FCC ID: XMR202307EM060KNA XMR202307EM060KNA

 

EM060K Series&EM120K-GL Hardware Design LTE-A Module Series Version: 1.1.0 Date: 2023-06-12 Status: Preliminary LTE-A Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-

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party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. EM060K_Series&EM120K-GL_Hardware_Design 2 / 92 LTE-A Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. EM060K_Series&EM120K-GL_Hardware_Design 3 / 92 LTE-A Module Series About the Document Revision History Version Date Author Description

2021-12-29 Davon ZHAO/

Robinson SHEN/

Eysen WANG/

Jacen HUANG Frank GAO/

Creation of the document 1.0 2022-08-18 Robinson SHEN/

First official release Jacen HUANG Preliminary:

1. Added the EM060K-NA and the related Frank GAO/

information;

1.1.0 2023-06-12 Waller GUO/

2. Updated the supported USB serial driver Jacen HUANG information (Table 3);

3. Updated the power consumption figures

(Table 45). EM060K_Series&EM120K-GL_Hardware_Design 4 / 92 LTE-A Module Series Contents Safety Information .................................................................................................................................... 3 About the Document ................................................................................................................................ 4 Contents .................................................................................................................................................... 5 Table Index ............................................................................................................................................... 8 Figure Index ............................................................................................................................................ 10 1 Introduction ..................................................................................................................................... 11 1.1. Reference Standards .............................................................................................................. 11 1.2. Special Marks ......................................................................................................................... 12 2 Product Overview ............................................................................................................................ 13 2.1. Frequency Bands and Functions ............................................................................................ 13 2.2. Key Features .......................................................................................................................... 14 2.3. Functional Diagram ................................................................................................................ 17 2.4. Pin Assignment ...................................................................................................................... 17 2.5. Pin Description ....................................................................................................................... 19 2.6. EVB Kit ................................................................................................................................... 23 3 Operating Characteristics .............................................................................................................. 24 3.1. Operating Modes .................................................................................................................... 24 3.2. Sleep Mode ............................................................................................................................ 25 3.3. Airplane Mode ........................................................................................................................ 26 3.4. Communication Interface with Host ........................................................................................ 26 3.5. Power Supply ......................................................................................................................... 26 3.5.1. Power Supply Pins ....................................................................................................... 26 3.5.2. Reference Design for Power Supply ............................................................................ 26 3.5.3. Voltage Stability Requirements .................................................................................... 27 3.5.4. Monitor the Power Supply ............................................................................................ 28 3.6. Turn-on ................................................................................................................................... 28 3.7. Turn-off ................................................................................................................................... 30 3.8. Reset ...................................................................................................................................... 31 4.1. 4 Application Interfaces ..................................................................................................................... 33

(U)SIM Interface ..................................................................................................................... 33 4.1.1. Pin definition of (U)SIM ................................................................................................ 33 4.1.2.

(U)SIM Hot-swap ......................................................................................................... 34 4.1.3. Normally Closed (U)SIM Card Connector .................................................................... 35 4.1.4. Normally Open (U)SIM Card Connector ...................................................................... 36 4.1.5.

(U)SIM Card Connector Without Hot-swap .................................................................. 36

(U)SIM2 Card Compatible Design ............................................................................... 37 4.1.6. 4.1.7.

(U)SIM Design Notices ................................................................................................ 38 4.2. USB Interface ......................................................................................................................... 38 4.3. PCM Interface* ....................................................................................................................... 40 4.4. Control and Indication Interfaces ............................................................................................ 41 EM060K_Series&EM120K-GL_Hardware_Design 5 / 92 LTE-A Module Series 4.4.1. W_DISABLE1# ............................................................................................................ 42 4.4.2. W_DISABLE2# ............................................................................................................ 42 4.4.3. WWAN_LED# .............................................................................................................. 44 4.4.4. WAKE_ON_WAN# ...................................................................................................... 44 4.4.5. DPR ............................................................................................................................. 45 4.4.6. WLAN_PA_EN ............................................................................................................. 46 4.5. Cellular/WLAN COEX Interface* ............................................................................................ 46 4.6. Configuration Pins .................................................................................................................. 47 4.7. PCIe Interface ......................................................................................................................... 48 4.7.1. Root Complex Mode .................................................................................................... 48 5.1.2.1. 5.1.2.2. 5 Antenna Interfaces .......................................................................................................................... 51 5.1. Cellular Network ..................................................................................................................... 51 5.1.1. Antenna Interfaces & Frequency Bands ...................................................................... 51 5.1.2. Antenna Tuner Control Interface* ................................................................................ 54 Antenna Tuner Control Interface through GPIOs .............................................. 54 Antenna Tuner Control Interface through RFFE ............................................... 55 5.1.3. Tx Power ..................................................................................................................... 55 5.1.4. Rx Sensitivity ............................................................................................................... 56 5.2. GNSS ..................................................................................................................................... 60 5.2.1. Antenna Interface & Frequency Bands ........................................................................ 60 5.2.2. GNSS Performance ..................................................................................................... 61 5.3. Antenna Design Requirements ............................................................................................... 62 5.4. Antenna Connectors ............................................................................................................... 63 5.4.1. Antenna Connector Location ....................................................................................... 63 5.4.2. Antenna Connector Specifications ............................................................................... 64 5.4.3. Antenna Connector Installation .................................................................................... 65 6 Electrical Characteristics and Reliability ...................................................................................... 67 6.1. Absolute Maximum Ratings .................................................................................................... 67 6.2. Power Supply Ratings ............................................................................................................ 67 6.3. Power Consumption ............................................................................................................... 68 6.4. Digital I/O Characteristics ....................................................................................................... 75 6.5. ESD Protection ....................................................................................................................... 76 6.6. Operating and Storage Temperatures .................................................................................... 77 6.7. Thermal Dissipation ............................................................................................................. 78 6.8. Notification .............................................................................................................................. 79 6.8.1. Coating ........................................................................................................................ 80 6.8.2. Cleaning ...................................................................................................................... 80 6.8.3. Installing ...................................................................................................................... 80 7 Mechanical Information and Packaging ........................................................................................ 81 7.1. Mechanical Dimensions .......................................................................................................... 81 7.2. Top and Bottom Views ........................................................................................................... 82 7.3. M.2 Connector ........................................................................................................................ 84 7.4. Packaging Specification ......................................................................................................... 84 EM060K_Series&EM120K-GL_Hardware_Design 6 / 92 7.4.1. Blister Tray................................................................................................................... 84 7.4.2. Packaging Process ...................................................................................................... 86 8 Appendix References ..................................................................................................................... 87 LTE-A Module Series EM060K_Series&EM120K-GL_Hardware_Design 7 / 92 LTE-A Module Series Table Index Table 1: Special Marks ............................................................................................................................ 12 Table 2: Frequency Bands and GNSS Functions of EM060K Series and EM120K-GL .......................... 13 Table 3: Key Features ............................................................................................................................. 14 Table 4: Definition of I/O Parameters ...................................................................................................... 19 Table 5: Pin Description .......................................................................................................................... 19 Table 6: Overview of Operating Modes ................................................................................................... 24 Table 7: Definition of VCC and GND Pins ............................................................................................... 26 Table 8: Pin Definition of FULL_CARD_POWER_OFF# ......................................................................... 28 Table 9: Turn-on Timing of the Module ................................................................................................... 30 Table 10: Turn-off Timing of the Module ................................................................................................. 30 Table 11: Pin Definition of RESET# ........................................................................................................ 31 Table 12: Reset Timing of the Module ..................................................................................................... 32 Table 13: Pin Definition of (U)SIM Interfaces .......................................................................................... 33 Table 14: Pin Definition of USB Interface ................................................................................................ 38 Table 15: Pin Definition of PCM Interface ............................................................................................... 41 Table 16: Pin Definition of Control and Indication Interfaces ................................................................... 41 Table 17: RF Function Status .................................................................................................................. 42 Table 18: GNSS Function Status ............................................................................................................ 43 Table 19: Network Status Indications of WWAN_LED# .......................................................................... 44 Table 20: State of the WAKE_ON_WAN# ............................................................................................... 44 Table 21: Pin definition of DPR ............................................................................................................... 45 Table 22: Function of the DPR Signal ..................................................................................................... 45 Table 23: Pin definition of WLAN_PA_EN ............................................................................................... 46 Table 24: Pin Definition of Cellular/WLAN COEX Interface ..................................................................... 46 Table 25: List of Configuration Pins ......................................................................................................... 47 Table 26: Pin Definition of Configuration Pins ......................................................................................... 47 Table 27: Pin Definition of the PCIe Interface ......................................................................................... 48 Table 28: PCIe Trace Length Inside the Module ..................................................................................... 49 Table 29: Antenna Connectors Definition for EM060K-GL & EM120K-GL .............................................. 51 Table 30: Antenna Connectors Definition for EM060K-NA ...................................................................... 51 Table 31: Frequency Bands for EM060K-GL & EM120K-GL .................................................................. 52 Table 32: Frequency Bands for EM060K-NA .......................................................................................... 53 Table 33: Pin Definition of Antenna Tuner Control Interface through GPIOs .......................................... 54 Table 34: EM060K-GL and EM120K-GL Tx Power ................................................................................. 55 Table 35: EM060K-NA Tx Power ............................................................................................................ 55 Table 36: EM060K-GL Rx Sensitivity ...................................................................................................... 56 Table 37: EM120K-GL Rx Sensitivity ...................................................................................................... 58 Table 38: EM060K-NA Rx Sensitivity ...................................................................................................... 59 Table 39: GNSS Frequency .................................................................................................................... 60 Table 40: GNSS Performance ................................................................................................................. 61 Table 41: Antenna Requirements ............................................................................................................ 62 EM060K_Series&EM120K-GL_Hardware_Design 8 / 92 LTE-A Module Series Table 42: Major Specifications of the RF Connectors ............................................................................. 64 Table 43: Absolute Maximum Ratings ..................................................................................................... 67 Table 44: Power Supply Requirements ................................................................................................... 67 Table 45: EM060K-GL Power Consumption (3.7 V Power Supply) ......................................................... 68 Table 46: EM060K-NA Power Consumption (3.7 V Power Supply) ......................................................... 71 Table 47: EM120K-GL Power Consumption (3.7 V Power Supply) ......................................................... 72 Table 48: (U)SIM 1.8 V I/O Requirements ............................................................................................... 75 Table 49: (U)SIM 3.0 V I/O Requirements ............................................................................................... 76 Table 50: 1.8 V Digital I/O Requirements ................................................................................................ 76 Table 51: 3.3 V Digital I/O Requirements ................................................................................................ 76 Table 52: Electrostatic Discharge Characteristics (Temperature: 2530 C, Humidity: 40 5 %) ........... 77 Table 53: Operating and Storage Temperatures ..................................................................................... 77 Table 54: Maximum Operating Temperature for Main Chips (Unit: C) ................................................... 79 Table 55: Related Documents ................................................................................................................. 87 Table 56: Terms and Abbreviations ......................................................................................................... 87 EM060K_Series&EM120K-GL_Hardware_Design 9 / 92 LTE-A Module Series Figure Index Figure 1: Functional Diagram for EM060K-GL&EM120K-GL .................................................................. 17 Figure 2: Functional Diagram for EM060K-NA ........................................................................................ 17 Figure 3: Pin Assignment ........................................................................................................................ 18 Figure 4: DRX Run Time and Current Consumption in Sleep Mode ....................................................... 25 Figure 5: Sleep Mode Application with USB Remote Wakeup Function .................................................. 25 Figure 6: Reference Circuit for Power Supply ......................................................................................... 27 Figure 7: Power Supply Limits During Burst Transmission ...................................................................... 27 Figure 8: Reference Circuit for VCC Pins ................................................................................................ 28 Figure 9: Turn On the Module with a Host GPIO ..................................................................................... 29 Figure 10: Turn-on Timing ....................................................................................................................... 29 Figure 11: Turn-off Timing ....................................................................................................................... 30 Figure 12: Reference Circuit of RESET# with Open Collector Driving Circuit ......................................... 31 Figure 13: Reset Timing .......................................................................................................................... 32 Figure 14: Reference Circuit for Normally Closed (U)SIM Card Connector ............................................. 35 Figure 15: Reference Circuit for Normally Open (U)SIM Card Connector ............................................... 36 Figure 16: Reference Circuit for 6-Pin (U)SIM Card Connector............................................................... 37 Figure 17: Recommended Compatible Design for (U)SIM2 Interface ..................................................... 37 Figure 18: Reference Circuit for USB Interface ....................................................................................... 39 Figure 19: Primary Mode Timing ............................................................................................................. 40 Figure 20: Auxiliary Mode Timing ............................................................................................................ 41 Figure 21: Reference Circuit of W_DISABLE1# and W_DISABLE2# ...................................................... 43 Figure 22: WWAN_LED# Reference Circuit ............................................................................................ 44 Figure 23: Reference Circuit of WAKE_ON_WAN# ................................................................................ 45 Figure 24: Recommended Circuit of Configuration Pins .......................................................................... 47 Figure 25: Reference Circuit of PCIe Interface (RC Mode) ..................................................................... 49 Figure 26: Antenna Connectors on EM060K-GL & EM120K-GL ............................................................. 63 Figure 27: Antenna Connectors on EM060K-NA ..................................................................................... 63 Figure 28: Dimensions of the Receptacle (Unit: mm) .............................................................................. 64 Figure 29: Dimensions of Mated Plugs (0.81/1.13 mm Coaxial Cables) (Unit: mm) .......................... 65 Figure 30: Space Factor of Mated Connectors (0.81 mm Coaxial Cables) (Unit: mm) ......................... 65 Figure 31: Space Factor of Mated Connectors ( 1.13 mm Coaxial Cables) (Unit: mm) ........................ 66 Figure 32: Distribution of Heat Source Chips Inside the EM060K-GL&EM120K-GL ............................... 78 Figure 33: Distribution of Heat Source Chips Inside the EM060K-NA ..................................................... 78 Figure 34: Placement and Fixing of the Heatsink .................................................................................... 79 Figure 35: EM060K-GL&EM120K-GL Mechanical Dimensions ............................................................... 81 Figure 36: EM060K-NA Mechanical Dimensions ..................................................................................... 82 Figure 37: EM060K-GL Top and Bottom Views....................................................................................... 82 Figure 38: EM120K-GL Top and Bottom Views....................................................................................... 83 Figure 39: EM060K-NA Top and Bottom Views ...................................................................................... 83 Figure 40: Blister Tray Dimension Drawing ............................................................................................. 85 Figure 41: Packaging Process................................................................................................................. 86 EM060K_Series&EM120K-GL_Hardware_Design 10 / 92 LTE-A Module Series 1 Introduction This document defines EM060K series and EM120K-GL module and defines their air interfaces and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module. 1.1. Reference Standards The module complies with the following standards:

PCI Express M.2 Specification Revision 4.0, Version 1.1 PCI Express Base Specification Revision 4.0 Universal Serial Bus 3.1 Specification ISO/IEC 7816-3 MIPI Alliance Specification for RF Front-End Control Interface Version 2.0 3GPP TS 27.007 and 3GPP 27.005 3GPP TS 34.121-1 and 3GPP TS 36.521-1 EM060K_Series&EM120K-GL_Hardware_Design 11 / 92 LTE-A Module Series 1.2. Special Marks Table 1: Special Marks Mark Definition Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*)

after a model indicates that the sample of the model is currently unavailable. Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type.

For example, SDIO_DATA [0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. EM060K_Series&EM120K-GL_Hardware_Design 12 / 92 LTE-A Module Series 2 Product Overview 2.1. Frequency Bands and Functions EM060K series and EM120K-GL are LTE-A/UMTS/HSPA+ wireless communication modules with receiving diversity. They provide data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks. They are standard M.2 Key-B WWAN modules. For more details, see PCI Express M.2 Specification Revision 4.0, Version 1.1. They support embedded operating systems such as Windows, Linux and Android, and also provide GNSS and voice functionality 1 to meet specific application demands. The following table shows the frequency bands and GNSS functions of the module. For details about CA combinations, you can see document [1]. Table 2: Frequency Bands and GNSS Functions of EM060K Series and EM120K-GL Mode EM060K-GL EM060K-NA EM120K-GL B1/B2/B3/B4/B5/B7/B8/B12/

B13/B14/B172/B18/B19/B20/

B25/B26/B28/B293/B30/B32 3

/B66/B71 B2/B4/B5/B7/B12/B13/

B14/B17 2/B25/B26/

B29 3 /B30/B66/B71 B1/B2/B3/B4/B5/B7/B8/B12/

B13/B14/B17 2/B18/B19/B20/

B25/B26/B28/B29 3/B30/

B32 3/B66/B71 B34/B38/B39/B40/B41/B42/

B43/B46 3 (LAA)/B48(CBRS) B41/B48/B42/B43 B34/B38/B39/B40/B41/B42/

B43/B46 3 (LAA)/B48(CBRS) LTE-FDD

(with Rx-

diversity) LTE-TDD

(with Rx-

diversity) WCDMA

(with Rx-

B1/B2/B3/B4/B5/B6/B8/B19 B1/B2/B3/B4/B5/B6/B8/B19 diversity) GNSS GPS/GLONASS/BDS/Galileo GPS/GLONASS/BDS/

Galileo GPS/GLONASS/BDS/Galileo 1 The module contains DataVoice* and Data-only version. DataVoice* version supports voice and data functions, while Data-only version only supports data function. 2 B17 is supported through MFBI + B12. 3 LTE-FDD B29/B32 and LTE-TDD B46 support Rx only and are only for secondary component carrier. EM060K_Series&EM120K-GL_Hardware_Design 13 / 92 The module can be applied to a wide range of applications such as industrial routers, home gateways, set-top boxes, industrial laptops, consumer laptops, industrial PDAs, rugged tablet PCs and digital signage, LTE-A Module Series etc. 2.2. Key Features Table 3: Key Features Feature Details Function Interface PCI Express M.2 Interface Power Supply Supply voltage: 3.1354.4 V Typical supply voltage: 3.7 V Compliant with ISO/IEC 7816-3 and ETSI and IMT-2000 requirements

(U)SIM Interface Supports (U)SIM card: 1.8/3.0 V Supports Dual SIM Single Standby eSIM (Optional) Supports built-in eSIM function Compliant with USB 3.0 and 2.0 specifications, with maximum transmission rates up to 5 Gbps on USB 3.0 and 480 Mbps on USB 2.0. Used for AT command communication, data transmission, firmware upgrade

(USB 2.0 only), software debugging, GNSS NMEA sentence output, and USB Interface voice* over USB. Supports USB serial drivers:

- Windows 7/8/8.1/10/11

- Linux 2.65.18

- Android 4.x13.x Used for audio function through external codec Supports 16-bit linear data format PCM Interface*

Supports long and short frame synchronization Supports master and slave modes, but must be the master in long frame synchronization Compliant with PCI Express Base Specification Revision 4.0 PCIe Interface Supports one PCIe interface, up to 5 Gbps/lane

(Optional) Used for data transmission Rx-diversity RC mode only EM060K-GL and EM120K-GL:

LTE/WCDMA EM060K-NA:

LTE Antenna Interfaces EM060K-GL and EM120K-GL:

EM060K_Series&EM120K-GL_Hardware_Design 14 / 92 LTE-A Module Series Main antenna connector and diversity/GNSS antenna connector 50 impedance EM060K-NA:

Main antenna connector, Diversity antenna connector, GNSS antenna connector 50 impedance Transmitting Power WCDMA: Class 3 (23 dBm 2 dB) LTE-FDD/TDD: Class 3 (23 dBm 2 dB) Supports 3GPP Rel-12 LTE-FDD and LTE-TDD Supports CA categories:

EM060K-GL and EM060K-NA:

Supports up to UL CA Cat 6 Supports up to DL CA Cat 6 EM120K-GL:

Supports up to UL CA Cat 13 Supports up to DL CA Cat 12 Supports modulations:

Uplink:

Downlink:

LTE Features EM120K-GL: QPSK,16QAM and 64QAM EM060K-GL and EM060K-NA: QPSK and 16QAM EM060K-GL and EM060K-NA: QPSK, 16QAM and 64QAM EM120K-GL: QPSK, 16QAM, 64QAM and 256QAM Supports 1.4/3/5/10/15/20 MHz RF bandwidths Max. transmission data rates 4:

EM060K-GL and EM060K-NA:

LTE-FDD: 300 Mbps (DL)/50 Mbps (UL) LTE-TDD: 226 Mbps (DL)/28 Mbps (UL) EM120K-GL:

LTE-FDD: 600 Mbps (DL)/150 Mbps (UL) LTE-TDD: 430 Mbps (DL)/90 Mbps (UL) EM060K-GL and EM120K-GL:

Supports 3GPP Rel-9 DC-HSDPA, HSPA+, HSDPA, HSUPA and UMTS Features 5 WCDMA Supports modulations:

DL: BPSK, QPSK, 16QAM and 64QAM UL: BPSK, QPSK Max. transmission data rates:

DC-HSDPA: 42 Mbps (DL) HSUPA: 5.76 Mbps (UL) WCDMA: 384 kbps (DL)/384 kbps (UL) 4 The maximum rates are theoretical and the actual values refer to the network configuration. 5 EM060K-NA does not support WCDMA. EM060K_Series&EM120K-GL_Hardware_Design 15 / 92 LTE-A Module Series GNSS Features AT Commands Internet Protocol Features Supports GPS, GLONASS, BDS and Galileo Data update rate: 1 Hz by default Compliant with 3GPP TS 27.007 and 3GPP TS 27.005 Quectel enhanced AT commands QMI/MBIM/NITZ/HTTP/HTTPS/FTP/LwM2M/PING Firmware Upgrade Via USB 2.0 or DFOTA SMS Physical Characteristics Temperature Range Point-to-point MO and MT Text and PDU Modes SMS cell broadcast SMS storage: ME by default M.2 Key-B Size: 30.0 mm 42.0 mm 2.3 mm Weight: approx. 6.2 g Operating temperature range: -25 to +75 C 6 Extended temperature range: -40 to +85 C 7 Storage temperature range: -40 to +90 C RoHS All hardware components are fully compliant with EU RoHS directive 6 To meet this operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module can meet 3GPP specifications. 7 To meet this extended temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module remains the ability to establish and maintain functions such as voice*, SMS, emergency call* etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may undergo a reduction in value, exceeding the specified tolerances of 3GPP. When the temperature returns to the normal operating temperature level, the module will meet 3GPP specifications again. EM060K_Series&EM120K-GL_Hardware_Design 16 / 92 LTE-A Module Series 2.3. Functional Diagram The following figure shows a functional diagram of EM120K-GL. Power management Baseband LPDDR2 SDRAM+NAND flash Radio frequency M.2 Key-B interface The following figure shows a functional diagram of EM060K series.Power management Baseband LPDDR2 SDRAM+NAND flash Radio frequency M.2 Key-B interface 2.4. Pin Assignment The following figure shows the pin assignment of the module. EM060K_Series&EM120K-GL_Hardware_Design 17 / 92 LTE-A Module Series Figure 1: Pin Assignment NOTE EM060K-GL and EM120K-GL have conflicts between B46 and 5 GHz frequency bands of WLAN, so you need to set WLAN_PA_EN on pin 60, which mainly controls the coexistence of the two. However, due to EM060K-NA does not support B46, it does not conflict with the 5 GHz frequency bands of WLAN, Pin 60 is not needed. So it is NC. EM060K_Series&EM120K-GL_Hardware_Design 18 / 92 PIN2PIN74BOTPIN1PIN75TOPPin NameNo.CONFIG_275GND73GND71CONFIG_169RESET#67ANTCTL365ANTCTL263ANTCTL161ANTCTL059GND57PCIE_REFCLK_P55PCIE_REFCLK_M53GND51PCIE_RX_P49PCIE_RX_M47GND45PCIE_TX_P43PCIE_TX_M41GND39USB_SS_RX_P37USB_SS_RX_M35GND33USB_SS_TX_P31USB_SS_TX_M29GND27DPR25WAKE_ON_WAN#23CONFIG_021NotchNotchNotchNotchGND11USB_DM9USB_DP7GND5GND3CONFIG_31PIN11PIN10No.Pin Name74VCC72VCC70VCC68NC66USIM1_DET64COEX_TXD62COEX_RXD60WLAN_PA_EN/NC58RFFE_DATA56RFFE_CLK54PCIE_WAKE_N52PCIE_CLKREQ_N50PCIE_RST_N48USIM2_VDD46USIM2_RST44USIM2_CLK42USIM2_DATA40USIM2_DET38NC36USIM1_VDD34USIM1_DATA32USIM1_CLK30USIM1_RST28PCM_SYNC26W_DISABLE2#24PCM_DOUT22PCM_DIN20PCM_CLKNotchNotchNotchNotch10WWAN_LED#8W_DISABLE1#6FULL_CARD_POWER_OFF#4VCC2VCC LTE-A Module Series 2.5. Pin Description Table 4: Definition of I/O Parameters Type AI AO AIO DI DO DIO OD PI PO PU PD Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Pull Up Pull Down DC characteristics include power domain and rate current, etc. Table 5: Pin Description Pin No. Pin Name I/O Description DC Characteristic Comment 1 2 3 4 CONFIG_3 DO Not connected internally VCC PI GND Power supply for the module Ground VCC PI Power supply for the module Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V EM060K_Series&EM120K-GL_Hardware_Design 19 / 92 LTE-A Module Series GND Ground FULL_CARD_ POWER_OFF#

Internally pulled VIHmax = 4.4 V down with a DI, PD Turn on/off the module VIHmin = 1.19 V 100 k resistor. VILmax = 0.2 V High level: turn on USB_DP AIO USB differential data (+) Low level: turn off. A test point must be reserved. W_DISABLE1#

DI, PU Airplane mode control VILmax = 0.4 V Active low. VIHmin = 1.8 V USB_DM AIO USB differential data (-) VILmin = -0.4 V A test point must be reserved. WWAN_LED#

OD RF status LED indicator VCC Active low. GND Notch Notch Notch Notch Notch Notch Notch Notch Ground Notch Notch Notch Notch Notch Notch Notch Notch PCM_CLK*

DIO, PD CONFIG_0 DO PCM clock 1.8 V Connected to GND internally PCM_DIN*

DI, PD PCM data input 1.8 V WAKE_ON_ WAN#

PCM_DOUT*

OD Wake up the host 1.8/3.3 V Active low. DO, PD PCM data output 1.8 V 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 DPR DI, PU Dynamic power reduction 1.8 V High level by default. Active low. EM060K_Series&EM120K-GL_Hardware_Design 20 / 92 26 W_DISABLE2#

DI, PU GNSS control VILmax = 0.4 V Active low. VIHmin = 1.8 V VILmin = -0.4 V LTE-A Module Series 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 GND Ground PCM_SYNC*

DIO, PD USB_SS_TX_M AO USIM1_RST DO, PD USB_SS_TX_P AO USIM1_CLK GND USIM1_DATA DO, PD DIO, PD USB_SS_RX_M AI USIM1_VDD PO USB_SS_RX_P AI NC GND PCM data frame sync 1.8 V USIM1_VDD 1.8/3.0 V USIM1_VDD 1.8/3.0 V USIM1_VDD 1.8/3.0 V 1.8/3.0 V USB 3.0 super-speed transmit (-)

(U)SIM1 card reset USB 3.0 super-speed transmit (+)

(U)SIM1 card clock Ground

(U)SIM1 card data USB 3.0 super-speed receive (-)

(U)SIM1 card power supply USB 3.0 super-speed receive (+) Not connected Ground USIM2_DET 8 DI, PD

(U)SIM2 card hot-plug detect 1.8 V Internally pulled up to 1.8 V. PCIE_TX_M AO PCIe transmit (-) USIM2_DATA DIO, PD

(U)SIM2 card data USIM2_VDD 1.8/3.0 V PCIE_TX_P AO PCIe transmit (+) USIM2_CLK GND USIM2_RST DO, PD DO, PD

(U)SIM2 card clock Ground

(U)SIM2 card reset USIM2_VDD 1.8/3.0 V USIM2_VDD 1.8/3.0 V 8 This pin is pulled low by default, and will be internally pulled up to 1.8 V by software configuration only when (U)SIM hot-swap is enabled by AT+QSIMDET. For more details, see document [3]. EM060K_Series&EM120K-GL_Hardware_Design 21 / 92 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 LTE-A Module Series PCIE_RX_M AI PCIe receive (-) USIM2_VDD PO

(U)SIM2 card power supply 1.8/3.0 V PCIE_RX_P AI PCIe receive (+) PCIE_RST_N DO PCIe reset 1.8/3.3 V RC mode only. GND Ground PCIE_CLKREQ_ N PCIE_REFCLK_ M DI PCIe clock request 1.8/3.3 V AO PCIe reference clock (-) PCIE_WAKE_N DI PCIe wake up 1.8/3.3 V PCIE_REFCLK_ P RFFE_CLK* 9 GND RFFE_DATA* 9 ANTCTL0*

AO PCIe reference clock (+) DO, PD Used for external MIPI IC control Ground DIO, Used for external MIPI IC 1.8 V 1.8 V control PD DO, PD Antenna GPIO control 1.8 V WLAN_PA_EN DI, PD Self-protection of QLN control 1.8 V It is not connected for EM060K-NA. ANTCTL1*

DO, PD Antenna GPIO control 1.8 V COEX_RXD*

DI, PD LTE/WLAN coexistence receive 1.8 V ANTCTL2*

COEX_TXD*

ANTCTL3*

DO, PD DO, PD DO, PD Antenna GPIO control 1.8 V LTE/WLAN coexistence transmit 1.8 V Antenna GPIO control 1.8 V USIM1_DET 8 DI, PD

(U)SIM1 card hot-plug detect 1.8 V Internally pulled up to 1.8 V. VIHmax = 2.1 V Internally pulled up 67 RESET#

DI, PU Reset the module VIHmin = 1.3 V VILmax = 0.5 V to 1.8 V with a 10 k resistor. 9 If RFFE_CLK and RFFE_DATA are required, please contact Quectel for more details. EM060K_Series&EM120K-GL_Hardware_Design 22 / 92 LTE-A Module Series Active low. A test point is recommended to be reserved if unused. NC Not connected 68 69 CONFIG_1 DO 70 VCC PI 71 GND 72 VCC PI 73 GND 74 VCC PI Connected to GND internally Power supply for the module Ground Power supply for the module Ground Power supply for the module Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V 75 CONFIG_2 DO Not connected internally NOTE Keep all NC and unused pins unconnected. 2.6. EVB Kit To help you develop applications conveniently with EM060K series and EM120K-GL, Quectel supplies an evaluation board (5G-M2 EVB). For more details, see document [2]. EM060K_Series&EM120K-GL_Hardware_Design 23 / 92 LTE-A Module Series 3 Operating Characteristics 3.1. Operating Modes The table below summarizes different operating modes of the modules. Table 6: Overview of Operating Modes Mode Full Functionality Mode Minimum Functionality Mode Airplane Mode Details Idle Software is active. The module is registered on the network and is ready to send and receive data. Voice*/Data Network is connected. In this mode, the power consumption is determined by network setting and data transfer rate. AT+CFUN=0 sets the module to a minimum functionality mode without removing the power supply. In this mode, both RF function and (U)SIM card are invalid. AT+CFUN=4 or driving W_DISABLE1# pin low will set the module to airplane mode. In this mode, the RF function is invalid. In this mode, current consumption of the module will be reduced to the Sleep Mode minimal level. The module can still receive paging, SMS, voice* call and TCP/UDP data from network. Power Down Mode Software is inactive, while all interfaces are inaccessible and the operating In this mode, the power management unit shuts down the power supply. voltage (connected to VCC) remains applied. For more details, see document [3]. EM060K_Series&EM120K-GL_Hardware_Design 24 / 92 LTE-A Module Series 3.2. Sleep Mode In sleep mode, DRX (Discontinuous Reception) of the module is able to reduce the current consumption to a minimum level, and DRX cycle index values are broadcasted by the wireless network. The figure below shows the relationship between the DRX run time and the current consumption in sleep mode. The longer the DRX cycle is, the lower the current consumption will be. Figure 2: DRX Run Time and Current Consumption in Sleep Mode The following part of this chapter describes the power saving procedure and sleep mode entrance of the module. If the host supports USB suspend/resume and remote wakeup function, the following two conditions must be met simultaneously to bring the module into sleep mode. Execute AT+QSCLK=1 to enable the sleep mode. For more details, see document [3]. Ensure the hosts USB bus, which is connected to the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application with USB Remote Wakeup Function The module will wake up when the host sends data to the module through USB interface. EM060K_Series&EM120K-GL_Hardware_Design 25 / 92 Current ConsumptionRun TimeDRX OFF ON OFF ON OFF ON OFF ON OFF USB InterfaceUSB InterfaceModuleHostGNDGND LTE-A Module Series 3.3. Airplane Mode Execution of AT+CFUN=4 or driving W_DISABLE1# pin low will set the module to airplane mode. For more details, see Chapter 4.4.1. 3.4. Communication Interface with Host The module supports communication with the host through USB interface. USB 2.0 should be reserved for firmware upgrade. See the USB mode features as below:

USB Mode:

Supports all USB 2.0 and 3.0 features Supports MBIM/QMI/QRTR/AT 3.5. Power Supply 3.5.1. Power Supply Pins Table 7: Definition of VCC and GND Pins Pin No. Pin Name I/O Description Comment 2, 4, 70, 72, 74 VCC PI Power supply for the module Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V 3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73 GND Ground 3.5.2. Reference Design for Power Supply Power design is vital to the module, as the performance of the module largely depends on the power source. The power supply of the module should be able to provide a sufficient current of 2 A at least. In case of a slight difference between input and output voltages, use an LDO when supplying power to the module. In case of a large difference between input and desired output (typically 3.7 V) voltages, using a buck DC-DC converter is preferred. The performance of the module largely depends on the power supply design. The continuous current of the power supply should be 3 A at least and the peak current should be 4 A at least. EM060K_Series&EM120K-GL_Hardware_Design 26 / 92 The following figure shows a reference design for +5 V input power supply based on DC-DC converter. The typical output of the power supply is about 3.7 V. LTE-A Module Series Figure 4: Reference Circuit for Power Supply NOTE To avoid corrupting the data in the internal flash, do not cut off the power supply before the module is completely turned off by pulling down FULL_CARD_POWER_OFF# pin for more than 6.6 s, and do not cut off power supply directly when the module is working. 3.5.3. Voltage Stability Requirements The power supply of the module ranges from 3.135 V to 4.4 V. Please ensure that the input voltage never drops below 3.135 V, otherwise the module will be powered off automatically. The following figure shows the maximum voltage drop during burst transmission in 3G/4G networks. Figure 5: Power Supply Limits During Burst Transmission To decrease the voltage drop, two bypass capacitors of about 220 F with low ESR (ESR = 0.7 ) should be used. To avoid disturbing the power supply, two multi-layer ceramic chip capacitor (MLCC) arrays also should be used due to their ultra-low ESR. It is recommended to use eight ceramic capacitors (1 F, 100 nF, 33 pF, 10 pF) to compose the MLCC arrays, and to place these capacitors close to VCC pins. The width of VCC trace should be no less than 2.5 mm. In principle, the longer the VCC trace is, the wider it EM060K_Series&EM120K-GL_Hardware_Design 27 / 92 D1TVSPWR_INC8220 FC1110 pFC1033 pFC9100 nF+R1205KU1Q1NPNR847KR74.7KPWR_ENR4182KPWR_OUTL11.5 HVINVINVINENVSNSCOMPRT/CLKSSPHPHPHBOOTPWRGDGNDGNDAGNDVFBR5383K 1 %R6100K 1 %C6100 nFPWRGDEPR280.6KC710 nFR310KC410 nFC5NMVFBC2100 nFC333 pFC1470 F+VCC (V)Burst TransmissionVoltage Ripple< 100 mVVoltage Drop Burst Transmission3.135 VLoad (A) LTE-A Module Series should be. In addition, to guarantee the stability of the power supply, please use a TVS component with a reverse TVS voltage of 5.1 V and a dissipation power higher than 0.5 W. The following figure shows a reference circuit of the VCC. Figure 6: Reference Circuit for VCC Pins 3.5.4. Monitor the Power Supply You can use AT+CBC to monitor the voltage value of VCC. For more details, see document [3]. 3.6. Turn-on FULL_CARD_POWER_OFF# serves to turn on/off the module. This input signal is 3.3 V tolerant and can be driven by either 1.8 V or 3.3 V GPIO. Also, it has been internally pulled down with a 100 k resistor. When FULL_CARD_POWER_OFF# is de-asserted (driven high, 1.19 V), the module will be turned on. Table 8: Pin Definition of FULL_CARD_POWER_OFF#

Pin No. Pin Name I/O Description Comment 6 FULL_CARD_ POWER_OFF#

DI, PD Turn on/off the module Internally pulled down with a 100 k resistor. EM060K_Series&EM120K-GL_Hardware_Design 28 / 92 ModuleAPT2, 4C2220 F3, 5, 11VCC (3.7 V Typ.)VCCGNDC1010 pFC833 pFC6100 nFC41 F+C1220 FD15.1 VVCCGNDC910 pFC733 pFC5100 nFC31 F+27, 33, 39, 45, 51, 57, 71, 7370, 72, 74PMU LTE-A Module Series High level: turn on Low level: turn off. It is recommended to use a host GPIO to control FULL_CARD_POWER_OFF#. A simple reference circuit is illustrated in the following figure. Figure 7: Turn On the Module with a Host GPIO NOTE The voltage of pin 6 of the module should be not less than 1.19 V when it is at high level. The turn-on timing is illustrated in the following figure. Figure 8: Turn-on Timing EM060K_Series&EM120K-GL_Hardware_Design 29 / 92 HostModuleFULL_CARD_POWER_OFF#PMUGPIO61.8 V or 3.3 VR1100KGSDVIL 0.2 V1.19 V VIH 4.4 VVCCFULL_CARD_POWER_OFF#RESET#BootingActiveModule StateT1T2OFF LTE-A Module Series Table 9: Turn-on Timing of the Module Symbol Min. Typ. Max. Comment T1 T2 100 ms

13.7s

The turn-on time of the module. The system booting time of the module. NOTE RESET# is automatically pulled up as on as the module is powered on. RESET# is not allowed to be pulled down by host during powering up 3.7. Turn-off If the module is turned off using a host GPIO, when VCC is supplied with power, pulling down FULL_CARD_POWER_OFF# pin ( 0.2 V) will turn off the module normally. The turn-off timing is illustrated in the following figure. Figure 9: Turn-off Timing NOTE As shown by the dotted line, it is suggested to disconnect VCC and drive RESET# low after the module shuts down. Table 10: Turn-off Timing of the Module Symbol Min. T1

Typ. 1 s Max. Comment

The turn-off time of the module EM060K_Series&EM120K-GL_Hardware_Design 30 / 92 VCCModule StatusFULL_CARD_POWER_OFF#Power-down procedureActiveOFFT1 LTE-A Module Series 3.8. Reset The RESET# pin serves to reset the module. Triggering the RESET# signal will lead to loss of all data from the modem and removal of system drivers. It will also lead to disconnection of the modem from the network. Table 11: Pin Definition of RESET#

Pin No. Pin Name I/O Description Comment 67 RESET#

DI, PU Reset the module Active low. Internally pulled up to 1.8 V with a 10 k resistor. A test point is recommended to be reserved if unused. The module can be reset by pulling down the RESET# pin for 200600 ms. An open collector (OC)/drain driver or a button can be used to control the RESET# pin. Figure 10: Reference Circuit of RESET# with Open Collector Driving Circuit The reset timing is illustrated in the following figure. EM060K_Series&EM120K-GL_Hardware_Design 31 / 92 HostModuleRESET#PMICGPIO671.8 VReset pulse200600 msR110KR3100KR41KQ1R2 1K LTE-A Module Series Figure 11: Reset Timing Table 12: Reset Timing of the Module Index Min. Typ. Max. Comment T1 T2 T3 0 ms 100 ms

It is recommended to pull down RESET# for about 100 ms before driving FULL_CARD_POWER_OFF# low. 200 ms

600 ms Driving RESET# low for 200600 ms can reset the module.

50 ms

Set up by the host, 50 ms by default. EM060K_Series&EM120K-GL_Hardware_Design 32 / 92 VCCFULL_CARD_POWER_OFF#RESET#T1RunningOffRestartModule StatusResetingT3T2 LTE-A Module Series 4 Application Interfaces 4.1. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements and ISO/IEC 7816-3. Both Class B

(3.0 V) and Class C (1.8 V) (U)SIM cards are supported, and Dual SIM Single Standby function is supported. 4.1.1. Pin definition of (U)SIM Table 13: Pin Definition of (U)SIM Interfaces Pin No. Pin Name USIM1_VDD I/O PO Description

(U)SIM1 card power supply 36 34 32 30 66 40 42 44 46 48 USIM1_DATA DIO, PD

(U)SIM1 card data USIM1_CLK DO, PD

(U)SIM1 card clock USIM1_RST DO, PD

(U)SIM1 card reset USIM1_DET DI, PD

(U)SIM1 card hot-plug detect USIM2_DET DI, PD

(U)SIM2 card hot-plug detect USIM2_DATA DIO, PD

(U)SIM2 card data USIM2_CLK DO, PD

(U)SIM2 card clock USIM2_RST DO, PD

(U)SIM2 card reset USIM2_VDD PO

(U)SIM2 card power supply EM060K_Series&EM120K-GL_Hardware_Design 33 / 92 LTE-A Module Series 4.1.2.

(U)SIM Hot-swap The module supports (U)SIM card hot-swap via (U)SIM card hot-swap detect pins USIM1_DET and USIM2_DET. (U)SIM card insertion can be detected by high/low level. (U)SIM card hot-swap function is disabled by default. The following command configures (U)SIM card hot-swap detection. AT+QSIMDET Configure (U)SIM Card Hot-Swap Detection Test Command AT+QSIMDET=?

Read Command AT+QSIMDET?

Write Command Response

+QSIMDET:

(list of supported <enable>s),(list of supported <insert_level>s) OK Response

+QSIMDET: <enable>,<insert_level>

OK Response AT+QSIMDET=<enable>,<insert_level>

OK If there is any error:

ERROR 300 ms The command takes effect after the module is rebooted. The configuration will be saved automatically. Maximum Response Time Characteristics Parameter

<enable>

Integer type. Enable or disable (U)SIM card detection. 0 Disable 1 Enable

<insert_level>

Integer type. The level of (U)SIM detection pin when a (U)SIM card is inserted. 0 Low level 1 High level EM060K_Series&EM120K-GL_Hardware_Design 34 / 92 LTE-A Module Series NOTE 1. Hot-swap function is invalid if the configured value of <insert_level> is inconsistent with hardware design. 2. The underlined value represents the default configuration. 3. USIM1_DET and USIM2_DET are pulled low by default, and will be internally pulled up to 1.8 V by software configuration only when (U)SIM hot-swap is enabled by AT+QSIMDET. For more details, see document [3]. 4.1.3. Normally Closed (U)SIM Card Connector With a normally closed (U)SIM card connector, USIM_DET pin is normally shorted to ground when there is no (U)SIM card inserted. (U)SIM card detection by high level is applicable to this type of connector. Once (U)SIM hot-swap is enabled by executing AT+QSIMDET=1,1, insertion of a (U)SIM card will drive USIM_DET from low to high level, and the removal of it will drive USIM_DET from high to low level. When the (U)SIM is absent, CD is shorted to ground and USIM_DET is at low level. When the (U)SIM is present, CD is open from ground and USIM_DET is at high level. The following figure shows a reference design of (U)SIM interface with a normally closed (U)SIM card connector. Figure 12: Reference Circuit for Normally Closed (U)SIM Card Connector NOTE All these resistors, capacitors and TVS array in the reference circuit should be close to (U)SIM card connector in PCB layout. EM060K_Series&EM120K-GL_Hardware_Design 35 / 92 Module(U)SIM CardConnectorUSIM_DETUSIM_DATAUSIM_CLKRSTCLKCDIOUSIM_VDDUSIM_RSTVCCGNDVPPGNDTVS array10-20K22R 22R 22R 33 pF33 pF33 pF100 nF LTE-A Module Series 4.1.4. Normally Open (U)SIM Card Connector With a normally open (U)SIM card connector, CD1 and CD2 of the connector are disconnected when there is no (U)SIM card inserted. (U)SIM card detection by low level is applicable to this type of connector. Once

(U)SIM hot-swap is enabled by executing AT+QSIMDET=1,0, insertion of a (U)SIM card will drive USIM_DET from high to low level, and the removal of it will drive USIM_DET from low to high level. When the (U)SIM is absent, CD1 is open from CD2 and USIM_DET is at high level. When the (U)SIM is inserted, CD1 is shorted to ground and USIM_DET is at low level. The following figure shows a reference design of (U)SIM interface with a normally open (U)SIM card connector. Figure 13: Reference Circuit for Normally Open (U)SIM Card Connector NOTE All these resistors, capacitors and TVS array in the reference circuit should be close to (U)SIM card connector in PCB layout. 4.1.5.

(U)SIM Card Connector Without Hot-swap If the (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for the (U)SIM card interface with a 6-pin (U)SIM card connector is illustrated by the following figure. EM060K_Series&EM120K-GL_Hardware_Design 36 / 92 Module(U)SIM CardConnectorUSIM_DETUSIM_DATAUSIM_CLKRSTCLKCD1IOUSIM_VDDUSIM_RSTVCCGNDVPPGNDTVS array10-20K22R 22R 22R 33 pF33 pF33 pF100 nF0RCD2 LTE-A Module Series Figure 14: Reference Circuit for 6-Pin (U)SIM Card Connector NOTE All these resistors, capacitors and TVS array in the reference circuit should be close to (U)SIM card connector in PCB layout. 4.1.6.

(U)SIM2 Card Compatible Design It should be noted that if the (U)SIM2 interface is used for an external (U)SIM card, the circuits are the same as those of (U)SIM1 interface. if the (U)SIM2 interface is used for an internal eSIM card, pins 40, 42, 44, 46 and 48 of the module must be kept open. A recommended compatible design for the (U)SIM2 interface is shown below. Figure 15: Recommended Compatible Design for (U)SIM2 Interface EM060K_Series&EM120K-GL_Hardware_Design 37 / 92 Module(U)SIM CardConnectorUSIM_DETUSIM_DATAUSIM_CLKRSTCLKIOUSIM_VDDUSIM_RSTVCCGNDVPPGNDTVS array10-20K22R 22R 22R 33 pF33 pF33 pF100 nFModule(U)SIM CardConnectorUSIM2_DETUSIM2_DATAUSIM2_CLKRSTCLKCDIOUSIM2_VDDUSIM2_RSTVCCGNDVPPGNDTVS array484644404210-20K22 22 22 33 pF33 pF33 pF100 nF0 0 0 0 0 eSIM LTE-A Module Series NOTE The five 0 resistors must be close to the module, and all other components should be close to (U)SIM card connector in PCB layout. 4.1.7.

(U)SIM Design Notices To enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design. Place the (U)SIM card connector as close to the module as possible. Keep the trace length less than 200 mm if possible. Keep (U)SIM card signals away from RF and VCC traces. Ensure the ground between the module and the (U)SIM card connector is short and wide. Keep the trace width of ground and USIM_VDD not less than 0.5 mm to maintain the same electric potential. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. To offer better ESD protection, add a TVS array of which the parasitic capacitance should be less than 10 pF. Add 22 resistors in series between the module and the (U)SIM card connector to facilitate debugging. The 33 pF capacitors are used to filter out RF interference. Additionally, keep the

(U)SIM peripheral circuit close to the (U)SIM card connector. For USIM_DATA, it is recommended to add a 20 k pull-up resistor near the (U)SIM card connector to improve the anti-jamming capability of the (U)SIM card. The (U)SIM card connector should be placed near the M.2 socket, because a long trace may lead to waveform distortion, which affects the signal quality. 4.2. USB Interface The module provides one integrated Universal Serial Bus (USB) interface which complies with USB 3.0 and 2.0 specifications and supports SuperSpeed (5 Gbps) on USB 3.0 and high-speed (480 Mbps) and full-speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, firmware upgrade (USB 2.0 only), software debugging, GNSS NMEA sentence output, and voice* over USB. Table 14: Pin Definition of USB Interface Pin No. Pin Name I/O Description Comment 7 9 USB_DP AIO USB differential data (+) USB_DM AIO USB differential data (-) Require differential impedance of 90 Test points must be reserved. EM060K_Series&EM120K-GL_Hardware_Design 38 / 92 LTE-A Module Series 29 31 35 37 USB_SS_TX_M AO USB 3.0 super-speed transmit (-) USB_SS_TX_P AO USB 3.0 super-speed transmit (+) USB_SS_RX_M AI USB 3.0 super-speed receive (-) USB_SS_RX_P AI USB 3.0 super-speed receive (+) Require differential impedance of 90 . For more details about the USB 3.0 and 2.0 specifications, please visit http://www.usb.org/home. The following figure presents a reference circuit for the USB interface. Figure 16: Reference Circuit for USB Interface AC coupling capacitors C3 and C4 must be placed close to the host and close to each other. C1 and C2 have been integrated inside the module, so do not place these two capacitors on your schematic and PCB. To ensure the signal integrity of USB 2.0 data traces, R1, R2, R3 and R4 must be placed close to the module, and the stubs must be minimized in PCB layout. Please follow the principles below when designing the USB interface to meet USB 3.0 and 2.0 specifications:

Route USB signal traces as differential pairs with surrounded ground. The impedance of USB 2.0 and USB 3.0 differential trace is 90 . For USB 2.0 signal traces, the trace length should be less than 120 mm, and the differential data pair matching should be less than 2 mm. For USB 3.0 signal traces, the intra-pair length matching (P/M) should be less than 0.7 mm, while the inter-pair length matching (Tx/Rx) should be less than 10 mm. Do not route signal traces under crystals, oscillators, magnetic devices, PCIE,other high-speed and RF signal traces. Route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. EM060K_Series&EM120K-GL_Hardware_Design 39 / 92 HostModuleUSB_DMUSB_DPUSB_SS_RX_PUSB_SS_RX_MUSB_SS_TX_PUSB_SS_TX_MBBUSB_DMUSB_DPUSB_SS_RX_PUSB_SS_RX_MUSB_SS_TX_PUSB_SS_TX_M9737353129TVS arrayTest PointsMinimize these stubs in PCB layout.C3 100 nFC4 100 nFC1 100 nFC2 100 nFR1 0 R2 0 R3 NM-0 R4 NM-0 LTE-A Module Series Junction capacitance of the ESD protection components might cause influences on USB data traces, so you should pay attention to the selection of the components. Typically, the stray capacitance should be less than 1.0 pF for USB 2.0, and less than 0.15 pF for USB 3.0. Keep the ESD protection components as close to the USB connector as possible. If possible, reserve 0 resistor on USB_DP and USB_DM traces respectively. 4.3. PCM Interface*

The module supports audio communication through external codec via Pulse Code Modulation (PCM) digital interface. The PCM interface supports the following modes:

Primary mode (short frame synchronization): the module works as both master and slave Auxiliary mode (long frame synchronization): the module works as master only In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256 kHz, 512 kHz, 1024 kHz or 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4096 kHz PCM_CLK at 16 kHz PCM_SYNC. In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates only with a 256 kHz PCM_CLK and an 8 kHz, 50 % duty cycle PCM_SYNC. The module supports 16-bit linear data format. The following figures show the primary modes timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary modes timing relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK. Figure 17: Primary Mode Timing EM060K_Series&EM120K-GL_Hardware_Design 40 / 92 PCM_CLKPCM_SYNCPCM_DOUTMSBLSBMSB125 s12256255PCM_DINMSBLSBMSB LTE-A Module Series Figure 18: Auxiliary Mode Timing The following table shows the pin definition of PCM interface which can be applied to audio codec design. Table 15: Pin Definition of PCM Interface Pin No. Pin Name I/O Description Comment 20 22 24 28 PCM_CLK DIO, PD PCM clock PCM_DIN DI, PD PCM data input PCM_DOUT DO, PD PCM data output 1.8 V PCM_SYNC DIO, PD PCM data frame sync The clock and mode can be configured by AT command. The default configuration is master mode using short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. For more details, see document [3]. 4.4. Control and Indication Interfaces Table 16: Pin Definition of Control and Indication Interfaces Pin No. Pin Name I/O Description Comment 8 W_DISABLE1#

DI, PU Airplane mode control VIHmin = 1.8 V VILmax = 0.4 V VILmin = -0.4 V EM060K_Series&EM120K-GL_Hardware_Design 41 / 92 PCM_CLKPCM_SYNCPCM_DOUTMSBLSBPCM_DIN125 sMSB123231LSB 10 WWAN_LED#

OD RF status indication LED 23 WAKE_ON_WAN#

OD Wake up the host LTE-A Module Series Active low. VCC. Active low. 1.8/3.3 V. Active low. 1.8 V, high level by 25 DPR DI, PU Dynamic power reduction default. 26 W_DISABLE2#

DI, PU GNSS control Active low. VIHmin = 1.8 V VILmax = 0.4 V VILmin = -0.4 V Active low. 60 WLAN_PA_EN DI Self-protection of QLN control 1.8 V 4.4.1. W_DISABLE1#

The module provides a W_DISABLE1# pin to disable or enable airplane mode through hardware operation. W_DISABLE1# is pulled up by default. Driving it low will configure the module into airplane mode. In airplane mode, the RF function will be disabled. The RF function can also be enabled or disabled through software AT commands. The following table shows the RF function status of the module. Table 17: RF Function Status W_DISABLE1#

Logic Level AT Command RF Function Status Operating Mode AT+CFUN=1 Enable Full functionality mode High Level AT+CFUN=0 Disable Minimum functionality mode AT+CFUN=4 Disable Airplane mode AT+CFUN=0 Low Level AT+CFUN=1 Disable Airplane mode AT+CFUN=4 4.4.2. W_DISABLE2#

The module provides a W_DISABLE2# pin to disable or enable the GNSS function. The W_DISABLE2#

pin is pulled up by default. Driving it low will disable the GNSS function. EM060K_Series&EM120K-GL_Hardware_Design 42 / 92 The GNSS function can also be controlled through software AT commands. The combination of W_DISABLE2# pin and AT commands controls the GNSS function. LTE-A Module Series Table 18: GNSS Function Status W_DISABLE2# Logic Level AT Commands GNSS Function Status High Level Low Level AT+QGPS=1 Enable AT+QGPSEND AT+QGPS=1 Disable AT+QGPSEND For details about AT commands mentioned above, see document [4]. A simple level-shifting circuit based on diodes is used on W_DISABLE1# pin and W_DISABLE2# pin which are pulled up to a 1.8 V voltage in the module. The control signals (GPIO) of the host device could be at 1.8 V or 3.3 V voltage level. W_DISABLE1# and W_DISABLE2# are active low signals. A reference circuit of the two pins is shown below. Figure 19: Reference Circuit of W_DISABLE1# and W_DISABLE2#

NOTE The voltage level of VCC_IO_HOST could be 1.8 V or 3.3 V typically. EM060K_Series&EM120K-GL_Hardware_Design 43 / 92 HostModuleW_DISABLE2#W_DISABLE1#BBGPIOGPIO268VDD 1.8 VR110KR210KVCC_IO_HOSTR3100KR4100K LTE-A Module Series 4.4.3. WWAN_LED#

The WWAN_LED# signal is used to indicate RF status of the module, and its sink current is up to 10 mA. To reduce power consumption of the LED, a current-limited resistor must be placed in series with the LED, as illustrated in the figure below. The LED is ON when the WWAN_LED# signal is at low level. Figure 20: WWAN_LED# Reference Circuit Table 19: Network Status Indications of WWAN_LED#

WWAN_LED# Logic Level Description Low Level (LED On) RF function is enabled. High Level (LED Off) RF function is disabled if any of the following occurs:

The (U)SIM card is not powered. W_DISABLE1# is at low level (airplane mode enabled). AT+CFUN=4 and AT+CFUN=0 (RF function disabled). 4.4.4. WAKE_ON_WAN#

The WAKE_ON_WAN# is an open drain pin, which requires a pull-up resistor on the host. When a URC returns, a 1 s low level pulse signal will be outputted to wake up the host. Table 20: State of the WAKE_ON_WAN#

WAKE_ON_WAN# State Module Operation Status Output a 1 s low level pulse signal Call/SMS/Data is incoming (to wake up the host) EM060K_Series&EM120K-GL_Hardware_Design 44 / 92 ModuleWWAN_LED#PMIC10VCC (Typ. 3.7 V)R1330 LED12, 470, 72, 74VCC Always at high level Idle/Sleep LTE-A Module Series Figure 21: Reference Circuit of WAKE_ON_WAN#

NOTE The voltage level on VCC_IO_HOST depends on the host side due to the open drain in pin 23 of the module. 4.4.5. DPR The module provides a DPR (Dynamic Power Reduction) pin for body SAR (Specific Absorption Rate) detection. The signal is sent from a host system proximity sensor to the module to provide an input trigger, which will reduce the output power in burst transmission. Table 21: Pin definition of DPR Pin No. Pin Name I/O Description Comment 25 DPR DI, PU Dynamic power reduction High level by default. Active low. Table 22: Function of the DPR Signal DPR Logic Level Function High/Floating No backoff of max transmitting power occurred EM060K_Series&EM120K-GL_Hardware_Design 45 / 92 HostModuleWAKE_ON_WAN#BBGPIO23VCC_IO_HOSTWake up the host1 sHLR110K Low Backoff of max transmitting power occurred according to configuration in SAR efs file LTE-A Module Series 4.4.6. WLAN_PA_EN QLN enables self-protection circuit (integrated inside QLN) when WLAN_PA_EN is at high level. In LTE mode, WLAN_PA_EN is set to 0 (low level) by default. When WLAN_PA_EN is set to 1 (high level), the LNA will be in self-protection mode. Table 23: Pin definition of WLAN_PA_EN Pin No. Pin Name I/O Description Comment 60 WLAN_PA_EN DI, PD Self-protection of QLN control It is not connected for 1.8 V power domain;

EM060K-NA. 4.5. Cellular/WLAN COEX Interface*

The module provides a cellular/WLAN coexistence interface. The following table shows the pin definition of this interface. Table 24: Pin Definition of Cellular/WLAN COEX Interface Pin No. Pin Name I/O Description Comment 62 64 COEX_RXD DI, PD LTE/WLAN coexistence receive 1.8 V COEX_TXD DO, PD LTE/WLAN coexistence transmit 1.8 V EM060K_Series&EM120K-GL_Hardware_Design 46 / 92 LTE-A Module Series 4.6. Configuration Pins Table 25: List of Configuration Pins Config_0 Config_1 Config_2 Config_3 Module Type and Port

(Pin 21)

(Pin 69)

(Pin 75)

(Pin 1) Main Host Interface Configuration GND GND NC NC WWANUSB3.0 2 Table 26: Pin Definition of Configuration Pins Pin No. Pin Name I/O Description 21 69 75 1 CONFIG_0 DO Connected to GND internally CONFIG_1 DO Connected to GND internally CONFIG_2 DO Not connected internally CONFIG_3 DO Not connected internally The following figure shows a reference circuit for these four pins. Figure 22: Recommended Circuit of Configuration Pins EM060K_Series&EM120K-GL_Hardware_Design 47 / 92 HostModuleCONFIG_0CONFIG_1CONFIG_2CONFIG_3GPIOGPIOGPIOGPIO2169751VCC_IO_HOSTR1100KR2100KR3100KR4100K0 NM-0 NM-0 0 NOTE The voltage level VCC_IO_HOST depends on the host side, and could be a 1.8 V or 3.3 V voltage level. LTE-A Module Series 4.7. PCIe Interface The module provides one integrated PCIe (Peripheral Component Interconnect Express) interface which can transmit data. The module supports PCIe Root Complex (RC) mode only. Compliant with PCI Express Base Specification Revision 2.0 Data rate up to 5 Gbps/lane Can be connected to external WLAN IC RC mode only Table 27: Pin Definition of the PCIe Interface Pin Name Pin No. I/O Description Comment PCIE_REFCLK_M 53 PCIE_REFCLK_P 55 PCIE_TX_M PCIE_TX_P PCIE_RX_M PCIE_RX_P 41 43 47 49 PCIE_CLKREQ_N 52 AO AO AO AO AI AI DI PCIe reference clock (-) PCIe reference clock (+) PCIe transmit (-) PCIe transmit (+) PCIe receive (-) PCIe receive (+) PCIe clock request PCIE_RST_N 50 DO PCIe reset Require differential impedance of 95 . If unused, keep them unconnected. If unused, keep it unconnected. If unused, keep it unconnected. RC mode only. PCIE_WAKE_N 54 DI PCIe wake up If unused, keep it open. 4.7.1. Root Complex Mode In this mode, the module works as a PCIe RC device. The following figure shows a reference circuit of PCIe RC mode. EM060K_Series&EM120K-GL_Hardware_Design 48 / 92 LTE-A Module Series Figure 23: Reference Circuit of PCIe Interface (RC Mode) To enhance the reliability and availability in applications, follow the criteria below in the PCIe interface circuit design:

Keep the PCIe data and control signals away from sensitive circuits and signals, such as RF, USB, and clock signals. Add a capacitor in series on Rx traces to prevent any DC bias. Keep the maximum trace length less than 300 mm. Keep the length matching of each differential data pair (Tx/Rx/REFCLK) less than 0.7 mm for PCIe routing traces. Keep the differential impedance of PCIe data trace as 95 10 %. Do not route PCIe data traces under components or cross them with other traces. Table 28: PCIe Trace Length Inside the Module Pin No. Pin Name Length (mm) Length Difference (mm) 53 55 41 43 47 PCIE_REFCLK_M 20.83 PCIE_REFCLK_P 20.59 PCIE_TX_M PCIE_TX_P 21.26 21.58 PCIE_RX_M 20.16 0.24 0.32 0.31 EM060K_Series&EM120K-GL_Hardware_Design 49 / 92 GNDPCIE_TX_MPCIE_TX_PGNDPCIE_RX_MPCIE_RX_PPCIE_RX_MPCIE_RX_PPCIE_TX_MPCIE_TX_PC3C4C1C2100nF100nF100nF100nFModuleWLANPCIE_REFCLK_PPCIE_REFCLK_MPCIE_REFCLK_PPCIE_REFCLK_MPCIE_RST_NPCIE_CLKREQ_NPCIE_WAKE_NPCIE_RST_NPCIE_CLKREQ_NPCIE_WAKE_NR2100KR1100KVDD_WLANNMR3Wi-FiAntennaR4100K 49 PCIE_RX_P 19.85 LTE-A Module Series EM060K_Series&EM120K-GL_Hardware_Design 50 / 92 LTE-A Module Series 5 Antenna Interfaces Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. 5.1. Cellular Network 5.1.1. Antenna Interfaces & Frequency Bands The module provides a main antenna connector and a diversity/GNSS antenna connector, which are used to resist the fall of signals caused by high-speed movement and multipath effect. The impedance of antenna ports is 50 . Table 29: Antenna Connectors Definition for EM060K-GL & EM120K-GL Antenna Connector I/O Description Comment ANT_MAIN AIO LTE: TRx WCDMA: TRx Main antenna interface:

Diversity/GNSS antenna interface:

50 impedance ANT_DRx/GNSS AI LTE: DRx WCDMA: DRx GNSS: GPS/GLONASS/Galileo/BDS Table 30: Antenna Connectors Definition for EM060K-NA Antenna Connector I/O Description Comment ANT_MAIN ANT_DRx AIO AI Main antenna interface:

LTE: TRx Diversity antenna interface:

LTE: DRx 50 impedance EM060K_Series&EM120K-GL_Hardware_Design 51 / 92 ANT_GNSS AI GNSS antenna interface:

GNSS: GPS/GLONASS/Galileo/BDS LTE-A Module Series Table 31: Frequency Bands for EM060K-GL & EM120K-GL 3GPP Band Transmit Receive WCDMA B1 19201980 21102170 WCDMA B2 18501910 19301990 WCDMA B3 17101785 18051880 WCDMA B4 17101755 21102155 WCDMA B5 WCDMA B6 WCDMA B8 824849 830840 880915 WCDAM B19 830845 869894 875885 925960 875890 LTE-FDD B1 19201980 21102170 LTE-FDD B2 18501910 19301990 LTE-FDD B3 17101785 18051880 LTE-FDD B4 17101755 21102155 LTE-FDD B5 824849 869894 LTE-FDD B7 25002570 26202690 LTE-FDD B8 880915 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 699716 777787 788798 704716 815830 830845 925960 729746 746756 758768 734746 860875 875890 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EM060K_Series&EM120K-GL_Hardware_Design 52 / 92 LTE-A Module Series LTE-FDD B20 832862 791821 LTE-FDD B25 18501915 19301995 LTE-FDD B26 814849 LTE-FDD B28 703748 LTE-FDD B29 3

859894 758803 717728 LTE-FDD B30 23052315 23502360 LTE-FDD B32 8

14521496 LTE-FDD B66 17101780 21102200 LTE-FDD B71 663-698 617-652 LTE-TDD B34 2010-2025 2010-2025 LTE-TDD B38 25702620 25702620 LTE-TDD B39 18801920 18801920 LTE-TDD B40 23002400 23002400 LTE-TDD B41 24962690 24962690 LTE-TDD B42 34003600 34003600 LTE-TDD B43 36003800 36003800 LTE-TDD B46 8

51505925 LTE-TDD B48 35503700 35503700 Table 32: Frequency Bands for EM060K-NA 3GPP Band Transmit Receive LTE-FDD B2 18501910 19301990 LTE-FDD B4 17101755 21102155 LTE-FDD B5 824849 869894 LTE-FDD B7 25002570 26202690 MHz MHz MHz MHz MHz MHz MHz MHz MHZ MHZ MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz EM060K_Series&EM120K-GL_Hardware_Design 53 / 92 LTE-A Module Series LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 699716 777787 788798 704716 729746 746756 758768 734746 LTE-FDD B25 18501915 19301995 LTE-FDD B26 814849 LTE-FDD B29 10

859894 717728 LTE-FDD B30 23052315 23502360 LTE-FDD B66 17101780 21102200 LTE-FDD B71 663-698 617-652 LTE-TDD B41 24962690 24962690 LTE-TDD B48 35503700 35503700 LTE-TDD B42 34003600 34003600 LTE-TDD B43 36003800 36003800 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHZ MHz MHz MHz MHz 5.1.2. Antenna Tuner Control Interface*

ANTCTL[0:3] and RFFE interfaces are used for antenna tuner control and should be routed to an appropriate antenna control circuit. 5.1.2.1. Antenna Tuner Control Interface through GPIOs Table 33: Pin Definition of Antenna Tuner Control Interface through GPIOs Pin No. 59 61 63 Pin Name I/O Description Comment ANTCTL0 DO, PD 1.8 V ANTCTL1 DO, PD Antenna tuner GPIO control 1.8 V ANTCTL2 DO, PD 1.8 V 10 LTE-FDD B29/B32 and LTE-TDD B46 support Rx only and are only for secondary component carrier. EM060K_Series&EM120K-GL_Hardware_Design 54 / 92 LTE-A Module Series 65 ANTCTL3 DO, PD 1.8 V 5.1.2.2. Antenna Tuner Control Interface through RFFE Table 33: Pin Definition of Antenna Tuner Control Interface through RFFE Pin No. Pin Name I/O Description Comment RFFE_CLK DO, PD Used for external MIPI IC control 1.8 V RFFE_DATA DIO, PD Used for external MIPI IC control 1.8 V 56 58 NOTE If RFFE_CLK and RFFE_DATA are required, please contact Quectel for more details. 5.1.3. Tx Power Table 34: EM060K-GL and EM120K-GL Tx Power Frequency Band Modulation Max. Min. Comment WCDMA BPSK 23 dBm 2 dB

< -50 dBm

LTE-FDD QPSK 23 dBm 2 dB

< -40 dBm 10 MHz, 1RB LTE-TDD QPSK 23 dBm 2 dB

< -40 dBm 10 MHz, 1RB Table 35: EM060K-NA Tx Power Frequency Band Modulation Max. Min. Comment LTE-FDD QPSK 23 dBm 2 dB

< -40 dBm 10 MHz, 1RB LTE-TDD QPSK 23 dBm 2 dB

< -40 dBm 10 MHz, 1RB EM060K_Series&EM120K-GL_Hardware_Design 55 / 92 LTE-A Module Series 5.1.4. Rx Sensitivity Table 36: EM060K-GL Rx Sensitivity Frequency Band Primary Diversity SIMO 11 3GPP (SIMO) (dBm) Comment 12 WCDMA B1

-108.5

-109.5

-111.5

-106.7 WCDMA B2

-108.5

-109.5

-111.5

-104.7 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B6

-109

-108

-110.5

-110.5

-109

-111.5

-103.7

-108.5

-111

-106.7

-111

-111

-113

-104.7

-113

-106.7 WCDMA B8

-111

-111.5

-113.5

-103.7 WCDMA B19

-110.5

-111

-113

-106.7 LTE-FDD B1

-96.5

-98

-100

-96.3 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5

-97

-98

-97

-99

-97.5

-100

-94.3

-97.5

-100.5

-93.3

-97

-99

-99.5

-96.3

-101.5

-94.3 LTE-FDD B7

-96.5

-97.5

-99.5

-94.3 LTE-FDD B8

-99

-99

-101.5

-93.3 LTE-FDD B12

-98.5

-99.5

-101.5

-93.3 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18

-99

-99

-98.5

-98.5

-99.5

-101.5

-93.3

-99.5

-101.5

-93.3

-99.5

-101.5

-93.3

-99

-101.5

-96.3 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 11 SIMO is a smart antenna technology that uses a single antenna at the transmitter side and multiple antennas at the receiver side, which can improve Rx performance. 12 The RB configuration follows 3GPP specification. EM060K_Series&EM120K-GL_Hardware_Design 56 / 92 LTE-FDD B19

-98.5 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28

-99

-97

-98.5

-99.5

-99

-98

-101.5

-96.3

-101

-93.3

-97.5

-100

-92.8

-99

-101.5

-93.8

-99.5

-102

-94.8 LTE-FDD B29 13

-98.5

-98.5

-101

-93.3 LTE-FDD B30 LTE-FDD B32 13 LTE-FDD B66 LTE-FDD B71 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40

-95

-98

-97

-99

-97.5

-97.5

-97.5

-95.5

-96.5

-98.5

-95.3

-96.5

-99.5

-96.3

-97

-99.5

-95.8

-98.5

-101.5

-94.3

-98

-100

-96.3

-97.5

-99.5

-96.3

-97

-99.5

-96.3

-95.5

-98.5

-96.3 LTE-TDD B41

-97

-97

-99.5

-94.3 LTE-TDD B42 LTE-TDD B43

-97.5

-97.5 LTE-TDD B46 13

-93 LTE-TDD B48

-97.5

-98.5

-100.5

-95.0

-98.5

-100.5

-95.0

-92

-98

-95.5

-88.5

-100.5

-95.0 LTE-A Module Series 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 20 MHz 10 MHz 13 The test results are based on CA_2A-29A, CA_20A-32A and CA_46A-66A. LTE-FDD B29/B32 and LTE-TDD B46 support Rx only and are only for secondary component carrier. EM060K_Series&EM120K-GL_Hardware_Design 57 / 92 Table 37: EM120K-GL Rx Sensitivity Frequency Band Primary Diversity SIMO 11 3GPP (SIMO)

(dBm) Comment 12 LTE-A Module Series WCDMA B1

-108.5

-109.5

-111.5

-106.7 WCDMA B2

-108.5

-109.5

-111.5

-104.7 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B6

-109

-108

-110.5

-110.5

-109

-111.5

-103.7

-108.5

-111

-106.7

-111

-111

-113

-113

-104.7

-106.7 WCDMA B8

-111

-111.5

-113.5

-103.7 WCDMA B19

-110.5 LTE-FDD B1

-96.5 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8

-97

-98

-97

-99

-96.5

-99

-111

-98

-97.5

-113

-100

-100

-106.7

-96.3

-94.3 10 MHz 10 MHz

-97.5

-100.5

-93.3 10 MHz

-97

-99

-99.5

-96.3 10 MHz

-101.5

-94.3 10 MHz

-97.5

-99.5

-94.3 10 MHz

-99

-101.5

-93.3 10 MHz LTE-FDD B12

-98.5

-99.5

-101.5

-93.3 10 MHz LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25

-99

-99

-98.5

-98.5

-98.5

-99

-97

-99.5

-101.5

-93.3 10 MHz

-99.5

-101.5

-93.3 10 MHz

-99.5

-101.5

-93.3 10 MHz

-99

-99

-98

-97.5

-101.5

-96.3 10 MHz

-101.5

-96.3 10 MHz

-101

-100

-93.3

-92.8 10 MHz 10 MHz EM060K_Series&EM120K-GL_Hardware_Design 58 / 92 LTE-A Module Series LTE-FDD B26 LTE-FDD B28

-98.5

-99.5 LTE-FDD B29 13

-98.5

-99

-101.5

-93.8 10 MHz

-99.5

-98.5

-102

-101

-94.8

-93.3 10 MHz 10 MHz LTE-FDD B30 LTE-FDD B32 13 LTE-FDD B66 LTE-FDD B71 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40

-95

-98

-97

-99

-97.5

-97.5

-97.5

-95.5

-96.5

-98.5

-95.3 10 MHz

-96.5

-99.5

-96.3 10 MHz

-97

-99.5

-95.8 10 MHz

-98.5

-101.5

-94.3 10 MHz

-98

-100

-96.3 10 MHz

-97.5

-99.5

-96.3 10 MHz

-97

-99.5

-96.3 10 MHz

-95.5

-98.5

-96.3 10 MHz LTE-TDD B41

-97

-97

-99.5

-94.3 10 MHz LTE-TDD B42 LTE-TDD B43

-97.5

-97.5 LTE-TDD B46 13

-93 LTE-TDD B48

-97.5

-98.5

-100.5

-95.0 10 MHz

-98.5

-100.5

-95.0 10 MHz

-92

-98

-95

-88.5 20 MHz

-100.5

-95.0 10 MHz Table 38: EM060K-NA Rx Sensitivity Frequency Bands Primary Diversity SIMO 11 3GPP (SIMO)

(dBm) Comment 12 LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B12 LTE-FDD B13

-99.5

-99

-99.5

-97

-99.3

-99.2

-99.4

-102

-94.3 10 MHz

-98.3

-101.1

-96.3 10 MHz

-99.4

-97.2

-102

-100

-94.3

-94.3 10 MHz 10 MHz

-100.3

-102.4

-93.3 10 MHz

-100.5

-102.6

-93.3 10 MHz EM060K_Series&EM120K-GL_Hardware_Design 59 / 92 LTE-A Module Series LTE-FDD B14

-99

-100.3

-102.3

-93.3 10 MHz LTE-FDD B17 LTE-FDD B25 LTE-FDD B26

-99.2

-99.4

-99.2

-100.3

-102.5

-93.3 10 MHz

-99.2

-101.9

-92.8 10 MHz

-99.4

-101.9

-93.8 10 MHz LTE-FDD B29 13

-98.5

-99

-102

-93.3 10 MHz LTE-FDD B30

-96.8

-97.7

-99.4

-95.3 10MHz

-99

-100

-97

-97.8

-100.9

-95.8 10 MHz

-100.3

-102.8

-94.3 10 MHz

-98.2

-100.3

-94.3 10 MHz

-98.2

-100.2

-102.3

-95.0 10 MHz LTE-FDD B66 LTE-FDD B71 LTE-TDD B41 LTE-TDD B48/B42/B43 5.2. GNSS 5.2.1. Antenna Interface & Frequency Bands The module includes a fully integrated global navigation satellite system solution. The module supports standard NMEA 0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, the module GNSS engine is switched off. It has to be switched on via AT command. For more details, see document [4]. Table 39: GNSS Frequency Type Frequency GPS/Galileo 1575.42 1.023 GLONASS 1601.65 4.15 BDS 1561.098 2.046 Unit MHz MHz MHz EM060K_Series&EM120K-GL_Hardware_Design 60 / 92 5.2.2. GNSS Performance Table 40: GNSS Performance Parameter Description Condition Acquisition Autonomous Sensitivity Reacquisition Autonomous Tracking Autonomous TTFF Cold start

@ open sky Warm start

@ open sky Hot start

@ open sky Accuracy CEP-50 NOTE Autonomous XTRA enabled Autonomous XTRA enabled Autonomous XTRA enabled Autonomous

@ open sky LTE-A Module Series Typ.

-146

-158

-158 35 13 23 3 2 2 2 Unit dBm dBm dBm s s s s s s m 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock. 3. Acquisition sensitivity: the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command. EM060K_Series&EM120K-GL_Hardware_Design 61 / 92 LTE-A Module Series 5.3. Antenna Design Requirements Table 41: Antenna Requirements Type Requirements Main Antenna

(Tx/Rx) Diversity Antenna

(RX) Diversity/GNSS Antenna VSWR: 2 Efficiency: >30 %

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss:

- < 1 dB: LB (<1 GHz)

- < 1.5 dB: MB (12.3 GHz)

- < 2 dB: LB (> 2.3 GHz) NOTE It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. EM060K_Series&EM120K-GL_Hardware_Design 62 / 92 LTE-A Module Series 5.4. Antenna Connectors 5.4.1. Antenna Connector Location The antenna connector locations are shown below. Figure 24: Antenna Connectors on EM060K-GL & EM120K-GL Figure 25: Antenna Connectors on EM060K-NA EM060K_Series&EM120K-GL_Hardware_Design 63 / 92 Main AntennaDiversity/GNSS AntennaMain AntennaDiversity/GNSS AntennaMain AntennaDiversity AntennaGNSS Antenna LTE-A Module Series NOTE The antennas from left to right are respectively main antenna, diversity antenna and GNSS Antenna. 5.4.2. Antenna Connector Specifications The modules are mounted with standard 2 mm 2 mm receptacle antenna connectors for convenient antenna connection. The connector dimensions are illustrated as below:

Figure 26: Dimensions of the Receptacle (Unit: mm) Table 42: Major Specifications of the RF Connectors Item Specification Nominal Frequency Range DC to 6 GHz Nominal Impedance 50 Temperature Rating

-40 to +85 C Voltage Standing Wave Ratio (VSWR) Max. 1.3 (DC3 GHz) Max. 1.45 (36 GHz) Meet the requirements of:

EM060K_Series&EM120K-GL_Hardware_Design 64 / 92 LTE-A Module Series 5.4.3. Antenna Connector Installation The receptacle RF connector used in conjunction with the modules will accept two types of mated plugs that will meet a maximum height of 1.2 mm using a 0.81 mm coaxial cable or a maximum height of 1.45 mm utilizing a 1.13 mm coaxial cable. The following figure shows the dimensions of mated plugs using 0.81 mm coaxial cables:

Figure 27: Dimensions of Mated Plugs (0.81/1.13 mm Coaxial Cables) (Unit: mm) The following figure illustrates the connection between the receptacle RF connector on the modules and the mated plugs using a 0.81 mm coaxial cable. Figure 28: Space Factor of Mated Connectors (0.81 mm Coaxial Cables) (Unit: mm) The following figure illustrates the connection between the receptacle RF connector on EM060K-GL and EM060K_Series&EM120K-GL_Hardware_Design 65 / 92 EM120K-GL and the mated plugs using a 1.13 mm coaxial cable. LTE-A Module Series Figure 29: Space Factor of Mated Connectors ( 1.13 mm Coaxial Cables) (Unit: mm) EM060K_Series&EM120K-GL_Hardware_Design 66 / 92 LTE-A Module Series 6 Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the modules are listed in the following table. Table 43: Absolute Maximum Ratings Parameter VCC Min.

-0.3 Typ.

Max. 4.7 Unit V 6.2. Power Supply Ratings The typical input voltage of the module is 3.7 V. Table 44: Power Supply Requirements Parameter Description Condition Min. Typ. Max. Unit VCC Voltage Ripple Power supply for the module The actual input voltages must be kept between the minimum and 3.135 3.7 4.4 V maximum values.

30 100 mV EM060K_Series&EM120K-GL_Hardware_Design 67 / 92 6.3. Power Consumption LTE-A Module Series Table 45: EM060K-GL Power Consumption (3.7 V Power Supply) Description Condition Typ. Unit OFF state Power down Sleep State AT+CFUN=0 @ USB2.0 Suspend AT+CFUN=0 @ USB3.0 Suspend AT+CFUN=4 @ USB2.0 Suspend AT+CFUN=4 @ USB3.0 Suspend WCDMA PF = 64 @ USB2.0 Suspend WCDMA PF = 64 @ USB3.0 Suspend LTE-FDD PF = 64 @ USB2.0 Suspend LTE-FDD PF = 64 @ USB3.0 Suspend LTE-TDD PF = 64 @ USB2.0 Suspend LTE-TDD PF = 64 @ USB3.0 Suspend WCDMA PF = 64 (USB Disconnect) WCDMA PF = 64 (USB2.0 Connect) WCDMA PF = 64 (USB3.0 Connect) LTE-FDD PF = 64 (USB Disconnect) ldle State LTE-FDD PF = 64 (USB2.0 Connect) LTE-FDD PF = 64 (USB3.0 Connect) LTE-TDD PF = 64 (USB Disconnect) LTE-TDD PF = 64 (USB2.0 Connect) LTE-TDD PF = 64 (USB3.0 Connect) WCDMA Data WCDMA B1 HSDPA CH10700 @ 22.2 dBm 70 1.65 1.67 1.66 1.88 3.09 3.01 3.3 3.3 3.44 3.47 19.18 20.07 38 19.47 21.22 38 19.5 21.37 38 620 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EM060K_Series&EM120K-GL_Hardware_Design 68 / 92 Transfer

(GNSS Off) WCDMA B1 HSUPA CH10700 @ 21 dBm WCDMA B2 HSDPA CH9800 @ 22.1 dBm WCDMA B2 HSUPA CH9800 @ 20.3 dBm WCDMA B3 HSDPA CH1338 @ 22.2 dBm WCDMA B3 HSUPA CH1338 @ 20 dBm WCDMA B4 HSDPA CH1638 @ 22.1 dBm WCDMA B4 HSUPA CH1638 @ 20.3 dBm WCDMA B5 HSDPA CH4407 @ 22.2 dBm WCDMA B5 HSUPA CH4407 @ 22.2 dBm WCDMA B6 HSDPA CH4400 @ 22.2 dBm WCDMA B6 HSUPA CH4400 @ 22.3 dBm WCDMA B8 HSDPA CH3012 @ 22 dBm WCDMA B8 HSUPA CH3012 @ 21.5 dBm WCDMA B19 HSDPA CH738 @ 22 dBm WCDMA B19 HSUPA CH738 @ 22.5 dBm LTE-FDD B1 CH300 @ 23.10 dBm LTE-FDD B2 CH900 @ 23.16 dBm LTE-FDD B3 CH1575 @ 23.13 dBm LTE-FDD B4 CH2175 @ 23.05 dBm LTE Data Transfer

(GNSS Off) LTE-FDD B5 CH2525 @ 23.13 dBm LTE-FDD B7 CH3100 @ 23.22 dBm LTE-FDD B8 CH3625 @ 23.12 dBm LTE-FDD B12 CH5095 @ 23.07 dBm LTE-FDD B13 CH5230 @ 23.11 dBm LTE-FDD B14 CH5330 @ 23.12 dBm LTE-A Module Series 520 550 450 590 470 560 460 590 580 570 580 550 560 520 580 740 690 700 682 690 900 660 650 585 540 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EM060K_Series&EM120K-GL_Hardware_Design 69 / 92 LTE-A Module Series LTE-FDD B17 CH5790 @ 23.05 dBm LTE-FDD B18 CH5925 @ 23.14 dBm LTE-FDD B19 CH6075 @ 23.18 dBm LTE-FDD B20 CH6300 @ 23.17 dBm LTE-FDD B25 CH8365 @ 23.21 dBm LTE-FDD B26 CH8865@ 23.14 dBm LTE-FDD B28 CH9360 @ 22.95 dBm 565 590 610 575 700 710 615 LTE-FDD B30 CH9820 @ 23.03 dBm 1070 LTE-FDD B66 CH66886 @ 23.15 dBm LTE-FDD B71 CH68786 @ 23.05 dBm LTE-TDD B34 CH36275@ 23.10 dBm LTE-TDD B38 CH38000 @ 23.14 dBm LTE-TDD B39 CH38450 @ 23.06 dBm LTE-TDD B40 CH39150 @ 23.04 dBm LTE-TDD B41 CH40740 @ 23.20 dBm LTE-TDD B42 CH42590 @ 23.28 dBm LTE-TDD B43 CH44590 @ 23.08 dBm LTE-TDD B48 CH55990 @ 23.09 dBm WCDMA B1 CH10700 @ 23.2 dBm WCDMA B2 CH9800 @ 23.1 dBm WCDMA B3 CH1338 @ 23.2 dBm WCDMA B4 CH1638 @ 23.1 dBm WCDMA B5 CH4407 @ 23.2 dBm WCDMA B6 CH4400 @ 23.2 dBm WCDMA B8 CH3012 @ 23 dBm 690 670 350 485 360 450 460 440 390 415 700 590 680 630 660 660 610 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA Voice* Call EM060K_Series&EM120K-GL_Hardware_Design 70 / 92 WCDMA B19 CH738 @ 23 dBm 620 mA LTE-A Module Series Table 46: EM060K-NA Power Consumption (3.7 V Power Supply) Description Condition Typ. Unit OFF state Power down Sleep State AT+CFUN=0 @ USB2.0 Suspend AT+CFUN=0 @ USB3.0 Suspend AT+CFUN=4 @ USB2.0 Suspend AT+CFUN=4 @ USB3.0 Suspend LTE-FDD PF = 64 @ USB2.0 Suspend LTE-FDD PF = 64 @ USB3.0 Suspend LTE-TDD PF = 64 @ USB2.0 Suspend LTE-TDD PF = 64 @ USB3.0 Suspend LTE-FDD PF = 64 (USB Disconnect) LTE-FDD PF = 64 (USB 2.0 Connect) 70 1.56 1.58 1.62 1.63 3.06 3.11 3.2 3.31 18.99 20.61 ldle State LTE-FDD PF = 64 (USB 3.0 Connect) 38 LTE-TDD PF = 64 (USB Disconnect) LTE-TDD PF = 64 (USB 2.0 Connect) LTE-TDD PF = 64 (USB 3.0 Connect) LTE Data Transfer

(GNSS Off) LTE-FDD B2 23.25 dBm LTE-FDD B4 22.99 dBm LTE-FDD B5 23.33 dBm LTE-FDD B7 23.3 dBm LTE-FDD B12 23.29 dBm LTE-FDD B13 23.22 dBm 18.85 20.87 38 591 562 584 800 623 611 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EM060K_Series&EM120K-GL_Hardware_Design 71 / 92 LTE-A Module Series LTE-FDD B14 23.36 dBm LTE-FDD B17 23.16 dBm LTE-FDD B25 23.06 dBm LTE-FDD B26 23.35 dBm LTE-FDD B30 22.70 dBm LTE-FDD B66 23.12 dBm LTE-FDD B71 23.38 dBm LTE-TDD B41 23.6 dBm LTE-TDD B48/B42/B43 23.32 dBm 600 600 599 659 858 610 586 407 371 mA mA mA mA mA mA mA mA mA Table 47: EM120K-GL Power Consumption (3.7 V Power Supply) Description Condition Typ. Unit OFF state Power down AT+CFUN=0 @ USB2.0 Suspend AT+CFUN=0 @ USB3.0 Suspend AT+CFUN=4 @ USB2.0 Suspend AT+CFUN=4 @ USB3.0 Suspend WCDMA PF = 64 @ USB2.0 Suspend WCDMA PF = 64 @ USB3.0 Suspend LTE-FDD PF = 64 @ USB2.0 Suspend LTE-FDD PF = 64 @ USB3.0 Suspend LTE-TDD PF = 64 @ USB2.0 Suspend LTE-TDD PF = 64 @ USB3.0 Suspend WCDMA PF = 64 (USB Disconnect) WCDMA PF = 64 (USB2.0 Connect) Sleep State ldle State 70 1.71 1.74 1.78 1.78 3.0 3.06 3.27 3.3 3.29 3.37 18.72 19.75 A mA mA mA mA mA mA mA mA mA mA mA mA EM060K_Series&EM120K-GL_Hardware_Design 72 / 92 WCDMA PF = 64 (USB3.0 Connect) LTE-FDD PF = 64 (USB Disconnect) LTE-FDD PF = 64 (USB2.0 Connect) LTE-FDD PF = 64 (USB3.0 Connect) LTE-TDD PF = 64 (USB Disconnect) LTE-TDD PF = 64 (USB2.0 Connect) LTE-TDD PF = 64 (USB3.0 Connect) WCDMA B1 HSDPA CH10700 @ 22.2 dBm WCDMA B1 HSUPA CH10700 @21 dBm WCDMA B2 HSDPA CH9800 @ 22.1 dBm WCDMA B2 HSUPA CH9800 @ 20.3 dBm WCDMA B3 HSDPA CH1338 @ 22.2 dBm WCDMA B3 HSUPA CH1338 @ 20 dBm WCDMA B4 HSDPA CH1638 @ 22.1 dBm WCDMA B4 HSUPA CH1638 @ 20.3 dBm WCDMA B5 HSDPA CH4407 @ 22.2 dBm WCDMA B5 HSUPA CH4407 @ 22.2 dBm WCDMA B6 HSDPA CH4400 @ 22.2 dBm WCDMA B6 HSUPA CH4400 @ 22.3 dBm WCDMA B8 HSDPA CH3012 @ 22 dBm WCDMA B8 HSUPA CH3012 @ 21.5 dBm WCDMA B19 HSDPA CH738 @ 22 dBm WCDMA B19 HSUPA CH738 @ 22.5 dBm WCDMA Data Transfer

(GNSS Off) LTE Data Transfer

(GNSS Off) LTE-FDD B1 CH300 @ 23.02 dBm LTE-FDD B2 CH900 @ 23.1 dBm LTE-A Module Series 38 18.96 20.85 38 19.11 20.7 38 620 520 550 450 590 470 560 460 590 580 570 580 550 560 520 580 740 690 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EM060K_Series&EM120K-GL_Hardware_Design 73 / 92 LTE-A Module Series LTE-FDD B3 CH1575 @ 23.13 dBm LTE-FDD B4 CH2175 @ 23.06 dBm LTE-FDD B5 CH2525 @ 23.13 dBm LTE-FDD B7 CH3100 @ 23.03 dBm LTE-FDD B8 CH3625 @ 23.15 dBm LTE-FDD B12 CH5095 @ 23.03 dBm LTE-FDD B13 CH5230 @ 23.10 dBm LTE-FDD B14 CH5330 @ 22.95 dBm LTE-FDD B17 CH5790 @ 23.05 dBm LTE-FDD B18 CH5925 @ 23.16 dBm LTE-FDD B19 CH6075 @ 23.17 dBm LTE-FDD B20 CH6300 @ 23.17 dBm LTE-FDD B25 CH8365 @ 23.35 dBm LTE-FDD B26 CH8865@ 23.15 dBm LTE-FDD B28 CH9360 @ 23.05 dBm 700 682 690 900 660 650 585 540 565 600 620 581 700 710 615 LTE-FDD B30 CH9820 @ 23.24 dBm 1070 LTE-FDD B66 CH66886 @ 23.10 dBm LTE-FDD B71 CH68786 @ 23.36 dBm LTE-TDD B34 CH36275 @ 23.11 dBm LTE-TDD B38 CH38000 @ 23.13 dBm LTE-TDD B39 CH38450 @ 23.05 dBm LTE-TDD B40 CH39150 @ 23.21 dBm LTE-TDD B41 CH40740 @ 23.09 dBm LTE-TDD B42 CH42590 @ 23.21 dBm LTE-TDD B43 CH44590 @ 23.14 dBm 690 670 350 485 360 460 460 440 390 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EM060K_Series&EM120K-GL_Hardware_Design 74 / 92 LTE-TDD B48 CH55990 @ 23.10 dBm WCDMA B1 CH10700 @23.2 dBm WCDMA B2 CH9800 @ 23.1 dBm WCDMA B3 CH1338 @ 23.2 dBm WCDMA Voice* Call WCDMA B4 CH1638 @ 23.1 dBm WCDMA B5 CH4407 @ 23.2 dBm WCDMA B6 CH4400 @ 23.2 dBm WCDMA B8 CH3012 @ 23 dBm WCDMA B19 CH738 @ 23 dBm LTE-A Module Series 415 700 590 680 630 660 660 610 620 mA mA mA mA mA mA mA mA mA NOTE 1. Power consumption test is carried out under 3.7 V, 25 C with 5G-M2 EVB, and with thermal dissipation measures. 2. For more details about current consumption, please contact Quectel Technical Support to obtain the power consumption test report of the modules. 6.4. Digital I/O Characteristics Table 48: (U)SIM 1.8 V I/O Requirements Parameter Description USIM_VDD Power supply Min. 1.65 Max. 1.95 Unit V VIH VIL VOH VOL Input high voltage 0.7 USIM_VDD USIM_VDD + 0.3 V Input low voltage

-0.3 0.2 USIM_VDD V Output high voltage 0.8 USIM_VDD USIM_VDD Output low voltage 0 0.4 V V EM060K_Series&EM120K-GL_Hardware_Design 75 / 92 LTE-A Module Series Table 49: (U)SIM 3.0 V I/O Requirements Parameter Description USIM_VDD Power supply Min. 2.7 Max. 3.05 Unit V VIH VIL VOH VOL High-level input voltage 0.7 USIM_VDD USIM_VDD + 0.3 V Low-level input voltage

-0.3 0.2 USIM_VDD V High-level output voltage 0.8 USIM_VDD USIM_VDD Low-level output voltage 0 0.4 V V Unit V V V V Unit V V V Table 50: 1.8 V Digital I/O Requirements Parameter Description Min. VIH VIL VOH VOL High-level input voltage 1.65 Low-level input voltage

-0.3 High-level output voltage 1.3 Low-level output voltage

Table 51: 3.3 V Digital I/O Requirements Parameter Description Min. 3.3 V Power Domain 3.135 VIH VIL Input high voltage Input low voltage 2.0

-0.5 6.5. ESD Protection Max. 2.1 0.54

0.4 Max. 3.464 3.6 0.8 Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. EM060K_Series&EM120K-GL_Hardware_Design 76 / 92 LTE-A Module Series Table 52: Electrostatic Discharge Characteristics (Temperature: 2530 C, Humidity: 40 5 %) Tested Interface Contact Discharge Air Discharge Unit VCC, GND Antenna Interfaces 5 4 Other Interfaces 0.5 10 8 1 kV kV kV 6.6. Operating and Storage Temperatures Table 53: Operating and Storage Temperatures Parameter Min. Operating Temperature Range 14

-25 Extended Temperature Range 15

-40 Storage temperature Range

-40 Typ.

+25

Max. Unit

+75

+85

+90 C C C 14 To meet this operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module meets 3GPP specifications. 15 To meet this extended temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module remains the ability to establish and maintain functions such as voice*, SMS, emergency call* etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may undergo a reduction in value, exceeding the specified tolerances of 3GPP. When the temperature returns to the normal operating temperature level, the module will meet 3GPP specifications again. EM060K_Series&EM120K-GL_Hardware_Design 77 / 92 6.7. Thermal Dissipation LTE-A Module Series Figure 30: Distribution of Heat Source Chips Inside the EM060K-GL&EM120K-GL Figure 31: Distribution of Heat Source Chips Inside the EM060K-NA The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:

Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. EM060K_Series&EM120K-GL_Hardware_Design 78 / 92 LTE-A Module Series Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Expose the copper in the PCB area where module is mounted. Apply a soft thermal pad with appropriate thickness and high thermal conductivity between the module and the PCB to conduct heat. Follow the principles below when the heatsink is necessary:

Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation. Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;

Choose the heatsink with adequate fins to dissipate heat;

Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;

Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. Figure 32: Placement and Fixing of the Heatsink Table 54: Maximum Operating Temperature for Main Chips (Unit: C) BASEBAND MCP PMU WTR MMPA 85 85 85 85 100 PA 85 APT 85 6.8. Notification Please follow the principles below in the module application. EM060K_Series&EM120K-GL_Hardware_Design 79 / 92 HeatsinkPCBTIMThermal padModuleScrewHeatsinkTIMModuleThermal padPCB LTE-A Module Series 6.8.1. Coating If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 6.8.2. Cleaning Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6.8.3. Installing It is recommended to fix the module firmly when the module is inserted into a socket. EM060K_Series&EM120K-GL_Hardware_Design 80 / 92 LTE-A Module Series 7 Mechanical Information and Packaging This chapter mainly describes mechanical dimensions and packaging specifications of EM060K series and EM120K-GL. All dimensions are measured in millimeter (mm), and the tolerances are 0.15 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 33: EM060K-GL&EM120K-GL Mechanical Dimensions EM060K_Series&EM120K-GL_Hardware_Design 81 / 92 LTE-A Module Series Figure 34: EM060K-NA Mechanical Dimensions 7.2. Top and Bottom Views Figure 35: EM060K-GL Top and Bottom Views EM060K_Series&EM120K-GL_Hardware_Design 82 / 92 LTE-A Module Series Figure 36: EM120K-GL Top and Bottom Views Figure 37: EM060K-NA Top and Bottom Views NOTE Images above are for illustration purpose only and may differ from the actual modules. For authentic appearance and label, please refer to the module received from Quectel. EM060K_Series&EM120K-GL_Hardware_Design 83 / 92 LTE-A Module Series 7.3. M.2 Connector EM060K series and EM120K-GL adopt a standard PCI Express M.2 connector which compiles with the directives and standards listed in PCI Express M.2 Specification. 7.4. Packaging Specification This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts blister tray packaging and details are as follow:

7.4.1. Blister Tray Dimension details are as follow:

EM060K_Series&EM120K-GL_Hardware_Design 84 / 92 LTE-A Module Series Figure 38: Blister Tray Dimension Drawing EM060K_Series&EM120K-GL_Hardware_Design 85 / 92 7.4.2. Packaging Process LTE-A Module Series Each blister tray packs 15 modules. Stack 10 Packing 11 blister trays together and then put blister trays with modules together, and put 1 blister trays into conductive bag, seal and empty blister tray on the top. pack the conductive bag. Put the seal-packed blister trays into the mini Put 4 packaged mini boxes into 1 carton box box. 1 mini box can pack 150 modules. and then seal it. 1 carton box can pack 600 modules. Figure 39: Packaging Process EM060K_Series&EM120K-GL_Hardware_Design 86 / 92 LTE-A Module Series 8 Appendix References Table 55: Related Documents Document Name

[1] Quectel_EM060K_Series&EM120K-GL_CA_Feature

[2] Quectel_5G-M2_EVB_User_Guide

[3] Quectel_EG06xK&Ex120K&EM060K_Series_AT_Commands_Manual

[4] Quectel_LTE-A(Q)_Series_GNSS_Application_Note Table 56: Terms and Abbreviations Abbreviation Description APT AT BB BDS BIOS bps BPSK CBRS CPE COEX Average Power Tracking ATtention Baseband BeiDou Navigation Satellite System Basic Input/Output System Bit(s) per second Binary Phase Shift Keying Citizen Broadband Radio Service Customer-Premise Equipment Coexistence DC-HSDPA Dual-carrier High Speed Downlink Package Access EM060K_Series&EM120K-GL_Hardware_Design 87 / 92 DFOTA Delta Firmware Upgrade Over-The-Air LTE-A Module Series DL DPR DRX DRx EBI EIRP ESD ESR FDD Downlink Dynamic Power Reduction Discontinuous Reception Diversity Receive External Bus Interface Equipment Isotropic Radiated Power Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplex GLONASS Global Navigation Satellite System (Russia) GNSS GPS GSM HSDPA HSPA HSUPA IC kbps LAA LDO LED Global Navigation Satellite System Global Positioning System Global System for Mobile Communications High Speed Downlink Packet Access High Speed Packet Access High Speed Uplink Packet Access Integrated Circuit Kilobits per second License Assisted Access Low-dropout Regulator Light Emitting Diode LPDDR2 Low Power Double Data Rate 2 LSB LTE Least Significant Bit Long Term Evolution EM060K_Series&EM120K-GL_Hardware_Design 88 / 92 LTE-A Module Series MBIM Mbps MCP ME MFBI MIPI MIMO MLCC MMPA MO MSB MT Mobile Broadband Interface Model Megabits per second Multiple Chip Package Mobile Equipment Multi-Frequency Band Indicator Mobile Industry Processor Interface Multiple-Input Multiple-Output Multi-layer Ceramic Capacitor Multimode Multiband Power Amplifier Mobile Originated Most Significant Bit Mobile Terminated NAND NON-AND NC NPN PA PAP PC PCB PCIe PCM PDU PME PMIC PMU Not Connected Negative-Positive-Negative Power Amplifier Password Authentication Protocol Personal Computer Printed Circuit Board Peripheral Component Interconnect Express Pulse Code Modulation Protocol Data Unit Power Management Event Power Management IC Power Management Unit EM060K_Series&EM120K-GL_Hardware_Design 89 / 92 LTE-A Module Series POS PPP PRx QLN QMI Point of Sale Point-to-Point Protocol Primary Receive Qualcomm Low-noise Amplifer Qualcomm MSM (Mobile Station Modems) Interface QPSK Quadrature Phase Shift Keying RB RF RFFE RH Rx SAR Resource Block Radio Frequency RF Front-End Relative Humility Receive Specific Absorption Rate SDRAM Synchronous Dynamic Random-Access Memory SMS SPMI TCP TDD TRx Tx Short Message Service System Power Management Interface Transmission Control Protocol Time Division Duplex Transmit & Receive Transmit UART Universal Asynchronous Receiver/Transmitter UDP UL URC USB User Datagram Protocol Uplink Unsolicited Result Code Universal Serial Bus

(U)SIM

(Universal) Subscriber Identity Module EM060K_Series&EM120K-GL_Hardware_Design 90 / 92 LTE-A Module Series VFB VIH VIL VOH VOL Voltage Feedback High-level Input Voltage Low-level Input Voltage High-level Output Voltage Low-level Output Voltage WCDMA Wideband Code Division Multiple Access WTR XO Wafer-scale RF transceiver Crystal Oscillator Product Marketing NameQuectel EM060K-NA FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-

based timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202307EM060KNA 4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

EM060K_Series&EM120K-GL_Hardware_Design 91 / 92 LTE-A Module Series radiation, maximum antenna gain

(including cable loss) must not exceed:

FCC Max Antenna GaindBi Operating Band LTE B2 LTE B4 LTE B5 LTE B7 LTE B12 LTE B13 LTE B14 LTE B17 LTE B25 LTE B26 (814-824) LTE B26 (824-849) LTE B30 LTE B41 LTE B423450-3550 LTE B423550-3600 LTE B433600-3700 LTE B48 LTE B66 LTE B71 8.00 5.00 9.41 8.00 8.70 9.16 9.23 8.74 8.00 9.36 9.41

-1.02 8.00 5.00

-2.00

-2.00

-2.00 5.00 8.48 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC EM060K_Series&EM120K-GL_Hardware_Design 92 / 92 LTE-A Module Series ID: XMR202307EM060KNA or Contains FCC ID: XMR202307EM060KNA must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device."

The transmitter module may not be co-located with any other transmitter or antenna. or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the EM060K_Series&EM120K-GL_Hardware_Design 93 / 92 LTE-A Module Series module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-023EM060KNA or where: 10224A-023EM060KNA is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A-023EM060KNA " ou "o: 10224A-023EM060KNA est le numro de certification du module". EM060K_Series&EM120K-GL_Hardware_Design 94 / 92

 

 

 

 

 

 

 

 

 

 

QeIee Fea. EMOGOK: NA at- ne EMO60KNAAA-M22-SGNDA FCC 1D: XMR202307EMO60KNA 1C::10224A-023EM060KNA SN:E1A17K137XXXXX1 IMEI: BE45050400XXXO label location

 

 

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Federal Communication Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA 2023/7/02 Attestation Statement according to 2.911(d)(5)(i) and 2.911(d)(5)(ii) FCC ID: XMR202307EM060KNA TO WHOM IT MAY CONCERN:

Hereby we certify that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Further we certify that, as of the date of the filing of the application, Quectel Wireless Solutions Co., Ltd. is not identified on the Covered List as an entity producing covered equipment. Sincerely, __

(signature & company stamp) _____________

< Quectel Wireless Solutions Co., Ltd.>

<FCC Registration Number 0018988279>

< Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233>

< Jean Hu >

<+8602150086326>

< jean.hu@quectel.com >

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RF_160, Issue 04 Quectel Wireless Solutions Co., Ltd. Declaration of Authorization We Name:

Address:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 City:

Country:

Shanghai China Declare that:

Name Representative of agent: Well Wei Agent Company name:

Address:

Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone City:

Country Suzhou China SGS-CSTC Standards Technical Services (Suzhou) Co., Ltd. South of No. 6 Plant, No. 1, Runsheng Road, Suzhou Industrial is authorized to apply for Certification of the following product(s):

Product description: LTE-A Cat 6 M.2 Module Type designation: EM060K-NA Trademark:

FCC ID: XMR202307EM060KNA Quectel on our behalf. Date:

City:

Name:

Email:

2023/07/02.. Shanghai .. Jean hu .. jean.hu@quectel.com. Signature:

 

 

CONFIDENTIALITY REQUEST for Certification Service in USA Federal Communication Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048

<2023-07-02>

TO WHOM IT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b) (4) of the Freedom of Information Act, we requests confidentiality for the following products:

FCC ID: XMR202307EM060KNA Model name: EM060K-NA For the product stated above, we request that the following information be held confidential;

Exhibits Long-Term Confidentiality Short-Term Confidentiality External Photos Internal Photos Block Diagram Schematics Test Setup Photos Users Manual Parts List Tune Up Operational Description The long-term confidentiality exhibits contain our trade secrets and proprietary information that could be of benefit to our competitors. The short-term confidentiality on the basis of ensuring that business sensitive information remains confidential until the actual marketing of our new device, which is planned for confidentiality for 180 days If you have any questions, please feel free to contact me at the address shown below. Sincerely, Name / Title: Jean Hu/Certification Manager Company: Quectel Wireless Solutions Company Limited Address: Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Phone: +8602150086326 Fax: +862153253668 E-Mail: jean.hu@quectel.com

 

 

RF_734_02 04 April 16 Quectel Wireless Solutions Co., Ltd. Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) FCC ID: XMR202307EM060KNA Items to be covered by Single modular transmitters. 1. The modular transmitter must have its own RF shielding. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. Answer from applicant Yes, please see exhibition external photos Yes, the modular has buffer modulation /data inputs 3. The modular transmitter must have its own power supply regulation. Yes, please see the SCH.pdf 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. there are very strict operational and 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. Yes, the requirements of antenna connector and spurious emission have been fulfilled. Please refer to the test report exhibition. Yes, please refer to the setup photo exhibition for the stand-alone configuration Yes, the module will be label with its own FCC ID, and the instruction on the labelling rule of the end product has been stated in the user manual of this module. Please refer to the label and user manual exhibition. Yes, the required FCC rule has been fulfilled and all the instruction for maintaining compliance have been clearly stated in the user manual. Yes, please refer exhibition RF exposure for the compliance of MPE RF exposure rule. Note: A limited modular approval (LMA) may be granted for single modular transmitters that comply partially with the requirements above. RF_734_02 04 April 16 Name and surname of applicant (or authorized representative):

Date:

City:

Name:

Email:

2023/07/02.. Shanghai .. Jean hu .. jean.hu@quectel.com. Signature: