FCC ID: XMR201909EC21AUX LTE Module

 

EC21 Hardware Design LTE Standard Module Series Rev. EC21_Hardware_Design_V1.7 Date: 2019-08-19 Status: Released www.quectel.com LTE Standard Module Series EC21 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. EC21_Hardware_Design 1 / 120 LTE Standard Module Series EC21 Hardware Design About the Document History Revision Date Author Description 1.0 2016-04-15 Yeoman CHEN Initial 1.1 2016-09-22 Yeoman CHEN/

Frank WANG/

Lyndon LIU 1.2 2016-11-04 Lyndon LIU/

Michael ZHANG 1. Updated frequency bands in Table 1. 2. Updated transmitting power, supported maximum baud rate of main UART, supported internet protocols, supported USB drivers of USB interface, and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4. Updated timing of turning off module in Figure 13. 5. Updated timing of resetting module in Figure 16. 6. Updated main UART supports baud rate in Chapter 3.11. 7. Added notes for ADC interface in Chapter 3.13. 8. Updated GNSS Performance in Table 21. 9. Updated operating frequencies of module in Table 23. 10. Added current consumption in Chapter 6.4. 11. Updated RF output power in Chapter 6.5. 12. Added RF receiving sensitivity in Chapter 6.6. 1. Added SGMII and WLAN interfaces in Table 2. 2. Updated function diagram in Figure 1. 3. Updated pin assignment (Top View) in Figure 2. 4. Added description of SGMII and WLAN interfaces in Table 4. 5. Added SGMII interface in Chapter 3.17. 6. Added WLAN interface in Chapter 3.18. 7. Added USB_BOOT interface in Chapter 3.19. 8. Added reference design of RF layout in Chapter 5.1.4. 9. Added current consumption of EC21-V in Chapter EC21_Hardware_Design 2 / 120 LTE Standard Module Series EC21 Hardware Design 1.3 2017-01-24 Lyndon LIU/

Rex WANG 6.4 10. Added note about SIMO in Chapter 6.6. 1. Updated frequency bands in Table 1. 2. Updated function diagram in Figure 1. 3. Updated pin assignment (top view) in Figure 2. 4. Added BT interface in Chapter 3.18.2. 5. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29. 6. Updated GNSS performance in Table 24. 7. Updated module operating frequencies in Table 26. 8. Added EC21-AUV current consumption in Table 38. 9. Updated EC21-A conducted RF receiving sensitivity of in Table 42. 10. Added EC21-J conducted RF receiving sensitivity in Table 48. 1.4 2017-03-01 Geely YANG Deleted the LTE band TDD B41 of EC21-CT 1.5 2018-03-05 Annice ZHANG/

Lyndon LIU/

Frank WANG 1. Updated functional diagram in Figure 1. 2. Updated frequency bands in Table 1. 3. Updated UMTS and GSM features in Table 2. 4. Updated description of pin 40/136/137/138. 5. Updated PWRKEY pulled down time to 500ms in chapter 3.7.1 and reference circuit in Figure 10. 6. Updated reference circuit of (U)SIM interface in Figure 17&18. 7. Updated reference circuit of USB interface in Figure 19. 8. Updated PCM mode in Chapter 3.12. 9. Updated USB_BOOT reference circuit in Chapter 3.20. 10. Added SD card interface in Chapter 3.13. 11. Updated module operating frequencies in Table 26. 12. Updated EC21 series modules current consumption in Chapter 6.5. 13. Updated EC21 series modules conducted RF receiving sensitivity in Chapter 6.6. 14. Added thermal consideration description in Chapter 6.8. 15. Updated dimension tolerance information in Chapter 7. 16. Added storage temperature range in Table 2 and Chapter 6.3. 17. Updated RF output power in Table 42. 18. Updated antenna requirements in Table 29. EC21_Hardware_Design 3 / 120 LTE Standard Module Series EC21 Hardware Design 19. Updated GPRS multi-slot classes in Table 55. 20. Updated storage information in Chapter 8.1 1. Added new variants EC21-EU and related information. 2. Updated star structure of the power supply in Figure 8. 3. Updated power-on scenario of module in Figure 12. 4. Updated reference circuit with translator chip in Figure 20. 5. Added timing sequence for entering into emergency download mode of USB_BOOT interface in Figure 32. 6. Updated GNSS frequency in Table 29. 7. Updated antenna requirements in Table 30. 8. Added EC21-EU current consumption in Table 41. 9. Added EC21-EC current consumption in Table 42. 10. Updated EC21-E conducted RF receiving sensitivity in Table 44. 11. Updated EC21-A conducted RF receiving sensitivity in Table 45. 12. Updated EC21-V conducted RF receiving sensitivity in Table 46. 13. Updated EC21-AUT conducted RF receiving sensitivity in Table 47. 14. Updated EC21-AU sensitivity in Table 51. conducted RF receiving 15. Added EC21-EU conducted RF receiving sensitivity in Table 52. 16. Added EC21-EC conducted RF receiving sensitivity 1.6 2019-04-30 Woody WU/

Nathan LIU/

Frank WANG in Table 53. 17. Updated recommended stencil 0.18mm~0.20mm and reflow soldering profile in Chapter 8.2. thickness as thermal 1.7 2019-08-19 Ward WANG/

Owen WEI 1. Added ThreadX variant EC21-AUX and updated related information in Table 1 and Chapter 2.1. 2. Deleted the information of GNSS supported on EC21-EC in Table 1 3. Updated supported protocols and USB serial driver in Table 2. 4. Updated functional diagram in Figure 1. 5. Updated notes in Chapter 3.7.1. 6. Updated EC21-E current consumption (GSM voice call) in Table 34. 7. Updated EC21-EU current consumption in Table 41. EC21_Hardware_Design 4 / 120 LTE Standard Module Series EC21 Hardware Design 8. Updated EC21-EC current consumption in Table 42. 9. Added EC21-AUX current consumption in Table 43. 10. Updated EC21-EU conducted RF receiving sensitivity in Table 53. 11. Added EC21-AUX sensitivity in Table 55. conducted RF receiving 12. Updated module bottom dimensions (bottom view) in Figure 45. 13. Added tape and reel directions in Figure 51. EC21_Hardware_Design 5 / 120 LTE Standard Module Series EC21 Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 6 Table Index ............................................................................................................................................... 9 Figure Index ............................................................................................................................................ 11 1 Introduction ..................................................................................................................................... 13 1.1. Safety Information ................................................................................................................. 14 2 Product Concept ............................................................................................................................. 18 2.1. General Description .............................................................................................................. 18 Key Features ......................................................................................................................... 19 2.2. 2.3. Functional Diagram ............................................................................................................... 22 Evaluation Board ................................................................................................................... 23 2.4. 3.6. 3 Application Interfaces ..................................................................................................................... 24 3.1. General Description .............................................................................................................. 24 Pin Assignment ..................................................................................................................... 25 3.2. 3.3. Pin Description ...................................................................................................................... 26 3.4. Operating Modes .................................................................................................................. 38 3.5. Power Saving ........................................................................................................................ 38 3.5.1. Sleep Mode.................................................................................................................. 38 3.5.1.1. UART Application ............................................................................................... 39 3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 39 3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 40 3.5.1.4. USB Application without USB Suspend Function ............................................... 41 3.5.2. Airplane Mode .............................................................................................................. 41 Power Supply ........................................................................................................................ 42 3.6.1. Power Supply Pins ....................................................................................................... 42 3.6.2. Decrease Voltage Drop ................................................................................................ 43 3.6.3. Reference Design for Power Supply ............................................................................ 44 3.6.4. Monitor the Power Supply ............................................................................................ 44 Power-on/off Scenarios ......................................................................................................... 45 3.7.1. Turn on Module Using the PWRKEY ........................................................................... 45 3.7.2. Turn off Module ............................................................................................................ 47 3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 47 3.7.2.2. Turn off Module Using AT Command ................................................................. 47 3.8. Reset Module ........................................................................................................................ 48 3.9.

(U)SIM Interface .................................................................................................................... 49 3.10. USB Interface ........................................................................................................................ 51 3.11. UART Interfaces .................................................................................................................... 53 3.12. PCM and I2C Interfaces ........................................................................................................ 55 3.13. SD Card Interface ................................................................................................................. 58 3.14. Wireless Connectivity Interfaces ........................................................................................... 59 3.7. EC21_Hardware_Design 6 / 120 LTE Standard Module Series EC21 Hardware Design 3.14.1. WLAN Interface ........................................................................................................... 62 3.14.2. BT Interface* ................................................................................................................ 62 3.15. ADC Interfaces ...................................................................................................................... 62 3.16. SGMII Interface ..................................................................................................................... 63 3.17. Network Status Indication ...................................................................................................... 66 3.18. STATUS ................................................................................................................................ 67 3.19. Behaviors of RI ..................................................................................................................... 68 3.20. USB_BOOT Interface ............................................................................................................ 69 4 GNSS Receiver ................................................................................................................................ 71 4.1. General Description .............................................................................................................. 71 4.2. GNSS Performance .............................................................................................................. 71 4.3. Layout Guidelines ................................................................................................................. 72 5 Antenna Interfaces .......................................................................................................................... 73 5.1. Main/Rx-diversity Antenna Interfaces.................................................................................... 73 5.1.1. Pin Definition ................................................................................................................ 73 5.1.2. Operating Frequency ................................................................................................... 73 5.1.3. Reference Design of RF Antenna Interface ................................................................. 74 5.1.4. Reference Design of RF Layout ................................................................................... 75 5.2. GNSS Antenna Interface ....................................................................................................... 77 Antenna Installation ............................................................................................................... 79 5.3. 5.3.1. Antenna Requirement .................................................................................................. 79 5.3.2. Recommended RF Connector for Antenna Installation ................................................ 80 6 Electrical, Reliability and Radio Characteristics .......................................................................... 82 Absolute Maximum Ratings .................................................................................................. 82 6.1. Power Supply Ratings ........................................................................................................... 83 6.2. 6.3. Operation and Storage Temperatures ................................................................................... 83 Current Consumption ............................................................................................................ 84 6.4. 6.5. RF Output Power .................................................................................................................. 98 RF Receiving Sensitivity ....................................................................................................... 99 6.6. Electrostatic Discharge ....................................................................................................... 105 6.7. 6.8. Thermal Consideration ........................................................................................................ 105 7 Mechanical Dimensions................................................................................................................ 108 7.1. Mechanical Dimensions of the Module................................................................................ 108 7.2. Recommended Footprint ...................................................................................................... 110 Design Effect Drawings of the Module ................................................................................. 111 7.3. 8 Storage, Manufacturing and Packaging ...................................................................................... 112 8.1. Storage................................................................................................................................. 112 8.2. Manufacturing and Soldering ............................................................................................... 113 8.3. Packaging ............................................................................................................................ 114 9 Appendix A References ................................................................................................................ 116 10 Appendix B GPRS Coding Schemes ........................................................................................... 120 EC21_Hardware_Design 7 / 120 LTE Standard Module Series EC21 Hardware Design 11 Appendix C GPRS Multi-slot Classes .......................................................................................... 121 12 Appendix D EDGE Modulation and Coding Schemes ................................................................ 123 EC21_Hardware_Design 8 / 120 LTE Standard Module Series EC21 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EC21 SERIES MODULE ........................................................................ 18 TABLE 2: KEY FEATURES OF EC21 MODULE ............................................................................................... 19 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 26 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 26 TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 38 TABLE 6: VBAT AND GND PINS ....................................................................................................................... 42 TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 45 TABLE 8: PIN DEFINITION OF RESET_N ....................................................................................................... 48 TABLE 9: PIN DEFINITION OF (U)SIM INTERFACE ....................................................................................... 50 TABLE 10: PIN DESCRIPTION OF USB INTERFACE ..................................................................................... 52 TABLE 11: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................. 53 TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE ......................................................................... 54 TABLE 13: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 54 TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 57 TABLE 15: PIN DEFINITION OF SD CARD INTERFACE ................................................................................ 58 TABLE 16: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES ................................................ 60 TABLE 17: PIN DEFINITION OF ADC INTERFACES ....................................................................................... 63 TABLE 18: CHARACTERISTIC OF ADC .......................................................................................................... 63 TABLE 19: PIN DEFINITION OF SGMII INTERFACE ...................................................................................... 64 TABLE 20: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ...................... 66 TABLE 21: WORKING STATE OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ................... 66 TABLE 22: PIN DEFINITION OF STATUS ........................................................................................................ 67 TABLE 23: BEHAVIORS OF RI ......................................................................................................................... 68 TABLE 24: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 69 TABLE 25: GNSS PERFORMANCE ................................................................................................................. 71 TABLE 26: PIN DEFINITION OF RF ANTENNAS ............................................................................................. 73 TABLE 27: MODULE OPERATING FREQUENCIES ........................................................................................ 73 TABLE 28: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 77 TABLE 29: GNSS FREQUENCY ....................................................................................................................... 78 TABLE 30: ANTENNA REQUIREMENTS .......................................................................................................... 79 TABLE 31: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 82 TABLE 32: POWER SUPPLY RATINGS ........................................................................................................... 83 TABLE 33: OPERATION AND STORAGE TEMPERATURES .......................................................................... 83 TABLE 34: EC21-E CURRENT CONSUMPTION ............................................................................................. 84 TABLE 35: EC21-A CURRENT CONSUMPTION ............................................................................................. 86 TABLE 36: EC21-V CURRENT CONSUMPTION ............................................................................................. 87 TABLE 37: EC21-AUT CURRENT CONSUMPTION ........................................................................................ 87 TABLE 38: EC21-AUV CURRENT CONSUMPTION ........................................................................................ 88 TABLE 39: EC21-J CURRENT CONSUMPTION .............................................................................................. 89 TABLE 40: EC21-KL CURRENT CONSUMPTION ........................................................................................... 90 TABLE 41: EC21-EU CURRENT CONSUMPTION ........................................................................................... 91 EC21_Hardware_Design 9 / 120 LTE Standard Module Series EC21 Hardware Design TABLE 42: EC21-EC CURRENT CONSUMPTION ........................................................................................... 93 TABLE 43: EC21-AUX CURRENT CONSUMPTION ........................................................................................ 95 TABLE 44: RF OUTPUT POWER ..................................................................................................................... 98 TABLE 45: EC21-E CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 99 TABLE 46: EC21-A CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 100 TABLE 47: EC21-V CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 100 TABLE 48: EC21-AUT CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 100 TABLE 49: EC21-KL CONDUCTED RF RECEIVING SENSITIVITY .............................................................. 101 TABLE 50: EC21-J CONDUCTED RF RECEIVING SENSITIVITY................................................................. 101 TABLE 51: EC21-AUV CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 101 TABLE 52: EC21-AU CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 102 TABLE 53: EC21-EU CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 103 TABLE 54: EC21-EC CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 103 TABLE 55: EC21-AUX CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 104 TABLE 56: ELECTROSTATICS DISCHARGE CHARACTERISTICS (25C, 45% RELATIVE HUMIDITY) .... 105 TABLE 57: RECOMMENDED THERMAL PROFILE PARAMETERS .............................................................. 113 TABLE 58: RELATED DOCUMENTS ............................................................................................................... 116 TABLE 59: TERMS AND ABBREVIATIONS ..................................................................................................... 116 TABLE 60: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................ 120 TABLE 61: GPRS MULTI-SLOT CLASSES .................................................................................................... 121 TABLE 62: EDGE MODULATION AND CODING SCHEMES ......................................................................... 123 EC21_Hardware_Design 10 / 120 LTE Standard Module Series EC21 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 23 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 25 FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 39 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 40 FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 40 FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 41 FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 43 FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ............................................................................ 43 FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 44 FIGURE 10: TURN ON THE MODULE BY USING DRIVING CIRCUIT ........................................................... 45 FIGURE 11: TURN ON THE MODULE BY USING KEYSTROKE .................................................................... 46 FIGURE 12: TIMING OF TURNING ON MODULE ........................................................................................... 46 FIGURE 13: TIMING OF TURNING OFF MODULE ......................................................................................... 47 FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 48 FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 49 FIGURE 16: TIMING OF RESETTING MODULE ............................................................................................. 49 FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR

................................................................................................................................................................... 50 FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR . 51 FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 52 FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 54 FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 55 FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 56 FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 56 FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 57 FIGURE 25: REFERENCE CIRCUIT OF SD CARD INTERFACE .................................................................... 58 FIGURE 26: REFERENCE CIRCUIT OF WIRELESS CONNECTIVITY INTERFACES WITH FC20 MODULE

................................................................................................................................................................... 61 FIGURE 27: SIMPLIFIED BLOCK DIAGRAM FOR ETHERNET APPLICATION ............................................. 64 FIGURE 28: REFERENCE CIRCUIT OF SGMII INTERFACE WITH PHY AR8033 APPLICATION ................. 65 FIGURE 29: REFERENCE CIRCUIT OF THE NETWORK INDICATOR .......................................................... 67 FIGURE 30: REFERENCE CIRCUITS OF STATUS ......................................................................................... 68 FIGURE 31: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 69 FIGURE 32: TIMING SEQUENCE FOR ENTERING EMERGENCY DOWNLOAD MODE ............................. 70 FIGURE 33: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 75 FIGURE 34: MICROSTRIP DESIGN ON A 2-LAYER PCB ............................................................................... 76 FIGURE 35: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB ........................................................... 76 FIGURE 36: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)

................................................................................................................................................................... 76 FIGURE 37: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)

................................................................................................................................................................... 77 EC21_Hardware_Design 11 / 120 LTE Standard Module Series EC21 Hardware Design FIGURE 38: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 78 FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 80 FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 80 FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 81 FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ................ 106 FIGURE 43: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS PCB)

................................................................................................................................................................. 106 FIGURE 44: MODULE TOP AND SIDE DIMENSIONS ................................................................................... 108 FIGURE 45: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ............................................................... 109 FIGURE 46: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................. 110 FIGURE 47: TOP VIEW OF THE MODULE ..................................................................................................... 111 FIGURE 48: BOTTOM VIEW OF THE MODULE ............................................................................................. 111 FIGURE 49: REFLOW SOLDERING THERMAL PROFILE ............................................................................. 113 FIGURE 50: TAPE AND REEL SPECIFICATIONS .......................................................................................... 115 FIGURE 51: TAPE AND REEL DIRECTIONS .................................................................................................. 115 EC21_Hardware_Design 12 / 120 LTE Standard Module Series EC21 Hardware Design 1 Introduction This document defines EC21 module and describes its air interface and hardware interfaces which are connected with customers applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC21 module. To facilitate its application in different fields, relevant reference design is also provided for customers reference. Associated with application note and user guide, customers can use EC21 module to design and set up mobile applications easily. EC21_Hardware_Design 13 / 120 LTE Standard Module Series EC21 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC21 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. EC21_Hardware_Design 14 / 120 LTE Standard Module Series EC21 Hardware Design FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR201909EC21AUX. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

GSM850: <11.206dBi GSM1900: <12.140dBi WCDMA B2/LTE B2/ LTE B7: <8dBi WCDMA B4LTE B4: <5dBi WCDMA B5/LTE B5: <9.416dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 EC21_Hardware_Design 15 / 120 LTE Standard Module Series EC21 Hardware Design If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR201909EC21AUX or Contains FCC ID: XMR201909EC21AUX must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

EC21_Hardware_Design 16 / 120 LTE Standard Module Series EC21 Hardware Design

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. EC21_Hardware_Design 17 / 120 LTE Standard Module Series EC21 Hardware Design 2 Product Concept 2.1. General Description EC21 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides GNSS1) and voice functionality2) for customers specific applications. EC21 contains 11 variants: EC21-E, EC21-A, EC21-V, EC21-AU, EC21-EU, EC21-EC, EC21-AUT, EC21-AUV, EC21-J, EC21-KL and EC21-AUX. Customers can choose a dedicated type based on the region or operator. The following table shows the frequency bands of EC21 series module. Table 1: Frequency Bands of EC21 Series Module Modules2) LTE Bands EC21-E FDD:

B1/B3/B5/B7/B8/B20 WCDMA Bands GSM Bands Rx-

diversity GNSS1) B1/B5/B8 900/1800MHz EC21-A FDD: B2/B4/B12 B2/B4/B5 EC21-V FDD: B4/B13 N N N EC21-AU3) EC21-EU EC21-AUT EC21-EC EC21-AUV EC21-J FDD:

B1/B2/B3/B4/B5/B7/B8/

B28 TDD: B40 FDD:

B1/B3/B7/B8/B20/B28A FDD:

B1/B3/B5/B7/B28 FDD:

B1/B3/B7/B8/B20/B28A FDD:

B1/B3/B5/B8/B28 FDD:

B1/B3/B8/B18/B19/B26 B1/B2/B5/B8 850/900/

1800/1900MHz B1/B8 B1/B5 B1/B8 900/1800MHz N 900/1800MHz B1/B5/B8 N N N Y Y Y Y Y Y Y Y Y GPS, GLONASS, BeiDou/

Compass, Galileo, QZSS N N N EC21_Hardware_Design 18 / 120 LTE Standard Module Series EC21 Hardware Design FDD:

B1/B3/B5/B7/B8 FDD:

B1/B2/B3/B4/B5/B7/B8/

B28 TDD: B40 EC21-KL EC21-AUX3) NOTES N N B1/B2/B4/B5/

B8 850/900/

1800/1900MHz Y Y N Y 3. 1. 2. 1) GNSS function is optional. 2) EC21 series module contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. 3) B2 band on EC21-AU and EC21-AUX module does not support Rx-diversity. Additionally, EC21-AUX is based on ThreadX OS. 4. Y = Supported. N = Not supported. With a compact profile of 29.0mm 32.0mm 2.4mm, EC21 can meet almost all requirements for M2M applications such as automotive, metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EC21 is an SMD type module which can be embedded into applications through its 144-pin pads, including 80 LCC signal pads and 64 LGA pads. 2.2. Key Features The following table describes the detailed features of EC21 module. Table 2: Key Features of EC21 Module Features Details Power Supply Transmitting Power Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V Class 4 (33dBm2dB) for GSM850 Class 4 (33dBm2dB) for EGSM900 Class 1 (30dBm2dB) for DCS1800 Class 1 (30dBm2dB) for PCS1900 Class E2 (27dBm3dB) for GSM850 8-PSK Class E2 (27dBm3dB) for EGSM900 8-PSK Class E2 (26dBm3dB) for DCS1800 8-PSK Class E2 (26dBm3dB) for PCS1900 8-PSK EC21_Hardware_Design 19 / 120 LTE Standard Module Series EC21 Hardware Design Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm2dB) for LTE-FDD bands Class 3 (23dBm2dB) for LTE-TDD bands Support up to non-CA Cat 1 FDD and TDD Support 1.4/3/5/10/15/20MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max 10Mbps (DL)/Max 5Mbps (UL) LTE-TDD: Max 8.96Mbps (DL)/Max 3.1Mbps (UL) Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL) GPRS:

Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL)/Max 85.6Kbps (UL) EDGE:

Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL)/Max 236.8Kbps (UL) Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/NITZ/

MMS/SMTP/SSL/MQTT/FILE/CMUX*/SMTPS* protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connections Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default LTE Features UMTS Features GSM Features Internet Protocol Features SMS

(U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V Audio Features PCM Interface Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame EC21_Hardware_Design 20 / 120 LTE Standard Module Series EC21 Hardware Design USB Interface UART Interfaces synchronization Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6/3.x/4.1~4.15, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc. Main UART:

Used for AT command communication and data transmission Baud rates reach up to 921600bps, 115200bps by default Support RTS and CTS hardware flow control Debug UART:

Used for Linux console and log output 115200bps baud rate SD Card Interface1) Support SD 3.0 protocol SGMII Interface1) Support 10M/100M/1000M Ethernet work mode Wireless Connectivity Interfaces1) Support a low-power SDIO 3.0 interface for WLAN and UART/PCM interfaces for Bluetooth Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Network Indication Antenna Interfaces Physical Characteristics Temperature Range Gen8C Lite of Qualcomm Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Two pins including NET_MODE and NET_STATUS to indicate network connectivity status Including main antenna interface (ANT_MAIN), Rx-diversity antenna interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS) Size: (29.00.15)mm (32.00.15)mm (2.40.2)mm Weight: approx. 4.9g Operation temperature range: -35C ~ +75C2) Extended temperature range: -40C ~ +85C3) Storage temperature range: -40C ~ +90C Firmware Upgrade USB interface or DFOTA*

RoHS All hardware components are fully compliant with EU RoHS directive EC21_Hardware_Design 21 / 120 LTE Standard Module Series EC21 Hardware Design NOTES 1) SD card, wireless connectivity and SGMII interfaces are not supported on ThreadX module. 2) Within operation temperature range, the module is 3GPP compliant. 3) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call* (emergency call is not supported on ThreadX module), etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again.

