FCC ID: XMR2020EM120RGL2 LTE-A Cat 12 M.2 Module

 

X1 Carbon Gen 9 and X1 Yoga Gen 6

User Guide

Before using this documentation and the product it supports, ensure that you read and understand the

following:

Read this first

• Safety and Warranty Guide

• Setup Guide

• Generic Safety and Compliance Notices

First Edition (February 2021)

© Copyright Lenovo 2021.

LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered pursuant to a General Services

Administration “GSA” contract, use, reproduction, or disclosure is subject to restrictions set forth in Contract No. GS-

35F-05925.

Contents

Discover your Lenovo notebook. . . . . iii

Chapter 1. Meet your computer . . . . . 1

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. 1

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Front view .

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. 5

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Side view .

. 6

Bottom view .

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. 6

Specifications .

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USB specifications .

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Chapter 2. Get started with your

computer . . . . . . . . . . . . . . . . . 9

. 9

Access networks . .

. 9

. 9

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Connect to Wi-Fi networks.

Connect to the wired Ethernet

Connect to a cellular network (for selected

models)

. .

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Turn on the Airplane mode .

Interact with your computer . .

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Use the keyboard shortcuts .

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Use the TrackPoint pointing device .

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Use the trackpad .

Use the touch screen (for selected models)

Connect to an external display . .

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Get to know YOGA modes

. .

Use Lenovo Integrated Pen (for ThinkPad X1 Yoga

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Gen 6 only)

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. 9

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Chapter 3. Explore your computer . . 21

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Lenovo apps .

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Smart features (for selected models). .

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. 23

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Intelligent cooling . .

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Manage power .

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Set up a Bluetooth connection . .

Set up an NFC connection (for selected

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models)

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Accessories .

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Check the battery status

Charge the computer .

Change the power settings

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Purchase accessories

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Transfer data .

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Chapter 4. Secure your computer

and information . . . . . . . . . . . . 29

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. 29

Lock the computer

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. 29

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Log in with your fingerprint

. 30

Log in with your face ID (for selected models)

. .

. 30

Detect human presence (for selected models) . .

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Protect your privacy (for selected models)

Protect data against power loss (for selected

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models) .

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UEFI BIOS passwords . .

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Password types .

Set, change, or remove a password . .

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Associate your fingerprints with passwords

(for selected models) .

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Chapter 5. Configure advanced

settings. . . . . . . . . . . . . . . . . 35

. 35

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UEFI BIOS .

. 35

. 35

. 35

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. 35

. 36

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Enter the UEFI BIOS menu . .

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Navigate in the UEFI BIOS interface . .

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Set the system date and time.

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Change the startup sequence .

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Update UEFI BIOS . .

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Restore system files and settings to an earlier

. .

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point

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Restore your files from a backup .

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Reset your computer .

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Use advanced options .

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Windows automatic recovery.

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Create and use a recovery USB device .

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. 36

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Install Windows 10 and drivers . .

Recovery .

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Chapter 6. CRU replacement . . . . . 39

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CRU list .

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. 39

Disable Fast Startup and the built-in battery .

. 40

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Replace a CRU .

. 40

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Base cover assembly .

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2242 M.2 solid-state drive . .

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Chapter 7. Help and support

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Frequently asked questions .

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Error messages .

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Beep errors . .

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Self-help resources .

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Windows label

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Call Lenovo . .

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Before you contact Lenovo .

Lenovo Customer Support Center .

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Purchase additional services.

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Appendix A. Accessibility and

ergonomic information . . . . . . . . 51

© Copyright Lenovo 2021

i

Appendix B. Compliance

information . . . . . . . . . . . . . . . 55

Appendix C. Notices and

trademarks . . . . . . . . . . . . . . . 61

ii

X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Discover your Lenovo notebook

Thank you for choosing a Lenovo notebook! We are dedicated to delivering the best solution to you.

Before starting your tour, please read the following information:

• Illustrations in this documentation might look different from your product.

• Depending on the model, some optional accessories, features, software programs, and user interface

instructions might not be applicable to your computer.

• Documentation content is subject to change without notice. To get the latest documentation, go to https://

pcsupport.lenovo.com.

© Copyright Lenovo 2021

iii

iv

X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Chapter 1. Meet your computer

Front view

ThinkPad X1 Yoga Gen 6

IR camera* / Camera*

Privacy shutter (Camera cover)

Microphones

Power button with fingerprint reader

TrackPoint® pointing stick

Speaker

© Copyright Lenovo 2021

1

NFC (near field communication) mark*

Trackpad

TrackPoint buttons

Touch screen

Slide Privacy shutter to cover or uncover the camera lens. It is designed to protect your privacy.

* for selected models

Privacy shutter

Related topics

• “Log in with your face ID (for selected models)” on page 30

“Log in with your fingerprint” on page 29

“Detect human presence (for selected models)” on page 30

• “Use the touch screen (for selected models)” on page 14

• “Use the TrackPoint pointing device” on page 12

• “Use the trackpad” on page 13

• “Set up an NFC connection (for selected models)” on page 26

2

X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

ThinkPad X1 Carbon Gen 9

IR camera* / Camera*

Privacy Shutter (Camera cover)

Microphones

Power button with fingerprint reader

TrackPoint® pointing stick

Speaker

NFC (near field communication) mark*

Trackpad

TrackPoint buttons

Touch screen*

* for selected models

Chapter 1. Meet your computer

3

Slide Privacy Shutter to cover or uncover the camera lens. It is designed to protect your privacy.

ThinkShutter

Related topics

• “Log in with your face ID (for selected models)” on page 30

“Log in with your fingerprint” on page 29

“Detect human presence (for selected models)” on page 30

• “Use the touch screen (for selected models)” on page 14

• “Use the TrackPoint pointing device” on page 12

• “Use the trackpad” on page 13

• “Set up an NFC connection (for selected models)” on page 26

4

X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Side view

Power connector

Thunderbolt™ 4 connector (USB-C®)

Always on USB 3.2 connector Gen 1

Lenovo Integrated Pen (for ThinkPad X1

Yoga Gen 6 only)

Nano-SIM-card tray

Audio connector

Security-lock slot

* for selected models

Related topics

• “Connect to a cellular network (for selected models)” on page 9

• “Charge the computer” on page 24

• “Connect to an external display” on page 16

• “Use Lenovo Integrated Pen (for ThinkPad X1 Yoga Gen 6 only)” on page 18

• “USB specifications” on page 6

• “Lock the computer” on page 29

•

Chapter 1. Meet your computer

5

Bottom view

Emergency-reset hole

Speaker

Emergency-reset hole

If the computer stops responding and you cannot turn it off by pressing the power button, reset your

computer:

1. Disconnect your computer from ac power.

2. Insert a straightened paper clip into the hole to cut off power supply temporarily.

3. Connect your computer to ac power and then turn on your computer.

For detailed specifications of your computer, go to https://psref.lenovo.com.

Specifications

USB specifications

Notes:

• Depending on the model, some USB connectors might not be available on your computer.

• On very rare occasions, the USB-C compatible devices connected to the USB-C connector might

interfere with the wireless features. If your computer cannot be connected to Wi-Fi or cellular network, or if

your location cannot be pinpointed through the GPS function, detach the USB-C compatible devices from

the USB-C connector.

6

X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Connector name

Description

Connect USB-compatible devices, such as a USB keyboard, USB

mouse, USB storage device, or USB printer.

• Charge USB-C compatible devices with the output voltage and

current of 5 V and 1.5 A.

• Connect to an external display:

– USB-C to VGA: up to 1920 x 1200 pixels, 60 Hz

– USB-C to DP: up to 5120 x 3200 pixels, 60 Hz

• Connect to USB-C accessories to help expand your computer

functionality. To purchase USB-C accessories, go to https://

www.lenovo.com/accessories.

•

•

USB 2.0 connector

USB 3.2 connector Gen 1

• USB-C (3.2 Gen 1) connector

• USB-C (3.2 Gen 2) connector

•

•

Thunderbolt 3 connector (USB-C)

Thunderbolt 4 connector (USB-C)

Statement on USB transfer rate

Depending on many factors such as the processing capability of the host and peripheral devices, file

attributes, and other factors related to system configuration and operating environments, the actual transfer

rate using the various USB connectors on this device will vary and will be slower than the data rate listed

below for each corresponding device.

USB device

3.2 Gen 1 / 3.1 Gen 1

Thunderbolt 3 connector (USB-C)

Thunderbolt 4 connector (USB-C)

Data rate (Gbit/s)

5

40

40

Chapter 1. Meet your computer

7

8

X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Chapter 2. Get started with your computer

Access networks

This section helps you connect to a wireless or wired network.

Connect to Wi-Fi networks

Click the network icon in the Windows® notification area, and then select a network for connection. Provide

required information, if needed.

Connect to the wired Ethernet

To connect your computer to a local network, you need a Lenovo USB-C to Ethernet Adapter. Lenovo USB-

C to Ethernet Adapter is available as an option and shipped with some computer models. You can purchase

one from Lenovo at https://www.lenovo.com/accessories.

Connect to a cellular network (for selected models)

If your computer has a wireless wide area network (WWAN) card and a nano-SIM card installed, you can

connect to a cellular data network and get online everywhere.

© Copyright Lenovo 2021

9

Note: The cellular service is provided by authorized mobile service carriers in some countries or regions.

You must have a cellular plan from a service carrier to connect to the cellular network.

To establish a cellular connection:

1. Turn off the computer.

2. Turn over the computer to prevent nano-SIM card from falling.

3. Locate the nano-SIM card slot and insert the nano-SIM card as shown. Note the orientation of the card

and ensure that it is seated correctly.

5. Click the network icon, and then select the cellular network icon

from the list. Provide required

4. Turn over the computer and turn it on.

information, if needed.

Turn on the Airplane mode

When the Airplane mode is enabled, all wireless features are disabled.

1. Click the action center icon

in the Windows notification area.

2. Click Airplane mode to turn on the Airplane mode.

Interact with your computer

Your computer provides you various ways to navigate the screen.

Use the keyboard shortcuts

The special keys on the keyboard help you work more effectively.

https://support.lenovo.com/solutions/featurevideo

+

FnLock indicator on: standard function

FnLock indicator off: special function

Enable / disable speakers

Decrease volume

Increase volume

10

X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Invoke the special function printed as an icon on each key or standard function of

F1–F12 function keys.

Enable / disable microphones

Darken display

Brighten display

Manage external displays

Enable / disable airplane mode

Open / collapse notification center

Answer incoming calls

This function only works with some apps, such as Skype for Business 2016 and

Microsoft Teams 1.0.

By default, the function works with Skype for Business 2016. You can change the

default setting on the Vantage app.

Decline incoming calls

This function only works with some apps, such as Skype for Business 2016 and

Microsoft Teams 1.0.

By default, the function works with Skype for Business 2016. You can change the

default setting on the Vantage app.

Note: You can also press F11 to hang up ongoing calls on Skype for Business

2016.

Customize the function of this key on the Vantage app

+

+

+

+

+

+

+

Open Snipping Tool

Toggle keyboard backlight

Break operation

Pause operation

Scroll contents

Send system request

Enter sleep mode

To wake up the computer, press Fn or the power button.

Chapter 2. Get started with your computer

11

+

+

Go to beginning

Go to end

Use the TrackPoint pointing device

The TrackPoint pointing device enables you to perform all the functions of a traditional mouse, such as

pointing, clicking, and scrolling.

Use the TrackPoint pointing device

Use your finger to apply pressure to the pointing-stick nonslip cap in any direction parallel to the keyboard.

The pointer on the screen moves accordingly. The higher the pressure applied, the faster the pointer moves.

TrackPoint pointing stick

TrackPoint buttons

The left-click button and right-click button correspond to the left and right buttons on a traditional mouse.

Press and hold the dotted middle button while using your finger to applying pressure to the pointing stick in

the vertical or horizontal direction. Then, you can scroll through the document, Web site, or apps.

Disable the TrackPoint pointing device

The TrackPoint pointing device is active by default. To disable the device:

1. Open the Start menu, and then click Settings ➙ Devices ➙ Mouse.

2. Follow the on-screen instructions to disable TrackPoint.

12

X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Replace the pointing-stick nonslip cap

Note: Ensure that the new cap has grooves a .

You can use the trackpad to perform all the pointing, clicking, and scrolling functions of a traditional mouse.

Use the trackpad

Use the trackpad

Left-click zone

Right-click zone

Chapter 2. Get started with your computer

13

Use the touch gestures

Tap once to select or open an item.

Tap twice quickly to display a shortcut menu.

Two-finger zoom in or zoom out.

Scroll through items.

Open the task view to see all open windows.

Show the desktop.

Notes:

• When using two or more fingers, ensure that you position your fingers slightly apart.

• Some gestures are not available if the last action was done from the TrackPoint pointing device.

• Some gestures are only available when you are using certain apps.

• If the trackpad surface is stained with oil, turn off the computer first. Then, gently wipe the trackpad

surface with a soft and lint-free cloth moistened with lukewarm water or computer cleaner.

For more gestures, see the help information of the pointing device.

Disable the trackpad

The trackpad is active by default. To disable the device:

1. Open the Start menu, and then click Settings ➙ Devices ➙ Touchpad.

2. In the Touchpad section, turn off the Touchpad control.

Use the touch screen (for selected models)

If your computer display supports the multi-touch function, you can navigate the screen with simple touch

gestures.

Note: Some gestures might not be available when you are using certain apps.

14

X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Tap once to single click

Tap twice quickly to double-click

Tap and hold to right-click

Slide to scroll through items

Zoom out

Zoom in

Swipe from the left: view all open windows

Swipe from the right: open action center

Swipe downwards shortly: show title bar

Swipe downwards: close the current app

Drag

Chapter 2. Get started with your computer

15

Maintenance tips:

• Turn off the computer before cleaning the touch screen.

• Use a dry, soft, and lint-free cloth or a piece of absorbent cotton to remove fingerprints or dust from the

touch screen. Do not apply solvents to the cloth.

• The touch screen is a glass panel covered with a plastic film. Do not apply pressure or place any metallic

object on the screen, which might damage the touch panel or cause it to malfunction.

• Do not use fingernails, gloved fingers, or inanimate objects for input on the screen.

• Regularly calibrate the accuracy of the finger input to avoid a discrepancy.

Connect to an external display

Connect your computer to a projector or a monitor to give presentations or expand your workspace.

Connect to a wired display

If your computer cannot detect the external display, right-click a blank area on the desktop, and then click

Display settings ➙ Detect.

Supported resolution

The following table lists the supported maximum resolution of the external display.

Connect the external display to

Supported resolution

Thunderbolt 4 connectors (USB-C)

Up to 5120 x 3200 pixels / 60 Hz

HDMI™ connector

Up to 3840 x 2160 pixels / 60 Hz

Connect to a wireless display

To use a wireless display, ensure that both your computer and the external display support the Miracast®

feature.

Press

+

and then select a wireless display to connect with.

Set the display mode

Press

or

and then select a display mode of your preference.

16

X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Change display settings

1. Right-click a blank area on the desktop and select Display settings.

2. Select the display that you want to configure.

3. Change display settings of your preference.

You can change the settings for both the computer display and the external display. For example, you can

define which one is the main display and which one is the secondary display. You also can change the

resolution and orientation.

Get to know YOGA modes

Rotate the display to switch among different YOGA modes according to your preference. The keyboard and

the pointing devices are automatically disabled in the stand mode, tent mode, and tablet mode. Use the

touch screen to control your computer instead.

Attention: Do not rotate the computer display with too much force, or apply too much force to the upper-

right or upper-left corner of the computer display. Otherwise the computer display or hinges might get

damaged.

Chapter 2. Get started with your computer

17

Notebook mode

Stand mode

Tent mode

Tablet mode

Use Lenovo Integrated Pen (for ThinkPad X1 Yoga Gen 6 only)

The garaged rechargeable electronic Lenovo Integrated Pen enables a more precise and easier way of

writing and sketching.

Eraser button

Right-click button

Lneovo Integrated Pen is not waterproof. Keep the pen away from water and excessive moisture. To

purchase Lenovo Integrated Pen, go to https://www.lenovo.com/accessories.

18

X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Charge Lenovo Integrated Pen

1. Ensure that your computer is on or in sleep mode.

2. Insert the pen back into the pen slot. The pen is 80% charged in about 15 seconds and 100% charged

in about five minutes.

Chapter 2. Get started with your computer

19

20

X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Chapter 3. Explore your computer

This section provides introduction to the Vantage and Lenovo Quick Clean apps.

Lenovo apps

The Vantage app

The preinstalled Vantage app is a customized one-stop solution to help you maintain your computer with

automated updates and fixes, configure hardware settings, and get personalized support.

To access the Vantage app, type Vantage in the search box.

Key features

The Vantage app enables you to:

• Know the device status easily and customize device settings.

• Download and install UEFI BIOS, firmware, and driver updates to keep your computer up-to-date.

• Monitor your computer health, and secure your computer against outside threats.

• Scan your computer hardware and diagnose hardware problems.

• Look up warranty status (online).

• Access User Guide and helpful articles.

Notes:

• The available features vary depending on the computer model.

• The Vantage app makes periodic updates of the features to keep improving your experience with your

computer. The description of features might be different from that on your actual user interface.

Lenovo Quick Clean

Depending on the model, your computer might support the Lenovo Quick Clean feature. The preinstalled

Lenovo Quick Clean enables you to temporarily disable the keyboard, screen, trackpad, and TrackPoint

pointing device for cleaning.

To access Lenovo Quick Clean, do one of the following:

• Open the Start menu and click Lenovo Quick Clean.

• Type Lenovo Quick Clean in the search box.

• Press Fn and the right Shift key at the same time.

To download the latest version of Lenovo Quick Clean, go to https://pcsupport.lenovo.com.

Smart features (for selected models)

Your computer might be preinstalled with Glance by Mirametrix. Glance can capture your eye direction and

head position through camera and makes your computer smarter and more efficient.

© Copyright Lenovo 2021

21

Access Glance by Mirametrix

• Open the Start menu and click Glance by Mirametrix.

• Use Windows Search.

Note: If Glance is uninstalled, you can request it through https://support.lenovo.com/contactus for applicable

system.

Depending on the model, some features might not be available on your computer.

Explore key features

• Protect privacy

– Presence Detection: Keep your computer awake when in use and automatically lock the computer

when your head moves out of the camera range.

– Privacy Alert: When a shoulder surfer is detected, an alert icon appears on your computer screen.

– Privacy Guard: When a shoulder surfer is detected, your screen is blurred. Press Alt+F2 to cancel the

blur effect.

+F2 to cancel the blur effect.

– Smart Display: Blur screens you are not looking at. If you look away, all screens are blurred. Press Alt

Note: If your computer comes with an ePrivacy screen, it can work with Glance to achieve better privacy

protection. For details, go to https://support.lenovo.com/us/en/videos/vid500144.

• Improve productivity

– Smart Player: Pause the media player when you look away from the screen. Smart Player might not

work when you are using certain media players.

– Snap Window: When your computer is connected to external displays and you select a window, the

window automatically snaps to the top center of the screen you are facing.

– Smart Pointer: Relocate the Windows pointer to the screen you are facing. When the pointer moves

from screen to screen, it is momentarily drawn large.

Note: Snap Window and Smart Pointer only work with external displays. External displays should be

positioned beside the computer on its same level.

22

X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

• Promote digital wellness

– Posture check: Remind you if you hunch toward the screen while using the computer.

– 20/20/20 Alert: Remind you to look away from the screen for 20 seconds every 20 minutes.

•

•

•

•

•

The Intelligent Cooling feature helps you adjust fan speed, computer temperature and performance. This

feature works in auto mode by default. Press Fn+T to switch between manual mode and auto mode.

Intelligent cooling

Manual mode

Quiet mode: the least fan noise

Balanced mode: balanced performance and fan noise

Performance mode: the highest performance and normal fan noise

on ac power

on battery power

Do the following to select the preferred mode:

1. Click the battery status icon in the Windows notification area.

2. Move the slider to the left or right to select your preferred mode.

Auto mode

of system activity.

Auto battery mode: Switch between quiet mode and battery mode automatically based on the amount

Auto performance mode: Switch among quiet mode, balanced mode and performance mode

automatically based on the amount of system activity.

Chapter 3. Explore your computer

23

Use the information in this section to achieve the best balance between performance and power efficiency.

Manage power

Check the battery status

Click the battery icon in the Windows notification area to check the battery status, view the current power

plan, change the power mode, and access battery settings quickly. For more details about your battery, refer

to the Vantage app.

Charge the computer

Use ac power

Notes: To maximize the life of the battery:

• Use the battery until the charge is depleted and recharge the battery completely before using it. Once the

battery is fully charged, it must discharge to 94% or lower before it will be allowed to recharge again.

• The battery may optimize its full charge capacity based on your usage. After prolonged periods of limited

use, full battery capacity may not be available until you discharge to as low as 20% and recharge

completely. For more information, refer to the power section of the Vantage app.

24

X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Use P-to-P 2.0 (Peer to Peer 2.0) charging function

Both Thunderbolt 4 connectors (USB-C) on the computer feature the Lenovo-unique P-to-P 2.0 charging

function. To use the function, ensure that Always On USB and Charge in Battery Mode are enabled in UEFI

BIOS of your computers, so that the function works even when the computers are off or in hibernation mode.

To enable Always On USB and Charge in Battery Mode:

1. Press F1 to enter the UEFI BIOS menu.

2. Click Config ➙ USB, and then to enable Always On USB and Charge in Battery Mode.

• When no ac power is available:

Note: The remaining battery power of computer A should be at least 30% and be 3% higher than that of

computer B.

• When ac power is available:

Note: The actual charging speed of your computer depends on many factors, such as the remaining battery

power of the computers, the wattage of the ac power adapter, and whether you are using the computers.

Change the power settings

For ENERGY STAR® compliant computers, the following power plan takes effect when your computer has

been idle for a specified duration:

• Turn off the display: After 10 minutes

• Put the computer to sleep: After 30 minutes

To reset the power plan:

1. Right-click the battery status icon and select Power Options.

2. Choose or customize a power plan of your preference.

To reset the power button function:

2. Change the settings as you prefer.

1. Right-click the battery status icon and select Power Options ➙ Choose what the power buttons do.

Chapter 3. Explore your computer

25

Transfer data

Quickly share your files using the built-in Bluetooth or NFC technology among devices with the same

features.

Set up a Bluetooth connection

You can connect all types of Bluetooth-enabled devices to your computer, such as a keyboard, a mouse, a

smartphone, or speakers. To ensure successful connection, place the devices at most 10 meters (33 feet)

from the computer.

1. Click the action center icon

in the Windows notification area, and enable the Bluetooth feature.

2. Right-click the Bluetooth icon.

3. Select Go To Settings ➙ Add Bluetooth or other device ➙ Bluetooth.

4. Select a Bluetooth device, and then follow the on-screen instructions.

Set up an NFC connection (for selected models)

If your computer supports NFC, you will see an NFC mark

around the trackpad area.

To turn on NFC:

1. Open the Start menu and click Settings ➙ Network & Internet ➙ Airplane mode.

2. Ensure that the Airplane mode is off and turn on the NFC function.

By using NFC, you can simply tap the left side of the trackpad to pair you computer with an NFC card or

NFC-enabled device.

Note: Ensure that the NFC card is in NFC Data Exchange Format (NDEF), otherwise the card cannot be

detected.

Accessories

This section provides instructions on how to use hardware accessories to expand your computer

functionalities.

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Purchase accessories

Lenovo has a number of hardware accessories and upgrades to help expand the functionalities of your

computer. Options include memory modules, storage devices, network cards, port replicators or docking

stations, batteries, power adapters, keyboards, mice, and more.

To shop at Lenovo, go to https://www.lenovo.com/accessories.

Chapter 3. Explore your computer

27

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Chapter 4. Secure your computer and information

Lock the computer

Lock your computer to a desk, table, or other fixtures through a compatible security cable lock.

Note: The slot supports cable locks that conform to the Kensington NanoSaver® lock standards using

Cleat™ locking technology. You are responsible for evaluating, selecting, and implementing the locking

device and security feature. Lenovo is not responsible for the locking device and security feature. You can

purchase the cable locks at https://smartfind.lenovo.com.

Log in with your fingerprint

The fingerprint reader is combined with the power button. You can use it to enroll your fingerprints. After

enrollment, you can tap your finger on the fingerprint reader to log in to Windows.

1. Open the Start menu and then click Settings ➙ Accounts ➙ Sign-in options.

2. Follow the on-screen instructions to finish the enrollment.

Note: It is recommended that you put your finger at the middle of the fingerprint reader during

enrollment and enroll more than one fingerprint in case of any injuries to your fingers. After the

enrollment, the fingerprints are associated with the Windows password automatically.

3. Log in with your fingerprint. When the fingerprint reader indicator is solid green, tap your finger on the

fingerprint reader for authentication.

Associate your fingerprints with UEFI BIOS passwords

You can associate your fingerprints with your power-on password and hard disk password. See “Associate

your fingerprints with passwords (for selected models)” on page 34.

Maintenance tips:

© Copyright Lenovo 2021

29

• Do not scratch the surface of the reader with anything hard.

• Do not use or touch the reader with a wet, dirty, wrinkled, or injured finger.

Log in with your face ID (for selected models)

Create your face ID and unlock your computer by scanning your face:

1. Open the Start menu and click Settings ➙ Accounts ➙ Sign-in options.

2. Locate the Password section and click Add to create a password.

3. Locate the Windows Hello Face section and click Set up under Face Recognition. Then, click Get

Started. The camera preview starts.

4. Follow the on-screen instructions to create a Personal Identification Number (PIN) and complete the

setup.

5. Click Improve Recognition to improve the image so that Windows Hello can recognize you in different

light conditions or when your appearance changes.

6. Look straight at the camera to log in with your face ID.

Detect human presence (for selected models)

With a face ID created, your computer can support human presence detection.

• Unlock or wake up the computer automatically. You need to face the camera and be at most 1.4 meters

(4.6 feet) from the computer. The function does not work when your computer is in hibernation mode or

has been turned off.

• Dim the display and lock the computer when you are leaving. The function does not work if you set the

power options to never turn off the display.

The human presence sensor is enabled by default. To disable the function:

1. Restart the computer. When the logo screen is displayed, press F1 to enter the UEFI BIOS menu.

2. Select Security ➙ I/O Port Access, and then turn on or turn off Human Presence Sensor.

To customize the sensitivity of human presence detection:

1. Restart the computer. When the logo screen is displayed, press F1 to enter the UEFI BIOS menu.

2. Select Security ➙ Intelligent Security, and then follow the on-screen instructions.

Notes:

• These features might not work when your computer is in tent, tablet, or stand mode.

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• If the Airplane mode is enabled, human presence detection is disabled.

• Your computer uses a human presence sensor to detect your presence and the IR camera to recognize

your face. Lenovo does not collect any personal data. For some countries or regions, the human presence

sensor is disabled according to local regulations.

Protect your privacy (for selected models)

Use the ePrivacy screen

Your computer might come with an ePrivacy screen. It can reduce screen visibility from side angles to

protect screen content against visual hacking. By default, this function is disabled. You can press F12 or Fn

+D to enable it. You will be prompted by the on-screen icon

disabled.

every time the function is enabled or

or

Your ePrivacy screen can work in case that you are required to input passwords. By default, this automatic

function for passwords is disabled. You can enable it on the Vantage app.

The ePrivacy screen also can work with the preinstalled Glance app to better protect your privacy. For

details, go to https://support.lenovo.com/us/en/videos/vid500144.

Set the privacy level

The privacy level of this function varies depending on the screen brightness level, the contrast ratio, and the

physical environment where you are using this function.

• Press

to increase the privacy level.

• Press

to decrease the privacy level.

Protect data against power loss (for selected models)

NVMe (Non-Volatile Memory express) M.2 solid-state drive features the Lenovo-unique PLP (Power Loss

Protection) function to avoid data loss or damage. If your computer is not responding and you might have to

shut down your computer by pressing and holding the power button for several seconds. In this case, the

PLP function enables your computer data to be saved timely. However, there is no guarantee that all data is

saved in any situation. To check the type of your M.2 solid-state drive:

1. Restart the computer. When the logo screen is displayed, press F10 to enter the Lenovo diagnostics

window.

2. On the TOOLS tab, select SYSTEM INFORMATION ➙ STORAGE using the arrow keys.

3. Locate the Device Type section to check the information

You can set passwords in UEFI (Unified Extensible Firmware Interface) BIOS (Basic Input/Output System) to

strengthen the security of your computer.

UEFI BIOS passwords

Password types

You can set a power-on password, supervisor password, system management password, or hard disk

password in UEFI BIOS to prevent unauthorized access to your computer. However, you are not prompted to

enter any UEFI BIOS password when your computer resumes from sleep mode.

Chapter 4. Secure your computer and information

31

If you set a power-on password, a window is displayed on the screen when you turn on the computer. Enter

the correct password to use the computer.

Power-on password

Supervisor password

The supervisor password protects the system information stored in UEFI BIOS. When entering the UEFI

BIOS menu, enter the correct supervisor password in the window prompted. You also can press Enter to

skip the password prompt. However, you cannot change most of the system configuration options in UEFI

BIOS.

If you have set both the supervisor password and power-on password, you can use the supervisor password

to access your computer when you turn it on. The supervisor password overrides the power-on password.

System management password

The system management password can also protect the system information stored in UEFI BIOS like a

supervisor password, but it has lower authority by default. The system management password can be set

through the UEFI BIOS menu or through Windows Management Instrumentation (WMI) with the Lenovo

client-management interface.

You can enable the system management password to have the same authority as the supervisor password

to control security-related features. To customize the authority of the system management password through

the UEFI BIOS menu:

1. Restart the computer. When the logo screen is displayed, press F1 to enter the UEFI BIOS menu.

2. Select Security ➙ Password ➙ System Management Password Access Control.

3. Follow the on-screen instructions.

If you have set both the supervisor password and the system management password, the supervisor

password overrides the system management password. If you have set both the system management

password and the power-on password, the system management password overrides the power-on

password.

The hard disk password prevents unauthorized access to the data on the storage drive. When a hard disk

password is set, you are prompted to type a correct password each time you try to access the storage drive.

Hard disk passwords

• User hard disk password only

When a user hard disk password is set without a master hard disk password, the user must enter the user

hard disk password to access files and applications on the storage drive.

• Master hard disk password + User hard disk password

The master hard disk password is set and used by a system administrator. It enables the administrator to

access any storage drive in a system or any computer connected in the same network. The administrator

can also assign a user hard disk password for each computer in the network. The user of the computer

can change the user hard disk password as desired, but only the administrator can remove the user hard

disk password.

When prompted to enter a hard disk password, press F1 to switch between the master hard disk password

and user hard disk password.

Notes: The hard disk password is not available in the following situations:

• A Trusted Computing Group (TCG) Opal-compliant storage drive and a TCG Opal management software

program are installed in the computer, and the TCG Opal management software program is activated.

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• An eDrive storage drive is installed in the computer preinstalled with the Windows 10 operating system.

Set, change, or remove a password

Before you start, print these instructions.

1. Restart the computer. When the logo screen is displayed, press F1 to enter the UEFI BIOS menu.

2. Select Security ➙ Password by using the arrow keys.

3. Select the password type. Then, follow the on-screen instructions to set, change, or remove a

password.

You should record all your passwords and store them in a safe place. If you forget any of your passwords,

any potential repair actions required are not covered under warranty.

What to do if you forget your power-on password

If you forget your power-on password, do the following to remove the power-on password:

• If you have set a supervisor password or a system management password and remember it:

1. Restart the computer. When the logo screen is displayed, immediately press F1.

2. Type the supervisor password or the system management password to enter the UEFI BIOS menu.

3. Select Security ➙ Password ➙ Power-On Password by using the arrow keys.

4. Type the current supervisor password or the system management password in the Enter Current

Password field. Then, leave the Enter New Password field blank, and press Enter twice.

5. In the Changes have been saved window, press Enter.

6. Press F10 to save changes and exit the UEFI BIOS menu.

• If you have not set a supervisor password or a system management password, contact a Lenovo

authorized service provider to have the power-on password removed.

What to do if you forget your system management password

If you forget your system management password, do the following to remove the system management

password:

• If you have set a supervisor password and remember it:

1. Restart the computer. When the logo screen is displayed, immediately press F1.

2. Type the supervisor password to enter the UEFI BIOS menu.

3. Select Security ➙ Password ➙ System Management Password by using the arrow keys.

4. Type the current supervisor password in the Enter Current Password field. Then, leave the Enter

New Password field blank, and press Enter twice.

5. In the Changes have been saved window, press Enter.

6. Press F10 to save changes and exit the UEFI BIOS menu.

system management password removed.

What to do if you forget your hard disk password

• If you have not set a supervisor password, contact a Lenovo authorized service provider to have the

If you forget your user hard disk password or both user and master hard disk passwords, there is no service

procedure to remove the password or recover data from the storage drive. You can contact a Lenovo

authorized service provider to have the storage drive replaced. A fee will be charged for parts and service. If

the storage drive is a CRU (Customer Replaceable Unit), you can also contact Lenovo to purchase a new

storage drive to replace the old one by yourself. To check whether the storage drive is a CRU and the

relevant replacement procedure, see Chapter 6 “CRU replacement” on page 39.

Chapter 4. Secure your computer and information

33

What to do if you forget your supervisor password

If you forget your supervisor password, there is no service procedure to remove the password. You can

contact a Lenovo authorized service provider to have the system board replaced. A fee will be charged for

parts and service.

Associate your fingerprints with passwords (for selected models)

Do the following to associate your fingerprints with the power-on password and hard disk password:

1. Turn off and then turn on the computer.

2. When prompted, scan your finger on the fingerprint reader.

3. Enter your power-on password, hard disk password, or both as required. The association is established.

When you start the computer again, you can use your fingerprints to log in to the computer without entering

your Windows password, power-on password, or hard disk password. To change settings, press F1 to enter

the UEFI BIOS menu, and then select Security ➙ Fingerprint.

Attention: If you always use your fingerprint to log in to the computer, you might forget your passwords.

Write down your passwords, and keep them in a safe place.

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Chapter 5. Configure advanced settings

UEFI BIOS

UEFI BIOS is the first program that the computer runs. When the computer turns on, UEFI BIOS performs a

self test to make sure that various devices in the computer are functioning.

Enter the UEFI BIOS menu

Restart the computer. When the logo screen is displayed, press F1 to enter the UEFI BIOS menu.

Navigate in the UEFI BIOS interface

You can navigate in the UEFI BIOS interface by pressing the following keys:

• F1: General Help

• F9: Setup Defaults

• F10: Save and Exit

• F5 / F6: Change boot priority order

• ↑↓ or PgUp / PgDn: Select / Scroll page

• ← →: Move keyboard focus

• Esc: Back / Close dialog

• Enter: Select / Open submenu

Set the system date and time

1. Restart the computer. When the logo screen is displayed, press F1.

2. Select Date/Time and set the system date and time as desired.

3. Press F10 to save changes and exit.

Change the startup sequence

1. Restart the computer. When the logo screen is displayed, press F1.

2. Select Startup ➙ Boot. Then, press Enter. The default device order list is displayed.

Note: No bootable device is displayed if the computer cannot start from any devices or the operating

system cannot be found.

3. Set the startup sequence as desired.

4. Press F10 to save the changes and exit.

To change the startup sequence temporarily:

1. Restart the computer. When the logo screen is displayed, press F12.

2. Select the device that you want the computer to start from and press Enter.

Update UEFI BIOS

When you install a new program, device driver, or hardware component, you might need to update UEFI

BIOS.

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35

Download and install the latest UEFI BIOS update package by one of the following methods:

• Open the Vantage app to check the available update packages. If the latest UEFI BIOS update package is

available, follow the on-screen instructions to download and install the package.

• Go to https://pcsupport.lenovo.com and select the entry for your computer. Then, follow the on-screen

instructions to download and install the latest UEFI BIOS update package.

To know more about UEFI BIOS, visit Knowledge Base of your computer at https://pcsupport.lenovo.com.

Recovery

This section introduces the recovery information of the Windows 10 operating system. Ensure that you read

and follow the on-screen recovery instructions. The data on your computer might be deleted during the

recovery process. To avoid data loss, make a backup copy of all the data that you want to keep.

Restore system files and settings to an earlier point

1. Go to Control Panel and view by Large icons or Small icons.

2. Click Recovery ➙ Open System Restore. Then, follow the on-screen instructions.

Restore your files from a backup

Note: If you use the File History tool to restore your files from a backup, ensure that you backed up your

data earlier with the tool.

1. Go to Control Panel and view by Large icons or Small icons.

2. Click File History ➙ Restore personal files. Then, follow the on-screen instructions.

Reset your computer

In the resetting process, you can choose to keep your files or remove them when you reinstall the operating

system.

Note: The items in the graphical user interface (GUI) might change without notice.

1. Open the Start menu, and then click Settings ➙ Update & Security ➙ Recovery.

2. In the Reset this PC section, click Get started.

3. Follow the on-screen instructions to reset your computer.

Use advanced options

Note: The items in the graphical user interface (GUI) might change without notice.

1. Open the Start menu, and then click Settings ➙ Update & security ➙ Recovery.

2. In the Advanced startup section, click Restart now ➙ Troubleshoot ➙ Advanced options.

3. Select a preferred option, and then follow the on-screen instructions.

Windows automatic recovery

Note: Ensure that your computer is connected to ac power during the recovery process.

The Windows recovery environment on your computer operates independently from the Windows 10

operating system. It enables you to recover or repair the operating system even if the Windows 10 operating

system fails to start.

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After two consecutive failed boot attempts, the Windows recovery environment starts automatically. Then

you can choose repair and recovery options by following the on-screen instructions.

To know more about recovery information, visit Knowledge Base of your computer at https://

pcsupport.lenovo.com.

Create and use a recovery USB device

It is recommended that you create a recovery USB drive as early as possible as a backup for the Windows

recovery programs. With the recovery USB drive, you can troubleshoot and fix the problems even if the

preinstalled Windows recovery programs are damaged. If you did not create a recovery USB drive as a

precautionary measure, you can contact Lenovo Customer Support Center and purchase one from Lenovo.

For a list of the Lenovo Support phone numbers for your country or region, go to:

https://pcsupport.lenovo.com/supportphonelist

Create a recovery USB drive

Attention: The creation process deletes anything stored on the USB drive. To avoid data loss, make a

backup copy of all the data that you want to keep.

1. Ensure that your computer is connected to ac power.

2. Prepare a USB drive with at least 16 GB of storage capacity. The actual USB capacity required depends

on the size of the recovery image.

3. Connect the prepared USB drive to the computer.

4. Type recovery in the search box. Then, click Create a recovery drive.

5. Click Yes in the User Account Control window to allow the Recovery Media Creator program to start.

6. In the Recovery Drive window, follow the on-screen instructions to create a recovery USB drive.

Use the recovery USB drive

1. Ensure that your computer is connected to ac power.

2. Connect the recovery USB drive to the computer.

3. Turn on or restart the computer. When the logo screen is displayed, press F12. The Boot Menu window

4. Select the recovery USB drive as the boot device. Then, follow the on-screen instructions to complete

opens.

the process.

Install Windows 10 and drivers

This section provides instructions on installing a Windows 10 operating system and device drivers.

Install a Windows 10 operating system

Microsoft constantly makes updates to the Windows 10 operating system. Before installing a particular

Windows 10 version, check the compatibility list for the Windows version. For details, go to https://

support.lenovo.com/us/en/solutions/windows-support.

Attention:

might cause security risks.

• It is recommended that you update your operating system through official channels. Any unofficial update

• The process of installing a new operating system deletes all the data on your internal storage drive,

including the data stored in a hidden folder.

Chapter 5. Configure advanced settings

37

1. If you are using the Windows BitLocker Drive Encryption feature and your computer has a Trusted

Platform Module, ensure that you have disabled the feature.

2. Ensure that the security chip is set to Active.

a. Restart the computer. When the logo screen is displayed, press F1 to enter the UEFI BIOS menu.

b. Select Security ➙ Security Chip and press Enter. The Security Chip submenu opens.

c. Ensure that the security chip for TPM 2.0 is set to Active.

d. Press F10 to save the settings and exit.

3. Connect the drive that contains the operating system installation program to the computer.

4. Restart the computer. When the logo screen is displayed, press F1 to enter the UEFI BIOS menu.

5. Select Startup ➙ Boot to display the Boot Priority Order submenu.

6. Select the drive that contains the operating system installation program, for example, USB HDD. Then,

Attention: After you change the startup sequence, ensure that you select the correct device during a

copy, a save, or a format operation. If you select the wrong device, the data on that device might be

erased or overwritten.

7. Select Restart and ensure that OS Optimized Defaults is enabled. Then, press F10 to save the settings

8. Follow the on-screen instructions to install the device drivers and necessary programs.

9. After installing the device drivers, apply Windows Update to get the latest updates, for example the

press Esc.

and exit.

security patches.

Install device drivers

You should download the latest driver for a component when you notice poor performance from that

component or when you added a component. This action might eliminate the driver as the potential cause of

a problem. Download and install the latest driver by one of the following methods:

• Open the Vantage app to check the available update packages. Select the update packages you want,

and then follow the on-screen instructions to download and install the packages.

• Go to https://pcsupport.lenovo.com and select the entry for your computer. Then, follow the on-screen

instructions to download and install necessary drivers and software.

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Chapter 6. CRU replacement

Customer Replaceable Units (CRUs) are parts that can be upgraded or replaced by the customer. The

computers contain the following types of CRUs:

• Self-service CRUs: Refer to parts that can be installed or replaced easily by customer themselves or by

trained service technicians at an additional cost.

• Optional-service CRUs: Refer to parts that can be installed or replaced by customers with a greater skill

level. Trained service technicians can also provide service to install or replace the parts under the type of

warranty designated for the customer’s machine.

If you intend on installing a CRU, Lenovo will ship the CRU to you. CRU information and replacement

instructions are shipped with your product and are available from Lenovo at any time upon request. You

might be required to return the defective part that is replaced by the CRU. When return is required: (1) return

instructions, a prepaid shipping label, and a container will be included with the replacement CRU; and (2) you

might be charged for the replacement CRU if Lenovo does not receive the defective CRU within thirty (30)

days of your receipt of the replacement CRU. For full details, see the Lenovo Limited Warranty

documentation at https://www.lenovo.com/warranty/llw_02.

CRU list

The following is a list of CRUs of your computer.

Self-service CRUs

• ac power adapter

• Base cover assembly

• Nano-SIM-card tray*

• Lenovo Integrated Pen (for ThinkPad X1 Yoga Gen 6 only)

• 2242 M.2 solid-state drive

• 2242 M.2 solid-state drive bracket

* for selected models

Disable Fast Startup and the built-in battery

Before replacing any CRU, ensure that you disable Fast Startup first and then disable the built-in battery.

To disable Fast Startup:

1. Go to Control Panel and view by Large icons or Small icons.

2. Click Power Options, and then click Choose what the power buttons do on the left pane.

3. Click Change settings that are currently unavailable at the top.

4. If prompted by User Account Control (UAC), click Yes.

5. Clear the Turn on fast startup check box, and then click Save changes.

To disable the built-in battery:

menu.

1. Restart your computer. When the logo screen is displayed, immediately press F1 to enter the UEFI BIOS

© Copyright Lenovo 2021

39

2. Select Config ➙ Power. The Power submenu is displayed.

3. Select Disable Built-in Battery and press Enter.

4. Select Yes in the Setup Confirmation window. The built-in battery is disabled and the computer turns off

automatically. Wait three to five minutes to let the computer cool.

Replace a CRU

Follow the replacement procedure to replace a CRU.

Base cover assembly

Prerequisite

Before you start, read Generic Safety and Compliance Notices and print the following instructions.

Note: Do not remove the base cover assembly when your computer is connected to ac power. Otherwise,

there might be a risk of short circuits.

For access, do the following:

1. Disable the built-in battery. See “Disable Fast Startup and the built-in battery” on page 39.

2. Turn off the computer and disconnect the computer from ac power and all connected cables.

3. Close the computer display and turn over the computer.

Removal procedure

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Installation procedure

Troubleshooting

If the computer does not start up after you reinstall the base cover assembly, disconnect the ac power

adapter and then reconnect it to the computer.

2242 M.2 solid-state drive

Prerequisite

Before you start, read Generic Safety and Compliance Notices and print the following instructions.

Attention: If you replace a 2242 M.2 solid-state drive, you might need to install a new operating system. For

details on how to install a new operating system, see “Install Windows 10 and drivers” on page 37.The M.2

solid-state drive is sensitive. Inappropriate handling might cause damage and permanent loss of data.

When handling the M.2 solid-state drive, observe the following guidelines:

• Replace the M.2 solid-state drive only for upgrade or repair. The M.2 solid-state drive is not designed for

frequent changes or replacement.

• Before replacing the M.2 solid-state drive, make a backup copy of all the data that you want to keep.

• Do not apply pressure to the M.2 solid-state drive.

• Do not touch the contact edge or circuit board of the M.2 solid-state drive. Otherwise, the M.2 solid-state

drive might get damaged.

• Do not make the M.2 solid-state drive subject to physical shocks or vibration. Put the M.2 solid-state drive

on a soft material, such as cloth, to absorb physical shocks.

For access, do the following:

1. Disable the built-in battery. See “Disable Fast Startup and the built-in battery” on page 39.

2. Turn off the computer and disconnect the computer from ac power and all connected cables.

3. Close the computer display and turn over the computer.

4. Remove the base cover assembly. See “Base cover assembly” on page 40.

Chapter 6. CRU replacement

41

Removal procedure

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Chapter 7. Help and support

Frequently asked questions

How do I access Control Panel?

• Open the Start menu and click Windows System ➙ Control Panel.

• Use Windows Search.

How do I turn off my computer?

Open the Start menu and click Power. Then, click Shut down.

How do I partition my storage

drive?

https://support.lenovo.com/solutions/ht503851

What do I do if my computer

stops responding.

What do I do if I spill liquid on the

computer?

1. Press and hold the power button until the computer turns off. Then, restart

the computer.

2. If step 1 does not work:

• For models with an emergency reset hole: Insert a straightened paper clip

into the emergency reset hole to cut off power supply temporarily. Then,

restart the computer with ac power connected.

• For models without an emergency reset hole:

– For models with the removable battery, remove the removable battery

and disconnect all power sources. Then, reconnect to ac power and

restart the computer.

– For models with the built-in battery, disconnect all power sources.

Press and hold the power button for about seven seconds. Then,

reconnect to ac power and restart the computer.

1. Carefully unplug the ac power adapter and turn off the computer immediately.

The more quickly you stop the current from passing through the computer the

more likely you will reduce damage from short circuits.

Attention: Although you might lose some data or work by turning off the

computer immediately, leaving the computer on might make your computer

unusable.

2. Do not try to drain out the liquid by turning over the computer. If your

computer has keyboard drainage holes on the bottom, the liquid will be

drained out through the holes.

3. Wait until you are certain that all the liquid is dry before turning on your

computer.

How do I enter the UEFI BIOS

menu?

Restart the computer. When the logo screen is displayed, press F1 to enter the

UEFI BIOS menu.

How do I disable my trackpad?

1. Open the Start menu, and then click Settings ➙ Devices ➙ Touchpad.

2. In the Touchpad section, turn off the Touchpad control.

Where can I get the latest device

drivers and UEFI BIOS?

“Update UEFI BIOS” on page 35.

• From the Vantage app. See “Install Windows 10 and drivers” on page 37 and

• Download from Lenovo Support Web site at https://pcsupport.lenovo.com.

© Copyright Lenovo 2021

43

Error messages

If you see a message that is not included in the following table, record the error message first, then shut

down the computer and call Lenovo for help. See “Lenovo Customer Support Center” on page 48.

Message

Solution

0190: Critical low-battery error

The computer turned off because the battery power is low. Connect the ac power

adapter to the computer and charge the batteries.

0191: System Security - Invalid

remote change requested

The system configuration change has failed. Confirm the operation and try again.

0199: System Security - Security

password retry count exceeded.

This message is displayed when you enter a wrong supervisor password more

than three times. Confirm the supervisor password and try again.

0271: Check Date and Time

settings.

The date or the time is not set in the computer. Enter the UEFI BIOS menu and set

the date and time.

210x/211x: Detection/Read error

on HDDx/SSDx

The storage drive is not working. Reinstall the storage drive. If the problem still

exists, replace the storage drive.

Note:

This error indicates that the operating system or programs cannot create, modify,

or delete data in the non-volatile system UEFI variable storage due to insufficient

storage space after POST.

The non-volatile system UEFI variable storage is used by the UEFI BIOS and by

the operating system or programs. This error occurs when the operating system

or programs store large amounts of data in the variable storage. All data needed

for POST, such as UEFI BIOS setup settings, chipset, or platform configuration

data, are stored in a separate UEFI variable storage.

Press F1 after the error message is displayed to enter the UEFI BIOS menu. A

dialog asks for confirmation to clean up the storage. If you select “Yes”, all data

that were created by the operating system or programs will be deleted except

global variables defined by the Unified Extensible Firmware Interface

Specification. If you select “No”, all data will be kept, but the operating system or

programs will not be able to create, modify, or delete data in the storage.

If this error happens at a service center, Lenovo authorized service personnel will

clean up the non-volatile system UEFI variable storage using the preceding

solution.

The thermal fan might not work correctly. After the error message is displayed,

press ESC within five seconds to start up the computer with limited performance.

Otherwise, the computer will shut down immediately. If the problem still exists

when you starts up next time, have your computer serviced.

Error: The non-volatile system

UEFI variable storage is nearly

full.

Fan error. Press ESC to startup

with limited performance.

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X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Beep errors

Lenovo SmartBeep technology enables you to decode beep errors with your smartphone when a black

screen occurs with beeps from your computer. To decode the beep error with Lenovo SmartBeep

technology:

1. Go to https://support.lenovo.com/smartbeep or scan the following QR Code.

2. Download the proper diagnostic app and install it on your smartphone.

3. Run the diagnostic app and place the smartphone near the computer.

4. Press Fn on your computer to emit the beep again. The diagnostic app decodes the beep error and

shows possible solutions on the smartphone.

Note: Do not attempt to service a product yourself unless instructed to do so by the Customer Support

Center or product documentation. Only use a Lenovo-authorized service provider to repair your product.

Chapter 7. Help and support

45

Use the following self-help resources to learn more about the computer and troubleshoot problems.

Self-help resources

Resources

Use the Vantage app to:

• Configure device settings.

• Download and install UEFI BIOS, drivers, and firmware

updates.

• Secure your computer from outside threats.

• Diagnose hardware problems.

• Check the computer warranty status.

• Access User Guide and helpful articles.

Note: The available features vary depending on the

computer model.

Product documentation:

• Safety and Warranty Guide

• Generic Safety and Compliance Notices

• Setup Guide

• This User Guide

• Regulatory Notice

Lenovo Support Web site with the latest support

information of the following:

• Drivers and software

• Diagnostic solutions

• Product and service warranty

• Product and parts details

• Knowledge base and frequently asked questions

Windows help information

Windows label

How to access?

Type Vantage in the search box.

Go to https://pcsupport.lenovo.com. Then, follow the on-

screen instructions to filter out the documentation you

want.

https://pcsupport.lenovo.com

• Open the Start menu and click Get Help or Tips.

• Use Windows Search or the Cortana® personal

assistant.

• Microsoft support Web site: https://

support.microsoft.com

Your computer might have a Windows 10 Genuine Microsoft label affixed to its cover depending on the

following factors:

• Your geographic location

• Edition of Windows 10 that is preinstalled

Go to https://www.microsoft.com/en-us/howtotell/Hardware.aspx for illustrations of the various types of

Genuine Microsoft labels.

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X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

• In the People’s Republic of China, the Genuine Microsoft label is required on all computer models

preinstalled with any version of Windows 10.

• In other countries and regions, the Genuine Microsoft label is required only on computer models licensed

for Windows 10 Pro.

The absence of a Genuine Microsoft label does not indicate that the preinstalled Windows version is not

genuine. For details on how to tell whether your preinstalled Windows product is genuine, refer to the

information provided by Microsoft at https://www.microsoft.com/en-us/howtotell/default.aspx.

There are no external, visual indicators of the Product ID or Windows version for which the computer is

licensed. Instead, the Product ID is recorded in the computer firmware. Whenever a Windows 10 product is

installed, the installation program checks the computer firmware for a valid, matching Product ID to complete

the activation.

In some cases, an earlier Windows version might be preinstalled under the terms of the Windows 10 Pro

license downgrade rights.

Call Lenovo

If you have tried to correct the problem yourself and still need help, you can call Lenovo Customer Support

Center.

Before you contact Lenovo

Prepare the following before you contact Lenovo:

1. Record the problem symptoms and details:

• What is the problem? Is it continuous or intermittent?

• Any error message or error code?

• What operating system are you using? Which version?

• Which software applications were running at the time of the problem?

• Can the problem be reproduced? If so, how?

2. Record the system information:

• Product name

• Machine type and serial number

The following illustration shows where to find the machine type and serial number of your computer.

Chapter 7. Help and support

47

Lenovo Customer Support Center

During the warranty period, you can call Lenovo Customer Support Center for help.

Telephone numbers

For a list of the Lenovo Support phone numbers for your country or region, go to https://

pcsupport.lenovo.com/supportphonelist for the latest phone numbers.

Note: Phone numbers are subject to change without notice. If the number for your country or region is not

provided, contact your Lenovo reseller or Lenovo marketing representative.

Services available during the warranty period

• Problem determination - Trained personnel are available to assist you with determining if you have a

hardware problem and deciding what action is necessary to fix the problem.

• Lenovo hardware repair - If the problem is determined to be caused by Lenovo hardware under warranty,

trained service personnel are available to provide the applicable level of service.

• Engineering change management - Occasionally, there might be changes that are required after a product

has been sold. Lenovo or your reseller, if authorized by Lenovo, will make selected Engineering Changes

(ECs) that apply to your hardware available.

Services not covered

• Replacement or use of parts not manufactured for or by Lenovo or nonwarranted parts

• Identification of software problem sources

• Configuration of UEFI BIOS as part of an installation or upgrade

• Changes, modifications, or upgrades to device drivers

• Installation and maintenance of network operating systems (NOS)

• Installation and maintenance of programs

For the terms and conditions of the Lenovo Limited Warranty that apply to your Lenovo hardware product,

go to:

• https://www.lenovo.com/warranty/llw_02

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X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

• https://pcsupport.lenovo.com/warrantylookup

Purchase additional services

During and after the warranty period, you can purchase additional services from Lenovo at https://

www.lenovo.com/services.

Service availability and service name might vary by country or region.

Chapter 7. Help and support

49

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X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Appendix A. Accessibility and ergonomic information

This chapter provides information about accessibility and ergonomics.

Accessibility information

Lenovo is committed to providing users who have hearing, vision, and mobility limitations with greater

access to information and technology. This section provides information about the ways these users can get

the most out of their computer experience. You also can get the most up-to-date accessibility information

from the following Web site:

https://www.lenovo.com/accessibility

Keyboard shortcuts

The following list contains keyboard shortcuts that can help make your computer easier to use.

Note: Depending on your keyboard, some of the following keyboard shortcuts might not be available.

• Windows logo key + U: Open Ease of Access Center

• Right Shift for eight seconds: Turn on or turn off Filter Keys

• Shift five times: Turn on or turn off Sticky Keys

• Num Lock for five seconds: Turn on or turn off Toggle Keys

• Left Alt+Left Shift+Num Lock: Turn on or turn off Mouse Keys

• Left Alt+Left Shift+PrtScn (or PrtSc): Turn on or turn off High Contrast

For more information, go to https://windows.microsoft.com, and then search using any of the following

keywords: keyboard shortcuts, key combinations, shortcut keys.

Ease of Access Center

Ease of Access Center on the Windows operating system enables you to configure your computers to suit

their physical and cognitive needs.

To access Ease of Access Center:

1. Go to Control Panel and view by Category.

2. Click Ease of Access ➙ Ease of Access Center.

3. Choose the appropriate tool by following the on-screen instructions.

Ease of Access Center mainly includes the following tools:

• Magnifier

• Narrator

• On-Screen Keyboard

Magnifier is a useful utility that enlarges the entire screen or part of the screen so that you can see the

items better.

Narrator is a screen reader that reads what is displayed on the screen aloud and describes events such as

error messages.

If you prefer to type or enter data into your computer using a mouse, joystick, or other pointing device

instead of a physical keyboard, you can use On-Screen Keyboard. On-Screen Keyboard displays a visual

© Copyright Lenovo 2021

51

keyboard with all the standard keys. You can select keys using the mouse or another pointing device, or

you can tap to select the keys if your computer supports multi-touch screen.

High Contrast is a feature that heightens the color contrast of some text and images on your screen. As a

result, those items are more distinct and easier to identify.

Adjust keyboard settings to make your keyboard easier to use. For example, you can use your keyboard

to control the pointer and make the keyboard easier to type certain key combinations.

• High Contrast

• Personalized keyboard

• Personalized mouse

Adjust mouse settings to make your mouse easier to use. For example, you can change the pointer

appearance and make your mouse easier to manage windows.

Speech Recognition

Speech Recognition enables you to control your computer by voice.

You can use verbal instructions to control the keyboard and mouse. With verbal instructions, you can start

programs, open menus, click objects on the screen, dictate text into documents, and write and send e-mails.

Screen-reader technologies are primarily focused on software program interfaces, help systems, and various

online documents. For additional information about screen readers, see the following:

To use Speech Recognition:

1. Go to Control Panel and view by Category.

2. Click Ease of Access ➙ Speech Recognition.

3. Follow the on-screen instructions.

Screen-reader technologies

• Use PDFs with screen readers:

https://www.adobe.com/accessibility.html?promoid=DJGVE

• Use the JAWS screen reader:

https://www.freedomscientific.com/Products/Blindness/JAWS

• Use the NVDA screen reader:

https://www.nvaccess.org/

Screen resolution

You can make the text and images on your screen easier to read by adjusting the screen resolution of your

computer.

To adjust the screen resolution:

2. Follow the on-screen instructions.

1. Right-click a blank area on the desktop and then click Display settings ➙ Display.

Note: Setting a resolution too low might prevent some items from fitting on the screen.

Customizable item size

You can make the items on your screen easier to read by changing the item size.

• To change the item size temporarily, use the Magnifier tool in Ease of Access Center.

• To change the item size permanently:

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X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

– Change the size of all the items on your screen.

1. Right-click a blank area on the desktop and then click Display settings ➙ Display.

2. Change the item size by following the on-screen instructions. For some applications, your

configuration might not take effect until you sign out and then sign in again.

– Change the size of the items on a Web page.

Press and hold Ctrl, and then press the plus-sign key (+) to enlarge or the minus-sign key (–) to reduce

the text size.

– Change the size of the items on the desktop or a window.

Note: This function might not work on some windows.

If your mouse has a wheel, press and hold Ctrl, and then scroll the wheel to change the item size.

Your computer provides industry-standard connectors that enable you to connect assistive devices.

Industry-standard connectors

Documentation in accessible formats

Lenovo provides electronic documentation in accessible formats, such as properly tagged PDF files or

HyperText Markup Language (HTML) files. Lenovo electronic documentation is developed to ensure that

visually impaired users can read the documentation through a screen reader. Each image in the

documentation also includes adequate alternative text so that visually impaired users can understand the

image when they use a screen reader.

Ergonomic information

Good ergonomic practice is important to get the most from your personal computer and to avoid discomfort.

Arrange your workplace and the equipment you use to suit your individual needs and the kind of work that

you perform. In addition, use healthy work habits to maximize your performance and comfort when using

your computer.

Working in the virtual office might mean adapting to frequent changes in your environment. Adapting to the

surrounding light sources, active seating, and the placement of your computer hardware, can help you

improve your performance and achieve greater comfort.

This example shows someone in a conventional setting. Even when not in such a setting, you can follow

many of these tips. Develop good habits, and they will serve you well.

General posture: Make minor modifications in your working posture to deter the onset of discomfort caused

by long periods of working in the same position. Frequent short breaks from your work also help to prevent

minor discomfort associated with your working posture.

Appendix A. Accessibility and ergonomic information

53

Display: Position the display to maintain a comfortable viewing distance of 510 mm to 760 mm (20 inches to

30 inches). Avoid glare or reflections on the display from overhead lighting or outside sources of light. Keep

the display screen clean and set the brightness to levels that enable you to see the screen clearly. Press the

brightness control keys to adjust display brightness.

Head position: Keep your head and neck in a comfortable and neutral (vertical, or upright) position.

Chair: Use a chair that gives you good back support and seat height adjustment. Use chair adjustments to

best suit your comfort posture.

Arm and hand position: If available, use chair arm rests or an area on your working surface to provide

weight support for your arms. Keep your forearms, wrists, and hands in a relaxed and neutral (horizontal)

position. Type with a soft touch without pounding the keys.

Leg position: Keep your thighs parallel to the floor and your feet flat on the floor or on a footrest.

What if you are traveling?

It might not be possible to observe the best ergonomic practices when you are using your computer while on

the move or in a casual setting. Regardless of the setting, try to observe as many of the tips as possible.

Sitting properly and using adequate lighting, for example, helps you maintain desirable levels of comfort and

performance. If your work area is not in an office setting, ensure to take special note of employing active

sitting and taking work breaks. Many product solutions are available to help you modify and expand your

computer to best suit your needs. You can find some of these options at https://www.lenovo.com/accessories.

Explore your options for docking solutions and external products that provide the adjustability and features

that you want.

Questions about vision?

The visual display screens of notebook computers are designed to meet the highest standards. These visual

display screens provide you with clear, crisp images and large, bright displays that are easy to see, yet easy

on the eyes. Any concentrated and sustained visual activity can be tiring. If you have questions on eye

fatigue or visual discomfort, consult a vision-care specialist for advice.

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Appendix B. Compliance information

Note: For more compliance information, refer to Generic Safety and Compliance Notices and Regulatory

Notice at https://pcsupport.lenovo.com.

Certification-related information

Product name

ThinPad X1 Yoga Gen 6

Compliance ID

Machine types

TP00128A

20XY and 20Y0

ThinkPad X1 Yoga Gen 6 HPD (for mainland China only)

TP00128A0*

ThinkPad X1 Carbon Gen 9

TP00129A

20XW and 20XX

ThinkPad X1 Carbon Gen 9 HPD (for mainland China only

TP00129A0*

ThinkPad X1 Yoga Gen 6 LTE2 (for mainland China only)

ThinkPad X1 Yoga Gen 6 5G (for mainland China only)

ThinkPad X1 Yoga Gen 6 LTE2 HPD (for mainland China only)

ThinkPad X1 Yoga Gen 6 5G HPD (for mainland China only)

ThinkPad X1 Carbon Gen 9 LTE1 (for mainland China only)

ThinkPad X1 Carbon Gen 9 LTE2 (for mainland China only)

ThinkPad X1 Carbon Gen 9 5G (for mainland China only)

ThinkPad X1 Carbon Gen 9 LTE1 HPD (for mainland China only)

ThinkPad X1 Carbon Gen 9 LTE2 HPD (for mainland China only)

ThinkPad X1 Carbon Gen 9 5G HPD (for mainland China only)

* for India only

The latest compliance information is available at:

https://www.lenovo.com/compliance

Locate the UltraConnect wireless antennas

Your computer has an UltraConnect™ wireless antenna system. You can enable wireless communication

wherever you are.

© Copyright Lenovo 2021

55

The following illustration shows the antenna locations on ThinkPad X1 Yoga Gen 6:

1 Wireless LAN antenna (auxiliary)

2 Wireless LAN antenna (main)

3 Wireless WAN antenna* (MIMO1)

4 Wireless WAN antenna* (main)

5 Wireless WAN antenna* (auxiliary)

6 Wireless WAN antenna* (MIMO2)

* for selected models

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X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

The following illustration shows the antenna locations on ThinkPad X1 Carbon Gen 9:

1 Wireless LAN antenna (main and auxiliary)

2 Wireless WAN antenna (MIMO1)*

3 Wireless WAN antenna (main)*

4 Wireless WAN antenna (auxiliary)*

5 Wireless WAN antenna (MIMO2)*

* for selected models

Federal Communications Commission (FCC) Supplier’s Declaration of

Conformity

The following information refers to products below:

Product name

ThinPad X1 Yoga Gen 6

ThinkPad X1 Carbon Gen 9

Machine types

20XY and 20Y0

20XW and 20XX

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to

Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses, and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference to

radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which can be

determined by turning the equipment off and on, the user is encouraged to try to correct the interference by

one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult an authorized dealer or service representative for help.

Appendix B. Compliance information

57

Lenovo is not responsible for any radio or television interference caused by using other than recommended

cables and connectors or by unauthorized changes or modifications to this equipment. Unauthorized

changes or modifications could void the user’s authority to operate the equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)

this device may not cause harmful interference, and (2) this device must accept any interference received,

including interference that may cause undesired operation.

Responsible Party:

Lenovo (United States) Incorporated

7001 Development Drive

Morrisville, NC 27560

Email: FCC@lenovo.com

FCC ID and IC Certification information

You can find the FCC and IC Certification information through one of the following methods:

• Through an electronic-label screen (E-label screen) preinstalled on your computer. To view the E-label

screen, see “Regulatory labels” on page 59.

• On a physical label attached to the outside of your computer shipping carton.

Korea radio frequency compliance statement

무선설비 전파 혼신 (사용주파수 2400∼2483.5 , 5725∼5825 무선제품해당)

해당 무선설비가 전파혼신 가능성이 있으므로 인명안전과 관련된 서비스는 할 수 없음

SAR 정보

본 장치는 전파 노출에 대한 가이드라인을 충족합니다.

본 장치는 무선 송수신기 입니다. 본 장치는 국제 가이드라인으로 권장되는 전파 노출에 대한 제한을 초과하지

않도록 설계되었습니다. 장치 액세서리 및 최신 부품을 사용할 경우 SAR 값이 달라질 수 있 습니다. SAR 값은

국가 보고 및 테스트 요구 사항과 네트워크 대역에 따라 다를 수 있습니다. 본 장치 는 사람의 신체에서 20mm

이상의 거리에서 사용할 수 있습니다.

Operating environment

Maximum altitude (without pressurization)

3048 m (10 000 ft)

Temperature

• Operating: 5°C to 35°C (41°F to 95°F)

• Storage and transportation in original shipping packaging: -20°C to 60°C (-4°F to 140°F)

• Storage without packaging: 5°C to 43°C (41°F to 109°F)

Note: When you charge the battery, its temperature must be no lower than 10°C (50°F).

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X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide

Relative humidity

• Operating: 8% to 95% at wet-bulb temperature 23°C (73°F)

• Storage and transportation: 5% to 95% at wet-bulb temperature 27°C (81°F)

Regulatory labels

Depending on your country or region, you can find the government-required regulatory information through

one of the following methods:

• On a physical label attached to the outside of your computer shipping carton

• On a physical label attached to your computer

• Through an electronic-label screen (E-label screen) preinstalled on your computer

To access the E-label screen, restart the computer. When the logo screen is displayed, press F9, or tap the

prompt to enter the Startup Interrupt menu and the Regulatory Information option subsequently.

Korean E-label notice

Appendix B. Compliance information

59

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Appendix C. Notices and trademarks

Notices

Lenovo may not offer the products, services, or features discussed in this document in all countries. Consult

your local Lenovo representative for information on the products and services currently available in your

area. Any reference to a Lenovo product, program, or service is not intended to state or imply that only that

Lenovo product, program, or service may be used. Any functionally equivalent product, program, or service

that does not infringe any Lenovo intellectual property right may be used instead. However, it is the user's

responsibility to evaluate and verify the operation of any other product, program, or service.

Lenovo may have patents or pending patent programs covering subject matter described in this document.

The furnishing of this document does not give you any license to these patents. You can send license

inquiries, in writing, to:

Lenovo (United States), Inc.

8001 Development Drive

Morrisville, NC 27560

U.S.A.

Attention: Lenovo Director of Licensing

LENOVO PROVIDES THIS PUBLICATION "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS

OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT,

MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some jurisdictions do not allow

disclaimer of express or implied warranties in certain transactions, therefore, this statement may not apply to

you.

Changes are made periodically to the information herein; these changes will be incorporated in new editions

of the publication. To provide better service, Lenovo reserves the right to improve and/or modify the

products and software programs described in the manuals included with your computer, and the content of

the manual, at any time without additional notice.

The software interface and function and hardware configuration described in the manuals included with your

computer might not match exactly the actual configuration of the computer that you purchase. For the

configuration of the product, refer to the related contract (if any) or product packing list, or consult the

distributor for the product sales. Lenovo may use or distribute any of the information you supply in any way it

believes appropriate without incurring any obligation to you.

The products described in this document are not intended for use in implantation or other life support

applications where malfunction may result in injury or death to persons. The information contained in this

document does not affect or change Lenovo product specifications or warranties. Nothing in this document

shall operate as an express or implied license or indemnity under the intellectual property rights of Lenovo or

third parties. All information contained in this document was obtained in specific environments and is

presented as an illustration. The result obtained in other operating environments may vary.

Lenovo may use or distribute any of the information you supply in any way it believes appropriate without

incurring any obligation to you.

Any references in this publication to non-Lenovo Web sites are provided for convenience only and do not in

any manner serve as an endorsement of those Web sites. The materials at those Web sites are not part of the

materials for this Lenovo product, and use of those Web sites is at your own risk.

© Copyright Lenovo 2021

61

Any performance data contained herein was determined in a controlled environment. Therefore, the result

obtained in other operating environments may vary significantly. Some measurements may have been made

on development-level systems and there is no guarantee that these measurements will be the same on

generally available systems. Furthermore, some measurements may have been estimated through

extrapolation. Actual results may vary. Users of this document should verify the applicable data for their

specific environment.

This document is copyrighted by Lenovo and is not covered by any open source license, including any

Linux® agreement(s) which may accompany software included with this product. Lenovo may update this

document at any time without notice.

For the latest information or any questions or comments, contact or visit the Lenovo Web site:

https://pcsupport.lenovo.com

Trademarks

LENOVO, LENOVO logo, THINKPAD, THINKPAD logo, TRACKPOINT, and ULTRACONNECT are trademarks

of Lenovo. Intel and Thunderbolt are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or

other countries. Microsoft, Windows, BitLocker, and Cortana are trademarks of the Microsoft group of

companies. DisplayPort is a trademarks of the Video Electronics Standards Association. The terms HDMI

and HDMI High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing

LLC in the United States and other countries. USB-C® is a registered trademark of USB Implementers

Forum. Wi-Fi, Wi-Fi Alliance, and Miracast are registered trademarks of Wi-Fi Alliance. All other trademarks

are the property of their respective owners. © 2021 Lenovo.

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X1 Carbon Gen 9 and X1 Yoga Gen 6User Guide



 

 

ThinkPad X1 Carbon Gen 9

Regulatory Notice

First Edition (February 2021)

© Copyright Lenovo 2021.

LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered pursuant to a General Services

Administration “GSA” contract, use, reproduction, or disclosure is subject to restrictions set forth in Contract No. GS-

35F-05925.

Contents

About this manual . . . . . . . . . . . . iii

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Chapter 1. Notice for users in USA

and Canada . . . . . . . . . . . . . . . 1

USA - Federal Communications Commission

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(FCC) .

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FCC RF exposure compliance . .

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Emergency Calls

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Simultaneous use of RF transmitters .

Radio Frequency interference requirements .

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Canada — Industry Canada (IC)

IC certification number

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Low power license-exempt radio

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communication devices (RSS-247)

Exposure of humans to RF fields (RSS-102) .

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Canada - Industrie Canada (IC) .

Numéro de certification IC .

Permis d'émission à faible puissance - Cas

des appareils de radio-communication (CNR-

247)

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Conformité des appareils de

radiocommunication aux limites d'exposition

humaine aux radiofréquences (CNR-102) . .

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Electromagnetic emission notices.

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Usage environment and your health . .

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Precautions against electrostatic discharges (ESD)

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in inserting or removing the nano-SIM card .

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Chapter 2. Notice for users in

Japan. . . . . . . . . . . . . . . . . . . 7

日本国内で無線LAN/Bluetoothアダプターをご使用

になる場合の注意 . .

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無線 LAN 製品ご使用時におけるセキュリティに関

するご注意.

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NFCカードをご使用になる場合の注意 .

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使用環境および快適に使用するために .

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日本国内で無線WAN 設備をご使用になる場合の注

意 . .

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無線通信機能(モジュールを含む)を持つパーソナル

コンピュータの比吸収率（Body SAR）について .

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Chapter 3. Europe — EU Declaration

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Chapter 4. Trademarks . . . . . . . . 21

© Copyright Lenovo 2021

i

ii

ThinkPad X1 Carbon Gen 9 Regulatory Notice

This manual contains regulatory information for ThinkPad® X1 Carbon Gen 9 (compliance ID TP00129A).

ThinkPad X1 Carbon Gen 9 supports the following wireless modules:

About this manual

• WLAN/Bluetooth combo module AX201D2W

• WWAN module EM120R-GL

• WWAN module T99W175

• NFC module T77H747

• Human Presence Sensing® module X4C007

© Copyright Lenovo 2021

iii

iv

ThinkPad X1 Carbon Gen 9 Regulatory Notice

Chapter 1. Notice for users in USA and Canada

Read this document before using your computer. This computer complies with the radio frequency and

safety standards of any country or region in which it has been approved for wireless use. Install and use your

computer according to the following instructions.

The latest Regulatory Notice manual is available on the Lenovo Web site. To download the manual, go to

https://support.lenovo.com and then follow the on-screen instructions.

Lisez ce document avant d'utiliser votre ordinateur. Cette ordinateur est conforme aux normes de fréquence

radio et de sécurité du pays ou de la région où son utilisation sans fil est autorisée. Installez et utilisez votre

ordinateur en vous conformant aux instructions ci-dessous.

La dernière version du manuel Regulatory Notice est disponible sur le site Web de Lenovo. Pour télécharger

le document, rendez-vous sur https://support.lenovo.com et suivez les instructions à l'écran.

USA - Federal Communications Commission (FCC)

This computer contains the following wireless devices and underwent the certification process of FCC CFR

47 Part 2 section 1093, Part 15 Subpart C and Subpart E, Part 27, Part 22 Subpart H, Part 24 Subpart E and

Part 90 under each respective FCC ID below.

– Wireless LAN module with Bluetooth function (model: AX201D2W)

• FCC ID: PD9AX201D2

• FCC ID: MCLT77H747

– NFC module (model: T77H747)

• FCC ID: 2AD9Q-X4C007

– Human Presence Sensing module (model: X4C007)

• FCC ID: XMR2020EM120RGL2

– Wireless WWAN module (model: EM120R-GL)

• FCC ID: 2AJN7-TP00129A

– TP00129A with Wireless WWAN module T99W175

You can find the FCC certification information through one of the following methods:

• On a physical label attached to the outside of your computer shipping carton

• Through an electronic-label screen (E-label screen) preinstalled on your computer

To access the E-label screen, do one of the following:

• Restart the computer. When the logo screen is displayed, press F9. The E-label screen is displayed.

• Restart the computer. When the logo screen is displayed, press Enter or tap the prompt to enter the

Startup Interrupt menu. Then press F9 or tap the Regulatory Information option. The E-label screen is

displayed.

The wireless modules in your computer are preinstalled by Lenovo, and you are prohibited to replace with

other wireless adapter nor remove it. If the device requires replacement due to some problem during

warranty, it must be serviced by a Lenovo authorized servicer.

© Copyright Lenovo 2021

1

FCC RF exposure compliance

The radiated output power of your computer is below the FCC radio frequency exposure limits. Nevertheless,

it should be used in such a manner that the potential for human contact is minimized during normal operation

of your computer.

CAUTION:

The total radiated energy from the antennas connected to the installed wireless modules conforms to

the FCC limit of the SAR (Specific Absorption Rate) requirement, regarding 47 CFR Part 2 Section

1093, when the computer was tested in conventional notebook computer orientation.

To know the location of transmission antennas for the Wireless LAN/Bluetooth combo module and the

wireless WAN module, see “Locate the UltraConnect™ wireless antennas” in the User Guide.

Emergency Calls

The wireless WAN module does not support voice calls, hence their use for essential communication is not

possible, including emergency calls regarding the E911 rule.

Simultaneous use of RF transmitters

Your computer is approved for simultaneous use of the integrated wireless LAN/Bluetooth combo module

and wireless WAN module.

Make sure of the following conditions when you use any other external wireless option device:

• When you use any other RF option device, you are requested to confirm that the device conforms to the

RF Safety requirement and is approved to use for your computer.

• You must follow the RF Safety instructions of wireless option devices that are included in the user manual

of the RF option device.

wireless features in your computer.

• If wireless options are prohibited to use in conjunction with another transmitters, you must turn off all other

Radio Frequency interference requirements

When you use a wireless LAN module in the 802.11 a/n transmission mode, note that high power radars are

allocated as primary users of the 5250 to 5350 MHz and 5650 to 5850 MHz bands. These radar stations can

cause interference with and/or damage this device.

Your computer contains the following wireless devices and the IC certification number is as below.

Canada — Industry Canada (IC)

IC certification number

• IC: 1000M-AX201D2

• IC: 2878D-T77H747

– NFC module (model: T77H747)

• IC: 22782-X4C007

– Human Presence Sensing module (model: X4C007)

• IC: 10224A-2020EM120GL

– Wireless LAN module with Bluetooth function (model: AX201D2W)

2

ThinkPad X1 Carbon Gen 9 Regulatory Notice

– Wireless WWAN module EM120R-GL

• IC: 21863-TP00129A

– TP00129A with wireless WWAN module T99W175

You can find the IC certification information through one of the following methods:

• On a physical label attached to the outside of your computer shipping carton

• Through an electronic-label screen (E-label screen) preinstalled on your computer

To access the E-label screen, do one of the following:

• Restart the computer. When the logo screen is displayed, press F9. The E-label screen is displayed.

• Restart the computer. When the logo screen is displayed, press Enter or tap the prompt to enter the

Startup Interrupt menu. Then press F9 or tap the Regulatory Information option. The E-label screen is

displayed.

The preinstalled wireless LAN/Bluetooth combo module also has been tested and found to comply with the

limits regarding IC RSS-247, Low-power Licence-exempt Radio communication Devices.

The wireless LAN/Bluetooth combo module and the wireless WAN module are preinstalled by Lenovo, and

are not removable by you. You are prohibited to replace it with any other wireless features. If the wireless

LAN/Bluetooth combo module or the wireless WAN module requires replacement during warranty, it must be

serviced by a Lenovo authorized servicer.

Low power license-exempt radio communication devices (RSS-247)

Operation is subject to the following two conditions:

• This device may not cause interference.

• This device must accept any interference, including interference that may cause undesired operation of

the device.

When you use a wireless LAN/Bluetooth combo module in the 802.11 a/n transmission mode:

• The devices for the band 5150–5350 MHz are only for indoor usage to reduce potential for harmful

interference to co-channel Mobile Satellite systems.

• High power radars are allocated as primary users (meaning they have priority) of 5250–5350 MHz and

5650–5850 MHz and these radars could cause interference and/or damage to LE-LAN (Licence-Exempt

Local Area Network) devices.

Exposure of humans to RF fields (RSS-102)

The computer employs low gain integral antennas that do not emit RF field in excess of Health Canada limits

for the general population; consult Safety Code 6, obtainable from Health Canada's Web site at:

http://www.hc-sc.gc.ca/

The radiated energy from the antennas connected to the wireless modules conforms to the Canada Portable

RF exposure limit regarding IC RSS-102 Issue 5, Section 4 set forth for an uncontrolled environment, and are

safe for intended operation in the conventional setting. Further RF exposure reduction can be achieved if the

product can be kept as far as possible from the user body or set the device to lower output power if such

function is available.

Chapter 1. Notice for users in USA and Canada

3

Canada - Industrie Canada (IC)

Numéro de certification IC

Votre ordinateur contient les périphériques sans fil suivants et le numéro de certification IC indiqué ci-

dessous.

– Wireless LAN module with Bluetooth function (model: AX201D2W)

• IC: 1000M-AX201D2

• IC: 2878D-T77H747

– NFC module (model: T77H747)

• IC: 22782-X4C007

– Human Presence Sensing module (model: X4C007)

• IC: 10224A-2020EM120GL

– Wireless WWAN module EM120R-GL

• IC: 21863-TP00129A

– TP00129A with wireless WWAN module T99W175

Vous trouverez les informations relatives aux numéros de certification IC via l'une des méthodes suivantes:

• Sur une étiquette physique apposée à l'extérieur du carton d'emballage de l'ordinateur

• Via un écran d'étiquette électronique (écran de l'E-label) préinstallé sur votre ordinateur

Pour accéder à l'écran de l'E-label, procédez comme suit:

• Redémarrez l'ordinateur. Lorsque l'écran d'accueil du logiciel s'affiche, appuyez sur la touche F9. L'écran

de l'E-label s'affiche.

• Redémarrez l'ordinateur. Lorsque le logo s'affiche, appuyez sur Entrée ou touchez l'invite pour entrer

dans le menu Startup Interrupt. Appuyez sur F9 ou touchez l'option Informations réglementaires. L'écran

de l'E-label s'affiche.

Le module combiné réseau local sans fil/Bluetooth préinstallé a été testé et déclaré conforme aux limites des

appareils de radio-communication basse tension IC CNR-247 sans licence d'utilisation.

Le module combiné réseau local sans fil/Bluetooth et le module réseau local sans fil sont préinstallés par

Lenovo et ne peuvent pas être retirés par l'utilisateur. Vous ne devez pas la remplacer par une autre fonction

sans fil. Si le module combiné réseau local sans fil/Bluetooth ou le module réseau local sans fil doit être

remplacé pendant la période de garantie, l'opération doit être effectuée par un prestataire de services agréé

par Lenovo.

Permis d'émission à faible puissance - Cas des appareils de radio-

communication (CNR-247)

Le fonctionnement de ce type d'appareil est soumis aux deux conditions suivantes:

• Cet appareil ne doit pas perturber les communications radio.

• Cet appareil doit supporter toute perturbation, y compris les perturbations qui pourraient provoquer son

dysfonctionnement.

4

ThinkPad X1 Carbon Gen 9 Regulatory Notice

Lorsque vous utilisez un module combiné réseau local sans fil/Bluetooth dans le mode de transmission

802.11 a/n:

• Les appareils destinés à la bande 5150–5350 MHz devront être exclusivement utilisés en intérieur afin de

réduire les risques de perturbations électromagnétiques gênantes sur les systèmes de satellite mobile

dans un même canal.

• Les radars à forte puissance sont désignés comme les utilisateurs principaux (c'est-à-dire qu'ils sont

prioritaires) des bandes 5250-5350 MHz et 5650-5850 MHz. Ils peuvent provoquer des perturbations

électromagnétiques sur les appareils de type LE-LAN (réseau de communication local sans licence) ou les

endommager.

Conformité des appareils de radiocommunication aux limites

d'exposition humaine aux radiofréquences (CNR-102)

Les ordinateur utilisent des antennes intégrales à faible gain qui n'émettent pas un champ électromagnétique

supérieur aux normes imposées par Santé Canada pour la population. Consultez le Code de sécurité 6 sur le

site Web de Santé Canada à l'adresse:

http://www.hc-sc.gc.ca/

L'énergie émise par les antennes reliées aux modules sans fil respecte la limite d'exposition aux

radiofréquences émises par les appareils portables au Canada telle que définie par Industrie Canada dans la

section 4 du document CNR-102, version 5 pour un environnement non contrôlé et permet d'affecter sans

danger le produit à l'usage auquel il est destiné. La réduction de l'exposition aux radiofréquences est

possible si le produit peut être conservé aussi loin que possible du corps de l'utilisateur ou en définissant

une puissance de sortie plus faible si une telle fonction est disponible.

Electromagnetic emission notices

Refer to your product User Guide for information regarding the FCC compliance statement and other

compliance statements.

Usage environment and your health

The wireless device installed in the computer operates within the guidelines identified by radio frequency (RF)

safety standards and recommendations; therefore, Lenovo believes this product is safe for use by

consumers. These standards and recommendations reflect the consensus of the worldwide scientific

community, and result from deliberations of panels and committees of scientists, who continually review and

interpret the extensive research literature.

In some situations or environments, the use of wireless devices might be restricted by the proprietor of a

building or responsible representatives of an organization. For example, these situations and areas might

include the following:

• On board of airplanes, in hospitals or near petrol stations, blasting areas (with electro-explosive devices),

medical implants or body-worn electronic medical devices, such as pace makers.

• In any other environment where the risk of interference to other devices or services is perceived or

identified as harmful.

If you are uncertain of the policy that applies to the use of wireless devices in a specific area (such as an

airport or hospital), you are encouraged to ask for authorization to use a wireless device prior to turning on

the computer.

Chapter 1. Notice for users in USA and Canada

5

Precautions against electrostatic discharges (ESD) in inserting or

removing the nano-SIM card

Do not touch the nano-SIM card connectors. As a precaution, always make sure that your computer is in

your hand before you insert or remove the nano-SIM card.

6

ThinkPad X1 Carbon Gen 9 Regulatory Notice

Chapter 2. Notice for users in Japan

内蔵無線アダプターを日本国内でご使用になる際の注意

日本国内で無線LAN/Bluetoothアダプターをご使用になる場合の注意

本製品が装備する無線アダプターは、電波法および電気通信事業法により技 術基準認証を下記のとおり取得

しています。本製品に組み込まれた無線設備 を他の機器で使用する場合は、当該機器が上記と同じく認証を

受けているこ とをご確認ください。認証されていない機器での使用は、電波法の規定に より認められてい

ません。

Table 1. 無線LAN / Bluetooth アダプターが搭載されているモデル

認証番号

認証製品名

認証申請者名

003-180233

D180132003

AX201D2W

Intel Mobile Communications S.A.S.

0008–200356

X4C007

Novelda AS

5 GHz 帯は屋内使用限定 (登録局との通信を除く)

(5 GHz の場合)

(2.4 GHz の場合)

この機器の使用周波数帯では、電子レンジ等の産業・科学・医療用機器のほか工場の製造ライン等で使用さ

れている移動体識別用の構内無線局 (免許を要する無線局) および特定小電力無線局 (免許を要しない無線局)

並びにアマチュア無線局 (免許を要する無線局) が運用されています。

1. この機器を使用する前に、近くで移動体識別用の構内無線局及び特定小電力無線局並びにアマチュア無

線局が運用されていないことを確認してください。

2. 万一、この機器から移動体識別用の構内無線局に対して電波干渉の事例が発生した場合には、速やかに

使用周波数を変更するかまたは電波の発射を停止した上で、下記連絡先にご連絡頂き、混信回避のため

の処置等についてご相談ください。

3. その他、この機器からの移動体識別用の特定小電力無線局あるいはアマチュア無線局に対して有害な電

波干渉の事例が発生した場合など何かお困りのことが起きたときには、次の連絡先にお問い合わせくだ

さい。

連絡先: スマートセンター (スマートセンターのご利用方法は、次のホームページでご確認頂けます。https://

www.lenovo.com/jp/lsmartctr)

Bluetooth アダプターの場合

この機器が、2.4 GHz 周波数帯 (2400 から 2483.5 MHｚ) を使用する周波数ホッピング

(FH) 方式の無線装置で、干渉距離が約 80 m であることを意味します。

無線 LAN 製品ご使用時におけるセキュリティに関するご注意

無線 LAN では、LAN ケーブルを使用する代わりに、電波を利用してパソコン等と無線アクセスポイント間

で情報のやり取りを行うため、電波の届く範囲であれば自由に LAN 接続が可能であるという利点がありま

© Copyright Lenovo 2021

7

2.4FH8す。 その反面、電波はある範囲内であれば障害物 (壁等) を越えてすべての場所に届くため、セキュリティに

関する設定を行っていない場合、以下のような問題が発生する可能性があります。

• 通信内容を盗み見られる 悪意ある第三者が、電波を故意に傍受し、

– ID やパスワード又はクレジットカード番号等の個人情報

– メールの内容

等の通信内容を盗み見られる可能性があります。

• 不正に侵入される 悪意ある第三者が、無断で個人や会社内のネットワークへアクセスし、

– 個人情報や機密情報を取り出す (情報漏洩)

– 特定の人物になりすまして通信し、不正な情報を流す (なりすまし)

– 傍受した通信内容を書き換えて発信する (改ざん)

– コンピュータウィルスなどを流しデータやシステムを破壊する (破壊)

などの行為をされてしまう可能性があります。

本来、無線 LAN カードや無線アクセスポイントは、これらの問題に対応するためのセキュリティの仕組み

を持っていますので、無線 LAN 製品のセキュリティに関する設定を行って製品を使用することで、その問

題が発生する可能性は少なくなります。

セキュリティの設定を行わないで使用した場合の問題を充分理解した上で、お客様自身の判断と責任におい

てセキュリティに関する設定を行い、製品を使用することをお奨めします。

NFCカードをご使用になる場合の注意

当該製品が装備するNFC カードは、電波法に基づき、「誘導式読み書き通信設 備の指定（型式指定）」に

拠り認可を得ております。お客様による分解、修 理等は故障の原因となったり、技術基準から不適合となる

改造の要因となり ますので絶対に行わないで下さい。

Table 2. NFCカード

指定番号

総務省指定

第AC-16074号

認証製品名（型式名）

認証申請者名

T77H747

レノボ・ジャパン株式会社

使用環境および快適に使用するために

無線LAN/Bluetoothアダプターは、ほかの無線装置のように無線周波数電磁波を発します。しかしながら、

これらの無線装置が発する電磁波が人体へ与える影響は、頭部等へ直接接触して使用される携帯電話などの

機器とは異なり、とても弱いレベルのものです。

無線LAN/Bluetoothアダプターは、無線周波数に関する安全基準や勧告などのガイドラインに従って動作す

るもので、Lenovoは、消費者が内蔵ワイヤレス・カードを使用しても安全であると考えます。これらの標準

および勧告は、科学者団体の合意や広範な研究文献を頻繁 に検討、調査している科学者のパネルや委員会の

審議の結果を反映しています。

状況や環境によって、建物の所有者や組織の代表責任者が無線LAN/Bluetoothアダプターの使用を制限する

ことがあります。 たとえば、次のような場合や場所です。

• 飛行機の搭乗中、病院内、あるいはガソリンスタンド、(電気式発火装置のある) 爆発の危険のある場所、

医療用インプラント、またはペースメーカーなどの装着式医療用電子機器の近くで、内蔵ワイヤレス・

カードを使用すること。

• 他の装置や機能に対して有害と認識または確認されている妨害を起こす危険性がある場合。

特定の場所で (たとえば空港や病院など) ワイヤレス・デバイスの使用が許可されているかどうかがわからな

い場合は、ThinkPad の電源を入れる前に無線LAN/Bluetoothアダプターを使用してもよいかどうかをお尋ね

ください。

8

ThinkPad X1 Carbon Gen 9 Regulatory Notice

日本国内で無線WAN 設備をご使用になる場合の注意

本製品は、電波法および電気通信事業法により技 術基準認証を下記のとおり取得しています。本製品に組み

込まれた無線設備を他の機器で使用する場合は、当該機器が上記と同じく認証を受けていることをご確認く

ださい。認証されていない機器での使用は、電波法の規定により認められていません。

モデル

認証番号

認証製品名 認証申請者名

Table 3. 無線 WAN 設備

EM120R-GL搭載モデ

ル

L860-GL搭載モデル

xxx-xxxxxx

D200119003

003-190286

D180164201

TP00129A

LC Future Center Limited Taiwan Branch

EM120R-

GL

Quectel Wireless Solutions Co., Ltd

TP00129A

LC Future Center Limited Taiwan Branch

T99W175

Hon Lin Technology Co., Ltd

無線通信機能(モジュールを含む)を持つパーソナルコンピュータの比吸収率

（Body SAR）について

この機種【ThinkPad X1 Carbon】は、Body SAR の対象となる無線通信機（モジュールを含む）*1を搭載し

ており、国が定めた電波の人体吸収に関する技術基準および電波防護の国際ガイドラインに適合していま

す。対象モジュールを搭載しているパーソナルコンピュータは、国が定めた電波の人体吸収に関する技術基

準*2ならびに、これと同等な国際ガイドラインが推奨する電波防護の許容値を遵守するよう設計されていま

す。この国際ガイドラインは世界保健機関（WHO）が支持するガイドラインと同等のものとなっており、

その許容値は使用者の年齢や健康状況に関係なく十分な安全率（約 50 倍の安全率）となっています。 国の

法律および国際ガイドラインは電波防護の許容値を人体に吸収される電波の平均エネルギー量を表す比吸収

率（SAR：Specific Absorption Rate）で定めており､対象モジュールを搭載しているパーソナルコンピュー

タに対する局所 SAR の許容値は 2.0W/kg（手首から先を除く手足は 4W/Kg）です。

本製品の Body SAR の値は Table 4 “Body SAR値” on page 9 にある通りであり、許容値を満足しています。

Table 4. Body SAR値

EM120R-GL搭載モデル

T99W175搭載モデル

xxx W/kg

xxx W/kg

Body SAR について、さらに詳しい情報をお知りになりたい方は、下記のホームページをご参照ください。

総務省 電波利用ホームページ

https://www.tele.soumu.go.jp/

https://www.tele.soumu.go.jp/j/sys/ele/pr/

注*1 2014 年 4 月 1 日現在、対象となる無線通信機（モジュールを含む）は、携帯電話、衛星携帯電話およ

び WiMAX。

注*2 技術基準については、電波法関連省令（無線設備規則第 14 条の 2）で規定されています。

Chapter 2. Notice for users in Japan

9

10

ThinkPad X1 Carbon Gen 9 Regulatory Notice

Chapter 3. Europe — EU Declaration of Conformity

EU Frequency band restriction

English

Hereby, Lenovo (Singapore) Pte. Ltd., declares that the wireless equipment listed in this document is in

compliance with the Radio Equipment Directive 2014/53/EU.

The full text of the system EU declaration of conformity is available at the following Internet address:

https://www.lenovo.com/us/en/compliance/eu-doc

EU Frequency band restriction for wireless LAN

Usage of this device is limited to indoor in the band 5150 MHz to 5350 MHz (channels 36, 40, 44, 48, 52, 56,

60, 64).

RF Exposure information

This device meets the EU requirements and the International Commission on Non-Ionizing Radiation

Protection (ICNIRP) guidelines for general public’s exposure to electromagnetic fields. To get your product’s

SAR value, go to https://support.lenovo.com/us/en/solutions/sar and follow the on-screen instructions.

Bulgarian

С настоящото Lenovo (Singapore) Pte. Ltd. декларира, че безжичното оборудване, споменато в този

раздел, съответства на Директивата за радиооборудване 2014/53/EС.

Пълният текст на декларацията за съответствие с ЕС относно системата е наличен на следния адрес

в интернет:

https://www.lenovo.com/us/en/compliance/eu-doc

Ограничение в ЕС за честотни ленти за безжичен LAN

Употребата на това устройство е ограничена само на закрито в диапазона 5150 MHz до 5350 MHz

(канали 36, 40, 44, 48, 52, 56, 60, 64).

Информация за излагане на радиочестоти

Това устройство отговаря на изискванията на ЕС и насоките на международната комисия за защита

от нейонизираща радиация (ICNIRP) за общо обществено излагане на електромагнитни полета. За да

получите стойността на SAR за вашия продукт, отворете https://support.lenovo.com/us/en/solutions/sar и

следвайте инструкциите от екрана.

© Copyright Lenovo 2021

11

AT BE BG CH CY CZ DE DK EE EL ES FI FR HR HU IE IS IT LI LT LU LV MT NL NO PL PT RO SE SI SK TR UK Croatian

Lenovo (Singapore) Pte. Ltd. ovime izjavljuje da je bežična oprema navedena u ovom dokumentu usklađena

s Direktivom o radijskoj opremi 2014/53/EU.

Potpuni tekst deklaracije EU-a o sukladnosti sustava dostupan je na sljedećoj internetskoj adresi:

https://www.lenovo.com/us/en/compliance/eu-doc

Ograničenje frekvencijskog pojasa za bežični LAN u EU-u

Upotreba uređaja ograničena je na zatvorene prostore unutar pojasa od 5150 MHz do 5350 MHz (kanali 36,

40, 44, 48, 52, 56, 60, 64).

Informacije o izlaganju radijskoj frekvenciji

Ovaj uređaj zadovoljava zahtjeve EU-a i smjernice Međunarodne komisije za zaštitu od neionizirajućeg

zračenja o izlaganju javnosti elektromagnetskim poljima. Za SAR vrijednost svojeg proizvoda posjetite https://

support.lenovo.com/us/en/solutions/sar i pratite upute na zaslonu.

Czech

Společnost Lenovo (Singapore) Pte. Ltd. tímto prohlašuje, že bezdrátová zařízení uvedená v tomto

dokumentu splňují základní i další relevantní požadavky směrnice o rádiových zařízeních 2014/53/EU.

Úplné znění EU prohlášení o shodě systému je dostupné na následujících internetových adresách:

https://www.lenovo.com/us/en/compliance/eu-doc

Omezení EU pro frekvenční pásma bezdrátové sítě LAN

Použití tohoto zařízení je omezeno na vnitřní prostory a frekvenční pásma 5150 až 5350 MHz (kanály 36, 40,

44, 48, 52, 56, 60, 64).

Informace o vystavení radiofrekvenčnímu záření

Toto zařízení splňuje požadavky EU a pokyny ICNIRP (International Commission on Non-Ionizing Radiation

Protection – Mezinárodní komise pro ochranu před neionizujícím zářením) týkající se vystavení obecné

veřejnosti elektromagnetickým polím. Chcete-li získat hodnotu SAR vašeho produktu, přejděte na stránku

https://support.lenovo.com/us/en/solutions/sar a postupujte podle pokynůna obrazovce.

Danish

Lenovo (Singapore) Pte. Ltd. erklærer hermed, at det trådløse udstyr, der er angivet i dette dokument,

overholder direktivet om radioudstyr 2014/53/EU.

Hele teksten til EU's overensstemmelseserklæring findes på følgende internetadresser:

https://www.lenovo.com/us/en/compliance/eu-doc

Restriktioner for frekvensbånd i EU for et trådløst LAN

Brug af denne enhed er begrænset til indendørs brug i frekvensbåndet 5150 MHz til 5350 MHz (kanal 36, 40,

44, 48, 52, 56, 60, 64).

Oplysninger om radiobølgeeksponering

Denne enhed opfylder EU-kravene og ICNIRP-retningslinjerne ( International Commission on Non-Ionizing

Radiation Protection) for eksponering for elektromagnetiske felter. Du kan få dit produkts SAR-værdi ved at

gå til https://support.lenovo.com/us/en/solutions/sar og følge instruktionerne på skærmen.

12

ThinkPad X1 Carbon Gen 9 Regulatory Notice

Dutch

Hierbij verklaart Lenovo (Singapore) Pte. Ltd. dat de draadloze apparatuur die in dit artikel is aangegeven

voldoet aan de richtlijn 2014/53/EU voor radioapparatuur.

De volledige tekst van de EU-verklaring van conformiteit van het systeem is beschikbaar op de volgende

internetpagina:

https://www.lenovo.com/us/en/compliance/eu-doc

EU-beperking van frequentieband voor een draadloos LAN

Gebruik van dit apparaat is beperkt tot gebruik binnenshuis in de band van 5150 MHz tot 5350 MHz (kanalen

36, 40, 44, 48, 52, 56, 60, 64).

Informatie over blootstelling aan radiogolven

Dit apparaat voldoet aan de vereisten van de EU en de richtlijnen van de ICNIRP (International Commission

on Non-Ionizing Radiation Protection) voor blootstelling van het algemene publiek aan elektromagnetische

velden. Om de SAR-waarde van uw product te krijgen, gaat u naar https://support.lenovo.com/us/en/solutions/

sar en volgt u de instructies op het scherm.

Estonian

Siinkohal kinnitab ettevõte Lenovo (Singapore) Pte. Ltd., et käesolevas dokumendis kirjeldatud juhtmeta

seadmed on kooskõlas raadioseadmete direktiiviga 2014/53/EL.

Süsteemi ELi vastavusdeklaratsiooni täielik tekst on saadaval järgmisel Interneti-aadressil:

https://www.lenovo.com/us/en/compliance/eu-doc

EL-i sagedusvahemiku piirang traadita side LAN-ile

Seda seadet võib kasutada siseruumides sagedusvahemikus 5150–5350 MHz (kanalid 36, 40, 44, 48, 52, 56,

60, 64).

Raadiosagedusliku kiirguse teave

Seade vastab EL-i nõuetele ja Rahvusvahelise mitteioniseeriva kiirguse eest kaitsmise komisjoni (ICNIRP)

juhistele elanikkonna elektromagnetiliste väljadega kokkupuute kohta. Toote SAR-väärtuse saamiseks minge

aadressile https://support.lenovo.com/us/en/solutions/sar ja järgige ekraanil kuvatavaid juhiseid.

Finnish

Lenovo (Singapore) Pte. Ltd. ilmoittaa täten, että tässä asiakirjassa mainittu langaton laite on

radiolaitedirektiivin 2014/53/EU mukainen.

Lausuma järjestelmän EU-säännöstenmukaisuudesta on saatavilla kokonaisuudessaan seuraavassa

Internet-osoitteessa:

https://www.lenovo.com/us/en/compliance/eu-doc

Langattoman lähiverkon taajuusalueen rajoitus EU:n alueella

Tämä laite on tarkoitettu käytettäväksi sisätiloissa taajuusalueella 5 150–5 350 MHz (kanavat 36, 40, 44, 48,

52, 56, 60 ja 64).

Tietoja radiotaajuiselle säteilylle altistumisesta

Tämä laite täyttää Euroopan unionin vaatimukset ja kansainvälisen ionisoimattoman säteilyn toimikunnan

(ICNIRP, International Commission on Non-Ionizing Radiation Protection) suositukset, jotka koskevat

Chapter 3. Europe — EU Declaration of Conformity

13

väestön altistumista sähkömagneettisille kentille. Löydät tuotteesi SAR-arvon käymällä osoitteessa https://

support.lenovo.com/us/en/solutions/sar ja noudattamalla näytöllä esitettyjä ohjeita.

French

Par la présente, Lenovo (Singapore) Pte. Ltd., déclare que les équipements sans fil listés dans ce document

sont conformes à la directive 2014/53/EU sur les équipements radio.

Le texte complet de la déclaration de l'UE de conformité du système est disponible à l'adresse suivante:

https://www.lenovo.com/us/en/compliance/eu-doc

Restriction liée à une bande de fréquence pour un réseau local sans fil au sein de l'Union européenne

Ce périphérique doit être utilisé exclusivement à l'intérieur, dans la bande de fréquence de 5150 à 5350 MHz

(canaux 36, 40, 44, 48, 52, 56, 60, 64).

Informations sur l'exposition aux RF

Ce périphérique respecte les directives de l'UE et de la Commission internationale pour la protection contre

les radiations non-ionisantes (ICNIRP) concernant l'exposition du public à des champs

électromagnétiques. Pour obtenir la valeur DAS de votre produit, accédez à https://support.lenovo.com/us/en/

solutions/sar et suivez les instructions à l'écran.

German

Hiermit erklärt Lenovo (Singapore) Pte. Ltd., dass das in diesem Dokument aufgelistete drahtlose Gerät die

Funkanlagen-Richtlinie 2014/53/EU erfüllt.

Die vollständige EU-Konformitätserklärung für das System finden Sie unter der folgenden Internetadresse:

https://www.lenovo.com/us/en/compliance/eu-doc

EU-Frequenzbandeinschränkung für drahtloses LAN

Die Verwendung dieses Gerätes ist im Frequenzband zwischen 5.150 und 5.350 MHz (Kanäle 36, 40, 44, 48,

52, 56, 60, 64) auf die Verwendung im Innenbereich beschränkt.

Informationen zur HF-Exposition

Dieses Gerät erfüllt die EU-Anforderungen sowie die Richtlinien der International Commission on Non-

Ionizing Radiation Protection (ICNIRP) hinsichtlich der Exposition der Bevölkerung gegenüber

elektromagnetischen Feldern. Um die Anforderungen bezüglich der HF-Exposition zu erfüllen, muss dieses

Gerät mit einem Mindestabstand von 20 cm zum Körper des Benutzers betrieben werden.

Greek

Με την παρούσα, η Lenovo (Singapore) Pte. Ltd., δηλώνει ότι ο ασύρματος εξοπλισμός που αναφέρεται στο

παρόν έγγραφο συμμορφώνεται με την Οδηγία περί Ραδιοεξοπλισμού 2014/53/ΕΕ.

Το πλήρες κείμενο της δήλωσης συμμόρφωσης της ΕΕ για το σύστημα διατίθεται στην εξής διεύθυνση στο

Internet:

https://www.lenovo.com/us/en/compliance/eu-doc

Περιορισμός ζώνης συχνοτήτων στην ΕΕ για ασύρματο LAN

Η χρήση αυτής της συσκευής περιορίζεται σε εσωτερικούς χώρους στη ζώνη συχνοτήτων 5150 MHz έως

5350 MHz (κανάλια 36, 40, 44, 48, 52, 56, 60, 64).

14

ThinkPad X1 Carbon Gen 9 Regulatory Notice

Πληροφορίες σχετικά με την έκθεση στις ραδιοσυχνότητες (RF)

Η συγκεκριμένη συσκευή πληροί τις απαιτήσεις της ΕΕ και τις οδηγίες της Διεθνούς Επιτροπής για την

Προστασία από τις Μη Ιοντίζουσες Ακτινοβολίες (ICNIRP) σχετικά με την έκθεση του ευρύτερου κοινού στα

ηλεκτρομαγνητικά πεδία. Για να λάβετε την τιμή SAR του προϊόντος σας, επισκεφθείτε τον δικτυακό τόπο

https://support.lenovo.com/us/en/solutions/sar και ακολουθήστε τις οδηγίες στην οθόνη.

Hungarian

A Lenovo (Singapore) Pte. Ltd. kijelenti, hogy a jelen dokumentumban említett vezeték nélküli készülék

megfelel a 2014/53/EU számú, rádióberendezésekről szóló direktívában foglaltaknak.

A rendszer EU-s megfelelőségi nyilatkozatának teljes szövege a következő webhelyen tekinthető meg:

https://www.lenovo.com/us/en/compliance/eu-doc

Frekvenciatartományra vonatkozó európai uniós korlátozás vezeték nélküli LAN-hálózatokhoz

Az eszköz használata beltérre korlátozódik az 5150–5350 MHz tartományban (csatornák: 36, 40, 44, 48, 52,

56, 60, 64).

RF-kitettségre vonatkozó információk

Ez az eszköz megfelel a személyek elektromágneses mezőknek való kitettségére vonatkozó, az EU és az

International Commission on Non-Ionizing Radiation Protection (ICNIRP – Nemzetközi Bizottság a Nem-

ionizáló Sugárzással Szembeni Védelemről) által előírt követelményeknek. Az Ön termékére vonatkozó SAR-

érték megismeréséhez lépjen a https://support.lenovo.com/us/en/solutions/sar címre, és kövesse a képernyőn

megjelenő utasításokat.

Italian

Con la presente documentazione, Lenovo (Singapore) Pte. Ltd. dichiara che l'apparecchiatura wireless

indicata in questo documento è conforme alla direttiva 2014/53/EU sulle apparecchiature radio.

Il testo integrale della dichiarazione di conformità dei sistemi dell'UE è disponibile al seguente indirizzo

Internet:

https://www.lenovo.com/us/en/compliance/eu-doc

Restrizioni UE sulla banda di frequenza per una WLAN (wireless LAN)

L'utilizzo di questo dispositivo è limitato ad ambienti chiusi in banda compresa tra 5150 MHz e 5350 MHz

(canali 36, 40, 44, 48, 52, 56, 60, 64).

Informazioni sull'esposizione RF

Questo dispositivo rispetta i requisiti EU e le linee guida ICNIRP (International Commission on Non-Ionizing

Radiation Protection) per l'esposizione generale ai campi elettromagnetici. Per ottenere il valore SAR del

prodotto, accedere a https://support.lenovo.com/us/en/solutions/sar e seguire le istruzioni su schermo.

Latvian

Ar šo uzņēmums Lenovo (Singapore) Pte. Ltd. paziņo, ka šajā dokumentā norādītais bezvadu aprīkojums

atbilst radioiekārtu Direktīvai 2014/53/EK.

Pilns ES atbilstības deklarācijas teksts ir pieejams šajā interneta adresē:

https://www.lenovo.com/us/en/compliance/eu-doc

Chapter 3. Europe — EU Declaration of Conformity

15

ES frekvenču joslu ierobežojums bezvadu LAN adapterim

Šī ierīce ir paredzēta izmantošanai iekštelpās joslās no 5150 MHz līdz 5350 MHz (kanālos 36, 40, 44, 48, 52,

56, 60, 64).

Informācija par pakļaušanu RF starojumam

Šī ierīce atbilst ES prasībām un vadlīnijām, ko publicējusi Starptautiskā komisija aizsardzībai pret

nejonizējošo starojumu (International Commission on Non-Ionizing Radiation Protection — ICNIRP), attiecībā

uz vispārīgu sabiedrības pakļaušanu elektromagnētiskajam laukam. Lai saņemtu sava produkta SAR vērtību,

dodieties uz vietni https://support.lenovo.com/us/en/solutions/sar un izpildiet ekrānā redzamos norādījumus.

