EMW3072 Embedded Wi-Fi Module Version1.2 Date2019-07-28 NumberDS0151EN Datasheet Characteristic Abstract Application Intelligent Lighting Smart Home/Home Appliances Industrial Automation Intelligent Security Module Type Type Description EMW3072 PCB Antenna Supports 802.11b/g/n standard, integrates ARM-CM4F, WLAN MAC/Baseband/RF. Contains 256KB RAM/2MB FLASH Operation voltageDC 3.3V 20MHz Bandwidth with maximum data rate at 65Mbps Wi-Fi connectivity Support 802.11b/g/n_ HT-20 standard Hardware Block and HT-40 Support Station, Soft AP, Station+Soft Support EasyLinkAlinkJoinlink AP PCB Antenna Operation temperature-30 to +105 Datasheet
[Page 1]
Version Record Data Version Update Note 2019-05-20 1.0 Initial version 2019-05-30 1.1 Revise supply voltage to 3.3V. PWM9 in pin13 function table is corrected to PWM0, PIN14 is removed as the annotation of PWM1. Definition of Pin2 is changed to PWM1 and revised. 2019-07-30 1.2 Increase FCC and IC information EMW3072 Datasheet
[Page 2]
Catalogue Abstract ................................................................................................................................................................................. 1 Version Record...................................................................................................................................................................... 1 1. Product Introduction.................................................................................................................................................... 4 EMW3072 Label Information ........................................................................................................................... 5 Pin Arrangement ................................................................................................................................................ 5 Pin Definition .................................................................................................................................................... 7 1.3.1 EMW3072 Package Definition ............................................................................................................. 7 1.3.2 EMW3072 Pin Definition ..................................................................................................................... 7 2. Electrical Parameters ................................................................................................................................................... 9 Operating Ratings .............................................................................................................................................. 9 Power Consumption .......................................................................................................................................... 9 Operation Conditions ...................................................................................................................................... 10 ESD Parameters ............................................................................................................................................... 10 3. RF Parameters ............................................................................................................................................................ 11 Basic RF Parameters ....................................................................................................................................... 11 TX Performance .............................................................................................................................................. 11 IEEE802.11bMode Tx Parameters ..................................................................................................... 11 3.2.1 IEEE802.11g mode TX Performance ................................................................................................. 12 3.2.2 3.2.3 IEEE802.11n-HT Mode TX Performance .......................................................................................... 13 RX Performance .............................................................................................................................................. 13 IEEE802.11b Mode RX Performance................................................................................................. 13 3.3.1 IEEE802.11g. Mode RX Performance................................................................................................ 14 3.3.2 IEEE802.11n HT20 Mode RX Performance ...................................................................................... 14 3.3.3 3.3.4 IEEE802.11n HT40 Mode RX Performance ...................................................................................... 14 3.3.5 OTA Performance ............................................................................................................................... 14 4. Antenna Information ................................................................................................................................................. 15 Antenna Type................................................................................................................................................... 15 PCB Antenna Forbidden Area ......................................................................................................................... 15 5. Production Instruction ............................................................................................................................................... 17 Production Guidelines ..................................................................................................................................... 17 The matters need attention .............................................................................................................................. 18 Storage Condition ............................................................................................................................................ 19 Recommended Reflow Profile ........................................................................................................................ 20 6. Reference Circuit ........................................................................................................................................................ 21 7. FCC and IC Information ........................................................................................................................................... 23 FCC Warning ................................................................................................................................................... 23 IC warning ....................................................................................................................................................... 23 8. Module MOQ and packaging information .............................................................................................................. 25 9. Sales Information and Technical Support ................................................................................................................ 26 EMW3072 Figure Catalogue Datasheet
[Page 3]
Figure 1 EMW3072 Hardware Block and Interface ........................................................................................ 4 Figure 2 EMW3072 label picture.................................................................................................................... 5 Figure 3 Stamp Hole Packaging Dimension Diagram ..................................................................................... 6 Figure 4 EMW3072 Packaging Definition Diagram ........................................................................................ 7 Figure 5 EMW3072 Drawings ...................................................................................................................... 15 Figure 6 PCB Minimum clearance area of antennaUnit: mm ................................................................. 16 Figure 7 Humility Card ................................................................................................................................ 17 Figure 8 Storage Condition ........................................................................................................................... 19 Figure 9 Temperature Curve Reference ......................................................................................................... 20 Figure 10 Power Reference Circuit ............................................................................................................... 21 Figure 11 USB to UART Reference Circuit .................................................................................................. 21 Figure 12 EMW3072 External Interface Reference Design ........................................................................... 21 Figure 13 3.3V UART- 5V UART Conversion Reference Circuit .................................................................. 22 Table Catalogue Table 1 EMW3072 pin definition ................................................................................................................... 7 Table 2 Input voltage range ............................................................................................................................ 9 Table 3 Absolute Maximum Ratings ............................................................................................................... 9 Table 4 Power Consumption Parameters ......................................................................................................... 9 Table 5 Temperature and Humidity conditions .............................................................................................. 10 Table 6 ESD Parameters ............................................................................................................................... 10 Table 7 RF Standard ......................................................................................................................................11 Table 8 IEEE 802.11b Mode CCK_11 Tx Parameters ....................................................................................11 Table 9 IEEE802.11g Mode OFDM_54 TX Performance Parameters............................................................ 12 Table 10 IEEE802.11n-HT 20MHz Mode MCS7 TX Performance ............................................................... 13 Table 12 PCB Antenna ................................................................................................................................. 15 Table 13 Module MOQ and packaging information ...................................................................................... 25 EMW3072 Datasheet
[Page 4]
1. Product Introduction EMW3072 is a cost-effective embedded W-Fi module launched by Shanghai Qingke (MXCHIP). It is highly integrated with ARM CM4F, WLAN MAC/Baseband/RF, with a maximum main frequency of 240MHz, built-in 256KB SRAM, 2M FLASH and 3.3V single power supply. The following diagram is the hardware block diagram of EMW3072 module, which mainly includes four parts:
CM4F main core WLAN MAC/BB/RF/ANT SWD debugging Power management Among them:
1. ARM CM4F CPUworking frequency up to 240MHz, internal integration 256K SRAM, 2MB FLASH, support high-speed UART, I2C, SPI, PWM, and multiple GPIO ports. 2. Extra-chip SPI Flash with maximum support of 128MB for custom firmware development. 3. Supporting PCB antenna and IPEX external antenna 4. Input typical voltage: DC 3.3V Figure 1 EMW3072 Hardware Block and Interface EMW3072 EMW3072 Label Information Datasheet
[Page 5]
Figure 2 EMW3072 label picture Label Information:
CMIIT ID: XXXXXXXXXXXXX, SRRC Authentication ID. FCC ID: P53-XXXXXXXX, FCC Authentication ID. MXCHIP: Company Logo. EMW3072 : Module Main Model. D0BAE45000DF: MAC Address(Each module has a unique MAC address). X1916Production batch. 0000.0000.A213: Module Firmware Serial Number. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Pin Arrangement EMW3072 adopts the design scheme of stamp hole. The packaging design of stamp hole (as shown in Figure 3 Stamp Hole Packaging Dimension Diagram) is convenient for customers to debug and disassemble. The size of welding pad and window is the same. SMT suggests that the thickness of steel mesh be 0.12mm-0.14mm. EMW3072 Datasheet
[Page 6]
Figure 3 Stamp Hole Packaging Dimension Diagram TOP VIEW EMW3072 Datasheet
[Page 7]
Pin Definition 1.3.1 EMW3072 Package Definition Figure 4 EMW3072 Packaging Definition Diagram FUNCTION6 GPIO GPIO_4 1.3.2 EMW3072 Pin Definition Table 1 EMW3072 pin definition FUNCTION1 FUNCTION2 FUNCTION3 FUNCTION4 FUNCTION5 SDIO UART PWM SPI 1 2 3 4 5 6 7 8 9 RESET SWD_CLK SDIO_CMD UART0_TXD PWM0 ADC1 ELINK UART2_RXD SPI2_SCK GPIO_13 SWD_DIO SDIO_CLK PWM2 ADC2 GPIO_5 ADC3 ADC4 VDD33 GND SDIO_INT UART2_RTS PWM3 SPI2_MOSI GPIO_11 SDIO_DATA0 UART0_CTS PWM4 SPI0_CSN GPIO_6 SDIO_DATA1 UART0_RTS PWM6 SPI0_SCK GPIO_7 EMW3072 Datasheet
[Page 8]
10 11 12 I2C0_SDA SDIO_INT UART1_RXD I2C0_SCL UART1_TXD I2C0_SDA SDIO_INT UART1_RXD SPI1_MOSI GPIO_3 SPI1_MISO GPIO_2 SPI1_MOSI GPIO_3 13 STRAP/SEL1 UART1_CTS PWM0 SPI2_SCK GPIO_14 14 MODE_SEL3 ADC7 UART1_CTS PWM1 SPI2_SCK GPIO_10 15 SWD 16 SWC 17 BOOT 18 PAD_SEL Description:
UART0_RXD PWM7 SPI1_SCK UART0_TXD PWM5 SPI1_CSN GPIO_1 GPIO_0 UART2_TXD SPI2_CSN GPIO_12
(1) PIN 17 pin is used by BOOT by default, PIN 3 pin is used by EASYLINK, PIN 21/22 pin is used by debugging log information output. Please try not to use it in hardware design. If you want to use it, please contact our engineer to confirm.
(2) PIN11/12 pin must be High level while its power on, and it can be pull-up by externally connecting with 100k resistance. Please pay special attention to the design of the circuit.
(3) In order to enable pins, CHIP_EN pulls down the resettable module and then pulls up the resettable module. If not used, it can remain suspended or pull up 3.3V at 10K.
(4) PIN11/12 can be internal 100k weak pull-up, please allocate related peripheral devices reasonably.
(5) PIN18 can be used to choose PAD mode, which is raised when burning, and floating usually.
(6) Other non-pins can be kept in suspension. It should be noted that IO port is a floating state at startup. This is true from the beginning of ROM code. It can be pulled up and down in boot code as soon as possible, and the time it takes will be affected by flash. Therefore, if the module needs to be in the level state determined by module at startup, it needs to be added to the outside that less than 100k resistor pulled up and down to stabilize the level. As shown in the figure below, when the module is started, the level of the IO port, which is configured to be very low, is changed when the floating state is pulled up by an external 100K resistor. EMW3072 Datasheet
[Page 9]
2. Electrical Parameters Operating Ratings Be noticed that when the input voltage is lower than the minimum rated voltage, EMW3072 may work abnormally. Please pay attention while designing power circuit. Table 2 Input voltage range Detail Symbol Description Condition Min. Typ. Max. Unit VDD Power supply 3.0 VDD Power supply V Voltage exceeding maximum ratings will cause hardware damage to the module and working at the maximum ratings for a long time will affect the reliability of the module. Table 3 Absolute Maximum Ratings Symbol VDD VIN Description Power supply Input voltage of GPIOs Min. Typ. Unit 0.3 0.3 3.6 3.6 V V Power Consumption Test temperatureroom temperature Test distance20~50cm Table 4 Power Consumption Parameters Mode Description Average Maximum Circuit Run mode 10.2 10.6 Wi-Fi RF is off, MCU is running in Task State Idle mode 7.6 8.2 Wi-Fi RF is off, MCU is in Idle statesystem automatically enters low power mode Station Tx Power 57.8mA 212.5mA Wi-Fi is in connection state, sending broadcast packet state (data interval 10ms) Station Rx Power 55.9mA 92.7mA Wi-Fi is in connection state, receiving broadcast packet state (data interval 10ms) Station Tx Rx Power SoftAP mode 52.1mA 191.5mA Wi-Fi is in connection state, TCP/IP data is in sending and receiving status (data interval 10ms) 59.2mA 180.8mA Wi-Fi start SoftAP mode and connect devices EMW3072 Datasheet
[Page 10]
Power Save mode(Idle) 12.4mA 58.3mA Wi-Fi is in connection state, MCU is in idle state Monitor mode 56.5mA 59.3mA Wi-Fi start monitor mode Notice: the power consumption data may be different in different firmware. MAX working circuit is 290mA. Operation Conditions Symbol TSTG TA Table 5 Temperature and Humidity conditions Name Range Unit Storage Temperature Operating Temperature
-40 to +85
-20 to +85
<95
%
Humidity Non-condensing, relative humidity ESD Parameters Table 6 ESD Parameters Symbol Name Spec Rank Max. Unit Electronics Static Discharge Human Body Model Electronics Static Discharge Charge Device Model VESD(HBM) VESD(CDM) TA= +25 C JESD22-A114 TA = +25 C JESD22-C101 2 2000 II 500 V EMW3072 Datasheet
[Page 11]
3. RF Parameters Basic RF Parameters Table 7 RF Standard Item Description Frequency Range 2412~2.462MHz Wi-Fi Wireless Standard IEEE802.11b/g/n Modulation Mode 11g: BPSK, QPSK, 16QAM, 64QAM for OFDM 11b: DBPSK, DQPSK,CCK for DSSS 11n: MCS0~7,OFDM 11b1,2,5.5 11Mbps Data Rate 20MHz 11g : 6,9,12,18,24,36,48,54Mbps Antenna Type 11n : MCS0~7,65Mbps PCB antenna Default TX Performance 11g: BPSK, QPSK, 16QAM, 64QAM for OFDM 3.2.1 IEEE802.11bMode Tx Parameters 11n: MCS0~7,OFDM Table 8 IEEE 802.11b Mode CCK_11 Tx Parameters Item Mode Channel Rage Description IEEE802.11b CH1 to CH13 1, 2, 5.5, 11Mbps TX Performance Minimum Typical. Maximum Unit Remark 15.0 16.5 18.0 dBm 1Mbps 1.Output Power 15.0 16.5 18.0 dBm 11Mbps 2. Spectrum Template 1) fc +/-11MHz to +/-22MHz 2) fc > +/-22MHz
-
-
-
-
-30
-50 dBr dBr EMW3072 Datasheet
[Page 12]
3. Frequency Offset 4. EVM( Peak EVM)
-15
-1.5
+15 ppm 1) 1~11Mbps 35%or 11dB 3.2.2 IEEE802.11g mode TX Performance Table 9 IEEE802.11g Mode OFDM_54 TX Performance Parameters Item Mode Channel Rate Description IEEE802.11g CH1 to CH13 6, 9, 12, 18, 24, 36, 48, 54Mbps TX Performance Minimum Typical. Maximum Unit Remark 14.0 15.5 1. Output Power 13.0 14.5 2. Spectrum Template 1) at fc +/- 11MHz 2) at fc +/- 20MHz 3) at fc > +/-30MHz
-
-
-
-
17 16
-20
-28
-40 dBm 6Mbps dBm 54Mbps dBr dBr dBr 3.Frequency Offset
-15
-1.5
+15 ppm 4. EVM( Peak EVM) 6Mbps 54Mbps
-
-
-30
-31
-5
-25 dBm dBm EMW3072 3.2.3 IEEE802.11n-HT Mode TX Performance Table 10 IEEE802.11n-HT 20MHz Mode MCS7 TX Performance Datasheet
[Page 13]
Item Mode Channel Rate Description IEEE802.11n HT20 CH1 to CH13 MCS0/1/2/3/4/5/6/7, maximum 65Mbps TX Performance Minimum Typical. Maximum Unit Remark 13.5 15 16.5 dBm MCS0 1.Output Power 2.Spectrum Template 1) at fc +/- 11MHz 2) at fc +/- 20MHz 3) at fc > +/-30MHz 3. Frequency Offset 4. EVM( Peak EVM) MCS0 MCS7 12
-
-
-15
-
-
13.5 15.0 dBm MCS7
-
-
-20 dBr
-28 dBr
-45 dBr
-1.5
+15 ppm
-30
-32
-5 dBm
-27 dBm RX Performance 3.3.1 IEEE802.11b Mode RX Performance RX Minimum Receiving Sensitivity Minimum Typical. Maximum Unit Remark 1Mbps (FER8%) 11Mbps (FER8%)
-
-
-98
-90
-97
-90 dBm dBm EMW3072 3.3.2 IEEE802.11g. Mode RX Performance Datasheet
[Page 14]
RX Minimum Receiving Sensitivity Minimum Typical. Maximum Unit Remark 6Mbps (FER10%) 54Mbps (FER10%)
-
-
-92.5
-92.5 dBm
-76
-75.5 dBm 3.3.3 IEEE802.11n HT20 Mode RX Performance RX Minimum Receiving Sensitivity Minimum Typical. Maximum Unit Remark MCS0 (FER10%) MCS7 (FER10%)
-
-
-92.5
-92 dBm
-73
-73 dBm 3.3.4 IEEE802.11n HT40 Mode RX Performance RX Minimum Receiving Sensitivity Minimum Typical. Maximum Unit Remark MCS0 (FER10%) MCS7 (FER10%)
-
-
-90
-70
-90
-70 dBm dBm Note:
Tx test data above are typically recorded at room temperature for about 20 seconds. 11b power is measured in factory mode (through-the-wall mode). User's practical application and authentication test will be 2 dB lower than that in factory mode, i.e. the actual maximum power limit of 11b is 16 dBm. Ensure that the PSD test items of the certification test pass. 3.3.5 OTA Performance TBD EMW3072 Datasheet
[Page 15]
4. Antenna Information Antenna Type EMW3072 only has PCB antenna model. Figure 5 EMW3072 Drawings Table 11 PCB Antenna PCB Antenna Information Frequency Range 2412MHz~2462MHz Impedance VSWR Gain 50
<2 2dBiGain>0.8dBi Efficiency
>50% or >-3dB Note: The above conditions are obtained under the condition of module welding to motherboard and darkroom testing. PCB Antenna Forbidden Area While using PCB antenna, make sure that metal and electrical components are at least 16mm away from the antenna. The shadow area should not contain any metal components, sensor, PCB ground. EMW3072 Datasheet
[Page 16]
Figure 6 PCB Minimum clearance area of antennaUnit: mm EMW3072 Datasheet
[Page 17]
5. Production Instruction Production Guidelines Qingke stamp port packaging module must be SMT machine patches, module humidity sensitivity grade MSL3, after unpacking more than a fixed time patches to bake module. SMT need machine:
1. Reflow soldering SMT machine 2. The AOI detector 3. 6-8 mm diameter suction nozzle Baking need equipment:
1. Cabinet baking box 2. The antistatic, high temperature resistant tray 3. The antistatic high temperature resistant gloves Storage conditions as follows:
1. Moisture bag must be stored in a temperature < 30 C, humidity 85% RH of the environment. 2. Dry packaging products, the guarantee period should be from 6 months from the date of packing seal. Figure 7 Humility Card After the module is split, if the humidity card shows pink, it needs to be baked. Baking Parameters:
Roasting temperature: 125and baking time: 4 hours. The alarm temperature is set to 130 C. SMT patches can be prepared after cooling < 36 C under natural conditions. Drying times: 1 time. If there is no welding after baking for more than 12 hours, please bake again. EMW3072 Datasheet
[Page 18]
If opened the time more than 3 months, please ban the use of SMT process welding this batch module, zedoary because PCB process, more than 3 months bonding pad oxidation, SMT is likely to cause virtual welding, welding, the resulting problems we do not assume corresponding responsibility. Please to ESDstatic dischargestatic electricity discharge protection module before SMT;
Please according to the SMT reflow soldering curve, peak temperature 245 , reflow soldering temperature curve as shown in figure 10, section 5.5;
For the first time in order to ensure the qualified rate of reflow soldering, first SMT please extraction 10% product to visual analysis, AOI inspection, to ensure that the furnace temperature control, device adsorption method, the rationality of the put way; Suggestionswhen batch production per hour 5-10 pieces of visual analysis, AOI test. The matters need attention In the entire production, each station of the operator must wear anti-static gloves;
When baking, no more than baking time;
When roasting, it is forbidden to join explosive, flammable, corrosive substances;
When baking, high temperature module application tray in the oven, keep the air circulation between each module, at the same time avoid direct contact with the oven wall module;
Baking, please will bake the door is closed, the guarantee baking box sealing, prevent leakage, temperature influence the baking effect;
Don't open the door, as far as possible when baking box running if must open, shortening the time of can open the door as far as possible;
After baking, must be natural cooling modules to < 36 before wearing anti-static gloves out, so as not to burn. Operation, forbidden module bottom touch water or dirt;
Temperature and humidity control level for Level3, storage and baking conditions based on IPC/JEDEC J -
STD - 020. EMW3072 Storage Condition Datasheet
[Page 19]
Figure 8 Storage Condition EMW3072 Datasheet
[Page 20]
Recommended Reflow Profile Solder paste recommendations: SAC305, Lead -Free solder paste. Reflow times should be no more than twice. Figure 9 Temperature Curve Reference EMW3072 Datasheet
[Page 21]
6. Reference Circuit The EMW3072 power supply reference circuit is shown in Figure 10, Figure 10 USB serial port reference circuit and Figure 11 external interface reference design for user reference. Figure 10 Power Reference Circuit Figure 11 USB to UART Reference Circuit Figure 12 EMW3072 External Interface Reference Design EMW3072 UART is 3.3V UART. If the UART of the chip is 5V, the user needs to convert 5V U ART to 3.3V UART to communicate with EMW3072 UART. The 5V-3.3V UART conversion circuit refers to the circuit shown in Figure 13. EMW3072 Datasheet
[Page 22]
Figure 13 3.3V UART- 5V UART Conversion Reference Circuit EMW3072 Datasheet
[Page 23]
7. FCC and IC Information FCC Warning Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help. The device has been evaluated to meet general RF exposure requirement. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be inst alled and operated with minimum distance 20cm between the radiator & your body. IC warning
- English:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference, and (2) This device must accept any interference, including interference that may cause undesired operation of the device.
- French:
Le prsentappareilestconforme aux CNR d'Industrie Canada applicable aux appareils radio exempts de license. L'exploitationestautorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareildoit accepter tout brouillageradiolectriquesubi, mmesi le brouillageest susceptible d'encompromettre le fonctionnement. EMW3072 NoteThe host product manufacturers need to provide a physical or e-label stating Contains FCC ID with their finished product. Datasheet
[Page 24]
EMW3072 Datasheet
[Page 25]
8. Module MOQ and packaging information Table 12 Module MOQ and packaging information Material number MOQ(pcs) Shipment packing method Outer packing box size Remark 650pcs/volume one volume in one box four boxes in one case. EMW3072 650 Tape reel 385*275*370(mm) EMW3072 Datasheet
[Page 26]
9. Sales Information and Technical Support If you need to get the latest information on this product or our other product information, you can visit:
http://www.mxchip.com/. If you need to get technical support, please call us during the working hours. From Monday to Friday, morning 9:00~12:00, afternoon 13:00~18:00 Telephone: +86 (021)52655026 Email: sales@mxchip.com Postcode: 200333 Contact address: 9F, 5 Building, No.2145 Jinshajiang Road, Shanghai, China EMW3072