FCC ID: QOQGM210P Bluetooth Low Energy and ZigBee wireless radio modules

 

BGM210P Blue Gecko Bluetooth Module Data Sheet The BGM210P is a module designed and built to meet the per-

formance, security, and reliability requirements of line-powered IoT products for Bluetooth networks. Based on the EFR32BG21 SoC, it enables Bluetooth Low Energy and Bluetooth Mesh connectivity while delivering best-in-class RF range and performance, future-proof capa-

bility for feature and OTA firmware updates, enhanced security, low active current con-

sumption, and a temperature rating suited for operating in demanding environmental conditions. The BGM210P is a complete solution that comes with robust and fully-upgradeable soft-

ware stacks, world-wide regulatory certifications, advanced development and debugging tools, and support that will simplify and minimize the development cycle and deployment of your end-product helping to accelerate its time-to-market. The BGM210P is targeted for a broad range of applications, including:

Smart home Connected lighting Building automation and security Factory automation KEY FEATURES Bluetooth 5.1 and Bluetooth Mesh connectivity Chip antenna and RF pin

+10 and +20 dBm TX power variants

-97.0 dBm Bluetooth RX sensitivity at 1 Mbps 32-bit ARM Cortex-M33 core at 38.4 MHz 1024/96 kB of Flash/RAM memory Enhanced security features Optimal set of MCU peripherals 20 GPIO pins

-40 to +125 oC 12.9 mm x 15.0 mm x 2.2 mm Core / Memory Crystal Clock Management ARM CortexTM M33 processor with DSP extensions, FPU and TrustZone Flash Program Memory 38.4 MHz HF Crystal Oscillator HF RC Oscillator Fast Startup RC Oscillator EM23 HF RC Oscillator ETM Debug Interface RAM Memory LDMA Controller LF Crystal Oscillator Ultra LF RC Oscillator LF RC Oscillator Energy Management Voltage Regulator Brown-Out Detector Power-On Reset Security Crypto Acceleration Secure Debug True Random Number Generator Security Core Antenna Chip Antenna Matching RF Pin 32-bit bus Peripheral Reflex System Radio Transceiver I Q RF Frontend LNA PA PA DEMOD PGA IFADC Frequency Synth AGC MOD C R F C F U B C R C C A R Serial Interfaces USART I2C I/O Ports Timers and Triggers Analog I/F External Interrupts General Purpose I/O Pin Reset Pin Wakeup Timer/Counter Protocol Timer ADC Low Energy Timer Watchdog Timer Analog Comparator Real Time Capture Counter Back-Up Real Time Counter Lowest power mode with peripheral operational:

EM0Active EM1Sleep EM2Deep Sleep EM3Stop EM4Shutoff silabs.com | Building a more connected world. Rev. 0.5 1. Features Supported Protocols Bluetooth 5.1 Bluetooth Low Energy Bluetooth Mesh AoA/AoD Wireless System-on-Chip 2.4 GHz radio TX power up to +20 dBm High-performance 32-bit ARM Cortex-M33 with DSP in-

struction and floating-point unit for efficient signal process-

ing 1024 kB flash program memory 96 kB RAM data memory Embedded Trace Macrocell (ETM) for advanced debugging Receiver Performance

-104.5 dBm sensitivity (0.1% BER) at 125 kbps GFSK

-100.1 dBm sensitivity (0.1% BER) at 500 kbps GFSK

-97.0 dBm sensitivity (0.1% BER) at 1 Mbps GFSK

-94.1 dBm sensitivity (0.1% BER) at 2 Mbps GFSK Current Consumption 9.3 mA RX current at 1 Mbps GFSK 16.1 mA TX current at 0 dBm (BGM210Px22) 34.1 mA TX current at 10 dBm (BGM210Px22) 173 mA TX current at 20 dBm (BGM210Px32) 50.9A/MHz in Active Mode (EM0) 5.1A EM2 DeepSleep current (RTCC running from LFXO, Bluetooth Stack not running) 8.5A EM2 DeepSleep current (RTCC running from LFXO, Bluetooth Stack running) Regulatory Certifications CE ISED FCC BGM210P Blue Gecko Bluetooth Module Data Sheet Features Operating Range 1.8 to 3.8 V

-40 to +125 C Dimensions 12.9 mm x 15.0 mm x 2.2 mm Security Secure Boot with Root of Trust and Secure Loader (RTSL)1 Hardware Cryptographic Acceleration with DPA counter-

measures1 for AES128/256, SHA-1, SHA-2 (up to 256-bit), ECC (up to 256-bit), ECDSA, and ECDH True Random Number Generator (TRNG) compliant with NIST SP800-90 and AIS-31 ARM TrustZone Secure Debug Interface lock/unlock MCU Peripherals 12-bit 1 Msps SAR Analog to Digital Converter (ADC) 2 Analog Comparator (ACMP) 20 General Purpose I/O pins with output state retention and asynchronous interrupts 8 Channel DMA Controller 12 Channel Peripheral Reflex System (PRS) 2 16-bit Timer/Counter

(3 Compare/Capture/PWM channels) 1 32-bit Timer/Counter

(3 Compare/Capture/PWM channels) 32-bit Real Time Counter 24-bit Low Energy Timer for waveform generation 2 Watchdog Timer 3 Universal Synchronous/Asynchronous Receiver/Trans-

mitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S) 2 I2C interface with SMBus support 1. With Secure Element (SE) firmware v1.1.2 or newer silabs.com | Building a more connected world. Rev. 0.5 | 2 BGM210P Blue Gecko Bluetooth Module Data Sheet Ordering Information 2. Ordering Information Table 2.1. Ordering Information Ordering Code Protocol Stack TX Power Freq Band Antenna BGM210P022JIA21 Bluetooth 5.1 10 dBm 2.4 GHz BGM210P022JIA2R1 Bluetooth 5.1 10 dBm 2.4 GHz BGM210P032JIA21 Bluetooth 5.1 20 dBm 2.4 GHz BGM210P032JIA2R1 Bluetooth 5.1 20 dBm 2.4 GHz BGM210PA22JIA22 Bluetooth 5.1 10 dBm 2.4 GHz BGM210PA22JIA2R2 Bluetooth 5.1 10 dBm 2.4 GHz BGM210PA32JIA22 Bluetooth 5.1 20 dBm 2.4 GHz BGM210PA32JIA2R2 Bluetooth 5.1 20 dBm 2.4 GHz Chip and RF pin Chip and RF pin Chip and RF pin Chip and RF pin Chip and RF pin Chip and RF pin Chip and RF pin Chip and RF pin 1. Engineering sample device 2. Production device Flash

(kB) 1024 1024 1024 1024 1024 1024 1024 1024 RAM

(kB) GPIO Temp Range Packaging 96 96 96 96 96 96 96 96 20 20 20 20 20 20 20 20

-40 to 125 C Cut Tape

-40 to 125 C Reel

-40 to 125 C Cut Tape

-40 to 125 C Reel

-40 to 125 C Cut Tape

-40 to 125 C Reel

-40 to 125 C Cut Tape

-40 to 125 C Reel See 4.5 RF Transmitter General Characteristics for maximum TX power figures. End-product manufacturers must verify that the module is configured to comply with the regulatory limits for each region, in accordance with the formal certification test reports for the device. BGM210P modules are pre-programmed with BGAPI UART DFU bootloader. Throughout this document, the devices above may be referred to by their product family name (BGM210P), model name

(BGM210P22A / BGM210P32A) or full ordering code. The SLWSTK6102A Wireless Gecko Module Starter Kit is available for BGM210P evaluation and development, as well as SLWRB4308A (+20 dBm TX) and SLWRB4308B (+10 dBm TX) radio boards. silabs.com | Building a more connected world. Rev. 0.5 | 3

. Table of Contents

. 1. Features . 2. Ordering Information . 3. System Overview . 3.1 Block Diagram . 3.2 EFR32BG21 SoC . 3.3 Antenna . 3.4 Power Supply . 4. Electrical Specifications . 4.1 Absolute Maximum Ratings. 4.2 General Operating Conditions . 4.3 MCU Current Consumption at 3.0V . 4.4 Radio Current Consumption at 3.0V . 4.5 RF Transmitter General Characteristics

. 4.6 RF Receiver General Characteristics

. 4.7 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps . 4.8 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps . 4.9 RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps . 4.10 RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps . 4.11 High-Frequency Crystal

. 4.12 GPIO Pins . 4.13 Microcontroller Peripherals

. 4.14 Typical Performance Curves . 5.1 Network Co-Processor (NCP) Application with UART Host

. 5.2 SoC Application

. 6. Pin Definitions . 6.1 Module Pinout

. 6.2 Alternate Pin Functions . 6.3 Analog Peripheral Connectivity 6.4 Digital Peripheral Connectivity . 4.14.1 Antenna Radiation and Efficiency . 7.1 Layout and Placement

. 7.2 Proximity to Other Materials 7.3 Proximity to Human Body . 5. Reference Diagrams. 7. Design Guidelines

. silabs.com | Building a more connected world. 2

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. 9

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. 30 Rev. 0.5 | 4

. 8.1 Dimensions . 8.2 PCB Land Pattern . 8.3 Package Marking . 8. Package Specifications

. 9. Soldering Recommendations 10. Tape and Reel

. 11. Certifications . 11.1 Qualified Antennas . 11.2 CE . 11.3 FCC . 11.4 ISED Canada . 11.5 Proximity to Human Body . 12. Revision History. 31

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. silabs.com | Building a more connected world. Rev. 0.5 | 5 BGM210P Blue Gecko Bluetooth Module Data Sheet System Overview 3. System Overview 3.1 Block Diagram The BGM210P module is a highly-integrated, high-performance system with all the hardware components needed to enable 2.4 GHz wireless connectivity and to support robust networking capabilities via multiple protocols. Built around the EFR32BG21 Wireless Gecko SoC, the BGM210P includes a chip antenna, an RF matching network (optimized for transmit power efficiency), supply decoupling and filtering components, a 38.4 MHz reference crystal, and an RF shield. It also comes with a 50 -matched RF pin and allows the use of an external 32 kHz crystal as a low frequency reference signal via GPIO pins. Since the RF matching networks are optimized for transmit power efficiency, modules rated for +20 dBm will show non-optimal current consumption and performance when operated at a lower output power (e.g. +10 or 0 dBm). The same applies for modules rated for +10 dBm. Antenna RF Match RFPIN RF Match Supply Decoupling Silicon Labs EFR32BG21

(up to 20) HF XTAL External LF XTAL option RF SHIELD Figure 3.1. BGM210P Block Diagram VDD IOVDD GPIO GND 3.2 EFR32BG21 SoC The EFR32BG21 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 1 MB of Flash memory, a dedicated core for security, a rich set of MCU peripherals, and various clock management and serial interfacing options. Consult the EFR32xG21 Wireless Gecko Reference Manual and the EFR32BG21 Data Sheet for details. 3.3 Antenna BGM210P modules include a ceramic chip antenna on board with the characteristics detailed in the table below. They also include a 50

-matched RF pin to enable the use of an external antenna instead of the module's chip antenna. See 4.14.1 Antenna Radiation and Efficiency and 11.1 Qualified Antennas for other relevant details. Table 3.1. Antenna Efficiency and Peak Gain With optimal layout Note

-1 to -2 dB 1.86 dBi Antenna efficiency, gain and radiation pattern are highly depend-

ent on the application PCB layout and mechanical design. Refer to Design Guidelines for recommendations to achieve optimal an-

tenna performance. Parameter Efficiency Peak gain 3.4 Power Supply The BGM210P requires a single nominal supply level of 3.0 V to operate. However, it can support use cases needing different levels for the main supply (VDD) and for digital IO (IOVDD). All necessary decoupling and filtering components are included in the module. silabs.com | Building a more connected world. Rev. 0.5 | 6 BGM210P Blue Gecko Bluetooth Module Data Sheet Electrical Specifications 4. Electrical Specifications All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:

Typical values are based on TA=25 C and VDD supply at 3.0 V, by production test and/or technology characterization. Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow-

er-specific external RF impedance-matching networks for interfacing to a 50 antenna. Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise. 4.1 Absolute Maximum Ratings Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-

bility data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx. Table 4.1. Absolute Maximum Ratings Test Condition Parameter Storage temperature range Voltage on any supply pin Symbol TSTG VDDMAX VDDRAMPMAX Voltage ramp rate on VDD supply pin DC voltage on any GPIO pin VDIGPIN Total current into VDD power lines IVDDMAX Total current into GND pin Current per I/O pin IGNDMAX IIOMAX Current for all I/O pins IIOALLMAX Source Sink Sink Source Sink Source Min

-50

-0.3

-0.3 Typ Max

+150 3.8 1.0 VIOVDD +

0.3 200 200 50 50 200 200 Unit C V V / s V mA mA mA mA mA mA silabs.com | Building a more connected world. Rev. 0.5 | 7 4.2 General Operating Conditions This table specifies the general operating temperature range and supply voltage range for all supplies. The minimum and maximum values of all other tables are specifed over this operating range, unless otherwise noted. BGM210P Blue Gecko Bluetooth Module Data Sheet Electrical Specifications Table 4.2. General Operating Conditions Test Condition

-I temperature grade Parameter Operating ambient tempera-

ture range VDD Supply Voltage IOVDD operating supply volt-

age (All IOVDD pins) Symbol TA VDD VIOVDD HCLK and Core frequency fHCLK MODE = WS1, RAMWSEN = 11 MODE = WS1, RAMWSEN = 01 MODE = WS0, RAMWSEN = 01 PCLK frequency EM01 Group A clock fre-

quency fPCLK fEM01GRPACLK HCLK Radio frequency fHCLKRADIO Note:

Min

-40 1.8 1.8 38 Typ 3.0 3.0 38.4 Max

+125 3.8 3.8 80 50 39 50 80 40 Unit C V V MHz MHz MHz MHz MHz MHz 1. Flash wait states are set by the MODE field in the MSC_READCTRL register. RAM wait states are enabled by setting the RAMW-

SEN bit in the SYSYCFG_DMEM0RAMCTRL register. silabs.com | Building a more connected world. Rev. 0.5 | 8 4.3 MCU Current Consumption at 3.0V Unless otherwise indicated, typical conditions are: VDD = 3.0 V. TA = 25 C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 C. BGM210P Blue Gecko Bluetooth Module Data Sheet Electrical Specifications Table 4.3. MCU Current Consumption at 3.0V Test Condition Min 80 MHz HFRCO, CPU running Prime from flash 80 MHz HFRCO, CPU running while loop from flash 80 MHz HFRCO, CPU running CoreMark loop from flash 38.4 MHz crystal, CPU running while loop from flash 80 MHz HFRCO 38.4 MHz crystal Full RAM retention and RTC run-

ning from LFXO (Bluetooth Stack not running) Full RAM retention, RTCC run-

ning, and Bluetooth Stack running from LFXO 1 bank (16 kB) RAM retention and RTC running from LFRCO Full RAM retention and RTC run-

ning from ULFRCO 1 bank (16 kB) RAM retention and RTC running from ULFRCO No BURTC, no LF oscillator Hard pin reset held Parameter Current consumption in EM0 mode with all peripherals dis-

abled1 Symbol IACTIVE Current consumption in EM1 mode with all peripherals dis-

abled1 IEM1 Current consumption in EM2 mode IEM2 Current consumption in EM3 mode IEM3 Current consumption in EM4 mode Current consumption during reset Current consumption per re-

tained 16kB RAM bank in EM2 Note:

IEM4 IRST IRAM Typ 50.9 45.6 59.8 63.8 28.7 46.9 5.1 8.5 4.5 4.8 4.3 0.21 146 0.10 Max Unit A/MHz 55.5 A/MHz 37.6 10.5 11.4 0.5 A/MHz A/MHz A/MHz A/MHz A A A A A A A A 1. The typical EM0/EM1 current measurement includes some current consumed by the security core for periodical housekeeping purposes. This does not include current consumed by user-triggered security operations, such as cryptographic calculations. silabs.com | Building a more connected world. Rev. 0.5 | 9 4.4 Radio Current Consumption at 3.0V RF current consumption measured with MCU in EM1, HCLK = 38.4 MHz, and all MCU peripherals disabled. Unless otherwise indica-

ted, typical conditions are: VDD = 3.0V. TA = 25 C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 C. BGM210P Blue Gecko Bluetooth Module Data Sheet Electrical Specifications Parameter Current consumption in re-

ceive mode, active packet reception Symbol IRX_ACTIVE Table 4.4. Radio Current Consumption at 3.0V Test Condition Min 125 kbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running 500 kbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running 1 Mbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running 2 Mbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running Current consumption in re-

ceive mode, Stack running IRX_LISTEN 125 kbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running Current consumption in transmit mode ITX 500 kbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running 1 Mbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running 2 Mbit/s, 2GFSK, f = 2.4 GHz, Bluetooh stack running f = 2.4 GHz, CW, 10 dBm Module, 0 dBm output power f = 2.4 GHz, CW, 10 dBm Module, 10 dBm output power f = 2.4 GHz, CW, 20 dBm Module, 10 dBm output power, VDD = 3.0 V f = 2.4 GHz, CW, 20 dBm Module, POUT =19.2 dBm, VDD = 3.3 V 1 Note:

1. The maximum power for Bluetooth Low-Energy is limited to 19.2 dBm. Typ 9.3 9.3 9.3 9.9 9.1 9.1 9.1 9.8 16.1 34.1 59.7 173 Max Unit mA mA mA mA mA mA mA mA mA mA mA mA silabs.com | Building a more connected world. Rev. 0.5 | 10 4.5 RF Transmitter General Characteristics Unless otherwise indicated, typical conditions are: TA = 25 C, VDD = 3.0V. Measured with RF center frequency of 2.45 GHz on RF2G4_IO2 port. Table 4.5. RF Transmitter General Characteristics BGM210P Blue Gecko Bluetooth Module Data Sheet Electrical Specifications Parameter RF tuning frequency range Symbol FRANGE Maximum TX output power 1 POUTMAX Test Condition 20 dBm Module, BLE, VDD =

3.3V2 10 dBm Module Minimum active TX Power POUTMIN 20 dBm Module, VDD = 3.3 V Output power step size POUTSTEP Output power variation vs VDD supply voltage, Freq =

2450MHz POUTVAR_V Output power variation vs temperature, Freq =

2450MHz POUTVAR_T Output power variation vs RF frequency POUTVAR_F 10 dBm Module 10 dBm Module, -5 dBm < POUT <

0 dBm 10 dBm Module, 0 dBm < POUT <

10 dBm 20 dBm Module, 0 dBm < POUT <

5 dBm 20 dBm Module, 5 dBm < POUT <

POUTMAX 20 dBm Module, POUT =

POUTMAX VDD swept from 3.0V to 3.8V. 10 dBm Module, POUT =

POUTMAX VDD swept from 1.8V to 3.0V. 20 dBm Module, POUT =

POUTMAX, VDD = 3.3V, tempera-

ture swept from -40 to +125 C. 10 dBm Module, POUT =

POUTMAX, VDD = 3.0V, tempera-

ture swept from -40 to +125 C. 20 dBm Module, POUT =

POUTMAX, VDD = 3.3V, Freq. swept from 2400 to 2483.5 MHz 10 dBm Module, POUT =

POUTMAX, VDD = 3.0V, Freq. swept from 2400 to 2483.5 MHz Min 2400 Typ 19.2 10

-20.5

-19.3 1.5 1.0 0.7 0.5 1.0 0.2 1.5 0.3 0.2 0.2 Max 2483.5 Unit MHz dBm dBm dBm dBm dB dB dB dB dB dB dB dB dB dB Note:

1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-

ered in this data sheet can be found in the TX Power column of the Ordering Information Table. 2. The maximum power for Bluetooth Low-Energy. silabs.com | Building a more connected world. Rev. 0.5 | 11 BGM210P Blue Gecko Bluetooth Module Data Sheet Electrical Specifications 4.6 RF Receiver General Characteristics Unless otherwise indicated, typical conditions are: TA = 25 C, VDD = 3.0V. Measured with RF center frequency of 2.45 GHz on RF2G4_IO2 port. Table 4.6. RF Receiver General Characteristics Parameter RF tuning frequency range Symbol FRANGE Test Condition Min 2400 Typ Max 2483.5 Unit MHz silabs.com | Building a more connected world. Rev. 0.5 | 12 4.7 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps Unless otherwise indicated, typical conditions are: TA = 25 C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2. Table 4.7. RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps BGM210P Blue Gecko Bluetooth Module Data Sheet Electrical Specifications Parameter Max usable receiver input level Sensitivity Symbol SAT SENS Signal to co-channel interfer-

er C/ICC N 1 Adjacent channel se-

lectivity C/I1 N 2 Alternate channel se-

lectivity C/I2 N 3 Alternate channel se-

lectivity C/I3 Selectivity to image frequen-

cy C/IIM Selectivity to image frequen-

cy 1 MHz C/IIM_1 Test Condition Min Signal is reference signal, packet length is 37 bytes1 Signal is reference signal, 37 byte payload1 With non-ideal signals2 1

(see notes)1 3 Interferer is reference signal at +1 MHz offset1 4 3 5 Interferer is reference signal at -1 MHz offset1 4 3 5 Interferer is reference signal at +2 MHz offset1 4 3 5 Interferer is reference signal at -2 MHz offset1 4 3 5 Interferer is reference signal at +3 MHz offset1 4 3 5 Interferer is reference signal at -3 MHz offset1 4 3 5 Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion1 5 Interferer is reference signal at im-

age frequency +1 MHz with 1 MHz precision1 5 Interferer is reference signal at im-

age frequency -1 MHz with 1 MHz precision1 5 Typ 10

-97.0

-96.7

+6.6

-8.3

-8.7

-42.1

-48.9

-42.4

-54.8

-42.1

-42.4

-8.3

-23 Max Unit dBm dBm dBm dB dB dB dB dB dB dB dB dB dB dBm Intermodulation performance IM n = 36 Note:

1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -67 dBm. 4. Desired frequency 2402 MHz Fc 2480 MHz. 5. With allowed exceptions. 6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4 silabs.com | Building a more connected world. Rev. 0.5 | 13 4.8 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps Unless otherwise indicated, typical conditions are: TA = 25 C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2. Table 4.8. RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps BGM210P Blue Gecko Bluetooth Module Data Sheet Electrical Specifications Parameter Max usable receiver input level Sensitivity Symbol SAT SENS Signal to co-channel interfer-

er C/ICC N 1 Adjacent channel se-

lectivity C/I1 N 2 Alternate channel se-

lectivity C/I2 N 3 Alternate channel se-

lectivity C/I3 Selectivity to image frequen-

cy C/IIM Selectivity to image frequen-

cy 1 MHz C/IIM_1 Test Condition Min Signal is reference signal, packet length is 37 bytes1 Signal is reference signal, 37 byte payload1 With non-ideal signals2 1

(see notes)1 3 Interferer is reference signal at +2 MHz offset1 4 3 5 Interferer is reference signal at -2 MHz offset1 4 3 5 Interferer is reference signal at +4 MHz offset1 4 3 5 Interferer is reference signal at -4 MHz offset1 4 3 5 Interferer is reference signal at +6 MHz offset1 4 3 5 Interferer is reference signal at -6 MHz offset1 4 3 5 Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion1 5 Interferer is reference signal at im-

age frequency +2 MHz with 1 MHz precision1 5 Interferer is reference signal at im-

age frequency -2 MHz with 1 MHz precision1 5 Typ 10

-94.1

-93.9

+6.0

-8.0

-8.8

-42.2

-50.3

-54.4

-55.4

-8.0

-42.2

+6.0

-22.3 Max Unit dBm dBm dBm dB dB dB dB dB dB dB dB dB dB dBm Intermodulation performance IM n = 36 Note:

1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -67 dBm. 4. Desired frequency 2402 MHz Fc 2480 MHz. 5. With allowed exceptions. 6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4 silabs.com | Building a more connected world. Rev. 0.5 | 14 4.9 RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps Unless otherwise indicated, typical conditions are: TA = 25 C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2. Table 4.9. RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps BGM210P Blue Gecko Bluetooth Module Data Sheet Electrical Specifications Parameter Max usable receiver input level Sensitivity Symbol SAT SENS Signal to co-channel interfer-

er C/ICC N 1 Adjacent channel se-

lectivity C/I1 N 2 Alternate channel se-

lectivity C/I2 N 3 Alternate channel se-

lectivity C/I3 Selectivity to image frequen-

cy C/IIM Selectivity to image frequen-

cy 1 MHz C/IIM_1 Test Condition Min Signal is reference signal, packet length is 37 bytes1 Signal is reference signal1 With non-ideal signals2 1

(see notes)1 3 Interferer is reference signal at +1 MHz offset1 4 3 5 Interferer is reference signal at -1 MHz offset1 4 3 5 Interferer is reference signal at +2 MHz offset1 4 3 5 Interferer is reference signal at -2 MHz offset1 4 3 5 Interferer is reference signal at +3 MHz offset1 4 3 5 Interferer is reference signal at -3 MHz offset1 4 3 5 Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion1 5 Interferer is reference signal at im-

age frequency +1 MHz with 1 MHz precision1 5 Interferer is reference signal at im-

age frequency -1 MHz with 1 MHz precision1 5 Typ 10

-100.1

-99.3

+2.1

-9.0

-9.5

-44.4

-51.9

-44.3

-58.3

-44.4

-44.3

-9.0 Max Unit dBm dBm dBm dB dB dB dB dB dB dB dB dB dB Note:

1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -72 dBm. 4. Desired frequency 2402 MHz Fc 2480 MHz. 5. With allowed exceptions. silabs.com | Building a more connected world. Rev. 0.5 | 15 4.10 RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps Unless otherwise indicated, typical conditions are: TA = 25 C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2. Table 4.10. RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps BGM210P Blue Gecko Bluetooth Module Data Sheet Electrical Specifications Parameter Max usable receiver input level Sensitivity Symbol SAT SENS Signal to co-channel interfer-

er C/ICC N 1 Adjacent channel se-

lectivity C/I1 N 2 Alternate channel se-

lectivity C/I2 N 3 Alternate channel se-

lectivity C/I3 Selectivity to image frequen-

cy C/IIM Selectivity to image frequen-

cy 1 MHz C/IIM_1 Test Condition Min Signal is reference signal, packet length is 37 bytes1 Signal is reference signal1 With non-ideal signals2 1

(see notes)1 3 Interferer is reference signal at +1 MHz offset1 4 3 5 Interferer is reference signal at -1 MHz offset1 4 3 5 Interferer is reference signal at +2 MHz offset1 4 3 5 Interferer is reference signal at -2 MHz offset1 4 3 5 Interferer is reference signal at +3 MHz offset1 4 3 5 Interferer is reference signal at -3 MHz offset1 4 3 5 Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion1 5 Interferer is reference signal at im-

age frequency +1 MHz with 1 MHz precision1 5 Interferer is reference signal at im-

age frequency -1 MHz with 1 MHz precision1 5 Typ 10

-104.5

-104.2

+0.8

-13.1

-13.6

-49.5

-56.9

-47.0

-63.1

-49.5

-47.0

-13.1 Max Unit dBm dBm dBm dB dB dB dB dB dB dB dB dB dB Note:

1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -79 dBm. 4. Desired frequency 2402 MHz Fc 2480 MHz. 5. With allowed exceptions. silabs.com | Building a more connected world. Rev. 0.5 | 16 4.11 High-Frequency Crystal BGM210P Blue Gecko Bluetooth Module Data Sheet Electrical Specifications Parameter Crystal frequency Initial calibrated accuracy Temperature drift Symbol fHFXTAL ACCHFXTAL DRIFTHFXTAL Table 4.11. High-Frequency Crystal Test Condition Across specified temperature range Min

-10

-30 Typ 38.4 Max

+10

+30 Unit MHz ppm ppm silabs.com | Building a more connected world. Rev. 0.5 | 17 4.12 GPIO Pins Unless otherwise indicated, typical conditions are: VDD = 3.0 V. BGM210P Blue Gecko Bluetooth Module Data Sheet Electrical Specifications Parameter Leakage current Symbol ILEAK_IO Input low voltage1 Input high voltage1 Output low voltage Output high voltage VIL VIH VOL VOH GPIO rise time TGPIO_RISE GPIO fall time TGPIO_FALL Pull up/down resistance2 RPULL Maximum filtered glitch width TGF Note:

Table 4.12. GPIO Pins Test Condition MODEx = DISABLED, VDD =

1.71V MODEx = DISABLED, VDD = 3.0 V MODEx = DISABLED, VDD = 3.8 V TA = 125 C Any GPIO pin Min Any GPIO pin 0.7 * VDD Sinking 20mA, VDD = 3.0 V Sinking 8mA, VDD = 1.62 V Sourcing 20mA, VDD = 3.0 V Sourcing 8mA, VDD = 1.62 V VDD = 3.0V, Cload = 50pF, SLEW-

RATE = 4, 10% to 90%

VDD = 1.7V, Cload = 50pF, SLEW-

RATE = 4, 10% to 90%

VDD = 3.0V, Cload = 50pF, SLEW-

RATE = 4, 90% to 10%

VDD = 1.7V, Cload = 50pF, SLEW-

RATE = 4, 90% to 10%

pull-up: MODEn = DISABLE DOUT=1, pull-down: MODEn =

WIREDORPULLDOWN DOUT =

0 MODE = INPUT, DOUT = 1 0.8 * VDD 0.6 * VDD 35 Typ 1.9 2.5 8.4 13 7.1 11.9 44 26 Max Unit 200 0.3 * VDD 0.2 * VDD 0.4 * VDD 55 nA nA nA V V V V V V ns ns ns ns k ns 1. GPIO and RESETn input thresholds are proportional to the VDD supply. 2. GPIO and RESETn pull-ups connect to the VDD supply. Pull-downs on GPIO connect to VSS. silabs.com | Building a more connected world. Rev. 0.5 | 18 BGM210P Blue Gecko Bluetooth Module Data Sheet Electrical Specifications 4.13 Microcontroller Peripherals The MCU peripherals set available in BGM210P modules includes:

