FCC ID: XMR201907EC25MX LTE Module

 

EC25 Hardware Design LTE Standard Module Series Rev. EC25_Hardware_Design_V2.0 Date: 2019-04-30 Status: Released www.quectel.com LTE Standard Module Series EC25 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

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http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. EC25_Hardware_Design 1 / 112 LTE Standard Module Series EC25 Hardware Design About the Document History Revision Date Author Description 1.0 2016-04-01 Woody WU Initial 1. Updated EC25 series frequency bands in Table 1. 2. Updated transmitting power, supported maximum baud rate of main UART/internal protocols/USB drivers of USB interface, firmware upgrade and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4. Updated timing of turning off module in Figure 13. 5. Updated timing of resetting module in Figure 16. 6. Updated supported baud rates of main UART in Chapter 3.11. 7. Added notes for ADC interface in Chapter 3.13. 8. Updated GNSS performance in Table 21. 9. Updated operating frequencies of module in Table 23. 10. Added current consumption in Chapter 6.4. 11. Updated RF output power in Chapter 6.5. 12. Added RF receiving sensitivity in Chapter 6.6. 1. Added SGMII and WLAN interfaces in Table 2. 2. Updated function diagram in Figure 1. 3. Updated pin assignment (Top View) in Figure 2. 4. Added description of SGMII and WLAN interfaces in Table 4. 5. Added SGMII interface in Chapter 3.17. 6. Added WLAN interface in Chapter 3.18. 7. Added USB_BOOT interface in Chapter 3.19. 8. Added reference design of RF layout in Chapter 5.1.4. 9. Added note about SIMO in Chapter 6.6. 1. Updated function diagram in Figure 1. 2. Updated pin assignment (top view) in Figure 2. 1.1 2016-09-22 Lyndon LIU/

Frank WANG 1.2 2016-11-04 Lyndon LIU/

Michael ZHANG 1.3 2017-01-24 Lyndon LIU/

Frank WANG EC25_Hardware_Design 2 / 112 LTE Standard Module Series EC25 Hardware Design 3. Added BT interface in Chapter 3.18.2. 4. Updated GNSS performance in Table 24. 5. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29. 6. Updated current consumption of EC25-E module in Table 33. 7. Updated EC25-A conducted RF receiving sensitivity in Table 38. 8. Added EC25-J conducted RF receiving sensitivity in Table 40. 1. Updated functional diagram in Figure 1. 2. Updated LTE, UMTS and GSM features in Table 2. 3. Updated description of pin 40/136/137/138. 4. Updated PWRKEY pulled down time to 500ms in Chapter 3.7.1 and reference circuit in Figure 10. 5. Updated reference circuit of (U)SIM interface in Figure 17&18. 6. Updated reference circuit of USB interface in Figure 19. 7. Updated PCM mode in Chapter 3.12. 8. Added SD card interface in Chapter 3.13. 9. Updated USB_BOOT reference circuit in Chapter 3.20. 10. Updated module operating frequencies in Table 26. 11. Updated antenna requirements in Table 30. 12. Updated EC25 series module current consumption in Chapter 6.4. 13. Updated EC25 series module conducted RF receiving sensitivity in Chapter 6.6. 14. Added thermal consideration description in Chapter 6.8. 15. Added dimension tolerance information in Chapter 7. 16. Added storage temperature range in Table 2 and Chapter 6.3. 17. Updated RF output power in Table 41. 18. Updated GPRS multi-slot classes in Table 53. 19. Updated storage information in Chapter 8.1. 1. Added information of EC25-AF in Table 1. 2. Updated module operating frequencies in Table 27. 3. Added current consumption of EC25-AF module in 1.4 2018-03-05 AnniceZHANG/

Lyndon LIU/

Frank WANG 1.5 2018-04-20 Kinsey ZHANG Table 40. 4. Changed GNSS current consumption of EC25 series module into Table 41. 5. Added EC25-AF conducted RF receiving sensitivity in EC25_Hardware_Design 3 / 112 LTE Standard Module Series EC25 Hardware Design Table 50. 1. Added new variants EC25-EU/-EC/-EUX/-MX and related information. 2. Updated functional diagram in Figure 1. 3. Updated star structure of the power supply in Figure 8. 4. Updated power-on scenario of module in Figure 12. 5. Updated reference circuit with translator chip in Figure 20. 6. Added timing sequence for entering into emergency download mode of USB_BOOT interface in Figure 32. 7. Updated general description in Table 1. 8. Updated module operating frequencies in Table 27. 9. Updated GNSS frequency in Table 29. 10. Updated antenna requirements in Table 30. 11. Updated EC25-V current consumption in Table 36. 12. Added EC25-EU current consumption in Table 41 13. Added EC25-EC current consumption in Table 42. 14. Added EC25-EUX current consumption in Table 43. 15. Added EC25-MX current consumption in Table 44. 16. Updated EC25-E conducted RF receiving sensitivity in Table 47. 17. Updated EC25-A conducted RF receiving sensitivity in Table 48. 18. Updated EC25-V conducted RF receiving sensitivity in Table 49. 19. Updated EC25-AUT sensitivity in Table 52. conducted RF receiving 20. Updated EC25-AUTL conducted RF receiving sensitivity in Table 53. 21. Added EC25-EU conducted RF receiving sensitivity in Table 55. 22. Added EC25-EC conducted RF receiving sensitivity in Table 56. 23. Added EC25-EUX conducted RF receiving sensitivity in Table 57. 24. Added EC25-MX conducted RF receiving sensitivity in 2.0 2019-04-30 Nathan LIU/

Frank WANG/

Ward WANG/

Ethan SHAN Table 58. 25. Updated recommended as 0.18mm~0.20mm and reflow soldering thermal profile in Chapter 8.2. thickness stencil EC25_Hardware_Design 4 / 112 LTE Standard Module Series EC25 Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 5 Table Index ............................................................................................................................................... 8 Figure Index ............................................................................................................................................ 10 1 Introduction ..................................................................................................................................... 12 1.1. Safety Information ................................................................................................................. 13 2 Product Concept ............................................................................................................................. 17 2.1. General Description .............................................................................................................. 17 Key Features ......................................................................................................................... 18 2.2. 2.3. Functional Diagram ............................................................................................................... 21 Evaluation Board ................................................................................................................... 22 2.4. 3.6. 3 Application Interfaces ..................................................................................................................... 23 3.1. General Description .............................................................................................................. 23 Pin Assignment ..................................................................................................................... 24 3.2. 3.3. Pin Description ...................................................................................................................... 25 3.4. Operating Modes .................................................................................................................. 37 3.5. Power Saving ........................................................................................................................ 37 3.5.1. Sleep Mode.................................................................................................................. 37 3.5.1.1. UART Application .............................................................................................. 37 3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 38 3.5.1.3. USB Application with USB Suspend/Resume and RI Function.......................... 39 3.5.1.4. USB Application without USB Suspend Function .............................................. 40 3.5.2. Airplane Mode .............................................................................................................. 40 Power Supply ........................................................................................................................ 41 3.6.1. Power Supply Pins ....................................................................................................... 41 3.6.2. Decrease Voltage Drop ............................................................................................... 42 3.6.3. Reference Design for Power Supply ............................................................................ 43 3.6.4. Monitor the Power Supply ............................................................................................ 43 Power-on and off Scenarios .................................................................................................. 44 3.7.1. Turn on Module Using the PWRKEY ........................................................................... 44 3.7.2. Turn off Module ............................................................................................................ 46 3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 46 3.7.2.2. Turn off Module Using AT Command ................................................................ 46 3.8. Reset Module ........................................................................................................................ 47 3.9.

(U)SIM Interface .................................................................................................................... 48 3.10. USB Interface ........................................................................................................................ 50 3.11. UART Interfaces ................................................................................................................... 52 3.12. PCM and I2C Interfaces ........................................................................................................ 55 3.13. SD Card Interface ................................................................................................................. 57 3.14. ADC Interfaces ...................................................................................................................... 59 3.7. EC25_Hardware_Design 5 / 112 LTE Standard Module Series EC25 Hardware Design 3.15. Network Status Indication ..................................................................................................... 60 3.16. STATUS ................................................................................................................................ 61 3.17. Behaviors of RI ..................................................................................................................... 62 3.18. SGMII Interface ..................................................................................................................... 62 3.19. Wireless Connectivity Interfaces ........................................................................................... 64 3.19.1. WLAN Interface ........................................................................................................... 67 3.19.2. BT Interface* ................................................................................................................ 67 3.20. USB_BOOT Interface............................................................................................................ 67 4 GNSS Receiver ................................................................................................................................ 70 4.1. General Description .............................................................................................................. 70 4.2. GNSS Performance .............................................................................................................. 70 4.3. Layout Guidelines ................................................................................................................. 71 5 Antenna Interfaces .......................................................................................................................... 72 5.1. Main/Rx-diversity Antenna Interfaces.................................................................................... 72 5.1.1. Pin Definition ................................................................................................................ 72 5.1.2. Operating Frequency ................................................................................................... 72 5.1.3. Reference Design of RF Antenna Interface ................................................................. 74 5.1.4. Reference Design of RF Layout ................................................................................... 74 5.2. GNSS Antenna Interface ....................................................................................................... 76 Antenna Installation .............................................................................................................. 78 5.3. 5.3.1. Antenna Requirement .................................................................................................. 78 5.3.2. Recommended RF Connector for Antenna Installation ................................................ 79 6 Electrical, Reliability and Radio Characteristics .......................................................................... 81 Absolute Maximum Ratings .................................................................................................. 81 6.1. Power Supply Ratings ........................................................................................................... 82 6.2. 6.3. Operation and Storage Temperatures .................................................................................. 82 Current Consumption ............................................................................................................ 83 6.4. 6.5. RF Output Power ................................................................................................................ 101 RF Receiving Sensitivity ..................................................................................................... 102 6.6. Electrostatic Discharge ....................................................................................................... 108 6.7. 6.8. Thermal Consideration ........................................................................................................ 109 7 Mechanical Dimensions................................................................................................................ 111 7.1. Mechanical Dimensions of the Module................................................................................ 111 7.2. Recommended Footprint ..................................................................................................... 113 Design Effect Drawings of the Module ................................................................................ 114 7.3. 8 Storage, Manufacturing and Packaging ...................................................................................... 115 8.1. Storage ............................................................................................................................... 115 8.2. Manufacturing and Soldering .............................................................................................. 116 8.3. Packaging ........................................................................................................................... 117 9 Appendix A References ................................................................................................................ 119 10 Appendix B GPRS Coding Schemes ........................................................................................... 123 EC25_Hardware_Design 6 / 112 LTE Standard Module Series EC25 Hardware Design 11 Appendix C GPRS Multi-slot Classes .......................................................................................... 124 12 Appendix D EDGE Modulation and Coding Schemes ................................................................ 126 EC25_Hardware_Design 7 / 112 LTE Standard Module Series EC25 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE ....................................................................... 17 TABLE 2: KEY FEATURES OF EC25 MODULE .............................................................................................. 18 TABLE 3: I/O PARAMETERS DEFINITION ...................................................................................................... 25 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 25 TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................ 37 TABLE 6: VBAT AND GND PINS ...................................................................................................................... 41 TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 44 TABLE 8: PIN DEFINITION OF RESET_N ....................................................................................................... 47 TABLE 9: PIN DEFINITION OF (U)SIM INTERFACE ....................................................................................... 49 TABLE 10: PIN DESCRIPTION OF USB INTERFACE ..................................................................................... 51 TABLE 11: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................ 52 TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE......................................................................... 53 TABLE 13: LOGIC LEVELS OF DIGITAL I/O ................................................................................................... 53 TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ...................................................................... 56 TABLE 15: PIN DEFINITION OF SD CARD INTERFACE ................................................................................ 57 TABLE 16: PIN DEFINITION OF ADC INTERFACES ...................................................................................... 59 TABLE 17: CHARACTERISTIC OF ADC .......................................................................................................... 59 TABLE 18: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR .................... 60 TABLE 19: WORKING STATE OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR .................. 60 TABLE 20: PIN DEFINITION OF STATUS ....................................................................................................... 61 TABLE 21: BEHAVIORS OF RI ......................................................................................................................... 62 TABLE 22: PIN DEFINITION OF SGMII INTERFACE ...................................................................................... 63 TABLE 23: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES ............................................... 65 TABLE 24: PIN DEFINITION OF USB_BOOT INTERFACE............................................................................. 68 TABLE 25: GNSS PERFORMANCE ................................................................................................................. 70 TABLE 26: PIN DEFINITION OF RF ANTENNAS ............................................................................................ 72 TABLE 27: MODULE OPERATING FREQUENCIES ....................................................................................... 72 TABLE 28: PIN DEFINITION OF GNSS ANTENNA INTERFACE .................................................................... 76 TABLE 29: GNSS FREQUENCY ...................................................................................................................... 77 TABLE 30: ANTENNA REQUIREMENTS ......................................................................................................... 78 TABLE 31: ABSOLUTE MAXIMUM RATINGS ................................................................................................. 81 TABLE 32: POWER SUPPLY RATINGS .......................................................................................................... 82 TABLE 33: OPERATION AND STORAGE TEMPERATURES ......................................................................... 82 TABLE 34: EC25-E CURRENT CONSUMPTION ............................................................................................. 83 TABLE 35: EC25-A CURRENT CONSUMPTION ............................................................................................. 85 TABLE 36: EC25-V CURRENT CONSUMPTION ............................................................................................. 86 TABLE 37: EC25-J CURRENT CONSUMPTION ............................................................................................. 87 TABLE 38: EC25-AU CURRENT CONSUMPTION .......................................................................................... 88 TABLE 39: EC25-AUT CURRENT CONSUMPTION ........................................................................................ 91 TABLE 40: EC25-AF CURRENT CONSUMPTION ........................................................................................... 92 TABLE 41: EC25-EU CURRENT CONSUMPTION .......................................................................................... 93 EC25_Hardware_Design 8 / 112 LTE Standard Module Series EC25 Hardware Design TABLE 42: EC25-EC CURRENT CONSUMPTION .......................................................................................... 95 TABLE 43: EC25-EUX CURRENT CONSUMPTION ........................................................................................ 97 TABLE 44: EC25-MX CURRENT CONSUMPTION ........................................................................................ 100 TABLE 45: GNSS CURRENT CONSUMPTION OF EC25 SERIES MODULE .............................................. 101 TABLE 46: RF OUTPUT POWER ................................................................................................................... 101 TABLE 47: EC25-E CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 102 TABLE 48: EC25-A CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 103 TABLE 49: EC25-V CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 103 TABLE 50: EC25-J CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 103 TABLE 51: EC25-AU CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 104 TABLE 52: EC25-AUT CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 105 TABLE 53: EC25-AUTL CONDUCTED RF RECEIVING SENSITIVITY ......................................................... 105 TABLE 54: EC25-AF CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 105 TABLE 55: EC25-EU CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 106 TABLE 56: EC25-EC CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 106 TABLE 57: EC25-EUX CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 107 TABLE 58: EC25-MX CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 108 TABLE 59: ELECTROSTATICS DISCHARGE CHARACTERISTICS (25C, 45% RELATIVE HUMIDITY) ... 108 TABLE 60: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................ 116 TABLE 61: RELATED DOCUMENTS ............................................................................................................. 119 TABLE 62: TERMS AND ABBREVIATIONS ................................................................................................... 119 TABLE 63: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................ 123 TABLE 64: GPRS MULTI-SLOT CLASSES .................................................................................................... 124 TABLE 65: EDGE MODULATION AND CODING SCHEMES ........................................................................ 126 EC25_Hardware_Design 9 / 112 LTE Standard Module Series EC25 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 22 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 24 FIGURE 3: SLEEP MODE APPLICATION VIA UART ...................................................................................... 38 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 39 FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 39 FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 40 FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ..................................................... 42 FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ........................................................................... 42 FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 43 FIGURE 10: TURN ON THE MODULE BY USING DRIVING CIRCUIT ........................................................... 44 FIGURE 11: TURN ON THE MODULE BY USING KEYSTROKE ................................................................... 45 FIGURE 12: POWER-ON SCENARIO OF MODULE ....................................................................................... 45 FIGURE 13: POWER-OFF SCENARIO OF MODULE ...................................................................................... 46 FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 47 FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 48 FIGURE 16: RESET SCENARIO OF MODULE ................................................................................................ 48 FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR

................................................................................................................................................................... 49 FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR 50 FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 51 FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 54 FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 54 FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 55 FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 56 FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ................................... 57 FIGURE 25: REFERENCE CIRCUIT OF SD CARD INTERFACE ................................................................... 58 FIGURE 26: REFERENCE CIRCUIT OF THE NETWORK INDICATOR ......................................................... 61 FIGURE 27: REFERENCE CIRCUITS OF STATUS ........................................................................................ 61 FIGURE 28: SIMPLIFIED BLOCK DIAGRAM FOR ETHERNET APPLICATION ............................................. 63 FIGURE 29: REFERENCE CIRCUIT OF SGMII INTERFACE WITH PHY AR8033 APPLICATION ................ 64 FIGURE 30: REFERENCE CIRCUIT OF WIRELESS CONNECTIVITY INTERFACES WITH FC20 MODULE

................................................................................................................................................................... 66 FIGURE 31: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 68 FIGURE 32: TIMING SEQUENCE FOR ENTERING INTO EMERGENCY DOWNLOAD MODE .................... 68 FIGURE 33: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................ 74 FIGURE 34: MICROSTRIP DESIGN ON A 2-LAYER PCB .............................................................................. 75 FIGURE 35: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB .......................................................... 75 FIGURE 36: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)

................................................................................................................................................................... 75 FIGURE 37: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)

................................................................................................................................................................... 76 EC25_Hardware_Design 10 / 112 LTE Standard Module Series EC25 Hardware Design FIGURE 38: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 77 FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 79 FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 79 FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) .......................................................... 80 FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ............... 109 FIGURE 43: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS PCB)

................................................................................................................................................................. 110 FIGURE 44: MODULE TOP AND SIDE DIMENSIONS .................................................................................. 111 FIGURE 45: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ............................................................... 112 FIGURE 46: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ 113 FIGURE 47: TOP VIEW OF THE MODULE .................................................................................................... 114 FIGURE 48: BOTTOM VIEW OF THE MODULE ............................................................................................ 114 FIGURE 49: REFLOW SOLDERING THERMAL PROFILE ............................................................................ 116 FIGURE 50: TAPE AND REEL SPECIFICATIONS ........................................................................................ 118 EC25_Hardware_Design 11 / 112 LTE Standard Module Series EC25 Hardware Design 1 Introduction This document defines the EC25 module and describes its air interface and hardware interfaces which are connected with customers applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC25 module. To facilitate its application in different fields, relevant reference design is also provided for customers reference. Associated with application note and user guide, customers can use EC25 module to design and set up mobile applications easily. EC25_Hardware_Design 12 / 112 LTE Standard Module Series EC25 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. EC25_Hardware_Design 13 / 112 LTE Standard Module Series EC25 Hardware Design 1.2. FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR201907EC25MX. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

WCDMA Band2:9.000dBi WCDMA Band4:6.000dBi WCDMA Band5:10.416dBi LTE Band2:10.000dBi LTE Band5:11.255dBi LTE Band4/7/66:7.000dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. EC25_Hardware_Design 14 / 112 LTE Standard Module Series EC25 Hardware Design For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR201907EC25MX or Contains FCC ID: XMR201907EC25MX must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by EC25_Hardware_Design 15 / 112 LTE Standard Module Series EC25 Hardware Design this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements FCC RF Exposure Requirements This device complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter and must be installed to provide a separation distance of at least 20cm from all persons. FCC Regulations This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. EC25_Hardware_Design 16 / 112 LTE Standard Module Series EC25 Hardware Design 2 Product Concept 2.1. General Description EC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides GNSS1) and voice functionality2) for customers specific applications. EC25 contains 12 variants: EC25-E, EC25-A, EC25-V, EC25-J, EC25-AU, EC25-AUT, EC25-AF, EC25-EU, EC25-EC, EC25-EUX3), EC25-AUTL and EC25-MX3). Customers can choose a dedicated type based on the region or operator. The following table shows the frequency bands of EC25 series module. Table 1: Frequency Bands of EC25 Series Module Modules2) LTE Bands WCDMA Bands GSM Bands Rx-

diversity GNSS1) EC25-E FDD: B1/B3/B5/B7/B8/B20 TDD: B38/B40/B41 B1/B5/B8 900/1800MHz EC25-A FDD: B2/B4/B12 B2/B4/B5 EC25-V FDD: B4/B13 N N N EC25-J EC25-AU4) FDD: B1/B3/B8/B18/B19/

B26 TDD: B41 FDD: B1/B2/B3/B4/B5/B7/

TDD: B40 B8/B28 B1/B6/B8/B19 N B1/B2/B5/B8 850/900/

1800/1900MHz EC25-AUT FDD: B1/B3//B5/B7/B28 B1/B5 N N B2/B4/B5 Y Y Y Y Y Y Y GPS, GLONASS, BeiDou/

Compass, Galileo, QZSS EC25-AF EC25-EU FDD: B2/B4//B5/B12/B13/

B14/B66/B71 FDD: B1/B3/B7/B8/B20/

B28A TDD: B38/B40/B41 B1/B8 900/1800MHz Y EC25_Hardware_Design 17 / 112 LTE Standard Module Series EC25 Hardware Design EC25-EC EC25-EUX FDD: B1/B3/B7/B8/B20/

B28A FDD: B1/B3/B7/B8/B20/

B28A TDD: B38/B40/B41 B1/B8 900/1800MHz Y B1/B8 900/1800MHz Y EC25-AUTL FDD: B3/B7/B28 N FDD: B2/B4//B5/B7/B28/

B66 B2/B4/B5 EC25-MX NOTES N N Y Y N N 1. 2. 1) GNSS function is optional. 2) EC25 series module contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. 3) EC25-EUX and EC25-MX are based on ThreadX OS. 4) B2 band on EC25-AU module does not support Rx-diversity. 3. 4. 5. Y = Supported. N = Not supported. With a compact profile of 29.0mm 32.0mm 2.4mm, EC25 can meet almost all requirements for M2M applications such as automotive, metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EC25 is an SMD type module which can be embedded into applications through its 144-pin pads, including 80 LCC signal pads and 64 LGA pads. 2.2. Key Features The following table describes the detailed features of EC25 module. Table 2: Key Features of EC25 Module Features Details Power Supply Transmitting Power Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V Class 4 (33dBm2dB) for GSM850 Class 4 (33dBm2dB) for EGSM900 Class 1 (30dBm2dB) for DCS1800 Class 1 (30dBm2dB) for PCS1900 Class E2 (27dBm3dB) for GSM850 8-PSK EC25_Hardware_Design 18 / 112 LTE Standard Module Series EC25 Hardware Design Class E2 (27dBm3dB) for EGSM900 8-PSK Class E2 (26dBm3dB) for DCS1800 8-PSK Class E2 (26dBm3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm2dB) for LTE-FDD bands Class 3 (23dBm2dB) for LTE-TDD bands Support up to non-CA Cat 4 FDD and TDD Support 1.4MHz~20MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max 150Mbps (DL)/Max 50Mbps (UL) LTE-TDD: Max 130Mbps (DL)/Max 30Mbps (UL) Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL) GPRS:

Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL)/Max 85.6Kbps (UL) EDGE:

Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL)/Max 236.8Kbps (UL) Support TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/NITZ/CMUX*/HTTPS*/

SMTP/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connections Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default LTE Features UMTS Features GSM Features Internet Protocol Features SMS

(U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V Audio Features Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression EC25_Hardware_Design 19 / 112 LTE Standard Module Series EC25 Hardware Design Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE 5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc. Main UART:

Used for AT command communication and data transmission Baud rates reach up to 921600bps, 115200bps by default Support RTS and CTS hardware flow control Debug UART:

Used for Linux console and log output 115200bps baud rate PCM Interface USB Interface UART Interfaces SD Card Interface Support SD 3.0 protocol SGMII Interface Wireless Connectivity Interfaces Support 10M/100M/1000M Ethernet work mode Support maximum 150Mbps (DL)/50Mbps (UL) for 4G network Support a low-power SDIO 3.0 interface for WLAN and UART/PCM interface for Bluetooth*

Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Network Indication Antenna Interfaces Physical Characteristics Temperature Range Gen8C Lite of Qualcomm Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Two pins including NET_MODE and NET_STATUS to indicate network connectivity status Including main antenna interface (ANT_MAIN), Rx-diversity antenna interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS) Size: (29.00.15)mm (32.00.15)mm (2.40.2)mm Weight: approx. 4.9g Operation temperature range: -35C ~ +75C1) Extended temperature range: -40C ~ +85C2) Storage temperature range: -40C~ +90C Firmware Upgrade USB interface or DFOTA*

RoHS All hardware components are fully compliant with EU RoHS directive EC25_Hardware_Design 20 / 112 LTE Standard Module Series EC25 Hardware Design NOTES 1. 1) Within operation temperature range, the module is 3GPP compliant. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again. 3. * means under development. 2.3. Functional Diagram The following figure shows a block diagram of EC25 and illustrates the major functional parts. Power management Baseband DDR+NAND flash Radio frequency Peripheral interfaces EC25_Hardware_Design 21 / 112 LTE Standard Module Series EC25 Hardware Design ANT_MAIN ANT_GNSS ANT_DIV PAM SAW Switch SAW Duplex LNA APT PA Tx PRx SAW DRx Transceiver NAND DDR2 SDRAM IQ Control Baseband PMIC Control 19.2M XO VBAT_RF VBAT_BB PWRKEY RESET_N ADCs STATUS VDD_EXT USB (U)SIM PCM I2C UARTs SGMII WLAN BT*

GPIOs SD Figure 1: Functional Diagram NOTE

* means under development. 2.4. Evaluation Board In order to help customers develop applications with EC25, Quectel supplies an evaluation board (EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module. EC25_Hardware_Design 22 / 112 LTE Standard Module Series EC25 Hardware Design 3 Application Interfaces

(U)SIM interface 3.1. General Description EC25 is equipped with 80 LCC pads plus 64 LGA pads that can be connected to cellular application platform. Sub-interfaces included in these pads are described in detail in the following chapters:

Power supply USB interface UART interfaces PCM and I2C interfaces SD card interface ADC interfaces Status indication SGMII interface Wireless connectivity interfaces USB_BOOT interface EC25_Hardware_Design 23 / 112 LTE Standard Module Series EC25 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC25 module. Figure 2: Pin Assignment (Top View) NOTES 1) means that these pins cannot be pulled up before startup. 2) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. 3) means these interface functions are only supported on Telematics version. 1. 2. 3. 4. Pads 37~40, 118, 127 and 129~139 are used for wireless connectivity interfaces, among which pads 118, 127 and 129~138 are WLAN function pins, and others are Bluetooth (BT) function pins. BT function is under development. 5. Pads 119~126 and 128 are used for SGMII interface. EC25_Hardware_Design 24 / 112 LTE Standard Module Series EC25 Hardware Design 6. Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on the BT module. 7. Keep all RESERVED pins and unused pins unconnected. 8. GND pads 85~112 should be connected to ground in the design. RESERVED pads 73~84 should not be designed in schematic and PCB decal, and these pins should be served as a keepout area.

* means under development. 9. 3.3. Pin Description The following tables show the pin definition of EC25 module. Table 3: I/O Parameters Definition Type AI AO DI DO IO OD PI PO Description Analog input Analog output Digital input Digital output Bidirectional Open drain Power input Power output Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 59, 60 VBAT_RF 57, 58 PI PI Power supply for modules baseband part Power supply for modules RF part Vmax=4.3V Vmin=3.3V Vnorm=3.8V Vmax=4.3V Vmin=3.3V It must be able to provide sufficient current up to 0.8A. It must be able to provide sufficient EC25_Hardware_Design 25 / 112 LTE Standard Module Series EC25 Hardware Design Vnorm=3.8V VDD_EXT 7 PO Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA current up to 1.8A in a burst transmission. Power supply for external GPIOs pull-up circuits. If unused, keep it open. 8, 9, 19, 22, 36, 46, 48, 50~54, 56, 72, 85~112 GND Turn on/off Ground Pin Name Pin No. I/O Description DC Characteristics Comment DI DI Turn on/off the module VH=0.8V Reset signal of the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. If unused, keep it open. PWRKEY 21 RESET_N 20 Status Indication Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 61 OD Indicate the module operating status The drive current should be less than 0.9mA. NET_MODE 5 DO NET_ STATUS 6 DO USB Interface Indicate the modules network registration mode Indicate the modules network activity status VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V An external pull-up resistor is required. If unused, keep it open. 1.8V power domain. It cannot be pulled up before startup. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 71 PI USB power supply, used for USB detection Vmax=5.25V Vmin=3.0V Vnorm=5.0V Typical: 5.0V If unused, keep it open. EC25_Hardware_Design 26 / 112 LTE Standard Module Series EC25 Hardware Design USB_DP 69 IO USB differential data bus (+) USB_DM 70 IO USB differential data bus (-)

(U)SIM Interface Compliant with USB 2.0 standard specification. Compliant with USB 2.0 standard specification. Require differential impedance of 90. If unused, keep it open. Require differential impedance of 90. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USIM_GND 10 Specified ground for

(U)SIM card USIM_ PRESENCE 13 DI

(U)SIM card insertion detection USIM_VDD 14 PO Power supply for

(U)SIM card USIM_DATA 15 IO Data signal of

(U)SIM card USIM_CLK 16 DO Clock signal of

(U)SIM card VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V For 1.8V(U)SIM:

Vmax=1.9V Vmin=1.7V For 3.0V(U)SIM:

Vmax=3.05V Vmin=2.7V IOmax=50mA For 1.8V (U)SIM:

VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:

VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VOLmax=0.45V 1.8V power domain. If unused, keep it open. Either 1.8V or 3.0V is supported by the module automatically. EC25_Hardware_Design 27 / 112 LTE Standard Module Series EC25 Hardware Design USIM_RST 17 DO Reset signal of

(U)SIM card VOHmin=2.55V For 1.8V (U)SIM:

VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VOLmax=0.45V VOHmin=2.55V Main UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment RI DCD CTS 62 63 64 DO Ring indicator DO Data carrier detection DO Clear to send RTS 65 DI Request to send DTR 66 DI Data terminal ready, sleep mode control TXD 67 DO Transmit data RXD 68 DI Receive data Debug UART Interface VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Pulled up by default. Low level wakes up the module. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD 12 DO Transmit data VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it EC25_Hardware_Design 28 / 112 LTE Standard Module Series EC25 Hardware Design DBG_RXD 11 DI Receive data ADC Interfaces VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment ADC0 ADC1 45 44 PCM Interface AI AI General purpose analog to digital converter General purpose analog to digital converter Voltage range:

