EMW3092 Datasheet Embedded Wi-Fi module Version1.1 Date2019-03-20 Number: DS0132EN Features Support 802.11b/g/n, integrate ARM-
CM4F, WLAN MAC/Baseband/RF 256KB RAM/ 2MB FLASH Working Voltage: DC 3.0-3.6V Maximum transmission rate up to 65 Mbps with 20 MHz bandwidth. Wi-Fi Features Abstract EMW3092: -20 to +105 EMW3092L: -20 to +85 Application Intelligent lighting Smart Home Application Industrial automation Intelligent Security Support 802.11b/g/n, HT-20 Support Station, Soft AP, Station+Soft Module Type Support EasyLinkAlinkJoinlink AP Antenna: PCB antenna Operating Temperature Part Number Note EMW3092 EMW3092L PCB antenna, 105 operating temperature PCB antenna, 85 operating temperature Copyright Notice Mxchip copyrights this specification. No part of this specification may be reproduced in any form or means, without the prior written consent of Mxchip. Datasheet Version History Date Version Details 2019-03-20 2019-03-21 1.0 1.1 Initial release Add FCC&IC information 1 / 21 Datasheet Content Abstract ................................................................................................................................................................................. 1 Version History ..................................................................................................................................................................... 1 1. Product Introduction.................................................................................................................................................... 4 EMW3092 Label Information ........................................................................................................................... 4 Pin Arrangement ................................................................................................................................................ 5 Pin Definition .................................................................................................................................................... 6 1.3.1 EMW3092 Package Definition ............................................................................................................. 6 1.3.2 EMW3092 Pin Definition ..................................................................................................................... 6 2. Electrical Parameters ................................................................................................................................................... 8 Operating Conditions ........................................................................................................................................ 8 Power Consumption .......................................................................................................................................... 8 Working Environment ....................................................................................................................................... 9 Electrostatic Discharge ...................................................................................................................................... 9 3. RF parameters ............................................................................................................................................................ 10 Basic RF parameters ........................................................................................................................................ 10 TX Performance .............................................................................................................................................. 10 3.2.1 Transmit performance of IEEE802.11b mode .................................................................................... 10 3.2.2 Transmit performance of IEEE802.11g mode .................................................................................... 11 3.2.3 Transmit performance of IEEE802.11n-HT20 mode ......................................................................... 11 4. Antenna Information ................................................................................................................................................. 13 Type of Antenna .............................................................................................................................................. 13 PCB antenna clearance area ............................................................................................................................ 13 5. Assembly Information and Production Guidance ................................................................................................... 14 Production Guidance ....................................................................................................................................... 14 Considerations ................................................................................................................................................. 15 Storage Condition ............................................................................................................................................ 16 Temperature Curve of Secondary Reflow ....................................................................................................... 17 6. FCC& IC Information ............................................................................................................................................... 18 FCC Warning ................................................................................................................................................... 18 IC warning ....................................................................................................................................................... 18 Other information ............................................................................................................................................ 18 7. Sales Information and Technical Support ................................................................................................................ 20 Figure Content Figure 1 EMW3092 Label Information ........................................................................................................... 4 Figure 2 Module Picture ................................................................................................................................. 5 Figure 3 DIP Package Size ............................................................................................................................. 5 Figure 4 SMT Package Size............................................................................................................................ 6 2 / 21 Datasheet Figure 5 Package Definition ........................................................................................................................... 6 Figure 6 PCB antenna minimum clearance area (unit: mm)........................................................................... 13 Figure 7 Humidity Card ............................................................................................................................... 14 Figure 8 Storage Condition ........................................................................................................................... 16 Figure 9 Temperature Curve of Secondary Reflow ........................................................................................ 17 Table Content Table 1 EMW3092 Pin Definition .................................................................................................................. 6 Table 2 Absolute maximum voltage rating ...................................................................................................... 8 Table 3 EMW3092 Power Consumption ......................................................................................................... 8 Table 4 Temperature and humidity condition .................................................................................................. 9 Table 5 Electrostatic Discharge Parameters ..................................................................................................... 9 Table 6 Radio-frequency standards ............................................................................................................... 10 Table 7 CCK_11 transmit performance parameters of IEEE802.11b mode .................................................... 10 Table 8 OFDM_54 transmit performance parameters of IEEE802.11g mode ..................................................11 Table 9 MCS7 transmit performance parameters of IEEE802.11n-HT20 mode ..............................................11 3 / 21 Datasheet 1. Product Introduction EMW3092 is a cost-effective embedded Wi-Fi module released by MXCHIP with high integrating ARM CM4F, WLAN MAC/Baseband/RF. Maximum frequency 62.5MHz with 256KB SRAM and 2M FLASH. Power supply is DC 3.3V. Hardware diagram is shown below with four main parts:
CM4F main core WLAN MAC/BB/RF/ANT Hardware encryption Power management With 1. ARM CM4F CPU with 62.5MHz maximum frequency and 256KB SRAM and 2M FLASH. Support high speed UART, I2C, SPI, PWM and multi-GPIO. 2. 2MB SPI Flash is used for custom firmware development. 3. Support PCB antenna and IPEX 4. Input voltage: DC 3.3V EMW3092 Label Information Figure 1 EMW3092 Label Information Label Information:
MXCHIP: Company LOGO. CMIIT ID: xxxxxxxxxx, SRRC approval number. EMW3092: Main module type. B0F89310583D: MAC address (Each module has a unique MAC address). X1908: Production cycle, factory initials and annual week time. 0000.0000.A213: SN series number. FCC ID: P53-EMW3092, FCC certification information. 4 / 21 Datasheet This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Pin Arrangement EMW3092 adopts a through-hole and SMT package design. The stamp hole package design is convenient for customer debugging, easy to disassemble and easy to use for SMT. The left and right pads are 1.2x1.6mm and the lower pads are 1.2x0.8mm. The motherboard pad is recommended to expand 0.1mm.Solder mask opening and pad size are the same. SMT recommends stencil thickness 0.12mm-0.14mm. Figure 2 Module Picture Figure 3 DIP Package Size 5 / 21 Datasheet Figure 4 SMT Package Size Pin Definition 1.3.1 EMW3092 Package Definition Figure 5 Package Definition 1.3.2 EMW3092 Pin Definition EMW3092 Pin Definition is shown as Table 1. Table 1 EMW3092 Pin Definition Pin FUNCTION1 FUNCTION2 FUNCTION3 FUNCTION4 FUNCTION5 MICO_SPI1_CS MICO_PWM2 SWD_DIO 1 2 3 4 5 6 7 8 9 CHIP_EN MICO_GPIO_8 MICO_I2C0_SDA MICO_UART0_CTS MICO_GPIO_23 MICO_GPIO_2 MICO_GPIO_12 MICO_GPIO_13 MICO_GPIO_14 VDD GND MICO_PWM3 MICO_PWM4 MICO_PWM5 10 MICO_GPIO_22 MICO_I2C0_SCL MICO_UART1_RXD MICO_PWM5 11 MICO_GPIO_21 MICO_I2C0_SDA MICO_UART1_TXD MICO_PWM4 12 MICO_GPIO_22 MICO_I2C0_SCL MICO_UART1_RXD MICO_PWM5 13 MICO_GPIO_7 MICO_I2C0_SCL MICO_UART0_RTS MICO_PWM6 MICO_SPI1_MISO 6 / 21 Datasheet Pin FUNCTION1 FUNCTION2 FUNCTION3 FUNCTION4 FUNCTION5 14 MICO_GPIO_1 MICO_PWM1 SWD_CLK 15 MICO_GPIO_10 MICO_I2C1_CLK MICO_UART0_RXD MICO_SPI1_CLK 16 MICO_GPIO_9 MICO_I2C1_SDA MICO_UART0_TXD MICO_PWM1 MICO_SPI1_MOSI 17 MICO_GPIO_19 BOOT Description:
(1) The GPIO19 pin defaults to BOOT; the GPIO23 pin is used by EASYLINK; the PIN11/12 pin is used for debugging log information output. Please try not to use the hardware design. Please contact our engineers for confirmation.
(2) The PIN11 pin can't be pulled low and then powered on. The PWM3 power-on must be in the L state, and the module has made 10k resistor pull-down inside. Please pay special attention when designing the circuit.
(3) CHIP_EN is the enable pin. Pulling low and then pulling high will generate a chip reset.
(4) CHIP_EN, PIN11/12 has 10k pull-up inside; except PWM corresponding to SWD and UART1 (Debug) pin, other PWM1, PWM3, PWM4, PWM5, PWM6 have 10k pull-down inside; please allocate relevant peripheral devices reasonably.
(5) Other pins that are not used can be left floating. It should be noted that the IO port is a floating state at startup. This is the case from the beginning of the ROM code. It is also necessary to go to the boot code at the earliest. Up and down, and the time elapsed in it will be affected by the flash, so if the module needs to be at the level determined by the module at startup, it needs to externally pull at least 100k resistor to externally pull up to stabilize the level. If the figure below shows the level of the IO port that is configured to be normally low after the module is started, the floating state is pulled up by the external 100K resistor. 7 / 21 Datasheet 2. Electrical Parameters Operating Conditions EMW3092 would be unstable when input voltage is less than the lowest rated voltage. Table 1 Range of input voltage Details Symbol Illustration Condition Minimum Typ Maximum Unit VDD Power Supply 3.0 3.3 3.6 V There would be permanent damage in hardware if the device operates at the voltage over rated value. Meanwhile, reliability could be influenced when the device has a long-term operating at maximum voltage. Table 2 Absolute maximum voltage rating Symbol VDD VIN Description Minimum Typ Unit Module input voltage GPIO input voltage 0.3 0.3 3.6 3.6 V V Power Consumption Table 3 EMW3092 Power Consumption Mode Wi-Fi off Wi-Fi off Wi-Fi off EMW3092 current Average Max Note 20.903mA 21.209mA CPU idle 3.704mA 3.450mA CPU idle and in low power mode 19.610mA 20.295mA CPU run at full speed Wi-Fi initialization 110.603mA 126.092mA Wi-Fi and MCU low power mode OFF Wi-Fi keep connected with router 109.447 124.086 mA Wi-Fi and MCU low power mode OFF mA Wi-Fi keep connected with router Wi-Fi and MCU low power mode ON SoftAP 9.059 mA 282.791 mA 116.698 306.078 mA mA SoftAP Monitor 114.699mA 126.954mA Monitor mode for WiFi configuration 8 / 21 Datasheet Standby Iperf Iperf 4.642 uA 20.323 uA MCU/RAM/Peripherals/RTC OFF, wake up by IO or internal Timer 115.697mA 345.190mA Wi-Fi and MCU low power mode OFF 115.030mA 353.832mA Wi-Fi and MCU low power mode ON Actual working current is variable at different operating mode. Maximum operating current 300 mA Working Environment Symbol TSTG TA Table 4 Temperature and humidity condition Name Maximum Unit Storage Temperature Operation Temperature
-40 to +125
-20 to +85 95
%
Humidity Non-condensing, Relative humidity Electrostatic Discharge Table 5 Electrostatic Discharge Parameters Symbol Name Details Level Maximum Unit Electrostatic discharge VESD(HBM) voltage TA= +25 C , JESD22-A114 2 2000
(Human Body Model) Electrostatic discharge voltage
(Charged Device Model) VESD(CDM) TA = +25 C , JESD22-C101 II 500 V 9 / 21 Datasheet 3. RF parameters Basic RF parameters Table 6 Radio-frequency standards Name Illustration Working frequency 2.412~2.484GHz Wi-Fi wireless standard IEEE802.11b/g/n Data transmission rate 11b1,2,5.5 11Mbps 20MHz 11g : 6,9,12,18,24,36,48,54Mbps 11n : MCS0~7,72.2Mbps Antenna type TX Performance PCB (Default) IPX (Optional) 3.2.1 Transmit performance of IEEE802.11b mode Table 7 CCK_11 transmit performance parameters of IEEE802.11b mode Category Mode Channel Rate TX Content IEEE802.11b CH1 to CH13 1, 2, 5.5, 11Mbps Minimum Typ. Maximum Unit 1. Output power 14.5 16.5 18.0 dBm 2. Spectrum template 1) fc +/-11MHz to +/-22MHz
-
2) fc > +/-22MHz -
3. Frequency offset 4. EVM( Peak EVM) 1) 1~11Mbps
-15
-
-
-
-2
-
dBr dBr ppm
-30
-50
+15 35%
Maximum RX Minimum receiving sensitivity Minimum Typ
(IEEE Spec) Unit 1Mbps (FER8%) 11Mbps (FER8%)
-
-
-98
-89
-83
-76 dBm dBm 10 / 21 Datasheet 3.2.2 Transmit performance of IEEE802.11g mode Table 8 OFDM_54 transmit performance parameters of IEEE802.11g mode Category Mode Channel Rate TX Content IEEE802.11g CH1 to CH13 6, 9, 12, 18, 24, 36, 48, 54Mbps Minimum Typ Maximum Unit 1. Output Power 12.5 14.5 16.5 dBm 2. Spectrum template 1) at fc +/- 11MHz 2) at fc +/- 20MHz 3) at fc > +/-30MHz 3. Frequency offset 4. EVM( Peak EVM) 6Mbps 54Mbps
-
-
-15
-
-
-
-
-2
-30
-31
-20
-28
-40 dBr dBr dBr
+15 ppm dBm dBm
-5
-25 Maximum RX Minimum receiving sensitivity Minimum Typ
(IEEE Spec) Unit 6Mbps (FER10%) 54Mbps (FER10%)
-
-
-92
-76
-82
-65 dBm dBm 3.2.3 Transmit performance of IEEE802.11n-HT20 mode Table 9 MCS7 transmit performance parameters of IEEE802.11n-HT20 mode Category Mode Channel Rate TX Content IEEE802.11n HT20 CH1 to CH13 MCS0/1/2/3/4/5/6/7, Maximum 65Mbps Minimum Typ Maximum Unit 1. Output power 11.5 13.5 15.5 dBm 2. Spectrum template 11 / 21 Datasheet 1) at fc +/- 11MHz 2) at fc +/- 20MHz 3) at fc > +/-30MHz 3. Frequency offset 4. EVM( Peak EVM) MCS0 MCS7
-
-
-15
-
-
-
-
-2
-30
-32
-20
-28
-45 dBr dBr dBr
+15 ppm
-5
-27 Maximum dBm dBm RX Minimum receiving sensitivity Minimum Typ
(IEEE Spec) Unit MCS0 (FER10%) MCS7 (FER10%)
-
-
-92
-73
-82
-64 dBm dBm 12 / 21 Datasheet 4. Antenna Information Type of Antenna EMW3092 is a PCB on-board antenna. Please pay attention to the module PCB onboard antenna clearance area while using. PCB antenna clearance area When using a PCB antenna on a WIFI module, you need to ensure that the distance between the motherboard PCB and other metal components is at least 16mm. The shaded areas in the figure below need to be kept away from metal components, sensors, sources of interference, and other materials that may cause signal interference. Figure 6 PCB antenna minimum clearance area (unit: mm) 13 / 21 Datasheet 5. Assembly Information and Production Guidance Production Guidance The stamp hole package module produced by Mxchip must completely being patched by SMT machine in 24 hours after open firmware package. Otherwise the module should be re-package by vacuum pumping and drying before patch. Devices for SMT patch:
1Reflow soldering machine 2AOI detector 3Suction nozzle with 6-8mm caliber Device for drying:
1Cabinet type oven 2Anti-static and high thermos tolerant tray 3Anti-static and high thermos tolerant gloves Conditions of product storage (Storage environment is shown in figure 8):
Moisture bag must be stored in temperature below 30 and humidity less than 85%RH. Dry packaging products, the guarantee period should be from 6 months date of packing seal. Humidity indicator card is in the hermetic package. Figure 7 Humidity Card Humidity indicator card and drying situation:
2 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is blue after unpacking;
4 hours drying for module if the color ring at 30% in humidity indicator card is pink after unpacking;
6 hours drying for module if the color ring at 30%, 40% in humidity indicator card is pink after unpacking;
14 / 21 Datasheet 12 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is pink after unpacking. Drying parameters:
Drying temperature: 1255 Alarm temperature: 130 SMT patch when the device cool down below 36 in natural condition;
Dry times: 1;
Please dry again if the module is unsoldering in 12 hours after last drying. SMT is unsuitable if the module packed over 3 months. There would be serious oxidation of the pad because of immersion gold and cause false welding and lack of weld. Mxchip does not assume the corresponding responsibility;
ESD protection is required before SMT;
SMT patch should on the basis of reflow profile diagram, maximum temperature 245, reflow profile diagram is shown in figure 10;
In order to guarantee the reflow soldering qualification rate, vision and AOI detection should be done in 10% products for the first patch to make sure the rationality of temperature control, device adsorption mode and position. Detect 5 to 10 sample every hour in the following batch production. Considerations Operator should wear anti-static gloves during producing;
No more than drying time;
Any explosive, flammable and corrosive material is not allowed to add in drying;
Module should be put into oven with high thermotolerant tray. Ventilation should exist between each module and no direct contact with oven;
Make sure oven is closed when drying to prevent temperature leaking;
Reduce opening time or keep closing the door of the oven during drying;
Use anti-static glove to take out module when its temperature below 36 by natural cool down after drying;
Make sure no water and dirt in the bottom of the module;
Temperature and humidity control is level 3 for initial modules. Storage and drying conditions are based on IPC/JEDEC J-STD-020. 15 / 21 Datasheet Storage Condition Figure 8 Storage Condition 16 / 21 Datasheet Temperature Curve of Secondary Reflow Suggested solder paste type: SAC305, unleaded, solder paste thickness from 0.12 to 0.15, less than 2 times reflow. Figure 9 Temperature Curve of Secondary Reflow 17 / 21 Datasheet 6. FCC& IC Information FCC Warning Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. The device has been evaluated to meet general RF exposure requirement. IC warning English:
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference, and (2) This device must accept any interference, including interference that may cause undesired operation of the device. French:
Le prsentappareilestconforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationestautorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et.
(2) l'utilisateur de l'appareildoit accepter tout brouillageradiolectriquesubi, mmesi le brouillageest susceptible d'encompromettre le fonctionnement. Other information This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. There are more information you should know here:
Module is limited to OEM installation ONLY. 18 / 21 Datasheet OEM integrators is responsible for ensuring that the end-user has no manual instructions to remove or install module. Module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). Separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations. Labeling instructions of finished products. Example: Contains Transmitter Module FCC ID: P53-EMW3092 or Contains FCC ID: P53-EMW3092 19 / 21 Datasheet 7. Sales Information and Technical Support For consultation or purchase the product, please contact Mxchip during working hours:
From Monday to Friday, morning 9:00~12:00, afternoon 13:00~18:00 Telephone: +86-21-52655026 Contact address: 9thFloor, No.5, Lane2145 JinshaJiang Road Putuo District, ShangHai. Postcode200333 Email: sales@mxchip.com 20 / 21