12-bit 1 Msps ADC Analog Comparators 16-bit and 32-bit Timers/Counters 24-bit Low Energy Timer for waveform generation 32-bit Real Time Counter USART (UART/SPI/SmartCards/IrDA/I2S) I2C peripheral interfaces 12 Channel Peripheral Reflex System For details on their electrical performance, consult the relevant portions of Section 4 in the SoC's datasheet. To learn which GPIO ports provide access to every peripheral, consult 6.3 Analog Peripheral Connectivity and 6.4 Digital Peripheral Connectivity. 4.14 Typical Performance Curves Typical performance curves indicate typical characterized performance under the stated conditions. silabs.com | Building a more connected world. Rev. 0.5 | 19 4.14.1 Antenna Radiation and Efficiency Typical BGM210P radiation patterns and efficiency for the on-board chip antenna under optimal operating conditions are plotted in the figures that follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is mounted on, as well as on the proximity of any mechanical design to the antenna. BGM210P Blue Gecko Bluetooth Module Data Sheet Electrical Specifications Figure 4.1. Typical 2D Antenna Radiation Patterns and Efficiency Top Left: Phi 0o, Top Right: Phi 90o, Bottom Left: Theta 90o, Bottom Right: Radiation Efficiency vs Application Board GND Plane Width silabs.com | Building a more connected world. Rev. 0.5 | 20 BGM210P Blue Gecko Bluetooth Module Data Sheet Reference Diagrams 5. Reference Diagrams 5.1 Network Co-Processor (NCP) Application with UART Host The BGM210P can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, pro-

gramming/debug interface, and host interface connections are shown in the figure below. For more details, refer to AN958: Debugging and Programming Interfaces for Custom Designs. Figure 5.1. UART NCP Configuration silabs.com | Building a more connected world. Rev. 0.5 | 21 5.2 SoC Application The BGM210P can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and program-

ming/debug interface connections are shown in the figure below. For more details, refer to AN958: Debugging and Programming Inter-

faces for Custom Designs. BGM210P Blue Gecko Bluetooth Module Data Sheet Reference Diagrams Figure 5.2. Stand-Alone SoC Configuration Figure 5.3. Stand-Alone SoC Configuration with External Antenna silabs.com | Building a more connected world. Rev. 0.5 | 22 6. Pin Definitions 6.1 Module Pinout BGM210P Blue Gecko Bluetooth Module Data Sheet Pin Definitions Figure 6.1. BGM210P Module Pinout The next table shows the BGM210P pinout and some general descriptions of pin functionality. For more information on the features supported by each GPIO, see 6.3 Analog Peripheral Connectivity and 6.4 Digital Peripheral Connectivity. Table 6.1. BGM210P Module Pin Definitions Pin Name No. Description Pin Name No. Description GND PB00 PA01 PA03 PA05 DECOUPLE VDD PD04 PD02 PD00 PC00 PC02 PC04 RESETn RF2G4_IO2 GND 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 GPIO GPIO GPIO GPIO Decouple output for on-chip voltage regulator. An external decoupling ca-

pacitor is required at this pin. Power supply GPIO GPIO GPIO GPIO GPIO GPIO Reset Pin 2.4 GHz RF input/output GPIO GPIO GPIO GPIO GPIO Digital IO power supply GPIO GPIO GPIO GPIO GPIO PB01 PA00 PA02 PA04 PA06 GND IOVDD PD03 PD01 GND PC01 PC03 PC05 GND GND 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 silabs.com | Building a more connected world. Rev. 0.5 | 23 6.2 Alternate Pin Functions Some pins support multiple functions through internal multiplexing in the SoC (e.g. debugging, wake-up, etc.). The following table shows the functions available on each module pin. Refer to SoC's reference manual for more details. BGM210P Blue Gecko Bluetooth Module Data Sheet Pin Definitions Table 6.2. GPIO Alternate Functions Table Alternate Function GPIO.EM4WU3 GPIO.SWCLK GPIO.SWDIO GPIO.SWV GPIO.TDI GPIO.EM4WU0 GPIO.EM4WU9 LFXO.LFXTAL_I LFXO.LFXTAL_O GPIO.EM4WU6 GPIO.EM4WU7 GPIO.TRACEDATA0 GPIO.TDO GPIO.TRACECLK LFXO.LF_EXTCLK GPIO PB01 PA01 PA02 PA03 PA04 PA05 PD02 PD01 PD00 PC00 PC05 6.3 Analog Peripheral Connectivity Many analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avali-

able on each GPIO port. When a differential connection is being used Positive inputs are restricted to the EVEN pins and Negative inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the device Reference Manual for more details on the ABUS and analog peripherals. Table 6.3. ABUS Routing Table Peripheral Signal PA PB PC PD ACMP0 ACMP1 IADC0 ana_neg ana_pos ana_neg ana_pos ana_neg ana_pos EVEN ODD EVEN ODD EVEN ODD EVEN ODD Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes silabs.com | Building a more connected world. Rev. 0.5 | 24 6.4 Digital Peripheral Connectivity Many digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avalia-

ble on each GPIO port. BGM210P Blue Gecko Bluetooth Module Data Sheet Pin Definitions Peripheral.Resource ACMP0.DIGOUT ACMP1.DIGOUT CMU.CLKIN0 CMU.CLKOUT0 CMU.CLKOUT1 CMU.CLKOUT2 FRC.DCLK FRC.DFRAME FRC.DOUT I2C0.SCL I2C0.SDA I2C1.SCL I2C1.SDA LETIMER0.OUT0 LETIMER0.OUT1 PRS.ASYNCH0 PRS.ASYNCH1 PRS.ASYNCH10 PRS.ASYNCH11 PRS.ASYNCH2 PRS.ASYNCH3 PRS.ASYNCH4 PRS.ASYNCH5 PRS.ASYNCH6 PRS.ASYNCH7 PRS.ASYNCH8 PRS.ASYNCH9 PRS.SYNCH0 PRS.SYNCH1 PRS.SYNCH2 PRS.SYNCH3 Table 6.4. DBUS Routing Table PA Available Available PB Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available PORT PC Available Available Available Available Available Available Available Available Available Available Available Available PD Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available silabs.com | Building a more connected world. Rev. 0.5 | 25 Peripheral.Resource TIMER0.CC0 TIMER0.CC1 TIMER0.CC2 TIMER0.CDTI0 TIMER0.CDTI1 TIMER0.CDTI2 TIMER1.CC0 TIMER1.CC1 TIMER1.CC2 TIMER1.CDTI0 TIMER1.CDTI1 TIMER1.CDTI2 TIMER2.CC0 TIMER2.CC1 TIMER2.CC2 TIMER2.CDTI0 TIMER2.CDTI1 TIMER2.CDTI2 TIMER3.CC0 TIMER3.CC1 TIMER3.CC2 TIMER3.CDTI0 TIMER3.CDTI1 TIMER3.CDTI2 USART0.CLK USART0.CS USART0.CTS USART0.RTS USART0.RX USART0.TX USART1.CLK USART1.CS USART1.CTS USART1.RTS USART1.RX USART1.TX BGM210P Blue Gecko Bluetooth Module Data Sheet Pin Definitions PORT PC Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available PD Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available PA Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available PB Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available silabs.com | Building a more connected world. Rev. 0.5 | 26 PA PB Peripheral.Resource USART2.CLK USART2.CS USART2.CTS USART2.RTS USART2.RX USART2.TX BGM210P Blue Gecko Bluetooth Module Data Sheet Pin Definitions PORT PC Available Available Available Available Available Available PD Available Available Available Available Available Available silabs.com | Building a more connected world. Rev. 0.5 | 27 7. Design Guidelines 7.1 Layout and Placement For optimal performance of the BGM210P, BGM210P Blue Gecko Bluetooth Module Data Sheet Design Guidelines Place the module aligned to the edge of the application PCB, as illustrated in the figures below. Leave the antenna clearance area void of any traces, components, or copper on all layers of the application PCB if you are going to use the on-board chip antenna Antenna clearance area is not necessary if you are using an external antenna attached to the RF pin. For external antenna use cases, use a 50 grounded coplanar transmission line to trace the signal from the RF pin to an exter-

nal RF connector if applicable (see Figure 7.2 Recommended Layout for BGM210P Using External Antenna on page 29). A general rule is to use 50 transmission lines where the length of the RF trace is longer than /16 at the fundamental frequen-

cy, which for 2.4 GHz is approximately 7.8 mm. A U.FL connector can be used in the host PCB for the connection to an external antenna. The use of a U.FL connector is also recommended for conductive tests. The integrator must use a unique connector, such as a reverse polarity SMA or reverse thread SMA, if detachable antenna is offered with the host chassis. This is especially required for the FCC and ISED approvals to remain valid, and any other kind of direct connector to the antenna might require a permissive change. A trace length of 2.6 mm was used in the certifications host board to connect the module RF pin to the U.FL connector. For reference, Figure 7.4 RF Trace Design Example on page 30 shows a set of parameters for a 50 trace. Trace impedance should always be matched to the particular stack-up used on the host board. Connect all ground pads directly to a solid ground plane. Place the ground vias as close to the ground pads as possible. Do not place plastic or any other dielectric material in contact with the antenna. Place vias close to each of the modules GND pads Align module edge with PCB edge GND Antenna Clearance No metal in this area GND GND GND Wireless Module

(Top View) GND GND Figure 7.1. Recommended Layout for BGM210P Using On-Board Chip Antenna Place vias along all PCB edges silabs.com | Building a more connected world. Rev. 0.5 | 28 BGM210P Blue Gecko Bluetooth Module Data Sheet Design Guidelines Place vias close to each of the modules GND pads Align module edge with PCB edge GND GND GND GND RF2G4_IO2 Wireless Module

(Top View) 50 Ohm trace for RF signal GND GND U.FL connector for external antenna Place vias along all PCB edges Figure 7.2. Recommended Layout for BGM210P Using External Antenna The figure below illustrates layout scenarios that will lead to severely degraded RF performance for the module. Copper Clearance Area XGND plane width Figure 7.3. Non-Optimal Layout Examples The width of the GND plane to the sides the module will impact the efficiency of the on-board chip antenna. To achieve optimal per-

formance, a GND plane width of 50 mm is recommended. See Figure 4.1 Typical 2D Antenna Radiation Patterns and Efficiency on page 20 for reference. silabs.com | Building a more connected world. Rev. 0.5 | 29 BGM210P Blue Gecko Bluetooth Module Data Sheet Design Guidelines Figure 7.4. RF Trace Design Example 7.2 Proximity to Other Materials Avoid placing plastic or any other dielectric material in close proximity to the antenna. Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended dis-

tance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes. 7.3 Proximity to Human Body Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range. silabs.com | Building a more connected world. Rev. 0.5 | 30 BGM210P Blue Gecko Bluetooth Module Data Sheet Package Specifications 8. Package Specifications 8.1 Dimensions 15.0 mm

(0.2) 4.2 mm

(0.1) 3.0 mm

(0.1) 5.7 mm

(0.1) 0.8 mm

(0.1) 0.8 mm

(0.1) 1.5 mm

(0.1)

(0.1) 8.1 mm

(0.1) 0.4 mm

(0.1) 1.45 mm

(0.1) 2.25 mm

(0.2) 12.9 mm

(0.2) Figure 8.1. Module Dimensions silabs.com | Building a more connected world. Rev. 0.5 | 31 8.2 PCB Land Pattern BGM210P Blue Gecko Bluetooth Module Data Sheet Package Specifications Figure 8.2. Land Pattern for Chip Antenna Use Case Figure 8.3. Land Pattern for RF Pin Use Case silabs.com | Building a more connected world. Rev. 0.5 | 32 8.3 Package Marking The figure below shows the module markings engraved on the RF shield. BGM210P Blue Gecko Bluetooth Module Data Sheet Package Specifications Figure 8.4. BGM210P Top Marking Mark Description The package marking consists of:

BGM210Pxxxxxxx - Part number designation Model: BGM210Pxxx - Model number designation QR Code: YYWWMMABCDE YY Last two digits of the assembly year. WW Two-digit workweek when the device was assembled. MMABCDE Silicon Labs unit code YYWWTTTTTT YY Last two digits of the assembly year. WW Two-digit workweek when the device was assembled. TTTTTT Manufacturing trace code. The first letter is the device revision. Certification marks such as the CE logo, FCC and IC IDs, etc will be engraved in the gray area according to regulatory body require-

ments silabs.com | Building a more connected world. Rev. 0.5 | 33 BGM210P Blue Gecko Bluetooth Module Data Sheet Soldering Recommendations 9. Soldering Recommendations It is recommended that final PCB assembly of the BGM210P follows the industry standard as identified by the Institute for Printed Cir-

cuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements. CLASS 1 General Electronic Products Includes products suitable for applications where the major requirement is function of the completed assembly. CLASS 2 Dedicated Service Electronic Products Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. CLASS 3 High Performance/Harsh Environment Electronic Products Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. silabs.com | Building a more connected world. Rev. 0.5 | 34 10. Tape and Reel BGM210P modules are delivered to the customer in cut tape (100 pcs) or reel (1000 pcs) packaging with the dimensions below. All dimensions are given in mm unless otherwise indicated. BGM210P Blue Gecko Bluetooth Module Data Sheet Tape and Reel Figure 10.1. Carrier Tape Dimensions Figure 10.2. Reel Dimensions silabs.com | Building a more connected world. Rev. 0.5 | 35 BGM210P Blue Gecko Bluetooth Module Data Sheet Certifications 11. Certifications This section details the regulatory certification status of the module in various regions. The address for the module manufacturer and certification applicant is:

SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland 11.1 Qualified Antennas BGM210P modules have been tested and certified both with the on-board chip antenna and with an external antenna attached to the RF pin (RF2G4_IO2). Performance characteristics for the chip antenna are presented in Table 3.1 Antenna Efficiency and Peak Gain on page 6 and Figure 4.1 Typical 2D Antenna Radiation Patterns and Efficiency on page 20. Details for the external antenna qualified are summarized in the table below. Table 11.1. Qualified External Antennas for BGM210P Antenna Type Maximum Gain Connectorized Coaxial Dipole 2.14 dBi Impedance 50 Any antenna of the same general type and of equal or less directional gain as listed in the above table can be used in the regulatory areas that have a full modular radio approval (USA, Canada, Korea, Japan) as long as spot-check testing is performed to verify that no performance changes compromising compliance have been introduced. In countries applying the ETSI standards, like the EU countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher gain may violate some of the regulatory limits. If an antenna of a different type (such as a chip antenna, a PCB trace antenna or a patch) with a gain less than or equal to 2.14 dBi is needed, it can be added as a permissive change, requiring some radiated emission testing. Antenna types with more gain than 2.14 dBi may require a fully new certification. Since the exact permissive change procedure is chosen on a case by case basis, please consult your test house and/or certification body for understanding the correct approach. You might also want or need to get in touch with Sili-

con Labs for any authorization letter that your certification body might ask for. 11.2 CE The BGM210P module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Direc-

tive (RED) (2014/53/EU). Please note that every application using the BGM210P will need to perform the radio EMC tests on the end product, according to EN 301 489-17. It is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product. The specific product assembly may have an impact to RF radiated characteristics, and manufacturers should carefully consider RF radiated testing with the end-product assembly. A formal Declaration of Conformity (DoC) is available via https://www.silabs.com/. 11.3 FCC This device complies with Part 15 of the FCC Rules when operating with the embedded antenna or with the antenna type(s) listed in Table 11.1. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. Any changes or modifications not expressly approved by Silicon Labs could void the users authority to operate the equipment. FCC RF Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif-

ic operating instructions for satisfying RF exposure compliance. This transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance to the limit(s) exposed in the RF Exposure Analysis. This transmitter also meets the Portable requirements at distances equal or above 5.3 mm for the BGM210P22A and 44.0 mm for the BGM210P32A. These distances are reported for convenience also in Table 11.2. This transmitter must not be co-located or operating in conjunction with any other an-

tenna or transmitter except in accordance with FCC multi-transmitter product procedures. silabs.com | Building a more connected world. Rev. 0.5 | 36 BGM210P Blue Gecko Bluetooth Module Data Sheet Certifications OEM Responsibilities to comply with FCC Regulations This module has been tested for compliance to FCC Part 15. OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module in-

stalled (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, in accord-

ance to the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01. General Considerations This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radia-

tor) rule requirement applicable to the final host. The final host will still need to be reassessed for compliance to this portion of rule requirements if applicable. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end-user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warnings as shown in this manual. OEM/Host Manufacturer Responsibilities OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reas-

sessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the FCC rules. This module must not be incorporated into any other device or system without retesting for compliance as multi-radio and combined equipment. Separation To meet the SAR exemption for portable conditions, the minimum separation distance indicated in Table 11.2 must be maintained between the human body and the radiator (antenna) at all times. In particular, the minimum distance must be 5.3 mm for the BGM210P22A and 44.0 mm for the BGM210P32A. This transmitter module is tested in a standalone mobile RF exposure condition, and in case of any co-located radio transmitter be-

ing allowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the exceptions rules to be applied, a separate additional SAR evaluation will be required, ultimately leading to a Class II Permissive Change, or more rarely to a new grant. Important Note: In the event that these conditions cannot be met, the final product will have to undergo additional testing to evalu-

ate the RF exposure in order for the FCC authorization to remain valid, and a permissive change will have to be applied. The evalua-

tion (SAR) is in the responsibility of the end-products manufacturer, as well as the permissive change that can be carried out with the help of the customer's own Telecommunication Certification Body as the grant holders agent. End Product Labeling BGM210P modules are labeled with their own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

"Contains Transmitter Module FCC ID: QOQGM210P"

Or

"Contains FCC ID: QOQGM210P"

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. As long as all conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. silabs.com | Building a more connected world. Rev. 0.5 | 37 BGM210P Blue Gecko Bluetooth Module Data Sheet Certifications Class B Device Notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio/TV technician for help silabs.com | Building a more connected world. Rev. 0.5 | 38 BGM210P Blue Gecko Bluetooth Module Data Sheet Certifications 11.4 ISED Canada ISED This radio transmitter (IC: 5123A-GM210P) has been approved by Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada) to operate with the embedded antenna and with the antenna type(s) listed in 11.1 Qualified Anten-

nas, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device. This device complies with ISEDs license-exempt RSS standards. Operation is subject to the following two conditions:

1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device RF Exposure Statement Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. The module meets the given requirements when the minimum separation distance to human body is as indicated in Table 11.2. RF exposure or SAR evaluation is not required when the separation distances from the human body are equal or above 20 mm for the BGM210P22A and 40 mm for the BGM210P32A. These distances are reported for convenience also in Table 11.2. If the separation distance is less than stated above the OEM integrator is responsible for evaluating the SAR. OEM Responsibilities to comply with IC Regulations The module has been certified for integration into products only by OEM integrators under the following conditions:

The antenna must be installed such that a minimum separation distance as stated above is maintained between the radiator (anten-

na) and all persons at all times. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. Important Note: In the event that these conditions cannot be met, the final product will have to undergo additional testing to evaluate the RF exposure in order for the ISED authorization to remain valid, and a permissive change will have to be applied with the help of the customer's own Telecommunication Certification Body typically acting as the certificate holders agent. End Product Labeling The BGM210P module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

Contains Transmitter Module IC: 5123A-GM210P or Contains IC: 5123A-GM210P The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. As long as all the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still respon-

sible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). CAN ICES-003 (B) This Class B digital apparatus complies with Canadian ICES-003. silabs.com | Building a more connected world. Rev. 0.5 | 39 BGM210P Blue Gecko Bluetooth Module Data Sheet Certifications ISEDC (Franais) Le prsent metteur radio (IC: 5123A-GM210P) a t approuv par Innovation, Sciences et Dveloppement conomique Canada pour fonctionner avec les types d'antenne numrs au chapitre 11.1 et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est suprieur au gain maximal indiqu pour tout type figurant sur la liste, sont strictement interdits pour l'exploitation de l'metteur. Ce composant est conforme aux normes RSS, exonres de licence d'ISED. Son mode de fonctionnement est soumis aux deux condi-

tions suivantes:

1. Ce composant ne doit pas gnrer dinterfrences. 2. Ce composant doit pouvoir tre soumis tout type de perturbation y compris celle pouvant nuire son bon fonctionnement. Dclaration d'exposition RF L'exception tire des limites courantes d'valuation SAR est donne dans le document RSS-102 Issue 5. Les modles BGM210P respectent les exigences dexemption prvues lorsque la distance de sparation minimale entre le(s) an-

tenne(s) et le corps humain est conforme aux valeurs indiques dans le Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 41. La dclaration dexposition RF ou l'valuation DAS n'est pas ncessaire lorsque la distance de sparation est identique ou suprieure celle indique ci-dessus. Si la distance de sparation est infrieure celle mentionnes plus haut, il incombe l'intgrateur OEM de procd une valuation DAS. La dclaration dexposition RF ou l'valuation SAR n'est pas ncessaire lorsque la distance de sparation est identique ou suprieure celle indique ci-dessus. Si la distance de sparation est infrieure celle mentionnes plus haut, il incombe l'intgrateur OEM de procd une valuation SAR. Responsabilits des OEM pour une mise en conformit avec le Rglement du Circuit Intgr Le module a t approuv pour l'intgration dans des produits finaux exclusivement raliss par des OEM sous les conditions sui-

vantes:

L'antenne doit tre installe de sorte qu'une distance de sparation minimale indique ci-dessus soit maintenue entre le radiateur

(antenne) et toutes les personnes avoisinante, ce tout moment. Le module metteur ne doit pas tre localis ou fonctionner avec une autre antenne ou un autre transmetteur que celle indique plus haut. Tant que les deux conditions ci-dessus sont respectes, il nest pas ncessaire de tester ce transmetteur de faon plus pousse. Ce-

pendant, il incombe lintgrateur OEM de sassurer de la bonne conformit du produit fini avec les autres normes auxquelles il pour-

rait tre soumis de fait de lutilisation de ce module (par exemple, les missions des priphriques numriques, les exigences de p-

riphriques PC, etc.). Remarque Importante:Dans le cas o ces conditions ne peuvent tre satisfaites (pour certaines configurations ou co-implantation avec un autre metteur), l'autorisation ISED n'est plus considre comme valide et le numro didentification ID IC ne peut pas tre appos sur le produit final. Dans ces circonstances, l'intgrateur OEM sera responsable de la rvaluation du produit final (y compris le transmetteur) et de l'obtention d'une autorisation ISED distincte. tiquetage des produits finis Les modules BGM210P sont tiquets avec leur propre ID IC. Si l'ID IC n'est pas visible lorsque le module est intgr au sein d'un autre produit, cet autre produit dans lequel le module est install devra porter une tiquette faisant apparaitre les rfrence du module intgr. Dans un tel cas, sur le produit final doit se trouver une tiquette aisment lisible sur laquelle figurent les informations suivantes:

Contient le module transmetteur: 5123A-GM210P or Contient le circuit: 5123A-GM210P L'intgrateur OEM doit tre conscient quil ne doit pas fournir, dans le manuel dutilisation, d'informations relatives la faon d'installer ou de denlever ce module RF ainsi que sur la procdure suivre pour modifier les paramtres lis la radio. silabs.com | Building a more connected world. Rev. 0.5 | 40 BGM210P Blue Gecko Bluetooth Module Data Sheet Certifications 11.5 Proximity to Human Body When using the module in an application where the radio is located close to the human body, the human RF exposure must be evalu-

ated. FCC, ISED, and CE all have different standards for evaluating the RF exposure, and because of this, each standard requires a different minimum separation distance between the module and human body. Certification of BGM210P allows for the minimum separa-

tion distances detailed in the table below in portable use cases (less than 20 cm from human body). The module is approved for the mobile use case (more than 20 cm) without any need for RF exposure evaluation. Table 11.2. Minimum Separation Distances for SAR Evaluation Exemption Certification BGM210P22A BGM210P32A FCC ISED CE 5.3 mm 20 mm 44.0 mm 40 mm The RF exposure must always be evaluated using the end-product when transmitting with power levels high-

er than 20 mW (13 dBm). For FCC and ISED, using the module in end-products where the separation distance from the human body is smaller than that listed above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a Class 2 Permissive Change or Change of ID to be applied to the existing FCC/ISED approvals of the module. For CE, RF exposure must be evaluated using the end-

product in all cases when transmitting a more than the power level indicated in the table. Note: Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a reduced range is to be expected. silabs.com | Building a more connected world. Rev. 0.5 | 41 BGM210P Blue Gecko Bluetooth Module Data Sheet Revision History 12. Revision History Revision 0.5.1 September, 2019 Update wording for FCC and ISED certifications section Updated Design Guidelines Revision 0.5 September, 2019 Initial Production Release. Updated with latest values, certifications, security, etc Updated with OPNs for Reel packaging Added System Overview Updated Electrical Specifications with latest values Added Reference Diagrams Updated wording and figures in Design Guidelines Updated figures in Package Specifications and added Marking section Added Tape and Reel dimensions Updated Certifications information General wording, spelling, and grammar fixes. Revision 0.1 April, 2019 Initial Release. silabs.com | Building a more connected world. Rev. 0.5 | 42 Simplicity StudioOne-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux!IoT Portfoliowww.silabs.com/IoTSW/HWwww.silabs.com/simplicityQualitywww.silabs.com/qualitySupport and Communitycommunity.silabs.comhttp://www.silabs.comSilicon Laboratories Inc.400 West Cesar ChavezAustin, TX 78701USADisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications.Trademark InformationSilicon Laboratories Inc. , Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, Bluegiga, Bluegiga Logo, ClockBuilder, CMEMS, DSPLL, EFM, EFM32, EFR, Ember, Energy Micro, Energy Micro logo and combinations thereof, "the worlds most energy friendly microcontrollers", Ember, EZLink, EZRadio, EZRadioPRO, Gecko, Gecko OS, Gecko OS Studio, ISOmodem, Precision32, ProSLIC, Simplicity Studio, SiPHY, Telegesis, the Telegesis Logo, USBXpress , Zentri, the Zentri logo and Zentri DMS, Z-Wave, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders.

 

 

MGM210P Mighty Gecko Module Data Sheet The MGM210P is a module designed and built to meet the per-

formance, security, and reliability requirements of line-powered IoT products for mesh networks. Based on the EFR32MG21 SoC, it enables Zigbee, Thread, Bluetooth and multi-pro-

tocol connectivity (Zigbee + Bluetooth) while delivering best-in-class RF range and per-

formance, future-proof capability for feature and OTA firmware updates, enhanced se-

curity, low active current consumption, and a temperature rating suited for operating in demanding environmental conditions. The MGM210P is a complete solution that comes with robust and fully-upgradeable soft-

ware stacks, world-wide regulatory certifications, advanced development and debugging tools, and support that will simplify and minimize the development cycle and deployment of your end-product helping to accelerate its time-to-market. The MGM210P is targeted for a broad range of applications, including:

Smart home Connected lighting Building automation and security KEY FEATURES Zigbee, Thread, Bluetooth 5.1, and multi-

protocol connectivity Chip antenna and RF pin

+10 and +20 dBm TX power variants

-103.9 dBm 802.15.4 RX sensitivity

-97.0 dBm Bluetooth RX sensitivity at 1 Mbps 32-bit ARM Cortex-M33 core at 38.4 MHz 1024/96 kB of Flash/RAM memory Enhanced security features Optimal set of MCU peripherals 20 GPIO pins

-40 to +125 C 12.9 mm x 15.0 mm x 2.2 mm Core / Memory Crystal Clock Management ARM CortexTM M33 processor with DSP extensions, FPU and TrustZone Flash Program Memory 38.4 MHz HF Crystal Oscillator HF RC Oscillator Fast Startup RC Oscillator EM23 HF RC Oscillator ETM Debug Interface RAM Memory LDMA Controller LF Crystal Oscillator Ultra LF RC Oscillator LF RC Oscillator Energy Management Voltage Regulator Brown-Out Detector Power-On Reset Security Crypto Acceleration Secure Debug True Random Number Generator Security Core Antenna Chip Antenna Matching RF Pin 32-bit bus Peripheral Reflex System Radio Transceiver I Q RF Frontend LNA PA PA DEMOD PGA IFADC Frequency Synth AGC MOD C R F C F U B C R C C A R Serial Interfaces USART I2C I/O Ports Timers and Triggers Analog I/F External Interrupts General Purpose I/O Pin Reset Pin Wakeup Timer/Counter Protocol Timer ADC Low Energy Timer Watchdog Timer Analog Comparator Real Time Capture Counter Back-Up Real Time Counter Lowest power mode with peripheral operational:

EM0Active EM1Sleep EM2Deep Sleep EM3Stop EM4Shutoff silabs.com | Building a more connected world. Rev. 0.5.1 MGM210P Mighty Gecko Module Data Sheet Features Operating Range 1.8 to 3.8 V

-40 to +125C Dimensions 12.9 mm x 15.0 mm x 2.2 mm Security Secure Boot with Root of Trust and Secure Loader (RTSL)1 Hardware Cryptographic Acceleration with DPA counter-

measures1 for AES128/256, SHA-1, SHA-2 (up to 256-bit), ECC (up to 256-bit), ECDSA, and ECDH True Random Number Generator (TRNG) compliant with NIST SP800-90 and AIS-31 ARM TrustZone Secure Debug Interface lock/unlock MCU Peripherals 12-bit 1 Msps SAR Analog to Digital Converter (ADC) 2 Analog Comparator (ACMP) 20 General Purpose I/O pins with output state retention and asynchronous interrupts 8 Channel DMA Controller 12 Channel Peripheral Reflex System (PRS) 2 16-bit Timer/Counter

(3 Compare/Capture/PWM channels) 1 32-bit Timer/Counter

(3 Compare/Capture/PWM channels) 32-bit Real Time Counter 24-bit Low Energy Timer for waveform generation 2 Watchdog Timer 3 Universal Synchronous/Asynchronous Receiver/Trans-

mitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S) 2 I2C interface with SMBus support 1. Features Supported Protocols Zigbee Thread Bluetooth 5.1 Bluetooth Mesh Multi-protocol (Zigbee + Bluetooth 5.1) Wireless System-on-Chip 2.4 GHz radio TX power up to +20 dBm 32-bit ARM Cortex-M33 with DSP instruction and floating-

point unit for efficient signal processing 1024 kB flash program memory 96 kB RAM data memory Embedded Trace Macrocell (ETM) for advanced debugging Receiver Performance

-103.9 dBm sensitivity (1% PER) at 250 kbps O-QPSK DSSS

-104.5 dBm sensitivity (0.1% BER) at 125 kbps GFSK

-100.1 dBm sensitivity (0.1% BER) at 500 kbps GFSK

-97.0 dBm sensitivity (0.1% BER) at 1 Mbps GFSK

-94.1 dBm sensitivity (0.1% BER) at 2 Mbps GFSK Current Consumption 9.4 mA RX current at 250 kbps O-QPSK DSSS 9.3 mA RX current at 1 Mbps GFSK 16.1 mA TX current at 0 dBm (MGM210Px22) 34.1 mA TX current at 10 dBm (MGM210Px22) 181.3 mA TX current at 20 dBm (MGM210Px32) 50.9 A/MHz in Active Mode (EM0) 5.1 A EM2 DeepSleep current (RTCC running from LFXO, Bluetooth Stack not running) 8.5 A EM2 DeepSleep current (RTCC running from LFXO, Bluetooth Stack running) Regulatory Certifications CE ISED FCC 1. With Secure Element (SE) firmware v1.1.2 or newer silabs.com | Building a more connected world. Rev. 0.5.1 | 2 MGM210P Mighty Gecko Module Data Sheet Ordering Information 2. Ordering Information Table 2.1. Ordering Information Ordering Code Protocol Stack TX Power Freq Band Antenna MGM210P022JIA21 MGM210P022JIA2R1 MGM210P032JIA21 MGM210P032JIA2R1 MGM210PA22JIA22 MGM210PA22JIA2R2 MGM210PA32JIA22 MGM210PA32JIA2R2 Zigbee Thread Bluetooth 5.1 Zigbee Thread Bluetooth 5.1 Zigbee Thread Bluetooth 5.1 Zigbee Thread Bluetooth 5.1 Zigbee Thread Bluetooth 5.1 Zigbee Thread Bluetooth 5.1 Zigbee Thread Bluetooth 5.1 Zigbee Thread Bluetooth 5.1 1. Engineering sample device 2. Production device 10 dBm 2.4 GHz 10 dBm 2.4 GHz 20 dBm 2.4 GHz 20 dBm 2.4 GHz 10 dBm 2.4 GHz 10 dBm 2.4 GHz 20 dBm 2.4 GHz 20 dBm 2.4 GHz Chip and RF pin Chip and RF pin Chip and RF pin Chip and RF pin Chip and RF pin Chip and RF pin Chip and RF pin Chip and RF pin Flash

(kB) 1024 RAM

(kB) GPIO Temp Range Packaging 96 20

-40 to 125 C Cut Tape 1024 96 20

-40 to 125 C Reel 1024 96 20

-40 to 125 C Cut Tape 1024 96 20

-40 to 125 C Reel 1024 96 20

-40 to 125 C Cut Tape 1024 96 20

-40 to 125 C Reel 1024 96 20

-40 to 125 C Cut Tape 1024 96 20

-40 to 125 C Reel See 4.5 RF Transmitter General Characteristics for maximum TX power figures. End-product manufacturers must verify that the module is configured to comply with the regulatory limits for each region, in accordance with the formal certification test reports for the device. MGM210P modules are pre-programmed with UART XMODEM bootloader. Throughout this document, the devices above may be referred to by their product family name (e.g. MGM210P), model name

(MGM210P22A / MGM210P32A) or full ordering code. The SLWSTK6102A Wireless Gecko Module Starter Kit is available for MGM210P evaluation and development, as well as SLWRB4308A (+20 dBm TX) and SLWRB4308B (+10 dBm TX) radio boards. silabs.com | Building a more connected world. Rev. 0.5.1 | 3

. Table of Contents

. 1. Features . 2. Ordering Information . 3. System Overview . 3.1 Block Diagram . 3.2 EFR32MG21 SoC . 3.3 Antenna . 3.4 Power Supply . 4. Electrical Specifications . 4.1 Absolute Maximum Ratings. 4.2 General Operating Conditions . 4.3 MCU Current Consumption at 3.0V . 4.4 Radio Current Consumption at 3.0V . 4.5 RF Transmitter General Characteristics

. 4.6 RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band. 4.7 RF Receiver General Characteristics

. 4.8 RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band

. 4.9 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps . 4.10 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps

. 4.11 RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps . 4.12 RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps . 4.13 High-Frequency Crystal

. 4.14 GPIO Pins . 4.15 Microcontroller Peripherals

. 4.16 Typical Performance Curves . 5.1 Network Co-Processor (NCP) Application with UART Host

. 5.2 SoC Application

. 4.16.1 Antenna Radiation and Efficiency . 6. Pin Definitions . 6.1 Module Pinout

. 6.2 Alternate Pin Functions . 6.3 Analog Peripheral Connectivity 6.4 Digital Peripheral Connectivity . 7.1 Layout and Placement

. 5. Reference Diagrams. 7. Design Guidelines

. silabs.com | Building a more connected world. 2

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. 8.1 Dimensions . 8.2 PCB Land Pattern . 8.3 Package Marking . 8. Package Specifications

. 7.2 Proximity to Other Materials 7.3 Proximity to Human Body . 9. Soldering Recommendations 10. Tape and Reel

. 11. Certifications . 11.1 Qualified Antennas . 11.2 CE . 11.3 FCC . 11.4 ISED Canada . 11.5 Proximity to Human Body . 12. Revision History. 31

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. silabs.com | Building a more connected world. Rev. 0.5.1 | 5 MGM210P Mighty Gecko Module Data Sheet System Overview 3. System Overview 3.1 Block Diagram The MGM210P module is a highly-integrated, high-performance system with all the hardware components needed to enable 2.4 GHz wireless connectivity and to support robust networking capabilities via multiple protocols. Built around the EFR32MG21 Wireless Gecko SoC, the MGM210P includes a chip antenna, an RF matching network (optimized for transmit power efficiency), supply decoupling and filtering components, a 38.4 MHz reference crystal, and an RF shield. It also comes with a 50 -matched RF pin and allows the use of an external 32 kHz crystal as a low frequency reference signal via GPIO pins. Since the RF matching networks are optimized for transmit power efficiency, modules rated for +20 dBm will show non-optimal current consumption and performance when operated at a lower output power (e.g. +10 or 0 dBm). The same applies for modules rated for +10 dBm. Antenna RF Match RFPIN RF Match Supply Decoupling Silicon Labs EFR32MG21

(up to 20) HF XTAL External LF XTAL option RF SHIELD Figure 3.1. MGM210P Block Diagram VDD IOVDD GPIO GND 3.2 EFR32MG21 SoC The EFR32MG21 SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 1 MB of Flash memory, a dedicated core for security, a rich set of MCU peripherals, and various clock management and serial interfacing options. Consult the EFR32xG21 Wireless Gecko Reference Manual and the EFR32MG21 Data Sheet for details. 3.3 Antenna MGM210P modules include a ceramic chip antenna on board with the characteristics detailed in the table below. They also include a 50

-matched RF pin to enable the use of an external antenna instead of the module's chip antenna. See 4.16.1 Antenna Radiation and Efficiency and 11.1 Qualified Antennas for other relevant details. Table 3.1. Antenna Efficiency and Peak Gain With optimal layout Note

-1 to -2 dB 1.86 dBi Antenna efficiency, gain and radiation pattern are highly depend-

ent on the application PCB layout and mechanical design. Refer to Design Guidelines for recommendations to achieve optimal an-

tenna performance. Parameter Efficiency Peak gain 3.4 Power Supply The MGM210P requires a single nominal supply level of 3.0 V to operate. However, it can support use cases needing different levels for the main supply (VDD) and for digital IO (IOVDD). All necessary decoupling and filtering components are included in the module. silabs.com | Building a more connected world. Rev. 0.5.1 | 6 MGM210P Mighty Gecko Module Data Sheet Electrical Specifications 4. Electrical Specifications All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:

Typical values are based on TA=25 C and VDD supply at 3.0 V, by production test and/or technology characterization. Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow-

er-specific external RF impedance-matching networks for interfacing to a 50 antenna. Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise. 4.1 Absolute Maximum Ratings Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-

bility data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx. Table 4.1. Absolute Maximum Ratings Test Condition Parameter Storage temperature range Voltage on any supply pin Symbol TSTG VDDMAX VDDRAMPMAX Voltage ramp rate on VDD supply pin DC voltage on any GPIO pin VDIGPIN Total current into VDD power lines IVDDMAX Total current into GND pin Current per I/O pin IGNDMAX IIOMAX Current for all I/O pins IIOALLMAX Source Sink Sink Source Sink Source Min

-50

-0.3

-0.3 Typ Max

+150 3.8 1.0 VIOVDD +

0.3 200 200 50 50 200 200 Unit C V V / s V mA mA mA mA mA mA silabs.com | Building a more connected world. Rev. 0.5.1 | 7 4.2 General Operating Conditions This table specifies the general operating temperature range and supply voltage range for all supplies. The minimum and maximum values of all other tables are specifed over this operating range, unless otherwise noted. MGM210P Mighty Gecko Module Data Sheet Electrical Specifications Table 4.2. General Operating Conditions Test Condition

-I temperature grade Parameter Operating ambient tempera-

ture range VDD Supply Voltage IOVDD operating supply volt-

age (All IOVDD pins) Symbol TA VDD VIOVDD HCLK and Core frequency fHCLK MODE = WS1, RAMWSEN = 11 MODE = WS1, RAMWSEN = 01 MODE = WS0, RAMWSEN = 01 PCLK frequency EM01 Group A clock fre-

quency fPCLK fEM01GRPACLK HCLK Radio frequency fHCLKRADIO Note:

Min

-40 1.8 1.8 38 Typ 3.0 3.0 38.4 Max

+125 3.8 3.8 80 50 39 50 80 40 Unit C V V MHz MHz MHz MHz MHz MHz 1. Flash wait states are set by the MODE field in the MSC_READCTRL register. RAM wait states are enabled by setting the RAMW-

SEN bit in the SYSYCFG_DMEM0RAMCTRL register. silabs.com | Building a more connected world. Rev. 0.5.1 | 8 4.3 MCU Current Consumption at 3.0V Unless otherwise indicated, typical conditions are: VDD = 3.0 V. TA = 25 C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 C. MGM210P Mighty Gecko Module Data Sheet Electrical Specifications Table 4.3. MCU Current Consumption at 3.0V Test Condition Min 80 MHz HFRCO, CPU running Prime from flash 80 MHz HFRCO, CPU running while loop from flash 80 MHz HFRCO, CPU running CoreMark loop from flash 38.4 MHz crystal, CPU running while loop from flash 80 MHz HFRCO 38.4 MHz crystal Full RAM retention and RTC run-

ning from LFXO (Bluetooth Stack not running) Full RAM retention, RTCC run-

ning, and Bluetooth Stack running from LFXO 1 bank (16 kB) RAM retention and RTC running from LFRCO Full RAM retention and RTC run-

ning from ULFRCO 1 bank (16 kB) RAM retention and RTC running from ULFRCO No BURTC, no LF oscillator Hard pin reset held Parameter Current consumption in EM0 mode with all peripherals dis-

abled1 Symbol IACTIVE Current consumption in EM1 mode with all peripherals dis-

abled1 IEM1 Current consumption in EM2 mode IEM2 Current consumption in EM3 mode IEM3 Current consumption in EM4 mode Current consumption during reset Current consumption per re-

tained 16kB RAM bank in EM2 Note:

IEM4 IRST IRAM Typ 50.9 45.6 59.8 63.8 28.7 46.9 5.1 8.5 4.5 4.8 4.3 0.21 146 0.10 Max Unit A/MHz 55.5 A/MHz 37.6 10.5 11.4 0.5 A/MHz A/MHz A/MHz A/MHz A A A A A A A A 1. The typical EM0/EM1 current measurement includes some current consumed by the security core for periodical housekeeping purposes. This does not include current consumed by user-triggered security operations, such as cryptographic calculations. silabs.com | Building a more connected world. Rev. 0.5.1 | 9 4.4 Radio Current Consumption at 3.0V RF current consumption measured with MCU in EM1, HCLK = 38.4 MHz, and all MCU peripherals disabled. Unless otherwise indica-

ted, typical conditions are: VDD = 3.0V. TA = 25 C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 C. MGM210P Mighty Gecko Module Data Sheet Electrical Specifications Parameter Current consumption in re-

ceive mode, active packet reception Symbol IRX_ACTIVE Table 4.4. Radio Current Consumption at 3.0V Test Condition Min 125 kbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running 500 kbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running 1 Mbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running 2 Mbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running 802.15.4 receiving frame, f = 2.4 GHz, ZigBee stack running Current consumption in re-

ceive mode, Stack running IRX_LISTEN 125 kbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running Current consumption in transmit mode ITX 500 kbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running 1 Mbit/s, 2GFSK, f = 2.4 GHz, Bluetooth stack running 2 Mbit/s, 2GFSK, f = 2.4 GHz, Bluetooh stack running 802.15.4, f = 2.4 GHz, ZigBee stack running f = 2.4 GHz, CW, 10 dBm Module, 0 dBm output power f = 2.4 GHz, CW, 10 dBm Module, 10 dBm output power f = 2.4 GHz, CW, 20 dBm Module, 10 dBm output power, VDD = 3.0 V f = 2.4 GHz, CW, 20 dBm Module, POUT = 19.6 dBm, VDD = 3.3 V1 f = 2.4 GHz, CW, 20 dBm Module, POUT =19.2 dBm, VDD = 3.3 V 2 Typ 9.3 9.3 9.3 9.9 9.4 9.1 9.1 9.1 9.8 9.2 16.1 34.1 59.7 181.3 173 Max Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Note:

1. The maximum power for when not using Bluetooth Low-Energy is limited to 19.6 dBm. 2. The maximum power for Bluetooth Low-Energy is limited to 19.2 dBm. silabs.com | Building a more connected world. Rev. 0.5.1 | 10 4.5 RF Transmitter General Characteristics Unless otherwise indicated, typical conditions are: TA = 25 C, VDD = 3.0V. Measured with RF center frequency of 2.45 GHz on RF2G4_IO2 port. MGM210P Mighty Gecko Module Data Sheet Electrical Specifications Table 4.5. RF Transmitter General Characteristics Parameter RF tuning frequency range Symbol FRANGE Test Condition Min 2400 Maximum TX output power 1 POUTMAX 20 dBm Module, VDD = 3.3V2 20 dBm Module, BLE, VDD =

3.3V3 10 dBm Module Minimum active TX Power POUTMIN 20 dBm Module, VDD = 3.3 V Output power step size POUTSTEP Output power variation vs VDD supply voltage, Freq =

2450MHz POUTVAR_V Output power variation vs temperature, Freq =

2450MHz POUTVAR_T Output power variation vs RF frequency POUTVAR_F 10 dBm Module 10 dBm Module, -5 dBm < POUT <

0 dBm 10 dBm Module, 0 dBm < POUT <

10 dBm 20 dBm Module, 0 dBm < POUT <

5 dBm 20 dBm Module, 5 dBm < POUT <

POUTMAX 20 dBm Module, POUT =

POUTMAX VDD swept from 3.0V to 3.8V. 10 dBm Module, POUT =

POUTMAX VDD swept from 1.8V to 3.0V. 20 dBm Module, POUT =

POUTMAX, VDD = 3.3V, tempera-

ture swept from -40 to +125 C. 10 dBm Module, POUT =

POUTMAX, VDD = 3.0V, tempera-

ture swept from -40 to +125 C. 20 dBm Module, POUT =

POUTMAX, VDD = 3.3V, Freq. swept from 2400 to 2483.5 MHz 10 dBm Module, POUT =

POUTMAX, VDD = 3.0V, Freq. swept from 2400 to 2483.5 MHz Typ 19.6 19.2 10

-20.5

-19.3 1.5 1.0 0.7 0.5 1.0 0.2 1.5 0.3 0.2 0.2 Max 2483.5 Unit MHz dBm dBm dBm dBm dBm dB dB dB dB dB dB dB dB dB dB Note:

1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-

ered in this data sheet can be found in the TX Power column of the Ordering Information Table. 2. The maximum power when not using Bluetooth Low-Energy. 3. The maximum power for Bluetooth Low-Energy. silabs.com | Building a more connected world. Rev. 0.5.1 | 11 4.6 RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band Unless otherwise indicated, typical conditions are: TA = 25 C, VDD = 3.0V. Measured with RF center frequency of 2.45 GHz on RF2G4_IO2 port. Table 4.6. RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band MGM210P Mighty Gecko Module Data Sheet Electrical Specifications Parameter Error vector magnitude per 802.15.4-2011 Symbol EVM Test Condition 20 dBm Module, Average across frequency, signal is DSSS-

OQPSK reference packet, VDD =

3.3 V, Pout = POUTMAX 10 dBm Module, Average across frequency, signal is DSSS-

OQPSK reference packet, Pout =

10 dBm Min Typ TBD Max Unit

% rms TBD

% rms 4.7 RF Receiver General Characteristics Unless otherwise indicated, typical conditions are: TA = 25 C, VDD = 3.0V. Measured with RF center frequency of 2.45 GHz on RF2G4_IO2 port. Table 4.7. RF Receiver General Characteristics Parameter RF tuning frequency range Symbol FRANGE Test Condition Min 2400 Typ Max 2483.5 Unit MHz silabs.com | Building a more connected world. Rev. 0.5.1 | 12 4.8 RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band Unless otherwise indicated, typical conditions are: TA = 25 C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2. Table 4.8. RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band MGM210P Mighty Gecko Module Data Sheet Electrical Specifications Parameter Symbol Test Condition Min Max usable receiver input level, 1% PER Co-channel interferer rejec-

tion, 1% PER SAT CCR Sensitivity, 1% PER SENS Image rejection, 1% PER, desired is reference signal at 3 dB above reference sensi-

tivity level2 IR BLOCK RSSIRES RSSILIN ACRREF1 ACRREF2 Blocking rejection of all other channels, 1% PER, desired is reference signal at 3 dB above reference sensitivity level2, interferer is reference signal RSSI resolution RSSI accuracy in the linear region as defined by 802.15.4-2003 Adjacent channel rejection, Interferer is reference signal, 1% PER, desired is refer-

ence signal at 3 dB above reference sensitivity level2 Alternate channel rejection, interferer is reference signal, 1% PER, desired is refer-

ence signal at 3 dB above reference sensitivity level2 Note:

Signal is reference signal1, packet length is 20 octets Desired signal 3 dB above sensi-

tivity limit Signal is reference signal, packet length is 20 octets Interferer is CW in image band3 Interferer frequency < desired fre-

quency -3 channel spacing Interferer frequency > desired fre-

quency +3 channel spacing

-100 dBm to +5 dBm Interferer is reference signal at +1 channel spacing Interferer is reference signal at -1 channel spacing Interferer is reference signal at +2 channel spacing Interferer is reference signal at -2 channel spacing Typ 10

-0.2

-103.9 43.5 57.6 57.5 0.25

+/-6 39.9 39.2 51.1 51.6 Max Unit dBm dB dBm dB dB dB dB dB dB dB dB dB 1. Reference signal is defined as O-QPSK DSSS per 802.15.4, Frequency range = 2400-2483.5 MHz, Symbol rate = 62.5 ksym-

bols/s. 2. Reference sensitivity level is -85 dBm. 3. Due to low-IF frequency, there is some overlap of adjacent channel and image channel bands. Adjacent channel CW blocker tests place the Interferer center frequency at the Desired frequency 5 MHz on the channel raster, whereas the image rejection test places the CW interferer near the image frequency of the Desired signal carrier, regardless of the channel raster. silabs.com | Building a more connected world. Rev. 0.5.1 | 13 4.9 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps Unless otherwise indicated, typical conditions are: TA = 25 C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2. Table 4.9. RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps MGM210P Mighty Gecko Module Data Sheet Electrical Specifications Parameter Max usable receiver input level Sensitivity Symbol SAT SENS Signal to co-channel interfer-

er C/ICC N 1 Adjacent channel se-

lectivity C/I1 N 2 Alternate channel se-

lectivity C/I2 N 3 Alternate channel se-

lectivity C/I3 Selectivity to image frequen-

cy C/IIM Selectivity to image frequen-

cy 1 MHz C/IIM_1 Test Condition Min Signal is reference signal, packet length is 37 bytes1 Signal is reference signal, 37 byte payload1 With non-ideal signals2 1

(see notes)1 3 Interferer is reference signal at +1 MHz offset1 4 3 5 Interferer is reference signal at -1 MHz offset1 4 3 5 Interferer is reference signal at +2 MHz offset1 4 3 5 Interferer is reference signal at -2 MHz offset1 4 3 5 Interferer is reference signal at +3 MHz offset1 4 3 5 Interferer is reference signal at -3 MHz offset1 4 3 5 Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion1 5 Interferer is reference signal at im-

age frequency +1 MHz with 1 MHz precision1 5 Interferer is reference signal at im-

age frequency -1 MHz with 1 MHz precision1 5 Typ 10

-97.0

-96.7

+6.6

-8.3

-8.7

-42.1

-48.9

-42.4

-54.8

-42.1

-42.4

-8.3

-23 Max Unit dBm dBm dBm dB dB dB dB dB dB dB dB dB dB dBm Intermodulation performance IM n = 36 Note:

1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -67 dBm. 4. Desired frequency 2402 MHz Fc 2480 MHz. 5. With allowed exceptions. 6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4 silabs.com | Building a more connected world. Rev. 0.5.1 | 14 4.10 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps Unless otherwise indicated, typical conditions are: TA = 25 C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2. Table 4.10. RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps MGM210P Mighty Gecko Module Data Sheet Electrical Specifications Parameter Max usable receiver input level Sensitivity Symbol SAT SENS Signal to co-channel interfer-

er C/ICC N 1 Adjacent channel se-

lectivity C/I1 N 2 Alternate channel se-

lectivity C/I2 N 3 Alternate channel se-

lectivity C/I3 Selectivity to image frequen-

cy C/IIM Selectivity to image frequen-

cy 1 MHz C/IIM_1 Test Condition Min Signal is reference signal, packet length is 37 bytes1 Signal is reference signal, 37 byte payload1 With non-ideal signals2 1

(see notes)1 3 Interferer is reference signal at +2 MHz offset1 4 3 5 Interferer is reference signal at -2 MHz offset1 4 3 5 Interferer is reference signal at +4 MHz offset1 4 3 5 Interferer is reference signal at -4 MHz offset1 4 3 5 Interferer is reference signal at +6 MHz offset1 4 3 5 Interferer is reference signal at -6 MHz offset1 4 3 5 Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion1 5 Interferer is reference signal at im-

age frequency +2 MHz with 1 MHz precision1 5 Interferer is reference signal at im-

age frequency -2 MHz with 1 MHz precision1 5 Typ 10

-94.1

-93.9

+6.0

-8.0

-8.8

-42.2

-50.3

-54.4

-55.4

-8.0

-42.2

+6.0

-22.3 Max Unit dBm dBm dBm dB dB dB dB dB dB dB dB dB dB dBm Intermodulation performance IM n = 36 Note:

1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -67 dBm. 4. Desired frequency 2402 MHz Fc 2480 MHz. 5. With allowed exceptions. 6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4 silabs.com | Building a more connected world. Rev. 0.5.1 | 15 4.11 RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps Unless otherwise indicated, typical conditions are: TA = 25 C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2. Table 4.11. RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps MGM210P Mighty Gecko Module Data Sheet Electrical Specifications Parameter Max usable receiver input level Sensitivity Symbol SAT SENS Signal to co-channel interfer-

er C/ICC N 1 Adjacent channel se-

lectivity C/I1 N 2 Alternate channel se-

lectivity C/I2 N 3 Alternate channel se-

lectivity C/I3 Selectivity to image frequen-

cy C/IIM Selectivity to image frequen-

cy 1 MHz C/IIM_1 Test Condition Min Signal is reference signal, packet length is 37 bytes1 Signal is reference signal1 With non-ideal signals2 1

(see notes)1 3 Interferer is reference signal at +1 MHz offset1 4 3 5 Interferer is reference signal at -1 MHz offset1 4 3 5 Interferer is reference signal at +2 MHz offset1 4 3 5 Interferer is reference signal at -2 MHz offset1 4 3 5 Interferer is reference signal at +3 MHz offset1 4 3 5 Interferer is reference signal at -3 MHz offset1 4 3 5 Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion1 5 Interferer is reference signal at im-

age frequency +1 MHz with 1 MHz precision1 5 Interferer is reference signal at im-

age frequency -1 MHz with 1 MHz precision1 5 Typ 10

-100.1

-99.3

+2.1

-9.0

-9.5

-44.4

-51.9

-44.3

-58.3

-44.4

-44.3

-9.0 Max Unit dBm dBm dBm dB dB dB dB dB dB dB dB dB dB Note:

1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -72 dBm. 4. Desired frequency 2402 MHz Fc 2480 MHz. 5. With allowed exceptions. silabs.com | Building a more connected world. Rev. 0.5.1 | 16 4.12 RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps Unless otherwise indicated, typical conditions are: TA = 25 C, VDD = 3.0V. RF center frequency 2.45 GHz. Measured on RF2G4_IO2. Table 4.12. RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps MGM210P Mighty Gecko Module Data Sheet Electrical Specifications Parameter Max usable receiver input level Sensitivity Symbol SAT SENS Signal to co-channel interfer-

er C/ICC N 1 Adjacent channel se-

lectivity C/I1 N 2 Alternate channel se-

lectivity C/I2 N 3 Alternate channel se-

lectivity C/I3 Selectivity to image frequen-

cy C/IIM Selectivity to image frequen-

cy 1 MHz C/IIM_1 Test Condition Min Signal is reference signal, packet length is 37 bytes1 Signal is reference signal1 With non-ideal signals2 1

(see notes)1 3 Interferer is reference signal at +1 MHz offset1 4 3 5 Interferer is reference signal at -1 MHz offset1 4 3 5 Interferer is reference signal at +2 MHz offset1 4 3 5 Interferer is reference signal at -2 MHz offset1 4 3 5 Interferer is reference signal at +3 MHz offset1 4 3 5 Interferer is reference signal at -3 MHz offset1 4 3 5 Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion1 5 Interferer is reference signal at im-

age frequency +1 MHz with 1 MHz precision1 5 Interferer is reference signal at im-

age frequency -1 MHz with 1 MHz precision1 5 Typ 10

-104.5

-104.2

+0.8

-13.1

-13.6

-49.5

-56.9

-47.0

-63.1

-49.5

-47.0

-13.1 Max Unit dBm dBm dBm dB dB dB dB dB dB dB dB dB dB Note:

1. 0.1% Bit Error Rate. 2. With non-ideal signals as specified in Bluetooth Test Specification RF-PHY.TS.5.0.1 section 4.7.1 3. Desired signal -79 dBm. 4. Desired frequency 2402 MHz Fc 2480 MHz. 5. With allowed exceptions. silabs.com | Building a more connected world. Rev. 0.5.1 | 17 4.13 High-Frequency Crystal MGM210P Mighty Gecko Module Data Sheet Electrical Specifications Parameter Crystal frequency Initial calibrated accuracy Temperature drift Symbol fHFXTAL ACCHFXTAL DRIFTHFXTAL Table 4.13. High-Frequency Crystal Test Condition Across specified temperature range Min

-10

-30 Typ 38.4 Max

+10

+30 Unit MHz ppm ppm silabs.com | Building a more connected world. Rev. 0.5.1 | 18 4.14 GPIO Pins Unless otherwise indicated, typical conditions are: VDD = 3.0 V. MGM210P Mighty Gecko Module Data Sheet Electrical Specifications Parameter Leakage current Symbol ILEAK_IO Input low voltage1 Input high voltage1 Output low voltage Output high voltage VIL VIH VOL VOH GPIO rise time TGPIO_RISE GPIO fall time TGPIO_FALL Pull up/down resistance2 RPULL Maximum filtered glitch width TGF Note:

Table 4.14. GPIO Pins Test Condition MODEx = DISABLED, VDD =

1.71V MODEx = DISABLED, VDD = 3.0 V MODEx = DISABLED, VDD = 3.8 V TA = 125 C Any GPIO pin Min Any GPIO pin 0.7 * VDD Sinking 20mA, VDD = 3.0 V Sinking 8mA, VDD = 1.62 V Sourcing 20mA, VDD = 3.0 V Sourcing 8mA, VDD = 1.62 V VDD = 3.0V, Cload = 50pF, SLEW-

RATE = 4, 10% to 90%

VDD = 1.7V, Cload = 50pF, SLEW-

RATE = 4, 10% to 90%

VDD = 3.0V, Cload = 50pF, SLEW-

RATE = 4, 90% to 10%

VDD = 1.7V, Cload = 50pF, SLEW-

RATE = 4, 90% to 10%

pull-up: MODEn = DISABLE DOUT=1, pull-down: MODEn =

WIREDORPULLDOWN DOUT =

0 MODE = INPUT, DOUT = 1 0.8 * VDD 0.6 * VDD 35 Typ 1.9 2.5 8.4 13 7.1 11.9 44 26 Max Unit 200 0.3 * VDD 0.2 * VDD 0.4 * VDD 55 nA nA nA V V V V V V ns ns ns ns k ns 1. GPIO and RESETn input thresholds are proportional to the VDD supply. 2. GPIO and RESETn pull-ups connect to the VDD supply. Pull-downs on GPIO connect to VSS. silabs.com | Building a more connected world. Rev. 0.5.1 | 19 MGM210P Mighty Gecko Module Data Sheet Electrical Specifications 4.15 Microcontroller Peripherals The MCU peripherals set available in MGM210P modules includes:

12-bit 1 Msps ADC Analog Comparators 16-bit and 32-bit Timers/Counters 24-bit Low Energy Timer for waveform generation 32-bit Real Time Counter USART (UART/SPI/SmartCards/IrDA/I2S) I2C peripheral interfaces 12 Channel Peripheral Reflex System For details on their electrical performance, consult the relevant portions of Section 4 in the SoC's datasheet. To learn which GPIO ports provide access to every peripheral, consult 6.3 Analog Peripheral Connectivity and 6.4 Digital Peripheral Connectivity. 4.16 Typical Performance Curves Typical performance curves indicate typical characterized performance under the stated conditions. silabs.com | Building a more connected world. Rev. 0.5.1 | 20 4.16.1 Antenna Radiation and Efficiency Typical MGM210P radiation patterns and efficiency for the on-board chip antenna under optimal operating conditions are plotted in the figures that follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is mounted on, as well as on the proximity of any mechanical design to the antenna. MGM210P Mighty Gecko Module Data Sheet Electrical Specifications Figure 4.1. Typical 2D Antenna Radiation Patterns and Efficiency Top Left: Phi 0o, Top Right: Phi 90o, Bottom Left: Theta 90o, Bottom Right: Radiation Efficiency vs Application Board GND Plane Width silabs.com | Building a more connected world. Rev. 0.5.1 | 21 5. Reference Diagrams 5.1 Network Co-Processor (NCP) Application with UART Host The MGM210P can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, pro-

gramming/debug interface, and host interface connections are shown in the figure below. For more details, refer to AN958: Debugging and Programming Interfaces for Custom Designs. MGM210P Mighty Gecko Module Data Sheet Reference Diagrams Figure 5.1. UART NCP Configuration silabs.com | Building a more connected world. Rev. 0.5.1 | 22 5.2 SoC Application The MGM210P can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and program-

ming/debug interface connections are shown in the figure below. For more details, refer to AN958: Debugging and Programming Inter-

faces for Custom Designs. MGM210P Mighty Gecko Module Data Sheet Reference Diagrams Figure 5.2. Stand-Alone SoC Configuration Figure 5.3. Stand-Alone SoC Configuration with External Antenna silabs.com | Building a more connected world. Rev. 0.5.1 | 23 6. Pin Definitions 6.1 Module Pinout MGM210P Mighty Gecko Module Data Sheet Pin Definitions Figure 6.1. MGM210P Module Pinout The next table shows the MGM210P pinout and some general descriptions of pin functionality. For more information on the features supported by each GPIO, see 6.3 Analog Peripheral Connectivity and 6.4 Digital Peripheral Connectivity. Table 6.1. MGM210P Module Pin Definitions Pin Name No. Description Pin Name No. Description GND PB00 PA01 PA03 PA05 DECOUPLE VDD PD04 PD02 PD00 PC00 PC02 PC04 RESETn RF2G4_IO2 GND 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 GPIO GPIO GPIO GPIO Decouple output for on-chip voltage regulator. An external decoupling ca-

pacitor is required at this pin. Power supply GPIO GPIO GPIO GPIO GPIO GPIO Reset Pin 2.4 GHz RF input/output GPIO GPIO GPIO GPIO GPIO Digital IO power supply GPIO GPIO GPIO GPIO GPIO PB01 PA00 PA02 PA04 PA06 GND IOVDD PD03 PD01 GND PC01 PC03 PC05 GND GND 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 silabs.com | Building a more connected world. Rev. 0.5.1 | 24 6.2 Alternate Pin Functions Some pins support multiple functions through internal multiplexing in the SoC (e.g. debugging, wake-up, etc.). The following table shows the functions available on each module pin. Refer to SoC's reference manual for more details. MGM210P Mighty Gecko Module Data Sheet Pin Definitions Table 6.2. GPIO Alternate Functions Table Alternate Function GPIO.EM4WU3 GPIO.SWCLK GPIO.SWDIO GPIO.SWV GPIO.TDI GPIO.EM4WU0 GPIO.EM4WU9 LFXO.LFXTAL_I LFXO.LFXTAL_O GPIO.EM4WU6 GPIO.EM4WU7 GPIO.TRACEDATA0 GPIO.TDO GPIO.TRACECLK LFXO.LF_EXTCLK GPIO PB01 PA01 PA02 PA03 PA04 PA05 PD02 PD01 PD00 PC00 PC05 6.3 Analog Peripheral Connectivity Many analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avali-

able on each GPIO port. When a differential connection is being used Positive inputs are restricted to the EVEN pins and Negative inputs are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the device Reference Manual for more details on the ABUS and analog peripherals. Table 6.3. ABUS Routing Table Peripheral Signal PA PB PC PD ACMP0 ACMP1 IADC0 ana_neg ana_pos ana_neg ana_pos ana_neg ana_pos EVEN ODD EVEN ODD EVEN ODD EVEN ODD Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes silabs.com | Building a more connected world. Rev. 0.5.1 | 25 6.4 Digital Peripheral Connectivity Many digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avalia-

ble on each GPIO port. MGM210P Mighty Gecko Module Data Sheet Pin Definitions Peripheral.Resource ACMP0.DIGOUT ACMP1.DIGOUT CMU.CLKIN0 CMU.CLKOUT0 CMU.CLKOUT1 CMU.CLKOUT2 FRC.DCLK FRC.DFRAME FRC.DOUT I2C0.SCL I2C0.SDA I2C1.SCL I2C1.SDA LETIMER0.OUT0 LETIMER0.OUT1 PRS.ASYNCH0 PRS.ASYNCH1 PRS.ASYNCH10 PRS.ASYNCH11 PRS.ASYNCH2 PRS.ASYNCH3 PRS.ASYNCH4 PRS.ASYNCH5 PRS.ASYNCH6 PRS.ASYNCH7 PRS.ASYNCH8 PRS.ASYNCH9 PRS.SYNCH0 PRS.SYNCH1 PRS.SYNCH2 PRS.SYNCH3 Table 6.4. DBUS Routing Table PA Available Available PB Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available PORT PC Available Available Available Available Available Available Available Available Available Available Available Available PD Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available silabs.com | Building a more connected world. Rev. 0.5.1 | 26 Peripheral.Resource TIMER0.CC0 TIMER0.CC1 TIMER0.CC2 TIMER0.CDTI0 TIMER0.CDTI1 TIMER0.CDTI2 TIMER1.CC0 TIMER1.CC1 TIMER1.CC2 TIMER1.CDTI0 TIMER1.CDTI1 TIMER1.CDTI2 TIMER2.CC0 TIMER2.CC1 TIMER2.CC2 TIMER2.CDTI0 TIMER2.CDTI1 TIMER2.CDTI2 TIMER3.CC0 TIMER3.CC1 TIMER3.CC2 TIMER3.CDTI0 TIMER3.CDTI1 TIMER3.CDTI2 USART0.CLK USART0.CS USART0.CTS USART0.RTS USART0.RX USART0.TX USART1.CLK USART1.CS USART1.CTS USART1.RTS USART1.RX USART1.TX MGM210P Mighty Gecko Module Data Sheet Pin Definitions PORT PC Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available PD Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available PA Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available PB Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available Available silabs.com | Building a more connected world. Rev. 0.5.1 | 27 PA PB Peripheral.Resource USART2.CLK USART2.CS USART2.CTS USART2.RTS USART2.RX USART2.TX MGM210P Mighty Gecko Module Data Sheet Pin Definitions PORT PC Available Available Available Available Available Available PD Available Available Available Available Available Available silabs.com | Building a more connected world. Rev. 0.5.1 | 28 7. Design Guidelines 7.1 Layout and Placement For optimal performance of the MGM210P, MGM210P Mighty Gecko Module Data Sheet Design Guidelines Place the module aligned to the edge of the application PCB, as illustrated in the figures below. Leave the antenna clearance area void of any traces, components, or copper on all layers of the application PCB if you are going to use the on-board chip antenna Antenna clearance area is not necessary if you are using an external antenna attached to the RF pin. For external antenna use cases, use a 50 grounded coplanar transmission line to trace the signal from the RF pin to an exter-

nal RF connector if applicable (see Figure 7.2 Recommended Layout for MGM210P Using External Antenna on page 30). A general rule is to use 50 transmission lines where the length of the RF trace is longer than /16 at the fundamental frequen-

cy, which for 2.4 GHz is approximately 7.8 mm. A U.FL connector can be used in the host PCB for the connection to an external antenna. The use of a U.FL connector is also recommended for conductive tests. The integrator must use a unique connector, such as a reverse polarity SMA or reverse thread SMA, if detachable antenna is offered with the host chassis. This is especially required for the FCC and ISED approvals to remain valid, and any other kind of direct connector to the antenna might require a permissive change. A trace length of 2.6 mm was used in the certifications host board to connect the module RF pin to the U.FL connector. For reference, Figure 7.4 RF Trace Design Example on page 31 shows a set of parameters for a 50 trace. Trace impedance should always be matched to the particular stack-up used on the host board. Connect all ground pads directly to a solid ground plane. Place the ground vias as close to the ground pads as possible. Do not place plastic or any other dielectric material in contact with the antenna. Place vias close to each of the modules GND pads Align module edge with PCB edge GND Antenna Clearance No metal in this area GND GND GND Wireless Module

(Top View) GND GND Figure 7.1. Recommended Layout for MGM210P Using On-Board Chip Antenna Place vias along all PCB edges silabs.com | Building a more connected world. Rev. 0.5.1 | 29 MGM210P Mighty Gecko Module Data Sheet Design Guidelines Place vias close to each of the modules GND pads Align module edge with PCB edge GND GND GND GND RF2G4_IO2 Wireless Module

(Top View) 50 Ohm trace for RF signal GND GND U.FL connector for external antenna Place vias along all PCB edges Figure 7.2. Recommended Layout for MGM210P Using External Antenna The figure below illustrates layout scenarios that will lead to severely degraded RF performance for the module. Copper Clearance Area XGND plane width Figure 7.3. Non-Optimal Layout Examples The width of the GND plane to the sides the module will impact the efficiency of the on-board chip antenna. To achieve optimal per-

formance, a GND plane width of 50 mm is recommended. See Figure 4.1 Typical 2D Antenna Radiation Patterns and Efficiency on page 21 for reference. silabs.com | Building a more connected world. Rev. 0.5.1 | 30 MGM210P Mighty Gecko Module Data Sheet Design Guidelines Figure 7.4. RF Trace Design Example 7.2 Proximity to Other Materials Avoid placing plastic or any other dielectric material in close proximity to the antenna. Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended dis-

tance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes. 7.3 Proximity to Human Body Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range. silabs.com | Building a more connected world. Rev. 0.5.1 | 31 MGM210P Mighty Gecko Module Data Sheet Package Specifications 8. Package Specifications 8.1 Dimensions 15.0 mm

(0.2) 4.2 mm

(0.1) 3.0 mm

(0.1) 5.7 mm

(0.1) 0.8 mm

(0.1) 0.8 mm

(0.1) 1.5 mm

(0.1)

(0.1) 8.1 mm

(0.1) 0.4 mm

(0.1) 1.45 mm

(0.1) 2.25 mm

(0.2) 12.9 mm

(0.2) Figure 8.1. Module Dimensions silabs.com | Building a more connected world. Rev. 0.5.1 | 32 8.2 PCB Land Pattern MGM210P Mighty Gecko Module Data Sheet Package Specifications Figure 8.2. Land Pattern for Chip Antenna Use Case Figure 8.3. Land Pattern for RF Pin Use Case silabs.com | Building a more connected world. Rev. 0.5.1 | 33 8.3 Package Marking The figure below shows the module markings engraved on the RF shield. MGM210P Mighty Gecko Module Data Sheet Package Specifications Figure 8.4. MGM210P Top Marking Mark Description The package marking consists of:

MGM210Pxxxxxxx - Part number designation Model: MGM210Pxxx - Model number designation QR Code: YYWWMMABCDE YY Last two digits of the assembly year. WW Two-digit workweek when the device was assembled. MMABCDE Silicon Labs unit code YYWWTTTTTT YY Last two digits of the assembly year. WW Two-digit workweek when the device was assembled. TTTTTT Manufacturing trace code. The first letter is the device revision. Certification marks such as the CE logo, FCC and IC IDs, etc will be engraved in the gray area according to regulatory body require-

ments silabs.com | Building a more connected world. Rev. 0.5.1 | 34 MGM210P Mighty Gecko Module Data Sheet Soldering Recommendations 9. Soldering Recommendations It is recommended that final PCB assembly of the MGM210P follows the industry standard as identified by the Institute for Printed Cir-

cuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements. CLASS 1 General Electronic Products Includes products suitable for applications where the major requirement is function of the completed assembly. CLASS 2 Dedicated Service Electronic Products Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. CLASS 3 High Performance/Harsh Environment Electronic Products Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. silabs.com | Building a more connected world. Rev. 0.5.1 | 35 10. Tape and Reel MGM210P modules are delivered to the customer in cut tape (100 pcs) or reel (1000 pcs) packaging with the dimensions below. All dimensions are given in mm unless otherwise indicated. MGM210P Mighty Gecko Module Data Sheet Tape and Reel Figure 10.1. Carrier Tape Dimensions Figure 10.2. Reel Dimensions silabs.com | Building a more connected world. Rev. 0.5.1 | 36 MGM210P Mighty Gecko Module Data Sheet Certifications 11. Certifications This section details the regulatory certification status of the module in various regions. The address for the module manufacturer and certification applicant is:

SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland 11.1 Qualified Antennas MGM210P modules have been tested and certified both with the on-board chip antenna and with an external antenna attached to the RF pin (RF2G4_IO2). Performance characteristics for the chip antenna are presented in Table 3.1 Antenna Efficiency and Peak Gain on page 6 and Figure 4.1 Typical 2D Antenna Radiation Patterns and Efficiency on page 21. Details for the external antenna qualified are summarized in the table below. Table 11.1. Qualified External Antennas for MGM210P Antenna Type Maximum Gain Connectorized Coaxial Dipole 2.14 dBi Impedance 50 Any antenna of the same general type and of equal or less directional gain as listed in the above table can be used in the regulatory areas that have a full modular radio approval (USA, Canada, Korea, Japan) as long as spot-check testing is performed to verify that no performance changes compromising compliance have been introduced. In countries applying the ETSI standards, like the EU countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher gain may violate some of the regulatory limits. If an antenna of a different type (such as a chip antenna, a PCB trace antenna or a patch) with a gain less than or equal to 2.14 dBi is needed, it can be added as a permissive change, requiring some radiated emission testing. Antenna types with more gain than 2.14 dBi may require a fully new certification. Since the exact permissive change procedure is chosen on a case by case basis, please consult your test house and/or certification body for understanding the correct approach. You might also want or need to get in touch with Sili-

con Labs for any authorization letter that your certification body might ask for. 11.2 CE The MGM210P module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Direc-

tive (RED) (2014/53/EU). Please note that every application using the MGM210P will need to perform the radio EMC tests on the end product, according to EN 301 489-17. It is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product. The specific product assembly may have an impact to RF radiated characteristics, and manufacturers should carefully consider RF radiated testing with the end-product assembly. A formal Declaration of Conformity (DoC) is available via https://www.silabs.com/. 11.3 FCC This device complies with Part 15 of the FCC Rules when operating with the embedded antenna or with the antenna type(s) listed in Table 11.1. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. Any changes or modifications not expressly approved by Silicon Labs could void the users authority to operate the equipment. FCC RF Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif-

ic operating instructions for satisfying RF exposure compliance. This transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance to the limit(s) exposed in the RF Exposure Analysis. This transmitter also meets the Portable requirements at distances equal or above 5 mm for the MGM210P22A and 36.17 mm for the MGM210P32A in the case of Zigbee, and respectively 5.3 mm and 44.0 mm in the case of Bluetooth Low Energy. These distances are reported for convenience also in Table 11.2. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in ac-

cordance with FCC multi-transmitter product procedures. silabs.com | Building a more connected world. Rev. 0.5.1 | 37 MGM210P Mighty Gecko Module Data Sheet Certifications OEM Responsibilities to comply with FCC Regulations This module has been tested for compliance to FCC Part 15. OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module in-

stalled (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, in accord-

ance to the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01. General Considerations This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radia-

tor) rule requirement applicable to the final host. The final host will still need to be reassessed for compliance to this portion of rule requirements if applicable. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end-user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warnings as shown in this manual. OEM/Host Manufacturer Responsibilities OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reas-

sessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the FCC rules. This module must not be incorporated into any other device or system without retesting for compliance as multi-radio and combined equipment. Separation To meet the SAR exemption for portable conditions, the minimum separation distance indicated in Table 11.2 must be maintained between the human body and the radiator (antenna) at all times. In particular, in the use case of Zigbee the minimum distance must be 5 mm for the MGM210P22A and 36.17 mm for the MGM210P32A, whereas in the use case of Bluetooth Low Energy the mini-

mum distances must be 5.3 mm and 44.0 mm respectively. This transmitter module is tested in a standalone mobile RF exposure condition, and in case of any co-located radio transmitter be-

ing allowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the exceptions rules to be applied, a separate additional SAR evaluation will be required, ultimately leading to a Class II Permissive Change, or more rarely to a new grant. Important Note: In the event that these conditions cannot be met, the final product will have to undergo additional testing to evalu-

ate the RF exposure in order for the FCC authorization to remain valid, and a permissive change will have to be applied. The evalua-

tion (SAR) is in the responsibility of the end-products manufacturer, as well as the permissive change that can be carried out with the help of the customer's own Telecommunication Certification Body as the grant holders agent. End Product Labeling MGM210P modules are labeled with their own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

"Contains Transmitter Module FCC ID: QOQGM210P"

Or

"Contains FCC ID: QOQGM210P"

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. As long as all conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. silabs.com | Building a more connected world. Rev. 0.5.1 | 38 MGM210P Mighty Gecko Module Data Sheet Certifications Class B Device Notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio/TV technician for help silabs.com | Building a more connected world. Rev. 0.5.1 | 39 MGM210P Mighty Gecko Module Data Sheet Certifications 11.4 ISED Canada ISED This radio transmitter (IC: 5123A-GM210P) has been approved by Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada) to operate with the embedded antenna and with the antenna type(s) listed in 11.1 Qualified Anten-

nas, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device. This device complies with ISEDs license-exempt RSS standards. Operation is subject to the following two conditions:

1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device RF Exposure Statement Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. The module meets the given requirements when the minimum separation distance to human body is as indicated in Table 11.2. RF exposure or SAR evaluation is not required when the separation distances from the human body are equal or above 15 mm for the MGM210P22A and 35 mm for the MGM210P32A in the case of Zigbee, and respectively 20 mm and 40 mm in the case of Bluetooth Low Energy. These distances are reported for convenience also in Table 11.2. If the separation distance is less than stated above the OEM integrator is responsible for evaluating the SAR. OEM Responsibilities to comply with IC Regulations The module has been certified for integration into products only by OEM integrators under the following conditions:

The antenna must be installed such that a minimum separation distance as stated above is maintained between the radiator (anten-

na) and all persons at all times. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. Important Note: In the event that these conditions cannot be met, the final product will have to undergo additional testing to evaluate the RF exposure in order for the ISED authorization to remain valid, and a permissive change will have to be applied with the help of the customer's own Telecommunication Certification Body typically acting as the certificate holders agent. End Product Labeling The MGM210P module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

Contains Transmitter Module IC: 5123A-GM210P or Contains IC: 5123A-GM210P The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. As long as all the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still respon-

sible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). CAN ICES-003 (B) This Class B digital apparatus complies with Canadian ICES-003. silabs.com | Building a more connected world. Rev. 0.5.1 | 40 MGM210P Mighty Gecko Module Data Sheet Certifications ISEDC (Franais) Le prsent metteur radio (IC: 5123A-GM210P) a t approuv par Innovation, Sciences et Dveloppement conomique Canada pour fonctionner avec les types d'antenne numrs au chapitre 11.1 et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est suprieur au gain maximal indiqu pour tout type figurant sur la liste, sont strictement interdits pour l'exploitation de l'metteur. Ce composant est conforme aux normes RSS, exonres de licence d'ISED. Son mode de fonctionnement est soumis aux deux condi-

tions suivantes:

1. Ce composant ne doit pas gnrer dinterfrences. 2. Ce composant doit pouvoir tre soumis tout type de perturbation y compris celle pouvant nuire son bon fonctionnement. Dclaration d'exposition RF L'exception tire des limites courantes d'valuation SAR est donne dans le document RSS-102 Issue 5. Les modles MGM210P respectent les exigences dexemption prvues lorsque la distance de sparation minimale entre le(s) an-

tenne(s) et le corps humain est conforme aux valeurs indiques dans le . La dclaration dexposition RF ou l'valuation DAS n'est pas ncessaire lorsque la distance de sparation est identique ou suprieure celle indique ci-dessus. Si la distance de sparation est infrieure celle mentionnes plus haut, il incombe l'intgrateur OEM de procd une valuation DAS. La dclaration dexposition RF ou l'valuation SAR n'est pas ncessaire lorsque la distance de sparation est identique ou suprieure celle indique ci-dessus. Si la distance de sparation est infrieure celle mentionnes plus haut, il incombe l'intgrateur OEM de procd une valuation SAR. Responsabilits des OEM pour une mise en conformit avec le Rglement du Circuit Intgr Le module a t approuv pour l'intgration dans des produits finaux exclusivement raliss par des OEM sous les conditions sui-

vantes:

L'antenne doit tre installe de sorte qu'une distance de sparation minimale indique ci-dessus soit maintenue entre le radiateur

(antenne) et toutes les personnes avoisinante, ce tout moment. Le module metteur ne doit pas tre localis ou fonctionner avec une autre antenne ou un autre transmetteur que celle indique plus haut. Tant que les deux conditions ci-dessus sont respectes, il nest pas ncessaire de tester ce transmetteur de faon plus pousse. Ce-

pendant, il incombe lintgrateur OEM de sassurer de la bonne conformit du produit fini avec les autres normes auxquelles il pour-

rait tre soumis de fait de lutilisation de ce module (par exemple, les missions des priphriques numriques, les exigences de p-

riphriques PC, etc.). Remarque Importante:Dans le cas o ces conditions ne peuvent tre satisfaites (pour certaines configurations ou co-implantation avec un autre metteur), l'autorisation ISED n'est plus considre comme valide et le numro didentification ID IC ne peut pas tre appos sur le produit final. Dans ces circonstances, l'intgrateur OEM sera responsable de la rvaluation du produit final (y compris le transmetteur) et de l'obtention d'une autorisation ISED distincte. tiquetage des produits finis Les modules MGM210P sont tiquets avec leur propre ID IC. Si l'ID IC n'est pas visible lorsque le module est intgr au sein d'un autre produit, cet autre produit dans lequel le module est install devra porter une tiquette faisant apparaitre les rfrence du module intgr. Dans un tel cas, sur le produit final doit se trouver une tiquette aisment lisible sur laquelle figurent les informations suivantes:

Contient le module transmetteur: 5123A-GM210P or Contient le circuit: 5123A-GM210P L'intgrateur OEM doit tre conscient quil ne doit pas fournir, dans le manuel dutilisation, d'informations relatives la faon d'installer ou de denlever ce module RF ainsi que sur la procdure suivre pour modifier les paramtres lis la radio. silabs.com | Building a more connected world. Rev. 0.5.1 | 41 MGM210P Mighty Gecko Module Data Sheet Certifications 11.5 Proximity to Human Body When using the module in an application where the radio is located close to the human body, the human RF exposure must be evalu-

ated. FCC, ISED, and CE all have different standards for evaluating the RF exposure, and because of this, each standard requires a different minimum separation distance between the module and human body. Certification of MGM210P allows for the minimum sepa-

ration distances detailed in the table below in portable use cases (less than 20 cm from human body). The module is approved for the mobile use case (more than 20 cm) without any need for RF exposure evaluation. Table 11.2. Minimum Separation Distances for SAR Evaluation Exemption Certification MGM210P22A MGM210P32A FCC ISED CE Bluetooth: 5.3 mm, Zigbee: 5 mm Bluetooth: 44.03 mm, Zigbee: 36.17 mm Bluetooth: 20 mm, Zigbee: 15 mm Bluetooth: 40 mm, Zigbee: 35 mm The RF exposure must always be evaluated using the end-product when transmitting with power levels high-

er than 20 mW (13 dBm). For FCC and ISED, using the module in end-products where the separation distance from the human body is smaller than that listed above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a Class 2 Permissive Change or Change of ID to be applied to the existing FCC/ISED approvals of the module. For CE, RF exposure must be evaluated using the end-

product in all cases when transmitting a more than the power level indicated in the table. Note: Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a reduced range is to be expected. silabs.com | Building a more connected world. Rev. 0.5.1 | 42 MGM210P Mighty Gecko Module Data Sheet Revision History 12. Revision History Revision 0.5.1 September, 2019 Update wording for FCC and ISED certifications section Updated Design Guidelines Revision 0.5 September, 2019 Initial Production Release. Updated Features with latest values, certifications, security, etc Updated Ordering Information with OPNs for Reel packaging Added System Overview Updated Electrical Specifications with latest values Added Reference Diagrams Updated wording and figures in Design Guidelines Updated figures in Package Specifications and added Marking section Added Tape and Reel dimensions Updated Certifications information General wording, spelling, and grammar fixes. Revision 0.1 April, 2019 Initial Release. silabs.com | Building a more connected world. Rev. 0.5.1 | 43 Simplicity StudioOne-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux!IoT Portfoliowww.silabs.com/IoTSW/HWwww.silabs.com/simplicityQualitywww.silabs.com/qualitySupport and Communitycommunity.silabs.comhttp://www.silabs.comSilicon Laboratories Inc.400 West Cesar ChavezAustin, TX 78701USADisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications.Trademark InformationSilicon Laboratories Inc. , Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, Bluegiga, Bluegiga Logo, ClockBuilder, CMEMS, DSPLL, EFM, EFM32, EFR, Ember, Energy Micro, Energy Micro logo and combinations thereof, "the worlds most energy friendly microcontrollers", Ember, EZLink, EZRadio, EZRadioPRO, Gecko, Gecko OS, Gecko OS Studio, ISOmodem, Precision32, ProSLIC, Simplicity Studio, SiPHY, Telegesis, the Telegesis Logo, USBXpress , Zentri, the Zentri logo and Zentri DMS, Z-Wave, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders.

 

 

Photos of xGM210P Figure 1: Bottom (rear) view of all variants Left column: low-power variants / Right column:

high-power variants / Top row: BGMx / Bottom row: MGMx Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 1 of 5 Figure 2: Top (front) view of all variants Left column: low-power variants / Right column:

high-power variants / Top row: MGMx internal / Mid row: BGMx / Bottom row: MGMx Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 2 of 5 Figure 3: Detail of MGM210P32A Top (front) internal view Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 3 of 5 Figure 4: Detail of MGM210P32A Top (front) external view Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 4 of 5 Figure 5: Detail of MGM210P32A Bottom (rear) external view Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 5 of 5

 

 

Photos of xGM210P Figure 1: Bottom (rear) view of all variants Left column: low-power variants / Right column:

high-power variants / Top row: BGMx / Bottom row: MGMx Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 1 of 5 Figure 2: Top (front) view of all variants Left column: low-power variants / Right column:

high-power variants / Top row: MGMx internal / Mid row: BGMx / Bottom row: MGMx Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 2 of 5 Figure 3: Detail of MGM210P32A Top (front) internal view Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 3 of 5 Figure 4: Detail of MGM210P32A Top (front) external view Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 4 of 5 Figure 5: Detail of MGM210P32A Bottom (rear) external view Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com Page 5 of 5

 

 

a5.0mm eo1 a) EMI SHIELD END VIEW 57mm

(oa mm SILICON LABS soit wae 117mm ican teoamm 3.0mm (0am) 42mm Shield width

{sox 410.7 mmm

(01mm) 2 ES ames 0.65 min (so mm) Shield height as 1.2mm (ee mm me PCB THICKNESS 0.8 mm (2 08) 2.0 mm eo. mf 2.0 mim (2105)

 

 

xGM210P / Shield Markings BGM210P 2 Silicon Labs Confidential MGM210P 3 Silicon Labs Confidential

 

 

SILICON LABS Agency Authorization Letter Attn:

Re:

To Whom it May Concern / Application Examiner / Review Engineer / Officer in Charge Authority to Act as Agent for FCC application Dear Madam or Sir, We, Silicon Laboratories Finland Oy, a corporation validly organized and existing under the laws of Finland, having its principal place of business at Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland hereby authorize the following person:

Andrea Hsia Supervisor of Bureau Veritas Consumer Products Services (H.K.) Ltd. Taoyuan Branch (BV CPS Taoyuan) of Taiwan to act on our behalf as our agent in all manners relating to the Federal Communication Commission (FCC) application for equipment authorization in connection with our multiprotocol Bluetooth Low Energy and Zigbee wireless radio modules with model names BGM21OPx and MGM21OPx having FCC ID: QOQGM21OP Our authorization extends to any communication needed with the TCB and FCC, and includes signing of all documents relating to this matters. Any and all acts carried out by Andrea Hsia, Supervisor of BV CPS Taoyuan, on our behalf, within the scope of the powers granted herein, shall have the same effect as acts of our own. Should there be any query regarding this authorization, please do not hesitate to contact the undersigned. Thank you for your attention to this matter. Place and date of issue (of this letter):

Espoo, 20 August Senior Contact: Pasi Rahikkala Job Title: Staff Hardware Engineer, loT Radio Modules Email: pasi.rahikkala@silabs.com Silicon Laboratories Finland Qy Alberga Business Park, Bertel ]ungin aukio 3 Fl-02600 Espoo, Finland Phone: 358 9 435 5060 www.silabscom

 

 

SILICON LABS Cover Letter for Confidentiality Federal Communications Commission

(Authorization and Evaluation Division) 7435 Oakland Mills Road Columbia, MD 21046 Attn:

Re:

To Whom it May Concern I Application Examiner! Review Engineer / Officer in Charge Permanent Confidentiality Request for FCC ID: QOQGM21OP Dear Madam or Sir, We, Silicon Laboratories Finland Oy, a corporation validly organized and existing under the laws of Finland, having its principal place of business at Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland, pursuant to Sections 0.457 and 0.459 of the Commissions Rules, hereby request the permanent confidential treatment of information as outlined below:

Schematics, Block Diagram, and Operational Description The above design material relates to the FCC application for equipment authorization in connection with our multiprotocol Bluetooth Low Energy and Zigbee wireless radio modules with model names BGM21OPx and MGM21OPx having FCC ID: 000GM21OP The above design material contains trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to our business and provide unjustified benefits to our competitors. We understand that pursuant to Rule 0.457, disclosure of the application and all accompanying documentation shall not be made before the date of the related Grant release. Should there be any query regarding this authorization, please do not hesitate to contact the undersigned. Thank you for your attention to this matter. Place and date of issue (of this letter):

Espoo, August 15, 2019 Senior Contact: Pasi Rahikkala Job Title: Staff Hardware Engineer, loT Modules Email: pasi.rahikkala@silabs.com Silicon Laboratories Finland Oy Alberga Business Park Bertel Jungin aukio 3 FI-02600 Espoo, Finland Phone: +358 9 435 5060 www.silabs.com

 

 

SILICON LABS Silicon Laboratories Finland Oy Alberga Business Park, Bertel Jungin aukic 3, FI-02600 Espoo, Finland TEL: +358 9 435 5060 Federal Communications Commission

(Authorization and Evaluation Division) 7435 Oakland Mills Road Columbia, MD 21046 SUBJECT: Attestation of Model Difference FCC: QOQGM21OP Models: BGM2JOP22A, BGM21OP32A, MGM2JOP22A, MGM2JOP32A We, Silicon Laboratories Finland Oy, hereby dectare that the famity of our Bluetooth Low Energy and ZigBee wireless radio modules, includes 4 modeLs with names as listed above. These modets are electricalLy and mechanically identical. The differences between models are described in the table below:

Model Specification

,

. Antenna Type Hardware Note MGM21OP22A Low-Power, MGM21OP32A High-Power,

. Zigbee and/or BLE

. Zigbee and/or BLE BGM21OP22A BGM21OP32A Low-Power, BLE High-Power, BLE 1. On-board ceramic chip antenna with 1 .S6dBi of gain 2. Reference external dipole antenna with the theoretical gain of 2.l4dBi which can be optionally connected to modules RE pin The wireless chipset (System-on-Chip, S0C) is the same in all these modules, and it integrates a PA subsystem and a RF switch to route the RF signal to two separate RF ports, one further routed to the modules integral on-board ceramic chip antenna, and the other routed to a modules RE pin for an optional external antenna. Both antennas can be used for a switched diversity implementation with Zigbee-only. There cannot be simultaneous transmission out of the two RE ports, and packets are transmitted only using one protocol at a time. lOdBm 2OdBm RE maxTX power Differences: The MGM21 OP modules are for Zigbee + BLE, while the BGM21 OP modules are for BLE only. The Zigbee is disabled in the BGM21 OP by a hardcoded software configuration in the SoC. The 22 and 32 in the model names indicate the power variant, 22 referring to the low-power variants which are allowed to transmit at up to 1 OdBm, based on a purely hardcoded software limitation in the SoC, whereas the 32 indicates the high-power variants for up to 2OdBm. Hardware-wise, the two power variants only differ in their 500 matching networks which are optimized for the related max allowed output power. lOdBm 2OdBm Should you have any question, feeL free to contact the undersigned directLy. Sincerely yours, Senior Contact: Pasi Rahikkala Job Title: Staff Hardware Engineer, loT Wireless Radio Modules E-mail: pasi.rahikkata@sitabs.com Ptace and date: Espoo, September 11, 2019

 

 

FCC ID: QOQGM210P Modular Approval Request Letter Bureau Veritas Consumer Products Services (H.K.) Ltd., Taoyuan Branch September 3, 2019 Dear Application Examiner, Silicon Laboratories Finland Oy., Bluetooth Low Energy and ZigBee wireless radio modules, FCC ID: QOQGM210P would like to have your authorization as a modular approval specific to the mobile RF exposure condition. The requirements of KDB996369 have been met and shown on the following statements. 1. The modular transmitter must have its own RF shielding. The radio portion of this module has been shielded, please see exhibition External Photo. 2. The modular transmitter must have buffered modulation/data inputs. The EUT has buffered data inputs, it is integrated in chip MGM210P22A, MGM210P32A, BGM210P22A, BGM210P32A. 3. The modular transmitter must have its own power supply regulation. The part number of this regulator is MGM210P22A, MGM210P32A, BGM210P22A, BGM210P32A. 4. The modular transmitter must comply with the antenna requirements of section 15.203 and 15.204(C). The EUT meets the FCC antenna requirements. The spurious emission, unique antenna connector and photo of antennas are shown in the test report. 5. The modular transmitter must be tested in a stand-alone configuration The EUT was tested in a stand-alone configuration via a USB extender. Please see section Photographs of Test Configuration in the test report, the EUT was plugged in this extender. 6. The modular transmitter must be labeled with its own FCC ID number. Please see exhibition Label Sample for the FCC ID of this module. And also in the exhibition Users Manual, there are instructions give to the OEM on how to label the end product. Report No.: RF190408C21, RF190408C21-1 FCC ID: QOQGM210P 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. The EUT is compliant with all applicable FCC rules. Detail instructions for maintaining compliance are given in the Users Manual. 8. The modular transmitter must comply with any applicable RF exposure requirements. The EUT is compliant with all applicable RF exposure requirements. RF Exposure is addressed in the RF exposure exhibition. Please contact me if you have any further questions. Thanks for your attention. Best Regards, ________________ Andrea Hsia Supervisor Bureau Veritas Consumer Products Services (H.K.) Ltd., Hsinchu Branch Report No.: RF190408C21, RF190408C21-1