FCC ID: XMR2023AH20C Bluetooth Module

AH20C Hardware Design Automotive Bluetooth Module Series Version: 1.0.2 Date: 2022-12-30 Status: Preliminary Automotive Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved. AH20C_Hardware_Design 2 / 41 Automotive Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal shall notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation interference with of wireless appliances in an aircraft communication systems. If there is an Airplane Mode, it shall be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. is forbidden to prevent Wireless devices may cause interference on sensitive medical equipment, so the restrictions on the use of wireless devices when in please be aware of hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. AH20C_Hardware_Design 3 / 41 Automotive Bluetooth Module Series About the Document Revision History Version Date Author Description

2022-01-21 Julian XIA Creation of the document 1.0.0 2022-01-21 Julian XIA Preliminary 1.0.1 2022-06-10 Julian XIA Preliminary:

1. Updated Bluetooth 5.0 to Bluetooth 5.2. 2. Updated modules weight information (Table 2) 3. Updated pin 2, 3, 5, 6 descriptions (Table 4, Table 5). 4. Updated pin 12 description (Table 4, Table 11). 5. Updated power consumption data (Table 17). 6. Updated RF performances (Table 18). 7. Updated ESD parameters (Table 20). (Table 22). Preliminary:

1. Updated the power-up and power-down timing (Figure 4). 2. Updated block diagram of Bluetooth application interface connection (Figure 5). 1.0.2 2022-12-30 Julian XIA/

Shinnie XU 3. Added the description of I2C interface (Chapter 3.5.3). 4. Updated the absolute maximum ratings (Table 15). 5. Updated recommended footprint and top and bottom views of the module (Figure 18, Figure 19). 6. Updated the ramp-up slope and cool-down slope (Figure 20, Table 22). 7. Updated the packing specifications (Chapter 6.3). AH20C_Hardware_Design 4 / 41 Automotive Bluetooth Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ....................................................................................................................................4 Contents ........................................................................................................................................................5 Table Index ....................................................................................................................................................7 Figure Index ..................................................................................................................................................8 1 2 3 4 Introduction ........................................................................................................................................... 9 Product Overview ............................................................................................................................... 10 2.1. General Description ...................................................................................................................10 Key Features ............................................................................................................................. 10 2.2. Functional Diagram ....................................................................................................................11 2.3. EVB Kit ....................................................................................................................................... 11 2.4. 3.4. 3.3.1. 3.3.2. 3.4.1. 3.4.2. 3.4.3. Application Interfaces ........................................................................................................................12 Pin Assignment .......................................................................................................................... 12 3.1. Pin Description ...........................................................................................................................13 3.2. Power Supply .............................................................................................................................15 3.3. Reference Design for Power Supply ..............................................................................15 Reset ...............................................................................................................................16 Bluetooth Application Interfaces ................................................................................................17 BT_WAKE_HOST and HOST_WAKE_BT .....................................................................17 PCM Interface .................................................................................................................17 UART Interface ............................................................................................................... 18 3.5. Other Interfaces ......................................................................................................................... 19 JTAG_SEL ...................................................................................................................... 19 BT_CLK_REQ ................................................................................................................ 19 I2C Interface ................................................................................................................... 19 3.6. RF Antenna Interface ................................................................................................................ 20 3.6.1. Pin Definition of RF Antenna Interface ...........................................................................20 3.6.2. Operating Frequency ......................................................................................................20 Reference Design of RF Antenna Interface ...................................................................20 3.6.3. RF Routing Guidelines ................................................................................................... 21 3.6.4. Antenna Design Requirements ...................................................................................... 23 3.6.5. RF Connector Recommendation ................................................................................... 23 3.6.6. 3.5.1. 3.5.2. 3.5.3. Electrical Characteristics & Reliability ............................................................................................ 25 Absolute Maximum Ratings ...................................................................................................... 25 4.1. Power Supply Ratings ............................................................................................................... 25 4.2. 4.3. Power Consumption .................................................................................................................. 25 4.4. RF Performances ...................................................................................................................... 26 4.5. Digital I/O Characteristics ..........................................................................................................27 4.6. ESD Protection .......................................................................................................................... 27 4.7. Operating and Storage Temperatures .......................................................................................28 AH20C_Hardware_Design 5 / 41 Automotive Bluetooth Module Series 5 Mechanical Information ..................................................................................................................... 29 5.1. Mechanical Dimensions ............................................................................................................ 29 5.2. Recommended Footprint ...........................................................................................................31 Top and Bottom Views ...............................................................................................................32 5.3. 6 Storage, Manufacturing & Packaging .............................................................................................. 33 6.1. Storage Conditions .................................................................................................................... 33 6.2. Manufacturing and Soldering .................................................................................................... 34 Packaging Specifications .......................................................................................................... 36 6.3. Carrier Tape .................................................................................................................... 36 6.3.1. Plastic Reel .....................................................................................................................37 6.3.2. 6.3.3. Mounting Direction ..........................................................................................................37 Packaging Process .........................................................................................................38 6.3.4. 7 Appendix References .........................................................................................................................39 AH20C_Hardware_Design 6 / 41 Automotive Bluetooth Module Series Table Index Table 1: Module Information .......................................................................................................................... 9 Table 2: Key Features .................................................................................................................................. 10 Table 3: I/O Parameters Definition .............................................................................................................. 13 Table 4: Pin Description ............................................................................................................................... 13 Table 5: Definition of Power Supply and GND Pins .................................................................................... 15 Table 6: Pin Definition of RESET .................................................................................................................16 Table 7: Pin Definition of BT_WAKEUP_HOST and HOST_WAKEUP_BT ............................................... 17 Table 8: Pin Definition of PCM Interface ..................................................................................................... 17 Table 9: Pin Definition of UART Interface ....................................................................................................18 Table 10: Pin Definition of JTAG_SEL .........................................................................................................19 Table 11: Pin Definition of BT_CLK_REQ ................................................................................................... 19 Table 12: Pin Definition of RF Antenna Interface ........................................................................................ 20 Table 13: Operating Frequency ................................................................................................................... 20 Table 14: Antenna Design Requirements ....................................................................................................23 Table 15: Absolute Maximum Ratings (Unit: V) ...........................................................................................25 Table 16: Module Power Supply Ratings (Unit: V) ...................................................................................... 25 Table 17: Power Consumption .....................................................................................................................26 Table 18: Tx power and Rx Sensitivity ........................................................................................................ 26 Table 19: 1.8 V I/O Characteristics (Unit: V) ............................................................................................... 27 Table 20: Electrostatic Discharge Characteristics (Temperature: 2530 C, Humidity: 40 5 %) ............. 27 Table 21: Operating and Storage Temperatures (Unit: C) .........................................................................28 Table 22: Recommended Thermal Profile Parameters ...............................................................................35 Table 23: Carrier Tape Dimension Table (Unit: mm) ................................................................................... 36 Table 24: Plastic Reel Dimension Table (Unit: mm) ....................................................................................37 Table 25: Related Documents ..................................................................................................................... 39 Table 26: Terms and Abbreviations ............................................................................................................. 39 AH20C_Hardware_Design 7 / 41 Automotive Bluetooth Module Series Figure Index Figure 1: Functional Diagram .......................................................................................................................11 Figure 2: Pin Assignment (Top View) .......................................................................................................... 12 Figure 3: Reference Circuit of Power Supply ..............................................................................................15 Figure 4: Power-up and Power-down Timing ..............................................................................................16 Figure 5: Bluetooth Application Interface Connection .................................................................................17 Figure 6: PCM Interface Connection ........................................................................................................... 18 Figure 7: UART Interface Connection ......................................................................................................... 19 Figure 8: Reference Circuit for RF Antenna Interface .................................................................................21 Figure 9: Microstrip Design on a 2-layer PCB .............................................................................................21 Figure 10: Coplanar Waveguide Design on a 2-layer PCB ........................................................................ 21 Figure 11: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .....................22 Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 22 Figure 13: Dimensions of the Receptacle (Unit: mm) ................................................................................. 23 Figure 14: Specifications of Mated Plugs ....................................................................................................24 Figure 15: Space Factor of Mated Connectors (Unit: mm) .........................................................................24 Figure 16: Top and Side Dimensions .......................................................................................................... 29 Figure 17: Bottom Dimension (Bottom View) .............................................................................................. 30 Figure 18: Recommended Footprint (Top View) ......................................................................................... 31 Figure 19: Top and Bottom Views of the Module ........................................................................................ 32 Figure 20: Recommended Reflow Soldering Thermal Profile .................................................................... 34 Figure 21: Carrier Tape Dimensions Drawing ............................................................................................. 36 Figure 22: Plastic Reel Dimension Drawing ................................................................................................37 Figure 23: Mounting Direction ..................................................................................................................... 37 Figure 24: Packaging Process .....................................................................................................................38 AH20C_Hardware_Design 8 / 41 Automotive Bluetooth Module Series 1 Introduction This document defines the AH20C and describes its air interface and hardware interfaces which are connected to your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module. It is designed to be used in conjunction with Quectel Automotive modules (like AG52xR series, AG55xQ series, etc.) or other application processors (like IMX6, IMX8, etc.) to provide you with Automotive + Bluetooth applications. Table 1: Module Information Module AH20C Bluetooth Bluetooth Low Energy (BLE 5.2) AH20C_Hardware_Design 9 / 41 Automotive Bluetooth Module Series 2 Product Overview 2.1. General Description AH20C is a cost-effective Bluetooth 5.2 module with low power consumption. It provides a UART and a PCM interface for Bluetooth function. It is an SMD type module which can be embedded in applications through its 24 LGA pins. The size is only 13 mm 13 2.45 mm. 2.2. Key Features Table 2: Key Features Parameter Description Power Supply Bluetooth Protocol Bluetooth Operation Modes VDD_BT_3V3:

Supply voltage range: 3.143.46 V Typical supply voltage: 3.3 V VDD_PADS:

Supply voltage range: 1.71.9 V Typical supply voltage: 1.8 V GATT SPP Classic Bluetooth (BR + EDR) Bluetooth Low Energy (BLE) Bluetooth Modulations GFSK, 8-DPSK, /4-DQPSK Bluetooth Application Interfaces Antenna Interface Physical Characteristics UART PCM ANT_BT 50 impedance Size: (13 0.2) mm (13.0 0.2) mm (2.45 0.2) mm Package: LGA Weight: approx. 0.71 g AH20C_Hardware_Design 10 / 41 Automotive Bluetooth Module Series Temperature Ranges Operating temperature range: -40 C to +85 C 1 Storage temperature range: -40 C to +95 C RoHS All hardware components are fully compliant with EU RoHS directive 2.3. Functional Diagram The following figure shows a block diagram of the module and illustrates the major functional parts. Power management Bluetooth application interface RF antenna interface Other interfaces Figure 1: Functional Diagram 2.4. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (V2X&5G EVB) with accessories to control or test the module. For more details, see document [1]. 1 Within the operating temperature range, the modules related performance meets Bluetooth specification. AH20C_Hardware_Design 11 / 41 Automotive Bluetooth Module Series 3 Application Interfaces 3.1. Pin Assignment Figure 2: Pin Assignment (Top View) NOTE 1. Keep all unused pins unconnected. 2. All GND pins should be connected to ground. AH20C_Hardware_Design 12 / 41 Automotive Bluetooth Module Series 3.2. Pin Description Table 3: I/O Parameters Definition Type AIO DI DO PI Description Analog Input Output Digital Input Digital Output Power Input Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment Power supply for the module Vmin = 3.14 V Vnom = 3.3 V Vmax = 3.46 V Power supply for the modules I/O pins Vmin = 1.7 V Vnom = 1.8 V Vmax = 1.9 V It should be provided with sufficient current up to 100 mA. 1.8 power domain. It should be provided with sufficient current up to 80 mA. VDD_BT_3V3 5, 6 PI VDD_PADS 2, 3 PI GND Reset 1, 4, 11, 23 Pin Name Pin No. I/O Description DC Characteristics Comment RESET 21 DI Resets the module 1.8 V power domain Internally pulled up to 1.8 V. Active low. Bluetooth Application Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment BT_WAKE_HOST 13 DO HOST_WAKE_BT 14 DI Bluetooth wakes up the host Host wakes up Bluetooth 1.8 V power domain If unused, keep them open. AH20C_Hardware_Design 13 / 41 Automotive Bluetooth Module Series PCM_IN PCM_SYNC PCM_CLK PCM_OUT BT_RTS BT_CTS BT_TXD BT_RXD I2C_SCL I2C_SDA BT_CLK_REQ 19 17 20 18 7 8 9 10 16 15 12 RF Antenna Interface DI DI DI PCM data input PCM data frame sync PCM clock DO PCM data output DO DI DO DI DI DI DO DCE request to send signal to DTE DCE clear to send signal from DTE Bluetooth UART transmit Bluetooth UART receive I2C serial clock I2C serial data Shared-clock application Pin Name Pin No. I/O Description DC Characteristics Comment ANT_BT 24 AIO Bluetooth antenna interface 50 impedance. Other Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment JTAG_SEL 22 DI ARM JTAG debugging mode control 1.8 V power domain If unused, connect it to ground. AH20C_Hardware_Design 14 / 41 Automotive Bluetooth Module Series 3.3. Power Supply Table 5: Definition of Power Supply and GND Pins Pin Name Pin No. I/O Description Min. Typ. Max. Unit VDD_BT_3V3 5, 6 VDD_PADS 2, 3 PI PI GND 1, 4, 11, 23 Power supply for the module 3.14 3.3 3.46 Power supply for the modules I/O pins 1.71 1.8 1.9 V V 3.3.1. Reference Design for Power Supply The module is powered by VDD_BT_3V3, and it is recommended to use a power supply chip which is able to output a current of at least 100 mA. The following figure shows a reference design for VDD_BT_3V3 which is controlled by EN_CTRL:

Figure 3: Reference Circuit of Power Supply The power-up and power-down timing is illustrated in the following figure:

AH20C_Hardware_Design 15 / 41 Automotive Bluetooth Module Series Figure 4: Power-up and Power-down Timing 3.3.2. Reset RESET is used to reset the module. Table 6: Pin Definition of RESET Pin Name Pin No. I/O Description Comment RESET 21 DI Resets the module 1.8 V power domain. Internally pulled up to 1.8 V. Active low. AH20C_Hardware_Design 16 / 41 Automotive Bluetooth Module Series 3.4. Bluetooth Application Interfaces The module provides a UART and a PCM interface for Bluetooth functions. The following figure shows the Bluetooth application interface connection between the module and the host:

HOST Figure 5: Bluetooth Application Interface Connection 3.4.1. BT_WAKE_HOST and HOST_WAKE_BT Table 7: Pin Definition of BT_WAKEUP_HOST and HOST_WAKEUP_BT Pin Name Pin No. I/O Description Comment HOST_WAKE_BT BT_WAKE_HOST 14 13 DI Host wakes up Bluetooth DO Bluetooth wakes up the host 1.8 V power domain. If unused, keep them open. 3.4.2. PCM Interface The module provides a PCM interface for Bluetooth audio functions. The following table shows the pin definition of PCM interface. Table 8: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_IN PCM_SYNC 19 17 DI DI PCM data input PCM data frame sync 1.8 V power domain. If unused, keep them open. AH20C_Hardware_Design 17 / 41 Automotive Bluetooth Module Series PCM_CLK PCM_OUT 20 18 DI DO PCM clock PCM data output The following figure shows the PCM interface connection between the module and the host:

Figure 6: PCM Interface Connection 3.4.3. UART Interface The module serves as DCE (Data Communication Equipment), which is connected in the traditional DCE-DTE (Data Terminal Equipment) mode. The following table shows the pin definition of UART interface:

Table 9: Pin Definition of UART Interface Pin Name Pin No. I/O Description Comment BT_RTS BT_CTS BT_TXD 7 8 9 DO DCE request to send signal to DTE DI DCE clear to send signal from DTE DO Bluetooth UART transmit 1.8 V power domain. If unused, keep them open. BT_RXD 10 DI Bluetooth UART receive The following figure shows the UART interface connection between the module and the host:

AH20C_Hardware_Design 18 / 41 Automotive Bluetooth Module Series Figure 7: UART Interface Connection 3.5. Other Interfaces 3.5.1. JTAG_SEL JTAG_SEL can be used to control ARM JTAG debugging mode. Table 10: Pin Definition of JTAG_SEL Pin Name Pin No. I/O Description Comment JTAG_SEL 22 DI ARM JTAG debugging mode control 1.8 V power domain. If unused, connect it to ground. 3.5.2. BT_CLK_REQ BT_CLK_REQ is used for shared-clock application with the host. Table 11: Pin Definition of BT_CLK_REQ Pin Name Pin No. I/O Description Comment BT_CLK_REQ 12 DO Shared-clock application 1.8 V power domain, If unused, keep it open. 3.5.3. I2C Interface The I2C interface of the module cannot be used as general I2C port. It is connected with external I2C EEPROM for data exchange. AH20C_Hardware_Design 19 / 41 Automotive Bluetooth Module Series The following table shows the pin definition of I2C interface:

Pin Name Pin No. I/O Description Comment I2C_SCL I2C_SDA 16 15 DI DI I2C serial clock I2C serial data 1.8 V power domain. If unused, keep them open. 3.6. RF Antenna Interface ANT_BT is the RF antenna pin, and the RF port requires 50 characteristic impedance. 3.6.1. Pin Definition of RF Antenna Interface The following table shows the pin definition of RF antenna interface:

Table 12: Pin Definition of RF Antenna Interface Pin Name Pin No. I/O Description Comment ANT_BT 24 AIO Bluetooth antenna interface 50 impedance 3.6.2. Operating Frequency Table 13: Operating Frequency Feature Bluetooth Frequency 2.4002.4835 Unit GHz 3.6.3. Reference Design of RF Antenna Interface The module comes with ground pins which are next to the antenna pin for better grounding. It is recommended to reserve a -type and two notch filter circuits for better RF performance. C2, L1 and L3, C3 form two notch filter circuits for filtering out interference caused by specific frequencies. When L3, C2, L1 and C3 are not mounted, C1, R1 and C4 form a -type matching circuit. Capacitors (C1, C2, C3, and C4) and inductors (L1 and L3) are not mounted by default, and R1 is only mounted with 0 resistor. AH20C_Hardware_Design 20 / 41 Automotive Bluetooth Module Series Figure 8: Reference Circuit for RF Antenna Interface 3.6.4. RF Routing Guidelines the characteristic impedance of all RF traces should be controlled to 50 . The For users PCB, impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 9: Microstrip Design on a 2-layer PCB Figure 10: Coplanar Waveguide Design on a 2-layer PCB AH20C_Hardware_Design 21 / 41 Automotive Bluetooth Module Series Figure 11: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [2]. AH20C_Hardware_Design 22 / 41 Automotive Bluetooth Module Series 3.6.5. Antenna Design Requirements Table 14: Antenna Design Requirements Parameter Requirement Frequency Range (GHz) 2.4002.4835 (Cable insertion loss <1 dB) VSWR Gain (dBi) Max Input Power (W) Input Impedance () 2 1 (Typ.) 50 50 Polarization Type Vertical 3.6.6. RF Connector Recommendation If you use an RF connector for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Figure 13: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. AH20C_Hardware_Design 23 / 41 Automotive Bluetooth Module Series Figure 14: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. Figure 15: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. AH20C_Hardware_Design 24 / 41 Automotive Bluetooth Module Series 4 Electrical Characteristics & Reliability 4.1. Absolute Maximum Ratings Table 15: Absolute Maximum Ratings (Unit: V) Parameter VDD_BT_3V3 VDD_PADS Digital I/O Input Voltage Min.

-0.5

-0.5

-0.5 Max. 3.7 2.2 VDD_PADS + 0.2 4.2. Power Supply Ratings Table 16: Module Power Supply Ratings (Unit: V) Parameter VDD_BT_3V3 VDD_PADS Min. 3.14 1.7 Typ. 3.3 1.8 Max. 3.46 1.9 4.3. Power Consumption AH20C_Hardware_Design 25 / 41 Automotive Bluetooth Module Series Table 17: Power Consumption Mode Channel Tx power IVDD_BT_3V3 IVDD_PADS BR EDR BLE CH0 CH39 CH78 CH0 CH39 CH78 CH0 CH19 CH39 7.27 dBm 11.51 mA 27.13 mA 7.79 dBm 12.13 mA 27.28 mA 7.37 dBm 11.68 mA 27.35 mA 6.56 dBm 10.49 mA 27.41 mA 7.57 dBm 11.27 mA 27.45 mA 7.13 dBm 10.72 mA 27.51 mA 8.13 dBm 17.37 mA 23.79 mA 9.39 dBm 19.63 mA 23.97 mA 8.76 dBm 17.07 mA 24.97 mA 4.4. RF Performances The following tables summarize the transmitting and receiving performances of the module:

Table 18: Tx power and Rx Sensitivity Mode Channel Tx Power Rx Sensitivity BR EDR BLE CH0 CH39 CH78 CH0 CH39 CH78 CH0 CH19 7.66 dBm 8.10 dBm 7.48 dBm 6.85 dBm 7.95 dBm 7.56 dBm 8.56 dBm 9.87 dBm

-90.0 dBm

-90.5 dBm

-91.0 dBm

-93.0 dBm

-93.5 dBm

-92.0 dBm

-92.0 dBm

-93.5 dBm AH20C_Hardware_Design 26 / 41 Automotive Bluetooth Module Series CH39 9.34 dBm

-93.0 dBm 4.5. Digital I/O Characteristics Table 19: 1.8 V I/O Characteristics (Unit: V) Parameter Description VIH VIL VOH VOL High-level Input Voltage Low-level Input Voltage High-level Output Voltage Low-level Output Voltage Min. 1.1

1.4

4.6. ESD Protection Max.

0.6

0.4 Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 20: Electrostatic Discharge Characteristics (Temperature: 2530 C, Humidity: 40 5 %) Tested Interfaces Contact Discharge Air Discharge Unit VDD_BT_3V3 VDD_PADS ANT_BT GND 8 8 8 8 12 12 12 12 kV kV kV kV AH20C_Hardware_Design 27 / 41 Automotive Bluetooth Module Series 4.7. Operating and Storage Temperatures Table 21: Operating and Storage Temperatures (Unit: C) Parameter Operating temperature range 2 Storage temperature range Min.

-40

-40 Typ.

Max.

+85

+95 2 Within the operating temperature range, the modules related performance meets Bluetooth specification. AH20C_Hardware_Design 28 / 41 Automotive Bluetooth Module Series 5 Mechanical Information This chapter describes the mechanical dimensions of AH20C. All dimensions are measured in millimeter

(mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 5.1. Mechanical Dimensions Figure 16: Top and Side Dimensions AH20C_Hardware_Design 29 / 41 Automotive Bluetooth Module Series Figure 17: Bottom Dimension (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. AH20C_Hardware_Design 30 / 41 5.2. Recommended Footprint Automotive Bluetooth Module Series Figure 18: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. AH20C_Hardware_Design 31 / 41 5.3. Top and Bottom Views Automotive Bluetooth Module Series Figure 19: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, refer to the module received from Quectel. AH20C_Hardware_Design 32 / 41 Automotive Bluetooth Module Series 6 Storage, Manufacturing & Packaging 6.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 3 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet 3 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. AH20C_Hardware_Design 33 / 41 Automotive Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 6.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [3]. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 20: Recommended Reflow Soldering Thermal Profile AH20C_Hardware_Design 34 / 41 Automotive Bluetooth Module Series Table 22: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 4. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3]. AH20C_Hardware_Design 35 / 41 Automotive Bluetooth Module Series 6.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

6.3.1. Carrier Tape Dimension details are as follow:

Figure 21: Carrier Tape Dimensions Drawing Table 23: Carrier Tape Dimension Table (Unit: mm) W 24 P 20 T 0.4 A0 B0 K0 13.4 13.4 2.95 K1 5.6 F E 11.5 1.75 AH20C_Hardware_Design 36 / 41 6.3.2. Plastic Reel Automotive Bluetooth Module Series Figure 22: Plastic Reel Dimension Drawing Table 24: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 24.5 6.3.3. Mounting Direction Figure 23: Mounting Direction AH20C_Hardware_Design 37 / 41 6.3.4. Packaging Process Automotive Bluetooth Module Series Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 2000 modules. Figure 24: Packaging Process AH20C_Hardware_Design 38 / 41 Automotive Bluetooth Module Series 7 Appendix References Table 25: Related Documents Document Name

[1] Quectel_V2X&5G_EVB_User_Guide

[2] Quectel_RF_Layout_Application_Note

[3] Quectel_Module_SMT_Application_Note Table 26: Terms and Abbreviations Abbreviation Description ARM BLE BT DPSK DQPSK BR EDR CTS DCE DTE Advanced RISC Machine Bluetooth Low Energy Bluetooth Differential Phase Shift Keying Differential Quadrature Phase Shift Keying Basic Rate Enhanced Data Rate Clear To Send Data Communication Equipment Data Terminal Equipment EEPROM Electrically Erasable Programmable Read-Only Memory ESD GATT Electrostatic Discharge Generic Attribute Profile AH20C_Hardware_Design 39 / 41 Automotive Bluetooth Module Series GFSK GND I/O I2C JTAG LGA PCB PCM RF RoHS RTS Rx RXD SMT SPP Tx TXD UART VIHmax VIHmin VILmax VILmin Vmax Vmin Vnom Gauss Frequency Shift Keying Ground Input/Output Inter-Integrated Circuit Joint Test Action Group Land Grid Array Printed Circuit Board Pulse Code Modulation Radio Frequency Restriction of Hazardous Substances Request to Send Receive Receive Data Surface Mount Technology Serial Port Profile Transmit Transmit Data Universal Asynchronous Receiver/Transmitter Maximum High-level Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Minimum Low-level Input Voltage Maximum Voltage Minimum Voltage Nominal Voltage AH20C_Hardware_Design 40 / 41 Automotive Bluetooth Module Series VOHmax VOHmin VOLmax VOLmin VSWR Maximum High-level Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Minimum Low-level Output Voltage Voltage Standing Wave Ratio AH20C_Hardware_Design 41 / 41 CE Statement The minimum distance between the user and/or any bystander and the radiating structure of the transmitter is 20cm. Hereby, We, Quectel Wireless Solutions Co., Ltd. declares that the radio equipment type AH20C is in compliance with the Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address:

Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China https://www.quectel.com. The device operates with the following frequency bands and transmitting power:

Band Rx (MHz) Tx (MHz) The Maximum (EIRP) Transmitted Power (dBm) 8.62 dBm Bluetooth 2402 ~ 2480 2402 ~ 2480 Bluetooth LE 2402 ~ 2480 2402 ~ 2480 7.70 dBm FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2023AH20C. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

Bluetooth LE: 0.73 dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR2023AH20C or Contains FCC ID: XMR2023AH20C must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. To comply with IC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

Bluetooth LE: 0.73 dBi The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-2023AH20C or where: 10224A-2023AH20C is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:"Contient IC: 10224A-2023AH20C " ou "o: 10224A-2023AH20C est le numro de certification du module.

QUECTEL AH20C ss at-axxx AH20CAAMD SN: MP22629D30XXXXX FCC ID:XMR2023AH20C 1C:10224A-2023AH20C BHPOCAAMD SN: D1C22KI3F000575

Quectel Wireless Solutions Co., Ltd March 8, 2023 Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: Attestation Statements Part 2.911(d)(5)(i) request for FCC IDXMR2023AH20C

[Quectel Wireless Solutions Co., Ltd] (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Sincerely, Applicant signature Applicant printed nameJean Hu Quectel Wireless Solutions Co., Ltd March 8, 2023 Eurofins Electrical and Electronic Testing NA, Inc. 914 West Patapsco Avenue Baltimore, MD 21230 RE: Attestation Statements Part 2.911(d)(5)(ii) request for FCC IDXMR2023AH20C

[Quectel Wireless Solutions Co., Ltd] (the applicant) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing covered equipment. Sincerely, Applicant signature Applicant printed nameJean Hu

Quectel Wireless Solutions Company Limited Request for Confidentiality Date:

_2023/03/08_ Subject: Confidentiality Request for: _____ FCC ID: XMR2023AH20C____ _____ IC ID: 10224A-2023AH20C____ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100 Issue 12 / 12.4, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Permanent Permanent*1 Permanent Permanent Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term ______(Insert Explanation as Necessary)______ Permanent*

Permanent

*Note:

Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement Schematics Test Setup Photos Users Manual ___Quectel Wireless Solutions Company Limited _has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of _180___ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:

(Signature/Title2) Jean Hu

(Print name)

Quectel Wireless Solutions Company Limited Declaration of the Modular Approval Applicant / Grantee FCC ID:

Model:

Quectel Wireless Solutions Co., Ltd. XMR2023AH20C AH20C The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:

EUT Condition The radio elements of the modular transmitter have their own shielding. Comply YES The modular has buffered data inputs, it is integrated in chip. Please see schematic.pdf YES All power lines derived from the host device are regulated before energizing other circuits internal to the AH20C. Please see schematic.pdf A permanently attached antenna or unique antenna connector is not a requirement for licensed modules. YES YES The AH20C was tested in a standalone configuration via a PCMCIA extender. Please see spurious setup YES Modular approval requirement

(a) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements.

(b) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to the module will comply with part 15 ensure that requirements under conditions of excessive data rates or over-modulation.

(c)The modular transmitter must have its own powersupply regulation.

(d) The modular transmitter must comply with the antenna and transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section.

(e)The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that Quectel Wireless Solutions Company Limited length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see Section 15.31(i))mustnotbeinsideanotherdeviceduringtesting.

(f)The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number.

(g) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any suchrequirements. A copy of these instructions must be included in the application for equipmentauthorizationrequirements,whicharebasedonthei ntendeduse/configurations. The label position of AH20C is clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text:

Contains FCC ID: XMR2023AH20C. Please see the label.pdf The AH20C is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. YES YES

(h)The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. The AH20C is approved to comply with the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance restriction. YES Dated By:

2023/03/08 Jean Hu Signature Printed Title: Project Manager

Quectel Wireless Solutions Co., Ltd POWER OF ATTORNEY DATE:March 8, 2023 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/Sun Yue on our behalf, to apply to FCC on our equipment for FCC ID:

XMR2023AH20C. Any and all acts carried out by TA Technology (Shanghai) Co., Ltd. / Sun Yue on our behalf shall have the same effect as acts of our own. Sincerely, Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Co., Ltd