FCC ID: XMR202006EC25AUX LTE Module

 

Preliminary Datasheet Vanchip Confidential VC7916-62 Linear RF Power Amplifier For Quad-Band GSM/GPRS/EDGE /TD-SCDMA/TDD-LTE With SP16T Antenna Switch Product IDVC7916-62 Version1.0 Preliminary Datasheet Vanchip Technologies All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 1 Preliminary Datasheet Vanchip Confidential VC7916-62 Revision History Version 1.0 Date May 2, 2018 Author Vanchip Datasheet Modify Description All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 2 Preliminary Datasheet Vanchip Confidential VC7916-62 Features

Small package: 5.5 x 5.3 x 0.83mm

8KV ESD Protection at Antenna Port

MIPI RFFE Digital Interface

Integrated Antenna Switches

Linear EDGE Operation

14 Low Insertion Loss TRx Ports

TRx Ports interchangeable

Integrated Low Pass TX Harmonic Filter

Advanced HBT/CMOS/SOI Process

GPRS multi-mode capability Class 12

Support TD-SCDMA B34/B39

Support TDD-LTE B34/B39 Product Description The VC7916-62 is a high-power, high-efficiency transmit and receive Front-End Module for Quad-band GSM850/GSM900/DCS1800/PCS1900 operation. The FEM also supports Class 12 GPRS multi-slot operation ,linear EDGE operation ,TD-SCDMA HSPA and TDD-LTE. This FEM builds upon Vanchips unique power amplifier technology to provide maximum efficiency and over current protection, reduce output power variation under mismatched load. Integrated antenna switch module reduces PCB size, and interchangeable TRx ports are easy for layout and application. The module provides 50 matched input and output ports. The VC7916-62 can sustain 8KV ESD at Antenna port without external components. The module can sustain 20:1 VSWR mismatched condition on Antenna Port.

Support APT, buck DC-DC supply VC7916-62 Function Block Diagram All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 3 Preliminary Datasheet Vanchip Confidential Absolute Maximum Ratings 1,2,3 VC7916-62 Parameter Symbol Typ. Max. Supply Power Control Voltage Input RF Power Max. Burst Duty Cycle Output Load VSWR (Ruggedness) Current Continuous During Burst 3 MIPI Supply Voltage MIPI Data and Clock Voltage Operating Case Temperature Storage Temperature Reflow Solder Temperature (J-STD-020B) Moisture Sensitivity Level ESD Antenna Port ESD All Pins (Charge Device Model) ESD All Pins (Human Body Model) VBATT Vramp Pin DT Ru I_VBATT VIO V_SDATA,SCLK T_CASE T_STG T_SOLDER MSL ESD_ANT ESD_CDM ESD_HBM Min.

-1.2

-0.3

-8

-1

-1

-30

-40

+260 20:1 2.5

+100

+150 6 3 15 50 2 2 3

+8

+1

+1 Unit V V dBm

VSWR A V V C C C KV KV KV 1. 2. Exceeding any one more maximum rating conditions for extended periods may reduce device reliability and also may cause permanent damage to the device. There is no damage to device with only one parameter set at the limit at a time and all other parameters set at recommended operating conditions. 3. Applied voltage must be current-limited to specified range. Parameter Symbol Unit Test Condition Recommended Operating Conditions1,2 Supply Voltage VCC Supply Voltage VBATT MIPI Supply MIPI Signal Level (SCLK,SDATA) Leakage Current (VBATT) TRx Mode Current Operating Temperature Range VCC VBATT VIO V_MIPI_LOW V_MIPI_HIGH I_LEAK I_TRx T_range Typ. 3.5 3.5 1.8 Min 3.1 0.9 1.65 0 0.8*VIO 1.8 150

+25

-25 Max 4.6 4.6 1.95 0.2*VIO VIO 20 300

+85 Normal Test Condition (NTC), defined as VBATT = VCC = 3.5V, Ta = 25C 1. 2. Extreme Test Condition (ETC), defined as VBATT = VCC = 3.1V to 4.6V, T = T_range Signal Level Low Signal Level High Applied DC Only VCC = VBATT = 4.6V, VIO = 0V Ta= 25C All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 4 V V V V V uA uA C Preliminary Datasheet Vanchip Confidential VC7916-62 MIPI RFFE REGISTER MAP (1) Description R/W Default Trigger Mode Notes Register 0, Address 0x00 (Mode Control) Trigger0 R/W 0 Linear GMSK Power Control register map Data Bit

[7]

[6:3]

[2]

[1:0]

[4:0]

Register Map and Power Control Selector PA Bias Mode Control PA Enable Power Gain Mode Switch Control

[7:0]

Reserved Trigger0 R/W 00000000 Reserved Register 2, Address 0x02 (Switch Control)

[7:5]

Reserved Trigger0 R/W 000 0100 = B34/39 TD-SCDMA 0110 = LB Switch OUT 0111 = HB Switch OUT 0101 = B34/39 TDD LTE 0011 = HB GMSK 0000 0 00 0000 = LB EDGE 0001 = HB EDGE 0010 = LB GMSK 0 = PA Tx Disabled, 1 = PA Tx Enabled 00 = High Power Mode (HPM) 01 = Mid Power Mode (MPM) 10 = Low Power Mode (LPM) 11 = Ultra-Low Power Mode (ULPM) Register 1, Address 0x01 (Reserved) 0x08 = TRx4 0x09 = LB PA Tx 0x0A = Forward Isolation Reserved 0x00 = Standby 0x01 = TRx10 0x02 = TRx9 0x03 = Forward Isolation 0x0B = HB PA Tx 0x04 = TRx5 0x05 = TRx7 0x06 = TRx6 0x07 = TRx8 0x0C = TRx3 0x0E = Forward Isolation 0x10 = TRx1 0x11 = TRx2 0x12 = TRx11 0x13 = TRx12 0x14 = TRx13 0x15 = TRx14 00000 Other = Reserved (Do Not Use)

[7:0]

Reserved Trigger0 R/W 00000000 Reserved

[7:0]

Reserved Trigger0 R/W 00000000 Reserved

[7:0]

Reserved Trigger0 R/W 00000000 Reserved

[7:0]

Reserved Trigger0 R/W 00000000 Reserved Register 3, Address 0x03 (RESERVED) Register 4, Address 0x04 (RESERVED) Register 5, Address 0x05 (RESERVED) Register 6, Address 0x06 (RESERVED) All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 5 Preliminary Datasheet Vanchip Confidential VC7916-62 MIPI RFFE REGISTER MAP (2) Data Bit Description R/W Default Trigger Mode Notes Register 26, Address 0x1A (RFFE Status) No R/W

[7]

Software Reset Reset all configurable registers to the default values except for USID, GROUP_SID, and PM_TRIG. The RFFE_STATUS register should be reset after it is read. 0: normal operation ; 1: software reset. Command Sequence received with parity error discard command. The RFFE_STATUS register shall reset after it is read. Command length error. The RFFE_STATUS register shall reset after it is read. Address frame with parity error. The RFFE_STATUS register shall reset after it is read. Data frame with parity error. The RFFE_STATUS register shall reset after it is read. Read command to an invalid address. The RFFE_STATUS register shall reset after it is read. Write command to an invalid address. The RFFE_STATUS register shall reset after it is read. Read command with a BROADCAST_ID or GROUP_ID. The RFFE_STATUS register shall reset after it is read. 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Command_Frame _parity_Err Command_Length _parity_Err Address_Frame _parity_Err Data_Frame _parity_Err Read_Unused_Reg Write_Unused_Reg Bid_Gid_Err

[7:6]

PWR_MODE Trigger Mask 2 Trigger Mask 1 Trigger Mask 0 Trigger Register 2 Trigger Register 1 Trigger Register 0

[6]

[5]

[4]

[3]

[2]

[1]

[0]

[5]

[4]

[3]

[2]

[1]

[0]

[7:4]

[3:0]

Reserved Group SID No R/W 0000 0000 Reserved Group slave ID Register 27, Address 0x1B (GROUP_ID) No R/W Register 28, Address 0x1C (PM_TRIG) 00 00 = Normal Operation (Active) 01 = Default Settings (Startup) 10 = Low Power 11 = Reserved Trigger Enable: 0, Trigger Disable: 1 Trigger Enable: 0, Trigger Disable: 1 Trigger Enable: 0, Trigger Disable: 1 Not supported

(Reserved) 1 = Latch Register 0,1 contents

[7:0]

Product ID

[7:0]

Manufacturer ID

[7:6]

[5:4]

[3:0]

Reserved Manufacturer_ID[MSB]

USID No No No R R R/W R Register 29, Address 0x1D (PROD_ID) 10010110 Product ID[7:0] = 0x96 Register 30, Address 0x1E (MAN_ID) 00111000 Manufacture ID[7:0] = 0x38 Register 31, Address 0x1F (USID) 00 11 1110 Reserved Manufacture ID[9:8] = 0x3 USID = 0xE All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 6 Preliminary Datasheet Vanchip Confidential VC7916-62 Table 1: GMSK and 8-PSK Recommended Operation Power Mode GSM Band Waveform PA Power Mode LB GSM850/GSM900 HB DCS1800/PCS1900 GMSK 8-PSK GMSK 8-PSK High Power Mode (HPM) Medium Power Mode (MPM) Low Power Mode (LPM) Ultra Low Power Mode (ULPM) Medium Power Mode (MPM) Low Power Mode (LPM) Ultra Low Power Mode (ULPM) High Power Mode (HPM) Medium Power Mode (MPM) Low Power Mode (LPM) Ultra-Low Power Mode (ULPM) Medium Power Mode (MPM) Low Power Mode (LPM) Ultra Low Power Mode (ULPM) PRATED 33 29 23 15 27.5 21.5 15.5 30 28.5 22.5 14.5 26.5 20.5 14.5 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 7 Preliminary Datasheet Vanchip Confidential VC7916-62 Electrical Specifications (GSM850/GSM900 GMSK Mode) Test Condition: NTC, VBATT = VCC = 3.5V, Ta = 25C , Duty Cycle = 25% , Reference to Table 1, unless otherwise specified Parameter Symbol PA Mode Condition PAE_Max_NTC GMSK_HPM Operation Frequency Max Output Power Power Added Efficiency, Max Output power Power Added Efficiency at Rated Output Power Gain at Rated Output Power f_GSM850_TX f_GSM900_TX Pout_Max_NTC Pout_Max_ETC PAE_Rated_HPM PAE_Rated_MPM PAE_Rated_LPM PAE_Rated_ULPM Gain_Rated_HPM Gain_Rated_MPM Gain_Rated_LPM Gain_Rated_ULPM Gain Variation over Temperature Gain_T Gain Variation over Voltage Gain_V Output Noise Power PN_GSM850RX PN_GSM900RX PN_DCS1800RX PN_PCS1900RX 2f0 to 13f0 S Ru Harmonic Stability Ruggedness Input VSWR Switching Transients _IN SWT_400KHz Turn On Time Turn Off Time T_ON T_OFF GMSK_HPM GMSK_HPM GMSK_HPM GMSK_MPM GMSK_LPM GMSK_ULPM GMSK_HPM GMSK_MPM GMSK_LPM GMSK_ULPM GMSK_HPM GMSK_MPM GMSK_LPM GMSK_ULPM GMSK_HPM GMSK_MPM GMSK_LPM GMSK_ULPM All GMSK PA Gain Mode at Rated Output Power All PA Gain Mode All PA Gain Mode All PA Gain Mode All PA Gain Mode GMSK_HPM GMSK_MPM GMSK_LPM GMSK_ULPM All PA Gain Mode All PA Gain Mode Typ. Max. 849 915 Min. 824 880 33 31 Unit MHz MHz dBm Pin = 8dBm dBm Pin = 8dBm, ETC Pout = Pout_Max_NTC;

Pin = 8dBm

dB 34 38 35 24 12 4 29.5 28 27 24.5

-1.5

-2

-2

-1.5

-1

-0.5

-0.5

-0.5 VCC=VBATT = 3.1V to 4.6V VBATT = VCC = 3.5V;

T = T_range dB dB dB dB dB dB dB dB dB dB dB dBm = 869 to 894MHz, RBW = 100KHz, ETC dBm = 925 to 935MHz, RBW = 100KHz, ETC dBm = 935 to 960MHz, RBW = 100KHz, ETC dBm = 1805 to 1880MHz, RBW = 100KHz, ETC dBm = 1930 to 1990MHz, RBW = 100KHz, ETC dBm Pout PRATED, ETC

+1

+2

+2

+1.5

+0.5

+0.5

+0.5

+0.5

-82

-80

-82

-90

-90

-33

-36 dBm Pout PRATED; VSWR = 6:1,all phases angles, RBW = 1MHz, ETC 20:1 VSWR No damage or permanent degradation. All phase angles, ETC 2.5:1

-28

-28

-28

-28 5 5 Pout PRATED;

T = T_range VSWR dBm 400 KHz offset; measured with 30kHz RBW, dBm dBm dBm us us from final MIPI command to 90% VRF_Peak from final MIPI command to 10% VRF_Peak All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 8 Preliminary Datasheet Vanchip Confidential VC7916-62 Electrical Specifications (DCS1800/PCS1900 GMSK Mode) (1 OF 2) Test Condition: NTC, VBATT = VCC = 3.5V, Ta = 25C , Duty Cycle = 25% , Reference to Table 1, unless otherwise specified Parameter Symbol PA Mode Condition Operation Frequency Max Output Power f_DCS1800_TX f_DCS1900_TX Pout_Max_NTC Pout_Max_ETC GMSK_HPM GMSK_HPM Power Added Efficiency, Max Output power PAE_Max_NTC GMSK_HPM Power Added Efficiency at Rated Output Power Gain at Rated Output Power Gain Variation over Temperature Gain Variation over Voltage GMSK_HPM PAE_Rated_HPM PAE_Rated_MPM GMSK_MPM GMSK_LPM PAE_Rated_LPM PAE_Rated_ULPM GMSK_ULPM Gain_Rated_HPM_DCS GMSK_HPM Gain_Rated_MPM_DCS GMSK_MPM Gain_Rated_LPM_DCS GMSK_LPM Gain_Rated_ULPM_DCS GMSK_ULPM Gain_Rated_HPM_PCS GMSK_HPM Gain_Rated_MPM_PCS GMSK_MPM Gain_Rated_LPM_PCS GMSK_LPM Gain_Rated_ULPM_PCS GMSK_ULPM GMSK_HPM GMSK_MPM GMSK_LPM GMSK_ULPM GMSK_HPM GMSK_MPM GMSK_LPM GMSK_ULPM Gain_T Gain_V Typ. Max. 1785 1910 Min. 1710 1850 30 28 Unit MHz MHz dBm dBm 31.5 34 30 27 14 5 34.5 32 31.5 30 33 31 29.5 28

-1.5

-1

-1

-0.5

-1

-0.5

-0.5

-0.5

+1.5

+1

+1

+0.5

+0.5

+0.5

+0.5

+0.5 Pin=6dBm Pin=6dBm, ETC Pout = Pout_Max_NTC;

Pin = 6 dBm

= 1710 to 1785MHz

= 1850 to 1910MHz VBATT = VCC = 3.5V;

T = T_range VCC=VBATT = 3.1V to 4.6V

dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 9 Preliminary Datasheet Vanchip Confidential VC7916-62 Electrical Specifications (DCS1800/PCS1900 GMSK Mode) (2 OF 2) Test Condition: NTC, VBATT = VCC = 3.5V, Ta = 25C , Duty Cycle = 25% , Reference to Table 1, unless otherwise specified PA Mode All GMSK PA Gain Mode Min. Typ. Max.

-90

-90

-83 Condition Unit dBm = 869 to 894MHz, RBW = 100KHz, ETC dBm = 935 to 960MHz, RBW = 100KHz, ETC dBm = 1805 to 1880MHz, RBW = 100KHz, ETC Parameter Output Noise Power Harmonic Stability Ruggedness Symbol PN_GSM850RX PN_GSM900RX PN_DCS1800RX PN_PCS1900RX 2f0 to 7f0 S Ru Input VSWR Switching Transients _IN SWT_400KHz Turn On Time Turn Off Time T_ON T_OFF All PA Gain Mode All PA Gain Mode All PA Gain Mode All PA Gain Mode GMSK_HPM GMSK_MPM GMSK_LPM GMSK_ULPM All PA Gain Mode All PA Gain Mode dBm = 1930 to 1990MHz, RBW = 100KHz, ETC dBm Pout PRATED, ETC dBm Pout PRATED; VSWR = 6:1,all phases angles, RBW = 1MHz, ETC 20:1 VSWR No damage or permanent degradation. All phase angles, ETC VSWR dBm dBm dBm dBm us us 400 KHz offset; measured with 30kHz RBW, Pout PRATED;

T = T_range from final MIPI command to 90% VRF_Peak from final MIPI command to 10% VRF_Peak

-83

-33

-36 2:1

-28

-28

-28

-28 5 5 All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 10 Preliminary Datasheet Vanchip Confidential VC7916-62 Test Condition: NTC, VBATT = VCC = 3.5V, Ta = 25C , Duty Cycle = 25% , Reference to Table 1, unless otherwise specified Electrical Specifications (GSM850/GSM900 8-PSK Mode) PA Mode Condition Typ. Max. 849 915 Parameter Operation Frequency Max Output Power PAE at Rated Output Power Gain Symbol f_GSM850_TX f_GSM900_TX Pout_Max_NTC Pout_Max_ETC PAE_Rated_MPM PAE_Rated_LPM PAE_Rated_ULPM Gain_Rated_MPM Gain_Rated_LPM Gain_Rated_ULPM Gain Variation over Temperature Gain_T Gain Variation over Voltage Gain_V Output Noise Power PN_GSM850RX PN_GSM900RX PN_DCS1800RX PN_PCS1900RX 2f0 to 13f0 S Ru _IN ACPR400KHz Harmonic Stability Ruggedness Input VSWR ACPR Min. 824 880 27.5 26

-2

-2

-2

-1

-0.5

-0.5 8-PSK_MPM 8-PSK_MPM 8-PSK_MPM 8-PSK_LPM 8-PSK_ULPM 8-PSK_MPM 8-PSK_LPM 8-PSK_ULPM 8-PSK_MPM 8-PSK_LPM 8-PSK_ULPM 8-PSK_MPM 8-PSK_LPM 8-PSK_ULPM All 8-PSK PA Gain Mode All PA Gain Mode All PA Gain Mode All PA Gain Mode All PA Gain Mode 8-PSK_MPM 8-PSK_LPM 8-PSK_ULPM 8-PSK_MPM 8-PSK_LPM 8-PSK_ULPM 15 7 4 30 29 26

-62

-65

-67 3.5

+2

+2

+2

+0.5

+0.5

+0.5

-82

-80

-82

-90

-90

-33 2.5:1

-57

-57

-57 5 3.5 3.5 Unit MHz MHz dBm dBm T = T_range

dB dB dB dB dB dB dB dB dB VBATT = VCC = 3.5V;

T = T_range VBATT = VCC = 3.1V to 4.6V dBm = 869 to 894MHz, RBW = 100KHz, ETC dBm = 925 to 935MHz, RBW = 100KHz, ETC dBm = 935 to 960MHz, RBW = 100KHz, ETC dBm = 1805 to 1880MHz, RBW = 100KHz, ETC dBm = 1930 to 1990MHz, RBW = 100KHz, ETC dBm Pout PRATED, ETC

-36 dBm 20:1 VSWR Pout PRATED; VSWR = 6:1,all phases angles, RBW = 1MHz, ETC No damage or permanent degradation. All phase angles, ETC 400 KHz offset; measured with 30kHz RBW, Pout PRATED;

VSWR dBc dBc dBc

EVM EVM Pout PRATED All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 11 Preliminary Datasheet Vanchip Confidential VC7916-62 Electrical Specifications (DCS1800/PCS1900 8-PSK Mode) Test Condition: NTC, VBATT = VCC = 3.5V, Ta = 25C , Duty Cycle = 25% , Reference to Table 1, unless otherwise specified PA Mode Condition Parameter Operation Frequency Max Output Power PAE at Rated Output Power Gain Gain Variation over Temperature Gain Variation over Voltage Gain_V Output Noise Power Symbol f_GSM1800_TX f_GSM1900_TX Pout_Max_NTC Pout_Max_ETC PAE_Rated_MPM PAE_Rated_LPM PAE_Rated_ULPM Gain_Rated_MPM Gain_Rated_LPM Gain_Rated_ULPM Gain_Rated_MPM Gain_Rated_LPM Gain_Rated_ULPM Gain_T PN_GSM850RX PN_GSM900RX PN_DCS1800RX PN_PCS1900RX 2f0 to 7f0 S Ru _IN ACPR400KHz Harmonic Stability Ruggedness Input VSWR ACPR Typ. Max. 1785 1910 Min. 1710 1850 26.5 25.5

-1.5

-1.5

-1

-1

-0.5

-0.5 8-PSK_MPM 8-PSK_MPM 8-PSK_MPM 8-PSK_LPM 8-PSK_ULPM 8-PSK_MPM 8-PSK_LPM 8-PSK_ULPM 8-PSK_MPM 8-PSK_LPM 8-PSK_ULPM 8-PSK_MPM 8-PSK_LPM 8-PSK_ULPM 8-PSK_MPM 8-PSK_LPM 8-PSK_ULPM All 8-PSK PA Gain Mode All PA Gain Mode All PA Gain Mode All PA Gain Mode All PA Gain Mode 8-PSK_MPM 8-PSK_LPM 8-PSK_ULPM 8-PSK_MPM 8-PSK_LPM 8-PSK_ULPM 16 8 4 36 35 32 34 33 30

-63

-65

-65 3.5 Unit MHz MHz dBm dBm T = T_range

dB dB dB dB dB dB dB dB dB dB dB dB

= 1710 to 1785MHz

= 1850 to 1910MHz VBATT = VCC = 3.5V;

T = T_range VBATT = VCC = 3.1V to 4.6V

+1

+1

+1

+0.5

+0.5

+0.5

-90

-90

-83

-83

-33

-36 2:1

-57

-57

-57 5 3.5 3.5 VSWR dBc dBc dBc

dBm = 869 to 894MHz, RBW = 100KHz, ETC dBm = 935 to 960MHz, RBW = 100KHz, ETC dBm = 1805 to 1880MHz, RBW = 100KHz, ETC dBm = 1930 to 1990MHz, RBW = 100KHz, ETC dBm Pout PRATED, ETC dBm Pout PRATED; VSWR = 6:1,all phases angles, RBW = 1MHz, ETC 20:1 VSWR No damage or permanent degradation. All phase angles, ETC 400 KHz offset; measured with 30kHz RBW, Pout PRATED;

EVM (w/o Predistortion) EVM Pout PRATED All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 12 Preliminary Datasheet Vanchip Confidential VC7916-62 Test Condition: NTC, VBATT = VCC = 3.5V, Ta = 25C, unless otherwise specified Signal Configuration: ETSI TS 125.102 UL reference measurement channel (12.2 kbps), 16% duty cycle. Electrical Specifications for TD-SCDMA B39 Parameter symbol PA mode Condition Min. Typ. Max. Unit 1880 25 MHz dBm 1920 Operation Frequency Max Output Power Power Gain f_Band39 Pout_Max_NTC Pout_Max_ETC Gain_MPM_NTC Gain_LPM_NTC Gain_ULPM_NTC Gain Variation over ETC Gain_ETC Adjacent Channel Leakage Power Ratio EVM Power Added Efficiency Input VSWR Harmonics ACLR1_1.6MHz_NTC ACLR2_3.2MHz_NTC ACLR1_1.6MHz_ETC ACLR2_3.2MHz_ETC EVM_RMS_NTC PAE _IN 2f0 3f0 Turn On Time Turn Off Time Stability Ruggedness 4f0 T_ON T_OFF S Ru PN_GSM900 PN_DCS1800 MPM MPM LPM ULPM MPM LPM ULPM MPM All PA Mode MPM All PA Mode All PA Mode All PA Mode All PA Mode All PA Mode Noise Power All PA Mode Spectral Emission Margin SEM1-SEM3 All PA Mode 5 24

-2

-1.5

-0.5 30 24 21.5

-40

-57 2 17 2:1

-40

-40 dBm ETC dB dB Pout = Pout_Max_NTC Pin = -35dBm dB dB dB dB dBc Pin = -35dBm Pout = Pout_Max_NTC, ETC Pin = -35dBm, ETC Pin = -35dBm, ETC Pout Pout_Max_NTC Pout Pout_Max_ETC , ETC

Pout Pout_Max_NTC Pout = Pout_Max_NTC

+2

+1

+0.5

-33

-48

-33

-46 5

-33

-33

-33 5 5 VSWR dBm dB us us Pout Pout_Max_NTC ,ETC Pout Pout_Max_NTC, Harmonics up to 12.75GHz, ETC Pout = Pout_Max_NTC, Margin to ETSI SEM mask from final MIPI command to 90% VRF_Peak from final MIPI command to 10% VRF_Peak

-36 dBm Pout Pout_Max_NTC,VSWR = 6:1, All Phase, RBW = 1MHz, ETC 20:1 VSWR No damage or permanent degradation. All phase angles, ETC

-95 dBm

= 925 to 960MHz, Pout Pout_Max_NTC, RBW = 100kHz , ETC dBm = 1805 to 1880MHz,

-84 Pout Pout_Max_NTC, RBW = 100kHz, ETC All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 13 Preliminary Datasheet Vanchip Confidential VC7916-62 Electrical Specifications for TD-SCDMA B34 Test Condition: NTC, VBATT = VCC = 3.5V, Ta = 25C, unless otherwise specified Signal Configuration: ETSI TS 125.102 UL reference measurement channel (12.2 kbps), 16% duty cycle. PA mode Parameter symbol Condition Min. Typ. Max. Unit 2010 25 24 2025 MHz dBm dBm ETC Operation Frequency Max Output Power Power Gain f_Band39 Pout_Max_NTC Pout_Max_ETC Gain_MPM_NTC Gain_LPM_NTC Gain_ULPM_NTC Gain Variation over ETC Gain_ETC Adjacent Channel Leakage Power Ratio EVM Power Added Efficiency Input VSWR Harmonics ACLR1_1.6MHz_NTC ACLR2_3.2MHz_NTC ACLR1_1.6MHz_ETC ACLR2_3.2MHz_ETC EVM_RMS_NTC PAE _IN 2f0 3f0 Turn On Time Turn Off Time Stability Ruggedness 4f0 T_ON T_OFF S Ru PN_GSM900 PN_DCS1800 MPM MPM LPM ULPM MPM LPM ULPM MPM All PA Mode MPM All PA Mode All PA Mode All PA Mode All PA Mode All PA Mode Noise Power All PA Mode Spectral Emission Margin SEM1-SEM3 All PA Mode 5

-2

-1.5

-0.5 28 22 19.5

-40

-57 2 16 2:1

-40

-40 Pout = Pout_Max_NTC Pin = -35dBm Pin = -35dBm Pout = Pout_Max_NTC, ETC Pin = -35dBm, ETC Pin = -35dBm, ETC Pout Pout_Max_NTC Pout Pout_Max_ETC , ETC Pout Pout_Max_NTC Pout = Pout_Max_NTC Pout Pout_Max_NTC , ETC Pout Pout_Max_NTC, Harmonics up to 12.75GHz, ETC Pout = Pout_Max_NTC, Margin to ETSI SEM mask dB dB dB dB dB dB dBc

VSWR dBm dB us us

+1.5

+1

+0.5

-33

-48

-33

-46 5

-33

-33

-33 5 5 from final MIPI command to 90% VRF_Peak from final MIPI command to 10% VRF_Peak

-36 dBm Pout Pout_Max_NTC,VSWR = 6:1, All Phase, RBW = 1MHz , ETC 20:1 VSWR No damage or permanent degradation. All phase angles, ETC

-95 dBm

= 925 to 960MHz, Pout Pout_Max_NTC, RBW = 100kHz, ETC dBm = 1805 to 1880MHz,

-84 Pout Pout_Max_NTC, RBW = 100kHz, ETC All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 14 Preliminary Datasheet Vanchip Confidential VC7916-62 Test Condition: NTC, VBATT = VCC = 3.5V, Ta = 25C, unless otherwise specified Signal Configuration: 3GPP TS36.101, QPSK/10MHz/12RB, 40% duty cycle, unless otherwise specified Electrical Specifications for TDD-LTE B39 Characteristics Symbol PA_mode Test Condition Typ. Max. 1920 Maximum Output Power Operating Frequency f Pout_Max_NTC Pout_Max_ETC Gain_MPM_NTC Gain_LPM_NTC Gain_ULPM_NTC Power Gain Gain Variation over ETC Gain_ETC MPM MPM LPM ULPM MPM LPM ULPM MPM E-UTRA_ACLR_NTC UTRA_ACLR1_NTC UTRA_ACLR2_NTC E-UTRA_ACLR_ETC UTRA_ACLR1_ETC UTRA_ACLR2_ETC EVM_RMS_NTC PAE All PA mode MPM Adjacent Channel Leakage Power Ratio EVM Power Added Efficiency Input VSWR Harmonic _IN 2f0 3f0 4f0 T_ON T_OFF S Ru Turn On Time Turn Off Time Stability Ruggedness Spectral Emissions Margin SEM1SEM9 5 Tx Noise in Rx Bands*

PN_B34Rx All PA mode ETC Pout = Pout_Max_NTC Pin = -35dBm Pin = -35dBm Pout = Pout_Max_NTC, ETC Pin = -35dBm, ETC Pin = -35dBm, ETC Pout Pout_Max_NTC Pout Pout_Max_ETC , ETC

Pout Pout_Max_NTC Pout = Pout_Max_NTC VSWR Min. 1880 25 24

-2

-1.5

-1 33 27 24.5

-40

-40

-43 2.5 16

-40

-40 Unit MHz dBm dB dB dB dB dB dB dBc dBm dB dBm us us dBm

+2

+1.5

+1

-33

-33

-39

-33

-33

-36 5 2:1

-33

-33

-33

-75 10 5

-36 Pout Pout_Max_NTC , ETC Pout Pout_Max_NTC, Harmonics up to 12.75GHz , ETC Pout = Pout_Max_NTC, Margin to ETSI SEM mask

= 2010 to 2025 MHz, Pout Pout_Max_NTC , RBW = 100KHz, ETC from final MIPI command to 90% VRF_Peak from final MIPI command to 10% VRF_Peak Pout Pout_Max_NTC, VSWR = 6:1 , RBW = 1MHz, ETC 20:1 VSWR No damage or permanent degradation. All phase angles, ETC

* Noise power measured with 10MHz/1RB LTE waveform. All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 15 Preliminary Datasheet Vanchip Confidential VC7916-62 Electrical Specifications for TDD-LTE B34 Test Condition: NTC, VBATT = VCC = 3.5V, Ta = 25C, unless otherwise specified Signal Configuration: 3GPP TS36.101, QPSK/10MHz/12RB, 40% duty cycle, unless otherwise specified PA_mode Characteristics Symbol Test Condition Typ. Max. 2025 Maximum Output Power Operating Frequency f Pout_Max_NTC Pout_Max_ETC Gain_MPM_NTC Gain_LPM_NTC Gain_ULPM_NTC Power Gain Gain Variation over ETC Gain_ETC MPM MPM LPM ULPM MPM LPM ULPM MPM E-UTRA_ACLR_NTC UTRA_ACLR1_NTC UTRA_ACLR2_NTC E-UTRA_ACLR_ETC UTRA_ACLR1_ETC UTRA_ACLR2_ETC EVM_RMS_NTC PAE All PA mode MPM Adjacent Channel Leakage Power Ratio EVM Power Added Efficiency Input VSWR Harmonic _IN 2f0 3f0 4f0 T_ON T_OFF S Ru Turn On Time Turn Off Time Stability Ruggedness Spectral Emissions Margin SEM1SEM9 5 Tx Noise in Rx Bands*

PN_B39Rx All PA mode ETC Pout = Pout_Max_NTC Pin = -35dBm Pin = -35dBm Pout = Pout_Max_NTC, ETC Pin = -35dBm, ETC Pin = -35dBm, ETC Pout Pout_Max_NTC Pout Pout_Max_ETC , ETC

Pout Pout_Max_NTC Pout = Pout_Max_NTC VSWR Min. 2010 25 24

-2

-2

-1 31 25.5 23

-40

-40

-43 2.5 14

-40

-40 Unit MHz dBm dB dB dB dB dB dB dBc dBm dB dBm us us dBm

+2

+1

+1

-33

-33

-39

-33

-33

-36 5 2:1

-33

-33

-33

-75 10 5

-36 20:1 VSWR Pout Pout_Max_NTC , ETC Pout Pout_Max_NTC, Harmonics up to 12.75GHz, ETC Pout = Pout_Max_NTC, Margin to ETSI SEM mask f=1880 to 2025 MHz, Pout Pout_Max_NTC , RBW = 100KHz , ETC from final MIPI command to 90% VRF_Peak from final MIPI command to 10% VRF_Peak Pout Pout_Max_NTC, VSWR = 6:1 , RBW = 1MHz, ETC No damage or permanent degradation. All phase angles, ETC

* Noise power measured with 10MHz/1RB LTE waveform. All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 16 Preliminary Datasheet Vanchip Confidential VC7916-62 Test Condition: NTC, VBATT = 3.5V, Ta = 25 C , unless otherwise specified Electrical Specifications for TRx Mode RF Ports TRx1 to TRx14 Parameter Frequency Range Insertion Loss Symbol f IL_TRx_LB IL_TRx_MB IL_TRx_HB TRx Mode Return Loss RL Isolation

( Active TRx port to any adjacent TRx port ) Isolation

( Active TRx port to any non-adjacent TRx port ) TRx Harmonics Second Order Intermodulation Distortion Third Order Intermodulation Distortion ISO_ADJ ISO_NON_ADJ 2f0/3f0 2f0_B13 IMD2 IMD3 Leakage power from Tx to TRx Ports P_LEAK Coupling Factor in TRx Mode1 TRx to TRx Switching Time CF_TRX_LB CF_TRX_MB CF_TRX_HB T_sw Min. 699 Typ. Max. 2690 1.0 0.8 1.15 0.9 1.3 1 1.5 1.2 1.3 1.1 1.55 1.25 1.7 1.4 1.9 1.6 22 17 15 26 20 17 28 23 21 30 25 22

-28

-23

-21

-12

-55

-68

-1 2 9 5 Unit MHz dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm Conditions f = 699 MHz to 960 MHz, All TRx Ports f = 1710 MHz to 1990 MHz, TRx8 f = 1710 MHz to 1990 MHz, TRx3/4/5/6/7/9/10/14 f = 1710 MHz to 1990 MHz, TRx1/2/11/12/13 f = 2010MHz to 2690 MHz,TRx8 f = 2010MHz to 2690 MHz,TRx3/4/5/6/7/9/10/14 f = 2010MHz to 2690 MHz,TRx1/2/11/12 f = 2010MHz to 2690 MHz,TRx13 f = 699 MHz to 960 MHz f = 1710 MHz to 1990 MHz f = 2010 MHz to 2690 MHz f = 699 MHz to 960 MHz f = 1710 MHz to 1990 MHz f = 2010 MHz to 2690 MHz Power in TRx Port = +27 dBm, NTC Power in TRx Port = +25 dBm at 787 MHz, NTC

-105 dBm

-105 dBm CW Pin = 20dBm;

P_BLK = -15dBm dBm dBm dBm dB dB dB us Any Tx mode to TRx1- TRx8 Any Tx mode to TRx9- TRx11 Any Tx mode to TRx12- TRx14 699 to 960 MHz 1710 to 1990 MHz 2010 to 2690 MHz from final MIPI command to 90% VRF_Peak 1. Coupler Factor defined as the ratio of CPL port to ANT port output power, driven from TRx. All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 17 Preliminary Datasheet Vanchip Confidential VC7916-62 EVB Schematic Illustration Note:

1. ALL RF Input and output Trace with 50 Ohm Microstrip-line. 2. The Schematic will be compatible with VC7916-61 Bill Of Materials for VC7916-62 EVB Reference Part Description Manufacturer Item 1 2 3 4 5 6 7 8 9 Qty. 2 2 2 1 1 21 1 4 1 C105,C108 C101.C1106 C100, C128 C103 C107 CAP,0402,47pF,5%,50V,COG CAP,0402,22pF,5%,50V,COG CAP,0402,100nF,10%,10V,X5R CAP,TANTALUM,68uF, 6.3V, 10%

CAP,0805,10uF,20%, 6.3V,X5R J1,J2,J3,J4,J5,J6,J7,J8,J9,J10,J11, J12,J13,J14,J15,J17,J18,J19,J20, J21,J22 U100 C123,C124,C125,J16 J101 TXM, VC7916-62 Not Connected Connector,6PIN muRata muRata Yageo AVX Yageo Vanchip ASSY,JACK End Launch SMA, STR 50OHM Cinch All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 18 Preliminary Datasheet Vanchip Confidential VC7916-62 EVB TOP Assembly Illustration Note:

1. The EVB will be compatible with VC7916-61 All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 19 Preliminary Datasheet Vanchip Confidential VC7916-62 Pin illustration and Description 5.30.1 mm 0.8340.100 Pin 1 Part Number Date Code Trace Code VC7916-62 YYWW XXXXXX m m 1

. 0 0 5

. 5 T R x 8 T R x 9 T R x 1 0 T R x 1 1 T R x 1 2 T R x 1 3 T R x 1 4 G N D A N T G N D G N D TRx7 TRx6 TRx5 TRx4 TRx3 TRx2 TRx1 GND T X _ L B _ I N T X _ H B _ I N L B _ S W O U T H B _ S W O U T S C L K S D A T A I V O V R A M P V C C G N D V B A T T PadlayoutasseenfromTopViewlookingthroughpackage 1 2 3 4 5 6 7 8 9 NC GND CPL GND GND GND GND Pad Name GND PIN Description 1116,18,20,21,23,38 LB_SWOUT RF Output path for TX_LB_IN Swap Input Tx Signal 699 MHz915 MHz Tx_LB_IN Input Tx Signal 1710 MHz2025 MHz Tx_HB_IN HB_SWOUT RF Output path for TX_HB_IN Swap SCLK SDATA VIO MIPI Clock MIPI Data MIPI Power Supply VRAMP No Function VCC VBAT Controller Supply Voltage PA Supply Voltage GND 10 17 19 22 24~37 CPL NC ANT TRx14~1 Ground PAD Directional coupler RF output Not connect PA output to Antenna Wideband TRx switch port Ground PAD Grid under Device All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 20 Preliminary Datasheet Vanchip Confidential VC7916-62 APT Application Schematics DC Supply APT, Buck DC-DC Supply 8 X R T 9 X R T 0 1 X R T 1 1 X R T 2 1 X R T 3 1 X R T 4 1 X R T D N G T N A D N G D N G 30 29 28 27 26 25 24 23 22 21 20 TRX7 TRX6 TRX5 TRX4 TRX3 TRX2 TRX1 GND GND 1 2 3 4 5 6 7 8 9 10 11 100pF 10uF FromVbat NC GND CPL GND GND GND GND GND 3 1 3 2 3 3 3 4 3 5 3 6 3 7 3 8 T U O W S _ B L 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 1 N I _ B L N I _ B H K L C S A T A D S O V I P M A R V C C V T A B V D N G T U O W S _ B H All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 21 Preliminary Datasheet Vanchip Confidential VC7916-62 Package Outline Unit: mm Note: Unless otherwise specified 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONS AND TOLERANCING IN ACCORDANCE WITH ASME Y14.5M-1994. All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 22 Preliminary Datasheet Vanchip Confidential VC7916-62 PCB Layout Footprint RecommendationUnit: mm For PCB Metal/ Stencil Pin to Pin Pitch: 0.48 For PCB Solder mask Pin to Pin Pitch: 0.48 L: 0.65 W: 0.23 L: 0.750 W: 0.33 Note: Unless otherwise specified 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONS AND TOLERANCING IN ACCORDANCE WITH ASME Y14.5M-1994. All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 23 Preliminary Datasheet Vanchip Confidential VC7916-62 Tape and Reel VC7916-62 carrier tape basic dimensions are based on EIA 481. The pocket is designed to hold the part for shipping and loading onto SMT manufacturing equipment, while protecting the body and the solder terminals from damaging stresses. Prior to shipping, moisture sensitive parts (MSL level 2a-5a) are baked and placed into the pockets of the carrier tape. A cover tape is sealed over the top of the entire length of the carrier tape. The reel is sealed in a moisture barrier ESD bag with the appropriate units of desiccant and a humidity indicator card, which is placed in a cardboard shipping box. It is important to note that unused moisture sensitive parts need to be resealed in the moisture barrier bag. If the reels exceed the exposure limit and need to be rebaked, most carrier tape and shipping reels are not rated as bakeable at 125C. All rights reserved. Products and Product Information are Subject to Change Without Prior Notice. 24

 

 

Module : EC25-AUX EC25 Hardware Design LTE Standard Module Series Rev. EC25_Hardware_Design_V2.2 Date: 2019-08-19 Status: Released www.quectel.com LTE Standard Module Series EC25 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. EC25_Hardware_Design 1 / 130 LTE Standard Module Series EC25 Hardware Design About the Document History Revision Date Author Description 1.0 2016-04-01 Woody WU Initial 1.1 2016-09-22 Lyndon LIU/

Frank WANG 1. Updated EC25 series frequency bands in Table 1. 2. Updated transmitting power, supported maximum baud rate of main UART/internal protocols/USB drivers of USB interface, firmware upgrade and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4. Updated timing of turning off module in Figure 13. 5. Updated timing of resetting module in Figure 16. 6. Updated supported baud rates of main UART in Chapter 3.11. 7. Added notes for ADC interface in Chapter 3.13. 8. Updated GNSS performance in Table 21. 9. Updated operating frequencies of module in Table 23. 10. Added current consumption in Chapter 6.4. 11. Updated RF output power in Chapter 6.5. 12. Added RF receiving sensitivity in Chapter 6.6. 1. Added SGMII and WLAN interfaces in Table 2. 2. Updated function diagram in Figure 1. 3. Updated pin assignment (Top View) in Figure 2. 4. Added description of SGMII and WLAN interfaces in 5. Added SGMII interface in Chapter 3.17. 6. Added WLAN interface in Chapter 3.18. 7. Added USB_BOOT interface in Chapter 3.19. 8. Added reference design of RF layout in Chapter 5.1.4. 9. Added note about SIMO in Chapter 6.6. 1.2 2016-11-04 Lyndon LIU/

Michael ZHANG Table 4. 1.3 2017-01-24 Lyndon LIU/

Frank WANG 1. Updated function diagram in Figure 1. 2. Updated pin assignment (top view) in Figure 2. EC25_Hardware_Design 2 / 130 LTE Standard Module Series EC25 Hardware Design 3. Added BT interface in Chapter 3.18.2. 4. Updated GNSS performance in Table 24. 5. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29. 6. Updated current consumption of EC25-E module in 7. Updated EC25-A conducted RF receiving sensitivity 8. Added EC25-J conducted RF receiving sensitivity in Table 33. in Table 38. Table 40. 1. Updated functional diagram in Figure 1. 2. Updated LTE, UMTS and GSM features in Table 2. 3. Updated description of pin 40/136/137/138. 4. Updated PWRKEY pulled down time to 500ms in Chapter 3.7.1 and reference circuit in Figure 10. 5. Updated reference circuit of (U)SIM interface in Figure 17&18. 6. Updated reference circuit of USB interface in Figure 7. Updated PCM mode in Chapter 3.12. 8. Added SD card interface in Chapter 3.13. 9. Updated USB_BOOT reference circuit in Chapter 10. Updated module operating frequencies in Table 26. 11. Updated antenna requirements in Table 30. 12. Updated EC25 series module current consumption in 13. Updated EC25 series module conducted RF receiving sensitivity in Chapter 6.6. 14. Added thermal consideration description in Chapter 15. Added dimension tolerance information in Chapter 7. 16. Added storage temperature range in Table 2 and 19. 3.20. Chapter 6.4. 6.8. Chapter 6.3. 17. Updated RF output power in Table 41. 18. Updated GPRS multi-slot classes in Table 53. 19. Updated storage information in Chapter 8.1. 1. Added information of EC25-AF in Table 1. 2. Updated module operating frequencies in Table 27. 3. Added current consumption of EC25-AF module in 4. Changed GNSS current consumption of EC25 series module into Table 41. 5. Added EC25-AF conducted RF receiving sensitivity in 1.5 2018-04-20 Kinsey ZHANG Table 40. EC25_Hardware_Design 3 / 130 1.4 2018-03-05 AnniceZHANG/

Lyndon LIU/

Frank WANG 2.0 2019-04-30 Nathan LIU/

Frank WANG/

Ward WANG/

Ethan SHAN LTE Standard Module Series EC25 Hardware Design Table 50. 1. Added new variants EC25-EU/-EC/-EUX/-MX and related information. 2. Updated functional diagram in Figure 1. 3. Updated star structure of the power supply in Figure 8. 4. Updated power-on scenario of module in Figure 12. 5. Updated reference circuit with translator chip in Figure 20. 6. Added timing sequence for entering into emergency download mode of USB_BOOT interface in Figure 32. 7. Updated general description in Table 1. 8. Updated module operating frequencies in Table 27. 9. Updated GNSS frequency in Table 29. 10. Updated antenna requirements in Table 30. 11. Updated EC25-V current consumption in Table 36. 12. Added EC25-EU current consumption in Table 41 13. Added EC25-EC current consumption in Table 42. 14. Added EC25-EUX current consumption in Table 43. 15. Added EC25-MX current consumption in Table 44. 16. Updated EC25-E conducted RF receiving sensitivity in 17. Updated EC25-A conducted RF receiving sensitivity in 18. Updated EC25-V conducted RF receiving sensitivity in 19. Updated EC25-AUT sensitivity in Table 52. conducted RF receiving 20. Updated EC25-AUTL conducted RF receiving sensitivity in Table 53. 21. Added EC25-EU conducted RF receiving sensitivity in 22. Added EC25-EC conducted RF receiving sensitivity in Table 47. Table 48. Table 49. Table 55. Table 56. in Table 57. 23. Added EC25-EUX conducted RF receiving sensitivity 24. Added EC25-MX conducted RF receiving sensitivity in Table 58. 25. Updated recommended as 0.18mm~0.20mm and reflow soldering thermal profile in Chapter 8.2. thickness stencil 1. Added new variants EC25-AFX/-AUX and related 2. Added notes for interfaces not supported by ThreadX 2.1 2019-07-05 information. Fanny CHEN/

Ethan SHAN EC25_Hardware_Design 4 / 130 LTE Standard Module Series EC25 Hardware Design modules. Table 2. in Table 56. Figure 45. 3. Updated supported protocols and USB serial drivers in 4. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 26. 5. Added EC25-AFX current consumption in Table 41. 6. Added EC25-AFX conducted RF receiving sensitivity 7. Updated mechanical dimensions of the module in 8. Added tape and reel directions in Figure 51. 1. Updated EC25-J current consumption in Table 37. 2. Deleted the LTE-TDD bands information of EC25-AUT current consumption in Table 39. 3. Updated EC25-EC current consumption in Table 43. 4. Updated EC25-EUX current consumption in Table 44. 5. Added EC25-AUX current consumption in Table 46. 6. Updated EC25-AU conducted RF receiving sensitivity 7. Updated EC25-EU conducted RF receiving sensitivity 8. Added EC25-AUX conducted RF receiving sensitivity in Table 53. in Table 58. in Tbale 62. 2.2 2019-08-19 Ward WANG/

Owen WEI/

Frank WANG EC25_Hardware_Design 5 / 130 LTE Standard Module Series EC25 Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 6 Table Index ............................................................................................................................................... 9 Figure Index ............................................................................................................................................ 11 1 Introduction ..................................................................................................................................... 13 Safety Information ................................................................................................................. 14 1.1. 2 Product Concept ............................................................................................................................. 16 2.1. General Description .............................................................................................................. 16 Key Features ......................................................................................................................... 17 2.2. Functional Diagram ............................................................................................................... 20 2.3. 2.4. Evaluation Board ................................................................................................................... 21 3.6. 3 Application Interfaces ..................................................................................................................... 22 3.1. General Description .............................................................................................................. 22 3.2. Pin Assignment ..................................................................................................................... 23 3.3. Pin Description ...................................................................................................................... 24 3.4. Operating Modes .................................................................................................................. 36 3.5. Power Saving ........................................................................................................................ 36 3.5.1. Sleep Mode.................................................................................................................. 36 3.5.1.1. UART Application .............................................................................................. 37 3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 37 3.5.1.3. USB Application with USB Suspend/Resume and RI Function.......................... 38 3.5.1.4. USB Application without USB Suspend Function .............................................. 39 3.5.2. Airplane Mode .............................................................................................................. 39 Power Supply ........................................................................................................................ 40 3.6.1. Power Supply Pins ....................................................................................................... 40 3.6.2. Decrease Voltage Drop ............................................................................................... 41 3.6.3. Reference Design for Power Supply ............................................................................ 42 3.6.4. Monitor the Power Supply ............................................................................................ 42 Power-on/off Scenarios ......................................................................................................... 43 Turn on Module Using the PWRKEY ........................................................................... 43 Turn off Module ............................................................................................................ 45 Turn off Module Using the PWRKEY Pin ........................................................... 45 Turn off Module Using AT Command ................................................................ 45 Reset Module ........................................................................................................................ 46 3.8. 3.9.

(U)SIM Interface .................................................................................................................... 47 3.10. USB Interface ........................................................................................................................ 50 3.11. UART Interfaces ................................................................................................................... 51 3.12. PCM and I2C Interfaces ........................................................................................................ 54 3.7.2.1. 3.7.2.2. 3.7.1. 3.7.2. 3.7. EC25_Hardware_Design 6 / 130 LTE Standard Module Series EC25 Hardware Design 3.13. SD Card Interface ................................................................................................................. 56 3.14. Wireless Connectivity Interfaces ........................................................................................... 58 3.14.1. WLAN Interface ........................................................................................................... 61 3.14.2. BT Interface* ................................................................................................................ 61 3.15. ADC Interfaces ...................................................................................................................... 61 3.16. SGMII Interface ..................................................................................................................... 62 3.17. Network Status Indication ..................................................................................................... 64 3.18. STATUS ................................................................................................................................ 66 3.19. Behaviors of RI ..................................................................................................................... 66 3.20. USB_BOOT Interface............................................................................................................ 67 4 GNSS Receiver ................................................................................................................................ 69 4.1. General Description .............................................................................................................. 69 4.2. GNSS Performance .............................................................................................................. 69 Layout Guidelines ................................................................................................................. 70 4.3. 5 Antenna Interfaces .......................................................................................................................... 71 5.1. Main/Rx-diversity Antenna Interfaces.................................................................................... 71 5.1.1. Pin Definition ................................................................................................................ 71 5.1.2. Operating Frequency ................................................................................................... 71 5.1.3. Reference Design of RF Antenna Interface ................................................................. 73 5.1.4. Reference Design of RF Layout ................................................................................... 73 5.2. GNSS Antenna Interface ....................................................................................................... 75 5.3. Antenna Installation .............................................................................................................. 77 5.3.1. Antenna Requirement .................................................................................................. 77 5.3.2. Recommended RF Connector for Antenna Installation ................................................ 78 6 Electrical, Reliability and Radio Characteristics .......................................................................... 80 Absolute Maximum Ratings .................................................................................................. 80 6.1. 6.2. Power Supply Ratings ........................................................................................................... 81 6.3. Operation and Storage Temperatures .................................................................................. 81 Current Consumption ............................................................................................................ 82 6.4. RF Output Power ................................................................................................................ 104 6.5. 6.6. RF Receiving Sensitivity ..................................................................................................... 105 Electrostatic Discharge ....................................................................................................... 113 6.7. 6.8. Thermal Consideration ........................................................................................................ 113 7 Mechanical Dimensions................................................................................................................ 116 7.1. Mechanical Dimensions of the Module................................................................................ 116 Recommended Footprint ..................................................................................................... 118 7.2. 7.3. Design Effect Drawings of the Module ................................................................................ 119 8 Storage, Manufacturing and Packaging ...................................................................................... 120 8.1. Storage ............................................................................................................................... 120 8.2. Manufacturing and Soldering .............................................................................................. 121 Packaging ........................................................................................................................... 122 8.3. EC25_Hardware_Design 7 / 130 LTE Standard Module Series EC25 Hardware Design 9 Appendix A References ................................................................................................................ 124 10 Appendix B GPRS Coding Schemes ........................................................................................... 128 11 Appendix C GPRS Multi-slot Classes .......................................................................................... 129 12 Appendix D EDGE Modulation and Coding Schemes ................................................................ 131 EC25_Hardware_Design 8 / 130 LTE Standard Module Series EC25 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE ....................................................................... 16 TABLE 2: KEY FEATURES OF EC25 MODULE .............................................................................................. 17 TABLE 3: I/O PARAMETERS DEFINITION ...................................................................................................... 24 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 24 TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................ 36 TABLE 6: VBAT AND GND PINS ...................................................................................................................... 40 TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 43 TABLE 8: PIN DEFINITION OF RESET_N ....................................................................................................... 46 TABLE 9: PIN DEFINITION OF (U)SIM INTERFACE ....................................................................................... 48 TABLE 10: PIN DESCRIPTION OF USB INTERFACE ..................................................................................... 50 TABLE 11: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................ 51 TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE......................................................................... 52 TABLE 13: LOGIC LEVELS OF DIGITAL I/O ................................................................................................... 52 TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ...................................................................... 55 TABLE 15: PIN DEFINITION OF SD CARD INTERFACE ................................................................................ 56 TABLE 16: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES ............................................... 58 TABLE 17: PIN DEFINITION OF ADC INTERFACES ...................................................................................... 62 TABLE 18: CHARACTERISTIC OF ADC .......................................................................................................... 62 TABLE 19: PIN DEFINITION OF SGMII INTERFACE ...................................................................................... 63 TABLE 20: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR .................... 65 TABLE 21: WORKING STATE OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR .................. 65 TABLE 22: PIN DEFINITION OF STATUS ....................................................................................................... 66 TABLE 23: BEHAVIORS OF RI ......................................................................................................................... 67 TABLE 24: PIN DEFINITION OF USB_BOOT INTERFACE............................................................................. 67 TABLE 25: GNSS PERFORMANCE ................................................................................................................. 69 TABLE 26: PIN DEFINITION OF RF ANTENNAS ............................................................................................ 71 TABLE 27: MODULE OPERATING FREQUENCIES ....................................................................................... 71 TABLE 28: PIN DEFINITION OF GNSS ANTENNA INTERFACE .................................................................... 75 TABLE 29: GNSS FREQUENCY ...................................................................................................................... 76 TABLE 30: ANTENNA REQUIREMENTS ......................................................................................................... 77 TABLE 31: ABSOLUTE MAXIMUM RATINGS ................................................................................................. 80 TABLE 32: POWER SUPPLY RATINGS .......................................................................................................... 81 TABLE 33: OPERATION AND STORAGE TEMPERATURES ......................................................................... 81 TABLE 34: EC25-E CURRENT CONSUMPTION ............................................................................................. 82 TABLE 35: EC25-A CURRENT CONSUMPTION ............................................................................................. 84 TABLE 36: EC25-V CURRENT CONSUMPTION ............................................................................................. 85 TABLE 37: EC25-J CURRENT CONSUMPTION ............................................................................................. 86 TABLE 38: EC25-AU CURRENT CONSUMPTION .......................................................................................... 87 TABLE 39: EC25-AUT CURRENT CONSUMPTION ........................................................................................ 90 TABLE 40: EC25-AF CURRENT CONSUMPTION ........................................................................................... 91 TABLE 41: EC25-AFX CURRENT CONSUMPTION ........................................................................................ 92 EC25_Hardware_Design 9 / 130 LTE Standard Module Series EC25 Hardware Design TABLE 42: EC25-EU CURRENT CONSUMPTION .......................................................................................... 94 TABLE 43: EC25-EC CURRENT CONSUMPTION .......................................................................................... 96 TABLE 44: EC25-EUX CURRENT CONSUMPTION ........................................................................................ 98 TABLE 45: EC25-MX CURRENT CONSUMPTION ........................................................................................ 100 TABLE 46: EC25-AUX CURRENT CONSUMPTION ...................................................................................... 101 TABLE 47: GNSS CURRENT CONSUMPTION OF EC25 SERIES MODULE .............................................. 104 TABLE 48: RF OUTPUT POWER ................................................................................................................... 104 TABLE 49: EC25-E CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 105 TABLE 50: EC25-A CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 106 TABLE 51: EC25-V CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 106 TABLE 52: EC25-J CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 106 TABLE 53: EC25-AU CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 107 TABLE 54: EC25-AUT CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 108 TABLE 55: EC25-AUTL CONDUCTED RF RECEIVING SENSITIVITY ......................................................... 108 TABLE 56: EC25-AF CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 108 TABLE 57: EC25-AFX CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 109 TABLE 58: EC25-EU CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 110 TABLE 59: EC25-EC CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 110 TABLE 60: EC25-EUX CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 111 TABLE 61: EC25-MX CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 111 TABLE 62: EC25-AUX CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 112 TABLE 63: ELECTROSTATICS DISCHARGE CHARACTERISTICS (25C, 45% RELATIVE HUMIDITY) ... 113 TABLE 64: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................ 121 TABLE 65: RELATED DOCUMENTS ............................................................................................................. 124 TABLE 66: TERMS AND ABBREVIATIONS ................................................................................................... 124 TABLE 67: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................ 128 TABLE 68: GPRS MULTI-SLOT CLASSES .................................................................................................... 129 TABLE 69: EDGE MODULATION AND CODING SCHEMES ........................................................................ 131 EC25_Hardware_Design 10 / 130 LTE Standard Module Series EC25 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 21 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 23 FIGURE 3: SLEEP MODE APPLICATION VIA UART ...................................................................................... 37 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 38 FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 38 FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 39 FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ..................................................... 41 FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ........................................................................... 41 FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 42 FIGURE 10: TURN ON THE MODULE BY USING DRIVING CIRCUIT ........................................................... 43 FIGURE 11: TURN ON THE MODULE BY USING KEYSTROKE ................................................................... 44 FIGURE 12: TIMING OF TURNING ON MODULE ........................................................................................... 44 FIGURE 13: TIMING OF TURNING OFF MODULE ......................................................................................... 45 FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 46 FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 47 FIGURE 16: TIMING OF RESETTING MODULE ............................................................................................. 47 FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR

................................................................................................................................................................... 48 FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR 49 FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 50 FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 53 FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 53 FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 54 FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 55 FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ................................... 56 FIGURE 25: REFERENCE CIRCUIT OF SD CARD INTERFACE ................................................................... 57 FIGURE 26: REFERENCE CIRCUIT OF WIRELESS CONNECTIVITY INTERFACES WITH FC20 MODULE

................................................................................................................................................................... 60 FIGURE 27: SIMPLIFIED BLOCK DIAGRAM FOR ETHERNET APPLICATION ............................................. 63 FIGURE 28: REFERENCE CIRCUIT OF SGMII INTERFACE WITH PHY AR8033 APPLICATION ................ 64 FIGURE 29: REFERENCE CIRCUIT OF THE NETWORK INDICATOR ......................................................... 65 FIGURE 30: REFERENCE CIRCUITS OF STATUS ........................................................................................ 66 FIGURE 31: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 68 FIGURE 32: TIMING SEQUENCE FOR ENTERING EMERGENCY DOWNLOAD MODE ............................. 68 FIGURE 33: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................ 73 FIGURE 34: MICROSTRIP DESIGN ON A 2-LAYER PCB .............................................................................. 74 FIGURE 35: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB .......................................................... 74 FIGURE 36: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)

................................................................................................................................................................... 74 FIGURE 37: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)

................................................................................................................................................................... 75 EC25_Hardware_Design 11 / 130 LTE Standard Module Series EC25 Hardware Design FIGURE 38: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 76 FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 78 FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 78 FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) .......................................................... 79 FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ............... 114 FIGURE 43: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS PCB)

................................................................................................................................................................. 114 FIGURE 44: MODULE TOP AND SIDE DIMENSIONS .................................................................................. 116 FIGURE 45: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ............................................................... 117 FIGURE 46: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ 118 FIGURE 47: TOP VIEW OF THE MODULE .................................................................................................... 119 FIGURE 48: BOTTOM VIEW OF THE MODULE ............................................................................................ 119 FIGURE 49: REFLOW SOLDERING THERMAL PROFILE ............................................................................ 121 FIGURE 50: TAPE AND REEL SPECIFICATIONS ........................................................................................ 123 FIGURE 51: TAPE AND REEL DIRECTIONS ................................................................................................ 123 EC25_Hardware_Design 12 / 130 LTE Standard Module Series EC25 Hardware Design 1 Introduction This document defines EC25 module and describes its air interface and hardware interfaces which are connected with customers applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC25 module. To facilitate its application in different fields, relevant reference design is also provided for customers reference. Associated with application note and user guide, customers can use EC25 module to design and set up mobile applications easily. 1. CAUTION : RISK OF EXPL OSION IF BATTERY IS REPL ACED BY AN INCORRECT TYPE. DISPOSE OF USED BATTERIES ACCORDING To THE INSTRUCTIONS. 2. Operating temperature: -40 C to 85 C 3. EC25-AUX, EC25-AUX MINIPCIEsupport frequency bands : GSM900/1800 , WCDMA I/V/VIII, LTE Band 1/3/5/7/8/20/28/40 ;

4. EC25-AUX, EC25-AUX MINIPCIE max output power :

GSM900/1800 , WCDMA I/V/VIII, LTE Band 1/3/5/7/8/20/28/40 : 23dBm ;

The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter and must be installed to provide a separation distance of at least 20cm from all persons. Declaration of Conformity Hereby, Quectel Wireless Solutions Co., Ltd declares that the radio equiqment type EC25-AUX, EC25-AUX MINIPCIEis incompliance with Directives: 2014/53/EU.The full text of the EU declaration ofconformity is available at the following internet address: http://www.quectel.com/support/downloadb/TechnicalDocuments.htm EC25_Hardware_Design 13 / 130 LTE Standard Module Series EC25 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. EC25_Hardware_Design 14 / 130 LTE Standard Module Series EC25 Hardware Design In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. EC25_Hardware_Design 15 / 130 LTE Standard Module Series EC25 Hardware Design 2 Product Concept 2.1. General Description EC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides GNSS1) and voice functionality2) for customers specific applications. EC25 contains 14 variants: EC25-E, EC25-A, EC25-V, EC25-J, EC25-AU, EC25-AUX, EC25-AUT, EC25-AF, EC25-AFX, EC25-EU, EC25-EUX, EC25-AUTL, EC25-EC and EC25-MX. Customers can choose a dedicated type based on the region or operator. The following table shows the frequency bands of EC25 series module. Table 1: Frequency Bands of EC25 Series Module Modules2) LTE Bands WCDMA Bands GSM Bands Rx-

diversity GNSS1) EC25-E FDD: B1/B3/B5/B7/B8/B20 TDD: B38/B40/B41 B1/B5/B8 900/1800MHz Y EC25-A FDD: B2/B4/B12 B2/B4/B5 EC25-V FDD: B4/B13 N EC25-J B1/B6/B8/B19 N FDD: B1/B3/B8/B18/B19/

B26 TDD: B41 B8/B28 FDD: B1/B2/B3/B4/B5/B7/

TDD: B40 FDD: B1/B23)/B3/B4/B5/B7/

TDD: B40 B8/B28 EC25-AU3) EC25-AUX4) B1/B2/B5/B8 850/900/

1800/1900MHz B1/B2/B4/B5/

B8 850/900/

1800/1900MHz EC25-AUT FDD: B1/B3//B5/B7/B28 B1/B5 EC25-AF FDD: B2/B4//B5/B12/B13/

B14/B66/B71 B2/B4/B5 N N N N Y Y Y Y Y Y Y GPS, GLONASS, BeiDou/

Compass, Galileo, QZSS EC25_Hardware_Design 16 / 130 LTE Standard Module Series EC25 Hardware Design EC25-AFX4) FDD: B2/B4//B5/B12/B13/

B2/B4/B5 N Y EC25-EU B1/B8 900/1800MHz Y B14/B66/B71 FDD: B1/B3/B7/B8/B20/

B28A TDD: B38/B40/B41 FDD: B1/B3/B7/B8/B20/

B28A TDD: B38/B40/B41 EC25-EUX4) B1/B8 900/1800MHz Y EC25-AUTL FDD: B3/B7/B28 N N EC25-EC EC25-MX4) FDD: B1/B3/B7/B8/B20/

B28A FDD: B2/B4//B5/B7/B28/

B66 B1/B8 900/1800MHz Y B2/B4/B5 N Y Y N N N NOTES 1. 2. 1) GNSS function is optional. 2) EC25 series module contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. 3) B2 band on EC25-AU and EC25-AUX modules do not support Rx-diversity. 4) EC25-AFX, EC25-EUX, EC25-AUX and EC25-MX are based on ThreadX OS. 3. 4. 5. Y = Supported. N = Not supported. With a compact profile of 29.0mm 32.0mm 2.4mm, EC25 can meet almost all requirements for M2M applications such as automotive, metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EC25 is an SMD type module which can be embedded into applications through its 144-pin pads, including 80 LCC signal pads and 64 LGA pads. 2.2. Key Features The following table describes the detailed features of EC25 module. Table 2: Key Features of EC25 Module Features Details Power Supply Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V EC25_Hardware_Design 17 / 130 Transmitting Power LTE Features UMTS Features GSM Features LTE Standard Module Series EC25 Hardware Design Class 4 (33dBm2dB) for GSM850 Class 4 (33dBm2dB) for EGSM900 Class 1 (30dBm2dB) for DCS1800 Class 1 (30dBm2dB) for PCS1900 Class E2 (27dBm3dB) for GSM850 8-PSK Class E2 (27dBm3dB) for EGSM900 8-PSK Class E2 (26dBm3dB) for DCS1800 8-PSK Class E2 (26dBm3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm2dB) for LTE-FDD bands Class 3 (23dBm2dB) for LTE-TDD bands Support up to non-CA Cat 4 FDD and TDD Support 1.4/3/5/10/15/20MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max 150Mbps (DL)/Max 50Mbps (UL) LTE-TDD: Max 130Mbps (DL)/Max 30Mbps (UL) Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL) GPRS:

Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL)/Max 85.6Kbps (UL) EDGE:

Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL)/Max 236.8Kbps (UL) Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/NITZ/

MMS/SMTP/SSL/MQTT/FILE/CMUX*/SMTPS* protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connections Internet Protocol Features SMS Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default

(U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V EC25_Hardware_Design 18 / 130 LTE Standard Module Series EC25 Hardware Design Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6/3.x/4.1~4.15, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc. Main UART:

Used for AT command communication and data transmission Baud rates reach up to 921600bps, 115200bps by default Support RTS and CTS hardware flow control Debug UART:

Used for Linux console and log output 115200bps baud rate Audio Features PCM Interface USB Interface UART Interfaces SD Card Interface1) Support SD 3.0 protocol SGMII Interface1) Support 10M/100M/1000M Ethernet work mode Support maximum 150Mbps (DL)/50Mbps (UL) for 4G network Wireless Connectivity Interfaces1) Support a low-power SDIO 3.0 interface for WLAN and UART/PCM interfaces for Bluetooth Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Network Indication Antenna Interfaces Gen8C Lite of Qualcomm Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Two pins including NET_MODE and NET_STATUS to indicate network connectivity status Including main antenna interface (ANT_MAIN), Rx-diversity antenna interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS) Physical Characteristics Temperature Range Size: (29.00.15)mm (32.00.15)mm (2.40.2)mm Weight: approx. 4.9g Operation temperature range: -35C ~ +75C2) Extended temperature range: -40C ~ +85C3) Storage temperature range: -40C~ +90C EC25_Hardware_Design 19 / 130 LTE Standard Module Series EC25 Hardware Design Firmware Upgrade USB interface or DFOTA*

RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 1) SD card, wireless connectivity and SGMII interfaces are not supported on ThreadX modules. 2. 2) Within operation temperature range, the module is 3GPP compliant. 3. 3) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call* (emergency call is not supported on ThreadX modules), etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again. 4. * means under development. 2.3. Functional Diagram The following figure shows a block diagram of EC25 and illustrates the major functional parts. Power management Baseband DDR+NAND flash Radio frequency Peripheral interfaces EC25_Hardware_Design 20 / 130 LTE Standard Module Series EC25 Hardware Design ANT_MAIN ANT_GNSS ANT_DIV PAM SAW Switch SAW Duplex LNA SAW DRx APT PA Tx PRx Transceiver NAND DDR2 SDRAM IQ Control Baseband PMIC Control 19.2M XO VBAT_RF VBAT_BB PWRKEY RESET_N ADCs STATUS VDD_EXT USB (U)SIM PCM I2C UARTs SGMII WLAN BT GPIOs SD Figure 1: Functional Diagram 2.4. Evaluation Board In order to help customers develop applications with EC25, Quectel supplies an evaluation board

(UMTS&LTE EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module. For more details, please refer to document [8]. EC25_Hardware_Design 21 / 130 LTE Standard Module Series EC25 Hardware Design 3 Application Interfaces 3.1. General Description

(U)SIM interface EC25 is equipped with 80 LCC pads plus 64 LGA pads that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following functions/pins/

interfaces. Power supply USB interface UART interfaces PCM and I2C interfaces SD card interface1) ADC interfaces Status indication SGMII interface1) Wireless connectivity interfaces1) USB_BOOT interface NOTE 1) SD card, wireless connectivity and SGMII interfaces are not supported on ThreadX modules. EC25_Hardware_Design 22 / 130 LTE Standard Module Series EC25 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC25 module. RESERVED RESERVED 141 142 WAKEUP_IN1) AP_READY RESERVED W_DISABLE#

NET_MODE1) NET_STATUS VDD_EXT GND GND USIM_GND DBG_RXD DBG_TXD USIM_VDD USIM_DATA USIM_CLK USIM_RST RESERVED 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 USIM_PRESENCE R E S E R V E D 1 1 4 R E S E R V E D 1 1 3 129 117 130 118 131 119 132 120 133 121 134 122 135 123 1361) 124 1371) 125 1381) 126 139 127 140 128 1 1 6 1 1 5 R E S E R V E D U S B _ B O O T 1

) U S B _ V B U S G N D U S B _ D M U S B _ D P R X D T X D D T R R T S C T S D C D R I S T A T U S V B A T _ B B V B A T _ B B V B A T _ R F V B A T _ R F G N D R E S E R V E D 7 2 7 1 7 0 6 9 6 8 6 7 6 6 6 5 6 4 6 3 6 2 6 1 6 0 5 9 5 8 5 7 5 6 5 5 108 103 99 95 90 85 109 104 100 96 91 86 110 105 92 87 82 83 84 79 80 81 76 77 78 73 74 75 111 106 101 97 93 88 112 107 102 98 94 89 GND GND GND GND GND GND ANT_MAIN 144 143 47 RESERVED RESERVED ANT_GNSS GND ADC0 ADC1 RESERVED I2C_SDA I2C_SCL BT_CTS1) BT_RXD BT_TXD BT_RTS 54 53 52 51 50 49 48 46 45 44 43 42 41 40 39 38 37 1 9 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 2 3 3 3 4 3 5 3 6 G N D G N D R E S E T _ N P W R K E Y 2

) I S D _ N S _ D E T P C M _ N I 3

) P C M _ O U T 3

) P C M _ C L K 3

) P C M _ S Y N C 3

) S D C 2 _ D A T A 3 S D C 2 _ D A T A 2 S D C 2 _ D A T A 1 S D C 2 _ D A T A 0 S D C 2 _ C L K S D C 2 _ C M D V D D _ S D O I G N D A N T _ D V I Power Pins Signal Pins WLAN Pins RESERVED Pins GND Pins Bluetooth Pins SGMII Pins Figure 2: Pin Assignment (Top View) NOTES 2. 1. 1) means pins WAKEUP_IN, NET_MODE, WLAN_EN, COEX_UART_RX, COEX_UART_TX, USB_BOOT and BT_CTS cannot be pulled up before startup. 2) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. 3) means digital audio (PCM) is only supported on Telematics version. 3. 4. Pins 37~40, 118, 127 and 129~139 are used for wireless connectivity interfaces, among which pins 118, 127 and 129~138 are WLAN function pins, and the rest are Bluetooth (BT) function pins. BT function is under development. EC25_Hardware_Design 23 / 130 LTE Standard Module Series EC25 Hardware Design 5. Pins 119~126 and 128 are used for SGMII interface. 6. Pins 24~27 for PCM function are multiplexing pins used for audio design on EC25 module and BT function on FC20 module. 7. SD card, wireless connectivity and SGMII interfaces (pins 37~40, 118, 127, 129~139, 119~126, 128, 23, 28~34) are not supported on ThreadX modules. 8. Keep all RESERVED pins and unused pins unconnected. 9. GND pins 85~112 should be connected to ground in the design. RESERVED pins 73~84 should not be designed in schematic and PCB decal, and these pins should be served as a keepout area. 3.3. Pin Description The following tables show the pin definition of EC25 module. Table 3: I/O Parameters Definition Type AI AO DI DO IO OD PI PO Description Analog Input Analog Output Digital Input Digital Output Bidirectional Open Drain Power Input Power Output Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 59, 60 PI Power supply for modules baseband part Vmax=4.3V Vmin=3.3V Vnorm=3.8V It must be provided with sufficient current up to 0.8A. EC25_Hardware_Design 24 / 130 LTE Standard Module Series EC25 Hardware Design VBAT_RF 57, 58 PI Power supply for modules RF part Vmax=4.3V Vmin=3.3V Vnorm=3.8V VDD_EXT 7 PO Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA It must be provided with sufficient current up to 1.8A in a burst transmission. Power supply for external GPIOs pull-up circuits. If unused, keep it open. GND Ground 8, 9, 19, 22, 36, 46, 48, 50~54, 56, 72, 85~112 Power-on/off Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 21 DI VH=0.8V Turn on/off the module RESET_N 20 DI Status Indication Reset signal of the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 61 OD Indicate the module operating status The drive current should be less than 0.9mA. NET_MODE 5 DO NET_ STATUS 6 DO USB Interface Indicate the modules network registration mode Indicate the modules network activity status VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V Pin Name Pin No. I/O Description DC Characteristics Comment The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. If unused, keep it open. An external pull-up resistor is required. If unused, keep it open. 1.8V power domain. It cannot be pulled up before startup. If unused, keep it open. 1.8V power domain. If unused, keep it open. EC25_Hardware_Design 25 / 130 LTE Standard Module Series EC25 Hardware Design USB_VBUS 71 PI USB_DP 69 IO USB_DM 70 IO

(U)SIM Interface USB power supply, used for USB detection Vmax=5.25V Vmin=3.0V Vnorm=5.0V USB differential data bus (+) Compliant with USB 2.0 standard specification. USB differential data bus (-) Compliant with USB 2.0 standard specification. Typical: 5.0V If unused, keep it open. Require differential impedance of 90. If unused, keep it open. Require differential impedance of 90. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USIM_GND 10 Specified ground for

(U)SIM card USIM_ PRESENCE 13 DI

(U)SIM card insertion detection USIM_VDD 14 PO Power supply for

(U)SIM card 1.8V power domain. If unused, keep it open. Either 1.8V or 3.0V is supported by the module automatically. USIM_DATA 15 IO Data signal of

(U)SIM card USIM_CLK 16 DO Clock signal of

(U)SIM card EC25_Hardware_Design 26 / 130 VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V For 1.8V(U)SIM:

Vmax=1.9V Vmin=1.7V For 3.0V(U)SIM:

Vmax=3.05V Vmin=2.7V IOmax=50mA For 1.8V (U)SIM:

VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:

VOLmax=0.45V VOHmin=1.35V LTE Standard Module Series EC25 Hardware Design For 3.0V (U)SIM:

VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:

VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VOLmax=0.45V VOHmin=2.55V USIM_RST 17 DO Reset signal of

(U)SIM card Main UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment RI 62 DO Ring indicator VOLmax=0.45V VOHmin=1.35V DCD 63 DO Data carrier detection VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Pulled up by default. Low level wakes up the module. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. CTS 64 DO Clear to send RTS 65 DI Request to send DTR 66 DI Data terminal ready, sleep mode control TXD 67 DO Transmit data RXD 68 DI Receive data Debug UART Interface VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V Pin Name Pin No. I/O Description DC Characteristics Comment EC25_Hardware_Design 27 / 130 LTE Standard Module Series EC25 Hardware Design DBG_TXD 12 DO Transmit data DBG_RXD 11 DI Receive data VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment General purpose analog to digital converter General purpose analog to digital converter Voltage range:

0.3V to VBAT_BB If unused, keep it open. Voltage range:

0.3V to VBAT_BB If unused, keep it open. ADC Interfaces ADC0 45 AI ADC1 44 AI PCM Interface1) Pin Name Pin No. I/O Description DC Characteristics Comment PCM_IN 24 DI PCM data input PCM_OUT 25 DO PCM data output PCM_SYNC 26 IO PCM data frame synchronization signal PCM_CLK 27 IO PCM clock I2C Interface VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. EC25_Hardware_Design 28 / 130 LTE Standard Module Series EC25 Hardware Design Pin Name Pin No. I/O Description DC Characteristics Comment I2C serial clock. Used for external codec. I2C serial data. Used for external codec. I2C_SCL 41 OD I2C_SDA 42 OD SD Card Interface Pin Name Pin No. I/O Description DC Characteristics Comment An external pull-up resistor is required. 1.8V only. If unused, keep it open. An external pull-up resistor is required. 1.8V only. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V SDC2_ DATA3 28 IO SD card SDIO bus DATA3 SDC2_ DATA2 29 IO SD card SDIO bus DATA2 EC25_Hardware_Design 29 / 130 LTE Standard Module Series EC25 Hardware Design VIHmax=3.34V 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V 1.8V signaling:

VOLmax=0.45V VOHmin=1.4V VILmin=-0.3V SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SDC2_ DATA1 30 IO SD card SDIO bus DATA1 SDC2_ DATA0 31 IO SD card SDIO bus DATA0 SDC2_CLK 32 DO SD card SDIO bus clock SDC2_CMD 33 IO SD card SDIO bus command EC25_Hardware_Design 30 / 130 LTE Standard Module Series EC25 Hardware Design VILmax=0.58V VIHmin=1.27V VIHmax=2.0V 3.0V signaling:

VOLmax=0.38V VOHmin=2.01V VILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V For 1.8V:

VOLmax=0.45V VOHmin=1.4V For 2.85V:

VOLmax=0.35V VOHmin=2.14V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V For 1.8V:

VOLmax=0.45V VOHmin=1.4V VILmax=0.58V VIHmin=1.27V For 2.85V:

VOLmax=0.35V SD 3.0 protocol for more details. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V/2.85V configurable. Cannot be used for SD card power. If unused, keep it open. 1.8V/2.85V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V/2.85V power domain. If unused, keep it open. SD_INS_ DET 23 DI SD card insertion detect VDD_SDIO 34 PO IOmax=50mA SD card SDIO bus pull-up power SGMII Interface Pin Name Pin No. I/O Description DC Characteristics Comment EPHY_RST_ N 119 DO Ethernet PHY reset EPHY_INT_N 120 DI Ethernet PHY interrupt SGMII_ MDATA 121 IO SGMII MDIO

(Management Data Input/Output) data EC25_Hardware_Design 31 / 130 LTE Standard Module Series EC25 Hardware Design VOHmin=2.14V VILmax=0.71V VIHmin=1.78V For 1.8V:

VOLmax=0.45V VOHmin=1.4V For 2.85V:

VOLmax=0.35V VOHmin=2.14V SGMII_ MCLK 122 DO SGMII MDIO

(Management Data Input/Output) clock USIM2_VDD 128 PO SGMII MDIO pull-up power source SGMII_TX_M 123 AO SGMII transmission

- minus SGMII_TX_P 124 AO SGMII transmission

- plus SGMII_RX_P 125 AI SGMII receiving

- plus SGMII_RX_M 126 AI SGMII receiving

- minus 1.8V/2.85V power domain. If unused, keep it open. Configurable power source. 1.8V/2.85V power domain. External pull-up for SGMII MDIO pins. If unused, keep it open. Connect with a 0.1uF capacitor, and is close to the PHY side. If unused, keep it open. Connect with a 0.1uF capacitor, and is close to the PHY side. If unused, keep it open. Connect with a 0.1uF capacitor, and is close to EC25 module. If unused, keep it open. Connect with a 0.1uF capacitor, and is close to EC25 module. If unused, keep it open. Wireless Connectivity Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment EC25_Hardware_Design 32 / 130 LTE Standard Module Series EC25 Hardware Design SDC1_ DATA3 129 IO WLAN SDIO data bus D3 SDC1_ DATA2 130 IO WLAN SDIO data bus D2 SDC1_ DATA1 131 IO WLAN SDIO data bus D1 SDC1_ DATA0 132 IO WLAN SDIO data bus D0 VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V SDC1_CLK 133 DO WLAN SDIO bus clock VOLmax=0.45V VOHmin=1.35V SDC1_CMD 134 DO WLAN SDIO bus command VOLmax=0.45V VOHmin=1.35V PM_ENABLE 127 DO WLAN power control WAKE_ON_ WIRELESS 135 DI Wake up the host

(EC25 module) by FC20 module VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V WLAN_EN 136 DO WLAN function control via FC20 module VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Active low. If unused, keep it open. 1.8V power domain. Active high. Cannot be pulled up before startup. If unused, keep it open. EC25_Hardware_Design 33 / 130 LTE Standard Module Series EC25 Hardware Design COEX_UART _RX 137 DI LTE/WLAN&BT coexistence signal COEX_UART _TX 138 DO LTE/WLAN&BT coexistence signal VOLmax=0.45V VOHmin=1.35V WLAN_SLP_ CLK 118 DO WLAN sleep clock BT_RTS 37 DI BT UART request to send BT_TXD 38 DO BT UART transmit data VOLmax=0.45V VOHmin=1.35V BT_RXD 39 DI BT UART receive data VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V BT_CTS 40 DO BT UART clear to send VOLmax=0.45V VOHmin=1.35V BT_EN 139 DO BT function control via FC20 module VOLmax=0.45V VOHmin=1.35V RF Interfaces ANT_DIV 35 AI Diversity antenna ANT_MAIN 49 IO Main antenna ANT_GNSS 47 AI GNSS antenna 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Cannot be pulled up before startup. If unused, keep it open. 1.8V power domain. If unused, keep it open. 50 impedance. If unused, keep it open. 50 impedance. 50 impedance. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment EC25_Hardware_Design 34 / 130 LTE Standard Module Series EC25 Hardware Design Other Interface Pins Pin Name Pin No. I/O Description DC Characteristics Comment WAKEUP_IN 1 DI Sleep mode control W_DISABLE# 4 DI Airplane mode control AP_READY 2 DI Application processor sleep state detection USB_BOOT Interface VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. Low level wakes up the module. If unused, keep it open. 1.8V power domain. Pull-up by default. At low voltage level, module can enter airplane mode. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment Force the module to enter emergency download mode VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. Cannot be pulled up before startup. It is recommended to reserve test point. Pin Name Pin No. I/O Description DC Characteristics Comment RESERVED Reserved Keep these pins unconnected. USB_BOOT 115 DI RESERVED Pins 3, 18, 43, 55, 73~84, 113, 114, 116, 117, 140-144. EC25_Hardware_Design 35 / 130 LTE Standard Module Series EC25 Hardware Design NOTES FC20 module. 1. 1) PCM interface pins are multiplexing pins used for audio design on EC25 module and BT function on 2. SD card, wireless connectivity and SGMII interfaces pins are not supported on ThreadX modules. 3. BT function is under development. 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Details Normal Operation Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. Minimum Functionality Mode AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. Airplane Mode AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. Sleep Mode Power Down Mode In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. In this mode, the power management unit shuts down the power supply. Software is not active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. 3.5. Power Saving 3.5.1. Sleep Mode EC25 is able to reduce its current consumption to a minimum value during the sleep mode. The following section describes power saving procedures of EC25 module. EC25_Hardware_Design 36 / 130 LTE Standard Module Series EC25 Hardware Design 3.5.1.1. UART Application If the host communicates with module via UART interface, the following preconditions can let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Drive DTR to high level. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module. When EC25 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.19 for details about RI behaviors. AP_READY will detect the sleep state of the host (can be configured to high level or low level detection). Please refer to AT+QCFG="apready" command for details. 3.5.1.2. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. EC25_Hardware_Design 37 / 130 LTE Standard Module Series EC25 Hardware Design Figure 4: Sleep Mode Application with USB Remote Wakeup Sending data to EC25 via USB will wake up the module. When EC25 has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend and resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. Figure 5: Sleep Mode Application with RI EC25_Hardware_Design 38 / 130 LTE Standard Module Series EC25 Hardware Design Sending data to EC25 via USB will wake up the module. When EC25 has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected via an additional control circuit to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. Disconnect USB_VBUS. The following figure shows the connection between the module and the host. Figure 6: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. Please pay attention to the level match shown in dotted line between the module and the host. For more details about EC25 power management application, please refer to document [1]. NOTE 3.5.2. Airplane Mode When the module enters airplane mode, the RF function does not work, and all AT commands correlative with RF function will be inaccessible. This mode can be set via the following ways. EC25_Hardware_Design 39 / 130 LTE Standard Module Series EC25 Hardware Design Hardware:

Software:

NOTES The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. AT+CFUN command provides the choice of the functionality level through setting <fun> into 0, 1 or 4. AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled. AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode. RF function is disabled. 1. The W_DISABLE# control function is disabled in firmware by default. It can be enabled by AT+QCFG="airplanecontrol" command, and this command is under development. 2. The execution of AT+CFUN command will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EC25 provides four VBAT pins for connection with the external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for modules RF part Two VBAT_BB pins for modules baseband part The following table shows the details of VBAT pins and ground pins. Table 6: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 57, 58 3.3 3.8 4.3 VBAT_BB 59, 60 3.3 3.8 4.3 Power supply for modules RF part Power supply for modules baseband part GND Ground

0

8, 9, 19, 22, 36, 46, 48, 50~54, 56, 72, 85~112 V V V EC25_Hardware_Design 40 / 130 LTE Standard Module Series EC25 Hardware Design 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100F with low ESR (ESR=0.7) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm; and the width of VBAT_RF trace should be no less than 2mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to avoid the damage caused by electric surge and ESD, it is suggested that a TVS diode with suggested low reverse stand-off voltage VRWM 4.5V, low clamping voltage VC and high reverse peak pulse current IPP should be used. The following figure shows the star structure of the power supply. VBAT

D1 C1 C2 C3 C4 C5 C6 C7 C8

WS4.5D3HV 100uF 100nF 33pF 10pF 100uF 100nF 33pF 10pF VBAT_RF VBAT_BB Module Figure 8: Star Structure of the Power Supply EC25_Hardware_Design 41 / 130 LTE Standard Module Series EC25 Hardware Design 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2.0A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5.0V input power source. The typical output of the power supply is about 3.8V and the maximum load current is 3.0A. Figure 9: Reference Circuit of Power Supply NOTE In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 3.6.4. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. EC25_Hardware_Design 42 / 130 LTE Standard Module Series EC25 Hardware Design 3.7. Power-on/off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name Pin No. I/O Description Comment PWRKEY 21 DI Turn on/off the module The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When EC25 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms. It is recommended to use an open drain/collector driver to control the PWRKEY. After STATUS pin (require external pull-up resistor) outputs a low level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. 500ms Turn-on pulse 4.7K PWRKEY 10nF 47K Figure 10: Turn on the Module by Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. EC25_Hardware_Design 43 / 130 LTE Standard Module Series EC25 Hardware Design Figure 11: Turn on the Module by Using Keystroke The power-on scenario is illustrated in the following figure. VBA T 500ms VH=0.8V VIL0.5V Abo ut 100ms NOTE 1 PWRKEY VDD_EXT RESET_N STATUS

(OD) BOO T_CONFIG &

USB_BOO T Pin s 2.5s 12s 13s UART Inactive USB Inactive 100ms. Afte r this time, the BOOT_CONFIG pins ca n b e set to high level by external circuit. Active Active Figure 12: Timing of Turning on Module EC25_Hardware_Design 44 / 130 LTE Standard Module Series EC25 Hardware Design NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30ms. 2. PWRKEY can be pulled down directly to GND with a recommended 10K resistor if module needs to be powered on automatically and shutdown is not needed. 3.7.2. Turn off Module The following procedures can be used to turn off the module:

Normal power-off procedure: Turn off the module using the PWRKEY pin. Normal power-off procedure: Turn off the module using AT+QPOWD command. 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-off procedure after the PWRKEY is released. The power-off scenario is illustrated in the following figure. 650ms 29.5s VBA T PWRKEY STATUS

(OD) Module Status RUNNING Power-down procedure OFF Figure 13: Timing of Turning off Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer to document [2] for details about AT+QPOWD command. EC25_Hardware_Design 45 / 130 LTE Standard Module Series EC25 Hardware Design NOTES 1. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 2. When turning off module with AT command, please keep PWRKEY at high level after the execution of power-off command. Otherwise the module will be turned on again after successfully turn-off. 3.8. Reset Module The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N to a low level voltage for time between 150ms and 460ms. Table 8: Pin Definition of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 20 DI Reset the module 1.8V power domain The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 14: Reference Circuit of RESET_N by Using Driving Circuit EC25_Hardware_Design 46 / 130 LTE Standard Module Series EC25 Hardware Design Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure. Figure 16: Timing of Resetting Module NOTES 1. Use RESET_N only when failed to turn off the module by AT+QPOWD command and PWRKEY pin. 2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. EC25_Hardware_Design 47 / 130 LTE Standard Module Series EC25 Hardware Design Table 9: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Description Comment USIM_VDD 14 PO Power supply for (U)SIM card Either 1.8V or 3.0V is supported by the module automatically. USIM_DATA 15 IO Data signal of (U)SIM card USIM_CLK 16 DO Clock signal of (U)SIM card USIM_RST 17 DO Reset signal of (U)SIM card USIM_ PRESENCE 13 DI

(U)SIM card insertion detection 1.8V power domain. If unused, keep it open. USIM_GND 10 Specified ground for (U)SIM card EC25 supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections, and is disabled by default. Please refer to document [2] for more details about AT+QSIMDET command. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. EC25_Hardware_Design 48 / 130 LTE Standard Module Series EC25 Hardware Design Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers applications, please follow the criteria below in (U)SIM circuit design:

Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as close to (U)SIM card connector as possible. If the ground is complete on customers PCB, USIM_GND can be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should not be more than 15pF. The 0 resistors should be added in series between the module and the (U)SIM card to facilitate debugging. The 33pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the

(U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. EC25_Hardware_Design 49 / 130 LTE Standard Module Series EC25 Hardware Design 3.10. USB Interface EC25 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface can only serves as a slave device and is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface. Table 10: Pin Description of USB Interface Pin Name Pin No. I/O Description Comment USB_DP 69 USB differential data bus (+) USB_DM 70 USB differential data bus (-) USB_VBUS 71 USB power supply, used for USB detection IO IO PI Require differential impedance of 90 Require differential impedance of 90 Typical 5.0V GND 72 Ground For more details about the USB 2.0 specifications, please visit http://www.usb.org/home. The USB interface is recommended to be reserved for firmware upgrade in customers designs. The following figure shows a reference circuit of USB interface. Figure 19: Reference Circuit of USB Application EC25_Hardware_Design 50 / 130 LTE Standard Module Series EC25 Hardware Design A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2.0pF. Keep the ESD protection components to the USB connector as close as possible. 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. The main UART interface supports 4800bps, 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps and 921600bps baud rates, and the default is 115200bps. This interface is used for data transmission and AT command communication. The debug UART interface supports 115200bps baud rate. It is used for Linux console and log output. The following tables show the pin definition of the UART interfaces. Table 11: Pin Definition of Main UART Interface Pin Name Pin No. I/O Description Comment RI DCD CTS 62 63 64 DO DO DO Ring indicator Clear to send Data carrier detection 1.8V power domain EC25_Hardware_Design 51 / 130 LTE Standard Module Series EC25 Hardware Design 65 66 67 68 DI DI DO DI Request to send Data terminal ready, sleep mode control Transmit data Receive data RTS DTR TXD RXD Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_TXD DBG_RXD 12 11 DO DI Transmit data Receive data The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O 1.8V power domain Parameter VIL VIH VOL VOH Min.

-0.3 1.2 0 1.35 Max. 0.6 2.0 0.45 1.8 Unit V V V V The module provides 1.8V UART interface. A level translator should be used if customers application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. EC25_Hardware_Design 52 / 130 LTE Standard Module Series EC25 Hardware Design VDD_EXT VCCA VCCB 0.1uF VDD_MCU 0.1uF 1 0 K 120K RI DCD CTS RTS DTR TXD RXD OE A1 A2 A3 A4 A5 A6 A7 A8 Translator GND B1 B2 B3 B4 B5 B6 B7 B8 51K 51K RI_MCU DCD_MCU CTS_MCU RTS_MCU DTR_MCU TXD_MCU RXD_MCU Figure 20: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. The circuit design of dotted line section can refer to the design of solid line section, in terms of both modules input and output circuit designs, but please pay attention to the direction of connection. Figure 21: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. EC25_Hardware_Design 53 / 130 LTE Standard Module Series EC25 Hardware Design 3.12. PCM and I2C Interfaces EC25 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface:

Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK at 8KHz PCM_SYNC, and also supports 4096KHz PCM_CLK at 16KHz PCM_SYNC. In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK and an 8KHz, 50% duty cycle PCM_SYNC. EC25 supports 16-bit linear data format. The following figures show the primary modes timing relationship with 8KHz PCM_SYNC and 2048KHz PCM_CLK, as well as the auxiliary modes timing relationship with 8KHz PCM_SYNC and 256KHz PCM_CLK. Figure 22: Primary Mode Timing EC25_Hardware_Design 54 / 130 LTE Standard Module Series EC25 Hardware Design Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_SYNC 26 PCM_IN PCM_OUT PCM_CLK I2C_SCL I2C_SDA 24 25 27 41 42 DI DO IO IO OD OD PCM data input 1.8V power domain PCM data output 1.8V power domain PCM data frame synchronization signal 1.8V power domain PCM data bit clock 1.8V power domain I2C serial clock Require external pull-up to 1.8V I2C serial data Require external pull-up to 1.8V Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC. Please refer to document [2] for more details about AT+QDAI command. The following figure shows a reference design of PCM interface with external codec IC. EC25_Hardware_Design 55 / 130 LTE Standard Module Series EC25 Hardware Design Figure 24: Reference Circuit of PCM Application with Audio Codec NOTES 1. It is recommended to reserve an RC (R=22, C=22pF) circuits on the PCM lines, especially for PCM_CLK. 2. EC25 works as a master device pertaining to I2C interface. 3.13. SD Card Interface EC25 supports SDIO 3.0 interface for SD card. The following table shows the pin definition of SD card interface. Table 15: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SDC2_DATA3 28 IO SD card SDIO bus DATA3 SDC2_DATA2 29 IO SD card SDIO bus DATA2 SDC2_DATA1 30 IO SD card SDIO bus DATA1 SDC2_DATA0 31 IO SD card SDIO bus DATA0 SDC2_CLK 32 DO SD card SDIO bus clock SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. EC25_Hardware_Design 56 / 130 LTE Standard Module Series EC25 Hardware Design SDC2_CMD 33 IO SD card SDIO bus command VDD_SDIO 34 PO SD card SDIO bus pull up power SD_INS_DET 23 DI SD card insertion detection The following figure shows a reference design of SD card. 1.8V/2.85V configurable. Cannot be used for SD card power. If unused, keep it open. 1.8V power domain. If unused, keep it open. Figure 25: Reference Circuit of SD Card Interface In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with:

SD_INS_DET must be connected. The voltage range of SD card power supply VDD_3V is 2.7V~3.6V and a sufficient current up to 0.8A should be provided. As the maximum output current of VDD_SDIO is 50mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card. To avoid jitter of bus, resistors R7~R11 are needed to pull up the SDIO to VDD_SDIO. Value of these resistors is among 10K~100K and the recommended value is 100K. VDD_SDIO should be used as the pull-up power. In order to adjust signal quality, it is recommended to add 0 resistors R1~R6 in series between the module and the SD card. The bypass capacitors C1~C6 are reserved and not mounted by default. All resistors and bypass capacitors should be placed close to the module. In order to offer good ESD protection, it is recommended to add a TVS diode on SD card pins near the SD card connector with junction capacitance less than 15pF. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DCDC signals, etc. EC25_Hardware_Design 57 / 130 LTE Standard Module Series EC25 Hardware Design It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data trace is 50 (10%). Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of SDIO bus should be less than 15pF. It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1mm and the total routing length less than 50mm. The total trace length inside the module is 27mm, so the exterior total trace length should be less than 23mm. NOTE SD card interface is not supported on ThreadX modules. 3.14. Wireless Connectivity Interfaces EC25 supports a low-power SDIO 3.0 interface for WLAN and UART/PCM interfaces for BT function. The following table shows the pin definition of wireless connectivity interfaces. Table 16: Pin Definition of Wireless Connectivity Interfaces Pin Name Pin No. I/O Description Comment WLAN Part SDC1_DATA3 129 IO WLAN SDIO data bus D3 1.8V power domain SDC1_DATA2 130 IO WLAN SDIO data bus D2 1.8V power domain SDC1_DATA1 131 IO WLAN SDIO data bus D1 1.8V power domain SDC1_DATA0 132 IO WLAN SDIO data bus D0 1.8V power domain SDC1_CLK 133 DO WLAN SDIO bus clock 1.8V power domain SDC1_CMD 134 IO WLAN SDIO bus command 1.8V power domain WLAN_EN 136 DO WLAN function control via FC20 module. Coexistence and Control Part 1.8V power domain. Active high. Cannot be pulled up before startup. EC25_Hardware_Design 58 / 130 LTE Standard Module Series EC25 Hardware Design PM_ENABLE 127 DO WLAN power control WAKE_ON_ WIRELESS 135 DI Wake up the host (EC25 module) by FC20 module COEX_UART_RX 137 DI LTE/WLAN&BT coexistence signal COEX_UART_TX 138 DO LTE/WLAN&BT coexistence signal WLAN_SLP_CLK 118 DO WLAN sleep clock 1.8V power domain Active high. 1.8V power domain 1.8V power domain. Cannot be pulled up before startup. 1.8V power domain. Cannot be pulled up before startup. BT Part BT_RTS BT_TXD BT_RXD PCM_IN1) PCM_OUT1) PCM_SYNC1) PCM_CLK1) 37 38 39 24 25 26 27 DI BT UART request to send 1.8V power domain DO BT UART transmit data 1.8V power domain DI BT UART receive data 1.8V power domain BT_CTS 40 DO BT UART clear to send 1.8V power domain. Cannot be pulled up before startup. DI PCM data input 1.8V power domain DO PCM data output 1.8V power domain IO PCM data frame synchronization signal 1.8V power domain IO PCM data bit clock 1.8V power domain BT_EN 139 DO BT function control via FC20 module. 1.8V power domain Active high. The following figure shows a reference design of wireless connectivity interfaces with Quectel FC20 module. EC25_Hardware_Design 59 / 130 LTE Standard Module Series EC25 Hardware Design Module FC20 Module PM_ENABL E DCDC/LDO VDD_3V3 POWER WLAN Bluetooth WLAN_SLP_CLK WAKE_ON_WIREL ESS COEX COEX_UART_RX COEX_UART_TX VDD_EXT SDC1_DATA3 SDC1_DATA2 SDC1_DATA1 SDC1_DATA0 SDC1_CLK SDC1_CMD WLAN_EN BT_EN BT_RTS BT_CTS BT_TXD BT_RXD PCM_IN PCM_OUT PCM_SYNC PCM_CLK WAKE_ON_WIREL ESS VIO SDIO_D3 SDIO_D2 SDIO_D1 SDIO_D0 SDIO_CLK SDIO_CMD WLAN_EN 32KHZ_IN LTE_UART_TXD LTE_UART_RXD BT_EN BT_UART_RTS BT_UART_CTS BT_UART_RXD BT_UART_TXD PCM_OUT PCM_IN PCM_SYNC PCM_CLK Figure 26: Reference Circuit of Wireless Connectivity Interfaces with FC20 Module 1. FC20 module can only be used as a slave device. 2. When BT function is enabled on EC25 module, PCM_SYNC and PCM_CLK pins are only used to 3. output signals. BT function is under development. 1) Pins 24~27 are multiplexing pins used for audio design on EC25 module and BT function on BT module. 4. Wireless connectivity interfaces are not supported on ThreadX modules. 5. For more information about wireless connectivity interfaces, please refer to document [5]. NOTES EC25_Hardware_Design 60 / 130 LTE Standard Module Series EC25 Hardware Design 3.14.1. WLAN Interface EC25 provides a low-power SDIO 3.0 interface and control interface for WLAN design. SDIO interface supports SDR mode (up to 50MHz). As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles:

It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 5010%. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DCDC signals, etc. It is recommended to keep matching length between CLK and DATA/CMD less than 1mm and total routing length less than 50mm. Keep termination resistors within 15~24 on clock lines near the module and keep the route distance from the module clock pins to termination resistors less than 5mm. Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than EC25 supports a dedicated UART interface and a PCM interface for BT application. Further information about BT interface will be added in future version of this document. 15pF. 3.14.2. BT Interface*

NOTE

* means under development. 3.15. ADC Interfaces The module provides two analog-to-digital converter (ADC) interfaces. AT+QADC=0 command can be used to read the voltage value on ADC0 pin. AT+QADC=1 command can be used to read the voltage value on ADC1 pin. For more details about these AT commands, please refer to document [2]. In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground. EC25_Hardware_Design 61 / 130 LTE Standard Module Series EC25 Hardware Design Table 17: Pin Definition of ADC Interfaces Pin Name Pin No. Description ADC0 ADC1 45 44 General purpose analog to digital converter General purpose analog to digital converter The following table describes the characteristic of ADC function. Table 18: Characteristic of ADC Parameter Min. Typ. Max. ADC0 Voltage Range ADC1 Voltage Range 0.3 0.3 ADC Resolution 15 VBAT_BB VBAT_BB Unit V V bits NOTES 1. ADC input voltage must not exceed that of VBAT_BB. 2. 3. It is prohibited to supply any voltage to ADC pins when VBAT power supply is removed. It is recommended to use a resistor divider circuit for ADC application. 3.16. SGMII Interface IEEE802.3 compliant EC25 includes an integrated Ethernet MAC with an SGMII interface and two management interfaces. The key features of the SGMII interface are shown below:

Support 10M/100M/1000M Ethernet work mode Support maximum 150Mbps (DL)/50Mbps (UL) for 4G network Support VLAN tagging Support IEEE1588 and Precision Time Protocol (PTP) Can be used to connect to external Ethernet PHY like AR8033, or to an external switch Management interfaces support dual voltage 1.8V/2.85V The following table shows the pin definition of SGMII interface. EC25_Hardware_Design 62 / 130 LTE Standard Module Series EC25 Hardware Design Table 19: Pin Definition of SGMII Interface Pin Name Pin No. I/O Description Comment Control Signal Part EPHY_RST_N 119 DO Ethernet PHY reset 1.8V/2.85V power domain EPHY_INT_N 120 DI Ethernet PHY interrupt 1.8V power domain SGMII_MDATA 121 IO 1.8V/2.85V power domain SGMII MDIO (Management Data Input/Output) data SGMII MDIO (Management Data Input/Output) clock SGMII_MCLK 122 DO 1.8V/2.85V power domain USIM2_VDD 128 PO SGMII MDIO pull-up power source Configurable power source. 1.8V/2.85V power domain. External pull-up power source for SGMII MDIO pins. SGMII Signal Part SGMII_TX_M 123 AO SGMII transmission - minus SGMII_TX_P 124 AO SGMII transmission - plus SGMII_RX_P 125 SGMII receiving - plus SGMII_RX_M 126 SGMII receiving - minus AI AI Connect with a 0.1uF capacitor, and is close to the PHY side. Connect with a 0.1uF capacitor, and is close to EC25 module. The following figure shows the simplified block diagram for Ethernet application. Figure 27: Simplified Block Diagram for Ethernet Application The following figure shows a reference design of SGMII interface with PHY AR8033 application. EC25_Hardware_Design 63 / 130 LTE Standard Module Series EC25 Hardware Design Figure 28: Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in customers applications, please follow the criteria below in the Ethernet PHY circuit design:

Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. Keep the maximum trace length less than 10-inch and keep skew on the differential pairs less than 20mil. should be complete. The differential impedance of SGMII data trace is 10010%, and the reference ground of the area Make sure the trace spacing between SGMII RX and TX is at least 3 times of the trace width, and the same to the adjacent signal traces. NOTE SGMII interface is not supported on ThreadX modules. 3.17. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two pins which are NET_MODE and NET_STATUS. The following tables describe the pin definition and logic level changes in different network status. EC25_Hardware_Design 64 / 130 LTE Standard Module Series EC25 Hardware Design Table 20: Pin Definition of Network Connection Status/Activity Indicator Pin Name Pin No. I/O Description Comment NET_MODE 5 DO Indicate the modules network registration mode NET_STATUS 6 DO Indicate the modules network activity status 1.8V power domain Cannot be pulled up before startup 1.8V power domain Table 21: Working State of Network Connection Status/Activity Indicator Pin Name Logic Level Changes Network Status NET_MODE Always High Always Low Registered on LTE network Others Flicker slowly (200ms High/1800ms Low) Network searching NET_STATUS Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure. Figure 29: Reference Circuit of the Network Indicator EC25_Hardware_Design 65 / 130 LTE Standard Module Series EC25 Hardware Design 3.18. STATUS The STATUS pin is an open drain output for indicating the modules operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 22: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 61 OD Indicate the modules operation status An external pull-up resistor is required. If unused, keep it open. The following figure shows different circuit designs of STATUS, and customers can choose either one according to customers application demands. Figure 30: Reference Circuits of STATUS NOTES The status pin cannot be used as indication of module shutdown status when VBAT power supply is removed. 3.19. Behaviors of RI AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. No matter on which port a URC is presented, the URC will trigger the behaviors of RI pin. EC25_Hardware_Design 66 / 130 LTE Standard Module Series EC25 Hardware Design URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. In addition, RI behavior can be configured flexibly. The default behaviors of the RI is shown as below. NOTE State Idle URC Table 23: Behaviors of RI Response RI keeps at high level RI outputs 120ms low pulse when a new URC returns The RI behavior can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2]

for details. 3.20. USB_BOOT Interface EC25 provides a USB_BOOT pin. Customers can pull up USB_BOOT to 1.8V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface. Table 24: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 115 DI Force the module to enter emergency download mode The following figure shows a reference circuit of USB_BOOT interface. 1.8V power domain. Active high. It is recommended to reserve a test point. EC25_Hardware_Design 67 / 130 LTE Standard Module Series EC25 Hardware Design Module USB_BOOT Test point 4.7K Close to test point TVS VDD_EXT Figure 31: Reference Circuit of USB_BOOT Interface NOTE 1 VBAT 500ms VH=0.8V VIL0.5V About 100ms USB_BOOT can be pul led up to 1.8V before VDD_EXT Is powered up, and the module will enter emerge ncy download mode wh en i t is powered on. PWRKEY VDD_EXT USB_BOOT RESET_N Figure 32: Timing Sequence for Entering Emergency Download Mode NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30ms. 2. When using MCU to control module to enter the emergency download mode, please follow the above timing sequence. It is not recommended to pull up USB_BOOT to 1.8V before powering up VBAT. Short the test points as shown in Figure 31 can manually force the module to enter download mode. EC25_Hardware_Design 68 / 130 LTE Standard Module Series EC25 Hardware Design 4 GNSS Receiver 4.1. General Description EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC25 GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows the GNSS performance of EC25. Table 25: GNSS Performance Parameter Description Conditions Sensitivity

(GNSS) TTFF

(GNSS) Cold start Autonomous Reacquisition Autonomous Tracking Autonomous Cold start

@open sky Warm start

@open sky Autonomous XTRA enabled Autonomous XTRA enabled Typ.

-146

-157

-157 35 18 26 2.2 Unit dBm dBm dBm s s s s EC25_Hardware_Design 69 / 130 LTE Standard Module Series EC25 Hardware Design Hot start

@open sky CEP-50 Autonomous XTRA enabled Autonomous

@open sky 2.5 1.8

<2.5 s s m Accuracy

(GNSS) NOTES 1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes position within 3 minutes after executing cold start command. 4.3. Layout Guidelines The following layout guidelines should be taken into account in customers designs. Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna. Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar kept away from the antennas. isolation and protection. Keep 50 characteristic impedance for the ANT_GNSS trace. Please refer to Chapter 5 for GNSS antenna reference design and antenna installation information. EC25_Hardware_Design 70 / 130 LTE Standard Module Series EC25 Hardware Design 5 Antenna Interfaces EC25 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna ports have an impedance of 50. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 26: Pin Definition of RF Antennas Pin Name Pin No. Description Comment ANT_MAIN 49 Main antenna 50 impedance I/O IO ANT_DIV 35 AI Receive diversity antenna 50 impedance. If unused, keep it open. 5.1.2. Operating Frequency Table 27: Module Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 Transmit 824~849 880~915 1710~1785 1850~1910 1920~1980 Receive 869~894 925~960 1805~1880 1930~1990 2110~2170 Unit MHz MHz MHz MHz MHz EC25_Hardware_Design 71 / 130 LTE Standard Module Series EC25 Hardware Design LTE-FDD B1 1920~1980 LTE-FDD B4 1710~1755 LTE-FDD B5 824~849 LTE-FDD B7 2500~2570 2620~2690 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 WCDMA B19 LTE-FDD B2 LTE-FDD B3 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B26 LTE-FDD B28 1850~1910 1710~1755 824~849 830~840 880~915 830~845 1850~1910 1710~1785 880~915 699~716 777~787 788~798 815~830 830~845 832~862 814~849 703~748 LTE-TDD B38 2570~2620 LTE-TDD B40 2300~2400 LTE-TDD B41 2555~2655 LTE-FDD B66 1710~1780 1930~1990 2110~2155 869~894 875~885 925~960 875~890 2110~2170 1930~1990 1805~1880 2110~2155 869~894 925~960 729~746 746~756 758~768 860~875 875~890 791~821 859~894 758~803 2570~2620 2300~2400 2555~2655 2100~2200 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHZ MHz MHz MHz MHz MHz MHz MHz MHz MHz EC25_Hardware_Design 72 / 130 LTE Standard Module Series EC25 Hardware Design LTE-FDD B71 663~698 617~652 MHz 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A -type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 33: Reference Circuit of RF Antenna Interface NOTES receiving sensitivity. possible. 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the 2. ANT_DIV function is enabled by default. AT+QCFG="diversity",0 command can be used to disable receive diversity. Please refer to document [2] for details. 3. Place the -type matching components (R1&C1&C2, R2&C3&C4) as close to the antenna as 5.1.4. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled as 50. The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, height from the reference ground to the signal layer (H), and the space between the RF trace and the ground (S). Microstrip and coplanar waveguide are typically used in RF layout to control characteristic impedance. The following figures are reference designs of microstrip or coplanar waveguide with different PCB structures. EC25_Hardware_Design 73 / 130 LTE Standard Module Series EC25 Hardware Design

. Figure 34: Microstrip Design on a 2-layer PCB Figure 35: Coplanar Waveguide Design on a 2-layer PCB Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EC25_Hardware_Design 74 / 130 LTE Standard Module Series EC25 Hardware Design Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:

Please use an impedance simulation tool to control the characteristic impedance of RF traces as 50. connected to ground. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully The distance between the RF pins and the RF connector should be as short as possible, and all the right angle traces should be changed to curved ones. There should be clearance area under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W). For more details about RF layout, please refer to document [6]. 5.2. GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 28: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 47 AI GNSS antenna 50 impedance. If unused, keep it open. EC25_Hardware_Design 75 / 130 Type GPS Galileo BeiDou QZSS NOTES LTE Standard Module Series EC25 Hardware Design Table 29: GNSS Frequency GLONASS 1597.5~1605.8 Frequency 1575.421.023 1575.422.046 1561.0982.046 1575.42 Unit MHz MHz MHz MHz MHz A reference design of GNSS antenna is shown as below. Figure 38: Reference Circuit of GNSS Antenna 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. If the module is designed with a passive antenna, then the VDD circuit is not needed. EC25_Hardware_Design 76 / 130 LTE Standard Module Series EC25 Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement Table 30: Antenna Requirements Type Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain:< 17dB VSWR: 2 Efficiency: > 30%

Max input power: 50W Input impedance: 50 Cable insertion loss: < 1dB

(GSM850, EGSM900, WCDMA B5/B6/B8/B19, LTE-FDD B5/B8/B12/B13/B14/B18/B19/B20/B26/B28/B71) Cable insertion loss: < 1.5dB

(DCS1800, PCS1900, WCDMA B1/B2/B4, LTE-FDD B1/B2/B3/B4/B66) Cable insertion loss: < 2dB

(LTE-FDD B7, LTE-TDD B38/B40/B41) 1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. GSM/WCDMA/LTE GNSS1) NOTE EC25_Hardware_Design 77 / 130 LTE Standard Module Series EC25 Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.FL-LP Connectors EC25_Hardware_Design 78 / 130 LTE Standard Module Series EC25 Hardware Design The following figure describes the space factor of mated connector. Figure 41: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. EC25_Hardware_Design 79 / 130 LTE Standard Module Series EC25 Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage at ADC0 Voltage at ADC1 Min.

-0.3

-0.3 0 0 0 0 Voltage at Digital Pins

-0.3 Max. Unit 4.7 5.5 0.8 1.8 2.3 VBAT_BB VBAT_BB V V A A V V V EC25_Hardware_Design 80 / 130 LTE Standard Module Series EC25 Hardware Design 6.2. Power Supply Ratings Table 32: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum and maximum values. Voltage drop during burst transmission Maximum power control level on EGSM900. Maximum power control level on EGSM900. Peak supply current

(during transmission slot) USB power supply, used for USB detection 3.3 3.8 4.3 V 400 mV 1.8 2.0 A USB_VBUS 3.0 5.0 5.25 V 6.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table. Table 33: Operation and Storage Temperatures Parameter Min. Max. Unit Operation Temperature Range1)

-35 Extended Temperature Range2)

-40 Storage Temperature Range

-40 Typ.

+25

+75

+85

+90 C C C VBAT IVBAT NOTES 1. 2. 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call* (emergency call is not supported on ThreadX modules), etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum EC25_Hardware_Design 81 / 130 LTE Standard Module Series EC25 Hardware Design and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operation temperature levels, the module will meet 3GPP specifications again.

* means under development. 3. 6.4. Current Consumption The values of current consumption are shown below. Table 34: EC25-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down IVBAT Sleep state WCDMA PF=128 (USB disconnected) AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) Idle state WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) 11 1.16 2.74 2.00 2.15 1.67 2.60 1.90 2.79 2.00 19.5 29.5 21.0 31.0 20.7 30.8 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 82 / 130 LTE Standard Module Series EC25 Hardware Design GPRS data transfer

(GNSS OFF) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) 20.8 32.0 mA mA EGSM900 4DL/1UL @33.22dBm 271.0 mA EGSM900 3DL/2UL @33.0dBm 464.0 mA EGSM900 2DL/3UL @30.86dBm 524.0 mA EGSM900 1DL/4UL @29.58dBm 600.0 mA DCS1800 4DL/1UL @29.92dBm 192.0 mA DCS1800 3DL/2UL @29.84dBm 311.0 mA DCS1800 2DL/3UL @29.67dBm 424.0 mA DCS1800 1DL/4UL @29.48dBm 539.0 mA EGSM900 4DL/1UL PCL=8 @27.40dBm 174.0 mA EGSM900 3DL/2UL PCL=8 @27.24dBm 281.0 mA EGSM900 2DL/3UL PCL=8 @27.11dBm 379.0 mA EDGE data transfer

(GNSS OFF) EGSM900 1DL/4UL PCL=8 @26.99dBm 480.0 mA DCS1800 4DL/1UL PCL=2 @25.82dBm 159.0 mA DCS1800 3DL/2UL PCL=2 @25.85dBm 251.0 mA DCS1800 2DL/3UL PCL=2 @25.68dBm 340.0 mA DCS1800 1DL/4UL PCL=2 @25.57dBm 433.0 mA WCDMA B1 HSDPA @22.47dBm 613.0 mA WCDMA B1 HSUPA @22.44dBm 609.0 mA WCDMA B5 HSDPA @23.07dBm 671.0 mA WCDMA B5 HSUPA @23.07dBm 669.0 mA WCDMA B8 HSDPA @22.67dBm 561.0 mA WCDMA B8 HSUPA @22.39dBm 557.0 mA WCDMA data transfer

(GNSS OFF) LTE data LTE-FDD B1 @23.27dBm 754.0 mA EC25_Hardware_Design 83 / 130 LTE Standard Module Series EC25 Hardware Design transfer

(GNSS OFF) GSM voice call WCDMA voice call LTE-FDD B3 @23.54dBm 774.0 mA LTE-FDD B5 @22.83dBm 762.0 mA LTE-FDD B7 @23.37dBm 842.0 mA LTE-FDD B8 @23.48dBm 720.0 mA LTE-FDD B20 @22.75dBm 714.0 mA LTE-TDD B38 @23.05dBm 481.0 mA LTE-TDD B40 @23.17dBm 431.8 mA LTE-TDD B41 @23.02dBm 480.0 mA EGSM900 PCL=5 @33.08dBm 264.0 mA DCS1800 PCL=0 @29.75dBm 190.0 mA WCDMA B1 @23.22dBm 680.0 mA WCDMA B5 @23.18dBm 677.0 mA WCDMA B8 @23.54dBm 618.0 mA Table 35: EC25-A Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) IVBAT LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) Idle state WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) 10 1.1 1.8 1.5 2.2 1.6 21.0 31.0 21.0 uA mA mA mA mA mA mA mA mA EC25_Hardware_Design 84 / 130 LTE Standard Module Series EC25 Hardware Design LTE-FDD PF=64 (USB connected) 31.0 mA WCDMA B2 HSDPA @21.9dBm 591.0 mA WCDMA B2 HSUPA @21.62dBm 606.0 mA WCDMA data transfer

(GNSS OFF) WCDMA B4 HSDPA @22.02dBm 524.0 mA WCDMA B4 HSUPA @21.67dBm 540.0 mA WCDMA B5 HSDPA @22.71dBm 490.0 mA WCDMA B5 HSUPA @22.58dBm 520.0 mA LTE data transfer

(GNSS OFF) WCDMA voice call LTE-FDD B2 @22.93dBm 715.0 mA LTE-FDD B4 @22.96dBm 738.0 mA LTE-FDD B12 @23.35dBm 663.0 mA WCDMA B2 @22.93dBm 646.0 mA WCDMA B4 @23dBm 572.0 mA WCDMA B5 @23.78dBm 549.0 mA IVBAT Table 36: EC25-V Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) 10 0.85 2.0 1.5 20.0 31.0 uA mA mA mA mA mA LTE-FDD B4 @23.14dBm 770.0 mA LTE-FDD B13 @23.48dBm 531.0 mA Idle state LTE data transfer

(GNSS OFF) EC25_Hardware_Design 85 / 130 LTE Standard Module Series EC25 Hardware Design Table 37: EC25-J Current Consumption Parameter Description Conditions Typ. Unit IVBAT LTE-TDD PF=64 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB connected) WCDMA B1 HSDPA @22.30dBm WCDMA B1 HSUPA @21.98dBm WCDMA B6 HSDPA @22.32dBm WCDMA B6 HSUPA @21.78dBm WCDMA B8 HSDPA @22.17dBm WCDMA B8 HSUPA @21.98dBm WCDMA B19 HSDPA @22.44dBm WCDMA B19 HSUPA @21.82dBm Idle state WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) LTE-FDD B1 @23.13dBm LTE-FDD B3 @23.07dBm 2.9 4.0 3.5 4.8 4.0 4.9 4.1 29.6 42.7 29.8 41.3 29.9 42.7 823.4 835.2 616.6 621.6 658.3 690.1 615.7 617.2 1075.0 988.5 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 86 / 130 LTE Standard Module Series EC25 Hardware Design LTE-FDD B8 @23.32dBm LTE-FDD B18 @23.61dBm LTE-FDD B19 @23.67dBm LTE-FDD B26 @22.86dBm LTE-TDD B41 @22.40dBm WCDMA B1 @23.23dBm WCDMA B6 @23.02dBm WCDMA B8 @23.12dBm WCDMA B19 @22.99dBm WCDMA voice call Table 38: EC25-AU Current Consumption OFF state Power down AT+CFUN=0 IVBAT PCS1900 DRX=5 (USB disconnected) Sleep state GSM850 DRX=5 (USB disconnected) EGSM900 DRX=5 (USB disconnected) DCS1800 DRX=5 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) 882.3 867.0 911.4 909.6 563.4 964.8 667.9 735.4 664.8 11 1.3 1.8 2.0 1.9 1.9 2.0 1.6 2.2 1.6 2.3 1.6 mA mA mA mA mA mA mA mA mA uA mA mA mA mA mA mA mA mA mA mA mA Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) 1.46 mA EC25_Hardware_Design 87 / 130 LTE Standard Module Series EC25 Hardware Design Idle state EGSM900 DRX=5 (USB disconnected) 22.0 mA EGSM900 DRX=5 (USB connected) 34.0 mA WCDMA PF=64 (USB disconnected) 22.0 mA WCDMA PF=64 (USB connected) 33.0 mA LTE-FDD PF=64 (USB disconnected) 24.0 mA LTE-FDD PF=64 (USB connected) 35.0 mA GSM850 1UL/4DL @32.53dBm 232.0 mA GSM850 2UL/3DL @32.34dBm 384.0 mA GSM850 3UL/2DL @30.28dBm 441.0 mA GSM850 4UL/1DL @29.09dBm 511.0 mA EGSM900 1UL/4DL @32.34dBm 241.0 mA EGSM900 2UL/3DL @32.19dBm 397.0 mA EGSM900 3UL/2DL @30.17dBm 459.0 mA GPRS data transfer

(GNSS OFF) EGSM900 4UL/1DL @28.96dBm 533.0 mA DCS1800 1UL/4DL @29.71dBm 183.0 mA DCS1800 2UL/3DL @29.62dBm 289.0 mA DCS1800 3UL/2DL @29.49dBm 392.0 mA DCS1800 4UL/1DL @29.32dBm 495.0 mA PCS1900 1UL/4DL @29.61dBm 174.0 mA PCS1900 2UL/3DL @29.48dBm 273.0 mA PCS1900 3UL/2DL @29.32dBm 367.0 mA PCS1900 4UL/1DL @29.19dBm 465.0 mA GSM850 1UL/4DL @27.09dBm 154.0 mA GSM850 2UL/3DL @26.94dBm 245.0 mA GSM850 3UL/2DL @26.64dBm 328.0 mA EDGE data transfer

(GNSS OFF) EC25_Hardware_Design 88 / 130 LTE Standard Module Series EC25 Hardware Design GSM850 4UL/1DL @26.53dBm 416.0 mA EGSM900 1UL/4DL @26.64dBm 157.0 mA EGSM900 2UL/3DL @26.95dBm 251.0 mA EGSM900 3UL/2DL @26.57dBm 340.0 mA EGSM900 4UL/1DL @26.39dBm 431.0 mA DCS1800 1UL/4DL @26.03dBm 152.0 mA DCS1800 2UL/3DL @25.62dBm 240.0 mA DCS1800 3UL/2DL @25.42dBm 325.0 mA DCS1800 4UL/1DL @25.21dBm 415.0 mA PCS1900 1UL/4DL @25.65dBm 148.0 mA PCS1900 2UL/3DL @25.63dBm 232.0 mA PCS1900 3UL/2DL @25.54dBm 313.0 mA PCS1900 4UL/1DL @25.26dBm 401.0 mA WCDMA B1 HSDPA @22.34dBm 625.0 mA WCDMA B1 HSUPA @21.75dBm 617.0 mA WCDMA B2 HSDPA @22.51dBm 610.0 mA WCDMA data transfer

(GNSS OFF) WCDMA B2 HSUPA @22. 14dBm 594.0 mA WCDMA B5 HSDPA @22.98dBm 576.0 mA WCDMA B5 HSUPA @22.89dBm 589.0 mA WCDMA B8 HSDPA @22.31dBm 556.0 mA WCDMA B8 HSUPA @22.11dBm 572.0 mA LTE data transfer

(GNSS OFF) LTE-FDD B1 @23.28dBm LTE-FDD B2 @23.34dBm LTE-FDD B3 @23.2dBm LTE-FDD B4 @22.9dBm 817.0 mA 803.0 mA 785.0 mA 774.0 mA EC25_Hardware_Design 89 / 130 LTE Standard Module Series EC25 Hardware Design LTE-FDD B5 @23.45dBm LTE-FDD B7 @22.84dBm LTE-FDD B8 @22.92dBm LTE-FDD B28 @23.23dBm LTE-TDD B40 @23.3dBm GSM850 PCL5 @32.66dBm EGSM900 PCL5 @32.59dBm DCS1800 PCL0 @29.72dBm PCS1900 PCL0 @29.82dBm WCDMA B1 @23.27dBm WCDMA B2 @23.38dBm WCDMA B5 @23.38dBm WCDMA B8 @23.32dBm GSM voice call WCDMA voice call Table 39: EC25-AUT Current Consumption Parameter Description Conditions Typ. Unit IVBAT OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) Idle state EC25_Hardware_Design 90 / 130 687.0 mA 843.0 mA 689.0 mA 804.0 mA 429.0 mA 228.0 mA 235.0 mA 178.0 mA 170.0 mA 687.0 mA 668.0 mA 592.0 mA 595.0 mA 10 1.0 1.9 1.5 2.3 1.9 23.0 33.0 17.0 29.0 uA mA mA mA mA mA mA mA mA mA LTE Standard Module Series EC25 Hardware Design WCDMA B1 HSDPA @22.24dBm 500.0 mA WCDMA data transfer

(GNSS OFF) WCDMA B1 HSUPA @22.05dBm 499.0 mA WCDMA B5 HSDPA @22.39dBm 418.0 mA WCDMA B5 HSUPA @22dBm 486.0 mA LTE-FDD B1 @23.28dBm 707.0 mA LTE-FDD B3 @23.36dBm 782.0 mA LTE data transfer

(GNSS OFF) LTE-FDD B5 @23.32dBm 588.0 mA LTE-FDD B7 @23.08dBm 692.0 mA LTE-FDD B28A @23.37dBm 752.0 mA LTE-FDD B28B @23.48dBm 770.0 mA WCDMA voice call WCDMA B1 @23.22dBm WCDMA B5 @23.01dBm 546.0 mA 511.0 mA IVBAT Table 40: EC25-AF Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) Idle state 10 1.0 1.8 1.4 2.2 1.8 23.3 33.4 17.6 29.4 uA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 91 / 130 LTE Standard Module Series EC25 Hardware Design WCDMA B2 HSDPA @22.63dBm WCDMA B2 HSUPA @22.49dBm WCDMA B4 HSDPA @22.45dBm WCDMA B4 HSUPA @22.57dBm WCDMA data transfer

(GNSS OFF) WCDMA B5 HSDPA @22.49dBm WCDMA B5 HSUPA @22.43dBm LTE-FDD B2 @22.92dBm LTE-FDD B4 @23.12dBm LTE-FDD B5 @22.98dBm LTE-FDD B12 @23.42dBm LTE-FDD B13 @22.92dBm LTE-FDD B14 @23.42dBm LTE-FDD B66 @23.35dBm LTE-FDD B71 @23.39dBm WCDMA B2 @23.59dBm WCDMA B4 @23.47dBm WCDMA B5 @23.46dBm LTE data transfer

(GNSS OFF) WCDMA voice call 560.0 564.0 601.0 610.0 603.0 617.0 698.0 710.0 650.0 648.0 690.0 685.0 715.0 689.0 585.0 610.0 605.0 8 0.83 1.55 1.24 1.07 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA uA mA mA mA mA Table 41: EC25-AFX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) IVBAT WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) WCDMA PF=256 (USB disconnected) EC25_Hardware_Design 92 / 130 LTE Standard Module Series EC25 Hardware Design WCDMA PF=512 (USB disconnected) LTE-FDD PF=32 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=256 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) 1.00 2.97 1.93 1.43 1.17 14.9 34.2 15.2 34.8 mA mA mA mA mA mA mA mA mA WCDMA B2 HSDPA @22.1dBm 548.0 mA WCDMA B2 HSUPA @22.28dBm 545.0 mA WCDMA B4 HSDPA @22.2dBm 580.0 mA WCDMA B4 HSUPA @22.2dBm 596.0 mA WCDMA B5 HSDPA @22.1dBm 498.0 mA WCDMA B5 HSUPA @22.0dBm 500.0 mA LTE-FDD B2 @23.36dBm 621.0 mA LTE-FDD B4 @22.7dBm LTE-FDD B5 @22.7dBm 702.0 mA 564.0 mA Idle state WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) LTE-FDD B12 @22.66dBm 648.0 mA LTE-FDD B13 @22.79dBm 617.0 mA LTE-FDD B14 @22.72dBm 622.0 mA LTE-FDD B66 @22.86dBm 698.0 mA WCDMA voice call LTE-FDD B71 @22.73dBm 628.0 mA WCDMA B2 @22.63dBm 578.0 mA WCDMA B4 @22.74dBm 581.0 mA EC25_Hardware_Design 93 / 130 LTE Standard Module Series EC25 Hardware Design WCDMA B5 @22.6dBm 561.0 mA Table 42: EC25-EU Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down Sleep state WCDMA PF=128 (USB disconnected) AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) 11 1.16 2.74 2.0 2.15 1.67 2.60 1.90 2.79 2.00 19.5 29.5 21.0 31.0 20.7 30.8 20.8 32.0 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA IVBAT GSM DRX=5 (USB disconnected) Idle state GPRS data transfer

(GNSS OFF) EGSM900 4DL/1UL @33.23dBm 243.0 mA EGSM900 3DL/2UL @31.96dBm 388.0 mA EGSM900 2DL/3UL @29.73dBm 453.0 mA EC25_Hardware_Design 94 / 130 LTE Standard Module Series EC25 Hardware Design EGSM900 1DL/4UL @28.5dBm 522 mA DCS1800 4DL/1UL @30.49dBm 172.0 mA DCS1800 3DL/2UL @29.24dBm 274.0 mA DCS1800 2DL/3UL @27.15dBm 337.0 mA DCS1800 1DL/4UL @25.88dBm 406.0 mA EGSM900 4DL/1UL PCL=8 @26.60dBm 142.0 mA EGSM900 3DL/2UL PCL=8 @25.43dBm 229.0 mA EGSM900 2DL/3UL PCL=8 @23.4dBm 286.0 mA EGSM900 1DL/4UL PCL=8 @22.36dBm 348.0 mA DCS1800 4DL/1UL PCL=2 @25.59dBm 136.0 mA DCS1800 3DL/2UL PCL=2 @24.54dBm 225.0 mA DCS1800 2DL/3UL PCL=2 @22.38dBm 300.0 mA DCS1800 1DL/4UL PCL=2 @21.24dBm 379.0 mA WCDMA B1 HSDPA @22.93dBm 504.0 mA WCDMA B1 HSUPA @22.62dBm 512.0 mA WCDMA B8 HSDPA @22.88dBm 562.0 mA WCDMA B8 HSUPA @22.14dBm 535.0 mA LTE-FDD B1 @23.6dBm 664.0 mA LTE-FDD B3 @23.67dBm 728.0 mA LTE-FDD B7 @23.83dBm 821.0 mA LTE-FDD B8 @23.82dBm 695.0 mA LTE-FDD B20 @23.88dBm 649.0 mA LTE-FDD B28A @23.43dBm 689.0 mA LTE-TDD B38 @22.82dBm 438.0 mA LTE-TDD B40 @23.43dBm 355.0 mA EDGE data transfer

(GNSS OFF) WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) EC25_Hardware_Design 95 / 130 LTE Standard Module Series EC25 Hardware Design GSM voice call WCDMA voice call LTE-TDD B41 @23.46dBm 451.0 mA EGSM900 PCL=5 @33.25dBm 258.0 mA DCS1800 PCL=0 @30.23dBm 178.0 mA WCDMA B1 @23.88dBm 548.0 mA WCDMA B8 @23.8dBm 615.0 mA Table 43: EC25-EC Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down IVBAT GSM DRX=5 (USB disconnected) Sleep state WCDMA PF=64 (USB disconnected) AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) GSM DRX=5 (USB connected) Idle state WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) GPRS data transfer

(GNSS OFF) EGSM900 4DL/1UL @32.91dBm EGSM900 3DL/2UL @32.75dBm EGSM900 2DL/3UL @30.87dBm 9 1.0 2.0 1.3 2.1 1.7 2.3 1.8 17.3 28.3 17.1 27.2 18.9 28.7 250.0 462.0 511.0 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 96 / 130 LTE Standard Module Series EC25 Hardware Design EGSM900 1DL/4UL @28.84dBm DCS1800 4DL/1UL @29.46dBm DCS1800 3DL/2UL @29.41dBm DCS1800 2DL/3UL @29.37dBm DCS1800 1DL/4UL @29.28dBm EDGE data transfer

(GNSS OFF) EGSM900 4DL/1UL PCL=8 @25.21dBm 175.0 EGSM900 3DL/2UL PCL=8 @24.80dBm 295.0 EGSM900 2DL/3UL PCL=8 @24.74dBm 397.0 EGSM900 1DL/4UL PCL=8 @24.38dBm 509.0 DCS1800 4DL/1UL PCL=2 @25.72dBm 134.0 DCS1800 3DL/2UL PCL=2 @24.86dBm 211.0 DCS1800 2DL/3UL PCL=2 @25.59dBm 312.0 DCS1800 1DL/4UL PCL=2 @25.39dBm 299.0 WCDMA data transfer

(GNSS OFF) WCDMA B1 HSDPA @22.54dBm WCDMA B1 HSUPA @22.45dBm WCDMA B8 HSDPA @22.42dBm WCDMA B8 HSUPA @21.91dBm LTE data transfer

(GNSS OFF) LTE-FDD B1 @22.55dBm LTE-FDD B3 @22.93dBm LTE-FDD B7 @23.03dBm LTE-FDD B20 @22.98dBm LTE-FDD B28 @22.27dBm GSM voice call EGSM900 PCL=5 @33.84dBm DCS1800 PCL=0 @29.62dBm WCDMA voice WCDMA B1 @23.94dBm 586.0 156.0 250.0 344.0 443.0 567.0 574.3 481.9 463.0 752.0 701.5 715.4 724.6 782.5 292.0 154.0 614.6 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 97 / 130 LTE Standard Module Series EC25 Hardware Design call WCDMA B8 @23.33dBm 517.0 mA Table 44: EC25-EUX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down Sleep state WCDMA PF=128 (USB disconnected) AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) 9 0.9 1.8 1.3 1.6 1.3 2.2 1.6 2.2 1.6 14.5 34.3 14.7 35.3 15.0 36.5 15.0 36.5 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA IVBAT GSM DRX=5 (USB disconnected) Idle state GPRS data transfer

(GNSS OFF) EGSM900 4DL/1UL @33.02dBm 270.7 mA EGSM900 3DL/2UL @32.24dBm 444.3 mA EGSM900 2DL/3UL @30.08dBm 509.8 mA EC25_Hardware_Design 98 / 130 LTE Standard Module Series EC25 Hardware Design EGSM900 1DL/4UL @29.50dBm 629.3 mA DCS1800 4DL/1UL @29.63dBm 157.4 mA DCS1800 3DL/2UL @28.96dBm 246.3 mA DCS1800 2DL/3UL @27.49dBm 310.6 mA DCS1800 1DL/4UL @26.44dBm 377.7 mA EGSM900 4DL/1UL PCL=8 @27.27dBm 175.4 mA EGSM900 3DL/2UL PCL=8 @26.13dBm 292.1 mA EGSM900 2DL/3UL PCL=8 @24.03dBm 386.8 mA EGSM900 1DL/4UL PCL=8 @23.35dBm 494.7 mA DCS1800 4DL/1UL PCL=2 @25.92dBm 134.5 mA DCS1800 3DL/2UL PCL=2 @25.63dBm 222.9 mA DCS1800 2DL/3UL PCL=2 @23.14dBm 301.2 mA DCS1800 1DL/4UL PCL=2 @22.60dBm 391.8 mA WCDMA B1 HSDPA @22.01dBm 534.8 mA WCDMA B1 HSUPA @21.38dBm 526.7 mA WCDMA B8 HSDPA @22.21dBm 459.8 mA WCDMA B8 HSUPA @21.85dBm 471.6 mA LTE-FDD B1 @23.38dBm 743.4 mA LTE-FDD B3 @22.87dBm 674.6 mA LTE-FDD B7 @22.08dBm 658.8 mA LTE-FDD B8 @23.49dBm 607.3 mA LTE-FDD B20 @23.01dBm 711.0 mA LTE-FDD B28A @23.18dBm 788.2 mA LTE-TDD B38 @23.38dBm 446.6 mA LTE-TDD B40 @23.56dBm 344.4 mA EDGE data transfer

(GNSS OFF) WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) EC25_Hardware_Design 99 / 130 LTE Standard Module Series EC25 Hardware Design GSM voice call WCDMA voice call LTE-TDD B41 @23.17dBm 483.2 mA EGSM900 PCL=5 @32.81dBm 262.2 mA DCS1800 PCL=0 @29.62dBm 151.2 mA WCDMA B1 @23.09dBm 594.2 mA WCDMA B8 @23.18dBm 504.3 mA Table 45: EC25-MX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) 19 1.0 2.3 1.7 2.5 2.2 12.9 32.0 13.7 32.6 uA mA mA mA mA mA mA mA mA mA WCDMA B2 HSDPA @22.27dBm 581.9 mA WCDMA B2 HSUPA @22.15dBm 603.0 mA WCDMA B4 HSDPA @22.5dBm 578.0 mA WCDMA B4 HSUPA @22.5dBm 571.0 mA WCDMA B5 HSDPA @22.4dBm 499.0 mA WCDMA B5 HSUPA @22.17dBm 515.0 mA LTE data LTE-FDD B2 @23.2dBm 685.0 mA Idle state WCDMA data transfer

(GNSS OFF) IVBAT EC25_Hardware_Design 100 / 130 LTE Standard Module Series EC25 Hardware Design transfer

(GNSS OFF) LTE-FDD B4 @23.4dBm LTE-FDD B5 @23.2dBm LTE-FDD B7 @24.3dBm LTE-FDD B28 @23.45dBm 631.0 mA LTE-FDD B66 @22.68dBm 781.0 mA 744.0 mA 578.0 mA 868.0 mA 643.0 mA 633.0 mA 551.0 mA 9 0.9 2.4 2.5 3.4 16.9 34.5 17.9 35.2 18.3 35.1 18.4 35.1 uA mA mA mA mA mA mA mA mA mA mA mA mA Parameter Description Conditions Typ. Unit WCDMA voice call WCDMA B2 @23.47dBm WCDMA B4 @23.5dBm WCDMA B5 @23.5dBm Table 46: EC25-AUX Current Consumption OFF state Power down Sleep state AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) IVBAT Idle state GPRS data GSM850 4DL/1UL @32.48dBm 240.1 mA EC25_Hardware_Design 101 / 130 LTE Standard Module Series EC25 Hardware Design transfer

(GNSS OFF) GSM850 3DL/2UL @31.59dBm GSM850 2DL/3UL @29.51dBm GSM850 1DL/4UL @28.41dBm EGSM900 4DL/1UL @33.27dBm EGSM900 3DL/2UL @31.99dBm EGSM900 2DL/3UL @29.67dBm EGSM900 1DL/4UL @28.44dBm DCS1800 4DL/1UL @29.44dBm DCS1800 3DL/2UL @28.47dBm DCS1800 2DL/3UL @26.29dBm DCS1800 1DL/4UL @25.26dBm PCS1900 4DL/1UL @29.44dBm PCS1900 3DL/2UL @28.59dBm PCS1900 2DL/3UL @26.51dBm PCS1900 1DL/4UL @25.34dBm GSM850 4DL/1UL @26.94dBm GSM850 3DL/2UL @25.90dBm GSM850 2DL/3UL @23.70dBm GSM850 1DL/4UL @22.47dBm EGSM900 2DL/3UL @23.97dBm EGSM900 1DL/4UL @22.68dBm DCS1800 4DL/1UL @26.01dBm DCS1800 3DL/2UL @25.02dBm EDGE data transfer

(GNSS OFF) EGSM900 4DL/1UL @27.18dBm EGSM900 3DL/2UL @26.03dBm 384.8 452.1 542.1 272.7 406.9 470.2 547.1 164.5 235.7 292.2 363.8 162.9 246.8 300.6 370.5 177.5 290.8 394.0 504.5 176.6 289.6 390.7 502.1 141.0 227.5 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 102 / 130 LTE Standard Module Series EC25 Hardware Design WCDMA data transfer

(GNSS OFF) WCDMA B4 HSDPA @22.97dBm WCDMA B4 HSUPA @23.20dBm DCS1800 2DL/3UL @23.04dBm DCS1800 1DL/4UL @22.11dBm PCS1900 4DL/1UL @26.24dBm PCS1900 3DL/2UL @25.46dBm PCS1900 2DL/3UL @23.45dBm PCS1900 1DL/4UL @22.38dBm WCDMA B1 HSDPA @22.60dBm WCDMA B1 HSUPA @22.48dBm WCDMA B2 HSDPA @21.60dBm WCDMA B2 HSUPA @22.06dBm WCDMA B5 HSDPA @22.63dBm WCDMA B5 HSUPA @22.98dBm WCDMA B8 HSDPA @22.46dBm WCDMA B8 HSUPA @21.89dBm LTE-FDD B1 @22.91dBm LTE-FDD B2 @22.85dBm LTE-FDD B3 @23.12dBm LTE-FDD B4 @22.52dBm LTE-FDD B5 @23.12dBm LTE-FDD B7 @22.95dBm LTE-FDD B8 @23.55dBm LTE-FDD B28A @23.23dBm LTE-TDD B40 @23.54dBm LTE data transfer

(GNSS OFF) 316.3 411.0 143.3 231.4 316.1 411.0 534.6 541.3 572.9 560.0 495.8 512.4 493.1 504.7 545.5 541.1 713.5 713.4 675.7 607.8 563.1 702.9 728.8 769.3 335.5 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Hardware_Design 103 / 130 LTE Standard Module Series EC25 Hardware Design GSM voice call WCDMA voice call GSM850 PCL5 @32.36dBm EGSM900 PCL5 @33.15dBm DCS1800 PCL0 @29.38dBm PCS1900 PCL0 @29.47dBm WCDMA B1 @23.13dBm WCDMA B2 @22.99dBm WCDMA B4 @22.90dBm WCDMA B5 @23.10dBm WCDMA B8 @22.90dBm 240.3 260.9 153.0 160.3 568.9 628.4 506.3 507.5 581.5 mA mA mA mA mA mA mA mA mA Table 47: GNSS Current Consumption of EC25 Series Module Parameter Description Conditions Typ. Unit Searching

(AT+CFUN=0) Cold start @Passive Antenna Lost state @Passive Antenna IVBAT

(GNSS) Tracking

(AT+CFUN=0) Instrument Environment Open Sky @Passive Antenna Open Sky @Active Antenna 54.0 53.9 30.5 33.2 40.8 mA mA mA mA mA 6.5. RF Output Power The following table shows the RF output power of EC25 module. Table 48: RF Output Power Frequency Max. Min. GSM850/EGSM900 33dBm2dB 5dBm5dB EC25_Hardware_Design 104 / 130 LTE Standard Module Series EC25 Hardware Design DCS1800/PCS1900 30dBm2dB 0dBm5dB GSM850/EGSM900 (8-PSK) 27dBm3dB 5dBm5dB DCS1800/PCS1900 (8-PSK) 26dBm3dB 0dBm5dB WCDMA bands 24dBm+1/-3dB

< -49dBm LTE-FDD bands LTE-TDD bands 23dBm2dB 23dBm2dB

< -39dBm

< -39dBm NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EC25 series module. Table 49: EC25-E Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-109.0dBm DCS1800

-109.0dBm WCDMA B1

-110.5dBm WCDMA B5

-110.5dBm WCDMA B8

-110.5dBm

-102.0dBm

-102.0dbm

-106.7dBm

-104.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-98.0dBm

-101.5dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-98.5dBm

-101.5dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.5dBm

-101.0dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-97.0dBm

-99.5dBm

-94.3dBm EC25_Hardware_Design 105 / 130 LTE Standard Module Series EC25 Hardware Design LTE-FDD B8 (10MHz)

-97.0dBm

-97.0dBm

-101.0dBm

-93.3dBm LTE-FDD B20 (10MHz)

-97.5dBm

-99.0dBm

-102.5dBm

-93.3dBm LTE-TDD B38 (10MHz)

-95dBm

-97.0dBm

-98.9dBm

-96.3dBm LTE-TDD B40 (10MHz)

-96.3dBm

-98.0dBm

-101.0dBm

-96.3dBm LTE-TDD B41 (10MHz)

-94.5dBm

-97.0dBm

-98.5dBm

-94.3dBm Table 50: EC25-A Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-110.0dBm WCDMA B4

-110.0dBm WCDMA B5

-110.5dBm

-104.7dBm

-106.7dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98.0dBm

-98.0dBm

-101.0dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.5dBm

-99.0dBm

-101.0dBm

-96.3dBm LTE-FDD B12 (10MHz)

-97.2dBm

-98.0dBm

-101.0dBm

-93.3dBm Table 51: EC25-V Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B4 (10MHz)

-97.5dBm

-99.0dBm

-101.0dBm

-96.3dBm LTE-FDD B13 (10MHz)

-97.7dBm

-97.0dBm

-100.0dBm

-93.3dBm Table 52: EC25-J Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B1

-110.0dBm WCDMA B6

-110.5dBm WCDMA B8

-110.5dBm

-106.7dBm

-106.7dBm

-103.7dBm

EC25_Hardware_Design 106 / 130 LTE Standard Module Series EC25 Hardware Design WCDMA B19

-110.5dBm

-106.7dBm LTE-FDD B1 (10MHz)

-97.5dBm

-98.7dBm

-100.2dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-97.1dBm

-100.5dBm

-93.3dBm LTE-FDD B8 (10MHz)

-98.4dBm

-99.0dBm

-101.2dBm

-93.3dBm LTE-FDD B18 (10MHz)

-99.5dBm

-99.0dBm

-101.7dBm

-96.3dBm LTE-FDD B19 (10MHz)

-99.2dBm

-99.0dBm

-101.4dBm

-96.3dBm LTE-FDD B26 (10MHz)

-99.5dBm

-99.0dBm

-101.5dBm

-93.8dBm LTE-TDD B41 (10MHz)

-95.0dBm

-95.7dBm

-99.0dBm

-94.3dBm Table 53: EC25-AU Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO)

-102.0dBm

-102.0dBm

-102.0dBm

-102.0dBm

-104.7dBm GSM850

-109.0dBm EGSM900

-109.0dBm DCS1800

-109.0dBm PCS1900

-109.0dBm WCDMA B2

-110.0dBm

WCDMA B1

-110.0dBm

-109dBm

-112dBm

-106.7dBm WCDMA B5

-111.0dBm

-112dBm

-113dBm

-104.7dBm WCDMA B8

-111.0dBm

-111dBm

-113dBm

-103.7dBm LTE-FDD B1 (10MHz)

-97.2dBm

-97.5dBm

-100.2dBm

-96.3dBm LTE-FDD B2 (10MHz)

-98.2dBm

-94.3dBm LTE-FDD B3 (10MHz)

-98.7dBm

-98.6dBm

-102.2dBm

-93.3dBm LTE-FDD B4 (10MHz)

-97.7dBm

-97.4dBm

-100.2dBm

-96.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.2dBm

-101.0dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.7dBm

-97.7dBm

-101.2dBm

-94.3dBm EC25_Hardware_Design 107 / 130 LTE Standard Module Series EC25 Hardware Design LTE-FDD B8 (10MHz)

-99.2dBm

-98.2dBm

-102.2dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.6dBm

-98.7dBm

-102.0dBm

-94.8dBm LTE-TDD B40 (10MHz)

-97.2dBm

-98.4dBm

-101.2dBm

-96.3dBm Table 54: EC25-AUT Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B1

-110.0dBm WCDMA B5

-110.5dBm

-106.7dBm

-104.7dBm LTE-FDD B1 (10MHz)

-98.5dBm

-98.0dBm

-101.0dBm

-96.3dBm LTE-FDD B3 (10MHz)

-98.0dBm

-97.0dBm

-100.0dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-99.0dBm

-102.5dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-97.0dBm

-98.5dBm

-94.3dBm LTE-FDD B28 (10MHz)

-97.0dBm

-99.0dBm

-102.0dBm

-94.8dBm Table 55: EC25-AUTL Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B3 (10MHz)

-98.0dBm

-97.0dBm

-100.0dBm

-93.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-97.0dBm

-98.5dBm

-94.3dBm LTE-FDD B28 (10MHz)

-97.0dBm

-99.0dBm

-102.0dBm

-94.8dBm Table 56: EC25-AF Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-109.5dBm

-110dBm

-110.4dBm

-104.7dBm WCDMA B4

-109.6dBm

-110dBm

-110.6dBm

-106.7dBm WCDMA B5

-110dBm

-110dBm

-110.7dBm

-104.7dBm EC25_Hardware_Design 108 / 130 LTE Standard Module Series EC25 Hardware Design LTE-FDD B2 (10MHz)

-98.0dBm

-98.5dBm

-100.5dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.5dBm

-98.2dBm

-99.5dBm

-96.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.5dBm

-100.5dBm

-94.3dBm LTE-FDD B12 (10MHz)

-99.0dBm

-99.5dBm

-100.5dBm

-93.3dBm LTE-FDD B13 (10MHz)

-98.5dBm

-99.5dBm

-100.7dBm

-93.3dBm LTE-FDD B14 (10MHz)

-99.4dBm

-99.5dBm

-100.9dBm

-93.3dBm LTE-FDD B66 (10MHz)

-97.5dBm

-98.5dBm

-99.6dBm

-95.8dBm LTE-FDD B71 (10MHz)

-98.6dBm

-99.5dBm

-100dBm

-93.5dBm Table 57: EC25-AFX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-109.5dBm

-110dBm

-110.4dBm

-104.7dBm WCDMA B4

-109.6dBm

-110dBm

-110.6dBm

-106.7dBm WCDMA B5

-110dBm

-110dBm

-110.7dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98.0dBm

-98.5dBm

-100.5dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.5dBm

-98.2dBm

-99.5dBm

-96.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.5dBm

-100.5dBm

-94.3dBm LTE-FDD B12 (10MHz)

-99.0dBm

-99.5dBm

-100.5dBm

-93.3dBm LTE-FDD B13 (10MHz)

-98.5dBm

-99.5dBm

-100.7dBm

-93.3dBm LTE-FDD B14 (10MHz)

-99.4dBm

-99.5dBm

-100.9dBm

-93.3dBm LTE-FDD B66 (10MHz)

-97.5dBm

-98.5dBm

-99.6dBm

-95.8dBm LTE-FDD B71 (10MHz)

-98.6dBm

-99.5dBm

-100dBm

-93.5dBm EC25_Hardware_Design 109 / 130 LTE Standard Module Series EC25 Hardware Design Table 58: EC25-EU Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-108.5dBm DCS1800

-108.5dBm WCDMA B1

-109.5dBm

-109.5dBm WCDMA B8

-110.0dBm

-111.5 dBm

-102.0dBm

-102.0dbm

-106.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.5dBm

-99.0dBm

-101.7dBm

-96.3dBm LTE-FDD B3 (10MHz)

-98.2dBm

-99.8dBm

-102dBm

-93.3dBm LTE-FDD B7 (10MHz)

-96.7dBm

-98.5dBm

-100.7dBm

-94.3dBm LTE-FDD B8 (10MHz)

-98.5dBm

-100.4dBm

-102.4dBm

-93.3dBm LTE-FDD B20 (10MHz)

-98.7dBm

-100.2dBm

-102.7dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.7dBm

-100.5dBm

-102.5dBm

-94.8dBm LTE-TDD B38 (10MHz)

-95.2dBm

-97.0dBm

-100.2dBm

-96.3dBm LTE-TDD B40 (10MHz)

-95.7dBm

-98.2dBm

-101.2dBm

-96.3dBm LTE-TDD B41 (10MHz)

-95.0dBm

-97.1dBm

-100.2dBm

-94.3dBm Table 59: EC25-EC Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-108.8dBm DCS1800

-109.0dBm WCDMA B1

-110.5dBm WCDMA B8

-110.5dBm

-102.0dBm

-102.0dbm

-106.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-98.0dBm

-101.0dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-98.5dBm

-100.0dBm

-93.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-95.5dBm

-99.5dBm

-94.3dBm

EC25_Hardware_Design 110 / 130 LTE Standard Module Series EC25 Hardware Design LTE-FDD B8 (10MHz)

-97.0dBm

-97.0dBm

-101.0dBm

-93.3dBm LTE-FDD B20 (10MHz)

-97.5dBm

-99.0dBm

-101.0dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.6dBm

-98.7dBm

-101.5dBm

-94.8dBm Table 60: EC25-EUX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-109.0dBm DCS1800

-109.0dBm WCDMA B1

-110.5dBm WCDMA B8

-110.5dBm

-102.0dBm

-102.0dbm

-106.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-98.0dBm

-101dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-98.5dBm

-99.5dBm

-93.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-94.5dBm

-99.5dBm

-94.3dBm LTE-FDD B8 (10MHz)

-97.0dBm

-97.0dBm

-100.0dBm

-93.3dBm LTE-FDD B20 (10MHz)

-97.5dBm

-99.0dBm

-101.5dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.6dBm

-98.7dBm

-101.0dBm

-94.8dBm LTE-TDD B38 (10MHz)

-96.3dBm

-97dBm

-98.5dBm

-96.3dBm LTE-TDD B40 (10MHz)

-96.9dBm

-98.0dBm

-99.1dBm

-96.3dBm LTE-TDD B41 (10MHz)

-95.3dBm

-97.5dBm

-98.0dBm

-94.3dBm Table 61: EC25-MX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-109dBm

-110.5dBm WCDMA B4

-109.5dBm

-110dBm WCDMA B5

-110dBm

-111dBm

-104.7dBm

-106.7dBm

-104.7dBm

EC25_Hardware_Design 111 / 130 LTE Standard Module Series EC25 Hardware Design LTE-FDD B2 (10MHz)

-98dBm

-99.1dBm

-101.5dBm

-94.3dBm LTE-FDD B4 (10MHz)

-98.5dBm

-98.2dBm

-101.5dBm

-96.3dBm LTE-FDD B5 (10MHz)

-99dBm

-99.2dBm

-102.5dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97dBm

-98.5dBm

-101.5dBm

-94.3dBm LTE-FDD B28(10MHz)

-98dBm

-99.3dBm

-102dBm

-94.8dBm LTE-FDD B66 (10MHz)

-98dBm

-98.4dBm

-101.5dBm

-95.8dBm Table 62: EC25-AUX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO1) 3GPP (SIMO)

-102.0dBm

-102.0dBm

-102.0dBm

-102.0dBm

-104.7dBm GSM850

-109.0dBm EGSM900

-109.0dBm DCS1800

-109.0dBm PCS1900

-109.0dBm WCDMA B2

-110.5dBm

WCDMA B1

-110.0dBm

-109.5dBm

-112dBm

-106.7dBm WCDMA B4

-110.0dBm

-110dBm

-112dBm

-104.7dBm WCDMA B5

-111.0dBm

-112dBm

-113dBm

-104.7dBm WCDMA B8

-111.0dBm

-112dBm

-113dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-97.7dBm

-101.2dBm

-96.3dBm LTE-FDD B2 (10MHz)

-98.5dBm

-94.3dBm LTE-FDD B3 (10MHz)

-99.0dBm

-98.8dBm

-102.2dBm

-93.3dBm LTE-FDD B4 (10MHz)

-97.7dBm

-97.6dBm

-100.2dBm

-96.3dBm LTE-FDD B5 (10MHz)

-98.5dBm

-98.2dBm

-101.0dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.7dBm

-97.7dBm

-101.2dBm

-94.3dBm LTE-FDD B8 (10MHz)

-99.0dBm

-98.5dBm

-102.2dBm

-93.3dBm EC25_Hardware_Design 112 / 130 LTE Standard Module Series EC25 Hardware Design LTE-FDD B28 (10MHz)

-98.0dBm

-98.7dBm

-101.5dBm

-94.8dBm LTE-TDD B40 (10MHz)

-97.5dBm

-98.2dBm

-101.2dBm

-96.3dBm NOTE 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.7. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the modules electrostatics discharge characteristics. Table 63: Electrostatics Discharge Characteristics (25C, 45% Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND All Antenna Interfaces Other Interfaces 5 4 0.5 10 8 1 kV kV kV 6.8. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:

On customers PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc. Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary. EC25_Hardware_Design 113 / 130 LTE Standard Module Series EC25 Hardware Design Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Make sure the ground pads of the module and PCB are fully connected. According to customers application demands, the heatsink can be mounted on the top of the module, or the opposite side of the PCB area where the module is mounted, or both of them. The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB. The following shows two kinds of heatsink designs for reference and customers can choose one or both of them according to their application structure. Figure 42: Referenced Heatsink Design (Heatsink at the Top of the Module) Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers PCB) EC25_Hardware_Design 114 / 130 LTE Standard Module Series EC25 Hardware Design NOTES 1. The module offers the best performance when the internal BB chip stays below 105C. When the maximum temperature of the BB chip reaches or exceeds 105C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. 2. For more detailed guidelines on thermal design, please refer to document [7]. EC25_Hardware_Design 115 / 130 LTE Standard Module Series EC25 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the dimensional tolerances are 0.05mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module 32.00.15 2.40.2 5 1

. 0 0

. 9 2 Figure 44: Module Top and Side Dimensions 0.8 EC25_Hardware_Design 116 / 130 LTE Standard Module Series EC25 Hardware Design 1.90 1.30 3.85 32.0/-0.15 5.96 2.0 4

. 3 1.1 1.8 2.15 1.15 1.05 3.0 0.87 4.82 1.6 6.8 1.7 Pin 1 1.30 5

. 3 1.1 2.0 2.0 3.0 1.8 5 1

. 0

0

. 9 2 2.8 8

. 4 4.37 3.2 3.4 3.2 3.4 3.2 2.49 1.9 2.4 3.45 0.8 5 3

. 1.5 Figure 45: Module Bottom Dimensions (Bottom View) EC25_Hardware_Design 117 / 130 LTE Standard Module Series EC25 Hardware Design 7.2. Recommended Footprint Figure 46: Recommended Footprint (Top View) 1. The keepout area should not be designed. 2. For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB. NOTES EC25_Hardware_Design 118 / 130 LTE Standard Module Series EC25 Hardware Design 7.3. Design Effect Drawings of the Module Figure 47: Top View of the Module Figure 48: Bottom View of the Module NOTE These are renderings of EC25 module. For authentic appearance, please refer to the module that you receive from Quectel. EC25_Hardware_Design 119 / 130 LTE Standard Module Series EC25 Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EC25 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40C/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:

Mounted within 168 hours at the factory environment of 30C/60%RH. Stored at <10%RH. 3. Devices require baking before mounting, if any circumstances below occurs:

When the ambient temperature is 23C5C and the humidity indicator card shows the humidity Device mounting cannot be finished within 168 hours at factory conditions of 30C/60%RH. is >10% before opening the vacuum-sealed bag. If baking is required, devices may be baked for 8 hours at 120C5C. As the plastic package cannot be subjected to high temperature, it should be removed from devices temperature (120C) baking. before high to IPC/JEDECJ-STD-033 for baking procedure. is desired, please refer If shorter baking time 4. NOTE EC25_Hardware_Design 120 / 130 LTE Standard Module Series EC25 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18mm~0.20mm. For more details, please refer to document [4]. It is suggested that the peak reflow temperature is 238C~245C, and the absolute maximum reflow temperature is 245C. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Temp. (C) 245 238 220 200 150 100 Soak Zone A Max slope: 1~3C/sec Reflow Zone Max slope:

2~3C/sec C Cooling down slope: 1~4C/sec B D Figure 49: Reflow Soldering Thermal Profile Table 64: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Reflow Zone Soak time (between A and B: 150C and 200C) 60~120sec Recommendation 1~3C/sec EC25_Hardware_Design 121 / 130 LTE Standard Module Series EC25 Hardware Design 2~3C/sec 40~60sec 238~245C 1~4C/sec 1 Max slope Reflow time (D: over 220C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle 8.3. Packaging

. 1 0 5 7

. 1

. 5 1 0 0 2 0 2

. 3 0 0 0

. 4 4 EC25 is packaged in tap and reel carriers. Each reel is 11.88m long and contains 250pcs modules. The figure below shows the package details, measured in mm. 44.00 0.1 2.00 0.1 4.00 0.1 0.1 1.5 0 0.35 0.05 32.5 0.15 33.5 0.15 32.5 0.15 33.5 0.15

. 5 1 0 3 9 2

. 5 1 0 3 0 3

. 5 1 0 3 0 3

. 4.2 0.15 3.1 0.15 EC25_Hardware_Design 122 / 130 LTE Standard Module Series EC25 Hardware Design Cover tape Direction of feed Figure 50: Tape and Reel Specifications 48.5 0 0 1 13 44.5+0.20

-0.00 1083 Carrier tape packing module Carrier tape unfolding Figure 51: Tape and Reel Directions EC25_Hardware_Design 123 / 130 LTE Standard Module Series EC25 Hardware Design 9 Appendix A References Table 65: Related Documents SN Document Name Remark Quectel_EC2x&EGxx_Power_Management_ Application_Note Quectel_EC2x&EG9x&EM05_AT_Commands_ Manual Quectel_EC2x&EGxx&EM05_GNSS_AT_Commands _Manual Power management application note for EC25, EC21, EC20 R2.0, EC20 R2.1, EG95, EG91 and EG25-G modules AT commands manual for EC25, EC21, EC20 R2.0, EC20 R2.1, EG91, EG95 and EM05 modules for GNSS AT Commands Manual EC25, EC21, EC20 R2.0, EC20 R2.1, EG95, EG91, EG25-G and EM05 modules

[4]

Quectel_Module_Secondary_SMT_User_Guide Module secondary SMT user guide

[5]

Quectel_EC25_Reference_Design EC25 reference design

[6]

Quectel_RF_Layout_Application_Note RF layout application note

[7]

Quectel_LTE_Module_Thermal_Design_Guide

[8]

Quectel_UMTS&LTE_EVB_User_Guide Thermal design guide for LTE standard, LTE-A and Automotive modules UMTS&LTE EVB user guide UMTS&LTE modules for

[1]

[2]

[3]

Table 66: Terms and Abbreviations Abbreviation Description AMR bps CHAP CS Adaptive Multi-rate Bits Per Second Coding Scheme Challenge Handshake Authentication Protocol EC25_Hardware_Design 124 / 130 LTE Standard Module Series EC25 Hardware Design DC-HSPA+

Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over-The-Air CSD CTS DL DTR DTX EFR ESD FDD FR GMSK GNSS GPS GSM HR HSPA HSDPA HSUPA I/O Inorm LED LNA LTE Circuit Switched Data Clear To Send Downlink Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Downlink Packet Access High Speed Uplink Packet Access Input/Output Normal Current Light Emitting Diode Low Noise Amplifier Long Term Evolution GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System EC25_Hardware_Design 125 / 130 LTE Standard Module Series EC25 Hardware Design MIMO MO MS MT PAP PCB PDU PPP QAM QPSK RF RHCP Rx SGMII SIM SIMO SMS TDD TX UL UMTS URC

(U)SIM Multiple Input Multiple Output Mobile Originated Mobile Station (GSM engine) Mobile Terminated Password Authentication Protocol Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Right Hand Circularly Polarized Receive Subscriber Identification Module Single Input Multiple Output Short Message Service Time Division Duplexing Serial Gigabit Media Independent Interface Transmitting Direction Uplink Universal Mobile Telecommunications System Unsolicited Result Code

(Universal) Subscriber Identity Module TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access EC25_Hardware_Design 126 / 130 LTE Standard Module Series EC25 Hardware Design Vmax Vnorm Vmin VIHmax VIHmin VILmax VILmin VImax VImin VOHmax VOHmin VOLmax VOLmin VSWR WCDMA WLAN Maximum Voltage Value Normal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Absolute Minimum Input Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Voltage Standing Wave Ratio Wideband Code Division Multiple Access Wireless Local Area Network EC25_Hardware_Design 127 / 130 LTE Standard Module Series EC25 Hardware Design 10 Appendix B GPRS Coding Schemes Table 67: Description of Different Coding Schemes Radio Block excl.USF and BCS 181 268 CS-1 CS-2 CS-3 CS-4 2/3 3/4 1/2 3 3 40 4 456 0 3 6 16 4 588 132 3 6 312 16 4 676 220 15.6 9.05 13.4 1 3 12 428 16 456

21.4 Scheme Code Rate USF Pre-coded USF BCS Tail Coded Bits Punctured Bits Data Rate Kb/s EC25_Hardware_Design 128 / 130 LTE Standard Module Series EC25 Hardware Design 11 Appendix C GPRS Multi-slot Classes Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 68: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1 2 2 3 2 3 3 4 3 4 4 4 3 4 2 3 3 4 4 4 4 5 5 5 5 5 NA NA 1 1 2 1 2 2 3 1 2 2 3 4 3 4 EC25_Hardware_Design 129 / 130 LTE Standard Module Series EC25 Hardware Design 5 6 7 8 2 3 4 4 6 2 3 4 4 6 8 1 2 3 4 NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA 6 6 6 6 5 6 7 8 6 6 6 6 6 8 8 8 8 8 8 5 5 5 5 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 EC25_Hardware_Design 130 / 130 LTE Standard Module Sires EC25 Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 69: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot GMSK GMSK GMSK GMSK GMSK GMSK GMSK GMSK 8-PSK 8-PSK 8-PSK 8-PSK 8-PSK

C B A C B A B A A 9.05kbps 18.1kbps 36.2kbps 13.4kbps 26.8kbps 53.6kbps 15.6kbps 31.2kbps 62.4kbps 21.4kbps 42.8kbps 85.6kbps 8.80kbps 17.60kbps 35.20kbps 11.2kbps 22.4kbps 44.8kbps 14.8kbps 29.6kbps 59.2kbps 17.6kbps 35.2kbps 70.4kbps 22.4kbps 44.8kbps 89.6kbps 29.6kbps 59.2kbps 118.4kbps 44.8kbps 89.6kbps 179.2kbps 54.4kbps 108.8kbps 217.6kbps 59.2kbps 118.4kbps 236.8kbps CS-1:

CS-2:

CS-3:

CS-4:

MCS-1 MCS-2 MCS-3 MCS-4 MCS-5 MCS-6 MCS-7 MCS-8 MCS-9 EC25_Hardware_Design 131 / 131 According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a 1.1. FCC Certification Requirements. mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202006EC25AUX. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

GSM850 :8.571dBi GSM1900 :10.03dBi WCDMA Band2:8.000dBi WCDMA Band5:9.541 dBi LTE Band2:8.000dBi LTE Band4:5.000dBi LTE Band5:9.541dBi LTE Band7:8.000dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 configurations. If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR202006EC25AUX or Contains FCC ID: XMR202006EC25AUX must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment.

 

 

EC25 Mini PCIe Hardware Design LTE Standard Module Series Rev. EC25_Mini_PCIe_Hardware_Design_V2.2 Date: 2019-08-19 Status: Released www.quectel.com LTE Standard Module Series EC25 Mini PCIe Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. EC25_Mini_PCIe_Hardware_Design 1 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design About the Document History Revision Date Author Description 1.0 2016-06-07 Mountain ZHOU/

Frank WANG Initial 1.1 2017-01-24 Table 2. Lyndon LIU/

Frank WANG 1. Deleted description of EC25-AUT Mini PCIe 2. Added description of EC25-AU and EC25-J in Table 1. Mini PCIe in Table 1. 3. Updated key features of EC25 Mini PCIe in 4. Added current consumption in Chapter 4.7. 5. Updated conducted RF receiving sensitivity of EC25-A Mini PCIe in Table 17. 6. Added conducted RF receiving sensitivity of EC25-J Mini PCIe in Table 18. 1. Added new variants EC25-AF Mini PCIe, EC25-EU Mini PCIe, EC25-EC Mini PCIe, EC25-EUX Mini PCIe, EC25-MX Mini PCIe and their related information. 2. Updated LTEUMTS and GSM features, and 5. Updated the mechanical dimension of EC25 interface in Figure 6. Mini PCIe in Figure 18. 6. Added USIM_PRESENCE

(U)SIM interface and updated the reference circuit in Chapter 3.4. in 2.0 2019-04-30 Nathan LIU/

Frank WANG/

Ward WANG/

Ethan SHAN added storage temperature range in Table 2. 3. Added pin definition and description of pin 3, 5, 44 in Figure 2 and Table 4. 4. Modified the reference circuit of USB EC25_Mini_PCIe_Hardware_Design 2 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 7. Added COEX UART

(under development) as UART interface in Chapter 3.6. interface 8. Modified description of W_DISABLE# signal 9. Modified description of LED_WWAN# signal 10. Updated description of antenna connection in Chapter 3.8.3. in Chapter 3.8.5. in Chapter 5. 11. Added thermal consideration in Chapter 6.7. 12. Added operating frequencies in Table 16. 13. Added GNSS frequency in Table 17. 14. Updated antenna requirements in Table 18. 15. Updated EC25 Mini PCIe conducted RF output power in Table 21. 16. Updated conducted RF receiving sensitivity of EC25-A Mini PCIe in Table 22. 17. Added conducted RF receiving sensitivity of EC25-AU Mini PCIe in Table 23. 18. Updated conducted RF receiving sensitivity of EC25-J Mini PCIe in Table 24. 19. Updated conducted RF receiving sensitivity of EC25-E Mini PCIe in Table 25. 20. Updated conducted RF receiving sensitivity of EC25-V Mini PCIe in Table 26. 21. Added conducted RF receiving sensitivity of EC25-AF Mini PCIe in Table 27. 22. Added conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 28. 23. Added conducted RF receiving sensitivity of EC25-EC Mini PCIe in Table 29. 24. Added conducted RF receiving sensitivity of EC25-EUX Mini PCIe in Table 30. 25. Added current consumption of EC25-AU Mini 26. Added current consumption of EC25-J Mini PCIe in Table 33. PCIe in Table 34. PCIe in Table 37. PCIe in Table 38. 27. Added current consumption of EC25-AF Mini 28. Added current consumption of EC25-EC Mini 29. Added current consumption of EC25-EUX Mini PCIe in Table 39. EC25_Mini_PCIe_Hardware_Design 3 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 2.1 2019-07-05 of EC25-EU Mini PCIe in Table 29. Fanny CHEN/

Ethan SHAN 1. Added EC25-AFX/-AUX Mini PCIe and 2. Updated supported protocols and USB serial related information. drivers in Table 2. 3. Added EC25-AFX Mini PCIe conducted RF receiving sensitivity in Table 28. 4. Updated conducted RF receiving sensitivity 5. Updated EC25-AF Mini PCIe current consumption in Table 39. 6. Added EC25-AFX Mini PCIe current consumption in Table 42. 7. Added EC25-MX Mini PCIe conducted RF receiving sensitivity in Table 32. 8. Added EC25-MX Mini PCIe current consumption in Table 43. 1. Deleted the information of GNSS supported on EC25-EC Mini PCIe in Table 1. 2. Updated conducted RF receiving sensitivity of EC25-AU Mini PCIe in Table 24. 3. Updated conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 30. 4. Added conducted RF receiving sensitivity of EC25-AUX Mini PCIe in Table 34. 6. Added current consumption of EC25-AUX 7. Added current consumption of EC25-EU Mini PCIe in Table 38. Mini PCIe in Table 45. PCIe in Table 46. 8. Deleted current consumption of EC21-EC Mini PCIe, and the data will be updated in the future version. 2.2 2019-08-19 5. Updated current consumption of EC25-J Mini Ward WANG/

Owen WEI EC25_Mini_PCIe_Hardware_Design 4 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 5 Table Index ............................................................................................................................................... 7 Figure Index .............................................................................................................................................. 9 1 Introduction ..................................................................................................................................... 10 1.1. Safety Information ..................................................................................................................11 2 Product Concept ............................................................................................................................. 13 2.1. General Description .............................................................................................................. 13 Description of Product Series ................................................................................................ 14 2.2. Key Features ......................................................................................................................... 16 2.3. 2.4. Functional Diagram ............................................................................................................... 18 3.1. 3.2. 3.3. 3.4. 3.5. 3.6. 3.7. 3.8. 3 Application Interfaces ..................................................................................................................... 19 Pin Assignment ..................................................................................................................... 19 Pin Description ...................................................................................................................... 20 Power Supply ........................................................................................................................ 23

(U)SIM Interface .................................................................................................................... 24 USB Interface ........................................................................................................................ 26 UART Interfaces .................................................................................................................... 28 PCM and I2C Interfaces ........................................................................................................ 29 Control and Indicator Signals ................................................................................................ 31 3.8.1. RI Signal ...................................................................................................................... 32 3.8.2. DTR Signal .................................................................................................................. 32 3.8.3. W_DISABLE# Signal ................................................................................................... 32 3.8.4. PERST# Signal ............................................................................................................ 33 3.8.5. LED_WWAN# Signal ................................................................................................... 33 3.8.6. WAKE# Signal ............................................................................................................. 34 4 GNSS Receiver ................................................................................................................................ 35 5 Antenna Connection ....................................................................................................................... 36 5.1. Operating Frequency .......................................................................................................... 36 5.2. GNSS Frequency ................................................................................................................. 37 5.3. GNSS Performance .............................................................................................................. 38 5.4. Antenna Requirements ....................................................................................................... 39 5.4.1. Antenna Requirements ................................................................................................ 39 5.4.2. Antenna Connectors and Mating Plugs ....................................................................... 40 6 Electrical, Reliability and Radio Characteristics .......................................................................... 42 6.1. General Description .............................................................................................................. 42 6.2. Power Supply Requirements ................................................................................................. 42 EC25_Mini_PCIe_Hardware_Design 5 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 6.3. 6.4. 6.5. 6.6. 6.7. I/O Requirements .................................................................................................................. 43 RF Characteristics ................................................................................................................ 43 ESD Characteristics .............................................................................................................. 51 Current Consumption ............................................................................................................ 51 Thermal Consideration .......................................................................................................... 70 7 Dimensions and Packaging ............................................................................................................ 72 7.1. General Description .............................................................................................................. 72 7.2. Mechanical Dimensions of EC25 Mini PCIe .......................................................................... 72 Standard Dimensions of Mini PCI Express ............................................................................ 73 7.3. 7.4. Packaging Specifications ...................................................................................................... 74 8 Appendix A References .................................................................................................................. 75 EC25_Mini_PCIe_Hardware_Design 6 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Table Index TABLE 1: DESCRIPTION OF EC25 MINI PCIE ................................................................................................ 14 TABLE 2: KEY FEATURES OF EC25 MINI PCIE ............................................................................................. 16 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 20 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 20 TABLE 5: DEFINITION OF VCC_3V3 AND GND PINS .................................................................................... 23 TABLE 6: PIN DEFINITION OF (U)SIM INTERFACE ....................................................................................... 24 TABLE 7: PIN DEFINITION OF USB INTERFACE ........................................................................................... 26 TABLE 8: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................... 28 TABLE 9: PIN DEFINITION OF COEX UART INTERFACE .............................................................................. 28 TABLE 10: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 29 TABLE 11: PIN DEFINITION OF CONTROL AND INDICATOR SIGNALS ....................................................... 31 TABLE 12: AIRPLANE MODE CONTROLLED BY HARDWARE METHOD ..................................................... 32 TABLE 13: AIRPLANE MODE CONTROLLED BY SOFTWARE METHOD ..................................................... 33 TABLE 14: INDICATIONS OF NETWORK STATUS (AT+QCFG="LEDMODE",0, DEFAULT SETTING) ......... 34 TABLE 15: INDICATIONS OF NETWORK STATUS (AT+QCFG="LEDMODE",2) ........................................... 34 TABLE 16: OPERATING FREQUENCIES ........................................................................................................ 36 TABLE 17: GNSS FREQUENCY ....................................................................................................................... 38 TABLE 18: GNSS PERFORMANCE ................................................................................................................. 38 TABLE 19: ANTENNA REQUIREMENTS .......................................................................................................... 39 TABLE 20: POWER SUPPLY REQUIREMENTS .............................................................................................. 42 TABLE 21: I/O REQUIREMENTS ...................................................................................................................... 43 TABLE 22: CONDUCTED RF OUTPUT POWER OF EC25 MINI PCIE ........................................................... 43 TABLE 23: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-A MINI PCIE .......................................... 44 TABLE 24: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-AU MINI PCIE ....................................... 44 TABLE 25: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-J MINI PCIE .......................................... 45 TABLE 26: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-E MINI PCIE .......................................... 45 TABLE 27: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-V MINI PCIE .......................................... 46 TABLE 28: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-AF MINI PCIE ........................................ 46 TABLE 29: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-AFX MINI PCIE ..................................... 47 TABLE 30: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-EU MINI PCIE ....................................... 47 TABLE 31: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-EC MINI PCIE ....................................... 48 TABLE 32: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-EUX MINI PCIE ..................................... 49 TABLE 33: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-MX MINI PCIE ....................................... 49 TABLE 34: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-AUX MINI PCIE ..................................... 50 TABLE 35: ESD CHARACTERISTICS OF EC25 MINI PCIE ............................................................................ 51 TABLE 36: CURRENT CONSUMPTION OF EC25-A MINI PCIE ..................................................................... 51 TABLE 37: CURRENT CONSUMPTION OF EC25-AU MINI PCIE .................................................................. 52 TABLE 38: CURRENT CONSUMPTION OF EC25-J MINI PCIE ...................................................................... 54 TABLE 39: CURRENT CONSUMPTION OF EC25-E MINI PCIE ..................................................................... 56 TABLE 40: CURRENT CONSUMPTION OF EC25-V MINI PCIE ..................................................................... 58 TABLE 41: CURRENT CONSUMPTION OF EC25-AF MINI PCIE ................................................................... 58 EC25_Mini_PCIe_Hardware_Design 7 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design TABLE 42: CURRENT CONSUMPTION OF EC25-EUX MINI PCIE ................................................................ 60 TABLE 43: CURRENT CONSUMPTION OF EC25-AFX MINI PCIE ................................................................ 62 TABLE 44: CURRENT CONSUMPTION OF EC25-MX MINI PCIE .................................................................. 63 TABLE 45: CURRENT CONSUMPTION OF EC25-AUX MINI PCIE ................................................................ 65 TABLE 46: CURRENT CONSUMPTION OF EC25-EU MINI PCIE .................................................................. 68 TABLE 47: GNSS CURRENT CONSUMPTION OF EC25 MINI PCIE SERIES MODULE ............................... 70 TABLE 48: RELATED DOCUMENTS ................................................................................................................ 75 TABLE 49: TERMS AND ABBREVIATIONS ...................................................................................................... 75 EC25_Mini_PCIe_Hardware_Design 8 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 18 FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 19 FIGURE 3: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 24 FIGURE 4: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR 25 FIGURE 5: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR ... 25 FIGURE 6: REFERENCE CIRCUIT OF USB INTERFACE .............................................................................. 27 FIGURE 7: TIMING IN PRIMARY MODE .......................................................................................................... 30 FIGURE 8: TIMING IN AUXILIARY MODE ....................................................................................................... 30 FIGURE 9: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ...................................... 31 FIGURE 10: RI BEHAVIORS ............................................................................................................................. 32 FIGURE 11: TIMING OF RESETTING MODULE .............................................................................................. 33 FIGURE 12: LED_WWAN# SIGNAL REFERENCE CIRCUIT DIAGRAM ........................................................ 33 FIGURE 13: WAKE# BEHAVIOR ...................................................................................................................... 34 FIGURE 14: DIMENSIONS OF THE ANTENNA CONNECTORS (UNIT: MM) ................................................. 40 FIGURE 15: MECHANICALS OF U.FL-LP MATING PLUGS ........................................................................... 40 FIGURE 16: SPACE FACTOR OF MATING PLUGS (UNIT: MM) ..................................................................... 41 FIGURE 17: REFERENCED HEATSINK DESIGN ........................................................................................... 71 FIGURE 18: MECHANICAL DIMENSIONS OF EC25 MINI PCIE .................................................................... 72 FIGURE 19: STANDARD DIMENSIONS OF MINI PCI EXPRESS ................................................................... 73 FIGURE 20: DIMENSIONS OF THE MINI PCI EXPRESS CONNECTOR (MOLEX 679100002) .................... 74 EC25_Mini_PCIe_Hardware_Design 9 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 1 Introduction This document defines EC25 Mini PCIe module, and describes its air interfaces and hardware interfaces which are connected with customers applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details as well as other related information of EC25 Mini PCIe module. To facilitate its application in different fields, relevant reference design is also provided for customers reference. Associated with application note and user guide, customers can use the module to design and set up mobile applications easily. 1. CAUTION : RISK OF EXPL OSION IF BATTERY IS REPL ACED BY AN INCORRECT TYPE. DISPOSE OF USED BATTERIES ACCORDING To THE INSTRUCTIONS. 2. Operating temperature: -40 C to 85 C 3. EC25-AUX, EC25-AUX MINIPCIEsupport frequency bands : GSM900/1800 , WCDMA I/V/VIII, LTE Band 1/3/5/7/8/20/28/40 ;

4. EC25-AUX, EC25-AUX MINIPCIE max output power :

GSM900/1800 , WCDMA I/V/VIII, LTE Band 1/3/5/7/8/20/28/40 : 23dBm ;

The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter and must be installed to provide a separation distance of at least 20cm from all persons. Declaration of Conformity Hereby, Quectel Wireless Solutions Co., Ltd declares that the radio equiqment type EC25-AUX, EC25-AUX MINIPCIEis incompliance with Directives: 2014/53/EU.The full text of the EU declaration ofconformity is available at the following internet address: http://www.quectel.com/support/downloadb/TechnicalDocuments.htm EC25_Mini_PCIe_Hardware_Design 10 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 Mini PCIe module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. EC25_Mini_PCIe_Hardware_Design 11 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. EC25_Mini_PCIe_Hardware_Design 12 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 2 Product Concept 2.1. General Description EC25 Mini PCIe module provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks with PCI Express Mini Card 1.2 standard interface. It supports embedded operating systems such as Linux, Android, etc., and also provides audio, high-speed data transmission and GNSS functionalities for customers applications. EC25 Mini PCIe module can be applied in the following fields:

PDA and Laptop Computer Remote Monitor System Vehicle System Wireless POS System Wireless Router and Switch Other Wireless Terminal Devices This chapter generally introduces the following aspects of EC25 Mini PCIe module:

Product Series Key Features Functional Diagram Intelligent Meter Reading System NOTE EC25 Mini PCIe contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. EC25_Mini_PCIe_Hardware_Design 13 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 2.2. Description of Product Series EC25 Mini PCIe series contains 12 variants, and are listed in the following table. Table 1: Description of EC25 Mini PCIe Product Series Description EC25-A Mini PCIe EC25-AU Mini PCIe3) EC25-J Mini PCIe EC25-E Mini PCIe EC25-V Mini PCIe EC25-AF Mini PCIe Support LTE-FDD: B2/B4/B12 Support WCDMA: B2/B4/B5 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B2/B3/B4/B5/B7/B8/B28 Support LTE-TDD: B40 Support WCDMA: B1/B2/B5/B8 Support GSM: 850/900/1800/1900MHz Support LTE/WCDMA receive diversity3) Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B3/B8/B18/B19/B26 Support LTE-TDD: B41 Support WCDMA: B1/B6/B8/B19 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B3/B5/B7/B8/B20 Support LTE-TDD: B38/B40/B41 Support WCDMA: B1/B5/B8 Support GSM: 900/1800MHz Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B4/B13 Support LTE receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B2/B4/B5/B12/B13/B14/B66/B71 Support WCDMA: B2/B4/B5 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) EC25_Mini_PCIe_Hardware_Design 14 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design EC25-EU Mini PCIe EC25-EC Mini PCIe EC25-EUX Mini PCIe4) EC25-MX Mini PCIe4) EC25-AFX Mini PCIe4) EC25-AUX Mini PCIe3)4) Support LTE-FDD: B1/B3/B7/B8/B20/B28A Support LTE-TDD: B38/B40/B41 Support WCDMA: B1/B8 Support GSM: 900/1800MHz Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B3/B7/B8/B20/B28A Support WCDMA: B1/B8 Support GSM: 900/1800MHz Support LTE/WCDMA receive diversity Support digital audio2) Support LTE-FDD: B1/B3/B7/B8/B20/B28A Support LTE-TDD: B38/B40/B41 Support WCDMA: B1/B8 Support GSM: 900/1800MHz Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B2/B4/B5/B7/B28/B66 Support WCDMA: B2/B4/B5 Support LTE/WCDMA receive diversity Support digital audio2) Support LTE-FDD: B2/B4/B5/B12/B13/B14/B66/B71 Support WCDMA: B2/B4/B5 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B2/B3/B4/B5/B7/B8/B283) Support LTE-TDD: B40 Support WCDMA: B1/B2/B4/B5/B8 Support GSM: 850/900/1800/1900MHz Support LTE/WCDMA receive diversity3) Support GNSS1) Support digital audio2) NOTES 1. 2. 3. 4. 1) GNSS function is optional. 2) Digital audio (PCM) function is only supported on Telematics version. 3) B2 band on EC25-AU/-AUX Mini PCIe does not support receive diversity. 4) EC25-EUX/-MX/-AFX/-AUX Mini PCIe are based on ThreadX OS. EC25_Mini_PCIe_Hardware_Design 15 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 2.3. Key Features The following table describes the detailed features of EC25 Mini PCIe module. Table 2: Key Features of EC25 Mini PCIe Feature Details Function Interface PCI Express Mini Card 1.2 Standard Interface Power Supply Supply voltage: 3.0V~3.6V Typical supply voltage: 3.3V Transmitting Power LTE Features UMTS Features GSM Features Class 4 (33dBm2dB) for GSM850 Class 4 (33dBm2dB) for EGSM900 Class 1 (30dBm2dB) for DCS1800 Class 1 (30dBm2dB) for PCS1900 Class E2 (27dBm3dB) for GSM850 8-PSK Class E2 (27dBm3dB) for EGSM900 8-PSK Class E2 (26dBm3dB) for DCS1800 8-PSK Class E2 (26dBm3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm2dB) for LTE-FDD bands Class 3 (23dBm2dB) for LTE-TDD bands Support up to non-CA Cat 4 FDD and TDD Support 1.4/3/5/10/15/20MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max 150Mbps (DL)/Max 50Mbps (UL) LTE-TDD: Max 130Mbps (DL)/Max 30Mbps (UL) Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL) GPRS:

Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL)/Max 85.6Kbps (UL) EDGE:

Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 EC25_Mini_PCIe_Hardware_Design 16 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Max 296Kbps (DL)/Max 236.8Kbps (UL) Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/NITZ/

MMS/SMTP/SSL/MQTT/FILE/CMUX*/SMTPS* protocols Support protocols PAP (Password Authentication Protocol) and CHAP

(Challenge Handshake Authentication Protocol) which are usually used for PPP connection Internet Protocol Features SMS Text and PDU mode Point to point MO and MT SMS cell broadcast SMS storage: ME by default

(U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V UART Interfaces Main UART:

Support RTS and CTS hardware flow control Baud rate can reach up to 230400bps, 115200bps by default Used for AT command communication and data trnasmission Audio Features PCM Interface USB Interface COEX UART*:

LTE/WLAN&BT coexistence UART Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6/3.x/4.1~4.15, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc. Include main antenna, diversity antenna and GNSS antenna receptacle connectors Antenna Connectors GNSS Features AT Commands Rx-diversity Support LTE/WCDMA Rx-diversity Gen8C Lite of Qualcomm Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Physical Characteristics Size: (51.00.15)mm (30.00.15)mm (4.90.2)mm Weight: approx. 9.8g EC25_Mini_PCIe_Hardware_Design 17 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Temperature Range Operation temperature range: -35C ~ +75C1) Extended temperature range: -40C ~ +80C2) Storage temperature range: -40C ~ +90C Firmware Upgrade Upgrade via USB interface or DFOTA*

RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. COEX UART interface is not supported on ThreadX modules. 2. 3. 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call* (emergency call is not supported on ThreadX modules), etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again.

* means under development. 4. 2.4. Functional Diagram The following figure shows the block diagram of EC25 Mini PCIe. Figure 1: Functional Diagram EC25_Mini_PCIe_Hardware_Design 18 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 3 Application Interfaces The physical connections and signal levels of EC25 Mini PCIe comply with PCI Express Mini Card Electromechanical Specification. This chapter mainly describes the definition and application of the following interfaces of EC25 Mini PCIe:

Power supply USB interface UART interfaces PCM and I2C interfaces Control and indicator signals Antenna interfaces

(U)SIM interface 3.1. Pin Assignment The following figure shows the pin assignment of EC25 Mini PCIe module. The top side contains EC25 module and antenna connectors. Figure 2: Pin Assignment EC25_Mini_PCIe_Hardware_Design 19 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 3.2. Pin Description The following tables show the pin definition and description of the 52 pins on EC25 Mini PCIe . Table 3: I/O Parameters Definition Description Digital Input Digital Output Bidirectional Open Collector Power Input Power Output Table 4: Pin Description Pin No. Mini PCI Express Standard Name EC25 Mini PCIe Pin Name I/O Description Comment WAKE#

WAKE#

OC Output signal used to wake up the host. 3.3Vaux VCC_3V3 PI 3.3V DC supply COEX1 COEX_UART_RX 1) DI LTE/WLAN&BT coexistence signal GND GND Mini card ground COEX2 COEX_UART_TX 1) DO LTE/WLAN&BT coexistence signal 1.5V NC Not connected CLKREQ#

RESERVED Reserved UIM_PWR USIM_VDD PO Power source for the

(U)SIM card It is prohibited to be pulled up to high level before startup. It is prohibited to be pulled up to high level before startup. EC25_Mini_PCIe_Hardware_Design 20 / 76 Type DI DO IO OC PI PO 1 2 3 4 5 6 7 8 LTE Standard Module Series EC25 Mini PCIe Hardware Design GND GND Mini card ground UIM_DATA USIM_DATA IO Data signal of (U)SIM card REFCLK-

UART_RX DI UART receive data UIM_CLK USIM_CLK DO Clock signal of (U)SIM card REFCLK+

UART_TX DO UART transmit data UIM_RESET USIM_RST DO Reset signal of (U)SIM card GND GND Mini card ground UIM_VPP RESERVED Reserved RESERVED RI DO Output signal to wake up the host. GND GND Mini card ground RESERVED RESERVED Reserved 20 W_DISABLE#

W_DISABLE#

DI Airplane mode control 21 GND GND Mini card ground 22 PERST#

PERST#

DI Fundamental reset signal PERn0 UART_CTS DI UART clear to send 3.3Vaux RESERVED Reserved PERp0 UART_RTS DO UART request to send GND GND 1.5V GND GND GND NC GND Mini card ground Mini card ground Not connected Mini card ground 9 10 11 12 13 14 15 16 17 18 19 23 24 25 26 27 28 29 30 Connect to DTEs TX. Connect to DTEs RX. Pulled up by default. Active low. Pulled up by default. Active low. Connect to DTEs RTS. Connect to DTEs CTS. SMB_CLK I2C_SCL DO I2C serial clock Require external pull-up EC25_Mini_PCIe_Hardware_Design 21 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 31 PETn0 DTR DI Sleep mode control 32 SMB_DATA I2C_SDA IO I2C serial data PETp0 RESERVED Reserved GND GND GND GND Mini card ground Mini card ground 36 USB_D-

USB_DM IO USB differential data (-) 37 GND GND Mini card ground 38 USB_D+

USB_DP IO USB differential data (+) 3.3Vaux VCC_3V3 PI 3.3V DC supply GND GND Mini card ground 3.3Vaux VCC_3V3 PI 3.3V DC supply 42 LED_WWAN#

LED_WWAN#

OC Active low LED signal for indicating the network status of the module GND GND Mini card ground LED_WLAN#

USIM_PRESENCE DI

(U)SIM card insertion detection RESERVED PCM_CLK2) IO PCM clock signal LED_WPAN#

RESERVED Reserved RESERVED PCM_DOUT2) DO PCM data output 1.5V NC Not connected RESERVED PCM_DIN2) DI PCM data input GND GND Mini card ground EC25_Mini_PCIe_Hardware_Design 22 / 76 to 1.8V. Require external pull-up to 1.8V. Require differential impedance of 90. Require differential impedance of 90. 33 34 35 39 40 41 43 44 45 46 47 48 49 50 NOTES 51 52 LTE Standard Module Series EC25 Mini PCIe Hardware Design RESERVED PCM_SYNC2) IO PCM frame synchronization 3.3Vaux VCC_3V3 PI 3.3V DC supply 1. 1) COEX UART interface pins (pins 3 and 5) are not supported on ThreadX modules, and the function is under development. 2) The digital audio (PCM) function is only supported on Telematics version. 2. 3. Keep all NC, reserved and unused pins unconnected. 3.3. Power Supply The following table shows pin definition of VCC_3V3 pins and ground pins. Table 5: Definition of VCC_3V3 and GND Pins Pin Name Pin No. I/O Power Domain Description VCC_3V3 2, 39, 41, 52 PI 3.0V~3.6V 3.3V DC supply GND Mini card ground 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 The typical supply voltage of EC25 Mini PCIe is 3.3V. In the 2G network, the input peak current may reach 2.7A during the transmitting time. Therefore, the power supply must be able to provide enough current, and a bypass capacitor of no less than 470F with low ESR should be used to prevent the voltage from dropping. The following figure shows a reference design of power supply. The precision of resistor R2 and R3 is 1%, and the capacitor C3 needs a low ESR. EC25_Mini_PCIe_Hardware_Design 23 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 3: Reference Circuit of Power Supply 3.4. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. The following table shows the pin definition of (U)SIM interface. Table 6: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Power Domain Description USIM_VDD USIM_DATA USIM_CLK USIM_RST 8 10 12 14 PO 1.8V/3.0V Power source for (U)SIM card IO DO 1.8V/3.0V Data signal of (U)SIM card 1.8V/3.0V Clock signal of (U)SIM card DO 1.8V/3.0V Reset signal of (U)SIM card USIM_PRESENCE 44 DI 1.8V

(U)SIM card insertion detection EC25 Mini PCIe supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections, and it is disabled by default. For more details of AT+QSIMDET command, please refer to document [2]. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. EC25_Mini_PCIe_Hardware_Design 24 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design USIM_VDD 15K Module GND USIM_VDD USIM_RST USIM_CLK USIM_PRESENCE USIM_DATA 0R 0R 0R 100nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33pF 33pF 33pF GND GND GND Figure 4: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 5: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers applications, please follow the criteria below in (U)SIM circuit design:

EC25_Mini_PCIe_Hardware_Design 25 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and power supply traces. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode with parasitic capacitance not exceeding 15pF. The 0 resistors should be added in series between the module and the (U)SIM card so as to facilitate debugging. The 33pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the

(U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 3.5. USB Interface The following table shows the pin definition of USB interface. Table 7: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_DM USB_DP 36 38 IO USB differential data (-) Require differential impedance of 90 IO USB differential data (+) Require differential impedance of 90 EC25 Mini PCIe is compliant with USB 2.0 specification. It can only be used as a slave device. Meanwhile, it supports high speed (480Mbps) mode and full speed (12Mbps) mode. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB. The following figure shows a reference circuit of USB interface. EC25_Mini_PCIe_Hardware_Design 26 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Minimize these stubs Test Points Module USB_DM USB_DP GND NM_0R NM_0R R3 R4 L1 ESD Array Close to Module MCU USB_DM USB_DP GND Figure 6: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner layer with ground shielding on not only upper and lower layers but also right and left sides. Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2pF. Keep the ESD protection components to the USB connector as close as possible. NOTES details. 1. There are three preconditions when enabling EC25 Mini PCIe to enter the sleep mode:

a) Execute AT+QSCLK=1 command to enable the sleep mode. Please refer to document [2] for b) DTR pin should be kept at high level (pulled up internally). c) USB interface on Mini PCIe must be connected with the USB interface of the host and please guarantee the USB of the host is in suspend state. EC25_Mini_PCIe_Hardware_Design 27 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 2. The ESD device used for USB interface protection has been built in the Mini PCIe, thus the external ESD device can be reserved for the further use. 3.6. UART Interfaces The following table shows the pin definition of the main UART and COEX UART* interfaces. Table 8: Pin Definition of Main UART Interface Pin Name Pin No. I/O Power Domain Description UART_RX UART_TX UART_CTS UART_RTS 11 13 23 25 DI 3.3V UART receive data DO 3.3V UART transmit data DI DO 3.3V 3.3V UART clear to send UART request to send The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps and 230400bps baud rates, and the default is 115200bps. This interface can be used for AT command communication and data transmission. Table 9: Pin Definition of COEX UART Interface Pin No. Pin Name I/O Power Domain Description COEX_UART_RX DI 1.8V COEX_UART_TX DO 1.8V LTE/WLAN&BT coexistence signal. It is prohibited to be pulled up to high level before startup. LTE/WLAN&BT coexistence signal. It is prohibited to be pulled up to high level before startup. 3 5 EC25_Mini_PCIe_Hardware_Design 28 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design NOTES 1. AT+IPR command can be used to set the baud rate of the main UART, and AT+IFC command can be used to set the hardware flow control (hardware flow control is disabled by default). Please refer to document [2] for details. 2. COEX UART interface is not supported on ThreadX modules. 3. * means under development. 3.7. PCM and I2C Interfaces EC25 Mini PCIe provides one Pulse Code Modulation (PCM) digital interface and one I2C interface. The following table shows the pin definition of PCM and I2C interfaces that can be applied in audio codec design. Table 10: Pin Definition of PCM and I2C Interfaces Pin No. Pin Name I/O Power Domain Description 45 47 49 51 30 32 PCM_CLK1) PCM_DOUT1) PCM_DIN1) PCM_SYNC1) IO DO DI IO 1.8V 1.8V 1.8V 1.8V I2C_SCL DO 1.8V I2C_SDA IO 1.8V PCM clock signal PCM data output PCM data input PCM frame synchronization I2C serial clock. Require external pull-up to 1.8V. I2C serial data. Require external pull-up to 1.8V. EC25 Mini PCIe provides one PCM digital interface, which supports 16-bit linear data format and the following modes:

Primary mode (short frame synchronization, works as either master or slave) Auxiliary mode (long frame synchronization, works as master only) NOTE 1) The digital audio (PCM) function is only supported on Telematics version. EC25_Mini_PCIe_Hardware_Design 29 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK at 8KHz PCM_SYNC, and also supports 4096KHz PCM_CLK at 16KHz PCM_SYNC. The following figure shows the timing relationship in primary mode with 8KHz PCM_SYNC and 2048KHz PCM_CLK. Figure 7: Timing in Primary Mode In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK and an 8KHz, 50% duty cycle PCM_SYNC. The following figure shows the timing relationship in auxiliary mode with 8KHz PCM_SYNC and 256KHz PCM_CLK. Figure 8: Timing in Auxiliary Mode EC25_Mini_PCIe_Hardware_Design 30 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC. In addition, EC25 Mini PCIes firmware has integrated the configuration on some PCM codecs application with I2C interface. Please refer to document [2] for details about AT+QDAI command. The following figure shows a reference design of PCM interface with an external codec IC. Figure 9: Reference Circuit of PCM Application with Audio Codec 3.8. Control and Indicator Signals The following table shows the pin definition of control and indicator signals. Table 11: Pin Definition of Control and Indicator Signals Pin No. Pin Name I/O Power Domain Description RI DTR 17 31 20 W_DISABLE#

DI 3.3V 22 PERST#

DI 3.3V 42 LED_WWAN#

OC DO 3.3V Output signal used to wake up the host DI 3.3V Sleep mode control Airplane mode control;

Pulled up by default;

Active low. Fundamental reset signal;

Active low. LED signal for indicating the network status of the module;

Active low. 1 WAKE#

OC Output signal to wake up the host. EC25_Mini_PCIe_Hardware_Design 31 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 3.8.1. RI Signal The RI signal can be used to wake up the host. When a URC returns, there will be the following behaviors on the RI pin after executing AT+QCFG="risignaltype","physical" command. Figure 10: RI Behaviors The DTR signal supports sleep control function. Driving it to low level will wake up the module. 3.8.2. DTR Signal 3.8.3. W_DISABLE# Signal EC25 Mini PCIe provides a W_DISABLE# signal to disable or enable the RF function (GNSS not included). W_DISABLE# signal function is disabled by default, and AT+QCFG=airplanecontrol,1 can be used to enable this function. The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. AT+CFUN can also be used to control the RF status, and the details are as follows:

Table 12: Airplane Mode Controlled by Hardware Method W_DISABLE#

RF Function Status Module Operation Mode High level Low level RF enabled Normal mode RF disabled Airplane mode Software method can be controlled by AT+CFUN, and has the same effect with W_DISABLE# signal function, the details are as follows. EC25_Mini_PCIe_Hardware_Design 32 / 76 0 LTE Standard Module Series EC25 Mini PCIe Hardware Design Table 13: Airplane Mode Controlled by Software Method AT+CFUN=? RF Function Status Module Operation Mode Conditions RF and (U)SIM disabled Minimum functionality mode Keep W_DISABLE# at high level 3.8.4. PERST# Signal The PERST# signal can be used to force a hardware reset on the card. Customers can reset the module by driving the PERST# to a low level voltage within the time frame of 150ms~460ms and then releasing it. The reset scenario is illustrated in the following figure. Figure 11: Timing of Resetting Module 3.8.5. LED_WWAN# Signal The LED_WWAN# signal of EC25 Mini PCIe is used to indicate the network status of the module, and can absorb the current up to 40mA. According to the following circuit, in order to reduce the current of the LED, a resistor must be placed in series with the LED. The LED is emitting light when the LED_WWAN# output signal is active low. Figure 12: LED_WWAN# Signal Reference Circuit Diagram There are two indication modes for LED_WWAN# signal to indicate network status, which can be switched through following AT commands:

EC25_Mini_PCIe_Hardware_Design 33 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design AT+QCFG="ledmode",0 (Default setting) AT+QCFG="ledmode",2 The following tables show the detailed network status indications of the LED_WWAN# signal. Table 14: Indications of Network Status (AT+QCFG="ledmode",0, Default Setting) Pin Status Description Flicker slowly (200ms Low/1800ms High) Network searching Flicker slowly (1800ms Low/200ms High) Idle Flicker quickly (125ms Low/125ms High) Data transfer is ongoing Always Low Voice calling Table 15: Indications of Network Status (AT+QCFG="ledmode",2) Pin Status Description Low Level (Light on) Registered on network High impedance (Light off) 3.8.6. WAKE# Signal No network coverage or not registered W_DISABLE# signal is at low level.

(Disable RF) AT+CFUN=0, AT+CFUN=4 The WAKE# signal is an open collector signal which is similar to RI signal, but a host pull-up resistor and AT+QCFG="risignaltype","physical" command are required. When a URC returns, a 120ms low level pulse will be outputted. The state of WAKE# signal is shown as below. Figure 13: WAKE# Behavior EC25_Mini_PCIe_Hardware_Design 34 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 4 GNSS Receiver EC25 Mini PCIe includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC25 Mini PCIe supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC25 Mini PCIe GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. EC25_Mini_PCIe_Hardware_Design 35 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 5 Antenna Connection EC25 Mini PCIe is mounted with three antenna connectors for external antenna connection: a main antenna connector, an Rx-diversity antenna connector, and a GNSS antenna connector. And Rx-diversity function is enabled by default. The impedance of the antenna connectors is 50. 5.1. Operating Frequency The following table shows the operating frequencies of EC25 Mini PCIe. Table 16: Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 WCDMA B19 LTE-FDD B1 LTE-FDD B2 Transmit 824~849 880~915 1710~1785 1850~1910 1920~1980 1850~1910 1710~1755 824~849 830~840 880~915 830~845 1920~1980 1850~1910 Receive 869~894 925~960 1805~1880 1930~1990 2110~2170 1930~1990 2110~2155 869~894 875~885 925~960 875~890 2110~2170 1930~1990 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EC25_Mini_PCIe_Hardware_Design 36 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B3 LTE-FDD B4 1710~1785 1710~1755 LTE-FDD B5 824~849 LTE-FDD B7 2500~2570 2620~2690 1805~1880 2110~2155 869~894 925~960 729~746 746~756 758~768 860~875 875~890 791~821 859~894 758~803 2570~2620 2300~2400 2555~2655 2100~2200 617~652 MHz MHz MHz MHz MHz MHz MHz MHZ MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B26 LTE-FDD B28 880~915 699~716 777~787 788~798 815~830 830~845 832~862 814~849 703~748 LTE-TDD B38 2570~2620 LTE-TDD B40 2300~2400 LTE-TDD B41 2555~2655 LTE-FDD B66 1710~1780 LTE-FDD B71 663~698 5.2. GNSS Frequency The following table shows the GNSS frequency of EC25 Mini PCIe. EC25_Mini_PCIe_Hardware_Design 37 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Table 17: GNSS Frequency GLONASS 1597.5~1605.8 Frequency 1575.421.023 1575.422.046 1561.0982.046 1575.42 Type GPS Galileo BeiDou QZSS 5.3. GNSS Performance The following table shows the GNSS performance of EC25 Mini PCIe. Table 18: GNSS Performance Parameter Description Conditions Sensitivity

(GNSS) Cold start Autonomous Reacquisition Autonomous Tracking Autonomous TTFF

(GNSS) Warm start

@open sky Cold start

@open sky Hot start

@open sky CEP-50 Accuracy

(GNSS) Autonomous XTRA enabled Autonomous XTRA enabled Autonomous XTRA enabled Autonomous

@open sky Unit MHz MHz MHz MHz MHz Typ.

-146

-157

-157 35 18 26 2.2 2.5 1.8 Unit dBm dBm dBm s s s s s s

<2.5 m EC25_Mini_PCIe_Hardware_Design 38 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design NOTES 1. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. 2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock. 3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes position within 3 minutes after executing cold start command. 5.4. Antenna Requirements 5.4.1. Antenna Requirements Table 19: Antenna Requirements Type Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: <2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain: < 17dB VSWR: 2 Efficiency: > 30%

Max input power: 50W Input impedance: 50 Cable insertion loss: < 1dB

(GSM850, EGSM900, WCDMA B5/B6/B8/B19, LTE-FDD B5/B8/B12/B13/B14/B18/B19/B20/B26/B28/B71) Cable insertion loss: < 1.5dB

(DCS1800, PCS1900, WCDMA B1/B2/B4, LTE-FDD B1/B2/B3/B4/B66) Cable insertion loss: < 2dB

(LTE-FDD B7, LTE-TDD B38/B40/B41) GNSS1) GSM/UMTS/LTE EC25_Mini_PCIe_Hardware_Design 39 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design NOTES 1. It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 2. Since the GNSS port has a 2.85V voltage output, a passive antenna that causes shorting to GND, such as PIFA antenna is not recommended. 5.4.2. Antenna Connectors and Mating Plugs The dimensions of the antenna connectors are shown as below. Figure 14: Dimensions of the Antenna Connectors (Unit: mm) It is recommended to use U.FL-LP mating plugs listed in the following figure to match the antenna connectors. Figure 15: Mechanicals of U.FL-LP Mating Plugs EC25_Mini_PCIe_Hardware_Design 40 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design The following figure describes the space factor of mating plugs. Figure 16: Space Factor of Mating Plugs (Unit: mm) For more details of the recommended mating plugs, please visit http://www.hirose.com. EC25_Mini_PCIe_Hardware_Design 41 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. General Description I/O requirements This chapter mainly describes the following electrical and radio characteristics of EC25 Mini PCIe:

Power supply requirements RF characteristics GNSS receiver ESD characteristics Current consumption Thermal consideration 6.2. Power Supply Requirements The input voltage of EC25 Mini PCIe is 3.3V9%, as specified by PCI Express Mini CEM Specifications 1.2. The following table shows the power supply requirements of EC25 Mini PCIe. Table 20: Power Supply Requirements Parameter Description Min. Typ. Max. VCC_3V3 Power supply 3.0 3.3 3.6 Unit V EC25_Mini_PCIe_Hardware_Design 42 / 76 VIH VIL VOH VOL NOTES LTE Standard Module Series EC25 Mini PCIe Hardware Design 6.3. I/O Requirements The following table shows the I/O requirements of EC25 Mini PCIe. Table 21: I/O Requirements Parameter Description Min. Max. Unit Input High Voltage 0.7 VCC_3V3 VCC_3V3 + 0.3 Input Low Voltage

-0.3 0.3 VCC_3V3 Output High Voltage VCC_3V3 - 0.5 VCC_3V3 Output Low Voltage 0 0.4 V V V V 1. The PCM and I2C interfaces belong to 1.8V power domain and other I/O interfaces belong to VCC_3V3 power domain. 2. The maximum voltage value of VIL for PERST# signal and W_DISABLE# signal is 0.5V. 6.4. RF Characteristics The following tables show the conducted RF output power and receiving sensitivity of EC25 Mini PCIe module. Table 22: Conducted RF Output Power of EC25 Mini PCIe Frequency Max. Min. GSM850/EGSM900 33dBm2dB 5dBm5dB DCS1800/PCS1900 30dBm2dB 0dBm5dB GSM850/EGSM900 (8-PSK) 27dBm3dB 5dBm5dB DCS1800/PCS1900 (8-PSK) 26dBm3dB 0dBm5dB WCDMA bands 24dBm+1/-3dB

< -49dBm EC25_Mini_PCIe_Hardware_Design 43 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD bands LTE-TDD bands 23dBm2dB

< -39dBm 23dBm2dB

< -39dBm Table 23: Conducted RF Receiving Sensitivity of EC25-A Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-110.0dBm WCDMA B4

-110.0dBm WCDMA B5

-110.5dBm

-104.7dBm

-106.7dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98.0dBm

-98.0dBm

-101.0dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.5dBm

-99.0dBm

-101.0dBm

-96.3dBm LTE-FDD B12 (10MHz)

-97.2dBm

-98.0dBm

-101.0dBm

-93.3dBm Table 24: Conducted RF Receiving Sensitivity of EC25-AU Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO)

-102.0dBm

-102.0dBm

-102.0dBm

-102.0dBm

-104.7dBm GSM850

-109.0dBm EGSM900

-109.0dBm DCS1800

-109.0dBm PCS1900

-109.0dBm WCDMA B2

-110.0dBm

WCDMA B1

-110.0dBm

-109dBm

-112dBm

-106.7dBm WCDMA B5

-111.0dBm

-112dBm

-113dBm

-104.7dBm WCDMA B8

-111.0dBm

-111dBm

-113dBm

-103.7dBm LTE-FDD B1 (10MHz)

-97.2dBm

-97.5dBm

-100.2dBm

-96.3dBm LTE-FDD B2 (10MHz)

-98.2dBm

-94.3dBm LTE-FDD B3 (10MHz)

-98.7dBm

-98.6dBm

-102.2dBm

-93.3dBm

EC25_Mini_PCIe_Hardware_Design 44 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B4 (10MHz)

-97.7dBm

-97.4dBm

-100.2dBm

-96.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.2dBm

-101.0dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.7dBm

-97.7dBm

-101.2dBm

-94.3dBm LTE-FDD B8 (10MHz)

-99.2dBm

-98.2dBm

-102.2dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.6dBm

-98.7dBm

-102.0dBm

-94.8dBm LTE-TDD B40 (10MHz)

-97.2dBm

-98.4dBm

-101.2dBm

-96.3dBm Table 25: Conducted RF Receiving Sensitivity of EC25-J Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B1

-110.0dBm WCDMA B6

-110.5dBm WCDMA B8

-110.5dBm WCDMA B19

-110.5dBm

-106.7dBm

-106.7dBm

-103.7dBm

-106.7dBm LTE-FDD B1 (10MHz)

-97.5dBm

-98.7dBm

-100.2dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-97.1dBm

-100.5dBm

-93.3dBm LTE-FDD B8 (10MHz)

-98.4dBm

-99.0dBm

-101.2dBm

-93.3dBm LTE-FDD B18 (10MHz)

-99.5dBm

-99.0dBm

-101.7dBm

-96.3dBm LTE-FDD B19 (10MHz)

-99.2dBm

-99.0dBm

-101.4dBm

-96.3dBm LTE-FDD B26 (10MHz)

-99.5dBm

-99.0dBm

-101.5dBm

-93.8dBm LTE-TDD B41 (10MHz)

-95.0dBm

-95.7dBm

-99.0dBm

-94.3dBm Table 26: Conducted RF Receiving Sensitivity of EC25-E Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-109.0dBm DCS1800

-109.0dBm

-102.0dBm

-102.0dbm

EC25_Mini_PCIe_Hardware_Design 45 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA B1

-110.5dBm WCDMA B5

-110.5dBm WCDMA B8

-110.5dBm

-106.7dBm

-104.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-98.0dBm

-101.5dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-98.5dBm

-101.5dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.5dBm

-101.0dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-97.0dBm

-99.5dBm

-94.3dBm LTE-FDD B8 (10MHz)

-97.0dBm

-97.0dBm

-101.0dBm

-93.3dBm LTE-FDD B20 (10MHz)

-97.5dBm

-99.0dBm

-102.5dBm

-93.3dBm LTE-TDD B38 (10MHz)

-95.0dBm

-97.0dBm

-98.9dBm

-96.3dBm LTE-TDD B40 (10MHz)

-96.3dBm

-98.0dBm

-101.0dBm

-96.3dBm LTE-TDD B41 (10MHz)

-94.5dBm

-97.0dBm

-98.5dBm

-94.3dBm Table 27: Conducted RF Receiving Sensitivity of EC25-V Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B4 (10MHz)

-97.5dBm

-99.0dBm

-101.0dBm

-96.3dBm LTE-FDD B13 (10MHz)

-97.7dBm

-97.0dBm

-100.0dBm

-93.3dBm Table 28: Conducted RF Receiving Sensitivity of EC25-AF Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-109.5dBm

-110dBm

-110.4dBm

-104.7dBm WCDMA B4

-109.6dBm

-110dBm

-110.6dBm

-106.7dBm WCDMA B5

-110.5dBm

-110dBm

-110.7dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98.0dBm

-98.5dBm

-100.5dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.5dBm

-98.2dBm

-99.5dBm

-93.3dBm EC25_Mini_PCIe_Hardware_Design 46 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B5 (10MHz)

-98.0dBm

-98.5dBm

-100.5dBm

-94.3dBm LTE-FDD B12 (10MHz)

-99.0dBm

-99.5dBm

-100.5dBm

-93.3dBm LTE-FDD B13 (10MHz)

-98.5dBm

-99.5dBm

-100.7dBm

-93.3dBm LTE-FDD B14 (10MHz)

-99.4dBm

-99.5dBm

-100.9dBm

-93.3dBm LTE-FDD B66 (10MHz)

-97.5dBm

-98.5dBm

-99.6dBm

-95.8dBm LTE-FDD B71 (10MHz)

-98.6dBm

-99.5dBm

-100dBm

-93.5dBm Table 29: Conducted RF Receiving Sensitivity of EC25-AFX Mini PCIe Frequency Primary Diversity 3GPP (SIMO) WCDMA B2

-109.6dBm

-110 WCDMA B4

-109.6dBm

-110 WCDMA B5

-110.5dBm

-110 SIMO1)

-110.4

-110.6

-110.7

-104.7dBm

-106.7dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98.0dBm

-98.5dBm

-100.5dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.6dBm

-98.2dBm

-99.5dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.5dBm

-100.5dBm

-94.3dBm LTE-FDD B12 (10MHz)

-99.0dBm

-99.5dBm

-100.5dBm

-93.3dBm LTE-FDD B13 (10MHz)

-98.5dBm

-99.7dBm

-100.8dBm

-93.3dBm LTE-FDD B14 (10MHz)

-99.4dBm

-99.5dBm

-100.9dBm

-93.3dBm LTE-FDD B66 (10MHz)

-97.5dBm

-98.5dBm

-99.6dBm

-95.8dBm LTE-FDD B71 (10MHz)

-98.8dBm

-99.7dBm

-100.5dBm

-93.5dBm Table 30: Conducted RF Receiving Sensitivity of EC25-EU Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-108dBm DCS1800

-108.6dBm

-102.0dBm

-102.0dbm EC25_Mini_PCIe_Hardware_Design 47 / 76

LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA B1

-110dBm

-109dBm WCDMA B8

-110dBm

-111dBm

-106.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.2dBm

-99.0dBm

-101.2dBm

-96.3dBm LTE-FDD B3 (10MHz)

-97.7dBm

-99.8dBm

-101.0dBm

-93.3dBm LTE-FDD B7 (10MHz)

-96.7dBm

-98.5dBm

-100.2dBm

-94.3dBm LTE-FDD B8 (10MHz)

-98.2dBm

-100.4dBm

-101.7 dBm

-93.3dBm LTE-FDD B20 (10MHz)

-98.2dBm

-100.8dBm

-101.7dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.2dBm

-100.5dBm

-101.7dBm

-94.8dBm LTE-TDD B38 (10MHz)

-95dBm

-97.0dBm

-99.7dBm

-96.3dBm LTE-TDD B40 (10MHz)

-95.9dBm

-98.0dBm

-100.2dBm

-96.3dBm LTE-TDD B41 (10MHz)

-94.8dBm

-97.0dBm

-99.7dBm

-94.3dBm Table 31: Conducted RF Receiving Sensitivity of EC25-EC Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-108.8dBm DCS1800

-109.0dBm WCDMA B1

-110.5dBm WCDMA B8

-110.5dBm

-102.0dBm

-102.0dbm

-106.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-98.0dBm

-101.0dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-98.5dBm

-100.0dBm

-93.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-95.5dBm

-99.5dBm

-94.3dBm LTE-FDD B8 (10MHz)

-97.0dBm

-97.0dBm

-101.0dBm

-93.3dBm LTE-FDD B20 (10MHz)

-97.5dBm

-99.0dBm

-101.0dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.6dBm

-98.7dBm

-101.5dBm

-94.8dBm EC25_Mini_PCIe_Hardware_Design 48 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Table 32: Conducted RF Receiving Sensitivity of EC25-EUX Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-109.0dBm DCS1800

-109.0dBm WCDMA B1

-110.5dBm WCDMA B8

-110.5dBm

-102.0dBm

-102.0dbm

-106.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-98.0dBm

-101dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-98.5dBm

-99.5dBm

-93.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-94.5dBm

-99.5dBm

-94.3dBm LTE-FDD B8 (10MHz)

-97.0dBm

-97.0dBm

-100.0dBm

-93.3dBm LTE-FDD B20 (10MHz)

-97.5dBm

-99.0dBm

-101.5dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.6dBm

-98.7dBm

-101.0dBm

-94.8dBm LTE-TDD B38 (10MHz)

-96.3dBm

-97dBm

-98.5dBm

-96.3dBm LTE-TDD B40 (10MHz)

-96.9dBm

-98.0dBm

-99.1dBm

-96.3dBm LTE-TDD B41 (10MHz)

-95.3dBm

-97.5dBm

-98.0dBm

-94.3dBm Table 33: Conducted RF Receiving Sensitivity of EC25-MX Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-110dBm

-110dBm WCDMA B4

-109.5dBm

-110dBm WCDMA B5

-110dBm

-110dBm

-104.7dBm

-106.7dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98.2dBm

-99.1dBm

-101.5dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.2dBm

-98.2dBm

-101.2dBm

-96.3dBm LTE-FDD B5 (10MHz)

-98.2dBm

-99.2dBm

-102.2dBm

-94.3dBm LTE-FDD B7 (10MHz)

-95.7dBm

-98.5dBm

-100.2dBm

-94.3dBm EC25_Mini_PCIe_Hardware_Design 49 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B28 (10MHz)

-97.2dBm

-99.3dBm

-101.7dBm

-94.8dBm LTE-FDD B66 (10MHz)

-97.2dBm

-98.4dBm

-101.2dBm

-95.8dBm Table 34: Conducted RF Receiving Sensitivity of EC25-AUX Mini PCIe Frequency Primary Diversity SIMO1) 3GPP (SIMO)

-102.0dBm

-102.0dBm

-102.0dBm

-102.0dBm

-104.7dBm GSM850

-109.0dBm EGSM900

-109.0dBm DCS1800

-109.0dBm PCS1900

-109.0dBm WCDMA B2

-110.5dBm

WCDMA B1

-110.0dBm

-109.5dBm

-112dBm

-106.7dBm WCDMA B4

-110.0dBm

-110dBm

-112dBm

-104.7dBm WCDMA B5

-111.0dBm

-112dBm

-113dBm

-104.7dBm WCDMA B8

-111.0dBm

-112dBm

-113dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-97.7dBm

-101.2dBm

-96.3dBm LTE-FDD B2 (10MHz)

-98.5dBm

-94.3dBm LTE-FDD B3 (10MHz)

-99.0dBm

-98.8dBm

-102.2dBm

-93.3dBm LTE-FDD B4 (10MHz)

-97.7dBm

-97.6dBm

-100.2dBm

-96.3dBm LTE-FDD B5 (10MHz)

-98.5dBm

-98.2dBm

-101.0dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.7dBm

-97.7dBm

-101.2dBm

-94.3dBm LTE-FDD B8 (10MHz)

-99.0dBm

-98.5dBm

-102.2dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.0dBm

-98.7dBm

-101.5dBm

-94.8dBm LTE-TDD B40 (10MHz)

-97.5dBm

-98.2dBm

-101.2dBm

-96.3dBm EC25_Mini_PCIe_Hardware_Design 50 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design NOTE 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.5. ESD Characteristics The following table shows the ESD characteristics of EC25 Mini PCIe. Table 35: ESD Characteristics of EC25 Mini PCIe Tested Interfaces Contact Discharge Air Discharge Unit Power Supply and GND Antenna Interfaces USB Interface

(U)SIM Interface Others

+/-5

+/-4

+/-4

+/-4

+/-0.5

+/-10

+/-8

+/-8

+/-8

+/-1 6.6. Current Consumption The following tables describe the current consumption of EC25 Mini PCIe series module. Table 36: Current Consumption of EC25-A Mini PCIe Parameter Description Conditions Typ. Unit IVBAT Sleep state WCDMA PF=128 (USB disconnected) AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) mA mA mA mA mA EC25_Mini_PCIe_Hardware_Design 51 / 76 kV kV kV kV kV 3.6 4.4 3.8 5.9 4.8 LTE Standard Module Series EC25 Mini PCIe Hardware Design Idle state WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) 27.0 40.0 43.0 59.0 mA mA mA mA WCDMA B2 HSDPA @22.63dBm 764.0 mA WCDMA B2 HSUPA @23.19dBm 741.0 mA WCDMA data transfer

(GNSS OFF) WCDMA B4 HSDPA @22.45dBm 745.0 mA WCDMA B4 HSUPA @22.57dBm 752.0 mA WCDMA B5 HSDPA @22.49dBm 616.0 mA WCDMA B5 HSUPA @22.43dBm 637.0 mA LTE data transfer

(GNSS OFF) LTE-FDD B2 @22.92dBm 977.0 mA LTE-FDD B4 @23.42dBm 1094.0 mA LTE-FDD B12 @23.39dBm 847.0 mA Parameter Description Conditions Typ. Unit WCDMA voice call WCDMA B2 @23.59dBm WCDMA B4 @23.47dBm WCDMA B5 @23.46dBm Table 37: Current Consumption of EC25-AU Mini PCIe IVBAT Sleep state AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) 861.0 mA 812.0 mA 683.0 mA 2.6 4.3 3.1 3.8 3.3 4.2 mA mA mA mA mA mA EC25_Mini_PCIe_Hardware_Design 52 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) 3.5 4.5 3.7 22.0 34.0 22.0 33.0 29.0 42.0 30.0 42.0 mA mA mA mA mA mA mA mA mA mA mA EGSM900 4DL/1UL @33.10dBm 385.0 mA EGSM900 3DL/2UL @32.93dBm 631.0 mA EGSM900 2DL/3UL @31.15dBm 730.0 mA EGSM900 1DL/4UL @29.94dBm 830.0 mA DCS1800 4DL/1UL @30.35dBm 255.0 mA DCS1800 3DL/2UL @30.25dBm 392.0 mA DCS1800 2DL/3UL @30.18dBm 527.0 mA DCS1800 1DL/4UL @29.93dBm 667.0 mA EGSM900 4DL/1UL @27.54dBm 264.0 mA EGSM900 3DL/2UL @27.38dBm 368.0 mA Idle state GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) EGSM900 2DL/3UL @27.27dBm 498.0 mA EGSM900 1DL/4UL @27.17dBm 634.0 mA DCS1800 4DL/1UL @27.64dBm 223.0 mA DCS1800 3DL/2UL @27.45dBm 333.0 mA EC25_Mini_PCIe_Hardware_Design 53 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design DCS1800 2DL/3UL @27.34dBm 449.0 mA DCS1800 1DL/4UL @27.29dBm 573.0 mA WCDMA B1 HSDPA @22.45dBm 815.0 mA WCDMA B1 HSUPA @21.75dBm 804.0 mA WCDMA data transfer

(GNSS OFF) WCDMA B5 HSDPA @22.41dBm 755.0 mA WCDMA B5 HSUPA @22.13dBm 775.0 mA WCDMA B8 HSDPA @21.34dBm 619.0 mA WCDMA B8 HSUPA @21.07dBm 634.0 mA LTE-FDD B1 @23.39dBm 1055.0 mA LTE data transfer

(GNSS OFF) GSM voice call LTE-FDD B3 @22.26dBm 967.0 mA LTE-FDD B5 @22.27dBm 814.0 mA LTE-FDD B8 @22.21dBm 817.0 mA LTE-TDD B40 @22.62dBm 568.0 mA EGSM900 PCL=5 @33.24dBm 368.0 mA DCS1800 PCL=0 @30.13dBm 223.0 mA WCDMA voice call WCDMA B1 @23.20dBm WCDMA B5 @22.82dBm WCDMA B8 @22.99dBm Table 38: Current Consumption of EC25-J Mini PCIe 883.0 mA 782.0 mA 677.0 mA Parameter Description Conditions Typ. Unit IVBAT Sleep state AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) 3.2 4.3 3.8 5.0 mA mA mA mA EC25_Mini_PCIe_Hardware_Design 54 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) WCDMA B1 HSDPA @22.55dBm WCDMA B1 HSUPA @22.25dBm WCDMA B6 HSDPA @22.79dBm WCDMA B6 HSUPA @22.59dBm WCDMA B8 HSDPA @22.71dBm WCDMA B8 HSUPA @22.63dBm WCDMA B19 HSDPA @22.77dBm WCDMA B19 HSUPA @22.53dBm Idle state WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) LTE-FDD B8 @23.29dBm LTE-FDD B18 @23.82dBm LTE-FDD B19 @23.78dBm LTE-FDD B26 @23.22dBm LTE-TDD B41 @22.95dBm WCDMA WCDMA B1 @23.39dBm 4.4 5.1 4.4 31.5 43.5 32.3 45.4 32.3 43.3 829.0 848.2 649.2 661.4 691.0 700.0 644.2 657.6 867.3 947.7 955.1 924.9 609.6 969.6 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE-FDD B1 @23.15dBm 1045.0 mA LTE-FDD B3 @23.29dBm 1070.0 mA EC25_Mini_PCIe_Hardware_Design 55 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Parameter Description Conditions Typ. Unit voice call WCDMA B6 @23.36dBm WCDMA B8 @23.54dBm WCDMA B19 @23.29dBm Table 39: Current Consumption of EC25-E Mini PCIe Sleep state WCDMA PF=128 (USB disconnected) AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) IVBAT GSM DRX=5 (USB disconnected) Idle state 692.3 763.9 682.1 mA mA mA 3.9 5.1 4.3 5.5 4.8 5.8 5.0 5.8 4.9 30.0 43.0 31.0 45.0 31.0 44.0 32.0 44.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA GPRS data transfer

(GNSS OFF) EGSM900 4DL/1UL @33.08dBm 372.0 mA EGSM900 3DL/2UL @31.03dBm 626.0 mA EC25_Mini_PCIe_Hardware_Design 56 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design EGSM900 2DL/3UL @29.86dBm 706.0 mA EGSM900 1DL/4UL @29.44dBm 767.0 mA DCS1800 4DL/1UL @30.39dBm 262.0 mA DCS1800 3DL/2UL @30.19dBm 417.0 mA DCS1800 2DL/3UL @30.02dBm 564.0 mA DCS1800 1DL/4UL @29.86dBm 709.0 mA EGSM900 4DL/1UL @27.59dBm 233.0 mA EGSM900 3DL/2UL @27.45dBm 370.0 mA EGSM900 2DL/3UL @27.31dBm 500.0 mA EGSM900 1DL/4UL @27.14dBm 623.0 mA DCS1800 4DL/1UL @26.24dBm 224.0 mA DCS1800 3DL/2UL @26.13dBm 334.0 mA DCS1800 2DL/3UL @25.97dBm 440.0 mA DCS1800 1DL/4UL @25.82dBm 553.0 mA WCDMA B1 HSDPA @22.49dBm 798.0 mA WCDMA B1 HSUPA @21.87dBm 788.0 mA EDGE data transfer

(GNSS OFF) WCDMA data transfer

(GNSS OFF) WCDMA B5 HSDPA @22.66dBm 781.0 mA WCDMA B5 HSUPA @21.99dBm 770.0 mA WCDMA B8 HSDPA @22.23dBm 655.0 mA WCDMA B8 HSUPA @21.68dBm 659.0 mA LTE-FDD B1 @23.12dBm 940.0 mA LTE data transfer

(GNSS OFF) LTE-FDD B3 @22.75dBm 989.0 mA LTE-FDD B5 @22.92dBm 962.0 mA LTE-FDD B7 @23.42dBm 1188.0 mA LTE-FDD B8 @22.97dBm 911.0 mA EC25_Mini_PCIe_Hardware_Design 57 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B20 @22.51dBm 946.0 mA LTE-TDD B38 @22.58dBm 686.0 mA LTE-TDD B40 @22.31dBm 576.0 mA LTE-TDD B41 @22.03dBm 611.0 mA GSM voice call EGSM900 PCL=5 @33.31dBm 367.0 mA DCS1800 PCL=0 @29.48dBm 248.0 mA WCDMA voice call WCDMA B1 @23.18dBm WCDMA B5 @22.62dBm WCDMA B8 @23.02dBm 868.0 mA 808.0 mA 728.0 mA 3.4 4.8 4.3 30.0 42.0 mA mA mA mA mA Table 40: Current Consumption of EC25-V Mini PCIe Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) IVBAT LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) Idle state LTE data transfer

(GNSS OFF) LTE-FDD B4 @23.3dBm 873.0 mA LTE-FDD B13 @22.13dBm 638.0 mA Table 41: Current Consumption of EC25-AF Mini PCIe Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) IVBAT Sleep state WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) 2.2 3.1 2.8 mA mA mA EC25_Mini_PCIe_Hardware_Design 58 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Idle state WCDMA data transfer

(GNSS OFF) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) 3.7 3.1 21.7 32.5 25.0 38.0 mA mA mA mA mA mA WCDMA B2 HSDPA @22.63dBm 560.0 mA WCDMA B2 HSUPA @22.49dBm 564.0 mA WCDMA B4 HSDPA @22.45dBm 601.0 mA WCDMA B4 HSUPA @22.57dBm 610.0 mA WCDMA B5 HSDPA @22.49dBm 603.0 mA WCDMA B5 HSUPA @22.43dBm 617.0 mA LTE-FDD B2 @22.92dBm 758.0 mA LTE-FDD B4 @23.12dBm 770.0 mA LTE-FDD B5 @22.98dBm 700.0 mA LTE data transfer

(GNSS OFF) LTE-FDD B12 @23.42dBm 808.0 mA LTE-FDD B13 @22.92dBm 790.0 mA LTE-FDD B14 @23.42dBm 795.0 mA LTE-FDD B66 @23.35dBm 816.0 mA LTE-FDD B71 @23.39dBm 801.0 mA WCDMA voice call WCDMA B2 @23.59dBm WCDMA B4 @23.47dBm WCDMA B5 @23.46dBm 585.0 mA 610.0 mA 605.0 mA EC25_Mini_PCIe_Hardware_Design 59 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Table 42: Current Consumption of EC25-EUX Mini PCIe Parameter Description Conditions Typ. Unit OFF state Power down Sleep state WCDMA PF=128 (USB disconnected) AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) 11 0.96 2.14 1.49 1.99 1.39 2.48 1.81 2.79 2.00 19.5 29.5 21.0 31.0 20.7 30.8 20.8 32.0 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA IVBAT GSM DRX=5 (USB connected) Idle state EGSM900 4DL/1UL @33.23dBm 265.0 mA GPRS data transfer

(GNSS OFF) EGSM900 3DL/2UL @31.96dBm 388.0 mA EGSM900 2DL/3UL @29.73dBm 461.0 mA EGSM900 1DL/4UL @28.5dBm 593.0 mA DCS1800 4DL/1UL @30.49dBm 156.0 mA EC25_Mini_PCIe_Hardware_Design 60 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design DCS1800 3DL/2UL @29.24dBm 245.0 mA DCS1800 2DL/3UL @27.15dBm 337.0 mA DCS1800 1DL/4UL @25.88dBm 427.0 mA EGSM900 4DL/1UL PCL=8 @26.60dBm 170.0 mA EGSM900 3DL/2UL PCL=8 @25.43dBm 205.0 mA EGSM900 2DL/3UL PCL=8 @23.4dBm 280.0 mA EGSM900 1DL/4UL PCL=8 @22.36dBm 348.0 mA DCS1800 4DL/1UL PCL=2 @25.59dBm 136.0 mA DCS1800 3DL/2UL PCL=2 @24.54dBm 225.0 mA DCS1800 2DL/3UL PCL=2 @22.38dBm 300.0 mA DCS1800 1DL/4UL PCL=2 @21.24dBm 379.0 mA WCDMA B1 HSDPA @22.93dBm 504.0 mA EDGE data transfer

(GNSS OFF) WCDMA data transfer

(GNSS OFF) WCDMA B1 HSUPA @22.62dBm 512.0 mA WCDMA B8 HSDPA @22.88dBm 562.0 mA WCDMA B8 HSUPA @22.14dBm 535.0 mA LTE data transfer

(GNSS OFF) LTE-FDD B1 @23.6dBm 664.0 mA LTE-FDD B3 @23.67dBm 693.0 mA LTE-FDD B7 @23.83dBm 800.0 mA LTE-FDD B8 @23.82dBm 695.0 mA LTE-FDD B20 @23.88dBm 690.0 mA LTE-FDD B28A @23.43dBm 669.0 mA LTE-TDD B38 @22.82dBm 438.0 mA LTE-TDD B40 @23.43dBm 355.0 mA LTE-TDD B41 @23.46dBm 451.0 mA GSM EGSM900 PCL=5 @33.25dBm 258.0 mA EC25_Mini_PCIe_Hardware_Design 61 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design voice call WCDMA voice call DCS1800 PCL=0 @30.23dBm 178.0 mA WCDMA B1 @23.88dBm 533.0 mA WCDMA B8 @23.8dBm 506.0 mA Table 43: Current Consumption of EC25-AFX Mini PCIe Parameter Description Conditions Typ. Unit IVBAT LTE-FDD PF=128 (USB disconnected) Sleep state WCDMA PF=512 (USB disconnected) AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) WCDMA PF=128 (USB disconnected) WCDMA PF=256 (USB disconnected) LTE-FDD PF=32 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-FDD PF=256 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) 1.67 2.51 2.93 2.16 2.07 1.88 4.29 3.04 3.23 2.39 2.06 22.0 43.0 22.0 42.8 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle state WCDMA B2 HSDPA @22.45dBm 691.0 mA WCDMA data transfer

(GNSS OFF) WCDMA B2 HSUPA @22.23dBm 605.0 mA WCDMA B4 HSDPA @22.42dBm 628.0 mA WCDMA B4 HSUPA @22.11dBm 630.0 mA EC25_Mini_PCIe_Hardware_Design 62 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA B5 HSDPA @22.02dBm 618.0 mA WCDMA B5 HSUPA @22.10dBm 634.0 mA LTE-FDD B2 @23.01dBm 743.0 mA LTE-FDD B4 @22.58dBm 816.0 mA LTE-FDD B5 @23.2dBm 751.0 mA LTE-FDD B12 @22.94dBm 825.0 mA LTE-FDD B13 @23.18dBm 815.0 mA LTE-FDD B14 @23.44dBm 849.0 mA LTE-FDD B66 @23.2dBm 850.0 mA LTE-FDD B71 @22.82dBm 788.0 mA LTE data transfer

(GNSS OFF) WCDMA voice call WCDMA B2 @23.27dBm 672.0 mA WCDMA B4 @23.22dBm 663.0 mA WCDMA B5 @23.02dBm 680.0 mA Table 44: Current Consumption of EC25-MX Mini PCIe Parameter Description Conditions Typ. Unit IVBAT Sleep state WCDMA PF=256 (USB disconnected) AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) WCDMA PF=128 (USB disconnected) WCDMA PF=512 (USB disconnected) LTE-FDD PF=32 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) 1.55 2.82 2.98 2.33 2.13 1.97 4.36 3.14 3.33 mA mA mA mA mA mA mA mA mA EC25_Mini_PCIe_Hardware_Design 63 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=256 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) 2.55 2.38 20.0 41.1 20.5 40.7 mA mA mA mA mA mA WCDMA B2 HSDPA @22.75dBm 848.0 mA WCDMA B2 HSUPA @22.3dBm 818.0 mA WCDMA B4 HSDPA @23.34dBm 813.0 mA WCDMA B4 HSUPA @23.11dBm 774.0 mA WCDMA B5 HSDPA @22.53dBm 759.0 mA WCDMA B5 HSUPA @22.58dBm 717.0 mA LTE-FDD B2 @23.09dBm 918.0 mA LTE-FDD B4 @23.12dBm 933.0 mA LTE-FDD B5 @22.28dBm 706.0 mA LTE-FDD B7 @22.56dBm 1011.0 mA LTE-FDD B28 @22.41dBm 793.0 mA LTE-FDD B66 @23.94dBm 937.0 mA Idle state WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) WCDMA B2 @23.97dBm 967.0 mA WCDMA voice call WCDMA B4 @23.92dBm 825.0 mA WCDMA B5 @23.00dBm 844.0 mA EC25_Mini_PCIe_Hardware_Design 64 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Table 45: Current Consumption of EC25-AUX Mini PCIe Parameter Description Conditions Typ. Unit IVBAT WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) GSM850 4DL/1UL @32.88dBm GSM850 3DL/2UL @31.99dBm GSM850 2DL/3UL @29.94dBm GSM850 1DL/4UL @28.73dBm EGSM900 4DL/1UL @33.75dBm EGSM900 3DL/2UL @32.18dBm Idle state GPRS data transfer

(GNSS OFF) 1.9 2.9 2.4 3.8 3.4 4.5 3.9 4.5 3.7 23.4 43.4 24.2 45.6 28.7 43.7 30.4 43.9 368.0 565.5 636.7 733.7 419.3 591.5 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Mini_PCIe_Hardware_Design 65 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design EGSM900 2DL/3UL @29.90dBm EGSM900 1DL/4UL @28.70dBm DCS1800 4DL/1UL @30.02dBm DCS1800 3DL/2UL @29.12dBm DCS1800 2DL/3UL @26.98dBm DCS1800 1DL/4UL @25.80dBm PCS1900 4DL/1UL @30.22dBm PCS1900 3DL/2UL @28.93dBm PCS1900 2DL/3UL @27.00dBm PCS1900 1DL/4UL @25.86dBm GSM850 4DL/1UL @27.45dBm GSM850 3DL/2UL @26.29dBm GSM850 2DL/3UL @23.96dBm GSM850 1DL/4UL @22.72dBm EGSM900 4DL/1UL @27.63dBm EGSM900 3DL/2UL @26.45dBm EGSM900 2DL/3UL @24.27dBm EGSM900 1DL/4UL @22.99dBm DCS1800 4DL/1UL @26.55dBm DCS1800 3DL/2UL @25.90dBm DCS1800 2DL/3UL @23.91dBm DCS1800 1DL/4UL @22.61dBm PCS1900 4DL/1UL @26.67dBm PCS1900 3DL/2UL @25.88dBm PCS1900 2DL/3UL @23.85dBm EDGE data transfer

(GNSS OFF) 631.4 725.3 221.8 319.6 384.8 468.3 243.2 336.9 398.3 478.0 253.6 389.8 515.4 647.6 257.2 399.1 515.3 642.0 196.7 304.4 408.8 524.3 194.7 299.1 399.7 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Mini_PCIe_Hardware_Design 66 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design PCS1900 1DL/4UL @22.73dBm WCDMA B1 HSDPA @21.54dBm WCDMA B1 HSUPA @21.82dBm WCDMA B2 HSDPA @22.10dBm WCDMA data transfer

(GNSS OFF) WCDMA B2 HSUPA @21.84dBm WCDMA B5 HSDPA @23.27dBm WCDMA B5 HSUPA @22.93dBm WCDMA B8 HSDPA @21.70dBm WCDMA B8 HSUPA @21.12dBm LTE-FDD B1 @23.50dBm LTE-FDD B2 @22.95dBm LTE-FDD B3 @23.27dBm LTE-FDD B4 @23.28dBm LTE-FDD B5 @23.09dBm LTE-FDD B7 @23.09dBm LTE-FDD B8 @23.64dBm LTE-FDD B28 @22.79dBm LTE-TDD B40 @23.70dBm GSM850 PCL5 @32.75dBm EGSM900 PCL5 @33.53dBm DCS1800 PCL0 @30.03dBm PCS1900 PCL0 @29.94dBm WCDMA B1 @23.75dBm WCDMA B2 @23.07dBm WCDMA B5 @23.31dBm LTE data transfer

(GNSS OFF) GSM voice call WCDMA voice call 510.1 679.4 721.1 723.0 708.6 672.6 672.0 667.9 674.5 963.9 941.7 856.4 817.1 724.5 945.2 888.3 964.5 428.9 346.9 385.3 210.2 219.6 785.1 804.5 701.8 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Mini_PCIe_Hardware_Design 67 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA B8 @22.65dBm 739.7 mA Table 46: Current Consumption of EC25-EU Mini PCIe Parameter Description Conditions Typ. Unit Sleep state WCDMA PF=128 (USB disconnected) AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) 3.4 5.2 4.1 4.9 4.4 5.3 4.6 5.3 4.5 23.3 35.4 23.9 36.3 24.1 36.4 24.1 36.3 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA IVBAT GSM DRX=5 (USB connected) Idle state EGSM900 4DL/1UL @32.54dBm 379.0 mA GPRS data transfer

(GNSS OFF) EGSM900 3DL/2UL @31.96dBm 610.0 mA EGSM900 2DL/3UL @29.59dBm 654.0 mA EGSM900 1DL/4UL @28.34dBm 734.0 mA EC25_Mini_PCIe_Hardware_Design 68 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design DCS1800 4DL/1UL @29.63dBm 236.0 mA DCS1800 3DL/2UL @28.59dBm 343.0 mA DCS1800 2DL/3UL @26.62dBm 413.0 mA DCS1800 1DL/4UL @25.29dBm 498.0 mA EGSM900 4DL/1UL @27.51dBm 234.0 mA EGSM900 3DL/2UL @27.23dBm 372.0 mA EGSM900 2DL/3UL @27.08dBm 501.0 mA EDGE data transfer

(GNSS OFF) EGSM900 1DL/4UL @26.81dBm 628.0 mA DCS1800 4DL/1UL @26.29dBm 199.0 mA DCS1800 3DL/2UL @26.18dBm 309.0 mA DCS1800 2DL/3UL @26.05dBm 415.0 mA DCS1800 1DL/4UL @25.35dBm 503.0 mA WCDMA B1 HSDPA @22.01dBm 755.0 mA WCDMA data transfer

(GNSS OFF) WCDMA B1 HSUPA @22.79dBm 776.0 mA WCDMA B8 HSDPA @22.21dBm 670.6 mA WCDMA B8 HSUPA @22.04dBm 692.6 mA LTE-FDD B1 @23.63dBm 918.7 mA LTE-FDD B3 @22.78dBm 914.0 mA LTE-FDD B7 @22.31dBm 985.2 mA LTE-FDD B8 @23.35dBm 886.5 mA LTE-FDD B20 @22.71dBm 909.1 mA LTE-FDD B28A @21.79dBm 898.1 mA LTE-TDD B38 @22.85dBm 587.8 mA LTE-TDD B40 @22.96dBm 460.6 mA LTE-TDD B41 @22.69dBm 571.2 mA LTE data transfer

(GNSS OFF) EC25_Mini_PCIe_Hardware_Design 69 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design GSM voice call EGSM900 PCL=5 @32.80dBm 370.0 mA DCS1800 PCL=0 @29.51dBm 221.0 mA WCDMA voice call WCDMA B1 @22.96dBm WCDMA B8 @23.21dBm 829.5 mA 752.9 mA Table 47: GNSS Current Consumption of EC25 Mini PCIe Series Module Parameter Description Conditions Typ. Unit IVBAT

(GNSS) Searching

(AT+CFUN=0) Cold start @Passive Antenna Lost state @Passive Antenna Tracking

(AT+CFUN=0) Instrument environment Open Sky @Passive Antenna Open Sky @Active Antenna 75.0 74.0 44.0 53.0 58.0 mA mA mA mA mA 6.7. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:

On customers PCB design, please keep placement of the PCI Express Mini Card away from heating Do not place components on the PCB area where the module is mounted, in order to facilitate adding Do not apply solder mask on the PCB area where the module is mounted, so as to ensure better heat sources. of heatsink. dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Add a heatsink on the top of the module and the heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module. Add a thermal pad with appropriate thickness at the bottom of the module to conduct the heat to PCB. The following figure shows the referenced heatsink design. EC25_Mini_PCIe_Hardware_Design 70 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 17: Referenced Heatsink Design NOTES 1. The module offers the best performance when the internal BB chip stays below 105C. When the maximum temperature of the BB chip reaches or exceeds 105C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. 2. For more detailed guidelines on thermal design, please refer to document [4]. EC25_Mini_PCIe_Hardware_Design 71 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 7 Dimensions and Packaging 7.1. General Description This chapter mainly describes mechanical dimensions as well as packaging specification of EC25 Mini PCIe module. All dimensions are measured in mm, and the dimensional tolerances are 0.05mm unless otherwise specified. 7.2. Mechanical Dimensions of EC25 Mini PCIe 30.000.15 24.200.20 3x3.000.10 5.980.10 2x2.600.1 0.610.05 2.350.10 8.250.10 5.450.10 6.380.10 6.350.10 34.300.20 48.050.20 4.900.20 50.950.15 1.400.10 9.900.10 7.260.10 1.000.10 Side View 4.000.10 Pin1 Pin51 Top View 10.350.10 Figure 18: Mechanical Dimensions of EC25 Mini PCIe EC25_Mini_PCIe_Hardware_Design 72 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 7.3. Standard Dimensions of Mini PCI Express The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1]

for Detail A and Detail B. Figure 19: Standard Dimensions of Mini PCI Express EC25_Mini_PCIe_Hardware_Design 73 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design EC25 Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives and standards listed in the document [1]. The following figure takes the Molex 679100002 as an example. Figure 20: Dimensions of the Mini PCI Express Connector (Molex 679100002) 7.4. Packaging Specifications The EC25 Mini PCIe is packaged in a tray. Each tray contains 10pcs of modules. The smallest package of EC25 Mini PCIe contains 100pcs. EC25_Mini_PCIe_Hardware_Design 74 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design 8 Appendix A References Table 48: Related Documents SN Document Name Remark PCI Express Mini Card Electromechanical Specification Revision 1.2 Quectel_EC2x&EG9x&EM05_AT_Commands_ Manual Quectel_EC2x&EGxx&EM05_GNSS_AT_ Commands_Manual

[4]

Quectel_LTE_Module_Thermal_Design_Guide Mini PCI Express specification AT commands manual for EC25, EC21, EC20 R2.0, EC20 R2.1, EG91, EG95 and EM05 modules GNSS AT Commands Manual for EC25, EC21, EC20 R2.0, EC20 R2.1, EG95, EG91, EG25-G and EM05 modules Thermal design guide for LTE standard, LTE-A and Automotive modules Table 49: Terms and Abbreviations Abbreviation Description Adaptive Multi-rate Bits Per Second Bluetooth Coding Scheme Clear to Send Down Link Data Terminal Equipment DC-HSPA+

Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over-The-Air

[1]

[2]

[3]

AMR bps BT CS CTS DL DTE EC25_Mini_PCIe_Hardware_Design 75 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design GLONASS GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System DTR EFR EMI ESD ESR FDD FR GMSK GNSS GPS GSM HR HSPA HSUPA kbps LED LTE Mbps MCU ME MIMO MMS MO MT Data Terminal Ready Enhanced Full Rate Electro Magnetic Interference Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplexing Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Uplink Packet Access Kilo Bits Per Second Light Emitting Diode Long-Term Evolution Million Bits Per Second Micro Control Unit Mobile Equipment Multiple-Input Multiple-Output Multimedia Messaging Service Mobile Originated Mobile Terminated EC25_Mini_PCIe_Hardware_Design 76 / 76 LTE Standard Module Series EC25 Mini PCIe Hardware Design NMEA National Marine Electronics Association PCM PDA PDU POS PPP RF RTS Rx SIMO SMS TX TVS UART UL URC USB

(U)SIM WCDMA WLAN Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Point of Sale Point-to-Point Protocol Radio Frequency Ready To Send Receive Single Input Multiple Output Short Message Service Transmitting Direction Transient Voltage Suppressor Up Link Unsolicited Result Code Universal Serial Bus Universal Asynchronous Receiver & Transmitter

(Universal) Subscriber Identification Module Wideband Code Division Multiple Access Wireless Local Area Networks EC25_Mini_PCIe_Hardware_Design 77 / 76

 

 

 

 

 

 

 

 

 

 

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Quectel Wireless Solutions Company Limited EC52-AUX original date of grant : 07/01/2020, Certificate number :202180541AA00 FCC IDXMR202006EC25AUX Name: LTE Module Parent Model: EC25-AUX, EC25-AUX MINIPCIE The description of the modification is as follows All reports are updated as follows:

EC25-AUX, EC25-AUX MINIPCIE (Report No.: R2108A0762-R1) is a variant model of EC25-AUX, EC25-AUX MINIPCIE (Report No.: R2005A0269-R1). There is only changed the Power Amplifier and Software Version of product. Tested cases refer to the following table. Please refer to Appendix C for Verify data Test Case Original Variant RF Power Output and Effective Radiated Power Occupied Bandwidth Band Edge Compliance PASS Retest(GSM850 /WCDMA Band V/ LTE band5) PASS PASS Verify the worst combination of each frequency band(GSM850 / WCDMA Band V/ LTE band5) Verify the worst combination of each frequency band(GSM850 / WCDMA Band V/ LTE band5) Peak-to-Average Power Ratio PASS Retest(GSM850 / WCDMA Band V/ LTE band 5) Frequency Stability PASS Retest(GSM850 / WCDMA Band V/ LTE band 5) Spurious Emissions at Antenna Terminals PASS Verify the worst combination of each frequency band(GSM850 / WCDMA Band V/ LTE band5) Radiates Spurious Emission PASS Retest(GSM850 / WCDMA Band V/ LTE band 5) EC25-AUX, EC25-AUX MINIPCIE (Report No.: R2108A0762-R2) is a variant model of EC25-AUX, EC25-AUX MINIPCIE (Report No.: R2005A0269-R2). There is only changed the Power Amplifier and Software Version of product. Tested cases refer to the following table. Please refer to Appendix C for Verify data Test Case Original Variant RF Power Output and Effective Radiated Power Occupied Bandwidth Band Edge Compliance PASS Retest(GSM1900/ WCDMA Band II/ LTE Band 2) PASS PASS Verify the worst combination of each frequency band(GSM1900/ WCDMA Band II/ LTE Band 2) Verify the worst combination of each frequency band(GSM1900/ WCDMA Band II/ LTE Band 2) Peak-to-Average Power Ratio PASS Retest(GSM1900/ WCDMA Band II/ LTE Band 2) Frequency Stability PASS Retest(GSM1900/ WCDMA Band II/ LTE Band 2) Spurious Emissions at Antenna Terminals PASS Verify the worst combination of each frequency band(GSM1900/ WCDMA Band II/ LTE Band 2) Radiates Spurious Emission PASS Retest(GSM1900/ WCDMA Band II/ LTE Band 2) EC25-AUX, EC25-AUX MINIPCIE (Report No.: R2108A0762-R3) is a variant model of EC25-AUX, EC25-AUX MINIPCIE (Report No.: R2005A0269-R3). There is only changed the Power Amplifier and Software Version of product. Tested cases refer to the following table. Please refer to Appendix C for Verify data Test Case Original Variant RF Power Output and Effective Radiated Power Occupied Bandwidth Band Edge Compliance Peak-to-Average Power Ratio Frequency Stability PASS PASS PASS PASS PASS Retest(LTE band4/7) Verify the worst combination of each frequency band(LTE band4/7) Verify the worst combination of each frequency band(LTE band4/7) Retest(LTE band4/7) Retest(LTE band4/7) Spurious Emissions at Antenna Terminals PASS Radiates Spurious Emission PASS Verify the worst combination of each frequency band(LTE band4/7) Verify the worst combination of each frequency band(LTE band4/7) Your assistance on this matter is highly appreciated. Signature:

Print name: Jean Hu Date: 11/20/2021 Company: Quectel Wireless Solutions Co., Ltd.

 

 

The cover letter - C2PCPX 1) The requirements of 2.1043 are fulfilled, i.e., the devices block functions for the fundamentalfrequency, primary modulator circuit, maximum power, or field strength ratings shall remain unchanged. Reply:

Remains un-changed. Only the following components are changed. RF Switches, and 2G FEM module (IC) with PA, and internal switch are changed 2) Transmitter PCB layout and parts changes are only permitted if there is no change in identifying adevices form, functional specification, as initially granted or previously approved under a Class IIpermissive change. Reply:

PCB remains identical, Both switches, and 2G (GSM) FEM module are pin to pin compatible with same Pin defined. 3) PCB changes are limited to non-substantive modifications layout changes to the same size physicalcircuit board previously granted. Reply:

Layout is identical with non-electrical identical RF components changed. The datasheet as submitted yields the characteristics with better performance with regards to image suppression, sensitivity, etc. And, Max power is set identically, and lower than the original one. 4) C2PCPX is not permitted to add, remove, augment, or change capabilities, such as transmitters, increasedbandwidth, additional rule parts, bands, etc. Reply:

There is no augment, add, or change as compared to the original. The 2G GSM FEM module remains in part 22, and 24. The replacing switches has larger capability to handle higher input power (RF), however, the power by RF remains the same with purpose to yield better power handling, and leakage ratio 5) In the PAG submission for item C2PCPX, the applicant shall provide complete information on testing demonstrating that the proposed changes for fundamental emissions are unchanged within the normal,acceptable tolerances and out-of-band;

emissions do not exceed the appropriate limits.The PAG submission shall include all applicable test reports and internal photos. Reply:

The submitted evaluation, The spot check summary sheet TA1208, with appendix C of the submitted test report reflects the tolerances as compared to the original are controlled. Furthermore, emissions as tested under spot check mode are even better. 6) The modified device shall not be marketed under the existing grant of certification before confirmationthat the C2PCPX PAG is approved and granted. Reply:

The modified device would not be marketed, and imported before this PAG is approved, and obtaining the grant 7) Software Defined Radio (SDR) grants that use the C2PCPX procedure are not permitted to makesubsequent Class III permissive changes. Reply:

This application is not SDR equipment, but non-SDR with components changed 8) The C2PCPX PAG procedure has no impact on the provisions of V) of this publication for non-SDRsoftware-only changes; thus, adding an equipment class when related to rule changes is still permitted. Reply:

Inapplicable as this is non-SDR module 9) Class I permissive changes are not permitted3 under this C2PCPX procedure. Reply:

Class II is pursuant Signature:

Print name: Jean Hu Date 01/07/2021 Company: Quectel Wireless Solutions Co., Ltd.

 

 

Quectel Wireless Solutions Co., Ltd Statement We Quectel Wireless Solutions Co., Ltd declare the following models. Product Name: LTE Module Model Number: EC25-AUX Hardware Version: R2.0 The new version of EC25-AUX share the same HW design with the certificated version, The main differences are Switch and TXM as follow:

Quectel Wireless Solutions Co., Ltd Designator EC25-AUX (Original) EC25-AUX (new version)

(Part Description) U0702 BGS12SN6 E6327

(Part Description) MXD8625C IC RF SWITCH SPDT 30dBm 1.1x0.7mm IC RF SWITCH SPDT 36.5dBm 1.1x0.7mm IC RF SWITCH SPDT 30dBm 1.1x0.7mm IC RF SWITCH SPDT 36.5dBm 1.1x0.7mm H0.375mm RO U0703 BGS12SN6 E6327 H0.375mm RO U0801 BGS12SN6 E6327 H0.375mm RO U0803 VC7912-61 H0.45mm RO MXD8625C H0.45mm RO MXD8625C H0.45mm RO VC7916-62 IC RF SWITCH SPDT 30dBm 1.1x0.7mm IC RF SWITCH SPDT 36.5dBm 1.1x0.7mm IC RF SWITCH SP10T + GSM Qualband IC RF SWITCH SP14T + GSM Qualband 5.3x5.5mm H0.905mm RO 5.3x5.5mm H0.83mm RO The change will not impact RF performance for original frequency bands. Verification with the causal impact are related test made, and the results reflect the modification remains compliant below the compliance level. Your assistance on this matter is highly appreciated. Sincerely, Name: Jean Hu Title: Certification Section

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Quectel Wireless Solutions Company Limited POWER OF ATTORNEY DATE: November 20,2021 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/Han jinnan on our behalf, to apply to FCC on our equipment for FCC ID:

XMR202006EC25AUX. Any and all acts carried out by TA Technology

(Shanghai) Co., Ltd. / Han jinnan on our behalf shall have the same effect as acts of our own. Sincerely, Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Company Limited

 

 

Quectel Wireless Solutions Company Limited Request for Confidentiality Date: _2021/11/20_ Subject: Confidentiality Request for: _____ FCC ID: XMR202006EC25AUX_____ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested

*Note:

Short Term ______(Insert Explanation as Necessary)______ Permanent Exhibit Parts List & Placement ______ FCC ID: XMR202006EC25AUX has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:

(Signature/Title1) Jean Hu

(Print name)

 

 

 

 

 

 

 

 

 

 

Quectel Wireless Solutions Company Limited Request for Confidentiality Date:

_2020/6/8 _ Subject: Confidentiality Request for: _____ FCC ID: XMR202006EC25AUX ______ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Permanent Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term ______(Insert Explanation as Necessary)______ Permanent*1 Permanent Permanent Permanent Permanent Permanent*

Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual

*Note:

______ FCC ID: XMR202006EC25AUX _____ has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:

(Signature/Title2) Jean Hu

(Print name)

 

 

 

 

 

 

Quectel Wireless Solutions Company Limited Declaration of the Modular Approval Applicant / Grantee FCC ID:

Model:

Quectel Wireless Solutions Company Limited XMR202006EC25AUX EC25-AUX, EC25-AUX MINIPCIE The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:

Modular approval requirement

(a) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. EUT Condition The radio elements of the modular transmitter have their own shielding. Comply YES

(b) The modular transmitter have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation. must The modular has buffered data inputs, it is integrated in chip. Please see schematic.pdf

(c)The modular transmitter must have its own powersupply regulation. YES YES Not Applicable All power lines derived from the host device are regulated before energizing other circuits internal to the EC25-

AUX, EC25-AUX MINIPCIE. Please see schematic.pdf A permanently attached antenna or unique antenna connector is not a requirement for licensed modules.

(d) the and The antenna modular transmitter must transmission comply with system requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section.

(e)The be must modular transmitter tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section The EC25-AUX, EC25-AUX MINIPCIE was tested in a standalone configuration via a PCMCIA extender. Please see conducted setup photo.pdf and YES Quectel Wireless Solutions Company Limited spurious setup least 10 centimeters to insure that 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, there is no at coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available

(see Section 15.31(i)) must not be in side another device during testing.

(f)The modular transmitter be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. must

(g) The modular transmitter must comply YES with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any suchrequirements. A copy of these instructions must be included in the application for equipmentauthorizationrequirements,whicharebasedon theintendeduse/configurations.

(h)The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. YES The label position of EC25-

AUX, EC25-AUX MINIPCIE is clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text: Contains FCC ID:

XMR202006EC25AUX. Please see the label.pdf The EC25-AUX, EC25-AUX MINIPCIE is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. YES The EC25-AUX, EC25-AUX MINIPCIE is approved to comply with the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance restriction. Quectel Wireless Solutions Company Limited Dated By:

2020/6/8 Jean Hu Signature Printed Title: Certification Section Manager On behalf of :

(Quectel Wireless Solutions Company Limited) Telephone:

+86-2150086326-800

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Quectel Wireless Solutions Company Limited XMR202006EC25AUXdatareusecoverletter EC25,EC25AUMINIPCIEFCCID:XMR201805EC25AUcertifite:182180550_AA_00_final,dateof grant:05/04/2018 We Quectel Wireless Solutions Co., Ltd. declare the following models. Product Name: LTE CAT4 Module Model Number: EC25-AU, EC25-AUX Hardware Version: V3.1 EC25-AU and EC25-AUX share the same HW design, the difference between them is only MMPA and TXM. The vendor is SKYWORKS on EC25-AU, Vanchip on EC25-AUX. No.: R2005A 0154R1). Te power outp quency Stab A0269R1) is st values pa ut, Effective bility and Ra a variant mo rtial duplicat e Radiated P diates Spuri odel of EC25 ted from ori Power, Occu ous Emission 5AU, ginal upied n for eport No.: R port No.: R There is on th, Band Ed r variant in No.: R2005A 0154R3). Te power outp quency Stab 9-R2) is a va R2005A0269 4-R2). Test R1804A0154 RF power o nly tested R iance, Freq dge Compli

. this report. a variant mo A0269R3) is st values pa rtial duplicat ut, Effective e Radiated P bility and Ra diates Spuri ariant mod values pa utput, Effec quency Stab el of artial ctive bility odel of EC25 ted from ori Power, Occu ous Emission 5AU, ginal upied n for ereportupda AUX MINIPC CIE (Report N ere is only d Edge Com port. atesbelow:

CIE (Report No.: R1804A0 tested RF p mpliance, Fre C25-AUX MI 25-AU MINI m original f er, Occupie Spurious Em AUX MINIPC CIE (Report N ere is only d Edge Com port. NIPCIE (Re IPCIE (Rep for variant. ed Bandwid mission for CIE (Report No.: R1804A0 tested RF p mpliance, Fre asecheckthe 5AUX, EC25 5AU MINIPC variant. The dwidth, Ban antinthisre 25-AUX, EC 25-AU, EC2 plicated from diated Powe d Radiates S 5AUX, EC25 5AU MINIPC variant. The dwidth, Ban antinthisre Plea EC25 EC25 for Band varia EC2 EC2 dup Rad and EC25 EC25 for Band varia GNATURE:

SIG JeanH Hu O Originalwritten signatureofau uthorizedsigne er Date(Month,D Day,Year) 05/20 0/2020 Projec ctManager Typed/pri intednameofa authorizedsign ner Ti itleofauthorize edsigner