FCC ID: A8TBM64S1 Bluetooth Module

 

Bluetooth 4.2 Stereo Audio Module BM62/64 Features Qualified for Bluetooth v4.2 specification Supports A2DP 1.3, AVRCP 1.6, HFP 1.6, HSP 1.2 and SPP 1.2 Supports Bluetooth 4.2 dual-mode (BDR/EDR/

BLE) specifications Stand-alone module with on-board PCB antenna and Bluetooth stack Supports high resolution up to 24-bit, 96 kHz audio data format Supports to connect two hosts with HFP/A2DP profiles simultaneously Transparent UART mode for seamless serial data over UART interface Supports virtual UART communication between host MCU and smartphone applications by Blue-

tooth SPP or BLE link Easy to configure with Windows GUI or directly by external MCU Supports firmware field upgrade Supports one microphone Compact surface mount module:

- BM62: 29 x 15 x 2.5 mm

- BM64: 32 x 15 x 2.5 mm Castellated surface mount pads for easy and reliable host PCB mounting RoHS compliant Ideal for portable battery operated devices Internal battery regulator circuitry DSP Audio Processing Supports 64 kbps A-Law, -Law PCM format/

Continuous Variable Slope Delta (CVSD) modula-

tion for SCO channel operation Supports 8/16 kHz noise suppression Supports 8/16 kHz echo cancellation Supports Modified Sub-Band Coding (MSBC) decoder for wide band speech Built-in High Definition Clean Audio (HCA) algo-

rithms for both narrow band and wide band speech processing Packet loss concealment (PLC) Built-in audio effect algorithms to enhance audio streaming Supports Serial Copy Management System

(SCMS-T) content protection FIGURE 1:

BM62 MODULE FIGURE 2:

BM64 MODULE Audio Codec Sub-band Coding (SBC) and optional Advanced Audio Coding (AAC) decoding 20-bit digital-to-analog converter (DAC) with 98 dB SNR 16-bit analog-to-digital converter (ADC) with 92 dB SNR Supports up to 24-bit, 96 kHz I2S digital audio

(BM64 only) 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 1 BM62/64 Peripherals Description The BM62/64 Stereo Audio module is a fully qualified Bluetooth v4.2 dual-mode (BDR/EDR/BLE) module for designers to add wireless audio and voice applications to their products. The BM62/64 module is a Bluetooth Special Interest Group (SIG) certified module that provides a complete wireless solution with a Bluetooth stack, an integrated PCB antenna, and worldwide radio certifications in a compact surface-mount package. The BM62/64 module has several SKUs. The BM62 module is a Class 2 device and the BM64 module is available in both Class 1 and Class 2 versions. Built-in lithium-ion and lithium-polymer battery charger (up to 350 mA) Integrated 1.8V and 3V configurable switching regulator and low-dropout (LDO) regulator Built-in ADC for battery monitoring and voltage sense Built-in ADC for charger thermal protection Built-in undervoltage protection (UVP) An Auxiliary input port for external audio input Two LED drivers Multiple I/O pins for control and status RF/Analog Frequency spectrum: 2.402 GHz to 2.480 GHz Receive sensitivity: -90 dBm (2 Mbps EDR) Output Power

- BM64 Class 1: +15 dBm typical

- BM62/64 Class 2: +2 dBm typical HCI Interface High-speed HCI-UART interface (supports up to 921,600 bps) MAC/Baseband Processor Supports Bluetooth 4.2 dual-mode

- BDR/EDR transport for audio, voice, and SPP data exchange

- BLE transport for proprietary transparent service and Apple Notification Center Service

(ANCS) data exchange Operating Condition Operating voltage: 3.2V to 4.2V Operating temperature: -20C to +70C Compliance Bluetooth SIG QDID: 83345 (BM62, BM64 Class 2) and 83336 (BM64 Class 1) Certified to the United States (FCC), Canada (IC), European Economic Area (CE), Korea (KCC), Tai-

wan (NCC), Japan (MIC), China (SRRC), and Brazil (ANATEL) radio regulations Applications Portable speaker Multiple speakers Headset Sound bar DS60001403C-Page 2 Preliminary 2017 Microchip Technology Inc. BM62/64 Table of Contents 1.0 Device Overview ...................................................................................................................................................... 5 2.0 Audio ...................................................................................................................................................................... 15 3.0 Transceiver ............................................................................................................................................................ 19 4.0 Power Management Unit ....................................................................................................................................... 21 5.0 Application Information .......................................................................................................................................... 23 6.0 Printed Antenna Information .................................................................................................................................. 39 7.0 Physical Dimensions .............................................................................................................................................. 43 8.0 Electrical Characteristics ........................................................................................................................................ 47 9.0 Soldering Recommendations ................................................................................................................................. 55 10.0 Ordering Information ............................................................................................................................................ 57 Appendix A: Certification Notices ................................................................................................................................. 59 Appendix B: Revision History ....................................................................................................................................... 69 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrorsmicrochip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We wel-

come your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following:

Microchips Worldwide Web site; http://www.microchip.com Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 3 BM62/64 NOTES:

DS60001403C-Page 4 Preliminary 2017 Microchip Technology Inc. BM62/64 1.0 DEVICE OVERVIEW Windows-based utility. The BM62 and BM64 Stereo Audio modules are built around Microchip Technology IS2062 and IS2064 SoCs. The IS2062/64 SoC integrates the Bluetooth 4.2 dual-

mode radio transceiver, Power Management Unit

(PMU), a crystal and DSP. Users can configure the BM62/64 module by using the UI tool and DSP tool, a Note:

The UI and DSP tools are available for download from the Microchip web site at:

www.microchip.com/BM62 and www.microchip.com/BM64. Figure 1-1 illustrates a typical example of the BM62 module, which is connected to an external audio amplifier and the MCU. FIGURE 1-1:

SINGLE SPEAKER APPLICATION USING BM62 MODULE Figure 1-2 illustrates a typical example of the Class 1 BM64 module, which is connected to an external MCU and a DSP/codec. FIGURE 1-2:

SINGLE SPEAKER APPLICATION USING BM64 MODULE 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 5 BM62/64 Figure 1-3 illustrates the Multi-speaker application using the BM64 module. FIGURE 1-3:

MULTI-SPEAKER APPLICATION USING BM62/64 MODULE DS60001403C-Page 6 Preliminary 2017 Microchip Technology Inc. Table 1-1 provides the key features of the BM62/64 module. TABLE 1-1:

BM62/64 KEY FEATURES BM62/64 Feature Application Stereo/mono Pin count Dimensions (mm2) PCB antenna Tx power (typical) Audio DAC output DAC (single-ended) SNR at 2.8V (dB) DAC (capless) SNR at 2.8V (dB) ADC SNR at 2.8V (dB) I2S digital output Analog Auxiliary-Input Mono microphone External audio amplifier interface UART Full-speed USB 1.1 LED driver Internal DC-DC step down regulator DC 5V adapter input Battery charger (350 mA max) ADC for thermal charger protection Under voltage protection (UVP) GPIO Button support EEPROM BM62 CLASS 2 BM64 CLASS 2 BM64 CLASS 1 Headset/Speaker Multi-speaker/Soundbar Stereo 37 15 x 29 Yes 2 dBm Stereo 43 15 x 32 Yes 2 dBm Stereo 43 15 x 32 Yes 15 dBm 2-channel 2-channel 2-channel

-98

-98

-92 No Yes 1 Yes Yes No 2 Yes Yes Yes Yes Yes 10 6 Yes

-98

-98

-92 Yes Yes 1 Yes Yes Yes 2 Yes Yes Yes Yes Yes 12 6 Yes

-98

-98

-92 Yes Yes 1 Yes Yes Yes 2 Yes Yes Yes Yes Yes 12 6 Yes Customized voice prompt 8K Sampling Rate, Stored in EEPROM with approximately 800 bytes/second Multitone DSP functions (audio playback and voice call) BLE Bluetooth profiles A2DP AVRCP HFP HSP SPP Yes Yes Yes 1.3 1.6 1.6 1.2 1.2 Yes Yes Yes 1.3 1.6 1.6 1.2 1.2 Yes Yes Yes 1.3 1.6 1.6 1.2 1.2 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 7 BM62/64 Figure 1-4 illustrates the pin diagram of the BM62 module. FIGURE 1-4:

BM62 MODULE PIN DIAGRAM DS60001403C-Page 8 Preliminary 2017 Microchip Technology Inc. BM62/64 Table 1-2 provides the pin description of the BM62 module. TABLE 1-2:

BM62 MODULE PIN DESCRIPTION Pin No Pin Type Pin Name Description 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 I/O P0_0 I EAN I/O I/O P3_0 P2_0 Configurable control or indication pin

(Internally pulled-up, if configured as an input) Slide switch detector, active-high UART TX_IND, active-low (used by Bluetooth sys-

tem to wakeup the host MCU) External address bus negative System configuration pin along with the P2_0 and P2_4 pins, used to set the module in any one of the fol-

lowing three modes:

Application mode (for normal operation) Test mode (to change EEPROM values) Write Flash mode (to load a new firmware into the module), refer to Table 5-1 Flash: Must be pulled-down with 4.7 kOhm to GND Configurable control or indication pin

(Internally pulled-up, if configured as an input) Auxiliary input detector, active-low System configuration pin along with P2_4 and EAN pins used to set the module in any one of the following three modes:

Application mode (for normal operation) Test mode (to change EEPROM values) Write Flash mode (to load a new firmware into the module), refer to Table 5-1 I/O P1_5 Configurable control or indication pin

(Internally pulled-up, if configured as an input) NFC detection pin, active-low Out_Ind_1 Slide switch detector, active-high I/O P0_4 Configurable control or indication pin

(Internally pulled-up, if configured as an input) NFC detection pin, active-low Out_Ind_1 SPKR Right-channel, analog headphone output AOHPM Headphone common mode output/sense input SPKL VDDA MIC1_P MIC1_N Left-channel, analog headphone output Analog reference voltage. Do not connect, for internal use only MIC1 mono differential analog positive input MIC1 mono differential analog negative input MIC1_BIAS Electric microphone biasing voltage AIR AIL Right-channel, single-ended analog input Left-channel, single-ended analog input RST_N System Reset (active-low) O O O P I I P I I I Legend:

I= Input pin O= Output pin I/O= Input/Output pin P= Power pin Note:

All I/O pins can be configured using the UI tool, a Windows utility. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 9 BM62/64 TABLE 1-2:

BM62 MODULE PIN DESCRIPTION (CONTINUED) Pin No Pin Type Pin Name Description 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34

-

I/O P P P P P P P I I I I/O I/O I/O I/O I/O I/O NC P0_1 VDD_IO ADAP_IN BAT_IN No connection Configurable control or indication pin

(Internally pulled-up, if configured as an input) FWD key when Class 2 RF (default), active-low Class 1 Tx control signal for external RF Tx/Rx switch, active-high I/O positive supply. Do not connect, for internal use only 5V power adapter input, used to charge the battery in the Li-Ion battery power applications Power Supply input. Voltage range: 3.2V to 4.2V. Source can either be a Li-Ion battery or any other power rail on the host board AMB_DET Analog input for ambient temperature detection GND Ground reference SYS_PWR BK_OUT System power output derived from ADAP_IN or BAT_IN. Do not connect, for internal use only 1.8V buck regulator output. Do not connect to other devices. For internal use only MFB Multi-Function Button and power-on key UART RX_IND, active-high (used by host MCU to wakeup the Bluetooth system) LED1 LED2 P2_4 P0_2 P0_3 LED driver 1 LED driver 2 System configuration pin along with P2_0 and EAN pins used to set the module in any one of the following three modes:

Application mode (for normal operation) Test mode (to change EEPROM values) Write Flash mode (to load a new firmware into the module), refer to Table 5-1 Configurable control or indication pin

(Internally pulled-up, if configured as an input) Play/Pause key (default), active-low Configurable control or indication pin

(Internally pulled-up, if configured as an input) REV key (default), active-low Buzzer signal output Out_Ind_2 Class 1 Rx Control signal of external RF Tx/Rx switch, active-high HCI_TXD HCI UART data output HCI_RXD HCI UART data input P0_5 Configurable control or indication pin

(Internally pulled-up, if configured as an input) Volume-down key (default), active-low Legend:

I= Input pin O= Output pin I/O= Input/Output pin P= Power pin Note:

All I/O pins can be configured using the UI tool, a Windows utility. DS60001403C-Page 10 Preliminary 2017 Microchip Technology Inc. BM62/64 TABLE 1-2:

BM62 MODULE PIN DESCRIPTION (CONTINUED) Pin No Pin Type Pin Name Description 35 36 37 38 39 40 I/O P2_7 Configurable control or indication pin

(Internally pulled-up, if configured as an input) Volume-up key (default), active-low

-

P

-

-

-

NC GND NC NC NC No connection Ground reference No connection No connection No connection Legend:

I= Input pin O= Output pin I/O= Input/Output pin P= Power pin Note:

All I/O pins can be configured using the UI tool, a Windows utility. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 11 BM62/64 Figure 1-5 illustrates the pin diagram of the BM64 module. FIGURE 1-5:

BM64 MODULE PIN DIAGRAM DS60001403C-Page 12 Preliminary 2017 Microchip Technology Inc. Table 1-3 provides the pin description of the BM64 Module. TABLE 1-3:

BM64 MODULE PIN DESCRIPTION Pin No Pin Type Pin Name Description BM62/64 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 I/O I/O I/O I/O O O O I I P I I I P I/O I/O I/O DR0 RFS0 SCLK0 DT0 I2S interface: digital left/right data I2S interface: left/right clock I2S interface: bit clock I2S interface: digital left/right data AOHPR Right-channel, analog headphone output AOHPM Headphone common mode output/sense input AOHPL Left-channel, analog headphone output MIC_N1 MIC1 mono differential analog negative input MIC_P1 MIC1 mono differential analog positive input MIC_BIAS Electric microphone biasing voltage AIR AIL Right-channel, single-ended analog input Left-channel, single-ended analog input RST_N System Reset (active-low) GND P1_2 P1_3 P0_4 Ground reference EEPROM clock SCL EEPROM data SDA Configurable control or indication pin

(Internally pulled-up, if configured as an input) NFC detection pin, active-low Out_Ind_1 Configurable control or indication pin

(Internally pulled-up, if configured as an input) NFC detection pin, active-low Slide switch detector, active-high Out_Ind_1 18 I/O P1_5 19 20 21 22 23 24 25 26 27 28 I O P P P P P I I I Legend:

I= Input pin Multi-SPK Master/Slave mode control (firmware depen-

dent) HCI_RXD HCI-UART data input HCI_TXD HCI-UART data output VDD_IO I/O positive supply. Do not connect, for internal use only BAT_IN Power Supply input. Voltage range: 3.2V to 4.2V. Source can either be a Li-Ion bat-

tery or any other power rail on the host board ADAP_IN 5V power adapter input, used to charge the battery in the Li-Ion battery power applications SYS_PWR System power output derived from ADAP_IN or BAT_IN. Do not connect, for internal use only AMB_DET Analog input for ambient temperature detection MFB Multi-Function Button and power-on key UART RX_IND, active-high (used by host MCU to wakeup the Bluetooth system) LED2 LED driver 2 LED1 O= Output pin LED driver 1 I/O= Input/Output pin P= Power pin Note:

All I/O pins can be configured using the UI tool, a Windows utility. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 13 BM62/64 TABLE 1-3:

BM64 MODULE PIN DESCRIPTION (CONTINUED) Pin No Pin Type Pin Name Description 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 I/O P3_7 I/O P3_5 I/O P0_0 I EAN I/O I/O I/O I/O I/O I/O I/O I/O I/O DM DP P0_5 P3_0 P3_1 P3_3 P3_6 P0_2 P2_0 Configurable control or indication pin

(Internally pulled-up, if configured as an input) UART TX_IND, active-low (used by Bluetooth system to wakeup the host MCU) Configurable control or indication pin

(Internally pulled-up, if configured as an input) Slide switch detector, active-high Configurable control or indication pin

(Internally pulled-up, if configured as an input) Slide switch detector, active-high, Out_Ind_0 External address bus negative System configuration pin along with the P2_0 and P2_4 pins used to set the module in any one of these modes:

Application mode (for normal operation) Test mode (to change EEPROM values) Write Flash mode (to load a new firmware into the mod-

ule) refer to Table 5-1 Flash: must be pulled-down with 4.7 kOhm to GND Differential data-minus USB Differential data-plus USB Configurable control or indication pin

(Internally pulled-up, if configured as an input) Volume-down key (default), active-low Configurable control or indication pin

(Internally pulled-up, if configured as an input) Auxiliary input detector, active-low Configurable control or indication pin

(Internally pulled-up, if configured as an input) REV key (default), active-low Configurable control or indication pin

(Internally pulled-up, if configured as an input) FWD key (default), active-low Configurable control or indication pin

(Internally pulled-up, if configured as an input) Multi-SPK Master/Slave mode control (firmware dependent) Configurable control or indication pin

(Internally pulled-up, if configured as an input) Play/Pause key (default) System configuration pin along with P2_4 and EAN pins used to set the module in any one of the following modes:

Application mode (for normal operation) Test mode (to change EEPROM values) Write Flash mode (to load a new firmware into the mod-

ule), refer to Table 5-1 I/O P2_7 Configurable control or indication pin

(Internally pulled-up, if configured as an input) Volume-up key (default), active-low P GND Ground reference Legend:

I= Input pin O= Output pin I/O= Input/Output pin P= Power pin Note:

All I/O pins can be configured using the UI tool, a Windows utility. DS60001403C-Page 14 Preliminary 2017 Microchip Technology Inc. BM62/64 tion of speaker output or microphone input. Adaptive fil-

tering is also applied to track the echo path impulse in response to provide echo free and full-duplex user experience. The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs cap-

tured by the microphones and improves mutual under-

standing in communication. The advanced audio features, such as multi-band dynamic range control, parametric multi-band equal-

izer, audio widening and virtual bass are inbuilt. The audio effect algorithms improve the users audio listen-

ing experience in terms of better audio quality after audio signal processing. Figure 2-1 and Figure 2-2 illustrate the processing flow of speaker-phone applications for speech and audio signal processing. 2.0 AUDIO The input and output audios have different stages and each stage can be programmed to vary the gain response characteristics. For microphone, both sin-

gle-ended inputs and differential inputs are supported. To maintain a high quality signal, a stable bias voltage source to the condenser microphones FET is provided. The DC blocking capacitors can be used at both posi-

tive and negative sides of a input. Internally, this analog signal is converted to 16-bit, 8/16 kHz linear PCM data. 2.1 Digital Signal Processor A Digital Signal Processor (DSP) is used to perform speech and audio processing. The advanced speech features, such as acoustic echo cancellation and noise reduction are inbuilt. To reduce nonlinear distortion and to help echo cancellation, an outgoing signal level to the speaker is monitored and adjusted to avoid satura-

FIGURE 2-1:

SPEECH SIGNAL PROCESSING FIGURE 2-2:

AUDIO SIGNAL PROCESSING 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 15 BM62/64 The DSP parameters can be configured using the DSP tool. For additional information on the DSP tool, refer to the IS206X DSP Application Note. Note:

The DSP tool and IS206X DSP Applica-

tion Note document, are available for download from the Microchip web site at:

www.microchip.com/BM62 and www.microchip.com/BM64. 2.2 Codec The built-in codec has a high signal-to-noise ratio

(SNR) performance and it consists of an ADC, a DAC and an additional analog circuitry. Note: The internal codec supports 16-bit resolu-

tion, by adding trailing zeros in LSBs 24-

bit I2S port requirements can be met. Figure 2-3 through Figure 2-6 illustrate the dynamic range and frequency response of the codec. CODEC DAC DYNAMIC RANGE FIGURE 2-3:

Note:

The data corresponds to the 16 Ohm load with 2.8V operating voltage at +25C room temperature. CODEC DAC THD+N VERSUS INPUT POWER FIGURE 2-4:

Note:

The data corresponds to the 16 Ohm load with 2.8V operating voltage at +25C room temperature. DS60001403C-Page 16 Preliminary 2017 Microchip Technology Inc. FIGURE 2-5:

CODEC DAC FREQUENCY RESPONSE (CAPLESS MODE) BM62/64 CODEC DAC FREQUENCY RESPONSE (SINGLE-ENDED MODE) FIGURE 2-6:

Note:

The DAC frequency response corresponds to single-ended mode with a 47 F DC block capacitor. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 17 BM62/64 2.3 Auxiliary Port 2.4 Analog Speaker Output The BM62/64 module supports one analog (line-in) sig-

nal from the external audio source. The analog (line-in) signal can be processed by the DSP to generate differ-

ent sound effects (Multi-band dynamic range compres-

sion and audio widening), which can be configured by using the DSP tool. The BM62/64 module supports the following analog speaker output modes:

Capless mode Recommended for headphone applications in which capless output connection helps to save the BOM cost by avoiding a large DC blocking capacitor. Figure 2-7 illustrates the analog speaker output capless mode Single-ended mode Used for driving an exter-

nal audio amplifier where a DC blocking capacitor is required. Figure 2-8 illustrates the analog speaker output single-ended mode FIGURE 2-7:

ANALOG SPEAKER OUTPUT CAPLESS MODE FIGURE 2-8:

ANALOG SPEAKER OUTPUT SINGLE-ENDED MODE DS60001403C-Page 18 Preliminary 2017 Microchip Technology Inc. BM62/64 BDR, symbol 1 represents 1-bit. However, each sym-

bol in the payload part of EDR packet represents 2/3 bits. This is achieved by using two different modula-

tions, /4 DQPSK and 8 DPSK. 3.5 Adaptive Frequency Hopping

(AFH) The BM62/64 module has an AFH function to avoid RF interference. It has an algorithm to check the nearby interference and for transceiver Bluetooth signal. to choose clear channel 3.0 TRANSCEIVER The BM62/64 module is designed and optimized for Bluetooth 2.4 GHz system. It contains a complete radio frequency transmitter/receiver section. An internal syn-

thesizer generates a stable clock for synchronizing with another device. 3.1 Transmitter The internal power amplifier (PA) has a maximum out-

put power of +4 dBm. This is applied for Class 2 or Class 3 radios without an external RF PA. The transmitter performs the IQ conversion to minimize the frequency drift. 3.2 Receiver The low-noise amplifier (LNA) operates with TR-com-

bined mode for single port application. It can save a pin on the package without having an external Tx/Rx switch. The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysis. A channel filter has been integrated into the receiver channel before the ADC, which is used to reduce the external component count and increase the anti-inter-

ference capability. The image rejection filter is used to reject the image fre-

quency for low-IF architecture. This filter for low-IF architecture is intented to reduce external Band Pass Filter (BPF) component for a super heterodyne archi-

tecture. The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF out-

put power to make a good trade-off for effective dis-

tance and current consumption. 3.3 Synthesizer A synthesizer generates a clock for radio transceiver operation. There is a VCO inside with a tunable internal LC tank that can reduce variation for components. A crystal oscillator with an internal digital trimming circuit provides a stable clock for the synthesizer. 3.4 Modem For Bluetooth 1.2 specification and below, 1 Mbps was the standard data rate based on the Gaussian Fre-

quency Shift Keying (GFSK) modulation scheme. This basic rate modem meets Basic Data Rate (BDR) requirements of Bluetooth 2.0 with Enhanced Data Rate (EDR) specifications. For Bluetooth 2.0 and above specifications, EDR has been introduced to provide the data rates of 1/2/3 Mbps. For baseband, both BDR and EDR utilize the same 1 MHz symbol rate and 1.6 kHz slot rate. For 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 19 BM62/64 NOTES:

DS60001403C-Page 20 Preliminary 2017 Microchip Technology Inc. BM62/64 4.0 POWER MANAGEMENT UNIT 4.1 Charging a Battery The on-chip Power Management Unit (PMU) has two main features: lithium-ion and lithium-polymer battery charger, and voltage regulator. A power switch is used to switch over the power source between the battery and an adapter. Also, the PMU provides current to drive two LEDs. The BM62/64 module has a built-in battery charger, which is optimized for lithium-ion and lithium-polymer batteries. The battery charger includes a current sensor for charging control, user programmable current regula-

tion, and high accuracy voltage regulation. The charging current parameters are configured by the UI tool. Reviving, pre-charging, constant current and constant voltage modes, and re-charging functions are included. The maximum charging current is 350 mA. Figure 4-1 illustrates the charging curve of a battery. FIGURE 4-1:

BATTERY CHARGING CURVE 4.2 Voltage Monitoring 4.3 LED Driver A 10-bit, successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage level detection. The warning level can be programmed by using the UI tool. The ADC provides a granular res-

olution to enable the external MCU to take control over the charging process. Two dedicated LED drivers control the LEDs.They pro-

vide enough sink current (16 step control and 0.35 mA for each step), thus LEDs can be connected directly with the BM62/64 module. The LED settings can be configured using the UI tool. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 21 BM62/64 Figure 4-2 illustrates the LED drivers in the BM62/64 module. FIGURE 4-2:

LED DRIVER 4.4 Under Voltage Protection When the voltage of the SYS_PWR pin drops below the voltage level of 2.9V, the system will shutdown automatically. 4.5 Ambient Detection The BM62/64 module has a built-in ADC for charger thermal protection. Figure 4-3 illustrates the suggested circuit and thermistor, Murata NCP15WF104F. The FIGURE 4-3:

AMBIENT DETECTION charger thermal protection can avoid battery charge in restricted temperature range. The upper and lower limits for temperature values can be configured by using the UI tool. Note: Thermistor must be placed close to the battery in the user application for accurate temperature measurements and to enable thermal shutdown feature. DS60001403C-Page 22 Preliminary 2017 Microchip Technology Inc. BM62/64 5.0 APPLICATION INFORMATION 5.1 Host MCU Interface The BM62/64 module supports UART commands. The UART commands enable an external MCU to control the BM62/64 module. Figure 5-1 illustrates the UART interface between the BM62/64 module and an external MCU. FIGURE 5-1:

HOST MCU INTERFACE OVER UART An external MCU can control the BM62/64 module over the UART interface and wakeup the module with the MFB, P0_0 (BM62) and P3_7 (BM64) pins. Refer to the UART_CommandSet document for a list of functions the BM62/64 module supports and how to use the UI tool to configure the UART and UART Com-

mand Set tool. Note:

The UART Command set tool (SPKCom-

mandSetTool v160.xx) and UART_Com-

mandSet document are available for download from the Microchip web site at:

www.microchip.com/BM62 and www.microchip.com/BM64. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 23 Figure 5-2 through Figure 5-7 illustrate the timing sequences of various UART control signals. FIGURE 5-2:

POWER-ON/OFF SEQUENCE B M 6 2

/

6 4 D S 6 0 0 0 1 4 0 3 C

-

P a g e 2 4 P r e l i i m n a r y i i 2 0 1 7 M c r o c h p T e c h n o o g y I n c

. l FIGURE 5-3:

TIMING SEQUENCE OF RX INDICATION AFTER POWER-ON STATE BM62/64 TIMING SEQUENCE OF POWER-OFF STATE FIGURE 5-4:

Note 1: EEPROM clock = 100 kHz. 2: For a byte write: 0.01 ms x 32 clock x 2 = 640 s. 3: It is recommended to have ramp-down time more than 640 s during the power-off sequence to ensure safe operation of the device. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 25 BM62/64 FIGURE 5-5:

TIMING SEQUENCE OF POWER-ON (NACK) RESET TIMING SEQUENCE IN NO RESPONSE FROM MODULE TO HOST MCU FIGURE 5-6:

Note: When the host MCU sends the UART command and the BM62/64 module does not respond, the MCU resends the UART command. If the BM62/64 module does not respond within 5 secs, the MCU will force the system to Reset. DS60001403C-Page 26 Preliminary 2017 Microchip Technology Inc. TIMING SEQUENCE OF POWER DROP PROTECTION BM62/64 FIGURE 5-7:

Note 1: It is recommended to use the battery to provide the power supply at BAT_IN in to the module. 2: If an external power source or a power adapter is utilized to provide power to the module (ADAP_IN), it is recommended to use a voltage supervisor IC. 3: The Reset IC output pin, RST_N, must be Open drain with delay time 10 ms and the recommended part is G691L293T73. 5.2 I2S Mode Application The BM64 module provides an I2S digital audio output interface to connect with an external codec/DSP. It pro-

vides 8, 16, 44.1, 48, 88.2, and 96 kHz sampling rates for 16-bit and 24-bit data formats. The I2S setting can be configured by using the UI and DSP tools. Figure 5-8 and Figure 5-9 illustrate the I2S signal con-

nection between the BM64 module and an external DSP. Use the DSP tool to configure the BM64 module as a Master/Slave. For additional information on timing specifications, refer to 8.2 Timing specifications. FIGURE 5-8:

BM64 MODULE IN I2S MASTER MODE 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 27 BM62/64 FIGURE 5-9:

BM64 MODULE IN I2S SLAVE MODE 5.3 Reset The BM62/64 module provides a watchdog timer

(WDT) to reset the chip. It has an integrated Power-on Reset (POR) circuit that resets all circuits to a known Power-on state. This action can be driven by an exter-

nal Reset signal, which is used to control the device externally by forcing it into a POR state. The RST_N signal input is active-low and no connection is required in most applications. DS60001403C-Page 28 Preliminary 2017 Microchip Technology Inc. BM62/64 5.4 External Configuration and Programming The BM62/64 module can be configured by using an external configuration tool (EEPROM tool) and the firm-

ware is programmed by using a programming tool

(Flash tool). Note: The EEPROM and Flash tools are avail-

able for download from the Microchip web site at: www.microchip.com/BM62 and www.microchip.com/BM64. Figure 5-10 illustrates the configuration and firmware programming interface on the BM62 module. It is recommended to include a header pin on the main PCB for development. FIGURE 5-10: EXTERNAL PROGRAMMING HEADER CONNECTIONS Configuration and firmware programming modes are entered according to the system configuration I/O pins. Table 5-1 provides the system configuration settings. The P2_0, P2_4 and EAN pins have internal pull up. TABLE 5-1:

SYSTEM CONFIGURATION I/O PIN SETTINGS P2_0 High Low Low P2_4 High High Low Pins EAN Operating Mode Low (Flash), High (ROM) APP mode (Normal operation) Low (Flash), High (ROM) Test mode (Write EEPROM) High Write Flash (BM62 only) 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 29 5.5 Reference Circuit Figure 5-11 through Figure 5-14 illustrate the BM62 module reference circuit for a stereo headset applications. FIGURE 5-11:

BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION B M 6 2

/

6 4 D S 6 0 0 0 1 4 0 3 C

-

P a g e 3 0 P r e l i i m n a r y i i 2 0 1 7 M c r o c h p T e c h n o o g y I n c

. l BM62/64 I I N O T A C L P P A T E S D A E H O E R E T S R O F T U C R C E C N E R E F E R 2 6 M B I I

:

2 1

-

5 E R U G F I 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 31 BM62/64 FIGURE 5-13:

BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION Note:

The section NFC (Optional) contains built-in rectifier circuit of NXP 203F NFC type. DS60001403C-Page 32 Preliminary 2017 Microchip Technology Inc. FIGURE 5-14:

BM62 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION BM62/64 Note:

All ESD diodes in the schematics are reserved for testing. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 33 Figure 5-15 through Figure 5-18 illustrate the BM64 reference circuit for a stereo headset applications. FIGURE 5-15:

BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION B M 6 2

/

6 4 D S 6 0 0 0 1 4 0 3 C

-

P a g e 3 4 P r e l i i m n a r y i i 2 0 1 7 M c r o c h p T e c h n o o g y I n c

. l BM62/64 I I N O T A C L P P A T E S D A E H O E R E T S R O F T U C R C E C N E R E F E R 4 6 M B I I

:

6 1

-

5 E R U G F I 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 35 BM62/64 FIGURE 5-17:

BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION DS60001403C-Page 36 Preliminary 2017 Microchip Technology Inc. FIGURE 5-18:

BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION BM62/64 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 37 BM62/64 NOTES:

DS60001403C-Page 38 Preliminary 2017 Microchip Technology Inc. 6.0 PRINTED ANTENNA INFORMATION 6.1 Antenna Radiation Pattern The BM62/64 module is integrated with one PCB printed antenna, see Figure 6-1. FIGURE 6-1:

RECOMMENDED KEEPOUT AREA FOR PCB ANTENNA BM62/64 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 39 BM62/64 Figure 6-2 illustrates the 3D radiation pattern of the PCB printed antenna at 2441 MHZ. FIGURE 6-2:

PCB ANTENNA 3D RADIATION PATTERN AT 2441 MHZ tion. For the best range performance, keep all external metal at least 15 mm away from the on-board PCB trace antenna. Table 6-1 provides the PCB Antenna characteristics of the BM62/64 module. TABLE 6-1:

BM62/64 PCB ANTENNA CHARACTERISTICS Parameter Values Frequency Peak Gain Efficiency 2400 MHz to 2480 MHz 1.927 dBi 73.41%

6.2 Module Placement Guidelines For a Bluetooth-enabled product, the antenna placement affects the overall performance of the system. The antenna requires free space to radiate RF signals and it must not be surrounded by the ground plane. Microchip recommends that the areas underneath the antenna on the host PCB must not contain copper on the top, inner, or bottom layers, as illustrated in Figure 6-1. A low-impedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommen-

dation, as required for the main PCB EMC noise reduc-

DS60001403C-Page 40 Preliminary 2017 Microchip Technology Inc. Figure 6-3 and Figure 6-4 illustrate the examples of good and poor placement of the BM62/64 module on a host board with GND plane. FIGURE 6-3:

MODULE PLACEMENT GUIDELINES BM62/64 FIGURE 6-4:

GND PLANE ON MAIN APPLICATION BOARD 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 41 BM62/64 NOTES:

DS60001403C-Page 42 Preliminary 2017 Microchip Technology Inc. 7.0 PHYSICAL DIMENSIONS Figure 7-1 illustrates the PCB dimension of the BM62 module. BM62/64 BM62 MODULE PCB DIMENSION FIGURE 7-1:

Note:

PCB dimensions: X: 15.0 mm, Y: 29.0 mm and tolerances: 0.25 mm. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 43 BM62/64 Figure 7-2 illustrates the PCB dimension of the BM64 module. BM64 MODULE PCB DIMENSION FIGURE 7-2:

Note:

PCB dimensions: X: 15.0 mm, Y: 32.0 mm and tolerances: 0.25 mm. DS60001403C-Page 44 Preliminary 2017 Microchip Technology Inc. Figure 7-3 illustrates the recommended PCB footprint of the BM62 module. BM62/64 RECOMMENDED BM62 MODULE PCB FOOTPRINT FIGURE 7-3:

Note 1: The keep-out area is reserved to keep the RF test point away from GND plane. 2: All metal keep-out is used to isolate the PCB antenna. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 45 BM62/64 Figure 7-4 illustrates the recommended PCB footprint of the BM64 module. RECOMMENDED BM64 MODULE PCB FOOTPRINT FIGURE 7-4:

Note 1: The keep-out area is reserved to keep the RF test point away from GND plane. 2: All metal keep-out is used to isolate the PCB antenna. DS60001403C-Page 46 Preliminary 2017 Microchip Technology Inc. BM62/64 8.0 ELECTRICAL CHARACTERISTICS This section provides an overview of the BM62/64 Stereo Audio module electrical characteristics. Additional information will be provided in future revisions of this document, as it becomes available. Absolute maximum ratings for the BM62/64 module are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied. 8.1 Absolute Maximum Ratings Ambient temperature under bias.............................................................................................................. -20C to +70C Storage temperature ...............................................................................................................................-40C to +125C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +3.6V Maximum output current sink by any I/O pin..........................................................................................................12 mA Maximum output current sourced by any I/O pin....................................................................................................12 mA Note: Stresses listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only. The functional operation of the device at those or any other conditions and those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating condi-

tions for extended periods may affect device reliability. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 47 BM62/64 Table 8-1 through Table 8-9 provide the recommended operating conditions and the electrical specifications of the BM62/64 module. TABLE 8-1: RECOMMENDED OPERATING CONDITION Symbol Parameter Min. Typical Max. Unit BAT_IN ADAP_IN Input voltage for battery Input voltage for adapter TOPERATION Operation temperature 3.2 4.5

-20 3.8 5

+25 4.2 5.5

+70 V V C Note:

The absolute and recommended operating condition tables reflect a typical voltage usage for the device. TABLE 8-2:

I/O AND RESET LEVEL Parameter I/O Supply Voltage (VDD_IO) I/O Voltage Levels VIL input logic levels low VIH input logic levels high VOL output logic levels low VOH output logic levels high RST_N Threshold voltage Min. 3.0 0 2.0 2.4 Typical Max. Unit 3.3 1.6 3.6 0.8 3.6 0.4 V V V V V V Note:

These parameters are characterized, but not tested in manufacturing. TABLE 8-3:

BATTERY CHARGER Parameter Min. Typical Max. Unit ADAP_IN Input Voltage Supply current to charger only Maximum Battery Fast Charge Current Headroom > 0.7V

(ADAP_IN = 5V) Headroom = 0.3V to 0.7V

(ADAP_IN = 4.5V) Trickle Charge Voltage Threshold Battery Charge Termination Current,

(% of Fast Charge Current) Note 1: Headroom = VADAP_IN VBAT 4.5 5.0 3 350 175(2) 3 10 5.5 4.5 V mA mA mA V

%

2: When VADAP_IN VBAT > 2V, the maximum fast charge current is 175 mA for thermal protection. 3: These parameters are characterized, but not tested in manufacturing. DS60001403C-Page 48 Preliminary 2017 Microchip Technology Inc. BM62/64 TABLE 8-4:

LED DRIVER Parameter Min. Typical Max. Open-drain Voltage Programmable Current Range Intensity Control Current Step Power Down Open-drain Current Shutdown Current 0 16 0.35 3.6 5.25 1 1 Unit V mA step mA A A Note 1: Test condition: BK_OUT = 1.8V with +25C temperature. 2: These parameters are characterized, but not tested in manufacturing. TABLE 8-5:

AUDIO CODEC ANALOG TO DIGITAL CONVERTER T = 25oC, VDD = 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz to 20 kHz Parameter (Condition) Min. Typical Max. Unit Resolution Output Sample Rate Signal to Noise Ratio (Note 1)

(SNR at MIC or Line-in mode) Digital Gain Digital Gain Resolution MIC Boost Gain Analog Gain Analog Gain Resolution Input full-scale at maximum gain (differential) Input full-scale at minimum gain (differential) 3 dB bandwidth Microphone mode (input impedance) THD+N (microphone input) at 30 mV/rms input 8

-54 92 2 to 6 20 2.0 4 800 20 24 0.02 16 48 4.85 60 Bit kHz dB dB dB dB dB dB mV/rms mV/rms kHz kOhm

%

Note 1: fin = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, THD+N < 1%, 150 mVPP input. 2: These parameters are characterized, but not tested in manufacturing. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 49 BM62/64 TABLE 8-6:

AUDIO CODEC DIGITAL TO ANALOG CONVERTER T = 25oC, VDD = 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz to 20 kHz Parameter (Condition) Min. Typical Max. Unit Over-sampling rate Resolution Output Sample Rate Signal to Noise Ratio (Note 1)

(SNR at capless mode) for 48 kHz Signal to Noise Ratio (Note 1)

(SNR at single-ended mode) for 48 kHz Digital Gain Digital Gain Resolution Analog Gain Analog Gain Resolution Output Voltage Full-scale Swing (AVDD = 2.8V) Maximum Output Power (16 Ohm load) Maximum Output Power (32 Ohm load) Allowed Load Resistive Capacitive THD+N (16 Ohm load) (Note 2) Signal to Noise Ratio (SNR at 16 Ohm load) (Note 3) 16 8

-54

-28 495 128 98 98 2 to 6 1 742.5 34.5 17.2 16 0.05 98 20 48 4.85 3 O.C. 500 fs Bit kHz dB dB dB dB dB dB mV/rms mW mW Ohm pF

%

dB Note 1: fin = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, THD+N < 0.01%, 0 dBFS signal, Load = 100 kOhm 2: fin = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, -1 dBFS signal, Load =16 Ohm 3: fin = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, THD+N < 0.05%, 0 dBFS signal, Load = 16 Ohm 4: These parameters are characterized, but not tested in manufacturing. TABLE 8-7:

TRANSMITTER SECTION FOR BDR AND EDR Parameter Min. Typical Max. Bluetooth specification RF transmit power Class 1 Class 2 EDR/BDR Relative transmit power Note 1: The RF Tx power is modulation value.

-4 15.0(3) 2(3)

-1.8 1

< 20

-6 to 4

-4 to 1 Unit dBm dBm dB 2: The RF Transmit power is calibrated during the production by using the MP tool software and MT8852 Blue-

tooth Test equipment. 3: Test condition: VCC_RF = 1.28V, temperature +25C. DS60001403C-Page 50 Preliminary 2017 Microchip Technology Inc. BM62/64 TABLE 8-8:

RECEIVER SECTION FOR BDR AND EDR Modulation Min. Typical Max. Bluetooth specification Sensitivity at 0.1% BER GFSK Sensitivity at 0.01% BER

/4 DQPSK 8 DPSK

-89

-90

-83

-70

-70

-70 Note 1: Test condition: VCC_RF = 1.28V with temperature +25C. 2: These parameters are characterized, but not tested in manufacturing. Unit dBm dBm dBm TABLE 8-9:

BM62 SYSTEM CURRENT CONSUMPTION System Status Typical(1) System-Off mode Stop advertising (Samsung S5 (SM-G900I)/Android 4.4.2) Standby mode Link mode ESCO link A2DP link Stop advertising (iPhone 6/iOS 8.4) Standby mode Link mode SCO link A2DP link 0.57 0.5 15.1 14.3 0.6 0.6 15.3 15.4 Max. 10 Unit A mA mA mA mA mA mA mA mA Note 1: The measurement data corresponds to Firmware v1.0. 2: Mode definition:

Standby mode: Power-on without Bluetooth link;

Link mode: With Bluetooth link in Low-power mode. 3: The current consumption values are measured with the BM62 EVB as test platform, with BAT_IN = 3.8V. The distance between the smartphone and BM62 EVB is 30 cm, and the speaker is without loading. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 51 BM62/64 8.2 Timing specifications Figure 8-1 and Figure 8-2 illustrate the timing diagram of the BM62/64 module in I2S and PCM modes. FIGURE 8-1:

TIMING DIAGRAM FOR I2S MODES (MASTER/SLAVE) TIMING DIAGRAM FOR PCM MODES (MASTER/SLAVE) FIGURE 8-2:

Note 1: fs: 8,16, 32, 44.1, 48, 88.2 and 96 kHz. 2: SCLK0: 64*fs/256*fs. 3: Word Length: 16-bit and 24-bit. DS60001403C-Page 52 Preliminary 2017 Microchip Technology Inc. Figure 8-3 illustrates the timing diagram of the audio interface. FIGURE 8-3:

AUDIO INTERFACE TIMING DIAGRAM BM62/64 Table 8-10 provides the timing specifications of the audio interface. TABLE 8-10: AUDIO INTERFACE TIMING SPECIFICATIONS PARAMETER SYMBOL MIN TYP MAX UNIT SCLK0 duty ratio SCLK0 cycle time SCLK0 pulse width high SCLK0 pulse width low RFS0 setup time to SCLK0 rising edge RFS0 hold time from SCLK0 rising edge DR0 hold time from SCLK0 rising edge dSCLK tSCLKCY tSCLKCH tSCLKCL tRFSSU tRFSH tDH 50 20 20 10 10 10 50

%

ns ns ns ns ns ns Note:

Test Conditions: Slave Mode, fs = 48 kHz, 24-bit data and SLK0 period = 256 fs. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 53 BM62/64 NOTES:

DS60001403C-Page 54 Preliminary 2017 Microchip Technology Inc. 9.0 SOLDERING RECOMMENDATIONS The BM62/64 module is assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020. The BM62/64 module can be soldered to the main PCB using a standard leaded and lead-free solder reflow profiles. To avoid the damage to the module, follow these recom-

mendations:

Refer to Microchip Technology Application Note AN233 Solder Reflow Recommendation

(DS00233) for the soldering reflow recommenda-

tions FIGURE 9-1:

REFLOW PROFILE BM62/64 Do not exceed peak temperature (TP) of +260C Refer to the Solder Paste data sheet for specific reflow profile recommendations Use no-clean flux solder paste Do not wash the module, as moisture can be trapped under the shield Use only one flow. If the PCB requires multiple flows, apply the module on the final flow Figure 9-1 illustrates the reflow profile of the BM62/64 module. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 55 BM62/64 NOTES:

DS60001403C-Page 56 Preliminary 2017 Microchip Technology Inc. 10.0 ORDERING INFORMATION Table 10-1 provides the ordering information of the BM62/64 module. TABLE 10-1: BM62/64 MODULE ORDERING INFORMATION Module Microchip IC Description Shield BM62/64 Regulatory Certification Part No. BM62 IS2062GM Bluetooth 4.2 Stereo Audio module, Class 2 with RF shield Yes FCC, IC, CE, MIC, NCC, KCC, SRRC, ANATEL BM62SPKS1MC2 BM62 IS2062GM Bluetooth 4.2 Stereo Audio module, No CE BM62SPKA1MC2 Class 2 without RF shield BM64 IS2064GM Bluetooth 4.2 Stereo Audio module, Class 2 with RF shield Yes FCC, IC, CE, MIC, KCC, NCC, SRRC BM64SPKS1MC2 BM64 IS2064GM Bluetooth 4.2 Stereo Audio module, No CE BM64SPKA1MC2 Class 2 without RF shield BM64 IS2064GM Bluetooth 4.2 Stereo Audio module, Class 1 with RF shield Yes FCC, IC, CE, MIC, KCC, NCC, SRRC BM64SPKS1MC1 BM64 IS2064GM Bluetooth 4.2 Stereo Audio module, No CE BM64SPKA1MC1 Class 1 without RF shield BM64 IS2064S Bluetooth 4.2 Stereo Audio module, Class 2 with RF shield Yes FCC, IC, CE, MIC, KCC, NCC, SRRC BM64SPKS1NC2 BM64 IS2064S Bluetooth 4.2 Stereo Audio module, Class 2 without RF shield No CE BM64SPKA1NC2 BM64 IS2064S Bluetooth 4.2 Stereo Audio module, Class 1 with RF shield Yes FCC, IC, CE, MIC, KCC, NCC, SRRC BM64SPKS1NC1 BM64 IS2064S Bluetooth 4.2 Stereo Audio module, Class 1 without RF shield No CE BM64SPKA1NC1 Note: The BM62/64 module can be purchased through a Microchip representative. Go to Microchip web site www.microchip.com for the current pricing and a list of distributors for the product. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 57 BM62/64 NOTES:

DS60001403C-Page 58 Preliminary 2017 Microchip Technology Inc. BM62/64 APPENDIX A: CERTIFICATION NOTICES The BM62 module (BM62SPKS1MC2) has received the regulatory approval for following countries:

BT SIG/QDID: 83345 Korea Taiwan China Brazil Other Regulatory Jurisdictions United States/FCC ID: A8TBM62S2 A.1.1 UNITED STATES Canada

- IC ID: 12246A-BM62S2

- HVIN: BM62SPKS1MC2 Europe/CE Japan/MIC: 005-101204 Korea/KCC: MSIP-CRM-mcp-BM62SPKS1MC2 Taiwan/NCC No: CCAN16LP0270T5 China/SRRC: CMIIT ID: 2016DJ2656 Brazil/ANATEL: 00633-17-03464 The BM64C1 (Class 1) module (BM64SPKS1MC1) has received the regulatory approval for following countries:

BT SIG/QDID: 83336 United States/FCC ID: A8TBM64S1 Canada

- IC ID: 12246A-BM64S1

- HVIN: BM64SPKS1MC1 Europe/CE Japan/MIC: 005-101206 Korea/KCC: MSIP-CRM-mcp-BM64SPKS1MC1 Taiwan/NCC No: CCAN16LP0300T1 China/SRRC: CMIIT ID: 2016DJ2453 The BM64C2 (Class 2) module (BM64SPKS1MC2) has received the regulatory approval for following countries:

the user The BM62/BM64C1/BM64C2 Stereo Audio module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C Inten-

tional Radiators modular approval in accordance with Part 15.212 Modular Transmitter approval. Modular approval allows the BM62/BM64C1/BM64C2 module into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation, provided no changes or modifications are made to the module circuitry. Changes or modifications could void the users author-

ity to operate the equipment. The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions neces-

sary for compliance. integrate to The finished product is required to comply with all appli-

cable FCC equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. For example, com-

pliance must be demonstrated to regulations for other transmitter components within the host product; The requirements for unintentional radiators (Part 15 Sub-

part B Unintentional Radiators), such as digital devices, computer peripherals, radio receivers, etc.;

and to additional authorization requirements for the non-transmitter functions on the transmitter module

(i.e., Verification, or Declaration of Conformity) (e.g., transmitter modules may also contain digital logic func-

tions) as appropriate. BT SIG/QDID: 83345 United States/FCC ID: A8TBM64S2 A.1.2 LABELING AND USER INFORMATION REQUIREMENTS The BM62/BM64C1/BM64C2 Stereo Audio module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as follows:

Canada

- IC ID: 12246A-BM64S2

- HVIN: BM64SPKS1MC2 Europe/CE Japan/MIC: 005-101205 Korea/KCC: MSIP-CRM-mcp-BM64SPKS1MC2 Taiwan/NCC No: CCAN16LP0280T8 China/SRRC: CMIIT ID: 2016DJ2356 A.1 REGULATORY APPROVAL This section outlines the regulatory information of the BM62/BM64C1/BM64C2 Stereo Audio modules for the following countries:

United States Canada Europe Japan 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 59 BM62/64 For the BM62:

Contains Transmitter Module FCC ID: A8TBM62S2 or Contains FCC ID: A8TBM62S2 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation For the BM64C1:

Contains Transmitter Module FCC ID: A8TBM64S1 or Contains FCC ID: A8TBM64S1 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation For the BM64C2:

Contains Transmitter Module FCC ID: A8TBM64S2 or Contains FCC ID: A8TBM64S2 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation A users manual for the finished product must include the following statement:

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equip-

ment generates, uses and can radiate radio fre-

quency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the follow-

ing measures:

Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is con-

nected Consult the dealer or an experienced radio/TV technician for help Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748 available at the FCC Office of Engi-

neering and Technology (OET) Laboratory Division Knowledge

(KDB) https://apps.fcc.gov/oetcf/kdb/index.cfm Database A.1.3 RF EXPOSURE All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multi-transmitter product procedures. BM62 and BM64C2: These modules are approved for installation into mobile or/and portable host platforms. BM64C1:The installation of the transmitter must ensure that the antenna has a separation distance of at least 30 mm from all persons or compliance, and it must be demonstrated according to the FCC SAR procedures. DS60001403C-Page 60 Preliminary 2017 Microchip Technology Inc. A.1.4 HELPFUL WEB SITES Federal Communications Commission http://www.fcc.gov

(FCC):

FCC Office of Engineering and Technology (OET) Lab-

oratory Division Knowledge Database

(KDB):

https://apps.fcc.gov/oetcf/kdb/index.cfm A.2 Canada The BM62/BM64C1/BM64C2 Stereo Audio module has been certified for use in Canada under Industry Canada (IC) Radio Standards Procedure (RSP) RSP-

100, Radio Standards Specification (RSS) RSS-Gen and RSS-247. Modular approval permits the installation of a module in a host device without the need to recertify the device. A.2.1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements for the host device (from Sec-

tion 3.1, RSS-Gen, Issue 4, November 2014): The host device shall be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words Contains transmit-

ter module, or the word Contains, or similar wording expressing the same meaning, as follows:

For the BM62:

Contains transmitter module IC: 12246A-BM62S2 For the BM64C1:

Contains transmitter module IC: 12246A-BM64S1 For the BM64C2:

Contains transmitter module IC: 12246A-BM64S2 User Manual Notice for License-Exempt Radio Appara-

tus (from Section 8.4 RSS-Gen, Issue 4, November 2014): User manuals for license-exempt radio appara-

BM62/64 tus shall contain the following or equivalent notice in a conspicuous location in the user manual or alterna-

tively on the device or both:

This device complies with Industry Canada license-

exempt RSS standard(s). Operation is sub- ject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Indus-

trie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux con-

ditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Transmitter Antenna (from Section 8.3 RSS-Gen, Issue 4, November 2014): User manuals for transmitters shall display the following notice in a conspicuous loca-

tion:

Under Industry Canada regulations, this radio trans-

mitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the trans-

mitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain must be so chosen that the equivalent isotropi-

cally radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformment la rglementation d'Industrie Can-

ada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par Industrie Can-

ada. Dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablisse-

ment d'une communication satisfaisante. The above notice may be affixed to the device instead of displayed in the user manual. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 61 A.3.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM62/BM64C1/BM64C2 Stereo Audio module must follow CE marking requirements. A.3.2 CONFORMITY ASSESSMENT From ETSI Guidance Note EG 203367, section 6.1 Non-radio products are combined with a radio product:

If the manufacturer of the combined equipment installs the radio product in a host non-radio product in equiva-

lent assessment conditions (i.e. host equivalent to the one used for the assessment of the radio product) and according to the installation instructions for the radio product, then no additional assessment of the com-

bined equipment against article 3.2 of the RED is required. BM62/64 A.2.2 RF EXPOSURE All transmitters regulated by the IC must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio com-

munication Apparatus (All Frequency Bands). This transmitter is restricted for use with a specific antenna tested in this application for certification, and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with Canada multi-transmitter product procedures. BM62 and BM64C2: These modules are approved for installation into mobile or/and portable host platforms BM64C1:The installation of the transmitter must ensure that the antenna has a separation distance of at least 30 mm from all persons or compliance must be demon-

strated according to the IC SAR procedures. A.2.3 HELPFUL WEB SITES Industry Canada: http://www.ic.gc.ca/

A.3 Europe The BM62/BM64C1/BM64C2 Stereo Audio module is an Radio Equipment Directive (RED) assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. tested The BM62/BM64C1/BM64C2 Stereo Audio module has been to RED 2014/53/EU Essential Requirements for Health and Safety (Article (3.1(a)), Electro Magnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are summarized in Table A-1/Table A-2/Table A-3. A notified body type examination certificate has also been issued. The ETSI provides guidance on modular devices in Guide to the application of harmonised standards cov-

ering Article 3.1(b) and Article 3.2 of the RED Directive 2014/53/EU to multi-radio and combined radio and non-radio at http://www.etsi.org/deliver/etsi_eg/203300_203399/20 3367/01.01.01_60/eg_203367v010101p.pdf. equipment document available Note: To maintain conformance to the testing listed in Table A-1/Table A-2/Table A-3:

European Compliance Testing, the mod-

ule shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements against the RED. product the DS60001403C-Page 62 Preliminary 2017 Microchip Technology Inc. BM62/64 The European Compliance Testing listed in Table A-1, Table A-2 and Table A-3 was performed using the PCB Trace antenna. TABLE A-1: EUROPEAN COMPLIANCE TESTING (BM62SPKS1MC2/BM62SPKA1MC2) Certification Standards Article Laboratory Report Number Date Safety Health EMC EN 60950-1:2006+A11:2009+A1:

2010+A12:2011+A2:2013 ETSI EN 300 328 V1.9.1 EN 62479:2010 ETSI EN 301 489-1 V1.9.2 ETSI EN 301 489-17 V2.2.1

[3.1(a)] TUV, 10055923 001 2016-04-20 Rheinland, Taiwan 10055775 001 2016-05-05

(BDR/EDR) 10055772 001

(BLE)

[3.1(b)]

10055205 001 2016-05-19

(BM62SPKS1MC2) 10055207 001

(BM62SPKA1MC2) Radio ETSI EN 300 328 V1.9.1

(3.2) 10055775 001 2016-05-05 Notified Body Type Examination Certificate by Notified Body TRLP (0197)

(BDR/EDR) 10055772 001

(BLE) 50053212 001 2016-09-02

(BM62SPKS1MC2) 50053210 001

(BM62SPKA1MC2) TABLE A-2:

EUROPEAN COMPLIANCE TESTING (BM64SPKS1MC1/BM64SPKA1MC1) Certification Standards Article Laboratory Report Number Date Safety Health EMC EN 60950-1:2006+A11:2009+

A1:2010+A12:2011+A2:2013 ETSI EN 300 328 V1.9.1 EN 62479:2010 ETSI EN 301 489-1 V1.9.2 ETSI EN 301 489-17 V2.2.1

[3.1(a)] TUV, 10055924 001 2016-04-20 Rheinland, Taiwan 50041199 001 2016-07-05

(BDR/EDR) 50041198 001

(BLE)

[3.1(b)]

10055194 001 2016-05-19

(Shield) 10055196 001

(No shield) Radio ETSI EN 300 328 V1.9.1

(3.2) 50041199 001 2016-07-05 Notified Body Type Examination Certificate by Notified Body TRLP (0197)

(BDR/EDR) 50041198 001

(BLE) 50053220 001 2016-09-02

(BM64SPKS1MC1) 50053219 001

(BM64SPKA1MC1) 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 63 BM62/64 TABLE A-3:

EUROPEAN COMPLIANCE TESTING (BM64SPKS1MC2/BM64SPKA1MC2) Certification Standards Article Laboratory Report Number Date Safety Health EMC EN 60950-1:2006+A11:2009+A1:

2010+A12:2011+A2:2013 ETSI EN 300 328 V1.9.1 EN 62479:2010 ETSI EN 301 489-1 V1.9.2 ETSI EN 301 489-17 V2.2.1

[3.1(a)] TUV, 10055925 001 2016-04-20 Rheinland, Taiwan 10055788 001 2016-04-29

(BDR/EDR) 10055787 001

(BLE)

[3.1(b)]

10055200 001 2016-05-19

(Shield) 10055202 001

(No shield) Radio ETSI EN 300 328 V1.9.1

(3.2) 10055788 001 2016-04-29 Notified Body Type Examination Certificate by Notified Body TRLP (0197)

(BDR/EDR) 10055787 001

(BLE) 50053216 001 2016-09-02

(BM64SPKS1MC2) 50053215 001

(BM64SPKA1MC2) Integration of this module into a final product does not require additional radio certification provided installa-

tion instructions are followed and no modifications of the module are allowed. Additional testing may be required:

If the host product is subject to electrical appli-

ance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator must contact their confor-

mance laboratory to determine if this testing is required There is an voluntary Electromagnetic Compatibil-

ity (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html A.4.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM62/BM64C1/BM64C2 Stereo Audio module must follow Japan marking requirements. The integrator of the module must refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. A.3.3 HELPFUL WEBSITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Communica-

tions Committee (ECC) at: http://www.ecodocdb.dk/

Additional helpful web sites are:

Radio Equipment Directive (2014/53/EU):

https://ec.europa.eu/growth/single-market/euro-

pean-standards/harmonised-standards/rtte_de European Conference of Postal and Telecommu-

nications Administrations (CEPT):

http://www.cept.org European Telecommunications Standards Insti-

tute (ETSI):

http://www.etsi.org European Communications Committee (ECC):

http://www.ecodocdb.dk The Radio Equipment Directive Compliance Association (REDCA):

http://www.redca.eu/

A.4 Japan The BM62/BM64C1/BM64C2 Stereo Audio module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regu-

lated by the Ministry of Internal Affairs and Communi-

cations (MIC) of Japan pursuant to the Radio Act of Japan. DS60001403C-Page 64 Preliminary 2017 Microchip Technology Inc. For the BM62 Stereo Audio module, due to a limited module size, the technical conformity logo and ID is displayed in the data sheet and/or packaging and can-

not be displayed on the module label. The final product in which this module is being used must have a label referring to the type certified module inside:

For the BM64C1 Stereo Audio module, due to limited module size, the technical conformity logo and ID is displayed in the data sheet and/or packaging and can-

not be displayed on the module label. The final product in which this module is being used must have a label referring to the type certified module inside:

BM62/64 A.5.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM62/BM64C1/BM64C2 Stereo Audio module must follow KC marking requirements. The integrator of the module must refer to the labeling requirements for Korea available on the Korea Communications Com-

mission (KCC) website. The BM62 Stereo Audio module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module:

The BM64C1 Stereo Audio module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module:

For the BM64C2 Stereo Audio module, due to limited module size, the technical conformity logo and ID is displayed in the data sheet and/or packaging and can-

not be displayed on the module label. The final product in which this module is being used must have a label referring to the type certified module inside:

The BM64C2 Stereo Audio module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module:

A.4.2 HELPFUL WEB SITES Ministry of Internal Affairs and Communications (MIC):

http://www.tele.soumu.go.jp/e/index.htm Association of Radio

(ARIB): http://www.arib.or.jp/english/

Industries and Businesses A.5 Korea The BM62/BM64C1/BM64C2 Stereo Audio module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided installation instructions are fol-

lowed and no modifications of the module are allowed. A.5.2 HELPFUL WEB SITES Korea http://www.kcc.go.kr Communications Commission

(KCC):

Research Agency

(RRA):

National http://rra.go.kr Radio A.6 Taiwan The BM62/BM64C1/BM64C2 Stereo Audio module has received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product must con-

tact Microchip Technology sales or distribution partners to obtain a Letter of Authority. Integration of this module into a final product does not require additional radio certification provided installa-

tion instructions are followed and no modifications of the module are allowed. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 65 BM62/64 A.6.1 LABELING AND USER INFORMATION REQUIREMENTS For the BM62 Stereo Audio module, due to limited module size, the NCC mark and ID are displayed in the data sheet and/or packaging and cannot be displayed on the module label. For the BM64SPKS1MC1 Stereo Audio module, due to limited module size, the NCC Mark and ID are displayed in the data sheet and/or packaging and cannot be displayed on the module label. For the BM64SPKS1MC2 Stereo Audio module, due to limited module size, the NCC Mark and ID is displayed in the data sheet and/or packaging and cannot be displayed on the module label. For the BM64SPKS1NC1 Stereo Audio module, due to limited module size, the NCC Mark and ID are displayed in the data sheet and/or packaging and cannot be displayed on the module label. For the BM64SPKS1NC2 Stereo Audio module, due to limited module size, the NCC Mark and ID is displayed in the data sheet and/or packaging and cannot be displayed on the module label. The user's manual must contain below warning (for RF device) in traditional Chinese:

!

DS60001403C-Page 66 Preliminary 2017 Microchip Technology Inc. BM62/64 A.6.2 HELPFUL WEB SITES National Communications Commission

(NCC): http://www.ncc.gov.tw A.7 China The BM62/BM64C1/BM64C2 Stereo Audio module has received certification of conformity in accordance with the China MIIT Notice 2014-

01 of State Radio Regulation Committee

(SRRC) certification scheme. Integration of this module into a final product does not require additional radio certification, provided installa-

tion followed and no modifications of the module are allowed. instructions are A.7.1 LABELING AND USER INFORMATION REQUIREMENTS The BM62 Stereo Audio module is labeled with its own CMIIT ID as follows:

When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement This device contains SRRC approved Radio module CMIIT ID 2016DJ2656. The BM64C1 Stereo Audio module is labeled with its own CMIIT ID as follows:

When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement This device contains SRRC approved Radio module CMIIT ID 2016DJ2453. The BM64C2 Stereo Audio module is labeled with its own CMIIT ID as follows:

When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement This device contains SRRC approved Radio module CMIIT ID 2016DJ2356. A.8 Brazil The BM62 Stereo Audio module has received compliance approval in accordance with the Telecommunications Act of the Federal Republic of Brazil National Telecommunications Agency (ANATEL). Customers seeking to use the compliance approval in their product must contact Microchip Technology sales or to obtain a Letter of distribution partners Authority. 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 67 BM62/64 Integration of this module into a final product does not require additional radio certification provided installa-

tion instructions are followed and no modifications of the module are allowed. A.8.1 LABELING AND USER INFORMATION REQUIREMENTS The BM62 module does not carry the Homologation ID, due to the limited space. Este produto esta homologado pela ANATEL, de acordo com os procedimentos regulamentados pela Resolucao 242/2000, e atende aos requisitos tecnicos aplicados. Para maiores informacoes, consulte o site da ANATEL:

www.anatel.gov.br The End product (Host) manual must include the following statement:

Este product contm a placa BM62SPKS1MC2 cdigo de homologao ANATEL 00633-17-03464. A.9 Other Regulatory Jurisdictions Should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the module for other reasons, contact Micro-

chip for the required utilities and documentation. DS60001403C-Page 68 Preliminary 2017 Microchip Technology Inc. NOTES:

BM62/64 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 69 BM62/64 APPENDIX B: REVISION HISTORY Revision A (May 2016) This is the initial released version of this document. Revision B (December 2016) This revision includes the following changes and minor updates to text and formatting, which were incorpo-

rated throughout the document. TABLE B-1: MAJOR SECTION UPDATES Section Update Description Audio Codec Compliance 1.0Device Overview 2.2Codec Updated the I2S digital audio applicability and SNR details of 20-bit DAC and 16-bit ADC. Updated the certification information. Added USB and BLE and updated the Customized voice prompt details in Table 1-1. Updated Figure 1-4 and Table 1-2 with correct pin names for pins 11 and 12. Deleted the ROM details and updated Table 1-2, Table 1-3. Added a note for internal codec support and addition of trailing zeros. 5.0Application Information Updated Figure 5-16 and Figure 5-18. 8.0Electrical Characteristics Added the storage temperature details. 10.0Ordering Information Updated Table 10-1 with regulatory certification information. Appendix A:Certification Notices Added Certification IDs and updated associated sections. Revision C (May 2017) This revision includes the following changes and minor updates to text and formatting, which were incorpo-

rated throughout the document. TABLE C-1: MAJOR SECTION UPDATES Section Update Description Compliance 1.0Device Overview Added the Brazil certification information. Updated Figure 1-1 and Figure 1-2. Deleted Figure 1-3 and Figure 1-4. Updated Figure 1-5. Updated Table 1-1. Updated pin description for pins ADAP_IN, BAT_IN and SYS_PWR in Table 1-2 and Table 1-3. 10.0Ordering Information Updated Table 10-1 with Brazil regulatory certification information. Appendix A:Certification Notices Updated Europe certification information. Updated KDB and ECC URL links. Added Brazil regulatory certification details. DS60001403C-Page 70 Preliminary 2017 Microchip Technology Inc. NOTES:

BM62/64 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 69 BM62/64 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels:

Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support should contact Customers distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. their Technical support is available through the web site at: http://microchip.com/support Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, following information:

the web site contains the Product Support Data sheets and errata, application notes and sample programs, design resources, users guides and hardware support documents, latest software releases and archived software General Technical Support Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing Business of Microchip Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchips customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access www.microchip.com. Under Customer Change Notification and registration instructions. the Microchip web site at Support, click on the follow DS60001403C-Page 72 Preliminary 2017 Microchip Technology Inc. NOTES:

BM62/64 2017 Microchip Technology Inc. Preliminary DS60001403C-Page 71 BM62/64 Note the following details of the code protection feature on Microchip devices:

Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as unbreakable. Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Companys quality system processes and procedures are for its PIC MCUs and dsPIC DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchips quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. 2017, Microchip Technology Incorporated, All Rights Reserved. CERTIFIED BY DNV ISBN:

== ISO/TS 16949 ==

DS60001403C-Page 72 Preliminary 2017 Microchip Technology Inc. Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support:

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support Web Address:

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Azimuth = -2.5 Elevation = 8.2 Roll = -48.7 se (dB) Respons

-12

-15 18 21 Azimuth = -23.8 Elevation = -85.4 Roll = 154.9 se (dB) uodsey 15 18 Frequency (MHz) Ant. Port Input Pwr. (dBm) Tot. Rad. Pwr. (dBm) Efficiency (%) Gain (dBi)

 

 

Permissive change letter Date: 2022-10-13 Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 Subject: C2PC for FCC ID: A8TBM64S1 Dear Examiner, This is to request a Class II permissive change for FCC ID: A8TBM64S1 originally granted on 11/03/2017. This application covers the component changes for Power supply optimization, optimal start-up and alternate parts details are captured in the exhibits (Schematic, Change Parts List). It is compliant with KDB 178919 III D standards. Sincerely, By:

(Signature) Steve Caldwell / Vice President

(Print name)

 

 

Date: 2022-10-13 Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Road, Columbia, MD 21046, USA Subject: Confidentiality Request for FCC ID: A8TBM64S1 Pursuant to FCC 47 CRF 0.457(d), the applicant requests that a part of the subject FCC/IC application be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent n/a Permanent Permanent Permanent Permanent Permanent Permanent Permanent Exhibit Block Diagrams External Photo Internal Photos ***

Operation Description/Theory of Operation Schematics Test Setup***

Tune-Up Procedure Users Manual***

Part List/ Antenna Construction Microchip Technology Inc. has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public.

(*** Exceptional case for Permanent Confidentiality for these Exhibits by PAG only) Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of 180 days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TUV Rheinland in the event information regarding the product or the product is made available to the public. TUV Rheinland will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. Sincerely, By:

_______________________________________ ___Steve Caldwell / Vice President___

(Signature)

(Print name/Title) Tel: 480-792-7464 Email: steve.caldwell@microchip.com MS-0044715 Page 1 of 1 Revision 1

 

 

Applicant/Grantee Microchip Technology Inc. FCC ID:

A8TBM64S1 X Request for Modular Approval Request for Limited Modular Approval Section 15.212 Modular Transmitters /

Requirements Device Conditions Comply (Y/N) Single Modular Approval Requirements The radio elements must have the radio frequency circuitry must be shielded. Physical/discrete and tuning capacitors may be located external to the shield, but must be on the module assembly. The module shall have buffered modulation/data input(s) (if such inputs are provided) to ensure that the module will comply with the requirements set out in the applicable RSS standard under conditions of excessive data rates or over-modulation. The module shall have its own power supply regulation on the module. This is to ensure that the module will comply with the requirements set out in the applicable standard regardless of the design of the power supplying circuitry in the host device which houses the module. Requirements set out in the applicable standard regardless of the design of the power supplying circuitry in the host device which houses the module. The module shall comply with the provisions for external power amplifiers and antennas detailed in this standard. The Equipment certification submission shall contain a detailed description of the configuration of all antennas that will be used with the module. The module shall be tested for compliance with the applicable standard in a stand-

alone configuration, i.e. the module must not be inside another device during testing. The module has its own RF shielding. Shield Can is employed on the board structure, please see exhibition External Photo, the emission measurement was conducted without further shielding added. All modulation and data input(s) are buffered. The EUT has buffered data inputs, it is integrated on the RF chip Output power is controlled by the RF Chip and de-coupled from supply voltage variations. Frequencies are determined by Crystal The antenna is part of the module The modular transmitter was tested in a stand-alone configuration via a UART Interface. The module shall comply with the Category I equipment labelling requirements. In the exhibition OEM manual, there are Instructions given to the OEM on how to label the end product. 1 2 3 4 5 6 Y Y Y Y Y Y The modular transmitter complies with all specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer will provide adequate instructions along with the module to explain any such requirements. A copy of these instructions is included in this application for equipment authorization:

Address compliance with the Commission's RF exposure limits in Sections 1.1310 and 2.1093. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF exposure compliance in accordance with Section 15.247(b)(4). 7 8a Instructions in User Manual Please refer the Maximum Permissible Exposure Information. Y Y A limited modular approval may be granted for single or split modular transmitters that do not comply with all of the above requirements, e.g., shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation, if the manufacturer can demonstrate by alternative means in the application for equipment authorization that the modular transmitter meets all the applicable Part 15 requirements under the operating conditions in which the transmitter will be used. Limited modular approval also may be granted in those instances where compliance with RF exposure rules is demonstrated only for particular product configurations. The applicant for certification must state how control of the end product into which the module will be installed will be maintained such that full compliance of the end product is always ensured. Signature Name/Title: Steve Caldwell / Vice President Company Name: Microchip Technology Inc. Date: 10.13.2022