FCC ID: XMR2019SC600NA LTE Module

 

SC600Y&SC600T Hardware Design Smart LTE Module Series Rev: SC600Y&SC600T_Hardware_Design_V1.0 Date: 2019-07-01 Status: Preliminary www.quectel.com Smart LTE Module Series SC600Y&SC600T Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

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http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. SC600Y&SC600T_Hardware_Design 1 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design About the Document History Revision Date Author Description 1.0 2019-07-01 Light WANG/

Rock CHEN Initial SC600Y&SC600T_Hardware_Design 2 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Table Index ................................................................................................................................................... 6 Figure Index ................................................................................................................................................. 8 1 Introduction ........................................................................................................................................ 14 1.1. Safety Information ..................................................................................................................... 15 2 Product Concept ................................................................................................................................ 16 2.1. General Description .................................................................................................................. 16 2.2. Key Features ............................................................................................................................. 19 2.3. Functional Diagram ................................................................................................................... 23 2.4. Evaluation Board ....................................................................................................................... 24 3 Application Interfaces ....................................................................................................................... 25 3.1. General Description .................................................................................................................. 25 3.2. Pin Assignment ......................................................................................................................... 26 3.3. Pin Description .......................................................................................................................... 27 3.4. Power Supply ............................................................................................................................ 43 3.4.1. Power Supply Pins ......................................................................................................... 43 3.4.2. Decrease Voltage Drop .................................................................................................. 43 3.4.3. Reference Design for Power Supply .............................................................................. 44 3.5. Turn on and off Scenarios ......................................................................................................... 45 3.5.1. Turn on Module Using the PWRKEY ............................................................................. 45 3.5.2. Turn off Module .............................................................................................................. 47 3.6. VRTC Interface ......................................................................................................................... 48 3.7. Power Output ............................................................................................................................ 49 3.8. Battery Charge and Management ............................................................................................. 49 3.9. USB Interface ............................................................................................................................ 51 3.10. UART Interfaces ........................................................................................................................ 54 3.11. (U)SIM Interfaces ...................................................................................................................... 56 3.12. SD Card Interface ..................................................................................................................... 58 3.13. GPIO Interfaces ........................................................................................................................ 60 3.14. I2C Interfaces ............................................................................................................................ 63 3.15. I2S Interface .............................................................................................................................. 64 3.16. SPI Interfaces ............................................................................................................................ 64 3.17. ADC Interfaces .......................................................................................................................... 65 3.18. Vibrator Drive Interface ............................................................................................................. 65 3.19. LCM Interfaces .......................................................................................................................... 66 3.20. Touch Panel Interfaces ............................................................................................................. 70 3.21. Camera Interfaces..................................................................................................................... 71 SC600Y&SC600T_Hardware_Design 3 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 3.21.1. Design Considerations ................................................................................................... 77 3.21.2. Flashlight Interfaces ....................................................................................................... 79 3.22. Sensor Interfaces ...................................................................................................................... 80 3.23. Audio Interfaces ........................................................................................................................ 80 3.23.1. Reference Circuit Design for Microphone Interfaces ..................................................... 82 3.23.2. Reference Circuit Design for Earpiece Interface ........................................................... 83 3.23.3. Reference Circuit Design for Headphone Interface ....................................................... 83 3.23.4. Reference Circuit Design for Loudspeaker Interface..................................................... 84 3.23.5. Audio Interfaces Design Considerations........................................................................ 84 3.24. Emergency Download Interface ................................................................................................ 85 4 Wi-Fi and BT ....................................................................................................................................... 86 4.1. Wi-Fi Overview .......................................................................................................................... 86 4.1.1. Wi-Fi Performance ......................................................................................................... 86 4.2. BT Overview .............................................................................................................................. 88 4.2.1. BT Performance ............................................................................................................. 89 5 GNSS ................................................................................................................................................... 90 5.1. GNSS Performance .................................................................................................................. 90 5.2. GNSS RF Design Guidelines .................................................................................................... 91 6 Antenna Interfaces ............................................................................................................................. 92 6.1. Main/Rx-diversity Antenna Interfaces ....................................................................................... 92 6.1.1. Main and Rx-diversity Antenna Interfaces Reference Design ....................................... 95 6.1.2. Reference Design of RF Layout..................................................................................... 96 6.2. Wi-Fi/BT Antenna Interface ....................................................................................................... 98 6.3. GNSS Antenna Interface ........................................................................................................... 99 6.3.1. Recommended Circuit for Passive Antenna .................................................................. 99 6.3.2. Recommended Circuit for Active Antenna ................................................................... 100 6.4. Antenna Installation ................................................................................................................. 100 6.4.1. Antenna Requirements ................................................................................................ 100 6.4.2. Recommended RF Connector for Antenna Installation ............................................... 101 7 Electrical, Reliability and Radio Characteristics .......................................................................... 103 7.1. Absolute Maximum Ratings .................................................................................................... 103 7.2. Power Supply Ratings ............................................................................................................. 103 7.3. Operation and Storage Temperatures ..................................................................................... 104 7.4. Current Consumption .............................................................................................................. 105 7.5. RF Output Power .....................................................................................................................111 7.6. RF Receiving Sensitivity ......................................................................................................... 114 7.7. Electrostatic Discharge ........................................................................................................... 116 8 Mechanical Dimensions .................................................................................................................. 118 8.1. Mechanical Dimensions of the Module ................................................................................... 118 8.2. Recommended Footprint ........................................................................................................ 120 8.3. Top and Bottom View of the Module ....................................................................................... 121 SC600Y&SC600T_Hardware_Design 4 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 9 Storage, Manufacturing and Packaging ........................................................................................ 122 9.1. Storage .................................................................................................................................... 122 9.2. Manufacturing and Soldering .................................................................................................. 123 9.3. Packaging ............................................................................................................................... 124 10 Appendix A References ................................................................................................................... 126 11 Appendix B GPRS Coding Schemes ............................................................................................. 129 12 Appendix C GPRS Multi-slot Classes ............................................................................................ 130 13 Appendix D EDGE Modulation and Coding Schemes ................................................................. 132 SC600Y&SC600T_Hardware_Design 5 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Table Index TABLE 1: SC600Y-EM*/SC600T-EM* FREQUENCY BANDS .......................................................................... 16 TABLE 2: SC600Y-NA*/SC600T-NA* FREQUENCY BANDS ........................................................................... 17 TABLE 3: SC600Y-JP*/SC600T-JP* FREQUENCY BANDS ............................................................................. 17 TABLE 4: SC600Y-WF*/SC600T-WF* FREQUENCY BANDS .......................................................................... 18 TABLE 5: SC600Y&SC600T KEY FEATURES ................................................................................................. 19 TABLE 6: I/O PARAMETERS DEFINITION ....................................................................................................... 27 TABLE 7: PIN DESCRIPTION ........................................................................................................................... 27 TABLE 8: POWER DESCRIPTION ................................................................................................................... 49 TABLE 9: PIN DEFINITION OF CHARGING INTERFACE ............................................................................... 50 TABLE 10: PIN DEFINITION OF USB INTERFACE ......................................................................................... 52 TABLE 11: USB TRACE LENGTH INSIDE THE MODULE ............................................................................... 54 TABLE 12: PIN DEFINITION OF UART INTERFACES ..................................................................................... 54 TABLE 13: PIN DEFINITION OF (U)SIM INTERFACES ................................................................................... 56 TABLE 14: PIN DEFINITION OF SD CARD INTERFACE ................................................................................ 59 TABLE 15: SD CARD SIGNAL TRACE LENGTH INSIDE THE MODULE ....................................................... 60 TABLE 16: PIN DEFINITION OF GPIO INTERFACES ..................................................................................... 60 TABLE 17: PIN DEFINITION OF I2C INTERFACES ......................................................................................... 63 TABLE 18: PIN DEFINITION OF I2S INTERFACE ........................................................................................... 64 TABLE 19: PIN DEFINITION OF SPI INTERFACES ........................................................................................ 65 TABLE 20: PIN DEFINITION OF ADC INTERFACES ....................................................................................... 65 TABLE 21: PIN DEFINITION OF VIBRATOR DRIVE INTERFACE .................................................................. 66 TABLE 22: PIN DEFINITION OF LCM INTERFACES ....................................................................................... 66 TABLE 23: PIN DEFINITION OF TOUCH PANEL INTERFACES ..................................................................... 70 TABLE 24: PIN DEFINITION OF CAMERA INTERFACES ............................................................................... 72 TABLE 25: MIPI TRACE LENGTH INSIDE THE MODULE............................................................................... 77 TABLE 26: PIN DEFINITION OF FLASHLIGHT INTERFACES ........................................................................ 79 TABLE 27: PIN DEFINITION OF SENSOR INTERFACES ............................................................................... 80 TABLE 28: PIN DEFINITION OF AUDIO INTERFACES ................................................................................... 81 TABLE 29: WI-FI TRANSMITTING PERFORMANCE ....................................................................................... 86 TABLE 30: WI-FI RECEIVING PERFORMANCE .............................................................................................. 87 TABLE 31: BT DATA RATE AND VERSIONS .................................................................................................... 89 TABLE 32: BT TRANSMITTING AND RECEIVING PERFORMANCE ............................................................. 89 TABLE 33: GNSS PERFORMANCE ................................................................................................................. 90 TABLE 34: PIN DEFINITION OF MAIN/RX-DIVERSITY ANTENNA INTERFACES ......................................... 92 TABLE 35: SC600Y-JP*/SC600T-JP* MODULE OPERATING FREQUENCIES .............................................. 92 TABLE 36: SC600Y-EM*/SC600T-EM* MODULE OPERATING FREQUENCIES............................................ 93 TABLE 37: SC600Y-NA*/SC600T-NA* MODULE OPERATING FREQUENCIES ............................................ 94 TABLE 38: PIN DEFINITION OF WI-FI/BT ANTENNA INTERFACE ................................................................ 98 TABLE 39: WI-FI/BT FREQUENCY................................................................................................................... 98 TABLE 40: PIN DEFINITION OF GNSS ANTENNA .......................................................................................... 99 TABLE 41: GNSS FREQUENCY ....................................................................................................................... 99 SC600Y&SC600T_Hardware_Design 6 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design TABLE 42: ANTENNA REQUIREMENTS ........................................................................................................ 100 TABLE 43: ABSOLUTE MAXIMUM RATINGS ................................................................................................ 103 TABLE 44: SC600Y&SC600T MODULES POWER SUPPLY RATINGS ........................................................ 103 TABLE 45: OPERATION AND STORAGE TEMPERATURES ........................................................................ 104 TABLE 46: SC600Y-JP*/SC600T-JP* CURRENT CONSUMPTION ............................................................... 105 TABLE 47: SC600Y-EM*/SC600T-EM* CURRENT CONSUMPTION ............................................................ 106 TABLE 48: SC600Y-NA*/SC600T-NA* CURRENT CONSUMPTION .............................................................. 110 TABLE 49: SC600Y-JP*/SC600T-JP* RF OUTPUT POWER .......................................................................... 111 TABLE 50: SC600Y-EM*/SC600T-EM* RF OUTPUT POWER ........................................................................ 112 TABLE 51: SC600Y-NA*/SC600T-NA* RF OUTPUT POWER ......................................................................... 113 TABLE 52: SC600Y-JP*/SC600T-JP* RF RECEIVING SENSITIVITY ............................................................. 114 TABLE 53: SC600Y-EM*/SC600T-EM* RF RECEIVING SENSITIVITY .......................................................... 115 TABLE 54: SC600Y-NA*/SC600T-NA* RF RECEIVING SENSITIVITY ........................................................... 116 TABLE 55: ESD CHARACTERISTICS (TEMPERATURE: 25C, HUMIDITY: 45%) ........................................ 117 TABLE 56: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................. 123 TABLE 57: REEL PACKAGING ....................................................................................................................... 125 TABLE 58: RELATED DOCUMENTS .............................................................................................................. 126 TABLE 59: TERMS AND ABBREVIATIONS .................................................................................................... 126 TABLE 60: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................ 129 TABLE 61: GPRS MULTI-SLOT CLASSES .................................................................................................... 130 TABLE 62: EDGE MODULATION AND CODING SCHEMES ......................................................................... 132 SC600Y&SC600T_Hardware_Design 7 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 23 FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... 26 FIGURE 3: VOLTAGE DROP SAMPLE ............................................................................................................. 43 FIGURE 4: STAR STRUCTURE OF POWER SUPPLY .................................................................................... 44 FIGURE 5: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 45 FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................... 46 FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 46 FIGURE 8: TIMING OF TURNING ON MODULE ............................................................................................. 47 FIGURE 9: TIMING OF TURNING OFF MODULE ........................................................................................... 48 FIGURE 10: RTC POWERED BY COIN CELL ................................................................................................. 48 FIGURE 11: REFERENCE DESIGN FOR BATTERY CHARGING CIRCUIT ................................................... 51 FIGURE 12: USB 2.0 INTERFACE REFERENCE DESIGN ............................................................................. 53 FIGURE 13: USB TYPE-C INTERFACE REFERENCE DESIGN ..................................................................... 53 FIGURE 14: REFERENCE CIRCUIT WITH LEVEL TRANSLATOR CHIP (FOR UART5) .............................. 55 FIGURE 15: RS232 LEVEL MATCH CIRCUIT (FOR UART5) .......................................................................... 56 FIGURE 16: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR

................................................................................................................................................................... 57 FIGURE 17: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR

................................................................................................................................................................... 58 FIGURE 18: REFERENCE CIRCUIT FOR SD CARD INTERFACE ................................................................. 59 FIGURE 19: REFERENCE CIRCUIT FOR VIBRATOR CONNECTION ........................................................... 66 FIGURE 20: REFERENCE CIRCUIT DESIGN FOR LCM0 INTERFACE ......................................................... 68 FIGURE 21: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE ......................................................... 69 FIGURE 22: REFERENCE DESIGN OF LCM1 EXTERNAL BACKLIGHT DRIVING CIRCUIT ....................... 70 FIGURE 23: REFERENCE CIRCUIT DESIGN FOR TOUCH PANEL INTERFACES ....................................... 71 FIGURE 24: REFERENCE CIRCUIT DESIGN FOR TWO-CAMERA APPLICATIONS .................................... 75 FIGURE 25: REFERENCE CIRCUIT DESIGN FOR THREE-CAMERA APPLICATIONS ................................ 76 FIGURE 26: REFERENCE CIRCUIT DESIGN FOR FLASHLIGHT INTERFACES .......................................... 80 FIGURE 27: REFERENCE CIRCUIT DESIGN FOR ANALOG ECM-TYPE MICROPHONE ........................... 82 FIGURE 28: REFERENCE CIRCUIT DESIGN FOR MEMS-TYPE MICROPHONE ........................................ 82 FIGURE 29: REFERENCE CIRCUIT DESIGN FOR EARPIECE INTERFACE ................................................ 83 FIGURE 30: REFERENCE CIRCUIT DESIGN FOR HEADPHONE INTERFACE ........................................... 83 FIGURE 31: REFERENCE CIRCUIT DESIGN FOR LOUDSPEAKER INTERFACE ....................................... 84 FIGURE 32: REFERENCE CIRCUIT DESIGN FOR EMERGENCY DOWNLOAD INTERFACE ..................... 85 FIGURE 33: REFERENCE CIRCUIT DESIGN FOR MAIN AND RX-DIVERSITY ANTENNA INTERFACES .. 95 FIGURE 34: MICROSTRIP DESIGN ON A 2-LAYER PCB ............................................................................... 96 FIGURE 35: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB ........................................................... 96 FIGURE 36: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)

................................................................................................................................................................... 97 FIGURE 37: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)

................................................................................................................................................................... 97 SC600Y&SC600T_Hardware_Design 8 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design FIGURE 38: REFERENCE CIRCUIT DESIGN FOR WI-FI/BT ANTENNA INTERFACE .................................. 98 FIGURE 39: REFERENCE CIRCUIT DESIGN FOR GNSS PASSIVE ANTENNA ........................................... 99 FIGURE 40: REFERENCE CIRCUIT DESIGN FOR GNSS ACTIVE ANTENNA ........................................... 100 FIGURE 41: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) .............................................. 101 FIGURE 42: MECHANICALS OF U.FL-LP CONNECTORS ........................................................................... 102 FIGURE 43: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ......................................................... 102 FIGURE 44: MODULE TOP AND SIDE DIMENSIONS .................................................................................... 118 FIGURE 45: MODULE BOTTOM DIMENSIONS (TOP VIEW) ........................................................................ 119 FIGURE 46: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ 120 FIGURE 47: TOP VIEW OF SC600Y/SC600T MODULES ............................................................................. 121 FIGURE 48: BOTTOM VIEW OF SC600Y/SC600T MODULES ..................................................................... 121 FIGURE 49: RECOMMENDED REFLOW SOLDERING THERMAL PROFILE .............................................. 123 FIGURE 50: TAPE DIMENSIONS ................................................................................................................... 124 FIGURE 51: REEL DIMENSIONS ................................................................................................................... 125 SC600Y&SC600T_Hardware_Design 9 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: XMR2019SC600NA Contains IC: 10224A-2019SC600NA The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met. SC600Y&SC600T_Hardware_Design 10 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void SC600Y&SC600T_Hardware_Design 11 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Industry Canada Statement This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions:

(1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement."

The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology. The device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

The maximum antenna gain permitted for devices in the bands 52505350 MHz and 54705725 MHz shall comply with the e.i.r.p. limit; and The maximum antenna gain permitted for devices in the band 57255825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate. L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations transmettre ou de panne oprationnelle. Notez que ceci n'est pas destin interdire la transmission d'informations de contrle ou de signalisation ou l'utilisation de codes rptitifs lorsque cela est requis par la technologie. Le dispositif utilis dans la bande 5150-5250 MHz est rserv une utilisation en intrieur afin de rduire le risque de brouillage prjudiciable aux systmes mobiles par satellite dans le mme canal;

Le gain d'antenne maximal autoris pour les dispositifs dans les bandes 5250-5350 MHz et 5470-5725 MHz doit tre conforme la norme e.r.p. limite; et Le gain d'antenne maximal autoris pour les appareils de la bande 5725-5825 MHz doit tre conforme la norme e.i.r.p. les limites spcifies pour un fonctionnement point point et non point point, selon le cas. CAN ICES-3(B)/ NMB-3(B) Radiation Exposure Statement SC600Y&SC600T_Hardware_Design 12 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator &

your body. SC600Y&SC600T_Hardware_Design 13 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 1 Introduction This document defines the SC600Y&SC600T modules and describes their air interfaces and hardware interfaces which are connected with customers applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details as well as other related information of SC600Y&SC600T modules. Associated with application note and user guide, customers can use SC600Y&SC600T modules to design and set up mobile applications easily. SC600Y&SC600T_Hardware_Design 14 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating SC600Y&SC600T modules. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. SC600Y&SC600T_Hardware_Design 15 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 2 Product Concept 2.1. General Description SC600Y&SC600T are a series of Smart LTE modules based on Qualcomm platform and Android operating system, and provide industrial grade performance. Their general features are listed below:

Support worldwide LTE-FDD, LTE-TDD, DC-HSDPA, DC-HSUPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS coverage Support short-range wireless communication via Wi-Fi 802.11a/b/g/n/ac and BT4.2 LE standards Integrate GPS/GLONASS/BeiDou satellite positioning systems Support multiple audio and video codecs Built-in high performance AdrenoTM 506 graphics processing unit Provide multiple audio and video input/output interfaces as well as abundant GPIO interfaces SC600Y&SC600T modules are composed of standard version (SC600Y-XX) and high-performance version (SC600T-XX). They are available in SC600Y-EM*/ SC600T-EM*, SC600Y-NA*/ SC600T-NA*, SC600Y-JP*/ SC600T-JP*, SC600Y-WF*/ SC600T-WF*. The following table shows the supported frequency bands of SC600Y&SC600T. Table 1: SC600Y-EM*/SC600T-EM* Frequency Bands Type LTE-FDD LTE-TDD WCDMA TD-SCDMA EVDO/CDMA GSM Frequency Bands B1/B2/B3/B4/B5/B7/B8/B20/B28A/B28B B38/B39/B40/B41 B1/B2/B4/B5/B8

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850/900/1800/1900MHz SC600Y&SC600T_Hardware_Design 16 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Wi-Fi 802.11a/b/g/n/ac 2402MHz~2482MHz; 5180MHz~5825MHz BT4.2 LE GNSS 2402MHz~2480MHz GPS: 1575.42MHz1.023MHz GLONASS: 1597.5MHz~1605.8MHz BeiDou: 1561.098MHz2.046MHz Table 2: SC600Y-NA*/SC600T-NA* Frequency Bands Type LTE-FDD LTE-TDD WCDMA TD-SCDMA EVDO/CDMA GSM Frequency Bands B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71 B41 B2/B4/B5

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Wi-Fi 802.11a/b/g/n/ac 2402MHz~2482MHz; 5180MHz~5825MHz BT4.2 LE GNSS 2402MHz~2480MHz GPS: 1575.42MHz1.023MHz GLONASS: 1597.5MHz~1605.8MHz BeiDou: 1561.098MHz2.046MHz Table 3: SC600Y-JP*/SC600T-JP* Frequency Bands Type LTE-FDD LTE-TDD WCDMA TD-SCDMA EVDO/CDMA GSM Frequency Bands B1/B3/B5/B8/B11/B18/B19/B21/B26/B28A/B28B B41 B1/B6/B8/B19

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SC600Y&SC600T_Hardware_Design 17 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Wi-Fi 802.11a/b/g/n/ac 2402MHz~2482MHz; 5180MHz~5825MHz BT4.2 LE GNSS 2402MHz~2480MHz GPS: 1575.42MHz1.023MHz GLONASS: 1597.5MHz~1605.8MHz BeiDou: 1561.098MHz2.046MHz Table 4: SC600Y-WF*/SC600T-WF* Frequency Bands Type LTE-FDD LTE-TDD WCDMA TD-SCDMA EVDO/CDMA GSM Frequency Bands

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Wi-Fi 802.11a/b/g/n/ac 2402MHz~2482MHz; 5180MHz~5825MHz 2402MHz~2480MHz

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BT4.2 LE GNSS NOTE

* means under development. SC600Y&SC600T are SMD-type modules which can be embedded into applications through its 323 pins

(including 152 LCC pads and 171 LGA pads). With a compact profile of 43.0mm 44.0mm 2.85mm, SC600Y&SC600T can meet almost all requirements for M2M applications such as smart metering, smart home, security, routers, wireless POS, mobile computing devices, PDA phone, tablet PC, etc. SC600Y&SC600T_Hardware_Design 18 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 2.2. Key Features The following table describes the detailed features of SC600Y&SC600T modules. Table 5: SC600Y&SC600T Key Features Features Details SC600Y-XX Octa-core ARM Cortex-A53 64-bit CPU @1.8GHz Two quad-core processors with 512KB L2 cache Application Processor SC600T-XX Octa-core ARM Cortex-A53 64-bit CPU @2.0GHz (high performance) Modem system GPU Memory One quad-core with 1MB L2 cache One quad-core with 512KB L2 cache Hexagon DSP v56 core up to 850MHz 768KB L2 cache SC600Y-XX AdrenoTM 506 with 64-bit addressing, designed for 600MHz SC600T-XX AdrenoTM 506 with 64-bit addressing, designed for 650MHz 16GB eMMC + 2GB LPDDR3 (default) 32GB eMMC + 4GB LPDDR3 (optional) Operating System Android OS 9.0 Power Supply VBAT Supply Voltage: 3.55V~4.4V Typical: 3.8V Class 4 (33dBm2dB) for GSM850 Class 4 (33dBm2dB) for EGSM900 Class 1 (30dBm2dB) for DCS1800 Class 1 (30dBm2dB) for PCS1900 Class E2 (27dBm3dB) for GSM850 8-PSK Class E2 (27dBm3dB) for EGSM900 8-PSK Transmitting Power Class E2 (26dBm3dB) for DCS1800 8-PSK Class E2 (26dBm3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (24dBm+3/-1dB) for EVDO/CDMA BC0 Class 2 (24dBm+1/-3dB) for TD-SCDMA bands Class 3 (23dBm2dB) for LTE-FDD bands Class 3 (23dBm2dB) for LTE-TDD bands LTE Features Support 3GPP R8 Cat 6* and Cat 4 Support 1.4 to 20MHz RF bandwidth SC600Y&SC600T_Hardware_Design 19 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Support Multiuser MIMO in DL direction Cat 6* FDD: Max 300Mbps (DL)/Max 50Mbps (UL) Cat 6* TDD: Max 265Mbps (DL)/Max 30Mbps (UL) Cat 4 FDD: Max 150Mbps (DL)/Max 50Mbps (UL) Cat 4 TDD: Max 130Mbps (DL)/Max 30Mbps (UL) Support 3GPP R9 DC-HSDPA/DC-HSUPA/HSPA+/HSDPA/HSUPA/WCDMA Support QPSK, 16-QAM and 64-QAM modulation UMTS Features DC-HSDPA: Max 42Mbps (DL) DC-HSUPA: Max 11.2Mbps (UL) WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL) R99 CSD: 9.6kbps, 14.4kbps GPRS Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL), 85.6Kbps (UL) EDGE Support EDGE multi-slot class 33 (33 by default) GSM Features Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL), 236.8Kbps (UL) WLAN Features 2.4GHz/5GHz, support 802.11a/b/g/n/ac, maximally up to 433Mbps Support AP and STA mode Bluetooth Features BT4.2 LE GNSS Features GPS/GLONASS/BeiDou SMS Text and PDU mode Point-to-point MO and MT SMS cell broadcast LCM Interfaces Support two groups of 4-lane MIPI_DSI Support dual LCDs Support WUXGA up to (19201200) at 60fps Provide one high voltage output for powering a string of WLEDs Provide four drivers for sinking the current from WLED strings, and each sink current can reach up to 25mA Support three groups of 4-lane MIPI_CSI, up to 2.1Gbps per lane Support 3 cameras (4-lane + 4-lane + 4-lane) or 4 cameras (4-lane + 4-lane +

Camera Interfaces SC600Y-XX 2-lane + 1-lane) up to 21MP with dual ISP SC600T-XX up to 24MP with dual ISP SC600Y&SC600T_Hardware_Design 20 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Video Codec Audio Interfaces Audio Codec SC600Y-XX Video encoding and decoding: up to 1080P @60fps Wi-Fi Video: encoding up to 1080P @30fps; decoding up to 1080P @60fps SC600T-XX Video encoding and decoding: up to 4K @30fps, up to 1080P @60fps Wi-Fi Video: encoding up to 1080P @30fps; decoding up to 1080P @60fps Audio Input Three analog microphone inputs, integrating internal bias voltage Audio Output Class AB stereo headphone output Class AB earpiece differential output Class D speaker differential amplifier output G711, QCELP, EVRC, EVRC-B, EVRC-WB, AMR-NB, AMR-WB, GSM-EFR, GSM-FR, GSM-HR Support with USB 3.0 or 2.0 specifications, with transmission rates up to 5Gbps on USB 3.0 and 480Mbps on USB 2.0. USB Interface Support USB OTG Used for AT command communication, data transmission, software debugging and firmware upgrade 4 UART Interfaces: UART5, UART6, UART4 and UART2 UART5 & UART6: 4-wire UART interface with RTS/CTS hardware flow UART Interfaces control, baud rate up to 4Mbps UART4: 2-wire UART interface UART2: 2-wire UART interface used for debugging Vibrator drive interface Drive ERM vibrator SD Card Interface Support SD 3.0 Support SD card hot-plug 2 (U)SIM interfaces

(U)SIM Interfaces Support USIM/SIM card: 1.8V/2.95V Support Dual SIM Dual Standby (supported by default) I2C Interfaces Five I2C interfaces, used for peripherals such as TP, camera, sensor, etc. I2S Interface Support for I2S peripherals 2 high current Flash and torch LED driver Flashlight Interface 1A each for Flash mode and 300mA each for torch mode by default 1.5A each for Flash mode and 300mA each for torch mode maximally ADC Interfaces 2 general purpose ADC interfaces Support up to 15-bit sampling accuracy SPI Interfaces One SPI interface used for peripheral device Two SPI interfaces, only support master mode One SPI interface used for sensor application, such as fingerprint sensors SC600Y&SC600T_Hardware_Design 21 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Charging Interface Used for battery voltage detection, fuel gauge, battery temperature detection Real Time Clock Supported Antenna Interfaces Main antenna, Rx-diversity antenna, GNSS antenna and Wi-Fi/BT antenna interfaces Size: (43.00.15)mm (44.00.15)mm (2.850.2)mm Physical Characteristics Package: LCC + LGA Weight: approx. 13.0g Temperature Range Operating temperature range: -35C ~ +65C 1) Extended temperature range: -40C ~ +75C 2) Storage temperature range: -40C ~ +90C Firmware Upgrade Over USB interface All hardware components are fully compliant with EU RoHS directive RoHS NOTES 1. 1) Within operation temperature range, the module is 3GPP compliant. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. 3. * means under development. SC600Y&SC600T_Hardware_Design 22 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 2.3. Functional Diagram The following figure shows a block diagram of SC600Y&SC600T and illustrates the major functional parts. Power management Radio frequency Baseband LPDDR3+eMMC flash Peripheral interfaces

-- USB interface

-- (U)SIM interfaces

-- UART interfaces

-- SD card interface

-- I2C interfaces

-- ADC interfaces

-- LCM (MIPI) interfaces

-- TP (touch panel) interfaces

-- Camera (MIPI) interfaces

-- Audio interfaces Figure 1: Functional Diagram SC600Y&SC600T_Hardware_Design 23 / 128 BasebandTranceiverWCNLPDDReMMCUSB_VBUSBatteryFlashWLEDMotorChargeOTG BoostDIPXOANT_GNSSANT_WiFi/BTGPIOsI2CSD 3.0UART 2(U)SIMUSB2.0/3.03CAM2TP2LCM2SPIEARSPKMICsADCsHK ADCFlashHapticsRFCLKBBCLKMEMMultimediaConnectivityAir InterfacePorcessorsCodecPowerSignalPowerFunctionSAW48MHz5G FEMDuplexsPAPAMSAWLNASAWSAWSwitchSAWANT_DRXANT_MAIN19.2MXOPMUHK ADC &MPPsPWMHeadsetVRTCVBATAPTVDD_RFLEDPWRKEYPMIC1SD_LDO11USIM1_VDDUSIM2_VDDLDO6_1P8LDO5_1P8SD_LDO12LDO22_2P8LDO10_2P8LDO17_2P85LDO23_1P2LDO2_1P1I2SWLED ICVPH_PWR Smart LTE Module Series SC600Y&SC600T Hardware Design 2.4. Evaluation Board In order to help customers develop applications with SC600Y&SC600T conveniently, Quectel supplies the evaluation board, USB to RS232 converter cable, USB Type-C data cable, power adapter, earphone, antenna and other peripherals to control or test the module. For more details, please refer to document

[1]. SC600Y&SC600T_Hardware_Design 24 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 3 Application Interfaces 3.1. General Description SC600Y&SC600T are equipped with 323-pin 1.0mm pitch SMT pads that can be embedded into cellular application platform. The following chapters provide the detailed description of pins/interfaces listed below. Power supply VRTC interface Charging interface USB interface UART interfaces

(U)SIM interfaces SD card interface GPIO interfaces I2C interfaces I2S interfaces SPI interfaces ADC interfaces Vibrator drive interface LCM interfaces TP (touch panel) interfaces Camera interfaces Flashlight interfaces Sensor interfaces Audio interfaces Emergency download interface SC600Y&SC600T_Hardware_Design 25 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of SC600Y&SC600T modules. Figure 2: Pin Assignment (Top View) SC600Y&SC600T_Hardware_Design 26 / 128 313314315316317318319306307308309310311312299300301302303304305292293294295296297298285286287288289290291278279280281282283284271272273274275276277264265266268269270267257258259261262263260123456789101112131415161718192021222339414243444546474849515253544050555657585960616263643233213222425262729283031323334353637386566676869707172737475767778798081828384858687888990919293949596979899100101102103104105106107109111112113114115116117118120121122123124125126128129130131132133134135136137138139141142143144145146147148149150151152127140153154155156157158159160161162163164165166119GNDPOWERAUDIOUSB(U)SIMSDTPLCMCAMERAANTUARTGPIORESERVEDOTHERS108110182183184185186187188189190191192193194195211212213214215216217218219220221244243242241240239238237236235234200201202203204205206207208209210196197198199246247248249250251252253254255256245177176175174173172171170169168167181180179178232231230229228227226225224223222233320 Smart LTE Module Series SC600Y&SC600T Hardware Design 3.3. Pin Description Table 6: I/O Parameters Definition Type IO DI DO PI PO AI AO OD Description Bidirectional Digital input Digital output Power input Power output Analog input Analog output Open drain The following tables show the SC600Y&SC600Ts pin definitions and electrical characteristics. Table 7: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT 36, 37, 38 PI/PO Power supply for the module Vmax=4.4V Vmin=3.55V Vnorm=3.8V VDD_RF 1, 2 PO Connect to external bypass capacitors to eliminate voltage fluctuation of RF part. VOmax=4.4V VOmin=3.55V VOnorm=3.8V It must be able to provide sufficient current up to 3.0A. It is suggested to use a TVS to increase voltage surge withstand capability. Do not load externally. VPH_PWR 220, 221 PO Power supply for peripheral Vmax=4.4V Vmin=3.55V It can provide a maximum continuous SC600Y&SC600T_Hardware_Design 27 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Vnorm=3.8V current of 1A approximately. VRTC 16 PI/PO Power supply for VOmax=3.2V internal RTC circuit VI=2.0V~3.25V LDO5_1P8 9 PO 1.8V output power Vnorm=1.8V external GPIOs pull supply IOmax=20mA up circuits and level Power supply for LDO10_2P8 11 PO 2.8V output power Vnorm=2.8V supply IOmax=150mA shift circuit. Power supply for VDD of sensors and TPs. Add a 1.0uF~4.7uF bypass capacitor if used. If unused, keep this pin open. Power supply for I/O VDD of cameras, LCDs and sensors. LDO6_1P8 10 PO 1.8V output power Vnorm=1.8V Add a 1.0uF~2.2uF supply IOmax=300mA bypass capacitor if LDO17_2P85 12 PO 2.85V output power Vnorm=2.85V supply IOmax=300mA used. If unused, keep this pin open. Power supply for cameras and LCDs. Add a 1.0uF~4.7uF bypass capacitor if used. If unused, keep this pin open. Power supply for DVDD of front cameras. LDO23_1P2 15 PO 1.2V output power Vnorm=1.2V Add a 1.0uF~2.2uF supply IOmax=600mA bypass capacitor if LDO2_1P1 13 PO 1.1V output power Vnorm=1.1V supply IOmax=1200mA used. If unused, keep this pin open. Power supply for DVDD of rear cameras. Add a 1.0uF~2.2uF bypass capacitor if SC600Y&SC600T_Hardware_Design 28 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design LDO22_2P8 14 PO 2.8V output power Vnorm=2.8V supply IOmax=150mA used. If unused, keep this pin open. Power supply for AVDD of cameras. Add a 1.0uF~4.7uF bypass capacitor if used. If unused, keep this pin open. GND 3, 4, 18, 20, 31, 34, 35, 40, 43, 47, 56, 62, 87, 98, 101, 112, 125, 128, 130, 133, 135, 148, 150, 159, 163, 170, 173, 176, 182, 193, 195, 219, 225, 243, 257~323 Ground Audio Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment MIC_BIAS 167 AO Microphone bias voltage VO=1.6V~2.85V MIC1_P MIC1_N 44 45 AI AI MIC_GND 168 MIC2_P 46 AI Microphone positive input for channel 1 Microphone negative input for channel 1 Microphone reference ground Microphone positive input for headset If unused, connect this pin to the ground. SC600Y&SC600T_Hardware_Design 29 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design MIC3_P 169 AI EAR_P EAR_N SPK_P SPK_N HPH_R 53 52 55 54 51 AO AO AO AO AO HPH_REF 50 AI HPH_L 49 AO HS_DET 48 AI USB Interface Microphone positive input for channel 3 Earpiece positive output Earpiece negative output Speaker positive output Speaker negative output Headphone right channel output Headphone reference ground Headphone left channel output Headset insertion detection Pulled up internally. Pin Name Pin No. I/O Description DC Characteristics Comment PI/

PO IO IO AI AI AI USB_VBUS 41, 42 USB_DM 33 32 30 171 172 USB_DP USB_ID USB_SS_RX _P USB_SS_RX _M USB_SS_TX _P USB_SS_TX _M 174 AO 175 AO Charging power input. Power supply output for OTG device. USB/charger insertion detection. USB 2.0 differential Vmax=10V Vmin=4.0V Vnorm=5.0V data bus (minus) USB 2.0 standard 90 differential USB 2.0 differential compliant impedance. data bus (plus) USB ID detection High level by default. USB 3.0 differential receive (plus) USB 3.0 differential receive (minus) USB 3.0 standard USB 3.0 differential compliant transmit (plus) USB 3.0 differential transmit (minus) 90 differential impedance. 90 differential impedance. USBC_CC2 223 AI/

USB Type-C control SC600Y&SC600T_Hardware_Design 30 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design AO configuration USBC_CC1 224 AI/

AO USB_SS_SEL 226 DO USB_OPT 217 AI

(U)SIM Interfaces channel 2 USB Type-C control configuration channel 1 USB Type-C switch control Type-C/ Micro USB select control Float, select Type-C. Connect 1K to GND, select Micro USB. Pin Name Pin No. I/O Description DC Characteristics Comment USIM1_DET 145 DI

(U)SIM1 card VILmax=0.63V hot-plug detection VIHmin=1.17V USIM1_RST 144 DO USIM1_CLK 143 DO

(U)SIM1 card reset signal

(U)SIM1 card clock signal USIM1_DATA 142 IO

(U)SIM1 card data signal USIM1_VDD 141 PO

(U)SIM1 card power supply VOLmax=0.4V VOHmin=

0.8 USIM1_VDD VOLmax=0.4V VOHmin=

0.8 USIM1_VDD VILmax=

0.2 USIM1_VDD VIHmin=

0.7 USIM1_VDD VOLmax=0.4V VOHmin=

0.8 USIM1_VDD 1.8V (U)SIM:

Vmax=1.85V Vmin=1.75V Active Low. Require external pull-up to 1.8V. If unused, keep this pin open. Disabled by default, and can be enabled through software configuration. Either 1.8V or 2.95V

(U)SIM card is 2.95V (U)SIM:

supported. Vmax=3.1V Vmin=2.8V SC600Y&SC600T_Hardware_Design 31 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design USIM2_DET 256 DI

(U)SIM2 card VILmax=0.63V detection VIHmin=1.17V USIM2_RST 207 DO USIM2_CLK 208 DO

