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| 1 | Tune up Procedure | Parts List/Tune Up Info | November 29 2019 | confidential |
| 1 | Users Manual | Users Manual | 1.78 MiB | / February 12 2019 |
EG95 Hardware Design LTE Standard Module Series Rev. EG95_Hardware_Design_V1.5 Date: 2019-08-09 Status: Released www.quectel.com LTE Standard Module Series EG95 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:
http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. EG95_Hardware_Design 1 / 93 LTE Standard Module Series EG95 Hardware Design About the Document History Revision Date Author Description 1.0 2017-03-22 Yeoman CHEN/
Initial Jackie WANG Felix YIN/
1.1 2018-01-04 Yeoman CHEN/
Rex WANG 1.2 2018-03-14 Felix YIN/
Rex WANG 1. Added band B28A. 2. Updated the description of UMTS and GSM features in Table 2. 3. Updated the functional diagram in Figure 1. 4. Updated module operating frequencies in Table 21. 5. Updated current consumption in Table 26. 6. Updated the conducted RF receiving sensitivity in Table 28. 7. Updated the GPRS multi-slot classes in Table 33. 8. Added thermal consideration in Chapter 5.8 9. Added a GND pad in each of the four corners of the modules footprint in Chapter 6.2. 10. Added packaging information in Chapter 7.3. 1. Added the description of EG95-NA. 2. Updated the functional diagram in Figure 1. 3. Updated pin assignment in Figure 2. 4. Updated GNSS function in Table 1. 5. Updated GNSS Features in Table 2. 6. Updated reference circuit of USB interface in Figure 21. 7. Added description of GNSS receiver in Chapter 4. 8. Updated pin definition of RF antenna in Table 21. EG95_Hardware_Design 2 / 93 LTE Standard Module Series EG95 Hardware Design 9. Updated module operating frequencies in Table 22. 10. Added description of GNSS antenna interface in Chapter 5.2. 11. Updated antenna requirements in Table 25. 12. Updated RF output power in Table 32. 1. Added variant EG95-EX and related information. 2. Updated functional diagram in Figure 1. 3. Updated pin assignment (top view) in Figure 2. 4. Updated pin description in Table 4. 5. Updated star structure of power supply in Figure 8. 6. Updated the reference circuit of turning on the module using PWRKEY in Figure 10. 7. Updated the power-on scenario in Figure 12. 8. Updated reference circuit of SPI interface with peripherals in Figure 25. 9. Updated GNSS performance in Table 20. 10. Updated module operating frequencies in Table 22. 11. Updated GNSS frequency in Table 24. 12. Updated antenna requirements in Table 25. 13. Updated EG95-NA current consumption in Table 30. 14. Adeed EG95-EX current consumption in Table 31. 15. Updated EG95-E conducted RF receiving sensitivity in Table 34. 16. Updated EG95-NA conducted RF receiving sensitivity in Table 35. 17. Added EG95-EX conducted RF receiving sensitivity in Table 36.Updated GNSS current consumption of EG95 in Table 32.Updated related documents in Table 38.Updated reference circuit of PWRKEY interface in Figure 10. 18. Updated description of (U)SIM in Chapter 3.9. 19. Updated description of UART in Chapter 3.11. 20. Added description of ADC interface in 1.3 2019-05-24 Nathan LIU/
Ward WANG/
Rex WANG EG95_Hardware_Design 3 / 93 LTE Standard Module Series EG95 Hardware Design Chapter 3.16. 21. Added description of USB_BOOT interface in Chapter 3.18. 22. Updated description of manufacturing and soldering in Chapter 8.2. 1. Updated supported protocols (Table 2). 2. Updated timing of turning on module (Figure 12). 1.4 2019-07-05 Ward WANG 3. DFOTA is developed. 4. Updated description of USB_BOOT 1.5 2019-08-09 Fanny CHEN/
Rex WANG interface and timing sequence for entering emergency download mode (Chapter 3.18 and Figure 29). 1. Added ThreadX module EG95-NAX and updated related contents (Table 1 and 4, Chapter 2.2, 2.3, 3.2 and 5). 2. Updated module operating frequencies
(Table 25). 3. Updated antenna requirements (Table 28). 4. Added current consumption of EG95-NAX
(Table 35). 5. Updated RF output power (Table 37). 6. Updated EG95-NA conducted RF receiving sensitivity (Table 39). 7. Added EG95-NAX conducted RF receiving sensitivity (Table 41). EG95_Hardware_Design 4 / 93 LTE Standard Module Series EG95 Hardware Design Contents About the Document ..................................................................................................................................... 2 Contents.......................................................................................................................................................... 5 Table Index ..................................................................................................................................................... 7 Figure Index.................................................................................................................................................... 9 1 Introduction........................................................................................................................................... 11 1.1. Safety Information...................................................................................................................... 12 2 Product Concept .................................................................................................................................. 13 2.1. General Description ................................................................................................................... 13 2.2. 2.3. 2.4. Key Features.............................................................................................................................. 14 Functional Diagram ................................................................................................................... 17 Evaluation Board ....................................................................................................................... 18 3 Application Interfaces.......................................................................................................................... 19 3.1. General Description ................................................................................................................... 19 3.2. 3.3. Pin Assignment .......................................................................................................................... 20 Pin Description ........................................................................................................................... 21 3.4. Operating Modes ....................................................................................................................... 28 3.5. Power Saving ............................................................................................................................. 29 3.5.1. Sleep Mode ...................................................................................................................... 29 3.5.1.1. UART Application ................................................................................................... 29 3.5.1.2. USB Application with USB Remote Wakeup Function ......................................... 30 3.5.1.3. USB Application with USB Suspend/Resume and RI Function ........................... 30 3.5.1.4. USB Application without USB Suspend Function ................................................. 31 3.5.2. Airplane Mode .................................................................................................................. 32 3.6. Power Supply ............................................................................................................................. 32 3.6.1. Power Supply Pins ........................................................................................................... 32 3.6.2. Decrease Voltage Drop .................................................................................................... 33 3.6.3. Reference Design for Power Supply ............................................................................... 34 3.6.4. Monitor the Power Supply................................................................................................ 35 3.7. Power-on/off Scenarios ............................................................................................................. 35 3.7.1. Turn on Module Using the PWRKEY .............................................................................. 35 3.7.2. Turn off Module ................................................................................................................ 37 3.7.2.1. Turn off Module Using the PWRKEY Pin .............................................................. 37 3.7.2.2. Turn off Module Using AT Command .................................................................... 37 3.8. 3.9. Reset the Module....................................................................................................................... 38
(U)SIM Interfaces....................................................................................................................... 39 3.10. USB Interface............................................................................................................................. 42 3.11. UART Interfaces ........................................................................................................................ 43 3.12. PCM and I2C Interfaces ............................................................................................................ 46 3.13. SPI Interface .............................................................................................................................. 48 3.14. Network Status Indication.......................................................................................................... 49 EG95_Hardware_Design 5 / 93 LTE Standard Module Series EG95 Hardware Design 3.15. STATUS...................................................................................................................................... 50 3.16. ADC Interface ............................................................................................................................ 51 3.17. Behaviors of RI .......................................................................................................................... 51 3.18. USB_BOOT Interface ................................................................................................................ 52 4 GNSS Receiver ..................................................................................................................................... 54 4.1. General Description ................................................................................................................... 54 4.2. GNSS Performance ................................................................................................................... 54 4.3. Layout Guidelines ...................................................................................................................... 55 5 Antenna Interfaces ............................................................................................................................... 56 5.1. Main/Rx-diversity Antenna Interfaces ....................................................................................... 56 5.1.1. Pin Definition .................................................................................................................... 56 5.1.2. Operating Frequency ....................................................................................................... 56 5.1.3. Reference Design of RF Antenna Interface .................................................................... 57 5.1.4. Reference Design of RF Layout ...................................................................................... 58 5.2. GNSS Antenna Interface ........................................................................................................... 60 5.3. Antenna Installation ................................................................................................................... 61 5.3.1. Antenna Requirement ...................................................................................................... 61 5.3.2. Recommended RF Connector for Antenna Installation .................................................. 62 6 Electrical, Reliability and Radio Characteristics ............................................................................. 64 6.1. 6.2. Absolute Maximum Ratings....................................................................................................... 64 Power Supply Ratings ............................................................................................................... 64 6.3. Operation and Storage Temperatures....................................................................................... 65 6.4. 6.5. 6.6. 6.7. 6.8. Current Consumption ................................................................................................................ 66 RF Output Power ....................................................................................................................... 72 RF Receiving Sensitivity ............................................................................................................ 73 Electrostatic Discharge .............................................................................................................. 75 Thermal Consideration .............................................................................................................. 76 7 Mechanical Dimensions ...................................................................................................................... 78 7.1. Mechanical Dimensions of the Module ..................................................................................... 78 7.2. 7.3. Recommended Footprint ........................................................................................................... 80 Top and Bottom Views of the Module ....................................................................................... 81 8 Storage, Manufacturing and Packaging ............................................................................................ 82 8.1. Storage....................................................................................................................................... 82 8.2. Manufacturing and Soldering .................................................................................................... 83 8.3. Packaging .................................................................................................................................. 84 9 Appendix A References ....................................................................................................................... 86 10 Appendix B GPRS Coding Schemes ................................................................................................. 90 11 Appendix C GPRS Multi-slot Classes................................................................................................ 91 12 Appendix D EDGE Modulation and Coding Schemes ..................................................................... 93 EG95_Hardware_Design 6 / 93 LTE Standard Module Series EG95 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EG95 SERIES MODULE ...................................................................... 13 TABLE 2: KEY FEATURES OF EG95 MODULE ............................................................................................ 14 TABLE 3: IO PARAMETERS DEFINITION ..................................................................................................... 21 TABLE 4: PIN DESCRIPTION ........................................................................................................................ 21 TABLE 5: OVERVIEW OF OPERATING MODES........................................................................................... 28 TABLE 6: PIN DEFINITION OF VBAT AND GND ........................................................................................... 33 TABLE 7: PIN DEFINITION OF PWRKEY ...................................................................................................... 35 TABLE 8: PIN DEFINITION OF RESET_N ..................................................................................................... 38 TABLE 9: PIN DEFINITION OF (U)SIM INTERFACES ................................................................................... 40 TABLE 10: PIN DEFINITION OF USB INTERFACE ....................................................................................... 42 TABLE 11: PIN DEFINITION OF MAIN UART INTERFACES ......................................................................... 