* means under development. 1. 2. 3. 4. 2.3. Functional Diagram The following figure shows a block diagram of EC21 and illustrates the major functional parts. Power management Baseband DDR+NAND flash Radio frequency Peripheral interfaces EC21_Hardware_Design 22 / 120 LTE Standard Module Series EC21 Hardware Design ANT_MAIN ANT_GNSS ANT_DIV PAM SAW Switch SAW Duplex LNA APT PA Tx PRx SAW DRx Transceiver NAND DDR2 SDRAM IQ Control Baseband PMIC Control 19.2M XO VBAT_RF VBAT_BB PWRKEY RESET_N ADCs STATUS VDD_EXT USB (U)SIM PCM I2C UARTs SGMII WLAN BT GPIOs SD Figure 1: Functional Diagram 2.4. Evaluation Board In order to help customers develop applications with EC21, Quectel supplies an evaluation board

(UMTS&LTE EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module. For more details, please refer to document [8]. EC21_Hardware_Design 23 / 120 LTE Standard Module Series EC21 Hardware Design 3 Application Interfaces

(U)SIM interface 3.1. General Description EC21 is equipped with 80 LCC pads plus 64 LGA pads that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following functions/pins/

interfaces. Power supply USB interface UART interfaces PCM and I2C interfaces SD card interface1) ADC interfaces Status indication SGMII interface1) Wireless connectivity interfaces1) USB_BOOT interface NOTE 1) SD card, wireless connectivity and SGMII interfaces are not supported on ThreadX module. EC21_Hardware_Design 24 / 120 LTE Standard Module Series EC21 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC21 module. WAKEUP_IN1) AP_READY RESERVED W_DISABLE#

NET_MODE1) NET_STATUS VDD_EXT RESERVED RESERVED GND GND USIM_GND DBG_RXD DBG_TXD USIM_PRESENCE USIM_VDD USIM_DATA USIM_CLK USIM_RST RESERVED 1 2 3 4 5 6 7 141 142 8 9 10 11 12 13 14 15 16 17 18 R E S E R V E D R E S E R V E D 1 1 4 1 1 3 129 117 130 118 131 119 132 120 133 121 134 122 135 123 1361) 124 1371) 125 1381) 126 139 127 140 128 1 1 6 1 1 5 R E S E R V E D U S B _ B O O T 1

) U S B _ V B U S G N D U S B _ D M U S B _ D P R X D T X D D T R R T S C T S D C D R I S T A T U S V B A T _ B B V B A T _ B B V B A T _ R F V B A T _ R F G N D R E S E R V E D 7 2 7 1 7 0 6 9 6 8 6 7 6 6 6 5 6 4 6 3 6 2 6 1 6 0 5 9 5 8 5 7 5 6 5 5 108 103 99 95 109 104 100 96 110 105 82 83 84 79 80 81 76 77 78 73 74 75 111 106 101 97 90 91 92 93 85 86 87 88 112 107 102 98 94 89 1 9 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 2 3 3 3 4 3 5 3 6 G N D G N D R E S E T _ N P W R K E Y 2

) P C M _ I N 3

) S D _ I N S _ D E T P C M _ O U T 3

) P C M _ S Y N C 3

) P C M _ C L K 3

) S D C 2 _ D A T A 3 S D C 2 _ D A T A 2 S D C 2 _ D A T A 1 S D C 2 _ D A T A 0 G N D S D C 2 _ C L K S D C 2 _ C M D V D D _ S D O I A N T _ D V I 54 53 52 51 50 49 48 144 143 47 46 45 44 43 42 41 40 39 38 37 GND GND GND GND GND ANT_MAIN GND RESERVED RESERVED ANT_GNSS GND ADC0 ADC1 RESERVED I2C_SDA I2C_SCL BT_CTS1) BT_RXD BT_TXD BT_RTS Power Pins GND Pins Signal Pins Bluetooth Pins WLAN Pins SGMII Pins RESERVED Pins Figure 2: Pin Assignment (Top View) NOTES 1. 1) means pins WAKEUP_IN, NET_MODE, WLAN_EN, COEX_UART_RX, COEX_UART_TX, USB_BOOT and BT_CTS cannot be pulled up before startup. 2) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. 3) means digital audio (PCM) is only supported on Telematics version. 2. 3. 4. Pins 37~40, 118, 127 and 129~139 are used for wireless connectivity interfaces, among which pads 118, 127 and 129~138 are WLAN function pins, and the rest are Bluetooth (BT) function pins. BT function is under development. EC21_Hardware_Design 25 / 120 LTE Standard Module Series EC21 Hardware Design 5. Pins 119~126 and 128 are used for SGMII interface. 6. Pins 24~27 for PCM function are multiplexing pins used for audio design on EC21 module and BT function on FC20 module. 7. SD card, wireless connectivity and SGMII interfaces (pins 37~40, 118, 127, 129~139, 119~126, 128, 23, 28~34) are not supported on ThreadX module. 8. Keep all RESERVED pins and unused pins unconnected. 9. GND pads 85~112 should be connected to ground in the design. RESERVED pads 73~84 should not be designed in schematic and PCB decal, and these pins should be served as a keepout area. 3.3. Pin Description The following tables show the pin definition of EC21 module. Table 3: I/O Parameters Definition Type AI AO DI DO IO OD PI PO Description Analog Input Analog Output Digital Input Digital Output Bidirectional Open Drain Power Input Power Output Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 59, 60 PI Power supply for modules baseband part Vmax=4.3V Vmin=3.3V Vnorm=3.8V It must be provided with sufficient current up to 0.8A. EC21_Hardware_Design 26 / 120 LTE Standard Module Series EC21 Hardware Design VBAT_RF 57, 58 PI Power supply for modules RF part Vmax=4.3V Vmin=3.3V Vnorm=3.8V VDD_EXT 7 PO Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA It must be provided with sufficient current up to 1.8A in a burst transmission. Power supply for external GPIOs pull-up circuits. If unused, keep it open. GND 8, 9, 19, 22, 36, 46, 48, 50~54, 56, 72, 85~112 Power-on/off Ground Pin Name Pin No. I/O Description DC Characteristics Comment DI DI Turn on/off the module VH=0.8V Reset signal of the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. If unused, keep it open. PWRKEY 21 RESET_N 20 Status Indication Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 61 OD Indicate the module operating status The drive current should be less than 0.9mA. NET_MODE 5 DO NET_ STATUS 6 DO USB Interface Indicate the modules network registration mode Indicate the modules network activity status VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V An external pull-up resistor is required. If unused, keep it open. 1.8V power domain. It cannot be pulled up before startup. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment EC21_Hardware_Design 27 / 120 LTE Standard Module Series EC21 Hardware Design USB_VBUS 71 PI USB power supply, used for USB detection Vmax=5.25V Vmin=3.0V Vnorm=5.0V USB_DP 69 IO USB differential data bus (+) USB_DM 70 IO USB differential data bus (-)

(U)SIM Interface Compliant with USB 2.0 standard specification. Compliant with USB 2.0 standard specification. Typical: 5.0V If unused, keep it open. Require differential impedance of 90. If unused, keep it open. Require differential impedance of 90. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USIM_GND 10 Specified ground for

(U)SIM card USIM_VDD 14 PO Power supply for

(U)SIM card USIM_DATA 15 IO Data signal of

(U)SIM card USIM_CLK 16 DO Clock signal of

(U)SIM card For 1.8V (U)SIM:

Vmax=1.9V Vmin=1.7V For 3.0V (U)SIM:

Vmax=3.05V Vmin=2.7V IOmax=50mA For 1.8V (U)SIM:

VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:

VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VOLmax=0.45V VOHmin=2.55V Either 1.8V or 3.0V is supported by the module automatically. EC21_Hardware_Design 28 / 120 LTE Standard Module Series EC21 Hardware Design USIM_RST 17 DO Reset signal of

(U)SIM card USIM_ PRESENCE 13 DI

(U)SIM card insertion detection Main UART Interface For 1.8V (U)SIM:

VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VOLmax=0.45V VOHmin=2.55V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment RI DCD CTS 62 63 64 DO Ring indicator DO Data carrier detection DO Clear to send RTS 65 DI Request to send DTR 66 DI Data terminal ready, sleep mode control TXD 67 DO Transmit data RXD 68 DI Receive data Debug UART Interface VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Pulled up by default. Low level wakes up the module. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. EC21_Hardware_Design 29 / 120 LTE Standard Module Series EC21 Hardware Design Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD 12 DO Transmit data DBG_RXD 11 DI Receive data ADC Interfaces VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment ADC0 ADC1 45 44 PCM Interface1) AI AI General purpose analog to digital converter General purpose analog to digital converter Voltage range:

0.3V to VBAT_BB If unused, keep it open. Voltage range:

0.3V to VBAT_BB If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment PCM_IN 24 DI PCM data input PCM_OUT 25 DO PCM data output PCM_SYNC 26 IO frame PCM data synchronization signal PCM_CLK 27 IO PCM clock VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep open. it 1.8V power domain. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. EC21_Hardware_Design 30 / 120 LTE Standard Module Series EC21 Hardware Design I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2C serial clock. Used for external codec I2C serial data. Used for external codec I2C_SCL 41 OD I2C_SDA 42 OD SD Card Interface An external pull-up resistor is required. 1.8V only. If unused, keep it open. An external pull-up resistor is required. 1.8V only. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment SDC2_ DATA3 28 IO SD card SDIO bus DATA3 SDC2_ DATA2 29 IO SD card SDIO bus DATA2 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. EC21_Hardware_Design 31 / 120 LTE Standard Module Series EC21 Hardware Design VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported SDC2_ DATA1 30 IO SD card SDIO bus DATA1 SDC2_ DATA0 31 IO SD card SDIO bus DATA0 SDC2_CLK 32 DO SD card SDIO bus clock SDC2_CMD 33 IO SD card SDIO bus command EC21_Hardware_Design 32 / 120 LTE Standard Module Series EC21 Hardware Design VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V SD_INS_ DET 23 DI SD card insertion detect VDD_SDIO 34 PO SD card SDIO bus pull-up power IOmax=50mA level, please refer to SD 3.0 protocol for more details. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V/2.85V configurable. Cannot be used for SD card power. If unused, keep it open. SGMII Interface Pin Name Pin No. I/O Description DC Characteristics Comment EPHY_RST_N 119 DO Ethernet PHY reset EPHY_INT_N 120 DI Ethernet PHY interrupt SGMII_ MDATA 121 IO SGMII MDIO

(Management Data Input/Output) data For 1.8V:

VOLmax=0.45V VOHmin=1.4V For 2.85V:

VOLmax=0.35V VOHmin=2.14V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V For 1.8V:

VOLmax=0.45V VOHmin=1.4V VILmax=0.58V VIHmin=1.27V For 2.85V:

1.8V/2.85V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V/2.85V power domain. If unused, keep it open. EC21_Hardware_Design 33 / 120 LTE Standard Module Series EC21 Hardware Design SGMII_ MCLK 122 DO SGMII MDIO

(Management Data Input/Output) clock VOLmax=0.35V VOHmin=2.14V VILmax=0.71V VIHmin=1.78V For 1.8V:

VOLmax=0.45V VOHmin=1.4V For 2.85V:

VOLmax=0.35V VOHmin=2.14V USIM2_VDD 128 PO SGMII MDIO pull-up power source SGMII_TX_M 123 AO SGMII transmission

- minus SGMII_TX_P 124 AO SGMII transmission

- plus SGMII_RX_P 125 AI SGMII receiving

- plus SGMII_RX_M 126 AI SGMII receiving

- minus Wireless Connectivity Interfaces 1.8V/2.85V power domain. If unused, keep it open. Configurable power source. 1.8V/2.85V power domain. External pull-up for SGMII MDIO pins. If unused, keep it open. Connect with a 0.1uF capacitor, and is close to the PHY side. If unused, keep it open. Connect with a 0.1uF capacitor, and is close to the PHY side. If unused, keep it open. Connect with a 0.1uF capacitor, and is close to EC21 module. If unused, keep it open. Connect with a 0.1uF capacitor, and is close to EC21 module. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment EC21_Hardware_Design 34 / 120 LTE Standard Module Series EC21 Hardware Design SDC1_ DATA3 129 IO WLAN SDIO data bus D3 SDC1_ DATA2 130 IO WLAN SDIO data bus D2 SDC1_ DATA1 131 IO WLAN SDIO data bus D1 SDC1_ DATA0 132 IO WLAN SDIO data bus D0 SDC1_CLK 133 DO WLAN SDIO bus clock VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V SDC1_CMD 134 DO WLAN SDIO bus command VOLmax=0.45V VOHmin=1.35V PM_ENABLE 127 DO WLAN power control WAKE_ON_ WIRELESS 135 DI Wake up the host

(EC21 module) by FC20 module. VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V WLAN_EN 136 DO WLAN function control via FC20 module VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Active low. If unused, keep it open. 1.8V power domain. Active high. Cannot be pulled up before startup. If unused, keep it open. EC21_Hardware_Design 35 / 120 LTE Standard Module Series EC21 Hardware Design COEX_UART_ RX 137 DI LTE/WLAN&BT coexistence signal VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V COEX_UART_ TX 138 DO LTE/WLAN&BT coexistence signal VOLmax=0.45V VOHmin=1.35V WLAN_SLP_ CLK 118 DO WLAN sleep clock BT_RTS 37 DI BT UART request to send VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V BT_TXD 38 DO BT UART transmit data VOLmax=0.45V VOHmin=1.35V BT_RXD 39 DI BT UART receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V BT_CTS 40 DO BT UART clear to send VOLmax=0.45V VOHmin=1.35V BT_EN 139 DO BT function control via FC20 module VOLmax=0.45V VOHmin=1.35V RF Interfaces 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment ANT_DIV 35 AI Diversity antenna ANT_MAIN 49 IO Main antenna ANT_GNSS 47 AI GNSS antenna 50 impedance. If unused, keep it open. 50 impedance 50 impedance. If unused, keep it open. EC21_Hardware_Design 36 / 120 LTE Standard Module Series EC21 Hardware Design Other Interface Pins Pin Name Pin No. I/O Description DC Characteristics Comment WAKEUP_IN 1 DI Sleep mode control W_DISABLE# 4 DI Airplane mode control AP_READY 2 DI USB_BOOT Interface Application processor sleep state detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. Low level wakes up the module. If unused, keep it open. 1.8V power domain. Pull-up by default. At low voltage level, module can enter airplane mode. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USB_BOOT 115 DI RESERVED Pins Force the module to enter emergency download mode. VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. It is recommended to reserve test point. Pin Name Pin No. I/O Description DC Characteristics Comment RESERVED 3, 18, 43, 55, 73~84, 113, 114, 116, 117, 140-144. Reserved Keep these pins unconnected. EC21_Hardware_Design 37 / 120 LTE Standard Module Series EC21 Hardware Design NOTES 1. 1) PCM interface pins are multiplexing pins used for audio design on EC25 module and BT function on FC20 module. SD card, wireless connectivity and SGMII interfaces pins are not supported on ThreadX module. 1. 2. BT function is under development. 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Details Idle Talk/Data Software is active. The module has registered on the network, and it is ready to send and receive data. Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. In this mode, the power management unit shuts down the power supply. Software is not active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. Normal Operation Minimum Functionality Mode Airplane Mode Sleep Mode Power Down Mode 3.5. Power Saving 3.5.1. Sleep Mode EC21 is able to reduce its current consumption to a minimum value during the sleep mode. The following section describes power saving procedures of EC21 module. EC21_Hardware_Design 38 / 120 LTE Standard Module Series EC21 Hardware Design 3.5.1.1. UART Application If the host communicates with module via UART interface, the following preconditions can let the module enter into sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Drive DTR to high level. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module. When EC21 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.19 for details about RI behaviors. AP_READY will detect the sleep state of the host (can be configured to high level or low level detection). Please refer to AT+QCFG="apready" command for details. 3.5.1.2. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. EC21_Hardware_Design 39 / 120 LTE Standard Module Series EC21 Hardware Design Figure 4: Sleep Mode Application with USB Remote Wakeup Sending data to EC21 via USB will wake up the module. When EC21 has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend and resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. Figure 5: Sleep Mode Application with RI EC21_Hardware_Design 40 / 120 LTE Standard Module Series EC21 Hardware Design Sending data to EC21 via USB will wake up the module. When EC21 has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected via an additional control circuit to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. Disconnect USB_VBUS. The following figure shows the connection between the module and the host. Figure 6: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and the host. For more details about EC21 power management application, please refer to document [1]. 3.5.2. Airplane Mode When the module enters airplane mode, the RF function does not work, and all AT commands correlative with RF function will be inaccessible. This mode can be set via the following ways. EC21_Hardware_Design 41 / 120 LTE Standard Module Series EC21 Hardware Design Hardware:

The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. Software:

AT+CFUN command provides the choice of the functionality level through setting <fun> into 0, 1 or 4. AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled. AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode. RF function is disabled. NOTES 1. The W_DISABLE# control function is disabled in firmware by default. It can be enabled by AT+QCFG="airplanecontrol" command, and this command is under development. 2. The execution of AT+CFUN command will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EC21 provides four VBAT pins for connection with the external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for modules RF part. Two VBAT_BB pins for modules baseband part. The following table shows the details of VBAT pins and ground pins. Table 6: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 57, 58 VBAT_BB 59, 60 GND 8, 9, 19, 22, 36, 46, 48, 50~54, 56, 72, 85~112 Power supply for modules RF part. Power supply for modules baseband part. 3.3 3.3 3.8 3.8 4.3 4.3 Ground

-

0

-

V V V EC21_Hardware_Design 42 / 120 LTE Standard Module Series EC21 Hardware Design 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100F with low ESR (ESR=0.7) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm; and the width of VBAT_RF trace should be no less than 2mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to avoid the damage caused by electric surge and ESD, it is suggested that a TVS diode with suggested low reverse stand-off voltage VRWM 4.5V, low clamping voltage VC and high reverse peak pulse current IPP should be used. The following figure shows the star structure of the power supply. VBAT D1 WS4.5D3HV

+

C1 100uF C2 100nF C3 33pF C4 10pF

+

C5 100uF C6 100nF C7 33pF C8 10pF VBAT_RF VBAT_BB Module Figure 8: Star Structure of the Power Supply EC21_Hardware_Design 43 / 120 LTE Standard Module Series EC21 Hardware Design 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2.0A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5.0V input power source. The typical output of the power supply is about 3.8V and the maximum load current is 3.0A. Figure 9: Reference Circuit of Power Supply NOTE In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 3.6.4. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. EC21_Hardware_Design 44 / 120 LTE Standard Module Series EC21 Hardware Design 3.7. Power-on/off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name Pin No. PWRKEY 21 I/O DI Description Comment Turn on/off the module The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When EC21 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms. It is recommended to use an open drain/collector driver to control the PWRKEY. After STATUS pin (require external pull-up resistor) outputs a low level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. 500ms Turn-on pulse 4.7K PWRKEY 10nF 47K Figure 10: Turn on the Module by Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. EC21_Hardware_Design 45 / 120 LTE Standard Module Series EC21 Hardware Design Figure 11: Turn on the Module by Using Keystroke The power-on scenario is illustrated in the following figure. NOTE 1 VBAT PWRKEY VDD_EXT BOOT_CONFIG &

USB_BOOT Pins RESET_N STATUS

(OD) UART USB 500ms VH=0.8V VIL0.5V About 100ms 100ms. After this time, the BOOT_CONFIG pins can be set high level by external circuit. 2.5s 12s 13s Inactive Inactive Active Active Figure 12: Timing of Turning on Module EC21_Hardware_Design 46 / 120 LTE Standard Module Series EC21 Hardware Design NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30ms. 2. PWRKEY can be pulled down directly to GND with a recommended 10k resistor if module needs to be powered on automatically and shutdown is not needed. 3.7.2. Turn off Module The following procedures can be used to turn off the module:

Normal power-off procedure: Turn off the module using the PWRKEY pin. Normal power-off procedure: Turn off the module using AT+QPOWD command. 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-off procedure after the PWRKEY is released. The power-off scenario is illustrated in the following figure. VBAT PWRKEY STATUS

(OD) Module Status 650ms 29.5s RUNNING Power-off procedure OFF Figure 13: Timing of Turning off Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer to document [2] for details about AT+QPOWD command. EC21_Hardware_Design 47 / 120 LTE Standard Module Series EC21 Hardware Design NOTE 1. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 2. When turning off module with AT command, please keep PWRKEY at high level after the execution of power-off command. Otherwise the module will be turned on again after successfully turn-off. 3.8. Reset Module The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N to a low level voltage for time between 150ms and 460ms. Table 8: Pin Definition of RESET_N Pin Name Pin No. RESET_N 20 I/O DI Description Comment Reset the module 1.8V power domain The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 14: Reference Circuit of RESET_N by Using Driving Circuit EC21_Hardware_Design 48 / 120 LTE Standard Module Series EC21 Hardware Design Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure. Figure 16: Timing of Resetting Module NOTES 1. Use RESET_N only when failed to turn off the module by AT+QPOWD command and PWRKEY pin. 2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. EC21_Hardware_Design 49 / 120 LTE Standard Module Series EC21 Hardware Design Table 9: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Description Comment USIM_VDD USIM_DATA USIM_CLK USIM_RST USIM_ PRESENCE USIM_GND 14 15 16 17 13 10 PO Power supply for (U)SIM card Either 1.8V or 3.0V is supported by the module automatically. IO Data signal of (U)SIM card DO Clock signal of (U)SIM card DO Reset signal of (U)SIM card DI

(U)SIM card insertion detection 1.8V power domain. If unused, keep it open. Specified ground for (U)SIM card EC21 supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections, and is disabled by default. Please refer to document [2] for more details about AT+QSIMDET command. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. EC21_Hardware_Design 50 / 120 LTE Standard Module Series EC21 Hardware Design Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers applications, please follow the criteria below in (U)SIM circuit design:

Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as close to (U)SIM card connector as possible. If the ground is complete on customers PCB, USIM_GND can be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should not be more than 15pF. The 0 resistors should be added in series between the module and the (U)SIM card to facilitate debugging. The 33pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the

(U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 3.10. USB Interface EC21 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface can only serves as a slave device and is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface. EC21_Hardware_Design 51 / 120 LTE Standard Module Series EC21 Hardware Design Table 10: Pin Description of USB Interface Pin Name Pin No. I/O Description USB_DP USB_DM 69 70 USB_VBUS 71 GND 72 IO IO PI USB differential data bus (+) USB differential data bus (-) USB power supply, used for USB detection Ground Comment Require differential impedance of 90 Require differential impedance of 90 Typical 5.0V For more details about the USB 2.0 specifications, please visit http://www.usb.org/home. The USB interface is recommended to be reserved for firmware upgrade in customers designs. The following figure shows a reference circuit of USB interface. Figure 19: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. EC21_Hardware_Design 52 / 120 LTE Standard Module Series EC21 Hardware Design Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2.0pF. Keep the ESD protection components to the USB connector as close as possible. 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. The main UART interface supports 4800bps, 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps and 921600bps baud rates, and the default is 115200bps. This interface is used for data transmission and AT command communication. The debug UART interface supports 115200bps baud rate. It is used for Linux console and log output. The following tables show the pin definition of the UART interfaces. Table 11: Pin Definition of Main UART Interface Pin Name Pin No. 62 63 64 65 66 67 68 RI DCD CTS RTS DTR TXD RXD I/O DO DO DO DI DI DO DI Description Ring indicator Data carrier detection Clear to send Request to send Data terminal ready, sleep mode control Transmit data Receive data Comment 1.8V power domain EC21_Hardware_Design 53 / 120 LTE Standard Module Series EC21 Hardware Design Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. DBG_TXD DBG_RXD 12 11 I/O DO DI Description Transmit data Receive data The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O Comment 1.8V power domain Parameter VIL VIH VOL VOH Min.

-0.3 1.2 0 1.35 Max. 0.6 2.0 0.45 1.8 Unit V V V V The module provides 1.8V UART interface. A level translator should be used if customers application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. VDD_EXT 0.1uF 1 0 K 120K RI DCD CTS RTS DTR TXD RXD 51K VCCA VCCB 0.1uF VDD_MCU OE A1 A2 A3 A4 A5 A6 A7 A8 Translator GND B1 B2 B3 B4 B5 B6 B7 B8 51K RI_MCU DCD_MCU CTS_MCU RTS_MCU DTR_MCU TXD_MCU RXD_MCU Figure 20: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. EC21_Hardware_Design 54 / 120 LTE Standard Module Series EC21 Hardware Design Another example with transistor translation circuit is shown as below. The circuit design of dotted line section can refer to the design of solid line section, in terms of both module input and output circuit designs, but please pay attention to the direction of connection. Figure 21: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12. PCM and I2C Interfaces EC21 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface:

Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK at 8KHz PCM_SYNC, and also supports 4096KHz PCM_CLK at 16KHz PCM_SYNC. In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK and an 8KHz, 50% duty cycle PCM_SYNC. EC21_Hardware_Design 55 / 120 LTE Standard Module Series EC21 Hardware Design EC21 supports 16-bit linear data format. The following figures show the primary modes timing relationship with 8KHz PCM_SYNC and 2048KHz PCM_CLK, as well as the auxiliary modes timing relationship with 8KHz PCM_SYNC and 256KHz PCM_CLK. Figure 22: Primary Mode Timing Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. EC21_Hardware_Design 56 / 120 LTE Standard Module Series EC21 Hardware Design Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN PCM_OUT 24 25 PCM_SYNC 26 PCM_CLK I2C_SCL I2C_SDA 27 41 42 DI DO IO IO OD OD PCM data input 1.8V power domain PCM data output 1.8V power domain PCM data frame synchronization signal 1.8V power domain PCM data bit clock 1.8V power domain I2C serial clock Require external pull-up to 1.8V I2C serial data Require external pull-up to 1.8V Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC. Please refer to document [2] for more details about AT+QDAI command. The following figure shows a reference design of PCM interface with external codec IC. Figure 24: Reference Circuit of PCM Application with Audio Codec NOTES 1. It is recommended to reserve an RC (R=22, C=22pF) circuits on the PCM lines, especially for PCM_CLK. 2. EC21 works as a master device pertaining to I2C interface. EC21_Hardware_Design 57 / 120 LTE Standard Module Series EC21 Hardware Design 3.13. SD Card Interface EC21 supports SDIO 3.0 interface for SD card. The following table shows the pin definition of SD card interface. Table 15: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SDC2_DATA3 SDC2_DATA2 SDC2_DATA1 SDC2_DATA0 SDC2_CLK SDC2_CMD VDD_SDIO 28 29 30 31 32 33 34 IO IO IO IO SD card SDIO bus DATA3 SD card SDIO bus DATA2 SD card SDIO bus DATA1 SD card SDIO bus DATA0 DO SD card SDIO bus clock IO SD card SDIO bus command PO SD card SDIO bus pull up power SD_INS_DET 23 DI SD card insertion detection The following figure shows a reference design of SD card. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. 1.8V/2.85V configurable. Cannot be used for SD card power. If unused, keep it open. 1.8V power domain. If unused, keep it open. Figure 25: Reference Circuit of SD Card Interface EC21_Hardware_Design 58 / 120 LTE Standard Module Series EC21 Hardware Design In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with:

SD_INS_DET must be connected. The voltage range of SD card power supply VDD_3V is 2.7V~3.6V and a sufficient current up to 0.8A should be provided. As the maximum output current of VDD_SDIO is 50mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card. To avoid jitter of bus, resistors R7~R11 are needed to pull up the SDIO to VDD_SDIO. Value of these resistors is among 10K~100K and the recommended value is 100K. VDD_SDIO should be used as the pull-up power. In order to adjust signal quality, it is recommended to add 0 resistors R1~R6 in series between the module and the SD card. The bypass capacitors C1~C6 are reserved and not mounted by default. All resistors and bypass capacitors should be placed close to the module. In order to offer good ESD protection, it is recommended to add a TVS diode on SD card pins near the SD card connector with junction capacitance less than 15pF. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DCDC signals, etc. It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data trace is 50 (10%). Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of SDIO bus should be less than 15pF. It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1mm and the total routing length less than 50mm. The total trace length inside the module is 27mm, so the exterior total trace length should be less than 23mm. NOTE SD card interface is not supported on ThreadX module. 3.14. Wireless Connectivity Interfaces EC21 supports a low-power SDIO 3.0 interface for WLAN and UART/PCM interfaces for BT function. The following table shows the pin definition of wireless connectivity interfaces. EC21_Hardware_Design 59 / 120 LTE Standard Module Series EC21 Hardware Design Table 16: Pin Definition of Wireless Connectivity Interfaces Pin Name Pin No. I/O Description Comment WLAN Part SDC1_DATA3 SDC1_DATA2 SDC1_DATA1 SDC1_DATA0 SDC1_CLK SDC1_CMD 129 130 131 132 133 134 IO IO IO IO DO IO WLAN SDIO data bus D3 1.8V power domain WLAN SDIO data bus D2 1.8V power domain WLAN SDIO data bus D1 1.8V power domain WLAN SDIO data bus D0 1.8V power domain WLAN SDIO bus clock 1.8V power domain WLAN SDIO bus command 1.8V power domain WLAN_EN 136 DO WLAN function control via FC20 module. Coexistence and Control Part PM_ENABLE 127 DO WLAN power control 1.8V power domain Active high. It cannot be pulled up before startup 1.8V power domain. Active high. 1.8V power domain 1.8V power domain. It cannot be pulled up before startup 1.8V power domain. It cannot be pulled up before startup Wake up the host (EC21 module) by FC20 module LTE/WLAN&BT coexistence signal LTE/WLAN&BT coexistence signal WLAN sleep clock BT UART request to send 1.8V power domain BT UART transmit data 1.8V power domain BT UART receive data 1.8V power domain BT UART clear to send 1.8V power domain It cannot be pulled up before startup WAKE_ON_ WIRELESS 135 COEX_UART_RX 137 COEX_UART_TX 138 WLAN_SLP_CLK 118 BT Part BT_RTS BT_TXD BT_RXD BT_CTS 37 38 39 40 DI DI DO DO DI DO DI DO EC21_Hardware_Design 60 / 120 LTE Standard Module Series EC21 Hardware Design PCM_IN1) PCM_OUT1) PCM_SYNC1) PCM_CLK1) 24 25 26 27 DI DO IO IO BT_EN 139 DO PCM data input 1.8V power domain PCM data output 1.8V power domain PCM data frame synchronization signal PCM data bit clock BT function control via FC20 module. 1.8V power domain 1.8V power domain 1.8V power domain Active high. The following figure shows a reference design of wireless connectivity interfaces with Quectel FC20 module. PM_ENABLE DCDC/LDO VDD_3V3 FC20 Module Module POWER WLAN VDD_EXT SDC1_DATA3 SDC1_DATA2 SDC1_DATA1 SDC1_DATA0 SDC1_CLK SDC1_CMD WLAN_EN WLAN_SLP_CLK WAKE_ON_WIRELESS COEX COEX_UART_RX COEX_UART_TX Bluetooth*

BT_EN BT_RTS BT_CTS BT_TXD BT_RXD PCM_IN PCM_OUT PCM_SYNC PCM_CLK VIO SDIO_D3 SDIO_D2 SDIO_D1 SDIO_D0 SDIO_CLK SDIO_CMD WLAN_EN 32KHZ_IN WAKE_ON_WIRELESS LTE_UART_TXD LTE_UART_RXD BT_EN BT_UART_RTS BT_UART_CTS BT_UART_RXD BT_UART_TXD PCM_OUT PCM_IN PCM_SYNC PCM_CLK Figure 26: Reference Circuit of Wireless Connectivity Interfaces with FC20 Module NOTES 1. FC20 module can only be used as a slave device. 2. When BT function is enabled on EC21 module, PCM_SYNC and PCM_CLK pins are only used to output signals. BT function is under development. 1) Pads 24~27 are multiplexing pins used for audio design on EC21 module and BT function on BT 3. EC21_Hardware_Design 61 / 120 LTE Standard Module Series EC21 Hardware Design module. 4. Wireless connectivity interfaces are not supported on ThreadX module. 5. For more information about wireless connectivity interfaces, please refer to document [5]. 3.14.1. WLAN Interface EC21 provides a low power SDIO 3.0 interface and control interface for WLAN design. SDIO interface supports the SDR mode (up to 50MHz). As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles:

It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 5010%. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DCDC signals, etc. It is recommended to keep matching length between CLK and DATA/CMD less than 1mm and total routing length less than 50mm. Keep termination resistors within 15~24 on clock lines near the module and keep the route distance from the module clock pins to termination resistors less than 5mm. Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than 15pF. 3.14.2. BT Interface*

EC21 supports a dedicated UART interface and a PCM interface for BT application. Further information about BT interface will be added in future version of this document. NOTE

* means under development. 3.15. ADC Interfaces The module provides two analog-to-digital converter (ADC) interfaces. AT+QADC=0 command can be used to read the voltage value on ADC0 pin. AT+QADC=1 command can be used to read the voltage value on ADC1 pin. For more details about these AT commands, please refer to document [2]. EC21_Hardware_Design 62 / 120 LTE Standard Module Series EC21 Hardware Design In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground. Table 17: Pin Definition of ADC Interfaces Pin Name Pin No. Description ADC0 ADC1 45 44 General purpose analog to digital converter General purpose analog to digital converter The following table describes the characteristic of ADC function. Table 18: Characteristic of ADC Parameter ADC0 Voltage Range ADC1 Voltage Range ADC Resolution NOTES Min. 0.3 0.3 Typ. Max. 15 VBAT_BB VBAT_BB Unit V V bits 1. ADC input voltage must not exceed that of VBAT_BB. 2. It is prohibited to supply any voltage to ADC pins when VBAT power supply is removed. 3. It is recommended to use a resistor divider circuit for ADC application. 3.16. SGMII Interface EC21 includes an integrated Ethernet MAC with an SGMII interface and two management interfaces. The key features of the SGMII interface are shown below:

Support 10M/100M/1000M Ethernet work mode Support VLAN tagging Support IEEE1588 and Precision Time Protocol (PTP) Can be used to connect to external Ethernet PHY like AR8033, or to an external switch Management interfaces support dual voltage 1.8V/2.85V IEEE802.3 compliant EC21_Hardware_Design 63 / 120 LTE Standard Module Series EC21 Hardware Design The following table shows the pin definition of SGMII interface. Table 19: Pin Definition of SGMII Interface Pin Name Pin No. I/O Description Comment Control Signal Part EPHY_RST_N 119 DO Ethernet PHY reset 1.8V/2.85V power domain EPHY_INT_N 120 SGMII_MDATA 121 DI IO SGMII_MCLK 122 DO Ethernet PHY interrupt SGMII MDIO (Management Data Input/Output) data SGMII MDIO (Management Data Input/Output) clock USIM2_VDD 128 PO SGMII MDIO pull-up power source SGMII Signal Part SGMII_TX_M 123 AO SGMII transmission - minus SGMII_TX_P 124 AO SGMII transmission - plus SGMII_RX_P 125 SGMII_RX_M 126 AI AI SGMII receiving - plus SGMII receiving - minus 1.8V power domain 1.8V/2.85V power domain 1.8V/2.85V power domain Configurable power source. 1.8V/2.85V power domain. External pull-up power source for SGMII MDIO pins. Connect with a 0.1uF capacitor, close to the PHY side. Connect with a 0.1uF capacitor, close to the PHY side. Connect with a 0.1uF capacitor, close to EC21 module. Connect with a 0.1uF capacitor, close to EC21 module. The following figure shows the simplified block diagram for Ethernet application. SGMII Module AR8033 MDI Ethernet Transformer RJ45 Control Figure 27: Simplified Block Diagram for Ethernet Application EC21_Hardware_Design 64 / 120 LTE Standard Module Series EC21 Hardware Design The following figure shows a reference design of SGMII interface with PHY AR8033 application. Figure 28: Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in customers applications, please follow the criteria below in the Ethernet PHY circuit design:

Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. Keep the maximum trace length less than 10 inch and keep skew on the differential pairs less than 20mil. The differential impedance of SGMII data trace is 10010%, and the reference ground of the area should be complete. Make sure the trace spacing between SGMII RX and TX is at least 3 times of the trace width, and the same to the adjacent signal traces. NOTE SGMII interface is not supported on ThreadX module. EC21_Hardware_Design 65 / 120 LTE Standard Module Series EC21 Hardware Design 3.17. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two pins which are NET_MODE and NET_STATUS. The following tables describe the pin definition and logic level changes in different network status. Table 20: Pin Definition of Network Connection Status/Activity Indicator Pin Name Pin No. I/O Description NET_MODE 5 NET_STATUS 6 DO DO Indicate the modules network registration mode Indicate the modules network activity status Comment 1.8V power domain. Cannot be pulled up before startup 1.8V power domain Table 21: Working State of Network Connection Status/Activity Indicator Pin Name Logic Level Changes Network Status NET_MODE Always High Always Low Registered on LTE network Others NET_STATUS Flicker slowly (200ms High/1800ms Low) Network searching Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure. EC21_Hardware_Design 66 / 120 LTE Standard Module Series EC21 Hardware Design Figure 29: Reference Circuit of the Network Indicator 3.18. STATUS The STATUS pin is an open drain output for indicating the modules operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 22: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 61 OD Indicate the modules operation status An external pull-up resistor is required. If unused, keep it open. The following figure shows different circuit designs of STATUS, and customers can choose either one according to customers application demands. EC21_Hardware_Design 67 / 120 LTE Standard Module Series EC21 Hardware Design Figure 30: Reference Circuits of STATUS NOTES The status pin cannot be used as indication of module shutdown status when VBAT power supply is removed. 3.19. Behaviors of RI AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. No matter on which port URC is presented, the URC will trigger the behaviors of RI pin. NOTE URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. In addition, RI behavior can be configured flexibly. The default behaviors of the RI is shown as below. Table 23: Behaviors of RI Response RI keeps at high level RI outputs 120ms low pulse when a new URC returns State Idle URC EC21_Hardware_Design 68 / 120 LTE Standard Module Series EC21 Hardware Design The RI behavior can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2] for details. 3.20. USB_BOOT Interface EC21 provides a USB_BOOT pin. Customers can pull up USB_BOOT to 1.8V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface. Table 24: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description USB_BOOT 115 DI Force the module to enter emergency download mode The following figure shows a reference circuit of USB_BOOT interface. Module Comment 1.8V power domain. Active high. It is recommended to reserve a test point. USB_BOOT Test point 4.7K Close to test point TVS VDD_EXT Figure 31: Reference Circuit of USB_BOOT Interface EC21_Hardware_Design 69 / 120 LTE Standard Module Series EC21 Hardware Design NOTE 1 VBAT PWRKEY VDD_EXT USB_BOOT RESET_N VH=0.8V 500ms VIL0.5V About 100ms USB_BOOT can be pulled up to 1.8V before VDD_EXT Is powered up, and the module will enter emergency download mode when it is powered on. Figure 32: Timing Sequence for Entering Emergency Download Mode NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30ms. 2. When using MCU to control module to enter the emergency download mode, please follow the above timing sequence. It is not recommended to pull up USB_BOOT to 1.8V before powering up VBAT. Short the test points as shown in Figure 31 can manually force the module to enter download mode. EC21_Hardware_Design 70 / 120 LTE Standard Module Series EC21 Hardware Design 4 GNSS Receiver 4.1. General Description EC21 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC21 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC21 GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows the GNSS performance of EC21. Table 25: GNSS Performance Parameter Description Cold start Conditions Autonomous Sensitivity

(GNSS) TTFF

(GNSS) Reacquisition Autonomous Tracking Cold start

@open sky Warm start

@open sky Autonomous Autonomous XTRA enabled Autonomous XTRA enabled Typ.

-146

-157

-157 35 18 26 2.2 Unit dBm dBm dBm s s s s EC21_Hardware_Design 71 / 120 LTE Standard Module Series EC21 Hardware Design Hot start

@open sky CEP-50 Autonomous XTRA enabled Autonomous

@open sky 2.5 1.8

<2.5 s s m Accuracy

(GNSS) NOTES 1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes position within 3 minutes after executing cold start command. 4.3. Layout Guidelines The following layout guidelines should be taken into account in customers designs. Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna. Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be kept away from the antennas. Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar isolation and protection. Keep 50 characteristic impedance for the ANT_GNSS trace. Please refer to Chapter 5 for GNSS antenna reference design and antenna installation information. EC21_Hardware_Design 72 / 120 LTE Standard Module Series EC21 Hardware Design 5 Antenna Interfaces EC21 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna ports have an impedance of 50. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 26: Pin Definition of RF Antennas Pin Name Pin No. ANT_MAIN ANT_DIV 49 35 I/O IO AI 5.1.2. Operating Frequency Table 27: Module Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 Transmit 824~849 880~915 1710~1785 1850~1910 1920~1980 Description Comment Main antenna 50 impedance Receive diversity antenna 50 impedance. If unused, keep it open. Receive 869~894 925~960 1805~1880 1930~1990 2110~2170 Unit MHz MHz MHz MHz MHz EC21_Hardware_Design 73 / 120 LTE Standard Module Series EC21 Hardware Design WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B26 LTE-FDD B28 LTE-TDD B40 1850~1910 1710~1755 824~849 880~915 1920~1980 1850~1910 1710~1785 1710~1755 824~849 2500~2570 880~915 699~716 777~787 815~830 830~845 832~862 814~849 703~748 1930~1990 2110~2155 869~894 925~960 2110~2170 1930~1990 1805~1880 2110~2155 869~894 2620~2690 925~960 729~746 746~756 860~875 875~890 791~821 859~894 758~803 2300~2400 2300~2400 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A -type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. EC21_Hardware_Design 74 / 120 LTE Standard Module Series EC21 Hardware Design Figure 33: Reference Circuit of RF Antenna Interface NOTES 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. 2. ANT_DIV function is enabled by default. AT+QCFG="diversity",0 command can be used to disable receive diversity. Please refer to document [2] for details. 3. Place the -type matching components (R1&C1&C2, R2&C3&C4) as close to the antenna as possible. 5.1.4. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled as 50. The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, height from the reference ground to the signal layer (H), and the space between the RF trace and the ground (S). Microstrip and coplanar waveguide are typically used in RF layout to control characteristic impedance. The following figures are reference designs of microstrip or coplanar waveguide with different PCB structures. EC21_Hardware_Design 75 / 120 LTE Standard Module Series EC21 Hardware Design

. Figure 34: Microstrip Design on a 2-layer PCB Figure 35: Coplanar Waveguide Design on a 2-layer PCB Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EC21_Hardware_Design 76 / 120 LTE Standard Module Series EC21 Hardware Design Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:

Please use an impedance simulation tool to control the characteristic impedance of RF traces as 50. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right angle traces should be changed to curved ones. There should be clearance area under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W). For more details about RF layout, please refer to document [6]. 5.2. GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 28: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 47 AI GNSS antenna 50 impedance. If unused, keep it open. EC21_Hardware_Design 77 / 120 LTE Standard Module Series EC21 Hardware Design Table 29: GNSS Frequency Type GPS GLONASS Galileo BeiDou QZSS Frequency 1575.421.023 1597.5~1605.8 1575.422.046 1561.0982.046 1575.42 A reference design of GNSS antenna is shown as below. Unit MHz MHz MHz MHz MHz Figure 38: Reference Circuit of GNSS Antenna NOTES If the module is designed with a passive antenna, then the VDD circuit is not needed. 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. EC21_Hardware_Design 78 / 120 LTE Standard Module Series EC21 Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 30: Antenna Requirements Type Requirements Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: <1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain: < 17dB VSWR: 2 Efficiency: > 30%

Max input power: 50W Input impedance: 50 Cable insertion loss: <1dB

(GSM850, EGSM900, WCDMA B5/B8, LTE-FDD B5/B8/B12/B13/B18/B19/B20/B26/B28) Cable insertion loss: <1.5dB

(DCS1800, PCS1900, WCDMA B1/B2/B4, LTE B1/B2/B3/B4) Cable insertion loss <2dB

(LTE-FDD B7, LTE-TDD B40) GNSS1) GSM/WCDMA/LTE NOTE 1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. EC21_Hardware_Design 79 / 120 LTE Standard Module Series EC21 Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.FL-LP Connectors EC21_Hardware_Design 80 / 120 LTE Standard Module Series EC21 Hardware Design The following figure describes the space factor of mated connector. Figure 41: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. EC21_Hardware_Design 81 / 120 LTE Standard Module Series EC21 Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage at Digital Pins Voltage at ADC0 Voltage at ADC1 Min.

-0.3

-0.3 0 0

-0.3 0 0 Max. Unit 4.7 5.5 0.8 1.8 2.3 VBAT_BB VBAT_BB V V A A V V V EC21_Hardware_Design 82 / 120 LTE Standard Module Series EC21 Hardware Design 6.2. Power Supply Ratings Table 32: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF Voltage drop during burst transmission Peak supply current

(during transmission slot) USB power supply, used for USB detection VBAT IVBAT USB_VBUS The actual input voltages must be kept between the minimum and maximum values. Maximum power control level on EGSM900 Maximum power control level on EGSM900 3.3 3.8 4.3 V 400 mV 1.8 2.0 A 3.0 5.0 5.25 V 6.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table. Table 33: Operation and Storage Temperatures Parameter Operation Temperature Range1) Extended Temperature Range2) Storage Temperature Range Min.

-35

-40

-40 Typ.

+25 Max.

+75

+85

+90 Unit C C C NOTES 1. 2. 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call* (emergency call is not supported on ThreadX modules), etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum EC21_Hardware_Design 83 / 120 LTE Standard Module Series EC21 Hardware Design and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operation temperature levels, the module will meet 3GPP specifications again.

* means under development. 3. 6.4. Current Consumption The values of current consumption are shown below. Table 34: EC21-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) 13 1.4 EGSM900 @DRX=9 (USB disconnected) 1.8 DCS1800 @DRX=9 (USB disconnected) Sleep state WCDMA PF=64 (USB disconnected) IVBAT Idle state

(GNSS OFF) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) EGSM900 @DRX=5 (USB disconnected) 22.0 EGSM900 @DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) GPRS data transfer

(GNSS OFF) EGSM900 4DL/1UL @32.3dBm EGSM900 3DL/2UL @32.18dBm uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 1.8 2.4 1.9 3.2 2.1 32.0 22.5 32.7 22.5 32.5 220 387 EC21_Hardware_Design 84 / 120 LTE Standard Module Series EC21 Hardware Design EGSM900 2DL/3UL @30.3dBm EGSM900 1DL/4UL @29.4dBm DCS1800 4DL/1UL @29.6dBm DCS1800 3DL/2UL @29.1dBm DCS1800 2DL/3UL @28.8dBm DCS1800 1DL/4UL @29.1dBm EGSM900 4DL/1UL @26dBm EGSM900 3DL/2UL @26dBm EGSM900 2DL/3UL @25dBm EGSM900 1DL/4UL @25dBm DCS1800 4DL/1UL @26dBm DCS1800 3DL/2UL @25dBm DCS1800 2DL/3UL @25dBm DCS1800 1DL/4UL @25dBm WCDMA B1 HSDPA @22.5dBm WCDMA B1 HSUPA @21.11dBm EDGE data transfer

(GNSS OFF) WCDMA data transfer

(GNSS OFF) WCDMA B5 HSDPA @23.5dBm WCDMA B5 HSUPA @21.4dBm WCDMA B8 HSDPA @22.41dBm WCDMA B8 HSUPA @21.2dBm LTE-FDD B1 @23.45dBm LTE-FDD B3 @23.4dBm LTE-FDD B5 @23.4dBm LTE-FDD B7 @23.86dBm LTE-FDD B8 @23.5dBm LTE data transfer

(GNSS OFF) 467 555 185 305 431 540 148 245 338 432 150 243 337 430 659 545 767 537 543 445 807 825 786 887 675 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Hardware_Design 85 / 120 LTE Standard Module Series EC21 Hardware Design GSM voice call LTE-FDD B20 @23.57dBm EGSM900 PCL=5 @33.08dBm DCS1800 PCL=0 @29.75dBm WCDMA B1 @23.69dBm WCDMA voice call WCDMA B5 @23.61dBm WCDMA B8 @23.35dBm Table 35: EC21-A Current Consumption Parameter Description Conditions OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) IVBAT Idle state

(GNSS OFF) WCDMA data transfer

(GNSS OFF) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA B2 HSDPA @21.54dBm WCDMA B2 HSUPA @22.19dBm WCDMA B4 HSDPA @22.15dBm WCDMA B4 HSUPA @21.82dBm WCDMA B5 HSDPA @22.22dBm WCDMA B5 HSUPA @21.45dBm 770 264.0 190.0 683 741 564 Typ. 10 1.25 2.03 1.65 2.31 1.85 23.1 32.8 22.8 32.8 479.0 530.0 539.0 531.0 454.0 433.0 mA mA mA mA mA mA Unit uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Hardware_Design 86 / 120 LTE Standard Module Series EC21 Hardware Design LTE data transfer

(GNSS OFF) LTE-FDD B2 @23.11dBm LTE-FDD B4 @23.16dBm LTE-FDD B12 @23.25dBm WCDMA B2 @22.97dBm WCDMA voice call WCDMA B4 @22.91dBm WCDMA B5 @23.06dBm Table 36: EC21-V Current Consumption Parameter Description Conditions OFF state Power down AT+CFUN=0 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) Idle state

(GNSS OFF) LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE data transfer

(GNSS OFF) LTE-FDD B4 @22.77dBm LTE-FDD B13 @23.05dBm IVBAT 721.0 748.0 668.0 565.0 590.0 493.0 Typ. 10 1.07 2.85 2.26 22.0 32.0 762.0 533.0 mA mA mA mA mA mA Unit uA mA mA mA mA mA mA mA Table 37: EC21-AUT Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down IVBAT Sleep state AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) 10 0.99 2.1 1.7 2.9 uA mA mA mA mA EC21_Hardware_Design 87 / 120 LTE Standard Module Series EC21 Hardware Design Idle state

(GNSS OFF) WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA B1 HSDPA @22.59dBm WCDMA B1 HSUPA @22.29dBm WCDMA B5 HSDPA @22.22dBm WCDMA B5 HSUPA @21.64dBm LTE-FDD B1 @23.38dBm LTE-FDD B3 @22.87dBm LTE-FDD B5 @23.12dBm LTE-FDD B7 @22.96dBm LTE-FDD B28 @23.31dBm WCDMA voice call WCDMA B1 @24.21dBm WCDMA B5 @23.18dBm 2.4 22.0 32.0 23.6 33.6 589.0 623.0 511.0 503.0 813.0 840.0 613.0 761.0 650.0 687.0 535.0 Table 38: EC21-AUV Current Consumption Parameter Description Conditions OFF state Power down IVBAT AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) Typ. 10 1.15 2.06 1.65 2.46 LTE-FDD PF=128 (USB disconnected) 1.86 EC21_Hardware_Design 88 / 120 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Unit uA mA mA mA mA mA LTE Standard Module Series EC21 Hardware Design Idle state

(GNSS OFF) WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA B1 HSDPA @22.59dBm WCDMA B1 HSUPA @22.47dBm WCDMA B5 HSDPA @22.95dBm WCDMA B5 HSUPA @22.87dBm WCDMA B8 HSDPA @22.37dBm WCDMA B8 HSUPA @22.09dBm LTE-FDD B1 @23.28dBm LTE-FDD B3 @23.2dBm LTE-FDD B5 @23.05dBm LTE-FDD B8 @23.21dBm LTE-FDD B28 @22.9dBm WCDMA B1 @23.43dBm WCDMA voice call WCDMA B5 @23.32dBm WCDMA B8 @23.31dBm Table 39: EC21-J Current Consumption Parameter Description Conditions OFF state Power down IVBAT AT+CFUN=0 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) EC21_Hardware_Design 89 / 120 22.0 32.0 23.5 33.5 623.0 628.0 605.0 610.0 549.0 564.0 789.0 768.0 669.0 693.0 795.0 672.0 616.0 592.0 Typ. 10 0.85 2.20 1.46 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Unit uA mA mA mA LTE Standard Module Series EC21 Hardware Design Idle state

(GNSS OFF) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE data transfer

(GNSS OFF) LTE-FDD B1 @23.35dBm LTE-FDD B3 @22.95dBm LTE-FDD B8 @22.81dBm LTE-FDD B18 @23.15dBm LTE-FDD B19 @23.17dBm LTE-FDD B26 @23.37dBm Table 40: EC21-KL Current Consumption Parameter Description Conditions OFF state Power down AT+CFUN=0 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) Idle state

(GNSS OFF) IVBAT LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE data transfer

(GNSS OFF) LTE-FDD B1 @23.0dBm LTE-FDD B3 @23.36dBm LTE-FDD B5 @23.56dBm LTE-FDD B7 @23.32dBm LTE-FDD B8 @23.33dBm 23.5 33.8 734.0 778.0 722.0 677.0 688.0 723.0 Typ. 10 1.08 2.1 1.4 24.8 33.5 771.0 780.0 628.0 754.0 680.0 mA mA mA mA mA mA mA mA Unit uA mA mA mA mA mA mA mA mA mA mA EC21_Hardware_Design 90 / 120 LTE Standard Module Series EC21 Hardware Design Table 41: EC21-EU Current Consumption Parameter Description Conditions OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) Sleep state WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) Typ. 12.8 1.8 3.0 2.2 3.1 2.6 3.3 2.6 EGSM900 @DRX=5 (USB disconnected) 17.6 Idle state

(GNSS OFF) IVBAT GPRS data transfer

(GNSS OFF) EGSM900 @DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) EGSM900 4DL/1UL @33.80dBm EGSM900 3DL/2UL @32.57dBm EGSM900 2DL/3UL @30.26dBm EGSM900 1DL/4UL @28.94dBm DCS1800 4DL/1UL @31.13dBm DCS1800 3DL/2UL @30.28dBm DCS1800 2DL/3UL @28.21dBm DCS1800 1DL/4UL @27.05dBm EDGE data transfer EGSM900 4DL/1UL @27.08dBm 27.7 17.9 27.9 17.9 28.0 264.3 419.8 481.5 553.2 178.3 293.6 354.3 424.7 147.1 Unit uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Hardware_Design 91 / 120 LTE Standard Module Series EC21 Hardware Design

(GNSS OFF) EGSM900 3DL/2UL @25.91dBm EGSM900 2DL/3UL @23.83dBm EGSM900 1DL/4UL @22.73dBm DCS1800 4DL/1UL @26.65dBm DCS1800 3DL/2UL @25.61dBm DCS1800 2DL/3UL @23.46dBm DCS1800 1DL/4UL @22.19dBm WCDMA B1 HSDPA @23.26dBm WCDMA B1 HSUPA @23.09dBm WCDMA B8 HSDPA @23.27dBm WCDMA B8 HSUPA @22.67dBm LTE-FDD B1 @24.50dBm LTE-FDD B3 @23.67dBm LTE-FDD B7 @23.75dBm LTE-FDD B8 @22.81dBm LTE-FDD B20 @24.08dBm LTE-FDD B28A @23.34dBm GSM900 PCL=5 @33.85dBm DCS1800 PCL=0 @31.20dBm WCDMA B1 @24.06dBm WCDMA B8 @24.17dBm WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) GSM voice call WCDMA voice call 240.0 296.2 357.1 138.7 227.4 302.8 381.7 605.0 615.3 544.0 536.1 798.7 751.8 878.7 592.6 777.8 748.1 279.9 189.5 681.0 593.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Hardware_Design 92 / 120 LTE Standard Module Series EC21 Hardware Design Table 42: EC21-EC Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) Sleep state WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) Idle state

(GNSS OFF) IVBAT WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) EGSM900 4DL/1UL @33.65dBm EGSM900 3DL/2UL @33.41dBm EGSM900 2DL/3UL @30.08dBm EGSM900 1DL/4UL @28.75dBm DCS1800 4DL/1UL @30.05dBm DCS1800 3DL/2UL @29.99dBm DCS1800 2DL/3UL @29.79dBm DCS1800 1DL/4UL @29.85dBm GPRS data transfer

(GNSS OFF) EDGE data EGSM900 4DL/1UL PCL=8 @24.73dBm 7 0.9 2.0 1.3 1.9 1.6 2.3 1.6 16.8 27.3 17.9 26.3 18.0 27.9 270.8 491.2 496.3 566.0 167.7 273.1 378.8 488.0 164.3 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Hardware_Design 93 / 120 LTE Standard Module Series EC21 Hardware Design transfer

(GNSS OFF) EGSM900 3DL/2UL PCL=8 @24.47dBm EGSM900 2DL/3UL PCL=8 @24.99dBm EGSM900 1DL/4UL PCL=8 @24.77dBm DCS1800 4DL/1UL PCL=2 @25.91dBm DCS1800 3DL/2UL PCL=2 @25.71dBm DCS1800 2DL/3UL PCL=2 @25.97dBm DCS1800 1DL/4UL PCL=2 @25.93dBm WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) GSM voice call WCDMA B1 HSDPA @22.72dBm WCDMA B1 HSUPA @22.59dBm WCDMA B8 HSDPA @22.76dBm WCDMA B8 HSUPA @22.64dBm LTE-FDD B1 @23.83dBm LTE-FDD B3 @24.32dBm LTE-FDD B7 @24.47dBm LTE-FDD B8 @24.07dBm LTE-FDD B20 @23.56dBm LTE-FDD B28A @23.73dBm EGSM900 PCL=5 @33.29dBm DCS1800 PCL=0 @29.69dBm WCDMA voice call WCDMA B1 @23.75dBm WCDMA B8 @23.67dBm 277.6 389.8 504.2 149.6 243.4 327.5 423.4 581.4 601.4 496.7 493.1 744.6 715.2 744.4 586.0 721.0 806.6 269.3 158.1 636.6 546.5 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Hardware_Design 94 / 120 LTE Standard Module Series EC21 Hardware Design Table 43: EC21-AUX Current Consumption Parameter Description Conditions OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) IVBAT GSM DRX=5 (USB connected) Idle state

(GNSS OFF) GPRS data transfer

(GNSS OFF) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) GSM850 4DL/1UL @32.41dBm GSM850 3DL/2UL @31.48dBm GSM850 2DL/3UL @29.31dBm GSM850 1DL/4UL @28.21dBm EGSM900 4DL/1UL @33.06dBm Typ. 7 1.00 1.91 1.31 2.19 1.91 2.74 2.12 2.68 2.16 16.6 33.7 16.7 33.7 16.9 34.0 17.0 34.0 236.2 380.2 446.2 527.7 259.0 Unit uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Hardware_Design 95 / 120 LTE Standard Module Series EC21 Hardware Design EGSM900 3DL/2UL @31.74dBm EGSM900 2DL/3UL @29.32dBm EGSM900 1DL/4UL @28.30dBm DCS1800 4DL/1UL @29.20dBm DCS1800 3DL/2UL @28.16dBm DCS1800 2DL/3UL @26.05dBm DCS1800 1DL/4UL @25.14dBm PCS1900 4DL/1UL @29.39dBm PCS1900 3DL/2UL @28.06dBm PCS1900 2DL/3UL @26.01dBm PCS1900 1DL/4UL @25.20dBm GSM850 4DL/1UL PCL=8 @26.86dBm GSM850 3DL/2UL PCL=8 @25.76dBm GSM850 2DL/3UL PCL=8 @23.68dBm GSM850 1DL/4UL PCL=8 @22.39dBm EGSM900 4DL/1UL PCL=8 @27.01dBm EGSM900 3DL/2UL PCL=8 @25.82dBm EGSM900 2DL/3UL PCL=8 @23.64dBm EGSM900 1DL/4UL PCL=8 @22.46dBm DCS1800 4DL/1UL PCL=2 @25.90dBm DCS1800 3DL/2UL PCL=2 @24.98dBm DCS1800 2DL/3UL PCL=2 @22.92dBm DCS1800 1DL/4UL PCL=2 @21.82dBm PCS1900 4DL/1UL PCL=2 @25.36dBm PCS1900 3DL/2UL PCL=2 @25.07dBm 398.0 448.0 532.0 149.0 225.0 283.0 357.0 159.7 234.6 289.0 363.9 169.9 284.1 387.2 498.7 171.0 286.0 389.0 500.0 133.0 220.0 308.0 403.0 132.4 220.9 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EDGE data transfer

(GNSS OFF) EC21_Hardware_Design 96 / 120 LTE Standard Module Series EC21 Hardware Design WCDMA data transfer

(GNSS OFF) PCS1900 2DL/3UL PCL=2 @23.13dBm PCS1900 1DL/4UL PCL=2 @21.82dBm WCDMA B1 HSDPA @22.78dBm WCDMA B1 HSUPA @22.12dBm WCDMA B2 HSDPA @22.54dBm WCDMA B2 HSUPA @22.17dBm WCDMA B4 HSDPA @23.27dBm WCDMA B4 HSUPA @23.19dBm WCDMA B5 HSDPA @23.18dBm WCDMA B5 HSUPA @22.90dBm WCDMA B8 HSDPA @22.32dBm WCDMA B8 HSUPA @22.26dBm LTE-FDD B1 @23.48dBm LTE-FDD B2 @22.85dBm LTE-FDD B3 @23.45dBm LTE-FDD B4 @23.16dBm LTE data transfer

(GNSS OFF) LTE-FDD B5 @23.61dBm LTE-FDD B7 @23.40dBm LTE-FDD B8 @23.57dBm LTE-FDD B28A @23.49dBm LTE-FDD B28B @23.65dBm LTE-TDD B40 @23.66dBm GSM850 PCL=5 @32.45dBm GSM voice call EGSM900 PCL=5 @32.81dBm DCS1800 PCL=0 @29.28dBm 307.2 402.8 530.0 542.0 556.3 542.4 491.0 504.0 480.4 490.0 504.0 528.0 690.0 696.7 655.0 603.0 558.0 704.0 663.0 763.0 780.0 340.3 234.9 249.0 143.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Hardware_Design 97 / 120 LTE Standard Module Series EC21 Hardware Design WCDMA voice call PCS1900 PCL=0 @29.47dBm WCDMA B1 @23.44dBm WCDMA B2 @23.15dBm WCDMA B4 @23.20dBm WCDMA B5 @23.23dBm WCDMA B8 @23.05dBm 154.5 568.0 614.0 497.0 492.0 553.0 mA mA mA mA mA mA Table 43: GNSS Current Consumption of EC21 Series Module Parameter Description Conditions Typ. Unit Searching

(AT+CFUN=0) Tracking

(AT+CFUN=0) Cold start @Passive Antenna Lost state @Passive Antenna Instrument Environment Open Sky @Passive Antenna Open Sky @Active Antenna 58 58 33 35 43 mA mA mA mA mA IVBAT

(GNSS) 6.5. RF Output Power The following table shows the RF output power of EC21 module. Table 44: RF Output Power Frequency GSM850/EGSM900 DCS1800/PCS1900 Max. 33dBm2dB 30dBm2dB GSM850/EGSM900 (8-PSK) 27dBm3dB DCS1800/PCS1900 (8-PSK) 26dBm3dB WCDMA bands 24dBm+1/-3dB Min. 5dBm5dB 0dBm5dB 5dBm5dB 0dBm5dB

< -49dBm EC21_Hardware_Design 98 / 120 LTE Standard Module Series EC21 Hardware Design LTE-FDD bands LTE-TDD bands NOTE 23dBm2dB 23dBm2dB

< -39dBm

< -39dBm In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EC21 series module. Table 45: EC21-E Conducted RF Receiving Sensitivity Frequency EGSM900 DCS1800 WCDMA B1 WCDMA B5 WCDMA B8 Primary Diversity SIMO1) 3GPP (SIMO)

-109.0dBm

-109.0dBm

-110.5dBm

-110.5dBm

-110.5dBm

/

/

/

/

/

/

/

/

/

/

-102.0dBm

-102.0dbm

-106.7dBm

-104.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-98.0dBm

-101.5dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-98.5dBm

-101.5dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.5dBm

-101.0dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-97.0dBm

-99.5dBm

-94.3dBm LTE-FDD B8 (10MHz)

-97.0dBm

-97.0dBm

-101.0dBm

-93.3dBm LTE-FDD B20 (10MHz)

-97.5dBm

-99.0dBm

-102.5dBm

-93.3dBm EC21_Hardware_Design 99 / 120 LTE Standard Module Series EC21 Hardware Design Table 46: EC21-A Conducted RF Receiving Sensitivity Frequency WCDMA B2 WCDMA B4 WCDMA B5 Primary Diversity SIMO1) 3GPP (SIMO)

-110.0dBm

-110.0dBm

-110.5dBm

/

/

/

/

/

/

-104.7dBm

-106.7dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98.0dBm

-98.0dBm

-101.0dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.5dBm

-99.0dBm

-101.0dBm

-96.3dBm LTE-FDD B12 (10MHz)

-97.2dBm

-98.0dBm

-101.0dBm

-93.3dBm Table 47: EC21-V Conducted RF Receiving Sensitivity Frequency Primary LTE-FDD B4 (10MHz)

-97.5dBm LTE-FDD B13 (10MHz)

-97.7dBm Diversity

-99.0dBm

-97.0dBm SIMO1) 3GPP (SIMO)

-101.0dBm

-96.3dBm

-100.0dBm

-93.3dBm Table 48: EC21-AUT Conducted RF Receiving Sensitivity Frequency WCDMA B1 WCDMA B5 Primary Diversity SIMO1) 3GPP (SIMO)

-110.0dBm

-110.5dBm

/

/

/

/

-106.7dBm

-104.7dBm LTE-FDD B1 (10MHz)

-98.5dBm

-98.0dBm

-101.0dBm

-96.3dBm LTE-FDD B3 (10MHz)

-98.0dBm

-97.0dBm

-100.0dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-99.0dBm

-102.5dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-97.0dBm

-98.5dBm

-94.3dBm LTE-FDD B28 (10MHz)

-97.0dBm

-99.0dBm

-102.0dBm

-94.8dBm EC21_Hardware_Design 100 / 120 LTE Standard Module Series EC21 Hardware Design Table 49: EC21-KL Conducted RF Receiving Sensitivity Frequency Primary LTE-FDD B1 (10MHz)

-98.0dBm LTE-FDD B3 (10MHz)

-97.0dBm Diversity

-99.5dBm

-97.5dBm SIMO1) 3GPP (SIMO)

-100.5dBm

-96.3dBm

-99.5dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-99.5dBm

-100.5dBm

-94.3dBm LTE-FDD B7 (10MHz)

-96.0dBm LTE-FDD B8 (10MHz)

-97.0dBm

-96.0dBm

-99.0dBm

-98.5dBm

-94.3dBm

-101.0dBm

-93.3dBm Table 50: EC21-J Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B1 (10MHz)

-97.5dBm

-98.7dBm

-100.2dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-97.1dBm

-100.5dBm

-93.3dBm LTE-FDD B8 (10MHz)

-98.4dBm

-99.0dBm

-101.2dBm

-93.3dBm LTE-FDD B18 (10MHz)

-99.5dBm

-99.0dBm

-101.7dBm

-96.3dBm LTE-FDD B19 (10MHz)

-99.2dBm

-99.0dBm

-101.4dBm

-96.3dBm LTE-FDD B26 (10MHz)

-99.5dBm

-99.0dBm

-101.5dBm

-93.8dBm Table 51: EC21-AUV Conducted RF Receiving Sensitivity Frequency WCDMA B1 WCDMA B5 WCDMA B8 Primary Diversity SIMO1) 3GPP (SIMO)

-109.5dBm

-111.0dBm

-111.0dBm

/

/

/

/

/

/

-106.7dBm

-104.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-97.7dBm

-97.5dBm

-101.3dBm

-96.3dBm LTE-FDD B3 (10MHz)

-98.2dBm

-98.6dBm

-102.7dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98.7dBm

-98.2dBm

-102.5dBm

-94.3dBm EC21_Hardware_Design 101 / 120 LTE Standard Module Series EC21 Hardware Design LTE-FDD B8 (10MHz)

-98.2dBm

-98.2dBm

-102.3dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.0dBm

-98.7dBm

-102.1dBm

-94.8dBm Table 52: EC21-AU Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B5 WCDMA B8

-109.0dBm

-109.0dBm

-109.0dBm

-109.0dBm

-110.0dBm

-110.0dBm

-111.0dBm

-111.0dBm

/

/

/

/

/

/

/

/

/

/

/

/

/

/

/

/

-102.0dBm

-102.0dBm

-102.0dBm

-102.0dBm

-106.7dBm

-104.7dBm

-104.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-97.2dBm

-97.5dBm

-100.2dBm

-96.3dBm LTE-FDD B2 (10MHz)

-98.2dBm

/

/

-94.3dBm LTE-FDD B3 (10MHz)

-98.7dBm

-98.6dBm

-102.2dBm

-93.3dBm LTE-FDD B4 (10MHz)

-97.7dBm

-97.4dBm

-100.2dBm

-96.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.2dBm

-101.0dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.7dBm

-97.7dBm

-101.2dBm

-94.3dBm LTE-FDD B8 (10MHz)

-99.2dBm

-98.2dBm

-102.2dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.6dBm

-98.7dBm

-102.0dBm

-94.8dBm LTE-TDD B40 (10MHz)

-97.2dBm

-98.4dBm

-101.2dBm

-96.3dBm EC21_Hardware_Design 102 / 120 LTE Standard Module Series EC21 Hardware Design Table 53: EC21-EU Conducted RF Receiving Sensitivity Frequency EGSM900 DCS1800 WCDMA B1 WCDMA B8 Primary Diversity SIMO1) 3GPP (SIMO)

-109.0dBm

-109.0dBm

-110.5dBm

-110.5dBm

/

/

/

/

/

/

/

/

-102.0dBm

-102.0dbm

-106.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.2dBm

-99dBm

-101.7dBm

-96.3dBm LTE-FDD B3 (10MHz)

-98.7dBm

-99.5dBm

-101.2dBm

-93.3dBm LTE-FDD B7 (10MHz)

-96.8dBm

-98.5dBm

-100.7dBm

-94.3dBm LTE-FDD B8 (10MHz)

-98.7dBm

-100dBm

-101.7dBm

-93.3dBm LTE-FDD B20 (10MHz)

-98.2dBm

-99.5dBm

-101.8dBm

-93.3dBm LTE-FDD B28A (10MHz)

-98.8dBm

-100dBm

-101.5dBm

-94.8dBm Table 54: EC21-EC Conducted RF Receiving Sensitivity Frequency EGSM900 DCS1800 WCDMA B1 WCDMA B8 Primary Diversity SIMO1) 3GPP (SIMO)

-108.8dBm

-109.0dBm

-110.5dBm

-110.5dBm

/

/

/

/

/

/

/

/

-102.0dBm

-102.0dbm

-106.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-98.0dBm

-101.0dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-98.5dBm

-100.0dBm

-93.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-95.5dBm

-99.5dBm

-94.3dBm LTE-FDD B8 (10MHz)

-97.0dBm

-97.0dBm

-101.0dBm

-93.3dBm LTE-FDD B20 (10MHz)

-97.5dBm

-99.0dBm

-101.0dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.6dBm

-98.7dBm

-101.5dBm

-94.8dBm EC21_Hardware_Design 103 / 120 LTE Standard Module Series EC21 Hardware Design Table 55: EC21-AUX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8

-109.0dBm

-109.0dBm

-109.0dBm

-109.0dBm

/

/

/

/

/

/

/

/

-102.0dBm

-102.0dBm

-102.0dBm

-102.0dBm

-110.0dBm

-109.5dBm

-112dBm

-106.7dBm

-110.5dBm

/

/

-104.7dBm

-110.0dBm

-111.0dBm

-111.0dBm

-110dBm

-112dBm

-112dBm

-112dBm

-104.7dBm

-113dBm

-104.7dBm

-113dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-97.7dBm

-101.2dBm

-96.3dBm LTE-FDD B2 (10MHz)

-98.5dBm

/

/

-94.3dBm LTE-FDD B3 (10MHz)

-99.0dBm LTE-FDD B4 (10MHz)

-97.7dBm LTE-FDD B5 (10MHz)

-98.5dBm LTE-FDD B7 (10MHz)

-97.7dBm LTE-FDD B8 (10MHz)

-99.0dBm LTE-FDD B28 (10MHz)

-98.0dBm LTE-TDD B40 (10MHz)

-97.5dBm

-98.8dBm

-97.6dBm

-98.2dBm

-97.7dBm

-98.5dBm

-98.7dBm

-98.2dBm

-102.2dBm

-93.3dBm

-100.2dBm

-96.3dBm

-101.0dBm

-94.3dBm

-101.2dBm

-94.3dBm

-102.2dBm

-93.3dBm

-101.5dBm

-94.8dBm

-101.2dBm

-96.3dBm NOTE 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. EC21_Hardware_Design 104 / 120 LTE Standard Module Series EC21 Hardware Design 6.7. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the modules electrostatics discharge characteristics. Table 56: Electrostatics Discharge Characteristics (25C, 45% Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND All Antenna Interfaces Other Interfaces 5 4 0.5 10 8 1 kV kV kV 6.8. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:

On customers PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc. Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary. Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Make sure the ground pads of the module and PCB are fully connected. According to customers application demands, the heatsink can be mounted on the top of the module, or the opposite side of the PCB area where the module is mounted, or both of them. The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB. The following shows two kinds of heatsink designs for reference and customers can choose one or both of them according to their application structure. EC21_Hardware_Design 105 / 120 LTE Standard Module Series EC21 Hardware Design Figure 42: Referenced Heatsink Design (Heatsink at the Top of the Module) Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers PCB) NOTES 1. The module offers the best performance when the internal BB chip stays below 105C. When the maximum temperature of the BB chip reaches or exceeds 105C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature EC21_Hardware_Design 106 / 120 LTE Standard Module Series EC21 Hardware Design always maintains below 105C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. 2. For more detailed guidelines on thermal design, please refer to document [7]. EC21_Hardware_Design 107 / 120 LTE Standard Module Series EC21 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the dimensional tolerances are 0.05mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module 32.00.15 2.40.2 Pin 1 Pin 1 5 1

. 0 0

. 9 2 Figure 44: Module Top and Side Dimensions 0.8 EC21_Hardware_Design 108 / 120 LTE Standard Module Series EC21 Hardware Design 1.90 1.8 2.15 32.0/-0.15 1.30 3.85 5.96 2.0 4

. 3 1.1 3.0 0.87 4.82 1.6 6.8 1.7 1.15 1.05 2.8 8

. 4 Pin 1 1.30 5

. 3 1.1 2.0 2.0 3.0 1.8 5 1

. 0

-

/

0

. 9 2 4.37 3.2 3.4 3.2 3.4 3.2 2.49 1.9 2.4 3.45 0.8 5 3

. 1.5 Figure 45: Module Bottom Dimensions (Bottom View) EC21_Hardware_Design 109 / 120 LTE Standard Module Series EC21 Hardware Design 7.2. Recommended Footprint Figure 46: Recommended Footprint (Top View) NOTES 1. The keepout area should not be designed. 2. For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB. EC21_Hardware_Design 110 / 120 LTE Standard Module Series EC21 Hardware Design 7.3. Design Effect Drawings of the Module Figure 47: Top View of the Module Figure 48: Bottom View of the Module NOTE These are renderings of EC21 module. For authentic appearance, please refer to the module that you receive from Quectel. EC21_Hardware_Design 111 / 120 LTE Standard Module Series EC21 Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EC21 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40C/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:

Mounted within 168 hours at the factory environment of 30C/60%RH. Stored at <10%RH. 3. Devices require baking before mounting, if any circumstances below occurs:

When the ambient temperature is 23C5C and the humidity indicator card shows the humidity Device mounting cannot be finished within 168 hours at factory conditions of 30C/60%RH. is >10% before opening the vacuum-sealed bag. If baking is required, devices may be baked for 8 hours at 120C5C. 4. NOTE As the plastic package cannot be subjected to high temperature, it should be removed from devices before high to temperature (120C) baking. IPC/JEDECJ-STD-033 for baking procedure. is desired, please refer If shorter baking time EC21_Hardware_Design 112 / 120 LTE Standard Module Series EC21 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18mm~0.20mm. For more details, please refer to document [4]. It is suggested that the peak reflow temperature is 238C~245C, and the absolute maximum reflow temperature is 245C. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Temp. (C) 245 238 220 200 150 100 Soak Zone A Max slope: 1~3C/sec Reflow Zone C Max slope:

2~3C/sec Cooling down slope: 1~4C/sec B D Figure 49: Reflow Soldering Thermal Profile Table 57: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 1~3C/sec Soak time (between A and B: 150C and 200C) 60~120sec Reflow Zone EC21_Hardware_Design 113 / 120 LTE Standard Module Series EC21 Hardware Design Max slope Reflow time (D: over 220C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle 2~3C/sec 40~60sec 238~245C 1~4C/sec 1 8.3. Packaging EC21 is packaged in tap and reel carriers. Each reel is 11.88m long and contains 250pcs modules. The figure below shows the package details, measured in mm. 1

. 0 5 7 1

. 5 1

. 0 0 2 0 2

. 3

. 0 0 0 4 4

. 44.00 0.1 2.00 0.1 4.00 0.1 1.50 0.1 0.35 0.05 5 1

. 0 3 9 2

. 5 1

. 0 3 0 3

. 5 1

. 0 3 0 3

. 32.5 0.15 33.5 0.15 32.5 0.15 33.5 0.15 4.2 0.15 3.1 0.15 EC21_Hardware_Design 114 / 120 LTE Standard Module Series EC21 Hardware Design 48.5 0 0 1 13 44.5+0.20

-0.00 Cover tape Direction of feed Figure 50: Tape and Reel Specifications 1083 Carrier tape packing module Carrier tape unfolding Figure 51: Tape and Reel Directions EC21_Hardware_Design 115 / 120 LTE Standard Module Series EC21 Hardware Design 9 Appendix A References Table 58: Related Documents SN Document Name Remark

[1]

[2]

[3]

Quectel_EC2x&EGxx_Power_Management_ Application_Note Quectel_EC2x&EG9x&EM05_AT_Commands_ Manual Quectel_EC2x&EGxx&EM05_GNSS_AT_Commands_ Manual Power management application note for EC25, EC21, EC20 R2.0, EC20 R2.1, EG95, EG91 and EG25-G modules AT commands manual for EC25, EC21, EC20 R2.0, EC20 R2.1, EG91, EG95 and EM05 modules GNSS AT Commands Manual for EC25, EC21, EC20 R2.0, EC20 R2.1, EG95, EG91, EG25-G and EM05 modules

[4] Quectel_Module_Secondary_SMT_User_Guide Module secondary SMT user guide

[5] Quectel_EC21_Reference_Design EC21 reference design

[6] Quectel_RF_Layout_Application_Note RF layout application note

[7] Quectel_LTE_Module_Thermal_Design_Guide

[8] Quectel_UMTS&LTE_EVB_User_Guide Table 59: Terms and Abbreviations Abbreviation Description Thermal design guide for LTE standard, LTE-A and Automotive modules UMTS&LTE EVB user guide for UMTS&LTE modules AMR bps CHAP CS CSD Adaptive Multi-rate Bits Per Second Challenge Handshake Authentication Protocol Coding Scheme Circuit Switched Data EC21_Hardware_Design 116 / 120 LTE Standard Module Series EC21 Hardware Design CTS DC-HSPA+

DFOTA Clear To Send Dual-carrier High Speed Packet Access Delta Firmware Upgrade Over The Air DL DTR DTX EFR ESD FDD FR Downlink Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK GNSS GPS GSM HR HSPA HSDPA HSUPA I/O Inorm LED LNA LTE MIMO Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Downlink Packet Access High Speed Uplink Packet Access Input/Output Normal Current Light Emitting Diode Low Noise Amplifier Long Term Evolution Multiple Input Multiple Output EC21_Hardware_Design 117 / 120 LTE Standard Module Series EC21 Hardware Design MO MS MT PAP PCB PDU PPP QAM QPSK RF RHCP Rx SGMII SIM SIMO SMS TDD Mobile Originated Mobile Station (GSM engine) Mobile Terminated Password Authentication Protocol Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Right Hand Circularly Polarized Receive Serial Gigabit Media Independent Interface Subscriber Identification Module Single Input Multiple Output Short Message Service Time Division Duplexing TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access TX UL UMTS URC

(U)SIM Vmax Transmitting Direction Uplink Universal Mobile Telecommunications System Unsolicited Result Code

(Universal) Subscriber Identity Module Maximum Voltage Value EC21_Hardware_Design 118 / 120 LTE Standard Module Series EC21 Hardware Design Vnorm Vmin VIHmax VIHmin VILmax VILmin VImax VImin VOHmax VOHmin VOLmax VOLmin VSWR WCDMA WLAN Normal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Absolute Minimum Input Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Voltage Standing Wave Ratio Wideband Code Division Multiple Access Wireless Local Area Network EC21_Hardware_Design 119 / 120 LTE Standard Module Series EC21 Hardware Design 10 Appendix B GPRS Coding Schemes Table 60: Description of Different Coding Schemes Scheme Code Rate USF Pre-coded USF CS-1 1/2 3 3 Radio Block excl. USF and BCS 181 BCS Tail Coded Bits Punctured Bits Data Rate Kb/s 40 4 456 0 9.05 CS-2 2/3 3 6 268 16 4 588 132 13.4 CS-3 3/4 3 6 312 16 4 676 220 15.6 CS-4 1 3 12 428 16

-

456

-

21.4 EC21_Hardware_Design 120 / 120 LTE Standard Module Series EC21 Hardware Design 11 Appendix C GPRS Multi-slot Classes Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 61: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1 2 2 3 2 3 3 4 3 4 4 4 3 4 1 1 2 1 2 2 3 1 2 2 3 4 3 4 2 3 3 4 4 4 4 5 5 5 5 5 NA NA EC21_Hardware_Design 121 / 120 LTE Standard Module Series EC21 Hardware Design 5 6 7 8 6 6 6 6 6 8 8 8 8 8 8 5 5 5 5 5 6 7 8 2 3 4 4 6 2 3 4 4 6 8 1 2 3 4 NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA 6 6 6 6 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 EC21_Hardware_Design 122 / 120 LTE Standard Module Sires EC21 Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 62: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot GMSK GMSK GMSK GMSK GMSK GMSK GMSK GMSK 8-PSK 8-PSK 8-PSK 8-PSK 8-PSK

/

/

/

/

C B A C B A B A A 9.05kbps 18.1kbps 36.2kbps 13.4kbps 26.8kbps 53.6kbps 15.6kbps 31.2kbps 62.4kbps 21.4kbps 42.8kbps 85.6kbps 8.80kbps 17.60kbps 35.20kbps 11.2kbps 22.4kbps 44.8kbps 14.8kbps 29.6kbps 59.2kbps 17.6kbps 35.2kbps 70.4kbps 22.4kbps 44.8kbps 89.6kbps 29.6kbps 59.2kbps 118.4kbps 44.8kbps 89.6kbps 179.2kbps 54.4kbps 108.8kbps 217.6kbps 59.2kbps 118.4kbps 236.8kbps CS-1:

CS-2:

CS-3:

CS-4:

MCS-1 MCS-2 MCS-3 MCS-4 MCS-5 MCS-6 MCS-7 MCS-8 MCS-9 EC21_Hardware_Design 123 / 120

 

 

EC21 Mini PCIe Hardware Design LTE Standard Module Series Rev. EC21_Mini_PCIe_Hardware_Design_V1.3 Date: 2019-08-19 Status: Released www.quectel.com LTE Standard Module Series EC21 Mini PCIe Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. EC21_Mini_PCIe_Hardware_Design 1 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design About the Document History Revision Date Author Description 1.0 2016-06-07 Yeoman CHEN/

Frank WANG Initial 1.1 2017-01-24 Lyndon LIU/

Rex WANG 1. Deleted description of EC21-AUTL and EC21-CT Mini PCIe in Table 1. 2. Updated key features of EC21 Mini PCIe in Table 2. 3. Added current consumption of EC21 Mini PCIe in Chapter 4.7. 4. Updated mechanical dimensions of EC21 Mini PCIe in Figure 15. 5. Updated conducted RF output power in Table 16. 6. Updated conducted RF receiving sensitivity of EC21-A in Table 18. 7. Added conducted RF receiving sensitivity of EC21-KL in Table 21. 8. Added conducted RF receiving sensitivity of EC21-J in Table 22. 1. Added new variants EC21-EU Mini PCIe/EC21-EC Mini PCIe and related information. 2. Added pin definition and description of pin 44 in Figure 2 and Table 4. 1.2 2019-04-30 Woody WU/

Nathan LIU/

Frank WANG 3. Updated mechanical dimensions in Figure 18. 4. Added USIM_PRESENCE in (U)SIM interface and updated the reference circuit in Chapter 3.4. 5. Updated reference circuit of USB interface in Chapter 3.5. 6. Modified description of W_DISABLE# signal in Chapter 3.8.3. 7. Modified description of LED_WWAN# signal in Chapter 3.8.5. EC21_Mini_PCIe_Hardware_Design 2 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 8. Added thermal consideration in Chapter 6.7. 9. Updated UMTS and GSM features and added storage temperature range in Table 2. 10. Added operating frequencies in Table 15 11. Added GNSS frequency in Table 16. 12. Updated antenna requirements in Table 17. 13. Updated EC21 Mini PCIe conducted RF output power in Table 20. 14. Updated conducted RF receiving sensitivity of EC21-E Mini PCIe in Table 21. 15. Updated conducted RF receiving sensitivity of EC21-A Mini PCIe in Table 22. 16. Updated conducted RF receiving sensitivity of EC21-V Mini PCIe in Table 23 17. Updated conducted RF receiving sensitivity of EC21-AUT Mini PCIe in Table 24. 18. Added conducted RF receiving sensitivity of EC21-AU Mini PCIe in Table 27. 19. Added conducted RF receiving sensitivity of EC21-EU Mini PCIe in Table 28. 20. Added conducted RF receiving sensitivity of EC21-EC Mini PCIe in Table 29. 21. Added current consumption of EC21-EC Mini PCIe in Table 34. 1. Deleted the information of GNSS supported on EC21-EC Mini PCIe in Table 1. 2. Added ThreadX variant EC21-AUX Mini PCIe and updated related contents in Table 1. 3. Updated supported protocols and USB serial driver in Table 2. 1.3 2019-08-19 4. Updated conducted RF receiving sensitivity of EC21-EU Mini PCIe in Table 29. Ward WANG/

Owen WEI 5. Added conducted RF receiving sensitivity of EC21-AUX Mini PCIe in Table 31. 6. Added current consumption of EC21-AUX Mini PCIe in Table 36. 7. Added current consumption of EC21-EU Mini PCIe in Table 37. 8. Added current consumption of EC21-AU Mini PCIe in Table 38. 9. Added note 2 for antenna requirement in Chapter 5.4.1. 10. Deleted current consumption of EC21-EC Mini PCIe, and the data will be updated in the future EC21_Mini_PCIe_Hardware_Design 3 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design version. EC21_Mini_PCIe_Hardware_Design 4 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 5 Table Index ............................................................................................................................................... 7 Figure Index .............................................................................................................................................. 8 1 Introduction ....................................................................................................................................... 9 1.1. Safety Information ................................................................................................................. 10 2 Product Concept ............................................................................................................................. 14 2.1. General Description .............................................................................................................. 14 Description of Product Series ................................................................................................ 15 2.2. 2.3. Key Features ......................................................................................................................... 16 Functional Diagram ............................................................................................................... 19 2.4. 3.1. 3.2. 3.3. 3.4. 3.5. 3.6. 3.7. 3.8. 3 Application Interfaces ..................................................................................................................... 20 Pin Assignment ..................................................................................................................... 20 Pin Description ...................................................................................................................... 21 Power Supply ........................................................................................................................ 24

(U)SIM Interface .................................................................................................................... 25 USB Interface ........................................................................................................................ 27 UART Interface ..................................................................................................................... 29 PCM and I2C Interfaces ........................................................................................................ 29 Control and Indicator Signals ................................................................................................ 32 3.8.1. RI Signal ...................................................................................................................... 33 3.8.2. DTR Signal .................................................................................................................. 33 3.8.3. W_DISABLE# Signal ................................................................................................... 33 3.8.4. PERST# Signal ............................................................................................................ 34 3.8.5. LED_WWAN# Signal ................................................................................................... 34 3.8.6. WAKE# Signal ............................................................................................................. 35 4 GNSS Receiver ................................................................................................................................ 36 5 Antenna Connection ....................................................................................................................... 37 5.1. Operating Frequency ............................................................................................................ 37 5.2. GNSS Frequency .................................................................................................................. 38 5.3. GNSS Performance .............................................................................................................. 39 5.4. Antenna Requirements ......................................................................................................... 40 5.4.1. Antenna Requirements ................................................................................................ 40 5.4.2. Antenna Connectors and Mating Plugs ....................................................................... 41 6 Electrical, Reliability and Radio Characteristics .......................................................................... 43 6.1. General Description .............................................................................................................. 43 Power Supply Requirements ................................................................................................. 43 6.2. 6.3. I/O Requirements .................................................................................................................. 44 EC21_Mini_PCIe_Hardware_Design 5 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 6.4. 6.5. 6.6. 6.7. RF Characteristics ................................................................................................................ 44 ESD Characteristics .............................................................................................................. 50 Current Consumption ............................................................................................................ 50 Thermal Consideration .......................................................................................................... 60 7 Dimensions and Packaging ............................................................................................................ 62 7.1. General Description .............................................................................................................. 62 7.2. Mechanical Dimensions of EC21 Mini PCIe .......................................................................... 62 Standard Dimensions of Mini PCI Express ............................................................................ 63 7.3. 7.4. Packaging Specifications ...................................................................................................... 64 8 Appendix A References .................................................................................................................. 65 EC21_Mini_PCIe_Hardware_Design 6 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Table Index TABLE 1: DESCRIPTION OF EC21 MINI PCIE ................................................................................................ 15 TABLE 2: KEY FEATURES OF EC21 MINI PCIE ............................................................................................. 16 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 21 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 21 TABLE 5: PIN DEFINITION OF VCC_3V3 AND GND PINS ............................................................................. 24 TABLE 6: PIN DEFINITION OF (U)SIM INTERFACE ....................................................................................... 25 TABLE 7: PIN DEFINITION OF USB INTERFACE ........................................................................................... 27 TABLE 8: PIN DEFINITION OF UART INTERFACE ......................................................................................... 29 TABLE 9: PIN DEFINITION OF PCM AND I2C INTERFACES ......................................................................... 30 TABLE 10: PIN DEFINITION OF CONTROL AND INDICATOR SIGNALS ....................................................... 32 TABLE 11: AIRPLANE MODE CONTROLLED BY HARDWARE METHOD ..................................................... 33 TABLE 12: AIRPLANE MODE CONTROLLED BY SOFTWARE METHOD ..................................................... 34 TABLE 13: INDICATIONS OF NETWORK STATUS (AT+QCFG="LEDMODE",0, DEFAULT SETTING) ......... 35 TABLE 14: INDICATIONS OF NETWORK STATUS (AT+QCFG="LEDMODE",2) ........................................... 35 TABLE 15: OPERATING FREQUENCIES ........................................................................................................ 37 TABLE 16: GNSS FREQUENCY ....................................................................................................................... 38 TABLE 17: GNSS PERFORMANCE ................................................................................................................. 39 TABLE 18: ANTENNA REQUIREMENTS .......................................................................................................... 40 TABLE 19: POWER SUPPLY REQUIREMENTS .............................................................................................. 43 TABLE 20: I/O REQUIREMENTS ...................................................................................................................... 44 TABLE 21: CONDUCTED RF OUTPUT POWER OF EC21 MINI PCIE ........................................................... 44 TABLE 22: CONDUCTED RF RECEIVING SENSITIVITY OF EC21-E MINI PCIE .......................................... 45 TABLE 23: CONDUCTED RF RECEIVING SENSITIVITY OF EC21-A MINI PCIE .......................................... 45 TABLE 24: CONDUCTED RF RECEIVING SENSITIVITY OF EC21-V MINI PCIE .......................................... 46 TABLE 25: CONDUCTED RF RECEIVING SENSITIVITY OF EC21-AUT MINI PCIE ..................................... 46 TABLE 26: CONDUCTED RF RECEIVING SENSITIVITY OF EC21-KL MINI PCIE ........................................ 46 TABLE 27: CONDUCTED RF RECEIVING SENSITIVITY OF EC21-J MINI PCIE .......................................... 47 TABLE 28: CONDUCTED RF RECEIVING SENSITIVITY OF EC21-AU MINI PCIE ....................................... 47 TABLE 29: CONDUCTED RF RECEIVING SENSITIVITY OF EC21-EU MINI PCIE ....................................... 48 TABLE 30: CONDUCTED RF RECEIVING SENSITIVITY OF EC21-EC MINI PCIE ....................................... 48 TABLE 31: CONDUCTED RF RECEIVING SENSITIVITY OF EC21-AUX MINI PCIE ..................................... 49 TABLE 32: ESD CHARACTERISTICS OF EC21 MINI PCIE ............................................................................ 50 TABLE 33: CURRENT CONSUMPTION OF EC21-A MINI PCIE ..................................................................... 50 TABLE 34: CURRENT CONSUMPTION OF EC21-V MINI PCIE ..................................................................... 51 TABLE 35: CURRENT CONSUMPTION OF EC21-KL MINI PCIE ................................................................... 52 TABLE 36: CURRENT CONSUMPTION OF EC21-AUX MINI PCIE ................................................................ 52 TABLE 37: CURRENT CONSUMPTION OF EC21-EU MINI PCIE .................................................................. 55 TABLE 38: CURRENT CONSUMPTION OF EC21-AU MINI PCIE .................................................................. 57 TABLE 39: GNSS CURRENT CONSUMPTION OF EC21 MINI PCIE SERIES MODULE ............................... 60 TABLE 40: RELATED DOCUMENTS ................................................................................................................ 65 TABLE 41: TERMS AND ABBREVIATIONS ...................................................................................................... 65 EC21_Mini_PCIe_Hardware_Design 7 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 19 FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 20 FIGURE 3: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 25 FIGURE 4: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR 26 FIGURE 5: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR ... 26 FIGURE 6: REFERENCE CIRCUIT OF USB INTERFACE .............................................................................. 28 FIGURE 7: TIMING IN PRIMARY MODE .......................................................................................................... 31 FIGURE 8: TIMING IN AUXILIARY MODE ....................................................................................................... 31 FIGURE 9: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ...................................... 32 FIGURE 10: RI BEHAVIOR ............................................................................................................................... 33 FIGURE 11: TIMING OF RESETTING MODULE .............................................................................................. 34 FIGURE 12: LED_WWAN# SIGNAL REFERENCE CIRCUIT DIAGRAM ........................................................ 34 FIGURE 13: WAKE# BEHAVIOR ...................................................................................................................... 35 FIGURE 14: DIMENSIONS OF ANTENNA CONNECTORS (UNIT: MM) ......................................................... 41 FIGURE 15: MECHANICALS OF U.FL-LP MATING PLUGS ........................................................................... 41 FIGURE 16: SPACE FACTOR OF MATING PLUGS (UNIT: MM) ..................................................................... 42 FIGURE 17: REFERENCED HEATSINK DESIGN ........................................................................................... 61 FIGURE 18: MECHANICAL DIMENSIONS OF EC21 MINI PCIE .................................................................... 62 FIGURE 19: STANDARD DIMENSIONS OF MINI PCI EXPRESS ................................................................... 63 FIGURE 20: DIMENSIONS OF THE MINI PCI EXPRESS CONNECTOR (MOLEX 679100002) .................... 64 EC21_Mini_PCIe_Hardware_Design 8 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 1 Introduction This document defines EC21 Mini PCIe module, and describes its air interfaces and hardware interfaces which are connected with customers applications. This document can help customers to quickly understand module interface specifications, electrical and mechanical details as well as other related information of EC21 Mini PCIe module. To facilitate its application in different fields, relevant reference design is also provided for customers reference. Associated with application note and user guide, customers can use the module to design and set up mobile applications easily. EC21_Mini_PCIe_Hardware_Design 9 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC21 Mini PCIe module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. EC21_Mini_PCIe_Hardware_Design 10 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR201909EC21AUX. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

GSM850: <11.206dBi GSM1900: <12.140dBi WCDMA B2/LTE B2/ LTE B7: <8dBi WCDMA B4LTE B4: <5dBi WCDMA B5/LTE B5: <9.416dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 EC21_Mini_PCIe_Hardware_Design 11 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR201909EC21AUX or Contains FCC ID: XMR201909EC21AUX must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

EC21_Mini_PCIe_Hardware_Design 12 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. EC21_Mini_PCIe_Hardware_Design 13 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 2 Product Concept 2.1. General Description EC21 Mini PCIe module provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks with PCI Express Mini Card 1.2 standard interface. It supports embedded operating systems such as WinCE, Linux, Android etc., and also provides audio, high-speed data transmission and GNSS functionalities for customers applications. EC21 Mini PCIe module can be applied in the following fields:

PDA and Laptop Computer Remote Monitor System Vehicle System Wireless POS System Wireless Router and Switch Other Wireless Terminal Devices This chapter generally introduces the following aspects of EC21 Mini PCIe module:

Product Series Key Features Functional Diagram NOTE Intelligent Meter Reading System EC21 Mini PCIe contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. EC21_Mini_PCIe_Hardware_Design 14 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 2.2. Description of Product Series EC21 Mini PCIe series contains 10 variants, and are listed in the following table. Table 1: Description of EC21 Mini PCIe Product Series Description EC21-E Mini PCIe EC21-A Mini PCIe EC21-V Mini PCIe EC21-AUT Mini PCIe EC21-AU Mini PCIe3) EC21-J Mini PCIe EC21-KL Mini PCIe Support GSM: 900/1800MHz Support WCDMA: B1/B5/B8 Support LTE-FDD: B1/B3/B5/B7/B8/B20 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support WCDMA: B2/B4/B5 Support LTE-FDD: B2/B4/B12 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B4/B13 Support LTE receive diversity Support GNSS1) Support digital audio2) Support WCDMA: B1/B5 Support LTE-FDD: B1/B3/B5/B7/B28 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support GSM: 850/900/1800/1900MHz Support WCDMA: B1/B2/B5/B8 Support LTE-FDD: B1/B2/B3/B4/B5/B7/B8/B28 Support LTE-TDD: B40 Support LTE/WCDMA receive diversity3) Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B3/B8/B18/B19/B26 Support LTE receive diversity Support digital audio2) Support LTE-FDD: B1/B3/B5/B7/B8 Support LTE receive diversity Support digital audio2) EC21_Mini_PCIe_Hardware_Design 15 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Support GSM: 900/1800MHz Support WCDMA: B1/B8 Support LTE-FDD: B1/B3/B7/B8/B20/B28A Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B3/B7/B8/B20/B28A Support WCDMA: B1/B8 Support GSM: 900/1800MHz Support LTE/WCDMA receive diversity Support digital audio2) Support GSM: 850/900/1800/1900MHz Support WCDMA: B1/B2/B4/B5/B8 Support LTE-FDD: B1/B2/B3/B4/B5/B7/B8/B28 Support LTE-TDD: B40 Support LTE/WCDMA receive diversity3) Support GNSS1) Support digital audio2) EC21-EU Mini PCIe EC21-EC Mini PCIe EC21-AUX Mini PCIe3) NOTES 1) GNSS function is optional. 2) Digital audio (PCM) function is only supported on Telematics version. 3) B2 band on EC21-AU Mini PCIe and EC21-AUX Mini PCIe module does not support receive diversity. Additionally, EC21-AUX Mini PCIe is based on ThreadX OS. 1. 2. 3. 2.3. Key Features The following table describes the detailed features of EC21 Mini PCIe module. Table 2: Key Features of EC21 Mini PCIe Feature Details Function Interface PCI Express Mini Card 1.2 Standard Interface Power Supply Transmitting Power Supply voltage: 3.0V~3.6V Typical supply voltage: 3.3V Class 4 (33dBm2dB) for GSM850 Class 4 (33dBm2dB) for EGSM900 Class 1 (30dBm2dB) for DCS1800 EC21_Mini_PCIe_Hardware_Design 16 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Class 1 (30dBm2dB) for PCS1900 Class E2 (27dBm3dB) for GSM850 8-PSK Class E2 (27dBm3dB) for EGSM900 8-PSK Class E2 (26dBm3dB) for DCS1800 8-PSK Class E2 (26dBm3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm2dB) for LTE-FDD bands Class 3 (23dBm2dB) for LTE-TDD bands Support up to non-CA Cat 1 FDD and TDD Support 1.4/3/5/10/15/20MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max 10Mbps (DL)/Max 5Mbps (UL) LTE-TDD: Max 8.96Mbps (DL)/Max 3.1Mbps (UL) Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL) GPRS:

Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL)/Max 85.6Kbps (UL) EDGE:

Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL)/Max 236.8Kbps (UL) Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/NITZ/

MMS/SMTP/SSL/MQTT/FILE/CMUX*/SMTPS* protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connection Text and PDU mode Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default LTE Features UMTS Features GSM Features Internet Protocol Features SMS

(U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V UART Interface Audio Features Baud rate can reach up to 230400bps, 115200bps by default Used for AT command communication Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB EC21_Mini_PCIe_Hardware_Design 17 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6/3.x/4.1~4.15, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc. Include main antenna, diversity antenna and GNSS antenna receptacle connectors PCM Interface USB Interface Antenna Connectors Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Physical Characteristics Temperature Range Gen8C Lite of Qualcomm Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Size: (51.00.15)mm (30.00.15)mm (4.90.2)mm Weight: approx. 9.8g Operation temperature range: -35C ~ +75C 1) Extended temperature range: -40C ~ +80C 2) Storage temperature range: -40C ~ +90C Firmware Upgrade Upgrade via USB interface or DFOTA*

All hardware components are fully compliant with EU RoHS directive RoHS NOTES 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call* (emergency call is not supported on ThreadX module), etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again.

* means under development. 1. 2. 3. EC21_Mini_PCIe_Hardware_Design 18 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 2.4. Functional Diagram The following figure shows the block diagram of EC21 Mini PCIe. Figure 1: Functional Diagram EC21_Mini_PCIe_Hardware_Design 19 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 3 Application Interfaces The physical connections and signal levels of EC21 Mini PCIe comply with PCI Express Mini CEM specifications. This chapter mainly describes the definition and application of the following interfaces of EC21 Mini PCIe:

Power supply USB interface UART interface PCM and I2C interfaces Control and indicator signals Antenna interfaces

(U)SIM interface 3.1. Pin Assignment The following figure shows the pin assignment of EC21 Mini PCIe module. The top side contains EC21 module and antenna connectors. Figure 2: Pin Assignment EC21_Mini_PCIe_Hardware_Design 20 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 3.2. Pin Description The following tables show the pin definition and description of EC21 Mini PCIe on the 52-pin application. Table 3: I/O Parameters Definition Type DI DO IO OC PI PO Description Digital Input Digital Output Bidirectional Open Collector Power Input Power Output Table 4: Pin Description Pin No. Mini PCI Express Standard Name EC21 Mini PCIe Pin Name 1 2 3 4 5 6 WAKE#

3.3Vaux WAKE#

VCC_3V3 COEX1 RESERVED GND GND COEX2 RESERVED 1.5V NC I/O OC PI Description Comment Output signal used to wake up the host 3.3V DC supply Reserved It is prohibited to be pulled up to high level before startup. Mini card ground Reserved It is prohibited to be pulled up to high level before startup. Not connected EC21_Mini_PCIe_Hardware_Design 21 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 CLKREQ#

RESERVED Reserved UIM_PWR USIM_VDD PO GND GND UIM_DATA USIM_DATA REFCLK-

UART_RX UIM_CLK USIM_CLK REFCLK+

UART_TX UIM_RESET USIM_RST GND GND UIM_VPP RESERVED RESERVED RI GND GND RESERVED RESERVED IO DI DO DO DO DO Power source for the

(U)SIM card Mini card ground Data signal of (U)SIM card UART receive data Clock signal of (U)SIM card UART transmit data Reset signal of (U)SIM card Mini card ground Reserved Output signal to wake up the host Mini card ground Reserved W_DISABLE#

W_DISABLE#

DI Airplane mode control GND GND PERST#

PERST#

DI DI Mini card ground Fundamental reset signal UART clear to send Reserved UART_CTS RESERVED UART_RTS DO UART request to send GND GND NC Mini card ground Mini card ground Not connected PERn0 3.3Vaux PERp0 GND GND 1.5V Connect to DTEs TX Connect to DTEs RX Pulled up by default. Active low. Pulled up by default. Active low. Connect to DTEs RTS Connect to DTEs CTS EC21_Mini_PCIe_Hardware_Design 22 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 GND GND Mini card ground SMB_CLK I2C_SCL DO I2C serial clock Require external pull-up to 1.8V. PETn0 DTR DI Sleep mode control SMB_DATA I2C_SDA IO I2C serial data PETp0 GND GND RESERVED GND GND Reserved Mini card ground Mini card ground USB_D-

USB_DM IO USB differential data (-) Require external pull-up to 1.8V. Require differential impedance of 90. GND GND Mini card ground USB_D+

USB_DP IO USB differential data (+) 3.3Vaux GND 3.3Vaux VCC_3V3 GND VCC_3V3 PI PI 3.3V DC supply Mini card ground 3.3V DC supply Require differential impedance of 90. LED_WWAN#

LED_WWAN#

OC LED signal for indicating the network status of the module Active low GND LED_WLAN#

RESERVED GND USIM_ PRESENCE PCM_CLK1) LED_WPAN#

RESERVED DI IO Mini card ground

(U)SIM card insertion detection PCM clock signal Reserved RESERVED PCM_DOUT1) DO PCM data output EC21_Mini_PCIe_Hardware_Design 23 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 1.5V NC RESERVED PCM_DIN1) GND GND RESERVED PCM_SYNC1) 3.3Vaux VCC_3V3 DI IO PI Not connected PCM data input Mini card ground PCM frame synchronization 3.3V DC supply 48 49 50 51 52 NOTES 1. Keep all NC, reserved and unused pins unconnected. 2. 1) The digital audio (PCM) function is only supported on Telematics version. 3.3. Power Supply The following table shows pin definition of VCC_3V3 pins and ground pins. Table 5: Pin Definition of VCC_3V3 and GND Pins Pin Name Pin No. I/O Power Domain Description VCC_3V3 2, 39, 41, 52 PI 3.0V~3.6V 3.3V DC supply GND 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 Mini card ground The typical supply voltage of EC21 Mini PCIe is 3.3V. In the 2G network, the input peak current may reach 2.7A during the transmitting time. Therefore, the power supply must be able to provide enough current, and a bypass capacitor of no less than 470F with low ESR should be used to prevent the voltage from dropping. The following figure shows a reference design of power supply. The precision of resistor R2 and R3 is 1%, and the capacitor C3 needs a low ESR. EC21_Mini_PCIe_Hardware_Design 24 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Figure 3: Reference Circuit of Power Supply 3.4. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. The following table shows the pin definition of (U)SIM interface. Table 6: Pin Definition of (U)SIM Interface Pin Name USIM_VDD USIM_DATA USIM_CLK USIM_RST Pin No. I/O Power Domain Description 8 10 12 14 PO 1.8V/3.0V Power source for (U)SIM card IO DO 1.8V/3.0V 1.8V/3.0V Data signal of (U)SIM card Clock signal of (U)SIM card DO 1.8V/3.0V Reset signal of (U)SIM card USIM_PRESENCE 44 DI 1.8V

(U)SIM card insertion detection EC21 Mini PCIe supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections, and it is disabled by default. For more details of AT+QSIMDET command, please refer to document [2]. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. EC21_Mini_PCIe_Hardware_Design 25 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design USIM_VDD 15K Module GND USIM_VDD USIM_RST USIM_CLK USIM_PRESENCE USIM_DATA 0R 0R 0R 100nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33pF 33pF 33pF GND GND GND Figure 4: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. USIM_VDD 15K Module GND USIM_VDD USIM_RST USIM_CLK USIM_DATA 0R 0R 0R 33pF 33pF 33pF 100nF

(U)SIM Card Connector VCC RST CLK GND VPP IO GND GND Figure 5: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers applications, please follow the criteria below in (U)SIM circuit design:

EC21_Mini_PCIe_Hardware_Design 26 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and power supply traces. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode with parasitic capacitance not exceeding 15pF. The 0 resistors should be added in series between the module and the (U)SIM card so as to facilitate debugging. The 33pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the

(U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 3.5. USB Interface The following table shows the pin definition of USB interface. Table 7: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_DM USB_DP 36 38 IO IO USB differential data (-) Require differential impedance of 90 USB differential data (+) Require differential impedance of 90 EC21 Mini PCIe is compliant with USB 2.0 specification. It can only be used as a slave device. Meanwhile, it supports high speed (480Mbps) mode and full speed (12Mbps) mode. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB. The following figure shows a reference circuit of USB interface. EC21_Mini_PCIe_Hardware_Design 27 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Minimize these stubs Test Points Module USB_DM USB_DP GND NM_0R NM_0R R3 R4 L1 ESD Array Close to Module MCU USB_DM USB_DP GND Figure 6: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2pF. Keep the ESD protection components to the USB connector as close as possible. NOTES 1. There are three preconditions when enabling EC21 Mini PCIe to enter into the sleep mode:

a) Execute AT+QSCLK=1 command to enable the sleep mode. Please refer to document [2] for details. b) DTR pin should be kept at high level (pulled up internally). c) USB interface on Mini PCIe must be connected with the USB interface of the host and please guarantee the USB of the host is in suspend state. EC21_Mini_PCIe_Hardware_Design 28 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 2. The ESD device used for USB interface protection has been built in the Mini PCIe, thus the external ESD device can be reserved for the further use. 3.6. UART Interface The following table shows the pin definition of the UART interface. Table 8: Pin Definition of UART Interface Pin Name UART_RX UART_TX UART_CTS UART_RTS Pin No. I/O Power Domain Description 11 13 23 25 DI 3.3V UART receive data DO 3.3V UART transmit data DI DO 3.3V 3.3V UART clear to send UART request to send The UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps and 230400bps baud rates, and the default is 115200bps. This interface can be used for AT command communication. NOTE AT+IPR command can be used to set the baud rate of the UART, and AT+IFC command can be used to set the hardware flow control (hardware flow control is disabled by default). Please refer to document [2]

for details. 3.7. PCM and I2C Interfaces EC21 Mini PCIe provides one Pulse Code Modulation (PCM) digital interface and one I2C interface. The following table shows the pin definition of PCM and 12C interfaces that can be applied in audio codec design. EC21_Mini_PCIe_Hardware_Design 29 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Table 9: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Power Domain Description PCM_CLK 1) PCM_DOUT 1) PCM_DIN 1) PCM_SYNC 1) I2C_SCL I2C_SDA 45 47 49 51 30 32 IO DO DI IO DO IO 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V PCM clock signal PCM data output PCM data input PCM frame synchronization I2C serial clock. Require external pull-up to 1.8V. I2C serial data. Require external pull-up to 1.8V. EC21 Mini PCIe provides one PCM digital interface, which supports 16-bit linear data format and the following modes:

Primary mode (short frame synchronization, works as either master or slave) Auxiliary mode (long frame synchronization, works as master only) NOTE 1) The digital audio (PCM) function is only supported on Telematics version. In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK at 8KHz PCM_SYNC, and also supports 4096KHz PCM_CLK at 16KHz PCM_SYNC. The following figure shows the timing relationship in primary mode with 8KHz PCM_SYNC and 2048KHz PCM_CLK. EC21_Mini_PCIe_Hardware_Design 30 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Figure 7: Timing in Primary Mode In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK and an 8KHz, 50% duty cycle PCM_SYNC. The following figure shows the timing relationship in auxiliary mode with 8KHz PCM_SYNC and 256KHz PCM_CLK. Figure 8: Timing in Auxiliary Mode Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC. In addition, EC21 Mini PCIes firmware has integrated the configuration on some PCM codecs application with I2C interface. Please refer to document [2] for details about AT+QDAI command. EC21_Mini_PCIe_Hardware_Design 31 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design The following figure shows a reference design of PCM interface with an external codec IC. PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN I2C_SCL I2C_SDA Module 1.8V BCLK FS DACIN ADCOUT SCLK SDIN MIC_BIAS MIC+

MIC-

SPKOUT+

SPKOUT-

Codec Figure 9: Reference Circuit of PCM Application with Audio Codec 3.8. Control and Indicator Signals The following table shows the pin definition of control and indicator signals. Table 10: Pin Definition of Control and Indicator Signals Pin Name Pin No. I/O Power Domain Description 17 31 20 22 42 1 RI DTR W_DISABLE#

PERST#

LED_WWAN#

WAKE#

DO 3.3V DI 3.3V DI 3.3V DI 3.3V OC OC Output signal used to wake up the host Sleep mode control Airplane mode control;

Pulled up by default;

Active low. Fundamental reset signal;

Active low. LED signal for indicating the network status of the module;

Active low. Output signal to wake up the host EC21_Mini_PCIe_Hardware_Design 32 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 3.8.1. RI Signal The RI signal can be used to wake up the host. When a URC returns, there will be the following behaviors on the RI pin after executing AT+QCFG="risignaltype","physical" command. High Low 120ms URC returns Figure 10: RI Behavior 3.8.2. DTR Signal The DTR signal supports sleep control function. Driving it to low level will wake up the module. 3.8.3. W_DISABLE# Signal EC21 Mini PCIe provides a W_DISABLE# signal to disable or enable the RF function (GNSS not included) W_DISABLE# signal function is disabled by default, and AT+QCFG=airplanecontrol,1 can be used to enable this function. The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. AT+CFUN can also be used to control the RF status, and the details are as follows:

Table 11: Airplane Mode Controlled by Hardware Method W_DISABLE#

RF Function Status Module Operation Mode High level Low level RF enabled RF disabled Normal mode Airplane mode Software method can be controlled by AT+CFUN, and has the same effect with W_DISABLE# signal function, the details is as follows. EC21_Mini_PCIe_Hardware_Design 33 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Table 12: Airplane Mode Controlled by Software Method AT+CFUN=?

RF Function Status Module Operation Mode Conditions 0 RF and (U)SIM disabled Minimum functionality mode Keep W_DISABLE# at high level. 3.8.4. PERST# Signal The PERST# signal can be used to force a hardware reset on the card. Customers can reset the module by driving the PERST# to a low level voltage within the time frame of 150ms~460ms and then releasing it. The reset scenario is illustrated in the following figure. VCC_3V3 PERST#

Module Status 150ms 460ms VIL0.5V VIH2.3V Running Resetting Restart Figure 11: Timing of Resetting Module 3.8.5. LED_WWAN# Signal The LED_WWAN# signal of EC21 Mini PCIe is used to indicate the network status of the module, and can absorb the current up to 40mA. According to the following circuit, in order to reduce the current of the LED, a resistor must be placed in series with the LED. The LED is emitting light when the LED_WWAN# output signal is active low. Figure 12: LED_WWAN# Signal Reference Circuit Diagram There are two indication modes for LED_WWAN# signal to indicate network status, which can be switched through following AT commands:

EC21_Mini_PCIe_Hardware_Design 34 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design AT+QCFG="ledmode",0 (Default setting) AT+QCFG="ledmode",2 The following tables show the detailed network status indications of the LED_WWAN# signal. Table 13: Indications of Network Status (AT+QCFG="ledmode",0, Default Setting) Pin Status Description Flicker slowly (200ms Low/1800ms High) Network searching Flicker slowly (1800ms Low/200ms High) Idle Flicker quickly (125ms Low/125ms High) Data transfer is ongoing Always Low Voice calling Table 14: Indications of Network Status (AT+QCFG="ledmode",2) Pin Status Low Level (Light on) High-impedance (Light off) 3.8.6. WAKE# Signal Description Registered on network No network coverage or not registered W_DISABLE# signal is at low level.

(Disable the RF) AT+CFUN=0, AT+CFUN=4 The WAKE# signal is an open collector signal which is similar to RI signal, but a host pull-up resistor and AT+QCFG="risignaltype","physical" command are required. When a URC returns, a 120ms low level pulse will be outputted. The state of WAKE# signal is shown as below. Figure 13: WAKE# Behavior EC21_Mini_PCIe_Hardware_Design 35 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 4 GNSS Receiver EC21 Mini PCIe includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC21 Mini PCIe supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC21 Mini PCIe GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. EC21_Mini_PCIe_Hardware_Design 36 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 5 Antenna Connection EC21 Mini PCIe is mounted with three antenna connectors for external antenna connection: a main antenna connector, an Rx-diversity antenna connector, and a GNSS antenna connector. And Rx-diversity function is enabled by default. The impedance of the antenna connectors is 50. 5.1. Operating Frequency The following table shows the operating frequencies of EC21 Mini PCIe. Table 15: Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 Transmit 824~849 880~915 1710~1785 1850~1910 1920~1980 1850~1910 1710~1755 824~849 880~915 1920~1980 1850~1910 1710~1785 1710~1755 Receive 869~894 925~960 1805~1880 1930~1990 2110~2170 1930~1990 2110~2155 869~894 925~960 2110~2170 1930~1990 1805~1880 2110~2155 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EC21_Mini_PCIe_Hardware_Design 37 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B26 LTE-FDD B28 LTE-TDD B40 824~849 2500~2570 880~915 699~716 777~787 815~830 830~845 832~862 814~849 703~748 869~894 2620~2690 925~960 729~746 746~756 860~875 875~890 791~821 859~894 758~803 2300~2400 2300~2400 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz 5.2. GNSS Frequency The following table shows the GNSS frequency of EC21 Mini PCIe. Table 16: GNSS Frequency Frequency 1575.421.023 1597.5~1605.8 1575.422.046 1561.0982.046 1575.42 Unit MHz MHz MHz MHz MHz Type GPS GLONASS Galileo BeiDou QZSS EC21_Mini_PCIe_Hardware_Design 38 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 5.3. GNSS Performance The following table shows the GNSS performance of EC21 Mini PCIe. Table 17: GNSS Performance Parameter Description Cold start Conditions Autonomous Sensitivity

(GNSS) Reacquisition Autonomous Tracking Cold start

@open sky Warm start

@open sky Hot start

@open sky CEP-50 Autonomous Autonomous XTRA enabled Autonomous XTRA enabled Autonomous XTRA enabled Autonomous

@open sky TTFF

(GNSS) Accuracy

(GNSS) NOTES Typ.

-146

-157

-157 35 18 26 2.2 2.5 1.8

<2.5 Unit dBm dBm dBm s s s s s s m 1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes position within 3 minutes after executing cold start command. EC21_Mini_PCIe_Hardware_Design 39 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 5.4. Antenna Requirements 5.4.1. Antenna Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 18: Antenna Requirements Type Requirements Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: <1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain: <17dB VSWR: 2 Efficiency: > 30%

Max input power: 50W Input impedance: 50 Cable insertion loss: < 1dB

(GSM850, EGSM900, WCDMA B5/B8, LTE-FDD B5/B8/B12/B13/B18/B19/B20/B26/B28) Cable insertion loss: < 1.5dB

(DCS1800, PCS1900, WCDMA B1/B2/B4, LTE-FDD B1/B2/B3/B4) Cable insertion loss < 2dB

(LTE-FDD B7, LTE-TDD B40) GNSS1) GSM/UMTS/LTE NOTES 1. It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 2. Since the GNSS port has a 2.85V voltage output, a passive antenna that causes shorting to GND, such as PIFA antenna is not recommended. EC21_Mini_PCIe_Hardware_Design 40 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 5.4.2. Antenna Connectors and Mating Plugs The dimensions of the antenna connectors are shown as below. Figure 14: Dimensions of Antenna Connectors (Unit: mm) It is recommended to use U.FL-LP mating plugs listed in the following figure to match the antenna connectors. Figure 15: Mechanicals of U.FL-LP Mating Plugs EC21_Mini_PCIe_Hardware_Design 41 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design The following figure describes the space factor of mating plugs. Figure 16: Space Factor of Mating Plugs (Unit: mm) For more details of the recommended mating plugs, please visit http://www.hirose.com. EC21_Mini_PCIe_Hardware_Design 42 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. General Description This chapter mainly describes the following electrical and radio characteristics of EC21 Mini PCIe:

Power supply requirements I/O requirements RF characteristics GNSS receiver ESD characteristics Current consumption Thermal consideration 6.2. Power Supply Requirements The input voltage of EC21 Mini PCIe is 3.3V9%, as specified by PCI Express Mini CEM Specifications 1.2. The following table shows the power supply requirements of EC21 Mini PCIe. Table 19: Power Supply Requirements Parameter Description VCC_3V3 Power supply Min. 3.0 Typ. 3.3 Max. 3.6 Unit V EC21_Mini_PCIe_Hardware_Design 43 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 6.3. I/O Requirements The following table shows the I/O requirements of EC21 Mini PCIe. Table 20: I/O Requirements Parameter Description Min. Max. Unit Input High Voltage 0.7 VCC_3V3 VCC_3V3+0.3 Input Low Voltage

-0.3 0.3 VCC_3V3 Output High Voltage VCC_3V3-0.5 VCC_3V3 Output Low Voltage 0 0.4 V V V V VIH VIL VOH VOL NOTES 1. The PCM and I2C interfaces belong to 1.8V power domain and other I/O interfaces belong to VCC_3V3 power domain. 2. The maximum voltage value of VIL for PERST# signal and W_DISABLE# signal is 0.5V. 6.4. RF Characteristics The following tables show the conducted RF output power and receiving sensitivity of EC21 Mini PCIe module. Table 21: Conducted RF Output Power of EC21 Mini PCIe Frequency GSM850/EGSM900 DCS1800/PCS1900 GSM850/EGSM900 (8-PSK) DCS1800/PCS1900 (8-PSK) Max. 33dBm2dB 30dBm2dB 27dBm3dB 26dBm3dB WCDMA bands 24dBm+1/-3dB Min. 5dBm5dB 0dBm5dB 5dBm5dB 0dBm5dB

< -49dBm EC21_Mini_PCIe_Hardware_Design 44 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design LTE-FDD bands LTE-TDD bands 23dBm2dB 23dBm2dB

< -39dBm

< -39dBm Table 22: Conducted RF Receiving Sensitivity of EC21-E Mini PCIe Frequency EGSM900 DCS1800 WCDMA B1 WCDMA B5 WCDMA B8 Primary Diversity SIMO1) 3GPP (SIMO)

-109.0dBm

-109.0dBm

-110.5dBm

-110.5dBm

-110.5dBm

/

/

/

/

/

/

/

/

/

/

-102.0dBm

-102.0dbm

-106.7dBm

-104.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-98.0dBm

-101.5dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-98.5dBm

-101.5dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.5dBm

-101.0dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-97.0dBm

-99.5dBm

-94.3dBm LTE-FDD B8 (10MHz)

-97.0dBm

-97.0dBm

-101.0dBm

-93.3dBm LTE-FDD B20 (10MHz)

-97.5dBm

-99.0dBm

-102.5dBm

-93.3dBm Table 23: Conducted RF Receiving Sensitivity of EC21-A Mini PCIe Frequency WCDMA B2 WCDMA B4 WCDMA B5 Primary Diversity SIMO1) 3GPP (SIMO)

-110.0dBm

-110.0dBm

-110.5dBm

/

/

/

/

/

/

-104.7dBm

-106.7dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98.0dBm

-98.0dBm

-101.0dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.5dBm

-99.0dBm

-101.0dBm

-96.3dBm LTE-FDD B12 (10MHz)

-97.2dBm

-98.0dBm

-101.0dBm

-93.3dBm EC21_Mini_PCIe_Hardware_Design 45 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Table 24: Conducted RF Receiving Sensitivity of EC21-V Mini PCIe Frequency Primary LTE-FDD B4 (10MHz)

-97.5dBm LTE-FDD B13 (10MHz)

-97.7dBm Diversity

-99.0dBm

-97.0dBm SIMO1) 3GPP (SIMO)

-101.0dBm

-96.3dBm

-100.0dBm

-93.3dBm Table 25: Conducted RF Receiving Sensitivity of EC21-AUT Mini PCIe Frequency WCDMA B1 WCDMA B5 Primary Diversity SIMO1) 3GPP (SIMO)

-110.0dBm

-110.5dBm

/

/

/

/

-106.7dBm

-104.7dBm LTE-FDD B1 (10MHz)

-98.5dBm

-98.0dBm

-101.0dBm

-96.3dBm LTE-FDD B3 (10MHz)

-98.0dBm

-97.0dBm

-100.0dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-99.0dBm

-102.5dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-97.0dBm

-98.5dBm

-94.3dBm LTE-FDD B28 (10MHz)

-97.0dBm

-99.0dBm

-102.0dBm

-94.8dBm Table 26: Conducted RF Receiving Sensitivity of EC21-KL Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B1 (10MHz)

-98.0dBm

-99.5dBm

-100.5dBm

-96.3dBm LTE-FDD B3 (10MHz)

-97.0dBm

-97.5dBm

-99.5dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98.0dBm LTE-FDD B7 (10MHz)

-96.0dBm

-99.5dBm

-96.0dBm

-100.5dBm

-94.3dBm

-98.5dBm

-94.3dBm LTE-FDD B8 (10MHz)

-97.0dBm

-99.0dBm

-101.0dBm

-93.3dBm EC21_Mini_PCIe_Hardware_Design 46 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Table 27: Conducted RF Receiving Sensitivity of EC21-J Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B1 (10MHz)

-97.5dBm

-98.7dBm

-100.2dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-97.1dBm

-100.5dBm

-93.3dBm LTE-FDD B8 (10MHz)

-98.4dBm

-99.0dBm

-101.2dBm

-93.3dBm LTE-FDD B18 (10MHz)

-99.5dBm

-99.0dBm

-101.7dBm

-96.3dBm LTE-FDD B19 (10MHz)

-99.2dBm

-99.0dBm

-101.4dBm

-96.3dBm LTE-FDD B26 (10MHz)

-99.5dBm

-99.0dBm

-101.5dBm

-93.8dBm Table 28: Conducted RF Receiving Sensitivity of EC21-AU Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO) GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B5 WCDMA B8

-109.0dBm

-109.0dBm

-109.0dBm

-109.0dBm

-110.0dBm

-110.0dBm

-111.0dBm

-111.0dBm

/

/

/

/

/

/

/

/

/

/

/

/

/

/

/

/

-102.0dBm

-102.0dBm

-102.0dBm

-102.0dBm

-106.7dBm

-104.7dBm

-104.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-97.2dBm

-97.5dBm

-100.2dBm

-96.3dBm LTE-FDD B2 (10MHz)

-98.2dBm

/

/

-94.3dBm LTE-FDD B3 (10MHz)

-98.7dBm LTE-FDD B4 (10MHz)

-97.7dBm

-98.6dBm

-97.4dBm

-102.2dBm

-93.3dBm

-100.2dBm

-96.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.2dBm

-101.0dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.7dBm

-97.7dBm

-101.2dBm

-94.3dBm EC21_Mini_PCIe_Hardware_Design 47 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design LTE-FDD B8 (10MHz)

-99.2dBm

-98.2dBm

-102.2dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.6dBm LTE-TDD B40 (10MHz)

-97.2dBm

-98.7dBm

-98.4dBm

-102.0dBm

-94.8dBm

-101.2dBm

-96.3dBm Table 29: Conducted RF Receiving Sensitivity of EC21-EU Mini PCIe Frequency EGSM900 DCS1800 WCDMA B1 WCDMA B8 LTE-FDD B1 (10MHz) LTE-FDD B3 (10MHz) LTE-FDD B7 (10MHz) LTE-FDD B8 (10MHz) LTE-FDD B20 (10MHz) LTE-FDD B28 (10MHz) Primary Diversity SIMO1) 3GPP (SIMO)

-108.5dBm

-108.5dBm

-110dBm

-110dBm

-98.5dBm

-97.8dBm

-96.7dBm

-98.7dBm

-98.7dBm

-99dBm

/

/

/

/

/

/

/

/

-102.0dBm

-102.0dbm

-106.7dBm

-103.7dBm

-99dBm

-101.2dBm

-96.3dBm

-99.7dBm

-101.7dBm

-93.3dBm

-98.5dBm

-99.7dBm

-94.3dBm

-100dBm

-102.2dBm

-93.3dBm

-99.5dBm

-102.2dBm

-93.3dBm

-100dBm

-102.2dBm

-94.8dBm Table 30: Conducted RF Receiving Sensitivity of EC21-EC Mini PCIe Frequency EGSM900 DCS1800 WCDMA B1 WCDMA B8 Primary Diversity SIMO1) 3GPP (SIMO)

-108.8dBm

-109.0dBm

-110.5dBm

-110.5dBm

/

/

/

/

/

/

/

/

-102.0dBm

-102.0dbm

-106.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-98.0dBm

-101.0dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-98.5dBm

-100.0dBm

-93.3dBm EC21_Mini_PCIe_Hardware_Design 48 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design LTE-FDD B7 (10MHz)

-97.0dBm

-95.5dBm

-99.5dBm

-94.3dBm LTE-FDD B8 (10MHz)

-97.0dBm

-97.0dBm

-101.0dBm

-93.3dBm LTE-FDD B20 (10MHz)

-97.5dBm

-99.0dBm

-101.0dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.6dBm

-98.7dBm

-101.5dBm

-94.8dBm Table 31: Conducted RF Receiving Sensitivity of EC21-AUX Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO) GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8

-109.0dBm

-109.0dBm

-109.0dBm

-109.0dBm

/

/

/

/

/

/

/

/

-102.0dBm

-102.0dBm

-102.0dBm

-102.0dBm

-110.0dBm

-109.5dBm

-112dBm

-106.7dBm

-110.5dBm

/

/

-104.7dBm

-110.0dBm

-111.0dBm

-111.0dBm

-110dBm

-112dBm

-112dBm

-112dBm

-104.7dBm

-113dBm

-104.7dBm

-113dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-97.7dBm

-101.2dBm

-96.3dBm LTE-FDD B2 (10MHz)

-98.5dBm

/

/

-94.3dBm LTE-FDD B3 (10MHz)

-99.0dBm LTE-FDD B4 (10MHz)

-97.7dBm LTE-FDD B5 (10MHz)

-98.5dBm LTE-FDD B7 (10MHz)

-97.7dBm LTE-FDD B8 (10MHz)

-99.0dBm LTE-FDD B28 (10MHz)

-98.0dBm LTE-TDD B40 (10MHz)

-97.5dBm

-98.8dBm

-97.6dBm

-98.2dBm

-97.7dBm

-98.5dBm

-98.7dBm

-98.2dBm

-102.2dBm

-93.3dBm

-100.2dBm

-96.3dBm

-101.0dBm

-94.3dBm

-101.2dBm

-94.3dBm

-102.2dBm

-93.3dBm

-101.5dBm

-94.8dBm

-101.2dBm

-96.3dBm EC21_Mini_PCIe_Hardware_Design 49 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design NOTE 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.5. ESD Characteristics The following table shows the ESD characteristics of EC21 Mini PCIe. Table 32: ESD Characteristics of EC21 Mini PCIe Tested Interfaces Contact Discharge Air Discharge Unit Power Supply and GND Antenna Interfaces USB Interface

(U)SIM Interface Others

+/-5

+/-4

+/-4

+/-4

+/-0.5

+/-10

+/-8

+/-8

+/-8

+/-1 KV KV KV KV KV 6.6. Current Consumption The following tables describe the current consumption of EC21 Mini PCIe series module. Table 33: Current Consumption of EC21-A Mini PCIe Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) IVBAT Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) 3.5 5.0 4.4 5.3 4.5 mA mA mA mA mA EC21_Mini_PCIe_Hardware_Design 50 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Idle state WCDMA data transfer

(GNSS OFF) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA B2 HSDPA @21.59dBm WCDMA B2 HSUPA @22.17dBm WCDMA B4 HSDPA @21.47dBm WCDMA B4 HSUPA @21.73dBm WCDMA B5 HSDPA @20.02dBm WCDMA B5 HSUPA @20.18dBm LTE data transfer

(GNSS OFF) WCDMA voice call LTE-FDD B2 @22.93dBm LTE-FDD B4 @22.72dBm LTE-FDD B12 @23.26dBm WCDMA B2 @22.88dBm WCDMA B4 @23.21dBm WCDMA B5 @23.13dBm 32.0 45.0 32.0 45.0 582.0 675.0 575.0 637.0 686.0 577.0 926.0 934.0 835.0 610.0 743.0 643.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Table 34: Current Consumption of EC21-V Mini PCIe Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) IVBAT Idle state LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE data transfer

(GNSS OFF) LTE-FDD B4 @23.59dBm LTE-FDD B13 @24.05dBm 3.8 5.3 4.9 30.0 42.0 997.0 724.0 mA mA mA mA mA mA mA EC21_Mini_PCIe_Hardware_Design 51 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Table 35: Current Consumption of EC21-KL Mini PCIe Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) Idle state LTE data transfer

(GNSS OFF) LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-FDD B1 @22.78dBm LTE-FDD B3 @23.03dBm LTE-FDD B5 @23.03dBm LTE-FDD B7 @22.89dBm LTE-FDD B8 @22.86dBm 3.5 5.6 4.7 35.0 49.0 972.0 974.0 764.0 959.0 839.0 mA mA mA mA mA mA mA mA mA mA IVBAT Table 36: Current Consumption of EC21-AUX Mini PCIe Parameter Description Conditions AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) IVBAT LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) Idle state GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) Typ. 1.79 3.06 2.36 3.70 3.28 4.41 3.59 4.45 3.68 22.4 42.8 Unit mA mA mA mA mA mA mA mA mA mA mA EC21_Mini_PCIe_Hardware_Design 52 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) GSM850 4DL/1UL @32.50dBm GSM850 3DL/2UL @31.69dBm GSM850 2DL/3UL @29.48dBm GSM850 1DL/4UL @28.35dBm EGSM900 4DL/1UL @33.50dBm EGSM900 3DL/2UL @32.04dBm EGSM900 2DL/3UL @29.52dBm EGSM900 1DL/4UL @28.45dBm DCS1800 4DL/1UL @29.72dBm DCS1800 3DL/2UL @28.82dBm DCS1800 2DL/3UL @26.79dBm DCS1800 1DL/4UL @25.71dBm PCS1900 4DL/1UL @29.44dBm PCS1900 3DL/2UL @28.60dBm PCS1900 2DL/3UL @26.46dBm PCS1900 1DL/4UL @25.36dBm GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) GSM850 4DL/1UL PCL=8 @27.08dBm GSM850 3DL/2UL PCL=8 @25.80dBm GSM850 2DL/3UL PCL=8 @23.80dBm 23.1 43.4 30.7 43.5 31.2 43.8 335.0 537.0 605.0 701.0 386.0 563.0 606.0 703.0 194.0 291.0 361.0 450.0 202.0 306.0 370.0 456.0 223.0 370.0 492.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Mini_PCIe_Hardware_Design 53 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design GSM850 1DL/4UL PCL=8 @22.60dBm EGSM900 4DL/1UL PCL=8 @27.42dBm EGSM900 3DL/2UL PCL=8 @26.23dBm EGSM900 2DL/3UL PCL=8 @24.10dBm EGSM900 1DL/4UL PCL=8 @22.80dBm DCS1800 4DL/1UL PCL=2 @26.50dBm DCS1800 3DL/2UL PCL=2 @25.50dBm DCS1800 2DL/3UL PCL=2 @23.60dBm DCS1800 1DL/4UL PCL=2 @22.37dBm PCS1900 4DL/1UL PCL=2 @26.26dBm PCS1900 3DL/2UL PCL=2 @25.30dBm PCS1900 2DL/3UL PCL=2 @23.10dBm PCS1900 1DL/4UL PCL=2 @21.97dBm WCDMA B1 HSDPA @21.57dBm WCDMA B1 HSUPA @21.79dBm WCDMA B2 HSDPA @22.00dBm WCDMA data transfer

(GNSS OFF) WCDMA B2 HSUPA @21.98dBm WCDMA B5 HSDPA @22.90dBm WCDMA B5 HSUPA @22.66dBm WCDMA B8 HSDPA @21.59dBm WCDMA B8 HSUPA @21.37dBm LTE-FDD B1 @23.36dBm LTE data transfer

(GNSS OFF) LTE-FDD B2 @23.18dBm LTE-FDD B3 @23.13dBm LTE-FDD B4 @23.25dBm 623.0 227.0 371.0 492.0 626.0 171.0 280.0 387.0 504.0 170.0 280.0 389.0 508.0 650.0 667.0 706.0 715.0 617.0 633.0 624.0 654.0 938.0 953.0 814.0 778.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Mini_PCIe_Hardware_Design 54 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design LTE-FDD B5@23.06dBm LTE-FDD B7 @23.17dBm LTE-FDD B8 @22.89dBm LTE-FDD B28 @22.55dBm LTE-TDD B40 @23.27dBm GSM850 PCL=5 @32.40dBm EGSM900 PCL=5 @33.58dBm DCS1800 PCL=0 @29.45dBm PCS1900 PCL=0 @29.56dBm WCDMA B1 @22.15dBm WCDMA B2 @22.77dBm WCDMA B5 @23.16dBm WCDMA B8 @22.62dBm GSM voice call WCDMA voice call 697.0 886.0 852.0 939.0. 421.0 322.0 379.0 182.0 195.0 714.0 780.0 658.0 698.0 mA mA mA mA mA mA mA mA mA mA mA mA mA Table 37: Current Consumption of EC21-EU Mini PCIe Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) Sleep state WCDMA PF=64 (USB disconnected) IVBAT WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) Idle state GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) 3.6 5.3 4.2 5.1 4.5 5.6 4.8 24.7 38.0 mA mA mA mA mA mA mA mA mA EC21_Mini_PCIe_Hardware_Design 55 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) EGSM900 4DL/1UL @33.39dBm EGSM900 3DL/2UL @32.47dBm EGSM900 2DL/3UL @29.49dBm EGSM900 1DL/4UL @28.05dBm DCS1800 4DL/1UL @31.44dBm DCS1800 3DL/2UL @30.38dBm DCS1800 2DL/3UL @28.27dBm DCS1800 1DL/4UL @27.01dBm EGSM900 4DL/1UL PCL=8 @26.39dBm EGSM900 3DL/2UL PCL=8 @25.39dBm EGSM900 2DL/3UL PCL=8 @23.34dBm EGSM900 1DL/4UL PCL=8 @22.26dBm DCS1800 4DL/1UL PCL=2 @26.49dBm DCS1800 3DL/2UL PCL=2 @25.23dBm DCS1800 2DL/3UL PCL=2 @22.96dBm DCS1800 1DL/4UL PCL=2 @22.08dBm GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) WCDMA data transfer

(GNSS OFF) WCDMA B1 HSDPA @23.00dBm WCDMA B1 HSUPA @22.57dBm WCDMA B8 HSDPA @22.97dBm WCDMA B8 HSUPA @22.52dBm LTE data LTE-FDD B1 @22.09dBm 25.3 38.0 26.0 37.0 389.3 593.6 611.6 682.1 260.9 391.2 464.2 550.5 198.6 303.9 372.8 451.4 190.5 300.4 394.8 496.9 754.6 662.3 749.9 662.5 875.2 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Mini_PCIe_Hardware_Design 56 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design transfer

(GNSS OFF) LTE-FDD B3 @22.42dBm LTE-FDD B7 @22.21dBm LTE-FDD B8 @23.37dBm LTE-FDD B20 @22.72dBm LTE-FDD B28A @21.72dBm GSM voice call EGSM900 PCL=5 @33.53dBm DCS1800 PCL=0 @31.20dBm WCDMA voice call WCDMA B1 @23.45dBm WCDMA B8 @23.51dBm 938.3 1036.0 897.5 913.0 898.8 385.0 256.0 794.6 792.0 mA mA mA mA mA mA mA mA mA Table 38: Current Consumption of EC21-AU Mini PCIe Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) IVBAT LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) Idle state 2.8 4.3 3.3 3.5 3.1 4.6 3.9 4.7 3.9 24.1 37.4 25.4 38.4 mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Mini_PCIe_Hardware_Design 57 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) GSM850 4DL/1UL @32.62dBm GSM850 3DL/2UL @32.52dBm GSM850 2DL/3UL @30.53dBm GSM850 1DL/4UL @29.27dBm EGSM900 4DL/1UL @32.76dBm EGSM900 3DL/2UL @32.80dBm EGSM900 2DL/3UL @30.52dBm EGSM900 1DL/4UL @29.49dBm DCS1800 4DL/1UL @30.05dBm DCS1800 3DL/2UL @30.02dBm DCS1800 2DL/3UL @29.73dBm DCS1800 1DL/4UL @29.62dBm PCS1900 4DL/1UL @29.82dBm PCS1900 3DL/2UL @29.92dBm PCS1900 2DL/3UL @29.76dBm PCS1900 1DL/4UL @29.35dBm GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) GSM850 4DL/1UL PCL=8 @26.62dBm GSM850 3DL/2UL PCL=8 @26.56dBm GSM850 2DL/3UL PCL=8 @26.39dBm GSM850 1DL/4UL PCL=8 @26.25dBm EGSM900 4DL/1UL PCL=8 @26.74dBm 25.4 38.8 25.8 39.0 312.8 530.6 602.5 686.0 344.5 590.8 657.3 752.4 229.1 365.2 501.5 637.5 228.2 366.9 496.2 628.4 191.0 303.0 414.2 537.2 196.3 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Mini_PCIe_Hardware_Design 58 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design EGSM900 3DL/2UL PCL=8 @26.91dBm EGSM900 2DL/3UL PCL=8 @26.78dBm EGSM900 1DL/4UL PCL=8 @26.67dBm DCS1800 4DL/1UL PCL=2 @26.33dBm DCS1800 3DL/2UL PCL=2 @26.65dBm DCS1800 2DL/3UL PCL=2 @26.33dBm DCS1800 1DL/4UL PCL=2 @26.35dBm PCS1900 4DL/1UL PCL=2 @26.01dBm PCS1900 3DL/2UL PCL=2 @26.45dBm PCS1900 2DL/3UL PCL=2 @26.12dBm PCS1900 1DL/4UL PCL=2 @26.09dBm WCDMA B1 HSDPA @22.30dBm WCDMA B1 HSUPA @21.62dBm WCDMA B2 HSDPA @21.93dBm WCDMA B2 HSUPA @21.99dBm WCDMA B5 HSDPA @22.44dBm WCDMA B5 HSUPA @22.14dBm WCDMA B8 HSDPA @21.62dBm WCDMA B8 HSUPA @21.65dBm LTE-FDD B1 @23.71dBm LTE-FDD B2 @23.00dBm LTE-FDD B3 @23.34dBm LTE-FDD B4 @23.05dBm LTE-FDD B5 @22.84dBm LTE-FDD B7 @22.77dBm 343.9 449.6 570.8 199.2 306.3 419.8 540.1 186.5 315.3 406.6 524.5 758.3 755.7 792.0 799.1 746.5 741.1 625.1 647.4 1025.4 996.0 950.1 892.1 816.1 1198.1 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) EC21_Mini_PCIe_Hardware_Design 59 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design LTE-FDD B8 @23.04dBm LTE-FDD B28A @23.54dBm LTE-TDD B40 @23.79dBm GSM850 PCL=5 @32.80dBm EGSM900 PCL=5 @33.16dBm DCS1800 PCL=0 @29.81dBm PCS1900 PCL=0 @29.79dBm WCDMA B1 @23.27dBm WCDMA B2 @22.89dBm WCDMA B5 @22.87dBm WCDMA B8 @22.89dBm GSM voice call WCDMA voice call Table 39: GNSS Current Consumption of EC21 Mini PCIe Series Module Parameter Description Conditions Searching

(AT+CFUN=0) Cold start @Passive Antenna Lost state @Passive Antenna Tracking

(AT+CFUN=0) Instrument environment Open Sky @Passive Antenna Open Sky @Active Antenna IVBAT

(GNSS) 807.4 932.0 585.2 316.2 348.7 216.8 214.9 823.4 898.7 776.9 685.6 Typ. 75.0 74.0 44.0 53.0 58.0 mA mA mA mA mA mA mA mA mA mA mA Unit mA mA mA mA mA 6.7. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:

On customers PCB design, please keep placement of the PCI Express Mini Card away from heating sources. Do not place components on the PCB area where the module is mounted, in order to facilitate adding of heatsink. EC21_Mini_PCIe_Hardware_Design 60 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design Do not apply solder mask on the PCB area where the module is mounted, so as to ensure better heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Add a heatsink on the top of the module and the heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module. Add a thermal pad with appropriate thickness at the bottom of the module to conduct the heat to PCB. The following figure shows the referenced heatsink design. Figure 17: Referenced Heatsink Design NOTES 1. The module offers the best performance when the internal BB chip stays below 105C. When the maximum temperature of the BB chip reaches or exceeds 105C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. 2. For more detailed guidelines on thermal design, please refer to document [4]. EC21_Mini_PCIe_Hardware_Design 61 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 7 Dimensions and Packaging 7.1. General Description This chapter mainly describes mechanical dimensions as well as packaging specification of EC21 Mini PCIe module. All dimensions are measured in mm, and the dimensional tolerances are 0.05mm unless otherwise specified. 7.2. Mechanical Dimensions of EC21 Mini PCIe 30.000.15 24.200.20 3x3.000.10 5.980.10 2x2.600.1 0.610.05 2.350.10 8.250.10 5.450.10 6.380.10 6.350.10 34.300.20 48.050.20 4.900.20 4.000.10 Pin1 Pin51 Top View 10.350.10 Figure 18: Mechanical Dimensions of EC21 Mini PCIe 50.950.15 1.400.10 9.900.10 7.260.10 1.000.10 Side View EC21_Mini_PCIe_Hardware_Design 62 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 7.3. Standard Dimensions of Mini PCI Express The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1]

for detailed A and B. Figure 19: Standard Dimensions of Mini PCI Express EC21_Mini_PCIe_Hardware_Design 63 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design EC21 Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives and standards listed in the document [1]. The following figure takes the Molex 679100002 as an example. Figure 20: Dimensions of the Mini PCI Express Connector (Molex 679100002) 7.4. Packaging Specifications The EC21 Mini PCIe is packaged in a tray. Each tray contains 10pcs of modules. The smallest package of EC21 Mini PCIe contains 100pcs. EC21_Mini_PCIe_Hardware_Design 64 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design 8 Appendix A References Table 40: Related Documents SN

[1]

[2]

[3]

Document Name Remark PCI Express Mini Card Electromechanical Specification Revision 1.2 Quectel_EC2x&EG9x&EM05_AT_Commands_ Manual Quectel_EC2x&EGxx&EM05_GNSS_AT_ Commands_Manual Mini PCI Express specification AT commands manual for EC25, EC21, EC20 R2.0, EC20 R2.1, EG91, EG95 and EM05 modules GNSS AT Commands Manual for EC25, EC21, EC20 R2.0, EC20 R2.1, EG95, EG91, EG25-G and EM05 modules Thermal design guide for LTE modules including EC25, EC21, EC20 R2.0, EC20 R2.1, EG91, EG95, EP06, EG06, EM06 and AG35.

[4]

Quectel_LTE_Module_Thermal_Design_Guide Table 41: Terms and Abbreviations Abbreviation Description AMR bps BT CS CTS Adaptive Multi-rate Bits Per Second Bluetooth Coding Scheme Clear to Send DC-HSPA+

Dual-carrier High Speed Packet Access DFOTA DL Delta Firmware Upgrade Over The Air Down Link EC21_Mini_PCIe_Hardware_Design 65 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design DTE DTR EFR EMI ESD ESR FDD FR Data Terminal Equipment Data Terminal Ready Enhanced Full Rate Electro Magnetic Interference Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplexing Full Rate GLONASS GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System GMSK GNSS GPS GSM HR HSPA HSUPA kbps LED LTE Mbps MCU ME MIMO MMS MO Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Uplink Packet Access Kilo Bits Per Second Light Emitting Diode Long-Term Evolution Million Bits Per Second Micro Control Unit Mobile Equipment Multiple-Input Multiple-Output Multimedia Messaging Service Mobile Originated EC21_Mini_PCIe_Hardware_Design 66 / 64 LTE Standard Module Series EC21 Mini PCIe Hardware Design MT NMEA PCM PDA PDU POS PPP RF RTS Rx SIMO SMS TX TVS UART UL URC USB

(U)SIM WCDMA WLAN Mobile Terminated National Marine Electronics Association Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Point of Sale Point-to-Point Protocol Radio Frequency Ready To Send Receive Single Input Multiple Output Short Message Service Transmitting Direction Transient Voltage Suppressor Universal Asynchronous Receiver & Transmitter Up Link Unsolicited Result Code Universal Serial Bus

(Universal) Subscriber Identification Module Wideband Code Division Multiple Access Wireless Local Area Networks EC21_Mini_PCIe_Hardware_Design 67 / 64

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Quectel Wireless Solutions Company Limited EC21-AUX original date of grant : 10/31/2019, Certificate number :192181004AA00 FCC IDXMR201909EC21AUX Name: LTE Module Parent Model: EC21-AUX, EC21-AUX MINIPCIE The description of the modification is as follows 1. FEM IC (swtich, and PA) are changed 2. the swtich are changed. All reports are updated as follows:

EC21-AUX, EC21-AUX MINIPCIE (Report No.: R2108A0686-R1V1) is a variant model of EC21-AUX MINIPCIE (Report No.: R1908A0502-R1). There is only changed the Power Amplifier and Software Version of product. Tested cases refer to the following table. Please refer to Appendix C for Verify data Test Case Original Variant RF Power Output and Effective Radiated Power Occupied Bandwidth Band Edge Compliance PASS Retest(GSM850 /WCDMA Band V/ LTE band5) PASS PASS Verify the worst combination of each frequency band(GSM850 / WCDMA Band V/ LTE band5) Verify the worst combination of each frequency band(GSM850 / WCDMA Band V/ LTE band5) Peak-to-Average Power Ratio PASS Retest(GSM850 / WCDMA Band V/ LTE band 5) Frequency Stability PASS Retest(GSM850 / WCDMA Band V/ LTE band 5) Spurious Emissions at Antenna Terminals PASS Verify the worst combination of each frequency band(GSM850 / WCDMA Band V/ LTE band5) Radiates Spurious Emission PASS Retest(GSM850 / WCDMA Band V/ LTE band 5) EC21-AUX, EC21-AUX MINIPCIE (Report No.: R2108A0686-R2V1) is a variant model of EC21-AUX MINIPCIE (Report No.: R1908A0502-R2). There is only changed the Power Amplifier and Software Version of product. Tested cases refer to the following table. Please refer to Appendix C for Verify data Test Case Original Variant RF Power Output and Effective Radiated Power Occupied Bandwidth Band Edge Compliance PASS Retest(GSM1900/WCDMA Band II/LTE Band 2) PASS PASS Verify the worst combination of each frequency band(GSM1900/WCDMA Band II/LTE Band 2) Verify the worst combination of each frequency band(GSM1900/WCDMA Band II/LTE Band 2) Peak-to-Average Power Ratio PASS Retest(GSM1900/WCDMA Band II/LTE Band 2) Frequency Stability PASS Retest(GSM1900/WCDMA Band II/LTE Band 2) Spurious Emissions at Antenna Terminals PASS Verify the worst combination of each frequency band(GSM1900/WCDMA Band II/LTE Band 2) Radiates Spurious Emission PASS Retest(GSM1900/WCDMA Band II/LTE Band 2) EC21-AUX, EC21-AUX MINIPCIE (Report No.: R2108A0686-R3V1) is a variant model of EC21-AUX MINIPCIE (Report No.: R1908A0502-R3). There is only changed the Power Amplifier and Software Version of product. Tested cases refer to the following table. Please refer to Appendix C for Verify data Test Case Original Variant RF Power Output and Effective Radiated Power Occupied Bandwidth Band Edge Compliance PASS Retest(WCDMA Band IV/ LTE Band 4/7) PASS PASS Verify the worst combination of each frequency band(WCDMA Band IV/ LTE Band 4/7) Verify the worst combination of each frequency band(WCDMA Band IV/ LTE Band 4/7) Peak-to-Average Power Ratio PASS Retest(WCDMA Band IV/ LTE Band 4/7) Frequency Stability PASS Retest(WCDMA Band IV/ LTE Band 4/7) Spurious Emissions at Antenna Terminals PASS Verify the worst combination of each frequency band(WCDMA Band IV/ LTE Band 4/7) Radiates Spurious Emission PASS Retest(WCDMA Band IV/ LTE Band 4/7) Your assistance on this matter is highly appreciated. Signature:

Print name: Jean Hu Date: 11/20/2021 Company: Quectel Wireless Solutions Co., Ltd.

 

 

The cover letter - C2PCPX 1) The requirements of 2.1043 are fulfilled, i.e., the devices block functions for the fundamentalfrequency, primary modulator circuit, maximum power, or field strength ratings shall remain unchanged. Reply:

The max power of PA remains un-changed with test result in the newly test report being measured lower as compared to the original. Only the following components are changed. RF Switches, and 2G FEM module (IC) with PA, and internal switch are changed 2) Transmitter PCB layout and parts changes are only permitted if there is no change in identifying adevices form, functional specification, as initially granted or previously approved under a Class IIpermissive change. Reply:

PCB remains identical, Both switches, and 2G (GSM) FEM module are pin to pin compatible with same Pin defined. 3) PCB changes are limited to non-substantive modifications layout changes to the same size physicalcircuit board previously granted. Reply:

Layout is identical with non-electrical identical RF components changed. The datasheet as submitted yields the characteristics with better performance with regards to image suppression, sensitivity, etc. And, Max power is set identically, and lower than the original one. 4) C2PCPX is not permitted to add, remove, augment, or change capabilities, such as transmitters, increasedbandwidth, additional rule parts, bands, etc. Reply:

There is no augment, add, or change as compared to the original. The 2G GSM FEM module remains in part 22, and 24. The replacing switches has larger capability to handle higher input power (RF), however, the power by RF remains the same with purpose to yield better power handling, and leakage ratio 5) In the PAG submission for item C2PCPX, the applicant shall provide complete information on testing demonstrating that the proposed changes for fundamental emissions are unchanged within the normal,acceptable tolerances and out-of-band;

emissions do not exceed the appropriate limits.The PAG submission shall include all applicable test reports and internal photos. Reply:

The submitted evaluation, The spot check summary sheet TA1208, with appendix C of the submitted test report reflects the tolerances as compared to the original are controlled. Furthermore, emissions as tested under spot check mode are even better. 6) The modified device shall not be marketed under the existing grant of certification before confirmationthat the C2PCPX PAG is approved and granted. Reply:

The modified device would not be marketed, and imported before this PAG is approved, and obtaining the grant 7) Software Defined Radio (SDR) grants that use the C2PCPX procedure are not permitted to makesubsequent Class III permissive changes. Reply:

This application is not SDR equipment, but non-SDR with components changed 8) The C2PCPX PAG procedure has no impact on the provisions of V) of this publication for non-SDRsoftware-only changes; thus, adding an equipment class when related to rule changes is still permitted. Reply:

Inapplicable as this is non-SDR module 9) Class I permissive changes are not permitted3 under this C2PCPX procedure. Reply:

Class II is pursuant Signature:

Print name: Jean Hu Date 01/07/2021 Company: Quectel Wireless Solutions Co., Ltd.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Quectel Wireless Solutions Company Limited POWER OF ATTORNEY DATE: November 20,2021 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/Han jinnan on our behalf, to apply to FCC on our equipment for FCC ID:

XMR201909EC21AUX. Any and all acts carried out by TA Technology

(Shanghai) Co., Ltd. / Han jinnan on our behalf shall have the same effect as acts of our own. Sincerely, Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Company Limited

 

 

Quectel Wireless Solutions Company Limited Request for Confidentiality Date: _2021/11/20_ Subject: Confidentiality Request for: _____ FCC ID: XMR201909EC21AUX_____ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Short Term Short Term ______(Insert Explanation as Necessary)______ Permanent Permanent Exhibit Parts List & Placement operational description

*Note:

______ FCC ID: XMR201909EC21AUX has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:

(Signature/Title1) Jean Hu

(Print name)

 

 

 

 

 

 

The spot check cover sheet To demonstrate the change of deviated non-electrical characteristics components leaves no significant performance change with regards to the compliance concern Power Output Original worst dBm Power Output New worst dBm Original worst deviation New worst %

deviation

Emission designat Original worst Emission designat New worst dBm 32.24 26.99 23.46 23.38 23.05 23.91 29.89 26.05 23.75 23.00 22.94 23.79 23.55 23.65 23.22 23.1 23.9 23.84 23.02

23.74 23.68 31.86 25.51 23.41 23.1 23.0 22.69 29.48 26.04 23.43 22.97 22.69 22.63 22.39 23.33 23.08 23.07 22.73 22.48 23.01 23.51 22.72 22.34 1.675 0.500 0.222 0.218 0.202 0.246 0.975 0.403 0.237 0.200 0.197 0.239 0.226 0.232 0.210 0.204 0.245 0.242 0.200

0.237 0.233 1.535 0.356 0.219 0.302 0.295 0.275 0.887 0.410 0.220 0.280 0.262 0.259 0.245 0.215 0.244 0.244 0.225 0.213 0.264 0.257 0.247 0.226 244K GXW 244K G7W 4M13 F9W 4M49 G7D 8M91 G7D 8M91 W7D 247K GXW 248K G7W 4M13 F9W 1M12 G7D 1M11 G7D 17M81 W7D 17M81 W7D 4M14 F9W 1.M12 G7D 17M83 G7D 1M12 W7D 17M82 W7D 17M80 G7D 13M36 W7D 17M79 W7D 247KGXW 245KG7W 4M1348F9W 2M714G7D 2M714G7D 4M53W7D 2491KGXW 252KG7W 4M13F9W 4M53G7D 17M9G7D 4M51W7D 4M51W7D 4M14F9W 2M71G7D 17M98 G7D 1M10W7D 4M53W7D 8M97G7D 17M9G7D 4M52W7D 4M52W7D Mode of Selection (The item of re-test and spot check test to ensure consistency of performance GPRS850 EGPRS850 WCDMA BandV LTE Band 5 QPSK LTE Band 5 QPSK LTE Band 5 16QAM GPRS1900 EGPRS1900 WCDMA Band II LTE Band 2 QPSK LTE Band 2 QPSK LTE Band 2 16QAM LTE Band 2 16QAM WCDMA Band IV LTE Band 1.4M LTE Band 4 QPSK LTE Band 4 16QAM LTE Band 4 16QAM LTE Band 7 QPSK LTE Band 7 QPSK LTE Band 7 16QAM LTE Band 7 16QAM 4QPSK The comparison Summary:

PAPR Original worst dBm PAPR New worst dBm Frequency Frequency Stability Original worstppm Stability worstppm New Radiates Spurious Emission Original

(dBm/MHz) worst Radiates Emission New worst Spurious

(dBm/MHz) GPRS850 EGPRS850 WCDMA BandV Band 5 LTE QPSK Band 5 LTE QPSK Band 5 LTE 16QAM GPRS1900 EGPRS1900 WCDMA Band II Band 2 Band 2 LTE QPSK LTE QPSK Band 2 LTE 16QAM Band 2 LTE 16QAM WCDMA Band IV LTE 4QPSK 1.4M Band Band 4 LTE QPSK Band 4 LTE 16QAM Band 4 LTE 16QAM Band 7 LTE QPSK Band 7 LTE 16QAM Band 7 LTE 16QAM 5.69 5.69 3.18 5.35 5.35 5.38 5.88 5.88 3.2 5.41 5.41 5.43 5.43 3.14 3.14 5.95 5.95 5.33 5.34 5.34 2.8 6.12 2.96 4.82 4.82 5.7 2.8 5.69 3.12 5.27 5.27 6.17 6.17 2.89 5.19 5.19 6.07 6.07 5.17 5.79 5.79 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 46.39 44.92 46.39 44.92 44.878 44.878 46.3 46.39 37.5 37.5 38.8 36.2 36.2 36.2 36.2 39 44.28 44.28 45.47 44.92 41.54 41.54 30.92 33.967 33.967 33.967 33.967 40.15 37.95 36.54 37.95 36.54 37.95 36.54 37.95 36.54 23.59 23.252 23.59 23.252 23.59 23.252 Signature:

Print name: Jean Hu Date: 11/20/2021 Company: Quectel Wireless Solutions Co., Ltd.