FCC ID: XMR202008EG91NAXD LTE Module

 

EG91 Series Hardware Design LTE Standard Module Series Version: 1.9 Date: 2020-09-03 Status: Preliminary www.quectel.com LTE Standard Module Series EG91 Series Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm or email to support@quectel.com. GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. DISCLAIMER WHILE QUECTEL HAS MADE EFFORTS TO ENSURE THAT THE FUNCTIONS AND FEATURES UNDER DEVELOPMENT ARE FREE FROM ERRORS, IT IS POSSIBLE THAT THESE FUNCTIONS AND FEATURES COULD CONTAIN ERRORS, INACCURACIES AND OMISSIONS. UNLESS OTHERWISE PROVIDED BY VALID AGREEMENT, QUECTEL MAKES NO WARRANTIES OF ANY KIND, IMPLIED OR EXPRESS, WITH RESPECT TO THE USE OF FEATURES AND FUNCTIONS UNDER DEVELOPMENT. TO THE MAXIMUM EXTENT PERMITTED BY LAW, QUECTEL EXCLUDES ALL LIABILITY FOR ANY LOSS OR DAMAGE SUFFERED IN CONNECTION WITH THE USE OF THE FUNCTIONS AND FEATURES UNDER DEVELOPMENT, REGARDLESS OF WHETHER SUCH LOSS OR DAMAGE MAY HAVE BEEN FORESEEABLE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCING, DISSEMINATING AND EDITING THIS DOCUMENT AS WELL AS USING THE CONTENT WITHOUT PERMISSION ARE FORBIDDEN. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved. EG91_Series_Hardware_Design 1 / 106 LTE Standard Module Series EG91 Series Hardware Design About the Document Revision History Version Date Author Description 1.0 2017-03-22 Initial Felix YIN/

Yeoman CHEN/

Jackie WANG 1.1 2018-01-23 Felix YIN/

Rex WANG 1.2 2018-03-14 Felix YIN/

Rex WANG 1. Added band B28A. 2. Updated the description of UMTS and GSM features in Table 2. 3. Updated the functional diagram in Figure 1. 4. Updated module operating frequencies in Table 21. 5. Updated current consumption in Table 26. 6. Updated RF output power in Table 27. 7. Updated the conducted RF receiving sensitivity in Table 28. 8. Updated the GPRS multi-slot classes in Table 33. 9. Added thermal consideration in Chapter 5.8 10. Added a GND pad in each of the four corners of the modules footprint in Chapter 6.2. 11. Updated storage information in Chapter 7.1. 12. Added packaging information in Chapter 7.3. 1. Added the description of EG91-NA. 2. Updated the functional diagram in Figure 1. 3. Updated pin assignment in Figure 2. 4. Updated GNSS function in Table 1. 5. Updated GNSS Features in Table 2. 6. Updated reference circuit of USB interface 7. Added description of GNSS receiver in in Figure 21. Chapter 4. EG91_Series_Hardware_Design 2 / 106 LTE Standard Module Series EG91 Series Hardware Design 8. Updated pin definition of RF antenna in 9. Updated module operating frequencies in Table 21. Table 22. 10. Added description of GNSS antenna interface in Chapter 5.2. 11. Updated antenna requirements in Table 25. 12. Updated RF output power in Table 32. 1. Added new variants EG91-NS, EG91-V, EG91-EC and related contents. 2. Opened pin 24 as ADC0 and added related contents. 3. Updated functional diagram (Figure 1) 4. Updated pin assignment (Figure 2) 5. Updated GNSS features (Table 2) 6. Added USB_BOOT interface information 7. Updated storage information (Chapter 8.1) 8. Updated module operating frequencies

(Chapter 3.18)

(Table 23) 9. Updated antenna requirements (Table 26) 10. Added current consumption of EG91-NS, EG91-V and EG91-EC (Table 32, 33 and 34) 11. Added conducted RF receiving sensitivity of EG91-NS, EG91-V and EG91-EC (Table 39, 40 and 41) 1. Modified module name EG91-EC to EG91-EX, and EG91-V to EG91-VX 2. Added newly supported 9.x of Android USB serial driver (Table 2) 3. Modified the reflow temperature range as . 238C~245C (Chapter 8.2) 1. Updated comment of RF antenna (Table 4) 2. Updated EG91-EX current consumption 3. Updated EG91-EX conducted RF receiving sensitivity (Table 43) 1. Updated supported protocols (Table 2). 2. Updated timing of turning on module (Figure 12). 3. DFOTA is developed. 4. Updated description of USB_BOOT interface and timing sequence for entering emergency download mode (Chapter 3.18 1.3 2019-02-03 Ward WANG/

Nathan LIU/

Rex WANG 1.4 2019-03-29 Ward WANG 1.5 2019-05-24

(Table 36) Ward WANG/

Nathan LIU 1.6 2019-07-05 Ward WANG EG91_Series_Hardware_Design 3 / 106 LTE Standard Module Series EG91 Series Hardware Design and Figure 29). 1.7 2019-08-09 Fanny CHEN/

Rex WANG

(Table 37). 1. Added ThreadX variant EG91-NAX and updated related contents (Table 1 and 4, Chapter 2.2, 2.3, 3.2 and 5). 2. Added related notes of SPI interface not supported on ThreadX modules (Chapter 3.1, 3.3 and 3.13). 3. Added current consumption of EG91-NAX 4. Updated EG91-NA conducted RF receiving 5. Updated EG91-NS conducted RF receiving 6. Added EG91-NAX conducted RF receiving 1. Removed related information of ThreadX 2. Updated the supported USB serial drivers sensitivity (Table 41). sensitivity (Table 42). sensitivity (Table 45). OS.

(Table 2)

(Chapter 4.2). 4. Updated the AT command be used to disable the receive diversity (Chapter 5.1.3). 5. Updated the current consumption of LTE-FDD B13 (Table 42). Added EG91-AUX and related information (Table1, 38 and 47). 1.8 2019-11-07 Rex WANG 3. Updated the notes for GNSS performance 1.9 2020-08-24 Frank WANG EG91_Series_Hardware_Design 4 / 106 LTE Standard Module Series EG91 Series Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 5 Table Index ............................................................................................................................................... 7 Figure Index .............................................................................................................................................. 9 1 Introduction ..................................................................................................................................... 11 1.1. Safety Information ................................................................................................................. 14 2 Product Concept ............................................................................................................................. 15 2.1. General Description .............................................................................................................. 15 Key Features ......................................................................................................................... 16 2.2. 2.3. Functional Diagram ............................................................................................................... 19 Evaluation Board ................................................................................................................... 20 2.4. 3.6. 3 Application Interfaces ..................................................................................................................... 21 3.1. General Description .............................................................................................................. 21 Pin Assignment ..................................................................................................................... 22 3.2. 3.3. Pin Description ...................................................................................................................... 23 3.4. Operating Modes .................................................................................................................. 30 3.5. Power Saving ........................................................................................................................ 31 3.5.1. Sleep Mode.................................................................................................................. 31 3.5.1.1. UART Application ............................................................................................... 31 3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 32 3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 32 3.5.1.4. USB Application without USB Suspend Function ............................................... 33 3.5.2. Airplane Mode .............................................................................................................. 34 Power Supply ........................................................................................................................ 34 3.6.1. Power Supply Pins ....................................................................................................... 34 3.6.2. Decrease Voltage Drop ................................................................................................ 35 3.6.3. Reference Design for Power Supply ............................................................................ 36 3.6.4. Monitor the Power Supply ............................................................................................ 36 Power-on/off Scenarios ......................................................................................................... 37 3.7.1. Turn on Module Using the PWRKEY ........................................................................... 37 3.7.2. Turn off Module ............................................................................................................ 39 3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 39 3.7.2.2. Turn off Module Using AT Command ................................................................. 39 3.8. Reset the Module .................................................................................................................. 40 3.9.

(U)SIM Interfaces .................................................................................................................. 41 3.10. USB Interface ........................................................................................................................ 44 3.11. UART Interfaces ................................................................................................................... 45 3.12. PCM and I2C Interfaces ........................................................................................................ 48 3.13. SPI Interface ......................................................................................................................... 51 3.14. Network Status Indication ..................................................................................................... 52 3.7. EG91_Series_Hardware_Design 5 / 106 LTE Standard Module Series EG91 Series Hardware Design 3.15. STATUS ................................................................................................................................ 53 3.16. ADC Interface ....................................................................................................................... 53 3.17. Behaviors of RI ..................................................................................................................... 54 3.18. USB_BOOT Interface............................................................................................................ 55 4 GNSS Receiver ................................................................................................................................ 57 4.1. General Description .............................................................................................................. 57 4.2. GNSS Performance .............................................................................................................. 57 Layout Guidelines ................................................................................................................. 58 4.3. 5 Antenna Interfaces .......................................................................................................................... 59 5.1. Main/Rx-diversity Antenna Interfaces.................................................................................... 59 5.1.1. Pin Definition ................................................................................................................ 59 5.1.2. Operating Frequency ................................................................................................... 59 5.1.3. Reference Design of RF Antenna Interface ................................................................. 60 5.1.4. Reference Design of RF Layout ................................................................................... 61 5.2. GNSS Antenna Interface ....................................................................................................... 63 5.3. Antenna Installation .............................................................................................................. 64 5.3.1. Antenna Requirement .................................................................................................. 64 5.3.2. Recommended RF Connector for Antenna Installation ................................................ 65 6 Electrical, Reliability and Radio Characteristics .......................................................................... 67 Absolute Maximum Ratings .................................................................................................. 67 6.1. 6.2. Power Supply Ratings ........................................................................................................... 67 6.3. Operation and Storage Temperatures .................................................................................. 68 Current Consumption ............................................................................................................ 69 6.4. RF Output Power .................................................................................................................. 81 6.5. 6.6. RF Receiving Sensitivity ....................................................................................................... 82 Electrostatic Discharge ......................................................................................................... 87 6.7. 6.8. Thermal Consideration .......................................................................................................... 87 7 Mechanical Dimensions.................................................................................................................. 90 7.1. Mechanical Dimensions of the Module.................................................................................. 90 Recommended Footprint ....................................................................................................... 93 7.2. 7.3. Top and Bottom Views of the Module ................................................................................... 94 8 Storage, Manufacturing and Packaging ........................................................................................ 96 8.1. Storage ................................................................................................................................. 96 8.2. Manufacturing and Soldering ................................................................................................ 97 8.3. Packaging ............................................................................................................................. 98 9 Appendix A References ................................................................................................................ 101 10 Appendix B GPRS Coding Schemes ........................................................................................... 105 11 Appendix C GPRS Multi-slot Classes .......................................................................................... 106 12 Appendix D EDGE Modulation and Coding Schemes ................................................................ 108 EG91_Series_Hardware_Design 6 / 106 LTE Standard Module Series EG91 Series Hardware Design Table Index Table 1: Frequency Bands of EG91 Series Module .......................................................................................... 15 Table 2: Key Features of EG91 series Module .................................................................................................. 16 Table 3: IO Parameters Definition ...................................................................................................................... 23 Table 4: Pin Description ..................................................................................................................................... 23 Table 5: Overview of Operating Modes ............................................................................................................. 30 Table 6: Pin Definition of VBAT and GND .......................................................................................................... 35 Table 7: Pin Definition of PWRKEY ................................................................................................................... 37 Table 8: Pin Definition of RESET_N .................................................................................................................. 40 Table 9: Pin Definition of (U)SIM Interfaces ...................................................................................................... 42 Table 10: Pin Definition of USB Interface .......................................................................................................... 44 Table 11: Pin Definition of Main UART Interfaces .............................................................................................. 46 Table 12: Pin Definition of Debug UART Interface ............................................................................................ 46 Table 13: Logic Levels of Digital I/O .................................................................................................................. 46 Table 14: Pin Definition of PCM and I2C Interfaces .......................................................................................... 50 Table 15: Pin Definition of SPI Interface ............................................................................................................ 51 Table 16: Pin Definition of Network Status Indicator .......................................................................................... 52 Table 17: Working State of Network Status Indicator ........................................................................................ 52 Table 18: Pin Definition of STATUS ................................................................................................................... 53 Table 19: Pin Definition of ADC Interface .......................................................................................................... 54 Table 20: Characteristics of ADC Interface ........................................................................................................ 54 Table 21: Default Behaviors of RI ...................................................................................................................... 55 Table 22: Pin Definition of USB_BOOT Interface .............................................................................................. 55 Table 23: GNSS Performance ........................................................................................................................... 57 Table 24: Pin Definition of RF Antenna .............................................................................................................. 59 Table 25: Module Operating Frequencies ......................................................................................................... 59 Table 26: Pin Definition of GNSS Antenna Interface ......................................................................................... 63 Table 27: GNSS Frequency ............................................................................................................................... 63 Table 28: Antenna Requirements ...................................................................................................................... 64 Table 29: Absolute Maximum Ratings ............................................................................................................... 67 Table 30: Power Supply Ratings ........................................................................................................................ 67 Table 31: Operation and Storage Temperatures ................................................................................................ 68 Table 32: EG91-E Current Consumption ........................................................................................................... 69 Table 33: EG91-NA Current Consumption ........................................................................................................ 71 Table 34: EG91-NS Current Consumption ........................................................................................................ 72 Table 35: EG91-VX Current Consumption ........................................................................................................ 73 Table 36: EG91-EX Current Consumption ........................................................................................................ 74 Table 37: EG91-NAX Current Consumption ...................................................................................................... 76 Table 38: EG91-NAXD Current Consumption ................................................................................................... 77 Table 39: EG91-AUX Current Consumption ...................................................................................................... 78 Table 40: GNSS Current Consumption of EG91 ............................................................................................... 81 Table 41: RF Output Power ............................................................................................................................... 81 Table 42: EG91-E Conducted RF Receiving Sensitivity .................................................................................... 82 EG91_Series_Hardware_Design 7 / 106 LTE Standard Module Series EG91 Series Hardware Design Table 43: EG91-NA Conducted RF Receiving Sensitivity ................................................................................. 83 Table 44: EG91-NS Conducted RF Receiving Sensitivity ................................................................................. 83 Table 45: EG91-VX Conducted RF Receiving Sensitivity ................................................................................. 84 Table 46: EG91-EX Conducted RF Receiving Sensitivity ................................................................................. 84 Table 47: EG91-NAX Conducted RF Receiving Sensitivity ............................................................................... 85 Table 48: EG91-NAXD Conducted RF Receiving Sensitivity ............................................................................ 85 Table 49: EG91-AUX Conducted RF Receiving Sensitivity ............................................................................... 86 Table 50: Electrostatic Discharge Characteristics (25C, 45% Relative Humidity) ........................................... 87 Table 51: Recommended Thermal Profile Parameters ..................................................................................... 98 Table 52: Related Documents ......................................................................................................................... 101 Table 53: Terms and Abbreviations .................................................................................................................. 101 Table 54: Description of Different Coding Schemes ........................................................................................ 105 Table 55: GPRS Multi-slot Classes .................................................................................................................. 106 Table 56: EDGE Modulation and Coding Schemes ......................................................................................... 108 EG91_Series_Hardware_Design 8 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure Index Figure 1: Functional Diagram .................................................................................................................. 20 Figure 2: Pin Assignment (Top View) ....................................................................................................... 22 Figure 3: Sleep Mode Application via UART ............................................................................................ 31 Figure 4: Sleep Mode Application with USB Remote Wakeup ................................................................. 32 Figure 5: Sleep Mode Application with RI ................................................................................................ 33 Figure 6: Sleep Mode Application without Suspend Function .................................................................. 33 Figure 7: Power Supply Limits during Burst Transmission ...................................................................... 35 Figure 8: Star Structure of Power Supply ................................................................................................ 36 Figure 9: Reference Circuit of Power Supply .......................................................................................... 36 Figure 10: Turn on the Module Using Driving Circuit ............................................................................... 37 Figure 11: Turn on the Module Using Button ........................................................................................... 38 Figure 12: Timing of Turning on Module .................................................................................................. 38 Figure 13: Timing of Turning off Module .................................................................................................. 39 Figure 14: Reference Circuit of RESET_N by Using Driving Circuit ........................................................ 40 Figure 15: Reference Circuit of RESET_N by Using Button .................................................................... 41 Figure 16: Timing of Resetting Module .................................................................................................... 41 Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector ......................... 43 Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector ........................... 43 Figure 19: Reference Circuit of USB Interface ........................................................................................ 45 Figure 20: Reference Circuit with Translator Chip ................................................................................... 47 Figure 21: Reference Circuit with Transistor Circuit ................................................................................ 48 Figure 22: Primary Mode Timing ............................................................................................................. 49 Figure 23: Auxiliary Mode Timing ............................................................................................................ 49 Figure 24: Reference Circuit of PCM Application with Audio Codec ........................................................ 50 Figure 25: Reference Circuit of SPI Interface with Peripherals ............................................................... 51 Figure 26: Reference Circuit of Network Status Indicator ........................................................................ 52 Figure 27: Reference Circuit of STATUS ................................................................................................. 53 Figure 28: Reference Circuit of USB_BOOT Interface ............................................................................ 55 Figure 29: Timing Sequence for Entering Emergency Download Mode .................................................. 56 Figure 30: Reference Circuit of RF Antenna Interface ............................................................................. 61 Figure 31: Microstrip Design on a 2-layer PCB ....................................................................................... 61 Figure 32: Coplanar Waveguide Design on a 2-layer PCB ...................................................................... 62 Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ................... 62 Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ................... 62 Figure 35: Reference Circuit of GNSS Antenna ...................................................................................... 64 Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm) .......................................................... 65 Figure 37: Mechanicals of U.FL-LP Connectors ...................................................................................... 66 Figure 38: Space Factor of Mated Connector (Unit: mm) ........................................................................ 66 Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module) ......................................... 88 Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers PCB) ........................ 88 Figure 41: Module Top and Side Dimensions .......................................................................................... 90 EG91_Series_Hardware_Design 9 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure 42: Module Bottom Dimensions (Top View) .................................................................................. 91 Figure 43: Recommended Footprint (Top View) ...................................................................................... 93 Figure 44: Top View of the Module .......................................................................................................... 94 Figure 45: Bottom View of the Module .................................................................................................... 95 Figure 46: Recommended Reflow Soldering Thermal Profile .................................................................. 97 Figure 47: Tape Dimensions .................................................................................................................... 99 Figure 48: Reel Dimensions .................................................................................................................... 99 Figure 49: Tape and Reel Directions ..................................................................................................... 100 EG91_Series_Hardware_Design 10 / 106 LTE Standard Module Series EG91 Series Hardware Design 1 Introduction This document defines the EG91 series module and describes its air interface and hardware interface which are connected with customers applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EG91 series module. Associated with application note and user guide, customers can use EG91 series module to design and set up mobile applications easily. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a 1.1. FCC Certification Requirements. mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202008EG91NAXD. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

EG91_Series_Hardware_Design 11 / 106 LTE Standard Module Series EG91 Series Hardware Design WCDMA II :8.000dBi WCDMA IV :5.000dBi WCDMA V :9.416dBi LTE Band 2 :8.000dBi LTE Band 4:5.000dBi LTE Band 5 :9.416dBi LTE Band 12 :8.734dBi LTE Band 13:9.173dBi LTE Band 25:8.000dBi LTE Band 26:9.416dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 configurations. If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward EG91_Series_Hardware_Design 12 / 106 LTE Standard Module Series EG91 Series Hardware Design commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR202008EG91NAXD or Contains FCC ID: XMR202008EG91NAXD must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. EG91_Series_Hardware_Design 13 / 106 LTE Standard Module Series EG91 Series Hardware Design 1.2. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EG91 series module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. EG91_Series_Hardware_Design 14 / 106 LTE Standard Module Series EG91 Series Hardware Design 2 Product Concept 2.1. General Description EG91 series module is an embedded 4G wireless communication module with receive diversity. It supports LTE-FDD/WCDMA/GSM wireless communication, and provides data connectivity on LTE-FDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It can also provide voice functionality 1) to meet customers specific application demands. EG91 series contain 8 variants: EG91-E, EG91-NA, EG91-NS, EG91-VX, EG91-EX, EG91-NAX, EG91-NAXD and EG91-AUX. The following table shows the frequency bands of EG91 series module. Table 1: Frequency Bands of EG91 Series Module Module EG91-E LTE Bands

(with Rx-diversity) WCDMA

(with Rx-diversity) GSM GNSS 2) FDD:

B1/B3/B7/B8/B20/B28A B1/B8 900/1800MHz Not supported EG91-NA FDD:

B2/B4/B5/B12/B13 B2/B4/B5 Not supported EG91-NS B2/B4/B5 Not supported FDD:

B2/B4/B5/B12/B13/B25/

B26 EG91-VX FDD: B4/B13 Not supported Not supported EG91-EX FDD:

B1/B3/B7/B8/B20/B28 B1/B8 900/1800MHz EG91-NAX B2/B4/B5 Not supported FDD:

B2/B4/B5/B12/B13/B25/

B26 FDD:

B2/B4/B5/B12/B13/B25/

B26 EG91-NAXD B2/B4/B5 Not supported GPS, GLONASS, BeiDou/Compass, Galileo, QZSS GPS, GLONASS, BeiDou/Compass, Galileo, QZSS GPS, GLONASS, BeiDou/Compass, Galileo, QZSS GPS, GLONASS, BeiDou/Compass, Galileo, QZSS GPS, GLONASS, BeiDou/Compass, Galileo, QZSS GPS, GLONASS, BeiDou/Compass, Galileo, QZSS EG91_Series_Hardware_Design 15 / 106 LTE Standard Module Series EG91 Series Hardware Design EG91-AUX3) B1/B2/B5/B8 FDD:

B1/B2/B3/B4/B5/B7/B8 B28/B66 850/900/1800/

1900 GPS, GLONASS, BeiDou/Compass, Galileo, QZSS NOTES 1. 2. 3. 1) EG91 contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. 2) GNSS function is optional. 3) EG91-AUX does not support LTE and WCDMA Rx-diversity. With a compact profile of 29.0mm 25.0mm 2.3mm, EG91 series module can meet almost all requirements for M2M applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EG91 series module is an SMD type module which can be embedded into applications through its 106 LGA pads. EG91 series module is integrated with internet service protocols like TCP, UDP and PPP. Extended AT commands have been developed for customers to use these internet service protocols easily. 2.2. Key Features The following table describes the detailed features of EG91 series module. Table 2: Key Features of EG91 series Module Feature Details Power Supply Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V Transmitting Power Class 4 (33dBm2dB) for GSM850 Class 4 (33dBm2dB) for EGSM900 Class 1 (30dBm2dB) for DCS1800 Class 1 (30dBm2dB) for PCS1900 Class E2 (27dBm3dB) for GSM850 8-PSK Class E2 (27dBm3dB) for EGSM900 8-PSK Class E2 (26dBm3dB) for DCS1800 8-PSK Class E2 (26dBm3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm2dB) for LTE-FDD bands EG91_Series_Hardware_Design 16 / 106 LTE Standard Module Series EG91 Series Hardware Design LTE Features UMTS Features GSM Features SMS Audio Features PCM Interface Support up to non-CA Cat 1 FDD Support 1.4/3/5/10/15/20MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max 10Mbps (DL), Max 5Mbps (UL) Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL), Max 384Kbps (UL) R99:

CSD: 9.6kbps GPRS:

Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL), Max 85.6Kbps (UL) EDGE:

Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: MCS 1-9 Uplink coding schemes: MCS 1-9 Max 296Kbps (DL)/Max 236.8Kbps (UL) Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/NITZ/

MMS/SMTP/SSL/MQTT/FILE/CMUX*/SMTPS* protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connections Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave mode, but must be the master in long frame synchronization Internet Protocol Features Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default

(U)SIM Interfaces Support 1.8V and 3.0V (U)SIM cards EG91_Series_Hardware_Design 17 / 106 LTE Standard Module Series EG91 Series Hardware Design Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6~5.4, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc. Main UART:

Used for AT command communication and data transmission Baud rates reach up to 921600bps, 115200bps by default Support RTS and CTS hardware flow control Debug UART:

Used for Linux console and log output 115200bps baud rate Provides a duplex, synchronous and serial communication link with the peripheral devices. Dedicated to one-to-one connection, without chip selection. 1.8V operation voltage with clock rates up to 50MHz. Rx-diversity Support LTE/WCDMA Rx-diversity Gen8C Lite of Qualcomm Protocol: NMEA 0183 Data update rate: 1Hz by default Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Network Indication NETLIGHT pin for network activity status indication Antenna Interfaces Including main antenna interface (ANT_MAIN), Rx-diversity antenna

(ANT_DIV) interface and GNSS antenna interface (ANT_GNSS) 1) Physical Characteristics Temperature Range Size: (29.00.15)mm (25.00.15)mm (2.30.2)mm Package: LGA Weight: approx. 3.8g Operation temperature range: -35C ~ +75C 2) Extended temperature range: -40C ~ +85C 3) Storage temperature range: -40C ~ +90C Firmware Upgrade USB interface or DFOTA All hardware components are fully compliant with EU RoHS directive USB Interface UART Interface SPI Interface GNSS Features AT Commands RoHS NOTES 1. 2. 1) GNSS antenna interface is only supported on EG91-NA/-NS/-VX/-EX/-NAX/-NAXD/-AUX. 2) Within operation temperature range, the module is 3GPP compliant. EG91_Series_Hardware_Design 18 / 106 LTE Standard Module Series EG91 Series Hardware Design 3) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call*, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again.

