all | frequencies |
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User Manual | Users Manual | 1.58 MiB | December 12 2012 | |||
1 2 | Cover Letter(s) | |||||||
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1 2 | RF Exposure Info | |||||||
1 2 | Cover Letter(s) | |||||||
1 2 | Cover Letter(s) | |||||||
1 2 | Test Report | |||||||
1 2 | Cover Letter(s) | December 12 2012 | ||||||
1 2 | External Photos | December 12 2012 | ||||||
1 2 | Internal Photos | December 12 2012 | ||||||
1 2 | Cover Letter(s) | December 12 2012 | ||||||
1 2 | ID Label/Location Info | December 12 2012 | ||||||
1 2 | RF Exposure Info | December 12 2012 | ||||||
1 2 | Test Report | December 12 2012 | ||||||
1 2 | Test Setup Photos | December 12 2012 |
1 2 | User Manual | Users Manual | 1.58 MiB | December 12 2012 |
M50Hardware Design M50 Quectel Cellular Engine Hardware Design M50_HD_V2.0 M50_HD_V2.0
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M50Hardware Design Document Title M50 Hardware Design Revision Date Status 2.0 2012-06-26 Released Document Control ID M50_HD_V2.0 General Notes Quectel offers this information as a service to its customers, to support application and engineering efforts that use the products designed by Quectel. The information provided is based upon requirements specifically provided for customers of Quectel. Quectel has not undertaken any independent search for additional information, relevant to any information that may be in the customers possession. Furthermore, system validation of this product designed by Quectel within a larger electronic system remains the responsibility of the customer or the customers system integrator. All specifications supplied herein are subject to change. Copyright This document contains proprietary technical information of Quectel Co., Ltd. Copying this document, distribution to others, and communication of the contents thereof, are forbidden without permission. Offenders are liable to the payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. All specifications supplied herein are subject to change without notice at any time. Copyright Shanghai Quectel Wireless Solutions Ltd. 2012. M50_HD_V2.0
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Quecctel Confidential M50Hardware Design Contents Contents ................................................................................................................................................... 3 Table Index .............................................................................................................................................. 5 Figure Index ............................................................................................................................................ 6 0. Revision history .................................................................................................................................. 8 1. Introduction ....................................................................................................................................... 9 1.1. Related documents.................................................................................................................... 9 1.2. Terms and abbreviations......................................................................................................... 10 1.3. Safety cautions ........................................................................................................................ 12 2. Product concept ............................................................................................................................. 15 2.1. Key features ............................................................................................................................ 15 2.2. Functional diagram ................................................................................................................. 17 2.3. Evaluation board ..................................................................................................................... 18 3. Application interface ...................................................................................................................... 19 3.1. Pin of module .......................................................................................................................... 20 3.1.1. Pin assignment .............................................................................................................. 20 3.1.2. Pin description .............................................................................................................. 22 3.2. Operating modes ..................................................................................................................... 29 3.3. Power supply........................................................................................................................... 30 3.3.1. Power features of module ............................................................................................ 30 3.3.2. Decrease supply voltage drop ...................................................................................... 30 3.3.3. Reference design for power supply ............................................................................. 31 3.3.4. Monitor power supply .................................................................................................. 32 3.4. Power on and down scenarios ................................................................................................ 32 3.4.1. Power on ....................................................................................................................... 32 3.4.2. Power down .................................................................................................................. 34 3.4.3. Restart ........................................................................................................................... 36 3.5. Charge interface ...................................................................................................................... 38 3.6. Power saving ........................................................................................................................... 38 3.6.1. Minimum functionality mode ...................................................................................... 38 3.6.2. SLEEP mode................................................................................................................. 39 3.6.3. Wake up module from SLEEP mode .......................................................................... 39 3.7. Summary of state transition ................................................................................................... 39 3.8. RTC backup............................................................................................................................. 40 3.9. Serial interfaces ...................................................................................................................... 41 3.9.1. UART Port .................................................................................................................... 42 3.9.2. Debug Port .................................................................................................................... 46 3.9.3. Auxiliary UART Port ................................................................................................... 46 3.9.4. UART application ........................................................................................................ 47 3.10. Audio interfaces .................................................................................................................... 50 3.10.1. Decrease TDD noise and other noise ........................................................................ 51 3.10.2. Microphone interfaces design.................................................................................... 51 M50_HD_V2.0
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Quecctel Confidential M50Hardware Design 3.10.3. Receiver and speaker interface design ...................................................................... 52 3.10.4. Earphone interface design.......................................................................................... 54 3.10.5. Loud speaker interface design ................................................................................... 54 3.10.6. Audio characteristics .................................................................................................. 55 3.11. SIM card interface ................................................................................................................ 55 3.11.1. SIM card application .................................................................................................. 55 3.11.2. 6 Pin SIM cassette ...................................................................................................... 57 3.11.3. 8 Pin SIM cassette ...................................................................................................... 58 3.12. SD card interface .................................................................................................................. 60 3.13. PCM interface ....................................................................................................................... 62 3.13.1. Configuration .............................................................................................................. 62 3.13.2. Timing ......................................................................................................................... 63 3.13.3. Reference design ........................................................................................................ 64 3.13.4. AT command .............................................................................................................. 64 3.14. ADC ....................................................................................................................................... 66 3.15. Behaviors of the RI............................................................................................................... 66 3.16. Network status indication..................................................................................................... 69 3.17. Operating status indication .................................................................................................. 69 4. Antenna interface........................................................................................................................... 71 4.1. RF reference design ................................................................................................................ 71 4.2. RF output power ..................................................................................................................... 72 4.3. RF receiving sensitivity.......................................................................................................... 72 4.4. Operating frequencies............................................................................................................. 72 4.5. RF cable soldering .................................................................................................................. 73 5. Electrical, reliability and radio characteristics ......................................................................... 74 5.1. Absolute maximum ratings .................................................................................................... 74 5.2. Operating temperature ............................................................................................................ 74 5.3. Power supply ratings .............................................................................................................. 75 5.4. Current consumption .............................................................................................................. 76 5.5. Electro-static discharge .......................................................................................................... 78 6. Mechanical dimensions ................................................................................................................ 79 6.1. Mechanical dimensions of module ........................................................................................ 79 6.2. Recommended footprint without bottom centre pads .......................................................... 81 6.4. Top view of the module ......................................................................................................... 82 6.5. Bottom view of the module.................................................................................................... 83 7. Storage and manufacturing ......................................................................................................... 84 7.1. Storage ..................................................................................................................................... 84 7.2. Soldering ................................................................................................................................. 85 7.3. Packaging ................................................................................................................................ 86 Appendix A: GPRS coding schemes ............................................................................................. 87 Appendix B: GPRS multi-slot classes............................................................................................ 88 M50_HD_V2.0
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Quecctel Confidential M50Hardware Design Table Index TABLE 1: RELATED DOCUMENTS ..................................................................................................... 9 TABLE 2: TERMS AND ABBREVIATIONS........................................................................................ 10 TABLE 3: MODULE KEY FEATURES ................................................................................................ 15 TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE .. 17 TABLE 5: M50 PIN ASSIGNMENT ..................................................................................................... 21 TABLE 6: PIN DESCRIPTION ............................................................................................................. 22 TABLE 7: OVERVIEW OF OPERATING MODES.............................................................................. 29 TABLE 8: PIN DEFINITION OF THE CHARGING ............................................................................ 38 TABLE 9: SUMMARY OF STATE TRANSITION ............................................................................... 39 TABLE 10: LOGIC LEVELS OF THE UART INTERFACES.............................................................. 42 TABLE 11: PIN DEFINITION OF THE UART INTERFACES ............................................................ 42 TABLE 12: PIN DEFINITION OF AUDIO INTERFACES .................................................................. 50 TABLE 13: AOUT3 OUTPUT CHARACTERISTICS .......................................................................... 51 TABLE 14: TYPICAL ELECTRET MICROPHONE CHARACTERISTICS ....................................... 55 TABLE 15: TYPICAL SPEAKER CHARACTERISTICS .................................................................... 55 TABLE 16: PIN DEFINITION OF THE SIM INTERFACE ................................................................. 56 TABLE 17: PIN DESCRIPTION OF AMPHENOL SIM CARD HOLDER ......................................... 58 TABLE 18: PIN DESCRIPTION OF MOLEX SIM CARD HOLDER ................................................. 59 TABLE 19: PIN DEFINITION OF THE SD CARD INTERFACE ....................................................... 60 TABLE 20: PIN NAME OF THE SD CARD AND MICRO SD CARD ............................................... 61 TABLE 21: PIN DEFINITION OF PCM INTERFACE......................................................................... 62 TABLE 22: CONFIGURATION ............................................................................................................ 62 TABLE 23: QPCMON COMMAND DESCRIPTION .......................................................................... 65 TABLE 24: QPCMVOL COMMAND DESCRIPTION ........................................................................ 65 TABLE 25: PIN DEFINITION OF THE ADC....................................................................................... 66 TABLE 26: CHARACTERISTICS OF THE ADC ................................................................................ 66 TABLE 27: BEHAVIORS OF THE RI .................................................................................................. 66 TABLE 28: WORKING STATE OF THE NETLIGHT ......................................................................... 69 TABLE 29: PIN DEFINITION OF THE STATUS................................................................................. 69 TABLE 30: PIN DEFINITION OF THE RF_ANT ................................................................................ 71 TABLE 31: THE MODULE CONDUCTED RF OUTPUT POWER .................................................... 72 TABLE 32: THE MODULE CONDUCTED RF RECEIVING SENSITIVITY .................................... 72 TABLE 33: THE MODULE OPERATING FREQUENCIES ................................................................ 72 TABLE 34: ABSOLUTE MAXIMUM RATINGS................................................................................. 74 TABLE 35: OPERATING TEMPERATURE ......................................................................................... 74 TABLE 36: THE MODULE POWER SUPPLY RATINGS ................................................................... 75 TABLE 37: THE MODULE CURRENT CONSUMPTION .................................................................. 76 TABLE 38: THE ESD ENDURANCE (TEMPERATURE:25,HUMIDITY:45 %)............................ 78 TABLE 39: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................. 87 TABLE 40: GPRS MULTI-SLOT CLASSES ........................................................................................ 88 M50_HD_V2.0
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Quecctel Confidential M50Hardware Design Figure Index FIGURE 1: MODULE FUNCTIONAL DIAGRAM ............................................................................. 18 FIGURE 2: PIN ASSIGNMENT ............................................................................................................ 20 FIGURE 3: VOLTAGE RIPPLE DURING TRANSMITTING ............................................................. 30 FIGURE 4: REFERENCE CIRCUIT FOR THE VBAT INPUT ............................................................ 31 FIGURE 5: REFERENCE CIRCUIT FOR POWER SUPPLY .............................................................. 31 FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT................................................. 32 FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ........................................................... 33 FIGURE 8: TIMING OF TURNING ON SYSTEM .............................................................................. 33 FIGURE 9: TIMING OF TURNING OFF THE MODULE................................................................... 34 FIGURE 10: REFERENCE CIRCUIT FOR EMERG_OFF BY USING DRIVING CIRCUIT ............ 36 FIGURE 11: REFERENCE CIRCUIT FOR EMERG_OFF BY USING BUTTON .............................. 36 FIGURE 12: TIMING OF RESTARTING SYSTEM ............................................................................ 37 FIGURE 13: TIMING OF RESTARTING SYSTEM AFTER EMERGENCY SHUTDOWN .............. 37 FIGURE 14: RTC SUPPLY FROM NON-CHARGEABLE BATTERY ............................................... 40 FIGURE 15: RTC SUPPLY FROM RECHARGEABLE BATTERY .................................................... 40 FIGURE 16: RTC SUPPLY FROM CAPACITOR ................................................................................ 40 FIGURE 17: SEIKO XH414H-IV01E CHARGE CHARACTERISTICS ............................................. 41 FIGURE 18: REFERENCE DESIGN FOR FULL-FUNCTION UART ................................................ 44 FIGURE 19: REFERENCE DESIGN FOR UART PORT ..................................................................... 44 FIGURE 20: REFERENCE DESIGN FOR UART PORT WITH HARDWARE FLOW CONTROL... 45 FIGURE 21: REFERENCE DESIGN FOR FIRMWARE UPGRADE .................................................. 45 FIGURE 22: REFERENCE DESIGN FOR DEBUG PORT .................................................................. 46 FIGURE 23: REFERENCE DESIGN FOR AUXILIARY UART PORT ............................................... 47 FIGURE 24: LEVEL MATCH DESIGN FOR 3.3V SYSTEM.............................................................. 47 FIGURE 25: LEVEL MATCH DESIGN FOR 5V SYSTEM................................................................. 48 FIGURE 26: LEVEL MATCH DESIGN FOR RS-232 .......................................................................... 49 FIGURE 27: REFERENCE DESIGN FOR AIN1&AIN2...................................................................... 52 FIGURE 28: REFERENCE DESIGN FOR AOUT1 .............................................................................. 52 FIGURE 29: HANDSET INTERFACE DESIGN FOR AOUT2 ........................................................... 53 FIGURE 30: SPEAKER INTERFACE DESIGN WITH AN AMPLIFIER FOR AOUT2 ..................... 53 FIGURE 31: EARPHONE INTERFACE DESIGN ............................................................................... 54 FIGURE 32: LOUD SPEAKER INTERFACE DESIGN ....................................................................... 54 FIGURE 33: REFERENCE CIRCUIT OF THE 8 PINS SIM CARD .................................................... 56 FIGURE 34: REFERENCE CIRCUIT OF THE 6 PINS SIM CARD .................................................... 57 FIGURE 35: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER .............................................. 58 FIGURE 36: MOLEX 91228 SIM CARD HOLDER ............................................................................ 59 FIGURE 37: REFERENCE CIRCUIT OF SD CARD ........................................................................... 60 FIGURE 38: LONG SYNCHRONIZATION & SIGN EXTENSION DIAGRAM ............................... 63 FIGURE 39: LONG SYNCHRONIZATION & ZERO PADDING DIAGRAM ................................... 63 FIGURE 40: SHORT SYNCHRONIZATION & SIGN EXTENSION DIAGRAM .............................. 63 FIGURE 41: SHORT SYNCHRONIZATION & ZERO PADDING DIAGRAM ................................. 64 M50_HD_V2.0
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Quecctel Confidential M50Hardware Design FIGURE 42: REFERENCE DESIGN FOR PCM .................................................................................. 64 FIGURE 43: RI BEHAVIOR OF VOICE CALLING AS A RECEIVER .............................................. 67 FIGURE 44: RI BEHAVIOR OF DATA CALLING AS A RECEIVER ................................................ 67 FIGURE 45: RI BEHAVIOR AS A CALLER ........................................................................................ 67 FIGURE 46: RI BEHAVIOR OF URC OR SMS RECEIVED .............................................................. 68 FIGURE 47: REFERENCE DESIGN FOR NETLIGHT ....................................................................... 69 FIGURE 48: REFERENCE DESIGN FOR STATUS ............................................................................ 70 FIGURE 49: REFERENCE DESIGN FOR RF ...................................................................................... 71 FIGURE 50: RF SOLDERING SAMPLE.............................................................................................. 73 FIGURE 51: M50 TOP AND SIDE DIMENSIONS .............................................................................. 79 FIGURE 52: M50 BOTTOM DIMENSIONS ........................................................................................ 80 FIGURE 53: RECOMMENDED FOOTPRINT WITHOUT BOTTOM CENTRE PADS .................... 81 FIGURE 55: TOP VIEW OF THE MODULE ....................................................................................... 82 FIGURE 56: BOTTOM VIEW OF THE MODULE .............................................................................. 83 FIGURE 57: PASTE APPLICATION .................................................................................................... 85 FIGURE 58: RAMP-SOAK-SPIKE REFLOW PROFILE .................................................................... 86 FIGURE 59: MODULE TRAY .............................................................................................................. 86 FIGURE 60: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3 ........................................... 87 FIGURE 61: RADIO BLOCK STRUCTURE OF CS-4 ........................................................................ 87 M50_HD_V2.0
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Quecctel Confidential M50Hardware Design 0. Revision history Revision Date 1.0 1.1 Author 2011-12-20 Ray XU 2012-02-03 Ray XU 1.2 1.3 2012-07-20 Baly BAO 2012-10-22 Mountain ZHOU 2.0 2012-06-16 Ray XU Description of change Initial 1. Updated PCM interface 2. Updated SD interface 3. Updated charging interface 4. Updated timing of turning on the module 1. Deleted the USB interface 2. Deleted the camera interface 1. Updated functional diagram 2. Updated reference design circuit 3. Updated audio characteristics 4. Updated VRTC DC characteristics 5. Updated SLEEP current consumption 6. Updated internet service protocols 7. Updated SIM pins name 8. Modified PCM function 9. Deleted FAX function 1. Update the module size 2. Update the pin layout M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 1. Introduction This document defines the M50 module and describes the hardware interface of M50 which are connected with the customer application and the air interface. This document can help customers quickly understand module interface specifications, electrical and mechanical details. Associated with application notes and user guide, customers can use M50module to design and set up mobile applications easily. 1.1. Related documents Table 1: Related documents Document name SN
[1] M50_ATC Remark AT commands set new Serial asynchronous automatic dialing and control
[2]
[3]
[4]
[5]
Draft ITU-T recommendation V.25ter GSM 07.07 GSM 07.10 GSM 07.05
[6]
GSM 11.14
[7]
GSM 11.11
[8]
GSM 03.38
[9]
GSM 11.10
[10] GSM_UART_AN
[11] GSM_FW_Upgrade_AN01
[12] M10_EVB_UGD telecommunications Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) Support GSM 07.10 multiplexing protocol Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment Data Circuit terminating Equipment (DTE DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) Digital cellular
(Phase 2+);
Specification of the SIM Application Toolkit for the Subscriber Identity module Mobile Equipment (SIM ME) interface
