FCC ID: XMR202307EG92NA LTE Cat 1 Module

EG92 Series Hardware Design LTE Standard Module Series Version: 0.1 Date: 2023-07-21 Status: Draft LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. EG92_Series_Hardware_Design 2 / 79 LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any terminal or mobile incorporating the module. Manufacturers of the terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. EG92_Series_Hardware_Design 3 / 79 LTE Standard Module Series About the Document Revision History Version Date Author Description

2023-07-21 Thor LEI/Woping WANG/

Kai YU/Gavin LU Creation of the document 0.1 2023-07-21 Thor LEI/Woping WANG/

Kai YU/Gavin LU Draft EG92_Series_Hardware_Design 4 / 79 LTE Standard Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents ....................................................................................................................................................... 5 Table Index ................................................................................................................................................... 8 Figure Index ............................................................................................................................................... 10 1 Introduction ........................................................................................................................................ 12 2 Product Overview .............................................................................................................................. 13 Frequency Bands and Functions ............................................................................................ 14 Key Features ........................................................................................................................... 14 Pin Description ........................................................................................................................ 17 EVB Kit .................................................................................................................................... 22 2.1. 2.2. 2.3. 2.4. 3.1. 3.2. 3.3. 3.4. 3 Operating Characteristics ................................................................................................................. 23 Operating Modes ..................................................................................................................... 23 Sleep Mode ............................................................................................................................. 24 3.2.1. UART Application Scenario ........................................................................................... 24 3.2.2. USB Application Scenarios ............................................................................................ 25 USB Application with USB Suspend/Resume and USB Remote Wakeup 3.2.2.1. 25 Function USB Application with USB Suspend/Resume and RI Function ..................... 25 3.2.2.2. USB Application without USB Suspend Function .......................................... 26 3.2.2.3. Airplane Mode ......................................................................................................................... 27 Power Supply .......................................................................................................................... 27 3.4.1. Power Supply Interface .................................................................................................. 27 3.4.2. Reference Design for Power Supply .............................................................................. 28 3.4.3. Requirements for Voltage Stability ................................................................................ 29 3.4.4. Power Supply Voltage Monitoring .................................................................................. 30 Turn-On ................................................................................................................................... 30 Turn-On with PWRKEY .................................................................................................. 30 Turn-Off ................................................................................................................................... 32 Turn-Off with PWRKEY .................................................................................................. 32 Turn-Off with AT Command ........................................................................................... 33 Reset ....................................................................................................................................... 33 3.6.1. 3.6.2. 3.5.1. 3.5. 3.6. 3.7. 4 Application Interfaces ....................................................................................................................... 36 USB Interface .......................................................................................................................... 36 USB_BOOT ............................................................................................................................. 37

(U)SIM Interface ...................................................................................................................... 39 UART ....................................................................................................................................... 41 4.1. 4.2. 4.3. 4.4. EG92_Series_Hardware_Design 5 / 79 LTE Standard Module Series 4.5. 4.6. 4.7. 4.8. PCM and I2C Interfaces .......................................................................................................... 43 ADC Interface .......................................................................................................................... 45 SPI ........................................................................................................................................... 46 Indication Signal ...................................................................................................................... 47 4.8.1. Network Status Indication .............................................................................................. 47 4.8.2. STATUS ......................................................................................................................... 48 4.8.3. MAIN_RI ......................................................................................................................... 48 5.2. 5.1. 5 RF Specifications ............................................................................................................................... 50 Cellular Network ...................................................................................................................... 50 5.1.1. Antenna Interface & Frequency Bands .......................................................................... 50 5.1.2. Antenna Tuner Control Interface.................................................................................... 51 5.1.3. Transmitting Power ........................................................................................................ 52 5.1.4. Receiver Sensitivity ........................................................................................................ 53 5.1.5. Reference Design .......................................................................................................... 54 GNSS ...................................................................................................................................... 54 5.2.1. Antenna Interface & Frequency Bands .......................................................................... 55 5.2.2. GNSS Performance ....................................................................................................... 55 5.2.3. Reference Design .......................................................................................................... 56 5.2.3.1. GNSS Active Antenna .................................................................................... 56 GNSS Passive Antenna ................................................................................. 57 5.2.3.2. RF Routing Guidelines ............................................................................................................ 57 Requirements for Antenna Design .......................................................................................... 59 RF Connector Recommendation ............................................................................................ 60 5.3. 5.4. 5.5. 6 Electrical Characteristics and Reliability ........................................................................................ 62 Absolute Maximum Ratings .................................................................................................... 62 Power Supply Ratings ............................................................................................................. 62 Power Consumption ................................................................................................................ 63 Digital I/O Characteristics ........................................................................................................ 63 ESD ......................................................................................................................................... 63 Operating and Storage Temperatures .................................................................................... 64 6.1. 6.2. 6.3. 6.4. 6.5. 6.6. 7 Mechanical Information ..................................................................................................................... 65 7.1. Mechanical Dimensions .......................................................................................................... 65 Recommended Footprint ......................................................................................................... 67 7.2. Top and Bottom Views ............................................................................................................ 68 7.3. 8 Storage, Manufacturing & Packaging .............................................................................................. 69 8.1. Storage Conditions .................................................................................................................. 69 8.2. Manufacturing and Soldering .................................................................................................. 70 Packaging Specification .......................................................................................................... 71 8.3. 8.3.1. Carrier Tape ................................................................................................................... 72 8.3.2. Plastic Reel .................................................................................................................... 72 8.3.3. Mounting Direction ......................................................................................................... 73 8.3.4. Packaging Process ........................................................................................................ 73 EG92_Series_Hardware_Design 6 / 79 LTE Standard Module Series 9 Appendix References ........................................................................................................................ 75 EG92_Series_Hardware_Design 7 / 79 LTE Standard Module Series Table Index Table 1: Brief Introduction .......................................................................................................................... 13 Table 2: Frequency Bands and Functions ................................................................................................. 14 Table 3: Key Features ................................................................................................................................ 14 Table 4: Parameter Definition .................................................................................................................... 17 Table 5: Pin Definition ................................................................................................................................ 17 Table 6: Operating Modes Overview ......................................................................................................... 23 Table 7: VBAT and GND Pins .................................................................................................................... 28 Table 8: Pin Definition of PWRKEY ........................................................................................................... 30 Table 9: Pin Definition of RESET_N .......................................................................................................... 34 Table 10: Pin Definition of USB Interface .................................................................................................. 36 Table 11: Pin Definition of USB_BOOT ..................................................................................................... 38 Table 12: Pin Definition of (U)SIM Interface .............................................................................................. 39 Table 13: UART Information ...................................................................................................................... 41 Table 14: Pin Definition of Main UART ...................................................................................................... 41 Table 15: Pin Definition of Main UART ...................................................................................................... 42 Table 16: Pin Definition of PCM Interface .................................................................................................. 45 Table 17: Pin Definition of I2C Interface .................................................................................................... 45 Table 18: Pin Definition of ADC Interface .................................................................................................. 46 Table 19: Characteristics of ADC Interface ............................................................................................... 46 Table 20: Pin Definition of SPI ................................................................................................................... 46 Table 21: Pin Definition of Indication Signal .............................................................................................. 47 Table 22: Network Status Indication Pin Level and Module Network Status ............................................ 47 Table 23: MAIN_RI Level and Module Status ............................................................................................ 49 Table 24: Pin Definition of Cellular Antenna Interface ............................................................................... 50 Table 25: Operating Frequency of EG92-NA (Unit: MHz) ......................................................................... 50 Table 26: Operating Frequency of EG92-EU (Unit: MHz) ......................................................................... 51 Table 27: Pin Definition of GRFC Interface ............................................................................................... 51 Table 28: Truth Table of GRFC Interfaces for EG92-NA (Unit: MHz) ....................................................... 52 Table 29: Truth Table of GRFC Interfaces for EG92-EU (Unit: MHz) ....................................................... 52 Table 30: RF Transmitting Power .............................................................................................................. 52 Table 31: Conducted RF Receiver Sensitivity of EG92-EU (Unit: dBm) ............................................. 53 Table 32: Pin Definition of GNSS Antenna Interface ................................................................................. 55 Table 33: GNSS Frequency (Unit: MHz) .................................................................................................... 55 Table 34: GNSS Performance ................................................................................................................... 55 Table 35: Requirements for Antenna Design ............................................................................................. 59 Table 36: Absolute Maximum Ratings ....................................................................................................... 62 Table 37: Modules Power Supply Ratings ................................................................................................ 62 Table 38: VDD_EXT I/O Characteristics (Unit: V) ..................................................................................... 63 Table 39: (U)SIM Low/High-voltage I/O Characteristics (Unit: V) ............................................................. 63 Table 40: ESD Characteristics (Temperature: 2530 C, Humidity: 40 5 %; Unit: kV) ........................... 64 Table 41: Operating and Storage Temperatures (Unit: C) ....................................................................... 64 EG92_Series_Hardware_Design 8 / 79 LTE Standard Module Series Table 42: Recommended Thermal Profile Parameters ............................................................................. 71 Table 43: Carrier Tape Dimension Table (Unit: mm) ................................................................................. 72 Table 44: Plastic Reel Dimension Table (Unit: mm) .................................................................................. 73 Table 45: Related Documents .................................................................................................................... 75 Table 46: Terms and Abbreviations ........................................................................................................... 75 EG92_Series_Hardware_Design 9 / 79 LTE Standard Module Series Figure Index Figure 1: Module Power Consumption in Sleep Mode .............................................................................. 24 Figure 2: Block Diagram of UART Application in Sleep Mode .................................................................. 24 Figure 3: Block Diagram of Application with USB Remote Wakeup Function in Sleep Mode .................. 25 Figure 4: Block Diagram of Application with RI Function in Sleep Mode .................................................. 26 Figure 5: Block Diagram of Application without USB Suspend Function in Sleep Mode .......................... 26 Figure 6: Reference Design of Power Input ............................................................................................... 28 Figure 7: Power Supply Limits During Burst Transmission ....................................................................... 29 Figure 8: Reference Design of Power Supply ............................................................................................ 30 Figure 9: Reference Design of Turn-On with Driving Circuit ..................................................................... 31 Figure 10: Reference Design of Turn-On with Keystroke .......................................................................... 31 Figure 11: Timing of Turn-On with PWRKEY ............................................................................................ 32 Figure 12: Timing of Turn-Off with PWRKEY ............................................................................................ 33 Figure 13: Reference Design of Reset with Driving Circuit ....................................................................... 34 Figure 14: Reference Design of Reset with Button.................................................................................... 34 Figure 15: Timing of Reset ......................................................................................................................... 35 Figure 16: Reference Design of USB Interface ......................................................................................... 37 Figure 17: Reference Design of USB_BOOT ............................................................................................ 38 Figure 18: Timing of Entering Emergency Download Mode ...................................................................... 38 Figure 19: Reference Design of (U)SIM Interface with an 8-pin (U)SIM Card Connector ........................ 40 Figure 20: Reference Design of (U)SIM Interface with a 6-pin (U)SIM Card Connector .......................... 40 Figure 21: Reference Design of UART with a Voltage-level Translator .................................................... 42 Figure 22: Reference Design of UART with Transistor Circuit .................................................................. 43 Figure 23: Timing of Short Frame Mode .................................................................................................... 44 Figure 24: Timing of Long Frame Mode ..................................................................................................... 44 Figure 25: Reference Design of PCM and I2C Interfaces ......................................................................... 45 Figure 26: Reference Design of SPI with a Level-Shifting Chip ................................................................ 47 Figure 27: Reference Design of Network Status Indication ....................................................................... 48 Figure 28: Reference Design of STATUS .................................................................................................. 48 Figure 29: Reference Design of Main Antenna and Diversity Antenna ..................................................... 54 Figure 30: Reference Design of GNSS Active Antenna ............................................................................ 56 Figure 31: Reference Design of GNSS Passive Antenna ......................................................................... 57 Figure 32: Microstrip Design on a 2-layer PCB ......................................................................................... 58 Figure 33: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 58 Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 58 Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 59 Figure 36: Dimensions of the Receptacle (Unit: mm) .......................................................................... 60 Figure 37: Specifications of Mated Plugs (Unit: mm) .......................................................................... 61 Figure 38: Space Factor of the Mated Connectors (Unit: mm) ........................................................... 61 Figure 39: Top and Side Dimensions ......................................................................................................... 65 Figure 40: Bottom Dimensions ................................................................................................................... 66 Figure 41: Recommended Footprint .......................................................................................................... 67 EG92_Series_Hardware_Design 10 / 79 LTE Standard Module Series Figure 42: Top & Bottom Views of the Module .......................................................................................... 68 Figure 43: Recommended Reflow Soldering Thermal Profile ................................................................... 70 Figure 44: Carrier Tape Dimension Drawing ......................................................................................... 72 Figure 45: Plastic Reel Dimension Drawing .......................................................................................... 72 Figure 46: Mounting Direction ................................................................................................................ 73 Figure 47: Packaging Process ................................................................................................................ 74 EG92_Series_Hardware_Design 11 / 79 LTE Standard Module Series 1 Introduction This document describes the EG92 series module features, performance, and air interfaces and hardware interfaces connected to your applications. The document provides a quick insight into interface specifications, RF performance, electrical and mechanical specifications, and other module information, as well. This document is applicable to the following modules:

EG92-EU EG92-NA EG92_Series_Hardware_Design 12 / 79 LTE Standard Module Series 2 Product Overview The module is an SMD module with compact packaging, which is engineered to meet most of the demands of M2M and IoT applications, for instance:

Smart metering Wearable devices Environmental monitoring Asset tracking Fleet Management Security and alarm systems Table 1: Brief Introduction Item Packaging type Pin counts Dimensions Weight Models Description LGA 102 pins

(26.5 0.2) mm x (22.5 0.2) mm x (2.3 0.2) mm 3.8 g EG92-EU EG92-NA EG92_Series_Hardware_Design 13 / 79 LTE Standard Module Series 2.1. Frequency Bands and Functions Table 2: Frequency Bands and Functions Technology EG92-EU EG92-NA LTE-FDD B1/B3/B7/B8/B20/B28 B2/B4/B5/B12/B13/B66/B71 WCDMA B1/B8 GSM GNSS EGSM900/DCS1800 GPS, GLONASS, BDS, Galileo, QZSS

2.2. Key Features Table 3: Key Features Feature Capability Supply Voltage 3.34.3 V Typ.: 3.8 V SMS Text and PDU mode Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default USB Interface One USB interface Complies with USB 2.0 specification (slave mode only) Data rate: up to 480 Mbps Use: AT command communication, data transmission, GNSS NMEA sentence output, software debugging, firmware upgrade and voice over USB USB serial drivers under Windows 7/8/8.1/10/11, Linux 2.66.5 and Android 4.x13.x systems

(U)SIM Interfaces 1.8 V and 3.0 V UARTs Two UART Main UART:

Use: AT command communication and data transmission Baud rate: 921600 bps RTS and CTS hardware flow control Debug UART:

EG92_Series_Hardware_Design 14 / 79 LTE Standard Module Series Use: Linux console and log output Baud rate: 115200 bps One digital audio interface GSM: HR, FR, EFR, AMR and AMR-WB WCDMA: AMR and AMR-WB LTE: AMR and AMR-WB Echo cancellation and noise suppression Use: audio data transmission between the module and the external codec 16-bit linear data format Long and short frame synchronization Master and slave modes (but must be in master mode for long frame synchronization) One SPI Master mode only One-to-one connection, without chip selection Clock rate: up to 50 MHz Audio Features PCM Interface SPI Network Indication NET_STATUS:

Use: network connectivity status indication Complies with the AT commands defined in 3GPP TS 27.007 and 3GPP TS AT Commands 27.005 Complies with Quectel enhanced AT commands Rx-diversity LTE and WCDMA Rx-diversity Antenna Interfaces Transmitting Power LTE Features UMTS Features One main antenna interface (ANT_MAIN) One Rx-diversity antenna interface (ANT_DRX) One GNSS antenna interface (ANT_GNSS) 50 characteristic impedance LTE-FDD: Class 3 (23 dBm 2 dB) WCDMA: Class 3 (23 dBm 2 dB) DCS1800 8-PSK: Class E2 (26 dBm 3 dB) EGSM900 8-PSK: Class E2 (27 dBm 3 dB) DCS1800: Class 1 (30 dBm 2 dB) EGSM900: Class 4 (33 dBm 2 dB) Complies with 3GPP Rel-8 specification Max. LTE category: Cat 1 1.4/3/5/10/15/20 MHz RF bandwidths Modulations:

DL: QPSK, 16QAM and 64QAM UL: QPSK, 16QAM LTE-FDD max. data rates: 10 Mbps (DL)/5 Mbps (UL) Complies with 3GPP Rel-8 specification DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Modulations: QPSK, 16QAM and 64QAM Max. data rates:

EG92_Series_Hardware_Design 15 / 79 LTE Standard Module Series DC-HSDPA: 42 Mbps (DL) HSUPA: 5.76 Mbps (UL) WCDMA: 384 kbps (DL/UL) GPRS:

GPRS multi-slot class 33 (33 by default) Coding scheme: CS 14 Max. data rates: 107 kbps (DL)/85.6 kbps (UL) EDGE:

EDGE multi-slot class 33 (33 by default) Coding scheme: GMSK and 8-PSK DL coding schemes: MCS 19 UL coding schemes: MCS 19 Max. data rates: 296 kbps (DL)/236.8 kbps (UL) GPS, GLONASS, BDS, Galileo and QZSS Complies with NMEA 0183 protocol The data update rate is 1 Hz by default and 10 Hz maximally Complies with TCP, UDP, PPP, NTP, NITZ, FTP, HTTP, PING, QMI, CMUX, HTTPS, FTPS, SSL, FILE, MQTT, MMS, SMTP and SMTPS protocols PAP and CHAP for PPP connections Normal operating temperature 1: -35 C to +75 C Extended operating temperature 2: -40 C to +85 C Storage temperature: -40 C to +90 C GSM Features GNSS Features Internet Protocol Features Temperature Ranges Firmware Upgrade USB 2.0 interface DFOTA RoHS All hardware components are fully Complies with EU RoHS directive 1 Within this range, the modules performance complies with 3GPP requirements. 2 Within this range, the module retains the ability to establish and maintain functions such as voice and SMS, without any unrecoverable malfunction. Radio spectrum and radio network remain uninfluenced, whereas the value of one or more parameters, such as Pout, may decrease and fall below the range of the 3GPP specified tolerances. When the temperature returns to the normal operating temperature range, the modules performance will comply with 3GPP requirements again. EG92_Series_Hardware_Design 16 / 79 LTE Standard Module Series 2.3. Pin Description Table 4: Parameter Definition Parameters AI AIO DI DO DIO OD PI PO Descriptions Analog Input Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output DC characteristics include power domain and rate current, etc. Table 5: Pin Definition Power Supply Pin Name Pin No. I/O Description DC Characteristic Comment VBAT_BB 32, 33 PI Power supply for the modules BB part VBAT_RF 52, 53 PI Power supply for the modules RF part Vmax = 4.3 V Vmin = 3.3 V Vnom = 3.8 V It must be provided with sufficient current up to 0.8 A. A test point is recommended to be reserved. It must be provided with sufficient current up to 1.8 A in a burst transmission. A test point is recommended to be reserved. VDD_EXT 29 PO Provide 1.8 V for Vnom = 1.8 V Power supply for EG92_Series_Hardware_Design 17 / 79 LTE Standard Module Series external circuit IOmax = 50 mA external GPIOs pull-up circuits. A test point is recommended to be reserved. GND 3, 31, 47, 48, 50, 54, 55, 58, 59, 61, 62, 6774, 7982, 8991, 100102 Turn On/Off Pin Name Pin No. I/O Description DC Characteristic Comment PWRKEY 15 DI Turn on/off the module RESET_N 17 DI Reset the module VIHmax = 2.1 V VIHmin = 1.3 V VILmax = 0.5 V The output voltage is 0.8 V because of the diode drop in the baseband chipset. A test point is recommended to be reserved. 1.8 V power domain. A test point is recommended to be reserved if unused. Indication Interfaces Pin Name Pin No. I/O Description DC Characteristic Comment STATUS 20 DO NET_STATUS 21 DO Indicate the module's operation status Indicate the module's network activity status VDD_EXT If unused, keep it open. USB Interface Pin Name Pin No. I/O Description DC Characteristic Comment USB_VBUS 8 AI USB connection detect USB_DP 9 AIO USB_DM 10 AIO USB 2.0 differential data (+) USB 2.0 differential data (-) Vmax = 5.25 V Vmin = 3.0 V Vnom = 5.0 V A test point must be reserved. Require differential impedance of 90 . Test points must be reserved.

(U)SIM Interfaces Pin Name Pin No. I/O Description DC Characteristic Comment EG92_Series_Hardware_Design 18 / 79 LTE Standard Module Series USIM1_VDD 43 PO

(U)SIM1 card power supply IOmax = 50 mA Low-voltage:

Vmax = 1.9 V Vnom = 1.8 V Vmin = 1.7 V High-voltage:

Vmax = 3.05 V Vnom = 2.85 V Vmin = 2.7 V Either 1.8 V or 3.0 V is supported by the module automatically. USIM1_DATA 45 DIO

(U)SIM1 card data USIM1_CLK 46 DO

(U)SIM1 card clock USIM1_VDD USIM1_RST 44 DO

(U)SIM1 card reset USIM1_DET 42 DI

(U)SIM1 card hot-plug detect VDD_EXT If unused, keep it open. USIM2_VDD 87 PO

(U)SIM2 card power supply IOmax = 50 mA Low-voltage:

Vmax = 1.9 V Vnom = 1.8 V Vmin = 1.7 V High-voltage:

Vmax = 3.05 V Vnom = 2.85 V Vmin = 2.7 V Either 1.8 V or 3.0 V is supported by the module automatically. USIM2_DATA 86 DIO

(U)SIM2 card data USIM2_CLK 84 DO

(U)SIM2 card clock USIM2_VDD USIM2_RST 85 DO

(U)SIM2 card reset USIM2_DET 83 DI

(U)SIM2 card hot-plug detect VDD_EXT If unused, keep them open. Main UART Pin Name Pin No. I/O Description DC Characteristic Comment MAIN_CTS 36 DO Clear to send signal to the module VDD_EXT If unused, keep it open. Connect to the MCU's CTS. MAIN_RTS 37 DI Request to send signal If unused, keep it open. EG92_Series_Hardware_Design 19 / 79 LTE Standard Module Series from the module Connect to the MCU's RTS. MAIN_RXD 34 DI Main UART receive MAIN_DCD 38 DO Main UART data carrier detect MAIN_TXD 35 DO Main UART transmit MAIN_RI 39 DO MAIN_DTR 30 DI Main UART ring indication Main UART data terminal ready If unused, keep them open. Pulled up by default. The pin can wake up the module in the low level. If unused, keep it open. Debug UART Pin Name Pin No. I/O Description DC Characteristic Comment DBG_RXD 22 DI Debug UART receive DBG_TXD 23 DO Debug UART transmit VDD_EXT Test points must be reserved. I2C Interface Pin Name Pin No. I/O Description DC Characteristic Comment I2C_SCL 40 OD I2C_SDA 41 OD I2C serial clock (for external codec) I2C serial data (for external codec) VDD_EXT Externally pulled up to 1.8 V. If unused, keep them open. PCM Interface Pin Name PCM_SYNC PCM_CLK PCM_DIN PCM_DOUT Pin No. 5 4 6 7 I/O Description DC Characteristic Comment DIO PCM data frame sync DIO PCM clock DI PCM data input DO PCM data output VDD_EXT Master mode: output. Slave mode: input. If unused, keep it open. If unused, keep them open. RF Antenna Interfaces Pin Name Pin No. I/O Description DC Characteristic Comment ANT_MAIN 60 AIO Main antenna interface 50 impedance. EG92_Series_Hardware_Design 20 / 79 LTE Standard Module Series ANT_DRX 56 AI ANT_GNSS 49 AI Diversity antenna interface GNSS antenna interface Antenna Tuner Control Interfaces 50 impedance. If unused, keep them open. Pin Name Pin No. I/O Description DC Characteristic Comment GRFC1 76 DO Generic RF Controller GRFC2 77 DO Generic RF Controller If unused, keep them open. SPI Pin Name Pin No. I/O Description DC Characteristic Comment SPI_CLK 26 DO SPI clock SPI_DIN 28 DI SPI data input VDD_EXT SPI_DOUT 27 DO SPI data output Master mode only. If unused, keep them open. ADC Interface Pin Name Pin No. I/O Description DC Characteristic Comment ADC0 24 AI General-purpose ADC interface Voltage range:

0.3 V to VBAT_BB If unused, keep it open. Other Interfaces Pin Name Pin No. I/O Description DC Characteristic Comment USB_BOOT 75 DI Force the module into emergency download mode W_DISABLE#

18 DI Airplane mode control VDD_EXT Application processor ready AP_READY 19 DI RESERVED Pins Pin Name Pin No. RESERVED 1, 2, 1114, 16, 25, 51, 57, 6366, 78, 88, 9299 Cannot be pulled up before startup. A test point is recommended to be reserve. Pulled up by default. If unused, keep it open. If unused, keep it open. EG92_Series_Hardware_Design 21 / 79 LTE Standard Module Series NOTE 1. Keep all RESERVED pins and unused pins unconnected. 2. BOOT_CONFIG pins (SPI_CLK, USB_BOOT, PCM_CLK, PCM_SYNC, GRFC1) cannot be pulled up before startup. 2.4. EVB Kit Quectel supplies an evaluation board (UMTS&LTE EVB) with accessories to develop or test the module. For more details, see document [1]. EG92_Series_Hardware_Design 22 / 79 LTE Standard Module Series 3 Operating Characteristics 3.1. Operating Modes Table 6: Operating Modes Overview Modes Descriptions Full Functionality Mode Idle The module remains registered on the network but has no data interaction with the network. In this mode, the software is active. Voice/Data The module is connected to the network. In this mode, the power consumption is decided by network settings and data rates. Minimum Functionality Mode AT+CFUN=0 can set the module to the minimum functionality mode without removing the power supply. In this mode, both (U)SIM card and RF function are disabled. Airplane Mode Sleep Mode AT+CFUN=4 or W_DISABLE# can set the module to airplane mode. In this mode, RF function is disabled and all relevant AT commands are inaccessible. The module can still receive paging, SMS, voice call and TCP/UDP data from the network. In this mode, the power consumption is minimized. Shutdown Mode PMU shuts down the power supply. In this mode, software is not active. However, the voltage supply (for VBAT_RF and VBAT_BB) remains connected. NOTE For more details about AT+CFUN, see document [2]. EG92_Series_Hardware_Design 23 / 79 LTE Standard Module Series 3.2. Sleep Mode With DRX technology, power consumption of the module will be reduced to a minimal level. Figure 1: Module Power Consumption in Sleep Mode NOTE DRX cycle values are transmitted over the wireless network. 3.2.1. UART Application Scenario If the module communicates with the MCU via main UART, both the following preconditions should be met to set the module to sleep mode:

Execute AT+QSCLK=1. Ensure MAIN_DTR is held high or is kept unconnected. Figure 2: Block Diagram of UART Application in Sleep Mode EG92_Series_Hardware_Design 24 / 79 Power consumptionRun timeDRX OFF ON OFF ON ON OFF OFFON OFFMAIN_RXDMAIN_TXDMAIN_RIMAIN_DTRAP_READYTXDRXDEINTGPIOGPIOModuleMCUGNDGND LTE Standard Module Series Drive MAIN_DTR low with the MCU will wake up the module. When the module has a URC to report, MAIN_RI signal will wake up the MCU. See Chapter 4.8.3 for details about MAIN_RI. 3.2.2. USB Application Scenarios For the two situations (USB application with USB remote wakeup function and USB application with USB suspend/resume and RI function) below, three preconditions must be met to set the module to sleep mode:

Execute AT+QSCLK=1. Ensure MAIN_DTR is held high or is kept unconnected. Ensure the hosts USB bus, which is connected to the modules USB interface, enters suspend state. Sending data to the module through USB will wake up the module. 3.2.2.1. USB Application with USB Suspend/Resume and USB Remote Wakeup Function The host supports USB suspend/resume and remote wakeup function. Figure 3: Block Diagram of Application with USB Remote Wakeup Function in Sleep Mode When the module has a URC to report, the module will send remote wake-up signals through USB bus to wake up the host. 3.2.2.2. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wakeup function, the MAIN_RI signal is needed to wake up the host. EG92_Series_Hardware_Design 25 / 79 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostGNDGND LTE Standard Module Series Figure 4: Block Diagram of Application with RI Function in Sleep Mode When the module has a URC to report, the module will wake up the host through MAIN_RI signal. 3.2.2.3. USB Application without USB Suspend Function If the host does not support USB suspend function, the following three preconditions must be met to set the module to sleep mode:

Execute AT+QSCLK=1. Ensure MAIN_DTR is held high or is kept unconnected. Ensure USB_VBUS is disconnected via the external control circuit. Figure 5: Block Diagram of Application without USB Suspend Function in Sleep Mode Restore the power supply of USB_VBUS will wake up the module. EG92_Series_Hardware_Design 26 / 79 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostGNDGNDMAIN_RIEINTUSB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostMAIN_RIEINTExternal Control CircuitGPIOGNDGND LTE Standard Module Series NOTE 1. Pay attention to the level match shown in the dotted line between the module and the host. See document [4] for more details about EG92 series module power management application. 2. For details of AT+QSCLK, see document [2]. 3.3. Airplane Mode When the module enters airplane mode, the RF function does not work and all AT commands related to the RF function are inaccessible. The following ways can be used to let the module enter airplane mode. Hardware:

The W_DISABLE# pin is pulled up by default. Its control function for airplane mode is disabled by default, and AT+QCFG=airplanecontrol,1 can be used to enable the function. Driving the pin low after its control function for airplane mode is enabled by AT command, which can make the module enter the airplane mode. Software:

AT+CFUN=<fun> provides the choice of the functionality level through setting <fun> into 0, 1 or 4. AT+CFUN=0: Minimum functionality mode (disable (U)SIM and RF functions). AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode (disable RF function). NOTE 1. The execution of AT+CFUN does not affect GNSS function. 2. For details of AT+QCFG, see document [3]. 3.4. Power Supply 3.4.1. Power Supply Interface The module has four VBAT pins dedicate to connecting with the external power supply. EG92_Series_Hardware_Design 27 / 79 LTE Standard Module Series Table 7: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_BB 32, 33 Power supply for the modules BB part 3.3 3.8 VBAT_RF 52, 53 Power supply for the modules RF part 3.3 3.8 4.3 4.3 V V GND 3, 31, 47, 48, 50, 54, 55, 58, 59, 61, 62, 6774, 7982, 8991, 100102 3.4.2. Reference Design for Power Supply The performance of the module largely depends on the power supply design. The power supply of the module should be able to provide sufficient current of 2.0 A at least. If the voltage difference between input voltage and the supply voltage is small, it is suggested to use an LDO; if the voltage difference is big, a buck converter is recommended. The following figure shows a reference design for +5 V input power supply. The designed output of the power supply is about 3.8 V. Figure 6: Reference Design of Power Input NOTE To avoid corrupting the data in the internal flash, do not cut off the power supply to turn off the module when the module works normally. Only after turning off the module with PWRKEY or AT command can you cut off the power supply. EG92_Series_Hardware_Design 28 / 79 DC_INLDOINOUTENGNDADJVBAT 100 nF470 F100 nF470 F330R51K1%1%4.7K47KVBAT_EN LTE Standard Module Series 3.4.3. Requirements for Voltage Stability The power supply range of the module is from 3.3 V to 4.3 V. Ensure the input voltage never drops below 3.3 V. Figure 7: Power Supply Limits During Burst Transmission To decrease the voltage drop, use a bypass capacitor of about 100 F with low ESR (ESR 0.7 ), and reserve a multi-layer ceramic chip (MLCC) capacitor array with ultra-low ESR. Use three ceramic capacitors (100 nF, 33 pF, 10/100 pF 3 for VBAT_BB and 100 nF, 33 pF, 10 pF for VBAT_RF) for composing the MLCC array, and place these capacitors close to the VBAT pins. The main power supply from an external application should be a single voltage source and can be expanded to two sub paths routed as the star configuration. The width of VBAT_BB trace and VBAT_RF trace should be at least 1 mm and 2 mm respectively. As per design rules, the longer the VBAT trace is, the wider it should be. To avoid the ripple and surge and ensure the stability of the power supply to the module, add a TVS component with VRWM = 4.5 V, low clamping Vc and high reverse peak pulse current Ipp near the power supply. 3 For EG92-EU, the capacitance value is 10 pF. For EG92-NA, the capacitance value is 100 pF. EG92_Series_Hardware_Design 29 / 79 Power Supply (V)Burst TransmissionRippleDropBurst TransmissionLoad (A) LTE Standard Module Series Figure 8: Reference Design of Power Supply 3.4.4. Power Supply Voltage Monitoring You can use AT+CBC to monitor and query the VBAT_BB voltage. For details, see document [2]. 3.5. Turn-On 3.5.1. Turn-On with PWRKEY Table 8: Pin Definition of PWRKEY Pin Name Pin No. I/O Description Comment PWRKEY 15 DI Turn on/off the module The output voltage is 0.8 V because of the diode drop in the baseband chipset. A test point is recommended to be reserved. When the module is in turn-off state, it can be turned on by driving PWRKEY low for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY. After STATUS outputs high-level voltage, the PWRKEY can be released. EG92_Series_Hardware_Design 30 / 79 ModuleVBAT_RFVBAT_BBVBATC1100FC6100nFC733pFC810pF++C2100nFC5100FC333pFC410/100 pFD1TVSNOTE:For EG92-EU, the capacitance value of C4 is 10 pF.For EG92-NA, the capacitance value of C4 is 100 pF. LTE Standard Module Series Figure 9: Reference Design of Turn-On with Driving Circuit The module can also be turned on by pressing the PWRKEY button. A ESD component should be placed near the button for protection against ESD, since static electricity may be generated by the finger touching. Figure 10: Reference Design of Turn-On with Keystroke EG92_Series_Hardware_Design 31 / 79 PWRKEY 500 msMCUGPIOModuleTurn-on pulse4.7K47KQ110nFPWRKEYModuleS1Close to S1ESD1KTurn-on pulseR1 LTE Standard Module Series Figure 11: Timing of Turn-On with PWRKEY

. NOTE 1. Ensure that VBAT is stable for at least 30 ms before driving the PWRKEY low. 2. If the module needs to turn on automatically but does not need turn-off function, PWRKEY can be driven low directly to ground with a recommended 10 k resistor. 3. BOOT_CONFIG pins (SPI_CLK, USB_BOOT, PCM_CLK, PCM_SYNC, GRFC1) cannot be pulled up before startup. 3.6. Turn-Off 3.6.1. Turn-Off with PWRKEY Drive PWRKEY low for at least 650 ms and then release it to turn off the module. EG92_Series_Hardware_Design 32 / 79 VIL 0.5VVBATPWRKEY 500msRESET_NSTATUS(DO)InactiveActiveUARTInactiveActiveUSB 12s 14sVDD_EXTBOOT_CONFIG &USB_BOOT Pins About 100 ms11sNOTE 1 100 ms. After this time, the BOOT_CONFIG pins can be set to high level by the external circuit.VIH0.8 V LTE Standard Module Series Figure 12: Timing of Turn-Off with PWRKEY 3.6.2. Turn-Off with AT Command To turn off the module, you can also execute AT+QPOWD, which has similar timing and effect as turning off the module through driving PWRKEY low. See document [2] for details about AT+QPOWD. NOTE 1. To avoid corrupting the data in the internal flash, do not switch off the power supply to turn off the module when the module works normally. Only after turning off the module with PWRKEY or AT command can you cut off the power supply. 2. When turning off the module with the AT command, keep PWRKEY at high level after the execution of the command. Otherwise, the module will be turned on automatically again after successful turn-off. 3.7. Reset Drive RESET_N low for at least 150-460 ms and then release it to reset the module. RESET_N signal is sensitive to interference, consequently it is recommended to route the trace as short as possible and surround it with ground. EG92_Series_Hardware_Design 33 / 79 VBATPWRKEY 30 s 650 msRunningPower-down procedureOFFModuleStatusSTATUS LTE Standard Module Series Table 9: Pin Definition of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 17 DI Reset the module 1.8 V power domain. A test point is recommended to be reserved if unused. The recommended circuit for reset function is similar to the PWRKEY control circuit. You can use an open drain/collector driver or a button to control RESET_N. Figure 13: Reference Design of Reset with Driving Circuit Figure 14: Reference Design of Reset with Button EG92_Series_Hardware_Design 34 / 79 RESET_N 150-460 msMCUGPIOModuleReset pulse4.7K47KQ1RESET_NModuleS2Close to S2ESD1KReset pulseR1 LTE Standard Module Series Figure 15: Timing of Reset NOTE 1. Use RESET_N only when you fail to turn off the module with the AT+QPOWD and PWRKEY. 2. Ensure the capacitance on PWRKEY and RESET_N is no more than 10 nF. EG92_Series_Hardware_Design 35 / 79 VIL 0.5 VVIH 1.3 VVBAT 150 msResettingModule StatusRunningRESET_NRestart 460 ms LTE Standard Module Series 4 Application Interfaces 4.1. USB Interface The module contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface can only serve as the slave device. USB interface is used for AT command communication, data transmission, GNSS NMEA sentence output, software debugging, firmware upgrade and voice over USB. Table 10: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_VBUS 8 AI USB connection detect Test point must be reserved. USB_DP 9 AIO USB 2.0 differential data (+) Require differential impedance of 90 . USB_DM 10 AIO USB 2.0 differential data (-) Test points must be reserved. USB 2.0 interface can be used for firmware upgrade and test points must be reserved for debugging in your designs. EG92_Series_Hardware_Design 36 / 79 LTE Standard Module Series Figure 16: Reference Design of USB Interface It is recommended to add a common-mode choke L1 in series between MCU and the module to suppress EMI spurious transmission. Meanwhile, it is also suggested to add R1 and R2 in series between the module and test points for debugging. These resistors are not mounted by default. To ensure the signal integrity of USB 2.0 data transmission, you should place L1, R1 and R2 close to the module, and keep these resistors close to each other. Moreover, keep extra stubs of trace as short as possible. To ensure performance, you should follow the following principles when designing USB interface:

Route USB signal traces as differential pairs with surrounded ground. The impedance of USB differential trace is 90 . Route USB differential traces at the inner-layer of the PCB, and surround the traces with ground on that layer and ground planes above and below. For signal traces, provide clearance from power supply traces, crystal-oscillators, magnetic devices, sensitive signals like RF signals, analog signals, and noise signals generated by clock, DC-DC, etc. Pay attention to the impact caused by stray capacitance of the ESD protection component on USB data lines. Typically, the stray capacitance should be less than 2 pF for USB . If possible, reserve two 0 resistors on USB_DP and USB_DM traces respectively. For more details about the USB specifications, visit http://www.usb.org/home. 4.2. USB_BOOT The module has a USB_BOOT for emergency download. Pulling up USB_BOOT to VDD_EXT before turning on the module, and then the module will enter emergency download mode. In this mode, the module supports firmware upgrade over USB interface. EG92_Series_Hardware_Design 37 / 79 USB_DPUSB_DMGNDUSB_DPUSB_DMGNDL1Close to moduleR1R2Test PointsESD ArrayNM_0 RNM_0 RMinimize these stubsModuleMCUUSB_VBUSVDD LTE Standard Module Series Table 11: Pin Definition of USB_BOOT Pin Name Pin No. I/O Description Comment USB_BOOT 75 DI Force the module into emergency download mode Cannot be pulled up before startup. A test point is recommended to be reserve. Figure 17: Reference Design of USB_BOOT Figure 18: Timing of Entering Emergency Download Mode EG92_Series_Hardware_Design 38 / 79 ModuleUSB_BOOTVDD_EXT4.7KTest PointsESDClose to test pointsVIL 0.5 VV=0.8VVBATPWRKEY 500 msRESET_NVDD_EXT 100 msUSB_BOOTUSB_BOOT can be pulled up to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is turned on.NOTE 1 IH LTE Standard Module Series NOTE 1. Ensure VBAT is stable before driving PWRKEY low. The time period between powering VBAT up and driving PWRKEY low shall be at least 30 ms. 2. Follow the above timing when using MCU control the module to enter the emergency download 3. mode. Do not pull up USB_BOOT to 1.8 V before powering up VBAT. If you need to manually force the module to enter emergency download mode, directly connect the test points shown in Figure 17. 4.3. (U)SIM Interface The (U)SIM interface meets ETSI and IMT-2000 requirements. Either 1.8 V or 3.0 V (U)SIM card is supported. and only one (U)SIM card can work at a time. The (U)SIM1 and (U)SIM2 cards can be switched by AT+QDSIM. For more details, see document [5]. Table 12: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Description Comment USIM1_VDD 43 PO

(U)SIM1 card power supply USIM1_DATA 45 DIO

(U)SIM1 card data USIM1_CLK 46 DO

(U)SIM1 card clock USIM1_RST 44 DO

(U)SIM1 card reset Either 1.8 V or 3.0 V is supported by the module automatically. USIM1_DET 42 DI

(U)SIM1 card hot-swap detect If unused, keep it open. USIM2_VDD 87 PO

(U)SIM2 card power supply USIM2_DATA 86 DIO

(U)SIM2 card data Either 1.8 V or 3.0 V is supported by the module automatically. USIM2_CLK 84 DO

(U)SIM2 card clock If unused, keep them open. USIM2_RST 85 DO

(U)SIM2 card reset USIM2_DET 83 DI

(U)SIM2 card detect If unused, keep it open. The module supports (U)SIM card hot-swap via the USIM_DET, and both high-level and low-level detections are supported. Hot-swap function is disabled by default and you can use AT+QSIMDET to EG92_Series_Hardware_Design 39 / 79 LTE Standard Module Series configure this function. See document [2] for more details. Figure 19: Reference Design of (U)SIM Interface with an 8-pin (U)SIM Card Connector If the function of (U)SIM card hot-swap is not needed, keep USIM_DET unconnected. Figure 20: Reference Design of (U)SIM Interface with a 6-pin (U)SIM Card Connector To enhance the reliability and availability of the (U)SIM card in applications, you should follow the principles below in the (U)SIM circuit design:

Place the (U)SIM card connector close to the module. Keep the trace length less than 200 mm if possible. EG92_Series_Hardware_Design 40 / 79 ModuleUSIM_VDDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_DET0R0R0RVDD_EXT51K100 nF(U)SIM Card ConnectorGNDGND33 pF33 pF33 pFVCCRSTCLKIOVPPGNDGND15KESD ArrayCD1CD2ModuleUSIM_VDDUSIM_RSTUSIM_CLKUSIM_DATA0R0R0R100 nF(U)SIM Card ConnectorGNDVCCRSTCLKIOVPPGND15K33 pF33 pF33 pFESD Array LTE Standard Module Series Route (U)SIM card differential traces at the inner-layer of the PCB, and surround the traces with ground on that layer and ground planes above and below. For signal traces, provide clearance from power supply traces, crystal-oscillators, magnetic devices, sensitive signals like RF signals, analog signals, and noise signals generated by clock, DC-DC, etc. Ensure the tracing between the (U)SIM card connector and the module is short and wide. Keep the trace width of ground and USIM_VDD at least 0.5 mm to keep the same electric potential. To avoid cross talk between USIM_DATA and USIM_CLK, keep the traces away from each other and shield them with surrounded ground. To offer better ESD protection, you can add a ESD array of which the parasitic capacitance should be less than 15 pF. Add 0 resistors in series between the module and the (U)SIM card connector to facilitate debugging. Additionally, add 33 pF capacitors in parallel among USIM_DATA, USIM_CLK and USIM_RST signal traces to filter out RF interference. For USIM_DATA, it is recommended to add a 15 k pull-up resistor near the (U)SIM card connector to improve the anti-jamming capability of the (U)SIM card. 4.4. UART The module has two UART:

Table 13: UART Information UART Types Supported Baud Rates

(bps) Default Baud Rates

(bps) Functions Main UART 4800/9600/19200/38400/

57600/115200/230400/

460800/921600 115200 Data transmission AT command communication Debug UART 115200 115200 Linux console and log output Table 14: Pin Definition of Main UART Pin Name Pin No. I/O Description Comment MAIN_CTS 36 DO Main UART clear to send MAIN_RTS MAIN_RXD 37 34 DI Main UART request to send DI Main UART receive If unused, keep it open. If unused, keep it open. Connect to the MCUl's CTS. If unused, keep it open. Connect to the MCU's RTS. EG92_Series_Hardware_Design 41 / 79 LTE Standard Module Series MAIN_DCD MAIN_TXD MAIN_RI 38 35 39 DO DO DO Main UART data carrier detect Main UART transmit Main UART ring indication MAIN_DTR 30 DI Main UART data terminal ready Pulled up by default. The pin can wake up the module in the low level. If unused, keep it open. Table 15: Pin Definition of Main UART Pin Name Pin No. DBG_RXD DBG_TXD 22 23 I/O DI Description Comment Debug UART receive DO Debug UART transmit If unused, keep it open. Test points must be reserved. The module has 1.8 V UART. You can use a voltage-level translator between the module and MCUs UART if the MCU is equipped with a 3.3 V UART. Figure 21: Reference Design of UART with a Voltage-level Translator Another example of transistor circuit is shown as below. For the design of input/output circuits in dotted lines, see that shown in solid lines, but pay attention to the direction of the connection. EG92_Series_Hardware_Design 42 / 79 VCCAVCCBOEA1A2A3A4A5A6A7A8GNDB1B2B3B4B5B6B7B8VDD_EXTMAIN_RIMAIN_DCDMAIN_RTSMAIN_RXDMAIN_DTRMAIN_CTSMAIN_TXD51K51K0.1 F0.1 FRI_MCUDCD_MCURTS_MCUTXD_MCUDTR_MCUCTS_MCURXD_MCUVDD_MCULevel-shifting Chip10K120K LTE Standard Module Series Figure 22: Reference Design of UART with Transistor Circuit NOTE 1. Transistor circuit above is not suitable for applications with baud rates exceeding 460 kbps. 2. Please note that the module's CTS is connected to the MCU's CTS, and the module's RTS is connected to the MCU's RTS. 4.5. PCM and I2C Interfaces The module has one PCM interfaces and one I2C interfaces. The PCM interface supports the following modes:

Short frame mode: the module works as both the slave and the master device Long frame mode: the module works as the master device only The module supports 16-bit linear encoding format. The following figures are the short frame mode timing diagram (PCM_SYNC = 8 kHz, PCM_CLK = 2048 kHz) and the long frame mode timing diagram

(PCM_SYNC = 8 kHz, PCM_CLK = 256 kHz). EG92_Series_Hardware_Design 43 / 79 MCUTXDRXDVDD_EXT10KVCC_MCU4.7K10KVDD_EXTMAIN_TXDMAIN_RXDMAIN_RTSMAIN_CTSMAIN_DTRMAIN_RIRTSCTSGNDGPIOMAIN_DCDModuleGPIOEINTVDD_EXT4.7KGND1 nF1 nF LTE Standard Module Series Figure 23: Timing of Short Frame Mode In short frame mode, data is sampled on the falling edge of PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, PCM_CLK supports 256 kHz, 512 kHz, 1024 kHz and 2048 kHz when PCM_SYNC operates at 8 kHz, and also supports 4096 kHz when PCM_SYNC operates at 16 kHz. Figure 24: Timing of Long Frame Mode In long frame mode, data is also sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. But in this mode, the PCM_SYNC rising edge represents the MSB. PCM_CLK supports 256 kHz, 512 kHz, 1024 kHz and 2048 kHz when PCM_SYNC reaches 8 kHz with a 50 % duty cycle. The clock and mode of PCM can be configured by AT+QDAI, and the default configuration is short frame mode (PCM_CLK = 2048 kHz, PCM_SYNC = 8 kHz). For details, see document [2] about AT command. EG92_Series_Hardware_Design 44 / 79 PCM_CLKPCM_SYNCPCM_DOUTMSBLSBMSB125 s12256255PCM_DINMSBLSBMSBPCM_CLKPCM_SYNCPCM_DOUTMSBLSBPCM_DIN125 sMSB123231LSB LTE Standard Module Series Figure 25: Reference Design of PCM and I2C Interfaces Table 16: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_SYNC PCM_CLK PCM_DIN PCM_DOUT 5 4 6 7 DIO PCM data frame sync DIO PCM clock Master mode: output. Slave mode: input. If unused, keep it open. DI PCM data input If unused, keep it open. DO PCM data output If unused, keep it open. Table 17: Pin Definition of I2C Interface Pin Name Pin No. I/O Description Comment I2C_SCL I2C_SDA 40 41 OD I2C serial clock (for external codec) OD I2C serial data (for external codec) Externally pulled up to 1.8 V. If unused, keep it open. 4.6. ADC Interface The module has one ADC interface. To improve the accuracy of ADC, the trace of ADC interface should be surrounded by ground. EG92_Series_Hardware_Design 45 / 79 PCM_DINPCM_DOUTPCM_SYNCPCM_CLKI2C_SCLI2C_SDAModule1.8 V4.7K4.7KBCLKLRCKDACADCSCLSDABIASMICBIASINPINNLOUTPLOUTNCodec LTE Standard Module Series Table 18: Pin Definition of ADC Interface Pin Name Pin No. I/O Description Comment ADC0 24 AI General-purpose ADC interface If unused, keep it open. With AT+QADC=0, you can read the voltage value on ADC0. For more details about the AT command, see document [2]. Table 19: Characteristics of ADC Interface Parameters ADC0 Voltage Range ADC Resolution NOTE Min. 0.3

Typ. Max. Units

VBAT_BB V 15 bits 1. The input voltage of every ADC interface should not exceed its corresponding voltage range. 2. It is prohibited to directly supply any voltage to ADC interface when the module is not powered by the VBAT. It is recommended to use resistor divider circuit for ADC interface application. 3. 4.7. SPI The module has one SPI which only supports master mode with a maximum clock frequency up to 50 MHz. Table 20: Pin Definition of SPI Pin Name Pin No. I/O Description Comment SPI_CLK SPI_DIN 26 28 DO SPI clock DI SPI master-in salve-out SPI_DOUT 27 DO SPI master-out slave-in Master mode only. If unused, keep it open. EG92_Series_Hardware_Design 46 / 79 LTE Standard Module Series The module has 1.8 V SPI interfaces. A voltage-level translator should be used between the module and the host if the application is equipped with a 3.3 V processor or device interface. The following figure shows a reference design:

Figure 26: Reference Design of SPI with a Level-Shifting Chip 4.8. Indication Signal Table 21: Pin Definition of Indication Signal Pin Name Pin No. I/O Description Comment STATUS 20 DO Indicate the module's operation status If unused, keep it open. NET_STATUS 21 DO Indicate the module's network activity status If unused, keep it open. 4.8.1. Network Status Indication The module has one network status indication pin: the NET_STATUS for the modules network operation status indication. NET_STATUS can drive corresponding LED. Table 22: Network Status Indication Pin Level and Module Network Status Pin Name Level Status Module Network Status Flicker slowly (200 ms high/1800 ms low) Network searching NET_STATUS Flicker slowly (1800 ms high/200 ms low) Idle EG92_Series_Hardware_Design 47 / 79 VCCAVCCBOEA1A2A3A4NCGNDB1B2B3B4NCVDD_EXTSPI_CLKSPI_DINSPI_DOUT0.1 F0.1 FSPI_CLK_MCUSPI_MISO_MCUSPI_MOSI_MCUVDD_MCULevel-shiftingChip LTE Standard Module Series Flicker quickly (125 ms high/125 ms low) Data transmission is ongoing Always high Voice calling Figure 27: Reference Design of Network Status Indication 4.8.2. STATUS The STATUS is used for indicating modules operation status. It will output high level when the module is turned on. Figure 28: Reference Design of STATUS 4.8.3. MAIN_RI AT+QCFG= risignaltype, physical can be used to configure the indication behavior for MAIN_RI. No matter on which port (main UART, USB AT port or USB modem port) a URC information is presented, EG92_Series_Hardware_Design 48 / 79 4.7 K47 KVBAT2.2 KModuleNET_STATUS4.7K47KVBAT2.2KModule STATUS LTE Standard Module Series the URC information will trigger the behavior of the MAIN_RI. NOTE The AT+QURCCFG allows you to set the main UART, USB AT port or USB modem port as the URC information output port. The USB AT port is the URC output port by default. See document [2] for details. You can configure MAIN_RI behaviors flexibly. The default behaviors of the MAIN_RI are shown as below:

Table 23: MAIN_RI Level and Module Status Module Status MAIN_RI Level Status Idle High When a new URC information returns MAIN_RI outputs at least 120 ms low level. After the module outputs the data, the level status will then become high. Indication behavior for MAIN_RI can be configured via AT+QCFG="urc/ri/ring". See document [3] for details. EG92_Series_Hardware_Design 49 / 79 LTE Standard Module Series 5 RF Specifications Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products. 5.1. Cellular Network 5.1.1. Antenna Interface & Frequency Bands Table 24: Pin Definition of Cellular Antenna Interface Pin Name Pin No. I/O Description Comment ANT_MAIN ANT_DRX 60 56 AIO Main antenna interface 50 impedance. AI Diversity antenna interface 50 impedance. If unused, keep it open. NOTE Only passive antennas are supported. Table 25: Operating Frequency of EG92-NA (Unit: MHz) Operating Frequency Transmit LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B12 LTE-FDD B13 1850~1910 1710~1755 824~849 699~716 777~787 Receive 1930~1990 2110~2155 869~894 729~746 746~756 EG92_Series_Hardware_Design 50 / 79 LTE Standard Module Series LTE-FDD B66 LTE-FDD B71 1710~1780 663~698 2110~2200 617~652 Table 26: Operating Frequency of EG92-EU (Unit: MHz) Operating Frequency Transmit EGSM900 DCS1800 WCDMA B1 WCDMA B8 LTE-FDD B1 LTE-FDD B3 LTE-FDD B7 LTE-FDD B8 LTE-FDD B20 LTE-FDD B28 880915 17101785 19201980 880915 19201980 17101785 25002570 880915 832862 703748 Receive 925960 18051880 21102170 925960 21102170 18051880 26202690 925960 791821 758803 5.1.2. Antenna Tuner Control Interface The module can use GRFC (generic RF control) interfaces to control external antenna tuner. Table 27: Pin Definition of GRFC Interface Pin Name Pin No. I/O Description Comment GRFC1 GRFC2 76 77 DO DO Generic RF Controller Generic RF Controller If unused, keep them open. EG92_Series_Hardware_Design 51 / 79 LTE Standard Module Series Table 28: Truth Table of GRFC Interfaces for EG92-NA (Unit: MHz) GRFC1 Level GRFC2 Level Frequency Range Bands Low Low High High Low High Low High 699756 824894 663652 LTE: B12/B13 LTE: B5 LTE: B71 17102180 LTE: B2/B4/B66 Table 29: Truth Table of GRFC Interfaces for EG92-EU (Unit: MHz) GRFC1 Level GRFC2 Level Frequency Range Bands Low Low Low High 703803 LTE B28 791862 LTE B20 High Low 880960 High High 17102690 LTE: B8 WCDMA: B8 GSM900 LTE: B1/B3/B7 WCDMA: B1 DCS1800 5.1.3. Transmitting Power Table 30: RF Transmitting Power Frequency EGSM900 DCS1800 Max. Tx Power Min. Tx Power 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB EGSM900 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB DCS1800 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB WCDMA bands 23 dBm 2 dB LTE bands 23 dBm 2 dB

< -49 dBm

< -39 dBm EG92_Series_Hardware_Design 52 / 79 LTE Standard Module Series

. NOTE For GPRS transmission on 4 uplink timeslots, the maximum output power reduction is 4.0 dB. The design conforms to 3GPP TS 51.010-1 subclause 13.16 5.1.4. Receiver Sensitivity Table 31: Conducted RF Receiver Sensitivity of EG92-NA (Unit: dBm) Frequency Receiver Sensitivity (Typ.) Primary Diversity SIMO 4 3GPP Requirements

(SIMO) LTE-FDD B2

-97.5 dBm

-98.5 dBm

-101.1 dBm

-94.3dBm LTE-FDD B4

-97.2 dBm

-98.4 dBm

-100.2 dBm

-96.3dBm LTE-FDD B5

-98.8 dBm

-99.4 dBm

-101.5 dBm

-94.3dBm LTE-FDD B12

-97.8 dBm

-98.1 dBm

-100.2 dBm

-93.3dBm LTE-FDD B13

-97.8 dBm

-98.2 dBm

-100.3 dBm

-93.3dBm LTE-FDD B66

-97.2 dBm

-98.5 dBm

-100.2 dBm

-96.5dBm LTE-FDD B71

-97.8 dBm

-98.8 dBm

-100.3 dBm

-94.2dBm Table 31: Conducted RF Receiver Sensitivity of EG92-EU (Unit: dBm) Frequency Receiver Sensitivity (Typ.) Primary Diversity SIMO 5 3GPP Requirements

(SIMO) EGSM900

-109.4 DCS1800

-109

WCDMA B1

-109.2

-111 WCDMA B8

-110

-111.2 LTE-FDD B1

-97.5

-99.4 LTE-FDD B3

-98

-99

-101

-100.5

-102

-102

-106.7

-103.7

-96.3

-93.3 4 For the SIMO receiving sensitivity, LTE bands are tested with 2 Rx antennas. 5 For the SIMO receiving sensitivity, LTE bands are tested with 2 Rx antennas. EG92_Series_Hardware_Design 53 / 79 LTE Standard Module Series LTE-FDD B7

-96.6 LTE-FDD B8

-98.5

-98.1

-99.7 LTE-FDD B20

-98.5

-97 LTE-FDD B28

-98.6

-99.8

-99.5

-102

-100.4

-102.5

-94.3

-93.3

-93.3

-94.8 5.1.5. Reference Design Figure 29: Reference Design of Main Antenna and Diversity Antenna NOTE 1. To improve receiver sensitivity, ensure that the clearance among antennas is appropriate. 2. Use a -type matching circuit for all the antenna interfaces for better RF performance and for the ease of debugging. 3. Capacitors are not mounted by default. 4. Place the -type matching components (R1, C1, C2 and R2, C3, C4) to antennas as close as possible. 5.2. GNSS GNSS information of the module is as follows:

EG92_Series_Hardware_Design 54 / 79 ANT_MAINR1 0RC1ModuleMain AntennaNMC2NMR2 0RC3Diversity AntennaNMC4NMANT_DRX LTE Standard Module Series Supports GPS, GLONASS, BDS, Galileo and QZSS positioning system. Supports NMEA 0183 protocol and outputs NMEA sentences via USB interface (data update rate for positioning: 110 Hz, 1 Hz by default). The modules GNSS function is OFF by default. It must be ON via AT commands. For more details about GNSS technology and configurations, see document [6]. 5.2.1. Antenna Interface & Frequency Bands Table 32: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 49 AI GNSS antenna interface 50 impedance. If unused, keep it open. Table 33: GNSS Frequency (Unit: MHz) Antenna Types GPS GLONASS BDS Galileo QZSS 5.2.2. GNSS Performance Table 34: GNSS Performance Frequency 1575.42 1.023 (L1) 1176.45 10.23 (L5) 1597.51605.8 (L1) 1561.098 2.046 (B1I) 1575.42 2.046 (E1) 1176.45 10.23 (E5a) 1575.42 1.023 (L1) 1176.45 10.23 (L5) Parameters Modes Conditions Acquisition Sensitivity Reacquisition Autonomous Tracking TTFF Cold start @ open sky Autonomous Typ.

-146

-157

-157 35 Units dBm s EG92_Series_Hardware_Design 55 / 79 LTE Standard Module Series Warm start @ open sky Hot start @ open sky XTRA start Autonomous XTRA start Autonomous XTRA start 12 26 3.7 2 3.4 Accuracy CEP-50 Autonomous @ open sky 2.5 m

. NOTE 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock of navigation signals (keep positioning for at least 3 minutes continuously). 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock of navigation signals within 3 minutes after loss of lock. 3. Acquisition sensitivity: the minimum GNSS signal power at which the module can fix position of navigation signals successfully within 3 minutes after executing cold start command. 5.2.3. Reference Design 5.2.3.1. GNSS Active Antenna GNSS active antenna connection reference circuit is shown in the figure below. Figure 30: Reference Design of GNSS Active Antenna EG92_Series_Hardware_Design 56 / 79 GNSS AntennaVDDModuleANT_GNSS47 nH10R0.1 F0RNMNM100 pFESD LTE Standard Module Series The power supply voltage range of the external active antenna is 2.84.3 V, and the typical value is 3.3 V. 5.2.3.2. GNSS Passive Antenna GNSS passive antenna connection reference circuit is shown in the figure below. Figure 31: Reference Design of GNSS Passive Antenna It is recommended to reserve a -type matching circuit in the peripheral circuit design for Bluetooth antenna interface for better RF performance. Components (R1, C1 and C2) of the -type matching circuit shall be placed as close to the antenna as possible. C1andC2are not mounted by default. Only a 0 resistor is mounted on R1. Keep the characteristic impedance for RF trace as 50 when routing and keep the trace as short as possible. NOTE 1. You can select an external LDO according to the active antenna types. If you design the module with a passive antenna, you will not need the VDD circuit. 2. Junction capacitance of ESD protection components on the antenna interface should not exceed 3. 0.05 pF. It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 5.3. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB EG92_Series_Hardware_Design 57 / 79 ANT_GNSSR1 0RC1ModuleGNSSAntennaNMC2NMESD LTE Standard Module Series structures. Figure 32: Microstrip Design on a 2-layer PCB Figure 33: Coplanar Waveguide Design on a 2-layer PCB Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EG92_Series_Hardware_Design 58 / 79 LTE Standard Module Series Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [7]. 5.4. Requirements for Antenna Design Table 35: Requirements for Antenna Design Antenna Types Requirements GNSS Frequency range:

L1: 15591609 MHz L5: 11661187 MHz RHCP or linear polarization VSWR: 2 (Typ.) EG92_Series_Hardware_Design 59 / 79 LTE Standard Module Series For passive antenna application:

Passive antenna gain: > 0 dBi For active antenna application:

Active antenna noise coefficient: < 1.5 dB Active antenna gain: > 0 dBi Active antenna embedded LNA gain: < 17 dB VSWR: 2 Efficiency: > 30 %

Gain: 1 dBi Max input power: 50 W Input impedance: 50 Vertical polarization Cable insertion loss:

< 1 dB: LB (< 1 GHz)

< 1.5 dB: MB (12.3 GHz)

< 2 dB: HB (> 2.3 GHz) GSM, WCDMA, LTE-FDD 5.5. RF Connector Recommendation If the RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT receptacle provided by Hirose. Figure 36: Dimensions of the Receptacle (Unit: mm) EG92_Series_Hardware_Design 60 / 79 LTE Standard Module Series U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT. Figure 37: Specifications of Mated Plugs (Unit: mm) The following figure describes the space factor of the mated connector. Figure 38: Space Factor of the Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com. EG92_Series_Hardware_Design 61 / 79 LTE Standard Module Series 6 Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Table 36: Absolute Maximum Ratings Parameters Min. Max. Units Voltage at VBAT_RF & VBAT_BB

-0.3 Voltage at USB_VBUS Voltage at digital pins Voltage at ADC0 Current at VBAT_BB Current at VBAT_RF

-0.3

-0.3 0

4.7 5.5 2.3 VBAT_BB 0.8 1.8 V V V V A A 6.2. Power Supply Ratings Table 37: Modules Power Supply Ratings Parameters Descriptions Conditions Min. Typ. Max. Units VBAT VBAT_BB & VBAT_RF Voltage drops during burst transmission IVBAT Peak power consumption The actual input voltage must be within this range At maximum power control level At maximum power control level 3.3 3.8 4.3 V

400 mV 2.0 A EG92_Series_Hardware_Design 62 / 79 LTE Standard Module Series USB_VBUS USB connection detection

3.0 5.0 5.25 V 6.3. Power Consumption The power consumption of EG92 series will be provided in future version of this document. 6.4. Digital I/O Characteristics Table 38: VDD_EXT I/O Characteristics (Unit: V) Parameters Descriptions Min. Max. VIH VIL VOH VOL High-level input voltage 0.65 VDD_EXT VDD_EXT + 0.2 Low-level input voltage

-0.3 0.35 VDD_EXT High-level output voltage VDD_EXT - 0.45 VDD_EXT Low-level output voltage 0 0.45 Table 39: (U)SIM Low/High-voltage I/O Characteristics (Unit: V) Parameters Descriptions Min. Max. High-level input voltage 0.8 x USIM_VDD USIM_VDD Low-level input voltage

-0.3 0.12 x USIM_VDD High-level output voltage 0.8 x USIM_VDD USIM_VDD Low-level output voltage 0 0.4 VIH VIL VOH VOL 6.5. ESD Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the EG92_Series_Hardware_Design 63 / 79 LTE Standard Module Series development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 40: ESD Characteristics (Temperature: 2530 C, Humidity: 40 5 %; Unit: kV) Test Points VBAT & GND All Antenna Interfaces Other Interfaces Contact Discharge Air Discharge 5 4 0.5 10 8 1 6.6. Operating and Storage Temperatures Table 41: Operating and Storage Temperatures (Unit: C) Parameters Normal Operating Temperature 6 Extended Operating Temperature 7 Storage Temperature Min.

-35

-40

-40 Typ.

+25

Max.

+75

+85

+90 6 To meet the normal operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the modules performance complies with 3GPP requirements. 7 To meet the extended operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module retains the ability to establish and maintain functions such as voice and SMS, without any unrecoverable malfunction. Radio spectrum and radio network remain uninfluenced, whereas the value of one or more parameters, such as Pout, may decrease and fall below the range of the 3GPP specified tolerances. When the temperature returns to the normal operating temperature range, the modules performance will comply with 3GPP requirements again. EG92_Series_Hardware_Design 64 / 79 LTE Standard Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 39: Top and Side Dimensions EG92_Series_Hardware_Design 65 / 79 LTE Standard Module Series Figure 40: Bottom Dimensions NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. EG92_Series_Hardware_Design 66 / 79 LTE Standard Module Series 7.2. Recommended Footprint Figure 41: Recommended Footprint

. NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. EG92_Series_Hardware_Design 67 / 79 LTE Standard Module Series 7.3. Top and Bottom Views Figure 42: Top & Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EG92_Series_Hardware_Design 68 / 79 LTE Standard Module Series 8 Storage, Manufacturing & Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended storage condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in recommended storage condition. 3. Floor life: 168 hours 8 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in recommended storage condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 8 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering. EG92_Series_Hardware_Design 69 / 79 LTE Standard Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.130.18 mm. For more details, see document [9]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below:

Figure 43: Recommended Reflow Soldering Thermal Profile EG92_Series_Hardware_Design 70 / 79 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Ramp-to-soak slope: 03 C/s Cool-down slope: -30 C/s Ramp-up slope: 03 C/s LTE Standard Module Series Table 42: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak Slope 03 C/s Soak Time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up Slope Reflow Time (D: over 217C) Max Temperature Cool-down Slope Reflow Cycle Max Reflow Cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both 2. the hottest and coldest spots of solder joints on the PCB should meet the above requirements. If a conformal coating is necessary for the module, do not use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 3. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 4. Due to the complexity of the SMT process, contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective wave soldering, ultrasonic soldering) that is not mentioned in document [9]. 8.3. Packaging Specification This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

EG92_Series_Hardware_Design 71 / 79 LTE Standard Module Series 8.3.1. Carrier Tape Dimension details are as follow:

Figure 44: Carrier Tape Dimension Drawing Table 43: Carrier Tape Dimension Table (Unit: mm) W 44 P 32 T A0 B0 0.35 22.8 26.8 K0 3.1 K1 6.9 F E 20.2 1.75 8.3.2. Plastic Reel Figure 45: Plastic Reel Dimension Drawing EG92_Series_Hardware_Design 72 / 79 LTE Standard Module Series Table 44: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 44.5 8.3.3. Mounting Direction Figure 46: Mounting Direction 8.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. EG92_Series_Hardware_Design 73 / 79 LTE Standard Module Series Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 1000 modules. Figure 47: Packaging Process EG92_Series_Hardware_Design 74 / 79 LTE Standard Module Series 9 Appendix References Table 45: Related Documents Document Name

[1] Quectel_UMTS&LTE_EVB_User_Guide

[2] Quectel_EC2x&EG2x-G(L)&EG9x&EM05_Series_AT_Commands_Manual

[3] Quectel_EC2x&EG2x&EG9x&EM05_Series_QCFG_AT_Commands_Manual

[4] Quectel_EC2x&EG2x&EG9x_Series_Power_Management_Application_Note

[5] Quectel_EG9x_Series_AT+QDSIM_Command_Manual

[6] Quectel_EC2x&EG2x&EG9x&EM05_Series_GNSS_Application_Note

[7] Quectel_RF_Layout_Application_Note

[8] Quectel_EC2x&EG2x&EG9x&EM05_Series_Software_Thermal_Management_Guide

[9] Quectel_Module_SMT_Application_Note Table 46: Terms and Abbreviations Abbreviation Description ADC Analog-to-Digital Converter AMR-WB Adaptive Multi-Rate Wideband bps CHAP CS CTS Bits Per Second Challenge Handshake Authentication Protocol Coding Scheme Clear To Send DC-HSDPA Dual-carrier High Speed Downlink Packet Access EG92_Series_Hardware_Design 75 / 79 LTE Standard Module Series DDR DFOTA DL DRX DRX DTR EFR ESD FDD FR Double Data Rate Delta Firmware Upgrade Over The Air Downlink Discontinuous Reception Diversity Receive Data Terminal Ready Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate GLONASS Global Navigation Satellite System (Russia) GMSK GNSS GPS GRFC HB HR HSDPA HSPA HSUPA I2C I/O LB LED LGA Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System General RF Control High Band Half Rate High Speed Downlink Packet Access High Speed Packet Access High Speed Uplink Packet Access Inter-Integrated Circuit Input/Output Low Band Light Emitting Diode Land Grid Array EG92_Series_Hardware_Design 76 / 79 LTE Standard Module Series LNA LTE MB MCU MO MT PAP PCB PCM PDA PDU QAM QPSK QZSS RI RF RHCP Rx SIMO SMD SMS SPI Tx UART UL Low Noise Amplifier Long Term Evolution Middle Band Microcontroller Unit Mobile Originated Mobile Terminated Password Authentication Protocol Printed Circuit Board Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Quadrature Amplitude Modulation Quadrature Phase Shift Keying Quasi-Zenith Satellite System Ring Indicator Radio Frequency Right Hand Circularly Polarized Receive Single Input Multiple Output Surface Mount Device Short Message Service Serial Peripheral Interface Transmit Universal Asynchronous Receiver/Transmitter Uplink EG92_Series_Hardware_Design 77 / 79 LTE Standard Module Series UMTS URC USB

(U)SIM VBAT Vmax Vnom Vmin VIHmax VIHmin VILmax VSWR Universal Mobile Telecommunications System Unsolicited Result Code Universal Serial Bus Universal Subscriber Identity Module Voltage at Battery (Pin) Maximum Voltage Nominal Voltage Minimum Voltage Maximum High-level Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access EG92_Series_Hardware_Design 78 / 79 LTE Standard Module Series OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k):

The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID

(new application) procedure followed by a Class II permissive change application End Product Labeling When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text:

Contains FCC ID: XMR202307EG92NA. The FCC ID can be used only when all FCC compliance requirements are met. EG92_Series_Hardware_Design 80 / 84 LTE Standard Module Series Antenna

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed Technology Frequency Range (MHz) Antenna Type Max Peak Gain (dBi) LTE Band 2 LTE Band 4 LTE Band 5 LTE Band 12 LTE Band 13 LTE Band 66 LTE Band 71 1850 ~ 1910 1710 ~ 1755 824 ~ 849 699 ~ 716 777 ~ 787 1710 ~ 1780 663~698 Dipole 9.9 9.9 7.3 6.5 7.0 9.9 6.3 EG92_Series_Hardware_Design 81 / 84 LTE Standard Module Series Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual EG92_Series_Hardware_Design 82 / 84 LTE Standard Module Series Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. List of applicable FCC rules This module has been tested and found to comply with part 22, part 24, part 27 requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. EG92_Series_Hardware_Design 83 / 84 LTE Standard Module Series This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body. EG92_Series_Hardware_Design 84 / 84

QUECCTEL EG92-NA ai-axnx EG92NAGA-51 2-SGNS. SN:MPA18B41 40XXXXxXX IMEI:8664250303XXXXX FCC.ID: ee RR

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QUECCTEL Federal Communications Commission 7435 Oakland Mills Road Columbia MD 21046 Subject: Certification designating a U.S. agent for service of process pursuant to Part 2.911(d)(7) To whom it may concern, Quectel Wireless Solutions Company Limited, FRN: 0018988279, Grantee Code: XMR (the applicant) certifies that, as of the date of the filing of application, Ikotek USA, Inc., FRN: 0033350331 (the agent) is designated as the U.S. agent for the purpose of accepting service of process on behalf of the applicant. The physical U.S. address and email for the designated agent are:

Physical U.S. address: 9920 Pacific Heights Blvd., Ste. 150, #7025, San Diego, CA 92121 Email: compliance@ikotek.com The applicant accepts to maintain an agent for service of process in the United States for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. The agent accepts the designation by (the applicant) as the U.S. agent to accept service of process includes, but is not limited to, delivery of any correspondence, notices, orders, decisions, and requirements of administrative, legal, or judicial process related to Commission proceedings. Signed by the Applicant Signed by the Agent (if different from the Applicant) 7 he! Jean Hu Name: eterson Title Certification Manager Title: CEO. Email: Jean.hu@quectel.com Email: joe.peterson@ikotek.com Date: 07 July, 2023 Date: 07 July, 2023

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< Quectel Wireless Solutions Co., Ltd >

Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: 18-08-2023 Ref: Attestation Statements Part 2.911(d)(5)(i) Filing and Part 2.911(d)(5)(ii) Filing FCC ID: XMR202307EG92NA 1. Quectel Wireless Solutions Co., Ltd (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. 2. Quectel Wireless Solutions Co., Ltd (the applicant) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List (as a specifically named entity or any of its subsidiaries of affiliates) as an entity producing covered equipment. Sincerely, _________________ Name: Jean Hu Title: Certification Section Manager Email: jean.hu@quectel.com Date:2023/08/18

Quectel Wireless Solutions Co., Ltd Confidentiality Request Letter Federal Communications Commission Authorization and Evaluation Division FCC ID: XMR202307EG92NA Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:

1. Block Diagram 2. Schematics 3. Operational Description 4. Tune-up Procedure, BOM List The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Rule 0.457, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely, _________________ Name: Jean Hu Title: Certification Section Manager Email: jean.hu@quectel.com Date:2023/08/18

WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/6768174.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case Quectel Wireless Solutions Co., Ltd Declaration of Authorization We Name: Quectel Wireless Solutions Co., Ltd Address: Building 5, Shanghai Business Park PhaseIII (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China,200233 Declare that:

Name Representative of agent: Marlin Chen Agent Company name:

Address:

MRT Technology (Suzhou) Co., Ltd D8 Building, Youxin Industrial Park, No.2 Tian'edang Rd., Wuzhong Economic Development Zone Suzhou China City:

Country:

is authorized to apply for Certification of the following product(s):

LTE Cat 1 Module XMR202307EG92NA EG92-NA Product:

FCC ID:

Model No.:

Sincerely, ________________ Name: Jean Hu Title: Certification Section Manager Email: jean.hu@quectel.com Date:2023/08/18

ANTENNA SPECIFICATION Project Number: S0691 Rev. 1.0 Internal Antenna Product Specification Customer Name:

Project Name:

Quectel Wireless Solutions Co., Ltd. 4G-LTE External Antenna Part Number:

SAA30968A VENDOR NAME:

ShanghaiSaintennaElectronic

TechnologyCo.,Ltd. Tel: 021- 36307272 Fax: 021- 36307757 Approval Sheet Customer Saintenna Rev 1.0 Change Summary Preliminary Release Date 2014-07-26 Author Kevin Cui PREPARED BY ShanghaiSaintennaElectronicTechnologyCo.,Ltd. 2005 COPYRIGHT SAINTENNA CO. LTD. This document is issued by Saintenna Electronic Technology Co. Ltd. (hereinafter called Saintenna) in confidence, and is not to be reproduced in whole or in part without the prior written permission of Saintenna. The information contained herein is the property of Saintenna and is to be used only for the purpose for which it is submitted and is not to be released in whole or in part without the prior written permission of Saintenna. Building 8, No. 611 BaoQI Road, Baoshan District Shanghai 200444, P.R. China Saintenna Co. Ltd. Confidential & Proprietary Tel. 0086-21-36307272 SFN01.05A Fax 0086-21-36307757 Page 1 of 1 Catalog Project / content 1. Cover 2. Catalog 3. Product chart 4. Antenna standard parameters 5. Electrical performance test report 6. RoHS No. 1 2 3 4 5-7 8 Standard parameter Specifications Frequency range 699~960MHz/1710~2700MHz S.W.R Gain Connector Impedance 3 4.0dBi SMA Plug 50 Ohm Reliability test Project Test condition Result Storage environment Temperature, humidity, air pressure test are as follows:

1.Temperature: -30+80 Normal electrical and mechanical properties 2.Humidity: 45%-85%

3.Pressure: 86kpa-106kpa

Drop test The 5 cycle is between 70 and 40. Then check the appearance quality Meet the mechanical and electrical properties

Meet the mechanical and electrical properties Vibration frequency 10-55HZ, displacement:

0.35MM, acceleration: 50.0M/S, Frequency sweep frequency: 30 times 1m height drop Normal electrical and mechanical properties Normal electrical and mechanical properties Normal electrical and mechanical properties Drawing force test Push pull tester to test the strength of the instrument10N Voltage resistance 1.Insulation spark voltage 1.5KV 2.Sheath spark voltage 1.5KV 3.Insulation resistance to sheath voltage 0.5KV Normal electrical and mechanical properties Shanghai Saintenna Electronic TechnologyCo.Ltd. Company / project External antenna Working frequency band All Test date 2016/6/22 Test person Victor Peng Version number V1.0 Test sample description Mould Free space test data of whole machine passive efficiency:

Freq 700 710 720 730 740 750 760 770 780 790 800 810 820 830 840 850 860 870 880 890 900 910 920 930 940 950 Gain 1.66 3.26 3.95 3.6 3.85 4.04 3.44 3.98 4.45 3.63 3.47 3.19 2.53 2.13 1.89 2.29 2.64 3.01 2.98 2.46 2.38 2.06 1.91 2.06 2.27 2.04 Efficiency 41.00%

49.30%

58.30%

58.10%

55.50%

54.40%

53.30%

57.30%

63.50%

66.00%

67.30%

62.40%

59.20%

57.60%

56.30%

57.10%

60.50%

61.20%

60.60%

57.00%

54.80%

52.30%

51.50%

51.30%

55.40%

54.10%

Freq 960 970 980 990 1000 1700 1720 1740 1760 1780 1800 1820 1840 1860 1880 1900 1920 1940 1960 1980 2000 2020 2040 2060 2080 2100 Gain 1.7 1.23 1 0.82 1.17 1.67 1.94 2 1.57 0.97 1.33 1.17 1.36 1.25 1.38 1.59 1.36 1.01 1.41 1.53 1.84 2.1 2.65 3.22 3.69 4.01 Efficiency 51.90%

47.10%

44.80%

41.90%

40.70%

63.40%

62.90%

64.80%

60.40%

56.80%

55.90%

56.20%

55.70%

51.40%

49.90%

51.70%

52.00%

49.40%

51.60%

53.20%

52.70%

50.40%

54.50%

56.90%

56.60%

59.20%

The information contained in this product is of a proprietary nature. It may not be reproduced without expressed written permission of Shanghai Saintenna Electronic Technology Co., Ltd. CONFIDENTIAL Freq 2500 2520 2540 2560 2580 2600 2620 2640 2660 2680 2700 Gain 3 2.68 2.44 2.3 2 2.04 2.06 2 1.71 1.71 1.78 Efficiency 67.00%

68.00%

68.80%

66.30%

59.90%

60.30%

61.10%

60.70%

59.90%

58.60%

59.00%

Freq 2120 2140 2160 2180 2300 2320 2340 2360 2380 2400 2420 2440 2460 2480 Gain 3.69 3.22 2.46 1.45 1.25 1.49 1.49 1.49 1.57 1.88 2.15 2.85 3.35 3.6 Efficiency 59.60%

56.00%

52.20%

47.30%

46.90%

50.10%

50.60%

49.90%

51.90%

54.40%

57.80%

60.80%

64.80%

69.50%

LOG MAG:

The information contained in this product is of a proprietary nature. It may not be reproduced without expressed written permission of Shanghai Saintenna Electronic Technology Co., Ltd. Page 2 CONFIDENTIAL VSWR The information contained in this product is of a proprietary nature. It may not be reproduced without expressed written permission of Shanghai Saintenna Electronic Technology Co., Ltd. Page 3 CONFIDENTIAL Product :RF Antenna Assembly ROHS Supplier Part No.

() ITEM

() RAW MATERIAL RAW MATERIAL Cd() Pb() Cr6+(

(//

) SUPPLIER

()

(ppm) Silver plated copper wire RG-178 FEP Tin plated copper wire Brown color Rod sleeve ABS Fixed Solid PBT+PC PBT+PC POM NI-Plated Connector Gold-Plated PTFE Brass Toner Black masterbatch PCB FR4 1 2 3 4 5 6 7 JIANGSU YUANDA N.D N.D N.D N.D Chemical fiber N.D N.D N.D N.D N.D N.D N.D 14 N.D N.D SHIYANG HEN-CHEN LIANFENG LIANFENG Huake Formosa PBBS(

) Hg()

(ppm)

)

(ppm) N.D

(ppm) N.D N.D N.D N.D N.D

(ppm) N.D Negative N.D N.D N.D N.D N.D N.D Negative N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D Negative N.D N.D Negative N.D N.D 31782 Negative N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D PBDES(

)

(ppm) N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D Test organization Test report No. SGS Report date CTI ECL01H051755017 2015.10.23 SGS SGS SGS SGS SGS SGS CTI SGS SGS SGS CE/2016/13616 2016.01.25 CE/2015/C5211 2015.12.30 KE/2015/C2285A-01 CANEC1517911004 CANEC1517911006 SCL01I013440001C CANEC1603095201 CANEC1601390003 SCL01H099132001C 2015.12.28 2015.10.26 2015.10.26 2016.03.07 2016.03.09 2016.01.28 2015.11.23

WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/6768175.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Request for Modular/Limited Modular Approval Date: 2023.08.18 Subject: Manufacturers Declaration for

- Modular Approval

- Split Modular Approval

- Limited Modular Approval - Limited Split Modular Approval Confidentiality Request for: XMR202307EG92NA 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i) Requirement Met

- YES - NO(*) Details: <example The module contains a metal shield which covers all RF components and circuitry. The shield is located on the top of the board next to antenna connector>

2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii)

- YES - NO(*) Details: <example Data to the modulation circuit is buffered as described in the operational description provided with the application>

3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii)

- YES - NO(*) Details: <example The module contains its own power supply regulation. Please refer to schematic filed with this application>

4. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv)

- YES - NO(*) Details: <example The module connects to its antenna using an UFL connector which is considered a non-

standard connector. A list of antennas tested and approved with this device may be found in users manual provided with the application>

5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v)

- YES - NO(*) Details: <example The module was tested stand-alone as shown in test setup photographs filed with this application>

6. The modular transmitter must be labeled with its own FCC ID number, or use an electron display (see KDB Publication 784748). Modular Approval Requirement Requirement Met If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID:

XMR202307EG92NA or Contains FCC ID: XMR202307EG92NA Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi)

- YES - NO(*) Details: <example There is a label on the module as shown in the labeling exhibit filed with this application. Host specific labeling instructions are shown in the installation manual .filed with this application.>

7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii)

- YES - NO(*) Details: <example The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application.>

8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1)(viii) Details: < The module meets RF exposure in mobile configuration.>

- YES - NO(*) 070920-02b Limited Module Description When Applicable

* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval

(LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA; the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: <example - N/A>

Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Requirement Met

- Provided in Separate Cover Letter

- N/A Details: <example The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. >

2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.

- Provided in Separate Cover Letter

- N/A Details: <example N/A>

Split Modular Requirements Requirement 1. For split modular transmitters, specific descriptions for secure communications between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained. Provided in Manual

- Provided in Separate Cover Letter

- N/A Details: <example N/A >

070920-02b OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?

- YES

- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 D03, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 point systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D03, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc note that omni-directional is not considered a type) 7. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product 8. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 a. Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. b. Provide information on how to configure test modes for evaluation 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10

- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.

- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. _____________ Name: Jean Hu Title: Certification Section Manager Date:2023/08/18 070920-02b

WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/6768173.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case Quectel Wireless Solutions Co., Ltd Declaration of Conformity Federal Communications Commission Authorization and Evaluation Division FFCCCC IIDD:: XXMMRR220022330077EEGG9922NNAA Please be notified that we, the undersigned, QQuueecctteell WWiirreelleessss SSoolluuttiioonnss CCoo..,, LLttdd declares that the product which bears the above FCC ID is also compliant with the FCC requirements for sDOC. And the sDOC procedure shall be carried out prior to marketing the device in the US. Sincerely, _________________ Name: Jean Hu Title: Certification Section Manager Email: jean.hu@quectel.com Date:2023/08/18