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1 2 | Operational Description | Operational Description | January 31 2019 | confidential | ||||
1 2 | Parts list | Parts List/Tune Up Info | January 31 2019 | confidential | ||||
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1 2 | Schematics | Schematics | January 31 2019 | confidential | ||||
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1 2 | User manual | Users Manual | 1.92 MiB |
EM12-G Hardware Design LTE-A Module Series Rev. EM12_Hardware_Design_ Date: 2018-09-28 Status: Preliminary www.quectel.com LTE-A Module Series EM12-G Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd. 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:
http://quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit:
http://quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2018. All rights reserved. EM12-G_Hardware_Design 1 / 62 LTE-A Module Series EM12-G Hardware Design About the Document History Revision Date Author Description Draft 2018-09-28 Oscar LIU/
Reed Wang Initial EM12-G_Hardware_Design 2 / 62 LTE-A Module Series EM12-G Hardware Design Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Table Index ................................................................................................................................................... 5 Figure Index ................................................................................................................................................. 6 1 Introduction .......................................................................................................................................... 7 1.1. Safety Information ..................................................................................................................... 10 2 Product Concept ................................................................................................................................ 11 2.1. General Description .................................................................................................................. 11 2.2. Key Features ............................................................................................................................. 13 2.3. Functional Diagram ................................................................................................................... 15 2.4. Evaluation Board ....................................................................................................................... 15 3.4.2. 3.4.1. 3.4.1.1. 3.4.1.2. 3 Application Interfaces ....................................................................................................................... 16 3.1. Pin Assignment ......................................................................................................................... 17 3.2. Pin Description .......................................................................................................................... 18 3.3. Power Supply ............................................................................................................................ 22 3.3.1. Decrease Voltage Drop .................................................................................................. 22 3.3.2. Reference Design for Power Supply .............................................................................. 23 3.4. Turn on and off Scenarios ......................................................................................................... 24 Turn on the Module ........................................................................................................ 24 Turn on the Module Through GPIO Controlled FULL_CARD_POWER_OFF# . 25 Turn on the Module Automatically ....................................................................... 25 Turn off the Module ........................................................................................................ 26 Turn off the Module Through FULL_CARD_POWER_OFF# ............................. 26 Turn off the Module via AT Command ................................................................. 27 3.5. Reset the Module ...................................................................................................................... 27 3.6.
(U)SIM Interfaces ...................................................................................................................... 28 3.7. USB Interface ............................................................................................................................ 32 3.8. PCIE Interface ........................................................................................................................... 34 3.9. PCM and I2C Interfaces ............................................................................................................ 34 3.10. Control and Indicator Signals .................................................................................................... 36 3.10.1. W_DISABLE1# Signal.................................................................................................... 37 3.10.2. WWAN_LED# Signal ..................................................................................................... 38 3.10.3. WAKE_ON_WAN# Signal .............................................................................................. 38 3.10.4. DPR Signal ..................................................................................................................... 39 3.11. Tunable Antenna Control Interface* .......................................................................................... 40 3.12. Configuration Pins ..................................................................................................................... 40 3.4.2.1. 3.4.2.2. 4 GNSS Receiver ................................................................................................................................... 42 4.1. General Description .................................................................................................................. 42 EM12-G_Hardware_Design 3 / 62 LTE-A Module Series EM12-G Hardware Design 5 Antenna Interfaces ............................................................................................................................. 43 5.1. Main/Rx-diversity Antenna Interfaces ....................................................................................... 43 5.1.1. Operating Frequency ..................................................................................................... 44 5.2. GNSS Antenna Interface ........................................................................................................... 45 5.3. Antenna Installation .................................................................................................................. 46 5.3.1. Antenna Requirements .................................................................................................. 46 5.3.2. Recommended RF Connector for Antenna Installation ................................................. 46 6 Electrical, Reliability and Radio Characteristics ............................................................................ 50 6.1. Absolute Maximum Ratings ...................................................................................................... 50 6.2. Power Supply Requirements .................................................................................................... 50 6.3. I/O Requirements ...................................................................................................................... 51 6.4. Operation and Storage Temperatures ...................................................................................... 51 6.5. Current Consumption(TBD) ...................................................................................................... 52 6.6. RF Output Power ...................................................................................................................... 52 6.7. RF Receiving Sensitivity ........................................................................................................... 52 6.8. ESD Characteristics .................................................................................................................. 54 6.9. Thermal Dissipation .................................................................................................................. 54 7 Mechanical Dimensions and Packaging ......................................................................................... 56 7.1. Mechanical Dimensions of the Module ..................................................................................... 56 7.2. Standard Dimensions of M.2 PCI Express ............................................................................... 57 7.3. Design Effect Drawings of the Module ...................................................................................... 58 7.4. M.2 Connector ........................................................................................................................... 58 7.5. Barcode Rule ............................................................................................................................ 58 7.6. Packaging ................................................................................................................................. 59 8 Appendix References ........................................................................................................................ 61 1 EM12-G_Hardware_Design 4 / 62 LTE-A Module Series EM12-G Hardware Design Table Index TABLE 1: FREQUENCY BANDS AND GNSS TYPE OF EM12 MODULE ........................................................ 11 TABLE 2: KEY FEATURES OF EM12 ............................................................................................................... 13 TABLE 3: DEFINITION OF I/O PARAMETERS ................................................................................................. 18 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 18 TABLE 5: DEFINITION OF VCC AND GND PINS............................................................................................. 22 TABLE 6: DEFINITION OF FULL_CARD_POWER_OFF# PIN ........................................................................ 24 TABLE 7: RESET# PIN DEFINITION ................................................................................................................ 27 TABLE 8: PIN DEFINITION OF (U)SIM INTERFACES ..................................................................................... 29 TABLE 9: PIN DEFINITION OF USB INTERFACE ........................................................................................... 32 TABLE 10: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 35 TABLE 11: LIST OF CONTROL AND INDICATOR SIGNALS ........................................................................... 37 TABLE 12: RF FUNCTION STATUS ................................................................................................................. 37 TABLE 13: NETWORK STATUS INDICATIONS OF WWAN_LED# SIGNAL ................................................... 38 TABLE 14: STATE OF THE WAKE_ON_WAN# SIGNAL .................................................................................. 38 TABLE 15: FUNCTION OF THE DPR SIGNAL ................................................................................................. 39 TABLE 16: PIN DEFINITION OF TUNABLE ANTENNA CONTROL INTERFACE* .......................................... 40 TABLE 17: PIN DEFINITION OF CONFIGURATION PINS .............................................................................. 40 TABLE 18: LIST OF CONFIGURATION PINS .................................................................................................. 41 TABLE 19: EM12 OPERATING FREQUENCIES .............................................................................................. 44 TABLE 20: GNSS FREQUENCY ....................................................................................................................... 45 TABLE 21: ANTENNA REQUIREMENTS .......................................................................................................... 46 TABLE 22: MAJOR SPECIFICATIONS OF THE RF CONNECTOR ................................................................. 47 TABLE 23: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 50 TABLE 24: POWER SUPPLY REQUIREMENTS .............................................................................................. 50 TABLE 25: I/O REQUIREMENTS ...................................................................................................................... 51 TABLE 26: OPERATION AND STORAGE TEMPERATURES .......................................................................... 51 TABLE 27: RF OUTPUT POWER ..................................................................................................................... 52 TABLE 28: EM12 CONDUCTED RF RECEIVING SENSITIVITY ..................................................................... 52 TABLE 29: ELECTROSTATIC DISCHARGE CHARACTERISTICS (TEMPERATURE: 25C, HUMIDITY: 40%)
................................................................................................................................................................... 54 TABLE 30: RELATED DOCUMENTS ................................................................................................................ 61 TABLE 31: TERMS AND ABBREVIATIONS ...................................................................................................... 61 EM12-G_Hardware_Design 5 / 62 LTE-A Module Series EM12-G Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 15 FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 17 FIGURE 3: POWER SUPPLY LIMITS DURING RADIO TRANSMISSION ....................................................... 23 FIGURE 4: REFERENCE CIRCUIT OF VCC .................................................................................................... 23 FIGURE 5: REFERENCE DESIGN OF POWER SUPPLY ............................................................................... 24 FIGURE 6: TURN ON THE MODULE THROUGH GPIO CONTROLLED FULL_CARD_POWER_OFF# ....... 25 FIGURE 7: TURN ON THE MODULE AUTOMATICALLY ................................................................................. 25 FIGURE 8: TIMING OF TURNING ON MODULE ............................................................................................. 26 FIGURE 9: TIMING OF TURNING OFF THE MODULE THROUGH FULL_CARD_POWER_OFF# ............... 26 FIGURE 10: REFERENCE CIRCUIT OF RESET# BY USING DRIVING CIRCUIT ......................................... 27 FIGURE 11: REFERENCE CIRCUIT OF RESET# BY USING BUTTON ......................................................... 28 FIGURE 12: TIMING OF RESETTING MODULE ............................................................................................. 28 FIGURE 13: REFERENCE CIRCUIT OF NORMALLY SHORT-CIRCUITED (U)SIM CARD CONNECTOR ... 30 FIGURE 14: REFERENCE CIRCUIT OF NORMALLY OPEN (U)SIM CARD CONNECTOR .......................... 30 FIGURE 15: REFERENCE CIRCUIT OF A 6-PIN (U)SIM CARD CONNECTOR ............................................. 31 FIGURE 16: REFERENCE CIRCUIT OF USB 2.0 & 3.0 INTERFACE ............................................................. 33 FIGURE 17: PRIMARY MODE TIMING ............................................................................................................ 35 FIGURE 18: AUXILIARY MODE TIMING .......................................................................................................... 35 FIGURE 19: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 36 FIGURE 20: WWAN_LED# SIGNAL REFERENCE CIRCUIT DIAGRAM ........................................................ 38 FIGURE 21: WAKE_ON_WAN# BEHAVIOR .................................................................................................... 39 FIGURE 22: WAKE_ON_WAN# SIGNAL REFERENCE CIRCUIT DESIGN .................................................... 39 FIGURE 23: ANTENNA INTERFACES ON THE MODULE .............................................................................. 43 FIGURE 24: EM12 RF CONNECTOR DIMENSIONS (UNIT: MM) ................................................................... 47 FIGURE 25: SPECIFICATIONS OF MATING PLUGS USING 0.81MM COAXIAL CABLES ......................... 48 FIGURE 26: CONNECTION BETWEEN RF CONNECTOR AND MATING PLUG USING 0.81MM COAXIAL CABLE ....................................................................................................................................................... 48 FIGURE 27: CONNECTION BETWEEN RF CONNECTOR AND MATING PLUG USING 1.13MM COAXIAL CABLE ....................................................................................................................................................... 49 FIGURE 28: THERMAL DISSIPATION AREA ON BOTTOM SIDE OF MODULE (TOP VIEW) ....................... 55 FIGURE 29: MECHANICAL DIMENSIONS OF EM12 (UNIT: MM) ................................................................... 56 FIGURE 30: STANDARD DIMENSIONS OF M.2 TYPE 3042-S3 (UNIT: MM) ................................................. 57 FIGURE 31: M.2 NOMENCLATURE ................................................................................................................. 57 FIGURE 32: TOP VIEW OF THE MODULE ...................................................................................................... 58 FIGURE 33: TRAY SIZE .................................................................................................................................... 59 FIGURE 34: TRAY PACKAGING PROCEDURE .............................................................................................. 60 EM12-G_Hardware_Design 6 / 62 LTE-A Module Series EM12-G Hardware Design 1 Introduction This document defines EM12 module and describes its air interface and hardware interfaces which are connected with customers applications. This document can help customers to quickly understand the interface specifications, electrical and mechanical details, as well as other related information of EM12 module. To facilitate its application in different fields, reference design is also provided for customers reference. Associated with application note and user guide, customers can use the module to design and set up mobile applications easily. The device could be used with a separation distance of 20cm to the human body. Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [EM12-G] is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address:
http://www.quectel.com FCC Regulations:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. This device has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiated radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is EM12-G_Hardware_Design 7 / 62 LTE-A Module Series EM12-G Hardware Design encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. Caution: Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. RF Exposure Information This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. ISED Notice This device complies with Innovation, Science and Economic Development Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR Innovation, Sciences et Dveloppement conomique Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en This device complies with the Canadian ICES-003 Class B specifications. CAN ICES-3(B)/ NMB-3(B) ISED Radiation Exposure Statement This device complies with RSS-102 radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the ISED radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. Cet appareil est conforme aux limites d'exposition aux rayonnements de la CNR-102 dfinies pour un environnement non contrl. Afin d'viter la possibilit de dpasser les limites d'exposition aux EM12-G_Hardware_Design 8 / 62 LTE-A Module Series EM12-G Hardware Design frquences radio de la CNR-102, la proximit humaine l'antenne ne doit pas tre infrieure 20 cm
(8 pouces) pendant le fonctionnement normal. IMPORTANT NOTE:
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled environment can be satisfied. Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains Transmitter Module FCC ID: XMR201901EM12G ". If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host device; otherwise, the host device must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the words Contains transmitter module IC: 10224A-201901EM12G EM12-G_Hardware_Design 9 / 62 LTE-A Module Series EM12-G Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating EM12-G module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. EM12-G_Hardware_Design 10 / 62 LTE-A Module Series EM12-G Hardware Design 2 Product Concept 2.1. General Description EM12-G is a LTE/UMTS/HSPA+ wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks with standard PCI Express M.2 interface. EM12-G supports embedded operating systems such as Windows CE, Linux and Android, and also provides GNSS1) and voice functionality2) to meet customers specific application demands. The following table shows the frequency bands and GNSS type of EM12-G module. Table 1: Frequency Bands and GNSS Type of EM12-G Module Mode LTE-FDD
(with Rx-diversity) LTE-TDD
(with Rx-diversity) DL 2CA EM12-G B1/B2/B3/B4/B5/B7/B8/B9/B12/B13/B14/B17/B18/B19/B20/B213)/B25/B26/
B28/B29/B30/B32/B66;
B38/39/B40/B41 B1+3,5,18,19,20,26;
B2+2,4,5,12,13,17,29,30,66;
B3+3,5,7,8,19,20,28;
B4+4(CA_4C only),5,12,13,17,29,30;
B5+7,25,30,66;
B7+7,20,28;
B12+25,30;
B13+66;
B19+213);
B20+B32;
B25+25,26,41 B29+30;
B38+38;
B39+39 (CA_39C only);
B39+39; B39+41 EM12-G_Hardware_Design 11 / 62 LTE-A Module Series EM12-G Hardware Design B40+40 (CA_40C only);
B41+41;
B66+66 (CA_66C only);12,29,30,5;
B2+B14;B14+B30;B14+B66;
(Note: B29, B32 is only for secondary component carrier) DL inter-band 3CA:
1+3+7, 1+3+19, 1+3+20, 1+3+5, 1+3+8, 1+3+28,1+7+20,1+3+5, 2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30 , 3+7+20, 3+7+28 , 3+7+8, 4+5+30, 4+12+30, 4+29+30 , 5+66+2, 13+66+2, 66+12+30,66+29+30,66+5+30;
B2+B14+B66;
DL 2 intra-band plus inter-band 3CA:
DL 3CA 2+2+5, 2+2+13 , 3+3+7, 3+7+7, 3+3+20 , 3+3+28,3+3+1, 4+4+5, 4+4+13, 7+7+28, 5+66+66, 13+66+66, 66+66+2, B39+B39+B41; B39+B41+B41;
B14+B66+B66 B25+B25+B26, B25+B41+B41 DL 3 intra-band 3CA:
40+40+40, 41+41+41, 66+66+66 B3C;B7C;B38C;B40C;B41C;
B1/B2/B3/B4/B5/B8/B9/B19 UL CA WCDMA
(with Rx-diversity) GNSS 1) GPS, GLONASS, BeiDou, Galileo NOTES 1. 1) GNSS function is optional. 2. 2) EM12-G contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. 3. 3)B21 band follow up will be developed EM12-G can be applied in the following fields:
Rugged Tablet PC and Laptop Computer Remote Monitor System Vehicle System EM12-G_Hardware_Design 12 / 62 LTE-A Module Series EM12-G Hardware Design Wireless POS System Smart Metering System Wireless Router and Switch Other Wireless Terminal Devices 2.2. Key Features The following table describes the detailed features of EM12-G. Table 2: Key Features of EM12-G Feature Details Function Interface PCI Express M.2 Interface Power Supply Supply voltage: 3.135V~4.4V Typical supply voltage: 3.7V Transmitting Power Class 3 (23dBm2dB) for LTE-TDD bands Class 3 (23dBm2dB) for LTE-FDD bands Class 3 (24dBm+1/-3dB) for WCDMA Support up to LTE Cat 12 Support 1.4MHz to 20MHz RF bandwidth LTE Features Support MIMO in DL direction FDD: Max 600Mbps (DL)/150Mbps (UL) TDD: Max 408Mbps (DL)/90Mbps (UL) Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation UMTS Features DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL) Support PPP/QMI/NTP*/TCP*/UDP*/FTP*/HTTP*/PING*/HTTPS*/SMTP*
/MMS*/FTPS*/SMTPS*/SSL* protocols Internet Protocol Features Support the protocols PAP (Password Authentication Protocol) and CHAP
(Challenge Handshake Authentication Protocol) usually used for PPP SMS connections Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default Support (U)SIM card: 1.8V, 3.0V
(U)SIM Interfaces Include USIM1 and USIM2 interfaces Support Dual SIM Single Standby*
EM12-G_Hardware_Design 13 / 62 LTE-A Module Series EM12-G Hardware Design Support one digital audio interface: PCM interface Audio Feature WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Used for audio function with external codec Support 16-bit linear data format PCM Interface Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization Compliant with USB 3.0 and 2.0 specifications, with maximum transmission rates up to 5Gbps on USB 3.0 and 480Mbps on USB 2.0. Used for AT command communication, data transmission, firmware USB Interface upgrade, software debugging, GNSS NMEA sentence output and voice over USB*
Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE 5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x PCIE Interface*
Support PCIE interface, under development Antenna Interface Include main antenna, diversity antenna and GNSS antenna interfaces Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Gen 9HT Lite of Qualcomm Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Physical Characteristics Temperature Range Size: (42.00.15)mm (30.00.15)mm (2.30.1)mm Weight: TBD Operation temperature range: -30C~ +70C 1) Extended temperature range: -40C~ +85C 2) Storage temperature range: -40C ~ +90C Firmware Upgrade USB 2.0 interface and DFOTA*
All hardware components are fully compliant with EU RoHS directive RoHS NOTES 1. 2. 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operating temperature levels, the module will meet 3GPP specifications again. 3.
* means under development. EM12-G_Hardware_Design 14 / 62 LTE-A Module Series EM12-G Hardware Design 2.3. Functional Diagram The following figure shows a block diagram of EM12-G. Figure 1: Functional Diagram 2.4. Evaluation Board In order to help customers develop applications conveniently with EM12-G, Quectel supplies the evaluation board (M.2 EVB), USB to RS-232 converter cable, USB type-C cable, earphone, antenna and other peripherals to control or test the module. For more details, please refer to document [1]. EM12-G_Hardware_Design 15 / 62 BasebandPMICTransceiverANT_MAINANT_GNSSETVCCRESET#38.4MHzXOControlQLINKControlTxPRxDRxPCI Express M.2 Key-B InterfaceFULL_CARD_POWER_OFF#W_DISABLE1#USB2.0&USB3.0(U)SIM1&(U)SIM2WWAN_LED#WAKE_ON_WAN#NAND +DDR2 SDRAMPCMW_DISABLE2#GPIOsTx/Rx BlocksANT_DIVPCIE* LTE-A Module Series EM12-G Hardware Design 3 Application Interfaces The physical connections and signal levels of EM12-G comply with PCI Express M.2 specifications. This chapter mainly describes the definition and application of the following interfaces/signals/pins of EM12-G:
Power supply
(U)SIM interfaces USB interface PCIE interface*
PCM and I2C interfaces Control and indicator signals Tunable antenna control interface*
Configuration pins NOTE
* means under development. EM12-G_Hardware_Design 16 / 62 LTE-A Module Series EM12-G Hardware Design 3.1. Pin Assignment The following figure shows the pin assignment of EM12-G. The top side contains EM12-G module and antenna connectors. Figure 2: Pin Assignment EM12-G_Hardware_Design 17 / 62 PIN2PIN74BOTPIN1PIN75TOPPin NameNo.CONFIG_275GND73GND71CONFIG_169RESET#67ANTCTL365ANTCTL263ANTCTL161ANTCTL059GND57PCIE_REFCLK+55PCIE_REFCLK-53GND51PCIE_RX+49PCIE_RX-47GND45PCIE_TX+43PCIE_TX-41GND39USB3.0_RX+37USB3.0_RX-35GND33USB3.0_TX+31USB3.0_TX-29GND27DPR25WAKE_ON_WAN#23CONFIG_021NotchNotchNotchNotchGND11USB_DM9USB_DP7GND5GND3CONFIG_31No.Pin Name74VCC72VCC70VCC68NC66USIM1_DET64RESERVED62RESERVED60RESERVED58I2C_SCL56I2C_SDA54NC52NC50NC48USIM2_VDD46USIM2_RESET44USIM2_CLK42USIM2_DATA40USIM2_DET38NC36USIM1_VDD34USIM1_DATA32USIM1_CLK30USIM1_RESET28PCM_SYNC26W_DISABLE2#24PCM_OUT22PCM_IN20PCM_CLKNotchNotchNotchNotch10WWAN_LED#8W_DISABLE1#6FULL_CARD_POWER_OFF#4VCC2VCCPIN11PIN10 LTE-A Module Series EM12-G Hardware Design 3.2. Pin Description The following tables show the pin definition and description of EM12-G on the 75-pin application. Table 3: Definition of I/O Parameters Type IO DI DO OD PI PO Description Bidirectional Digital input Digital output Open drain Power input Power output Table 4: Pin Description Pin No. M.2 Socket 2 WWAN Module Pinout EM12-G Pin Name I/O Description Comment 1 CONFIG_3 CONFIG_3 EM12-G is configured as Not connected internally. WWAN-USB 3.0. 2 3 4 5 6 3.3V VCC PI Power supply Vmin=3.135V Vnorm=3.7V Vmax=4.4V GND GND Ground 3.3V VCC PI Power supply Vmin=3.135V Vnorm=3.7V Vmax=4.4V GND GND Ground FULL_CARD_ FULL_CARD_ POWER_OFF#
POWER_OFF#
A signal to control power-on/-off of the module. When it is at low DI level, the module powers off. When it is at high level, the module powers on. Pulled down internally EM12-G_Hardware_Design 18 / 62 LTE-A Module Series EM12-G Hardware Design 7 8 9 USB_D+
USB_DP IO USB 2.0 differential data bus (+) W_DISABLE1#
W_DISABLE1#
DI Airplane mode control. 1.8V/3.3V Active low. power domain USB_D-
USB_DM IO USB 2.0 differential data bus (-) 10 GPIO_9 WWAN_LED#
OD It allows the module to provide It is an open collector and active low signal. RF status indication via LED devices provided by the system. 3.3V power domain 11 GND 12 Key 13 Key 14 Key 15 Key 16 Key 17 Key 18 Key 19 Key GND Notch Notch Notch Notch Notch Notch Notch Notch Ground Notch Notch Notch Notch Notch Notch Notch Notch 20 GPIO_5
(AUDIO_0) PCM_CLK IO PCM data bit clock. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. Connected to GND internally. 1.8V power domain 21 CONFIG_0 CONFIG_0 EM12-G is configured as WWAN-USB 3.0. 22 23 24 GPIO_6
(AUDIO_1) PCM_IN DI PCM data input GPIO_11
(WOWWAN#) WAKE_ON_ WAN#
OD A signal to wake up the host. It is an open collector and active low signal. GPIO_7
(AUDIO_2) PCM_OUT DO PCM data output 25 DPR DPR DI 26 GPIO_10
(W_DISABLE2#) W_DISABLE2#* DI Dynamic power reduction. High level by default. GNSS enable control. Active low. 1.8V power domain 1.8V power domain 1.8V power domain 1.8V power domain 1.8V/3.3V power domain 27 GND GND Ground 28 GPIO_8 PCM_SYNC IO PCM data frame synchronization 1.8V power EM12-G_Hardware_Design 19 / 62 LTE-A Module Series EM12-G Hardware Design
(AUDIO_3) signal domain 29 USB3.0-TX-
USB3.0_TX-
DO USB 3.0 transmit data (-) 30 UIM-RESET USIM1_RESET DO
(U)SIM1 card reset 1.8V/3.0V power domain 31 USB3.0-TX+
USB3.0_TX+
DO USB 3.0 transmit data (+) 32 UIM-CLK USIM1_CLK DO
(U)SIM1 card clock 1.8V/3.0V power domain 33 GND GND Ground 34 UIM-DATA USIM1_DATA IO
(U)SIM1 card data Pulled up to USIM2_VDD internally 35 USB3.0-RX-
USB3.0_RX-
DI USB 3.0 receive data (-) 36 UIM-PWR USIM1_VDD PO Power supply for (U)SIM1 card 37 USB3.0-RX+
USB3.0_RX+
DI USB 3.0 receive data (+) 38 N/C 39 GND 40 GPIO_0
(SIM_DET2) NC GND NC Ground USIM2_DET DI
(U)SIM2 card insertion detection 1.8V/3.0V power domain Pulled up internally 41 PETn0 PCIE_TX-
DO PCIE transmit data (-) 42 GPIO_1
(SIM_DAT2) USIM2_DATA IO
(U)SIM2 card data Pulled up to USIM2_VDD internally 43 PETp0 PCIE_TX+
DO PCIE transmit data (+) 44 GPIO_2
(SIM_CLK2) USIM2_CLK DO
(U)SIM2 card clock 1.8V/3.0V power domain 45 GND GND Ground 46 GPIO_3
(SIM_RST2) USIM2_RESET DO
(U)SIM2 card reset 1.8V/3.0V power domain 47 PERn0 PCIE_RX-
DI PCIE receive data (-) 48 GPIO_4
(SIM_PWR2) USIM2_VDD PO Power supply for (U)SIM2 card 1.8V/3.0V power domain 49 PERp0 PCIE_RX+
DI PCIE receive data (+) 50 PRRST#
PCIE_RST_N DI PCIE reset. Active low. 3.3V power domain EM12-G_Hardware_Design 20 / 62 LTE-A Module Series EM12-G Hardware Design 51 GND GND Ground 52 CLKREQ#
PCIE_CLKREQ_ N IO PCIE clock request. Active low. 3.3V power domain 53 REFCLKn PCIE_REFCLK- AI PCIE reference clock(-) 54 PEWAKE#
PCIE_WAKE_N IO PCIE wake on host. Active low. 3.3V power domain 55 REFCLKp PCIE_REFCLK+ AI PCIE reference clock(+) 56 N/C I2C_DATA IO I2C serial data. Used for external codec. 57 GND GND Ground 58 N/C I2C_CLK DO I2C serial clock. Used for external codec. 59 ANTCTL0 ANTCTL0*
DO Tunable antenna control. 1.8V power domain 60 COEX3 RESERVED Reserved 61 ANTCTL1 ANTCTL1*
DO Tunable antenna control. 1.8V power domain 62 COEX2 RESERVED Reserved 63 ANTCTL2 ANTCTL2*
DO Tunable antenna control. 1.8V power domain 64 COEX1 RESERVED Reserved 65 ANTCTL3 ANTCTL3*
DO Tunable antenna control. 66 SIM_DETECT USIM1_DET DI
(U)SIM1 card insertion detection 67 RESET#
RESET#
DI System reset. Active low. 68 SUSCLK (32kHz) NC 69 CONFIG_1 CONFIG_1 NC Connected to GND internally. EM12-G is configured as WWAN-USB 3.0. 70 3.3V VCC PI Power supply 1.8V power domain Pulled up internally Vmin=3.135V Vnorm=3.7V Vmax=4.4V 71 GND GND Ground 72 3.3V VCC PI Power supply Vmin=3.135V Vnorm=3.7V Vmax=4.4V EM12-G_Hardware_Design 21 / 62 LTE-A Module Series EM12-G Hardware Design 73 GND GND Ground 74 3.3V VCC PI Power supply Vmin=3.135V Vnorm=3.7V Vmax=4.4V 75 CONFIG_2 CONFIG_2 EM12-G is configured as Not connected internally. WWAN-USB 3.0. NOTES 1. Keep all NC, reserved and unused pins unconnected. 2.
* means under development. 3.3. Power Supply The following table shows pin definition of VCC pins and ground pins. Table 5: Definition of VCC and GND Pins Pin No. Pin Name I/O Power Domain Description 2, 4, 70, 72, 74 VCC PI 3.135V~4.4V 3.7V typical DC supply 3, 5, 11, 27, 33, 39, 45, 51, 57, 71, GND Ground 73 3.3.1. Decrease Voltage Drop The power supply range of the module is from 3.135V to 4.4V. Please make sure that the input voltage will never drop below 3.135V, otherwise the module will be powered off automatically. The following figure shows the maximum voltage drop during radio transmission in 3G and 4G networks. EM12-G_Hardware_Design 22 / 62 VCCMax Tx powerMin.3.135VRippleDropMax Tx power LTE-A Module Series EM12-G Hardware Design Figure 3: Power Supply Limits during Radio Transmission To decrease voltage drop, a bypass capacitor of about 220F with low ESR (ESR=0.7) should be used, and a multi-layer ceramic chip capacitor (MLCC) array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and place these capacitors close to VCC pins. The main power supply from an external application has to be a single voltage source. The width of VCC trace should be no less than 2mm. In principle, the longer the VCC trace is, the wider it will be. In addition, in order to get a stable power source, it is recommended to use a zener diode with reverse zener voltage of 5.1V and dissipation power more than 0.5W. The following figure shows a reference circuit of VCC. Figure 4: Reference Circuit of VCC 3.3.2. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply is capable of providing sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output
(VCC), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5V input power source. The typical output of the power supply is about 3.7V and the maximum load current is 3A. EM12-G_Hardware_Design 23 / 62 ModuleVCCVCCC1220uF+D15.1VC21uFC3100nFC433pFC510pF LTE-A Module Series EM12-G Hardware Design Figure 5: Reference Design of Power Supply NOTE In order to avoid damages to the internal flash, please do not switch off the power supply directly when the module is working. It is suggested that the power supply can be cut off after pulling down FULL_CARD_POWER_OFF# for about 100ms. 3.4. Turn on and off Scenarios 3.4.1. Turn on the Module Driving the FULL_CARD_POWER_OFF# pin to a high level will power on the module. The following table shows the definition of FULL_CARD_POWER_OFF#. Table 6: Definition of FULL_CARD_POWER_OFF# Pin Pin Name Pin No. Description DC Characteristics Comment A signal to control power-on/-off FULL_CARD of the module. When it is at low VIHmax=4.4V _POWER_ 6 level, the module powers off. VIHmin=0.7V OFF#
When it is at high level, the VILmax=0.5V Pulled down internally. module powers on. EM12-G_Hardware_Design 24 / 62 LDO_INC1C2MIC29302WUU1INOUTENGNDADJ24135VCC100nFC3470uFC4100nFR2100K 1%51K 1%R3470uF470R51KR4R1MCU_POWER_ON/OFF47K4.7KR5R6C5C633pF10pFTVSD1 LTE-A Module Series EM12-G Hardware Design 3.4.1.1. Turn on the Module Through GPIO Controlled FULL_CARD_POWER_OFF#
It is recommended to use a GPIO from host to control FULL_CARD_POWER_OFF#. A simple reference circuit is illustrated in the following figure. Figure 6: Turn on the Module Through GPIO Controlled FULL_CARD_POWER_OFF#
3.4.1.2. Turn on the Module Automatically If FULL_CARD_POWER_OFF# is pulled up to 3.3V with a 5k~10k resistor, the module will be powered on automatically when the power supply for VCC is applied, and will be powered off when the power supply is removed. A reference circuit is shown in the following figure. Figure 7: Turn on the Module Automatically EM12-G_Hardware_Design 25 / 62 ModuleHostGNDGNDGPIOFULL_CARD_POWER_OFF#3.3VModuleFULL_CARD_POWER_OFF#10K3.3V LTE-A Module Series EM12-G Hardware Design The turn on scenario is illustrated in the following figure. Figure 8: Timing of Turning on Module NOTE Please make sure that VCC is stable before pulling down FUL_CARD_POWER_OFF# pin. The time between them is no less than 30ms. 3.4.2. Turn off the Module 3.4.2.1. Turn off the Module Through FULL_CARD_POWER_OFF#
Driving the FULL_CARD_POWER_OFF# pin to low will turn off the module. The power-down scenario is illustrated in the following figure. Figure 9: Timing of Turning off the Module Through FULL_CARD_POWER_OFF#
EM12-G_Hardware_Design 26 / 62 VIL0.2VVIH1.19VVCCFULL_CARD_POWER_OFF#RESET#BootingActiveModule StatusNOTE12.5sOFFVCCFULL_CARD_POWER_OFF#RUNNINGOFFModuleStatusON LTE-A Module Series EM12-G Hardware Design 3.4.2.2. Turn off the Module via AT Command The module can also be turned off by AT+QPOWD command. For more details about the command, please refer to document [2]. 3.5. Reset the Module The RESET# pin is used to reset the module. The module can be reset by driving RESET# to a low level voltage for 250ms~600ms. Table 7: RESET# Pin Definition Pin Name Pin No. Description DC Characteristics Comment RESET#
67 Reset the module VIHmin=1.3V VIHmax=2.1V VILmax=0.5V An open collector/collector driver or button can be used to control the RESET# pin. Figure 10: Reference Circuit of RESET# by Using Driving Circuit EM12-G_Hardware_Design 27 / 62 Reset pulseRESET#4.7K47K LTE-A Module Series EM12-G Hardware Design Figure 11: Reference Circuit of RESET# by Using Button The reset scenario is illustrated in the following figure. Figure 12: Timing of Resetting Module NOTE Please ensure that there is no large capacitance on RESET# pin. 3.6. (U)SIM Interfaces The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported, and Dual SIM Single Standby* function is supported. EM12-G_Hardware_Design 28 / 62 RESET#S2Close to S2TVSVIL0.5VVIH1.3VVCC250msResettingModule StatusRunningRESET#Restart600ms LTE-A Module Series EM12-G Hardware Design Table 8: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM1_VDD 36 PO Power supply for (U)SIM1 Either 1.8V or 3.0V is supported card by the module automatically. USIM1_DATA 34 IO Data signal of (U)SIM1 card USIM1_CLK 32 DO Clock signal of (U)SIM1 card USIM1_RESET 30 DO Reset signal of (U)SIM1 card
(U)SIM1 card insertion When (U)SIM1 card is present, it Pulled up internally. USIM1_DET 66 DI detection. is at high level. Active high. When (U)SIM1 card is absent, it is at low level. USIM2_VDD 48 PO Power supply for (U)SIM2 Either 1.8V or 3.0V is supported card by the module automatically. USIM2_DATA 42 IO Data signal of (U)SIM2 card USIM2_CLK 44 DO Clock signal of (U)SIM2 card USIM2_RESET 46 DO Reset signal of (U)SIM2 card
(U)SIM2 card insertion When (U)SIM2 card is present, it Pulled up internally. USIM2_DET 40 DI detection. is at high level. Active high. When (U)SIM2 card is absent, it is at low level. EM12-G supports (U)SIM card hot-plug via the USIM_DET pin, which is a level trigger pin. The USIM_DET is normally short-circuited to ground when (U)SIM card is not inserted. When the (U)SIM card is inserted, the USIM_DET will change from low to high level. The rising edge will indicate insertion of the
(U)SIM card. When the (U)SIM card is removed, the USIM_DET will change from high to low level. This falling edge will indicate the absence of the (U)SIM card. The following figure shows a reference design of (U)SIM interface with normally short-circuited (U)SIM card connector. EM12-G_Hardware_Design 29 / 62 LTE-A Module Series EM12-G Hardware Design Figure 13: Reference Circuit of Normally Short-Circuited (U)SIM Card Connector Normally Short-Circuited (U)SIM Card Connector:
When the (U)SIM is absent, CD is short-circuited to SW and USIM_DET is at low level. When the (U)SIM is inserted, CD is open to SW and USIM_DET is at high level. The following figure shows a reference design of (U)SIM interface with normally open (U)SIM card connector. Figure 14: Reference Circuit of Normally Open (U)SIM Card Connector Normally Open (U)SIM Card Connector:
When the (U)SIM is absent, CD is open to SW and USIM_DET is at low level. When the (U)SIM is inserted, CD is short-circuited to SW and USIM_DET is at high level. EM12-G_Hardware_Design 30 / 62 ModuleUSIM_VDDUSIM_RESETUSIM_CLKUSIM_DATAUSIM_DET22R22R22R100nF(U)SIM Card ConnectorGNDGND33pF33pF33pFVCCRSTCLKIOVPPGNDGNDUSIM_VDD15KGNDCDSWModuleUSIM_VDDUSIM_RESETUSIM_CLKUSIM_DATAUSIM_DET22R22R22R100nF(U)SIM Card ConnectorGND33pF33pF33pFVCCRSTCLKIOVPPGNDGNDUSIM_VDD15KGNDCD1.8V4.7K33KSW LTE-A Module Series EM12-G Hardware Design If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for (U)SIM card interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 15: Reference Circuit of a 6-Pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers applications, please follow the criteria below in (U)SIM circuit design:
Keep placement of (U)SIM card connector as close as possible to the module. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VCC traces. Assure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode array with parasitic capacitance not exceeding 10pF. The 22 resistors should be added in series between the module and the (U)SIM card connector so as to suppress EMI spurious transmission and enhance ESD protection. The 33pF capacitors are used to filter out RF interference. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. NOTE S
* means under development. EM12-G_Hardware_Design 31 / 62 ModuleUSIM_VDDUSIM_GNDUSIM_RESETUSIM_CLKUSIM_DATA22R22R22R100nF(U)SIM Card ConnectorGND33pF33pF33pFVCCRSTCLKIOVPPGNDGND15KUSIM_VDD LTE-A Module Series EM12-G Hardware Design 3.7. USB Interface EM12-G provides one integrated Universal Serial Bus (USB) interface which complies with the USB 3.0/2.0 specifications and supports super speed (5Gbps) on USB 3.0, high speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB interface. Table 9: Pin Definition of USB Interface Pin No. Pin Name I/O Description Comment USB_DP IO USB 2.0 differential data bus (+) USB_DM IO USB 2.0 differential data bus (-) Require differential impedance of 90 USB3.0_TX-
DO USB 3.0 transmit data (-) USB3.0_TX+ DO USB 3.0 transmit data (+) Require differential impedance of 90 USB3.0_RX- DI USB 3.0 receive data (-) USB3.0_RX+ DI USB 3.0 receive data (+) Require differential impedance of 90 7 9 29 31 35 37 For more details about the USB 2.0 & 3.0 specifications, please visit http://www.usb.org/home. The USB interface is recommended to be reserved for firmware upgrade in customers designs. The following figure shows a reference circuit of USB 2.0 & USB 3.0 interface. EM12-G_Hardware_Design 32 / 62 LTE-A Module Series EM12-G Hardware Design Figure 16: Reference Circuit of USB 2.0 & 3.0 Interface In order to ensure the integrity of USB 2.0 & 3.0 data line signal, R1/R2/R3/R4 components must be placed close to the module, capacitors C1 and C2 have been placed inside the module, capacitors C3 and C4 must be placed close to the MCU, and these components should be placed close to each other. In order to ensure the USB interface design corresponding with USB 2.0 & 3.0 specifications, please comply with the following principles:
It is important to route the USB 2.0 & 3.0 signal traces as differential pairs with total grounding. 1) For USB 2.0 routing traces, the trace impedance of the differential pair should be 90, and the trace length difference between the differential pair should be less than 2mm. 2) For USB 3.0 routing traces, the trace impedance of Tx and Rx differential pairs should be 90, and the trace length difference between Tx and Rx differential pairs should be less than 0.7mm. Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. It is important to route the USB 2.0 & 3.0 differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. If USB connector is used, please keep the ESD protection components as close as possible to the USB connector. Pay attention to the influence of junction capacitance of ESD protection components on USB 2.0 & 3.0 data lines. The capacitance value of ESD protection components should be less than 2.0pF for USB 2.0, and less than 0.4pF for USB 3.0. If possible, reserve a 0R resistor on USB_DP and USB_DM lines, respectively. EM12-G_Hardware_Design 33 / 62 GNDUSB3.0_TX-USB3.0_TX+GNDUSB3.0_RX-USB3.0_RX+USB3.0_RX-USB3.0_RX+USB3.0_TX-USB3.0_TX+C3C4USB_DPUSB_DMR1R20R0RUSB_DMUSB_DPC1C2ESD Array100nF100nF100nF100nFModuleMCUR3R4NM_0RNM_0RTest PointsMinimize these stubs LTE-A Module Series EM12-G Hardware Design NOTE S
* means under development. 3.8. PCIE Interface Under development 3.9. PCM and I2C Interfaces EM12-G supports audio communication via Pulse Code Modulation (PCM) digital interface and I2C interface. The PCM interface supports the following modes:
Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK at 8kHz PCM_SYNC, and also supports 4096kHz PCM_CLK at 16kHz PCM_SYNC. In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a 256kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC only. EM12-G supports 16-bit linear data format. The following figures show the primary modes timing relationship with 8kHz PCM_SYNC and 2048kHz PCM_CLK, as well as the auxiliary modes timing relationship with 8kHz PCM_SYNC and 256kHz PCM_CLK. EM12-G_Hardware_Design 34 / 62 LTE-A Module Series EM12-G Hardware Design Figure 17: Primary Mode Timing Figure 18: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 10: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN 22 DI PCM data input 1.8V power domain. PCM_OUT 24 DO PCM data output 1.8V power domain. EM12-G_Hardware_Design 35 / 62 PCM_CLKPCM_SYNCPCM_OUTMSBLSBMSB125us12256255PCM_INMSBLSBMSBPCM_CLKPCM_SYNCPCM_OUTMSBLSBPCM_IN125usMSB123231LSB LTE-A Module Series EM12-G Hardware Design PCM_SYNC 28 IO PCM data frame synchronization signal 1.8V power domain. PCM_CLK 20 IO PCM data bit clock 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. Used for external codec. Require an external pull-up to I2C_SCL I2C_SDA 58 56 DO I2C serial clock IO I2C serial data 1.8V. The clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. Please refer to document [2] for details about AT+QDAI command. The following figure shows a reference design of PCM interface with an external codec IC. Figure 19: Reference Circuit of PCM Application with Audio Codec NOTES 1. It is recommended to reserve an RC (R=22, C=22pF) circuit on the PCM lines, especially for PCM_CLK. 2. EM12-G works as a master device pertaining to I2C interface. 3.10. Control and Indicator Signals The following table shows the pin definition of control and indicator signals. EM12-G_Hardware_Design 36 / 62 PCM_INPCM_OUTPCM_SYNCPCM_CLKI2C_SCLI2C_SDAModule1.8V4.7KBCLKLRCKDACADCSCLSDABIASMICBIASINPINNLOUTPLOUTNCodec4.7K LTE-A Module Series EM12-G Hardware Design Table 11: List of Control and Indicator Signals Pin No. NOTE Pin Name I/O Power Domain Description 10 WWAN_LED#
OD 3.3V WAKE_ON_WAN# OD 1.8V It is an open collector and active low signal. It is used to indicate the RF status of the module. A signal to wake up the host. It is an open collector and active low signal. W_DISABLE1#
DI 1.8V/3.3V Airplane mode control. Active low. W_DISABLE2#*
DI 1.8V/3.3V GNSS enable control. Active low. DPR DI 1.8V Dynamic power reduction. High level by default. 23 8 26 25
* means under development. 3.10.1. W_DISABLE1# Signal EM12-G provides a W_DISABLE1# signal to disable or enable airplane mode through hardware operation. The W_DISABLE1# pin is pulled up by default. Driving it to low level will let the module enter into airplane mode. In airplane mode, the RF function will be disabled. The RF function can also be enabled or disabled through software AT commands. The following table shows the RF function status of the module. Table 12: RF Function Status W_DISABLE1# Level AT Commands RF Function Status High Level AT+CFUN=1 Enabled High Level Low Level AT+CFUN=0 AT+CFUN=4 AT+CFUN=0 AT+CFUN=1 AT+CFUN=4 Disabled Disabled EM12-G_Hardware_Design 37 / 62 LTE-A Module Series EM12-G Hardware Design 3.10.2. WWAN_LED# Signal The WWAN_LED# signal is used to indicate the RF status of the module, and its typical current consumption is up to 40mA. In order to reduce the current consumption of the LED, a resistor must be placed in series with the LED, as illustrated in the figure below. The LED is ON when the WWAN_LED# signal is at a low voltage level. Figure 20: WWAN_LED# Signal Reference Circuit Diagram The following table shows the RF status indicated by WWAN_LED# signal. Table 13: Network Status Indications of WWAN_LED# Signal WWAN_LED# Level Description Low Level (LED ON) RF function is turned on High Level (LED OFF) RF function is turned off if any of the following circumstances occurs:
The (U)SIM card is not powered W_DISABLE1# signal is at low level (airplane mode enabled). AT+CFUN=4 (RF function disabled) 3.10.3. WAKE_ON_WAN# Signal The WAKE_ON_WAN# signal is an open collector signal, which requires a pull-up resistor on the host. When a URC returns, a 1s low level pulse signal will be outputted to wake up the host. The module operation status indicated by WAKE_ON_WAN# is shown as below. Table 14: State of the WAKE_ON_WAN# Signal WAKE_ON_WAN# State Module Operation Status Output a 1s low level pulse signal Call/SMS/Data is incoming (to wake up the host) Always at high level Idle/Sleep EM12-G_Hardware_Design 38 / 62 WWAN_LED#VCCR LTE-A Module Series EM12-G Hardware Design Figure 21: WAKE_ON_WAN# Behavior Figure 22: WAKE_ON_WAN# Signal Reference Circuit Design 3.10.4. DPR Signal EM12-G provides a DPR (Dynamic Power Reduction) signal for body SAR (Specific Absorption Rate) detection. The signal is sent by a host system proximity sensor to EM12-G module to provide an input trigger which will reduce the output power in the radio transmission. Table 15: Function of the DPR Signal DPR Level Function High/Floating Max transmitting power will NOT be backed off Max transmitting power will be backed off by executing AT+QCFG="sarcfg"
command Low NOTE Please refer to document [2] for more details about AT+QCFG="sarcfg" command. EM12-G_Hardware_Design 39 / 62 Wake up the host1sHighLow(external pull-up)ModuleHostWAKE_ON_WAN#10KVCC from the Host LTE-A Module Series EM12-G Hardware Design 3.11. Tunable Antenna Control Interface*
ANTCTL[0:3] signals are used for tunable antenna control and should be routed to an appropriate antenna control circuitry. More details about the interface will be added in the future version of the document. Table 16: Pin Definition of Tunable Antenna Control Interface*
Pin Name Pin No. I/O Description Comment ANTCTL0*
59 DO Tunable antenna control 1.8V power domain ANTCTL1*
61 DO Tunable antenna control 1.8V power domain ANTCTL2*
63 DO Tunable antenna control 1.8V power domain ANTCTL3*
65 DO Tunable antenna control 1.8V power domain NOTE
* means under development. 3.12. Configuration Pins EM12-G provides 4 configuration pins, and it is configured as WWAN-USB 3.0 2. Table 17: Pin Definition of Configuration Pins Pin No. Pin Name I/O Power Domain Description CONFIG_0 CONFIG_1 CONFIG_2 CONFIG_3 0 0 0 0 Connected to GND internally. Connected to GND internally. NC NC 21 69 75 1 The 4 pins on EM12-G module are defined as below:
EM12-G_Hardware_Design 40 / 62 LTE-A Module Series EM12-G Hardware Design Table 18: List of Configuration Pins Config_0 Config_1 Config_2 Config_3 Module Type and Port
(Pin 21)
(Pin 69)
(Pin 75)
(Pin 1) Main Host Interface Configuration GND GND NC NC WWAN-USB 3.0 2 EM12-G_Hardware_Design 41 / 62 LTE-A Module Series EM12-G Hardware Design 4 GNSS Receiver 4.1. General Description EM12-G includes a fully integrated global navigation satellite system solution that supports Gen9C-Lite of Qualcomm (GPS, GLONASS, BeiDou Galileo and QZSS). EM12-G supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EM12-G GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. EM12-G_Hardware_Design 42 / 62 LTE-A Module Series EM12-G Hardware Design 5 Antenna Interfaces EM12-G provides a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna ports have an impedance of 50. 5.1. Main/Rx-diversity Antenna Interfaces The main/Rx-diversity/GNSS antenna interfaces are shown as below. Figure 23: Antenna Interfaces on the Module EM12-G_Hardware_Design 43 / 62 LTE-A Module Series EM12-G Hardware Design 5.1.1. Operating Frequency Table 19: EM12-G Operating Frequencies 3GPP Band Transmit Receive WCDMA B1 1920~1980 WCDMA B2 1850~1910 WCDMA B3 1710~1785 WCDMA B4 1710~1755 WCDMA B5 824~849 WCDMA B8 880~915 2110~2170 1930~1990 1805~1880 2110~2155 869~894 925~960 WCDMA B9 1750~1785 1845~1880 WCDMA B19 830~845 LTE B1 LTE B2 LTE B3 LTE B4 LTE B5 LTE B7 LTE B8 LTE B9 LTE B12 LTE B13 LTE B14 LTE B17 LTE B18 LTE B19 1920~1980 1850~1910 1710~1785 1710~1755 824~849 875~890 2110~2170 1930~1990 1805~1880 2110~2155 869~894 2500~2570 2620~2690 880~915 925~960 1749.9~1784.9 1844.9~1879.9 699~716 777~787 788~798 704~716 815~830 830~845 729~746 746~756 758~768 734~746 860~875 875~890 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EM12-G_Hardware_Design 44 / 62 LTE-A Module Series EM12-G Hardware Design 832~862 791~821 1447.9~1462.9 1495.9~1510.9 1850~1915 1930~1995 814~849 703~748
/
2305~2315
/
2570~2620 1880~1920 2300~2400 2496~2690 1710~1780 859~894 758~803 717~728 2350~2360 1452~1496 2570~2620 1880~1920 2300~2400 2496~2690 2110~2200 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz LTE B20 LTE B21 LTE B25 LTE B26 LTE B28 LTE B29 LTE B30 LTE B32 LTE B38 LTE B39 LTE B40 LTE B41 LTE B66 5.2. GNSS Antenna Interface The following table shows frequency specification of GNSS antenna interface. Table 20: GNSS Frequency Type Frequency GPS/Galileo 1575.421.023 GLONASS 1597.5~1605.8 BeiDou 1561.0982.046 Unit MHz MHz MHz EM12-G_Hardware_Design 45 / 62 LTE-A Module Series EM12-G Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 21: Antenna Requirements Type Requirements GNSS 1) Frequency range: 1559MHz ~ 1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi VSWR: 2 Efficiency: > 30%
Max Input Power: 50W Input Impedance: 50 Cable insertion loss: <1dB WCDMA/LTE
(WCDMA B5/B8/B19, LTE B5/B8/B12/B13/B14/B17/B18/B19/B20/B26/B28/B29) Cable insertion loss: <1.5dB
(WCDMA B1/B2/B3/B4/B9, LTE B1/B2/B3/B4/B9/B21/B25/B32/B39/B66) Cable insertion loss <2dB
(LTE B7/B30/B38/B40/B41) NOTE 1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 5.3.2. Recommended RF Connector for Antenna Installation EM12-G is mounted with standard 2mm 2mm receptacle RF connectors for convenient antenna connection. The connector dimensions are illustrated below:
EM12-G_Hardware_Design 46 / 62 LTE-A Module Series EM12-G Hardware Design Figure 24: EM12-G RF Connector Dimensions (Unit: mm) Table 22: Major Specifications of the RF Connector Item Specification Nominal Frequency Range DC to 6GHz Nominal Impedance 50 Temperature Rating
-40C to +85C Voltage Standing Wave Ratio (VSWR) Max 1.3 (DC~3GHz) Max 1.45 (3GHz~6GHz) Meet the requirements of:
The receptacle RF connector used in conjunction with EM12-G will accept two types of mating plugs that will meet a maximum height of 1.2mm using a 0.81mm coaxial cable or a maximum height of 1.45mm utilizing a 1.13mm coaxial cable. The following figure shows the specifications of mating plugs using 0.81mm coaxial cables. EM12-G_Hardware_Design 47 / 62 LTE-A Module Series EM12-G Hardware Design Figure 25: Specifications of Mating Plugs Using 0.81mm Coaxial Cables The following figure illustrates the connection between the receptacle RF connector on EM12-G and the mating plug using a 0.81mm coaxial cable. Figure 26: Connection between RF Connector and Mating Plug Using 0.81mm Coaxial Cable The following figure illustrates the connection between the receptacle RF connector on EM12-G and the mating plug using a 1.13mm coaxial cable. EM12-G_Hardware_Design 48 / 62 LTE-A Module Series EM12-G Hardware Design Figure 27: Connection between RF Connector and Mating Plug Using 1.13mm Coaxial Cable EM12-G_Hardware_Design 49 / 62 LTE-A Module Series EM12-G Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 23: Absolute Maximum Ratings Parameter VCC Voltage at Digital Pins Min.
-0.3
-0.3 Max. Unit 4.7 2.3 V V 6.2. Power Supply Requirements The typical input voltage of EM12-G is 3.7V, as specified by PCIe M.2 Electromechanical Spec Rev1.0. The following table shows the power supply requirements of EM12-G. Table 24: Power Supply Requirements Parameter Description Min. Typ. Max. Unit VCC Power Supply 3.135 3.7 4.4 V EM12-G_Hardware_Design 50 / 62 LTE-A Module Series EM12-G Hardware Design 6.3. I/O Requirements Table 25: I/O Requirements Parameter Description Min. Max. Unit Input high voltage 0.7 VDD18 1) VDD18+0.3 Input low voltage
-0.3 0.3 VDD18 Output high voltage VDD18-0.5 Output low voltage 0 VDD18 0.4 V V V V VIH VIL VOH VOL NOTE 1) VDD18 refers to I/O power domain. 6.4. Operation and Storage Temperatures Table 26: Operation and Storage Temperatures Parameter Min. Operation Temperature Range 1)
-30 Extended Temperature Range 2)
-40 Storage temperature Range
-40 Typ.
+25 NOTES Max. Unit
+70
+85
+90 C C C 1. 2. 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. EM12-G_Hardware_Design 51 / 62 LTE-A Module Series EM12-G Hardware Design 6.5. Current Consumption(TBD) 6.6. RF Output Power The following table shows the RF output power of EM12-G module. Table 27: RF Output Power Frequency Max. WCDMA bands 24dBm+1/-3dB LTE- FDD bands 23dBm2dB LTE-TDD bands 23dBm2dB 6.7. RF Receiving Sensitivity Min.
<-50dBm
<-40dBm
<-40dBm The following tables show conducted RF receiving sensitivity of EM12-G module. Table 28: EM12-G Conducted RF Receiving Sensitivity(PRXDRX TBD) Frequency Primary (Typ.) Diversity (Typ.) SIMO1) (Typ.) 3GPP (SIMO) WCDMA B1
-109.5 WCDMA B2
-109.5 WCDMA B3
-109.5 WCDMA B4
-109.0 WCDMA B5
-110.5 WCDMA B8
-110.5 WCDMA B9
-109.5 WCDMA B19
-110.5
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
-106.7dBm
-104.7dbm
-103.7dbm
-106.7dBm
-104.7dbm
-103.7dBm
-105.7dBm
-106.7dBm LTE-FDD B1 (10M)
-96.5
-96.0
-98.5dbm
-96.3dBm EM12-G_Hardware_Design 52 / 62 LTE-A Module Series EM12-G Hardware Design LTE-FDD B2 (10M)
-97.5
-97.0
-99.5dbm
-94.3dBm LTE-FDD B3 (10M)
-97.0
-96.5
-99.0dbm
-93.3dBm LTE-FDD B4 (10M)
-97.0
-96.0
-99.0dBm
-96.3dBm LTE-FDD B5 (10M)
-98.5
-98.5
-100.5dBm
-94.3dBm LTE-FDD B7 (10M)
-96.5
-96.0
-98.5dBm
-94.3dBm LTE-FDD B8 (10M)
-98.0
-98.0
-101.5dBm
-93.3dBm LTE-FDD B9(10M)
-97.5
-97.5
-100.0dBm
-95.3dBm LTE-FDD B12 (10M)
-98.5
-99.0
-101.5dBm
-93.3dBm LTE-FDD B13 (10M)
-99.0
-99.0
-101.0dBm
-93.3dBm LTE-FDD B14 (10M)
-97.0
-97.5
-100.0dBm
-93.3dBm LTE-FDD B17 (10M)
-99.0
-99.0
-101.0dBm
-93.3dBm LTE-FDD B18 (10M)
-99.0
-99.0
-101.0dBm
-96.3dBm LTE-FDD B19 (10M)
-98.5
-98.5
-100.5dBm
-96.3dBm LTE-FDD B20 (10M)
-98.5
-98.5
-100.5dBm
-93.3dBm LTE-FDD B21 (10M)
-96.0
-96.0
-98.0dBm
-96.3dBm LTE-TDD B25 (10M)
-96.5
-97.0
-99.0dBm
-92.8dBm LTE-TDD B26 (10M)
-99.0
-98.5
-100.5dBm
-93.8dBm LTE-TDD B28 (10M)
-98.0
-99.0
-100.5dBm
-94.8dBm LTE-TDD B29 (10M)
/
/
/
/
LTE-TDD B30 (10M)
-97.0
-95.0
-98.0dBm
-95.3dBm LTE-TDD B32 (10M)
/
/
/
/
LTE-TDD B38 (10M)
-96.5
-96.0
-98.0dBm
-96.3dBm LTE-TDD B39 (10M)
-97.0
-97.5
-99.5dBm
-96.3dBm LTE-TDD B40 (10M)
-96.5
-96
-98.0dBm
-96.3dBm LTE-TDD B41 (10M)
-96.0
-95.5
-97.5dBm
-94.3dBm EM12-G_Hardware_Design 53 / 62 LTE-A Module Series EM12-G Hardware Design LTE-TDD B66 (10M)
-97.0
-96.0
-99.0dBm
-95.8dBm NOTES 1. 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and multiple
(two for EM12-G) antennas at the receiver side, which can improve Rx performance. 2. 2) Per 3GPP specification. 6.8. ESD Characteristics The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the module electrostatic discharge characteristics. Table 29: Electrostatic Discharge Characteristics (Temperature: 25C, Humidity: 40%) Tested Points Contact Discharge Air Discharge Unit VBAT, GND Antenna Interfaces 5 4 Other Interfaces 0.5 6.9. Thermal Dissipation 10 8 1 kV kV kV EM12-G is designed to work over an extended temperature range. In order to achieve a maximum performance while working under extended temperatures or extreme conditions (such as with maximum power or data rate, etc.) for a long time, it is strongly recommended to add a thermal pad or other thermally conductive compounds between the module and the main PCB for thermal dissipation. The thermal dissipation area (i.e. the area for adding thermal pad) is show as below. The dimensions are measured in mm. EM12-G_Hardware_Design 54 / 62 LTE-A Module Series EM12-G Hardware Design Figure 28: Thermal Dissipation Area on Bottom Side of Module (Top View) There are some other measures to enhance heat dissipation performance:
Add ground vias as many as possible on PCB. Maximize airflow over/around the module. Place the module away from other heating sources. Module mounting holes must be used to attach (ground) the device to the main PCB ground. It is NOT recommended to apply solder mask on the main PCB where the modules thermal dissipation area is located. Select an appropriate material, thickness and surface for the outer housing (i.e. the mechanical enclosure) of the application device that integrates the module so that it provides good thermal dissipation. Customers may also need active cooling to pull heat away from the module. If possible, add a heatsink on the top of the module. A thermal pad should be used between the heatsink and the module, and the heatsink should be designed with as many fins as possible to increase heat dissipation area. EM12-G_Hardware_Design 55 / 62 LTE-A Module Series EM12-G Hardware Design 7 Mechanical Dimensions and Packaging This chapter mainly describes mechanical dimensions and packaging specifications of EM12-G module. All dimensions are measured in mm, and the tolerances for dimensions without tolerance values are 0.05mm. 7.1. Mechanical Dimensions of the Module Figure 29: Mechanical Dimensions of EM12-G (Unit: mm) EM12-G_Hardware_Design 56 / 62 LTE-A Module Series EM12-G Hardware Design 7.2. Standard Dimensions of M.2 PCI Express The following figure shows the standard dimensions of M.2 PCI Express. Please refer to document [4]
for detailed A and B. Figure 30: Standard Dimensions of M.2 Type 3042-S3 (Unit: mm) According to M.2 nomenclature, EM12-G is Type 3042-S3-B (30.0mm 42.0mm, max component height on the top is 1.5mm and single-sided, key ID is B). Figure 31: M.2 Nomenclature EM12-G_Hardware_Design 57 / 62 LTE-A Module Series EM12-G Hardware Design 7.3. Design Effect Drawings of the Module Figure 32: Top View of the Module NOTE These are design effect drawings of EM12-G module. For more accurate pictures, please refer to the module that you get from Quectel. 7.4. M.2 Connector EM12-G adopts a standard PCI Express M.2 connector which compiles with the directives and standards listed in the document [4]. 7.5. Barcode Rule The PN (Q1-A2449) printed on the label is fixed for Quectel. For the SN shown in the top view, the first two digits indicate project stage. For example, D1 means DVT1. The next one digit indicates the code of the factory where the module is manufactured. The next EM12-G_Hardware_Design 58 / 62 LTE-A Module Series EM12-G Hardware Design four digits indicate the day, month and year when the module is manufactured. For instance, 18FD means 13th June, 2018. The next two digits indicate serial number of the manufacturing order. The last six digits vary by module which could not be the same in certain time. Meanwhile, the SN and IMEI can be checked by scanning the QR code. 7.6. Packaging EM12-G modules are packaged in trays. The following figure shows the tray size. Figure 33: Tray Size Each tray contains 10 modules. The smallest package contains 100 modules. Tray packaging procedure as below. 1. Use 10 trays to package 100 modules at a time (tray size: 247mm 172mm). 2. Place an empty tray on the top of the 10-tray stack. 3. Fix the stack with masking tape in # shape as shown in the figure. 4. Pack the stack with conductive bag, and then fix the bag with masking tape. 5. Place the IMEI No. list into the small carton. 6. Seal the carton and then label the seal with sealing sticker (small carton size: 250mm 175mm 128mm). EM12-G_Hardware_Design 59 / 62 LTE-A Module Series EM12-G Hardware Design Figure 34: Tray Packaging Procedure EM12-G_Hardware_Design 60 / 62 LTE-A Module Series EM12-G Hardware Design 8 Appendix References Table 30: Related Documents SN Document Name Remark
[1]
Quectel_M.2_EVB_User_Guide M.2 EVB User Guide
[2]
Quectel_EP06&EG06&EM06_AT_Commands_Manual EP06, EG06 and EM06 AT Commands Manual
[3]
Quectel_EP06&EG06&EM06_GNSS_AT_Commands_ EP06, EG06 and EM06 GNSS AT Manual Commands Manual
[4]
PCI Express M.2 Specification PCI Express Specification Table 31: Terms and Abbreviations Abbreviation Description bps Bits Per Second DC-HSPA+
Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air DL ESD FDD GLONASS GNSS GPS GSM HR HSPA Down Link Electrostatic Discharge Frequency Division Duplexing GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate High Speed Packet Access EM12-G_Hardware_Design 61 / 62 LTE-A Module Series EM12-G Hardware Design HSUPA High Speed Uplink Packet Access kbps LED LTE Mbps ME MIMO MLCC MMS MO MT PDU PPP RF Rx SAR SMS Tx UART UL URC
(U)SIM WCDMA Kilo Bits Per Second Light Emitting Diode Long Term Evolution Million Bits Per Second Mobile Equipment (Module) Multiple-Input Multiple-Output Multiplayer Ceramic Chip Capacitor Multimedia Messaging Service Mobile Originated Mobile Terminated Protocol Data Unit Point-to-Point Protocol Radio Frequency Receive Specific Absorption Rate Short Message Service Transmit Universal Asynchronous Receiver & Transmitter Up Link Unsolicited Result Code
(Universal) Subscriber Identification Module Wideband Code Division Multiple Access EM12-G_Hardware_Design 62 / 62
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2019-02-01 | 2575 ~ 2615 | PCB - PCS Licensed Transmitter | Original Equipment |
2 | JAB - Part 15 Class B Digital Device |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 2 | Effective |
2019-02-01
|
||||
1 2 | Applicant's complete, legal business name |
Quectel Wireless Solutions Company Limited
|
||||
1 2 | FCC Registration Number (FRN) |
0018988279
|
||||
1 2 | Physical Address |
Building 5, Shanghai Business Park PhaseIII
|
||||
1 2 |
Shanghai, N/A 200233
|
|||||
1 2 |
China
|
|||||
app s | TCB Information | |||||
1 2 | TCB Application Email Address |
s******@nemko.com
|
||||
1 2 | TCB Scope |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
||||
1 2 |
A1: Low Power Transmitters below 1 GHz (except Spread Spectrum), Unintentional Radiators, EAS (Part 11) & Consumer ISM devices
|
|||||
app s | FCC ID | |||||
1 2 | Grantee Code |
XMR
|
||||
1 2 | Equipment Product Code |
201901EM12G
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 2 | Name |
J******** x********
|
||||
1 2 | Telephone Number |
+8602******** Extension:
|
||||
1 2 | Fax Number |
+8621********
|
||||
1 2 |
j******@quectel.com
|
|||||
app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 2 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 | If so, specify the short-term confidentiality release date (MM/DD/YYYY format) | 07/31/2019 | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 2 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 2 | Equipment Class | PCB - PCS Licensed Transmitter | ||||
1 2 | JAB - Part 15 Class B Digital Device | |||||
1 2 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | LTE-A Cat 12 M.2 Module | ||||
1 2 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 2 | Modular Equipment Type | Single Modular Approval | ||||
1 2 | Purpose / Application is for | Original Equipment | ||||
1 2 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
1 2 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 2 | Grant Comments | Single Modular Approval. Power output listed is conducted at the antenna terminal. This device is to be used only for mobile and fixed application, and must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi-transmitter evaluation procedures as documented in this filing. OEM integrators must be provided with antenna installation instructions, and labeling requirements for finished products. OEM integrators and End-users must be provided with transmitter operation conditions for satisfying RF exposure compliance. For mobile and fixed operating configurations the antenna gain, including cable loss, must not exceed 5 dBi at 700 MHz, 6 dBi at 800/850 MHz, 5 dBi at 1700 MHz, 7 dBi at 1900 MHz and 2500/2600 MHz, and 4 dBi at 2300 MHz as defined in 2.1091 for satisfying RF exposure compliance. Under no conditions may an antenna gain be used that would exceed the ERP and EIRP power limits as specified in Parts 22, Part 24 and Part 27. | ||||
1 2 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 2 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 2 | Firm Name |
Sporton International (KunShan) Inc.
|
||||
1 2 | Name |
M****** L****
|
||||
1 2 | Telephone Number |
86-51********
|
||||
1 2 | Fax Number |
86-51********
|
||||
1 2 |
m******@sporton.com.tw
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 22H | 826.4 | 846.6 | 0.1897 | 0.0442 ppm | 4M13F9W | ||||||||||||||||||||||||||||||||||
1 | 2 | 24E | 1852.4 | 1907.6 | 0.2028 | 0.0239 ppm | 4M13F9W | ||||||||||||||||||||||||||||||||||
1 | 3 | 27 | 1712.4 | 1752.6 | 0.1986 | 0.0167 ppm | 4M12F9W | ||||||||||||||||||||||||||||||||||
1 | 4 | 24E | 1860 | 1900 | 0.2636 | 0.002 ppm | 18M4G7D | ||||||||||||||||||||||||||||||||||
1 | 5 | 24E | 1860 | 1900 | 0.2143 | 0.002 ppm | 18M3W7D | ||||||||||||||||||||||||||||||||||
1 | 6 | 24E | 1860 | 1900 | 0.2148 | 0.002 ppm | 18M3W7D | ||||||||||||||||||||||||||||||||||
1 | 7 | 24E | 1855 | 1905 | 0.2239 | 0.002 ppm | 9M07W7D | ||||||||||||||||||||||||||||||||||
1 | 8 | 24E | 1855 | 1905 | 0.2213 | 0.002 ppm | 9M05W7D | ||||||||||||||||||||||||||||||||||
1 | 9 | 27 | 1720 | 1745 | 0.246 | 0.0023 ppm | 18M4G7D | ||||||||||||||||||||||||||||||||||
1 | 1 | 27 | 1720 | 1745 | 0.2113 | 0.0023 ppm | 18M5W7D | ||||||||||||||||||||||||||||||||||
1 | 11 | 27 | 1720 | 1745 | 0.208 | 0.0023 ppm | 18M4W7D | ||||||||||||||||||||||||||||||||||
1 | 12 | 27 | 1717.5 | 1747.5 | 0.2208 | 0.0023 ppm | 13M5W7D | ||||||||||||||||||||||||||||||||||
1 | 13 | 22H | 829 | 844 | 0.2535 | 0.0078 ppm | 9M05G7D | ||||||||||||||||||||||||||||||||||
1 | 14 | 22H | 829 | 844 | 0.2173 | 0.0078 ppm | 9M03W7D | ||||||||||||||||||||||||||||||||||
1 | 15 | 22H | 829 | 844 | 0.2213 | 0.0078 ppm | 9M03W7D | ||||||||||||||||||||||||||||||||||
1 | 16 | 22H | 826.5 | 846.5 | 0.2198 | 0.0078 ppm | 4M50W7D | ||||||||||||||||||||||||||||||||||
1 | 17 | 27 | 2510 | 2560 | 0.2265 | 0.0026 ppm | 18M4G7D | ||||||||||||||||||||||||||||||||||
1 | 18 | 27 | 2510 | 2560 | 0.1968 | 0.0026 ppm | 18M5W7D | ||||||||||||||||||||||||||||||||||
1 | 19 | 27 | 2510 | 2560 | 0.1892 | 0.0026 ppm | 18M3W7D | ||||||||||||||||||||||||||||||||||
1 | 2 | 27 | 2505 | 2565 | 0.1982 | 0.0026 ppm | 9M01W7D | ||||||||||||||||||||||||||||||||||
1 | 21 | 27 | 2505 | 2565 | 0.1945 | 0.0026 ppm | 9M07W7D | ||||||||||||||||||||||||||||||||||
1 | 22 | 27 | 2510 | 2540.2 | 0.1824 | 0.0026 ppm | 37M6G7D | ||||||||||||||||||||||||||||||||||
1 | 23 | 27 | 2510 | 2540.2 | 0.1633 | 0.0026 ppm | 37M4W7D | ||||||||||||||||||||||||||||||||||
1 | 24 | 27 | 2510 | 2540.2 | 0.1476 | 0.0026 ppm | 37M7W7D | ||||||||||||||||||||||||||||||||||
1 | 25 | 27 | 2510 | 2545.1 | 0.2344 | 0.0026 ppm | 37M7W7D | ||||||||||||||||||||||||||||||||||
1 | 26 | 27 | 2510 | 2545.1 | 0.2123 | 0.0026 ppm | 33M2W7D | ||||||||||||||||||||||||||||||||||
1 | 27 | 27 | 2510 | 2545.1 | 0.2089 | 0.0026 ppm | 32M9W7D | ||||||||||||||||||||||||||||||||||
1 | 28 | 27 | 704 | 711 | 0.2188 | 0.0102 ppm | 9M05G7D | ||||||||||||||||||||||||||||||||||
1 | 29 | 27 | 704 | 711 | 0.1954 | 0.0102 ppm | 9M01W7D | ||||||||||||||||||||||||||||||||||
1 | 3 | 27 | 704 | 711 | 0.1892 | 0.0102 ppm | 9M07W7D | ||||||||||||||||||||||||||||||||||
1 | 31 | 27 | 701.5 | 713.5 | 0.2228 | 0.0102 ppm | 4M51G7D | ||||||||||||||||||||||||||||||||||
1 | 32 | 27 | 782 | 782 | 0.2046 | 0.0088 ppm | 9M07G7D | ||||||||||||||||||||||||||||||||||
1 | 33 | 27 | 782 | 782 | 0.1875 | 0.0088 ppm | 9M03W7D | ||||||||||||||||||||||||||||||||||
1 | 34 | 27 | 782 | 782 | 0.1824 | 0.0088 ppm | 9M05W7D | ||||||||||||||||||||||||||||||||||
1 | 35 | 27 | 779.5 | 784.5 | 0.2089 | 0.0088 ppm | 4M50G7D | ||||||||||||||||||||||||||||||||||
1 | 36 | 9 | 793 | 793 | 0.2042 | 0.0044 ppm | 9M07G7D | ||||||||||||||||||||||||||||||||||
1 | 37 | 9 | 793 | 793 | 0.1652 | 0.0044 ppm | 8M99W7D | ||||||||||||||||||||||||||||||||||
1 | 38 | 9 | 793 | 793 | 0.1629 | 0.0044 ppm | 9M03W7D | ||||||||||||||||||||||||||||||||||
1 | 39 | 9 | 790.5 | 795.5 | 0.1845 | 0.0044 ppm | 4M49W7D | ||||||||||||||||||||||||||||||||||
1 | 4 | 9 | 790.5 | 795.5 | 0.1858 | 0.0044 ppm | 4M50W7D | ||||||||||||||||||||||||||||||||||
1 | 41 | 27 | 709 | 711 | 0.2188 | 0.0102 ppm | 9M05G7D | ||||||||||||||||||||||||||||||||||
1 | 42 | 27 | 709 | 711 | 0.1954 | 0.0102 ppm | 9M01W7D | ||||||||||||||||||||||||||||||||||
1 | 43 | 27 | 709 | 711 | 0.1892 | 0.0102 ppm | 9M07W7D | ||||||||||||||||||||||||||||||||||
1 | 44 | 27 | 706.5 | 713.5 | 0.2228 | 0.0102 ppm | 4M51G7D | ||||||||||||||||||||||||||||||||||
1 | 45 | 24E | 1860 | 1905 | 0.2636 | 0.002 ppm | 18M4G7D | ||||||||||||||||||||||||||||||||||
1 | 46 | 24E | 1860 | 1905 | 0.2143 | 0.002 ppm | 18M3W7D | ||||||||||||||||||||||||||||||||||
1 | 47 | 24E | 1860 | 1905 | 0.2148 | 0.002 ppm | 18M3W7D | ||||||||||||||||||||||||||||||||||
1 | 48 | 24E | 1855 | 1910 | 0.2239 | 0.002 ppm | 9M07W7D | ||||||||||||||||||||||||||||||||||
1 | 49 | 24E | 1855 | 1910 | 0.2213 | 0.002 ppm | 9M05W7D | ||||||||||||||||||||||||||||||||||
1 | 5 | 22H | 831.5 | 841.5 | 0.2307 | 0.0078 ppm | 13M5G7D | ||||||||||||||||||||||||||||||||||
1 | 51 | 22H | 831.5 | 841.5 | 0.2109 | 0.0078 ppm | 13M5W7D | ||||||||||||||||||||||||||||||||||
1 | 52 | 22H | 831.5 | 841.5 | 0.2004 | 0.0078 ppm | 13M4W7D | ||||||||||||||||||||||||||||||||||
1 | 53 | 9 | 821.5 | 821.5 | 0.2275 | 0.0084 ppm | 13M4G7D | ||||||||||||||||||||||||||||||||||
1 | 54 | 9 | 821.5 | 821.5 | 0.1977 | 0.0084 ppm | 13M4W7D | ||||||||||||||||||||||||||||||||||
1 | 55 | 9 | 821.5 | 821.5 | 0.1892 | 0.0084 ppm | 13M5W7D | ||||||||||||||||||||||||||||||||||
1 | 56 | 9 | 816.5 | 821.5 | 0.2512 | 0.0084 ppm | 4M50G7D | ||||||||||||||||||||||||||||||||||
1 | 57 | 9 | 816.5 | 821.5 | 0.2213 | 0.0084 ppm | 4M50W7D | ||||||||||||||||||||||||||||||||||
1 | 58 | 9 | 816.5 | 821.5 | 0.2198 | 0.0084 ppm | 4M51W7D | ||||||||||||||||||||||||||||||||||
1 | 59 | 27 | 2310 | 2310 | 0.103 | 0.0017 ppm | 9M01G7D | ||||||||||||||||||||||||||||||||||
1 | 6 | 27 | 2310 | 2310 | 0.0881 | 0.0017 ppm | 8M99W7D | ||||||||||||||||||||||||||||||||||
1 | 61 | 27 | 2310 | 2310 | 0.0857 | 0.0017 ppm | 8M99W7D | ||||||||||||||||||||||||||||||||||
1 | 62 | 27 | 2307.5 | 2312.5 | 0.0861 | 0.0017 ppm | 4M51W7D | ||||||||||||||||||||||||||||||||||
1 | 63 | 27 | 2580 | 2610 | 0.228 | 0.002 ppm | 18M3G7D | ||||||||||||||||||||||||||||||||||
1 | 64 | 27 | 2580 | 2610 | 0.1875 | 0.002 ppm | 18M3W7D | ||||||||||||||||||||||||||||||||||
1 | 65 | 27 | 2580 | 2610 | 0.1758 | 0.002 ppm | 18M4W7D | ||||||||||||||||||||||||||||||||||
1 | 66 | 27 | 2575 | 2615 | 0.1766 | 0.002 ppm | 9M05W7D | ||||||||||||||||||||||||||||||||||
1 | 67 | 27 | 2580 | 2590.2 | 0.2014 | 0.002 ppm | 37M7G7D | ||||||||||||||||||||||||||||||||||
1 | 68 | 27 | 2580 | 2590.2 | 0.1641 | 0.002 ppm | 37M7W7D | ||||||||||||||||||||||||||||||||||
1 | 69 | 27 | 2580 | 2590.2 | 0.1197 | 0.002 ppm | 37M6W7D | ||||||||||||||||||||||||||||||||||
1 | 7 | 27 | 2577.5 | 2597.5 | 0.2018 | 0.002 ppm | 28M7G7D | ||||||||||||||||||||||||||||||||||
1 | 71 | 27 | 2506 | 2680 | 0.228 | 0.002 ppm | 18M3G7D | ||||||||||||||||||||||||||||||||||
1 | 72 | 27 | 2506 | 2680 | 0.1875 | 0.002 ppm | 18M3W7D | ||||||||||||||||||||||||||||||||||
1 | 73 | 27 | 2506 | 2680 | 0.1758 | 0.002 ppm | 18M4W7D | ||||||||||||||||||||||||||||||||||
1 | 74 | 27 | 2501 | 2685 | 0.1766 | 0.002 ppm | 9M05W7D | ||||||||||||||||||||||||||||||||||
1 | 75 | 27 | 2506 | 2660.2 | 0.2014 | 0.002 ppm | 37M7G7D | ||||||||||||||||||||||||||||||||||
1 | 76 | 27 | 2506 | 2660.2 | 0.1641 | 0.002 ppm | 37M7W7D | ||||||||||||||||||||||||||||||||||
1 | 77 | 27 | 2506 | 2660.2 | 0.1197 | 0.002 ppm | 37M6W7D | ||||||||||||||||||||||||||||||||||
1 | 78 | 27 | 2506 | 2665.1 | 0.2495 | 0.002 ppm | 32M9G7D | ||||||||||||||||||||||||||||||||||
1 | 79 | 27 | 2506 | 2665.1 | 0.2148 | 0.002 ppm | 33M1W7D | ||||||||||||||||||||||||||||||||||
1 | 8 | 27 | 1720 | 1770 | 0.246 | 0.0023 ppm | 18M4G7D | ||||||||||||||||||||||||||||||||||
1 | 81 | 27 | 1720 | 1770 | 0.2113 | 0.0023 ppm | 18M5W7D | ||||||||||||||||||||||||||||||||||
1 | 82 | 27 | 1720 | 1770 | 0.208 | 0.0023 ppm | 18M4W7D | ||||||||||||||||||||||||||||||||||
1 | 83 | 27 | 1717.5 | 1772.5 | 0.2208 | 0.0023 ppm | 13M5W7D | ||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
2 | 1 | 15B |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC