FCC ID: XMR2020RM500QAE 5G Sub-6 GHz M.2 Module

 

RM500Q-AE&RM502Q-AE

Hardware Design

5G Module Series

Version: 1.0.0

Date: 2020-10-22

Status: Preliminary

www.quectel.com

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Our aim is to provide customers with timely and comprehensive service. For any assistance,

please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.

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Copyright

The information contained here is proprietary technical information of Quectel wireless solutions co., ltd.

Transmitting, reproducing, disseminating and editing this document as well as using the content without

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Copyright © Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved.

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About the Document

Revision History

Version Date

Author

Description

-

2020-10-22

Creation of the document

1.0.0

2020-10-22

Preliminary

Jared WANG

/Hank LIU

Jared WANG

/Hank LIU

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Contents

About the Document ................................................................................................................................... 4

Contents ....................................................................................................................................................... 5

Table Index ................................................................................................................................................... 7

Figure Index ............................................................................................................................................. 810

1

Introduction .................................................................................................................................... 1012

1.1. Safety Information ................................................................................................................. 1113

2 Product Concept ............................................................................................................................ 1214

2.1. General Description .............................................................................................................. 1214

2.2. Key Features ......................................................................................................................... 1315

2.3. Functional Diagram ............................................................................................................... 1517

2.4. Evaluation Board ................................................................................................................... 1618

3.5.2.1.

3.5.2.2.

3 Application Interfaces ................................................................................................................... 1719

3.1. Pin Assignment ..................................................................................................................... 1820

3.2. Pin Description ...................................................................................................................... 1921

3.3. Operating Modes ................................................................................................................... 2326

3.4. Power Supply ........................................................................................................................ 2326

3.4.1. Decrease Voltage Drop .............................................................................................. 2427

3.4.2. Reference Design for Power Supply .......................................................................... 2528

3.5. Turn on and off Scenarios ..................................................................................................... 2629

3.5.1. Turn on the Module .................................................................................................... 2629

3.5.2. Turn off the Module .................................................................................................... 2730

Turn off the Module through FULL_CARD_POWER_OFF# .......................... 2730

Turn off the Module through AT Command .................................................... 2831

3.6. Reset the Module .................................................................................................................. 2932

(U)SIM Interface .................................................................................................................... 3134

3.7.

3.8. USB Interface ........................................................................................................................ 3336

3.9. PCIe Interface ....................................................................................................................... 3639

3.9.1. PCIe Operating Mode ................................................................................................ 3639

3.9.2. USB and PCIe Modes ................................................................................................ 3942

3.10. PCM Interface* ...................................................................................................................... 4043

3.11. Control and Indication Interfaces .......................................................................................... 4245

3.11.1. W_DISABLE1#* ......................................................................................................... 4245

3.11.2. W_DISABLE2#* ......................................................................................................... 4346

3.11.3. WWAN_LED#* ........................................................................................................... 4447

3.11.4. WAKE_ON_WAN#* ................................................................................................... 4548

3.11.5. DPR* .......................................................................................................................... 4548

3.11.6. STATUS* .................................................................................................................... 4649

3.12. Cellular/WLAN Interface* ...................................................................................................... 4649

3.13. Antenna Tuner Control Interface* ......................................................................................... 4750

3.14. Configuration Pins ................................................................................................................. 4750

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4 GNSS Receiver ............................................................................................................................... 4952

4.1. General Description .............................................................................................................. 4952

4.2. GNSS Performance .............................................................................................................. 4952

5 Antenna Interfaces ......................................................................................................................... 5154

5.1. RF Antenna Interfaces .......................................................................................................... 5154

5.1.1. Antenna Pin Definition................................................................................................ 5154

5.1.2. RF Antenna Port Mapping ......................................................................................... 5255

5.1.3. Operating Frequency ................................................................................................. 5255

5.1.4. Reference Design of RF Antenna Interface ............................................................... 5356

5.2. GNSS Antenna Interface ...................................................................................................... 5457

5.3. Reference Design of RF Layout ........................................................................................... 5457

5.4. Antenna Connectors ............................................................................................................. 5659

5.4.1 RF Bands Supported by Antenna Connectors ................................................................ 5861

5.5. Antenna Installation .............................................................................................................. 5861

5.5.1. Antenna Requirements .............................................................................................. 5861

5.5.2. Recommended RF Connector for Antenna Installation ............................................. 5962

6 Reliability, Radio and Electrical Characteristics ........................................................................ 6366

6.1. Absolute Maximum Ratings .................................................................................................. 6366

6.2. Power Supply Requirements ................................................................................................ 6366

6.3.

I/O Requirements .................................................................................................................. 6467

6.4. Operating and Storage Temperatures .................................................................................. 6467

6.5. Current Consumption ............................................................................................................ 6568

6.6. RF Output Power .................................................................................................................. 6770

6.7. RF Receiving Sensitivity ....................................................................................................... 6871

6.8. ESD Characteristics .............................................................................................................. 6973

6.9. Thermal Dissipation .............................................................................................................. 7073

7 Mechanical Dimensions and Packaging ..................................................................................... 7376

7.1. Mechanical Dimensions of the Module ................................................................................. 7376

7.2. Top and Bottom Views of the Module ................................................................................... 7477

7.3. M.2 Connector ....................................................................................................................... 7578

7.4. Packaging ............................................................................................................................. 7578

8 Appendix References .................................................................................................................... 7780

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Table Index

Table 1: Frequency Bands and GNSS Type of RM500Q-AE&RM502Q-AE Module ............................ 1214

Table 2: Key Features of RM500Q-AE&RM502Q-AE ........................................................................... 1315

Table 3: Definition of I/O Parameters ..................................................................................................... 1922

Table 4: Pin Description ......................................................................................................................... 1922

Table 5: Overview of Operating Modes ................................................................................................. 2326

Table 6: Definition of VCC and GND Pins ............................................................................................. 2426

Table 7: Definition of FULL_CARD_POWER_OFF# Pin ....................................................................... 2629

Table 8: Definition of RESET_N Pin ...................................................................................................... 2932

Table 9: Pin Definition of (U)SIM Interfaces .......................................................................................... 3134

Table 10: Pin Definition of USB Interface .............................................................................................. 3437

Table 11: Pin Definition of PCIe Interface .............................................................................................. 3639

Table 12: Pin Definition of PCM Interface .............................................................................................. 4144

Table 13: Pin Definition of Control and Indication Interfaces................................................................. 4245

Table 14: RF Function Status ................................................................................................................ 4346

Table 15: GNSS Function Status ........................................................................................................... 4346

Table 16: Network Status Indications of WWAN_LED# ........................................................................ 4548

Table 17: State of the WAKE_ON_WAN# ............................................................................................. 4548

Table 18: Function of the DPR Signal .................................................................................................... 4649

Table 19: Pin Definition of COEX Interface ........................................................................................... 4649

Table 20: Pin Definition of Antenna Tuner Control Interface ................................................................. 4750

Table 21: Definition of Configuration Pins.............................................................................................. 4750

Table 22: Configuration Pins List of M.2 Specification .......................................................................... 4851

Table 23: GNSS Performance ............................................................................................................... 4952

Table 24: RM500Q-AE&RM502Q-AE Pin Definition of RF Antenna Interfaces .................................... 5154

Table 25: RM500Q-AE & RM502Q-AE RF Antenna Mapping .............................................................. 5255

Table 26: RM500Q-AE&RM502Q-AE Module Operating Frequencies ................................................. 5255

Table 27: GNSS Frequency ................................................................................................................... 5457

Table 28: RF Bands Supported by RM500Q-AE&RM502Q-AE Antenna Connectors .......................... 5861

Table 29: Antenna Requirements .......................................................................................................... 5962

Table 30: Major Specifications of the RF Connector ............................................................................. 6063

Table 31: Absolute Maximum Ratings ................................................................................................... 6366

Table 32: Power Supply Requirements ................................................................................................. 6366

Table 33: I/O Requirements ................................................................................................................... 6467

Table 34: Operating and Storage Temperatures ................................................................................... 6467

Table 35: RM500Q-AE&RM502Q-AE Current Consumption ................................................................ 6568

Table 36: RF Output Power ................................................................................................................... 6771

Table 37: RM500Q-AE&RM502Q-AE Conducted RF Receiving Sensitivity ......................................... 6871

Table 38: Electrostatic Discharge Characteristics (Temperature: 25 ºC, Humidity: 40 %) ................... 7073

Table 39: Related Documents ................................................................................................................ 7780

Table 40: Terms and Abbreviations ....................................................................................................... 7780

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Figure Index

Figure 1: Functional Diagram ..................................................................................................................... 16

Figure 2: Pin Assignment ........................................................................................................................... 18

Figure 3: Power Supply Limits during Radio Transmission ....................................................................... 24

Figure 4: Reference Circuit of VCC Pins ................................................................................................... 25

Figure 5: Reference Design of Power Supply ............................................................................................ 25

Figure 6: Turn-on Timing of the Module ..................................................................................................... 26

Figure 7: Turn on the Module with a Host GPIO ........................................................................................ 27

Figure 8: Turn-off Timing through FULL_CARD_POWER_OFF# ............................................................. 28

Figure 9: Turn-off Timing through AT Command and FULL_CARD_POWER_OFF# .............................. 28

Figure 10: Reference Circuit of RESET_N with NPN Driving Circuit ........................................................ 29

Figure 11: Reference Circuit of RESET_N with NMOS Driving Circuit ..................................................... 30

Figure 12: Resetting Timing of the Module ................................................................................................ 30

Figure 13: Reference Circuit for Normally Closed (U)SIM Card Connector .............................................. 32

Figure 14: Reference Circuit for Normally Open (U)SIM Card Connector ................................................ 32

Figure 15: Reference Circuit for a 6-Pin (U)SIM Card Connector ............................................................. 33

Figure 16: Reference Circuit of USB 3.1 & 2.0 Interface ........................................................................... 35

Figure 17: PCIe Interface Reference Circuit .............................................................................................. 37

Figure 18: PCIe Power-on Timing Requirements of M.2 Specification ..................................................... 38

Figure 19: PCIe Power-on Timing Requirements of the Module ............................................................... 38

Figure 20: Primary Mode Timing ................................................................................................................ 40

Figure 21: Auxiliary Mode Timing .............................................................................................................. 41

Figure 22: W_DISABLE1# and W_DISABLE2# Reference Circuit ........................................................... 44

Figure 23: WWAN_LED# Reference Circuit .............................................................................................. 44

Figure 24: WAKE_ON_WAN# Signal Reference Circuit ........................................................................... 45

Figure 25: Recommended Circuit of Configuration Pins ........................................................................... 48

Figure 26: RM500Q-AE&RM502Q-AE Reference Circuit of RF Antenna ................................................. 53

Figure 27: Microstrip Design on a 2-layer PCB ......................................................................................... 55

Figure 28: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 55

Figure 29: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 55

Figure 30: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 56

Figure 31: RM500Q-AE Antenna Connectors ........................................................................................... 57

Figure 32: RM502Q-AE Antenna Connectors ........................................................................................... 57

Figure 33: RM500Q-AE&RM502Q-AE RF Connector Dimensions (Unit: mm) ......................................... 60

Figure 34: Specifications of Mating Plugs Using Ø0.81 mm Coaxial Cables ............................................ 61

Figure 35: Connection between RF Connector and Mating Plug Using Ø0.81 mm Coaxial Cable .......... 61

Figure 36: Connection between RF Connector and Mating Plug Using Ø1.13 mm Coaxial Cable .......... 62

Figure 37: Thermal Dissipation Area on Bottom Side of Module .............................................................. 71

Figure 38: Mechanical Dimensions of the Module (Unit: mm) ................................................................... 73

Figure 39: RM500Q-AE Top View and Bottom view ................................................................................. 74

Figure 40: RM502Q-AE Top View and Bottom View ................................................................................. 74

Figure 41: Tray Size (Unit: mm) ................................................................................................................. 75

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Figure 42: Tray Packaging Procedure ....................................................................................................... 76

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1 Introduction

The hardware design defines RM500Q-AE&RM502Q-AE and describes the air and hardware interfaces

which are connected with customers’ applications.

This document helps you quickly understand the interface specifications, electrical and mechanical

details, as well as other related information of RM500Q-AE&RM502Q-AE. To facilitate its application in

different fields, reference design is also provided for reference. Associated with application notes and

user guides, customers can use the module to design and set up mobile applications easily.

This document is applicable to the RM500Q-AE&RM502Q-AE models:

NOTE

“*” means under development

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1.1. Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service

or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal

should notify users and operating personnel of the following safety information by incorporating these

guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to

comply with these precautions.

Full attention must be paid to driving at all times in order to reduce the risk of an

accident. Using a mobile while driving (even with a handsfree kit) causes

distraction and can lead to an accident. Please comply with laws and regulations

restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation

of wireless appliances in an aircraft is forbidden to prevent interference with

communication systems. If there is an Airplane Mode, it should be enabled prior to

boarding an aircraft. Please consult the airline staff for more restrictions on the use

of wireless devices on an aircraft.

Wireless devices may cause interference on sensitive medical equipment, so

please be aware of the restrictions on the use of wireless devices when in

hospitals, clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signals and cellular network

cannot be guaranteed to connect in all possible conditions (for example, with

unpaid bills or with an invalid (U)SIM card. When emergency help is needed in

such conditions, use emergency call. In order to make or receive a call, the cellular

terminal or mobile must be switched on in a service area with adequate cellular

signal strength.

The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it

receives and transmits radio frequency signals. RF interference can occur if it is

used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn

off wireless devices such as mobile phone or other cellular terminals. Areas with

potentially explosive atmospheres include fuelling areas, below decks on boats,

fuel or chemical transfer or storage facilities, areas where the air contains

chemicals or particles such as grain, dust or metal powders.

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2 Product Concept

2.1. General Description

RM500Q-AE&RM502Q-AE are 5G NR/LTE-FDD/LTE-TDD/WCDMA wireless communication modules

with receive diversity. They provide data connectivity on 5G NR SA and NSA, LTE-FDD, LTE-TDD,

DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks with standard PCI Express M.2 interface.

They support embedded operating systems such as Windows, Linux and Android, and also provide

GNSS and voice functionality to meet specific application demands.

The following table shows the frequency bands and GNSS type of the module.

Table 1: Frequency Bands and GNSS Type of RM500Q-AE&RM502Q-AE Module

Mode

5G NR

RM500Q-AE&RM502Q-AE

n2/n5/n7/n12/n25/n41/n66/n71/n77

LTE-FDD

B2/eB4/B5/B7/B12/B13/B14/B17/B25/B26/B30/B66/B71

LTE-TDD

B38/B41/B48

WCDMA

B2/B4/B5

GNSS

GPS/GLONASS/BeiDou/Galileo

RM500Q-AE&RM502Q-AE can be applied in the following fields:

⚫ Rugged tablet PC and laptop computer

⚫ Remote monitor system

⚫ Smart metering system

⚫ Wireless router and switch

⚫ Other wireless terminal devices

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2.2. Key Features

The following table describes key features of RM500Q-AE&RM502Q-AE.

Table 2: Key Features of RM500Q-AE&RM502Q-AE

Feature

Details

Function Interface

PCI Express M.2 Interface

Power Supply

⚫ Supply voltage: 3.135–4.4 V

⚫ Typical supply voltage: 3.7 V

Transmitting Power

⚫ Class 3 (24 dBm +1/-3 dB) for WCDMA bands

⚫ Class 3 (23 dBm ±2 dB) for LTE bands

⚫ Class 3 (23 dBm ±2 dB) for 5G NR bands

⚫ Class 2 (26 dBm ±2 dB) for LTE B38/B41 bands HPUE 1)

⚫ Class 2 (26 dBm +2/-3 dB) for 5G NR n41/n77 bands HPUE 1)

5G NR Features

⚫ Support 3GPP Rel-15

⚫ Modulations:

Uplink: π/2-BPSK, QPSK, 16QAM, 64QAM and 256QAM

Downlink: QPSK, 16QAM, 64QAM and 256QAM

⚫ Support downlink 4 × 4 MIMO on: n2/n7/25/n41/n66/n77

⚫ Support SCS 15 kHz 2) and 30 kHz 2)

⚫ Supports 5G NR refarmed band bandwidth ≤ 20 MHz

⚫ Supports 5G NR n41/n77 bandwidth ≤ 100 MHz

⚫ Support SA and NSA operation modes

⚫ Support Option 3x, 3a, and Option 2

⚫ Max. transmission data rates 3):

RM500Q-AE

NSA: Max 2.5 Gbps(DL)/ 650 Mbps (UL)

SA: Max 2.1 Gbps(DL)/ 450 Mbps (UL)

RM502Q-AE

NSA: Max 5 Gbps(DL)/ 650 Mbps (UL)

SA: Max 4.2 Gbps(DL)/ 450 Mbps (UL)

⚫ Supports 3GPP Rel-15

⚫ Support up to CA Cat 16 FDD and TDD

⚫ Supported modulations:

LTE Features

Uplink: QPSK, 16QAM and 64QAM and 256QAM

Downlink: QPSK, 16QAM and 64QAM and 256QAM

⚫ Supports 1.4/3/5/10/15/20 MHz RF bandwidth

⚫ Support downlink 4 × 4 MIMO on: B2/B4/B7/B25/B30/B38/B41/B48/B66

⚫ Max. transmission data rates 3):

RM500Q-AE

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LTE: Max 1.0 Gbps(DL)/ 200 Mbps (UL)

RM502Q-AE

LTE: 2.0 Gbps (DL) /200 Mbps (UL)

UMTS Features

⚫ Support 3GPP R8 DC-HSDPA, HSPA +, HSDPA, HSUPA and WCDMA

⚫ Support QPSK, 16QAM and 64QAM modulation

⚫ Max. transmission data rates 2):

DC-HSDPA: Max 42 Mbps (DL)

HSUPA: Max 5.76 Mbps (UL)

WCDMA: Max 384 kbps (DL)/384 kbps (UL)

Internet Protocol

Features

⚫ Support QMI/NTP* protocols

⚫ Support the protocols PAP and EIRP usually used for PPP connections

SMS

⚫ Text and PDU modes

⚫ Point-to-point MO and MT

⚫ SMS cell broadcast

⚫ SMS storage: ME by default

(U)SIM Interface

⚫ Support (U)SIM card: Class B (3.0 V) and Class C(1.8 V)

(U)SIM interface

⚫

⚫ Support Single (U)SIM

USB Interface

⚫ Compliant with USB 3.1 and 2.0 specifications, with maximum transmission

rates up to 10 Gbps on USB 3.1 and 480 Mbps on USB 2.0.

⚫ Used for AT command communication, data transmission, firmware

upgrade, software debugging, GNSS NMEA sentence output.

⚫ Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6–5.4, Android

4.x/5.x/6.x/7.x/8.x/9.x/10

PCIe × 1 Interface

⚫ Complaint with PCIe GEN3, support 8 Gbps per lane, PCIe × 1.

⚫ Used for AT command communication, data transmission, firmware

upgrade, software debugging, GNSS NMEA sentence output

Rx-diversity

⚫ Support 5G NR/LTE/WCDMA Rx-diversity

GNSS Features

⚫ Gen9 Lite of Qualcomm

⚫ Protocol: NMEA 0183

⚫ Data Update Rate: 1 Hz

AT Commands

commands

⚫ Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT

Antenna Interfaces

⚫ ANT0, ANT1, ANT2, and ANT3_GNSSL1

Physical

Characteristics

⚫ Size: (52.0 ±0.15) mm × (30.0 ±0.15) mm × (2.3 ±0.2) mm

⚫ Weight: approx. 8.7

Temperature Range

⚫ Operating temperature range: -20 to +60 °C 4)

⚫ Restricted Operating temperature range: -30 to -20 °C, +60 to +75 °C

⚫ Extended temperature range: -40 to -30 °C, +75 to +85 °C 5)

⚫ Storage temperature range: -40 to +90°C

Firmware Upgrade

⚫ USB 2.0 interface, PCIe interface and DFOTA

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RoHS

⚫ All hardware components are fully compliant with EU RoHS directive

NOTES

1.

2.

3.

4.

5.

6.

1) HPUE is only for single carrier.

2) 5G NR FDD bands only support 15 kHz SCS, NR TDD bands only support 30 kHz SCS.

3) The maximum rates are theoretical and the actual values refer to the network configuration.

4) To meet this operating temperature range, you need to ensure effective thermal dissipation, for

example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range,

the module can meet 3GPP specifications.

5) Within extended temperature range, the module remains the ability to establish and maintain

functions such as voice, SMS, data transmission without any unrecoverable malfunction. Radio

spectrum and radio network will not be influenced, while one or more specifications, such as Pout may

undergo a reduction in value, exceeding the specified tolerances of 3GPP. When the temperature

returns to the normal operating temperature level, the module will meet 3GPP specifications again.

“*” means under development.

2.3. Functional Diagram

The following figure shows a block diagram of RM500Q-AE&RM502Q-AE.

⚫ Power management

⚫ Baseband

⚫ DDR + NAND flash

⚫ Radio frequency

⚫ M.2 Key-B interface

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Figure 1: Functional Diagram

2.4. Evaluation Board

To help with the development of applications conveniently with RM500Q-AE&RM502Q-AE, Quectel

supplies the evaluation board (PCIe Card EVB), a USB to RS-232 converter cable, a USB type-C cable,

antennas and other peripherals to control or test the module. For more details, see document [1].

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BasebandPMICSub-6 GHzTransceiver ANT0 ANT3_GNSSL1 ANT2ETVCCRESET_N38.4MXOSPMIIQControlTxPRxMIPI/GRFCPCI Express M.2 Key-B InterfaceFULL_CARD_POWER_OFF#W_DISABLE2#USB 2.0 & USB 3.1(U)SIM1WWAN_LED#WAKE_ON_WAN#NAND Flash 4Gb x8LPDDR4X SDRAM 4Gb x16RFFEW_DISABLE1#GPIOsTx/Rx Blocks ANT1PCIe × 1GNDDRxGNSS 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

3 Application Interfaces

(U)SIM interfaces

The physical connections and signal levels of RM500Q-AE&RM502Q-AE comply with PCI Express M.2

specification. This chapter mainly describes the definition and application of the following interfaces/pins

of the module:

⚫ Power supply

⚫

⚫ USB interface

⚫ PCIe interface

⚫ PCM interface*

⚫ Control and indication interfaces*

⚫ COEX UART interface*

⚫ Antenna tuner control interface*

⚫ Configuration pins

NOTE

“*” means under development.

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3.1. Pin Assignment

The following figure shows the pin assignment of the module. The top side contains module and antenna

connectors.

Figure 2: Pin Assignment

RM500Q-AE&RM502Q-AE_Hardware_Design 18 / 83

PIN2PIN74BOTPIN1PIN75TOPPin NameNo.CONFIG_275GND73GND71CONFIG_169RESET_N67RFFE_VIO_1V865ANTCTL263ANTCTL161LAA_TX_EN59GND57PCIE_REFCLK_P55PCIE_REFCLK_M53GND51PCIE_RX_P49PCIE_RX_M47GND45PCIE_TX_P43PCIE_TX_M41GND39USB_SS_RX_P37USB_SS_RX_M35GND33USB_SS_TX_P31USB_SS_TX_M29GND27DPR25WAKE_ON_WAN#23CONFIG_021NotchNotchNotchNotchGND11USB_DM9USB_DP7GND5GND3CONFIG_31PIN11PIN10No.Pin Name74VCC72VCC70VCC68AP2SDX_STATUS66USIM_DET64COEX_TXD62COEX_RXD60WLAN_TX_EN58RFFE_DATA56RFFE_CLK54PCIE_WAKE_N52PCIE_CLKREQ_N50PCIE_RST_N48NC46NC44NC42NC40NC38SDX2AP_STATUS36USIM_VDD34USIM_DATA32USIM_CLK30USIM_RST28PCM_SYNC26W_DISABLE2#24PCM_DOUT22PCM_DIN20PCM_CLKNotchNotchNotchNotch10WWAN_LED#8W_DISABLE1#6FULL_CARD_POWER_OFF#4VCC2VCC 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

3.2. Pin Description

Table 3: Definition of I/O Parameters

Description

Analog Input

Analog Output

Digital Input

Digital Output

Bidirectional

Open Drain

Power Input

Power Output

Type

AI

AO

DI

DO

IO

OD

PI

PO

Pin

No.

1

2

3

4

5

6

The following table shows the pin definition and description of the module.

Table 4: Pin Description

Pin Name

I/O

Description

Comment

CONFIG_3

DO

Not connected internally

VCC

GND

VCC

GND

PI

Power supply

Ground

Ground

PI

Power supply

Vmin = 3.135 V

Vnorm = 3.7 V

Vmax = 4.4 V

Vmin = 3.135 V

Vnorm = 3.7 V

Vmax = 4.4 V

FULL_CARD_

POWER_OFF#

DI

Turn on/off of the module.

Internally pulled down with

a 100 kΩ resistor.

When it is at low level, the

module is turned off.

RM500Q-AE&RM502Q-AE_Hardware_Design 19 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

When it is at high level, the

module is turned on.

USB_DP

AI,

AO

USB 2.0 differential data

(+)

Airplane mode control.

Active LOW.

W_DISABLE1#*

DI

1.8/3.3 V power domain

USB_DM

USB 2.0 differential data (-)

AI,

AO

WWAN_LED#*

OD

RF status indication LED

It is an open drain and

active LOW signal.

GND

Notch

Notch

Notch

Notch

Notch

Notch

Notch

Notch

Ground

Notch

Notch

Notch

Notch

Notch

Notch

Notch

Notch

PCM_CLK*

IO

PCM data bit clock

1.8 V power domain

CONFIG_0

DO

Not connected internally

PCM_DIN*

DI

PCM data input

1.8 V power domain

WAKE_ON_WAN#* OD Wake up the host.

Open drain

Active LOW.

PCM_DOUT*

DO

PCM data output

1.8 V power domain

DPR

DI

Dynamic power reduction.

High level by default.

1.8 V power domain

W_DISABLE2#*

DI

GNSS disable control.

1.8/3.3 V power domain

Active LOW.

GND

Ground

PCM_SYNC*

IO

PCM data frame sync

1.8 V power domain

USB_SS_TX_M

AO

USB 3.1 transmit (-)

RM500Q-AE&RM502Q-AE_Hardware_Design 20 / 83

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

USIM_RST

DO

(U)SIM card reset

1.8/3.0 V power domain

USB_SS_TX_P

AO

USB 3.1 transmit data (+)

USIM_CLK

DO

(U)SIM clock

1.8/3.0 V power domain

GND

Ground

USIM_DATA

IO

(U)SIM card data

1.8/3.0 V power domain

USB_SS_RX_M

AI

USB 3.1 super-speed

receive (-)

USIM_VDD

PO

(U)SIM card power supply 1.8/3.0 V power domain

USB_SS_RX_P

AI

USB 3.1 super-speed

receive (+)

SDX2AP_STATUS DO

Status indication to AP

1.8 V power domain

PCIE_TX_M

AO

PCIe transmit (-)

PCIE_TX_P

AO

PCIe transmit (+)

GND

NC

NC

NC

GND

NC

NC

Ground

NC

NC

NC

NC

NC

Ground

PCIE_RX_M

AI

PCIe receive (-)

PCIE_RX_P

AI

PCIe receive (+)

PCIE_RST_N

DI

PCIe reset.

GND

Ground

PCIE_CLKREQ_N

DO

PCIe clock request.

PCIE_REFCLK_M

PCIe reference clock (-)

AI,

AO

Open drain

Active LOW.

Open drain

Active LOW.

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

RM500Q-AE&RM502Q-AE_Hardware_Design 21 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

PCIE_WAKE_N

DO

PCIe wake up

Open drain

Active LOW

PCIE_REFCLK_P

PCIe reference clock (+)

RFFE_CLK*

Used for external MIPI IC

control

1.8 V power domain

GND

Ground

RFFE_DATA*

DO

1.8 V power domain

AI,

AO

DO

LAA_TX_EN

DO

1.8 V power domain

Used for external MIPI IC

control

Notification from SDR to

WL when LTE transmitting

Notification from WL to

SDR while transmitting

WLAN_TX_EN

DI

1.8 V power domain

ANTCTL1*

DO

Antenna control

1.8 V power domain

COEX_RXD

DI

1.8 V power domain

LTE/WLAN coexistence

receive data

ANTCTL2*

DO

Antenna control

1.8 V power domain

COEX_TXD

DO

1.8 V power domain

LTE/WLAN coexistence

transmit data

RFFE_VIO_1V8

PO

Power supply for RFFE

1.8 V power output

USIM_DET

DI

Internally pulled up to 1.8 V

(U)SIM card insertion

detection

RESET_N

DI

Reset the module.

Internally pulled up to 1.5 V

with a 100 kΩ resistor

Active LOW.

AP2SDX_STATUS DI

Status indication from AP

1.8 V power domain

CONFIG_1

DO

Connected to GND

internally

VCC

GND

VCC

GND

VCC

PI

Power supply

Ground

Ground

PI

Power supply

PI

Power supply

Vmin = 3.135 V

Vnorm = 3.7 V

Vmax = 4.4 V

Vmin = 3.135 V

Vnorm = 3.7 V

Vmax = 4.4 V

Vmin = 3.135 V

Vnorm = 3.7 V

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

RM500Q-AE&RM502Q-AE_Hardware_Design 22 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Vmax = 4.4 V

75

CONFIG_2

DO

Not connected internally

NOTE

、

1.Keep all NC, reserved and unused pins unconnected.

2.Pin 61 and Pin 63 are used for antenna tuner

3.3. Operating Modes

The table below briefly summarizes the various operating modes to be mentioned in the following

chapters.

Table 5: Overview of Operating Modes

Mode

Details

Normal

Operation

Idle

Software is active. The module has registered on the network, and it is

ready to send and receive data.

Talk/Data

The module is connected to network. In this mode, the power

consumption is decided by network setting and data transfer rate.

Minimum

Functionality

Mode

AT+CFUN=0 command sets the module to a minimum functionality mode without

removing the power supply. In this mode, both RF function and (U)SIM card are

invalid.

Airplane Mode

AT+CFUN=4 command or driving W_DISABLE1#* pin low will set the module to

airplane mode. In this mode, the RF function is invalid.

Sleep Mode

In this mode, the current consumption of the module is reduced to the minimal level,

while the module keeps receiving paging messages, SMS, voice calls and TCP/UDP

data from the network.

Power Down

Mode

In this mode, the power management unit shuts down the power supply. Software is

inactive, the serial interfaces are inaccessible, and the operating voltage (connected to

VCC) remains applied.

3.4. Power Supply

The following table shows pin definition of VCC pins and ground pins.

RM500Q-AE&RM502Q-AE_Hardware_Design 23 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Pin No.

Pin Name

I/O

Power Domain Description

2, 4, 70, 72, 74

PI

3.135–4.4 V

3.7 V typical DC supply

Ground

Table 6: Definition of VCC and GND Pins

VCC

GND

3, 5, 11, 27, 33, 39, 45, 51, 57,

71, 73

3.4.1. Decrease Voltage Drop

The power supply range of the module is from 3.135 V to 4.4 V. Please ensure that the input voltage will

never drop below 3.135 V, otherwise the module will be powered off automatically. The following figure

shows the maximum voltage drop during radio transmission in 3G/4G/5G networks.

Figure 3: Power Supply Limits during Radio Transmission

The main power supply from an external system must be a single voltage source. To decrease voltage

drop, a bypass capacitor of about 100 µF with low ESR (ESR = 0.7 Ω) should be used, and a multi-layer

ceramic chip capacitor (MLCC) array also should be used due to its ultra-low ESR. It is recommended to

use four ceramic capacitors (1 µF, 100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these

capacitors close to VCC pins. The width of VCC trace should be no less than 2 mm. In principle, the

longer the VCC trace is, the wider it should be.

In addition, to guarantee stability of the power supply, please use a zener diode with a reverse zener

voltage of 5.1 V and a dissipation power of higher than 0.5 W. The following figure shows a reference

circuit of VCC.

RM500Q-AE&RM502Q-AE_Hardware_Design 24 / 83

VCCMax Tx powerMin.3.135 VVoltage Ripple< 100mVVoltage DropMax Tx power 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Figure 4: Reference Circuit of VCC Pins

3.4.2. Reference Design for Power Supply

Power design for the module is very important, as the performance of the module largely depends on the

power source. The power supply is capable of providing a sufficient current of at least 3 A. If the voltage

drop between the input and output is not too high, it is suggested that an LDO is used to supply power for

the module. If there is a big voltage difference between the input source and the desired output (VCC =

3.7 V Typ.), a buck DC-DC converter is preferred as the power supply.

The following figure shows a reference design for +5 V input power source based on the DC-DC

TPS54319. The typical output of the power supply is about 3.7 V and the maximum load current is 3 A.

Figure 5: Reference Design of Power Supply

NOTE

To avoid damages to the internal flash, please do not switch off the power supply directly when the

module is working. It is suggested that the power supply can be cut off after the module is powered off by

pulling down the FULL_CARD_POWER_OFF# pin for more than 10 s.

RM500Q-AE&RM502Q-AE_Hardware_Design 25 / 83

ModulePMU2, 4, 70, 72, 74C1100 μFD15.1 V3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73VCCVCCGNDC510 pFC433 pFC3100 nFC21 μF+D1TVSPWR_INC8220 μFC1110 pFC1033 pFC9100 nF+R1205kU1Q1NPNR847kR74.7kPWR_ENR4182kPWR_OUTL11.5 μHTPS54319VINVINVINENVSNSCOMPRT/CLKSSPHPHPHBOOTPWRGDGNDGNDAGNDVFBR5330k 1%R6100k 1%C6100 nFEP17R280.6kC710 nFR310kC410 nFC5NMVFBC2100 nFC333 pFC1470 μF+ 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

3.5. Turn on and off Scenarios

3.5.1. Turn on the Module

FULL_CARD_POWER_OFF# asynchronous signal is an Active Low input that is used to turn off the

entire module. When the input signal is asserted high ( ≥ 1.19 V), the module will be enabled. When the

input signal is driven low signal ( ≤ 0.2 V) or Tri-stated, it will force the module to shut down.

This input signal is 3.3 V tolerant and can be driven by either 1.8 V or 3.3 V GPIO. Also, it has internally

pulled down with a 100 kΩ resistor.

The following table shows the definition of FULL_CARD_POWER_OFF#.

Table 7: Definition of FULL_CARD_POWER_OFF# Pin

Pin No. Pin Name

Description

DC Characteristics Comment

6

FULL_CARD_

POWER_

OFF#

Turn on/off of the

module.

VIH(max) = 4.4 V

VIH(min) = 1.19 V

VIL(max) = 0.2 V

The timing of turn-on scenario is illustrated in the following figure.

Internally pulled down with a

100 kΩ resistor

When it is at low level, the

module is powered off.

When it is at high level, the

module is powered on.

Figure 6: Turn-on Timing of the Module

It is recommended to use a host GPIO to control FULL_CARD_POWER_OFF#. A simple reference circuit

is illustrated in the following figure.

RM500Q-AE&RM502Q-AE_Hardware_Design 26 / 83

VCCRESET_NModule power-on or insertion detectionUSIM1_VDD / USIM2_VDDModule StatusFULL_CARD_POWER_OFF#RFFE_VIO_1V8System turn-on and bootingVIH ≥ 1.19 V1.8 V or 3.0 VSystem bootingInactiveActivetpower-on tturn-ontbooting68 ms19.7 stUSIMt0  5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Figure 7: Turn on the Module with a Host GPIO

NOTES

1.

2.

3.

tpower-on is the interval between VCC and RESET_N high voltage level. It is measured when

RESET_N is not pulled down by the host device.

tturn-on is the interval between FULL_CARD_POWER_OFF# high voltage level and RFFE_VIO_1V8

(an internal LDO output) high voltage level, which is typically 68 ms.

t0

level.

FULL_CARD_POWER_OFF# could be pulled up at any time decided by the host, as shown in figure

above.

interval between VCC and FULL_CARD_POWER_OFF# high voltage

the

is

4. tbooting is the interval between RFFE_VIO_1V8 high voltage level and the USIM_VDD power-on.

3.5.2. Turn off the Module

3.5.2.1. Turn off the Module through FULL_CARD_POWER_OFF#

For the design that turns on the module with a host GPIO, when the power is supplied to VCC, pulling

down FULL_CARD_POWER_OFF# pin will turn off the module.

The timing of turning-off scenario is illustrated in the following figure.

RM500Q-AE&RM502Q-AE_Hardware_Design 27 / 83

HostModuleFULL_CARD_POWER_OFF#PMUGPIO61.8 V or 3.3 VNote: The voltage of pin 6 should be no less than 1.19 V when it is at HIGH level.R4100k 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Figure 8: Turn-off Timing through FULL_CARD_POWER_OFF#

3.5.2.2. Turn off the Module through AT Command

It is also a safe way to use AT+QPOWD command to turn off the module. For more details about the

command, see document [2].

The module is designed to be turned on with a host GPIO. Pull down FULL_CARD_POWER_OFF# pin

after the module’s USB/PCIe is removed. Otherwise, the module will be powered on again.

Figure 9: Turn-off Timing through AT Command and FULL_CARD_POWER_OFF#

NOTE

Please pull down FULL_CARD_POWER_OFF# pin immediately or cut off the power supply VCC when

the host detects that the module USB/PCIe is removed.

RM500Q-AE&RM502Q-AE_Hardware_Design 28 / 83

VCCFULL_CARD_POWER_OFF#RUNNINGOFFModule StatusPower-off procedureRESET_N(H)≥10 sVCCFULL_CARD_POWER_OFF#RUNNINGOFFModule StatusTurn off procedureRESET_N(H)USB/PCIeAT+QPOWDUSB/PCIe removed 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

3.6. Reset the Module

RESET_N is an asynchronous and active low signal (1.5 V logic level). Whenever this pin is active, the

module will immediately be placed in a Power On Reset (POR) condition.

CAUTION: Triggering the RESET# signal will lead to loss of all data in the modem and the removal of

system drivers. It will also disconnect the modem from the network.

Table 8: Definition of RESET_N Pin

Pin No. Pin Name

Description

DC Characteristics

Comment

67

RESET_N

Reset the module

VIH(max) = 1.5 V

VIH(min) = TBD

VIL(max) = TBD

Internally pulled up to 1.5 V

with a 100 kΩ resistor

The module can be reset by pulling down the RESET_N pin for 200–700 ms. An open collector/drain

driver or button can be used to control the RESET_N pin.

Figure 10: Reference Circuit of RESET_N with NPN Driving Circuit

RM500Q-AE&RM502Q-AE_Hardware_Design 29 / 83

HostModuleRESET_NResetLogicGPIO67VDD 1.5 VReset pulse200-700 msR1100kR3100kR21kQ1NPN 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Figure 11: Reference Circuit of RESET_N with NMOS Driving Circuit

The reset scenario is illustrated in the following figure.

Figure 12: Resetting Timing of the Module

RM500Q-AE&RM502Q-AE_Hardware_Design 30 / 83

HostModuleRESET_NResetLogicGPIO67VDD 1.5 VReset pulse200-700 msR1100kR5100kR410RQ2NMOSModuleRESET_NResetLogic67VDD 1.5V200-700 msS1TVSR1100k33 pFC1Note: The capacitor C1 is recommended to be less than 47 pF.VIL ≤ 0.5 VVCC≥200 msResettingModule StatusRunningRESET_NRestart≤ 700 ms 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

3.7. (U)SIM Interface

The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both Class B (3.0 V) and Class C

(1.8 V) (U)SIM cards are supported, and Dual SIM Single Standby* function is supported.

Table 9: Pin Definition of (U)SIM Interfaces

Pin No. Pin Name

I/O Description

Comment

USIM_VDD

PO Power supply for (U)SIM card

Class B (3.0 V) and Class C (1.8 V)

USIM_DATA

IO

(U)SIM card data

1.8/3.0 V power domain

USIM_CLK

DO

(U)SIM card clock

1.8/3.0 V power domain

USIM_RST

DO

(U)SIM card reset

1.8/3.0 V power domain

USIM_DET

DI

(U)SIM card insertion detection.

Internally pulled up

36

34

32

30

66

NOTE

“*” means under development.

RM500Q-AE&RM502Q-AE supports (U)SIM card hot-plug via the USIM_DET pin. With a normally closed

(U)SIM card connector, the USIM_DET is normally short-circuited to ground when a (U)SIM card is not

inserted, and the USIM_DET will change from low to high voltage level when a (U)SIM card is inserted.

The rising edge indicates an insertion of the (U)SIM card. When the (U)SIM card is removed, USIM_DET

will change from high to low voltage level. This falling edge indicates a removal of the (U)SIM card.

Normally Closed (U)SIM Card Connector:

⚫ When the (U)SIM is absent, CD is short-circuited to ground and USIM_DET is at low voltage level.

⚫ When the (U)SIM is inserted, CD is open from ground and USIM_DET is at high voltage level.

The following figure shows a reference design of (U)SIM interface with a normally closed (U)SIM card

connector.

RM500Q-AE&RM502Q-AE_Hardware_Design 31 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Figure 13: Reference Circuit for Normally Closed (U)SIM Card Connector

Normally Open (U)SIM Card Connector:

⚫ When the (U)SIM is absent, CD1 is open from CD2 and USIM_DET is at low voltage level.

⚫ When the (U)SIM is inserted, CD1 is short-circuited to 1.8 V and USIM_DET is at high voltage level.

The following figure shows a reference design of (U)SIM interface with a normally open (NO) (U)SIM card

connector.

Figure 14: Reference Circuit for Normally Open (U)SIM Card Connector

If (U)SIM card detection function is not needed, please keep USIM_DET disconnected. A reference circuit

for (U)SIM card interface with a 6-pin (U)SIM card connector is illustrated by the following figure.

RM500Q-AE&RM502Q-AE_Hardware_Design 32 / 83

Module(U)SIM CardConnectorUSIM_DETUSIM_DATAUSIM_CLKRSTCLKCDIOUSIM_VDDUSIM_VDDUSIM_RSTVCCGNDVPPGNDTVSNote: All these resistors, capacitors and TVS should be close to (U)SIM card connector in PCB layout.10-20k22R 22R 22R 33 pF33 pF33 pF100 nFModule(U)SIM CardConnectorUSIM_DETUSIM_DATAUSIM_CLKRSTCLKCD1IOUSIM_VDDUSIM_VDDUSIM_RSTVCCGNDVPPGNDTVSNote: All these resistors, capacitors and TVS should be close to (U)SIM card connector in PCB layout.10-20k22R 22R 22R 33 pF33 pF33 pF100 nF33k1.8 V4.7kCD2 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Figure 15: Reference Circuit for a 6-Pin (U)SIM Card Connector

To enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria

below in (U)SIM circuit design.

⚫ Place the (U)SIM card connector as close to the module as possible. Keep the trace length less than

200 mm.

⚫ Keep (U)SIM card signals away from RF and VCC traces.

⚫ Make sure the ground between the module and the (U)SIM card connector is short and wide. Keep

the trace width of ground and USIM_VDD no less than 0.5 mm to maintain the same electric

potential.

⚫ To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and

shield them with surrounded ground.

⚫ To offer better ESD protection, add a TVS diode array of which the parasitic capacitance should be

not higher than 10 pF. Add 22 Ω resistors in series between the module and the (U)SIM card

connector to suppress EMI such as spurious transmission, and to enhance ESD protection. The 33

pF capacitors are used to filter out RF interference.

⚫ For USIM_DATA, a 10–20 kΩ pull-up resistor must be added near the (U)SIM card connector.

⚫

(U)SIM card hot-plug is disabled by default.

3.8. USB Interface

RM500Q-AE&RM502Q-AE module provides one integrated Universal Serial Bus (USB) interface which

complies with the USB 3.1 & 2.0 specifications and supports super speed (10) on USB 3.1 and high

speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT

command communication, data transmission, GNSS NMEA sentence output, software debugging,

firmware upgrade.

RM500Q-AE&RM502Q-AE_Hardware_Design 33 / 83

Module(U)SIM CardConnectorUSIM_DETUSIM_DATAUSIM_CLKRSTCLKIOUSIM_VDDUSIM_VDDUSIM_RSTVCCGNDVPPGNDTVSNote: All these resistors, capacitors and TVS should be close to (U)SIM card connector in PCB layout.10-20k22R 22R 22R 33 pF33 pF33 pF100 nF 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Please note that only USB 2.0 can be used for firmware upgrade currently.

The following table shows the pin definition of USB interface.

Table 10: Pin Definition of USB Interface

Pin No. Pin Name

I/O

Description

Comment

USB_DP

AI/AO USB 2.0 differential data bus (+)

USB_DM

AI/AO USB 2.0 differential data bus (-)

USB_SS_TX_M

AO

USB 3.1 transmit data (-)

USB_SS_TX_P

AO

USB 3.1 transmit data (+)

Require differential

impedance of 90 Ω

USB_SS_RX_M

AI

USB 3.1 receive data (-)

USB_SS_RX_P

AI

USB 3.1 receive data (+)

7

9

29

31

35

37

NOTE

“*” means under development.

For more details about the USB 3.1 & 2.0 specifications, please visit http://www.usb.org/home.

The USB 2.0 interface is recommended to be reserved for firmware upgrade in designs. The following

figure shows a reference circuit of USB 3.1 & 2.0 interface.

RM500Q-AE&RM502Q-AE_Hardware_Design 34 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Figure 16: Reference Circuit of USB 3.1 & 2.0 Interface

AC coupling capacitors C5 and C6 must be placed close to the host and close to each other. C1 and C2

have been integrated inside the module, so do not place these two capacitors on customers’ schematic

and PCB. To ensure the signal integrity of USB 2.0 data traces, R1, R2, R3 and R4 must be placed close

to the module, and the stubs must be minimized in PCB layout.

You should follow the principles below when designing for the USB interface to meet USB 3.1 and 2.0

specifications:

⚫ Route the USB signal traces as differential pairs with ground surrounded. The impedance of

differential trace of USB 2.0 and 3.1 is 90 Ω.

⚫ For USB 2.0 signal traces, the trace length should be less than 120 mm, and the differential data pair

matching should be less than 2 mm. For USB 3.1 signal traces, length matching of each differential

data pair (Tx/Rx) should be less than 0.7 mm, while the matching between Tx and Rx should be less

than 10 mm.

⚫ Do not route signal traces under crystals, oscillators, magnetic devices, PCIe and RF signal traces.

Route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on

that layer and with ground planes above and below.

⚫ Junction capacitance of the ESD protection device might cause influences on USB data lines, so you

should pay attention to the selection of the device. Typically, the stray capacitance should be less

than 1.0 pF for USB 2.0, and less than 0.15 pF for USB 3.1.

If possible, reserve 0 Ω resistors on USB_DP and USB_DM lines respectively.

⚫ Keep the ESD protection devices as close to the USB connector as possible.

⚫

RM500Q-AE&RM502Q-AE_Hardware_Design 35 / 83

HostModuleUSB_DMUSB_DPUSB_SS_RX_PUSB_SS_RX_MUSB_SS_TX_PUSB_SS_TX_MBBUSB_DMUSB_DPUSB_SS_RX_PUSB_SS_RX_MUSB_SS_TX_PUSB_SS_TX_M9737353129ESDTest PointsMinimize these stubs in PCB layout.C5 220 nFC6 220 nFC1 220 nFC2 220 nFR1 0Ω R2 0Ω R3 NM-0Ω R4 NM-0Ω  5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

3.9. PCIe Interface

RM500Q-AE&RM502Q-AE modules provide one integrated PCIe (Peripheral Component Interconnect

Express) interface which complies with the PCI Express Base Specification, Revision 3.0 and supports up

to 8 Gbps per lane.

⚫ PCI Express Base Specification Revision 3.0 compliant

⚫ Data rate up to 8 Gbps per lane

The following table shows the pin definition of PCIe interface.

Table 11: Pin Definition of PCIe Interface

Pin No. Pin Name

I/O

Description

Comment

55

53

49

47

43

41

50

52

54

PCIE_REFCLK_P AI/AO PCIe reference clock (+)

PCIE_REFCLK_M AI/AO PCIe reference clock (-)

PCIE_RX_P

AI

PCIe receive (+)

PCIE_RX_M

AI

PCIe receive (-)

PCIE_TX_P

AO

PCIe transmit (+)

PCIE_TX_M

AO

PCIe transmit (-)

PCIE_RST_N

DI

PCIe reset.

PCIE_CLKREQ_N DO

PCIe clock request.

PCIE_WAKE_N

DO

PCIe wake up

100 MHz. Require differential

impedance of 85 Ω

Require differential impedance

of 85 Ω

Require differential impedance

of 85 Ω

Open drain

Active LOW.

Open drain

Active LOW.

Open drain

Active LOW.

3.9.1. PCIe Operating Mode

RM500Q-AE&RM502Q-AE supports endpoint (EP) mode and root complex (RC) mode. In EP mode, the

module is configured as a PCIe EP device. In RC mode, the module is configured as a PCIe root complex.

The following figure shows a reference circuit for the PCIe interface.

RM500Q-AE&RM502Q-AE_Hardware_Design 36 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Figure 17: PCIe Interface Reference Circuit

AT+QCFG="pcie/mode" is used to set PCIe RC/EP mode. For more details about the command, see

document [2].

To ensure the signal integrity of PCIe interface, AC coupling capacitors C5 and C6 should be placed close

to the host on PCB. C1 and C2 have been embedded into the module, so do not place these two

capacitors on your schematic and PCB.

RM500Q-AE&RM502Q-AE_Hardware_Design 37 / 83

HostModulePCIE_REFCLK_PPCIE_REFCLK_MPCIE_RX_PPCIE_RX_MPCIE_TX_PPCIE_TX_MBBPCIE_REFCLK_PPCIE_REFCLK_MPCIE_RX_PPCIE_RX_MPCIE_TX_PPCIE_TX_M555349474341PCIE_CLKREQ_NPCIE_RST_NPCIE_WAKE_NPCIE_CLKREQ_NPCIE_RST_NPCIE_WAKE_N545250Note: The voltage level of VCC_IO_HOST depends on the host side due to the open drain in pins 50, 52 and 54.C6 220 nFC5 220 nFC2 220 nFC1 220 nFR1100kR2100kR3100kVCC_IO_HOSTR5 0RR4 0R 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Figure 18: PCIe Power-on Timing Requirements of M.2 Specification

Figure 19: PCIe Power-on Timing Requirements of the Module

The following principles of PCIe interface design should be complied with, so as to meet PCIe

specification.

⚫ Keep the PCIe data and control signals away from sensitive circuits and signals, such as RF, audio,

crystal and oscillator signals.

⚫ Add a capacitor in series on Tx/Rx traces to prevent any DC bias.

⚫ Keep the maximum trace length less than 300 mm.

⚫ Keep the length matching of each differential data pair (Tx/Rx) less than 0.7 mm for PCIe routing

traces.

RM500Q-AE&RM502Q-AE_Hardware_Design 38 / 83

VCCModule power-on or insertion detectionPICE_REFCLKRFFE_VIO_1V8System turn-on and bootingtturn-on68 ms23 msPICE_RST_NTPERST#_CLK ＞ 100 usTPVPGL 100 msVIH 1.19 Vtpower-onFULL_CARD_POWER_OFFRESET_N 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

⚫ Keep the differential impedance of PCIe data trace as 85 Ω ±10 %.

⚫ You must not route PCIe data traces under components or cross them with other traces.

3.9.2. USB and PCIe Modes

RM500Q-AE&RM502Q-AE supports to communicate through both USB and PCIe interfaces, respectively

referring to the USB mode and the PCIe mode as described below:

USB Mode

⚫ Supports all USB 2.0/3.1 features

⚫ Supports MBIM/QMI/QRTR/AT

⚫ Communication can be switched to PCIe mode by AT command

USB is the default communication interface between RM500Q-AE&RM502Q-AE module and a host. To

use PCIe interface for the communication between a host, an AT command under USB mode can be

used. For more details about the AT command, see document [2].

It is suggested that USB 2.0 interface be reserved for firmware upgrade.

USB-AT-based PCIe Mode

⚫ Supports MBIM/QMI/QRTR/AT

⚫ Communication can be switched back to USB mode by AT command

When RM500Q-AE&RM502Q-AE module works at the USB-AT-based (switched from USB mode by AT

command) PCIe mode, it supports MBIM/QMI/QRTR/AT, and can be switched back to USB mode by AT

command. But the firmware upgrade via PCIe interface is not supported, so USB 2.0 interface must be

reserved for the firmware upgrade.

eFuse-based PCIe Mode

⚫ Supports MBIM/QMI/QRTR/AT

⚫ Supports Non-X86 systems and X86 system (supports BIOS PCIe early initial)

RM500Q-AE&RM502Q-AE can also be reprogrammed to PCIe mode based on eFuse. If the

communication is switched to PCIe mode by burnt eFuse, the communication cannot be switched back to

USB mode.

Note that if the host does not support firmware upgrade through PCIe, then RM500Q-AE&RM502Q-AE

USB 2.0 interface (Pin 7 and Pin 9) and two test points (VREG_L6E_1P8 and FORCE_USB_BOOT,

reserved on bottom side) must be used for the firmware upgrade. Also, the firmware can be upgraded by

the PCIe Card EVB, which could be inserted into a PC. For more details, see document [1].

RM500Q-AE&RM502Q-AE_Hardware_Design 39 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

3.10. PCM Interface*

RM500Q-AE&RM502Q-AE module supports audio communication via Pulse Code Modulation (PCM)

digital interface. The PCM interface supports the following modes:

⚫ Primary mode (short frame synchronization): the module works as both master and slave

⚫ Auxiliary mode (long frame synchronization): the module works as master only

In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising

edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256

kHz, 512 kHz, 1024 kHz or 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4096 kHz

PCM_CLK at 16 kHz PCM_SYNC.

In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising

edge. The PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a 256

kHz PCM_CLK and an 8 kHz, 50 % duty cycle PCM_SYNC only.

The module supports 16-bit linear data format. The following figures show the primary mode’s timing

relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary mode’s timing

relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK.

Figure 20: Primary Mode Timing

RM500Q-AE&RM502Q-AE_Hardware_Design 40 / 83

PCM_CLKPCM_SYNCPCM_DOUTMSBLSBMSB125 μs12256255PCM_DINMSBLSBMSB 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Figure 21: Auxiliary Mode Timing

The following table shows the pin definition of PCM interface which can be applied to audio codec design.

Table 12: Pin Definition of PCM Interface

Pin No. Pin Name

I/O

Description

Comment

20

PCM_CLK

IO

PCM data bit clock

1.8 V power domain

In master mode, it is an output signal.

In slave mode, it is an input signal.

If unused, keep it open.

PCM_DIN

DI

PCM data input

1.8 V power domain

PCM_DOUT DO

PCM data output

1.8 V power domain

PCM_SYNC

IO

PCM data frame sync

1.8 V power domain

The clock and mode can be configured by AT command, and the default configuration is master mode

using short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. See

document [2] for details about AT+QDAI command.

22

24

28

NOTE

“*” means under development.

RM500Q-AE&RM502Q-AE_Hardware_Design 41 / 83

PCM_CLKPCM_SYNCPCM_DOUTMSBLSBPCM_DIN125 μsMSB123231LSB 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

3.11. Control and Indication Interfaces

The following table shows the pin definition of control and indication pins.

Table 13: Pin Definition of Control and Indication Interfaces

Pin No. Pin Name

I/O Description

Comment

W_DISABLE1#*

DI

Airplane mode control. Active LOW.

1.8/3.3 V

WWAN_LED#*

OD

Indicate RF status of the module.

WAKE_ON_WAN#* OD Wake up the host.

25

DPR*

DI Dynamic power reduction.

W_DISABLE2#*

DI GNSS disable control.

Open drain and

active low signal.

Open drain and

active low signal.

1.8 V power domain.

High voltage level by

default.

1.8/3.3 V power

domain.

Active LOW.

SDX2AP_STATUS DO Status indication to AP

1.8 V power domain

AP2SDX_STATUS DI

Status indication from AP

1.8 V power domain

8

10

23

26

38

68

NOTE

“*” means under development.

3.11.1. W_DISABLE1#*

The module provides a W_DISABLE1# pin to disable or enable airplane mode through hardware

operation. The W_DISABLE1# pin is pulled up by default. Driving it low will set the module to airplane

mode. In airplane mode, the RF function will be disabled.

The RF function can also be enabled or disabled through software AT commands. The following table

shows the RF function status of the module.

RM500Q-AE&RM502Q-AE_Hardware_Design 42 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Table 14: RF Function Status

W_DISABLE1# Level

AT Commands

RF Function Status

High Level

AT+CFUN=1

Enabled

AT+CFUN=0

AT+CFUN=4

AT+CFUN=0

AT+CFUN=1

AT+CFUN=4

Disabled

Disabled

High Level

Low Level

3.11.2. W_DISABLE2#*

RM500Q-AE&RM502Q-AE module provides a W_DISABLE2# pin to disable or enable the GNSS

function. The W_DISABLE2# pin is pulled up by default. Driving it low will disable the GNSS function. The

combination of W_DISABLE2# pin and AT commands can control the GNSS function.

Table 15: GNSS Function Status

W_DISABLE2# Level

AT Commands

GNSS Function Status

High Level

AT+QGPS=1

Enabled

High Level

AT+QGPSEND

Low Level

AT+QGPS=1

Disabled

Low Level

AT+QGPSEND

A simple level shifter based on diodes is used on W_DISABLE1# pin and W_DISABLE2# pin which are

pulled up to a 1.8 V voltage in the module, as shown in the following figure. So the control signals (GPIO)

of the host device could be at 1.8 V or 3.3 V voltage level. W_DISABLE1# and W_DISABLE2# are active

low signals, and a reference circuit is shown as below.

RM500Q-AE&RM502Q-AE_Hardware_Design 43 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Figure 22: W_DISABLE1# and W_DISABLE2# Reference Circuit

3.11.3. WWAN_LED#*

The WWAN_LED# signal is used to indicate RF status of the module, and its sink current is up to 10 mA.

To reduce current consumption of the LED, a current-limited resistor must be placed in series with the

LED, as illustrated in the figure below. The LED is ON when the WWAN_LED# signal is at low level.

Figure 23: WWAN_LED# Reference Circuit

The following table shows the RF status indicated by WWAN_LED# .

RM500Q-AE&RM502Q-AE_Hardware_Design 44 / 83

HostModuleW_DISABLE2#W_DISABLE1#BBGPIOGPIO268VDD 1.8 VNote: The voltage level of VCC_IO_HOST could be 1.8 V or 3.3 V typically.R3100kR2100kR510kVCC_IO_HOSTR610kHostModuleWWAN_LED#PMUGPIO10VCCNote: This VCC could be the power supply of the module.LEDR1330Ω 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Table 16: Network Status Indications of WWAN_LED#

WWAN_LED# Level

Description

Low Level (LED ON)

RF function is turned on

RF function is turned off if any of the following occurs:

⚫ The (U)SIM card is not powered.

⚫ W_DISABLE1# is at low level (airplane mode enabled).

⚫ AT+CFUN=4 (RF function disabled).

High Level (LED OFF)

3.11.4. WAKE_ON_WAN#*

The WAKE_ON_WAN# is an open drain pin, which requires a pull-up resistor on the host. When a URC

returns, a 1 s low level pulse signal will be outputted to wake up the host. The module operation status

indicated by WAKE_ON_WAN# is shown as below.

Table 17: State of the WAKE_ON_WAN#

WAKE_ON_WAN# State

Module Operation Status

Output a 1 s low level pulse signal

Call/SMS/Data is incoming (to wake up the host)

Always at high level

Idle/Sleep

Figure 24: WAKE_ON_WAN# Signal Reference Circuit

3.11.5. DPR*

RM500Q-AE&RM502Q-AE module provides a DPR (Dynamic Power Reduction) pin for body SAR

RM500Q-AE&RM502Q-AE_Hardware_Design 45 / 83

HostModuleWAKE_ON_WAN#BBGPIO23VCC_IO_HOSTNote: The voltage level on VCC_IO_HOST depends on the host side due to the open drain in pin 23.Wake up the host1sHLR110k 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

(Specific Absorption Rate) detection. The signal is sent from a host system proximity sensor to the

module to provide an input trigger, which will reduce the output power in radio transmission.

Table 18: Function of the DPR Signal

DPR Level

Function

High/Floating

NO max. transmitting power backoff

Low

Max. transmitting power backoff by AT+QCFG="sarcfg"

NOTE

3.11.6. STATUS*

See document [2] for more details about AT+QCFG="sarcfg" command.

RM500Q-AE&RM502Q-AE module provides two status indication pins for communication with IPQ807x

device. Pin 38 (SDX2AP_STATUS) outputs the status indication signal to IPQ807x device, and pin 68

(AP2SDX_STATUS) inputs the status indication signal from IPQ807x device.

3.12. Cellular/WLAN Interface*

RM500Q-AE&RM502Q-AE module provides a cellular/WLAN COEX interface, the following table shows

the pin definition of this interface.

Table 19: Pin Definition of COEX Interface

Pin No. Pin Name

I/O

Description

Comment

62

64

59

60

COEX_RXD

DI

LTE/WLAN coexistence receive

1.8 V power domain

COEX_TXD

DO

LTE/WLAN coexistence transmit

1.8 V power domain

LAA_TX_EN

DO

1.8 V power domain

Notification from SDR to WL when

LTE transmitting

Notification from WL to SDR while

transmitting

WLAN_TX_EN DI

1.8 V power domain

RM500Q-AE&RM502Q-AE_Hardware_Design 46 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

NOTE

“*” means under development.

56

58

61

63

NOTE

3.13. Antenna Tuner Control Interface*

ANTCTL[1:2] are used for antenna tuner control and should be routed to an appropriate antenna control

circuit. More details about the interface will be added in the future version of this document.

Table 20: Pin Definition of Antenna Tuner Control Interface

Pin No. Pin Name

I/O

Description

DC Characteristics

RFFE_CLK

DO

RFFE_DATA

DO

ANTCTL1

ANTCTL2

DO

DO

Used for external MIPI IC control

Antenna Control

VOLmax = 0.45 V

VOHmin = 1.35 V

VOHmax = 1.8 V

VOLmax = 0.45 V

VOHmin = 1.35 V

VOHmax = 1.8 V

“*” means under development.

3.14. Configuration Pins

RM500Q-AE&RM502Q-AE module provides four configuration pins, which are defined as below.

Pin No.

Pin Name

Power Domain Description

Table 21: Definition of Configuration Pins

21

69

CONFIG_0

CONFIG_1

I/O

DO

DO

0

0

Not connected internally

Connected to GND internally

RM500Q-AE&RM502Q-AE_Hardware_Design 47 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

75

1

CONFIG_2

CONFIG_3

DO

DO

0

0

Not connected internally

Not connected internally

The following figure shows a reference circuit of these four pins.

Figure 25: Recommended Circuit of Configuration Pins

Table 22: Configuration Pins List of M.2 Specification

Config_0

(Pin 21)

Config_1

(Pin 69)

Config_2

(Pin 75)

Config_3

(Pin 1)

Module Type and

Main Host Interface

Port

Configuration

NC

GND

NC

NC

Quectel defined

N/A

RM500Q-AE&RM502Q-AE_Hardware_Design 48 / 83

HostModuleCONFIG_0CONFIG_1CONFIG_2CONFIG_3GPIOGPIOGPIOGPIO2169751VCC_IO_HOSTR110kR210kR310kR410kNM-0Ω NM-0Ω NM-0Ω 0Ω Note: The voltage level of VCC_IO_HOST depends on the host side and could be 1.8 V or 3.3 V. 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

4 GNSS Receiver

4.1. General Description

RM500Q-AE&RM502Q-AE module includes a fully integrated global navigation satellite system solution

that supports Gen9-Lite of Qualcomm (GPS, GLONASS, BeiDou/Compass, and Galileo).

The module supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1 Hz data update

rate via USB interface by default.

By default, the module GNSS engine is switched off. It has to be switched on via AT command. For more

details about GNSS engine technology and configurations, see document [3].

4.2. GNSS Performance

The following table shows GNSS performance of RM500Q-AE&RM502Q-AE.

Table 23: GNSS Performance

Parameter

Description

Conditions

Sensitivity

(GNSS)

TTFF

(GNSS)

Cold start

Autonomous

Reacquisition

Autonomous

Tracking

Autonomous

Cold start

@ open sky

Warm start

@ open sky

Autonomous

XTRA enabled

Autonomous

XTRA enabled

Typ.

TBD

TBD

TBD

TBD

TBD

TBD

TBD

Unit

dBm

dBm

dBm

s

s

s

s

RM500Q-AE&RM502Q-AE_Hardware_Design 49 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Hot start

@ open sky

CEP-50

Autonomous

XTRA enabled

Autonomous

@ open sky

TBD

TBD

TBD

s

s

m

1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep

2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock

positioning for at least 3 minutes continuously).

within 3 minutes after the loss of lock.

3. Cold start sensitivity: the minimum GNSS signal power at which the module can fix position

successfully within 3 minutes after executing cold start command.

Accuracy

(GNSS)

NOTES

RM500Q-AE&RM502Q-AE_Hardware_Design 50 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

5 Antenna Interfaces

RM500Q-AE&RM502Q-AE provides four antenna interfaces, the impedance of antenna port is 50 Ω.

5.1. RF Antenna Interfaces

5.1.1. Antenna Pin Definition

The pin definition of RF antenna interfaces is shown below.

Table 24: RM500Q-AE&RM502Q-AE Pin Definition of RF Antenna Interfaces

Pin Name

I/O

Description

Comment

ANT0

AI/AO

50 Ω impedance

Antenna0 interface:

5G NR: MHB_TRx & n41/n77/n78/n79_PRX MIMO;

LTE: MHB_TRx & UHB_PRX MIMO

WCDMA: MHB_TRx

Antenna1 interface:

5G NR: LB_TRx & MHB_DRx MIMO &

n41_DRX & n77/n78/n79_DRx MIMO

LTE: LB_TRx & MHB_DRx MIMO & UHB_DRx MIMO &

LAA_PRx

WCDMA: LB_TRx

Antenna2 interface:

5G NR: MHB_PRX MIMO & n41/n77/n78/n79 TRX

LTE: LB_DRX & MHB_PRX MIMO & UHB_TRX

WCDMA: LB_DRX

Antenna3 interface:

5G NR: n41_DRX MIMO & n77/n78/n79_DRX

LTE: MHB_DRX & UHB_DRX & LAA_DRX

WCDMA: MHB_DRX

GNSS: L1

50 Ω impedance

ANT2

AI/AO

50 Ω impedance

ANT1

AI/AO

50 Ω impedance

ANT3_

GNSSL1

AI

RM500Q-AE&RM502Q-AE_Hardware_Design 51 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

5.1.2. RF Antenna Port Mapping

Table 25: RM500Q-AE & RM502Q-AE RF Antenna Mapping

Antenna WCDMA

4G

5G NR

n41

n77/n78/

n79

LB

(MHz)

MHB

(MHz)

n77

(MHz)

ANT0

MHB

TRX

MHB_TRx

UHB_PRx MIMO

PRx

MIMO

PRx_

MIMO

–

1452 to

2690

3300 to

4200

ANT1

LB_TRx

DRx

DRx_

MIMO

617 to

960

1452 to

2690

3300 to

4200

ANT2

LB_DRx

TRx

TRx

617 to

960

1452 to

2690

3300 to

4200

ANT3_

GNSSL1

MHB

DRx

DRx_

MIMO

DRx

–

1452 to

2690

3300 to

4200

1) LTE UHB frequency range: 3400–5000 MHz.

LB_TRx

MHB_DRx MIMO,

UHB_DRx MIMO,

LAA PRx

LB_DRx,

MHB_PRx MIMO,

UHB_TRx 1)

MHB_DRx,

UHB_DRX,

LAA_DRx

5.1.3. Operating Frequency

NOTE

LTE-FDD LTE-TDD UMTS

5G NR

Table 26: RM500Q-AE&RM502Q-AE Module Operating Frequencies

Band Name

Transmit

(MHz)

Receive

(MHz)

PCS (1900)

1850–1910

1930–1990

AWS

1710–1755

2110–2155

Cell (850)

824–849

869–894

IMT-E (2600)

2500–2570

2620–2690

700 lower A–C 699–716

729–746

700 upper C

777–787

746–756

700 D

788–798

758–768

B17

704–716

734–746

B2

B4

B5

B7

B12

B13

B14

B17

PCS + G

1850–1915

1930–1995

B25

–

–

–

–

–

–

–

–

–

B2

B4

B5

–

–

–

–

–

–

n2

–

n5

n7

n12

–

–

–

n25

RM500Q-AE&RM502Q-AE_Hardware_Design 52 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

B41/B41-XGP 2496–2690

2496–2690

B26

WCS

B38

B48

B66

B71

n77

814–849

859–894

B26

2305–2315

2350–2360

B30

2570–2620

2570–2620

3550–3700

3550–3700

1710–1780

2110–2200

B66

663–698

617–652

B71

3300–4200

3300–4200

–

–

–

–

–

–

B38

B41

B48

–

–

–

–

–

–

–

–

–

–

–

–

–

n38

n41

-

n66

n71

n77

5.1.4. Reference Design of RF Antenna Interface

A reference design of antenna interface is shown as below. A π-type matching circuit should be reserved

for better RF performance. The capacitors are not mounted by default.

Figure 26: RM500Q-AE&RM502Q-AE Reference Circuit of RF Antenna

NOTES

1. Keep the characteristic impedance for antenna trace as 50 Ω.

2. Place the π-type matching components as close to the antenna as possible.

3. Digital circuits such as (U)SIM card, USB interface, camera module, display connector and SD card

should be kept away from the antenna traces.

4. Keep 75 dB PCB isolation between two antenna traces.

5. Keep 15 dB isolation between each antenna to improve the receiving sensitivity.

RM500Q-AE&RM502Q-AE_Hardware_Design 53 / 83

ModuleANT3_GNSSL1ANT0R1 0Ω R4 0Ω C1NMC2NMC8NMC7NM 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

5.2. GNSS Antenna Interface

The following table shows frequency specification of GNSS antenna connector.

Table 27: GNSS Frequency

Type

Frequency

GPS/Galileo/QZSS

1575.42 ±1.023 (L1)

1575.42 ±2.046 (E1)

1575.42 (L1)

1597.5–1605.8

1561.098 ±2.046

Unit

MHz

MHz

MHz

MHz

MHz

Galileo

QZSS

GLONASS

BeiDou

NOTES

1. Keep the characteristic impedance for ANT3_GNSSL1 trace as 50 Ω.

2. Place the π-type matching components as close to the antenna as possible.

3. Digital circuits such as (U)SIM card, USB interface, camera module, display connector and SD card

should be kept away from the antenna traces.

4. Keep 75 dB isolation between two antenna traces.

5. Keep 15 dB isolation between each antenna to improve the receiving sensitivity.

5.3. Reference Design of RF Layout

For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50 Ω. The

impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,

the height from the signal layer to reference ground (H), and the space between RF trace and ground (S).

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Microstrip or coplanar waveguide is typically used in RF layout for characteristic impedance control. The

following are reference designs of microstrip or coplanar waveguide with different PCB structures.

Figure 27: Microstrip Design on a 2-layer PCB

Figure 28: Coplanar Waveguide Design on a 2-layer PCB

Figure 29: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)

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Figure 30: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)

To ensure RF performance and reliability, the following principles should be complied with in RF layout

design:

⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to

⚫ The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully

50 Ω.

connected to ground.

⚫ The distance between the RF pins and the RF connector should be as short as possible, and all the

right-angle traces should be changed to curved ones. The recommended trace angle is 135°.

⚫ There should be clearance under the signal pin of the antenna connector or solder joint.

⚫ The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around

RF traces and the reference ground could help to improve RF performance. The distance between

the ground vias and RF traces should be no less than two times the width of RF signal traces (2 × W).

⚫ Keep RF traces away from interference sources, and avoid intersection and paralleling between

traces on adjacent layers.

For more details about RF layout, see document [4].

5.4. Antenna Connectors

RM500Q-AE&RM502Q-AE ANT0, ANT1, ANT2 and ANT3_GNSSL1 antenna connectors are shown as

below.

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Figure 31: RM500Q-AE Antenna Connectors

Figure 32: RM502Q-AE Antenna Connectors

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ANT0ANT1ANT2ANT3_GNSSANT0ANT1ANT2ANT3_GNSS 5G Module Series

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5.4.1 RF Bands Supported by Antenna Connectors

Table 28: RF Bands Supported by RM500Q-AE&RM502Q-AE Antenna Connectors

Description

Frequency

Antenna0 interface:

5G NR:

MHB_TRx & n41/n77/ _PRx MIMO;

LTE: MHB_TRx & UHB_PRx MIMO

WCDMA: MHB_TRx

Antenna1 interface:

5G NR:

LB_TRx & MHB_DRx MIMO & n41_DRx & n77_DRx MIMO

LTE:

LB_TRx & MHB_DRx MIMO & UHB_DRx MIMO & LAA_PRx

WCDMA: LB_TRX

Antenna2 interface:

5G NR:MHB_PRx MIMO & n41/n77 TRx

LTE:LB_DRx & MHB_PRx MIMO & UHB_TRx

WCDMA: LB_DRx

Antenna3 interface:

5GNR:n41_DRX MIMO & n77_DRX

LTE:MHB_DRX & UHB_DRX & LAA_DRx

WCDMA:MHB_DRX

GNSS: L1

1400–5000 MHz

600–6000 MHz

600–5000 MHz

1400–6000 MHz

Pin

Name

ANT0

ANT1

ANT2

ANT3_

GNSSL1

NOTE

n77 group also includes B42/B48 function.

5.5. Antenna Installation

5.5.1. Antenna Requirements

The following table shows the requirements on WCDMA, LTE, 5G NR antenna and GNSS antenna.

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Table 29: Antenna Requirements

Type

Requirements

GNSS

WCDMA/LTE/5G NR

⚫ Frequency range: 1559–1606 MHz

⚫ Polarization: RHCP or linear

⚫ VSWR: < 2 (Typ.)

⚫ Passive antenna gain: >0 dBi

⚫ VSWR: ≤ 3

⚫ Efficiency: > 30%

⚫

Input Impedance: 50 Ω

⚫ Cable insertion loss: < 1 dB

WCDMA B5

LTE B5/B12/B13/B14/B17/B26/B71

5G NR n5/n12/n71

⚫ Cable insertion loss: < 1.5 dB

WCDMA B2/B4

LTE B2/B4/B25/B66

5G NR n2/n25/n66

⚫ Cable insertion loss: < 2 dB

LTE B7/B38/B41/B48

⚫ 5G NR n7*/n41/n77

5.5.2. Recommended RF Connector for Antenna Installation

RM500Q-AE&RM502Q-AE is mounted with standard 2 mm × 2 mm receptacle RF connectors for

convenient antenna connection.

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The connector dimensions are illustrated as below:

Figure 33: RM500Q-AE&RM502Q-AE RF Connector Dimensions (Unit: mm)

Item

Table 30: Major Specifications of the RF Connector

Specification

Nominal Frequency Range

DC to 6 GHz

Nominal Impedance

50 Ω

Temperature Rating

-40 to +85 °C

Voltage Standing Wave Ratio (VSWR)

Meet the requirements of:

Max 1.3 (DC–3 GHz)

Max 1.45 (3–6 GHz)

The receptacle RF connector used in conjunction with the module will accept two types of mating plugs

that will meet a maximum height of 1.2 mm using a Ø0.81 mm coaxial cable or a maximum height of 1.45

mm utilizing a Ø1.13 mm coaxial cable.

The following figure shows the specifications of mating plugs using Ø0.81 mm coaxial cables.

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Figure 34: Specifications of Mating Plugs Using Ø0.81 mm Coaxial Cables

The following figure illustrates the connection between the receptacle RF connector on the module and

the mating plug using a Ø0.81 mm coaxial cable.

Figure 35: Connection between RF Connector and Mating Plug Using Ø0.81 mm Coaxial Cable

The following figure illustrates the connection between the receptacle RF connector on the module and

the mating plug using a Ø1.13 mm coaxial cable.

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Figure 36: Connection between RF Connector and Mating Plug Using Ø1.13 mm Coaxial Cable

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6 Reliability, Radio and Electrical

Characteristics

6.1. Absolute Maximum Ratings

Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are

listed in the following table.

Table 31: Absolute Maximum Ratings

Parameter

VCC

Voltage at Digital Pins

Min.

-0.3

-0.3

Max.

Unit

4.7

2.3

V

V

6.2. Power Supply Requirements

The typical input voltage of the module is 3.7 V, as specified by PCIe M.2 Electromechanical Specification

Rev 1.0. The following table shows the power supply requirements of the module.

Table 32: Power Supply Requirements

Parameter

Description

Min.

Typ.

Max.

Unit

VCC

Power Supply

3.135

3.7

Voltage Ripple

Voltage Drop

–

–

30

–

4.4

100

165

V

mV

mV

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6.3. I/O Requirements

Table 33: I/O Requirements

Parameter

Description

Min.

Max.

Unit

Input high voltage

0.7 × VDD18

1)

VDD18 +0.3

Input low voltage

-0.3

0.3 × VDD18

Output high voltage

VDD18-0.5

Output low voltage

0

VDD18

0.4

V

V

V

V

1) VDD18 is the I/O power domain of the module.

6.4. Operating and Storage Temperatures

Table 34: Operating and Storage Temperatures

Parameter

Min.

Max.

Unit

Operating Temperature Range1)

-20

Extended Temperature Range2)

-40

Storage temperature Range

-40

Typ.

+25

+60

+85

+90

ºC

ºC

ºC

VIH

VIL

VOH

VOL

NOTE

NOTES

1. 1) To meet this operating temperature range, you need to ensure effective thermal dissipation, for

example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range,

the module meets 3GPP specifications.

2. 2) To meet this extended temperature range, you need to ensure effective thermal dissipation, for

example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range,

the module remains the ability to establish and maintain functions such as voice, SMS, emergency

call, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not

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influenced, while one or more specifications, such as Pout, may undergo a reduction in value,

exceeding the specified tolerances of 3GPP. When the temperature returns to the normal operating

temperature level, the module will meet 3GPP specifications again.

6.5. Current Consumption

Table 35: RM500Q-AE&RM502Q-AE Current Consumption

Description

Conditions

OFF state

Power down

Typ.

Unit

TBD μA

AT+CFUN=0 (USB disconnected)

WCDMA PF = 64 (USB disconnected)

WCDMA PF = 128 (USB disconnected)

WCDMA PF = 512 (USB disconnected)

Sleep state

LTE-FDD PF = 32 (USB disconnected)

LTE-FDD PF = 64 (USB disconnected)

LTE-FDD PF = 128 (USB disconnected)

LTE-TDD PF = 32 (USB disconnected)

LTE-TDD PF = 64 (USB disconnected)

LTE-TDD PF = 128 (USB disconnected)

WCDMA PF = 64 (USB disconnected)

WCDMA PF = 64 (USB connected)

LTE-FDD PF = 64 (USB disconnected)

LTE-FDD PF = 64 (USB connected)

LTE-TDD PF = 64 (USB disconnected)

LTE-TDD PF = 64 (USB connected)

Idle state

WCDMA data

transfer (GNSS

OFF)

WCDMA B2 HSDPA CH9800 @ 23 dBm

WCDMA B2 HSUPA CH9800 @ 23 dBm

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

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LTE

data transfer

(GNSS OFF)

LTE-FDD B17 CH5790 @ 23 dBm

LTE-FDD B25 CH8365 @ 23 dBm

WCDMA B4 HSDPA CH1638 @ 23 dBm

WCDMA B4 HSUPA CH1638 @ 23 dBm

WCDMA B5 HSDPA CH4407 @ 23 dBm

WCDMA B5 HSUPA CH4407 @ 23 dBm

LTE-FDD B2 CH900 @ 23 dBm

LTE-FDD B4 CH2175 @ 23 dBm

LTE-FDD B5 CH2525 @ 23 dBm

LTE-FDD B7 CH3100 @ 23 dBm

LTE-FDD B12 CH5095 @ 23 dBm

LTE-FDD B13 CH5230 @ 23 dBm

LTE-FDD B14 CH5330 @ 23 dBm

LTE-FDD B26 CH8865 @ 23 dBm

LTE-FDD B30 CH9820 @ 23 dBm

LTE-TDD B38 CH38000 @ 23 dBm

LTE-TDD B41 CH40620 @ 23 dBm

LTE-TDD B48 CH55990 @ 23 dBm

LTE-FDD B66 CH66886 @ 23 dBm

LTE-FDD B71 CH68761 @ 23 dBm

5G NR-TDD n41 CH501204 @ 23 dBm

5G NR-TDD n41 CH518598 @ 23 dBm

5G NR-TDD n41 CH535998 @ 23 dBm

5G NR-TDD n77 CH620668 @ 23 dBm

5G NR-TDD n77 CH650000 @ 23 dBm

5G NR-TDD n77 CH679332 @ 23 dBm

5G NR data

transfer (GNSS

OFF)

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

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5G NR-FDD n2 CH387000 @ 23 dBm

5G NR-FDD n2 CH392000 @ 23 dBm

5G NR-FDD n2 CH397000 @ 23 dBm

5G NR-FDD n5 CH174800 @ 23 dBm

5G NR-FDD n5 CH176300 @ 23 dBm

5G NR-FDD n5 CH177800 @ 23 dBm

5G NR-FDD n7 CH525000 @ 23 dBm

5G NR-FDD n7 CH531000 @ 23 dBm

5G NR-FDD n7 CH537000 @ 23 dBm

5G NR-FDD n12 CH146800 @ 23 dBm

5G NR-FDD n12 CH147500 @ 23 dBm

5G NR-FDD n12 CH148200 @ 23 dBm

5G NR-FDD n66 CH423000 @ 23 dBm

5G NR-FDD n66 CH429000 @ 23 dBm

5G NR-FDD n66 CH435000 @ 23 dBm

5G NR-FDD n71 CH124400 @ 23 dBm

5G NR-FDD n71 CH126900 @ 23 dBm

5G NR-FDD n71 CH129400 @ 23 dBm

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

TBD

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

6.6. RF Output Power

The following table shows the RF output power of RM500Q-AE&RM502Q-AE.

Table 36: RF Output Power

Mode

Frequency

Max.

Min.

WCDMA WCDMA bands

24 dBm +1/-3 dB (Class 3)

< -50 dBm

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LTE bands

23 dBm ±2 dB (Class 3)

< -40 dBm

LTE

LTE HPUE bands

(B38/B41/)

26 dBm ±2 dB (Class 2)

< -40 dBm

5G NR bands

23 dBm ±2 dB (Class 3)

5G NR HUPE bands

(n41/n77)

26 dBm +2/-3 dB (Class 2)

< -40 dBm

(BW: 5–20 MHz) 1)

< -40 dBm

(BW: 5–20 MHz) 1)

1) For 5G NR TDD bands, the normative reference for this requirement is TS 38.101-1 [2] clause 6.3.1

6.7. RF Receiving Sensitivity

The following tables show conducted RF receiving sensitivity of RM500Q-AE&RM502Q-AE.

Table 37: RM500Q-AE&RM502Q-AE Conducted RF Receiving Sensitivity

Mode

Frequency

Primary Diversity SIMO 1)

3GPP (SIMO)

WCDMA B2

TBD

TBD

TBD

-106.7 dBm

WCDMA

WCDMA B4

TBD

TBD

TBD

-106.7 dBm

WCDMA B5

TBD

TBD

TBD

-104.7 dBm

LTE-FDD B2 (10 MHz)

TBD

TBD

TBD

-96.3 dBm

LTE-FDD B4 (10 MHz)

TBD

TBD

TBD

-96.3 dBm

LTE-FDD B5 (10 MHz)

TBD

TBD

TBD

-94.3 dBm

LTE

LTE-FDD B7 (10 MHz)

TBD

TBD

TBD

-94.3 dBm

LTE-FDD B12 (10 MHz)

TBD

TBD

TBD

-93.3 dBm

LTE-FDD B13 (10 MHz)

TBD

TBD

TBD

-93.3 dBm

LTE-FDD B14 (10 MHz)

TBD

TBD

TBD

-93.3 dBm

LTE-FDD B17 (10 MHz)

TBD

TBD

TBD

-93.3 dBm

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LTE-FDD B25 (10 MHz)

TBD

TBD

TBD

-92.8 dBm

LTE-FDD B26 (10 MHz)

TBD

TBD

TBD

-93.8 dBm

LTE-FDD B30 (10 MHz)

TBD

TBD

TBD

-95.3 dBm

LTE-TDD B38 (10 MHz)

TBD

TBD

TBD

-96.3 dBm

LTE-TDD B41 (10 MHz)

TBD

TBD

TBD

-94.3 dBm

LTE-TDD B48 (10 MHz)

TBD

TBD

TBD

-95 dBm

LTE-FDD B66 (10 MHz)

TBD

TBD

TBD

-96.5 dBm

LTE-FDD B71 (10 MHz)

TBD

TBD

TBD

-94.2 dBm

5G NR-FDD n2 (20 MHz) (SCS:

15 kHz)

5G NR-FDD n5 (10 MHz) (SCS:

15 kHz)

5G NR-FDD n7 (20 MHz) (SCS:

15 kHz)

5G NR-FDD n12 (10 MHz)

(SCS: 15 kHz)

5G NR-FDD n25 (20 MHz)

(SCS: 15 kHz)

5G NR-TDD n41 (20 MHz)

(SCS: 30 kHz)

5G NR-FDD n66 (20 MHz)

(SCS: 15 kHz)

5G NR-FDD n71 (10 MHz)

(SCS: 15 kHz)

5G NR-TDD n77 (20 MHz)

(SCS: 30 kHz)

TBD

TBD

TBD

-94.0 dBm

TBD

TBD

TBD

-95.0 dBm

TBD

TBD

TBD

-92.0 dBm

TBD

TBD

TBD

-94.0 dBm

TBD

TBD

TBD

-92.0 dBm

TBD

TBD

TBD

-93.5 dBm

TBD

TBD

TBD

-94.0 dBm

TBD

TBD

TBD

-92.9 dBm

5G NR

TBD

TBD

TBD

-90.5 dBm

NOTE

1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two

antennas at the receiver side, which improves Rx performance.

6.8. ESD Characteristics

The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject

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to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and

packaging procedures must be applied throughout the processing, handling and operation of any

application that incorporates the module.

The following table shows the module electrostatic discharge characteristics.

Table 38: Electrostatic Discharge Characteristics (Temperature: 25 ºC, Humidity: 40 %)

Tested Interfaces

Contact Discharge

Air Discharge

Unit

VCC, GND

Antenna Interfaces

±5

±4

Other Interfaces

±0.5

6.9. Thermal Dissipation

±10

±8

±1

kV

kV

kV

RM500Q-AE&RM502Q-AE is designed to work over an extended temperature range. In order to achieve

a maximum performance while working under extended temperatures or extreme conditions (such as with

maximum power or data rate) for a long time, it is strongly recommended to add a thermal pad or other

thermally conductive compounds between the module and the main PCB for thermal dissipation.

The thermal dissipation area on the bottom (i.e. the area for adding thermal pad) is shown as below on

the below, and conductive compounds are also added on the BB, MCP, PMU, WTR, PA-1, PA-2 chips

inside the module. The dimensions are measured in mm.

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Figure 37: Thermal Dissipation Area on Bottom Side of Module

There are other measures to enhance heat dissipation performance:

⚫ Add ground vias as many as possible on PCB.

⚫ Maximize airflow over/around the module.

⚫ Place the module away from other heating sources.

⚫ Module mounting holes must be used to attach (ground) the device to the main PCB ground.

⚫

It is NOT recommended to apply solder mask on the main PCB where the module’s thermal

dissipation area is located.

⚫ Select an appropriate material, thickness and surface for the outer housing (i.e. the mechanical

enclosure) of the application device that integrates the module so that it provides good thermal

dissipation.

⚫ Customers may also need active cooling to pull heat away from the module.

⚫

If possible, add a heatsink on the top of the module. A thermal pad should be used between the

heatsink and the module, and the heatsink should be designed with as many fins as possible to

increase heat dissipation area.

NOTE

If a conformal coating is necessary for the module, do NOT use any coating material that may chemically

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react with the PCB or shielding cover, and prevent the coating material from flowing into the module.

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7 Mechanical Dimensions and

Packaging

This chapter mainly describes mechanical dimensions and packaging specifications of

RM500Q-AE&RM502Q-AE. All dimensions are measured in mm, and the tolerances are ±0.05 mm

unless otherwise specified.

7.1. Mechanical Dimensions of the Module

Figure 38: Mechanical Dimensions of the Module (Unit: mm)

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7.2. Top and Bottom Views of the Module

Figure 39: RM500Q-AE Top View and Bottom view

Figure 40: RM502Q-AE Top View and Bottom View

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NOTE

Images above are for illustration purpose only and may differ from the actual module. For authentic

appearance and label, please refer to the module received from Quectel.

7.3. M.2 Connector

The module adopts a standard PCI Express M.2 connector which compiles with the directives and

standards listed in document [5].

7.4. Packaging

The modules are packaged in trays. The following figure shows the tray size.

Figure 41: Tray Size (Unit: mm)

Each tray contains 10 modules. The smallest package contains 100 modules. Tray packaging procedures

are as below.

1. Use 10 trays to package 100 modules at a time (tray size: 247 mm × 172 mm).

2. Place an empty tray on the top of the 10-tray stack.

3. Fix the stack with masking tape in “#” shape as shown in the following figure.

4. Pack the stack with conductive bag, and then fix the bag with masking tape.

5. Place the list of IMEI No. into a small carton.

6. Seal the carton and then label the seal with sealing sticker (small carton size: 250 mm × 175 mm ×

128 mm).

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Figure 42: Tray Packaging Procedure

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8 Appendix References

Table 39: Related Documents

SN. Document Name

Remark

[1]

Quectel_PCIe_Card_EVB_User_Guide

PCIe card EVB user guide

Quectel_RG50xQ&RM5xxQ_Series_AT_Commands_

Manual

AT commands manual for RG50xQ,

RM5xxQ series

Quectel_RG50xQ&RM5xxQ_Series_GNSS_

Application_Note

The GNSS application note for

RG50xQ and RM5xxQ series

[4]

Quectel_RF_Layout_Application_Note

RF layout application note

[5]

PCI Express M.2 Specification Rev3.0

PCI express M.2 specification

Table 40: Terms and Abbreviations

Abbreviation

Description

Bit Per Second

Delta Firmware Upgrade Over-The-Air

Downlink

Dynamic Power Reduction

Equivalent Isotropically Radiated Power

Electrostatic Discharge

Frequency Division Duplexing

Global Navigation Satellite System

Global Positioning System

GLONASS

Global Navigation Satellite System (Russia)

[2]

[3]

bps

DFOTA

DL

DPR

EIRP

ESD

FDD

GNSS

GPS

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GSM

HSPA

HSUPA

kbps

LAA

LED

LTE

Mbps

ME

MIMO

MLCC

MO

MT

PAP

PCB

PCIe

PCM

PDU

PME

PPP

RF

Rx

SAR

SMS

Tx

Global System for Mobile Communications

High Speed Packet Access

High Speed Uplink Packet Access

Kilo Bits Per Second

License Assisted Access

Light Emitting Diode

Long Term Evolution

Mega Bits Per Second

Mobile Equipment

Multiple-Input Multiple-Output

Multiplayer Ceramic Chip Capacitor

Mobile Originated

Mobile Terminated

Password Authentication Protocol

Printed Circuit Board

Peripheral Component Interconnect Express

Pulse Code Modulation

Protocol Data Unit

Power Management Event

Point-to-Point Protocol

Radio Frequency

Receive

Specific Absorption Rate

Short Message Service

Transmit

RM500Q-AE&RM502Q-AE_Hardware_Design 78 / 83

 5G Module Series

RM500Q-AE&RM502Q-AE Hardware Design

Universal Asynchronous Receiver & Transmitter

(U)SIM

(Universal) Subscriber Identity Module

UART

UL

URC

USB

VIH

VIL

VOH

VOL

Uplink

Unsolicited Result Code

Universal Serial Bus

Input High Voltage Level

Input Low Voltage Level

Output High Voltage Level

Output Low Voltage Level

WCDMA

Wideband Code Division Multiple Access

Installation engineers need to be aware of the potential risk of the thermal effects of radio frequency

energy and how to stay protected against undue risk.

The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user's body

and must not transmit simultaneously with any other antenna or transmitter.

RM500Q-AE&RM502Q-AE_Hardware_Design 79 / 83

OEM/Integrators Installation Manual

Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module

is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate

approval is required for all other operating configurations, including portable configurations with respect

to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host

manufacturer is responsible for additional testing to verify compliance as a composite system. When

testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show

compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The

modules should be transmitting and the evaluation should confirm that the module's intentional

emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must

verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart

B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the

host manufacturer for Part 15 B requirements if needed.

Important Note

notice that any deviation(s) from the defined parameters of the antenna trace, as described by the

instructions, require that the host product manufacturer must notify to Quectel that they wish to change

the antenna trace design. In this case, a Class II permissive change application is required to be filed by

the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application)

procedure followed by a Class II permissive change application

End Product Labeling

When the module is installed in the host device, the FCC/IC ID label must be visible through a window

on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a

second label must be placed on the outside of the final device that contains the following text: “Contains

FCC ID: XMR2020RM500QAE” “Contains IC: 10224A-2021RM500AE”. The FCC ID/IC ID can be used

only when all FCC/IC compliance requirements are met.

Antenna

authorization.

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna.

In the event that these conditions cannot be met (for example certain laptop configurations or co-location

with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC

ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible

for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC

To comply with FCC regulations limiting both maximum RF output power and human exposure to RF

radiation, maximum antenna gain (including cable loss) must not exceed

Antenna Gain (dBi)

Test Mode

Antenna Gain (dBi)

Test Mode

WCDMA B2

WCDMA B4

WCDMA B5

LTE B2

LTE B4

LTE B5

LTE B7

LTE B12

LTE B13

LTE B14

LTE B17

LTE B25

LTE B26

LTE B30*

8.00

5.00

5.00

8.00

5.00

5.00

8.00

5.00

5.00

5.00

5.00

8.00

5.00

5.00

LTE B38

LTE B41

LTE B48*

LTE B66

LTE B71

n2

n5

n7

n12

n25

n41

n66

n71

n77

5.00

5.00

5.00

5.00

5.00

8.00

5.00

8.00

5.00

8.00

5.00

5.00

5.00

5.00

Note: “*” means when using these max gain antenna, the host manufacturer should reduce the

conducted power to meet the FCC maximum RF output power limit.

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install

or remove this RF module in the user’s manual of the end product which integrates this module. The end

user manual shall include all required regulatory information/warning as show in this manual

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference

received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant

to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which can

be determined by turning the equipment off and on, the user is encouraged to try to correct the

interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could void

the user's authority to operate this equipment. This transmitter must not be co-located or operating in

conjunction with any other antenna or transmitter.

List of applicable FCC rules

This module has been tested and found to comply with part 22, part 24, part 27, part 90, 15.247 and

15.407 requirements for Modular Approval.

The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules)

listed on the grant, and that the host product manufacturer is responsible for compliance to any other

FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the

grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-

radiator digital circuity), then the grantee shall provide a notice stating that the final host product still

requires Part 15 Subpart B compliance testing with the modular transmitter installed.

This device is intended only for OEM integrators under the following

conditions: (For module device use)

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements

required with this module installed.

Radiation Exposure Statement

your body.

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

This equipment should be installed and operated with minimum distance 20 cm between the radiator &

Industry Canada Statement

This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following

(1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired operation

two conditions:

of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts

de licence. L'exploitation est autorisée aux deux conditions suivantes:

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est

susceptible d'en compromettre le fonctionnement."

Radiation Exposure Statement

body

Déclaration d'exposition aux radiations:

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20 cm between the radiator & your

Cet équipement est conforme aux limites d'exposition aux rayonnements ISED établies pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de

distance entre la source de rayonnement et votre corps.

This device is intended only for OEM integrators under the following

conditions: (For module device use)

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2

conditions above are met, further transmitter test will not be required. However, the OEM integrator is still

responsible for testing their end-product for any additional compliance requirements required with this

module installed.

Cet appareil est conçu uniquement pour les intégrateurs OEM dans les

conditions suivantes: (Pour utilisation de dispositif module)

1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et

les utilisateurs, et

2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.

Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront

pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final

pour toutes exigences de conformité supplémentaires requis pour ce module installé.

IMPORTANT NOTE:

In the event that these conditions cannot be met (for example certain laptop configurations or colocation

with another transmitter), then the Canada authorization is no longer considered valid and the IC ID

cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for

re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.

NOTE IMPORTANTE:

Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations

d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada

n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces

circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et

l'obtention d'une autorisation distincte au Canada.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such

that 20 cm may be maintained between the antenna and users. The final end product must be labeled in

a visible area with the following: “Contains IC: 10224A-2021RM500AE”.

Plaque signalétique du produit final

Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut

être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les

utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient

des IC: 10224A-2021RM500AE".

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install

or remove this RF module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warning as show in this manual.

Manuel d'information à l'utilisateur final

L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la

façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre

ce module.

Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et

avertissements comme indiqué dans ce manuel.



 

 

 

 

 

 

 

 

 

 

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Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Declaration of authorization Date: 2021.01.12 Product Name: 5G Sub-6 GHz M.2 Module Model No.: RM500Q-AE FCC ID: XMR2020RM500QAE We, the undersigned, hereby authorize MRT Technology (Suzhou) Co., Ltd to act on our behalf, to act on our behalf in all manners relating to FCC approval of our products: report submittal, related correspondence, the signing of all documents relating to these matters, and any other lawful activity necessary to obtain such certification. Any act carried out by MRT Technology (Suzhou) Co., Ltd within the scope of this authorization shall have the same effects as our own. Name Representative of agent: Marlin Chen Agent Company name: MRT Technology (Suzhou) Co., Ltd Address: D8 Building, Youxin Industrial Park, No.2 Tian'edang Rd., Wuzhong Economic Development Zone, City: Suzhou Country: China If you have any questions regarding the authorization, please dont hesitate to contact us. Sincerely yours, Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511

 

 

Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Confidentiality Letter Date: 2021.01.12 Federal Communications Commission Authorization and Evaluation Division FCC ID: XMR2020RM500QAE Confidentiality Request released to the public. Operational Description Parts List Tune up procedure Block Diagram Schematics Pursuant to FCC 47 CRF 0.457(d) and 0.459, we request that a part of the subject FCC application listed below be held permanently confidential and permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily Further, the Applicant has spent substantial effort in developing this product, some aspects of which are deemed to be trade secret and proprietary. Having the subject information easily available to our competitors in this market would negate the advantage we have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Sincerely yours, Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511

 

 

Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Confidentiality Letter Date: 2021.01.12 Federal Communications Commission Authorization and Evaluation Division FCC ID: XMR2020RM500QAE Confidentiality Request Pursuant to Sections 0.457 and 0.459 of the commissions rules, we request shortterm confidential treatment for the following information until 180 days after the Grant Date of Equipment Authorization in order to ensure sensitive business information remains confidential until the actual marketing of the device:

Test Setup Photos External Photos Internal Photos User Manual Sincerely yours, Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511

 

 

Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Request for Modular/Limited Modular Approval Date: January 22, 2021 Subject: Manufacturers Declaration for Confidentiality Request for: XMR2020RM500QAE

- Modular Approval

- Split Modular Approval

- Limited Modular Approval - Limited Split Modular Approval 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement Requirement Met 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i) Details: <example The module contains a metal shield which covers all RF components and circuitry. The shield is located on the top of the board next to antenna connector>

- YES - NO(*) 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii) Details: <example Data to the modulation circuit is buffered as described in the operational description provided with the application>

- YES - NO(*) 3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii) Details: <example The module contains its own power supply regulation. Please refer to schematic filed with this application>

- YES - NO(*) 4. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv) Details: <example The module connects to its antenna using an UFL connector which is considered a non-

standard connector. A list of antennas tested and approved with this device may be found in users manual provided with the application>

- YES - NO(*) 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v) Details: <example The module was tested stand-alone as shown in test setup photographs filed with this application>

- YES - NO(*) 6. The modular transmitter must be labeled with its own FCC ID number, or use an electron Modular Approval Requirement Requirement Met display (see KDB Publication 784748). If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID:

XMR2020RM502QAE or Contains FCC ID: XMR2020RM502QAE Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi) Details: <example There is a label on the module as shown in the labeling exhibit filed with this application. Host specific labeling instructions are shown in the installation manual .filed with this application.>

- YES - NO(*) 7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii) Details: <example The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application.>

- YES - NO(*) 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1)(viii) Details: < The module meets RF exposure in mobile configuration.>

- YES - NO(*) 070920-02b Limited Module Description When Applicable

* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval

(LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA; the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: <example - N/A>

Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement Requirement Met 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Details: <example The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. >

Separate Cover Letter

- Provided in

- N/A 2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.

- Provided in Separate Cover Letter

- N/A Details: <example N/A>

Split Modular Requirements Requirement Provided in Manual 1. For split modular transmitters, specific descriptions for secure communications between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained. Details: <example N/A >

- Provided in Separate Cover Letter

- N/A 070920-02b OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?

- YES

- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 D03, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. include a cover letter as cited above. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 point systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D03, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc note that omni-directional is not considered a type) 7. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product 8. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 a. Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. b. Provide information on how to configure test modes for evaluation 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10

- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.

- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. Sincerely, 070920-02b Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511