* means under development. 3. 4. 2.3. Functional Diagram The following figure shows a block diagram of EG91 series module and illustrates the major functional parts. Power management Baseband DDR+NAND flash Radio frequency Peripheral interfaces VBAT_RF VBAT_BB PWRKEY RESET_N STATUS ANT_MAIN ANT_GNSS 1) ANT_DIV PAM SAW Switch Duplexer LNA PA Tx PRx SAW GPS Transceiver SAW DRx IQ Control NAND DDR2 SDRAM PMIC Control 19.2M XO Baseband VDD_EXT USB

(U)SIM1

(U)SIM2 PCM I2C SPI UART GPIOs EG91_Series_Hardware_Design 19 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure 1: Functional Diagram NOTE 1) GNSS antenna interface is only supported on EG91-NA/-NS/-VX/-EX/-NAX/-NAXD/-AUX. 2.4. Evaluation Board Quectel provides a complete set of evaluation tools to facilitate the use and testing of EG91 series module. The evaluation tool kit includes the evaluation board (UMTS&LTE EVB), USB data cable, earphone, antenna and other peripherals. For more details, please refer to document [7]. EG91_Series_Hardware_Design 20 / 106 LTE Standard Module Series EG91 Series Hardware Design 3 Application Interfaces 3.1. General Description

(U)SIM interfaces EG91 series module is equipped with 62-pin 1.1mm pitch SMT pads and 44-pin ground/reserved pads that can be connected to customers cellular application platforms. Sub-interfaces included in these pads are described in detail in the following chapters:

Power supply USB interface UART interfaces PCM and I2C interfaces SPI interface Status indication USB_BOOT interface EG91_Series_Hardware_Design 21 / 106 LTE Standard Module Series EG91 Series Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EG91 series module. Figure 2: Pin Assignment (Top View) EG91_Series_Hardware_Design 22 / 106 LTE Standard Module Series EG91 Series Hardware Design 1) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. 1. 2. Keep all RESERVED pins and unused pins unconnected. 3. GND pads should be connected to ground in the design. 4. Please definition note that the pin of 49 and 56 are different among EG91-NA/-NS/-VX/-EX/-NAX/-NAXD/-AUX and EG91-E. For more details, please refer to Table 4. 3.3. Pin Description The following tables show the pin definition and description of EG91 series module. Table 3: IO Parameters Definition NOTES Type AI AO DI DO IO OD PI PO Description Analog Input Analog Output Digital Input Digital Output Bidirectional Open Drain Power Input Power Output Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 32, 33 PI Power supply for modules baseband part Vmax=4.3V Vmin=3.3V Vnorm=3.8V It must be provided with sufficient current up to 0.8A. EG91_Series_Hardware_Design 23 / 106 LTE Standard Module Series EG91 Series Hardware Design VBAT_RF 52, 53 PI Power supply for modules RF part Vmax=4.3V Vmin=3.3V Vnorm=3.8V VDD_EXT 29 PO Provide 1.8V for external circuit Vnorm=1.8V IOmax=50mA It must be provided with sufficient current up to 1.8A in a burst transmission. Power supply for external GPIOs pull up circuits. If unused, keep it open. GND Ground 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67~74, 79~82, 89~91, 100~106 Power-on/off The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. Require pull-up resistor to 1.8V internally. Active low. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 15 DI Turn on/off the module VH=0.8V RESET_N 17 DI Reset signal of the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V Status Indication STATUS 20 DO NETLIGHT 21 DO USB Interface Pin Name Pin No. I/O Description DC Characteristics Comment Indicate the modules operation status Indicate the modules network activity status VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 8 PI USB connection detection Vmax=5.25V Vmin=3.0V Typical: 5.0V If unused, keep it EG91_Series_Hardware_Design 24 / 106 LTE Standard Module Series EG91 Series Hardware Design Vnorm=5.0V open. USB_DP 9 USB 2.0 compliant IO IO USB differential data bus (+) USB differential data bus (-) USB 2.0 compliant Require differential impedance of 90. Require differential impedance of 90. USB_DM 10

(U)SIM Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment USIM_GND 47 Specified ground for (U)SIM card Connect to ground of

(U)SIM card connector. Either 1.8V or 3.0V is supported by the module automatically. USIM1_VDD 43 PO Power supply for

(U)SIM card USIM1_DATA 45 IO Data signal of

(U)SIM card USIM1_CLK 46 DO Clock signal of

(U)SIM card IOmax=50mA For 1.8V (U)SIM:

Vmax=1.9V Vmin=1.7V For 3.0V (U)SIM:

Vmax=3.05V Vmin=2.7V For 1.8V (U)SIM:

VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:

VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VOLmax=0.45V VOHmin=2.55V EG91_Series_Hardware_Design 25 / 106 LTE Standard Module Series EG91 Series Hardware Design 1.8V power domain. If unused, keep it open. Either 1.8V or 3.0V is supported by the module automatically. USIM1_RST 44 DO Reset signal of

(U)SIM card USIM1_ PRESENCE 42 DI

(U)SIM card insertion detection USIM2_VDD 87 PO Power supply for

(U)SIM card USIM2_DATA 86 IO Data signal of

(U)SIM card USIM2_CLK 84 DO Clock signal of

(U)SIM card USIM2_RST 85 DO Reset signal of

(U)SIM card For 1.8V (U)SIM:

VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VOLmax=0.45V VOHmin=2.55V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V For 1.8V (U)SIM:

Vmax=1.9V Vmin=1.7V For 3.0V (U)SIM:

Vmax=3.05V Vmin=2.7V IOmax=50mA For 1.8V (U)SIM:

VILmax=0.6V VIHmin=1.2V VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VILmax=1.0V VIHmin=1.95V VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:

VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VOLmax=0.45V VOHmin=2.55V For 1.8V (U)SIM:

VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM:

VOLmax=0.45V VOHmin=2.55V EG91_Series_Hardware_Design 26 / 106 LTE Standard Module Series EG91 Series Hardware Design USIM2_ PRESENCE 83 DI

(U)SIM card insertion detection Main UART Interface VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment RI 39 DO Ring indicator VOLmax=0.45V VOHmin=1.35V DCD 38 DO Data carrier detection VOLmax=0.45V VOHmin=1.35V CTS 36 DO Clear to send RTS 37 DI Request to send DTR 30 DI Data terminal ready. Sleep mode control. VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V TXD 35 DO Transmit data RXD 34 DI Receive data Debug UART Interface 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. Require pull-up resistor by default. Low level wakes up the module. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD 23 DO Transmit data DBG_RXD 22 DI Receive data VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it EG91_Series_Hardware_Design 27 / 106 LTE Standard Module Series EG91 Series Hardware Design PCM Interface Pin Name Pin No. I/O Description DC Characteristics Comment VIHmin=1.2V VIHmax=2.0V open. PCM_DIN 6 DI PCM data input PCM_ DOUT 7 DO PCM data output PCM_SYNC 5 IO PCM data frame synchronization signal PCM_CLK 4 IO PCM clock VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SCL 40 OD I2C_SDA 41 OD ADC Interface I2C serial clock. Used for external codec I2C serial data. Used for external codec Pin Name Pin No. I/O Description DC Characteristics Comment EG91_Series_Hardware_Design 28 / 106 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. An external pull-up resistor is required. 1.8V only. If unused, keep it open. An external pull-up resistor is required. 1.8V only. If unused, keep it open. LTE Standard Module Series EG91 Series Hardware Design General-purpose analog to digital converter Voltage range:

0.3V to VBAT_BB If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment Clock signal of SPI interface VOLmax=0.45V VOHmin=1.35V Master output slave input of SPI interface VOLmax=0.45V VOHmin=1.35V Master input slave output of SPI interface VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. 1.8V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment ANT_GNSS AI GNSS antenna pad ADC0 24 AI SPI Interface SPI_CLK 26 DO SPI_MOSI 27 DO SPI_MISO 28 DI RF Interfaces 49

(EG91-

NA/-NS/

-VX/-EX/

-NAX/-N AXD/

-AUX) 49

(EG91-E) 56

(EG91-

NA/-NS/

-VX/-EX/

-NAX/-N AXD) 50 impedance. If unused, keep it open. The pin is defined as ANT_DIV on EG91-E. 50 impedance. If unused, keep it open. Pin 56 is reserved on EG91-E. ANT_DIV AI Receive diversity antenna pad ANT_MAIN 60 IO Main antenna pad 50 impedance. Other Pins Pin Name Pin No. I/O Description DC Characteristics Comment AP_READY 19 DI Application VILmin=-0.3V 1.8V power domain. EG91_Series_Hardware_Design 29 / 106 LTE Standard Module Series EG91 Series Hardware Design Pin Name Pin No. I/O Description DC Characteristics Comment processor sleep state detection Force the module to enter emergency download mode VILmax=0.6V VIHmin=1.2V VIHmax=2.0V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V USB_BOOT 75 DI RESERVED Pins NC NC 1,2, 11~14, 16, 51, 57, 63~66, 76~78, 88, 92~99 RESERVED 18, 25, 56 Reserved NOTE Keep all RESERVED pins and unused pins unconnected. If unused, keep it open. 1.8V power domain. It is recommended to reserve the test points. Keep these pins unconnected. Keep these pins unconnected. Pin 56 is only reserved on EG91-E. 3.4. Operating Modes The table below briefly outlines the operating modes to be mentioned in the following chapters. Table 5: Overview of Operating Modes Mode Details Normal Operation Minimum Functionality Mode Idle Talk/Data Software is active. The module has registered on network, and it is ready to send and receive data. Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. EG91_Series_Hardware_Design 30 / 106 LTE Standard Module Series EG91 Series Hardware Design Airplane Mode AT+CFUN command or W_DISABLE# pin can set the module to enter airplane mode. In this case, RF function will be invalid. In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. In this mode, the power management unit shuts down the power supply. Software is goes inactive. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. Sleep Mode Power Down Mode 3.5. Power Saving 3.5.1. Sleep Mode 3.5.1.1. UART Application EG91 series module is able to reduce its current consumption to a minimum value during the sleep mode. The following sub-chapters describe the power saving procedures of EG91 series module. If the host communicates with the module via UART interface, the following preconditions can let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Drive DTR to high level. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module. When EG91 series module has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.17 for details about RI behavior. EG91_Series_Hardware_Design 31 / 106 LTE Standard Module Series EG91 Series Hardware Design AP_READY will detect the sleep state of host (can be configured to high level or low level detection). Please refer to AT+QCFG="apready" for details. 3.5.1.2. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application with USB Remote Wakeup Sending data to EG91 series module through USB will wake up the module. When EG91 series module has a URC to report, the module will send remote wakeup signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wakeup function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters suspended state. The following figure shows the connection between the module and the host. EG91_Series_Hardware_Design 32 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure 5: Sleep Mode Application with RI Sending data to EG91 series module through USB will wake up the module. When module has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected with an external control circuit to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. Disconnect USB_VBUS. The following figure shows the connection between the module and the host. Figure 6: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. EG91_Series_Hardware_Design 33 / 106 LTE Standard Module Series EG91 Series Hardware Design NOTE Hardware:

Software:

4. NOTES Please pay attention to the level match shown in dotted line between the module and the host. Please refer to document [1] for more details about EG91 series module power management application. 3.5.2. Airplane Mode When the module enters airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. This mode can be set via the following ways. The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. AT+CFUN=<fun> command provides the choice of the functionality level through setting <fun> as 0, 1 or AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled. AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode. RF function is disabled. 1. Airplane mode control via W_DISABLE# is disabled in firmware by default. It can be enabled by AT+QCFG="airplanecontrol" command and this command is under development. 2. The execution of AT+CFUN command will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EG91 series module provides four VBAT pins for connection with an external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for modules RF part. Two VBAT_BB pins for modules baseband part. The following table shows the details of VBAT pins and ground pins. EG91_Series_Hardware_Design 34 / 106 LTE Standard Module Series EG91 Series Hardware Design Table 6: Pin Definition of VBAT and GND Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 52, 53 3.3 3.8 4.3 VBAT_BB 32, 33 3.3 3.8 4.3 Power supply for modules RF part. Power supply for modules baseband part. V V GND Ground

0

V 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67~74, 79~82, 89~91, 100~106 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100F with low ESR (ESR=0.7) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm, and the width of VBAT_RF trace should be no less than 2mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to avoid the damage caused by electric surge and ESD, it is suggested that a TVS diode with low reverse stand-off voltage VRWM, low clamping voltage VC and high reverse peak pulse current IPP should be used. The following figure shows the star structure of the power supply. EG91_Series_Hardware_Design 35 / 106

LTE Standard Module Series EG91 Series Hardware Design VBAT

D1 C1 WS4.5D3HV 100uF C2 C3 C4 C5 C6 C7 C8 100nF 33pF 10pF 100uF 100nF 33pF 10pF Figure 8: Star Structure of Power Supply VBAT_RF VBAT_BB Module 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5V input power source. The typical output of the power supply is about 3.8V and the maximum load current is 3A. Figure 9: Reference Circuit of Power Supply 3.6.4. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. EG91_Series_Hardware_Design 36 / 106 LTE Standard Module Series EG91 Series Hardware Design 3.7. Power-on/off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name Pin No. Description DC Characteristics Comment PWRKEY 15 Turn on/off the module VOH=0.8V The output voltage is 0.8V because of the diode drop in the Qualcomm chipset. When EG91 series module is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms. It is recommended to use an open drain/collector driver to control the PWRKEY. After STATUS pin outputting a high level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. Figure 10: Turn on the Module Using Driving Circuit Another way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from the finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. EG91_Series_Hardware_Design 37 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure 11: Turn on the Module Using Button The power-on scenario is illustrated in the following figure. NOTE 1 BOOT_CONFIG &

USB_BOOT Pins VBAT PWRKEY VDD_EXT RESET_N STATUS

(DO) UART USB 500ms VH =0.8V VIL0.5V About 100ms 100ms. After this time, the BOOT_CONFIG pins can be set to high level by external circuit. 10s 12s 13s I nactive I nactive Active Active Figure 12: Timing of Turning on Module EG91_Series_Hardware_Design 38 / 106 LTE Standard Module Series EG91 Series Hardware Design NOTES no less than 30ms. 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is 2. PWRKEY can be pulled down directly to GND with a recommended 10K resistor if module needs to be powered on automatically and shutdown is not needed. 3.7.2. Turn off Module Either of the following methods can be used to turn off the module:

Use the PWRKEY pin. Use AT+QPOWD command. 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-off procedure after the PWRKEY is released. The power-off scenario is illustrated in the following figure. Figure 13: Timing of Turning off Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer to document [2] for details about the AT+QPOWD command. EG91_Series_Hardware_Design 39 / 106 LTE Standard Module Series EG91 Series Hardware Design NOTES 1. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off. 2. When turning off module with the AT command, please keep PWRKEY at high level after the execution of the command. Otherwise, the module will be turned on again after being shut down. 3.8. Reset the Module The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N to a low level voltage for 150ms~460ms. Table 8: Pin Definition of RESET_N Pin Name Pin No. Description DC Characteristics Comment RESET_N 17 Reset the module VIHmax=2.1V VIHmin=1.3V VILmax=0.5V The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 14: Reference Circuit of RESET_N by Using Driving Circuit EG91_Series_Hardware_Design 40 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure. Figure 16: Timing of Resetting Module NOTES 1. Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin failed. 2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interfaces EG91 series module provides two (U)SIM interfaces, and only one (U)SIM card can work at a time. The

(U)SIM1 and (U)SIM2 cards can be switched by AT+QDSIM command. For more details, please refer to document [2]. The (U)SIM interfaces circuitry meet ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. EG91_Series_Hardware_Design 41 / 106 LTE Standard Module Series EG91 Series Hardware Design Table 9: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment Either 1.8V or 3.0V is supported by the module automatically. Either 1.8V or 3.0V is supported by the module automatically. USIM1_VDD 43 PO Power supply for (U)SIM1 card USIM1_DATA IO Data signal of (U)SIM1 card USIM1_CLK DO Clock signal of (U)SIM1 card USIM1_RST USIM1_ PRESENCE USIM_GND DO Reset signal of (U)SIM1 card DI

(U)SIM1 card insertion detection Specified ground for (U)SIM card USIM2_VDD 87 PO Power supply for (U)SIM2 card USIM2_DATA IO Data signal of (U)SIM2 card USIM2_CLK DO Clock signal of (U)SIM2 card USIM2_RST USIM2_ PRESENCE DO Reset signal of (U)SIM2 card DI

(U)SIM2 card insertion detection 45 46 44 42 47 86 84 85 83 EG91 series module supports (U)SIM card hot-plug via USIM_PRESENCE (USIM1_PRESENCE/USIM2 _PRESENCE) pin. The function supports low level and high level detection. By default, it is disabled by default, and can be configured via AT+QSIMDET command. Please refer to document [2] about the command. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. EG91_Series_Hardware_Design 42 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit of (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM cards in customers applications, please follow the criteria below in the (U)SIM circuit design:

Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. EG91_Series_Hardware_Design 43 / 106 LTE Standard Module Series EG91 Series Hardware Design Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as close to (U)SIM card connector as possible. If the ground is complete on customers PCB, USIM_GND can be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should not be more than 15pF. The 0 resistors should be added in series between the module and the (U)SIM card to facilitate debugging. The 33pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the

(U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 3.10. USB Interface EG91 series module contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface acts as slave only, and is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface. Table 10: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_DP USB_DM USB_VBUS GND 9 10 8 3 IO IO PI USB differential data bus (+) USB differential data bus (-) Require differential impedance of 90. Require differential impedance of 90. USB connection detection Typical: 5.0V Ground For more details about USB 2.0 specifications, please visit http://www.usb.org/home. The USB interface is recommended to be reserved for firmware upgrade in customers design. The following figure shows a reference circuit of USB interface. EG91_Series_Hardware_Design 44 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure 19: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. Pay attention to the influence of junction capacitance of ESD protection components on USB data lines. Typically, the capacitance value should be less than 2pF. Junction capacitance of the ESD protection device might cause influences on USB data line, so please pay attention to the selection of the device. Typically, the stray capacitance should be less than 2pF. Keep the ESD protection components to the USB connector as close as possible. 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. EG91_Series_Hardware_Design 45 / 106 LTE Standard Module Series EG91 Series Hardware Design The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps, 921600bps and 3000000bps baud rates, and the default is 115200bps. It supports RTS and CTS hardware flow control, and is used for AT command communication only. The debug UART interface supports 115200bps baud rate. It is used for Linux console and log output. The following tables show the pin definition of the two UART interfaces. Table 11: Pin Definition of Main UART Interfaces Pin Name Pin No. I/O Description Comment RI DCD CTS RTS DTR TXD RXD 39 38 36 37 30 35 34 Ring indicator Data carrier detection Clear to send Sleep mode control Transmit data Receive data Request to send 1.8V power domain Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_TXD DBG_RXD 23 22 Transmit data 1.8V power domain Receive data 1.8V power domain The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O Parameter VIL VIH Max. 0.6 2.0 Unit V V DO DO DO DI DI DO DI DO DI Min.

-0.3 1.2 EG91_Series_Hardware_Design 46 / 106 LTE Standard Module Series EG91 Series Hardware Design VOL VOH 0 1.35 0.45 1.8 V V The module provides 1.8V UART interfaces. A level translator should be used if customers application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. Figure 20: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. The circuit design of dotted line section can refer to the circuit design of solid line section, in terms of both module input and output circuit design. Please pay attention to the direction of connection. EG91_Series_Hardware_Design 47 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure 21: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12. PCM and I2C Interfaces EG91 series module provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface:

Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK at 8KHz PCM_SYNC, and also supports 4096KHz PCM_CLK at 16KHz PCM_SYNC. In auxiliary mode, the data is also sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256KHz, 512KHz, 1024KHz or 2048KHz PCM_CLK and an 8KHz, 50% duty cycle PCM_SYNC. EG91 series module supports 16-bit linear data format. The following figures show the primary modes timing relationship with 8KHz PCM_SYNC and 2048KHz PCM_CLK, as well as the auxiliary modes timing relationship with 8KHz PCM_SYNC and 256KHz PCM_CLK. EG91_Series_Hardware_Design 48 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure 22: Primary Mode Timing Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. EG91_Series_Hardware_Design 49 / 106 LTE Standard Module Series EG91 Series Hardware Design Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_DIN DI PCM data input 1.8V power domain PCM_DOUT DO PCM data output 1.8V power domain 6 7 5 4 40 41 PCM_SYNC PCM_CLK I2C_SCL I2C_SDA IO IO OD OD PCM data frame synchronization signal 1.8V power domain PCM data bit clock 1.8V power domain I2C serial clock Require an external pull-up to 1.8V I2C serial data Require an external pull-up to 1.8V Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048KHz PCM_CLK and 8KHz PCM_SYNC. Please refer to document [2] about AT+QDAI command for details. The following figure shows a reference design of PCM interface with external codec IC. Figure 24: Reference Circuit of PCM Application with Audio Codec NOTES 1. It is recommended to reserve an RC (R=22, C=22pF) circuit on the PCM lines, especially for 2. EG91 series module works as a master device pertaining to I2C interface. PCM_CLK. EG91_Series_Hardware_Design 50 / 106 LTE Standard Module Series EG91 Series Hardware Design 3.13. SPI Interface SPI interface of EG91 series module acts as the master only. It provides a duplex, synchronous and serial communication link with the peripheral devices. It is dedicated to one-to-one connection, without chip selection. Its operation voltage is 1.8V with clock rates up to 50MHz. The following table shows the pin definition of SPI interface. Table 15: Pin Definition of SPI Interface Pin Name Pin No. I/O Description Comment SPI_CLK 26 DO Clock signal of SPI interface 1.8V power domain SPI_MOSI 27 DO 1.8V power domain Master output slave input of SPI interface Master input slave output of SPI interface SPI_MISO 28 DI 1.8V power domain The following figure shows a reference design of SPI interface with peripherals. Figure 25: Reference Circuit of SPI Interface with Peripherals The module provides 1.8V SPI interface. A level translator should be used between the module and the host if customers application is equipped with a 3.3V processor or device interface. NOTE EG91_Series_Hardware_Design 51 / 106 LTE Standard Module Series EG91 Series Hardware Design 3.14. Network Status Indication The module provides one network indication pin: NETLIGHT. The pin is used to drive a network status indication LED. The following tables describe the pin definition and logic level changes of NETLIGHT in different network status. Table 16: Pin Definition of Network Status Indicator Pin Name Pin No. I/O Description Comment NETLIGHT 21 DO Indicate the modules network activity status 1.8V power domain Table 17: Working State of Network Status Indicator Pin Name Logic Level Changes Network Status Flicker slowly (200ms High/1800ms Low) Network searching NETLIGHT Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure. Figure 26: Reference Circuit of Network Status Indicator EG91_Series_Hardware_Design 52 / 106 LTE Standard Module Series EG91 Series Hardware Design 3.15. STATUS The STATUS pin is set as the modules operation status indicator. It will output high level when the module is powered on. The following table describes the pin definition of STATUS. Table 18: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 20 DO Indicate the modules operation status 1.8V power domain. If unused, keep it open. The following figure shows the reference circuit of STATUS. Figure 27: Reference Circuit of STATUS 3.16. ADC Interface The module provides one analog-to-digital converter (ADC) interface. AT+QADC=0 command can be used to read the voltage value on ADC0 pin. For more details about the command, please refer to document [2]. In order to improve the accuracy of ADC voltage values, the traces of ADC should be surrounded by ground. EG91_Series_Hardware_Design 53 / 106 LTE Standard Module Series EG91 Series Hardware Design Table 19: Pin Definition of ADC Interface Pin Name Pin No. I/O Description Comment ADC0 24 AI General-purpose analog to digital converter If unused, keep this pin open. The following table describes the characteristics of ADC interface. Table 20: Characteristics of ADC Interface Parameter Min. Typ. Max. ADC0 Voltage Range 0.3 ADC Resolution VBAT_BB 15 Unit V bits NOTES NOTE 1. 2. It is prohibited to supply any voltage to ADC pins when ADC pins are not powered by VBAT. It is recommended to use resistor divider circuit for ADC application. 3.17. Behaviors of RI AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. The default RI behaviors can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2] for details. No matter on which port URC is presented, URC will trigger the behavior of RI pin. URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. The default behaviors of the RI are shown as below. EG91_Series_Hardware_Design 54 / 106 LTE Standard Module Series EG91 Series Hardware Design Table 21: Default Behaviors of RI Response RI keeps at high level State Idle URC 3.18. USB_BOOT Interface RI outputs 120ms low pulse when a new URC returns EG91 series module provides a USB_BOOT pin. Customers can pull up USB_BOOT to 1.8V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface. Table 22: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 75 DI Force the module to enter emergency download mode 1.8V power domain. Active high. It is recommended to reserve test point. The following figures show the reference circuit of USB_BOOT interface and timing sequence of entering emergency download mode. Module USB_BOOT Test point 4.7K Close to test point TVS VDD_EXT Figure 28: Reference Circuit of USB_BOOT Interface EG91_Series_Hardware_Design 55 / 106 LTE Standard Module Series EG91 Series Hardware Design NOTE 1 VBAT 500ms VH=0.8V VIL0.5V About 100ms USB_BOOT can be pul led up to 1.8V before VDD_EXT Is powered up, and the module will enter emerge ncy download mode wh en i t is powered on. PWRKEY VDD_EXT USB_BOOT RESET_N Figure 29: Timing Sequence for Entering Emergency Download Mode NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30ms. 2. When using MCU to control module to enter the emergency download mode, please follow the above timing sequence. It is not recommended to pull up USB_BOOT to 1.8V before powering up VBAT. Short the test points as shown in Figure 28 can manually force the module to enter download mode. EG91_Series_Hardware_Design 56 / 106 LTE Standard Module Series EG91 Series Hardware Design 4 GNSS Receiver 4.1. General Description EG91 series module includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EG91 series module supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EG91 series module GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows GNSS performance of EG91 series module. Table 23: GNSS Performance Parameter Description Conditions Sensitivity

(GNSS) TTFF

(GNSS) Cold start Autonomous Reacquisition Autonomous Tracking Autonomous Cold start

@open sky Warm start

@open sky Autonomous XTRA enabled Autonomous XTRA enabled Typ.

