EM120R-GL&EM160R-GL Hardware Design Rev. EM120R-GL&EM160R-GL_Hardware_Design_V1.0 LTE-A Module Series Date: 2020-07-02 Status: Preliminary www.quectel.com LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:
http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT WITHOUT PERMISSION ARE FORBIDDEN. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved. EM120R-GL&EM160R-GL_Hardware_Design 1 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design About the Document Revision History Version Date Author Description 1.0 2020-07-02 Jim HAN/
Charls SHENG Initial EM120R-GL&EM160R-GL_Hardware_Design 2 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Table Index ................................................................................................................................................... 5 Figure Index ................................................................................................................................................. 7 1 Introduction .......................................................................................................................................... 9 1.1. Safety Information ..................................................................................................................... 10 2 Product Concept ................................................................................................................................ 11 2.1. General Description .................................................................................................................. 11 2.2. Key Features ............................................................................................................................. 12 2.3. Functional Diagram ................................................................................................................... 14 2.4. Evaluation Board ....................................................................................................................... 15 3 Application Interfaces........................................................................................................................ 16 3.4.1. 3.4.2. 3.4.2.1. 3.4.2.2. 3.4.1.1. 3.4.1.2. 3.4.1.3. 3.1. Pin Assignment ......................................................................................................................... 17 3.2. Pin Description .......................................................................................................................... 18 3.3. Power Supply ............................................................................................................................ 23 3.3.1. Decrease Voltage Drop .................................................................................................. 23 3.3.2. Reference Design for Power Supply.............................................................................. 24 3.4. Turn-on and Turn-off Scenarios ................................................................................................ 25 Turn on the Module ........................................................................................................ 25 Turn on the Module with a Host GPIO ................................................................ 25 Turn on the Module Automatically ....................................................................... 26 Turn on the Module with Compatible Design ...................................................... 26 Turn off the Module ........................................................................................................ 28 Turn off the Module through FULL_CARD_POWER_OFF#............................... 28 Turn off the Module through AT Command ......................................................... 28 3.5. Reset ......................................................................................................................................... 30 3.6.
(U)SIM Interfaces ...................................................................................................................... 32 3.7. USB Interface ............................................................................................................................ 37 3.8. PCIe Interface ........................................................................................................................... 39 3.8.1. Endpoint Mode ............................................................................................................... 40 3.8.2. USB Version and PCIe Only Version ............................................................................. 42 3.9. PCM Interface* .......................................................................................................................... 43 3.10. Control and Indicator Signals* .................................................................................................. 45 3.10.1. W_DISABLE1# Signal.................................................................................................... 45 3.10.2. W_DISABLE2# Signal.................................................................................................... 46 3.10.3. WWAN_LED# Signal...................................................................................................... 47 3.10.4. WAKE_ON_WAN# Signal .............................................................................................. 48 3.10.5. DPR ................................................................................................................................ 49 3.10.6. ANT_CONFIG Signal ..................................................................................................... 50 3.11. COEX UART Interface* ............................................................................................................. 50 EM120R-GL&EM160R-GL_Hardware_Design 3 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.12. Antenna Tuner Control Interfaces*............................................................................................ 51 3.12.1. Antenna Tuner Control Interface through GPIOs .......................................................... 51 3.12.2. Antenna Tuner Control Interface through RFFE ............................................................ 51 3.13. Configuration Pins ..................................................................................................................... 52 3.13.1. EM160R-GL configuration pins ...................................................................................... 52 3.13.2. EM120R-GL configuration pins ...................................................................................... 53 4 GNSS Receiver ................................................................................................................................... 55 4.1. General Description .................................................................................................................. 55 5 Antenna Connection .......................................................................................................................... 56 5.1. Antenna Connectors ................................................................................................................. 56 5.1.1. Operating Frequency ..................................................................................................... 57 5.2. GNSS Antenna Connector ........................................................................................................ 59 5.3. Antenna Installation................................................................................................................... 60 5.3.1. Antenna Requirements .................................................................................................. 60 5.3.2. Recommended RF Connector for Antenna Installation ................................................. 62 6 Electrical, Reliability and Radio Characteristics ............................................................................ 64 6.1. Absolute Maximum Ratings ...................................................................................................... 64 6.2. Power Supply Requirements .................................................................................................... 64 6.3. I/O Requirements ...................................................................................................................... 65 6.4. Operation and Storage Temperatures....................................................................................... 65 6.5. Current Consumption ................................................................................................................ 66 6.6. RF Output Power ...................................................................................................................... 66 6.7. RF Receiving Sensitivity ........................................................................................................... 67 6.8. Characteristics........................................................................................................................... 68 6.9. Thermal Dissipation .................................................................................................................. 69 7 Mechanical Dimensions and Packaging.......................................................................................... 71 7.1. Mechanical Dimensions of the Module ..................................................................................... 71 7.2. Standard Dimensions of M.2 PCI Express ............................................................................... 72 7.3. Design Effect Drawings of the Module...................................................................................... 73 7.3.1. Design Effect Drawings of EM160R-GL Module............................................................ 73 7.3.2. Design Renderings of EM120R-GL Module .................................................................. 74 7.4. M.2 Connector........................................................................................................................... 75 7.5. Packaging.................................................................................................................................. 75 8 Appendix References ........................................................................................................................ 77 EM120R-GL&EM160R-GL_Hardware_Design 4 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table Index Table 1: Frequency Bands and GNSS Types of EM120R-GL&EM160R-GL .............................................11 Table 2: Definition of I/O Parameters ......................................................................................................... 18 Table 3: Pin Description.............................................................................................................................. 18 Table 4: Pin Definition of VCC and GND.................................................................................................... 23 Table 5: Pin Definition of FULL_CARD_POWER_OFF# ........................................................................... 25 Table 6: Description of Turn-on Timing of the Module ............................................................................... 27 Table 7: Description of the Timing of Resetting the Module througn FULL_CARD_POWER_OFF#........ 28 Table 8: Pin Definition of RESET# ............................................................................................................. 30 Table 9: Timing of Resetting the Module .................................................................................................... 32 Table 10: Pin Definition of (U)SIM Interfaces ............................................................................................. 33 Table 11: Pin Definition of USB Interface ................................................................................................... 37 Table 12: Pin Definition of PCIe Interface .................................................................................................. 39 Table 13: Description of PCIe Power-on Timing Requirements of the Module ......................................... 42 Table 14: Pin Definition of PCM Interface .................................................................................................. 44 Table 15: Definition of Control and Indicator Signals ................................................................................. 45 Table 16: RF Function Status ..................................................................................................................... 46 Table 17: GNSS Function Status ............................................................................................................... 46 Table 18: RF Status Indications of WWAN_LED# Signal .......................................................................... 48 Table 19: State of the WAKE_ON_WAN# Signal....................................................................................... 48 Table 20: Function of the DPR Signal ........................................................................................................ 49 Table 21: Pin Definition of ANT_COMNFIG of EM160R-GL ...................................................................... 50 Table 22: Pin Definition of COEX UART Interface ..................................................................................... 50 Table 23: Pin Definition of Antenna Tuner Control Interface through GPIOs............................................. 51 Table 24: Pin Definition of Antenna Tuner Control Interface through RFFE .............................................. 51 Table 25: List of EM160R-GL Configuration Pins ...................................................................................... 52 Table 26: List of EM160R-GL Configuration Pins ...................................................................................... 53 Table 27: List of EM120R-GL Configuration Pins ...................................................................................... 53 Table 28: List of EM120R-GL Configuration Pins ...................................................................................... 54 Table 29: Operating Frequencies of EM120R-GL&EM160R-GL ............................................................... 57 Table 30: GNSS Frequency........................................................................................................................ 59 Table 31: Antenna Requirements of EM160R-GL...................................................................................... 60 Table 32: Antenna Requirements of EM120R-GL...................................................................................... 61 Table 33: Major Specifications of the RF Connector.................................................................................. 62 Table 34: Absolute Maximum Ratings ........................................................................................................ 64 Table 35: Power Supply Requirements ...................................................................................................... 64 Table 36: I/O Requirements........................................................................................................................ 65 Table 37: Operation and Storage Temperatures ........................................................................................ 65 Table 38: EM120R-GL&EM160R-GL Current Consumption...................................................................... 66 Table 39: RF Output Power ........................................................................................................................ 66 Table 40: EM120R-GL&EM160R-GL Conducted RF Min. Receiving Sensitivity ...................................... 67 Table 41: Electrostatic Discharge Characteristics (Temperature: 25 C, Humidity: 40%) ......................... 69 EM120R-GL&EM160R-GL_Hardware_Design 5 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 42: Related Documents .................................................................................................................... 77 Table 43: Terms and Abbreviations ............................................................................................................ 77 EM120R-GL&EM160R-GL_Hardware_Design 6 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure Index Figure 1: Functional Diagram ..................................................................................................................... 14 Figure 2: Pin Assignment ........................................................................................................................... 17 Figure 3: Power Supply Limits during Radio Transmission ....................................................................... 23 Figure 4: Reference Circuit of VCC............................................................................................................ 24 Figure 5: Reference Design of Power Supply............................................................................................ 24 Figure 6: Turn on the Module with a Host GPIO ........................................................................................ 25 Figure 7: Turn on the Module Automatically............................................................................................... 26 Figure 8: Turn on the Module with Compatible Design .............................................................................. 26 Figure 9: Turn-on Timing of the Module ..................................................................................................... 27 Figure 10: Timing of Turning off the Module through FULL_CARD_POWER_OFF#................................ 28 Figure 11: Timing of Turning off the Module through AT Command and FULL_CARD_POWER_OFF# .. 29 Figure 12: Timing of Turning off the Module through AT Command and Power Supply............................ 29 Figure 13: Reference Circuit of RESET_N with NPN Driving Circuit......................................................... 30 Figure 14: Reference Circuit of RESET_N with NMOS Driving Circuit ..................................................... 31 Figure 15: Reference Circuit of RESET_N with Button ............................................................................. 31 Figure 16: Timing of Resetting the Module ................................................................................................ 32 Figure 17: Reference Circuit of Normally Closed (U)SIM1 Card Connector ............................................. 34 Figure 18: Reference Circuit of Normally Open (U)SIM1 Card Connector................................................ 34 Figure 19: Reference Circuit of a 6-Pin (U)SIM1 Card Connector ............................................................ 35 Figure 20: Recommended Compatible Design of (U)SIM2 Interface ........................................................ 36 Figure 21: Reference Circuit of USB 3.0/2.0 Interface .............................................................................. 38 Figure 22: PCIe Interface Reference Circuit (EP Mode)............................................................................ 40 Figure 23: PCIe Power-on Timing Requirements of M.2 Specification ..................................................... 41 Figure 24: PCIe Power-on Timing Requirements of the Module ............................................................... 41 Figure 25: Primary Mode Timing ................................................................................................................ 43 Figure 26: Auxiliary Mode Timing ............................................................................................................... 44 Figure 27: W_DISABLE1# and W_DISABLE2# Reference Circuit ........................................................... 47 Figure 28: WWAN_LED# Signal Reference Circuit ................................................................................... 47 Figure 29: WAKE_ON_WAN# Signal Reference Circuit Design ............................................................... 49 Figure 30: Recommended Circuit of EM160R-GL Configuration Pins ...................................................... 52 Figure 31: Recommended Circuit of EM120R-GL Configuration Pins ...................................................... 53 Figure 32: Antenna Connectors on the EM160R-GL Module .................................................................... 56 Figure 33: Antenna Connectors on the EM120R-GL Module .................................................................... 57 Figure 34: EM120R-GL&EM160R-GL RF Connector Dimensions (Unit: mm) .......................................... 62 Figure 35: Specifications of Mating Plugs Using 0.81 mm Coaxial Cables ............................................ 63 Figure 36: Connection between RF Connector and Mating Plug Using 0.81 mm Coaxial Cable .......... 63 Figure 37: Connection between RF Connector and Mating Plug Using 1.13 mm Coaxial Cable .......... 63 Figure 38: Thermal Dissipation Area on Bottom Side of Module (Top View)............................................. 69 Figure 39: Mechanical Dimensions of EM120R-GL&EM160R-GL (Unit: mm) .......................................... 71 Figure 40: Standard Dimensions of M.2 Type 3042-S3 (Unit: mm) ........................................................... 72 Figure 41: M.2 Nomenclature..................................................................................................................... 72 EM120R-GL&EM160R-GL_Hardware_Design 7 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 42: Top View of the Module............................................................................................................. 73 Figure 43: Bottom View of the Module ....................................................................................................... 73 Figure 44: Top View of the Module............................................................................................................. 74 Figure 45: Bottom View of the Module ....................................................................................................... 74 Figure 46: Tray Size (Unit: mm) ................................................................................................................. 75 Figure 47: Tray Packaging Procedure ....................................................................................................... 76 EM120R-GL&EM160R-GL_Hardware_Design 8 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 1 Introduction This document defines EM120R-GL&EM160R-GL and describes its air interfaces and hardware interfaces which are connected to customers applications. This document is applicable to the following modules:
EM120R-GL EM160R-GL This document can help customers quickly understand the interface specifications, electrical and mechanical details, as well as other related information of EM120R-GL&EM160R-GL. To facilitate its application in different fields, reference design is also provided for customers reference. This document, coupled with application notes and user guides, can help customers use the module to design and set up mobile applications easily. EM120R-GL&EM160R-GL_Hardware_Design 9 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EM120R-GL&EM160R-GL modules. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, use emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as mobile phone or other cellular terminals. Areas with potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders. EM120R-GL&EM160R-GL_Hardware_Design 10 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 2 Product Concept 2.1. General Description EM120R-GL&EM160R-GL are LTE-A/UMTS/HSPA+ wireless communication modules with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks with standard PCI Express M.2 interface. It supports embedded operating systems such as Windows, Linux and Android, and provides GNSS 1) and voice functionality 2) to meet customers specific application demands. The following table shows the frequency bands and GNSS types of EM120R-GL&EM160R-GL. Table 1: Frequency Bands and GNSS Types of EM120R-GL&EM160R-GL Mode EM120R-GL&EM160R-GL LTE-FDD
(with Rx-diversity/MIMO 5)) LTE-TDD
(with Rx-diversity/MIMO 5)) WCDMA
(with Rx-diversity) GNSS 1) NOTES B1 4)/B2 4)/B3 4)/B4 4)/B5/B7 4)/
B8/B12/B13/B14/B17/B18/B19/B20/B25 4)/B26/B28/
B29 3)/B30 4)/B32 3) 4)/B66 4) B38 4)/B39 4)/B40 4)/B41 4)/B42/B43/B46 3)/B48 B1/B2/B3/B4/B5/B6/B8/B19 GPS;
GLONASS;
BeiDou/Compass;
Galileo 1. 1) GNSS function is optional. 2. 2) EM120R-GL&EM160R-GL contain Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. 3. 3) LTE-FDD B29/B32 and LTE-TDD B46 support Rx only and are only for secondary component EM120R-GL&EM160R-GL_Hardware_Design 11 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design carrier. 4. 4) EM160R-GL supports up to 4 4 MIMO in DL direction. 5. 5) MIMO antennas only apply for EM160R-GL. 6. For details about CA combinations, refer to document [1]. EM120R-GL&EM160R-GL can be applied in the following fields:
Tablet PC and Laptop Remote Monitor System Vehicle System Wireless POS System Smart Metering System Wireless Router and Switch Other Wireless Terminal Devices 2.2. Key Features The following table describes the detailed features of EM120R-GL&EM160R-GL. Table 2: Key Features of EM120R-GL&EM160R-GL Feature Details Function Interface PCI Express M.2 Interface Power Supply Supply voltage: 3.1354.4 V Typical supply voltage: 3.7 V Transmitting Power Class 3 (23 dBm 2 dB) for LTE-FDD bands Class 3 (23 dBm 2 dB) for LTE-TDD bands Class 3 (24 dBm +1/-3 dB) for WCDMA EM160R-GL Support up to LTE Cat 16 Support 1.4100 MHz (5CA) RF bandwidth Support 4 4 MIMO in DL direction Up to 1000 Mbps (DL)/150 Mbps (UL) EM120R-GL Support up to LTE Cat 12 Support 1.460 MHz (3CA) RF bandwidth Support 2 2 MIMO in DL direction Up to 600 Mbps (DL)/150 Mbps (UL) LTE Features EM120R-GL&EM160R-GL_Hardware_Design 12 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design UMTS Features Internet Protocol Features Support 3GPP R9 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16QAM and 64QAM modulation DC-HSDPA: Max 42 Mbps (DL) HSUPA: Max 5.76 Mbps (UL) WCDMA: Max 384 Kbps (DL)/384 Kbps (UL) Support PPP/QMI/NTP*/TCP*/UDP*/FTP*/HTTP*/PING*/HTTPS*/
SMTP*/MMS*/FTPS*/SMTPS*/SSL* protocols Support the protocols PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) usually used for PPP connections SMS Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default
(U)SIM Interfaces Support (U)SIM card: 1.8/3.0 V Support Dual SIM Single Standby*
Compliant with USB 3.0 and 2.0 specifications, with maximum transmission rates up to 5 Gbps on USB 3.0 and 480 Mbps on USB 2.0. Used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA sentences output and voice over USB*
USB Interface Support USB serial drivers for:
Windows: 7/8/8.1/10 Linux: 2.6/3.x/4.14.15 Android: 4.x/5.x/6.x/7.x/8.x/9.x PCIe x1 Interface Antenna connectors Comply with PCI Express Specification, Revision 2.1 and support 5 Gbps per lane Used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA sentences output EM160R-GL Provide Main, Rx-diversity/GNSS, MIMO1 and MIMO2 antenna connectors EM120R-GL Provide Main and Rx-diversity/GNSS antenna connectors Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Gen9 Lite of Qualcomm Protocol: NMEA-0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Physical Characteristics Size: 42.0 0.15 mm 30.0 0.15 mm 2.3 0.1 mm Weight: approx. 6 g Temperature Range Operation temperature range: -25 C to +75 C 1) EM120R-GL&EM160R-GL_Hardware_Design 13 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Extended temperature range: -40 C to +85 C 2) Storage temperature range: -40 C to +90 C Firmware Upgrade USB 2.0 interface, PCIe interface and DFOTA RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. 3. 1) Within operating temperature range, the module is 3GPP compliant. For those end devices with bad thermal dissipation condition, a thermal pad or other thermal conductive components may be required between the module and main PCB to achieve the full operating temperature range. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their values and exceed the specified tolerances. When the temperature returns to normal operating temperature level, the module will meet 3GPP specifications again.
* means under development. 2.3. Functional Diagram The following figure shows a block diagram of EM120R-GL&EM160R-GL. Figure 1: Functional Diagram EM120R-GL&EM160R-GL_Hardware_Design 14 / 79 VCC FULL_CARD_POWER_OFF#
RESET#
e c a f r e t n I
. B
y e K 2 M s s e r p x E I C P USB2.0&USB3.0
(U)SIM1&(U)SIM2 W_DISABLE1#
WWAN_LED#
WAKE_ON_WAN#
RFFE PCM GPIOs PCIe W_DISABLE2#
PMIC T E 38.4M XO l o r t n o C Baseband IQ Control i r e v e c s n a r T NAND Flash +
DDR4 SDRAM Tx PRx MIMO1 MIMO2 DRx l s k c o B x R
x T ANT_DIV/GNSS MIMO1 MIMO2 ANT_MAIN LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE MIMO1 and MIMO2 antennas are only applicable to the EM160R-GL module. 2.4. Evaluation Board To help customers develop applications conveniently with EM120R-GL&EM160R-GL, Quectel supplies the evaluation board (M.2 EVB), USB to RS-232 converter cable, USB type-C cable, earphone, antenna and other peripherals to control or test the module. For more details, refer to document [2]. EM120R-GL&EM160R-GL_Hardware_Design 15 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3 Application Interfaces the
(U)SIM interfaces the definition and application of The physical connections and signal levels of EM120R-GL&EM160R-GL comply with PCI Express M.2 specifications. This chapter mainly describes following interfaces/signals/pins of EM120R-GL&EM160R-GL:
Power supply USB interface PCM interface*
PCIe interface Control and indicator signals*
Antenna tuner control interfaces*
Configuration pins COEX UART Interface*
NOTE
* means under development. EM120R-GL&EM160R-GL_Hardware_Design 16 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.1. Pin Assignment The following figure shows the pin assignment of EM120R-GL&EM160R-GL. The top side contains EM120R-GL&EM160R-GL and antenna connectors. Figure 2: Pin Assignment EM120R-GL&EM160R-GL_Hardware_Design 17 / 79 PIN74 PIN75 BOT TOP PIN10 PIN2 PIN11 PIN1 Pin Name CONFIG_2 GND GND CONFIG_1 RESET#
ANTCTL3 ANTCTL2 ANTCTL1 ANTCTL0 GND PCIE_REFCLK_P PCIE_REFCLK_M GND PCIE_RX_P PCIE_RX_M GND PCIE_TX_P PCIE_TX_M GND USB_SS_RX_P USB_SS_RX_M USB_SS_TX_P USB_SS_TX_M WAKE_ON_WAN#
CONFIG_0 GND GND DPR Notch Notch Notch Notch GND USB_DM USB_DP GND GND CONFIG_3 No. 75 73 71 69 67 65 63 61 59 57 55 53 51 49 47 45 43 41 39 37 35 33 31 29 27 25 23 21 11 9 7 5 3 1 No. 74 72 70 68 66 64 62 60 58 56 54 52 50 48 46 44 42 40 38 36 34 32 30 28 26 24 22 20 10 8 6 4 2 PCIE_WAKE_N PCIE_CLKREQ_N Pin Name VCC VCC VCC ANT_CONFIG USIM1_DET COEX_TXD COEX_RXD COEX3 RFFE_DATA RFFE_CLK PCIE_RST_N USIM2_VDD USIM2_RST USIM2_CLK USIM2_DATA USIM2_DET NC USIM1_VDD USIM1_DATA USIM1_CLK USIM1_RST PCM_SYNC PCM_DIN PCM_CLK Notch Notch Notch Notch VCC VCC W_DISABLE2#
PCM_DOUT/VDDIO WWAN_LED#
W_DISABLE1#
FULL_CARD_POWER_OFF#
LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.2. Pin Description The following tables show the pin definition and description of EM120R-GL&EM160R-GL. Table 2: Definition of I/O Parameters Description Analog Input Analog Output Digital Input Digital Output Bidirectional Open Drain Power Input Power Output Type AI AO DI DO IO OD PI PO 1 2 3 4 5 6 Table 3: Pin Description Pin No. M.2 Socket 2 WWAN Module Pinout EM120R-GL&EM1 60R-GL Pin Name I/O Description Comment CONFIG_3 CONFIG_3 NC 3.3V VCC PI Power supply GND GND Ground 3.3V VCC PI Power supply Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V GND GND Ground FULL_CARD_ POWER_OFF#(I)
(0/1.8V) FULL_CARD_ POWER_OFF#
DI Turn on/off the module. When it is at low level, the module is powered Pulled down internally. EM120R-GL&EM160R-GL_Hardware_Design 18 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design USB_D+
USB_DP AI/AO W_DISABLE1# W_DISABLE1#
DI Airplane mode control. Active low. 1.8/3.3 V power domain USB_D-
USB_DM AI/AO 10 GPIO_9 WWAN_LED#
OD off. When it is at high level, the module is powered on. USB 2.0 differential data bus (+) USB 2.0 differential data bus (-) RF status indication. Active low. GND Notch Notch Notch Notch Notch Notch Notch Notch Ground Notch Notch Notch Notch Notch Notch Notch Notch 20 GPIO_5
(AUDIO_0) PCM_CLK DI 21 CONFIG_0 CONFIG_0 GPIO_6
(AUDIO_1) PCM_DIN PO PCM data input GPIO_11
(WOWWAN#) WAKE_ON_ WAN#
OD Wake up the host. Active low. GPIO_7
(AUDIO_2) PCM_DOUT
/VDDIO DO/P O PCM data bit clock. In master mode, it is an output signal. In slave mode, it is an input signal. EM120R-GL: Connected to GND internally;
EM160R-GL: NC PCM data output;
Could be designed to be compatible with 1.8 V power supply. 1.8 V power domain. If unused, keep it open. 1.8 V power domain 1.8/3.3 V power domain 1.8 V power domain EM120R-GL&EM160R-GL_Hardware_Design 19 / 79 11 GND 12 Key 13 Key 14 Key 15 Key 16 Key 17 Key 18 Key 19 Key 7 8 9 22 23 24 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 25 DPR DPR DI Dynamic power reduction. Active low. 1.8 V power domain. 26 GPIO_10
(W_DISABLE2#) W_DISABLE2#
DI GNSS enable control. Active low. 1.8/3.3 V power domain 27 GND GND Ground 28 GPIO_8
(AUDIO_3) PCM_SYNC IO PCM data frame synchronization 1.8 V power domain 29 USB3.0-TX-
USB_SS_TX_M AO USB 3.0 transmit data
(-) USB 3.0 transmit data
(+) 30 UIM-RESET USIM1_RST DO
(U)SIM1 card reset 31 USB3.0-TX+
USB_SS_TX_P AO 32 UIM-CLK USIM1_CLK DO
(U)SIM1 card clock 33 GND GND Ground 1.8/3.0 V power domain 1.8/3.0 V power domain Pulled up to USIM1_VDD internally. 34 UIM-DATA USIM1_DATA IO
(U)SIM1 card data 35 USB3.0-RX-
USB_SS_RX_M AI USB 3.0 receive data (-) 36 UIM-PWR USIM1_VDD PO Power supply for
(U)SIM1 card 1.8/3.0 V power domain 37 USB3.0-RX+
USB_SS_RX_P AI USB 3.0 receive data (+) 38 N/C 39 GND NC GND NC Ground 40 GPIO_0
(SIM_DET2) USIM2_DET DI
(U)SIM2 card insertion detection 41 PETn0 PCIE_TX_M AO PCIe transmit data (-) USIM2_DATA IO
(U)SIM2 card data 42 GPIO_1
(SIM_DAT2) 44 GPIO_2
(SIM_CLK2) 43 PETp0 PCIE_TX_P AO PCIe transmit data (+) USIM2_CLK DO
(U)SIM2 card clock Pulled up internally. 1.8 V power domain. Pulled up to USIM2_VDD internally 1.8/3.0 V power domain EM120R-GL&EM160R-GL_Hardware_Design 20 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 45 GND GND Ground 46 48 GPIO_3
(SIM_RST2) GPIO_4
(SIM_PWR2) USIM2_RST DO
(U)SIM2 card reset 1.8/3.0 V power domain 47 PERn0 PCIE_RX_M AI PCIe receive data (-) USIM2_VDD PO Power supply for
(U)SIM2 card 1.8/3.0 V power domain 49 PERp0 PCIE_RX_P PCIe receive data (+) 50 PCIE_RST_N PCIE_RST_N PCIe reset input. Active low. 3.3 V power domain 51 GND GND Ground AI DI 52 PCIE_CLKREQ_ N PCIE_CLKREQ_N DO PCIe clock request. Active low. 3.3 V power domain 53 REFCLKn PCIE_REFCLK_M AI/AO PCIe reference clock (-) 54 PEWAKE#
PCIE_WAKE_N IO PCIe wake up the host. Active low. 3.3 V power domain 55 REFCLKp PCIE_REFCLK_P AI/AO PCIe reference clock (+) 56 N/C RFFE_CLK DO RFFE clock 57 GND GND Ground 58 N/C RFFE_DATA IO RFFE data 59 ANTCTL0 ANTCTL0 DO Antenna tuner control 60 COEX3 COEX3 IO COEX GPIO 61 ANTCTL1 ANTCTL1 DO Antenna tuner control 62 COEX2 COEX_RXD DI 63 ANTCTL2 ANTCTL2 DO Antenna tuner control COEX UART receive data COEX UART transmit data 64 COEX1 COEX_TXD DO 65 ANTCTL3 ANTCTL3 DO Antenna tuner control 66 SIM_DETECT USIM1_DET DI
(U)SIM1 card insertion detection 1.8 V power domain 1.8 V power domain 1.8 V power domain 1.8 V power domain 1.8 V power domain 1.8 V power domain 1.8 V power domain Pulled up internally. 1.8 V power EM120R-GL&EM160R-GL_Hardware_Design 21 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 67 RESET#
RESET#
DI WWAN reset input Active low. 68 SUSCLK (32kHz) ANT_CONFIG DI Antenna configuration 69 CONFIG_1 CONFIG_1 Connected to GND internally 70 3.3V VCC PI Power supply 71 GND GND Ground 72 3.3V VCC PI Power supply 73 GND GND Ground 74 3.3V VCC PI Power supply 75 CONFIG_2 CONFIG_2 NC NOTE Please keep all NC, reserved and unused pins unconnected. domain. Pulled up internally. 1.8 V power domain. Pulled up internally. 1.8 V power domain. Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnorm = 3.7 V Vmax = 4.4 V EM120R-GL&EM160R-GL_Hardware_Design 22 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.3. Power Supply The following table shows definition of VCC pins and ground pins. Table 4: Pin Definition of VCC and GND Pin No. Pin Name Power Domain Description 2, 4, 70, 72, 74 VCC 3.1354.4 V 3.7 V typical DC supply I/O PI Ground 3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73 GND 3.3.1. Decrease Voltage Drop The power supply range of the module is from 3.135 V to 4.4 V. Make sure that the input voltage never drops below 3.135 V, otherwise the module will be powered off automatically. The following figure shows the maximum voltage drop during radio transmission in 3G and 4G networks. Figure 3: Power Supply Limits during Radio Transmission To decrease voltage drop, a bypass capacitor of about 220 F with low ESR (ESR = 0.7 ) should be used, and a multi-layer ceramic chip capacitor (MLCC) array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to VCC pins. The main power supply from an external application must be a single voltage source. The width of VCC trace should be no less than 2 mm. In principle, a longer VCC trace indicates a wider VCC trace. In addition, in order to get a stable power source, it is recommended to use a zener diode with reverse zener voltage of 5.1 V and dissipation power more than 0.5 W. The following figure shows a reference EM120R-GL&EM160R-GL_Hardware_Design 23 / 79 Max Tx power Max Tx power VCC Min. 3.135 V Drop Ripple LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design circuit of VCC. Figure 4: Reference Circuit of VCC 3.3.2. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply can provide sufficient current (at least 2.5 A). If the voltage drop between the input and output is not too high, an LDO is suggested to be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VCC), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5 V input power source. The typical output of the power supply is about 3.7 V and the maximum load current is 3 A. Figure 5: Reference Design of Power Supply EM120R-GL&EM160R-GL_Hardware_Design 24 / 79 VCC
D1 C1 C2 C3 C4 C5 5.1 V 220 F 1 F 100 nF 33 pF 10 pF Module VCC LDO_IN VCC MIC29302WU 2 IN R1 N E U1 D N G 4 OUT J D A 1 3 5 D1 C1 C2 TVS 470F 100nF R2 R3
1 K 0 0 1
1 K 1 5 R4 C3 C4 C5 C6 470R 470F 100nF 33pF 10pF R5 4.7K MCU_POWER _ON/OFF R6 47K LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE In order to avoid damages to the internal flash, do not cut off the power supply directly when the module is working. It is suggested that the power supply should be cut off after the module is shut down. 3.4. Turn-on and Turn-off Scenarios 3.4.1. Turn on the Module Pulling up the FULL_CARD_POWER_OFF# pin will power on the module. The following table shows the pin definition of FULL_CARD_POWER_OFF#. Table 5: Pin Definition of FULL_CARD_POWER_OFF#
Pin Name Pin No. Description DC Characteristics Comment FULL_CARD _POWER_ OFF#
6 Turn on/off the module. When it is at low level, the module is powered off. When it is at high level, the module is powered on. VIHmax = 4.4 V VIHmin = 1.19 V VILmax = 0.2 V Pulled down internally. 3.4.1.1. Turn on the Module with a Host GPIO It is recommended to use a host GPIO to control FULL_CARD_POWER_OFF#. A simple reference circuit is illustrated in the following figure. Figure 6: Turn on the Module with a Host GPIO EM120R-GL&EM160R-GL_Hardware_Design 25 / 79 Host GPIO GND 1.8 V or 3.3 V Module FULL_CARD_POWER_OFF#
GND LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.4.1.2. Turn on the Module Automatically If FULL_CARD_POWER_OFF# is pulled up to VCC with a 510 k resistor, the module will be powered on automatically when the power supply for VCC is applied. A reference circuit is shown in the following figure. Figure 7: Turn on the Module Automatically 3.4.1.3. Turn on the Module with Compatible Design The following figure shows a compatible design to turn on the module automatically after power-up or by host. Figure 8: Turn on the Module with Compatible Design EM120R-GL&EM160R-GL_Hardware_Design 26 / 79 Host Module VCC_IO_HOST R1 10K GPIO GND FULL_CARD_POWER_OFF#
6 GND Notes:
1. The voltage of pin 6 should be no less than 1.19 V when it is at HIGH level. 2. The voltage level VCC_IO_HOST could be a 1.8 V or 3.3 V typically. Host Auto turn on Turn on by host R1 R2 10 K NM NM 0 Module VCC_IO_HOST R1 10K GPIO GND R2 NM_0 6 FULL_CARD_POWER_OFF#
GND Notes:
1. The voltage of pin 6 should be no less than 1.19 V when it is at HIGH level. 2. The voltage level VCC_IO_HOST could be 1.8 V or 3.3 V typically. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The turn-on scenario is illustrated in the following figure. Figure 9: Turn-on Timing of the Module Table 6: Description of Turn-on Timing of the Module Index Min. Typical Max. Comment T1 0 ms 50 ms T2 0 ms 20 ms
T3 T4 0 ms 15 ms 20 ms
100 ms
RESET# is pulled up internally, and it would be de-asserted 50 ms after VCC is powered on. FULL_CARD_POWER_OFF# could be de-asserted before or after RESET#, 20 ms is a recommended value when it is controlled by GPIO. DPR or ANT_CONFIG should be asserted before modem initialize. PCIE_RST_N should be de-asserted 100 ms after FULL_CARD_POWER_OFF#. EM120R-GL&EM160R-GL_Hardware_Design 27 / 79 VCC RESET#
T1 T2 FULL_CARD_POWER_OFF#
DPR/ANT_CONFIG PCIE_RST_N T3 T4 Typical 11.6 s OFF Booting Active LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.4.2. Turn off the Module 3.4.2.1. Turn off the Module through FULL_CARD_POWER_OFF#
Pulling down the FULL_CARD_POWER_OFF# pin will turn off the module. The turn-off scenario is illustrated in the following figure. Figure 10: Timing of Turning off the Module through FULL_CARD_POWER_OFF#
T1 T2 T3 Table 7: Description of the Timing of Resetting the Module througn FULL_CARD_POWER_OFF#
Index Min. Typical Max. Comments 0 ms 20 ms
PCIE_RST_N should be asserted before RESET#. 0 ms 10 ms 200 ms RESET# is recommended to be asserted before FULL_CARD_POWER_OFF#
10 ms
If power is always on, it could be ignored. 3.4.2.2. Turn off the Module through AT Command It is a safe way to use AT+QPOWD command to turn off the module. For more details about the command, refer to document [3]. For the circuit design of Figure 6, pull down FULL_CARD_POWER_OFF# pin, or cut off power supply of VCC after the modules USB/PCIe is removed. Otherwise, the module will be powered on again. EM120R-GL&EM160R-GL_Hardware_Design 28 / 79 VCC FULL_CARD_POWER_OFF#
T3 RESET#
PCIE_RST_N T2 T1 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 11: Timing of Turning off the Module through AT Command and FULL_CARD_POWER_OFF#
For the circuit design of Figure 7, cut off power supply of VCC after the modules USB/PCIe is removed, as illustrated in Figure 11. Otherwise, the module will be powered on again. Figure 12: Timing of Turning off the Module through AT Command and Power Supply NOTE Please pull down FULL_CARD_POWER_OFF# pin immediately or cut off the power supply of VCC when the host detects that the module is removed. EM120R-GL&EM160R-GL_Hardware_Design 29 / 79 VCC RESET#(H) USB/PCIe FULL_CARD_POWER_OFF#
AT+QPOWD USB/PCIe remove Module Status Running Power-off procedure OFF VCC RESET#(H) USB/PCIe FULL_CARD_POWER_OFF#(H) AT+QPOWD USB/PCIe remove Module Status Running Power-off procedure OFF LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.5. Reset The RESET# pin is used to reset the module. The module can be reset by driving RESET# to a low-level voltage for 200700 ms. Table 8: Pin Definition of RESET#
Pin Name Pin No. Description DC Characteristics Comment RESET#
67 Reset the module VIHmax = 2.1 V VIHmin = 1.3 V VILmax = 0.5 V Pulled up internally. 1.8 V power domain. An open collector/drain driver or button can be used to control the RESET# pin. Figure 13: Reference Circuit of RESET_N with NPN Driving Circuit EM120R-GL&EM160R-GL_Hardware_Design 30 / 79 Host Module VDD 1.8 V R1 100K Reset Logic Reset pulse RESET_N 67 GPIO Q1 NPN R2 1K R3 100K 200700 ms LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 14: Reference Circuit of RESET_N with NMOS Driving Circuit Figure 15: Reference Circuit of RESET_N with Button EM120R-GL&EM160R-GL_Hardware_Design 31 / 79 Host Module VDD 1.8 V R1 100K Reset Logic Reset pulse RESET_N 67 GPIO Q2 NMOS R4 10 R5 100K 200700 ms Module VDD 1.8 V R1 100K RESET_N 67 Reset Logic S1 TVS C1 33 pF 200700 ms Note: The capacitor C1 is recommended to be less than 47 pF. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The reset scenario is illustrated in the following figure. Figure 16: Timing of Resetting the Module T1 T2 T3 T4 T5 Table 9: Timing of Resetting the Module Index Min. Typical Max. Comments 0 ms 20 ms
PCIE_RST_N should be asserted before RESET#. 0 ms 10 ms 200 ms 0 ms 20 ms 200 ms
100 ms
200 ms
700 ms RESET# should be asserted before FULL_CARD_POWER_OFF#. RESET# should be de-asserted after FULL_CARD_POWER_OFF#
PCIE_RST_N should be de-asserted 100 ms after FULL_CARD_POWER_OFF#. RESET# should be de-asserted no longer than 700 ms, otherwise the module would reset several times. NOTE Please ensure that there is no large capacitance on RESET# pin. 3.6. (U)SIM Interfaces The (U)SIM interfaces circuitry meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported, and Dual SIM Single Standby* function is supported. EM120R-GL&EM160R-GL_Hardware_Design 32 / 79 VCC (H) FULL_CARD_POWER_OFF#
RESET#
T2 T5 PCIE_RST_N T1 T3 T4 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 10: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM1_VDD 36 PO Power supply for (U)SIM1 card 32 30 44 46 USIM1_DATA 34 IO
(U)SIM1 card data USIM1_CLK DO
(U)SIM1 card clock USIM1_RST DO
(U)SIM1 card reset USIM1_DET 66 DI
(U)SIM1 card insertion detection. Active high. USIM2_VDD 48 PO Power supply for (U)SIM2 card USIM2_DATA 42 IO
(U)SIM2 card data USIM2_CLK DO
(U)SIM2 card clock USIM2_RST DO
(U)SIM2 card reset USIM2_DET 40 DI
(U)SIM2 card insertion detection. Active high. Either 1.8 V or 3.0 V is supported by the module automatically. Internally pulled up. When (U)SIM1 card is present, it is at high level. When (U)SIM1 card is absent, it is at low level. Either 1.8 V or 3.0 V is supported by the module automatically. Internally pulled up. When (U)SIM2 card is present, it is at high level. When (U)SIM2 card is absent, it is at low level. EM120R-GL&EM160R-GL support (U)SIM card hot-plug via the USIM_DET pin, which is a level trigger pin. The USIM_DET is normally short-circuited to ground when (U)SIM card is not inserted. When the
(U)SIM card is inserted, the USIM_DET will change from low to high level. The rising edge will indicate insertion of the (U)SIM card. When the (U)SIM card is removed, the USIM_DET will change from high to low level. This falling edge will indicate the absence of the (U)SIM card. EM120R-GL&EM160R-GL_Hardware_Design 33 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following figure shows a reference design for a (U)SIM interface with normally closed (U)SIM card connector. Figure 17: Reference Circuit of Normally Closed (U)SIM1 Card Connector Normally Closed (U)SIM Card Connector:
When the (U)SIM is absent, CD is short-circuited to SW and USIM_DET is at low level. When the (U)SIM is inserted, CD is open to SW and USIM_DET is at high level. The following figure shows a reference design for a (U)SIM interface with normally open (U)SIM card connector. Figure 18: Reference Circuit of Normally Open (U)SIM1 Card Connector EM120R-GL&EM160R-GL_Hardware_Design 34 / 79 USIM_VDD GND 15K 100 nF
(U)SIM Card Connector Module USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA 22R 22R 22R VCC RST CLK CD GND VPP IO SW GND 33 pF 33 pF 33 pF GND GND USIM_VDD GND 15K 100 nF
(U)SIM Card Connector 1.8 V 4.7K Module USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA 22R 22R 22R GND VPP IO SW VCC RST CLK CD 33K 33 pF 33 pF 33 pF GND GND LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Normally Open (U)SIM Card Connector:
When the (U)SIM is absent, CD is open to SW and USIM_DET is at low level. When the (U)SIM is inserted, CD is short-circuited to SW and USIM_DET is at high level. If (U)SIM card detection function is not needed, keep USIM_DET unconnected. The following figure shows a reference circuit for a (U)SIM card interface with a 6-pin (U)SIM card connector. Figure 19: Reference Circuit of a 6-Pin (U)SIM1 Card Connector EM120R-GL&EM160R-GL provide two (U)SIM interfaces. (U)SIM1 interface is used for external (U)SIM card only, and (U)SIM2 interface is used for external (U)SIM card or internal eSIM card. It should be noted that, when (U)SIM2 interface is used for an external (U)SIM card, the reference circuits are the same as those of (U)SIM1 interface. When (U)SIM2 interface is used for the internal eSIM card, pins 40, 42, 44, 46 and 48 of the module must be kept open. EM120R-GL&EM160R-GL_Hardware_Design 35 / 79 USIM_VDD GND Module USIM_VDD USIM_RST USIM_CLK USIM_DATA 15K 22R 22R 22R 100 nF
(U)SIM Card Connector VCC RST CLK GND VPP IO 33 pF 33 pF 33 pF GND GND LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design A recommended compatible design of (U)SIM2 interface is shown below. Figure 20: Recommended Compatible Design of (U)SIM2 Interface In order to enhance the reliability and availability of the (U)SIM card in customers applications, follow the criteria below when designing the (U)SIM circuit:
Keep placement of (U)SIM card connector as close as possible to the module. Keep the trace length as less than 200 mm as possible. Keep (U)SIM card signals away from RF and VCC traces. Assure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5 mm to maintain the same electric potential. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode array with parasitic capacitance not exceeding 10 pF. The 22 resistors should be added in series between the module and the (U)SIM card connector so as to suppress EMI spurious transmission and enhance ESD protection. The 33 pF capacitors are used to filter out RF interference. Note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA trace can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. NOTE
* means under development. EM120R-GL&EM160R-GL_Hardware_Design 36 / 79 Module USIM2_VDD 10-20K 100 nF
(U)SIM Card Connector VPP eSIM USIM2_VDD USIM2_RST USIM2_CLK USIM2_DET USIM2_DATA 48 46 44 40 42 GND 0 0 0 0 0 22 22 22 VCC RST CLK CD IO GND 33 pF33 pF33 pF TVS Note: The five 0 resistors must be close to M.2 socket connector, and all other components should be close to (U)SIM card connector in PCB layout. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.7. USB Interface EM120R-GL&EM160R-GL provide one integrated Universal Serial Bus (USB) interface which complies with the USB 3.0/2.0 specifications and supports super speed (5 Gbps) on USB 3.0, high speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB interface. Table 11: Pin Definition of USB Interface Pin No. Pin Name I/O Description Comment USB_DP AI/AO USB_DM AI/AO USB 2.0 differential data bus
(+) USB 2.0 differential data bus
(-) USB_SS_TX_M AO USB 3.0 transmit data (-) USB_SS_TX_P AO USB 3.0 transmit data (+) USB_SS_RX_M AI USB 3.0 receive data (-) USB_SS_RX_P AI USB 3.0 receive data (+) Require differential impedance of 90 Require differential impedance of 90 Require differential impedance of 90 7 9 29 31 35 37 For more details about the USB 3.0 & 2.0 specifications, visit http://www.usb.org/home. EM120R-GL&EM160R-GL_Hardware_Design 37 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The USB 2.0 interface is recommended to be reserved for firmware upgrade in customers designs. The following figure shows a reference circuit of USB 3.0/USB 2.0 interface. Figure 21: Reference Circuit of USB 3.0/2.0 Interface AC coupling capacitors C5 and C6 must be placed close to the host and close to each other. C1 and C2 have been integrated inside the module, so do not place these two capacitors on customers schematic and PCB. In order to ensure the signal integrity of USB 2.0 data traces, R1, R2, R3 and R4 components must be placed close to the module, and the stubs must be minimized in PCB layout. In order to ensure that the USB interface designs correspond with USB specifications, comply with the following principles. It is important to route the USB 2.0 & 3.0 signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90 . For USB 2.0 signal traces, the trace lengths must be less than 120 mm, and the differential data pair matching is less than 2 mm (15 ps). For USB 3.0 signal traces, the maximum length of TX and RX differential data pair is recommended to be less than 100 mm, and the TX and RX differential data pair matching is less than 0.7 mm (5 ps). Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. It is important to route the USB 2.0 & 3.0 differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. If USB connector is used, keep the ESD protection components as close as possible to the USB connector. Pay attention to the influence of junction capacitance of ESD protection components on USB 2.0 & 3.0 data traces. Typically, the capacitance value should be less than 2.0 pF for USB 2.0, and less than 0.4 pF for USB 3.0. If possible, reserve four 0 resistors (R1R4) on USB_DP and USB_DM traces, as shown in the above figure. EM120R-GL&EM160R-GL_Hardware_Design 38 / 79 C5 100 nF C6 100 nF Host USB_SS_TX_P USB_SS_TX_M USB_SS_RX_P USB_SS_RX_M USB_DM USB_DP Module C1 100 nF C2 100 nF BB USB_SS_RX_P USB_SS_RX_M USB_SS_TX_P USB_SS_TX_M R10 R20 USB_DM USB_DP 37 35 31 29 9 7 Test Points R3 NM-0 R4 NM-0 ESD Minimize these stubs in PCB layout. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE
* means under development. 3.8. PCIe Interface EM120R-GL and EM160R-GL provide one integrated PCIe (Peripheral Component Interconnect Express) interface which complies with the PCI Express Specification, Revision 2.1 and supports 5 Gbps per lane. The PCIe interface is used for data transmission, GNSS NMEA sentences output, software debugging and firmware upgrade. The following table shows the pin definition of PCIe interface. Table 12: Pin Definition of PCIe Interface Pin No. Pin Name I/O Description Comment PCIE_REFCLK_P AI/AO PCIe reference clock (+) PCIE_REFCLK_M AI/AO PCIe reference clock (-) PCIE_RX_P AI PCIe receive data (+) PCIE_RX_M PCIe receive data (-) PCIE_TX_P PCIe transmit data (+) PCIE_TX_M PCIe transmit data (-) AI AO AO Require differential impedance of 95 . Require differential impedance of 95 Require differential impedance of 95 PCIE_RST_N DI 3.3 V power domain PCIE_CLKREQ_N DO 3.3 V power domain PCIe reset input. Active low. PCIe clock request. Active low. PCIe wake up the host. Active low. PCIE_WAKE_N DO 3.3 V power domain 55 53 49 47 43 41 50 52 54 EM120R-GL&EM160R-GL_Hardware_Design 39 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.8.1. Endpoint Mode EM120R-GL and EM160R-GL support endpoint (EP) mode. In this mode, the modules are configured as a PCIe EP device. The following figure shows a reference circuit of PCIe endpoint mode. Figure 22: PCIe Interface Reference Circuit (EP Mode) In order to ensure the signal integrity of PCIe interface, AC coupling capacitors C5 and C6 should be placed close to the host on PCB. C1 and C2 have been integrated inside the module, so do not place these two capacitors on customers schematic and PCB. EM120R-GL&EM160R-GL_Hardware_Design 40 / 79 Host PCIE_REFCLK_P PCIE_REFCLK_M PCIE_TX_P PCIE_TX_M PCIE_RX_P PCIE_RX_M PCIE_WAKE_N PCIE_CLKREQ_N PCIE_RST_N C5 100 nF C6 100 nF R1 10K R2 10K R3 10K VCC_IO_HOST PCIE_REFCLK_P PCIE_REFCLK_M PCIE_RX_P PCIE_RX_M PCIE_TX_P PCIE_TX_M 55 53 49 47 43 41 Module C1 100 nF C2 100 nF BB PCIE_WAKE_N PCIE_CLKREQ_N PCIE_RST_N 54 52 50 Note: The voltage level VCC_IO_HOST depends on the host side due to open drain in pin 50, 52 and 54. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 23: PCIe Power-on Timing Requirements of M.2 Specification Figure 24: PCIe Power-on Timing Requirements of the Module EM120R-GL&EM160R-GL_Hardware_Design 41 / 79 VCC T1 FULL_CARD_POWER_OFF#
T2 RESET#
PCIE_CLKREQ_N T3 T4 T5 PCIE_RST_N PCIE_REFCLK Active clock state LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 13: Description of PCIe Power-on Timing Requirements of the Module Index Min. Typical Max. Comment T1 0 ms 20 ms T2 T3 T4
50 ms 70 ms 100 ms T5 100 s
FULL_CARD_POWER_OFF# could be de-asserted before or after RESET#, 20 ms is a recommended value when it is controlled by GPIO. RESET# is pulled up internally, and it would be de-asserted 50 ms after VCC is powered on. PCIE_CLKREQ_N would be asserted 70 ms after FULL_CARD_POWER_OFF#. PCIE_RST_N should be de-asserted after PCIE_CLKREQ_N. The host must ensure that the reference clock is in the active clock state for at least a period specified by TPCIE_RST_N-CLK, prior to PCIE_RST_N de-assertion. The following principles of PCIe interface design should be complied with so as to meet PCIe V2.1 specifications. For PCIe signal traces, the TX and RX differential data pair maximum length is recommended to be It is important to route the PCIe signal traces as differential pairs with total grounding. less than 250 mm, the TX and RX differential data pair matching are less than 0.7 mm (5 ps). Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. It is important to route the PCIe differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. 3.8.2. USB Version and PCIe Only Version Beginning with ES2 (engineering samples), EM120R-GL&EM160R-GL support USB version and PCIe only version described as below:
USB version:
Support all USB 3.0/2.0 features Support MBIM/QMI/QRTR/AT Support firmware upgrade PCIe only version:
Support MBIM/QMI/QRTR/AT Support BIOS PCIe early initial Support firmware upgrade If EM120R-GL&EM160R-GL work at PCIe only version by burnt eFuse, the modules cannot switch back to USB version. EM120R-GL&EM160R-GL_Hardware_Design 42 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.9. PCM Interface*
EM120R-GL&EM160R-GL support audio communication via Pulse Code Modulation (PCM) digital interface. The PCM interface supports the following modes:
Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256, 512, 1024 or 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4096 kHz PCM_CLK at 16 kHz PCM_SYNC. In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a 256 kHz PCM_CLK and an 8 kHz, 50% duty cycle PCM_SYNC only. EM120R-GL&EM160R-GL support 16-bit linear data format. The following figures show the primary modes timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary modes timing relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK. Figure 25: Primary Mode Timing EM120R-GL&EM160R-GL_Hardware_Design 43 / 79 125 s PCM_CLK 1 2 255 256 PCM_SYNC PCM_OUT PCM_IN MSB LSB MSB MSB LSB MSB LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 26: Auxiliary Mode Timing The following table shows the pin definition of PCM interface which can be applied on audio codec design. Table 14: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_DIN 22 DI PCM data input 1.8 V power domain PCM_DOUT 24 DO PCM data output 1.8 V power domain PCM_SYNC 28 IO 1.8 V power domain PCM data frame synchronization PCM data bit clock In master mode, it is an output signal. In slave mode, it is an input signal. PCM_CLK 20 IO 1.8 V power domain. If unused, keep it open. The clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. Refer to document [3] for details about AT+QDAI command. EM120R-GL&EM160R-GL_Hardware_Design 44 / 79 125 s PCM_CLK 1 2 31 32 PCM_SYNC PCM_OUT PCM_IN MSB MSB LSB LSB LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design NOTE
* means under development. 3.10. Control and Indicator Signals*
The following table shows the pin definition of control and indicator signals. Table 15: Definition of Control and Indicator Signals Pin Name Pin No. I/O Power Domain Description WWAN_LED#
10 OD 3.3 V WAKE_ON_WAN#
23 OD 1.8/3.3 V W_DISABLE1#
8 DI 1.8/3.3 V W_DISABLE2#
DI 1.8/3.3 V DPR ANT_CONFIG DI DI 1.8 V 1.8 V 26 25 68 RF status indication. Active low. Wake up the host. Active low. Airplane mode control. Active low. GNSS enable control. Active low. Dynamic power reduction. Active low. Antenna configuration pin. NOTE
* means under development. 3.10.1. W_DISABLE1# Signal EM120R-GL&EM160R-GL provide a W_DISABLE1# signal to disable or enable airplane mode through hardware operation. The W_DISABLE1# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. In airplane mode, the RF function will be disabled. The RF function can also be enabled or disabled through software AT commands. The following table shows the RF function status of the modules. EM120R-GL&EM160R-GL_Hardware_Design 45 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 16: RF Function Status W_DISABLE1# Level AT Commands RF Function Status High Level AT+CFUN=1 Enabled High Level Low Level AT+CFUN=0 AT+CFUN=4 AT+CFUN=0 AT+CFUN=1 AT+CFUN=4 Disabled Disabled 3.10.2. W_DISABLE2# Signal EM120R-GL&EM160R-GL provide a W_DISABLE2# pin to disable or enable the GNSS function. The W_DISABLE2# pin is pulled up by default. Driving it to low level will disable the GNSS function. The combination of W_DISABLE2# pin and AT commands can control the GNSS function. Table 17: GNSS Function Status W_DISABLE2# Level AT Commands GNSS Function Status High Level AT+QGPS=1 Enabled High Level AT+QGPSEND Low Level AT+QGPS=1 Disabled Low Level AT+QGPSEND EM120R-GL&EM160R-GL_Hardware_Design 46 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design A simple level shifter based on diodes is used on W_DISABLE1# pin and W_DISABLE2# pin which are pulled up to a 1.8 V voltage in the module, as shown in the following figure. So, the control signals (GPIO) of the host device could be a 1.8 V or 3.3 V voltage level and pull-up resistor is not needed on the host side. These two signals are active low, and a reference circuit is shown below. Figure 27: W_DISABLE1# and W_DISABLE2# Reference Circuit 3.10.3. WWAN_LED# Signal The WWAN_LED# signal is used to indicate RF status of the modules, and its typical current consumption is up to 10 mA. In order to reduce the current consumption of the LED, a resistor must be placed in series with the LED, as illustrated in the figure below. The LED is ON when the WWAN_LED# signal is at a low voltage level. Figure 28: WWAN_LED# Signal Reference Circuit EM120R-GL&EM160R-GL_Hardware_Design 47 / 79 Host GPIO GPIO VCC_IO_HOST R1 10K R2 10K Module VDD 1.8 V R3 10K R4 10K BB W_DISABLE2#
W_DISABLE1#
26 8 Note:
Hosts GPIO could be a 1.8 V or 3.3 V voltage level. Host Module VCC R1 200 LED GPIO WWAN_LED#
10 PMU Note: This VCC could be the power supply of the module. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following table shows the RF status indicated by WWAN_LED# signal. Table 18: RF Status Indications of WWAN_LED# Signal LED On Off RF Status On Off RF function is turned off if any of the following circumstances occurs:
The (U)SIM card is not working. W_DISABLE1# signal is at low level (airplane mode enabled). WWAN_LED# Level Low Level High Level NOTE 3.10.4. WAKE_ON_WAN# Signal The WAKE_ON_WAN# signal is an open collector signal, which requires a pull-up resistor on the host. When a URC returns, a 1s low level pulse signal will be outputted to wake up the host. The module operation status indicated by WAKE_ON_WAN# is shown as below. Table 19: State of the WAKE_ON_WAN# Signal WAKE_ON_WAN# State Module Operation Status Output a 1s low level pulse signal Call/SMS/Data is incoming (to wake up the host) Always at high level Idle/Sleep EM120R-GL&EM160R-GL_Hardware_Design 48 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 29: WAKE_ON_WAN# Signal Reference Circuit Design 3.10.5. DPR EM120R-GL&EM160R-GL provide a DPR (Dynamic Power Reduction) signal for body SAR (Specific Absorption Rate) detection. The signal to EM120R-GL&EM160R-GL modules to provide an input trigger which will reduce the output power in the radio transmission. is sent by a host system proximity sensor Table 20: Function of the DPR Signal DPR Level Function High/Floating Max transmitting power will NOT back off Low Max transmitting power will back off by executing AT+QCFG="sarcfg" command NOTE Please refer to document [3] for more details about AT+QCFG="sarcfg" command. EM120R-GL&EM160R-GL_Hardware_Design 49 / 79 Host Module GPIO WAKE_ON_WAN#
23 BB VCC_IO_HOST R1 10K H L 1 s Wake up the host Note: The voltage level on VCC_IO_HOST depends on the host side due to open drain in pin 23. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.10.6. ANT_CONFIG Signal EM160R-GL provides an ANT_CONFIG signal for antenna configuration, however, EM120R-GL does not support it since EM120R-GL only supports 2 antennas. The signal is sent by a host system to EM160R-GL module. ANT_CONFIG is an input port which is pulled high internally by default. The definition of ANT_CONFIG signal is shown as below table. Table 21: Pin Definition of ANT_COMNFIG of EM160R-GL ANT_CONFIG Level Function High/Floating Low Level Support 2 antennas Support 4 antennas 3.11. COEX UART Interface*
EM120R-GL&EM160R-GL provide one COEX UART interface. The following table shows the COEX UART interface pin definition. Table 22: Pin Definition of COEX UART Interface Pin Name Pin No. I/O Description Comment COEX3 60 GPIO 1.8 V power domain COEX UART Interface 1.8 V power domain 1.8 V power domain COEX_RXD 62 COEX_TXD 64 IO IO IO NOTE
* means under development. EM120R-GL&EM160R-GL_Hardware_Design 50 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.12. Antenna Tuner Control Interfaces*
ANTCTL [0:3] and RFFE signals are used for antenna tuner control and should be routed to an appropriate antenna control circuit. More details about the interface will be added in a future version of the document. 3.12.1. Antenna Tuner Control Interface through GPIOs Table 23: Pin Definition of Antenna Tuner Control Interface through GPIOs Pin Name Pin No. I/O Description Comment ANTCTL0 ANTCTL1 ANTCTL2 ANTCTL3 59 61 63 65 DO DO DO DO Antenna tuner control 1.8 V power domain Antenna tuner control 1.8 V power domain Antenna tuner control 1.8 V power domain Antenna tuner control 1.8 V power domain 3.12.2. Antenna Tuner Control Interface through RFFE Table 24: Pin Definition of Antenna Tuner Control Interface through RFFE Pin Name Pin No. I/O Description Comment RFFE_CLK 56 RFFE_DATA 58 DO IO RFFE serial interface used for external tuner control If unused, keep it open. If unused, keep it open. NOTE
* means under development. EM120R-GL&EM160R-GL_Hardware_Design 51 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 3.13. Configuration Pins EM120R-GL&EM160R-GL provide four configuration pins which are defined as below. 3.13.1. EM160R-GL configuration pins Table 25: List of EM160R-GL Configuration Pins Pin No. Pin Name Power Domain Description 21 69 75 1 CONFIG_0 CONFIG_1 CONFIG_2 CONFIG_3 0 0 0 0 NC NC NC The following figure shows a reference circuit of these four pins. Connected to GND internally. Figure 30: Recommended Circuit of EM160R-GL Configuration Pins EM120R-GL&EM160R-GL_Hardware_Design 52 / 79 Host VCC_IO_HOST EM160R-GL R1 R2 R3 100K 100K 100K R4 100K GPIO GPIO GPIO GPIO CONFIG_0 NM-0 CONFIG_1 0 CONFIG_2 NM-0 CONFIG_3 NM-0 21 69 75 1 Note: The voltage level VCC_IO_HOST depends on the host side, and could be a 1.8 V or 3.3 V voltage level. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 26: List of EM160R-GL Configuration Pins Config_0
(Pin 21) Config_1
(Pin 69) Config_2
(Pin 75) Config_3
(Pin 1) Module Type and Main Host Interface Port Configuration NC GND NC NC Vender defined N/A 3.13.2. EM120R-GL configuration pins Table 27: List of EM120R-GL Configuration Pins Pin No. Pin Name Power Domain Description 21 69 75 1 CONFIG_0 CONFIG_1 CONFIG_2 CONFIG_3 0 0 0 0 Connected to GND internally. Connected to GND internally. NC NC The following figure shows a reference circuit of these four pins. Figure 31: Recommended Circuit of EM120R-GL Configuration Pins EM120R-GL&EM160R-GL_Hardware_Design 53 / 79 Host VCC_IO_HOST EM120R-GL R1 R2 R3 100K 100K 100K R4 100K GPIO GPIO GPIO GPIO CONFIG_0 CONFIG_1 0 0 CONFIG_2 NM-0 CONFIG_3 NM-0 21 69 75 1 Note: The voltage level VCC_IO_HOST depends on the host side, and could be a 1.8 V or 3.3 V voltage level. LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 28: List of EM120R-GL Configuration Pins Config_0
(Pin 21) Config_1
(Pin 69) Config_2
(Pin 75) Config_3
(Pin 1) Module Type and Main Host Interface Port Configuration GND GND NC NC Vender defined N/A EM120R-GL&EM160R-GL_Hardware_Design 54 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 4 GNSS Receiver 4.1. General Description EM120R-GL&EM160R-GL include a fully integrated global navigation satellite system solution that supports Gen9-Lite of Qualcomm (GPS, GLONASS, BeiDou/Compass and Galileo). The modules support standard NMEA-0183 protocol, and output NMEA sentences at 1 Hz data update rate via USB interface by default. By default, EM120R-GL&EM160R-GL GNSS engine is switched off. It can only be switched on via AT command. For more details about GNSS engine technology and configurations, refer to document [4]. EM120R-GL&EM160R-GL_Hardware_Design 55 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 5 Antenna Connection EM120R-GL and EM160R-GL provide Main, Rx-diversity/GNSS and MIMO antenna connectors 1) which are used to resist the fall of signals caused by high speed movement and multipath effect. The impedance of antenna ports is 50 . EM160R-GL provides a Main, an Rx-diversity/GNSS and two MIMO antenna connectors. EM120R-GL provides a Main and an Rx-diversity/GNSS antenna connectors. 5.1. Antenna Connectors The antenna connectors are shown below. Figure 32: Antenna Connectors on the EM160R-GL Module EM120R-GL&EM160R-GL_Hardware_Design 56 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 33: Antenna Connectors on the EM120R-GL Module 5.1.1. Operating Frequency Table 29: Operating Frequencies of EM120R-GL&EM160R-GL 3GPP Band Transmit Receive WCDMA B1 19201980 WCDMA B2 18501910 WCDMA B3 17101785 WCDMA B4 17101755 WCDMA B5 WCDMA B6 WCDMA B8 WCDAM B19 824849 830840 880915 830845 21102170 19301990 18051880 21102155 869894 875885 925960 875890 Unit MHz MHz MHz MHz MHz MHz MHz MHz EM120R-GL&EM160R-GL_Hardware_Design 57 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design LTE B1 LTE B2 LTE B3 LTE B4 LTE B5 LTE B7 LTE B8 LTE B12 LTE B13 LTE B14 LTE B17 LTE B18 LTE B19 LTE B20 LTE B25 LTE B26 LTE B28 LTE B29 1) LTE B30 LTE B32 1) LTE B38 LTE B39 LTE B40 LTE B41 LTE B42 25002570 26202690 18501915 19301995 19201980 18501910 17101785 17101755 824849 880915 699716 777787 788798 704716 815830 830845 832862 814849 703748
23052315 25702620 18801920 23002400 24962690 34003600 21102170 19301990 18051880 21102155 869894 925960 729746 746756 758768 734746 860875 875890 791821 859894 758803 717728 23502360 14521496 25702620 18801920 23002400 24962690 34003600 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EM120R-GL&EM160R-GL_Hardware_Design 58 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 36003800 51505925 35503700 17101780 36003800 51505925 35503700 21102200 MHz MHz MHz MHz 1) LTE-FDD B29/32 and LTE-TDD B46 support Rx only and are only for secondary component carrier. 5.2. GNSS Antenna Connector The following table shows frequency specification of GNSS antenna connector. Table 30: GNSS Frequency Type Frequency GPS/Galileo 1575.42 1.023 GLONASS 1601.65 4.15 BeiDou/Compass 1561.098 2.046 Unit MHz MHz MHz LTE B43 LTE B46 1) LTE B48 LTE B66 NOTE EM120R-GL&EM160R-GL_Hardware_Design 59 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirements The following table shows the requirements on Main, Rx-diversity/GNSS and MIMO antennas. Table 31: Antenna Requirements of EM160R-GL Type Requirements Supported Bands Main Antenna
(Tx/Rx) Rx-diversity/
GNSS Antenna MIMO1 Antenna Rx VSWR: 2 Efficiency: > 30%
Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB
(699960 MHz) Cable Insertion Loss: < 1.5 dB
(17102200 MHz) Cable Insertion Loss: < 2dB
(23002690 MHz) VSWR: 2 Efficiency: > 30%
Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB
(699960 MHz) Cable Insertion Loss: < 1.5 dB
(15592200 MHz) Cable Insertion Loss: < 2 dB
(23002690 MHz) VSWR: 2 Efficiency: > 30%
Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB
(699960 MHz) Cable Insertion Loss: < 1.5 dB
(15592200 MHz) LTE:
B1/B2/B3/B4/B5/B7/B8/B12/B13/
B14/B17/B18/B19/B20/B25/B26/
B28/B29/B30/B32/B38/B39/B40/
B41/B42/B43/B46/B48/B66 WCDMA:
B1/B2/B3/B4/B5/B6/B8/B19 LTE:
B1/B2/B3/B4/B5/B7/B8/B12/B13/
B14/B17/B18/B19/B20/B25/B26/
B28/B29/B30/B32/B38/B39/B40/
B41/B42/B43/B46/B48/B66 WCDMA:
B1/B2/B3/B4/B5/B6/B8/B19 GNSS:
GPS;
GLONASS;
BeiDou/Compass;
Galileo LTE:
B1/B2/B3/B4/B7/B25/
B30/B32/B38/B39/B40/B41/B66 EM120R-GL&EM160R-GL_Hardware_Design 60 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Table 32: Antenna Requirements of EM120R-GL Type Requirements Supported Bands Cable Insertion Loss: < 2 dB
(23002690 MHz) VSWR: 2 Efficiency: > 30%
Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB
(699960 MHz) Cable Insertion Loss: < 1.5 dB
(15592200 MHz) Cable Insertion Loss: < 2 dB
(23002690 MHz) VSWR: 2 Efficiency: > 30%
Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB
(699960 MHz) Cable Insertion Loss: < 1.5 dB
(17102200 MHz) Cable Insertion Loss: < 2dB
(23002690 MHz) VSWR: 2 Efficiency: > 30%
Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss: < 1 dB
(699960 MHz) Cable Insertion Loss: < 1.5 dB
(15592200 MHz) Cable Insertion Loss: < 2 dB
(23002690 MHz) MIMO2 Antenna
(Rx) Main Antenna
(Tx/Rx) Rx-diversity/
GNSS Antenna LTE:
B1/B2/B3/B4/B7/B25/
B30/B32/B38/B39/B40/B41/B66 LTE:
B1/B2/B3/B4/B5/B7/B8/B12/B13/
B14/B17/B18/B19/B20/B25/B26/
B28/B29/B30/B32/B38/B39/B40/
B41/B42/B43/B46/B48/B66 WCDMA:
B1/B2/B3/B4/B5/B6/B8/B19 LTE:
B1/B2/B3/B4/B5/B7/B8/B12/B13/
B14/B17/B18/B19/B20/B25/B26/
B28/B29/B30/B32/B38/B39/B40/
B41/B42/B43/B46/B48/B66 WCDMA:
B1/B2/B3/B4/B5/B6/B8/B19 GNSS:
GPS;
GLONASS;
BeiDou/Compass;
Galileo EM120R-GL&EM160R-GL_Hardware_Design 61 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation EM120R-GL and EM160R-GL are mounted with standard 2 mm 2 mm receptacle RF connectors for convenient antenna connection. The connector dimensions are illustrated below:
Figure 34: EM120R-GL&EM160R-GL RF Connector Dimensions (Unit: mm) Item Table 33: Major Specifications of the RF Connector Specification Nominal Frequency Range DC to 6 GHz Nominal Impedance 50 Temperature Rating
-40 C to +85 C Voltage Standing Wave Ratio (VSWR) Meet the requirements of:
Max. 1.3 (DC3 GHz) Max. 1.45 (36 GHz) The receptacle RF connector used in conjunction with EM120R-GL&EM160R-GL will accept two types of mating plugs that will meet a maximum height of 1.2 mm using a 0.81 mm coaxial cable or a maximum height of 1.4 mm utilizing a 1.13 mm coaxial cable. EM120R-GL&EM160R-GL_Hardware_Design 62 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following figure shows the specifications of mating plugs using 0.81 mm coaxial cables. Figure 35: Specifications of Mating Plugs Using 0.81 mm Coaxial Cables The EM120R-GL&EM160R-GL and the mating plug using a 0.81 mm coaxial cable. the connection between illustrates following figure the receptacle RF connector on Figure 36: Connection between RF Connector and Mating Plug Using 0.81 mm Coaxial Cable The EM120R-GL&EM160R-GL and the mating plug using a 1.13 mm coaxial cable. the connection between illustrates following figure the receptacle RF connector on Figure 37: Connection between RF Connector and Mating Plug Using 1.13 mm Coaxial Cable EM120R-GL&EM160R-GL_Hardware_Design 63 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the modules are listed in the following table. Table 34: Absolute Maximum Ratings Parameter VCC Voltage at Digital Pins Min.
-0.3
-0.3 Max. Unit 4.7 2.3 V V 6.2. Power Supply Requirements The typical input voltage of EM120R-GL&EM160R-GL is 3.7 V, as specified by PCIe M.2 Electromechanical Spec Rev1.0. The following table shows the power supply requirements of the modules. Table 35: Power Supply Requirements Parameter Description Min. Typ. Max. VCC Power Supply 3.135 3.7 4.4 Unit V EM120R-GL&EM160R-GL_Hardware_Design 64 / 79 VIH VIL VOH VOL NOTE LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 6.3. I/O Requirements Table 36: I/O Requirements Parameter Description Min. Max. Unit Input high voltage 0.7 VDD18 1) VDD18 + 0.3 Input low voltage
-0.3 0.3 VDD18 Output high voltage VDD18 - 0.5 VDD18 Output low voltage 0 0.4 V V V V 1) VDD18 refers to I/O power domain. 6.4. Operation and Storage Temperatures Table 37: Operation and Storage Temperatures Parameter Min. Max. Unit Typ.
+25
+75
+85
+90 C C C Operating temperature Range 1)
-25 Extended Temperature Range 2)
-40 Storage temperature Range
-40 NOTES 1. 1) Within operating temperature range, the module is 3GPP compliant. For those end devices with bad thermal dissipation condition, a thermal pad or other thermal conductive components may be required between the module and main PCB to achieve the full operating temperature range. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like EM120R-GL&EM160R-GL_Hardware_Design 65 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Pout might reduce in their values and exceed the specified tolerances. When the temperature returns to the normal operating temperature level, the module will meet 3GPP specifications again. 6.5. Current Consumption Table 38: EM120R-GL&EM160R-GL Current Consumption Parameter Description Conditions IVCC OFF state Power down Typ. Unit TBD A 6.6. RF Output Power The following table shows the RF output power of EM120R-GL&EM160R-GL. Table 39: RF Output Power Frequency
(Quectel SPEC) Max. WCDMA band 1, 3, 5, 8s 24 dBm +1.5/-3 dB LTE-FDD band 1, 3, 5, 7, 8, 20, 28s 23 dBm 2 dB LTE-TDD band 38, 40, 41, 42, 43s 23 dBm 2 dB Min.
< -50 dBm
< -40 dBm
< -40 dBm
EM120R-GL&EM160R-GL_Hardware_Design 66 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 6.7. RF Receiving Sensitivity The following tables show conducted RF min. receiving sensitivity of EM120R-GL and EM160R-GL. Table 40: EM120R-GL&EM160R-GL Conducted RF Min. Receiving Sensitivity Frequency Primary Diversity SIMO 1) SIMO 2) (Worst Case) WCDMA B3
-109.5
-110.5 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6
-111
-109.5 TBD
-111 TBD WCDMA B8
-111.5
-110.5 WCDMA B19 TBD
-110.5
-106.7 dBm
-110
-111 TBD
-112 TBD
-111 TBD
-104.7 dBm
-103.7 dBm
-106.7 dBm
-104.7 dBm
-106.7 dBm
-103.7 dBm
-106.7 dBm LTE-FDD B1 (10 MHz)
-98
-100.7
-96.3 dBm LTE-FDD B2 (10 MHz)
-97.8
-100.3
-94.3 dBm LTE-FDD B3 (10 MHz)
-98.8
-100.8
-93.3 dBm LTE-FDD B4 (10 MHz)
-97.7
-100.6
-96.3 dBm LTE-FDD B5 (10 MHz)
-99.7
-99 LTE-FDD B7 (10 MHz)
-96
-102
-99.4
-94.3 dBm
-94.3 dBm LTE-FDD B8 (10 MHz)
-99
-101.7
-93.3 dBm LTE-FDD B12 (10 MHz)
-99.8
-102.3
-93.3 dBm LTE-FDD B13 (10 MHz)
-100.2
-99.4
-102.5
-93.3 dBm LTE-FDD B14 (10 MHz)
-99.2
-101.8
-93.3 dBm LTE-FDD B17 (10 MHz)
-99.9
-102.3
-93.3 dBm LTE-FDD B18 (10 MHz)
-99.6
-102.2
-96.3 dBm
-110
-110 TBD
-111 TBD TBD
-98
-97.7
-97.3
-97.9
-97.2
-99.2
-99.5
-99.2
-99.6
-99.4 EM120R-GL&EM160R-GL_Hardware_Design 67 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design LTE-FDD B19 (10 MHz)
-99.7
-99
-102
-96.3 dBm LTE-FDD B20 (10 MHz)
-99.7
-102.2
-93.3 dBm LTE-FDD B25 (10 MHz)
-97.8
-100.3
-92.8 dBm LTE-FDD B26 (10 MHz)
-99.4
-101.9
-93.8 dBm LTE-FDD B28 (10 MHz)
-99.3
-102.1
-94.8 dBm LTE-FDD B30 (10 MHz)
-96
-99.5
-95.3 dBm LTE-TDD B38 (10 MHz)
-98.4
-97
-100.1
-96.3 dBm LTE-FDD B39 (10 MHz)
-98.4
-100.5
-96.3 dBm LTE-TDD B40 (10 MHz)
-96.3 LTE-TDD B41 (10 MHz)
-98.1
-99.2
-99.7
-96.3 dBm
-94.3 dBm LTE-TDD B42 (10 MHz)
-97.3
-100.7
-95.0 dBm LTE-TDD B43 (10 MHz)
-97.4
-100.7
-95.0 dBm LTE-TDD B48 (10 MHz)
-97.3
-100.6
-95.0 dBm
-99.5
-97.6
-99.1
-99.6
-97.4
-97.5
-96.9
-96.1
-98.7
-98.4
-98.5
-97.8 LTE-FDD B66 (10 MHz)
-97.6
-100.4
-95.8 dBm NOTES 1. 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and multiple antennas at the receiver side, which can improve Rx performance. 2. 2) Per 3GPP specification. 6.8. Characteristics The modules are not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the modules. EM120R-GL&EM160R-GL_Hardware_Design 68 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design The following table shows the modules electrostatic discharge characteristics. Table 41: Electrostatic Discharge Characteristics (Temperature: 25 C, Humidity: 40%) Contact Discharge Air Discharge Unit Interfaces VCC, GND Antenna Interfaces Other Interfaces TBD TBD TBD 6.9. Thermal Dissipation TBD TBD TBD kV kV kV EM120R-GL&EM160R-GL are designed to work over an extended temperature range. In order to achieve a better performance while working under extended temperatures or extreme conditions (such as with maximum power or data rate, etc.) for a long time, it is strongly recommended to add a thermal pad or other thermally conductive compounds between the module and the main PCB for thermal dissipation. The thermal dissipation area (i.e. the area for adding thermal pad) is shown as below. The dimensions are measured in mm. Figure 38: Thermal Dissipation Area on Bottom Side of Module (Top View) EM120R-GL&EM160R-GL_Hardware_Design 69 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design There are some other measures to enhance heat dissipation performance:
Add ground vias as many as possible on PCB. Maximize airflow over/around the module. Place the module away from other heating sources. Module mounting holes must be used to attach (ground) the device to the main PCB ground. It is NOT recommended to apply solder mask on the main PCB where the modules thermal dissipation area is located. Select an appropriate material, thickness and surface for the outer housing (i.e. the mechanical enclosure) of the application device that integrates the module so that it provides good thermal dissipation. Customers may also need active cooling to pull heat away from the module. If possible, add a heatsink on the top of the module. A thermal pad should be used between the heatsink and the module, and the heatsink should be designed with as many fins as possible to increase heat dissipation area. NOTE For more detailed guidelines on thermal design, refer to document [5]. EM120R-GL&EM160R-GL_Hardware_Design 70 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7 Mechanical Dimensions and Packaging This chapter mainly describes mechanical dimensions and packaging specifications of EM120R-GL&EM160R-GL. All dimensions are measured in mm, and the dimensional tolerances are 0.05 mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module Figure 39: Mechanical Dimensions of EM120R-GL&EM160R-GL (Unit: mm) EM120R-GL&EM160R-GL_Hardware_Design 71 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.2. Standard Dimensions of M.2 PCI Express The following figure shows the standard dimensions of M.2 PCI Express, refer to document [6]. Figure 40: Standard Dimensions of M.2 Type 3042-S3 (Unit: mm) According to M.2 nomenclature, EM120R-GL&EM160R-GL are Type 3042-S3-B (30.0 mm 42.0 mm, max component height on the top is 1.5 mm and single-sided, key ID is B). Figure 41: M.2 Nomenclature EM120R-GL&EM160R-GL_Hardware_Design 72 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.3. Design Effect Drawings of the Module 7.3.1. Design Effect Drawings of EM160R-GL Module Figure 42: Top View of the Module Figure 43: Bottom View of the Module EM120R-GL&EM160R-GL_Hardware_Design 73 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.3.2. Design Renderings of EM120R-GL Module Figure 44: Top View of the Module Figure 45: Bottom View of the Module NOTE These are renderings of EM120R-GL&EM160R-GL. For authentic appearance, refer to the modules that you receive from Quectel. EM120R-GL&EM160R-GL_Hardware_Design 74 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 7.4. M.2 Connector EM120R-GL&EM160R-GL adopt a standard PCI Express M.2 connector which compiles with the directives and standards listed in the document [6]. 7.5. Packaging EM120R-GL&EM160R-GL are packaged in trays. The following figure shows the tray size. Figure 46: Tray Size (Unit: mm) Each tray contains 10 modules. The smallest package contains 100 modules. Tray packaging procedures are as below. 1. Use 10 trays to package 100 modules at a time (tray size: 247 mm 172 mm). 2. Place an empty tray on the top of the 10-tray stack. 3. Fix the stack with masking tape in # shape as shown in the following figure. 4. Pack the stack with conductive bag, and then fix the bag with masking tape. 5. Place the list of IMEI No. into a small carton. 6. Seal the carton and then label the seal with sealing sticker (small carton size: 250 mm 175 mm 128 mm). EM120R-GL&EM160R-GL_Hardware_Design 75 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Figure 47: Tray Packaging Procedure EM120R-GL&EM160R-GL_Hardware_Design 76 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design 8 Appendix References Table 42: Related Documents SN Document Name Remark
[1]
Quectel_EM120R-GL&EM160R-GL_CA_Feature EM120R-GL&EM160R-GL CA Feature
[2]
Quectel_M.2_EVB_User_Guide M.2 EVB User Guide
[3]
[4]
Quectel_EM120R-GL&EM160R-GL_AT_Commands_ Mannual EM120R-GL&EM160R-GL AT Commands Manual Quectel_EM120R-GL&EM160R-GL_GNSS_AT_ Commands_ Manual EM120R-GL&EM160R-GL GNSS AT Commands Manual
[5]
Quectel_LTE_Module_Thermal_Design_Guide Thermal Design Guide for LTE Modules
[6]
PCI Express M.2 Specification Table 43: Terms and Abbreviations Abbreviation Description bps Bits Per Second DC-HSPA+
Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air DL DRx ESD FDD Downlink Diversity Receive Electrostatic Discharge Frequency Division Duplexing GLONASS Globalnaya Navigatsionnaya Sputnikovaya Sistema (the Russian Global Navigation Satellite System) GNSS Global Navigation Satellite System EM120R-GL&EM160R-GL_Hardware_Design 77 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design Global Positioning System Global System for Mobile Communications High Speed Packet Access HSUPA High Speed Uplink Packet Access GPS GSM HSPA kbps LED LTE Mbps ME MIMO MLCC MMS MO MT PDU PPP PRx RF Rx SAR SMS Tx UART UL URC Kilo Bits Per Second Light Emitting Diode Long Term Evolution Million Bits Per Second Mobile Equipment (Module) Multiple-Input Multiple-Output Multiplayer Ceramic Chip Capacitor Multimedia Messaging Service Mobile Originated Mobile Terminated Protocol Data Unit Point-to-Point Protocol Primary Receive Radio Frequency Receive Specific Absorption Rate Short Message Service Transmit Uplink Unsolicited Result Code Universal Asynchronous Receiver & Transmitter EM120R-GL&EM160R-GL_Hardware_Design 78 / 79 LTE-A Module Series EM120R-GL&EM160R-GL Hardware Design
(U)SIM WCDMA
(Universal) Subscriber Identification Module Wideband Code Division Multiple Access EM120R-GL&EM160R-GL_Hardware_Design 79 / 79 FCC Part 15 Subpart B, Part 22 Subpart H, Part 24 Subpart E, Part 27 Subpart D & L & H & F FCC KDB996369 D03v01 Requirements List of applicable FCC rules
& M & N, Part 90 Subpart R & S, Part 96 Summarize the specific operational use conditions Not Applicable Technology Frequency Range Antenna Type Max Peak Gain (dBi) Limited module procedures Not Applicable Trace antenna designs Refer to Manual Section 4 RF exposure considerations Refer to FCC certification requirements Antennas WCDMA & LTE Band 2 WCDMA & LTE Band 4 WCDMA & LTE Band 5 LTE Band 7 LTE Band 12 LTE Band 13 LTE Band 14 LTE Band 25 LTE Band 26 LTE Band 30 LTE Band 38 LTE Band 41 LTE Band 48 LTE Band 66
(MHz) 1850 ~ 1910 1710 ~ 1755 824 ~ 849 2500 ~ 2570 699 ~ 716 777 ~ 787 788 ~ 798 1850 ~ 1915 814 ~ 849 2305 ~ 2315 2570 ~ 2620 2496 ~ 2690 3550 ~ 3700 1710 ~ 1780 Label and compliance information Refer to FCC Label Information on test modes and additional testing requirements Not Applicable Dipole 1.15
-0.50 1.85 1.32
-2.43
-0.10 2.40 1.15 1.85
-3.64 0.93 0.93
-3.37
-0.50 Additional testing, Part 15 Subpart B disclaimer Refer to FCC 15B Report FCC Certification Requirements. device is a mobile device. And the following conditions must be met:
According to the definition of mobile and fixed device is described in Part 2.1091(b), this 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user's body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2020EM160RGL2. 4. This module must not transmit simultaneously with any other antenna or transmitter 5. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a se parate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certifed modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the module's FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: "Contains Transmitter Module FCC ID: XMR2020EM160RGL2 " or "Contains FCC ID:
XMR2020EM160RGL2 " must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The user's manual or instruction manual for an intentional or unintentiona l radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in This device complies with part 15 of the FCC Rules. Operation is subject to the following two that form. conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesir ed operation. Changes or modifications not expressly approved by the manufacturer could void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and r eceiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/ TV technician for help. IC Statement IRSS-GEN of the device. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may ca use undesired operation Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Radiation Exposure Statement:
The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user's body and must not transmit simultaneously with any other antenna or transmitter. Dclarationd'exposition aux radiations:
L'EST est un appareil mobile; maintenir une distance d'au moins 20 cm entre l'EST et le corps de l'utilisateur et ne pas mettre simultanment avec une autre antenne ou un autre metteur. Technology Frequency Range Antenna Type Max Peak Gain (dBi) Antennas WCDMA & LTE Band 2 WCDMA & LTE Band 4 WCDMA & LTE Band 5 LTE Band 7 LTE Band 12 LTE Band 13 LTE Band 14 LTE Band 25 LTE Band 26 LTE Band 30 LTE Band 38 LTE Band 41 LTE Band 48 LTE Band 66
(MHz) 1850 ~ 1910 1710 ~ 1755 824 ~ 849 2500 ~ 2570 699 ~ 716 777 ~ 787 788 ~ 798 1850 ~ 1915 814 ~ 849 2305 ~ 2315 2570 ~ 2620 2496 ~ 2690 3550 ~ 3700 1710 ~ 1780 Dipole 1.15
-0.50 1.85 1.32
-2.43
-0.10 2.40 1.15
-3.64 0.93 0.93
-0.50
-3.37
-0.50 Technologie Gamme de Type d'antenne Gain de crte frquences (MHz) maximum (dBi) Antennes WCDMA & LTE Band 2 WCDMA & LTE Band 4 WCDMA & LTE Band 5 LTE Bande 7 LTE Bande 12 LTE Bande 13 LTE Bande 14 LTE Bande 25 LTE Bande 30 LTE Bande 38 LTE Bande 41 LTE Bande 66 1850 ~ 1910 1710 ~ 1755 824 ~ 849 2500 ~ 2570 699 ~ 716 777 ~ 787 788 ~ 798 1850 ~ 1915 2305 ~ 2315 2570 ~ 2620 2500 ~ 2690 1710 ~ 1780 Dipole 1.15
-0.50 1.85 1.32
-2.43
-0.10 2.40 1.15
-3.64 0.93 0.93
-0.50 The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains" or similar wording expressing the same meaning, as follows: Contains IC: 10224A-2020EM160GL or "where:
10224A-2020EM160GL is the module's certification number". Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est install dans le produit hte; sinon, le produit hte doit tre tiquet pour afficher le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell similaire exprimant le mme sens, comme suit: Contient IC: 10224A-2020EM160GL ou
"o: 10224A-2020EM160GL est le numro de certification du module".