all | frequencies |
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exhibits | applications |
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manual |
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Users Manual | Users Manual | 3.98 MiB | August 07 2019 / September 07 2019 | |||
1 2 3 | Cover Letter(s) | August 07 2019 / September 07 2019 | ||||||
1 2 3 | Cover Letter(s) | August 07 2019 / September 07 2019 | ||||||
1 2 3 | ID Label/Location Info | August 07 2019 / September 07 2019 | ||||||
1 2 3 | RF Exposure Info | August 07 2019 / September 07 2019 | ||||||
1 2 3 | Cover Letter(s) | August 07 2019 / September 07 2019 | ||||||
1 2 3 | Test Report | August 07 2019 / September 07 2019 | ||||||
1 2 3 | Test Report | August 07 2019 / September 07 2019 | ||||||
1 2 3 | Cover Letter(s) | August 07 2019 / September 07 2019 | ||||||
1 2 3 | Test Report | August 07 2019 / September 07 2019 | ||||||
1 2 3 | Test Report | August 07 2019 / September 07 2019 | ||||||
1 2 3 | Test Report | August 07 2019 / September 07 2019 | ||||||
1 2 3 | Cover Letter(s) | August 07 2019 / September 07 2019 |
1 2 3 | Users Manual | Users Manual | 3.98 MiB | August 07 2019 / September 07 2019 |
Title:
Drawing Type :
IEEE802.11ac wave2 SDIO wireless LAN module SX-SDMAC2-2830 Product specifications Drawing No.:
JW205100XX Date :
May 30, 2019 silex technology, Inc.
(1/58) CONFIDENTIAL Drawing No.JW205100XX Date Prepared by Checked by Approved by May. 30, 19 Y.Kuroda K.Hamada Y.Shibuya
(Revision history) Rev. Description XX The first edtion silex technology, Inc.
(2/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 4.1. 4.2. 4.3. 3.1. 3.2. 3.3. 3.4. 3.5. 3.6. 3.7. 3.8. 3.9. 3.10.
(Index) 1. (Product introduction) ........................................................................................................... 4 2. (Hardware block diagram) ................................................................................. 6 3. (Board specifications) ........................................................................................................... 7
(General specifications) .....................................................................................................7
(Environmental conditions) ................................................................................................8
(Electrical specifications) .................................................................................................9
(Current consumption specifications) ........................................................................... 11 LAN (Wireless LAN general specifications) .................................................................... 13 LAN (Wireless LAN transmitter specifications) ............................................................... 15 LAN (Wireless LAN Receiver specifications)................................................................... 18 Bluetooth (Bluetooth general specifications) ....................................................................... 20 Bluetooth (Bluetooth Transmitter specifications) .................................................................. 21 Bluetooth (Bluetooth Receiver specifications) ...................................................................... 21 4. (Signal pin specifications) .................................................................................................... 22
(Pin locations) ................................................................................................................ 22
(Signal specifications) ..................................................................................................... 23
(Signal definitions) .......................................................................................................... 28 5. / (Interface / timing specifications) ........................................................ 29 WLAN SDIO AC (WLAN SDIO AC timing specifications) ................................................ 29 Bluetooth UART (Bluetooth UART interface specifications) .......................................................... 33 Bluetooth (Bluetooth audio interface specifications) ........................................ 34 ON/OFF, (Power on/off and reset timing) ..................................................... 35 6. (Standards Compliance) ...................................................................................................... 36
(Standard list) ................................................................................................................ 36
(Recommended Antenna List) .............................................................................. 37 Federal Communications Commission (FCC) Statement .................................................................... 38 Canada, Industry Canada (IC) ...................................................................................................... 40 7. (Mechanical Specifications) ............................................................................................... 42 8. (Indication specifications) .................................................................................................... 43 9. (Components composition List) ......................................................................................... 44 10. (Packing specifications) ....................................................................................................... 45 11. (Reliability test) ............................................................................................................... 48 12. (Notifications) .............................................................................................................. 51 13. A (Appendix-A Reference land design) ............................................................... 53 14. B SMT (Appendix -B SMT reflow profiles) .............................................................. 54 15. C (Appendix -C TX power at each destination) .............................................. 55 Japan ......................................................................................................................................... 55 EU ............................................................................................................................................. 56 US ............................................................................................................................................. 57 5.1. 5.2. 5.3. 5.4. 6.1. 6.2. 6.3. 6.4. 15.1. 15.2. 15.3. silex technology, Inc.
(3/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX SX-SDMAC2
/(HVIN)SX-SDMAC2 This document describes about SX-SDMAC2. Model name/Hardware Version Identification Number (HVIN) of this module is SX-SDMAC2. 1. (Product introduction) SX-SDMAC2 QCA9379-3 (Qualcomm Atheros )2.4GHz/5GHz Dual Band IEEE 802.11 a/b/g/n/acBluetooth 5.0 BR/EDR/LE (Class1) SDIO3.0 MAC/BBP/RF/RF /
The SX-SDMAC2 is a 2.4 GHz / 5GHz dual band IEEE802.11 a/b/g/n/ac WLAN and Bluetooth 5.0 BR/EDR/LE (Class1) module based on Qualcomm QCA9379-3 chipset. The SX-SDMAC2 highly integrates MAC, Base band, RF, RF front end and peripheral circuitry like power unit, reference clock, etc. silex technology, Inc.
(4/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 2 spatial data stream system (2T2R) IEEE802.11a/b/g/n/ac compliant (2.4 GHz, 5 GHz)
(Features) IEEE802.11a/b/g/n/ac (2.4 GHz, 5 GHz) 2 (2T2R) 5 GHz20/40/80 MHz (PHY 867 Mbps) PHY Data Rate 2.4 GHz20/40 MHz (PHY 300Mbps, PHY 400Mbps) 5 GHz: 20/40/80 MHz bandwidth mode (PHY Data rate 867 Mbps) 2.4 GHz: 20/40 MHz bandwidth mode (PHY Data rate 300 Mbps, Extra PHY Data rate 400Mbps) 802.11b/g 1-54 Mbps 802.11a 6-54 Mbps 802.11n 1T1R MCS0-7, 2T2R MCS8-15 802.11ac MCS0-9 Bluetooth 5.0 BR/EDR/LE (Class1). Backward-compatible to Bluetooth 1.x, 2.x, 3.0, 4.0, 4.1, 4.2 SDIO3.0 as the Wireless LAN host interface Bluetooth 5.0 BR/EDR/LE (Class1)Bluetooth 1.x, 2.x, 3.0, 4.0, 4.1, 4.2 Wireless LAN SDIO 3.0 Bluetooth UART
+3.3V, IO (VDD_GPIO1, VDD_SDIO)+1.8V/+3.3V EU RoHS 2011/65/EC (Lead Free) EU RoHS directive 2011/65/EC (Lead Free) compliant UART as the Bluetooth host interface
+3.3V main power supply, selectable +1.8V/+3.3V IO power supply (VDD_GPIO1, VDD_SDIO) silex technology, Inc.
(5/58) DateMay 30, 2019 CONFIDENTIAL 2. (Hardware block diagram) Drawing No.JW205100XX
(Acronyms) PMU DPX MHF I Power Management Unit Integrated Passive Device type Diplexer MHF-I co-axial connector (I-PEX) or compatible connector silex technology, Inc.
(6/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 3. (Board specifications) 3.1. (General specifications) Items Specifications Units Remarks Connection with the host board Antenna port 68-pin Land Grid Array
(Direct solder) MHF I connector x 3 Antenna port characteristics 50 SDIO v3.0 UART IEEE802.11a/b/g/n/ac Bluetooth 5.0 BR/EDR/LE Host interface RF interface Weight Dimensions MTTF pcs SWR < 3 : 1
(2.4-2.5GHz, 5.18-5.85GHz) For Wireless LAN For Bluetooth IEEE802.11-2012 IEEE802.11ac-2013 Max antenna gain
+4.0dBi@2.4GHz 5.1 g Typ. W x H x D 20.5 x 27.0 x 3.1 mm 7 (See 7) 90,000 Antenna connector Desorption number of times Reflow number of times 10 1 h Min. Times Max. Time Max. ESD ESD resistance Signal pins
+/-2000 V Human Body Model JESD22-A114-F
(with/ no power supply) Antenna connector
+/-2000 silex technology, Inc.
