspend this pin Debug serial port sending If not, please suspend this pin USIM card hot swap detection If not, please suspend this pin Software shutdown detection function USIM_VDD PO 1.8V/3.0V USIM power supply USIM_DATA I/O 1.8V/3.0V USIM data signal line USIM_CLK O 1.8V/3.0V USIM clock signal line USIM_RST O 1.8V/3.0V USIM reset signal line 18 GPIO18 IO VILnom=0V VIHnom=1.8V If not, please suspend this pin The module is internally connected with UART2_ RTS, default NC MeiG Smart Technology Co., Ltd 15/89 MeiG_SLM320_Hardware Design Manual GND VILnom=0V VIHnom=1.8V VILnom=0V VIHnom=1.8V Module reset signal, low level valid Module power on / off signal Low level active 19 20 21 22 GND RESET_N PWRKEY GND G I I G 23 SD1_DETECT I 24 PCM_IN(I2S_DI) I VILnom=0V VIHnom=1.8V VILnom=0V VIHnom=1.8V 25 26 27 PCM_OUT(I2S_ DO) O VOLnom=0V VOHnom=1.8V PCM_SYNC(I2S _SYNC) I/O 0V/1.8V PCM_CLK(I2S_ CLK) I/O 0V/1.8V 28 SDC2_DATA_3 I/O 1.8V/3.0V 29 SDC2_DATA_2 I/O 1.8V/3.0V 30 SDC2_DATA_1 I/O 1.8V/3.0V 31 SDC2_DATA_0 I/O 1.8V/3.0V 32 SDC2_CLK O 1.8V/3.0V 33 SDC2_CMD O 1.8V/3.0V 34 VDD_SDIO PO 1.8V/3.0V GND SD card hot swap detection signal If not, please suspend this pin PCM data input If not, please suspend this pin PCM data output If not, please suspend this pin PCM data synchronization signal If not, please suspend this pin PCM clock signal If not, please suspend this pin SDC2_DATA_3 If not, please suspend this pin SDC2_DATA_2 If not, please suspend this pin SDC2_DATA_1 If not, please suspend this pin SDC2_DATA_0 If not, please suspend this pin SDC2_CLK If not, please suspend this pin SDC2_CMD If not, please suspend this pin SD card pull-up power supply, power supply capacity 150mA MeiG Smart Technology Co., Ltd 16/89 WIFI_ANT(BT_A NT) I MeiG_SLM320_Hardware Design Manual WiFi / BT antenna If not, please suspend this pin The module is internally connected with BT_ ANT GND G GND 35 36 37 SPI_CS_N O 38 SPI_MOSI O 39 SPI_MISO I 40 SPI_CLK O 41 I2C_SCL OD VOLnom=0V VOHnom=1.8V VOLnom=0V VOHnom=1.8V VILnom=0V VIHnom=1.8V VOLnom=0V VOHnom=1.8V VOLnom=0V VOHnom=1.8V 42 I2C_SDA BOT 0V/1.8V 43 ADC2*
AI 44 ADC1 AI 45 ADC0 AI SPI chip selection signal If not, please suspend this pin SPI_MOSI If not, please suspend this pin SPI_MISO If not, please suspend this pin SPI_CLK If not, please suspend this pin I2C interface clock signal If not, please suspend this pin I2C interface data signal If not, please suspend this pin ADC interface 2 When in use, 1K in series, If not, please suspend this pin ADC interface 1 When in use, 1K in series, If not, please suspend this pin ADC interface 0 When in use, 1K in series, If not, please suspend this pin 46 47 48 49 GND G GND ANT_GNSS GPS antenna If not, please suspend this pin GND G GND ANT_MAIN I/O Main collector antenna MeiG Smart Technology Co., Ltd 17/89 50 51 52 53 54 55 56 57 MeiG_SLM320_Hardware Design Manual GND GND GND GND GND G G G G G GND GND GND GND GND RESERVED RESERVED GND G GND VBAT_RF PI 58 VBAT_RF PI 59 VBAT_BB PI 60 VBAT_BB PI 61 STATUS O Vmax=4.5V Vmin=3.2V Vnorm=3.6V Vmax=4.5V Vmin=3.2V Vnorm=3.6V Vmax=4.5V Vmin=3.2V Vnorm=3.6V Vmax=4.5V Vmin=3.2V Vnorm=3.6V VOLnom=0V VOHnom=1.8V 62 RI*
O VOLnom=0V VOHnom=1.8V 63 64 65 66 67 68 UART2_TXD O CTS*
RTS*
O O UART_2_RXD O MAIN_TXD O MAIN_RXD I VOLnom=0V VOHnom=1.8V VOLnom=0V VOHnom=1.8V VOLnom=0V VOHnom=1.8V VOLnom=0V VOHnom=1.8V VOLnom=0V VOHnom=1.8V VILnom=0V VIHnom=1.8V MeiG Smart Technology Co., Ltd RF power input RF power input Baseband power input Baseband power input Reserved status indication interface If not, please suspend this pin Module output ringing prompt If not, please suspend this pin Module sends data If not, please suspend this pin Connected to Vbat Connected to Vbat Connected to Vbat Connected to Vbat GPIO22 UART2_TXD Module clear send UART1_CTS Module request sending UART1_RTS The module receives data Module sends data If not, please suspend this pin The module receives data UART_2_RX D UART1_ TXD, for at command UART1_ RXD, for at 18/89 MeiG_SLM320_Hardware Design Manual If not, please suspend this pin command 69 70 71 72 USB_DP USB_DM I/O I/O USB_VBUS AI Vnorm=5.0V USB signal DP USB signal DM USB insertion detection signal GND G GND 73 KEYOUT2 I 74 KEYOUT3 I 75 76 77 SPK_P O RESERVED SPK_N 78 KEYIN1 O I 79 KEYIN2 I 80 KEYIN3 I 81 KEYIN4 I 82 KEYIN5 I 83 KEYOUT0 O Keyboard matrix input signal If not, please suspend this pin Keyboard matrix input signal If not, please suspend this pin SPK_P If not, please suspend this pin SPK_N If not, please suspend this pin Keyboard matrix input signal If not, please suspend this pin Keyboard matrix input signal If not, please suspend this pin Keyboard matrix input signal If not, please suspend this pin Keyboard matrix input signal If not, please suspend this pin Keyboard matrix input signal If not, please suspend this pin Keyboard matrix input signal VILnom=0V VIHnom=1.8V VILnom=0V VIHnom=1.8V VILnom=0V VIHnom=1.8V VILnom=0V VIHnom=1.8V VILnom=0V VIHnom=1.8V VOLnom=0V VOHnom=1.8V MeiG Smart Technology Co., Ltd 19/89 84 KEYOUT1 O VOLnom=0V VOHnom=1.8V MeiG_SLM320_Hardware Design Manual If not, please suspend this pin Keyboard matrix input signal If not, please suspend this pin 85-112 GND G GND 113 MIC_P1 114 MIC_N1 I I 115 USB_BOOT I 116 NC(ZSP_UART_ TXD) 117 CLK26M_OUT O VOLnom=0V VOHnom=1.8V VOLnom=0V VOHnom=1.8V VILnom=0V VIHnom=1.8V If not, please suspend this pin If not, please suspend this pin USB_ BOOT And VDD_ Ext short circuit into emergency download mode Reserved pin, default NC CLK26M_OUT If not, please suspend this pin 118 NC(PSM_EXT_I NT) NC 119 LCD_FMARK O 1.8V/3.0V 120 LCD_RSTB O 1.8V/3.0V 121 SPILCD_SEL O 1.8V/3.0V 122 SPILCD_CS O 1.8V/3.0V 123 SPILCD_CLK O 1.8V/3.0V LCD_FMARK If not, please suspend this pin LCD_RSTB If not, please suspend this pin SPILCD_SEL If not, please suspend this pin SPILCD_CS If not, please suspend this pin SPILCD_CLK If not, please suspend this pin It can be reused as keyin0 The module is internally connected with ZSP_ UART_ TXD The module is internally connected with PSM_ EXT_ Int, default NC MeiG Smart Technology Co., Ltd 20/89 124 SPILCD_SDC O 1.8V/3.0V SPILCD_SDC MeiG_SLM320_Hardware Design Manual 125 SPILCD_SI/O I/O 1.8V/3.0V 126 UART2_RTS I VILnom=0V VIHnom=1.8V 127 128 RESERVED RESERVED 129 SD1_DATA3 I/O 1.8V/3.0V 130 SD1_DATA2 I/O 1.8V/3.0V 131 SD1_DATA1 I/O 1.8V/3.0V 132 SD1_DATA0 I/O 1.8V/3.0V 133 SD1_CLK O 1.8V/3.0V 134 SD1_CMD O 1.8V/3.0V SPILCD_SI/O If not, please suspend this pin Module clear send If not, please suspend this pin RESERVED RESERVED SD1_DATA3 If not, please suspend this pin SD1_DATA2 If not, please suspend this pin SD1_DATA1 If not, please suspend this pin SD1_DATA0 If not, please suspend this pin SD1_CLK If not, please suspend this pin SD1_CMD If not, please suspend this pin 135 RESERVED RESERVED 136 SYS_STATE 137 UART3_RXD I I 138 UART3_TXD O 139 REF_CLK O VILnom=0V VIHnom=1.8V VOLnom=0V VOHnom=1.8V Reserve data pin of camera If not used, suspend this pin UART3_ RXD, If not used, suspend this pin UART3_ TXD, If not used, suspend this pin Reserve CLK of camera Configurable as GPIO If not used, suspend this pin 140*
RESERVED RESERVED MeiG Smart Technology Co., Ltd 21/89 MeiG_SLM320_Hardware Design Manual 141 142 I2C3_SCL OD VOLnom=0V VOHnom=1.8V I2C3_SCL I2C3_SDA BOT 0V/1.8V I2C3_SDA 143 RFCTL_1 O 144 RFCTL_2 O VOLnom=0V VOHnom=1.8V RFCTL_1 If not used, suspend this pin VOLnom=0V VOHnom=1.8V RFCTL_2 If not used, suspend this pin The module is actually connected to rfctl 3 The module is actually connected to rfctl 4 Remark:
1. 2. The above interface functions are not supported at the same time, some pins are reusable functions,
* Is a function under development please pay attention when selecting!