-146

-157

-157 34.6 11.57 26.09 3.7 Unit dBm dBm dBm s s s s EG91_Series_Hardware_Design 57 / 106 LTE Standard Module Series EG91 Series Hardware Design Hot start

@open sky CEP-50 Autonomous XTRA enabled Autonomous

@open sky 1.8 3.4

<2.5 s s m Accuracy

(GNSS) NOTES 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock. 3. Cold start sensitivity: the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command. 4.3. Layout Guidelines The following layout guidelines should be taken into account in customers design. Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna. Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar kept away from the antennas. isolation and protection. Keep the characteristic impedance for ANT_GNSS trace as 50. Please refer to Chapter 5 for GNSS antenna reference design and antenna installation information. EG91_Series_Hardware_Design 58 / 106 LTE Standard Module Series EG91 Series Hardware Design 5 Antenna Interfaces EG91 series module antenna interfaces include a main antenna interface and an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface which is only supported on EG91-NA/-NS/-VX/-EX/-NAX/-NAXD/-AUX. The impedance of the antenna port is 50. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 24: Pin Definition of RF Antenna Pin Name Pin No. I/O Description Comment ANT_MAIN ANT_DIV

(EG91-E) ANT_DIV

(EG91-NA/-NS/-VX/

-EX/-NAX/-NAXD) 60 49 IO AI Main antenna pad 50 impedance Receive diversity antenna pad 50 impedance 56 AI Receive diversity antenna pad 50 impedance 5.1.2. Operating Frequency Table 25: Module Operating Frequencies 3GPP Band Transmit GSM850 EGSM900 DCS1800 824~849 880~915 Receive 869~894 925~960 Unit MHz MHz MHz 1710~1785 1805~1880 EG91_Series_Hardware_Design 59 / 106 LTE Standard Module Series EG91 Series Hardware Design PCS1900 1850~1910 1930~1990 WCDMA B1 1920~1980 2110~2170 WCDMA B2 1850~1910 1930~1990 WCDMA B4 1710~1755 2110~2155 WCDMA B5 WCDMA B8 824~849 880~915 869~894 925~960 LTE-FDD B1 1920~1980 2110~2170 LTE FDD B2 1850~1910 1930~1990 LTE-FDD B3 1710~1785 1805~1880 LTE FDD B4 1710~1755 2110~2155 LTE FDD B5 824~849 869~894 LTE-FDD B7 2500~2570 2620~2690 880~915 699~716 777~787 832~862 814~849 703~748 925~960 729~746 746~756 791~821 859~894 758~803 LTE-FDD B25 1850~1915 1930~1995 LTE-FDD B8 LTE FDD B12 LTE FDD B13 LTE-FDD B20 LTE-FDD B26 LTE-FDD B28 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz LTE-FDD B66 1710~1780 2100~2200 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A -type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. EG91_Series_Hardware_Design 60 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure 30: Reference Circuit of RF Antenna Interface NOTES receiving sensitivity. receive diversity. 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the 2. ANT_DIV function is enabled by default. AT+QCFG="divctl",0 command can be used to disable 3. Place the -type matching components (R1/C1/C2, R2/C3/C4) as close to the antenna as possible. 5.1.4. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 31: Microstrip Design on a 2-layer PCB EG91_Series_Hardware_Design 61 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure 32: Coplanar Waveguide Design on a 2-layer PCB Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) EG91_Series_Hardware_Design 62 / 106 LTE Standard Module Series EG91 Series Hardware Design In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . connected to ground. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully The distance between the RF pins and the RF connector should be as short as possible, and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 x W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, please refer to document [5]. 5.2. GNSS Antenna Interface The GNSS antenna interface is only supported on EG91-NA/-NS/-VX/-EX/-NAX/-NAXD/-AUX. The following tables show pin definition and frequency specification of GNSS antenna interface. Table 26: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment 49 AI GNSS antenna 50 impedance ANT_GNSS

(EG91-NA/-NS/-VX/-EX/-NAX/-

NAXD/-AUX) Table 27: GNSS Frequency GLONASS 1597.5~1605.8 Type GPS Galileo BeiDou Frequency 1575.421.023 1575.422.046 1561.0982.046 Unit MHz MHz MHz MHz EG91_Series_Hardware_Design 63 / 106 LTE Standard Module Series EG91 Series Hardware Design QZSS 1575.42 MHz A reference design of GNSS antenna is shown as below. Figure 35: Reference Circuit of GNSS Antenna NOTES GNSS 1) 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. If the module is designed with a passive antenna, then the VDD circuit is not needed. 5.3. Antenna Installation 5.3.1. Antenna Requirement Table 28: Antenna Requirements Type Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain: < 17dB EG91_Series_Hardware_Design 64 / 106 LTE Standard Module Series EG91 Series Hardware Design GSM/WCDMA/LTE VSWR: 2 Efficiency : > 30%

Max input power: 50W Input impedance: 50 Cable insertion loss: < 1dB

(GSM850,EGSM900, WCDMA B5/B8, LTE-FDD B5/B8/B12/B13/B20/B26/B28) Cable insertion loss: < 1.5dB

(DCS1800, PCS1900,WCDMA B1/B2/B4, LTE-FDD B1/B2/B3/B4/B25/B66) Cable insertion loss: < 2dB

(LTE-FDD B7) NOTE 1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm) EG91_Series_Hardware_Design 65 / 106 LTE Standard Module Series EG91 Series Hardware Design U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 37: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. Figure 38: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. EG91_Series_Hardware_Design 66 / 106 LTE Standard Module Series EG91 Series Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 29: Absolute Maximum Ratings Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage at Digital Pins Min.

-0.3

-0.3 0 0

-0.3 6.2. Power Supply Ratings Table 30: Power Supply Ratings Max. Unit 4.7 5.5 0.8 1.8 2.3 V V A A V Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum and maximum values. 3.3 3.8 4.3 V EG91_Series_Hardware_Design 67 / 106 LTE Standard Module Series EG91 Series Hardware Design Voltage drop during burst transmission Maximum power control level on EGSM900 Peak supply current

(during transmission slot) Maximum power control level on EGSM900 IVBAT 400 mV 1.8 2.0 A USB_VBUS USB connection detection 3.0 5.0 5.25 V 6.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table. Table 31: Operation and Storage Temperatures Parameter Min. Typ. Max. Unit Operation Temperature Range 1) Extended Temperature Range 2) Storage Temperature Range

-35

-40

-40

+25

+75

+85

+90 C C C NOTES 1. 2. 3. 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call*, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again.

* means under development. EG91_Series_Hardware_Design 68 / 106 LTE Standard Module Series EG91 Series Hardware Design 6.4. Current Consumption The values of current consumption are shown below. Table 32: EG91-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=5 (USB suspended) GSM DRX=9 (USB disconnected) Sleep state WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspended) IVBAT Idle state GPRS data transfer WCDMA PF=512 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspended) LTE-FDD PF=256 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) EGSM900 4DL/1UL @32.67dBm EGSM900 3DL/2UL @32.59dBm EGSM900 2DL/3UL @30.74dBm 13 1.1 2.0 1.9 1.3 1.7 2.1 1.1 2.1 2.6 1.4 19.0 29.0 19.0 29.0 19.0 29.0 260 463 552 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Series_Hardware_Design 69 / 106 LTE Standard Module Series EG91 Series Hardware Design EDGE data transfer WCDMA data transfer EGSM900 1DL/4UL @29.26dBm DCS1800 4DL/1UL @29.2dBm DCS1800 3DL/2UL @29.13dBm DCS1800 2DL/3UL @29.01dBm DCS1800 1DL/4UL @28.86dBm EGSM900 4DL/1UL PCL=8 @27.1dBm 163 EGSM900 3DL/2UL PCL=8 @27.16dBm 274 EGSM900 2DL/3UL PCL=8 @26.91dBm 383 EGSM900 1DL/4UL PCL=8 @26.12dBm 463 DCS1800 4DL/1UL PCL=2 @25.54dBm 136 DCS1800 3DL/2UL PCL=2 @25.68dBm 220 DCS1800 2DL/3UL PCL=2 @25.61dBm 306 DCS1800 1DL/4UL PCL=2 @25.41dBm 396 WCDMA B1 HSDPA CH10700 @22.29dBm 507 WCDMA B1 HSUPA CH10700 @21.79dBm 516 WCDMA B8 HSDPA CH3012 @22.47dBm 489 WCDMA B8 HSUPA CH3012 @21.98dBm 482 LTE-FDD B1 CH18300 @22.98dBm LTE-FDD B3 CH19575 @23.23dBm 619 165 267 406 467 685 698 723 655 723 660 258 159 LTE data transfer LTE-FDD B7 CH21100 @23.46dBm LTE-FDD B8 CH21625 @23.35dBm LTE-FDD B20 CH24300 @23.41dBm LTE-FDD B28A CH27360 @23.16dBm GSM voice call EGSM900 PCL=5 @32.5dBm DCS1800 PCL=0 @29.23dBm mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Series_Hardware_Design 70 / 106 LTE Standard Module Series EG91 Series Hardware Design WCDMA voice call WCDMA B1 CH10700 @23.06dBm WCDMA B8 CH3012 @23.45dBm 555 535 mA mA Table 33: EG91-NA Current Consumption Parameter Description Conditions Typ. Unit IVBAT Idle state OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspended) Sleep state WCDMA PF=512 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspended) LTE-FDD PF=256 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA B2 HSDPA CH9938 @22.45dBm WCDMA B2 HSUPA CH9938 @21.73dBm WCDMA data transfer WCDMA B4 HSDPA CH1537 @23.05dBm WCDMA B4 HSUPA CH1537 @22.86dBm WCDMA B5 HSDPA CH4407 @23dBm WCDMA B5 HSUPA CH4407 @ 22.88dBm LTE data transfer LTE-FDD B2 CH1100 @23.29dBm LTE-FDD B4 CH2175 @23.19dBm 13 1.0 2.2 2.5 1.4 2.6 2.9 1.7 14.0 26.0 15.0 26.0 569 559 572 586 518 514 705 693 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Series_Hardware_Design 71 / 106 LTE Standard Module Series EG91 Series Hardware Design Parameter Description Conditions Typ. Unit LTE-FDD B5 CH2525 @23.39dBm LTE-FDD B12 CH5060 @23.16dBm LTE-FDD B13 CH5230 @23.36dBm WCDMA B2 CH9938 @23.34dBm WCDMA B4 CH1537 @23.47dBm WCDMA B5 CH4357 @ 23.37dBm WCDMA voice call Table 34: EG91-NS Current Consumption OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspended) Sleep state WCDMA PF=512 (USB disconnected) IVBAT Idle state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspended) LTE-FDD PF=256 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA B2 HSDPA CH9938 @22.4dBm WCDMA data transfer WCDMA B2 HSUPA CH9938 @22.31dBm WCDMA B4 HSDPA CH1537 @23.01dBm WCDMA B4 HSUPA CH1537 @22.69dBm 601 650 602 627 591 536 8 2 1.2 2.3 1.3 2.5 2.8 1.6 19.9 30.1 21.2 30.9 527 547 575 589 mA mA mA mA mA mA A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Series_Hardware_Design 72 / 106 LTE Standard Module Series EG91 Series Hardware Design WCDMA B5 HSDPA CH4407 @23.05dBm WCDMA B5 HSUPA CH4407 @ 22.91dBm LTE-FDD B2 CH1100 @23.26dBm LTE-FDD B4 CH2175 @23.52dBm LTE-FDD B5 CH2525 @23.51dBm LTE-FDD B12 CH5060 @23.39dBm LTE-FDD B13 CH5230 @23.3dBm LTE-FDD B25 CH8590@ 23.64dBm LTE-FDD B26 CH8765@ 23.34dBm WCDMA B2 CH9938 @23.39dBm WCDMA B4 CH1738 @23.27dBm WCDMA B5 CH4357 @ 23.35dBm LTE data transfer WCDMA voice call Table 35: EG91-VX Current Consumption Parameter Description Conditions Typ. Unit IVBAT LTE-FDD PF=256 (USB disconnected) OFF state Power down AT+CFUN=0 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspended) Idle state LTE data transfer LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-FDD B4 CH2175 @23.36dBm LTE-FDD B13 CH5230 @23.38dBm EG91_Series_Hardware_Design 73 / 106 553 556 724 693 613 634 672 739 647 571 593 554 9 TBD TBD TBD TBD 16.5 30.8 715 642 mA mA mA mA mA mA mA mA mA mA mA mA A mA mA mA mA mA mA mA mA LTE Standard Module Series EG91 Series Hardware Design Table 36: EG91-EX Current Consumption OFF state Power down Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=5 (USB suspend) GSM DRX=9 (USB disconnected) Sleep state WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspend) WCDMA PF=512 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspend) LTE-FDD PF=256 (USB disconnected) IVBAT GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) Idle state WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) EGSM900 4DL/1UL @33.06dBm EGSM900 3DL/2UL @32.93dBm EGSM900 2DL/3UL @31.1dBm EGSM900 1DL/4UL @29.78dBm DCS1800 4DL/1UL @29.3dBm DCS1800 3DL/2UL @29.3dBm GPRS data transfer 15 1.3 2.3 2.0 1.6 1.8 2.1 1.3 2.3 2.6 1.5 21.0 31.0 21.0 31.0 21.0 31.0 247.9 450.8 536.4 618 144 253.4 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Series_Hardware_Design 74 / 106 LTE Standard Module Series EG91 Series Hardware Design DCS1800 2DL/3UL @29.21dBm DCS1800 1DL/4UL @29.07dBm EGSM900 4DL/1UL PCL=8 @27.29dBm 355.4 455.7 169.5 EGSM900 3DL/2UL PCL=8 @27.01dBm 305.06 mA EGSM900 2DL/3UL PCL=8 @26.86dBm EGSM900 1DL/4UL PCL=8 @25.95dBm DCS1800 4DL/1UL PCL=2 @26.11dBm EDGE data transfer DCS1800 3DL/2UL PCL=2 @25.8dBm DCS1800 2DL/3UL PCL=2 @25.7dBm DCS1800 1DL/4UL PCL=2 @25.6dBm WCDMA B1 HSDPA @22.48dBm WCDMA data transfer WCDMA B1 HSUPA @21.9dBm WCDMA B8 HSDPA @22.6dBm WCDMA B8 HSUPA @22.02dBm LTE data transfer LTE-FDD B1 @23.37dBm LTE-FDD B3 @23.3dBm LTE-FDD B7 @23.2dBm LTE-FDD B8 @23.09dBm LTE-FDD B20 @23.21dBm LTE-FDD B28 @22.76dBm GSM voice call WCDMA voice call EGSM900 PCL=5 @32.36dBm DCS1800 PCL=0 @29.5dBm WCDMA B1 @23.4dBm WCDMA B8 @23.6dBm 434 548 135 244 349 455 485 458 556 520 605 667 783 637 646 661 259 149 494 608 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Series_Hardware_Design 75 / 106 LTE Standard Module Series EG91 Series Hardware Design Table 37: EG91-NAX Current Consumption OFF state Power down Parameter Description Conditions Typ. Unit IVBAT LTE-FDD PF=64 (USB connected) Sleep state WCDMA PF=512 (USB disconnected) AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspend) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspend) LTE-FDD PF=256 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) WCDMA B2 HSDPA @21.74dBm WCDMA B2 HSUPA @21.47dBm WCDMA B4 HSDPA @22.67dBm WCDMA B4 HSUPA @22.30dBm WCDMA B5 HSDPA @22.63dBm WCDMA B5 HSUPA @22.31dBm LTE-FDD B2 @23.08dBm LTE-FDD B4 @23.31dBm LTE-FDD B5 @23.23dBm LTE-FDD B12 @23.03dBm LTE-FDD B13 @23.13dBm Idle state WCDMA data transfer LTE data transfer 9 1.1 2.1 2.2 1.6 2.6 2.7 1.8 16.7 32.2 14.0 32.6 528 536 542 550 523 523 694 691 586 613 626 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Series_Hardware_Design 76 / 106 LTE Standard Module Series EG91 Series Hardware Design Parameter Description Conditions Typ. Unit LTE-FDD B25 @22.96dBm LTE-FDD B26 @23.11dBm WCDMA B2 @23.08dBm WCDMA B4 @23.21dBm WCDMA B5 @23.29dBm WCDMA voice call Table 38: EG91-NAXD Current Consumption IVBAT WCDMA PF=64 (USB disconnected) OFF state Power down Sleep state WCDMA PF=512 (USB disconnected) AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspend) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspend) LTE-FDD PF=256 (USB disconnected) Idle state WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA data transfer WCDMA B2 HSDPA @21.74dBm WCDMA B2 HSUPA @21.47dBm WCDMA B4 HSDPA @22.67dBm WCDMA B4 HSUPA @22.30dBm WCDMA B5 HSDPA @22.63dBm 689 636 581 557 534 9 1.1 2.1 2.2 1.6 2.6 2.7 1.8 16.7 32.2 14.0 32.6 528 536 542 550 523 mA mA mA mA mA A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Series_Hardware_Design 77 / 106 LTE Standard Module Series EG91 Series Hardware Design WCDMA B5 HSUPA @22.31dBm LTE-FDD B2 @23.08dBm LTE-FDD B4 @23.31dBm LTE-FDD B5 @23.23dBm LTE-FDD B12 @23.03dBm LTE-FDD B13 @23.13dBm LTE-FDD B25 @22.96dBm LTE-FDD B26 @23.11dBm LTE data transfer Table 39: EG91-AUX Current Consumption OFF state Power down Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) GSM DRX = 2 (USB disconnected) GSM DRX = 5 (USB suspend) GSM DRX = 9 (USB disconnected) Sleep state WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB suspend) IVBAT WCDMA PF = 512 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB suspend) LTE-FDD PF = 256 (USB disconnected) GSM DRX = 5 (USB disconnected) Idle state GSM DRX = 5 (USB connected) WCDMA PF = 64 (USB disconnected) 523 694 691 586 613 626 689 636 10 1.2 2.3 2.0 1.5 1.8 2.1 1.3 2.3 2.6 1.5 18 28 18 mA mA mA mA mA mA mA mA A mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Series_Hardware_Design 78 / 106 LTE Standard Module Series EG91 Series Hardware Design WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) GSM850 4DL/1UL @ 32.48 dBm GSM850 3DL/2UL @ 31.89dBm GSM850 2DL/3UL @ 29.45 dBm GSM850 1DL/4UL @ 28.31 dBm EGSM900 4DL/1UL @ 33.17 dBm EGSM900 3DL/2UL @ 32.16 dBm EGSM900 2DL/3UL @ 29.77 dBm EGSM900 1DL/4UL @ 28.59 dBm DCS1800 4DL/1UL @ 30.19 dBm DCS1800 3DL/2UL @ 29.23 dBm DCS1800 2DL/3UL @ 27.19 dBm DCS1800 1DL/4UL @ 26.14 dBm PCS1900 4DL/1UL @ 30.22 dBm PCS1900 3DL/2UL @ 29.48 dBm PCS1900 2DL/3UL @ 27.50 dBm PCS1900 1DL/4UL @ 26.44 dBm GPRS data transfer 28 18 29 217.9 372.3 432.9 513.9 235.1 387.7 446.5 540.0 154.4 258.0 332.4 419.1 155.0 259.5 333.1 416.8 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EDGE data transfer GSM850 4DL/1UL PCL = 8 @ 25.75 dBm 161.8 GSM850 3DL/2UL PCL = 8 @ 25.49 dBm 291.8 GSM850 2DL/3UL PCL = 8 @ 23.26 dBm 410.2 GSM850 1DL/4UL PCL = 8 @ 22.01 dBm 520.5 EGSM900 4DL/1UL PCL = 8 @ 26.04 dBm 161.5 EGSM900 3DL/2UL PCL = 8 @ 25.86 dBm 294.6 EG91_Series_Hardware_Design 79 / 106 LTE Standard Module Series EG91 Series Hardware Design EGSM900 2DL/3UL PCL = 8 @ 23.62 dBm 411.4 EGSM900 1DL/4UL PCL = 8 @ 22.27 dBm 520.8 DCS1800 4DL/1UL PCL = 2 @ 26.12 dBm 139.4 DCS1800 3DL/2UL PCL = 2 @ 25.02 dBm 250.7 DCS1800 2DL/3UL PCL = 2 @ 22.75 dBm 355.3 DCS1800 1DL/4UL PCL = 2 @ 21.47 dBm 452.1 PCS1900 4DL/1UL PCL = 2 @ 26.36 dBm 138.3 PCS1900 3DL/2UL PCL = 2 @ 25.2 dBm 248.2 PCS1900 2DL/3UL PCL = 2 @ 22.94 dBm 351.5 PCS1900 1DL/4UL PCL = 2 @ 21.67 dBm 448.8 WCDMA data transfer LTE data transfer WCDMA B1 HSDPA @ 22.30 dBm WCDMA B1 HSUPA @ 21.50 dBm WCDMA B2 HSDPA @ 22.14 dBm WCDMA B2 HSUPA @ 21.18 dBm WCDMA B5 HSDPA @ 22.6 dBm WCDMA B5 HSUPA @ 21.45 dBm WCDMA B8 HSDPA @ 21.92 dBm WCDMA B8 HSUPA @ 21.93 dBm LTE-FDD B1 @ 22.96 dBm LTE-FDD B2 @ 22.79 dBm LTE-FDD B3 @ 23.09 dBm LTE-FDD B4 @ 22.83 dBm LTE-FDD B5 @ 23.05 dBm LTE-FDD B7 @ 22.71 dBm LTE-FDD B8 @ 22.80 dBm 609.6 640.5 557.4 539.4 588.2 545.2 578.1 592.5 777.4 634.4 697.9 704.6 657.1 765.3 635.3 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG91_Series_Hardware_Design 80 / 106 670.0 725.9 227.8 253.8 168.0 166.8 656.2 579.8 589.8 627.8 54 54 53 32 mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE Standard Module Series EG91 Series Hardware Design LTE-FDD B28 @ 22.84 dBm LTE-FDD B66 @ 22.73 dBm GSM850 PCL5 @32.57dBm EGSM900 PCL5 @33.21dBm DCS1800 PCL0 @30.24dBm PCS1900 PCL0 @30.33dBm WCDMA B1 @22.93dBm GSM voice call WCDMA voice call WCDMA B2 @22.95dBm WCDMA B5 @22.54dBm WCDMA B8 @22.47dBm Table 40: GNSS Current Consumption of EG91 Parameter Description Conditions Typ. Unit IVBAT

(GNSS) Cold start @Passive Antenna Hot Start @Passive Antenna Lost state @Passive Antenna Open Sky @Passive Antenna Searching

(AT+CFUN=0) Tracking

(AT+CFUN=0) 6.5. RF Output Power The following table shows the RF output power of EG91 series module. Table 41: RF Output Power Frequency GSM850 Max. Min. 33dBm2dB 5dBm5dB EG91_Series_Hardware_Design 81 / 106 LTE Standard Module Series EG91 Series Hardware Design EGSM900 DCS1800 PCS1900 33dBm2dB 5dBm5dB 30dBm2dB 0dBm5dB 30dBm2dB 0dBm5dB GSM850 (8-PSK) 27dBm3dB 5dBm5dB EGSM900 (8-PSK) 27dBm3dB 5dBm5dB DCS1800 (8-PSK) 26dBm3dB 0dBm5dB PCS1900 (8-PSK) 26dBm3dB 0dBm5dB WCDMA B1/B2/B4/B5/B8 24dBm+1/-3dB

< -49dBm LTE-FDD B1/B2/B3/B4/B5/B7/

B8/B12/B13/B20/B25/B26/B28/B66 23dBm2dB

< -39dBm NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EG91 series module. Table 42: EG91-E Conducted RF Receiving Sensitivity Frequency 3GPP (SIMO) Receiving Sensitivity (Typ.) Primary Diversity SIMO EGSM900

-108.6dBm DCS1800

-109.4 dBm NA NA NA NA

-102dBm

-102dbm WCDMA B1

-109.5dBm

-110dBm

-112.5dBm

-106.7dBm WCDMA B8

-109.5dBm

-110dBm

-112.5dBm

-103.7dBm LTE-FDD B1 (10MHz)

-97.5dBm

-98.3dBm

-101.4dBm

-96.3dBm EG91_Series_Hardware_Design 82 / 106 LTE Standard Module Series EG91 Series Hardware Design LTE-FDD B3 (10MHz)

-98.3dBm

-98.5dBm

-101.5dBm

-93.3dBm LTE-FDD B7 (10MHz)

-96.3dBm

-98.4dBm

-101.3dBm

-94.3dBm LTE-FDD B8 (10MHz)

-97.1dBm

-99.1dBm

-101.2dBm

-93.3dBm LTE-FDD B20 (10MHz)

-97dBm

-99dBm

-101.3dBm

-93.3dBm LTE-FDD B28A (10MHz)

-98.3dBm

-99dBm

-101.4dBm

-94.8dBm Table 43: EG91-NA Conducted RF Receiving Sensitivity Frequency 3GPP (SIMO) Receiving Sensitivity (Typ.) Primary Diversity SIMO WCDMA B2

-110dBm

-110dBm

-112.5dBm

-104.7dBm WCDMA B4

-110dBm

-110dBm

-112.5dBm

-106.7dBm WCDMA B5

-111dBm

-111dBm

-113dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98dBm

-99dBm

-102.2dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.8dBm

-99.5dBm

-102.2dBm

-96.3dBm LTE-FDD B5 (10MHz)

-99.6dBm

-100.3dBm

-103dBm

-94.3dBm LTE-FDD B12 (10MHz)

-99.5dBm

-100dBm

-102.5dBm

-93.3dBm LTE-FDD B13 (10MHz)

-99.2dBm

-100dBm

-102.5dBm

-93.3dBm Table 44: EG91-NS Conducted RF Receiving Sensitivity Frequency 3GPP (SIMO) Primary Diversity SIMO Receiving Sensitivity (Typ.) WCDMA B2

-110dBm

-110dBm

-112.5dBm

-104.7dBm WCDMA B4

-110dBm

-110dBm

-112.5dBm

-106.7dBm WCDMA B5

-111dBm

-111dBm

-113dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98dBm

-99dBm

-102.2dBm

-94.3dBm EG91_Series_Hardware_Design 83 / 106 LTE Standard Module Series EG91 Series Hardware Design LTE-FDD B4 (10MHz)

-97.8dBm

-99.5dBm

-102.2dBm

-96.3dBm LTE-FDD B5 (10MHz)

-99.4dBm

-100dBm

-102.7dBm

-94.3dBm LTE-FDD B12 (10MHz)

-99.5dBm

-100dBm

-102.5dBm

-93.3dBm LTE-FDD B13 (10MHz)

-99.2dBm

-100dBm

-102.5dBm

-93.3dBm LTE-FDD B25 (10MHz)

-97.6dBm

-99dBm

-102.2dBm

-92.8dBm LTE-FDD B26 (10MHz)

-99.1dBm

-99.9dBm

-102.7dBm

-93.8dBm Table 45: EG91-VX Conducted RF Receiving Sensitivity Frequency 3GPP (SIMO) Primary Diversity SIMO Receiving Sensitivity (Typ.) LTE-FDD B4 (10MHz)

-98.2dBm

-99.2dBm

-102.2dBm

-96.3dBm LTE-FDD B13 (10MHz)

-99.2dBm

-100dBm

-102.5dBm

-93.3dBm Table 46: EG91-EX Conducted RF Receiving Sensitivity Frequency 3GPP (SIMO) Receiving Sensitivity (Typ.) Primary Diversity SIMO EGSM900

-109.8dBm NA DCS1800

-109.8 dBm NA NA NA

-102dBm

-102dbm WCDMA B1

-110dBm

-111dBm

-112.5dBm

-106.7dBm WCDMA B8

-110dBm

-111dBm

-112.5dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.7dBm

-98.8dBm

-102.4dBm

-96.3dBm LTE-FDD B3 (10MHz)

-98.3dBm

-99.5dBm

-102.5dBm

-93.3dBm LTE-FDD B7 (10MHz)

-97.5dBm

-98.4dBm

-100.3dBm

-94.3dBm LTE-FDD B8 (10MHz)

-98.7dBm

-99.6dBm

-102.2dBm

-93.3dBm LTE-FDD B20 (10MHz)

-97dBm

-97.5dBm

-102.2dBm

-93.3dBm EG91_Series_Hardware_Design 84 / 106 LTE Standard Module Series EG91 Series Hardware Design LTE-FDD B28 (10MHz)

-98.2dBm

-99.5dBm

-102dBm

-94.8dBm Table 47: EG91-NAX Conducted RF Receiving Sensitivity Frequency 3GPP (SIMO) Primary Diversity SIMO Receiving Sensitivity (Typ.) WCDMA B2

-110dBm

-110dBm

-112.5dBm

-104.7dBm WCDMA B4

-110dBm

-110dBm

-112.5dBm

-106.7dBm WCDMA B5

-111dBm

-111dBm

-113dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98dBm

-99dBm

-102.2dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.8dBm

-99.5dBm

-102.2dBm

-96.3dBm LTE-FDD B5 (10MHz)

-99.4dBm

-100dBm

-102.7dBm

-94.3dBm LTE-FDD B12 (10MHz)

-99.5dBm

-100dBm

-102.5dBm

-93.3dBm LTE-FDD B13 (10MHz)

-99.2dBm

-100dBm

-102.5dBm

-93.3dBm LTE-FDD B25 (10MHz)

-97.6dBm

-99dBm

-102.2dBm

-92.8dBm LTE-FDD B26 (10MHz)

-99.1dBm

-99.9dBm

-102.7dBm

-93.8dBm Table 48: EG91-NAXD Conducted RF Receiving Sensitivity Frequency 3GPP (SIMO) Primary Diversity SIMO Receiving Sensitivity (Typ.) WCDMA B2

-110dBm

-110dBm

-112.5dBm

-104.7dBm WCDMA B4

-110dBm

-110dBm

-112.5dBm

-106.7dBm WCDMA B5

-111dBm

-111dBm

-113dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98dBm

-99dBm

-102.2dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.8dBm

-99.5dBm

-102.2dBm

-96.3dBm LTE-FDD B5 (10MHz)

-99.4dBm

-100dBm

-102.7dBm

-94.3dBm EG91_Series_Hardware_Design 85 / 106 LTE Standard Module Series EG91 Series Hardware Design LTE-FDD B12 (10MHz)

-99.5dBm

-100dBm

-102.5dBm

-93.3dBm LTE-FDD B13 (10MHz)

-99.2dBm

-100dBm

-102.5dBm

-93.3dBm LTE-FDD B25 (10MHz)

-97.6dBm

-99dBm

-102.2dBm

-92.8dBm LTE-FDD B26 (10MHz)

-99.1dBm

-99.9dBm

-102.7dBm

-93.8dBm Table 49: EG91-AUX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP GSM850 EGSM900 DCS1800 PCS1900

-109.1 dBm NA

-109.7 dBm NA

-110.0 dBm NA

-109.4 dBm NA WCDMA B1

-109.2 dBm NA WCDMA B2

-109.8 dBm NA WCDMA B5 WCDMA B8

-110 dBm

-110 dBm LTE-FDD B1 (10MHz)

-97.2dBm LTE-FDD B2 (10MHz)

-97.7dBm LTE-FDD B3 (10MHz)

-98.2dBm LTE-FDD B4 (10MHz)

-97.7dBm LTE-FDD B5 (10MHz)

-99.2dBm LTE-FDD B7 (10MHz)

-96.7dBm LTE-FDD B8 (10MHz)

-98.0dBm LTE-FDD B28 (10MHz)

-98.7dBm LTE-FDD B66 (10MHz)

-97.7dBm NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA

-102 dBm

-102 dBm

-102 dBm

-102 dBm

-106.7 dBm

-104.7 dBm

-104.7 dBm

-103.7 dBm

-96.3dBm

-94.3dBm

-93.3dBm

-96.3dBm

-94.3dBm

-94.3dBm

-93.3dBm

-94.8dBm

-95.8dBm EG91_Series_Hardware_Design 86 / 106 LTE Standard Module Series EG91 Series Hardware Design 6.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the modules electrostatic discharge characteristics. Table 50: Electrostatic Discharge Characteristics (25C, 45% Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND All Antenna Interfaces Other Interfaces 5 4 0.5 6.8. Thermal Consideration 10 8 1 KV KV KV In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:

On customers PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc. Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary. Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Make sure the ground pads of the module and PCB are fully connected. According to customers application demands, the heatsink can be mounted on the top of the module, or the opposite side of the PCB area where the module is mounted, or both of them. The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB. The following shows two kinds of heatsink designs for reference and customers can choose one or both of them according to their application structure. EG91_Series_Hardware_Design 87 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module) Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers PCB) NOTE The module offers the best performance when the internal BB chip stays below 105C. When the maximum temperature of the BB chip reaches or exceeds 105C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below EG91_Series_Hardware_Design 88 / 106 LTE Standard Module Series EG91 Series Hardware Design 105C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. EG91_Series_Hardware_Design 89 / 106 LTE Standard Module Series EG91 Series Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.05 mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module 250.15 2.300.2 Pin 1 5 1

. 0 9 2 Figure 41: Module Top and Side Dimensions EG91_Series_Hardware_Design 90 / 106 LTE Standard Module Series EG91 Series Hardware Design 250.15 2.75 1.10 1.95 7.45 7.15 1.10 0 9

. 3 0.50 1.58 4.85 0.33 2.93 1.44 1.00 5.10 1.70 0.20 0.85 8.50 1.10 5 1

. 0 9 2 1.90 1.10 4.25 0.85 1.70 5.95 1.00 1.00 0.70 1.70 1.15 0.55 0.50 5 1

. 1 2.75 62x0.7 40x1.0 1.70 62x1.15 40x1.0 1.70 1.70 1.70 0.40 0.40 Figure 42: EG91-E Module Bottom Dimensions (Top View) EG91_Series_Hardware_Design 91 / 106 LTE Standard Module Series EG91 Series Hardware Design 250.15 2.75 1.10 1.95 7.45 7.15 1.10 0.50 0 9

. 3 1.58 4.85 0.33 2.93 1.70 0.20 1.63 1.00 8.50 5.10 0.85 5.95 4.25 0.85 1.70 1.00 1.00 5 1

. 0 9 2 1.10 1.90 1.10 0.70 1.70 1.15 0.55 0.50 5 1

. 1 2.75 1.70 1.70 0.40 62x0.7 40x1.0 62x1.15 40x1.0 1.70 1.70 0.40 Figure 43: EG91-EX Module Bottom Dimensions (Top View) NOTE 1. The package warpage level of the module conforms to the JEITA ED-7306 standard. EG91_Series_Hardware_Design 92 / 106 LTE Standard Module Series EG91 Series Hardware Design 2. EG91-NA, EG91-NS, EG91-VX, EG91-NAX, EG91-NAXD and EG91-AUX modules bottom dimensions is as the same as EG95-EX. 7.2. Recommended Footprint 7.45 7.15 1.10 1.95 1.10 0 9

. 3 0.50 0.50 PIN 1 4.85 5 1

. 0 9 2 1.10 1.90 1.10 1.00 5.10 1.70 0.20 8.50 0.85 5.95 1.00 1.00 4.25 0.85 1.70 0.50 5 1

. 1 0.50 2.75 0.70 1.70 1.15 0.55 62x0.7 40x1.0 1.70 62x1.15 40x1.0 1.70 1.70 1.70 0.40 0.40 Figure 44: Recommended Footprint (Top View) EG91_Series_Hardware_Design 93 / 106 LTE Standard Module Series EG91 Series Hardware Design NOTE For easy maintenance of this module, please keep about 3 mm between the module and other components on the motherboard. 7.3. Top and Bottom Views of the Module Figure 45: Top View of the Module EG91_Series_Hardware_Design 94 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure 46: EG91-E Bottom View of the Module NOTES Figure 47: EG91-EX Bottom View of the Module These are renderings of the module. For authentic appearance, please refer to the module received from Quectel. 2. EG91-NA, EG91-NS, EG91-VX, EG91-NAX, EG91-NAXD and EG91-AUX modules bottom view is as the same as EG95-EX. EG91_Series_Hardware_Design 95 / 106 LTE Standard Module Series EG91 Series Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. should be 35%60%. 3. The floor life of the module is 168 hours 1) in a plant where the temperature is 23 5 C and relative humidity is below 60%. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10% (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a dry environment such as in a drying oven. 5. EG91_Series_Hardware_Design 96 / 106 LTE Standard Module Series EG91 Series Hardware Design NOTES 1. 1) This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. 2. To avoid blistering, layer separation and other soldering issues, it is forbidden to expose the modules to the air for a long time. If the temperature and moisture do not conform to IPC/JEDEC J-STD-033 or the relative moisture is over 60%, It is recommended to start the solder reflow process within 24 hours after the package is removed. And do not remove the packages of tremendous modules if they are not ready for soldering. 3. Please take the module out of the packaging and put it on high-temperature resistant fixtures before the baking. If shorter baking time is desired, please refer to IPC/JEDEC J-STD-033 for baking procedure. 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.130.15 mm. For more details, please refer to document [4]. It is suggested that the peak reflow temperature is 238246 C, and the absolute maximum reflow temperature is 246 C. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Temp. (C) 246 238 220 200 150 100 Soak Zone A Max slope: 1 to 3C/s Reflow Zone Max slope:

2 to 3C/s C Cooling down slope:

-1.5 to -3C/s B D Figure 48: Recommended Reflow Soldering Thermal Profile EG91_Series_Hardware_Design 97 / 106 LTE Standard Module Series EG91 Series Hardware Design Table 51: Recommended Thermal Profile Parameters Soak time (between A and B: 150 C and 200 C) 70120 s Factor Soak Zone Max slope Reflow Zone Max slope Reflow time (D: over 220C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle 8.3. Packaging Recommendation 13 C/s 23 C/s 4570 s 238 C to 246 C

-1.5 to -3 C/s 1 EG91 series module is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. The reel is 330mm in diameter and each reel contains 250 modules. The following figures show the packaging details, measured in mm. EG91_Series_Hardware_Design 98 / 106 LTE Standard Module Series EG91 Series Hardware Design Figure 49: Tape Dimensions 48.5 0 0 1 13 44.5+0.20

-0.00 Figure 50: Reel Dimensions Cover tape Direction of feed EG91_Series_Hardware_Design 99 / 106 LTE Standard Module Series EG91 Series Hardware Design 1083 Carrier tape packing module Carrier tape unfolding Figure 51: Tape and Reel Directions EG91_Series_Hardware_Design 100 / 106 LTE Standard Module Series EG91 Series Hardware Design 9 Appendix A References Table 52: Related Documents SN Document Name Remark

[1]

Quectel_EC2x&EG9x_Power_Management_ Application_Note

[2]

Quectel_EG9x_AT_Commands_Manual Power Management Application Note for EC25, EC21, EC20 R2.0, EC20 R2.1, EG95 and EG91 AT Commands Manual for EG95 and EG91

[3]

Quectel_EC25&EC21_GNSS_AT_Commands_ Manual GNSS AT Commands Manual for EC25 and EC21 modules

[4]

Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide

[5]

Quectel_RF_Layout_Application_Note RF Layout Application Note

[6]

Quectel_LTE_Module_Thermal_Design_Guide

[7]

Quectel_UMTS&LTE_EVB_User_Guide Thermal design guide for LTE standard, LTE-A and Automotive modules UMTS&LTE EVB user guide for UMTS&LTE modules Table 53: Terms and Abbreviations Abbreviation Description Adaptive Multi-rate Bits Per Second Coding Scheme Circuit Switched Data Clear To Send CHAP Challenge Handshake Authentication Protocol DC-HSPA+

Dual-carrier High Speed Packet Access AMR bps CS CSD CTS EG91_Series_Hardware_Design 101 / 106 LTE Standard Module Series EG91 Series Hardware Design DFOTA Delta Firmware Upgrade Over-The-Air DL DTR DTX EFR ESD FDD FR GMSK GSM HR HSPA HSDPA HSUPA I/O Inorm LED LNA LTE MIMO MO MS MSL MT PAP Downlink Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate Gaussian Minimum Shift Keying Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Downlink Packet Access High Speed Uplink Packet Access Input/Output Normal Current Light Emitting Diode Low Noise Amplifier Long Term Evolution Multiple Input Multiple Output Mobile Originated Mobile Station (GSM engine) Moisture Sensitivity Level Mobile Terminated Password Authentication Protocol EG91_Series_Hardware_Design 102 / 106 LTE Standard Module Series EG91 Series Hardware Design PCB PDU PPP QAM QPSK RF RHCP Rx SMS TDD TX UL UMTS URC

(U)SIM Vmax Vnorm Vmin VIHmax VIHmin VILmax VILmin VImax VImin VOHin Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Right Hand Circularly Polarized Receive Short Message Service Time Division Duplexing Transmitting Direction Uplink Universal Mobile Telecommunications System Unsolicited Result Code

(Universal) Subscriber Identity Module Maximum Voltage Value Normal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Absolute Minimum Input Voltage Value Minimum Output High Level Voltage Value EG91_Series_Hardware_Design 103 / 106 LTE Standard Module Series EG91 Series Hardware Design Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access VOLmax VOLmin VSWR EG91_Series_Hardware_Design 104 / 106 LTE Standard Module Series EG91 Series Hardware Design 10 Appendix B GPRS Coding Schemes Table 54: Description of Different Coding Schemes Scheme Code Rate USF Pre-coded USF BCS Tail Coded Bits Punctured Bits Data Rate Kb/s Radio Block excl.USF and BCS 181 268 CS-1 CS-2 CS-3 CS-4 2/3 3/4 1/2 3 3 40 4 456 0 3 6 16 4 588 132 3 6 312 16 4 676 220 15.6 9.05 13.4 1 3 12 428 16 456

21.4 EG91_Series_Hardware_Design 105 / 106 LTE Standard Module Series EG91 Series Hardware Design 11 Appendix C GPRS Multi-slot Classes Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 55: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1 2 2 3 2 3 3 4 3 4 4 4 3 4 2 3 3 4 4 4 4 5 5 5 5 5 NA NA 1 1 2 1 2 2 3 1 2 2 3 4 3 4 EG91_Series_Hardware_Design 106 / 106 LTE Standard Module Series EG91 Series Hardware Design 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 5 6 7 8 6 6 6 6 6 8 8 8 8 8 8 5 5 5 5 5 6 7 8 2 3 4 4 6 2 3 4 4 6 8 1 2 3 4 NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA 6 6 6 6 EG91_Series_Hardware_Design 107 / 106 LTE Standard Module Series EG91 Series Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 56: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot GMSK GMSK GMSK GMSK 8-PSK 8-PSK 8-PSK 8-PSK 8-PSK C B A C B A B A A 8.80kbps 17.60kbps 35.20kbps 11.2kbps 22.4kbps 44.8kbps 14.8kbps 29.6kbps 59.2kbps 17.6kbps 35.2kbps 70.4kbps 22.4kbps 44.8kbps 89.6kbps 29.6kbps 59.2kbps 118.4kbps 44.8kbps 89.6kbps 179.2kbps 54.4kbps 108.8kbps 217.6kbps 59.2kbps 118.4kbps 236.8kbps MCS-1 MCS-2 MCS-3 MCS-4 MCS-5 MCS-6 MCS-7 MCS-8 MCS-9 EG91_Series_Hardware_Design 108 / 106

 

 

 

 

 

 

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Quectel Wireless Solutions Company Limited EG91NAXDcoverletter XMR202008EG91NAXD original certifite : 202180789AA00 , date of grant :09/09/2020 FCC ID :XMR202008EG91NAXD Product Name: LTE Module Model Number: EG91-NAX, EG91-NAXD Hardware Version: R1.0 EG91-NAXand EG91-NAXD share thesameHWdesign and BOM, that means they have completely same hardware, The onlydifference is EG91-NAXD disabled voice functionality by software change. All reports are updated as follows:

EG91-NAXD (Report No.: R2006A0379-M1) is a variant model of EG91-NAX (Report No.: R1907A0406-M1). Test values duplicated from Original for variant. There is no test for variant in this report. The detailed product change description please refers to the Statement letter_EG91-NAX&EG91-NAXD. EG91-NAXD (Report No.: R2006A0379-M2) is a variant model of EG91-NAX (Report No.: R1907A0406-M2V1). Test values duplicated from Original for variant. There is no test for variant in this report. The detailed product change description please refers to the Statement letter_EG91-NAX&EG91-NAXD. EG91-NAXD (Report No.: R2006A0379-R1) is a variant model of EG91-NAX (Report No.: R1907A0406-R1). Test values partial duplicated from Original for variant. There is only tested Frequency Stability and Spurious Emissions at Antenna Terminals for variant in this report. The detailed product change description please refers to the Statement letter_EG91-NAX&EG91-NAXD. EG91-NAXD (Report No.: R2006A0379-R2) is a variant model of EG91-NAX (Report No.: R1907A0406-R2). Test values partial duplicated from Original for variant. There is only tested Frequency Stability for variant in this report. The detailed product change description please refers to the Statement letter_EG91-NAX&EG91-NAXD. EG91-NAXD (Report No.: R2006A0379-R3) is a variant model of EG91-NAX (Report No.: R1907A0406-R3). Test values partial duplicated from Original for variant. There is only tested Emission Masks, Frequency Stability and Spurious Emissions at Ant enna Termi inals for va riant in this s report. Th he detailed p product cha ange des scription ple ease refers to the Stat tement lette er_EG91-NA AX&EG91-N NAXD. EG9 91-NAXD (R Report No.:

R2006A037 79-R4) is a v variant mod del of EG91 1-NAX (Rep port No.

: R1907A04 406-R4). Tes st values pa artial duplic cated from Original fo r variant. T here is o only tested F Frequency Stability fo or variant in n this report t. The detai led produc t cha ange descri ption pleas se refers to the Statem ment letter_E EG91-NAX&

&EG91-NAX XD. EG9 91-NAXD (R Report No.:

R2006A037 79-R5) is a v variant mod del of EG91 1-NAX (Rep port No.

: R1907A04 406-R5V1). T Test values s partial dup plicated fro om Original for variant t. The ere is only t ested Band d Edge Com mpliance for r LTE Band d 13, Radiat es Spuriou s Emi ission for W WCDMA Ba nd IV and L LTE Band 1 3, Frequenc cy Stability y for all Ban nd and d Spurious E Emissions at Antenna a Terminals for LTE Ba and 4 and L LTE Band 12 2 in this s report. The e detailed p product cha ange descri iption pleas se refers to o the Statem ment lette er_EG91-NA AX&EG91-N NAXD. EG9 91-NAXD (R Report No.:

R2006A037 79-R6) is a v variant mod del of EG91 1-NAX (Rep port No.

: R1907A04 406-R6). Tes st values pa artial duplic cated from Original fo r variant. T here is o only tested F Frequency Stability fo or variant in n this report t. The detai led produc t cha ange descri ption pleas se refers to the Statem ment letter_E EG91-NAX&

&EG91-NAX XD. You ur assistance e on this mat tter is highly y appreciated d. Sign nature:

Prin nt name: Jea an Hu Date e: 08/27/202 20 Com mpany: Quec ctel Wireles s Solutions Co., Ltd. dress: Buildin hang Distric ail: jean.hu ng 5, Shang ct, Shanghai u@quectel.c ghai Busines

, China 200 com ss Park Pha 233 Add Min Ema se III (Area B), No.1016 6 Tianlin Roa ad,

 

 

 

 

 

 

 

 

 

 

Quectel Wireless Solutions Co., Ltd POWER OF ATTORNEY We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd. Jinnan han on our behalf, to apply to FCC on our equipment for FCC ID:

XMR202008EG91NAXD. Any and all acts carried out by TA Technology

(Shanghai) Co., Ltd. / Jinnan han on our behalf shall have the same effect as DATE: August 27, 2020 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 acts of our own. Sincerely, Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Company Limited

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Quectel Wireless Solutions Co., Ltd Request for Confidentiality Date: _2020/09/07_ Subject: Confidentiality Request for: _____ FCC ID: XMR202008EG91NAXD ______ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Short Term Permanent Exhibit Tune-Up Procedure

*Note: ______(Insert Explanation as Necessary)______ ______ FCC ID: XMR202008EG91NAXD _____ has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:

(Signature/Title1) Jean Hu

(Print name)

 

 

Quectel Wireless Solutions Co., Ltd Request for Changing of FCC ID Date: September 2, 2020 We, Quectel Wireless Solutions Co., Ltd , hereby apply for changing of FCC ID. The new FCC ID we will use is XMR202008EG91NAXD. Here we declare that the products which will bear two different FCC IDs are totally the same as each other in every aspect. The information of the original FCC ID:

FCC ID: XMR201909EG91NAX Model number: EG91-NAX Applicant: Quectel Wireless Solutions Co., Ltd Address: Building5,ShanghaiBusinessParkPhaseIII(AreaB),No.1016TianlinRoad, MinhangDistrict,Shanghai,China200233 Device name: LTE Module Date of Grant: 12/02/2019 The information of new FCC ID:

FCC ID: XMR202008EG91NAXD Model number: EG91-NAXD Applicant: Quectel Wireless Solutions Co., Ltd Address: Building5,ShanghaiBusinessParkPhaseIII(AreaB),No.1016TianlinRoad, MinhangDistrict,Shanghai,China200233 Device name: LTE Module The original test results continue to be representative of and applicable to the equipment bearing the changed (new) FCC ID. Thank you. Regards, Yours Sincerely, Print name:

Signature: Jean Hu/Project Manager Company: Quectel Wireless Solutions Co., Ltd

 

 

Quect tel Wire eless S EG91 Solution 1NAXDcover s Com letter pany L imited XMR R202008EG91 1NAXD origin nal certifite :

192181105 5AA00 , date e of grant :1 2/02/2019 91-NAXand mpletely sam ctionality by d EG91-NAX me hardware, y software ch XDshare the

, The onlydi hange. esameHWde ifference is E esign and BO EG91-NAXD OM, that me D disabled v eans they hav voice ve FCC C ID :XMR2 201909EG91 1NAX oduct Name del Number rdware Ver

: LTE Modu r: EG91-NA rsion: R1.0 ule AX, EG91-N NAXD Pro Mod Har EG9 com func You ur assistance e on this mat tter is highly y appreciated d. Sign nature:

Prin nt name: Jea an Hu Date e: 08/27/202 20 Com mpany: Quec ctel Wireles s Solutions Co., Ltd. dress: Buildin hang Distric ail: jean.hu ng 5, Shang ct, Shanghai u@quectel.c ghai Busines

, China 200 com ss Park Pha 233 Add Min Ema se III (Area B), No.1016 6 Tianlin Roa ad,