(7/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 3.2. (Environmental conditions) Items Specifications Min. Typ. Max. Units Remarks Recommended operating temperature
-30 +70 Recommended operating humidity 15 95 %RH
() Recommended storage temperature
(After assembly)
() Recommended storage humidity
(After assembly)
*NOTE 1 Recommended storage temperature
(In the warehouse, before assembly)
*NOTE 1 Recommended storage temperature
(In the warehouse, before assembly)
-40 +85 15 95 %RH
+5 +35 20 60 %RH Moisture Sensitivity Level (MSL) 3 Ambient temperature After assembled with powered No condensing After assembled with powered After assembled with no-powered No condensing After assembled with no-powered MSL Packaged. Apply MSL after unpackaged. No condensing MSL Packaged. Apply MSL after unpackaged. IPC/JEDEC J-STD-020D See below standard for handling IPC/JEDEC J-STD-033C*NOTE 1 NOTE1
( 1 ) 10%RH 10%RH 10 1 This is condition to keep the product in the warehouse for long term (1 year after shipping from Silex). In case of unpacked of the dry pack, humidity of inside shall be keep less than 10%RH. To know whether humidity in the dry pack is exceed 10%RH or not, please check out the humidity indication card (HIC). After 1 year from shipping or in case it might be exceeded this condition due to transportation, checking HIC or checking solderability before production is strongly recommended. NOTE2 (Recommended baking conditions)
(Board only)125+10/-0 24 hours
(With reel)40+5/-0 5%RH 13 days JEDEC J-STD-033 30/60%RH 168 10 10%RH In case 30/60%RH with handling rule of JEDEC-STD-033 and floor time is exceeded 168hrs, baking must be necessary. Even before unpacking the dry pack, baking must be necessary if color of HIC is changed to color of 10%RH or more. silex technology, Inc.
(8/58) DateMay 30, 2019 CONFIDENTIAL 3.3. (Electrical specifications)
(Absolute maximum rating) Items Main power supply
(VDD33) IO (VDDIO_GPIO1) IO Power supply voltage SDIO (VDDIO_SDIO) SDIO Power supply voltage
(Recommended operating conditions)
(Main power supply) Drawing No.JW205100XX Specifications Min. Typ. Max.
-0.3
+3.6
-0.3
-0.3
+3.6
+3.6 Units Remarks V V V Items Specifications Min. Typ. Max. Units Remarks
+3.14 +3.30 +3.46 V Main power supply
(VDD33) IO /SDIO +3.3V (IO power supply/SDIO power supply, +3.3V operation) Items IO (VDDIO_GPIO1) IO Power supply voltage SDIO (VDDIO_SDIO) SDIO Power supply voltage Specifications Min. Typ. Max. Units Remarks
+3.14 +3.30 +3.46
+3.14 +3.30 +3.46 V V IO /SDIO +1.8V (IO power supply/SDIO power supply, +1.8V operation) Items IO (VDDIO_GPIO1) IO Power supply voltage SDIO (VDDIO_SDIO) SDIO Power supply voltage Specifications Min. Typ. Max. Units Remarks
+1.71 +1.80 +1.89
+1.71 +1.80 +1.89 V V silex technology, Inc.
(9/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX
(Digital logic signal level) 1) VIO (VDDIO_GPIO1, VDDIO_SDIO) = +3.3V operation Specifications Items Parameters Output/Input current Min. Typ. Max. Units Remarks VIH VIL VOH VOL High Input High voltage Low Input Low voltage High Output High voltage Low Output Low voltage 0.7 x VIO
+3.3
-0.3 VIO +
0.3 V 0.3 x VIO V V 0.1 x VIO V IOH = 3mA VIO - 0.4 IOL = -11mA 2) VIO (VDDIO_GPIO1, VDDIO_SDIO) = +1.8V operation Specifications Items Parameters Output/Input current Min. Typ. Max. Units Remarks VIH VIL VOH VOL High Input High voltage Low Input Low voltage High Output High voltage Low Output Low voltage 0.7 x VIO
+1.8
-0.3 VIO +
0.2 V 0.3 x VIO V VIO V 0.1 x VIO V IOH = 3mA VIO - 0.4 IOL = -11mA NOTE1 I/O
+1.8V IO375mV (Typ.), +3.3V IO645mV (Typ.) Schmitt trigger is prepared for all I/O pins. Schmitt hysteresis is +1.8V IO375mV (Typ.), +3.3V IO645mV (Typ.). NOTE2 UHS-I(Ultra High Speed) VDDIO_SDIO +1.8V HS(High Speed)/DS(Default Speed) VDDIO_SDIO +3.3V / +1.8V Supported only VDDIO_SDIO=+1.8V as UHS-I (Ultra High Speed) mode. Supported only VDDIO_SDIO=+1.8V/+3.3V as HS (High Speed) and DS (Default Speed) mode. silex technology, Inc.
(10/58) DateMay 30, 2019 CONFIDENTIAL 3.4. (Current consumption specifications) VDD (WLAN operating) Items Units Remarks Modes Standards Typ. Max. Specifications Drawing No.JW205100XX Current consumption 2.4GHz Current consumption 5GHz TX 11b 300 410 mA 11g 330 430 mA 11ng HT20 330 400 mA 1T1R 11ng HT20 640 710 mA 2T2R 11ng HT40 330 420 mA 1T1R 11ng HT40 640 770 mA 2T2R Rx All mode 120 150 mA 1T1R Rx All mode 150 170 mA 2T2R TX 11a 490 610 mA 11na HT20 480 580 mA 1T1R 11na HT20 920 1080 mA 2T2R 11na HT40 470 580 mA 1T1R 11na HT40 870 1040 mA 2T2R 11ac VHT80 470 580 mA 1T1R 11ac VHT80 890 1050 mA 2T2R Rx All mode 120 140 mA 1T1R Rx All mode 130 150 mA 2T2R silex technology, Inc.
(11/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX NOTE1:
Typ.: /
Average value of unevenness of average current per unit with continuous transmit/receive mode of the test tool. Max.: /
Maximum value of unevenness of peak current per unit with continuous transmit/receive mode of the test tool. NOTE2 VDD33(WLAN operating) VDDIO_GPIO1 Total power consumption is total of VDD33 (WLAN operating) and VDDIO_GPIO1. Note that combination of each mode. silex technology, Inc.
(12/58) DateMay 30, 2019 CONFIDENTIAL 3.5. LAN (Wireless LAN general specifications) Items Specifications Units Remarks Drawing No.JW205100XX Chipset
/
Country/Region code QCA9379-3 (Qualcomm Atheros) 0x0000
*NOTE1 Band Modes Min Max Operating frequencies 2.4GHz 11b 2412 2472 MHz 11g/n/ac 20MHz 2412 2472 MHz 11g/n/ac 40MHz 2422 2462 MHz 5GHz 11a/n/ac 20MHz 5180 5825 MHz 11n/ac 40MHz 5190 5795 MHz 11ac 80MHz 5210 5775 MHz 2.4GHz 11b/g/n Frequency steps 5GHz 11a/n/ac 20MHz Data rates 11n/ac 40MHz 11ac 80MHz 11b 1,2,5.5L,5.5S,11L,11S 11a/g 6,9,12,18,24,36,48,54 11n 1stream 11n 2stream MCS 0,1,2,3,4,5,6,7 MCS 8,9,10,11,12,13,14,15 11ac MCS 0,1,2,3,4,5,6,7,8,9 5 20 40 80 11b DSSS(DBPSK,DQPSK,CCK) Modulation types 11a/g/n OFDM(BPSK,QPSK,16QAM,64QAM) Encryptions 11ac RC4 AES OFDM
(BPSK,QPSK,16QAM,64QAM,256QAM) 128 128 MHz MHz MHz MHz Mbps Mbps bits bits NOTE1 / (Country/Region code)
/ 0x0000 0x0000 is programed into the memory of the module as the default value. This code is assumed to be changed to the other code by driver when the module is loaded. silex technology, Inc.
(13/58) DateMay 30, 2019 CONFIDENTIAL
(Operatable channel list) Drawing No.JW205100XX 2.4GHz 5GHz US/CA EU/JP US CA EU/JP 20MHz 40MHz 20MHz 40MHz 20MHz 40MHz 80MHz 20MHz 40MHz 80MHz 20MHz 40MHz 80MHz Ch.1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 Ch.3, 4, 5, 6, 7, 8, 9 Ch.1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13 Ch.3, 4, 5, 6, 7, 8, 9, 10, 11 Ch.36,40,44,48,52,56,60,64,100,104,108,112,116,120, 124,128,132,136,140,149,153,157,161,165 Ch.38,46,54,62,102,110,118,126,134,151,159 Ch.42,58,106,122,155 Ch.36,40,44,48,52,56,60,64,100,104,108,112,116,132, 136,140,149,153,157,161,165 Ch.38,46,54,62,102,110,134,151,159 Ch.42,58,106,155 Ch.36,40,44,48,52,56,60,64,100,104,108,112,116,120, 124,128,132,136,140 Ch.38,46,54,62,102,110,118,126,134 Ch.42,58,106,122 silex technology, Inc.
(14/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 3.6. LAN (Wireless LAN transmitter specifications) IEEE 802.11 There is maximum TX power which is compliant with IEEE 802.11 standard. Actual TX Power value of each channel is limited by the regulatory certification of each country, however. 2.4GHz (+25) Data Rates Index 1Mbps 2 Mbps 5.5 Mbps 11 Mbps 6 Mbps 9 Mbps 12 Mbps 18 Mbps 24 Mbps 36 Mbps 48 Mbps 54 Mbps MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 MCS8 MCS9 Standard Modulation 802.11b 802.11g 802.11n/ac 802.11ac
(optional) BPSK QPSK CCK CCK BPSK BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 64 QAM 256 QAM 256 QAM 2.4 GHz TX Power with IEEE 802.11 EVM and Spectral Mask at +25 802.11n/ac 802.11n/ac 802.11b/g Typical
+21.5
+21.5
+21.5
+21.5
+21.0
+21.0
+21.0
+21.0
+21.0
+20.5
+20.0
+19.0 20 MHz Typical 40 MHz Typical Units
+21.0
+21.0
+21.0
+21.0
+21.0
+19.5
+19.0
+18.5
+17.5
+19.5
+19.5
+19.5
+19.5
+19.5
+19.5
+19.5
+18.5
+17.5
+17.0 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm silex technology, Inc.
(15/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 5GHz (+25) Standard Modulation Data Rates BPSK BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM BPSK QPSK QPSK 16 QAM 16 QAM 64 QAM 64 QAM 64 QAM 256 QAM 256 QAM 802.11a 802.11n/ac 802.11ac
(optional) Index 6 Mbps 9 Mbps 12 Mbps 18 Mbps 24 Mbps 36 Mbps 48 Mbps 54 Mbps MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 MCS8 MCS9 5 GHZ TX Power with IEEE 802.11 EVM and Spectral Mask at +25 802.11n/ac 802.11n/ac 802.11n/ac 20 MHz Typical 40 MHz Typical 80 MHz Typical Units
+19.0
+19.0
+19.0
+19.0
+19.0
+18.0
+17.5
+17.0
+15.5
+18.0
+18.0
+18.0
+18.0
+18.0
+18.0
+17.5
+16.5
+15.0
+14.0
+18.0
+18.0
+18.0
+18.0
+18.0
+18.0
+17.0
+16.0
+14.0
+13.0 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm 802.11a Typical
+19.5
+19.5
+19.5
+19.5
+19.5
+18.5
+18.0
+17.0 NOTE1 Chain 2 Data stream +3.0dB Transmit power is the value from each single chain. When the device transmits 2 streams of data, total power can be +3.0dB. NOTE2 FCC/CE MIC 15 Actual TX Power value of each channel is limited by the regulatory certification. Please refer to the product specifications 15 regarding limited TX Power by FCC/CE and MIC. NOTE3 () Green TX The function that changes transmit power dynamically such as Green TX must be disabled when measure transmit power in normal mode (Non-test mode). silex technology, Inc.
(16/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX
(Transmit power uncertainty) (Operating temperature) Items Power uncertainty due to environmental conditions Temperature, Power supply Specifications Modes Min. Typ. Max. Units Remarks 802.11a 6-54Mbps
-2.0 802.11b 1-11Mbps
-2.0 802.11g 6-54Mbps
-2.0 802.11n/ac MSC0-9
-2.0
+2.0 dB
+2.0 dB
+2.0 dB
+2.0 dB
(Frequency accuracy) (Operating temperature) Item Frequency accuracy Specifications Standards Min. Typ. Max. Unit Remark 11a/11b/11g/11n/11ac
-20 0
+20 ppm silex technology, Inc.
(17/58) DateMay 30, 2019 CONFIDENTIAL 3.7. LAN (Wireless LAN Receiver specifications) 2.4GHz ( / Operating temperature Items Receiver minimum sensitivity 1x1 (1SS) Specifications Modes Min. Typ. 1Mbps 2Mbps 5.5Mbps 11Mbps 6Mbps 9Mbps 12Mbps 18Mbps 24Mbps 36Mbps 48Mbps 54Mbps MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 MCS8 MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 MCS8 MCS9
-97.0
-93.0
-93.0
-90.0
-92.0
-90.5
-89.5
-87.5
-84.0
-81.0
-77.0
-75.5
-91.5
-89.0
-87.0
-84.5
-81.5
-77.5
-76.0
-74.0
-70.0
-89.0
-87.0
-84.0
-81.5
-78.5
-74.0
-73.0
-71.5
-67.5
-65.5 11b
(FER<8%) 11g
(PER<10%) 11n/ac 20MHz
(PER<10%) 11n/ac 40MHz
(PER<10%) Drawing No.JW205100XX Max.
-76.0
-76.0
-76.0
-76.0
-82.0
-81.0
-79.0
-77.0
-74.0
-70.0
-66.0
-65.0
-82.0
-79.0
-77.0
-74.0
-70.0
-66.0
-65.0
-64.0
-59.0
-79.0
-76.0
-74.0
-71.0
-67.0
-63.0
-62.0
-61.0
-56.0
-54.0 Units Remarks dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm VHT dBm VHT silex technology, Inc.
(18/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 5GHz ( / Operating temperature Items Receiver minimum sensitivity 1x1 (1SS) Specifications Modes Min. Typ. 6Mbps 9Mbps 12Mbps 18Mbps 24Mbps 36Mbps 48Mbps 54Mbps MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 MCS8 MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 MCS8 MCS9 MCS0 MCS1 MCS2 MCS3 MCS4 MCS5 MCS6 MCS7 MCS8 MCS9
-89.0
-88.5
-87.0
-85.0
-81.0
-78.5
-74.0
-72.5
-89.0
-86.5
-85.0
-81.5
-78.5
-75.0
-73.0
-71.5
-67.0
-86.5
-84.5
-82.0
-79.0
-76.0
-71.5
-70.0
-69.0
-64.5
-63.0
-83.5
-81.5
-79.0
-76.0
-73.0
-68.0
-67.0
-66.0
-61.0
-58.5 11a
(PER<10%) 11n/ac 20MHz
(PER<10%) 11n/ac 40MHz
(PER<10%) 11ac 80MHz
(PER<10%) Max.
-82.0
-81.0
-79.0
-77.0
-74.0
-70.0
-66.0
-65.0
-82.0
-79.0
-77.0
-74.0
-70.0
-66.0
-65.0
-64.0
-59.0
-79.0
-76.0
-74.0
-71.0
-67.0
-63.0
-62.0
-61.0
-56.0
-54.0
-76.0
-73.0
-71.0
-68.0
-64.0
-60.0
-59.0
-58.0
-53.0
-51.0 Units Remarks VHT dBm dBm dBm dBm dBm dBm dBm dBm dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm dBm dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm HT/VHT dBm dBm VHT VHT VHT VHT silex technology, Inc.
(19/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 3.8. Bluetooth (Bluetooth general specifications) Items Specifications Units Remarks Chipset Core specification QCA9379-3 (Qualcomm Atheros) Bluetooth 5.0 Mode Min Max Operating Frequency range BR/EDR/LE 2402 2480 MHz Frequency step Modulation type LE PDU LE maximum PDU size Encryption BR/EDR LE 1 2 MHz Ch.1-Ch.79 MHz Ch.0-Ch.39 GFSK(1Mbps),
/4 DQPSK(2Mbps),8DPSK(3Mbps) 123 E0 AES 128 128 Octets bits BR/EDR bits LE silex technology, Inc.
(20/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 3.9. Bluetooth (Bluetooth Transmitter specifications) Bluetooth BR/EDR/LE (+25) Items Units Remarks Standards Min. Typ. Max. Specifications BR Class 1 Ch.1-Ch.79
-3.0 +2.5 +4.5 dBm Maximum TX power EDR Class 1 Ch.1-Ch.79
-6.6
-0.9 +1.0 dBm LE BR Ch.0-Ch.39
-1.6 +2.5 +6.1 dBm Ch.1-Ch.79 2 8 8 dB dB TX power step EDR Ch.1-Ch.79 2.5 Frequency accuracy (Operating temperature) Items Units Remarks Standards Min. Typ. Max. Specifications Center frequency accuracy BR/EDR/LE
-20
+20 ppm 3.10. Bluetooth (Bluetooth Receiver specifications) Bluetooth BR/EDR/LE ( / Operating temperature) Items Specifications Units Remarks Standards Packet Types Min. Typ. Max. Receiver minimum BR (BER<0.1%) GFSK (1Mbps) Sensitivity EDR (BER<0.01%)
/4 DQPSK (2Mbps) 8DPSK (3Mbps)
-95.5
-70 dBm
-99.5
-70 dBm
-87.0
-70 dBm
-96.5
-70 dBm LE (PER<30%) GFSK (1Mbps) silex technology, Inc.
(21/58) DateMay 30, 2019 CONFIDENTIAL 4. (Signal pin specifications) 4.1. (Pin locations) Drawing No.JW205100XX silex technology, Inc.
(22/58) DateMay 30, 2019 CONFIDENTIAL 4.2. (Signal specifications) Num Signal name Type I/O Domain Descriptions Drawing No.JW205100XX 1 VDDIO_SDIO 2 VDDIO_GPIO1 VDD33 3 4 P P P P P P WLAN SDIO SDIO power supply for WLAN.
+1.71 +3.46V IO IO power supply.
+1.71 +3.46V Main power supply.
+3.135+3.465V GND GND GND Ground 5 SDIO_D3 B VDDIO_SDIO 6 RESERVED DI VDDIO_SDIO WLAN SDIO Data[3]Bootstrap option Reset Pull-up SDIO Data [3] for WLAN. Since this pin is used for Bootstrap option, you must not drive this pin until releasing the reset signal. Internal Pull-up.
(Open)Bootstrap option Reset Pull-up Un-used signal. Keep Open. Since this pin is used for Bootstrap option, you must not drive this pin until releasing the reset signal. Internal Pull-up. 7 SDIO_CLK DI VDDIO_SDIO WLAN SDIO clock SDIO Clock for WLAN. 8 SDIO_D2 B VDDIO_SDIO WLAN SDIO Data[2]Bootstrap option Reset Pull-up SDIO Data [2] for WLAN. Since this pin is used for Bootstrap option, you must not drive this pin until releasing the reset signal. Internal Pull-up 9 SDIO_D0 B VDDIO_SDIO WLAN SDIO Data[0]
SDIO Data [0] for WLAN. 10 SDIO_D1 B VDDIO_SDIO WLAN SDIO Data[1]Bootstrap option Reset Pull-up SDIO Data [1] for WLAN. Since this pin is used for Bootstrap option, you must not drive this pin until releasing the reset signal. Internal Pull-up 11 SDIO_CMD B VDDIO_SDIO WLAN SDIO Command SDIO command for WLAN. 12 GND GND GND Ground 13 WLAN_PWD_L DI VDD33 14 BT_PWD_L DI VDD33 WLAN HW (0=Disable, 1=Enable) Pull-down WLAN reset. (0=Disable, 1=Enable) Internal Pull-down. BT HW (0=Disable, 1=Enable) Pull-down BT HW reset. (0=Disable, 1=Enable) Internal Pull-down. 15 RESERVED DO VDD33
() IO Pull-up Test pad (Open) Un-used signal (Debug port). Open drain output. Recommended to connect to a test pad and need external pull-up to IO power rail of the connected external system if the debug function is used. Keep Open if the debug function is not used. silex technology, Inc.
(23/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX Num Signal name Type I/O Domain Descriptions 16 17 GND GND GND GND GND GND Ground Ground 18 BT_WKUP_HOST OD VDD33 Bluetooth wakeup the host. Active high. 19 RESERVED DI VDD33
(Open) Un-used signal. Keep Open. 20 QoW B VDD33 Wake on wireless High IO Pull-up Wake on wireless signal. Active High. Open drain output. Need external pull-up to IO power rail of the host system. 21 GND GND GND Ground 22 GND GND GND Ground 23 GND GND GND Ground 24 GND GND GND Ground 25 GND GND GND Ground 26 GND GND GND Ground 27 GND GND GND Ground 28 VDD33 29 VDD33 30 VDD33 31 VDD33 32 VDD33 P P P P P P P P P P Main power supply.
+3.135+3.465V Main power supply.
+3.135+3.465V Main power supply.
+3.135+3.465V Main power supply.
+3.135+3.465V Main power supply.
+3.135+3.465V 33 GND GND GND Ground 34 GND GND GND Ground silex technology, Inc.
(24/58) DateMay 30, 2019 CONFIDENTIAL Num Signal name Type I/O Domain Descriptions Drawing No.JW205100XX 35 36 GND GND GND GND GND GND Ground Ground 37 GND GND GND Ground 38 GND GND GND Ground 39 GND GND GND Ground 40 GND GND GND Ground 41 GND GND GND Ground 42 GND GND GND Ground 43 GND GND GND Ground 44 GND GND GND Ground 45 GND GND GND Ground 46 GND GND GND Ground 47 GND GND GND Ground 48 GND GND GND Ground 49 GND GND GND Ground silex technology, Inc.
(25/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX Num Signal name Type I/O Domain Descriptions 50 51 GND GND GND GND GND GND Ground Ground 52 VDD33 P P 53 RESERVED DI VDD33 Main power supply.
+3.135+3.465V
(Open) Un-used signal. Keep Open. 54 PCM_IN DI VDDIO_GPIO1 BT PCM IN. Keep Open if BT Audio is not used. BT PCM IN BT Audio (Open)
* I2S CODEC 55 BT_UART_CTS DI VDDIO_GPIO1 56 BT_UART_TXD DO VDDIO_GPIO1 57 BT_UART_RXD DI VDDIO_GPIO1
*No testing function. Need to verify with your I2S device or CODEC. If you need this function please contact silex support. BT UART CTS Bootstrap option Reset BT (Open) Pull-up UART CTS for BT. Since this pin is used for Bootstrap option, you must not drive this pin until releasing the reset signal. Keep Open if BT is not used. Internal Pull-up. BT UART TXD Bootstrap option Reset BT (Open) Pull-up UART TXD for BT. Since this pin is used for Bootstrap option, you must not drive this pin until releasing the reset signal. Keep Open if BT is not used. Internal Pull-up. BT UART RXD Bootstrap option Reset BT (Open) Pull-up UART RXD for BT. Since this pin is used for Bootstrap option, you must not drive this pin until releasing the reset signal.Keep Open if BT is not used. Internal Pull-up. 58 GND GND GND Ground 59 3D_FRAME_SYNC DI VDDIO_GPIO1 Frame sync signals from TV to sync with 3D glass via Bluetooth. 60 HOST_WKUP_BT DI VDDIO_GPIO1 Host wakeup Bluetooth through UART. Active Low. 61 GND GND GND Ground silex technology, Inc.
(26/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX Num Signal name Type I/O Domain Descriptions 62 PCM_SYNC DI VDDIO_GPIO1 BT PCM SYNC BT Audio (Open) Pull-down. * I2S CODEC BT PCM SYNC. Keep Open if BT Audio is not used. Internal pull-down.
*No testing function. Need to verify with your I2S device or CODEC. If you need this function please contact silex support. BT PCM OUT BT Audio (Open)
* I2S CODEC 63 PCM_OUT DO VDDIO_GPIO1 BT PCM OUT. Keep Open if BT Audio is not used.
*No testing function. Need to verify with your I2S device or CODEC. If you need this function please contact silex support. 64 GND GND GND Ground 65 GND GND GND Ground 66 RESERVED DO VDDIO_GPIO1
(Open) Un-used signal. Keep Open. 67 BT_UART_RTS DO VDDIO_GPIO1 BT UART RTS BT (Open) UART RTS for BT. Keep Open if BT is not used. 68 PCM_BCK DI VDDIO_GPIO1 BT PCM BCK Bootstrap option Reset BT Audio (Open) Pull-down. *
I2S CODEC BT PCM BCK. Bootstrap option, you must not drive this pin until releasing the reset signal. Keep Open if BT Audio is not used. Internal Pull-down.
*No testing function. Need to verify with your I2S device or CODEC. If you need this function please contact silex support. EXPGND Exposed Ground GND GND Exposed Ground 6 pads silex technology, Inc.
(27/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 4.3. (Signal definitions) Symbols Descriptions B DI DO OD P GND CMOS CMOS bidirectional digital signal CMOS CMOS digital input CMOS CMOS digital output Open drain digital output Voltage supply Ground silex technology, Inc.
(28/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 5. / (Interface / timing specifications) 5.1. WLAN SDIO AC (WLAN SDIO AC timing specifications) Default Speed Symbols Items fPP fOD tWL tWH tTLH tTHL tISU tIH tODLY tODLY Clock frequency Data Transfer Mode Clock frequency Identification Mode Clock low time Clock high time Clock rise time Clock fall time Input setup time Input hold time Output Delay time during Data Transfer Mode Output Delay time during Identification Mode Specifications Min. Max. Units Remarks 0 100 10 10 5 5 0 0 25 400 10 10 14 50 MHz kHz nsec nsec nsec nsec nsec nsec nsec nsec Stop:0Hz silex technology, Inc.
(29/58) DateMay 30, 2019 CONFIDENTIAL High Speed Drawing No.JW205100XX Symbols Items Specifications Min. Max. Units Remarks fPP tWL tWH tTLH tTHL tISU tIH tODLY tOH Clock frequency Data Transfer Mode Clock low time Clock high time Clock rise time Clock fall time Input setup time Input hold time Output Delay time during Identification Mode Output Hold time 0 7 7 6 2 2.5 50 3 3 14 MHz nsec nsec nsec nsec nsec nsec nsec nsec silex technology, Inc.
(30/58) DateMay 30, 2019 CONFIDENTIAL Ultra High Speed (UHS/SDR mode) Drawing No.JW205100XX Symbols Items fCLK tCR tCF tIS tIH tIS tIH tODLY tODLY tOHLD tOP tODW Clock frequency Data Transfer Mode Clock rise time Clock fall time Input setup time Input hold time Input setup time Input hold time Output Delay time during Identification Mode Output Delay time during Identification Mode Output Hold time Card Output phase Output valid data window NOTE1:
0.96 nsec(Max.) at SDR104 (208MHz) 2.00 nsec(Max.) at SDR50 (100MHz) 40.00 nsec(Max.) at SDR25 (50MHz) Specifications Max. Min. Units Remarks 0 1.4 0.8 3.0 0.8 1.5 0 2.88 208 MHz 0.2*1/ fCLK nsec NOTE1 0.2*1/ fCLK nsec NOTE1 7.5 14 9.6 nsec SDR104 nsec SDR104 nsec SDR50 nsec SDR50 nsec SDR50 nsec SDR25 nsec nsec SDR104 nsec SDR104 silex technology, Inc.
(31/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX SDIO (SDIO signal length) SDIO SD_CLK Skew of SDIO signal lines are recommended on the host board. Signals PCB SD_CLK SD_CMD 5.6581 4.1752 SD_DATA3 6.5884 SD_DATA2 5.4256 SD_DATA1 4.5592 SD_DATA0 3.727 Difference from SD_CLK signal 0
-1.483
+0.9303
-0.2325
-1.0989
-1.9311 Units mm mm mm mm mm mm Diff from CLK SD_CLK Diff from CLK + SD_CLK - SD_CLK The value of tables means the length of SDIO signals on the module, and Diff from CLK means the difference of each SD signals length from SD_CLK. + means the length of SD signal should be shorter from SD_CLK,
- means the length of SD signal should be longer from SD_CLK on your board to equate the length of SD signals. silex technology, Inc.
(32/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 5.2. Bluetooth UART (Bluetooth UART interface specifications) HCI Bluetooth HCI-UART This module supports standard HCI-UART interface so its compatible with HCI upper layer Bluetooth stacks. Items Baud rates Number of data bits Parity bit Stop bit Flow control Specification Units Remarks 115200, 375000, 460800, 750000, 1500000, 3000000, 4000000 8 None 1 RTS/CTS bps bits bit Flow control is necessary. Bluetooth SIG Bluetooth Core See Bluetooth core specifications from Bluetooth SIG for further information. https://www.bluetooth.com/specifications/
URL The Link URL might be changed or be removed without notification. silex technology, Inc.
(33/58) DateMay 30, 2019 CONFIDENTIAL 5.3. Bluetooth (Bluetooth audio interface specifications) Bluetooth PCM I2S The audio interface of this module is configurable either PCM or I2S protocol by top-level register setting Drawing No.JW205100XX of software. CODEC types Items Specifications Remarks Codec CVSD, SBC Over PCM/I2S or HCI Synchronous audio interface (SCO profile) Items Specifications Units Remarks Interface modes PCM/I2S Master/Slave(Default) Sampling frequencies 8kHz / 16 kHz 8kHz / 16 kHz Sample-based operations PCM PCM data formats A-law,-law 8-bit,13-bit,14-bit,16-bit Linear mono 8K,16K,32K,48K,96K Samples Switch by Software PCM PCM clock frequencies 64,96,128,192,256,384,512,768,1024,1536, 1544,2048,3072,4096 kHz I2S I2S clock frequencies 2.4 Asynchronous audio interface (A2DP profile) MHz Max. Items Specifications Units Remarks Mode HCI UART silex technology, Inc.
(34/58) DateMay 30, 2019 CONFIDENTIAL 5.4. ON/OFF, (Power on/off and reset timing) Drawing No.JW205100XX Symbols Descriptions TA TB TC TD TE Specification Min. Max. Units 1 0 sec 0 sec 10 sec 0 msec 10 sec If VDDIO_GPIO1 connected to 1.8 V If VDDIO_GPIO1 connected to 3.3 V VDDIO_GPIO1 90%
WLAN/BT (De-assert) Time from VDDIO_GPIO1 reaches 90%
to WLAN/BT reset release (De-assert). WLAN_PWD_L=High(De-assert) WLAN load process Time from BT_PWD_L = High(De-assert) to WLAN load process start WLAN/BT Low(Assert) VDDIO_GPIO OFF Time from WLAN/BT reset = Low to VDDIO_GPIO = OFF. If VDDIO_GPIO1 connected to 1.8 V 0 sec If VDDIO_GPIO1 connected to 3.3 V sec silex technology, Inc.
(35/58) DateMay 30, 2019 CONFIDENTIAL Power Up SequencePower Down SequenceVDDIO_GPIO1WLAN_PWD_LBT_PWD_LWLAN load process(Software)WLAN load process(insmod or load script)TCVDD33TATBTDTEBT load process(Software)BT load process(insmod or load script) Drawing No.JW205100XX 6. (Standards Compliance) 6.1. (Standard list)
(Standards conformity) IEEE802.11-2012 (a/b/g/n) IEEE802.11ac-2013 Bluetooth 5.0 BR/EDR/LE (DID: D036525) * (Antenna Gain) +4.0dBi (Max.) SDIO v3.0
(Law regulation compliance)
(MIC) 2 1 19 (Infra /, Wi-Fi Direct, Bluetooth) 2 1 19 3 (W52 Infra /W53 Infra ) 2 1 19 3 2 (Infra ) Article 2 paragraph 1 Article 2 paragraph 1 Article 2 paragraph 1
(Certification number) : 007-AH0068 FCC Part15 (Subpart C, Subpart E) Subpart C (2.4GHz Infra , Wi-Fi Direct, Bluetooth. 2.4GHz Infra Slave mode Wi-Fi Direct, Bluetooth.) Subpart E (W52/W58 Infra , W53/W56 Infra . W52/W58 Infra Slave mode, W53/W56 Infra Slave item (19) (Infra Master/Slave mode, Wi-Fi Direct, Bluetooth) item (19)-3 (W52 Infra Master/Slave modeW53 Infra Slave mode) item (19)-3-2 (Infra Slave mode) mode.) ID: N6C-SDMAC2 ISED RSS-247 Subpart C (2.4GHz Infra , Wi-Fi Direct, Bluetooth. 2.4GHz Infra Slave mode Wi-Fi Direct, Bluetooth.) Subpart E (W52/W58 Infra , W53/W56 Infra . W52/W58 Infra Slave mode, W53/W56 Infra Slave mode.) ID: 4908A-SDMAC2 ETSI (EN 300 328, EN 301 893) EN 300 328 (2.4GHz Infra , Wi-Fi Direct, Bluetooth. 2.4GHz Infra Slave mode Wi-Fi Direct, Bluetooth.) EN 301 893 (W52 Infra , W53/W56 Infra . W52 Infra Slave mode, W53/W56 Infra Slave mode.) CE RoHS Directive
(Countries) Asia Japan North America US Canada EU silex technology, Inc.
(36/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 6.2. (Recommended Antenna List)
(Japan) MIC Antennas Vendors Antenna 2.4GHz Type Gain 5GHz Gain No.19 No.19-2 No.19-3 No.19-3-2 2.4GHz 2.484GHz W52/53 W56 AA258 (H2B1PC1A1C)
(Exclude cable loss) AA222 (H2B1PD1A1C)
(Exclude cable loss) 146153
(Exclude cable loss) 1000418
(Exclude cable loss) GRF1762/GRF1802
(Exclude cable loss) GRF1763
(Exclude cable loss) ANTDC-081A0/B0
(Exclude cable loss) ANTDP-027A0
(Exclude cable loss) Unictron PCB
+2.9dBi
+4.4dBi Unictron PCB
+2.8dBi
+4.2dBi Molex PCB
+3.25dBi
+5.0dBi Ethertronics PIFA
+2.5dBi
+3.5dBi VSO Rod
+2.0dBi
+2.0dBi VSO Rod
+1.5dBi
+2.1dBi Sansei-Denki Rod
+2.0dBi
+2.0dBi Sansei-Denki Rod
+1.5dBi
+2.1dBi
(USACanadaEurope) FCC/IC/ETSI Antennas Vendors Antenna 2.4GHz 5GHz FCC Subpart-C FCC Subpart-E Type Gain Gain
(2.4GHz) W52/53/56/58 ETSI ETSI EN300329 EN300329 2.4GHz W52/53/56 146153
(Exclude cable loss) ANTDC-081A0/B0
(Exclude cable loss) Molex PCB
+3.25dBi +5.0dBi Sansei-Denki Rod
+2.0dBi +2.0dBi NOTE1 silex silex silex silex silex The above certification is effective only with the silex recommended antennas, silex recommended board data file and driver. However, the re-certification might be required in the case of the final product form even if the silex recommended antennas are used or no use of the silex driver. NOTE2 EMC EMC certification of each country might be required as the final product. NOTE3 Rod VSO The rod antenna of Sansei-Denkis been certified, but not recommended. VSOs compatible one is recommended silex technology, Inc.
(37/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 6.3. Federal Communications Commission (FCC) Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1) this device may not cause harmful interference and 2) this device must accept any interference received, including interference that may cause undesired operation of the device. 15.21 You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the users authority to operate the equipment. 15.105(b) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1) this device may not cause harmful interference and 2) this device must accept any interference received, including interference that may cause undesired operation of the device. silex technology, Inc.
(38/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX FCC RF Radiation Exposure Statement:
1) This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 2) This equipment complies with RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body. Test Modes silex technology, Inc. uses various test mode programs for test set up which operate separate from production firmware. Host integrators should contact silex technology, Inc. for assistance with test modes needed for module/host compliance test requirements. Additional testing, Part 15 Subpart B disclaimer The SX-SDMAC2 modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. Antennas The following external antenna type have been approved for use with the SX-SDMAC2. Antenna Type Supplier Antenna Part No. Freq. (MHz) Peak Antenna Gain (dBi) PCB ACON AEP8P-100000 2.4GHz PCB ACON AEP8P-100001 2.4GHz PCB ACON AEP8P-100003 2.4GHz PCB ACON AEP8P-100004 2.4GHz PCB ACON AEP8P-100005 2.4GHz PCB molex 1461530100 2.4GHz Dipole SANSEI TD16081A0C0 2.4GHz Dipole SANSEI TD16081B0C0 2.4GHz Dipole JOYMAX IWF-145XMPXX 2.4GHz 2 2 2 2 2 3.25 2 2 4 Antenna Type Supplier Antenna Part No. Freq. (MHz) Peak Antenna Gain (dBi) PCB ACON AEP8P-100000 PCB ACON AEP8P-100001 PCB ACON AEP8P-100003 PCB ACON AEP8P-100004 PCB ACON AEP8P-100005 PCB molex 1461530100 Dipole SANSEI TD16081A0C0 Dipole SANSEI TD16081B0C0 5GHz 5GHz 5GHz 5GHz 5GHz 5GHz 5GHz 5GHz 3 3 3 3 3 5 2 2 silex technology, Inc.
(39/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 6.4. Canada, Industry Canada (IC) This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence
.L'exploitation est autorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Caution: Exposure to Radio Frequency Radiation. To comply with RSS 102 RF exposure compliance requirements, a separation distance of at least 20 cm must be maintained between the antenna of this device and all persons. Pour se conformer aux exigences de conformit CNR 102 RF exposition, une distance de sparation d'au moins 20 cm doit tre maintenue entre l'antenne de cet appareil et toutes les personnes. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as shown in this manual. Required End Product Labeling Any device incorporating this module must include an external, visible, permanent marking or label which states:
Contains FCC ID : N6C-SDMAC2 and Contains IC: 4908A-SDMAC2 Obligation d'tiquetage du produit final:
Tout dispositif intgrant ce module doit comporter un externe, visible, marquage permanent o une tiquette qui dit: "Contient IC: 4908A-SDMAC2 Antennas This radio transmitter (IC: 4908A-SDMAC2, HVIN: SX-SDMAC2) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet metteur radio (IC: 4908A-SDMAC2, HVIN: SX-SDMAC2) a t approuv par Industrie Canada pour fonctionner avec les types d'antenne numrs ci-dessous avec le gain maximal admissible indiqu. types d'antennes non inclus dans cette liste , ayant un gain suprieur au gain maximum indiqu pour ce type , sont strictement interdits pour une utilisation avec cet appareil. silex technology, Inc.
(40/58) DateMay 30, 2019 CONFIDENTIAL Antenna Type Supplier Antenna Part No. Freq. (MHz) Peak Antenna Gain (dBi) Drawing No.JW205100XX PCB ACON AEP8P-100000 2.4GHz PCB ACON AEP8P-100001 2.4GHz PCB ACON AEP8P-100003 2.4GHz PCB ACON AEP8P-100004 2.4GHz PCB ACON AEP8P-100005 2.4GHz PCB molex 1461530100 2.4GHz Dipole SANSEI TD16081A0C0 2.4GHz Dipole SANSEI TD16081B0C0 2.4GHz Dipole JOYMAX IWF-145XMPXX 2.4GHz 2 2 2 2 2 3.25 2 2 4 Antenna Type Supplier Antenna Part No. Freq. (MHz) Peak Antenna Gain (dBi) PCB ACON AEP8P-100000 PCB ACON AEP8P-100001 PCB ACON AEP8P-100003 PCB ACON AEP8P-100004 PCB ACON AEP8P-100005 PCB molex 1461530100 Dipole SANSEI TD16081A0C0 Dipole SANSEI TD16081B0C0 5GHz 5GHz 5GHz 5GHz 5GHz 5GHz 5GHz 5GHz 3 3 3 3 3 5 2 2 silex technology, Inc.
(41/58) DateMay 30, 2019 CONFIDENTIAL 7. (Mechanical Specifications) Drawing No.JW205100XX Thickness Item SMT () SMT (A simple substance) PCB PCB Thickness Thickness 3.1mm Description Item SMT (PCB) Thickness 1.00 mm +/- 0.15 mm Description 0.15 mm All dimension tolerances are 0.15mm, unless otherwise specified. silex technology, Inc.
(42/58) DateMay 30, 2019 CONFIDENTIAL 8. (Indication specifications) Drawing No.JW205100XX silex technology, Inc.
(43/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 9. (Components composition List) Categories Board Label Accessory Packing Items
() Main Board EMI Label Packing Label MSL MSL Caution Label Carton Label Humidity Indicator Packing Box Carton Box Aluminum lamination bag Reel Set Silica gel Product No. ZXE03993 SX-SDMAC2-2830 1 ZXE03994 SX-SDMAC2-2830-SP 1 Remarks 1 1/500 1/500 1/2500 1/500 1/500 1/2500 1/500 1/500 2/500 1 1/10 1/10 1/50 1/10 1/10 1/50 1/10 1/10 2/10 silex technology, Inc.
(44/58) DateMay 30, 2019 CONFIDENTIAL 10. (Packing specifications) Drawing No.JW205100XX 160 400
(mm) silex technology, Inc.
(45/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX silex technology, Inc.
(46/58) DateMay 30, 2019 CONFIDENTIAL MSL (MSL caution label) Drawing No.JW205100XX
(Example of humidity indication card)
(mm) silex technology, Inc.
(47/58) DateMay 30, 2019 CONFIDENTIAL 11. (Reliability test) Test items Standards Description DC
+3.0 V ~ +3.6 V DC voltage test Check to work with +3.0 - +3.6V voltage range. Check no transaction stop or no throughput drop. Temperature/
Humidity cycle test Drawing No.JW205100XX Requirements Electricity Appearance Workable NA Check to work with below conditions. Check no transaction stop or no throughput drop. Standard test[: Ramp]
(Harming) Step 1
+25 2 3
-35 4 5
+75 6 7
-35
%RH OFF OFF OFF OFF OFF OFF OFF 8 20 9 10
+75
+75 20 85 Time 0:05 1:00 2:00 1:00 2:00 1:00 4:00 1:00 2:00 6:00 Power ON ON ON ON ON ON ON ON ON ON Step
%RH 11 30 12
+25 OFF Time 1:00 0:10 Power
+25 Extended test[: Ramp]
Step 1
-
2 3
-35 4 5 0
%RH OFF OFF OFF OFF OFF
(Harming) 6 7
+20 10 8 9 10
+40
+40 10 Time 0:00 2:00 2:00 1:00 2:00 1:00 3:00 1:00 4:00 0:45 Power ON ON ON ON ON ON ON ON ON ON Step 11
+40
%RH 95 12 13
+75 95 14 15
+40 95 16 17
+25 50 Time 24:15 1:00 12:00 1:00 4:00 1:00 2:00 Power ON ON ON ON ON ON ON Workable NA Workable Workable NA NA Functional hot temp Functional cold temp
+75 Workable at +75
-35 Workable at -35 silex technology, Inc.
(48/58) DateMay 30, 2019 CONFIDENTIAL Test items Standards Description JEDEC Drawing No.JW205100XX Requirements Electricity Appearance Mechanical JESD22-B104C X1/2 (+ /-), Y1/2 (+ /-), Z1/2 (+ /-) 5 (30) Test spec in No damage shock test Condition B
//RF Check to work after shocking. Axis and number of times X1/2 (+ /-), Y1/2 (+ /-), Z1/2 (+ /-) 5 times per direction (Total 30 times) Damage/Defect/RF degradation is not observed after shock. JEDEC Mechanical JESD22-B103B X-Y-Z 4 4 (12) vibration test Condition 1
//RF Check to work after vibrating. Axis and number of times X-Y-Z 4 minutes / 4 times per direction (Total 12 times) Damage/Defect/RF degradation is not observed after vibration. Test spec in No damage JEDEC LxWxT=50x18x1.6mm Thermal shock JESD22-A106B Test spec in No damage test Test Condition C Step 1 () / Step 3 ()
(Fluid Air) 100 Cycle Perform after soldering this module down on the LxWxT=50x18x1.6mm. Check to work after heat shocking Repeat Step 1 (High temp.) / Step 3 (Low temp.) Check to work after 100 Cycles Steps per 1 Cycle [: Ramp]
Steps Temperature Time Power 1
+125
+10/-0 5min OFF 2
< 10sec OFF 3
-55
+0/-10 5min OFF 4
< 10sec OFF ESD test JEDEC GNDESD JESD22-A114F
=100pF/=1.5k
+/-2kV 3
/RF Add ESD to the center pin and GND ring of antenna connector. Discharging capacitance=100pF, Discharging resistance=1.5k Workable NA ESD level for the center pin+/-2kV 3 times per each plus pulse and minus pulse. Check no damage and no RF performance degradation after testing. silex technology, Inc.
(49/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX Criteria No damage Test spec in Workable Description No damage on the appearance after test. RF Meet to RF test specifications Can confirm to work during test. NOTE1 3 10 Sample numbers for all test except below is 3 units. Thermal shock test10 units silex technology, Inc.
(50/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 12. (Notifications) 6. Specifications of this module compliant to law regulations of 6. Standards Compliance, but this shall not apply to following cases. 1) 6.1 In case this module is used in the different country from the list of 6.1 2) 6.2 In case this module is used with different antenna from the antenna list of 6.2 3) In case the certification must be renewed. 2.4GHz 5GHz 5.15-5.35GHz W52, W53 W52 / W53 This module is the wireless device using 2.4GHz / 5GHz band. You have to disable 5.15-5.35GHz band
(W52, W53) before use at outdoor in Japan because these band are prohibited to use at outdoor by low restriction. This module is designed for embedded purpose into the general electric devices, and is not designed for high reliability demands like aircraft instruments, nuclear control instruments, high reliability medical instruments (Class III, IV), high reliability security instruments or any other devices required extremely high reliability and quality. In the case embedded into the medical instrument, please ask to silex despite the medical class. As this module communicates by radio wave, it is strongly recommended to use some security system to prevent unexpected information leakage to others. EMC EMC This module is a radio module for embedded purpose. Please understand functions and features of this module, and evaluate as the final product which has this module embedded. Also, as evaluation of EMC conformity of this module has not been performed, EMC conformity evaluation and application must be performed with the final product which this module is embedded. silex technology, Inc.
(51/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX This module will effect to some other device or be affected by the some other device using the same frequency band. Please investigate the environment to use this module beforehand. Disassembling or modifying the radio module leads to punishment based on radio law. This module is the embedded module that has the exposed connectors or some devices. Please be careful for electro static, condensing, and other dusts.
(IEEE802.11-2012 IEEE802.11ac-2013 ) In the case using the other wireless devices using same frequency band around this product, please take care below. (See IEEE802.11-2012 and IEEE802.11ac-2013) 1) 2.4GHz +/- 25MHz (5Ch)
+/-25MHz (+/-25MHz) or more frequency separation from the center frequency of this module is recommended in 2.4GHz. 2) Appropriate environment to avoid interference from the adjacent channels or the non-adjacent channels is necessary. 2.4GHz : +/-25MHz(5Ch), : +/-30MHz(6Ch) 2.4GHz: Center frequency +/-25MHz (5Ch), Non Adjacent channel: Further than Center frequency +/-30MHz (6Ch) 5GHz HT20 : +/-20MHz(4Ch), : +/-40MHz(8Ch) 5GHz HT20: Center frequency +/-20MHz (4Ch), Non Adjacent channel: Further than Center frequency +/-40MHz (8Ch) 5GHz HT40 : +/-40MHz(8Ch), : +/-80MHz(16Ch) 5GHz HT40 Adjacent channel: Center frequency +/-40MHz (8Ch), Non Adjacent channel: Further than Center frequency
+/-80MHz (16Ch) 5GHz HT80 : +/-80MHz(16Ch), : +/-160MHz(32Ch) 5GHz HT80 Adjacent channel: Center frequency +/-80MHz (16Ch), Non Adjacent channel: Further than Center frequency
+/-160MHz (32Ch) Even if these conditions is satisfied, the module is possibly interfered when strong signal is input. The other wireless system should be enough far from this module 2.4GHz -20dBm 5GHz -30dBm The input level from the opponent device must be -20dBm or less at 2.4GHz, -30dBm or less at GHz with including antenna gain. silex technology, Inc.
(52/58) DateMay 30, 2019 CONFIDENTIAL 13. A (Appendix-A Reference land design) Drawing No.JW205100XX
(mm) reference stencil design Top view silex technology, Inc.
(53/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 14. B SMT (Appendix -B SMT reflow profiles) Sn/Ag/Cu Pb-
This recommended condition assumes Sn/Ag/Cu solder. This condition should be optimized per using solder type. Sn/Ag/Cu Pb- (Sn/Ag/Cu Pb-Free Assembly) Profile Feature Parametric Average ramp-up rate TL to Tp Preheat Time maintained above Peak Temperature Time within 5 of Actual Peak Temperature Average ramp-down rate Time 25 to Peak Temperature Temperature Tsmin Temperature Tsmax Time ts Temperature TL Time tL Tp tp Conditions Min. Typ. Max. Units 0 150 60 220 50 240 0 3.0 190 120 70 245 20 6 6
/Sec Sec Sec Sec
/Sec Min
(Reflow profile data) silex technology, Inc.
(54/58) DateMay 30, 2019 CONFIDENTIAL TPTsmaxTsmintSPreheat time25tPTime 25 to PeakTimeTemperature ()Ramp-upRamp-downTLtL 15. C (Appendix -C TX power at each destination) 15.1. Japan Drawing No.JW205100XX 2.4GHz (+25C) Items Transmit Power Target Power (dBm) 5GHz (+25C) Items Transmit Power Target Power (dBm) silex technology, Inc. Modes Rates Ch.1-Ch.13 Ch.3-Ch.11
+11.5
+14.5
+14.5
+14.5
+14.5
+14.5
+14.5
+14.5
+14.5
+14.5
+14.0 W52
+11.0
+11.0
+11.0
+11.0
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+10.5
+12.0
+12.0
+12.0
+12.0
+12.0
+10.5
+9.5 11b 11g 11n/ac 20MHz 11n/ac 40MHz Modes 11a 11n/ac 20MHz 11n/ac 40MHz 11n/ac 80MHz 1-11Mbps 6-24Mbps 36Mbps 48Mbps 54Mbps MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 9 Rates 6-24Mbps 36Mbps 48Mbps 54Mbps MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 9 MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 9
(55/58)
+14.5
+14.5
+14.5
+14.5
+14.5
+14.0
+13.5 W53
+11.0
+11.0
+11.0
+11.0
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+10.5
+12.0
+12.0
+12.0
+12.0
+12.0
+10.5
+9.5 W56
+12.5
+12.5
+12.5
+12.5
+13.0
+13.0
+13.0
+13.0
+13.0
+12.0
+13.0
+13.0
+13.0
+13.0
+13.0
+11.5
+10.5
+13.0
+13.0
+13.0
+13.0
+12.5
+10.5
+9.5 DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX 15.2. EU 2.4GHz (+25C) Items Transmit Power Target Power (dBm) 5GHz (+25C) Items Transmit Power Target Power (dBm) Modes Rates Ch.1-Ch.13 Ch.3-Ch.11 11b 11g 11n/ac 20MHz 11n/ac 40MHz 1-11Mbps 6-24Mbps 36Mbps 48Mbps 54Mbps MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 9
+11.0
+13.5
+13.5
+13.5
+13.5
+13.5
+13.5
+13.5
+13.5
+13.5
+13.5 Modes 11a 11n/ac 20MHz 11n/ac 40MHz Rates 6-24Mbps 36Mbps 48Mbps 54Mbps MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 9 11n/ac 80MHz MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 9 W52
+11.0
+11.0
+11.0
+11.0
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+14.0
+14.0
+14.0
+14.0
+13.0
+11.5
+10.5
+13.5
+13.5
+13.5
+13.5
+12.5
+10.5
+9.5 W53
+11.0
+11.0
+11.0
+11.0
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+14.0
+14.0
+14.0
+14.0
+13.0
+11.5
+10.5
+13.5
+13.5
+13.5
+13.5
+12.5
+10.5
+9.5
+13.5
+13.5
+13.5
+13.5
+13.5
+13.5
+13.5 W56
+11.0
+11.0
+11.0
+11.0
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+13.5
+13.5
+13.5
+13.5
+13.0
+11.5
+10.5
+13.0
+13.0
+13.0
+13.0
+12.5
+10.5
+9.5 W58 silex technology, Inc.
(56/58) DateMay 30, 2019 CONFIDENTIAL 15.3. US 2.4GHz (+25C) Items Transmit Power Target Power (dBm) 5GHz (+25C) W52, W53 Items Transmit Power Target Power (dBm) Drawing No.JW205100XX Modes Rates 11b 11g 11n/ac 20MHz Modes 11n/ac 40MHz 1-11Mbps 6-24Mbps 36Mbps 48Mbps 54Mbps MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 Rates MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 9 Ch.1
+10.0
+15.0
+15.0
+15.0
+15.0
+14.5
+14.5
+14.5
+14.5
+14.5
+14.0 Ch.3
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5 Ch.2-Ch.9
+10.0
+17.0
+17.0
+16.5
+15.5
+17.5
+17.5
+16.0
+15.5
+15.0
+14.0 Ch.4-Ch.7
+12.5
+12.5
+12.5
+12.5
+12.5
+12.5
+12.5 Ch.10
+10.0
+16.5
+16.5
+16.5
+15.5
+17.5
+17.5
+16.0
+15.5
+15.0
+14.0 Ch.8
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5
+11.5 Modes Rates Ch.36-Ch.48 Ch.52-Ch.60 11a 6-24Mbps 36Mbps 48Mbps 54Mbps MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 Rates MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 9 Rates MCS 0-2 MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 9 11n/ac 20MHz Modes 11n/ac 40MHz Modes 11n/ac 80MHz
+10.5
+10.5
+10.5
+10.5
+10.5
+10.5
+10.5
+10.5
+10.5
+10.5 Ch.38-Ch.46
+11.0
+11.0
+11.0
+11.0
+11.0
+11.0
+10.5 Ch.42
+6.5
+6.5
+6.5
+6.5
+6.5
+6.5
+6.5
+15.0
+15.0
+14.5
+13.5
+15.0
+15.0
+14.5
+14.0
+13.5
+12.0 Ch.54
+14.0
+14.0
+14.0
+14.0
+13.0
+11.5
+10.5 Ch.58
+11.0
+11.0
+11.0
+11.0
+11.0
+10.5
+9.5 Ch.11
+10.0
+12.5
+12.5
+12.5
+12.5
+13.0
+13.0
+13.0
+13.0
+13.0
+13.0 Ch.9
+9.5
+9.5
+9.5
+9.5
+9.5
+9.5
+9.5 Ch.64
+14.0
+14.0
+14.0
+13.5
+14.0
+14.0
+14.0
+14.0
+13.5
+12.0 Ch.62
+13.0
+13.0
+13.0
+13.0
+13.0
+11.5
+10.5 silex technology, Inc.
(57/58) DateMay 30, 2019 CONFIDENTIAL Drawing No.JW205100XX Modes Rates Ch.100 Ch.104-Ch.136 Ch.140 Ch.149-Ch.157 Ch.165 5GHz (+25C) W56, W58 Items 11a 6-24Mbps +13.0
+15.0 Transmit Power Target Power (dBm) 36Mbps 48Mbps 54Mbps
+13.0
+15.0
+13.0
+14.5
+13.0
+13.5 11n/ac MCS 0-2
+13.5
+15.0 20MHz MCS 3-4
+13.5
+15.0 MCS 5 MCS 6 MCS 7 MCS 8
+13.5
+14.5
+13.5
+14.0
+13.5
+13.5
+12.0
+12.0
+12.0
+14.5
+12.0
+14.5
+12.0
+14.5
+12.0
+13.5
+13.5
+14.5
+13.5
+14.5
+13.5
+14.5
+13.5
+14.0
+13.5
+13.5
+12.0
+12.0
+14.0
+14.0
+14.0
+13.5
+14.0
+14.0
+14.0
+14.0
+13.5
+12.0 Modes Rates Ch.102 Ch.110-Ch.126 Ch.134 Ch.151 Ch.159 11n/ac MCS 0-2 40MHz MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 9
+9.5
+9.5
+9.5
+9.5
+9.5
+9.5
+9.5
+13.5
+13.5
+13.5
+13.5
+13.0
+11.5
+10.5
+12.5
+11.0
+12.5
+11.0
+12.5
+11.0
+12.5
+11.0
+12.5
+11.0
+11.5
+11.0
+10.5
+10.5 Modes Rates Ch.106 Ch.122-Ch.138 Ch.155 11n/ac MCS 0-2 80MHz MCS 3-4 MCS 5 MCS 6 MCS 7 MCS 8 MCS 9
+4.0
+4.0
+4.0
+4.0
+4.0
+4.0
+4.0
+14.5
+14.5
+14.5
+13.5
+12.5
+10.5
+9.5
+11.5
+11.5
+11.5
+11.5
+11.5
+10.5
+9.5
+13.5
+13.5
+13.5
+13.5
+13.0
+11.5
+10.5 NOTE1 Chain 2 Data stream +3.0dB Transmit power is the value from each single chain. When the device transmits 2 streams of data, total power can be +3.0dB. silex technology, Inc.
(58/58) DateMay 30, 2019 CONFIDENTIAL
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2019-07-09 | 5745 ~ 5825 | NII - Unlicensed National Information Infrastructure TX | Original Equipment |
2 | 2402 ~ 2480 | DSS - Part 15 Spread Spectrum Transmitter | ||
3 | 2402 ~ 2480 | DTS - Digital Transmission System |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 2 3 | Effective |
2019-07-09
|
||||
1 2 3 | Applicant's complete, legal business name |
Silex Technology, Inc.
|
||||
1 2 3 | FCC Registration Number (FRN) |
0013616305
|
||||
1 2 3 | Physical Address |
2-3-1 Hikaridai,Seika-cho Sourakugun
|
||||
1 2 3 |
Kyoto, N/A
|
|||||
1 2 3 |
Japan
|
|||||
app s | TCB Information | |||||
1 2 3 | TCB Application Email Address |
c******@telefication.com
|
||||
1 2 3 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
app s | FCC ID | |||||
1 2 3 | Grantee Code |
N6C
|
||||
1 2 3 | Equipment Product Code |
SDMAC2
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 2 3 | Name |
T****** K******
|
||||
1 2 3 | Title |
Manager
|
||||
1 2 3 | Telephone Number |
81 77********
|
||||
1 2 3 | Fax Number |
81 77********
|
||||
1 2 3 |
k******@silex.jp
|
|||||
app s | Technical Contact | |||||
1 2 3 | Firm Name |
SGS Taiwan Ltd
|
||||
1 2 3 | Name |
J******** C******
|
||||
1 2 3 | Physical Address |
134, Wu Kung Road, WuKu Industrial Zone
|
||||
1 2 3 |
Taiwan
|
|||||
1 2 3 | Telephone Number |
886 2********
|
||||
1 2 3 | Fax Number |
886 2********
|
||||
1 2 3 |
J******@sgs.com
|
|||||
app s | Non Technical Contact | |||||
1 2 3 | Firm Name |
SGS Taiwan Ltd
|
||||
1 2 3 | Name |
J******** C****
|
||||
1 2 3 | Physical Address |
134, Wu Kung Road, WuKu Industrial Zone
|
||||
1 2 3 |
Taiwan
|
|||||
1 2 3 | Telephone Number |
886 2********
|
||||
1 2 3 | Fax Number |
886 2********
|
||||
1 2 3 |
J******@sgs.com
|
|||||
app s | Confidentiality (long or short term) | |||||
1 2 3 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 3 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 3 | If so, specify the short-term confidentiality release date (MM/DD/YYYY format) | 01/05/2020 | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 2 3 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 2 3 | Equipment Class | NII - Unlicensed National Information Infrastructure TX | ||||
1 2 3 | DSS - Part 15 Spread Spectrum Transmitter | |||||
1 2 3 | DTS - Digital Transmission System | |||||
1 2 3 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | SX-SDMAC2 | ||||
1 2 3 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 2 3 | Modular Equipment Type | Single Modular Approval | ||||
1 2 3 | Purpose / Application is for | Original Equipment | ||||
1 2 3 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
1 2 3 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 2 3 | Grant Comments | Modular Approval. Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. The antenna's as listed in this application must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-users may not be provided with the module installation instructions. OEM integrators and end-users must be provided with transmitter operating conditions for satisfying RF exposure compliance. This device has 20 MHz, 40MHz and 80MHz bandwidth modes Operations in 5150-5250 MHz band is for indoor use only. | ||||
1 2 3 | Modular Approval. Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. The antenna's as listed in this application must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-users may not be provided with the module installation instructions. OEM integrators and end-users must be provided with transmitter operating conditions for satisfying RF exposure compliance. | |||||
1 2 3 | Modular Approval. Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. The antenna's as listed in this application must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-users may not be provided with the module installation instructions. OEM integrators and end-users must be provided with transmitter operating conditions for satisfying RF exposure compliance. This device has 20 MHz, 40MHz bandwidth modes | |||||
1 2 3 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 2 3 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 2 3 | Firm Name |
Compliance Certification Services Inc. Wugu Lab.
|
||||
1 2 3 | Name |
H**** L********
|
||||
1 2 3 | Telephone Number |
886-2******** Extension:
|
||||
1 2 3 | Fax Number |
+886-********
|
||||
1 2 3 |
h******@sgs.com
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15E | CC MO | 5180 | 5240 | 0.055 | |||||||||||||||||||||||||||||||||||
1 | 2 | 15E | CC MO ND | 5260 | 5320 | 0.078 | |||||||||||||||||||||||||||||||||||
1 | 3 | 15E | CC MO ND | 5500 | 5700 | 0.073 | |||||||||||||||||||||||||||||||||||
1 | 4 | 15E | CC MO | 5745 | 5825 | 0.079 | |||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
2 | 1 | 15C | CC | 2402.00000000 | 2480.00000000 | 0.0040000 | |||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
3 | 1 | 15C | CC | 2402 | 2480 | 0.003 | |||||||||||||||||||||||||||||||||||
3 | 2 | 15C | CC MO | 2412 | 2462 | 0.41 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC