FCC ID: SRQ-ZTEMG2618 GSM Wireless Data Terminal

Welink Your Smart Hardware Development Guide of Module Product Version 1.02015-03-18 ZTE MG2618 Hardware Development Guide of Module Product ZTE MG2618 Legal Information By accepting this certain document of ZTE CORPORATIN you agree to the following terms. If you do not agree to the following terms, please notice that you are not allowed to use this document. Copyright 2009 ZTE CORPORATION. Any rights not expressly granted herein are reserved. This document contains proprietary information of ZTE CORPORATION. Any reproduction, transfer, distribution, use or disclosure of this document or any portion of this document, in any form by any means, without the prior written consent of ZTE CORPORATION is prohibited. and are registered trademarks of ZTE CORPORATION. ZTEs company name, logo and product names referenced herein are either trademarks or registered trademarks of ZTE CORPORATION. Other product and company names mentioned herein may be trademarks or trade names of their respective owners. Without the prior written consent of ZTE CORPORATION or the third party owner thereof, anyones access to this document should not be construed as granting, by implication, estopped or otherwise, any license or right to use any marks appearing in the document. The design of this product complies with requirements of environmental protection and personal security. This product shall be stored, used or discarded in accordance with product manual, relevant contract or laws and regulations in relevant country (countries). This document is provided as is and as available. Information contained in this document is subject to continuous update without further notice due to improvement and update of ZTE CORPORATIONs products and technologies. All Rights reserved, No Spreading abroad without Permission of ZTE I Hardware Development Guide of Module Product ZTE MG2618 Revision History Version V1.0 Date 2015-03-18 1st released Description All Rights reserved, No Spreading abroad without Permission of ZTE II Hardware Development Guide of Module Product ZTE MG2618 Contents 1 2 PRODUCT OVERVIEW ............................................................................................................. 1 1.1 TECHNICAL PARAMETERS ............................................................................................ 1 1.2 APPLICATION FRAME ..................................................................................................... 2 1.3 ABBREVIATIONS.............................................................................................................. 3 INTERFACES ............................................................................................................................... 6 2.1 PIN DESCRIPTION ............................................................................................................ 6 2.2 ANTENNA INTERFACE ................................................................................................... 8 2.3 RF PERFORMANCE OF ANTENNA INTERFACE ......................................................... 8 3 ELECTRIC FEATURES ........................................................................................................... 10 INTERFACE POWER LEVEL ......................................................................................... 10 3.1 POWER CONSUMPTION ................................................................................................ 10 3.2 3.3 POWER-ON/OFF TIMING SEQUENCE ......................................................................... 11 3.4 RELIABILITY TEST ........................................................................................................ 11 3.5 ESD CHARACTERISTIC ................................................................................................. 12 3.6 GPS PERFORMANCE ...................................................................................................... 12 4 REFERENCE CIRCUIT OF MODULE INTERFACES ....................................................... 13 4.1 RESET AND POWER DESIGNING ................................................................................ 13 4.2 UART INTERFACE .......................................................................................................... 15 4.2.1 DUPLEX UART INTERFACE .............................................................................. 17 4.3 SIM CARD INTERFACE .................................................................................................. 18 4.4 AUDIO INTERFACE ........................................................................................................ 19 4.5 LED INDICATOR INTERFACE ...................................................................................... 22 4.6 GPS INTERFACE ............................................................................................................. 22 4.7 CONNECTION METHOD OF GPS ACTIVE ANTENNA.............................................. 23 5 MECHANIC FEATURES.......................................................................................................... 24 5.1 APPEARANCE DIAGRAM ............................................................................................. 24 5.2 ASSEMBLY DIAGRAM .................................................................................................. 25 PCB PACKAGE DIMENSIONS ....................................................................................... 26 5.3 All Rights reserved, No Spreading abroad without Permission of ZTE III 6 Hardware Development Guide of Module Product ZTE MG2618 SMT PROCESS AND BAKING GUIDE .................................................................................. 28 6.1 STORAGE REQUIREMENTS.......................................................................................... 28 6.2 RECOMMENDED PAD DESIGN .................................................................................... 28 6.3 REQUIREMENTS OF MODULES POSITION ON MAIN BOARD ............................. 30 6.4 MODULE PLANENESS STANDARD ............................................................................ 31 PROCESS ROUTING SELECTION ................................................................................. 31 6.5 6.5.1 SOLDER PASTE SELECTION.............................................................................. 31 6.5.2 DESIGN OF MODULE PADS STEEL MESH OPENING ON MAIN BOARD . 31 6.5.3 MODULE BOARDS SMT PROCESS .................................................................. 32 6.5.4 MODULE SOLDERING REFLOW CURVE ........................................................ 33 6.5.5 REFLOW METHOD .............................................................................................. 34 6.5.6 MAINTENANCE OF DEFECTS ........................................................................... 34 6.6 MODULES BAKING REQUIREMENTS ....................................................................... 35 6.6.1 MODULES BAKING ENVIRONMENT .............................................................. 35 6.6.2 BAKING DEVICE AND OPERATION PROCEDURE ........................................ 35 6.6.3 MODULE BAKING CONDITIONS ...................................................................... 35 7 SAFETY INFORMATION ........................................................................................................ 36 All Rights reserved, No Spreading abroad without Permission of ZTE IV Hardware Development Guide of Module Product ZTE MG2618 Figures Figure 11 Application Frame ...................................................................................................................... 3 Figure 31 Power-on/off timing sequence .................................................................................................. 11 Figure 41 Reference Circuit of Power Supply & Reset Interface ............................................................. 14 Figure 42 Reference Circuit of Power Supply Interface ........................................................................... 14 Figure 43 Reference Circuit 1 of UART Interface ................................................................................... 16 Figure 44 Reference Circuit 2 of UART Interface ................................................................................... 16 Figure 45 UART Connection between DCEDTE ................................................................................. 17 Figure 46 Reference Circuit of SIM Card Interface ................................................................................. 19 Figure 47 MIC reference circuit ............................................................................................................... 20 Figure 48 SPK reference circuit ............................................................................................................... 21 Figure 49 Reference Circuit of Status Indicator ....................................................................................... 22 Figure 410 Reference Circuit of GPS Interface ........................................................................................ 23 Figure 411 Active GPS antenna circuit reference design principle diagram ............................................ 23 Figure 51 Top & bottom & side view of module ..................................................................................... 24 Figure 52 The assembly diagram of module ............................................................................................ 25 Figure 53 The PCB package dimensions of module (Top View) ............................................................. 26 Figure 54 Test point of module ................................................................................................................ 27 Figure 61 Modules dimensions ............................................................................................................... 29 Figure 62 Recommended PAD dimensions on corresponding main board .............................................. 29 Figure 63 Module boards PAD mounted on main board......................................................................... 30 Figure 64 Green oil and white oil at modules position on main board .................................................... 30 Figure 65 Module Boards Steel Mesh Diagram ...................................................................................... 32 Figure 66 Material Module Pallet ............................................................................................................. 33 Figure 67 Module Furnace Temperature Curve Diagram ......................................................................... 34 All Rights reserved, No Spreading abroad without Permission of ZTE V Hardware Development Guide of Module Product ZTE MG2618 Tables Table 11 The function information of module ............................................................................................ 1 Table 12 Major Technical Parameters ........................................................................................................ 1 Table 13 Abbreviation List ......................................................................................................................... 3 Table 21 PIN Interface Definition .............................................................................................................. 6 Table 22 RF Performance of antenna interface .......................................................................................... 8 Table 31 Power Level Range of Digital Signal ........................................................................................ 10 Table 32 Power Consumption of Module (Typical) ................................................................................. 10 Table 33 Module testing environment of temperature .............................................................................. 11 Table 34 ESD Endurance.......................................................................................................................... 12 Table 35 GPS Performance ...................................................................................................................... 12 Table 41 Working Condition .................................................................................................................... 13 Table 42 UART Interface Definition ........................................................................................................ 17 Table 43 Definition of SIM Card Signal .................................................................................................. 18 Table 44 Audio interface definition .......................................................................................................... 19 Table 45 Definition of LED Indicator Status ............................................................................................ 22 Table 61 Baking parameters ..................................................................................................................... 28 Table 62 Recommended PAD dimensions of main board ........................................................................ 30 Table 63 LCC module PADs steel mesh opening ................................................................................... 31 All Rights reserved, No Spreading abroad without Permission of ZTE VI Hardware Development Guide of Module Product ZTE MG2618 R&TTE Regulation:

In all cases assessment of the final product must be mass against the Essential requirements of the R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3 requirements. Hereby, ZTE CORPORATION declares that this product is in complies with the essential requirements of Article 3 of the R&TTE 1999/5/EC Directive. All Rights reserved, No Spreading abroad without Permission of ZTE VII Hardware Development Guide of Module Product ZTE MG2618 Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. End Product Labeling The final end product must be labeled in a visible area with the following: Contains FCC ID:

SRQ-ZTEMG2618. The grantee's FCC ID can be used only when all FCC compliance requirements are met.The FCC part15.19 staement below has also be available on the label:The device complies with part 15 of FCC rules,Operation is sugject to the following two conditions:(1)This device may not cause harmful interference,and(2)this device must accept any interference received,including interference that may cause undesired operation,to comply With FCC regulations limiting both maximum RF output power and human exposure to RF radiation. A user maual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure Guidelines,The end product with an module may also need to pass the FCC part15 unintentional emission testing requirements and be properly authorized for FCC part15.Note:If thie module is intended for use in a portable device,you are responsinble For separate approval to satify the SAR requirements of FCC part2.1093 This device is intended only for OEM integrators under the following conditions:

1)The antenna must be installed such that 20 cm is maintained between the antenna and users, and the maximum antenna gain allowed for use with this device is 3 dBi. 2)The transmitter module may not be co-located with any other transmitter or antenna. All Rights reserved, No Spreading abroad without Permission of ZTE VIII Hardware Development Guide of Module Product ZTE MG2618 1 Product Overview MG2618 is a GSM/GPRS wireless industrial module, and it contains three variants V2A, V2B and V2C. Customer can choose the dedicated type based on the wireless network configuration. The following table shows the entire configuration of MG2618 series. Table 11 The function information of module SN 1 2 3 PID V2A V2B V2C BAND GSM 900/1800 GSM 850/900/1800/1900 GSM 850/900/1800/1900 GPS Not support Not support Support MG2618 is a wireless Internet module with 49 pin LCC interface. It is widely applied to but not limited to the various products and equipment such as laptops, vehicle-mounted terminals, and electric devices, by providing data services, transceiver Email, web browsing, high speed download and so on. In places with GSM network coverage, you can send and receive SMS, use high-speed data access service, voice calls and other functions under the mobile environment. The module provides users with a high degree of freedom, convenient solution to realize mobile office dreams. This section describes the basic functions and logic diagram of the module. 1.1 Technical Parameters Table 12 Major Technical Parameters Items Parameters Basic Features Bands Dimensions Weight Normal Working Temperature Extreme Working Temperature Storage Temperature Humidity Performance Power Supply GSM850/EGSM900/DCS1800/PCS1900(Optional) 22.00mm*20.00mm*2.0mm About 1.9g

-35~75C

-40~85C

-50~90C 0% ~ 95%

The range of voltage supply is 3.4V-4.2V, typical value: 3.8V Max. Transmitter Power 332dBm @ GSM850/GSM900 All Rights reserved, No Spreading abroad without Permission of ZTE 1 Hardware Development Guide of Module Product ZTE MG2618 Items Parameters Receiving sensitivity Interface Encapsulation type Antenna interface UART Interface SIM card Interface Data Service Service GPRS Mobile station GPRS class Max. DL Data rate Max. UL Data rate Protocols SMS AT Commands 302dBm @ DCS1800/PCS1900

-108dBm @ GSM850/GSM900

-106dBm @ DCS1800/PCS1900 49 Pin LCC LCC pad AT commands, data transmission 1.8V/3V GPRS, Class A or B, Class 10 or 12 Class C Class 12 85.6Kbps 42.8Kbps Embedded TCP/IP and UDP/IP protocol stack TCP Server, UDP Server Embedded FTP Support TEXT/PDU mode Point-to-point MO/MT SMS Cell Broadcast Static AT commands set Extended AT commands set 1.2 Application Frame The application frame of module is as follows:

All Rights reserved, No Spreading abroad without Permission of ZTE 2 Hardware Development Guide of Module Product ZTE MG2618 Main Chip GPS Chip Note: Only the modules which support GPS function have the function of GPS as shown in Blue Block Diagram above. Figure 11 Application Frame 1.3 Abbreviations A ADC AFC AGC ARFCN ARP ASIC B BER BTS C CDMA CDG Table 13 Abbreviation List Analog-Digital Converter Automatic Frequency Control Automatic Gain Control Absolute Radio Frequency Channel Number Antenna Reference Point Application Specific Integrated Circuit Bit Error Rate Base Transceiver Station Code Division Multiple Access CDMA Development Group CDMA All Rights reserved, No Spreading abroad without Permission of ZTE 3 Hardware Development Guide of Module Product ZTE MG2618 Carrier Noise Ratio Circuit Switched Data Central Processing Unit Digital-to-Analog Converter Data Communication Equipment Digital Signal Processor Data Terminal Equipment Dual Tone Multi-Frequency Data Terminal Ready Enhanced Full Rate Enhanced GSM Electromagnetic Compatibility Electro Magnetic Interference Electronic Static Discharge European Telecommunication Standard Frequency Division Multiple Access Full Rate GSM General Packet Radio Service Global Standard for Mobile Communications Half Rate Integrated Circuit International Mobile Equipment Identity International Standards Organization International Telecommunications Union Liquid Crystal Display Light Emitting Diode Machine Control Unit Man Machine Interface Mobile Station Printed Circuit Board Power Control Level Personal Communication System

/

CNR CSD CPU D DAC DCE DSP DTE DTMF DTR E EFR EGSM EMC EMI ESD ETS F FDMA FR G GPRS GSM H HR I IC IMEI ISO ITU L LCD LED M MCU MMI MS P PCB PCL PCS All Rights reserved, No Spreading abroad without Permission of ZTE 4 Hardware Development Guide of Module Product ZTE MG2618 Protocol Data Unit Point-to-point protocol Random Access Memory Radio Frequency Read-only Memory Real Time Clock Subscriber Identification Module Short Message Service Static Random Access Memory Terminal adapter Time Division Multiple Access Terminal Equipment also referred it as DTE Time To First Fix Universal asynchronous receiver-transmitter User Identifier Management Universal Serial Bus DTE

/

PDU PPP R RAM RF ROM RTC S SIM SMS SRAM T TA TDMA TE TTFF U UART UIM USB All Rights reserved, No Spreading abroad without Permission of ZTE 5 Hardware Development Guide of Module Product ZTE MG2618 2 Interfaces The MG2618 module connects externally through a 49 PIN stamp-hole interface. 2.1 PIN Description PIN Type Signal Definition I/O Description Remark Table 21 PIN Interface Definition 1 2 3 4 5 6 7 8 9 GND GND POWER RSSI_LED POWER ON/OFF GND GND AUDIO HSED BIAS AUDIO MIC1_P AUDIO MIC1_N AUDIO MIC2_P AUDIO SPK2_P 10 AUDIO SPK1_P 11 12 13 14 15 16 17 AUDIO SPK1_N GND POWER GND

/RESET POWER VREG_MSME1 GND ANT GND GND RF_ANT GND

--

O I

--

O I I I O O O

--

I O

--

--

Working status indicator Module power-on/off control

--

--

Active High Valid at low level; pull-up internally, more information please refer to 4.1

--

MIC bias Default is 1.9V Differential audio input channel 1, anode Differential audio input channel 1, cathode Single-end audio input channel 2 Single-end audio output channel 2 Differential audio output channel 1, anode Differential audio output channel 1, cathode

--

Resetting signal 2.8V output

--

I/O

--

GSM antenna interface

--

--

--

--

--

--

--

--

Active low Recommend to use this pin for pull-up when level matching

--

--

--

All Rights reserved, No Spreading abroad without Permission of ZTE 6 Hardware Development Guide of Module Product ZTE MG2618 PIN Type Signal Definition I/O Description Remark GND GND POWER VBAT GND GND VREG_SIM SIM_DATA I/O 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 SIM SIM SIM SIM UART UART UART UART NC GND UART UART UART UART NC GND GND ANT GND SIM_CLK SIM_RST

/RTS

/CTS TXD RXD NC GND DCD

/DSR RI

/DTR NC GND GND GPS_ANT GND 40 POWER VGPS_MAIN 41 42 43 44 ADC GND USB USB ADCIN GND USB_DP USB_DM

--

I

--

O O O O I O I

--

--

O O O I

--

--

--

I

--

I I

--

--

--

--

--

GSM Power supply 3.4V~4.2V

--

Power supply for SIM card. Data signal of SIM card Clock signal of SIM card. Reset signal of SIM card. Request to send Clear to send Transmitting data to serial port Receiving data from serial port

--

--

Carrier detection Data is ready Ring tone Data terminal is ready

--

--

--

GPS antenna

--

GPS power supply ADC voltage detection

--

USB differential data (+) USB differential data (-)

--

1.8/3V

--

--

--

2.8Vactive low 2.8Vactive low 2.8Vactive low 2.8Vactive low

--

--

2.8Vactive low 2.8Vactive low 2.8Vactive low 2.8Vactive low

--

--

--

Module without GPS function, this pin should not be connected.

--

Voltage range: 2.8V~4.2V, recommended 3.3V Module without GPS function, this pin should not be connected.

--

Using USB and RI to download firmware, calibration and measurement. Not support data transmitting yet. All Rights reserved, No Spreading abroad without Permission of ZTE 7 Hardware Development Guide of Module Product ZTE MG2618 PIN Type Signal Definition I/O Description Remark 45 46 47 48 49 I2C I2C GND BT GND I2C_SCL I2C_SDA GND BT_ANT GND

--

--

--

I/O

--

I2C serial clock I2C serial data

--

Bluetooth antenna interface

--

2.8V, Not supported currently 2.8V, Not supported currently

--

Not supported currently

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2.2 Antenna Interface Regarding the antenna of module, proper measures should be taken to reduce the access loss of effective bands, and good shielding should be established between external antenna and RF connector. Besides, external RF cables should be kept far away from all interference sources such as high-speed digital signal or switch power supply. According to mobile station standard, stationary wave ratio (SWR) of antenna should be between1.1 to 1.5, and input impedance is 50 ohm. Different environments may have different requirements on the antennas gain. Generally, the larger in-band gain and smaller out-band gain, the better performance the antenna has. Isolation among ports must more than 30dB when multi-ports antenna is used. For example, between two different polarized ports on dual-polarized antenna, or two different frequency ports on dual-frequency antenna, or among four ports on dual-polarized dual-frequency antenna, the isolation should be more than 30dB. RF_ANT, GPS_ANT (PIN16, PIN38) are respectively used as the input pin for GSM and GPS antenna. when using these pin pads as the antenna feed pins, customers need pay attention to the following:

(1)The feed connected to PIN38 or PIN 16 is 50ohm micro-strip or strip line. To approach the module, put shape or Inverted-F shape matching network for later debugging.

(2)The RF wires must be kept away from the GND, and generally the distance should be 3 times of the width of RF wires.

(3)Its forbidden to put some interference sources such as DC to DC, WIFI module, SIM card around RF wires or RF port. 2.3 RF Performance of antenna interface The RF performance of antenna interface is shown in Table 2-2:

Table 22 RF Performance of antenna interface All Rights reserved, No Spreading abroad without Permission of ZTE 8 Hardware Development Guide of Module Product ZTE MG2618 Uplink Frequency Downlink Frequency Band

(MS->BTS) Band

(BTS->MS) Max. Transmitter Power(dBm) 332 dBm 824MHz-849MHz 880MHz-915MHz 332 dBm 1710MHz-1785MHz 1805MHz-1880MHz 302 dBm 1850MHz-1910MHz 1930MHz-1990MHz 302 dBm 869MHz-894MHz 925MHz-960MHz Receiving sensitivity(T ypical)

-108dBm

-108dBm

-106dBm

-106dBm Band GSM850 EGSM900 DCS1800 PCS1900 All Rights reserved, No Spreading abroad without Permission of ZTE 9 Hardware Development Guide of Module Product ZTE MG2618 3 Electric Features This chapter mainly describes the modules electrical characteristics, including the level, power consumption, reliability of modules interfaces. 3.1 Interface Power Level Table 31 Power Level Range of Digital Signal Interface High/Low level Min. Max. Remark 0 2.8V 0 UART SIM Typ. 0 0 0.7* UART1 2.8V 0.3* UART1 1.1*UART1 0 0 0.3*VREG_SIM 1.8V/3.0V 0.7*VREG_SIM VREG_SIM 1.1*VREG_SIM The high power level of UART1 is 2.8V, VREG_SIM is 1.8V/3V( automatic adaptation). 3.2 Power Consumption Test Items Table 32 Power Consumption of Module (Typical) Test condition(Test duration 1min) Test result GSM GPS Max. Min. Average Standby The kernel is running, but not working properly Standby/sleep current Working current Network lock current ON OFF ON OFF Standby Standby Sleep Sleep Turn on the module, GSP kernel is running, not sleep or work PGSM62PCL5 47.46 30.32 31.16 69.19 39.45 75.2 28.55 44.45 21.96 23.68 0.93 46.35 22.87 27.2 2.45 123.44 54.27 72.55 239.4 174.68 242.68 All Rights reserved, No Spreading abroad without Permission of ZTE Unit mA mA mA mA mA mA mA 10 Hardware Development Guide of Module Product ZTE MG2618

(Instrument Network, GPS sleep) PGSM62PCL10 PGSM62PCL19 DCS698PCL0 DCS698PCL5 DCS698PCL15 157.13 94.41 195.42 146.32 87.68 120.65 32.71 147.47 113.48 70.53 145.4 82.01 180.7 135.2 79.08 mA mA mA mA mA Note: As the GPS cant work independently, when the module sleep in the condition of GPS working, in fact , the module is in the state of part dormant, and the part related to GPS is still working. 3.3 Power-on/off timing sequence The timing sequence of module shows entire process of power-on/off. Figure 31 Power-on/off timing sequence 3.4 Reliability Test The reliability test of module includes the items as follows: High/low temperature operation, high/low temperature storage, thermal shock, alternating temperature humidity, etc. The test results must conform to the industrial requirements. Module testing environment of temperature is shown as the Table below. Table 33 Module testing environment of temperature All Rights reserved, No Spreading abroad without Permission of ZTE 11 Hardware Development Guide of Module Product ZTE MG2618 Parameter Working Condition Min Max Remark To Ta Ts Operation temperature Limited temperature Storage temperature

-35

-40

-50

+75

+85

+90 3.5 ESD Characteristic The measured ESD values of module at the normal temperature are shown as the following table. Table 34 ESD Endurance Interface Test program Test requirements Antenna Interface SIM Interface Air discharge Contact discharge Air discharge Contact discharge 8 kV 8 kV 8 kV 6 kV 3.6 GPS Performance Test Items CNR @130dBm Sensitivity(dBm) TTFF @-130 dBm(Sec.) Table 35 GPS Performance Working mode Typical

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Tracking Cold start Warm start Cold start Warm start Hot start 40

-162

-145.5

-159.5 34.1 32.7 0.8 Note: The test result belongs to the modules which support GPS function. All Rights reserved, No Spreading abroad without Permission of ZTE 12 Hardware Development Guide of Module Product ZTE MG2618 4 Reference Circuit of Module Interfaces The chapter provides the precautions and reference design on the interface circuit according to the modules functions. 4.1 Reset and Power Designing Power Designing VBAT is the power supply pin of module. See the modules required voltage characteristics in Table 4-1:

Table 41 Working Condition Vmin 3.4V Typical 3.8 V

< 3mA (average)

--

Vmax 4.2 V 2A(Depending on the condition of the network signal) Type Input Voltage Input Current Power-on The module is under power-off status after its normally connect to the power supply. To turn on the module, provide a low level voltage more than 2.5s to the ON/OFF PIN. The power-on time of module is related to module status, its usually required low level for more than 2.5S. Power-off To turn off the module, provide a 3s low level pulse to the ON/OFF PIN. Reset If the external reset function has to be used, provide a low level pulse lasting 100ms to the /RESET PIN to reset the module. After resetting, the module will enter power-off state, and you need to provide a low level voltage lasting 2.5s to the ON/OFF pin to power-on the module. When resetting the module, if the power level of ON/OFF pin in the state of low level, the module will restart automatically. Reference circuit of power supply and reset interface are shown as Figures below. Select appropriate parameters according to the actual selected power supply since VD1 is TVS tube, and select CJ2305 from Changjiang Electronics or DMP2305U-7 from DIODES since VT1 is MOS tube. Refer to figure 4-2 for the design of power circuit. Select MIC29302 and adjust the output voltage through All Rights reserved, No Spreading abroad without Permission of ZTE 13 Hardware Development Guide of Module Product ZTE MG2618 the adjustment of R5 and R6. Please refer to MIC29302s specification for detailed parameters design. Please note that the components in the figure are just for your reference. For details, please adjust according to the actual circuit. Figure 41 Reference Circuit of Power Supply & Reset Interface Figure 42 Reference Circuit of Power Supply Interface VREG_MSME1 All Rights reserved, No Spreading abroad without Permission of ZTE 14 Power supplyVD1TVSC1C222ufC3100ufVT1R115kPower supply for module VBATC40.1ufBuffer start circuitMCU_ON/OFFR24.7KMCU_RESET/RESETON/OFFR34.7KR52.2KR61KC60.1uFC8100uFC70.1uFR410KC510uFD1MIC29302GNDTAB/SHUTINOUTSENSEVoltage inputPower supply for module VBAT Hardware Development Guide of Module Product ZTE MG2618 The voltage output is available only when the module is on. The normal output voltage is 2.8V, and users should absorb the current from this pin as little as possible (less than 10mA). Generally, it is recommended to use this pin to pull up the chipset PIN as the requirements of level matching. Therefore, its not recommended to use this pin for other control purposes. Other Advice In order to make sure the data is saved safely, please do not cut off the power when the module is on. Its strongly recommended to use ON/OFF pin or AT command to turn off the module. 4.2 UART Interface The module provides an integrated full duplex UART interface. The typical baud rate is 115.2Kbps and the max. rate is 921.6kbps. Note:

1)The duplex UART interface could be used as serial interface for AT commands, data service, and the default baud rate is adaptive. 2)The modules UART output I/O level is 2.8V, therefore it needs level conversion when connecting with 3.3V or 5V logic circuit. Otherwise, it would be damaged or unstable by the mismatch of power level For example, if MCU communication with module through UART interface, and the MCU UART level is 3.3V. the most common method is to use a dynatron to realize the level conversion. Figures below show the level conversion to 3.3V through the UART interface of module. The resistance and capacitance in figure 4-4 are just for reference, and they need to be recalculated during the design. The diode in this Figure is Schottky diode (forward voltage drop is 0.3V). If you select other diodes, please select one with lower forward voltage drop to make sure RXD_2V8 is below the threshold when inputting low level. Recommended level converter :NLSX5014MUTAG//TXB0304RUTR Recommended Transistor: MMBT3904LT1G//LMBT3904LT1G//PMBT3904 Recommended Diode: LRB521S-30T1G//RB521SM-30T2R//RB521S-30//1PS79SB10//

RB521S-30U9JTE61 All Rights reserved, No Spreading abroad without Permission of ZTE 15 Hardware Development Guide of Module Product ZTE MG2618 Figure 43 Reference Circuit 1 of UART Interface Figure 44 Reference Circuit 2 of UART Interface 3)When the module need to enter sleep mode, pull up the pin /DTR to high level, and when you want to wake up the module, pull down the /DRT pin to low level. 4)When there is a call, a low level is output from PIN RI, and lasting until the end of conversation. All Rights reserved, No Spreading abroad without Permission of ZTE 16 VREG_MSME1(2.8V)TXD(2.8V)10K1KVCC(3.3V)TX(3.3V)22pF10KRX(3.3V)100pFRXD(2.8V)VREG_MSME1(2.8V) Hardware Development Guide of Module Product ZTE MG2618 4.2.1 Duplex UART Interface The UART interface definition is shown in Table below:

Figure 45 UART Connection between DCEDTE Table 42 UART Interface Definition Definition

/RTS

/CTS TXD RXD DCD

/DSR RI

/DTR I/O O I O I O O O I Description Ready to send Clear to send Transmitting data Receiving data Carrier detection Data set ready Ringtone indication Data terminal ready Remark DTE informs DCE to send DCE has switched to Rx. mode DTE receives serial data DTE transmits serial data Data link connected DCE is ready Inform DTE upon a remote call DTE is ready Function UART PIN 25 26 27 28 31 32 33 34 All Rights reserved, No Spreading abroad without Permission of ZTE 17 RXDTXD/CTS/RTS/DTR/DSRDCDRITXDRXDRTSCTSDTRDSRDCDRINGModuleApplicationDCEDTE Hardware Development Guide of Module Product ZTE MG2618 4.3 SIM Card Interface Module supports two kinds of SIM card of 1.8V and 3V. The following Figure shows the reference design of the SIM card. On the line close to the SIM card console, be sure to add the ESD circuit protection during the design. Table 43 Definition of SIM Card Signal PIN Function Definition I/O Description Remark 21 22 23 24 SIM SIM SIM SIM VREG_SIM SIM_DATA SIM_CLK SIM_RST O I/O O O SIM card power, output from the module SIM card DATA signal SIM card clock signal SIM card reset signal 1.8/3V

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The typical rate of SIM card interface is about 3.25MHz. It is recommended to place SIM card console close to the SIM card interface to prevent the wiring from being too long(less than 100mm), which might seriously distort the waveform and thus affect the signal integrity The distance between the module and headset/handset should be as short as possible and its enveloped by the ground wires to avoid strong interference sources. It is recommended to make the grounding protection for SIM_CLK and SIM_DATA signal wiring. Cascade one 1uF capacitor between VREG_SIM and GND, another 0.1uF and 33pF capacitor can be added between VREG_UIM and GND. In order to filter out the antennas interference signal, add three 33pF capacitors between SIM_CLK, SIM_DATA, SIM_RST and GND. It is recommended to take electrostatic discharge (ESD) protection measures near the SIM card socket. The TVS diode junction capacitance less than 10 pF must be placed as close as possible to the SIM socket, and the Ground pin of the ESD protection component is well connected to the Ground. The recommended model is: CESDLC3V0L4//NZQA5V6AXV5T1G//PESD3V3V4UW. The reference circuit of SIM card interface is as shown in Figure below. All Rights reserved, No Spreading abroad without Permission of ZTE 18 Hardware Development Guide of Module Product ZTE MG2618 Figure 46 Reference Circuit of SIM Card Interface Note:

The distance between the module and SIM card console should be as short as possible, and it is recommended to place SIM card console and ESD circuit close to the SIM card interface. 4.4 Audio Interface The module provides 2 Speaker interfaces and 2 Microphone interfaces. Only one pair I/O works at the same time. Table 44 Audio interface definition Function PIN Definition I/O Description Remark 7 6 11 10 8 9 5 MIC1_N MIC1_P SPK1_N SPK1_P MIC2_P SPK2_P HSED BIAS I I O O I O O Differential audio input channel 1, cathode Differential audio input channel 1, anode Differential audio output channel 1, cathode Differential audio output channel 1, anode Single-end audio input channel 2 Single-end audio output channel 2 MIC bias Differential input Differential output Single-end input Single-end output Default: 1.8V AUDIO All Rights reserved, No Spreading abroad without Permission of ZTE 19 Hardware Development Guide of Module Product ZTE MG2618 See the audio reference circuit in Figure below. Figure 47 MIC reference circuit 20 All Rights reserved, No Spreading abroad without Permission of ZTE Hardware Development Guide of Module Product ZTE MG2618 Figure 48 SPK reference circuit Microphone The MIC1_N & MIC1_P are both differential interfaces, and they can also be used for single-ended input. Its recommended to use differential method to reduce the noises. The MIC2_P interface is used for single-ended input. Directly connect to the microphone since these two inputs are internally provide 1.9V bias voltage. Speaker The SPK1_P & SPK1_N are both differential interfaces with 32 ohm impedance, while the SPK2_P is single-ended interface with 32 ohm impedance. There is no coupling capacitor internally, you need to add it in the designing process. Design of audio interface on the receiver The output power of SPK1 is 35mW. Select the microphone with the sensitivity lower than -51.5dB since and the max. gain inside MIC1 can reach 51.5dB. The voltage level of MIC1_P is about 1.9V. NOTE:

If other kind of audio input method is adopted, the input signal should be within 0.5V. If the signal voltage is lower than this value, then the pre-amplifier should be added. If the signal voltage is higher than this value, then attenuation network should be added Design of audio interface on the earpiece The output power of SPK2 is 10.8 mW.Select the microphone with the sensitivity lower than -51.5dB since and the max. gain inside MIC2 reaches 51.5dB. The voltage level of MIC2_P is about 1.9V. Note: In order to achieve well audio effects, its recommended that:

1) During the process of using module, its advised to use 100pf & 33pf capacitance on its external audio path, and serially connect with the beads to improve the audio quality. 2) Connect TVS tube or pressure sensitive resistance on the audio path (approaching the modules interface) to prevent the ESD from damaging the module. 3) Make sure the use environment and module are well grounded and there is no mutual influence. 4) The power ripple supplied to the module is less than 50mV. All Rights reserved, No Spreading abroad without Permission of ZTE 21 Hardware Development Guide of Module Product ZTE MG2618 4.5 LED indicator interface RSSI_LED is pull-down internally, it need to add transistor to drive. Table 45 Definition of LED Indicator Status Module status LED status Frequency Power on state the LED is off Network searching state the LED blinks at 3Hz Idle/sleep state the LED blinks at 1Hz Traffic state (call, data):

the LED blinks at 5Hz 3Hz 1Hz 5Hz The output status of RSSI_LED pin is decided by the software of module, and its the GPIO pin, the driver ability is limit. It cant drive the LED directly, and it need to work with transistor. The figure below is the reference of circuit. Figure 49 Reference Circuit of Status Indicator 4.6 GPS Interface

(This chapter can be only applied by the modules support GPS function) All Rights reserved, No Spreading abroad without Permission of ZTE 22 Hardware Development Guide of Module Product ZTE MG2618 Figure 410 Reference Circuit of GPS Interface Its recommended to connect with GPS RF socket through a 50 RF cable. The good matching between antenna and module enables GPS to obtain better receiving sensitivity. V_GPS works as the PIN to supply 2.8-4.3V power to GPS(recommended: 3.3V);

LDO can be the power supply of GPS, and the GPIO of MCU can be used as the external enable/disable control for the LDO. In the figure above, name the MCU control signal of LDO as GPS_EN, which connected with MCU to control the power supply for GPS. The GPS chip cant work independently, and it need to work with the GSM module together to output the valid location information. The GPS data output from UART interface. 4.7 Connection Method of GPS Active Antenna

(This chapter can be only applied by the modules support GPS function) In the figure below, V_G_ANT works as the power supply of GPS active antenna. Set V_G_ANT voltage according to the requirements of selected GPS active antenna, connect M_GPS_RF to GPS_ANT, and connect GPS_RFIN to GPS active antenna. The resistance of RF cable in the figure is 50. Figure 411 Active GPS antenna circuit reference design principle diagram All Rights reserved, No Spreading abroad without Permission of ZTE 23 Hardware Development Guide of Module Product ZTE MG2618 5 Mechanic Features 5.1 Appearance diagram

(Note: The figure above is just for reference, please take the actual products as the reference) Figure 51 Top & bottom & side view of module All Rights reserved, No Spreading abroad without Permission of ZTE 24 Hardware Development Guide of Module Product ZTE MG2618 5.2 Assembly Diagram See the assembly diagram of module in Figure below (Unit: mm):

Figure 52 The assembly diagram of module Dimensions(LengthWidthThickness): 22.00mm20.00mm2.0mm Weight: About 1.9g All Rights reserved, No Spreading abroad without Permission of ZTE 25 ZTE MG2618 Hardware Development Guide of Module Product 5.3 PCB Package Dimensions The PCB package dimensions of module are shown in Figure below (Unit: mm):

PIN18 PIN19 PIN1 PIN49 PIN37 PIN36 Figure 53 The PCB package dimensions of module (Top View) All Rights reserved, No Spreading abroad without Permission of ZTE 26 Hardware Development Guide of Module Product ZTE MG2618 Precaution during PCB designing:

Figure 54 Test point of module 1 Copper-clad and wiring are forbidden in the nearby areas of the RF stamp-hole. 2 For the convenience of testing and maintenance, it is recommended to drill holes on the PCB to expose JTAG test points. All Rights reserved, No Spreading abroad without Permission of ZTE 27 Hardware Development Guide of Module Product ZTE MG2618 6 SMT Process and Baking Guide This chapter describes modules storage, PAD design, SMT process parameters, baking requirements, etc., and it is applicable for the process guide to second-level assembly of LCC encapsulation module. 6.1 Storage Requirements Storage conditions: temperature<40, relative humidity<90% (RH), 12 months weldability guaranteed under this circumstances of excellent sealing package. The Moisture sensitivity level for all modules is level 3 (Conforming to IPC/JEDEC J-STD-020). After opening the package, mount within 168 hours under the environment conditions of temperature<30, relative humidity<60% (RH); if it doesnt meet the above requirements, perform the baking process. See the baking parameters in Table below:

Table 61 Baking parameters Temperature Baking conditions Baking time Remarks 1255 455 Moisture60%RH Moisture5%RH 8 hours 192 hours The accumulated baking time must be less than 96 hours The products transportation, storage and processing must conform to IPC/JEDEC J-STD-033 When in the process of PAD designing of module, refer to IPC-SM-782A and the chapter 6.2 below. 6.2 Recommended PAD Design When designing the pad of main board, the following dimensions marked in the Figure below should be taken into consideration. All Rights reserved, No Spreading abroad without Permission of ZTE 28 Hardware Development Guide of Module Product ZTE MG2618 Figure 61 Modules dimensions Figure 62 Recommended PAD dimensions on corresponding main board t1=Main boards PAD extend outward LCC module PAD t2=Main boards PAD extend inward All Rights reserved, No Spreading abroad without Permission of ZTE 29 Hardware Development Guide of Module Product ZTE MG2618 Figure 63 Module boards PAD mounted on main board Refer to the recommended PAD dimensions of main board at client end in the table below:

Table 62 Recommended PAD dimensions of main board Main boards recommended PAD dimensions Limited conditions of module boards dimensions When H<1mm, P-W<0.5mm When H<1mm P-W0.5mm When H1mm,and P-W<0.5mm When H1mm,and P-W0.5mm Y1=T1+t1+t2

/

t1 t2 0.05mm 0.05mm 0.05mm(min) 0.1mm(max) T1 H/2 H/2 0.5mm 0.5mm X W Z G L+2*t1 S-2*t2 W(min)

(W+0.2mm)(max) L+2*t1 S-2*t2 W L+2*t1 S-2*t2 e P P P P 0.05mm(min) 0.1mm(max) W(min)

(W+0.2mm)(max) L+2*t1 S-2*t2 6.3 Requirements of Modules Position on Main board It is recommended that the thickness of green oil at the modules position on main board should be less than 0.02mm. Do not cover with white oil or cover white oil on the green oil layer to avoid excessive thickness. As the excessive thickness may cause the module cannot be effective contact with the solder paste thus affecting the quality of welding. The white oil need be removed Figure 64 Green oil and white oil at modules position on main board

(The figure is just for reference; it doesnt represent the actual module encapsulation) In addition, do not lay out other components within 2mm around the modules position on main board to ensure the maintenance of the module. All Rights reserved, No Spreading abroad without Permission of ZTE 30 Hardware Development Guide of Module Product ZTE MG2618 6.4 Module Planeness Standard The modules planeness is required to be 0.15mm. Measurement method: put the module on the marble plane, use the feeler gage to measure the gap width at the position of maximum warp, and do not exert force on the module during the measurement. 6.5 Process Routing Selection The modules are manufactured with the lead-free process and meet the ROHS requirements, therefore its recommended to follow the lead-free manufacturing process upon the selection of process routing for module board and main board. 6.5.1 Solder Paste Selection The solder pastes with metal particle TYPE3 and TYPE4 can fulfill the welding requirements. It is accordingly recommended to use the no-clean solder paste. If the solder paste which needs cleaning is used, we cannot guarantee the components on the module board could withstand the washing of the cleaning solvents. This might cause the functional problems of such components and affect the appearance of the module. During the printing process, make sure the solder pastes thickness at the position of modules PAD is within 0.18mm -0.20mm. 6.5.2 Design of module PADs steel mesh opening on main board The thickness of the steel mesh on main board is selected according to the encapsulation type of components on the main board. Pay attention to the following requirements:

1 Make sure to design the module PAD on main board according to section 2.1. 2 The thickness of steel mesh is 0.15mm or 0.18mm, but the thickness at the position of module pad can be increased to 0.18~0.20mm or the thickness of steel mesh is directly 0.18mm~0.20mm on main board. 3 Requirements on the thickness of solder paste: control the thickness between 0.18mm and 0.20mm. 4 See the LCC module PADs steel mesh opening in the following table:

Table 63 LCC module PADs steel mesh opening All Rights reserved, No Spreading abroad without Permission of ZTE 31 Hardware Development Guide of Module Product ZTE MG2618 Module PAD GAP (G)=Center Distance (e) PAD width (X) Steel mesh opening G0.5mm G0.5mm Drill holes at 100%

scale in the direction of width;

extend 0.3mm outward in the direction of length Contract 0.05~0.1mm in the direction of width;

Contract 0.05~0.1mm inward in the direction of length, extend 0.5mm outward in the direction of length. 0.1mm 0.1mm Steel mesh opening Module PAD on PCB 0.5mm 0.1mm Figure 65 Module Boards Steel Mesh Diagram 6.5.3 Module Boards SMT process 1) SMT Pallets:

The pallets, which are suitable for SMT, have been made for most ZTE modules. If the module has provided the pallets itself and meets the SMT requirements, customers can directly use it for module SMT. All Rights reserved, No Spreading abroad without Permission of ZTE 32 Hardware Development Guide of Module Product ZTE MG2618 Figure 66 Material Module Pallet

(The figure is just for reference; it doesnt represent the actual Material Module Pallet) Otherwise, customers need make a loading tool similar to the pallet. Customers can take out the module from the packaging box, put them into the pallet according to the sequence and direction, and then start SMT. 2 Mounting Pressure:

In order to ensure a good contact between the module and the solder paste on main board, the pressure of placing the module board on main board should be 2-5N according to our experiences. Different modules have different numbers of pads, therefore the pressure selected are different. Customers can select proper pressure based on their own situations to suppress the module paste as little as possible, in order to avoid the surface tension of the solder paste melts too much to drag the module during reflow. 6.5.4 Module Soldering Reflow Curve Module soldering furnace temperature curve is:

Peak value: 245+0/-5 217: 3060S 150200: 60120S Temperature rise slope: <3/S Temperature drop rate: 24/S All Rights reserved, No Spreading abroad without Permission of ZTE 33 Hardware Development Guide of Module Product ZTE MG2618 Figure 67 Module Furnace Temperature Curve Diagram Note: The test board of furnace temperature must be the main board with the module board mounted on, and there must be testing points at the position of module board. 6.5.5 Reflow method If the main board used by customers is a double-sided board, it is recommended to mount the module board at the second time. In addition, it is preferable for the main board to reflow on the mesh belt when mounting at the first time and the second time. If such failure is caused by any special reason, the fixture should be also used to make such main board reflow on the track so as to avoid the deformation of PCB during the reflow process. 6.5.6 Maintenance of defects If poor welding occurs to the module board and main board, e.g., pseudo soldering of the module board and main board, the welder can directly use the soldering iron to repair welding according to the factorys normal welding parameters. All Rights reserved, No Spreading abroad without Permission of ZTE 34 Hardware Development Guide of Module Product ZTE MG2618 6.6 Modules Baking Requirements The module must be baked prior to the second reflow. 6.6.1 Modules Baking Environment The operators must wear dust-free finger cots and anti-static wrist strap under the lead-free and good static-resistant environment. Refer to the following environment requirements:

The products transportation, storage and processing must conform to IPC/JEDEC J-STD-033. 6.6.2 Baking device and operation procedure Baking device: any oven where the temperature can rise up to 125C or above. Precautions regarding baking: during the baking process, the modules should be put in the high-temperature resistant pallet flatly and slightly to avoid the collisions and frictions between the modules. During the baking process, do not overlay the modules directly because it might cause damage to the modules chipset. 6.6.3 Module Baking Conditions See the baking parameters in Table 6-1. All Rights reserved, No Spreading abroad without Permission of ZTE 35 Hardware Development Guide of Module Product ZTE MG2618 7 Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal incorporating ZM5330 module. Manufacturers of the cellular terminal should send the following safety information to users, operating personnel and to incorporate these guidelines into all manuals supplied with the product. The use of this product may be dangerous and has to be avoided in the following areas:

Where it can interfere with other electronic devices in environments such as hospitals, aircrafts, airports, etc, switch off before boarding an aircraft. Make sure the cellular terminal is switched off in these areas. The operation of wireless appliances in the hospitals, aircrafts and airports are forbidden to prevent interference with communication systems. Areas with potentially explosive atmospheres including fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as gasoline stations, oil refineries, etc make sure that wireless devices are turned off. Its the responsibility of users to enforce other country regulations and the specific environment regulations. And our company does not take on any liability for customer failure to comply with these precautions. All Rights reserved, No Spreading abroad without Permission of ZTE 36