FCC ID: XMR202212EG21GL LTE CAT1 Module

EG21-GL Hardware Design LTE Standard Module Series Version: 1.0.1 Date: 2022-10-27 Status: Preliminary LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved. EG21-GL_Hardware_Design 2 / 96 LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for your failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. EG21-GL_Hardware_Design 3 / 96 LTE Standard Module Series About the Document Revision History Version Date Author Description

2022-09-09 Ethan FANG/Joe MA Creation of the document 1.0.0 2022-09-09 Ethan FANG/Joe MA Preliminary 1.0.1 2022-10-27 Ethan FANG/Joe MA Preliminary:

1. Added an applicable module EG21-GL. 2. Updated the information of manufacturing and soldering (Chapter 8.2). EG21-GL_Hardware_Design 4 / 96 LTE Standard Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents ....................................................................................................................................................... 5 Table Index ................................................................................................................................................... 8 Figure Index ............................................................................................................................................... 10 1 Introduction ........................................................................................................................................ 12 Special Marks .......................................................................................................................... 12 1.1 2 Product Overview .............................................................................................................................. 13 Frequency Bands and Functions ............................................................................................. 13 Key Features ........................................................................................................................... 14 Functional Diagram ................................................................................................................. 17 Pin Assignment ........................................................................................................................ 18 Pin Description ......................................................................................................................... 19 EVB Kit..................................................................................................................................... 27 2.1 2.2 2.3 2.4 2.5 2.6 3.3 3.2.3 3.1 3.2 3.2.1 3.2.2 3.2.2.1 3.2.2.2 3.2.2.3 3 Operating Characteristics ................................................................................................................. 28 Operating Modes ..................................................................................................................... 28 Sleep Mode .............................................................................................................................. 29 UART Application Scenario ............................................................................................ 29 USB Application Scenario .............................................................................................. 29 USB Application with USB Remote Wakeup Function ........................................ 29 USB Application with USB Suspend/Resume and MAIN_RI Function ............... 30 USB Application without USB Suspend Function ................................................ 31 Airplane Mode ................................................................................................................ 31 Power Supply ........................................................................................................................... 32 Power Supply Pins ......................................................................................................... 32 Voltage Stability Requirements ...................................................................................... 33 Reference Design for Power Supply .............................................................................. 34 Power Supply Voltage Monitoring .................................................................................. 35 Turn On .................................................................................................................................... 35 Turn On with PWRKEY .................................................................................................. 35 Turn Off .................................................................................................................................... 37 Turn Off with PWRKEY .................................................................................................. 37 Turn Off with AT Command ............................................................................................ 37 Reset ........................................................................................................................................ 38 3.3.1 3.3.2 3.3.3 3.3.4 3.5.1 3.5.2 3.4.1 3.4 3.6 3.5 4 Application Interfaces ....................................................................................................................... 40

(U)SIM Interface ...................................................................................................................... 40 USB Interface .......................................................................................................................... 42 UART Interfaces ...................................................................................................................... 43 PCM and I2C Interfaces .......................................................................................................... 46 4.1 4.2 4.3 4.4 EG21-GL_Hardware_Design 5 / 96 LTE Standard Module Series SD Card Interface .................................................................................................................... 48 4.5 4.6 WLAN and Bluetooth Application Interfaces ........................................................................... 50 4.6.1 WLAN Application Interface ........................................................................................... 53 Bluetooth Application Interface* ..................................................................................... 53 4.6.2 ADC Interfaces ........................................................................................................................ 53 SGMII Interface ........................................................................................................................ 54 Indication Signals..................................................................................................................... 56 Network Status Indication .............................................................................................. 56 4.9.1 4.9.2 STATUS .......................................................................................................................... 58 4.9.3 MAIN_RI ......................................................................................................................... 58 4.10 USB_BOOT ............................................................................................................................. 59 4.7 4.8 4.9 5.1 5.1.1 5.1.2 5.1.3 5.1.4 5 RF Specifications ............................................................................................................................... 61 Cellular Network ...................................................................................................................... 61 Antenna Interface & Frequency Bands .......................................................................... 61 Tx Power ........................................................................................................................ 63 Rx Sensitivity .................................................................................................................. 63 Reference Design .......................................................................................................... 65 GNSS ....................................................................................................................................... 66 5.2.1 Antenna Interface & Frequency Bands .......................................................................... 66 5.2.2 GNSS Performance ....................................................................................................... 67 Reference Design .......................................................................................................... 68 5.2.3 RF Routing Guidelines ............................................................................................................ 68 Antenna Design Requirements ............................................................................................... 70 RF Connector Recommendation ............................................................................................. 71 5.3 5.4 5.5 5.2 6 Electrical Characteristics and Reliability ........................................................................................ 73 Absolute Maximum Ratings ..................................................................................................... 73 Power Supply Ratings ............................................................................................................. 74 Power Consumption ................................................................................................................ 74 ESD Protection ........................................................................................................................ 79 Operating and Storage Temperatures ..................................................................................... 80 6.1 6.2 6.3 6.4 6.5 7 Mechanical Information ..................................................................................................................... 81 Mechanical Dimensions ........................................................................................................... 81 Recommended Footprint ......................................................................................................... 83 Recommended Compatible Footprint...................................................................................... 84 Top and Bottom Views ............................................................................................................. 85 7.1 7.2 7.3 7.4 8.1 8.2 8.3 8 Storage, Manufacturing and Packaging .......................................................................................... 86 Storage Conditions .................................................................................................................. 86 Manufacturing and Soldering .................................................................................................. 87 Packaging Specifications ......................................................................................................... 88 Carrier Tape .................................................................................................................... 89 Plastic Reel .................................................................................................................... 89 Packaging Process ........................................................................................................ 90 8.3.1 8.3.2 8.3.3 EG21-GL_Hardware_Design 6 / 96 9. Appendix References ........................................................................................................................ 92 LTE Standard Module Series EG21-GL_Hardware_Design 7 / 96 LTE Standard Module Series Table Index Table 1: Special Marks ............................................................................................................................... 12 Table 2: Frequency Bands and Functions ................................................................................................. 13 Table 3: Key Features of EG21-GL Module ............................................................................................... 14 Table 4: I/O Parameters Definition ............................................................................................................. 19 Table 5: Pin Description ............................................................................................................................. 20 Table 6: Overview of Operating Modes ...................................................................................................... 28 Table 7: Pin Definition of VBAT and GND Pins .......................................................................................... 32 Table 8: Pin Definition of PWRKEY ............................................................................................................ 35 Table 9: Pin Definition of RESET_N ........................................................................................................... 38 Table 10: Pin Definition of (U)SIM Interface ............................................................................................... 40 Table 11: Pin Definition of USB Interface ................................................................................................... 42 Table 12: Pin Definition of Main UART Interface ....................................................................................... 44 Table 13: Pin Definition of Debug UART Interface ..................................................................................... 44 Table 14: Pin Definition of PCM and I2C Interfaces .................................................................................. 47 Table 15: Pin Definition of SD Card Interface ............................................................................................ 48 Table 16: Pin Definition of WLAN & Bluetooth Application Interfaces ....................................................... 50 Table 17: Pin Definition of ADC Interfaces ................................................................................................. 53 Table 18: Characteristic of ADC ................................................................................................................. 54 Table 19: Pin Definition of SGMII Interface ................................................................................................ 54 Table 20: Pin Definition of Network Connection Status/Activity Indication ................................................ 57 Table 21: Working State of Network Connection Status/Activity Indication ............................................... 57 Table 22: Pin Definition of STATUS ............................................................................................................ 58 Table 23: Behaviors of MAIN_RI ................................................................................................................ 59 Table 24: Pin Definition of USB_BOOT Interface ...................................................................................... 59 Table 25: Pin Definition of Antenna Antennas ............................................................................................ 61 Table 26: Frequency Bands ....................................................................................................................... 61 Table 27: EG21-GL Tx Power .................................................................................................................... 63 Table 28: EG21-GL Conducted RF Receiving Sensitivity .......................................................................... 63 Table 29: Pin Definition of GNSS Antenna Interface ................................................................................. 66 Table 30: GNSS Frequency ....................................................................................................................... 66 Table 31: GNSS Performance .................................................................................................................... 67 Table 32: Antenna Requirements ............................................................................................................... 70 Table 33: Absolute Maximum Ratings ........................................................................................................ 73 Table 34: Power Supply Ratings ................................................................................................................ 74 Table 35: EG21-GL Power Consumption ................................................................................................... 74 Table 36: Electrostatic Discharge Characteristics (25 C, 45 % Relative Humidity) ................................. 79 Table 37: Operating and Storage Temperatures ........................................................................................ 80 Table 38: Recommended Thermal Profile Parameters .............................................................................. 88 Table 39: Carrier Tape Dimension Table (Unit: mm) .................................................................................. 89 Table 40: Plastic Reel Dimension Table (Unit: mm) ................................................................................... 90 Table 41: Related Documents .................................................................................................................... 92 EG21-GL_Hardware_Design 8 / 96 Table 42: Terms and Abbreviations ............................................................................................................ 92 LTE Standard Module Series EG21-GL_Hardware_Design 9 / 96 LTE Standard Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 17 Figure 2: Pin Assignment (Top View) ......................................................................................................... 18 Figure 3: Sleep Mode Application via UART .............................................................................................. 29 Figure 4: Sleep Mode Application with USB Remote Wakeup .................................................................. 30 Figure 5: Sleep Mode Application with MAIN_RI ....................................................................................... 30 Figure 6: Sleep Mode Application without Suspend Function ................................................................... 31 Figure 7: Power Supply Limits during Burst Transmission ........................................................................ 33 Figure 8: Star Structure of the Power Supply ............................................................................................ 34 Figure 9: Reference Circuit of Power Supply ............................................................................................. 34 Figure 10: Turn On the Module by Using Driving Circuit ........................................................................... 35 Figure 11: Turn On the Module by Using a Button ..................................................................................... 36 Figure 12: Power-up Timing ....................................................................................................................... 36 Figure 13: Power-down Timing .................................................................................................................. 37 Figure 14: Reference Circuit of RESET_N by Using Driving Circuit ......................................................... 38 Figure 15: Reference Circuit of RESET_N by Using a Button .................................................................. 39 Figure 16: Reset Timing ............................................................................................................................. 39 Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector ......................... 41 Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector ........................... 41 Figure 19: Reference Circuit of USB Interface .......................................................................................... 43 Figure 20: Reference Circuit with Translator Chip ..................................................................................... 45 Figure 21: Reference Circuit with Transistor Circuit .................................................................................. 45 Figure 22: Primary Mode Timing ................................................................................................................ 46 Figure 23: Auxiliary Mode Timing ............................................................................................................... 47 Figure 24: Reference Circuit of PCM and I2C Application with Audio Codec ........................................... 48 Figure 25: Reference Circuit of SD Card Interface .................................................................................... 49 Figure 26: Reference Circuit of WLAN & Bluetooth Application Interfaces with FC20 Series/FC21 ........ 52 Figure 27: Simplified Block Diagram for Ethernet Application ................................................................... 55 Figure 28: Reference Circuit of SGMII Interface with PHY AR8033 Application ....................................... 56 Figure 29: Reference Circuit of the Network Indication ............................................................................. 57 Figure 30: Reference Circuits of STATUS ................................................................................................. 58 Figure 31: Reference Circuit of USB_BOOT Interface .............................................................................. 60 Figure 32: Timing Sequence for Entering Emergency Download Mode.................................................... 60 Figure 33: Reference Circuit of RF Antenna Interface ............................................................................... 65 Figure 34: Reference Circuit of GNSS Antenna ........................................................................................ 67 Figure 35: Microstrip Design on a 2-layer PCB ......................................................................................... 69 Figure 36: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 69 Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 69 Figure 38: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 70 Figure 39: Dimensions of the Receptacle (Unit: mm) ................................................................................ 71 Figure 40: Specifications of Mated Plugs .................................................................................................. 72 Figure 41: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 72 EG21-GL_Hardware_Design 10 / 96 LTE Standard Module Series Figure 42: Module Top and Side Dimensions ............................................................................................ 81 Figure 43: Bottom Dimensions (Bottom View) ........................................................................................... 82 Figure 44: Recommended Footprint (Top View) ........................................................................................ 83 Figure 45: Recommended Compatible Footprint (Top View) ..................................................................... 84 Figure 46: Top and Bottom Views of the Module ....................................................................................... 85 Figure 47: Recommended Reflow Soldering Thermal Profile ................................................................... 87 Figure 48: Carrier Tape Dimension Drawing .............................................................................................. 89 Figure 49: Plastic Reel Dimension Drawing .............................................................................................. 89 Figure 50: Packaging Process ................................................................................................................... 91 EG21-GL_Hardware_Design 11 / 96 LTE Standard Module Series 1 Introduction This document defines EG21-GL module and describes its air interfaces and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module. 1.1 Special Marks Table 1: Special Marks Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of the model is currently unavailable. Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. EG21-GL_Hardware_Design 12 / 96 LTE Standard Module Series 2 Product Overview 2.1 Frequency Bands and Functions EG21-GL is an LTE/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, UMTS, EDGE and GPRS networks. It also provides GNSS and voice functionality for your specific applications. The following table shows the supported frequency bands, GNSS and digital audio functions of EG21-GL module. Table 2: Frequency Bands and Functions Mode GSM WCDMA

(With receive diversity) LTE-FDD

(With receive diversity) LTE-TDD

(With receive diversity) EG21-GL GSM850/EGSM900/DCS1800/PCS1900 B1/B2/B4/B5/B6/B8/B19 B1/B2/B3/B4/B5/B7/B8/B12/B13/B18/B19/B20/B25/B26/B28/B66 B34/B38/B39/B40/B41 GNSS (Optional) GPS, GLONASS, BDS, Galileo, QZSS Digital Audio (PCM) Supported VoLTE (Voice over LTE) Optional With a compact profile of 29.0 mm 32.0 mm 2.4 mm, EG21-GL can meet most requirements for M2M applications such as automation, smart metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EG21-GL is an SMD type module which can be embedded into applications through its 144 LGA 1 pins. 1 LGA form factor is used for EG21-GL module, while LCC is recommended only in the compatible design with EC25 series/EC21 series/EC20-CE/EG21-G/EG25-G/EC200A series modules. EG21-GL_Hardware_Design 13 / 96 LTE Standard Module Series 2.2 Key Features The following table describes the detailed features of EG21-GL module. Table 3: Key Features of EG21-GL Module Features Description Power Supply Supply voltage: 3.34.3 V Typical supply voltage: 3.8 V Transmitting Power LTE Features UMTS Features Class 4 (33 dBm 2 dB) for GSM850 Class 4 (33 dBm 2 dB) for EGSM900 Class 1 (30 dBm 2 dB) for DCS1800 Class 1 (30 dBm 2 dB) for PCS1900 Class E2 (27 dBm 3 dB) for GSM850 8-PSK Class E2 (27 dBm 3 dB) for EGSM900 8-PSK Class E2 (26 dBm 3 dB) for DCS1800 8-PSK Class E2 (26 dBm 3 dB) for PCS1900 8-PSK Class 3 (23 dBm 2 dB) for WCDMA bands Class 3 (23 dBm 2 dB) for LTE-FDD bands Class 3 (23 dBm 2 dB) for LTE-TDD bands Supports up to non-CA Cat 1 FDD and TDD Supports 1.4/3/5/10/15/20 MHz RF bandwidth Supports MIMO in DL direction LTE-FDD: Max. 10 Mbps (DL), Max. 5 Mbps (UL) LTE-TDD: Max. 8.96 Mbps (DL), Max. 3.1 Mbps (UL) Supports 3GPP Rel-8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Supports QPSK, 16QAM and 64QAM modulation DC-HSDPA: Max. 42 Mbps (DL) HSUPA: Max. 5.76 Mbps (UL) WCDMA: Max. 384 kbps (DL), Max. 384 kbps (UL) GPRS:

- Supports GPRS multi-slot class 33 (33 by default)

- Coding scheme: CS 14

- Max. 107 kbps (DL), Max. 85.6 kbps (UL) EDGE:

GSM Features

- Supports EDGE multi-slot class 33 (33 by default)

- Supports GMSK and 8-PSK for different MCS (Modulation and Coding Scheme)

- Downlink coding schemes: MCS 19

- Uplink coding schemes: MCS 19

- Max. 296 kbps (DL), Max. 236.8 kbps (UL) EG21-GL_Hardware_Design 14 / 96 LTE Standard Module Series Internet Protocol Features SMS Supports TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/NITZ/

SMTP/SSL/MQTT/CMUX/SMTPS/FILE/MMS protocols Supports PAP and CHAP for PPP connections Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default

(U)SIM Interface Supports USIM/SIM card: 1.8 V, 3.0 V Audio Features PCM Interface Supports one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Supports echo cancellation and noise suppression Used for audio function with external codec Supports 16-bit linear data format Supports long frame synchronization and short frame synchronization Supports master and slave modes in short frame synchronization, and only supports master mode in long frame synchronization Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480 Mbps USB Interface Used for AT command communication, data transmission, GNSS NMEA sentence output, software debugging, firmware upgrade and voice over USB Supports USB serial drivers for: Windows 7/8/8.1/10/11, Linux 2.65.18, Android 4.x12.x, etc. Main UART:

UART Interfaces

- Used for AT command communication and data transmission

- Baud rates reach up to 921600 bps, 115200 bps by default

- Support RTS and CTS hardware flow control Debug UART:

- Used for Linux console and log output

115200bps baud rate SD Card Interface Supports SD 3.0 protocol SGMII Interface Supports 10/100/1000 Mbps Ethernet work mode Supports maximum 150 Mbps (DL)/50 Mbps (UL) for 4G network Rx-diversity Supports LTE/WCDMA Rx-diversity GNSS Features AT Commands Network Indication Protocol: NMEA 0183 Data update rate: 1 Hz by default Compliant with 3GPP TS 27.007, 3GPP TS 27.005 Compliant with Quectel enhanced AT commands Two pins NET_MODE and NET_STATUS to indicate network connectivity status EG21-GL_Hardware_Design 15 / 96 LTE Standard Module Series Antenna Interfaces Main antenna interface (ANT_MAIN) Rx-diversity antenna interface (ANT_DIV) GNSS antenna interface (ANT_GNSS) Physical Characteristics Size: (29.0 0.2) mm (32.0 0.2) mm (2.4 0.2) mm Package: LGA Weight: approx. 4.9 g Temperature Range Operating temperature range: -35 C to +75 C 2 Extended temperature range: -40 C to +85 C 3 Storage temperature range: -40 C to +90 C Firmware Upgrade USB interface or DFOTA RoHS All hardware components are fully compliant with EU RoHS directive. 2 Within operating temperature range, the module is 3GPP compliant. 3 Within the extended temperature range, the module remains the ability to establish and maintain functions such as voice, SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. EG21-GL_Hardware_Design 16 / 96 LTE Standard Module Series 2.3 Functional Diagram The following figure shows a block diagram of EG21-GL and illustrates the major functional parts. Power management Baseband DDR2+NAND flash Radio frequency Peripheral interfaces Figure 1: Functional Diagram EG21-GL_Hardware_Design 17 / 96 ANT_MAINANT_DIVANT_GNSSVBAT_BBVBAT_RFPWRKEYADCsVDD_EXTUSB(U)SIMPCMUARTsI2CRESET_NSTATUSGPIOsControlIQControlTxPRxDRxWLANSDBluetoothSGMIIPMU19.2MXOTransceiverNANDDDR2SDRAMBasebandAPTSAWSAWSAWSwitchDuplexPAMPALNA LTE Standard Module Series 2.4 Pin Assignment The following figure shows the pin assignment of EG21-GL module. Figure 2: Pin Assignment (Top View) NOTE 1. BOOT_CONFIG pins

(WAKEUP_IN, NET_MODE, WLAN_EN, COEX_RXD, COEX_TXD, USB_BOOT and BT_CTS*) cannot be pulled up before startup. 2. PWRKEY output voltage is 0.8 V because of the diode drop in the baseband chipset. 3. USB_BOOT and COEX_RXD are connected inside the module and share the same network. EG21-GL_Hardware_Design 18 / 96 34335362021222324252627282930313233145672WAKEUP_IN AP_READYRESERVEDW_DISABLE#NET_MODE NET_STATUSVDD_EXTGNDGNDDBG_RXDDBG_TXDUSIM_VDDUSIM_DATAUSIM_CLKUSIM_RSTRESERVED8910111213141516171819545352515049484746454443424140393837727170696867666564636261605958575655USIM_GNDGNDRESET_NPWRKEYGNDSD_DETSD_DATA3SD_DATA2SD_DATA1SD_DATA0SD_CLKSD_CMDANT_DIVGNDGNDUSB_VBUSUSB_DMUSB_DPMAIN_RXDMAIN_TXDMAIN_DTRMAIN_RTSMAIN_CTSMAIN_DCDMAIN_RISTATUSVBAT_BBVBAT_BBVBAT_RFVBAT_RFGNDRESERVEDGNDGNDANT_MAINGNDANT_GNSSGNDADC1RESERVEDI2C_SDAI2C_SCLADC0GNDGNDGND737475767778798081828384100101102106107111112103104109105110899498889397869196859095998792108113RESERVEDRESERVED117126125124123122121118127128115USB_BOOTRESERVED116140137136135134133132131130129114SD_PU_VDDPower PinsSignal PinsGND PinsRESERVEDRESERVED141142RESERVEDRESERVED143144119120WLAN PinsRESERVED PinsBluetooth PinsPCM_DINPCM_DOUTPCM_SYNCPCM_CLKBT_CTSBT_RXDBT_TXDBT_RTS139138SGMII PinsUSIM_DET LTE Standard Module Series 4. Pins 3740, 118, 127 and 129139 are used for WLAN & Bluetooth application interfaces, among which pins 118, 127 and 129138 are WLAN function pins, and the rest are Bluetooth function* pins. 5. Pins 119126 and 128 are used for SGMII interface. 6. Pins 2427 of PCM interface can be used not only for audio function on EG21-GL module, but also for Bluetooth function* on FC20 series or FC21 module. 7. Keep all RESERVED pins and unused pins unconnected. 8. GND pin 85112 should be connected to ground in the design. RESERVED pin 7384 should not be designed in schematic and PCB decal, and these pins should be served as a keepout area. 2.5 Pin Description The following tables show the pin definition of EG21-GL module. DC characteristics include power domain and rate current. Table 4: I/O Parameters Definition Type AI AO AIO DI DO DIO OD PI PO Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output EG21-GL_Hardware_Design 19 / 96 LTE Standard Module Series Table 5: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 59, 60 PI Power supply for the modules BB part VBAT_RF 57, 58 PI Power supply for the modules RF part Vmax = 4.3 V Vmin = 3.3 V Vnom = 3.8 V VDD_EXT 7 PO Provide 1.8 V for external circuit Vnom = 1.8 V IOmax = 50 mA GND 8, 9, 19, 22, 36, 46, 48, 5054, 56, 72, 85112 Turn On/Off It must be provided with sufficient current up to 0.8 A. It must be provided with sufficient current up to 1.8 A in a burst transmission. Power supply for external GPIOs pull up circuits. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 21 DI Turn on/off the module RESET_N 20 DI Reset the module Indication Signals The output voltage is 0.8 V because of the diode drop in the chipset. 1.8 V power domain. If unused, keep it open. VIHmax = 2.1 V VIHmin = 1.3 V VILmax = 0.5 V Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 61 OD Indicate the modules operation status VDD_EXT NET_MODE 5 DO Indicate the modules network registration mode VDD_EXT The drive current should be less than 0.9 mA. An external pull-up resistor is required. If unused, keep it open. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. EG21-GL_Hardware_Design 20 / 96 NET_STATUS 6 DO Indicate the modules network activity status VDD_EXT USB Interface LTE Standard Module Series 1.8 V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 71 PI USB_DP 69 AIO USB_DM 70 AIO USB connection detect USB 2.0 differential data (+) USB 2.0 differential data (-)

(U)SIM Interface Vmax = 5.25 V Vmin = 3.0 V Vnom = 5.0 V Typical: 5.0 V If unused, keep it open. USB 2.0 compliant. Require differential impedance of 90 . If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USIM_GND 10

Specified ground for

(U)SIM USIM_VDD 14 PO

(U)SIM card power supply IOmax = 50 mA Low-voltage:

Vmax = 1.9 V Vmin = 1.7 V High-voltage:

Vmax = 3.05 V Vmin = 2.7 V Either 1.8 V or 3.0 V is supported by the module automatically. USIM_DATA 15 DIO

(U)SIM card data USIM_VDD USIM_CLK 16 DO

(U)SIM card clock USIM_VDD USIM_RST 17 DO

(U)SIM card reset USIM_VDD USIM_DET 13 DI

(U)SIM card hot-plug detect VDD_EXT Main UART Interface 1.8 V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment MAIN_RI 62 DO Main UART ring indication VDD_EXT 1.8 V power domain. If unused, keep it EG21-GL_Hardware_Design 21 / 96 MAIN_DCD 63 DO Main UART data carrier detect VDD_EXT open. LTE Standard Module Series MAIN_CTS 64 DO DTE clear to send signal from DCE VDD_EXT MAIN_RTS 65 DI DTE request to send signal to DCE VDD_EXT MAIN_DTR 66 DI Main UART data terminal ready VDD_EXT MAIN_TXD 67 DO Main UART transmit VDD_EXT MAIN_RXD 68 DI Main UART receive VDD_EXT Debug UART Interface Connect to DTEs CTS. 1.8 V power domain. If unused, keep it open. Connect to DTE's RTS. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. Pulled up by default. The pin can wake up the module in the low level. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD DBG_RXD 12 11 ADC Interfaces DO Debug UART transmit VDD_EXT DI Debug UART receive VDD_EXT 1.8 V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment ADC0 45 AI ADC1 44 AI General-purpose analog to digital converter General-purpose analog to digital converter Voltage range:

0.3 V to VBAT_BB If unused, keep it open. EG21-GL_Hardware_Design 22 / 96 LTE Standard Module Series PCM Interface 4 Pin Name Pin No. I/O Description DC Characteristics Comment PCM_DIN 24 DI PCM data input VDD_EXT PCM_DOUT 25 DO PCM data output VDD_EXT PCM_SYNC 26 DIO PCM data frame sync VDD_EXT PCM_CLK 27 DIO PCM clock VDD_EXT 1.8 V power domain. If unused, keep it open. 1.8 V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SCL I2C_SDA 41 42 SD Card Interface OD OD I2C serial clock (for external codec) I2C serial data (for external codec) VDD_EXT VDD_EXT An external pull-up to 1.8 V is required. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment SD_DATA0 31 DIO SDIO data bit 0 SD_PU_VDD SD_DATA1 30 DIO SDIO data bit 1 SD_PU_VDD SD_DATA2 29 DIO SDIO data bit 2 SD_PU_VDD SD_DATA3 28 DIO SDIO data bit 3 SD_PU_VDD SD_CLK 32 DO SD card clock SD_PU_VDD SDIO signal level can be selected according to SD card supported level, see SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, see SD 3.0 protocol for more details. If unused, keep it open. 4 Pins (Pin 2427) of the PCM interface can be used not only for audio function on EG21-GL module, but also for Bluetooth function* on FC20 series or FC21 module. EG21-GL_Hardware_Design 23 / 96 LTE Standard Module Series SD_CMD 33 DIO SD card command SD_PU_VDD SD_DET 23 DI SD card insertion detect VDD_EXT SD_PU_VDD 34 PO 1.8/2.85 V output power for SD card pull-up circuits IOmax = 50 mA WLAN & Bluetooth Application Interfaces SDIO signal level can be selected according to SD card supported level, see SD 3.0 protocol for more details. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Cannot be used for SD card power. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment WLAN_SLP_ CLK 118 DO WLAN sleep clock WLAN_ PWR_EN 127 DO WLAN power supply enable control VDD_EXT SDC_DATA0 132 DIO SDC_DATA1 131 DIO SDC_DATA2 130 DIO SDC_DATA3 129 DIO WLAN SDIO data bit 0 WLAN SDIO data bit 1 WLAN SDIO data bit 2 WLAN SDIO data bit 3 VDD_EXT VDD_EXT VDD_EXT VDD_EXT SDC_CLK 133 DO WLAN SDIO clock VDD_EXT SDC_CMD 134 DO WLAN SDIO command VDD_EXT WAKE_ON_ WIRELESS 135 DI Wi-Fi/Bluetooth wakeup signal to the module VDD_EXT If unused, keep it open. 1.8 V power domain. Active high. If unused, keep it open. 1.8 V power domain. If unused, keep it open. FC20 series or FC21 module wakes up the module. 1.8 V power domain. Active low. If unused, keep it open. EG21-GL_Hardware_Design 24 / 96 WLAN_EN 136 DO WLAN function enable control VDD_EXT COEX_RXD 137 DI COEX_TXD 138 DO LTE & WLAN/

Bluetooth coexistence receive LTE & WLAN/

Bluetooth coexistence transmit VDD_EXT VDD_EXT BT_RTS*

37 DI DTE request to send signal to DCE VDD_EXT BT_TXD*

38 DO BT_RXD*

39 DI Bluetooth UART transmit Bluetooth UART receive VDD_EXT VDD_EXT BT_CTS*

40 DO DTE clear to send signal from DCE VDD_EXT BT_EN*

139 DO Bluetooth enable control VDD_EXT SGMII Interface LTE Standard Module Series 1.8 V power domain. Active high. Cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. Connect to DTE's RTS. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Connect to DTEs CTS. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment SGMII_RST_N 119 DO Ethernet PHY reset SGMII_MDIO_VDD SGMII_INT_N 120 DI Ethernet PHY interrupt VDD_EXT SGMII_MDIO 121 DIO SGMII management data SGMII_MDIO_VDD 1.8/2.85 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8/2.85 V power domain. EG21-GL_Hardware_Design 25 / 96 LTE Standard Module Series SGMII_MDC 122 DO SGMII management data clock SGMII_MDIO_VDD SGMII_TX_M 123 AO SGMII transmit (-) SGMII_TX_P 124 AO SGMII transmit (+) SGMII_RX_P 125 SGMII_RX_M 126 AI AI SGMII receive (+) SGMII receive (-) SGMII_MDIO_ VDD 128 PO SGMII_MDIO pull up power supply IOmax = 50 mA Require external pull-up to SGMII_MDIO_VDD, and the resistor should be 1.5 k. If unused, keep it open. 1.8/2.85 V power domain. If unused, keep it open. Connect with a 0.1 F capacitor, which is close to the two pins of the module. If unused, keep it open. Configurable power source. 1.8/2.85 V power domain. If unused, keep it open. Antenna Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment ANT_DIV 35 AI ANT_MAIN 49 AIO ANT_GNSS 47 AI Other Interface Pins Diversity antenna interface Main antenna interface GNSS antenna interface 50 impedance. If unused, keep it open. 50 impedance. 50 impedance. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment WAKEUP_IN 1 DI External wakeup signal to the module VDD_EXT 1.8 V power domain. Cannot be pulled up before startup. The pin can wake up EG21-GL_Hardware_Design 26 / 96 LTE Standard Module Series the module in the low level. If unused, keep it open. 1.8 V power domain. Pull-up by default. At low voltage level, module can enter into airplane mode. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. Cannot be pulled up before startup. It is recommended to reserve test point. Comment Keep these pins unconnected. W_DISABLE# 4 DI Airplane mode control VDD_EXT AP_READY 2 DI Application processor ready VDD_EXT USB_BOOT 115 DI Force the module into emergency download mode VDD_EXT RESERVED Pins Pin Name Pin No. RESERVED 3, 18, 43, 55, 7384, 113, 114, 116, 117, 140144 2.6 EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (UMTS&LTE EVB) with accessories to control or test the module. For more details, see document [1]. EG21-GL_Hardware_Design 27 / 96 LTE Standard Module Series 3 Operating Characteristics 3.1 Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters. Table 6: Overview of Operating Modes Mode Details Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Voice/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. AT+CFUN=0 can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. AT+CFUN=4 or W_DISABLE# pin can set the module to enter airplane mode. In this case, RF function will be invalid. The current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. The power management unit shuts down the power supply. Software goes inactive. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. Full Functionality Mode Minimum Functionality Mode Airplane Mode Sleep Mode Power Down Mode NOTE See document [2] for details of AT+CFUN. EG21-GL_Hardware_Design 28 / 96 LTE Standard Module Series 3.2 Sleep Mode 3.2.1 UART Application Scenario If the host communicates with module via UART interfaces, the following preconditions can let the module enter sleep mode. Execute AT+QSCLK=1 to enable sleep mode. For details of the command, see document [2]. Drive MAIN_DTR to high level. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART Driving the host MAIN_DTR to low level will wake up the module. When the module has a URC to report, MAIN_RI will wake up the host. See Chapter 4.9.3 for details about MAIN_RI behaviors. AP_READY will detect the sleep state of the host (It can be configured to high or low level detection). See document [3] for details about AT+QCFG="apready". 3.2.2 USB Application Scenario 3.2.2.1 USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to set the module to sleep mode. Execute AT+QSCLK=1 to enable sleep mode. Ensure the MAIN_DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. EG21-GL_Hardware_Design 29 / 96 MAIN_RXDMAIN_TXDMAIN_RIMAIN_DTRAP_READYTXDRXDEINTGPIOGPIOModuleHostGNDGND The following figure shows the connection between the module and the host. LTE Standard Module Series Figure 4: Sleep Mode Application with USB Remote Wakeup Sending data to the module through USB will wake up the module. When the module has a URC to report, it will send remote wake-up signals via USB bus to wake up the host. 3.2.2.2 USB Application with USB Suspend/Resume and MAIN_RI Function If the host supports USB suspend and resume, but does not support remote wakeup function, MAIN_RI signal is needed to wake up the host. There are three preconditions to set the module to sleep mode. Execute AT+QSCLK=1 to enable the sleep mode. Ensure the MAIN_DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. Figure 5: Sleep Mode Application with MAIN_RI EG21-GL_Hardware_Design 30 / 96 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostGNDGNDUSB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostGNDGNDMAIN_RIEINT Sending data to the module via USB will wake up the module. When the module has a URC to report, MAIN_RI signal will wake up the host. LTE Standard Module Series 3.2.2.3 USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected with an external control circuit to set the module to sleep mode. Execute AT+QSCLK=1 to enable sleep mode. Ensure the MAIN_DTR is held at high level or keep it open. Disconnect USB_VBUS. The following figure shows the connection between the module and the host. Figure 6: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. NOTE Pay attention to the level match shown in dotted line between the module and the host. For more details about the module power management application, see document [4]. 3.2.3 Airplane Mode When the module enters airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. This mode can be set via the following ways. EG21-GL_Hardware_Design 31 / 96 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostMAIN_RIEINTPower SwitchGPIOGNDGND LTE Standard Module Series Hardware:

The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. Software:

AT+CFUN provides the choice of the functionality level through setting <fun> into 0, 1 or 4. AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled. AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode. RF function is disabled. NOTE 1. The W_DISABLE# control function is disabled in firmware by default. It can be enabled by AT+QCFG="airplanecontrol". 2. The execution of AT+CFUN will not affect GNSS function. 3.3 Power Supply 3.3.1 Power Supply Pins The module provides four VBAT pins for connection with the external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for modules RF part Two VBAT_BB pins for modules BB part The following table shows the details of VBAT pins and ground pins. Table 7: Pin Definition of VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_BB 59, 60 Power supply for modules BB part 3.3 VBAT_RF 57, 58 Power supply for modules RF part 3.3 3.8 3.8 4.3 4.3 V V GND 8, 9, 19, 22, 36, 46, 48, 5054, 56, 72, 85112 EG21-GL_Hardware_Design 32 / 96 LTE Standard Module Series 3.3.2 Voltage Stability Requirements The power supply range of the module is from 3.3 V to 4.3 V. Please make sure that the input voltage will never drop below 3.3 V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100 F with low ESR (ESR = 0.7 ) should be used for VBAT_BB and VBAT_RF respectively, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors

(100 nF, 33 pF, 100 pF) for composing the MLCC array, and place these capacitors close to VBAT_BB and VBAT_RF. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be not less than 1 mm; and the width of VBAT_RF trace should be not less than 2 mm. In principle, the longer the VBAT trace is, the wider it should be. In addition, in order to avoid the damage caused by electric surge and electrostatics discharge (ESD), it is suggested that a TVS diode with suggested low reverse stand-off voltage VRWM 4.5 V, low clamping voltage VC and high reverse peak pulse current IPP should be used. The following figure shows the star structure of the power supply. EG21-GL_Hardware_Design 33 / 96 Power Supply (V)Burst TransmissionRippleDropBurst TransmissionLoad (A) LTE Standard Module Series Figure 8: Star Structure of the Power Supply 3.3.3 Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2.0 A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5.0 V input power source. The typical output of the power supply is about 3.8 V and the maximum load current is 3.0 A. Figure 9: Reference Circuit of Power Supply EG21-GL_Hardware_Design 34 / 96 ModuleVBAT_RFVBAT_BBVBATC1C6C7C8++C2C5C3C4D14.5 V100 F100 nF33 pF100 pF100 F100 nF33 pF10 pFDC_INMIC29302WUINOUTENGNDADJ24135VBAT 100K47K470R51K1%1%4.7K47KVBAT_EN470 F470 F100 nF100 nF LTE Standard Module Series NOTE To avoid corrupting the data in the internal flash, do not switch off the power supply when the module works normally. Only after shutting down the module with PWRKEY or AT command can you cut off the power supply. 3.3.4 Power Supply Voltage Monitoring AT+CBC can be used to monitor the VBAT_BB voltage value. For more details, see document [2]. 3.4 Turn On 3.4.1 Turn On with PWRKEY The following table shows the pin definition of PWRKEY. Table 8: Pin Definition of PWRKEY Pin Name Pin No. I/O Description Comment PWRKEY 21 DI Turn on/off the module The output voltage is 0.8 V because of the diode drop in the chipset. When the module is in power down mode, it can be turned on by driving PWRKEY low for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY. After STATUS pin

(requires external pull-up resistor) outputs a low level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. Figure 10: Turn On the Module by Using Driving Circuit EG21-GL_Hardware_Design 35 / 96 PWRKEY4.7K47KTurn-on pulse 500 ms10 nF The other way to control the PWRKEY is using a button directly. When pressing the button, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. LTE Standard Module Series Figure 11: Turn On the Module by Using a Button The power-up timing is illustrated in the following figure. Figure 12: Power-up Timing EG21-GL_Hardware_Design 36 / 96 PWRKEYS1Close to S1TVSVIL 0.5 VVBATPWRKEY 500 msRESET_NSTATUS(OD)InactiveActiveUARTNOTE 1InactiveActiveUSB 2.5 s 12 s 13 sVDD_EXTAbout 100 msBOOT_CONFIG & USB_BOOT Pins 100 ms. After this time, the BOOT_CONFIG pins can be set to high level by external circuit. LTE Standard Module Series NOTE 1. Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is not less than 30 ms. 2. PWRKEY can be pulled down directly to GND with a recommended 10 k resistor if the module needs to be turned on automatically and shutdown is not needed. 3. BOOT_CONFIG pins

(WAKEUP_IN, NET_MODE, WLAN_EN, COEX_RXD, COEX_TXD, USB_BOOT and BT_CTS*) cannot be pulled up before startup. 4. Ensure that there is no large capacitance on PWRKEY pin. 3.5 Turn Off The following procedures can be used to turn off the module normally:

Use the PWRKEY pin. Use AT+QPOWD command. For details of the command, see document [2]. 3.5.1 Turn Off with PWRKEY Driving PWRKEY low for at least 650 ms, the module will execute power-off procedure after the PWRKEY is released. The power-down timing is illustrated in the following figure. Figure 13: Power-down Timing 3.5.2 Turn Off with AT Command It is also a safe way to use AT+QPOWD to turn off the module, which is similar to turning off the module via the PWRKEY pin. EG21-GL_Hardware_Design 37 / 96 VBATPWRKEY 29.5 s 650 msRunningPower-down procedureOFFModuleStatusSTATUS(OD) LTE Standard Module Series NOTE 1. To avoid corrupting the data in the internal flash, do not switch off the power supply when the module works normally. Only after turning off the module with PWRKEY or AT command can you cut off the power supply. 2. When turning off module with the AT command, keep PWRKEY at high level after the execution of the command. Otherwise, the module will be turned on again after successfully turn-off. 3.6 Reset The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N low for 150460 ms. Table 9: Pin Definition of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 20 DI Reset the module 1.8 V power domain. If unused, keep it open. The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 14: Reference Circuit of RESET_N by Using Driving Circuit EG21-GL_Hardware_Design 38 / 96 Reset pulseRESET_N4.7K47K150460 ms LTE Standard Module Series Figure 15: Reference Circuit of RESET_N by Using a Button The reset scenario is illustrated in the following figure. Figure 16: Reset Timing NOTE 1. Use RESET_N only when failed to turn off the module by AT+QPOWD and PWRKEY pin. 2. Ensure that there is no large capacitance on RESET_N pin. EG21-GL_Hardware_Design 39 / 96 RESET_NS2Close to S2TVSVIL 0.5 VVIH 1.3 VVBAT 150 msResettingModule StatusRunningRESET_NRestart 460 ms LTE Standard Module Series 4 Application Interfaces 4.1 (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Either 1.8 V or 3.0 V (U)SIM card is supported. Table 10: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Description Comment USIM_VDD 14 PO

(U)SIM card power supply Either 1.8 V or 3.0 V is supported by the module automatically. USIM_DATA 15 DIO

(U)SIM card data USIM_CLK 16 DO

(U)SIM card clock USIM_RST 17 DO

(U)SIM card reset USIM_DET 13 DI

(U)SIM card hot-plug detect 1.8 V power domain. If unused, keep it open. USIM_GND 10

Specified ground for (U)SIM The module supports (U)SIM card hot-plug via the USIM_DET pin, and both high and low level detection are supported. The function is disabled by default, and see AT+QSIMDET in document [2] for more details. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. EG21-GL_Hardware_Design 40 / 96 LTE Standard Module Series Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, keep USIM_DET unconnected. A reference circuit of

(U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in your applications, please follow the criteria below in (U)SIM circuit design:

Place the (U)SIM card connector as close to the module as possible. Keep the trace length as short as possible, at most 200 mm. Keep (U)SIM card signal traces away from RF and power supply traces. Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1 F, and place it as close to (U)SIM card connector as possible. If the ground is complete on your PCB, USIM_GND can EG21-GL_Hardware_Design 41 / 96 ModuleUSIM_VDDUSIM_GNDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_DET0R0R0RVDD_EXT51K100 nFGNDGND33 pF33 pF33 pFVCCRSTCLKIOVPPGNDGNDUSIM_VDD15K(U)SIM Card ConnectorTVS arrayModuleUSIM_VDDUSIM_GNDUSIM_RSTUSIM_CLKUSIM_DATA0R0R0RGNDVCCRSTCLKIOVPPGNDGND15KUSIM_VDD(U)SIM Card Connector33 pF33 pF33 pF100 nFTVS array LTE Standard Module Series be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS array whose parasitic capacitance should not be more than 15 pF. The 0 resistors should be added in series between the module and the (U)SIM card to facilitate debugging. The 33 pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the

(U)SIM card connector. The pull-up resistor on USIM_DATA trace can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 4.2 USB Interface The module contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface can only serve as the slave device. USB interface is used for AT command communication, data transmission, GNSS NMEA sentence output, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface. Table 11: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_DP USB_DM 69 70 AIO USB 2.0 differential data (+) USB 2.0 compliant. AIO USB 2.0 differential data (-) Require differential impedance of 90 . If unused, keep it open. USB_VBUS 71 PI USB connection Typical 5.0 V GND 72

Ground For more details about the USB 2.0 specifications, visit http://www.usb.org/home. The USB interface is recommended to be reserved for firmware upgrade in your design. The following figure shows a reference circuit of USB interface. EG21-GL_Hardware_Design 42 / 96 LTE Standard Module Series Figure 19: Reference Circuit of USB Interface A common-mode choke L1 is recommended to be added in series between the module and your MCU to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. To ensure the integrity of USB data trace signal, L1/R3/R4 component must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90 . Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer, and surround the traces with ground on that layer and with ground planes above and below. Junction capacitance of the ESD protection component might cause influences on USB data traces, so pay attention to the selection of the component. Typically, the stray capacitance should be less than 2 pF. Keep the ESD protection components to the USB connector as close as possible. 4.3 UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. The main UART interface supports 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800 and EG21-GL_Hardware_Design 43 / 96 USB_DPUSB_DMGNDUSB_DPUSB_DMGNDL1Close to ModuleR3R4Test PointsESD ArrayNM_0RNM_0RMinimize these stubsModuleMCUUSB_VBUSVDD LTE Standard Module Series 921600 bps baud rates, and the default is 115200 bps. It also supports RTS and CTS hardware flow control, and can be used for data transmission and AT command communication. The debug UART interface supports 115200 bps baud rate. It is used for Linux console and log output. The following tables show the pin definition of the UART interfaces. Table 12: Pin Definition of Main UART Interface Pin Name Pin No. I/O Description Comment MAIN_RI 62 DO Main UART ring indication MAIN_DCD 63 DO Main UART data carrier detect MAIN_CTS 64 DO DTE clear to send signal from DCE MAIN_RTS 65 DI DTE request to send signal to DCE MAIN_DTR 66 DI Main UART data terminal ready MAIN_TXD 67 DO Main UART transmit MAIN_RXD 68 DI Main UART receive Table 13: Pin Definition of Debug UART Interface 1.8 V power domain. If unused, keep it open. Connect to DTEs CTS. 1.8 V power domain. If unused, keep it open. Connect to DTE's RTS. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. Pulled up by default. The pin can wake up the module in the low level. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Pin Name Pin No. I/O Description Comment DBG_TXD DBG_RXD 12 11 DO DI Debug UART transmit Debug UART receive 1.8 V power domain. If unused, keep it open. The module provides 1.8 V UART interfaces. A level translator should be used if your application is equipped with a 3.3 V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. EG21-GL_Hardware_Design 44 / 96 LTE Standard Module Series Figure 20: Reference Circuit with Translator Chip Visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. For the design of circuits shown in dotted lines, see that shown in solid lines, but pay attention to the direction of connection. Figure 21: Reference Circuit with Transistor Circuit NOTE 1. Transistor circuit solution is not suitable for applications with high baud rates exceeding 460 kbps. 2. Please note that the modules CTS is connected to the hosts CTS, and the modules RTS is connected to the hosts RTS. EG21-GL_Hardware_Design 45 / 96 VCCAVCCBOEA1A2A3A4A5A6A7A8GNDB1B2B3B4B5B6B7B8VDD_EXTMAIN_RIMAIN_DCDMAIN_RTSMAIN_RXDMAIN_DTRMAIN_CTSMAIN_TXD51K51K0.1 F0.1 FRI_MCUDCD_MCURTS_MCURXD_MCUDTR_MCUCTS_MCUTXD_MCUVDD_MCUTranslator10K120KMCU/ARMTXDRXDVDD_EXT10KVCC_MCU4.7K10KVDD_EXTMAIN_TXDMAIN_RXDMAIN_RTSMAIN_CTSMAIN_DTRMAIN_RIRTSCTSGNDGPIOMAIN_DCDModuleGPIOEINTVDD_EXT4.7KGND1 nF1 nF LTE Standard Module Series 4.4 PCM and I2C Interfaces The module provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes, and one I2C interface:

Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256, 512, 1024 or 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4096 kHz PCM_CLK at 16 kHz PCM_SYNC. In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256, 512, 1024 or 2048 kHz PCM_CLK and an 8 kHz, 50% duty cycle PCM_SYNC. The module supports 16-bit linear data format. The following figures show the primary modes timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary modes timing relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK. Figure 22: Primary Mode Timing EG21-GL_Hardware_Design 46 / 96 PCM_CLKPCM_SYNCPCM_DOUTMSBLSBMSB12256255PCM_DINMSBLSBMSB125 s LTE Standard Module Series Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_DIN 24 DI PCM data input PCM_DOUT 25 DO PCM data output 1.8 V power domain. If unused, keep it open. PCM_SYNC 26 DIO PCM data frame sync PCM_CLK 27 DIO PCM clock I2C_SCL 41 OD I2C_SDA 42 OD I2C serial clock (for external codec) I2C serial data (for external codec) 1.8 V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. An external pull-up to 1.8 V is required. If unused, keep it open. Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. See document [2]

for more details about AT+QDAI. The following figure shows a reference design of PCM and I2C interfaces with external codec IC. EG21-GL_Hardware_Design 47 / 96 PCM_CLKPCM_SYNCPCM_DOUTMSBLSBPCM_DINMSB123231LSB125 s LTE Standard Module Series Figure 24: Reference Circuit of PCM and I2C Application with Audio Codec NOTE 1. It is recommended to reserve an RC (R = 22 , C = 22 pF) circuits on the PCM lines, especially for PCM_CLK. 2. The module works as a master device pertaining to I2C interface. 4.5 SD Card Interface The module supports SDIO 3.0 interface for SD card. The following table shows the pin definition of SD card interface. Table 15: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SD_DATA0 31 DIO SDIO data bit 0 SD_DATA1 30 DIO SDIO data bit 1 SD_DATA2 29 DIO SDIO data bit 2 SD_DATA3 28 DIO SDIO data bit 3 SD_CLK 32 DO SD card clock SDIO signal level can be selected according to SD card supported level, see SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, see SD 3.0 protocol for more details. If unused, keep it open. EG21-GL_Hardware_Design 48 / 96 PCM_DINPCM_DOUTPCM_SYNCPCM_CLKI2C_SCLI2C_SDAModule1.8 V4.7K4.7KBCLKLRCKDACADCSCLSDABIASMICBIASINPINNLOUTPLOUTNCodec LTE Standard Module Series SDIO signal level can be selected according to SD card supported level, see SD 3.0 protocol for more details. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Cannot be used for SD card power. If unused, keep it open. SD_CMD 33 DIO SD card command SD_DET 23 DI SD_PU_VDD 34 PO SD card insertion detect 1.8/2.85 V output power for SD card pull-up circuits The following figure shows a reference design of SD card. Figure 25: Reference Circuit of SD Card Interface In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with:

SD_DET must be connected. The voltage range of SD card power supply VDD_3V is 2.73.6 V and a sufficient current up to 0.8 A should be provided. As the maximum output current of SD_PU_VDD is 50 mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card. To avoid jitter of bus, resistors R7R11 are needed to pull up the SDIO to SD_PU_VDD. Value of these resistors is among 10100 k and the recommended value is 100 k. SD_PU_VDD should be used as the pull-up power. In order to adjust signal quality, it is recommended to add 0 resistors R1R6 in series between the module and the SD card. The bypass capacitors C1C6 are reserved and not mounted by default. All resistors and bypass capacitors should be placed close to the module. In order to offer good ESD protection, it is recommended to add a TVS diode on SD card pins near the SD card connector with junction capacitance less than 15 pF. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. EG21-GL_Hardware_Design 49 / 96 SD Card ConnectorDAT2CD/DAT3CMDVDDCLKVSSDAT0DAT1DETECTIVEModuleSD_DATA3SD_DATA2SD_DATA1SD_PU_VDDSD_DATA0SD_CLKSD_CMDSD_DETR1 0RR7NMR8NMR9NMR10NMR11NMR12470KVDD_EXTVDD_3VR2 0RR3 0RR4 0RR5 0RR6 0RC2NMD2C3NMD3C4NMD4C5NMD5C6NMD6C1NMD1D7+C10100 FC9100 nFC833 pFC710 pF LTE Standard Module Series It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data trace is 50 (10%). Make sure the adjacent trace spacing is twice of the trace width and the load capacitance of SDIO bus should be less than 15 pF. It is recommended to keep the trace length difference between SD_CLK and SD_DATA[0:3]/

SD_CMD less than 1mm and the total routing length less than 50 mm. The total trace length inside the module is 27 mm, so the exterior total trace length should be less than 23 mm. 4.6 WLAN and Bluetooth Application Interfaces The module supports a SDIO 3.0 interface for WLAN function, and UART and PCM interfaces for Bluetooth function*. The following table shows the pin definition of WLAN and Bluetooth application interfaces. Table 16: Pin Definition of WLAN & Bluetooth Application Interfaces Pin Name Pin No. I/O Description Comment WLAN Application Interfaces SDC_DATA0 132 DIO WLAN SDIO data bit 0 SDC_DATA1 131 DIO WLAN SDIO data bit 1 SDC_DATA2 130 DIO WLAN SDIO data bit 2 SDC_DATA3 129 DIO WLAN SDIO data bit 3 1.8 V power domain. If unused, keep it open. SDC_CLK 133 DO WLAN SDIO clock SDC_CMD 134 DO WLAN SDIO command WLAN_EN 136 DO WLAN function enable control 1.8 V power domain. Active high. Cannot be pulled up before startup. If unused, keep it open. Coexistence and Control Interfaces WLAN_SLP_ CLK WLAN_PWR _EN 118 DO WLAN sleep clock If unused, keep it open. 127 DO WLAN power supply enable control 1.8 V power domain. Active high. If unused, keep it open. EG21-GL_Hardware_Design 50 / 96 LTE Standard Module Series FC20 series or FC21 module wakes up the module. 1.8 V power domain. Active low. If unused, keep it open. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. WAKE_ON_ WIRELESS 135 DI Wi-Fi/Bluetooth wakeup signal to the module COEX_RXD 137 DI COEX_TXD 138 DO LTE & WLAN/ Bluetooth coexistence receive LTE & WLAN/

Bluetooth coexistence transmit Bluetooth Application Interfaces BT_RTS*

37 DI DTE request to send signal to DCE BT_TXD*

BT_RXD*

38 39 DO Bluetooth UART transmit DI Bluetooth UART receive Connect to DTE's RTS. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. BT_CTS*

40 DO DTE clear to send signal from DCE BT_EN*

139 DO Bluetooth enable control PCM_DIN 5 24 DI PCM data input PCM_DOUT 5 25 DO PCM data output PCM_SYNC 5 26 DIO PCM data frame sync PCM_CLK 5 27 DIO PCM clock Connect to DTEs CTS. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. The following figure shows a reference design of WLAN and Bluetooth application interfaces with Quectel FC20 series or FC21 module. 5 Pins (Pin 2427) of PCM interface can be used not only for audio function on EG21-GL module, but also for Bluetooth function* on FC20 series or FC21 module. EG21-GL_Hardware_Design 51 / 96 LTE Standard Module Series Figure 26: Reference Circuit of WLAN & Bluetooth Application Interfaces with FC20 Series/FC21 NOTE 1. FC20 series or FC21 module can only be used as a slave device. 2. When Bluetooth function* is enabled on the module, PCM_SYNC and PCM_CLK pins can only be used to output signals. 3. For more information about WLAN and Bluetooth application interfaces, see document [5]. EG21-GL_Hardware_Design 52 / 96 ModuleWAKE_ON_WIRELESSWLAN_SLP_CLKWLAN_PWR_ENDC-DC/LDO32KHz_INWAKE_ON_WIRELESSVDD_3V3POWERSDC_DATA3SDC_DATA2SDC_DATA1SDC_DATA0SDC_CLKSDC_CMDWLAN_ENSDIO_D3SDIO_D2SDIO_D1SDIO_D0SDIO_CLKSDIO_CMDWLAN_ENWLANBT_ENBT_RTSBT_CTSBT_TXDBT_RXDPCM_DINPCM_DOUTPCM_SYNCPCM_CLKBT_ENBT_UART_RTSBT_UART_CTSBT_UART_RXDBT_UART_TXDPCM_OUTPCM_INPCM_SYNCPCM_CLKVDD_EXTVIOCOEX_TXDCOEX_RXDLTE_UART_TXDLTE_UART_RXDCOEXBluetoothFC20 Series/ FC21 Module LTE Standard Module Series 4.6.1 WLAN Application Interface The module provides a SDIO 3.0 interface and control interface for WLAN design. SDIO interface supports SDR mode, and the maximum frequency is up to 50 MHz. As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles:

It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 50 10%. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. It is recommended to keep matching length between SDC_CLK and SDC_DATA[0:3]/SDC_CMD less than 1 mm and total routing length less than 50 mm. Keep termination resistors within 1524 on clock traces near the module and keep the route distance from the module clock pins to termination resistors less than 5 mm. Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than 15 pF. 4.6.2 Bluetooth Application Interface*

The module supports a dedicated UART interface and a PCM interface for Bluetooth application. Further information about Bluetooth interface will be added in the future version of this document. 4.7 ADC Interfaces The module provides two Analog-to-Digital Converter (ADC) interfaces. AT+QADC=0 can be used to read the voltage value on ADC0 pin. AT+QADC=1 can be used to read the voltage value on ADC1 pin. For more details about these AT commands, see document [2]. To improve the accuracy of ADC, the trace of ADC should be surrounded by ground. Table 17: Pin Definition of ADC Interfaces Pin Name Pin No. I/O Description Comment ADC0 ADC1 45 44 AI General-purpose analog to digital converter AI General-purpose analog to digital converter If unused, keep it open. EG21-GL_Hardware_Design 53 / 96 LTE Standard Module Series The following table describes the characteristic of ADC function. Table 18: Characteristic of ADC Parameter Min. Typ. Max. ADC0 Voltage Range ADC1 Voltage Range ADC Resolution 0.3 0.3

15 VBAT_BB VBAT_BB

Unit V V bits NOTE 1. ADC input voltage must not exceed that of VBAT_BB. 2. 3. It is prohibited to supply any voltage to ADC pins when VBAT power supply is removed. It is recommended to use a resistor divider circuit for ADC application. 4.8 SGMII Interface The module includes an integrated Ethernet MAC with four SGMII data signals, two management signals and two control signals. The key features of the SGMII interface are shown below:

IEEE802.3 compliant Supports 10/100/1000 Mbps Ethernet work mode Supports maximum 150 Mbps (DL)/50 Mbps (UL) for 4G network Supports VLAN tagging Supports IEEE1588 and Precision Time Protocol (PTP) Can be used to connect to external Ethernet PHY like AR8033, or to an external switch Management interfaces support dual voltage 1.8/2.85 V The following table shows the pin definition of SGMII interface. Table 19: Pin Definition of SGMII Interface Pin Name Pin No. I/O Description Comment Control and Management Signals SGMII_RST_N 119 DO Ethernet PHY reset 1.8/2.85 V power domain. If unused, keep it open. EG21-GL_Hardware_Design 54 / 96 SGMII_INT_N 120 DI Ethernet PHY interrupt SGMII_MDIO 121 DIO SGMII management data LTE Standard Module Series 1.8 V power domain. If unused, keep it open. 1.8/2.85 V power domain. Require external pull-up to SGMII_MDIO_VDD, and the resistor should be 1.5 k. If unused, keep it open. SGMII_MDC 122 DO SGMII management data clock 1.8/2.85 V power domain. If unused, keep it open. SGMII_MDIO_ VDD 128 PO SGMII_MDIO pull up power supply Configurable power source. 1.8/2.85 V power domain. If unused, keep it open. SGMII Data Signals SGMII_TX_M 123 AO SGMII transmit (-) SGMII_TX_P 124 AO SGMII transmit (+) SGMII_RX_P 125 AI SGMII receive (+) SGMII_RX_M 126 AI SGMII receive (-) Connect with a 0.1 F capacitor, which is close to the PHY side. If unused, keep it open. The following figure shows the simplified block diagram for Ethernet application. Figure 27: Simplified Block Diagram for Ethernet Application The following figure shows a reference design of SGMII interface with PHY AR8033 application. EG21-GL_Hardware_Design 55 / 96 ModuleAR8033EthernetTransformerRJ45SGMIIControl and ManagementMDI LTE Standard Module Series Figure 28: Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in your applications, please follow the criteria below in the Ethernet PHY circuit design:

Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. Keep the maximum trace length less than 10 inches and keep skew on the differential pairs less than 20 mil. The differential impedance of SGMII data trace is 100 10%, and the reference ground of the area should be complete. Make sure the trace spacing between SGMII_TX_P/M and SGMII_RX_P/M is at least 3 times of the trace width, and the same to the adjacent signal traces. 4.9 Indication Signals 4.9.1 Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two pins which are NET_MODE and NET_STATUS. The following tables describe the pin definition and logic level changes in different network status. EG21-GL_Hardware_Design 56 / 96 SGMII_MDIOSGMII_INT_NMDIORSTNMDCR1R210KVDD_EXTModuleAR80331.5KSGMII_MDIO_VDDSGMII_RST_NINTSGMII_MDCC1C2C3C4SGMII_TX_MSGMII_TX_PSGMII_RX_PSGMII_RX_MSIPSINSOPSONClose to ModuleClose to AR8033ControlSGMII Data0.1 FSGMII_MDIO_VDDSGMII_MDIO_VDD0.1 F0.1 F0.1 F LTE Standard Module Series Table 20: Pin Definition of Network Connection Status/Activity Indication Pin Name Pin No. I/O Description Comment NET_MODE 5 DO Indicate the modules network registration mode 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. NET_STATUS 6 DO Indicate the modules network activity status 1.8 V power domain. If unused, keep it open. Table 21: Working State of Network Connection Status/Activity Indication Pin Name Logic Level Changes Network Status NET_MODE Always High Always Low Registered on LTE network Others Flicker slowly (200 ms High/1800 ms Low) Network searching NET_STATUS Flicker slowly (1800 ms High/200 ms Low) Idle Flicker quickly (125 ms High/125 ms Low) Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure. Figure 29: Reference Circuit of the Network Indication EG21-GL_Hardware_Design 57 / 96 4.7K47KVBAT2.2KModuleNetwork Indicator LTE Standard Module Series 4.9.2 STATUS The STATUS pin is an open drain output for indicating the modules operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 22: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 61 OD Indicate the modules operation status An external pull-up resistor is required. If unused, keep it open. The following figure shows different circuit designs of STATUS, and you can choose either one according to your application demands. Figure 30: Reference Circuits of STATUS NOTE The status pin cannot be used as indication of module shutdown status when VBAT power supply is removed. 4.9.3 MAIN_RI AT+QCFG="risignaltype","physical" can be used to configure MAIN_RI behaviors. No matter on which port a URC is presented, the URC will trigger the behaviors of MAIN_RI pin. The default behaviors of AT+QCFG="urc/ri/ring". See document [3] for details. the MAIN_RI are shown as below, and can be changed by EG21-GL_Hardware_Design 58 / 96 VDD_MCU10KModuleSTATUSMCU_GPIOModuleSTATUSVBAT2.2K Table 23: Behaviors of MAIN_RI LTE Standard Module Series Response MAIN_RI keeps at high level MAIN_RI outputs 120 ms low pulse when a new URC returns State Idle URC NOTE A URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG. The default port is USB AT port. See document [2] for details. 4.10 USB_BOOT The module provides a USB_BOOT pin. You can pull up USB_BOOT to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface. Table 24: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 115 DI Force the module into emergency download mode 1.8 V power domain. Cannot be pulled up before startup. It is recommended to reserve test point. The following figures show the reference circuit of USB_BOOT interface and timing sequence of entering emergency download mode. EG21-GL_Hardware_Design 59 / 96 LTE Standard Module Series Figure 31: Reference Circuit of USB_BOOT Interface Figure 32: Timing Sequence for Entering Emergency Download Mode NOTE 1. Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is not less than 30 ms. 2. When using MCU to control module to enter the emergency download mode, please follow the above timing sequence. It is not recommended to pull up USB_BOOT to 1.8 V before powering up VBAT. Connect the test points as shown in Figure 31 can manually force the module to enter download mode. EG21-GL_Hardware_Design 60 / 96 ModuleUSB_BOOTVDD_EXT4.7KTest pointsTVSClose to test pointsVBATPWRKEYRESET_NVDD_EXTUSB_BOOTUSB_BOOT can be pulled up to 1.8 V before VDD_EXT Is powered up, and the module will enter emergency download mode when it is powered on.NOTE 1 500 msVIL 0.5 VAbout 100 ms LTE Standard Module Series 5 RF Specifications 5.1 Cellular Network 5.1.1 Antenna Interface & Frequency Bands The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 25: Pin Definition of Antenna Antennas Pin Name Pin No. I/O Description Comment ANT_MAIN 49 AIO Main antenna interface 50 impedance ANT_DIV 35 AI Diversity antenna interface 50 impedance. If unused, keep it open. Table 26: Frequency Bands 3GPP Bands Transmit GSM850 824849 EGSM900 880915 Receive 869894 925960 DCS1800 17101785 18051880 Unit MHz MHz MHz PCS1900 18501910 19301990 MHz WCDMA B1 19201980 21102170 WCDMA B2 18501910 19301990 WCDMA B4 17101755 21102155 WCDMA B5 824849 WCDMA B6 830840 869894 875885 MHz MHz MHz MHz MHz EG21-GL_Hardware_Design 61 / 96 LTE Standard Module Series WCDMA B8 880915 WCDMA B19 830845 925960 875890 MHz MHz LTE-FDD B1 19201980 21102170 LTE-FDD B2 18501910 19301990 LTE-FDD B3 17101785 18051880 LTE-FDD B4 17101755 21102155 LTE-FDD B5 824849 869894 LTE-FDD B7 25002570 26202690 LTE-FDD B8 880915 LTE-FDD B12 699716 LTE-FDD B13 777787 LTE-FDD B18 815830 LTE-FDD B19 830845 LTE-FDD B20 832862 925960 729746 746756 860875 875890 791821 LTE-FDD B25 18501915 19301995 LTE-FDD B26 814849 LTE-FDD B28 703748 859894 758803 LTE-TDD B34 20102025 20102025 LTE-TDD B38 25702620 25702620 LTE-TDD B39 18801920 18801920 LTE-TDD B40 23002400 23002400 LTE-TDD B41 24962690 24962690 LTE-FDD B66 17101780 21102180 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EG21-GL_Hardware_Design 62 / 96 LTE Standard Module Series 5.1.2 Tx Power The following table shows the RF output power of the module. Table 27: EG21-GL Tx Power Frequency Bands Max. RF Output Power Min. RF Output Power GSM850/EGSM900 33 dBm 2 dB 5 dBm 5 dB DCS1800/PCS1900 30 dBm 2 dB 0 dBm 5 dB GSM850/EGSM900 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB DCS1800/PCS1900 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB WCDMA bands 24 dBm +1/-3 dB

< -49 dBm LTE-FDD bands 23 dBm 2 dB LTE-TDD bands 23 dBm 2 dB

< -39 dBm

< -39 dBm NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 5.1.3 Rx Sensitivity The following tables show the conducted RF receiving sensitivity of the module. Table 28: EG21-GL Conducted RF Receiving Sensitivity Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO 6 GSM850 EGSM900

-108 dBm

-107 dBm

3GPP (SIMO)

-102.4 dBm

-102.4 dBm 6 SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve Rx performance. EG21-GL_Hardware_Design 63 / 96 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 LTE Standard Module Series

-107 dBm

-107.5 dBm

-102.4 dBm

-102.4 dBm

-108dBm

-109 dBm

-110 dBm

-106.7 dBm

-108 dBm

-108 dBm

-110 dBm

-104.7 dBm

-107 dBm

-109 dBm

-109 dBm

-106.7 dBm

-109.5 dBm

-109.5 dBm

-110.4 dBm

-104.7 dBm

-109 dBm

-110 dBm

-110.5 dBm

-106.7 dBm

-109.5 dBm

-110 dBm

-110 dBm

-103.7 dBm WCDMA B19

-110 dBm

-109.5 dBm

-110.1 dBm

-106.7 dBm LTE-FDD B1 (10 MHz)

-96.7 dBm

-96.3 dBm

-99.5 dBm

-96.3 dBm LTE-FDD B2 (10 MHz)

-97.5 dBm

-97.5 dBm

-100 dBm

-94.3 dBm LTE-FDD B3 (10 MHz)

-97 dBm

-97 dBm

-98 dBm

-93.3 dBm LTE-FDD B4 (10 MHz)

-96.3 dBm

-96.3 dBm

-99.7 dBm

-96.3 dBm LTE-FDD B5 (10 MHz)

-96.3 dBm

-96.4 dBm

-100 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-95.5 dBm

-94.8 dBm

-99.2 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-97 dBm

-97 dBm

-101 dBm

-93.3 dBm LTE-FDD B12 (10 MHz)

-97.5 dBm

-98 dBm

-99.8 dBm

-93.3 dBm LTE-FDD B13 (10 MHz)

-97.2 dBm

-97.3 dBm

-98 dBm

-93.3 dBm LTE-FDD B18 (10 MHz)

-96.7 dBm

-96.4 dBm

-101 dBm

-96.3 dBm LTE-FDD B19 (10 MHz)

-96.7 dBm

-96.5 dBm

-100.5 dBm

-96.3 dBm LTE-FDD B20 (10 MHz)

-97.2 dBm

-97.4 dBm

--101 dBm

-93.3 dBm LTE-FDD B25 (10 MHz)

-97.5 dBm

-97.4 dBm

-101 dBm

-92.8 dBm LTE-FDD B26 (10 MHz)

-96.2 dBm

-97.3 dBm

-101 dBm

-93.8 dBm LTE-FDD B28 (10 MHz)

-97 dBm

-98.0 dBm

-101 dBm

-94.8 dBm LTE-TDD B34 (10 MHz)

-96.7 dBm

-96.8 dBm

-100.5 dBm

-96.3 dBm EG21-GL_Hardware_Design 64 / 96 LTE Standard Module Series LTE-TDD B38 (10 MHz)

-97 dBm

-97 dBm

-100 dBm

-96.3 dBm LTE-TDD B39 (10 MHz)

-97.5 dBm

-97.5 dBm

-100 dBm

-96.3 dBm LTE-TDD B40 (10 MHz)

-97.3 dBm

-97.5 dBm

-100.5dBm

-96.3 dBm LTE-TDD B41 (10 MHz)

-96.3 dBm

-97 dBm

-99.5 dBm

-94.3 dBm LTE-FDD B66 (10 MHz)

-96 dBm

-96 dBm

-99.5 dBm

-94.8 dBm 5.1.4 Reference Design A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A -type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 33: Reference Circuit of RF Antenna Interface NOTE 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. 2. For the operation of ANT_MAIN and ANT_DIV, see AT+QCFG="divctl" in document [3] for details. 3. Place the -type matching components (R1, C1 and C2; R2, C3 and C4) as close to the antenna as possible. EG21-GL_Hardware_Design 65 / 96 ANT_MAINR1 0RC1ModuleMainAntennaNMC2NMR2 0RC3Diversity AntennaNMC4NMANT_DIV LTE Standard Module Series 5.2 GNSS 5.2.1 Antenna Interface & Frequency Bands The module includes a fully integrated global navigation satellite system solution that supports GPS, GLONASS, BDS, Galileo and QZSS. The module supports standard NMEA 0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. The GNSS engine of the module is switched off by default. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, see document [6]. Table 29: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 47 AI GNSS antenna interface 50 impedance. If unused, keep it open. Table 30: GNSS Frequency Type GPS Frequency 1575.42 1.023 (L1) GLONASS 1597.51605.8 Galileo BDS QZSS 1575.42 2.046 1561.098 2.046 1575.42 A reference design of GNSS antenna is shown as below. Unit MHz MHz MHz MHz MHz EG21-GL_Hardware_Design 66 / 96 LTE Standard Module Series Figure 34: Reference Circuit of GNSS Antenna NOTE 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. 3. If the module is designed with a passive antenna, then the VDD circuit is not needed. It is recommended to use a passive GNSS antenna when LTE B13 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 5.2.2 GNSS Performance The following table shows the GNSS performance of the module. Table 31: GNSS Performance Parameter Description Conditions Acquisition Autonomous Sensitivity Reacquisition Autonomous Tracking Autonomous TTFF Cold start

@ open sky Warm start

@ open sky Autonomous XTRA enabled Autonomous XTRA enabled Typ.

-146

-156

-157 35 15 28 3 Unit dBm dBm dBm s s s s EG21-GL_Hardware_Design 67 / 96 GNSS AntennaVDDModuleANT_GNSS10R0RNMNM100 pF0.1 F47 nH LTE Standard Module Series Hot start

@ open sky Accuracy CEP-50 Autonomous XTRA enabled Autonomous

@ open sky 2 1.6 2.5 s s m NOTE 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock. 3. Acquisition sensitivity: the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command. 5.2.3 Reference Design The following layout guidelines should be taken into account in your design. Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna. Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be kept away from the antennas. Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar isolation and protection. Keep 50 characteristic impedance for the ANT_GNSS trace. 5.3 RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. EG21-GL_Hardware_Design 68 / 96 LTE Standard Module Series Figure 35: Microstrip Design on a 2-layer PCB Figure 36: Coplanar Waveguide Design on a 2-layer PCB Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EG21-GL_Hardware_Design 69 / 96 LTE Standard Module Series Figure 38: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be not less than twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [7]. 5.4 Antenna Design Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 32: Antenna Requirements Type GNSS Requirements Frequency range: 15591609 MHz (L1) Polarization: RHCP or linear VSWR: 2 (Typ.) EG21-GL_Hardware_Design 70 / 96 LTE Standard Module Series Passive antenna gain: > 0 dBi Active antenna noise figure: < 1.5 dB Active antenna gain: > 0 dBi Active antenna embedded LNA gain: < 17 dB VSWR: 2 Efficiency: > 30%

Max. input power: 50 W Input impedance: 50 Cable insertion loss:

< 1 dB: LB (<1 GHz)

< 1.5 dB: MB (12.3 GHz)

< 2 dB: HB (> 2.3 GHz) GSM/WCDMA/LTE NOTE It is recommended to use a passive GNSS antenna when LTE B13 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 5.5 RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Figure 39: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. EG21-GL_Hardware_Design 71 / 96 LTE Standard Module Series Figure 40: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. Figure 41: Space Factor of Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com EG21-GL_Hardware_Design 72 / 96 LTE Standard Module Series 6 Electrical Characteristics and Reliability 6.1 Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 33: Absolute Maximum Ratings Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage at Digital Pins Voltage at ADC0 Voltage at ADC1 Min.

-0.3

-0.3

-0.3 0 0 Max. Unit 4.7 5.5 0.8 1.8 2.3 VBAT_BB VBAT_BB V V A A V V V EG21-GL_Hardware_Design 73 / 96 LTE Standard Module Series 6.2 Power Supply Ratings Table 34: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum and maximum values. Voltage drop during burst transmission Maximum power control level on EGSM900. Peak supply current

(during transmission slot) USB connection detection Maximum power control level on EGSM900. VBAT IVBAT USB_VBUS 3.3 3.8 4.3 V

400 mV 1.8 2.0 A 3.0 5.0 5.25 V 6.3 Power Consumption Table 35: EG21-GL Power Consumption Description Conditions Typ. Unit Power-off Power down Sleep State AT+CFUN=0 (USB disconnected) AT+CFUN=0 (USB suspended) AT+CFUN=4 (USB disconnected) AT+CFUN=4 (USB suspended) GSM850 @ DRX = 2 (USB disconnected) GSM850 @ DRX = 5 (USB disconnected) GSM850 @ DRX = 5 (USB suspended) GSM850 @ DRX = 9 (USB disconnected) 7 1.3 1.5 1.3 1.5 2.3 1.8 2.0 1.6 A mA mA mA mA mA mA mA mA EG21-GL_Hardware_Design 74 / 96 DCS1800 @ DRX = 2 (USB disconnected) DCS1800 @ DRX = 5 (USB disconnected) DCS1800 @ DRX = 5 (USB suspended) DCS1800 @ DRX = 9 (USB disconnected) WCDMA @ PF = 64 (USB disconnected) WCDMA @ PF = 64 (USB suspended) WCDMA @ PF = 128 (USB disconnected) WCDMA @ PF = 256 (USB disconnected) WCDMA @ PF = 512 (USB disconnected) LTE-FDD @ PF = 32 (USB disconnected) LTE-FDD @ PF = 64 (USB disconnected) LTE-FDD @ PF = 64 (USB suspended) LTE-FDD @ PF = 128 (USB disconnected) LTE-FDD @ PF = 256 (USB disconnected) LTE-TDD @ PF = 32 (USB disconnected) LTE-TDD @ PF = 64 (USB disconnected) LTE-TDD @ PF = 64 (USB suspended) LTE-TDD @ PF = 128 (USB disconnected) LTE-TDD @ PF = 256 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) EGSM900 @ DRX = 5 (USB connected) WCDMA @ PF = 64 (USB disconnected) WCDMA @ PF = 64 (USB connected) LTE-FDD @ PF = 64 (USB disconnected) LTE-FDD @ PF = 64 (USB connected) LTE Standard Module Series 2.3 1.8 2.0 1.6 2.2 2.4 1.8 1.6 1.5 3.7 2.6 2.8 2.0 1.7 4.0 2.6 2.9 2.0 1.6 15.7 25.3 15.9 25.5 16.4 26.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle State EG21-GL_Hardware_Design 75 / 96 LTE-TDD @ PF = 64 (USB disconnected) LTE-TDD @ PF = 64 (USB connected) EGSM900 4DL/1UL @ 32 dBm EGSM900 3DL/2UL @ 31.09dBm EGSM900 2DL/3UL @ 29.2 dBm EGSM900 1DL/4UL @ 28.1 dBm GSM850 4DL/1UL @ 31.97 dBm GSM850 3DL/2UL @ 30.08 dBm GSM850 2DL/3UL @ 29.08 dBm GSM850 1DL/4UL @ 27.93 dBm DCS1800 4DL/1UL @ 28.69 dBm DCS1800 3DL/2UL @ 28.25 dBm DCS1800 2DL/3UL @ 26.28 dBm DCS1800 1DL/4UL @ 25.51 dBm PCS1900 4DL/1UL @ 29.21 dBm PCS1900 3DL/2UL @ 28.30 dBm PCS1900 2DL/3UL @ 26.86 dBm PCS1900 1DL/4UL @ 25.57 dBm EGSM900 4DL/1UL @ 26.11 dBm EGSM900 3DL/2UL @ 24.93 dBm EGSM900 2DL/3UL @ 23.24 dBm EGSM900 1DL/4UL @ 22.07 dBm GSM850 4DL/1UL @ 25.92 dBm GSM850 3DL/2UL @ 24.79 dBm GSM850 2DL/3UL @ 22.89 dBm GPRS Data Transfer (GNSS OFF) EDGE Data Transfer (GNSS OFF) LTE Standard Module Series 16.4 26.2 260 400 490 580 250 370 470 580 180 280 350 460 170 270 350 440 190 320 450 560 190 320 450 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG21-GL_Hardware_Design 76 / 96 GSM850 1DL/4UL @ 21.71 dBm DCS1800 4DL/1UL @ 25.19 dBm DCS1800 3DL/2UL @ 24.61 dBm DCS1800 2DL/3UL @ 23.48 dBm DCS1800 1DL/4UL @ 22.25 dBm PCS1900 4DL/1UL @ 25.24 dBm PCS1900 3DL/2UL @ 24.76 dBm PCS1900 2DL/3UL @ 23.6 dBm PCS1900 1DL/4UL @ 22.27 dBm WCDMA B1 HSDPA @ 22.6 dBm WCDMA B1 HSUPA @ 22.4 dBm WCDMA B2 HSDPA @ 22.73 dBm WCDMA B2 HSUPA @ 22.89 dBm WCDMA B4 HSDPA @ 22.72 dBm WCDMA B4 HSUPA @ 22.24 dBm WCDMA B5 HSDPA @ 22.48 dBm WCDMA B5 HSUPA @ 22 dBm WCDMA B6 HSDPA @ 22.38 dBm WCDMA B6 HSUPA @ 21.95 dBm WCDMA B8 HSDPA @ 22.45 dBm WCDMA B8 HSUPA @ 22 dBm WCDMA B19 HSDPA @ 22.4 dBm WCDMA B19 HSUPA @ 21.93 dBm WCDMA Data Transfer (GNSS OFF) LTE Data Transfer (GNSS OFF) LTE-FDD B1 @ 23.4 dBm LTE-FDD B2 @ 23.57 dBm LTE Standard Module Series 560 160 270 380 480 160 270 380 480 600 580 700 690 630 610 750 740 760 720 745 730 740 710 770 850 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG21-GL_Hardware_Design 77 / 96 LTE-FDD B3 @ 23.52 dBm LTE-FDD B4 @ 23.42 dBm LTE-FDD B5 @ 23.27 dBm LTE-FDD B7 @ 23.3 dBm LTE-FDD B8 @ 23.14 dBm LTE-FDD B12 @ 23.33 dBm LTE-FDD B13 @ 23.2 dBm LTE-FDD B18 @ 23.2 dBm LTE-FDD B19 @ 23.02 dBm LTE-FDD B20 @ 23.16 dBm LTE-FDD B25 @ 23.26 dBm LTE-FDD B26 @ 23.06 dBm LTE-FDD B28 @ 23.55 dBm LTE-TDD B34 @ 22.75 dBm LTE-TDD B38 @ 22.86 dBm LTE-TDD B39 @ 22.82 dBm LTE-TDD B40 @ 22.94 dBm LTE-TDD B41 @ 22.90 dBm LTE-FDD B66 @ 23.40 dBm GSM Voice Call EGSM900 PCL = 5 @ 32.22 dBm EGSM900 PCL = 12 @ 19.71 dBm EGSM900 PCL = 19 @ 3.09 dBm GSM850 PCL = 5 @ 32.05 dBm GSM850 PCL = 12 @ 19.33 dBm GSM850 PCL = 19 @ 2.92 dBm LTE Standard Module Series 760 785 840 1050 950 830 760 930 910 910 820 920 860 380 450 360 400 490 780 270 140 90 250 150 90 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG21-GL_Hardware_Design 78 / 96 DCS1800 PCL = 0 @ 28.91 dBm DCS1800 PCL = 7 @ 15.83 dBm DCS1800 PCL = 15 @ -2.91 dBm PCS1900 PCL = 0 @ 29.31 dBm PCS1900 PCL = 7 @ 15.81 dBm PCS1900 PCL = 15 @ -2.75 dBm WCDMA B1 @ 23.65 dBm WCDMA B2 @ 23.96 dBm WCDMA B4 @ 23.77 dBm WCDMA B5 @ 23.51 dBm WCDMA B6 @ 23.5 dBm WCDMA B8 @ 23.6 dBm WCDMA B19 @ 23.39 dBm WCDMA Voice Call LTE Standard Module Series 180 140 80 170 140 78 670 750 700 830 800 690 770 mA mA mA mA mA mA mA mA mA mA mA mA mA 6.4 ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 36: Electrostatic Discharge Characteristics (25 C, 45 % Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND All Antenna Interfaces Other Interfaces 10 10 0.5 16 16 1 kV kV kV EG21-GL_Hardware_Design 79 / 96 LTE Standard Module Series 6.5 Operating and Storage Temperatures The operating and storage temperatures are listed in the following table. Table 37: Operating and Storage Temperatures Parameter Min. Operating Temperature Range 7

-35 Extended Temperature Range 8

-40 Storage Temperature Range

-40 Typ.

+25

Max. Unit

+75

+85

+90 C C C 7 Within operation temperature range, the module is 3GPP compliant. 8 Within the extended temperature range, the module remains the ability to establish and maintain functions such as voice, SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. EG21-GL_Hardware_Design 80 / 96 LTE Standard Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the dimensional tolerances are 0.2 mm unless otherwise specified. 7.1 Mechanical Dimensions Figure 42: Module Top and Side Dimensions EG21-GL_Hardware_Design 81 / 96 LTE Standard Module Series Figure 43: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. EG21-GL_Hardware_Design 82 / 96 7.2 Recommended Footprint LTE Standard Module Series Figure 44: Recommended Footprint (Top View) NOTE 1. The keepout area should not be designed. 2. Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. EG21-GL_Hardware_Design 83 / 96 LTE Standard Module Series 7.3 Recommended Compatible Footprint Figure 45: Recommended Compatible Footprint (Top View) NOTES 1. The keepout area should not be designed. 2. For easy maintenance of the module, please keep about 3 mm between the module and other components in the host PCB. 3. LGA form factor is used for EG21-GL module, while LCC is recommended only in the compatible design with EC25 series/EC21 series/EC20-CE/EG21-G/EG25-G/EC200A series modules. If you EG21-GL_Hardware_Design 84 / 96 use LCC form factor, you should choose the stencil matched with LGA package instead of that matched with LCC package. For more details, see document [8]. LTE Standard Module Series 7.4 Top and Bottom Views Figure 46: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EG21-GL_Hardware_Design 85 / 96 LTE Standard Module Series 8 Storage, Manufacturing and Packaging 8.1 Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 9 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 9 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. EG21-GL_Hardware_Design 86 / 96 LTE Standard Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 8.2 Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.130.15 mm. For more details, see document [8]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 47: Recommended Reflow Soldering Thermal Profile EG21-GL_Hardware_Design 87 / 96 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Ramp-to-soak slope: 03 C/s Cool-down slope: -30 C/s Ramp-up slope: 03 C/s LTE Standard Module Series Table 38: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak slope 03 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Ramp-up slope Reflow time (D: over 217C) Max temperature Cool-down slope Reflow Cycle Max reflow cycle NOTE 03 C/s 4070 s 235246 C

-30 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both 2. the hottest and coldest spots of solder joints on the PCB should meet the above requirements. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 3. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 4. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [8]. 8.3 Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

EG21-GL_Hardware_Design 88 / 96 LTE Standard Module Series 8.3.1 Carrier Tape Dimension details are as follow:

Figure 48: Carrier Tape Dimension Drawing Table 39: Carrier Tape Dimension Table (Unit: mm) W 44 P 44 T A0 B0 0.35 32.5 29.5 K0 3.0 K1 3.8 F E 20.2 1.75 8.3.2 Plastic Reel Figure 49: Plastic Reel Dimension Drawing EG21-GL_Hardware_Design 89 / 96 LTE Standard Module Series Table 40: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 44.5 8.3.3 Packaging Process Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the vacuum-packed plastic reel into the pizza box. EG21-GL_Hardware_Design 90 / 96 LTE Standard Module Series Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 1000 modules. Figure 50: Packaging Process EG21-GL_Hardware_Design 91 / 96 LTE Standard Module Series 9. Appendix References Table 41: Related Documents Document Name

[1] Quectel_UMTS&LTE_EVB_User_Guide

[2] Quectel_EC2x&EG2x-G(L)&EG9x&EM05_Series_AT_Commands_Manual

[3] Quectel_EC2x&EG2x-G(L)&EG9x&EM05_Series_QCFG_AT_Commands_Manual

[4] Quectel_EC2x&EG9x&EG2x-G(L)_Series_Power_Management_Application_Note

[5] Quectel_EG21-GL_Reference_Design

[6] Quectel_EC2x&EG2x-G(L)&EG9x&EM05_Series_GNSS_Application_Note

[7] Quectel_RF_Layout_Application_Note

[8] Quectel_Module_SMT_Application_Note Table 42: Terms and Abbreviations Abbreviation Description AMR Adaptive Multi-rate AMR-WB Adaptive Multi-Rate Wideband bps CHAP CS CTS Bits Per Second Challenge Handshake Authentication Protocol Coding Scheme Clear To Send DC-HSPA+

Dual-carrier High Speed Packet Access DCS Digital Cellular System EG21-GL_Hardware_Design 92 / 96 LTE Standard Module Series DDR DFOTA DL DTR DTX EDGE EFR EGSM ESD EVB FDD FR FTP Double Data Rate Delta Firmware Upgrade Over The Air Downlink Data Terminal Ready Discontinuous Transmission Enhanced Data Rates for GSM Evolution Enhanced Full Rate Enhanced GSM Electrostatic Discharge Evaluation Board Frequency Division Duplex Full Rate File Transfer Protocol FTPS FTP over SSL GLONASS Global Navigation Satellite System (Russia) GMSK GNSS GPS GSM HR HSPA HSDPA HSUPA HTTP HTTPS Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Downlink Packet Access High Speed Uplink Packet Access Hypertext Transfer Protocol Hypertext Transfer Protocol Secure EG21-GL_Hardware_Design 93 / 96 LTE Standard Module Series I/O LED LGA LNA LTE M2M MCS ME MIMO MMS MO MQTT MS MSL MT NITZ Input/Output Light Emitting Diode Land Grid Array Low Noise Amplifier Long Term Evolution Machine to Machine Modulation and Coding Scheme Mobile Equipment Multiple Input Multiple Output Multimedia Messaging Service Mobile Originated Message Queuing Telemetry Transport Mobile Station (GSM engine) Moisture Sensitivity Level Mobile Terminated Network Identity and Time Zone NMEA NMEA (National Marine Electronics Association) 0183 Interface Standard NTP PAP PCB PCM PDA PDU PING POS Network Time Protocol Password Authentication Protocol Printed Circuit Board Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Packet Internet Groper Point of Sale EG21-GL_Hardware_Design 94 / 96 LTE Standard Module Series PPP QAM QPSK QZSS RF RHCP RTS Rx SDR SGMII SIMO SMD SMS SMTP Point-to-Point Protocol Quadrature Amplitude Modulation Quadrature Phase Shift Keying Quasi-Zenith Satellite System Radio Frequency Right Hand Circularly Polarized Ready To Send Receive Software-Defined Radio Serial Gigabit Media Independent Interface Single Input Multiple Output Surface Mount Device Short Message Service Simple Mail Transfer Protocol SMTPS Simple Mail Transfer Protocol Secure SSL TCP TDD TVS TX UDP UL UMTS URC

(U)SIM Secure Sockets Layer Transmission Control Protocol Time Division Duplexing Transient Voltage Suppressor Transmitting Direction User Datagram Protocol Uplink Universal Mobile Telecommunications System Unsolicited Result Code

(Universal) Subscriber Identity Module EG21-GL_Hardware_Design 95 / 96 LTE Standard Module Series VLAN Vmax Vnom Vmin VIHmax VIHmin VILmax VILmin VOHmax VOHmin VOLmax VOLmin VSWR Virtual Local Area Network Maximum Voltage Normal Voltage Minimum Voltage Maximum High-level Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Minimum Low-level Input Voltage Maximum High-level Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Minimum Low-level Output Voltage Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network EG21-GL_Hardware_Design 96 / 96 OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: XMR202212EG25GL Contains IC: 10224A-2022EG25GL. The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met. Antenna

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed Technology Frequency Range (MHz) Antenna Type Max Peak Gain (dBi) GSM 850 PCS 1900 WCDMA Band II WCDMA Band IV 824 ~ 849 1850 ~ 1910 1850 ~ 1910 1710 ~ 1755 WCDMA Band V 824 ~ 849 LTE Band 2 LTE Band 4 LTE Band 5 LTE Band 7 LTE Band 12 LTE Band 13 LTE Band 25 LTE Band 26 LTE Band 38 LTE Band 41 LTE Band 66 1850 ~ 1910 1710 ~ 1755 824 ~ 849 2500 ~ 2570 699 ~ 716 777 ~ 787 1850 ~ 1915 814 ~ 849 2570 ~ 2620 2496 ~ 2690 1710 ~ 1780 Dipole 6.3 11.9 9.9 9.9 7.3 9.9 9.9 7.3 9.9 6.5 7.0 9.9 7.2 9.9 9.9 9.9 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. List of applicable FCC rules This module has been tested and found to comply with part 22, part 24, part 27, part 90 requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-

radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator &

your body. Industry Canada Statement This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions:

(1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement."

Radiation Exposure Statement This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body Dclaration d'exposition aux radiations:

Cet quipement est conforme aux limites d'exposition aux rayonnements ISED tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit tre installe de telle sorte qu'une distance de 20 cm est respecte entre l'antenne et les utilisateurs, et 2) Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:

In the event that these conditions cannot be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains IC: 10224A-2022EG25GL. Plaque signaltique du produit final Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l'antenne peut tre installe de telle sorte qu'une distance de 20cm peut tre maintenue entre l'antenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: "Contient des IC: 10224A-2022EG25GL". Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel.

aegiee Fee

=G21 GL Q1-C0574 GA EG21GLGA-128-SGNS CE cS FCC: ID: XMR202212EG21GL IC: 10224A-2022EG21GL SN:MPA7301 730XXXXX

QIECCTEL Federal Communications Commission 7435 Oakland Mills Road Columbia MD 21046 Subject: Certification designating a U.S. agent for service of process pursuant to Part 2.911(d)(7) To whom it may concern, Quectel Wireless Solutions Company Limited, Grantee Code: XMR (the applicant) certifies that, as of the date of the filing of application, Ikotek USA, Inc., FRN: 0033350331 (the agent) is designated as the U.S. agent for the purpose of accepting service of process on behalf of the applicant. The physical U.S. address and email for the designated agent are:

Physical U.S. address: 9920 Pacific Heights Blvd., Ste. 150, #7025, San Diego, CA 92121 Email: compliance@ikotek.com The applicant accepts to maintain an agent for service of process in the United States for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. The agent accepts the designation by (the applicant) as the U.S. agent to accept service of process includes, but is not limited to, delivery of any correspondence, notices, orders, decisions, and requirements of administrative, legal, or judicial process related to Commission proceedings. Signed by the Applicant Signed by the Agent (if different from the Applicant) Name: Jean Hu C Name-dseph M. Peterson Title: Certification Manager Title: President and CEO Email: Jean.hu@quectel.com Email: joe.peterson@ikotek.com Date: 16 February 2023 Date: February 17%, 2023

Quectel Wireless Solutions Co., Ltd Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: 2023-02-28 Ref: Attestation Statements Part 2.911(d)(5)(i) Filing FCC ID: XMR202212EG21GL Quectel Wireless Solutions Co., Ltd (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Sincere) ee a Rev 1/26/2023 Hu Quectel Wireless Solutions Co., Ltd Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: 2023-02-28 Ref: Attestation Statements Part 2.911(d)(5)(ii) Filing FCC ID: XMR202212EG21GL Quectel Wireless Solutions Co., Ltd (the applicant) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing covered equipment. Sincere) ee a Rev 1/26/2023 Hu

Quectel Wireless Solutions Company Limited Confidentiality Request Letter Federal Communications Commission Authorization and Evaluation Division FCC ID: XMR202212EG21GL Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:

Block Diagram Schematics Operational Description Tune-up procedure BOM List woe & NP The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Rule 0.457, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely, a: CAL er. Name: Jean Email: Certification@Quectel.com Date: 2023-02-25 Hu

Quectel Wireless Solutions Company Limited Declaration of Conformity Federal Communications Commission Authorization and Evaluation Division FCC ID: XMR202212EG21GL Please be notified that we, the undersigned, Quectel Wireless Solutions Company Limited declares that the product which bears the above FCC ID is also compliant with the FCC requirements for sDOC. And the sDOC procedure shall be carried out prior to marketing the device in the US. Sincerely, Name:Jean Email: Certification@Quectel.com Date: 2023-02-25 Hu

Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Request for Modular/Limited Modular Approval Date: 2023.02.25 Subject: Manufacturers Declaration for - Modular Approval - Split Modular Approval

- Limited Modular Approval - Limited Split Modular Approval Confidentiality Request for: XMR202212EG21GL 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement Requirement Met 1. The modular transmitter must have Gn RESRSEE This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits - YES - NOC) in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i) Details: <example The module contains a metal shield which covers all RF components and circuitry. The shield is located on the top of the board next to antenna connector>

2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of - YES - NOC) excessive data rates or over-modulation. 15.212(a)(1) (ii) Details: <example Data to the modulation circuit is buffered as described in the operational description provided with the application>

3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1) (iii)

-YES - NOC) Details: <example The module contains its own power supply regulation. Please refer to schematic filed with this application>

4, The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv)

-YES - NOC) Details: <example The module connects to its antenna using an UFL connector which is considered a non-

standard connector. A list of antennas tested and approved with this device may be found in users manual provided with the application>

5. The modular transmitter must be tested in a stand-alone configuration, ie., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be - YES - NO) marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v) Details: <example The module was tested stand-alone as shown in test setup photographs filed with this application>

Modular Approval Requirement Requirement Met 6. The modular transmitter must be EbSed ain oan FEC 1D AT or use an electron display (see KDB Publication 784748). If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID:

XWMIR202919EGD4GL" or "Contains FCC ID: XMR202212EG21GL Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment - YES - NO(*) authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 5.212(a)(1) (vi) Details: <example There is a label on the module as shown in the labeling exhibit filed with this application. Host specific labeling instructions are shown in the installation manual .filed with this application.>

. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration iaehichore Sy INelaraTieS A copy of these instructions must be included in the application or equipment authorization. For example, there are very strict operational and timing equirements that must be met before a transmitter is authorized for operation under Section 5.231. For instance, data transmission is prohibited, except for operation under Section 5.231 (e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii) Details: <example The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application.>

. The modular transmitter example, FCC Rules in Sections 2. 1091, 2. 1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15. 255(9), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1) (viii) Details: < The module meets RF exposure in mobile configuration.>

070920-02b Limited Module Description - When Applicable

* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval

(LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA; the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: <example - N/A>

Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied Requirement Requirement Met 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided - Provided in about how such control is implemented to ensure prevention of third-party Separate Cover Letter modification; see KDB Publication 594280. Details: <example The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. >

2. For Software Defined Radio (SDR) devices, transmitter module applications - Provided in must provide a software security description; see KDB Publication 442812. Separate Cover Letter - NA Details: <example N/A>

Split Modular Requirements Requirement Provided in Manual 1. For split modular transmitters, specific descriptions for secure communications between front-end and control sections, including authentication and - Provided in NA restrictions on third-party modifications; also, instructions to third-party Separate Cover Letter . integrators on how control is maintained. Details: <example N/A >

070920-02b OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement

- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to ES TRI PHSUUIS TAISRES tr be basic integration instructions for a users manual and the sale to third parties? information below must still be included in the operational description. If the applicant wishes to keep this info confidential this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 DO3, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 DO3, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 DO3, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to point systems, professional installation info

. Limited Module Procedures. KDB 996369 DO3, Section 2.4 a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class || for new hosts, etc. Integration Guide (or

. Trace antenna designs. KDB 996369 DO3, Section 2.5 UM) for Full Modular a. Layout of trace design, parts list, antenna, connectors, isolation requirements, Approval (MA) 0 tests for design verification, and production test procedures for ensuring LMA compliance. If confidential, the method used to keep confidential must be :

identified and information provided in the operational description. RF exposure considerations. KDB 996369 D03, Section 2.6 - An LMA applies a. Clearly and explicitly state conditions that allow host manufacturers to use the and is approved module. Two types of instructions are necessary: first to the host manufacturer ONLY for use by the to define conditions (mobile, portable xx cm from body) and second additional grantee in their own text needed to be provided to the end user in the host product manuals. __ produets, and not

. Antennas. KDB 996369 D03, Section 2.7 intended for sale to <

a. List of antennas included in the application and all applicable professional parties as provided in installer instructions when applicable. The antenna list shall also identify the a separate cover antenna types (monopole, PIFA, dipole, etc note that omni-directional is not letter. Therefore the considered a type information shown to DO3, Section 2.8 the left is found in the

- All Items shown to the left are provided in the Modular

. Label and compliance information. KDB 996369 d a. Advice to host integrators that they need to provide a physical or e-label stating theory of operation. Contains FCC ID: with their finished product

. Information on test modes and additional testing requirements. KDB 996369 DO3, Section 2.9 a. Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. b. Provide information on how to configure test modes for evaluation

. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 DO3, Section 2.10 Email: Certification@ Quectel.com Date: 2023-02-25 070920-02b Hu

Quectel Wireless Solutions Company Limited Declaration of Authorization We Name: Quectel Wireless Solutions Company Limited Address: Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Declare that:

Name Representative of agent: Marlin Chen Agent Company name: MRT Technology (Suzhou) Co., Ltd Address: D8 Building, Youxin Industrial Park, No.2 Tian'edang Rd., Wuzhong Economic Development Zone City: Suzhou Country: China is authorized to apply for Certification of the following product(s):

Product: LTE CAT1 Module FCC ID: XMR202212EG21GL Model No.: EG21-GL, EG21-GL MINIPCIE Sincerely, Reine: Jean Email: Certification@Quectel.com Date: 2023-02-25 Hu

Quectel Wireless Solutions Co., Ltd Statement We Quectel Wireless Solutions Co., Ltd declare the following models. Product Name: LTE Module Model Number: EG25-GL, EG21-GL Hardware Version: R1.0 EG25-GL (FCC ID: XMR202212EG25GL, IC: 10224A-2022EG25GL) and EG21-GL (FCC ID:

XMR202212EG21GL, IC: 10224A-2022EG21GL) share the same software and hardware design. The difference is as below:

1. EG25-GL and EG21-GL support the same bands, EG25-GL support Cat4, EG21-GL support Cat1. LTE-FDD: B1/ B2/ B3/ B4/ B5/ B7/ B8/ B12/B13/ B18/

B19/ B20/ B25/ B26/ B28/B66 LTE-TDD: B34/B38/ B39/ B40/ B41 WCDMA: B1/ B2/ B4/ B5/ B6/ B8/ B19 EG25-GL EG25-GL MINIPCIE GSM: 850/900/1800/1900 LTE-FDD: B1/ B2/ B3/ B4/ B5/ B7/ B8/ B12/B13/ B18/

B19/ B20/ B25/ B26/ B28/B66 LTE-TDD: B34/B38/ B39/ B40/ B41 WCDMA: B1/ B2/ B4/ B5/ B6/ B8/ B19 GSM: 850/900/1800/1900 EG21-GL EG25-GL MINIPCIE 2. The only difference between EG21-GL and EG25-GL is the type of BB chip Designator EG25-GL EG21-GL

(Part Description) (Part Description) IC BB MDM9207-0 328-PSP 0.35pitch IC BB MDM9207-1 328-PSP 0.35pitch 6.9x7.8mm H0.82mm RO 6.9x7.8mm H0.82mm RO U0101 Quectel Wireless Solutions Co., Ltd Above changes wont impact the protocol and RF performance for original frequency bands. Your assistance on this matter is highly appreciated. So, we have performed spot checks on the following items to verify that if any unexpected RF conducted power or emission changes can be noted. The test results show that all spot check data are within the instrument measurement uncertainty and data reuse is justifiable. Verification test items with 1 sample:

@ Occupied Bandwidth

@ QPSK Conducted Power

@ Radiated Spurious Emission

@ Conducted Band Edge please refers to included exhibit Test Reports.pdf for detail. Reuse data test items

@ Conducted Power / EIRP/ ERP / PAPR / Frequency stability

@ Conducted Emission Sincerely, 4. ,~ cr. Name: Jean Hu Title? Certification Section