FCC ID: SRQ-ZM8620 LTE Wireless Data Terminal

 

Welink Your Smart Hardware Development Guide of Module Product Version 2.3, 2014-04-15 ZM8620_V2 ZM8620_V2 Hardware Development Guide of Module Product Legal Information By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as ZTEWelink), you are deemed to have agreed to the following terms. If you dont agree to the following terms, please stop using the document. Copyright 2013 Shenzhen ZTEWelink Technology Co., Ltd. All rights reserved. The document contains ZTEWelinks proprietary information. Without the prior written permission of ZTEWelink, no entity or individual is allowed to reproduce, transfer, distribute, use and disclose this document or any image, table, data or other information contained in this document. As the wholly-owned subsidiaries of ZTE, ZTEWelink is the professional company engaging in R&D, manufacture and sales of wireless module product. is the registered trademark of ZTEWelink. The name and logo of ZTEWelink are ZTEWelinks trademark or registered trademark. Meanwhile, ZTEWelink is a wholly-owned subsidiary of ZTE Corporation, and is granted to use ZTE Corporations registered trademark. The other products or company names mentioned in this document are the trademark or registered trademark of their respective owner. Without the prior written permission of ZTEWelink or the third-party oblige, no one is allowed to read this document. The product meets the design requirements of environmental protection and personal security. The storage, use or disposal of products should abide by the product manual, relevant contract or the laws and regulations of relevant country. ZTEWelink reserves the right to make modifications on the product described in this document without prior notice, and keeps the right to revise or retrieve the document any time. If you have any question about the manual, please consult the company or its distributors promptly. All Rights reserved, No Spreading abroad without Permission of ZTEWelink I ZM8620_V2 Hardware Development Guide of Module Product Applicability Table Product ZM8620_V2EUD ZM8620_V2LAT All Rights reserved, No Spreading abroad without Permission of ZTEWelink II ZM8620_V2 Hardware Development Guide of Module Product Revision History Version Date Description V1.0 2013-02-22 First published V2.0 2013-03-20 Delete the part of 4.8 in the former version, and change the header, front cover, legal information and footer. 1. Modify the legal information 2. Modify the part of 7.1.1 3. Modify the format of footer and header 2013-08-16 4. Modify the figure of PIN Configuration Diagram 5. Add the figure of PIN Distribution Diagram 6. Add chapter 8 of Debugging Environment and Method 7. Modify chapter 7 of Antenna 8. Modify the typical voltage of power supply to 3.8V 9. Add the support of WinCE OS 10. Update the Product Material Object Picture of Figure 2-1 11. Modify the support of GPRS Class B in Table 2-1 12. Modify the Specification of SIM interface in Table 2-1 13. Modify the pin NO. of USIM in Table 4-4 14. Modify the Figure of (U)SIM Card Signal Connection Circuit 15. Modify the support of MMS, RAS, phonebook, network lock, 2013-09-30 and USSD in Table 2-1 16. Add the Figure 4-4 of Module Serial Port & AP Application V2.1 Processor 17. Add the Table 4-6 of Definition of UART Signal 18. Add 4.10 of W_DISABLE_N Signal 19. Modify chapter 5.3 of Resetting Flow 20. Delete the part of Power_on/Power_off in chapter 5.2 and chapter 4.8 21. Add Table 5-3 of Power-on/Resetting Period 22. Complete and modify Table 4-2 of PIN Interface Definition 2013-10-11 23. Add chapter 4.8 of SPI Interface 24. Add chapter 6 of Related Test & Testing Standard 25. Add Contact Information 26. Modify Power-on/Resetting Period in chapter 5 27. Add the document in table List for Supported& Related 2013-12-12 Documents 28. Modify LTE TDD in Technical Standard to DL 50Mbps / UL 25Mbps (10MHz) in Table 2-1 29. Modify the RxDiv Band in Table 2-1 30. Add the power consumption in the mode of UMTS/LTE in All Rights reserved, No Spreading abroad without Permission of ZTEWelink III ZM8620_V2 Hardware Development Guide of Module Product Version Date Description chapter 5.1 31. Modify the antenna interface to MHF-A13 of I-PEX 1. Modify the typical voltage of power supply to 3.3Vand the range to 3.1-3.6V 2. Modify the the Profile Dimensions in Figure 8-1 and The PCB layout is shown in the Figure 8-2. 3. Modify the antenna interface to U.FL-R-SMT-1(80)(HRS)/

V2.2 2014-03-06 ECT818000071(ECT) 4. Modify the pins in chapter 4.1 5. Modify the chapter 4.6 of UART interface 6. Update the format and template of the document 7. Update the legal information of this document 8. Update the Product Material Object Picture in Figure 2-1 1. Update the document as the hardware development guide of module ZM8620_V2 2. Add the difference between the module ZM8620_V2 and ZM8620. 3. Update the bands information of two variants ZM8620_V2EUD and ZM8620_V2LAT 4. Modify the Figure in chapter of UART electric feature 5. Add the chapter of 10 and 11 6. Update the Overview of Major Technical Parameters in Table 22 V2.3 2014-04-15 Note: Because of ZTEWelink ZM8620_V2 module is still under revision to improve its performances, the present document could be subject to revisions without notice. All Rights reserved, No Spreading abroad without Permission of ZTEWelink IV ZM8620_V2 Hardware Development Guide of Module Product Contact Information Post 9/F, Tower A, Hans Innovation Mansion, North Ring Rd., No.9018, Hi-Tech Industrial Park, Nanshan District, Shenzhen, P.R.China. Web Phone E-Mail www.ztewelink.com

+86-755-86360200-8679 ztewelink@zte.com.cn Note: Consult our website for up-to-date product descriptions, documentation, application notes, firmware upgrades, troubleshooting tips, and press releases Besides, ZTEWelink provides various technical support ways to the customers, such as support by phone, website, instant messaging, E-mail and on-site. All Rights reserved, No Spreading abroad without Permission of ZTEWelink V ZM8620_V2 Hardware Development Guide of Module Product Contents LEGAL INFORMATION ....................................................................................................................................... I 1 ABOUT THIS DOCUMENT ..................................................................................................................... 1 1.1 Application Range ................................................................................................................................. 1 1.2 Purpose ................................................................................................................................................ 1 1.3 Supported & Reference Document List .................................................................................................... 1 1.4 Abbreviations ....................................................................................................................................... 2 2 PRODUCT OVERVIEW ........................................................................................................................... 3 2.1 Product Technical Parameter .................................................................................................................. 4 2.2 Function Overview ................................................................................................................................ 7 2.2.1 Baseband Function .................................................................................................................... 7 2.2.2 Radio Frequency Function ......................................................................................................... 7 3 MECHANIC FEATURE ............................................................................................................................ 9 3.1 Dimensions and Interface ....................................................................................................................... 9 3.2 Antenna Interface ................................................................................................................................ 11 3.3 Thermal Design .................................................................................................................................. 12 4 PIN DESCRIPTION ................................................................................................................................ 14 4.1 Dimensions and Interface ..................................................................................................................... 14 4.1.1 Definition of PIN I/O Parameters .............................................................................................. 14 4.1.2 PIN Configuration Diagram ...................................................................................................... 14 4.1.3 PIN Description ........................................................................................................................ 15 4.2 Feature of Interface Power Level .......................................................................................................... 18 4.2.1 Power Level of IO Interface ...................................................................................................... 18 4.3 Power Interface ................................................................................................................................... 19 4.3.1 Description of Power PINs ....................................................................................................... 19 4.3.2 Requirement of Power Supply .................................................................................................. 19 4.4

(U)SIM Card Interface ......................................................................................................................... 19 4.4.1 Description of PINs ................................................................................................................... 19 All Rights reserved, No Spreading abroad without Permission of ZTEWelink VI ZM8620_V2 Hardware Development Guide of Module Product 4.4.2 Electric Feature ........................................................................................................................ 20 4.5 USB2.0 Interface ................................................................................................................................ 20 4.5.1 Description of PINs ................................................................................................................... 20 4.5.2 Electric Feature ........................................................................................................................ 21 4.6 UART Interface .................................................................................................................................. 21 4.6.1 Description of PINs ................................................................................................................... 21 4.6.2 Electric Feature ........................................................................................................................ 22 4.7 SPI Interface ....................................................................................................................................... 23 4.8 Reset Signal PERST# .......................................................................................................................... 24 4.9 WAKE# Signal ................................................................................................................................... 24 4.10 W_DISABLE_N Signal ....................................................................................................................... 25 4.11 Recommended Upgrade Methods ......................................................................................................... 26 5 ELECTRIC FEATURE ........................................................................................................................... 27 5.1 Power Feature ..................................................................................................................................... 27 5.1.1 Power Supply ........................................................................................................................... 27 5.1.2 Working Current ....................................................................................................................... 27 5.2 Power-on/Resetting Flow ..................................................................................................................... 28 5.3 Resetting Flow .................................................................................................................................... 29 6 RELATED TEST & TESTING STANDARD ........................................................................................... 30 6.1 Testing Reference ................................................................................................................................ 30 6.2 Description of Testing Environment ...................................................................................................... 30 6.3 Reliability Testing Environment ............................................................................................................ 31 6.4 Reliability Test Result .......................................................................................................................... 32 7 RF SPECIFICATIONS ........................................................................................................................... 34 7.1 Technical Specification for UMTS Mode Radio Frequency ..................................................................... 34 7.1.1 Maximum Transmission Power................................................................................................. 34 7.1.2 Receiving Sensitivity ................................................................................................................ 34 7.1.3 Spurious Specification .............................................................................................................. 35 7.2 Technical Specification of GSM Mode Radio Frequency ......................................................................... 35 All Rights reserved, No Spreading abroad without Permission of ZTEWelink VII ZM8620_V2 Hardware Development Guide of Module Product 7.2.1 Maximum Transmission Power................................................................................................. 35 7.2.2 Receiving Sensitivity ................................................................................................................ 36 7.3 Technical Specification of LTE Mode Radio Frequency .......................................................................... 36 7.3.1 Maximum Transmission Power................................................................................................. 36 7.3.2 Receiving Sensitivity ................................................................................................................ 36 7.3.3 Spurious Specification .............................................................................................................. 38 8 ANTENNA ............................................................................................................................................. 41 8.1 RF Antenna Specification ..................................................................................................................... 41 8.1.1 Technical Parameter for the Main Antenna Connector ............................................................. 41 8.2 Proposal on Layout of Product in Terminal Product ................................................................................ 42 8.3 Antenna Dimensions and Location ........................................................................................................ 43 8.4 Diversity Antenna Design .................................................................................................................... 43 9 DEBUGGING ENVIRONMENT AND METHOD .................................................................................... 44 9.1 Debugging Board ................................................................................................................................ 44 9.2 Interfaces on Debugging Board............................................................................................................. 45 9.2.1 JTAG Interface ......................................................................................................................... 45 9.2.2 USB Interface ........................................................................................................................... 45 9.2.3 Power-supply Interface ............................................................................................................. 45 9.2.4 USIM Card Console Interface .................................................................................................. 46 9.2.5 PON_RESET_N Button ............................................................................................................ 46 9.2.6 W_DISABLE_N Button ............................................................................................................. 46 9.2.7 LED Indicator............................................................................................................................ 46 PACKAGE SYSTEM .............................................................................................................................. 47 SAFETY INFORMATION ....................................................................................................................... 48 10 11 All Rights reserved, No Spreading abroad without Permission of ZTEWelink VIII ZM8620_V2 Hardware Development Guide of Module Product Figures Figure 21 Product Material Object Picture .............................................................................................................. 4 Figure 22 System Connection Diagram ................................................................................................................... 7 Figure 31 PCI Express Mini Card Dimensions Type and Slot Compatibility ........................................................ 11 Figure 32 Antenna Interface Flag Diagram (with Diversity) ................................................................................. 12 Figure 33 Radio Frequency Interface Test Base .................................................................................................... 12 Figure 41 PIN Distribution Diagram ..................................................................................................................... 15 Figure 42 PIN Configuration Diagram .................................................................................................................. 15 Figure 43 (U)SIM Card Signal Connection Circuit ............................................................................................... 19 Figure 44 Module Serial Port & AP Application Processor ................................................................................... 22 Figure 45 The connection of ZM8620_V2 UART and Standard RS-232-C interface ........................................... 23 Figure 46 Reference Circuit Design of PERST# Signal ........................................................................................ 24 Figure 47 Reference Connection Circuit of WAKE# Signal .................................................................................. 25 Figure 48 Reference Circuit Design of W_DISABLE_N Signal ........................................................................... 26 Figure 51 Module Reset Flow ............................................................................................................................... 29 Figure 81 the Profile Dimensions .......................................................................................................................... 41 Figure 82 Recommended PCB layout .................................................................................................................... 42 Figure 91 The diagram for the switching board ..................................................................................................... 44 Figure 92 Debugging Board .................................................................................................................................. 45 Figure 101 Package process of ZM8620_V2 modules .......................................................................................... 47 All Rights reserved, No Spreading abroad without Permission of ZTEWelink IX ZM8620_V2 Hardware Development Guide of Module Product Tables Table 11 List for Supported& Related Documents .................................................................................................. 1 Table 12 Abbreviation List ...................................................................................................................................... 2 Table 21 The bands informaiton of ZM8620_V2 module........................................................................................ 3 Table 22 Overview of Major Technical Parameters ................................................................................................. 4 Table 23 Product Operating Frequency Band .......................................................................................................... 8 Table 31 PCI Express Mini Card ............................................................................................................................. 9 Table 41 PIN Parameters ....................................................................................................................................... 14 Table 42 PIN Interface Definition .......................................................................................................................... 15 Table 43 Power Level Range of Digital Signal ...................................................................................................... 18 Table 44 Definition & Description of (U) SIM Card Signal Group ....................................................................... 20 Table 45 Definition of UART Signal ..................................................................................................................... 21 Table 46 Definition and Description of SPI Control Signal Group ........................................................................ 23 Table 47 Definition and Description of PERST# Signal ........................................................................................ 24 Table 48 Definition and Description of W_DISABLE_N Signal .......................................................................... 25 Table 51 Input Voltages ......................................................................................................................................... 27 Table 52 Averaged standby DC power consumption ............................................................................................. 27 Table 53 DC power consumption in UMTS mode ................................................................................................. 27 Table 54 DC power consumption in LTE mode (Unit: mA) .................................................................................. 28 Table 55 Power-on/Resetting Period ...................................................................................................................... 28 Table 61 Testing Standard ...................................................................................................................................... 30 Table 62 Testing Environment ............................................................................................................................... 31 Table 63 Testing Instrument & Device .................................................................................................................. 31 Table 64 Reliability Feature ................................................................................................................................... 31 Table 65 Temperature Testing Result under Windless Environment ...................................................................... 32 Table 66 Test Results of High/low Temperature Running and Reliability Test ...................................................... 33 Table 71 Maximum Transmission Power ............................................................................................................... 34 Table 72 Receiving Sensitivity Reference Table .................................................................................................... 34 Table 73 General Requirement of Receiver Spurious Emission ............................................................................ 35 Table 74 Additional Spurious Emission Requirement ........................................................................................... 35 Table 75 Maximum Transmission Power ............................................................................................................... 35 Table 76 Reference Table of Receiving Sensitivity ............................................................................................... 36 Table 77 Maximum Transmission Power ............................................................................................................... 36 Table 78 Receiving Sensitivity Reference Table .................................................................................................... 37 Table 79 General Requirement of Receiver Spurious Emission ............................................................................ 38 Table 710 UE Co-existence Spurious Emission Requirement ............................................................................... 38 All Rights reserved, No Spreading abroad without Permission of ZTEWelink X ZM8620_V2 Hardware Development Guide of Module Product 1 About This Document 1.1 Application Range This document is applicable as the hardware development guide of ZM8620_V2 LTE module product. The user can conduct secondary development according to the requirement and guidance in this document. And it is only applicable for the hardware application development based on the use of ZM8620_V2 module product. 1.2 Purpose This document provides the design and development fundamentals for the users of ZM8620_V2. By reading this document, the user can have an overall knowledge of this product, and a clear understanding of the technical parameters, hardware interfaces, electrical and mechanical details of this product. With this document, the user can use ZM8620_V2 successfully fulfill the wireless communication function development of M2M applications including Wireless POS, mobile terminal products such as Tablet, Notepad etc. 1.3 Supported & Reference Document List Besides this hardware development document, ZTEWelink also provides the software development guide. Table 1-1 is the list of supported documents. Table 11 List for Supported& Related Documents NUM Document Name 1 2 3 4 ZTEWelink Software Development Guide of LTE Module Products-V2.3.pdf ZTEWelink ZM8620_V2 Module Specification.pdf AT Command reference guide for ZTEWelink LTE Module.pdf 3GPP LTE 36.101 protocol (Evolved Universal Terrestrial Radio Access

(E-UTRA); User Equipment (UE) radio transmission and reception) All Rights reserved, No Spreading abroad without Permission of ZTEWelink 1 ZM8620_V2 Hardware Development Guide of Module Product 5 3GPP TS 34.121 protocol 1.4 Abbreviations Table 1-2 is a list of the relevant abbreviations, and interpretations in Chinese and English involved in the whole document. Table 12 Abbreviation List Abbreviations English full name BER DCE DL DTE DTR Bit Error Rate Data circuit-terminating equipment Downlink Data terminal equipment Data terminal ready DPCH Dedicated Physical Channel DPCH_Ec Average energy per PN chip for DPCH. DPCH EMC ESD FDD GPRS GSM I/O LED PCB SIM SMS SPI UART UMTS USB Electromagnetic compatibility Electro-Static discharge Frequency Division Duplexing General Packet Radio Service Global Standard for Mobile Communications Input/output Light Emitting Diode Printed Circuit Board Subscriber Identification Module Short Message Service Serial Peripheral Interface Universal asynchronous receiver-transmitter Universal Mobile Telecommunication System Universal Serial Bus WCDMA Wideband Code Division Multi Access All Rights reserved, No Spreading abroad without Permission of ZTEWelink 2 ZM8620_V2 Hardware Development Guide of Module Product 2 Product Overview ZM8620_V2 is a multimode wireless communication module with mini-PCIE express interface, which can be applied in but not limited to equipment such as Tablet, Vehicle Mounted Terminals, CPE and electronic consumer products, and provides equipment with high-speed data access service in mobile environment (LTE FDD, UTMS and GSM network). ZM8620_V2contains two variants ZM8620_V2EUD and ZM8620_V2LAT. Customer can choose the dedicated type based on the wireless network configuration. The following table shows the entire radio band configuration of ZM8620_V2series. Table 21 The bands informaiton of ZM8620_V2 module BAND BAND 1 BAND 2 BAND 3 BAND 4 FDD-LTE BAND 5 BAND 7 BAND 8 BAND12 BAND 20 BAND 38 BAND 40 BAND 1 BAND 2 TD-LTE UMTS BAND 4 BAND 5 BAND 8 GSM Quadband ZM8620_V2EUD ZM8620_V2LAT

--

--

--

--

--

--

--

--

--

NOTE:

In the Table 2-1 means theband is supported by module ZM8620_V2, while -- means not supported The Figure 2-1 below shows the product material object picture. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 3 ZM8620_V2 Hardware Development Guide of Module Product Figure 21 Product Material Object Picture 2.1 Product Technical Parameter The major features of ZM8620_V2 can be described from the aspects of mechanic feature, base band, radio frequency, technical standard and environment feature. Table 2-2 is a list of the major technical parameters and features supported by ZM8620_V2. Table 22 Overview of Major Technical Parameters Item Feature Specifications Dimensions 51mm x 30mm x 4.9mm Mechanic Specifications Weight About 11g Form Factor Mini-PCIE package(52Pin)

(U)SIM/SIM 3V SIM card and 1.8V SIM card Memory(SDRAM/

NAND) 128MByte & 256MByte MICRO SD Card No memory card support USB Version USB 2.0 HIGH SPEED Baseband UART Interface Yes Reset/Power_on/Po wer_off interface Yes SPI Interface Yes Maximum power TBD All Rights reserved, No Spreading abroad without Permission of ZTEWelink 4 ZM8620_V2 Hardware Development Guide of Module Product Item Feature Specifications consumption Power supply Typical is 3.3V, the range is 3.-3.6V Peak current About 2.5A Working current Average normal working current Standby current TBD TBD LED Control Yes, Module can output the signal to control the LED of the main board GSM Band EDGE/GPRS/GSM: 1900/1800/900/850MHz CDMA Band N/A RF switch RF switch controlled by AT command RxDiv Band RF Max. transmitter power UMTS: 2100/1900/850/900MHz ZM8620_V2EUD LTE FDD: Band 1,3,7,8,20 LTE TDD: Band 40 ZM8620_V2LAT UMTS: 2100/1900/1700/850/900MHz LTE FDD: Band 1,2,4,5,7,8,1 LTE TDD: Band 38 WCDMA/HSDPA 2100/1900/1700/850/900MHz: Power Class 3

( +24dBm +1/-3dB) LTE FDD: 2600/2100/1900/1700/900/850/700MHz Power Class 3 (+23dBm +2.7/-2.7dB) LTE TDD: Band 38 Power Class 3 (+23dBm +2.7/-2.7dB) GSM/GPRS 850MHz/900MHz: Power Class 4 (+33dBm2dBm) GSM/GPRS 1800MHz/1900MHz: Power Class 1 (+30dBm2 dBm) EDGE 850MHz/900MHz: Power Class E2 (+27dBm 3dBm) EDGE 1800MHz/1900MHz: Power Class E2 (+26dBm Receiving sensitivity

-4/+3dBm) UMTS2100/1700: -106.7 dBm UMTS1900/850: -104.7 dBm UMTS900: -103.7 dBm LTE 2600/1900: -92dBm(20 MHz) LTE 2100/1700: -94dBm(20 MHz) LTE 900/700: -94dBm(10 MHz) LTE 850: -95dBm(10 MHz) LTE Band 38: -94dBm(20 MHz) GSM850/900/1800/1900: -102dBm All Rights reserved, No Spreading abroad without Permission of ZTEWelink 5 ZM8620_V2 Hardware Development Guide of Module Product Item Feature Specifications Equalization Yes Main Antenna Provide external main Antenna Interface of RF connector mode GPS Antenna Provide external GPS Antenna Interface of RF connector mode Receive Diversity Provide external Diversity Antenna Interface of RF connector Antenna mode LTE TDD DL 50Mbps / UL 25Mbps (10MHz) GSM/EDGE/WCD MA Technical Standard HSDPA/HSUPA/

HSPA+/

DC-HSPA+

GSM CS: UL 9.6kbps/DL 9.6kbps GPRS: Multi-slot Class 10 EDGE: Multi-slot Class 12 WCDMA CS: UL 64kbps/DL 64kbps WCDMA PS: UL 384kbps/DL 384kbps HSDPA Rel 6: DL 14.4Mb/s HSUPA Rel 6: UL 5.76Mb/s HSPA+ Rel 7: DL 28/UL 5.76Mb/s DC-HSPA+ Rel 8: DL 42/UL 5.76 Mb/s CDMA 1xEV-DO N/A LTE-FDD DL 100Mbps / UL 50Mbps (Category 3) 3GPP Release R99, R5, R6, R7, R8(HSPA+),R9(FDD) OS Windows XP/Vista/7/8, Android, Linux, WinCE GPRS Class Class A Operating Temperature Environment Storage Temperature

-10 to 60 C

-40 to 85 C Humidity 5%~ 95%

DATA SMS RAS ECM NDIS Yes Yes Yes Yes Application MMS Yes, not support embedded MMS stack STK TCP/IP USSD No No Yes (Phase I &Phase II) Phonebook Yes All Rights reserved, No Spreading abroad without Permission of ZTEWelink 6 ZM8620_V2 Hardware Development Guide of Module Product Item Feature Specifications NETWORK LOCK BAND LOCK SIM Reader No Yes Yes Firmware Update Yes GPS/AGPS Yes 2.2 Function Overview 2.2.1 Baseband Function When connect the module product ZM8620_V2 to the system board, there are several main signal groups as follows: USB signal, SIM card signal, UART signal, GPIO signal, SPI signal, power on and resetting signal, wakeup signal, power supply and ground. At the same time, ZM8620_V2 has the main antenna interface, diversity antenna interface, and GPS antenna interface. Figure 22 System Connection Diagram 2.2.2 Radio Frequency Function The radio frequency function of ZM8620_V2 can be viewed from the aspect of over-the-air wireless bearer network, frequency band, whether receive diversity feature is supported.

(a) Support LTE FDD, LTE TDD, UMTS;

All Rights reserved, No Spreading abroad without Permission of ZTEWelink 7 Main Antenna USBSIM cardPOWERGNDGPIOUART WAKE#&PERST#&W_DISABLE Signals GPS Antenna ZM8620_V2 PCIE LTE wireless Internet access moduleDiversity AntennaSPI ZM8620_V2 Hardware Development Guide of Module Product

(b) Support GSM 850/900/1800/1900 MHz;

(c) Support the diversity receives;

The operating frequencies of module ZM8620_V2 are shown as Table 2-3. Table 23 Product Operating Frequency Band Operating Frequency Uplink Frequency Band Downlink Frequency Band Band

(Uplink)

(Downlink) UMTS850 UMTS900 824 MHz 849 MHz 869 MHz 894 MHz 880 MHz 915 MHz 925 MHz 960 MHz UMTS1700 1710 MHz 1755MHz 2110 MHz 2155MHz UMTS1900 1850 MHz 1910 MHz 1930 MHz 1990 MHz UMTS2100 1920 MHz 1980 MHz 2110 MHz 2170 MHz GSM1900 1850 MHz 1910 MHz 1930 MHz 1990 MHz GSM850 GSM900 824 MHz 849 MHz 869 MHz 894 MHz 890 MHz 915MHz 935 MHz 960MHz GSM1800 1710 MHz 1785MHz 1805 MHz 1880MHz LTE-FDD Band17 788 MHz 798 MHz 734 MHz 746 MHz LTE-FDD Band5 824 MHz 849MHz 869 MHz 894 MHz LTE-FDD Band8 880 MHz 915 MHz 925 MHz 960 MHz LTE-FDD Band4 1710 MHz 1755MHz 2110 MHz 2155 MHz LTE-FDD Band2 1850 MHz 1910MHz 1930 MHz 1990MHz LTE-FDD Band1 1920 MHz 1980 MHz 2110 MHz 2170 MHz LTE-FDD Band7 2500 MHz 2570MHz 2620 MHz 2690MHz LTE-TDD Band38 2570 MHz 2620MHz 2570 MHz 2620MHz All Rights reserved, No Spreading abroad without Permission of ZTEWelink 8 ZM8620_V2 Hardware Development Guide of Module Product 3 Mechanic Feature 3.1 Dimensions and Interface This product adopts the standard PCI Express Mini Card interface type, and the contour size is designed according to F1 type. Figure 3-1 illustrates the dimensions and slot compatibility of PCI Express Mini Card. Users of this module can refer to the document named PCI Express Mini Card Electromechanical Specification Revision 1.2, October 26 2007 for the detail of PCIE interface. Table 31 PCI Express Mini Card Card Type Full-Mini-

Half-Mini-

Dual-Use Dual Head-to-Head Only Socket Only Socket Socket Socket Connector Connector Connector Connector Connector A Yes F1 Full-Mini F2 Full-Mini with bottom-side keep Yes outs A No No A No A No B No Yes Yes No F3 Half-Mini No Yes Yes Yes No F4 Half-Mini with bottom-side keep No Yes Yes Yes Yes outs All Rights reserved, No Spreading abroad without Permission of ZTEWelink 9 ZM8620_V2 Hardware Development Guide of Module Product

(a)

(b) All Rights reserved, No Spreading abroad without Permission of ZTEWelink 10 ZM8620_V2 Hardware Development Guide of Module Product

(c) Figure 31 PCI Express Mini Card Dimensions Type and Slot Compatibility Figure (a) is TOP surface dimensions; Figure (b) is BOTTOM surface dimensions; Figure (c) is thickness information. 3.2 Antenna Interface This product has three radio frequency antenna interfaces: One is the main antenna interface (there is the MAIN flag on the PCB), one is a diversity receiving antenna (diversity optional) interface (there is AUX flag on the PCB), and one is GPS antenna, as shown in Figure 3-2. The radio frequency bases adopted by the antenna interface of ZM8620_V2 module are all U.FL-R-SMT-1(80)(HRS)/

ECT818000071(ECT) at present as shown in Figure 3-3. NOTE:

The radio frequency bases adopted by the antenna interface of ZM8620_V2 module is U.FL-R-SMT-1(80)(HRS)/ECT818000071(ECT) at present instead of adopting 20429-001E MHF-A13 of I-PEX by ZM8620 before. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 11 ZM8620_V2 Hardware Development Guide of Module Product Figure 32 Antenna Interface Flag Diagram (with Diversity) Figure 33 Radio Frequency Interface Test Base This product antenna is placed on the side of the system board. If this product is embedded in a notebook, place it on the top of the LCD screen. 3.3 Thermal Design The thermal design of this product strictly complies with the specification [PCI Express Mini Card Electromechanical Specification Revision 1.2, October 26, 2007], and distributes the heat source evenly, and has excellent heat dissipating design. As the maximum power consumption of the overall system is very high when transmitting, if it is impossible to ensure the temperature of ZM8620_V2 less than 60C, the rise of the overall system temperature will lead to the performance degradation of ZM8620_V2, or even not operate normally. In order to ensure product performance, safety and stability, the following proposals are provided for the main board design:

(a) the module far away from the switch power and high-speed signal cable as much as All Rights reserved, No Spreading abroad without Permission of ZTEWelink 12 ZM8620_V2 Hardware Development Guide of Module Product possible. Well protect the wiring of the interference sources.

(b)

(c) located close the interference sources. the module close to devices with large heat dissipation, such as CPU, south bridge, etc. The high temperature will affect the RF performance. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 13 ZM8620_V2 Hardware Development Guide of Module Product 4 Pin Description 4.1 Dimensions and Interface 4.1.1 Definition of PIN I/O Parameters The definition of the modules I/O parameter is as shown in Table 4-1. Table 41 PIN Parameters PIN Attribute Description AI AO B DI DO Z P1 P2 PU PD Analog signal input Analog signal output bidirectional digital with CMOS input Digital signal input Digital signal output High-resistance output PIN group 1, the power supply voltage is VDD_P1 PIN group 2, the power supply voltage is VDD_P2 PIN internal pull-up PIN internal pull-down 4.1.2 PIN Configuration Diagram The PIN sequence of interfaces on the module is following the mini-PCIE interface and defined as shown in Figure 4-2. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 14 ZM8620_V2 Hardware Development Guide of Module Product Figure 41 PIN Distribution Diagram Figure 42 PIN Configuration Diagram 4.1.3 PIN Description Table 42 PIN Interface Definition All Rights reserved, No Spreading abroad without Permission of ZTEWelink 15 123579111315171921232527293133353739414345495146810121416182022242628303234363840424446485052VDD_3V3VREG_UIMUIM_DATAUIM_CLKUIM_RSTUART1_DSRW_DISABLE_NPERST#VDD_3V3USB_DMUSB_DPVDD_3V3VDD_3V3LED_PWRVDD_3V347GNDSPI_CSGNDGNDGPIONCGNDGNDNCSLIC_INTSLIC_RESETGNDWAKE#SPI_SDISPI_SDOSPI_CLKGNDGNDGNDGNDGNDGNDGNDUART1_RXUART1_RIGPIO_79UART1_CTSUART1_RFRUART1_DTRGNDRESERVEDRESERVEDRESERVEDRESERVEDCOEX1COEX2CLKREQ*GND[1]REFCLK-REFCLK+GND[2]RESERVED5_UIM_C8RESERVED4_UIM_C4GND[4]PERN0PERP0GND[6]GND[7]PETN0PETP0GND[9]GND[10]3V3VAUX[2]3V3VAUX[3]GND[12]RESERVED3RESERVED2RESERVED0RESERVED13V3VAUX[0]GND[0]1V5[0]UIM_PWRUIM_DATAUIM_CLKUIM_RESETUIM_VPPW_DISABLE*PERST*3V3VAUX[1]GND[5]1V5[1]SMB_CLKSMB_DATAGND[8]USB_D+LED_WWAN*LED_WLAN*LED_WPAN*1V5[2]GND[13]3V3VAUX[4]ZM8620_V2USB_D-GND[11]GND[3]UART1_DCDUART1_TXNC ZM8620_V2 Hardware Development Guide of Module Product Pin Standard PIN ZM8620_V2 PIN Description 1 WAKE#

WAKE#

Wake up the system host I/O DO Remark

--

3.1V-3.6VThe 2 3.3Vaux VDD_3V3 3.3V supply DI typical value is COEX1 GND COEX2 1.5V CLKREQ#

SPI_SDI GND SPI_SDO SPI_CS SPI_CLK SPI data signal Ground SPI data signal SPI segment signal SPI synchronization clock UIM_PWR VREG_UIM USIM card power supply DI

--

DO DO

--

DO 3.3V 3.3V Ground pin 3.3V 3.3V 3.3V 2.85V/1.8V for SIM card GND GND Ground

--

Ground pin 3 4 5 6 7 8 9 10 UIM_DATA UIM_DATA USIM card data signal DI/DO 2.85V/1.8V.this signal requires a pull-up resistor on the host board 11 REFCLK-

UART1_RX UART port receive data 12 UIM_CLK UIM_CLK USIM card clock signal 13 REFCLK+

UART1_TX UART port transmit data 14 UIM_RESET UIM_RST USIM card reset signal 15 GND GND Ground 16 UIM_VPP UATR1_DSR Data is ready 17 Reserved(UIM_C8) UART1_RI Ringtone indicator 18 GND GND Ground 19 Reserved(UIM_C4) GPIO_79 The standby and wakeup of module Active low signal. This signal is used by the system DI DO DO DO

--

DO DO

--

--

3.3V 2.85V/1.8V 3.3V 2.85V/1.8V Ground pin 1.8V 1.8V Ground pin

--

20 W_DISABLE#

W_DISABLE_N to disable radio operation on DI Active low add-in cards that implement radio frequency applications. 21 GND 22 PERST#

23 PERn0 GND PERST#

Ground Module resetting UART1_CTS UART port, clear to send

--

DI DI Ground pin 1.8V 1.8V 3.1V-3.6VThe 24 +3.3Vaux VDD_3V3 3.3V supply DI typical value is 25 PERp0 UART1_RFR 26 GND 27 GND GND GND UART port, preparing to receive Ground Ground 3.3V DO 1.8V

--

--

Ground pin Ground pin All Rights reserved, No Spreading abroad without Permission of ZTEWelink 16 ZM8620_V2 Hardware Development Guide of Module Product Pin Standard PIN ZM8620_V2 PIN Description I/O Remark 28 +1.5V 29 GND 30 SMB_CLK GPIO GND NC General Purpose Input/Output Ground

--

31 PETn0 UART1_DTR UART1 data terminal ready 32 SMB_DATA NC

--

33 PETp0 UART1_DCD 34 GND 35 GND GND GND 36 USB_D-

USB_DM 37 GND GND 38 USB_D+

USB_DP UART1 carrier wave detection Ground Ground USB differential signal, minus side Ground DI/DO 1.8V

--

--

DI

--

Ground pin

--

1.8V

--

DO 1.8V

--

--

Ground pin Ground pin DI/DO

--

--

Ground pin USB differential signal, positive side DI/DO

--

3.1V-3.6VThe 39 +3.3Vaux VDD_3V3 3.3V supply DI typical value is 40 GND GND Ground 3.3V

--

Ground pin 3.1V-3.6VThe 41 +3.3Vaux VDD_3V3 3.3V supply DI typical value is 42 LED_WWAN#

LED_PWR signals. This signal is used DO

--

to provide status indicator Open drainactive low 3.3V 43 GND 44 LED_WLAN#

GND NC 45 Reserved Reserved Ground

--

--

46 LED_WPAN#

SLIC_INT exclusive use for routing adaptation 47 Reserved Reserved

--

48 +1.5V SLIC_RESET exclusive use for routing adaptation 49 Reserved Reserved

--

50 GND GND Ground 51 Reserved Reserved

--

--

--

--

DO

--

DO

--

--

Ground pin

--

--

--

--

--

--

Ground pin

--

3.1V-3.6VThe 52 +3.3Vaux VDD_3V3 3.3V supply DI typical value is 3.3V All Rights reserved, No Spreading abroad without Permission of ZTEWelink 17 ZM8620_V2 Hardware Development Guide of Module Product NOTE:

The voltage design of external circuit interfaces should match that of the ZM8620_V2 PINs. In the Table 4-2, the Power supply of ZM8620_V2 has been updated between 3.1V-3.6V, and the typical value is 3.3V at present. While in ZM8620 module, the Power supply is 3.4-4.2V, and typical is 3.8V before. In ZM8620_V2, the signal of pin 6,11,13,16,17,23,25,28,30~33,44,46.48 is different from that of module ZM8620. 4.2 Feature of Interface Power Level 4.2.1 Power Level of IO Interface Table 43 Power Level Range of Digital Signal Signal Description Min Max Units VIH High level of input voltage 0.65*VDD_PX VDD_PX+0.3 V VIL Low level of input voltage

-0.3 0.35*

V VDD_PX VOH High level of output VDD_PX-0.45 VDD_PX V voltage VOL Low level of output 0 0.45 V voltage NOTE:

1. The high/low PWL of input voltage should comply with the range in the table. 2. The high/low PWL of external interface signal should match the interface PWL of ZM8620_V2. 3. VDD_PX indicates the typical voltage of each Pin specified in Table 4-2. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 18 ZM8620_V2 Hardware Development Guide of Module Product 4.3 Power Interface 4.3.1 Description of Power PINs Power VCC (PIN No: 2, 24, 39, 41, 52). This is the positive signal of 3.3V power supply. GND signal (PIN No: 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50). This is the power ground and signal ground of the module, which needs to be connected to the ground on the system board. If the GND signal is not connected completely, the performance of the module will be affected. 4.3.2 Requirement of Power Supply The power supply is recommended to be within the range of 3.1~3.6V. If the network is in poor situation, the antenna will transmit at the maximum power, and the transient maximum peak current less than 2G mode can reach as high as 1.8A. So the power supply capacity for peak current needs to be above 2.5A, and the average peak current needs to be above 0.9A. 4.4

(U)SIM Card Interface 4.4.1 Description of PINs ZM8620_V2 module baseband processor integrates the (U)SIM card interface. The signals on SIM card interface is as shown in Figure 4-3. VREG_UIM VREG_UIM Figure 43 (U)SIM Card Signal Connection Circuit All Rights reserved, No Spreading abroad without Permission of ZTEWelink 19 ZM8620_V2 Hardware Development Guide of Module Product NOTE:

The PCB wiring of UIM card should be laid closely around the module as possible as you can, and the ESD component should be put near the UIM card socket by the customer. Table 44 Definition & Description of (U) SIM Card Signal Group PIN Signal Name Signal Description 8 VREG_UIM USIM card power, output from the module 10 UIM_DATA USIM card DATA signal, two-way signal 12 UIM_CLK USIM card clock signal, output from the module 14 UIM_RST USIM card reset signal, output from the module 4.4.2 Electric Feature The signals of (U)SIM card signal group are described in Table 4-4. As the USIM card console is placed on the system board side, be sure to add the ESD protection during the design. To comply with the requirements of 3GPP TS 51.010-1 and EMC authentication, it is recommended to place (U)SIM card console close to the (U)SIM card interface, to prevent the wiring from being too long, which might seriously distort the waveform and thus affect the signal integrity. It is recommended to make the grounding protection for UIM_CLK and UIM_DATA signal wiring. Cascade one 0.1uF and 33pF capacitor between VREG_UIM and GND, and cascade a 33pF bypass capacitor between UIM_CLK, UIM_RST and GND, to filter out the interference by RF signals. It is recommended to cascade a 20ohm resistance on UIM_DATA signal. And UIM_DATA must be pulled up via a 20K ohm resistance to VREG_UIM. 4.5 USB2.0 Interface 4.5.1 Description of PINs ZM8620_V2 has the high-speed USB2.0 interface,. USB is connected to the system board side via the PCI-E interface, to communicate with the processor on the system board side. Its PINs are PIN36

(USB_DM), PIN38 (USB_DP). The USB interface can be mapped to difference ports, such as Diagnostics port to capture the log, AT port is used to complete AT command interaction with the AP side. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 20 ZM8620_V2 Hardware Development Guide of Module Product 4.5.2 Electric Feature The USB interface of Module complies with the USB2.0 specifications and the electrical characteristics. During the PCB wiring, the wires must be parallel, the distance should be as short as possible and as far away as possible from the antenna, and its enveloped by the ground wires to avoid strong interference sources. USB_DP and USB_DM should be wired strictly in the differential mode, and the length difference of the two signals is within 1mm. NOTE:

The differential resistance needs to be controlled within 90, and the difference cannot exceed 5%. It is recommended to cascade the high-speed common-mode rejection filter on the USB differential traces. If some of the trace is exposed, it is recommended to add the ESD protection device, and the junction capacitor of the ESD protection device should better be kept within 1.5pF. Large junction capacitor will distort the waveform, and affect the bus communication. 4.6 UART Interface The UART interface is used as MODEM port by default which is occupied by data service. 4.6.1 Description of PINs The wireless module ZM8620_V2 supports the full UART interface with flow control function, which complies with the RS-232 interface protocol, and supports the 8-wires serial bus interface or 2-wires serial interface. The module can perform the serial communication and AT instruction interaction with external. This UART port supports the programmable data width, programmable data stop bit and programmable parity check, and has an independent TX and RX FIFOs (512 bytes for each). For the normal UART application (non-Bluetooth), the maximum baud rate is 230400bps, and the default baud rate is 115200bps. The PINs are defined as shown in Table 4-5. Table 45 Definition of UART Signal PIN Signal Name Description Level 11 13 UART1_RX UART port RX receive data Power level is 3.3V. UART1_TX UART port TX transmit data Power level is 3.3V. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 21 ZM8620_V2 Hardware Development Guide of Module Product 16 17 23 25 31 33 UART1_DSR Data is ready UART1_RI Ringtone indicator UART1_CTS UART port CTS clear to send UART1_RFR UART port RFR preparing to Power level is 1.8V. receive UART1_DTR DTE is ready UART1_DCD Carrier detection 4.6.2 Electric Feature During the software interconnection process, there is a method of capturing logs, and it is recommended that this interface be kept during the design and the testing point be reserved. If the module is used together with the application processor, and the PWL of it matches with the power level of the module, the connection mode is as shown in Figure 4-4. The 4-wires or 2-wires mode can also be used for connection. If it does not match the PWL of AP interface, it is recommended to add the PWL conversion circuit. Otherwise, it might cause unstable com ports because the level is not matched or cause damage to the module because it is at high level for long time. The connection of ZM8620_V2 UART port and standard RS-232-C interface can be through the chip like class 232. The design involves the transformation of TTL level and EIA level. We recommend to use the chip of NLSX5014MUTAG. If using the 2-byte serial bus interface, MAX3232 is recommended, and if using the 8-byte serial bus interface, SP3238 or MAX3238 is recommended. The connection mode is as shown in Figure 4-5. Figure 44 Module Serial Port & AP Application Processor All Rights reserved, No Spreading abroad without Permission of ZTEWelink 22 ZM8620_V2APRXDRXDTXDTXDCTSRFRCTSRFRDTRDSRDSRDTRDCDRIRIDCDGNDGND ZM8620_V2 Hardware Development Guide of Module Product Figure 45 The connection of ZM8620_V2 UART and Standard RS-232-C interface 4.7 SPI Interface The SPI signal interface is used to control PCI voices. The SPI_CLK clock is 127.2kHz. Pin No: 3/5/6/7 are SPI control signals. Table 4-6 describes detailed definition for each signal. The system board side needs to convert the power level of SPI_SDI (SPI control output signal cable on the system board side) into 3.3V, to comply with the high power level VIH input requirements. Table 46 Definition and Description of SPI Control Signal Group PIN Signal Name I/O Signal Description 3 5 6 7 SPI_SDI SPI_SDO SPI_CS I O O SPI data signal, ZM8620_V2 input, input high power level is VIH, and low power level is VIL. SPI data signal, ZM8620_V2 output, input high power level is VOH, and low power level is VOL. SPI chip select pin, ZM8620_V2 output, input high power level is VOH, and low power level is VOL. SPI synchronization clock, 100kHz, output by SPI_CLK

--

ZM8620_V2, high power level is VOH, and low power level is VOL. NOTE:

VIH, VIL, VOH, and VOL comply with the power I/O interface power level requirements in 4.2.1. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 23 TTL-RS232 level translator SP3238 MAX3238ZM8620_V2module1.8V-TTL level translator NLSX5014MUTAGUART_DCDUART_DSRUART_CTSUART_RFRUART_DTRUART_RIGNDRS232_DCDRS232_DSRRS232_TXDRS232_CTSRS232_RXDRS232_RTSRS232_DTRRS232_RIGND123456789User BoardFemale DB9Note:UART_RFR is equal To UART_RTS.The level of UART1_Rx and UART1_TX is 3.3V, the other pins of UART is 1.8V and needs the TTL level translatorUART_TXDUART_RXD ZM8620_V2 Hardware Development Guide of Module Product 4.8 Reset Signal PERST#

The PERST# signal (PIN No: 22) is the system reset signal of ZM8620_V2, active low. Table 4-7 illustrates its control logic. It shows that pull down the reset key (PERST#) to 100ms will reset the module. NOTE:

Do not directly connect this signal to the positive end of power supply. Table 47 Definition and Description of PERST# Signal PERST#

ZM8620_V2 Status 1 0 and 100ms ZM8620_V2 is in the normal working status. RF is in the OFF mode, ZM8620_V2 is reset. ZM8620_V2 Figure 46 Reference Circuit Design of PERST# Signal 4.9 WAKE# Signal Figure 4-7 illustrates the reference connection circuit of WAKE# signal. The WAKE# signal (PIN No.: 1) is an output signal, active low level or low fall edge. This signal is a reserved signal for ZM8620_V2 to wake up the system host. ZM8620_V2 pulls up the power level to VDD_3V3 internally by the 10Kohm resistance. It is recommended to connect the 47ohm resistance to the GPIO PIN on the main chip (If this GPIO PIN is on the system side, it can wake up the host). All Rights reserved, No Spreading abroad without Permission of ZTEWelink 24 ZM8620_V2 Hardware Development Guide of Module Product NOTE:

Do not directly connect this signal to the positive end of power supply. ZM8620_V2 Figure 47 Reference Connection Circuit of WAKE# Signal 4.10 W_DISABLE_N Signal The W_DISABLE_N signal (PIN No: 20) is the input signal of ZM8620_V2, active low. Table 4-8 describes its control logic. Table 48 Definition and Description of W_DISABLE_N Signal W_DISABLE_N ZM8620_V2 Status 1 0 RF is enabled. RF is disabled. The W_DISABLE_N signal is pulled up by the 150Kohm resistance to 3.3V inside ZM8620_V2, so the system side does not pull up this circuit any more. NOTE:

Do not directly connect this signal to the positive end of power supply. Figure 4-8 illustrates the reference circuit design of W_DISABLE_N signal. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 25 ZM8620_V2 Hardware Development Guide of Module Product ZM8620_V2 Figure 48 Reference Circuit Design of W_DISABLE_N Signal 4.11 Recommended Upgrade Methods Its recommended to use the one-click software upgrade tool to upgrade through the USB port provided by ZTEWelink in the Windows system. If the customers want to upgrade the module in other operation systems, ZTEWelink provides the corresponding reliable tools too. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 26 ZM8620_V2 Hardware Development Guide of Module Product 5 Electric Feature 5.1 Power Feature 5.1.1 Power Supply The input voltage range of the module is DC 3.1V~3.6V, and the typical value is 3.3V, as shown in Table 5-1. Table 51 Input Voltages Parameter Min Typical Max Input voltage 3.1V 3.3V 3.6V 5.1.2 Working Current The working current range of the module is as shown in Table 5-2 to Table 5-4. The tables provide the working power consumption under LTE and WCMA mode. As the power consumptions are affected by many factors, its normal that there are some differences when tested by users, and these tables can only be viewed as one example. Table 52 Averaged standby DC power consumption Mode Bands Test value (mA) Remark HSDPA/WCDMA UMTS bands GSM/GPRS/EDGE GSM bands LTE LTE bands TBD TBD TBD Sleep mode Sleep mode Sleep mode Note: assumes USB bus is fully suspended during measurements. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. Table 53 DC power consumption in UMTS mode Power Consumption of R99 BAND BAND1 BAND2 BAND5 BAND8 Power Consumption Maximum Transmit power

(Unit: mA)

(23.32dBm) TBD TBD TBD TBD All Rights reserved, No Spreading abroad without Permission of ZTEWelink 27 ZM8620_V2 Hardware Development Guide of Module Product Power Consumption of HSDPA Power Consumption with HS-DPCCH (HSDPA)

(dBm) Maximum Transmit power 22.62 22.56 22.04 22.51 Power Consumption (mA) TBD TBD TBD TBD Power Consumption of HSUPA Power Consumption with HS-DPCCH (HSUPA)

(dBm) Maximum Transmit power 22.2 21.9 21.7 21.7 Power Consumption (mA) TBD TBD TBD TBD Power Consumption of HSPA+

Power Consumption Maximum Transmit power

(Unit: mA)

(22.89dBm) TBD TBD TBD TBD Table 54 DC power consumption in LTE mode (Unit: mA) Test band BAND BAND BAND BAND BAND BAND BAND TDD 1 2 4 5 7 8 12 BAND38 BW 10M band channel 300 650 2175 2450 3400 3500 5130 38200 Power QPSK 1RB Consumpti MAX PWR TBD TBD TBD TBD TBD TBD TBD TBD on QPSK 12RB MAX PWR QPSK 50RB MAX PWR 16QAM 12RG MAX PWR 16QAM 50RG MAX PWR NOTE:

TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Under different environments and conditions (for example: under different band channel, transmit power, power level etc.), the testing values of Table 5-3 and Table 5-4 might be slightly different. Take the actual situation as the reference. 5.2 Power-on/Resetting Flow Table 55 Power-on/Resetting Period All Rights reserved, No Spreading abroad without Permission of ZTEWelink 28 ZM8620_V2 Hardware Development Guide of Module Product No. Status Average Remark Response time of About 12s From the time of module power-on and power-off power-on to port initialization Searching network upon About 15s Depending on the actual power-on network situation 1 2 Note:

1. The specific power-on/power-off response time depends on the actual software versions. The time of searching network upon power-on differs according to the network quality. The above values are only an example. 2. By default, the module is started up upon power-on. 5.3 Resetting Flow The failing edge of PERST# reset signal initiates a reset process. The module is reset by driving this pin with a low pulse. Figure 51 Module Reset Flow All Rights reserved, No Spreading abroad without Permission of ZTEWelink 29 10PERST# signal100msResetting at the edge of rising ZM8620_V2 Hardware Development Guide of Module Product 6 Related Test & Testing Standard 6.1 Testing Reference The related tests of ZM8620_V2 comply with the IEC standard, including the equipment running under high/low temperature, storage under high/low temperature, temperature shock and EMC. Table 6-1 is the list of testing standard, which includes the related testing standards for ZM8620_V2. Table 61 Testing Standard Testing Standard Document Reference IEC6006826 Environmental testing-Part2.6:Test FC: Sinusoidal Vibration IEC60068234 Basic environment testing procedures part2. IEC60068264 Environmental testing-part2-64: Test FH: vibration, broadband random and guidance. IEC60068214 Environmental testing-part 2-14: Test N:change of temperature. IEC60068229 Basic environmental testing procedures-part2: Test EB and guidance. IEC6006822 Environmental testing-part2-2:Test B:dry heat IEC6006821 Environment testing-part2-1: Test A: cold. GB/T 15844.2 MS telecommunication RF wireless phone-set environment requirement & experimental method part 4: Strict level of experimental condition GB/T 2423.17 Basic environment experiment of electronic products-Experiment Ka:

Salt mist experiment method GB/T 2423.5 Basic environment experiment of electronic products-Part2:Experiment method Try Ea & Introduction: Shock GB/T 2423.11 Basic environment experiment of electronic products-Part2:Experiment method Try Fd: Broad frequency band random vibration (General requirement) TIA/EIA 603 3.3.5 TIA Standard-part3-5:Shock Stability Note: 1. IECL International Electro technical Commission; 2. GB/T: Recommended national standard 6.2 Description of Testing Environment The working temperature range of ZM8620_V2 is divided into the normal working temperature range All Rights reserved, No Spreading abroad without Permission of ZTEWelink 30 ZM8620_V2 Hardware Development Guide of Module Product and the extreme working temperature range. Under the normal working temperature range, the testing result of RF complies with the requirements of 3GPP specifications, and its function is normal. Under the extreme temperature range, the RF index basically complies with the 3GPP specifications, and the quality of data communication is affected to a certain extent, but its normal function is not affected. ZM8620_V2 has passed the EMC test. Table 62 is the requirement for the testing environment, and Table 63 lists out the instruments and devices that might be used during the test. Table 62 Testing Environment Working Condition Min Max Remark Temperature Temperature Normal working

-10C 60C All the indexes are condition good. Extreme working

-20C 70C Some indexes condition Storage become poorer.

-40C 85C Storage environment of ZM8620_V2 Table 63 Testing Instrument & Device Testing Item Instrument & Device RF test Comprehensive testing device RF cable Tower antenna Microwave darkroom High/Low-temperature High/Low-temperature running & storage test experimental box Temperature shock test Temperature shock experimental box Vibration test Vibration console 6.3 Reliability Testing Environment The reliability test includes the vibration test, high/low-temperature running, high/low-temperature storage and temperature shock experiment test. Refer to Table 6-4 for the specific parameters. Table 64 Reliability Feature All Rights reserved, No Spreading abroad without Permission of ZTEWelink 31 ZM8620_V2 Hardware Development Guide of Module Product Test Standard Test Condition Test Reference Test Item Random Oscillation Frequency range: 5-20Hz, IEC 68-2-6 PSD:1.0m2/s3;

Frequency range: 20-200Hz, -3dB/oct;

On the 3 axis, 1 hour for each axis Shock Testing Half sine wave shock Acceleration: 20g Short time: 11ms On 6 axis, one shock on each axis (x, y and z) TIA/EIA 603 3.3.5 GB/T 15844.2.4.1 Temperature Shock Low temperature: -40C 2C IEC 68-2-14 Na High temperature: +80C 2C Temperature changing time: less than 30 seconds Testing duration: 2 hours Cycles: 10 High-temperature Temperature: +60C ZTE standard Working Testing duration: 24h Low-temperature Temperature: -10C ZTE standard Working Testing duration: 24h High-temperature Temperature: +55C ZTE standard and high humidity Humidity: 95%

Duration: 48 hours High-temperature Temperature: 85C IEC 68-2-1 Ab Storage Testing duration: 24h Low-temperature Temperature: -40C IEC 68-2-2 Bb Storage Testing duration: 24h 6.4 Reliability Test Result Table 65 Temperature Testing Result under Windless Environment Mode Ambient Voltage Transmission Duration Results Temperature GPRS Class 10

+25C EDGE Class 12

+25C 3.3V 3.3V power Max Max 1 hour Pass 1 hour Pass All Rights reserved, No Spreading abroad without Permission of ZTEWelink 32 WCDMA LTE

+25C

+25C 3.3V 3.3V ZM8620_V2 Hardware Development Guide of Module Product Max Max 1 hour Pass 1 hour Pass Table 66 Test Results of High/low Temperature Running and Reliability Test Test Item Test Conditions and Test Items Results Criteria Random vibration Refer to Table 6-4 RF test and function test Pass Impact test Refer to Table 6-4 RF test and function test Pass Temperature impact Refer to Table 6-4 RF test and function test Pass Running at low Refer to Table 6-4 RF test and function test Pass temperature Running at high Refer to Table 6-4 RF test and function test Pass temperature Running at the limit Refer to Table 6-4 RF test and function test Pass of low temperature Running at the limit Refer to Table 6-4 RF test and function test Pass of high temperature Storage at low Refer to Table 6-4 RF test and function test Pass temperature Storage at high Refer to Table 6-4 RF test and function test Pass temperature All Rights reserved, No Spreading abroad without Permission of ZTEWelink 33 ZM8620_V2 Hardware Development Guide of Module Product 7 RF Specifications The following content is the description of module radio frequency performance. 7.1 Technical Specification for UMTS Mode Radio Frequency 7.1.1 Maximum Transmission Power In the normal test environment, UMTS 2100/1900/850/900/(1700)MHz maximum output power meets the requirement in Table 7-1. The test values are the average of some test samples. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. Table 71 Maximum Transmission Power Power grade Maximum output power Tolerance value Test value Class 3 24dBm

+1/-3dBm TBD 7.1.2 Receiving Sensitivity UMTS 2100/1900/850/900/(1700)MHz receiving sensitivity meets 3GPP TS 34.121 protocol requirement. Under the specification that BER does not exceed 0.001, it meets the requirement in Table 7-2. The test values are the average of some test samples. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. Table 72 Receiving Sensitivity Reference Table Operating Unit DPCH_Ec

<REFIOR> Test value band

<REFSENS>

dBm/3.84 MHz

-117 dBm/3.84 MHz

-115 dBm/3.84 MHz

-117 dBm/3.84 MHz

-115 dBm/3.84 MHz

-114

-106.7

-104.7

-106.7

-104.7

-104.7 TBD TBD TBD TBD TBD NOTE 1: For Power class 3 this shall be at the maximum output power NOTE 2: For Power class 4 this shall be at the maximum output power NOTE 3: For the UE which supports both Band and Band operating frequencies, the reference sensitivity level of -114.5 dBm DPCH_Ec<REFSENS> shall apply for Band . All Rights reserved, No Spreading abroad without Permission of ZTEWelink 34 ZM8620_V2 Hardware Development Guide of Module Product The corresponding <REFIOR> is -104.2 dBm 7.1.3 Spurious Specification Spurious emission meets 3GPP TS 34.121 protocol requirement. The receiver spurious emission power refers to the spurious power generated or amplified by the receiver, which is tested from the antenna connector. The spurious emission shall meet the requirements in Table 7-3 and Table 7-4:

Table 73 General Requirement of Receiver Spurious Emission Frequency band Resolution rate Minimum requirement bandwidth 9 kHz f < 1 GHz 100 kHz 1 GHz f < 12.75 GHz 1 MHz

-57 dBm

-47 dBm Table 74 Additional Spurious Emission Requirement Frequency band Measurement Minimum requirement bandwidth 1920 MHz f 1980 MHz 3.84 MHz 2110 MHz f 2170 MHz 3.84 MHz

-60 dBm

-60 dBm 7.2 Technical Specification of GSM Mode Radio Frequency 7.2.1 Maximum Transmission Power In the normal test environment, GSM: 1900/1800/900/850MHz maximum output power meets the requirement in Table 7-5. The test values are the average of some test samples. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. Table 75 Maximum Transmission Power Operating Power Power Maximum Tolerance Test band control level class output power value 2 2 Class 2 30dBm 2dBm Class 2 30dBm 2dBm Value TBD TBD All Rights reserved, No Spreading abroad without Permission of ZTEWelink 35 ZM8620_V2 Hardware Development Guide of Module Product 2 2 Class 4 33dBm 2dBm Class 4 33dBm 2dBm TBD TBD 7.2.2 Receiving Sensitivity GSM 1900/1800/900/850MHz receiving sensitivity meets 3GPP TS 34.121 protocol requirement. Under the specification that BER does not exceed 2.24, it meets the requirement smaller than -102dBm. It meets the requirement in Table 7-6. The test values are the average of some test samples. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. Table 76 Reference Table of Receiving Sensitivity Operating Band Unit 3GPP Protocol Claim Test value GSM850 dBm/3.84 MHz

-102dBm GSM900 dBm/3.84 MHz

-102dBm GSM1800 dBm/3.84 MHz

-102dBm GSM1900 dBm/3.84 MHz

-102dBm TBD TBD TBD TBD 7.3 Technical Specification of LTE Mode Radio Frequency 7.3.1 Maximum Transmission Power The maximum output power of LTE FDD, LTE TDD in the normal test environment meets Table 7-7 requirement. The test values are the average of some test samples. Under different environments, the testing results might be slightly different. Take the actual situation as the reference. Table 77 Maximum Transmission Power Power grade Maximum output power Tolerance value Test value Class 3 23 dBm

+2.7/-2.7dBm 21.4 dBm 7.3.2 Receiving Sensitivity LTE FDD/TDD receiving sensitivity meets 3GPP TS 36.101 protocol requirement. Under the specification that the throughput is not smaller than 95% of the maximum throughput, it meets Table 7-8 requirement. The test values are the average of some test samples. Under different environments, the All Rights reserved, No Spreading abroad without Permission of ZTEWelink 36 ZM8620_V2 Hardware Development Guide of Module Product testing results might be slightly different. Take the actual situation as the reference. Table 78 Receiving Sensitivity Reference Table E-UTRA Band 1.4 MHz

(dBm) 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz Duplex

(dBm)

(dBm)

(dBm)

(dBm)

(dBm) Mode Channel bandwidth Test value

(dBm)

-97

-95.2

-94 FDD TBD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 17 18 19 20 21 33 34 35 36 37 38 39 40

-

-

-102.7

-99.7

-101.7

-98.7

-100

-98

-97

-104.7

-101.7

-100

-103.2

-100.2

-98

-102.2

-99.2

-101.7

-98.7

-99.2

-100

-98

-97

-99

-100

-100

-97

-97

-97

-102.2

-99.2

-97

-93.2

-92 FDD TBD

-92.2

-95.2

-91

-94 FDD

--

FDD TBD FDD TBD FDD

--

-93.2

-92 FDD TBD

-94.2

-95.2

-93

-94 FDD TBD FDD FDD FDD

--

--

--

FDD TBD

-97

-95.2

-97

-95.2

-94

-91.2

-90 FDD

-100

-97

-95.2 FDD

-95.2

-94 TDD

-100

-100

-97

-100

-100

-106.2

-102.2

-100

-106.2

-102.2

-100

-100

-100

-100

-100

-95.2

-95.2

-95.2

-95.2

-95.2

-95.2

-94

-94

-94

-94

-94

-94 TDD TBD

-95.2

-94 TDD FDD FDD FDD FDD FDD TDD TDD TDD TDD TDD

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

--

-95

-94

-97

-95

-97

-95

-94

-96

-97

-97

-94

-94

-94

-94

-97

-97

-97

-97

-97

-97

-97

-97 All Rights reserved, No Spreading abroad without Permission of ZTEWelink 37 ZM8620_V2 Hardware Development Guide of Module Product 41

[-100]

[-97]

[-95.2]

[-94]

TDD

--

Note 1:

The transmitter shall be set to maximum output power level as defined in clause 6.2.5 in the protocol of 3GPP TS 36.101 Note 2:

Reference measurement channel is specified A.3.2 with one sided dynamic OCNG Pattern OP.1 FDD/TDD as described in Annex A.5.1.1/A.5.2.1 in the protocol of 3GPP TS 36.101 Note 3:

The signal power is specified per port Note 4:

For the UE which supports both Band 3 and Band 9 the reference sensitivity level of Band 3 + 0.5 dB is applicable for band 9 Note 5:

For the UE which supports both Band 11 and Band 21 the reference sensitivity level is FFS. 7.3.3 Spurious Specification Spurious emission meets 3GPP TS 36.101 protocol requirement. The receiver spurious emission power refers to the spurious power generated or amplified by the module, which is tested from the antenna connector. The spurious emission shall meet the requirement of Table 7-9 and Table 7-10:

Table 79 General Requirement of Receiver Spurious Emission Frequency range Maximum level Measurement bandwidth 9 kHz f < 150 kHz

-36 dBm 150 kHz f < 30 MHz

-36 dBm 1 kHz 10 kHz 30 MHz f < 1000 MHz

-36 dBm 100 kHz 1 GHz f < 12.75 GHz

-30 dBm 1 MHz E-UTRA Band Table 710 UE Co-existence Spurious Emission Requirement Spurious emission Protected band Frequency range Level Bandwidth

(MHz)

(dBm)

(MHz) Comment 1 E-UTRA Band 1, 3, 7, 8, 9, 11, 34, 38, 40 FDL_low - FDL_high Frequency range 860-895 1884.5-1919.6 Frequency range 1884.5-1915.7 E-UTRA band 33 E-UTRA band 39 1900-1920 1880-1920

-50

-50

-41

-50

-50 2 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low- FDL_high

-50 1 1 Note6,Note7 0.3 Note 6, Note8 1 1 1 Note 3 Note 3 All Rights reserved, No Spreading abroad without Permission of ZTEWelink 38 ZM8620_V2 Hardware Development Guide of Module Product 3 4 5 6 E-UTRA Band 1, 3, 7, 8, 9, 11, 33, 34, 38 FDL_low- FDL_high

-50 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low- FDL_high

-50 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low- FDL_high E-UTRA Band 1, 9, 11, 34 FDL_low- FDL_high Frequency range Frequency range 860-875 875-895 1884.5-1919.6

-50

-50

-37

-50 1 1 1 1 1 1 Frequency range 1884.5-1915.7

-41 0.3 7 E-UTRA Band 1, 3, 7, 8, 33, 34 FDL_low- FDL_high E-UTRA Band 38 2570-2620 8 E-UTRA Band 1, 8, 7, 33, 34, 38, 39, 40 FDL_low- FDL_high E-UTRA band 3 E-UTRA band 3 E-UTRA band 3 E-UTRA band 7 E-UTRA band 7 1805-1830 1805-1880 1830-1880 2640-2690 2640-2690 9 E-UTRA Band 1, 9, 11, 34 FDL_low- FDL_high Frequency range 860-895 1884.5-1919.6

-50

-50

-50

-50

-36

-50

-50

-36

-50

-50 1 1 1 1 0.1 1 1 0.1 1 1 Frequency range 1884.5-1915.7

-41 0.3 10 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low- FDL_high 11 E-UTRA Band 1, 9, 11, 34 FDL_low- FDL_high Frequency range 860-895 1884.5-1919.6

-50

-50

-50 1 1 1 Frequency range 1884.5-1915.7

-41 0.3 12 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low- FDL_high

-50 13 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low- FDL_high Frequency range 763-775 14 E-UTRA Band 2, 4, 5, 10, 12, 13, 14, 17 FDL_low- FDL_high Frequency range 763-775 17 E-UTRA Band 2, 4, 5, 10,

-50

-35

-50

-35 1 1 0.00625 1 0.00625 12, 13, 14, 17 FDL_low FDL_high

-50 1 Note7 Note8 Note 3 Note 4 Note 2,4 Note 4 Note 4 Note 2,4 Note7 Note8 Note7 Note8 All Rights reserved, No Spreading abroad without Permission of ZTEWelink 39 ZM8620_V2 Hardware Development Guide of Module Product 33 E-UTRA Band 1, 3, 8, 34, 38, 39, 40 FDL_low- FDL_high

-50 34 E-UTRA Band 1, 3, 7, 8, 9, 11, 33, 38,39, 40 FDL_low- FDL_high Frequency range 860-895

-50

-50 1 1 1 Frequency range 1884.5-1915.7

-41 0.3 1884.5-1919.6 E-UTRA Band 1,3, 33, 34 FDL_low- FDL_high E-UTRA Band 34, 40 FDL_low- FDL_high E-UTRA Band 1, 3, 33, 34, 39 FDL_low- FDL_high

-50

-50

-50 1 1 1 Note 5 Note 5 Note7 Note8 FDL_low and FDL_high refer to each E-UTRA frequency band specified in Table 5.5-1 in the protocol of 3GPP TS 36.101 As exceptions, measurements with a level up to the applicable requirements defined in Table 7-9 are permitted for each assigned E-UTRA carrier used in the measurement due to 2nd or 3rd harmonic spurious emissions. An exception is allowed if there is at least one individual RE within the transmission bandwidth (see Figure 5.6-1 in the protocol of 3GPP TS 36.101) for which the 2nd or 3rd harmonic, i.e. the frequency equal to two or three times the frequency of that RE, is within the measurement bandwidth. To meet these requirements some restriction will be needed for either the working band or protected band Requirements are specified in terms of E-UTRA sub-bands For non synchronized TDD operation to meet these requirements some restriction will be needed for either the working band or protected band Applicable when NS_05 in section 6.6.3.3.1 in the protocol of 3GPP TS 36.101 is signaled by the network. Applicable when co-existence with PHS system working in. 1884.5-1919.6MHz. Applicable when co-existence with PHS system working in 1884.5-1915.7MHz. 35 36 37 38 39 40 Note 1 2 3 4 5 6 7 8 All Rights reserved, No Spreading abroad without Permission of ZTEWelink 40 ZM8620_V2 Hardware Development Guide of Module Product 8 Antenna 8.1 RF Antenna Specification 8.1.1 Technical Parameter for the Main Antenna Connector The main and diversity antenna is the product U.FL-R-SMT-1(80)(HRS)/ ECT818000071(ECT). The Profile Dimensions is shown in Figure 8-1. If more technical parameter for the main antenna connector is needed, please contact with ZTEWelink. Figure 81 the Profile Dimensions All Rights reserved, No Spreading abroad without Permission of ZTEWelink 41 ZM8620_V2 Hardware Development Guide of Module Product The PCB layout is shown in the Figure 8-2. Figure 82 Recommended PCB layout NOTE:

The radio frequency bases adopted by the antenna interface of ZM8620_V2 module is U.FL-R-SMT-1(80)(HRS)/ECT818000071(ECT) at present instead of adopting 20429-001E MHF-A13 of I-PEX by ZM8620 before. 8.2 Proposal on Layout of Product in Terminal Product The module layout among other terminal products should take full consideration of the electric magnetic compatibility. As the types of terminal products vary and their circuit layouts are different, when considering the module layout, we should reduce the electric magnetic interference from other devices upon the module. Taking 3G Internet-access laptop as an example, during the layout of laptops, make sure that the module is not adjacent to the switch power or the high-speed signal cable, and well protect the cabling of these interference sources. At the same time, keep the antenna and the coaxial cables of network cables and antenna far away from the interference sources. Keep the module away from the devices that have a large heat-radiating capacity such as CPU, hard disk and south bridge, to guarantee that heat can be radiated effectively. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 42 ZM8620_V2 Hardware Development Guide of Module Product 8.3 Antenna Dimensions and Location The dimensions of different terminal products are different, so they impose different requirements upon the performance of antenna. The dimensions and location of antennas are also different. Taking 3G Internet-access laptop as an example, it is recommended that the antenna be placed on the top of LCD. 8.4 Diversity Antenna Design ZM8620_V2 supports diversity receiving function, and if it is necessary to support diversity, the notebook needs to add diversity antenna. The design method of the diversity antenna is consistent with the main antenna, and its efficiency index is allowed to reduce by 3dB. The isolation of the main antenna and the diversity antenna is required to be bigger than 12dB. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 43 ZM8620_V2 Hardware Development Guide of Module Product 9 Debugging Environment and Method In the process of the actual implementation, it is necessary to adopt the switching board to convert MINI PCIE module interface into the standard USB interface to connect the host for debugging verification. It is also necessary to connect external power supply adaptor to provide the module with sufficient current, and the diagram for the switching board is as follows:

Figure 91 The diagram for the switching board 9.1 Debugging Board Figure 9-2 shows the module debugging & installation method. The debugging board is mainly used to debug the basic functions of ZM8620_V2 module, such as downloading the JTAG program, resetting the module, powering off and shutting down RF, LED indicator display, making a call or browsing web pages via computer UI by inserting the USIM card into the switching board. The USB interface supplies power to the debugging board, provides it to the module after LDO conversion, and directly supplies the power to the module by the power socket on the board. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 44 Module boardComputer hostSwitching boardPower supply adapterPCI Express Mini Card InterfaceUSB PortAC ZM8620_V2 Hardware Development Guide of Module Product 3 2 4 5 7 Module ZM8620_V2 6 1 Figure 92 Debugging Board Note: 1 UIM card console; 2 JTAG downloading interface; 3- DC power interface; 4 USB interface; 5 LED indicator; 6

- PON_RESET_N button (module resetting); 7 W_DISABLE_N button (RF switch) 9.2 Interfaces on Debugging Board 9.2.1 JTAG Interface The JTAG interface can be used to download and debug the firmware program. This interface is reserved in the module of ZM8620_V2. 9.2.2 USB Interface The USB2.0 interface on the debugging board is connected to the PCI-E interface on ZM8620_V2. 9.2.3 Power-supply Interface The USB interface as illustrated in Figure 9-2 supplies power, provides the 3.3V power to the module after LDO conversion, and directly supplies the 3.3V power to the module by the power socket on the board. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 45 ZM8620_V2 Hardware Development Guide of Module Product 9.2.4 USIM Card Console Interface As shown in Figure 9-2, 1 the USIM card console is the 5PIN USIM card console on the conversion board, connecting to: power, ground, UIM_DATA, USIM_CMD and UIM_CLK. It supports the 1.8V/3V USIM card. 9.2.5 PON_RESET_N Button This button corresponds to the PON_RESET_N PIN of the PCI-E interfaced. The user presses the button to reset the module. 9.2.6 W_DISABLE_N Button This button corresponds to the W_DISABLE_N PIN of the PCI-E interface. The user presses this button to enable or disconnect RF, so as to perform the debugging of this PIN. 9.2.7 LED Indicator The LED indicator on the debugging board is connected to the LED_WWAN_N interface of ZM8620_V2. By controlling the indicator, the user can debug the function of this interface. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 46 ZM8620_V2 Hardware Development Guide of Module Product 10 Package System The ZM8620_V2 modules are wrapped with anti-static shielding bags, which is packaged on EPE trays of 6 pieces each. And these modules are put into cardboard box in a set of 10 trays. Each cardboard box is with 60 modules typically. The package process of ZM8620_V2 modules is shown as the Figure below. The unit of dimensions is mm. Figure 101 Package process of ZM8620_V2 modules 10 trays Cardboard box All Rights reserved, No Spreading abroad without Permission of ZTEWelink 47 ZM8620_V2 Hardware Development Guide of Module Product 11 Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal incorporating ZM8620_V2 module. Manufacturers of the cellular terminal should send the following safety information to users, operating personnel and to incorporate these guidelines into all manuals supplied with the product. The use of this product may be dangerous and has to be avoided in the following areas:

Where it can interfere with other electronic devices in environments such as hospitals, aircrafts, airports, etc, switch off before boarding an aircraft. Make sure the cellular terminal is switched off in these areas. The operation of wireless appliances in the hospitals, aircrafts and airports are forbidden to prevent interference with communication systems. Areas with potentially explosive atmospheres including fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as gasoline stations, oil refineries, etc make sure that wireless devices are turned off. Its the responsibility of users to enforce other country regulations and the specific environment regulations. And ZTEWelink does not take on any liability for customer failure to comply with these precautions. All Rights reserved, No Spreading abroad without Permission of ZTEWelink 48 12.NOTICE Note1This device complies with Part 15 of the FCC RulesOperation is subject to the following two conditions:

(1) this device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation. Note2: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Note3: For EUT which intended use is at least 20 cm between human body and antenna. Note4: Label of The End Product The final end product must be labeled in a visible are with the following Contains TX FCC ID:SRQ-ZM8620.The FCC part 15.19 statement below has to also be available on the label:This device complies with Part 15 of FCC rules.Operation is subject to the foll owing two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause u ndesired operation. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation. A user manual with the end product must clearly indicate the operating requirements a nd conditions that must be observed to ensure compliance with current FCC RF expos ure guidelines. The end product with an Module may also need to pass the FCC Part 1 5 unintentional emission testing requirements and be properly authorized per FCC Part 15. Note:If this module is intended for use in a portable device,you are responsible for separate approval to satify the SAR requirements of FCC Part 2.1093.

 

 

 

 

 

 

 

 

 

 

ZTE 209620 LTE Wireless Data Terminal FCC ID:SRQ-ZM8620 IMEI:XXXXXXXXXXXXXXX LMM eg S/N:XXXXXXXXXXXX ZTE CORPORATION Size:30*25mm

 

 

CONFIDENTIALITY REQUEST for Certification Service in USA Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 Date:Oct.16, 2014 TO WHOM IT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, we requests confidentiality for the following products:

FCC ID SRQ-ZM8620 For the product stated above, we request permanent confidentiality for exhibits which contain Operational Description, Block Diagram, Schematics, Parts Lists or Tune Up Information. The above exhibits contain our trade secrets and proprietary information that could be of benefit to our competitors. If you have any questions, please feel free to contact me at the address shown below. Sincerely, Model name ZM8620

(Signed) Name:Min Zhang Company: ZTE CORPORATION Address: ZTE Plaza, Keji Road South, Shenzhen, China Phone: +86-18616587757 Fax: +86-21-50801070 Email:zhang.min13@zte.cm.cn

 

 

Company Letter head IC/FCC Modular Approval Statement Receiver Federal Communication Commission Equipment Authorization Devision, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 Certification and Engineering Bureau Industry Canada Spectrum Engineering Branch 3701 Carling Avenue, Building 94 Ottawa, Ontario K2H 8S2 Subject:

Modular Approval Statement Date: Oct 20, 2014 FCC Certification Number: SRQ-ZM8620 Model Name/Number: ZM8620 TO WHOM IT MAY CONCERN Pursuant to Paragraphs RSS-GEN Issue 3 December 2010 Item 3.2.2 and CFR 15.212, we herewith declare for our module. Modular approval requirement Yes No *

(a) The radio elements must have the radio frequency circuitry be shielded. Physical/discrete and tuning capacitors may be located external to the shield, but must be on the module assembly. YES

*Please provide a detailed explanation if the answer is No.:

(b) The module shall have buffered modulation/data input(s) (if such inputs are provided) to ensure that the module will comply with the requirements set out in the applicable RSS standard under conditions of excessive data rates or over-modulation.

*Please provide a detailed explanation if the answer is No.:

(c) The module shall have its own power supply regulation on the module. This is to ensure that the module will comply with the requirements set out in the applicable standard regardless of the design of the power supplying circuitry in the host device which houses the module.

*Please provide a detailed explanation if the answer is No.:

(d) The module shall comply with the provisions for external power amplifiers and antennas detailed in this standard. The equipment certification submission shall contain a detailed description of the configuration of all antennas that will be used with the module.

*Please provide a detailed explanation if the answer is No.:

YES YES YES

(e) The module shall be tested for compliance with the applicable standard in a stand-alone configuration, i.e. the module must not be inside another device during testing. Yes 1 Company Letter head IC/FCC Modular Approval Statement

*Please provide a detailed explanation if the answer is No.:

Yes Yes labeling

(f) The module shall comply with the Category I equipment requirements and CFR 15.212(a)(1)(vi).

*Please provide a detailed explanation if the answer is No.:

(g) The module shall comply with applicable RSS-102 exposure requirements and any applicable FCC RF exposure requirement which are based on the intended use/configurations.

*Please provide a detailed explanation if the answer is No.:

Only applicable for IC certification:

(h) Is the modular device for an Industry Canada licensed exempt service?

*Please provide a detailed explanation if the answer is No.:

Only applicable for FCC certification:

(i) The modular transmitter complies with all applicable FCC rules. Instructions for maintaining compliance are given in the user instructions. If you have any questions, please feel free to contact us at the address shown below Best Regards, Yes ______________________ Name of person authorized to sign Company name: ZTE CORPORATION Address :ZTE Plaza, Keji Road South, Shenzhen, China Phone No:. +86-18616587757 2