FCC ID: XMR2022EM120KGL LTE-A Cat 12 M.2 Module

 

EM060K-GL&EM120K-GL Hardware Design LTE-A Module Series Version: 1.0.0 Date: 2021-04-15 Status: Preliminary LTE-A Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. EM060K-GL&EM120K-GL_Hardware_Design 1 / 78 LTE-A Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

(third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved. EM060K-GL&EM120K-GL_Hardware_Design 2 / 78 LTE-A Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as mobile phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders. EM060K-GL&EM120K-GL_Hardware_Design 3 / 78 LTE-A Module Series About the Document Revision History Version Date Author Description

2021-12-29 Creation of the document 1.0.0 2022-04-15 Preliminary Davon ZHAO/

Robinson SHEN/

Eysen WANG/

Jacen HUANG Davon ZHAO/

Robinson SHEN/

Eysen WANG/

Jacen HUANG EM060K-GL&EM120K-GL_Hardware_Design 4 / 78 LTE-A Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents ....................................................................................................................................................... 5 Table Index ................................................................................................................................................... 8 Figure Index ............................................................................................................................................... 10 1 Introduction ........................................................................................................................................ 11 1.1. Reference Standard .................................................................................................................. 14 1.2. Special Marks ............................................................................................................................ 14 2 Product Overview .............................................................................................................................. 15 2.1. Frequency Bands and Functions .............................................................................................. 15 2.2. Key Features ............................................................................................................................. 16 2.3. Functional Diagram ................................................................................................................... 18 2.4. Pin Assignment ......................................................................................................................... 19 2.5. Pin Description .......................................................................................................................... 20 2.6. EVB kit ....................................................................................................................................... 24 3 Operating Characteristics ................................................................................................................. 25 3.1. Operating Modes ....................................................................................................................... 25 3.2. Sleep Mode ............................................................................................................................... 25 3.3. Airplane Mode ........................................................................................................................... 27 3.4. Communication Interface with the Host .................................................................................... 27 3.5. Power Supply ............................................................................................................................ 27 3.5.1. Power Supply Pins ......................................................................................................... 27 3.5.2. Reference Design for Power Supply .............................................................................. 27 3.5.3. Voltage Stability Requirements ...................................................................................... 28 3.6. Turn on ...................................................................................................................................... 29 3.7. Turn off ...................................................................................................................................... 30 3.8. Reset ......................................................................................................................................... 31 4.1. 4 Application Interfaces ....................................................................................................................... 34

(U)SIM Interface ........................................................................................................................ 34 4.1.1. Pin definition of (U)SIM .................................................................................................. 34

(U)SIM Hot-Plug ............................................................................................................. 35 4.1.2. 4.1.3. Normally Closed (U)SIM Card Connector...................................................................... 36 4.1.4. Normally Open (U)SIM Card Connector ........................................................................ 36

(U)SIM Card Connector Without Hot-Plug ..................................................................... 37 4.1.5.

(U)SIM2 Card Connector ............................................................................................... 38 4.1.6.

(U)SIM Design Notices................................................................................................... 38 4.1.7. 4.2. USB Interface ............................................................................................................................ 39 4.3. PCM Interface* .......................................................................................................................... 40 4.4. Control and Indication Interfaces* ............................................................................................. 42 EM060K-GL&EM120K-GL_Hardware_Design 5 / 78 LTE-A Module Series 4.4.1. W_DISABLE1# ............................................................................................................... 42 4.4.2. W_DISABLE2# ............................................................................................................... 43 4.4.3. WWAN_LED#................................................................................................................. 44 4.4.4. WAKE_ON_WAN# ......................................................................................................... 45 4.4.5. DPR ................................................................................................................................ 45 4.4.6. WLAN_PA_EN ............................................................................................................... 46 4.5. Cellular/WLAN COEX Interface* ............................................................................................... 46 4.6. Configuration Pins ..................................................................................................................... 47 5.1.2.1. 5.1.2.2. 5 Antenna Interfaces ............................................................................................................................. 48 5.1. Cellular Network ........................................................................................................................ 48 5.1.1. Antenna Interfaces & Frequency Bands ........................................................................ 48 5.1.2. Antenna Tuner Control Interface* .................................................................................. 48 Antenna Tuner Control Interface through GPIOs ............................................... 48 Antenna Tuner Control Interface through RFFE ................................................. 49 5.1.3. Operating Frequency ..................................................................................................... 49 5.1.4. Tx Power ........................................................................................................................ 51 5.1.5. Rx Sensitivity .................................................................................................................. 51 5.2. GNSS ........................................................................................................................................ 55 5.2.1. General Description ....................................................................................................... 55 5.2.2. GNSS Frequency ........................................................................................................... 55 5.2.3. GNSS Performance ....................................................................................................... 55 5.3. Antenna Connectors ................................................................................................................. 56 5.3.1. Antenna Connector Size ................................................................................................ 56 5.3.2. Antenna Connector Location ......................................................................................... 58 5.3.3. Antenna Connector Installation ...................................................................................... 58 5.3.4. Antenna Design Requirements ...................................................................................... 60 6 Electrical Characteristics and Reliability ........................................................................................ 61 6.1. Absolute Maximum Ratings ...................................................................................................... 61 6.2. Power Supply Requirements .................................................................................................... 61 6.3. Power consumption .................................................................................................................. 62 6.4. Digital I/O Characteristics ......................................................................................................... 68 6.5. ESD Protection .......................................................................................................................... 69 6.6. Operating and Storage Temperatures ...................................................................................... 70 6.7. Thermal Dissipation ................................................................................................................ 70 6.8. Notification ................................................................................................................................ 72 6.8.1. Coating ........................................................................................................................... 72 6.8.2. Cleaning ......................................................................................................................... 72 7 Mechanical Information and Packaging .......................................................................................... 73 7.1. Mechanical Dimensions ............................................................................................................ 73 7.2. Top and Bottom Views .............................................................................................................. 74 7.3. M.2 Connector ........................................................................................................................... 75 7.4. Packaging ................................................................................................................................. 75 7.4.1. Blister Tray ..................................................................................................................... 75 EM060K-GL&EM120K-GL_Hardware_Design 6 / 78 7.4.2. Packaging Process ........................................................................................................ 77 8 Appendix References ........................................................................................................................ 78 LTE-A Module Series EM060K-GL&EM120K-GL_Hardware_Design 7 / 78 LTE-A Module Series Table Index Table 1: Special Marks ............................................................................................................................... 14 Table 2: Frequency Bands and GNSS Types of EM060K-GL and EM120K-GL ...................................... 15 Table 3: Key Features ................................................................................................................................ 16 Table 4: Definition of I/O Parameters ......................................................................................................... 20 Table 5: Pin Description ............................................................................................................................. 20 Table 6: Overview of Operating Modes ..................................................................................................... 25 Table 7: Definition of VCC and GND Pins ................................................................................................. 27 Table 8: Pin Definition of FULL_CARD_POWER_OFF# ........................................................................... 29 Table 9: Turn-on Timing of the Module ...................................................................................................... 30 Table 10: Turn-off Timing of the Module .................................................................................................... 31 Table 11: Pin Definition of RESET# ........................................................................................................... 31 Table 12: Reset Timing of the Module ....................................................................................................... 33 Table 13: Pin Definition of (U)SIM Interfaces ............................................................................................ 34 Table 14: Pin Definition of USB Interface .................................................................................................. 39 Table 15: Pin Definition of PCM Interface .................................................................................................. 41 Table 16: Pin Definition of Control and Indication Interfaces..................................................................... 42 Table 17: RF Function Status .................................................................................................................... 43 Table 18: GNSS Function Status ............................................................................................................... 43 Table 19: Network Status Indications of WWAN_LED# ............................................................................ 44 Table 20: State of the WAKE_ON_WAN# ................................................................................................. 45 Table 21: Function of the DPR Signal ........................................................................................................ 46 Table 22: Pin definition of WLAN_PA_EN ................................................................................................. 46 Table 23: Pin Definition of COEX Interface ............................................................................................... 46 Table 24: List of EM060K-GL and EM120K-GLConfiguration Pins ........................................................... 47 Table 25: Pin Definition of EM060K-GL and EM120K-GL Configuration Pins .......................................... 47 Table 26: EM060K-GL and EM120K-GL Pin Definition ............................................................................. 48 Table 27: Pin Definition of Antenna Tuner Control Interface through GPIOs ............................................ 48 Table 28: Pin Definition of Antenna Tuner Control Interface through RFFE ............................................. 49 Table 29: Operating Frequencies of EM060K-GL and EM120K-GL ......................................................... 49 Table 30: EM060K-Gl and EM120K-GL Tx Power .................................................................................... 51 Table 31: EM060K-GL Conducted Rx Sensitivity ...................................................................................... 51 Table 32: EM120K-GL Conducted Rx Sensitivity ...................................................................................... 53 Table 33: GNSS Frequency ....................................................................................................................... 55 Table 34: EM060K-GL and EM120K-GL GNSS Performance .................................................................. 55 Table 35: Major Specifications of the RF Connectors ............................................................................... 57 Table 36: Antenna Requirements of EM060K-Gl and EM120K-GL .......................................................... 60 Table 37: Absolute Maximum Ratings ....................................................................................................... 61 Table 38: Power Supply Requirements ..................................................................................................... 61 Table 39: EM060K-GL Power Consumption (3.7 V Power Supply) .......................................................... 62 Table 40: EM120K-GL Power Consumption (3.7 V Power Supply) .......................................................... 65 Table 41: 1.8 V Digital I/O Requirements) ................................................................................................. 68 EM060K-GL&EM120K-GL_Hardware_Design 8 / 78 LTE-A Module Series Table 42: 3.3 V Digital I/O Requirements .................................................................................................. 68 Table 43: (U)SIM 1.8 V I/O Requirements ................................................................................................. 68 Table 44: (U)SIM 3.0 V I/O Requirements ................................................................................................. 69 Table 45: Electrostatic Discharge Characteristics (Temperature: 25 C, Humidity: 40 %) ....................... 69 Table 46: Operating and Storage Temperatures ....................................................................................... 70 Table 47: Maximum Operating Temperature for Main Chips (Unit: C) .................................................... 71 Table 48: Related Documents .................................................................................................................... 78 Table 49: Terms and Abbreviations ........................................................................................................... 78 EM060K-GL&EM120K-GL_Hardware_Design 9 / 78 LTE-A Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 18 Figure 2: Pin Assignment ........................................................................................................................... 19 Figure 3: DRX Run Time and Power Consumption in Sleep Mode ........................................................... 26 Figure 4: Sleep Mode Application with USB Remote Wakeup .................................................................. 26 Figure 5: Reference Circuit for the Power Supply ..................................................................................... 28 Figure 6: Power Supply Limits during Radio Transmission ....................................................................... 28 Figure 7: Reference Circuit for the VCC .................................................................................................... 29 Figure 8: Turn on the Module with a Host GPIO ........................................................................................ 30 Figure 9: Turn-on Timing of the Module ..................................................................................................... 30 Figure 10: Turn-off Timing through FULL_CARD_POWER_OFF# ........................................................... 31 Figure 11: Reference Circuit for the RESET# with NPN Driver Circuit ..................................................... 32 Figure 12: Reference Circuit for the RESET# with a Button...................................................................... 32 Figure 13: Reset Timing of the Module ...................................................................................................... 33 Figure 14: Reference Circuit for Normally Closed (U)SIM Card Connector .............................................. 36 Figure 15: Reference Circuit for Normally Open (U)SIM Card Connector ................................................ 37 Figure 16: Reference Circuit for a 6-Pin (U)SIM Card Connector ............................................................. 37 Figure 17: Recommended Compatible Design for (U)SIM2 Interface ....................................................... 38 Figure 18: Reference Circuit for the USB 3.0 and 2.0 Interface ................................................................ 39 Figure 19: Primary Mode Timing ................................................................................................................ 41 Figure 20: Auxiliary Mode Timing .............................................................................................................. 41 Figure 21: W_DISABLE1# and W_DISABLE2# Reference Circuit ........................................................... 44 Figure 22: WWAN_LED# Reference Circuit .............................................................................................. 44 Figure 23: WAKE_ON_WAN# Signal Reference Circuit ........................................................................... 45 Figure 24: Recommended Circuit of EM060K-GL and EM120K-GL Configuration Pins .......................... 47 Figure 25: Dimensions of the Receptacle (Unit: mm) ................................................................................ 57 Figure 26: Antenna Connectors on the EM060K-GL and EM120K-GL ..................................................... 58 Figure 27: EM060K-GLandEM120K-GL RF Connector Dimensions (Unit: mm) ...................................... 58 Figure 28: Dimensions of Mated Plugs (0.81 mm Coaxial Cables) (Unit: mm)/ ..................................... 59 Figure 29: Space Factor of Mated Connectors (0.81 mm Coaxial Cables) (Unit: mm) .......................... 59 Figure 30: Space Factor of Mated Connectors ( 1.13 mm Coaxial Cables) (Unit: mm) ......................... 60 Figure 31: Distribution of Heat Source Chips Inside the Module ............................................................... 70 Figure 32: Placement and Fixing of the Heatsink ...................................................................................... 71 Figure 33: Mechanical Dimensions of the Module (Unit: mm) ................................................................... 73 Figure 34: EM060K-GL Top and Bottom Views ......................................................................................... 74 Figure 35: EM120K-GL Top and Bottom Views ......................................................................................... 74 Figure 36: Blister Tray Dimension Drawing ............................................................................................... 76 Figure 37: Packaging Process ................................................................................................................... 77 EM060K-GL&EM120K-GL_Hardware_Design 10 / 78 LTE-A Module Series 1 Introduction The hardware design defines the air and hardware interfaces of EM060K-GL and EM120K-GL which are connected to your applications. This document can help you quickly understand the interface specifications, electrical and mechanical details, as well as other related information of EM060K-GL and EM120K-GL. Besides, Reference design will be offered to facilitate their applications in diverse fields. Coupled with application notes and user guides, you can use the module to design and set up mobile applications easily. Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [EM060K-GL] and

[EM120K-GL] are in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address:

http://www.quectel.com The device could be used with a separation distance of 20cm to the human body. FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2022EM060KGL, XMR2022EM0120KGL. 4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

radiation, maximum antenna gain (including cable loss) FCC Max Antenna GaindBi IC Max Antenna GaindBi EM060K-GL&EM120K-GL_Hardware_Design 11 / 78 LTE-A Module Series must not exceed: Operating Band WCDMA BAND II WCDMA BAND IV WCDMA BAND V LTE BAND 2 LTE BAND 4 LTE BAND 5 LTE BAND 7 LTE BAND 12 LTE BAND 13, 14, 17, 71 LTE BAND 25 LTE BAND 26(814-824) LTE BAND 26(824-849) LTE BAND 30, 38, 41 LTE BAND 66 8.00 8.00 5.00 8.00 8.00 5.00 8.00 5.00 5.00 8.00 8.00 5.00 8.00 8.00 8.00 8.00 5.00 8.00 8.00 5.00 8.00 5.00 5.00 8.00 NA 5.00 8.00 8.00 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: XMR2022EM060KGL or Contains FCC ID: XMR2022EM060KGL and Contains Transmitter Module FCC ID: XMR2022EM120KGL or Contains FCC ID: XMR2022EM120KGLmust be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user EM060K-GL&EM120K-GL_Hardware_Design 12 / 78 LTE-A Module Series that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-22EM060KGL or where: 10224A-22EM060KGL is the modules certification number. Contains IC: 10224A-22EM120KGL or where: 10224A-22EM120KGL is the modules certification number. EM060K-GL&EM120K-GL_Hardware_Design 13 / 78 LTE-A Module Series Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A-22EM060KGL" ou "o: 10224A-22EM060KGL est le numro de certification du module".

"Contient IC: 10224A-22EM120KGL" ou "o: 10224A-22EM120KGL est le numro de certification du module". 1.1. Reference Standard The module complies with the following standards:

PCI Express M.2 Specification Revision 3.0, Version 1.2 PCI Express Base Specification Revision 2.0 Universal Serial Bus Specification, Revision 3.0 MIPI Alliance Specification for RF Front-End Control Interface Version 2.0 3GPP TS 27.007 and 3GPP 27.005 3GPP TS 34.121-1 and 3GPP TS 36.521-1 ISO/IEC 7816-3 1.2. Special Marks Table 1: Special Marks Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of the model is currently unavailable. Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA [0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. EM060K-GL&EM120K-GL_Hardware_Design 14 / 78 LTE-A Module Series 2 Product Overview 2.1. Frequency Bands and Functions EM060K-GL and EM120K-GL are LTE-A/UMTS/HSPA+ wireless communication modules with receive diversity. They provide data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks. They are standard WWAN M.2 Key-B modules. For more details, see PCI Express M.2 Specification Revision 2.0, Version 1.2. They support embedded operating systems such as Windows, Linux and Android, and also provide GNSS and voice functionality 1 to meet specific application demands. The following table shows the frequency bands and GNSS types of the module. And details about CA combinations can be found in document [1] and document [2]. Table 2: Frequency Bands and GNSS Types of EM060K-GL and EM120K-GL Mode Frequency Bands LTE-FDD

(with Rx-diversity) LTE-TDD

(with Rx-diversity) B1/B2/B3/B4/B5/B7/B8/B12/B13/B14 /B17 2/

B18/B19/B20/B25/B26/B28/B29 3/B30/B32 3/B66/B71 B34/B38/B39/B40/B41/B42/B43/B46 3/B48 WCDMA (with Rx-diversity) B1/B2/B3/B4/B5/B6/B8/B19 GNSS GPS; GLONASS; BDS; Galileo The module can be applied in the following fields:

Tablet PC and Laptop Remote Monitor System Wireless POS System 1 The module contains DataVoice* and Data-only version. DataVoice* version supports voice and data functions, while Data-only version only supports data function. 2 B17 is supported through MFBI + B12. 3 LTE-FDD B29/B32 and LTE-TDD B46 support Rx only and are only for secondary component carrier. EM060K-GL&EM120K-GL_Hardware_Design 15 / 78 LTE-A Module Series Smart Metering System Wireless Router and Switch Other Wireless Terminal Devices 2.2. Key Features Table 3: Key Features Feature Details Function Interface PCI Express M.2 Interface Power Supply

(U)SIM Interface Supply voltage: 3.1354.4 V Typical supply voltage: 3.7 V Compliant with ISO/IEC 7816-3 and ETSI and IMT-2000 requirements Supports (U)SIM card: 1.8/3.0 V Supports Dual SIM Single Standby eSIM eSIM function is optional USB Interface Compliant with USB 3.0 and 2.0 specifications, with maximum transmission rates up to 5 Gbps on USB 3.0 and 480 Mbps on USB 2.0. Used for AT command communication, data transmission, firmware Linux 2.6- 5.15 upgrade (USB 2.0 only), software debugging, GNSS NMEA sentence output, and voice over USB*. Supports USB serial drivers:

- Windows 7/8/8.1/10/11;

- Android 4.x-12.x Used for audio function with external codec Supports 16-bit linear data format Supports long and short frame synchronization Supports master and slave modes, but must be the master in long frame PCM Interface*

Rx-diversity LTE/WCDMA synchronization Antenna Interfaces Transmitting Power LTE Features Main, Diversity and GNSS antenna connectors 50 impedance WCDMA: Class 3 (23 dBm 2 dB) LTE-FDD/TDD: Class 3 (23 dBm 2 dB) EM060K-GL Supports 3GPP Rel-12 LTE-FDD and LTE-TDD Supports 1.4/3/5/10/15/20 MHz RF bandwidth EM060K-GL&EM120K-GL_Hardware_Design 16 / 78 LTE-A Module Series

- Supports up to UL Cat 6

- Supports up to DL CA Cat 6 LTE-FDD: Max. 300 Mbps (DL)/50 Mbps (UL) LTE-TDD: Max. 226 Mbps (DL)/28 Mbps (UL) Supports UL QPSK and 16QAM modulation Supports DL QPSK, 16QAM and 64QAM EM120K-GL Supports 3GPP Rel-12 LTE-FDD and LTE-TDD Supports 1.4/3/5/10/15/20 MHz RF bandwidth

- Supports up to UL CA Cat 13

- Supports up to DL CA Cat 12 LTE-FDD: Max. 600 Mbps (DL)/150 Mbps (UL) LTE-TDD: Max. 430 Mbps (DL)/90 Mbps (UL) Supports UL QPSK ,16QAM and 64QAM modulation Supports DL QPSK, 16QAM, 64QAM and 256QAM modulation Supports 3GPP Rel-9 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Supports QPSK, 16QAM and 64QAM modulation DC-HSDPA: Max. 42 Mbps (DL) HSUPA: Max. 5.76 Mbps (UL) WCDMA: Max. 384 kbps (DL)/384 kbps (UL) Supports GPS, GLONASS, BDS and Galileo Data update rate: 1 Hz by default Compliant with 3GPP TS 27.007 and 3GPP TS 27.005 Quectel enhanced AT commands QMI/MBIM/NITZ/HTTP/HTTPS/FTP/LwM2M*/PING*

UMTS Features GNSS Features AT Commands Internet Protocol Features SMS Physical Characteristics Firmware Upgrade Via USB 2.0 or DFOTA Point-to-point MO and MT Text and PDU Modes SMS cell broadcast SMS storage: ME by default M.2 Key-B Size: 30.0 mm 42.0 mm 2.3 mm Weight: approx. 6.2 g Temperature Range Operating temperature range: -25 to +75 C 4 Extended temperature range: -40 to +85 C 5 4 To meet this operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module can meet 3GPP specifications. 5 To meet this extended temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module remains the ability to establish and maintain functions such as voice*, SMS, emergency call* etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may undergo a reduction in value, exceeding the specified tolerances of 3GPP. When the temperature returns to the normal operating temperature level, the module will meet 3GPP specifications again. EM060K-GL&EM120K-GL_Hardware_Design 17 / 78 LTE-A Module Series Storage temperature range: -40 to +90 C All hardware components are fully compliant with EU RoHS directive RoHS 2.3. Functional Diagram The following figure shows a functional diagram of EM060K-GL and EM120K-GL. Power management Baseband LPDDR2 SDRAM+NAND Flash Radio frequency M.2 Key-B interface VCC GND RESET#

FULL_CARD_POWER_OFF#

PMIC e c a f r e t n I

. B

y e K 2 M s s e r p x E I C P USB 2.0 & USB 3.0

(U)SIM1

(U)SIM2 RFFE GPIOs WWAN_LED#

WAKE_ON_WAN#

W_DISABLE1#

W_DISABLE2#

I M P S 2Gb 8 bit NAND Flash 2Gb 32 bit LPDDR2 SDRAM 1 I B E 2 I B E eSIM Baseband 38.4MHz XO z H M 2

. 9 1 K L C _ B B z H M 4

. 8 3 K L C _ F R Qlink Control i r e v e c s n a r T Tx PRx DRx GNSS T P A l s k c o B x R

x T Figure 1: Functional Diagram ANT_MAIN ANT_DRx/GNSS EM060K-GL&EM120K-GL_Hardware_Design 18 / 78 2.4. Pin Assignment The following figure shows the pin assignment of the module. The top side contains module and antenna connectors. LTE-A Module Series Pin Name CONFIG_2 GND GND CONFIG_1 RESET#

ANTCTL3 ANTCTL2 ANTCTL1 ANTCTL0 GND NC NC GND NC NC GND NC NC GND USB_SS_RX_P USB_SS_RX_M GND USB_SS_TX_P USB_SS_TX_M GND DPR WAKE_ON_WAN#

CONFIG_0 Notch Notch Notch Notch GND USB_DM USB_DP GND GND CONFIG_3 No. 75 73 71 69 67 65 63 61 59 57 55 53 51 49 47 45 43 41 39 37 35 33 31 29 27 25 23 21 11 9 7 5 3 1 No. 74 72 70 68 66 64 62 60 58 56 54 52 50 48 46 44 42 40 38 36 34 32 30 28 26 24 22 20 10 8 6 4 2 Pin Name VCC VCC VCC NC USIM1_DET COEX_TXD COEX_RXD WLAN_PA_EN RFFE_DATA RFFE_CLK NC NC NC USIM2_VDD USIM2_RST USIM2_CLK USIM2_DATA USIM2_DET NC USIM1_VDD USIM1_DATA USIM1_CLK USIM1_RST PCM_SYNC W_DISABLE2#

PCM_DOUT PCM_DIN PCM_CLK Notch Notch Notch Notch WWAN_LED#

W_DISABLE1#

FULL_CARD_POWER_OFF#

VCC VCC PIN74 PIN75 BOT TOP PIN10 PIN2 PIN11 PIN1 Figure 2: Pin Assignment EM060K-GL&EM120K-GL_Hardware_Design 19 / 78 LTE-A Module Series 2.5. Pin Description Table 4: Definition of I/O Parameters Type AI AO AIO DI DO DIO OD PI PO PU PD Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Pull Up Pull Down Table 5: Pin Description Pin No. Pin Name I/O Description DC Characteristic Comment 1 2 3 4 5 CONFIG_3 DO Not connected internally VCC PI Power supply GND Ground VCC PI Power supply GND Ground Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V EM060K-GL&EM120K-GL_Hardware_Design 20 / 78 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 LTE-A Module Series FULL_CARD_ POWER_OFF#

DI, PD Turn on/off the module. High level: Turn on Low level: Turn off VIHmax = 4.4 V VIHmin = 1.19 V VILmax = 0.2 V Internally pulled down with a 100 k resistor USB_DP AIO USB differential data (+) W_DISABLE1#* DI, PU Airplane mode control. Active LOW. VIHmin = 1.8 V VILmax = 0.4 V VILmin = -0.4 V USB_DM AIO USB differential data (-) WWAN_LED#* OD RF status indication LED. Active LOW. VCC GND Notch Notch Notch Notch Notch Notch Notch Notch Ground Notch Notch Notch Notch Notch Notch Notch Notch PCM_CLK*

DIO, PD PCM clock 1.8 V CONFIG_0 DO Connected to GND internally PCM_DIN*

DI, PD PCM data input 1.8 V WAKE_ON_ WAN#*

OD Wake up the host. Active LOW. 1.8/3.3 V PCM_DOUT*

DO, PD PCM data output 1.8 V DPR*

DI, PU 1.8 V High level by default. Dynamic power reduction. GNSS disable control. Active LOW. VIHmin = 1.8 V VILmax = 0.4 V VILmin = -0.4 V 26 W_DISABLE2#* DI, PU 27 GND Ground EM060K-GL&EM120K-GL_Hardware_Design 21 / 78 LTE-A Module Series 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 PCM_SYNC*

DIO, PD PCM data frame sync 1.8 V USB_SS_TX_M AO USB 3.0 super-speed transmit (-) USIM1_RST DO, PD

(U)SIM1 card reset USB_SS_TX_P AO USB 3.0 super-speed transmit (+) USIM1_CLK DO, PD

(U)SIM1 card clock GND Ground USIM1_DATA DIO, PD

(U)SIM1 card data USIM1_VDD 1.8/3.0 V USIM1_VDD 1.8/3.0 V USIM1_VDD 1.8/3.0 V USIM1_VDD PO 1.8/3.0 V USB_SS_RX_M AI USB_SS_RX_P AI USB 3.0 super-speed receive (-)

(U)SIM1 card power supply USB 3.0 super-speed receive (+) Not connected Ground Not connected Not connected USIM2_DATA DIO, PD

(U)SIM2 card data USIM2_VDD 1.8/3.0 V USIM2_VDD 1.8/3.0 V USIM2_VDD 1.8/3.0 V USIM2_CLK DO, PD

(U)SIM2 card clock GND Ground USIM2_RST DO, PD

(U)SIM2 card reset NC Not connected USIM2_VDD PO

(U)SIM2 card power supply 1.8/3.0 V NC GND NC NC USIM2_DET*6 DI, PD

(U)SIM2 card detect 1.8 V Internally pulled up to 1.8 V 6 This pin is pulled LOW by default, and will be internally pulled up to 1.8 V by software configuration only when (U)SIM hot-plug is enabled by AT+QSIMDET. See document [1] for details about the AT command. EM060K-GL&EM120K-GL_Hardware_Design 22 / 78 LTE-A Module Series 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 68 69 NC NC GND NC NC NC NC Not connected Not connected Ground Not connected Not connected Not connected Not connected RFFE_CLK 7*

DO, PD Used for external MIPI IC control 1.8 V GND Ground RFFE_DATA 7 * DIO, PD Used for external MIPI IC control 1.8 V ANTCTL0*

DO, PD Antenna GPIO control 1.8 V WLAN_PA_EN* DI, PD Self-protection of QLN control 1.8 V ANTCTL1*

DO, PD Antenna GPIO control 1.8 V COEX_RXD*

DI, PD LTE/WLAN coexistence receive 1.8 V ANTCTL2*

DO, PD Antenna GPIO control 1.8 V COEX_TXD*

DO, PD LTE/WLAN coexistence transmit 1.8 V ANTCTL3*

DO, PD Antenna GPIO control 1.8 V USIM1_DET 8 DI, PD

(U)SIM1 card hot-plug detect 1.8 V Internally pulled up to 1.8 V 8 67 RESET#

DI, PU Reset the module. Active LOW VIHmax = 2.1 V VIHmin = 1.3 V VILmax = 0.5 V Internally pulled up to 1.8 V with a 10 k resistor. NC Not connected CONFIG_1 DO Connected to GND internally 7 If RFFE_CLK and RFFE_DATA is required, please contact Quectel for more details. 8 This pin is pulled low by default, and will be internally pulled up to 1.8 V by software configuration only when (U)SIM hot-plug is enabled by AT+QSIMDET. See document [4] for details about the AT command. EM060K-GL&EM120K-GL_Hardware_Design 23 / 78 LTE-A Module Series 70 VCC PI Power supply for the module Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V 71 GND Ground Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V 72 VCC PI Power supply 73 GND Ground 74 VCC PI Power supply 75 CONFIG_2 DO Not connected internally Keep all NC, reserved and unused pins unconnected. NOTE 2.6. EVB kit To help you develop applications conveniently with EM060K-GL and EM120K-GL, Quectel supplies an evaluation board (5G-M2 EVB). For more details, see document [1]. EM060K-GL&EM120K-GL_Hardware_Design 24 / 78 LTE-A Module Series 3 Operating Characteristics 3.1. Operating Modes The table below summarizes different operating modes of the module. Table 6: Overview of Operating Modes Mode Normal Operation Mode Details Idle Minimum Functionality Mode Airplane Mode Sleep Mode Power Down Mode 3.2. Sleep Mode Software is active. The module has registered on the network, and it is ready to send and receive data. Voice*/Data Network connected. In this mode, the power consumption is decided by network setting and data transfer rate. AT+CFUN=0 command sets the module to a minimum functionality mode without removing the power supply. In this mode, both RF function and

(U)SIM card are invalid. AT+CFUN=4 command or driving W_DISABLE1# pin low will set the module to airplane mode. In this mode, the RF function is invalid. The modules keep receiving paging messages, SMS, voice* calls and TCP/UDP data from the network with its power consumption reduced to the minimal level. In this mode, the power management unit shuts down the power supply. Software is inactive, while all interfaces are inaccessible and the operating voltage (connected to VCC) remains applied. See document [4] for more details about the AT command mentioned above. In sleep mode, DRX of the module is able to reduce the power consumption to a minimum level, and DRX cycle index values are broadcasted by the wireless network. The figure below shows the relationship between the DRX run time and the power consumption in sleep mode. The longer the DRX cycle is, the lower the power consumption will be. EM060K-GL&EM120K-GL_Hardware_Design 25 / 78 LTE-A Module Series n o i t p m u s n o C r e w o P DRX OFF ON OFF ON OFF ON OFF ON OFF Run Time Figure 3: DRX Run Time and Power Consumption in Sleep Mode The following part of this section describes the power saving procedure and sleep mode entrance of the module. If the host supports USB suspend/resume and remote wakeup function, the following two conditions must be realized to bring the module into sleep mode. Execute AT+QSCLK=1 command to enable the sleep mode. See document [4] for more details. The hosts USB bus, which is connected to the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. Module Host USB Interface USB Interface GND GND Figure 4: Sleep Mode Application with USB Remote Wakeup The module and the host will wake up in the following conditions:

Sending data to the module through USB will wake up the module. When module has a URC to report, the module will send remote wake-up signals via USB bus to wake up the host. EM060K-GL&EM120K-GL_Hardware_Design 26 / 78 LTE-A Module Series 3.3. Airplane Mode The module provides a W_DISABLE1# pin to disable or enable airplane mode through hardware operation. See Chapter 4.4 for more details 3.4. Communication Interface with the Host The module supports communicate through USB interfaces:

USB Mode Supports all USB 2.0/3.0 features Supports MBIM/QMI/QRTR/AT USB is the default communication interface between the module and the host. It is suggested that USB 2.0 interface be reserved for firmware upgrade. 3.5. Power Supply 3.5.1. Power Supply Pins Table 7: Definition of VCC and GND Pins Pin No. Pin Name I/O Description Comment 2, 4, 70, 72, 74 VCC PI Power supply 3.1354.4 V 3.7 V typical DC supply 3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73 GND Ground 3.5.2. Reference Design for Power Supply Power design is vital to the module, as the performance of the module largely depends on the power source. If the voltage difference between the input and output is not too high, it is suggested that an LDO be used when supplying power for the module. If there is a big voltage difference between the input source and the desired output (VCC = 3.7 V Typ.), adding a buck DC-DC converter is preferred. The following figure shows a reference design for +5 V input power source based on the DC-DC TPS54319. The typical output of the power supply is about 3.7 V and the maximum load current is 3.0 A. EM060K-GL&EM120K-GL_Hardware_Design 27 / 78 LTE-A Module Series PWR_IN

D1 TVS C1 470 F C2 100 nF C3 33 pF R1 205K R2 80.6K VFB R7 4.7K PWR_EN R3 10K R4 182K Q1 NPN R8 47K C5 NM C4 10 nF C7 10 nF U1 EP VIN VIN VIN EN VSNS COMP RT/CLK SS PH PH PH BOOT PWRGD GND GND AGND L1 1.5 H PWR_OUT C6 100 nF PWRGD

C8 220 F C9 100 nF C10 33 pF C11 10 pF R5 383K 1 %

R6 100K 1 %

VFB Figure 5: Reference Circuit for the Power Supply NOTE To avoid corrupting the data in the internal flash, do not cut off the power supply before the module is completely turned off by pulling down FULL_CARD_POWER_OFF# pin for more than 6.6 s, and do not cut off power supply directly when the module is working. 3.5.3. Voltage Stability Requirements The power supply of the module ranges from 3.135 V to 4.4 V. Please ensure that the input voltage will never drop below 3.135 V, otherwise the module will be powered off automatically. The following figure shows the maximum voltage drop during radio transmission in 3G/4G networks. Burst Transmission Burst Transmission VCC 3.135 V Voltage Drop Voltage Ripple

< 100 mV Figure 6: Power Supply Limits during Radio Transmission Ensure the continuous current capability of the power supply is 2.0 A. To decrease the voltage drop, two bypass capacitors of about 220 F with low ESR (ESR = 0.7 ) should be used. To decrease the power supply being disturbed, a multi-layer ceramic chip capacitor (MLCC) array also should be used due to their ultra-low ESR. It is recommended to use four ceramic capacitors (1 F, 100 nF, 33 pF, 10 pF) for composing the MLCC array, and to place these capacitors close to VCC pins. The width of VCC trace should be no less than 2.5 mm. In principle, the longer the VCC trace is, the wider it should be. In addition, to guarantee the stability of the power supply, please use a TVS with a reverse TVS voltage of EM060K-GL&EM120K-GL_Hardware_Design 28 / 78 5.1 V and a dissipation power higher than 0.5 W. The following figure shows a reference circuit of the VCC. LTE-A Module Series VCC (3.7 V Typ.) Module VCC 2, 4

C2 220 F C4 1 F C6 100 nF C8 33 pF C10 10 pF GND 3, 5, 11 VCC 70, 72, 74 APT PMU GND 27, 33, 39, 45, 51, 57, 71, 73

D1 5.1 V C1 220 F C3 1 F C5 100 nF C7 33 pF C9 10 pF Figure 7: Reference Circuit for the VCC 3.6. Turn on FULL_CARD_POWER_OFF# is used to turn on/off the module. When the input signal is de-asserted high

( 1.19 V), the module will be turned on. When the input signal is driven low ( 0.2 V) or Tri-stated, the module will be turned off. This input signal is 3.3 V tolerant and can be driven by either 1.8 V or 3.3 V GPIO. Also, it has internally pulled down with a 100 k resistor. Table 8: Pin Definition of FULL_CARD_POWER_OFF#

Pin No. Pin Name I/O Description Comment 6 FULL_CARD_ POWER_OFF#

DI, PD Turn on/off the module. High level: Turn on Low level: Turn off Pull down with a 100 k resistor. It is recommended to use a host GPIO to control FULL_CARD_POWER_OFF#. A simple reference circuit is illustrated in the following figure. EM060K-GL&EM120K-GL_Hardware_Design 29 / 78 Host Module 1.8 V or 3.3 V GPIO FULL_CARD_POWER_OFF#

LTE-A Module Series PMU D S 6 G R4 100K NOTE: The voltage of pin 6 should be no less than 1.19 V when it is at HIGH level. Figure 8: Turn on the Module with a Host GPIO The timing of turn-on scenario is illustrated in the following figure. VCC System turn-on and booting FULL_CARD_POWER_OFF #

USB 2.0 or USB 3.0 Module Status Inactive System booting Waiting for network registration T1 T2 Figure 9: Turn-on Timing of the Module Table 9: Turn-on Timing of the Module Symbol Min. Typ. Max. Comment T1 T2 0 ms

Module power-on time

5.9 s System booting

3.7. Turn off For the design that turns off the module with a host GPIO, when the power is supplied to VCC, pulling down FULL_CARD_POWER_OFF# pin will turn off the module. The timing of turn-off scenario is illustrated in the following figure. EM060K-GL&EM120K-GL_Hardware_Design 30 / 78 LTE-A Module Series VCC FULL_CARD_ POWER_OFF#

Module Status Running Turn-off procedure OFF T1 Figure 10: Turn-off Timing through FULL_CARD_POWER_OFF#

Table 10: Turn-off Timing of the Module Symbol Min. Typ. Max. Comment T1 6.5 s 6.6 s

Module system turn-off time. 3.8. Reset The RESET# pin is used to reset the module. The module can be reset by driving RESET# low for 250600 ms. Table 11: Pin Definition of RESET#

Pin No. Pin Name I/O Description Comment 67 RESET#

DI, PU Reset the module Active LOW. Internally pulled up to 1.8 V with a 10 k resistor. NOTE Triggering the RESET# signal will lead to loss of all data in the modem and removal of system drivers. It will also detach the modem from the network. The module can be reset by pulling down the RESET# pin for 250600 ms. An open collector/drain driver or a button can be used to control the RESET# pin. EM060K-GL&EM120K-GL_Hardware_Design 31 / 78 Host Reset pulse GPIO RESET#

67 R1 1K Q1 NPN R2 1K R3 100K 250600 ms LTE-A Module Series Module Reset Logic 1.8 V R4 10K Figure 11: Reference Circuit for the RESET# with NPN Driver Circuit Module Reset Logic 1.8 V R4 10K S1 TVS C1 33 pF RESET#

