Technical data of meige intelligent products SLM500S Hardware Design Manual Released Date: 2022/08 File name: SLM500S Hardware Design Manual Version Number: V1.06 Company: MeiG Smart Technology Co., Ltd 0 / 62 SLM500S Hardware Design Guide IMPORTANT NOTICE COPYRIGHT NOTICE Copyright: MeiG Intelligent Technology Co., Ltd. All contents of this manual are exclusively owned by MeiG Smart Technology Co., Ltd(MeiG laws in Smart for short), which is under the protection of Chinese laws and copyright international conventions. Anyone shall not copy, spread, distribute, modify or use its content in other ways without the written authorization of MeiG Smart. Those who violated will be investigated by corresponding legal liability in accordance with the law. NON-GUARANTEE MeiG Smart makes no representations or warranties, either express or implied, for any content in this document, and will not be liable for any specific merchantability and applicable or any indirect, particular and collateral damage. CONFIDENTIALITY All information contained in the document (including any attachments) is confidential. The recipient is aware that this document is confidential except for specific purposes and that the document shall not be disclosed to third parties. DISCLAIMER MeiG Smart will not take any responsibility for any property and health damage caused by the abnormal operation of customers. Please develop the product according to the technical specification and design reference guidance defined in the product manual. MeiG Smart has the right to modify the document according to technical requirement without announcement to the customer. MeiG Intelligent Product Technical Data 1 / 62 SLM500S Hardware Design Guide Security Warning Pay attention to the following security precautions in the process of using or repairing any terminal or mobile phone. Terminal devices should be informed of the following security information. Otherwise, MeiG will not bear any consequences that the user does not follow these warning operations. Logo Requirement When you are at a hospital or medical facility, observe the restrictions on using your phone. If necessary, please turn off the terminal or mobile phone, otherwise the medical device may malfunction due to radio frequency interference. Turn off the wireless terminal or mobile phone before boarding. To prevent interference with the communication system, wireless communication equipment is prohibited on the aircraft. Ignoring the above will violate local laws and may result in a flight accident. Do not use mobile terminals or mobile phones in front of flammable gases. Turn off the mobile terminal when you are near an explosion, chemical factory, fuel depot, or gas station. It is dangerous to operate a mobile terminal next to any potentially explosive electrical equipment. The mobile terminal receives or transmits radio frequency energy when it is turned on. It can interfere with TV, radio, computer or other electrical equipment. Road safety first! Do not use a handheld terminal or mobile phone while driving, please use a hands-free device. Stop before using your handheld terminal or mobile phone. GSM mobile terminals operate under RF signals and cellular networks, but are not guaranteed to be connected in all situations. For example, there is no credit or invalid SIM card. When in this situation and need emergency services, remember to use an emergency call. In order to be able to call and receive calls, the mobile terminal must be powered on and in a service area where the mobile signal is strong enough. Emergency calls are not allowed when certain network services or telephony features are in use, such as feature locks, keyboard locks. These functions should be removed before using an emergency call. Some networks require effective SIM card support. MeiG Intelligent Product Technical Data 2 / 62 SLM500S Hardware Design Guide SLM500S Hardware Design Manual_V1.06 MeiG Intelligent Product Technical Data 3 / 62 SLM500S Hardware Design Guide Foreword Thank you for using the SLM500S module from Meg Smart. This product can provide data communication services. Please read the user manual carefully before use, you will appreciate its perfect function and simple operation method. The company does not assume responsibility for property damage or personal injury caused by improper operation of the user. Users are requested to develop the corresponding products according to the technical specifications and reference designs in the manual. Also pay attention to the general safety issues that mobile products should focus on. Before the announcement, the company has the right to modify the contents of this manual according to the needs of technological development. MeiG Intelligent Product Technical Data 4 / 62 SLM500S Hardware Design Guide Contents 1. Introduction ................................................................................................................................................ 8 2. Module Overview ........................................................................................................................................9 2.1.Summary of Features ......................................................................................................................... 9 2.2.Block Diagram ...................................................................................................................................11 3.Module Package ........................................................................................................................................ 12 3.1.Pin Distribution Diagram ...................................................................................................................12 3.2.Module Pin Description .....................................................................................................................13 3.3.Mechanical Dimensions ................................................................................................................... 23 4.Interface Application .................................................................................................................................25 4.1.Power Supply ....................................................................................................................................25 4.1.1.Power Pin ............................................................................................................................... 26 4.2.Power On/Off .................................................................................................................................... 26 4.2.1.Power On ................................................................................................................................26 4.2.2.Module Shutdown .................................................................................................................. 27 4.2.3.Module Reset ......................................................................................................................... 28 4.3.VCOIN ...............................................................................................................................................28 4.4.Power Output ....................................................................................................................................29 4.5.Serial Port ......................................................................................................................................... 30 4.6.MIPI Interface ................................................................................................................................... 32 4.6.1.LCD Interface ........................................................................................................................ 32 4.6.2.MIPI Camera Interface ........................................................................................................... 33 4.7.Capacitive Touch Interface ............................................................................................................... 36 4.8.Audio Interface ..................................................................................................................................37 4.8.1.Receiver Interface Circuit .......................................................................................................38 4.8.2.Microphone Receiving Circuit ................................................................................................ 38 4.8.3.Headphone Interface Circuit .................................................................................................. 39 4.8.4.Speaker Interface Circuit ....................................................................................................... 39 4.8.5 SPI Interface ..........................................................................................................................40 4.9.USB Interface .................................................................................................................................. 40 4.9.1.USB OTG ............................................................................................................................... 41 4.10.Charging Interface .......................................................................................................................... 42 4.10.1.Charging Detection .............................................................................................................. 43 4.10.2.Charge Control ..................................................................................................................... 43 4.10.3.BAT_THERM ........................................................................................................................43 4.11.UIM Interface ...................................................................................................................................43 4.12.SD Interface ....................................................................................................................................44 4.13.I2C Bus Interface ............................................................................................................................45 4.14.ADC .................................................................................................................................................45 4.15.PWM ............................................................................................................................................... 45 4.16.MOTOR ...........................................................................................................................................45 4.17. Antenna Interface .......................................................................................................................... 46 4.17.1.Main Antenna ....................................................................................................................... 46 4.17.2.DRX Antenna ........................................................................................................................47 4.17.3.GPS Antenna ........................................................................................................................48 4.17.4.WiFi/BT Antenna .................................................................................................................. 48 5.Electrical, Reliability ................................................................................................................................. 50 5.1.Absolute Maximum ........................................................................................................................... 50 MeiG Intelligent Product Technical Data 5 / 62 SLM500S Hardware Design Guide 5.2.Working Temperature ....................................................................................................................... 50 5.3.Working Voltage ................................................................................................................................50 5.4.Digital Interface Features ................................................................................................................. 51 5.5.SIM_VDD Features .......................................................................................................................... 51 5.6.PWRKEY Features ........................................................................................................................... 51 5.7.VCOIN Features ............................................................................................................................... 51 5.8.ConsumptionVBAT=3.8V .......................................................................................................... 52 5.9.Electrostatic Protection .....................................................................................................................52 5.10.Module Operating Frequency Band ............................................................................................... 52 5.11.RF Characteristics .......................................................................................................................... 53 5.12.Module Conduction Receiving Sensitivity ......................................................................................54 5.13.WIFI Main RF Performance ............................................................................................................55 5.14.BT Main RF Performance ...............................................................................................................56 5.15.Main RF Performance of GNSS .....................................................................................................56 6.Production ................................................................................................................................................. 57 6.1.Top and Bottom Views of Modules ...................................................................................................57 6.2.Recommended Welding Furnace Temperature Curve .................................................................... 57 6.3.Humidity Sensitive Characteristic (MSL) ......................................................................................... 57 6.4.Baking Requirements ....................................................................................................................... 58 7.Appendix .................................................................................................................................................... 59 7.1.The related documents .....................................................................................................................59 7.2.Terminology and Interpretation .........................................................................................................59 MeiG Intelligent Product Technical Data 6 / 62 SLM500S Hardware Design Guide Version History Time Revision Change Description 2020-3-14 2020-5-19 2020-6-22 1.00 1.01 1.02 2020-10-26 1.03 2021-1-18 2021-8-5 2022-08-26 1.04 1.05 1.06 Initial establishment Update the content Add MIC and earphone design instructions Update module 3D dimension diagram and recommended PCB package dimension diagram, increase pin interval size. Added 7.5 Packaging Information NTC resistance changed from 47K to 10K;
Update ADC Description Changing PIN Definitions Overall content modification Author Hardware Department Hardware Department Hardware Department Hardware Department Hardware Department Hardware Department Hardware Department MeiG Intelligent Product Technical Data 7 / 62 SLM500S Hardware Design Guide 1. Introduction This document describes the hardware application interfaces of including circuit connections and radio frequency interfaces. This helps users quickly learn about the interface definition, electrical performance, and structural dimensions of the module. Combining this document with other application documents, customers can quickly design various mobile communication solutions and provide more perfect solutions for end users. the module, Meige Smart 8 / 62 SLM500S Hardware Design Guide 2. Module Overview The SLM500S module uses a quad-core base band processor based on ARM Cotex-A53. The main frequency is up to 1.4GHz, and the memory supports single-channel 32-bit LPDDR3/667MHz. The chip can support TD-LTE/FDD-LTE/WCDMA/GSM and other systems. The SLM500S module supports the following operating frequency bands TDD-LTE: B34/38/39/40/41 FDD-LTE: B1/3/5/7/8/20 WCDMA: B1/B5/B8 GSM: B2/3/5/8 Note: The TDD-LTE B41 band bandwidth of SLM500S is 100MHz (2535 ~ 2655 MHz), and the channel is 40040 ~ 41240 The physical interface of the module is a 274-pin pad, and the hardware interface is as follows Three 1.8V UART serial ports, including one four-wire port and two two-wire port One LCD (MIPI interface) Double Camera Interface (MIPI interface) A high-speed USB interface Three-channel audio input interface Two audio output interfaces Two UIM card ports GPIO interfaces Four sets of I2C interfaces (one set of CAM-specific I2C) Two SPI interfaces One SD card port Support GNSS, 2.4G WiFi, Bluetooth 4.2 functions 2.1.Summary of Features Table 2.1:Main features of the module Product Feature Description CPU GPU Quad-core A53 (64bit) 1.4GHz Mail T820 MP1@680MHz System memory 8GB eMMC + 1GB LPDDR3 Compatible with 16GB+2GB Operating System Android10 Size 40.5x40.5x2.8mmLCC 146pin+LGA 128pin Network band SLM500S Wi-Fi Meige Smart TDD-LTE: B34/38/39/40/41 FDD-LTE: B1/3/5/8 WCDMA: B1/B5/B8 GSM: B2/3/5/8 IEEE 802.11b/g/n 2.4G 9 / 62 Bluetooth BT 4.2 SLM500S Hardware Design Guide NO Support GPS/Beidou/Glonass TD-LTE Cat4 TD-LTE 117/30Mbps FDD-LTE Cat4 FDD-LTE 150/50Mbps DC-HSPA+
42/11.2Mbps EDGE GPRS Class12, 236.8kbps/236.8kbps Class12, 85.6kbps/85.6kbps DSDS 3.0/1.8V Support SIM detection L/W/G+G with CSFB to W/G Matrix: HD+1440*720 Support HD up to 60fps LCD Size: User defined Interface: MIPI DSI 4-lane;
FM GNSS Data access SIM Display Camera Input devices Reset Application interface Interface: Main: MIPI CSI 2-lanes; front: MIPI CSI 1-lanes Camera Pixel: Max. Front 2Mp/Rear 5Mp Video decode 1080p@30 fps:H.264/MPEG-4 Video encode KeypadsPower on/offResetvolume+volume-
TP 1080p@30 fps: H.264/MPEG-4 Support hard reset The name of the interface VBAT SDIO *1 USB UART*3 I2C*4 Main Function Description 4pinModule power input3.5V4.2VNominal value3.8V SD Cardsupport up to 256GB Support OTG USB_BOOTFor forced download One four-wire port and two two-wire port Support SPI*2(master only) Support ADC*1 PWM*1 Charger Vibration GPIO VRTC RF Interface Support Support Linear Charger 1A Support 37 GPIOs Real-time clock backup battery Multi-mode LTE main antenna Multi-mode LTE diversity antenna GPS antenna 2.4G WiFi/BT antenna Meige Smart 10 / 62 Audio Three groups of analog MICs SLM500S Hardware Design Guide One Hands free speaker. One earpiece One stereo headphone. 2.2.Block Diagram The following figure lists the main functional parts of the module Base band chips Power management chip The RF Transceiver chip WIFI/BT 2-in-1 chip The antenna interface LCD/CAM - MIPI interface EMCP memory chip AUDIO interface Serial port, SD card interface, SIM card interface, I2C interface and so on Fig2.1Module function block diagram Meige Smart 11 / 62 SLM500S Hardware Design Guide 3.Module Package 3.1.Pin Distribution Diagram Fig3.1Module pin diagram (top view) MeiG Intelligent Product Technical Data 12 / 62 3.2.Module Pin Description Table 3.1:Pin description SLM500S Hardware Design Guide Pin Name GPIO Interrupt Pad Characteristics PI,PO PI,PO GND AI AI AI Functional Description Battery,3.5V-4.2V,default 3.8V Battery,3.5V-4.2V,default 3.8V GND Microphone 1 input plus Microphone 1 input minus Microphone 2 input GND GND
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 VBAT VBAT GND MIC1_P MIC1_N MIC2_P GND EAR_P EAR_M SPKR_OU T_P SPKR_OU T_M GND USB_DM USB_DP GND USB_ID UIM2_DE T UIM2_RE SET UIM2_CL K UIM2_DA TA UIM2_VD D UIM1_DE T UIM1_RE SET UIM1_CL K UIM1_DA TA AO AO AO AO GND I/O I/O GND DI DI DO DO I/O PO GPIO9 Earpiece output, plus Earpiece output, minus Class-D speaker driver output, plus Class-D speaker driver output, minus GND USB data minus USB data plus GND USB ID Configurable I/O,UIM2 removal detection UIM2 reset UIM2 clock UIM2 data PMIC output for UIM2 GPIO31 DI Configurable I/O,UIM1 removal detection DO DO I/O UIM1 reset UIM1 clock UIM1 data MeiG Intelligent Product Technical Data 13 / 62 SLM500S Hardware Design Guide UIM1_VD D GND VIB_DRV _P PO GND PO PMIC output for UIM1 GND Haptics driver output positive PWM GPIO123 I/O Configurable PWM TP_INT GPIO144 DI Configurable I/O,TP INT TP_RST GPIO145 DO Configurable I/O,TP RESET VDDSDIO GPIO87 GPIO87 PO I/O PMIC output 1.8V for SD-card IO Configurable I/O UART0_T XD UART0_R XD UART0_C TS UART0_R TS SD_VDD SD_CLK SD_CMD SD_D0 SD_D1 SD_D2 SD_D3 USB_BO OT TP_I2C_S CL TP_I2C_S DA LCD_RES ET GPIO60 I/O Configurable I/O,UART0 TX GPIO61 I/O Configurable I/O,UART0 RX GPIO62 I/O Configurable I/O,UART0 CTS GPIO63 I/O Configurable I/O,UART0 RTS PO DO I/O I/O I/O I/O I/O DI DI PMIC output 2.95V for SD-card power Secure digital controller clock Secure digital controller command Secure digital controller data bit 0 Secure digital controller data bit 1 Secure digital controller data bit 2 Secure digital controller data bit 3 Configurable I/O,SD card detection Pullup to forced USB boot SD_DET GPIO78 GPIO146 DO Configurable I/O,TP I2C SCL GPIO147 I/O Configurable I/O,TP I2C SDA GPIO50 DO Configurable I/O, LCD RESET LCD_TE GPIO51 DO Configurable I/O, LCD TE GND DSI_CLK_ M DSI_CLK_ P DSI_LAN GND GND AO AO AIO MIPI display serial interface 0 clock-
MIPI display serial interface 0 clock+
MIPI display serial interface 0 lane0-
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 MeiG Intelligent Product Technical Data 14 / 62 SLM500S Hardware Design Guide E0_M DSI_LAN E0_P DSI_LAN E1_M DSI_LAN E1_P DSI_LAN E2_M DSI_LAN E2_P DSI_LAN E3_M DSI_LAN E3_P GND CSI1_CLK _M CSI1_CLK _P CSI1_LAN E0_M CSI1_LAN E0_P CSI1_LAN E1_M CSI1_LAN E1_P GND CSI0M_C LK_M CSI0M_C LK_P CSI0M_L ANE0_M CSI0M_L ANE0_P MCAM_M CLK SCAM_M CLK GND ANT_WIFI
/BT 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 AIO AIO AIO AIO AIO AIO AIO MIPI display serial interface 0 lane0+
MIPI display serial interface 0 lane1-
MIPI display serial interface 0 lane1+
MIPI display serial interface 0 lane2-
MIPI display serial interface 0 lane2+
MIPI display serial interface 0 lane3-
MIPI display serial interface 0 lane3+
GND GND AO AO AIO AIO AIO AIO MIPI camera serial interface 1 clock-
MIPI camera serial interface 1 clock+
MIPI camera serial interface 1 lane0-
MIPI camera serial interface 1 lane0+
MIPI camera serial interface 1 lane1-
MIPI camera serial interface 1 lane1+
GND GND AO AO AIO AIO MIPI camera serial interface 0 clock-
MIPI camera serial interface 0 clock+
MIPI camera serial interface 0 lane0-
MIPI camera serial interface 0 lane0+
GPIO42 DO Configurable I/O,main CAM MCLK GPIO43 DO Configurable I/O,front CAM MCLK GND AIO GND RF signal for WIFI/BT MeiG Intelligent Product Technical Data 15 / 62 SLM500S Hardware Design Guide GND MCAM_R ST MCAM_P WDN SCAM_R ST SCAM_P WDN CAM_I2C _SCL CAM_I2C _SDA GND GND ANT_MAI N GND GND GND GND GPIO44 DO Configurable I/O,main CAM RESET GPIO46 DO Configurable I/O,main CAM PWDN GPIO45 DO Configurable I/O,front CAM RESET GPIO47 DO Configurable I/O,front CAM PWDN GPIO74 DO Dedicated camera I2C SCL GPIO75 I/O Dedicated camera I2C SDA GND GND AIO GND GND GND GND RF signal for main ANT GND GND GPIO131 GPIO131 I/O Configurable I/O GPIO127 DO SENSOR I2C SCL GPIO128 I/O SENSOR I2C SDA SENSOR_ I2C_SCL SENSOR_ I2C_SDA DBG_UA RT_RX DBG_UA RT_TX VOL_UP VOL_DO WN GPIO85 GPIO85 GPIO89 GPIO89 GPIO8 GPIO7 GPIO8 GPIO7 GPIO132 GPIO132 GPIO134 GPIO134 GPIO11 GPIO11 GPIO10 GPIO10 GPIO133 GPIO133 GPIO121 GPIO121 DI DO DI DI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O UART RX UART TX KEY VOL+
KEY VOL-
Configurable I/O Configurable I/O Configurable I/O Configurable I/O Configurable I/O Configurable I/O Configurable I/O Configurable I/O Configurable I/O, Configurable I/O 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 MeiG Intelligent Product Technical Data 16 / 62 SLM500S Hardware Design Guide 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 GPIO52 GPIO52 GPIO53 GPIO53 GPIO54 GPIO54 GPIO55 GPIO55 VDD_1V8 5 GPIO122 GPIO122 GPIO33 GPIO33 PWRKEY GPIO130 GPIO130 GPIO93 GPIO93 GPIO90 GPIO90 GPIO92 GPIO92 GPIO91 GPIO91 GND ANT_GNS S GND I/O I/O I/O I/O PO I/O I/O DI I/O I/O I/O I/O I/O GND AI GND Configurable I/O Configurable I/O Configurable I/O Configurable I/O PMIC output 1.85V for digital I/Os Configurable I/O Configurable I/O KEY POWER ON/OFF Configurable I/O Configurable I/O,SPI CLK Configurable I/O,SPI CS Configurable I/O,SPI DI Configurable I/O,SPI DO GND RF signal for GPS ANT GND GPIO32 GPIO32 I/O Configurable I/O 124 GPIO129 GPIO129 I/O Configurable I/O 125 VDDCAMI O 126 VRTC 127 128 129 130 131 132 133 134 135 136 137 138 139 CHARGE _SEL ADC VDD_2V8 GND ANT_DRX GND BAT_SNS BATT_TH ERM GND HPH_R HPH_REF HPH_L HS_DET PO AI,AO DI AI PO GND AI GND AI AI PMIC output 1.8V for Camera IO Coin-cell battery or backup battery Charge path selection Configurable ADC PMIC output 2.8V for TP and sensor GND RF signal for diversity ANT GND battery voltage input to ADC Battery temperature input to ADC GND GND AO AI AO AI Headphone output, right channel Headphone ground reference Headphone output, left channel MBHC mechanical insertion/removal-detection MeiG Intelligent Product Technical Data 17 / 62 SLM500S Hardware Design Guide 140 141 142 143 144 145 146 147 148 149 150 GND VBUS VBUS GND GND VBAT VBAT MIC_BIAS 1 RESERVE D RESERVE D RESERVE D GND PI PI GND GND PI,PO PI,PO AO GND USB Voltage USB Voltage GND GND Battery,3.5V-4.2V,default 3.8V Battery,3.5V-4.2V,default 3.8V Microphone bias #1 Reserved Reserved Reserved 151 MIC3_N 152 MIC3_P AI AI Microphone 3 input minus Microphone 3 input plus GPIO73 I/O Configurable I/O,UART2 RXD GPIO72 I/O Configurable I/O,UART2 TXD Reserved PO PMIC output 2.8V for Camera AVDD UART2_R XD UART2_T XD RESERVE D VDDCAM A RESERVE D RESERVE D RESERVE D RESERVE D RESERVE D GND 153 154 155 156 157 158 159 160 161 162 163 164 165 GPIO40 GPIO40 GPIO41 GPIO41 RESERVE D Reserved Reserved Reserved Reserved Reserved GND Configurable I/O Configurable I/O Reserved GND I/O I/O 166 GPIO48 GPIO48 I/O Configurable I/O MeiG Intelligent Product Technical Data 18 / 62 SLM500S Hardware Design Guide 167 I2C4_SDA GPIO155 I/O 168 I2C4_SCL GPIO154 DO Configurable I/O, I2C4 SDA for switching Charging and Flash LED Driver and Source Driver(if need) Configurable I/O, I2C4 SCL for switching Charging and Flash LED Driver and Source Driver(if need) 169 170 171 172 173 174 175 RESERVE D RESERVE D GND GND RESERVE D RESERVE D RESERVE D GND GND Reserved Reserved GND GND Reserved Reserved Reserved 176 GND GND GND 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 RESERVE D RESERVE D RESERVE D RESERVE D GPIO77 GPIO77 I/O GPIO139 GPIO139 I/O CS_M CS_P BAT_ID RESERVE D GND GND GND GND GND VDDCAM D VDDCAM MOT DI DI DI GND GND GND GND GND PO PO Reserved Reserved Reserved Reserved Configurable I/O Configurable I/O Fuel gauge input,minus Fuel gauge input,plus Battery ID Reserved GND GND GND GND GND PMIC output 1.2V for Camera DVDD PMIC output 2.8V MeiG Intelligent Product Technical Data 19 / 62 SLM500S Hardware Design Guide 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208 209 210 211 212 213 214 215 216 217 218 219 220 221 222 223 224 225 RESERVE D RESERVE D RESERVE D RESERVE D RESERVE D RESERVE D RESERVE D Reserved Reserved Reserved Reserved Reserved Reserved Reserved GPIO29 GPIO29 I/O Configurable I/O GND GND GND GND GND GND GND GND GND GPIO49 GPIO49 I/O Configurable I/O GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND RESET_N GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND DI GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND PMIC RESET MeiG Intelligent Product Technical Data 20 / 62 SLM500S Hardware Design Guide 226 227 228 229 230 231 232 233 234 235 236 237 238 239 240 241 242 243 244 245 246 247 248 249 250 251 252 253 254 255 256 257 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GPIO88 GPIO88 I/O Configurable I/O GND GND GND GND GND GND RESERVE D GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Reserved GND GND GPIO23 GPIO23 I/O Configurable I/O GND GND GND RESERVE D GND GND RGB_B GND GND RGB_R RGB_G RESERVE D GND GND RESERVE D GND GND GND GND GND GND GND GND Reserved GND GND SINK IN Blue LED Driver GND GND SINK IN SINK IN GND GND GND GND Red LED Driver Green LED Driver Reserved GND GND Reserved 258 GND GND GND MeiG Intelligent Product Technical Data 21 / 62 SLM500S Hardware Design Guide 259 260 261 262 263 GND GRFC_7 GND GRFC_5 RESERVE D GND DO GND DI,DO GND RFFE3 CLK GND RFFE3 DATA Reserved 264 GPIO86 GPIO86 I/O Configurable I/O 265 266 267 268 269 270 271 272 273 274 RESERVE D GND Reserved GND GND GPIO136 GPIO136 I/O Configurable I/O GND GND RESERVE D GND GND GND GND GND GND GND GND GND GND GND GND Reserved GND GND GND GND All the GPIO could be programmed to be either input or output, when in input mode,they could be programmed to trigger interrupt to CPU WPUWeak pull up WPDWeak pull down MeiG Intelligent Product Technical Data 22 / 62 3.3.Mechanical Dimensions SLM500S Hardware Design Guide Fig3.2Module 3D dimensionmm MeiG Intelligent Product Technical Data 23 / 62 SLM500S Hardware Design Guide Fig3.3Recommended PCB package sizemm MeiG Intelligent Product Technical Data 24 / 62 SLM500S Hardware Design Guide 4.Interface Application 4.1.Power Supply For battery-powered devices, the VBAT module has a voltage input range of 3.5V to 4.2V and a recommended voltage of 3.8V. In GSM band, when the module is transmitted at maximum power, the current peak can reach up to 3A instantly, resulting in a large voltage drop on VBAT. It is recommended to use a large capacitor to stabilize voltage close to VBAT. It is recommended to use a 22uF ceramic capacitor, and a 100nF capacitor in parallel can effectively remove high-frequency interference. At the same time, in order to prevent ESD and surge damage to the chip, it is recommended to use appropriate TVS tube and 4.5V voltage regulator tube at module VBAT pin. When PCB layout, capacitor and TVS tube should be as close as possible to module VBAT pin. The user can directly power the module with a 3.8v lithium ion battery. When using the battery, the impedance between the VBAT pin and the battery should be less than 150m. Fig4.1VBAT input reference circuit The DC input voltage is +5V. The following figure shows the recommended circuit for using dc-dc power supply MeiG Intelligent Product Technical Data 25 / 62 Fig4.2DC-DC power supply circuit SLM500S Hardware Design Guide Note:If the user does not use battery power supply, please note that a 10K resistor is connected to pin 134
(BATT_THERM) of the module and pulled down to GND, so as to prevent the software from judging abnormal battery temperature after the module is powered on and leading to shutdown. The connection diagram is as follows:
Fig4.3Diagram of connection when not powered by battery Users can directly use the 3.8V lithium ion battery to power the module, or use the Nickel-cadmium or nickel-manganese battery to power the module. However, the maximum voltage of the nickel-cadmium or nickel-manganese battery cannot exceed the maximum allowed voltage of the module. Otherwise, the module may be damaged. When using a battery, the impedance between the VBAT pin and the battery should be less than 150m. 4.1.1.Power Pin The VBAT pins (1, 2, 145, 146) are used for power input. In the user's design, please pay special attention to the design of the power supply part to ensure that the drop of VBAT is not less than 3.5V even when the module consumption reaches 3A. If the voltage drop is less than 3.5V, the module may shut down. PCB wiring from VBAT pins to the power supply should be wide enough to reduce voltage sags in transmission burst mode. Fig4.4VBAT lowest voltage sag 4.2.Power On/Off Do not turn on the module when the temperature and voltage upper limits of the module are exceeded. In extreme cases such operations can cause permanent damage to the module. 4.2.1.Power On The user can start the module by pulling down the PWRKEY pin (114) for at least 3 seconds. The pin 26 / 62 MeiG Intelligent Product Technical Data has been pulled up to the 1.8V power supply in the module. The recommended circuit is as follows. SLM500S Hardware Design Guide Fig4.5Power on using external signal driver module Fig4.6Use the button circuit to boot The following figure shows the boot sequence description:
Fig4.7PWRKEY startup sequence table
*This is a reference timing diagram. Because there may be slight differences with the actual measurement, the actual measurement shall prevail. 4.2.2.Module Shutdown The user can shut down the machine using the PWRKEY pin. MeiG Intelligent Product Technical Data 27 / 62 SLM500S Hardware Design Guide 4.2.2.1PWRKEY Shutdown The user can power off the device by lowering the PWRKEY signal for at least 3 seconds. Power off circuit can refer to the design of power on circuit. After the module detects the shutdown action, a prompt window will pop up on the screen to confirm whether to execute the shutdown action. You can forcibly shut down the PWRKEY by holding it down for at least 15 seconds. 4.2.3.Module Reset The SLM500S module supports the reset function. Users can quickly restart the module by pulling down the RESET_N pin of the module. Recommended circuits are as follows:
Fig4.8Use the button circuit to reset Fig4.9Reset module using external signal The typical voltage of the pin is 1.8V at high current level, so the user with 3V or 3.3V level can not directly use GPIO of MCU to drive the pin, and an isolation circuit is required, as shown in Figure 4.9. 4.3.VCOIN When the VBAT is disconnected and the user needs to save the real-time clock, the VCOIN pin should not be suspended and should be connected to a large external capacitor or battery. When the external capacitor is connected, the recommended value is 100uF, which can keep the real-time clock for 30 seconds. The RTC power module uses an external capacitor or battery to supply power to the RTC inside MeiG Intelligent Product Technical Data 28 / 62 the module. SLM500S Hardware Design Guide Fig4.10The external capacitor supplies power to the RTC Chargeable battery power:
Fig4.11Chargeable batteries power the RTC NotesThis VCOIN power supply is 2.5-3.1V, typical typically 3.0V. 4.4.Power Output The SLM500S has multiple power outputs. Used for LCD, Camera, In is recommended to add parallel 33PF and 10PF capacitors in each power supply to touch panel and so on. application, effectively remove high-frequency interference. it Table 4.1:The power to describe Signal UIM1_VDD UIM2_VDD SD_VDD VDD_1V85 VDD_2V8 VRTC VDDCAMIO VDDCAMD VDDCAMMOT VDDCAMA VDDSDIO Voltage 1.8V/3V 1.8V/3V 3.0V 1.85V 2.8V 3.0V 1.8V 1.2V 2.8V 2.8V 1.8V/3V Drive current 50mA 50mA 400mA 200mA 150mA 200mA 400mA 100mA 150mA 100mA MeiG Intelligent Product Technical Data 29 / 62 SLM500S Hardware Design Guide 4.5.Serial Port The SLM500S provides three sets of UART serial ports Table 4.2:UART Pin description Name UART0_TXD UART0_RXD UART0_CTS UART0_RTS DBG_UART_RX DBG_UART_TX UART2_RXD UART2_TXD Pin 34 35 36 37 93 94 153 154 Direction Function DI DO DI DO DI DO DI DO UART0 Data sending UART0 Data receiving UART0 Clear to sendCTS UART0 Request to sendRTS UART1 Data receiving UART1 Data sending UART2 Data receiving UART2 Data sending You can refer to the following connection mode:
Fig4.12Serial port connection diagram When the serial port level used by the user does not match the module, in addition to increasing the level conversion IC, the figure below can also be used to achieve level matching. Here, only TX and RX matching circuits are listed, and other low-speed signals can refer to these two circuits. MeiG Intelligent Product Technical Data 30 / 62 SLM500S Hardware Design Guide Fig4.13TX connection diagram Fig4.14RX connection diagram Note: When using Figure 14 and 15 for level isolation, it is necessary to pay attention to the output timing of VDD1V85. The serial port can communicate normally only after VDD1V85 is output normally. Table 4.3:Serial Port Hardware Parameters Description Input low level Input high level Output low level Output high level Note:
MIN
1.17
1.35 MAX 0.63
0.45
Unit V V V V 1. The serial port of signal. Use an RS232 converter chip if necessary. the module is CMOS interface, which cannot be directly connected to RS232 2. If the 1.8V output of the module cannot meet the high level range of the client, please add a level conversion circuit. MeiG Intelligent Product Technical Data 31 / 62 SLM500S Hardware Design Guide 4.6.MIPI Interface The SLM500S supports the Module Industry Processor Interface(MIPI) Interface for Camera and LCD. The module supports a maximum HD+(1440*720) display, in which the Main Camera supports a maximum of 2 lane MIPI and the Front Camera supports 1 lane MIPI. MIPI is a high-speed signal cable. During the Layout phase, Layout the cables according to the impedance and length requirements:
1. MIPI differential wiring, 100ohm impedance control, priority is given to each pair of separate wrapping. In the case of insufficient space, CLK needs to wrap the ground, while the others need to wrap the ground together, but it should be noted that when the ground cannot be wrapped, the space between the pair and the pair should be extended. 2. Equal length control: 0.5mm between P and N, 2mm between groups based on CLK. 3. The length of the MIPI cable should not exceed 75mm(3000mil), and the number of through-holes on the path should not exceed four. 4.6.1.LCD Interface The SLM500S module supports one set of MIPI LCD screens with a maximum resolution of 1440 x 720. The signal interfaces are shown in the following table Table 4.4:PIN Interface Name Pin Description Main Screen Interface DSI0_CLK_M DSI0_CLK_P DSI0_LANE0_M DSI0_LANE0_P DSI0_LANE1_M DSI0_LANE1_P DSI0_LANE2_M DSI0_LANE2_P DSI0_LANE3_M DSI0_LANE3_P LCD_RESET LCD_TE VDD_2V8 VDDCAMIO 52 53 54 55 56 57 58 59 60 61 49 50 129 125 MIPI_LCD clock line MIPI_LCD data line LCD reset pin LCD frame sync signal 2.8V power supply 1.8V power supply The GPIO of the module can be used as the LCD_ID. If the GPIO is used as the LCD_ID, please confirm the internal circuit of the LCD. If the resistor divider mode is used in the LCD, please note that the MeiG Intelligent Product Technical Data 32 / 62 voltage must meet the voltage range of GPIO. MIPI is a high-speed signal cable. To avoid EMI interference, you are advised to place a common-
mode inductor near the LCD. SLM500S Hardware Design Guide Fig4.15LCD Interface SLM500S does not support internal backlight drive. The backlight drive circuit of LCD needs to be added by customers themselves. For details, please refer to the following figure:
Fig4.16LCD backlight drive circuit 4.6.2.MIPI Camera Interface SLM500S module supports MIPI Camera interface and provides Camera dedicated power supply. The MeiG Intelligent Product Technical Data 33 / 62 SLM500S Hardware Design Guide rear Camera is CSI1 interface, supporting two sets of data lines and supporting 5M pixels. The front Camera is CSI0 interface and supports a set of data lines, which can support 2M pixels. The module provides power for the Camera, including VDDCAMA (2.8V), VDDCAMIO (1.8V), VDDCAMMOT (2.8V)
(focusing motor power) and VDDCAMD (1.2V). Table 4.5:MIPI Camera Interface Name Pin Description Rear Camera Interface CSI1_CLK_M CSI1_CLK_P CSI1_LANE0_M CSI1_LANE0_P CSI1_LANE1_M CSI1_LANE1_P MCAM_MCLK MCAM_RST MCAM_PWDN CAM_I2C_SCL CAM_I2C_SDA VDDCAMIO VDDCAMD VDDCAMMOT VDDCAMA 63 64 65 66 67 68 74 79 80 83 84 125 192 193 156 Camera MIPI CLK Camera MIPI DATA Camera CLK camera Camera Reset camera Camera Sleep camera I2C Clock camera I2C Data Output 1.8V,Camera IOVDD Output 1.2V,Camera DVDD Output 2.8V,Camera AFVDD Output 2.8V,Camera AVDD Front Camera Interface Name Pin Description CSI0M_CLK_M CSI0M_CLK_P CSI0M_LANE0_M CSI0M_LANE0_P SCAM_MCLK SCAM_RST SCAM_PWDN CAM_I2C_SCL CAM_I2C_SDA VDDCAMIO VDDCAMD VDDCAMMOT VDDCAMA 70 71 72 73 75 81 82 83 84 125 192 193 156 Camera MIPI CLK Camera MIPI DATA Camera CLK camera Camera Reset camera Camera Sleep camera I2C Clock camera I2C Data Output 1.8V,Camera IOVDD Output 1.2V,Camera DVDD Output 2.8V,Camera AFVDD Output 2.8V,Camera AVDD MeiG Intelligent Product Technical Data 34 / 62 SLM500S Hardware Design Guide If the user designs a CAMERA module with auto-focus function, please note that the I2C of the module cannot be directly connected to the AF device, and the I2C of the AF device should be connected to the driver chip of the CAMERA. The rate of the MIPI interface is high. During cabling, use 100 ohm impedance to control the cable, and pay attention to the cable length. Do not add a small capacitor to the MIPI signal cable, because the rising edge time of MIPI data may be affected and MIPI data may be invalid Fig4.17MIPI Camera1 reference circuit MeiG Intelligent Product Technical Data 35 / 62 SLM500S Hardware Design Guide Fig4.18MIPI Camera0 reference circuit The power supply required by the Camera, including AVDD-2.8V, AFVDD-2.8V (focus motor power supply) and DVDD-1.2V (CAM core voltage), can be designed with reference to the following LDO circuit. Fig4.19Camera imaging diagram 4.7.Capacitive Touch Interface The module provides a set of I2C interfaces that can be used to connect capacitive touch, as well as the required power supply and interrupt pins. The default interface pins of capacitive touch software are defined as follows:
MeiG Intelligent Product Technical Data 36 / 62 SLM500S Hardware Design Guide Table 4.6:Capacitive touch interface definition Name TP_I2C_SCL TP_I2C_SDA TP_INT TP_RST VDD_2V8 Pin IN/OUT Description 47 48 30 31 129 DO I/O DI DO PO The I2C interface with capacitive touch needs to be pulled up to VDD_1V85 INT Reset 2.8V Note: The interface definition for capacitive touch can be adjusted by software, and users can change GPIO and I2C according to design needs. 4.8.Audio Interface The module provides three analog audio inputs. MIC1_P/N is used to connect the main mic; MIC2_P/N can be used to connect the headset mic, and MIC3_P/N can be used to connect the noise-
canceling mic. The module also provides three channels of analog audio output (HPH_L/R, REC_P/N, SPK_P/N). The definition of audio PIN is as follows:
Table 4.7:Audio pin Name MIC1_P MIC1_N MIC2_P MIC3_P MIC3_N MIC_BIAS1 HPH_REF HPH_L HPH_R HS_DET EAR_M EAR_P SPKR_OUT_M SPKR_OUT_P Pin IN/OUT Description 4 5 6 152 151 147 137 138 136 139 9 8 11 10 AI AI AI AI AI AO GND AO AO AI AO AO AO AO MIC1 differential input +
MIC1 differential input -
MIC2 single input MIC2 differential input +
MIC3 differential input -
MIC1 bias voltage Earphone reference Gnd Earphone left channel Earphone right channel Earphone plug detection Receiver differential output +
Receiver differential output -
Speaker differential output +
Speaker differential output -
It is recommended that users choose the following circuit according to the actual application situation to get better sound effect. MeiG Intelligent Product Technical Data 37 / 62 4.8.1.Receiver Interface Circuit SLM500S Hardware Design Guide Fig4.20Receiver interface circuit 4.8.2.Microphone Receiving Circuit Fig4.21Microphone interface circuit MeiG Intelligent Product Technical Data 38 / 62 SLM500S Hardware Design Guide 4.8.3.Headphone Interface Circuit The module integrates a stereo headphone jack. You are advised to reserve ESD devices during the design phase to prevent ESD damage. The HS_DET pin of the module can be set as interrupt. By default, this pin is headset interrupt in the software. Users can use this pin to detect the plug and unplug of the headset. Note: HP_L must increase the pull-down resistance of 100K. Fig4.22Headphone interface circuit Note:1. The headphone holder in Figure 4.24 is type NO. If NC headphone is used, 10K is reserved on HP_DET and pulled up to VDD_2V8. 4.8.4.Speaker Interface Circuit The speaker interface adopts differential output, with built-in class D power amplifier driver. Under 4.2V VBAT power supply, the typical output power is 800mW when the load is 8 , and the output signal is SPKR_OUT_P/SPKR_OUT_M. Fig4.23Internal audio amplifier circuit MeiG Intelligent Product Technical Data 39 / 62 You can also add an audio power amplifier externally and use HPH_R as a single-ended input signal. The reference circuit is shown in the figure below. SLM500S Hardware Design Guide 4.24Recommended circuit with external audio amplifier 4.8.5 SPI Interface There are two sets of GPIO compatible I2S interfaces inside the module. The pins used for this function are listed below:
Name GPIO90 GPIO91 GPIO92 GPIO93 GPIO52 GPIO53 GPIO54 GPIO55 Pin 117 119 118 116 107 108 109 110 IN/OUT Description DO DO DI DO DO DO DI DO SPI0_CS SPI0_DO SPI0_DI SPI0_ CLK SPI2_CS SPI2_DO SPI2_DI SPI2_ CLK 4.9.USB Interface The SLM500S supports a USB 2.0 High Speed interface. The 90 ohm differential impedance must be controlled during Layout and the external cable length must be controlled according to the cable length inside the module. The module also supports OTG function. OTG power supply needs external IC power supply. The voltage input range during charging is as follows:
Table 4.8:Voltage input range during charging PIN Min Typical Max Unit MeiG Intelligent Product Technical Data 40 / 62 SLM500S Hardware Design Guide VBUS 4.5
9.7 V The USB insertion detection of the module is realized by VBUS and DP/DM data cable. When the USB cable is inserted, the VBUS voltage is detected first, and then the USB cable or charger is determined by detecting the pull up and down state of DM/DP. Therefore, if the user needs to use USB function, please be sure to connect VBUS to the 5V power supply on the data line. USB is in high-speed mode. You are advised to connect a serial common-mode inductor close to the USB connector to effectively suppress EMI interference. At the same time, the USB interface is an external interface. is recommended to add TVS to prevent electrostatic damage caused by plugging and unplugging data cables. Users should notice that the load capacitance of TVS should be less than 1PF when selecting TVS. The connection diagram is as follows:
It Fig4.25 USB Connection diagram 4.9.1.USB OTG The SLM500S module provides the USB OTG function, which uses the following pins:
Table 4.19:USB OTG Name VBUS USB_DM USB_DP USB_ID Pin 141142 13 14 16 Description OTG power supply requires external IC power supply USB DATA-
USB DATA+
USB ID The recommended circuit diagram of USB_OTG is shown below:
MeiG Intelligent Product Technical Data 41 / 62 SLM500S Hardware Design Guide Fig4.26Schematic of USB-OTG connection 4.10.Charging Interface The SLM500S module is integrated with 1A linear charging scheme. The charging contents in this manual are explained only by the internal charging scheme. The SLM500S module can charge over discharged batteries, including trickling charge, constant current charge, and constant voltage charge. Trickle charging: it is divided into two parts, trickle charging -A: when the battery voltage is lower than 2.05V, the charging current is 70mA; Trickle charging -B: the charging current is 450mA when the battery voltage is between 2.05V and 3.05V;
Constant current charging: when the battery voltage between 3.05V and 4.18V constant current charging, adapter charging charging current 1.0A, USB charging current 450mA;
Constant voltage charging: when the battery voltage reaches 4.18V, it enters the constant voltage charging, the charging current gradually decreases, the charging current decreases to about 100mA, and the charging ends. MeiG Intelligent Product Technical Data 42 / 62 4.10.1.Charging Detection Fig4.27Charging diagram SLM500S Hardware Design Guide When the VBUS PIN voltage is higher inside the module, and the software will judge USB_HS_DP/USB_HS_DM status to identify whether the charger or USB data cable is inserted. than 4.0V, a hardware interrupt will occur 4.10.2.Charge Control The SLM500S module can charge over discharged batteries, including trickle charge, pre-charge, constant current charge, and constant voltage charge. When the VBAT voltage is lower than 3.05V, the module is pre-charged. When VBAT is between 3.05V and 4.2V, the optimal constant current and constant voltage charging method for lithium battery is adopted. The current charging cut-off voltage of the software is 4.2V, and the back flush voltage is 4.05V. 4.10.3.BAT_THERM The SLM500S module comes with battery temperature detection, which you can implement with BATT_THERM (134PIN). This requires the battery to integrate an NTC resistor (negative temperature coefficient) at room temperature of 10K and connect the NTC resistor pin to the BATT_THERM pin. During the charging process, the software reads the voltage of the BATT_THERM pin to determine whether the battery temperature is too high. If it is found to be too high or too low, it will immediately stop charging to prevent battery damage. The schematic diagram of battery charging connection is shown below. Fig4.28Charging circuit connection diagram 4.11.UIM Interface The SLM500S supports two SIM card interfaces to achieve dual-card dual-standby. It supports hot swap of SIM cards and automatically identifies 1.8V and 3.0V cards. Below is the recommended SIM interface circuit. To protect SIM cards, TVS devices are recommended for static protection. The peripheral circuit of the SIM card should be close to the SIM card holder. MeiG Intelligent Product Technical Data 43 / 62 The reference circuit is as follows:
SLM500S Hardware Design Guide Fig4.29UIM card interface circuit 4.12.SD Interface The SLM500S supports SD card interfaces with a maximum of 256GB. The reference circuit is as follows:
Fig4.30 SD interface circuit MeiG Intelligent Product Technical Data 44 / 62 SLM500S Hardware Design Guide 4.13.I2C Bus Interface SLM500S module supports four hardware I2C bus interfaces, including one Camera dedicated CCI interface. Pin definitions and default functions are as follows:
Table 4.10:I2C interface Name CAM_I2C_SCL CAM_I2C_SDA TP_I2C_SCL TP_I2C_SDA SENSOR_I2C_SCL SENSOR_I2C_SDA I2C4_SDA I2C4_SCL 4.14.ADC Pin Description 83 84 47 48 91 92 167 168 Camera I2C Universal I2C, default for TP General I2C General I2C The SLM500S module uses a power management chip to provide two ADC functional signals: ADC
(128PIN) and BAT_ID (185PIN). ADC signal has a resolution of 12bit, and its performance parameters are as follows:
Table 4.11:ADC performance parameters Describe Minimum Typical Maximum Unit Input Voltage Range ADC Resolution Sampling Frequency 4.15.PWM
1.2
49
12
V bits kHz PWM pin can be used to do LCD backlight adjustment, by adjusting the duty ratio to adjust the backlight brightness. 4.16.MOTOR The SLM500S supports motor reference schematic diagram is as follows:
function, which can be achieved by VIB_DRV_P (28PIN). The MeiG Intelligent Product Technical Data 45 / 62 SLM500S Hardware Design Guide Fig4.31motor Interface circuit 4.17. Antenna Interface The module provides four antenna interfaces: MAIN antenna, DRX antenna, GPS antenna and WiFi/BT antenna. To ensure good wireless performance of the user's product, the user should select an antenna whose input impedance is 50 ohm and standing wave coefficient is less than 2 in the working frequency band. 4.17.1.Main Antenna The module provides the MAIN antenna interface pin RF_MAIN. The antenna on the user's MAIN board shall be connected to the antenna pin of the module with a characteristic impedance of 50 ohm micros trip line or ribbon line. To facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows:
Fig4.32MAIN Antenna interface connects the circuit In the figure, R101, C101 and C102 are antenna matching devices. The specific component values can be determined after the antenna is debugging in the antenna factory. 0R is displayed by default for R101, and not for C101 and C102. MeiG Intelligent Product Technical Data 46 / 62 If there are fewer components that can be placed between the antenna and the output end of the module, or RF test head is not required in the design, the antenna matching circuit can be simplified as shown in the figure below:
SLM500S Hardware Design Guide Fig4.33MAIN antenna interface simplifies the connection circuit Note: In the figure above, R101 is pasted by default, C101 and C102 are not pasted by default. 4.17.2.DRX Antenna The module provides the DRX antenna interface pin RF_DIV. The antenna on the user's motherboard the module using a micro strip line or ribbon line with a shall be connected to the antenna pin of characteristic impedance of 50 ohm. To facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows:
Fig4.34The DRX antenna port connects to the circuit Note: R102, C103, C104 are antenna matching devices, the specific component value can be determined after the antenna is debugging in the antenna factory. 0R is attached by default to R102, C103 and C104 are not attached by default. If there are fewer components that can be placed between the antenna and the output end of the module, or RF test head is not required in the design, the antenna matching circuit can be simplified as shown in the figure below:
MeiG Intelligent Product Technical Data 47 / 62 SLM500S Hardware Design Guide Fig4.35The DRX antenna port simplifies the connection circuit Note: R102 default paste 0R, C103 and C104 default do not paste. 4.17.3.GPS Antenna GNSS antenna pin RF_GPS is provided by the module. The antenna on the user's motherboard shall be connected to the antenna pin of the module using a micros trip line or ribbon line with a characteristic impedance of 50 ohm. LNA is integrated in the module. To improve GNSS reception performance, customers can use external active antennas. The recommended circuit connection is shown in the figure below:
Fig4.36Connect active antenna 4.17.4.WiFi/BT Antenna The module provides WiFi/BT antenna pin RF_WIFI/BT. The antenna on the user's motherboard shall be connected to the antenna pin of the module using a microstrip line or ribbon line with a characteristic impedance of 50 ohm. MeiG Intelligent Product Technical Data 48 / 62 To facilitate antenna debugging and certification testing, an RF connector and antenna matching network should be added. The recommended circuit diagram is as follows:
SLM500S Hardware Design Guide Fig4.37WiFi_BT antenna interface connection circuit Note: R301, C301, C302 are antenna matching devices. The specific component values can be determined after the antenna is debugging in the antenna factory. 0R is displayed by default for R301, C301 and C302 are not displayed by default. If there are fewer components that can be placed between the antenna and the output end of the module, or RF test head is not required in the design, the antenna matching circuit can be simplified as shown in the figure below:
Fig4.38WIFI_BT antenna interface simplifies connection circuit Note: R301 is pasted by default, C301 and C302 are not pasted by default. MeiG Intelligent Product Technical Data 49 / 62 SLM500S Hardware Design Guide 5.Electrical, Reliability 5.1.Absolute Maximum The table below shows the absolute maximum values that the module can withstand. Exceeding these limits may cause permanent damage to the module. Table 5.1:Absolute maximum Parameter Min Typical Max Unit VBAT VBUS Peak current
6 12 3 5.2.Working Temperature The following table shows the operating temperature range of the module:
Table 5.2:Module operating temperature Parameter Working temperature Storage temperature Min
-25
-40 Typical
Max 75 90 V V A Unit 5.3.Working Voltage Table 5.3:Module operating voltage Parameter VBAT VBUS Hardware shutdown voltage Min 3.5 4.5 3.4 Typical Max Unit 3.8 5
4.2 9.2
V V V MeiG Intelligent Product Technical Data 50 / 62 SLM500S Hardware Design Guide 5.4.Digital Interface Features Table 5.4:Digital Interface Features (1.8V) Parameter Description Min Typical Max Unit VIH VIL VOH VOL Input high level voltage 1.26 Input low level voltage Output high level voltage Output low level voltage
1.6
0.54
0.2 V V V V 5.5.SIM_VDD Features Table 5.5:SIM_VDD Features Parameter Description Min Typical Max Unit VO IO Output voltage Output current
3 1.8
50 V mA 5.6.PWRKEY Features Table 5.6:PWRKEY features Parameter Description PWRKEY High level Low level Valid time 5.7.VCOIN Features Table 5.7:VCOIN features Min 1.4
3000 Typical Max Unit
0.6 V V ms Parameter Description Min Typical VCOIN-IN VCOIN Input voltage 2.5 VCOIN-OUT VCOIN Output voltage
3.0 3.0 Max 3.1 3.35 Unit V V MeiG Intelligent Product Technical Data 51 / 62 SLM500S Hardware Design Guide 5.8.ConsumptionVBAT=3.8V Table 5.8:Consumption Parameter Description Conditions Min Typical Max Unit VBAT Power supply voltage The voltage must be between the maximum and minimum 3.5 3.8 Shutdown mode GSM Standby consumption Average current WCDMA Standby consumption Ivbat Call flow consumption Digital transmission Imax Peak current FDD Standby consumption TDD Standby consumption GSM900 CH62 32dBm WCDMA2100 CH10700 22.5 dBm GPRS GSM900 CH62 PCL5 1DL 4UL EGPRS GSM900 CH62 PCL8 1DL 4UL Power is controlled at maximum output power
2.36 2.99 3.47 2.98
4.2 67
V uA mA mA mA mA 278.11 mA 490.18 mA 547.6 mA 535.5 mA 3 A 5.9.Electrostatic Protection The module is not protected against electrostatic discharge. Therefore, you must pay attention to ESD protection when producing, assembling, and operating modules. 5.10.Module Operating Frequency Band The following table lists the operating bands of the modules in accordance with 3GPP TS 05.05 technical specification. Table 5.9:Module operating frequency band Band GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 Receiving Transmitting Physical Channel 869 894MHz 925 960MHz 1805 1880MHz 1930 1890MHz 2110 2170 MHz 824 849MHz 880 915MHz 1710 1785MHz 1850 1910MHz 1920 1980 MHz 128~251 0~124975~1023 512~885 512~661 TX: 9612~9888 MeiG Intelligent Product Technical Data 52 / 62 SLM500S Hardware Design Guide WCDMA B5 869894MHz 824849MHz WCDMA B8 880915MHz 925960MHz LTE B1 LTE B3 LTE B5 LTE B7 LTE B8 LTE B20 LTE B34 LTE B38 LTE B39 LTE B40 LTE B41 21102170 MHz 19201980 MHz 18051880 MHz 17101785 MHz 869894MHz 824849MHz 26202690MHz 25002570MHz 925960MHz 880915MHz 791821MHz 832862MHz 20102025 MHz 25702620 MHz 18801920 MHz 23002400 MHz 24962690 MHz 20102025 MHz 25702620 MHz 18801920 MHz 23002400 MHz 24962690 MHz RX: 10562~10838 TX: 4132~4233 RX: 4357~4458 TX: 2712~2863 RX: 2937~3088 TX: 1800018599 RX: 0~599 TX: 19200~19949 RX: 1200~1949 TX: 2040020649 RX: 2400~2649 TX: 2075021449 RX: 2750~3449 TX: 2145021799 RX: 3450~3799 TX: 2415024449 RX: 6150~6449 3620036349 3775038249 3825038649 3865039649 3965041589 Note: THE LTE TDD B41 band bandwidth of SLM500S is 100MHz (2555 ~ 2655 MHz), and the channel is 40240 ~ 41240. 5.11.RF Characteristics The table below lists the conducted RF output power of the module in accordance with 3GPP TS 05.05 technical specification, 3GPP TS 134121-1 standard. Table 5.10:Conducted output power Band Standard Output(dBm) Output Tolerance(dBm) GSM850EGSM900 DCS1800 WCDMA LTE 33dBm 30dBm 24 dBm 23 dBm 2 2
+1/-3 2.7 MeiG Intelligent Product Technical Data 53 / 62 SLM500S Hardware Design Guide 5.12.Module Conduction Receiving Sensitivity The following table lists the conductive reception sensitivity of the module, which is tested under static conditions. Table 5.11:Conduction reception sensitivity Band Reception SensitivityTYP Reception SensitivityMAX GSM850EGSM900
<-108dBm DCS1800PCS1900
<-108dBm WCDMAB1 WCDMAB5 WCDMAB8
<-109 dBm
<-109 dBm
<-109 dBm LTEFDD/TDD Shown in Table 6.12 3GPP 3GPP 3GPP 3GPP 3GPP 3GPP Table 5.12:LTE reference sensitivity 3GPP Dual Antenna Requirements (QPSK) E-UTRA Band Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14
... 17 18 19 20 21 22 23 24 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz Duplex mode
-102.7
-101.7
-104.7
-103.2
-102.2
-101.7
-99.7
-98.7
-101.7
-100.2
-99.2
-98.7
-104.7
-101.7
-100
-98
-97
-100
-98
-100
-98
-97
-99
-100
-100
-97
-97
-97
-97
-1007
-100
-97
-100
-97
-100
-100
-97
-95
-94
-97
-95
-97
-95
-94
-96
-97
-97
-94
-94
-94
-94
-977
-97
-94
-97
-94
-97
-97
-95.2
-93.2
-92.2
-95.2
-93.2
-94.2
-95.2
-95.27
-95.2
-91.2
-95.2
-92.2
-95.2
-94
-92
-91
-94
-92
-93
-94
-90
-91
-94 FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD FDD MeiG Intelligent Product Technical Data 54 / 62 SLM500S Hardware Design Guide 25 26 27 28 31
... 33 34 35 36 37 38 39 40 41
-101.2
-102.7
-103.2
-99.0
-106.2
-106.2
-98.2
-99.7
-100.2
-100.2
-95.7
-102.2
-102.2
-96.5
-97.56
-98
-98.5
-93.5
-100
-100
-100
-100
-100
-100
-100
-100
-98
-93.5
-94.56
-95
-95.5
-91.7
-92.76
-90.5
-93.7
-91
-97
-97
-97
-97
-97
-97
-97
-97
-95
-95.2
-95.2
-95.2
-95.2
-95.2
-95.2
-95.2
-95.2
-93.2
-94
-94
-94
-94
-94
-94
-94
-92 5.13.WIFI Main RF Performance The following table lists the main RF performance under WIFI conduction. Table 5.13:WIFI Main RF performance parameters under conduction Launch Performance 2.4G 802.11B 802.11G 802.11N Transmitted power (minimum rate) Transmitted power (maximum rate) EVM (Maximum rate) 19 18 20%
17 15
-27 16 13
-30 Receiving Performance 2.4G Reception sensitivity 802.11B 802.11G 802.11N Minimum speed Maximum speed
-89
-86
-88
-71.5
-87
-69.5 FDD FDD FDD FDD FDD TDD TDD TDD TDD TDD TDD TDD TDD TDD dBm dBm dB dBm dBm MeiG Intelligent Product Technical Data 55 / 62 SLM500S Hardware Design Guide 5.14.BT Main RF Performance The following table lists the main rf properties under BT conduction. Table 5.14:Main RF performance parameters under BT conduction Transmission power Reception sensitivity Launch Performance DH5 10 2DH5 6 Receiving Performance DH5
-91.5 2DH5
-91.5 3DH5 6 3DH5
-83 dBm dBm 5.15.Main RF Performance of GNSS The main RF performance under GNSS conduction is listed in the following table. Table 5.15:Main RF performance parameters under GNSS conduction GNSS Working Band:1575.42MHZ GNSSC Carrier to noise ratioN040dB/Hz GNSS Sensitivity GNSS Startup time Capture (cold start) Capture (hot start) tracking
-148 hot start 5
-156 start 10
-160 dBm cold start 38 S MeiG Intelligent Product Technical Data 56 / 62 SLM500S Hardware Design Guide 6.Production 6.1.Top and Bottom Views of Modules Fig6.1Top and bottom views of modules 6.2.Recommended Welding Furnace Temperature Curve Fig6.2Recommended welding furnace temperature curve 6.3.Humidity Sensitive Characteristic (MSL) The SLM500S meets humidity sensitivity level 3. The temperature & lt; 30 degrees and relative humidity < 60% of the environmental conditions, dry packaging according to IPC/JEDEC standard J-
STD-020C specification. The temperature & lt; 40 degrees and relative humidity < Shelf life is at least 6 MeiG Intelligent Product Technical Data 57 / 62 SLM500S Hardware Design Guide months when unopened in 90% of environmental conditions. After unpacking, table 22 lists the shelf life of modules corresponding to different moisture sensitivity levels. Table 6.1:Humidity sensitivity level differentiation Level Factory environment 30/60%RH 1 2 2a 3 4 5 5a 6 Indefinite quality at ambient 30/85% RH 1 year 4 weeks 168 hours 72 hours 48 hours 24 hours Force bake before use. After baking, the module must be fitted within the time limit specified on the label. After unpacking, at temperature < 30 degrees and relative humidity < SMT within 168 hours in 60% of environmental conditions. Bake if the above conditions are not met. Note: Oxidation risk: Baking SMD packaging can cause metal oxidation and, if excessive, can lead to solder ability problems during thus limiting solder ability circuit board assembly. Baking SMD packages for temperature and time, considerations. The accumulated baking time at temperatures greater than 90 C and up to 125 C should not exceed 96 hours. 6.4.Baking Requirements Due to the moisture sensitive nature of the modules, the SLM500S should be fully baked before reflow soldering, otherwise the modules may be permanently damaged during reflow soldering. The SLM500S should be baked for 192 hours at 40C +5C /-0C with relative humidity less than 5%, or the module should be baked for 72 hours at 80C +5C. The user should be aware that the tray is not resistant to high temperatures and should remove the module from the tray for baking, otherwise the tray may be damaged by high temperatures. Table 6.2:Baking needs:
Baking Temperature Humidity Baking Time 40C5C 120C5C
<5%
<5%
192 hours 4 hours MeiG Intelligent Product Technical Data 58 / 62 SLM500S Hardware Design Guide 7.Appendix 7.1.The related documents Table 7.1:The related documents
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
File Name Comment GSM 07.07 Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) GSM 07.10 Support GSM 07.10 multiplexing protocol GSM 07.05 GSM 11.14 Digital cellular telecommunications(Phase 2+); Use of Data Terminal EquipmentData Circuit terminating Equipment(DTEDCE) interface for Short Message service(SMS)and Cell Broadcast Service(CBS) Digital cellular telecommunications system (Phase 2+);Specification of the UIM Application Toolkit for the Subscriber Identity ModuleMobile Equipment (UIMME) interface GSM 11.11 Digital cellular telecommunications system (Phase 2+);Specification of the Subscriber Identity Module Mobile Equipment (UIMME) interface GSM 03.38 Digital cellular telecommunications system (Phase 2+); Alphabets and language-specific information GSM 11.10 Digital cellular telecommunications system (Phase 2)Mobile Station
(MS) conformance specificationPart 1Conformance specification AN_Serial Port AN_Serial Port 7.2.Terminology and Interpretation Table 7.2:Terminology and Interpretation Term ADC AMR CS CSD CTS DTE DTR DTX EFR Explanation Analog-to-Digital Converter Adaptive Multi-Rate Coding Scheme Circuit Switched Data Clear to Send Data Terminal Equipment (typically computer, terminal, printer) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate EGSM Enhanced GSM MeiG Intelligent Product Technical Data 59 / 62 SLM500S Hardware Design Guide ESD ETS FR GPRS GSM HR IMEI Li-ion MO MS MT PAP Electrostatic Discharge European Telecommunication Standard Full Rate General Packet Radio Service Global Standard for Mobile Communications Half Rate International Mobile Equipment Identity Lithium-Ion Mobile Originated Mobile Station (GSM engine), also referred to as TE Mobile Terminated Password Authentication Protocol PBCCH Packet Broadcast Control Channel PCB PCL PCS PDU PPP RF RMS RX UIM SMS TDD TE TX UART URC USSD Printed Circuit Board Power Control Level Personal Communication System, also referred to as GSM 1900 Protocol Data Unit Point-to-point protocol Radio Frequency Root Mean Square (value) Receive Direction Subscriber Identification Module Short Message Service Time Division Distortion Terminal Equipment, also referred to as DTE Transmit Direction Universal Asynchronous Receiver & Transmitter Unsolicited Result Code Unstructured Supplementary Service Data Telephone book abbreviation explain FD LD MC ON RC SM UIM fix dialing phonebook UIM last dialing phonebook (list of numbers most recently dialed) Mobile Equipment list of unanswered MT calls (missed calls) UIM (or ME) own numbers (MSISDNs) list Mobile Equipment list of received calls UIM phonebook MeiG Intelligent Product Technical Data 60 / 62 NC Not connect SLM500S Hardware Design Guide MeiG Intelligent Technology Co., LTD Address: 5th floor, Building G, Vijing Center, 2337 Gudai Road, Minhang District, Shanghai Zip code200233 Tel+86-21-54278676 Fax+86-21-54278679 Web http://www.meigsmart.com MeiG Intelligent Product Technical Data 61 / 62 Doc Products with CE Marking comply with the radio Equipment Directive2014/53/EUand UK Radio Equipment Regulations (SI 2017/1206) The full text of the EU declaration of conformity is available at the following internet address: http://www.meigsmart.com RF exposure statement RF exposure information: The Maximum Permissible Exposure (MPE) level has been calculated based on a distance of d=20 cm between the device and the human body. To maintain compliance with RF exposure requirement, use product that maintain a 20cm distance between the device and human body. Temperature: -40C ~ +75C Bands:
The Radio equipment operation with following frequecy bands Maximum tune-up power(dBm) BT3.0: 5dBm(eirp) Ble: 5dBm(eirp) 2.4GWIFI:17.83dBm(eirp) GSM 900:32dBm GSM 1800:31dBm WCDMA band8:23dbm LTE Band7:24dbm LTE Band8:24dbm LTE Band28:24dbm LTE Band34:24dbm LTE Band38:24dbm LTE Band40:24dbm 15.19 Labeling requirements. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 15.21 Changes or modification warning. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. 15.105 Information to the user. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help RF warning for Mobile device:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This module is intended for OEM integrators only. Per FCC KDB 996369 D03 OEM Manual v01 guidance, the following conditions must be strictly followed when using this certified module:
KDB 996369 D03 OEM Manual v01 rule sections:
2.2 List of applicable FCC rules This module has been tested for compliance to FCC Part 15 2.3 Summarize the specific operational use conditions The module is tested for standalone mobile RF exposure use condition. Any other usage conditions such as co-location with other transmitter(s) or being used in a portable condition will need a separate reassessment through a class II permissive change application or new certification. 2.4 Limited module procedures Not application 2.5 Trace antenna designs Not application 2.6 RF exposure considerations This equipment complies with FCC mobile radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body. If the module is installed in a portable host, a separate SAR evaluation is required to confirm compliance with relevant FCC portable RF exposure rules. 2.7 Antennas The following antennas have been certified for use with this module; antennas of the same type with equal or lower gain may also be used with this module. The antenna must be installed such that 20 cm can be maintained between the antenna and users. Antenna Type(Dipole) BT/2.4Gwifi 1.77 dBi;
Antenna connector R-SMA 2.8 Label and compliance information The final end product must be labeled in a visible area with the following: Contains FCC ID: 2APJ4-SL500SA. The grantee's FCC ID can be used only when all FCC compliance requirements are met. 2.9 Information on test modes and additional testing requirements This transmitter is tested in a standalone mobile RF exposure condition and any co-located or simultaneous transmission with other transmitter(s) or portable use will require a separate class II permissive change re-evaluation or new certification. 2.10 Additional testing, Part 15 Subpart B disclaimer This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radiator) rule requirement applicable to the final host. The final host will still need to be reassessed for compliance to this portion of rule requirements if applicable. As long as all conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. Manual Information To the End User:
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual OEM/Host manufacturer responsibilities OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the FCC rules. This module must not be incorporated into any other device or system without retesting for compliance as multi-radio and combined equipment