(Phase 2+);
Digital cellular Specification of the Subscriber Identity module Mobile Equipment (SIM ME) interface Digital cellular Alphabets and language-specific information Digital cellular telecommunications (Phase 2); Mobile Station (MS) conformance specification; Part 1:
Conformance specification UART port application note GSM Firmware upgrade application note M10 EVB user guide telecommunications telecommunications
(Phase 2+);
M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 1.2. Terms and abbreviations Table 2: Terms and abbreviations Abbreviation Description ADC AMR ARP ASIC BER BOM BTS CHAP CS CSD CTS DAC DRX DSP DCE DTE DTR DTX EFR EGSM EMC ESD ETS FCC FDMA FR GMSK GPRS GSM HR I/O IC IMEI Imax Inorm kbps LED Analog-to-Digital Converter Adaptive Multi-Rate Antenna Reference Point Application Specific Integrated Circuit Bit Error Rate Bill Of Material Base Transceiver Station Challenge Handshake Authentication Protocol Coding Scheme Circuit Switched Data Clear To Send Digital-to-Analog Converter Discontinuous Reception Digital Signal Processor Data Communications Equipment (typically module) Data Terminal Equipment (typically computer, external controller) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSM Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard Federal Communications Commission (U.S.) Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying General Packet Radio Service Global System for Mobile Communications Half Rate Input/Output Integrated Circuit International Mobile Equipment Identity Maximum Load Current Normal Current Kilo Bits Per Second Light Emitting Diode M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Lithium-Ion Mobile Originated Mobile Station (GSM engine) Mobile Terminated Password Authentication Protocol Packet Switched Broadcast Control Channel Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Radio Frequency Root Mean Square (value) Real Time Clock Receive Direction Subscriber Identification Module Short Message Service Time Division Multiple Access Terminal Equipment Transmitting Direction Universal Asynchronous Receiver & Transmitter Unsolicited Result Code Unstructured Supplementary Service Data Voltage Standing Wave Ratio Maximum Voltage Value Normal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Absolute Minimum Input Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Li-Ion MO MS MT PAP PBCCH PCB PDU PPP RF RMS RTC RX SIM SMS TDMA TE TX UART URC USSD VSWR Vmax Vnorm Vmin VIHmax VIHmin VILmax VILmin VImax VImin VOHmax VOHmin VOLmax VOLmin Phonebook abbreviations LD MC ON RC SM SIM Last Dialing phonebook (list of numbers most recently dialed) Mobile Equipment list of unanswered MT Calls (missed calls) SIM (or ME) Own Numbers (MSISDNs) list Mobile Equipment list of Received Calls SIM phonebook M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 1.3. Safety cautions The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating M50module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, Quectel does not take on any liability for customer failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions about the use of mobile. Switch the cellular terminal or mobile off. Medical equipment may be sensitive to not operate normally for RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forget to think much of these instructions may lead to the flight safety or offend against local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gas or fume. Switch off the cellular terminal when you are near petrol station, fuel depot, chemical plant or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmosphere can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile while driving a vehicle, unless it is securely mounted in a holder for hands-free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, Please Remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in cellular terminal or mobile. According to the R&TTE Directive 1999/95/CE, all wireless equipment and telecommunications terminals sold in EU must meet all the stipulated health, safety RF, EMC requirements that provide for CE mark. Quectel Module M50 is fully in accordance with all the directives of EU. 1.4. Directives and standards The M50 module is designed to comply with the FCC statements. FCC ID: XMR201211M50. The Host system using M50, should have label indicated contains FCC ID: XMR201211M50. 1.4.1. FCC Statement 1. This device complies with Part 15 of the FCC rules. Operation is subject to the following conditions:
a) This device may not cause harmful interference. b) This device must accept any interference received, including interference that may cause 2. Changes or modifications not expressly approved by the party responsible for compliance undesired operation. could void the users authority to operate the equipment. 1.4.2. FCC Radiation exposure statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body as well as kept minimum 20cm from radio antenna depending on the Mobile status of this module usage. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design The manual of the host system, which uses M50, must include RF exposure warning statement to advice user should keep minimum 20cm from the radio antenna of M50 module depending on the Mobile status. The following list of antenna is indicating the maximum permissible antenna gain. Type External Antenna Internal Antenna Maximum Gain
(850Hz/900Hz) 0.5dBi 0.5dBi 0.5dBi 0.5dBi 0.5dBi 0.5dBi Maximum Gain
(1800Hz/1900Hz) 2dBi 2dBi 2dBi 2dBi 2dBi 2dBi Impedance 50 50 50 50 50 50 Monopole Vehicular antenna Monopole PIFA FPC PCB This radio module must not be installed to co-locate and operate simu ltaneously with other radios in host system;
additional testing and equipment authorization may be required to op erating simultaneously with other radios. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 2. Product concept M50 is a Quad-band GSM/GPRS engine that works at frequencies of GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz. The M50 features GPRS multi-slot class 12 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about GPRS multi-slot classes and coding schemes, please refer to the Appendix A and Appendix B. With a tiny profile of 24.5mm25.3mm 2.6mm, the module can meet almost all the requirements for M2M applications, including Vehicles and Personal Tracking, Security System, Wireless POS, Industrial PDA, Smart Metering, and Remote Maintenance & Control etc. M50 is an SMD type module with LCC package, which can be embedded in customers applications. It provides abundant hardware interfaces between the module and customers host board. Designed with power saving technique, the current consumption of M50 is as low as 1.3 mA in SLEEP mode when DRX is 5. M50 is integrated with Internet service protocols, such as TCP, UDP, FTP and PPP. Extended AT commands have been developed for customer to use these Internet service protocols easily. The module fully complies with the RoHS directive of the European Union. 2.1. Key features Table 3: Module key features Feature Power supply Power saving Frequency bands GSM class Transmitting power GPRS connectivity Description Single supply voltage 3.3V~ 4.6V Typical supply voltage 4.0V Typical power consumption in SLEEP mode: 1.3 mA@ DRX=5 1.2 mA@ DRX=9 Quad-band: GSM850, GSM900, DCS1800, PCS1900. The module can search these frequency bands automatically The frequency bands can be set by AT command. Compliant with GSM Phase 2/2+
Small MS Class 4 (2W) at GSM850 and GSM900 Class 1 (1W) at DCS1800 and PCS1900 GPRS multi-slot class 12 (default) GPRS multi-slot class 1~12 (configurable) GPRS mobile station class B M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Temperature range DATA GPRS:
CSD:
SMS SIM interface Audio features UART interfaces Normal operation: -35C ~ +80C Restricted operation: -40C ~ -35C and +80C ~ +85C 1) Storage temperature: -45C ~ +90C GPRS data downlink transfer: max. 85.6 kbps GPRS data uplink transfer: max. 85.6 kbps Coding scheme: CS-1, CS-2, CS-3 and CS-4 Support the protocols PAP (Password Authentication Protocol) usually used for PPP connections Internet service protocols TCP/UDP/FTP/PPP/HTTP/NTP/PING Support Packet Broadcast Control Channel (PBCCH) CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps non-transparent Support Unstructured Supplementary Service Data (USSD) Text and PDU mode SMS storage: SIM card Support SIM card: 1.8V, 3V Speech codec modes:
Half Rate (ETS 06.20) Full Rate (ETS 06.10) Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80) Adaptive Multi-Rate (AMR) Echo Suppression Echo Cancellation Noise Reduction Embedded one amplifier of class AB with maximum driving power up to 800mW UART Port:
Seven lines on UART port interface Used for AT command, GPRS data and CSD data Multiplexing function Support autobauding from 4800 bps to 115200 bps Debug Port:
Two lines on debug port interface DBG_TXD and DBG_RXD Debug Port only used for firmware debugging Auxiliary Port:
Used for AT command Support phonebook types: SM, ME, ON, MC, RC, DC, LD, LA Phonebook management SIM Application Toolkit Support SAT class 3, GSM 11.14 Release 99 Real time clock Physical characteristics Supported Size:
24.5 (0.15) 25.3 (0.15) 2.6 (0.2) mm Weight: 3.3g Firmware upgrade via UART Port Firmware upgrade M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Connected to antenna pad with 50 Ohm impedance control Antenna interface 1When the module works in this temperature range, the deviations from the GSM specification may occur. For example, the frequency error or the phase error will be increased. Table 4: Coding schemes and maximum net data rates over air interface Coding scheme CS-1 CS-2 CS-3 CS-4 1 Timeslot 9.05kbps 13.4kbps 15.6kbps 21.4kbps 2.2. Functional diagram 2 Timeslot 18.1kbps 26.8kbps 31.2kbps 42.8kbps 4 Timeslot 36.2kbps 53.6kbps 62.4kbps 85.6kbps The following figure shows a block diagram of the M50 module and illustrates the major functional parts:
Power management Baseband Serial Flash The radio frequency part The peripheral interface Charge interface PCM interface SD interface SIM interface Audio interface Serial interface Power supply RF interface ADC Turn on/off interface (PWRKEY & EMERG_OFF) M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design RF_ANT VBAT Charge Interface PWRKEY EMERG_OFF VRTC SIM Interface STATUS&
NETLIGHT UART ESD RF PAM SAW Filter 32KHz Charge Reset RTC SIM Interface GPIO Serial Interface RF Transceiver 26MHz SD Interface PCM Interface ADC Audio PMU BB&RF Memory Interface Serial Flash SD Interface PCM Inteface ADC Audio Figure 1: Module functional diagram 2.3. Evaluation board In order to help customer to develop applications with M50 , Quectel supplies an evaluation board
(EVB), RS-232 to USB cable, power adapter, earphone, antenna and other peripherals to control or test the module. For details, please refer to the document [12]. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3. Application interface The module is equipped with 83-pin SMT pads and it adopts LCC package. Detailed descriptions on Sub-interfaces included in these pads are given in the following chapters:
Power supply Power on/down Charge interface RTC Serial interfaces Audio interfaces SIM interface SD interface PCM interface ADC M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.1. Pin of module 3.1.1. Pin assignment D E V R E S E R 74 D E V R E S E R 73 D E V R E S E R 72 D E V R E S E R 71 T A B V 70 T A B V 69 T A B V 68 T A B V 67 D N G 66 D N G 65 D N G 64 T N A _ F R 63 D N G 62 D N G 61 T X E _ D D V 60 C T R V 59 D E V R E S E R 58 E C N E S E R P _ M I S 57 Top view GND 82 83 78 RESERVED 81 GND 80 79 GND GND RESERVED RESERVED RESERVED 75 76 77 ADC1 ADC0 RESERVED NETLIGHT SPK2P AGND MIC2P MIC2N MIC1P MIC1N SPK1N SPK1P LOUDSPKN LOUDSPKP STATUS PWRKEY EMERG_OFF PCM_IN PCM_CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 SIM1_VDD SIM1_DATA SIM1_CLK SIM1_RST SIM1_GND TXD RXD RTS CTS DTR RI DCD RESERVED DBG_RXD DBG_TXD RXD_AUX TXD_AUX RESERVED RESERVED 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 T U O _ M C P C N Y S _ M C P D E V R E S E R D E V R E S E R D E V R E S E R D E V R E S E R D E V R E S E R D E V R E S E R D E V R E S E R D E V R E S E R D E V R E S E R D E V R E S E R D E V R E S E R D E V R E S E R D M C _ D S K L C _ D S 0 A T A D _ D S D N G VBAT Other GND RF PCM UART ADC Power SIM Reserved SD Audio Figure 2: Pin assignment M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Table 5: M50 pin assignment 1 ADC1 RESERVED 3 SPK2P 5 7 MIC2P MIC1P 9 SPK1N 11 13 LOUDSPKN STATUS 15 17 EMERG_OFF PCM_CLK 19 PCM_SYNC 21 23 RESERVED RESERVED 25 RESERVED 27 29 RESERVED RESERVED 31 RESERVED 33 35 SD_CLK GND 37 RESERVED 39 41 RXD_AUX DBG_RXD 43 45 DCD DTR 47 RTS 49 51 TXD SIM_RST 53 SIM_DATA 55 57 SIM_PRESENCE VRTC 59 GND 61 63 RF_ANT GND 65 VBAT 67 69 VBAT RESERVED 71
/
I O I I O O O I O O O I I O I I O O I/O I I/O I/O I I ADC0 NETLIGHT AGND MIC2N MIC1N SPK1P LOUDSPKP PWRKEY PCM_IN PCM_OUT RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED SD_CMD SD_DATA0 RESERVED TXD_AUX DBG_TXD RESERVED RI CTS RXD SIM_GND SIM_CLK SIM_VDD RESERVED VDD_EXT GND GND GND VBAT VBAT RESERVED 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72
/
I O I I O O I I O O I/O O O O O I O O O I I M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 74 76 78 80 82 RESERVED RESERVED RESERVED GND GND 73 75 77 79 81 83 RESERVED RESERVED RESERVED GND GND GND Note: Keep all reserved pins open. 3.1.2. Pin description Table 6: Pin description Power supply PIN NAME VBAT PIN NO. 67, 68, 69 70 I/O DESCRIPTION I Main power supply of module:
VBAT=3.3V~4.6V DC CHARACTERISTICS Vmax= 4.6V Vmin=3.3V Vnorm=4.0V VRTC 59 I/O Power supply for RTC when VBAT is not supplied for the system. Charging for backup battery or golden capacitor when the VBAT is supplied. Supply 2.8V voltage for external circuit. VDD_EXT 60 O VImax=3.3V VImin=1.5V VInorm=2.8V VOmax=2.85V VOmin=2.6V VOnorm=2.8V Iout(max)= 1mA Iin=2.6~5 uA Vmax=2.9V Vmin=2.7V Vnorm=2.8V Imax=20mA GND 37, 61, Ground COMMENT Make sure that supply sufficient current in a transmitting burst which typically rises to 1.6A. If unused, keep this pin open. 1. If unused, keep this pin open. 2. Recommended to add a 2.2~4.7uF bypass capacitor when supplying power for external circuit. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 62, 64, 65, 66, PIN NO. 15 Turn on/off PIN NAME PWRKEY Emergency shutdown PIN PIN NAME NO. 17 EMERG_OFF Module indicator PIN NAME STATUS PIN NO. 16 DC CHARACTERISTICS VILmax=
0.1VBAT VIHmin=
0.6VBAT VImax=VBAT DC CHARACTERISTICS VILmax=0.4V VIHmin=2.2V Vopenmax=2.8V COMMENT Pulled up to VBAT internally. COMMENT Open drain/collector driver required in cellular device application. If unused, keep this pin open. DC CHARACTERISTICS VOHmin=
0.85VDD_EXT VOLmax=
0.15VDD_EXT COMMENT If unused, keep this pin open. I/O DESCRIPTION I Turn on/off control. PWRKEY should be pulled down for a moment to turn on or off the system. I/O DESCRIPTION I Emergency off. Pulled down for at least 20ms, which will turn off the module in case of emergency. Use it only when normal shutdown through PWRKEY or AT command cannot perform well. I/O DESCRIPTION O Indicate module operating status. High level indicates module is power-on and low level indicates power-down. Audio interface PIN NAME MIC1P MIC1N PIN NO. 9, 10 I/O DESCRIPTION I Channel one for positive and negative voice-band input DC CHARACTERISTICS COMMENT If unused, keep these pins open. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design MIC2P MIC2N 7, 8 I SPK1P SPK1N O 12, 11 SPK2P AGND 5 6 LOUDSPKN LOUDSPKP 13, 14 O O Channel two for positive and negative voice-band input Channel one for positive and negative voice-band output Channel two for voice-band output Analog ground. Constitute a pseudo differential channel with SPK2P. Channel three of positive and negative voice-band output Net status indicator PIN PIN NAME NO. 4 NETLIGHT I/O DESCRIPTION O Network status indication DC CHARACTERISTICS VOHmin=
0.85VDD_EXT VOLmax=
0.15VDD_EXT 1. If unused, keep these pins open. 2. Support both voice and ringtone output. 1. If unused, keep these pins open. 2. Embedded amplifier of class AB internally. 3. Support both voice and ringtone output. COMMENT If unused, keep this pin open. UART Port PIN NAME DTR RXD TXD RTS CTS RI DCD PIN NO. 47 50 49 51 48 46 45 I/O DESCRIPTION DC CHARACTERISTICS COMMENT I I O I O O O VILmax=
Data terminal ready VILmin=0V Receive data Transmit data Request to send Clear to send Ring indicator Data carrier detection VOHmin=
VIHmax=
VIHmin=
0.25VDD_EXT 0.75VDD_EXT VDD_EXT+0.3 0.85VDD_EXT If only use TXD, RXD and GND to communicate, recommend pulling down RTS and keeping other pins open. VOLmax=
M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Debug Port PIN NAME DBG_TXD PIN NO. 42 I/O DESCRIPTION O UART interface for debugging only. DBG_RXD 43 I Auxiliary UART Port PIN PIN NAME NO. 40 TXD_AUX I/O DESCRIPTION O Transmit data RXD_AUX 41 I Receive data SIM interface PIN NAME SIM_VDD PIN NO. 56 I/O DESCRIPTION O Power supply for SIM card SIM_DATA 54 I/O SIM data COMMENT If unused, keep these pins open. COMMENT If unused, keep these pins open. 0.15VDD_EXT DC CHARACTERISTICS VILmin=0V VILmax=
0.25VDD_EXT VIHmin=
0.75VDD_EXT VIHmax=
VDD_EXT+0.3 VOHmin=
0.85VDD_EXT VOLmax=
0.15VDD_EXT DC CHARACTERISTICS VILmin=0V VILmax=
0.25VDD_EXT VIHmin=
0.75VDD_EXT VIHmax=
VDD_EXT+0.3 VOHmin=
0.85VDD_EXT VOLmax=
0.15VDD_EXT DC CHARACTERISTICS The voltage can be selected by firmware automatically. Either 1.8V or 3V. 3V VOLmax=0.4 VOHmin=
SIM_VDD-0.4 1.8V:
VOLmax=
COMMENT All signals of SIM interface should be protected against ESD with a TVS diode array. Maximum cable length is 200mm from the module pad to SIM card M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 0.15SIM_VDD holder. SIM_CLK 55 O SIM clock SIM_RST 53 O SIM reset SIM_GND SIM_PRESEN CE 52 57 I SIM ground SIM card detection VOHmin=
SIM_VDD-0.4 3V VOLmax=0.4 VOHmin=
0.9SIM_VDD 1.8V:
VOLmax=
0.12SIM_VDD VOHmin=
0.9SIM_VDD 3V VOLmax=0.36 VOHmin=
0.9SIM_VDD 1.8V:
VOLmax=
0.2SIM_VDD VOHmin=
0.9SIM_VDD VILmin=0V VILmax=
0.25VDD_EXT VIHmin=
0.75VDD_EXT VIHmax=
VDD_EXT+0.3 If unused, keep this pin open. ADC PIN NAME ADC0 PIN NO. 2 ADC1 1 I/O DESCRIPTION I I General purpose analog to digital converter. General purpose analog to digital converter. DC CHARACTERISTICS Voltage range: 0V to 2.8V Voltage range: 0V to 2.8V COMMENT Please give priority to the use of ADC0. If unused, keep these pins open. PCM PIN NAME PCM_CLK PCM_IN PIN NO. 19 18 I/O DESCRIPTION O I PCM clock PCM data input DC CHARACTERISTICS VILmin=0V VILmax=
COMMENT M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design PCM_OUT PCM_SYNC 20 21 O O PCM data output PCM frame synchronization SD card PIN NAME SD_CMD SD_CLK SD_DATA0 PIN NO. 34 35 36 I/O DESCRIPTION O O I/O SD command SD clock SD data 0.25VDD_EXT VIHmin=
0.75VDD_EXT VIHmax=
VDD_EXT+0.3 VOHmin=
0.85VDD_EXT VOLmax=
0.15VDD_EXT DC CHARACTERISTICS VILmin=0V VILmax=
0.25VDD_EXT VIHmin=
0.75VDD_EXT VIHmax=
VDD_EXT+0.3 VOHmin=
0.85VDD_EXT VOLmax=
0.15VDD_EXT COMMENT I/O DESCRIPTION I/O RF antenna pad DC CHARACTERISTICS Impedance of 50 COMMENT I/O DESCRIPTION I DC CHARACTERISTICS VILmin=0V VILmax=
0.25VDD_EXT VIHmin=
0.75VDD_EXT VIHmax=
VDD_EXT+0.3 COMMENT this pin Keep open. Keep these pins open. RF interface PIN NAME RF_ANT Other interface PIN NAME DOWNLOAD PIN NO. 63 PIN NO. 3 RESERVED 22~
33 38~
39, 44, 58, M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 71~
75 M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.2. Operating modes The table below briefly summarizes the various operating modes in the following chapters. Table 7: Overview of operating modes Mode Normal operation GSM/GPRS Function SLEEP GSM IDLE GSM TALK GPRS IDLE GPRS STANDBY GPRS READY The module will automatically go into SLEEP mode if DTR is set to high level and there is no interrupt (such as GPIO interrupt or data on UART port). In this case, the current consumption of module will reduce to the minimal level. During SLEEP mode, the module can still receive paging message and SMS from the system normally. Firmware is active. The module has registered to the GSM network, and the module is ready to send and receive GSM data. GSM connection is ongoing. In this mode, the power consumption is decided by the configuration of Power Control Level (PCL), dynamic DTX control and the working RF band. The module is not registered to GPRS network. The module is not reachable through GPRS channel. The module is registered to GPRS network, but no GPRS PDP context is active. The SGSN knows the Routing Area where the module is located at. The PDP context is active, but no data transfer is ongoing. The module is ready to receive or send GPRS data. The SGSN knows the cell where the module is located at. GPRS DATA There is GPRS data in transfer. In this mode, power consumption is decided by the PCL, working RF band and GPRS multi-slot configuration. Normal shutdown by sending the AT+QPOWD=1 command, using the PWRKEY or the EMERG_OFF1) pin. The power management ASIC disconnects the power supply from the base band part of the module, and only the power supply for the RTC is remained. Software is not active. The UART interfaces are not accessible. Operating voltage (connected to VBAT) remains applied. AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, the RF part of the module will not work or the SIM card will not be accessible, or both RF part and SIM card will be disabled, but the UART port is still accessible. The power consumption in this case is very low. Power down Minimum functionality mode (without removing power supply) M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 1) Use the EMERG_OFF pin only while failing to turn off the module by the command AT+QPOWD=1 and the PWRKEY pin. Please refer to the Section 3.4.2.4. 3.3. Power supply 3.3.1. Power features of module The power supply is one of the key issues in the designing GSM terminals. Due to the 577us radio burst emission in GSM every 4.615ms, power supply must be able to deliver high current peaks in a burst period. During these peaks, drops on the supply voltage must not exceed minimum working voltage of module. For the M50 module, the max current consumption could reach to 1.6A during a transmit burst. It will cause a large voltage drops on the VBAT. In order to ensure stable operation of the module, it is recommended that the max voltage drop during the transmit burst does not exceed 400mV. 4.615ms 577us IVBAT VBAT Burst:1.6A Vdrop Figure 3: Voltage ripple during transmitting 3.3.2. Decrease supply voltage drop The power supply rang of the module is 3.3V to 4.6V. Make sure that the input voltage will never drop below 3.3V even in a transmitting burst. If the power voltage drops below 3.3V, the module could turn off automatically. For better power performance, it is recommended to place a 100uF tantalum capacitor with low ESR (ESR=0.7) and ceramic capacitor 100nF, 33pF and 10pF near the VBAT pin. The reference circuit is illustrated in Figure 4. The VBAT route should be wide enough to ensure that there is not too much voltage drop occurring during transmit burst. The width of trace should be no less than 2mm and the principle of the VBAT route is the longer route, the wider trace. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design VBAT
+
C1 C2 C3 C4 100uF 100nF 10pF 0603 33pF 0603 GND Figure 4: Reference circuit for the VBAT input 3.3.3. Reference design for power supply The power design for the module is very important, since the performance of power supply for the module largely depends on the power source. The power supply is capable of providing the sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested to use a LDO as modules power supply. If there is a big voltage difference between the input source and the desired output (VBAT), a switcher power converter is prefer to use as a power supply. Figure 5 shows a reference design for +5V input power source. The designed output for the power supply is 4.16V and the maximum load current is 3A. In addition, in order to get a stable output voltage, a zener diode is placed close to the pins of VBAT. As to the zener diode, it is suggested to use a zener diode which reverse zener voltage is 5.1V and dissipation power is more than 1 Watt. DC_IN MIC29302 U1 2 IN OUT 4 VBAT 1 3 5 N E D N G C1 C2 470uF 100nF J D A R1 120K R2 51K C3 C4 D1 470uF 100nF Figure 5: Reference circuit for power supply M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.3.4. Monitor power supply To monitor the supply voltage, customer can use the AT+CBC command which includes three parameters: charging status, remaining battery capacity and voltage value (in mV). It returns the 0~100 percent of battery capacity and actual value measured between VBAT and GND. The voltage is automatically measured in period of 5s. The displayed voltage (in mV) is averaged over the last measuring period before the AT+CBC command is executed. For details, please refer to the document [1]. 3.4. Power on and down scenarios 3.4.1. Power on Customers application can turn on the module by driving the pin PWRKEY to a low level voltage, and after STATUS pin outputs a high level, PWRKEY pin can be released. Customer may monitor the level of the STATUS pin to judge whether the module is power-on or not. An open collector driver circuit is suggested to control the PWRKEY. A simple reference circuit is illustrated as below. PWRKEY 4.7K Turn on pulse 47K Figure 6: Turn on the module using driving circuit Note: The module is set to autobauding mode (AT+IPR=0) in default configuration. In the autobauding mode, the URC RDY after powering on is not sent to host controller. When the module receives AT command, it will be powered on after a delay of 2 or 3 seconds. Host controller should firstly send an AT or at string in order that the module can detect baud rate of host controller, and it should send the second or the third AT or at string until receiving OK string from the module. Then an AT+IPR=x;&W should be sent to set a fixed baud rate for the module and save the configuration to flash memory of the module. After these configurations, the URC RDY would be received from the UART Port of the module every time when the module is powered on. Refer to the section AT+IPR in document [1]. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design The other way to control the PWRKEY is using a button directly. A TVS component is indispensable to be placed nearby the button for ESD protection. When pressing the key, electrostatic strike may generate from finger. A reference circuit is shown in the following figure. S1 TVS1 PWRKEY Close to S1 Figure 7: Turn on the module using keystroke The power-on scenarios is illustrated as the following figure. 1 VBAT 2 EMERG_OFF
(INPUT) PWRKEY
(INPUT) VDD_EXT
(OUTPUT) STATUS
(OUTPUT) MODULE STATUS VIH > 0.6*VBAT 54ms
>1s VIL<0.1*VBAT 800ms OFF BOOTING RUNNING Figure 8: Timing of turning on system Make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is recommended 30ms. EMERG_OFF should be floated when it is unused M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.4.2. Power down The following procedures can be used to turn off the module:
Normal power down procedure: Turn off module using the PWRKEY pin Normal power down procedure: Turn off module using command AT+QPOWD Over-voltage or under-voltage automatic shutdown: Take effect when over-voltage or under-voltage is detected Emergent power down procedure: Turn off module using the EMERG_OFF pin 3.4.2.1. Power down module using the PWRKEY pin Customers application can turn off the module by driving the PWRKEY to a low level voltage for a certain time. The power down scenario is illustrated in Figure 9. 0.6s<Pulldown<1s Logout net about 2s to 12s VBAT PWRKEY
(INPUT) STATUS
(OUTPUT) EMERG_OFF
(INPUT)
>160us Figure 9: Timing of turning off the module The power down procedure causes the module to log off from the network and allows the firmware to save important data before completely disconnecting the power supply, thus it is a safe way. Before the completion of the power down procedure, the module sends out the result code shown below:
NORMAL POWER DOWN Note: This result code does not appear when autobauding is active and DTE and DCE are not correctly synchronized after start-up. The module is recommended to set a fixed baud rate. After that moment, no further AT commands can be executed. Then the module enters the power down mode, only the RTC is still active. The power down mode can also be indicated by the M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design STATUS pin, which is a low level voltage in this mode. 3.4.2.2. Power down module using AT command Customers application can turn off the module via AT command AT+QPOWD=1. This command will let the module to log off from the network and allow the firmware to save important data before completely disconnecting the power supply, thus it is a safe way. Before the completion of the power down procedure the module sends out the result code shown below:
NORMAL POWER DOWN After that moment, no further AT commands can be executed. And then the module enters the power down mode, only the RTC is still active. The power down mode can also be indicated by STATUS pin, which is a low level voltage in this mode. Please refer to the document [1] for details about the AT command AT+QPOWD. 3.4.2.3. Over-voltage or under-voltage automatic shutdown The module will constantly monitor the voltage applied on the VBAT, if the voltage is 3.5V, the following URC will be presented:
UNDER_VOLTAGE WARNING If the voltage is 4.5V, the following URC will be presented:
OVER_VOLTAGE WARNING The normal input voltage range is from 3.3V to 4.6V. If the voltage is > 4.6V or < 3.3V, the module would automatically shutdown itself. If the voltage is < 3.3V, the following URC will be presented:
UNDER_VOLTAGE POWER DOWN If the voltage is > 4.6V, the following URC will be presented:
OVER_VOLTAGE POWER DOWN Note: These result codes do not appear when autobauding is active and DTE and DCE are not M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design correctly synchronized after start-up. The module is recommended to set to a fixed baud rate. After that moment, no further AT commands can be executed. The module logs off from network and enters power down mode, and only RTC is still active. The power down mode can also be indicated by the pin STATUS, which is a low level voltage in this mode. 3.4.2.4. Emergency shutdown using EMERG_OFF pin The module can be shut down by driving the pin EMERG_OFF to a low level voltage over 20ms and then releasing it. The EMERG_OFF line can be driven by an open-drain/collector driver or a button. The circuit is illustrated as the following figures. EMERG_OFF 4.7K Emergency shutdown pulse 47K Figure 10: Reference circuit for EMERG_OFF by using driving circuit S2 TVS2 EMERG_OFF Close to S2 Figure 11: Reference circuit for EMERG_OFF by using button 3.4.3. Restart Customers application can restart the module by driving the PWRKEY to a low level voltage for a certain time, which is similar to the way of turning on module. Before restarting the module, at M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design least 500ms should be delayed after detecting the low level of STATUS. The restart timing is illustrated as the following figure. PWRKEY
(INPUT) STATUS
(OUTPUT) Turn off Delay >0.5s Restart Pull down the PWRKEY to turn on the module Figure 12: Timing of restarting system The module can also be restarted by the PWRKEY after emergency shutdown. Pulldown >20ms Delay >2s 6us EMERG_OFF
(INPUT) STATUS
(OUTPUT) PWRKEY
(INPUT) Figure 13: Timing of restarting system after emergency shutdown M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.5. Charge interface M50 provides charging function for rechargeable Li-Ion or Lithium Polymer battery. It is introduced simply in this document. If customer wants to get more information about charging, please refer to the document [13]. Table 8: Pin definition of the charging I/O O I I I I Description. Charge driving Charger power supply source Charger detection Current sense VBAT voltage sense Name GATDRV CHGLDO CHGDET ISENSE BATSNS Pin 74 73 72 71 70 3.6. Power saving Upon system requirement, there are several actions to drive the module to enter low current consumption status. For example, AT+CFUN can be used to set module into minimum functionality mode and DTR hardware interface signal can be used to lead system to SLEEP mode. 3.6.1. Minimum functionality mode Minimum functionality mode reduces the functionality of the module to a minimum level, thus minimize the current consumption when the slow clocking mode is activated at the same time. This mode is set with the AT+CFUN command which provides the choice of the functionality levels <fun>=0, 1, 4. 0: minimum functionality 1: full functionality (default) 4: disable both transmitting and receiving of RF part If the module is set to minimum functionality by AT+CFUN=0, the RF function and SIM card function would be disabled. In this case, the UART port is still accessible, but all AT commands correlative with RF function or SIM card function will be not accessible. If the module has been set by AT+CFUN=4, the RF function will be disabled, the UART port is still active. In this case, all AT commands correlative with RF function will be not accessible. After the module is set by AT+CFUN=0 or AT+CFUN=4, it can return to full functionality by M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design AT+CFUN=1. For detailed information about AT+CFUN, please refer to the document [1]. 3.6.2. SLEEP mode The SLEEP mode is disabled in default firmware configuration. Customers application can enable this mode by AT+QSCLK=1. On the other hand, the default setting is AT+QSCLK=0 and in this mode, the module cannot enter SLEEP mode. When AT+QSCLK=1 is sent to the module, customers application can control the module to enter or exit from the SLEEP mode through pin DTR. When DTR is set to high level, and there is no on-air or hardware interrupt such as GPIO interrupt or data on UART port, the module will enter SLEEP mode automatically. In this mode, the module can still receive voice, SMS or GPRS paging from network but the UART port is not accessible. 3.6.3. Wake up module from SLEEP mode When the module is in the SLEEP mode, the following methods can wake up the module. If the DTR Pin is set low, it would wake up the module from the SLEEP mode. The UART port will be active within 20ms after DTR is changed to low level. Receive a voice or data call from network wakes up module. Receive an SMS from network wakes up module. Note: DTR pin should be held at low level during communication between the module and DTE. 3.7. Summary of state transition Table 9: Summary of state transition Current mode Power down Normal mode SLEEP mode Power down AT+QPOWD, use PWRKEY pin, or use EMERG_OFF pin Use PWRKEY pin, or use EMERG_OFF pin Next mode Normal mode Use PWRKEY Pull DTR down or incoming call or SMS or GPRS SLEEP mode Use AT command AT+QSCLK=1 and pull DTR up M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.8. RTC backup The RTC (Real Time Clock) can be supplied by an external capacitor or battery (rechargeable or non-chargeable) through the pin VRTC. A 1.5K resistor has been integrated in the module for current limiting. A coin-cell battery or a super-cap can be used to backup power supply for RTC. The following figures show various sample circuits for RTC backup. Module VRTC 1.5K RTC Core Non-chargeable Backup Battery Figure 14: RTC supply from non-chargeable battery Module VRTC 1.5K RTC Core Rechargeable Backup Battery Figure 15: RTC supply from rechargeable battery Module VRTC 1.5K RTC Core Large Capacitance Capacitor Figure 16: RTC supply from capacitor M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Coin-type rechargeable capacitor such as XH414H-IV01E from Seiko can be used. Figure 17: Seiko XH414H-IV01E Charge Characteristics 3.9. Serial interfaces The module provides three serial ports: UART Port, Debug Port and Auxiliary UART Port. The module is designed as a DCE (Data Communication Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection. Autobauding function supports baud rate from 4800bps to 115200bps. The UART Port:
TXD: Send data to RXD of DTE. RXD: Receive data from TXD of DTE. RTS: Request to send. CTS: Clear to send. DTR: DTE is ready and inform DCE (this pin can wake the module up). RI: Ring indicator (when the call, SMS, data of the module are coming, the module will output signal to inform DTE). DCD: Data carrier detection (the validity of this pin demonstrates the communication link is set up). Note: The module disables hardware flow control by default. When hardware flow control is required, RTS and CTS should be connected to the host. AT command AT+IFC=2,2 is used to enable hardware flow control. AT command AT+IFC=0,0 is used to disable the hardware flow control. For more details, please refer to the document [1]. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design The Debug Port DBG_TXD: Send data to the COM port of computer. DBG_RXD: Receive data from the COM port of computer. The Auxiliary UART Port TXD_AUX: Send data to the RXD of DTE. RXD_AUX: Receive data from the TXD of DTE. The logic levels are described in the following table. Table 10: Logic levels of the UART interfaces Parameter VIL VIH VOL VOH Max Min 0 0.25VDD_EXT 0.75VDD_EXT VDD_EXT +0.3 0.15VDD_EXT 0.85VDD_EXT Unit V V V V Table 11: Pin definition of the UART interfaces Name DBG_RXD DBG_TXD RI RTS CTS RXD TXD DTR DCD RXD_AUX TXD_AUX Pin 43 42 46 51 48 50 49 47 45 41 40 Description Receive data of the debug port Transmit data of the debug port Ring indicator Request to send Clear to send Receive data of the UART port Transmit data of the UART port Data terminal ready Data carrier detection Receive data of the Auxiliary UART Transmit data of the Auxiliary UART Interface Debug Port UART Port Auxiliary UART Port 3.9.1. UART Port 3.9.1.1. The features of UART Port. Seven lines on UART interface Contain data lines TXD and RXD, hardware flow control lines RTS and CTS, other control lines DTR, DCD and RI. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Used for AT command, GPRS data, etc. Multiplexing function is supported on the UART Port. So far only the basic mode of multiplexing is available. 300, 600, 1200, 2400, 4800, 9600, 14400, 19200, 28800, 38400, 57600, 115200. Support the communication baud rates as the following:
The default setting is autobauding mode. Support the following baud rates for Autobauding The module disables hardware flow control by default. AT command AT+IFC=2,2 is used function:
4800, 9600, 19200, 38400, 57600, 115200. to enable hardware flow control. After setting a fixed baud rate or autobauding, please send AT string at that rate. The UART port is ready when it responds OK. Autobauding allows the module to detect the baud rate by receiving the string AT or at from the host or PC automatically, which gives module flexibility without considering which baud rate is used by the host controller. Autobauding is enabled by default. To take advantage of the autobauding mode, special attention should be paid according to the following requirements:
Synchronization between DTE and DCE:
When DCE (the module) powers on with the autobauding enabled, it is recommended to wait 2 to 3 seconds before sending the first AT character. After receiving the OK response, DTE and DCE are correctly synchronized. If the host controller needs URC in the mode of autobauding, it must be synchronized firstly. Otherwise the URC will be discarded. Restrictions on autobauding operation:
