EP06 Manual LTE-A Module Series Rev. EP06_Hardware_Design_V1.0 Date: 2018-06-14 www.quectel.com Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:
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http://quectel.com/support/technical.htm Or Email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2018. All rights reserved. 1 / 50 About the Document History Revision Date Author Description 1.0 2018-06-20 Nina Dou Initial 2 / 50 Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 1 Introduction .......................................................................................................................................... 5 Safety Information...................................................................................................................... 5 1.1. 2 Product Concept .................................................................................................................................. 7 2.1. General Description ................................................................................................................... 7 Description of Product Series .................................................................................................... 7 2.2. Key Features ............................................................................................................................. 8 2.3. 2.4. Functional Diagram ................................................................................................................. 10 Evaluation Board ..................................................................................................................... 11 2.5. 3.3. 3.4. 3.5. 3.6. 3.7. 3 Application Interface ......................................................................................................................... 12 3.1. General Description ................................................................................................................. 12 EP06 Interface ......................................................................................................................... 12 3.2. 3.2.1. Pin Assignment .............................................................................................................. 12 3.2.2. Definition of Interface ..................................................................................................... 13 Power Supply ........................................................................................................................... 16
(U)SIM Card Interfaces ............................................................................................................ 17 USB Interfaces ......................................................................................................................... 18 PCM and I2C Interfaces .......................................................................................................... 20 Control Signals ........................................................................................................................ 22 3.7.1. RESET_N Signal ............................................................................................................ 23 3.7.2. WWAN_LED_N Signal ................................................................................................... 23 Antenna Interfaces .................................................................................................................. 24 3.8.1. Main/Rx-diversity Antenna Interface .............................................................................. 24 3.8.1.1. Pin Definition of RF Antenna ............................................................................... 24 3.8.2. Operating Frequency ..................................................................................................... 25 3.8.3. GNSS Antenna Interface ................................................................................................ 26 3.8.4. Antenna Installation ........................................................................................................ 27 3.8.4.1. Antenna Requirement ......................................................................................... 27 3.8. 4 Electrical and Radio Characteristics ............................................................................................... 30 4.1. General Description ................................................................................................................. 30 Power Supply Requirements ................................................................................................... 30 4.2. 4.3. RF Characteristics ................................................................................................................... 30 4.4. GNSS Receiver ....................................................................................................................... 32 ESD Characteristics ................................................................................................................ 33 4.5. Current Consumption .............................................................................................................. 34 4.6. 4.7. Thermal Consideration ............................................................................................................ 39 5 Mechanical Dimensions .................................................................................................................... 41 3 / 50 5.1. General Description ................................................................................................................. 41 5.2. Mechanical Dimensions of EP06 module ................................................................................ 41 Standard Dimensions of Mini PCI Express ............................................................................. 42 5.3. 5.4. Design Effect Drawings of the Module .................................................................................... 43 6 Storage and Packaging ..................................................................................................................... 45 Storage .................................................................................................................................... 45 Packaging ................................................................................................................................ 45 6.1. 6.2. 7 Appendix References ........................................................................................................................ 46 8 IC & FCC Requirement ...................................................................................................................... 48 FCC Regulations: .................................................................................................................... 48 8.1. RF Exposure Information ......................................................................................................... 48 8.2. 8.3. ISED Notice ............................................................................................................................. 48 ISED Radiation Exposure Statement ...................................................................................... 49 8.4. IMPORTANT NOTE: ................................................................................................................ 49 8.5. 8.6. USERS MANUAL OF THE END PRODUCT: .......................................................................... 49 LABEL OF THE END PRODUCT: ........................................................................................... 50 8.7. 4 / 50 1 Introduction This document defines EP06 module, and describes its air interface and hardware interfaces which are connected with customers applications. This document can help customers to quickly understand the interface specifications, electrical and mechanical details, as well as other related information of EP06 module. To facilitate its application in different fields, reference design is also provided for customers reference. Associated with application note and user guide, customers can use the module to design and set up mobile applications easily. 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating EP06. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. You must comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden, so as to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device offers an Airplane Mode which must be enabled prior to boarding an aircraft. Switch off your wireless device when in hospitals, clinics or other health care facilities. These requests are designed to prevent possible interference with sensitive medical equipment. 5 / 50 Cellular terminals or mobiles operating over radio frequency signal and cellular network cannot be guaranteed to connect in all conditions, for example no mobile fee or with an invalid (U)SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Your cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres includefuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. Please do not discard. Maybe wireless devices have an impact on the environment so please do not arbitrarily discarded. 6 / 50 2 Product Concept 2.1. General Description EP06 is a series of LTE-A Cat 6 module which provides data connectivity on LTE FDD, LTE TDD and WCDMA networks with PCI Express Mini Card 1.2 standard interface. It supports embedded operating systems such as WinCE, Linux, Android, etc., and also provides audio, high-speed data transmission and GNSS functionalities for customers applications. EP06 module can be applied in the following fields:
Rugged Tablet PC and Laptop Computer Remote Monitor System Wireless Router and Switch Other Wireless Terminal Devices This chapter generally introduces the following aspects of EP06 module:
Product Series Key Features Functional Diagram 2.2. Description of Product Series The following table shows the product series of EP06 module. 7 / 50 Table 1: Description of EP06 Module Product Series Description Support LTE FDD: B2/B4/B5/B7/B12/B13/B25/B26/B29/B30/B66 Support 2CA: B2+B2/B5/B12/B13/B26/B291);
B4+B4/B5/B12/B13/B26/B291);
B7+B5/B7/B12/B13/B26/B291);
B25+B5/B12/B13/B25/B26/B291);
B30+B5/B12/B26/B291) B66+B5/B12/B13/B26/B291)/B66 Support WCDMA: B2/B4/B5 Support LTE/WCDMA receive diversity Support GNSS Support digital audio Support LTE FDD: B1/B3/B5/B7/B8/B20/B28/B322) Support LTE TDD: B38/B40/B41 Support 2CA: B1+B1/B5/B8/B20/B28;
B3+B3/B5/B7/B8/B20/B28;
B7+B5/B7/B8/B20/B28;
B20+B322) ;
B38+B38;
B40+B40;
B41+B41 Support WCDMA: B1/B3/B5/B8 Support LTE/WCDMA receive diversity Support GNSS Support digital audio EP06-A EP06-E NOTE B29 and B32 is only for secondary component carriers. 2.3. Key Features The following table describes the detailed features of EP06 module. 8 / 50 Table 2: Key Features of EP06 Feature Details Functional Interface PCI Express Mini Card 1.2 Standard Interface Power Supply Supply voltage: 3.1V~4.4V Typical supply voltage: 3.3V Transmitting Power Class 3 (23dBm2dB) for LTE-FDD bands Class 3 (23dBm2dB) for LTE-TDD bands Class 2 (24dBm+1/-3dB) for TD-SCDMA Class 3 (24dBm+1/-3dB) for UMTS Support up to CA Cat 6 Support 1.4 to 40MHz (2CA) RF bandwidth LTE Features Support MIMO in DL direction WCDMA Features FDD: Max 50Mbps (UL), 300Mbps (DL) TDD: Max 28Mbps (UL), 226Mbps (DL) Support 3GPP R10 DC-HSPA+
Support 16-QAM, 64-QAM and QPSK modulation 3GPP R6 Cat 6 HSUPA: Max 5.76Mbps (UL) 3GPP R8 Cat 24 DC-HSPA+: Max 42Mbps (DL) Support PPP/QMI/TCP*/UDP*/FTP*/HTTP*/NTP*/PING*/
HTTPS*/SMTP*/MMS*/FTPS*/SMTPS*/SSL*protocols Internet Protocol Features Support the protocols PAP (Password Authentication Protocol) and CHAP
(Challenge Handshake Authentication Protocol) usually used for PPP SMS connections Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default Support (U)SIM card: 1.8V, 3.0V
(U)SIM Interface Include USIM and USIM2 interfaces Support Dual SIM Signal Standy*
Support one digital audio interface: PCM interface Audio Feature*
WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Support 8-bit A-law, -law and 16-bit linear data formats PCM Interface*
Support long frame synchronization and short frame synchronization Support master and slave mode, but must be the master in long frame synchronization Compliant with USB 2.0 specification; the data transfer rate can reach up to USB 2.0&3.0 Interface 480Mbps Used for AT command communication, data transmission, firmware 9 / 50 upgrade, software debugging, GNSS NMEA output and voice over USB2.0*
Compliant with USB 3.0 specification The data transfer rate can reach up to 5.0Gbps. Used for AT command communication, data transmission, GNSS NMEA output and voice over USB 3.0*
USB Driver: Windows XP, Windows Vista, Windows 7, Windows 8/8.1, Windows 10, Linux 2.6 or later, Android 4.0/4.2/4.4/5.0/5.1/6.0 Antenna Interface Include main antenna, diversity antenna and GNSS antenna Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Physical Characteristics Temperature Range Gen8C Lite of Qualcomm Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Size: (51.00.1) (30.00.1) (4.30.2 mm) Weight: approx. 6g Operation temperature range: -35C ~ +75C 1) Extended temperature range: -40C ~ +85C 2) Storage temperature range: -40C ~ +90C Firmware Upgrade USB interface and DFOTA*
RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. 3.
*means under development. 1) Within operating temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction; there are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operating temperature levels, the module will meet 3GPP specifications again. 2.4. Functional Diagram The following figure shows the block diagram of EP06. 10 / 50 Figure 1: Functional Diagram 2.5. Evaluation Board In order to help customers develop applications with EP06, Quectel supplies an evaluation board (EVB), USB Type C cable, USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module. 11 / 50 BasebandNANDDDR2SDRAMANT_MAINANT_DIVANT_GNSSAPT19.2MXOControlIQControlTxPRxDRxMini PCI Express InterfaceVCCUSB 2.0&3.0W_DISABLE_NPCM&I2CUSIM&USIM2GPIOsWAKE_NBasebandRESET_NWAN_LED_NPowerPowerPowerPowerPowerPowerTx/Rx BlocksPowerPMICTransceiver 3 Application Interface 3.1. General Description The physical connections and signal levels of EP06 comply with PCI Express Mini CEM specifications. This chapter mainly describes definition and application of the following interface/signals/pins of EP06. Power supply
(U)SIM card interfaces USB interfaces PCM&I2C interfaces Control signals Antenna interface 3.2. EP06 Interface 3.2.1. Pin Assignment The following figure shows the pin assignment of EP06 module. The top side contains EP06 module and antenna connectors. 12 / 50 Figure 2: EP06 Pin Assignment 3.2.2. Definition of Interface The following tables show the pin definition and description of EP06 on the 52-pin application. Table 3: Definition of I/O Parameters Description Bidirectional Digital input Digital output Open collector Open Drain Power input Power output Type IO DI DO OC OD PI PO 13 / 50 Pin No.Pin Name13579111315171921232527293133353739414345474951Pin No.Pin Name246810121416182022242628303234363840444648505242WAKE_NANTCTL0/GPIO0ANTCTL1/GPIO1USIM2_RSTGNDTOPBOTVCCNCUSIM_VDDGNDUSIM_DATAVREF_1.8VUSIM_CLKUSIM2_VDDUSIM_RSTGNDNCUSIM2_CLKGNDUSIM2_DATAW_DISABLE_NGNDRESET_NUSB3.0_TX-VCCUSB3.0_TX+GNDGNDNCGNDI2C_CLKUSB3.0_RX-I2C_DATAUSB3.0_RX+GNDGNDUSB_D-GNDUSB_D+VCCGNDVCCWWAN_LED_NGNDANTCTL2/GPIO2PCM_CLKANTCTL3/GPIO3PCM_DOUTPCM_DINNCGNDPCM_SYNCVCCPIN 1PIN 51PIN 2PIN 52 Vmin=3.1V Vnorm=3.3V Vmax=4.4V 1.8V power domain Table 4: Description of Pins Pin No. Mini PCI Express EP06 Pin Standard Name Name I/O Description Comment 1 WAKE#
WAKE_N OC Output signal, used to wake up the host. 2 3.3Vaux VCC PI 3.3V DC supply COEX1 ANTCTL0/
GPIO0 External switch control for IO multiple antenna/
General purpose I/O GND GND Ground COEX2 ANTCTL1/
GPIO1 External switch control for IO multiple antenna/
General purpose I/O 1.8V power domain 1.5V NC Not connected CLKREQ#
USIM2_RST DO USIM2 reset 1.8V/3.0V UIM_PWR USIM_VDD PO USIM VCC supply 1.8V/3.0V GND GND Ground 3 4 5 6 7 8 9 10 UIM_DATA USIM_DATA IO USIM data 1.8V/3.0V 11 REFCLK-
VREF_1.8V DI 1.8V reference voltage output 12 UIM_CLK USIM_CLK DO USIM clock 1.8V/3.0V 13 REFCLK+
USIM2_VDD PO USIM2 VCC supply 1.8V/3.0V 14 UIM_RESET USIM_RST DO USIM reset 1.8V/3.0V 15 GND 16 UIM_VPP GND NC Ground Not connected 17 RESERVED USIM2_CLK DO USIM2 clock signal 1.8V/3.0V 18 GND GND Ground 19 RESERVED USIM2_DATA IO USIM2 data 20 W_DISABLE#
21 GND W_DISABLE_ N GND DI Disable wireless communications Ground 1.8V/3.0V 1.8V power domain 22 PERST#
RESET_N DI Functional reset to the module Active low 14 / 50 23 PERn0 USB3.0_TX-
DO USB 3.0 transmit data (-) 24 3.3Vaux VCC PI 3.3V DC supply 25 PERp0 USB3.0_TX+ DO USB 3.0 transmit data (+) 26 GND 27 GND 28 1.5V 29 GND GND GND NC GND Ground Ground Not connected Ground 30 SMB_CLK I2C_CLK OD I2C serial clock Vmin=3.1V Vnorm=3.3V Vmax=4.4V Require external pull-up to 1.8V. 31 PETn0 USB3.0_RX- DI USB 3.0 receive data (-) 32 SMB_DATA I2C_DATA OD I2C serial data Require external pull-up to 1.8V. 33 PETp0 USB3.0_RX+ DI USB 3.0 receive data (+) 34 GND 35 GND GND GND Ground Ground 36 USB_D-
USB_D-
IO USB differential data (-) 37 GND GND Ground 38 USB_D+
USB_D+
IO USB differential data (+) Vmin=3.1V Vnorm=3.3V Vmax=4.4V Vmin=3.1V Vnorm=3.3V Vmax=4.4V Active low 39 3.3Vaux VCC PI 3.3V DC supply 40 GND GND Ground 41 3.3Vaux VCC PI 3.3V DC supply 42 LED_WWAN#
43 GND 44 LED_WLAN#
WWAN_LED_ N GND ANTCTL2/
GPIO2 OC LED driver signal for indicating the state of the card. Ground External switch control for IO multiple antenna/
General purpose I/O 1.8V power domain 45 RESERVED PCM_CLK DO PCM clock signal 15 / 50 46 LED_WPAN#
ANTCTL3/
GPIO3 External switch control for IO multiple antenna/
General purpose I/O 1.8V power domain 47 RESERVED PCM_DOUT DO PCM data output 48 1.5V NC Not connected 49 RESERVED PCM_DIN DI PCM data input 50 GND GND Ground 51 RESERVED PCM_SYNC IO input in slave mode and output PCM frame synchronization in master mode 52 3.3Vaux VCC PI 3.3V DC supply Vmin=3.1V Vnorm=3.3V Vmax=4.4V NOTE Keep all NC and unused pins unconnected. 3.3. Power Supply The following table shows pin definition of VCC pins and ground pins. Table 5: Definition of VCC and GND Pins Pin No. Pin Name I/O Power Domain Description VCC PI 3.1~4.4V 3.3V DC supply 2, 24, 39, 41, 52 4, 9, 15, 18, 21, 26, 27, 29, 34, GND Ground 35, 37, 40, 43, 50 The typical supply voltage of EP06 is 3.3V. The power supply must be able to provide sufficient current up to 2A at least, and a bypass capacitor of no less than 470F with low ESR should be used to prevent the voltage from dropping. 16 / 50 The following figure shows a reference design of power supply. The precision of resistor R2 and R3 is 1%, and the capacitor C3 needs a low ESR. Figure 3: Reference Design of Power Supply 3.4. (U)SIM Card Interfaces The following table shows the pin definition of (U)SIM card interfaces. Table 6: (U)SIM Pin Definition Pin No. Pin Name I/O Power Domain Description USIM_VDD 8,13 USIM2_VDD USIM_DATA USIM2_DATA USIM_CLK USIM2_CLK USIM_RST USIM2_RST 10,19 12,17 14,7 PO 1.8V/3.0V Power source for the (USIM) card IO 1.8V/3.0V
(U)SIM data signal DO 1.8V/3.0V
(U)SIM clock signal DO 1.8V/3.0V
(U)SIM reset signal EP06 supports 1.8V and 3.0V (U)SIM cards. The following figure shows a reference design for a 6-pin
(U)SIM card connector. 17 / 50 LDO_INC1C2MIC29302WUU1INOUTENGNDADJ24135VCC100nFC3470uFC4100nFR282K 1%47K 1%R3470uF470R51KR4R1MCU_POWER_ON/OFF47K4.7KR5R6C5C633pF10pFTVSD1 Figure 4: Reference Circuit of (U)SIM Card Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers application, please follow the criteria below in (U)SIM circuit design:
Keep layout of (U)SIM card as close to the module as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signal away from RF and power supply traces. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential. The decouple capacitor of USIM_VDD should be less than 1uF and must near to (U)SIM card connector. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS whose parasitic capacitance should not be more than 50pF. The 22 ohm resistors should be added in series between the module and the (U)SIM card so as to suppress EMI spurious transmission and enhance ESD protection. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 3.5. USB Interfaces The following table shows the pin definition of USB 2.3&3.0 interfaces. 18 / 50 GNDUSIM_RSTUSIM_CLKUSIM_DATA22R22R22R100nF(U)SIM Card ConnectorGNDVCCRSTCLKIOVPPGND15KModuleUSIM_VDDUSIM_VDD Table 7: Pin Definition of USB 2.0&3.0 Interfaces Pin No. Pin Name I/O Power Domain Description Comment USB_D-
USB_D+
IO IO Compliant with USB 2.0 standard specification USB differential data (-) USB differential data (+) Require differential impedance of 90 USB3.0_TX-
DO USB 3.0 transmit data (-) USB3.0_TX+ DO USB3.0_RX- DI Compliant with USB 3.0 standard specification USB 3.0 transmit data (+) USB 3.0 receive data (-) Require differential impedance of 90 USB3.0_RX+ DI USB 3.0 receive data (+) 36 38 23 25 31 33 EP06 is compliant with USB 2.0 and USB 3.0 specifications. Meanwhile, The USB 2.0 interface supports high speed (480Mbps) mode and full speed (12Mbps) mode. It is used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB2.0*. The data rate of USB 3.0 interface is up to 5Gbps, and it is used for AT command communication, data transmission, GNSS NMEA output and voice over USB 3.0*. The following figure shows a reference circuit of USB 2.0&3.0 interfaces. Figure 5: Reference Circuit of USB2.0&3.0 Interfaces In order to ensure the integrity of USB 2.0&3.0 data line signal, R1, R2, C1 and C2 components must be placed close to the module, C3 and C4 components must be placed close to the MCU, and also these components should be placed close to each other. In order to ensure the USB 2.0&3.0 interface design corresponding with the USB 2.0&3.0 specifications, please comply with the following principles:
19 / 50 GNDUSB3.0_TX-USB3.0_TX+GNDESD ArrayUSB3.0_RX-USB3.0_RX+USB3.0_RX-USB3.0_RX+USB3.0_TX-USB3.0_TX+C3C4USB_DPUSB_DMR1R20R0RUSB_D-USB_D+C1C2ESD Array100nF100nF100nF100nFMouduleAP It is important to route the USB 2.0&3.0 signal traces as differential pairs with total grounding. 1) For USB 2.0 routing traces, the trace impedance of a differential pair should be 90, and the length matching of the differential pair should be less than 2mm. 2) For USB 3.0 routing traces, the trace impedance of Tx and Rx differential pairs should be 90, and the length matching of Tx and Rx differential pairs should be less than 0.7mm. Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. It is important to route the USB 2.0&3.0 differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. If USB connector is used, please keep the ESD protection components to the USB connector as close as possible. Pay attention to the influence of junction capacitance of ESD protection components on USB 2.0&3.0 data lines. The capacitance value of ESD protection components should be less than 2.0pF for USB 2.0, and less than 0.4pF for USB 3.0. If possible, reserve a 0R resistor on USB_D+ and USB_D- lines. NOTE S
* means under development. 3.6. PCM and I2C Interfaces The following table shows the pin definition of PCM and I2C interfaces that can be applied in audio codec design. Table 8: Pin Definition of PCM and I2C Interfaces Pin No. Pin Name I/O Power Domain Description Comment 45 47 49 51 30 PCM_CLK IO 1.8V PCM clock signal PCM_DOUT DO 1.8V PCM data output PCM_DIN DI 1.8V PCM data input PCM_SYNC IO 1.8V PCM frame synchronization I2C_SCL DO 1.8V I2C serial clock 32 I2C_SDA IO 1.8V I2C serial data Require external pull-up to 1.8V. Require external pull-up to 1.8V. 20 / 50 EP06 module provides one PCM digital interface*, which supports 8-bit A-law and -law, and also supports 16-bit linear data formats and the following modes:
Primary mode (short frame synchronization, works as either master or slave) Auxiliary mode (long frame synchronization, works as master only) NOTE
* means under development. In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, PCM_CLK supports 128, 256, 512, 1024 and 2048kHz for different speed codecs. The following figure shows the timing relationship in primary mode with 8kHz PCM_SYNC and 2048kHz PCM_CLK. Figure 6: Timing in Primary Mode In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge; while the PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a 128kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC only. The following figure shows the timing relationship in auxiliary mode with 8kHz PCM_SYNC and 128kHz PCM_CLK. 21 / 50 PCM_CLKPCM_SYNCPCM_DOUTMSBLSBMSB125us12256255PCM_DINMSBLSBMSB Figure 7: Timing in Auxiliary Mode Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization data format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. In addition, the modules firmware has integrated the configuration on some PCM codecs application with I2C interface. The following figure shows a reference design of PCM interface with an external codec IC. Figure 8: Reference Circuit of PCM Application with Audio Codec 3.7. Control Signals The following table shows the pin definition of control signals. 22 / 50 PCM_CLKPCM_SYNCPCM_DOUTMSBLSBPCM_DIN125usMSB121615LSBPCM_DINPCM_DOUTPCM_SYNCPCM_CLKI2C_SCLI2C_SDACodecModule1.8V2.2K2.2KBCLKFSDACINADCOUTSCLKSDINBIASMIC_BIASMIC+MIC-SPKOUT+SPKOUT-
Table 9: Pin Definition of Control Signals Pin No. Pin Name I/O Power Domain Description 1 WAKE_N*
OC Output signal, used to wake up the host. W_DISABLE_N* DI 1.8V Disable wireless communications Comment Active low. RESET_N DI 1.8V Functional reset to the Module Active low. WWAN_LED_N OC LED signal for indicating the state of the module. Active-low. 20 22 42 NOTE
* means under development. 3.7.1. RESET_N Signal The RESET_N signal can be used to force a hardware reset on the card. Customers can reset the module by driving the RESET_N to a low level voltage with the time frame of TBD1~TBD2ms and then releasing it. The reset scenario is illustrated in the following figure. Figure 9: Timing of Resetting Module 3.7.2. WWAN_LED_N Signal The WWAN_LED_N signal of EP06 module is used to indicate the network status of the module, which can absorb the current up to 40mA. According to the following circuit, in order to reduce the current of the LED, a resistor must be placed in series with the LED. The LED is emitting light when the WWAN_LED_N output signal is active low. 23 / 50 VIL0.5VVIH1.3VVCCTBD1ResettingModule StatusRunningRESET_NRestartTBD2 Figure 10: WWAN_LED_N Signal Reference Circuit Diagram The following table shows the network status indications of the WWAN_LED_N signal. Table 10: Indications of Network Status LED_WWAN_N Description Low Level (LED ON) Registered on network High Level (LED OFF) W_DISABLE_N signal is at low level. (Disable the RF) No network coverage or not registered AT+CFUN=0 or AT+CFUN=4 3.8. Antenna Interfaces EP06 includes a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The impedance of antenna port is 50. 3.8.1. Main/Rx-diversity Antenna Interface 3.8.1.1. Pin Definition of RF Antenna The pin definition of main antenna and Rx-diversity antenna interfaces are shown below. Table 11: Pin Definition of the RF Antenna Pin Name Pin No. I/O Description Comment ANT_MAIN ANT_DIV 107 127 IO AI Main antenna pad 50 impedance Receive diversity antenna pad 50 impedance 24 / 50 WWAN_LED_NVCCR 3.8.2. Operating Frequency Table 12: EP6-A Operating Frequencies 3GPP Band Transmit Receive WCDMA B2 1850~1910 1930~1990 WCDMA B4 1710~1755 2110~2155 WCDMA B5 824~849 869~894 LTE B2 LTE B4 LTE B5 LTE B7 LTE B12 LTE B13 LTE B25 LTE B26 1850~1910 1930~1990 1710~1755 2110~2155 824~849 869~894 2500~2570 2620~2690 699~716 777~787 729~746 746~756 1850~1915 1930~1995 814~849 LTE B29 1)
-
859~894 716~728 LTE B30 LTE B66 2305~2315 2350~2360 1710~1780 2110~2200 Table 13: EP6-E Operating Frequencies 3GPP Band Transmit Receive WCDMA B1 1920~1980 2110~2170 WCDMA B3 1710~1785 1805~1880 824~849 880~915 869~894 925~960 1920~1980 2110~2170 1710~1785 1805~1880 WCDMA B5 WCDMA B8 LTE B1 LTE B3 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz 25 / 50 LTE B5 LTE B7 LTE B8 LTE B20 LTE B28 824~849 869~894 2500~2570 2620~2690 880~915 832~862 703~748 925~960 791~821 758~803 LTE B32 1)
-
1452~1496 LTE B38 LTE B40 2570~2620 2570~2620 2300~2400 2300~2400 LTE B41 2545~2655 2545~2655 NOTES MHz MHz MHz MHz MHz MHz MHz MHz MHz 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. 2. ANT_DIV function is enabled by default. AT+QCFG="diversity",0 command can be used to disable receive diversity. 3. Place the -type matching components (R1/C1/C2 and R2/C3/C4) as close to the antenna as possible. 3.8.3. GNSS Antenna Interface The following tables show pin definition and frequency specification of GNSS antenna interface. Table 14: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 119 AI GNSS antenna pad 50 impedance 26 / 50 Table 15: GNSS Frequency Type Frequency GPS/Galileo/QZSS 1575.421.023 GLONASS 1597.5~1605.8 BeiDou NOTES 1561.0982.046 Unit MHz MHz MHz 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. If the module is designed with a passive antenna, then the VDD circuit is not needed. 3.8.4. Antenna Installation 3.8.4.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 16: Antenna Requirements Type Requirements GNSS1) WCDMA/LTE Frequency range: 1561MHz ~ 1615MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain: < 17dB VSWR: 2 Efficiency: > 30%
Max Input Power: 50W Input Impedance: 50 Cable insertion loss: < 1dB
(WCDMA B5/B6/B8/B19, LTE B5/B8/B12/B13/B18/B19/B20/B26/B28/B29/) Cable insertion loss: < 1.5dB
(WCDMA B1/B2/B3/B4/B9, LTE B1/B2/B3/B4/B21/B25/B66) Cable insertion loss < 2dB 27 / 50
(LTE B7/B38/B40/B41/B30) NOTE 1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. The following figure shows the overall sizes of RF connector. Figure 11: Dimensions of the RF Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the RF connector. 28 / 50 Figure 12: Mechanicals of U.FL-LP Connectors 29 / 50 4 Electrical and Radio Characteristics 4.1. General Description This chapter mainly describes the following electrical and radio characteristics of EP06:
Power supply requirements RF characteristics GNSS receiver Current consumption ESD characteristics 4.2. Power Supply Requirements The input voltage of EP06 is 3.3V9%, as specified by PCI Express Mini CEM Specifications 1.2. And the power supply of EP06 should be able to provide sufficient current up to 2A at least. The following table shows the power supply requirements of EP06. Table 17: EP06 Power Supply Requirements Parameter Description Min. Typ. Max. Unit VCC Power Supply 3.1 3.3 4.4 V 4.3. RF Characteristics The following table shows the RF output power of EP06 module. 30 / 50 Table 18: RF Output Power Frequency Max. WCDMA bands 24dBm+1/-3dB LTE FDD bands 23dBm2dB LTE TDD bands 23dBm2dB Min.
<-50dBm
<-40dBm
<-40dBm The following tables show conducted RF receiving sensitivity of EP06 series module. Table 19: EP06-A Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2
-108.5dBm WCDMA B4
-108.0dBm WCDMA B5
-109.5dBm LTE-FDD B2 (10M)
-97.7dBm LTE-FDD B4 (10M)
-97.2dBm LTE-FDD B5 (10M)
-97.7dBm LTE-FDD B7 (10M)
-96.2dBm LTE-FDD B12 (10M)
-97.2dBm LTE-FDD B13 (10M)
-97.7dBm LTE-FDD B25 (10M)
-98.0dBm LTE-TDD B26 (10M)
-98.4dBm LTE-TDD B30 (10M)
-96.7dBm LTE-TDD B66 (10M)
-97.6dBm
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
-106.7dBm
-103.7dBm
-104.7dBm
-100.7dBm
-94.3dBm
-100.2dBm
-96.3dBm
-102.2dBm
-94.3dBm
-98.7dBm
-94.3dBm
-101.7dBm
-93.3dBm
-100.7dBm
-93.3dBm
-100.9dBm
-92.8dBm
-102.1dBm
-93.8dBm
-99.6dBm
-95.3dBm
-100.7dBm
-95.8dBm The following tables show conducted RF receiving sensitivity of EP06 series module. Table 20: EP06-E Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B1
-109.5dBm
/
/
-106.7dBm 31 / 50 WCDMA B3
-108.5dBm WCDMA B5
-109.0dBm WCDMA B8
-110.0dBm LTE-FDD B1 (10M)
-98.0dBm LTE-FDD B3 (10M)
-97.0dBm LTE-FDD B5 (10M)
-97.0dBm LTE-FDD B7 (10M)
-95.2dBm LTE-FDD B8 (10M)
-98.7dBm LTE-FDD B20 (10M)
-96.0dBm LTE-FDD B28 (10M)
-97.4dBm LTE-TDD B38 (10M)
-96.7dBm LTE-TDD B40 (10M)
-96.7dBm LTE-TDD B41 (10M)
-96.7dBm NOTE
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
-103.7dBm
-104.7dBm
-103.7dBm
-100.0dBm
-96.3dBm
-100.0dBm
-93.3dBm
-100.0dBm
-94.3dBm
-98.5dBm
-94.3dBm
-101.0dBm
-93.3dBm
-102.0dBm
-93.3dBm
-101.0dBm
-94.8dBm
-98.4dBm
-96.3dBm
-100.0dBm
-96.3dBm
-98.6dBm
-94.3dBm 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve Rx performance. 4.4. GNSS Receiver The following table shows GNSS performance of EP06. Table 21: GNSS Performance Parameter Description Conditions Sensitivity
(GNSS) Cold start Autonomous Reacquisition Autonomous Tracking Autonomous TTFF Cold start Autonomous Typ. TBD TBD TBD TBD Unit dBm dBm dBm s 32 / 50
(GNSS)
@open sky Warm start
@open sky Hot start
@open sky CEP-50 Accuracy
(GNSS) NOTES XTRA enabled Autonomous XTRA enabled Autonomous XTRA enabled Autonomous
@open sky TBD TBD TBD TBD TBD TBD s s s s s m 1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes position within 3 minutes after executing cold start command. 4.5. ESD Characteristics The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the module electrostatic discharge characteristics. Table 22: Electrostatic Discharge Characteristics Tested Points Contact Discharge Air Discharge Unit VBAT, GND Antenna Interfaces 5 4 Other Interfaces 0.5 10 8 1 kV kV kV 33 / 50 4.6. Current Consumption The following table shows the current consumption of the EP06-A. Table 23: EP06-A Current Consumption Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) WCDMA PF=256 (USB disconnected) WCDMA PF=512 (USB disconnected) LTE-FDD PF=32 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) 1.88 2.4 2.29 2.29 2.28 3.5 3.47 LTE-FDD PF=128 (USB disconnected) 3.5 LTE-FDD PF=256 (USB disconnected) LTE-TDD PF=32 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) LTE-TDD PF=256 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) 3.49 3.67 3.6 3.2 3.54 21.2 31.3 22.7 31.1 23.9 31.2 Idle state WCDMA data WCDMA B2 HSDPA CH9400 @23.5dBm 673.7 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 34 / 50 transfer
(GNSS OFF) WCDMA B2 HSUPA CH9400 @23.1dBm 658.8 WCDMA B4 HSDPA CH1412 @23.4dBm 614.7 WCDMA B4 HSUPA CH1412 @23.3dBm 655.2 WCDMA B5 HSDPA CH4407 @23.4dBm 514.2 WCDMA B5 HSUPA CH4407 @23.3dBm 532.9 LTE data transfer
(GNSS OFF) 2CA data transfer LTE-FDD B2 CH900 @23.6dBm LTE-FDD B4 CH 2175 @23.4dBm LTE-FDD B5 CH2525 @23.4dBm LTE-FDD B7 CH3100@22.4dBm LTE-FDD B12 CH5095@23.3dBm LTE-FDD B13 CH5230@23.2dBm LTE-FDD B25 CH8365@23.4dBm LTE-FDD B26 CH8865@23.1dBm LTE-FDD B30 CH9820@22.7dBm LTE-FDD B66 CH132322@22.3dBm LTE-TDD B41 CH40740@23.9dBm LTE-FDD B1+B1 @21.05dBm LTE-FDD B1+B5 @21.07dBm LTE-FDD B1+B8 @21.91dBm LTE-FDD B1+B20 @20.91dBm LTE-FDD B1+B28 @21.09dBm LTE-FDD B3+B5 @21.18dBm LTE-FDD B3+B7 @21.1dBm LTE-FDD B3+B8 @21.2dBm LTE-FDD B3+B20 @21.16dBm 735.4 725.4 644.2 916.8 550.0 651.6 718.4 679.2 757.7 704.6 430 TBD TBD TBD TBD TBD TBD TBD TBD TBD mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 35 / 50 LTE-FDD B3+B28 @21.12dBm LTE-FDD B7+B5 @21.29dBm LTE-FDD B7+B7 @21.33dBm LTE-FDD B7+B8 @21.3dBm LTE-FDD B7+B20 @21.32dBm LTE-FDD B7+B28 @21.33dBm LTE-FDD B5+B32 @20.91dBm LTE-FDD B8+B32 @20.88dBm LTE-FDD B20+B32 @20.88dBm LTE-FDD B28+B32 @21.1dBm LTE-TDD B38+B38 @21.3dBm LTE-TDD B40+B40 @20.99dBm LTE-TDD B41+B41 @21.25dBm WCDMA B2 CH9400@23.5dBm WCDMA B4 CH1412 @23.1dBm WCDMA B5 CH4407 @23.1dBm TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 658.8 655.2 532.9 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA voice call The following table shows the current consumption of the EP06-E. Table 24: EP06-E Current Consumption Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) WCDMA PF=256 (USB disconnected) WCDMA PF=512 (USB disconnected) 1.69 2.65 2.69 2.41 2.66 mA mA mA mA mA 36 / 50 LTE-FDD PF=32 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=256 (USB disconnected) LTE-TDD PF=32 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) LTE-TDD PF=256 (USB disconnected) WCDMA PF=64 (USB disconnected) 3.06 3.26 2.58 2.26 3.1 3.3 2.63 2.29 24 mA mA mA mA mA mA mA mA mA WCDMA PF=64 (USB connected) 32.12 mA Idle state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) 19.2 28.5 21.3 28.6 mA mA mA mA WCDMA B1 HSDPA CH10700 @23dBm 577.05 mA WCDMA B1 HSUPA CH10700 @23.3dBm 557.63 mA WCDMA B3 HSDPA CH 1338 @22.5dBm 807.04 mA WCDMA data transfer
(GNSS OFF) WCDMA B3 HSUPA CH 1338 @23.1dBm 776.52 mA WCDMA B5 HSDPA CH4408 @22.5dBm 572.22 mA WCDMA B5 HSUPA CH4408 @21.8dBm 566.37 mA WCDMA B8 HSDPA CH3012 @22.6dBm 657.85 mA WCDMA B8 HSUPA CH3012 @22.1dBm 643.46 mA LTE-FDD B1 CH300 @23.9dBm 651.3 mA LTE data transfer
(GNSS OFF) LTE-FDD B3 CH1575 @24.1dBm 898.8 mA LTE-FDD B5 CH2525 @23.4dBm 597.5 mA LTE-FDD B7 CH3100@23.4dBm 980.0 mA LTE-FDD B8 CH3625@23.5dBm 667.2 mA 37 / 50 LTE-FDD B20 CH6300@23.5dBm 765.1 mA LTE-FDD B28 CH9510@21.4dBm 810.0 mA LTE-FDD B66 CH132322@22.3dBm 396.1 mA LTE-TDD B38 CH38000@24.0dBm 407.0 mA LTE-TDD B40 CH39150@23.8dBm 370.2 mA LTE-TDD B41 CH40740@24.3dBm 396.1 mA 2CA data transfer LTE-FDD B1+B1 @21.05dBm LTE-FDD B1+B5 @21.07dBm LTE-FDD B1+B8 @21.91dBm LTE-FDD B1+B20 @20.91dBm LTE-FDD B1+B28 @21.09dBm LTE-FDD B3+B5 @21.18dBm LTE-FDD B3+B7 @21.1dBm LTE-FDD B3+B8 @21.2dBm LTE-FDD B3+B20 @21.16dBm LTE-FDD B3+B28 @21.12dBm LTE-FDD B7+B5 @21.29dBm LTE-FDD B7+B7 @21.33dBm LTE-FDD B7+B8 @21.3dBm LTE-FDD B7+B20 @21.32dBm LTE-FDD B7+B28 @21.33dBm LTE-FDD B5+B32 @20.91dBm LTE-FDD B8+B32 @20.88dBm LTE-FDD B20+B32 @20.88dBm LTE-FDD B28+B32 @21.1dBm LTE-TDD B38+B38 @21.3dBm LTE-TDD B40+B40 @20.99dBm TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 38 / 50 LTE-TDD B41+B41 @21.25dBm TBD mA WCDMA B1 CH10700 @23.75dBm 596.7 mA WCDMA voice call WCDMA B3 CH1122 @22.6dBm 576.63 mA WCDMA B5 CH4408 @ 22.22dBm 557.01 mA WCDMA B8 CH3012 @22.98dBm 638.67 mA 4.7. Thermal Consideration EP06 is designed to work over an extended temperature range. In order to achieve a maximum performance, it is strongly recommended to comply with the following principles for thermal consideration. On customers PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc. According to customers application demands, the heatsink can be mounted on the top of the module, or the thermal pad can be filled between the module and the application board and the corresponding area on the application board need as much GND copper as possible, or both of them. The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB. The following shows the heatsink and thermal pad designs for reference and customers can choose one or both of them according to their application structure. Figure 13: Referenced Heatsink Design (Heatsink at the Top of the Module) 39 / 50 HeatsinkEP06 ModuleApplication BoardThermal PadShielding CoverMiniPCIe ConnectorApplication BoardHeatsinkHeatsinkEP06 ModulePCBA Figure 14: Referenced Thermal Pad Design NOTES 1. Make sure that customers PCB design provides sufficient cooling for the module: proper mounting, heatsinks, and active cooling may be required depending on the integrated application. 2. The modules internal temperature must be kept below 105C to protect the components from damage when it is integrated to customers applications. And the temperature can be queried by AT+QTEMP command. 40 / 50 EP06 ModuleApplication BoardThermal PadShielding CoverMiniPCIe ConnectorApplication BoardEP06 ModulePCBAThermal Pad 5 Mechanical Dimensions 5.1. General Description This chapter mainly describes mechanical dimensions as well as packaging specification of EP06 module. 5.2. Mechanical Dimensions of EP06 module Figure 15: Mechanical Dimensions of EP06module (Unit: mm) 41 / 50 5.3. Standard Dimensions of Mini PCI Express The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1]
for detailed A and B. Figure 16: Standard Dimensions of Mini PCI Express (Unit: mm) EP06 Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives and standards listed in the document [1]. The following figure takes the Molex 679100002 as an example. 42 / 50 Figure 17: Dimensions of the Mini PCI Express Connector (Molex 679100002, Unit: mm) 5.4. Design Effect Drawings of the Module Figure 18: Top View of the Module 43 / 50 Figure 19: Bottom View of the Module NOTE These are design effect drawings of EP06 module. For more accurate pictures, please refer to the module that you get from Quectel. 44 / 50 6 Storage and Packaging 6.1. Storage The module is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in the vacuum-sealed bag: 12 months at < 40C/90%RH. 2. After the vacuum-sealed bag is opened, devices must stored at <10% RH. NOTE As the plastic container cannot be subjected to high temperature, it should be removed from devices before high temperature (120C) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033 for baking procedure. 6.2. Packaging The EP06 Mini PCIe is packaged in a tray. Each tray contains 10pcs of modules. The smallest package of EP06 Mini PCIe contains 100pcs 45 / 50 7 Appendix References Table 25: Related Documents SN Document Name Remark PCI Express Mini Card Electromechanical Specification Revision 1.2 Mini PCI Express Specification
[1]
Table 26: Terms and Abbreviations Abbreviation Description AMR bps CS Adaptive Multi-rate Bits Per Second Coding Scheme DC-HSPA+
Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air DL EFR ESD FDD FR GLONASS GMSK GNSS GPS Down Link Enhanced Full Rate Electrostatic Discharge Frequency Division Duplexing Full Rate GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System 46 / 50 GSM HR kbps LED LTE-A Mbps ME MIMO MMS MO MT PCM PDU PPP RF Rx Global System for Mobile Communications Half Rate Kilo Bits Per Second Light Emitting Diode Long Term Evolution-Advanced Million Bits Per Second Mobile Equipment (Module) Multiple-Input Multiple-Output Multimedia Messaging Service Mobile Originated Mobile Terminated Pulse Code Modulation Protocol Data Unit Point-to-Point Protocol Radio Frequency Receive USIM
(Universal) Subscriber Identification Module SIMO SMS UART UL URC Single Input Multiple Output Short Message Service Universal Asynchronous Receiver & Transmitter Up Link Unsolicited Result Code WCDMA Wideband Code Division Multiple Access 47 / 50 8 IC & FCC Requirement 8.1. FCC Regulations:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. This device has been tested and found to comply with the limits for a Class B digital device , pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiated radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help. Caution: Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. 8.2. RF Exposure Information This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. 8.3. ISED Notice This device complies with Innovation, Science and Economic Development Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device. 48 / 50 Le prsent appareil est conforme aux CNR Innovation, Sciences et Dveloppement conomique Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numrique de la classe B est conforme la norme NMB-003 du Canada. 8.4. ISED Radiation Exposure Statement This device complies with RSS-102 radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the ISED radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. Cet appareil est conforme aux limites d'exposition aux rayonnements de la CNR-102 dfinies pour un environnement non contrl. Afin d'viter la possibilit de dpasser les limites d'exposition aux frquences radio de la CNR-102, la proximit humaine l'antenne ne doit pas tre infrieure 20 cm
(8 pouces) pendant le fonctionnement normal. 8.5. IMPORTANT NOTE:
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled environment can be satisfied. Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. 8.6. USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to 49 / 50 the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. 8.7. LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains Transmitter Module FCC ID: XMR201807EP06A. If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host device; otherwise, the host device must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the words Contains transmitter module IC: 10224A-201807EP06A. 50 / 50