FCC ID: XMR201903EG25G LTE Module

EG25-G Mini PCIe Hardware Design LTE Module Series Rev. EG25-G_Mini_PCIe_Hardware_Design_V1.0 Date: 2019-01-03 Status: Released www.quectel.com LTE Module Series EG25-G Mini PCIe Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

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http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. EG25-G_Mini_PCIe_Hardware_Design 1 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design About the Document History Revision Date Author Description 1.0 2019-01-03 Lorry XU/

Ethan SHAN Initial EG25-G_Mini_PCIe_Hardware_Design 2 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Table Index ................................................................................................................................................... 5 Figure Index ................................................................................................................................................. 6 1 Introduction .......................................................................................................................................... 7 1.1. Safety Information...................................................................................................................... 8 2 Product Concept .................................................................................................................................. 9 2.1. General Description ................................................................................................................... 9 2.2. Description of Product Series .................................................................................................. 10 2.3. Key Features ........................................................................................................................... 10 Functional Diagram ................................................................................................................. 13 2.4. 3 Application Interfaces ....................................................................................................................... 14 Pin Assignment ........................................................................................................................ 14 3.1. Pin Description ......................................................................................................................... 15 3.2. Power Supply ........................................................................................................................... 18 3.3. 3.4.

(U)SIM Interface ...................................................................................................................... 19 3.5. USB Interface .......................................................................................................................... 21 3.6. UART Interface ........................................................................................................................ 22 3.7. PCM and I2C Interfaces .......................................................................................................... 23 3.8. Control and Indicator Signals .................................................................................................. 25 3.8.1. RI Signal ......................................................................................................................... 26 3.8.2. DTR Signal ..................................................................................................................... 26 3.8.3. W_DISABLE# Signal ...................................................................................................... 26 3.8.4. PERST# Signal .............................................................................................................. 27 3.8.5. LED_WWAN# Signal ..................................................................................................... 27 3.8.6. WAKE# Signal ................................................................................................................ 28 Antenna Interfaces .................................................................................................................. 29 3.9.1. Antenna Requirements .................................................................................................. 29 3.9.2. Recommended RF Connector for Antenna Installation ................................................. 30 3.9. 4 Electrical, Reliability and Radio Characteristics ............................................................................ 32 4.1. General Description ................................................................................................................. 32 Power Supply Requirements ................................................................................................... 32 4.2. 4.3. I/O Requirements ..................................................................................................................... 33 4.4. RF Characteristics ................................................................................................................... 33 4.5. GNSS Receiver ....................................................................................................................... 35 ESD Characteristics ................................................................................................................ 36 4.6. 4.7. Thermal Consideration ............................................................................................................ 36 4.8. Current Consumption .............................................................................................................. 37 5 Dimensions and Packaging .............................................................................................................. 43 EG25-G_Mini_PCIe_Hardware_Design 3 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design 5.1. General Description ................................................................................................................. 43 5.2. Mechanical Dimensions of EG25-G Mini PCIe ....................................................................... 43 Standard Dimensions of Mini PCI Express ............................................................................. 44 5.3. 5.4. Packaging ................................................................................................................................ 45 6 Appendix References ........................................................................................................................ 46 EG25-G_Mini_PCIe_Hardware_Design 4 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design Table Index TABLE 1: DESCRIPTION OF EG25-G MINI PCIE............................................................................................ 10 TABLE 2: KEY FEATURES OF EG25-G MINI PCIE ......................................................................................... 10 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 15 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 15 TABLE 5: DEFINITION OF VCC_3V3 AND GND PINS .................................................................................... 18 TABLE 6: PIN DEFINITION OF (U)SIM INTERFACE ....................................................................................... 19 TABLE 7: PIN DEFINITION OF USB INTERFACE ........................................................................................... 21 TABLE 8: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................... 22 TABLE 9: PIN DEFINITION OF PCM AND I2C INTERFACES ......................................................................... 23 TABLE 10: PIN DEFINITION OF CONTROL AND INDICATOR SIGNALS ....................................................... 25 TABLE 11: RF FUNCTION STATUS .................................................................................................................. 26 TABLE 12: INDICATIONS OF NETWORK STATUS (AT+QCFG=LEDMODE,0, DEFAULT SETTING) ......... 28 TABLE 13: INDICATIONS OF NETWORK STATUS (AT+QCFG=LEDMODE,2) ........................................... 28 TABLE 14: ANTENNA REQUIREMENTS .......................................................................................................... 29 TABLE 15: POWER SUPPLY REQUIREMENTS .............................................................................................. 32 TABLE 16: I/O REQUIREMENTS ...................................................................................................................... 33 TABLE 17: EG25-G MINI PCIE CONDUCTED RF OUTPUT POWER ............................................................. 33 TABLE 18: EG25-G MINI PCIE CONDUCTED RF RECEIVING SENSITIVITY ............................................... 34 TABLE 19: ESD CHARACTERISTICS OF EG25-G MINI PCIE ........................................................................ 36 TABLE 20: CURRENT CONSUMPTION OF EG25-G MINI PCIE .................................................................... 37 TABLE 21: GNSS CURRENT CONSUMPTION OF EG25-G MINI PCIE ......................................................... 42 TABLE 22: RELATED DOCUMENTS ................................................................................................................ 46 TABLE 23: TERMS AND ABBREVIATIONS ...................................................................................................... 46 EG25-G_Mini_PCIe_Hardware_Design 5 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 13 FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 14 FIGURE 3: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 18 FIGURE 4: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR 19 FIGURE 5: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR ... 20 FIGURE 6: REFERENCE CIRCUIT OF USB INTERFACE .............................................................................. 21 FIGURE 7: TIMING IN PRIMARY MODE .......................................................................................................... 24 FIGURE 8: TIMING IN AUXILIARY MODE........................................................................................................ 24 FIGURE 9: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ...................................... 25 FIGURE 10: RI BEHAVIOR ............................................................................................................................... 26 FIGURE 11: TIMING OF RESETTING MODULE .............................................................................................. 27 FIGURE 12: LED_WWAN# SIGNAL REFERENCE CIRCUIT DIAGRAM ........................................................ 27 FIGURE 13: WAKE# BEHAVIOR ...................................................................................................................... 28 FIGURE 14: DIMENSIONS OF THE RF CONNECTORS (UNIT: MM) ............................................................. 30 FIGURE 15: MECHANICALS OF U.FL-LP MATING PLUGS ........................................................................... 30 FIGURE 16: SPACE FACTOR OF MATING PLUGS (UNIT: MM) ..................................................................... 31 FIGURE 17: REFERENCED HEATSINK DESIGN ........................................................................................... 37 FIGURE 18: MECHANICAL DIMENSIONS OF EG25-G MINI PCIE ................................................................ 43 FIGURE 19: STANDARD DIMENSIONS OF MINI PCI EXPRESS ................................................................... 44 FIGURE 20: DIMENSIONS OF THE MINI PCI EXPRESS CONNECTOR (MOLEX 679100002) .................... 45 EG25-G_Mini_PCIe_Hardware_Design 6 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design 1 Introduction This document defines EG25-G Mini PCIe module, and describes its air interfaces and hardware interfaces which are connected with customers applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details as well as other related information of EG25-G Mini PCIe module. To facilitate its application in different fields, relevant reference design is also provided for customers reference. Associated with application note and user guide, customers can use the module to design and set up mobile applications easily. EG25-G_Mini_PCIe_Hardware_Design 7 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EG25-G Mini PCIe module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. EG25-G_Mini_PCIe_Hardware_Design 8 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design 2 Product Concept 2.1. General Description EG25-G Mini PCIe module provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks with PCI Express Mini Card 1.2 standard interface. It supports embedded operating systems such as WinCE, Linux, Android, etc., and also provides audio, high-speed data transmission and GNSS functionalities for customers applications. EG25-G Mini PCIe module can be applied in the following fields:

PDA and Laptop Computer Remote Monitor System Vehicle System Wireless POS System Intelligent Meter Reading System Wireless Router and Switch Other Wireless Terminal Devices This chapter generally introduces the following aspects of EG25-G Mini PCIe module:

Product Series Key Features Functional Diagram NOTE EG25-G Mini PCIe contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. EG25-G_Mini_PCIe_Hardware_Design 9 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design 2.2. Module Description The following table shows the description of EG25-G Mini PCIe module. Table 1: Description of EG25-G Mini PCIe Module Description Support LTE-FDD:

B1/B2/B3/B4/B5/B7/B8/B12/B13/B18/B19/B20/B25/B26/B28 Support LTE-TDD: B38/B39/B40/B41 EG25-G Mini PCIe Support WCDMA: B1/B2/B4/B5/B6/B8/B19 Support GSM: 850/900/1800/1900MHz Support GPS, GLONASS, BeiDou/Compass, Galileo, QZSS 1) Support digital audio 2) NOTES SS 1) GNSS function is optional. 2) Digital audio (PCM) function is only supported on Telematics version. 1. 2. 2.3. Key Features The following table describes the detailed features of EG25-G Mini PCIe module. Table 2: Key Features of EG25-G Mini PCIe Feature Details Function Interface PCI Express Mini Card 1.2 Standard Interface Power Supply Supply voltage: 3.0V~3.6V Typical supply voltage: 3.3V Class 4 (33dBm2dB) for GSM850 Class 4 (33dBm2dB) for EGSM900 Class 1 (30dBm2dB) for DCS1800 Transmitting Power Class 1 (30dBm2dB) for PCS1900 Class E2 (27dBm3dB) for GSM850 8-PSK Class E2 (27dBm3dB) for EGSM900 8-PSK Class E2 (26dBm3dB) for DCS1800 8-PSK EG25-G_Mini_PCIe_Hardware_Design 10 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design Class E2 (26dBm3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm2dB) for LTE FDD bands Class 3 (23dBm2dB) for LTE TDD bands Support up to non-CA Cat 4 FDD and TDD Support 1.4MHz~20MHz RF bandwidth LTE Features Support MIMO in DL direction LTE-FDD: Max 150Mbps (DL), Max 50Mbps (UL) LTE-TDD: Max 130Mbps (DL), Max 30Mbps (UL) Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK,16-QAM and 64-QAM modulation UMTS Features DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL), Max 384Kbps (UL) GPRS:

Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL), Max 85.6Kbps (UL) EDGE:

GSM Features Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL), Max 236.8Kbps (UL) Support Internet Protocol Features TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/NITZ/SMTP/CMUX*/HTTPS*/

/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for SMS PPP connections Text and PDU mode Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default

(U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V UART Interface Baud rate can reach up to 230400bps, 115200bps by default Support RTS and CTS hardware flow control Used for AT command communication and data transmission Support one digital audio interface: PCM interface Audio Features GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB EG25-G_Mini_PCIe_Hardware_Design 11 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design Support echo cancellation and noise suppression Used for audio function with external codec Support 16-bit linear data format PCM Interface Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame USB Interface synchronization Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB*

Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE 5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x/8.x, etc. Antenna Interfaces Including main antenna, diversity antenna and GNSS antenna Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Physical Characteristics Temperature Range Gen8C Lite of Qualcomm Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Size: (51.00.15)mm (30.00.15)mm (4.90.2)mm Weight: approx. 9.8g Operation temperature range: -35C ~ +75C 1) Extended temperature range: -40C ~ +80C 2) Storage temperature range: -40C ~ +90C Firmware Upgrade Upgrade via USB interface or DFOTA*

RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again. 3.

* means under development. EG25-G_Mini_PCIe_Hardware_Design 12 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design 2.4. Functional Diagram The following figure shows the block diagram of EG25-G Mini PCIe. Figure 1: Functional Diagram EG25-G_Mini_PCIe_Hardware_Design 13 / 48 EG25-G ModulePCM&I2CMini PCI Express InterfaceUSBW_DISABLE#PERST#LED_WWAN#Main Antenna InterfaceVCCMain Antenna VBATGNSSAntennaInterfaceGNSSAntennaBoostCircuitDiversityAntennaInterfaceDiversityAntennaWAKE#UARTDTRRI(U)SIM LTE Module Series EG25-G Mini PCIe Hardware Design 3 Application Interfaces The physical connections and signal levels of EG25-G Mini PCIe comply with PCI Express Mini CEM specifications. This chapter mainly describes the definition and application of the following interfaces for EG25-G Mini PCIe:

Power supply

(U)SIM interface USB interface UART interface PCM&I2C interfaces Control and Indicator signals Antenna interfaces 3.1. Pin Assignment The following figure shows the pin assignment of EG25-G Mini PCIe module. The top side contains EG25-G module and antenna connectors. Figure 2: Pin Assignment EG25-G_Mini_PCIe_Hardware_Design 14 / 48 PIN2PIN52BOTPIN1PIN51TOPPin NamePin No.WAKE#13579111315171921232527293133353739414345474951RESERVEDRESERVEDRESERVEDGNDUART_RXUART_TXGNDRIRESERVEDGNDUART_CTSUART_RTSGNDGNDDTRRESERVEDGNDGNDVCC_3V3VCC_3V3GNDPCM_CLKPCM_DOUTPCM_DIPCM_SYNCPin NamePin No.246810121416182022242628303234363840424446485052VCC_3V3GNDNCUSIM_VDDUSIM_DATAUSIM_CLKUSIM_RSTRESERVEDGNDW_DISABLE#PERST#RESERVEDGNDNCI2C_SCLI2C_SDAGNDUSB_DMUSB_DPGNDLED_WWAN#USIM_PRESENCERESERVEDNCGNDVCC_3V3 LTE Module Series EG25-G Mini PCIe Hardware Design 3.2. Pin Description The following tables show the pin definition and description of EG25-G Mini PCIe on the 52-pin application. Table 3: I/O Parameters Definition Type DI DO IO OC PI PO Description Digital Input Digital Output Bidirectional Open Collector Power Input Power Output Table 4: Pin Description Pin No. Mini PCI Express EG25-G Mini PCIe Standard Name Pin Name I/O Description Comment 1 2 3 4 5 6 7 8 9 10 11 WAKE#

WAKE#

OC Output signal to wake up the host. 3.3Vaux VCC_3V3 PI 3.3V DC supply RESERVED RESERVED GND GND RESERVED RESERVED 1.5V NC CLKREQ#

RESERVED Reserved Mini card ground Reserved Not connected Reserved UIM_PWR USIM_VDD PO Power source for the

(U)SIM card GND GND Mini card ground UIM_DATA USIM_DATA IO Data signal of (U)SIM card REFCLK-

UART_RX DI UART receive data Connect to EG25-G_Mini_PCIe_Hardware_Design 15 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design UIM_CLK USIM_CLK DO Clock signal of (U)SIM card REFCLK+

UART_TX DO UART transmit data Connect to DTEs RX. DTEs TX. UIM_RESET USIM_RST DO Reset signal of (U)SIM card GND GND UIM_VPP RESERVED Mini card ground Reserved RESERVED RI DO GND GND RESERVED RESERVED Output signal to wake up the host. Mini card ground Reserved 12 13 14 15 16 17 18 19 20 W_DISABLE#

W_DISABLE#

DI Airplane mode control default. Active low. 21 GND GND Mini card ground Pull-up by 22 PERST#

PERST#

DI Fundamental reset signal default. Pull-up by 23 PERn0 UART_CTS DI UART clear to send 24 25 26 27 28 29 3.3Vaux RESERVED Reserved PERp0 UART_RTS DO UART request to send GND GND 1.5V GND GND GND NC GND Mini card ground Mini card ground Not connected Mini card ground 30 SMB_CLK I2C_SCL DO I2C serial clock Active low Connect to DTEs RTS. Connect to DTEs CTS Require external pull-up to 1.8V. 31 32 PETn0 DTR DI Sleep mode control SMB_DATA I2C_SDA IO I2C serial data Require EG25-G_Mini_PCIe_Hardware_Design 16 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design 33 34 35 PETp0 RESERVED GND GND GND GND Reserved Mini card ground Mini card ground 36 USB_D-

USB_DM IO USB differential data (-) external pull-up to 1.8V. Require differential impedance of 90 37 GND GND Mini card ground 38 USB_D+

USB_DP IO USB differential data (+) 39 40 41 3.3Vaux VCC_3V3 PI 3.3V DC supply GND GND Mini card ground 3.3Vaux VCC_3V3 PI 3.3V DC supply Require differential impedance of 90 42 LED_WWAN#

LED_WWAN#

OC network status of the Active low LED signal for indicating the module GND GND Mini card ground LED_WLAN#

USIM_PRESENCE DI

(U)SIM card insertion detection RESERVED PCM_CLK 1) IO PCM clock signal LED_WPAN#

RESERVED Reserved RESERVED PCM_DOUT 1) DO PCM data output 1.5V NC Not connected RESERVED PCM_DIN 1) DI PCM data input GND GND Mini card ground RESERVED PCM_SYNC 1) IO PCM frame synchronization 3.3Vaux VCC_3V3 PI 3.3V DC supply 43 44 45 46 47 48 49 50 51 52 EG25-G_Mini_PCIe_Hardware_Design 17 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design NOTES 1. Keep all NC, reserved and unused pins unconnected. 2. 1) The digital audio (PCM) function is only supported on Telematics version. 3.3. Power Supply The following table shows pin definition of VCC_3V3 pins and ground pins. Table 5: Definition of VCC_3V3 and GND Pins Pin No. Pin Name I/O Power Domain Description 2, 39, 41, 52 VCC_3V3 PI 3.0V~3.6V 3.3V DC supply 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, GND Mini card ground 37, 40, 43, 50 The typical supply voltage of EG25-G Mini PCIe is 3.3V. In the 2G network, the input peak current may reach 2.7A during the transmitting time. Therefore, the power supply must be able to provide enough current, and a bypass capacitor of no less than 470F with low ESR should be used to prevent the voltage from dropping. The following figure shows a reference design of power supply. The precision of resistor R2 and R3 is 1%, and the capacitor C3 needs a low ESR. Figure 3: Reference Circuit of Power Supply EG25-G_Mini_PCIe_Hardware_Design 18 / 48 LDO_INC1C2MIC29302WUU1INOUTENGNDADJ24135VCC_3V3100nFC3470uFC4100nFR282K 1%47K 1%R3470uF470R51KR4R1MCU_POWER_ON/OFF47K4.7KR5R6C5C633pF10pFTVSD1 LTE Module Series EG25-G Mini PCIe Hardware Design 3.4. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. Table 6: Pin Definition of (U)SIM Interface Pin No. Pin Name I/O Power Domain Description 8 10 12 14 44 USIM_VDD PO 1.8V/3.0V Power source for (U)SIM card USIM_DATA IO 1.8V/3.0V Data signal of (U)SIM card USIM_CLK DO 1.8V/3.0V Clock signal of (U)SIM card USIM_RST DO 1.8V/3.0V Reset signal of (U)SIM card USIM_ PRESENCE DI 1.8V/3.0V

(U)SIM card insertion detection EG25-G Mini PCIe supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections, and is disabled by default. For more details of AT+QSIMDET command, please refer to document [2]. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. Figure 4: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector EG25-G_Mini_PCIe_Hardware_Design 19 / 48 USIM_VDDGNDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_PRESENCE100nFGNDGND33pF33pF33pFVCCRSTCLKIOVPPGNDGNDUSIM_VDD15K(U)SIM Card ConnectorModuleVDD_EXT51K0R0R0R LTE Module Series EG25-G Mini PCIe Hardware Design If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 5: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers applications, please follow the criteria below in (U)SIM circuit design:

Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and power supply traces. Assure the ground trace between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential. Make sure the bypass capacitor between USIM_VDD and USIM_GND is less than 1uF, and be placed as close to (U)SIM card connector as possible. If the ground is complete on customers PCB, USIM_GND can be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode array with parasitic capacitance not exceeding 15pF. The 0 resistors should be added in series between the module and the (U)SIM card so as to facilitate debugging. The 33pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the

(U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. EG25-G_Mini_PCIe_Hardware_Design 20 / 48 USIM_VDDGNDUSIM_RSTUSIM_CLKUSIM_DATA0R0R0R100nFGND33pF33pF33pFVCCRSTCLKIOVPPGNDGND15KUSIM_VDD(U)SIM Card ConnectorModule LTE Module Series EG25-G Mini PCIe Hardware Design 3.5. USB Interface The following table shows the pin definition of USB interface. Table 7: Pin Definition of USB Interface Pin No. Pin Name I/O Description Comment USB_DM IO USB differential data (-) Require differential impedance of 90 USB_DP IO USB differential data (+) Require differential impedance of 90 36 38 EG25-G Mini PCIe is compliant with USB 2.0 specification. It can only be used as a slave device. Meanwhile, it supports high speed (480Mbps) mode and full speed (12Mbps) mode. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB*. The following figure shows a reference circuit of USB interface. Figure 6: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. EG25-G_Mini_PCIe_Hardware_Design 21 / 48 USB_DPUSB_DMGNDUSB_DPUSB_DMGNDL1Close to ModuleR3R4Test PointsESD ArrayNM_0RNM_0RMinimize these stubsModuleMCUUSB_VBUSVDD LTE Module Series EG25-G Mini PCIe Hardware Design The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2pF. Keep the ESD protection components as close to the USB connector as possible. NOTES S 1. There are three preconditions when enabling EG25-G Mini PCIe to enter into the sleep mode:

a) Execute AT+QSCLK=1 command to enable the sleep mode. Please refer to document [2] for details. b) DTR pin should be kept at high level (pull-up internally). c) USB interface on Mini PCIe must be connected with the USB interface of the host and please guarantee the USB of the host is in suspension state. 2.

* means under development. 3.6. UART Interface The following table shows the pin definition of the main UART interface. Table 8: Pin Definition of Main UART Interface Pin No. Pin Name I/O Power Domain Description 11 13 23 25 UART_RX DI 3.3V UART receive data UART_TX DO 3.3V UART transmit data UART_CTS UART_RTS DI DO 3.3V 3.3V UART clear to send UART request to send The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps and 230400bps baud rates, and the default is 115200bps. This interface can be used for AT command communication and data transmission. EG25-G_Mini_PCIe_Hardware_Design 22 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design NOTE AT+IPR command can be used to set the baud rate of the main UART, and AT+IFC command can be used to set the hardware flow control (hardware flow control is disabled by default). Please refer to document [2] for details. 3.7. PCM and I2C Interfaces EG25-G Mini PCIe provides one Pulse Code Modulation (PCM) digital interface and one I2C interface. The following table shows the pin definition of PCM and I2C interfaces that can be applied in audio codec design. Table 9: Pin Definition of PCM and I2C Interfaces Pin No. Pin Name I/O Power Domain Description PCM_CLK 1) IO PCM_DOUT 1) DO PCM_DIN 1) PCM_SYNC 1) DI IO 1.8V 1.8V 1.8V 1.8V I2C_SCL DO 1.8V I2C_SDA IO 1.8V 45 47 49 51 30 32 PCM clock signal PCM data output PCM data input PCM frame synchronization I2C serial clock. Require external pull-up to 1.8V. I2C serial data. Require external pull-up to 1.8V. EG25-G Mini PCIe provides one PCM digital interface, which supports 16-bit linear data format and the following modes:

Primary mode (short frame synchronization, works as either master or slave) Auxiliary mode (long frame synchronization, works as master only) NOTES 1. * means under development. 2. 1) The digital audio (PCM) function is only supported on Telematics version. EG25-G_Mini_PCIe_Hardware_Design 23 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, PCM_CLK supports 128KHz, 256KHz, 512KHz, 1024KHz and 2048KHz for different speed codecs. The following figure shows the timing relationship in primary mode with 8KHz PCM_SYNC and 2048KHz PCM_CLK. Figure 7: Timing in Primary Mode In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge; while the PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a 128KHz PCM_CLK and an 8KHz, 50% duty cycle PCM_SYNC only. The following figure shows the timing relationship in auxiliary mode with 8KHz PCM_SYNC and 128KHz PCM_CLK. Figure 8: Timing in Auxiliary Mode EG25-G_Mini_PCIe_Hardware_Design 24 / 48 PCM_CLKPCM_SYNCPCM_DOUTMSBLSBMSB125us12256255PCM_DINMSBLSBMSBPCM_CLKPCM_SYNCPCM_DOUTMSBLSBPCM_DIN125usMSB121615LSB LTE Module Series EG25-G Mini PCIe Hardware Design Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC. In addition, EG25-G Mini PCIes firmware has integrated the configuration on some PCM codecs application with I2C interface. Please refer to document [2] for details about AT+QDAI command. The following figure shows a reference design of PCM interface with an external codec IC. Figure 9: Reference Circuit of PCM Application with Audio Codec 3.8. Control and Indicator Signals The following table shows the pin definition of control and indicator signals. Table 10: Pin Definition of Control and Indicator Signals Pin No. Pin Name I/O Power Domain Description 17 31 20 22 42 1 RI DTR DO 3.3V Output signal to wake up the host. DI 3.3V Sleep mode control W_DISABLE#

DI 3.3V Airplane mode control; pull-up by default;

active low. PERST#

DI 3.3V Fundamental reset signal; active low. LED_WWAN#

OC LED signal for indicating the network status of the module; active low WAKE#

OC Output signal to wake up the host. EG25-G_Mini_PCIe_Hardware_Design 25 / 48 PCM_DINPCM_DOUTPCM_SYNCPCM_CLKI2C_SCLI2C_SDAModule1.8V4.7K4.7KBCLKLRCKDACADCSCLSDABIASMICBIASINPINNLOUTPLOUTNCodec LTE Module Series EG25-G Mini PCIe Hardware Design 3.8.1. RI Signal The RI signal can be used to wake up the host. When a URC returns, there will be the following behaviors on the RI pin after executing AT+QCFG=risignaltype,physical command. Figure 10: RI Behavior 3.8.2. DTR Signal The DTR signal supports sleep control function. Driving it to low level will wake up the module. 3.8.3. W_DISABLE# Signal EG25-G Mini PCIe provides a W_DISABLE# signal to disable or enable the RF function (not include GNSS). W_DISABLE# signal function is disabled by default, and AT+QCFG=airplanecontrol,1 can be used to enable this function. The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter into airplane mode. AT+CFUN can also be used to control the RF status, and the details are as follows:

Table 11: RF Function Status W_DISABLE1# Level AT Commands RF Function Status High Level AT+CFUN=1 Enabled High Level Low Level AT+CFUN=0 AT+CFUN=4 AT+CFUN=0 AT+CFUN=1 AT+CFUN=4 Disabled Disabled EG25-G_Mini_PCIe_Hardware_Design 26 / 48 HighLow120msURC return LTE Module Series EG25-G Mini PCIe Hardware Design 3.8.4. PERST# Signal The PERST# signal can be used to force a hardware reset on the card. Customers can reset the module by driving the PERST# to a low level voltage with the time frame of 150ms~460ms and then releasing it. The reset scenario is illustrated in the following figure. Figure 11: Timing of Resetting Module 3.8.5. LED_WWAN# Signal The LED_WWAN# signal of EG25-G Mini PCIe is used to indicate the network status of the module, and can absorb the current up to 40mA. According to the following circuit, in order to reduce the current of the LED, a resistor must be placed in series with the LED. The LED is emitting light when the LED_WWAN#

output signal is active low. Figure 12: LED_WWAN# Signal Reference Circuit Diagram There are two indication modes for LED_WWAN# signal to indicate network status, which can be switched through following AT commands:

AT+QCFG=ledmode,0 (Default setting) AT+QCFG=ledmode,2 The following tables show the detailed network status indications of the LED_WWAN# signal. EG25-G_Mini_PCIe_Hardware_Design 27 / 48 VIL0.5VVIH2.3VVCC_3V3150msResettingModule StatusRunningPERST#Restart460msLED_WWAN#VCCR LTE Module Series EG25-G Mini PCIe Hardware Design Table 12: Indications of Network Status (AT+QCFG=ledmode,0, Default Setting) Pin Status Description Flicker slowly (200ms High/1800ms Low) Network searching Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always High Voice calling Table 13: Indications of Network Status (AT+QCFG=ledmode,2) Pin Status Description Low Level (Light on) Registered on network High-impedance (Light off) 3.8.6. WAKE# Signal No network coverage or not registered W_DISABLE# signal is at low level.

(Disable the RF) AT+CFUN=0, AT+CFUN=4 The WAKE# signal is an open collector signal which is similar to RI signal, but a host pull-up resistor and AT+QCFG=risignaltype,physical command are required. When a URC returns, there will be 120ms low level pulse output as below. Figure 13: WAKE# Behavior EG25-G_Mini_PCIe_Hardware_Design 28 / 48 URC return120msHighLow(external pull-up) LTE Module Series EG25-G Mini PCIe Hardware Design 3.9. Antenna Interfaces EG25-G Mini PCIe antenna interfaces include a main antenna interface, an Rx-diversity antenna interface and a GNSS antenna interface. Rx-diversity function is enabled by default. 3.9.1. Antenna Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 14: Antenna Requirements Type Requirements Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: <1.5dB Active antenna gain: > -2dBi Active antenna embedded LNA gain: 20dB (Typ.) Active antenna total gain: > 18dBi (Typ.) VSWR: 2 Gain: 1dBi Max Input Power: 50W Input Impedance: 50 Polarization Type: Vertical Cable Insertion Loss: < 1dB

(GSM850, EGSM900, WCDMA B5/B6/B8/B19, LTE B5/B8/B12/B13/

B18/B19/B20/B26/B28) Cable Insertion Loss: < 1.5dB

(DCS1800, PCS1900, WCDMA B1/B2/B4, LTE B1/B2/B3/B4/B25/B39) Cable insertion loss: < 2dB

(LTE B7/B38/B40/B41) GNSS GSM/UMTS/LTE EG25-G_Mini_PCIe_Hardware_Design 29 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design 3.9.2. Recommended RF Connector for Antenna Installation EG25-G Mini PCIe is mounted with 2mm 2mm RF connectors for convenient antenna connection. The dimensions of the RF connectors are shown as below. Figure 14: Dimensions of the RF Connectors (Unit: mm) U.FL-LP mating plugs listed in the following figure can be used to match the RF connectors. Figure 15: Mechanicals of U.FL-LP Mating Plugs EG25-G_Mini_PCIe_Hardware_Design 30 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design The following figure describes the space factor of mating plugs. Figure 16: Space Factor of Mating Plugs (Unit: mm) For more details, please visit http://www.hirose.com. EG25-G_Mini_PCIe_Hardware_Design 31 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design 4 Electrical, Reliability and Radio Characteristics 4.1. General Description This chapter mainly describes the following electrical and radio characteristics of EG25-G Mini PCIe:

Power supply requirements I/O requirements RF characteristics GNSS receiver ESD characteristics Thermal consideration Current consumption 4.2. Power Supply Requirements The input voltage of EG25-G Mini PCIe is 3.3V9%, as specified by PCI Express Mini CEM Specifications 1.2. The following table shows the power supply requirements of EG25-G Mini PCIe. Table 15: Power Supply Requirements Parameter Description Min. Typ. Max. Unit VCC_3V3 Power Supply 3.0 3.3 3.6 V EG25-G_Mini_PCIe_Hardware_Design 32 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design 4.3. I/O Requirements The following table shows the I/O requirements of EG25-G Mini PCIe. Table 16: I/O Requirements Parameter Description Min. Max. Unit Input High Voltage 0.7 VCC_3V3 VCC_3V3 + 0.3 Input Low Voltage

-0.3 0.3 VCC_3V3 Output High Voltage VCC_3V3 - 0.5 VCC_3V3 Output Low Voltage 0 0.4 V V V V VIH VIL VOH VOL NOTES S 1. The PCM and I2C interfaces belong to 1.8V power domain and other I/O interfaces belong to VCC_3V3 power domain. 2. The maximum voltage value of VIL for PERST# signal and W_DISABLE# signal is 0.5V. 4.4. RF Characteristics The following tables show the conducted RF output power and receiving sensitivity of EG25-G Mini PCIe module. Table 17: EG25-G Mini PCIe Conducted RF Output Power Frequency GSM850/EGSM900 DCS1800/PCS1900 Max. 33dBm2dB 30dBm2dB GSM850/EGSM900 (8-PSK) 27dBm3dB DCS1800/PCS1900 (8-PSK) 26dBm3dB WCDMA B1/B2/B4/B5/B6/B8/B19 24dBm+1/-3dB LTE-FDD B1/B2/B3/B4/B5/B7/B8/B12 23dBm2dB Min. 5dBm5dB 0dBm5dB 5dBm5dB 0dBm5dB

< -49dBm

< -39dBm EG25-G_Mini_PCIe_Hardware_Design 33 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design LTE-FDD B13/B18/B19/B20/B25/B26/B28 23dBm2dB LTE-TDD B38/B39/B40/B41 23dBm2dB

< -39dBm

< -39dBm Table 18: EG25-G Mini PCIe Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) GSM850

-108dBm EGSM900

-108dBm DCS1800

-107.5dBm PCS1900

-107.5dBm NA NA NA NA NA NA NA NA

-102dBm

-102dBm

-102dBm

-102dBm WCDMA B1

-108.2dBm

-108.5dBm

-109.2dBm

-106.7dBm WCDMA B2

-109.5dBm

-109dBm

-110dBm

-104.7dBm WCDMA B4

-108.5dBm

-109dBm

-109.7dBm

-103.7dBm WCDMA B5

-109dBm

-109.5dBm

-110dBm

-104.7dBm WCDMA B6

-109dBm

-109.5dBm

-110.5dBm

-106.7dBm WCDMA B8

-109.2dBm

-109.5dBm

-110.5dBm

-103.7dBm WCDMA B19

-109dBm

-109.5dBm

-110.5dBm

-106.7dBm LTE-FDD B1 (10M)

-97.3dBm

-98.3dBm

-99.5dBm

-96.3dBm LTE-FDD B2 (10M)

-98dBm

-99dBm

-99.9dBm

-94.3dBm LTE-FDD B3 (10M)

-97.4dBm

-98.1dBm

-99.8dBm

-93.3dBm LTE-FDD B4 (10M)

-97.7dBm

-98.2dBm

-99.7dBm

-96.3dBm LTE-TDD B5 (10M)

-98dBm

-98.5dBm

-99.9dBm

-94.3dBm LTE-TDD B7 (10M)

-97.3dBm

-97.3dBm

-99.1dBm

-94.3dBm LTE-TDD B8 (10M)

-98dBm

-98.1dBm

-99.8dBm

-93.3dBm LTE-TDD B12 (10M)

-98dBm

-98.1dBm

-99.9dBm

-93.3dBm LTE-TDD B13 (10M)

-98dBm

-98.1dBm

-100.1dBm

-93.3dBm EG25-G_Mini_PCIe_Hardware_Design 34 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design LTE-TDD B18 (10M)

-98dBm

-99.5dBm

-100dBm

-96.3dBm LTE-TDD B19 (10M)

-98dBm

-99dBm

-99.8dBm

-96.3dBm LTE-TDD B20 (10M)

-98dBm

-98.8dBm

-99.7dBm

-93.3dBm LTE-TDD B25 (10M)

-98dBm

-98dBm

-100.2dBm

-92.8dBm LTE-TDD B26 (10M)

-98dBm

-98.8dBm

-100dBm

-93.8dBm LTE-TDD B28 (10M)

-98.1dBm

-98.9dBm

-99.8dBm

-94.8dBm LTE-TDD B38 (10M)

-97.2dBm

-97.3dBm

-99.2dBm

-96.3dBm LTE-TDD B39 (10M)

-98dBm

-98.2dBm

-99.8dBm

-96.3dBm LTE-TDD B40 (10M)

-97.7dBm

-97.5dBm

-99.7dBm

-96.3dBm LTE-TDD B41 (10M)

-97.2dBm

-97.2dBm

-99.3dBm

-94.3dBm 4.5. GNSS Receiver EG25-G Mini PCIe integrates a GNSS receiver that supports IZat Gen 8C Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo, QZSS). Meanwhile, it supports Qualcomm gpsOneXTRA technology (one kind of A-GNSS). This technology will download XTRA file from the internet server to enhance the TTFF. XTRA file contains predicted GPS and GLONASS satellites coordinates and clock biases valid for up to 7 days. It is best if XTRA file is downloaded every 1~2 days. Additionally, EG25-G Mini PCIe can support standard NMEA-0183 protocol and output NMEA messages with 1Hz via USB NMEA interface. EG25-G Mini PCIes GNSS engine is switched off by default. Customers must switch on it by AT command. Please refer to document [3] for more details about GNSS engine technology and configurations. A passive antenna should be used for the GNSS engine. EG25-G_Mini_PCIe_Hardware_Design 35 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design 4.6. ESD Characteristics The following table shows the ESD characteristics of EG25-G Mini PCIe. Table 19: ESD Characteristics of EG25-G Mini PCIe Part Contact Discharge Air Discharge Unit Power Supply and GND Antenna Interfaces USB Interface

(U)SIM Interface Others

+/-5

+/-4

+/-4

+/-4

+/-0.5 4.7. Thermal Consideration

+/-10

+/-8

+/-8

+/-8

+/-1 kV kV kV kV kV In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:

On customers PCB design, please keep placement of the PCI Express Mini Card away from heating sources. Do not place components on the PCB area where the module is mounted, in order to facilitate adding of heatsink. Do not apply solder mask on the PCB area where the module is mounted, so as to ensure better heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Add a heatsink on the top of the module and the heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module. Add a thermal pad with appropriate thickness at the bottom of the module to conduct the heat to PCB. The following figure shows the referenced heatsink design. EG25-G_Mini_PCIe_Hardware_Design 36 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design Figure 17: Referenced Heatsink Design NOTES 1. The module offers the best performance when the internal BB chip stays below 105C. When the maximum temperature of the BB chip reaches or exceeds 105C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. 2. For more detailed guidelines on thermal design, please refer to document [4]. 4.8. Current Consumption Table 20: Current Consumption of EG25-G Mini PCIe Parameter Description Conditions Typ. Unit IVBAT Sleep state AT+CFUN=0 (USB disconnected) EGSM @DRX=2 (USB disconnected) EGSM @DRX=5 (USB disconnected) EGSM @DRX=5 (USB suspended) 3.2 4.4 3.9 4.1 mA mA mA mA EG25-G_Mini_PCIe_Hardware_Design 37 / 48 Thermal PadApplication BoardApplication BoardHeatsinkThermal PadEG25-G ModuleEG25-G Mini PCIeHeatsinkPCI Express Mini Card ConnectorShielding CoverThermal Pad LTE Module Series EG25-G Mini PCIe Hardware Design EGSM @DRX=9 (USB disconnected) 3.7 DCS1800 @DRX=2 (USB disconnected) 4.5 DCS1800 @DRX=5 (USB disconnected) 3.9 DCS1800 @DRX=5 (USB suspended) 4.1 DCS1800 @DRX=9 (USB disconnected) 3.7 WCDMA @PF=64 (USB suspended) 4.2 WCDMA @PF=128 (USB disconnected) 3.9 WCDMA @PF=256 (USB disconnected) 3.6 WCDMA @ PF=512 (USB disconnected) 3.5 LTE-FDD @PF=32 (USB disconnected) 6.4 LTE-FDD @PF=64 (USB disconnected) 4.9 LTE-FDD @PF=64 (USB suspended) 5.1 LTE-FDD @PF=128 (USB disconnected) 4.2 LTE-FDD @PF=256 (USB disconnected) 4.0 LTE-TDD @PF=32 (USB disconnected) 6.5 LTE-TDD @PF=64 (USB disconnected) 5.2 LTE-TDD @PF=64 (USB suspended) 5.3 LTE-TDD @PF=128 (USB disconnected) 4.4 LTE-TDD @PF=256 (USB disconnected) 4.1 EGSM DRX=5 (USB disconnected) EGSM DRX=5 (USB connected) Idle state WCDMA @PF=64 (USB disconnected) WCDMA @PF=64 (USB connected) 25 36 24 37 LTE-FDD @PF=64 (USB disconnected) 16 LTE-FDD @PF=64 (USB connected) 30 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG25-G_Mini_PCIe_Hardware_Design 38 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design LTE-TDD @PF=64 (USB disconnected) 16 LTE-TDD @PF=64 (USB connected) 30 GSM850 1UL/4DL @32.5dBm GSM850 2UL/3DL @32.3dBm GSM850 3UL/2DL @30.2dBm GSM850 4UL/1DL @29.1dBm EGSM900 1UL/4DL @32.3dBm EGSM900 2UL/3DL @32.2dBm EGSM900 3UL/2DL @30.1dBm EGSM900 4UL/1DL @28.9dBm DCS1800 1UL/4DL @29.7dBm DCS1800 2UL/3DL @29.5dBm DCS1800 3UL/2DL @29.4dBm DCS1800 4UL/1DL @29.3dBm PCS1900 1UL/4DL @29.6dBm PCS1900 1UL/4DL @29.4dBm PCS1900 1UL/4DL @29.2dBm PCS1900 1UL/4DL @29.0dBm GSM850 1UL/4DL @27.1dBm GSM850 2UL/3DL @26.74dBm GSM850 3UL/2DL @26.5dBm GSM850 4UL/1DL @26.2dBm EGSM900 1UL/4DL @26.2dBm EGSM900 2UL/3DL @26.3dBm EGSM900 3UL/2DL @26.5dBm GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) 285 370 470 600 275 370 545 605 190 290 400 490 195 295 398 500 198 370 530 610 199 365 535 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG25-G_Mini_PCIe_Hardware_Design 39 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design EGSM900 4UL/1DL@26.4dBm DCS18001UL/4DL @26.0dBm DCS1800 2UL/3DL @25.6dBm DCS1800 3UL/2DL @25.4dBm DCS1800 4UL/1DL @25.2dBm PCS1900 1UL/4DL @25.6dBm PCS1900 1UL/4DL @25.6dBm PCS1900 1UL/4DL @25.5dBm PCS1900 1UL/4DL @25.2dBm WCDMA B1 HSDPA @22.0dBm WCDMA B2 HSDPA @22.1dBm WCDMA B4 HSDPA @22.1dBm WCDMA B5 HSDPA @22.3dBm WCDMA B6 HSUPA @22.2dBm WCDMA B8 HSDPA @22.5dBm WCDMA B19 HSUPA @22.4dBm LTE-FDD B1 @22.9dBm LTE-FDD B2 @23.0dBm LTE-FDD B3 @23.1dBm LTE-FDD B4 @22.9dBm LTE-FDD B5 @23.0dBm LTE-FDD B7 @22.9dBm LTE-FDD B8 @23.2dBm LTE-FDD B12 @23.1dBm LTE-FDD B13 @23.0dBm 598 170 280 370 460 180 270 365 460 600 600 600 530 510 580 510 710 800 770 760 700 730 780 670 820 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) EG25-G_Mini_PCIe_Hardware_Design 40 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design LTE-FDD B18 @23.2dBm LTE-FDD B19 @23.1dBm LTE-FDD B20 @23.0dBm LTE-FDD B25 @22.9dBm LTE-FDD B26 @23.0dBm LTE-FDD B28 @23.1dBm LTE-TDD B38 @22.8dBm LTE-TDD B39 @23.0dBm LTE-TDD B40 @22.8dBm LTE-TDD B41 @22.9dBm GSM850PCL=5 @32.6dBm EGSM900PCL=5 @32.6dBm DCS1800PCL=0 @29.5dBm PCS1900PCL=0 @29.5dBm WCDMA B1 @22.7dBm WCDMA B2 @22.8dBm WCDMA B4 @22.7dBm WCDMA B5 @22.8dBm WCDMA B6 @22.8dBm WCDMA B8 @22.9dBm WCDMA B19 @22.8dBm 800 720 730 720 740 720 430 370 370 440 300 299 200 189 630 650 620 580 580 620 560 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA GSM voice call WCDMA voice call EG25-G_Mini_PCIe_Hardware_Design 41 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design Table 21: GNSS Current Consumption of EG25-G Mini PCIe Parameter Description Conditions Typ. Unit Searching

(AT+CFUN=0) Tracking

(AT+CFUN=0) Cold start @Passive Antenna Lost state @Passive Antenna Instrument Environment 61 59 39 mA mA mA IVBAT

(GNSS) EG25-G_Mini_PCIe_Hardware_Design 42 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design 5 Dimensions and Packaging 5.1. General Description This chapter mainly describes mechanical dimensions as well as packaging specification of EG25-G Mini PCIe module. All dimensions are measured in mm. The tolerances for dimensions without tolerance values are 0.05mm. 5.2. Mechanical Dimensions of EG25-G Mini PCIe Figure 18: Mechanical Dimensions of EG25-G Mini PCIe EG25-G_Mini_PCIe_Hardware_Design 43 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design 5.3. Standard Dimensions of Mini PCI Express The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1]

for detailed A and B. Figure 19: Standard Dimensions of Mini PCI Express EG25-G_Mini_PCIe_Hardware_Design 44 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design EG25-G Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives and standards listed in the document [1]. The following figure takes the Molex 679100002 as an example. Figure 20: Dimensions of the Mini PCI Express Connector (Molex 679100002) 5.4. Packaging The EG25-G Mini PCIe is packaged in a tray. Each tray contains 10pcs of modules. The smallest package of EG25-G Mini PCIe contains 100pcs. EG25-G_Mini_PCIe_Hardware_Design 45 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design 6 Appendix References Table 22: Related Documents SN Document Name Remark

[1]

PCI Express Mini Card Electromechanical Specification Revision 1.2

[2] Quectel_EC2x&EG2x-G_AT_Commands_Manual Mini PCI Express specification AT commands manual for EC25, EC21, EG25-G and EG21-G modules GNSS AT commands manual for EC25, Quectel_EC2x&EGxx&EM05_GNSS_AT_Commands EC21, EC20 R2.0, EC20 R2.1, EG91-NA,

[3]

_ Manual EG95-NA, EG61-NA, EG25-G, EG21-G and EM05 modules Thermal design guide for LTE modules including EC25, EC21, EC20 R2.0, EC20 R2.1, EG91, EG95, EP06, EG06, EM06 and AG35.

[4] Quectel_LTE_Module_Thermal_Design_Guide Table 23: Terms and Abbreviations Abbreviation Description AMR bps CS CTS Adaptive Multi-rate Bits Per Second Coding Scheme Clear to Send DC-HSPA+

Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over-The-Air DL DTE Down Link Data Terminal Equipment EG25-G_Mini_PCIe_Hardware_Design 46 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design DTR EFR EMI ESD ESR FDD FR GLONASS GMSK GNSS GPS GSM HR kbps LED LTE Mbps MCU ME MIMO MMS MO MT NMEA PCM Data Terminal Ready Enhanced Full Rate Electro Magnetic Interference Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplexing Full Rate GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate Kilo Bits Per Second Light Emitting Diode Long-Term Evolution Million Bits Per Second Micro Control Unit Mobile Equipment Multiple-Input Multiple-Output Multimedia Messaging Service Mobile Originated Mobile Terminated National Marine Electronics Association Pulse Code Modulation EG25-G_Mini_PCIe_Hardware_Design 47 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design Personal Digital Assistant Protocol Data Unit Point of Sale Point-to-Point Protocol Radio Frequency Ready To Send Receive Direction Single Input Multiple Output Short Message Service Transmitting Direction Transient Voltage Suppressor Universal Asynchronous Receiver & Transmitter Up Link Unsolicited Result Code Universal Serial Bus

(Universal) Subscriber Identification Module Wideband Code Division Multiple Access Wireless Local Area Networks PDA PDU POS PPP RF RTS Rx SIMO SMS TX TVS UART UL URC USB

(U)SIM WCDMA WLAN EG25-G_Mini_PCIe_Hardware_Design 48 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design IC & FCC Requirement FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR201903EG25G 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

Operating Band FCC Max Antenna GaindBi IC Max Antenna GaindBi GSM850 GSM1900 WCDMA BAND II WCDMA BAND IV WCDMA BAND V LTE BAND 2 LTE BAND 4 LTE BAND 5 LTE BAND 7 LTE BAND 12 LTE BAND 13 LTE BAND 25 LTE BAND 26(814-824) LTE BAND 26(824-849) LTE BAND 38 LTE BAND 41 8.60 10.19 8.00 5.00 9.42 8.00 5.00 9.41 8.00 8.70 9.16 8.00 9.36 9.41 8.00 8.00 7.44 10.19 8.00 5.00 8.26 8.00 5.00 8.25 8.00 7.76 8.09 8.00 NA 8.25 8.00 8.00 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is EG25-G_Mini_PCIe_Hardware_Design 49 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR201903EG25G or Contains FCC ID: XMR201903EG25G must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement EG25-G_Mini_PCIe_Hardware_Design 50 / 48 LTE Module Series EG25-G Mini PCIe Hardware Design IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-201903EG25G or where: 10224A-201903EG25G is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A-201903EG25G " ou "o: 10224A-201903EG25G est le numro de certification du module". EG25-G_Mini_PCIe_Hardware_Design 51 / 48