ESP32MINI1U Datasheet Containing UltraLowPower SoC with SingleCore CPU Supporting 2.4 GHz WiFi, Bluetooth, and Bluetooth LE Pre-release v0.5 Espressif Systems Copyright 2021 www.espressif.com About This Document This document provides specifications for the ESP32-MINI-1U module. Document Updates Please always refer to the latest version on https://www.espressif.com/en/support/download/documents. Revision History For revision history of this document, please refer to the last page. Documentation Change Notification Espressif provides email notifications to keep customers updated on changes to technical documentation. Please subscribe at www.espressif.com/en/subscribe. Certification Download certificates for Espressif products from www.espressif.com/en/certificates. 1 Module Overview 1 Module Overview 1.1 Features MCU Class-1, class-2, and class-3 transmitter ESP32-U4WDH embedded, Xtensa single-core AFH 32-bit LX6 microprocessor, up to 160 MHz CVSD and SBC 448 KB ROM 520 KB SRAM 16 KB SRAM in RTC WiFi 802.11b/g/n Bit rate: 802.11n up to 150 Mbps A-MPDU and A-MSDU aggregation 0.4 s guard interval support Center frequency range of operating channel:
2412 ~ 2484 MHz Power Conducted:15dBm Bluetooth Hardware Interfaces: SD card, UART, SPI, SDIO, I2C, LED PWM, motor PWM, I2S, infrared remote controller, pulse counter, GPIO, touch sensor, ADC, DAC, Two-Wire Automotive Interface (TWAI, compati-
ble with ISO11898-1) 40 MHz crystal oscillator 4 MB SPI flash Operating voltage/Power supply: 3.0 ~ 3.6 V Operating temperature range: 40 ~ 85 C Dimensions:
(13.20 0.15) (13.50 0.15)
(2.40 0.15) mm (including shield cover) Bluetooth V4.2 BR/EDR and Bluetooth LE speci-
Certification fication Power Conducted:7dBm 1.2 Description Green certification: REACH/RoHS ESP32-MINI-1U is a highly-integrated, small-sized Wi-Fi + Bluetooth + Bluetooth LE MCU module that has a rich set of peripherals. This module is an ideal choice for a wide variety of IoT applications, ranging from home automation, smart building, consumer electronics to industrial control, especially suitable for applications within a compact space, such as bulbs, switches and sockets. ESP32-MINI-1U is an SMD module, with 4 MB SPI flash and a U.FL to connect with an external IPEX antenna. At the core of this module is ESP32-U4WDH*, an Xtensa 32-bit LX6 CPU that operates at up to 160 MHz. The user can power off the CPU and make use of the low-power coprocessor to constantly monitor the peripherals for changes or exceeding of thresholds. This ESP32 chip integrates a rich set of peripherals, ranging from capacitive touch sensor, Hall sensor, SD card interface, Ethernet, high-speed SPI, UART, I2S, I2C, etc. Note:
* For more information on ESP32 chips, please refer to ESP32 Series Datasheet. Espressif Systems 3 ESP32-MINI-1U Datasheet v0.5 1 Module Overview 1.3 Applications Generic Low-power IoT Sensor Hub Smart Building Generic Low-power IoT Data Loggers Industrial Automation Cameras for Video Streaming Over-the-top (OTT) Devices USB Devices Speech Recognition Image Recognition Mesh Network Home Automation Smart Agriculture Audio Applications Health Care Applications Wi-Fi-enabled Toys Wearable Electronics Retail & Catering Applications Espressif Systems 4 ESP32-MINI-1U Datasheet v0.5 Contents Contents 1 Module Overview 1.1 Features 1.2 1.3 Description Applications 2 Block Diagram 3 Pin Definitions 3.1 Pin Layout 3.2 3.3 Pin Description Strapping Pins 4 Electrical Characteristics 4.1 Absolute Maximum Ratings 4.2 4.3 4.4 Recommended Operating Conditions DC Characteristics (3.3 V, 25 C) Current Consumption Characteristics 4.5 Wi-Fi RF Characteristics 4.5.1 Wi-Fi RF Standards 4.5.2 Transmitter Characteristics 4.5.3 Receiver Characteristics 4.6 Bluetooth Radio 4.6.1 Receiver Basic Data Rate 4.6.2 Transmitter Basic Data Rate 4.6.3 Receiver Enhanced Data Rate 4.6.4 Transmitter Enhanced Data Rate 4.7 Bluetooth LE Radio 4.7.1 Receiver 4.7.2 Transmitter 5 Module Schematics 6 Peripheral Schematics 7 Physical Dimensions and PCB Land Pattern 7.1 Physical Dimensions 7.2 7.3 Recommended PCB Land Pattern U.FL Connector Dimensions 8 Product Handling 8.1 Storage Conditions 8.2 8.3 Electrostatic Discharge (ESD) Reflow Profile 3 3 3 4 9 10 10 10 12 14 14 14 14 15 16 16 16 17 18 18 18 19 20 20 20 21 22 23 24 24 25 26 27 27 27 27 Espressif Systems 5 ESP32-MINI-1U Datasheet v0.5 Contents 9 MAC Addresses and eFuse 10 Learning Resources 10.1 Must-Read Documents 10.2 Must-Have Resources Revision History 28 29 29 29 30 Espressif Systems 6 ESP32-MINI-1U Datasheet v0.5 List of Tables List of Tables 1 2 3 4 5 6 7 Pin Definitions Strapping Pins Absolute Maximum Ratings Recommended Operating Conditions DC Characteristics (3.3 V, 25 C) Current Consumption Depending on RF Modes Current Consumption Depending on Work Modes 8 Wi-Fi RF Standards 9 Transmitter Characteristics 10 Receiver Characteristics 11 Receiver Characteristics Basic Data Rate 12 Transmitter Characteristics Basic Data Rate 13 Receiver Characteristics Enhanced Data Rate 14 Transmitter Characteristics Enhanced Data Rate 15 Receiver Characteristics Bluetooth LE 16 Transmitter Characteristics Bluetooth LE 10 12 14 14 14 15 16 16 17 17 18 18 19 20 20 21 Espressif Systems 7 ESP32-MINI-1U Datasheet v0.5 List of Figures List of Figures 1 2 3 4 5 6 7 8 ESP32-MINI-1U Block Diagram Pin Layout (Top View) ESP32-MINI-1U Schematics Peripheral Schematics Physical Dimensions Recommended PCB Land Pattern U.FL Connector Dimensions Reflow Profile 9 10 22 23 24 25 26 27 Espressif Systems 8 ESP32-MINI-1U Datasheet v0.5 3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Section 7.1 Physical Dimensions. Figure 2: Pin Layout (Top View) 3.2 Pin Description ESP32-MINI-1U has 55 pins. See pin definitions in Table 1. Table 1: Pin Definitions Name GND 3V3 I36 I37 I38 I39 No. Type Function 1, 2, 27, 38 ~ 55 3 4 5 6 7 P P I I I I Ground Power supply GPIO36, ADC1_CH0, RTC_GPIO0 GPIO37, ADC1_CH1, RTC_GPIO1 GPIO38, ADC1_CH2, RTC_GPIO2 GPIO39, ADC1_CH3, RTC_GPIO3 Espressif Systems 10 ESP32-MINI-1U Datasheet v0.5 Contd on next page Pin 55GNDGNDGNDGNDGNDGNDGNDGNDGND3V3I37I38I39ENI34I35IO32GNDI36IO33IO25IO26IO27IO14IO12IO13IO15IO2IO0IO4NCNCIO9IO10GNDIO23NCIO19IO22IO21RXD0TXD0NCGNDGNDGNDIO18IO5GNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDPin 1Pin 2Pin 3Pin 4Pin 5Pin 6Pin 7Pin 8Pin 9Pin 10Pin 11Pin 12Pin 13Pin 14Pin 15Pin 16Pin 17Pin 18Pin 19Pin 20Pin 21Pin 22Pin 23Pin 24Pin 25Pin 26Pin 27Pin 28Pin 29Pin 30Pin 31Pin 32Pin 33Pin 34Pin 35Pin 36Pin 37Pin 38Pin 39Pin 40Pin 41Pin 42Pin 43Pin 44Pin 45Pin 46Pin 47Pin 48Pin 49Pin 50Pin 51Pin 52Pin 53Pin 54 3 Pin Definitions Name No. Type Function Table 1 contd from previous page EN I34 I35 IO32 IO33 IO25 IO26 IO27 IO14 IO12 IO13 IO15 IO2 IO0 IO4 NC NC IO9 IO10 NC IO5 IO18 IO23 IO19 IO22 IO21 RXD0 TXD0 NC 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 28 29 30 31 32 33 34 35 36 37 High: enables the chip Low: the chip powers off Note: do not leave the pin floating GPIO34, ADC1_CH6, RTC_GPIO4 GPIO35, ADC1_CH7, RTC_GPIO5 I I I I/O GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 I/O GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, I/O I/O I/O I/O TOUCH8, RTC_GPIO8 GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 I/O GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 I/O GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER I/O GPIO15, ADC2_CH3, TOUCH3, RTC_GPIO13, MTDO, HSPICS0, HS2_CMD, SD_CMD, EMAC_RXD3 I/O GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 I/O GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK I/O GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER No connect No connect GPIO9, HS1_DATA2, U1RXD, SD_DATA2 GPIO10, HS1_DATA3, U1TXD, SD_DATA3 No connect GPIO5, HS1_DATA6, VSPICS0, EMAC_RX_CLK GPIO18, HS1_DATA7, VSPICLK GPIO23, HS1_STROBE, VSPID GPIO19, VSPIQ, U0CTS, EMAC_TXD0 GPIO22, VSPIWP, U0RTS, EMAC_TXD1 GPIO21, VSPIHD, EMAC_TX_EN GPIO3, U0RXD, CLK_OUT2 GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 No connect
I/O I/O
I/O I/O I/O I/O I/O I/O I/O I/O
1 Pins GPIO6, GPIO7, GPIO8, GPIO11, GPIO16, and GPIO17 on the ESP32-U4WDH chip are connected to the SPI flash integrated on the module and are not led out. 2 For peripheral pin configurations, please refer to ESP32 Series Datasheet. Espressif Systems 11 ESP32-MINI-1U Datasheet v0.5 3 Pin Definitions 3.3 Strapping Pins ESP32 has five strapping pins, which can be seen in Chapter 5 Schematics:
MTDI = IO12 GPIO0 = BOOT/IO0 GPIO2 = IO2 MTDO = IO15 GPIO5 = IO5 Software can read the values of these five bits from register GPIO_STRAPPING. During the chips system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of the strapping pins sample the voltage level as strapping bits of 0 or 1, and hold these bits until the chip is powered down or shut down. The strapping bits configure the devices boot mode, the operating voltage of VDD_SDIO and other initial system settings. Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of the strapping pins. To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host MCUs GPIOs to control the voltage level of these pins when powering on ESP32. After reset release, the strapping pins work as normal-function pins. Refer to Table 2 for a detailed boot-mode configuration by strapping pins. Table 2: Strapping Pins Voltage of Internal LDO (VDD_SDIO) Pin Default MTDI Pull-down 3.3 V 0 Pin GPIO0 Default Pull-up Booting Mode SPI Boot 1 GPIO2 Pull-down Dont-care 1.8 V 1 Download Boot 0 0 Enabling/Disabling Debugging Log Print over U0TXD During Booting Pin MTDO Default Pull-up U0TXD Active U0TXD Silent 1 0 Timing of SDIO Slave Pin MTDO GPIO5 Default Pull-up Pull-up FE Sampling FE Sampling RE Sampling RE Sampling FE Output RE Output FE Output RE Output 0 0 0 1 1 0 1 1 Espressif Systems 12 ESP32-MINI-1U Datasheet v0.5 3 Pin Definitions Note:
FE: falling-edge, RE: rising-edge Firmware can configure register bits to change the settings of Voltage of Internal LDO (VDD_SDIO)and Timing of SDIO Slave, after booting. The module integrates a 3.3 V SPI flash, so the pin MTDI cannot be set to 1 when the module is powered up. Espressif Systems 13 ESP32-MINI-1U Datasheet v0.5 4 Electrical Characteristics 4 Electrical Characteristics 4.1 Absolute Maximum Ratings Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions. Table 3: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage Tstore Storage temperature 0.3 40 3.6 85 V C Note:
Please see Appendix IO_MUX of ESP32 Series Datasheet for IOs power domain. 4.2 Recommended Operating Conditions Table 4: Recommended Operating Conditions Symbol Parameter VDD33 Power supply voltage IV DD T Current delivered by external power supply Operating temperature Humidity Humidity condition Min Typ Max Unit 3.0 0.5 40 3.3
3.6
85 V A C
85
- %RH 4.3 DC Characteristics (3.3 V, 25 C) Table 5: DC Characteristics (3.3 V, 25 C) Symbol Parameter Min Typ Max Unit CIN VIH VIL IIH IIL VOH VOL IOH Pin capacitance High-level input voltage Low-level input voltage High-level input current Low-level input current High-level output voltage Low-level output voltage High-level source current
(VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum)
0.75VDD1 0.3
0.8VDD1
2
40 40 20
VDD1+0.3 0.25VDD1 50 50
0.1VDD1 pF V V nA nA V V
- mA
- mA
- mA VDD3P3_CPU power domain 1, 2 VDD3P3_RTC power domain 1, 2 VDD_SDIO power domain 1, 3 Espressif Systems 14 ESP32-MINI-1U Datasheet v0.5 4 Electrical Characteristics Symbol Parameter Min Typ Max Unit IOL RP U RP D VIL_nRST Low-level sink current
(VDD1 = 3.3 V, VOL = 0.495 V, output drive strength set to the maximum) Resistance of internal pull-up resistor Resistance of internal pull-down resistor Low-level input voltage of CHIP_PU to power off the chip Note:
28 45 45
- mA
k k 0.6 V 1. Please see Appendix IO_MUX of ESP32 Series Datasheet for IOs power domain. VDD is the I/O voltage for a particular power domain of pins. 2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced from around 40 mA to around 29 mA, as the number of current-source pins increases. 3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. 4.4 Current Consumption Characteristics With the use of advanced power-management technologies, ESP32 can switch between different power modes. For details on different power modes, please refer to Section RTC and Low-Power Management in ESP32 Series Datasheet. Table 6: Current Consumption Depending on RF Modes Work mode Description Peak (mA) Active (RF working) TX RX 802.11b, 20 MHz, 1 Mbps, @15 dBm 802.11g, 20 MHz, 54 Mbps, @15 dBm 802.11n, 20 MHz, MCS7, @13 dBm 802.11n, 40 MHz, MCS7, @13 dBm 802.11b/g/n, 20 MHz 802.11n, 40 MHz 379 276 258 260 112 118 Note:
The current consumption measurements are taken with a 3.3 V supply at 25 C of ambient temperature at the RF port. All transmittersmeasurements are based on a 100% duty cycle. The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle. Espressif Systems 15 ESP32-MINI-1U Datasheet v0.5 4 Electrical Characteristics Table 7: Current Consumption Depending on Work Modes Work mode Modem-sleep 1, 2 Light-sleep Deep-sleep The CPU is powered on 3 Description 160 MHz Normal speed: 80 MHz The ULP co-processor is powered on 4 ULP sensor-monitored pattern 5 RTC timer + RTC memory RTC timer only Power off CHIP_PU is set to low level, the chip is powered off Current consumption (Typ) 27 ~ 34 mA 20 ~ 25 mA 0.8 mA 150 A 100 A @1% duty 10 A 5 A 1 A 1 The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and the cache idle. 2 When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current consumption changes accordingly. 3 In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load and the peripherals used. 4 During Deep-sleep, when the ULP coprocessor is powered on, peripherals such as GPIO and RTC I2C are able to operate. 5 The ULP sensor-monitored pattern refers to the mode where the ULP coprocessor or the sensor works periodically. When ADC works with a duty cycle of 1%, the typical current consumption is 100 A. 4.5 WiFi RF Characteristics 4.5.1 WiFi RF Standards Table 8: WiFi RF Standards Name Center frequency range of operating channel 1 Wi-Fi wireless standard Description 2412 ~ 2484 MHz IEEE 802.11b/g/n Data rate Antenna type 11b: 1, 2, 5.5 and 11 Mbps 20 MHz 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 40 MHz 11n: MCS0-7, 72.2 Mbps (Max) 11n: MCS0-7, 150 Mbps (Max) IPEX antenna2 1 Device should operate in the center frequency range allocated by regional regulatory authorities. Target center frequency range is configurable by software. 2 For the modules that use IPEX antennas, the output impedance is 50 . For other modules without IPEX antennas, users do not need to concern about the output impedance. 4.5.2 Transmitter Characteristics Target TX power is configurable based on device or certification requirements. The default characteristics are provided in Table 9. Espressif Systems 16 ESP32-MINI-1U Datasheet v0.5 4 Electrical Characteristics Table 9: Transmitter Characteristics Parameter Rate Typ Unit TX Power 11b, 1 Mbps 11b, 11 Mbps 11g, 6 Mbps 11g, 54 Mbps 11n, HT20, MCS0 11n, HT20, MCS7 11n, HT40, MCS0 11n, HT40, MCS7 15 15 15 15 15 15 15 15 dBm 4.5.3 Receiver Characteristics Table 10: Receiver Characteristics Parameter RX Sensitivity Rate 1 Mbps 2 Mbps 5.5 Mbps 11 Mbps 6 Mbps 9 Mbps 12 Mbps 18 Mbps 24 Mbps 36 Mbps 48 Mbps 54 Mbps 11n, HT20, MCS0 11n, HT20, MCS1 11n, HT20, MCS2 11n, HT20, MCS3 11n, HT20, MCS4 11n, HT20, MCS5 11n, HT20, MCS6 11n, HT20, MCS7 11n, HT40, MCS0 11n, HT40, MCS1 11n, HT40, MCS2 11n, HT40, MCS3 11n, HT40, MCS4 11n, HT40, MCS5 11n, HT40, MCS6 11n, HT40, MCS7 Typ Unit dBm 97 94 92 88 93 91 89 87 84 80 77 75 92 88 86 83 80 76 74 72 89 85 83 80 76 72 71 69 Espressif Systems 17 ESP32-MINI-1U Datasheet v0.5 4 Electrical Characteristics Parameter Rate Typ Unit RX Maximum Input Level 11b, 1 Mbps 11b, 11 Mbps 11g, 6 Mbps 11g, 54 Mbps 11n, HT20, MCS0 11n, HT20, MCS7 11n, HT40, MCS0 11n, HT40, MCS7 Adjacent Channel Rejection 11b, 11 Mbps 11g, 6 Mbps 11g, 54 Mbps 11n, HT20, MCS0 11n, HT20, MCS7 11n, HT40, MCS0 11n, HT40, MCS7 dBm dB 5 5 0 8 0 8 0 8 35 27 13 27 12 16 7 4.6 Bluetooth Radio 4.6.1 Receiver Basic Data Rate Table 11: Receiver Characteristics Basic Data Rate Parameter Sensitivity @0.1% BER Maximum received signal @0.1% BER Co-channel C/I Adjacent channel selectivity C/I Out-of-band blocking performance Conditions
F = F0 + 1 MHz F = F0 1 MHz F = F0 + 2 MHz F = F0 2 MHz F = F0 + 3 MHz F = F0 3 MHz 30 MHz ~ 2000 MHz 2000 MHz ~ 2400 MHz 2500 MHz ~ 3000 MHz 3000 MHz ~ 12.5 GHz Intermodulation
4.6.2 Transmitter Basic Data Rate Min 90 0
10 27 27 10 36 Typ Max Unit 89 88 dBm dBm dB dB dB dB dB dB dB
6 6 25 33 25 45
dBm dBm dBm dBm dBm
+7
Table 12: Transmitter Characteristics Basic Data Rate Parameter Conditions Min Typ Max Unit RF transmit power (see note under Table 12)
0
dBm Espressif Systems 18 ESP32-MINI-1U Datasheet v0.5 4 Electrical Characteristics Parameter Gain control step RF power control range
+20 dB bandwidth Adjacent channel transmit power f 1avg f 2max f 2avg/ f 1avg ICFT Drift rate Drift (DH1) Drift (DH5) Note:
Conditions Min Typ Max Unit
F = F0 2 MHz F = F0 3 MHz F = F0 > 3 MHz
12
127
3
0.9 55 55 59
0.92 7 0.7 6 6
dB
+9 dBm
- MHz
155
dBm dBm dBm kHz kHz
kHz kHz/50 s kHz kHz There are a total of eight power levels from 0 to 7, and the transmit power ranges from 12 dBm to 9 dBm. When the power level rises by 1, the transmit power increases by 3 dB. Power level 4 is used by default and the corresponding transmit power is 0 dBm. 4.6.3 Receiver Enhanced Data Rate Table 13: Receiver Characteristics Enhanced Data Rate Parameter Conditions Min Typ Max Unit
/4 DQPSK Sensitivity @0.01% BER Maximum received signal @0.01% BER Co-channel C/I
Adjacent channel selectivity C/I F = F0 + 1 MHz F = F0 1 MHz F = F0 + 2 MHz F = F0 2 MHz F = F0 + 3 MHz F = F0 3 MHz Sensitivity @0.01% BER Maximum received signal @0.01% BER C/I c-channel 8DPSK
Adjacent channel selectivity C/I F = F0 + 1 MHz F = F0 1 MHz F = F0 + 2 MHz F = F0 2 MHz F = F0 + 3 MHz F = F0 3 MHz 90 89 88
0 11 7 7 25 35 25 45
84 83 82
5 18 2 2 25 25 25 38
dBm dBm dB dB dB dB dB dB dB dBm dBm dB dB dB dB dB dB dB Espressif Systems 19 ESP32-MINI-1U Datasheet v0.5 4 Electrical Characteristics 4.6.4 Transmitter Enhanced Data Rate Table 14: Transmitter Characteristics Enhanced Data Rate Parameter Conditions Min Typ Max Unit RF transmit power (see note under Table 12) Gain control step RF power control range
/4 DQPSK max w0
/4 DQPSK max wi
/4 DQPSK max |wi + w0|
8DPSK max w0 8DPSK max wi 8DPSK max |wi + w0|
/4 DQPSK modulation accuracy 8 DPSK modulation accuracy In-band spurious emissions
RMS DEVM 99% DEVM Peak DEVM RMS DEVM 99% DEVM Peak DEVM F = F0 1 MHz F = F0 2 MHz F = F0 3 MHz F = F0 +/> 3 MHz EDR differential phase coding
4.7 Bluetooth LE Radio 4.7.1 Receiver
12 0 3
dBm dB
+9 dBm 0.72 6 7.42 0.7 9.6 10 4.28 100 13.3 5.8 100 14 46 44 49
kHz kHz kHz kHz kHz kHz
dBm dBm dBm dBm
53 100
Table 15: Receiver Characteristics Bluetooth LE Parameter Sensitivity @30.8% PER Maximum received signal @30.8% PER Co-channel C/I Adjacent channel selectivity C/I Out-of-band blocking performance Intermodulation Espressif Systems Conditions
F = F0 + 1 MHz F = F0 1 MHz F = F0 + 2 MHz F = F0 2 MHz F = F0 + 3 MHz F = F0 3 MHz 30 MHz ~ 2000 MHz 2000 MHz ~ 2400 MHz 2500 MHz ~ 3000 MHz 3000 MHz ~ 12.5 GHz
20 Min 94 0
10 27 27 10 36 Typ Max Unit 93 92
+10 5 5 25 35 25 45
dBm dBm dB dB dB dB dB dB dB dBm dBm dBm dBm dBm ESP32-MINI-1U Datasheet v0.5 4 Electrical Characteristics 4.7.2 Transmitter Table 16: Transmitter Characteristics Bluetooth LE Parameter Conditions Min Typ Max Unit RF transmit power (see note under Table 12) Gain control step RF power control range
Adjacent channel transmit power F = F0 2 MHz F = F0 3 MHz F = F0 > 3 MHz f 1avg f 2max f 2avg/ f 1avg ICFT Drift rate Drift
12
210 0 3
55 57 59
+0.92 10 0.7 2
dBm dB
+9 dBm
265
dBm dBm dBm kHz kHz
kHz kHz/50 s kHz Espressif Systems 21 ESP32-MINI-1U Datasheet v0.5 8 Product Handling 8 Product Handling 8.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environ-
ment of < 40 C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 255 C and /60%RH. If the above conditions are not met, the module needs to be baked. 8.2 Electrostatic Discharge (ESD) Human body model (HBM): 2000 V Charged-device model (CDM): 500 V Air discharge: 6000 V Contact discharge: 4000 V 8.3 Reflow Profile Solder the module in a single reflow. Figure 8: Reflow Profile Espressif Systems 27 ESP32-MINI-1U Datasheet v0.5 501500251 ~ 3 /s02002502001 ~ 5 /sCooling zone10021750100250Reow zone 217 60 ~ 90 sTemperature ()Preheating zone150 ~ 200 60 ~ 120 sRamp-up zonePeak Temp. 235 ~ 250 Soldering time> 30 sTime (sec.)Ramp-up zone Temp.: 25 ~ 150 Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 /sPreheating zone Temp.: 150 ~ 200 Time: 60 ~ 120 sReow zone Temp.: >217 60 ~ 90 s; Peak Temp.: 235 ~ 250 Time: 30 ~ 70 sCooling zone Peak Temp. ~ 180 Ramp-down rate: 1 ~ 5 /sSolder Sn-Ag-Cu (SAC305) lead-free solder alloy 9 MAC Addresses and eFuse 9 MAC Addresses and eFuse The eFuse in ESP32 has been burnt into 48-bit mac_address. The actual addresses the chip uses in station, AP, Bluetooth LE, and Ethernet modes correspond to mac_address in the following way:
Station mode: mac_address AP mode: mac_address + 1 Bluetooth LE mode: mac_address + 2 Ethernet mode: mac_address + 3 In the 1 Kbit eFuse, 256 bits are used for the system (MAC address and chip configuration) and the remaining 768 bits are reserved for customer applications, including flash-encryption and chip-ID. Espressif Systems 28 ESP32-MINI-1U Datasheet v0.5 10 Learning Resources 10 Learning Resources 10.1 MustRead Documents Please familiarize yourself with the following documents:
ESP32 Hardware Resources The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development boards. ESP32 Hardware Design Guidelines The guidelines outline recommended design practices when developing standalone or add-on systems based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development boards. ESP32 AT Instruction Set and Examples This document introduces the ESP32 AT commands, explains how to use them, and provides examples of several common AT commands. Espressif Products Ordering Information 10.2 MustHave Resources Here are the ESP32-related must-have resources. ESP32 GitHub ESP32 development projects are freely distributed under Espressifs MIT license on GitHub. It is established to help developers get started with ESP32 and foster innovation and the growth of general knowledge about the hardware and software surrounding ESP32 devices. ESP32 Tools This is a webpage where users can download ESP32 Flash Download Tools and the zip file ESP32 Certifi-
cation and Test. ESP-IDF This webpage links users to the official IoT development framework for ESP32. ESP32 Resources This webpage provides the links to all available ESP32 documents, SDK and tools. Espressif Systems 29 ESP32-MINI-1U Datasheet v0.5 Revision History Revision History Date Version Release notes 2021-05-25 V0.5 Pre-release Espressif Systems 30 ESP32-MINI-1U Datasheet v0.5 Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTYS INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-
INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. www.espressif.com All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright 2021 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.