0.3V to VBAT_BB If unused, keep it open. Voltage range:

0.3V to VBAT_BB If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment PCM_IN 24 DI PCM data input PCM_OUT 25 DO PCM data output PCM_SYNC 26 IO PCM data frame synchronization signal PCM_CLK 27 IO PCM clock VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment EC25_Hardware_Design 29 / 112 LTE Standard Module Series EC25 Hardware Design I2C_SCL 41 OD I2C_SDA 42 OD SD Card Interface I2C serial clock. Used for external codec. I2C serial data. Used for external codec. An external pull-up resistor is required. 1.8V only. If unused, keep it open. An external pull-up resistor is required. 1.8V only. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling:

VOLmax=0.45V SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDC2_ DATA3 28 IO SD card SDIO bus DATA3 SDC2_ DATA2 29 IO SD card SDIO bus DATA2 SDC2_ DATA1 30 IO SD card SDIO bus DATA1 EC25_Hardware_Design 30 / 112 LTE Standard Module Series EC25 Hardware Design VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDC2_ DATA0 31 IO SD card SDIO bus DATA0 SDC2_CLK 32 DO SD card SDIO bus clock SDC2_CMD 33 IO SD card SDIO bus command EC25_Hardware_Design 31 / 112 LTE Standard Module Series EC25 Hardware Design 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V SD_INS_ DET 23 DI SD card insertion detect VDD_SDIO 34 PO SD card SDIO bus pull-up power IOmax=50mA 1.8V power domain. If unused, keep it open. 1.8V/2.85V configurable. Cannot be used for SD card power. If unused, keep it open. SGMII Interface Pin Name Pin No. I/O Description DC Characteristics Comment EPHY_RST_ N 119 DO Ethernet PHY reset EPHY_INT_N 120 DI Ethernet PHY interrupt SGMII_ MDATA 121 IO SGMII MDIO

(Management Data Input/Output) data For 1.8V:

VOLmax=0.45V VOHmin=1.4V For 2.85V:

VOLmax=0.35V VOHmin=2.14V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V For 1.8V:

VOLmax=0.45V VOHmin=1.4V VILmax=0.58V VIHmin=1.27V For 2.85V:

VOLmax=0.35V VOHmin=2.14V VILmax=0.71V VIHmin=1.78V 1.8V/2.85V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V/2.85V power domain. If unused, keep it open. EC25_Hardware_Design 32 / 112 LTE Standard Module Series EC25 Hardware Design SGMII_ MCLK 122 DO SGMII MDIO

(Management Data Input/Output) clock For 1.8V:

VOLmax=0.45V VOHmin=1.4V For 2.85V:

VOLmax=0.35V VOHmin=2.14V USIM2_VDD 128 PO SGMII MDIO pull-up power source SGMII_TX_M 123 AO SGMII transmission

- minus SGMII_TX_P 124 AO SGMII transmission

- plus SGMII_RX_P 125 AI SGMII receiving

- plus SGMII_RX_M 126 AI SGMII receiving

- minus Wireless Connectivity Interfaces 1.8V/2.85V power domain. If unused, keep it open. for Configurable power source. 1.8V/2.85V power domain. External pull-up SGMII MDIO pins. If unused, keep it open. Connect with a 0.1uF capacitor, close to the PHY side. If unused, keep it open. Connect with a 0.1uF capacitor, close to the PHY side. If unused, keep it open. Connect with a 0.1uF capacitor, close to EC25 module. If unused, keep it open. Connect with a 0.1uF capacitor, close to EC25 module. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment SDC1_ DATA3 129 IO WLAN SDIO data bus D3 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V 1.8V power domain. If unused, keep it open. EC25_Hardware_Design 33 / 112 LTE Standard Module Series EC25 Hardware Design SDC1_ DATA2 130 IO WLAN SDIO data bus D2 SDC1_ DATA1 131 IO WLAN SDIO data bus D1 SDC1_ DATA0 132 IO WLAN SDIO data bus D0 SDC1_CLK 133 DO WLAN SDIO bus clock VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V SDC1_CMD 134 DO WLAN SDIO bus command VOLmax=0.45V VOHmin=1.35V PM_ENABLE 127 DO WLAN power control WAKE_ON_ WIRELESS 135 DI Wake up the host

(EC25 module) by FC20 module VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V WLAN_EN 136 DO WLAN function control via FC20 module VOLmax=0.45V VOHmin=1.35V COEX_UART _RX 137 DI LTE/WLAN&BT coexistence signal VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Active low. If unused, keep it open. 1.8V power domain. Active high. Cannot be pulled up before startup. If unused, keep it open. 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. EC25_Hardware_Design 34 / 112 LTE Standard Module Series EC25 Hardware Design COEX_UART _TX 138 DO LTE/WLAN&BT coexistence signal VOLmax=0.45V VOHmin=1.35V WLAN_SLP_ CLK 118 DO WLAN sleep clock BT_RTS*

37 DI BT UART request to send VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V BT_TXD*

38 DO BT UART transmit data VOLmax=0.45V VOHmin=1.35V BT_RXD*

39 DI BT UART receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V BT_CTS*

40 DO BT UART clear to send VOLmax=0.45V VOHmin=1.35V BT_EN*

139 DO BT function control via FC20 module VOLmax=0.45V VOHmin=1.35V RF Interface 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment ANT_DIV 35 AI Diversity antenna pad 50 impedance If unused, keep it open. ANT_MAIN 49 IO Main antenna pad 50 impedance ANT_GNSS 47 AI GNSS antenna pad 50 impedance If unused, keep it open. GPIO Pins Pin Name Pin No. I/O Description DC Characteristics Comment WAKEUP_IN 1 DI Sleep mode control VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. Low level wakes up EC25_Hardware_Design 35 / 112 LTE Standard Module Series EC25 Hardware Design W_DISABLE# 4 DI Airplane mode control AP_READY 2 DI USB_BOOT Interface Application processor sleep state detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V the module. If unused, keep it open. 1.8V power domain. Pull-up by default. At low voltage level, module can enter into airplane mode. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment Force the module to enter into emergency download mode VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. It is recommended to reserve test point. USB_BOOT 115 DI RESERVED Pins Pin Name Pin No. I/O Description DC Characteristics Comment 3, 18, 43, 55, 73~84, 113, 114, 116, 117, 140-144. RESERVED NOTES Reserved Keep these pins unconnected. 1. * means under development. 2. Pads 24~27 are multiplexing pins used for audio design on the EC25 module and BT function on the BT module. EC25_Hardware_Design 36 / 112 LTE Standard Module Series EC25 Hardware Design 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Details Idle Talk/Data Software is active. The module has registered on the network, and it is ready to send and receive data. Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. In this mode, the power management unit shuts down the power supply. Software is not active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. Normal Operation Minimum Functionality Mode Airplane Mode Sleep Mode Power Down Mode 3.5. Power Saving 3.5.1. Sleep Mode EC25 is able to reduce its current consumption to a minimum value during the sleep mode. The following section describes power saving procedures of EC25 module. 3.5.1.1. UART Application If the host communicates with module via UART interface, the following preconditions can let the module enter into sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Drive DTR to high level. EC25_Hardware_Design 37 / 112 LTE Standard Module Series EC25 Hardware Design The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module. When EC25 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.17 for details about RI behaviors. AP_READY will detect the sleep state of the host (can be configured to high level or low level detection). Please refer to AT+QCFG="apready"* command for details. NOTE

* means under development. 3.5.1.2. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to let the module enter into sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters into suspended state. EC25_Hardware_Design 38 / 112 LTE Standard Module Series EC25 Hardware Design The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application with USB Remote Wakeup Sending data to EC25 through USB will wake up the module. When EC25 has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter into sleep mode. Execute AT+QSCLK=1 command to enable the sleep mode. Ensure the DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters into suspended state. The following figure shows the connection between the module and the host. Figure 5: Sleep Mode Application with RI EC25_Hardware_Design 39 / 112 LTE Standard Module Series EC25 Hardware Design Sending data to EC25 through USB will wake up the module. When EC25 has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected via an additional control circuit to let the module enter into sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. Disconnect USB_VBUS. The following figure shows the connection between the module and the host. Figure 6: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and the host. For more details about EC25 power management application, please refer to document [1]. 3.5.2. Airplane Mode When the module enters into airplane mode, the RF function does not work, and all AT commands correlative with RF function will be inaccessible. This mode can be set via the following ways. EC25_Hardware_Design 40 / 112 LTE Standard Module Series EC25 Hardware Design Hardware:

The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter into airplane mode. Software:

AT+CFUN command provides the choice of the functionality level through setting <fun> into 0, 1 or 4. AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled. AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode. RF function is disabled. NOTES 1. The W_DISABLE# control function is disabled in firmware by default. It can be enabled by AT+QCFG="airplanecontrol" command, and this command is under development. 2. The execution of AT+CFUN command will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EC25 provides four VBAT pins for connection with the external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for modules RF part Two VBAT_BB pins for modules baseband part The following table shows the details of VBAT pins and ground pins. Table 6: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 57, 58 VBAT_BB 59, 60 GND 8, 9, 19, 22, 36, 46, 48, 50~54, 56, 72, 85~112 Power supply for modules RF part Power supply for modules baseband part 3.3 3.3 3.8 3.8 4.3 4.3 Ground

-

0

-

V V V EC25_Hardware_Design 41 / 112 LTE Standard Module Series EC25 Hardware Design 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100F with low ESR (ESR=0.7) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm; and the width of VBAT_RF trace should be no less than 2mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to avoid the damage caused by electric surge and ESD, it is suggested that a TVS diode with suggested low reverse stand-off voltage VRWM 4.5V, low clamping voltage VC and high reverse peak pulse current IPP should be used. The following figure shows the star structure of the power supply. VBAT D1 WS4.5D3HV

+

C1 100uF C2 100nF C3 33pF C4 10pF

+

C5 100uF C6 100nF C7 33pF C8 10pF VBAT_RF VBAT_BB Module Figure 8: Star Structure of the Power Supply EC25_Hardware_Design 42 / 112 LTE Standard Module Series EC25 Hardware Design 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5V input power source. The typical output of the power supply is about 3.8V and the maximum load current is 3A. Figure 9: Reference Circuit of Power Supply NOTE In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 3.6.4. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. EC25_Hardware_Design 43 / 112 LTE Standard Module Series EC25 Hardware Design 3.7. Power-on and off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name Pin No. I/O Description Comment PWRKEY 21 DI Turn on/off the module The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When EC25 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms. It is recommended to use an open drain/collector driver to control the PWRKEY. After STATUS pin (require external pull-up) outputs a low level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. 500ms Turn-on pulse 4.7K PWRKEY 10nF 47K Figure 10: Turn on the Module by Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. EC25_Hardware_Design 44 / 112 LTE Standard Module Series EC25 Hardware Design Figure 11: Turn on the Module by Using Keystroke The power-on scenario is illustrated in the following figure. NOTE VBAT PWRKEY VDD_EXT BOOT_CONFIG &

USB_BOOT PINS RESET_N STATUS

(OD) UART USB 500ms VH=0.8V VIL0.5V About 100ms 100ms, after this time, the BOOT_CONFIG pins can be set high level by external circuit 2.5s 12s 13s Inactive Inactive Active Active Figure 12: Power-on Scenario of Module EC25_Hardware_Design 45 / 112 LTE Standard Module Series EC25 Hardware Design NOTE Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them should be no less than 30ms. 3.7.2. Turn off Module The following procedures can be used to turn off the module:

Normal power-off procedure: Turn off the module using the PWRKEY pin. Normal power-off procedure: Turn off the module using AT+QPOWD command. 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-off procedure after the PWRKEY is released. The power-off scenario is illustrated in the following figure. VBAT PWRKEY STATUS

(OD) Module Status 650ms 29.5s RUNNING Power-off procedure OFF Figure 13: Power-off Scenario of Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer to document [2] for details about AT+QPOWD command. EC25_Hardware_Design 46 / 112 LTE Standard Module Series EC25 Hardware Design NOTES 1. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 2. When turning off module with AT command, please keep PWRKEY at high level after the execution of power-off command. Otherwise the module will be turned on again after successfully turn-off. 3.8. Reset Module The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N to a low level voltage for time between 150ms and 460ms. Table 8: Pin Definition of RESET_N Pin Name Pin No. RESET_N 20 I/O DI Description Comment Reset the module 1.8V power domain The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 14: Reference Circuit of RESET_N by Using Driving Circuit EC25_Hardware_Design 47 / 112 LTE Standard Module Series EC25 Hardware Design Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure. Figure 16: Reset Scenario of Module NOTES 1. Use RESET_N only when failed to turn off the module by AT+QPOWD command and PWRKEY pin. 2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The(U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. EC25_Hardware_Design 48 / 112 LTE Standard Module Series EC25 Hardware Design Table 9: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Description Comment USIM_VDD 14 PO Power supply for (U)SIM card USIM_DATA 15 USIM_CLK USIM_RST USIM_ PRESENCE USIM_GND 16 17 13 10 IO DO DO Data signal of (U)SIM card Clock signal of (U)SIM card Reset signal of (U)SIM card DI

(U)SIM card insertion detection Specified ground for (U)SIM card Either 1.8V or 3.0V is supported by the module automatically. 1.8V power domain. If unused, keep it open. EC25 supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections, and is disabled by default. Please refer to document [2] for more details about AT+QSIMDET command. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. EC25_Hardware_Design 49 / 112 LTE Standard Module Series EC25 Hardware Design Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers applications, please follow the criteria below in (U)SIM circuit design:

Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. Assure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential. Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as close to (U)SIM card connector as possible. If the ground is complete on customers PCB, USIM_GND can be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should not be more than 15pF. The 0 resistors should be added in series between the module and the (U)SIM card to facilitate debugging. The 33pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the

(U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 3.10. USB Interface EC25 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface is EC25_Hardware_Design 50 / 112 LTE Standard Module Series EC25 Hardware Design used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface. Table 10: Pin Description of USB Interface Pin Name Pin No. I/O Description USB_DP USB_DM 69 70 USB_VBUS 71 GND 72 IO IO PI USB differential data bus (+) USB differential data bus (-) USB power supply, used for USB detection Ground Comment Require differential impedance of 90 Require differential impedance of 90 Typical 5.0V For more details about the USB 2.0 specifications, please visit http://www.usb.org/home. The USB interface is recommended to be reserved for firmware upgrade in customers designs. The following figure shows a reference circuit of USB interface. Figure 19: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. EC25_Hardware_Design 51 / 112 LTE Standard Module Series EC25 Hardware Design The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2pF. Keep the ESD protection components to the USB connector as close as possible. NOTES 1. EC25 module can only be used as a slave device. 2.

* means under development. 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. The main UART interface supports 4800bps, 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps and 921600bps baud rates, and the default is 115200bps. The interface is used for data transmission and AT command communication. The debug UART interface supports 115200bps baud rate. It is used for Linux console and log output. The following tables show the pin definition of the UART interfaces. Table 11: Pin Definition of Main UART Interface Pin Name Pin No. RI DCD CTS RTS 62 63 64 65 I/O DO DO DO DI Description Ring indicator Data carrier detection Clear to send Request to send Comment 1.8V power domain EC25_Hardware_Design 52 / 112 LTE Standard Module Series EC25 Hardware Design 66 67 68 DI DO DI Data terminal ready, sleep mode control Transmit data Receive data DTR TXD RXD Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. DBG_TXD DBG_RXD 12 11 I/O DO DI Description Transmit data Receive data The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O Comment 1.8V power domain Parameter VIL VIH VOL VOH Min.