67 R1 1K 250600 ms NOTE: The capacitor C1 is recommended to be less than 47 pF. Figure 12: Reference Circuit for the RESET# with a Button The timing of reset scenario is illustrated in the following figure. EM060K-GL&EM120K-GL_Hardware_Design 32 / 78 LTE-A Module Series VCC RESET#

Module Status Running Resetting Restarting T Figure 13: Reset Timing of the Module Table 12: Reset Timing of the Module Symbol Min. Typ. Max. Comment T 250 ms 500 ms 600 ms RESET# should be pulled down for 250600 ms. An asserting time of less than 200 ms is unreliable, while that of higher than 600 ms will cause repeated reset. EM060K-GL&EM120K-GL_Hardware_Design 33 / 78 LTE-A Module Series 4 Application Interfaces 4.1. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements and ISO/IEC 7816-3. Both Class B

(3.0 V) and Class C (1.8 V) (U)SIM cards are supported, and Dual SIM Single Standby function is supported. 4.1.1. Pin definition of (U)SIM Table 13: Pin Definition of (U)SIM Interfaces Pin No. Pin Name Description Comments USIM1_VDD

(U)SIM1 card power supply 1.8/3.0 V I/O PO USIM1_DATA DIO, PD

(U)SIM1 card data USIM1_CLK DO, PD

(U)SIM1 card clock USIM1_RST DO, PD

(U)SIM1 card reset USIM1_DET DI, PD

(U)SIM1 card hot-plug detect 1.8 V USIM2_DET*

DI, PD

(U)SIM2 card hot-plug detect 1.8 V USIM2_DATA DIO, PD

(U)SIM2 card data USIM2_CLK DO, PD

(U)SIM2 card clock USIM2_RST DO, PD

(U)SIM2 card reset USIM1_VDD 1.8/3.0 V USIM2_VDD 1.8/3.0 V USIM2_VDD PO

(U)SIM2 card power supply 1.8/3.0 V 36 34 32 30 66 40 42 44 46 48 NOTE USIM1_DET and USIM2_DET are pulled low by default, and will be internally pulled up to 1.8 V by EM060K-GL&EM120K-GL_Hardware_Design 34 / 78 LTE-A Module Series software configuration only when (U)SIM hot-plug is enabled by AT+QSIMDET. See document [4] for more details about the AT command mentioned above. 4.1.2.

(U)SIM Hot-Plug The module supports (U)SIM card hot-plug via (U)SIM card hot-plug detection pins (USIM1_DET and USIM2_DET). (U)SIM card insertion is detected by high/low level, and (U)SIM card hot-plug is disabled by default. The following commands enables (U)SIM card hot-plug function. AT+QSIMDET (U)SIM Card Detection

(list of supported <enable>s),(list of Test Command AT+QSIMDET=?

Read Command AT+QSIMDET?

Write Command AT+QSIMDET=<enable>,<insert_level>

Response

+QSIMDET:

supported <insert_level>s) OK Response

+QSIMDET: <enable>,<insert_level>

OK Response OK If there is any error:

ERROR 300 ms Maximum Response Time Characteristics The command takes effect after the module is restarted. The configuration will be saved to NVRAM automatically. Parameter

<insert_level>

<enable>

Integer type. Enable or disable (U)SIM card detection. 0 Disable 1 Enable Integer type. The level of (U)SIM detection pin when a (U)SIM card is inserted. 0 Low level 1 High level EM060K-GL&EM120K-GL_Hardware_Design 35 / 78 LTE-A Module Series NOTE design. 1. Hot-plug function is invalid if the configured value of <insert_level> is inconsistent with hardware 2. The underlined value is the default parameter value. 3. USIM1_DET and USIM2_DET are pulled low by default, and will be internally pulled up to 1.8 V by software configuration only when (U)SIM hot-plug is enabled by AT+QSIMDET. 4.1.3. Normally Closed (U)SIM Card Connector With a normally closed (U)SIM card connector, USIM_DET pin is normally shorted to ground when there is no (U)SIM card inserted. (U)SIM card detection by high level is applicable to this type of connector. After executing AT+QSIMDET=1,1 to enable the (U)SIM hot-plug: when a (U)SIM card is inserted, USIM_DET will change from low to high level; when the (U)SIM card is removed, USIM_DET will change from high to low level. When the (U)SIM is absent, CD is short-circuited to ground and USIM_DET is at low level. When the (U)SIM is present, CD is open from ground and USIM_DET is at high level. The following figure shows a reference design of (U)SIM interface with a normally closed (U)SIM card connector. Module USIM_VDD 10-20K 100 nF

(U)SIM Card Connector VPP USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA GND 22R 22R 22R VCC RST CLK CD IO GND F p 3 3 F p 3 3 F p 3 3 TVS array NOTE: All these resistors, capacitors and ESD should be close to (U)SIM card connector in PCB layout. Figure 14: Reference Circuit for Normally Closed (U)SIM Card Connector 4.1.4. Normally Open (U)SIM Card Connector With a normally open (U)SIM card connector, CD1 and CD2 of the connector are disconnected when there is no (U)SIM card inserted. (U)SIM card detection by low level is applicable to this type of connector. After executing AT+QSIMDET=1,0 to enable the (U)SIM hot-plug function: when a (U)SIM card is inserted, USIM_DET will decrease from high to low level; when the (U)SIM card is removed, USIM_DET will increase from low to high level. EM060K-GL&EM120K-GL_Hardware_Design 36 / 78 LTE-A Module Series When the (U)SIM is absent, CD1 is open from CD2 and USIM_DET is at high level. When the (U)SIM is inserted, CD1 is short-circuited to ground and USIM_DET is at low level. The following figure shows a reference design of (U)SIM interface with a normally open (U)SIM card connector. Module USIM_VDD USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA GND 22R 22R 22R 10-20k 100 nF F p 3 3 F p 3 3 F p 3 3 TVS array

(U)SIM Card Connector VPP CD2 VCC RST CLK CD1 IO GND NOTE:

All these resistors, capacitors and ESD should be close to (U)SIM card connector in PCB layout. 0R Figure 15: Reference Circuit for Normally Open (U)SIM Card Connector 4.1.5.

(U)SIM Card Connector Without Hot-Plug If the (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for the (U)SIM card interface with a 6-pin (U)SIM card connector is illustrated by the following figure. Module USIM_VDD 10-20K 100 nF

(U)SIM Card Connector VPP USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA GND 22R 22R 22R VCC RST CLK IO GND F p 3 3 F p 3 3 F p 3 3 TVS array Note: All these resistors, capacitors and TVS array should be close to (U)SIM card connector in PCB layout. Figure 16: Reference Circuit for a 6-Pin (U)SIM Card Connector EM060K-GL&EM120K-GL_Hardware_Design 37 / 78 LTE-A Module Series 4.1.6.

(U)SIM2 Card Connector The module provides two (U)SIM interfaces. (U)SIM1 interface is used for external (U)SIM card only, and

(U)SIM2 interface is used for external (U)SIM card or internal eSIM card. It should be noted that when the (U)SIM2 interface is used for an external (U)SIM card, the circuits are the same as those of (U)SIM1 interface. When the (U)SIM2 interface is used for the internal eSIM card, pins 40, 42, 44, 46 and 48 of the module must be kept open. A recommended compatible design for the (U)SIM2 interface is shown below. Module USIM2_VDD 10-20K 100 nF

(U)SIM Card Connector VPP USIM2_VDD USIM2_RST USIM2_CLK USIM2_DET USIM2_DATA 48 46 44 40 42 0 0 0 0 0 22 22 22 eSIM GND VCC RST CLK CD IO GND 33 pF33 pF33 pF TVS array Note: The five 0 resistors must be close to M.2 socket connector, and all other components should be close to (U)SIM card connector in PCB layout. Figure 17: Recommended Compatible Design for (U)SIM2 Interface 4.1.7.

(U)SIM Design Notices To enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design. Place the (U)SIM card connector as close to the module as possible. Keep the trace length less than 200 mm. Keep (U)SIM card signals away from RF and VCC traces. Ensure the ground between the module and the (U)SIM card connector is short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5 mm to maintain the same electric potential. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. To offer better ESD protection, add a TVS array of which the parasitic capacitance should be not higher than 10 pF. Add 22 resistors in series between the module and the (U)SIM card connector to suppress EMI such as spurious transmission. The 33 pF capacitors are used to filter out RF interference. Additionally, keep the (U)SIM peripheral circuit close to the (U)SIM card connector. For USIM_DATA, a 1020 k pull-up resistor must be added near the (U)SIM card connector. EM060K-GL&EM120K-GL_Hardware_Design 38 / 78 LTE-A Module Series 4.2. USB Interface The module provides one integrated Universal Serial Bus (USB) interface which complies with the USB 3.0 and 2.0 specifications and supports super speed (5 Gbps) on USB 3.0 and high speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, GNSS NMEA sentence output, software debugging, firmware upgrade (USB 2.0 only), and voice over USB*. 7 9 29 31 35 37 Table 14: Pin Definition of USB Interface Pin No. Pin Name I/O Description Comment USB_DP AIO USB differential data (+) USB_DM AIO USB differential data (-) USB_SS_TX_M AO USB 3.0 super-speed transmit (-) USB_SS_TX_P AO USB 3.0 super-speed transmit (+) Require differential impedance of 90 USB_SS_RX_M AI USB 3.0 super-speed receive (-) USB_SS_RX_P AI USB 3.0 super-speed receive (+) For more details about the USB 3.0 and 2.0 specifications, please visit http://www.usb.org/home. The following figure presents a reference circuit for the USB 3.0 and 2.0 interface. C5 100 nF C6 100 nF Host USB_SS_TX_P USB_SS_TX_M USB_SS_RX_P USB_SS_RX_M USB_DM USB_DP Module C1 100 nF C2 100 nF BB USB_SS_RX_P USB_SS_RX_M USB_SS_TX_P USB_SS_TX_M R1 0 USB_DM R2 0 USB_DP 37 35 31 29 9 7 Test Points R3 NM-0 R4 NM-0 TVS array Minimize these stubs in PCB layout. Figure 18: Reference Circuit for the USB 3.0 and 2.0 Interface EM060K-GL&EM120K-GL_Hardware_Design 39 / 78 LTE-A Module Series AC coupling capacitors C5 and C6 must be placed close to the host and close to each other. C1 and C2 have been integrated inside the module, so do not place these two capacitors on your schematic and PCB. To ensure the signal integrity of USB 2.0 data traces, R1, R2, R3 and R4 must be placed close to the module, and the stubs must be minimized in PCB layout. Please follow the principles below when designing for the USB interface to meet USB 3.0 and 2.0 specifications:

Route the USB signal traces as differential pairs with ground surrounded. The impedance of differential trace of USB 2.0 and USB 3.0 is 90 . For USB 2.0 signal traces, the trace length should be less than 120 mm, and the differential data pair matching should be less than 2 mm. For USB 3.0 signal traces, length matching of each differential data pair (Tx/Rx) should be less than 0.7 mm, while the matching between Tx and Rx should be less than 10 mm. Do not route signal traces under crystals, oscillators, magnetic devices, other high-speed and RF signal traces. Route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. Junction capacitance of the ESD protection device might cause influences on USB data lines, so you should pay attention to the selection of the device. Typically, the stray capacitance should be less than 1.0 pF for USB 2.0, and less than 0.15 pF for USB 3.0. Keep the ESD protection devices as close to the USB connector as possible. If possible, reserve 0 resistors on USB_DP and USB_DM traces respectively. 4.3. PCM Interface*

The module supports audio communication with external codec via Pulse Code Modulation (PCM) digital interface. The PCM interface supports the following modes:

Primary mode (short frame synchronization): the module works as both master and slave Auxiliary mode (long frame synchronization): the module works as master only In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256 kHz, 512 kHz, 1024 kHz or 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4096 kHz PCM_CLK at 16 kHz PCM_SYNC. In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a 256 kHz PCM_CLK and an 8 kHz, 50 % duty cycle PCM_SYNC only. The module supports 16-bit linear data format. The following figures show the primary modes timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary modes timing EM060K-GL&EM120K-GL_Hardware_Design 40 / 78 LTE-A Module Series relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK. 125 s PCM_CLK 1 2 255 256 PCM_SYNC PCM_DOUT PCM_DIN MSB LSB MSB MSB LSB MSB Figure 19: Primary Mode Timing 125 s PCM_CLK 1 2 31 32 PCM_SYNC PCM_DOUT PCM_DIN MSB MSB LSB LSB Figure 20: Auxiliary Mode Timing The following table shows the pin definition of PCM interface which can be applied to audio codec design. Table 15: Pin Definition of PCM Interface Pin No. Pin Name I/O Description Comments 20 22 PCM_CLK DIO, PD PCM clock PCM_DIN DI, PD PCM data input 1.8 V 1.8 V EM060K-GL&EM120K-GL_Hardware_Design 41 / 78 LTE-A Module Series 24 28 10 23 25 PCM_DOUT DO, PD PCM data output 1.8 V PCM_SYNC DIO, PD PCM data frame sync 1.8 V The clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. See document [4] for details about AT+QDAI command. 4.4. Control and Indication Interfaces*

Table 16: Pin Definition of Control and Indication Interfaces Pin No. Pin Name I/O Description 8 W_DISABLE1#

DI, PU WWAN_LED#

OD WAKE_ON_WAN#

OD DPR DI, PU 26 W_DISABLE2#

DI, PU Airplane mode control. Active LOW. RF status indication LED. Active LOW. Wake up the host. Active LOW. Dynamic power reduction. High voltage level by default. GNSS disable control. Active LOW. Comments VIHmin = 1.8 V VILmax = 0.4 V VILmin = -0.4 V VCC 1.8/3.3V 1.8 V VIHmin = 1.8 V VILmax = 0.4 V VILmin = -0.4 V 60 WLAN_PA_EN DI Self-protection of QLN control 1.8V 4.4.1. W_DISABLE1#

The module provides a W_DISABLE1# pin to disable or enable airplane mode through hardware operation. W_DISABLE1# is pulled up by default. Driving it low will set the module to airplane mode. In airplane mode, the RF function will be disabled. The RF function can also be enabled or disabled through software AT commands. The following table shows the RF function status of the module. EM060K-GL&EM120K-GL_Hardware_Design 42 / 78 LTE-A Module Series Table 17: RF Function Status W_DISABLE#

Logic Level AT Command RF Function Status Operating Modes AT+CFUN=1 Enabled Full functionality mode High Level AT+CFUN=0 Disabled Minimum functionality mode AT+CFUN=4 Disabled Airplane mode Low Level Disabled Airplane mode AT+CFUN=0 AT+CFUN=1 AT+CFUN=4 4.4.2. W_DISABLE2#

The module provides a W_DISABLE2# pin to disable or enable the GNSS function. The W_DISABLE2#

pin is pulled up by default. Driving it low will disable the GNSS function. The combination of W_DISABLE2# pin and AT commands can control the GNSS function. Table 18: GNSS Function Status W_DISABLE2# Level AT Commands GNSS Function Status High Level AT+QGPS=1 Enabled High Level AT+QGPSEND Low Level Low Level AT+QGPS=1 Disabled AT+QGPSEND A simple level shifter based on diodes is used on W_DISABLE1# pin and W_DISABLE2# pin which are pulled up to a 1.8 V voltage in the module, as shown in the following figure. So, the control signals (GPIO) of the host device could be at 1.8 V or 3.3 V voltage level. W_DISABLE1# and W_DISABLE2# are active low signals, and a reference circuit is shown as below. EM060K-GL&EM120K-GL_Hardware_Design 43 / 78 LTE-A Module Series H ost V C C _IO _H O S T R 5 10K R 6 10K G P IO G P IO M odule V D D 1.8 V R 2 100K R 3 100K B B W _D IS A B LE 2#

W _D IS A B LE 1#

26 8 N O T E : T he voltage level of V C C _IO _H O S T could be 1.8 V or 3.3 V typically. Figure 21: W_DISABLE1# and W_DISABLE2# Reference Circuit 4.4.3. WWAN_LED#

The WWAN_LED# signal is used to indicate RF status of the module, and its sink current is up to 10 mA. To reduce power consumption of the LED, a current-limited resistor must be placed in series with the LED, as illustrated in the figure below. The LED is ON when the WWAN_LED# signal is at low level. Module VCC 2, 4 70, 72, 74 VCC (Typ. 3.7 V) R1 330 LED1 WWAN_LED#

10 PMU Figure 22: WWAN_LED# Reference Circuit The following table shows the RF status indicated by WWAN_LED#. Table 19: Network Status Indications of WWAN_LED#

WWAN_LED# Level Description Low Level (LED On) RF function is turned on EM060K-GL&EM120K-GL_Hardware_Design 44 / 78 LTE-A Module Series High Level (LED Off) RF function is turned off if any of the following occurs:

The (U)SIM card is not powered. W_DISABLE1# is at low level (airplane mode enabled). AT+CFUN=4 (RF function disabled). 4.4.4. WAKE_ON_WAN#

The WAKE_ON_WAN# is an open drain pin, which requires a pull-up resistor on the host. When a URC returns, a 1 s low level pulse signal will be outputted to wake up the host. The module operation status indicated by WAKE_ON_WAN# is shown below. Table 20: State of the WAKE_ON_WAN#

WAKE_ON_WAN# State Module Operation Status Output a 1 s low level pulse signal Call/SMS/Data is incoming (to wake up the host) Always at high level Idle/Sleep Host Module GPIO WAKE_ON_WAN#

23 BB VCC_IO_HOST R1 10K H L 1 s Wake up the host NOTE: The voltage level on VCC_IO_HOST relies on the host side due to the open drain in pin 23. Figure 23: WAKE_ON_WAN# Signal Reference Circuit 4.4.5. DPR The module provides the DPR pin for body SAR detection. The signal is sent from a host system proximity sensor to the module to provide an input trigger, which will reduce the output power in radio transmission. EM060K-GL&EM120K-GL_Hardware_Design 45 / 78 LTE-A Module Series Table 21: Function of the DPR Signal DPR Level Function High/Floating Max transmitting power will NOT backoff. Max transmitting power backoff by SAR efs file configure. Low 4.4.6. WLAN_PA_EN In LTE mode, WLAN_PA_EN is set to 0 (low level) by default. QLN enables self-protection circuit (integrated inside QLN) when WLAN_PA_EN is at HIGH level. When WLAN_PA_EN is set to 1 (high level), the LNA will be in self-protection mode. Table 22: Pin definition of WLAN_PA_EN Pin No. Pin Name I/O Description Comment 60 WLAN_PA_EN DI, PD Self-protection of QLN control 1.8 V power domain 4.5. Cellular/WLAN COEX Interface*

The module provides the cellular/WLAN COEX interface, the following table shows the pin definition of this interface. Table 23: Pin Definition of COEX Interface Pin No. Pin Name I/O Description Comment COEX_RXD DI, PD LTE/WLAN coexistence receive 1.8 V COEX_TXD DO, PD LTE/WLAN coexistence transmit 1.8 V 62 64 EM060K-GL&EM120K-GL_Hardware_Design 46 / 78 21 69 75 1 LTE-A Module Series 4.6. Configuration Pins Table 24: List of EM060K-GL and EM120K-GLConfiguration Pins Config_0

(Pin 21) Config_1

(Pin 69) Config_2

(Pin 75) Config_3

(Pin 1) Module Type and Main Host Interface Port Configuration GND GND NC NC WWANUSB3.0 2 Table 25: Pin Definition of EM060K-GL and EM120K-GL Configuration Pins Pin No. Pin Name I/O Description Comment CONFIG_0 DO Connected to GND internally CONFIG_1 DO Connected to GND internally CONFIG_2 DO Not connected internally CONFIG_3 DO Not connected internally The following figure shows a reference circuit for these four pins. Host VCC_IO_HOST Module R1 100K R2 100K R3 100K R4 100K GPIO GPIO GPIO GPIO CONFIG_0 CONFIG_1 0 0 CONFIG_2 NM-0 CONFIG_3 NM-0 21 69 75 1 NOTE: The voltage level VCC_IO_HOST depends on the host side, and could be a 1.8 V or 3.3 V voltage level. Figure 24: Recommended Circuit of EM060K-GL and EM120K-GL Configuration Pins EM060K-GL&EM120K-GL_Hardware_Design 47 / 78 LTE-A Module Series 5 Antenna Interfaces 5.1. Cellular Network 5.1.1. Antenna Interfaces & Frequency Bands The module provides Main, Rx-diversity/GNSS antenna connectors which are used to resist the fall of signals caused by high-speed movement and multipath effect. The impedance of antenna ports is 50 . Table 26: EM060K-GL and EM120K-GL Pin Definition Pin Name I/O Description Comment ANT0 AIO 50 impedance Main Antenna interface:

LTE: TRx WCDMA: TRx Rx-diversity/GNSS Antenna interface:

LTE: DRx WCDMA: DRx GNSS:

GPS/GLONASS/Galileo/BDS ANT1 AI 50 impedance 5.1.2. Antenna Tuner Control Interface*

ANTCTL [0:3] and RFFE interface are used for antenna tuner control and should be routed to an appropriate antenna control circuit. More details about the interface will be added in the future version of this document. 5.1.2.1. Antenna Tuner Control Interface through GPIOs Table 27: Pin Definition of Antenna Tuner Control Interface through GPIOs Pin No. Pin Name I/O Description Comment 59 ANTCTL0 DO, PD Antenna GPIO Control 1.8 V EM060K-GL&EM120K-GL_Hardware_Design 48 / 78 ANTCTL1 DO, PD ANTCTL2 DO, PD ANTCTL3 DO, PD LTE-A Module Series 1.8 V 1.8 V 1.8 V 5.1.2.2. Antenna Tuner Control Interface through RFFE Table 28: Pin Definition of Antenna Tuner Control Interface through RFFE Pin No. Pin Name I/O Description Comment RFFE_CLK DO, PD Used for external MIPI IC control 1.8 V RFFE_DATA DIO, PD Used for external MIPI IC control 1.8 V 61 63 65 56 58 NOTE If RFFE_CLK and RFFE_DATA is required, please contact Quectel for more details. 5.1.3. Operating Frequency Table 29: Operating Frequencies of EM060K-GL and EM120K-GL 3GPP Band Transmit Receive WCDMA B1 19201980 21102170 WCDMA B2 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 WCDAM B19 18501910 17101785 17101755 824849 830840 880915 830845 19301990 18051880 21102155 869894 875885 925960 875890 LTE-FDD B1 19201980 21102170 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz EM060K-GL&EM120K-GL_Hardware_Design 49 / 78 LTE-A Module Series LTE-FDD B2 18501910 19301990 LTE-FDD B3 17101785 18051880 LTE-FDD B4 17101755 21102155 LTE-FDD B5 824849 869894 LTE-FDD B7 25002570 26202690 925960 729746 746756 758768 734746 860875 875890 791821 859894 758803 717728 23502360 14521496 21102200 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B26 LTE-FDD B28 LTE-FDD B29 9 LTE-FDD B32 9 880915 699716 777787 788798 704716 815830 830845 832862 814849 703748

LTE-FDD B25 18501915 19301995 LTE-FDD B30 23052315 LTE-FDD B66 17101780 LTE-FDD B71 663-698 617-652 LTE-TDD B34 2010-2025 2010-2025 LTE-TDD B38 25702620 25702620 LTE-TDD B39 18801920 18801920 LTE-TDD B40 23002400 23002400 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHZ MHZ MHz MHz MHz EM060K-GL&EM120K-GL_Hardware_Design 50 / 78 LTE-A Module Series LTE-TDD B41 24962690 24962690 LTE-TDD B42 34003600 LTE-TDD B43 36003800 LTE-TDD B46 9

LTE-TDD B48 35503700 34003600 36003800 51505925 35503700 MHz MHz MHz MHz MHz 5.1.4. Tx Power Table 30: EM060K-Gl and EM120K-GL Tx Power Frequency Bands Modulation Max. Min. Comment WCDMA BPSK 23 dBm 2 dB

< -50 dBm

LTE-FDD QPSK 23 dBm 2 dB

< -40 dBm 10 MHz, 1RB LTE-TDD QPSK 23 dBm 2 dB

< -40 dBm 10 MHz, 1RB 5.1.5. Rx Sensitivity Table 31: EM060K-GL Conducted Rx Sensitivity Frequency Bands Primary Diversity SIMO10 Comment 11 3GPP (SIMO)

(dBm) WCDMA B1

-108.5

-109.5

-111.5

-106.7 WCDMA B2

-108.5

-109.5

-111.5

-104.7 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8

-109

-108

-110.5

-110.5

-111

-109

-112

-103.7

-108.5

-111

-106.7

-111

-111

-113

-104.7

-113

-106.7

-111.5

-114

-103.7 9 LTE-FDD B29/32 and LTE-TDD B46 support Rx only and are only for secondary component carrier. 10 SIMO is a smart antenna technology that uses a single antenna at the transmitter side and multiple antennas at the receiver side, which can improve Rx performance. 11 The RB configuration follows 3GPP specification. EM060K-GL&EM120K-GL_Hardware_Design 51 / 78 WCDMA B19

-110.5

-111

-113

-106.7 LTE-FDD B1

-96.5

-98

-100

-96.3 LTE-A Module Series 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz LTE-FDD B7

-96.5

-97.5

-99.5

-94.3 LTE-FDD B8

-99

-99

-101.5

-93.3 LTE-FDD B12

-98.5

-99.5

-102

-93.3

-97.5

-100

-94.3

-97.5

-100.5

-93.3

-97

-99

-99.5

-96.3

-101.5

-94.3

-99.5

-99.5

-102

-93.3

-102

-93.3

-99.5

-101.5

-93.3

-99

-99

-98

-101.5

-96.3

-101.5

-96.3

-101

-93.3

-97.5

-100

-92.8

-99

-101.5

-93.8

-99.5

-102.5

-94.8 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28

-97

-98

-97

-99

-99

-99

-98.5

-98.5

-98.5

-99

-97

-98.5

-99.5

-98.5

-95

-98

-97

-99 LTE-FDD B29 12

-98.5

-101

-93.3 LTE-FDD B30

-96.5

-98.5

-95.3 LTE-FDD B32 12

-96.5

-100

-96.3 LTE-FDD B66 LTE-FDD B71

-97

-99.5

-95.8

-98.5

-101.5

-94.3 LTE-TDD B34

-97.5

-98

-100.5

-96.3 12 The test results are based on CA_2A-29A, CA_20A-32A and CA_46A-66A. EM060K-GL&EM120K-GL_Hardware_Design 52 / 78 LTE-A Module Series LTE-TDD B41

-97

-97

-99.5

-94.3

-97.5

-97.5

-95.5

-97.5

-97.5

-97.5

-99.5

-96.3

-97

-99.5

-96.3

-95.5

-98.5

-96.3

-98.5

-100.5

-95.0

-98.5

-100.5

-95.0 LTE-TDD B46 12

-93

-95.5

-88.5 LTE-TDD B48

-97.5

-100.5

-95.0

-92

-98 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 20 MHz 10 MHz Table 32: EM120K-GL Conducted Rx Sensitivity Frequency Bands Primary Diversity SIMO13 3GPP (SIMO)

(dBm) Comment 14 WCDMA B1

-108.5

-109.5

-111.5

-106.7 WCDMA B2

-108.5

-109.5

-111.5

-104.7

-109

-112

-103.7

-108.5

-111

-106.7

-111

-111

-111

-98

-113

-113

-113

-100

-104.7

-106.7

-106.7

-96.3 10 MHz

-97.5

-100

-94.3 10 MHz

-97.5

-100.5

-93.3 10 MHz

-97

-99.5

-96.3 10 MHz

-109

-108

-110.5

-110.5

-97

-98

-97 WCDMA B8

-111

-111.5

-114

-103.7 WCDMA B19

-110.5 LTE-FDD B1

-96.5 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40 LTE-TDD B42 LTE-TDD B43 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B6 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 13 SIMO is a smart antenna technology that uses a single antenna at the transmitter side and multiple antennas at the receiver side, which can improve Rx performance. 14 The RB configuration follows 3GPP specification. EM060K-GL&EM120K-GL_Hardware_Design 53 / 78 LTE-FDD B12

-98.5 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28 LTE-FDD B66 LTE-FDD B71 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40 LTE-TDD B42 LTE-TDD B43

-99

-96.5

-99

-99

-99

-98.5

-98.5

-98.5

-99

-97

-98.5

-99.5

-95

-98

-97

-99

-97.5

-97.5

-97.5

-95.5

-97.5

-97.5 LTE-A Module Series

-99

-101.5

-94.3 10 MHz

-97.5

-99.5

-94.3 10 MHz

-99

-101.5

-93.3 10 MHz

-99.5

-99.5

-102

-102

-93.3

-93.3 10 MHz 10 MHz

-99.5

-102

-93.3 10 MHz

-99.5

-101.5

-93.3 10 MHz

-99

-99

-98

-97.5

-101.5

-96.3 10 MHz

-101.5

-96.3 10 MHz

-101

-100

-93.3 10 MHz

-92.8 10 MHz

-99

-101.5

-93.8 10 MHz

-99.5

-102.5

-94.8 10 MHz

-97

-99.5

-95.8 10 MHz

-98.5

-101.5

-94.3 10 MHz

-98

-100.5

-96.3 10 MHz

-97.5

-99.5

-96.3 10 MHz

-97

-99.5

-96.3 10 MHz

-95.5

-98.5

-96.3 10 MHz

-98.5

-100.5

-95.0 10 MHz

-98.5

-100.5

-95.0 10 MHz LTE-FDD B29 12

-98.5

-98.5

-101

-93.3 10 MHz LTE-FDD B30

-96.5

-98.5

-95.3 10 MHz LTE-FDD B32 12

-96.5

-100

-96.3 10 MHz LTE-TDD B41

-97

-97

-99.5

-94.3 10 MHz EM060K-GL&EM120K-GL_Hardware_Design 54 / 78 LTE-TDD B46 12

-93

-95

-88.5 20 MHz LTE-TDD B48

-97.5

-100.5

-95.0 10 MHz

-92

-98 LTE-A Module Series 5.2. GNSS 5.2.1. General Description The module includes a fully integrated global navigation satellite system solution. The module supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, the module GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, see document [5]. 5.2.2. GNSS Frequency Table 33: GNSS Frequency Type Frequency GPS/Galileo 1575.42 1.023 GLONASS 1601.65 4.15 1561.098 2.046 BDS 5.2.3. GNSS Performance Unit MHz MHz MHz Table 34: EM060K-GL and EM120K-GL GNSS Performance Parameter Description Conditions Sensitivity

(GNSS) Cold start Autonomous Reacquisition Autonomous Tracking Autonomous TTFF Cold start Autonomous Typ.

-146

-158

-158 35 Unit dBm dBm dBm s EM060K-GL&EM120K-GL_Hardware_Design 55 / 78

(GNSS)

@ open sky Warm start

@ open sky Hot start

@ open sky CEP-50 XTRA enabled Autonomous XTRA enabled Autonomous XTRA enabled Autonomous

@ open sky LTE-A Module Series 13 23 3 2 2 2 s s s s s m Accuracy

(GNSS) NOTE 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock positioning for at least 3 minutes continuously). within 3 minutes after the loss of lock. 3. Cold start sensitivity: the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command. 5.3. Antenna Connectors 5.3.1. Antenna Connector Size Standard 2 mm 2 mm receptacle antenna connectors are mounted for convenient antenna connection. The antenna connectors PN is IPEX 20449-001E, and the connector dimensions are illustrated as below:

EM060K-GL&EM120K-GL_Hardware_Design 56 / 78 LTE-A Module Series Figure 25: Dimensions of the Receptacle (Unit: mm) Table 35: Major Specifications of the RF Connectors Item Specification Nominal Frequency Range DC to 6 GHz Nominal Impedance 50 Temperature Rating

-40 to +85 C Voltage Standing Wave Ratio (VSWR) Meet the requirements of:

Max. 1.3 (DC3 GHz) Max. 1.4 (36 GHz) EM060K-GL&EM120K-GL_Hardware_Design 57 / 78 5.3.2. Antenna Connector Location The antenna connector locations are shown below. LTE-A Module Series Figure 26: Antenna Connectors on the EM060K-GL and EM120K-GL 5.3.3. Antenna Connector Installation The 2 mm 2 mm connector dimensions are illustrated below:

Figure 27: EM060K-Gl and EM120K-GL RF Connector Dimensions (Unit: mm) The receptacle RF connector used in conjunction with the module will accept two types of mating plugs that will meet a maximum height of 1.2 mm using a 0.81 mm coaxial cable or a maximum height of EM060K-GL&EM120K-GL_Hardware_Design 58 / 78 1.45 mm utilizing a 1.13 mm coaxial cable. The following figure shows the specifications of mating plugs using 0.81 mm coaxial cables. LTE-A Module Series Figure 28: Dimensions of Mated Plugs (0.81 mm Coaxial Cables) (Unit: mm)/

The following figure illustrates the connection between the receptacle RF connector on the module and the mating plug using a 0.81 mm coaxial cable. Figure 29: Space Factor of Mated Connectors (0.81 mm Coaxial Cables) (Unit: mm) EM060K-GL&EM120K-GL_Hardware_Design 59 / 78 The following figure illustrates the connection between the receptacle RF connector on the module and the mating plug using a 1.13 mm coaxial cable. LTE-A Module Series Figure 30: Space Factor of Mated Connectors ( 1.13 mm Coaxial Cables) (Unit: mm) 5.3.4. Antenna Design Requirements Table 36: Antenna Requirements of EM060K-Gl and EM120K-GL Type Requirements

< 1 dB: LB (<1 GHz)

< 1.5 dB: MB (12.3 GHz) VSWR: 2 Efficiency: >30 %

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss:

- < 2 dB: HB (> 2.3 GHz) VSWR: 2 Efficiency: >30 %

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss:

< 1 dB: LB (<1 GHz)

< 1.5 dB: MB (12.3 GHz)

- < 2 dB: HB (> 2.3 GHz) Main Antenna

(Tx/Rx) Rx-diversity/

GNSS Antenna NOTE Active GNSS antenna is not supported. EM060K-GL&EM120K-GL_Hardware_Design 60 / 78 LTE-A Module Series 6 Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module is listed in the following table. Table 37: Absolute Maximum Ratings Parameter VCC Min.

-0.3 Typ.

Max. 4.7 Unit V 6.2. Power Supply Requirements The typical input voltage of the module is 3.7 V. The following table shows the power supply requirements of the module. Table 38: Power Supply Requirements Parameter Description Conditions Min. Typ. Max. Unit VCC Power Supply 3.135 3.7 4.4 V The actual input voltages must be kept between the minimum and maximum values. Voltage Ripple

30 100 mV EM060K-GL&EM120K-GL_Hardware_Design 61 / 78 LTE-A Module Series 6.3. Power consumption Table 39: EM060K-GL Power Consumption (3.7 V Power Supply) Description Conditions Typ. Unit OFF state Power down Sleep State AT+CFUN=0 @ USB Suspend AT+CFUN=0 @ USB Suspend AT+CFUN=4 @ USB Suspend AT+CFUN=4 @ USB Suspend WCDMA PF = 64 @ USB Suspend WCDMA PF = 64 @ USB Suspend LTE-FDD PF = 64 @ USB Suspend LTE-FDD PF = 64 @ USB Suspend LTE-TDD PF = 64 @ USB Suspend LTE-TDD PF = 64 @ USB Suspend WCDMA PF = 64 (B1 CH10700 USB Disconnect) 16.65 WCDMA PF = 64 (B1 CH10700 USB Connect) 18.01 ldle State LTE-FDD PF = 64 (B1 CH300 USB Disconnect) 16.75 LTE-FDD PF = 64 (B1 CH300 USB Connect) 18.38 LTE-TDD PF = 64 (B38 CH38000 USB Disconnect) 16.85 LTE-TDD PF = 64 (B38 CH38000 USB Connect) 18.53 WCDMA Data Transfer

(GNSS Off) WCDMA B1 HSDPA CH10700 @ 22.2 dBm WCDMA B1 HSUPA CH10700 @ 21 dBm WCDMA B2 HSDPA CH9800 @ 22.1 dBm WCDMA B2 HSUPA CH9800 @ 20.3 dBm 72 1.5 1.65 1.5 1.67 2.63 2.74 2.9 2.9 3.16 3.24 620 520 550 450 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EM060K-GL&EM120K-GL_Hardware_Design 62 / 78 WCDMA B3 HSDPA CH1338 @ 22.2 dBm WCDMA B3 HSUPA CH1338 @ 20 dBm WCDMA B4 HSDPA CH1638 @ 22.1 dBm WCDMA B4 HSUPA CH1638 @ 20.3 dBm WCDMA B5 HSDPA CH4407 @ 22.2 dBm WCDMA B5 HSUPA CH4407 @ 22.2 dBm WCDMA B6 HSDPA CH4400 @ 22.2 dBm WCDMA B6 HSUPA CH4400 @ 22.3 dBm WCDMA B8 HSDPA CH3012 @ 22 dBm WCDMA B8 HSUPA CH3012 @ 21.5 dBm WCDMA B19 HSDPA CH738 @ 22dBm WCDMA B19 HSUPA CH738 @ 22.5 dBm LTE-FDD B1 CH300 @ 23.10 dBm LTE-FDD B2 CH900 @ 23.16 dBm LTE-FDD B3 CH1575 @ 23.13 dBm LTE-FDD B4 CH2175 @ 23.05 dBm LTE-FDD B5 CH2525 @ 23.13 dBm LTE-FDD B7 CH3100 @ 23.22 dBm LTE-FDD B8 CH3625 @ 23.12 dBm LTE-FDD B12 CH5095 @ 23.07 dBm LTE-FDD B13 CH5230 @ 23.11 dBm LTE-FDD B14 CH5330 @ 23.12 dBm LTE-FDD B17 CH5790 @ 23.05 dBm LTE-FDD B18 CH5925 @ 23.14 dBm LTE-FDD B19 CH6075 @ 23.18 dBm LTE-A Module Series 590 470 560 460 590 580 570 580 550 560 520 580 740 690 700 682 690 900 660 650 585 540 565 590 610 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE Data Transfer

(GNSS Off) EM060K-GL&EM120K-GL_Hardware_Design 63 / 78 LTE-FDD B30 CH9820 @ 23.03 dBm 1070 LTE-FDD B20 CH6300 @ 23.17 dBm LTE-FDD B25 CH8365 @ 23.21 dBm LTE-FDD B26 CH8865@ 23.14 dBm LTE-FDD B28A CH9360 @ 22.95 dBm LTE-FDD B28B CH9510 @ 22.84 dBm LTE-FDD B66 CH66886 @ 23.15 dBm LTE-FDD B71 CH68786 @ 23.05 dBm LTE-TDD B34 CH36275@ 23.10 dBm LTE-TDD B38 CH38000 @ 23.14 dBm LTE-TDD B39 CH38450 @ 23.06 dBm LTE-TDD B40 CH39150 @ 23.04 dBm LTE-TDD B41 CH40740 @ 23.20 dBm LTE-TDD B42 CH42590 @ 23.28 dBm LTE-TDD B43 CH44590 @ 23.08 dBm LTE-TDD B48 CH55990 @ 23.09 dBm WCDMA B1 CH10700 @ 23.2 dBm WCDMA B2 CH9800 @ 23.1 dBm WCDMA B3 CH1338 @ 23.2 dBm WCDMA B4 CH1638 @ 23.1 dBm WCDMA B5 CH4407 @ 23.2 dBm WCDMA B6 CH4400 @ 23.2 dBm WCDMA B8 CH3012 @ 23 dBm WCDMA B19 CH738 @ 23 dBm LTE-A Module Series 575 700 710 615 615 690 670 350 485 360 450 460 440 390 415 700 590 680 630 660 660 610 620 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA Voice* Call EM060K-GL&EM120K-GL_Hardware_Design 64 / 78 LTE-A Module Series Table 40: EM120K-GL Power Consumption (3.7 V Power Supply) Description Conditions Typ. Unit OFF state Power down Sleep State AT+CFUN=0 @ USB Suspend AT+CFUN=0 @ USB Suspend AT+CFUN=4 @ USB Suspend AT+CFUN=4 @ USB Suspend WCDMA PF = 64 @ USB Suspend WCDMA PF = 64 @ USB Suspend LTE-FDD PF = 64 @ USB Suspend LTE-FDD PF = 64 @ USB Suspend LTE-TDD PF = 64 @ USB Suspend LTE-TDD PF = 64 @ USB Suspend WCDMA PF = 64 (B1 CH10700 USB Disconnect) 16.91 WCDMA PF = 64 (B1 CH10700 USB Connect) 17.85 ldle State LTE-FDD PF = 64 (B1 CH300 USB Disconnect) 17.28 LTE-FDD PF = 64 (B1 CH300 USB Connect) 18.23 LTE-TDD PF = 64 (B38 CH38000 USB Disconnect) 17.4 LTE-TDD PF = 64 (B38 CH38000 USB Connect) 18.1 WCDMA B1 HSDPA CH10700 @ 22.2 dBm WCDMA B1 HSUPA CH10700 @21 dBm WCDMA Data Transfer

(GNSS Off) WCDMA B2 HSDPA CH9800 @ 22.1 dBm WCDMA B2 HSUPA CH9800 @ 20.3 dBm WCDMA B3 HSDPA CH1338 @ 22.2 dBm WCDMA B3 HSUPA CH1338 @ 20 dBm 72 1.37 1.35 1.40 1.42 2.04 2.04 2.22 2.32 3.5 3.5 620 520 550 450 590 470 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EM060K-GL&EM120K-GL_Hardware_Design 65 / 78 WCDMA B4 HSDPA CH1638 @ 22.1 dBm WCDMA B4 HSUPA CH1638 @ 20.3 dBm WCDMA B5 HSDPA CH4407 @ 22.2 dBm WCDMA B5 HSUPA CH4407 @ 22.2 dBm WCDMA B6 HSDPA CH4400 @ 22.2 dBm WCDMA B6 HSUPA CH4400 @ 22.3 dBm WCDMA B8 HSDPA CH3012 @ 22 dBm WCDMA B8 HSUPA CH3012 @ 21.5 dBm WCDMA B19 HSDPA CH738 @ 22 dBm WCDMA B19 HSUPA CH738 @ 22.5 dBm LTE-FDD B1 CH300 @ 23.02 dBm LTE-FDD B2 CH900 @ 23.1 dBm LTE-FDD B3 CH1575 @ 23.13 dBm LTE-FDD B4 CH2175 @ 23.06 dBm LTE-FDD B5 CH2525 @ 23.13 dBm LTE-FDD B7 CH3100 @ 23.03 dBm LTE-FDD B8 CH3625 @ 23.15 dBm LTE-FDD B12 CH5095 @ 23.03 dBm LTE-FDD B13 CH5230 @ 23.10 dBm LTE-FDD B14 CH5330 @ 22.95 dBm LTE-FDD B17 CH5790 @ 23.05 dBm LTE-FDD B18 CH5925 @ 23.16 dBm LTE-FDD B19 CH6075 @ 23.17 dBm LTE-FDD B20 CH6300 @ 23.17 dBm LTE-FDD B25 CH8365 @ 23.35 dBm LTE-A Module Series 560 460 590 580 570 580 550 560 520 580 740 690 700 682 690 900 660 650 585 540 565 600 620 581 700 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE Data Transfer

(GNSS Off) EM060K-GL&EM120K-GL_Hardware_Design 66 / 78 LTE-FDD B26 CH8865@ 23.15 dBm LTE-FDD B28A CH9360 @ 23.05 dBm LTE-FDD B28B CH9510 @ 22.97 dBm LTE-FDD B30 CH9820 @ 23.24 dBm LTE-FDD B66 CH66886 @ 23.10 dBm LTE-FDD B71 CH68786 @ 23.36 dBm LTE-TDD B34 CH36275 @ 23.11 dBm LTE-TDD B38 CH38000 @ 23.13 dBm LTE-TDD B39 CH38450 @ 23.05 dBm LTE-TDD B40 CH39150 @ 23.21 dBm LTE-TDD B41 CH40740 @ 23.09 dBm LTE-TDD B42 CH42590 @ 23.21 dBm LTE-TDD B43 CH44590 @ 23.14 dBm LTE-TDD B48 CH55990 @ 23.10 dBm WCDMA B1 CH10700 @23.2 dBm WCDMA B2 CH9800 @ 23.1 dBm WCDMA B3 CH1338 @ 23.2 dBm WCDMA B4 CH1638 @ 23.1 dBm WCDMA B5 CH4407 @ 23.2 dBm WCDMA B6 CH4400 @ 23.2 dBm WCDMA B8 CH3012 @ 23 dBm WCDMA B19 CH738 @ 23 dBm LTE-A Module Series 710 615 615 1070 690 670 350 485 360 460 460 440 390 415 700 590 680 630 660 660 610 620 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA Voice* Call EM060K-GL&EM120K-GL_Hardware_Design 67 / 78 Parameter Description Unit 6.4. Digital I/O Characteristics Table 41: 1.8 V Digital I/O Requirements) Input high voltage Input low voltage Output high voltage 1.3 Output low voltage 0 Table 42: 3.3 V Digital I/O Requirements Parameter Description 3.3 V Power Domain VIH VIL Input high voltage Input low voltage Table 43: (U)SIM 1.8 V I/O Requirements Parameter Description USIM_VDD Power supply Min. 1.65

-0.3 Min. 3.135 2.0

-0.5 Min. 1.65 VIH VIL VOH VOL VIH VIL VOH VOL LTE-A Module Series Max. 2.1 0.54 1.8 0.4 Max. 3.464 3.6 0.8 Max. 1.95 V V V V V V V V V Unit Unit V Input high voltage 0.7 USIM_VDD USIM_VDD + 0.3 V Input low voltage

-0.3 0.2 USIM_VDD V Output high voltage 0.8 USIM_VDD USIM_VDD Output low voltage 0 0.4 EM060K-GL&EM120K-GL_Hardware_Design 68 / 78 LTE-A Module Series Table 44: (U)SIM 3.0 V I/O Requirements Parameter Description USIM_VDD Power supply Min. 2.7 Max. 3.05 VIH VIL VOH VOL Input high voltage 0.7 USIM_VDD USIM_VDD + 0.3 V Input low voltage

-0.3 0.2 USIM_VDD V Output high voltage 0.8 USIM_VDD USIM_VDD Output low voltage 0 0.4 Unit V V V 6.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 45: Electrostatic Discharge Characteristics (Temperature: 25 C, Humidity: 40 %) Tested Interfaces Contact Discharge Air Discharge Unit VCC, GND Antenna Interfaces 5 4 Other Interfaces 0.5 10 8 1 kV kV kV EM060K-GL&EM120K-GL_Hardware_Design 69 / 78 LTE-A Module Series 6.6. Operating and Storage Temperatures Table 46: Operating and Storage Temperatures Parameter Min. Max. Unit Operating Temperature Range 15

-25 Extended Temperature Range 16

-40 Storage temperature Range

-40 Typ.

+25

+75

+85

+90 C C C 6.7. Thermal Dissipation Figure 31: Distribution of Heat Source Chips Inside the Module The module offers the best performance when all internal IC chips are working within their operating 15 To meet this operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module meets 3GPP specifications. 16 To meet this extended temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module remains the ability to establish and maintain functions such as voice*, SMS, emergency call* etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may undergo a reduction in value, exceeding the specified tolerances of 3GPP. When the temperature returns to the normal operating temperature level, the module will meet 3GPP specifications again. EM060K-GL&EM120K-GL_Hardware_Design 70 / 78 LTE-A Module Series temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:

Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Expose the copper in the PCB area where module is mounted. Apply a soft thermal pad with appropriate thickness and high thermal conductivity between the module and the PCB to conduct heat. Follow the principles below when the heatsink is necessary:

- Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.

- Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;

- Choose the heatsink with adequate fins to dissipate heat;

- Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;

- Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. Heatsink PCB TIM Thermal pad Module Screw Heatsink TIM Module PCB Thermal pad Figure 32: Placement and Fixing of the Heatsink BB 85 Table 47: Maximum Operating Temperature for Main Chips (Unit: C) MCP PMU WTR MMPA 85 85 85 100 PA 85 APT 85 EM060K-GL&EM120K-GL_Hardware_Design 71 / 78 LTE-A Module Series 6.8. Notification Please follow the principles below in the module application. 6.8.1. Coating If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 6.8.2. Cleaning Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. EM060K-GL&EM120K-GL_Hardware_Design 72 / 78 LTE-A Module Series 7 Mechanical Information and Packaging This chapter mainly describes mechanical dimensions and packaging specifications of EM060K-GL and EM120K-GL. All dimensions are measured in mm, and the tolerances are 0.15 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 33: Mechanical Dimensions of the Module (Unit: mm) EM060K-GL&EM120K-GL_Hardware_Design 73 / 78 7.2. Top and Bottom Views LTE-A Module Series Figure 34: EM060K-GL Top and Bottom Views NOTE Figure 35: EM120K-GL Top and Bottom Views Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EM060K-GL&EM120K-GL_Hardware_Design 74 / 78 LTE-A Module Series 7.3. M.2 Connector EM060K-GL and EM120K-GL adopt a standard PCI Express M.2 connector which compiles with the directives and standards listed in PCI Express M.2 Specification. 7.4. Packaging The module adopts blister tray packaging and details are as follow:

7.4.1. Blister Tray Dimension details are as follow:

EM060K-GL&EM120K-GL_Hardware_Design 75 / 78 LTE-A Module Series Figure 36: Blister Tray Dimension Drawing EM060K-GL&EM120K-GL_Hardware_Design 76 / 78 7.4.2. Packaging Process LTE-A Module Series Each blister tray packs 10 modules. Stack 10 blister trays with modules together, and put 1 empty blister tray on the top. Packing 11 blister trays together and then put blister trays into a conductive bag, seal and pack the conductive bag. Put seal-packed blister trays into a mini box. One mini box can pack 100 modules. Put 4 mini boxes into 1 carton and then seal it. One carton can pack 400 modules. Figure 37: Packaging Process EM060K-GL&EM120K-GL_Hardware_Design 77 / 78 LTE-A Module Series 8 Appendix References Table 48: Related Documents Document Name

[1] Quectel_EM060K-GL_CA_Feature

[2] Quectel_EM120K-GL_CA_Feature

[3] Quectel_EM060K-GL_AT_Commands_Manual

[4] Quectel_5G-M2_EVB_User_Guide

[5] Quectel_LTE-A(Q)_GNSS_Application_Note Table 49: Terms and Abbreviations Abbreviation Description BIOS bps BPSK CPE COEX DL DPR DRX DRx Basic Input/Output System Bit(s) per second Binary Phase Shift Keying Customer-Premise Equipment Coexistence Downlink Dynamic Power Reduction Discontinuous Reception Diversity Receive DFOTA Delta Firmware Upgrade Over-The-Air EM060K-GL&EM120K-GL_Hardware_Design 78 / 78 LTE-A Module Series GLONASS Global Navigation Satellite System (Russia) HSUPA High Speed Uplink Packet Access Equipment Isotropic Radiated Power Electrostatic Discharge Frequency Division Duplex Global Navigation Satellite System Global Positioning System Global System for Mobile Communications High Speed Packet Access Kilobits per second License Assisted Access Light Emitting Diode Long Term Evolution Megabits per second Mobile Equipment Multi-Frequency Band Indicator Multiple-Input Multiple-Output Multi-layer Ceramic Capacitor Mobile Originated Most Significant Bit Mobile Terminated Password Authentication Protocol Printed Circuit Board Peripheral Component Interconnect Express Pulse Code Modulation EIRP ESD FDD GNSS GPS GSM HSPA kbps LAA LED LTE Mbps ME MFBI MIMO MLCC MO MSB MT PAP PCB PCIe PCM EM060K-GL&EM120K-GL_Hardware_Design 79 / 78 LTE-A Module Series Protocol Data Unit Power Management Event Point-to-Point Protocol Quadrature Phase Shift Keying Resource Block Radio Frequency RF Front-End Relative Humility Receive Specific Absorption Rate Short Message Service Transmission Control Protocol Transmit & Receive Transmit User Datagram Protocol Uplink Unsolicited Result Code Universal Serial Bus High-level Input Voltage Low-level Input Voltage High-level Output Voltage Low-level Output Voltage PDU PME PPP QPSK RB RF RFFE RH Rx SAR SMS TCP TRx Tx UDP UL URC USB VIH VIL VOH VOL UART Universal Asynchronous Receiver/Transmitter

(U)SIM

(Universal) Subscriber Identity Module WCDMA Wideband Code Division Multiple Access EM060K-GL&EM120K-GL_Hardware_Design 80 / 78

 

 

 

 

 

 

 

 

 

 

QMFL FEE. EMT20K-GL ot-mc0e EM120KGLAA-M22-SGADA FCC ID:XMR2022EM1 20KGL 1C:10224A-22EM1 20KGL SN:E1A17K137XXXXX1 IMEI: 86450504 XXXXX0

 

 

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SGS North America Inc. 620 Old Peachtree Road SUITE 100 Suwanee, Georgia 30024 United States Applicant Declaration Applicant Legal Business Name Quectel Wireless Solutions Co.,Ltd Address FRN Grantee Code FCC ID Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China 0018988279 XMR XMR2022EM120KGL Authorized Contact Name Jean Hu Contact Email Contact Phone jean.hu@quectel.com

+86-21-51086236-6511 I, the undersigned, certify that I am an authorized signatory for the Applicant and therefore declare;

a) b) in accordance with 47CFR2.911(d), all of the statements herein and the exhibits attached hereto are true and correct to the best of my knowledge and belief. in accepting a Grant of Equipment Authorization issued by a TCB, under the authority of the FCC, as a result of the representations made in this application, the Applicant is responsible for:

labeling the equipment with the exact FCC ID as specified in this application,

(1)

(2) compliance statement labeling pursuant to the applicable rules,

(3) compliance of the equipment with the applicable technical rules, c) d) e) if the Applicant is not the actual manufacturer of the equipment, appropriate arrangements have been made with the manufacturer to ensure that production units of this equipment will continue to comply with the FCCs technical requirements. in accordance with 47 CFR 2.909 and KDB394321, the Applicant has read, understood and agrees to accept that they are the responsible party and agree to abide by their responsibilities as specified under 47 CFR 2.909 and KDB394321. in accordance with ISO 17065, FCC KDB641163, FCC KDB610077, KDB394321 and RSP-100, the Applicant has read, understood, accepts and agrees to abide by the post market surveillance requirements.

(1)

(2)

(3) the Applicant understands, accepts and agrees that a sample may be requested for surveillance testing. the Applicant shall make provisions to always have a production sample available upon request by SGS, FCC and/or ISED. the Applicant shall, upon request by SGS, at the Applicants expense, provide a production sample of the requested product to SGS, FCC and/or ISED as instructed. The sample shall include all support devices, cables, software, accessories or other hardware or software required for evaluation, review, certification and audit surveillance of products certified by SGS. f) g) neither the Applicant nor any party to the application is subject to a denial of Federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862 because of a conviction for possession or distribution of a controlled substance. See 47CFR 1.2002(b) for the definition of a party for these purposes. the Applicant has read, understood, accepts and agrees to abide by the SGS North America, Inc.(TCB) terms and conditions. Link to CFRs: https://www.fcc.gov/wireless/bureau-divisions/technologies-systems-and-innovation-division/rules-regulations-title-47 Link to KDBs: https://apps.fcc.gov/oetcf/kdb/index.cfm Link to RSP-100: https://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf01130.html Link to the Covered List: Covered List Quectel Wireless Solutions Co.,Ltd (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Quectel Wireless Solutions Co.,Ltd (the applicant) certifies that, as of the date of the filing of the application, the applicant [is not]

identified on the Covered list, established pursuant to 1.50002, as an entity producing covered equipment. Date:2024/1/20 Applicant Signature:

Print Name:

Title:

Jean Hu Certification Manager

*NOTE: This declaration cannot be signed by an Agent, it shall be signed by an authorized person listed in the FCC database QSF27-14-04 Rev 1.1 Jan 17, 2024 Page 1 of 1 Original Issue: Jan. 4, 2021

 

 

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China, 200233 Request for Class II Permissive Change FCC IDXMR2022EM120KGL Date2024-1-13 Dear Sir/Madam, Subject: FCC Class permission change for FCC ID: XMR2022EM120KGL Original Grant Date: 10/25/2022 This project is a CIIPC submission to our product: LTE-A Cat 12 M.2 Module, model:

EM120K-GL, the device is identical to the previous certified except for the changes as below:

In addition to the hardware changes mentioned above, the software has enabled the B42/43 frequency bands, and the specific changes are as follows Model name EM120K-GL Original Software Version:EM120KGLAAR01A03M2G New Software Version:EM120KGLAAR01A05M2G Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China, 200233 The test strategy reference is as follows:

Case Part 22/24/27/90/96 Part 2.1091 Thank you. Sincerely. Remark Check Power+Check Worse RSE B42/43 complete test The B25/B66/B30 frequency bands involved in hardware modifications require retesting of RSE New Date:

City:

2024/1/13.. Shanghai .. Name:

Jean hu .. (2) Email:

jean.hu@quectel.com. Signature:

 

 

RF_734_02 04 April 16 Quectel Wireless Solutions Co., Ltd. Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) FCC ID: XMR2022EM120KGL Items to be covered by Single modular transmitters. 1. The modular transmitter must have its own RF shielding. 2. 3. 4. 5. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. The modular transmitter must have its own power supply regulation. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. there are very strict operational and 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. Answer from applicant Yes, please see exhibition external photos Yes, the modular has buffer modulation /data inputs Yes, please see the SCH.pdf Yes, the requirements of antenna connector and spurious emission have been fulfilled. Please refer to the test report exhibition. Yes, please refer to the setup photo exhibition for the stand-alone configuration Yes, the module will be label with its own FCC ID, and the instruction on the labelling rule of the end product has been stated in the user manual of this module. Please refer to the label and user manual exhibition. Yes, the required FCC rule has been fulfilled and all the instruction for maintaining compliance have been clearly stated in the user manual. Yes, please refer exhibition RF exposure for the compliance of MPE RF exposure rule. Note: A limited modular approval (LMA) may be granted for single modular transmitters that comply partially with the requirements above. RF_734_02 04 April 16 Name and surname of applicant (or authorized representative):

Date:

City:

Name:

Email:

2024/01/16.. . Shanghai

.. Jean hu jean.hu@quectel.com. Signature:

 

 

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Date: 2024/01/16 Federal Communications Commission Office of Engineering and Technology Laboratory Division 7435 Oakland Mills Rd Columbia MD 21046-1609 Subject: Request for Confidentiality FCC ID: XMR2022EM120KGL To Whom It May Concern, Pursuant to the provisions of Sections 0.457 and 0.459 of Commissions rules (47CFR0.457, 0.459), we are requesting the Commission to withhold the following attachment(s) as confidential document from public disclosure indefinitely. Schematic Diagram Block Diagram Part List Operational Description Tune-up Procedure Above mentioned document contains detailed system and equipment description are considered as proprietary information in operation of the equipment. The public disclosure of above documents might be harmful to our company and would give competitor an unfair advantage in the market. In additional to above mentioned documents, pursuant to Public Notice DA 04-1705 of the Commission s policy, in order to comply with the marketing regulations in 47 CFT 2.803 and the importation rules in 47 CFR 2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices. We are requesting the commission to grant short-term confidentiality request on the following attachment(s) for 180 days after the grant as outlined in Public Notice DA 04-1705. External Photos Internal Photos Test Setup Photos User Manual It is our understanding that all measurement test reports, FCC ID label format and correspondent during certification review process cannot be granted as confidential documents and those information will be available for public review once the grant of equipment authorization is issued. Best Regards, Date:

Name:

Email:

2024/01/16.. Jean Hu .. jean.hu@quectel.com.... Signature:

 

 

QUECCTEL Federal Communications Commission 7435 Oakland Mills Road Columbia MD 21046 Subject: Certification designating a U.S. agent for service of process pursuant to Part 2.911(d)(7) To whom it may concern, Quectel Wireless Solutions Company Limited, FRN: 0018988279, Grantee Code: XMR (the applicant) certifies that, as of the date of the filing of application, Ikotek USA, Inc., FRN: 0033350331 (the agent) is designated as the U.S. agent for the purpose of accepting service of process on behalf of the applicant. The physical U.S. address and email for the designated agent are:

Physical U.S. address: 9920 Pacific Heights Blvd., Ste. 150, #7025, San Diego, CA 92121 Email: compliance@ikotek.com The applicant accepts to maintain an agent for service of process in the United States for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. The agent accepts the designation by (the applicant) as the U.S. agent to accept service of process includes, but is not limited to, delivery of any correspondence, notices, orders, decisions, and requirements of administrative, legal, or judicial process related to Commission proceedings. Signed by the Applicant Signed by the Agent (if different from the Applicant) 7 he! Jean Hu Name: eterson Title Certification Manager Title: CEO. Email: Jean.hu@quectel.com Email: joe.peterson@ikotek.com Date: 07 July, 2023 Date: 07 July, 2023

 

 

RF_160, Issue 04 Quectel Wireless Solutions Co., Ltd. Declaration of Authorization We Name:

Address:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 City:

Country:

Shanghai China Declare that:

Name Representative of agent: Well Wei Agent Company name:

Address:

Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone City:

Country Suzhou China SGS-CSTC Standards Technical Services (Suzhou) Co., Ltd South of No. 6 Plant, No. 1, Runsheng Road, Suzhou Industrial is authorized to apply for Certification of the following product(s):

Product description: LTE-A Cat 12 M.2 Module Type designation:

Trademark:

FCC ID:

EM120K-GL Quectel XMR2022EM120KGL on our behalf. Date:

City:

Name:

Email:

2024/01/16.. Shanghai .. Jean hu .. jean.hu@quectel.com. Signature:

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Quectel Wireless Solutions Company Limited Confidentiality Request Letter Federal Communications Commission Authorization and Evaluation Division FCC ID: XMR2022EM120KGL Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:

1. Block Diagram 2. Schematics 3. Operational Description 4. BOM List 5. Tune up Procedure The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Rule 0.457, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely, _ _________________ Name: Jean Hu Email: jean.hu@quectel.com Date: 2022-05-27

 

 

Quectel Wireless Solutions Company Limited Declaration of Conformity Federal Communications Commission Authorization and Evaluation Division FCC ID: XMR2022EM120KGL Please be notified that we, the undersigned, Quectel Wireless Solutions Company Limited declares that the product which bears the above FCC ID is also compliant with the FCC requirements for sDOC. And the sDOC procedure shall be carried out prior to marketing the device in the US. Sincerely, _ _________________ Name: Jean Hu Email: jean.hu@quectel.com Date: 2022-05-27

 

 

Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Request for Modular/Limited Modular Approval Date: May 31, 2022 Subject: Manufacturers Declaration for Confidentiality Request for: XMR2022EM120KGL

- Modular Approval

- Split Modular Approval

- Limited Modular Approval - Limited Split Modular Approval 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i) Details: <example The module contains a metal shield which covers all RF components and circuitry. The shield is located on the top of the board next to antenna connector>

Requirement Met

- YES - NO(*) 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii) Details: <example Data to the modulation circuit is buffered as described in the operational description provided with the application>

- YES - NO(*) 3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii) Details: <example The module contains its own power supply regulation. Please refer to schematic filed with this application>

- YES - NO(*) 4. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv) Details: <example The module connects to its antenna using an UFL connector which is considered a non-

standard connector. A list of antennas tested and approved with this device may be found in users manual provided with the application>

- YES - NO(*) 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v) Details: <example The module was tested stand-alone as shown in test setup photographs filed with this application>

- YES - NO(*) 6. The modular transmitter must be labeled with its own FCC ID number, or use an electron Modular Approval Requirement Requirement Met display (see KDB Publication 784748). If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID:

XMR2022EM120KGL or Contains FCC ID: XMR2022EM120KGL Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi) Details: <example There is a label on the module as shown in the labeling exhibit filed with this application. Host specific labeling instructions are shown in the installation manual .filed with this application.>

- YES - NO(*) 7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii) Details: <example The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application.>

- YES - NO(*) 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1)(viii) Details: < The module meets RF exposure in mobile configuration.>

- YES - NO(*) 070920-02b Limited Module Description When Applicable

* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval

(LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA; the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: <example - N/A>

Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Details: <example The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. >

- Provided in Separate Cover Letter Requirement Met

- N/A 2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.

- Provided in Separate Cover Letter

- N/A Details: <example N/A>

Requirement 1. For split modular transmitters, specific descriptions for secure communications Provided in Manual Split Modular Requirements between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained. Details: <example N/A >

- Provided in Separate Cover Letter

- N/A 070920-02b OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?

- YES

- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 D03, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 point systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D03, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc note that omni-directional is not considered a type) 7. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product 8. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 a. Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. b. Provide information on how to configure test modes for evaluation 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10

- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.

- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. 070920-02b

 

 

Quectel Wireless Solutions Company Limited Declaration of Authorization We Name: Quectel Wireless Solutions Company Limited Address: Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Declare that:

Name Representative of agent: Marlin Chen Agent Company name:

Address:

MRT Technology (Suzhou) Co., Ltd D8 Building, Youxin Industrial Park, No.2 Tian'edang Rd., Wuzhong Economic Development Zone Suzhou China is authorized to apply for Certification of the following product(s):

LTE-A Cat 12 M.2 Module XMR2022EM120KGL EM120K-GL City:

Country:

Product:

FCC ID:

Model No.:

Sincerely, _ ________________ Name: Jean Hu Email: jean.hu@quectel.com Date: 2022-05-27