(U)SIM2 card reset signal

(U)SIM2 card clock signal USIM2_DATA 209 IO

(U)SIM2 card data signal USIM2_VDD 210 PO

(U)SIM2 card power supply VOLmax=0.4V VOHmin=

0.8 USIM2_VDD VOLmax=0.4V VOHmin=

0.8 USIM2_VDD VILmax=

0.2 USIM2_VDD VIHmin=

0.7 USIM2_VDD VOLmax=0.4V VOHmin=

0.8 USIM2_VDD 1.8V (U)SIM:

Vmax=1.85V Vmin=1.75V Active Low. Need external pull-up to 1.8V. If unused, keep this pin open. Disabled by default, and can be enabled through software configuration. Either 1.8V or 2.95V

(U)SIM card is 2.95V (U)SIM:

supported. Vmax=3.1V Vmin=2.8V UART Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment UART2_TXD 5 DO UART2_RXD 6 DI UART4_TXD 7 DO UART2 transmit data. VOLmax=0.45V Debug port by VOHmin=1.35V default. UART2 receive data. VILmax=0.63V Debug port by VIHmin=1.17V default. UART4 transmit VOLmax=0.45V data VOHmin=1.35V 1.8V power domain. If unused, keep these pins open. SC600Y&SC600T_Hardware_Design 32 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design UART4_RXD 8 DI UART4 receive data UART5_RXD 198 DI UART5 receive data VILmax=0.63V VIHmin=1.17V VILmax=0.63V VIHmin=1.17V UART5_TXD 199 DO UART5_RTS 245 DO UART5_CTS 246 DI SD Card Interface UART5 transmit VOLmax=0.45V data VOHmin=1.35V UART5 request to VOLmax=0.45V send VOHmin=1.35V UART5 clear to VILmax=0.63V send VIHmin=1.17V Pin Name Pin No. I/O Description DC Characteristics Comment 1.8V SD card:

VOLmax=0.45V High speed digital VOHmin=1.4V SD_CLK 70 DO clock signal of SD card SD_CMD 69 IO Command signal of SD card SD_DATA0 68 IO High speed 2.95V SD card:

VOLmax=0.37V VOHmin=2.2V 1.8V SD card:

VILmax=0.58V VIHmin=1.27V VOLmax=0.45V VOHmin=1.4V 2.95V SD card:

VILmax=0.73V VIHmin=1.84V VOLmax=0.37V VOHmin=2.2V 1.8V SD card:

VILmax=0.58V VIHmin=1.27V VOLmax=0.45V SD_DATA1 67 IO signal lines of SD bidirectional digital VOHmin=1.4V SD_DATA2 66 IO card 2.95V SD card:

VILmax=0.73V VIHmin=1.84V VOLmax=0.37V SC600Y&SC600T_Hardware_Design 33 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design SD_DATA3 65 IO VOHmin=2.2V SD_DET 64 DI SD card insertion VILmax=0.63V detection VIHmin=1.17V Active low. SD_LDO11 63 PO Power supply for SD Vnorm=2.95V card IOmax=800mA SD_LDO12 179 PO 1.8V/2.95V output Vnorm=1.8V/2.95V Power supply for SD IOmax=50mA cards pull-up circuit. TP (Touch Panel) Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment TP0_RST 138 DO Reset signal of VOLmax=0.45V 1.8V power domain. touch panel (TP0) VOHmin=1.35V Active low. TP0_INT 139 DI Interrupt signal of VILmax=0.63V touch panel (TP0) VIHmin=1.17V TP0_I2C_SCL 140 OD TP0_I2C_SDA 206 OD I2C clock signal of touch panel (TP0) I2C data signal of touch panel (TP0) 1.8V power domain. 1.8V power domain. 1.8V power domain. TP1_RST 136 DO Reset signal of VOLmax=0.45V 1.8V power domain. touch panel (TP1) VOHmin=1.35V Active low. TP1_INT 137 DI Interrupt signal of VILmax=0.63V touch panel (TP1) VIHmin=1.17V TP1_I2C_SDA 204 OD TP1_I2C_SCL 205 OD I2C data signal of touch panel (TP1) I2C clock signal of touch panel (TP1) LCM Interfaces 1.8V power domain. 1.8V power domain. 1.8V power domain. Pin Name Pin No. I/O Description DC Characteristics Comment LCD_BL_A 21 PO LCD_BL_K1 22 LCD_BL_K2 23 AI AI Current output for LCD backlight Current sink for LCD backlight Current sink for LCD backlight SC600Y&SC600T_Hardware_Design 34 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design LCD_BL_K3 24 LCD_BL_K4 25 AI AI Current sink for LCD backlight Current sink for LCD backlight PMU_MPP4 152 DO PWM signal output LCD0_RST 127 DO LCD0 reset signal VOLmax=0.45V VOHmin=1.35V 1.8V power domain. Active low. LCD0_TE 126 DI LCD0 tearing effect VILmax=0.63V signal VIHmin=1.17V 1.8V power domain. LCD1_RST 113 DO LCD1 reset signal VOLmax=0.45V VOHmin=1.35V 1.8V power domain. Active low. LCD1_TE 114 DI LCD1 tearing effect VILmax=0.63V signal VIHmin=1.17V 1.8V power domain. DSI0_CLK_N 116 AO DSI0_CLK_P 115 AO DSI0_LN0_N 118 AO DSI0_LN0_P 117 AO DSI0_LN1_N 120 AO DSI0_LN1_P 119 AO DSI0_LN2_N 122 AO DSI0_LN2_P 121 AO DSI0_LN3_N 124 AO DSI0_LN3_P 123 AO DSI1_CLK_N 103 AO DSI1_CLK_P 102 AO LCD0 MIPI clock signal (negative) LCD0 MIPI clock signal (positive) LCD0 MIPI lane 0 data signal (negative) LCD0 MIPI lane 0 data signal (positive) LCD0 MIPI lane 1 data signal (negative) LCD0 MIPI lane 1 data signal (positive) LCD0 MIPI lane 2 data signal (negative) LCD0 MIPI lane 2 data signal (positive) LCD0 MIPI lane 3 data signal (negative) LCD0 MIPI lane 3 data signal (positive) LCD1 MIPI clock signal (negative) LCD1 MIPI clock signal (positive) DSI1_LN0_N 105 AO LCD1 MIPI lane 0 SC600Y&SC600T_Hardware_Design 35 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design data signal (negative) LCD1 MIPI lane 0 data signal (positive) LCD1 MIPI lane 1 data signal (negative) LCD1 MIPI lane 1 data signal (positive) LCD1 MIPI lane 2 data signal (negative) LCD1 MIPI lane 2 data signal (positive) LCD1 MIPI lane 3 data signal (negative) LCD1 MIPI lane 3 data signal (positive) DSI1_LN0_P 104 AO DSI1_LN1_N 107 AO DSI1_LN1_P 106 AO DSI1_LN2_N 109 AO DSI1_LN2_P 108 AO DSI1_LN3_N 111 AO DSI1_LN3_P 110 AO Camera Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment CSI0_CLK_N 89 AI rear camera MIPI clock signal of CSI0_CLK_P 88 AI

(negative) MIPI clock signal of rear camera (positive) MIPI lane 0 data CSI0_LN0_N 91 AI signal of rear camera CSI0_LN0_P 90 AI signal of rear camera

(negative) MIPI lane 0 data

(positive) MIPI lane 1 data CSI0_LN1_N 93 AI signal of rear camera

(negative) MIPI lane 1 data CSI0_LN1_P 92 AI signal of rear camera CSI0_LN2_N 95 AI signal of rear camera

(positive) MIPI lane 2 data

(negative) MIPI lane 2 data CSI0_LN2_P 94 AI signal of rear camera

(positive) SC600Y&SC600T_Hardware_Design 36 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design CSI0_LN3_N 97 AI signal of rear camera MIPI lane 3 data

(negative) MIPI lane 3 data CSI0_LN3_P 96 AI signal of rear camera

(positive) MIPI clock signal of CSI1_CLK_N 184 AI depth camera

(negative) MIPI clock signal of CSI1_CLK_P 183 AI depth camera CSI1_LN0_N 186 AI signal of depth

(positive) MIPI lane 0 data camera (negative) MIPI lane 0 data CSI1_LN0_P 185 AI signal of depth CSI1_LN1_N 188 AI signal of depth camera (positive) MIPI lane 1 data CSI1_LN1_P 187 AI signal of depth camera (negative) MIPI lane 1 data CSI1_LN2_N 190 AI signal of depth camera (positive) MIPI lane 2 data camera (negative) MIPI lane 2 data CSI1_LN2_P 189 AI signal of depth camera (positive) MIPI lane 3 data CSI1_LN3_N 192 AI signal of depth camera (negative) MIPI lane 3 data CSI1_LN3_P 191 AI signal of depth camera (positive) MIPI clock signal of CSI2_CLK_N 78 AI front camera

(negative) Can be multiplexed into differential data of the fourth camera

(negative). Can be multiplexed into differential data of the fourth camera

(positive). Can be multiplexed into differential clock of the fourth camera

(negative). Can be multiplexed into differential clock of the fourth camera

(positive). SC600Y&SC600T_Hardware_Design 37 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design CSI2_CLK_P 77 AI front camera MIPI clock signal of

(positive) MIPI lane 0 data CSI2_LN0_N 80 AI signal of front camera CSI2_LN0_P 79 AI signal of front camera

(negative) MIPI lane 0 data

(positive) MIPI lane 1 data CSI2_LN1_N 82 AI signal of front camera

(negative) MIPI lane 1 data CSI2_LN1_P 81 AI signal of front camera

(positive) MIPI lane 2 data CSI2_LN2_N 84 AI signal of front camera

(negative) MIPI lane 2 data CSI2_LN2_P 83 AI signal of front camera

(positive) MIPI lane 3 data CSI2_LN3_N 86 AI signal of front camera

(negative) MIPI lane 3 data CSI2_LN3_P 85 AI signal of front camera

(positive) MCAM_MCLK 99 DO Master clock signal of VOLmax=0.45V rear camera VOHmin=1.35V 1.8V power domain. SCAM_MCLK 100 DO Master clock signal of VOLmax=0.45V front camera VOHmin=1.35V 1.8V power domain. MCAM_RST 74 DO Reset signal of rear VOLmax=0.45V camera VOHmin=1.35V 1.8V power domain. MCAM_PWDN 73 DO Power down signal of VOLmax=0.45V rear camera VOHmin=1.35V 1.8V power domain. SCAM_RST 72 DO Reset signal of front VOLmax=0.45V camera VOHmin=1.35V 1.8V power domain. SCAM_PWDN 71 DO Power down signal of VOLmax=0.45V front camera VOHmin=1.35V 1.8V power domain. SC600Y&SC600T_Hardware_Design 38 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design CAM_I2C_SCL 75 OD CAM_I2C_SDA 76 OD I2C clock signal of camera I2C data signal of camera 1.8V power domain. 1.8V power domain. DCAM_MCLK 194 DO CAM4_MCLK 236 DO DCAM_RST 180 DO DCAM_PWDN 181 DO Master clock signal of VOLmax=0.45V depth camera VOHmin=1.35V Master clock signal of VOLmax=0.45V fourth camera VOHmin=1.35V Reset signal of depth VOLmax=0.45V camera VOHmin=1.35V Power down signal of VOLmax=0.45V depth camera VOHmin=1.35V DCAM_I2C_ SDA DCAM_I2C_ SCL 197 OD 196 OD I2C data signal of depth camera I2C clock signal of depth camera Keypad Interfaces 1.8V power domain. 1.8V power domain. Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 39 DI Turn on/off the module VILmax=0.63V VIHmin=1.17V Pull-up to 1.8V internally. Active low. VOL_UP 146 DI Volume up VOL_ DOWN 147 DI Volume down SENSOR_I2C Interfaces VILmax=0.63V VIHmin=1.17V If unused, keep this pin open. VILmax=0.63V VIHmin=1.17V If unused, keep this pin open. Pin Name Pin No. I/O Description DC Characteristics Comment SENSOR_I2C_ SCL SENSOR_I2C_ SDA ADC Interfaces 131 OD 132 OD I2C clock signal of external sensors I2C data signal of external sensors 1.8V power domain. 1.8V power domain. Pin Name Pin No. I/O Description DC Characteristics Comment PMI_ADC 153 AI General purpose ADC interface Maximum input voltage: 1.5V. SC600Y&SC600T_Hardware_Design 39 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design PMU_MPP2 151 AI General purpose ADC interface Maximum input voltage: 1.7V. Charging Interface Pin Name Pin No. I/O Description DC Characteristics Comment BAT_PLUS 27 AI BAT_MINUS 28 AI Antenna Interfaces Differential input signal of battery voltage detection

(plus) Differential input signal of battery voltage detection

(minus) Must be connected. Must be connected. Pin Name Pin No. I/O Description DC Characteristics Comment ANT_MAIN 19 ANT_DRX 149 ANT_GNSS 134 IO AI AI ANT_WIFI/BT 129 IO GPIO Interfaces Main antenna interface Diversity antenna interface GNSS antenna interface Wi-Fi/BT antenna interface 50 impedance Pin Name Pin No. I/O Description DC Characteristics Comment GPIO_0 GPIO_1 GPIO_2 GPIO_3 GPIO_33 GPIO_36 GPIO_42 GPIO_43 248 247 201 200 238 237 252 253 IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO VILmax=0.63V VIHmin=1.17V VOLmax=0.45V VOHmin=1.4V SC600Y&SC600T_Hardware_Design 40 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design GPIO_44 GPIO_45 GPIO_66 GPIO_89 GPIO_90 GPIO_96 GPIO_97 GPIO_98 GPIO_99 254 255 234 232 231 230 229 177 178 IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO IO GPIO GPIO_105 242 IO GRFC1 GPIO_107 241 IO GRFC2 SPI Interfaces GRFC is only used for RF Tuner control. Pin Name Pin No. I/O Description DC Characteristics Comment SPI_CS SPI_CLK 58 59 DO DO Chip selection signal of SPI interface Clock signal of SPI interface SPI_MOSI 60 DO SPI_MISO 61 DI FP_SPI_CS 203 DO FP_SPI_CLK 250 DO FP_SPI_MOSI 249 DO FP_SPI_MISO 251 DI Vibrator Drive Interface Master out slave in of SPI interface Master in salve out of SPI interface Chip selection signal of SPI interface Clock signal of SPI interface Master out slave in of SPI interface Master in salve out of SPI interface Can be multiplexed into UART6_CTS. Can be multiplexed into UART6_RTS. Can be multiplexed into UART6_TXD. Can be multiplexed into UART6_RXD. Can be multiplexed into I2S_WS. Can be multiplexed into I2S_SCK. Can be multiplexed into I2S_D0. Can be multiplexed into I2S_D1. Pin Name Pin No. I/O Description DC Characteristics Comment VIB_GND 160 AI Vibrator GND Connected to the SC600Y&SC600T_Hardware_Design 41 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design

(negative) VIB_DRV 161 AO Vibrator drive

(positive) Flashlight Interfaces negative terminal of vibrator. Connected to the positive terminal of vibrator. Pin Name Pin No. I/O Description DC Characteristics Comment FLASH_LED1 26 AO FLASH_LED2 162 AO Emergency Download Interface Flash/torch current driver output Flash/torch current driver output Support flash and torch modes. Pin Name Pin No. I/O Description DC Characteristics Comment USB_BOOT 57 DI enter into emergency Force the module to download mode Pulled up to LDO5_1P8 during power-up will force the module to enter into emergency download mode. Other Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment BAT_ID 17 AI Battery type detection BAT_THERM 29 AI Battery temperature detection GNSS_LNA_EN 202 DO LNA enable control S1A S1B S2A S2B 215 216 211 233 S1A and S1B are connected together in the module S2A and S2B are connected together in the module Reserved Interface If unused, keep this pin open. Internally pulled up. Externally connected to GND via a 47K NTC resistor. For test purpose only. If unused, keep this pin open. SC600Y&SC600T_Hardware_Design 42 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Pin Name Pin No. I/O Description DC Characteristics Comment 154, 155, 156, 157, 158, 164, 165, 166, 212, 213, 214, 218, 222, 235, 239, 240, RESERVED Reserved pins Keep these pins open. 3.4. Power Supply 3.4.1. Power Supply Pins SC600Y&SC600T provide 3 VBAT pins , 2 VDD_RF pins and 2 VPH_PWR pins. VBAT pins are dedicated for connection with an external power supply. VDD_RF pins are designed for modules RF part, and are used to connect bypass capacitors so as to eliminate voltage fluctuation of RF part. VPH_PWR pins can supply power for peripherals, and it can provide a maximum continuous current of 1A approximately. 3.4.2. Decrease Voltage Drop The power supply range of the module is from 3.55V to 4.4V, and the recommended value is 3.8V. The power supply performance, such as load capacity, voltage ripple, etc. directly influences the modules performance and stability. Under ultimate conditions, the module may have a transient peak current up to 3A. If the power supply capability is not sufficient, there will be voltage drops, and if the voltage drops below 3.1V, the module will be powered off automatically. Therefore, please make sure the input voltage will never drop below 3.1V. Figure 3: Voltage Drop Sample SC600Y&SC600T_Hardware_Design 43 / 128 3.1VVoltage3.8VInput current3A Smart LTE Module Series SC600Y&SC600T Hardware Design To decrease voltage drop, a bypass capacitor of about 100F with low ESR (ESR=0.7) should be used, and a multi-layer ceramic chip capacitor (MLCC) array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and place these capacitors close to VBAT/VDD_RF/VPH_PWR pins. The width of VBAT trace should be no less than 3mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to get a stable power source, it is suggested to use a 0.5W TVS and place it as close to the VBAT pins as possible to increase voltage surge withstand capability. The following figure shows the structure of the power supply. Figure 4: Star Structure of Power Supply 3.4.3. Reference Design for Power Supply The power design for the module is very important, as the performance of module largely depends on the power source. The power supply of SC600Y&SC600T should be able to provide sufficient current up to 3A at least. By default, it is recommended to use a battery to supply power for SC600Y&SC600T. But if battery is not intended to be used, it is recommended to use a regulator for SC600Y&SC600T. If the voltage difference between the input and output is not too high, it is suggested to use an LDO to supply power for the module. If there is a big voltage difference between the input source and the desired output

(VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5V input power source which adopts an LDO

(MIC29502WU) from MICROCHIP. The typical output voltage is 3.8V and the maximum rated current is 5.0A. SC600Y&SC600T_Hardware_Design 44 / 128 ModuleVPH_PWRVBATVBATC1100uFC6100nFC733pFC810pF++C2100nFC5NMC333pFC410pFD1VDD_RFVPH_PWRC10100nFC1133pFC1210pFC9+NM Smart LTE Module Series SC600Y&SC600T Hardware Design Figure 5: Reference Circuit of Power Supply NOTES 1. It is recommended to switch off the power supply for module in abnormal state, and then switch on the power to restart the module. 2. The module supports battery charging function by default. If the above power supply design is adopted, please make sure the charging function is disabled by software, or connect VBAT to Schottky diode in series to avoid the reverse current to the power supply chip. 3. When the battery power is reduced to 0%, the system will trigger automatic shutdown, so the design of power supply should be consistent with the configuration of fuel gauge driver. 3.5. Turn on and off Scenarios 3.5.1. Turn on Module Using the PWRKEY The module can be turned on by driving PWRKEY pin to a low level for at least 1.6s. PWRKEY pin is pulled to 1.8V internally. It is recommended to use an open drain/collector driver to control the PWRKEY. A simple reference circuit is illustrated in the following figure. SC600Y&SC600T_Hardware_Design 45 / 128 DC_INC1C2MIC29502WUU1INOUTENGNDADJ24135VBAT 100nFC3470uFC4100nFR2100K47KR3470uF470R51KR4R11%1% Smart LTE Module Series SC600Y&SC600T Hardware Design Figure 6: Turn on the Module Using Driving Circuit Another way to control the PWRKEY is using a button directly. A TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 7: Turn on the Module Using Keystroke SC600Y&SC600T_Hardware_Design 46 / 128 Turn on pulsePWRKEY4.7K47K>1.6sR1R2Q1R31KPWRKEYS1Close to S1TVS1K Smart LTE Module Series SC600Y&SC600T Hardware Design The turning on scenario is illustrated in the following figure. Figure 8: Timing of Turning on Module NOTES 1. The turn-on timing might be different from the above figure when the module powers on for the first time. 2. Make sure that VBAT is stable before pulling down PWRKEY pin. The recommended time between them is no less than 30ms. PWRKEY cannot be pulled down all the time. 3.5.2. Turn off Module Pull down PWRKEY for at least 1s, and then choose to turn off the module when the prompt window comes up. Another way to turn off the module is to drive PWRKEY to a low level for at least 8s. The module will execute forced shutdown. The forced power-down scenario is illustrated in the following figure. SC600Y&SC600T_Hardware_Design 47 / 128 VBAT(Typ.:3.8V)PWRKEY>1.6sOthersLDO5_1P838sLDO6_1P861.2msSoftware controlledLDO17_2P85ActiveLDO10_2P8Note2Software controlled Smart LTE Module Series SC600Y&SC600T Hardware Design Figure 9: Timing of Turning off Module 3.6. VRTC Interface The RTC (Real Time Clock) can be powered by an external power source through VRTC when the module is powered down and there is no power supply for the VBAT. The external power source can be rechargeable battery (such as coil cells) according to application demands. The following reference circuit design when an external battery is utilized for powering RTC. Figure 10: RTC Powered by Coin Cell If RTC is ineffective, it can be synchronized through network after the module is powered on. 2.0V~3.25V input voltage range and 3.0V typical value for VRTC, when VBAT is disconnected. When powered by VBAT, the RTC error is 50ppm. When powered by VRTC, the RTC error is about 200ppm. If the rechargeable battery is used, the ESR of battery should be less than 2K, and it is recommended to use the MS621FE FL11E of SEIKO. SC600Y&SC600T_Hardware_Design 48 / 128 VBATPWRKEYOthers> 8sPower downCoin CellModuleRTC CoreVRTC Smart LTE Module Series SC600Y&SC600T Hardware Design 3.7. Power Output SC600Y&SC600T support output of regulated voltages for peripheral circuits. During application, it is recommended to use parallel capacitors (33pF and 10pF) in the circuit to suppress high frequency noise. Table 8: Power Description Pin Name Default Voltage (V) Drive Current (mA) Idle LDO5_1P8 LDO6_1P8 LDO10_2P8 1.8 1.8 2.8 LDO17_2P85 2.85 LDO2_1P1 LDO22_2P8 LDO23_1P2 1.1 2.8 1.2 SD_LDO12 1.8/2.95 SD_LDO11 2.95 USIM1_VDD 1.8/2.95 USIM2_VDD 1.8/2.95 20 300 150 300 1200 150 600 50 800 50 50 Keep

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3.8. Battery Charge and Management SC600Y&SC600T modules support a fully programmable switch-mode Li-ion battery charge function. It can charge single-cell Li-ion and Li-polymer battery. The battery charger of SC600Y&SC600T modules supports trickle charging, pre-charge, constant current charging and constant voltage charging modes, which optimize the charging procedure for Li-ion batteries. Trickle charging: When the battery voltage is below 2.1V, a 75mA trickle charging current is applied to the battery. Pre-charge: When the battery voltage is charged up and is between 2.1V and 3.0V (the maximum pre-charge voltage is 2.3V~3.0V programmable, 3.0V by default), the system will enter into SC600Y&SC600T_Hardware_Design 49 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design pre-charge mode. The charging current is 450mA (100mA~450mA programmable, 450mA by default). Constant current mode (CC mode): When the battery voltage is increased to between the maximum pre-charge voltage and 4.2V (3.6V~4.5V programmable, 4.2V by default), the system will switch to CC mode. The charging current is programmable from 300mA~3000mA. The default charging current is 500mA for USB charging and 2A for adapter. Constant voltage mode (CV mode): When the battery voltage reaches the final value 4.2V, the system will switch to CV mode and the charging current will decrease gradually. When the charging current reduces to about 100mA, the charging is completed. Table 9: Pin Definition of Charging Interface Pin Name Pin No. I/O Description Comment USB_VBUS 41, 42 PI/PO Power supply output for OTG device. USB/charger insertion detection. Charging power input. VBAT BAT_ID 36, 37, 38 17 PI/PO Power supply for the module AI Battery type detection BAT_PLUS 27 BAT_MINUS 28 AI AI Differential input signal of battery voltage detection (plus) Differential input signal of battery voltage detection (minus) BAT_THERM 29 AI Battery temperature detection Vmax=10V Vmin=4.0V Vnorm=5.0V Vmax=4.4V Vmin=3.55V Vnorm=3.8V If unused, keep this pin open. Must be connected. Must be connected. Internally pulled up. Externally connected to GND via a 47K NTC resistor. SC600Y&SC600T modules support battery temperature detection in the condition that the battery integrates a thermistor

(47K 1% NTC thermistor with B-constant of 4050K by default;

SDNT1608X473F4050FTF of SUNLORD is recommended) and the thermistor is connected to BAT_THERM pin. If BAT_THERM pin is not connected, there will be malfunctions such as boot error, battery charging failure, battery level display error, etc. A reference design for battery charging circuit is shown as below. SC600Y&SC600T_Hardware_Design 50 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Figure 11: Reference Design for Battery Charging Circuit SC600Y&SC600T offer a fuel gauge algorithm that is able to accurately estimate the batterys state by current and voltage monitor techniques. Using precise measurements of battery voltage, current, and temperature, the fuel gauge provides a dependable state of charge estimate throughout the entire life of the battery and across a broad range of operating conditions. It effectively protects the battery from over-discharging, and also allows users to estimate the battery life based on the battery level so as to timely save important data before completely power-down. Mobile devices such as mobile phones and handheld POS systems are powered by batteries. When different batteries are utilized, the charging and discharging curve has to be modified correspondingly so as to achieve the best effect. If thermistor is not available in the battery, or adapter is utilized for powering the module, then there is only a need for VBAT and GND connection. In this case, the system may be unable to detect the battery, which will cause power-on failure. In order to avoid this, BAT_THERM should be connected to GND with a 47K resistor. BAT_PLUS and BAT_MINUS must be connected, otherwise there may be abnormalities in use of the module. Among them, BAT_PLUS and BAT_MINUS are used for battery level detection, and they should be routed as differential pair to ensure accuracy. 3.9. USB Interface SC600Y&SC600T provide one integrated Universal Serial Bus (USB) interface which complies with the USB 3.0/2.0 specifications and supports super speed (5Gbps) on USB 3.0, high speed (480Mbps) on USB 2.0 and full speed (12Mbps) modes. The USB interface supports USB OTG function, and is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface. SC600Y&SC600T_Hardware_Design 51 / 128 GNDBAT_THERMVBAT0R100uFNTCVBAT33pF1uFESDUSB_VBUSAdapter or USBModuleBatteryC1C2C3R1D1D2BAT_PLUSESDBAT_MINUSGND0805 Smart LTE Module Series SC600Y&SC600T Hardware Design Table 10: Pin Definition of USB Interface Pin Name Pin No. I/O Description Charging power input;

Comment Vmax=10V USB_VBUS 41, 42 PI/PO Power supply output for OTG device;

Vmin=4.0V USB_DM USB_DP USB_ID 33 32 30 USB_SS_RX_P 171 USB_SS_RX_M 172 IO IO AI AI AI USB/charger insertion detection. Vnorm=5.0V USB 2.0 USB differential data bus

(minus) Require differential USB 2.0 USB differential data bus impedance of 90

(plus) USB ID detection High level by default USB 3.0 differential receive (plus) USB 3.0 differential receive (minus) Require differential impedance of 90 USB_SS_TX_P 174 AO USB 3.0 differential transmit (plus) USB_SS_TX_M 175 USBC_CC2 223 USBC_CC1 224 AO AI/

AO AI/

AO USB 3.0 differential transmit (minus) USB Type-C control configuration channel 2 USB Type-C control configuration channel 1 USB_SS_SEL 226 DO USB Type-C switch control USB_OPT 217 AI Type-C/ Micro USB select control Connect 1K to GND, select Micro USB. Floatselect Type-C. USB_VBUS can be powered by USB power or adapter. It is used for USB connection detection and power supply input for battery charging. Its input voltage ranges from 4.0V to 10.0V, and the typical value is 5.0V. SC600Y&SC600T modules support charging management for a single cell Li-ion battery, but varied charging parameters should be set for batteries with varied models or capacities. The maximum charging current is up to 3.0A. The module also supports USB On-The-Go (OTG) function, through using USB_ID pin to detect whether the OTG device is attached: when USB_ID is kept open (high level by default), SC600Y&SC600T are in USB slave mode; if USB_ID is connected to ground, it is in OTG mode and USB_VBUS is used to supply power for peripherals with maximum output of 5V/1A. The switch between Type-C and Micro USB is determined by USB_OPT of pin 217. If USB_OPT is floating, It is only need to select Type-C. If USB_OPT connects to GND via 1K, It is only need to select Micro USB . SC600Y&SC600T_Hardware_Design 52 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design The following is a reference design for USB interface:

Figure 12: Micro USB Interface Reference Design Figure 13: USB Type-C Interface Reference Design In order to ensure USB performance, please follow the following principles while designing USB interface. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. Pay attention to the influence of junction capacitance of ESD protection devices on USB data lines. Typically, the capacitance value should be less than 2pF for USB 2.0 and less than 0.5pF for USB 3.0. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. Keep the ESD protection devices as close as possible to the USB connector. Make sure the trace length difference between USB 2.0 DM/DP differential pair and that between USB 3.0 RX/TX differential pairs both do not exceed 0.7mm. SC600Y&SC600T_Hardware_Design 53 / 128 USB_DPUSB_DMUSB_VUSB12345USB_DPUSB_DMVUSBUSB_IDGNDGNDGNDGNDGND6789100nFModuleC1D1D2D3ESDESDESDUSB_IDUSB_OPT 1KR1USB_DP100nFModuleC14SwitchC2C3C4C5A0+A0-A1+A0-B0+B0-B1+B1-C0+C0-C1+C1-SELPDUSB_SS_TX_PUSB_SS_TX_MUSB_SS_RX_PUSB_SS_RX_MUSB_SS_SELR1VDD4.7uFC1VDD_3VTX1+TX1-VBUS_VBUSCC1D+D-RX1-RX1+CC2CC1CC2TX2+TX2-RX2+RX2-USB 3.0C6C7C8C9C10C11C12C13USB_DMUSB_VBUSR1NMUSB_OPT Smart LTE Module Series SC600Y&SC600T Hardware Design Table 11: USB Trace Length Inside the Module Pin No. Signal Length (mm) Length Difference (DP-DM) 33 32 171 172 174 175 USB_DM USB_DP USB_SS_RX_P USB_SS_RX_M USB_SS_TX_P USB_SS_TX_M 39.52 39.07 28.55 28.23 19.58 19.35 3.10. UART Interfaces The module provides the following four UART interfaces:

-0.45 0.32 0.23 UART5: 4-wire UART interface, hardware flow control supported, 1.8V power domain UART6: 4-wire UART interface, hardware flow control supported, multiplexed from SPI interface UART2: 2-wire UART interface, used for debugging UART4: 2-wire UART interface The following table shows the pin definition of UART interfaces. Table 12: Pin Definition of UART Interfaces Pin Name Pin No. I/O Description Comment UART2_TXD 5 UART2_RXD 6 UART4_TXD 7 UART4_RXD 8 UART5_RXD 198 UART5_TXD 199 UART5_CTS 246 DO DI DO DI DI DO DI UART2 transmit data. Debug port by default. UART2 receive data. Debug port by default. UART4 transmit data UART4 receive data UART5 receive data UART5 transmit data UART5 clear to send 1.8V power domain. If unused, keep these pins open. SC600Y&SC600T_Hardware_Design 54 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design UART5_RTS 245 DO UART5 request to send SPI_MISO 61 DI UART6 receive data Can be multiplexed into SPI interface pin by default. UART6_RXD. SPI interface pin by default. SPI_MOSI 60 DO UART6 transmit data Can be multiplexed into UART6_TXD. SPI interface pin by default. SPI_CS 58 DI UART6 clear to send Can be multiplexed into UART6_CTS. SPI interface pin by default. SPI_CLK 59 DO UART6 request to send Can be multiplexed into UART6_RTS. UART5 is a 4-wire UART interface with 1.8V power domain. A level translator chip should be used if customers application is equipped with a 3.3V UART interface. A level translator chip TXS0104EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. Figure 14: Reference Circuit with Level Translator Chip (for UART5) The following figure is an example of connection between SC600Y&SC600T and PC. A voltage level translator and a RS-232 level translator chip are recommended to be added between the module and PC, as shown below:

SC600Y&SC600T_Hardware_Design 55 / 128 VCCAVCCBOEA1A2A3A4GNDB1B2B3B4LDO5_1P8UART5_RTSUART5_RXDUART5_CTSUART5_TXDRXD_3.3VCTS_3.3VTXD_3.3VVDD_3.3VTXS0104EPWRC1100pFC2U1100pFRTS_3.3V Smart LTE Module Series SC600Y&SC600T Hardware Design Figure 15: RS232 Level Match Circuit (for UART5) NOTE UART2, UART4 and UART6 are similar to UART5. Please refer to UART5 reference circuit design for UART2, UART4 and UART6s. 3.11. (U)SIM Interfaces SC600Y&SC600T provide two (U)SIM interfaces which both meet ETSI and IMT-2000 requirements. Dual SIM Dual Standby is supported by default. Both 1.8V and 2.95V (U)SIM cards are supported, and the (U)SIM interfaces are powered by the dedicated low dropout regulators from SC600Y&SC600T modules. Table 13: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description USIM1_DET 145 DI

(U)SIM1 card detection Comment Active Low. Need external pull-up to 1.8V. If unused, keep this pin open. Disabled by default, and can be enabled through software configuration. USIM1_RST 144 DO

(U)SIM1 card reset signal SC600Y&SC600T_Hardware_Design 56 / 128 TXS0104EPWRRXD_3.3VCTS_3.3VVCCAModuleGNDGND1.8VVCCB3.3VDIN1ROUT3ROUT2ROUT1DIN4DIN3DIN2DIN5FORCEON3.3VDOUT1DOUT2DOUT3DOUT4DOUT5RIN3RIN2RIN1VCCGNDOESN65C3238DB-9RTSTXDCTSRXDGNDRTS_3.3VUART5_TXDUART5_RTSUART5_RXDUART5_CTSTXD_1.8VRTS_1.8VRXD_1.8VCTS_1.8V/FORCEOFF/INVALIDR1OUTBTXD_3.3V Smart LTE Module Series SC600Y&SC600T Hardware Design USIM1_CLK 143 DO

(U)SIM1 card clock signal USIM1_DATA 142 IO

(U)SIM1 card data signal USIM1_VDD 141 PO

(U)SIM1 card power supply Pull up to USIM1_VDD with a 10K resistor. Either 1.8V or 2.95V (U)SIM card is supported. Active low. Need external pull-up to 1.8V. USIM2_DET 256 DI

(U)SIM2 card insertion If unused, keep this pin open. detection Disabled by default, and can be enabled through software configuration. USIM2_RST 207 DO

(U)SIM2 card reset signal USIM2_CLK 208 DO

(U)SIM2 card clock signal USIM2_DATA 209 IO

(U)SIM2 card data signal USIM2_VDD 210 PO

(U)SIM2 card power supply Pull-up to USIM2_VDD with a 10K resistor. Either 1.8V or 2.95V (U)SIM card is supported. SC600Y&SC600T support (U)SIM card hot-plug via the USIM_DET pin, which is disabled by default and can be enabled through software configuration. A reference circuit for (U)SIM interface with an 8-pin

(U)SIM card connector is shown as below. Figure 16: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector If there is no need to use USIM_DET, please keep it open. The following is a reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector. SC600Y&SC600T_Hardware_Design 57 / 128 USIM_VDDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_DET22RLD05_1P8100K100nF(U)SIM Card ConnectorESD22pFVCCRSTCLKIOVPPGNDUSIM_VDD10KModuleR1R2C122pF22pFC2C3C4D122R22RR3R4R5 Smart LTE Module Series SC600Y&SC600T Hardware Design Figure 17: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to ensure good performance and avoid damage of (U)SIM cards, please follow the criteria below in (U)SIM circuit design:

Keep placement of (U)SIM card connector as close to the module as possible. Keep the trace length of (U)SIM card signals as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. A filter capacitor shall be reserved for USIM_VDD, and its maximum capacitance should not exceed 1uF. The capacitor should be placed near to (U)SIM card. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with ground. USIM_RST also needs ground protection. In order to offer good ESD protection, it is recommended to add a TVS diode array with parasitic capacitance not exceeding 50pF. The 22 resistors should be added in series between the module and (U)SIM card so as to suppress EMI spurious transmission and enhance ESD protection. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The 22pF capacitors should be added in parallel on USIM_DATA, USIM_CLK and USIM_RST signal lines so as to filter RF interference, and they should be placed as close to the (U)SIM card connector as possible. 3.12. SD Card Interface SC600Y&SC600T modules support SD 3.0 specifications. The pin definition of the SD card interface is shown below. SC600Y&SC600T_Hardware_Design 58 / 128 ModuleUSIM_VDDUSIM_RSTUSIM_CLKUSIM_DATA22R22R22R100nFESD22pFVCCRSTCLKIOVPPGND10KUSIM_VDD22pF22pFR1C1D1R2R3R4C2C3C4USIM_DET(U)SIM Card Connector Smart LTE Module Series SC600Y&SC600T Hardware Design Table 14: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SD_LDO11 63 PO Power supply for SD card Vnorm=2.95V IOmax=800mA SD_LDO12 179 PO SD card pull-up power Support 1.8V or 2.95V power supply. supply The maximum drive current is 50mA. SD_CLK 70 DO High speed digital clock signal of SD card SD_CMD 69 I/O Command signal of SD card SD_DATA0 68 SD_DATA1 67 SD_DATA2 66 SD_DATA3 65 I/O I/O I/O I/O High speed bidirectional digital signal lines of SD card Control characteristic impedance as 50. SD_DET 64 DI SD card insertion detection Active low. A reference circuit for SD card interface is shown as below. Figure 18: Reference Circuit for SD Card Interface SD_LDO11 is a peripheral driver power supply for SD card. The maximum drive current is approximate 800mA. Because of the high drive current, it is recommended that the trace width is 0.5mm or above. In order to ensure the stability of drive power, a 4.7uF and a 33pF capacitor should be added in parallel near the SD card connector. SC600Y&SC600T_Hardware_Design 59 / 128 SD_CMD120KNM_51KSD_DATA3SD_DATA2LDO5_1P8SD_CLKSD_DATA0SD_DETSD_DATA1P1-DAT2P2-CD/DAT3P3-CMDP4-VDDP5-CLKP8-DAT1GNDP6-VSSP7-DAT0DETECTIVEGNDGNDGND12345678910111213SD_LDO1133R33R33R33R33R33R1K33pF4.7uFSD_LDO12ModuleR1R2R3R4R5R6NM_51KNM_10KNM_51KNM_51KR7R8R9R10R11R12R13D1D2D3D4D5D6D7D8C1C2SD Card Connector Smart LTE Module Series SC600Y&SC600T Hardware Design CMD, CLK, DATA0, DATA1, DATA2 and DATA3 are all high speed signal lines. In PCB design, please control the characteristic impedance of them as 50, and do not cross them with other traces. It is recommended to route the trace on the inner layer of PCB, and keep the same trace length for CLK, CMD, DATA0, DATA1, DATA2 and DATA3. CLK additionally needs ground shielding. Layout guidelines:

Control impedance as 5010%, and ground shielding is required. The total trace length difference between CLK and other signal line traces should not exceed 1mm. Table 15: SD Card Signal Trace Length Inside the Module Pin No. Signal Length (mm) Comment 70 69 68 67 66 65 SD_CLK SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 32.11 32.11 32.11 32.11 32.11 32.11 3.13. GPIO Interfaces SC600Y&SC600T have abundant GPIO interfaces with power domain of 1.8V. The pin definition is listed below. Table 16: Pin Definition of GPIO Interfaces Pin Name Pin No. GPIO Default Status Comment GPIO_0 GPIO_1 GPIO_2 GPIO_3 248 247 201 200 GPIO_0 B-PD:nppukp 1) GPIO_1 B-PD:nppukp Wakeup 2) GPIO_2 B-PD:nppukp GPIO_3 B-PD:nppukp SC600Y&SC600T_Hardware_Design 60 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design UART2_TXD UART2_RXD TP1_I2C_SDA TP1_I2C_SCL TP1_RST TP1_INT TP0_I2C_SDA TP0_I2C_SCL UART4_TXD UART4_RXD 5 6 204 205 136 137 206 140 7 8 GPIO_4 B-PD:nppukp GPIO_5 B-PD:nppukp GPIO_6 B-PD:nppukp GPIO_7 B-PD:nppukp GPIO_8 B-PD:nppukp GPIO_9 B-PD:nppukp Wakeup GPIO_10 B-PD:nppukp GPIO_11 B-PD:nppukp GPIO_12 B-PD:nppukp GPIO_13 B-PD:nppukp Wakeup SENSOR_I2C_SDA 132 GPIO_14 B-PD:nppukp SENSOR_I2C_SCL 131 GPIO_15 B-PD:nppukp UART5_TXD UART5_RXD UART5_CTS UART5_RTS SPI_MOSI SPI_MISO SPI_CS SPI_CLK LCD0_TE LCD1_TE MCAM_MCLK SCAM_MCLK DCAM_MCLK CAM_I2C_SDA CAM_I2C_SCL 199 198 246 245 60 61 58 59 126 114 99 100 194 76 75 GPIO_16 B-PD:nppukp GPIO_17 B-PD:nppukp Wakeup GPIO_18 B-PD:nppukp GPIO_19 B-PD:nppukp GPIO_20 B-PD:nppukp GPIO_21 B-PD:nppukp Wakeup GPIO_22 B-PD:nppukp GPIO_23 B-PD:nppukp GPIO_24 B-PD:nppukp GPIO_25 B-PD:nppukp Wakeup GPIO_26 B-PD:nppukp GPIO_27 B-PD:nppukp GPIO_28 B-PD:nppukp Wakeup GPIO_29 B-PD:nppukp GPIO_30 B-PD:nppukp SC600Y&SC600T_Hardware_Design 61 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design DCAM_I2C_SDA 197 GPIO_31 B-PD:nppukp Wakeup DCAM_I2C_SCL 196 GPIO_32 B-PD:nppukp GPIO_33 GPIO_36 MCAM_PWDN MCAM_RST GPIO_42 GPIO_43 GPIO_44 GPIO_45 LCD0_RST TP0_RST TP0_INT GPIO_66 VOL_UP LCD1_RST GPIO_89 GPIO_90 GPIO_96 GPIO_97 GPIO_98 GPIO_99 GPIO_105 GPIO_107 CAM4_MCLK SCAM_RST SCAM_PWDN 3) 238 237 73 74 252 253 254 255 127 138 139 234 146 113 232 231 230 229 177 178 242 241 236 72 71 GPIO_33 B-PD:nppukp GPIO_36 B-PD:nppukp Wakeup GPIO_39 B-PD:nppukp GPIO_40 B-PD:nppukp GPIO_42 B-PD:nppukp Wakeup GPIO_43 B-PD:nppukp Wakeup GPIO_44 B-PD:nppukp Wakeup GPIO_45 B-PD:nppukp Wakeup GPIO_61 B-PD:nppukp GPIO_64 B-PD:nppukp GPIO_65 B-PD:nppukp Wakeup GPIO_66 B-PD:nppukp GPIO_85 B-PD:nppukp Wakeup GPIO_87 B-PD:nppukp Wakeup GPIO_89 B-PD:nppukp GPIO_90 B-PD:nppukp Wakeup GPIO_96 B-PD:nppukp GPIO_97 B-PD:nppukp Wakeup GPIO_98 B-PD:nppukp GPIO_99 B-PD:nppukp GPIO_105 B-PD:nppukp GPIO_107 B-PD:nppukp GPIO_128 B-PD:nppukp GPIO_129 B-PD:nppukp GPIO_130 B-PD:nppukp GRFC is only used for RF Tuner control SC600Y&SC600T_Hardware_Design 62 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 180 181 64 250 203 249 251 226 DCAM_RST DCAM_PWDN 3) SD_DET FP_SPI_CLK FP_SPI_CS FP_SPI_MOSI FP_SPI_MISO USB_SS_SEL NOTES GPIO_131 B-PD:nppukp Wakeup GPIO_132 B-PD:nppukp Wakeup GPIO_133 B-PD:nppukp Wakeup GPIO_135 B-PD:nppukp GPIO_136 B-PD:nppukp GPIO_137 B-PD:nppukp Wakeup GPIO_138 B-PD:nppukp Wakeup GPIO_139 B-PD:nppukp Wakeup 1. 1) B: Bidirectional digital with CMOS input; PD: nppukp = default pulldown with programmable options following the colon (:). 2) Wakeup: interrupt pins that can wake up the system. 3) SCAM_PWDN and DCAM_PWDN cannot be pulled up when the module starts up. 2. 3. 4. More details about GPIO configuration, please refer to document [2]. 3.14. I2C Interfaces SC600Y&SC600T provide five I2C interfaces. As an open drain output, each I2C interface should be pulled up to 1.8V voltage. The SENSOR_I2C interface supports only sensors of the aDSP architecture. CAM/DCAM_I2C bus is controlled by Linux Kernel code and supports connection to video output related devices. Table 17: Pin Definition of I2C Interfaces Pin Name Pin No I/O Description Comment TP0_I2C_SCL TP0_I2C_SDA TP1_I2C_SCL TP1_I2C_SDA 140 206 205 204 OD I2C clock signal of touch panel OD I2C data signal of touch panel OD I2C clock signal of touch panel OD I2C data signal of touch panel Used for TP0 Used for TP1 SC600Y&SC600T_Hardware_Design 63 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design CAM_I2C_SCL CAM_I2C_SDA DCAM_I2C_SCL DCAM_I2C_SDA 75 76 196 197 OD I2C clock signal of camera OD I2C data signal of camera OD I2C clock signal of depth camera OD I2C data signal of depth camera SENSOR_I2C_SCL 131 OD I2C clock signal for external sensor SENSOR_I2C_SDA 132 OD I2C data signal for external sensor Used for cameras Used for depth cameras Used for external sensors 3.15. I2S Interface SC600Y&SC600T provide one I2S interface. The I2S interface is multiplexed from FP_SPI, with power domain of 1.8V . Table 18: Pin Definition of I2S Interface Pin Name Pin No I/O Description Comment FP_SPI_CS 203 DO FP_SPI_CLK 250 DO FP_SPI_MOSI 249 DO FP_SPI_MISO 251 DI Chip selection signal of SPI interface pin by default. SPI interface Can be multiplexed into I2S_WS. Clock signal of SPI SPI interface pin by default. interface Can be multiplexed into I2S_SCK. Master out slave in of SPI SPI interface pin by default. interface Can be multiplexed into I2S_D0. Master in salve out of SPI SPI interface pin by default. interface Can be multiplexed into I2S_D1. LCM interface pin by default. LCD1_TE 114 DI Tearing effect signal Can be multiplexed into GPIO_66 234 DI/DO General GPIO I2S_MCLK_A. GPIO by default. Can be multiplexed into I2S_MCLK_B. 3.16. SPI Interfaces SC600Y&SC600T provide two SPI interfaces which only support master mode. The two interfaces are typically applied for fingerprint identification. SC600Y&SC600T_Hardware_Design 64 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Table 19: Pin Definition of SPI Interfaces Pin Name Pin No I/O Description Comment SPI_CS SPI_CLK 58 59 DO Chip selection signal of SPI interface DO Clock signal of SPI interface SPI_MOSI 60 DO Master out slave in of SPI interface SPI_MISO 61 DI Master in salve out of SPI interface FP_SPI_CS 203 DO Chip selection signal of SPI interface FP_SPI_CLK 250 DO Clock signal of SPI interface FP_SPI_MOSI 249 DO Master out slave in of SPI interface FP_SPI_MISO 251 DI Master in salve out of SPI interface Can be multiplexed into UART6_CST. Can be multiplexed into UART6_RTS. Can be multiplexed into UART6_TXD. Can be multiplexed into UART6_RXD. Used for fingerprint identification by default. Can be multiplexed into I2S interface. 3.17. ADC Interfaces SC600Y&SC600T provide two analog-to-digital converter (ADC) interfaces, and the pin definition is shown below. Table 20: Pin Definition of ADC Interfaces Pin Name Pin No. I/O Description Comment PMI_ADC 153 PMU_MPP2 151 AI AI The resolution of the ADC is up to 15 bits. General purpose ADC interface General purpose ADC interface Maximum input voltage: 1.5V. Maximum input voltage: 1.7V. 3.18. Vibrator Drive Interface The pin definition of vibrator drive interface is listed below. SC600Y&SC600T_Hardware_Design 65 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Table 21: Pin Definition of Vibrator Drive Interface Pin Name Pin No I/O Description Comment VIB_GND 160 AI Vibrator GND (negative) VIB_DRV 161 AO Vibrator drive (positive) Connected to the negative terminal of avibrator. Connected to the positive terminal of vibrator. The Vibrator is driven by an exclusive circuit, and a reference circuit design is shown below. Figure 19: Reference Circuit for Vibrator Connection 3.19. LCM Interfaces SC600Y&SC600T modules provide two LCM interfaces, and supports dual LCDs with WUXGA

(19001200) display. The interfaces support high speed differential data transmission, with up to eight lanes. Table 22: Pin Definition of LCM Interfaces Pin Name Pin No. I/O Description Comment LDO6_1P8 10 PO for LCM logic circuit and 1.8V output power supply LDO17_2P85 12 PO DSI 2.85V output power supply for LCM analog circuits PMU_MPP4 152 DO PWM signal output SC600Y&SC600T_Hardware_Design 66 / 128 1uFModuleVIB+MotorVIB-C233pFC1VIB_DRVD1VIB_GND Smart LTE Module Series SC600Y&SC600T Hardware Design LCD_BL_A LCD_BL_K1 LCD_BL_K2 LCD_BL_K3 LCD_BL_K4 LCD0_RST LCD0_TE LCD1_RST LCD1_TE 21 22 23 24 25 127 126 113 114 PO AI AI AI AI Current output for LCD backlight Current sink for LCD backlight Current sink for LCD backlight Current sink for LCD backlight Current sink for LCD backlight DO LCD0 reset signal Active low. DI LCD0 tearing effect signal DO LCD1 reset signal Active low. DI LCD1 tearing effect signal DSI0_CLK_N 116 AO DSI0_CLK_P 115 AO DSI0_LN0_N 118 AO DSI0_LN0_P 117 AO DSI0_LN1_N 120 AO DSI0_LN1_P 119 AO DSI0_LN2_N 122 AO DSI0_LN2_P 121 AO DSI0_LN3_N 124 AO DSI0_LN3_P 123 AO DSI1_CLK_N 103 AO DSI1_CLK_P 102 AO LCD0 MIPI clock signal

(negative) LCD0 MIPI clock signal

(positive) LCD0 MIPI lane 0 data signal (negative) LCD0 MIPI lane 0 data signal (positive) LCD0 MIPI lane 1 data signal (negative) LCD0 MIPI lane 1 data signal (positive) LCD0 MIPI lane 2 data signal (negative) LCD0 MIPI lane 2 data signal (positive) LCD0 MIPI lane 3 data signal (negative) LCD0 MIPI lane 3 data signal (positive) LCD1 MIPI clock signal

(negative) LCD1 MIPI clock signal

(positive) DSI1_LN0_N 105 AO LCD1 MIPI lane 0 data SC600Y&SC600T_Hardware_Design 67 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design DSI1_LN0_P 104 AO DSI1_LN1_N 107 AO DSI1_LN1_P 106 AO DSI1_LN2_N 109 AO DSI1_LN2_P 108 AO DSI1_LN3_N 111 AO DSI1_LN3_P 110 AO signal (negative) LCD1 MIPI lane 0 data signal (positive) LCD1 MIPI lane 1 data signal (negative) LCD1 MIPI lane 1 data signal (positive) LCD1 MIPI lane 2 data signal (negative) LCD1 MIPI lane 2 data signal (positive) LCD1 MIPI lane 3 data signal (negative) LCD1 MIPI lane 3 data signal (positive) The following are the reference designs for LCM interfaces. Figure 20: Reference Circuit Design for LCM0 Interface SC600Y&SC600T_Hardware_Design 68 / 128 DSI0_CLK_PLEDANCLEDKLPTENC (SDA-TP) VIO18NC (VTP-TP) DSI0_LN3_PLCD0_TELCD0_RSTDSI0_LN3_NDSI0_LN2_PDSI0_CLK_NDSI0_LN2_NRESETLCD_IDNC (SCL-TP) NC (RST-TP) NC (EINT-TP) GNDVCC28GNDMIPI_TDP3MIPI_TDN3GNDMIPI_TDP2MIPI_TDN2GNDMIPI_TDP1MIPI_TDN1GNDLDO17_2P85LDO6_1P8LCD_BL_ALCD_BL_K11234567891012131415161718192021222324252627MIPI_TDP0MIPI_TDN0GNDMIPI_TCPMIPI_TCN2928303456345634563456DSI0_LN1_NDSI0_LN1_PDSI0_LN0_NDSI0_LN0_P1234561112121212100nF4.7uF1uFModuleLCMFL1FL2FL3FL4FL5EMI filterC3C2C1NCGNDGNDGNDGNDPMI_MPP131323334LCD_BL_K2 Smart LTE Module Series SC600Y&SC600T Hardware Design Figure 21: Reference Circuit Design for LCM1 Interface MIPI are high speed signal lines. It is recommended that common-mode filters should be added in series near the LCM connector, so as to improve protection against electromagnetic radiation interference. When compatible design with other displays is required, please connect the LCD_ID pin of LCM to the modules ADC pin, and please note that the output voltage of LCD_ID cannot exceed the voltage range of ADC pin. Backlight driving circuits should be designed for LCMs. SC600 provides backlight driving output which can be used to drive LCM backlight WLEDs directly. The features are listed below:

Use the high voltage output (LCD_BL_A) for powering WLED strings, and the output voltage can be configured from VBAT to 29.5V. Support 4 current sinks (LCD_BL_K1, LCD_BL_K2, LCD_BL_K3, LCD_BL_K4,), with maximum sink current up to 25mA for each. SC600Y&SC600T_Hardware_Design 69 / 128 DSI1_CLK_PLEDANCLEDKLPTENC (SDA-TP)VIO18NC (VTP-TP)DSI1_LN3_PLCD1_TELCD1_RSTDSI1_LN3_NDSI1_LN2_PDSI1_CLK_NDSI1_LN2_NRESETLCD_IDNC (SCL-TP) NC (RST-TP) NC (EINT-TP) GNDVCC28GNDMIPI_TDP3MIPI_TDN3GNDMIPI_TDP2MIPI_TDN2GNDMIPI_TDP1MIPI_TDN1GNDLDO17_2P85LDO6_1P8LCM1_LED+1234567891012131415161718192021222324252627MIPI_TDP0MIPI_TDN0GNDMIPI_TCPMIPI_TCN2928303456345634563456DSI1_LN1_NDSI1_LN1_PDSI1_LN0_NDSI1_LN0_P1234561112121212100nF4.7uF1uFModuleLCMFL1FL2FL3FL4FL5EMI filterC3C2C1NCGNDGNDGNDGNDPMU_MPP231323334LCM1_LED- Smart LTE Module Series SC600Y&SC600T Hardware Design Power two strings of WLEDs (about 16 WLEDs) with two current sink drivers, or power four strings of WLEDs (about 28 WLEDs) with four current sink drivers. The frequency of PWM can be configured by software to adjust the backlight brightness. LCM0 uses the internal backlight driving circuit provided by SC600Y&SC600T by default. LCM1 can use the internal circuit or an external backlight driving circuit according to customers demands. The following is a reference design for LCM1 external backlight driving circuit where PMU_MPP4 is used to adjust the backlight brightness. Figure 22: Reference Design of LCM1 External Backlight Driving Circuit 3.20. Touch Panel Interfaces SC600Y&SC600T provide two I2C interfaces for connection with Touch Panel (TP), and also provides the corresponding power supply and interrupt pins. The pin definition of touch panel interfaces is illustrated below. Table 23: Pin Definition of Touch Panel Interfaces Pin Name Pin No I/O Description Comment LDO10_2P8 11 PO 2.8V output power supply for TP Vnorm=2.8V VDD power IOmax=150mA LDO6_1P8 10 PO 1.8V output power supply Pull-up power supply of I2C Vnorm=1.8V IOmax=300mA TP0_INT 139 DI Interrupt signal of touch panel (TP0) TP0_RST 138 DO Reset signal of touch panel (TP0) Active low TP0_I2C_ SCL 140 OD I2C clock signal of touch panel

(TP0) SC600Y&SC600T_Hardware_Design 70 / 128 152LCM1_LED+PMU_MPP4Module2.2uFBacklight DriverLCM1_LED-VBATC1 Smart LTE Module Series SC600Y&SC600T Hardware Design TP0_I2C_ SDA 206 OD I2C data signal of touch panel (TP0) TP1_INT 137 DI Interrupt signal of touch panel (TP1) TP1_RST 136 DO Reset signal of touch panel (TP1) Active low TP1_I2C_ SCL TP1_I2C_ SDA 205 OD I2C clock signal of touch panel

(TP1) 204 OD I2C data signal of touch panel (TP1) A reference design for touch panel interfaces is shown below. Figure 23: Reference Circuit Design for Touch Panel Interfaces NOTE TP is powered by LDO10_2P8 by default and LDO10_2P8 can output 150mA current. It is recommended to use an external LDO power supply if dual-TP or other applications need to be supported. 3.21. Camera Interfaces Based on standard MIPI CSI input interface, SC600Y&SC600T modules support 3 cameras (4-lane +

4-lane + 4-lane) or 4 cameras (4-lane + 4-lane + 2-lane + 1-lane), with maximum pixels up to 21MP for SC600Y-XX and 24MP for SC600T-XX. The video and photo quality are determined by various factors such as camera sensor, camera lens quality, etc. SC600Y&SC600T_Hardware_Design 71 / 128 TP_RSTTP_I2C_SCLTP_I2C_SDATP_INT1234562.2K2.2KLDO6_1P84.7uF100nFModuleRESET 1.8V SCL 1.8VSDA 1.8V INT 1.8V GNDVDD 2.8V TPR2R1C1C2D1D2D3D4D5LDO10_2P8 Smart LTE Module Series SC600Y&SC600T Hardware Design Table 24: Pin Definition of Camera Interfaces Pin Name Pin No. I/O Description Comment LDO2_1P1 13 PO for digital core circuit of 1.1V output power supply rear camera 1.8V output power supply LDO6_1P8 10 PO for digital I/O circuit of camera Vnorm=1.1V IOmax=1200mA Vnorm=1.8V IOmax=300mA LDO17_2P85 12 LDO22_2P8 14 PO PO 2.85V output power supply Vnorm=2.85V auto focus circuit IOmax=300mA 2.8V output power supply Vnorm=2.8V for AVDD of cameras IOmax=150mA LDO23_1P2 15 PO for digital core circuit of 1.2V output power supply CSI0_CLK_N 89 CSI0_CLK_P CSI0_LN0_N CSI0_LN0_P CSI0_LN1_N CSI0_LN1_P CSI0_LN2_N CSI0_LN2_P CSI0_LN3_N CSI0_LN3_P 88 91 90 93 92 95 94 97 96 CSI1_CLK_N 184 CSI1_CLK_P 183 CSI1_LN0_N 186 AI AI AI AI AI AI AI AI AI AI AI AI AI front camera MIPI clock signal of rear camera (negative) MIPI clock signal of rear camera (positive) MIPI lane 0 data signal of rear camera (negative) MIPI lane 0 data signal of rear camera (positive) MIPI lane 1 data signal of rear camera (negative) MIPI lane 1 data signal of rear camera (positive) MIPI lane 2 data signal of rear camera (negative) MIPI lane 2 data signal of rear camera (positive) MIPI lane 3 data signal of rear camera (negative) MIPI lane 3 data signal of rear camera (positive) MIPI clock signal of depth camera (negative) MIPI clock signal of depth camera (positive) MIPI lane 0 data signal of depth camera (negative) Vnorm=1.2V IOmax=600mA SC600Y&SC600T_Hardware_Design 72 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design CSI1_LN0_P 185 CSI1_LN1_N 188 CSI1_LN1_P 187 AI AI AI CSI1_LN2_N 190 AI CSI1_LN2_P 189 AI CSI1_LN3_N 192 AI CSI1_LN3_P 191 AI CSI2_CLK_N 78 CSI2_CLK_P CSI2_LN0_N CSI2_LN0_P CSI2_LN1_N CSI2_LN1_P CSI2_LN2_N CSI2_LN2_P CSI2_LN3_N CSI2_LN3_P 77 80 79 82 81 84 83 86 85 AI AI AI AI AI AI AI AI AI AI MCAM_MCLK 99 DO SCAM_MCLK 100 DO MIPI lane 0 data signal of depth camera (positive) MIPI lane 1 data signal of depth camera (negative) MIPI lane 1 data signal of depth camera (positive) MIPI lane 2 data signal of depth camera (negative) MIPI lane 2 data signal of depth camera (positive) MIPI lane 3 data signal of depth camera (negative) MIPI lane 3 data signal of depth camera (positive) MIPI clock signal of front camera (negative) MIPI clock signal of front camera (positive) MIPI lane 0 data signal of front camera (negative) MIPI lane 0 data signal of front camera (positive) MIPI lane 1 data signal of front camera (negative) MIPI lane 1 data signal of front camera (positive) MIPI lane 2 data signal of front camera (negative) MIPI lane 2 data signal of front camera (positive) MIPI lane 3 data signal of front camera (negative) MIPI lane 3 data signal of front camera (positive) Master clock signal of rear camera Master clock signal of front camera Can be multiplexed into differential data of the fourth camera (negative) Can be multiplexed into differential data of the fourth camera (positive) Can be multiplexed into differential clock of the fourth camera (negative) Can be multiplexed into differential clock of the fourth camera (positive) SC600Y&SC600T_Hardware_Design 73 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design MCAM_RST 74 DO MCAM_PWDN 73 DO SCAM_RST 72 DO SCAM_PWDN 71 DO Reset signal of rear camera Power down signal of rear camera Reset signal of front camera Power down signal of front camera CAM_I2C_SCL 75 OD I2C clock signal of camera CAM_I2C_SDA 76 OD I2C data signal of camera DCAM_MCLK 194 DO CAM4_MCLK 236 DO DCAM_RST 180 DO DCAM_PWDN 181 DO Clock signal of depth camera Master clock signal of fourth camera Reset signal of depth camera Power down signal of depth camera DCAM_I2C_SDA 197 OD I2C data of depth camera DCAM_I2C_SCL 196 OD I2C clock of depth camera SC600Y&SC600T_Hardware_Design 74 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design The following is a reference circuit design for two-camera applications. Figure 24: Reference Circuit Design for Two-Camera Applications NOTE CSI0 is used for rear camera, CSI1 is used for depth camera, and CSI2 is used for front camera. SC600Y&SC600T_Hardware_Design 75 / 128 Rear camera connectorMCAM_PWDNMCAM_MCLKCAM_I2C_SDACAM_I2C_SCLSCAM_RSTSCAM_PWDNSCAM_MCLKCSI0_CLK_PCSI0_CLK_NCSI2_CLK_PCSI2_CLK_NLDO6_1P8LDO2_1P1LDO22_2P82.2K2.2KFront camera connector4.7uF1uF1uFMCAM_RSTEMIEMIEMIEMIEMIEMIEMIEMIEMIEMILDO17_2P85AVDDAF_VDDDVDDDOVDD1uFCSI0_LN0_PCSI0_LN0_NCSI0_LN1_PCSI0_LN1_NCSI0_LN2_PCSI0_LN2_NCSI0_LN3_PCSI0_LN3_NCSI2_LN0_PCSI2_LN0_NCSI2_LN1_PCSI2_LN1_NCSI2_LN2_PCSI2_LN2_NCSI2_LN3_PCSI2_LN3_NLDO23_1P2DVDD1uF4.7uF4.7uFAVDDDOVDD Smart LTE Module Series SC600Y&SC600T Hardware Design The following is a reference circuit design for three-camera applications. Figure 25: Reference Circuit Design for Three-Camera Applications NOTE CSI1 data lines CSI1_LN2_P, CSI_LN2_N, CSI_LN3_P and CSI_LN3_N can be multiplexed into MIPI signals for the fourth camera in four-camera application. SC600Y&SC600T_Hardware_Design 76 / 128 Rear camera connectorMCAM_PWDNMCAM_MCLKCAM_I2C_SDACAM_I2C_SCL_CSI0_LN3_PCSI0_LN3_NCSI0_LN2_PCSI0_LN2_NCSI0_LN1_PCSI0_LN1_NCSI0_LN0_PCSI0_LN0_NSCAM_RSTSCAM_PWDNSCAM_MCLKCSI1_CLK_PCSI1_CLK_NCSI1_LN0_PCSI1_LN0_NCSI2_LN1_PCSI2_LN1_NCSI2_LN0_PCSI2_LN0_NCSI0_CLK_PCSI0_CLK_NCSI2_CLK_PCSI2_CLK_NLDO6_1P8LDO22_2P82.2K2.2KFront camera connector1uF4.7uF4.7uF1uF1uF4.7uFMCAM_RSTDCAM_PWDNDCAM_MCLKDCAM_I2C_SDA_DCAM_I2C_SCLDCAM_RSTDepth camera connector LDO17_2P85AVDDAF_VDDDVDDDOVDDEMIEMIEMIEMIEMIEMIEMIEMILDO2_1P11uFLDO23_1P22.2K2.2KDVDDEMIEMI4.71uFuFAVDDDOVDD Smart LTE Module Series SC600Y&SC600T Hardware Design 3.21.1. Design Considerations Special attention should be paid to the pin definition of LCM/camera connectors. Assure the SC600Y&SC600T and the connectors are correctly connected. MIPI are high speed signal lines, supporting maximum data rate up to 2.1Gbps. The differential impedance should be controlled as 100. Additionally, it is recommended to route the trace on the inner layer of PCB, and do not cross it with other traces. For the same group of DSI or CSI signals, all the MIPI traces should keep the same length. In order to avoid crosstalk, it is recommended to maintain the intra-lane spacing as trace width and the inter-lane spacing as two times of the trace width. Any cut or hole on GND reference plane under MIPI signals should be avoided. It is recommended to select a low capacitance TVS for ESD protection and the recommended parasitic capacitance is below 1pF. Route MIPI traces according to the following rules:

a) The total trace length should not exceed 305mm;

b) Control the differential impedance as 10010%;

c) Control intra-lane length difference within 0.67mm;

d) Control inter-lane length difference within 1.3mm. Table 25: MIPI Trace Length Inside the Module Pin No. Pin Name Length (mm) Length Difference (P-N) 116 115 118 117 120 119 122 121 124 123 103 102 DSI0_CLK_N DSI0_CLK_P DSI0_LN0_N DSI0_LN0_P DSI0_LN1_N DSI0_LN1_P DSI0_LN2_N DSI0_LN2_P DSI0_LN3_N DSI0_LN3_P DSI1_CLK_N DSI1_CLK_P 20.82 20.37 24.84 24.84 24.85 24.82 25.94 26.18 29.31 29.51 9.52 9.47

-0.45 0

-0.03 0.24 0.2

-0.05 SC600Y&SC600T_Hardware_Design 77 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 105 104 107 106 109 108 111 110 89 88 91 90 93 92 95 94 97 96 184 183 186 185 188 187 190 189 DSI1_LN0_N DSI1_LN0_P DSI1_LN1_N DSI1_LN1_P DSI1_LN2_N DSI1_LN2_P DSI1_LN3_N DSI1_LN3_P CSI0_CLK_N CSI0_CLK_P CSI0_LN0_N CSI0_LN0_P CSI0_LN1_N CSI0_LN1_P CSI0_LN2_N CSI0_LN2_P CSI0_LN3_N CSI0_LN3_P CSI1_CLK_N CSI1_CLK_P CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN2_N CSI1_LN2_P 10.27 10.16 11.75 11.58 14.86 14.5 15.73 15.88 16.54 16.57 17.47 17.4 12.13 12.08 9.56 9.7 8.73 8.86 20.32 20.09 12.09 12.66 11.33 11.70 5.86 6.05

-0.11

-0.17

-0.36 0.15 0.03

-0.07

-0.05 0.14 0.13

-0.23 0.57 0.37 0.19 SC600Y&SC600T_Hardware_Design 78 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 192 191 78 77 80 79 82 81 84 83 86 85 CSI1_LN3_N CSI1_LN3_P CSI2_CLK_N CSI2_CLK_P CSI2_LN0_N CSI2_LN0_P CSI2_LN1_N CSI2_LN1_P CSI2_LN2_N CSI2_LN2_P CSI2_LN3_N CSI2_LN3_P 10.49 10.06 22.00 22.17 22.07 22.00 22.54 22.05 22.03 21.92 21.90 22.49

-0.43 0.17

-0.07

-0.49

-0.11 0.59 3.21.2. Flashlight Interfaces SC600Y&SC600T modules support 2 flash LED drivers, with maximal output current up to 1.5A per channel in flash mode and 300mA in torch mode. The default output current is 1A in flash mode and 300mA in torch mode. Table 26: Pin Definition of Flashlight Interfaces Pin Name Pin No. I/O Description Comment FLASH_LED1 26 AO Flash/torch drive signal output FLASH_LED2 162 AO Flash/torch drive signal output SC600Y&SC600T_Hardware_Design 79 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design A reference circuit design is shown below. Figure 26: Reference Circuit Design for Flashlight Interfaces 3.22. Sensor Interfaces SC600Y&SC600T modules support communication with sensors via I2C interface, and it supports various sensors such as acceleration sensor, gyroscopic sensor, compass, optical sensor, temperature sensor. Table 27: Pin Definition of Sensor Interfaces Pin Name Pin No. I/O Description Comment SENSOR_I2C_SCL 131 OD I2C clock signal of external sensor SENSOR_I2C_SDA 132 OD I2C data signal of external sensor GPIO_43 GPIO_44 GPIO_42 GPIO_45 253 254 252 255 DI DI DI DI Interrupt signal of optical sensor Interrupt signal of direction sensor

(compass) Interrupt signal of acceleration sensor Interrupt signal of gyroscopic sensor 3.23. Audio Interfaces SC600Y&SC600T modules provide three analog input channels and three analog output channels. The following table shows the pin definition. SC600Y&SC600T_Hardware_Design 80 / 128 ModuleD2FLASH_LED1D1FLASH_LED2 Smart LTE Module Series SC600Y&SC600T Hardware Design Table 28: Pin Definition of Audio Interfaces Pin Name Pin No. I/O Description Comment MIC1_P MIC1_N 44 45 AI AI Microphone positive input for channel 1 Microphone negative input for channel 1 MIC_GND 168 Microphone reference ground If unused, connect this pin to the ground. MIC2_P 46 MIC3_P 169 AI AI Microphone positive input for headset. Microphone positive input for channel 2 MIC_BIAS 167 AO Microphone bias voltage AO Earpiece positive output AO Earpiece negative output AO Speaker positive output AO Speaker negative output AO Headphone right channel output AI Headphone reference ground AO Headphone left channel output EAR_P EAR_N SPK_P SPK_N HPH_R HPH_REF HPH_L HS_DET 53 52 55 54 51 50 49 48 AI Headset insertion detection High level by default. The module offers three audio input channels, including one differential input pair and two single-ended channels. The three sets of MICs are integrated with internal bias voltage. The output voltage range of MIC_BIAS is programmable between 1.6V and 2.85V, and the maximum output current is 3mA. The earpiece interface uses differential output. The loudspeaker interface uses differential output as well. The output channel is available with a Class-D amplifier whose maximum output power is 1.5W when load is 8. The headphone interface features stereo left and right channel output, and headphone insertion detection function is supported. SC600Y&SC600T_Hardware_Design 81 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 3.23.1. Reference Circuit Design for Microphone Interfaces Figure 27: Reference Circuit Design for Analog ECM-type Microphone Figure 28: Reference Circuit Design for MEMS-type Microphone SC600Y&SC600T_Hardware_Design 82 / 128 MIC1_PECM-MICR2R1ModuleD1MIC1_N33pFC10R0RR30RMIC3_P33pFMEMS-MICR2R1C2ModuleMIC_GND0RC1MIC_BIAS1234F1D1OUTGNDGNDVDD100nFC40R33pF Smart LTE Module Series SC600Y&SC600T Hardware Design 3.23.2. Reference Circuit Design for Earpiece Interface Figure 29: Reference Circuit Design for Earpiece Interface 3.23.3. Reference Circuit Design for Headphone Interface Figure 30: Reference Circuit Design for Headphone Interface SC600Y&SC600T_Hardware_Design 83 / 128 EAR_PEAR_NR233pF33pF33pFC2C3C1R1ModuleD1D20R0R20KESDMIC_GNDMIC2_PHPH_LHS_DETHPH_RHPH_REF33pFModuleR10R36452133pF33pFC3C4C5F3F2F1D1D2D3D4F4R2R30R Smart LTE Module Series SC600Y&SC600T Hardware Design 3.23.4. Reference Circuit Design for Loudspeaker Interface Figure 31: Reference Circuit Design for Loudspeaker Interface 3.23.5. Audio Interfaces Design Considerations It is recommended to use the electret microphone with dual built-in capacitors (e.g. 10pF and 33pF) for filtering out RF interference, thus reducing TDD noise. The 33pF capacitor is applied for filtering out RF interference when the module is transmitting at EGSM900. Without placing this capacitor, TDD noise could be heard. The 10pF capacitor here is used for filtering out RF interference at DCS1800. Please note that the resonant frequency point of a capacitor largely depends on the material and production technique. Therefore, customers would have to discuss with their capacitor vendors to choose the most suitable capacitor for filtering out high-frequency noises. The severity degree of the RF interference in the voice channel during GSM transmitting largely depends on the application design. In some cases, EGSM900 TDD noise is more severe; while in other cases, DCS1800 TDD noise is more obvious. Therefore, a suitable capacitor can be selected based on the test results. Sometimes, even no RF filtering capacitor is required. In order to decrease radio or other signal interference, RF antennas should be placed away from audio interfaces and audio traces. Power traces cannot be parallel with and also should be far away from the audio traces. The differential audio traces must be routed according to the differential signal layout rule. SC600Y&SC600T_Hardware_Design 84 / 128 EARPEARNF2SPK_PSPK_N33pF33pFC1C2F1ModuleD1D2 Smart LTE Module Series SC600Y&SC600T Hardware Design 3.24. Emergency Download Interface USB_BOOT is an emergency download interface. Pull up to LDO5_1P8 during power-up will force the module enter into emergency download mode. This is an emergency option when there are failures such as abnormal startup or operation. For convenient firmware upgrade and debugging in the future, please reverse the reference circuit design shown as below. Figure 32: Reference Circuit Design for Emergency Download Interface SC600Y&SC600T_Hardware_Design 85 / 128 LDO5_1P8S1 ModuleUSB_BOOTR110K Smart LTE Module Series SC600Y&SC600T Hardware Design 4 Wi-Fi and BT SC600Y&SC600T modules provide a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth

(BT) functions. The interface impedance is 50. External antennas such as PCB antenna, sucker antenna and ceramic antenna can be connected to the module via the interface, so as to achieve Wi-Fi and BT functions. 4.1. Wi-Fi Overview SC600Y&SC600T modules support 2.4GHz and 5GHz dual-band WLAN wireless communication based on IEEE 802.11a/b/g/n/ac standard protocols. The maximum data rate is up to 433Mbps. The features are as below:

Support Wake-on-WLAN (WoWLAN) Support ad hoc mode Support WAPI SMS4 hardware encryption Support AP mode Support Wi-Fi Direct Support MCS 0-7 for HT20 and HT40 Support MCS 0-8 for VHT20 Support MCS 0-9 for VHT40 and VHT80 4.1.1. Wi-Fi Performance The following table lists the Wi-Fi transmitting and receiving performance of SC600Y&SC600T modules. Table 29: Wi-Fi Transmitting Performance Standard 802.11b Rate 1Mbps Output Power 16dBm2.5dB 2.4GHz 802.11b 11Mbps 16dBm2.5dB 802.11g 6Mbps 16dBm2.5dB SC600Y&SC600T_Hardware_Design 86 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 802.11g 54Mbps 14dBm2.5dB 802.11n HT20 MCS0 15dBm2.5dB 802.11n HT20 MCS7 13dBm2.5dB 802.11n HT40 MCS0 14dBm2.5dB 802.11n HT40 MCS7 13dBm2.5dB 802.11a 802.11a 6Mbps 14dBm2.5dB 54Mbps 13dBm2.5dB 802.11n HT20 MCS0 15dBm2.5dB 802.11n HT20 MCS7 13dBm2.5dB 802.11n HT40 MCS0 15dBm2.5dB 802.11n HT40 MCS7 13dBm2.5dB 802.11ac VHT20 MCS0 15dBm2.5dB 802.11ac VHT20 MCS8 13dBm2.5dB 802.11ac VHT40 MCS0 14dBm2.5dB 802.11ac VHT40 MCS9 13dBm2.5dB 802.11ac VHT80 MCS0 13dBm2.5dB 802.11ac VHT80 MCS9 12dBm2.5dB 5GHz Table 30: Wi-Fi Receiving Performance Standard 802.11b 802.11b 2.4GHz 802.11g 802.11g Rate 1Mbps 11Mbps 6Mbps 54Mbps 802.11n HT20 MCS0 Sensitivity

-94.5

-87

-89

-71.5

-88.5 SC600Y&SC600T_Hardware_Design 87 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 802.11n HT20 MCS7 802.11n HT40 MCS0 802.11n HT40 MCS7 802.11a 802.11a 6Mbps 54Mbps

-71.5

-70

-85

-67

-90 802.11n HT20 MCS0 802.11n HT20 MCS7 5GHz 802.11n HT40 MCS0 802.11n HT40 MCS7 802.11ac VHT20 MCS8 802.11ac VHT40 MCS9 802.11ac VHT80 MCS9 Reference specifications are listed below:

-86dBm

-67dBm

-84dBm

-64dBm

-68dBm

-62dBm

-58dBm IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY, June 2007 IEEE Std 802.11b, IEEE Std 802.11d, IEEE Std 802.11e, IEEE Std 802.11g, IEEE Std 802.11i: IEEE 802.11-2007 WLAN MAC and PHY, June 2007 4.2. BT Overview SC600Y&SC600T modules support BT4.2 (BR/EDR+BLE) specifications, as well as GFSK, 8-DPSK,

/4-DQPSK modulation modes. Maximally support up to 7 wireless connections Maximally support up to 3.5 piconets at the same time Support one SCO or eSCO (Extended Synchronous Connection Oriented) connection The BR/EDR channel bandwidth is 1MHz, and can accommodate 79 channels. The BLE channel bandwidth is 2MHz, and can accommodate 40 channels. SC600Y&SC600T_Hardware_Design 88 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Table 31: BT Data Rate and Versions Version Data rate Maximum Application Throughput Comment 1.2 1Mbit/s

> 80Kbit/s 2.0+EDR 3Mbit/s

> 80Kbit/s 3.0+HS 24Mbit/s Reference to 3.0+HS 4.0 24Mbit/s Reference to 4.0 LE Reference specifications are listed below:

Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1+ EDR/3.0/3.0 + HS, August 6, 2009 Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009 4.2.1. BT Performance The following table lists the BT transmitting and receiving performance of SC600Y&SC600T modules. Table 32: BT Transmitting and Receiving Performance Transmitter Performance Packet Types DH5 2-DH5 3-DH5 Transmitting Power 10dBm2.5dB 8dBm2.5dB 8dBm2.5dB Receiver Performance Packet Types DH5 Receiving Sensitivity

-91dBm 2-DH5

-92dBm 3-DH5

-86dBm SC600Y&SC600T_Hardware_Design 89 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 5 GNSS SC600Y&SC600T modules integrate a Qualcomm IZat GNSS engine (Gen 8C) which supports multiple positioning and navigation systems including GPS, GLONASS and BeiDou. With an embedded LNA, the module provides greatly improved positioning accuracy. 5.1. GNSS Performance The following table lists the GNSS performance of SC600Y&SC600T modules in conduction mode. Table 33: GNSS Performance Parameter Description Cold start Sensitivity (GNSS) Reacquisition Tracking Cold start TTFF (GNSS) Warm start Hot start Static Drift (GNSS) CEP-50 Typ.

-144

-155

-155 35 30

<5

<80 Unit dBm dBm dBm s s s m SC600Y&SC600T_Hardware_Design 90 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 5.2. GNSS RF Design Guidelines Bad design of antenna and layout may cause reduced GNSS receiving sensitivity, longer GNSS positioning time, or reduced positioning accuracy. In order to avoid these, please follow the design rules listed below:

Maximize the distance between the GNSS RF part and the GPRS RF part (including trace routing and antenna layout) to avoid mutual interference. In user systems, GNSS RF signal lines and RF components should be placed far away from high speed circuits, switched-mode power supplies, power inductors, the clock circuit of single-chip microcomputers, etc. For applications with harsh electromagnetic environment or high ESD-protection requirements, it is recommended to add ESD protective diodes for the antenna interface. Only diodes with ultra-low junction capacitance such as 0.5pF can be selected. Otherwise, there will be effects on the impedance characteristic of RF circuit loop, or attenuation of bypass RF signal may be caused. Control the impedance of either feeder line or PCB trace as 50, and keep the trace length as short as possible. Refer to Chapter 6.3 for GNSS antenna reference circuit designs. SC600Y&SC600T_Hardware_Design 91 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 6 Antenna Interfaces SC600Y&SC600T provide four antenna interfaces for main antenna, Rx-diversity/MIMO antenna, GNSS antenna, and Wi-Fi/BT antenna, respectively. The antenna ports have an impedance of 50. 6.1. Main/Rx-diversity Antenna Interfaces The pin definition of main/Rx-diversity antenna interfaces is shown below. Table 34: Pin Definition of Main/Rx-diversity Antenna Interfaces Pin Name Pin No. I/O Description Comment ANT_MAIN 19 ANT_DRX 149 IO AI Main antenna interface 50 impedance Diversity and MIMO antenna interface 50 impedance The operating frequencies of SC600Y&SC600T modules are listed in the following table. Table 35: SC600Y-JP*/SC600T-JP* Module Operating Frequencies 3GPP Band Receive Transmit WCDMA B1 2110~2170 1920~1980 WCDMA B6 WCDMA B8 875~885 925~960 WCDMA B19 875~890 830~840 880~915 830~845 LTE-FDD B1 2110~2170 1920~1980 LTE-FDD B3 1805~1880 1710~1785 LTE-FDD B5 869~894 824~849 Unit MHz MHz MHz MHz MHz MHz MHz SC600Y&SC600T_Hardware_Design 92 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design LTE-FDD B8 925~960 880~915 LTE-FDD B11 1475.9~495.9 1427.9~1447.9 LTE-FDD B18 860~875 LTE-FDD B19 875~890 815~830 830~845 LTE-TDD B21 1495.9~1510.9 1447.9~1462.9 LTE-TDD B26 758~788 LTE-FDD B28A 758~788 LTE-FDD B28B 773~803 703~733 703~733 718~748 LTE-TDD B41 1) 2496~2690 2496~2690 Table 36: SC600Y-EM*/SC600T-EM* Module Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 Receive 869~894 925~960 Transmit 824~849 880~915 1805~1880 1710~1785 1930~1990 1850~1910 WCDMA B1 2110~2170 1920~1980 WCDMA B2 1930~1990 1850~1910 WCDMA B4 2110~2155 1710~1755 WCDMA B5 WCDMA B8 871~892 925~960 826~847 880~915 LTE-FDD B1 2110~2170 1920~1980 LTE-FDD B2 1930~1990 1850~1910 LTE-FDD B3 1805~1880 1710~1785 MHz MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz SC600Y&SC600T_Hardware_Design 93 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design LTE-FDD B5 869~894 824~849 LTE-FDD B7 2620~2690 2500~2570 LTE-FDD B8 925~960 LTE-FDD B20 791~821 LTE-FDD B28A 758~788 LTE-FDD B28B 773~803 880~915 832~862 703~733 718~748 LTE-TDD B38 2570~2620 2570~2620 LTE-TDD B39 1880~1920 1880~1920 LTE-TDD B40 2300~2400 2300~2400 LTE-TDD B41 1) 2496~2690 2496~2690 Table 37: SC600Y-NA*/SC600T-NA* Module Operating Frequencies 3GPP Band Receive Transmit WCDMA B2 1930~1990 1850~1910 WCDMA B4 2110~2155 1710~1755 WCDMA B5 871~892 826~847 LTE-FDD B2 1930~1990 1850~1910 LTE-FDD B4 2110~2155 1710~1755 LTE-FDD B5 869~894 824~849 LTE-FDD B7 2620~2690 2500~2570 LTE-FDD B12 729~746 LTE-FDD B13 746~756 LTE-FDD B14 758~768 LTE-FDD B17 734~746 699~716 777~787 788~798 704~716 LTE-FDD B25 1930~1995 1850~1915 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz SC600Y&SC600T_Hardware_Design 94 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design LTE-FDD B26 859~894 814~849 LTE-FDD B66 2110~2200 1710~1780 LTE-FDD B71 617 652 663 698 LTE-TDD B41 1) 2496~2690 2496~2690 MHz MHz MHz MHz NOTES 1. 1) The bandwidth of LTE-TDD B41 for SC600Y-EM*/SC600T-EM*SC600Y-JP*/SC600T-JP*

SC600Y-NA*/SC600T-NA* is 200MHz (2496MHz~2690MHz), and the corresponding channel ranges from 39650 to 41589. 6.1.1. Main and Rx-diversity Antenna Interfaces Reference Design A reference circuit design for main and Rx-diversity antenna interfaces is shown as below. A -type matching circuit should be reserved for better RF performance, and the -type matching components

(R1/C1/C2, R2/C3/C4) should be placed as close to the antennas as possible. The capacitors are not mounted by default and resistors are 0. Figure 33: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces SC600Y&SC600T_Hardware_Design 95 / 128 ANT_MAINR1 0RC1ModuleMainantennaNMC2NMR2 0RC3DiversityantennaNMC4NMANT_DRX Smart LTE Module Series SC600Y&SC600T Hardware Design 6.1.2. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled to 50. The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the clearance between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 34: Microstrip Design on a 2-layer PCB Figure 35: Coplanar Waveguide Design on a 2-layer PCB SC600Y&SC600T_Hardware_Design 96 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right angle traces should be changed to curved ones. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times as wide as RF signal traces (2*W). SC600Y&SC600T_Hardware_Design 97 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design For more details about RF layout, please refer to document [3]. 6.2. Wi-Fi/BT Antenna Interface The pin definition of Wi-Fi/BT antenna interfaces and operating frequencies is shown below. Table 38: Pin Definition of Wi-Fi/BT Antenna Interface Pin Name Pin No. I/O Description Comment ANT_WIFI/BT 129 IO Wi-Fi/BT antenna interface 50 impedance Table 39: Wi-Fi/BT Frequency Type 802.11a/b/g/n/ac BT4.2 LE Frequency 2402~2482 5180~5825 2402~2480 Unit MHz MHz A reference circuit design for Wi-Fi/BT antenna interface is shown as below. A -type matching circuit is recommended to be reserved for better RF performance. The capacitors are not mounted by default and resistors are 0. Figure 38: Reference Circuit Design for Wi-Fi/BT Antenna Interface SC600Y&SC600T_Hardware_Design 98 / 128 ANT_WIFI/BTR1 0RC1ModuleNMC2NM Smart LTE Module Series SC600Y&SC600T Hardware Design 6.3. GNSS Antenna Interface The pin definition of GNSS antenna interfaces and operating frequencies is shown below. Table 40: Pin Definition of GNSS Antenna Pin Name Pin No. I/O Description Comment ANT_GNSS 134 AI GNSS antenna Interface 50 impedance GNSS_LNA_EN 202 DO LNA enable control For test purpose only. If unused, keep it open. Table 41: GNSS Frequency Type GPS Frequency 1575.421.023 GLONASS 1597.5~1605.8 BeiDou 1561.0982.046 Unit MHz MHz MHz 6.3.1. Recommended Circuit for Passive Antenna GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. A reference circuit design is given below. Figure 39: Reference Circuit Design for GNSS Passive Antenna NOTE When the passive antenna is placed far away from the module (that is, the antenna trace is long), it is recommended to add an external LNA circuit for better GNSS receiving performance, and the LNA should be placed close to the antenna. SC600Y&SC600T_Hardware_Design 99 / 128 Passive AntennaModuleANT_GNSSNMC1C2R1C4NM0R Smart LTE Module Series SC600Y&SC600T Hardware Design 6.3.2. Recommended Circuit for Active Antenna The active antenna is powered by a 56nH inductor through the antenna's signal path. The common power supply voltage ranges from 3.3V to 5.0V. Although featuring low power consumption, the active antenna still requires stable and clean power supplies. It is recommended to use high performance LDO as the power supply. A reference design of GNSS active antenna is shown below. Figure 40: Reference Circuit Design for GNSS Active Antenna 6.4. Antenna Installation 6.4.1. Antenna Requirements The following table shows the requirements on main antenna, Rx-diversity, Wi-Fi/BT antenna and GNSS antenna. Table 42: Antenna Requirements Antenna Type Requirements GSM/WCDMA/

LTE VSWR:2 Gain (dBi): 1 Max Input Power (W): 50 Input Impedance (): 50 Polarization Type: Vertical Cable Insertion Loss: <1dB

(GSM850, EGSM900, WCDMA B5/B6/B8/B19, LTE B5/B8/B12/B13/B14/B17/B18/B19/B20/B26/B28A/B28B/B71) Cable Insertion Loss: <1.5dB

(DCS1800, PCS1900, WCDMA B1/B2/B4, LTE B1/B2/B3/B4/B11/B21/B25/B34/B39/B66) SC600Y&SC600T_Hardware_Design 100 / 128 Active Antenna3V3ModuleANT_GNSS56nH10R1uF100pFNMNMC4C1R1L1R20RC5C3C2100pF Smart LTE Module Series SC600Y&SC600T Hardware Design Cable Insertion Loss: <2dB (LTE-FDD B7, LTE-TDD B38/B40/B41) VSWR: 2 Gain (dBi): 1 Max Input Power (W): 50 Input Impedance (): 50 Polarization Type: Vertical Cable Insertion Loss: <1dB Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: <2 (Typ.) Passive Antenna Gain: >0dBi Active Antenna Noise Figure: <1.5dB (Typ.) Active Antenna Gain: >-2dBi Active Antenna Embedded LNA Gain: <17dB (Typ.) Active Antenna Total Gain: <17dBi (Typ.) Wi-Fi/BT GNSS 1) NOTE 1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 6.4.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by HIROSE. Figure 41: Dimensions of the U.FL-R-SMT Connector (Unit: mm) SC600Y&SC600T_Hardware_Design 101 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 42: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. Figure 43: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. SC600Y&SC600T_Hardware_Design 102 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 7 Electrical, Reliability and Radio Characteristics 7.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 43: Absolute Maximum Ratings Parameter VBAT USB_VBUS Current on VBAT Voltage on Digital Pins Min

-0.5

-0.5 0

-0.3 Max Unit 6 16 3 2.3 V V A V 7.2. Power Supply Ratings Table 44: SC600Y&SC600T Modules Power Supply Ratings Parameter Description Conditions Min Typ. Max Unit VBAT stay between the minimum and 3.55 3.8 4.4 V The actual input voltages must VBAT Voltage drop during transmitting burst maximum values. Maximum power control level at EGSM900 400 mV SC600Y&SC600T_Hardware_Design 103 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Parameter Description Conditions Min Typ. Max Unit Peak supply IVBAT current (during transmission slot) USB_VBUS Power supply VRTC voltage of backup battery. Maximum power control level at EGSM900 1.8 3.0 A 4.0 5.0 10 V 2.0 3.0 3.25 V 7.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table. Table 45: Operation and Storage Temperatures Parameter Min Operating temperature range 1)

-35 Extended temperature range 2)

-40 Storage temperature range

-40 Typ.

+25 Max Unit

+65

+75

+90 C C C NOTES 1. 2. 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. SC600Y&SC600T_Hardware_Design 104 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 7.4. Current Consumption The current consumption of different conditions is listed in the following table. Table 46: SC600Y-JP*/SC600T-JP* Current Consumption OFF state Power down WCDMA supply current LTE-FDD supply current Sleep (USB disconnected)

@DRX=6 Sleep (USB disconnected)

@DRX=8 Sleep (USB disconnected)

@DRX=9 Sleep (USB disconnected)

@DRX=6 Sleep (USB disconnected)

@DRX=8 Sleep (USB disconnected) LTE-TDD supply

@DRX=6 current Sleep (USB disconnected) IVBAT WCDMA voice call WCDMA data transfer

@DRX=8 B1 @max power B6 @max power B8 @max power B19 @max power B1 (HSDPA) @max power B6 (HSDPA) @max power B8 (HSDPA) @max power B19 (HSDPA) @max power B1 (HSUPA) @max power B6 (HSUPA) @max power B8 (HSUPA) @max power B19 (HSUPA) @max power 80 4.568 3.093 2.995 4.128 3.148 3.952 3.025 567 586 554 589 500 530 500 535 512 545 506 550 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC600Y&SC600T_Hardware_Design 105 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design LTE data transfer LTE-FDD B1 @max power LTE-FDD B3 @max power LTE-FDD B5 @max power LTE-FDD B8 @max power LTE-TDD B11 @max power LTE-TDD B18 @max power LTE-TDD B19 @max power LTE-TDD B21 @max power LTE-TDD B26 @max power LTE-TDD B28A @max power LTE-TDD B28B @max power LTE-TDD B41 @max power 535 590 505 520 512 555 500 520 530 640 585 490 mA mA mA mA mA mA mA mA mA mA mA mA Table 47: SC600Y-EM*/SC600T-EM* Current Consumption Parameter Description Conditions Min Typ. Max Unit OFF state Power down Sleep (USB disconnected)

@DRX=2 GSM supply current Sleep (USB disconnected)

@DRX=5 IVBAT WCDMA supply current Sleep (USB disconnected)

@DRX=9 Sleep (USB disconnected)

@DRX=6 Sleep (USB disconnected)

@DRX=8 Sleep (USB disconnected)

@DRX=9 LTE-FDD supply current Sleep (USB disconnected)

@DRX=6 80 uA TBD mA TBD mA TBD mA 3.471 mA 3.109 mA 2.747 mA 3.85 mA SC600Y&SC600T_Hardware_Design 106 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Sleep (USB disconnected)

@DRX=8 Sleep (USB disconnected) LTE-TDD supply

@DRX=6 current Sleep (USB disconnected) GSM voice call

@DRX=8 GSM850 @PCL 5 GSM850 @PCL 12 GSM850 @PCL 19 EGSM900 @PCL 5 EGSM900 @PCL 12 EGSM900 @PCL 19 DCS1800 @PCL 0 DCS1800 @PCL 7 DCS1800 @PCL 15 PCS1900 @PCL 0 PCS1900 @PCL 7 PCS1900 @PCL 15 B1 @max power B2 @max power WCDMA voice call B4 @max power B5 @max power B8 @max power GSM850 (1UL/4DL) @PCL 5 GSM850 (2UL/3DL) @PCL 5 GPRS data transfer GSM850 (3UL/2DL) @PCL 5 GSM850 (4UL/1DL) @PCL 5 EGSM900 (1UL/4DL) @PCL 5 2.959 mA 4.273 mA 3.173 mA 230 95 80 240 100 80 175 108 103 170 107 103 550 520 480 550 500 TBD TBD TBD TBD TBD mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC600Y&SC600T_Hardware_Design 107 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design EGSM900 (2UL/3DL) @PCL 5 EGSM900 (3UL/2DL) @PCL 5 EGSM900 (4UL/1DL) @PCL 5 DCS1800 (1UL/4DL) @PCL 0 DCS1800 (2UL/3DL) @PCL 0 DCS1800 (3UL/2DL) @PCL 0 DCS1800 (4UL/1DL) @PCL 0 PCS1900 (1UL/4DL) @PCL 0 PCS1900 (2UL/3DL) @PCL 0 PCS1900 (3UL/2DL) @PCL 0 PCS1900 (4UL/1DL) @PCL 0 GSM850 (1UL/4DL) @PCL 8 GSM850 (2UL/3DL) @PCL 8 GSM850 (3UL/2DL) @PCL 8 GSM850 (4UL/1DL) @PCL 8 EGSM900 (1UL/4DL) @PCL 8 EGSM900 (2UL/3DL) @PCL 8 EGSM900 (3UL/2DL) @PCL8 EGSM900 (4UL/1DL) @PCL 8 DCS1800 (1UL/4DL) @PCL 2 DCS1800 (2UL/3DL) @PCL 2 DCS1800 (3UL/2DL) @PCL 2 DCS1800 (4UL/1DL) @PCL 2 PCS1900 (1UL/4DL) @PCL 2 PCS1900 (2UL/3DL) @PCL 2 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EDGE data transfer SC600Y&SC600T_Hardware_Design 108 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design WCDMA data transfer PCS1900 (3UL/2DL) @PCL 2 PCS1900 (4UL/1DL) @PCL 2 B1 (HSDPA) @max power B2 (HSDPA) @max power B4 (HSDPA) @max power B5 (HSDPA) @max power B8 (HSDPA) @max power B1 (HSUPA) @max power B2 (HSUPA) @max power B4 (HSUPA) @max power B5 (HSUPA) @max power B8 (HSUPA) @max power LTE-FDD B1 @max power LTE-FDD B2 @max power LTE-FDD B3 @max power LTE-FDD B4 @max power LTE-FDD B5 @max power LTE-FDD B7 @max power LTE data transfer LTE-FDD B8@max power LTE-FDD B20 @max power LTE-FDD B28A @max power LTE-FDD B28B @max power LTE-TDD B38 @max power LTE-TDD B39 @max power LTE-TDD B40 @max power TBD TBD 540 480 470 490 470 560 490 480 505 480 670 600 730 570 560 780 570 510 640 650 490 320 370 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC600Y&SC600T_Hardware_Design 109 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design LTE-TDD B41 @max power 450 mA Table 48: SC600Y-NA*/SC600T-NA* Current Consumption Parameter Description Conditions Min Typ. Max Unit OFF state Power down WCDMA supply current LTE-FDD supply current Sleep (USB disconnected)

@DRX=6 Sleep (USB disconnected)

@DRX=8 Sleep (USB disconnected)

@DRX=9 Sleep (USB disconnected)

@DRX=6 Sleep (USB disconnected)

@DRX=8 Sleep (USB disconnected) LTE-TDD supply

@DRX=6 current Sleep (USB disconnected)

@DRX=8 B2 @max power WCDMA voice call B4@max power IVBAT B5 @max power B2 (HSDPA) @max power B4 (HSDPA) @max power B5 (HSDPA) @max power B2 (HSUPA) @max power B4 (HSUPA) @max power B5 (HSUPA) @max power LTE-FDD B2 @max power LTE-FDD B4 @max power WCDMA data transfer LTE data transfer 80 3.724 3.076 2.603 3.835 2.998 4.192 2.987 600 600 540 530 550 490 550 545 490 610 660 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC600Y&SC600T_Hardware_Design 110 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design LTE-FDD B5 @max power LTE-FDD B7 @max power LTE-FDD B12 @max power LTE-FDD B13 @max power LTE-TDD B14 @max power LTE-TDD B17 @max power LTE-TDD B25 @max power LTE-TDD B26 @max power LTE-TDD B66 @max power LTE-TDD B71 @max power LTE-TDD B41 @max power 550 780 520 560 500 470 670 560 650 580 370 mA mA mA mA mA mA mA mA mA mA mA 7.5. RF Output Power The following table shows the RF output power of SC600Y&SC600T modules. Table 49: SC600Y-JP*/SC600T-JP* RF Output Power Frequency WCDMA B1 WCDMA B6 WCDMA B8 WCDMA B19 LTE-FDD B1 LTE-FDD B3 LTE-FDD B5 Max Min 24dBm+1/-3dB

<-49dBm 24dBm +1/-3dB

<-49dBm 24dBm +1/-3dB

<-49dBm 24dBm +1/-3dB

<-49dBm 23dBm2dB 23dBm2dB 23dBm2dB

<-39dBm

<-39dBm

<-39dBm

<-39dBm LTE-FDD B8 23dBm2dB SC600Y&SC600T_Hardware_Design 111 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB LTE-FDD B11 LTE-FDD B18 LTE-FDD B19 LTE-FDD B21 LTE-FDD B26 LTE-FDD B28A LTE-TDD B28B LTE-TDD B41 Table 50: SC600Y-EM*/SC600T-EM* RF Output Power Frequency Max GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 33dBm2dB 33dBm2dB 30dBm2dB 30dBm2dB 24dBm+1/-3dB 24dBm+1/-3dB 24dBm+1/-3dB 24dBm+1/-3dB 24dBm+1/-3dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm Min 5dBm5dB 5dBm5dB 0dBm5dB 0dBm5dB

<-49dBm

<-49dBm

<-49dBm

<-49dBm

<-49dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm SC600Y&SC600T_Hardware_Design 112 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B20 LTE-FDD B28A LTE-FDD B28B LTE-TDD B41 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB Table 51: SC600Y-NA*/SC600T-NA* RF Output Power Frequency WCDMA B2 WCDMA B4 WCDMA B5 LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B25 LTE-FDD B26 LTE-FDD B66 LTE-FDD B71 LTE-TDD B41 Max 24dBm+1/-3dB 24dBm+1/-3dB 24dBm+1/-3dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm Min

<-49dBm

<-49dBm

<-49dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm SC600Y&SC600T_Hardware_Design 113 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3dB. This design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 7.6. RF Receiving Sensitivity The following table shows the conducted RF receiving sensitivity of SC600Y&SC600T modules. Table 52: SC600Y-JP*/SC600T-JP* RF Receiving Sensitivity Frequency Receive Sensitivity (Typ.) Primary Diversity SIMO 3GPP (SIMO) WCDMA B1

-109.5 WCDMA B6 WCDMA B8 WCDMA B19

-112

-111.5

-111.5 LTE-FDD B1 (10M)

-99 LTE-FDD B3 (10M)

-98.4 LTE-FDD B5 (10M)

-99 LTE-FDD B8 (10M)

-98.7 LTE-FDD B11 (10M)

-98.2 LTE-FDD B18(10M)

-99.2 LTE-FDD B19 (10M)

-99.2 LTE-FDD B21(10M)

-97.7 LTE-FDD B26 (10M)

-99 LTE-FDD B28A (10M)

-96.7 LTE-FDD B28B(10M)

-96.5 LTE-TDD B41 (10M)

-96.8

-111.5

-109.5

-111.5

-109.5 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

-101.2

-101.2

-101.7

-101.2

-106.7dBm

-106.7dBm

-104.7dBm

-106.7dBm

-96.3dBm

-93.3dBm

-94.3dBm

-93.3dBm

-100.5

-96.3dBm

-102.2

-101.7

-96.3dBm

-96.3dBm

-100.7

-96.3dBm

-101.7

-100.6

-100.4

-99.7

-93.8dBm

-94.8dBm

-94.8dBm

-94.3dBm SC600Y&SC600T_Hardware_Design 114 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Table 53: SC600Y-EM*/SC600T-EM* RF Receiving Sensitivity Receive Sensitivity (Typ.) Primary Diversity SIMO 3GPP (SIMO) Frequency GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5

-111

-100.9

-109.3

-109.3

-112

-112

-112

-113 WCDMA B8

-111 LTE-FDD B1 (10M)

-97.4 LTE-FDD B2 (10M)

-97.9 LTE-FDD B3 (10M)

-96.8 LTE-FDD B4 (10M)

-97.7 LTE-FDD B5 (10M)

-98.2

/

/

/

/

-111

-110

-111

-111

-111

-98.1

-97.9

-98

-97.8

-98.7 LTE-FDD B7 (10M)

-96.5

-97.3 LTE-FDD B8 (10M)

-98.7 LTE-FDD B20 (10M)

-97.9 LTE-FDD B28A (10M)

-98.3 LTE-FDD B28B (10M)

-97.7 LTE-TDD B38 (10M)

-97.8 LTE-TDD B39 (10M)

-97 LTE-TDD B40 (10M)

-97.9

-98.5

-98.9

-97.9

-97.4

-97.2

-98.7

-96.9

/

/

/

/

TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

-102.4dBm

-102.4dBm

-102.4dBm

-102.4dBm

-106.7dBm

-106.7dBm

-10dBm

-104.7dBm

-104.7dBm

-96.3dBm

-94.3dBm

-93.3dBm

-96.3dBm

-94.3dBm

-94.3dBm

-93.3dBm

-93.3dBm

-94.8dBm

-94.8dBm

-96.3dBm

-96.3dBm

-96.3dBm SC600Y&SC600T_Hardware_Design 115 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design LTE-TDD B41 (10M)

-97.7

-96.7 TBD

-94.3dBm Table 54: SC600Y-NA*/SC600T-NA* RF Receiving Sensitivity Frequency Receive Sensitivity (Typ.) Primary Diversity WCDMA B2

-110

-110.5 WCDMA B4

-110.5

-110.5 WCDMA B5

-111 LTE-FDD B2 (10M)

-98.9 LTE-FDD B4 (10M)

-99 LTE-FDD B5 (10M)

-100.2 LTE-FDD B7 (10M)

-97.8 LTE-FDD B12 (10M)

-97.8 LTE-FDD B13 (10M)

-97.1 LTE-FDD B14 (10M)

-98.5 LTE-FDD B17 (10M)

-97.9 LTE-FDD B25 (10M)

-99.3 LTE-FDD B26 (10M)

-100.2 LTE-FDD B66 (10M)

-99.2 LTE-FDD B71 (10M)

-97.6 LTE-TDD B41 (10M)

-97.7

-111 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD SIMO TBD TBD TBD

-101.2

-100

-101.7

-99.7

-100

-100.5

-100.3

-100.7

-100.7

-101.7 3GPP (SIMO)

-106.7dBm

-104.7dBm

-104.7dBm

-94.3dBm

-96.3dBm

-94.3dBm

-94.3dBm

-93.3dBm

-93.3dBm

-93.3dBm

-93.3dBm

-92.8dBm

-93.8dBm

-101.2

-95.8dBm

-100.3

-93.5dBm

-99.7

-94.3dBm 7.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general. Consequently, it should be subject to ESD handling precautions that are typically applied to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. SC600Y&SC600T_Hardware_Design 116 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design The following table shows the electrostatic discharge characteristics of SC600Y&SC600T modules. Table 55: ESD Characteristics (Temperature: 25C, Humidity: 45%) Test Points Contact Discharge Air Discharge Unit VBAT, GND

+/-5 All Antenna Interfaces

+/-5 Other Interfaces

+/-0.5

+/-10

+/-10

+/-1 KV KV KV SC600Y&SC600T_Hardware_Design 117 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 8 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the tolerances for dimensions without tolerance values are 0.05mm. 8.1. Mechanical Dimensions of the Module Figure 44: Module Top and Side Dimensions SC600Y&SC600T_Hardware_Design 118 / 128 Side viewTop viewPin1 Smart LTE Module Series SC600Y&SC600T Hardware Design Figure 45: Module Bottom Dimensions (Top View) SC600Y&SC600T_Hardware_Design 119 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 8.2. Recommended Footprint Figure 46: Recommended Footprint (Top View) NOTES 1. For easy maintenance of the module, keep about 3mm between the module and other components on host PCB. 2. All RESERVED pins should be kept open and MUST NOT be connected to ground. SC600Y&SC600T_Hardware_Design 120 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 8.3. Top and Bottom View of the Module Figure 47: Top View of SC600Y&SC600T Modules Figure 48: Bottom View of SC600Y&SC600T Modules NOTE These are renderings of SC600Y&SC600T modules. For authentic dimension and appearance, please refer to the module that you receive from Quectel. SC600Y&SC600T_Hardware_Design 121 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 9 Storage, Manufacturing and Packaging 9.1. Storage SC600Y&SC600T are stored in a vacuum-sealed bag. They are rated at MSL 3, and their storage restrictions are shown as below. 1. Shelf life in the vacuum-sealed bag: 12 months at <40C/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:

Mounted within 168 hours at the factory environment of 30C/60%RH. Stored at <10%RH. 3. Devices require baking before mounting, if any circumstance below occurs. When the ambient temperature is 23C5C and the humidity indication card shows the humidity is >10% before opening the vacuum-sealed bag. Device mounting cannot be finished within 168 hours at factory conditions of 30C/60%. 4. If baking is required, devices may be baked for 8 hours at 120C5C. NOTE As the plastic package cannot be subjected to high temperature, it should be removed from devic es before high temperature (120C) baking. If shorter baking time is desired, please refer to IPC/J EDECJ-STD-033 for baking procedure. SC600Y&SC600T_Hardware_Design 122 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 9.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18mm~0.20mm. It is recommended to slightly reduce the amount of solder paste for LGA pads, thus avoiding short-circuit. For more details, please refer to document [4]. It is suggested that the peak reflow temperature is 238~245C, and the absolute maximum reflow temperature is 245C. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 49: Recommended Reflow Soldering Thermal Profile Table 56: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 1 to 3C/sec Soak time (between A and B: 150C and 200C) 60 to 120 sec SC600Y&SC600T_Hardware_Design 123 / 128 Temp. (C)Reflow ZoneSoak Zone245200220238CDBA150100Max slope: 1~3C/secCooling down slope: 1~4C/secMax slope: 2~3C/sec Smart LTE Module Series SC600Y&SC600T Hardware Design Reflow Zone Max slope Reflow time (D: over 220C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle 9.3. Packaging 2 to 3C/sec 40 to 60 sec 238C ~ 245C 1 to 4C/sec 1 SC600Y&SC600T are packaged in tape and reel carriers. Each reel is 330mm in diameter and contains 200 modules. The following figures show the package details, measured in mm. Figure 50: Tape Dimensions SC600Y&SC600T_Hardware_Design 124 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design Figure 51: Reel Dimensions Table 57: Reel Packaging Model Name MOQ for MP Minimum Package: 200pcs Minimum Package4=800pcs SC600Y&

SC600T 200 Size: 398mm 383mm 83mm Size: 420mm 350mm 405mm N.W: 1.92kg G.W: 3.67kg N.W: 8.18kg G.W: 15.18kg SC600Y&SC600T_Hardware_Design 125 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 10 Appendix A References Table 58: Related Documents SN Document Name Remark

[1]

Quectel_Smart_EVB-G2_User_Guide

[2]

Quectel_SC600Y&SC600T_GPIO_Configuration EVB User Guide for SC600Y&SC600T GPIO Configuration of SC600Y&SC600T

[3]

Quectel_RF_Layout_Application_Note RF Layout Application Note

[4]

Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide

[5]

Quectel_ SC600Y&SC600T_Reference_Design Reference Design for SC600Y&SC600T Table 59: Terms and Abbreviations Abbreviation Description ADC AMR bps CS CSD CTS DRX EFR EGSM ESD Analog-to-Digital Converter Adaptive Multi-rate Bits per Second Coding Scheme Circuit Switched Data Clear to Send Discontinuous Reception Enhanced Full Rate Extended GSM900 band (includes standard GSM900 band) Electrostatic Discharge SC600Y&SC600T_Hardware_Design 126 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design FR GMSK GPS GPU GSM HR HSDPA HSPA I/O IQ LCD LCM LED LNA LRA MIPI PCB PDU PMI PMU PSK QAM QPSK RF RH Full Rate Gaussian Minimum Shift Keying Global Positioning System Graphics Processing Unit Global System for Mobile Communications Half Rate High Speed Down Link Packet Access High Speed Packet Access Input/Output Inphase and Quadrature Liquid Crystal Display LCD Module Light Emitting Diode Low Noise Amplifier Linear Resonant Actuator Mobile Industry Processor Interface Printed Circuit Board Protocol Data Unit Power Management Interface Power Management Unit Phase Shift Keying Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Relative Humidity SC600Y&SC600T_Hardware_Design 127 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design RHCP RTC Rx SMS TE TX UART UMTS

(U)SIM Vmax Vnorm Vmin VI VIHmin VILmax VO VOHmin VOLmax VSWR Right Hand Circularly Polarized Real Time Clock Receive Short Message Service Terminal Equipment Transmitting Direction Universal Asynchronous Receiver & Transmitter Universal Mobile Telecommunications System

(Universal) Subscriber Identity Module Maximum Voltage Value Normal Voltage Value Minimum Voltage Value Voltage Input Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Voltage Output Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access SC600Y&SC600T_Hardware_Design 128 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 11 Appendix B GPRS Coding Schemes Table 60: Description of Different Coding Schemes Scheme Code Rate USF Pre-coded USF CS-1 CS-2 CS-3 CS-4 1/2 3 3 2/3 3/4 3 6 3 6 Radio Block excl.USF and BCS 181 268 312 BCS Tail Coded Bits Punctured Bits 40 4 456 0 16 4 588 132 16 4 676 220 1 3 12 428 16

-

456

-

Data Rate Kb/s 9.05 13.4 15.6 21.4 SC600Y&SC600T_Hardware_Design 129 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 12 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 61: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1 2 2 3 2 3 3 4 3 4 4 4 3 4 1 1 2 1 2 2 3 1 2 2 3 4 3 4 2 3 3 4 4 4 4 5 5 5 5 5 NA NA SC600Y&SC600T_Hardware_Design 130 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 5 6 7 8 6 6 6 6 6 8 8 8 8 8 8 5 5 5 5 5 6 7 8 2 3 4 4 6 2 3 4 4 6 8 1 2 3 4 NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA 6 6 6 6 SC600Y&SC600T_Hardware_Design 131 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Design 13 Appendix D EDGE Modulation and Coding Schemes Table 62: EDGE Modulation and Coding Schemes Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot Coding Schemes CS-1:

CS-2:

CS-3:

CS-4:

GMSK GMSK GMSK GMSK MCS-1 GMSK MCS-2 GMSK MCS-3 GMSK MCS-4 GMSK MCS-5 8-PSK MCS-6 8-PSK MCS-7 8-PSK MCS-8 8-PSK MCS-9 8-PSK

/

/

/

/

C B A C B A B A A 9.05kbps 18.1kbps 36.2kbps 13.4kbps 26.8kbps 53.6kbps 15.6kbps 31.2kbps 62.4kbps 21.4kbps 42.8kbps 85.6kbps 8.80kbps 17.60kbps 35.20kbps 11.2kbps 22.4kbps 44.8kbps 14.8kbps 29.6kbps 59.2kbps 17.6kbps 35.2kbps 70.4kbps 22.4kbps 44.8kbps 89.6kbps 29.6kbps 59.2kbps 118.4kbps 44.8kbps 89.6kbps 179.2kbps 54.4kbps 108.8kbps 217.6kbps 59.2kbps 118.4kbps 236.8kbps SC600Y&SC600T_Hardware_Design 132 / 128 Smart LTE Module Series SC600Y&SC600T Hardware Desig n IC & FCC Requirement FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2019SC600NA 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

Operating Band WCDMA BAND II WCDMA BAND IV WCDMA BAND V LTE BAND 2 LTE BAND 4 LTE BAND 5 LTE BAND 7 LTE BAND 12 LTE BAND 13 LTE BAND 14 LTE BAND 17 LTE BAND 25 LTE BAND 26(814-824) LTE BAND 26(824-849) LTE BAND 41 LTE BAND 66 LTE BAND 71 Bluetooth/ Bluetooth BLE FCC Max Antenna GaindBi IC Max Antenna GaindBi 9 6 10.42 9 6 10.41 9 9.7 10.16 10.23 9.7 9 10.36 10.41 9 6 8.15 NA 8 5 8.26 8 5 8.25 8 7.76 8.09 8.13 7.79 8 NA 8.25 8 5 7.62 NA SC600Y&SC600T Hardware Design 1 / 1 Smart LTE Module Series SC600Y&SC600T Hardware Desig n WIFI 2.4G/5G NA NA 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR2019SC600NA or Contains FCC ID: XMR2019SC600NA must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User SC600Y&SC600T Hardware Design 2 / 2 Smart LTE Module Series SC600Y&SC600T Hardware Desig n The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-2019SC600NA or where: 10224A-2019SC600NA is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A-2019SC600NA " ou "o: 10224A-2019SC600NA est le numro de certification du module". SC600Y&SC600T Hardware Design 3 / 3