-0.3 1.2 0 1.35 Max. 0.6 2.0 0.45 1.8 Unit V V V V The module provides 1.8V UART interface. A level translator should be used if customers application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. EC25_Hardware_Design 53 / 112 LTE Standard Module Series EC25 Hardware Design VDD_EXT 0.1uF 1 0 K 120K RI DCD CTS RTS DTR TXD RXD 51K VCCA VCCB 0.1uF VDD_MCU OE A1 A2 A3 A4 A5 A6 A7 A8 Translator GND B1 B2 B3 B4 B5 B6 B7 B8 51K RI_MCU DCD_MCU CTS_MCU RTS_MCU DTR_MCU TXD_MCU RXD_MCU Figure 20: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. The circuit design of dotted line section can refer to the design of solid line section, in terms of both modules input and output circuit designs, but please pay attention to the direction of connection. Figure 21: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. EC25_Hardware_Design 54 / 112 LTE Standard Module Series EC25 Hardware Design 3.12. PCM and I2C Interfaces EC25 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface:

Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK at 8KHz PCM_SYNC, and also supports 4096KHz PCM_CLK at 16KHz PCM_SYNC. In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK and an 8KHz, 50% duty cycle PCM_SYNC. EC25 supports 16-bit linear data format. The following figures show the primary modes timing relationship with 8KHz PCM_SYNC and 2048KHz PCM_CLK, as well as the auxiliary modes timing relationship with 8KHz PCM_SYNC and 256KHz PCM_CLK. Figure 22: Primary Mode Timing EC25_Hardware_Design 55 / 112 LTE Standard Module Series EC25 Hardware Design Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN PCM_OUT PCM_SYNC PCM_CLK I2C_SCL I2C_SDA 24 25 26 27 41 42 DI DO IO IO OD OD PCM data input 1.8V power domain PCM data output 1.8V power domain PCM data frame synchronization signal 1.8V power domain PCM data bit clock 1.8V power domain I2C serial clock Require external pull-up to 1.8V I2C serial data Require external pull-up to 1.8V Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC. Please refer to document [2] for more details about AT+QDAI command. The following figure shows a reference design of PCM interface with external codec IC. EC25_Hardware_Design 56 / 112 LTE Standard Module Series EC25 Hardware Design Figure 24: Reference Circuit of PCM Application with Audio Codec NOTES 1. It is recommended to reserve an RC (R=22, C=22pF) circuits on the PCM lines, especially for PCM_CLK. 2. EC25 works as a master device pertaining to I2C interface. 3.13. SD Card Interface EC25 supports SDIO 3.0 interface for SD card. The following table shows the pin definition of SD card interface. Table 15: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SDC2_DATA3 SDC2_DATA2 SDC2_DATA1 SDC2_DATA0 SDC2_CLK 28 29 30 31 32 IO IO IO IO SD card SDIO bus DATA3 SD card SDIO bus DATA2 SD card SDIO bus DATA1 SD card SDIO bus DATA0 DO SD card SDIO bus clock SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. EC25_Hardware_Design 57 / 112 LTE Standard Module Series EC25 Hardware Design SDC2_CMD 33 IO SD card SDIO bus command VDD_SDIO 34 PO SD card SDIO bus pull up power SD_INS_DET 23 DI SD card insertion detection The following figure shows a reference design of SD card. 1.8V/2.85V configurable. Cannot be used for SD card power. If unused, keep it open. 1.8V power domain. If unused, keep it open. Figure 25: Reference Circuit of SD Card Interface In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with:

SD_INS_DET must be connected. The voltage range of SD card power supply VDD_3V is 2.7V~3.6V and a sufficient current up to 0.8A should be provided. As the maximum output current of VDD_SDIO is 50mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card. To avoid jitter of bus, resistors R7~R11 are needed to pull up the SDIO to VDD_SDIO. Value of these resistors is among 10K~100K and the recommended value is 100K. VDD_SDIO should be used as the pull-up power. In order to adjust signal quality, it is recommended to add 0 resistors R1~R6 in series between the module and the SD card. The bypass capacitors C1~C6 are reserved and not mounted by default. All resistors and bypass capacitors should be placed close to the module. In order to offer good ESD protection, it is recommended to add a TVS diode on SD card pins near the SD card connector with junction capacitance less than 15pF. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DCDC signals, etc. EC25_Hardware_Design 58 / 112 LTE Standard Module Series EC25 Hardware Design It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data trace is 50 (10%). Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of SDIO bus should be less than 15pF. It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1mm and the total routing length less than 50mm. The total trace length inside the module is 27mm, so the exterior total trace length should be less than 23mm. 3.14. ADC Interfaces The module provides two analog-to-digital converter (ADC) interfaces. AT+QADC=0 command can be used to read the voltage value on ADC0 pin. AT+QADC=1 command can be used to read the voltage value on ADC1 pin. For more details about these AT commands, please refer to document [2]. In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground. Table 16: Pin Definition of ADC Interfaces Pin Name Pin No. Description ADC0 ADC1 45 44 General purpose analog to digital converter General purpose analog to digital converter The following table describes the characteristic of ADC function. Table 17: Characteristic of ADC Parameter ADC0 Voltage Range ADC1 Voltage Range ADC Resolution NOTES Min. 0.3 0.3 Typ. Max. 15 VBAT_BB VBAT_BB Unit V V bits 1. ADC input voltage must not exceed VBAT_BB. 2. It is prohibited to supply any voltage to ADC pins when VBAT is removed. EC25_Hardware_Design 59 / 112 LTE Standard Module Series EC25 Hardware Design 3. It is recommended to use a resistor divider circuit for ADC application. 3.15. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two pins which are NET_MODE and NET_STATUS. The following tables describe the pin definition and logic level changes in different network status. Table 18: Pin Definition of Network Connection Status/Activity Indicator Pin Name Pin No. I/O Description NET_MODE 5 NET_STATUS 6 DO DO Indicate the modules network registration mode Indicate the modules network activity status Table 19: Working State of Network Connection Status/Activity Indicator Comment 1.8V power domain Cannot be pulled up before startup 1.8V power domain Pin Name Logic Level Changes Network Status NET_MODE Always High Always Low Registered on LTE network Others NET_STATUS Flicker slowly (200ms High/1800ms Low) Network searching Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure. EC25_Hardware_Design 60 / 112 LTE Standard Module Series EC25 Hardware Design Figure 26: Reference Circuit of the Network Indicator 3.16. STATUS The STATUS pin is an open drain output for indicating the modules operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 20: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 61 OD Indicate the modules operation status An external pull-up resistor is required. If unused, keep it open. The following figure shows different circuit designs of STATUS, and customers can choose either one according to customers application demands. Figure 27: Reference Circuits of STATUS EC25_Hardware_Design 61 / 112 LTE Standard Module Series EC25 Hardware Design 3.17. Behaviors of RI AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. No matter on which port a URC is presented, the URC will trigger the behavior of RI pin. NOTE URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. In addition, RI behavior can be configured flexibly. The default behavior of the RI is shown as below. Table 21: Behaviors of RI State Idle URC Response RI keeps at high level RI outputs 120ms low pulse when a new URC returns The RI behavior can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2]

for details. IEEE802.3 compliance 3.18. SGMII Interface EC25 includes an integrated Ethernet MAC with an SGMII interface and two management interfaces, and key features of the SGMII interface are shown below:

Support 10M/100M/1000M Ethernet work mode Support maximum 150Mbps (DL)/50Mbps (UL) for 4G network Support VLAN tagging Support IEEE1588 and Precision Time Protocol (PTP) Can be used to connect to external Ethernet PHY like AR8033, or to an external switch Management interfaces support dual voltage 1.8V/2.85V The following table shows the pin definition of SGMII interface. EC25_Hardware_Design 62 / 112 LTE Standard Module Series EC25 Hardware Design Table 22: Pin Definition of SGMII Interface Pin Name Pin No. I/O Description Comment Control Signal Part EPHY_RST_N 119 DO Ethernet PHY reset 1.8V/2.85V power domain EPHY_INT_N 120 SGMII_MDATA 121 DI IO SGMII_MCLK 122 DO Ethernet PHY interrupt SGMII MDIO (Management Data Input/Output) data SGMII MDIO (Management Data Input/Output) clock USIM2_VDD 128 PO SGMII MDIO pull-up power source SGMII Signal Part SGMII_TX_M 123 AO SGMII transmission-minus SGMII_TX_P 124 AO SGMII transmission-plus SGMII_RX_P 125 SGMII_RX_M 126 AI AI SGMII receiving-plus SGMII receiving-minus 1.8V power domain 1.8V/2.85V power domain 1.8V/2.85V power domain Configurable power source. 1.8V/2.85V power domain. External pull-up power source for SGMII MDIO pins. Connect with a 0.1uF capacitor, close to the PHY side. Connect with a 0.1uF capacitor, close to the PHY side. Connect with a 0.1uF capacitor, close to EC25 module. Connect with a 0.1uF capacitor, close to EC25 module. The following figure shows the simplified block diagram for Ethernet application. Figure 28: Simplified Block Diagram for Ethernet Application The following figure shows a reference design of SGMII interface with PHY AR8033 application. EC25_Hardware_Design 63 / 112 LTE Standard Module Series EC25 Hardware Design Figure 29: Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in customers applications, please follow the criteria below in the Ethernet PHY circuit design:

Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DCDC signals, etc. Keep the maximum trace length less than 10-inch and keep skew on the differential pairs less than 20mil. The differential impedance of SGMII data trace is 10010%, and the reference ground of the area should be complete. Make sure the trace spacing between SGMII RX and TX is at least 3 times of the trace width, and the same to the adjacent signal traces. 3.19. Wireless Connectivity Interfaces EC25 supports a low-power SDIO 3.0 interface for WLAN and a UART/PCM interface for BT. The following table shows the pin definition of wireless connectivity interfaces. EC25_Hardware_Design 64 / 112 LTE Standard Module Series EC25 Hardware Design Table 23: Pin Definition of Wireless Connectivity Interfaces Pin Name Pin No. I/O Description Comment WLAN Part SDC1_DATA3 SDC1_DATA2 SDC1_DATA1 SDC1_DATA0 SDC1_CLK SDC1_CMD 129 130 131 132 133 134 IO IO IO IO WLAN SDIO data bus D3 1.8V power domain WLAN SDIO data bus D2 1.8V power domain WLAN SDIO data bus D1 1.8V power domain WLAN SDIO data bus D0 1.8V power domain DO WLAN SDIO bus clock 1.8V power domain IO WLAN SDIO bus command 1.8V power domain WLAN_EN 136 DO WLAN function control via FC20 module. Coexistence and Control Part PM_ENABLE 127 DO WLAN power control WAKE_ON_ WIRELESS 135 DI Wake up the host (EC25 module) by FC20 module COEX_UART_RX 137 DI LTE/WLAN&BT coexistence signal COEX_UART_TX 138 DO LTE/WLAN&BT coexistence signal 1.8V power domain. Active high. Cannot be pulled up before startup. 1.8V power domain Active high. 1.8V power domain 1.8V power domain. Cannot be pulled up before startup. 1.8V power domain. Cannot be pulled up before startup. WLAN_SLP_CLK 118 DO WLAN sleep clock BT Part*

BT_RTS*

BT_TXD*

BT_RXD*

BT_CTS*

37 38 39 40 DI BT UART request to send 1.8V power domain DO BT UART transmit data 1.8V power domain DI BT UART receive data DO BT UART clear to send 1.8V power domain 1.8V power domain. Cannot be pulled up before startup. EC25_Hardware_Design 65 / 112 LTE Standard Module Series EC25 Hardware Design PCM_IN1) PCM_OUT1) PCM_SYNC1) PCM_CLK1) 24 25 26 27 BT_EN*

139 DO DI PCM data input DO PCM data output IO IO PCM data frame synchronization signal PCM data bit clock BT function control via FC20 module. 1.8V power domain 1.8V power domain 1.8V power domain 1.8V power domain 1.8V power domain Active high. The following figure shows a reference design of wireless connectivity interfaces with Quectel FC20 module. Module POWER PM_ENABLE DCDC/LDO VDD_EXT SDC1_DATA3 SDC1_DATA2 SDC1_DATA1 SDC1_DATA0 SDC1_CLK SDC1_CMD WLAN_EN WLAN WLAN_SLP_CLK WAKE_ON_WIRELESS COEX COEX_UART_RX COEX_UART_TX FC20 Module VDD_3V3 VIO SDIO_D3 SDIO_D2 SDIO_D1 SDIO_D0 SDIO_CLK SDIO_CMD WLAN_EN 32KHZ_IN WAKE_ON_WIRELESS LTE_UART_TXD LTE_UART_RXD Figure 30: Reference Circuit of Wireless Connectivity Interfaces with FC20 Module NOTES 1. FC20 module can only be used as a slave device. 2. When BT function is enabled on EC25 module, PCM_SYNC and PCM_CLK pins are only used to output signals. 3. For more information about wireless connectivity interfaces, please refer to document [5]. 4. 5.

* means under development. 1) Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on BT module. EC25_Hardware_Design 66 / 112 LTE Standard Module Series EC25 Hardware Design 3.19.1. WLAN Interface EC25 provides a low power SDIO 3.0 interface and control interface for WLAN design. SDIO interface supports the SDR mode (up to 50MHz). As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles:

It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 5010%. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DCDC signals, etc. It is recommended to keep matching length between CLK and DATA/CMD less than 1mm and total routing length less than 50mm. Keep termination resistors within 15~24 on clock lines near the module and keep the route distance from the module clock pins to termination resistors less than 5mm. Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than 15pF. 3.19.2. BT Interface*

EC25 supports a dedicated UART interface and a PCM interface for BT application. Further information about BT interface will be added in future version of this document. NOTE

* means under development. 3.20. USB_BOOT Interface EC25 provides a USB_BOOT pin. Customers can pull up USB_BOOT to VDD_EXT before powering on the module, thus the module will enter into emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface. EC25_Hardware_Design 67 / 112 LTE Standard Module Series EC25 Hardware Design Table 24: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description USB_BOOT 115 DI Force the module to enter into emergency download mode The following figure shows a reference circuit of USB_BOOT interface. Module Comment 1.8V power domain. Active high. It is recommended to reserve test point. USB_BOOT Test point 4.7K Close to test point TVS VDD_EXT Figure 31: Reference Circuit of USB_BOOT Interface NOTE VH=0.8V 500ms VIL0.5V About 100ms Setting USB_BOOT to high level between VBAT rising on and VDD_EXT rising on can let the module enter into emergency download mode. VBAT PWRKEY VDD_EXT USB_BOOT RESET_N Figure 32: Timing Sequence for Entering into Emergency Download Mode EC25_Hardware_Design 68 / 112 LTE Standard Module Series EC25 Hardware Design NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. 2. When using MCU to control module to enter into the forced download mode, follow the above timing sequence. It is not recommended to pull up USB_BOOT to 1.8V before powering up the VBAT. Short the test points as shown in Figure 31 can manually force the module to enter into download mode. EC25_Hardware_Design 69 / 112 LTE Standard Module Series EC25 Hardware Design 4 GNSS Receiver 4.1. General Description EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC25 GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows the GNSS performance of EC25. Table 25: GNSS Performance Parameter Description Cold start Conditions Autonomous Sensitivity

(GNSS) TTFF

(GNSS) Reacquisition Autonomous Tracking Cold start

@open sky Warm start

@open sky Autonomous Autonomous XTRA enabled Autonomous XTRA enabled Typ.

-146

-157

-157 35 18 26 2.2 Unit dBm dBm dBm s s s s EC25_Hardware_Design 70 / 112 LTE Standard Module Series EC25 Hardware Design Hot start

@open sky CEP-50 Autonomous XTRA enabled Autonomous

@open sky 2.5 1.8

<2.5 s s m Accuracy

(GNSS) NOTES 1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes position within 3 minutes after executing cold start command. 4.3. Layout Guidelines The following layout guidelines should be taken into account in customers designs. Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna. Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be kept away from the antennas. Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar isolation and protection. Keep 50 characteristic impedance for the ANT_GNSS trace. Please refer to Chapter 5 for GNSS antenna reference design and antenna installation information. EC25_Hardware_Design 71 / 112 LTE Standard Module Series EC25 Hardware Design 5 Antenna Interfaces EC25 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna ports have an impedance of 50. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 26: Pin Definition of RF Antennas Pin Name Pin No. ANT_MAIN ANT_DIV 49 35 I/O IO AI 5.1.2. Operating Frequency Table 27: Module Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 Transmit 824~849 880~915 1710~1785 1850~1910 1920~1980 Description Comment Main antenna pad Receive diversity antenna pad 50 impedance 50 impedance. If unused, keep it open. Receive 869~894 925~960 1805~1880 1930~1990 2110~2170 Unit MHz MHz MHz MHz MHz EC25_Hardware_Design 72 / 112 LTE Standard Module Series EC25 Hardware Design WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 WCDMA B19 LTE FDD B1 LTE FDD B2 LTE FDD B3 LTE FDD B4 LTE FDD B5 LTE FDD B7 LTE FDD B8 LTE FDD B12 LTE FDD B13 LTE FDD B14 LTE FDD B18 LTE FDD B19 LTE FDD B20 LTE FDD B26 LTE FDD B28 LTE TDD B38 LTE TDD B40 LTE TDD B41 LTE FDD B66 1850~1910 1710~1755 824~849 830~840 880~915 830~845 1920~1980 1850~1910 1710~1785 1710~1755 824~849 2500~2570 880~915 699~716 777~787 788~798 815~830 830~845 832~862 814~849 703~748 2570~2620 2300~2400 2555~2655 1710~1780 1930~1990 2110~2155 869~894 875~885 925~960 875~890 2110~2170 1930~1990 1805~1880 2110~2155 869~894 2620~2690 925~960 729~746 746~756 758~768 860~875 875~890 791~821 859~894 758~803 2570~2620 2300~2400 2555~2655 2100~2200 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHZ MHz MHz MHz MHz MHz MHz MHz MHz MHz EC25_Hardware_Design 73 / 112 LTE Standard Module Series EC25 Hardware Design LTE FDD B71 663~698 617~652 MHz 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A -type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 33: Reference Circuit of RF Antenna Interface NOTES 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. 2. ANT_DIV function is enabled by default. AT+QCFG="diversity",0 command can be used to disable receive diversity. Please refer to document [2] for details. 3. Place the -type matching components (R1&C1&C2, R2&C3&C4) as close to the antenna as possible. 5.1.4. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled as 50. The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, height from the reference ground to the signal layer (H), and the space between the RF trace and the ground (S). Microstrip and coplanar waveguide are typically used in RF layout to control characteristic impedance. The following figures are reference designs of microstrip or coplanar waveguide with different PCB structures. EC25_Hardware_Design 74 / 112 LTE Standard Module Series EC25 Hardware Design

. Figure 34: Microstrip Design on a 2-layer PCB Figure 35: Coplanar Waveguide Design on a 2-layer PCB Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EC25_Hardware_Design 75 / 112 LTE Standard Module Series EC25 Hardware Design Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:

Please use an impedance simulation tool to control the characteristic impedance of RF traces as 50. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right angle traces should be changed to curved ones. There should be clearance area under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W). For more details about RF layout, please refer to document [6]. 5.2. GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 28: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 47 AI GNSS antenna 50 impedance. If unused, keep it open. EC25_Hardware_Design 76 / 112 LTE Standard Module Series EC25 Hardware Design Table 29: GNSS Frequency Type GPS GLONASS Galileo BeiDou QZSS Frequency 1575.421.023 1597.5~1605.8 1575.422.046 1561.0982.046 1575.42 A reference design of GNSS antenna is shown as below. Unit MHz MHz MHz MHz MHz Figure 38: Reference Circuit of GNSS Antenna NOTES If the module is designed with a passive antenna, then the VDD circuit is not needed. 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. EC25_Hardware_Design 77 / 112 LTE Standard Module Series EC25 Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 30: Antenna Requirements Type Requirements Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain: < 17 dB VSWR: 2 Efficiency: > 30%

Max input power: 50W Input impedance: 50 Cable insertion loss: < 1dB

(GSM850, GSM 900, WCDMA B5/B6/B8/B19, LTE-FDD B5/B8/B12/B13/B14/B18/B19/B20/B26/B28/B71) Cable insertion loss: < 1.5dB

(DCS1800, PCS1900, WCDMA B1/B2/B4, LTE-FDD B1/B2/B3/B4/B66) Cable insertion loss: < 2dB

(LTE-FDD B7, LTE-TDD B38/B40/B41) GNSS1) GSM/WCDMA/LTE NOTE 1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. EC25_Hardware_Design 78 / 112 LTE Standard Module Series EC25 Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.FL-LP Connectors EC25_Hardware_Design 79 / 112 LTE Standard Module Series EC25 Hardware Design The following figure describes the space factor of mated connector. Figure 41: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. EC25_Hardware_Design 80 / 112 LTE Standard Module Series EC25 Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage at Digital Pins Voltage at ADC0 Voltage at ADC1 Min.

-0.3

-0.3 0 0

-0.3 0 0 Max. Unit 4.7 5.5 0.8 1.8 2.3 VBAT_BB VBAT_BB V V A A V V V EC25_Hardware_Design 81 / 112 LTE Standard Module Series EC25 Hardware Design 6.2. Power Supply Ratings Table 32: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF Voltage drop during burst transmission Peak supply current

(during transmission slot) The actual input voltages must stay between the minimum and maximum values. Maximum power control level on EGSM900. Maximum power control level on EGSM900. VBAT IVBAT 3.3 3.8 4.3 V 400 mV 1.8 2.0 A V USB_VBUS USB detection 3.0 5.0 5.25 6.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table. Table 33: Operation and Storage Temperatures Parameter Operation Temperature Range1) Extended Temperature Range2) Storage Temperature Range Min.

-35

-40

-40 Typ.

+25 NOTES Max.

+75

+85

+90 Unit C C C 1. 2. 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature EC25_Hardware_Design 82 / 112 LTE Standard Module Series EC25 Hardware Design returns to the normal operation temperature levels, the module will meet 3GPP specifications again. 6.4. Current Consumption The values of current consumption are shown below. Table 34: EC25-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) IVBAT LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) Idle state WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) 11 1.16 2.74 2.0 2.15 1.67 2.60 1.90 2.79 2.00 19.5 29.5 21.0 31.0 20.7 30.8 20.8 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 83 / 112 LTE Standard Module Series EC25 Hardware Design GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) LTE-TDD PF=64 (USB connected) EGSM900 4DL/1UL @33.22dBm EGSM900 3DL/2UL @33.0dBm EGSM900 2DL/3UL @30.86dBm EGSM900 1DL/4UL @29.58dBm DCS1800 4DL/1UL @29.92dBm DCS1800 3DL/2UL @29.84dBm DCS1800 2DL/3UL @29.67dBm DCS1800 1DL/4UL @29.48dBm EGSM900 4DL/1UL PCL=8 @27.40dBm EGSM900 3DL/2UL PCL=8 @27.24dBm EGSM900 2DL/3UL PCL=8 @27.11dBm EGSM900 1DL/4UL PCL=8 @26.99dBm DCS1800 4DL/1UL PCL=2 @25.82dBm DCS1800 3DL/2UL PCL=2 @25.85dBm DCS1800 2DL/3UL PCL=2 @25.68dBm DCS1800 1DL/4UL PCL=2 @25.57dBm WCDMA B1 HSDPA @22.47dBm WCDMA B1 HSUPA @22.44dBm WCDMA data transfer

(GNSS OFF) WCDMA B5 HSDPA @23.07dBm WCDMA B5 HSUPA @23.07dBm WCDMA B8 HSDPA @22.67dBm WCDMA B8 HSUPA @22.39dBm LTE data transfer

(GNSS OFF) LTE-FDD B1 @23.27dBm LTE-FDD B3 @23.54dBm 32.0 271.0 464.0 524.0 600 192.0 311.0 424.0 539.0 174.0 281.0 379.0 480.0 159.0 251.0 340.0 433.0 613.0 609.0 671.0 669.0 561.0 557.0 754.0 774.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 84 / 112 LTE Standard Module Series EC25 Hardware Design LTE-FDD B5 @22.83dBm LTE-FDD B7 @23.37dBm LTE-FDD B8 @23.48dBm LTE-FDD B20 @22.75dBm LTE-TDD B38 @23.05dBm LTE-TDD B40 @23.17dBm LTE-TDD B41 @23.02dBm GSM voice call EGSM900 PCL=5 @33.08dBm DCS1800 PCL=0 @29.75dBm WCDMA voice call WCDMA B1 @23.22dBm WCDMA B5 @23.18dBm WCDMA B8 @23.54dBm Table 35: EC25-A Current Consumption 762.0 842.0 720.0 714.0 481.0 431.8 480.0 264.0 190.0 680.0 677.0 618.0 mA mA mA mA mA mA mA mA mA mA mA mA Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) IVBAT Idle state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) 10 1.1 1.8 1.5 2.2 1.6 21.0 31.0 21.0 31.0 uA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 85 / 112 LTE Standard Module Series EC25 Hardware Design WCDMA data transfer

(GNSS OFF) WCDMA B2 HSDPA @21.9dBm WCDMA B2 HSUPA @21.62dBm WCDMA B4 HSDPA @22.02dBm WCDMA B4 HSUPA @21.67dBm WCDMA B5 HSDPA @22.71dBm WCDMA B5 HSUPA @22.58dBm LTE data transfer

(GNSS OFF) WCDMA voice call LTE-FDD B2 @22.93dBm LTE-FDD B4 @22.96dBm LTE-FDD B12 @23.35dBm WCDMA B2 @22.93dBm WCDMA B4 @23dBm WCDMA B5 @23.78dBm Table 36: EC25-V Current Consumption Parameter Description Conditions OFF state Power down AT+CFUN=0 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) Idle state LTE data transfer

(GNSS OFF) LTE-FDD B4 @23.14dBm LTE-FDD B13 @23.48dBm IVBAT 591.0 606.0 524.0 540.0 490.0 520.0 715.0 738.0 663.0 646.0 572.0 549.0 Typ. 10 0.85 2.0 1.5 20.0 31.0 770.0 531.0 mA mA mA mA mA mA mA mA mA mA mA mA Unit uA mA mA mA mA mA mA mA EC25_Hardware_Design 86 / 112 LTE Standard Module Series EC25 Hardware Design Table 37: EC25-J Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) Idle state IVBAT LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) WCDMA B1 HSDPA @22.32dBm WCDMA B1 HSUPA @22.64dBm WCDMA data transfer

(GNSS OFF) WCDMA B6 HSDPA @22.02dBm WCDMA B6 HSUPA @22.33dBm WCDMA B19 HSDPA @22.67dBm WCDMA B19 HSUPA @22.33dBm LTE data transfer

(GNSS OFF) LTE-FDD B1 @23.16dBm LTE-FDD B3 @23.22dBm LTE-FDD B8 @23.22dBm 10 1.1 1.9 1.5 2.5 1.8 2.6 1.9 21.0 31.0 21.0 32.0 21.0 32.0 550.0 516.0 524.0 521.0 517.0 522.0 685.0 766.0 641.0 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 87 / 112 LTE Standard Module Series EC25 Hardware Design LTE-FDD B18 @23.35dBm LTE-FDD B19 @23.16dBm LTE-FDD B26 @22.87dBm LTE-TDD B41 @22.42dBm WCDMA B1 @22.33dBm WCDMA B6 @23.28dBm WCDMA B19 @23.28dBm WCDMA voice call Table 38: EC25-AU Current Consumption 661.0 677.0 690.0 439.0 605.0 549.0 549.0 mA mA mA mA mA mA mA Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 AT+CFUN=0 (USB disconnected) GSM850 DRX=5 (USB disconnected) EGSM900 DRX=5 (USB disconnected) DCS1800 DRX=5 (USB disconnected) PCS1900 DRX=5 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) EGSM900 DRX=5 (USB disconnected) EGSM900 DRX=5 (USB connected) Sleep state IVBAT Idle state 11 1.3 1.46 1.8 2.0 1.9 1.9 2.0 1.6 2.2 1.6 2.3 1.6 22.0 34.0 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 88 / 112 LTE Standard Module Series EC25 Hardware Design WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) GSM850 1UL/4DL @32.53dBm GSM850 2UL/3DL @32.34dBm GSM850 3UL/2DL @30.28dBm GSM850 4UL/1DL @29.09dBm EGSM900 1UL/4DL @32.34dBm EGSM900 2UL/3DL @32.19dBm EGSM900 3UL/2DL @30.17dBm EGSM900 4UL/1DL @28.96dBm DCS1800 1UL/4DL @29.71dBm DCS1800 2UL/3DL @29.62dBm DCS1800 3UL/2DL @29.49dBm DCS1800 4UL/1DL @29.32dBm PCS1900 1UL/4DL @29.61dBm PCS1900 1UL/4DL @29.48dBm PCS1900 1UL/4DL @29.32dBm PCS1900 1UL/4DL @29.19dBm GSM850 1UL/4DL @27.09dBm GSM850 2UL/3DL @26.94dBm GSM850 3UL/2DL @26.64dBm GSM850 4UL/1DL @26.53dBm EGSM900 1UL/4DL @26.64dBm GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) 22.0 33.0 24.0 35.0 232.0 384.0 441.0 511.0 241.0 397.0 459.0 533.0 183.0 289.0 392.0 495.0 174.0 273.0 367.0 465.0 154.0 245.0 328.0 416.0 157.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 89 / 112 LTE Standard Module Series EC25 Hardware Design EGSM900 2UL/3DL @26.95dBm EGSM900 3UL/2DL @26.57dBm EGSM900 4UL/1DL @26.39dBm DCS18001 UL/4DL @26.03dBm DCS1800 2UL/3DL @25.62dBm DCS1800 3UL/2DL @25.42dBm DCS1800 4UL/1DL @25.21dBm PCS1900 1UL/4DL @25.65dBm PCS1900 1UL/4DL @25.63dBm PCS1900 1UL/4DL @25.54dBm PCS1900 1UL/4DL @25.26dBm WCDMA B1 HSDPA @22.34dBm WCDMA B1 HSUPA @21.75dBm WCDMA B2 HSDPA @22.51dBm WCDMA B2 HSUPA @22. 14dBm WCDMA B5 HSDPA @22.98dBm WCDMA B5 HSUPA @22.89dBm WCDMA B8 HSDPA @22.31dBm WCDMA B8 HSUPA @22.11dBm LTE-FDD B1 @23.28dBm LTE-FDD B2 @23.34dBm WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) LTE-FDD B3 @23.2dBm LTE-FDD B4 @22.9dBm LTE-FDD B5 @23.45dBm LTE-FDD B7 @22.84dBm 251.0 340.0 431.0 152.0 240.0 325.0 415.0 148.0 232.0 313.0 401.0 625.0 617.0 610.0 594.0 576.0 589.0 556.0 572.0 817.0 803.0 785.0 774.0 687.0 843.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 90 / 112 LTE Standard Module Series EC25 Hardware Design LTE-FDD B8 @22.92dBm LTE-FDD B28 @23.23dBm LTE-TDD B40 @23.3dBm GSM850 PCL5 @32.66dBm EGSM900 PCL5 @32.59dBm DCS1800 PCL0 @29.72dBm PCS1900 PCL0 @29.82dBm WCDMA B1 @23.27dBm WCDMA B2 @23.38dBm WCDMA B5 @23.38dBm WCDMA B8 @23.32dBm GSM voice call WCDMA voice call 689.0 804.0 429.0 228.0 235.0 178.0 170.0 687.0 668.0 592.0 595.0 mA mA mA mA mA mA mA mA mA mA mA Table 39: EC25-AUT Current Consumption Parameter Description Conditions Typ. Unit IVBAT OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) Idle state 10 1.0 1.9 1.5 2.3 1.9 23.0 33.0 17.0 29.0 21.0 32.0 uA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 91 / 112 LTE Standard Module Series EC25 Hardware Design IVBAT WCDMA B1 HSDPA @22.24dBm WCDMA data transfer

(GNSS OFF) WCDMA B1 HSUPA @22.05dBm WCDMA B5 HSDPA @22.39dBm WCDMA B5 HSUPA @22dBm LTE-FDD B1 @23.28dBm LTE-FDD B3 @23.36dBm LTE data transfer

(GNSS OFF) LTE-FDD B5 @23.32dBm LTE-FDD B7 @23.08dBm LTE-FDD B28-A @23.37dBm LTE-FDD B28-B @23.48dBm WCDMA voice call WCDMA B1 @23.22dBm WCDMA B5 @23.01dBm 500.0 499.0 418.0 486.0 707.0 782.0 588.0 692.0 752.0 770.0 546.0 511.0 mA mA mA mA mA mA mA mA mA mA mA mA Table 40: EC25-AF Current Consumption Parameter Description Conditions Typ. Unit IVBAT OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) Idle state 10 1.0 1.8 1.4 2.2 1.8 23.3 33.4 17.6 29.4 uA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 92 / 112 LTE Standard Module Series EC25 Hardware Design IVBAT WCDMA data transfer

(GNSS OFF) WCDMA B2 HSDPA @22.63dBm WCDMA B2 HSUPA @22.49dBm WCDMA B4 HSDPA @22.45dBm WCDMA B4 HSUPA @22.57dBm WCDMA B5 HSDPA @22.49dBm WCDMA B5 HSUPA @22.43dBm LTE-FDD B2 @22.92dBm LTE-FDD B4 @23.12dBm LTE-FDD B5 @22.98dBm LTE-FDD B12 @23.42dBm LTE-FDD B13 @22.92dBm LTE-FDD B14 @23.42dBm LTE-FDD B66 @23.35dBm LTE-FDD B71 @23.39dBm WCDMA B2 @23.59dBm WCDMA B4 @23.47dBm WCDMA B5 @23.46dBm LTE data transfer

(GNSS OFF) WCDMA voice call 560.0 564.0 601.0 610.0 603.0 617.0 698.0 710.0 650.0 648.0 690.0 685.0 715.0 689.0 585.0 610.0 605.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Table 41: EC25-EU Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down IVBAT Sleep state AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) 11 1.16 2.74 2.0 2.15 uA mA mA mA mA EC25_Hardware_Design 93 / 112 LTE Standard Module Series EC25 Hardware Design WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) EGSM900 4DL/1UL @33.23dBm EGSM900 3DL/2UL @31.96dBm EGSM900 2DL/3UL @29.73dBm EGSM900 1DL/4UL @28.5dBm DCS1800 4DL/1UL @30.49dBm DCS1800 3DL/2UL @29.24dBm DCS1800 2DL/3UL @27.15dBm DCS1800 1DL/4UL @25.88dBm Idle state GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) EGSM900 4DL/1UL PCL=8 @26.60dBm EGSM900 3DL/2UL PCL=8 @25.43dBm EGSM900 2DL/3UL PCL=8 @23.4dBm EGSM900 1DL/4UL PCL=8 @22.36dBm 1.67 2.60 1.90 2.79 2.00 19.5 29.5 21.0 31.0 20.7 30.8 20.8 32.0 243.0 388.0 453.0 522 172.0 274.0 337.0 406.0 142.0 229.0 286.0 348.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 94 / 112 LTE Standard Module Series EC25 Hardware Design DCS1800 4DL/1UL PCL=2 @25.59dBm DCS1800 3DL/2UL PCL=2 @24.54dBm DCS1800 2DL/3UL PCL=2 @22.38dBm DCS1800 1DL/4UL PCL=2 @21.24dBm WCDMA B1 HSDPA @22.93dBm WCDMA B1 HSUPA @22.62dBm WCDMA B8 HSDPA @22.88dBm WCDMA B8 HSUPA @22.14dBm LTE-FDD B1 @23.6dBm LTE-FDD B3 @23.67dBm LTE-FDD B7 @23.83dBm LTE-FDD B8 @23.82dBm LTE-FDD B20 @23.88dBm LTE-FDD B28A @23.43dBm LTE-TDD B38 @22.82dBm LTE-TDD B40 @23.43dBm LTE-TDD B41 @23.46dBm WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) GSM voice call EGSM900 PCL=5 @33.25dBm DCS1800 PCL=0 @30.23dBm WCDMA voice call WCDMA B1 @23.88dBm WCDMA B8 @23.8dBm Table 42: EC25-EC Current Consumption Parameter Description Conditions IVBAT OFF state Power down 136.0 225.0 300.0 379.0 504.0 512.0 562.0 535.0 664.0 728.0 821.0 695.0 649.0 689.0 438.0 355 451.0 258.0 178.0 548.0 615.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Typ. 11 Unit uA EC25_Hardware_Design 95 / 112 LTE Standard Module Series EC25 Hardware Design AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) Sleep state WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) EGSM900 4DL/1UL @33.23dBm EGSM900 3DL/2UL @31.96dBm EGSM900 2DL/3UL @29.73dBm EGSM900 1DL/4UL @28.5dBm DCS1800 4DL/1UL @30.49dBm DCS1800 3DL/2UL @29.24dBm DCS1800 2DL/3UL @27.15dBm DCS1800 1DL/4UL @25.88dBm Idle state GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) EGSM900 4DL/1UL PCL=8 @26.60dBm EGSM900 3DL/2UL PCL=8 @25.43dBm EGSM900 2DL/3UL PCL=8 @23.4dBm EGSM900 1DL/4UL PCL=8 @22.36dBm 1.02 2.01 2.1 2.02 1.39 2.20 1.81 18.7 27.6 21.0 31.0 20.7 30.8 265.0 388.0 461.0 606 156.0 250.0 344.0 441.0 160.0 259.0 381.0 488.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 96 / 112 LTE Standard Module Series EC25 Hardware Design DCS1800 4DL/1UL PCL=2 @25.59dBm DCS1800 3DL/2UL PCL=2 @24.54dBm DCS1800 2DL/3UL PCL=2 @22.38dBm DCS1800 1DL/4UL PCL=2 @21.24dBm WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) GSM voice call WCDMA B1 HSDPA @22.43dBm WCDMA B1 HSUPA @21.92dBm WCDMA B8 HSDPA @22.88dBm WCDMA B8 HSUPA @22.14dBm LTE-FDD B1 @23.6dBm LTE-FDD B3 @23.67dBm LTE-FDD B7 @23.83dBm LTE-FDD B8 @23.82dBm LTE-FDD B20 @23.88dBm LTE-FDD B28A @23.43dBm EGSM900 PCL=5 @33.25dBm DCS1800 PCL=0 @30.23dBm WCDMA voice call WCDMA B1 @23.88dBm WCDMA B8 @23.8dBm Table 43: EC25-EUX Current Consumption Parameter Description Conditions OFF state Power down IVBAT AT+CFUN=0 (USB disconnected) Sleep state GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) 132.0 205.0 300.0 359.0 504.0 497.0 562.0 535.0 659.0 693.0 821.0 695.0 690.0 689.0 258.0 188.0 548.0 615.0 Typ. 11 0.96 2.14 1.49 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Unit uA mA mA mA EC25_Hardware_Design 97 / 112 LTE Standard Module Series EC25 Hardware Design WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) EGSM900 4DL/1UL @33.23dBm EGSM900 3DL/2UL @31.96dBm EGSM900 2DL/3UL @29.73dBm EGSM900 1DL/4UL @28.5dBm DCS1800 4DL/1UL @30.49dBm DCS1800 3DL/2UL @29.24dBm DCS1800 2DL/3UL @27.15dBm DCS1800 1DL/4UL @25.88dBm Idle state GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) EGSM900 4DL/1UL PCL=8 @26.60dBm EGSM900 3DL/2UL PCL=8 @25.43dBm EGSM900 2DL/3UL PCL=8 @23.4dBm 1.99 1.39 2.48 1.81 2.79 2.00 19.5 29.5 21.0 31.0 20.7 30.8 20.8 32.0 265.0 388.0 461.0 593 156.0 245.0 337.0 427.0 170.0 205.0 280.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 98 / 112 LTE Standard Module Series EC25 Hardware Design EGSM900 1DL/4UL PCL=8 @22.36dBm DCS1800 4DL/1UL PCL=2 @25.59dBm DCS1800 3DL/2UL PCL=2 @24.54dBm DCS1800 2DL/3UL PCL=2 @22.38dBm DCS1800 1DL/4UL PCL=2 @21.24dBm WCDMA data transfer

(GNSS OFF) WCDMA B1 HSDPA @22.93dBm WCDMA B1 HSUPA @22.62dBm WCDMA B8 HSDPA @22.88dBm WCDMA B8 HSUPA @22.14dBm LTE data transfer

(GNSS OFF) LTE-FDD B1 @23.6dBm LTE-FDD B3 @23.67dBm LTE-FDD B7 @23.83dBm LTE-FDD B8 @23.82dBm LTE-FDD B20 @23.88dBm LTE-FDD B28A @23.43dBm LTE-TDD B38 @22.82dBm LTE-TDD B40 @23.43dBm LTE-TDD B41 @23.46dBm GSM voice call EGSM900 PCL=5 @33.25dBm DCS1800 PCL=0 @30.23dBm WCDMA voice call WCDMA B1 @23.88dBm WCDMA B8 @23.8dBm 348.0 136.0 225.0 300.0 379.0 504.0 512.0 562.0 535.0 664.0 693.0 800.0 695.0 690.0 669.0 438.0 355 451.0 258.0 178.0 533.0 506.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 99 / 112 LTE Standard Module Series EC25 Hardware Design Table 44: EC25-MX Current Consumption Parameter Description Conditions Typ. Unit IVBAT IVBAT OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) Idle state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA B2 HSDPA @22.27dBm WCDMA B2 HSUPA @22.15dBm WCDMA data transfer

(GNSS OFF) WCDMA B4 HSDPA @22.5dBm WCDMA B4 HSUPA @22.5dBm WCDMA B5 HSDPA @22.4dBm WCDMA B5 HSUPA @22.17dBm LTE data transfer

(GNSS OFF) LTE-FDD B2 @23.2dBm LTE-FDD B4 @23.4dBm LTE-FDD B5 @23.2dBm LTE-FDD B7 @24.3dBm LTE-FDD B28 @23.45dBm LTE-FDD B66 @22.68dBm WCDMA voice WCDMA B2 @23.47dBm 19 1.0 2.3 1.7 2.5 2.2 12.9 32 13.7 32.6 581.9 603.0 578.0 571.0 499.0 515.0 685.0 744.0 578.0 868.0 631.0 781.0 643.0 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 100 / 112 LTE Standard Module Series EC25 Hardware Design call WCDMA B4 @23.5dBm WCDMA B5 @23.5dBm 633.0 551.0 mA mA Table 45: GNSS Current Consumption of EC25 Series Module Parameter Description Conditions Searching

(AT+CFUN=0) Tracking

(AT+CFUN=0) Cold start @Passive Antenna Lost state @Passive Antenna Instrument Environment Open Sky @Passive Antenna Open Sky @Active Antenna IVBAT

(GNSS) 6.5. RF Output Power The following table shows the RF output power of EC25 module. Table 46: RF Output Power Frequency GSM850/EGSM900 DCS1800/PCS1900 Max. 33dBm2dB 30dBm2dB GSM850/EGSM900 (8-PSK) 27dBm3dB DCS1800/PCS1900 (8-PSK) 26dBm3dB WCDMA bands LTE-FDD bands LTE-TDD bands 24dBm+1/-3dB 23dBm2dB 23dBm2dB Typ. 54.0 53.9 30.5 33.2 40.8 Unit mA mA mA mA mA Min. 5dBm5dB 0dBm5dB 5dBm5dB 0dBm5dB

<-49dBm

<-39dBm

<-39dBm EC25_Hardware_Design 101 / 112 LTE Standard Module Series EC25 Hardware Design NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EC25 series module. Table 47: EC25-E Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 DCS1800

-109.0dBm

-109.0dBm WCDMA B1

-110.5dBm WCDMA B5

-110.5dBm WCDMA B8

-110.5dBm LTE-FDD B1 (10M)

-98.0dBm LTE-FDD B3 (10M)

-96.5dBm LTE-FDD B5 (10M)

-98.0dBm LTE-FDD B7 (10M)

-97.0dBm LTE-FDD B8 (10M)

-97.0dBm LTE-FDD B20 (10M)

-97.5dBm LTE-TDD B38 (10M)

-95dBm LTE-TDD B40 (10M)

-96.3dBm LTE-TDD B41 (10M)

-94.5dBm

/

/

/

/

/

-98.0dBm

-98.5dBm

-98.5dBm

-97.0dBm

-97.0dBm

-99.0dBm

-97.0dBm

-98.0dBm

-97.0dBm

/

/

/

/

/

-102.0dBm

-102.0dbm

-106.7dBm

-104.7dBm

-103.7dBm

-101.5dBm

-96.3dBm

-101.5dBm

-93.3dBm

-101.0dBm

-94.3dBm

-99.5dBm

-94.3dBm

-101.0dBm

-93.3dBm

-102.5dBm

-93.3dBm

-98.9dBm

-96.3dBm

-101.0dBm

-96.3dBm

-98.5dBm

-94.3dBm EC25_Hardware_Design 102 / 112 LTE Standard Module Series EC25 Hardware Design Table 48: EC25-A Conducted RF Receiving Sensitivity Frequency WCDMA B2 WCDMA B4 WCDMA B5 Primary Diversity SIMO1) 3GPP (SIMO)

-110.0dBm

-110.0dBm

-110.5dBm

/

/

/

/

/

/

-104.7dBm

-106.7dBm

-104.7dBm LTE-FDD B2 (10M)

-98.0dBm LTE-FDD B4 (10M)

-97.5dBm LTE-FDD B12 (10M)

-97.2dBm

-98.0dBm

-99.0dBm

-98.0dBm

-101.0dBm

-94.3dBm

-101.0dBm

-96.3dBm

-101.0dBm

-93.3dBm Table 49: EC25-V Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B4 (10M)

-97.5dBm

-99.0dBm

-101.0dBm

-96.3dBm LTE-FDD B13 (10M)

-97.7dBm

-97.0dBm

-100.0dBm

-93.3dBm Table 50: EC25-J Conducted RF Receiving Sensitivity Primary Diversity SIMO1) 3GPP (SIMO) Frequency WCDMA B1 WCDMA B6 WCDMA B8

-110.0dBm

-110.5dBm

-110.5dBm WCDMA B19

-110.5dBm LTE-FDD B1 (10M)

-97.5dBm LTE-FDD B3 (10M)

-96.5dBm LTE-FDD B8 (10M)

-98.4dBm LTE-FDD B18 (10M)

-99.5dBm LTE-FDD B19 (10M)

-99.2dBm

/

/

/

/

-98.7dBm

-97.1dBm

-99.0dBm

-99.0dBm

-99.0dBm

/

/

/

/

-106.7dBm

-106.7dBm

-103.7dBm

-106.7dBm

-100.2dBm

-96.3dBm

-100.5dBm

-93.3dBm

-101.2dBm

-93.3dBm

-101.7dBm

-96.3dBm

-101.4dBm

-96.3dBm EC25_Hardware_Design 103 / 112 LTE Standard Module Series EC25 Hardware Design LTE-FDD B26 (10M)

-99.5dBm LTE-TDD B41 (10M)

-95.0dBm

-99.0dBm

-95.7dBm

-101.5dBm

-93.8dBm

-99.0dBm

-94.3dBm Table 51: EC25-AU Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B5 WCDMA B8

-109.0dBm

-109.0dBm

-109.0dBm

-109.0dBm

-110.0dBm

-110.0dBm

-111.0dBm

-111.0dBm

/

/

/

/

/

/

/

/

/

/

/

/

/

/

/

/

-102.0dBm

-102.0dBm

-102.0dBm

-102.0dBm

-106.7dBm

-104.7dBm

-104.7dBm

-103.7dBm LTE-FDD B1 (10M)

-97.2dBm

-97.5dBm

-100.2dBm

-96.3dBm LTE-FDD B2 (10M)

-98.2dBm

/

/

-94.3dBm LTE-FDD B3 (10M)

-98.7dBm LTE-FDD B4 (10M)

-97.7dBm LTE-FDD B5 (10M)

-98.0dBm LTE-FDD B7 (10M)

-97.7dBm LTE-FDD B8 (10M)

-99.2dBm LTE-FDD B28 (10M)

-98.6dBm LTE-TDD B40 (10M)

-97.2dBm

-98.6dBm

-97.4dBm

-98.2dBm

-97.7dBm

-98.2dBm

-98.7dBm

-98.4dBm

-102.2dBm

-93.3dBm

-100.2dBm

-96.3dBm

-101.0dBm

-94.3dBm

-101.2dBm

-94.3dBm

-102.2dBm

-93.3dBm

-102.0dBm

-94.8dBm

-101.2dBm

-96.3dBm EC25_Hardware_Design 104 / 112 LTE Standard Module Series EC25 Hardware Design Table 52: EC25-AUT Conducted RF Receiving Sensitivity Frequency WCDMA B1 WCDMA B5 Primary Diversity SIMO1) 3GPP (SIMO)

-110.0dBm

-110.5dBm

/

/

/

/

-106.7dBm

-104.7dBm LTE-FDD B1 (10M)

-98.5dBm

-98.0dBm

-101.0dBm

-96.3dBm LTE-FDD B3 (10M)

-98.0dBm LTE-FDD B5 (10M)

-98.0dBm

-97.0dBm

-99.0dBm

-100.0dBm

-93.3dBm

-102.5dBm

-94.3dBm LTE-FDD B7 (10M)

-97.0dBm

-97.0dBm

-98.5dBm

-94.3dBm LTE-FDD B28 (10M)

-97.0dBm

-99.0dBm

-102.0dBm

-94.8dBm Table 53: EC25-AUTL Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B3 (10M)

-98.0dBm

-97.0dBm

-100.0dBm

-93.3dBm LTE-FDD B7 (10M)

-97.0dBm

-97.0dBm

-98.5dBm

-94.3dBm LTE-FDD B28 (10M)

-97.0dBm

-99.0dBm

-102.0dBm

-94.8dBm Table 54: EC25-AF Conducted RF Receiving Sensitivity Frequency WCDMA B2 WCDMA B4 WCDMA B5 Primary Diversity SIMO1) 3GPP (SIMO)

-109.5dBm

-110dBm

-110.4dBm

-104.7dBm

-109.6dBm

-110dBm

-110.6dBm

-106.7dBm

-110dBm

-110dBm

-110.7dBm

-104.7dBm LTE-FDD B2 (10M)

-98.0dBm

-98.5

-100.5dBm

-94.3dBm LTE-FDD B4 (10M)

-97.5dBm

-98.2dBm

-99.5dBm

-96.3dBm LTE-FDD B5 (10M)

-98.0dBm

-98.5dBm

-100.5dBm

-94.3dBm LTE-FDD B12 (10M)

-99.0dBm

-99.5dBm

-100.5dBm

-93.3dBm EC25_Hardware_Design 105 / 112 LTE Standard Module Series EC25 Hardware Design LTE-FDD B13 (10M)

-98.5dBm

-99.5dBm

-100.7dBm

-93.3dBm LTE-FDD B14 (10M)

-99.4dBm

-99.5dBm

-100.9dBm

-93.3dBm LTE-FDD B66 (10M)

-97.5dBm

-98.5dBm

-99.6dBm

-95.8dBm LTE-FDD B71 (10M)

-98.6dBm

-99.5dBm

-100dBm

-93.5dBm Table 55: EC25-EU Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 DCS1800

-109.0dBm

-109.0dBm

/

/

WCDMA B1

-109.5dBm

-109.5dBm WCDMA B8

-110.0dBm

-112 dBm

/

/

/

/

-102.0dBm

-102.0dbm

-106.7dBm

-103.7dBm LTE-FDD B1 (10M)

-99.2dBm LTE-FDD B3 (10M)

-99.2dBm LTE-FDD B7 (10M)

-97.7dBm

-99.0dBm

-99.8dBm

-98.5dBm

-101.7dBm

-96.3dBm

-102dBm

-93.3dBm

-100.7dBm

-94.3dBm LTE-FDD B8 (10M)

-99.2dBm

-100.4dBm

-102.4dBm

-93.3dBm LTE-FDD B20 (10M)

-99.2dBm

-100.8dBm

-102.7dBm

-93.3dBm LTE-FDD B28 (10M)

-99.2dBm

-100.5dBm

-102.5dBm

-94.8dBm LTE-TDD B38 (10M)

-96.2dBm LTE-TDD B40 (10M)

-96.7dBm LTE-TDD B41 (10M)

-96.2dBm

-98.0dBm

-99.2dBm

-98.1dBm

-100.2dBm

-96.3dBm

-101.2dBm

-96.3dBm

-100.2dBm

-94.3dBm Table 56: EC25-EC Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 DCS1800

-108.8dBm

-109.0dBm

/

/

/

/

-102.0dBm

-102.0dbm EC25_Hardware_Design 106 / 112 LTE Standard Module Series EC25 Hardware Design WCDMA B1

-110.5dBm WCDMA B8

-110.5dBm

/

/

/

/

-106.7dBm

-103.7dBm LTE-FDD B1 (10M)

-98.0dBm LTE-FDD B3 (10M)

-96.5dBm LTE-FDD B7 (10M)

-97.0dBm LTE-FDD B8 (10M)

-97.0dBm LTE-FDD B20 (10M)

-97.5dBm LTE-FDD B28 (10M)

-98.6dBm

-98.0dBm

-98.5dBm

-95.5dBm

-97.0dBm

-99.0dBm

-98.7dBm

-101.0dBm

-96.3dBm

-100.0dBm

-93.3dBm

-99.5dBm

-94.3dBm

-101.0dBm

-93.3dBm

-101.0dBm

-93.3dBm

-101.5dBm

-94.8dBm Table 57: EC25-EUX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 DCS1800

-109.0dBm

-109.0dBm WCDMA B1

-110.5dBm WCDMA B8

-110.5dBm LTE-FDD B1 (10M)

-98.0dBm LTE-FDD B3 (10M)

-96.5dBm LTE-FDD B7 (10M)

-97.0dBm LTE-FDD B8 (10M)

-97.0dBm LTE-FDD B20 (10M)

-97.5dBm LTE-FDD B28 (10M)

-98.6dBm

/

/

/

/

-98.0dBm

-98.5dBm

-94.5dBm

-97.0dBm

-99.0dBm

-98.7dBm LTE-TDD B38 (10M)

-96.3dBm

-97dBm LTE-TDD B40 (10M)

-96.9dBm LTE-TDD B41 (10M)

-95.3dBm

-98.0dBm

-97.5dBm

/

/

/

/

-101dBm

-99.5dBm

-99.5dBm

-102.0dBm

-102.0dbm

-106.7dBm

-103.7dBm

-96.3dBm

-93.3dBm

-94.3dBm

-100.0dBm

-93.3dBm

-101.5dBm

-93.3dBm

-101.0dBm

-94.8dBm

-98.5dBm

-99.1dBm

-98.0dBm

-96.3dBm

-96.3dBm

-94.3dBm EC25_Hardware_Design 107 / 112 LTE Standard Module Series EC25 Hardware Design Table 58: EC25-MX Conducted RF Receiving Sensitivity Diversity SIMO1) 3GPP (SIMO) Frequency WCDMA B2 WCDMA B4 WCDMA B5 Primary

-109dBm

-110.5dBm

-109.5dBm

-110dBm

-110dBm

-111dBm

/

/

/

-104.7dBm

-106.7dBm

-104.7dBm LTE-FDD B2 (10M)

-98dBm

-99.1dBm

-101.5dBm

-94.3dBm LTE-FDD B4 (10M)

-98.5dBm

-98.2dBm

-101.5dBm

-96.3dBm LTE-FDD B5 (10M)

-99dBm

-99.2dBm

-102.5dBm

-94.3dBm LTE-FDD B7 (10M)

-97dBm

-98.5dBm

-101.5dBm

-94.3dBm LTE-FDD B28(10M)

-98dBm

-99.3dBm

-102dBm

-94.8dBm LTE-FDD B66 (10M)

-98dBm

-98.4dBm

-101.5dBm

-95.8dBm NOTE 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.7. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the modules electrostatics discharge characteristics. Table 59: Electrostatics Discharge Characteristics (25C, 45% Relative Humidity) Tested Points Contact Discharge Air Discharge VBAT, GND 5 10 Unit kV EC25_Hardware_Design 108 / 112 LTE Standard Module Series EC25 Hardware Design All Antenna Interfaces Other Interfaces 4 0.5 8 1 kV kV 6.8. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:

On customers PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc. Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary. Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Make sure the ground pads of the module and PCB are fully connected. According to customers application demands, the heatsink can be mounted on the top of the module, or the opposite side of the PCB area where the module is mounted, or both of them. The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB. The following shows two kinds of heatsink designs for reference and customers can choose one or both of them according to their application structure. Figure 42: Referenced Heatsink Design (Heatsink at the Top of the Module) EC25_Hardware_Design 109 / 112 LTE Standard Module Series EC25 Hardware Design Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers PCB) NOTES 1. The module offers the best performance when the internal BB chip stays below 105C. When the maximum temperature of the BB chip reaches or exceeds 105C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. 2. For more detailed guidelines on thermal design, please refer to document [7]. EC25_Hardware_Design 110 / 112 LTE Standard Module Series EC25 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm. The tolerances for dimensions without tolerance values are 0.05mm. 7.1. Mechanical Dimensions of the Module 32.00.15 2.40.2

. 5 1 0 0 9 2

. Figure 44: Module Top and Side Dimensions 0.8 EC25_Hardware_Design 111 / 112 LTE Standard Module Series EC25 Hardware Design Figure 45: Module Bottom Dimensions (Bottom View) EC25_Hardware_Design 112 / 112 LTE Standard Module Series EC25 Hardware Design 7.2. Recommended Footprint Figure 46: Recommended Footprint (Top View) NOTES 1. The keepout area should not be designed. 2. For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB. EC25_Hardware_Design 113 / 112 LTE Standard Module Series EC25 Hardware Design 7.3. Design Effect Drawings of the Module Figure 47: Top View of the Module Figure 48: Bottom View of the Module NOTE These are design effect drawings of EC25 module. For more accurate pictures, please refer to the module that you get from Quectel. EC25_Hardware_Design 114 / 112 LTE Standard Module Series EC25 Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EC25 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40C/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:

Mounted within 168 hours at the factory environment of 30C/60%RH. Stored at <10% RH. 3. Devices require bake before mounting, if any circumstances below occurs:

When the ambient temperature is 23C5C and the humidity indicator card shows the humidity Device mounting cannot be finished within 168 hours at factory conditions of 30C/60%RH. is >10% before opening the vacuum-sealed bag. If baking is required, devices may be baked for 8 hours at 120C5C. 4. NOTE If shorter baking As the plastic package cannot be subjected to high temperature, it should be removed from devices before high to temperature (120C) baking. IPC/JEDECJ-STD-033 for baking procedure. is desired, please refer time EC25_Hardware_Design 115 / 112 LTE Standard Module Series EC25 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18mm~0.20mm. For more details, please refer to document [4]. It is suggested that the peak reflow temperature is 238C ~245C, and the absolute maximum reflow temperature is 245C. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Temp. (C) 245 238 220 200 150 100 Soak Zone A Max slope: 1~3C/sec Reflow Zone C Max slope:

2~3C/sec Cooling down slope: 1~4C/sec B D Figure 49: Reflow Soldering Thermal Profile Table 60: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 1 to 3C/sec Soak time (between A and B: 150C and 200C) 60 to 120 sec Reflow Zone EC25_Hardware_Design 116 / 112 LTE Standard Module Series EC25 Hardware Design Max slope Reflow time (D: over 220C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle 2 to 3C/sec 40 to 60 sec 238C ~ 245C 1 to 4C/sec 1 8.3. Packaging EC25 is packaged in tap and reel carriers. Each reel is 11.88m long and contains 250pcs modules. The figure below shows the package details, measured in mm. 44.00 0.1 2.00 0.1

. 1 0 5 7

. 1

. 5 1 0 0 2 0 2

. 3 0 0 0

. 4 4 32.5 0.15 33.5 0.15 4.00 0.1 32.5 0.15 33.5 0.15 1.50 0.1 0.35 0.05

. 5 1 0 3 9 2

. 5 1 0 3 0 3

. 5 1 0 3 0 3

. 4.2 0.15 3.1 0.15 EC25_Hardware_Design 117 / 112 LTE Standard Module Series EC25 Hardware Design 48.5 0 0 1 13 44.5+0.20

-0.00 Cover tape Direction of feed Figure 50: Tape and Reel Specifications EC25_Hardware_Design 118 / 112 LTE Standard Module Series EC25 Hardware Design 9 Appendix A References Table 61: Related Documents SN Document Name Remark Quectel_EC2x&EG9x&EM05_Power_Management_ Application_Note Quectel_EC2x&EG9x&EM05_AT_Commands_ Manual Quectel_EC25&EC21_GNSS_AT_Commands_ Manual Power management application note for EC25, EC21, EC20 R2.0, EC20 R2.1, EG95, EG91 and EM05 modules AT commands manual for EC25, EC21, EC20 R2.0, EC20 R2.1, EG91, EG95 and EM05 modules EC25 and EC21 GNSS AT commands manual Quectel_Module_Secondary_SMT_User_Guide Module secondary SMT user guide Quectel_EC25_Reference_Design EC25 reference design Quectel_RF_Layout_Application_Note RF layout application note

[1]

[2]

[3]

[4]

[5]

[6]

Thermal design guide for LTE modules including EC25, EC21, EC20 R2.0, EC20 R2.1, EG91, EG95, EG25-G, EP06, EG06, EM06 and AG35.

[7]

Quectel_LTE_Module_Thermal_Design_Guide Table 62: Terms and Abbreviations Abbreviation Description AMR bps CHAP CS CSD Adaptive Multi-rate Bits Per Second Challenge Handshake Authentication Protocol Coding Scheme Circuit Switched Data EC25_Hardware_Design 119 / 112 LTE Standard Module Series EC25 Hardware Design CTS DC-HSPA+

DFOTA Clear To Send Dual-carrier High Speed Packet Access Delta Firmware Upgrade Over-The-Air DL DTR DTX EFR ESD FDD FR Downlink Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK GNSS GPS GSM HR HSPA HSDPA HSUPA I/O Inorm LED LNA LTE MIMO Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Downlink Packet Access High Speed Uplink Packet Access Input/Output Normal Current Light Emitting Diode Low Noise Amplifier Long Term Evolution Multiple Input Multiple Output EC25_Hardware_Design 120 / 112 LTE Standard Module Series EC25 Hardware Design MO MS MT PAP PCB PDU PPP QAM QPSK RF RHCP Rx SGMII SIM SIMO SMS TDD Mobile Originated Mobile Station (GSM engine) Mobile Terminated Password Authentication Protocol Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Right Hand Circularly Polarized Receive Serial Gigabit Media Independent Interface Subscriber Identification Module Single Input Multiple Output Short Message Service Time Division Duplexing TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access TX UL UMTS URC USIM Vmax Transmitting Direction Uplink Universal Mobile Telecommunications System Unsolicited Result Code Universal Subscriber Identity Module Maximum Voltage Value EC25_Hardware_Design 121 / 112 LTE Standard Module Series EC25 Hardware Design Vnorm Vmin VIHmax VIHmin VILmax VILmin VImax VImin VOHmax VOHmin VOLmax VOLmin VSWR WCDMA WLAN Normal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Absolute Minimum Input Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Voltage Standing Wave Ratio Wideband Code Division Multiple Access Wireless Local Area Network EC25_Hardware_Design 122 / 112 LTE Standard Module Series EC25 Hardware Design 10 Appendix B GPRS Coding Schemes Table 63: Description of Different Coding Schemes Scheme Code Rate USF Pre-coded USF CS-1 1/2 3 3 Radio Block excl.USF and BCS 181 BCS Tail Coded Bits Punctured Bits Data Rate Kb/s 40 4 456 0 9.05 CS-2 2/3 3 6 268 16 4 588 132 13.4 CS-3 3/4 3 6 312 16 4 676 220 15.6 CS-4 1 3 12 428 16

-

456

-

21.4 EC25_Hardware_Design 123 / 112 LTE Standard Module Series EC25 Hardware Design 11 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 64: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1 2 2 3 2 3 3 4 3 4 4 4 3 4 1 1 2 1 2 2 3 1 2 2 3 4 3 4 2 3 3 4 4 4 4 5 5 5 5 5 NA NA EC25_Hardware_Design 124 / 112 LTE Standard Module Series EC25 Hardware Design 5 6 7 8 6 6 6 6 6 8 8 8 8 8 8 5 5 5 5 5 6 7 8 2 3 4 4 6 2 3 4 4 6 8 1 2 3 4 NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA 6 6 6 6 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 EC25_Hardware_Design 125 / 112 LTE Module Sires EC25Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 65: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot GMSK GMSK GMSK GMSK GMSK GMSK GMSK GMSK 8-PSK 8-PSK 8-PSK 8-PSK 8-PSK

/

/

/

/

C B A C B A B A A 9.05kbps 18.1kbps 36.2kbps 13.4kbps 26.8kbps 53.6kbps 15.6kbps 31.2kbps 62.4kbps 21.4kbps 42.8kbps 85.6kbps 8.80kbps 17.60kbps 35.20kbps 11.2kbps 22.4kbps 44.8kbps 14.8kbps 29.6kbps 59.2kbps 17.6kbps 35.2kbps 70.4kbps 22.4kbps 44.8kbps 89.6kbps 29.6kbps 59.2kbps 118.4kbps 44.8kbps 89.6kbps 179.2kbps 54.4kbps 108.8kbps 217.6kbps 59.2kbps 118.4kbps 236.8kbps CS-1:

CS-2:

CS-3:

CS-4:

MCS-1 MCS-2 MCS-3 MCS-4 MCS-5 MCS-6 MCS-7 MCS-8 MCS-9 EC25_Hardware_Design 126 / 126

 

 

Company:QuectelWirelessSolutionsCo.,Ltd Modelname:EC25MX,EC25MXMINIPCIE InternalPhotos

 

 

Company:QuectelWirelessSolutionsCo.,Ltd Modelname:EC25MX,EC25MXMINIPCIE ExternalPhotos

 

 

LabelLocation Company:QuectelWirelessSolutionsCo.,Ltd Modelname:EC25MX,EC25MXMINIPCIE

 

 

ANTENNA SPECIFICATION Project Number: S0691 Rev. 1.0 Internal Antenna Product Specification Customer Name:

Project Name:

Quectel Wireless Solutions Co., Ltd. 4G-LTE External Antenna Part Number:

SAA30968A VENDOR NAME:

ShanghaiSaintennaElectronic

TechnologyCo.,Ltd. Tel: 021- 36307272 Fax: 021- 36307757 Approval Sheet Customer Saintenna Rev 1.0 Change Summary Preliminary Release Date 2014-07-26 Author Kevin Cui PREPARED BY ShanghaiSaintennaElectronicTechnologyCo.,Ltd. 2005 COPYRIGHT SAINTENNA CO. LTD. This document is issued by Saintenna Electronic Technology Co. Ltd. (hereinafter called Saintenna) in confidence, and is not to be reproduced in whole or in part without the prior written permission of Saintenna. The information contained herein is the property of Saintenna and is to be used only for the purpose for which it is submitted and is not to be released in whole or in part without the prior written permission of Saintenna. Building 8, No. 611 BaoQI Road, Baoshan District Shanghai 200444, P.R. China Saintenna Co. Ltd. Confidential & Proprietary Tel. 0086-21-36307272 SFN01.05A Fax 0086-21-36307757 Page 1 of 1 Catalog Project / content 1. Cover 2. Catalog 3. Product chart 4. Antenna standard parameters 5. Electrical performance test report 6. RoHS No. 1 2 3 4 5-7 8 Standard parameter Specifications Frequency range 699~960MHz/1710~2700MHz S.W.R Gain Connector Impedance 3 4.0dBi SMA Plug 50 Ohm Reliability test Project Test condition Result Storage environment Temperature, humidity, air pressure test are as follows:

1.Temperature: -30+80 Normal electrical and mechanical properties 2.Humidity: 45%-85%

3.Pressure: 86kpa-106kpa

Drop test The 5 cycle is between 70 and 40. Then check the appearance quality Meet the mechanical and electrical properties

Meet the mechanical and electrical properties Vibration frequency 10-55HZ, displacement:

0.35MM, acceleration: 50.0M/S, Frequency sweep frequency: 30 times 1m height drop Normal electrical and mechanical properties Normal electrical and mechanical properties Normal electrical and mechanical properties Drawing force test Push pull tester to test the strength of the instrument10N Voltage resistance 1.Insulation spark voltage 1.5KV 2.Sheath spark voltage 1.5KV 3.Insulation resistance to sheath voltage 0.5KV Normal electrical and mechanical properties Shanghai Saintenna Electronic TechnologyCo.Ltd. Company / project External antenna Working frequency band All Test date 2016/6/22 Test person Victor Peng Version number V1.0 Test sample description Mould Free space test data of whole machine passive efficiency:

Freq 700 710 720 730 740 750 760 770 780 790 800 810 820 830 840 850 860 870 880 890 900 910 920 930 940 950 Gain 1.66 3.26 3.95 3.6 3.85 4.04 3.44 3.98 4.45 3.63 3.47 3.19 2.53 2.13 1.89 2.29 2.64 3.01 2.98 2.46 2.38 2.06 1.91 2.06 2.27 2.04 Efficiency 41.00%

49.30%

58.30%

58.10%

55.50%

54.40%

53.30%

57.30%

63.50%

66.00%

67.30%

62.40%

59.20%

57.60%

56.30%

57.10%

60.50%

61.20%

60.60%

57.00%

54.80%

52.30%

51.50%

51.30%

55.40%

54.10%

Freq 960 970 980 990 1000 1700 1720 1740 1760 1780 1800 1820 1840 1860 1880 1900 1920 1940 1960 1980 2000 2020 2040 2060 2080 2100 Gain 1.7 1.23 1 0.82 1.17 1.67 1.94 2 1.57 0.97 1.33 1.17 1.36 1.25 1.38 1.59 1.36 1.01 1.41 1.53 1.84 2.1 2.65 3.22 3.69 4.01 Efficiency 51.90%

47.10%

44.80%

41.90%

40.70%

63.40%

62.90%

64.80%

60.40%

56.80%

55.90%

56.20%

55.70%

51.40%

49.90%

51.70%

52.00%

49.40%

51.60%

53.20%

52.70%

50.40%

54.50%

56.90%

56.60%

59.20%

The information contained in this product is of a proprietary nature. It may not be reproduced without expressed written permission of Shanghai Saintenna Electronic Technology Co., Ltd. CONFIDENTIAL Freq 2500 2520 2540 2560 2580 2600 2620 2640 2660 2680 2700 Gain 3 2.68 2.44 2.3 2 2.04 2.06 2 1.71 1.71 1.78 Efficiency 67.00%

68.00%

68.80%

66.30%

59.90%

60.30%

61.10%

60.70%

59.90%

58.60%

59.00%

Freq 2120 2140 2160 2180 2300 2320 2340 2360 2380 2400 2420 2440 2460 2480 Gain 3.69 3.22 2.46 1.45 1.25 1.49 1.49 1.49 1.57 1.88 2.15 2.85 3.35 3.6 Efficiency 59.60%

56.00%

52.20%

47.30%

46.90%

50.10%

50.60%

49.90%

51.90%

54.40%

57.80%

60.80%

64.80%

69.50%

LOG MAG:

The information contained in this product is of a proprietary nature. It may not be reproduced without expressed written permission of Shanghai Saintenna Electronic Technology Co., Ltd. Page 2 CONFIDENTIAL VSWR The information contained in this product is of a proprietary nature. It may not be reproduced without expressed written permission of Shanghai Saintenna Electronic Technology Co., Ltd. Page 3 CONFIDENTIAL Product :RF Antenna Assembly ROHS Supplier Part No.

() ITEM

() RAW MATERIAL RAW MATERIAL Cd() Pb() Cr6+(

(//

) SUPPLIER

()

(ppm) Silver plated copper wire RG-178 FEP Tin plated copper wire Brown color Rod sleeve ABS Fixed Solid PBT+PC PBT+PC POM NI-Plated Connector Gold-Plated PTFE Brass Toner Black masterbatch PCB FR4 1 2 3 4 5 6 7 JIANGSU YUANDA N.D N.D N.D N.D Chemical fiber N.D N.D N.D N.D N.D N.D N.D 14 N.D N.D SHIYANG HEN-CHEN LIANFENG LIANFENG Huake Formosa PBBS(

) Hg()

(ppm)

)

(ppm) N.D

(ppm) N.D N.D N.D N.D N.D

(ppm) N.D Negative N.D N.D N.D N.D N.D N.D Negative N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D Negative N.D N.D Negative N.D N.D 31782 Negative N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D PBDES(

)

(ppm) N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D N.D Test organization Test report No. SGS Report date CTI ECL01H051755017 2015.10.23 SGS SGS SGS SGS SGS SGS CTI SGS SGS SGS CE/2016/13616 2016.01.25 CE/2015/C5211 2015.12.30 KE/2015/C2285A-01 CANEC1517911004 CANEC1517911006 SCL01I013440001C CANEC1603095201 CANEC1601390003 SCL01H099132001C 2015.12.28 2015.10.26 2015.10.26 2016.03.07 2016.03.09 2016.01.28 2015.11.23

 

 

Quectel Wireless Solutions Company Limited Request for Confidentiality Date: _2019-7-25_ Subject: Confidentiality Request for: _____ FCC ID: XMR201907EC25MX ______ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent*1 Permanent Permanent Permanent Permanent Permanent*

Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual

*Note: ______(Insert Explanation as Necessary)______ ______ FCC ID: XMR201907EC25MX _____ has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:

Johnny Xiang

(Signature/Title2)

(Print name) 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, ChinaEmail: info@quectel.comWebsite: www.quectel.compage 1

 

 

Quectel Wireless Solutions Company Limited Declaration of the Modular Approval Applicant / Grantee FCC ID:

Model:

The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:

Quectel Wireless Solutions Company Limited XMR201907EC25MX EC25-MX, EC25-MX MINIPCIE Modular approval requirement EUT Condition

(a) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning The radio elements of the modular transmitter have their own shielding. capacitors may be located external to the shielded radio elements. Com ply YES

(b) The modular have inputs are buffered modulation/data provided) to ensure that the module will comply with part inputs (if such transmitter must 15 requirements under conditions of excessive data rates or over-modulation.

(c)The modular transmitter must have its own power supply regulation.

(d) The modular comply with the antenna and transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna transmitter must must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section.

(e)The modular tested in a stand-alone configuration, i.e., the module must not be transmitter must be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with The modular has buffered data inputs, it is integrated in chip. Please see schematic.pdf YES All power lines derived from the host device are regulated before energizing other circuits internal to the EC25-MX, EC25-MX MINIPCIE. Please see schematic.pdf A permanently attached antenna or unique antenna connector is not a requirement for licensed modules. YES YES The EC25-MX, EC25-MX MINIPCIE was tested in a standalone configuration via a PCMCIA extender. Please see spurious setup YES 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, ChinaEmail: info@quectel.comWebsite: www.quectel.compage 1 Quectel Wireless Solutions Company Limited the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see Section 15.31(i))mustnotbeinsideanotherdeviceduringtesting.

(f)The modular be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. transmitter must

(g) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any suchrequirements. A copy of these instructions must be included in the application for equipmentauthorizationrequirements,whicharebasedonthei ntendeduse/configurations.

(h)The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. Dated By:

2019/7/25 Signature Title: Project Manager The label position of EC25-MX, EC25-MX YES MINIPCIE is clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text: Contains FCC ID:

EC25MXGAR10A02M1G. Please see the label.pdf The EC25-MX, EC25-MX MINIPCIE is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. YES The EC25-MX, EC25-MX MINIPCIE is approved to comply with the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance YES restriction. Johnny Xiang Printed On behalf of :

(Quectel Wireless Solutions Company Limited) Telephone:

+86-2150086326-800 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, ChinaEmail: info@quectel.comWebsite: www.quectel.compage 2

 

 

Quectel Wireless Solutions Company Limited POWER OF ATTORNEY DATE: July 25, 2019 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/Han jinnan on our behalf, to apply to FCC on our equipment for FCC ID:

XMR201907EC25MX. Any and all acts carried out by TA Technology

(Shanghai) Co., Ltd. / Han jinnan on our behalf shall have the same effect as acts of our own. Sincerely, Signature:

Print name: Johnny Xiang Company: Quectel Wireless Solutions Company Limited 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, ChinaEmail: info@quectel.comWebsite: www.quectel.compage 1