3. See the documentation for SLM320 pin multiplexing SLM320_GPIO unction multiplex. 3.4 Power source Table 5 Description of SLM320 module power interface. Pin Name I/O Pin Description VBAT_RF VBAT_BB PI PI 57,58 59,60 Module power supply, 3.4~4.5V, nominal value 3.8 Module power supply, 3.4~4.5V, nominal value 3.8 VDD_EXT PO 7 Voltage output, 1.8V GND G 8,9,19,22,36,46,48,50-5 4,56,85-112 GND MeiG Smart Technology Co., Ltd 22/89 MeiG_SLM320_Hardware Design Manual 3.4.1 Power Supply SLM320 module is powered through VBAT pin. The power supply recommended reference design is shown in Figure 3 VBAT
C1 C2 C3 C4
C5 C6 C7 C8 100uF 100nF 33pF 10pF 100uF 100nF 33pF 10pF D1 TVS VBAT_RF VBAT_BB Module Figure 3 Module power supply circuit 3.4.2 Reduce voltage drop SLM320 power supply range is from 3.2 V to 4.5 V, during data transmission or voice call, the ripple current up to 2A typically, due to GSM/GPRS emission burst (every 4.615ms), it may cause voltage drop. So the power supply for these pads must be able to provide sufficient current up to more than 2A. User needs to make sure that the input voltage will never drop below 3.3V. Figure 4 shows the voltage drop during burst transmission under 2G network. VBAT Min.3.3V Drop Ripple Figure 4 Burst transmission power requirements To reduce voltage drop, a 100uF filter capacitor with low ESR is required. MLCC has the best ESR. It is recommended to add 3 ceramic capacitors (100nF, 33pF, 10pF) to VBAT_BB and VBAT_RF pins, and the capacitors should be placed close to VBAT pins. At the same time, in order to ensure better power supply performance, a TVS tube is added near the input end of the module VBAT to improve the module's electrostatic bearing capacity. When the external power supply is connected to the module, VBAT_BB and VBAT_RF need to adopt star wiring. VBAT_BB wire width shall not be less than 1mm, and VBAT_RF wire width shall not be less than 2mm. In principle, the longer the line in VBAT, the wider MeiG Smart Technology Co., Ltd 23/89 the line. 3.4.3 Power Supply Reference Circuit MeiG_SLM320_Hardware Design Manual The design of the module power supply is very important, because the performance of the module depends largely on the power supply. The SLM320 must select a power source that provides at least 2A current capability. If the voltage difference between the input voltage and the module supply voltage is not very large, it is recommended to choose LDO as the supply. If there is a large voltage difference between the input and output voltages, DCDC is recommended as the power supply for the module. The figure below is the reference design of + 5V power supply circuit. The LDO of MICREL Company is used in the design, and the model is MIC29302WU. The load current is 3.9V and the output voltage is 3.3A.Note that MIC29302WU has the requirement of minimum load current 10mA. Figure 5 Reference design for power supply input 3.4.4 VDD_EXT voltage output When the SLM320 module is normally powered on, there is a voltage output on Pin9_VDD_EXT, the output voltage is 1.8V, and the current load is 50mA. This output voltage can be used as an external pull-up source, such as a level reference, and the Pin status can be read to determine whether the module is switched on or not. MeiG Smart Technology Co., Ltd 24/89 MeiG_SLM320_Hardware Design Manual 3.5 Start up 3.5.1 PWRKEY Pin boot When the SLM320 module is in shut down mode, the module can be turned on by pulling down the PWRKEY for at least 1s. It is recommended to use an open set drive circuit to control PWRKEY pin. The reference circuit is as following:
PWRKEY 500ms Turn on pulse 4.7K 47K Figure 6 Open set drive reference boot circuit Another way to control the PWRKEY pin is through a push button switch. A TVS is placed near the button for ESD protection. The reference circuit is shown as below:
S1 PWRKEY TVS Close to S1 Figure 7 Button startup reference circuit The boot sequence is shown in the figure below NOTE VBAT PWRKEY VDD_EXT RESET_N
(OD) STATUS UART USB 500ms VIL0.3V VH 1.6V 2 ms 2.5s 10s 13s I nactive I nactive Active Active MeiG Smart Technology Co., Ltd 25/89 Figure8 Power-on sequence diagram MeiG_SLM320_Hardware Design Manual Note:
Before pulling down PWRKEY pin, VBAT voltage should be guaranteed to be stable. It is recommended that the time interval between powering up VBAT and pulling down PWRKEY pins should be no less than 30ms. If the module needs to be powered on and started automatically, PWRKEY pin can be directly connected to the ground. The resistance value to GND should not exceed 4k at most. It is recommended to use 0R. 3.5.2 Power off Table 6 Description of three shutdown modes of the module Shut down method Shut of approach Applicable scene Low voltage shutdown When VBAT voltage is too low or power is lost, the module will shut down At this point, the module did not carry out the normal shutdown process, did not follow the process of logout from the base station Hardware shutdown Pull down PWRKEY(greater than 3.1s) and release Normal_shutdown ATshutdown AT+CPOF Soft power-off Remark:
1. When the module is working normally, do not immediately cut off the power supply of the module to avoid damaging the flash data inside the module. It is strongly recommended to power off the module through the AT command before disconnecting the power. 2. When using the AT command to shut down, make sure that PWRKEY is in a high level state after the shutdown AT command is executed; otherwise, the module will start up again automatically after the shutdown is completed. 3.6 Reset Function There are two SLM320 reset modes: hardware reset and AT command reset. 3.6.1 Hardware Reset When the module is working, user can pull down the RESET_N pin by at least 150ms to reset the module. RESET_N signal is sensitive to interference, so it is suggested that the routing should be as short as possible and should be protected by GND traces. MeiG Smart Technology Co., Ltd 26/89 MeiG_SLM320_Hardware Design Manual The reference circuit is similar to the PWRKEY control circuit, and the customer can control the RESET_N pin by using an open set drive circuit or a button. RESET_N 4.7K Reset pulse 47K Figure 9 RESET_N reset the open set reference circuit S2 RESET_N TVS Close to S2 Figure 10 RESET_N reset button reference circuit The reset sequence diagram is as follows:
VBAT RESET_N 150ms VIH1.6V VIL0.3V Figure 11 RESET_N reset sequence diagram 3.6.2 AT command Reset Through SLM320 UART or USB AT port, enter AT+TRB command, make SLM320 reset and restart. MeiG Smart Technology Co., Ltd 27/89 MeiG_SLM320_Hardware Design Manual 3.7 USIM/SIM Interface SLM320 supports both 1.8V and 3.0V SIM cards. Table 7 USIM/SIM interface description Pin Name USIM_DATA USIM_CLK USIM_RESET USIM_VDD USIM_PRESENCE I/O I/O O O O I Pin Pin description 15 16 17 14 13 USIM/SIM data signal USIM/SIM clock signal USIM/SIM reset signal USIM/SIM Power USIM/SIM Hot swap detection signal SLM320 module supports USIM card hot-plugging function through SIM0_DET pin and supports high level detection. After SIM card is inserted in the figure, SIM0_DET pin is at high level. When SIM0_DET pin is at low level, no card is detected. The SIM card hot swap function can be configured by the "AT+SIMHOTSWAP" command. The instructions of the AT command are shown in the following table:
Table 8 description of hot swap function setting of SIM card AT Command SIM card hot swap detection Function declaration AT+SIMHOTSWAP=1 Open AT+SIMHOTSWAP=0 Close By default, the SIM card hot-plug detection function is on, and the module detects whether the SIM card is inserted through the USIM_PRESENCE pin status The SIM card hot-plug detection function is turned off. The SIM card will be read by the module when the machine is turned on. The USIM_PRESENCE status will not be detected After the hot swap detection function of SIM card is turned on, when sim0_ Det is high level. If the module detects that the SIM card is inserted, it will execute the SIM card initialization procedure. After reading the SIM card information, the module will register the network. When sim0_ When det is low power level, the module determines that the SIM card is pulled out, then the SIM card is not read. SIM0_ Det is valid in high level by default and can be switched to low level by AT command. MeiG Smart Technology Co., Ltd 28/89 MeiG_SLM320_Hardware Design Manual The reference circuit is shown in the figure below, with SIM card hot swap function. VDD_EXT USIM_VDD 51K 15K Module USIM_GND USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA 22R 22R 100nF USIM CARD CONNECTOR VCC RST CLK GND VPP IO 22R 33PF 33PF 33PF GND Figure 12 Reference design drawing of the booth with hot-plug function If user does not need USIM card hot-plug detection, keep the USIM_DET pin open. The reference circuit is as follows:
Figure 13 Reference design drawing of the booth without hot-plugging function For USIM card interface, in order to ensure the good performance and reliability of USIM card, the following design principles are recommended in the circuit design:
For SIM0_DAT, SIM0_CLK and SIM0_RST lines, a 22 resistance used to suppress the spurious EMI, enhance ESD protection, and convenient debugging;
In order to improve the antistatic ability, TVS are added on USIM_VDD, USIM_DATA, USIM_CLK and USIM_RST lines, ESD protection devices with parasitic capacitance no more than 15Pf;
33pF capacitors in parallel on USIM_VDD, USIM_DATA, USIM_CLK and USIM_RST lines are used to filter out GSM900 interference. The peripheral devices of the USIM card shall be placed as close as possible to the USIM booth;
USIM booth is placed close to the module to ensure that the wiring length of USIM card signal line does not exceed 100mm;
In order to prevent USIM_CLK signals from crosstalk with USIM_DATA, the two wires should not be too close together and an additional shielding should be added between the two wires;
MeiG Smart Technology Co., Ltd 29/89 MeiG_SLM320_Hardware Design Manual 3.8 USB port The SLM320 provides a USB interface conforming to the USB 2.0 specification. This interface is used for AT command interaction, data transfer, software debugging and version upgrading, etc. 3.8.1 USB Pin Description The SLM320 module provides a USB2.0 interface. Table 9 USB interface Pin Name I/O Pin VBUS USB_DP USB_DM GND AI I/O I/O G 71 69 70 Description USB Insert the test USB Differential data +
USB Differential data -
8,9,19,22,36,46,48,50-54,56,85-112 GND 3.8.2 USB Reference Circuit The SLM320 module USB interface application reference circuit is shown in the figure below. Module Test Points MCU R3 R4 NM 0R NM 0R ESD Array R1 R2 R5 0R 0R 0R USB_DM USB_DP USB_VBUS GND USB_DM USB_DP USB_VBUS GND Figure 14 Refer to the design of the USB interface In order to meet the signal integrity requirement of USB data line, R1/R2/R3/R4 resistors must be placed close to the module and between resistors close to each other. The branch connecting the test point must be as short as possible. MeiG Smart Technology Co., Ltd 30/89 MeiG_SLM320_Hardware Design Manual In USB interface circuit design, to ensure USB performance, the following principles are recommended in circuit design:
The module USB_VBUS is not used to power the module, but to detect USB insertion and unplugging In order to reduce the USB high speed data transmission of signal interference, in USB_DM USB_DP interface circuit and concatenated R1 and R2 can improve the accuracy of data transmission, 0 R1 and R2 are recommended In order to improve the antistatic performance of USB interface, ESD protective devices are recommended to be added to USB_DP and USB_DM interface circuits, and ESD devices with junction capacitance less than 2pF are recommended. USB ESD protection device should be placed as close as possible to USB interface In order to ensure the USB work reliable, the design still need more consideration to the protection of USB, such as the Layout of the protection of the USB, need to do to USB_DP and USB_DM 90 impedance control, strictly in accordance with the requirements of the differential line, as far as possible away from the interference signal Do not use USB cable under crystal oscillator, oscillator, magnetic device and RF signal. It is recommended to use inner differential wiring and wrap the ground left, right, up and down. 3.9 Serial Port SLM320 module has three serial ports: main serial port UART1, DEBUG serial port UART and download, and RADIO frequency calibration serial port UART2. The main features of the main and debug serial ports are described below. The main serial port supports 4800Bps, 9600bps, 19200Bps, 38400Bps, 57600bps, 115200Bps, 230400bps baud rate. The default baud rate is 115200bps for data transmission and AT command transmission. Debugging serial port support 115200BPS baud rate, for r & D debugging use. Table 10 Main serial port pin description Pin Name UART1_RING UART2_TXD CTS RTS MAIN_TXD MAIN_RXD I/O DO DO I O O I Pin Description 62 63 64 65 67 68 Module output ring prompt Module sends data Module clear send The module requests to send Module sends data The module receives data MeiG Smart Technology Co., Ltd 31/89 MeiG_SLM320_Hardware Design Manual Table 11 Description of debugging serial port pin Pin Name I/O PIN Description DBG_RXD DBG_TXD I O 11 12 Module receiving data Module send data Table 12 Serial port logic level Parameter Min value Max value Units VIL VIH VOL VOH
-0.3 1.2 0 1.35 0.6 2.0 0.45 1.8 V V V V The serial port level of SLM320 module is 1.8V. If the client host is 3.3V, the level shifter needs to be added in the serial port application. TI's TXB0104PWR is recommended. The following picture is a reference design:
VDD_EXT VCCA VCCB 0.1uF 0.1uF VDD_MCU RI DCD CTS RTS DTR TXD RXD DSR OE A1 A2 A3 A4 A5 A6 A7 A8 GND Translator B1 B2 B3 B4 B5 B6 B7 B8 RI_MCU DCD_MCU CTS_MCU RTS_MCU DTR_MCU TXD_MCU RXD_MCU DSR_MCU Figure 15 Level conversion chip reference circuit MeiG Smart Technology Co., Ltd 32/89 MeiG_SLM320_Hardware Design Manual Another level converter circuit is shown in the figure below. The input and output circuit design of the following dotted line section can refer to the solid line section, but pay attention to the connection direction. At the same time, this level conversion circuit is not suitable for applications with baud rate over 460Kbps. Figure 16 UART signal connection Note: During design, it is recommended to reserve 0R resistance and parallel capacitor positions on the main serial port and debug serial port circuit, which can be added to the baseplate to prevent RF interference 3.10 Status indication The status indicator pin is mainly used to drive the network status indicator. SLM320 module has net_ MODENET_ Status and status (reserved, default NC) are three network status pins. The following two tables describe pin definitions and logic level changes in different network states. Table 13 Description of network indicator pin Pin Name I/O Pin Describe NET_MODE NET_STATUS STATUS O O O 5 6 61 Module status indication Module status indication Reserved MeiG Smart Technology Co., Ltd 33/89 MeiG_SLM320_Hardware Design Manual Table 14 Working status of network indicator pin PIN Name Pin working state Working status indicated NET_MODE High level Low level Register LTE network status other NET_STATUS Slow flash (200ms high / 1800ms low) Net searching status Slow flash (1800ms high / 200ms low) position in readiness Flash (125ms high / 125ms low) Data transmission mode High level On the phone The reference circuit is shown in the figure below:
Figure 17 Reference design of network indication Status is used to indicate the working status of the module, which is an open drain output pin. The customer can connect this pin to the GPIO or GPIO of the device band pull-up. MeiG Smart Technology Co., Ltd 34/89 MeiG_SLM320_Hardware Design Manual The LED indication circuit is shown in the figure below. When the module starts up normally, status defaults to high resistance state. Figure 18 status reference circuit 3.11 Low Power Mode 3.11.1 Flight mode Table 15 W_DISABLE pin descriptions Pin Name I/O W_DISABLE# DI Pin 4 Description Modular flight mode control SLM320 module supports two ways to enter flight mode:
Table 16 Description of flight mode Settings 1 2 Hardware I/O interface button control AT command control W_DISABLE# for high or hovering (default is pull-up) is normal mode, and low is flight mode AT+CFUN=4-- go into airplane mode AT+CFUN=1-- go into normal mode 3.11.2 Sleep mode The module can activate sleep mode in the following ways:
At + CSCLK = 0: close deep sleep function. At + CSCLK =1: when setting, DTR pin needs to be high level, or wakeup pin needs to be low level to enter deep sleep mode;
MeiG Smart Technology Co., Ltd 35/89 After that, when the DTR is set high or the wakeup pin is set low, and no interrupt is generated (such as GPIO interrupt or serial port data transmission), the GSM part will automatically enter the deepsleep mode. MeiG_SLM320_Hardware Design Manual At + CSCLK =2: when no interrupt is generated, the GSM part will automatically enter deepsleep mode. 3.11.3 Ultra low power mode Use the following AT instruction to put the module into ultra-low power mode (for power test). AT^TRACECTRL=0,0;
AT^TRACECTRL=1,0;
AT+CSCLK=2;
3.12 ADC Function SLM320 provides a Two-way 12-bit analog-digital conversion interface, and the ADC voltage range is 0-5V Table 17 ADC pin description Pin Name I/O Pin Description ADC0 ADC1 ADC2*
I I I 45 44 43 Analog to digital converter interface 0 Analog to digital converter interface 1 Analog to digital converter interface 2 Remark:
1. 2. 3. In the case that VBAT is not powered, the ADC interface cannot directly connect any input voltage. It is recommended that the ADC pin be input with voltage divider circuit. It is suggested that ADC should be wrapped when wiring, which can improve the accuracy of ADC voltage measurement. MeiG Smart Technology Co., Ltd 36/89 MeiG_SLM320_Hardware Design Manual 3.13 USB_BOOT Port SLM320 supports USB_BOOT. The client can shorten USB_BOOT and VDD_EXT before starting the module, and then the module will enter the forced download mode. In this mode, the module can be upgraded via USB interface. Table 18 USB_BOOT pin definition Pin Name USB_BOOT I/0 I Pin 115 VDD_EXT PO 7 Description Short connect USB_BOOT and VDD_EXT
(V_IO18) before starting the module, and then the module will enter the forced download mode MeiG Smart Technology Co., Ltd 37/89 MeiG_SLM320_Hardware Design Manual 4 GNSS Receiver 4.1 General Description SLM320 use the independent GPS chipincludes a fully integrated global navigation satellite system solution that supports GPS, GLONASS, BeiDou. It supports standard NMEA-0183 protocol. 4.2 GNSS Performance Cold start time<40S Hot start time<5S Tracking sensitivity-160dBm Acquisition sensitivity-147dBm Position accuracy<3m 4.3 Layout Guidelines The following layout guidelines should be taken into account in customers designs. Maximize the distance among GNSS antenna, main antenna. Digital circuits such as (U) SIM card, USB interface, and camera module and display connector should be kept away from the antennas. Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar isolation and protection. Keep 50 characteristic impedance for the ANT_GNSS trace. 4.4 Antenna connection Customers can use active antenna and passive antenna. If customers use active antenna, please refer to the figure below, if passive antenna is used, please refer to the figure (Figure 19 RF reference circuit) MeiG Smart Technology Co., Ltd 38/89 MeiG_SLM320_Hardware Design Manual 5 Antenna interface SLM320 module design interface, there are three antennas, the antenna impedance 50. Table 19 Definition of pin of antenna interface Pin Name Pin Number Description I/O Remark ANT_MAIN BT_ANT 49 35 main antenna port IO 50 impedance WIFI/BT antenna port IO 50 impedance ANT_GNSS 47 GPS antenna port IO 50 impedance 5.1 Introduction to Antenna Interface SLM320 provides three antenna pins: ANT_MAIN and ANT_WIFI/BT to improve the product's TDD-LTE/
FDD-LTE, WIFI/BT transceister performance. It is recommended to use with the module, RF connector match 50 impedance of the antenna. Note:
In order to ensure the communication capability of all frequency bands, please connect all antennas.It is recommended that applications carefully select RF wiring. RF wiring needs to be selected with minimal loss. RF wiring for RF loss requirements is recommended as follows:
GSM900 <0.6dB DCS1800 <1.0dB TDD-LTE<1.2dB FDD-LTE<1.2dB WIFI/BT<1.2dB GNSS<1.0dB 5.2 Radio frequency reference circuit The reference circuit for antenna connection of ANT_MAIN, ANT_WIFI/BT is shown in the figure below. In order to obtain better RF performance, the following four points should be paid attention to when designing schematic diagram and PCB layout:
1. Schematic design, near the module RF port reserved type matching circuit, capacitor default not attached;
2. Schematic design, redundant RF connectors between the RF port of the module and the antenna, used for certification test, RF connectors are not attached after mass production and delivery;
(Reference: RF Connector -1P-H176);
3. Schematic design, type matching circuit is reserved near the antenna end, capacitor is not affixed MeiG Smart Technology Co., Ltd 39/89 by default;
4. PCB layout, Module RF port to the antenna between lines as short as possible, and need to plate factory for RF line do 50 impedance control. MeiG_SLM320_Hardware Design Manual Figure 19 RF reference circuit 5.3 Installation of antenna 5.3.1 Antenna requirements The requirements of antenna receiving antenna are shown in the following table:
Table 20 Antenna requirements Type Requirement VSWR: < 2 Gain (dBi): 1 Maximum Inupt (W): 2W GSM/TDD-LTE/FDD-LTE Input impedance (ohm): 50 Polarization Type: vertical direction Cable insertion loss: < 1.5dB
(GSM900/1800 ; LTE B1/B2/B3/B4/B5/B8/B34/B39) Cable insertion loss: < 2dB
(LTE B7/B38/B40/B41) WIFI/BT VSWR: < 2 MeiG Smart Technology Co., Ltd 40/89 MeiG_SLM320_Hardware Design Manual Gain (dBi): 1 Maximum Inupt (W): 0.1W Input impedance (ohm): 50 Polarization Type: vertical direction Cable insertion loss: < 1.5dB VSWR: < 2 Gain (dBi): 1 Maximum input power (W): 0.1W Input impedance (ohm): 50 Polarization type: vertical Cable insertion loss:< 1.5dB GNSS 5.3.2 RF output power The RF output power of SLM320 is shown in the following table. Table 21 SLM320 RF transmission power Frequency Max Min EGSM900 DCS1800 33dBm2dB 5dBm5dB 30dBm2dB 0dBm5dB LTE-FDD B1 23dBm2.7dB
<-39dBm LTE-FDD B2 23dBm2.7dB
<-39dBm LTE-FDD B3 23dBm2.7dB
<-39dBm LTE-FDD B4 23dBm2.7dB
<-39dBm LTE-FDD B5 23dBm2.7dB
<-39dBm LTE-FDD B7 23dBm2.7dB
<-39dBm LTE-FDD B8 23dBm2.7dB
<-39dBm LTE-FDD B20 23dBm2.7dB
<-39dBm MeiG Smart Technology Co., Ltd 41/89 MeiG_SLM320_Hardware Design Manual LTE-TDD B28 23dBm2.7dB
<-39dBm LTE-TDD B34 23dBm2.7dB
<-39dBm LTE-TDD B38 23dBm2.7dB
<-39dBm LTE-TDD B39 23dBm2.7dB
<-39dBm LTE-TDD B40 23dBm2.7dB
<-39dBm LTE-TDD B41 23dBm2.7dB
<-39dBm 5.3.3 RF reception sensitivity Table 22 SLM320 module RF reception sensitivity Frequency Reception sensitivity (typical value BW) -10M Dominant set Diversity Dominant + Diversity 3GPP (Dominant + Diversity) EGSM900
-108dBm DCS1800
-108dBm LTE-FDD B1
-97dBm LTE-FDD B2
-97dBm LTE-FDD B3
-97dBm LTE-FDD B4
-97dBm LTE-FDD B5
-98dBm LTE-FDD B7
-97dBm LTE-FDD B8
-98dBm LTE-FDD B20
-98dBm LTE-FDD B28
-98dBm LTE-TDD B34
-97.5dBm LTE-TDD B38
-97.5dBm LTE-TDD B39
-97.5dBm LTE-TDD B40 -97.5dBm NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA
-102.4dBm
-102.4dBm
-96.3dBm
-94.3dBm
-93.3dBm
-96.3dBm
-94.3dBm
-94.3dBm
-93.3dBm
-93.3dBm
-94.8dBm
-96.3dBm
-96.3dBm
-96.3dBm
-96.3dBm MeiG Smart Technology Co., Ltd 42/89 LTE-TDD B41
-97.5dBm NA NA
-94.3dBm MeiG_SLM320_Hardware Design Manual Remark:
Other sub-model and frequency information will be reflected in subsequent versions of the document. 5.3.4 Working frequency Table 23 SLM320 operating frequency 3GPP Frequency band UL DL EGSM900 880~915 925~960 DCS1800 1710~1785 1805~1880 LTE-FDD B1 1920~1980 2110~2170 LTE-FDD B2 1850~1910 1930~1990 LTE-FDD B3 1710~1785 1805~1880 LTE-FDD B4 1710~1755 2110~2155 LTE-FDD B5 824~849 869~894 LTE-FDD B7 2500~2570 2620~2690 LTE-FDD B8 880~915 925~960 LTE-FDD B20 832~862 791~821 LTE-FDD B28 703~748 758~803 LTE-TDD B34 2010~2025 2010~2025 LTE-TDD B38 2570~2620 2570~2620 LTE-TDD B39 1880~1920 1880~1920 LTE-TDD B40 2300~2400 2300~2400 LTE-TDD B41 2555~2655 2555~2655 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MeiG Smart Technology Co., Ltd 43/89 MeiG_SLM320_Hardware Design Manual WIFI/BT 2400-2483 2400~2483 GPS BDS Glonass
1575.421 1559~1563 1597~1606 MHZ MHZ MHZ MHZ MeiG Smart Technology Co., Ltd 44/89 MeiG_SLM320_Hardware Design Manual 5.3.5 OTA Antenna requirements Table 24 Antenna index requirements Network Mode Band VSWR Gain Peak Avg. Effi. SAR TRP
(dBm) TIS
(dBm) 850/900 GSM 1800(DCS) 1900(PCS) Band34 Band38 TDD-LTE Band39 Band40 Band41 26 26 26 19 19 19 19 19
<-102
<-102
<-102
<-94
<-94
<-94
<-94
<-94 Band1
<2.5:1
>0dBi
>-4dBi >40%
<1.6W/Kg 19
<-94 Band2 Band3 Band4 FDD-LTE Band5 Band7 Band8 Band20 Band28 19 19 19 19 19 19 19 19
<-94
<-94
<-94
<-94
<-94
<-94
<-94
<-94 WIFI 2400
<2.5:1
>0dBi
>-4dBi >40%
<1.6W/Kg
<-80 BT 2400
<2.5:1
>0dBi
>-4dBi >40%
<1.6W/Kg 3
<-82 MeiG Smart Technology Co., Ltd 45/89 MeiG_SLM320_Hardware Design Manual 6 Electrical characteristics 6.1 Absolute Maximum Ratings Absolute maximum ratings refer to the maximum voltage range that the module supply voltage and digital and analog input/output interfaces can withstand. Work outside this range may cause damage to the product. Table 25 Absolut Maximum Ratings Parameters Description Min Typical value Max Units VBAT GPIO Power supply
-0.3 3.6 Digital I/O level supply voltage
-0.3 1.8 VBUS USB Insert the test
-0.3 5.0 5.5 2.0 9.2 V V V 6.2 Ambient Temperature Range The SLM320 module is recommended to operate at -30~+75. It is suggested that temperature control measures should be considered at the application end under adverse environmental conditions. At the same time, the extended operating temperature range of the module is provided. When used at the extended temperature, the function is normal, and some RF indicators may deteriorate. It is also recommended that the module application terminal be stored at a certain temperature. Modules outside this range may not work properly or may be damaged. 6.3 Electrical Characteristics of Interface Working State VLLogic low level VHLogic high level Table 26 The logic level of a normal digital IO signal VL Min
-0.3 Signal digital input digital output Max 0.6 0.45 VH Min 1.2 1.35 Max 2.0 Unit V V MeiG Smart Technology Co., Ltd 46/89 Table 27 Electrical characteristics of power supply operating state MeiG_SLM320_Hardware Design Manual Parameters I/O VBAT VBUS I I Min 3.4 4.5 Model Max Unit 3.8 5.0 4.5 9.2 USIM_VDD O 1.7/2.75 1.8/2.85 1.9/2.95 V V V 6.4 Module Power Consumption Range Table 28 Power consumption State of the module Power off Test Item Test Case Result (mA) Shutdown leakage current Real network Sleep Maintain normal voltage (3.8V) power supply in case of power failure 30uA Insert the mobile card, the actual network standby, use the AT command to query the registration on the network, and record the average current of 10 minutes Insert the unicom card, the actual network standby, use AT command to query and register the network, and record the 10-minute average current. Insert the telecom card, the actual network standby, use AT command to query and register the network, and record the average current of 10 minutes. 1.6 1.65 1.75 Dormant GSM850 Module is powered on With no data transfer, the USB is in a suspended state GSM850 CH190 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. GSM850 CH128 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state) 3) Under the condition of no data 1.6 1.6 MeiG Smart Technology Co., Ltd 47/89 MeiG_SLM320_Hardware Design Manual transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. GSM850 CH251 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state) 3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. GSM900 CH62 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state) 3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes GSM900 CH1 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. GSM900 CH124 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. 1.5 1.4 1.5 1.4 GSM900 MeiG Smart Technology Co., Ltd 48/89 MeiG_SLM320_Hardware Design Manual DCS CH698 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. DCS CH512 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. DCS CH885 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. PCS CH661 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. PCS CH512 1) The tested module was powered on, and the data network was successfully registered;
1.3 1.4 1.4 1.4 1.6 DCS PCS MeiG Smart Technology Co., Ltd 49/89 MeiG_SLM320_Hardware Design Manual 2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. PCS CH810 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band1 CH18300 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band1 CH18050 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band1 CH18550 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data 1.6 1.5 1.6 1.6 FDD The module is powered on, and the DRX monitoring period of the idle state on the network is 1.28s With no data transfer, the USB is in a suspended state MeiG Smart Technology Co., Ltd 50/89 MeiG_SLM320_Hardware Design Manual transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band2 CH18650 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band2 CH18900 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band2 CH19150 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band3 CH19575 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. 1.3 1.2 1.2 1.3 MeiG Smart Technology Co., Ltd 51/89 MeiG_SLM320_Hardware Design Manual Band3 CH19250 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band3 CH19900 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band4 CH20000 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band4 CH20175 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band4 CH20375 1) The tested module was powered on, and the data network was successfully registered;
1.2 1.2 1.3 1.3 1.3 MeiG Smart Technology Co., Ltd 52/89 MeiG_SLM320_Hardware Design Manual 2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band5 CH20525 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band5 CH20450 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band5 CH20600 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band8 CH21625 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data 1.4 1.5 1.4 1.5 MeiG Smart Technology Co., Ltd 53/89 MeiG_SLM320_Hardware Design Manual transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band8 CH21500 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band8 CH21750 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band40 CH39150 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band40 CH38700 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. 1.5 1.4 1.6 1.5 TDD The module is powered on, and the DRX monitoring period of the idle state on the network is 1.28s With no data transfer, the USB is in a suspended state MeiG Smart Technology Co., Ltd 54/89 MeiG_SLM320_Hardware Design Manual Band40 CH39600 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band41 CH40620 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band41 CH40290 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band41 CH41190 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band1 CH18300 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded 1.5 1.5 1.5 1.5 38.39 standby FDD The module is powered on, and the DRX monitoring MeiG Smart Technology Co., Ltd 55/89 period of the idle state on the network is 1.28s With no data transfer, USB is active MeiG_SLM320_Hardware Design Manual the average current for 10 minutes. Band1 CH18050 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band1 CH118550 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band2 CH18650 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band2 CH18900 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band2 CH19150 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band3 CH19575 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band3 CH19250 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band3 CH19900 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band4 CH20175 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. 37.86 38.56 37.39 37.86 38.86 38.57 36.99 37.41 39.5 MeiG Smart Technology Co., Ltd 56/89 MeiG_SLM320_Hardware Design Manual Band4 CH20375 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band5 CH20525 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band5 CH20600 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band5 CH20450 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band5 CH20525 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band8 CH21750 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band8 CH21625 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band8 CH21500 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band40 CH39150 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band40 CH39150 Under the condition of no data transmission, the tested module 38.59 37.46 38.83 37.32 37.46 39.3 37.59 37.88 38.58 38.94 TDD The module is powered on, and the DRX monitoring period of the idle state on the network is 1.28s MeiG Smart Technology Co., Ltd 57/89 With no data transfer, the USB is in a suspended state MeiG_SLM320_Hardware Design Manual maintained for 10 minutes and recorded the average current for 10 minutes. Band40 CH38700 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band40 CH39600 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band41 CH40620 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band41 CH40209 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band41 CH41190 Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. 39.77 37.89 35.3 37.49 38.26 Real network data sleep Unicom/Mobile Keep the data connection sending 256-byte packets back to the server every 5 minutes
Data transmission FDD 1) Room temperature;
2) Dc power supply is used to supply the module, and the voltage is set at 3.8V;
Band1 0dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band1 10dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band1 23dBm CH18300 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band1 23dBm CH18050 The tested module carries out data 183.52 227.24 525.95 590.36 MeiG Smart Technology Co., Ltd 58/89 MeiG_SLM320_Hardware Design Manual transmission and maintains for 5 minutes, and records the average current for 5 minutes Band1 23dBm CH18550 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band2 0dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band2 10dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band2 23dBm CH18065 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band2 23dBm CH18900 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band2 23dBm CH19150 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band3 0dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band3 10dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band3 23dBm CH19575 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes 624.43 194.1 258.21 680.21 675.64 674.55 194.1 258.21 650.21 MeiG Smart Technology Co., Ltd 59/89 MeiG_SLM320_Hardware Design Manual Band3 23dBm CH19250 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band3 23dBm CH19900 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band4 0dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band4 10dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band4 23dBm CH20000 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band4 23dBm CH20175 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band4 23dBm CH20350 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band5 0dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band5 10dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band5 23dBm CH20525 The tested module carries out data transmission and maintains for 5 minutes, 645.64 634.5 194.1 256.21 650.21 649.60 635.5 162.35 209.25 543.21 MeiG Smart Technology Co., Ltd 60/89 MeiG_SLM320_Hardware Design Manual and records the average current for 5 minutes Band5 23dBm CH20450 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band5 23dBm CH20600 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band7 0dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band7 10dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band7 23dBm CH20800 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band7 23dBm CH21100 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band7 23dBm CH21400 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band8 0dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band8 10dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes 558.57 581.79 174.21 210.1 690 700 710.5 174.21 214.3 MeiG Smart Technology Co., Ltd 61/89 MeiG_SLM320_Hardware Design Manual Band8 23dBm CH21625 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band8 23dBm CH21500 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band8 23dBm CH21750 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band20 0dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band20 10dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band20 23dBm CH24200 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band20 23dBm CH24300 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band20 23dBm CH24400 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band40 0dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band40 10dBm The tested module carries out data transmission and maintains for 5 minutes, 561.18 576.91 579.38 175.4 215.6 567.8 580.2 579.38 388.39 165.22 TDD MeiG Smart Technology Co., Ltd 62/89 MeiG_SLM320_Hardware Design Manual and records the average current for 5 minutes Band40 23dBm CH39150 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band40 23dBm CH38700 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band40 23dBm CH39600 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band41 0dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band41 10dBm The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band41 23dBm CH40620 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band41 23dBm CH40290 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes Band41 23dBm CH41190 The tested module carries out data transmission and maintains for 5 minutes, and records the average current for 5 minutes 310.14 311.99 319.10 158.2 187.4 388.3 354.48 378.43 Power off Dormant Shutdown leakage current Real network Sleep Maintain normal voltage (3.8V) power supply in case of power failure 30uA Insert the mobile card, the actual network standby, use the AT command to query the registration on the network, and record the average current of 10 minutes 1.6 MeiG Smart Technology Co., Ltd 63/89 MeiG_SLM320_Hardware Design Manual Insert the unicom card, the actual network standby, use AT command to query and register the network, and record the 10-minute average current. Insert the telecom card, the actual network standby, use AT command to query and register the network, and record the average current of 10 minutes. 1.65 1.75 GSM850 CH190 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. GSM850 CH128 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state) 3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. GSM850 CH251 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state) 3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. GSM900 CH62 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state) 3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded 1.6 1.6 1.5 1.4 GSM850 Module is powered on With no data transfer, the USB is in a suspended state GSM900 MeiG Smart Technology Co., Ltd 64/89 MeiG_SLM320_Hardware Design Manual the average current for 10 minutes GSM900 CH1 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. GSM900 CH124 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. DCS CH698 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. DCS CH512 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. DCS CH885 1) The tested module was powered on, 1.5 1.4 1.3 1.4 1.4 DCS MeiG Smart Technology Co., Ltd 65/89 MeiG_SLM320_Hardware Design Manual and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. PCS CH661 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. PCS CH512 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. PCS CH810 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band1 CH18300 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended 1.4 1.6 1.6 1.5 PCS FDD The module is powered on, and the DRX monitoring period of the idle state on MeiG Smart Technology Co., Ltd 66/89 the network is 1.28s With no data transfer, the USB is in a suspended state MeiG_SLM320_Hardware Design Manual state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band1 CH18050 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band1 CH18550 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band2 CH18650 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band2 CH18900 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded 1.6 1.6 1.3 1.2 MeiG Smart Technology Co., Ltd 67/89 MeiG_SLM320_Hardware Design Manual the average current for 10 minutes. Band2 CH19150 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band3 CH19575 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band3 CH19250 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band3 CH19900 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band4 CH20000 1) The tested module was powered on, 1.2 1.3 1.2 1.2 1.3 MeiG Smart Technology Co., Ltd 68/89 MeiG_SLM320_Hardware Design Manual and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band4 CH20175 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band4 CH20350 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band5 CH20450 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band5 CH20525 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended 1.2 1.2 1.4 1.4 MeiG Smart Technology Co., Ltd 69/89 MeiG_SLM320_Hardware Design Manual state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band5 CH20600 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band4 CH20175 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band4 CH20350 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band5 CH20450 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded 1.4 1.2 1.2 1.4 MeiG Smart Technology Co., Ltd 70/89 MeiG_SLM320_Hardware Design Manual the average current for 10 minutes. Band4 CH20175 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band4 CH20350 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band5 CH20450 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band4 CH20175 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band4 CH20350 1) The tested module was powered on, 1.2 1.2 1.4 1.2 1.2 MeiG Smart Technology Co., Ltd 71/89 MeiG_SLM320_Hardware Design Manual and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band5 CH20450 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band7 CH20800 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band7 CH21100 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band7 CH21400 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended 1.4 1.2 1.3 1.4 MeiG Smart Technology Co., Ltd 72/89 MeiG_SLM320_Hardware Design Manual state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band8 CH21500 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band8 CH21625 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band8 CH21750 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band20 CH24200 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded 1.3 1.2 1.4 1.4 MeiG Smart Technology Co., Ltd 73/89 MeiG_SLM320_Hardware Design Manual the average current for 10 minutes. Band20 CH24300 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band20 CH24400 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band28 CH27260 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band28 CH27435 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band28 CH27610 1) The tested module was powered on, 1.3 1.4 1.3 1.4 1.4 MeiG Smart Technology Co., Ltd 74/89 MeiG_SLM320_Hardware Design Manual and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band38 CH37800 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band38 CH38000 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band38 CH38200 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band39 CH38300 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended 1.2 1.3 1.3 1.2 Data transmission TDD 1) Room temperature;
2) Dc power supply is used to supply the module, and the voltage is set at 3.8V;
MeiG Smart Technology Co., Ltd 75/89 MeiG_SLM320_Hardware Design Manual state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band39 CH38450 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band39 CH38600 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band40 CH38700 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band40 CH39150 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded 1.3 1.3 1.2 1.3 MeiG Smart Technology Co., Ltd 76/89 MeiG_SLM320_Hardware Design Manual the average current for 10 minutes. Band40 CH39600 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band41 CH39990 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band41 CH40640 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. Band41 CH41190 1) The tested module was powered on, and the data network was successfully registered;
2) Set the module to sleep state through AT instruction (USB is in suspended state);
3) Under the condition of no data transmission, the tested module maintained for 10 minutes and recorded the average current for 10 minutes. 1.3 1.3 1.3 1.3 MeiG Smart Technology Co., Ltd 77/89 6.5 Environmental reliability requirements Table 29 Environmental reliability requirements Test Item Test Condition MeiG_SLM320_Hardware Design Manual LTST HTST ermal shock-TST High temperature and humidity test Low temperature running test High temperature running test Connection life test ESD test The temperature is -40, and the shutdown lasts for 24 hours The temperature is +85, and the shutdown lasts for 24 hours In the shutdown state, the temperature was -40 and +85 for 1h respectively. Temperature conversion time <3min, a total of 24 cycles Temperature +85, humidity 95%RH, shutdown state for 48 hours The temperature is -40, and the working condition lasts for 24 hours The temperature is +85, and the working condition lasts for 24 hours Board to board connector interface plugs and unplugs for 50 times; RF antenna interface cable plug and unplug 30 times 1. The module tests the power PAD and large area under the call state. ESD meets the following requirements:
Contact discharge shall pass 4KV, 5KV test grades
The air discharge shall pass 8KV, 10KV test grades 2Under the shutdown state, THE EVB SIM card holder is tested. ESD meets the following requirements:
Contact discharge shall pass 4KV test grade
Air discharge shall pass 8KV test grade 3Other interfaces of the module, ESD meets:
Contact discharge shall pass 0.5kV test grade
Air discharge shall pass 1KV test grade 6.6 ESD character Although SLM320 module design has been considered the ESD problem, and added the ESD protection, but consider SLM320 module during transportation and secondary development, it may also come across ESD problem. So, developers need to take into account of the final product ESD problem, besides the antistatic packaging processing, please refer to the reference design/recommended circuit of each hardware interface in this document. Refer to the following table for the discharge range allowed by ESD for SLM320 module. Table 30 ESD performance parameters (temperature: 25, humidity: 45%) Test point Contact discharge Units Test point MeiG Smart Technology Co., Ltd 78/89 GND Antenna interface 4 4 KV KV GND Antenna interface MeiG_SLM320_Hardware Design Manual MeiG Smart Technology Co., Ltd 79/89 MeiG_SLM320_Hardware Design Manual 7 Mechanical characteristics This section describes the mechanical dimensions of the module, all in millimeters; All dimensions not marked with tolerance, tolerance is 0.05mm. 7.1 Module Mechanical Dimensions Figure 20 Module top and side dimensions (unit: mm) a. Bottom view size MeiG Smart Technology Co., Ltd 80/89 MeiG_SLM320_Hardware Design Manual b. Bottom view size Figure 21 bottom view dimension (unit: mm) 7.2 Recommended Footprint Figure 22 Recommended package (top view) (unit: mm) MeiG Smart Technology Co., Ltd 81/89 7.3 Top View of Module MeiG_SLM320_Hardware Design Manual Figure 23 Top view of the module 7.4 Bottom View of Module Figure 24 Bottom view of the module MeiG Smart Technology Co., Ltd 82/89 MeiG_SLM320_Hardware Design Manual 8 Storage and production 8.1 Storage SLM320 is shipped in vacuum sealed bags. The storage of modules shall be subject to the following conditions:
1. When the ambient temperature is lower than 40C and the air humidity is less than 90%, the module can be stored in a vacuum sealed bag for 12 months;
2. After the vacuum seal bag is opened, the module can directly carry out reflow welding or other high-temperature processes if the following conditions are met:
The module stores air humidity less than 10%;
The environment temperature of module is lower than 30 , the air humidity is less than 60%, and the factory finishes the SMT within 72 hours. 3. If the module is under the following conditions, it needs to be baked before SMT;
When the ambient temperature is 23 (5 fluctuation is allowed), humidity level greater than 10%;
When the vacuum seal bag is opened, the ambient temperature of the module is lower than 30C and the air humidity is less than 60%. However, the factory fails to complete the SMT within 168 hours;
When the vacuum seal bag is opened, the module stores air humidity greater than 10%. If the module needs to be baked, bake at 125 (fluctuation of 5 above and below) for 8 hours. 4. Note:
The module packaging cannot withstand such high temperature, please remove the module packaging before the module baking. 8.2 Reflow Profile Figure 25 Reflow temperature curve MeiG Smart Technology Co., Ltd 83/89 MeiG_SLM320_Hardware Design Manual 8.3 Packaging SLM320 adopts tray packaging, shown as below:
Figure 26 SLM320 in tray packaging MeiG Smart Technology Co., Ltd 84/89 MeiG_SLM320_Hardware Design Manual 9 Appendix A refers to documentation and term abbreviations 9.1 Reference File SLM320 Module specifications;
SLM320 AT Commands;
SLM320 EVB user's manual SLM320 Reference design circuit;
SLM320 Apply the business process manual. 9.2 Symbol Key Table 31 Term abbreviations Abbreviation English description AMR BER BTS PCI CS CSD DCE DTE DTR EDGE EFR EGSM EMC Adaptive Multi-rate Bit Error Rate Base Transceiver Station Peripheral Component Interconnect Circuit Switched (CS) domain Circuit Switched Data Data communication equipment Data terminal equipment Data Terminal Ready Enhanced Data rates for GSM Evolution Enhanced Full Rate Enhanced GSM Electromagnetic Compatibility MeiG Smart Technology Co., Ltd 85/89 MeiG_SLM320_Hardware Design Manual ESD FR GMSK GPIO GPRS GSM HR HSDPA HSUPA HSPA HSPA+
IEC IMEI MEID I/O ISO ITU bps LED M2M MO MT NTC PC PCB Electrostatic Discharge Frame Relay Gaussian Minimum Shift Keying General Purpose Input Output General Packet Radio Service Global Standard for Mobile Communications Half Rate High Speed Downlink Packet Access High Speed Uplink Packet Access HSPA High-Speed Packet Access HSPA High-Speed Packet Access+
International Electro-technical Commission International Mobile Equipment Identity Mobile Equipment Identifier Input/Output International Standards Organization International Telecommunications Union bits per second Light Emitting Diode Machine to machine Mobile Originated Mobile Terminated Negative Temperature Coefficient Personal Computer Printed Circuit Board MeiG Smart Technology Co., Ltd 86/89 MeiG_SLM320_Hardware Design Manual PCS PCM PCS PDU PPP PS QPSK SIM Personal Cellular System Pulse Code Modulation Personal Communication System Packet Data Unit Point-to-point protocol Packet Switched Quadrate Phase Shift Keying Subscriber Identity Module TCP/IP Transmission Control Protocol/ Internet Protocol UART USIM UMTS USB Universal asynchronous receiver-transmitter Universal Subscriber Identity Module Universal Mobile Telecommunications System Universal Serial Bus WCDMA Wideband Code Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access TDD-LTE Time Division Long Term Evolution FDD-LTE Frequency Division Duplexing Long Term Evolution Vmax Vnorm Vmin VIHmax VIHmin VILmax VILmin Maximum Voltage Value Normal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value VOHmax Maximum Output High Level Voltage Value MeiG Smart Technology Co., Ltd 87/89 MeiG_SLM320_Hardware Design Manual VOHmin VOLmax VOLmin Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value MeiG Smart Technology Co., Ltd 88/89 MeiG_SLM320_Hardware Design Manual 10 Appendix B GPRS Coding Scheme Table 32 Description of different encoding schemes Way Code rate USF Pre-coded USF CS-1 1/2 3 3 Radio Block excl.USF and BCS 181 BCS Tail Coded Bits Punctured Bits Data rate Kb/s FCC Caution. 40 4 456 0 9.05 CS-2 2/3 3 6 268 16 4 588 132 13.4 CS-3 3/4 3 6 312 16 4 676 220 15.6 CS-4 1 3 12 428 16
456
21.4 15.19 Labelling requirements. This device complies with part 15 of the FCC Rules. Operation is subject to the condition that this device does not cause harmful interference. 15.21 Information to user. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. 15.105 Information to the user. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. Body-worn Operation This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated withmini mum distance 20cm between the radiator &
your body. MeiG Smart Technology Co., Ltd 89/89 C.Appendix A A1.Requirement of FCC KDB 996369 D03 for module certification:
1.1List of applicable FCC rules:
The module complies with FCC Part 2,22,24,27 1.2Summarize the specific operational use conditions:
SLM320 use the independent GPS chipincludes a fully integrated global navigation satellite system solution that supports GPS, GLONASS, BeiDou. It supports standard NMEA-0183 protocol. 1.3Limited module procedures:
The module does not have a standard antenna, which belong to Limited module Standard requires:
Clear and specific instructions describing the conditions, limitations and procedures for thirdparties to use and/or integrate the module into a host device (see Comprehensive integration instructions below). Resolve: Supply example as follows:
Installation Notes:
1) SLM320-L Module Power supply range is DC 3.5V~4.2V, when you use SLM320-L Module design product, the power supply cannot exceed this range. 2) When connect SLM320-L Module to the host device, the host device must be power off. 3) Make sure the module pins correctly installed. 4) Make sure that the module does not allow users to replace or demolition. 5)All types of antennas that can be used with a transmitterMax antenna gain not exceeding 3.5dBi in GSM850/1900 Max antenna gain not exceeding 5.1dBi in LTE band7 Max antenna gain not exceeding 3.9dBi in LTE band4 1.4Trace antenna designs: Not applicable. 1.5RF exposure considerations:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated withmini mum distance 20cm between the radiator & your body. 1.6Antennas:
The module does not have a standard antenna. 1.7Label and compliance information This device complies with part 15 of the FCC Rules. Operation is subject to the condition that this device does not cause harmful interference.Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. Body-worn Operation This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated withmini mum distance 20cm between the radiator & your body The host product Labeling Requirements:
NOTICE: The host product must make sure that FCC labeling requirements are met. This includes clearly visible exterior label on the outside of the final product housing that displays the contents shown in below:
Contains FCC ID:2APJ4-SLM320-L 1.8Information on test modes and additional testing requirements:
When setting up the configuration, if the pairing and call box options for testing do not work, the tester needs to coordinate with the module manufacturer to access the test mode software. 1.9Additional testing, Part 15 Subpart B disclaimer:
The modular transmitter is only FCC authorized for the specific rule parts (FCC Part 2,22,24,27 ) list on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. 1.10Information on test modes and additional testing requirements:
When testing, testers need to refer to the user manual, and the sample power supply needs to use a special adapter power supply.
1 2 | label | ID Label/Location Info | 476.02 KiB | October 20 2021 |
in sim320 OUI"
SLM320-L FDD-LTE/TDD-LTE/GSM IMEI: 862211041729401 SN: M320L16AHB07 1800074 FCCID:2APJ4-SLM320-L MeiG Smart Technology Co., LTD Made in China
1 2 | agent authorization | Cover Letter(s) | 111.89 KiB | October 20 2021 |
MeiG Smart Technology Co., Ltd
(24.9.2021) Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: LETTER OF AGENT AUTHORIZATION To Whom It May Concern:
We, the undersigned, hereby authorize (Chongqing Academy of Information and Communication Technology) to act on our behalf in all matters relating to application for equipment authorization, including the signing of all documents relating to these matters. We also hereby certify that no party to the application authorized hereunder is subject to the denial of benefits, including FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C.853(a). This agreement expires one year from the current date. Sincerely, By:____louxinwei___________ Signed Printed _____________________ Title: ________manager _______ Telephone:____021-54278676 ____ Applicant (Company Name): MeiG Smart Technology Co., Ltd
1 2 | long term confidentiality | Cover Letter(s) | 71.82 KiB | October 20 2021 |
MeiG Smart Technology Co., Ltd
(2021-9-24) Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: CONFIDENTIALITY REQUEST FOR (LTE Module / Model: SLM320-L / FCC ID: 2APJ4-SLM320-L) To Whom It May Concern:
This letter serves as an official request for confidentiality under sections 0.457 and 0.459 of CFR 47. We have requested that the
- Block Diagram
- Schematics
- Operational Description
- Tune up Procedure
- Part List required to be submitted with this application be permanently withheld from public review. The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. Please contact me if there is any information you may need. Sincerely, Clients signature Clients name / title: louxinwei/ manager Applicant Business Name:MeiG Smart Technology Co., Ltd Contact information / address : 3/F,No.88,QinJiang Road,Xuhui District,Shanghai,China
1 2 | modular approval letter | Cover Letter(s) | 158.74 KiB | October 20 2021 |
THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Request for Modular/Limited Modular Approval Date: 6.10.2020 Subject: Manufacturers Declaration for Modular Approval
- Limited Modular Approval
- Split Modular Approval
- - Limited Split Modular Approval Confidentiality Request for:
2APJ4-SLM320-L 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement Requirement Met 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i)
- YES - NO(*) Details: <example The module contains a metal shield which covers all RF components and circuitry. The shield is located on the top of the board next to antenna connector>
2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii)
- YES - NO(*) Details: <example Data to the modulation circuit is buffered as described in the operational description provided with the application>
3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii)
- YES - NO(*) Details: <example The module contains its own power supply regulation. Please refer to schematic filed with this application>
4. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv)
- YES - NO(*) Details: <example The module connects to its antenna using an UFL connector which is considered a non-standard connector. A list of antennas tested and approved with this device may be found in users manual provided with the application>
5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v)
- YES - NO(*) Details: <example The module was tested stand-alone as shown in test setup photographs filed with this application>
THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Modular Approval Requirement 6. The modular transmitter must be labeled with its own FCC ID number, or use an electron display (see Requirement Met KDB Publication 784748). If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: XYZMODEL1 or Contains FCC ID:
XYZMODEL1. Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi)
- YES - NO(*) Details: <example There is a label on the module as shown in the labeling exhibit filed with this application. Host specific labeling instructions are shown in the installation manual .filed with this application.>
7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii)
- YES - NO(*) Details: <example The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application.>
8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties toensure compliance. 15.212(a)(1)(viii) YES - NO(*) Details: <example The module meets Portable exclusion levels as shown in the RF exposure information filed with this application.>
THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD Limited Module Description When Applicable
* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval (LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA;
the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: <example - N/A>
Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Requirement Met
- Provided in Separate Cover Letter
- N/A Details: <example The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. >
2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.
- Provided in Separate Cover Letter
- N/A Details: <example N/A>
Split Modular Requirements Requirement Provided in Manual 1. For split modular transmitters, specific descriptions for secure communications between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained.
- Provided in Separate Cover Letter
- N/A Details: <example N/A >
THIS MUST BE SIGNED BY THE APPLICANT/AGENT AND SHOULD BE PLACED ON APPROPRIATE LETTERHEAD OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?
- YES
- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 D03, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to point 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets thenecessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D03, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types
(monopole, PIFA, dipole, etc note that omni-directional is not considered atype) 7. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product
- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.
- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. 8. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. Provide information on how to configure test modes for evaluation b. a. 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10 Sincerely, By:
manager
(Signature/Title1) louxinwei
(Print name) 1 - Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead.
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2021-10-20 | JAB - Part 15 Class B Digital Device | Original Equipment | |
2 | 2500 ~ 2570 | PCB - PCS Licensed Transmitter |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 2 | Effective |
2021-10-20
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1 2 | Applicant's complete, legal business name |
MeiG Smart Technology Co., Ltd
|
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1 2 | FCC Registration Number (FRN) |
0027430412
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1 2 | Physical Address |
3/F,No.88,Qinjiang Road, Xuhui District,Shanghai,China.
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1 2 |
3/F,No.88,Qinjiang Road
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1 2 |
Shanghai, N/A
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1 2 |
China
|
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app s | TCB Information | |||||
1 2 | TCB Application Email Address |
m******@metlabs.com
|
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1 2 | TCB Scope |
A1: Low Power Transmitters below 1 GHz (except Spread Spectrum), Unintentional Radiators, EAS (Part 11) & Consumer ISM devices
|
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1 2 |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
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app s | FCC ID | |||||
1 2 | Grantee Code |
2APJ4
|
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1 2 | Equipment Product Code |
SLM320-L
|
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app s | Person at the applicant's address to receive grant or for contact | |||||
1 2 | Name |
X******** L********
|
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1 2 | Title |
HW test Leader
|
||||
1 2 | Telephone Number |
021-5********
|
||||
1 2 | Fax Number |
021-5********
|
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1 2 |
l******@meigsmart.com
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app s | Technical Contact | |||||
1 2 | Firm Name |
MeiG Smart Technology Co., Ltd
|
||||
1 2 | Name |
l******** x******
|
||||
1 2 | Physical Address |
3/F,No.88,QinJiang Road,Xuhui District
|
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1 2 |
Shanghai
|
|||||
1 2 |
Shenzhen
|
|||||
1 2 |
China
|
|||||
1 2 | Telephone Number |
021-5********
|
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1 2 |
l******@meigsmart.com
|
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app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 2 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 2 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 2 | Equipment Class | JAB - Part 15 Class B Digital Device | ||||
1 2 | PCB - PCS Licensed Transmitter | |||||
1 2 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | LTE Module | ||||
1 2 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 2 | Modular Equipment Type | Limited Single Modular Approval | ||||
1 2 | Purpose / Application is for | Original Equipment | ||||
1 2 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
1 2 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 2 | Grant Comments | Power listed is ERP/EIRP. Values listed for LTE operations are for the highest power and the widest bandwidth for each band and modulation. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter, except the collocation as described in this filing or in accordance with FCC multi-transmitter product guidelines. Approval is limited to OEM installations only. OEM integrators and end users must be provided with transmitter operation conditions for satisfying RF exposure compliance. This grant is valid only when the device is sold to OEM integrators and the OEM integrators are instructed to ensure that the end user has no manual instructions to remove or install the device. Only those antenna(s) tested with the device or similar antenna(s) with equal or lesser gain may be used with this transmitter. The maximum antenna gain is 3.5dBi in 824-849 MHz, 3.9dBi in 1710-1780 MHz, 3.5dBi in 1850-1910 MHz, 5.1dBi in 2500-2570MHz. | ||||
1 2 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 2 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 2 | Firm Name |
Chongqing Academy of Information and Communcations
|
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1 2 | Name |
L**** Q******
|
||||
1 2 | Telephone Number |
023-8********
|
||||
1 2 |
l******@caict.ac.cn
|
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Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15B | |||||||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
2 | 1 | 22H | 824.2 | 848.8 | 3.39 | 0.005 ppm | 230KGXW | ||||||||||||||||||||||||||||||||||
2 | 2 | 22H | 829 | 844 | 0.54 | 0.011 ppm | 8M91G7D | ||||||||||||||||||||||||||||||||||
2 | 3 | 22H | 829 | 844 | 0.47 | 0.011 ppm | 4M93W7D | ||||||||||||||||||||||||||||||||||
2 | 4 | 24E | 1850.2 | 1909.8 | 0.71 | 0.007 ppm | 230KGXW | ||||||||||||||||||||||||||||||||||
2 | 5 | 24E | 1850 | 1910 | 0.28 | 0.003 ppm | 18M0G7D | ||||||||||||||||||||||||||||||||||
2 | 6 | 24E | 1850 | 1910 | 0.23 | 0.003 ppm | 7M05W7D | ||||||||||||||||||||||||||||||||||
2 | 7 | 27 | 1720 | 1745 | 0.31 | 0.004 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
2 | 8 | 27 | 1720 | 1745 | 0.28 | 0.004 ppm | 8M46W7D | ||||||||||||||||||||||||||||||||||
2 | 9 | 27 | 2500 | 2570 | 0.74 | 0.002 ppm | 18M0G7D | ||||||||||||||||||||||||||||||||||
2 | 1 | 27 | 2500 | 2570 | 0.76 | 0.002 ppm | 7M69W7D |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC