FCC ID: VPYLB1CDIMP003 1CD

 

Preliminary Specification Number : SP-ZV1CD-E WiFi Module Data Sheet Broadcom BCM43362 WiFi + ST Micro STM32F405 MCU Tentative P/N : LBWA1ZV1CD-716

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 1 / 24 The revision history of the product specification Change Reason Revision Code Revision Page Issued Date Apr.11.2014 May.23.2014 Jun.3.2014 Jul.1.2014 Jul.31.2014 Oct.14.2014 A B C D E P4 P10 P17 P9 P11 P12 P18 P10 P18 P18 Changed Items First issued 3. Block Diagram, 2MBit -> 4MBi 7. Absolute Maximum Rating 8. Operating Condition 9. Electric characteristics 14. Recommended Components 5. LED Drive 6. Phototransistor Corrected reference paragraph 10. External clock source characteristics add 11. Power Up Sequence Changed "NRST" to "RESET_L"

15.4. Low Power Schematic

-ABS07-120-32.768kHz-T add

-Changed "ST3215SB32768B0HPWB1"

"ST3215SB32768B0HPWB3"

7. SPI Flash Requirements Added SPI Flash Requirements 16. Recommended Components Added SPI Flash 16. Recommended Components

-Changed APT2012P3BT with KDT00030TR

-Changed S24FLxxx with S25FLxxx to

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 2 / 24 TABLE OF CONTENTS 1. Scope ..................................................................................................................................................... 3 2. Part Number ........................................................................................................................................... 3 3. Block Diagram ........................................................................................................................................ 4 4. Dimensions, Marking and Terminal Configurations ............................................................................... 5 4.1. Dimensions ...................................................................................................................................... 5 4.2. Terminal Configurations................................................................................................................... 6 4.3. Pin Mux Table .................................................................................................................................. 8 5. LED Drive ............................................................................................................................................... 9 6. Phototransistor ....................................................................................................................................... 9 7. SPI Flash Requirements ...................................................................................................................... 10 8. Absolute Maximum Rating ................................................................................................................... 10 9. Operating Condition ............................................................................................................................. 10 10. Electric characteristics.........................................................................................................................11 11. External clock source characteristics ..................................................................................................11 11.1. Low-speed external user clock characteristics.............................................................................11 12. Power Up Sequence .......................................................................................................................... 12 12.1. Without RESET_L control............................................................................................................ 12 12.2. With RESET_L control................................................................................................................. 12 12.2.1. RESET_L Circuit................................................................................................................... 12 13. RF Characteristics.............................................................................................................................. 13 13.1. RF Characteristics for IEEE802.11b (11Mbps mode unless otherwise specified.)..................... 13 13.2. RF Characteristics for IEEE802.11g (54Mbps mode unless otherwise specified.)..................... 13 13.3. RF Characteristics for IEEE802.11n (65Mbps(MCS7) mode unless otherwise specified.)........ 14 14. Land Pattern (Top View)..................................................................................................................... 15 15. Reference Circuit................................................................................................................................ 16 15.1. Low Cost Schematic.................................................................................................................... 16 15.2. Low Power Schematic................................................................................................................. 17 16. Recommended Components ............................................................................................................. 18 16.1. Bi-color LED................................................................................................................................. 18 16.2. Phototransistor............................................................................................................................. 18 16.3. SPI Flash ..................................................................................................................................... 18 16.4. Low Cost Schematic.................................................................................................................... 18 16.5. Low Power Schematic................................................................................................................. 18 17. Tape and Reel Packing ...................................................................................................................... 19 18. NOTICE.............................................................................................................................................. 22 18.1. Storage Conditions: ..................................................................................................................... 22 18.2. Handling Conditions: ................................................................................................................... 22 18.3. Standard PCB Design (Land Pattern and Dimensions): ............................................................. 22 18.4. Notice for Chip Placer:................................................................................................................. 22 18.5. Soldering Conditions: .................................................................................................................. 23 18.6. Cleaning:...................................................................................................................................... 23 18.7. Operational Environment Conditions: ......................................................................................... 23 18.8. Input Power Capacity: ................................................................................................................. 23 19. PRECONDITION TO USE OUR PRODUCTS................................................................................... 24 Please be aware that an important notice concerning availability, standard warranty and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet.

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 3 / 24 1. Scope This specification is for the LBWA1ZV1CD smart module that provides connectivity to the internet via WiFi with embedded OS that works with the Electric Imp cloud service.

802.11 b/g/n WiFi

- 20MHz 11n channels, 1 x 1 32-bit Cortex M4 processor

- Robust embedded operating system with fail-safe firmware updates

- Virtual machine for vendor firmware LED drive for red/green status LEDs

Phototransistor input for Electric imps patent-pending BlinkUpTM technology to provide optical configuration

23 user selectable I/Os

- GPIO, PWM, Analog input & output, SPI, UART, I2C

- Dedicated SPI bus for local storage Low power 4uA sleep mode (with external load switch)

- Option for coin cell RTC battery backup

Compliant with the RoHS directive 2. Part Number Sample Part Number LBWA1ZV1CD-716

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 4 / 24 3. Block Diagram 3.3V switch power supply antenna 4Mbit or higher density SPI Flash Load switch opto 23 I/Os STM32F405 BCM43362 SPDT LPF 26MHz xtal 26MHz xtal LBWA1ZV1CD-716 32.768KHz xtal DC/DC inductor

<Low Power Block Diagram>

antenna 4Mbit SPI Flash 3.3V LDO opto 23 I/Os STM32F405 BCM43362 SPDT LPF 26MHz xtal 26MHz xtal LBWA1ZV1CD-716 DC/DC inductor

<Low Cost Block Diagram>

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 5 / 24 4. Dimensions, Marking and Terminal Configurations 4.1. Dimensions

< Top View >

< Side View >

< Bottom View >

Mark L a1 a4 b2 c3 e1 e4 e7 e10 Dimensions 10.0 +/- 0.2 0.65 +/- 0.1 0.35 +/- 0.1 0.30 +/- 0.2 0.80 +/- 0.1 0.30 +/- 0.1 0.80 +/- 0.1 0.75 +/- 0.1 0.60 +/- 0.1 Mark W a2 a5 c1 c4 e2 e5 e8 m1 Dimensions 7.9 +/- 0.2 0.35 +/- 0.1 0.80 +/- 0.1 0.80 +/- 0.1 0.80 +/- 0.1 0.30 +/- 0.1 0.40 +/- 0.1 0.30 +/- 0.1 0.40 +/- 0.1 Mark T a3 b1 c2 c5 e3 e6 e9 m2 Dimensions 1.25 max. 0.35 +/- 0.1 0.30 +/- 0.2 0.80 +/- 0.1 0.80 +/- 0.1 0.30 +/- 0.1 0.30 +/- 0.1 0.50 +/- 0.1 0.40 +/- 0.1

(unit : mm)

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 6 / 24 4.2. Terminal Configurations No. Terminal Name Type Description 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 GND OPTO_Bias OPTO_IN PinW OSC32_IN OSC32_OUT PinN PSU_EN WLAN_POWER_EN GND GND ANT GND GND VDD WLAN_ANT_CTL2 WLAN_ANT_CTL1 VDD_PA VDD_PA VDD_WLAN VDD_WLAN VDD_DCDC_IN GND

-

O I Ground Phototransistor bias voltage Phototransistor input I/O I/O, please refer to Pin mux table I O MCU sleep clock input MCU sleep clock output I/O I/O, please refer to Pin mux table O O

-

-

-

-

-

PI O O PI PI PI PI PI

-

External power supply enable External power gate enable Ground Ground Antenna Ground Ground Power supply for MCU VDD and WLAN Digital IO Antenna switch control. Default is low. NC if not in use. Antenna switch control. Default is high. NC if not in use. Power supply for Internal Power Amplifier. Power supply for WLAN IC Voltage input for core LDO, low noise LDO1 and VCO/LDO Ground VDD_DCDC_OUT PO Voltage output for core LDO. SPIFLASH_NCS SPIFLASH_MISO O I SPI flash nCS SPI flash MISO

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 SPIFLASH_MOSI SPIFLASH_SCK LED_RED LED_GREEN PinM PinL PinK PinJ PinH GND PinG PinF PinE PinD PinC PinB PinA VDDA VBAT PinY GND PinV GND DNC GND RESET_L GND GND Preliminary Specification Number : SP-ZV1CD-E 7 / 24 SPI flash MOSI SPI flash CLK Must be connected to the Red terminal of the indicator LED Must be connected to the Green terminal of the indicator LED I/O, please refer to Pin mux table I/O, please refer to Pin mux table I/O, please refer to Pin mux table I/O, please refer to Pin mux table I/O, please refer to Pin mux table Ground I/O, please refer to Pin mux table I/O, please refer to Pin mux table I/O, please refer to Pin mux table I/O, please refer to Pin mux table I/O, please refer to Pin mux table I/O, please refer to Pin mux table I/O, please refer to Pin mux table MCU analog power and reference, must be connected to VDD MCU retention RAM and RTC backup supply O O O O I/O I/O I/O I/O I/O

-

I/O I/O I/O I/O I/O I/O I/O PI PI I/O I/O, please refer to Pin mux table

-

Ground I/O I/O, please refer to Pin mux table

-

-

-

I

-

-

Ground Do not connect Ground MCU reset, internally pulled up Ground Ground

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 8 / 24

-

-

-

I/O I/O I/O I/O I/O I/O I/O

-

-

Ground Ground Ground I/O, please refer to Pin mux table I/O, please refer to Pin mux table I/O, please refer to Pin mux table I/O, please refer to Pin mux table I/O, please refer to Pin mux table I/O, please refer to Pin mux table I/O, please refer to Pin mux table MCU analog ground, must be connected to GND Ground 55 56 57 58 59 60 61 62 63 64 65 GND GND GND PinQ PinR PinT PinP PinS PinU PinX VSSA 66-76 GND 4.3. Pin Mux Table Pin uartFG uartQRPW uartUVGD uartWJ uartDM i2cFG i2cAB spiEBCA spiLGDK ADC DAC PWM Wake from sleep TX RX Pin A Pin B Pin C Pin D Pin E Pin F Pin G Pin H Pin J Pin K Pin L Pin M Pin N Pin P Pin Q Pin R Pin S Pin T Pin U Pin V Pin W Pin X Pin Y CTS RTS RX SCL SDA TX RX RTS TX RX CTS TX RX TX SCL SDA nSS MISO SCLK MOSI SCLK MISO nSS MOSI yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes Pin trig pulse gen for C for K,X for G for D State change callback yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 9 / 24 5. LED Drive The indicator LED should be bicolor, because red, green and amber (red+green) are used to indicate status. The LED drive pins will auto-detect common anode or common cathode parts. The detection is done by looking to see which way up the LED_RED pin is idling at boot; to ensure this works correctly, please place a 100k resistor in parallel with the red LED. The current drive on these pins is 20mA maximum. Please refer to paragraph 15 for the recommended LEDs.

<Common anode diagram>

<Common cathode diagram>

6. Phototransistor The phototransistor is used to receive BlinkUp configuration data. The bias resistor connected between OPTO_IN and GND may need to be adjusted to ensure adequate sensitivity and response time - in general you need at least 500mV swing on the OPTO_IN pin between black and white states, with the worst

(dimmest) BlinkUp sender you can find. End-user BlinkUp send data at between 30 and 60 bits per second, depending on the users device. For factory configuration, data is typically sent at 142 bits per second using red LED(s) in a test fixture. If your application does not require optical configuration, config can be sent electrically at 120 bits per second from another micro using the OPTO_IN pin. Please contact us for more details. Please refer to paragraph 15 for the recommended phototransistors.

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 10 / 24 7. SPI Flash Requirements An external SPI Flash part is required. The minimum size of the SPI Flash is 4 Mbit (512 kByte). The area below address 0x70000 (448 kByte) is reserved for use by the OS. The remainder of the available space is made available to user code programmatically. Areas below address 0x70000 will be erased and reprogrammed by the OS; applications using pre-programmed SPI Flash components must not use space below this address. Minimum Size Reserved for OS (do not pre-program) 4 Mbit (512 kByte) 0x000000 to 0x70000 (448 kByte) 8. Absolute Maximum Rating Storage Temperature Supply Voltage VDD VDD_PA VDD_WLAN min.

-40

-0.3

-0.3

-0.3 max.

+85 4 6 6 unit deg.C V V V Caution! The absolute maximum ratings indicate levels where permanent damage to the device can occur, even if these limits are exceeded for only a brief duration. Functional operation is not guaranteed under these conditions. Opertation at absolute maximum conditions for extended periods can adversely affect long-term reliabilty of the device. 9. Operating Condition Operating Temperature Range(*1) Specification Temperature Range VDD VDD_PA VDD_WLAN VBAT Backup operating Voltage Supply Voltage min.

-40

-20 1.8 2.3(*2) 2.3(*2) 1.65 typ. 3.3 3.3 3.3 3.3 max.

+85

+70 3.6 4.8(*2) (*3) 4.8(*2) (*3) 3.6 unit deg.C deg.C V V V V

[Note] All RF characteristics in this datasheet are defined by Specification Temperature Range

(*1) Functionality is guaranteed but specifications require derating at extreme temperatures.

(*2)The BCM43362 is functional across this range of voltage. RF performance is guaranteed only 3.0V < VDD_PA/WLAN < 4.8V

(*3) The maximum continuous voltage is 4.8V. Voltages up to 5.5V for up to 10 seconds, cumulative duration, over the lifetime of the device are allowed voltages as high 5.0V for up to 250 seconds, cumulative duration, over the lifetime of the device are allowed.

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. 10. Electric characteristics Preliminary Specification Number : SP-ZV1CD-E 11 / 24 Parameter IDD IDDA VIH VIL IOUT I/O input leakage current Load capacitance Description Normal operation, WiFi on Normal operation, WiFi power-save mode enabled WiFi is off, processor sleep, RTC on, nvram preserved Current input on VDDA I/O input high level voltage I/O input low level voltage Output current on any single I/O pin Output current on LED_RED pin Output current on LED_GREEN pin Total output current on all I/O pins including LED_RED & LED_GREEN VSS VIN VDD Pins A to Y Min 0.7Vdd Vss-0.3

-8

-20

-20

-80 Typ 80 8 6 70 15 Max 250(*1) 250(*1) 500 3.6 0.3Vdd 8 20 20

-80 6 Unit mA mA uA uA V V mA mA mA mA uA pF

(*1) 250mA current is during worst-case TX events. These are a maximum of ~4.8ms long (802.11b 1Mbps) 11. External clock source characteristics 11.1. Low-speed external user clock characteristics Symbol fLSE_ext VLSEH VLSEL tW(LSE) tf(LSE) tr(LSE) tr(LSE) Cin(LSE) DuCy(LSE) Duty cycle Parameter User External clock source frequency(*1) OSC32_IN input pin high level voltage OSC32_IN input pin low level voltage OSC32_IN high or low time(*1) OSC32_IN rise or fall time(*1) OSC32_IN input capacitance(*1) IL

CL C0 OSC32_IN Input leakage current

Load Capacitance Shunt Capacitance

(*1) Guaranteed by design, not tested in production Conditions VSSINDD

Min

-

0.7VDD VSS 450

-

-

30

-

Max 1,000 VDD 0.3VDD

-

50

-

70 1

Typ 32.768

-

-

-

-

5

-

-

6 1.5 Unit kHz V ns pF

%

uA

pF pF

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 12 / 24 12. Power Up Sequence 12.1. Without RESET_L control Ramp time 90% > 40s Timing same as VDD_3P3 VDD_3P3 VDD_WLAN VDD_PA

*Power down sequence is opposite sequence of power up. 12.2. With RESET_L control Ramp time 90% > 40s Timing same as VDD_3P3

> 2 Sleep Clock cycles ( > 61 s ) VDD_3P3 VDD_WLAN VDD_PA RESET_L

*Power down sequence is opposite sequence of power up. 12.2.1. RESET_L Circuit External Reset circuit (1) RESET_L (2) VDD (3) RPU (4) 0.1uF Internal Reset Filter Murata Module

(1) The reset network protects the device against parasitic resets.

(2) The use must ensure that the level on the RESET_L pin can go below the 0.8V. Otherwise the reset is not taken into account by the device.

(3) Vdd=3.3V(for the 1.8Vdd3.6 voltage range)

(4) RPU=40k ohm (for the 30RPU50kohm range)

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 13 / 24 13. RF Characteristics 13.1. RF Characteristics for IEEE802.11b (11Mbps mode unless otherwise specified.) Conditions: 25deg.C, VDD=VDD_WLAN=3.3V Items Specification Mode Frequency Data rate Target Max Output Power

- DC Characteristics -

1. DC current 1) Tx mode 2) Rx mode

- Tx Characteristics -

2. Power Levels

- Rx Characteristics -

3. Minimum Input Level Sensitivity 1) 11Mbps (FER < 8%) 4. Maximum Input Level (FER < 8%) 5. Adjacent Channel Rejection

(FER < 8%) Items Specification Mode Frequency Data rate Target Max Output Power

- DC Characteristics -

1. DC current 1) Tx mode (1024byte, 20usec interval) 2) Rx mode

- Tx Characteristics -

2. Power Levels

- Rx Characteristics -

3. Minimum Input Level Sensitivity 1) 54Mbps (PER < 10%) 4. Maximum Input Level (PER < 10%) 5. Adjacent Channel Rejection

(PER < 10%) Contents IEEE802.11b DSSS / CCK 2400 - 2483.5MHz 1, 2, 5.5, 11Mbps 17.0 min.

-

-

min. 15.0 min.

-

-10 35 Typ. TBD 120 Typ. 17.0 typ.

-87

-

-

min.

-

-

min. 11.0 min.

-

-20

-1 Typ. 295 125 typ. 13.0 typ.

-73

-

-

max. TBD 170 max. 19.0 max.

-76

-

-

max. 370 170 max. 15.0 max.

-65

-

-

Unit mA mA Unit dBm Unit dBm dBm dB Unit mA mA unit dBm Unit dBm dBm dB Contents IEEE802.11g OFDM 2400 - 2483.5MHz 6, 9, 12, 18, 24, 36, 48, 54Mbps 13.0dBm 13.2. RF Characteristics for IEEE802.11g (54Mbps mode unless otherwise specified.) Conditions: 25deg.C, VDD=VDD_WLAN=3.3V

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. 13.3. RF Characteristics for IEEE802.11n (65Mbps(MCS7) mode unless otherwise specified.) Conditions: 25deg.C, VDD=VDD_WLAN=3.3V Preliminary Specification Number : SP-ZV1CD-E 14 / 24 Items Specification Mode Frequency Data rate Target Max Output Power

- DC Characteristics -

1. DC current 1) Tx mode (1024byte, 20usec interval) 2) Rx mode

- Tx Characteristics -

2. Power Levels

- Rx Characteristics -

3. Minimum Input Level Sensitivity 1) 65Mbps (PER < 10%) 4. Maximum Input Level (PER < 10%) 5. Adjacent Channel Rejection

(PER < 10%) Contents IEEE802.11n OFDM 2400 - 2483.5MHz 12.0dBm 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps min.

-

-

min. 10.0 min.

-

-20

-2 Typ. 280 125 typ. 12.0 typ.

-70

-

-

max. 350 170 max. 14.0 max.

-64

-

-

Unit mA mA Unit dBm Unit dBm dBm dB

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. 14. Land Pattern (Top View) Preliminary Specification Number : SP-ZV1CD-E 15 / 24

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

Unit : mm 15. Reference Circuit 15.1. Low Cost Schematic Please refer to paragraph 16 for the low cost recommended components. Preliminary Specification Number : SP-ZV1CD-E 16 / 24

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. 15.2. Low Power Schematic Please refer to paragraph 16 for the low power recommended components. Preliminary Specification Number : SP-ZV1CD-E 17 / 24

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 18 / 24 Manufacturer Manufacturers part number SunLED Liteon SunLED Bivar SunLED Liteon XZMDKVG59W-1 LTST-C195KGJRKT XZMDKVG88W SM1204BC XLMDKVG34M LTL1BEKVJNN Manufacturer Manufacturers part number Everlight Fairchild SunLED Everlight SunLED Honeywell Manufacturer Spansion Macronix Spansion Macronix PT17-21C/L41/TR8 KDT00030TR XZRNI56W-1 PT12-21C/TR8 XRNI30W-1 SDP8405-003 Manufacturers part number S25FL204K MX25L4006E S25FL132K MX25L3206E 16. Recommended Components 16.1. Bi-color LED Surface mount top-view side-view Through-hole 3mm 16.2. Phototransistor Surface mount top-view side-view Through-hole 3mm 16.3. SPI Flash Size 4 Mbit 4 Mbit 32 Mbit 32 Mbit 16.4. Low Cost Schematic Size U2 Q1 D1 L1 Manufacturer Manufacturers part number please refer to paragraph 16.3 please refer to paragraph 16.2 please refer to paragraph 16.1 Murata LQM21PN1R5MC0 16.5. Low Power Schematic Ref Des U2 U3 Q1 D1 L1 Y1 Manufacturer Manufacturers part number please refer to paragraph 16.3 Diodes Inc. AP2281 please refer to paragraph 16.2 please refer to paragraph 16.1 Murata Kyocera Abracon Abracon LQM21PN1R5MC0 ST3215SB32768B0HPWB3 ABS25-32.768KHZ-T ABS07-120-32.768kHz-T Description SPI Flash clear lens phototransistor red/green bicolor LED 1.5uH inductor Description SPI Flash 2A load switch clear lens phototransistor red/green bicolor LED 1.5uH inductor 32.768kHz crystal

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 19 / 24 17. Tape and Reel Packing

(1) Dimensions of Tape (Plastic tape)

. 0 1 0 5 7 1

. 2.00.1 4.00.1

1.5+0.1/-0.0 0.300.05

. 1 0 5 1 1

. 1 0 5 0 1

.

,

. 1 0

-

/

3 0 0 4 2

.

2.00.1/-0.0 16.00.1 8.40.1 feeding direction 1.5 max.

(1.40.1) 1) The corner and ridge radiuses (R) of inside cavity are 0.3mm max. 2) Cumulative tolerance of 10 pitches of the sprocket hole is +/-0.2mm 3) Measuring of cavity positioning is based on cavity center in accordance with JIS/IES standard.

(2) Dimensions of Reel 25.50.6 2.00.5

130.2

) 0 0 1

(

) 0 3 3

(

(unit : mm) 30.5 max.

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. PreliminarySpecificationNumber:SP-ZV1CD-E20/24<SpecificationmaybechangedbyMuratawithoutnotice>MurataManufacturingCo.,Ltd.(3)TapingDiagrams[1]FeedingHole:Asspecifiedin(1)[2]Holeforchip:Asspecifiedin(1)[4]Basetape:Asspecifiedin(1)(4)LeaderandTailtape[2][3][4][3][1]FeedingHoleChipFeedingDirectionPin1MarkingTailtape(Nocomponents)40to200mmComponentsNocomponents150mmmin.Leadertape(Covertapealone)250mmmin.Feedingdirection Preliminary Specification Number : SP-ZV1CD-E 21 / 24

(5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user.

(6) The cover tape and base tape are not adhered at no components area for 250mm min.

(7) Tear off strength against pulling of cover tape : 5N min.

(8) Packaging unit : 1000pcs./ reel

(9) material : Base tape : Plastic

: Plastic Real Cover tape, cavity tape and reel are made the anti-static processing.

(10) Peeling of force : 0.7N max. in the direction of peeling as shown below. 165 to 180 0.7 N max. Cover tape

(11) Packaging (Humidity proof Packing) Base tape Desiccant

Humidity

Indicator

Label

Label

Anti-humidity

Plastic Bag Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator.

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 22 / 24 18. NOTICE 18.1. Storage Conditions:

Please use this product within 6month after receipt.

- The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH.

(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)

- The product left more than 6months after reception, it needs to be confirmed the solderbility before used.

- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).

- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)

- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be used within 168hours.

- When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition: 125+5/-0deg.C, 24hours, 1time The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant. 18.2. Handling Conditions:

Be careful break products. in handling or transporting products because excessive stress or mechanical shock may Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solder ability and destroy by static electrical charge. 18.3. Standard PCB Design (Land Pattern and Dimensions):

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 18.4. Notice for Chip Placer:

When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products.

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 23 / 24 18.5. Soldering Conditions:

The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 C. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions(Example) Within 3s 240to 250 deg.C 220 deg.C 180 deg.C 150 deg.C Cooling down Slowly Pre-heating Within 120s Within 60s time(s) Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 18.6. Cleaning:

Since this Product is Moisture Sensitive, any cleaning is not permitted. 18.7. Operational Environment Conditions:

Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur.

- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).

- In an atmosphere containing combustible and volatile gases.

- Dusty place.

- Direct sunlight place.

- Water splashing place.

- Humid place where water condenses.

- Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. 18.8. Input Power Capacity:

Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range.

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-ZV1CD-E 24 / 24 19. PRECONDITION TO USE OUR PRODUCTS PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.

- Aerospace equipment

- Medical equipment.

- Aircraft equipment.

- Power plant control equipment

- Transportation equipment (vehicles, trains, ships, elevator, etc.).

- Traffic signal equipment.

-Burning / explosion control equipment

- Application of similar complexity and/ or reliability requirements to the applications listed in the above.

- Disaster prevention / crime prevention equipment.

- Undersea equipment. We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by

- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you,

-deviation or lapse in function of engineering sample,

-improper use of engineering samples. We disclaim any liability for consequential and incidental damages. If you cant agree the above contents, you should inquire our sales.

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd. FCC#Warning#

!Notice!

This!device!complies!with!Part!15!of!the!FCC!Rules.!Operation!is!subject!to!the!

following!two!conditions:!(1)!this!device!may!not!cause!harmful!interference!and!(2)!

this!device!must!accept!any!interference!received,!including!interference!that!may!

cause!undesired!operation.!

!Information!To!Be!Supplied!to!the!End!User!by!the!OEM!or!Integrator!

The!following!regulatory!and!safety!notices!must!be!published!in!documentation!

supplied!to!the!end!user!of!the!product!or!system!incorporating!an!adapter!in!

compliance!with!local!regulations.!Host!system!must!be!labeled!with!Contains!FCC!

ID:!VPYLB1CDIMP003.!

!This!1CD!module!is!to!be!used!only!for!mobile!and!fixed!application.!In!order!to!reV use!the!1CD!module!FCC!approvals,!the!antenna(s)!used!for!this!transmitter!must!be!

installed!to!provide!a!separation!distance!of!at!least!20cm!from!all!persons!and!must!

not!be!coVlocated!or!operating!in!conjunction!with!any!other!antenna!or!transmitter.!

If!antenna!is!installed!with!a!separation!distance!of!less!than!20cm!from!all!person!

or!is!coVlocated!or!operating!in!conjunction!with!any!other!antenna!or!transmitter!

then!additional!IC!testing!may!be!required.!EndVUsers!must!be!provided!with!

transmitter!operation!conditions!for!satisfying!RF!exposure!compliance.!

!!OEM!integrators!must!ensure!that!the!end!user!has!no!manual!instructions!to!

remove!or!install!the!1CD!module.!Antennas!used!with!the!1CD!module!must!not!

exceed!2.1dBi!gain!for!chip!antennas!or!2.24dBi!gain!for!PIFA!antennas.!

!!!!!!!!!!!!!!!!!!!!

IC#Warning#

!!!!

#Canada!LowVpower!licenseVexempt!radio!communication!devices!(RSSV210)!

a.!Common!information!Operation!is!subject!to!the!following!two!conditions:!

1.!This!device!may!not!cause!interference,!!and!

2.!This!device!must!accept!any!interference,!including!interference!that!may!cause!

undesired!operation!of!the!device.!

!a.!Informations!communes!

Son!fonctionnement!est!soumis!aux!deux!conditions!suivantes:!

1.!Ce!dispositive!ne!peut!causer!des!interferences,!et!

2.!Ce!dispositive!doit!accepter!toute!interference,!y!compris!les!interferences!qui!

peuvent!causer!un!mauvais!fonctionnement!du!dispositive.!

!Information!To!Be!Supplied!to!the!End!User!by!the!OEM!or!Integrator!

Modular!information!form!OEM!

Information!to!be!Supplied!to!the!End!User!by!the!OEM!or!Integrator!

The!following!regulatory!and!safety!notices!must!be!published!in!documentation!

supplied!to!the!end!user!of!the!product!or!system!incorporating!an!adapter!in!

compliance!with!local!regulations.!

Host!system!must!be!labeled!with!Contains!IC:!772CVLB1CDIMP003!

!This!1CD!module!is!to!be!used!only!for!mobile!and!fixed!application.!In!order!to!reV use!the!1CD!module!IC!approvals,!the!antenna(s)!used!for!this!transmitter!must!be!

installed!to!provide!a!separation!distance!of!at!least!20cm!from!all!persons!and!must!

not!be!coVlocated!or!operating!in!conjunction!with!any!other!antenna!or!transmitter.!

If!antenna!is!installed!with!a!separation!distance!of!less!than!20cm!from!all!person!

or!is!coVlocated!or!operating!in!conjunction!with!any!other!antenna!or!transmitter!

then!additional!IC!testing!may!be!required.!EndVUsers!must!be!provided!with!

transmitter!operation!conditions!for!satisfying!RF!exposure!compliance.!

!OEM!integrators!must!ensure!that!the!end!user!has!no!manual!instructions!to!

remove!or!install!the!1CD!module.!Antennas!used!with!the!1CD!module!must!not!

exceed!2.1dBi!gain!for!chip!antennas!or!2.24dBi!gain!for!PIFA!antennas.!

!