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Users Manual | Users Manual | 2.41 MiB | / March 04 2019 | |||
| 1 | BOM | Parts List/Tune Up Info | March 27 2019 | confidential | ||||
| 1 | Block Diagram | Block Diagram | March 27 2019 | confidential | ||||
| 1 | Cover Letter(s) | / March 04 2019 | ||||||
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| 1 | ID Label/Location Info | / March 04 2019 | ||||||
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Internal Photos | Internal Photos | 1.13 MiB | / March 04 2019 | |||
| 1 | RF Exposure Info | / March 04 2019 | ||||||
| 1 | Cover Letter(s) | / March 04 2019 | ||||||
| 1 | Operational Description | Operational Description | March 27 2019 | confidential | ||||
| 1 | Cover Letter(s) | / March 04 2019 | ||||||
| 1 | Schematics | Schematics | March 27 2019 | confidential | ||||
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| 1 | Test Report | / March 04 2019 | ||||||
| 1 | Test Report | / March 04 2019 | ||||||
| 1 | Test Report | / March 04 2019 | ||||||
| 1 | Test Setup Photos | / March 04 2019 | ||||||
| 1 | Tune up Procedure | Parts List/Tune Up Info | March 27 2019 | confidential | ||||
| 1 | Cover Letter(s) | / March 04 2019 |
| 1 | Users Manual | Users Manual | 2.41 MiB | / March 04 2019 |
EG G91 Ha rdw war re DDessign n LTEM Module S Series Rev. EG91_Ha ardware_ _Design_ _V1.3 Date:
2019-02 2-03 Statu s: Releas sed www.quec ctel.com LTE Module Series EG91 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd. 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:
http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALLINFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. EG91_Hardware_Design 1 / 93 LTE Module Series EG91 Hardware Design About the Document History Revision Date Author Description 1.0 2017-03-22 Felix YIN/
Yeoman CHEN/
Jackie WANG Initial 1. Added band B28A. 2. Updated the description of UMTS and GSM features in Table 2. 3. Updated the functional diagram in Figure 1. 4. Updated module operating frequencies in Table 21. 5. Updated current consumption in Table 26. 6. Updated RF output power in Table 27. 7. Updated the conducted RF receiving sensitivity in Table 28. 8. Updated the GPRS multi-slot classes in Table 33. 9. Added thermal consideration in Chapter 5.8 10. Added a GND pad in each of the four corners of the modules footprint in Chapter 6.2. 11. Updated storage information in Chapter 7.1. 12. Added packaging information in Chapter 7.3. 1. Added the description of EG91-NA. 2. Updated the functional diagram in Figure 1. 3. Updated pin assignment in Figure 2. 4. Updated GNSS function in Table 1. 5. Updated GNSS Features in Table 2. 6. Updated reference circuit of USB interface in Figure 21. 7. Added description of GNSS receiver in Chapter 4. 1.1 2018-01-23 Felix YIN/
Rex WANG 1.2 2018-03-14 Felix YIN/
Rex WANG EG91_Hardware_Design 2 / 93 LTE Module Series EG91 Hardware Design 8. Updated pin definition of RF antenna in Table 21. 9. Updated module operating frequencies in Table 22. 10. Added description of GNSS antenna interface in Chapter 5.2. 11. Updated antenna requirements in Table 25. 12. Updated RF output power in Table 32. 1. Added new variants EG91-NS, EG91-V, EG91-EC and related contents. 2. Opened pin 24 as ADC0 and added related contents. 3. Updated functional diagram (Figure 1) 4. Updated pin assignment (Figure 2) 5. Updated GNSS features (Table 2) 6. Added USB_BOOT interface information
(Chapter 3.18) 7. Updated storage information (Chapter 8.1) 8. Updated module operating frequencies
(Table 23) 9. Updatedantenna requirements (Table26) 10. Added current consumption of EG91-NS, EG91-V and EG91-EC (Table 32, 33 and 34) 11. Added conducted RF receiving sensitivityof EG91-NS, EG91-V and EG91-EC (Table 39, 40 and 41) 1.3 2019-02-03 Ward WANG/
Nathan LIU/
Rex WANG EG91_Hardware_Design 3 / 93 LTE Module Series EG91 Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 4 Table Index ............................................................................................................................................... 7 Figure Index .............................................................................................................................................. 9 1 Introduction ..................................................................................................................................... 11 Safety Information ................................................................................................................. 12 1.1. 1.2. FCC/ISED Regulatory notices ............................................................................................... 13 2 Product Concept ............................................................................................................................. 16 2.1. General Description .............................................................................................................. 16 Key Features ......................................................................................................................... 17 2.2. 2.3. Functional Diagram ............................................................................................................... 19 Evaluation Board ................................................................................................................... 20 2.4. 3.6. 3 Application Interfaces ..................................................................................................................... 21 3.1. General Description .............................................................................................................. 21 Pin Assignment ..................................................................................................................... 22 3.2. 3.3. Pin Description ...................................................................................................................... 23 3.4. Operating Modes .................................................................................................................. 30 3.5. Power Saving ........................................................................................................................ 31 3.5.1. Sleep Mode.................................................................................................................. 31 3.5.1.1. UART Application ............................................................................................... 31 3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 32 3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 32 3.5.1.4. USB Application without USB Suspend Function ............................................... 33 3.5.2. Airplane Mode .............................................................................................................. 34 Power Supply ........................................................................................................................ 34 3.6.1. Power Supply Pins ....................................................................................................... 34 3.6.2. Decrease Voltage Drop ................................................................................................ 35 3.6.3. Reference Design for Power Supply ............................................................................ 36 3.6.4. Monitor the Power Supply ............................................................................................ 37 Power-on/off Scenarios ......................................................................................................... 37 Turn on Module Using the PWRKEY ........................................................................... 37 Turn off Module ............................................................................................................ 39 Turn off Module Using the PWRKEY Pin ........................................................... 39 3.7.2.1. 3.7.2.2. Turn off Module Using AT Command ................................................................. 39 Reset the Module .................................................................................................................. 40 3.8.
(U)SIM Interfaces .................................................................................................................. 41 3.9. 3.10. USB Interface ........................................................................................................................ 44 3.11. UART Interfaces ................................................................................................................... 46 3.7.1. 3.7.2. 3.7. EG91_Hardware_Design 4 / 93 LTE Module Series EG91 Hardware Design 3.12. PCM and I2C Interfaces ........................................................................................................ 48 3.13. SPI Interface ......................................................................................................................... 51 3.14. Network Status Indication ..................................................................................................... 51 3.15. STATUS ................................................................................................................................ 52 3.16. ADC Interface ....................................................................................................................... 53 3.17. Behaviors of RI ..................................................................................................................... 54 3.18. USB_BOOT Interface............................................................................................................ 55 4 GNSS Receiver ................................................................................................................................ 57 4.1. General Description .............................................................................................................. 57 4.2. GNSS Performance .............................................................................................................. 57 Layout Guidelines ................................................................................................................. 58 4.3. 5 Antenna Interfaces .......................................................................................................................... 59 5.1. Main/Rx-diversityAntenna Interfaces..................................................................................... 59 5.1.1. Pin Definition ................................................................................................................ 59 5.1.2. Operating Frequency ................................................................................................... 59 5.1.3. Reference Design of RF Antenna Interface ................................................................. 60 5.1.4. Reference Design of RF Layout ................................................................................... 61 5.2. GNSS Antenna Interface ....................................................................................................... 63 5.3. Antenna Installation .............................................................................................................. 64 5.3.1. Antenna Requirement .................................................................................................. 64 5.3.2. Recommended RF Connector for Antenna Installation ................................................ 65 6 Electrical, Reliability and RadioCharacteristics ........................................................................... 67 Absolute Maximum Ratings .................................................................................................. 67 6.1. 6.2. Power Supply Ratings ........................................................................................................... 67 6.3. Operation and Storage Temperatures .................................................................................. 68 Current Consumption ............................................................................................................ 69 6.4. RF Output Power .................................................................................................................. 76 6.5. 6.6. RF Receiving Sensitivity ....................................................................................................... 77 Electrostatic Discharge ......................................................................................................... 79 6.7. 6.8. Thermal Consideration .......................................................................................................... 79 7 Mechanical Dimensions.................................................................................................................. 82 7.1. Mechanical Dimensions of the Module.................................................................................. 82 Recommended Footprint ....................................................................................................... 84 7.2. 7.3. Design Effect Drawings of the Module .................................................................................. 85 8 Storage, Manufacturing and Packaging ........................................................................................ 86 8.1. Storage ................................................................................................................................. 86 8.2. Manufacturing and Soldering ................................................................................................ 87 Packaging ............................................................................................................................. 88 8.3. 9 Appendix A References .................................................................................................................. 90 10 Appendix B GPRS Coding Schemes ............................................................................................. 94 EG91_Hardware_Design 5 / 93 LTE Module Series EG91 Hardware Design 11 Appendix C GPRS Multi-slot Classes ............................................................................................ 95 12 Appendix D EDGE Modulation and Coding Schemes .................................................................. 97 EG91_Hardware_Design 6 / 93 LTE Module Series EG91 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EG91 SERIES MODULE ....................................................................... 16 TABLE 2: KEY FEATURES OF EG91 MODULE ............................................................................................... 17 TABLE 3: IO PARAMETERS DEFINITION ........................................................................................................ 23 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 23 TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 30 TABLE 6: PIN DEFINITION OF VBAT AND GND ............................................................................................. 35 TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 37 TABLE 8: PIN DEFINITION OF RESET_N ....................................................................................................... 40 TABLE 9: PIN DEFINITION OF (U)SIM INTERFACES ..................................................................................... 42 TABLE 10: PIN DEFINITION OF USB INTERFACE ......................................................................................... 44 TABLE 11: PIN DEFINITION OF MAIN UART INTERFACES ........................................................................... 46 TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE ......................................................................... 46 TABLE 13: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 47 TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 50 TABLE 15: PIN DEFINITION OF SPI INTERFACE ........................................................................................... 51 TABLE 16: PIN DEFINITION OF NETWORK STATUS INDICATOR ................................................................ 52 TABLE 17: WORKING STATE OF NETWORK STATUS INDICATOR .............................................................. 52 TABLE 18: PIN DEFINITION OF STATUS ........................................................................................................ 53 TABLE 19: PIN DEFINITION OF ADC INTERFACE ......................................................................................... 53 TABLE 20: CHARACTERISTICS OF ADC INTERFACE ................................................................................... 54 TABLE 21: DEFAULT BEHAVIORS OF RI ........................................................................................................ 54 TABLE 22: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 55 TABLE 23: GNSS PERFORMANCE ................................................................................................................. 57 TABLE 24: PIN DEFINITION OF RF ANTENNA ............................................................................................... 59 TABLE 25: MODULE OPERATING FREQUENCIES ........................................................................................ 59 TABLE 26: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 63 TABLE 27: GNSS FREQUENCY ....................................................................................................................... 63 TABLE 28: ANTENNA REQUIREMENTS .......................................................................................................... 64 TABLE 29: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 67 TABLE 30: POWER SUPPLY RATINGS ........................................................................................................... 67 TABLE 31: OPERATION AND STORAGE TEMPERATURES .......................................................................... 68 TABLE 32: EG91-E CURRENT CONSUMPTION ............................................................................................. 69 TABLE 33: EG91-NA CURRENT CONSUMPTION ........................................................................................... 71 TABLE 34: EG91-NS CURRENT CONSUMPTION .......................................................................................... 72 TABLE 35: EG91-V CURRENT CONSUMPTION ............................................................................................. 73 TABLE 36: EG91-EC CURRENT CONSUMPTION .......................................................................................... 74 TABLE 37: GNSS CURRENT CONSUMPTION OF EG91 ............................................................................... 76 TABLE 38: RF OUTPUT POWER ..................................................................................................................... 76 TABLE 39: EG91-E CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 77 TABLE 40: EG91-NA CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 77 TABLE 41: EG91-NS CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 78 TABLE 42: EG91-V CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 78 EG91_Hardware_Design 7 / 93 LTE Module Series EG91 Hardware Design TABLE 43: EG91-EC CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 78 TABLE 44: ELECTROSTATIC DISCHARGE CHARACTERISTICS ................................................................. 79 TABLE 45: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................... 87 TABLE 46: RELATED DOCUMENTS ................................................................................................................ 90 TABLE 47: TERMS AND ABBREVIATIONS ...................................................................................................... 90 TABLE 48: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 94 TABLE 49: GPRS MULTI-SLOT CLASSES ...................................................................................................... 95 TABLE 50: EDGE MODULATION AND CODING SCHEMES ........................................................................... 97 EG91_Hardware_Design 8 / 93 LTE Module Series EG91 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 20 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 22 FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 31 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 32 FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 33 FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 34 FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 35 FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ............................................................................ 36 FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 36 FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................. 37 FIGURE 11: TURN ON THE MODULE USING BUTTON ................................................................................. 38 FIGURE 12: POWER-ON SCENARIO .............................................................................................................. 38 FIGURE 13: POWER-OFF SCENARIO ............................................................................................................ 39 FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 40 FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 41 FIGURE 16: RESET SCENARIO ...................................................................................................................... 41 FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 43 FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR . 43 FIGURE 19: REFERENCE CIRCUIT OF USB INTERFACE ............................................................................ 45 FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 47 FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 48 FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 49 FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 49 FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 50 FIGURE 25: REFERENCE CIRCUIT OF SPI INTERFACE WITH PERIPHERALS ......................................... 51 FIGURE 26: REFERENCE CIRCUIT OF NETWORK STATUS INDICATOR ................................................... 52 FIGURE 27: REFERENCE CIRCUIT OF STATUS ........................................................................................... 53 FIGURE 28: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 55 FIGURE 29: TIMING SEQUENCE FOR ENTERING INTO EMERGENCY DOWNLOAD MODE .................... 56 FIGURE 30: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 61 FIGURE 31: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 62 FIGURE 32: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB ........................................................... 62 FIGURE 33: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)
................................................................................................................................................................... 62 FIGURE 34: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)
................................................................................................................................................................... 62 FIGURE 35: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 64 FIGURE 36: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 65 FIGURE 37: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 66 FIGURE 38: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 66 EG91_Hardware_Design 9 / 93 LTE Module Series EG91 Hardware Design FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 80 FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS PCB)
................................................................................................................................................................... 81 FIGURE 41: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 82 FIGURE 42: MODULE BOTTOM DIMENSIONS (TOP VIEW) ......................................................................... 83 FIGURE 43: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 84 FIGURE 44: TOP VIEW OF THE MODULE ...................................................................................................... 85 FIGURE 45: BOTTOM VIEW OF THE MODULE .............................................................................................. 85 FIGURE 46: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 87 FIGURE 47: TAPE DIMENSIONS ..................................................................................................................... 88 FIGURE 48: REEL DIMENSIONS ..................................................................................................................... 89 FIGURE 49: TAPE AND REEL DIRECTIONS ................................................................................................... 89 EG91_Hardware_Design 10 / 93 LTE Module Series EG91 Hardware Design 1 Introduction This document defines the EG91module and describes its air interface and hardware interface which are connected with customers applications. This document can help customers quickly understand module interface specifications, electrical andmechanical details, as well as other related information of EG91 module. Associated with application note and user guide, customers can use EG91 module to design and set up mobile applications easily. EG91_Hardware_Design 11 / 93 LTE Module Series EG91 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EG91module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals,clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. EG91_Hardware_Design 12 / 93 LTE Module Series EG91 Hardware Design 1.2. FCC/ISED Regulatory notices Modification statement Quectel has not approved any changes or modifications to this device by the user. Any changes or modifications could void the users authority to operate the equipment. Quectel napprouve aucune modification apporte lappareil par lutilisateur, quelle quen soit la nature. Tout changement ou modification peuvent annuler le droit dutilisation de lappareil par lutilisateur. Interference statement This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. RF exposure This equipment complies with FCC and ISED radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna gain must be below:
Antenna Gain WCDAM II:9.000dBi WCDAM V:6.000dBi WCDAM VIII:10.416dBi LTE Band2:8.500dBi LTE Band4:5.500dBi LTE Band5:9.916dBi LTE Band12:9.234dBi LTE Band13:9.673dBi L TE Band25:8.500dBi L TE Band25:9.837dBi This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093. If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. Cet appareil est conforme aux limites d'exposition aux rayonnements de lISED pour un environnement non contrl. L'antenne doit tre install de faon garder une distance minimale de 20 centimtres entre la source de rayonnements et votre corps. Gain de l'antenne doit tre ci-dessous:
Gain de lantenne EG91_Hardware_Design 13 / 93 LTE Module Series EG91 Hardware Design WCDAM II:9.00dBi WCDAM V:6.00dBi WCDAM VIII:7.15dBi LTE Band2:8.50dBi LTE Band4:5.50dBi LTE Band5:6.64dBi LTE Band12:6.15dBi LTE Band13:6.44dBi L TE Band25:8.50dBi L TE Band25:6.63dBi L'metteur ne doit pas tre colocalis ni fonctionner conjointement avec autre antenne ou autre metteur. FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Labelling Requirements for the Host device The host device shall be properly labelled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the FCC ID and ISED of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows:
Contains FCC IDXMR201903EG91NS Contains IC: 10224A-20193EG91NS The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID and ISED. L'appareil hte doit tre tiquet comme il faut pour permettre l'identification des modules qui s'y trouvent. L'tiquette de certification du module donn doit tre pose sur l'appareil hte un endroit bien en vue en tout temps. En l'absence d'tiquette, l'appareil hte doit porter une tiquette donnant le FCC ID et lISED du module, prcd des mots Contient un module d'mission , du mot Contient ou d'une formulation similaire exprimant le mme sens, comme suit :
Contient FCC IDXMR201903EG91NS Contient IC: 10224A-20193EG91NS Le manuel d'utilisation OEM de l'hte doit galement contenir des instructions claires sur la manire dont les utilisateurs finaux peuvent trouver et / ou accder au module et l'ID FCC et lISED. EG91_Hardware_Design 14 / 93 LTE Module Series EG91 Hardware Design CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numrique de classe B est conforme la norme canadienne ICES-003. Installation Guidance The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. EG91_Hardware_Design 15 / 93 LTE Module Series EG91 Hardware Design 2 Product Concept 2.1. General Description is an embedded 4G wireless communication module with receive diversity. EG91module It supportsLTE-FDD/WCDMA/GSM wireless communication, andprovides data connectivity on LTE-FDD,DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA,EDGE andGPRSnetworks. It can also provide voice functionality1)to meet customers specific application demands. The following table shows the frequency bands of EG91series module. Table 1: Frequency Bands of EG91Series Module Module EG91-E LTE Bands
(with Rx-diversity) FDD:
B1/B3/B7/B8/B20/B28A WCDMA
(with Rx-diversity) GSM GNSS2) B1/B8 900/1800MHz Not supported EG91-NA FDD: B2/B4/B5/B12/B13 B2/B4/B5 Not supported EG91-NS FDD:
B2/B4/B5/B12/B13/B25/
B26 B2/B4/B5 Not supported EG91-V FDD: B4/B13 Not supported Not supported FDD:
B1/B3/B7/B8/B20/B28 B1/B8 900/1800MHz EG91-EC NOTES GPS, GLONASS, BeiDou/Compass,G alileo, QZSS GPS, GLONASS, BeiDou/Compass, Galileo, QZSS GPS, GLONASS, BeiDou/Compass, Galileo, QZSS GPS, GLONASS, BeiDou/Compass, Galileo, QZSS 1) EG91contains Telematicsversion and Data-only version. Telematics version supports voice and datafunctions, while Data-only version only supports data function. 2) GNSS function is optional. 1. 2. EG91_Hardware_Design 16 / 93 LTE Module Series EG91 Hardware Design With a compact profile of 29.0mm 25.0mm 2.3mm, EG91 can meet almost all requirements for M2M applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EG91 is an SMD type module which can be embedded into applications through its 106 LGA pads. EG91 is integrated with internet service protocols like TCP, UDP and PPP. Extended AT commands have been developed for customers to use these internet service protocols easily. 2.2. Key Features The following table describes the detailed features of EG91 module. Table 2: Key Features of EG91 Module Feature Details Power Supply Transmitting Power LTE Features UMTS Features GSMFeatures Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V Class 4 (33dBm2dB) for EGSM900 Class 1 (30dBm2dB) for DCS1800 Class E2 (27dBm3dB) for EGSM900 8-PSK Class E2 (26dBm3dB) for DCS1800 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm2dB) for LTE-FDD bands Support up to non-CA Cat 1 FDD Support 1.4MHz~20MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max 10Mbps (DL), Max 5Mbps (UL) Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL), Max 384Kbps (UL) R99:
CSD: 9.6kbps GPRS:
Support GPRS multi-slot class 33(33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL), Max 85.6Kbps (UL) EDGE:
EG91_Hardware_Design 17 / 93 LTE Module Series EG91 Hardware Design Support EDGE multi-slot class 33(33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL)/Max 236.8Kbps (UL) SupportTCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/NITZ/CMUX*/HTTPS*/
SMTP*/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connections Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default Internet Protocol Features SMS
(U)SIMInterfaces Support 1.8V and 3.0V (U)SIM cards Audio Features PCM Interface USB Interface UART Interface Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave mode, but must be the master in long frame synchronization Compliant with USB 2.0 specification (slave only);the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission,GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB*
Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE 5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x/8.x, etc. Main UART:
Used for AT command communication and data transmission Baud rates reach up to 921600bps, 115200bps by default Support RTS and CTS hardware flow control Debug UART:
Used for Linux console and log output 115200bps baud rate Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features Gen8C Lite of Qualcomm EG91_Hardware_Design 18 / 93 LTE Module Series EG91 Hardware Design Protocol: NMEA 0183 AT Commands Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Network Indication NETLIGHTpin for network activitystatusindication Antenna Interfaces Physical Characteristics Temperature Range Including main antenna interface (ANT_MAIN), Rx-diversity antenna
(ANT_DIV) interface and GNSS antenna interface(ANT_GNSS)1) Size: (29.00.15)mm (25.00.15)mm (2.30.2)mm Package: LGA Weight: approx. 3.8g Operation temperature range: -35C ~ +75C 2) Extended temperature range: -40C ~ +85C 3) Storage temperature range: -40C ~ +90C Firmware Upgrade USB interface orDFOTA*
All hardware components are fully compliant with EU RoHS directive RoHS NOTES 1)GNSS antenna interface is only supported on EG91-NA/-NS/-V/-EC. 2) Within operationtemperature range, the module is 3GPP compliant. 3) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operationtemperature levels, the module will meet 3GPP specificationsagain.
* means under development. 1. 2. 3. 4. 2.3. Functional Diagram The following figure shows a block diagram of EG91 and illustrates the major functional parts. Power management Baseband DDR+NAND flash Radio frequency Peripheral interfaces EG91_Hardware_Design 19 / 93 LTE Module Series EG91 Hardware Design VBAT_RF VBAT_BB PWRKEY RESET_N STATUS ANT_MAIN ANT_GNSS 1) ANT_DIV PAM SAW Switch Duplexer LNA PA Tx PRx SAW DRx SAW GPS Transceiver NAND DDR2 SDRAM IQ Control Baseband PMIC Control 19.2M XO VDD_EXT USB
(U)SIM1
(U)SIM2 PCM I2C SPI UART GPIOs Figure 1: Functional Diagram NOTE 1) GNSS antenna interface is only supported on EG91-NA/-NS/-V/-EC. 2.4. Evaluation Board Quectel provides a complete set of evaluation tools to facilitate the use and testing ofEG91 module. The evaluation tool kit includes the evaluation board (UMTS<E EVB), USB data cable, earphone, antenna and other peripherals. EG91_Hardware_Design 20 / 93 LTE Module Series EG91 Hardware Design 3 Application Interfaces 3.1. General Description
(U)SIMinterfaces EG91is equipped with 62-pin 1.1mm pitch SMT pads plus 44-pin ground/reserved pads that can be connected to customers cellular application platforms. Sub-interfaces included in these pads are described in detail in the following chapters:
Power supply USB interface UART interfaces PCMand I2C interfaces SPI interface Statusindication USB_BOOT interface EG91_Hardware_Design 21 / 93 LTE Module Series EG91 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EG91 module. A N T _ D V I
(
R E S E R V E D E G 9 1
-
N A
/
-
N S
/
-
V
/
-
E C
(
i P n 4 9 o n E G 9 1
-
E
)
) V B A T _ R F V B A T _ R F G N D G N D N C G N D A N T _ M A N I G N D G N D G N D G N D N C 103 6 2 6 1 6 0 5 9 5 8 5 7 5 6 5 5 5 4 5 3 5 2 5 1 5 0 106 NC NC GND PCM_CLK PCM_SYNC PCM_DIN PCM_DOUT USB_VBUS USB_DP USB_DM NC NC NC NC PWRKEY 1) NC RESET_N RESERVED 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 63 64 65 66 67 68 82 81 80 102 101 100 79 99 83 USIM2_PRESENCE 84 USIM2_CLK 85 USIM2_RST 86 USIM2_DATA 87 USIM2_VDD 88 89 69 90 70 91 71 92 72 98 97 96 95 94 93 78 77 76 75 74 73 9 1 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 2 0 3 1 3 104 S U T A T S Y D A E R _ P A 0 C D A I T H G L T E N D X R _ G B D D X T _ G B D K L C _ P S I D E V R E S E R I S O M _ P S I I O S M _ P S I R T D D N G T X E _ D D V 49 48 47 46 45 44 43 42 41 40 USB_BOOT ANT_GNSS (EG91-NA/-NS/-V/-EC) ANT_DIV (EG91-E) GND USIM_GND USIM1_CLK USIM1_DATA USIM1_RST USIM1_VDD USIM1_PRESENCE I2C_SDA I2C_SCL RI DCD RTS CTS TXD RXD VBAT_BB VBAT_BB 39 38 37 36 35 34 33 32 105 POWER USB UART
(U)SIM PCM SPI ANT GND NC RESERVED OTHERS Figure 2:Pin Assignment (Top View) EG91_Hardware_Design 22 / 93 LTE Module Series EG91 Hardware Design NOTES 1)PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. 1. 2. Keep all RESERVEDpins and unused pins unconnected. 3. GND pads should be connected to ground in the design. 4. Definition of pin 49 and 56 are different amongEG91-E/-NS/-V/-EC and EG91-NA.For more details, please refer to Table 4. 3.3. Pin Description The following tables show the pin definition and description of EG91. Table 3: IO Parameters Definition Type AI AO DI DO IO OD PI PO Description Analog input Analog output Digital input Digital output Bidirectional Open drain Power input Power output Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description VBAT_BB 32, 33 PI Power supply for modules baseband part DC Characteristics Vmax=4.3V Vmin=3.3V Vnorm=3.8V Comment It must be able to provide sufficient current up to 0.8A. EG91_Hardware_Design 23 / 93 LTE Module Series EG91 Hardware Design VBAT_RF 52, 53 PI Power supply for modules RF part Vmax=4.3V Vmin=3.3V Vnorm=3.8V VDD_EXT 29 PO Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA It must be able to provide sufficient current up to 1.8A in a burst transmission. Power supply for external GPIOs pull up circuits. If unused, keep it open. 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67~74, 79~82, 89~91, 100~106 GND Turn-on/off Ground Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 15 DI Turn on/off the module RESET_N 17 DI Reset signal of the module Status Indication VIHmax=2.1V VIHmin=1.3V VILmax=0.5V VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. Pull-up to 1.8V internally. Activelow. If unused,keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 20 DO NETLIGHT 21 DO USB Interface Indicate the modules operating status Indicate the modules network activity status VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 8 PI USB connection detection Vmax=5.25V Vmin=3.0V Vnorm=5.0V Typical:5.0V If unused,keep it open. EG91_Hardware_Design 24 / 93 LTE Module Series EG91 Hardware Design IO IO USB differential data bus (+) USB differential data bus (-) Compliant with USB 2.0 standard specification. Compliant with USB 2.0 standard specification. Require differential impedance of 90. Require differential impedance of 90. USB_DP 9 USB_DM 10
(U)SIM Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment USIM_GND 47 Specified for (U)SIM card ground USIM1_VDD 43 PO Power supply for
(U)SIMcard USIM1_DATA 45 IO Data signal of
(U)SIMcard USIM1_CLK 46 DO Clock signal of
(U)SIMcard For 1.8V (U)SIM:
Vmax=1.9V Vmin=1.7V For 3.0V (U)SIM:
Vmax=3.05V Vmin=2.7V IOmax=50mA For 1.8V (U)SIM:
VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:
VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
VOLmax=0.45V VOHmin=2.55V Connect to ground of
(U)SIM card connector. Either 1.8V or 3.0V is supported by the module automatically. EG91_Hardware_Design 25 / 93 LTE Module Series EG91 Hardware Design For 1.8V (U)SIM:
VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
VOLmax=0.45V VOHmin=2.55V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V For 1.8V (U)SIM:
Vmax=1.9V Vmin=1.7V For 3.0V (U)SIM:
Vmax=3.05V Vmin=2.7V IOmax=50mA For 1.8V (U)SIM:
VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:
VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:
VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
VOLmax=0.45V USIM1_RST 44 DO Reset signal of
(U)SIMcard USIM1_ PRESENCE 42 DI
(U)SIMcard insertion detection USIM2_VDD 87 PO Power supply for
(U)SIMcard USIM2_DATA 86 IO Data signal of
(U)SIMcard USIM2_CLK 84 DO Clock signal of
(U)SIMcard USIM2_RST 85 DO Reset signal of
(U)SIMcard EG91_Hardware_Design 26 / 93 1.8V power domain. If unused, keep it open. Either 1.8V or 3.0V is supported by the module automatically. LTE Module Series EG91 Hardware Design VOHmin=2.55V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. USIM2_ PRESENCE 83 DI
(U)SIMcard insertion detection Main UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment RI DCD CTS 39 38 36 DO Ring indicator DO Data carrier detection DO Clear to send RTS 37 DI Request to send DTR 30 DI Data terminal ready. Sleep mode control. TXD 35 DO Transmit data RXD 34 DI Receive data Debug UART Interface VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Pull-up by default. Low level wakes up the module. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD 23 DO Transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it EG91_Hardware_Design 27 / 93 LTE Module Series EG91 Hardware Design DBG_RXD 22 DI Receive data PCM Interface VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment PCM_DIN 6 DI PCM data input PCM_ DOUT 7 DO PCM data output PCM_SYNC 5 IO PCM data frame synchronization signal PCM_CLK 4 IO PCM clock VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SCL 40 OD I2C_SDA 41 OD I2C serial clock. Used for external codec I2C serial data. Used for external codec EG91_Hardware_Design 28 / 93 An external pull-up resistor is required. 1.8V only. If unused, keep it open. An external pull-up resistor is required. 1.8V only. If unused, keep it open. LTE Module Series EG91 Hardware Design ADC Interface Pin Name Pin No. I/O Description DC Characteristics Comment ADC0 24 AI SPI Interface General purpose analog to digital converter Voltage range:
0.3V to VBAT_BB If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment SPI_CLK 26 DO SPI_MOSI 27 DO SPI_MISO 28 DI RF Interfaces Clock signal of SPI interface VOLmax=0.45V VOHmin=1.35V Master output slave input of SPI interface Master input slave output of SPI interface VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment AI GNSS antenna pad ANT_GNSS ANT_DIV 49
(EG91-N A/-NS/
-V/-EC) 49
(EG91-E
) 56
(EG91-
NA/-NS/
-V/-EC) AI Receive diversity antenna pad ANT_MAIN 60 IO Main antenna pad Other Pins 50 impedance. If unused, keep it open. The pin is defined as ANT_DIV on EG91-E. 50 impedance. If unused, keep it open. The pin is reserved on EG91-E. 50 impedance. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment EG91_Hardware_Design 29 / 93 LTE Module Series EG91 Hardware Design AP_READY 19 DI USB_BOOT 75 DI RESERVED Pins Application processor sleep state detection Force the module to enter into emergency download mode VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. It is recommended to reserve the test points. Pin Name Pin No. I/O Description DC Characteristics Comment NC 1,2, 11~14, 16, 51, 57, 63~66, 76~78, 88, 92~99 RESERVED 18, 25, 49 NC Reserved NOTE Keep all RESERVED pins and unused pins unconnected. Keep these pins unconnected. Keep these pins unconnected. Pin 49 is only reserved on EG91-E. 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Details Normal Operation Idle Talk/Data Software is active. The module hasregistered on network, and it is ready to send and receive data. Network connection is ongoing. In this mode, the power consumption is decided by network settingand data transfer rate. Minimum Functionality AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. EG91_Hardware_Design 30 / 93 LTE Module Series EG91 Hardware Design AT+CFUN command or W_DISABLE# pin can set the module to enter intoairplane mode. In this case, RF function will be invalid. In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. In this mode, the power management unit shuts down the power supply. Software is not active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. Mode Airplane Mode Sleep Mode Power Down Mode 3.5. Power Saving 3.5.1. Sleep Mode EG91 is able to reduce its current consumption to a minimum value during the sleep mode. The following sub-chaptersdescribe the power saving procedures of EG91 module. 3.5.1.1. UART Application If the host communicates with the module via UART interface, the following preconditions can let the module enter into sleep mode. Execute AT+QSCLK=1commandto enable sleep mode. Drive DTR to high level. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module. EG91_Hardware_Design 31 / 93 LTE Module Series EG91 Hardware Design When EG91 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.17for details about RI behavior. AP_READY will detect the sleep state of host (can be configured to high level or low level detection). Please refer to AT+QCFG="apready"*commandfor details. NOTE
* means under development. 3.5.1.2. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to let the module enter into sleep mode. Execute AT+QSCLK=1commandto enable sleep mode. Ensure the DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters into suspend state. The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application with USB Remote Wakeup Sending data to EG91through USB will wake up the module. When EG91has a URC to report, the module will send remote wakeup signals via USB busso as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wakeup function, the RI signal is needed to wake up the host. There are threepreconditions to let the module enter into the sleep mode. EG91_Hardware_Design 32 / 93 LTE Module Series EG91 Hardware Design Execute AT+QSCLK=1commandto enable sleep mode. Ensure the DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters into suspended state. The following figure shows the connection between the module and the host. Figure 5: Sleep Mode Application with RI Sending data to EG91through USB will wake up the module. When EG91has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected with an externalcontrol circuit to let the module enter into sleep mode. Execute AT+QSCLK=1commandto enable sleep mode. Ensure the DTR is held at high level or keep it open. Disconnect USB_VBUS. The following figure shows the connection between the module and the host. Power Switch Module USB_VBUS USB_DP USB_DM RI AP_READY GND Host GPIO VDD USB_DP USB_DM EINT GPIO GND EG91_Hardware_Design 33 / 93 LTE Module Series EG91 Hardware Design Figure 6: Sleep Mode Application without Suspend Function Switching onthe power switch tosupply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and the host.Please refer to document [1] for more details about EG91 power management application. 3.5.2. Airplane Mode When the module enters into airplane mode, the RF function does not work, and all AT commands correlative with RF function will be inaccessible. This mode can be set viathe following ways. Hardware:
The W_DISABLE# pin is pulled up by default.Driving it to low level will let the module enter into airplane mode. Software:
AT+CFUN command provides the choice of the functionality level through setting <fun> into 0, 1 or 4. AT+CFUN=0: Minimum functionality mode.Both (U)SIM and RF functions are disabled. AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode. RF function is disabled. NOTES 1. Airplane mode control via W_DISABLE# is disabled in firmware by default. It can be enabled by AT+QCFG="airplanecontrol" command and this command is under development. 2. The execution of AT+CFUN command will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EG91 provides four VBAT pins dedicated to connectwithanexternal power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for modulesRF part. Two VBAT_BB pins for modules baseband part. EG91_Hardware_Design 34 / 93 LTE Module Series EG91 Hardware Design The following table shows the details of VBAT pins and ground pins. Table 6: Pin Definition of VBAT and GND Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 52,53 VBAT_BB 32,33 Power supply for modules RF part. Power supply for modules baseband part. 3.3 3.3 3.8 3.8 4.3 4.3 3, 31, 48,50, 54, 55,58, 59, 61,62, 67~74, 79~82,89~91, 100~106 GND Ground
-
0
-
V V V 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3Vto4.3V. Please make sure thatthe input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network.The voltage drop will be less in 3G and 4G networks. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100F with low ESR(ESR=0.7) should be used, and amulti-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to usethree ceramic capacitors (100nF, 33pF, 10pF)for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm, andthe width of VBAT_RF trace should be no less than 2mm.In principle, the longerthe VBAT trace is, the wider it will be. In addition, in order to avoid the damage caused by electric surge and ESD, it is suggested that a TVS EG91_Hardware_Design 35 / 93 LTE Module Series EG91 Hardware Design diode with low reverse stand-off voltage VRWM, low clamping voltage VC and high reverse peak pulse current IPP should be used. The following figure shows the star structure of the power supply. VBAT D1 WS4.5D3HV
+
C1 100uF C2 100nF C3 33pF C4 10pF
+
C5 100uF C6 100nF C7 33pF C8 10pF VBAT_RF VBAT_BB Module Figure 8: Star Structure of the Power Supply 3.6.3. Reference Design for Power Supply Power design for the module is very important, asthe performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be usedto supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5V input power source. The typicaloutput ofthe power supply is about 3.8V and the maximum load current is 3A. Figure 9: Reference Circuit of Power Supply EG91_Hardware_Design 36 / 93 LTE Module Series EG91 Hardware Design 3.6.4. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. 3.7. Power-on/off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definitionof PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name Pin No. Description DC Characteristics Comment PWRKEY 15 Turn on/off the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When EG91 is in powerdown mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms. It is recommended to use an open drain/collector driver to control the PWRKEY.After STATUS pin outputting a high level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. Figure 10: Turn on the Module Using Driving Circuit Another way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from the finger. Therefore, aTVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shownin the following figure. EG91_Hardware_Design 37 / 93 LTE Module Series EG91 Hardware Design Figure 11: Turn on the Module Using Button The power-on scenario is illustrated in the following figure. VBAT PWRKEY VDD_EXT BOOT_CONFIG &
USB_BOOT Pins RESET_N STATUS
(DO) UART USB NOTE VH =0.8V 500ms VIL0.5V About 100ms 100ms, after this time, the BOOT_CONFIG &
USB_BOOT pins can be set high level by external circuit. 2.5s 12s 13s I nactive I nactive Figure 12: Power-on Scenario Active Active EG91_Hardware_Design 38 / 93 LTE Module Series EG91 Hardware Design NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. 2. PWRKEY can be pulled down directly to GND with a recommended 10K resistor if module needs to be powered on automatically and shutdown is not needed. 3.7.2. Turn off Module Either of the following methodscan be used to turn off the module:
Normal power-offprocedure: Turn off the module using the PWRKEY pin. Normal power-off procedure: Turn off the module using AT+QPOWDcommand. 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-off procedure after the PWRKEY is released. The power-off scenario is illustrated inthe following figure. Figure 13: Power-off Scenario 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWDcommandto turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer todocument [2] for details about the AT+QPOWDcommand. EG91_Hardware_Design 39 / 93 LTE Module Series EG91 Hardware Design NOTES 1. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off. 2. When turning off module with AT command, please keep PWRKEY at high level after the execution of power-off command. Otherwise the module will be turned on again after successful turn-off. 3.8. Reset the Module The RESET_N pin can be used to reset the module.The module can be reset by driving RESET_N to a low level voltage for 150ms~460ms. Table 8: Pin Definition of RESET_N Pin Name Pin No. Description DC Characteristics Comment RESET_N 17 Reset the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 14: Reference Circuit of RESET_N by Using Driving Circuit EG91_Hardware_Design 40 / 93 LTE Module Series EG91 Hardware Design Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated inthe following figure. Figure 16: Reset Scenario NOTES 1. Use RESET_N only when turning off the module by AT+QPOWDcommand and PWRKEY pin failed. 2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interfaces EG91provides two (U)SIMinterfaces, and only one (U)SIMcard can work at a time. The (U)SIM1 and
(U)SIM2cards can be switched by AT+QDSIM* command. For more details, please refer to document
[2]. The(U)SIM interfacescircuitrymeet ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIMcards are supported. EG91_Hardware_Design 41 / 93 LTE Module Series EG91 Hardware Design Table 9: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM1_VDD 43 PO Power supply for (U)SIM1 card Either 1.8V or 3.0V is supported by the module automatically. USIM1_DATA 45 USIM1_CLK USIM1_RST USIM1_ PRESENCE USIM_GND 46 44 42 47 IO DO DO DI Data signal of (U)SIM1 card Clock signal of (U)SIM1card Reset signal of (U)SIM1 card
(U)SIM1 card insertion detection Specified ground for (U)SIMcard USIM2_VDD 87 PO Power supply for (U)SIM2 card Either 1.8V or 3.0V is supported by the module automatically. USIM2_DATA 86 USIM2_CLK USIM2_RST USIM2_ PRESENCE 84 85 83 IO DO DO DI Data signal of (U)SIM2 card Clock signal of (U)SIM2 card Reset signal of (U)SIM2 card
(U)SIM2 card insertion detection EG91 supports (U)SIMcard hot-plug via USIM_PRESENCE(USIM1_PRESENCE/USIM2_PRESENCE) pin. The functionsupports low level and high level detection, andis disabled by default. Pleaserefer to document [2] about AT+QSIMDETcommand for details. The following figure shows a reference design for (U)SIM interface with an8-pin (U)SIMcard connector. EG91_Hardware_Design 42 / 93 LTE Module Series EG91 Hardware Design Figure 17: Reference Circuitof (U)SIMInterface with an 8-Pin (U)SIMCard Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. Areference circuit of (U)SIM interface with a 6-pin (U)SIMcard connector is illustrated inthe following figure. Figure 18: Reference Circuitof (U)SIM Interface with a 6-Pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM cardin customers applications, please follow the criteria below in the (U)SIMcircuit design:
Keep placementof (U)SIMcard connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIMcard signals away from RF and VBAT traces. EG91_Hardware_Design 43 / 93 LTE Module Series EG91 Hardware Design Assure the ground trace between the module and the (U)SIMcard connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential. Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as close to (U)SIM card connector as possible.If the ground is complete on customers PCB, USIM_GND can be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away fromeach other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVSdiode array whose parasitic capacitance should not be more than15pF. The 0resistors should be added in series between the module and the (U)SIMcard to facilitate debugging. The 33pFcapacitors are used for filtering interference of EGSM900.Please note that the (U)SIMperipheral circuit should be close to the
(U)SIMcard connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion areapplied, and should be placed close to the (U)SIMcard connector. NOTE
* means under development. 3.10. USB Interface EG91 contains one integrated Universal Serial Bus (USB) interfacewhich complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface is used for AT command communication, data transmission, GNSS NMEA sentences output,software debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB interface. Table 10: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment Require differential impedance of 90. Require differential impedance of 90. USB_DP USB_DM USB_VBUS GND 9 10 8 3 IO IO PI USB differential data bus (+) USB differential data bus (-) USB connection detection Typical:5.0V Ground For more details about USB 2.0 specifications, please visit http://www.usb.org/home. EG91_Hardware_Design 44 / 93 LTE Module Series EG91 Hardware Design The USB interface is recommended to be reserved for firmware upgrade in customers design. The following figure shows areference circuit of USB interface. Figure 19: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customersMCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should beadded in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 componentsmust be placed close to the module, and also these resistors should be placed close to each other. Theextra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding onnot only upper and lower layers but also right and left sides. Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2pF. Keep the ESD protection components to the USB connector as close as possible. NOTES 1. EG91 module can only be used as a slave device. 2. * means under development. EG91_Hardware_Design 45 / 93 LTE Module Series EG91 Hardware Design 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and thedebug UART interface. The following shows their features. The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps, 921600bps and 3000000bps baud rates, and the default is 115200bps. It supports RTS and CTS hardware flow control, and is used for AT command communication only. The debug UART interface supports 115200bpsbaud rate. It is used forLinux console and log output. The following tables show the pin definition of the two UART interfaces. Table 11: Pin Definition of Main UART Interfaces Pin Name Pin No. RI DCD CTS RTS DTR TXD RXD 39 38 36 37 30 35 34 I/O DO DO DO DI DI DO DI Comment Description Ring indicator Data carrier detection Clear to send Request to send 1.8V power domain Sleep mode control Transmit data Receive data Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. DBG_TXD DBG_RXD 23 22 I/O DO DI Description Comment Transmit data 1.8V power domain Receive data 1.8V power domain The logic levels are described in the following table. EG91_Hardware_Design 46 / 93 LTE Module Series EG91 Hardware Design Table 13:Logic Levels of Digital I/O Parameter VIL VIH VOL VOH Min.
-0.3 1.2 0 1.35 Max. 0.6 2.0 0.45 1.8 Unit V V V V The module provides 1.8V UART interfaces. A level translator should be used if customers application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows areference design. Figure 20: Reference Circuit with Translator Chip Please visit http://www.ti.com formore information. Another example with transistor translation circuit is shown as below. Thecircuitdesign of dotted line section can refer to the circuitdesign of solid linesection, in terms of both module input and output circuit design. Please pay attention to the direction of connection. EG91_Hardware_Design 47 / 93 LTE Module Series EG91 Hardware Design Figure 21: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12. PCM and I2C Interfaces EG91 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface:
Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK at 8KHz PCM_SYNC, and also supports 4096KHz PCM_CLK at 16KHz PCM_SYNC. In auxiliary mode, the data is also sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK and an 8KHz, 50% duty cycle PCM_SYNC. EG91 supports 16-bit linear data format. The following figures show theprimary modes timing relationship with 8KHz PCM_SYNC and 2048KHz PCM_CLK, as well asthe auxiliary modes timing relationship with 8KHz PCM_SYNC and 256KHz PCM_CLK. EG91_Hardware_Design 48 / 93 LTE Module Series EG91 Hardware Design 125us PCM_CLK 1 2 255 256 PCM_SYNC PCM_DOUT PCM_DIN MSB MSB LSB LSB MSB MSB Figure 22: Primary Mode Timing Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. EG91_Hardware_Design 49 / 93 LTE Module Series EG91 Hardware Design Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_DIN PCM_DOUT PCM_SYNC PCM_CLK I2C_SCL I2C_SDA 6 7 5 4 40 41 DI DO IO IO OD OD PCM data input 1.8V power domain PCM data output 1.8V power domain PCM data frame synchronization signal 1.8V power domain PCM data bit clock 1.8V power domain I2C serial clock Require an external pull-up to 1.8V I2C serial data Require an external pull-up to 1.8V Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronizationformat with 2048KHzPCM_CLK and 8KHz PCM_SYNC.Please refer to document [2] aboutAT+QDAIcommand for details. The following figure shows areference design of PCM interface with external codec IC. Figure 24: Reference Circuit of PCM Application with Audio Codec NOTES PCM_CLK. 1. It is recommended to reserve an RC (R=22, C=22pF) circuit on the PCM lines, especially for 2. EG91 works as a master device pertaining to I2C interface. EG91_Hardware_Design 50 / 93 LTE Module Series EG91 Hardware Design 3.13. SPI Interface SPI interface of EG91acts asthe master only. It provides a duplex, synchronous and serial communication link with the peripheral devices. It isdedicated to one-to-one connection, withoutchip select.Its operation voltage is 1.8V with clock rates up to 50MHz. The following table shows the pin definition of SPI interface. Table 15: Pin Definition of SPI Interface Pin Name Pin No. I/O Description Comment SPI_CLK SPI_MOSI SPI_MISO 26 27 28 DO DO DI Clock signal of SPI interface 1.8V power domain Master output slave input of SPI interface Master input slave output of SPI interface 1.8V power domain 1.8V power domain The following figure shows areference design of SPI interface with peripherals. Figure 25: Reference Circuit of SPI Interface with Peripherals NOTE The module provides 1.8V SPI interface. A level translator should be used between the module and the host if customers applicationis equipped with a 3.3V processoror device interface. 3.14. Network Status Indication The module provides one network indication pin: NETLIGHT. The pin is used to drive a network status indication LED. EG91_Hardware_Design 51 / 93 LTE Module Series EG91 Hardware Design The following tables describe the pin definition and logic level changes of NETLIGHT in different network status. Table 16: Pin Definition of Network StatusIndicator Pin Name Pin No. I/O Description Comment NETLIGHT 21 DO Indicate the modulesnetwork activity status 1.8V power domain Table 17: Working State of Network Status Indicator Pin Name Logic Level Changes Network Status NETLIGHT Flicker slowly (200ms High/1800ms Low) Network searching Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure. Figure 26: Reference Circuit of Network Status Indicator 3.15. STATUS The STATUS pin is set as the modules operation status indicator. It will output high level when the module is powered on. The following table describes the pin definition of STATUS. EG91_Hardware_Design 52 / 93 LTE Module Series EG91 Hardware Design Table 18: Pin Definition of STATUS Pin Name Pin No. I/O Description STATUS 20 DO Indicate the modulesoperatingstatus The following figure showsthe reference circuit of STATUS. Comment 1.8V power domain. If unused, keep it open. Figure 27: Reference Circuit of STATUS 3.16. ADC Interface The module provides one analog-to-digital converter (ADC) interface. AT+QADC=0 command can beused to read the voltage value on ADC0 pin. For more details about the command, please refer to document [2]. In order to improve the accuracy of ADC voltage values, the traces of ADC should be surrounded by ground. Table 19: Pin Definition of ADC Interface Pin Name Pin No. I/O Description Comment ADC0 24 AI Force the module to enter into emergency download mode If unused, keep this pin open. The following table describes the characteristics of ADC interface. EG91_Hardware_Design 53 / 93 LTE Module Series EG91 Hardware Design Table 20: Characteristics of ADC Interface Parameter Min. Typ. Max. ADC0 Voltage Range 0.3 ADC Resolution VBAT_BB 15 Unit V bits NOTES It is prohibited to supply any voltage to ADC pins when VBAT is removed. It is recommended to use resistor divider circuit for ADC application. 1. 2. 3.17. Behaviors of RI AT+QCFG="risignaltype","physical"command can be used to configure RI behavior.The default RI behaviors can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2] for details. No matter on which port URC is presented, URC will trigger the behavior ofRI pin. NOTE URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. The default behaviors of the RI are shown as below. Table 21: Default Behaviors of RI Response RI keeps athigh level RI outputs 120ms low pulse when a new URC returns State Idle URC EG91_Hardware_Design 54 / 93 LTE Module Series EG91 Hardware Design 3.18. USB_BOOT Interface EG91provides a USB_BOOT pin. Customerscan pull up USB_BOOT to VDD_EXT before powering on the module, thus the module will enter into emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface. Table 22: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description USB_BOOT 75 DI Force the module to enter into emergency download mode Comment 1.8V power domain. Active high. It is recommended to reserve test point. The following figures showthereference circuit of USB_BOOT interface and timing sequence of entering into emergency download mode. Module USB_BOOT Test point 4.7K Close to test point TVS VDD_EXT Figure 28: Reference Circuit of USB_BOOT Interface EG91_Hardware_Design 55 / 93 LTE Module Series EG91 Hardware Design NOTE VH=0.8V 500ms VIL0.5V About 100ms Setting USB_BOOT to high level between VBAT rising on and VDD_EXT rising on can let the module enter into emergency download mode. VBAT PWRKEY VDD_EXT USB_BOOT RESET_N Figure 29: Timing Sequence for Entering into Emergency Download Mode NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. 2. When using MCU to control module to enter into the emergency download mode, follow the above timing sequence. It is not recommended to pull up USB_BOOT to 1.8V before powering up the VBAT. Short the test points as shown in Figure 28 can manually force the module to enter into download mode. EG91_Hardware_Design 56 / 93 LTE Module Series EG91 Hardware Design 4 GNSS Receiver 4.1. General Description EG91 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EG91 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EG91 GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows GNSS performance of EG91. Table 23: GNSS Performance Parameter Description Cold start Conditions Autonomous Sensitivity
(GNSS) TTFF
(GNSS) Reacquisition Autonomous Tracking Cold start
@open sky Warm start
@open sky Autonomous Autonomous XTRA enabled Autonomous XTRA enabled EG91_Hardware_Design 57 / 93 Typ.
-146
-157
-157 34.6 11.57 26.09 3.7 Unit dBm dBm dBm s s s s LTE Module Series EG91 Hardware Design Hot start
@open sky CEP-50 Autonomous XTRA enabled Autonomous
@open sky 1.8 3.4
<2.5 s s m Accuracy
(GNSS) NOTES 1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes position within 3 minutes after executing cold start command. 4.3. Layout Guidelines The following layout guidelines should be taken into account in customers design. Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna. Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be kept away from the antennas. Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar isolation and protection. Keep the characteristic impedance for ANT_GNSS trace as 50. Please refer to Chapter 5 for GNSS antenna reference design and antenna installation information. EG91_Hardware_Design 58 / 93 LTE Module Series EG91 Hardware Design 5 Antenna Interfaces EG91 antenna interfaces include a main antenna interface and anRx-diversity antennainterface which is used toresist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface which is only supported on EG91-NA/-NS/-V/-EC. The impedance of the antenna port is50. 5.1. Main/Rx-diversityAntenna Interfaces 5.1.1. Pin Definition The pin definitionof main antenna and Rx-diversityantenna interfaces is shown below. Table 24: Pin Definition of RF Antenna Pin Name ANT_MAIN ANT_DIV
(EG91-E) ANT_DIV
(EG91-NA/-NS/-V/-EC) Pin No. I/O Description Comment 60 49 56 IO AI AI Main antenna pad 50 impedance Receive diversity antenna pad 50 impedance Receive diversity antenna pad 50 impedance 5.1.2. Operating Frequency Table 25: Module Operating Frequencies 3GPP Band EGSM900 DCS1800 WCDMA B1 WCDMA B2 Transmit 880~915 1710~1785 1920~1980 1850~1910 EG91_Hardware_Design 59 / 93 Receive 925~960 1805~1880 2110~2170 1930~1990 Unit MHz MHz MHz MHz LTE Module Series EG91 Hardware Design WCDMA B4 WCDMA B5 WCDMA B8 LTE-FDD B1 LTE FDD B2 LTE-FDD B3 LTE FDD B4 LTE FDD B5 LTE-FDD B7 LTE-FDD B8 LTE FDD B12 LTE FDD B13 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28 1710~1755 824~849 880~915 1920~1980 1850~1910 1710~1785 1710~1755 824~849 2500~2570 880~915 699~716 777~787 832~862 1850~1915 814~849 703~748 2110~2155 869~894 925~960 2110~2170 1930~1990 1805~1880 2110~2155 869~894 2620~2690 925~960 729~746 746~756 791~821 1930~1995 859~894 758~803 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz 5.1.3. Reference Design of RF Antenna Interface Areference design of ANT_MAIN and ANT_DIVantenna pads is shown as below. A-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. EG91_Hardware_Design 60 / 93 LTE Module Series EG91 Hardware Design Figure 30: Reference Circuit of RF Antenna Interface NOTES 1. Keep a proper distance between the main antenna and theRx-diversityantenna to improve the receiving sensitivity. 2. ANT_DIV function is enabledby default.AT+QCFG="diversity",0command can be used to disable receive diversity. 3. Place the -type matching components (R1/C1/C2, R2/C3/C4) as close to the antenna as possible. 5.1.4. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled as 50. The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, height from the reference ground to the signal layer (H), and the space between the RF trace and the ground (S). Microstrip and coplanar waveguide are typically used in RF layout to control characteristic impedance. The following figures are reference designs of microstrip or coplanar waveguide with different PCB structures. EG91_Hardware_Design 61 / 93 LTE Module Series EG91 Hardware Design Figure 31: Microstrip Line Design on a 2-layer PCB Figure 32: Coplanar Waveguide Design on a 2-layer PCB Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) EG91_Hardware_Design 62 / 93 LTE Module Series EG91 Hardware Design In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:
Use impedance simulation tool to control the characteristic impedanceof RF tracesas 50. The GND pins adjacent to RF pins should not bedesigned as thermal relief pads, and should be fully connected to ground. The distance between the RF pinsand the RFconnector should be as short as possible, and all the right angle traces should be changed to curved ones. There should be clearance area under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground viasaround RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W). For more details about RF layout, please refer to document [5]. 5.2. GNSS Antenna Interface The GNSS antenna interface is only supported on EG91-NA/-NS/-V/-EC. The following tables show pin definition and frequency specification of GNSS antenna interface. Table 26: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS
(EG91-NA/-NS/-V/-EC) 49 AI GNSS antenna 50impedance Table 27: GNSS Frequency Unit MHz MHz MHz MHz MHz Type GPS GLONASS Galileo BeiDou QZSS Frequency 1575.421.023 1597.5~1605.8 1575.422.046 1561.0982.046 1575.42 A reference design of GNSS antenna is shown as below. EG91_Hardware_Design 63 / 93 LTE Module Series EG91 Hardware Design Figure 35: Reference Circuit of GNSS Antenna NOTES 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. If the module is designed with a passive antenna, then the VDD circuit is not needed. 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 28: Antenna Requirements Type Requirements GNSS1) GSM/WCDMA/LTE Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain: < 17dB VSWR: 2 Efficiency: > 30%
Max Input Power: 50 W Input Impedance: 50 Cable insertion loss: <1dB EG91_Hardware_Design 64 / 93 LTE Module Series EG91 Hardware Design
(EGSM900,WCDMA B5/B8, LTE B5/B8/B12/B13/B20/B26/B28) Cable Insertion Loss: <1.5dB
(DCS1800, WCDMA B1/B2/B4, LTE B1/B2/B3/B4/B25) Cable insertion loss: <2dB
(LTE B7) NOTE 1) It is recommended to use a passive GNSS antenna when LTE B13 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. EG91_Hardware_Design 65 / 93 LTE Module Series EG91 Hardware Design Figure 37:Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. Figure 38:Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. EG91_Hardware_Design 66 / 93 LTE Module Series EG91 Hardware Design 6 Electrical, Reliability and RadioCharacteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 29: Absolute Maximum Ratings Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage at Digital Pins Min.
-0.3
-0.3 0 0
-0.3 Max. Unit 4.7 5.5 0.8 1.8 2.3 V V A A V 6.2. Power Supply Ratings Table 30: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT_BB and VBAT_RF The actual input voltages must stay between the minimum and maximum values. 3.3 3.8 4.3 V EG91_Hardware_Design 67 / 93 LTE Module Series EG91 Hardware Design Voltage drop during burst transmission Peak supply current
(during transmissionslot) USB connectiondetection IVBAT USB_VBUS Maximum power control level on EGSM900 Maximum power control level on EGSM900 400 mV 1.8 2.0 A V 3.0 5.0 5.25 6.3. Operation and Storage Temperatures The operation and storage temperaturesare listed in the following table. Table 31: Operation and Storage Temperatures Parameter Operation Temperature Range1) ExtendedTemperatureRange2) Storage Temperature Range Min.
-35
-40
-40 Typ.
+25 Max.
+75
+85
+90 Unit C C C NOTES 1) Within operation temperature range, the module is 3GPP compliant. 1. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. EG91_Hardware_Design 68 / 93 LTE Module Series EG91 Hardware Design 6.4. Current Consumption The values of current consumption are shown below. Table 32: EG91-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=5 (USB suspended) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspended) WCDMA PF=512 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspended) LTE-FDD PF=256 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDDPF=64 (USB disconnected) LTE-FDDPF=64 (USB connected) EGSM900 4DL/1UL @32.67dBm EGSM900 3DL/2UL @32.59dBm EGSM900 2DL/3UL @30.74dBm IVBAT Sleep state Idle state GPRS data transfer 13 1.1 2.0 1.9 1.3 1.7 2.1 1.1 2.1 2.6 1.4 19.0 29.0 19.0 29.0 19.0 29.0 260 463 552 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Hardware_Design 69 / 93 LTE Module Series EG91 Hardware Design EGSM900 1DL/4UL @29.26dBm DCS1800 4DL/1UL @29.2dBm DCS1800 3DL/2UL @29.13dBm DCS1800 2DL/3UL @29.01dBm DCS1800 1DL/4UL @28.86dBm EGSM900 4DL/1UL PCL=8 @27.1dBm EGSM900 3DL/2UL PCL=8 @27.16dBm EGSM900 2DL/3UL PCL=8 @26.91dBm EGSM900 1DL/4UL PCL=8 @26.12dBm DCS1800 4DL/1UL PCL=2 @25.54dBm DCS1800 3DL/2UL PCL=2 @25.68dBm DCS1800 2DL/3UL PCL=2 @25.61dBm DCS1800 1DL/4UL PCL=2 @25.41dBm 619 165 267 406 467 163 274 383 463 136 220 306 396 EDGE data transfer WCDMA datatransfer WCDMA B1 HSDPACH10700 @22.29dBm 507 WCDMA B1 HSUPA CH10700 @21.79dBm 516 WCDMA B8 HSDPACH3012 @22.47dBm 489 WCDMA B8 HSUPA CH3012 @21.98dBm 482 LTE datatransfer LTE-FDD B1 CH18300 @22.98dBm LTE-FDD B3 CH19575 @23.23dBm LTE-FDD B7 CH21100 @23.46dBm LTE-FDD B8 CH21625 @23.35dBm LTE-FDD B20 CH24300 @23.41dBm LTE-FDD B28A CH27360 @23.16dBm GSM voice call EGSM900 PCL=5 @32.5dBm DCS1800PCL=0 @29.23dBm 685 698 723 655 723 660 258 159 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Hardware_Design 70 / 93 LTE Module Series EG91 Hardware Design WCDMA voice call WCDMA B1 CH10700 @23.06dBm WCDMA B8 CH3012 @23.45dBm 555 535 mA mA Table 33: EG91-NA Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspended) Sleep state WCDMA PF=512 (USB disconnected) IVBAT Idle state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspended) LTE-FDD PF=256 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDDPF=64 (USB disconnected) LTE-FDDPF=64 (USB connected) WCDMA B2 HSDPA CH9938@22.45 dBm WCDMA B2 HSUPACH9938 @21.73 dBm WCDMA datatransfer WCDMA B4 HSDPACH1537@23.05 dBm WCDMA B4 HSUPACH1537@22.86 dBm WCDMA B5 HSDPA CH4407@23 dBm WCDMA B5 HSUPACH4407 @22.88 dBm LTE datatransfer LTE-FDD B2 CH1100@23.29 dBm LTE-FDD B4 CH2175@23.19 dBm 13 1.0 2.2 2.5 1.4 2.6 2.9 1.7 14.0 26.0 15.0 26.0 569 559 572 586 518 514 705 693 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Hardware_Design 71 / 93 LTE Module Series EG91 Hardware Design LTE-FDD B5 CH2525@23.39dBm LTE-FDD B12 CH5060@23.16 dBm LTE-FDD B13 CH5230 @23.36 dBm WCDMA B2 CH9938 @23.34 dBm WCDMA B4 CH1537@23.47 dBm WCDMA B5 CH4357@23.37 dBm WCDMA voice call 601 650 602 627 591 536 mA mA mA mA mA mA Table 34: EG91-NS Current Consumption Parameter Description Conditions Typ. Unit IVBAT OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspended) Sleep state WCDMA PF=512 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspended) LTE-FDD PF=256 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDDPF=64 (USB disconnected) LTE-FDDPF=64 (USB connected) WCDMA B2 HSDPA CH9938@22.4 dBm WCDMA B2 HSUPACH9938 @22.31 dBm WCDMA B4 HSDPACH1537@23.01 dBm WCDMA B4 HSUPACH1537@22.69 dBm Idle state WCDMA datatransfer 8 1.2 2 2.3 1.3 2.5 2.8 1.6 19.9 30.1 21.2 30.9 527 547 575 589 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Hardware_Design 72 / 93 LTE Module Series EG91 Hardware Design WCDMA B5 HSDPA CH4407@23.05 dBm WCDMA B5 HSUPACH4407 @22.91 dBm LTE-FDD B2 CH1100@23.26 dBm LTE-FDD B4 CH2175@23.52 dBm LTE-FDD B5 CH2525@23.51dBm LTE-FDD B12 CH5060@23.39 dBm LTE-FDD B13 CH5230 @23.54 dBm LTE-FDD B25CH8590@23.64 dBm LTE-FDD B26CH8765@23.34 dBm WCDMA B2 CH9938 @23.39 dBm WCDMA B4 CH1738@23.27 dBm WCDMA B5 CH4357@23.35 dBm LTE datatransfer WCDMA voice call Table 35: EG91-V Current Consumption Parameter Description Conditions OFF state Power down Sleep state AT+CFUN=0 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspended) IVBAT LTE-FDD PF=256 (USB disconnected) Idle state LTEdatatransfer LTE-FDDPF=64 (USB disconnected) LTE-FDDPF=64 (USB connected) LTE-FDD B4 CH2175@23.36dBm LTE-FDD B13 CH5230@23.38dBm EG91_Hardware_Design 73 / 93 553 556 724 693 613 634 576 739 647 571 593 554 Typ. 9 TBD TBD TBD TBD 16.5 30.8 715 642 mA mA mA mA mA mA mA mA mA mA mA mA Unit uA mA mA mA mA mA mA mA mA LTE Module Series EG91 Hardware Design Table 36: EG91-EC Current Consumption Parameter Description Conditions OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=5 (USB suspended) GSM DRX=9 (USB disconnected) Sleep state WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspended) WCDMA PF=512 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspended) LTE-FDD PF=256 (USB disconnected) IVBAT GSM DRX=5 (USB disconnected) Idle state GPRS data transfer GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDDPF=64 (USB disconnected) LTE-FDDPF=64 (USB connected) EGSM900 4DL/1UL @TBDdBm EGSM900 3DL/2UL @TBDdBm EGSM900 2DL/3UL @TBDdBm EGSM900 1DL/4UL @TBDdBm DCS1800 4DL/1UL @TBDdBm DCS1800 3DL/2UL @TBDdBm EG91_Hardware_Design 74 / 93 Typ. TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Unit uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE Module Series EG91 Hardware Design DCS1800 2DL/3UL @TBDdBm DCS1800 1DL/4UL @TBDdBm EGSM900 4DL/1UL PCL=8 @TBDdBm EGSM900 3DL/2UL PCL=8 @TBDdBm EGSM900 2DL/3UL PCL=8 @TBDdBm EGSM900 1DL/4UL PCL=8 @TBDdBm DCS1800 4DL/1UL PCL=2 @TBDdBm DCS1800 3DL/2UL PCL=2 @TBDdBm DCS1800 2DL/3UL PCL=2 @TBDdBm DCS1800 1DL/4UL PCL=2 @TBDdBm WCDMA B1 HSDPA@TBD dBm WCDMA B1 HSUPA @TBD dBm WCDMA B8 HSDPA@TBD dBm WCDMA B8 HSUPA @TBD dBm LTE-FDD B1@TBD dBm LTE-FDD B3@TBD dBm EDGE data transfer WCDMA datatransfer LTE datatransfer LTE-FDD B7@TBD dBm LTE-FDD B8@TBD dBm LTE-FDD B20@TBD dBm LTE-FDD B28@TBD dBm EGSM900 PCL=5 @TBDdBm DCS1800PCL=0 @TBDdBm WCDMA B1@TBD dBm WCDMA B8@TBD dBm GSM voice call WCDMA voice call TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Hardware_Design 75 / 93 LTE Module Series EG91 Hardware Design Table 37: GNSS Current Consumption of EG91 Parameter Description Conditions Typ. Unit Cold start @Passive Antenna Hot Start @Passive Antenna Lost state @Passive Antenna Open Sky @Passive Antenna Searching
(AT+CFUN=0) Tracking
(AT+CFUN=0) IVBAT
(GNSS) 6.5. RF Output Power The following table shows the RF output power of EG91 module. Table 38: RF Output Power Frequency EGSM900 DCS1800 EGSM900 (8-PSK) DCS1800(8-PSK) Max. 33dBm2dB 30dBm2dB 27dBm3dB 26dBm3dB WCDMA B1/B2/B4/B5/B8 24dBm+1/-3dB LTE-FDD B1/B2/B3/B4/B5/B7/
B8/B12/B13/B20/B25/B26/B28A/B28B NOTE 23dBm2dB 54 54 53 32 mA mA mA mA Min. 5dBm5dB 0dBm5dB 5dBm5dB 0dBm5dB
<-49dBm
<-39dBm In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. Thedesign conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. EG91_Hardware_Design 76 / 93 LTE Module Series EG91 Hardware Design 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EG91 module. Table 39: EG91-E Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP
-102dBm
-102dbm EGSM900 DCS1800 WCDMA B1 WCDMA B8
-108.6dBm
-109.4 dBm NA NA NA NA
-109.5dBm
-110dBm
-112.5dBm
-106.7dBm
-109.5dBm
-110dBm
-112.5dBm
-103.7dBm LTE-FDD B1(10M)
-97.5dBm
-98.3dBm
-101.4dBm
-96.3dBm LTE-FDD B3(10M)
-98.3dBm
-98.5dBm
-101.5dBm
-93.3dBm LTE-FDD B7(10M)
-96.3dBm
-98.4dBm
-101.3dBm
-94.3dBm LTE-FDD B8(10M)
-97.1dBm
-99.1dBm
-101.2dBm
-93.3dBm LTE-FDD B20(10M)
-97dBm LTE-FDD B28A(10M)
-98.3dBm
-99dBm
-99dBm
-101.3dBm
-93.3dBm
-101.4dBm
-94.8dBm Table 40: EG91-NA Conducted RF Receiving Sensitivity Frequency WCDMA B2 WCDMA B4 WCDMA B5 Primary Diversity SIMO 3GPP
-110dBm
-111dBm
-112.5dBm
-104.7dBm
-110dBm
-111dBm
-112.5dBm
-106.7dBm
-111dBm
-111.5dBm
-113dBm
-104.7dBm LTE-FDD B2 (10M)
-98dBm
-99dBm
-102.2dBm
-94.3dBm LTE-FDD B4 (10M)
-97.8dBm
-99.5dBm
-102.2dBm
-96.3dBm LTE-FDD B5 (10M)
-99.6dBm
-100.3dBm
-103dBm
-94.3dBm LTE-FDD B12 (10M)
-99.5dBm
-100dBm
-102.5dBm
-93.3dBm EG91_Hardware_Design 77 / 93 LTE Module Series EG91 Hardware Design LTE-FDD B13 (10M)
-99.2dBm
-100dBm
-102.5dBm
-93.3dBm Table 41: EG91-NS Conducted RF Receiving Sensitivity Frequency WCDMA B2 WCDMA B4 WCDMA B5 Primary Diversity SIMO 3GPP
-110dBm
-111dBm
-112.5dBm
-104.7dBm
-110dBm
-111dBm
-112.5dBm
-106.7dBm
-111dBm
-111.5dBm
-113dBm
-104.7dBm LTE-FDD B2 (10M)
-98dBm
-99dBm
-102.2dBm
-94.3dBm LTE-FDD B4 (10M)
-97.8dBm
-99.5dBm
-102.2dBm
-96.3dBm LTE-FDD B5 (10M)
-99.4dBm
-100dBm
-102.7dBm
-94.3dBm LTE-FDD B12 (10M)
-99.5dBm
-100dBm
-102.5dBm
-93.3dBm LTE-FDD B13 (10M)
-99.2dBm
-100dBm
-102.5dBm
-93.3dBm LTE-FDD B25 (10M)
-97.6dBm
-99dBm
-102.2dBm
-92.8dBm LTE-FDD B26 (10M)
-99.1dBm
-99.9dBm
-102.7dBm
-93.8dBm Table 42: EG91-V Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP LTE-FDD B4 (10M)
-98.2dBm
-99.2dBm
-102.2dBm
-96.3dBm LTE-FDD B13 (10M)
-99.2dBm
-100dBm
-102.5dBm
-93.3dBm Table 43: EG91-EC Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO EGSM900 DCS1800 WCDMA B1 TBD TBD TBD TBD TBD TBD TBD TBD TBD 3GPP
-102dBm
-102dbm
-106.7dBm EG91_Hardware_Design 78 / 93 LTE Module Series EG91 Hardware Design WCDMA B8 LTE-FDD B1 (10M) LTE-FDD B3 (10M) LTE-FDD B7 (10M) LTE-FDD B8 (10M) TBD TBD TBD TBD TBD LTE-FDD B20 (10M) TBD LTE-FDD B28 (10M) TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
-103.7dBm
-96.3dBm
-93.3dBm
-94.3dBm
-93.3dBm
-93.3dBm
-94.8dBm 6.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the modules electrostatic discharge characteristics. Table 44: Electrostatic Discharge Characteristics Test Points VBAT, GND All Antenna Interfaces Other Interfaces Contact Discharge Air Discharge 5 4 0.5 10 8 1 Unit KV KV KV 6.8. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:
On customers PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc. EG91_Hardware_Design 79 / 93 LTE Module Series EG91 Hardware Design Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary. Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Make sure the ground pads of the module and PCB are fully connected. According to customers application demands, the heatsink can be mounted on the top of the module, or the opposite side of the PCB area where the module is mounted, or both of them. The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB. The following shows two kinds of heatsink designs for reference and customers can choose one or bothof them according to their application structure. Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module) EG91_Hardware_Design 80 / 93 LTE Module Series EG91 Hardware Design EG91 Module Thermal Pad Thermal Pad Heatsink Application Board Shielding Cover Application Board Heatsink Figure 40: Referenced Heatsink Design (Heatsink at the Backsideof Customers PCB) NOTES 1. The module offers the best performance when the internal BB chip stays below 105C. When the maximum temperature of the BB chip reaches or exceeds 105C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. 2. For more detailed guidelines on thermal design, please refer to document [6]. EG91_Hardware_Design 81 / 93 LTE Module Series EG91 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module.All dimensions are measured in mm. The tolerances for dimensions without tolerance values are 0.05mm. 7.1. Mechanical Dimensions of the Module 250.15 2.300.2 5 1
. 0 9 2 Figure 41: Module Top and Side Dimensions EG91_Hardware_Design 82 / 93 EG LTE Mod G91 Hardw dule Series s ware Design n Figure 4 42: Module B Bottom Dim mensions (T TopView) dware_Desi ign EG91_Hard 83 / 93 EG LTE Mod G91 Hardw dule Series s ware Design n 7.2. Figure NOTE Recomm mended Footprin nt 43: Recom mended Fo ootprint (To op View) For easyma in thehost P aintenance o PCB. of the modul e, please ke eep about 3m mm between n the module e and other components s dware_Desi ign EG91_Hard 84 / 93 EG LTE Mod G91 Hardw dule Series s ware Design n 7.3. Design Effect Dr rawings of the M Module F Figure 44: T Top View of f the Modul e Fig gure 45: Bo ottom View of the Mod ule NOTE These are module that design effe t you get fro ect drawings m Quectel. s of EG91 m module. Fo r more acc curate pictur res, please refer to the e dware_Desi ign EG91_Hard 85 / 93 LTE Module Series EG91 Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EG91is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40C/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:
Mounted within 168 hours at the factory environment of 30C/60%RH. Stored at <10% RH. 3. Devices require bake before mounting, if any circumstances below occurs:
When the ambient temperature is 23C5C and the humidity indicator card shows the humidity Device mounting cannot be finished within 168 hours at factory conditions of 30C/60%RH. is >10% before opening the vacuum-sealed bag. If baking is required, devices may be baked for 8 hours at 120C5C. NOTE As the plastic package cannot be subjected to high temperature, it should be removed from devices before high to temperature (120C) baking. IPC/JEDECJ-STD-033 for baking procedure. is desired, please refer If shorter baking time EG91_Hardware_Design 86 / 93 LTE Module Series EG91 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properlyso as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, thethickness of stencil for the module is recommended to be 0.15mm~0.18mm. For more details, please refer todocument [4]. It is suggested that the peak reflow temperature is 240C~245C, and the absolute maximum reflow temperature is 245C. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Temp. (C) 245 240 220 200 150 100 Soak Zone A Max slope: 1~3C/sec Reflow Zone C Max slope:
2~3C/sec Cooling down slope: 1~4C/sec B D Figure 46: Reflow Soldering Thermal Profile Table 45: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 1 to 3C/sec Soak time (between A and B: 150C and 200C) 60 to 120 sec Reflow Zone EG91_Hardware_Design 87 / 93 LTE Module Series EG91 Hardware Design Max slope Reflow time (D: over 220C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle 2 to 3C/sec 40 to 60 sec 240C ~ 245C 1 to 4C/sec 1 8.3. Packaging EG91is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. The reel is 330mm in diameter and each reel contains 250pcs modules. The following figures show the packaging details, measured in mm. Figure 47: Tape Dimensions EG91_Hardware_Design 88 / 93 LTE Module Series EG91 Hardware Design 48.5 0 0 1 13 44.5+0.20
-0.00 Cover tape Direction of feed Figure 48: Reel Dimensions 1083 Carrier tape packing module Carrier tape unfolding Figure 49: Tape and Reel Directions EG91_Hardware_Design 89 / 93 LTE Module Series EG91 Hardware Design 9 Appendix A References Table 46: Related Documents SN Document Name Remark Quectel_EC2x&EG9x&EM05_Power_Management_A pplication_Note Quectel_EG9x_AT_Commands_Manual Quectel_EC25&EC21_GNSS_AT_Commands_ Manual Power Management Application Note for EC25, EC21, EC20 R2.0, EC20 R2.1, EG95, EG91 and EM05 AT Commands Manual for EG95 and EG91 GNSS AT Commands Manual for EC25 and EC21 modules Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide Quectel_RF_Layout_Application_Note RF Layout Application Note
[1]
[2]
[3]
[4]
[5]
[6]
Quectel_LTE_Module_Thermal_Design_Guide Table 47: Terms and Abbreviations Abbreviation Description Thermal design guide for LTE modules including EC25, EC21, EC20 R2.0, EC20 R2.1, EG91, EG95, EG25-G, EP06, EG06, EM06 and AG35. AMR bps CHAP CS CSD CTS Adaptive Multi-rate Bits Per Second Challenge Handshake Authentication Protocol Coding Scheme Circuit Switched Data Clear To Send DC-HSPA+
Dual-carrier High Speed Packet Access EG91_Hardware_Design 90 / 93 LTE Module Series EG91 Hardware Design DFOTA Delta Firmware Upgrade Over-The-Air DL DTR DTX EFR ESD FDD FR GMSK GSM HR HSPA HSDPA HSUPA I/O Inorm LED LNA LTE MIMO MO MS MSL MT PAP Downlink Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate Gaussian Minimum Shift Keying Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Downlink Packet Access High Speed Uplink Packet Access Input/Output Normal Current Light Emitting Diode Low Noise Amplifier Long Term Evolution Multiple Input Multiple Output Mobile Originated Mobile Station (GSM engine) Moisture Sensitivity Level Mobile Terminated Password Authentication Protocol EG91_Hardware_Design 91 / 93 LTE Module Series EG91 Hardware Design PCB PDU PPP QAM QPSK RF RHCP Rx SMS TDD TX UL UMTS URC
(U)SIM Vmax Vnorm Vmin VIHmax VIHmin VILmax VILmin VImax VImin VOHin Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Right Hand Circularly Polarized Receive Short Message Service Time Division Duplexing Transmitting Direction Uplink Universal Mobile Telecommunications System Unsolicited Result Code
(Universal) Subscriber Identity Module Maximum Voltage Value Normal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Absolute Minimum Input Voltage Value Minimum Output High Level Voltage Value EG91_Hardware_Design 92 / 93 LTE Module Series EG91 Hardware Design VOLmax VOLmin VSWR WCDMA Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Voltage Standing Wave Ratio Wideband Code Division Multiple Access EG91_Hardware_Design 93 / 93 LTE Module Series EG91 Hardware Design 10 Appendix B GPRS Coding Schemes Table 48: Description of Different Coding Schemes Scheme Code Rate USF Pre-coded USF CS-1 1/2 3 3 Radio Block excl.USF and BCS 181 BCS Tail Coded Bits Punctured Bits Data Rate Kb/s 40 4 456 0 9.05 CS-2 2/3 3 6 268 16 4 588 132 13.4 CS-3 3/4 3 6 312 16 4 676 220 15.6 CS-4 1 3 12 428 16
-
456
-
21.4 EG91_Hardware_Design 94 / 93 LTE Module Series EG91 Hardware Design 11 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 49: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1 2 2 3 2 3 3 4 3 4 4 4 3 4 1 1 2 1 2 2 3 1 2 2 3 4 3 4 EG91_Hardware_Design 95 / 93 2 3 3 4 4 4 4 5 5 5 5 5 NA NA LTE Module Series EG91 Hardware Design 5 6 7 8 6 6 6 6 6 8 8 8 8 8 8 5 5 5 5 5 6 7 8 2 3 4 4 6 2 3 4 4 6 8 1 2 3 4 NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA 6 6 6 6 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 EG91_Hardware_Design 96 / 93 LTE Module Series EG91 Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 50: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot GMSK GMSK GMSK GMSK GMSK GMSK GMSK GMSK 8-PSK 8-PSK 8-PSK 8-PSK 8-PSK
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C B A C B A B A A 9.05kbps 18.1kbps 36.2kbps 13.4kbps 26.8kbps 53.6kbps 15.6kbps 31.2kbps 62.4kbps 21.4kbps 42.8kbps 85.6kbps 8.80kbps 17.60kbps 35.20kbps 11.2kbps 22.4kbps 44.8kbps 14.8kbps 29.6kbps 59.2kbps 17.6kbps 35.2kbps 70.4kbps 22.4kbps 44.8kbps 89.6kbps 29.6kbps 59.2kbps 118.4kbps 44.8kbps 89.6kbps 179.2kbps 54.4kbps 108.8kbps 217.6kbps 59.2kbps 118.4kbps 236.8kbps CS-1:
CS-2:
CS-3:
CS-4:
MCS-1 MCS-2 MCS-3 MCS-4 MCS-5 MCS-6 MCS-7 MCS-8 MCS-9 EG91_Hardware_Design 97 / 93
| frequency | equipment class | purpose | ||
|---|---|---|---|---|
| 1 | 2019-04-03 | 1850.7 ~ 1909.3 | PCB - PCS Licensed Transmitter | Original Equipment |
| app s | Applicant Information | |||||
|---|---|---|---|---|---|---|
| 1 | Effective |
2019-04-03
|
||||
| 1 | Applicant's complete, legal business name |
Quectel Wireless Solutions Company Limited
|
||||
| 1 | FCC Registration Number (FRN) |
0018988279
|
||||
| 1 | Physical Address |
Building 5, Shanghai Business Park PhaseIII
|
||||
| 1 |
Shanghai, N/A 200233
|
|||||
| 1 |
China
|
|||||
| app s | TCB Information | |||||
| 1 | TCB Application Email Address |
c******@telefication.com
|
||||
| 1 | TCB Scope |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
||||
| app s | FCC ID | |||||
| 1 | Grantee Code |
XMR
|
||||
| 1 | Equipment Product Code |
201903EG91NS
|
||||
| app s | Person at the applicant's address to receive grant or for contact | |||||
| 1 | Name |
J****** x******
|
||||
| 1 | Telephone Number |
+8602******** Extension:
|
||||
| 1 | Fax Number |
+8621********
|
||||
| 1 |
j******@quectel.com
|
|||||
| app s | Technical Contact | |||||
| 1 | Firm Name |
TA Technology(Shanghai) Company, Limited
|
||||
| 1 | Name |
K**** X****
|
||||
| 1 | Physical Address |
No.145,Jintang Rd,Tangzhen, ndustryPark,Pudong
|
||||
| 1 |
China
|
|||||
| 1 | Telephone Number |
86-21********
|
||||
| 1 | Fax Number |
86-21********
|
||||
| 1 |
x******@ta-shanghai.com
|
|||||
| app s | Non Technical Contact | |||||
| 1 | Firm Name |
TA Technology(Shanghai) Company, Limited
|
||||
| 1 | Name |
j****** Z********
|
||||
| 1 | Physical Address |
No.145,Jintang Rd,Tangzhen, ndustryPark,Pudong
|
||||
| 1 |
China
|
|||||
| 1 | Telephone Number |
86-21********
|
||||
| 1 | Fax Number |
86-21********
|
||||
| 1 |
h******@ta-shanghai.com
|
|||||
| app s | Confidentiality (long or short term) | |||||
| 1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
| 1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
| if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
| app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
| 1 | Is this application for software defined/cognitive radio authorization? | No | ||||
| 1 | Equipment Class | PCB - PCS Licensed Transmitter | ||||
| 1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | LTE Cat 1 Module | ||||
| 1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
| 1 | Modular Equipment Type | Single Modular Approval | ||||
| 1 | Purpose / Application is for | Original Equipment | ||||
| 1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
| 1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
| 1 | Grant Comments | Modular Approval. Power output listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. The antennas used for this transmitter as shown in this filing must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Maximum antenna gain (including cable loss) must not exceed: WCDMA Band2 / LTE Band2: 8.5 dBi; WCDMA Band4 / LTE Band4: 5.5 dBi; WCDMA Band5 / LTE Band5: 9.9 dBi; LTE Band12: 9.2 dBi; LTE Band13: 9.7 dBi; LTE Band25: 8.5 dBi; LTE Band26: 9.8 dBi. End-users may not be provided with the module installation instructions. OEM integrators and end-users must be provided with transmitter operating conditions for satisfying RF exposure compliance. | ||||
| 1 | Is there an equipment authorization waiver associated with this application? | No | ||||
| 1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
| app s | Test Firm Name and Contact Information | |||||
| 1 | Firm Name |
TA Technology (Shanghai) Co., Ltd.
|
||||
| 1 | Name |
M**** L******
|
||||
| 1 | Telephone Number |
86-21********
|
||||
| 1 |
l******@ta-shanghai.com
|
|||||
| Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 1 | 1 | 22H | 826.4 | 846.6 | 0.205 | 0.0068 ppm | 4M14F9W | ||||||||||||||||||||||||||||||||||
| 1 | 2 | 22H | 824.7 | 848.3 | 0.265 | 0.01387 ppm | 1M12G7D | ||||||||||||||||||||||||||||||||||
| 1 | 3 | 22H | 824.7 | 848.3 | 0.256 | 0.00574 ppm | 2M75W7D | ||||||||||||||||||||||||||||||||||
| 1 | 4 | 22H | 824.7 | 848.3 | 0.261 | 0.01387 ppm | 9M02G7D | ||||||||||||||||||||||||||||||||||
| 1 | 5 | 22H | 824.7 | 848.3 | 0.253 | 0.00574 ppm | 9M02W7D | ||||||||||||||||||||||||||||||||||
| 1 | 6 | 24E | 1852.4 | 1907.6 | 0.001 | 0.00323 ppm | 4M14F9W | ||||||||||||||||||||||||||||||||||
| 1 | 7 | 24E | 1850.7 | 1909.3 | 0.278 | 0.00211 ppm | 9M05G7D | ||||||||||||||||||||||||||||||||||
| 1 | 8 | 24E | 1850.7 | 1909.3 | 0.259 | 0.00258 ppm | 9M02W7D | ||||||||||||||||||||||||||||||||||
| 1 | 9 | 24E | 1850.7 | 1909.3 | 0.275 | 0.00211 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
| 1 | 1 | 24E | 1850.7 | 1909.3 | 0.256 | 0.00258 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
| 1 | 11 | 27 | 1712.4 | 1752.6 | 0.228 | 0.00135 ppm | 4M13F9W | ||||||||||||||||||||||||||||||||||
| 1 | 12 | 27 | 1710.7 | 1754.3 | 0.27 | 0.00264 ppm | 9M02G7D | ||||||||||||||||||||||||||||||||||
| 1 | 13 | 27 | 1710.7 | 1754.3 | 0.236 | 0.00241 ppm | 9M06W7D | ||||||||||||||||||||||||||||||||||
| 1 | 14 | 27 | 1710.7 | 1754.3 | 0.267 | 0.00264 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
| 1 | 15 | 27 | 1710.7 | 1754.3 | 0.233 | 0.00241 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
| 1 | 16 | 27 | 699.7 | 715.3 | 0.242 | 0.00758 ppm | 1M12W7D | ||||||||||||||||||||||||||||||||||
| 1 | 17 | 27 | 699.7 | 715.3 | 0.265 | 0.00416 ppm | 2M74G7D | ||||||||||||||||||||||||||||||||||
| 1 | 18 | 27 | 699.7 | 715.3 | 0.263 | 0.00416 ppm | 9M03G7D | ||||||||||||||||||||||||||||||||||
| 1 | 19 | 27 | 699.7 | 715.3 | 0.233 | 0.00758 ppm | 9M02W7D | ||||||||||||||||||||||||||||||||||
| 1 | 2 | 27 | 779.5 | 784.5 | 0.248 | 0.01015 ppm | 4M53G7D | ||||||||||||||||||||||||||||||||||
| 1 | 21 | 27 | 779.5 | 784.5 | 0.238 | 0.01015 ppm | 9M04G7D | ||||||||||||||||||||||||||||||||||
| 1 | 22 | 27 | 779.5 | 784.5 | 0.21 | 0.0117 ppm | 9M05W7D | ||||||||||||||||||||||||||||||||||
| 1 | 23 | 24E | 1850.7 | 1914.3 | 0.247 | 0.0033 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
| 1 | 24 | 24E | 1850.7 | 1914.3 | 0.255 | 0.0049 ppm | 1M21W7D | ||||||||||||||||||||||||||||||||||
| 1 | 25 | 22H | 824.7 | 848.3 | 0.225 | 0.0235 ppm | 2M75G7W | ||||||||||||||||||||||||||||||||||
| 1 | 26 | 22H | 824.7 | 848.3 | 0.208 | 0.0236 ppm | 877KW7D | ||||||||||||||||||||||||||||||||||
| 1 | 27 | 22H | 824.7 | 848.3 | 0.224 | 0.0235 ppm | 13M5G7W | ||||||||||||||||||||||||||||||||||
| 1 | 28 | 22H | 824.7 | 848.3 | 0.198 | 0.0236 ppm | 1M09W7D | ||||||||||||||||||||||||||||||||||
| 1 | 29 | 9 | 814.7 | 823.3 | 0.209 | 0.0239 ppm | 9M04G7D | ||||||||||||||||||||||||||||||||||
| 1 | 3 | 9 | 814.7 | 823.3 | 0.189 | 0.0235 ppm | 847KW7D | ||||||||||||||||||||||||||||||||||
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC