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HCM010S Hardware Design Bluetooth Module Series Version: 1.0.0 Date: 2023-09-05 Status: Preliminary Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:
http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. HCM010S_Hardware_Design 1 / 50 Bluetooth Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties
(third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. HCM010S_Hardware_Design 2 / 50 Bluetooth Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any terminal or mobile incorporating the module. Manufacturers of the terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. HCM010S_Hardware_Design 3 / 50 Bluetooth Module Series About the Document Revision History Version Date Author Description
2023-09-18 Luke Fu Creation of the document 1.0.0 2023-09-18 Luke Fu Preliminary HCM010S_Hardware_Design 4 / 50 Bluetooth Module Series Contents Safety Information ...................................................................................................................................... 3 About the Document .................................................................................................................................. 4 Contents ...................................................................................................................................................... 5 Table Index .................................................................................................................................................. 7 Figure Index ................................................................................................................................................ 8 1 Introduction ............................................................................................................................................. 9 1.1. Special Marks................................................................................................................................. 9 2 Product Overview ................................................................................................................................. 11 2.1. Key Features ................................................................................................................................ 12 3 Application Interfaces .......................................................................................................................... 13 3.1. Pin Assignment ............................................................................................................................ 13 3.2. Pin Description ............................................................................................................................. 14 3.3. GPIO Multiplexing ........................................................................................................................ 16 3.4. Application Interfaces ................................................................................................................... 20 3.4.1. USARTs ............................................................................................................................. 20 3.4.2. SWD Interface ................................................................................................................... 23 3.4.3. I2C Interfaces .................................................................................................................... 24 3.4.4. ACMP Interface ................................................................................................................. 25 3.4.5. IADC Interfaces ................................................................................................................. 25 3.4.6. GPIO Interfaces ................................................................................................................. 26 4 Operating Characteristics .................................................................................................................... 27 4.1. Power Supply ............................................................................................................................... 27 4.1.1. Reference Design for Power Supply ................................................................................. 27 4.2. Turn On ........................................................................................................................................ 28 4.3. Reset ............................................................................................................................................ 28 5 RF Performances .................................................................................................................................. 30 5.1. Bluetooth Performances .............................................................................................................. 30 5.2. Antenna Interface ......................................................................................................................... 30 6 Electrical Characteristics & Reliability ............................................................................................... 33 6.1. Absolute Maximum Ratings ......................................................................................................... 33 6.2. Power Supply Ratings .................................................................................................................. 33 6.3. Digital I/O Characteristics ............................................................................................................ 34 6.4. ESD Protection ............................................................................................................................ 34 7 Mechanical Information ....................................................................................................................... 35 7.1. Mechanical Dimensions ............................................................................................................... 35 7.2. Recommended Footprint ............................................................................................................. 37 HCM010S_Hardware_Design 5 / 50 Bluetooth Module Series 7.3. Top and Bottom Views ................................................................................................................. 38 8 Storage and Packaging ........................................................................................................................ 39 8.1. Storage Conditions ...................................................................................................................... 39 8.2. Manufacturing and Soldering ....................................................................................................... 40 8.3. Packaging Specifications ............................................................................................................. 