1 / 19 LoRa Module User Manual MP P/N: CMWX1ZZABZ Sample P/N: CMWX1ZZABZ-TEMP For LoRaTM Preliminary & Confidential
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Revision History 2 / 19 Description Comments Revision Code A B C D E F G Date June 8, 2016 July 1, 2016 July 30,2016 Aug 29,2016 Oct 11, 2016 Aug 20, 2018 Aug 12, 2021 Initial Draft Updated height and package info Revised some formats and RF_OPH_V test condition from 2.4-3.7V to 2.2-3.6V. Updated some electronic Characteristics. Added the recommended land pattern. Updated the RF performance, Electrical Characteristics and power up sequence. Added FCC and IC statements. Added additional antenna info. Added additional antenna info. Preliminary & Confidential
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3 / 19 TABLE OF CONTENTS 1. Features 4 2. Part Number 4 3. Block Diagram 4 4. Dimensions, Marking and Terminal Configurations 5 5. Label Information 8 6. Absolute Maximum Ratings 8 7. Operating Condition 8 8. Electrical Characteristics 9 9. Power Sequences 10 10. Recommend Land Pattern 11 11. Reference circuit 12 12. Tape and Reel packing 13 13. Notice 16 14. Regulatory Statements 18 Preliminary & Confidential
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4 / 19 Interfaces Main ICs Reference Clocks Supported Frequencies Module Size Package RoHS
: I2C, UART, USB, SPI
: STM32L082, SX1276
: Integrated 32MHz clock (TCXO with frequency error=2 ppm) and 32.768KHz clock (frequency error=20 ppm)
: 868 MHz, 915 MHz
: 12.5 mm x 11.6 mm x 1.76 mm (Max)
: Metal Shield can
: This module is compliant with the RoHS directive Ordering Part Number CMWX1ZZABZ CMWX1ZZABZ-TEMP Description MP P/N Engineering sample 1. Features 2. Part Number 3. Block Diagram N/A Preliminary & Confidential
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5 / 19 4. Dimensions, Marking and Terminal Configurations Top View Bottom View Side View Table 1 Dimension (Unit: mm) Mark L a1 b1 b4 b7 c3 e3 Dimension 12.50.20 0.500.10 0.200.15 3.500.15 2.550.15 1.500.10 1.000.10 Dimension 11.60.20 0.500.10 1.600.15 0.200.15 0.800.10 0.300.10 1.000.10 Mark W a2 b2 b5 c1 e1 e4 Mark T a3 b3 b6 c2 e2 Dimension 1.76 max 1.500.10 3.000.15 1.150.15 0.800.10 0.300.10 Preliminary & Confidential
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Terminal Configurations
< Top View >
6 / 19 Table 2 Terminal Configurations Terminal Name Type PA12/USB_DP I/O Connection to IC terminal STM32L082_PA12 Description PA11/USB_DM I/O STM32L082_PA11 GPIO Mode:PA11 Pin NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 GND VDD_USB VDD_MCU VDD_RF GND Ground Power Power Power Ground
DBG_SX1276_DIO2 I/O DBG_SX1276_DIO3 SX1276_DIO4 DBG_SX1276_DIO5 DBG_SX1276_DIO1 DBG_SX1276_DIO0 I/O I/O I/O I/O I/O SX1276_DIO2 SX1276_DIO3 SX1276_DIO4 SX1276_DIO5 SX1276_DIO1 SX1276_DIO0 PB15/SPI2_MOSI I/O STM32L082_PB15 GPIO Mode:PB15 15 PB14/SPI2_MISO I/O STM32L082_PB14 GPIO Mode:PB14 16 PB13/SPI2_SCK I/O STM32L082_PB13 GPIO Mode:PB13 17 PB12/SPI2_NSS I/O STM32L082_PB12 GPIO Mode:PB12 18 PA10/USART1_RX I/O STM32L082_PA10 GPIO Mode:PA10 Preliminary & Confidential
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GPIO Mode:PA12 USB_DP USB_DM Ground Power supply for USB Power supply for MCU Power supply for RF IC Ground Debug pin for SX1276 Debug pin for SX1276 SX1276 DIO4 Debug pin for SX1276 Debug pin for SX1276 Debug pin for SX1276 SPI2_MOSI SPI2_ MISO SPI2_SCK SPI2_NSS USART1_RX 7 / 19 19 PA9/USART1_TX I/O STM32L082_PA9 GPIO Mode:PA9 20 PA8/MCO I/O STM32L082_PA8 GPIO Mode:PA8 21 PA5/ADC5/DAC2 I/O STM32L082_PA5 GPIO Mode:PA5 USART1_TX MCO COMP2_INM ADC_IN5 DAC_OUT2 COMP2_INM ADC_IN4 DAC_OUT1 COMP2_ INP ADC_IN3 COMP2_OUT ADC_IN2 Ground Ground Debug pin Debug pin Debug pin COMP2_OUT ADC_IN2 I2C mode: SCL I2C mode: SDA LPTIM1_OUT LPTIM1_IN2 LPTIM1_ETR LPTIM1_IN1 SWDIO LPUART1_RX SWCLK LPUART1_TX 22 PA4/ADC4/DAC1 I/O STM32L082_PA4 GPIO Mode:PA4 23 PA3/ADC3 I/O STM32L082_PA3 GPIO Mode:PA3 24 PA2/ADC2 I/O STM32L082_PA2 GPIO Mode:PA2 Transmit / Receive Antenna GND ANT GND DBG_CRF1 DBG_CRF3 DBG_CRF2 STSAFE_nRST VREF+
PA0/WKUP1 Ground A,I/O Ground I/O I/O I/O I Power I/O
STM32L082_PA1 STM32L082_PC1 STM32L082_PC2 Reset for Security IC Reference Voltage For ADC and DAC STM32L082_PA0 GPIO Mode:PA0 25 26 27 28 29 30 31 32 33 34 35 MCU_nRST PB8/I2C1_SCL I I/O STM32L082_PD5 NRST STM32L082_ PB8 GPIO Mode:PB8 36 PB9/I2C1_SDA I/O STM32L082_ PB9 GPIO Mode: PB9 37 PB2/LPTIM1_OUT I/O STM32L082_PB2 GPIO Mode:PB2 38 PB7/LPTIM1_IN2 I/O STM32L082_PB7 GPIO Mode:PB7 39 PB6/LPTIM1_ETR I/O STM32L082_ PB6 GPIO Mode:PB6 40 PB5/LPTIM1_IN1 I/O STM32L082_ PB5 GPIO Mode:PB5 41 PA13/SWDIO I/O STM32L082_PA13 GPIO Mode:PA13 42 PA14/SWCLK I/O STM32L082_PA14 GPIO Mode:PA14 43 BOOT0 I STM32L082_PA5 Boot Option Preliminary & Confidential
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8 / 19 GND Ground
PH1-OSC_OUT I/O STM32L082_PH1 GPIO Mode:PH1 46 PH0-OSC_IN I/O STM32L082_PH0 GPIO Mode:PH0 High-speed external clock OSC output High-speed external clock OSC input Internal TCXO output Power supply for the TCXO IC Ground 44 45 47 48 TCXO_OUT O VDD _TCXO Power Ground
49~57 GND Note: GPIO pins are to be left OPEN if not used. 5. Label Information TBD 6. Absolute Maximum Ratings Table 3 Maximum ratings Parameters Storage Temperature Input RF Level Supply Voltage VDD_USB VDD_MCU, VDD_RF, VDD_TCXO VREF+
Min
-40
-0.3
-0.3
-0.3 Typ 25
Max
+90 10 3.9 3.9 VDD_MCU+0.4 7. Operating Condition Table 4 Operating specification Operating Temperature Parameters Supply Voltage Min
-40 3.0 Typ 25
Max
+85 3.6 VDD_USB (USB peripheral used) (1) VDD_USB(USB peripheral not used) (1) VDD_MCU_min VDD_MCU VDD_MCU_max VDD_MCU,VDD_RF,VDD_TCXO VREF+(2) 3.6 VDD_MCU 2.2(3) 1.8
(1) VDD_USB must respect the following conditions:
- When VDD_MCU is powered on (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU.
- When VDD_MCU is powered down (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU.
- In operating mode, VDD_USB could be lower or higher than VDD_MCU.
- If the USB is not used, VDD_USB must be tied to VDD_MCU to be able to use PA11 and PA12 as standard I/Os.
(2) VREF+ is used to ensure a better accuracy on low-voltage inputs and outputs of ADC and DAC. Detailed information is on the STM32L082*** datasheet and user guider.
(3) When module is on +20dBm operation, the supply of the voltage should be set from 2.4V to 3.6V. Unit degC dBm V V V Unit degC V V V V Preliminary & Confidential
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8. Electrical Characteristics 8.1 FSK/OOK Transceiver Specification 9 / 19 Conditions:
Supply voltage VDD=3.3 V, temperature = 25 C, FXOSC = 32 MHz, FRF =868/915 MHz , 2-level FSK modulation without pre-filtering, FDA = 5 kHz, Bit Rate = 4.8 kb/s and terminated in a matched 50 Ohm impedance, shared Rx and Tx path matching, unless otherwise specified. FSK/OOK Receiver Specification Description Symbol LnaBoost is turned on RFS_F_HF Supply current in Receive mode Conditions FDA = 5 kHz, BR = 4.8 kb/s LnaBoost Off, band 1 LnaBoost On, band 1 Typ
-117.5 Max Unit dBm mA mA Min. 22 23 IDDR FSK/OOK Transmitter Specification Symbol RF_OP RF_OPH RF_ OPH_V RF_T Description RF output power in 50 ohms on RFO pin ( High efficiency PA) RF output power in 50 ohms on PA_BOOST pin( Regulated PA) RF output power stability on PA_BOOST pin versus voltage supply. RF output power stability versus temperature on PA_BOOST pin. IDDT Supply current in Transmit mode with impedance matching Conditions Programmable with steps Programmable with 1dB steps Max Min Max Min VDD = 2.2 V to 3.6 V From T = -40 C to +85 C RFOP = +20 dBm, on PA_BOOST RFOP = +17 dBm, on PA_BOOST RFOP = +14 dBm, on RFO_HF pin RFOP = + 7 dBm, on RFO_HF pin Min. Typ 14 Max Unit dBm
-5 18.5 2
+/-1
+/-1.5 128 106 47 34 dBm dBm dBm dB dB mA mA mA mA 8.2 LoRa Transceiver Specification Conditions:
The table below gives the electrical specifications for the transceiver operating with LoRaTM modulation. Following conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25 C, FXOSC = 32 MHz, Error Correction Code (EC) = 4/5, Packet Error Rate (PER)= 1%, CRC on payload enabled, Payload length = 10 bytes. With matched impedances LoRa Receiver Specification Symbol Description IDDR_L Supply current in receiver LoRa mode, LnaBoost off RFS_L125_HF RF sensitivity, Long-Range Mode, highest LNA gain, LnaBoost for Band1, using split Rx/Tx path 125 kHz bandwidth RFS_L250_HF RF sensitivity, Long-Range Mode, highest LNA gain, LnaBoost for Band1, using split Rx/Tx path 250 kHz bandwidth Conditions Band 1, BW = 125 kHz Band 1, BW = 250 kHz Band 1, BW = 500 kHz SF = 6 SF = 7 SF = 8 SF = 9 SF = 10 SF = 11 SF = 12 SF = 6 SF = 7 SF = 8 SF = 9 SF = 10 SF = 11 SF = 12 Max Unit mA mA mA Min. Typ 21.5 22.2 23.6
-117.5
-122.5
-125.5
-128.5
-131.0
-133.5
-135.5
-114.0
-119.0
-122.0
-125.0
-127.5
-130.0
-133.0 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm Preliminary & Confidential
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LoRa Transmitter Specification Symbol IDDT_L IDDT_H_L Description Supply current in transmitter mode Supply current in transmitter mode Conditions RFOP setting = 14 dBm RFOP setting = 10 dBm Using PA_BOOST pin RFOP setting = 20 dBm Min. Typ 47 36 Max Unit mA mA 128 mA 9. Power Sequences 9.1 Power Up Sequence 10 / 1 Preliminary & Confidential
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11 / 1 10. Recommend Land Pattern Preliminary & Confidential
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11. Reference circuit 12 / 1 Preliminary & Confidential
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U4LoRa module PA12/USB_DP1PA11/USB_DM2GND3VDD_USB4VDD_MCU5VDD_RF6GND7DBG_SX1276_DIO28DBG_SX1276_DIO39SX1276_DIO410DBG_SX1276_DIO511DBG_SX1276_DIO112DBG_SX1276_DIO013PB15/SPI2_MOSI14PB14/SPI2_MISO15PB13/SPI2_SCK16PB12/SPI2_NSS17PA10/USART1_RX18PA9/USART1_TX19PA8/MCO20PA5/ADC5/DAC221PA4/ADC4/DAC122PA3/ADC323PA2/ADC224GND25ANT26GND27DBG_CRF128DBG_CRF329DBG_CRF230STSAFE_nRST31VREF+32PA0/WKUP133MCU_nRST34PB8/I2C1_SCL35PB9/I2C1_SDA36PB2/LPTIM1_OUT37PB7/LPTIM1_IN238PB6/LPTIM1_ETR39PA13/SWDIO41PA14/SWCLK42BOOT043GND44PB5/LPTIM1_IN140PH1-OSC_OUT45PH0-OSC_IN46TCXO_OUT47VDD_TCXO48GND49GND50GND51GND52GND53GND54GND55GND56GND57C310uFC50.1uFJ1112233445566Notes for VREF+1. VREF+ can be grounded when ADC and DAC are not active.2. VREF+ can be connected to a separate voltage which is between 1.8V and VDD for better accuracy on low-voltage inputs and outputs of ADC and DAC.C61uFVDD_TCXOButton12C70.1uFVDDR210KJ223415SMA connector to 868MHz/915MHz AntennaC41uFVDDVDD_USBC8C9SWD connectorL1VDDR110Kfor VDD_TCXO connectionOption1: Connect VDD_TCXO to VDDOption2: Connect VDD_TCXO to PA12 to make sure MCU can control TCXO on/offVREF+C110uFC20.1uFOptional 13 / 1 2.00.1 4.00.1 *1 1.5+0.1/-0.0 0.300.05
. 0 1 0 5 7 1 12. Tape and Reel packing 12.1 Dimension of Tape (Plastic tape) 1.5+0.1/-0 3 0 0 4 2 1 0 5 1 1 1 0 3 1
. 12.2 Dimensions of Reel 24.00.1 12.10.1 feeding direction 20.15
(unit : mm) Label R135 R80 R5 5 10 22 120 2 0 3 3 1 0 8
. 2 0 3 1 W1 W2 Reel inside width W1: 25.51.0 Reel outside width W2: 29.51.0 Unit: mm Preliminary & Confidential
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14 / 1
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape
[4] Base tape
: As specified in (1)
: 62m in thickness 12.3 Taping Diagrams 12.4 Leader and Tail tape Tail tape 40 to 200mm Feeding Hole Feeding Direction Chip
(No components) Component No components s Leader tape
(Cover tape alone) 150mm min. 250mm min. Feeding direction Preliminary & Confidential
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[2][3][4][3][1]
15 / 1
- Material The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. The cover tape and base tape are not adhered at no components area for 250mm min. Tear off strength against pulling of cover tape : 5N min. Packaging unit : 1000 pcs/ reel Base tape : Plastic Reel
: Plastic Cover tape, cavity tape and reel are made the anti-static processing.
Peeling of force: 1.3N max. in the direction of peeling as shown below. 1.3 N max.
Packaging (Humidity proof Packing) Label Desiccant Humidity Indicator Label Anti-humidity Plastic Bag Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. Preliminary & Confidential
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165 to 180 ?0.7 N max.Base tape Cover tape 16 / 1 13. Notice 13.1 Storage Conditions Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to 35 C and humidity from 20 ~ 70 %RH.
(Packing materials, in particular, may be deformed at the temperature over 40 C)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)
- After the packing opened, the product shall be stored at <30 C / <60 %RH and the product shall be used within 168 hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition: 125 +5/-0 C, 24 hours, 1 time The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant. 13.2 Handling Conditions Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solderability. 13.3 Standard PCB Design (Land Pattern and Dimensions) All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 13.4 Notice for Chip Placer :
When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. 13.5 Soldering Conditions The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 C. Contact Murata before use if concerning other soldering conditions. Preliminary & Confidential
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Reflow Soldering Standard Conditions (Example) Within 3 s 17 / 1 180 C 220 C 240 ~ 250 C 150 C Cooling down Slowly Pre-heatin g Within 120 s Within 60 s time(s) Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 13.6 Cleaning :
Since this Product is Moisture Sensitive, any cleaning is not permitted. 13.7 Operational Environment Conditions :
Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. 13.8 Input Power Capacity :
Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range. Preliminary & Confidential
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18 / 1 14. Regulatory Statements 14.1 FCC Statements This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired operation. Cet appareil est conforme la section 15 des rglementations de la FCC. Le fonctionnement de lappareil est sujetaux deux conditions suivantes :
(1) cet appareil ne doit pas provoquer dinterfrences nfastes, et
(2) cet appareil doit tolrer les interfrences reues, y compris celles qui risquent de provoquer un fonctionnement indsirable. Note: This product has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This product generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this product does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Please take attention that changes or modification not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. This equipment should be installed and operated with a minimum distance 20cm between the radiator and your body Cet quipement doit tre install et utilis une distance minimale de 20 cm entre le radiateur et votre corps When the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can be use wording Contains transmitter module FCC ID: VPYCMABZ or Contains FCC ID: VPYCMABZ. Preliminary & Confidential
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19 / 1 14.2 IC Statements This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radioexempts de licence. L'exploitation est autorise aux deux conditions suivantes :
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformment la rglementation d'Industrie Canada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par Industrie Canada. Dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. This equipment should be installed and operated with a minimum distance 20cm between the radiator and your body Cet quipement doit tre install et utilis une distance minimale de 20 cm entre le radiateur et votre corps When the Industry Canada certification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can be use wording Contains transmitter module IC: 772C-CMABZor Contains IC: 772C-CMABZ. 14.3 General Statements The module is limited to OEM installation ONLY. The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. Therefore, the final host product must be submitted to [SyChip] for confirmation that the installation for the module into the host is in compliance with regulations of FCC and IC Canada. Specially, if an antenna other than the model documented in the Filing is used, a Class 2 Permissive Change must be filed with the FCC. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. The LoRa module is for use with external antenna ONLY. The certified antennas include:
(1) Monopole Antenna with maximum gain 1.04dBi.
(2) PCB antenna with maximum gain of 1.0dBi.
(3) Chip antenna with maximum gain of -2.1dBi.
(4) PCB Antenna + MHF cable with maximum gain of 2dBi.
(5) Chip antenna NN02-224 with maximum gain of 0.9dBi. Preliminary & Confidential
< Specification may be changed by Murata without notice >
20 / 1 This module has been approved by FCC to operate with the antenna types with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Preliminary & Confidential
< Specification may be changed by Murata without notice >
21 / 1 CAUTION PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above. We expressly prohibit you from analyzing, breaking, Reverse-Engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. Customer acknowledges that Murata will, if requested by you, conduct a failure analysis for defect or alleged defect of Products only at the level required for consumer grade Products, and thus such analysis may not always be available or be in accordance with your request (for example, in cases where the defect was caused by components in Products supplied to Murata from a third party). By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 90 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent Preliminary & Confidential
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22 / 1 on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you, deviation or lapse in function of engineering sample, improper use of engineering samples. We disclaims any liability for consequential and incidental damages. If you cant agree the above contents, you should inquire our sales. Preliminary & Confidential
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