Lithuanian

„Lenovo (Singapore) Pte. Ltd.“ pareiškia, kad belaidė įranga, nurodyta šiame dokumente, atitinka Radijo

įrangos direktyvos 2014/53/ES reikalavimus.

Visą sistemos ES atitikties deklaracijos tekstą galite rasti šiuo internetiniu adresu:

https://www.lenovo.com/us/en/compliance/eu-doc

Belaidžio LAN ES dažnių diapazono apribojimas

Šį įrenginį patalpose galima naudoti 5 150–5 350 MHz dažnių diapazonu (kanalai: 36, 40, 44, 48, 52, 56, 60,

64).

Informacija apie radijo dažnių poveikį

Šis įrenginys atitinka ES reikalavimus ir Tarptautinės apsaugos nuo nejonizuojančiosios spinduliuotės

komisijos (ICNIRP) gaires dėl elektromagnetinių laukų poveikio plačiajai visuomenei. Norėdami sužinoti

gaminio SAR vertę, eikite į https://support.lenovo.com/us/en/solutions/sar ir vadovaukitės ekrane pateikiamais

nurodymais.

Norwegian

Lenovo (Singapore) Pte. Ltd. erklærer herved at det trådløse utstyret som er oppført i dette kapittelet, er i

samsvar med direktiv 2014/53/EU om radioutstyr.

Hele teksten til EUs samsvarserklæring finner du på følgende Internett-adresse:

https://www.lenovo.com/us/en/compliance/eu-doc

Begrensinger for frekvensbånd i EU for trådløst LAN

Denne enheten er begrenset til innendørs bruk i frekvensbåndet 5150 til 5350 MHz (kanal 36, 40, 44, 48, 52,

56, 60, 64).

Informasjon om RF-eksponering

Denne enheten oppfyller EU-kravene og ICNIRP-retningslinjene (International Commission on Non-Ionizing

Radiation) for eksponering for elektromagnetiske felter ved generell bruk. Hvis du vil finne produktets SAR-

verdi, kan du gå til https://support.lenovo.com/us/en/solutions/sar og følge instruksjonene på skjermen.

Polish

Lenovo (Singapore) Pte. Ltd., niniejszym oświadcza, że urządzenia bezprzewodowe wymienione w tym

dokumencie spełniają wymagania dyrektywy w sprawie sprzętu radiowego 2014/53/UE.

Pełna treść deklaracji zgodności systemu jest dostępna na następującej stronie internetowej:

https://www.lenovo.com/us/en/compliance/eu-doc

16

ThinkPad X1 Carbon Gen 9 Regulatory Notice

Ograniczenia dotyczące pasm częstotliwości w UE dla połączeń bezprzewodowych LAN

Urządzenie jest przeznaczone do używania wewnątrz budynków, w pasmach częstotliwości 5150 do 5350

MHz (kanały 36, 40, 44, 48, 52, 56, 60 i 64).

Informacje o ekspozycji na częstotliwości radiowe

To urządzenie spełnia wymagania UE i wytyczne Międzynarodowej Komisji ds. Ochrony przed

Promieniowaniem Niejonizującym (ICNIRP) dotyczące wystawienia ludzi na działanie pól

elektromagnetycznych. Aby uzyskać wartość SAR produktu, przejdź na stronę https://support.lenovo.com/us/

en/solutions/sar i postępuj zgodnie z instrukcjami wyświetlanymi na ekranie.

Portuguese

A Lenovo (Singapore) Pte. Ltd., declara por este meio que o equipamento sem fios listado neste documento

está em conformidade com a Diretiva de Equipamento de Rádio 2014/53/UE.

O texto integral da declaração de conformidade da UE do sistema está disponível no seguinte endereço na

Internet:

https://www.lenovo.com/us/en/compliance/eu-doc

Restrição da banda de frequências na UE para uma LAN sem fios

A utilização deste dispositivo está limitada à utilização no interior, na banda 5150 a 5350 MHz (canais 36, 40,

44, 48, 52, 56, 60, 64).

Informações sobre exposição a RF

Este dispositivo cumpre os requisitos da UE e as diretrizes da International Commission on Non-Ionizing

Radiation Protection (ICNIRP) para exposição do público geral a campos eletromagnéticos. Para estar em

conformidade com os requisitos de exposição a RF, este equipamento tem de ser operado com uma

distância de separação mínima de 20 cm em relação ao corpo do utilizador.

Romanian

Prin prezenta, Lenovo (Singapore) Pte. Ltd., declară că echipamentul fără fir prezentat în acest document

este în conformitate cu Directiva privitoare la echipamentele radio 2014/53/EU.

Textul complet al declarației de conformitate UE a sistemului este disponibil la următoarele adrese:

https://www.lenovo.com/us/en/compliance/eu-doc

Restricţia UE privind banda de frecvenţă a unei reţele LAN fără fir

Utilizarea acestui dispozitiv este limitată la spaţiile interioare, în banda de 5.150 – 5.350 MHz (canalele 36, 40,

44, 48, 52, 56, 60, 64).

Informaţii privind expunerea la frecvenţele radio

Acest dispozitiv îndeplineşte cerinţele UE şi instrucţiunile Comisiei internaţionale pentru protecţia împotriva

radiaţiilor neionizante (ICNIRP) referitoare la expunerea persoanelor la câmpuri electromagnetice. Pentru a

afla valoarea SAR a produsului dvs., accesați https://support.lenovo.com/us/en/solutions/sar și urmați

instrucțiunile de pe ecran.

Slovakian

Spoločnosť Lenovo (Singapore) Pte. Ltd. týmto vyhlasuje, že bezdrôtové zariadenie uvedené v tomto

dokumente je v súlade so smernicou o rádiových zariadeniach 2014/53/EÚ.

Chapter 3. Europe — EU Declaration of Conformity

17

Úplné znenie systémového vyhlásenia EÚ o zhode je k dispozícii na týchto internetových adresách:

https://www.lenovo.com/us/en/compliance/eu-doc

Obmedzenie frekvenčného pásma EÚ pre bezdrôtovú sieť LAN

Používanie tohto zariadenia je obmedzené na interiér vo frekvenčnom pásme 5 150 až 5 350 MHz (kanály 36,

40, 44, 48, 52, 56, 60, 64).

Informácie o vystavení rádiofrekvenčnému žiareniu

Toto zariadenie vyhovuje požiadavkám EÚ a smerniciam Medzinárodnej komisie pre ochranu pred

neionizujúcim žiarením (ICNIRP), ktoré upravujú vystavenie širokej verejnosti elektromagnetickým poliam. Ak

chcete získať hodnotu SAR svojho produktu, prejdite na stránku https://support.lenovo.com/us/en/solutions/

sar a postupujte podľa pokynov na obrazovke.

Slovenian

Lenovo (Singapore) Pte. Ltd. s tem izjavlja, da je brezžična oprema, navedena v tem dokumentu, skladna z

direktivo o radijski opremi 2014/53/EU.

Celotno besedilo izjav EU o skladnosti je na voljo na tem internetnem naslovu:

https://www.lenovo.com/us/en/compliance/eu-doc

Omejitve Evropske unije glede frekvenčnega pasu za brezžična krajevna omrežja

Ta naprava je omejena na notranjo uporabo v pasu od 5150 do 5350 MHz (kanali 36, 40, 44, 48, 52, 56, 60,

64).

Informacije o izpostavljenosti RF-sevanju

Ta naprava izpolnjuje zahteve EU in smernice Mednarodne komisije za varstvo pred neionizirnimi sevanji

(International Commission on Non-Ionizing Radiation Protection – ICNIRP) za izpostavljenost splošne

javnosti elektromagnetnim poljem. Če želite izvedeti vrednost SAR za svoj izdelek, obiščite https://

support.lenovo.com/us/en/solutions/sar in upoštevajte navodila na zaslonu.

Spanish

Mediante el presente documento, Lenovo (Singapore) Pte. Ltd., declara que el equipo inalámbrico indicado

en este documento cumple con la Directiva de Equipos de Radio 2014/53/UE.

El texto completo de la declaración de conformidad del sistema de la UE está disponible en la siguiente

dirección de Internet:

https://www.lenovo.com/us/en/compliance/eu-doc

Restricción de banda de frecuencia de la UE para LAN inalámbrica

La utilización de este dispositivo está limitada a interiores en la banda de 5150 MHz a 5350 MHz (canales 36,

40, 44, 48, 52, 56, 60, 64).

Información de exposición a RF

Este dispositivo satisface los requisitos de la UE y las directrices de la International Commission on Non-

Ionizing Radiation Protection (ICNIRP) sobre la exposición del público general a campos electromagnéticos.

Para obtener el valor SAR de su producto, vaya a https://support.lenovo.com/us/en/solutions/sar y siga las

instrucciones en pantalla.

18

ThinkPad X1 Carbon Gen 9 Regulatory Notice

Swedish

Härmed intygar Lenovo (Singapore) Pte. Ltd. att den trådlösa utrustningen i detta dokument överensstämmer

med direktivet för radioutrustning 2014/53/EU.

Den fullständiga texten i EU:s deklaration om överensstämmelse finns tillgänglig på:

https://www.lenovo.com/us/en/compliance/eu-doc

Frekvensområdesbegränsning inom EU för trådlöst nätverk

Enheten får bara användas inomhus i frekvensområdet 5150–5350 MHz (kanal 36, 40, 44, 48, 52, 56, 60, 64).

Information om exponering för radiovågor

Denna enhet överensstämmer med EU:s krav och ICNIRP:s (International Commission on Non-Ionizing

Radiation Protection) riktlinjer avseende allmänhetens exponering för elektromagnetiska fält. Ta reda på din

produkts SAR-värde genom att besöka https://support.lenovo.com/us/en/solutions/sar och följa anvisningarna

på skärmen.

Turkish

Lenovo (Singapore) Pte. Ltd., bu belgede listelenen kablosuz cihazların temel gereksinimler ve Radyo

Ekipmanları Yönetmeliği 2014/53/EC ile uyumlu olduğunu beyan eder.

Sistem AB uyumluluk bildiriminin tam metni şu İnternet adresinde sunulmaktadır:

https://www.lenovo.com/us/en/compliance/eu-doc

Kablosuz LAN için AB Frekans bandı kısıtlaması

Bu cihazın kullanımı iç mekanlarda, 5150 - 5350 MHz bant aralığı (36, 40, 44, 48, 52, 56, 60, 64 kanalları) ile

sınırlıdır.

RF maruz kalma bilgileri

Bu cihaz, kamunun elektromanyetik alanlara maruz kalmasına ilişkin AB gereksinimlerine ve Uluslararası Non-

İyonizan Radyasyondan Korunma Komitesi (International Commission on Non-Ionizing Radiation Protection-

ICNIRP) yönergelerine uygundur. Ürününüzün SAR değerini almak için https://support.lenovo.com/us/en/

solutions/sar adresine gidin ve ekrandaki yönergeleri izleyin.

Chapter 3. Europe — EU Declaration of Conformity

19

20

ThinkPad X1 Carbon Gen 9 Regulatory Notice

Chapter 4. Trademarks

LENOVO, LENOVO logo, THINKPAD and THINKPAD logo are trademarks of Lenovo. All other trademarks are

the property of their respective owners. © 2020 Lenovo.

© Copyright Lenovo 2021

21

22

ThinkPad X1 Carbon Gen 9 Regulatory Notice

Part Number: SP40T10130

Printed in

(1P) P/N: SP40T10130

*1PSP40T10130*



 

 

EM120R-GL&EM160R-GL Hardware Design Rev. EM120R-GL&EM160R-GL_Hardware_Design_V1.0 LTE-A Module Series Date: 2020-07-02 Status: Preliminary www.quectel.com LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT WITHOUT PERMISSION ARE FORBIDDEN. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved. EM120R-GL&EM160R-GL_Hardware_Design 1 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design About the Document Revision History Version Date Author Description 1.0 2020-07-02 Jim HAN/

Charls SHENG Initial EM120R-GL&EM160R-GL_Hardware_Design 2 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Table Index ................................................................................................................................................... 5 Figure Index ................................................................................................................................................. 7 1 Introduction .......................................................................................................................................... 9 1.1. Safety Information ..................................................................................................................... 10 2 Product Concept ................................................................................................................................ 11 2.1. General Description .................................................................................................................. 11 2.2. Key Features ............................................................................................................................. 12 2.3. Functional Diagram ................................................................................................................... 14 2.4. Evaluation Board ....................................................................................................................... 15 3 Application Interfaces........................................................................................................................ 16 3.4.1. 3.4.2. 3.4.2.1. 3.4.2.2. 3.4.1.1. 3.4.1.2. 3.4.1.3. 3.1. Pin Assignment ......................................................................................................................... 17 3.2. Pin Description .......................................................................................................................... 18 3.3. Power Supply ............................................................................................................................ 23 3.3.1. Decrease Voltage Drop .................................................................................................. 23 3.3.2. Reference Design for Power Supply.............................................................................. 24 3.4. Turn-on and Turn-off Scenarios ................................................................................................ 25 Turn on the Module ........................................................................................................ 25 Turn on the Module with a Host GPIO ................................................................ 25 Turn on the Module Automatically ....................................................................... 26 Turn on the Module with Compatible Design ...................................................... 26 Turn off the Module ........................................................................................................ 28 Turn off the Module through FULL_CARD_POWER_OFF#............................... 28 Turn off the Module through AT Command ......................................................... 28 3.5. Reset ......................................................................................................................................... 30 3.6.

(U)SIM Interfaces ...................................................................................................................... 32 3.7. USB Interface ............................................................................................................................ 37 3.8. PCIe Interface ........................................................................................................................... 39 3.8.1. Endpoint Mode ............................................................................................................... 40 3.8.2. USB Version and PCIe Only Version ............................................................................. 42 3.9. PCM Interface* .......................................................................................................................... 43 3.10. Control and Indicator Signals* .................................................................................................. 45 3.10.1. W_DISABLE1# Signal.................................................................................................... 45 3.10.2. W_DISABLE2# Signal.................................................................................................... 46 3.10.3. WWAN_LED# Signal...................................................................................................... 47 3.10.4. WAKE_ON_WAN# Signal .............................................................................................. 48 3.10.5. DPR ................................................................................................................................ 49 3.10.6. ANT_CONFIG Signal ..................................................................................................... 50 3.11. COEX UART Interface* ............................................................................................................. 50 EM120R-GL&EM160R-GL_Hardware_Design 3 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.12. Antenna Tuner Control Interfaces*............................................................................................ 51 3.12.1. Antenna Tuner Control Interface through GPIOs .......................................................... 51 3.12.2. Antenna Tuner Control Interface through RFFE ............................................................ 51 3.13. Configuration Pins ..................................................................................................................... 52 3.13.1. EM160R-GL configuration pins ...................................................................................... 52 3.13.2. EM120R-GL configuration pins ...................................................................................... 53 4 GNSS Receiver ................................................................................................................................... 55 4.1. General Description .................................................................................................................. 55 5 Antenna Connection .......................................................................................................................... 56 5.1. Antenna Connectors ................................................................................................................. 56 5.1.1. Operating Frequency ..................................................................................................... 57 5.2. GNSS Antenna Connector ........................................................................................................ 59 5.3. Antenna Installation................................................................................................................... 60 5.3.1. Antenna Requirements .................................................................................................. 60 5.3.2. Recommended RF Connector for Antenna Installation ................................................. 62 6 Electrical, Reliability and Radio Characteristics ............................................................................ 64 6.1. Absolute Maximum Ratings ...................................................................................................... 64 6.2. Power Supply Requirements .................................................................................................... 64 6.3. I/O Requirements ...................................................................................................................... 65 6.4. Operation and Storage Temperatures....................................................................................... 65 6.5. Current Consumption ................................................................................................................ 66 6.6. RF Output Power ...................................................................................................................... 66 6.7. RF Receiving Sensitivity ........................................................................................................... 67 6.8. Characteristics........................................................................................................................... 68 6.9. Thermal Dissipation .................................................................................................................. 69 7 Mechanical Dimensions and Packaging.......................................................................................... 71 7.1. Mechanical Dimensions of the Module ..................................................................................... 71 7.2. Standard Dimensions of M.2 PCI Express ............................................................................... 72 7.3. Design Effect Drawings of the Module...................................................................................... 73 7.3.1. Design Effect Drawings of EM160R-GL Module............................................................ 73 7.3.2. Design Renderings of EM120R-GL Module .................................................................. 74 7.4. M.2 Connector........................................................................................................................... 75 7.5. Packaging.................................................................................................................................. 75 8 Appendix References ........................................................................................................................ 77 EM120R-GL&EM160R-GL_Hardware_Design 4 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table Index Table 1: Frequency Bands and GNSS Types of EM120R-GL&EM160R-GL .............................................11 Table 2: Definition of I/O Parameters ......................................................................................................... 18 Table 3: Pin Description.............................................................................................................................. 18 Table 4: Pin Definition of VCC and GND.................................................................................................... 23 Table 5: Pin Definition of FULL_CARD_POWER_OFF# ........................................................................... 25 Table 6: Description of Turn-on Timing of the Module ............................................................................... 27 Table 7: Description of the Timing of Resetting the Module througn FULL_CARD_POWER_OFF#........ 28 Table 8: Pin Definition of RESET# ............................................................................................................. 30 Table 9: Timing of Resetting the Module .................................................................................................... 32 Table 10: Pin Definition of (U)SIM Interfaces ............................................................................................. 33 Table 11: Pin Definition of USB Interface ................................................................................................... 37 Table 12: Pin Definition of PCIe Interface .................................................................................................. 39 Table 13: Description of PCIe Power-on Timing Requirements of the Module ......................................... 42 Table 14: Pin Definition of PCM Interface .................................................................................................. 44 Table 15: Definition of Control and Indicator Signals ................................................................................. 45 Table 16: RF Function Status ..................................................................................................................... 46 Table 17: GNSS Function Status ............................................................................................................... 46 Table 18: RF Status Indications of WWAN_LED# Signal .......................................................................... 48 Table 19: State of the WAKE_ON_WAN# Signal....................................................................................... 48 Table 20: Function of the DPR Signal ........................................................................................................ 49 Table 21: Pin Definition of ANT_COMNFIG of EM160R-GL ...................................................................... 50 Table 22: Pin Definition of COEX UART Interface ..................................................................................... 50 Table 23: Pin Definition of Antenna Tuner Control Interface through GPIOs............................................. 51 Table 24: Pin Definition of Antenna Tuner Control Interface through RFFE .............................................. 51 Table 25: List of EM160R-GL Configuration Pins ...................................................................................... 52 Table 26: List of EM160R-GL Configuration Pins ...................................................................................... 53 Table 27: List of EM120R-GL Configuration Pins ...................................................................................... 53 Table 28: List of EM120R-GL Configuration Pins ...................................................................................... 54 Table 29: Operating Frequencies of EM120R-GL&EM160R-GL ............................................................... 57 Table 30: GNSS Frequency........................................................................................................................ 59 Table 31: Antenna Requirements of EM160R-GL...................................................................................... 60 Table 32: Antenna Requirements of EM120R-GL...................................................................................... 61 Table 33: Major Specifications of the RF Connector.................................................................................. 62 Table 34: Absolute Maximum Ratings ........................................................................................................ 64 Table 35: Power Supply Requirements ...................................................................................................... 64 Table 36: I/O Requirements........................................................................................................................ 65 Table 37: Operation and Storage Temperatures ........................................................................................ 65 Table 38: EM120R-GL&EM160R-GL Current Consumption...................................................................... 66 Table 39: RF Output Power ........................................................................................................................ 66 Table 40: EM120R-GL&EM160R-GL Conducted RF Min. Receiving Sensitivity ...................................... 67 Table 41: Electrostatic Discharge Characteristics (Temperature: 25 C, Humidity: 40%) ......................... 69 EM120R-GL&EM160R-GL_Hardware_Design 5 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 42: Related Documents .................................................................................................................... 77 Table 43: Terms and Abbreviations ............................................................................................................ 77 EM120R-GL&EM160R-GL_Hardware_Design 6 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure Index Figure 1: Functional Diagram ..................................................................................................................... 14 Figure 2: Pin Assignment ........................................................................................................................... 17 Figure 3: Power Supply Limits during Radio Transmission ....................................................................... 23 Figure 4: Reference Circuit of VCC............................................................................................................ 24 Figure 5: Reference Design of Power Supply............................................................................................ 24 Figure 6: Turn on the Module with a Host GPIO ........................................................................................ 25 Figure 7: Turn on the Module Automatically............................................................................................... 26 Figure 8: Turn on the Module with Compatible Design .............................................................................. 26 Figure 9: Turn-on Timing of the Module ..................................................................................................... 27 Figure 10: Timing of Turning off the Module through FULL_CARD_POWER_OFF#................................ 28 Figure 11: Timing of Turning off the Module through AT Command and FULL_CARD_POWER_OFF# .. 29 Figure 12: Timing of Turning off the Module through AT Command and Power Supply............................ 29 Figure 13: Reference Circuit of RESET_N with NPN Driving Circuit......................................................... 30 Figure 14: Reference Circuit of RESET_N with NMOS Driving Circuit ..................................................... 31 Figure 15: Reference Circuit of RESET_N with Button ............................................................................. 31 Figure 16: Timing of Resetting the Module ................................................................................................ 32 Figure 17: Reference Circuit of Normally Closed (U)SIM1 Card Connector ............................................. 34 Figure 18: Reference Circuit of Normally Open (U)SIM1 Card Connector................................................ 34 Figure 19: Reference Circuit of a 6-Pin (U)SIM1 Card Connector ............................................................ 35 Figure 20: Recommended Compatible Design of (U)SIM2 Interface ........................................................ 36 Figure 21: Reference Circuit of USB 3.0/2.0 Interface .............................................................................. 38 Figure 22: PCIe Interface Reference Circuit (EP Mode)............................................................................ 40 Figure 23: PCIe Power-on Timing Requirements of M.2 Specification ..................................................... 41 Figure 24: PCIe Power-on Timing Requirements of the Module ............................................................... 41 Figure 25: Primary Mode Timing ................................................................................................................ 43 Figure 26: Auxiliary Mode Timing ............................................................................................................... 44 Figure 27: W_DISABLE1# and W_DISABLE2# Reference Circuit ........................................................... 47 Figure 28: WWAN_LED# Signal Reference Circuit ................................................................................... 47 Figure 29: WAKE_ON_WAN# Signal Reference Circuit Design ............................................................... 49 Figure 30: Recommended Circuit of EM160R-GL Configuration Pins ...................................................... 52 Figure 31: Recommended Circuit of EM120R-GL Configuration Pins ...................................................... 53 Figure 32: Antenna Connectors on the EM160R-GL Module .................................................................... 56 Figure 33: Antenna Connectors on the EM120R-GL Module .................................................................... 57 Figure 34: EM120R-GL&EM160R-GL RF Connector Dimensions (Unit: mm) .......................................... 62 Figure 35: Specifications of Mating Plugs Using 0.81 mm Coaxial Cables ............................................ 63 Figure 36: Connection between RF Connector and Mating Plug Using 0.81 mm Coaxial Cable .......... 63 Figure 37: Connection between RF Connector and Mating Plug Using 1.13 mm Coaxial Cable .......... 63 Figure 38: Thermal Dissipation Area on Bottom Side of Module (Top View)............................................. 69 Figure 39: Mechanical Dimensions of EM120R-GL&EM160R-GL (Unit: mm) .......................................... 71 Figure 40: Standard Dimensions of M.2 Type 3042-S3 (Unit: mm) ........................................................... 72 Figure 41: M.2 Nomenclature..................................................................................................................... 72 EM120R-GL&EM160R-GL_Hardware_Design 7 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 42: Top View of the Module............................................................................................................. 73 Figure 43: Bottom View of the Module ....................................................................................................... 73 Figure 44: Top View of the Module............................................................................................................. 74 Figure 45: Bottom View of the Module ....................................................................................................... 74 Figure 46: Tray Size (Unit: mm) ................................................................................................................. 75 Figure 47: Tray Packaging Procedure ....................................................................................................... 76 EM120R-GL&EM160R-GL_Hardware_Design 8 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 1 Introduction This document defines EM120R-GL&EM160R-GL and describes its air interfaces and hardware interfaces which are connected to customers applications. This document is applicable to the following modules:

EM120R-GL EM160R-GL This document can help customers quickly understand the interface specifications, electrical and mechanical details, as well as other related information of EM120R-GL&EM160R-GL. To facilitate its application in different fields, reference design is also provided for customers reference. This document, coupled with application notes and user guides, can help customers use the module to design and set up mobile applications easily. EM120R-GL&EM160R-GL_Hardware_Design 9 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EM120R-GL&EM160R-GL modules. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, use emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as mobile phone or other cellular terminals. Areas with potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders. EM120R-GL&EM160R-GL_Hardware_Design 10 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 2 Product Concept 2.1. General Description EM120R-GL&EM160R-GL are LTE-A/UMTS/HSPA+ wireless communication modules with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks with standard PCI Express M.2 interface. It supports embedded operating systems such as Windows, Linux and Android, and provides GNSS 1) and voice functionality 2) to meet customers specific application demands. The following table shows the frequency bands and GNSS types of EM120R-GL&EM160R-GL. Table 1: Frequency Bands and GNSS Types of EM120R-GL&EM160R-GL Mode EM120R-GL&EM160R-GL LTE-FDD

(with Rx-diversity/MIMO 5)) LTE-TDD

(with Rx-diversity/MIMO 5)) WCDMA

(with Rx-diversity) GNSS 1) NOTES B1 4)/B2 4)/B3 4)/B4 4)/B5/B7 4)/

B8/B12/B13/B14/B17/B18/B19/B20/B25 4)/B26/B28/

B29 3)/B30 4)/B32 3) 4)/B66 4) B38 4)/B39 4)/B40 4)/B41 4)/B42/B43/B46 3)/B48 B1/B2/B3/B4/B5/B6/B8/B19 GPS;

GLONASS;

BeiDou/Compass;

Galileo 1. 1) GNSS function is optional. 2. 2) EM120R-GL&EM160R-GL contain Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. 3. 3) LTE-FDD B29/B32 and LTE-TDD B46 support Rx only and are only for secondary component EM120R-GL&EM160R-GL_Hardware_Design 11 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design carrier. 4. 4) EM160R-GL supports up to 4 4 MIMO in DL direction. 5. 5) MIMO antennas only apply for EM160R-GL. 6. For details about CA combinations, refer to document [1]. EM120R-GL&EM160R-GL can be applied in the following fields:

Tablet PC and Laptop Remote Monitor System Vehicle System Wireless POS System Smart Metering System Wireless Router and Switch Other Wireless Terminal Devices 2.2. Key Features The following table describes the detailed features of EM120R-GL&EM160R-GL. Table 2: Key Features of EM120R-GL&EM160R-GL Feature Details Function Interface PCI Express M.2 Interface Power Supply Supply voltage: 3.1354.4 V Typical supply voltage: 3.7 V Transmitting Power Class 3 (23 dBm 2 dB) for LTE-FDD bands Class 3 (23 dBm 2 dB) for LTE-TDD bands Class 3 (24 dBm +1/-3 dB) for WCDMA EM160R-GL Support up to LTE Cat 16 Support 1.4100 MHz (5CA) RF bandwidth Support 4 4 MIMO in DL direction Up to 1000 Mbps (DL)/150 Mbps (UL) EM120R-GL Support up to LTE Cat 12 Support 1.460 MHz (3CA) RF bandwidth Support 2 2 MIMO in DL direction Up to 600 Mbps (DL)/150 Mbps (UL) LTE Features EM120R-GL&EM160R-GL_Hardware_Design 12 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design UMTS Features Internet Protocol Features Support 3GPP R9 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16QAM and 64QAM modulation DC-HSDPA: Max 42 Mbps (DL) HSUPA: Max 5.76 Mbps (UL) WCDMA: Max 384 Kbps (DL)/384 Kbps (UL) Support PPP/QMI/NTP*/TCP*/UDP*/FTP*/HTTP*/PING*/HTTPS*/

SMTP*/MMS*/FTPS*/SMTPS*/SSL* protocols Support the protocols PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) usually used for PPP connections SMS Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default

(U)SIM Interfaces Support (U)SIM card: 1.8/3.0 V Support Dual SIM Single Standby*

Compliant with USB 3.0 and 2.0 specifications, with maximum transmission rates up to 5 Gbps on USB 3.0 and 480 Mbps on USB 2.0. Used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA sentences output and voice over USB*

USB Interface Support USB serial drivers for:

Windows: 7/8/8.1/10 Linux: 2.6/3.x/4.14.15 Android: 4.x/5.x/6.x/7.x/8.x/9.x PCIe x1 Interface Antenna connectors Comply with PCI Express Specification, Revision 2.1 and support 5 Gbps per lane Used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA sentences output EM160R-GL Provide Main, Rx-diversity/GNSS, MIMO1 and MIMO2 antenna connectors EM120R-GL Provide Main and Rx-diversity/GNSS antenna connectors Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Gen9 Lite of Qualcomm Protocol: NMEA-0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Physical Characteristics Size: 42.0 0.15 mm 30.0 0.15 mm 2.3 0.1 mm Weight: approx. 6 g Temperature Range Operation temperature range: -25 C to +75 C 1) EM120R-GL&EM160R-GL_Hardware_Design 13 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Extended temperature range: -40 C to +85 C 2) Storage temperature range: -40 C to +90 C Firmware Upgrade USB 2.0 interface, PCIe interface and DFOTA RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. 3. 1) Within operating temperature range, the module is 3GPP compliant. For those end devices with bad thermal dissipation condition, a thermal pad or other thermal conductive components may be required between the module and main PCB to achieve the full operating temperature range. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their values and exceed the specified tolerances. When the temperature returns to normal operating temperature level, the module will meet 3GPP specifications again.

* means under development. 2.3. Functional Diagram The following figure shows a block diagram of EM120R-GL&EM160R-GL. Figure 1: Functional Diagram EM120R-GL&EM160R-GL_Hardware_Design 14 / 79 VCC FULL_CARD_POWER_OFF#

RESET#

e c a f r e t n I

. B

y e K 2 M s s e r p x E I C P USB2.0&USB3.0

(U)SIM1&(U)SIM2 W_DISABLE1#

WWAN_LED#

WAKE_ON_WAN#

RFFE PCM GPIOs PCIe W_DISABLE2#

PMIC T E 38.4M XO l o r t n o C Baseband IQ Control i r e v e c s n a r T NAND Flash +

DDR4 SDRAM Tx PRx MIMO1 MIMO2 DRx l s k c o B x R

x T ANT_DIV/GNSS MIMO1 MIMO2 ANT_MAIN LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE MIMO1 and MIMO2 antennas are only applicable to the EM160R-GL module. 2.4. Evaluation Board To help customers develop applications conveniently with EM120R-GL&EM160R-GL, Quectel supplies the evaluation board (M.2 EVB), USB to RS-232 converter cable, USB type-C cable, earphone, antenna and other peripherals to control or test the module. For more details, refer to document [2]. EM120R-GL&EM160R-GL_Hardware_Design 15 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3 Application Interfaces the

(U)SIM interfaces the definition and application of The physical connections and signal levels of EM120R-GL&EM160R-GL comply with PCI Express M.2 specifications. This chapter mainly describes following interfaces/signals/pins of EM120R-GL&EM160R-GL:

Power supply USB interface PCM interface*

PCIe interface Control and indicator signals*

Antenna tuner control interfaces*

Configuration pins COEX UART Interface*

NOTE

* means under development. EM120R-GL&EM160R-GL_Hardware_Design 16 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.1. Pin Assignment The following figure shows the pin assignment of EM120R-GL&EM160R-GL. The top side contains EM120R-GL&EM160R-GL and antenna connectors. Figure 2: Pin Assignment EM120R-GL&EM160R-GL_Hardware_Design 17 / 79 PIN74 PIN75 BOT TOP PIN10 PIN2 PIN11 PIN1 Pin Name CONFIG_2 GND GND CONFIG_1 RESET#

ANTCTL3 ANTCTL2 ANTCTL1 ANTCTL0 GND PCIE_REFCLK_P PCIE_REFCLK_M GND PCIE_RX_P PCIE_RX_M GND PCIE_TX_P PCIE_TX_M GND USB_SS_RX_P USB_SS_RX_M USB_SS_TX_P USB_SS_TX_M WAKE_ON_WAN#

CONFIG_0 GND GND DPR Notch Notch Notch Notch GND USB_DM USB_DP GND GND CONFIG_3 No. 75 73 71 69 67 65 63 61 59 57 55 53 51 49 47 45 43 41 39 37 35 33 31 29 27 25 23 21 11 9 7 5 3 1 No. 74 72 70 68 66 64 62 60 58 56 54 52 50 48 46 44 42 40 38 36 34 32 30 28 26 24 22 20 10 8 6 4 2 PCIE_WAKE_N PCIE_CLKREQ_N Pin Name VCC VCC VCC ANT_CONFIG USIM1_DET COEX_TXD COEX_RXD COEX3 RFFE_DATA RFFE_CLK PCIE_RST_N USIM2_VDD USIM2_RST USIM2_CLK USIM2_DATA USIM2_DET NC USIM1_VDD USIM1_DATA USIM1_CLK USIM1_RST PCM_SYNC PCM_DIN PCM_CLK Notch Notch Notch Notch VCC VCC W_DISABLE2#

PCM_DOUT/VDDIO WWAN_LED#

W_DISABLE1#

FULL_CARD_POWER_OFF#

LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.2. Pin Description The following tables show the pin definition and description of EM120R-GL&EM160R-GL. Table 2: Definition of I/O Parameters Description Analog Input Analog Output Digital Input Digital Output Bidirectional Open Drain Power Input Power Output Type AI AO DI DO IO OD PI PO 1 2 3 4 5 6 Table 3: Pin Description Pin No. M.2 Socket 2 WWAN Module Pinout EM120R-GL&EM1 60R-GL Pin Name I/O Description Comment CONFIG_3 CONFIG_3 NC 3.3V VCC PI Power supply GND GND Ground 3.3V VCC PI Power supply Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V GND GND Ground FULL_CARD_ POWER_OFF#(I)

(0/1.8V) FULL_CARD_ POWER_OFF#

DI Turn on/off the module. When it is at low level, the module is powered Pulled down internally. EM120R-GL&EM160R-GL_Hardware_Design 18 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design USB_D+

USB_DP AI/AO W_DISABLE1# W_DISABLE1#

DI Airplane mode control. Active low. 1.8/3.3 V power domain USB_D-

USB_DM AI/AO 10 GPIO_9 WWAN_LED#

OD off. When it is at high level, the module is powered on. USB 2.0 differential data bus (+) USB 2.0 differential data bus (-) RF status indication. Active low. GND Notch Notch Notch Notch Notch Notch Notch Notch Ground Notch Notch Notch Notch Notch Notch Notch Notch 20 GPIO_5

(AUDIO_0) PCM_CLK DI 21 CONFIG_0 CONFIG_0 GPIO_6

(AUDIO_1) PCM_DIN PO PCM data input GPIO_11

(WOWWAN#) WAKE_ON_ WAN#

OD Wake up the host. Active low. GPIO_7

(AUDIO_2) PCM_DOUT

/VDDIO DO/P O PCM data bit clock. In master mode, it is an output signal. In slave mode, it is an input signal. EM120R-GL: Connected to GND internally;

EM160R-GL: NC PCM data output;

Could be designed to be compatible with 1.8 V power supply. 1.8 V power domain. If unused, keep it open. 1.8 V power domain 1.8/3.3 V power domain 1.8 V power domain EM120R-GL&EM160R-GL_Hardware_Design 19 / 79 11 GND 12 Key 13 Key 14 Key 15 Key 16 Key 17 Key 18 Key 19 Key 7 8 9 22 23 24 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 25 DPR DPR DI Dynamic power reduction. Active low. 1.8 V power domain. 26 GPIO_10

(W_DISABLE2#) W_DISABLE2#

DI GNSS enable control. Active low. 1.8/3.3 V power domain 27 GND GND Ground 28 GPIO_8

(AUDIO_3) PCM_SYNC IO PCM data frame synchronization 1.8 V power domain 29 USB3.0-TX-

USB_SS_TX_M AO USB 3.0 transmit data

(-) USB 3.0 transmit data

(+) 30 UIM-RESET USIM1_RST DO

(U)SIM1 card reset 31 USB3.0-TX+

USB_SS_TX_P AO 32 UIM-CLK USIM1_CLK DO

(U)SIM1 card clock 33 GND GND Ground 1.8/3.0 V power domain 1.8/3.0 V power domain Pulled up to USIM1_VDD internally. 34 UIM-DATA USIM1_DATA IO

(U)SIM1 card data 35 USB3.0-RX-

USB_SS_RX_M AI USB 3.0 receive data (-) 36 UIM-PWR USIM1_VDD PO Power supply for

(U)SIM1 card 1.8/3.0 V power domain 37 USB3.0-RX+

USB_SS_RX_P AI USB 3.0 receive data (+) 38 N/C 39 GND NC GND NC Ground 40 GPIO_0

(SIM_DET2) USIM2_DET DI

(U)SIM2 card insertion detection 41 PETn0 PCIE_TX_M AO PCIe transmit data (-) USIM2_DATA IO

(U)SIM2 card data 42 GPIO_1

(SIM_DAT2) 44 GPIO_2

(SIM_CLK2) 43 PETp0 PCIE_TX_P AO PCIe transmit data (+) USIM2_CLK DO

(U)SIM2 card clock Pulled up internally. 1.8 V power domain. Pulled up to USIM2_VDD internally 1.8/3.0 V power domain EM120R-GL&EM160R-GL_Hardware_Design 20 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 45 GND GND Ground 46 48 GPIO_3

(SIM_RST2) GPIO_4

(SIM_PWR2) USIM2_RST DO

(U)SIM2 card reset 1.8/3.0 V power domain 47 PERn0 PCIE_RX_M AI PCIe receive data (-) USIM2_VDD PO Power supply for

(U)SIM2 card 1.8/3.0 V power domain 49 PERp0 PCIE_RX_P PCIe receive data (+) 50 PCIE_RST_N PCIE_RST_N PCIe reset input. Active low. 3.3 V power domain 51 GND GND Ground AI DI 52 PCIE_CLKREQ_ N PCIE_CLKREQ_N DO PCIe clock request. Active low. 3.3 V power domain 53 REFCLKn PCIE_REFCLK_M AI/AO PCIe reference clock (-) 54 PEWAKE#

PCIE_WAKE_N IO PCIe wake up the host. Active low. 3.3 V power domain 55 REFCLKp PCIE_REFCLK_P AI/AO PCIe reference clock (+) 56 N/C RFFE_CLK DO RFFE clock 57 GND GND Ground 58 N/C RFFE_DATA IO RFFE data 59 ANTCTL0 ANTCTL0 DO Antenna tuner control 60 COEX3 COEX3 IO COEX GPIO 61 ANTCTL1 ANTCTL1 DO Antenna tuner control 62 COEX2 COEX_RXD DI 63 ANTCTL2 ANTCTL2 DO Antenna tuner control COEX UART receive data COEX UART transmit data 64 COEX1 COEX_TXD DO 65 ANTCTL3 ANTCTL3 DO Antenna tuner control 66 SIM_DETECT USIM1_DET DI

(U)SIM1 card insertion detection 1.8 V power domain 1.8 V power domain 1.8 V power domain 1.8 V power domain 1.8 V power domain 1.8 V power domain 1.8 V power domain Pulled up internally. 1.8 V power EM120R-GL&EM160R-GL_Hardware_Design 21 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 67 RESET#

RESET#

DI WWAN reset input Active low. 68 SUSCLK (32kHz) ANT_CONFIG DI Antenna configuration 69 CONFIG_1 CONFIG_1 Connected to GND internally 70 3.3V VCC PI Power supply 71 GND GND Ground 72 3.3V VCC PI Power supply 73 GND GND Ground 74 3.3V VCC PI Power supply 75 CONFIG_2 CONFIG_2 NC NOTE Please keep all NC, reserved and unused pins unconnected. domain. Pulled up internally. 1.8 V power domain. Pulled up internally. 1.8 V power domain. Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V EM120R-GL&EM160R-GL_Hardware_Design 22 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.3. Power Supply The following table shows definition of VCC pins and ground pins. Table 4: Pin Definition of VCC and GND Pin No. Pin Name Power Domain Description 2, 4, 70, 72, 74 VCC 3.1354.4 V 3.7 V typical DC supply I/O PI Ground 3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73 GND 3.3.1. Decrease Voltage Drop The power supply range of the module is from 3.135 V to 4.4 V. Make sure that the input voltage never drops below 3.135 V, otherwise the module will be powered off automatically. The following figure shows the maximum voltage drop during radio transmission in 3G and 4G networks. Figure 3: Power Supply Limits during Radio Transmission To decrease voltage drop, a bypass capacitor of about 220 F with low ESR (ESR = 0.7 ) should be used, and a multi-layer ceramic chip capacitor (MLCC) array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to VCC pins. The main power supply from an external application must be a single voltage source. The width of VCC trace should be no less than 2 mm. In principle, a longer VCC trace indicates a wider VCC trace. In addition, in order to get a stable power source, it is recommended to use a zener diode with reverse zener voltage of 5.1 V and dissipation power more than 0.5 W. The following figure shows a reference EM120R-GL&EM160R-GL_Hardware_Design 23 / 79 Max Tx power Max Tx power VCC Min. 3.135 V Drop Ripple LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design circuit of VCC. Figure 4: Reference Circuit of VCC 3.3.2. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply can provide sufficient current (at least 2.5 A). If the voltage drop between the input and output is not too high, an LDO is suggested to be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VCC), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5 V input power source. The typical output of the power supply is about 3.7 V and the maximum load current is 3 A. Figure 5: Reference Design of Power Supply EM120R-GL&EM160R-GL_Hardware_Design 24 / 79 VCC

D1 C1 C2 C3 C4 C5 5.1 V 220 F 1 F 100 nF 33 pF 10 pF Module VCC LDO_IN VCC MIC29302WU 2 IN R1 N E U1 D N G 4 OUT J D A 1 3 5 D1 C1 C2 TVS 470F 100nF R2 R3

1 K 0 0 1

1 K 1 5 R4 C3 C4 C5 C6 470R 470F 100nF 33pF 10pF R5 4.7K MCU_POWER _ON/OFF R6 47K LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE In order to avoid damages to the internal flash, do not cut off the power supply directly when the module is working. It is suggested that the power supply should be cut off after the module is shut down. 3.4. Turn-on and Turn-off Scenarios 3.4.1. Turn on the Module Pulling up the FULL_CARD_POWER_OFF# pin will power on the module. The following table shows the pin definition of FULL_CARD_POWER_OFF#. Table 5: Pin Definition of FULL_CARD_POWER_OFF#

Pin Name Pin No. Description DC Characteristics Comment FULL_CARD _POWER_ OFF#

6 Turn on/off the module. When it is at low level, the module is powered off. When it is at high level, the module is powered on. VIHmax = 4.4 V VIHmin = 1.19 V VILmax = 0.2 V Pulled down internally. 3.4.1.1. Turn on the Module with a Host GPIO It is recommended to use a host GPIO to control FULL_CARD_POWER_OFF#. A simple reference circuit is illustrated in the following figure. Figure 6: Turn on the Module with a Host GPIO EM120R-GL&EM160R-GL_Hardware_Design 25 / 79 Host GPIO GND 1.8 V or 3.3 V Module FULL_CARD_POWER_OFF#

GND LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.4.1.2. Turn on the Module Automatically If FULL_CARD_POWER_OFF# is pulled up to VCC with a 510 k resistor, the module will be powered on automatically when the power supply for VCC is applied. A reference circuit is shown in the following figure. Figure 7: Turn on the Module Automatically 3.4.1.3. Turn on the Module with Compatible Design The following figure shows a compatible design to turn on the module automatically after power-up or by host. Figure 8: Turn on the Module with Compatible Design EM120R-GL&EM160R-GL_Hardware_Design 26 / 79 Host Module VCC_IO_HOST R1 10K GPIO GND FULL_CARD_POWER_OFF#

6 GND Notes:

1. The voltage of pin 6 should be no less than 1.19 V when it is at HIGH level. 2. The voltage level VCC_IO_HOST could be a 1.8 V or 3.3 V typically. Host Auto turn on Turn on by host R1 R2 10 K NM NM 0 Module VCC_IO_HOST R1 10K GPIO GND R2 NM_0 6 FULL_CARD_POWER_OFF#

GND Notes:

1. The voltage of pin 6 should be no less than 1.19 V when it is at HIGH level. 2. The voltage level VCC_IO_HOST could be 1.8 V or 3.3 V typically. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The turn-on scenario is illustrated in the following figure. Figure 9: Turn-on Timing of the Module Table 6: Description of Turn-on Timing of the Module Index Min. Typical Max. Comment T1 0 ms 50 ms T2 0 ms 20 ms

T3 T4 0 ms 15 ms 20 ms

100 ms

RESET# is pulled up internally, and it would be de-asserted 50 ms after VCC is powered on. FULL_CARD_POWER_OFF# could be de-asserted before or after RESET#, 20 ms is a recommended value when it is controlled by GPIO. DPR or ANT_CONFIG should be asserted before modem initialize. PCIE_RST_N should be de-asserted 100 ms after FULL_CARD_POWER_OFF#. EM120R-GL&EM160R-GL_Hardware_Design 27 / 79 VCC RESET#

T1 T2 FULL_CARD_POWER_OFF#

DPR/ANT_CONFIG PCIE_RST_N T3 T4 Typical 11.6 s OFF Booting Active LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.4.2. Turn off the Module 3.4.2.1. Turn off the Module through FULL_CARD_POWER_OFF#

Pulling down the FULL_CARD_POWER_OFF# pin will turn off the module. The turn-off scenario is illustrated in the following figure. Figure 10: Timing of Turning off the Module through FULL_CARD_POWER_OFF#

T1 T2 T3 Table 7: Description of the Timing of Resetting the Module througn FULL_CARD_POWER_OFF#

Index Min. Typical Max. Comments 0 ms 20 ms

PCIE_RST_N should be asserted before RESET#. 0 ms 10 ms 200 ms RESET# is recommended to be asserted before FULL_CARD_POWER_OFF#

10 ms

If power is always on, it could be ignored. 3.4.2.2. Turn off the Module through AT Command It is a safe way to use AT+QPOWD command to turn off the module. For more details about the command, refer to document [3]. For the circuit design of Figure 6, pull down FULL_CARD_POWER_OFF# pin, or cut off power supply of VCC after the modules USB/PCIe is removed. Otherwise, the module will be powered on again. EM120R-GL&EM160R-GL_Hardware_Design 28 / 79 VCC FULL_CARD_POWER_OFF#

T3 RESET#

PCIE_RST_N T2 T1 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 11: Timing of Turning off the Module through AT Command and FULL_CARD_POWER_OFF#

For the circuit design of Figure 7, cut off power supply of VCC after the modules USB/PCIe is removed, as illustrated in Figure 11. Otherwise, the module will be powered on again. Figure 12: Timing of Turning off the Module through AT Command and Power Supply NOTE Please pull down FULL_CARD_POWER_OFF# pin immediately or cut off the power supply of VCC when the host detects that the module is removed. EM120R-GL&EM160R-GL_Hardware_Design 29 / 79 VCC RESET#(H) USB/PCIe FULL_CARD_POWER_OFF#

AT+QPOWD USB/PCIe remove Module Status Running Power-off procedure OFF VCC RESET#(H) USB/PCIe FULL_CARD_POWER_OFF#(H) AT+QPOWD USB/PCIe remove Module Status Running Power-off procedure OFF LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.5. Reset The RESET# pin is used to reset the module. The module can be reset by driving RESET# to a low-level voltage for 200700 ms. Table 8: Pin Definition of RESET#

Pin Name Pin No. Description DC Characteristics Comment RESET#

67 Reset the module VIHmax = 2.1 V VIHmin = 1.3 V VILmax = 0.5 V Pulled up internally. 1.8 V power domain. An open collector/drain driver or button can be used to control the RESET# pin. Figure 13: Reference Circuit of RESET_N with NPN Driving Circuit EM120R-GL&EM160R-GL_Hardware_Design 30 / 79 Host Module VDD 1.8 V R1 100K Reset Logic Reset pulse RESET_N 67 GPIO Q1 NPN R2 1K R3 100K 200700 ms LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 14: Reference Circuit of RESET_N with NMOS Driving Circuit Figure 15: Reference Circuit of RESET_N with Button EM120R-GL&EM160R-GL_Hardware_Design 31 / 79 Host Module VDD 1.8 V R1 100K Reset Logic Reset pulse RESET_N 67 GPIO Q2 NMOS R4 10 R5 100K 200700 ms Module VDD 1.8 V R1 100K RESET_N 67 Reset Logic S1 TVS C1 33 pF 200700 ms Note: The capacitor C1 is recommended to be less than 47 pF. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The reset scenario is illustrated in the following figure. Figure 16: Timing of Resetting the Module T1 T2 T3 T4 T5 Table 9: Timing of Resetting the Module Index Min. Typical Max. Comments 0 ms 20 ms

PCIE_RST_N should be asserted before RESET#. 0 ms 10 ms 200 ms 0 ms 20 ms 200 ms

100 ms

200 ms

700 ms RESET# should be asserted before FULL_CARD_POWER_OFF#. RESET# should be de-asserted after FULL_CARD_POWER_OFF#

PCIE_RST_N should be de-asserted 100 ms after FULL_CARD_POWER_OFF#. RESET# should be de-asserted no longer than 700 ms, otherwise the module would reset several times. NOTE Please ensure that there is no large capacitance on RESET# pin. 3.6. (U)SIM Interfaces The (U)SIM interfaces circuitry meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported, and Dual SIM Single Standby* function is supported. EM120R-GL&EM160R-GL_Hardware_Design 32 / 79 VCC (H) FULL_CARD_POWER_OFF#

RESET#

T2 T5 PCIE_RST_N T1 T3 T4 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 10: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM1_VDD 36 PO Power supply for (U)SIM1 card 32 30 44 46 USIM1_DATA 34 IO

(U)SIM1 card data USIM1_CLK DO

(U)SIM1 card clock USIM1_RST DO

(U)SIM1 card reset USIM1_DET 66 DI

(U)SIM1 card insertion detection. Active high. USIM2_VDD 48 PO Power supply for (U)SIM2 card USIM2_DATA 42 IO

(U)SIM2 card data USIM2_CLK DO

(U)SIM2 card clock USIM2_RST DO

(U)SIM2 card reset USIM2_DET 40 DI

(U)SIM2 card insertion detection. Active high. Either 1.8 V or 3.0 V is supported by the module automatically. Internally pulled up. When (U)SIM1 card is present, it is at high level. When (U)SIM1 card is absent, it is at low level. Either 1.8 V or 3.0 V is supported by the module automatically. Internally pulled up. When (U)SIM2 card is present, it is at high level. When (U)SIM2 card is absent, it is at low level. EM120R-GL&EM160R-GL support (U)SIM card hot-plug via the USIM_DET pin, which is a level trigger pin. The USIM_DET is normally short-circuited to ground when (U)SIM card is not inserted. When the

(U)SIM card is inserted, the USIM_DET will change from low to high level. The rising edge will indicate insertion of the (U)SIM card. When the (U)SIM card is removed, the USIM_DET will change from high to low level. This falling edge will indicate the absence of the (U)SIM card. EM120R-GL&EM160R-GL_Hardware_Design 33 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following figure shows a reference design for a (U)SIM interface with normally closed (U)SIM card connector. Figure 17: Reference Circuit of Normally Closed (U)SIM1 Card Connector Normally Closed (U)SIM Card Connector:

When the (U)SIM is absent, CD is short-circuited to SW and USIM_DET is at low level. When the (U)SIM is inserted, CD is open to SW and USIM_DET is at high level. The following figure shows a reference design for a (U)SIM interface with normally open (U)SIM card connector. Figure 18: Reference Circuit of Normally Open (U)SIM1 Card Connector EM120R-GL&EM160R-GL_Hardware_Design 34 / 79 USIM_VDD GND 15K 100 nF

(U)SIM Card Connector Module USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA 22R 22R 22R VCC RST CLK CD GND VPP IO SW GND 33 pF 33 pF 33 pF GND GND USIM_VDD GND 15K 100 nF

(U)SIM Card Connector 1.8 V 4.7K Module USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA 22R 22R 22R GND VPP IO SW VCC RST CLK CD 33K 33 pF 33 pF 33 pF GND GND LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Normally Open (U)SIM Card Connector:

When the (U)SIM is absent, CD is open to SW and USIM_DET is at low level. When the (U)SIM is inserted, CD is short-circuited to SW and USIM_DET is at high level. If (U)SIM card detection function is not needed, keep USIM_DET unconnected. The following figure shows a reference circuit for a (U)SIM card interface with a 6-pin (U)SIM card connector. Figure 19: Reference Circuit of a 6-Pin (U)SIM1 Card Connector EM120R-GL&EM160R-GL provide two (U)SIM interfaces. (U)SIM1 interface is used for external (U)SIM card only, and (U)SIM2 interface is used for external (U)SIM card or internal eSIM card. It should be noted that, when (U)SIM2 interface is used for an external (U)SIM card, the reference circuits are the same as those of (U)SIM1 interface. When (U)SIM2 interface is used for the internal eSIM card, pins 40, 42, 44, 46 and 48 of the module must be kept open. EM120R-GL&EM160R-GL_Hardware_Design 35 / 79 USIM_VDD GND Module USIM_VDD USIM_RST USIM_CLK USIM_DATA 15K 22R 22R 22R 100 nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33 pF 33 pF 33 pF GND GND LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design A recommended compatible design of (U)SIM2 interface is shown below. Figure 20: Recommended Compatible Design of (U)SIM2 Interface In order to enhance the reliability and availability of the (U)SIM card in customers applications, follow the criteria below when designing the (U)SIM circuit:

Keep placement of (U)SIM card connector as close as possible to the module. Keep the trace length as less than 200 mm as possible. Keep (U)SIM card signals away from RF and VCC traces. Assure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5 mm to maintain the same electric potential. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode array with parasitic capacitance not exceeding 10 pF. The 22 resistors should be added in series between the module and the (U)SIM card connector so as to suppress EMI spurious transmission and enhance ESD protection. The 33 pF capacitors are used to filter out RF interference. Note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA trace can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. NOTE

* means under development. EM120R-GL&EM160R-GL_Hardware_Design 36 / 79 Module USIM2_VDD 10-20K 100 nF

(U)SIM Card Connector VPP eSIM USIM2_VDD USIM2_RST USIM2_CLK USIM2_DET USIM2_DATA 48 46 44 40 42 GND 0 0 0 0 0 22 22 22 VCC RST CLK CD IO GND 33 pF33 pF33 pF TVS Note: The five 0 resistors must be close to M.2 socket connector, and all other components should be close to (U)SIM card connector in PCB layout. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.7. USB Interface EM120R-GL&EM160R-GL provide one integrated Universal Serial Bus (USB) interface which complies with the USB 3.0/2.0 specifications and supports super speed (5 Gbps) on USB 3.0, high speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB interface. Table 11: Pin Definition of USB Interface Pin No. Pin Name I/O Description Comment USB_DP AI/AO USB_DM AI/AO USB 2.0 differential data bus

(+) USB 2.0 differential data bus

(-) USB_SS_TX_M AO USB 3.0 transmit data (-) USB_SS_TX_P AO USB 3.0 transmit data (+) USB_SS_RX_M AI USB 3.0 receive data (-) USB_SS_RX_P AI USB 3.0 receive data (+) Require differential impedance of 90 Require differential impedance of 90 Require differential impedance of 90 7 9 29 31 35 37 For more details about the USB 3.0 & 2.0 specifications, visit http://www.usb.org/home. EM120R-GL&EM160R-GL_Hardware_Design 37 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The USB 2.0 interface is recommended to be reserved for firmware upgrade in customers designs. The following figure shows a reference circuit of USB 3.0/USB 2.0 interface. Figure 21: Reference Circuit of USB 3.0/2.0 Interface AC coupling capacitors C5 and C6 must be placed close to the host and close to each other. C1 and C2 have been integrated inside the module, so do not place these two capacitors on customers schematic and PCB. In order to ensure the signal integrity of USB 2.0 data traces, R1, R2, R3 and R4 components must be placed close to the module, and the stubs must be minimized in PCB layout. In order to ensure that the USB interface designs correspond with USB specifications, comply with the following principles. It is important to route the USB 2.0 & 3.0 signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90 . For USB 2.0 signal traces, the trace lengths must be less than 120 mm, and the differential data pair matching is less than 2 mm (15 ps). For USB 3.0 signal traces, the maximum length of TX and RX differential data pair is recommended to be less than 100 mm, and the TX and RX differential data pair matching is less than 0.7 mm (5 ps). Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. It is important to route the USB 2.0 & 3.0 differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. If USB connector is used, keep the ESD protection components as close as possible to the USB connector. Pay attention to the influence of junction capacitance of ESD protection components on USB 2.0 & 3.0 data traces. Typically, the capacitance value should be less than 2.0 pF for USB 2.0, and less than 0.4 pF for USB 3.0. If possible, reserve four 0 resistors (R1R4) on USB_DP and USB_DM traces, as shown in the above figure. EM120R-GL&EM160R-GL_Hardware_Design 38 / 79 C5 100 nF C6 100 nF Host USB_SS_TX_P USB_SS_TX_M USB_SS_RX_P USB_SS_RX_M USB_DM USB_DP Module C1 100 nF C2 100 nF BB USB_SS_RX_P USB_SS_RX_M USB_SS_TX_P USB_SS_TX_M R10 R20 USB_DM USB_DP 37 35 31 29 9 7 Test Points R3 NM-0 R4 NM-0 ESD Minimize these stubs in PCB layout. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE

* means under development. 3.8. PCIe Interface EM120R-GL and EM160R-GL provide one integrated PCIe (Peripheral Component Interconnect Express) interface which complies with the PCI Express Specification, Revision 2.1 and supports 5 Gbps per lane. The PCIe interface is used for data transmission, GNSS NMEA sentences output, software debugging and firmware upgrade. The following table shows the pin definition of PCIe interface. Table 12: Pin Definition of PCIe Interface Pin No. Pin Name I/O Description Comment PCIE_REFCLK_P AI/AO PCIe reference clock (+) PCIE_REFCLK_M AI/AO PCIe reference clock (-) PCIE_RX_P AI PCIe receive data (+) PCIE_RX_M PCIe receive data (-) PCIE_TX_P PCIe transmit data (+) PCIE_TX_M PCIe transmit data (-) AI AO AO Require differential impedance of 95 . Require differential impedance of 95 Require differential impedance of 95 PCIE_RST_N DI 3.3 V power domain PCIE_CLKREQ_N DO 3.3 V power domain PCIe reset input. Active low. PCIe clock request. Active low. PCIe wake up the host. Active low. PCIE_WAKE_N DO 3.3 V power domain 55 53 49 47 43 41 50 52 54 EM120R-GL&EM160R-GL_Hardware_Design 39 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.8.1. Endpoint Mode EM120R-GL and EM160R-GL support endpoint (EP) mode. In this mode, the modules are configured as a PCIe EP device. The following figure shows a reference circuit of PCIe endpoint mode. Figure 22: PCIe Interface Reference Circuit (EP Mode) In order to ensure the signal integrity of PCIe interface, AC coupling capacitors C5 and C6 should be placed close to the host on PCB. C1 and C2 have been integrated inside the module, so do not place these two capacitors on customers schematic and PCB. EM120R-GL&EM160R-GL_Hardware_Design 40 / 79 Host PCIE_REFCLK_P PCIE_REFCLK_M PCIE_TX_P PCIE_TX_M PCIE_RX_P PCIE_RX_M PCIE_WAKE_N PCIE_CLKREQ_N PCIE_RST_N C5 100 nF C6 100 nF R1 10K R2 10K R3 10K VCC_IO_HOST PCIE_REFCLK_P PCIE_REFCLK_M PCIE_RX_P PCIE_RX_M PCIE_TX_P PCIE_TX_M 55 53 49 47 43 41 Module C1 100 nF C2 100 nF BB PCIE_WAKE_N PCIE_CLKREQ_N PCIE_RST_N 54 52 50 Note: The voltage level VCC_IO_HOST depends on the host side due to open drain in pin 50, 52 and 54. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 23: PCIe Power-on Timing Requirements of M.2 Specification Figure 24: PCIe Power-on Timing Requirements of the Module EM120R-GL&EM160R-GL_Hardware_Design 41 / 79 VCC T1 FULL_CARD_POWER_OFF#

T2 RESET#

PCIE_CLKREQ_N T3 T4 T5 PCIE_RST_N PCIE_REFCLK Active clock state LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 13: Description of PCIe Power-on Timing Requirements of the Module Index Min. Typical Max. Comment T1 0 ms 20 ms T2 T3 T4

50 ms 70 ms 100 ms T5 100 s

FULL_CARD_POWER_OFF# could be de-asserted before or after RESET#, 20 ms is a recommended value when it is controlled by GPIO. RESET# is pulled up internally, and it would be de-asserted 50 ms after VCC is powered on. PCIE_CLKREQ_N would be asserted 70 ms after FULL_CARD_POWER_OFF#. PCIE_RST_N should be de-asserted after PCIE_CLKREQ_N. The host must ensure that the reference clock is in the active clock state for at least a period specified by TPCIE_RST_N-CLK, prior to PCIE_RST_N de-assertion. The following principles of PCIe interface design should be complied with so as to meet PCIe V2.1 specifications. For PCIe signal traces, the TX and RX differential data pair maximum length is recommended to be It is important to route the PCIe signal traces as differential pairs with total grounding. less than 250 mm, the TX and RX differential data pair matching are less than 0.7 mm (5 ps). Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. It is important to route the PCIe differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. 3.8.2. USB Version and PCIe Only Version Beginning with ES2 (engineering samples), EM120R-GL&EM160R-GL support USB version and PCIe only version described as below:

USB version:

Support all USB 3.0/2.0 features Support MBIM/QMI/QRTR/AT Support firmware upgrade PCIe only version:

Support MBIM/QMI/QRTR/AT Support BIOS PCIe early initial Support firmware upgrade If EM120R-GL&EM160R-GL work at PCIe only version by burnt eFuse, the modules cannot switch back to USB version. EM120R-GL&EM160R-GL_Hardware_Design 42 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.9. PCM Interface*

EM120R-GL&EM160R-GL support audio communication via Pulse Code Modulation (PCM) digital interface. The PCM interface supports the following modes:

Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256, 512, 1024 or 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4096 kHz PCM_CLK at 16 kHz PCM_SYNC. In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a 256 kHz PCM_CLK and an 8 kHz, 50% duty cycle PCM_SYNC only. EM120R-GL&EM160R-GL support 16-bit linear data format. The following figures show the primary modes timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary modes timing relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK. Figure 25: Primary Mode Timing EM120R-GL&EM160R-GL_Hardware_Design 43 / 79 125 s PCM_CLK 1 2 255 256 PCM_SYNC PCM_OUT PCM_IN MSB LSB MSB MSB LSB MSB LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 26: Auxiliary Mode Timing The following table shows the pin definition of PCM interface which can be applied on audio codec design. Table 14: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_DIN 22 DI PCM data input 1.8 V power domain PCM_DOUT 24 DO PCM data output 1.8 V power domain PCM_SYNC 28 IO 1.8 V power domain PCM data frame synchronization PCM data bit clock In master mode, it is an output signal. In slave mode, it is an input signal. PCM_CLK 20 IO 1.8 V power domain. If unused, keep it open. The clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. Refer to document [3] for details about AT+QDAI command. EM120R-GL&EM160R-GL_Hardware_Design 44 / 79 125 s PCM_CLK 1 2 31 32 PCM_SYNC PCM_OUT PCM_IN MSB MSB LSB LSB LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE

* means under development. 3.10. Control and Indicator Signals*

The following table shows the pin definition of control and indicator signals. Table 15: Definition of Control and Indicator Signals Pin Name Pin No. I/O Power Domain Description WWAN_LED#

10 OD 3.3 V WAKE_ON_WAN#

23 OD 1.8/3.3 V W_DISABLE1#

8 DI 1.8/3.3 V W_DISABLE2#

DI 1.8/3.3 V DPR ANT_CONFIG DI DI 1.8 V 1.8 V 26 25 68 RF status indication. Active low. Wake up the host. Active low. Airplane mode control. Active low. GNSS enable control. Active low. Dynamic power reduction. Active low. Antenna configuration pin. NOTE

* means under development. 3.10.1. W_DISABLE1# Signal EM120R-GL&EM160R-GL provide a W_DISABLE1# signal to disable or enable airplane mode through hardware operation. The W_DISABLE1# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. In airplane mode, the RF function will be disabled. The RF function can also be enabled or disabled through software AT commands. The following table shows the RF function status of the modules. EM120R-GL&EM160R-GL_Hardware_Design 45 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 16: RF Function Status W_DISABLE1# Level AT Commands RF Function Status High Level AT+CFUN=1 Enabled High Level Low Level AT+CFUN=0 AT+CFUN=4 AT+CFUN=0 AT+CFUN=1 AT+CFUN=4 Disabled Disabled 3.10.2. W_DISABLE2# Signal EM120R-GL&EM160R-GL provide a W_DISABLE2# pin to disable or enable the GNSS function. The W_DISABLE2# pin is pulled up by default. Driving it to low level will disable the GNSS function. The combination of W_DISABLE2# pin and AT commands can control the GNSS function. Table 17: GNSS Function Status W_DISABLE2# Level AT Commands GNSS Function Status High Level AT+QGPS=1 Enabled High Level AT+QGPSEND Low Level AT+QGPS=1 Disabled Low Level AT+QGPSEND EM120R-GL&EM160R-GL_Hardware_Design 46 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design A simple level shifter based on diodes is used on W_DISABLE1# pin and W_DISABLE2# pin which are pulled up to a 1.8 V voltage in the module, as shown in the following figure. So, the control signals (GPIO) of the host device could be a 1.8 V or 3.3 V voltage level and pull-up resistor is not needed on the host side. These two signals are active low, and a reference circuit is shown below. Figure 27: W_DISABLE1# and W_DISABLE2# Reference Circuit 3.10.3. WWAN_LED# Signal The WWAN_LED# signal is used to indicate RF status of the modules, and its typical current consumption is up to 10 mA. In order to reduce the current consumption of the LED, a resistor must be placed in series with the LED, as illustrated in the figure below. The LED is ON when the WWAN_LED# signal is at a low voltage level. Figure 28: WWAN_LED# Signal Reference Circuit EM120R-GL&EM160R-GL_Hardware_Design 47 / 79 Host GPIO GPIO VCC_IO_HOST R1 10K R2 10K Module VDD 1.8 V R3 10K R4 10K BB W_DISABLE2#

W_DISABLE1#

26 8 Note:

Hosts GPIO could be a 1.8 V or 3.3 V voltage level. Host Module VCC R1 200 LED GPIO WWAN_LED#

10 PMU Note: This VCC could be the power supply of the module. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following table shows the RF status indicated by WWAN_LED# signal. Table 18: RF Status Indications of WWAN_LED# Signal LED On Off RF Status On Off RF function is turned off if any of the following circumstances occurs:

The (U)SIM card is not working. W_DISABLE1# signal is at low level (airplane mode enabled). WWAN_LED# Level Low Level High Level NOTE 3.10.4. WAKE_ON_WAN# Signal The WAKE_ON_WAN# signal is an open collector signal, which requires a pull-up resistor on the host. When a URC returns, a 1s low level pulse signal will be outputted to wake up the host. The module operation status indicated by WAKE_ON_WAN# is shown as below. Table 19: State of the WAKE_ON_WAN# Signal WAKE_ON_WAN# State Module Operation Status Output a 1s low level pulse signal Call/SMS/Data is incoming (to wake up the host) Always at high level Idle/Sleep EM120R-GL&EM160R-GL_Hardware_Design 48 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 29: WAKE_ON_WAN# Signal Reference Circuit Design 3.10.5. DPR EM120R-GL&EM160R-GL provide a DPR (Dynamic Power Reduction) signal for body SAR (Specific Absorption Rate) detection. The signal to EM120R-GL&EM160R-GL modules to provide an input trigger which will reduce the output power in the radio transmission. is sent by a host system proximity sensor Table 20: Function of the DPR Signal DPR Level Function High/Floating Max transmitting power will NOT back off Low Max transmitting power will back off by executing AT+QCFG="sarcfg" command NOTE Please refer to document [3] for more details about AT+QCFG="sarcfg" command. EM120R-GL&EM160R-GL_Hardware_Design 49 / 79 Host Module GPIO WAKE_ON_WAN#

23 BB VCC_IO_HOST R1 10K H L 1 s Wake up the host Note: The voltage level on VCC_IO_HOST depends on the host side due to open drain in pin 23. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.10.6. ANT_CONFIG Signal EM160R-GL provides an ANT_CONFIG signal for antenna configuration, however, EM120R-GL does not support it since EM120R-GL only supports 2 antennas. The signal is sent by a host system to EM160R-GL module. ANT_CONFIG is an input port which is pulled high internally by default. The definition of ANT_CONFIG signal is shown as below table. Table 21: Pin Definition of ANT_COMNFIG of EM160R-GL ANT_CONFIG Level Function High/Floating Low Level Support 2 antennas Support 4 antennas 3.11. COEX UART Interface*

EM120R-GL&EM160R-GL provide one COEX UART interface. The following table shows the COEX UART interface pin definition. Table 22: Pin Definition of COEX UART Interface Pin Name Pin No. I/O Description Comment COEX3 60 GPIO 1.8 V power domain COEX UART Interface 1.8 V power domain 1.8 V power domain COEX_RXD 62 COEX_TXD 64 IO IO IO NOTE

* means under development. EM120R-GL&EM160R-GL_Hardware_Design 50 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.12. Antenna Tuner Control Interfaces*

ANTCTL [0:3] and RFFE signals are used for antenna tuner control and should be routed to an appropriate antenna control circuit. More details about the interface will be added in a future version of the document. 3.12.1. Antenna Tuner Control Interface through GPIOs Table 23: Pin Definition of Antenna Tuner Control Interface through GPIOs Pin Name Pin No. I/O Description Comment ANTCTL0 ANTCTL1 ANTCTL2 ANTCTL3 59 61 63 65 DO DO DO DO Antenna tuner control 1.8 V power domain Antenna tuner control 1.8 V power domain Antenna tuner control 1.8 V power domain Antenna tuner control 1.8 V power domain 3.12.2. Antenna Tuner Control Interface through RFFE Table 24: Pin Definition of Antenna Tuner Control Interface through RFFE Pin Name Pin No. I/O Description Comment RFFE_CLK 56 RFFE_DATA 58 DO IO RFFE serial interface used for external tuner control If unused, keep it open. If unused, keep it open. NOTE

* means under development. EM120R-GL&EM160R-GL_Hardware_Design 51 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.13. Configuration Pins EM120R-GL&EM160R-GL provide four configuration pins which are defined as below. 3.13.1. EM160R-GL configuration pins Table 25: List of EM160R-GL Configuration Pins Pin No. Pin Name Power Domain Description 21 69 75 1 CONFIG_0 CONFIG_1 CONFIG_2 CONFIG_3 0 0 0 0 NC NC NC The following figure shows a reference circuit of these four pins. Connected to GND internally. Figure 30: Recommended Circuit of EM160R-GL Configuration Pins EM120R-GL&EM160R-GL_Hardware_Design 52 / 79 Host VCC_IO_HOST EM160R-GL R1 R2 R3 100K 100K 100K R4 100K GPIO GPIO GPIO GPIO CONFIG_0 NM-0 CONFIG_1 0 CONFIG_2 NM-0 CONFIG_3 NM-0 21 69 75 1 Note: The voltage level VCC_IO_HOST depends on the host side, and could be a 1.8 V or 3.3 V voltage level. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 26: List of EM160R-GL Configuration Pins Config_0

(Pin 21) Config_1

(Pin 69) Config_2

(Pin 75) Config_3

(Pin 1) Module Type and Main Host Interface Port Configuration NC GND NC NC Vender defined N/A 3.13.2. EM120R-GL configuration pins Table 27: List of EM120R-GL Configuration Pins Pin No. Pin Name Power Domain Description 21 69 75 1 CONFIG_0 CONFIG_1 CONFIG_2 CONFIG_3 0 0 0 0 Connected to GND internally. Connected to GND internally. NC NC The following figure shows a reference circuit of these four pins. Figure 31: Recommended Circuit of EM120R-GL Configuration Pins EM120R-GL&EM160R-GL_Hardware_Design 53 / 79 Host VCC_IO_HOST EM120R-GL R1 R2 R3 100K 100K 100K R4 100K GPIO GPIO GPIO GPIO CONFIG_0 CONFIG_1 0 0 CONFIG_2 NM-0 CONFIG_3 NM-0 21 69 75 1 Note: The voltage level VCC_IO_HOST depends on the host side, and could be a 1.8 V or 3.3 V voltage level. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 28: List of EM120R-GL Configuration Pins Config_0

(Pin 21) Config_1

(Pin 69) Config_2

(Pin 75) Config_3

(Pin 1) Module Type and Main Host Interface Port Configuration GND GND NC NC Vender defined N/A EM120R-GL&EM160R-GL_Hardware_Design 54 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 4 GNSS Receiver 4.1. General Description EM120R-GL&EM160R-GL include a fully integrated global navigation satellite system solution that supports Gen9-Lite of Qualcomm (GPS, GLONASS, BeiDou/Compass and Galileo). The modules support standard NMEA-0183 protocol, and output NMEA sentences at 1 Hz data update rate via USB interface by default. By default, EM120R-GL&EM160R-GL GNSS engine is switched off. It can only be switched on via AT command. For more details about GNSS engine technology and configurations, refer to document [4]. EM120R-GL&EM160R-GL_Hardware_Design 55 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 5 Antenna Connection EM120R-GL and EM160R-GL provide Main, Rx-diversity/GNSS and MIMO antenna connectors 1) which are used to resist the fall of signals caused by high speed movement and multipath effect. The impedance of antenna ports is 50 . EM160R-GL provides a Main, an Rx-diversity/GNSS and two MIMO antenna connectors. EM120R-GL provides a Main and an Rx-diversity/GNSS antenna connectors. 5.1. Antenna Connectors The antenna connectors are shown below. Figure 32: Antenna Connectors on the EM160R-GL Module EM120R-GL&EM160R-GL_Hardware_Design 56 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 33: Antenna Connectors on the EM120R-GL Module 5.1.1. Operating Frequency Table 29: Operating Frequencies of EM120R-GL&EM160R-GL 3GPP Band Transmit Receive WCDMA B1 19201980 WCDMA B2 18501910 WCDMA B3 17101785 WCDMA B4 17101755 WCDMA B5 WCDMA B6 WCDMA B8 WCDAM B19 824849 830840 880915 830845 21102170 19301990 18051880 21102155 869894 875885 925960 875890 Unit MHz MHz MHz MHz MHz MHz MHz MHz EM120R-GL&EM160R-GL_Hardware_Design 57 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design LTE B1 LTE B2 LTE B3 LTE B4 LTE B5 LTE B7 LTE B8 LTE B12 LTE B13 LTE B14 LTE B17 LTE B18 LTE B19 LTE B20 LTE B25 LTE B26 LTE B28 LTE B29 1) LTE B30 LTE B32 1) LTE B38 LTE B39 LTE B40 LTE B41 LTE B42 25002570 26202690 18501915 19301995 19201980 18501910 17101785 17101755 824849 880915 699716 777787 788798 704716 815830 830845 832862 814849 703748

23052315 25702620 18801920 23002400 24962690 34003600 21102170 19301990 18051880 21102155 869894 925960 729746 746756 758768 734746 860875 875890 791821 859894 758803 717728 23502360 14521496 25702620 18801920 23002400 24962690 34003600 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EM120R-GL&EM160R-GL_Hardware_Design 58 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 36003800 51505925 35503700 17101780 36003800 51505925 35503700 21102200 MHz MHz MHz MHz 1) LTE-FDD B29/32 and LTE-TDD B46 support Rx only and are only for secondary component carrier. 5.2. GNSS Antenna Connector The following table shows frequency specification of GNSS antenna connector. Table 30: GNSS Frequency Type Frequency GPS/Galileo 1575.42 1.023 GLONASS 1601.65 4.15 BeiDou/Compass 1561.098 2.046 Unit MHz MHz MHz LTE B43 LTE B46 1) LTE B48 LTE B66 NOTE EM120R-GL&EM160R-GL_Hardware_Design 59 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirements The following table shows the requirements on Main, Rx-diversity/GNSS and MIMO antennas. Table 31: Antenna Requirements of EM160R-GL Type Requirements Supported Bands Main Antenna

(Tx/Rx) Rx-diversity/

GNSS Antenna MIMO1 Antenna Rx VSWR: 2 Efficiency: > 30%

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB

(699960 MHz) Cable Insertion Loss: < 1.5 dB

(17102200 MHz) Cable Insertion Loss: < 2dB

(23002690 MHz) VSWR: 2 Efficiency: > 30%

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB

(699960 MHz) Cable Insertion Loss: < 1.5 dB

(15592200 MHz) Cable Insertion Loss: < 2 dB

(23002690 MHz) VSWR: 2 Efficiency: > 30%

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB

(699960 MHz) Cable Insertion Loss: < 1.5 dB

(15592200 MHz) LTE:

B1/B2/B3/B4/B5/B7/B8/B12/B13/

B14/B17/B18/B19/B20/B25/B26/

B28/B29/B30/B32/B38/B39/B40/

B41/B42/B43/B46/B48/B66 WCDMA:

B1/B2/B3/B4/B5/B6/B8/B19 LTE:

B1/B2/B3/B4/B5/B7/B8/B12/B13/

B14/B17/B18/B19/B20/B25/B26/

B28/B29/B30/B32/B38/B39/B40/

B41/B42/B43/B46/B48/B66 WCDMA:

B1/B2/B3/B4/B5/B6/B8/B19 GNSS:

GPS;

GLONASS;

BeiDou/Compass;

Galileo LTE:

B1/B2/B3/B4/B7/B25/

B30/B32/B38/B39/B40/B41/B66 EM120R-GL&EM160R-GL_Hardware_Design 60 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 32: Antenna Requirements of EM120R-GL Type Requirements Supported Bands Cable Insertion Loss: < 2 dB

(23002690 MHz) VSWR: 2 Efficiency: > 30%

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB

(699960 MHz) Cable Insertion Loss: < 1.5 dB

(15592200 MHz) Cable Insertion Loss: < 2 dB

(23002690 MHz) VSWR: 2 Efficiency: > 30%

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB

(699960 MHz) Cable Insertion Loss: < 1.5 dB

(17102200 MHz) Cable Insertion Loss: < 2dB

(23002690 MHz) VSWR: 2 Efficiency: > 30%

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB

(699960 MHz) Cable Insertion Loss: < 1.5 dB

(15592200 MHz) Cable Insertion Loss: < 2 dB

(23002690 MHz) MIMO2 Antenna

(Rx) Main Antenna

(Tx/Rx) Rx-diversity/

GNSS Antenna LTE:

B1/B2/B3/B4/B7/B25/

B30/B32/B38/B39/B40/B41/B66 LTE:

B1/B2/B3/B4/B5/B7/B8/B12/B13/

B14/B17/B18/B19/B20/B25/B26/

B28/B29/B30/B32/B38/B39/B40/

B41/B42/B43/B46/B48/B66 WCDMA:

B1/B2/B3/B4/B5/B6/B8/B19 LTE:

B1/B2/B3/B4/B5/B7/B8/B12/B13/

B14/B17/B18/B19/B20/B25/B26/

B28/B29/B30/B32/B38/B39/B40/

B41/B42/B43/B46/B48/B66 WCDMA:

B1/B2/B3/B4/B5/B6/B8/B19 GNSS:

GPS;

GLONASS;

BeiDou/Compass;

Galileo EM120R-GL&EM160R-GL_Hardware_Design 61 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation EM120R-GL and EM160R-GL are mounted with standard 2 mm 2 mm receptacle RF connectors for convenient antenna connection. The connector dimensions are illustrated below:

Figure 34: EM120R-GL&EM160R-GL RF Connector Dimensions (Unit: mm) Item Table 33: Major Specifications of the RF Connector Specification Nominal Frequency Range DC to 6 GHz Nominal Impedance 50 Temperature Rating

-40 C to +85 C Voltage Standing Wave Ratio (VSWR) Meet the requirements of:

Max. 1.3 (DC3 GHz) Max. 1.45 (36 GHz) The receptacle RF connector used in conjunction with EM120R-GL&EM160R-GL will accept two types of mating plugs that will meet a maximum height of 1.2 mm using a 0.81 mm coaxial cable or a maximum height of 1.4 mm utilizing a 1.13 mm coaxial cable. EM120R-GL&EM160R-GL_Hardware_Design 62 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following figure shows the specifications of mating plugs using 0.81 mm coaxial cables. Figure 35: Specifications of Mating Plugs Using 0.81 mm Coaxial Cables The EM120R-GL&EM160R-GL and the mating plug using a 0.81 mm coaxial cable. the connection between illustrates following figure the receptacle RF connector on Figure 36: Connection between RF Connector and Mating Plug Using 0.81 mm Coaxial Cable The EM120R-GL&EM160R-GL and the mating plug using a 1.13 mm coaxial cable. the connection between illustrates following figure the receptacle RF connector on Figure 37: Connection between RF Connector and Mating Plug Using 1.13 mm Coaxial Cable EM120R-GL&EM160R-GL_Hardware_Design 63 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the modules are listed in the following table. Table 34: Absolute Maximum Ratings Parameter VCC Voltage at Digital Pins Min.

-0.3

-0.3 Max. Unit 4.7 2.3 V V 6.2. Power Supply Requirements The typical input voltage of EM120R-GL&EM160R-GL is 3.7 V, as specified by PCIe M.2 Electromechanical Spec Rev1.0. The following table shows the power supply requirements of the modules. Table 35: Power Supply Requirements Parameter Description Min. Typ. Max. VCC Power Supply 3.135 3.7 4.4 Unit V EM120R-GL&EM160R-GL_Hardware_Design 64 / 79 VIH VIL VOH VOL NOTE LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 6.3. I/O Requirements Table 36: I/O Requirements Parameter Description Min. Max. Unit Input high voltage 0.7 VDD18 1) VDD18 + 0.3 Input low voltage

-0.3 0.3 VDD18 Output high voltage VDD18 - 0.5 VDD18 Output low voltage 0 0.4 V V V V 1) VDD18 refers to I/O power domain. 6.4. Operation and Storage Temperatures Table 37: Operation and Storage Temperatures Parameter Min. Max. Unit Typ.

+25

+75

+85

+90 C C C Operating temperature Range 1)

-25 Extended Temperature Range 2)

-40 Storage temperature Range

-40 NOTES 1. 1) Within operating temperature range, the module is 3GPP compliant. For those end devices with bad thermal dissipation condition, a thermal pad or other thermal conductive components may be required between the module and main PCB to achieve the full operating temperature range. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like EM120R-GL&EM160R-GL_Hardware_Design 65 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Pout might reduce in their values and exceed the specified tolerances. When the temperature returns to the normal operating temperature level, the module will meet 3GPP specifications again. 6.5. Current Consumption Table 38: EM120R-GL&EM160R-GL Current Consumption Parameter Description Conditions IVCC OFF state Power down Typ. Unit TBD A 6.6. RF Output Power The following table shows the RF output power of EM120R-GL&EM160R-GL. Table 39: RF Output Power Frequency

(Quectel SPEC) Max. WCDMA band 1, 3, 5, 8s 24 dBm +1.5/-3 dB LTE-FDD band 1, 3, 5, 7, 8, 20, 28s 23 dBm 2 dB LTE-TDD band 38, 40, 41, 42, 43s 23 dBm 2 dB Min.

< -50 dBm

< -40 dBm

< -40 dBm

EM120R-GL&EM160R-GL_Hardware_Design 66 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 6.7. RF Receiving Sensitivity The following tables show conducted RF min. receiving sensitivity of EM120R-GL and EM160R-GL. Table 40: EM120R-GL&EM160R-GL Conducted RF Min. Receiving Sensitivity Frequency Primary Diversity SIMO 1) SIMO 2) (Worst Case) WCDMA B3

-109.5

-110.5 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6

-111

-109.5 TBD

-111 TBD WCDMA B8

-111.5

-110.5 WCDMA B19 TBD

-110.5

-106.7 dBm

-110

-111 TBD

-112 TBD

-111 TBD

-104.7 dBm

-103.7 dBm

-106.7 dBm

-104.7 dBm

-106.7 dBm

-103.7 dBm

-106.7 dBm LTE-FDD B1 (10 MHz)

-98

-100.7

-96.3 dBm LTE-FDD B2 (10 MHz)

-97.8

-100.3

-94.3 dBm LTE-FDD B3 (10 MHz)

-98.8

-100.8

-93.3 dBm LTE-FDD B4 (10 MHz)

-97.7

-100.6

-96.3 dBm LTE-FDD B5 (10 MHz)

-99.7

-99 LTE-FDD B7 (10 MHz)

-96

-102

-99.4

-94.3 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-99

-101.7

-93.3 dBm LTE-FDD B12 (10 MHz)

-99.8

-102.3

-93.3 dBm LTE-FDD B13 (10 MHz)

-100.2

-99.4

-102.5

-93.3 dBm LTE-FDD B14 (10 MHz)

-99.2

-101.8

-93.3 dBm LTE-FDD B17 (10 MHz)

-99.9

-102.3

-93.3 dBm LTE-FDD B18 (10 MHz)

-99.6

-102.2

-96.3 dBm

-110

-110 TBD

-111 TBD TBD

-98

-97.7

-97.3

-97.9

-97.2

-99.2

-99.5

-99.2

-99.6

-99.4 EM120R-GL&EM160R-GL_Hardware_Design 67 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design LTE-FDD B19 (10 MHz)

-99.7

-99

-102

-96.3 dBm LTE-FDD B20 (10 MHz)

-99.7

-102.2

-93.3 dBm LTE-FDD B25 (10 MHz)

-97.8

-100.3

-92.8 dBm LTE-FDD B26 (10 MHz)

-99.4

-101.9

-93.8 dBm LTE-FDD B28 (10 MHz)

-99.3

-102.1

-94.8 dBm LTE-FDD B30 (10 MHz)

-96

-99.5

-95.3 dBm LTE-TDD B38 (10 MHz)

-98.4

-97

-100.1

-96.3 dBm LTE-FDD B39 (10 MHz)

-98.4

-100.5

-96.3 dBm LTE-TDD B40 (10 MHz)

-96.3 LTE-TDD B41 (10 MHz)

-98.1

-99.2

-99.7

-96.3 dBm

-94.3 dBm LTE-TDD B42 (10 MHz)

-97.3

-100.7

-95.0 dBm LTE-TDD B43 (10 MHz)

-97.4

-100.7

-95.0 dBm LTE-TDD B48 (10 MHz)

-97.3

-100.6

-95.0 dBm

-99.5

-97.6

-99.1

-99.6

-97.4

-97.5

-96.9

-96.1

-98.7

-98.4

-98.5

-97.8 LTE-FDD B66 (10 MHz)

-97.6

-100.4

-95.8 dBm NOTES 1. 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and multiple antennas at the receiver side, which can improve Rx performance. 2. 2) Per 3GPP specification. 6.8. Characteristics The modules are not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the modules. EM120R-GL&EM160R-GL_Hardware_Design 68 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following table shows the modules electrostatic discharge characteristics. Table 41: Electrostatic Discharge Characteristics (Temperature: 25 C, Humidity: 40%) Contact Discharge Air Discharge Unit Interfaces VCC, GND Antenna Interfaces Other Interfaces TBD TBD TBD 6.9. Thermal Dissipation TBD TBD TBD kV kV kV EM120R-GL&EM160R-GL are designed to work over an extended temperature range. In order to achieve a better performance while working under extended temperatures or extreme conditions (such as with maximum power or data rate, etc.) for a long time, it is strongly recommended to add a thermal pad or other thermally conductive compounds between the module and the main PCB for thermal dissipation. The thermal dissipation area (i.e. the area for adding thermal pad) is shown as below. The dimensions are measured in mm. Figure 38: Thermal Dissipation Area on Bottom Side of Module (Top View) EM120R-GL&EM160R-GL_Hardware_Design 69 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design There are some other measures to enhance heat dissipation performance:

Add ground vias as many as possible on PCB. Maximize airflow over/around the module. Place the module away from other heating sources. Module mounting holes must be used to attach (ground) the device to the main PCB ground. It is NOT recommended to apply solder mask on the main PCB where the modules thermal dissipation area is located. Select an appropriate material, thickness and surface for the outer housing (i.e. the mechanical enclosure) of the application device that integrates the module so that it provides good thermal dissipation. Customers may also need active cooling to pull heat away from the module. If possible, add a heatsink on the top of the module. A thermal pad should be used between the heatsink and the module, and the heatsink should be designed with as many fins as possible to increase heat dissipation area. NOTE For more detailed guidelines on thermal design, refer to document [5]. EM120R-GL&EM160R-GL_Hardware_Design 70 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7 Mechanical Dimensions and Packaging This chapter mainly describes mechanical dimensions and packaging specifications of EM120R-GL&EM160R-GL. All dimensions are measured in mm, and the dimensional tolerances are 0.05 mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module Figure 39: Mechanical Dimensions of EM120R-GL&EM160R-GL (Unit: mm) EM120R-GL&EM160R-GL_Hardware_Design 71 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.2. Standard Dimensions of M.2 PCI Express The following figure shows the standard dimensions of M.2 PCI Express, refer to document [6]. Figure 40: Standard Dimensions of M.2 Type 3042-S3 (Unit: mm) According to M.2 nomenclature, EM120R-GL&EM160R-GL are Type 3042-S3-B (30.0 mm 42.0 mm, max component height on the top is 1.5 mm and single-sided, key ID is B). Figure 41: M.2 Nomenclature EM120R-GL&EM160R-GL_Hardware_Design 72 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.3. Design Effect Drawings of the Module 7.3.1. Design Effect Drawings of EM160R-GL Module Figure 42: Top View of the Module Figure 43: Bottom View of the Module EM120R-GL&EM160R-GL_Hardware_Design 73 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.3.2. Design Renderings of EM120R-GL Module Figure 44: Top View of the Module Figure 45: Bottom View of the Module NOTE These are renderings of EM120R-GL&EM160R-GL. For authentic appearance, refer to the modules that you receive from Quectel. EM120R-GL&EM160R-GL_Hardware_Design 74 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.4. M.2 Connector EM120R-GL&EM160R-GL adopt a standard PCI Express M.2 connector which compiles with the directives and standards listed in the document [6]. 7.5. Packaging EM120R-GL&EM160R-GL are packaged in trays. The following figure shows the tray size. Figure 46: Tray Size (Unit: mm) Each tray contains 10 modules. The smallest package contains 100 modules. Tray packaging procedures are as below. 1. Use 10 trays to package 100 modules at a time (tray size: 247 mm 172 mm). 2. Place an empty tray on the top of the 10-tray stack. 3. Fix the stack with masking tape in # shape as shown in the following figure. 4. Pack the stack with conductive bag, and then fix the bag with masking tape. 5. Place the list of IMEI No. into a small carton. 6. Seal the carton and then label the seal with sealing sticker (small carton size: 250 mm 175 mm 128 mm). EM120R-GL&EM160R-GL_Hardware_Design 75 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 47: Tray Packaging Procedure EM120R-GL&EM160R-GL_Hardware_Design 76 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 8 Appendix References Table 42: Related Documents SN Document Name Remark

[1]

Quectel_EM120R-GL&EM160R-GL_CA_Feature EM120R-GL&EM160R-GL CA Feature

[2]

Quectel_M.2_EVB_User_Guide M.2 EVB User Guide

[3]

[4]

Quectel_EM120R-GL&EM160R-GL_AT_Commands_ Mannual EM120R-GL&EM160R-GL AT Commands Manual Quectel_EM120R-GL&EM160R-GL_GNSS_AT_ Commands_ Manual EM120R-GL&EM160R-GL GNSS AT Commands Manual

[5]

Quectel_LTE_Module_Thermal_Design_Guide Thermal Design Guide for LTE Modules

[6]

PCI Express M.2 Specification Table 43: Terms and Abbreviations Abbreviation Description bps Bits Per Second DC-HSPA+

Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air DL DRx ESD FDD Downlink Diversity Receive Electrostatic Discharge Frequency Division Duplexing GLONASS Globalnaya Navigatsionnaya Sputnikovaya Sistema (the Russian Global Navigation Satellite System) GNSS Global Navigation Satellite System EM120R-GL&EM160R-GL_Hardware_Design 77 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Global Positioning System Global System for Mobile Communications High Speed Packet Access HSUPA High Speed Uplink Packet Access GPS GSM HSPA kbps LED LTE Mbps ME MIMO MLCC MMS MO MT PDU PPP PRx RF Rx SAR SMS Tx UART UL URC Kilo Bits Per Second Light Emitting Diode Long Term Evolution Million Bits Per Second Mobile Equipment (Module) Multiple-Input Multiple-Output Multiplayer Ceramic Chip Capacitor Multimedia Messaging Service Mobile Originated Mobile Terminated Protocol Data Unit Point-to-Point Protocol Primary Receive Radio Frequency Receive Specific Absorption Rate Short Message Service Transmit Uplink Unsolicited Result Code Universal Asynchronous Receiver & Transmitter EM120R-GL&EM160R-GL_Hardware_Design 78 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design

(U)SIM WCDMA

(Universal) Subscriber Identification Module Wideband Code Division Multiple Access EM120R-GL&EM160R-GL_Hardware_Design 79 / 79 OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: XMR2020EM120RGL2 Contains IC: 10224A-2020EM120GL2. The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met. Antenna authorization.

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed Test Mode Antenna Gain (dBi) Test Mode Antenna Gain (dBi) WCDMA B2 WCDMA B4 WCDMA B5 LTE B2 LTE B4 LTE B5 LTE B7 LTE B12 LTE B13 8.00 8.00 5.00 8.00 8.00 5.00 8.00 5.00 5.00 LTE B14 LTE B25 LTE B26 LTE B30*

LTE B38 LTE B41 LTE B48*

LTE B66 5.00 8.00 5.00 5.00 8.00 6.50 5.00 8.00 Note: * means when using these maximum gain antenna, the host manufacturer should reduce the conducted power to meet the FCC maximum RF output power limit. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. List of applicable FCC rules This module has been tested and found to comply with part 22, part 24, part 27, part 90 requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-

radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement your body. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator &

Industry Canada Statement This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following

(1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired operation two conditions:

of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement."

Radiation Exposure Statement body Dclaration d'exposition aux radiations:

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your Cet quipement est conforme aux limites d'exposition aux rayonnements ISED tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit tre installe de telle sorte qu'une distance de 20 cm est respecte entre l'antenne et les utilisateurs, et 2) Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:

In the event that these conditions cannot be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains IC: 10224A-2020EM120GL. Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l'antenne peut tre installe de telle sorte qu'une distance de 20cm peut tre maintenue entre l'antenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: "Contient des IC: 10224A-2020EM120GL ". Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel.

 

 

EM120R-GL&EM160R-GL Hardware Design Rev. EM120R-GL&EM160R-GL_Hardware_Design_V1.0 LTE-A Module Series Date: 2020-07-02 Status: Preliminary www.quectel.com LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT WITHOUT PERMISSION ARE FORBIDDEN. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved. EM120R-GL&EM160R-GL_Hardware_Design 1 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design About the Document Revision History Version Date Author Description 1.0 2020-07-02 Jim HAN/

Charls SHENG Initial EM120R-GL&EM160R-GL_Hardware_Design 2 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Table Index ................................................................................................................................................... 5 Figure Index ................................................................................................................................................. 7 1 Introduction .......................................................................................................................................... 9 1.1. Safety Information ..................................................................................................................... 10 2 Product Concept ................................................................................................................................ 11 2.1. General Description .................................................................................................................. 11 2.2. Key Features ............................................................................................................................. 12 2.3. Functional Diagram ................................................................................................................... 14 2.4. Evaluation Board ....................................................................................................................... 15 3 Application Interfaces........................................................................................................................ 16 3.4.1. 3.4.2. 3.4.2.1. 3.4.2.2. 3.4.1.1. 3.4.1.2. 3.4.1.3. 3.1. Pin Assignment ......................................................................................................................... 17 3.2. Pin Description .......................................................................................................................... 18 3.3. Power Supply ............................................................................................................................ 23 3.3.1. Decrease Voltage Drop .................................................................................................. 23 3.3.2. Reference Design for Power Supply.............................................................................. 24 3.4. Turn-on and Turn-off Scenarios ................................................................................................ 25 Turn on the Module ........................................................................................................ 25 Turn on the Module with a Host GPIO ................................................................ 25 Turn on the Module Automatically ....................................................................... 26 Turn on the Module with Compatible Design ...................................................... 26 Turn off the Module ........................................................................................................ 28 Turn off the Module through FULL_CARD_POWER_OFF#............................... 28 Turn off the Module through AT Command ......................................................... 28 3.5. Reset ......................................................................................................................................... 30 3.6.

(U)SIM Interfaces ...................................................................................................................... 32 3.7. USB Interface ............................................................................................................................ 37 3.8. PCIe Interface ........................................................................................................................... 39 3.8.1. Endpoint Mode ............................................................................................................... 40 3.8.2. USB Version and PCIe Only Version ............................................................................. 42 3.9. PCM Interface* .......................................................................................................................... 43 3.10. Control and Indicator Signals* .................................................................................................. 45 3.10.1. W_DISABLE1# Signal.................................................................................................... 45 3.10.2. W_DISABLE2# Signal.................................................................................................... 46 3.10.3. WWAN_LED# Signal...................................................................................................... 47 3.10.4. WAKE_ON_WAN# Signal .............................................................................................. 48 3.10.5. DPR ................................................................................................................................ 49 3.10.6. ANT_CONFIG Signal ..................................................................................................... 50 3.11. COEX UART Interface* ............................................................................................................. 50 EM120R-GL&EM160R-GL_Hardware_Design 3 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.12. Antenna Tuner Control Interfaces*............................................................................................ 51 3.12.1. Antenna Tuner Control Interface through GPIOs .......................................................... 51 3.12.2. Antenna Tuner Control Interface through RFFE ............................................................ 51 3.13. Configuration Pins ..................................................................................................................... 52 3.13.1. EM160R-GL configuration pins ...................................................................................... 52 3.13.2. EM120R-GL configuration pins ...................................................................................... 53 4 GNSS Receiver ................................................................................................................................... 55 4.1. General Description .................................................................................................................. 55 5 Antenna Connection .......................................................................................................................... 56 5.1. Antenna Connectors ................................................................................................................. 56 5.1.1. Operating Frequency ..................................................................................................... 57 5.2. GNSS Antenna Connector ........................................................................................................ 59 5.3. Antenna Installation................................................................................................................... 60 5.3.1. Antenna Requirements .................................................................................................. 60 5.3.2. Recommended RF Connector for Antenna Installation ................................................. 62 6 Electrical, Reliability and Radio Characteristics ............................................................................ 64 6.1. Absolute Maximum Ratings ...................................................................................................... 64 6.2. Power Supply Requirements .................................................................................................... 64 6.3. I/O Requirements ...................................................................................................................... 65 6.4. Operation and Storage Temperatures....................................................................................... 65 6.5. Current Consumption ................................................................................................................ 66 6.6. RF Output Power ...................................................................................................................... 66 6.7. RF Receiving Sensitivity ........................................................................................................... 67 6.8. Characteristics........................................................................................................................... 68 6.9. Thermal Dissipation .................................................................................................................. 69 7 Mechanical Dimensions and Packaging.......................................................................................... 71 7.1. Mechanical Dimensions of the Module ..................................................................................... 71 7.2. Standard Dimensions of M.2 PCI Express ............................................................................... 72 7.3. Design Effect Drawings of the Module...................................................................................... 73 7.3.1. Design Effect Drawings of EM160R-GL Module............................................................ 73 7.3.2. Design Renderings of EM120R-GL Module .................................................................. 74 7.4. M.2 Connector........................................................................................................................... 75 7.5. Packaging.................................................................................................................................. 75 8 Appendix References ........................................................................................................................ 77 EM120R-GL&EM160R-GL_Hardware_Design 4 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table Index Table 1: Frequency Bands and GNSS Types of EM120R-GL&EM160R-GL .............................................11 Table 2: Definition of I/O Parameters ......................................................................................................... 18 Table 3: Pin Description.............................................................................................................................. 18 Table 4: Pin Definition of VCC and GND.................................................................................................... 23 Table 5: Pin Definition of FULL_CARD_POWER_OFF# ........................................................................... 25 Table 6: Description of Turn-on Timing of the Module ............................................................................... 27 Table 7: Description of the Timing of Resetting the Module througn FULL_CARD_POWER_OFF#........ 28 Table 8: Pin Definition of RESET# ............................................................................................................. 30 Table 9: Timing of Resetting the Module .................................................................................................... 32 Table 10: Pin Definition of (U)SIM Interfaces ............................................................................................. 33 Table 11: Pin Definition of USB Interface ................................................................................................... 37 Table 12: Pin Definition of PCIe Interface .................................................................................................. 39 Table 13: Description of PCIe Power-on Timing Requirements of the Module ......................................... 42 Table 14: Pin Definition of PCM Interface .................................................................................................. 44 Table 15: Definition of Control and Indicator Signals ................................................................................. 45 Table 16: RF Function Status ..................................................................................................................... 46 Table 17: GNSS Function Status ............................................................................................................... 46 Table 18: RF Status Indications of WWAN_LED# Signal .......................................................................... 48 Table 19: State of the WAKE_ON_WAN# Signal....................................................................................... 48 Table 20: Function of the DPR Signal ........................................................................................................ 49 Table 21: Pin Definition of ANT_COMNFIG of EM160R-GL ...................................................................... 50 Table 22: Pin Definition of COEX UART Interface ..................................................................................... 50 Table 23: Pin Definition of Antenna Tuner Control Interface through GPIOs............................................. 51 Table 24: Pin Definition of Antenna Tuner Control Interface through RFFE .............................................. 51 Table 25: List of EM160R-GL Configuration Pins ...................................................................................... 52 Table 26: List of EM160R-GL Configuration Pins ...................................................................................... 53 Table 27: List of EM120R-GL Configuration Pins ...................................................................................... 53 Table 28: List of EM120R-GL Configuration Pins ...................................................................................... 54 Table 29: Operating Frequencies of EM120R-GL&EM160R-GL ............................................................... 57 Table 30: GNSS Frequency........................................................................................................................ 59 Table 31: Antenna Requirements of EM160R-GL...................................................................................... 60 Table 32: Antenna Requirements of EM120R-GL...................................................................................... 61 Table 33: Major Specifications of the RF Connector.................................................................................. 62 Table 34: Absolute Maximum Ratings ........................................................................................................ 64 Table 35: Power Supply Requirements ...................................................................................................... 64 Table 36: I/O Requirements........................................................................................................................ 65 Table 37: Operation and Storage Temperatures ........................................................................................ 65 Table 38: EM120R-GL&EM160R-GL Current Consumption...................................................................... 66 Table 39: RF Output Power ........................................................................................................................ 66 Table 40: EM120R-GL&EM160R-GL Conducted RF Min. Receiving Sensitivity ...................................... 67 Table 41: Electrostatic Discharge Characteristics (Temperature: 25 C, Humidity: 40%) ......................... 69 EM120R-GL&EM160R-GL_Hardware_Design 5 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 42: Related Documents .................................................................................................................... 77 Table 43: Terms and Abbreviations ............................................................................................................ 77 EM120R-GL&EM160R-GL_Hardware_Design 6 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure Index Figure 1: Functional Diagram ..................................................................................................................... 14 Figure 2: Pin Assignment ........................................................................................................................... 17 Figure 3: Power Supply Limits during Radio Transmission ....................................................................... 23 Figure 4: Reference Circuit of VCC............................................................................................................ 24 Figure 5: Reference Design of Power Supply............................................................................................ 24 Figure 6: Turn on the Module with a Host GPIO ........................................................................................ 25 Figure 7: Turn on the Module Automatically............................................................................................... 26 Figure 8: Turn on the Module with Compatible Design .............................................................................. 26 Figure 9: Turn-on Timing of the Module ..................................................................................................... 27 Figure 10: Timing of Turning off the Module through FULL_CARD_POWER_OFF#................................ 28 Figure 11: Timing of Turning off the Module through AT Command and FULL_CARD_POWER_OFF# .. 29 Figure 12: Timing of Turning off the Module through AT Command and Power Supply............................ 29 Figure 13: Reference Circuit of RESET_N with NPN Driving Circuit......................................................... 30 Figure 14: Reference Circuit of RESET_N with NMOS Driving Circuit ..................................................... 31 Figure 15: Reference Circuit of RESET_N with Button ............................................................................. 31 Figure 16: Timing of Resetting the Module ................................................................................................ 32 Figure 17: Reference Circuit of Normally Closed (U)SIM1 Card Connector ............................................. 34 Figure 18: Reference Circuit of Normally Open (U)SIM1 Card Connector................................................ 34 Figure 19: Reference Circuit of a 6-Pin (U)SIM1 Card Connector ............................................................ 35 Figure 20: Recommended Compatible Design of (U)SIM2 Interface ........................................................ 36 Figure 21: Reference Circuit of USB 3.0/2.0 Interface .............................................................................. 38 Figure 22: PCIe Interface Reference Circuit (EP Mode)............................................................................ 40 Figure 23: PCIe Power-on Timing Requirements of M.2 Specification ..................................................... 41 Figure 24: PCIe Power-on Timing Requirements of the Module ............................................................... 41 Figure 25: Primary Mode Timing ................................................................................................................ 43 Figure 26: Auxiliary Mode Timing ............................................................................................................... 44 Figure 27: W_DISABLE1# and W_DISABLE2# Reference Circuit ........................................................... 47 Figure 28: WWAN_LED# Signal Reference Circuit ................................................................................... 47 Figure 29: WAKE_ON_WAN# Signal Reference Circuit Design ............................................................... 49 Figure 30: Recommended Circuit of EM160R-GL Configuration Pins ...................................................... 52 Figure 31: Recommended Circuit of EM120R-GL Configuration Pins ...................................................... 53 Figure 32: Antenna Connectors on the EM160R-GL Module .................................................................... 56 Figure 33: Antenna Connectors on the EM120R-GL Module .................................................................... 57 Figure 34: EM120R-GL&EM160R-GL RF Connector Dimensions (Unit: mm) .......................................... 62 Figure 35: Specifications of Mating Plugs Using 0.81 mm Coaxial Cables ............................................ 63 Figure 36: Connection between RF Connector and Mating Plug Using 0.81 mm Coaxial Cable .......... 63 Figure 37: Connection between RF Connector and Mating Plug Using 1.13 mm Coaxial Cable .......... 63 Figure 38: Thermal Dissipation Area on Bottom Side of Module (Top View)............................................. 69 Figure 39: Mechanical Dimensions of EM120R-GL&EM160R-GL (Unit: mm) .......................................... 71 Figure 40: Standard Dimensions of M.2 Type 3042-S3 (Unit: mm) ........................................................... 72 Figure 41: M.2 Nomenclature..................................................................................................................... 72 EM120R-GL&EM160R-GL_Hardware_Design 7 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 42: Top View of the Module............................................................................................................. 73 Figure 43: Bottom View of the Module ....................................................................................................... 73 Figure 44: Top View of the Module............................................................................................................. 74 Figure 45: Bottom View of the Module ....................................................................................................... 74 Figure 46: Tray Size (Unit: mm) ................................................................................................................. 75 Figure 47: Tray Packaging Procedure ....................................................................................................... 76 EM120R-GL&EM160R-GL_Hardware_Design 8 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 1 Introduction This document defines EM120R-GL&EM160R-GL and describes its air interfaces and hardware interfaces which are connected to customers applications. This document is applicable to the following modules:

EM120R-GL EM160R-GL This document can help customers quickly understand the interface specifications, electrical and mechanical details, as well as other related information of EM120R-GL&EM160R-GL. To facilitate its application in different fields, reference design is also provided for customers reference. This document, coupled with application notes and user guides, can help customers use the module to design and set up mobile applications easily. EM120R-GL&EM160R-GL_Hardware_Design 9 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EM120R-GL&EM160R-GL modules. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, use emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as mobile phone or other cellular terminals. Areas with potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders. EM120R-GL&EM160R-GL_Hardware_Design 10 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 2 Product Concept 2.1. General Description EM120R-GL&EM160R-GL are LTE-A/UMTS/HSPA+ wireless communication modules with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks with standard PCI Express M.2 interface. It supports embedded operating systems such as Windows, Linux and Android, and provides GNSS 1) and voice functionality 2) to meet customers specific application demands. The following table shows the frequency bands and GNSS types of EM120R-GL&EM160R-GL. Table 1: Frequency Bands and GNSS Types of EM120R-GL&EM160R-GL Mode EM120R-GL&EM160R-GL LTE-FDD

(with Rx-diversity/MIMO 5)) LTE-TDD

(with Rx-diversity/MIMO 5)) WCDMA

(with Rx-diversity) GNSS 1) NOTES B1 4)/B2 4)/B3 4)/B4 4)/B5/B7 4)/

B8/B12/B13/B14/B17/B18/B19/B20/B25 4)/B26/B28/

B29 3)/B30 4)/B32 3) 4)/B66 4) B38 4)/B39 4)/B40 4)/B41 4)/B42/B43/B46 3)/B48 B1/B2/B3/B4/B5/B6/B8/B19 GPS;

GLONASS;

BeiDou/Compass;

Galileo 1. 1) GNSS function is optional. 2. 2) EM120R-GL&EM160R-GL contain Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. 3. 3) LTE-FDD B29/B32 and LTE-TDD B46 support Rx only and are only for secondary component EM120R-GL&EM160R-GL_Hardware_Design 11 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design carrier. 4. 4) EM160R-GL supports up to 4 4 MIMO in DL direction. 5. 5) MIMO antennas only apply for EM160R-GL. 6. For details about CA combinations, refer to document [1]. EM120R-GL&EM160R-GL can be applied in the following fields:

Tablet PC and Laptop Remote Monitor System Vehicle System Wireless POS System Smart Metering System Wireless Router and Switch Other Wireless Terminal Devices 2.2. Key Features The following table describes the detailed features of EM120R-GL&EM160R-GL. Table 2: Key Features of EM120R-GL&EM160R-GL Feature Details Function Interface PCI Express M.2 Interface Power Supply Supply voltage: 3.1354.4 V Typical supply voltage: 3.7 V Transmitting Power Class 3 (23 dBm 2 dB) for LTE-FDD bands Class 3 (23 dBm 2 dB) for LTE-TDD bands Class 3 (24 dBm +1/-3 dB) for WCDMA EM160R-GL Support up to LTE Cat 16 Support 1.4100 MHz (5CA) RF bandwidth Support 4 4 MIMO in DL direction Up to 1000 Mbps (DL)/150 Mbps (UL) EM120R-GL Support up to LTE Cat 12 Support 1.460 MHz (3CA) RF bandwidth Support 2 2 MIMO in DL direction Up to 600 Mbps (DL)/150 Mbps (UL) LTE Features EM120R-GL&EM160R-GL_Hardware_Design 12 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design UMTS Features Internet Protocol Features Support 3GPP R9 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16QAM and 64QAM modulation DC-HSDPA: Max 42 Mbps (DL) HSUPA: Max 5.76 Mbps (UL) WCDMA: Max 384 Kbps (DL)/384 Kbps (UL) Support PPP/QMI/NTP*/TCP*/UDP*/FTP*/HTTP*/PING*/HTTPS*/

SMTP*/MMS*/FTPS*/SMTPS*/SSL* protocols Support the protocols PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) usually used for PPP connections SMS Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default

(U)SIM Interfaces Support (U)SIM card: 1.8/3.0 V Support Dual SIM Single Standby*

Compliant with USB 3.0 and 2.0 specifications, with maximum transmission rates up to 5 Gbps on USB 3.0 and 480 Mbps on USB 2.0. Used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA sentences output and voice over USB*

USB Interface Support USB serial drivers for:

Windows: 7/8/8.1/10 Linux: 2.6/3.x/4.14.15 Android: 4.x/5.x/6.x/7.x/8.x/9.x PCIe x1 Interface Antenna connectors Comply with PCI Express Specification, Revision 2.1 and support 5 Gbps per lane Used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA sentences output EM160R-GL Provide Main, Rx-diversity/GNSS, MIMO1 and MIMO2 antenna connectors EM120R-GL Provide Main and Rx-diversity/GNSS antenna connectors Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Gen9 Lite of Qualcomm Protocol: NMEA-0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Physical Characteristics Size: 42.0 0.15 mm 30.0 0.15 mm 2.3 0.1 mm Weight: approx. 6 g Temperature Range Operation temperature range: -25 C to +75 C 1) EM120R-GL&EM160R-GL_Hardware_Design 13 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Extended temperature range: -40 C to +85 C 2) Storage temperature range: -40 C to +90 C Firmware Upgrade USB 2.0 interface, PCIe interface and DFOTA RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. 3. 1) Within operating temperature range, the module is 3GPP compliant. For those end devices with bad thermal dissipation condition, a thermal pad or other thermal conductive components may be required between the module and main PCB to achieve the full operating temperature range. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their values and exceed the specified tolerances. When the temperature returns to normal operating temperature level, the module will meet 3GPP specifications again.

* means under development. 2.3. Functional Diagram The following figure shows a block diagram of EM120R-GL&EM160R-GL. Figure 1: Functional Diagram EM120R-GL&EM160R-GL_Hardware_Design 14 / 79 VCC FULL_CARD_POWER_OFF#

RESET#

e c a f r e t n I

. B

y e K 2 M s s e r p x E I C P USB2.0&USB3.0

(U)SIM1&(U)SIM2 W_DISABLE1#

WWAN_LED#

WAKE_ON_WAN#

RFFE PCM GPIOs PCIe W_DISABLE2#

PMIC T E 38.4M XO l o r t n o C Baseband IQ Control i r e v e c s n a r T NAND Flash +

DDR4 SDRAM Tx PRx MIMO1 MIMO2 DRx l s k c o B x R

x T ANT_DIV/GNSS MIMO1 MIMO2 ANT_MAIN LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE MIMO1 and MIMO2 antennas are only applicable to the EM160R-GL module. 2.4. Evaluation Board To help customers develop applications conveniently with EM120R-GL&EM160R-GL, Quectel supplies the evaluation board (M.2 EVB), USB to RS-232 converter cable, USB type-C cable, earphone, antenna and other peripherals to control or test the module. For more details, refer to document [2]. EM120R-GL&EM160R-GL_Hardware_Design 15 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3 Application Interfaces the

(U)SIM interfaces the definition and application of The physical connections and signal levels of EM120R-GL&EM160R-GL comply with PCI Express M.2 specifications. This chapter mainly describes following interfaces/signals/pins of EM120R-GL&EM160R-GL:

Power supply USB interface PCM interface*

PCIe interface Control and indicator signals*

Antenna tuner control interfaces*

Configuration pins COEX UART Interface*

NOTE

* means under development. EM120R-GL&EM160R-GL_Hardware_Design 16 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.1. Pin Assignment The following figure shows the pin assignment of EM120R-GL&EM160R-GL. The top side contains EM120R-GL&EM160R-GL and antenna connectors. Figure 2: Pin Assignment EM120R-GL&EM160R-GL_Hardware_Design 17 / 79 PIN74 PIN75 BOT TOP PIN10 PIN2 PIN11 PIN1 Pin Name CONFIG_2 GND GND CONFIG_1 RESET#

ANTCTL3 ANTCTL2 ANTCTL1 ANTCTL0 GND PCIE_REFCLK_P PCIE_REFCLK_M GND PCIE_RX_P PCIE_RX_M GND PCIE_TX_P PCIE_TX_M GND USB_SS_RX_P USB_SS_RX_M USB_SS_TX_P USB_SS_TX_M WAKE_ON_WAN#

CONFIG_0 GND GND DPR Notch Notch Notch Notch GND USB_DM USB_DP GND GND CONFIG_3 No. 75 73 71 69 67 65 63 61 59 57 55 53 51 49 47 45 43 41 39 37 35 33 31 29 27 25 23 21 11 9 7 5 3 1 No. 74 72 70 68 66 64 62 60 58 56 54 52 50 48 46 44 42 40 38 36 34 32 30 28 26 24 22 20 10 8 6 4 2 PCIE_WAKE_N PCIE_CLKREQ_N Pin Name VCC VCC VCC ANT_CONFIG USIM1_DET COEX_TXD COEX_RXD COEX3 RFFE_DATA RFFE_CLK PCIE_RST_N USIM2_VDD USIM2_RST USIM2_CLK USIM2_DATA USIM2_DET NC USIM1_VDD USIM1_DATA USIM1_CLK USIM1_RST PCM_SYNC PCM_DIN PCM_CLK Notch Notch Notch Notch VCC VCC W_DISABLE2#

PCM_DOUT/VDDIO WWAN_LED#

W_DISABLE1#

FULL_CARD_POWER_OFF#

LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.2. Pin Description The following tables show the pin definition and description of EM120R-GL&EM160R-GL. Table 2: Definition of I/O Parameters Description Analog Input Analog Output Digital Input Digital Output Bidirectional Open Drain Power Input Power Output Type AI AO DI DO IO OD PI PO 1 2 3 4 5 6 Table 3: Pin Description Pin No. M.2 Socket 2 WWAN Module Pinout EM120R-GL&EM1 60R-GL Pin Name I/O Description Comment CONFIG_3 CONFIG_3 NC 3.3V VCC PI Power supply GND GND Ground 3.3V VCC PI Power supply Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V GND GND Ground FULL_CARD_ POWER_OFF#(I)

(0/1.8V) FULL_CARD_ POWER_OFF#

DI Turn on/off the module. When it is at low level, the module is powered Pulled down internally. EM120R-GL&EM160R-GL_Hardware_Design 18 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design USB_D+

USB_DP AI/AO W_DISABLE1# W_DISABLE1#

DI Airplane mode control. Active low. 1.8/3.3 V power domain USB_D-

USB_DM AI/AO 10 GPIO_9 WWAN_LED#

OD off. When it is at high level, the module is powered on. USB 2.0 differential data bus (+) USB 2.0 differential data bus (-) RF status indication. Active low. GND Notch Notch Notch Notch Notch Notch Notch Notch Ground Notch Notch Notch Notch Notch Notch Notch Notch 20 GPIO_5

(AUDIO_0) PCM_CLK DI 21 CONFIG_0 CONFIG_0 GPIO_6

(AUDIO_1) PCM_DIN PO PCM data input GPIO_11

(WOWWAN#) WAKE_ON_ WAN#

OD Wake up the host. Active low. GPIO_7

(AUDIO_2) PCM_DOUT

/VDDIO DO/P O PCM data bit clock. In master mode, it is an output signal. In slave mode, it is an input signal. EM120R-GL: Connected to GND internally;

EM160R-GL: NC PCM data output;

Could be designed to be compatible with 1.8 V power supply. 1.8 V power domain. If unused, keep it open. 1.8 V power domain 1.8/3.3 V power domain 1.8 V power domain EM120R-GL&EM160R-GL_Hardware_Design 19 / 79 11 GND 12 Key 13 Key 14 Key 15 Key 16 Key 17 Key 18 Key 19 Key 7 8 9 22 23 24 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 25 DPR DPR DI Dynamic power reduction. Active low. 1.8 V power domain. 26 GPIO_10

(W_DISABLE2#) W_DISABLE2#

DI GNSS enable control. Active low. 1.8/3.3 V power domain 27 GND GND Ground 28 GPIO_8

(AUDIO_3) PCM_SYNC IO PCM data frame synchronization 1.8 V power domain 29 USB3.0-TX-

USB_SS_TX_M AO USB 3.0 transmit data

(-) USB 3.0 transmit data

(+) 30 UIM-RESET USIM1_RST DO

(U)SIM1 card reset 31 USB3.0-TX+

USB_SS_TX_P AO 32 UIM-CLK USIM1_CLK DO

(U)SIM1 card clock 33 GND GND Ground 1.8/3.0 V power domain 1.8/3.0 V power domain Pulled up to USIM1_VDD internally. 34 UIM-DATA USIM1_DATA IO

(U)SIM1 card data 35 USB3.0-RX-

USB_SS_RX_M AI USB 3.0 receive data (-) 36 UIM-PWR USIM1_VDD PO Power supply for

(U)SIM1 card 1.8/3.0 V power domain 37 USB3.0-RX+

USB_SS_RX_P AI USB 3.0 receive data (+) 38 N/C 39 GND NC GND NC Ground 40 GPIO_0

(SIM_DET2) USIM2_DET DI

(U)SIM2 card insertion detection 41 PETn0 PCIE_TX_M AO PCIe transmit data (-) USIM2_DATA IO

(U)SIM2 card data 42 GPIO_1

(SIM_DAT2) 44 GPIO_2

(SIM_CLK2) 43 PETp0 PCIE_TX_P AO PCIe transmit data (+) USIM2_CLK DO

(U)SIM2 card clock Pulled up internally. 1.8 V power domain. Pulled up to USIM2_VDD internally 1.8/3.0 V power domain EM120R-GL&EM160R-GL_Hardware_Design 20 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 45 GND GND Ground 46 48 GPIO_3

(SIM_RST2) GPIO_4

(SIM_PWR2) USIM2_RST DO

(U)SIM2 card reset 1.8/3.0 V power domain 47 PERn0 PCIE_RX_M AI PCIe receive data (-) USIM2_VDD PO Power supply for

(U)SIM2 card 1.8/3.0 V power domain 49 PERp0 PCIE_RX_P PCIe receive data (+) 50 PCIE_RST_N PCIE_RST_N PCIe reset input. Active low. 3.3 V power domain 51 GND GND Ground AI DI 52 PCIE_CLKREQ_ N PCIE_CLKREQ_N DO PCIe clock request. Active low. 3.3 V power domain 53 REFCLKn PCIE_REFCLK_M AI/AO PCIe reference clock (-) 54 PEWAKE#

PCIE_WAKE_N IO PCIe wake up the host. Active low. 3.3 V power domain 55 REFCLKp PCIE_REFCLK_P AI/AO PCIe reference clock (+) 56 N/C RFFE_CLK DO RFFE clock 57 GND GND Ground 58 N/C RFFE_DATA IO RFFE data 59 ANTCTL0 ANTCTL0 DO Antenna tuner control 60 COEX3 COEX3 IO COEX GPIO 61 ANTCTL1 ANTCTL1 DO Antenna tuner control 62 COEX2 COEX_RXD DI 63 ANTCTL2 ANTCTL2 DO Antenna tuner control COEX UART receive data COEX UART transmit data 64 COEX1 COEX_TXD DO 65 ANTCTL3 ANTCTL3 DO Antenna tuner control 66 SIM_DETECT USIM1_DET DI

(U)SIM1 card insertion detection 1.8 V power domain 1.8 V power domain 1.8 V power domain 1.8 V power domain 1.8 V power domain 1.8 V power domain 1.8 V power domain Pulled up internally. 1.8 V power EM120R-GL&EM160R-GL_Hardware_Design 21 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 67 RESET#

RESET#

DI WWAN reset input Active low. 68 SUSCLK (32kHz) ANT_CONFIG DI Antenna configuration 69 CONFIG_1 CONFIG_1 Connected to GND internally 70 3.3V VCC PI Power supply 71 GND GND Ground 72 3.3V VCC PI Power supply 73 GND GND Ground 74 3.3V VCC PI Power supply 75 CONFIG_2 CONFIG_2 NC NOTE Please keep all NC, reserved and unused pins unconnected. domain. Pulled up internally. 1.8 V power domain. Pulled up internally. 1.8 V power domain. Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V EM120R-GL&EM160R-GL_Hardware_Design 22 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.3. Power Supply The following table shows definition of VCC pins and ground pins. Table 4: Pin Definition of VCC and GND Pin No. Pin Name Power Domain Description 2, 4, 70, 72, 74 VCC 3.1354.4 V 3.7 V typical DC supply I/O PI Ground 3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73 GND 3.3.1. Decrease Voltage Drop The power supply range of the module is from 3.135 V to 4.4 V. Make sure that the input voltage never drops below 3.135 V, otherwise the module will be powered off automatically. The following figure shows the maximum voltage drop during radio transmission in 3G and 4G networks. Figure 3: Power Supply Limits during Radio Transmission To decrease voltage drop, a bypass capacitor of about 220 F with low ESR (ESR = 0.7 ) should be used, and a multi-layer ceramic chip capacitor (MLCC) array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to VCC pins. The main power supply from an external application must be a single voltage source. The width of VCC trace should be no less than 2 mm. In principle, a longer VCC trace indicates a wider VCC trace. In addition, in order to get a stable power source, it is recommended to use a zener diode with reverse zener voltage of 5.1 V and dissipation power more than 0.5 W. The following figure shows a reference EM120R-GL&EM160R-GL_Hardware_Design 23 / 79 Max Tx power Max Tx power VCC Min. 3.135 V Drop Ripple LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design circuit of VCC. Figure 4: Reference Circuit of VCC 3.3.2. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply can provide sufficient current (at least 2.5 A). If the voltage drop between the input and output is not too high, an LDO is suggested to be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VCC), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5 V input power source. The typical output of the power supply is about 3.7 V and the maximum load current is 3 A. Figure 5: Reference Design of Power Supply EM120R-GL&EM160R-GL_Hardware_Design 24 / 79 VCC

D1 C1 C2 C3 C4 C5 5.1 V 220 F 1 F 100 nF 33 pF 10 pF Module VCC LDO_IN VCC MIC29302WU 2 IN R1 N E U1 D N G 4 OUT J D A 1 3 5 D1 C1 C2 TVS 470F 100nF R2 R3

1 K 0 0 1

1 K 1 5 R4 C3 C4 C5 C6 470R 470F 100nF 33pF 10pF R5 4.7K MCU_POWER _ON/OFF R6 47K LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE In order to avoid damages to the internal flash, do not cut off the power supply directly when the module is working. It is suggested that the power supply should be cut off after the module is shut down. 3.4. Turn-on and Turn-off Scenarios 3.4.1. Turn on the Module Pulling up the FULL_CARD_POWER_OFF# pin will power on the module. The following table shows the pin definition of FULL_CARD_POWER_OFF#. Table 5: Pin Definition of FULL_CARD_POWER_OFF#

Pin Name Pin No. Description DC Characteristics Comment FULL_CARD _POWER_ OFF#

6 Turn on/off the module. When it is at low level, the module is powered off. When it is at high level, the module is powered on. VIHmax = 4.4 V VIHmin = 1.19 V VILmax = 0.2 V Pulled down internally. 3.4.1.1. Turn on the Module with a Host GPIO It is recommended to use a host GPIO to control FULL_CARD_POWER_OFF#. A simple reference circuit is illustrated in the following figure. Figure 6: Turn on the Module with a Host GPIO EM120R-GL&EM160R-GL_Hardware_Design 25 / 79 Host GPIO GND 1.8 V or 3.3 V Module FULL_CARD_POWER_OFF#

GND LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.4.1.2. Turn on the Module Automatically If FULL_CARD_POWER_OFF# is pulled up to VCC with a 510 k resistor, the module will be powered on automatically when the power supply for VCC is applied. A reference circuit is shown in the following figure. Figure 7: Turn on the Module Automatically 3.4.1.3. Turn on the Module with Compatible Design The following figure shows a compatible design to turn on the module automatically after power-up or by host. Figure 8: Turn on the Module with Compatible Design EM120R-GL&EM160R-GL_Hardware_Design 26 / 79 Host Module VCC_IO_HOST R1 10K GPIO GND FULL_CARD_POWER_OFF#

6 GND Notes:

1. The voltage of pin 6 should be no less than 1.19 V when it is at HIGH level. 2. The voltage level VCC_IO_HOST could be a 1.8 V or 3.3 V typically. Host Auto turn on Turn on by host R1 R2 10 K NM NM 0 Module VCC_IO_HOST R1 10K GPIO GND R2 NM_0 6 FULL_CARD_POWER_OFF#

GND Notes:

1. The voltage of pin 6 should be no less than 1.19 V when it is at HIGH level. 2. The voltage level VCC_IO_HOST could be 1.8 V or 3.3 V typically. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The turn-on scenario is illustrated in the following figure. Figure 9: Turn-on Timing of the Module Table 6: Description of Turn-on Timing of the Module Index Min. Typical Max. Comment T1 0 ms 50 ms T2 0 ms 20 ms

T3 T4 0 ms 15 ms 20 ms

100 ms

RESET# is pulled up internally, and it would be de-asserted 50 ms after VCC is powered on. FULL_CARD_POWER_OFF# could be de-asserted before or after RESET#, 20 ms is a recommended value when it is controlled by GPIO. DPR or ANT_CONFIG should be asserted before modem initialize. PCIE_RST_N should be de-asserted 100 ms after FULL_CARD_POWER_OFF#. EM120R-GL&EM160R-GL_Hardware_Design 27 / 79 VCC RESET#

T1 T2 FULL_CARD_POWER_OFF#

DPR/ANT_CONFIG PCIE_RST_N T3 T4 Typical 11.6 s OFF Booting Active LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.4.2. Turn off the Module 3.4.2.1. Turn off the Module through FULL_CARD_POWER_OFF#

Pulling down the FULL_CARD_POWER_OFF# pin will turn off the module. The turn-off scenario is illustrated in the following figure. Figure 10: Timing of Turning off the Module through FULL_CARD_POWER_OFF#

T1 T2 T3 Table 7: Description of the Timing of Resetting the Module througn FULL_CARD_POWER_OFF#

Index Min. Typical Max. Comments 0 ms 20 ms

PCIE_RST_N should be asserted before RESET#. 0 ms 10 ms 200 ms RESET# is recommended to be asserted before FULL_CARD_POWER_OFF#

10 ms

If power is always on, it could be ignored. 3.4.2.2. Turn off the Module through AT Command It is a safe way to use AT+QPOWD command to turn off the module. For more details about the command, refer to document [3]. For the circuit design of Figure 6, pull down FULL_CARD_POWER_OFF# pin, or cut off power supply of VCC after the modules USB/PCIe is removed. Otherwise, the module will be powered on again. EM120R-GL&EM160R-GL_Hardware_Design 28 / 79 VCC FULL_CARD_POWER_OFF#

T3 RESET#

PCIE_RST_N T2 T1 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 11: Timing of Turning off the Module through AT Command and FULL_CARD_POWER_OFF#

For the circuit design of Figure 7, cut off power supply of VCC after the modules USB/PCIe is removed, as illustrated in Figure 11. Otherwise, the module will be powered on again. Figure 12: Timing of Turning off the Module through AT Command and Power Supply NOTE Please pull down FULL_CARD_POWER_OFF# pin immediately or cut off the power supply of VCC when the host detects that the module is removed. EM120R-GL&EM160R-GL_Hardware_Design 29 / 79 VCC RESET#(H) USB/PCIe FULL_CARD_POWER_OFF#

AT+QPOWD USB/PCIe remove Module Status Running Power-off procedure OFF VCC RESET#(H) USB/PCIe FULL_CARD_POWER_OFF#(H) AT+QPOWD USB/PCIe remove Module Status Running Power-off procedure OFF LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.5. Reset The RESET# pin is used to reset the module. The module can be reset by driving RESET# to a low-level voltage for 200700 ms. Table 8: Pin Definition of RESET#

Pin Name Pin No. Description DC Characteristics Comment RESET#

67 Reset the module VIHmax = 2.1 V VIHmin = 1.3 V VILmax = 0.5 V Pulled up internally. 1.8 V power domain. An open collector/drain driver or button can be used to control the RESET# pin. Figure 13: Reference Circuit of RESET_N with NPN Driving Circuit EM120R-GL&EM160R-GL_Hardware_Design 30 / 79 Host Module VDD 1.8 V R1 100K Reset Logic Reset pulse RESET_N 67 GPIO Q1 NPN R2 1K R3 100K 200700 ms LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 14: Reference Circuit of RESET_N with NMOS Driving Circuit Figure 15: Reference Circuit of RESET_N with Button EM120R-GL&EM160R-GL_Hardware_Design 31 / 79 Host Module VDD 1.8 V R1 100K Reset Logic Reset pulse RESET_N 67 GPIO Q2 NMOS R4 10 R5 100K 200700 ms Module VDD 1.8 V R1 100K RESET_N 67 Reset Logic S1 TVS C1 33 pF 200700 ms Note: The capacitor C1 is recommended to be less than 47 pF. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The reset scenario is illustrated in the following figure. Figure 16: Timing of Resetting the Module T1 T2 T3 T4 T5 Table 9: Timing of Resetting the Module Index Min. Typical Max. Comments 0 ms 20 ms

PCIE_RST_N should be asserted before RESET#. 0 ms 10 ms 200 ms 0 ms 20 ms 200 ms

100 ms

200 ms

700 ms RESET# should be asserted before FULL_CARD_POWER_OFF#. RESET# should be de-asserted after FULL_CARD_POWER_OFF#

PCIE_RST_N should be de-asserted 100 ms after FULL_CARD_POWER_OFF#. RESET# should be de-asserted no longer than 700 ms, otherwise the module would reset several times. NOTE Please ensure that there is no large capacitance on RESET# pin. 3.6. (U)SIM Interfaces The (U)SIM interfaces circuitry meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported, and Dual SIM Single Standby* function is supported. EM120R-GL&EM160R-GL_Hardware_Design 32 / 79 VCC (H) FULL_CARD_POWER_OFF#

RESET#

T2 T5 PCIE_RST_N T1 T3 T4 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 10: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM1_VDD 36 PO Power supply for (U)SIM1 card 32 30 44 46 USIM1_DATA 34 IO

(U)SIM1 card data USIM1_CLK DO

(U)SIM1 card clock USIM1_RST DO

(U)SIM1 card reset USIM1_DET 66 DI

(U)SIM1 card insertion detection. Active high. USIM2_VDD 48 PO Power supply for (U)SIM2 card USIM2_DATA 42 IO

(U)SIM2 card data USIM2_CLK DO

(U)SIM2 card clock USIM2_RST DO

(U)SIM2 card reset USIM2_DET 40 DI

(U)SIM2 card insertion detection. Active high. Either 1.8 V or 3.0 V is supported by the module automatically. Internally pulled up. When (U)SIM1 card is present, it is at high level. When (U)SIM1 card is absent, it is at low level. Either 1.8 V or 3.0 V is supported by the module automatically. Internally pulled up. When (U)SIM2 card is present, it is at high level. When (U)SIM2 card is absent, it is at low level. EM120R-GL&EM160R-GL support (U)SIM card hot-plug via the USIM_DET pin, which is a level trigger pin. The USIM_DET is normally short-circuited to ground when (U)SIM card is not inserted. When the

(U)SIM card is inserted, the USIM_DET will change from low to high level. The rising edge will indicate insertion of the (U)SIM card. When the (U)SIM card is removed, the USIM_DET will change from high to low level. This falling edge will indicate the absence of the (U)SIM card. EM120R-GL&EM160R-GL_Hardware_Design 33 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following figure shows a reference design for a (U)SIM interface with normally closed (U)SIM card connector. Figure 17: Reference Circuit of Normally Closed (U)SIM1 Card Connector Normally Closed (U)SIM Card Connector:

When the (U)SIM is absent, CD is short-circuited to SW and USIM_DET is at low level. When the (U)SIM is inserted, CD is open to SW and USIM_DET is at high level. The following figure shows a reference design for a (U)SIM interface with normally open (U)SIM card connector. Figure 18: Reference Circuit of Normally Open (U)SIM1 Card Connector EM120R-GL&EM160R-GL_Hardware_Design 34 / 79 USIM_VDD GND 15K 100 nF

(U)SIM Card Connector Module USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA 22R 22R 22R VCC RST CLK CD GND VPP IO SW GND 33 pF 33 pF 33 pF GND GND USIM_VDD GND 15K 100 nF

(U)SIM Card Connector 1.8 V 4.7K Module USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA 22R 22R 22R GND VPP IO SW VCC RST CLK CD 33K 33 pF 33 pF 33 pF GND GND LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Normally Open (U)SIM Card Connector:

When the (U)SIM is absent, CD is open to SW and USIM_DET is at low level. When the (U)SIM is inserted, CD is short-circuited to SW and USIM_DET is at high level. If (U)SIM card detection function is not needed, keep USIM_DET unconnected. The following figure shows a reference circuit for a (U)SIM card interface with a 6-pin (U)SIM card connector. Figure 19: Reference Circuit of a 6-Pin (U)SIM1 Card Connector EM120R-GL&EM160R-GL provide two (U)SIM interfaces. (U)SIM1 interface is used for external (U)SIM card only, and (U)SIM2 interface is used for external (U)SIM card or internal eSIM card. It should be noted that, when (U)SIM2 interface is used for an external (U)SIM card, the reference circuits are the same as those of (U)SIM1 interface. When (U)SIM2 interface is used for the internal eSIM card, pins 40, 42, 44, 46 and 48 of the module must be kept open. EM120R-GL&EM160R-GL_Hardware_Design 35 / 79 USIM_VDD GND Module USIM_VDD USIM_RST USIM_CLK USIM_DATA 15K 22R 22R 22R 100 nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33 pF 33 pF 33 pF GND GND LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design A recommended compatible design of (U)SIM2 interface is shown below. Figure 20: Recommended Compatible Design of (U)SIM2 Interface In order to enhance the reliability and availability of the (U)SIM card in customers applications, follow the criteria below when designing the (U)SIM circuit:

Keep placement of (U)SIM card connector as close as possible to the module. Keep the trace length as less than 200 mm as possible. Keep (U)SIM card signals away from RF and VCC traces. Assure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5 mm to maintain the same electric potential. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode array with parasitic capacitance not exceeding 10 pF. The 22 resistors should be added in series between the module and the (U)SIM card connector so as to suppress EMI spurious transmission and enhance ESD protection. The 33 pF capacitors are used to filter out RF interference. Note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA trace can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. NOTE

* means under development. EM120R-GL&EM160R-GL_Hardware_Design 36 / 79 Module USIM2_VDD 10-20K 100 nF

(U)SIM Card Connector VPP eSIM USIM2_VDD USIM2_RST USIM2_CLK USIM2_DET USIM2_DATA 48 46 44 40 42 GND 0 0 0 0 0 22 22 22 VCC RST CLK CD IO GND 33 pF33 pF33 pF TVS Note: The five 0 resistors must be close to M.2 socket connector, and all other components should be close to (U)SIM card connector in PCB layout. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.7. USB Interface EM120R-GL&EM160R-GL provide one integrated Universal Serial Bus (USB) interface which complies with the USB 3.0/2.0 specifications and supports super speed (5 Gbps) on USB 3.0, high speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB interface. Table 11: Pin Definition of USB Interface Pin No. Pin Name I/O Description Comment USB_DP AI/AO USB_DM AI/AO USB 2.0 differential data bus

(+) USB 2.0 differential data bus

(-) USB_SS_TX_M AO USB 3.0 transmit data (-) USB_SS_TX_P AO USB 3.0 transmit data (+) USB_SS_RX_M AI USB 3.0 receive data (-) USB_SS_RX_P AI USB 3.0 receive data (+) Require differential impedance of 90 Require differential impedance of 90 Require differential impedance of 90 7 9 29 31 35 37 For more details about the USB 3.0 & 2.0 specifications, visit http://www.usb.org/home. EM120R-GL&EM160R-GL_Hardware_Design 37 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The USB 2.0 interface is recommended to be reserved for firmware upgrade in customers designs. The following figure shows a reference circuit of USB 3.0/USB 2.0 interface. Figure 21: Reference Circuit of USB 3.0/2.0 Interface AC coupling capacitors C5 and C6 must be placed close to the host and close to each other. C1 and C2 have been integrated inside the module, so do not place these two capacitors on customers schematic and PCB. In order to ensure the signal integrity of USB 2.0 data traces, R1, R2, R3 and R4 components must be placed close to the module, and the stubs must be minimized in PCB layout. In order to ensure that the USB interface designs correspond with USB specifications, comply with the following principles. It is important to route the USB 2.0 & 3.0 signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90 . For USB 2.0 signal traces, the trace lengths must be less than 120 mm, and the differential data pair matching is less than 2 mm (15 ps). For USB 3.0 signal traces, the maximum length of TX and RX differential data pair is recommended to be less than 100 mm, and the TX and RX differential data pair matching is less than 0.7 mm (5 ps). Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. It is important to route the USB 2.0 & 3.0 differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. If USB connector is used, keep the ESD protection components as close as possible to the USB connector. Pay attention to the influence of junction capacitance of ESD protection components on USB 2.0 & 3.0 data traces. Typically, the capacitance value should be less than 2.0 pF for USB 2.0, and less than 0.4 pF for USB 3.0. If possible, reserve four 0 resistors (R1R4) on USB_DP and USB_DM traces, as shown in the above figure. EM120R-GL&EM160R-GL_Hardware_Design 38 / 79 C5 100 nF C6 100 nF Host USB_SS_TX_P USB_SS_TX_M USB_SS_RX_P USB_SS_RX_M USB_DM USB_DP Module C1 100 nF C2 100 nF BB USB_SS_RX_P USB_SS_RX_M USB_SS_TX_P USB_SS_TX_M R10 R20 USB_DM USB_DP 37 35 31 29 9 7 Test Points R3 NM-0 R4 NM-0 ESD Minimize these stubs in PCB layout. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE

* means under development. 3.8. PCIe Interface EM120R-GL and EM160R-GL provide one integrated PCIe (Peripheral Component Interconnect Express) interface which complies with the PCI Express Specification, Revision 2.1 and supports 5 Gbps per lane. The PCIe interface is used for data transmission, GNSS NMEA sentences output, software debugging and firmware upgrade. The following table shows the pin definition of PCIe interface. Table 12: Pin Definition of PCIe Interface Pin No. Pin Name I/O Description Comment PCIE_REFCLK_P AI/AO PCIe reference clock (+) PCIE_REFCLK_M AI/AO PCIe reference clock (-) PCIE_RX_P AI PCIe receive data (+) PCIE_RX_M PCIe receive data (-) PCIE_TX_P PCIe transmit data (+) PCIE_TX_M PCIe transmit data (-) AI AO AO Require differential impedance of 95 . Require differential impedance of 95 Require differential impedance of 95 PCIE_RST_N DI 3.3 V power domain PCIE_CLKREQ_N DO 3.3 V power domain PCIe reset input. Active low. PCIe clock request. Active low. PCIe wake up the host. Active low. PCIE_WAKE_N DO 3.3 V power domain 55 53 49 47 43 41 50 52 54 EM120R-GL&EM160R-GL_Hardware_Design 39 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.8.1. Endpoint Mode EM120R-GL and EM160R-GL support endpoint (EP) mode. In this mode, the modules are configured as a PCIe EP device. The following figure shows a reference circuit of PCIe endpoint mode. Figure 22: PCIe Interface Reference Circuit (EP Mode) In order to ensure the signal integrity of PCIe interface, AC coupling capacitors C5 and C6 should be placed close to the host on PCB. C1 and C2 have been integrated inside the module, so do not place these two capacitors on customers schematic and PCB. EM120R-GL&EM160R-GL_Hardware_Design 40 / 79 Host PCIE_REFCLK_P PCIE_REFCLK_M PCIE_TX_P PCIE_TX_M PCIE_RX_P PCIE_RX_M PCIE_WAKE_N PCIE_CLKREQ_N PCIE_RST_N C5 100 nF C6 100 nF R1 10K R2 10K R3 10K VCC_IO_HOST PCIE_REFCLK_P PCIE_REFCLK_M PCIE_RX_P PCIE_RX_M PCIE_TX_P PCIE_TX_M 55 53 49 47 43 41 Module C1 100 nF C2 100 nF BB PCIE_WAKE_N PCIE_CLKREQ_N PCIE_RST_N 54 52 50 Note: The voltage level VCC_IO_HOST depends on the host side due to open drain in pin 50, 52 and 54. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 23: PCIe Power-on Timing Requirements of M.2 Specification Figure 24: PCIe Power-on Timing Requirements of the Module EM120R-GL&EM160R-GL_Hardware_Design 41 / 79 VCC T1 FULL_CARD_POWER_OFF#

T2 RESET#

PCIE_CLKREQ_N T3 T4 T5 PCIE_RST_N PCIE_REFCLK Active clock state LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 13: Description of PCIe Power-on Timing Requirements of the Module Index Min. Typical Max. Comment T1 0 ms 20 ms T2 T3 T4

50 ms 70 ms 100 ms T5 100 s

FULL_CARD_POWER_OFF# could be de-asserted before or after RESET#, 20 ms is a recommended value when it is controlled by GPIO. RESET# is pulled up internally, and it would be de-asserted 50 ms after VCC is powered on. PCIE_CLKREQ_N would be asserted 70 ms after FULL_CARD_POWER_OFF#. PCIE_RST_N should be de-asserted after PCIE_CLKREQ_N. The host must ensure that the reference clock is in the active clock state for at least a period specified by TPCIE_RST_N-CLK, prior to PCIE_RST_N de-assertion. The following principles of PCIe interface design should be complied with so as to meet PCIe V2.1 specifications. For PCIe signal traces, the TX and RX differential data pair maximum length is recommended to be It is important to route the PCIe signal traces as differential pairs with total grounding. less than 250 mm, the TX and RX differential data pair matching are less than 0.7 mm (5 ps). Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. It is important to route the PCIe differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. 3.8.2. USB Version and PCIe Only Version Beginning with ES2 (engineering samples), EM120R-GL&EM160R-GL support USB version and PCIe only version described as below:

USB version:

Support all USB 3.0/2.0 features Support MBIM/QMI/QRTR/AT Support firmware upgrade PCIe only version:

Support MBIM/QMI/QRTR/AT Support BIOS PCIe early initial Support firmware upgrade If EM120R-GL&EM160R-GL work at PCIe only version by burnt eFuse, the modules cannot switch back to USB version. EM120R-GL&EM160R-GL_Hardware_Design 42 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.9. PCM Interface*

EM120R-GL&EM160R-GL support audio communication via Pulse Code Modulation (PCM) digital interface. The PCM interface supports the following modes:

Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256, 512, 1024 or 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4096 kHz PCM_CLK at 16 kHz PCM_SYNC. In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a 256 kHz PCM_CLK and an 8 kHz, 50% duty cycle PCM_SYNC only. EM120R-GL&EM160R-GL support 16-bit linear data format. The following figures show the primary modes timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary modes timing relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK. Figure 25: Primary Mode Timing EM120R-GL&EM160R-GL_Hardware_Design 43 / 79 125 s PCM_CLK 1 2 255 256 PCM_SYNC PCM_OUT PCM_IN MSB LSB MSB MSB LSB MSB LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 26: Auxiliary Mode Timing The following table shows the pin definition of PCM interface which can be applied on audio codec design. Table 14: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_DIN 22 DI PCM data input 1.8 V power domain PCM_DOUT 24 DO PCM data output 1.8 V power domain PCM_SYNC 28 IO 1.8 V power domain PCM data frame synchronization PCM data bit clock In master mode, it is an output signal. In slave mode, it is an input signal. PCM_CLK 20 IO 1.8 V power domain. If unused, keep it open. The clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. Refer to document [3] for details about AT+QDAI command. EM120R-GL&EM160R-GL_Hardware_Design 44 / 79 125 s PCM_CLK 1 2 31 32 PCM_SYNC PCM_OUT PCM_IN MSB MSB LSB LSB LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE

* means under development. 3.10. Control and Indicator Signals*

The following table shows the pin definition of control and indicator signals. Table 15: Definition of Control and Indicator Signals Pin Name Pin No. I/O Power Domain Description WWAN_LED#

10 OD 3.3 V WAKE_ON_WAN#

23 OD 1.8/3.3 V W_DISABLE1#

8 DI 1.8/3.3 V W_DISABLE2#

DI 1.8/3.3 V DPR ANT_CONFIG DI DI 1.8 V 1.8 V 26 25 68 RF status indication. Active low. Wake up the host. Active low. Airplane mode control. Active low. GNSS enable control. Active low. Dynamic power reduction. Active low. Antenna configuration pin. NOTE

* means under development. 3.10.1. W_DISABLE1# Signal EM120R-GL&EM160R-GL provide a W_DISABLE1# signal to disable or enable airplane mode through hardware operation. The W_DISABLE1# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. In airplane mode, the RF function will be disabled. The RF function can also be enabled or disabled through software AT commands. The following table shows the RF function status of the modules. EM120R-GL&EM160R-GL_Hardware_Design 45 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 16: RF Function Status W_DISABLE1# Level AT Commands RF Function Status High Level AT+CFUN=1 Enabled High Level Low Level AT+CFUN=0 AT+CFUN=4 AT+CFUN=0 AT+CFUN=1 AT+CFUN=4 Disabled Disabled 3.10.2. W_DISABLE2# Signal EM120R-GL&EM160R-GL provide a W_DISABLE2# pin to disable or enable the GNSS function. The W_DISABLE2# pin is pulled up by default. Driving it to low level will disable the GNSS function. The combination of W_DISABLE2# pin and AT commands can control the GNSS function. Table 17: GNSS Function Status W_DISABLE2# Level AT Commands GNSS Function Status High Level AT+QGPS=1 Enabled High Level AT+QGPSEND Low Level AT+QGPS=1 Disabled Low Level AT+QGPSEND EM120R-GL&EM160R-GL_Hardware_Design 46 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design A simple level shifter based on diodes is used on W_DISABLE1# pin and W_DISABLE2# pin which are pulled up to a 1.8 V voltage in the module, as shown in the following figure. So, the control signals (GPIO) of the host device could be a 1.8 V or 3.3 V voltage level and pull-up resistor is not needed on the host side. These two signals are active low, and a reference circuit is shown below. Figure 27: W_DISABLE1# and W_DISABLE2# Reference Circuit 3.10.3. WWAN_LED# Signal The WWAN_LED# signal is used to indicate RF status of the modules, and its typical current consumption is up to 10 mA. In order to reduce the current consumption of the LED, a resistor must be placed in series with the LED, as illustrated in the figure below. The LED is ON when the WWAN_LED# signal is at a low voltage level. Figure 28: WWAN_LED# Signal Reference Circuit EM120R-GL&EM160R-GL_Hardware_Design 47 / 79 Host GPIO GPIO VCC_IO_HOST R1 10K R2 10K Module VDD 1.8 V R3 10K R4 10K BB W_DISABLE2#

W_DISABLE1#

26 8 Note:

Hosts GPIO could be a 1.8 V or 3.3 V voltage level. Host Module VCC R1 200 LED GPIO WWAN_LED#

10 PMU Note: This VCC could be the power supply of the module. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following table shows the RF status indicated by WWAN_LED# signal. Table 18: RF Status Indications of WWAN_LED# Signal LED On Off RF Status On Off RF function is turned off if any of the following circumstances occurs:

The (U)SIM card is not working. W_DISABLE1# signal is at low level (airplane mode enabled). WWAN_LED# Level Low Level High Level NOTE 3.10.4. WAKE_ON_WAN# Signal The WAKE_ON_WAN# signal is an open collector signal, which requires a pull-up resistor on the host. When a URC returns, a 1s low level pulse signal will be outputted to wake up the host. The module operation status indicated by WAKE_ON_WAN# is shown as below. Table 19: State of the WAKE_ON_WAN# Signal WAKE_ON_WAN# State Module Operation Status Output a 1s low level pulse signal Call/SMS/Data is incoming (to wake up the host) Always at high level Idle/Sleep EM120R-GL&EM160R-GL_Hardware_Design 48 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 29: WAKE_ON_WAN# Signal Reference Circuit Design 3.10.5. DPR EM120R-GL&EM160R-GL provide a DPR (Dynamic Power Reduction) signal for body SAR (Specific Absorption Rate) detection. The signal to EM120R-GL&EM160R-GL modules to provide an input trigger which will reduce the output power in the radio transmission. is sent by a host system proximity sensor Table 20: Function of the DPR Signal DPR Level Function High/Floating Max transmitting power will NOT back off Low Max transmitting power will back off by executing AT+QCFG="sarcfg" command NOTE Please refer to document [3] for more details about AT+QCFG="sarcfg" command. EM120R-GL&EM160R-GL_Hardware_Design 49 / 79 Host Module GPIO WAKE_ON_WAN#

23 BB VCC_IO_HOST R1 10K H L 1 s Wake up the host Note: The voltage level on VCC_IO_HOST depends on the host side due to open drain in pin 23. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.10.6. ANT_CONFIG Signal EM160R-GL provides an ANT_CONFIG signal for antenna configuration, however, EM120R-GL does not support it since EM120R-GL only supports 2 antennas. The signal is sent by a host system to EM160R-GL module. ANT_CONFIG is an input port which is pulled high internally by default. The definition of ANT_CONFIG signal is shown as below table. Table 21: Pin Definition of ANT_COMNFIG of EM160R-GL ANT_CONFIG Level Function High/Floating Low Level Support 2 antennas Support 4 antennas 3.11. COEX UART Interface*

EM120R-GL&EM160R-GL provide one COEX UART interface. The following table shows the COEX UART interface pin definition. Table 22: Pin Definition of COEX UART Interface Pin Name Pin No. I/O Description Comment COEX3 60 GPIO 1.8 V power domain COEX UART Interface 1.8 V power domain 1.8 V power domain COEX_RXD 62 COEX_TXD 64 IO IO IO NOTE

* means under development. EM120R-GL&EM160R-GL_Hardware_Design 50 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.12. Antenna Tuner Control Interfaces*

ANTCTL [0:3] and RFFE signals are used for antenna tuner control and should be routed to an appropriate antenna control circuit. More details about the interface will be added in a future version of the document. 3.12.1. Antenna Tuner Control Interface through GPIOs Table 23: Pin Definition of Antenna Tuner Control Interface through GPIOs Pin Name Pin No. I/O Description Comment ANTCTL0 ANTCTL1 ANTCTL2 ANTCTL3 59 61 63 65 DO DO DO DO Antenna tuner control 1.8 V power domain Antenna tuner control 1.8 V power domain Antenna tuner control 1.8 V power domain Antenna tuner control 1.8 V power domain 3.12.2. Antenna Tuner Control Interface through RFFE Table 24: Pin Definition of Antenna Tuner Control Interface through RFFE Pin Name Pin No. I/O Description Comment RFFE_CLK 56 RFFE_DATA 58 DO IO RFFE serial interface used for external tuner control If unused, keep it open. If unused, keep it open. NOTE

* means under development. EM120R-GL&EM160R-GL_Hardware_Design 51 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.13. Configuration Pins EM120R-GL&EM160R-GL provide four configuration pins which are defined as below. 3.13.1. EM160R-GL configuration pins Table 25: List of EM160R-GL Configuration Pins Pin No. Pin Name Power Domain Description 21 69 75 1 CONFIG_0 CONFIG_1 CONFIG_2 CONFIG_3 0 0 0 0 NC NC NC The following figure shows a reference circuit of these four pins. Connected to GND internally. Figure 30: Recommended Circuit of EM160R-GL Configuration Pins EM120R-GL&EM160R-GL_Hardware_Design 52 / 79 Host VCC_IO_HOST EM160R-GL R1 R2 R3 100K 100K 100K R4 100K GPIO GPIO GPIO GPIO CONFIG_0 NM-0 CONFIG_1 0 CONFIG_2 NM-0 CONFIG_3 NM-0 21 69 75 1 Note: The voltage level VCC_IO_HOST depends on the host side, and could be a 1.8 V or 3.3 V voltage level. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 26: List of EM160R-GL Configuration Pins Config_0

(Pin 21) Config_1

(Pin 69) Config_2

(Pin 75) Config_3

(Pin 1) Module Type and Main Host Interface Port Configuration NC GND NC NC Vender defined N/A 3.13.2. EM120R-GL configuration pins Table 27: List of EM120R-GL Configuration Pins Pin No. Pin Name Power Domain Description 21 69 75 1 CONFIG_0 CONFIG_1 CONFIG_2 CONFIG_3 0 0 0 0 Connected to GND internally. Connected to GND internally. NC NC The following figure shows a reference circuit of these four pins. Figure 31: Recommended Circuit of EM120R-GL Configuration Pins EM120R-GL&EM160R-GL_Hardware_Design 53 / 79 Host VCC_IO_HOST EM120R-GL R1 R2 R3 100K 100K 100K R4 100K GPIO GPIO GPIO GPIO CONFIG_0 CONFIG_1 0 0 CONFIG_2 NM-0 CONFIG_3 NM-0 21 69 75 1 Note: The voltage level VCC_IO_HOST depends on the host side, and could be a 1.8 V or 3.3 V voltage level. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 28: List of EM120R-GL Configuration Pins Config_0

(Pin 21) Config_1

(Pin 69) Config_2

(Pin 75) Config_3

(Pin 1) Module Type and Main Host Interface Port Configuration GND GND NC NC Vender defined N/A EM120R-GL&EM160R-GL_Hardware_Design 54 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 4 GNSS Receiver 4.1. General Description EM120R-GL&EM160R-GL include a fully integrated global navigation satellite system solution that supports Gen9-Lite of Qualcomm (GPS, GLONASS, BeiDou/Compass and Galileo). The modules support standard NMEA-0183 protocol, and output NMEA sentences at 1 Hz data update rate via USB interface by default. By default, EM120R-GL&EM160R-GL GNSS engine is switched off. It can only be switched on via AT command. For more details about GNSS engine technology and configurations, refer to document [4]. EM120R-GL&EM160R-GL_Hardware_Design 55 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 5 Antenna Connection EM120R-GL and EM160R-GL provide Main, Rx-diversity/GNSS and MIMO antenna connectors 1) which are used to resist the fall of signals caused by high speed movement and multipath effect. The impedance of antenna ports is 50 . EM160R-GL provides a Main, an Rx-diversity/GNSS and two MIMO antenna connectors. EM120R-GL provides a Main and an Rx-diversity/GNSS antenna connectors. 5.1. Antenna Connectors The antenna connectors are shown below. Figure 32: Antenna Connectors on the EM160R-GL Module EM120R-GL&EM160R-GL_Hardware_Design 56 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 33: Antenna Connectors on the EM120R-GL Module 5.1.1. Operating Frequency Table 29: Operating Frequencies of EM120R-GL&EM160R-GL 3GPP Band Transmit Receive WCDMA B1 19201980 WCDMA B2 18501910 WCDMA B3 17101785 WCDMA B4 17101755 WCDMA B5 WCDMA B6 WCDMA B8 WCDAM B19 824849 830840 880915 830845 21102170 19301990 18051880 21102155 869894 875885 925960 875890 Unit MHz MHz MHz MHz MHz MHz MHz MHz EM120R-GL&EM160R-GL_Hardware_Design 57 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design LTE B1 LTE B2 LTE B3 LTE B4 LTE B5 LTE B7 LTE B8 LTE B12 LTE B13 LTE B14 LTE B17 LTE B18 LTE B19 LTE B20 LTE B25 LTE B26 LTE B28 LTE B29 1) LTE B30 LTE B32 1) LTE B38 LTE B39 LTE B40 LTE B41 LTE B42 25002570 26202690 18501915 19301995 19201980 18501910 17101785 17101755 824849 880915 699716 777787 788798 704716 815830 830845 832862 814849 703748

23052315 25702620 18801920 23002400 24962690 34003600 21102170 19301990 18051880 21102155 869894 925960 729746 746756 758768 734746 860875 875890 791821 859894 758803 717728 23502360 14521496 25702620 18801920 23002400 24962690 34003600 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EM120R-GL&EM160R-GL_Hardware_Design 58 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 36003800 51505925 35503700 17101780 36003800 51505925 35503700 21102200 MHz MHz MHz MHz 1) LTE-FDD B29/32 and LTE-TDD B46 support Rx only and are only for secondary component carrier. 5.2. GNSS Antenna Connector The following table shows frequency specification of GNSS antenna connector. Table 30: GNSS Frequency Type Frequency GPS/Galileo 1575.42 1.023 GLONASS 1601.65 4.15 BeiDou/Compass 1561.098 2.046 Unit MHz MHz MHz LTE B43 LTE B46 1) LTE B48 LTE B66 NOTE EM120R-GL&EM160R-GL_Hardware_Design 59 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirements The following table shows the requirements on Main, Rx-diversity/GNSS and MIMO antennas. Table 31: Antenna Requirements of EM160R-GL Type Requirements Supported Bands Main Antenna

(Tx/Rx) Rx-diversity/

GNSS Antenna MIMO1 Antenna Rx VSWR: 2 Efficiency: > 30%

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB

(699960 MHz) Cable Insertion Loss: < 1.5 dB

(17102200 MHz) Cable Insertion Loss: < 2dB

(23002690 MHz) VSWR: 2 Efficiency: > 30%

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB

(699960 MHz) Cable Insertion Loss: < 1.5 dB

(15592200 MHz) Cable Insertion Loss: < 2 dB

(23002690 MHz) VSWR: 2 Efficiency: > 30%

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB

(699960 MHz) Cable Insertion Loss: < 1.5 dB

(15592200 MHz) LTE:

B1/B2/B3/B4/B5/B7/B8/B12/B13/

B14/B17/B18/B19/B20/B25/B26/

B28/B29/B30/B32/B38/B39/B40/

B41/B42/B43/B46/B48/B66 WCDMA:

B1/B2/B3/B4/B5/B6/B8/B19 LTE:

B1/B2/B3/B4/B5/B7/B8/B12/B13/

B14/B17/B18/B19/B20/B25/B26/

B28/B29/B30/B32/B38/B39/B40/

B41/B42/B43/B46/B48/B66 WCDMA:

B1/B2/B3/B4/B5/B6/B8/B19 GNSS:

GPS;

GLONASS;

BeiDou/Compass;

Galileo LTE:

B1/B2/B3/B4/B7/B25/

B30/B32/B38/B39/B40/B41/B66 EM120R-GL&EM160R-GL_Hardware_Design 60 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 32: Antenna Requirements of EM120R-GL Type Requirements Supported Bands Cable Insertion Loss: < 2 dB

(23002690 MHz) VSWR: 2 Efficiency: > 30%

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB

(699960 MHz) Cable Insertion Loss: < 1.5 dB

(15592200 MHz) Cable Insertion Loss: < 2 dB

(23002690 MHz) VSWR: 2 Efficiency: > 30%

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB

(699960 MHz) Cable Insertion Loss: < 1.5 dB

(17102200 MHz) Cable Insertion Loss: < 2dB

(23002690 MHz) VSWR: 2 Efficiency: > 30%

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB

(699960 MHz) Cable Insertion Loss: < 1.5 dB

(15592200 MHz) Cable Insertion Loss: < 2 dB

(23002690 MHz) MIMO2 Antenna

(Rx) Main Antenna

(Tx/Rx) Rx-diversity/

GNSS Antenna LTE:

B1/B2/B3/B4/B7/B25/

B30/B32/B38/B39/B40/B41/B66 LTE:

B1/B2/B3/B4/B5/B7/B8/B12/B13/

B14/B17/B18/B19/B20/B25/B26/

B28/B29/B30/B32/B38/B39/B40/

B41/B42/B43/B46/B48/B66 WCDMA:

B1/B2/B3/B4/B5/B6/B8/B19 LTE:

B1/B2/B3/B4/B5/B7/B8/B12/B13/

B14/B17/B18/B19/B20/B25/B26/

B28/B29/B30/B32/B38/B39/B40/

B41/B42/B43/B46/B48/B66 WCDMA:

B1/B2/B3/B4/B5/B6/B8/B19 GNSS:

GPS;

GLONASS;

BeiDou/Compass;

Galileo EM120R-GL&EM160R-GL_Hardware_Design 61 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation EM120R-GL and EM160R-GL are mounted with standard 2 mm 2 mm receptacle RF connectors for convenient antenna connection. The connector dimensions are illustrated below:

Figure 34: EM120R-GL&EM160R-GL RF Connector Dimensions (Unit: mm) Item Table 33: Major Specifications of the RF Connector Specification Nominal Frequency Range DC to 6 GHz Nominal Impedance 50 Temperature Rating

-40 C to +85 C Voltage Standing Wave Ratio (VSWR) Meet the requirements of:

Max. 1.3 (DC3 GHz) Max. 1.45 (36 GHz) The receptacle RF connector used in conjunction with EM120R-GL&EM160R-GL will accept two types of mating plugs that will meet a maximum height of 1.2 mm using a 0.81 mm coaxial cable or a maximum height of 1.4 mm utilizing a 1.13 mm coaxial cable. EM120R-GL&EM160R-GL_Hardware_Design 62 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following figure shows the specifications of mating plugs using 0.81 mm coaxial cables. Figure 35: Specifications of Mating Plugs Using 0.81 mm Coaxial Cables The EM120R-GL&EM160R-GL and the mating plug using a 0.81 mm coaxial cable. the connection between illustrates following figure the receptacle RF connector on Figure 36: Connection between RF Connector and Mating Plug Using 0.81 mm Coaxial Cable The EM120R-GL&EM160R-GL and the mating plug using a 1.13 mm coaxial cable. the connection between illustrates following figure the receptacle RF connector on Figure 37: Connection between RF Connector and Mating Plug Using 1.13 mm Coaxial Cable EM120R-GL&EM160R-GL_Hardware_Design 63 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the modules are listed in the following table. Table 34: Absolute Maximum Ratings Parameter VCC Voltage at Digital Pins Min.

-0.3

-0.3 Max. Unit 4.7 2.3 V V 6.2. Power Supply Requirements The typical input voltage of EM120R-GL&EM160R-GL is 3.7 V, as specified by PCIe M.2 Electromechanical Spec Rev1.0. The following table shows the power supply requirements of the modules. Table 35: Power Supply Requirements Parameter Description Min. Typ. Max. VCC Power Supply 3.135 3.7 4.4 Unit V EM120R-GL&EM160R-GL_Hardware_Design 64 / 79 VIH VIL VOH VOL NOTE LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 6.3. I/O Requirements Table 36: I/O Requirements Parameter Description Min. Max. Unit Input high voltage 0.7 VDD18 1) VDD18 + 0.3 Input low voltage

-0.3 0.3 VDD18 Output high voltage VDD18 - 0.5 VDD18 Output low voltage 0 0.4 V V V V 1) VDD18 refers to I/O power domain. 6.4. Operation and Storage Temperatures Table 37: Operation and Storage Temperatures Parameter Min. Max. Unit Typ.

+25

+75

+85

+90 C C C Operating temperature Range 1)

-25 Extended Temperature Range 2)

-40 Storage temperature Range

-40 NOTES 1. 1) Within operating temperature range, the module is 3GPP compliant. For those end devices with bad thermal dissipation condition, a thermal pad or other thermal conductive components may be required between the module and main PCB to achieve the full operating temperature range. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like EM120R-GL&EM160R-GL_Hardware_Design 65 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Pout might reduce in their values and exceed the specified tolerances. When the temperature returns to the normal operating temperature level, the module will meet 3GPP specifications again. 6.5. Current Consumption Table 38: EM120R-GL&EM160R-GL Current Consumption Parameter Description Conditions IVCC OFF state Power down Typ. Unit TBD A 6.6. RF Output Power The following table shows the RF output power of EM120R-GL&EM160R-GL. Table 39: RF Output Power Frequency

(Quectel SPEC) Max. WCDMA band 1, 3, 5, 8s 24 dBm +1.5/-3 dB LTE-FDD band 1, 3, 5, 7, 8, 20, 28s 23 dBm 2 dB LTE-TDD band 38, 40, 41, 42, 43s 23 dBm 2 dB Min.

< -50 dBm

< -40 dBm

< -40 dBm

EM120R-GL&EM160R-GL_Hardware_Design 66 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 6.7. RF Receiving Sensitivity The following tables show conducted RF min. receiving sensitivity of EM120R-GL and EM160R-GL. Table 40: EM120R-GL&EM160R-GL Conducted RF Min. Receiving Sensitivity Frequency Primary Diversity SIMO 1) SIMO 2) (Worst Case) WCDMA B3

-109.5

-110.5 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6

-111

-109.5 TBD

-111 TBD WCDMA B8

-111.5

-110.5 WCDMA B19 TBD

-110.5

-106.7 dBm

-110

-111 TBD

-112 TBD

-111 TBD

-104.7 dBm

-103.7 dBm

-106.7 dBm

-104.7 dBm

-106.7 dBm

-103.7 dBm

-106.7 dBm LTE-FDD B1 (10 MHz)

-98

-100.7

-96.3 dBm LTE-FDD B2 (10 MHz)

-97.8

-100.3

-94.3 dBm LTE-FDD B3 (10 MHz)

-98.8

-100.8

-93.3 dBm LTE-FDD B4 (10 MHz)

-97.7

-100.6

-96.3 dBm LTE-FDD B5 (10 MHz)

-99.7

-99 LTE-FDD B7 (10 MHz)

-96

-102

-99.4

-94.3 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-99

-101.7

-93.3 dBm LTE-FDD B12 (10 MHz)

-99.8

-102.3

-93.3 dBm LTE-FDD B13 (10 MHz)

-100.2

-99.4

-102.5

-93.3 dBm LTE-FDD B14 (10 MHz)

-99.2

-101.8

-93.3 dBm LTE-FDD B17 (10 MHz)

-99.9

-102.3

-93.3 dBm LTE-FDD B18 (10 MHz)

-99.6

-102.2

-96.3 dBm

-110

-110 TBD

-111 TBD TBD

-98

-97.7

-97.3

-97.9

-97.2

-99.2

-99.5

-99.2

-99.6

-99.4 EM120R-GL&EM160R-GL_Hardware_Design 67 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design LTE-FDD B19 (10 MHz)

-99.7

-99

-102

-96.3 dBm LTE-FDD B20 (10 MHz)

-99.7

-102.2

-93.3 dBm LTE-FDD B25 (10 MHz)

-97.8

-100.3

-92.8 dBm LTE-FDD B26 (10 MHz)

-99.4

-101.9

-93.8 dBm LTE-FDD B28 (10 MHz)

-99.3

-102.1

-94.8 dBm LTE-FDD B30 (10 MHz)

-96

-99.5

-95.3 dBm LTE-TDD B38 (10 MHz)

-98.4

-97

-100.1

-96.3 dBm LTE-FDD B39 (10 MHz)

-98.4

-100.5

-96.3 dBm LTE-TDD B40 (10 MHz)

-96.3 LTE-TDD B41 (10 MHz)

-98.1

-99.2

-99.7

-96.3 dBm

-94.3 dBm LTE-TDD B42 (10 MHz)

-97.3

-100.7

-95.0 dBm LTE-TDD B43 (10 MHz)

-97.4

-100.7

-95.0 dBm LTE-TDD B48 (10 MHz)

-97.3

-100.6

-95.0 dBm

-99.5

-97.6

-99.1

-99.6

-97.4

-97.5

-96.9

-96.1

-98.7

-98.4

-98.5

-97.8 LTE-FDD B66 (10 MHz)

-97.6

-100.4

-95.8 dBm NOTES 1. 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and multiple antennas at the receiver side, which can improve Rx performance. 2. 2) Per 3GPP specification. 6.8. Characteristics The modules are not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the modules. EM120R-GL&EM160R-GL_Hardware_Design 68 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following table shows the modules electrostatic discharge characteristics. Table 41: Electrostatic Discharge Characteristics (Temperature: 25 C, Humidity: 40%) Contact Discharge Air Discharge Unit Interfaces VCC, GND Antenna Interfaces Other Interfaces TBD TBD TBD 6.9. Thermal Dissipation TBD TBD TBD kV kV kV EM120R-GL&EM160R-GL are designed to work over an extended temperature range. In order to achieve a better performance while working under extended temperatures or extreme conditions (such as with maximum power or data rate, etc.) for a long time, it is strongly recommended to add a thermal pad or other thermally conductive compounds between the module and the main PCB for thermal dissipation. The thermal dissipation area (i.e. the area for adding thermal pad) is shown as below. The dimensions are measured in mm. Figure 38: Thermal Dissipation Area on Bottom Side of Module (Top View) EM120R-GL&EM160R-GL_Hardware_Design 69 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design There are some other measures to enhance heat dissipation performance:

Add ground vias as many as possible on PCB. Maximize airflow over/around the module. Place the module away from other heating sources. Module mounting holes must be used to attach (ground) the device to the main PCB ground. It is NOT recommended to apply solder mask on the main PCB where the modules thermal dissipation area is located. Select an appropriate material, thickness and surface for the outer housing (i.e. the mechanical enclosure) of the application device that integrates the module so that it provides good thermal dissipation. Customers may also need active cooling to pull heat away from the module. If possible, add a heatsink on the top of the module. A thermal pad should be used between the heatsink and the module, and the heatsink should be designed with as many fins as possible to increase heat dissipation area. NOTE For more detailed guidelines on thermal design, refer to document [5]. EM120R-GL&EM160R-GL_Hardware_Design 70 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7 Mechanical Dimensions and Packaging This chapter mainly describes mechanical dimensions and packaging specifications of EM120R-GL&EM160R-GL. All dimensions are measured in mm, and the dimensional tolerances are 0.05 mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module Figure 39: Mechanical Dimensions of EM120R-GL&EM160R-GL (Unit: mm) EM120R-GL&EM160R-GL_Hardware_Design 71 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.2. Standard Dimensions of M.2 PCI Express The following figure shows the standard dimensions of M.2 PCI Express, refer to document [6]. Figure 40: Standard Dimensions of M.2 Type 3042-S3 (Unit: mm) According to M.2 nomenclature, EM120R-GL&EM160R-GL are Type 3042-S3-B (30.0 mm 42.0 mm, max component height on the top is 1.5 mm and single-sided, key ID is B). Figure 41: M.2 Nomenclature EM120R-GL&EM160R-GL_Hardware_Design 72 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.3. Design Effect Drawings of the Module 7.3.1. Design Effect Drawings of EM160R-GL Module Figure 42: Top View of the Module Figure 43: Bottom View of the Module EM120R-GL&EM160R-GL_Hardware_Design 73 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.3.2. Design Renderings of EM120R-GL Module Figure 44: Top View of the Module Figure 45: Bottom View of the Module NOTE These are renderings of EM120R-GL&EM160R-GL. For authentic appearance, refer to the modules that you receive from Quectel. EM120R-GL&EM160R-GL_Hardware_Design 74 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.4. M.2 Connector EM120R-GL&EM160R-GL adopt a standard PCI Express M.2 connector which compiles with the directives and standards listed in the document [6]. 7.5. Packaging EM120R-GL&EM160R-GL are packaged in trays. The following figure shows the tray size. Figure 46: Tray Size (Unit: mm) Each tray contains 10 modules. The smallest package contains 100 modules. Tray packaging procedures are as below. 1. Use 10 trays to package 100 modules at a time (tray size: 247 mm 172 mm). 2. Place an empty tray on the top of the 10-tray stack. 3. Fix the stack with masking tape in # shape as shown in the following figure. 4. Pack the stack with conductive bag, and then fix the bag with masking tape. 5. Place the list of IMEI No. into a small carton. 6. Seal the carton and then label the seal with sealing sticker (small carton size: 250 mm 175 mm 128 mm). EM120R-GL&EM160R-GL_Hardware_Design 75 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 47: Tray Packaging Procedure EM120R-GL&EM160R-GL_Hardware_Design 76 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 8 Appendix References Table 42: Related Documents SN Document Name Remark

[1]

Quectel_EM120R-GL&EM160R-GL_CA_Feature EM120R-GL&EM160R-GL CA Feature

[2]

Quectel_M.2_EVB_User_Guide M.2 EVB User Guide

[3]

[4]

Quectel_EM120R-GL&EM160R-GL_AT_Commands_ Mannual EM120R-GL&EM160R-GL AT Commands Manual Quectel_EM120R-GL&EM160R-GL_GNSS_AT_ Commands_ Manual EM120R-GL&EM160R-GL GNSS AT Commands Manual

[5]

Quectel_LTE_Module_Thermal_Design_Guide Thermal Design Guide for LTE Modules

[6]

PCI Express M.2 Specification Table 43: Terms and Abbreviations Abbreviation Description bps Bits Per Second DC-HSPA+

Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air DL DRx ESD FDD Downlink Diversity Receive Electrostatic Discharge Frequency Division Duplexing GLONASS Globalnaya Navigatsionnaya Sputnikovaya Sistema (the Russian Global Navigation Satellite System) GNSS Global Navigation Satellite System EM120R-GL&EM160R-GL_Hardware_Design 77 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Global Positioning System Global System for Mobile Communications High Speed Packet Access HSUPA High Speed Uplink Packet Access GPS GSM HSPA kbps LED LTE Mbps ME MIMO MLCC MMS MO MT PDU PPP PRx RF Rx SAR SMS Tx UART UL URC Kilo Bits Per Second Light Emitting Diode Long Term Evolution Million Bits Per Second Mobile Equipment (Module) Multiple-Input Multiple-Output Multiplayer Ceramic Chip Capacitor Multimedia Messaging Service Mobile Originated Mobile Terminated Protocol Data Unit Point-to-Point Protocol Primary Receive Radio Frequency Receive Specific Absorption Rate Short Message Service Transmit Uplink Unsolicited Result Code Universal Asynchronous Receiver & Transmitter EM120R-GL&EM160R-GL_Hardware_Design 78 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design

(U)SIM WCDMA

(Universal) Subscriber Identification Module Wideband Code Division Multiple Access EM120R-GL&EM160R-GL_Hardware_Design 79 / 79 FCC Part 15 Subpart B, Part 22 Subpart H, Part 24 Subpart E, Part 27 Subpart D & L & H & F FCC KDB996369 D03v01 Requirements List of applicable FCC rules

& M & N, Part 90 Subpart R & S, Part 96 Summarize the specific operational use conditions Not Applicable Technology Frequency Range Antenna Type Max Peak Gain (dBi) Limited module procedures Not Applicable Trace antenna designs Refer to Manual Section 4 RF exposure considerations Refer to FCC certification requirements Antennas WCDMA & LTE Band 2 WCDMA & LTE Band 4 WCDMA & LTE Band 5 LTE Band 7 LTE Band 12 LTE Band 13 LTE Band 14 LTE Band 25 LTE Band 26 LTE Band 30 LTE Band 38 LTE Band 41 LTE Band 48 LTE Band 66

(MHz) 1850 ~ 1910 1710 ~ 1755 824 ~ 849 2500 ~ 2570 699 ~ 716 777 ~ 787 788 ~ 798 1850 ~ 1915 814 ~ 849 2305 ~ 2315 2570 ~ 2620 2496 ~ 2690 3550 ~ 3700 1710 ~ 1780 Label and compliance information Refer to FCC Label Information on test modes and additional testing requirements Not Applicable Dipole 1.15

-0.50 1.85 1.32

-2.43

-0.10 2.40 1.15 1.85

-3.64 0.93 0.93

-3.37

-0.50 Additional testing, Part 15 Subpart B disclaimer Refer to FCC 15B Report FCC Certification Requirements. device is a mobile device. And the following conditions must be met:

According to the definition of mobile and fixed device is described in Part 2.1091(b), this 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user's body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2020EM120RGL2. 4. This module must not transmit simultaneously with any other antenna or transmitter 5. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a se parate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certifed modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the module's FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: "Contains Transmitter Module FCC ID: XMR2020EM120RGL2" or "Contains FCC ID:

XMR2020EM120RGL2 " must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The user's manual or instruction manual for an intentional or unintentiona l radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in This device complies with part 15 of the FCC Rules. Operation is subject to the following two that form. conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesir ed operation. Changes or modifications not expressly approved by the manufacturer could void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and r eceiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/ TV technician for help. IC Statement IRSS-GEN of the device. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may ca use undesired operation Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Radiation Exposure Statement:

The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user's body and must not transmit simultaneously with any other antenna or transmitter. Dclarationd'exposition aux radiations:

L'EST est un appareil mobile; maintenir une distance d'au moins 20 cm entre l'EST et le corps de l'utilisateur et ne pas mettre simultanment avec une autre antenne ou un autre metteur. Technology Frequency Range Antenna Type Max Peak Gain (dBi) Antennas WCDMA & LTE Band 2 WCDMA & LTE Band 4 WCDMA & LTE Band 5 LTE Band 7 LTE Band 12 LTE Band 13 LTE Band 14 LTE Band 25 LTE Band 26 LTE Band 30 LTE Band 38 LTE Band 41 LTE Band 48 LTE Band 66

(MHz) 1850 ~ 1910 1710 ~ 1755 824 ~ 849 2500 ~ 2570 699 ~ 716 777 ~ 787 788 ~ 798 1850 ~ 1915 814 ~ 849 2305 ~ 2315 2570 ~ 2620 2496 ~ 2690 3550 ~ 3700 1710 ~ 1780 Dipole 1.15

-0.50 1.85 1.32

-2.43

-0.10 2.40 1.15

-3.64 0.93 0.93

-0.50

-3.37

-0.50 Technologie Gamme de Type d'antenne Gain de crte frquences (MHz) maximum (dBi) Antennes WCDMA & LTE Band 2 WCDMA & LTE Band 4 WCDMA & LTE Band 5 LTE Bande 7 LTE Bande 12 LTE Bande 13 LTE Bande 14 LTE Bande 25 LTE Bande 30 LTE Bande 38 LTE Bande 41 LTE Bande 66 1850 ~ 1910 1710 ~ 1755 824 ~ 849 2500 ~ 2570 699 ~ 716 777 ~ 787 788 ~ 798 1850 ~ 1915 2305 ~ 2315 2570 ~ 2620 2500 ~ 2690 1710 ~ 1780 Dipole 1.15

-0.50 1.85 1.32

-2.43

-0.10 2.40 1.15

-3.64 0.93 0.93

-0.50 The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains" or similar wording expressing the same meaning, as follows: Contains IC: 10224A-2020EM120GL or "where:

10224A-2020EM120GL is the module's certification number". Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est install dans le produit hte; sinon, le produit hte doit tre tiquet pour afficher le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell similaire exprimant le mme sens, comme suit: Contient IC: 10224A-2020EM120GL ou

"o: 10224A-2020EM120GL est le numro de certification du module".