42 8.3.1. Carrier Tape ....................................................................................................................... 42 8.3.2. Plastic Reel ........................................................................................................................ 43 8.3.3. Mounting Direction ............................................................................................................. 43 8.3.4. Packaging Process ............................................................................................................ 44 9 Appendix References ........................................................................................................................... 45 HCM010S_Hardware_Design 6 / 50 Bluetooth Module Series Table Index Table 1 : Special Marks .............................................................................................................................. 10 Table 2 : Basic Information ........................................................................................................................ 11 Table 3 : Key Features ............................................................................................................................... 12 Table 4 : Parameter Description ................................................................................................................ 14 Table 5 : Pin Description ............................................................................................................................ 14 Table 6 : GPIO Multiplexing (Digital Pins) .................................................................................................. 16 Table 7 : GPIO Multiplexing (Analog Pins) ................................................................................................ 19 Table 8 : USART Synchronous/Asynchronous Mode ................................................................................ 21 Table 9 : Pin Definition of SWD Interface .................................................................................................. 23 Table 10 : Pin Definition of JTAG Interface................................................................................................ 24 Table 11 : Pin Definition of Power Supply and GND Pins ......................................................................... 27 Table 12 : Pin Definition of RESET_N ....................................................................................................... 28 Table 13 : Bluetooth Performances ........................................................................................................... 30 Table 14 : PCB Antenna Specifications ..................................................................................................... 30 Table 15 : Absolute Maximum Ratings (Unit: V) ........................................................................................ 33 Table 16 : Module Power Supply Ratings (Unit: V) ................................................................................... 33 Table 17 : VBAT I/O Characteristics (Unit: V) ............................................................................................ 34 Table 18 : ESD Characteristics (Unit: kV) .................................................................................................. 34 Table 19 : Recommended Thermal Profile Parameters ............................................................................ 41 Table 20 : Carrier Tape Dimension Table (Unit: mm) ................................................................................ 42 Table 21 : Plastic Reel Dimension Table (Unit: mm) ................................................................................. 43 Table 22 : Reference Documents .............................................................................................................. 45 Table 23 : Terms and Abbreviations .......................................................................................................... 45 HCM010S_Hardware_Design 7 / 50 Bluetooth Module Series Figure Index Figure 2 : Pin Assignment (Top View) ....................................................................................................... 13 Figure 3 : UART Connection ...................................................................................................................... 21 Figure 4 : Debug UART Reference Circuit................................................................................................. 22 Figure 5 : SPI Connection .......................................................................................................................... 22 Figure 6 : I2S Connection .......................................................................................................................... 22 Figure 7 : RS485 Connection ..................................................................................................................... 23 Figure 8 : SWD Interface Connection ........................................................................................................ 23 Figure 9 : JTAG Interface Connection ....................................................................................................... 24 Figure 10 : VBAT Reference Circuit ........................................................................................................... 27 Figure 11 : Turn-on Timing ......................................................................................................................... 28 Figure 12 : Reference Circuit of RESET with a Button .............................................................................. 29 Figure 13 : Reset Timing ............................................................................................................................ 29 Figure 14 : Keep-out Area on Motherboard ............................................................................................... 31 Figure 15 : Prohibited Area for Routing ..................................................................................................... 32 Figure 16 : Top and Side Dimensions ........................................................................................................ 35 Figure 17 : Bottom Dimensions (Bottom View) .......................................................................................... 36 Figure 18 : Recommended Footprint ......................................................................................................... 37 Figure 19 : Top and Bottom Views ............................................................................................................. 38 Figure 20 : Recommended Reflow Soldering Thermal Profile .................................................................. 40 Figure 21 : Tape Specifications .................................................................................................................. 42 Figure 22 : Plastic Reel Dimension Drawing ............................................................................................. 43 Figure 23 : Mounting Direction ................................................................................................................... 43 Figure 24 : Packaging Process .................................................................................................................. 44 HCM010S_Hardware_Design 8 / 50 Bluetooth Module Series 1 Introduction QuecOpen is a solution where the module acts as the main processor. Constant transition and evolution of both the communication technology and the market highlight its merits. It can help you to:
Realize embedded applications quick development and shorten product R&D cycle Simplify circuit and hardware structure design to reduce engineering costs Miniaturize products Reduce product power consumption Apply OTA technology Enhance product competitiveness and price-performance ratio This document defines HCM010S in QuecOpen solution and describes its hardware interfaces and air interfaces, which are connected with your applications. The document provides a quick insight into interface specifications, RF performance, electrical and mechanical specifications, as well as other related information of the module. Hereby, Quectel Wireless Solutions Co., Ltd. declares that the radio equipment type HCM010S is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address:
http://www.quectel.com/support/technical.htm The device could be used with a separation distance of 20cm to the human body. 1.1. Special Marks HCM010S_Hardware_Design 9 / 50 Bluetooth Module Series Table 1: Special Marks Mark Definition
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, argument, and so on, it indicates that the function, feature, interface, pin, AT command, argument, and so on, is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of the model is currently unavailable. Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA[0:3] refers four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. to all HCM010S_Hardware_Design 10 / 50 Bluetooth Module Series 2 Product Overview HCM010S is a low-power and high performance MCU Bluetooth module, it supports BLE 5.4 protocol and Bluetooth Mesh. The module, featuring built-in 2.4 GHz Balun, integrates tunable crystal loading capacitors and PA with maximum transmitting power up to 20 dBm. It supports multiple interfaces such as USART, SWD, JTAG, I2C, ACMP, IADC and for various applications. It is an SMD module with compact packaging. The general features of the module are as follows:
Embedded 32-bit ARM Corte-M33 processor with a frequency of up to 80 MHz 64 KB RAM memory and 768 KB Flash Flexible and efficient power management Supporting Peripheral Reflex System (PRS) for autonomous inter-peripheral signaling Supporting OTA (Over-The-Air Upgrade) Supporting secondary development Table 2: Basic Information HCM010S Packaging type Pin counts Dimensions Weight LCC 25
(20 0.2) mm (15.6 0.2) mm (2.35 0.2) mm Approx. 1.14 g HCM010S_Hardware_Design 11 / 50 Bluetooth Module Series 2.1. Key Features Table 3: Key Features Basic Information Protocols and Standards Bluetooth protocol: BLE 5.4 All hardware components are fully compliant with EU RoHS directive Power Supply Temperature Ranges VBAT Power Supply:
1.713.8 V Typ.: 3.3 V Operating temperature 1: -40 to +105 C Storage temperature: -45 to +115 C EVB Kit HCM010S-TE-B 2 Antenna/Antenna Interface Antenna/Antenna Interfaces PCB antenna 50 characteristic impedance Application Interface 3 Application Interfaces USART, SWD, JTAG, I2C, ACMP, IADC 1 Within the operating temperature range, the modules related performance meets Bluetooth specifications. 2 For more details about the EVB, see document [1]. 3 For more details about the interfaces, see Chapter 0 and Chapter 3.4. HCM010S_Hardware_Design 12 / 50 Bluetooth Module Series 3 Application Interfaces 3.1. Pin Assignment Figure 1: Pin Assignment (Top View) NOTE 1. Keep all unused pins unconnected. 2. All GND pins should be connected to ground. 3. The module provides 16 GPIO interfaces by default. In the case of multiplexing it supports interfaces including USART, SWD, JTAG, I2C, ACMP, IADC. For more details, see Chapter 3.3 HCM010S_Hardware_Design 13 / 50 12345678910111213141516171819202122232425GNDGPIOCTLPowerSWDUSARTHCM010SGNDUSART_TXDUSART_RXDSWDIOSWCLKGPIO4GPIO5GPIO1GPIO6GPIO7GPIO8GPIO9GNDRESET_NGPIO12VBATGNDGPIO13GPIO14GPIO15GPIO11GPIO10GPIO16GPIO2GPIO3 Bluetooth Module Series and Chapter 3.4. 3.2. Pin Description Table 4: Parameter Description Parameter Description DI DO DIO PI Digital Input Digital Output Digital Input/Output Power Input DC characteristics include power domain and rated current. Table 5: Pin Description Power Supply Pin Name Pin No. I/O Description VBAT 16 PI Power supply for the module DC Characteristics Vmax = 3.8 V Vmin = 1.71 V Vnom = 3.3 V Comment It must be provided with sufficient current of more than 0.3 A. GND 1, 13, 17 Reset Pin Name Pin No. I/O Description DC Characteristics Comment RESET_N 14 DI Reset the module VBAT Hardware reset. Internally pulled up to VBAT. Active low. USART Pin Name Pin No. I/O Description DC Characteristics Comment HCM010S_Hardware_Design 14 / 50 Bluetooth Module Series DO USART transmit DI USART receive VBAT Used for debugging. USART_TX D USART_RX D 2 3 SWD Interface Pin Name Pin No. I/O Description SWDIO SWCLK 4 5 GPIO Interfaces DIO Serial data input/
output DI Serial clock input DC Characteristics Comment VBAT Used for program downloading. Pin Name Pin No. I/O Description DC Characteristics Comment GPIO4 GPIO5 GPIO1 GPIO6 GPIO7 GPIO8 GPIO9 6 7 8 9 10 11 12 DIO DIO DIO DIO DIO DIO DIO GPIO12 15 DIO GPIO13 18 DIO GPIO14 19 DIO GPIO15 20 DIO GPIO10 21 DIO GPIO11 22 DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output VBAT The GPIO subsystem supports asynchronous external pin interrupts. HCM010S_Hardware_Design 15 / 50 Bluetooth Module Series GPIO16 23 DIO GPIO2 GPIO3 24 25 DIO DIO General-purpose input/output General-purpose input/output General-purpose input/output 3.3. GPIO Multiplexing The module provides 16 GPIO interfaces by default, and can support up to 20 GPIO interfaces in the case of multiplexing. Pins are defined as follows:
Table 6: GPIO Multiplexing (Digital Pins) Multiplexing Function GPIO Interface USART_TXD, USART_RXD, SWDIO, SWCLK, GPIO1~3 GPIO45 GPIO611 GPIO1216 ACMP0_DIGOUT ACMP1_DIGOUT CMU_CLKIN0 CMU_CLKOUT0 CMU_CLKOUT1
CMU_CLKOUT2 FRC_DCLK FRC_DFRAME FRC_DOUT I2C0_SCL I2C0_SDA I2C1_SCL I2C1_SDA
LETIMER0_OUT0
HCM010S_Hardware_Design 16 / 50 Bluetooth Module Series LETIMER0_OUT1 MODEM_ANT0 MODEM_ANT1 MODEM_DCLK MODEM_DIN MODEM_DOUT PRS_ASYNCH0 PRS_ASYNCH1 PRS_ASYNCH10 PRS_ASYNCH11 PRS_ASYNCH2 PRS_ASYNCH3 PRS_ASYNCH4 PRS_ASYNCH5 PRS_ASYNCH6 PRS_ASYNCH7 PRS_ASYNCH8 PRS_ASYNCH9 PRS_SYNCH0 PRS_SYNCH1 PRS_SYNCH2 PRS_SYNCH3 TIMER0_CC0 TIMER0_CC1 TIMER0_CC2 TIMER0_CDTI0
HCM010S_Hardware_Design 17 / 50 Bluetooth Module Series TIMER0_CDTI1 TIMER0_CDTI2 TIMER1_CC0 TIMER1_CC1 TIMER1_CC2 TIMER1_CDTI0 TIMER1_CDTI1 TIMER1_CDTI2 TIMER2_CC0 TIMER2_CC1 TIMER2_CC2 TIMER2_CDTI0 TIMER2_CDTI1 TIMER2_CDTI2 TIMER3_CC0 TIMER3_CC1 TIMER3_CC2 TIMER3_CDTI0 TIMER3_CDTI1 TIMER3_CDTI2 USART0_CLK USART0_CS USART0_CTS USART0_RTS USART0_RXD USART0_TXD
HCM010S_Hardware_Design 18 / 50 Bluetooth Module Series USART1_CLK USART1_CS USART1_CTS USART1_RTS USART1_RXD USART1_TXD USART2_CLK USART2_CS USART2_CTS USART2_RTS USART2_RXD USART2_TXD
Table 7: GPIO Multiplexing (Analog Pins) Interface Signal USART_TXD, USART_RXD, SWDIO, SWCLK, GPIO13 GPIO45 GPIO611 GPIO1216 EVEN ODD EVEN ODD EVEN ODD EVEN ODD ana_neg ana_pos ana_neg ana_pos ana_neg ana_pos ACMP0 ACMP1 IADC0 Notes:
HCM010S_Hardware_Design 19 / 50 Bluetooth Module Series 1. USART_TXDUSART_RXDSWDIOSWCLKGPIO1~5 pins are EM2 capable 2. These pins may be used by Low-Energy peripherals in EM2/3 and may also be used as EM2/3 pin wake-ups. 3. GPIO6-GPIO16 pins are latched/retained in their current state when entering EM2 until EM2 exit upon which internal peripherals could once again drive those pads. 4. GPIO8 GPIO11 GPIO4 USART_TXD and GPIO15 pins also have EM4 wake functionality 3.4. Application Interfaces 3.4.1. USARTs The Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O module. It supports full duplex asynchronous UART communication with hardware flow control as well as RS-485, SPI, MicroWire and 3-wire. It can also interface with devices supporting:
Smart-Cards (ISO7816) IrDA I2S HCM010S_Hardware_Design 20 / 50 USARTCLKCSRAMDMAControllerRX/MISOTX/MOSIIrDASmartCardsUSARTSPI Bluetooth Module Series The USART operates in either asynchronous or synchronous mode:
In synchronous mode, a separate clock signal generated by the bus master is transmitted with the data. Both the master and slave transmit data according to this clock. The synchronous communication mode is compatible with the SPI Bus standard. In asynchronous mode, no separate clock signal is transmitted with the data on the bus. The USART receiver thus has to determine where to sample the data on the bus from the actual data. To make it possible, additional synchronization bits are added to the data when operating in asynchronous mode. Asynchronous or synchronous mode can be selected by configuring SYNC in register (USARTn_CTRL). The options are listed with supported protocols are listed below:
Table 8: USART Synchronous/Asynchronous Mode SYNC Communication Mode Protocol 0 1 Asynchronous RS-232, RS-485 (w/external driver), IrDA, ISO 7816 Synchronous SPI, MicroWire, 3-wire USART can be used as UART for AT command communication, data transmission. In such case, it supports self-configurable baud rate with default baud rate of 115200 bps. The USART connection between the module and MCU is illustrated below (The dotted lines are optional as required). Figure 2: UART Connection The USART can be used as debug UART for outputting partial logs with debugging tools and supports 115200 bps baud rate by default. The following is a reference design for debug USART used as debug UART. HCM010S_Hardware_Design 21 / 50 UART_RXDUSARTn_RXDUSARTn_TXDModuleGNDGNDMCU UART_TXDUSARTn_RTSUSARTn_CTSUART_RTSUART_CTS Bluetooth Module Series Figure 3: Debug UART Reference Circuit The following figure shows the USART connection between the module and the host when used as SPI. Figure 4: SPI Connection The following figure shows the USART connection between the module and the host when used as I2S. Figure 5: I2S Connection The following figure shows the USART connection between the module and the host when used as RS485. HCM010S_Hardware_Design 22 / 50 ModuleESDUSARTn_TXDTest PointsUSARTn_TXDModuleUSARTn_RXDUSARTn_CLKUSARTn_CSSPI_MOSISPI_MISOSPI_CLKSPI_CSHostGNDGNDUSARTn_TXDModuleUSARTn_RXDUSARTn_CLKUSARTn_CSI2S_INI2S_OUTI2S_CLKI2S_WSHostGNDGND Bluetooth Module Series Figure 6: RS485 Connection 3.4.2. SWD Interface The module supports 1 SWD interface which can be multiplexed as JTAG interface. It is recommended to select the debugging interface for firmware upgrade and debugging based on the actual hardware design. The pin definitions of SWD interface are shown in the table below. Table 9: Pin Definition of SWD Interface Pin Name Pin No. I/O Description Comment SWDIO SWCLK 4 5 DIO Serial data input/output DI Serial clock input Enabled after power-up and has a built-in pull-up. Enabled after power-up and has a built-in pull-down. The SWD interface supports online program writing and the common connection of SWD interface is shown below. Figure 7: SWD Interface Connection In the case of multiplexing, the module supports JTAG interface. The JTAG function can only be enabled after power-down resetting to return debugging configuration when necessary. The pin definitions of JTAG interface are shown in the table below. HCM010S_Hardware_Design 23 / 50 Module485 ChipUSARTn_RXDUSARTn_TXDGNDTXDRXDGNDModuleJTAGVBATSWDIOSWCLKGND3V3SWDIOSWCLKGND Bluetooth Module Series Table 10: Pin Definition of JTAG Interface Pin Name Pin No. Multiplexing Function I/O Description Comment SWDIO SWCLK 4 5 JTAG_TMS DIO JTAG test mode select JTAG_TCK DI JTAG test clock GPIO2 24 JTAG_TDO DO JTAG test data output GPIO3 25 JTAG_TDI DI JTAG test data input Enabled after power-up and has a built-in pull-up. Enabled after power-up and has a built-in pull-down remains in high-Z state until the first valid JTAG command is received. remains in high-Z state until the first valid JTAG command is received. Once enabled, the pin has a built-in pull-up. The JTAG interface supports debugging and program writing and the common connection of JTAG interface is shown below. Figure 8: JTAG Interface Connection Upon disabling the debug pins, the device can no longer be accessed by a debugger. A reset will set the debug pins back to their enabled default state. The register (GPIO_DBGROUTEPEN) can only be updated when to modify GPIO_DBGROUTEPEN when the debugger is connected will not occur. Keep at least 3 s before running the program to disable the debug pins. the system. Any attempts is disconnected the debugger from 3.4.3. I2C Interfaces In the case of multiplexing, the module supports up to 2 I2C interfaces capable of acting as both a HCM010S_Hardware_Design 24 / 50 ModuleJTAGJTAG_TCKJTAG_TMSJTAG_TDIJTAG_TDOJTAG_TCKJTAG_TMSJTAG_TDIJTAG_TDO Bluetooth Module Series master and a slave.and supports multi-master buses. Standard-mode(100kbps), fast-mode(400kbps) and fast-mode plus (1Mbps) speeds are supported, Slave arbitration and timeouts are also provided to allow implementation of an SMBus compliant system.The interface provided to software by the I2C module allows precise control of the transmission process and highly automated transfers. Automatic recognition of slave addresses is provided in all energy modes (except EM4). Both the bus lines are open-drain. The maximum value of the pull-up resistor can be calculated as a function of the maximal rise-time tr for the given bus speed, and the estimated bus capacitance Cb as shown:
Rp(max) = tr/(0.8473 x Cb). The maximal rise times for 100 kHz, 400 kHz and 1 MHz I2C are 1 s, 300 ns and 120 ns respectively. 3.4.4. ACMP Interface The ACMP is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is higher.Inputs are selected from among internal references and external pins. The tradeoff between response time and current consumption is configurable by software. Two 6-bit reference dividers allow for a wide range of internally-programmable reference sources. The ACMP can also be used to monitor the supply voltage. An interrupt can be generated when the supply falls below or rises above the programmable threshold. The key features of ACMP interface are as follows:
Internal 1.25 V bandgap reference voltage with programmable divider Internal 2.5 V bandgap reference voltage with programmable divider Internal and external input selections:
- External I/O ports
- VBAT reference voltage VBAT voltage supply monitoring Selectable response time Operational in EM0 to EM3 Asynchronous interrupt generation on selectable edges Configurable output state when inactive Comparator output available on PRS The ACMP interface can be multiplexed with GPIOs. See Table 7 for more details of the multiplexing functions. When a differential connection is being used, positive inputs are restricted to the EVEN pins and negative inputs are restricted to the ODD pins. When a single ended connection is being used, positive input is available on all pins. 3.4.5. IADC Interfaces The module supports IADC interfaces multiplexed with GPIOs, and ee Table 7 for more details. IADC is a hybrid architecture combining techniques from both SAR and Delta-Sigma style converters with a resolution of 12 bits when operating at one million samples per second (1 Msps). The flexible incremental architecture uses oversampling to allow applications to trade speed for higher resolution. HCM010S_Hardware_Design 25 / 50 Bluetooth Module Series The key features of ACMP interface are as follows:
Flexible oversampled architecture allows for tradeoffs between speed and resolution:
1 Msps with oversampling ratio = 2
555 ksps with oversampling ratio = 4 Internal and external conversion trigger sources
- External TIMER module (synchronous with output/PWM generation)
- General PRS hardware signal Integrated pre-scaler for conversion clock generation Immediate (software triggered) Local IADC timer Can be run during EM2 and EM3, waking up the system on interrupts as needed Selectable reference sources
1.21 V internal reference
- External precision reference Support for offset and gain calibration Programmable input gain: 0.5x, 1x, 2x, 3x, or 4x Flexible output formatting Programmable single channel conversion Autonomous multi-channel scan Multiple interrupt resources 3.4.6. GPIO Interfaces In the case of multiplexing, the module supports up to 20 GPIO interfaces which can all be individually configured as either an output or input. More advanced configurations like open-drain, open-source, and glitch filtering can be configured for each individual GPIO pin. After a reset, both input and output are disabled for all pins on the device, except for the Serial Wire Debug pins.Peripheral resources, like Timer PWM outputs or USART RX/TX can be routed to the GPIO pins as desired by the user. Finally, the input value of a pin can be routed through the Peripheral Reflex System to other peripherals or used to trigger an external interrupt. HCM010S_Hardware_Design 26 / 50 Bluetooth Module Series 4 Operating Characteristics 4.1. Power Supply Power supply pin and ground pins of the module are defined in the following table. Table 11: Pin Definition of Power Supply and GND Pins Pin Name Pin No. I/O Description Min. Typ. Max. Unit VBAT 16 PI Power supply for the module 1.71 3.3 3.8 V GND 1, 13, 17 4.1.1. Reference Design for Power Supply The module is powered by VBAT, and it is recommended to use a power supply chip that can provide more than 0.3 A output current. For better power supply performance, it is recommended to parallel a 22 F decoupling capacitor, and two filter capacitors (1 F and 100 nF) near the modules VBAT pin. C4 is reserved for debugging and not mounted by default. In addition, it is recommended to add a TVS near the VBAT to improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be. VBAT reference circuit is shown below:
Figure 9: VBAT Reference Circuit HCM010S_Hardware_Design 27 / 50 ModuleVBATVBATD1C2C3C4NMC122 F1 F100 nFR10R Bluetooth Module Series 4.2. Turn On The module can automatically start up after the VBAT is powered on. The turn-on timing is shown below:
Figure 10: Turn-on Timing 4.3. Reset Pull the RESET_N up for at least 50 ms and then release it to reset the module. Table 12: Pin Definition of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 14 DI Reset the module Hardware reset. Internally pulled up to VBAT. Active high. The reference design for resetting the module is shown below. Pull up the button directly to realize the resetting of the module. At the same time, it is recommended to place a TVS near the button for ESD protection. HCM010S_Hardware_Design 28 / 50 VBAT> 0 ms> 50 msSWD Bluetooth Module Series Figure 11: Reference Circuit of RESET with a Button The module reset timing is illustrated in the following figure. Figure 12: Reset Timing HCM010S_Hardware_Design 29 / 50 RESET_NS1Closed to S1TVSVIL 0.3 VVIH 1.71 VVBATRESET_NT 50 ms Bluetooth Module Series 5 RF Performances 5.1. Bluetooth Performances Table 13: Bluetooth Performances Operating Frequency 2.4002.4835 GHz Modulation GFSK Operating Mode BLE Condition (VBAT = 3.3 V; Temp. 25C) Transmitting Power (Typ.) Receiving Sensitivity (Typ.) BLE (1 Mbps) BLE (2 Mbps) BLE (125 Kbps) BLE (500 Kbps) 20 dBm 20 dBm 20 dBm 20 dBm
-97.5 dBm 2 dB
-94.5 dBm 2 dB
-105 dBm 2 dB
-100.5 dBm 2 dB 5.2. Antenna Interface The module is provided PCB antenna. Table 14: PCB Antenna Specifications Parameter Specification HCM010S_Hardware_Design 30 / 50 Bluetooth Module Series Frequency Range (GHz) 2.4002.500 Input Impedance () VSWR Gain (dBi) Efficiency 50 2
-1.8 (Max.) 34 %(Average) When using the PCB antenna, the module should be placed on the edge of the motherboard. The PCB antenna should be at least 16 mm away from the vias, traces, copper pour area, and other components on the motherboard, including connectors, ethernet ports and any metal components. On the motherboard, all PCB layers under the PCB antenna should be designed as a keep-out area. Figure 13: Keep-out Area on Motherboard During PCB design, do not route traces across the RF test point at the bottom of the module to ensure the module performance. HCM010S_Hardware_Design 31 / 50 20.2mm16mm4.2mm16mm16mm Bluetooth Module Series Figure 14: Prohibited Area for Routing HCM010S_Hardware_Design 32 / 50 Bluetooth Module Series 6 Electrical Characteristics & Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 15: Absolute Maximum Ratings (Unit: V) Parameter VBAT Voltage at Digital Pins Voltage at ADC[0:3]
Min.
-0.3
-0.3 0 6.2. Power Supply Ratings Table 16: Module Power Supply Ratings (Unit: V) Max. 3.8 4.1 3.8 Parameter Description Condition Min. Typ. Max. VBAT Power supply for the module The actual input voltages must be kept between the minimum and maximum values. 1.71 3.3 3.8 HCM010S_Hardware_Design 33 / 50 Bluetooth Module Series 6.3. Digital I/O Characteristics Table 17: VBAT I/O Characteristics (Unit: V) Parameter Description Min. Max. VIH VIL VOH VOL High-level input voltage 0.7 VBAT VBAT Low-level input voltage
-0.3 0.3 VBAT High-level output voltage 0.9 VBAT VBAT Low-level output voltage 0 0.1 VBAT 6.4. ESD Protection Static electricity occurs naturally and may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 18: ESD Characteristics (Unit: kV) Model Test Result Standard Human Body Model (HBM) 2.5 ANSI/ESDA/JEDEC JS-001-2017 Charged Device Model (CDM) 1 ANSI/ESDA/JEDEC JS-002-2018 HCM010S_Hardware_Design 34 / 50 Bluetooth Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeters (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 15: Top and Side Dimensions HCM010S_Hardware_Design 35 / 50 Bluetooth Module Series Figure 16: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module refers to the JEITA ED-7306 standard. HCM010S_Hardware_Design 36 / 50 Bluetooth Module Series 7.2. Recommended Footprint Figure 17: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. HCM010S_Hardware_Design 37 / 50 Bluetooth Module Series 7.3. Top and Bottom Views Figure 18: Top and Bottom Views NOTE Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. HCM010S_Hardware_Design 38 / 50 Bluetooth Module Series 8 Storage and Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 4 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
The module is not stored in Recommended Storage Condition;
Violation of the third requirement mentioned above;
Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
Before module repairing. 5. If needed, the pre-baking should follow the requirements below:
The module should be baked for 8 hours at 120 5 C;
The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 4 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering. HCM010S_Hardware_Design 39 / 50 Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.18 mm. For more details, see document [3]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 19: Recommended Reflow Soldering Thermal Profile HCM010S_Hardware_Design 40 / 50 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Ramp-to-soak slope: 03 C/s Cool-down slope: -30 C/s Ramp-up slope: 03 C/s Bluetooth Module Series Table 19: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217 C) Max. temperature Cool-down slope Reflow Cycle Max. reflow cycle NOTE 03 C/s 4070 s 235246 C
-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 3. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 4. 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3]. HCM010S_Hardware_Design 41 / 50 Bluetooth Module Series 8.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:
8.3.1. Carrier Tape Dimension details are as follow:
Figure 20: Tape Specifications Table 20: Carrier Tape Dimension Table (Unit: mm) W 44 P 24 T 0.4 A0 16 B0 K0 20.4 2.85 K1 3.4 F E 20.2 1.75 HCM010S_Hardware_Design 42 / 50 Bluetooth Module Series 8.3.2. Plastic Reel Figure 21: Plastic Reel Dimension Drawing Table 21: Plastic Reel Dimension Table (Unit: mm) D1 380 D2 100 W 44.5 8.3.3. Mounting Direction Figure 22: Mounting Direction HCM010S_Hardware_Design 43 / 50 Bluetooth Module Series 8.3.4. Packaging Process Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 1000 modules. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 4000 modules. Figure 23: Packaging Process HCM010S_Hardware_Design 44 / 50 Bluetooth Module Series 9 Appendix References Table 22: Reference Documents Document Name
[1] Quectel_HCM010S_TE-B_User_Guide
[2] Quectel_RF_Layout_Application_Note
[3] Quectel_Module_SMT_Application_Note Table 23: Terms and Abbreviations Abbreviation Description ADC AMBA APB ARM BLE DAC DMA DSP ESD EM EVB FRC Analog-to-Digital Converter Advanced Microcontroller Bus Architecture Advanced Peripheral Bus Advanced RISC Machine Bluetooth Low Energy Digital-to-Analog Converter Direct Memory Access Digital Signal Processor Electrostatic Discharge Energy Mode Evaluation Board Frame Controller HCM010S_Hardware_Design 45 / 50 Bluetooth Module Series GFSK GND GPIO I/O I2C I2S LCC LDO LED Mbps MCU OTA PCB PRS PWM RF RoHS SPI SRAM SWD TBD TVS UART VIH VIL Gauss frequency Shift Keying Ground General-Purpose Input/Output Input/Output Inter-Integrated Circuit Inter-IC Sound Leadless Chip Carrier (package) Low-dropout Regulator Light Emitting Diode Million Bits Per Second Microcontroller Unit Over-The-Air Printed Circuit Board Peripheral Reflex System Pulse Width Modulation Radio Frequency Restriction of Hazardous Substances Serial Peripheral Interface Static Random-Access Memory Serial Wire Debug To Be Determined Transient Voltage Suppressor Universal Asynchronous Receiver/Transmitter High-level Input Voltage Low-level Input Voltage HCM010S_Hardware_Design 46 / 50 Bluetooth Module Series Vmax Vmin Vnom VOH VOL VSWR Maximum Voltage Minimum Voltage Nominal Voltage High-level Output Voltage Low-level Output Voltage Voltage Standing Wave Ratio HCM010S_Hardware_Design 47 / 50 Bluetooth Module Series FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2023HCM010S. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:
Bluetooth LE:-1.8 dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;
then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR2023HCM010S. or Contains FCC ID: XMR2023HCM010S. must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for HCM010S_Hardware_Design 48 / 50 Bluetooth Module Series unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. IC Certification Requirements. This device contains licence-exempt transmitteris)/receivers) that comply with Innovation, Science and EconomicDevelopment Canada's licence-exempt RSS(s). Operation is subject to the following two conditions:
1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device. To comply with IC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:
Bluetooth LE:-1.8 dBi The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:
Contains IC: 10224A-2023HCM010S or where: 10224A-2023HCM010S is the module s certification number. This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. To comply with RSS-102 RF Exposure compliance requirements, this grant is applicable to only Mobile Configurations. The antennas used for the transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. L'appareil contient un metteur / rcepteur exempt de licence conforme au CNR exempt de licence d'innovation, sciences et dveloppement conomique Canada. Les oprations sont soumises aux deux conditions suivantes:
HCM010S_Hardware_Design 49 / 50 Bluetooth Module Series 1. Cet appareil peut ne pas causer d'interfrence. L'appareil doit accepter toute interfrence, y compris celles qui peuvent entraner un fonctionnement ind sirable de l'appareil. HCM010S_Hardware_Design 50 / 50
1 | Label and Location | ID Label/Location Info | 212.90 KiB | November 15 2023 |
ICOSSYV-SOS3HCIN0L02 ECC IDXINBSOS3HCINOL02 CE HCAN01 02VVAD-Ob OS-CXXxX HCIW0J02 O Snencrec a ic
4
cad ge 50 mn
1 | Attestation Statement | Attestation Statements | 314.39 KiB | November 15 2023 |
Quectel Wireless Solutions Company Limited)
(Quectel Wireless Solutions Company Limited To: Federal Communications Commission 7435 Oakland Mills Road To: Federal Communications Commission Date: 2023/
7435 Oakland Mills Road Columbia, MD 21046 USA Date: 2023/11/06 Attestation 2.911(d)(5)(i) and Section 2.911(d)(5)(ii) Section 2.911(d)(5)(i) and Section 2.911(d)(5)(ii) 2.911(d)(5)(i) and Section 2.911(d)(5)(ii)
(KDB 986446 D01 Covered Equipment)
(KDB 986446 D01 Covered Equipment) Section 2.911(d)(5)(i)
(the applicant) certifies that the Quectel Wireless Solutions Company Limited] (the applicant) certifies that the
[Quectel Wireless Solutions Company Limited equipment for which authorization is sought is not covered equipment prohibited equipment for which authorization is sought is not covered equipment prohibi equipment for which authorization is sought is not covered equipment prohibi from receiving an equipment authorization pursuant to section 2.903 of the FCC from receiving an equipment authorization pursuant to section 2.903 of the FCC from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Section 2.911(d)(5)(ii)
(the applicant) certifies that, as of Quectel Wireless Solutions Company Limited] (the applicant) certifies that, as of
[Quectel Wireless Solutions Company Limited identified on the Covered the date of the filing of the application, the applicant [is not] identified on the Covered the date of the filing of the application, the applicant
(as a specifically named entity or any of its subsidiaries or affiliates) as an entity
(as a specifically named entity or any of its subsidiaries or affiliates) List (as a specifically named entity or any of its subsidiaries or affiliates) producing covered equipment. producing covered equipment. Type of Equipment subject to FCC Certification:
Type of Equipment subject to FCC Certification:
XMR2023HCM010S FCC ID:XMR2023HCM010S please feel free to contact me If you have any questions, please feel free to contact me Signature:
Printed Name:Jean Hu Date:2023/11/06 Company: Quectel Wireless Solutions Company Limited Company: Quectel Wireless Solutions Company Limited Job Title:Project Manager Email:jean.hu@quectel.com Email:jean.hu@quectel.com 2150086326 Phone NO.: +86-2150086326
1 | Letter of Agency | Cover Letter(s) | 237.63 KiB | November 15 2023 |
Quectel Wireless Solutions Company Limited LETTER OF AGENCY Date:2023/11/06 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 FCC ID:XMR2023HCM010S To Whom It May Concern:
We certify that we are not subject to denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse ACT of 1988, U.S.C. 862. Further, no party, as defined in 47 CFR 1.2002(b), to the application, is subject to denial of federal benefits, that includes FCC benefits. Thank you for your attention to this matter. Sincerely yours, Signature Printed Name:Jean Hu Company: Quectel Wireless Solutions Company Limited Job Title:Project Manager Email:jean.hu@quectel.com Phone NO.: +86-2150086326
1 | Modular Approval Letter | Attestation Statements | 439.99 KiB | November 15 2023 |
Quectel Wireless Solutions Company Limited Declaration of the Modular Approval Applicant / Grantee Quectel Wireless Solutions Company Limited FCC ID:
Model:
XMR2023HCM010S HCM010S The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:
Modular approval requirement The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. EUT Condition The radio elements of the modular Comply YES transmitter have their own shielding.
(b) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation. The modular has buffered data inputs, it is YES integrated in chip. Please see schematic.pdf All power lines derived from the host device are regulated before energizing other circuits internal to the HCM010S. Please see schematic.pdf YES A permanently attached antenna has YES equipped with the module. The HCM010S was tested in a stand alone configuration via a PCMCIA extender. Please see spurious setup YES
(c)The modular transmitter must have its own powersupply regulation.
(d) The modular transmitter must comply with the antenna and transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section.
(e)The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that Quectel Wireless Solutions Company Limited The label position of HCM010S is clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text: Contains FCC ID:
XMR2023HCM010S. Please see the label.pdf The HCM010S is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. YES YES The HCM010S is approved to comply with YES the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance restriction. length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see Section 15.31(i))mustnotbeinsideanotherdeviceduringtesting.
(f)The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number.
(g) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any suchrequirements. A copy of these instructions must be included in the application for equipmentauthorizationrequirements,whicharebasedonthei ntendeduse/configurations.
(h)The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. Signature:
Printed Name:Jean Hu Date:2023/11/06 Company: Quectel Wireless Solutions Company Limited Job Title:Project Manager Email:jean.hu@quectel.com Phone NO.: +86-2150086326
1 | Request for Confidentiality | Cover Letter(s) | 496.31 KiB | November 15 2023 |
Quectel Wireless Solutions Company Limited Request for Confidentiality Date: _2023/11/08_ Subject: Confidentiality Request for: _____ FCC ID: XMR2023HCM010SIC Number:10224A-2023HCM010S Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100 Issue 12 / 12.4, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Permanent Permanent*1 Permanent Exhibit Block Diagrams External Photos Internal Photos Operation Description Short Term Short Term Short Term Short Term ______(Insert Explanation as Necessary)______ Permanent*
Permanent Schematics Test Setup Photos Users Manual
*Note:
___Quectel Wireless Solutions Company Limited _has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:
The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:
The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ____ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:
The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, Signature:
Printed Name:Jean Hu Date:2023/11/08 Company: Quectel Wireless Solutions Company Limited Job Title:Project Manager Email:jean.hu@quectel.com Phone NO.: +86-2150086326
1 | US Agency Letter | Attestation Statements | 163.38 KiB | November 15 2023 |
QUECCTEL Federal Communications Commission 7435 Oakland Mills Road Columbia MD 21046 Subject: Certification designating a U.S. agent for service of process pursuant to Part 2.911(d)(7) To whom it may concern, Quectel Wireless Solutions Company Limited, FRN: 0018988279, Grantee Code: XMR (the applicant) certifies that, as of the date of the filing of application, Ikotek USA, Inc., FRN: 0033350331 (the agent) is designated as the U.S. agent for the purpose of accepting service of process on behalf of the applicant. The physical U.S. address and email for the designated agent are:
Physical U.S. address: 9920 Pacific Heights Blvd., Ste. 150, #7025, San Diego, CA 92121 Email: compliance@ikotek.com The applicant accepts to maintain an agent for service of process in the United States for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. The agent accepts the designation by (the applicant) as the U.S. agent to accept service of process includes, but is not limited to, delivery of any correspondence, notices, orders, decisions, and requirements of administrative, legal, or judicial process related to Commission proceedings. Signed by the Applicant Signed by the Agent (if different from the Applicant) 7 he! Jean Hu Name: eterson Title Certification Manager Title: CEO. Email: Jean.hu@quectel.com Email: joe.peterson@ikotek.com Date: 07 July, 2023 Date: 07 July, 2023
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2023-11-15 | 2402 ~ 2480 | DTS - Digital Transmission System | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 | Effective |
2023-11-15
|
||||
1 | Applicant's complete, legal business name |
Quectel Wireless Solutions Company Limited
|
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1 | FCC Registration Number (FRN) |
0018988279
|
||||
1 | Physical Address |
Building 5, Shanghai Business Park PhaseIII (Area B),No.1016 Tianlin Road, Minhang District
|
||||
1 |
Building 5, Shanghai Business Park PhaseIII
|
|||||
1 |
Shanghai, N/A
|
|||||
1 |
China
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|||||
app s | TCB Information | |||||
1 | TCB Application Email Address |
P******@element.com
|
||||
1 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
app s | FCC ID | |||||
1 | Grantee Code |
XMR
|
||||
1 | Equipment Product Code |
2023HCM010S
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
J****** H********
|
||||
1 | Telephone Number |
+8602******** Extension:
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1 | Fax Number |
+8621********
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1 |
j******@quectel.com
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app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | DTS - Digital Transmission System | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | Bluetooth Module | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Single Modular Approval | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Grant Comments | Single Modular Approval. Output power listed is conducted. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other transmitter. End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
TA Technology (Shanghai) Co., Ltd.
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1 | Name |
M****** L******
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1 | Telephone Number |
86-21********
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1 |
l******@ta-shanghai.com
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Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | 2402.00000000 | 2480.00000000 | 0.0809000 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC