AP-02FC Blutooth LE Module Specification Ver0.4 Product Specification Bluetooth LE 5 Module Model Name:
AP-02FC VERSION: 0.4 20F-B, No.98, Sec. 1, Xintai 5th Rd., Xizhi Dist, New Taipei City 22102, Taiwan TEL: 886-2-28961888 FAX: 886-2-28961899 AP-02FP Blutooth LE Module Specification Ver0.4 TABLE OF CONTENTS 1. INTRODUCTIONS AND SCOPE 2. FEATURES 3. MECHANICAL CHARACTERISTICS 4. EXTERNAL DIMENSION 5. PIN ASSIGNMENT AND DESCRIPTION 6. ELECTRICAL CHARACTERISTICS 6.1 ABSOLUTE MAXIMUM RATINGS 6.2 RECOMMENDED OPERATING CONDITIONS 6.3 ELECTRICAL PERFORMANCE SPECIFICATION 7. SHIPPING PACKAGE 1 2 3 4 5 7 7 7 7 10 AP-02FP Blutooth LE Module Specification Ver0.4 1. INTRODUCTIONS AND SCOPE AP-02FP is a Bluetooth low energy (BLE) module. It uses ON Semiconductor BLE controller RSL10, which is an ultralowpower, highly flexible multiprotocol 2.4 GHz radio chipset. AP-02FP is designed for highperformance wearable, medical, and industrial applications. The module integrates PCB antenna, crystal, and controller relative circuit, customer can easily apply it in product. April 20, 2020 1 AP-02FP Blutooth LE Module Specification Ver0.4 Rx Sensitivity (Bluetooth Low Energy Mode, 1 Mbps): 94 dBm 2. FEATURES Bluetooth 5 Certified with LE 2M PHY Support Designed with PCB antenna Build in 48MHz system clock crystal Transmitting Power: 17 to +6 dBm Build in Arm CortexM3 Processor Build in LPDSP32 for Audio Codec Support lower voltage to 1.1V Support Audio Streaming at 7 kHz BW 384 kB of Flash Memory Supports FOTA Operating Frequency: 2402 MHz ~ 2480 MHz Channel Spacing: 2 MHz Channel number: 40 Data Rate: 1Mbps, 2Mbps Operation Voltage: 3.3 Vdc Modulation: GFSK Maximum Output Power: 0.96 mW (0.19 dBm) 2 April 20, 2020 AP-02FP Blutooth LE Module Specification Ver0.4 1.0g (L x W x H, with metal cover) 3. MECHANICAL CHARACTERISTICS 3.1 Weight and Dimension Weight: 0.8g (L x W x H, without metal cover) Dimension: 20mm x 14mm x 2mm (L x W x H, without metal cover) 3.2 Module Picture 20mm x 14mm x 2.7mm (L x W x H, with metal cover) Top Side Bottom Side Top Side with Cover April 20, 2020 3 AP-02FP Blutooth LE Module Specification Ver0.4 4. EXTERNAL DIMENSION 4.1 Outline Dimension of PCBA (Unit: mm) April 20, 2020 4 AP-02FP Blutooth LE Module Specification Ver0.4 5. PIN ASSIGNMENT AND DESCRIPTION 5.1 Pin Assignment Top Side View 5.2 Pin Descriptions Pin Symbol 1 2 3 4 GND WAKEUP DIO[1]
VDDM NREST 5 DIO[9]
6 DIO[2]
7 DIO[4]
8 9 DIO[3]
10 DIO[8]
11 DIO[5]
12 DIO[6]
13 DIO[7]
14 DIO[10]
JTCK 15 JTMS 16 17 VBAT 18 DIO[0]
19 DIO[12]
20 DIO[11]
April 20, 2020 I/O I I/O I/O I I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I I/O I/O I/O A/D P A A/D P D A/D A/D D A/D D D D D D D D P A/D D D Pull U/D U1 U/D U/D U/D U/D U/D U/D U/D U/D U/D U U U/D U/D U/D Description Ground Wakeup pin for power modes Digital input output / ADC 1 LDO output for memories voltage supply Reset pin Digital input output Digital input output / ADC 2 Digital input output 4 Digital input output / ADC 3 Digital input output 8 Digital input output 5 Digital input output 6 Digital input output 7 Digital input output 10 CM3JTAG Test Clock CM3JTAG Test Mode State Battery input voltage Digital input output / ADC 0 Digital input output 12 Digital input output 11 5 AP-02FP Blutooth LE Module Specification Ver0.4 P Ground 21 GND Legend:
Type: A = analog; D = digital; I = input; O = output; P = power Pull: U = pull up; D = pull down Pull up: selectable between 10 k_ and 250 k_. U1 = pull up, 200 k_. Pull down: 250 k_ All digital pads have a Schmitt trigger input. All DIO pads have a programmable I2C low pass filter. All DIOs can be configured to no pull. April 20, 2020 6 AP-02FP Blutooth LE Module Specification Ver0.4 6. ELECTRICAL CHARACTERISTICS 6.1 Absolute Maximum Ratings Symbol VBAT VDDO Par Power supply voltage I/O supply voltage T functional Functional temperature range T storage Storage temperature range Min 40 40 Max 3.63 3.63 85 85 Unit V V C C 6.2 Recommended Operating Conditions Symbol Description VBAT Supply voltage operating range Condition Input supply voltage on VBAT pin
(Note 1) Min Typ 1.25 1.25 Max Units 3.3 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 6.3 Electrical Performance Specification Unless otherwise noted, the specifications mentioned in the table below are valid at 25C at VBAT = VDDO = 1.25 V. Description Symbol Conditions Min Typ Max Units IVBAT IVBAT IVBAT RX Mode, ON Semiconductor propri- etary audio streaming protocol at 7 kHz audio BW, 5.5 ms delay. TX Mode, ON Semiconductor propri- etary audio streaming protocol at 7 kHz audio BW, 5.5 ms delay. Transmit pow- er: 0 dBm RX Mode, ON Semiconductor propri- etary audio streaming protocol at 7 kHz audio BW, 37 ms delay. 1.8 mA 1.8 mA 1.15 mA Ids1 Wake up from wake up pin. 50 nA Ids2 Embedded 32 kHz oscillator running with interrupts from timer or external pin. 90 nA OVERALL Current consumption RX, VBAT = 1.25 V, low latency Current consumption TX, VBAT = 1.25 V, low latency Current consumption RX, VBAT = 1.25 V Deep sleep current, example 1, VBAT = 1.25 V Deep sleep current, example 2, VBAT = 1.25 V April 20, 2020 7 AP-02FP Blutooth LE Module Specification Ver0.4 Ids3 As Ids2 but with 8 kB RAM data reten- tion. 300 nA Istb Digital blocks and memories are not clocked and are powered at a reduced voltage. 30 A IVBAT IVBAT RX Mode, ON Semiconductor propri- etary audio streaming protocol at 7 kHz audio BW, 5.5 ms delay. TX Mode, ON Semiconductor propri- etary audio streaming protocol at 7 kHz audio BW, 5.5 ms delay. Transmit pow- er: 0 dBm 0.9 mA 0.9 mA Ids1 Wake up form wake up pin. 25 nA Ids2 Embedded 32 kHz oscillator running with interrupts from timer or external pin. 40 nA Ids3 As Ids2 but with 8 kB RAM data reten- tion. 100 nA Standby Mode current, VBAT =
3 V Istb Digital blocks and memories are not clocked and are powered at a reduced voltage. 17 A Deep sleep current, example 3, VBAT = 1.25 V Standby Mode current, VBAT =
1.25 V Current consumption RX, VBAT = 3 V Current consumption TX, VBAT = 3 V Deep sleep current, example 1, VBAT = 3 V Deep sleep current, example 2, VBAT = 3 V Deep sleep current, example 3, VBAT = 3 V April 20, 2020 8 RADIO FRONTEND: General Specifications Frequency range FRF Supported carrier frequencies 2360 2500 MHz AP-02FP Blutooth LE Module Specification Ver0.4 Current consumption at 1 Mbps, VBAT = 1.25 V Current consumption at 2 Mbps, VBAT = 1.25 V Current consumption at 1 Mbps, VBAT = 3 V, DCDC Current consumption at 2 Mbps, VBAT = 3 V, DCDC IBATRFRX VDDRF = 1.1 V, 100% duty cycle 5.6 IBATRFRX VDDRF = 1.1 V, 100% duty cycle 6.2 IBATRFRX VDDRF = 1.1 V, 100% duty cycle 3.0 IBATRFRX VDDRF = 1.1 V, 100% duty cycle 3.4 RX Sensitivity, 0.25 Mbps 0.1% BER (Notes 7, 8) RX Sensitivity, 0.5 Mbps 0.1% BER (Notes 7, 8) RX Sensitivity, 1 Mbps, BLE RX Sensitivity, 2 Mbps, BLE 0.1% BER (Notes 7, 8) Singleended on chip antenna match to 50 Q 0.1% BER (Notes 7, 8) 97 96 94 92 mA mA mA mA dBm dBm dBm dBm April 20, 2020 9 AP-02FP Blutooth LE Module Specification Ver0.4 7. RF Warnings April 20, 2020 10 NCC statement: FCC Statement: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and a human body. If theidentification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module, Contains FCC ID: XXXXXXXX, (XXXX should be corrected in accordance with current module ID). Colocation of this module with other transmitters that operate simultaneously are required to be evaluated using the multitransmitter procedures. The host integrator must follow the integration instructions provided in this document and ensure that the compositesystem end product complies with the requirements by a technical assessment or evaluation to the rules and to KDB Publication 996369. The host integrator installing this module into their product must ensure that the final composite product complies with the requirements by a technical assessment or evaluation to the rules, including the transmitter operation and should refer to guidance in KDB 996369.