MeiG Smart product technical information SLM500 Hardware Design Guide Released Date: 2020/07 File name: SLM500 Hardware Design Guide Version Number: V1.00 Company: MeiG Smart Technology Co., Ltd SLM500 Hardware Design Guide Page 1 MeiG Smart product technical information IMPORTANT NOTICE COPYRIGHT NOTICE Copyright MeiG Smart Technology Co., Ltd. All rights reserved. All contents of this manual are exclusively owned by MeiG Smart Technology Co., Ltd(MeiG Smart for short), which is under the protection of Chineselawsandcopyrightlaws in international conventions. Anyone shall not copy, spread, distribute, modify or use in other ways with its contents without the written authorization of MeiG Smart. Those whoviolatedwillbe investigated by corresponding legal liability in accordance with the law. NO GUARANTEE MeiG Smart makes no representation or warranty, either express or implied, for any content in this document, and will not be liable for any specific merchantability and applicable or any indirect,particular and collateral damage. CONFIDENTIALITY information contained here (including any attachments) is confidential. The recipient All acknowledges the confidentiality of this document, and except for the specific purpose, this document shall not be disclosed to any third party. DISCLAIMER MeiG Smart will not take any responsibility for any property and health damage caused by the abnormal operation of customers. Please develop the product according to the technical specification and designing reference guide which defined in the product manual. MeiG Smart have the right to modify the document according to technical requirement with no announcement to the customer. SLM500 Hardware Design Guide Page 2 MeiG Smart product technical information SLM500 Hardware Design Guide_V1.00 SLM500 Hardware Design Guide Page 3 MeiG Smart product technical information Foreword Thank you for using the SLM500 module from Meg Smart. This product can provide data communication services. Please read the user manual carefully before use, you will appreciate its perfect function and simple operation method. The company does not assume responsibility for property damage or personal injury caused by improper operation of the user. Users are requested to develop the corresponding products according to the technical specifications and reference designs in the manual. Also pay attention to the general safety issues that mobile products should focus on. Before the announcement, the company has the right to modify the contents of this manual according to the needs of technological development. SLM500 Hardware Design Guide Page 4 MeiG Smart product technical information Contents 1. Introduction .......................................................................................................................................................... 8 2. Module overview .................................................................................................................................................. 8 2.1 Summary of features ...................................................................................................................................... 9 2.2 Block diagram .............................................................................................................................................. 11 3. Module Package ..................................................................................................................................................... 12 3.1.Pin distribution diagram ............................................................................................................................. 12 3.2. Pin definitions .............................................................................................................................................. 13 3.3. Mechanical Dimensions .............................................................................................................................. 27 4. Interface application .............................................................................................................................................. 29 4.1. Power Supply.............................................................................................................................................. 29 4.1.1. Power Pin ................................................................................................................................................. 31 4.2. Power on and off ......................................................................................................................................... 31 4.2.1. Module Boot ............................................................................................................................................. 31 4.2.2. Module Shutdown .................................................................................................................................... 33 4.2.2.1 PWRKEY Shutdown ............................................................................................................................. 33 4.2.3.Module Reset ............................................................................................................................................. 33 4.3. VCOIN Power ............................................................................................................................................. 34 4.4. Power Output .............................................................................................................................................. 35 4.5. Serial Port .................................................................................................................................................... 35 4.6. MIPI Interface ............................................................................................................................................. 37 4.6.1. LCD Interface .......................................................................................................................................... 38 4.6.2.MIPI Camera Interface ........................................................................................................................... 40 4.7.CapacitiveTouch Interface .......................................................................................................................... 43 4.8.Audio Interface ............................................................................................................................................ 44 4.8.1Receiver Interface Circuit ......................................................................................................................... 44 4.8.2 Microphone receiving Circuit ................................................................................................................. 45 4.8.3.Headphone Interface Circuit ................................................................................................................... 45 4.8.4.Speaker Interface Circuit ......................................................................................................................... 46 4.8.5.I2S Interface .............................................................................................................................................. 46 4.9. USB Interface .............................................................................................................................................. 46 4.9.1. USB OTG .................................................................................................................................................. 47 4.10. Charging Interface .................................................................................................................................... 48 4.10.1. Charging Detection ................................................................................................................................ 49 4.10.2. Charge Control ...................................................................................................................................... 49 4.10.3. BAT_CON_TEM ................................................................................................................................... 49 4.11 UIM Card Interface ................................................................................................................................... 49 4.12. SD Card Interface ..................................................................................................................................... 50 4.13 I2C Bus Interface ....................................................................................................................................... 51 4.14 Analog to Digital Converter (ADC) .......................................................................................................... 51 4.15. PWM .......................................................................................................................................................... 51 4.16. Motor ......................................................................................................................................................... 52 4.17 Antenna Interface ...................................................................................................................................... 52 4.17.1 Main Antenna .......................................................................................................................................... 52 4.17.2 DRX Antenna .......................................................................................................................................... 53 4.18.3 GPS Antenna ........................................................................................................................................... 54 4.18.4 WiFi/BT antenna ..................................................................................................................................... 55 5.PCB Layout ............................................................................................................................................................. 56 5.1. Module PIN distribution ............................................................................................................................ 56 5.2. PCB Layout Principles ............................................................................................................................... 56 5.2.1. Antenna ..................................................................................................................................................... 56 5.2.2 Power Supply............................................................................................................................................. 57 5.2.3. SIM Card .................................................................................................................................................. 57 5.2.4. MIPI .......................................................................................................................................................... 58 5.2.5. USB ............................................................................................................................................................ 58 5.2.6.Audio .......................................................................................................................................................... 58 5.2.7. Other ......................................................................................................................................................... 59 6. Electrical, Reliability ............................................................................................................................................. 61 6.1 Absolute Maximum ...................................................................................................................................... 61 6.2 Working Temperature................................................................................................................................. 61 SLM500 Hardware Design Guide Page 5 MeiG Smart product technical information 6.3 Working Voltage .......................................................................................................................................... 61 6.4 Digital Interface Features............................................................................................................................ 61 6.5 SIM_VDD Characteristics .......................................................................................................................... 62 6.6 PWRKEY Feature ....................................................................................................................................... 62 6.7 VCOIN Feature ............................................................................................................................................ 62 6.8 Current Consumption (VBAT = 3.8V) ....................................................................................................... 62 6.9 Electrostatic Protection ............................................................................................................................... 63 6.10 Module Operating Frequency Band ......................................................................................................... 63 6.11 RF Characteristics ..................................................................................................................................... 64 6.12 Module Conduction Receiving Sensitivity ............................................................................................... 64 6.13 WIFI Main RF Performance .................................................................................................................... 66 6.14 BT Main RF Prformance .......................................................................................................................... 67 6.15 GNSS Main RF Performance ................................................................................................................... 67 7. Production .............................................................................................................................................................. 68 7.1. Top And Bottom Views Of The Module ................................................................................................... 68 7.2. Recommended Soldering Furnace Temperature Curve ......................................................................... 69
............................................................................................................................................................................. 69 7.3. Humidity Sensitivity (MSL) ....................................................................................................................... 69 7.4. Baking Requirements ................................................................................................................................. 70 8. Support Peripheral Device List ............................................................................................................................ 71 9. Appendix ................................................................................................................................................................ 72 9.1. Related Documents ..................................................................................................................................... 72 9.2. Terms And Explanations ............................................................................................................................ 72 9.3. Multiplexing function ................................................................................................................................. 77 9.4. Safety Warning ........................................................................................................................................... 77 SLM500 Hardware Design Guide Page 6 MeiG Smart product technical information Version History Date 2020-07-02 Version 1.00 Change description First edition Author MeiG Hardware SLM500 Hardware Design Guide Page 7 MeiG Smart product technical information 1. Introduction This document describes the hardware application interface of the module, including the connection of the circuit and the RF interface. It can help users quickly understand the interface definition, electrical performance, and structural dimensions of the module. Combining this document with other application documents, users can quickly use modules to design mobile communication applications. 2. Module overview SLM500 module uses the Qualcomm solution based on arm cotex-A53 four core processor, with the highest main frequency of 4 * 1.3GHz, and the memory supports single channel 32-bit LPDDR3/672MHz.This module is suitable for broadband intelligent wireless communication modules of TD-LTE/FDD-LTE/WCDMA/EVDO/TD-SCDMA/CDMA/GSM network standards. The physical interface of the module is a 272-pin pad that provides the following hardware interfaces:
Three 1.8V UART serial ports, supporting four or two wires. Main LCDMIPI interface. Two groups of Camera interfaceMIPI data. USB2.0 interface. Three groups of Audio input interface. Three groups of Audio output interface. Dual-Sim card interface. GPIO interface. Five groups of I2C interfaces. One sets of SPI interfaces. TF card interface. Support GNSSWiFiBluetooth 4.2 SLM500 Hardware Design Guide Page 8 MeiG Smart product technical information System memory 8GB eMMC + 1GB LPDDR3 compatible with 16GB+2GB 2.1 Summary of features Table 2.1SLM500 features Product characteristics Description Quad-core A53 (64bit) 1.3GHz Adreno 308 @485MHz Android 10 40.5x40.5x2.8mmLCC 146pin+LGA 128pin FDD-LTE: B2/4/5/7/12/13/17/25/26/66 WCDMA: B2/4/5 GSM: B2/5 IEEE 802.11b/g/n 2.4G 802.11a/n 5G BT 4.2 No support GPS/ Beidou/ Glonass Cat4 TD-LTE 117/30Mbps Cat4 FDD-LTE 150/50Mbps 42/11.2Mbps 2.8/2.3Mbps 3.1/1.8Mbps Class12, 236.8kbps/236.8kbps Class12, 85.6kbps/85.6kbps DSDS(Dual Sim & Dual Stanby) 3.0/1.8V Support SIM hot plug L/W/G+G with CSFB to W/G L/TDS/G+G with CSFB to TDS/G L/EVDO/CDMA1X+ G L/W/TDS/G+CDMA1X Dont support dual CDMA SIM card Matrix:
HD+1440*720 60fps CPU GPU OS Size RF band--
SLM500A Wi-Fi Bluetooth FM GNSS Data Acces s TD-LTE FDD-LTE DC-HSPA+
TD-HSPA EVDO Rev.A EDGE GPRS SIM Display Camera
(Front and Rear) LCD Size: User defined Interface: One MIPI DSI 4-lane;
Interface: main: MIPI CSI 4-lanes; front: MIPI CSI 4-lanes Camera Pixel: Max. Rear 5Mp/Front up to 13Mp Video 1080p 30 fps: H.264/VP8/HEVC (H.265) 720p 30fps in SW decode Video encode 1080p 30 fps: H.264 SLM500 Hardware Design Guide Page 9 MeiG Smart product technical information Input Device Reset KeyPower on/off, Reset , Home, Volume+, Volume-
Capacitive TP Support HW reset Interface Main function description name VBAT 4pinPower input3.4V4.2VNominal value3.8V Support OTG downloads SDIO *1 TF CardSupport 32GB max USB USB_BOOTForce USB boot for emergency 6 ports(BLSP2-7), 4-bits each, multiplexed serial BLSP ports interface functions UART*3 Max up to 4 Mbps Application interface I2C*5 Support SPI
(master only) ADC*1 PWM*1 Support Support Support Charge Vibrator GPIO VCOIN RF Interface Audio Max up to 1.44A Support 40 GPIOsExcluded BLSP multiplexing GPIO. Real time clock backup battery Multimode LTE main antenna Multimode LTE diversity antenna The GPS antenna 2.4G +5G WiFi/BT antenna One main MIC One noise reduction MIC One Handsfree speaker. One earpiece One stereo headphone. Accessories versions SLM500QW_MB_V1.01_PCB Software versions SLM500Q_EQ000_2774.2AAF2F74.BCA2CDE_200628_100_V01_T09 SLM500 Hardware Design Guide Page 10 MeiG Smart product technical information 2.2 Block diagram The following figure lists the main functional parts of the module:
baseband chip power management chip Transceiver chip WCN3660-WIFI/BT Two in one chip Antenna interface LCD/CAM-MIPI interface EMCP memory chip AUDIO interface UARTSD card interfaceSIM card interfaceI2Cinterface,etc. Figure 2.1: module function block diagram SLM500 Hardware Design Guide Page 11 MeiG Smart product technical information 3. Module Package 3.1.Pin distribution diagram Figure 3.1module pin diagram (top view) SLM500 Hardware Design Guide Page 12 MeiG Smart product technical information 3.2. Pin definitions table 3.1Pin description Pin number Pin number I/O Description Comment The power supply 12145146 I 141142 I/O 5V charging input power. VCOIN 126 I/O The module provides Four VBAT power pin pins. The SLM500 operates from a single supply with a voltage range from 3.4V to 4.2V for VBAT. When the VBAT of the system power is absent, the external backup battery provides power to the system real-time clock. When VBAT is present, the backup battery is charged. 1.8V power output, Power supply always available for IO port pull-up and level conver-
sion, not for peripheral power supply 1.8 V power output, standby will be closed, used for Camera, LCD and other small current power supply. Externally, large capacito-
rs and Zener diodes must be added for surge protec-
tion. VCOIN pins connect 3V button batteries or large capacitors. 50mA 100mA 2.8V power output, used for Sensor, TP power supply. 150mA 2.85 V power output, for LCD, Camera 2.8V. 300mA TF card power supply pin 500mA TF card signal pull-up power supply pin UIM power supply pins UIM power supply pins Camera AVDD 50mA 50mA 50mA 50mA O O O O O O O O O VBAT VBUS VREG_L5_1P8 VREG_L6_1P8 VREG_L10_2P8 VREG_L17_2P85 VREG_L11_SDC VREG_L12_ SDC VREG_L14_UIM1 VREG_L15_UIM2 VREG_L16_AVDD GND GND SLM500 Hardware Design Guide Page 13 111 125 156 129 38 32 26 21 193 371215 27516269 76788586 8889120 122130132 135140143 144149162 171172176 187~191202~204 206~224226~231 233~238240 241243244 245247248 MeiG Smart product technical information 250251255 256258259 261266268 269271~274 display interface (MIPI) MIPI_LCD clock MIPI_LCD data I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I O I O I O I O I O O I O O O LCD reset I/O LCD frame sync signal UART(1.8V) UART1 data transmit UART1 data receive UART2 data receive UART2 data transmit UART5 data receive UART5 data transmit UART5 Clear To SendCTS UART5 Request To Send RTS UIM card Interface I/O UIM1 data UIM1 insert detect UIM1 reset UIM1 clock UIM2 insert detect UIM2 reset UIM2 clock I/O UIM2 data Front Camera MIPI_DSI0_CLK_M MIPI_DSI0_CLK_P MIPI_DSI0_LANE0_M MIPI_DSI0_LANE0_P MIPI_DSI0_LANE1_M MIPI_DSI0_LANE1_P MIPI_DSI0_LANE2_M MIPI_DSI0_LANE2_P MIPI_DSI0_LANE3_M MIPI_DSI0_LANE3_P GPIO61_LCD_RST_N GPIO24_LCD_TE0 GPIO0_UART1_TXD GPIO1_UART1_RXD GPIO4_DBG_UART_TX GPIO5_DBG_UART_RX GPIO16_UART5_TXD GPIO17_UART5_RXD GPIO18_UART5_CTS GPIO19_UART5_RTS GPIO54_UIM1_DET GPIO58_UIM2_DET UIM1_RESET UIM1_CLK UIM1_DATA UIM2_RESET UIM2_CLK UIM2_DATA 154 153 52 53 54 55 56 57 58 59 60 61 49 50 94 93 34 35 36 37 22 23 24 25 17 18 19 20 SLM500 Hardware Design Guide Page 14 MeiG Smart product technical information MIPI_CSI0_CLK_M MIPI_CSI0_CLK_P MIPI_CSI0_LANE0_M MIPI_CSI0_LANE0_P MIPI_CSI0_LANE1_M MIPI_CSI0_LANE1_P MIPI_CSI0_LANE2_M MIPI_CSI0_LANE2_P MIPI_CSI0_LANE3_M MIPI_CSI0_LANE3_P GPIO28_SCAM_MCLK2 GPIO129_SCAM_RST_N GPIO125_SCAM_PWDN MIPI_CSI1_CLK_M MIPI_CSI1_CLK_P MIPI_CSI1_LANE0_M MIPI_CSI1_LANE0_P MIPI_CSI1_LANE1_M MIPI_CSI1_LANE1_P MIPI_CSI1_LANE2_M MIPI_CSI1_LANE2_P MIPI_CSI1_LANE3_M MIPI_CSI1_LANE3_P GPIO26_MCAM_MCLK0 GPIO128_MCAM_RST_N GPIO126_MCAM_PWDN MIC_GND MIC_IN1_P MIC_IN2_P MIC_IN3_P MIC_BIAS1 MIC_BIAS2 157 196 158 197 159 198 160 199 161 200 75 81 82 63 64 65 66 67 68 72 73 70 71 74 79 80 5 4 6 148 147 155 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I I I O O Front Camera MIPI clock Front Camera MIPI data Front Camera main clock Front Camera reset Front Camera dormancy Rear Camera MIPI clock Rear Camera Rear Camera MIPI data I/O Rear Camera main clock I/O Rear Camera reset I/O Rear Camera dormancy Audio Interface The main MIC negative The main MIC positive Headphone MIC positive Secondary MIC positive The BIAS voltage of main MIC is used in the design of silicon wheat The BIAS voltage of the earphone MIC is used in the design of silicon wheat SLM500 Hardware Design Guide Page 15 MeiG Smart product technical information Power amplifier output negative Class D Power amplifier output positive Class D SD card Interface GPIO67_SD_CARD_DET_N SD card insertion detection CDC_HPH_R CDC_HPH_L CDC_HSDET_L CDC_HPH_REF EAR_P EAR_M SPKR_OUT_P SPKR_OUT_M SDC2_SDCARD_CMD SDC2_SDCARD_CLK SDC2_SDCARD_D0 SDC2_SDCARD_D1 SDC2_SDCARD_D2 SDC2_SDCARD_D3 GPIO29_CAM_I2C_SDA0 GPIO30_CAM_I2C_SCL0 GPIO31_DCAM_I2C_SDA1 GPIO32_DCAM_I2C_SCL1 GPIO14_SENSOR_I2C4_SDA GPIO15_SENSOR_I2C4_SCL GPIO10_TP_I2C3_SDA GPIO11_TP_I2C3_SCL GPIO6 GPIO7 GPIO10_TP_I2C3_SDA GPIO11_TP_I2C3_SCL GPIO65_TP_INT_N GPIO64_TP_RESET_N USB_HS_DM USB_HS_DP USB_HS_ID 136 138 139 137 8 9 10 11 45 40 39 41 42 43 44 84 83 205 166 92 91 48 47 167 168 48 47 30 31 13 14 16 Right channel of earphone Left channel of earphone Headphone plug and unplug detection Earphone reference GND Earpiece output negative Earpiece output positive SD CMD SD clock SD data O O I I O O O O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I2C I/O I/O TP Special I2C signal can only be used for CAM Default for DCAM Special I2C signal can only be used for SENSOR I/O Universal I2C signal, which is used by default for TP I/O Universal I2C signal, I/O Universal I2C signal, which is used by default for TP I/O Pullup to VREG_L6_1P 8 Pullup to VREG_L5_1P 8 Pullup to VREG_L5_1P 8 I O TP interrupt TP reset USB I/O USB DM I/O USB DP I USB ID SLM500 Hardware Design Guide Page 16 MeiG Smart product technical information RF_MAIN RF_WIFI/BT RF_DIV RF_GPS GPIO20 GPIO21 GPIO22 GPIO23 GPIO89 GPIO44_MAG_INT GPIO42_ACCL_INT_N GPIO43_ALSP_INT_N GPIO63_GYRO_INT GPIO32_DCAM_I2C_SCL1 GPIO31_DCAM_I2C_SDA1 GPIO27_DCAM_MCLK GPIO38_DCAM_RST GPIO41_DCAM_PWDN GPIO34 GPIO85 GPIO86 GPIO87 GPIO88 GPIO12 GPIO48 GPIO59 GPIO13 GPIO61 87 77 131 121 119 118 117 116 115 109 110 107 108 170 265 239 105 264 166 205 165 164 163 101 99 100 102 267 Antenna interface I/O The main antenna I/O WIFI/BT antenna I I Diversity antenna GPS antenna GPIOand default function I/O Generic GPIO, SPI MOSI I/O Generic GPIO, SPI MISO I/O Generic GPIO, SPI CS I/O Generic GPIO, SPI CLK Generic GPIO, without default configuration The default configuration is the compass interrupt signal. The default configuration is G-
sensor interrupt The default configuration is Ps-
sensor interrupt signal The default configuration is the gyroscope interrupt signal. Generic GPIO, without default configuration I/O Generic GPIO, MI2S1 SCK I/O Generic GPIO, MI2S1 D1 I/O Generic GPIO, MI2S1 WS I/O Generic GPIO, MI2S1 D0 default configuration Depth camera I2C default configuration Depth camera I2C default configuration Depth camera MCLK default configuration Depth camera reset default configuration Depth camera power down General purpose GPIO, no default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O SLM500 Hardware Design Guide Page 17 MeiG Smart product technical information GPIO45 GPIO25 GPIO33 GPIO39 GPIO46 GPIO47 GPIO62 GPIO66 GPIO90 GPIO93 GPIO94 GPIO95 GPIO127 GPIO25 GPIO130 GPIO104_RFFE3_CLK GPIO106_RFFE3_DATA GNSS_LNA_EN FORCED_USB_BOOT CHARGE_SEL CHG_LED GPIO91_KEY_VOL_UP_N GPIO50_KEY_VOL_DOWN KYPD_PWR_N RESET_N BATT_THERM 98 90 33 201 113 124 123 106 177 112 104 103 169 90 97 260 262 194 46 127 195 95 96 114 225 134 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I I O I I I Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration Generic GPIO, without default configuration GRFC only used for RF Tuner controlnot for general GPIO External GPS LNA enable Other functional pin Pull up to 1.8 V into the emergency download mode SMB1360 (external charge IC) is used, the pin shall be grounded; when PM215is used, the pin shall be suspended. The charging indicator light negative I/O Control volume increase I/O Control volume decrease Pull down to power on / off Pull down to reset Battery temperature detection, Battery terminal NTC resistance default 47K). SLM500 Hardware Design Guide Page 18 MeiG Smart product technical information VBAT_SNS_P PM_VIB_DRV_N ADC PWM NFC_CLK NFC_CLK_REQ CBL_PWR_N BAT_ID RESERVED I Battery voltage monitoring O Motor negative control I O O I I I Analog voltage input can be used as ADC input Analog voltage input can be used as PWM input NFC Clock Default PM215 GPIO2 Grounding support power on automatic startup Battery type detection optional 133 28 128 29 181 182 186 185 150151152 173174175 178179180 183184192 232242246 249252253 254257263 270 Table 3.2Pin Characteristics PIN# SLM500 Pin name GPIO Interrupt Pad characteristics Functional description 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 VBAT VBAT GND MIC_IN1_P MIC_GND MIC_IN2_P GND EAR_P EAR_M SPKR_OUT_P SPKR_OUT_M GND USB_HS_DM USB_HS_DP GND PI,PO PI,PO GND AI GND AI GND AO AO AO AO GND AI,AO AI,AO GND Battery,3.5V-4.2V,default 3.8V Battery,3.5V-4.2V,default 3.8V GND Microphone 1 input plus Microphone bias filter ground Microphone 2 input plus GND Earpiece output, plus Earpiece output, minus Class-D speaker driver output, plus Class-D speaker driver output, minus GND USB data minus USB data plus GND SLM500 Hardware Design Guide Page 19 MeiG Smart product technical information USB_HS_ID AI USB ID GPIO58_UIM2_DET GPIO58*
B-PD:nppukp Configurable I/O,UIM2 removal detection GPIO54_UIM1_DET GPIO54*
B-PD:nppukp Configurable I/O,UIM1 removal detection UIM2_RESET UIM2_CLK UIM2_DATA VREG_L15_UIM2 UIM1_RESET UIM1_CLK UIM1_DATA VREG_L14_UIM1 PM_VIB_DRV_N GND PWM VREG_L12_SDC GPIO33 GPIO18_UART5_CTS GPIO19_UART5_RTS VREG_L11_SDC SDC2_SDCARD_CLK SDC2_SDCARD_CMD SDC2_SDCARD_D0 SDC2_SDCARD_D1 SDC2_SDCARD_D2 SDC2_SDCARD_D3 GPIO57 GPIO56 GPIO55 GPIO53 GPIO52 GPIO51 GPIO33 GPIO16 GPIO18 GPIO19 B-PD:nppukp Configurable I/O,UIM2 reset B-PD:nppukp Configurable I/O,UIM2 clock B-PD:nppukp Configurable I/O,UIM2 data PO PMIC output for UIM2 B-PD:nppukp Configurable I/O,UIM1 reset B-PD:nppukp Configurable I/O,UIM1 clock B-PD:nppukp Configurable I/O,UIM1 data PO GND PI PMIC output for UIM1 GND Haptics driver output negative AO-Z,DI,DO Configurable MPP,PWM,ADC B-PD:nppukp Configurable I/O,UART5 CTS B-PD:nppukp Configurable I/O,UART5 RTS PO PMIC output 2.95V for SD-card power BH-NP:pdpukp Secure digital controller 2 clock BH-NP:pdpukp Secure digital controller 2 command BH-NP:pdpukp Secure digital controller 2 data bit 0 BH-NP:pdpukp Secure digital controller 2 data bit 1 BH-NP:pdpukp Secure digital controller 2 data bit 2 BH-NP:pdpukp Secure digital controller 2 data bit 3 GPIO65_TP_INT_N GPIO65*
B-PD:nppukp Configurable I/O,TP INT GPIO64_TP_RESET_N GPIO64 B-PD:nppukp Configurable I/O,TP RESET PO PMIC output 2.95V for SDC2 signal B-PD:nppukp Configurable I/O GPIO16_UART5_TXD B-PD:nppukp Configurable I/O,UART5 TX GPIO17_UART5_RXD GPIO17*
B-PD:nppukp Configurable I/O,UART5 RX GPIO67_SD_CARD_DET_N GPIO67*
B-PD:nppukp Configurable I/O,SD card detection FORCED_USB_BOOT GPIO37*
DI pullup with VREG_L5 to forced USB boot GPIO11_TP_I2C3_SCL GPIO10_TP_I2C3_SDA GPIO60_LCD_RESET_N GPIO24_LCD_TE0 GND GPIO11 GPIO10 GPIO60 GPIO24 B-PD:nppukp Configurable I/O,TP I2C SCL B-PD:nppukp Configurable I/O,TP I2C SDA B-PD:nppukp Configurable I/O, LCD RESET B-PD:nppukp Configurable I/O, LCD TE GND GND SLM500 Hardware Design Guide Page 20 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 MeiG Smart product technical information MIPI_DSI0_CLK_M MIPI_DSI0_CLK_P MIPI_DSI0_LANE0_M MIPI_DSI0_LANE0_P MIPI_DSI0_LANE1_M MIPI_DSI0_LANE1_P MIPI_DSI0_LANE2_M MIPI_DSI0_LANE2_P MIPI_DSI0_LANE3_M MIPI_DSI0_LANE3_P GND MIPI_CSI1_CLK_M MIPI_CSI1_CLK_P MIPI_CSI1_LANE0_M MIPI_CS1_LANE0_P MIPI_CSI1_LANE1_M GND MIPI_CSI1_LANE3_M MIPI_CSI1_LANE3_P MIPI_CSI1_LANE2_M MIPI_CSI1_LANE2_P GND RF_WIFI/BT GND MIPI display serial interface 0 clock-
MIPI display serial interface 0 clock+
MIPI display serial interface 0 lane0-
MIPI display serial interface 0 lane0+
MIPI display serial interface 0 lane1-
MIPI display serial interface 0 lane1+
MIPI display serial interface 0 lane2-
MIPI display serial interface 0 lane2+
MIPI display serial interface 0 lane3-
MIPI display serial interface 0 lane3+
MIPI camera serial interface 0 clock-
MIPI camera serial interface 0 clock+
MIPI camera serial interface 0 lane0-
MIPI camera serial interface 0 lane0+
MIPI camera serial interface 0 lane1-
MIPI camera serial interface 1 lane3-
MIPI camera serial interface 1 lane3+
MIPI camera serial interface 1 lane2-
MIPI camera serial interface 1 lane2+
GND GND GND GND AO AO AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI GND AI GND GND GND RF signal for WIFI/BT GPIO26_MCAM_MCLK0 GPIO26 B-PD:nppukp Configurable I/O,main CAM MCLK GPIO28_SCAM_MCLK2 GPIO28*
B-PD:nppukp Configurable I/O,front CAM MCLK GPIO128_MCAM_RST_N GPIO128*
B-PD:nppukp Configurable I/O,main CAM RESET GPIO126_MCAM_PWDN GPIO126*
B-PD:nppukp Configurable I/O,main CAM PWDN GPIO129_SCAM_RST_N GPIO129 B-PD:nppukp Configurable I/O,front CAM RESET GPIO125_SCAM_PWDN GPIO125 B-PD:nppukp Configurable I/O,front CAM PWDN GPIO30_CAM_I2C_SCL0 GPIO29_CAM_I2C_SDA0 B-PD:nppukp Configurable I/O,Dedicated camera I2C0 SCL B-PD:nppukp Configurable I/O,Dedicated camera I2C0 SDA GPIO30 GPIO29 GND GND RF_MAIN GND GND GND AI GND GND GND GND RF signal for main ANT SLM500 Hardware Design Guide Page 21 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 MeiG Smart product technical information GND GND GND GND GPIO25*
B-PD:nppukp Configurable I/O GPIO15 GPIO14 GPIO5*
GPIO4 GPIO15_SENSOR_I2C4_SCL GPIO14_SENSOR_I2C4_SDA GPIO5_DBG_UART_RX GPIO4_DBG_UART_TX B-PD:nppukp Configurable I/O,SENSOR I2C SCL B-PD:nppukp Configurable I/O,SENSOR I2C SDA B-PD:nppukp Configurable I/O,UART2 RX B-PD:nppukp Configurable I/O,UART2 TX GPIO91_KEY_VOL_UP_N GPIO91*
B-PD:nppukp Configurable I/O,KEY VOL+
GPIO50_KEY_VOL_DOWN_N GPIO127*
B-PD:nppukp Configurable I/O,KEY VOL-
GPIO130 GPIO130*
B-PD:nppukp Configurable I/O GPIO45*
B-PD:nppukp Configurable I/O GPIO48*
B-PD:nppukp Configurable I/O GPIO59*
B-PD:nppukp Configurable I/O GPIO12*
B-PD:nppukp Configurable I/O GPIO13*
B-PD:nppukp Configurable I/O GPIO95 GPIO94 GPIO87 GPIO66 B-PD:nppukp Configurable I/O B-PD:nppukp Configurable I/O B-PD:nppukp Configurable I/O, MI2S1 WS B-PD:nppukp Configurable I/O GPIO43_ALSP_INT_N GPIO43*
B-PD:nppukp Configurable I/O,ALSP INT GPIO63_GYRO_INT GPIO63*
B-PD:nppukp Configurable I/O, GYRO INT GPIO44_MAG_INT GPIO44*
B-PD:nppukp Configurable I/O, MAG INT GPIO42_ACCL_INT_N GPIO42*
B-PD:nppukp Configurable I/O, ACCL INT VREG_L5_1P8 PO PMIC output 1.8V for digital I/Os KYPD_PWR_N DI KEY POWER ON/OFF GPIO93*
B-PD:nppukp Configurable I/O GPIO46*
B-PD:nppukp Configurable I/O GPIO89 GPIO23 GPIO22 B-PD:nppukp Configurable I/O B-PD:nppukp Configurable I/O, SPI CLK B-PD:nppukp Configurable I/O, SPI CS GPIO21*
B-PD:nppukp Configurable I/O, SPI MISO GPIO20 B-PD:nppukp Configurable I/O, SPI MOSI GND AI GND GND GND RF signal for GPS ANT GPIO62*
B-PD:nppukp Configurable I/O SLM500 Hardware Design Guide Page 22 GND GND GPIO25 GPIO45 GPIO48 GPIO59 GPIO12 GPIO13 GPIO95 GPIO94 GPIO87 GPIO66 GPIO93 GPIO46 GPIO89 GPIO23 GPIO22 GPIO21 GPIO20 GND RF_GPS GND GPIO62 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 MeiG Smart product technical information GPIO47 B-PD:nppukp Configurable I/O PO PMIC output 1.8V for LCD,CAM,TP,sensor AI,AO Coin-cell battery or backup battery AI Charger select AO-Z,AI,DO Configurable MPP,PWM,ADC PMIC output 2.8V for LCD,CAM GPIO47 VREG_L6_1P8 VCOIN CHARGE_SEL ADC VREG_L17_2P85 GND RF_DIV GND VBAT_SNS_P BATT_THERM GND CDC_HPH_R CDC_HPH_REF CDC_HPH_L CDC_HSDET_L GND VBUS VBUS GND GND VBAT VBAT MIC_BIAS1 MIC_IN3_P GND RESERVED RESERVED RESERVED 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 GND GND RF signal for diversity ANT GND GND battery voltage input to ADC Battery temperature input to ADC Headphone output, right channel Headphone ground reference Headphone output, left channel GND USB Voltage USB Voltage GND GND Battery,3.5V-4.2V,default 3.8V Battery,3.5V-4.2V,default 3.8V Microphone bias #1 Microphone 3 input plus MBHC mechanical insertion/removal-detection GND GND Reserved Reserved Reserved PO GND AI GND AI AI AO AI AO AI GND PI,PO PI,PO GND GND PI,PO PI,PO AO AI AO PO AI AI AI GPIO1_UART1_RXD GPIO1*
B-PD:nppukp Configurable I/O,UART1 RX GPIO0_UART1_TXD GPIO0 B-PD:nppukp Configurable I/O,UART1 TX MIC_BIAS2 VREG_L10_2P8 MIPI_CSI0_CLK_M MIPI_CSI0_LANE0_M MIPI_CSI0_LANE1_M Microphone bias #2 PMIC output 2.8V for TP, Sensor MIPI camera serial interface 0 clock-
MIPI camera serial interface 0 lane0-
MIPI camera serial interface 0 lane1-
SLM500 Hardware Design Guide Page 23 MeiG Smart product technical information MIPI_CSI0_LANE2_M MIPI_CSI0_LANE3_M GND AI AI GND MIPI camera serial interface 0 lane2-
MIPI camera serial interface 0 lane3-
GND GPIO41_DCAM_PWDN GPIO41*
B-PD:nppukp Configurable I/O, depth CAM PWDN GPIO38_DCAM_RST GPIO38*
B-PD:nppukp Configurable I/O, depth CAM RESET GPIO27_DCAM_MCLK GPIO32_DCAM_I2C_SCL1 B-PD:nppukp Configurable I/O, depth CAM MCLK B-PD:nppukp Configurable I/O, Dedicated camera I2C1 SCL GPIO27 GPIO32 GPIO6 GPIO7 B-PD:nppukp Configurable I/O, I2C2 SDA B-PD:nppukp Configurable I/O, I2C2 SCL GPIO127*
B-PD:nppukp Configurable I/O GPIO34*
B-PD:nppukp Configurable I/O 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 GPIO6 GPIO7 GPIO127 GPIO34 GND GND RESERVED RESERVED RESERVED GND GPIO90 RESERVED RESERVED RESERVED NFC_CLK RESERVED RESERVED BAT_ID CBL_PWR_N GND GND GND GND GND GND GND GPIO90*
B-PD:nppukp Configurable I/O Reserved Reserved Reserved GND GND GND GND Reserved Reserved Reserved Reserved DO NFC CLK DI DI GND GND GND GND GND PO Reserved Battery ID Cable power-on GND GND GND GND GND Reserved RESERVED VREG_L16_AVDD GNSS_LNA_EN GPIO118 B-PD:nppukp Configurable I/O, GNSS_LNA_EN CHG_LED AO Current sink for charging indication SLM500 Hardware Design Guide Page 24 PMIC output 2.8V for CAM AVDD NFC_CLK_REQ DO-Z,DI Configurable I/O, NFC CLK REQ MeiG Smart product technical information MIPI_CSI0_CLK_P MIPI_CSI0_LANE0_P MIPI_CSI0_LANE1_P MIPI_CSI0_LANE2_P MIPI_CSI0_LANE3_P MIPI camera serial interface 0 clock+
MIPI camera serial interface 0 lane0+
MIPI camera serial interface 0 lane1+
MIPI camera serial interface 0 lane2+
MIPI camera serial interface 0 lane3+
GPIO39 GPIO39 B-PD:nppukp Configurable I/O GPIO31_DCAM_I2C_SDA1 GPIO31*
B-PD:nppukp Configurable I/O, Dedicated camera I2C1 SDA 196 197 198 199 200 201 202 203 204 205 206 207 208 209 210 211 212 213 214 215 216 217 218 219 220 221 222 223 224 225 226 227 228 229 230 231 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND AI AI AI AI AI GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND DI GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND RESET_N KEY RESET SLM500 Hardware Design Guide Page 25 MeiG Smart product technical information 232 233 234 235 236 237 238 239 240 241 242 243 244 245 246 247 248 249 250 251 252 253 254 255 256 257 258 259 260 261 262 263 264 265 266 267 RESERVED GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GPIO86 GND GND RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED GPIO88 GPIO85 GND GPIO61 GPIO86*
B-PD:nppukp Configurable I/O,MI2S1 D1 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Reserved Reserved GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Reserved Reserved Reserved Reserved Reserved GND GND GND GND Reserved Reserved GPIO104_RFFE3_CLK GPIO104 B-PD:nppukp Configurable I/O,RFFE3 CLK GND GND GPIO106_RFFE3_DATA GPIO106 B-PD:nppukp Configurable I/O,RFFE3 DATA GPIO88 GPIO85 B-PD:nppukp Configurable I/O, MI2S1 D0 B-PD:nppukp Configurable I/O, MI2S1 SCK GND GND GPIO61*
B-PD:nppukp Configurable I/O SLM500 Hardware Design Guide Page 26 MeiG Smart product technical information RESERVED GND GND GND GND GND GND GND GND GND GND GND GND Reserved GND GND GND GND GND GND
*Wake-up system interrupt pin BBidirectionaldigital with CMOS input HHigh-voltage tolerant NPpdpukp=defaultno-pull with programmable options following the colon (:) PDnppukp=defaultpulldown with programmable options following the colon (:) PUnppdkp=defaultpullup with programmable options following the colon (:) KPnppdpu=defaultkeeper with programmable options following the colon (:) 268 269 270 271 272 273 274 3.3. Mechanical Dimensions SLM500 Hardware Design Guide Page 27 MeiG Smart product technical information Figure 3.2Module 3D sizeunit mm Figure 3.3Recommended PCB package sizeunit mm SLM500 Hardware Design Guide Page 28 MeiG Smart product technical information 3. Interface application 4.1. Power Supply In the case of a battery device, the voltage input range of the module VBAT is 3.4V to 4.2V, and the recommended voltage is 3.8V. In the GSM band, when the module is transmitting at maximum power, the peak current can reach up to 3A, resulting in a large voltage drop on VBAT. It is recommended to use a large capacitor regulator close to VBAT. It is recommended to use two 47uF ceramic capacitors. Parallel 33PF and 10PF capacitors can effectively remove high frequency interference. To prevent damage to the chip due to ESD and surge, it is recommended to use a suitable TVS tube and a 5.1V/500mW Zener diode at the VBAT pin of the module. For PCB layout, the capacitors and diodes should be as close as possible to the VBAT pin of the module. The user can directly power the module with a 3.7V lithium-ion battery. When using the battery, the impedance between the VBAT pin and the battery should be less than 150m. Figure 4.1VBAT input reference circuit SLM500 Hardware Design Guide Page 29 MeiG Smart product technical information If it is a DC power supply device, the DC input voltage is 5V-12V. The recommended circuit that can be powered by DC-DC is shown below:
Figure 4.2DC-DC power supply circuit NoteIf the user does not use battery power, please note that a 47K resistor is connected to the 134 pin (BAT_THERM) of the module and pulled down to GND to prevent the software from judging the abnormal battery temperature after the module is turned on, resulting in shutdown. The connection diagram is as follows:
47K Figure 4.3Connection diagram when not powered by battery SLM500 Hardware Design Guide Page 30 MeiG Smart product technical information 4.1.1. Power Pin The VBAT pin (12145146) is used for power input. In the user's design, pay special attention to the design of the power supply section to ensure that the VBAT does not fall below 3.4V even when the module consumes 2A. If the voltage drops below 3.4V, the module may shut down. The PCB layout from the VBAT pin to the power supply should be wide enough to reduce the voltage drop in the transmit burst mode. Figure4.4VBAT lowest voltage drop 4.2. Power on and off Do not turn on the module when the module's temperature and voltage limits are exceeded. In extreme cases, such operations can cause permanent damage to the module. 4.2.1. Module Boot The user can power on the module by pulling the KYPD_PWR_N pin (114) low. The pull-
down time is at least 5 seconds. This pin has been pulled up to 1.8V in the module. The recommended circuit is as follows; or the CBL_PWR_N pin (186) is pulled low. CBL_PWR_N can be powered on by 10K pull-down resistor to GND. It does not need to release this signal after booting. Figure 4.5Using an external signal to drive the module to boot SLM500 Hardware Design Guide Page 31 MeiG Smart product technical information Figure 4.6Booting with the button circuit The following figure is the boot timing description:
Figure 4.7Using PWRKEY boot timing diagram SLM500 Hardware Design Guide Page 32 MeiG Smart product technical information 4.2.2. Module Shutdown Users can use the PWRKEY pin to shutdown. 4.2.2.1 PWRKEY Shutdown The user can turn off the PWRKEY signal by pulling it down for at least 3 seconds. The shutdown circuit can refer to the design of the boot circuit. After the module detects the shutdown action, a prompt window pops up on the screen to confirm whether to perform the shutdown action. The user can achieve a forced shutdown by pulling PWRKEY down for a long time, pulling down for at least 15 seconds. 4.2.3.Module Reset follows:
The SLM500 module supports a reset function that allows the user to quickly restart the module by pulling the RESET_N pin225 of the module low. The recommended circuit is as Figure 4.8Reset using the key circuit SLM500 Hardware Design Guide Page 33 Figure 4.9 Reset Module Using External Signal MeiG Smart product technical information When the pin is high, the voltage is typically 1.8V. Therefore, for users with a level of 3V or 3.3V, it is not possible to directly use the GPIO of the MCU to drive the pin. An isolation circuit is required. The hardware parameters of the RESET(225) can refer to the following table:
Table 4.1RESET Hardware Parameters Pin RESET_N Description Input high level Input low level Pull down effective time Minimum 1
500 Typical Maximum
0.65
Unit V V ms 4.3. VCOIN Power When VBAT is disconnected, the user needs to save the real-time clock. The VCOIN pin cannot be left floating. It should be connected to a large capacitor or battery. When external capacitor is connected, the recommended value is 100uF, and the real-time clock can be kept for 1 minute. The reference design circuit is used when the RTC power supply uses an external large capacitor or battery to power the RTC inside the module:
Figure 4.10External Capacitor Powering the RTC Non-rechargeable battery powered:
Figure 4.11Non-rechargeable battery to power the RTC SLM500 Hardware Design Guide Page 34 MeiG Smart product technical information Rechargeable battery powered:
Figure 4.12 Rechargeable Battery Powers RTC NotesThis VCOIN power supply is 2.0-3.25V, typical typically 3.0V 4.4. Power Output The SLM500 has multiple power outputs. For LCD, Camera, touch panel, etc. In application, it is recommended to add parallel 33PF and 10PF capacitors to each power supply to effectively remove high frequency interference. Table 4.2Power Description Signal VREG_L5_1P8 VREG_L6_1P8 VREG_L10_2P8 VREG_L11_SDC VREG_L12_SDC VREG_L14_UIM1 VREG_L15_UIM2 VREG_L16_AVDD VREG_L17_2P85 Drive Current(mA) Default Voltage(V) 1.8 1.8 2.8 2.95 2.95 1.8/2.95 1.8/2.95 2.8 2.85 100 100 150 600 50 55 55 55 300 4.5. Serial Port The SLM500 provides three serial ports for communication. And corresponding to one groups of I2C interfaces can be multiplexed into hardware flow control, note that the I2C interface can not be added to the UART_RTS/CTS when the pull resistor can be added. Table 4.3UART Pin Description Name Pin Function GPIO0_UART1_TXD SLM500 Hardware Design Guide Page 35 UART1 Data Transmission 154 Direction I MeiG Smart product technical information GPIO1_UART1_RXD GPIO4_DBG_UART_TX GPIO5_DBG_UART_RX GPIO16_UART5_TXD GPIO17_UART5_RXD GPIO18_UART5_CTS GPIO19_UART5_RTS Please refer to the following connection method:
153 94 93 34 35 36 37 O I O I O I O UART1 Data Reception UART2 Data Transmission UART2 Data Reception UART5 Data Transmission UART5 Data Reception UART5 Clear To Send CTS UART5 Request To Send RTS Figure 4.13Serial Port Connection Diagram When the serial level used by the user does not match the module, in addition to adding the level shifting IC, the following figure can also be used to achieve level matching. Only the matching circuits on TX and RX are listed here. Other low speed signals can refer to this two circuits. module SLM500 Hardware Design Guide Page 36 Figure 4.14TX Connection Diagram MeiG Smart product technical information module Figure 4.15RX Connection Diagram Note When using Levels Isolation in Figures 14 and 15, Attention should be paid to LDO6_1P8 output timing, the serial port can communicate normally after the normal output. Table 4.4Serial Port Hardware Parameters Description Input low level Input high level Input low level Input high level Minimum Maximum Unit 1.17
1.35 0.63
0.45
V V V V Note1. The serial port of the module is a CMOS interface, and the RS232 signal cannot be directly connected. If necessary, please use the RS232 conversion chip. 2. If the 1.8V output of the module cannot meet the high level range of the user terminal, please add a level shifting circuit. 4.6. MIPI Interface The SLM500 supports the Moble Industry Processor Interface (MIPI) interface for Camera and LCD. The module supports HD+(1440*720 )display. The MIPI interface Main Camera supports up to 13MP, and the Front Camera supports 5MP. MIPI is a high-speed signal line. In the Layout stage, please follow the impedance and length requirements strictly, and control the length of the differential pair within the group and the group length. The total length should be as short as possible. SLM500 Hardware Design Guide Page 37 MeiG Smart product technical information 4.6.1. LCD Interface The SLM500 module supports the MIPI interface of one LCD displays, supports dual-
screen display, and has a compatible screen identification signal. The resolution of the screen can be up to 1440*720. The signal interface is shown in the following table. In the Layout, the MIPI signal line should strictly control the differential 100 ohm impedance and the equal length between the signal line group and the group. The module's MIPI interface is a 1.2V power domain. When the user needs a compatible screen design, the module's LCD_ID pin or ADC pin can be used. At the same time, the module can provide 2.8V power to the LCD. The LCD interface is as follows:
Table 4.5Primary screen interface definition Main screen interface MIPI_DSI0_CLK_M MIPI_DSI0_CLK_P MIPI_DSI0_LANE0_M MIPI_DSI0_LANE0_P MIPI_DSI0_LANE1_M MIPI_DSI0_LANE1_P MIPI_DSI0_LANE3_M MIPI_DSI0_LANE3_P MIPI_DSI0_LANE2_M MIPI_DSI0_LANE2_P GPIO60_LCD_RESET_N GPIO24_LCD_TE0 VREG_L6_1P8 VREG_L17_2P85 52 53 54 55 56 57 60 61 58 59 49 50 125 129 O O I/O I/O I/O I/O I/O I/O I/O I/O O O O MIPI_LCD clock line MIPI_LCD data line LCD reset pin I/O LCD frame sync signal 1.8V power supply 2.8V power supply LCD_ID of the module, this pin is internally GPIO. When used as LCD_ID, please confirm the internal circuit of LCD. If the internal divider of the LCD uses resistor divider, please pay attention to the voltage to meet the high or low range of GPIO. MIPI is a high-speed signal line. To avoid EMI interference, it is recommended to place a common-mode inductor near the LCD side. SLM500 Hardware Design Guide Page 38 MeiG Smart product technical information Figure 4.16 LCD interface circuit PMIC does not support backlight drive. LCD backlight driver circuit needs to be added by customers. Please refer to the following figure for specific circuit Figure 4.17Backlight drive schematic SLM500 Hardware Design Guide Page 39 MeiG Smart product technical information 4.6.2.MIPI Camera Interface The SLM500 module supports the MIPI interface Camera and provides a dedicated camera power supply. The main camera is a CSI1 interface that supports four sets of data lines and can support up to 13M pixels. The front camera is a CSI0 interface that supports four sets of data lines and can support 5M pixels. The module provides the power required by the Camera, including AVDD-2.8V, IOVDD-1.8V\AFVDD-2.8V (powered by the focus motor) and D-
VDD1.2V (CAM core voltage). D-VDD1.2V(CAM Core Votage) Please add external circuit by yourself Table 4.6MIPI Camera Interface Definition Main camera interface Name Name Name GPIO26_MCAM_MCLK0 GPIO128_MCAM_RST_N GPIO126_MCAM_PWDN MIPI_CSI1_CLK_M MIPI_CSI1_CLK_P MIPI_CSI1_LANE0_M MIPI_CSI1_LANE0_P MIPI_CSI1_LANE1_M MIPI_CSI1_LANE1_P MIPI_CSI1_LANE2_M MIPI_CSI1_LANE2_P MIPI_CSI1_LANE3_M MIPI_CSI1_LANE3_P GPIO29_CAM_I2C_SDA0 GPIO30_CAM_I2C_SCL0 VREG_L6_1P8 VREG_L16_AVDD VREG_L17_2P85 Name GPIO28_SCAM_MCLK2 GPIO129_SCAM_RST_N GPIO125_SCAM_PWDN MIPI_CSI0_CLK_M 74 79 80 63 64 65 66 67 68 72 73 70 71 84 83 125 193 129 75 81 82 157 O O O I I I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O O O O O O O I Name Main camera clock signal Main camera reset signal Main camera sleep signal Main camera MIPI clock signal Main camera MIPI data signal I2C data I2C clock 1.8V IOVDD 2.8V AVDD 2.8V AFVDD Front camera interface Name Name Name Front camera clock signal Front camera reset signal Front camera sleep signal Front camera MIPI clock signal SLM500 Hardware Design Guide Page 40 MeiG Smart product technical information MIPI_CSI0_CLK_P MIPI_CSI0_LANE0_M MIPI_CSI0_LANE0_P MIPI_CSI0_LANE1_M MIPI_CSI0_LANE1_P MIPI_CSI0_LANE2_M MIPI_CSI0_LANE2_P MIPI_CSI0_LANE3_M MIPI_CSI0_LANE3_P GPIO29_CAM_I2C_SDA0 GPIO30_CAM_I2C_SCL0 VREG_L6_1P8 VREG_L16_AVDD VREG_L17_2P85 196 158 197 159 198 160 199 161 200 84 83 125 193 129 I I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O O O O Front camera MIPI data signal I2C data I2C clock 1.8V IOVDD 2.8VAVDD 2.8V AFVDD If the user designs to use the CAMERA module with autofocus function, please note that the I2C of the module cannot be directly connected to the AF device. The I2C of the AF device should be connected to the driver chip of CAMERA, and the correct connection is as follows:
Figure 4.18 Correct CAMERA connection diagram The MIPI interface has a high rate. The user should control the impedance by 100 ohms during the routing. Please pay attention to the length of the trace. It is not recommended to add a small capacitor on the MIPI signal line. This may affect the rising edge of the MIPI data. This in turn causes the MIPI data to be invalid. SLM500 Hardware Design Guide Page 41 MeiG Smart product technical information SLM500 Hardware Design Guide Page 42 Figure 4.19MIPI Camera Reference Circuit MeiG Smart product technical information Important note: When designing the camera function, you need to pay attention to the position of the connector. There will be a small person in the specification of the camera to indicate the imaging direction. You need to ensure that the villain is standing on the long side of the LCD, otherwise the camera will be flipped. The software cannot be adjusted at 90. As shown in the two figures below. Figure 4.20Camera imaging diagram 4.7.CapacitiveTouch Interface The module provides a set of I2C interfaces that can be used to connect capacitive touches while providing the required power and interrupt pins. The default interface pins for capacitive touch software are defined as follows:
Table 4.7Capacitive Touch Interface Definitions Pin Name Input/Output GPIO10_TP_I2C3_SDA GPIO11_TP_I2C3_SCL GPIO65_TP_INT_N GPIO64_TP_RESET_N VREG_L6_1P8 VREG_L10_2P8 48 47 30 31 125 156 I/O I/O I O O O Description The capacitive touch I2C interface needs to be pulled up toVREG_L5_1P8 TP Interrupt TP Reset 1.8V Power supply to TP I/O 2.8V Power supply to TP VDD Note: The interface definition of the capacitive touch can be adjusted by software, and the user can change the GPIO and I2C according to the design needs. SLM500 Hardware Design Guide Page 43 SIM SIM MeiG Smart product technical information 4.8.Audio Interface The module provides three analog audio inputs, MIC_IN1_P for the main microphone, MIC_IN2_P for the microphone, and MIC_IN3_P for the noise reduction microphone. The module also provides three analog audio outputs (HPH_L/R, REC_P/N, SPK_P/N). The audio pin is defined as follows:
Table 4.8Audio Pin Definitions Name MIC_IN1_P MIC_IN2_P MIC_GND MIC_IN3_P MIC_BIAS1 MIC_BIAS2 CDC_HPH_R CDC_HPH_L CDC_HSDET_L CDC_HPH_REF EAR_M EAR_P SPKR_OUT_M SPKR_OUT_P Pin 4 6 5 148 147 155 136 138 139 137 9 8 11 10 Input/Ou tput I I Description Main MIC positive Headphone MIC positive I I O O O O I I O O O O Headphone MIC, Headphone MIC noise reduction MIC negative Noise reduction MIC positive BIAS voltage of the main MIC for BIAS voltage of the headphone MIC silicon wheat for silicon wheat design Headphone right channel Headphone left channel Headphone plug detection Headphone reference ground Earpiece output negative Earpiece output positive Amplifier (0.7W) output negative Amplifier (0.7W) output positive Users are advised to use the following circuit according to the actual application to get better sound effects. 4.8.1Receiver Interface Circuit Figure 4.21 Receiver Interface Circuit SLM500 Hardware Design Guide Page 44 MeiG Smart product technical information 4.8.2 Microphone receiving Circuit The figure below shows the interface circuit of MEMS microphone. Figure 4.22 Microphone Differential Interface Circuit 4.8.3.Headphone Interface Circuit The module integrates a stereo headphone jack. Users are advised to reserve ESD devices during the design phase to prevent ESD damage. The HS_DET pin of the module can be set as an interrupt. In software, this pin is the earphone interrupt by default. The user can use this pin to detect the plugging and unplugging of the earphone. Figure 4.23Headphone Interface Circuit Note:
1. The earphone holder in Figure 4.24 is normally closed. If the user is using the normally open mode earphone holder, please modify the detection circuit according to the actual pin and modify the software accordingly. 2. We recommend that the headphone detection pin HS_DET and HPH_L form a detection circuit (the connection method in the above figure), because HPH_L has a pull-down resistor SLM500 Hardware Design Guide Page 45 MeiG Smart product technical information inside the chip, which can ensure that HS_DET is low when connected with HPH_L, if the user will HS_DET and HPH_R To connect, please reserve a 1K pull-down resistor on HPH_R. 3 The standard of the headphone interface is the European standard OMPT. If you need to design the American standard CTIA interface, you need to swap the GND and MIC signals for the network. If you want to be compatible with both headset standards, you need an external dedicated chip, such as the TI-TS3A226AE. 4.8.4.Speaker Interface Circuit The module integrates a Class-D audio amplifier with an output power of 800mW and an output signal of SPKR_OUT_P / SPKR_OUT_M. 4.24Recommended circuit with Internal audio amplifier There are one sets of GPIO-compatible I2S interfaces inside the module. The pins used by 4.8.5.I2S Interface this function are as follows:
Name GPIO88 GPIO87 GPIO86 GPIO85 Pin 264 105 239 265 Intput/Output O O I O Description I2S1 Data out I2S1 WS I2S1 Data in I2S1 SLK 4.9. USB Interface The SLM500 supports a USB 2.0 High speed interface. It must control the 90 ohm differential impedance during Layout and control the external trace length. The module supports OTG function. The voltage input range during charging is as follows:
Table 4.9: Voltage input range during charging Name VBUS Description Minimum Typical Maximum Input range 4
6.3 Unit V SLM500 Hardware Design Guide Page 46 MeiG Smart product technical information The USB plug-in detection of the module is realized by the VBUS and DP/DM data lines. When the USB cable is inserted, the VBUS voltage is detected first, and then the DM/DP pull-
up state is detected to determine whether the USB data line or the charger is inserted. Therefore, if you need to use the USB function, please be sure to connect VBUS to the 5V power supply on the data line. USB is a high-speed mode. It is recommended to connect a common-mode inductor to the side of the USB connector to effectively suppress EMI interference. At the same time, the USB interface is an external interface. The DM/DP must add a TVS tube to prevent static damage caused by plugging and unplugging the data cable. When selecting the TVS, the user should pay attention to the load capacitance of less than 1pf. VBUS also needs to increase the TVS tube. If there is anti-surge demand, it is also necessary to increase the anti-surge tube. The connection diagram is as follows:
Figure 4.26: USB Connection Diagram The SLM500 module can provide USB OTG function. The pins used in this function are as 4.9.1. USB OTG follows:
Table 4.10: USB OTG Pin Description Pin name VBUS USB_HS_DM USB_HS_DP USB_HS_ID Pin 141142 13 14 16 5V charging input / OTG output power. Description USB Date-
USB Date+
USB ID SLM500 Hardware Design Guide Page 47 MeiG Smart product technical information The recommended circuit diagram of USB OTG is as follows:
Figure 4.27: USB-OTG Connection Diagram 4.10. Charging Interface The SLM500 module integrates a 1.44A charging solution. The charging related content of this manual is only described by the internal charging scheme. The QCM2150 platform uses the Qualcomm PM215 internal integrated charging chip by default. The chip is in liner mode. Trickle charging: it is divided into two parts: trickle charging-A: the charging current is 90mA when the battery voltage is lower than 2.8V; trickle charging-B: the charging current is 450mA when the battery voltage is between 2.8V and 3.2V;
Constant current charging: when the battery voltage is between 3.2V ~ 4.2V, the charging current is 1.44A , when charging with USB is 450mA;
Constant voltage charging: when the battery voltage reaches 4.2V, the charging current gradually decreases, and the charging current reduces to about 100mA to stop charging. SLM500 Hardware Design Guide Page 48 Figure 4.28: Charging diagram MeiG Smart product technical information 4.10.1. Charging Detection When the VBUS pin voltage is higher than 4.0V, a hardware interrupt will be generated inside the module. The software determines whether the charger is inserted or the USB data cable is inserted by judging the status of USB_DP/USB_DM. 4.10.2. Charge Control The SLM500 module can charge the over-discharged battery. The charging process includes trickle charge, pre-charge, constant current, and constant-voltage charge. When the VBAT voltage is lower than 3.4V, the module is pre-charged; when VBAT is between 3.4V and 4.2V, it is charged by the constant current plus constant voltage method optimized for the lithium battery. At present, the software's charge cut-off voltage is 4.2V, and the back-off voltage is 4.05V. 4.10.3. BAT_CON_TEM The SLM500 module has battery temperature detection and can be implemented by BAT_THERM (134 PIN). This requires the internal integration of a 47K thermistor
(negative temperature coefficient) inside the battery to connect the thermistor to the BAT_THERM pin. During the charging process, the software reads the voltage of the BAT_THERM pin to determine if the battery temperature is too high. If the temperature is too high or too low, the battery will stop charging immediately to prevent battery damage. The battery charging connection diagram is shown below:
PM215 Figure 4.29: Charging circuit connection diagram 4.11 UIM Card Interface The SLM500 can support two SIM cards at the same time to achieve dual card dual standby. Support SIM card hot swap, can automatically recognize 1.8V and 3.0V cards. The figure SLM500 Hardware Design Guide Page 49 MeiG Smart product technical information below is the SIM recommended interface circuit. In order to protect the SIM card, it is recommended to use TVS devices for electrostatic protection. The device of the peripheral circuit of the SIM card should be close to the SIM card holder. The reference circuit is as follows:
SIM card moduler Figure 4.30: UIM card interface circuit 4.12. SD Card Interface SLM500 supports SD card interface. The reference circuit is as follows:
Figure 4.31: SD Card Interface Circuit SLM500 Hardware Design Guide Page 50 MeiG Smart product technical information 4.13 I2C Bus Interface The SLM500 module supports five hardware I2C bus interfaces include two camera-specific CCI interface. The pin definitions and default functions are as follows:
Table 4.11: I2C Interface Pin Description Name GPIO14_SENSOR_I2C4_SDA GPIO15_SENSOR_I2C4_SCL GPIO29_CAM_I2C_SDA0 GPIO30_CAM_I2C_SCL0 GPIO32_DCAM_I2C_SCL1 GPIO31_DCAM_I2C_SDA1 GPIO10_TP_I2C3_SDA GPIO11_TP_I2C3_SCL GPIO6 Pin 92 91 84 83 166 205 48 47 167 Default function Dedicated I2C for sensors only|( G-sensor, compass, gyroscope, etc.) Main Camera dedicated Depth Camera General purpose I2C, default for TP Universal I2C Note: To use the 2.2K pull-up resistor to 1.8V . Gpio14 / 15 can only be used to connect sensor devices in Qualcomm QVL, not other devices. 4.14 Analog to Digital Converter (ADC) The SLM500 module provides two MPP function signals from the power management chip: PWM29PIN and ADC128PIN, MPP can be configured as an ADC or PWM signal. The ADC signal is 16 bit resolution, and its performance parameters are as follows:
Table 4.12: ADC Performance Parameters Description Minimum Typical Maximum Input Voltage Range ADC Resolution Analog Input Bandwidth Sampling Frequency INL DNL Offset error Gain error
1.8
100 2.4
15
8 4 1 1 Unit V bits kHz MHz LSB LSB
4.15. PWM The PWM pin can be used as a backlight adjustment for the LCD to adjust the backlight brightness by adjusting the duty cycle. SLM500 Hardware Design Guide Page 51 MeiG Smart product technical information 4.16. Motor The SLM500 supports motor functions and can be implemented by the user via PM_VIB_DRV_N 28PIN. The reference schematic diagram is as follows. Note that the uF-level capacitor cannot be placed on the signal line. Figure 4.32: Motor interface circuit 4.17 Antenna Interface The module provides four antenna interfaces: MAIN antenna, DRX antenna, GPS antenna and WiFi/BT antenna. In order to ensure that the user's products have good wireless performance, the antenna selected by the user should meet the requirement that the input impedance is 50 ohms in the working frequency band and the VSWR is less than 2. 4.17.1 Main Antenna The module provides the MAIN antenna interface pin Pin1 RF_MAIN. The antenna on the user's main board should be connected to the antenna pin of the module using a 50-ohm characteristic microstrip line or strip line. In order to facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows:
Figure 4.34: MAIN Antenna Interface Connection Circuit SLM500 Hardware Design Guide Page 52 MeiG Smart product technical information In the figure, R101, C101, and C102 are antenna matching devices, and the specific component values can be determined after the antenna factory debugs the antenna. Among them, R101 defaults to 0R, C101 and C102 do not paste by default. If there are fewer components between the antenna and the module output, or if the RF test head is not needed in the design, the antenna matching circuit can be simplified as shown below:
Figure 4.35: MAIN Antenna Interface Simplified Connection Circuit In the above figure, R101 defaults to 0R, and C101 and C102 do not paste by default. 4.17.2 DRX Antenna The module provides the DRX antenna interface pin RF_DIV, and the antenna on the user's motherboard should be connected to the module's antenna pins using a 50-ohm characteristic microstrip or strip line. In order to facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows:
Figure 4.36: DRX Antenna Interface Connection Circuit In the figure, R102, C103, and C104 are antenna matching devices, and the specific component values can be determined after the antenna factory debugs the antenna. Among them, R102 defaults to 0R, C103 and C104 are not posted by default. SLM500 Hardware Design Guide Page 53 MeiG Smart product technical information If there are fewer components between the antenna and the module output, or if the RF test head is not needed in the design, the antenna matching circuit can be simplified as shown below:
Figure 4.37: DRX Antenna Interface Simplified Connection Circuit In the above figure, R102 defaults to 0R, C103 and C104 are not attached by default. 4.18.3 GPS Antenna The module provides the GNSS antenna pin RF_GPS. The antenna on the user's main board should be connected to the antenna pin of the module using a 50-ohm characteristic microstrip line or strip line. The LNA is integrated inside the module. To improve GNSS reception performance, customers can use external active antennas. The recommended circuit connections are as follows:
Figure 4.38: Connecting Active Antennas SLM500 Hardware Design Guide Page 54 MeiG Smart product technical information 4.18.4 WiFi/BT antenna The module provides the WiFi/BT antenna pin RF_WIFI/BT. The antenna on the user's motherboard should be connected to the antenna pin of the module using a 50 ohm microstrip line or strip line. In order to facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows:
Figure 4.40: WiFI_BT antenna interface connection circuit In the figure, R301, C301, and C302 are antenna matching devices, and the specific component values can be determined after the antenna factory debugs the antenna. Among them, R301 defaults to 0R, C301 and C302 do not paste by default. If there are fewer components between the antenna and the module output, or if the RF test head is not needed in the design, the antenna matching circuit can be simplified as shown below:
Figure 4.41: WIFI_BT antenna interface simplified connection circuit In the above figure, R301 defaults to 0R, and C301 and C302 do not paste by default. SLM500 Hardware Design Guide Page 55 MeiG Smart product technical information 5.PCB Layout The performance of a product depends largely on the PCB trace. As mentioned above, if the PCB layout is unreasonable, it may cause interference problems such as card loss. The way to solve these interferences is often to redesign the PCB. If you can plan a good PCB layout in the early stage, the PCB traces smoothly, saving a lot of time. Of course, it can also save a lot of costs. This chapter mainly introduces some things that users should pay attention to during the PCB layout stage, minimizing interference problems and shortening the user's development cycle. The SLM500 module is an intelligent module with its own Android operating system. It includes sensitive data lines such as high-speed USB and MIPI. It also has strict requirements on the length and impedance of the signal line. If the high-speed signal processing is not good, it will cause serious EMI. The problem, more serious will also affect the USB identification, LCD display, so the PCB design requirements when using the SLM500 module is much higher than the previous 2G module, please read this chapter carefully, reduce the subsequent hardware debugging cycle. When using the SLM500 module, the user is required to use at least 4 layers of via holes for the PCB to facilitate impedance control and signal line shielding. 5.1. Module PIN distribution Before the PCB layout, first understand the pin distribution of the module, and rationally layout the related devices and interfaces according to the distribution defined by the pin. Please refer to Figure 2 to determine the distribution of the function feet of the module. 5.2. PCB Layout Principles Several aspects of the main attention during the PCB layout phase:
5.2.1. Antenna Antenna part design, SLM758 module has a total of 4 antenna interfaces, they are:
ANT_MAIN, ANT_DRX, ANT_GNSS, ANT_WIFI. Pay attention to component placement and RF routing:
The RF test head is used to test the conducted RF performance and should be placed as close as possible to the antenna pins of the module. The antenna matching circuit needs to be placed close to the antenna end;
The connection between the antenna pin of the module and the antenna matching circuit SLM500 Hardware Design Guide Page 56 MeiG Smart product technical information must be controlled by 50 ohm impedance;
The device and wiring between the antenna pin and the antenna connector of the module must be away from high-speed signal lines and strong interference sources to avoid crossing or parallel with any signal lines in adjacent layers. The length of the RF cable between the antenna pin of the module and the antenna connector should be as short as possible. The situation of crossing the entire PCB should be absolutely avoided. If the antenna is connected by a coaxial RF line, care should be taken to avoid the coaxial RF line spanning the SIM card, power supply circuit, and high-speed digital circuits to minimize the effects of each other. 5.2.2 Power Supply Power traces must consider not only VBAT, but also the return GND of the power supply. The trace of the VBAT positive must be short and thick, the trace must first pass through the large capacitor, Zener diode and then the power PIN of the module. There are multiple PAD exposed copper at the bottom of the module. Make sure that the GND path of these exposed copper areas to the power supply is the shortest and smoothest. This ensures that the current path of the entire power supply is the shortest and the interference is minimal. 5.2.3. SIM Card The SIM card has a large area and does not have an anti-EMI interference device. It is relatively susceptible to interference. Therefore, in the layout, first ensure that the SIM card is away from the antenna and the antenna extension cable inside the product. Place it as close as possible to the module. When the PCB is routed, pay attention to it. The SIM_CLK signal is protected, and the SIM_DATA, SIM_RST, and SIM_VDD signals of the SIM card are away from the power source and away from the high-speed signal line. If the processing is not easy, it may cause problems such as not knowing the card or dropping the card. Therefore, please follow the following principles when designing:
-speed signal lines, and the SIM card should not be too long;
module to make the GND equipotential between the two. SIM_CLK. card holder;
to place a 100nF capacitor on the SIM_VDD signal line near the SIM exceed 50pF, and the 51 resistor in series with the module can enhance ESD protection. The SIM card signal line increases the capacitance of 22pF to ground to prevent radio SLM500 Hardware Design Guide Page 57 MeiG Smart product technical information frequency interference. path of VBAT as much as possible. 5.2.4. MIPI MIPI is a high-speed signal line. Users must pay attention to protection during the layout stage, so that they are away from the signal lines that are easily interfered. The GND processing must be performed on the upper and lower sides, and the traces are differential pairs. 100 ohm differential impedance matching is performed. Ensure impedance consistency and do not bridge different GND planes as much as possible. The MIPI interface selects a small-capacity TVS when selecting an ESD device. It is recommended that the parasitic capacitance be less than 1pF. The MIPI routing requirements are as follows:
The total length of the cable does not exceed 305mm It is required to control 100 ohm differential impedance with an error of 10%. The error of the differential line length within the group is controlled within 1mm. The length error between groups is controlled within 2 mm. 5.2.5. USB The module supports high-speed USB interface at a rate of 480Mbps. The user recommends adding a common-mode inductor during the schematic design phase to effectively suppress EMI interference. If you need to increase the static protection, please select a TVS tube with a parasitic capacitance of less than 1pF. Please refer to the following notes when planning Layout:
g function, please note that the VBUS cable is as wide as possible. Table 5.1: Internal USB cable length of the module Pin 14 13 Signal Length mm) Length ErrorP-N USB_HS_DP USB_HS_DM 33.0 33.3 0.3mm 5.2.6.Audio The module supports 3 analog audio signals. Analog signals are susceptible to interference from high speed digital signals. So stay away from high-speed digital signal lines. The module supports the GSM system, and the GSM signal can interfere with the audio by coupling and conduction. Users can add 33pF and 10pF capacitors to the audio path to filter out coupling interference. The 33pF capacitor mainly filters out the interference of the GSM850/EGSM900 SLM500 Hardware Design Guide Page 58 MeiG Smart product technical information band, and the 10pF capacitor mainly filters out the interference of the DCS1800 band. The coupling interference of TDD has a great relationship with the PCB design of the user. In some cases, the TDD of the GSM850/EGSM900 frequency band is more serious, and in some cases, the TDD interference of the DCS1800 frequency band is more serious. Therefore, the user can select the required filter capacitor according to the actual test result, and sometimes even do not need to paste the filter capacitor. The GSM antenna is the main source of coupling interference for TDD, so users should pay attention to keeping the audio trace away from the GSM antenna and VBAT during PCB layout and routing. The filter capacitor of the audio is preferably placed close to the module end and placed next to the interface end. The audio output should be routed according to the differential signal rules. The conducted interference is mainly caused by the voltage drop of VBAT. If the Audio PA is directly powered by VBAT, it is easier to hear the zizi sound at the SPK output. Therefore, it is better to connect in parallel with the input of the Audio PA in the schematic design. Some large capacitance capacitors and series magnetic beads. The conducted interference is also strongly related to TDD and GND. If GND is not handled well, many high-frequency interference signals will interfere with MIC and Speaker through devices such as bypass capacitors, so users should ensure good performance of GND during PCB design. 5.2.7. Other Because the outer ring pad of the module is designed with stamp hole, it is necessary to expand the pad to enhance the tin climbing ability when making the SMD steel mesh. Therefore, a sufficient safety distance should be reserved between the module pad and other main board devices. The recommended safe distance is 3mm, as shown in the following figure:
SLM500 Hardware Design Guide Page 59 MeiG Smart product technical information SLM500 Hardware Design Guide Page 60 MeiG Smart product technical information 6. Electrical, Reliability 6.1 Absolute Maximum The table below shows the absolute maximum values that the module can withstand. Exceeding these limits can cause permanent damage to the module. Table 6.2: Absolute Maximum Parameter Minimum Typical Maximum Unit
10.5 6 3 75 90 4.2 6
VBAT VBUS Peak current
6.2 Working Temperature The table below shows the operating temperature range of the module:
Table 6.2: Module Operating Temperature Parameter Minimum Typical Maximum Working temperature Storage temperature
-25
-40 6.3 Working Voltage Table 6.3: Module Operating Voltage Parameter Minimum Typical Maximum Unit VBAT VBUS Hardware shutdown voltage 3.4 4 2.5 5 2.8 6.4 Digital Interface Features Table 6.4: Digital Interface Features (1.8V) Parameter Description Minimum Typical Maximum Unit VIH VIL VOH VOL Input high level voltage Input low level voltage Output high level voltage Output low level voltage 1.17 1.35
0.63
0.45 SLM500 Hardware Design Guide Page 61 Unit V V A V V V V V V V MeiG Smart product technical information 6.5 SIM_VDD Characteristics Table 6.5: SIM_VDD Characteristics Parameter Description Minimum Typical Maximum Unit VO IO Output voltage Output current
3 1.8
55 6.6 PWRKEY Feature Table 6.6: PWRKEY Characteristics Parameter Description Minimum Typical Maximum Unit PWRKEY High level Low level 1.4
Effective time 2000
0.6 6.7 VCOIN Feature Table 6.7: VCOIN Characteristics Parameter Description Minimum Typical Maximum Unit VCOIN-IN IRTC-IN VCOIN-OUT IRTC-OUT VCOIN input voltage VCOIN Current consumption VCOIN Output voltage VCOIN Output current 2
3 3 3.25 3
2 6.8 Current Consumption (VBAT = 3.8V) Table 6.8: Current consumption Parameter Descriptio n VBAT voltage Condition Voltage must be between the maximum and minimum values Ivbat Average Shutdown mode Minimu m Typical Maximu m 3.4
3.8
4.2 65 Unit V uA SLM500 Hardware Design Guide Page 62 V mA V V ms V uA V mA MeiG Smart product technical information current GSM Standby power consumption WCDMA Standby power consumption TD-S Standby power consumption CDMA Standby power consumption FDD Standby power consumption TDD Standby power consumption GSM900 CH62 32dBm GPRS GSM900 CH62 PCL5 1DL 4UL EGPRS GSM900 CH62 PCL8 1DL 4UL Power control at maximum output power Call Current consumpt ion Digital transmissi on Peak current
4.0 3.9 4.0 3.8 4.45 3.5 250 mA mA mA mA mA mA mA TBD mA TBD mA 3 A WCDMA2100 CH10700 22.5 dBm 550 mA Imax 6.9 Electrostatic Protection The module is not specifically protected against electrostatic discharge. Therefore, users must pay attention to electrostatic protection when producing, assembling, and operating modules. 6.10 Module Operating Frequency Band The table below lists the operating frequency bands of the module and complies with the 3GPP TS 05.05 technical specification. Table 6.9: Module Operating Band Frequency band Receive Transmission Physical channel GSM850 EGSM900 DCS1800 869 894MHz 824 849MHz 128~251 925 960MHz 880 915MHz 0~124975~1023 1805 1880MHz 1710 1785MHz 512~885 WCDMA B1 2110 2170 MHz 1920 1980 MHz WCDMA B5 869894MHz 824849MHz WCDMA B8 880915MHz 925960MHz TX: 9612~9888 RX: 10562~10838 TX: 4132~4233 RX: 4357~4458 TX: 2712~2863 RX: 2937~3088 CDMA BC0 869894MHz 824849MHz 1799 9911023 TDSCDMA 1.9G 18801920 MHz 18801920MHz 94009600 TDSCDMA 2G 20102025 MHz 20102025MHz 1005410121 SLM500 Hardware Design Guide Page 63 MeiG Smart product technical information LTE B1 21102170 MHz 19201980 MHz LTE B3 18051880 MHz 17101785 MHz LTE B5 869894MHz 824849MHz LTE B8 925960MHz 880915MHz TX: 1800018599 RX: 0~599 TX: 19200~19949 RX: 1200~1949 TX: 2040020649 RX: 2400~2649 TX: 2145021799 RX: 3450~3799 LTE B34 LTE B38 LTE B39 LTE B40 LTE B41 20102025 MHz 20102025 MHz 3620036349 25702620 MHz 25702620 MHz 3775038249 18801920 MHz 18801920 MHz 3825038649 23002400 MHz 23002400 MHz 3865039649 24962690 MHz 24962690 MHz 3965041589 Note: The SLM500Q's LTE TDD B41 band bandwidth is 100MHz (2555 ~ 2655 MHz), the channel is 40240 ~ 41240. 6.11 RF Characteristics The following table lists the conducted RF output power of the module, in accordance with 3GPP TS 05.05 technical specification, 3GPP TS 134121-1 standard. Table 6.10: Conducted Output Power Frequency band GSM850EGSM900 Standard output power
(dBm) Output power tolerance (dBm) DCS1800 WCDMA CDMABC0 TDSCDMA LTE 33dBm 30dBm 24 dBm 25 dBm 24 dBm 23 dBm 2 2
+1/-3 2
+1/-3 2.7 6.12 Module Conduction Receiving Sensitivity The table below lists the conducted receive sensitivity of the module and is tested under static conditions. Table 6.11: Conducted Receive Sensitivity Frequency band GSM850EGSM900 DCS1800 WCDMAB1 Receive sensitivity
(typical) Receive sensitivity (maximum)
<-108dBm
<-108dBm
<-109 dBm 3GPPrequirements 3GPPrequirements 3GPPrequirements SLM500 Hardware Design Guide Page 64 MeiG Smart product technical information WCDMAB5 CDMABC0 TDSCDMA1.9G TDSCDMA2G
<-109 dBm
<-110 dBm
<-110 dBm
<-110 dBm 3GPPrequirements 3GPPrequirements 3GPPrequirements 3GPPrequirements LTEFDD/TDD See Table 6.12 3GPPrequirements Table 6.12: LTE Reference Sensitivity 3GPP Dual Antenna Requirements (QPSK) 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz Duplex mode E-UTRA Frequenc y band number 1 2 3 4 5 6 7 8 9 10 11 12 13 14
... 17 18 19 20 21 22 23 24 25 26 27 28 31
... 33 34 35 36
-102.7
-101.7
-104.7
-103.2
-102.2
-101.7
-104.7
-101.2
-102.7
-103.2
-99.0
-106.2
-106.2
-99.7
-98.7
-101.7
-100.2
-99.2
-98.7
-101.7
-98.2
-99.7
-100.2
-100.2
-95.7
-102.2
-102.2
-100
-98
-97
-100
-98
-100
-98
-97
-99
-100
-100
-97
-97
-97
-97
-1007
-100
-97
-100
-97
-100
-100
-96.5
-97.56
-98
-98.5
-93.5
-100
-100
-100
-100
-97
-95
-94
-97
-95
-97
-95
-94
-96
-97
-97
-94
-94
-94
-94
-977
-97
-94
-97
-94
-97
-97
-93.5
-94.56
-95
-95.5
-97
-97
-97
-97
-95.2
-93.2
-92.2
-95.2
-93.2
-94.2
-95.2
-95.27
-95.2
-91.2
-95.2
-92.2
-95.2
-91.7
-92.76
-93.7
-95.2
-95.2
-95.2
-95.2
-94
-92
-91
-94
-92
-93
-94
-90
-91
-94
-90.5
-91
-94
-94
-94 FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD TDD TDD TDD TDD SLM500 Hardware Design Guide Page 65 MeiG Smart product technical information 37 38 39 40 41
-100
-100
-100
-100
-98
-97
-97
-97
-97
-95
-95.2
-95.2
-95.2
-95.2
-93.2
-94
-94
-94
-94
-92 TDD TDD TDD TDD TDD 6.13 WIFI Main RF Performance The table below lists the main RF performance under WIFI conduction. Table 6.13: Main RF performance parameters under WIFI conduction Transmission performance (2.4G) 802.11B 802.11G 802.11N Transmit power (minimum rate) Transmit power (maximum rate) EVM (maximum rate) 20%
Receiving performance (2.4G) Receiving sensitivity 802.11B 802.11G 802.11N Minimum rate Maximum rate Transmission performance(5G) 802.11a 802.11n 802.11a Transmit power (minimum rate) Transmit power (maximum rate) EVM (maximum rate) 20%
Receiving performance(5G) Receiving sensitivity 802.11a 802.11n 18 18
-92
-89 17 17
-91
-74 18 14.5
-27
-91
-74.5 17 15
-27
-90
-71 18 13
-30
-90
-72.5 dBm dBm dB dBm dBm dBm dBm dB dBm dBm 17 17 20%
802.11a
-91
-74 Minimum rate Maximum rate SLM500 Hardware Design Guide Page 66 MeiG Smart product technical information 6.14 BT Main RF Prformance The table below lists the main RF performance under BT conduction. Table 6.14: Main RF performance parameters under BT conduction Transmit power Receiving sensitivity Transmission performance DH5 14 DH5
-94.5 2DH5 14 2DH5
-94.5 3DH5 14 3DH5
-86 Receiving performance dBm dBm 6.15 GNSS Main RF Performance The table below lists the main RF performance under GNSS conduction. Table 6.15: Main RF performance parameters under GNSS conduction GNSS working frequency band: 1575.42MHZ GNSS carrier-to-noise ratio CN0: 40dB/Hz GNSS sensitivity:
GNSS startup time Capture (cold start) Capture (hot start)
-148
-156 Track
-160 Hot start Warm start Cold start 5 10 38 dBm S SLM500 Hardware Design Guide Page 67 MeiG Smart product technical information 7. Production 7.1. Top And Bottom Views Of The Module Figure 48: Module top and bottom views SLM500 Hardware Design Guide Page 68 MeiG Smart product technical information 7.2. Recommended Soldering Furnace Temperature Curve Figure 49: Module recommended soldering furnace temperature curve 7.3. Humidity Sensitivity (MSL) The SLM500 module meets moisture sensitivity level 3. The dry package is subjected to the J-STD-020C specification in accordance with the IPC/JEDEC standard under ambient conditions of temperature <30 degrees and relative humidity <60%. Under ambient conditions of temperature <40 degrees and relative humidity <90%, the shelf life is at least 6 months without unpacking. After unpacking, Table 22 lists the shelf life of the modules for different moisture sensitivity levels. Table 7.1: Humidity sensitivity level distinction Grade 1 2 2a 3 4 5 5a 6 Factory environment+30/60%RH Indefinite quality in the environment+30/85% RH Under conditions 1 year 4 weeks 168 hours 72 hours 48 hours 24 hours Use it after forced baking. After baking, the module must be patched within the SLM500 Hardware Design Guide Page 69 MeiG Smart product technical information time limit specified on the label. After unpacking, the SMT patch should be taken within 168 hours under ambient conditions of <30 degrees and relative humidity <60%. If the above conditions are not met, baking is required. Note: Oxidation risk: Baking SMD packages can cause metal oxidation and, if excessive, can cause solderability problems during board assembly. The temperature and time of the SMD package are baked, thus limiting solderability considerations. The accumulation of baking time should be no more than 96 hours at temperatures above 90C and as high as 125C 7.4. Baking Requirements Due to the humidity sensitivity of the module, the SLM500 should be thoroughly baked prior to reflow soldering, otherwise the module may cause permanent damage during reflow soldering. The SLM500 should be baked for 192 hours in a cryogenic vessel at 40C +5C/-
0C and a relative humidity of less than 5%, or in a high temperature vessel at 80C5C.Bake for 72 hours. Users should note that the tray is not resistant to high temperatures. The user should take the module out of the tray for baking, otherwise the tray may be damaged by high temperature. Table 7.2: Baking requirements:
Baking temperature Humidity Baking time 40C5C 120C5C
<5%
<5%
192 hours 4 hours SLM500 Hardware Design Guide Page 70 MeiG Smart product technical information 8. Support Peripheral Device List Table 8.1: List of supported display models Vendor Drive IC ILITEK ILI9881P Table 8.2: Support for Camera Model List Table 8.3: Support for touch screen model list Vendor Table 8.4: Support for G Sensor Model List Vendor Table 8.5: Support for Ecompass Model List Vendor Vendor Sunny optical Sunny optical Sunny optical GOODIX Bosch GMEMS Drive IC S5K3M2XX S5K4H7 S5K5E8 Drive IC GT5688 Model BMI120 Model GMC303 Model Table 8.6: Support PS/ALS Sensor Model List Vendor LITEON LTR-553ALS-01 Table 8.7: Support for Gyro Sensor Model List Vendor Bosch Model BMI120 Specification 9-axis,16bit/16bit Specification 1280x720 Specification 13M 8M 5M Specification 5"
Specification 9-axis,16bit/16bit Specification 3-Axis,14-bit Specification ALS+PS SLM500 Hardware Design Guide Page 71 MeiG Smart product technical information 9. Appendix 9.1. Related Documents Table 9.1: Related documents File name Comment Serial numb er
[1]
[2]
GSM 07.07 Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) GSM 07.10 Support GSM 07.10 multiplexing protocol
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GSM 07.05
[4]
GSM 11.14 Digital cellular telecommunications(Phase 2+); Use of Data Terminal EquipmentData Circuit terminating Equipment(DTEDCE) interface for Short Message service(SMS)and Cell Broadcast Service(CBS) Digital cellular telecommunications system (Phase 2+);Specification of the SIM Application Toolkit for the Subscriber Identity ModuleMobile Equipment
(SIMME) interface
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GSM 11.11 Digital cellular telecommunications system (Phase 2+);Specification of the Subscriber Identity Module Mobile Equipment (SIMME) interface
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GSM 03.38 Digital cellular telecommunications system (Phase 2+); Alphabets and language-
specific information
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GSM 11.10 Digital cellular telecommunications system (Phase 2)Mobile Station (MS) conformance specificationPart 1Conformance specification
[8]
AN_Serial Port AN_Serial Port 9.2. Terms And Explanations Table 9.2: Terms and explanations Terms ADC AMR CS CSD CTS DTE DTR DTX EFR EGSM ESD ETS FR GPRS GSM HR Explanations Analog-to-Digital Converter Adaptive Multi-Rate Coding Scheme Circuit Switched Data Clear to Send Data Terminal Equipment (typically computer, terminal, printer) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSM Electrostatic Discharge European Telecommunication Standard Full Rate General Packet Radio Service Global Standard for Mobile Communications Half Rate SLM500 Hardware Design Guide Page 72 MeiG Smart product technical information IMEI Li-ion MO MS MT PAP PBCCH PCB PCL PCS PDU PPP RF RMS RX SIM SMS TDD TE TX UART URC USSD Phone book abbreviation FD LD MC ON RC SM NC International Mobile Equipment Identity Lithium-Ion Mobile Originated Mobile Station (GSM engine), also referred to as TE Mobile Terminated Password Authentication Protocol Packet Broadcast Control Channel Printed Circuit Board Power Control Level Personal Communication System, also referred to as GSM 1900 Protocol Data Unit Point-to-point protocol Radio Frequency Root Mean Square (value) Receive Direction Subscriber Identification Module Short Message Service Time Division Distortion Terminal Equipment, also referred to as DTE Transmit Direction Universal Asynchronous Receiver & Transmitter Unsolicited Result Code Unstructured Supplementary Service Data Explanations SIM fix dialing phonebook SIM last dialing phonebook (list of numbers most recently dialed) Mobile Equipment list of unanswered MT calls (missed calls) SIM (or ME) own numbers (MSISDNs) list Mobile Equipment list of received calls SIM phonebook Not connect OEM requirement and guidance for host manufactures The module is limited to OEM installation ONLY The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. In case that FCC identification number and IC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:
Contains FCC ID: 2APJ4-SLM500 and Contains IC: 23860-SLM500 Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturers instructions as described in the user documentation that comes with the product. This device is intended only for OEM integrators under the followingconditions:1) The antenna must be installed such that 20 cm is maintained between the antenna and user.2) The transmitter module may not be co-
located with any other transmitter or antenna. SLM500 Hardware Design Guide Page 73 MeiG Smart product technical information Please take attention that changes or modification not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired operation. This equipment complies with FCC/IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radioexempts de licence. L'exploitation est autorise aux deux conditions suivantes :
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformment la rglementation d'Industrie Canada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par Industrie Canada. Dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. This equipment complies with FCC/IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. ce matriel est conforme aux limites de dose d'exposition aux rayonnements, FCC / CNR-102 nonce dans un autre environnement.cette eqipment devrait tre install et exploit avec distance minimale de 20 entre le radiateur et votre corps. The user manual for local area network devices shall contain instructions related to the restrictions mentioned in the above sections, namely that:
(i) the device for operation in the band 5150-5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;
(ii) the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall comply with the e.i.r.p. limit; and
(iii) the maximum antenna gain permitted for devices in the band 5725-5825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate.
(i)Les dispositifs fonctionnant dans la bande 5150-5250 MHz sont rservs uniquement pour une utilisation l'intrieur afin de rduire les risques de brouillage prjudiciable aux systmes de satellites mobiles utilisant les mmes canaux. SLM500 Hardware Design Guide Page 74 MeiG Smart product technical information
(ii) le gain d'antenne maximal autoris pour les appareils dans les bandes 5250-5350 MHz et 5470-5725 MHz doivent respecter le pire limiter; et
(iii) le gain d'antenne maximal autoris pour les appareils dans la bande 5725-5825 MHz doivent respecter le pire limites spcifies pour le point--point et l'exploitation non point point, le cas chant. Users should also be advised that high-power radars are allocated as primary users (i.e. priority users) of the bands 5250-5350 MHz and 5650-5850 MHz and that these radars could cause interference and/or damage to LE-LAN devices. Les utilisateurs de radars de haute puissance sont dsigns utilisateurs principaux (c.--d., qu'ils ont la priorit) pour les bandes 5250-5350 MHz et 5650-5850 MHz et que ces radars pourraient causer du brouillage et/ou des dommages aux dispositifs LAN-EL. EU Conformity Statement This product is marked with "CE" and comply therefore with the applicable harmonized European standards listed under the Radio Equipment Directive 2014/53/EU. RF Exposure Information This device has been tested and meets applicable limits for Radio Frequency (RF) exposure. The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range. BE BG CZ DK NO EE IE EL ES IS HR LU PL FI CH IT HU PT SE TR CY MT RO DE UK(NI) LV NL SI FR LT AT SK LI
(1) Operational use conditions
***if your module has professional users use condition limitations, please keep below sentence here Module has professional users use condition limitations, Host product manufacturer please ensure giving such warning like Product is limited to professional users use in your products instruction.
(2) Antenna used Antenna Type Brand/ manufacturer Shanghai Jesoncom Dipole Communication Engineering Co., Ltd Model No. 5Q004D Max. Antenna Gain 1dBi Xxx Xxx
(3)Notice to Host Product Manufacturer Any deviation(s) from the defined parameters of the antenna trace, as described by this instruction, host product manufacturer must notify us that you wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by us, or you (host manufacturer) can take responsibility through the change in FCC ID and IC ID (new application) procedure followed by a Class II permissive change application. SLM500 Hardware Design Guide Page 75 MeiG Smart product technical information
(4)Labelling Instruction for Host Product Integrator Please notice that if the FCC and IC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC ID: 2APJ4-SLM500 and Contains IC: 23860-SLM500 any similar wording that expresses the same meaning may be used. 15.19 and RSS-Gen Labelling requirements shall be complied on end user device. Labelling rules for special device, please refer to 2.925, 15.19 (a)(5) and relevant KDB publications. For E-label, please refer to 2.935.
(5)Installation Notice to Host Product Manufacturer The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile application, a separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and difference antenna configurations.
(6)Antenna Change Notice to Host manufacturer If you desire to increase antenna gain and either change antenna type or use same antenna type certified, a Class II permissive change application is required to be filed by us, or you (host manufacturer) can take responsibility through the change in FCC ID and IC ID (new application) procedure followed by a Class II permissive change application.
(7)FCC other Parts, Part 15B Compliance Requirements for Host product manufacturer This modular transmitter is only FCC authorized for the specific rule parts listed on our grant, host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. Host manufacturer in any case shall ensure host product which is installed and operating with the module is in compliant with Part 15B requirements. Please note that For a Class B or Class A digital device or peripheral, the instructions furnished the user manual of the end-user product shall include statement set out in 15.105 Information to the user or such similar statement and place it in a prominent location in the text of host product manual. Original texts as following:
For Class B Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Note: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. For Class A SLM500 Hardware Design Guide Page 76 MeiG Smart product technical information 9.3. Multiplexing function Table 9.3: Multiplexing Functions GPIO Module pin Reuse function 0 1 4 5 6 7 10 11 12 13 14 15 16 17 18 19 20 21 22 23 85 86 87 88 154 153 94 93 167 168 48 47 101 102 92 91 34 35 36 37 119 118 117 116 265 239 105 264 SPI MOSI MISO CS_N CLK CS_N CLK MOSI MISO CS_N CLK MOSI MISO CS_N CLK MOSI MISO CS_N CLK MOSI MISO CS_N CLK UART TX RX TX RX CTS RTS TX RX CTS RTS TX RX CTS RTS I2C SDA SCL SDA SCL SDA SCL SDA SCL SDA SCL Note: Blue is the default function 9.4. Safety Warning Pay attention to the following safety precautions when using or repairing any terminal or mobile phone that contains modules. The user should be informed of the following safety information on the terminal device. Otherwise, Meig will not be responsible for any consequences caused by the user not following these warning actions. SLM500 Hardware Design Guide Page 77 MeiG Smart product technical information Table 9.4: Security Warnings Identification Claim When you are at a hospital or medical facility, observe the restrictions on using your phone. If necessary, please turn off the terminal or mobile phone, otherwise the medical device may malfunction due to radio frequency interference. Turn off the wireless terminal or mobile phone before boarding. To prevent interference with the communication system, wireless communication equipment is prohibited on the aircraft. Ignoring the above will violate local laws and may result in a flight accident. Do not use mobile terminals or mobile phones in front of flammable gases. Turn off the mobile terminal when you are near an explosion, chemical factory, fuel depot, or gas station. It is dangerous to operate a mobile terminal next to any potentially explosive electrical equipment. The mobile terminal receives or transmits radio frequency energy when it is turned on. It can interfere with TV, radio, computer or other electrical equipment. Road safety first! Do not use a handheld terminal or mobile phone while driving, please use a hands-free device. Stop before using your handheld terminal or mobile phone. GSM mobile terminals operate under RF signals and cellular networks, but are not guaranteed to be connected in all situations. For example, there is no credit or invalid SIM card. When in this situation and need emergency services, remember to use an emergency call. In order to be able to call and receive calls, the mobile terminal must be powered on and in a service area where the mobile signal is strong enough. Emergency calls are not allowed when certain network services or telephony features are in use, such as feature locks, keyboard locks. These functions should be removed before using an emergency call. Some networks require effective SIM card support. MeiG Technology Technology Co., Ltd. Add: 5 / F, block g, Weijing center, 2337 Gudai Road, Minhang District, Shanghai Zip:200233 Tel: +86-21-54278676 Fax: +86-21-54278679 http://www.meigsmart.com SLM500 Hardware Design Guide Page 78