The UART port has to be operated at 8 data bits, no parity and 1 stop bit (factory setting). The At and aT commands cannot be used. Only the strings AT or at can be detected (neither At nor aT). The Unsolicited Result Codes like RDY, +CFUN: 1 and +CPIN: READY will not be indicated when the module is turned on with autobauding enabled and not be synchronized. Any other Unsolicited Result Codes will be sent at the previous baud rate before the module detects the new baud rate by receiving the first AT or at string. The DTE may receive unknown characters after switching to new baud rate. It is not recommended to switch to autobauding from a fixed baud rate. If autobauding is active it is not recommended to switch to multiplex mode. Note: To assure reliable communication and avoid any problems caused by undetermined baud rate between DCE and DTE, it is strongly recommended to configure a fixed baud rate and save it instead of using autobauding after start-up. For more details, please refer to the Section AT+IPR in document [1]. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.9.1.2. The connection of UART The connection between module and host using UART Port is very flexible. Three connection styles are illustrated as below. Reference design for Full-Function UART connection is shown as below when it is applied in modulation-demodulation. Module (DCE) UART port PC (DTE) Serial port TXD RXD RTS CTS DTR DCD RI GND TXD RXD RTS CTS DTR DCD RING GND Figure 18: Reference design for Full-Function UART Three-line connection is shown as below. Module (DCE) UART port TXD RXD GND RTS 0R Host (DTE) Controller TXD RXD GND Figure 19: Reference design for UART Port M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design UART Port with hardware flow control is shown as below. This connection will enhance the reliability of the mass data communication. Module (DCE) Host (DTE) Controller TXD RXD RTS CTS GND TXD RXD RTS CTS GND Figure 20: Reference design for UART Port with hardware flow control 3.9.1.3. Firmware upgrade The TXD, RXD can be used to upgrade firmware. The PWRKEY pin must be pulled down before the firmware upgrade. Please refer to the following figure for Firmware upgrade. Module (DCE) UART port TXD RXD GND PWRKEY IO Connector TXD RXD GND PWRKEY Figure 21: Reference design for Firmware upgrade Note: The firmware of module might need to be upgraded due to certain reasons, it is recommended to reserve these pins in the host board for firmware upgrade. For detailed design, please refer to the document [11]. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.9.2. Debug Port Debug Port Two lines: DBG_TXD and DBG_RXD It outputs log information automatically. Debug Port is only used for firmware debugging and its baud rate must be configured as 460800bps. Module (DCE) Debug port DBG_TXD DBG_RXD GND Computer TXD RXD GND Figure 22: Reference design for Debug Port 3.9.3. Auxiliary UART Port Auxiliary UART Port Two data lines: TXD_AUX and RXD_AUX Auxiliary UART port is used for AT command only and does not support GPRS data, CSD FAX, Multiplexing function etc. Auxiliary UART port supports the communication baud rates as the following:
4800, 9600, 14400, 19200, 28800, 38400, 57600, 115200. The default baud rate setting is 115200bps, and does not support autobauding. The baud rate can be modified by AT+QSEDCB command. For more details, please refer to the document
[1]. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Module (DCE) TXD_AUX RXD_AUX GND Host (DTE) Controller TXD RXD GND Figure 23: Reference design for Auxiliary UART port 3.9.4. UART application The reference design of 3.3V level match is shown as below. If the host is a 3V system, please change the 5.6K resistor to 15K. MCU/ARM
/TXD
/RXD
/RTS
/CTS GPIO EINT GPIO GND Voltage level:3.3V 1K 1K 1K 1K 1K 1K 1K Module RXD TXD RTS CTS DTR RI DCD GND 5.6K 5.6K 5.6K Figure 24: Level match design for 3.3V system M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design The reference design for 5V level match is shown as below. The connection of dotted line can be referred to the connection of solid line. Please pay attention to the direction of signal. Input dotted line of module should be referred to input solid line of the module. Output dotted line of module should be referred to output solid line of the module. As to the circuit below, VDD_EXT supplies power for the I/O of module, while VCC_MCU supplies power for the I/O of the MCU/ARM. MCU/ARM VCC_MCU 4.7K 5.6K VDD_EXT 4.7K Module
/TXD
/RXD
/RTS
/CTS GPIO EINT GPIO GND Voltage level: 5V 4.7K VCC_MCU 4.7K VDD_EXT RXD TXD RTS CTS DTR RI DCD GND Figure 25: Level match design for 5V system M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design The following circuit shows a reference design for the communication between module and PC. Since the electrical level of module is 2.8V, so a RS-232 level shifter must be used. SP3238 28 25 1 3 24 23 22 19 17 16 21 20 18 13 C1+
C1-
C2+
C2-
T1IN T2IN T3IN T4IN T5IN
/R1OUT R1OUT R2OUT R3OUT ONLINE V+
GND VCC V-
T4OUT T2OUT T3OUT T1OUT T5OUT R1IN R2IN R3IN
/STATUS
/SHUTDOWN 27 2 26 4 10 6 7 5 12 8 9 11 15 14 DCD TXD CTS RI MODULE GND RXD DTR RTS 3V 3V GND GND 6 7 8 9 1 2 3 4 5 To PC serial port GND Figure 26: Level match design for RS-232 M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.10. Audio interfaces The module provides two analogy input channels and three analogy output channels. Table 12: Pin definition of Audio interfaces Interface AIN1/AOUT1 AIN2/AOUT2 AOUT3 Name MIC1P MIC1N SPK1P SPK1N MIC2P MIC2N SPK2P AGND LOUDSPKP LOUDSPKN Pin 9 10 12 11 7 8 5 6 14 13 Description Channel one for Microphone positive input Channel one for Microphone negative input Channel one for Audio positive output Channel one for Audio negative output Channel two for Microphone positive input Channel two for Microphone negative input Channel two for Audio positive output Analog ground. Channel three for Audio positive output Channel three for Audio negative output AIN1 and AIN2 can be used for input of microphone and line. An electret microphone is usually used. AIN1 and AIN2 are both differential input channels. AOUT1 is used for output of the receiver. This channel is typically used for a receiver built into a handset. AOUT1 channel is a differential channel. AOUT2 is typically used with earphone. It is a single-ended and mono channel. SPK2P and AGND can establish a pseudo differential mode. AOUT3 is used for loud speaker output as it embedded an amplifier of class AB whose maximum drive power is 800mW. All of these three audio channels support voice and ringtone output, and so on, and can be swapped by AT+QAUDCH command. For more details, please refer to the document [1]. Use AT command AT+QAUDCH to select audio channel:
0--AIN1/AOUT1, the default value is 0. 1--AIN2/AOUT2 2--AIN2/AOUT3 For each channel, customer can use AT+QMIC to adjust the input gain level of microphone. Customer can also use AT+CLVL to adjust the output gain level of receiver and speaker. AT+QSIDET is used to set the side-tone gain level. For more details, please refer to the document [1]. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Table 13: AOUT3 output characteristics Parameter RMS power Gain adjustment range Gain adjustment steps Condition 8ohm load VBAT=4.3V THD+N=1%
8ohm load VBAT=3.7V THD+N=1%
Min Typ 800 Max Unit mW 0 700 mW 3 18 dB dB 3.10.1. Decrease TDD noise and other noise The 33pF capacitor is applied for filtering out 900MHz RF interference when the module is transmitting at GSM900MHz. Without placing this capacitor, TDD noise could be heard. Moreover, the 10pF capacitor here is for filtering out 1800MHz RF interference. However, the resonant frequency point of a capacitor largely depends on the material and production technique. Therefore, customer would have to discuss with its capacitor vendor to choose the most suitable capacitor for filtering out GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz separately. The severity degree of the RF interference in the voice channel during GSM transmitting period largely depends on the application design. In some cases, GSM900 TDD noise is more severe;
while in other cases, DCS1800 TDD noise is more obvious. Therefore, customer can have a choice based on test results. Sometimes, even no RF filtering capacitor is required. The capacitor which is used for filtering out RF noise should be close to RJ11 or other audio interfaces. Audio alignment should be as short as possible. In order to decrease radio or other signal interference, the position of RF antenna should be kept away from audio interface and audio alignment. Power alignment and audio alignment should not be parallel, and power alignment should be far away from audio alignment. The differential audio traces have to be placed according to the differential signal layout rule. 3.10.2. Microphone interfaces design AIN1 and AIN2 channels come with internal bias supply for external electret microphone. A reference circuit is shown in the following figure. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Close to Microphone GND GND GND Differential layout Module MICxP MICxN 10pF 0603 10pF 0603 10pF 0603 33pF 0603 33pF 0603 33pF 0603 ESD Electret Microphone ESD GND GND GND Figure 27: Reference design for AIN1&AIN2 3.10.3. Receiver and speaker interface design Differential layout Module SPK1P SPK1N Close to Speaker GND 33pF 0603 33pF 0603 33pF 0603 GND ESD ESD 10pF 0603 10pF 0603 10pF 0603 Figure 28: Reference design for AOUT1 M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Differential layout 10pF 0603 Close to Speaker GND 33pF 0603 ESD 22uF Module SPK2P AGND Figure 29: Handset interface design for AOUT2 Module SPK2P AGND C1 C2 Differential layout Amplifier circuit Close to Speaker GND 33pF 0603 33pF 0603 GND ESD ESD 10pF 0603 10pF 0603 Figure 30: Speaker interface design with an amplifier for AOUT2 Texas Instruments TPA6205A1is recommended for a suitable differential audio amplifier. There are plenty of excellent audio amplifiers in the market. Note: The value of C1 and C2 here depends on the input impedance of audio amplifier. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.10.4. Earphone interface design Close to Socket Differential layout 4.7uF GND GND GND Module MIC2N MIC2P SPK2P AGND AGND 22uF 10pF 0603 33pF 0603 ESD 68R 10pF 0603 33pF 0603 ESD 3 4 2 1 GND GND GND AGND Amphenol 9001-8905-050 Figure 31: Earphone interface design 3.10.5. Loud speaker interface design Differential layout Module LOUDSPKP LOUDSPKN Close to Speaker GND 10pF 0603 100pF 10pF 0603 ESD ESD 33pF 0603 0R 0R 33pF 0603 GND Figure 32: Loud speaker interface design M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.10.6. Audio characteristics Table 14: Typical electret microphone characteristics Parameter Working Voltage Working Current External Microphone Load Resistance Min 1.2 200 Typ 1.5 2.2 Max 2.0 500 Unit V uA kOhm Table 15: Typical speaker characteristics Parameter Normal Output
(AOUT1) Auxiliary Output
(AOUT2) Output
(AOUT3) Single Ended Load Resistance Ref level Differential Load Resistance Ref level Load Resistance Ref level Load Resistance Ref level Single Ended Differential Min 28 Typ 32 Max 0 28 0 16 0 0 32 32 8 2.4 4.8 2.4 2VBAT Unit Ohm Vpp Ohm Vpp Load Resistance Vpp Load Resistance Vpp 3.11. SIM card interface 3.11.1. SIM card application The SIM interface supports the functionality of the GSM Phase 1 specification and also supports the functionality of the new GSM Phase 2+ specification for FAST 64 kbps SIM card, which is intended for use with a SIM application Tool-kit. The SIM interface is powered from an internal regulator in the module. Both 1.8V and 3.0V SIM Cards are supported. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Table 16: Pin definition of the SIM interface Name SIM_VDD Pin 56 SIM_DATA SIM_CLK SIM_RST SIM_PRESENCE SIM_GND 54 55 53 57 52 Description Supply power for SIM Card. Automatic detection of SIM card voltage. 3.0V10% and 1.8V10%. Maximum supply current is around 10mA. SIM data SIM clock SIM reset SIM card detection SIM ground In Figure 33, the pin SIM_PRESENCE is used to detect whether the tray of the Molex SIM socket, which is used for holding SIM card, is present in the card socket. When the tray is inserted in the socket, SIM_PRESENCE is at low level. Regardless of whether the SIM card is in the tray or not, the change of SIM_PRESENCE level from high to low level inspires the module to reinitialize SIM card. In default configuration, SIM card detection function is disabled. Customers application can use AT+QSIMDET=1,0 to switch on and AT+QSIMDET=0,0 to switch off the SIM card detection function. For detail of this AT command, please refer to the document [1]. When AT+QSIMDET=1,0 is set and the tray with SIM card is removed from SIM socket, the following URC will be presented.
+CPIN: NOT READY When the tray with SIM card is inserted into SIM socket again and the module finishes re-initialization SIM card, the following URC will be presented. Call Ready VDD_EXT 10K Module SIM_GND SIM_VDD SIM_RST SIM_CLK SIM_PRESENCE SIM_DATA 22R 22R 22R 100nF SIM_Holder VCC RST CLK GND VPP IO 33pF 33pF 33pF 33pF ESDA6V8V6 GND GND GND Figure 33: Reference circuit of the 8 pins SIM card M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Note: Please do not use AT+QSIMDET=1,1 which causes to initialize SIM card when Figure 33 circuit is adopted. If customer does not need the SIM card detection function, keep SIM_PRESENCE open. The reference circuit using a 6-pin SIM card socket is illustrated as the following figure. Module SIM_GND SIM_VDD SIM_RST SIM_CLK SIM_PRESENCE SIM_DATA 22R 22R 22R 100nF SIM_Holder VCC RST CLK GND VPP IO 33pF 33pF 33pF 33pF ESDA6V8V6 GND GND Figure 34: Reference circuit of the 6 pins SIM card In order to enhance the reliability and availability of the SIM card in the customers application. Please follow the below criterion in the SIM circuit design. Keep layout of SIM card as close as possible to the module. Assure the possibility of the length of the trace is less than 20cm. Keep SIM card signal away from RF and VBAT alignment. Assure the ground between module and SIM cassette short and wide. Keep the width of ground no less than 0.5mm to maintain the same electric potential. The decouple capacitor of SIM_VDD is less than 1uF and must be near to SIM cassette. To avoid cross talk between SIM_DATA and SIM_CLK. Keep them away with each other and shield them with surrounded ground In order to offer good ESD protection, it is recommended to add TVS such as WILL
(http://www.willsemi.com) ESDA6V8AV6. The 22 resistors should be added in series between the module and the SIM card so as to suppress the EMI spurious transmission and enhance the ESD protection. Please to be noted that the SIM peripheral circuit should be close to the SIM card socket. 3.11.2. 6 Pin SIM cassette For 6-pin SIM card holder, it is recommended to use Amphenol C707 10M006 512 2. Please visit http://www.amphenol.com for more information. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Figure 35: Amphenol C707 10M006 512 2 SIM card holder Table 17: Pin description of Amphenol SIM card holder Description SIM Card Power Supply SIM Card Reset SIM Card Clock Ground Not Connect SIM Card data I/O Pin Name SIM_VDD C1 SIM_RST C2 SIM_CLK C3 GND C5 VPP C6 SIM_DATA C7 3.11.3. 8 Pin SIM cassette For 8-pin SIM card holder, http://www.molex.com for more information. it is recommended to use Molex 91228. Please visit M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Figure 36: Molex 91228 SIM card holder Table 18: Pin description of Molex SIM card holder Pin Name C1 SIM_VDD C2 SIM_RST SIM_CLK C3 SIM_PRESENCE C4 C5 GND C6 VPP SIM_DATA C7 C8 SIM_DETECT Description SIM Card Power supply SIM Card Reset SIM Card Clock SIM Card Presence Detection Ground Not Connect SIM Card Data I/O Pulled down GND with external circuit. When the tray is present, C4 is connected to C8. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.12. SD card interface The module provides SD card interface that support many types of memory, such as Memory Stick, SD/MCC card and T-Flash or Micro SD card. The following are the main features of SD card interface. Only supports 1bit serial mode. Does not support the SPI mode SD/MMC memory card. Does not support hot plug. Up to 26MHz data rate in serial mode. Up to 32GB maximum memory card capacity. With interface features and reference circuit of SD card shown in Figure 37, the users can easily design the SD card application circuit to enhance the memory capacity of the module. The module can record and store the audio files to the SD card, and play the audio files from SD card as well. Table 19: Pin definition of the SD card interface Name SD_DATA0 SD_CLK SD_CMD Module Pin 36 35 34 Description SD data SD clock SD command VDD_EXT SD_CMD SD_CLK SD_DATA0 33R 33R 33R 47K 47K 47K Micro SD Socket DATA2 CD/DATA3 CMD VDD CLK VSS DATA0 DATA1 1 2 3 4 5 6 7 8 4.7uF 0.1nF Figure 37: Reference circuit of SD card M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Table 20: Pin name of the SD card and Micro SD card Pin NO. 1 2 3 4 5 6 7 8 9 Pin name of SD card CD/DATA3 CMD VSS1 VDD CLK VSS2 DATA0 DATA1 DATA2 Pin name of T-Flash(Micro SD) card DATA2 CD/DATA3 CMD VDD CLK VSS DATA0 DATA1 In SD card interface designing, in order to ensure good communication performance with SD card, the following design principles should be complied with. Route SD card trace as short as possible. Keep total trace length < 100mm, and trace difference of DATA0, CMD, and CLK to be < 10mm. The SD_CLK and SD_DATA0 line must be shielded by GND in order to avoid interference. In order to offer good ESD protection, it is recommended to add TVS on signals with the capacitance is less than 15pF. Reserve external pull-up resistor for other data lines except the DATA0. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.13. PCM interface M50 supports PCM interface. It is used for digital audio transmission between the module and the customers device. This interface is composed of PCM_CLK, PCM_SYNC, PCM_IN and PCM_OUT signal lines. Pulse-code modulation (PCM) is a converter that changes the consecutive analog audio signal to discrete digital signal. The whole procedure of Pulse-code modulation contains sampling, quantizing and encoding. Table 21: Pin definition of PCM interface Name PCM_CLK PCM_IN PCM_OUT PCM_SYNC Pin 19 18 20 21 3.13.1. Configuration I/O O I O O Description PCM clock PCM data input PCM data output PCM frame synchronization M50 supports 16 bits line code PCM format. The sample rate is 8 KHz, the clock source is 256 KHz, and the module can only act as master mode. The PCM interfaces support long and short synchronization simultaneously. It only supports MSB first. For more detailed information, please see the table below. Table 22: Configuration PCM Line interface format Data length Sampling rate PCM clock/synchronization source PCM synchronization rate PCM clock rate PCM synchronization format PCM data ordering Zero padding Sign extension Linear Linear: 16 bits 8KHz PCM master mode: clock and synchronization is generated by module 8KHz PCM master mode:256 KHz Long/short synchronization MSB first Yes Yes M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.13.2. Timing The sample rate of the PCM interface is 8 KHz and the clock source is 256 KHz, so every frame contains 32 bits data, since M50 supports 16 bits line code PCM format, the left 16 bits are invalid. The following diagram shows the timing of different combinations. The synchronization length in long synchronization format can be programmed by firmware from one bit to eight bits. In the Sign extension mode, the high three bits of 16 bits are sign extension, and in the Zero padding mode, the low three bits of 16 bits are zero padding. PCM_CLK PCM_SYNC MSB PCM_OUT Sign extension 12 11 10 9 MSB PCM_IN Sign extension 12 11 10 9 8 8 7 7 6 6 5 5 4 4 3 3 2 2 1 1 0 0 Figure 38: Long synchronization & Sign extension diagram PCM_CLK PCM_SYNC PCM_OUT PCM_IN PCM_CLK PCM_SYNC PCM_OUT PCM_IN MSB 12 11 10 MSB 12 11 10 9 9 8 8 7 7 6 6 5 5 4 4 3 3 2 2 1 1 0 0 Zero padding Zero padding Figure 39: Long synchronization & Zero padding diagram MSB Sign extension MSB Sign extension 12 11 10 12 11 10 9 9 8 8 7 7 6 6 5 5 4 4 3 3 2 2 1 1 0 0 Figure 40: Short synchronization & Sign extension diagram M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design PCM_CLK PCM_SYNC MSB PCM_OUT 12 11 10 PCM_IN MSB 12 11 10 9 9 8 8 7 7 6 6 5 5 4 4 3 3 2 2 1 1 0 0 Zero padding Zero padding Figure 41: Short synchronization & Zero padding diagram 3.13.3. Reference design As M50 only acts as a master, the module provides synchronization and clock source. The reference design is shown as below. Codec
(slave) PCM_CLK PCM_SYNC PCM_OUT PCM_IN GND Module
(master) PCM_CLK PCM_SYNC PCM_IN PCM_OUT GND Figure 42: Reference design for PCM 3.13.4. AT command There are two AT commands about the configuration of PCM are listed as below. AT+QPCMON can configure operating mode of PCM. AT+QPCMON= mode,Sync_Type,Sync_Length,SignExtension,MSBFirst M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Table 23: QPCMON command description Parameter Mode Sync_Type Sync_Length SignExtension MSBFirst scope 0~2 0~1 1~8 0~1 0~1 Description 0: Close PCM 1: Open PCM 2: Open PCM when audio talk is set up 0: Short synchronization 1: Long synchronization Programmed from one bit to eight bit 0: Zero padding 1: Sign extension 0: MSB first 1: Not supported AT+QPCMVOL can configure volume of input and output. AT+QPCMVOL=vol_pcm_in,vol_pcm_out Table 24: QPCMVOL command description Parameter vol_pcm_in vol_pcm_out scope 0~32767 0~32767 Description Set the input volume Set the output volume The voice may be distorted when this value exceeds 16384. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.14. ADC The module provides two ADC channel to measure the value of voltage. Please give priority to the use of ADC0 channel. The command AT+QADC can read the voltage value applied on ADC0 pin, while AT command AT+QEADC can read the voltage value applied on ADC1 pin. For details of this AT command, please refer to the document [1]. In order to improve the accuracy of ADC, the layout of ADC should be surrounded by ground. Table 25: Pin definition of the ADC Name ADC0 ADC1 Pin 2 1 Description General purpose analog to digital converter General purpose analog to digital converter Table 26: Characteristics of the ADC Parameter Voltage Range ADC Resolution ADC Accuracy Min 0 Typ 10 2.7 Max 2.8 Unit V bit mV 3.15. Behaviors of the RI Table 27: Behaviors of the RI State Standby Voice calling Data calling RI response HIGH Change to LOW, then:
1. Change to HIGH when call is established. 2. Use ATH to hang up the call, RI changes to HIGH. 3. Calling part hangs up, RI changes to HIGH first, and changes to LOW for 120ms indicating NO CARRIER as an URC, then changes to HIGH again. 4. Change to HIGH when SMS is received. Change to LOW, then 1. Change to HIGH when data connection is established. 2. Use ATH to hang up the data calling, RI changes to HIGH. 3. Calling part hangs up, RI changes to HIGH first, and changes to LOW for 120ms indicating NO CARRIER as an URC, then changes to HIGH again. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design SMS URC 4. Change to HIGH when SMS is received. When a new SMS comes, the RI changes to LOW and holds low level for about 120 ms, then changes to HIGH. Certain URCs can trigger 120ms low level on RI. For more details, please refer to the document [1]
If the module is used as a caller, the RI would maintain high except the URC or SMS is received. On the other hand, when it is used as a receiver, the timing of the RI is shown below. HIGH RI LOW Idle Ring Off-hook byATA On-hook by ATH SMS received Figure 43: RI behavior of voice calling as a receiver HIGH RI LOW Idle Ring Data calling establish On-hook by ATH SMS received Figure 44: RI behavior of data calling as a receiver RI HIGH LOW Idle Calling Talking On-hook Idle Figure 45: RI behavior as a caller M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design HIGH RI 120ms LOW Idle or Talking URC or SMS received Figure 46: RI behavior of URC or SMS received M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 3.16. Network status indication The NETLIGHT signal can be used to drive a network status indicator LED. The working state of this pin is listed in the following table. Table 28: Working state of the NETLIGHT State Off 64ms On/ 800ms Off 64ms On/ 2000ms Off Module function The module is not running. The module is not synchronized with network. The module is synchronized with network. 64ms On/ 600ms Off GPRS data transfer is ongoing. A reference circuit is shown as below. Module NETLIGHT 4.7K VBAT 300R 47K Figure 47: Reference design for NETLIGHT 3.17. Operating status indication The STATUS pin is set as an output pin and can be used to judge whether module is power-on. In customers design, this pin can be connected to a GPIO of DTE or be used to drive an LED in order to judge the modules operation status. A reference circuit is shown in Figure 48. Table 29: Pin definition of the STATUS Name STATUS Pin 16 Description Indicate module operating status M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Module STATUS 4.7K VBAT 300R 47K Figure 48: Reference design for STATUS M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 4. Antenna interface The Pin 63 is the RF antenna pad. The RF interface has an impedance of 50. Table 30: Pin definition of the RF_ANT Name GND GND RF_ANT GND GND GND Pin 61 62 63 64 65 66 Description Ground Ground RF antenna pad Ground Ground Ground 4.1. RF reference design The reference design for RF is shown as below. RF_ANT Module 0R NM NM Figure 49: Reference design for RF M50 provides an RF antenna pad for customers antenna connection. The RF trace in host PCB connected to the module RF antenna pad should be micro-strip line or other types of RF trace, whose characteristic impedance should be close to 50. M50 comes with grounding pads which are next to the antenna pad in order to give a better grounding. Besides, a type match circuit is suggested to be used to adjust the RF performance. To minimize the loss on the RF trace and RF cable, take design into account carefully. It is recommended that the insertion loss should meet the following requirements:
M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design GSM850/EGSM900 is <1dB. DCS1800/PCS1900 is <1.5dB. 4.2. RF output power Table 31: The module conducted RF output power Max 32.5dBm 1dB 32.5dBm 1dB 29.5dBm 1dB 29.5dBm 1dB Frequency GSM850 EGSM900 DCS1800 PCS1900 Note: In GSM850&EGSM900 GPRS 4 slots TX mode, the max output power is reduced by 2.5dB. This design conforms to the GSM specification as described in section 13.16 of 3GPP TS 51.010-1. Min 5dBm5dB 5dBm5dB 0dBm5dB 0dBm5dB 4.3. RF receiving sensitivity Table 32: The module conducted RF receiving sensitivity Frequency GSM850 EGSM900 DCS1800 PCS1900 Receive sensitivity
< -108.5dBm
< -108.5dBm
< -108.5dBm
< -108.5dBm 4.4. Operating frequencies Table 33: The module operating frequencies Frequency GSM850 EGSM900 DCS1800 PCS1900 Receive 869~894MHz 925~960MHz 1805~1880MHz 1930~1990MHz Transmit 824~849MHz 880~915MHz 1710~1785MHz 1850~1910MHz ARFCH 128~251 0~124, 975~1023 512~885 512~810 M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 4.5. RF cable soldering Soldering the RF cable to RF pad of module correctly will reduce the loss on the path of RF, please refer to the following example of RF soldering. Figure 50: RF soldering sample M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 5. Electrical, reliability and radio characteristics 5.1. Absolute maximum ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of module are listed in the following table:
Table 34: Absolute maximum ratings Parameter Min VBAT
-0.3 Peak current of power supply 0 RMS current of power supply (during one TDMA- frame) 0 Voltage at digital pins Voltage at analog pins Voltage at digital/analog pins in power down mode
-0.3
-0.3
-0.25 Max
+4.73 2 0.7 3.3 3.0 0.25 Unit V A A V V V 5.2. Operating temperature The operating temperature is listed in the following table:
Table 35: Operating temperature Parameter Normal Temperature Restricted Operation1) Storage Temperature Min
-35
-40 ~ -35
-45 Typ
+25 Unit Max
+80
+80 ~ +85
+90 1When the module works in this temperature range, the deviation from the GSM specification may occur. For example, the frequency error or the phase error will be increased. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 5.3. Power supply ratings Table 36: The module power supply ratings Parameter Description Conditions VBAT Supply voltage Voltage must stay within the min/max values, including voltage drop, ripple, and spikes. Vdrop during transmitting burst Voltage ripple Maximum power control level on GSM850 and GSM900. Maximum power control level on GSM850 and GSM900
@ f<200kHz
@ f>200kHz IVBAT Average supply current Power down mode SLEEP mode @ DRX=5 Minimum functionality mode AT+CFUN=0 IDLE mode SLEEP mode AT+CFUN=4 IDLE mode SLEEP mode IDLE mode GSM850/EGSM 900 DCS1800/PCS1900 TALK mode GSM850/EGSM 9001) DCS1800/PCS19002) DATA mode, GPRS (3 Rx,2Tx) GSM850/EGSM 9001) DCS1800/PCS19002) DATA mode, GPRS(2 Rx,3Tx) GSM850/EGSM 9001) DCS1800/PCS19002) DATA mode, GPRS (4 Rx,1Tx) GSM850/EGSM 9001) DCS1800/PCS19002) DATA mode, GPRS
(1Rx,4Tx) GSM850/EGSM 9001) Min Typ 3.3 4.0 Max Unit 4.6 V 30 1.3 13 0.98 13 1.0 13 13 209/208 191/202 435/400 313/337 605/558 399/460 265/240 200/212 615/560 400 mV 50 2 mV mV uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design DCS1800/PCS19002) Maximum power control level on GSM850 and GSM900. 420/470 1.6 1.8 Peak supply current
(during transmission slot) mA A 1) Power control level PCL 5 2) Power control level PCL 0 5.4. Current consumption The values of current consumption are shown as below. Table 37: The module current consumption Condition Voice Call GSM850 GSM900 DCS1800 PCS1900 Current Consumption
@power level #5 <300mA,Typical 209mA
@power level #12,Typical 96mA
@power level #19,Typical 73mA
@power level #5 <300mA,Typical 208mA
@power level #12,Typical 96mA
@power level #19,Typical 73mA
@power level #0 <250mA,Typical 191mA
@power level #7,Typical 93mA
@power level #15,Typical 70mA
@power level #0 <250mA,Typical 202mA
@power level #7,Typical 95mA
@power level #15,Typical 71mA GPRS Data DATA mode, GPRS ( 1 Rx,1 Tx ) CLASS 12 GSM850 EGSM 900 DCS 1800 PCS 1900
@power level #5 <350mA,Typical 199mA
@power level #12,Typical 87mA
@power level #19,Typical 63mA
@power level #5 <350mA,Typical 200mA
@power level #12,Typical 96mA
@power level #19,Typical 70mA
@power level #0 <300mA,Typical 184mA
@power level #7,Typical 82mA
@power level #15,Typical 66mA
@power level #0 <300mA,Typical 192mA
@power level #7,Typical 82mA
@power level #15,Typical 66mA M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design DATA mode, GPRS ( 3 Rx, 2 Tx ) CLASS 12 GSM850 DATA mode, GPRS ( 2 Rx, 3 Tx ) CLASS 12 GSM850 DATA mode, GPRS ( 4 Rx,1 Tx ) CLASS 12 GSM850 EGSM 900 DCS 1800 PCS 1900 EGSM 900 DCS 1800 PCS 1900 EGSM 900 DCS 1800 PCS 1900
@power level #5 <550mA,Typical 435mA
@power level #12,Typical 158mA
@power level #19,Typical 99mA
@power level #5 <550mA,Typical 400mA
@power level #12,Typical 150mA
@power level #19,Typical 97mA
@power level #0 <450mA,Typical 313mA
@power level #7,Typical 130mA
@power level #15,Typical 92mA
@power level #0 <450mA,Typical 337mA
@power level #7,Typical 140mA
@power level #15,Typical 94mA
@power level #5 <640mA,Typical 605mA
@power level #12,Typical 195mA
@power level #19,Typical 107mA
@power level #5 <600mA,Typical 558mA
@power level #12,Typical 185mA
@power level #19,Typical 106mA
@power level #0 <490mA,Typical 399mA
@power level #7,Typical 150mA
@power level #15,Typical 94mA
@power level #0 <480mA,Typical 460mA
@power level #7,Typical 166mA
@power level #15,Typical 98mA
@power level #5 <350mA,Typical 265mA
@power level #12,Typical 122mA
@power level #19,Typical 93mA
@power level #5 <350mA,Typical 240mA
@power level #12,Typical 115mA
@power level #19,Typical 90mA
@power level #0 <300mA,Typical 200mA
@power level #7,Typical 107mA
@power level #15,Typical 89mA
@power level #0 <300mA,Typical 212mA
@power level #7,Typical 118mA
@power level #15,Typical 90mA DATA mode, GPRS ( 1 Rx, 4 Tx ) CLASS 12 GSM850
@power level #5 <660mA,Typical 615mA
@power level #12,Typical 232mA
@power level #19,Typical 118mA M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design EGSM 900 DCS 1800 PCS 1900
@power level #5 <660mA,Typical 560mA
@power level #12,Typical 215mA
@power level #19,Typical 114mA
@power level #0 <530mA,Typical 420mA
@power level #7,Typical 173mA
@power level #15,Typical 97mA
@power level #0 <530mA,Typical 470mA
@power level #7,Typical 192mA
@power level #15,Typical 101mA Note: GPRS Class 12 is the default setting. The module can be configured from GPRS Class 1 to Class 12 by AT+QGPCLASS. Setting to lower GPRS class would make it easier to design the power supply for the module. 5.5. Electro-static discharge Although the GSM engine is generally protected against Electrostatic Discharge (ESD), ESD protection precautions should still be emphasized. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any applications using the module. The measured ESD values of module are shown in the following table. Table 38: The ESD endurance (Temperature:25 ,Humidity:45 %) Tested point VBAT,GND RF_ANT PWRKEY STATUS SIM_VDD, SIM_DATA SIM_CLK, SIM_RST TXD, RXD RTS, CTS, DTR Others Contact discharge 5KV 5KV 2KV 2KV 2KV 0.5KV Air discharge 10KV 10KV 4KV 4KV 4KV 1KV M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 6. Mechanical dimensions This chapter describes the mechanical dimensions of the module. 6.1. Mechanical dimensions of module Figure 51: M50 top and side dimensions M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Figure 52: M50 bottom dimensions M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 6.2. Recommended footprint without bottom centre pads frame line silkscreen Figure 53: Recommended footprint without bottom centre pads M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 6.4. Top view of the module Figure 54: Top view of the module M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 6.5. Bottom view of the module Figure 55: Bottom view of the module M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 7. Storage and manufacturing 7.1. Storage M50 is distributed in vacuum-sealed bag. The restriction of storage condition is shown as below. Shelf life in sealed bag: 12 months at <40/90% RH After this bag is opened, devices that will be subjected to reflow solder or other high temperature process must be:
Mounted within 72 hours at factory conditions of 30/60% RH Stored at <10% RH Devices require bake before mounting, if:
Humidity indicator card is >10% when read at 235 Mounted exceed 72 hours at factory conditions of 30 /60% RH If baking is required, devices may be baked for 48 hours at 1255 Note: As plastic container cannot be subjected to high temperature, devices must be removed prior to high temperature (125) bake. If shorter bake times are desired, refer to the IPC/JEDECJ-STD-033 for bake procedure. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 7.2. Soldering The squeegee should push the paste on the surface of the stencil that makes the paste fill the stencil openings and penetrate to the PCB. The force on the squeegee should be adjusted so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil at the hole of the module pads should be 0.2mm for M50 . Figure 56: Paste application Suggest peak reflow temperature is from 235 to 245 (for SnAg3.0Cu0.5 alloy). Absolute max reflow temperature is 260. To avoid damage to the module when it was repeatedly heated, it is suggested that the module should be mounted after the first panel has been reflowed. The following picture is the actual diagram which we have operated. M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design 250 217 200 150 100 50 0 Preheat Heating Cooling Liquids Temperature 200 40s~60s 160 70s~120s Between 1~3/S 50 100 150 200 Time(s) 250 300 s Figure 57: Ramp-Soak-Spike reflow profile 7.3. Packaging M50 modules are distributed in trays of 20 pieces each. This is especially suitable for the M50 according to SMT processes requirements. The trays are stored inside a vacuum-sealed bag which is ESD protected. It should not be opened until the devices are ready to be soldered onto the application. Figure 58: Module tray M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Appendix A: GPRS coding schemes Four coding schemes are used in GPRS protocol. The differences between them are shown in Table 39. Table 39: Description of different coding schemes Scheme Code rate USF Pre-coded USF CS-1 CS-2 CS-3 CS-4 1/2 2/3 3/4 1 3 3 3 3 3 6 6 12 Radio Block excl.USF and BCS 181 268 312 428 BCS Tail Coded bits Punctured bits 40 16 16 16 4 4 4
-
456 588 676 456 0 132 220
-
Data rate Kb/s 9.05 13.4 15.6 21.4 USF Radio Block Radio block structure of CS-1, CS-2 and CS-3 is shown as Figure 60:
Rate 1/2 convolutional coding Puncturing 456 bits BCS Figure 59: Radio block structure of CS-1, CS-2 and CS-3 Radio block structure of CS-4 is shown as Figure 61:
USF Block code 456 bits Radio Block No coding BCS Figure 60: Radio block structure of CS-4 M50_HD_V2.0
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Quecctel Confidential M50 Hardware Design Appendix B: GPRS multi-slot classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependant, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in Table 40. Table 40: GPRS multi-slot classes Multislot class Downlink slots Uplink slots Active slots 1 2 3 4 5 6 7 8 9 10 11 12 1 2 2 3 2 3 3 4 3 4 4 4 1 1 2 1 2 2 3 1 2 2 3 4 2 3 3 4 4 4 4 5 5 5 5 5 M50_HD_V2.0
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Quecctel Confidential Shanghai Quectel Wireless Solutions Co., Ltd. Room 501, Building 13, No.99 Tianzhou Road, Shanghai, China 200233 Tel: +86 21 5108 6236 Mail: info@quectel.com Quecctel Confidential
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2016-01-18 | 1850.2 ~ 1909.8 | PCB - PCS Licensed Transmitter | Class II permissive change or modification of presently authorized equipment |
2 | 2012-12-12 | 1850.2 ~ 1909.8 | PCB - PCS Licensed Transmitter | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 2 | Effective |
2016-01-18
|
||||
1 2 |
2012-12-12
|
|||||
1 2 | Applicant's complete, legal business name |
Quectel Wireless Solutions Company Limited
|
||||
1 2 | FCC Registration Number (FRN) |
0018988279
|
||||
1 2 | Physical Address |
Building 5, Shanghai Business Park PhaseIII
|
||||
1 2 |
Shanghai, N/A 200233
|
|||||
1 2 |
China
|
|||||
app s | TCB Information | |||||
1 2 | TCB Application Email Address |
T******@siemic.com
|
||||
1 2 |
t******@siemic.com
|
|||||
1 2 | TCB Scope |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
||||
app s | FCC ID | |||||
1 2 | Grantee Code |
XMR
|
||||
1 2 | Equipment Product Code |
201211M50
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 2 | Name |
J******** x******
|
||||
1 2 | Telephone Number |
+8602******** Extension:
|
||||
1 2 | Fax Number |
+8621********
|
||||
1 2 |
j******@quectel.com
|
|||||
app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 2 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
1 2 | Yes | |||||
1 2 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 2 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 2 | Equipment Class | PCB - PCS Licensed Transmitter | ||||
1 2 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | GSM/GPRS Module | ||||
1 2 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 2 | Modular Equipment Type | Single Modular Approval | ||||
1 2 | Purpose / Application is for | Class II permissive change or modification of presently authorized equipment | ||||
1 2 | Original Equipment | |||||
1 2 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 2 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 2 | Grant Comments | C2PC for adding max allowed antenna gain. Single Modular approval for fixed and mobile host platform. Power listed is the conducted output power. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. OEM integrators must be provided with antenna installation instructions. OEM integrators and End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. Maximum antenna gain allowed for use with this device is 4.95dBi (850MHz ) , 2.50dBi (1900MHz) | ||||
1 2 | Limited Single Modular Approval. Power output shown is conducted at the antenna terminal. This device is to be used only for mobile and fixed application with using the specific antenna as shown within this application. The antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC muti-transmitter product procedures. | |||||
1 2 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 2 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 2 | Firm Name |
SIEMIC (Shenzhen-China) Laboratories
|
||||
1 2 |
SIEMIC (Nanjing-China) Laboratories
|
|||||
1 2 | Name |
L**** B****
|
||||
1 2 | Telephone Number |
86-07******** Extension:
|
||||
1 2 |
86-25********
|
|||||
1 2 | Fax Number |
86075********
|
||||
1 2 |
86-25********
|
|||||
1 2 |
l******@siemic.com
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 22H | 824.2 | 848.8 | 1.5276 | 0.0359 ppm | 245KGXW | ||||||||||||||||||||||||||||||||||
1 | 2 | 24E | 1850.2 | 1909.8 | 0.8453 | 0.0084 ppm | 250KGXW | ||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
2 | 1 | 22H | 824.2 | 848.8 | 0.9862 | 0.0359 ppm | 245KGXW | ||||||||||||||||||||||||||||||||||
2 | 2 | 24E | 1850.2 | 1909.8 | 0.5395 | 0.0084 ppm | 250KGXW |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC