FCC ID: XMR2023EM061KGL2 LTE-A Module

EM061K-GL Hardware Design LTE-A Module Series Version: 1.0.0 Date: 2023-02-24 Status: Preliminary LTE-A Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-

exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. EM061K-GL_Hardware_Design 1 / 75 LTE-A Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

(third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-

party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. EM061K-GL_Hardware_Design 2 / 75 LTE-A Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. EM061K-GL_Hardware_Design 3 / 75 LTE-A Module Series About the Document Revision History Version Date Author Description

2023-02-24 1.0.0 2023-02-24 Fung ZHU/

Eysen WANG Fung ZHU/

Eysen WANG Creation of the document Preliminary EM061K-GL_Hardware_Design 4 / 75 LTE-A Module Series Contents Safety Information ...................................................................................................................................... 3 About the Document .................................................................................................................................. 4 Table Index .................................................................................................................................................. 7 Figure Index ................................................................................................................................................ 9 1 Introduction ....................................................................................................................................... 10 1.1. Reference Standards ............................................................................................................... 13 1.2. Special Marks ........................................................................................................................... 13 2 Product Overview ............................................................................................................................. 15 2.1. Frequency Bands and Functions ............................................................................................. 15 2.2. Key Features ............................................................................................................................ 16 2.3. Functional Diagram .................................................................................................................. 18 2.4. Pin Assignment ........................................................................................................................ 19 2.5. Pin Description ......................................................................................................................... 20 2.6. EVB Kit ..................................................................................................................................... 25 3 Operating Characteristics ................................................................................................................ 26 3.1. Operating Modes ...................................................................................................................... 26 3.2. Sleep Mode .............................................................................................................................. 27 3.3. Airplane Mode .......................................................................................................................... 28 3.4. Communication Interface with Host ......................................................................................... 28 3.5. Power Supply ........................................................................................................................... 28 3.5.1. Power Supply Pins ........................................................................................................ 28 3.5.2. Reference Design for Power Supply ............................................................................. 28 3.5.3. Voltage Stability Requirements ..................................................................................... 29 3.5.4. Power Supply Voltage Monitoring ................................................................................. 30 3.6. Turn On .................................................................................................................................... 30 3.7. Turn Off .................................................................................................................................... 32 3.8. Reset ........................................................................................................................................ 32 4.1. 4 Application Interfaces ...................................................................................................................... 34

(U)SIM Interfaces ..................................................................................................................... 34 4.1.1. Pin definition of (U)SIM ................................................................................................. 34

(U)SIM Hot-Swap .......................................................................................................... 35 4.1.2. 4.1.3. Normally Closed (U)SIM Card Connector..................................................................... 36 4.1.4. Normally Open (U)SIM Card Connector ....................................................................... 36

(U)SIM Card Connector Without Hot-swap................................................................... 37 4.1.5.

(U)SIM2 Card Compatible Design ................................................................................ 38 4.1.6.

(U)SIM Design Notices.................................................................................................. 38 4.1.7. 4.2. USB Interface ........................................................................................................................... 39 4.3. PCM Interface* ......................................................................................................................... 40 4.4. Control and Indication Interfaces ............................................................................................. 42 4.4.1. W_DISABLE1# .............................................................................................................. 42 EM061K-GL_Hardware_Design 5 / 75 LTE-A Module Series 4.4.2. W_DISABLE2# .............................................................................................................. 43 4.4.3. WWAN_LED#................................................................................................................ 44 4.4.4. WAKE_ON_WAN# ........................................................................................................ 44 4.4.5. DPR ............................................................................................................................... 45 4.4.6. WLAN_PA_EN .............................................................................................................. 45 4.5. Antenna Tuner Control Interface* ............................................................................................ 46 Antenna Tuner Control Interface through GPIOs .............................................. 46 Antenna Tuner Control Interface through RFFE ................................................ 46 4.6. Configuration Pins .................................................................................................................... 47 4.5.1.1. 4.5.1.2. 5 Antenna Interfaces ............................................................................................................................ 48 5.1. Cellular Network ....................................................................................................................... 48 5.1.1. Antenna Interfaces & Frequency Bands ....................................................................... 48 5.1.2. Tx Power ....................................................................................................................... 50 5.1.3. Rx Sensitivity ................................................................................................................. 51 5.2. GNSS ....................................................................................................................................... 53 5.2.1. Antenna Interface & Frequency Bands ......................................................................... 53 5.2.2. GNSS Performance ...................................................................................................... 53 5.3. Antenna Design Requirements ................................................................................................ 54 5.4. Antenna Connectors ................................................................................................................ 55 5.4.1. Antenna Connector Location ........................................................................................ 55 5.4.2. Antenna Connector Specifications ................................................................................ 55 5.4.3. Antenna Connector Installation ..................................................................................... 56 6 Electrical Characteristics and Reliability ....................................................................................... 58 6.1. Absolute Maximum Ratings ..................................................................................................... 58 6.2. Power Supply Ratings .............................................................................................................. 58 6.3. Power consumption ................................................................................................................. 59 6.4. Digital I/O Characteristics ........................................................................................................ 62 6.5. ESD Protection ......................................................................................................................... 63 6.6. Operating and Storage Temperatures ..................................................................................... 64 6.7. Thermal Dissipation ................................................................................................................. 64 6.8. Notification ............................................................................................................................... 65 6.8.1. Coating .......................................................................................................................... 66 6.8.2. Cleaning ........................................................................................................................ 66 Installing ........................................................................................................................ 66 6.8.3. 7 Mechanical Information and Packaging ......................................................................................... 67 7.1. Mechanical Dimensions ........................................................................................................... 67 7.2. Top and Bottom Views ............................................................................................................. 68 7.3. M.2 Connector .......................................................................................................................... 68 7.4. Packaging ................................................................................................................................ 68 7.4.1. Blister Tray .................................................................................................................... 68 7.4.2. Packaging Process ....................................................................................................... 69 8 Appendix References ....................................................................................................................... 71 EM061K-GL_Hardware_Design 6 / 75 LTE-A Module Series Table Index Table 1: Special Marks ............................................................................................................................... 13 Table 2: Frequency Bands and GNSS Functions of EM061K-GL ............................................................. 15 Table 3: Key Features ................................................................................................................................ 16 Table 4: Definition of I/O Parameters ......................................................................................................... 20 Table 5: Pin Description ............................................................................................................................. 20 Table 6: Overview of Operating Modes ..................................................................................................... 26 Table 7: Definition of VCC and GND Pins ................................................................................................. 28 Table 8: Pin Definition of FULL_CARD_POWER_OFF# ........................................................................... 30 Table 9: Turn-on Timing of the Module ...................................................................................................... 31 Table 10: Turn-off Timing of the Module .................................................................................................... 32 Table 11: Pin Definition of RESET# ........................................................................................................... 32 Table 12: Reset Timing of the Module ....................................................................................................... 33 Table 13: Pin Definition of (U)SIM Interfaces ............................................................................................ 34 Table 14: Pin Definition of USB Interface .................................................................................................. 39 Table 15: Pin Definition of PCM Interface .................................................................................................. 41 Table 16: Pin Definition of Control and Indication Interfaces..................................................................... 42 Table 17: RF Function Status .................................................................................................................... 42 Table 18: GNSS Function Status ............................................................................................................... 43 Table 19: Network Status Indications of WWAN_LED# ............................................................................ 44 Table 20: State of the WAKE_ON_WAN# ................................................................................................. 44 Table 21: Pin definition of DPR .................................................................................................................. 45 Table 22: Function of the DPR Signal ........................................................................................................ 45 Table 23: Pin definition of WLAN_PA_EN ................................................................................................. 46 Table 29: Pin Definition of Antenna Tuner Control Interface through GPIOs ............................................ 46 Table 30: Pin Definition of Antenna Tuner Control Interface through RFFE ............................................. 46 Table 25: List of Configuration Pins ........................................................................................................... 47 Table 26: Pin Definition of Configuration Pins ........................................................................................... 47 Table 27: Antenna Connectors Definition .................................................................................................. 48 Table 28: Frequency Bands ....................................................................................................................... 48 Table 31: EM061K-GL Conducted RF Output Power ................................................................................ 50 Table 32: EM061K-GL Rx Sensitivity ......................................................................................................... 51 Table 34: GNSS Frequency ....................................................................................................................... 53 Table 35: GNSS Performance ................................................................................................................... 53 Table 36: Antenna Requirements .............................................................................................................. 54 Table 37: Major Specifications of the RF Connectors ............................................................................... 56 Table 38: Absolute Maximum Ratings ....................................................................................................... 58 Table 39: Power Supply Requirements ..................................................................................................... 58 Table 40: Averaged Power Consumption .................................................................................................. 59 Table 41: (U)SIM Low-voltage I/O Requirements ...................................................................................... 62 Table 45: (U)SIM High-voltage I/O Requirements ..................................................................................... 62 Table 46: 1.8 V Digital I/O Requirements .................................................................................................. 62 EM061K-GL_Hardware_Design 7 / 75 LTE-A Module Series Table 47: 3.3 V Digital I/O Requirements .................................................................................................. 63 Table 45: Electrostatic Discharge Characteristics (Temperature: 2530 C, Humidity: 40 5 %) ............ 63 Table 46: Operating and Storage Temperatures ....................................................................................... 64 Table 47: Maximum Operating Temperature for Main Chips (Unit: C) .................................................... 65 Table 48: Related Documents .................................................................................................................... 71 Table 49: Terms and Abbreviations ........................................................................................................... 71 EM061K-GL_Hardware_Design 8 / 75 LTE-A Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 18 Figure 2: Pin Assignment ........................................................................................................................... 19 Figure 3: DRX Run Time and Power Consumption in Sleep Mode ........................................................... 27 Figure 4: Sleep Mode Application with USB Remote Wakeup Function ................................................... 27 Figure 5: Reference Circuit for Power Supply ........................................................................................... 29 Figure 6: Power Supply Limits During Burst Transmission ....................................................................... 29 Figure 7: Reference Circuit for VCC Pins .................................................................................................. 30 Figure 8: Turn on the Module Using Host GPIO ........................................................................................ 31 Figure 9: Turn-on Timing of the Module ..................................................................................................... 31 Figure 10: Turn-off Timing of the Module .................................................................................................. 32 Figure 11: Reference Circuit for RESET# with Open Collector Driving Circuit ......................................... 33 Figure 12: Reset Timing of the Module ...................................................................................................... 33 Figure 13: Reference Circuit for Normally Closed (U)SIM Card Connector .............................................. 36 Figure 14: Reference Circuit for Normally Open (U)SIM Card Connector ................................................ 37 Figure 15: Reference Circuit for 6-Pin (U)SIM Card Connector ................................................................ 37 Figure 16: Recommended Compatible Design for (U)SIM2 Interface ....................................................... 38 Figure 17: Reference Circuit for USB Interface ......................................................................................... 39 Figure 18: Primary Mode Timing ................................................................................................................ 41 Figure 19: Auxiliary Mode Timing .............................................................................................................. 41 Figure 20: Reference Circuit of W_DISABLE1# and W_DISABLE2# ....................................................... 43 Figure 21: WWAN_LED# Reference Circuit .............................................................................................. 44 Figure 22: Reference Circuit of WAKE_ON_WAN# .................................................................................. 45 Figure 23: Recommended Circuit of Configuration Pins ........................................................................... 47 Figure 24: Antenna Connectors on EM061K-GL ....................................................................................... 55 Figure 25: Dimensions of the Receptacle (Unit: mm) ................................................................................ 55 Figure 26: Dimensions of Mated Plugs (0.81/1.13 mm Coaxial Cables) (Unit: mm) ........................... 56 Figure 27: Space Factor of Mated Connectors (0.81 mm Coaxial Cables) (Unit: mm) .......................... 57 Figure 28: Space Factor of Mated Connectors ( 1.13 mm Coaxial Cables) (Unit: mm) ......................... 57 Figure 29: Distribution of Heat Source Chips Inside the Module ............................................................... 64 Figure 30: Placement and Fixing of the Heatsink ...................................................................................... 65 Figure 31: Module Top and Side Dimensions ............................................................................................ 67 Figure 32: Top and Bottom Views of the Module ....................................................................................... 68 Figure 33: Blister Tray Dimension Drawing ............................................................................................... 69 Figure 34: Packaging Process ................................................................................................................... 70 EM061K-GL_Hardware_Design 9 / 75 LTE-A Module Series 1 Introduction The hardware design defines the air and hardware interfaces of EM061K-GL which connect to your applications. This document can help you quickly understand the interface specifications, electrical and mechanical details as well as other related information of EM061K-GL. Besides, reference designs will be offered to exemplify diverse applications of the modules. With this hardware design coupled with application notes and user guides, you can use the modules to design and set up mobile applications easily. CE Statement Regulatory Conformance Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [EM061K-GL] is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address:

http://www.quectel.com/support/technical.htm The device could be used with a separation distance of 20cm to the human body. UK Statement Regulations 2017 (SI 2017/1206) Declaration of Conformity Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that [EM061K-GL] is in compliance with the essential requirements and other relevant provisions of the UK Radio Equipment Regulations 2017 (SI 2017/1206). Product Marketing NameQUECTEL EM061K-GL FCC Certification Requirements According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-

based timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion EM061K-GL_Hardware_Design 10 / 75 LTE-A Module Series Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2023EM061KGL, XMR2023EM061KGL2, XMR2023EM061KGL3 4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

radiation, maximum antenna gain

(including cable loss) must not exceed:

FCC Max Antenna GaindBi IC Max Antenna GaindBi Operating Band WCDMA B2 WCDMA B4 WCDMA B5 LTE B2 LTE B4 LTE B5 LTE B7 LTE B12 LTE B13 LTE B14 LTE B17 LTE B25 LTE B26(814-824) LTE B26(824-849) LTE B30 LTE B38 LTE B41 LTE B66 LTE B71 8.00 5.00 9.43 8.50 5.50 9.91 9.00 9.20 9.66 9.73 9.24 8.50 9.86 9.91 0.98 9.00 9.00 5.50 8.98 6.22 5.00 6.13 8.50 5.50 6.62 9.00 6.14 6.46 6.50 6.16 8.50 NA 6.62 0.98 9.00 9.00 5.50 5.99 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining EM061K-GL_Hardware_Design 11 / 75 LTE-A Module Series to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: XMR2023EM061KGL/XMR2023EM061KGL2/XMR2023EM061KGL3 or Contains FCC ID:

XMR2023EM061KGL/XMR2023EM061KGL2/XMR2023EM061KGL3 must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device."

The transmitter module may not be co-located with any other transmitter or antenna. or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF EM061K-GL_Hardware_Design 12 / 75 LTE-A Module Series L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-23EM061KGL or where: 10224A-23EM061KGL is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A-23EM061KGL " ou "o: 10224A-23EM061KGL est le numro de certification du module". 1.1. Reference Standards The module complies with the following standards:

ISO/IEC 7816-3 PCI Express M.2 Specification Revision 4.0, Version 1.1 Universal Serial Bus Specification, Revision 4.0 MIPI Alliance Specification for RF Front-End Control Interface Version 2.0 3GPP TS 27.007 and 3GPP 27.005 3GPP TS 34.121-1 and 3GPP TS 36.521-1 1.2. Special Marks Table 1: Special Marks Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT EM061K-GL_Hardware_Design 13 / 75 LTE-A Module Series command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of the model is currently unavailable.

Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA [0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. EM061K-GL_Hardware_Design 14 / 75 LTE-A Module Series 2 Product Overview 2.1. Frequency Bands and Functions EM061K-GL are LTE-A/UMTS/HSPA+ wireless communication modules with diversity receiver. They provide data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks. They are standard WWAN M.2 Key-B modules. For more details, see PCI Express M.2 Specification Revision 4.0, Version 1.1. They support embedded operating systems such as Windows, Linux and Android, and also provide GNSS and voice functionality 1 to meet specific application demands. The following table shows the frequency bands and GNSS functions of the module. For details about CA combinations, you can see document [1]. Table 2: Frequency Bands and GNSS Functions of EM061K-GL Mode Frequency Band LTE-FDD (with Rx-diversity) B1/B2/B3/B4/B5/B7/B8/B12/B13/B14/B17 2/B18/B19/B20/B25/B26

/B28/B29 3/B30/B32 3/B66/B71 LTE-TDD (with Rx-diversity) B34/B38/B39/B40/B41 WCDMA (with Rx-diversity) B1/B2/B3/B4/B5/B6/B8/B19 GNSS GPS/GLONASS/BDS/Galileo The module can be applied to a wide range of applications such as industrial routers, home gateways, set-

top boxes, industrial laptops, consumer laptops, industrial PDAs, rugged tablet PCs and digital signage, etc. 1 The module contains DataVoice* and Data-only version. DataVoice* version supports voice and data functions, while Data-only version only supports data function. 2 B17 is supported through MFBI + B12. 3 LTE-FDD B29/B32 and support Rx only and are only for secondary component carrier. EM061K-GL_Hardware_Design 15 / 75 LTE-A Module Series 2.2. Key Features Table 3: Key Features Feature Details Function Interface PCI Express M.2 Interface Power Supply Supply voltage: 3.1354.4 V Typical supply voltage: 3.7 V

(U)SIM Interface Compliant with ISO/IEC 7816-3 and ETSI and IMT-2000 Supports (U)SIM card: 1.8/3.0 V Supports Dual SIM Single Standby eSIM Optional eSIM function Compliant with USB 2.0 specifications, with maximum transmission rates up to 480 Mbps. Used for AT command communication, data transmission, firmware upgrade (USB 2.0 only), software debugging, GNSS NMEA sentence output, and voice over USB*. Supports USB serial drivers:

- Windows 7/8/8.1/10/11

- Linux 2.65.18

- Android 4.x12.x Used for audio function through external codecs Supports 16-bit linear data format Supports long and short frame synchronization Supports master and slave modes, but must be the master in long frame USB Interface PCM Interface*

synchronization Rx-diversity LTE/WCDMA Antenna Interfaces Main antenna connector and RX-diversity/GNSS antenna connector 50 impedance Transmitting Power LTE Features WCDMA: Class 3 (23 dBm 2 dB) LTE B7/B38/B40/B41: Class 3 (23 dBm 1 dB) LTE B30: Class 3 (22 dBm 1 dB) Other bands: Class 3 (23.5 dBm 1 dB) Supports 3GPP Rel-12 LTE-FDD and LTE-TDD Supports CA category: up to UL CA Cat 6/DL CA Cat 6 Supports modulations:

- UL: QPSK and 16QAM modulations

- DL: QPSK, 16QAM and 64QAM modulations Supports 1.4/3/5/10/15/20 MHz RF bandwidths EM061K-GL_Hardware_Design 16 / 75 LTE-A Module Series Max. transmission data rates:

LTE-FDD: 300 Mbps (DL)/50 Mbps (UL) LTE-TDD: 226 Mbps (DL)/28 Mbps (UL) Supports 3GPP Rel-9 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Supports DL BPSK, QPSK, 16QAM and 64QAM modulations Supports UL BPSK, QPSK DC-HSDPA: Max. 42 Mbps (DL) HSUPA: Max. 5.76 Mbps (UL) WCDMA: Max. 384 kbps (DL)/384 kbps (UL) UMTS Features GNSS Features AT Commands Supports GPS, GLONASS, BDS and Galileo Data update rate: 1 Hz by default Compliant with 3GPP TS 27.007 and 3GPP TS 27.005 Quectel enhanced AT commands Internet Protocol Features QMI/MBIM/NITZ/HTTP/HTTPS/FTP/LwM2M*/PING*

Supports PAP and CHAP for PPP connections Firmware Upgrade Via USB 2.0 or DFOTA SMS Physical Characteristics Point-to-point MO and MT Text and PDU modes SMS cell broadcast SMS storage: ME by default Windows OS SMS push feature M.2 Key-B Size: 30.0 mm 42.0 mm 2.3 mm Weight: approx. 6.2 g Temperature Range Operating temperature range: -25 to +75 C 4 Extended temperature range: -40 to +85 C 5 Storage temperature range: -40 to +90 C RoHS All hardware components are fully compliant with EU RoHS directive 4 To meet this operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within the temperature range of -10 C to +55 Cthe mentioned RF performance margins higher than 3GPP specifications can be guaranteed. When temperature goes beyond temperature range of -10 C to 55 C, a few RF performances of module may be slightly off 3GPP specifications. 5 To meet this extended temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module remains the ability to establish and maintain functions such as voice*, SMS, emergency call*, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may undergo a reduction in value, exceeding the specified tolerances of 3GPP. When the temperature returns to the normal operating temperature level, the module will meet 3GPP specifications again. EM061K-GL_Hardware_Design 17 / 75 LTE-A Module Series 2.3. Functional Diagram The following figure shows a functional diagram of EM061K-GL. Power management Baseband LPDDR2 SDRAM+NAND flash Radio frequency M.2 Key-B interface Figure 1: Functional Diagram EM061K-GL_Hardware_Design 18 / 75 LTE-A Module Series 2.4. Pin Assignment The following figure shows the pin assignment of the module. It is recommended to keep RESERVED pins unconnected. Please contact Quectel for more details if required. Figure 2: Pin Assignment EM061K-GL_Hardware_Design 19 / 75 PIN2PIN74BOTPIN1PIN75TOPPin NameNo.CONFIG_275GND73GND71CONFIG_169RESET#67ANTCTL365ANTCTL263ANTCTL161ANTCTL059GND57RESERVED55RESERVED53GND51RESERVED49RESERVED47GND45RESERVED43RESERVED41GND39RESERVED37RESERVED35GND33RESERVED31RESERVED29GND27DPR25WAKE_ON_WAN#23CONFIG_021NotchNotchNotchNotchGND11USB_DM9USB_DP7GND5GND3CONFIG_31PIN11PIN10No.Pin Name74VCC72VCC70VCC68NC66USIM1_DET64RESERVED62RESERVED60WLAN_PA_EN58RFFE_DATA56RFFE_CLK54RESERVED52RESERVED50RESERVED48USIM2_VDD46USIM2_RST44USIM2_CLK42USIM2_DATA40USIM2_DET38NC36USIM1_VDD34USIM1_DATA32USIM1_CLK30USIM1_RST28PCM_SYNC26W_DISABLE2#24PCM_DOUT22PCM_DIN20PCM_CLKNotchNotchNotchNotch10WWAN_LED#8W_DISABLE1#6FULL_CARD_POWER_OFF#4VCC2VCC LTE-A Module Series 2.5. Pin Description Table 4: Definition of I/O Parameters Type AI AO AIO DI DO DIO OD PI PO PU PD Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Pull Up Pull Down DC characteristics include power domain and rate current, etc. Table 5: Pin Description Pin No. 1 2 3 4 Pin Name I/O Description DC Characteristic Comment CONFIG_3 DO Not connected internally VCC GND VCC PI PI Power supply for the module Ground Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V Power supply for the module Vmin = 3.135 V Vnom = 3.7 V EM061K-GL_Hardware_Design 20 / 75 LTE-A Module Series Vmax = 4.4 V GND Ground FULL_CARD_ POWER_OFF#

DI, PD Turn on/off the module High level: turn on Low level: turn off VIHmax = 4.4 V VIHmin = 1.19 V VILmax = 0.2 V Internally pulled down with a 100 k resistor. USB_DP AIO USB differential data (+) W_DISABLE1#

DI, PU Airplane mode control Active low VIHmin = 1.8 V VILmax = 0.4 V VILmin = -0.4 V USB_DM AIO USB differential data (-) WWAN_LED#

OD RF status indication LED Active low VCC Test point must be reserved. Test point must be reserved. GND Notch Notch Notch Notch Notch Notch Notch Notch Ground Notch Notch Notch Notch Notch Notch Notch Notch 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 PCM_CLK*

DIO, PD PCM clock 21 CONFIG_0 DO Connected to GND internally 22 PCM_DIN*

DI, PD PCM data input 23 WAKE_ON_ WAN#*

OD Wake up the host Active low VIHmin = 1.8 V VILmax = 0.4 V VOHmin = 1.8 V VOLmax = 0.4 V VIHmin = 3.3 V VILmax = 0.4 V High-Voltage:

Vmin = 3.5 V Vnom = 3.3 V Vmax = 3.0 V Externally pull up to 1.8 V or 3.3 V. EM061K-GL_Hardware_Design 21 / 75 24 PCM_DOUT*

DO, PD PCM data output LTE-A Module Series Low-Voltage:

Vmin = 1.95 V Vnom = 1.8 V Vmax = 1.65 V VOHmin = 1.8 V VOLmax = 0.4 V 25 DPR DI, PU Dynamic power reduction Active low VIHmin = 1.8 V VILmax = 0.4 V High level by default. VIHmin = 1.8 V VILmax = 0.4 V VILmin = -0.4 V VIHmin = 1.8 V VILmax = 0.4 V VOHmin = 1.8 V VOLmax = 0.4 V 26 W_DISABLE2#*

DI, PU GNSS control Active low 27 GND Ground 28 PCM_SYNC*

29 30 31 32 33 34 35 RESERVED USIM1_RST RESERVED USIM1_CLK GND USIM1_DATA RESERVED DIO, PD DO, PD DO, PD DIO, PD PCM data frame sync

(U)SIM1 card reset USIM1_VDD

(U)SIM1 card clock USIM1_VDD Ground

(U)SIM1 card data USIM1_VDD High-Voltage:

Vmin = 3.05 V Vnom = 2.85 V Vmax = 2.7 V Low-Voltage:

Vmin = 1.95 V Vnom = 1.8 V Vmax = 1.65 V 36 USIM1_VDD PO

(U)SIM1 card power supply 37 38 39 RESERVED NC GND Not connected Ground EM061K-GL_Hardware_Design 22 / 75 USIM2_DET 6 DI, PD

(U)SIM2 card hot-swap detect VIHmin = 1.8 V VILmax = 0.4 V Internally pulled up to 1.8 V. LTE-A Module Series RESERVED USIM2_DATA RESERVED USIM2_CLK GND USIM2_RST RESERVED AO DIO, PD DO, PD DO, PD

(U)SIM2 card data USIM2_VDD

(U)SIM2 card clock USIM2_VDD Ground

(U)SIM2 card reset USIM2_VDD 40 41 42 43 44 45 46 47 48 USIM2_VDD PO

(U)SIM2 card power supply High-Voltage:

Vmin = 3.05 V Vnom = 2.85 V Vmax = 2.7 V Low-Voltage:

Vmin = 1.95 V Vnom = 1.8 V Vmax = 1.65 V 49 50 51 52 53 54 55 56 57 58 RESERVED RESERVED GND Ground RESERVED RESERVED RESERVED RESERVED RFFE_CLK* 7 DO, PD Used for external MIPI IC control VOHmin = 1.8 V VOLmax = 0.4 V GND Ground RFFE_DATA* 7 DIO, PD Used for external MIPI IC control VIHmin = 1.8 V VILmax = 0.4 V 6 This pin is pulled low by default, and will be internally pulled up to 1.8 V by software configuration only when (U)SIM hot-swap is enabled by AT+QSIMDET. For more details, see document [3]. 7 If RFFE_CLK and RFFE_DATA are required, please contact Quectel for more details. EM061K-GL_Hardware_Design 23 / 75 LTE-A Module Series 59 ANTCTL0*

DO, PD Antenna GPIO control VOHmin = 1.8 V VOLmax = 0.4 V VOHmin = 1.8 V VOLmax = 0.4 V 60 WLAN_PA_EN*

DI, PD 61 62 63 64 65 ANTCTL1*

RESERVED ANTCTL2*

RESERVED ANTCTL3*

DO, PD DO, PD DO, PD Self-protection of QLN control VIHmin = 1.8 V VILmax = 0.4 V Antenna GPIO control VOHmin = 1.8 V VOLmax = 0.4 V Antenna GPIO control VOHmin = 1.8 V VOLmax = 0.4 V Antenna GPIO control VOHmin = 1.8 V VOLmax = 0.4 V 66 USIM1_DET 6 DI, PD

(U)SIM1 card hot-swap detect VIHmin = 1.8 V VILmax = 0.4 V Internally pulled up to 1.8 V. VIHmax = 2.1 V VIHmin = 1.3 V VILmax = 0.5 V Internally pulled up to 1.8 V with a 10 k resistor. Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V 67 RESET#

DI, PU 68 69 NC CONFIG_1 DO 70 VCC PI Reset the module Active low Not connected Connected to GND internally Power supply for the module 71 GND Ground 72 VCC PI Power supply for the module 73 GND Ground 74 VCC PI Power supply for the module 75 CONFIG_2 DO Not connected internally NOTE Keep all NC and unused pins unconnected. EM061K-GL_Hardware_Design 24 / 75 LTE-A Module Series 2.6. EVB Kit To help you develop applications conveniently with EM061K-GL, Quectel supplies an evaluation board

(5G-M2 EVB). For more details, see document [2]. EM061K-GL_Hardware_Design 25 / 75 LTE-A Module Series 3 Operating Characteristics 3.1. Operating Modes The table below summarizes different operating modes of the module. Table 6: Overview of Operating Modes Details Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Voice*/Data Network is connected. In this mode, the power consumption is decided by network setting and data transfer rate. AT+CFUN=0 sets the module to a minimum functionality mode without removing the power supply. In this mode, both RF function and (U)SIM card are invalid. AT+CFUN=4 or driving W_DISABLE1# pin low will set the module to airplane mode. In this mode, the RF function is invalid. The module keeps receiving paging messages, SMS, voice call* and TCP/UDP data from the network with its power consumption reduced to the minimal level. In this mode, the power management unit shuts down the power supply. Software is inactive, while all interfaces are inaccessible and the operating voltage (connected to VCC) remains applied. Mode Full Functionality Mode Minimum Functionality Mode Airplane Mode Sleep Mode Power Down Mode NOTE For more details about the AT command, see document [3]. EM061K-GL_Hardware_Design 26 / 75 LTE-A Module Series 3.2. Sleep Mode In sleep mode, DRX (Discontinuous Reception) of the module is able to reduce the power consumption to a minimum level, and DRX cycle index values are broadcasted by the wireless network. The figure below shows the relationship between the DRX run time and the power consumption in sleep mode. The longer the DRX cycle is, the lower the power consumption will be. Figure 3: DRX Run Time and Power Consumption in Sleep Mode The following part of this chapter describes the power saving procedure and sleep mode entrance of the module. If the host supports USB suspend/resume and remote wakeup function, the following two conditions must be met simultaneously to bring the module into sleep mode. Execute AT+QSCLK=1. The hosts USB bus, which is connected to the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application with USB Remote Wakeup Function The module will wake up when the host sends data to the module through USB interface. EM061K-GL_Hardware_Design 27 / 75 Power ConsumptionRun TimeDRX OFF ON OFF ON OFF ON OFF ON OFF USB InterfaceUSB InterfaceModuleHostGNDGND LTE-A Module Series 3.3. Airplane Mode Execution of AT+CFUN=4 or driving W_DISABLE1# pin low will set the module to airplane mode. For more details, see Chapter 4.4.1. 3.4. Communication Interface with Host The module supports communication with the host through USB interface. USB 2.0 should be reserved for firmware upgrade. See the USB mode features as below:

USB Mode:

Supports all USB 2.0 features. Supports MBIM/QMI/QRTR/AT. 3.5. Power Supply 3.5.1. Power Supply Pins Table 7: Definition of VCC and GND Pins Pin No. Pin Name I/O Description Comment 2, 4, 70, 72, 74 VCC PI Power supply for the module Vmin = 3.135 V Vnom = 3.7 V Vmax = 4.4 V 3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73 GND Ground 3.5.2. Reference Design for Power Supply The performance of the module largely depends on the power supply design. The continuous current of the power supply should be 3 A at least and the peak current should be 4 A at least. In case of a slight difference between input and output voltages, use an LDO when supplying power to the module. In case of a large difference between input and desired output (typically 3.7 V) voltages, using a buck DC-DC converter is preferred. The following figure shows a reference design for +5 V input power supply based on DC-DC converter. EM061K-GL_Hardware_Design 28 / 75 The typical output of the power supply is about 3.7 V. LTE-A Module Series Figure 5: Reference Circuit for Power Supply NOTE To avoid corrupting the data in the internal flash, do not cut off the power supply before the module is completely turned off, and do not cut off power supply directly when the module is working. 3.5.3. Voltage Stability Requirements The power supply of the module ranges from 3.135 V to 4.4 V. Please ensure that the input voltage never drops below 3.135 V, otherwise the module will be powered off automatically. The following figure shows the maximum voltage drop during burst transmission in 3G/4G networks. Figure 6: Power Supply Limits During Burst Transmission To decrease the voltage drop, two bypass capacitors of about 220 F with low ESR (ESR = 0.7 ) should be used. To avoid disturbing the power supply, two multi-layer ceramic chip capacitor (MLCC) arrays also should be used due to their ultra-low ESR. It is recommended to use eight ceramic capacitors (1 F, 100 nF, 33 pF, 10 pF) to compose the MLCC arrays, and to place these capacitors close to VCC pins. The width of VCC trace should be not less than 2.5 mm. In principle, the longer the VCC trace is, the wider it should be. EM061K-GL_Hardware_Design 29 / 75 D1TVSPWR_INC8220 FC1110 pFC1033 pFC9100 nF+R1205KU1Q1NPNR847KR74.7KPWR_ENR4182KPWR_OUTL11.5 HVINVINVINENVSNSCOMPRT/CLKSSPHPHPHBOOTPWRGDGNDGNDAGNDVFBR5383K 1 %R6100K 1 %C6100 nFPWRGDEPR280.6KC710 nFR310KC410 nFC5NMVFBC2100 nFC333 pFC1470 F+VCC (V)Burst TransmissionVoltage Ripple< 100 mVVoltage Drop Burst Transmission3.135 VLoad (A) In addition, to guarantee the stability of the power supply, please use a TVS component with a reverse TVS voltage of 5.1 V and a dissipation power higher than 0.5 W. The following figure shows a reference circuit of the VCC. LTE-A Module Series Figure 7: Reference Circuit for VCC Pins 3.5.4. Power Supply Voltage Monitoring You can use AT+CBC to monitor the voltage value of VCC. For more details, see document [3]. 3.6. Turn On FULL_CARD_POWER_OFF# serves to turn on/off the module. This input signal is 3.3 V tolerant and can be driven by either 1.8 V or 3.3 V GPIO. Also, it has been internally pulled down with a 100 k resistor. When FULL_CARD_POWER_OFF# is de-asserted (driven high, 1.19 V), the module will be turned on. Table 8: Pin Definition of FULL_CARD_POWER_OFF#

Pin No. Pin Name I/O Description Comment 6 FULL_CARD_ POWER_OFF#

DI, PD Turn on/off the module High level: turn on Low level: turn off Internally pulled down with a 100 k resistor It is recommended to use a host GPIO to control FULL_CARD_POWER_OFF#. A simple reference circuit is illustrated in the following figure. EM061K-GL_Hardware_Design 30 / 75 ModuleAPT2, 4C2220 F3, 5, 11VCC (3.3 V Typ.)VCCGNDC1010 pFC833 pFC6100 nFC41 F+C1220 FD15.1 VVCCGNDC910 pFC733 pFC5100 nFC31 F+27, 33, 39, 45, 51, 57, 71, 7370, 72, 74PMU LTE-A Module Series Figure 8: Turn on the Module Using Host GPIO The turn-on timing is illustrated in the following figure. Figure 9: Turn-on Timing of the Module Table 9: Turn-on Timing of the Module Symbol Min. Typ. Max. Comment T1 T2 30 ms

TBD

The turn-on time of the module. The system booting time of the module. EM061K-GL_Hardware_Design 31 / 75 HostModuleFULL_CARD_POWER_OFF#PMUGPIO61.8 V or 3.3 VNOTE: The voltage of pin 6 should be not less than 1.19 V when it is at high level.R1100KGSDVIL 0.2 V1.19 V VIH 4.4 VVCCFULL_CARD_POWER_OFF#RESET#BootingActiveModule StateT1T2OFF LTE-A Module Series 3.7. Turn Off If the module is turned off using a host GPIO, when VCC is supplied with power, pulling down FULL_CARD_POWER_OFF# pin ( 0.2 V) will turn off the module normally. The turn-off timing is illustrated in the following figure. Figure 10: Turn-off Timing of the Module Table 10: Turn-off Timing of the Module Symbol Min. T1 TBD Typ.

Max. Comment

The turn-off time of the module 3.8. Reset The RESET# pin serves to reset the module. Triggering the RESET# signal will lead to loss of all data from the modem and removal of system drivers. It will also lead to disconnection of the modem from the network. Table 11: Pin Definition of RESET#

Pin No. Pin Name I/O Description Comment 67 RESET#

DI, PU Reset the module Active LOW Internally pulled up to 1.8 V with a 10 k resistor. The module can be reset by pulling down the RESET# pin for 250600 ms. An open collector (OC)/drain driver or a button can be used to control the RESET# pin. EM061K-GL_Hardware_Design 32 / 75 VCCModule StatusFULL_CARD_POWER_OFF#Turn-off procedureActiveOFFT1NOTE: As shown by the dotted line, it is suggested to disconnect VCC after the module shuts down. LTE-A Module Series Figure 11: Reference Circuit for RESET# with Open Collector Driving Circuit The reset timing is illustrated in the following figure. Figure 12: Reset Timing of the Module Table 12: Reset Timing of the Module Symbol Min. Typ. Max. Comment T 250 ms 400 ms 500 ms RESET# should be pulled down for 250500 ms. Asserting time of less than 250 ms is unreliable and asserting time higher than 500 ms will cause repeated reset. EM061K-GL_Hardware_Design 33 / 75 HostModuleRESET#PMICGPIO671.8 VReset pulse250600 msR110KR3100KR41KQ1R2 1KVCCRESET#ResettingActiveRestartingT LTE-A Module Series 4 Application Interfaces The physical connections and signal levels of the module comply with the PCI Express M.2 specification. This chapter mainly describes the definition and application of the following interfaces/pins of the module:

(U)SIM interfaces USB interface PCM interface*

Control and indication interfaces Antenna Tuner Control Interface*

Configuration pins 4.1. (U)SIM Interfaces The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements and ISO/IEC 7816-3. Both Class B (3.0 V) and Class C (1.8 V) (U)SIM cards are supported, and dual SIM single standby function is supported. 4.1.1. Pin definition of (U)SIM Table 13: Pin Definition of (U)SIM Interfaces Pin No. Pin Name I/O Description Comments 36 34 32 30 66 40 42 USIM1_VDD PO

(U)SIM1 card power supply USIM1_DATA DIO, PD

(U)SIM1 card data USIM1_CLK DO, PD

(U)SIM1 card clock USIM1_RST DO, PD

(U)SIM1 card reset USIM1_DET DI, PD

(U)SIM1 card hot-swap detect USIM2_DET DI, PD

(U)SIM2 card hot-swap detect USIM2_DATA DIO, PD

(U)SIM2 card data Internally pulled up to 1.8 V. Internally pulled up to 1.8 V. EM061K-GL_Hardware_Design 34 / 75 LTE-A Module Series 44 46 48 USIM2_CLK DO, PD

(U)SIM2 card clock USIM2_RST DO, PD

(U)SIM2 card reset USIM2_VDD PO

(U)SIM2 card power supply 4.1.2.

(U)SIM Hot-Swap The module supports (U)SIM card hot-swap via (U)SIM card hot-swap detect pins USIM1_DET and USIM2_DET. (U)SIM card insertion can be detected by high/low level. (U)SIM card hot-swap function is disabled by default. The following command configures (U)SIM card hot-swap detection. AT+QSIMDET Configure (U)SIM Card Hot-swap Detection Test Command AT+QSIMDET=?

Read Command AT+QSIMDET?

Response

+QSIMDET:

supported <insert_level>s)

(list of supported <enable>s),(list of OK Response

+QSIMDET: <enable>,<insert_level>

Write Command AT+QSIMDET=<enable>,<insert_level>

Response OK OK Maximum Response Time 300 ms If there is any error:

ERROR Characteristics Parameter The command takes effect after the module is rebooted. The configuration will be saved automatically.

<enable>

Integer type. Enable or disable (U)SIM card detection.

<insert_level>

0 Disable 1 Enable Integer type. The level of (U)SIM detection pin when a (U)SIM card is inserted. 0 Low level 1 High level EM061K-GL_Hardware_Design 35 / 75 LTE-A Module Series NOTE 1. Hot-swap function is invalid if the configured value of <insert_level> is inconsistent with hardware design. 2. The underlined value represents the default configuration. 3. USIM1_DET and USIM2_DET are pulled low by default, and will be internally pulled up to 1.8 V by software configuration only when (U)SIM hot-swap is enabled by AT+QSIMDET. For more details, see document [3]. 4.1.3. Normally Closed (U)SIM Card Connector With a normally closed (U)SIM card connector, USIM_DET pin is normally shorted to ground when there is no (U)SIM card inserted. (U)SIM card detection by high level is applicable to this type of connector. Once (U)SIM hot-swap is enabled by executing AT+QSIMDET=1,1, insertion of a (U)SIM card will drive USIM_DET from low to high level, and the removal of it will drive USIM_DET from high to low level. When the (U)SIM is absent, CD is shorted to ground and USIM_DET is at low level. When the (U)SIM is present, CD is open from ground and USIM_DET is at high level. The following figure shows a reference design of (U)SIM interface with a normally closed (U)SIM card connector. Figure 13: Reference Circuit for Normally Closed (U)SIM Card Connector 4.1.4. Normally Open (U)SIM Card Connector With a normally open (U)SIM card connector, CD1 and CD2 of the connector are disconnected when there is no (U)SIM card inserted. (U)SIM card detection by low level is applicable to this type of connector. Once

(U)SIM hot-swap is enabled by executing AT+QSIMDET=1,0, insertion of a (U)SIM card will drive EM061K-GL_Hardware_Design 36 / 75 Module(U)SIM CardConnectorUSIM_DETUSIM_DATAUSIM_CLKRSTCLKCDIOUSIM_VDDUSIM_RSTVCCGNDVPPGNDTVS arrayNOTE: All these resistors, capacitors and TVS array should be close to (U)SIM card connector in PCB layout.10-20K22R 22R 22R 33 pF33 pF33 pF100 nF LTE-A Module Series USIM_DET from high to low level, and the removal of it will drive USIM_DET from low to high level. When the (U)SIM is absent, CD1 is open from CD2 and USIM_DET is at high level. When the (U)SIM is inserted, CD1 is shorted to ground and USIM_DET is at low level. The following figure shows a reference design of (U)SIM interface with a normally open (U)SIM card connector. Figure 14: Reference Circuit for Normally Open (U)SIM Card Connector 4.1.5.

(U)SIM Card Connector Without Hot-swap If the (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for the (U)SIM card interface with a 6-pin (U)SIM card connector is illustrated by the following figure. Figure 15: Reference Circuit for 6-Pin (U)SIM Card Connector EM061K-GL_Hardware_Design 37 / 75 Module(U)SIM CardConnectorUSIM_DETUSIM_DATAUSIM_CLKRSTCLKCD1IOUSIM_VDDUSIM_RSTVCCGNDVPPGNDTVS array10-20k22R 22R 22R 33 pF33 pF33 pF100 nF0RCD2NOTE: All these resistors, capacitors and TVS array should be close to (U)SIM card connector in PCB layout.Module(U)SIM CardConnectorUSIM_DETUSIM_DATAUSIM_CLKRSTCLKIOUSIM_VDDUSIM_RSTVCCGNDVPPGNDTVS arrayNOTE: All these resistors, capacitors and TVS array should be close to (U)SIM card connector in PCB layout.10-20K22R 22R 22R 33 pF33 pF33 pF100 nF LTE-A Module Series 4.1.6.

(U)SIM2 Card Compatible Design It should be noted that if the (U)SIM2 interface is used for an external (U)SIM card, the circuits are the same as those of (U)SIM1 interface. if the (U)SIM2 interface is used for an internal eSIM card, pins 40, 42, 44, 46 and 48 of the module must be kept open. A recommended compatible design for the (U)SIM2 interface is shown below. Figure 16: Recommended Compatible Design for (U)SIM2 Interface 4.1.7.

(U)SIM Design Notices To enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design. Place the (U)SIM card connector as close to the module as possible. Keep the trace length less than 200 mm. Keep (U)SIM card signals away from RF and VCC traces. Ensure the ground between the module and the (U)SIM card connector is short and wide. Keep the trace width of ground and USIM_VDD not less than 0.5 mm to maintain the same electric potential. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. To offer better ESD protection, add a TVS array of which the parasitic capacitance should be not higher than 10 pF. Add 22 resistors in series between the module and the (U)SIM card connector to suppress EMI such as spurious transmission. The 33 pF capacitors are used to filter out RF interference. Additionally, keep the (U)SIM peripheral circuit close to the (U)SIM card connector. For USIM_DATA, a 1020 k pull-up resistor must be added near the (U)SIM card connector. The (U)SIM card connector should be placed near the M.2 socket, because a long trace may lead to waveform distortion, which affects the signal quality. EM061K-GL_Hardware_Design 38 / 75 Module(U)SIM CardConnectorUSIM2_DETUSIM2_DATAUSIM2_CLKRSTCLKCDIOUSIM2_VDDUSIM2_RSTVCCGNDVPPGNDTVS arrayNOTE: The five 0 resistors must be close to the module, and all other components should be close to (U)SIM card connector in PCB layout.484644404210-20K22 22 22 33 pF33 pF33 pF100 nF0 0 0 0 0 eSIM LTE-A Module Series 4.2. USB Interface The module provides one integrated Universal Serial Bus (USB) interface which complies with USB 2.0 specifications and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, firmware upgrade (USB 2.0 only), software debugging, GNSS NMEA sentence output, and voice over USB*. Table 14: Pin Definition of USB Interface Pin No. Pin Name I/O Description Comment 7 9 USB_DP AIO USB differential data (+) USB_DM AIO USB differential data (-) Require differential impedance of 90 . Test points must be reserved. For more details about the USB 2.0 specifications, please visit http://www.usb.org/home. The following figure presents a reference circuit for the USB interface. Figure 17: Reference Circuit for USB Interface To ensure the signal integrity of USB 2.0 data traces, R1, R2, R3 and R4 must be placed close to the module, and the stubs must be minimized in PCB layout. Please follow the principles below when designing the USB interface to meet 2.0 specifications:

Route the USB signal traces as differential pairs with ground surrounded. The impedance of differential trace of USB 2.0 is 90 . EM061K-GL_Hardware_Design 39 / 75 HostModuleUSB_DMUSB_DPBBUSB_DMUSB_DP97TVS arrayTest PointsMinimize these stubs in PCB layout.R1 0 R2 0 R3 NM-0 R4 NM-0 LTE-A Module Series For USB 2.0, the trace length should be less than 120 mm, and the differential data pair matching should be less than 2 mm. Do not route signal traces under crystals, oscillators, magnetic devices, PCIE, other high-speed and RF signal traces. Route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. Junction capacitance of the ESD protection components might cause influences on USB data traces, so you should pay attention to the selection of the components. Typically, the stray capacitance should be less than 1.0 pF for USB 2.0. Keep the ESD protection components as close to the USB connector as possible. If possible, reserve 0 resistor on USB_DP and USB_DM traces respectively. 4.3. PCM Interface*

The module supports audio communication through external codecs via Pulse Code Modulation (PCM) digital interface. The PCM interface supports the following modes:

Primary mode (short frame synchronization): the module works as both master and slave. Auxiliary mode (long frame synchronization): the module works as master only. In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256 kHz, 512 kHz, 1024 kHz or 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4096 kHz PCM_CLK at 16 kHz PCM_SYNC. In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates only with a 256 kHz PCM_CLK and an 8 kHz, 50 % duty cycle PCM_SYNC. The module supports 16-bit linear data format. The following figures show the primary modes timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary modes timing relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK. EM061K-GL_Hardware_Design 40 / 75 LTE-A Module Series Figure 18: Primary Mode Timing Figure 19: Auxiliary Mode Timing The following table shows the pin definition of PCM interface which can be applied to audio codec design. Table 15: Pin Definition of PCM Interface Pin No. Pin Name I/O Description Comment 20 22 24 28 PCM_CLK DIO, PD PCM clock PCM_DIN DI, PD PCM data input PCM_DOUT DO, PD PCM data output PCM_SYNC DIO, PD PCM data frame sync EM061K-GL_Hardware_Design 41 / 75 PCM_CLKPCM_SYNCPCM_DOUTMSBLSBMSB125 s12256255PCM_DINMSBLSBMSBPCM_CLKPCM_SYNCPCM_DOUTMSBLSBPCM_DIN125 sMSB123231LSB The clock and mode can be configured by AT command. The default configuration is master mode using short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. For more details, see document [3]. LTE-A Module Series 4.4. Control and Indication Interfaces Table 16: Pin Definition of Control and Indication Interfaces Pin No. Pin Name I/O Description Comment 8 10 23 25 26 60 W_DISABLE1#

DI, PU WWAN_LED#

OD WAKE_ON_WAN#*

OD Airplane mode control Active low RF status indication LED Active low Wake up the host Active low DPR DI, PU Dynamic power reduction Active low High level by default. W_DISABLE2#*

DI, PU GNSS control Active low WLAN_PA_EN*

DI Self-protection of QLN control 4.4.1. W_DISABLE1#

The module provides a W_DISABLE1# pin to disable or enable airplane mode through hardware operation. W_DISABLE1# is pulled up by default. Driving it low will configure the module into airplane mode. In airplane mode, the RF function will be disabled. The RF function can also be enabled or disabled through software AT commands. The following table shows the AT command and corresponding RF function status of the module. Table 17: RF Function Status Logic Level AT Command RF Function Status Operating Mode AT+CFUN=1 Enabled Full functionality mode High Level AT+CFUN=0 AT+CFUN=4 Disabled Minimum functionality mode Airplane mode EM061K-GL_Hardware_Design 42 / 75 LTE-A Module Series Low Level AT+CFUN=0 AT+CFUN=1 AT+CFUN=4 Disabled Airplane mode 4.4.2. W_DISABLE2#

The module provides a W_DISABLE2# pin to disable or enable the GNSS function. The W_DISABLE2#

pin is pulled up by default. Driving it low will disable the GNSS function. The GNSS function can also be controlled through software AT commands. The combination of W_DISABLE2# pin and AT commands controls the GNSS function. Table 18: GNSS Function Status Logic Level AT Command GNSS Function Status High Level Low Level AT+QGPS=1 Enabled AT+QGPSEND Disabled AT+QGPS=1 AT+QGPSEND Disabled For details about AT commands mentioned above, see document [4]. A simple voltage-level translator based on diodes is used on W_DISABLE1# pin and W_DISABLE2# pin which are pulled up to a 1.8 V voltage in the module. The control signals (GPIO) of the host device could be at 1.8 V or 3.3 V voltage level. W_DISABLE1# and W_DISABLE2# are active low signals. A reference circuit of the two pins is shown below. Figure 20: Reference Circuit of W_DISABLE1# and W_DISABLE2#

EM061K-GL_Hardware_Design 43 / 75 HostModuleW_DISABLE2#W_DISABLE1#BBGPIOGPIO268VDD 1.8 VR110KR210KNOTE: The voltage level of VCC_IO_HOST could be 1.8 V or 3.3 V typically.VCC_IO_HOSTR3100KR4100K LTE-A Module Series 4.4.3. WWAN_LED#

The WWAN_LED# signal is used to indicate RF status of the module, and its sink current is up to 10 mA. To reduce power consumption of the LED, a current-limited resistor must be placed in series with the LED, as illustrated in the figure below. The LED is ON when the WWAN_LED# signal is at low level. Figure 21: WWAN_LED# Reference Circuit Table 19: Network Status Indications of WWAN_LED#

Logic Level Description Low Level (LED on) RF function is turned on High Level (LED off) RF function is turned off if any of the following occurs:

The (U)SIM card is not powered. W_DISABLE1# is at low level (airplane mode enabled). AT+CFUN=4 and AT+CFUN=0 (RF function disabled). 4.4.4. WAKE_ON_WAN#

The WAKE_ON_WAN# is an open drain pin, which requires a pull-up resistor on the host. When a URC returns, a one-second low level pulse signal will be outputted to wake up the host. Table 20: State of the WAKE_ON_WAN#

WAKE_ON_WAN# State Module Operation Status Outputs a one-second pulse signal at low level Call/SMS/Data is incoming (to wake up the host) Always at high level Idle/Sleep EM061K-GL_Hardware_Design 44 / 75 ModuleWWAN_LED#PMIC10VCC (Typ. 3.7 V)R1330 LED12, 470, 72, 74VCC LTE-A Module Series Figure 22: Reference Circuit of WAKE_ON_WAN#

4.4.5. DPR The module provides a DPR (Dynamic Power Reduction) pin for body SAR (Specific Absorption Rate) detection. The signal is sent from a host system proximity sensor to the module to provide an input trigger, which will reduce the output power in burst transmission. Table 21: Pin definition of DPR Pin No. Pin Name I/O Description Comment 25 DPR DI, PU Dynamic power reduction Active low High level by default. Table 22: Function of the DPR Signal Logic Level Function High/Floating No backoff of max transmitting power occurred Low Backoff of max transmitting power occurred according to configuration in SAR efs file 4.4.6. WLAN_PA_EN QLN enables self-protection circuit (integrated inside QLN) when WLAN_PA_EN is at high level. In LTE mode, WLAN_PA_EN is set to 0 (low level) by default. When WLAN_PA_EN is set to 1 (high level), the LNA will be in self-protection mode. EM061K-GL_Hardware_Design 45 / 75 HostModuleWAKE_ON_WAN#BBGPIO23VCC_IO_HOSTNOTE: The voltage level on VCC_IO_HOST depends on the host side due to the open drain in pin 23.Wake up the host1 sHLR110K LTE-A Module Series Table 23: Pin definition of WLAN_PA_EN Pin No. Pin Name I/O Description Comment 60 WLAN_PA_EN DI, PD Self-protection of QLN control 4.5. Antenna Tuner Control Interface*

ANTCTL [0:3] and RFFE interfaces are used for antenna tuner control and should be routed to an appropriate antenna control circuit. 4.5.1.1. Antenna Tuner Control Interface through GPIOs Table 24: Pin Definition of Antenna Tuner Control Interface through GPIOs Pin No. 59 61 63 65 Pin Name I/O Description Comment ANTCTL0 DO, PD ANTCTL1 DO, PD ANTCTL2 DO, PD ANTCTL3 DO, PD Antenna tuner GPIO control 4.5.1.2. Antenna Tuner Control Interface through RFFE Table 25: Pin Definition of Antenna Tuner Control Interface through RFFE Pin No. Pin Name I/O Description Comment RFFE_CLK DO, PD Used for external MIPI IC control RFFE_DATA DIO, PD Used for external MIPI IC control 56 58 NOTE If RFFE_CLK and RFFE_DATA are required, please contact Quectel for more details. EM061K-GL_Hardware_Design 46 / 75 4.6. 4.6. Configuration Pins Table 26: List of Configuration Pins LTE-A Module Series Config_0

(Pin 21) Config_1

(Pin 69) Config_2

(Pin 75) Config_3

(Pin 1) Module Type and Main Host Interface Port Configuration NC GND GND GND Quectel defined

Table 27: Pin Definition of Configuration Pins Pin No. Pin Name I/O Description 21 69 75 1 CONFIG_0 DO Not connected internally CONFIG_1 DO Connected to GND internally CONFIG_2 DO Connected to GND internally CONFIG_3 DO Connected to GND internally The following figure shows a reference circuit for these four pins. Figure 23: Recommended Circuit of Configuration Pins EM061K-GL_Hardware_Design 47 / 75 HostModuleCONFIG_0CONFIG_1CONFIG_2CONFIG_3GPIOGPIOGPIOGPIO2169751VCC_IO_HOSTR1100KR2100KR3100KR4100K0 NM-0 0 NOTE: The voltage level VCC_IO_HOST depends on the host side, and could be a 1.8 V or 3.3 V voltage level.0 LTE-A Module Series 5 Antenna Interfaces Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. 5.1. Cellular Network 5.1.1. Antenna Interfaces & Frequency Bands The module provides a main antenna connector and a diversity/GNSS antenna connector, which are used to resist the fall of signals caused by high-speed movement and multipath effect. The impedance of antenna ports is 50 . Table 28: Antenna Connectors Definition Antenna Connector I/O Description Comment ANT_MAIN AIO ANT_DRx/GNSS AI Table 29: Frequency Bands Main antenna interface:

LTE: TRx WCDMA: TRx Diversity/GNSS antenna interface:

LTE: DRx WCDMA: DRx GNSS: GPS/GLONASS/Galileo/BDS 50 impedance 3GPP Band Transmit Receive WCDMA B1 19201980 21102170 WCDMA B2 18501910 19301990 WCDMA B3 17101785 18051880 WCDMA B4 17101755 21102155 WCDMA B5 824849 869894 Unit MHz MHz MHz MHz MHz EM061K-GL_Hardware_Design 48 / 75 LTE-A Module Series WCDMA B6 WCDMA B8 WCDAM B19 830840 880915 830845 875885 925960 875890 LTE-FDD B1 19201980 21102170 LTE-FDD B2 18501910 19301990 LTE-FDD B3 17101785 18051880 LTE-FDD B4 17101755 21102155 LTE-FDD B5 824849 869894 LTE-FDD B7 25002570 26202690 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 880915 699716 777787 788798 704716 815830 830845 832862 925960 729746 746756 758768 734746 860875 875890 791821 LTE-FDD B25 18501915 19301995 LTE-FDD B26 814849 LTE-FDD B28 703748 LTE-FDD B29 8

LTE-FDD B30 23052315 LTE-FDD B32 8

859894 758803 717728 23502360 14521496 LTE-FDD B66 17101780 21102200 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz 8 LTE-FDD B29/B32 support Rx only and are only for secondary component carrier. EM061K-GL_Hardware_Design 49 / 75 LTE-A Module Series LTE-FDD B71 663-698 617-652 LTE-TDD B34 2010-2025 2010-2025 LTE-TDD B38 25702620 25702620 LTE-TDD B39 18801920 18801920 LTE-TDD B40 23002400 23002400 LTE-TDD B41 24962690 24962690 MHZ MHZ MHz MHz MHz MHz 5.1.2. Tx Power Table 30: EM061K-GL Conducted RF Output Power Frequency Bands Modulation Max. Min. Comment WCDMA B1 WCDMA B2 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 WCDMA B19 LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 BPSK BPSK BPSK BPSK BPSK BPSK BPSK BPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK 23 dBm 2 dB

< -50 dBm 23 dBm 2 dB

< -50 dBm 23 dBm 2 dB

< -50 dBm 23 dBm 2 dB

< -50 dBm 23 dBm 2 dB

< -50 dBm 23 dBm 2 dB

< -50 dBm 23 dBm 2 dB

< -50 dBm 23 dBm 2 dB

< -50 dBm

23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB EM061K-GL_Hardware_Design 50 / 75 LTE-A Module Series LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28 LTE-FDD B30 LTE-FDD B66 LTE-FDD B71 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40 LTE-TDD B41 QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK QPSK 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 22 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23.5 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23 dBm 1 dB

< -40 dBm 10 MHz, 1RB 23 dBm 1 dB

< -40 dBm 10 MHz, 1RB 5.1.3. Rx Sensitivity Table 31: EM061K-GL Rx Sensitivity Frequency Bands Primary Diversity SIMO 9 3GPP (SIMO) (dBm) Comment 10 WCDMA B1 WCDMA B2 WCDMA B3 WCDMA B4 WCDMA B5 WCDMA B6 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

-106.7

-104.7

-103.7

-106.7

-104.7

-106.7 9 SIMO is a smart antenna technology that uses a single antenna at the transmitter side and multiple antennas at the receiver side, which can improve Rx performance. 10 The RB configuration follows 3GPP specification. EM061K-GL_Hardware_Design 51 / 75 WCDMA B8 WCDMA B19 LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28 LTE-FDD B29 11 LTE-FDD B30 LTE-FDD B32 11 LTE-FDD B66 LTE-FDD B71 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

-103.7

-106.7

-96.3

-94.3

-93.3

-96.3

-94.3

-94.3

-93.3

-93.3

-93.3

-93.3

-93.3

-96.3

-96.3

-93.3

-92.8

-93.8

-94.8

-93.3

-95.3

-96.3

-95.8

-94.3

-96.3

-96.3

-96.3 LTE-A Module Series 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 5 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 5 MHz 5 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 10 MHz 11 The test results are based on CA_2A-29A, and CA_20A-32A. LTE-FDD B29/B32 support Rx only and are only for secondary component carrier. EM061K-GL_Hardware_Design 52 / 75 LTE-TDD B40 LTE-TDD B41 TBD TBD TBD TBD TBD TBD

-96.3

-94.3 10 MHz 20 MHz LTE-A Module Series 5.2. GNSS 5.2.1. Antenna Interface & Frequency Bands The module includes a fully integrated global navigation satellite system solution. The module supports standard NMEA 0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, the module GNSS engine is switched off. It has to be switched on via AT command. For more details, see document [4]. Table 32: GNSS Frequency Type Frequency GPS/Galileo 1575.42 1.023 GLONASS 1601.65 4.15 BDS 1561.098 2.046 5.2.2. GNSS Performance Table 33: GNSS Performance Parameter Description Condition Acquisition Autonomous Sensitivity Reacquisition Autonomous Tracking Autonomous TTFF Cold start

@ open sky Autonomous XTRA enabled Unit MHz MHz MHz Typ. TBD TBD TBD TBD TBD Unit dBm dBm dBm s s EM061K-GL_Hardware_Design 53 / 75 LTE-A Module Series TBD TBD TBD TBD TBD s s s s m Autonomous XTRA enabled Autonomous XTRA enabled Autonomous

@ open sky Warm start

@ open sky Hot start

@ open sky Accuracy CEP-50 NOTE 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock. 3. Acquisition sensitivity: the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command. 5.3. Antenna Design Requirements Table 34: Antenna Requirements Type Requirements Main Antenna

(WCDMA/LTE Tx/Rx) Diversity/GNSS Antenna

(WCDMA/LTE/GNSS RX) VSWR: 2 Efficiency: >30 %

Max Input Power: 50 W Input Impedance: 50 Cable Insertion Loss:

< 1 dB: LB (<1 GHz)

< 1.5 dB: MB (12.3 GHz)

< 2 dB: LB (> 2.3 GHz) NOTE It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. EM061K-GL_Hardware_Design 54 / 75 LTE-A Module Series 5.4. Antenna Connectors 5.4.1. Antenna Connector Location The antenna connector locations are shown below. Figure 24: Antenna Connectors on EM061K-GL 5.4.2. Antenna Connector Specifications The module is mounted with standard 2 mm 2 mm receptacle antenna connectors for convenient antenna connection. The antenna connectors PN is IPEX 20449-001E, and the connector dimensions are illustrated as below:

Figure 25: Dimensions of the Receptacle (Unit: mm) EM061K-GL_Hardware_Design 55 / 75 LTE-A Module Series Table 35: Major Specifications of the RF Connectors Item Specification Nominal Frequency Range DC to 6 GHz Nominal Impedance 50 Temperature Rating

-40 to +85 C Voltage Standing Wave Ratio (VSWR) Meet the requirements of:

Max. 1.3 (DC3 GHz) Max. 1.45 (36 GHz) 5.4.3. Antenna Connector Installation The receptacle RF connector used in conjunction with the modules will accept two types of mated plugs that will meet a maximum height of 1.2 mm using a 0.81 mm coaxial cable or a maximum height of 1.45 mm utilizing a 1.13 mm coaxial cable. The following figure shows the dimensions of mated plugs using 0.81 mm coaxial cables:

Figure 26: Dimensions of Mated Plugs (0.81/1.13 mm Coaxial Cables) (Unit: mm) EM061K-GL_Hardware_Design 56 / 75 The following figure illustrates the connection between the receptacle RF connector on the modules and the mated plugs using a 0.81 mm coaxial cable. LTE-A Module Series Figure 27: Space Factor of Mated Connectors (0.81 mm Coaxial Cables) (Unit: mm) The following figure illustrates the connection between the receptacle RF connector on EM061K-GL and the mated plugs using a 1.13 mm coaxial cable. Figure 28: Space Factor of Mated Connectors ( 1.13 mm Coaxial Cables) (Unit: mm) EM061K-GL_Hardware_Design 57 / 75 LTE-A Module Series 6 Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the modules are listed in the following table. Table 36: Absolute Maximum Ratings Parameter VCC Min.

-0.3 Typ. 3.7 Max. 4.7 Unit V 6.2. Power Supply Ratings The typical input voltage of the module is 3.7 V. Table 37: Power Supply Requirements Parameter Description Condition Min. Typ. Max. Unit VCC Voltage Ripple Power supply for the module The actual input voltages must be kept between the minimum and maximum values. 3.135 3.7 4.4 V

30 100 mV EM061K-GL_Hardware_Design 58 / 75 LTE-A Module Series 6.3. Power consumption Table 38: Averaged Power Consumption Description Condition Typ. Unit OFF state Power down AT+CFUN=0 @ USB2.0 Suspend AT+CFUN=4 @ USB2.0 Suspend Sleep State WCDMA PF = 64 @ USB2.0 Suspend LTE-FDD PF = 64 @ USB2.0 Suspend LTE-TDD PF = 64 @ USB2.0 Suspend TBD TBD TBD TBD TBD TBD WCDMA PF = 64 (B1 CH10700 USB Disconnect) TBD WCDMA PF = 64 (B1 CH10700 USB2.0 Connect) TBD ldle State LTE-FDD PF = 64 (B1 CH300 USB Disconnect) LTE-FDD PF = 64 (B1 CH300 USB2.0 Connect) TBD TBD LTE-TDD PF = 64 (B38 CH38000 USB Disconnect) TBD LTE-TDD PF = 64 (B38 CH38000 USB2.0 Connect) TBD WCDMA Data Transfer

(GNSS Off) WCDMA B1 HSDPA CH10700 @ TBD dBm WCDMA B1 HSUPA CH10700 @ TBD dBm WCDMA B2 HSDPA CH9800 @ TBD dBm WCDMA B2 HSUPA CH9800 @ TBD dBm WCDMA B3 HSDPA CH1338 @ TBD dBm WCDMA B3 HSUPA CH1338 @ TBD dBm WCDMA B4 HSDPA CH1638 @ TBD dBm WCDMA B4 HSUPA CH1638 @ TBD dBm WCDMA B5 HSDPA CH4407 @ TBD dBm TBD TBD TBD TBD TBD TBD TBD TBD TBD A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EM061K-GL_Hardware_Design 59 / 75 WCDMA B5 HSUPA CH4407 @ TBD dBm WCDMA B6 HSDPA CH4400 @ TBD dBm WCDMA B6 HSUPA CH4400 @ TBD dBm WCDMA B8 HSDPA CH3012 @ TBD dBm WCDMA B8 HSUPA CH3012 @ TBD dBm WCDMA B19 HSDPA CH738 @ TBD dBm WCDMA B19 HSUPA CH738 @ TBD dBm LTE-FDD B1 CH300 @ TBD dBm LTE-FDD B2 CH900 @ TBD dBm LTE-FDD B3 CH1575 @ TBD dBm LTE-FDD B4 CH2175 @ TBD dBm LTE-FDD B5 CH2525 @ TBD dBm LTE-FDD B7 CH3100 @ TBD dBm LTE-FDD B8 CH3625 @ TBD dBm LTE-FDD B12 CH5095 @ TBD dBm LTE Data Transfer

(GNSS Off) LTE-FDD B13 CH5230 @ TBD dBm LTE-FDD B14 CH5330 @ TBD dBm LTE-FDD B17 CH5790 @ TBD dBm LTE-FDD B18 CH5925 @ TBD dBm LTE-FDD B19 CH6075 @ TBD dBm LTE-FDD B20 CH6300 @ TBD dBm LTE-FDD B25 CH8365 @ TBD dBm LTE-FDD B26 CH8865@ TBD dBm LTE-FDD B28 CH9360 @ TBD dBm LTE-FDD B30 CH9820 @ TBD dBm LTE-A Module Series TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EM061K-GL_Hardware_Design 60 / 75 LTE-FDD B66 CH66886 @ TBD dBm LTE-FDD B71 CH68786 @ TBD dBm LTE-TDD B34 CH36275@ TBD dBm LTE-TDD B38 CH38000 @ TBD dBm LTE-TDD B39 CH38450 @ TBD dBm LTE-TDD B40 CH39150 @ TBD dBm LTE-TDD B41 CH40740 @ TBD dBm WCDMA B1 CH10700 @ TBD dBm WCDMA B2 CH9800 @ TBD dBm WCDMA B3 CH1338 @ TBD dBm WCDMA B4 CH1638 @ TBD dBm WCDMA B5 CH4407 @ TBD dBm WCDMA B6 CH4400 @ TBD dBm WCDMA B8 CH3012 @ TBD dBm WCDMA B19 CH738 @ TBD dBm WCDMA Voice Call*

NOTE LTE-A Module Series TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 1. Power consumption test is carried out under 3.7 V, 25 C with 5G-M2 EVB, and with thermal dissipation measures. 2. For more details about current consumption, please contact Quectel Technical Support to obtain the power consumption test report of the modules. EM061K-GL_Hardware_Design 61 / 75 LTE-A Module Series 6.4. Digital I/O Characteristics Table 39: (U)SIM Low-voltage I/O Requirements Parameter Description Min. Max. Unit VIH VIL VOH VOL High-level input voltage 0.7 USIM_VDD USIM_VDD + 0.3 V Low-level input voltage

-0.3 0.2 USIM_VDD V High-level output voltage 0.8 USIM_VDD USIM_VDD Low-level output voltage 0 0.4 V V Table 40: (U)SIM High-voltage I/O Requirements Parameter Description Min. Max. Unit VIH VIL VOH VOL High-level input voltage 0.7 USIM_VDD USIM_VDD + 0.3 V Low-level input voltage

-0.3 0.2 USIM_VDD V High-level output voltage 0.8 USIM_VDD USIM_VDD Low-level output voltage 0 0.4 Table 41: 1.8 V Digital I/O Requirements Parameter Description Min. VIH VIL VOH VOL High-level input voltage 1.65 Low-level input voltage

-0.3 High-level output voltage 1.3 Low-level output voltage 0 Max. 2.1 0.54 1.8 0.4 V V Unit V V V V EM061K-GL_Hardware_Design 62 / 75 LTE-A Module Series Table 42: 3.3 V Digital I/O Requirements Parameter Description 3.3 V Power domain Min. 3.135 VIH VIL High-level input voltage 2.0 Low-level input voltage

-0.5 Max. 3.464 3.6 0.8 Unit V V V 6.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 43: Electrostatic Discharge Characteristics (Temperature: 2530 C, Humidity: 40 5 %) Tested Interface Contact Discharge Air Discharge Unit VCC, GND Antenna Interfaces Other Interfaces 5 4 0.5 10 8 1 kV kV kV EM061K-GL_Hardware_Design 63 / 75 LTE-A Module Series 6.6. Operating and Storage Temperatures Table 44: Operating and Storage Temperatures Parameter Min. Operating Temperature Range 12

-25 Extended Temperature Range 13

-40 Storage temperature Range

-40 Typ.

+25

Max. Unit

+75

+85

+90 C C C 6.7. Thermal Dissipation Figure 29: Distribution of Heat Source Chips Inside the Module The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips 12 To meet this operating temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within the temperature range of -10 C to +55 Cthe mentioned RF performance margins higher than 3GPP specifications can be guaranteed. When temperature goes beyond temperature range of -10 C to 55 C, a few RF performances of module may be slightly off 3GPP specifications. 13 To meet this extended temperature range, you need to ensure effective thermal dissipation, for example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module remains the ability to establish and maintain functions such as voice*, SMS, emergency call*, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may undergo a reduction in value, exceeding the specified tolerances of 3GPP. When the temperature returns to the normal operating temperature level, the module will meet 3GPP specifications again. EM061K-GL_Hardware_Design 64 / 75 LTE-A Module Series always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:

Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Expose the copper in the PCB area where module is mounted. Apply a soft thermal pad with appropriate thickness and high thermal conductivity between the module and the PCB to conduct heat. Follow the principles below when the heatsink is necessary:

- Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.

- Attach the heatsink to the shielding cover of the module; In general, the base plate area of the heatsink should be larger than the module area to cover the module completely;

- Choose the heatsink with adequate fins to dissipate heat;

- Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;

- Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. Figure 30: Placement and Fixing of the Heatsink Table 45: Maximum Operating Temperature for Main Chips (Unit: C) BASEBAND MCP PMU WTR MMPA 85 85 85 85 100 PA 85 APT 85 6.8. Notification EM061K-GL_Hardware_Design 65 / 75 HeatsinkPCBTIMThermal padModuleScrewHeatsinkTIMModuleThermal padPCB LTE-A Module Series Please follow the principles below in the module application. 6.8.1. Coating If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 6.8.2. Cleaning Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6.8.3. Installing It is recommended to fix the module firmly when the module is inserted into a socket. EM061K-GL_Hardware_Design 66 / 75 LTE-A Module Series 7 Mechanical Information and Packaging This chapter mainly describes mechanical dimensions and packaging specifications of EM061K-GL. All dimensions are measured in mm, and the dimensional tolerances are 0.15 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 31: Module Top and Side Dimensions EM061K-GL_Hardware_Design 67 / 75 7.2. Top and Bottom Views LTE-A Module Series Figure 32: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual modules. For authentic appearance and label, please refer to the module received from Quectel. 7.3. M.2 Connector EM061K-GL adopts a standard PCI Express M.2 connector which compiles with the directives and standards listed in PCI Express M.2 Specification. 7.4. Packaging This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The modules adopt blister tray packaging and details are as follow:

7.4.1. Blister Tray Dimension details are as follow:

EM061K-GL_Hardware_Design 68 / 75 LTE-A Module Series Figure 33: Blister Tray Dimension Drawing 7.4.2. Packaging Process EM061K-GL_Hardware_Design 69 / 75 Each blister tray packs 10 modules. Stack 10 blister trays with modules together, and put 1 empty blister tray on the top. Packing 11 blister trays together and then put blister trays into a conductive bag, seal and pack the conductive bag. LTE-A Module Series Put seal-packed blister trays into a mini box. One mini box can pack 100 modules. Put 4 mini boxes into 1 carton and then seal it. One carton can pack 400 modules. Figure 34: Packaging Process EM061K-GL_Hardware_Design 70 / 75 LTE-A Module Series 8 Appendix References Table 46: Related Documents Document Name

[1] Quectel_EM061K-GL_CA_Feature

[2] Quectel_5G-M2_EVB_User_Guide

[3] Quectel_EG06xK&Ex120K&EM060K_Series_AT_Commands_Manual

[4] Quectel_LTE-A(Q)_Series_GNSS_Application_Note Table 47: Terms and Abbreviations Abbreviation Description APT AT BB BDS BIOS bps BPSK CBRS CPE COEX Average Power Tracking ATtention Baseband BeiDou Navigation Satellite System Basic Input/Output System Bit(s) per second Binary Phase Shift Keying Citizen Broadband Radio Service Customer-Premise Equipment Coexistence DC-HSDPA Dual-carrier High Speed Downlink Package Access DFOTA Delta Firmware Upgrade Over-The-Air EM061K-GL_Hardware_Design 71 / 75 LTE-A Module Series DL DPR DRX DRx EBI EIRP ESD ESR FDD Downlink Dynamic Power Reduction Discontinuous Reception Diversity Receive External Bus Interface Equipment Isotropic Radiated Power Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplex GLONASS Global Navigation Satellite System (Russia) GNSS GPS GSM HSDPA HSPA HSUPA IC kbps LAA LDO LED Global Navigation Satellite System Global Positioning System Global System for Mobile Communications High Speed Downlink Packet Access High Speed Packet Access High Speed Uplink Packet Access Integrated Circuit Kilobits per second License Assisted Access Low-dropout Regulator Light Emitting Diode LPDDR2 Low Power Double Data Rate 2 LSB LTE MBIM Least Significant Bit Long Term Evolution Mobile Broadband Interface Model EM061K-GL_Hardware_Design 72 / 75 LTE-A Module Series Mbps MCP ME MFBI MIPI MIMO MLCC MMPA MO MSB MT NAND NC NPN PA PAP PC PCB PCIe PCM PDU PME PMIC PMU POS Megabits per second Multiple Chip Package Mobile Equipment Multi-Frequency Band Indicator Mobile Industry Processor Interface Multiple-Input Multiple-Output Multi-layer Ceramic Capacitor Multimode Multiband Power Amplifier Mobile Originated Most Significant Bit Mobile Terminated NON-AND Not Connected Negative-Positive-Negative Power Amplifier Password Authentication Protocol Personal Computer Printed Circuit Board Peripheral Component Interconnect Express Pulse Code Modulation Protocol Data Unit Power Management Event Power Management IC Power Management Unit Point of Sale EM061K-GL_Hardware_Design 73 / 75 LTE-A Module Series PPP PRx QLN QMI QPSK RB RF RFFE RH Rx SAR Point-to-Point Protocol Primary Receive Qualcomm Low-noise Amplifer Qualcomm MSM (Mobile Station Modems) Interface Quadrature Phase Shift Keying Resource Block Radio Frequency RF Front-End Relative Humility Receive Specific Absorption Rate SDRAM Synchronous Dynamic Random-Access Memory SMS SPMI TCP TDD TRx Tx UART UDP UL URC USB

(U)SIM VFB Short Message Service System Power Management Interface Transmission Control Protocol Time Division Duplex Transmit & Receive Transmit Universal Asynchronous Receiver/Transmitter User Datagram Protocol Uplink Unsolicited Result Code Universal Serial Bus

(Universal) Subscriber Identity Module Voltage Feedback EM061K-GL_Hardware_Design 74 / 75 LTE-A Module Series VIH VIL VOH VOL High-level Input Voltage Low-level Input Voltage High-level Output Voltage Low-level Output Voltage WCDMA Wideband Code Division Multiple Access WTR XO Wafer-scale RF transceiver Crystal Oscillator EM061K-GL_Hardware_Design 75 / 75

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Federal Communications Commission Authorization and Evaluation Division Confidentiality Request regarding application for certification of FCC ID:

XMR2023EM061KGL2 Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:

Exhibit Type

(1. Block Diagram.pdf; 2.SCH.pdf; 3. Operational description.pdf; 4.BOM.pdf; 5. Tune up) File Name N/A The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Section 0.457 of the Rules, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. We are requesting the commission to grant short-term confidentiality request on the following attachment(s) for 180 days after the grant as outlined in Public Notice DA 04-1705. Exhibit Type

(External Photos, Internal Photos, Setup Photos, Manual) File Name

(Appendix A.3-External Photos.pdf; Appendix A.4-Internal Photos.pdf; Appendix A.2 PCB Setup Photos; Manual;) Sincerely, Name: Jean Hu Title: Certification Manager Rev 11/20/07

RF_160, Issue 04 Quectel Wireless Solutions Co., Ltd. Declaration of Authorization We Name:

Address:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China City:

Country:

Shanghai China Declare that:

Name Representative of agent: Well Wei Agent Company name:

Address:

Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone City:

Country Suzhou China SGS-CSTC Standards Technical Services (Suzhou) Co., Ltd South of No. 6 Plant, No. 1, Runsheng Road, Suzhou Industrial is authorized to apply for Certification of the following product(s):

Product description: LTE-A Module Type designation: EM061K-GL Trademark:

FCC ID: XMR2023EM061KGL2 QUECTEL on our behalf. Date:

Name:

Email:

2023/06/25 Jean Hu . (2) jean.hu@quectel.com. Signature:

Notes:

(1): Required for FCC application

(2): For FCC it must be the Grantee Code owner or the authorized agent.

Quectel Wireless Solutions Co., Ltd. Product Change Description As the applicant of the below model, [Quectel Wireless Solutions Co., Ltd.]

declares that the product, Original Model Name : EM061K-GL Hardware: R1.0 Software: EM061KGLAAR01A02M2G FCC ID: XMR2023EM061KGL is the variant of the initial certified product, New Model Name : EM061K-GL Hardware: R1.0 Software: EM061KGLAAR01A02M2G FCC ID: XMR2023EM061KGL2 The hardware and software are the same, only the FCC ID is different. Company: Quectel Wireless Solutions Co., Ltd. Address: Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Name: Jean hu Signature:

Date: 2023.7.5

FCC FEDERAL COMMUNICATIONS COMMISSION Suppliers Declaration of Conformity (SDoC) Trademark(s) and Model(s): QUECTEL / EM061K-GL Equipment: LTE-A Module Manufacturer: Quectel Wireless Solutions Co., Ltd. FCC ID in case other parts of this equipment are subject to certification:

XMR2023EM061KGL2 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1)

(2) this device may not cause harmful interference, and this device must accept any interference received, including interference that may cause undesired operation. The following test reports are subject to this declaration:

Test report number:

SEWM2304000133RG09 Issue date:

2023/07/06 The following manufacturer/importer/entity (located in the USA) is responsible for this declaration:

Date:

Name:

Email:

2023/07/06 Jean Hu jean.hu@quectel.com Signature:

Quectel Wireless Solutions Co., Ltd. Federal Communications Commission Authorization & Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 RE: CHANGE IN IDENTIFICATION OF EQUIPMENT Dear Sir or Madam:

We, Quectel Wireless Solutions Co., Ltd., hereby request a new FCC ID as established in 47CFR2.933(b) for a currently approved device. This request is to establish the new FCC ID: XMR2023EM061KGL2 Original FCC ID: XMR2023EM061KGL Original Model: EM061K-GL Original Grant Date: 07/04/2023 New FCC ID: XMR2023EM061KGL2 New Model: EM061K-GL Brand(s): Quectel The equipment is the identical design and construction, and in an entirely unmodified condition, with respect to the original FCC Grant cited above, only the FCC ID is different. The original test results continue to be representative of and applicable to the new equipment. If you have any questions, please contact Rolando Torricella via phone +8602150086326 / 800 or email at jean.hu@quectel.com Sincerely, Name: Jean hu Signature:______________ Date: 2023.7.5