44 TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE ....................................................................... 44 TABLE 13: LOGIC LEVELS OF DIGITAL I/O .................................................................................................. 44 TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ..................................................................... 47 TABLE 15: PIN DEFINITION OF SPI INTERFACE ......................................................................................... 48 TABLE 16: PIN DEFINITION OF NETWORK STATUS INDICATOR ............................................................... 49 TABLE 17: WORKING STATE OF NETWORK STATUS INDICATOR ............................................................ 49 TABLE 18: PIN DEFINITION OF STATUS ...................................................................................................... 50 TABLE 19: PIN DEFINITION OF ADC INTERFACE ....................................................................................... 51 TABLE 20: CHARACTERISTICS OF ADC INTERFACE ................................................................................. 51 TABLE 21: DEFAULT BEHAVIORS OF RI...................................................................................................... 52 TABLE 22: PIN DEFINITION OF USB_BOOT INTERFACE ........................................................................... 52 TABLE 23: GNSS PERFORMANCE .............................................................................................................. 54 TABLE 24: PIN DEFINITION OF RF ANTENNA ............................................................................................. 56 TABLE 25: MODULE OPERATING FREQUENCIES ...................................................................................... 56 TABLE 26: PIN DEFINITION OF GNSS ANTENNA INTERFACE ................................................................... 60 TABLE 27: GNSS FREQUENCY .................................................................................................................... 60 TABLE 28: ANTENNA REQUIREMENTS ....................................................................................................... 61 TABLE 29: ABSOLUTE MAXIMUM RATINGS ................................................................................................ 64 TABLE 30: POWER SUPPLY RATINGS......................................................................................................... 64 TABLE 31: OPERATION AND STORAGE TEMPERATURES ........................................................................ 65 TABLE 32: EG95-E CURRENT CONSUMPTION ........................................................................................... 66 TABLE 33: EG95-NA CURRENT CONSUMPTION ........................................................................................ 68 TABLE 34: EG95-EX CURRENT CONSUMPTION ........................................................................................ 69 TABLE 35: EG95-NAX CURRENT CONSUMPTION ...................................................................................... 71 TABLE 36: GNSS CURRENT CONSUMPTION OF EG95 ............................................................................. 72 TABLE 37: RF OUTPUT POWER .................................................................................................................. 73 TABLE 38: EG95-E CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 73 TABLE 39: EG95-NA CONDUCTED RF RECEIVING SENSITIVITY .............................................................. 74 TABLE 40: EG95-EX CONDUCTED RF RECEIVING SENSITIVITY .............................................................. 74 TABLE 41: EG95-NAX CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 75 TABLE 42: ELECTROSTATIC DISCHARGE CHARACTERISTICS (25C, 45% RELATIVE HUMIDITY) ........ 76 EG95_Hardware_Design 7 / 93 LTE Standard Module Series EG95 Hardware Design TABLE 43: RECOMMENDED THERMAL PROFILE PARAMETERS .............................................................. 83 TABLE 44: RELATED DOCUMENTS ............................................................................................................. 86 TABLE 45: TERMS AND ABBREVIATIONS ................................................................................................... 86 TABLE 46: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................. 90 TABLE 47: GPRS MULTI-SLOT CLASSES .................................................................................................... 91 TABLE 48: EDGE MODULATION AND CODING SCHEMES ......................................................................... 93 EG95_Hardware_Design 8 / 93 LTE Standard Module Series EG95 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM............................................................................................................. 17 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................. 20 FIGURE 3: SLEEP MODE APPLICATION VIA UART ..................................................................................... 29 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP ................................................... 30 FIGURE 5: SLEEP MODE APPLICATION WITH RI ....................................................................................... 31 FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ............................................... 31 FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION..................................................... 33 FIGURE 8: STAR STRUCTURE OF POWER SUPPLY .................................................................................. 34 FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY............................................................................. 34 FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT ............................................................... 35 FIGURE 11: TURN ON THE MODULE USING BUTTON ............................................................................... 36 FIGURE 12: TIMING OF TURNING ON MODULE ......................................................................................... 36 FIGURE 13: TIMING OF TURNING OFF MODULE ....................................................................................... 37 FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 38 FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ..................................................... 39 FIGURE 16: TIMING OF RESETTING MODULE ........................................................................................... 39 FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
............................................................................................................................................................... 41 FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR . 41 FIGURE 19: REFERENCE CIRCUIT OF USB INTERFACE........................................................................... 43 FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP .................................................................. 45 FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT............................................................. 45 FIGURE 22: PRIMARY MODE TIMING .......................................................................................................... 46 FIGURE 23: AUXILIARY MODE TIMING ....................................................................................................... 47 FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ................................... 48 FIGURE 25: REFERENCE CIRCUIT OF SPI INTERFACE WITH PERIPHERALS ........................................ 49 FIGURE 26: REFERENCE CIRCUIT OF NETWORK STATUS INDICATOR .................................................. 50 FIGURE 27: REFERENCE CIRCUIT OF STATUS ......................................................................................... 50 FIGURE 28: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ............................................................... 53 FIGURE 29: TIMING SEQUENCE FOR ENTERING EMERGENCY DOWNLOAD MODE ............................. 53 FIGURE 30: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................ 58 FIGURE 31: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB .................................................................... 58 FIGURE 32: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB.......................................................... 59 FIGURE 33: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)
............................................................................................................................................................... 59 FIGURE 34: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)
............................................................................................................................................................... 59 FIGURE 35: REFERENCE CIRCUIT OF GNSS ANTENNA ........................................................................... 61 FIGURE 36: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 62 FIGURE 37: MECHANICALS OF U.FL-LP CONNECTORS ........................................................................... 63 FIGURE 38: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) .......................................................... 63 EG95_Hardware_Design 9 / 93 LTE Standard Module Series EG95 Hardware Design FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 77 FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS PCB)
............................................................................................................................................................... 77 FIGURE 41: MODULE TOP AND SIDE DIMENSIONS................................................................................... 78 FIGURE 42: MODULE BOTTOM DIMENSIONS (TOP VIEW)........................................................................ 79 FIGURE 43: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ 80 FIGURE 44: TOP VIEW OF THE MODULE ................................................................................................... 81 FIGURE 45: BOTTOM VIEW OF THE MODULE ........................................................................................... 81 FIGURE 46: REFLOW SOLDERING THERMAL PROFILE ............................................................................ 83 FIGURE 47: TAPE DIMENSIONS .................................................................................................................. 84 FIGURE 48: REEL DIMENSIONS .................................................................................................................. 85 FIGURE 49: TAPE AND REEL DIRECTIONS ................................................................................................ 85 EG95_Hardware_Design 10 / 93 LTE Standard Module Series EG95 Hardware Design 1 Introduction This document defines the EG95 module and describes its air interface and hardware interface which are connected with customers applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EG95 module. Associated with application note and user guide, customers can use EG95 module to design and set up mobile applications easily. EG95_Hardware_Design 11 / 93 LTE Standard Module Series EG95 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EG95 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. EG95_Hardware_Design 12 / 93 LTE Standard Module Series EG95 Hardware Design 2 Product Concept 2.1. General Description EG95 module is an embedded 4G wireless communication module with receive diversity. It supports LTE-FDD/WCDMA/GSM wireless communication, and provides data connectivity on LTE-FDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It can also provide voice functionality 1) to meet customers specific application demands. EG95 contains 4 variants: EG95-E, EG95-NA, EG95-EX 2) and EG95-NAX 2). The following table shows the frequency bands of EG95 series module. Table 1: Frequency Bands of EG95 Series Module LTE Bands WCDMA
(with Rx-diversity)
(with Rx-diversity) GSM GNSS 2) Module EG95-E FDD:
B1/B3/B7/B8/B20/B28A EG95-NA FDD:
B2/B4/B5/B12/B13 EG95-EX 2) FDD:
B1/B3/B7/B8/B20/B28 FDD:
B1/B8 900/1800MHz Not supported B2/B4/B5 Not supported BeiDou/Compass, GPS, GLONASS, Galileo, QZSS GPS, GLONASS, B1/B8 900/1800MHz BeiDou/Compass, Galileo, QZSS GPS, GLONASS, EG95-NAX 2) B2/B4/B5/B12/B13/B25/
B2/B4/B5 Not supported BeiDou/Compass, B26 Galileo, QZSS NOTES 1) EG95 contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. 2) EG95-EX and EG95-NAX are based on ThreadX modules. 3) GNSS function is optional. 1. 2. 3. EG95_Hardware_Design 13 / 93 LTE Standard Module Series EG95 Hardware Design With a compact profile of 29.0mm 25.0mm 2.3mm, EG95 can meet almost all requirements for M2M applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EG95 is an SMD type module which can be embedded into applications through its 106 LGA pads. EG95 is integrated with internet service protocols like TCP, UDP and PPP. Extended AT commands have been developed for customers to use these internet service protocols easily. 2.2. Key Features The following table describes the detailed features of EG95 module. Table 2: Key Features of EG95 Module Feature Details Power Supply Transmitting Power LTE Features Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V Class 4 (33dBm2dB) for EGSM900 Class 1 (30dBm2dB) for DCS1800 Class E2 (27dBm3dB) for EGSM900 8-PSK Class E2 (26dBm3dB) for DCS1800 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm2dB) for LTE-FDD bands Support up to non-CA Cat 4 FDD Support 1.4/3/5/10/15/20MHz RF bandwidth Support MIMO in DL direction FDD: Max 150Mbps (DL)/Max 50Mbps (UL) Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation UMTS Features DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL)/ Max 384Kbps (UL) R99:
CSD: 9.6kbps GPRS:
GSM Features Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL), Max 85.6Kbps (UL) EDGE:
EG95_Hardware_Design 14 / 93 LTE Standard Module Series EG95 Hardware Design Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL)/Max 236.8Kbps (UL) Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/NITZ/
MMS/SMTP/SSL/MQTT/FILE/CMUX*/SMTPS* protocols Internet Protocol Features Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for SMS PPP connections Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default
(U)SIM Interfaces Support 1.8V and 3.0V (U)SIM cards Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB Audio Features WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Used for audio function with external codec Support 16-bit linear data format PCM Interface Support long frame synchronization and short frame synchronization Support master and slave mode, but must be the master in long frame synchronization Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps USB Interface sentences output, software debugging, firmware upgrade and voice over Used for AT command communication, data transmission, GNSS NMEA USB Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6/3.x/4.1~4.15, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc. Main UART:
Used for AT command communication and data transmission Baud rates reach up to 921600bps, 115200bps by default UART Interface Support RTS and CTS hardware flow control Debug UART:
Used for Linux console and log output 115200bps baud rate Provides a duplex, synchronous and serial communication link with the SPI Interface 2) peripheral devices. Dedicated to one-to-one connection, without chip selection. EG95_Hardware_Design 15 / 93 LTE Standard Module Series EG95 Hardware Design 1.8V operation voltage with clock rates up to 50MHz. Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Gen8C Lite of Qualcomm Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Network Indication NETLIGHT pin for network activity status indication Antenna Interfaces Including main antenna interface (ANT_MAIN), Rx-diversity antenna
(ANT_DIV) interface and GNSS antenna interface (ANT_GNSS)1) Physical Characteristics Package: LGA Size: (29.00.15)mm (25.00.15)mm (2.30.2)mm Temperature Range Weight: approx. 3.8g Operation temperature range: -35C ~ +75C 3) Extended temperature range: -40C ~ +85C 4) Storage temperature range: -40C ~ +90C Firmware Upgrade USB interface or DFOTA RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. 3. 4. 1) GNSS antenna interface is only supported on EG95-NA/-EX/-NAX. 2) SPI interface is not supported on ThreadX modules. 3) Within operation temperature range, the module is 3GPP compliant. 4) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call* (emergency call is not supported on ThreadX module), etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again. 5.
* means under development. EG95_Hardware_Design 16 / 93 LTE Standard Module Series EG95 Hardware Design 2.3. Functional Diagram The following figure shows a block diagram of EG95 and illustrates the major functional parts. Power management Baseband DDR+NAND flash Radio frequency Peripheral interfaces Figure 1: Functional Diagram NOTE 1) GNSS antenna interface is only supported on EG95-NA/-EX/-NAX. EG95_Hardware_Design 17 / 93 BasebandPMICTransceiverNANDDDR2SDRAMPAPAMSwitchANT_MAINANT_DIV VBAT_BBVBAT_RFPWRKEYVDD_EXTUSBPCMUARTI2CRESET_N19.2MXOSTATUSGPIOsControlIQControlDuplexerSAWTxPRxDRx(U)SIM2SPI(U)SIM1SAWLNAANT_GNSS 1) SAWGPS LTE Standard Module Series EG95 Hardware Design 2.4. Evaluation Board Quectel provides a complete set of evaluation tools to facilitate the use and testing of EG95 module. The evaluation tool kit includes the evaluation board (UMTS<E EVB), USB data cable, earphone, antenna and other peripherals. For more details, please refer to document [7]. EG95_Hardware_Design 18 / 93 LTE Standard Module Series EG95 Hardware Design 3 Application Interfaces 3.1. General Description EG95 is equipped with 62-pin 1.1mm pitch SMT pads and 44-pin ground/reserved pads that can be connected to customers cellular application platforms. Sub-interfaces included in these pads are described in detail in the following chapters:
(U)SIM interfaces Power supply USB interface UART interfaces PCM and I2C interfaces SPI interface 1) Status indication USB_BOOT interface NOTE 1) SPI interface is not supported on ThreadX modules. EG95_Hardware_Design 19 / 93 LTE Standard Module Series EG95 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EG95 module. Figure 2: Pin Assignment (Top View) EG95_Hardware_Design 20 / 93 NCPCM_SYNCPCM_CLKPCM_DINPCM_DOUTNCNCPWRKEY 1)NCRESET_NRESERVED123456711121314151617185051525354555859606162USB_DMAP_READYSTATUSNETLIGHTDBG_RXDDBG_TXDADC0RESERVEDSPI_CLKSPI_MOSISPI_MISOVDD_EXTDTRGNDUSIM1_CLKUSIM1_DATAUSIM1_RSTUSIM1_VDDRIDCDCTSTXDRXDVBAT_BBVBAT_BBUSIM_GNDGND3130292827262322212019109USB_DPUSB_VBUSNCGNDNCNCRTSI2C_SCLI2C_SDA8494847464544434041423938373635343332245756GNDGNDANT_MAINGNDGNDNCVBAT_RFVBAT_RFGNDGNDNCGNDUSIM1_PRESENCE63646566676883848586878898979695949378777675747391928990717269708079828110099102101POWERUSBUART(U)SIMOTHERSGNDNCPCMANT25USIM2_PRESENCEUSIM2_CLKUSIM2_RSTUSIM2_DATAUSIM2_VDDSPIUSB_BOOT103104105106ANT_DIV (EG95-NA/-EX/-NAX)ANT_GNSS (EG95-NA/-EX/-NAX)RESERVEDRESERVED (Pin 56 on EG95-E)ANT_DIV (EG95-E) LTE Standard Module Series EG95 Hardware Design NOTES 1. 1) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. 2. Keep all RESERVED pins and unused pins unconnected. 3. GND pads should be connected to ground in the design. 4. Please note that the definition of pin 49 and 56 are different among EG95-E and EG95-NA/-EX/-NAX. For more details, please refer to Table 4. 3.3. Pin Description The following tables show the pin definition and description of EG95. Table 3: IO Parameters Definition Type AI AO DI DO IO OD PI PO Description Analog Input Analog Output Digital Input Digital Output Bidirectional Open Drain Power Input Power Output Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 32, 33 PI modules Vmin=3.3V sufficient current up to Power supply for Vmax=4.3V It must be provided with baseband part Vnorm=3.8V 0.8A. VBAT_RF 52, 53 PI Power supply for Vmax=4.3V It must be provided with EG95_Hardware_Design 21 / 93 LTE Standard Module Series EG95 Hardware Design modules RF part Vmin=3.3V sufficient current up to Vnorm=3.8V 1.8A in a burst transmission. Power supply for VDD_EXT 29 PO Provide 1.8V for Vnorm=1.8V external GPIOs pull up external circuit IOmax=50mA circuits. If unused, keep it open. 3, 31, 48, 50, 54, 55, 58, 59, 61, GND 62, 67~74, Ground 79~82, 89~91, 100~106 Power-on/off Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 15 DI Turn on/off the module VH=0.8V RESET_N 17 DI Reset signal of the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V Status Indication The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. Pull-up to 1.8V internally. Active low. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 20 DO modules operation Indicate the status Indicate the NETLIGHT 21 DO modules network activity status USB Interface VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 8 PI USB connection detection Vmax=5.25V Vmin=3.0V Vnorm=5.0V Typical: 5.0V If unused, keep it open. EG95_Hardware_Design 22 / 93 LTE Standard Module Series EG95 Hardware Design USB differential data bus (+) USB differential data bus (-) Compliant with USB 2.0 standard specification. Compliant with USB 2.0 standard specification. Require differential impedance of 90. Require differential impedance of 90. USB_DP 9 IO USB_DM 10 IO
(U)SIM Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment USIM_GND 47 Specified ground for (U)SIM card USIM1_VDD 43 PO Power supply for
(U)SIM card For 3.0V (U)SIM:
For 1.8V (U)SIM:
Vmax=1.9V Vmin=1.7V USIM1_DATA 45 IO Data signal of
(U)SIM card USIM1_CLK 46 DO Clock signal of
(U)SIM card Vmax=3.05V Vmin=2.7V IOmax=50mA For 1.8V (U)SIM:
VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:
VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
VOLmax=0.45V VOHmin=2.55V Connect to ground of
(U)SIM card connector. Either 1.8V or 3.0V is supported by the module automatically. EG95_Hardware_Design 23 / 93 LTE Standard Module Series EG95 Hardware Design USIM1_RST 44 DO Reset signal of
(U)SIM card For 1.8V (U)SIM:
VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
USIM1_ PRESENCE 42 DI VOLmax=0.45V VOHmin=2.55V VILmin=-0.3V VILmax=0.6V
(U)SIM card insertion detection VIHmin=1.2V VIHmax=2.0V For 1.8V (U)SIM:
Vmax=1.9V Vmin=1.7V USIM2_VDD 87 PO Power supply for
(U)SIM card For 3.0V (U)SIM:
USIM2_DATA 86 IO Data signal of
(U)SIM card USIM2_CLK 84 DO Clock signal of
(U)SIM card USIM2_RST 85 DO Reset signal of
(U)SIM card Vmax=3.05V Vmin=2.7V IOmax=50mA For 1.8V (U)SIM:
VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:
VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:
VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:
VOLmax=0.45V VOHmin=2.55V 1.8V power domain. If unused, keep it open. Either 1.8V or 3.0V is supported by the module automatically. EG95_Hardware_Design 24 / 93 LTE Standard Module Series EG95 Hardware Design USIM2_ PRESENCE 83 DI Main UART Interface
(U)SIM card VILmin=-0.3V VILmax=0.6V insertion detection VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment RI 39 DO Ring indicator VOLmax=0.45V VOHmin=1.35V DCD 38 DO Data carrier detection VOLmax=0.45V VOHmin=1.35V CTS 36 DO Clear to send RTS 37 DI Request to send DTR 30 DI ready. Sleep mode Data terminal control. TXD 35 DO Transmit data RXD 34 DI Receive data Debug UART Interface VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Pull-up by default. Low level wakes up the module. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD 23 DO Transmit data DBG_RXD 22 DI Receive data VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. EG95_Hardware_Design 25 / 93 LTE Standard Module Series EG95 Hardware Design VIHmax=2.0V PCM Interface Pin Name Pin No. I/O Description DC Characteristics Comment PCM_DIN 6 DI PCM data input PCM_DOUT 7 DO PCM data output PCM_SYNC 5 IO synchronization PCM data frame signal PCM_CLK 4 IO PCM clock VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SCL 40 OD Used for external I2C serial clock. codec I2C_SDA 41 OD Used for external I2C serial data. codec ADC Interface An external pull-up resistor is required. 1.8V only. If unused, keep it open. An external pull-up resistor is required. 1.8V only. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment EG95_Hardware_Design 26 / 93 LTE Standard Module Series EG95 Hardware Design General purpose ADC0 24 AI analog to digital converter SPI Interface 1) Voltage range:
If unused, keep it 0.3V to VBAT_BB open. Pin Name Pin No. I/O Description DC Characteristics Comment SPI_CLK 26 DO Clock signal of SPI VOLmax=0.45V interface VOHmin=1.35V SPI_MOSI 27 DO input of SPI Master output slave interface Master input slave SPI_MISO 28 DI output of SPI interface RF Interfaces VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment ANT_GNSS ANT_DIV 49
(EG95-
NA/-EX/
-NAX) 49
(EG95-E) 56
(EG95-
NA/-EX/
-NAX) AI GNSS antenna pad AI Receive diversity antenna pad 50 impedance. If unused, keep it open. The pin is defined as ANT_DIV on EG95-E. 50 impedance. If unused, keep it open. Pin 56 is reserved on EG95-E. ANT_MAIN 60 IO Main antenna pad 50 impedance. Other Pins Pin Name Pin No. I/O Description DC Characteristics Comment AP_READY 19 DI processor sleep state detection Application VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. EG95_Hardware_Design 27 / 93 LTE Standard Module Series EG95 Hardware Design Force the module USB_BOOT 75 DI to enter emergency download mode RESERVED Pins VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. It is recommended to reserve the test points. Pin Name Pin No. I/O Description DC Characteristics Comment 1,2, 11~14, 16, 51, NC 57, 63~66, NC 76~78, 88, 92~99 RESERVED 18, 25, 56 Reserved NOTES 1. 1) SPI interface is not supported on ThreadX modules. 2. Keep all RESERVED pins and unused pins unconnected. Keep these pins unconnected. Keep these pins unconnected. Pin 56 is only reserved on EG95-E. 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Details Normal Operation Minimum Functionality Mode Idle Talk/Data Software is active. The module has registered on network, and it is ready to send and receive data. Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. Airplane AT+CFUN command or W_DISABLE# pin can set the module to enter airplane mode. In Mode this case, RF function will be invalid. EG95_Hardware_Design 28 / 93 LTE Standard Module Series EG95 Hardware Design In this mode, the current consumption of the module will be reduced to the minimal level. Sleep Mode During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. In this mode, the power management unit shuts down the power supply. Software is not active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. Power Down Mode 3.5. Power Saving 3.5.1. Sleep Mode EG95 is able to reduce its current consumption to a minimum value during the sleep mode. The following sub-chapters describe the power saving procedures of EG95 module. 3.5.1.1. UART Application If the host communicates with the module via UART interface, the following preconditions can let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Drive DTR to high level. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module. When EG95 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.17 for details about RI behavior. AP_READY will detect the sleep state of host (can be configured to high level or low level detection). Please refer to AT+QCFG="apready" for details. EG95_Hardware_Design 29 / 93 RXDTXDRIDTRAP_READYTXDRXDEINTGPIOGPIOModuleHostGNDGND LTE Standard Module Series EG95 Hardware Design 3.5.1.2. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application with USB Remote Wakeup Sending data to EG95 through USB will wake up the module. When EG95 has a URC to report, the module will send remote wakeup signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters suspended state. The following figure shows the connection between the module and the host. EG95_Hardware_Design 30 / 93 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostGNDGND LTE Standard Module Series EG95 Hardware Design Figure 5: Sleep Mode Application with RI Sending data to EG95 through USB will wake up the module. When module has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected with an external control circuit to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable the sleep mode. Ensure the DTR is held at high level or keep it open. Disconnect USB_VBUS. The following figure shows the connection between the module and the host. Figure 6: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. EG95_Hardware_Design 31 / 93 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostGNDGNDRIEINTUSB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostRIEINTPower SwitchGPIOGNDGND LTE Standard Module Series EG95 Hardware Design NOTE Please pay attention to the level match shown in dotted line between the module and the host. Please refer to document [1] for more details about EG95 power management application. 3.5.2. Airplane Mode When the module enters airplane mode, the RF function does not work, and all AT commands correlative with RF function will be inaccessible. This mode can be set via the following ways. Hardware:
The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. Software:
AT+CFUN command provides the choice of the functionality level through setting <fun> as 0, 1 or 4. AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled. AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode. RF function is disabled. NOTES 1. Airplane mode control via W_DISABLE# is disabled in firmware by default. It can be enabled by AT+QCFG="airplanecontrol" command and this command is under development. 2. The execution of AT+CFUN command will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EG95 provides four VBAT pins for connection with an external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for modules RF part. Two VBAT_BB pins for modules baseband part. The following table shows the details of VBAT pins and ground pins. EG95_Hardware_Design 32 / 93 LTE Standard Module Series EG95 Hardware Design Table 6: Pin Definition of VBAT and GND Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 52, 53 VBAT_BB 32, 33 Power supply for modules RF part. Power supply for modules baseband part. 3.3 3.8 4.3 3.3 3.8 4.3 V V 3, 31, 48, 50, 54, 55, 58, 59, GND 61, 62, 67~74, Ground
-
0
-
V 79~82, 89~91, 100~106 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100F with low ESR (ESR=0.7) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm, and the width of VBAT_RF trace should be no less than 2mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to avoid the damage caused by electric surge and ESD, it is suggested that a TVS diode with low reverse stand-off voltage VRWM, low clamping voltage VC and high reverse peak pulse current IPP should be used. The following figure shows the star structure of the power supply. EG95_Hardware_Design 33 / 93 VBATMin.3.3VRippleDropBurst TransmissionBurst Transmission LTE Standard Module Series EG95 Hardware Design Figure 8: Star Structure of Power Supply 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5V input power source. The typical output of the power supply is about 3.8V and the maximum load current is 3.0A. Figure 9: Reference Circuit of Power Supply EG95_Hardware_Design 34 / 93 ModuleVBAT_RFVBAT_BBVBATC1100uFC6100nFC733pFC810pF++C2100nFC5100uFC333pFC410pFD1WS4.5D3HVDC_INMIC29302WUINOUTENGNDADJ24135VBAT 100nF470uF100nF100K47K470uF470R51K1%1%4.7K47KVBAT_EN LTE Standard Module Series EG95 Hardware Design 3.6.4. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. 3.7. Power-on/off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name Pin No. Description DC Characteristics Comment PWRKEY 15 Turn on/off the module VH=0.8V because of the diode drop in The output voltage is 0.8V the Qualcomm chipset. When EG95 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms. It is recommended to use an open drain/collector driver to control the PWRKEY. After STATUS pin outputting a high level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. Figure 10: Turn on the Module Using Driving Circuit Another way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from the finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. EG95_Hardware_Design 35 / 93 Turn on pulsePWRKEY4.7K47K 500ms10nF LTE Standard Module Series EG95 Hardware Design Figure 11: Turn on the Module Using Button The power-on scenario is illustrated in the following figure. Figure 12: Timing of Turning on Module EG95_Hardware_Design 36 / 93 PWRKEYS1Close to S1TVSVIL0.5VVH=0.8VVBATPWRKEY500msRESET_NSTATUS(DO)InactiveActiveUARTInactiveActiveUSB12s13sVDD_EXTBOOT_CONFIG &USB_BOOT Pins About 100ms10s 100ms. After this time, the BOOT_CONFIG pins can be set to high level by external circuit.NOTE 1 LTE Standard Module Series EG95 Hardware Design NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. 2. PWRKEY can be pulled down directly to GND with a recommended 10K resistor if module needs to be powered on automatically and shutdown is not needed. 3.7.2. Turn off Module Either of the following methods can be used to turn off the module:
Normal power-off procedure: Turn off the module using the PWRKEY pin. Normal power-off procedure: Turn off the module using AT+QPOWD command. 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-off procedure after the PWRKEY is released. The power-off scenario is illustrated in the following figure. Figure 13: Timing of Turning off Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer to document [2] for details about the AT+QPOWD command. EG95_Hardware_Design 37 / 93 VBATPWRKEY 30s 650msRUNNINGPower-down procedureOFFModuleStatusSTATUS LTE Standard Module Series EG95 Hardware Design NOTES 1. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off. 2. When turning off module with AT command, please keep PWRKEY at high level after the execution of power-off command. Otherwise the module will be turned on again after successful turn-off. 3.8. Reset the Module The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N to a low level voltage for 150ms ~ 460ms. Table 8: Pin Definition of RESET_N Pin Name Pin No. Description DC Characteristics Comment RESET_N 17 Reset the module VIHmin=1.3V VIHmax=2.1V VILmax=0.5V The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 14: Reference Circuit of RESET_N by Using Driving Circuit EG95_Hardware_Design 38 / 93 Reset pulseRESET_N4.7K47K150ms~460ms LTE Standard Module Series EG95 Hardware Design Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure. Figure 16: Timing of Resetting Module NOTES 1. Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin failed. 2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interfaces EG95 provides two (U)SIM interfaces, and only one (U)SIM card can work at a time. The (U)SIM 1 and
(U)SIM 2 cards can be switched by AT+QDSIM command. For more details, please refer to document
[2]. The (U)SIM interfaces circuitry meet ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. EG95_Hardware_Design 39 / 93 RESET_NS2Close to S2TVSVIL 0.5VVIH 1.3VVBAT 150msResettingModule StatusRunningRESET_NRestart 460ms LTE Standard Module Series EG95 Hardware Design Table 9: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM1_VDD 43 PO Power supply for (U)SIM1 card supported by the module Either 1.8V or 3.0V is automatically. USIM1_DATA 45 IO Data signal of (U)SIM1 card USIM1_CLK 46 DO Clock signal of (U)SIM1 card USIM1_RST 44 DO Reset signal of (U)SIM1 card USIM1_ PRESENCE 42 DI
(U)SIM1 card insertion detection USIM_GND 47 Specified ground for (U)SIM card USIM2_VDD 87 PO Power supply for (U)SIM2 card supported by the module Either 1.8V or 3.0V is automatically. USIM2_DATA 86 IO Data signal of (U)SIM2 card USIM2_CLK 84 DO Clock signal of (U)SIM2 card USIM2_RST 85 DO Reset signal of (U)SIM2 card USIM2_ PRESENCE 83 DI
(U)SIM2 card insertion detection EG95 supports (U)SIM card hot-plug via USIM_PRESENCE (USIM1_PRESENCE/USIM2_PRESENCE) pin. The function supports low level and high level detection, and is disabled by default. Please refer to document [2] about AT+QSIMDET command for details. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. EG95_Hardware_Design 40 / 93 LTE Standard Module Series EG95 Hardware Design Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit of (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM cards in customers applications, please follow the criteria below in the (U)SIM circuit design:
Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. EG95_Hardware_Design 41 / 93 ModuleUSIM_VDD USIM_GNDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_PRESENCE0R0R0RVDD_EXT51K100nF(U)SIM Card ConnectorGNDGND33pF33pF33pFVCCRSTCLKIOVPPGNDGNDUSIM_VDD15KModuleUSIM_VDDUSIM_GNDUSIM_RSTUSIM_CLKUSIM_DATA0R0R0R100nF(U)SIM Card ConnectorGND33pF33pF33pFVCCRSTCLKIOVPPGNDGND15KUSIM_VDD LTE Standard Module Series EG95 Hardware Design Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as close to (U)SIM card connector as possible. If the ground is complete on customers PCB, USIM_GND can be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should not be more than 15pF. The 0 resistors should be added in series between the module and the (U)SIM card to facilitate debugging. The 33pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the
(U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 3.10. USB Interface EG95 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface acts as slave only, and is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface. Table 10: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_DP 9 USB_DM 10 USB_VBUS GND 8 3 IO IO PI USB differential data bus (+) USB differential data bus (-) Require differential impedance of 90. Require differential impedance of 90. USB connection detection Typical: 5.0V Ground For more details about USB 2.0 specifications, please visit http://www.usb.org/home. The USB interface is recommended to be reserved for firmware upgrade in customers design. The following figure shows a reference circuit of USB interface. EG95_Hardware_Design 42 / 93 LTE Standard Module Series EG95 Hardware Design Figure 19: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2pF. Keep the ESD protection components to the USB connector as close as possible. 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps, 921600bps and 3000000bps baud rates, and the default is 115200bps. It supports RTS and CTS hardware flow control, and is used for AT command communication only. EG95_Hardware_Design 43 / 93 USB_DPUSB_DMGNDUSB_DPUSB_DMGNDL1Close to ModuleR3R4Test PointsESD ArrayNM_0RNM_0RMinimize these stubsModuleMCUUSB_VBUSVDD LTE Standard Module Series EG95 Hardware Design The debug UART interface supports 115200bps baud rate. It is used for Linux console and log output. The following tables show the pin definition of the two UART interfaces. Table 11: Pin Definition of Main UART Interfaces Pin Name Pin No. I/O Description Comment RI DCD CTS RTS DTR TXD RXD 39 38 36 37 30 35 34 DO DO DO DI DI DO DI Ring indicator Data carrier detection Clear to send Request to send 1.8V power domain Sleep mode control Transmit data Receive data Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_TXD 23 DBG_RXD 22 DO DI Transmit data 1.8V power domain Receive data 1.8V power domain The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O Parameter VIL VIH VOL VOH Min.
-0.3 1.2 0 1.35 Max. 0.6 2.0 0.45 1.8 Unit V V V V EG95_Hardware_Design 44 / 93 LTE Standard Module Series EG95 Hardware Design The module provides 1.8V UART interfaces. A level translator should be used if customers application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. Figure 20: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. The circuit design of dotted line section can refer to the circuit design of solid line section, in terms of both module input and output circuit design. Please pay attention to the direction of connection. Figure 21: Reference Circuit with Transistor Circuit EG95_Hardware_Design 45 / 93 VCCAVCCBOEA1A2A3A4A5A6A7A8GNDB1B2B3B4B5B6B7B8VDD_EXTRIDCDRTSRXDDTRCTSTXD51K51K0.1uF0.1uFRI_MCUDCD_MCURTS_MCURXD_MCUDTR_MCUCTS_MCUTXD_MCUVDD_MCUTranslator120K10KMCU/ARMTXDRXDVDD_EXT10KVCC_MCU4.7K10KVDD_EXTTXDRXDRTSCTSDTRRIRTSCTSGNDGPIODCDModuleGPIOEINTVDD_EXT4.7KGND1nF1nF LTE Standard Module Series EG95 Hardware Design NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12. PCM and I2C Interfaces EG95 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface:
Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK at 8KHz PCM_SYNC, and also supports 4096KHz PCM_CLK at 16KHz PCM_SYNC. In auxiliary mode, the data is also sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK and an 8KHz, 50% duty cycle PCM_SYNC. EG95 supports 16-bit linear data format. The following figures show the primary modes timing relationship with 8KHz PCM_SYNC and 2048KHz PCM_CLK, as well as the auxiliary modes timing relationship with 8KHz PCM_SYNC and 256KHz PCM_CLK. Figure 22: Primary Mode Timing EG95_Hardware_Design 46 / 93 PCM_CLKPCM_SYNCPCM_DOUTMSBLSBMSB125us12256255PCM_DINMSBLSBMSB LTE Standard Module Series EG95 Hardware Design Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_DIN PCM_DOUT 6 7 PCM_SYNC 5 PCM_CLK 4 DI PCM data input 1.8V power domain DO PCM data output 1.8V power domain IO IO PCM data frame synchronization signal 1.8V power domain PCM data bit clock 1.8V power domain I2C_SCL 40 OD I2C serial clock I2C_SDA 41 OD I2C serial data Require an external pull-up to 1.8V Require an external pull-up to 1.8V Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC. Please refer to document [2] about AT+QDAI command for details. The following figure shows a reference design of PCM interface with external codec IC. EG95_Hardware_Design 47 / 93 PCM_CLKPCM_SYNCPCM_DOUTMSBLSBPCM_DIN125usMSB123231LSB LTE Standard Module Series EG95 Hardware Design Figure 24: Reference Circuit of PCM Application with Audio Codec NOTES 1. It is recommended to reserve an RC (R=22, C=22pF) circuit on the PCM lines, especially for PCM_CLK. 2. EG95 works as a master device pertaining to I2C interface. 3.13. SPI Interface SPI interface of EG95 acts as the master only. It provides a duplex, synchronous and serial communication link with the peripheral devices. It is dedicated to one-to-one connection, without chip select. Its operation voltage is 1.8V with clock rates up to 50MHz. The following table shows the pin definition of SPI interface. Table 15: Pin Definition of SPI Interface Pin Name Pin No. I/O Description Comment SPI_CLK 26 DO Clock signal of SPI interface 1.8V power domain SPI_MOSI 27 DO SPI_MISO 28 DI Master output slave input of SPI interface Master input slave output of SPI interface 1.8V power domain 1.8V power domain The following figure shows a reference design of SPI interface with peripherals. EG95_Hardware_Design 48 / 93 PCM_DINPCM_DOUTPCM_SYNCPCM_CLKI2C_SCLI2C_SDAModule1.8V4.7K4.7KBCLKLRCKDACADCSCLSDABIASMICBIASINPINNLOUTPLOUTNCodec LTE Standard Module Series EG95 Hardware Design Figure 25: Reference Circuit of SPI Interface with Peripherals NOTES 1. SPI interface is not supported on ThreadX modules. 2. The module provides 1.8V SPI interface. A level translator should be used between the module and the host if customers application is equipped with a 3.3V processor or device interface. 3.14. Network Status Indication The module provides one network indication pin: NETLIGHT. The pin is used to drive a network status indication LED. The following tables describe the pin definition and logic level changes of NETLIGHT in different network status. Table 16: Pin Definition of Network Status Indicator Pin Name Pin No. I/O Description Comment NETLIGHT 21 DO Indicate the modules network activity status 1.8V power domain Table 17: Working State of Network Status Indicator Pin Name Logic Level Changes Network Status Flicker slowly (200ms High/1800ms Low) Network searching NETLIGHT Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always High Voice calling EG95_Hardware_Design 49 / 93 SPI_MISOSPI_MOSISPI_CLKModuleSPI_CLKSPI_MOSISPI_MISO Peripherals LTE Standard Module Series EG95 Hardware Design A reference circuit is shown in the following figure. Figure 26: Reference Circuit of Network Status Indicator 3.15. STATUS The STATUS pin is set as the modules operation status indicator. It will output high level when the module is powered on. The following table describes the pin definition of STATUS. Table 18: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 20 DO Indicate the modules operation status 1.8V power domain. If unused, keep it open. The following figure shows the reference circuit of STATUS. Figure 27: Reference Circuit of STATUS EG95_Hardware_Design 50 / 93 4.7K47KVBAT2.2KModuleNETLIGHT4.7K47KVBAT2.2KModule STATUS LTE Standard Module Series EG95 Hardware Design 3.16. ADC Interface The module provides one analog-to-digital converter (ADC) interface. AT+QADC=0 command can be used to read the voltage value on ADC0 pin. For more details about the command, please refer to document [2]. In order to improve the accuracy of ADC voltage values, the traces of ADC should be surrounded by ground. Table 19: Pin Definition of ADC Interface Pin Name Pin No. I/O Description Comment ADC0 24 AI Force the module to enter If unused, keep this pin emergency download mode open. The following table describes the characteristics of ADC interface. Table 20: Characteristics of ADC Interface Parameter Min. Typ. Max. ADC0 Voltage Range 0.3 ADC Resolution VBAT_BB 15 Unit V bits NOTES It is prohibited to supply any voltage to ADC pins when ADC pins are not powered by VBAT. It is recommended to use resistor divider circuit for ADC application. 1. 2. 3.17. Behaviors of RI AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. The default RI behaviors can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2] for details. No matter on which port URC is presented, URC will trigger the behavior of RI pin. EG95_Hardware_Design 51 / 93 LTE Standard Module Series EG95 Hardware Design NOTE URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. The default behaviors of the RI are shown as below. Table 21: Default Behaviors of RI State Idle URC Response RI keeps at high level RI outputs 120ms low pulse when a new URC returns 3.18. USB_BOOT Interface EG95 provides a USB_BOOT pin. Customers can pull up USB_BOOT to 1.8V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface. Table 22: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 75 DI Force the module to enter Active high. emergency download mode It is recommended to 1.8V power domain. reserve test point. The following figures show the reference circuit of USB_BOOT interface and timing sequence of entering emergency download mode. EG95_Hardware_Design 52 / 93 LTE Standard Module Series EG95 Hardware Design Figure 28: Reference Circuit of USB_BOOT Interface NOTES Figure 29: Timing Sequence for Entering Emergency Download Mode 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30ms. 2. When using MCU to control module to enter the emergency download mode, please follow the above timing sequence. It is not recommended to pull up USB_BOOT to 1.8V before powering up VBAT. Short the test points as shown in Figure 28 can manually force the module to enter download mode. EG95_Hardware_Design 53 / 93 ModuleUSB_BOOTVDD_EXT4.7KTest pointTVSClose to test pointVIL0.5VVH=0.8VVBATPWRKEY500msRESET_NVDD_EXTAbout 100msUSB_BOOTUSB_BOOT can be pulled up to 1.8V before VDD_EXT Is powered up, and the module will enter emergency download mode when it is powered on.NOTE 1 LTE Standard Module Series EG95 Hardware Design 4 GNSS Receiver 4.1. General Description EG95 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EG95 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EG95 GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows GNSS performance of EG95. Table 23: GNSS Performance Parameter Description Conditions Sensitivity
(GNSS) TTFF
(GNSS) Cold start Autonomous Reacquisition Autonomous Tracking Autonomous Cold start
@open sky Warm start
@open sky Autonomous XTRA enabled Autonomous XTRA enabled Hot start Autonomous Typ.
-146
-157
-157 34.6 11.57 26.09 3.7 1.8 Unit dBm dBm dBm s s s s s EG95_Hardware_Design 54 / 93 LTE Standard Module Series EG95 Hardware Design
@open sky CEP-50 XTRA enabled Autonomous
@open sky 3.4
<2.5 s m Accuracy
(GNSS) NOTES 1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes position within 3 minutes after executing cold start command. 4.3. Layout Guidelines The following layout guidelines should be taken into account in customers design. Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna. Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be kept away from the antennas. Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar isolation and protection. Keep the characteristic impedance for ANT_GNSS trace as 50. Please refer to Chapter 5 for GNSS antenna reference design and antenna installation information. EG95_Hardware_Design 55 / 93 LTE Standard Module Series EG95 Hardware Design 5 Antenna Interfaces EG95 antenna interfaces include a main antenna interface and an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface which is only supported on EG95-NA/-EX/-NAX. The impedance of the antenna port is 50. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 24: Pin Definition of RF Antenna Pin Name Pin No. I/O Description Comment Main antenna pad 50 impedance Receive diversity antenna pad 50 impedance Receive diversity antenna pad 50 impedance ANT_MAIN 60 ANT_DIV (EG95-E) 49 ANT_DIV
(EG95-NA/-EX/-NAX) 56 IO AI AI 5.1.2. Operating Frequency Table 25: Module Operating Frequencies 3GPP Band EGSM900 DCS1800 Transmit 880~915 Receive 925~960 1710~1785 1805~1880 WCDMA B1 1920~1980 2110~2170 WCDMA B2 1850~1910 1930~1990 Unit MHz MHz MHz MHz EG95_Hardware_Design 56 / 93 LTE Standard Module Series EG95 Hardware Design WCDMA B4 1710~1755 2110~2155 WCDMA B5 WCDMA B8 824~849 880~915 869~894 925~960 LTE-FDD B1 1920~1980 2110~2170 LTE-FDD B2 1850~1910 1930~1990 LTE-FDD B3 1710~1785 1805~1880 LTE-FDD B4 1710~1755 2110~2155 LTE-FDD B5 824~849 869~894 LTE-FDD B7 2500~2570 2620~2690 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B20 880~915 699~716 777~787 832~862 925~960 729~746 746~756 791~821 LTE-FDD B25 1850~1915 1930~1995 LTE-FDD B26 LTE-FDD B28 814~849 703~748 859~894 758~803 5.1.3. Reference Design of RF Antenna Interface MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A -type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. EG95_Hardware_Design 57 / 93 LTE Standard Module Series EG95 Hardware Design Figure 30: Reference Circuit of RF Antenna Interface NOTES 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. 2. ANT_DIV function is enabled by default. AT+QCFG="diversity",0 command can be used to disable receive diversity. 3. Place the -type matching components (R1/C1/C2, R2/C3/C4) as close to the antenna as possible. 5.1.4. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled as 50. The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, height from the reference ground to the signal layer (H), and the space between the RF trace and the ground (S). Microstrip and coplanar waveguide are typically used in RF layout to control characteristic impedance. The following figures are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 31: Microstrip Line Design on a 2-layer PCB EG95_Hardware_Design 58 / 93 ANT_MAINR1 0RC1ModuleMainantennaNMC2NMR2 0RC3Diversity antennaNMC4NMANT_DIV LTE Standard Module Series EG95 Hardware Design Figure 32: Coplanar Waveguide Design on a 2-layer PCB Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) EG95_Hardware_Design 59 / 93 LTE Standard Module Series EG95 Hardware Design In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:
Use impedance simulation tool to control the characteristic impedance of RF traces as 50. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right angle traces should be changed to curved ones. There should be clearance area under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W). For more details about RF layout, please refer to document [5]. 5.2. GNSS Antenna Interface The GNSS antenna interface is only supported on EG95-NA/-EX/-NAX.The following tables show pin definition and frequency specification of GNSS antenna interface. Table 26: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS
(EG95-NA/-EX/-NAX) 49 AI GNSS antenna 50 impedance Table 27: GNSS Frequency Type GPS Frequency 1575.421.023 GLONASS 1597.5~1605.8 Galileo BeiDou QZSS 1575.422.046 1561.0982.046 1575.42 Unit MHz MHz MHz MHz MHz EG95_Hardware_Design 60 / 93 LTE Standard Module Series EG95 Hardware Design A reference design of GNSS antenna is shown as below. Figure 35: Reference Circuit of GNSS Antenna NOTES 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. If the module is designed with a passive antenna, then the VDD circuit is not needed. 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 28: Antenna Requirements Type Requirements GNSS1) Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain: < 17dB GSM/WCDMA/LTE VSWR: 2 Efficiency: > 30%
EG95_Hardware_Design 61 / 93 GNSS AntennaVDDModuleANT_GNSS47nH10R0.1uF0RNMNM100pF LTE Standard Module Series EG95 Hardware Design Max input power: 50W Input impedance: 50 Cable insertion loss: < 1dB
(EGSM900, WCDMA B5/B8, LTE-FDD B5/B8/B12/B13/B20/B26/B28) Cable insertion loss: < 1.5dB
(DCS1800, WCDMA B1/B2/B4, LTE-FDD B1/B2/B3/B4/B25) Cable insertion loss: < 2dB
(LTE-FDD B7) NOTE 1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm) EG95_Hardware_Design 62 / 93 LTE Standard Module Series EG95 Hardware Design U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 37: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. Figure 38: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. EG95_Hardware_Design 63 / 93 LTE Standard Module Series EG95 Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 29: Absolute Maximum Ratings Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage at Digital Pins Min.
-0.3
-0.3 0 0
-0.3 6.2. Power Supply Ratings Table 30: Power Supply Ratings Max. Unit 4.7 5.5 0.8 1.8 2.3 V V A A V Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT_BB and must be kept between the VBAT_RF minimum and maximum 3.3 3.8 4.3 V The actual input voltages values. EG95_Hardware_Design 64 / 93 LTE Standard Module Series EG95 Hardware Design Voltage drop during Maximum power control burst transmission level on EGSM900 Peak supply current IVBAT
(during transmission slot) Maximum power control level on EGSM900 USB_VBUS USB connection detection 400 mV 1.8 2.0 A 3.0 5.0 5.25 V 6.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table. Table 31: Operation and Storage Temperatures Parameter Min. Typ. Max. Unit Operation Temperature Range 1) Extended Temperature Range 2) Storage Temperature Range
-35
-40
-40
+25
+75
+85
+90 C C C NOTES 1. 2. 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call* (emergency call is not supported on ThreadX module), etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. 3.
* means under development. EG95_Hardware_Design 65 / 93 LTE Standard Module Series EG95 Hardware Design 6.4. Current Consumption The values of current consumption are shown below. Table 32: EG95-E Current Consumption Parameter Description Conditions Typ. Unit IVBAT OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=5 (USB suspended) GSM DRX=9 (USB disconnected) Sleep state WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspended) WCDMA PF=512 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspended) LTE-FDD PF=256 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) Idle state WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) GPRS data transfer EGSM900 4DL/1UL @32.35dBm EGSM900 3DL/2UL @32.16dBm EGSM900 2DL/3UL @30.57dBm 15 1.3 2.3 2.0 1.6 1.8 2.1 1.3 2.3 2.6 1.5 21.0 31.0 21.0 31.0 21.0 31.0 268 459 547 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG95_Hardware_Design 66 / 93 LTE Standard Module Series EG95 Hardware Design EGSM900 1DL/4UL @29.45dBm DCS1800 4DL/1UL @29.14dBm DCS1800 3DL/2UL @29.07dBm DCS1800 2DL/3UL @28.97dBm DCS1800 1DL/4UL @28.88dBm EGSM900 4DL/1UL PCL=8 @26.88dBm EGSM900 3DL/2UL PCL=8 @26.84dBm EGSM900 2DL/3UL PCL=8 @26.76dBm EGSM900 1DL/4UL PCL=8 @26.54dBm DCS1800 4DL/1UL PCL=2 @25.66dBm DCS1800 3DL/2UL PCL=2 @25.59dBm DCS1800 2DL/3UL PCL=2 @25.51dBm DCS1800 1DL/4UL PCL=2 @25.38dBm WCDMA B1 HSDPA @22.48dBm WCDMA B1 HSUPA @22.29dBm WCDMA B8 HSDPA @22.24dBm WCDMA B8 HSUPA @21.99dBm LTE-FDD B1 @23.37dBm LTE-FDD B3 @22.97dBm EDGE data transfer WCDMA data transfer LTE data transfer LTE-FDD B7 @23.17dBm LTE-FDD B8 @23.04dBm LTE-FDD B20 @23.21dBm LTE-FDD B28A @22.76dBm GSM voice call EGSM900 PCL=5 @32.36dBm DCS1800 PCL=0 @29.19dBm 631 177 290 406 517 167 278 385 492 169 256 341 432 586 591 498 511 736 710 775 651 699 714 271 181 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG95_Hardware_Design 67 / 93 LTE Standard Module Series EG95 Hardware Design WCDMA voice call WCDMA B1 @22.91dBm WCDMA B8 @23.14dBm 632 546 mA mA Table 33: EG95-NA Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspended) Sleep state WCDMA PF=512 (USB disconnected) IVBAT Idle state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspended) LTE-FDD PF=256 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA B2 HSDPA CH9938 @22.45 dBm WCDMA B2 HSUPA CH9938 @21.73 dBm WCDMA data transfer WCDMA B4 HSDPA CH1537 @23.05 dBm WCDMA B4 HSUPA CH1537 @22.86 dBm WCDMA B5 HSDPA CH4407 @23 dBm WCDMA B5 HSUPA CH4407 @ 22.88 dBm LTE data transfer LTE-FDD B2 CH1100 @23.29 dBm LTE-FDD B4 CH2175 @23.19 dBm 13 1.0 2.2 2.5 1.4 2.6 2.9 1.7 14.0 26.0 15.0 26.0 569 559 572 586 518 514 705 693 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG95_Hardware_Design 68 / 93 LTE Standard Module Series EG95 Hardware Design LTE-FDD B5 CH2525 @23.39 dBm LTE-FDD B12 CH5060 @23.16 dBm LTE-FDD B13 CH5230 @23.36 dBm WCDMA B2 CH9938 @23.34 dBm WCDMA B4 CH1537 @23.47 dBm WCDMA B5 CH4357 @ 23.37 dBm WCDMA voice call 601 650 602 627 591 536 mA mA mA mA mA mA Table 34: EG95-EX Current Consumption Parameter Description Conditions Typ. Unit IVBAT OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=5 (USB suspend) GSM DRX=9 (USB disconnected) Sleep state WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspend) WCDMA PF=512 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspend) LTE-FDD PF=256 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) Idle state WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) 15 1.3 2.3 2.0 1.6 1.8 2.1 1.3 2.3 2.6 1.5 21.0 31.0 21.0 31.0 21.0 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG95_Hardware_Design 69 / 93 LTE Standard Module Series EG95 Hardware Design LTE-FDD PF=64 (USB connected) EGSM900 4DL/1UL @33.06dBm EGSM900 3DL/2UL @32.93dBm EGSM900 2DL/3UL @31.1dBm EGSM900 1DL/4UL @29.78dBm DCS1800 4DL/1UL @29.3dBm DCS1800 3DL/2UL @29.3dBm DCS1800 2DL/3UL @29.21dBm DCS1800 1DL/4UL @29.07dBm GPRS data transfer 31.0 247.9 450.8 536.4 618 144 253.4 355.4 455.7 EGSM900 4DL/1UL PCL=8 @27.29dBm 169.5 mA mA mA mA mA mA mA mA mA mA EGSM900 3DL/2UL PCL=8 @27.01dBm 305.06 mA EGSM900 2DL/3UL PCL=8 @26.86dBm EDGE data transfer EGSM900 1DL/4UL PCL=8 @25.95dBm DCS1800 4DL/1UL PCL=2 @26.11dBm DCS1800 3DL/2UL PCL=2 @25.8dBm DCS1800 2DL/3UL PCL=2 @25.7dBm DCS1800 1DL/4UL PCL=2 @25.6dBm WCDMA B1 HSDPA @22.48dBm WCDMA data transfer WCDMA B1 HSUPA @21.9dBm WCDMA B8 HSDPA @22.6dBm WCDMA B8 HSUPA @22.02dBm LTE-FDD B1 @23.37dBm LTE data transfer LTE-FDD B3 @23.3dBm LTE-FDD B7 @23.2dBm LTE-FDD B8 @23.09dBm 434 548 135 244 349 455 485 458 556 520 605 667 783 637 mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG95_Hardware_Design 70 / 93 LTE Standard Module Series EG95 Hardware Design LTE-FDD B20 @23.21dBm LTE-FDD B28 @22.76dBm EGSM900 PCL=5 @32.36dBm DCS1800 PCL=0 @29.5dBm WCDMA B1 @23.4dBm WCDMA B8 @23.6dBm GSM voice call WCDMA voice call 646 661 259 149 494 608 mA mA mA mA mA mA Table 35: EG95-NAX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspend) Sleep state WCDMA PF=512 (USB disconnected) IVBAT Idle state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspend) LTE-FDD PF=256 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA B2 HSDPA @21.64dBm WCDMA data transfer WCDMA B2 HSUPA @21.13dBm WCDMA B4 HSDPA @22.15dBm WCDMA B4 HSUPA @22.21dBm 11 1.1 2.0 2.4 1.5 2.6 2.8 1.8 17.4 34.3 17.8 34.7 547 543 554 541 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG95_Hardware_Design 71 / 93 LTE Standard Module Series EG95 Hardware Design WCDMA B5 HSDPA @22.39dBm WCDMA B5 HSUPA @22.12dBm LTE-FDD B2 @23.07dBm LTE-FDD B4 @23.09dBm LTE-FDD B5 @23.31dBm LTE-FDD B12 @23.30dBm LTE-FDD B13 @23.32dBm LTE-FDD B25 @23.03dBm LTE-FDD B26 @22.97dBm WCDMA B2 @22.89dBm WCDMA B4 @22.76dBm WCDMA B5 @23.03dBm LTE data transfer WCDMA voice call 502 509 691 713 580 627 619 693 628 591 577 516 mA mA mA mA mA mA mA mA mA mA mA mA Table 36: GNSS Current Consumption of EG95 Parameter Description Conditions Typ. Unit Cold start @Passive Antenna Hot Start @Passive Antenna Lost state @Passive Antenna Open Sky @Passive Antenna Searching
(AT+CFUN=0) Tracking
(AT+CFUN=0) IVBAT
(GNSS) 6.5. RF Output Power The following table shows the RF output power of EG95 module. 54 54 53 32 mA mA mA mA EG95_Hardware_Design 72 / 93 LTE Standard Module Series EG95 Hardware Design Table 37: RF Output Power Frequency Max. EGSM900 DCS1800 33dBm2dB 30dBm2dB EGSM900 (8-PSK) 27dBm3dB DCS1800 (8-PSK) 26dBm3dB WCDMA B1/B2/B4/B5/B8 24dBm+1/-3dB LTE-FDD B1/B2/B3/B4/B5/B7/
B8/B12/B13/B20/B25/B26/B28 23dBm2dB NOTE Min. 5dBm5dB 0dBm5dB 5dBm5dB 0dBm5dB
<-49dBm
<-39dBm In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EG95 module. Table 38: EG95-E Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP EGSM900
-108.6dBm DCS1800
-109.4 dBm NA NA NA NA
-102dBm
-102dbm WCDMA B1
-109.5dBm
-110dBm
-112.5dBm
-106.7dBm WCDMA B8
-109.5dBm
-110dBm
-112.5dBm
-103.7dBm LTE-FDD B1 (10MHz)
-97.5dBm
-98.3dBm
-101.4dBm
-96.3dBm LTE-FDD B3 (10MHz)
-98.3dBm
-98.5dBm
-101.5dBm
-93.3dBm LTE-FDD B7 (10MHz)
-96.3dBm
-98.4dBm
-101.3dBm
-94.3dBm EG95_Hardware_Design 73 / 93 LTE Standard Module Series EG95 Hardware Design LTE-FDD B8 (10MHz)
-97.1dBm
-99.1dBm
-101.2dBm
-93.3dBm LTE-FDD B20 (10MHz)
-97dBm
-99dBm
-101.3dBm
-93.3dBm LTE-FDD B28A (10MHz)
-98.3dBm
-99dBm
-101.4dBm
-94.8dBm Table 39: EG95-NA Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP WCDMA B2
-110dBm
-110dBm
-112.5dBm
-104.7dBm WCDMA B4
-110dBm
-110dBm
-112.5dBm
-106.7dBm WCDMA B5
-111dBm
-111dBm
-113dBm
-104.7dBm LTE-FDD B2 (10MHz)
-98dBm
-99dBm
-102.2dBm
-94.3dBm LTE-FDD B4 (10MHz)
-97.8dBm
-99.5dBm
-102.2dBm
-96.3dBm LTE-FDD B5 (10MHz)
-99.6dBm
-100.3dBm
-103dBm
-94.3dBm LTE-FDD B12 (10MHz)
-99.5dBm
-100dBm
-102.5dBm
-93.3dBm LTE-FDD B13 (10MHz)
-99.2dBm
-100dBm
-102.5dBm
-93.3dBm Table 40: EG95-EX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP EGSM900
-109.8dBm NA DCS1800
-109.8 dBm NA NA NA
-102dBm
-102dbm WCDMA B1
-110dBm
-111dBm
-112.5dBm
-106.7dBm WCDMA B8
-110dBm
-111dBm
-112.5dBm
-103.7dBm LTE-FDD B1 (10MHz)
-98.7dBm
-98.8dBm
-102.4dBm
-96.3dBm LTE-FDD B3 (10MHz)
-98.3dBm
-99.5dBm
-102.5dBm
-93.3dBm LTE-FDD B7 (10MHz)
-97.5dBm
-98.4dBm
-100.3dBm
-94.3dBm LTE-FDD B8 (10MHz)
-98.7dBm
-99.6dBm
-102.2dBm
-93.3dBm EG95_Hardware_Design 74 / 93 LTE Standard Module Series EG95 Hardware Design LTE-FDD B20 (10MHz)
-97dBm
-97.5dBm
-102.2dBm
-93.3dBm LTE-FDD B28 (10MHz)
-98.2dBm
-99.5dBm
-102dBm
-94.8dBm Table 41: EG95-NAX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP WCDMA B2
-110dBm
-110dBm
-112.5dBm
-104.7dBm WCDMA B4
-110dBm
-110dBm
-112.5dBm
-106.7dBm WCDMA B5
-111dBm
-111dBm
-113dBm
-104.7dBm LTE-FDD B2 (10MHz)
-98dBm
-99dBm
-102.2dBm
-94.3dBm LTE-FDD B4 (10MHz)
-97.8dBm
-99.5dBm
-102.2dBm
-96.3dBm LTE-FDD B5 (10MHz)
-99.4dBm
-100dBm
-102.7dBm
-94.3dBm LTE-FDD B12 (10MHz)
-99.5dBm
-100dBm
-102.5dBm
-93.3dBm LTE-FDD B13 (10MHz)
-99.2dBm
-100dBm
-102.5dBm
-93.3dBm LTE-FDD B25 (10MHz)
-97.6dBm
-99dBm
-102.2dBm
-92.8dBm LTE-FDD B26 (10MHz)
-99.1dBm
-99.9dBm
-102.7dBm
-93.8dBm 6.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the modules electrostatic discharge characteristics. EG95_Hardware_Design 75 / 93 LTE Standard Module Series EG95 Hardware Design Table 42: Electrostatic Discharge Characteristics (25C, 45% Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND All Antenna Interfaces 5 4 Other Interfaces 0.5 6.8. Thermal Consideration 10 8 1 KV KV KV In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:
On customers PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc. Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary. Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Make sure the ground pads of the module and PCB are fully connected. According to customers application demands, the heatsink can be mounted on the top of the module, or the opposite side of the PCB area where the module is mounted, or both of them. The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB. The following shows two kinds of heatsink designs for reference and customers can choose one or both of them according to their application structure. EG95_Hardware_Design 76 / 93 LTE Standard Module Series EG95 Hardware Design Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module) Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers PCB) NOTES 1. The module offers the best performance when the internal BB chip stays below 105C. When the maximum temperature of the BB chip reaches or exceeds 105C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. 2. For more detailed guidelines on thermal design, please refer to document [6]. EG95_Hardware_Design 77 / 93 HeatsinkEG95 ModuleApplication BoardApplication BoardHeatsinkThermal PadShielding CoverThermal PadHeatsinkApplication BoardApplication BoardHeatsinkThermal PadEG95 ModuleShielding Cover LTE Standard Module Series EG95 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the dimensional tolerances are 0.05mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module Figure 41: Module Top and Side Dimensions EG95_Hardware_Design 78 / 93 250.15290.15 2.300.2Pin 1 LTE Standard Module Series EG95 Hardware Design Figure 42: Module Bottom Dimensions (Top View) EG95_Hardware_Design 79 / 93 LTE Standard Module Series EG95 Hardware Design 7.2. Recommended Footprint Figure 43: Recommended Footprint (Top View) NOTE For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB. EG95_Hardware_Design 80 / 93 LTE Standard Module Series EG95 Hardware Design 7.3. Top and Bottom Views of the Module Figure 44: Top View of the Module Figure 45: Bottom View of the Module NOTE These are renderings of EG95. For authentic appearance, please refer to the module that you receive from Quectel. EG95_Hardware_Design 81 / 93 LTE Standard Module Series EG95 Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EG95 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40C/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:
Mounted within 168 hours at the factory environment of 30C/60%RH. Stored at <10%RH. 3. Devices require baking before mounting, if any circumstances below occurs:
When the ambient temperature is 23C5C and the humidity indicator card shows the humidity is >10% before opening the vacuum-sealed bag. Device mounting cannot be finished within 168 hours at factory conditions of 30C/60%RH. If baking is required, devices may be baked for 8 hours at 120C5C. NOTE As the plastic package cannot be subjected to high temperature, it should be removed from devices before high temperature (120C) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033 for baking procedure. EG95_Hardware_Design 82 / 93 LTE Standard Module Series EG95 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.15mm~0.18mm. For more details, please refer to document [4]. It is suggested that the peak reflow temperature is 238C~245C, and the absolute maximum reflow temperature is 245C. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 46: Reflow Soldering Thermal Profile Table 43: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 1 ~ 3C/sec Soak time (between A and B: 150C and 200C) 60 ~ 120 sec Reflow Zone EG95_Hardware_Design 83 / 93 Temp. (C)Reflow ZoneSoak Zone245200220238CDBA150100 Max slope: 1~3C/sec Cooling down slope: 1~4C/sec Max slope: 2~3C/sec LTE Standard Module Series EG95 Hardware Design Max slope Reflow time (D: over 220C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle 8.3. Packaging 2 ~ 3C/sec 40 ~ 60 sec 238 ~ 245C 1 ~ 4C/sec 1 EG95 is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. The reel is 330mm in diameter and each reel contains 250pcs modules. The following figures show the packaging details, measured in mm. Figure 47: Tape Dimensions EG95_Hardware_Design 84 / 93 LTE Standard Module Series EG95 Hardware Design Figure 48: Reel Dimensions Figure 49: Tape and Reel Directions EG95_Hardware_Design 85 / 93 Direction of feedCover tape1310044.5+0.20-0.0048.5Carrier tapepacking moduleCarrier tapeunfolding1083 LTE Standard Module Series EG95 Hardware Design 9 Appendix A References Table 44: Related Documents SN Document Name Remark
[1]
Quectel_EC2x&EG9x_Power_Management_ Application_Note
[2]
Quectel_EG9x_AT_Commands_Manual Power Management Application Note for EC25, EC21, EC20 R2.0, EC20 R2.1, EG95 and EG91 AT Commands Manual for EG95 and EG91
[3]
[4]
[5]
Quectel_EC25&EC21_GNSS_AT_Commands_ GNSS AT Commands Manual for EC25 Manual and EC21 modules Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide Quectel_RF_Layout_Application_Note RF Layout Application Note Thermal design guide for LTE standard, LTE-A and Automotive modules UMTS<E EVB user guide for UMTS<E modules
[6]
Quectel_LTE_Module_Thermal_Design_Guide
[7]
Quectel_UMTS<E_EVB_User_Guide Table 45: Terms and Abbreviations Abbreviation Description AMR bps Adaptive Multi-rate Bits Per Second CHAP Challenge Handshake Authentication Protocol CS CSD CTS Coding Scheme Circuit Switched Data Clear To Send DC-HSPA+
Dual-carrier High Speed Packet Access EG95_Hardware_Design 86 / 93 LTE Standard Module Series EG95 Hardware Design DFOTA Delta Firmware Upgrade Over The Air DL DTR DTX EFR ESD FDD FR GMSK GSM HR HSPA HSDPA HSUPA I/O Inorm LED LNA LTE MIMO MO MS MSL MT PAP Downlink Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate Gaussian Minimum Shift Keying Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Downlink Packet Access High Speed Uplink Packet Access Input/Output Normal Current Light Emitting Diode Low Noise Amplifier Long Term Evolution Multiple Input Multiple Output Mobile Originated Mobile Station (GSM engine) Moisture Sensitivity Level Mobile Terminated Password Authentication Protocol EG95_Hardware_Design 87 / 93 LTE Standard Module Series EG95 Hardware Design PCB PDU PPP QAM QPSK RF RHCP Rx SMS TDD TX UL UMTS URC
(U)SIM Vmax Vnorm Vmin VIHmax VIHmin VILmax VILmin VImax VImin VOHin Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Right Hand Circularly Polarized Receive Short Message Service Time Division Duplexing Transmitting Direction Uplink Universal Mobile Telecommunications System Unsolicited Result Code
(Universal) Subscriber Identity Module Maximum Voltage Value Normal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Absolute Minimum Input Voltage Value Minimum Output High Level Voltage Value EG95_Hardware_Design 88 / 93 LTE Standard Module Series EG95 Hardware Design VOLmax VOLmin VSWR Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access EG95_Hardware_Design 89 / 93 LTE Standard Module Series EG95 Hardware Design 10 Appendix B GPRS Coding Schemes Table 46: Description of Different Coding Schemes Scheme Code Rate USF Pre-coded USF CS-1 CS-2 CS-3 CS-4 1/2 3 3 2/3 3/4 3 6 3 6 Radio Block excl.USF and BCS 181 268 312 BCS Tail Coded Bits Punctured Bits 40 4 456 0 16 4 588 132 16 4 676 220 Data Rate Kb/s 9.05 13.4 15.6 21.4 EG95_Hardware_Design 90 / 93 1 3 12 428 16
-
456
-
LTE Standard Module Series EG95 Hardware Design 11 Appendix C GPRS Multi-slot Classes Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 47: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1 2 2 3 2 3 3 4 3 4 4 4 3 4 1 1 2 1 2 2 3 1 2 2 3 4 3 4 2 3 3 4 4 4 4 5 5 5 5 5 NA NA EG95_Hardware_Design 91 / 93 LTE Standard Module Series EG95 Hardware Design 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 5 6 7 8 6 6 6 6 6 8 8 8 8 8 8 5 5 5 5 5 6 7 8 2 3 4 4 6 2 3 4 4 6 8 1 2 3 4 NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA 6 6 6 6 EG95_Hardware_Design 92 / 93 LTE Standard Module Series EG95 Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 48: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot
/
/
/
/
C B A C B A B A A CS-1:
CS-2:
CS-3:
CS-4:
GMSK GMSK GMSK GMSK MCS-1 GMSK MCS-2 GMSK MCS-3 GMSK MCS-4 GMSK MCS-5 8-PSK MCS-6 8-PSK MCS-7 8-PSK MCS-8 8-PSK MCS-9 8-PSK 9.05kbps 18.1kbps 36.2kbps 13.4kbps 26.8kbps 53.6kbps 15.6kbps 31.2kbps 62.4kbps 21.4kbps 42.8kbps 85.6kbps 8.80kbps 17.60kbps 35.20kbps 11.2kbps 22.4kbps 44.8kbps 14.8kbps 29.6kbps 59.2kbps 17.6kbps 35.2kbps 70.4kbps 22.4kbps 44.8kbps 89.6kbps 29.6kbps 59.2kbps 118.4kbps 44.8kbps 89.6kbps 179.2kbps 54.4kbps 108.8kbps 217.6kbps 59.2kbps 118.4kbps 236.8kbps EG95_Hardware_Design 93 / 93 1.1. FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR201909EG95NAX. 4. This module must not transmit simultaneously with any other antenna or transmitter 5. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID -
Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID:
XMR201909EG95NAX or Contains FCC ID: XMR201909EG95NAX must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment.
| 1 | External Photos | External Photos | 328.77 KiB | / February 12 2019 |
E EUT Appearanc ce EUT Ap ppearanc ce Re eport No.: R190 07A0407 a: EUT TA Techno Thisreportsh ology (Shang hallnotberepr ghai) Co., L roducedexcept Picture 1:
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| frequency | equipment class | purpose | ||
|---|---|---|---|---|
| 1 | 2019-12-02 | 1852.4 ~ 1907.6 | PCB - PCS Licensed Transmitter | Original Equipment |
| app s | Applicant Information | |||||
|---|---|---|---|---|---|---|
| 1 | Effective |
2019-12-02
|
||||
| 1 | Applicant's complete, legal business name |
Quectel Wireless Solutions Company Limited
|
||||
| 1 | FCC Registration Number (FRN) |
0018988279
|
||||
| 1 | Physical Address |
Building 5, Shanghai Business Park PhaseIII (Area B),No.1016 Tianlin Road, Minhang District
|
||||
| 1 |
Building 5, Shanghai Business Park PhaseIII
|
|||||
| 1 |
Shanghai, N/A
|
|||||
| 1 |
China
|
|||||
| app s | TCB Information | |||||
| 1 | TCB Application Email Address |
c******@telefication.com
|
||||
| 1 | TCB Scope |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
||||
| app s | FCC ID | |||||
| 1 | Grantee Code |
XMR
|
||||
| 1 | Equipment Product Code |
201909EG95NAX
|
||||
| app s | Person at the applicant's address to receive grant or for contact | |||||
| 1 | Name |
J****** H********
|
||||
| 1 | Telephone Number |
+8602******** Extension:
|
||||
| 1 | Fax Number |
+8621********
|
||||
| 1 |
j******@quectel.com
|
|||||
| app s | Technical Contact | |||||
| 1 | Firm Name |
TA Technology(Shanghai) Company, Limited
|
||||
| 1 | Name |
K**** X******
|
||||
| 1 | Physical Address |
No.145,Jintang Rd,Tangzhen IndustryPark,Pudong
|
||||
| 1 |
China
|
|||||
| 1 | Telephone Number |
86-21********
|
||||
| 1 | Fax Number |
86-21********
|
||||
| 1 |
x******@ta-shanghai.com
|
|||||
| app s | Non Technical Contact | |||||
| 1 | Firm Name |
TA Technology(Shanghai) Company, Limited
|
||||
| 1 | Name |
h******** n********
|
||||
| 1 | Physical Address |
No.145,Jintang Rd,Tangzhen IndustryPark,Pudong
|
||||
| 1 |
China
|
|||||
| 1 | Telephone Number |
86-21********
|
||||
| 1 | Fax Number |
86-21********
|
||||
| 1 |
h******@ta-shanghai.com
|
|||||
| app s | Confidentiality (long or short term) | |||||
| 1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
| 1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
| if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
| app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
| 1 | Is this application for software defined/cognitive radio authorization? | No | ||||
| 1 | Equipment Class | PCB - PCS Licensed Transmitter | ||||
| 1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | LTE Module | ||||
| 1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
| 1 | Modular Equipment Type | Single Modular Approval | ||||
| 1 | Purpose / Application is for | Original Equipment | ||||
| 1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
| 1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
| 1 | Grant Comments | Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. The antenna's as listed in this application must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-users may not be provided with the module installation instructions. OEM integrators and end-users must be provided with transmitter operating conditions for satisfying RF exposure compliance. The antenna gain is described as in the filling. | ||||
| 1 | Is there an equipment authorization waiver associated with this application? | No | ||||
| 1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
| app s | Test Firm Name and Contact Information | |||||
| 1 | Firm Name |
TA Technology (Shanghai) Co., Ltd.
|
||||
| 1 | Name |
M******** L********
|
||||
| 1 | Telephone Number |
86-21********
|
||||
| 1 |
l******@ta-shanghai.com
|
|||||
| Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 1 | 1 | 22H | 824.7 | 848.3 | 0.267 | 0.00952 ppm | 1M09G7D | ||||||||||||||||||||||||||||||||||
| 1 | 2 | 22H | 824.7 | 848.3 | 0.256 | 0.00952 ppm | 13M4G7D | ||||||||||||||||||||||||||||||||||
| 1 | 3 | 22H | 824.7 | 848.3 | 0.233 | 0.00957 ppm | 2M70W7D | ||||||||||||||||||||||||||||||||||
| 1 | 4 | 22H | 824.7 | 848.3 | 0.224 | 0.00957 ppm | 13M4W7D | ||||||||||||||||||||||||||||||||||
| 1 | 5 | 9 | 814.7 | 823.3 | 0.258 | 0.00949 ppm | 2M71G7D | ||||||||||||||||||||||||||||||||||
| 1 | 6 | 9 | 814.7 | 823.3 | 0.242 | 0.00949 ppm | 8M97G7D | ||||||||||||||||||||||||||||||||||
| 1 | 7 | 9 | 814.7 | 823.3 | 0.221 | 0.0094 ppm | 2M69W7D | ||||||||||||||||||||||||||||||||||
| 1 | 8 | 9 | 814.7 | 823.3 | 0.207 | 0.0094 ppm | 8M92W7D | ||||||||||||||||||||||||||||||||||
| 1 | 9 | 24E | 1850.7 | 1914.3 | 0.251 | 0.00921 ppm | 8M98G7D | ||||||||||||||||||||||||||||||||||
| 1 | 1 | 24E | 1850.7 | 1914.3 | 0.244 | 0.00921 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
| 1 | 11 | 24E | 1850.7 | 1914.3 | 0.224 | 0.00899 ppm | 8M99W7D | ||||||||||||||||||||||||||||||||||
| 1 | 12 | 24E | 1850.7 | 1914.3 | 0.216 | 0.00899 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
| 1 | 13 | 22H | 826.4 | 846.6 | 0.209 | 0.00724 ppm | 4M14F9W | ||||||||||||||||||||||||||||||||||
| 1 | 14 | 22H | 824.7 | 848.3 | 0.249 | 0.01387 ppm | 2M76G7D | ||||||||||||||||||||||||||||||||||
| 1 | 15 | 22H | 824.7 | 848.3 | 0.23 | 0.00574 ppm | 2M75W7D | ||||||||||||||||||||||||||||||||||
| 1 | 16 | 22H | 824.7 | 848.3 | 0.247 | 0.01387 ppm | 9M02G7D | ||||||||||||||||||||||||||||||||||
| 1 | 17 | 22H | 824.7 | 848.3 | 0.227 | 0.00574 ppm | 9M02W7D | ||||||||||||||||||||||||||||||||||
| 1 | 18 | 24E | 1852.4 | 1907.6 | 0.222 | 0.00327 ppm | 4M14F9W | ||||||||||||||||||||||||||||||||||
| 1 | 19 | 24E | 1850.7 | 1909.3 | 0.248 | 0.00193 ppm | 9M05G7D | ||||||||||||||||||||||||||||||||||
| 1 | 2 | 24E | 1850.7 | 1909.3 | 0.229 | 0.0024 ppm | 9M02W7D | ||||||||||||||||||||||||||||||||||
| 1 | 21 | 24E | 1850.7 | 1909.3 | 0.246 | 0.00193 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
| 1 | 22 | 24E | 1850.7 | 1909.3 | 0.226 | 0.0024 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
| 1 | 23 | 27 | 1712.4 | 1752.6 | 0.227 | 0.0015 ppm | 4M13F9W | ||||||||||||||||||||||||||||||||||
| 1 | 24 | 27 | 1710.7 | 1754.3 | 0.255 | 0.00255 ppm | 2M74G7D | ||||||||||||||||||||||||||||||||||
| 1 | 25 | 27 | 1710.7 | 1754.3 | 0.24 | 0.00231 ppm | 9M06W7D | ||||||||||||||||||||||||||||||||||
| 1 | 26 | 27 | 1710.7 | 1754.3 | 0.251 | 0.00255 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
| 1 | 27 | 27 | 1710.7 | 1754.3 | 0.237 | 0.00231 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
| 1 | 28 | 27 | 699.7 | 715.3 | 0.246 | 0.00387 ppm | 2M74G7D | ||||||||||||||||||||||||||||||||||
| 1 | 29 | 27 | 699.7 | 715.3 | 0.231 | 0.00729 ppm | 2M74W7D | ||||||||||||||||||||||||||||||||||
| 1 | 3 | 27 | 699.7 | 715.3 | 0.242 | 0.00387 ppm | 9M03G7D | ||||||||||||||||||||||||||||||||||
| 1 | 31 | 27 | 699.7 | 715.3 | 0.228 | 0.00729 ppm | 9M02W7D | ||||||||||||||||||||||||||||||||||
| 1 | 32 | 27 | 779.5 | 784.5 | 0.229 | 0.00974 ppm | 4M53G7D | ||||||||||||||||||||||||||||||||||
| 1 | 33 | 27 | 779.5 | 784.5 | 0.202 | 0.01211 ppm | 4M53W7D | ||||||||||||||||||||||||||||||||||
| 1 | 34 | 27 | 779.5 | 784.5 | 0.239 | 0.00974 ppm | 9M04G7D | ||||||||||||||||||||||||||||||||||
| 1 | 35 | 27 | 779.5 | 784.5 | 0.209 | 0.01211 ppm | 9M05W7D | ||||||||||||||||||||||||||||||||||
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC