FCC ID: XMR202011EC200TAU LTE Module

EC200T-AU Series Mini PCIe Hardware Design LTE Standard Module Series Version: 1.1 Date: 2020-10-17 Status: Released www.quectel.com LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

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http://www.quectel.com/support/technical.htm Or email to support@quectel.com. General Notes Quectel offers the information as a service to its customers. The information provided is based upon customers requirements. Quectel makes every effort to ensure the quality of the information it makes available. Quectel does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information. All information supplied herein is subject to change without prior notice. Disclaimer While Quectel has made efforts to ensure that the functions and features under development are free from errors, it is possible that these functions and features could contain errors, inaccuracies and omissions. Unless otherwise provided by valid agreement, Quectel makes no warranties of any kind, implied or express, with respect to the use of features and functions under development. To the maximum extent permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with the use of the functions and features under development, regardless of whether such loss or damage may have been foreseeable. Duty of Confidentiality The Receiving Party shall keep confidential all documentation and information provided by Quectel, except when the specific permission has been granted by Quectel. The Receiving Party shall not access or use Quectels documentation and information for any purpose except as expressly provided herein. Furthermore, the Receiving Party shall not disclose any of the Quectel's documentation and information to any third party without the prior written consent by Quectel. For any noncompliance to the above requirements, unauthorized use, or other illegal or malicious use of the documentation and information, Quectel will reserve the right to take legal action. Copyright EC200T_Series_Mini_PCIe_Hardware_Design 1 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design The information contained here is proprietary technical information of Quectel wireless solutions co., ltd. Transmitting, reproducing, disseminating and editing this document as well as using the content without permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. Copyright Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved. EC200T_Series_Mini_PCIe_Hardware_Design 2 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design About the Document Revision History Version Date Author Description 1.0 1.1 2020-02-27 Initial Jaye SANG/

Niko WU Anthony LIU/

Niko WU 2020-10-17 Added Current Consumption operation and storage temperatures EC200T_Series_Mini_PCIe_Hardware_Design 3 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Contents About the Document ................................................................................................................................ 3 Contents .................................................................................................................................................... 4 Table Index ............................................................................................................................................... 6 Figure Index .............................................................................................................................................. 7 1 Introduction ....................................................................................................................................... 8 Safety Information ..................................................................................................................11 1.1. 2 Product Concept ............................................................................................................................. 13 2.1. General Description .............................................................................................................. 13 Description of Module Series ................................................................................................ 14 2.2. Key Features ......................................................................................................................... 14 2.3. 2.4. Functional Diagram ............................................................................................................... 17 3 Application Interfaces ..................................................................................................................... 18 3.1. Pin Assignment ..................................................................................................................... 18 3.2. Pin Description ...................................................................................................................... 19 3.3. Operating Modes .................................................................................................................. 22 3.4. Power Saving ........................................................................................................................ 22 3.4.1. Sleep Mode.................................................................................................................. 22 3.4.2. Airplane Mode .............................................................................................................. 23 Power Supply ........................................................................................................................ 23 3.5.

(U)SIM Interface .................................................................................................................... 24 3.6. USB Interface ........................................................................................................................ 26 3.7. UART Interface ..................................................................................................................... 27 3.8. PCM and I2C Interfaces ........................................................................................................ 28 3.9. 3.10. Control and Indication Signals .............................................................................................. 30 3.10.1. RI Signal ...................................................................................................................... 31 3.10.2. DTR Signal .................................................................................................................. 31 3.10.3. W_DISABLE# Signal ................................................................................................... 31 3.10.4. PERST# Signal ............................................................................................................ 32 3.10.5. LED_WWAN# Signal ................................................................................................... 33 3.10.6. WAKE# Signal ............................................................................................................. 34 4.1. 4 Antenna Connection ....................................................................................................................... 35 Antenna Connectors ............................................................................................................. 35 4.1.1. Operating Frequency ................................................................................................... 35 Antenna Requirements ......................................................................................................... 37 Recommended Mating Plugs for Antenna Connection .......................................................... 38 4.2. 4.3. 5 Reliability, Radio and Electrical Characteristics .......................................................................... 40 5.1. General Description .............................................................................................................. 40 EC200T_Series_Mini_PCIe_Hardware_Design 4 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Power Supply Requirements ................................................................................................. 40 5.2. I/O Requirements .................................................................................................................. 41 5.3. RF Characteristics ................................................................................................................ 41 5.4. ESD Characteristics .............................................................................................................. 44 5.5. 5.6. Operation and Storage Temperatures ................................................................................... 45 5.7. Current Consumption ............................................................................................................ 45 6 Dimensions and Packaging ............................................................................................................ 52 6.1. General Description .............................................................................................................. 52 6.2. Mechanical Dimensions of EC200T Series Mini PCIe ........................................................... 52 6.3. Standard Dimensions of Mini PCI Express ............................................................................ 53 Packaging Specifications ...................................................................................................... 54 6.4. 7 Appendix References ..................................................................................................................... 55 EC200T_Series_Mini_PCIe_Hardware_Design 5 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Table Index Table 1: Description of EC200T Series Mini PCIe ................................................................................... 14 Table 2: Key Features of EC200T Series Mini PCIe ................................................................................ 14 Table 3: I/O Parameters Definition ........................................................................................................... 19 Table 4: Pin Description ........................................................................................................................... 19 Table 5: Overview of Operating Modes ................................................................................................... 22 Table 6: Definition of VCC_3V3 and GND Pins ....................................................................................... 23 Table 7: Pin Definition of (U)SIM Interface .............................................................................................. 24 Table 8: Pin Definition of USB Interface .................................................................................................. 26 Table 9: Pin Definition of Main UART Interface ....................................................................................... 28 Table 10: Pin Definition of PCM and I2C Interfaces ................................................................................. 29 Table 11: Pin Definition of Control and Indication Signals ....................................................................... 30 Table 12: Airplane Mode Controlled by Hardware Method ...................................................................... 31 Table 13: Airplane Mode Controlled by Software Method ........................................................................ 32 Table 14: Indications of Network Status (AT+QCFG="ledmode",0, Default Setting) ................................ 33 Table 15: Indications of Network Status (AT+QCFG="ledmode",2) ......................................................... 33 Table 16: EC200T-CN Mini PCIe Operating Frequencies ........................................................................ 35 Table 17: EC200T-EU Mini PCIe Operating Frequencies ........................................................................ 36 Table 18: EC200T-AU Mini PCIe* Operating Frequencies ...................................................................... 36 Table 19: Antenna Requirements ............................................................................................................ 37 Table 20: Power Supply Requirements ................................................................................................... 40 Table 21: I/O Requirements ..................................................................................................................... 41 Table 22: Conducted RF Output Power of EC200T Series Mini PCIe ..................................................... 41 Table 23: Conducted RF Receiving Sensitivity of EC200T-CN Mini PCIe ............................................... 42 Table 24: Conducted RF Receiving Sensitivity of EC200T-EU Mini PCIe ............................................... 42 Table 25: Conducted RF Receiving Sensitivity of EC200T-AU Mini PCIe* .............................................. 43 Table 26: ESD Characteristics of EC200T Series Mini PCIe ................................................................... 44 Table 27: Operation and Storage Temperatures ...................................................................................... 45 Table 28: EC200T-CN Mini PCIe Current Consumption .......................................................................... 45 Table 29: EC200T-EU Mini PCIe Current Consumption .......................................................................... 48 Table 30: Related Documents ................................................................................................................. 55 Table 31: Terms and Abbreviations .......................................................................................................... 55 EC200T_Series_Mini_PCIe_Hardware_Design 6 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Figure Index Figure 1: Functional Diagram .................................................................................................................. 17 Figure 2: Pin Assignment ........................................................................................................................ 18 Figure 3: Reference Circuit of Power Supply .......................................................................................... 24 Figure 4: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector ........................... 25 Figure 5: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector ............................. 25 Figure 6: Reference Circuit of USB Interface .......................................................................................... 27 Figure 7: Reference Circuit of Power Supply .......................................................................................... 28 Figure 8: Timing in Primary Mode ............................................................................................................ 29 Figure 9: Reference Circuit of PCM Application with Audio Codec .......................................................... 30 Figure 10: RI Behaviors ........................................................................................................................... 31 Figure 11: Timing of Resetting Module .................................................................................................... 32 Figure 12: LED_WWAN# Signal Reference Circuit Diagram ................................................................... 33 Figure 13: WAKE# Behavior .................................................................................................................... 34 Figure 14: Dimensions of the Receptacle RF Connectors (Unit: mm) ..................................................... 38 Figure 15: Mechanicals of U.FL-LP Mating Plugs ................................................................................... 38 Figure 16: Space Factor of Mating Plugs (Unit: mm) ............................................................................... 39 Figure 17: Mechanical Dimensions of EC200T Mini PCIe ....................................................................... 52 Figure 18: Standard Dimensions of Mini PCI Express ............................................................................. 53 Figure 19: Dimensions of the Mini PCI Express Connector (Molex 679105700) ..................................... 54 EC200T_Series_Mini_PCIe_Hardware_Design 7 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 1 Introduction This document defines EC200T Series Mini PCIe module, and describes its air interfaces and hardware interfaces which are connected with customers applications. This document helps customers quickly understand module interface specifications, electrical characteristics, mechanical specifications and other related information of the module. To facilitate application designs, it also includes some reference designs for customers reference. The document, coupled with application notes and user guides, makes it easy to design and set up wireless applications with EC200T Series Mini PCIe. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202011EC200TAU. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

GSM850 :8.571dBi GSM1900 :10.03dBi LTE Band2/25:11.000dBi EC200T_Series_Mini_PCIe_Hardware_Design 8 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design WCDMA Band II/LTE Band2/ LTE Band 7 :8.000dBi WCDMA Band IV/ LTE Band 4 / LTE Band 66:5.000dBi WCDMA Band V / LTE Band 5:9.541dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 configurations. If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR202011EC200TAU or Contains FCC ID: XMR202011EC200TAU must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. EC200T_Series_Mini_PCIe_Hardware_Design 9 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. EC200T_Series_Mini_PCIe_Hardware_Design 10 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC200T Series Mini PCIe module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. EC200T_Series_Mini_PCIe_Hardware_Design 11 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design EC200T_Series_Mini_PCIe_Hardware_Design 12 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 2 Product Concept 2.1. General Description Intelligent Meter Reading System EC200T Series Mini PCIe module provides data connectivity on LTE-FDD, LTE-TDD, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks with PCI Express Mini Card 1.2 standard interface. It supports embedded operating systems such as Linux, Android, etc., and also provides audio, high-speed data transmission for customers applications. EC200T Series Mini PCIe module can be applied in the following fields:

PDA and Laptop Computer Remote Monitor System Wireless POS System Wireless Router and Switch Other Wireless Terminal Devices This chapter generally introduces the following aspects of EC200T Series Mini PCIe module:

Product Series Key Features Functional Diagram EC200T_Series_Mini_PCIe_Hardware_Design 13 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 2.2. Description of Module Series EC200T Series Mini PCIe series contains 3 variants, and are listed in the following table. Table 1: Description of EC200T Series Mini PCIe Module Series Description Support LTE-FDD (with receive diversity) 1): B1/B3/B5/B8 Support LTE-TDD (with receive diversity) 1): B34/B38/B39/B40/B41 Support WCDMA: B1/B5/B8 Support GSM: 900/1800MHz Support digital audio Support LTE-FDD (with receive diversity) 1): B1/B3/B7/B8/B20/B28 Support LTE-TDD (with receive diversity) 1): B38/B40/B41 Support WCDMA: B1/B8 Support GSM: 900/1800MHz Support digital audio Support LTE-FDD (with receive diversity) 1): B1/B2/B3/B4/B5/B7/B8/B28/B66 Support LTE-TDD (with receive diversity) 1): B40 Support WCDMA: B1/B2/B4/B5/B8 Support GSM: 850/900/1800/1900MHz Support digital audio EC200T-CN Mini PCIe EC200T-EU Mini PCIe EC200T-AU Mini PCIe*

NOTES 1. 2. 1) Rx-diversity is optional.

* means under development. 2.3. Key Features The following table describes the detailed features of EC200T Series Mini PCIe module. Table 2: Key Features of EC200T Series Mini PCIe Features Description Function Interface PCI Express Mini Card 1.2 Standard Interface EC200T_Series_Mini_PCIe_Hardware_Design 14 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Power Supply Supply voltage: 3.03.6 V Typical supply voltage: 3.3 V Class 4 (33dBm2dB) for EGSM900 Class 1 (30dBm2dB) for DCS1800 Class E2 (27dBm3dB) for EGSM900 8-PSK Class E2 (26dBm3dB) for DCS1800 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm2dB) for LTE-FDD bands Class 3 (23dBm2dB) for LTE-TDD bands Support up to 3GPP R8 non-CA Cat 4 FDD and TDD Support 1.4/3/5/10/15/20MHz RF bandwidth Support MIMO in DL direction FDD: Max 150Mbps (DL), Max 50Mbps (UL) TDD: Max 130Mbps (DL), Max 30Mbps (UL) Support 3GPP R7 HSPA+, HSDPA, HSUPA and WCDMA Support QPSK and 16-QAM modulation HSDPA+: Max 21Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384kbps (UL), Max 384kbps (DL) GPRS:

Support GPRS multi-slot class 12 Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 85.6kbps (DL), Max 85.6kbps (UL) Transmitting Power LTE Features UMTS Features GSM Features EDGE:

Support EDGE multi-slot class 12 Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: MCS 1-9 Uplink coding schemes: MCS 1-9 Max 236.8kbps (DL), Max 236.8kbps (UL) Support protocols TCP/UDP/PPP/NTP/NITZ/FTP/HTTP/PING/CMUX/

HTTPS/FTPS/SSL/FILE/MQTT/MMS*/SMTP*/SMTPS*

Support PAP and CHAP for PPP connections Internet Protocol Features SMS Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: (U)SIM card currently

(U)SIM Interface Support USIM/SIM card: 1.8 V, 3.0 V UART Interface Main UART:

Support RTS and CTS hardware flow control Baud rate can reach up to 230400bps, 115200bps by default Used for AT command communication and data transmission EC200T_Series_Mini_PCIe_Hardware_Design 15 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Audio Features PCM Interface USB Interface Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB Support echo cancellation and noise suppression Used for audio function with external codec Support 16-bit linear data format Support short frame synchronization Support master and slave modes Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, software debugging, and firmware upgrade Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.65.4, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc. Antenna Connectors Include main antenna and diversity antenna connectors Rx-diversity (Optional) Support LTE Rx-diversity AT Commands Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Physical Characteristics Temperature Range Size: (51.00.15)mm (30.00.15)mm (4.90.2)mm Weight: approx. 9.7g Operating temperature range: -35C to +75C 1) Extended temperature range: -40C to +80C 2) Storage temperature range: -40C to +90C Firmware Upgrade Upgrade via USB interface or FOTA RoHS All hardware components are fully compliant with EU RoHS directive 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again.

* means under development. NOTES 1. 2. 3. EC200T_Series_Mini_PCIe_Hardware_Design 16 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 2.4. Functional Diagram The following figure shows the block diagram of EC200T Series Mini PCIe. Boost Circuit VBAT I n t e r f a c e M n i i P C I E x p r e s s VCC USB PCM&I2C UART

(U)SIM W_DISABLE#

PERST#

DTR WAKE#

RI LED_WWAN#

EC200T Module Main Antenna Connector Diversity Antenna Connector Main Antenna Diversity Antenna Figure 1: Functional Diagram EC200T_Series_Mini_PCIe_Hardware_Design 17 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 3 Application Interfaces The physical connections and signal levels of EC200T Series Mini PCIe comply with PCI Express Mini Card Electromechanical Specification. This chapter mainly describes the definition and application of the following interfaces/pins of EC200T Series Mini PCIe. Power supply USB interface UART interface PCM and I2C interfaces Control and indication pins

(U)SIM interface 3.1. Pin Assignment The following figure shows the pin assignment of EC200T Series Mini PCIe module. The top side contains EC200T module and antenna connectors. Pin Name Pin No. Pin No. PIN1 PIN2 TOP BOT PIN51 PIN52 WAKE#

RESERVED RESERVED RESERVED GND UART_RX UART_TX GND RESERVED RI GND UART_CTS UART_RTS GND GND DTR GND GND RESERVED VCC_3V3 VCC_3V3 GND PCM_CLK PCM_DOUT PCM_DIN PCM_SYNC 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 Pin Name VCC_3V3 GND NC USIM_VDD USIM_DATA USIM_CLK USIM_RST RESERVED GND W_DISABLE#

PERST#

RESERVED GND NC I2C_SCL I2C_SDA GND USB_DM USB_DP GND LED_WWAN#

USIM_DET RESERVED NC GND VCC_3V3 Figure 2: Pin Assignment EC200T_Series_Mini_PCIe_Hardware_Design 18 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 3.2. Pin Description The following tables show the pin definition and description of the 52 pins on EC200T Series Mini PCIe. Table 3: I/O Parameters Definition Type DI DO IO OC OD PI PO Description Digital Input Digital Output Bidirectional Open Collector Open drain Power Input Power Output Table 4: Pin Description Mini PCI Express Standard Name EC200T Series Mini PCIe Pin Name Pin No. I/O Description Comment WAKE#

WAKE#

OC Wake up the module. 3.3Vaux VCC_3V3 PI Power supply for the module COEX1 RESERVED Reserved GND GND Mini card ground COEX2 RESERVED Reserved 1.5V NC Not connected CLKREQ#

RESERVED Reserved UIM_PWR USIM_VDD PO

(U)SIM card power supply GND GND Mini card ground 1 2 3 4 5 6 7 8 9 EC200T_Series_Mini_PCIe_Hardware_Design 19 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design UIM_DATA USIM_DATA

(U)SIM card data REFCLK-

UART_RX receive UIM_CLK USIM_CLK DO

(U)SIM card clock REFCLK+

UART_TX DO transmit UIM_RESET USIM_RST DO

(U)SIM card reset GND GND Mini card ground UIM_VPP RESERVED Reserved RESERVED RI DO Ring indication GND GND Mini card ground RESERVED RESERVED Reserved W_DISABLE#

W_DISABLE#

20 DI Airplane mode control GND GND 21 Mini card ground PERST#

PERST#

22 DI Module reset PERn0 UART_CTS DI clear to send 3.3Vaux RESERVED Reserved PERp0 UART_RTS DO request to send GND GND 1.5V GND GND GND NC GND Mini card ground Mini card ground Not connected Mini card ground SMB_CLK I2C_SCL 30 OD I2C serial clock 10 11 12 13 14 15 16 17 18 19 23 24 25 26 27 28 29 IO DI Connect to DTEs TX. Connect to DTEs RX. Pulled up by default. Active low. Pulled up by default. Active low. Connect to DTEs RTS. Connect to DTEs CTS. Require external pull-up to 1.8V. EC200T_Series_Mini_PCIe_Hardware_Design 20 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design PETn0 DTR 31 DI Data terminal ready SMB_DATA I2C_SDA 32 OD I2C serial data PETp0 RESERVED Reserved GND GND GND GND Mini card ground Mini card ground USB_D-

USB_DM 36 IO USB differential data (-) GND GND 37 Mini card ground USB_D+

USB_DP 38 IO USB differential data (+) Require external pull-up to 1.8V. Require differential impedance of 90. Require differential impedance of 90. LED_WWAN#

LED_WWAN#

42 OC Active low 3.3Vaux VCC_3V3 GND GND 3.3Vaux VCC_3V3 GND GND LED_WLAN#

USIM_DET RESERVED PCM_CLK LED_WPAN#

RESERVED Power supply for the module Mini card ground Power supply for the module LED signal for indicating the network status of the module Mini card ground

(U)SIM card hot-plug detect PCM clock Reserved RESERVED PCM_DOUT DO PCM data output 1.5V NC Not connected RESERVED PCM_DIN DI PCM data input GND GND Mini card ground EC200T_Series_Mini_PCIe_Hardware_Design 21 / 54 33 34 35 39 40 41 43 44 45 46 47 48 49 50 PI PI DI IO LTE Standard Module Series EC200T Series Mini PCIe Hardware Design RESERVED PCM_SYNC 3.3Vaux VCC_3V3 51 52 IO PI PCM data frame sync Power supply for the module NOTE Keep all NC, reserved and unused pins unconnected. 3.3. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters. Table 5: Overview of Operating Modes Mode Details Normal Operation Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. Minimum Functionality Mode AT+CFUN=0 command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. Airplane Mode AT+CFUN=4 command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. Sleep Mode In this mode, the current consumption of the module will be reduced to the minimal level. In this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. 3.4. Power Saving 3.4.1. Sleep Mode EC200T Series Mini PCIe is able to reduce its current consumption to a minimum value in sleep mode. There are three preconditions must be met to make the module enter sleep mode. Execute AT+QSCLK=1 to enable sleep mode. Ensure the DTR is kept at high level or be kept open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. EC200T_Series_Mini_PCIe_Hardware_Design 22 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 3.4.2. Airplane Mode When the module enters airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. For more details, please refer to Chapter 3.10.3. 3.5. Power Supply The following table shows pin definition of VCC_3V3 pins and ground pins. Table 6: Definition of VCC_3V3 and GND Pins Pin Name Pin No. I/O Power Domain Description VCC_3V3 2, 39, 41, 52 PI 3.0 V3.6 V Power supply for the module GND Mini card ground 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 The typical supply voltage of EC200T Series Mini PCIe is 3.3 V. In the 2G network, the input peak current may reach 2.7 A during the transmitting time. Therefore, the power supply must be able to provide a rated output current of 2.7 A at least, and a bypass capacitor of no less than 470 F with low ESR should be used to prevent the voltage from dropping. If the switching power supply is used to supply power to the module, the power device and power supply routing traces of the switching power supply should be kept away from the antennas as much as possible to prevent EMI interference. The following figure shows a reference design of power supply where R2 and R3 are 1% tolerance resistors and C3 is a low-ESR capacitor. EC200T_Series_Mini_PCIe_Hardware_Design 23 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design LDO_IN D1 C1 C2 MIC29302WU U1 2 IN R1 N E OUT 4 J D A D N G TVS 470 F 100 nF 51K 1 3 5 82K 1%

R4 C3 C4 C5 C6 470R 470 F 100 nF 33 pF 10 pF R2 R3 47K 1%

VCC_3V3 Figure 3: Reference Circuit of Power Supply R5 4.7K MCU_POWER _ON/OFF R6 47K 3.6. (U)SIM Interface EC200T Series Mini PCIes (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported. The following table shows the pin definition of (U)SIM interface. Table 7: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Power Domain Description USIM_VDD USIM_DATA USIM_CLK USIM_RST USIM_DET 8 10 12 14 44 PO 1.8 V/3.0 V

(U)SIM card power supply IO DO 1.8 V/3.0 V

(U)SIM card data 1.8 V/3.0 V

(U)SIM card clock DO 1.8 V/3.0 V

(U)SIM card reset DI 1.8 V

(U)SIM card hot-plug detect EC200T Series Mini PCIe supports (U)SIM card hot-plug via the USIM_DET pin. The function supports low level and high level detections. By default, It is disabled, and can be configured via AT+QSIMDET command. Please refer to document [2] for details about the command. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. EC200T_Series_Mini_PCIe_Hardware_Design 24 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Module GND USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA USIM_VDD 15K 100 nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33 pF 33 pF 33 pF GND GND GND Figure 4: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Module GND USIM_VDD USIM_RST USIM_CLK USIM_DATA USIM_VDD 15K 33 pF 33 pF 33 pF 100 nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 0R 0R 0R 0R 0R 0R GND GND Figure 5: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers applications, please follow the criteria below in (U)SIM circuit design:

EC200T_Series_Mini_PCIe_Hardware_Design 25 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and power supply traces. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode with parasitic capacitance not exceeding 15 pF. The 0 resistors should be added in series between the module and the (U)SIM card connector so as to facilitate debugging. The 33 pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 3.7. USB Interface EC200T Series Mini PCIe provides one integrated Universal Serial Bus (USB) interface which complies with USB 2.0 specification. It can only be used as a slave device. Meanwhile, it supports high speed

(480Mbps) mode and full speed (12Mbps) mode. The USB interface is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface. Table 8: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_DM USB_DP 36 38 IO USB 2.0 differential data (-) Require differential impedance of 90 IO USB 2.0 differential data (+) Require differential impedance of 90 The following figure shows a reference circuit of USB interface. EC200T_Series_Mini_PCIe_Hardware_Design 26 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Minimize these stubs Test Points Module USB_DM USB_DP GND NM_0R NM_0R R3 R4 L1 ESD Array Close to Module MCU USB_DM USB_DP GND Figure 6: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner layer with ground shielding on not only upper and lower layers but also right and left sides. Special attention should be paid to the selection of ESD device on the USB data line. Its parasitic capacitance should not exceed 2 pF and should be placed as close as possible to the USB interface. 3.8. UART Interface The following table shows the pin definition of the main UART interface. The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps and 230400bps baud rates, and the default is 115200bps. This interface supports RTS and CTS hardware flow control, and be used for AT command communication and data transmission. EC200T_Series_Mini_PCIe_Hardware_Design 27 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design The following table shows the pin definition of the main UART interface. Table 9: Pin Definition of Main UART Interface Pin Name Pin No. I/O Power Domain Description UART_RX UART_TX UART_CTS UART_RTS DI 3.3 V DO 3.3 V DI DO 3.3 V 3.3 V receive transmit clear to send request to send The signal level of main UART interface is 3.3 V. When connecting to the peripheral MCU/RAM, customers need to pay attention to the signal direction. The reference circuit is as follows:

11 13 23 25 TXD RXD RTS CTS GND MCU/ARM Module UART_TXD UART_RXD UART_RTS UART_CTS GND Voltage level: 3.3 V Voltage level: 3.3 V Figure 7: Reference Circuit of Power Supply 3.9. PCM and I2C Interfaces EC200T Series Mini PCIe provides one Pulse Code Modulation (PCM) digital interface and one I2C interface. The following table shows the pin definition of PCM and I2C interfaces that can be applied in audio codec design. EC200T_Series_Mini_PCIe_Hardware_Design 28 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Table 10: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Power Domain Description PCM_CLK PCM_DOUT PCM_DIN PCM_SYNC I2C_SCL I2C_SDA 45 47 49 51 30 32 IO DO DI IO 1.8 V 1.8 V 1.8 V 1.8 V OD 1.8 V OD 1.8 V PCM clock signal PCM data output PCM data input PCM data frame sync I2C serial clock. Require external pull-up to 1.8 V. I2C serial data. Require external pull-up to 1.8 V. EC200T Series Mini PCIe provides one PCM digital interface, which supports 16-bit linear data format and the primary mode (short frame synchronization, works as either master or slave). In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK at 8kHz PCM_SYNC, and also supports 4096kHz PCM_CLK at 16kHz PCM_SYNC. The following figure shows the timing relationship in primary mode with 8kHz PCM_SYNC and 2048kHz PCM_CLK. Figure 8: Timing in Primary Mode EC200T_Series_Mini_PCIe_Hardware_Design 29 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. The following figure shows a reference design of PCM interface with an external codec IC. Figure 9: Reference Circuit of PCM Application with Audio Codec NOTE It is recommended to reserve an RC (R=22, C=22pF) circuit on the PCM signal lines, especially for PCM_CLK. 3.10. Control and Indication Signals The following table shows the pin definition of control and indication signals. Table 11: Pin Definition of Control and Indication Signals Pin Name Pin No. I/O Power Domain Description RI DTR DO 3.3 V Ring indication DI 3.3 V Data terminal ready W_DISABLE#

20 DI 3.3 V PERST#

DI 3.3 V Airplane mode control;

Pulled up by default;

Active low. Module reset ;

Active low. 17 31 22 42 LED_WWAN#

OC LED signal for indicating the network EC200T_Series_Mini_PCIe_Hardware_Design 30 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design WAKE#

1 OC Wake up the module. status of the module;

Active low. 3.10.1. RI Signal The RI signal can be used to wake up the host. When a URC returns, there will be the following behaviors on the RI pin after executing AT+QCFG="risignaltype","physical". Figure 10: RI Behaviors 3.10.2. DTR Signal The DTR signal is used for sleep mode control. It is pulled up by default. When module is in sleep mode, driving it low can wake up the module. For more details about the preconditions for module to enter sleep mode, please refer to Chapter 3.4.1. 3.10.3. W_DISABLE# Signal EC200T Series Mini PCIe provides a W_DISABLE# signal to disable or enable the RF function. The W_DISABLE# pin is pulled up by default. Its control function for airplane mode is disabled by default, and AT+QCFG=airplanecontrol,1 can be used to enable the function. Driving it low can make the module enter airplane mode. The RF function can also be enabled or disabled through AT commands AT+CFUN, and the details are as follows. Table 12: Airplane Mode Controlled by Hardware Method W_DISABLE#

RF Function Status Module Operation Mode High level Low level RF enabled Normal mode RF disabled Airplane mode EC200T_Series_Mini_PCIe_Hardware_Design 31 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Software method can be controlled by AT+CFUN, and the details are as follows. Table 13: Airplane Mode Controlled by Software Method AT+CFUN=?

RF Function Status Module Operation Mode RF and (U)SIM disabled Minimum functionality mode RF enabled Normal mode RF disabled Airplane mode 3.10.4. PERST# Signal The PERST# signal can be used to force a hardware reset on the card. The module can be reset by driving the PERST# signal low for at least 300ms and then releasing it. The PERST# signal is sensitive to interference. The traces should be as short as possible and be surrounded with ground. The reset scenario is illustrated in the following figure. VBAT PERST#

Module Status 300ms VIL0.5V Running Baseband resetting Baseband restart Figure 11: Timing of Resetting Module 1. Please ensure that there is no large capacitance with the max value exceeding 10nF on PERST# pin. 2. PEREST# only resets the internal baseband chip of the module and does not reset the power management chip. EC200T_Series_Mini_PCIe_Hardware_Design 32 / 54 0 1 4 NOTES LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 3.10.5. LED_WWAN# Signal The LED_WWAN# signal of EC200T Series Mini PCIe is used to indicate the network status of the module, and can absorb a current up to 40mA. According to the following circuit, in order to reduce the current of the LED, a resistor must be placed in series with the LED. The LED is emitting light when the LED_WWAN# output signal is low. Figure 12: LED_WWAN# Signal Reference Circuit Diagram There are two indication modes for LED_WWAN# signal to indicate network status, which can be switched through following AT commands:

AT+QCFG="ledmode",0 (Default setting) AT+QCFG="ledmode",2 The following tables show the detailed network status indications of the LED_WWAN# signal. Table 14: Indications of Network Status (AT+QCFG="ledmode",0, Default Setting) Pin Status Description Flicker slowly (200ms Low/1800ms High) Network searching Flicker slowly (1800ms Low/200ms High) Idle Flicker quickly (125ms Low/125ms High) Data transfer is ongoing Always Low Voice calling Table 15: Indications of Network Status (AT+QCFG="ledmode",2) Pin Status Description Low Level (Light ON) Registered on network successfully High Impedance (Light OFF) No network coverage or not registered W_DISABLE# signal is at low level. (Disable RF) EC200T_Series_Mini_PCIe_Hardware_Design 33 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design AT+CFUN=0, AT+CFUN=4 3.10.6. WAKE# Signal The WAKE# signal is an open collector signal which is similar to RI signal, but a host pull-up resistor and AT+QCFG="risignaltype","physical" command are required. When a URC returns, a 120ms low level pulse will be outputted. The state of WAKE# signal is shown as below. Figure 13: WAKE# Behavior EC200T_Series_Mini_PCIe_Hardware_Design 34 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 4 Antenna Connection 4.1. Antenna Connectors EC200T Series Mini PCIe is mounted with two antenna connectors for external antenna connection: a main antenna connector and an Rx-diversity antenna connector. And Rx-diversity function is enabled by default. The impedance of the antenna connectors is 50. 4.1.1. Operating Frequency Table 16: EC200T-CN Mini PCIe Operating Frequencies Receive 925960 869894 925960 869894 925960 17101785 18051880 WCDMA B1 19201980 21102170 3GPP Band EGSM900 DCS1800 WCDMA B5 WCDMA B8 Transmit 880915 824849 880915 LTE-FDD B1 19201980 21102170 LTE-FDD B3 17101785 18051880 LTE-FDD B5 LTE-FDD B8 824849 880915 LTE-TDD B34 20102025 20102025 LTE-TDD B38 25702620 25702620 LTE-TDD B39 18801920 18801920 LTE-TDD B40 23002400 23002400 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EC200T_Series_Mini_PCIe_Hardware_Design 35 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design LTE-TDD B41 25552655 25552655 MHz Table 17: EC200T-EU Mini PCIe Operating Frequencies 3GPP Band EGSM900 DCS1800 Transmit 880915 Receive 925960 17101785 18051880 WCDMA B1 19201980 21102170 WCDMA B8 880915 925960 LTE-FDD B1 19201980 21102170 LTE-FDD B3 17101785 18051880 LTE-FDD B7 25002570 26202690 LTE-FDD B8 LTE-FDD B201) LTE-FDD B28 880915 832862 703748 925960 791821 758803 LTE-TDD B38 25702620 25702620 LTE-TDD B40 23002400 23002400 LTE-TDD B41 25552655 25552655 Table 18: EC200T-AU Mini PCIe* Operating Frequencies 3GPP Band Transmit EGSM900 GSM850 DCS1800 PCS1900 880915 824849 Receive 925960 869894 17101785 18051880 18501910 19301990 WCDMA B1 19201980 21102170 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz EC200T_Series_Mini_PCIe_Hardware_Design 36 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design WCDMA B2 18501910 19301990 WCDMA B4 17101755 21102155 WCDMA B5 WCDMA B8 824849 880915 869894 925960 LTE-FDD B1 19201980 21102170 LTE-FDD B2 18501910 19301990 LTE-FDD B3 17101785 18051880 LTE-FDD B4 17101755 21102155 LTE-FDD B5 824849 869894 LTE-FDD B7 25002570 26202690 LTE-FDD B8 LTE-FDD B28 880915 703748 925960 758803 LTE-TDD B40 23002400 23002400 LTE-TDD B66 17101780 21102200 4.2. Antenna Requirements MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz The following table shows the requirements on main antenna and Rx-diversity antenna. Table 19: Antenna Requirements Type Requirements GSM/UMTS/LTE VSWR: 2 Efficiency: > 30%

Max input power: 50W Input impedance: 50 Cable insertion loss: < 1dB

(EGSM900, WCDMA B5/B8, LTE-FDD B5/B8/B20/B28) Cable insertion loss: < 1.5dB

(DCS1800, WCDMA B1, LTE B1/B3/B34/B39) Cable insertion loss: < 2dB EC200T_Series_Mini_PCIe_Hardware_Design 37 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design

(LTE-FDD B7, LTE-TDD B38/B40/B41) 4.3. Recommended Mating Plugs for Antenna Connection EC200T Series Mini PCIe is mounted with RF connectors (receptacles) for convenient antenna connection. The dimensions of the antenna connectors are shown as below. Figure 14: Dimensions of the Receptacle RF Connectors (Unit: mm) U.FL-LP mating plugs listed in the following figure can be used to match the receptacles. Figure 15: Mechanicals of U.FL-LP Mating Plugs EC200T_Series_Mini_PCIe_Hardware_Design 38 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design The following figure describes the space factor of mating plugs. Figure 16: Space Factor of Mating Plugs (Unit: mm) For more details of the recommended mating plugs, please visit http://www.hirose.com. EC200T_Series_Mini_PCIe_Hardware_Design 39 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 5 Reliability, Radio and Electrical Characteristics 5.1. General Description This chapter mainly describes the following electrical and radio characteristics of EC200T Series Mini PCIe:

Power supply requirements RF characteristics ESD characteristics I/O requirements 5.2. Power Supply Requirements The input voltage of EC200T Series Mini PCIe is 3.0V3.6V, as specified by PCI Express Mini CEM Specifications 1.2. The following table shows the power supply requirements of EC200T Series Mini PCIe. Table 20: Power Supply Requirements Parameter Description Min. Typ. Max. VCC_3V3 Power Supply 3.0 3.3 3.6 Unit V EC200T_Series_Mini_PCIe_Hardware_Design 40 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 5.3. I/O Requirements The following table shows the I/O requirements of EC200T Series Mini PCIe. Table 21: I/O Requirements Parameter Description Min. Max. Unit Input High Voltage 0.7 VCC_3V3 VCC_3V3 + 0.3 Input Low Voltage

-0.3 0.3 VCC_3V3 Output High Voltage VCC_3V3 - 0.5 VCC_3V3 Output Low Voltage 0 0.4 V V V V 1. The PCM and I2C interfaces belong to 1.8 V power domain and other I/O interfaces belong to 3.3 V power domain. 2. The maximum voltage value of VIL for PERST# signal and W_DISABLE# signal is 0.5 V. 5.4. RF Characteristics The following tables show the conducted RF output power and receiving sensitivity of EC200T Series Mini PCIe module. VIH VIL VOH VOL NOTES Table 22: Conducted RF Output Power of EC200T Series Mini PCIe Frequency Bands Max. Min. EGSM900 DCS1800 33dBm2dB 5dBm5dB 30dBm2dB 0dBm5dB EGSM900 (8-PSK) 27dBm3dB 5dBm5dB DCS1800 (8-PSK) 26dBm3dB 0dBm5dB WCDMA B1/B5/B8 24dBm+1/-3dB

< -49dBm EC200T_Series_Mini_PCIe_Hardware_Design 41 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design LTE-FDD B1/B3/B5/B7/B8/B20/B28 23dBm2dB

< -39dBm LTE-TDD B34/B38/B39/B40/B41 23dBm2dB

< -39dBm Table 23: Conducted RF Receiving Sensitivity of EC200T-CN Mini PCIe Frequency EGSM900 DCS1800 Receiving Sensitivity (Typ.) Primary Diversity SIMO

-108dBm NA

-108dBm NA WCDMA B1

-108dBm NA WCDMA B5

-109dBm NA WCDMA B8

-110dBm NA 3GPP (SIMO)

-102dBm

-102dBm

-106.7dBm

-104.7dBm

-103.7dBm NA NA NA NA NA LTE-FDD B1 (10MHz)

-97dBm

-98.5dBm

-100dBm

-96.3dBm LTE-FDD B3 (10MHz)

-97.5dBm

-97.5dBm

-100.5dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98dBm

-99dBm

-101dBm

-94.3dBm LTE-FDD B8 (10MHz)

-98dBm

-98dBm

-101dBm

-93.3dBm LTE-TDD B34 (10MHz)

-96.5dBm

-97dBm

-100dBm

-96.3dBm LTE-TDD B38 (10MHz)

-97dBm

-97.5dBm

-100dBm

-96.3dBm LTE-TDD B39 (10MHz)

-97dBm

-97.5dBm

-100dBm

-96.3dBm LTE-TDD B40 (10MHz)

-97dBm

-97dBm

-100dBm

-96.3dBm LTE-TDD B41 (10MHz)

-96dBm

-97dBm

-99dBm

-94.3dBm Table 24: Conducted RF Receiving Sensitivity of EC200T-EU Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) EGSM900 DCS1800

-108dBm

-108.6dBm /

-102.0dBm

-102.0dbm EC200T_Series_Mini_PCIe_Hardware_Design 42 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design WCDMA B1

-108dBm

WCDMA B5 2) TBD NA WCDMA B8

-108dBm

NA

-106.7dBm

-104.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.2dBm

-98.0dBm

-101.8dBm

-96.3dBm LTE-FDD B3 (10MHz)

-97.8dBm

-97.5dBm

-100.5dBm

-93.3dBm LTE-FDD B5 2) (10MHz) TBD TBD TBD

-94.3dBm LTE-FDD B7 (10MHz)

-96.5dBm

-96.5dBm

-99.5dBm

-94.3dBm LTE-FDD B8 (10MHz)

-98.2dBm

-98.5dBm

-101 dBm

-93.3dBm LTE-FDD B20 2) (10MHz)

-97.7dBm

-97dBm

-100.9dBm

-93.3dBm LTE-FDD B28 (10MHz)

-97.2dBm

-97dBm

-100dBm

-94.8dBm LTE-TDD B38 (10MHz)

-97.7dBm

-97.0dBm

-101dBm

-96.3dBm LTE-TDD B40 (10MHz)

-98dBm

-98.0dBm

-101dBm

-96.3dBm LTE-TDD B41 (10MHz)

-97.5dBm

-97.0dBm

-100dBm

-94.3dBm Table 25: Conducted RF Receiving Sensitivity of EC200T-AU Mini PCIe*

Frequency GSM850 EGSM900 DCS1800 DCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 Receiving Sensitivity (Typ.) Primary Diversity SIMO 3GPP (SIMO) TBD TBD TBD TBD TBD TBD TBD TBD NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA

-102 dBm

-102 dBm

-102 dBm

-102 dBm

-106.7 dBm

-104.7 dBm

-106.7 dBm

-104.7 dBm EC200T_Series_Mini_PCIe_Hardware_Design 43 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design WCDMA B8 TBD

-103.7 dBm NA TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD NA TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

-96.3 dBm

-94.3 dBm

-93.3 dBm

-96.3 dBm

-94.3 dBm

-94.3 dBm

-93.3 dBm

-94.8 dBm

-96.3 dBm

-96.3 dBm LTE-FDD B1 (10 MHz) TBD LTE-FDD B2 (10 MHz) TBD LTE-FDD B3 (10 MHz) TBD LTE-FDD B4 (10 MHz) TBD LTE-FDD B5 (10 MHz) TBD LTE-FDD B7 (10 MHz) TBD LTE-FDD B8 (10 MHz) TBD LTE-TDD B28 (10 MHz) TBD LTE-TDD B40 (10 MHz) TBD LTE-TDD B66 (10 MHz) TBD NOTES 1. 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve receiving performance. 5.5. ESD Characteristics The following table shows the ESD characteristics of EC200T Series Mini PCIe. Table 26: ESD Characteristics of EC200T Series Mini PCIe Tested Interfaces Contact Discharge Air Discharge Unit Power Supply and GND Antenna Interfaces Others

+/-5

+/-4

+/-0.5

+/-10

+/-8

+/-1 kV kV kV EC200T_Series_Mini_PCIe_Hardware_Design 44 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 5.6. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table Table 27: Operation and Storage Temperatures Parameter Operation Temperature Range 1) Extended Operation Range 2) Storage Temperature Range Min.

-35

-40

-40 Typ.

+25 Max.

+75

+85

+90 Unit C C C NOTE 1. 2. 1) Within the operation temperature range, the module is 3GPP compliant. 2) Within the extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. 5.7. Current Consumption The following table shows the current consumption of EC200T Series Mini PCIe. The current consumption of EC200T-AU Mini PCIe* will appear in the next version. Table 28: EC200T-CN Mini PCIe Current Consumption Description Conditions Sleep state AT+CFUN=0 (USB disconnected) EGSM900 @ DRX=2 (USB disconnected) Typ. 3.23 6.45 Unit mA mA EC200T_Series_Mini_PCIe_Hardware_Design 45 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design EGSM900 @ DRX=5 (USB disconnected) EGSM900 @ DRX=5 (USB suspend) EGSM900 @ DRX=9 (USB disconnected) DCS1800 @ DRX=2 (USB disconnected) DCS1800 @ DRX=5 (USB disconnected) DCS1800 @ DRX=5 (USB suspend) DCS1800 @ DRX=9 (USB disconnected) WCDMA @ PF=64 (USB disconnected) WCDMA @ PF=64 (USB suspend) WCDMA @ PF=128 (USB disconnected) WCDMA @ PF=256 (USB disconnected) WCDMA @ PF=512 (USB disconnected) LTE-FDD @ PF=32 (USB disconnected) LTE-FDD @ PF=64 (USB disconnected) LTE-FDD @ PF=64 (USB suspend) LTE-FDD @ PF=128 (USB disconnected) LTE-FDD @ PF=256 (USB disconnected) LTE-TDD @ PF=32 (USB disconnected) LTE-TDD @ PF=64 (USB disconnected) LTE-TDD @ PF=64 (USB suspend) LTE-TDD @ PF=128 (USB disconnected) LTE-TDD @ PF=256 (USB disconnected) EGSM900 DRX=5 (USB disconnected) 5.66 6.10 5.77 6.03 5.37 5.80 6.38 7.16 7.02 6.50 6.33 6.34 7.64 6.08 6.11 5.58 5.91 8.63 6.96 6.92 6.43 6.31 45.05 68.67 49.08 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle state EGSM900 DRX=5 (USB connected) WCDMA @ PF=64 (USB disconnected) EC200T_Series_Mini_PCIe_Hardware_Design 46 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design WCDMA @ PF=64 (USB connected) LTE-FDD @ PF=64 (USB disconnected) LTE-FDD @ PF=64 (USB connected) LTE-TDD @ PF=64 (USB disconnected) LTE-TDD @ PF=64 (USB connected) EGSM900 4DL/1UL @ 31.37 dBm EGSM900 3DL/2UL @ 31.32 dBm EGSM900 2DL/3UL @ 30.22 dBm EGSM900 1DL/4UL @ 28.15 dBm DCS1800 4DL/1UL @ 29.57 dBm DCS1800 3DL/2UL @ 29.59 dBm DCS1800 2DL/3UL @ 28.09 dBm DCS1800 1DL/4UL @ 26.16 dBm EGSM900 4DL/1UL @ 28.05 dBm EGSM900 3DL/2UL @ 27.72 dBm EGSM900 2DL/3UL @ 24.16 dBm EGSM900 1DL/4UL @ 21.98 dBm DCS1800 4DL/1UL @ 26.53 dBm DCS1800 3DL/2UL @ 26.27 dBm DCS1800 2DL/3UL @ 24.69 dBm DCS1800 1DL/4UL @ 22.00 dBm WCDMA B1 HSDPA @ 23.63 dBm GPRS data transfer EDGE data transfer WCDMA data transfer WCDMA B1 HSUPA @ 22.45 dBm WCDMA B5 HSDPA @ 23.08 dBm WCDMA B5 HSUPA @ 21.56 dBm 69.77 48.11 69.07 49.16 69.88 331.2 559.5 689.4 707.4 297.5 492.5 579.0 606.1 290.0 474.3 610.0 740.2 238.4 377.2 490.1 594.5 850.39 847.89 741.16 717.72 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC200T_Series_Mini_PCIe_Hardware_Design 47 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design WCDMA B8 HSDPA @ 22.47 dBm WCDMA B8 HSUPA @ 21.17 dBm LTE-FDD B1 @ 22.46 dBm LTE-FDD B3 @ 22.15 dBm LTE-FDD B5 @ 22.84 dBm LTE-FDD B8 @ 22.49 dBm LTE-TDD B34 @ 22.78 dBm LTE-TDD B38 @ 22.51 dBm LTE-TDD B39 @ 22.48 dBm LTE-TDD B40 @ 23.19 dBm LTE-TDD B41 @ 21.83 dBm EGSM900 PCL=5 @ 31.47 dBm EGSM900 PCL=12 @ 18.77 dBm EGSM900 PCL=19 @ 5.00 dBm DCS1800 PCL=0 @ 29.67 dBm DCS1800 PCL=7 @ 16.59 dBm DCS1800 PCL=15 @ 0.92 dBm WCDMA B1 @ 23.15 dBm WCDMA B5 @ 22.16 dBm WCDMA B8 @ 21.45 dBm LTE data transfer GSM voice call WCDMA voice call 843.54 824.58 828.24 841.85 750.57 878.72 435.50 483.14 410.16 549.74 514.43 344.5 165.3 133.9 308.4 158.3 131.5 802.36 708.40 801.31 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Table 29: EC200T-EU Mini PCIe Current Consumption Description Conditions Sleep state AT+CFUN=0 (USB disconnected) EGSM900 @ DRX=2 (USB disconnected) Typ. 3.25 5.59 Unit mA mA EC200T_Series_Mini_PCIe_Hardware_Design 48 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design EGSM900 @ DRX=5 (USB disconnected) 4.26 EGSM900 @ DRX=5 (USB suspend) EGSM900 @ DRX=9 (USB disconnected) DCS1800 @ DRX=2 (USB disconnected) DCS1800 @ DRX=5 (USB disconnected) DCS1800 @ DRX=5 (USB suspend) DCS1800 @ DRX=9 (USB disconnected) WCDMA @ PF=64 (USB disconnected) WCDMA @ PF=64 (USB suspend) WCDMA @ PF=128 (USB disconnected) WCDMA @ PF=256 (USB disconnected) WCDMA @ PF=512 (USB disconnected) LTE-FDD @ PF=32 (USB disconnected) LTE-FDD @ PF=64 (USB disconnected) LTE-FDD @ PF=64 (USB suspend) LTE-FDD @ PF=128 (USB disconnected) LTE-FDD @ PF=256 (USB disconnected) LTE-TDD @ PF=32 (USB disconnected) LTE-TDD @ PF=64 (USB disconnected) LTE-TDD @ PF=64 (USB suspend) LTE-TDD @ PF=128 (USB disconnected) LTE-TDD @ PF=256 (USB disconnected) EGSM900 DRX=5 (USB disconnected) mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 4.58 3.99 5.71 4.24 4.64 3.73 5.94 6.15 4.45 3.72 3.45 7.29 5.46 5.66 4.22 3.48 7.69 5.94 6.12 4.71 4.24 48.69 73.96 54.88 Idle state EGSM900 DRX=5 (USB connected) WCDMA @ PF=64 (USB disconnected) EC200T_Series_Mini_PCIe_Hardware_Design 49 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design WCDMA @ PF=64 (USB connected) 74.74 LTE-FDD @ PF=64 (USB disconnected) 52.94 LTE-FDD @ PF=64 (USB connected) 73.83 LTE-TDD @ PF=64 (USB disconnected) 51.45 LTE-TDD @ PF=64 (USB connected) mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 74.27 367.6 605.7 671.4 682.7 299.8 476.1 558.7 582.5 298.4 470.2 628.7 766.2 243.6 370.4 493.4 612.9 866.1 855.5 762.1 744.9 GPRS data transfer EDGE data transfer EGSM900 4DL/1UL @ 33.01dBm EGSM900 3DL/2UL @ 32.93 dBm EGSM900 2DL/3UL @ 30.91 dBm EGSM900 1DL/4UL @ 28.95 dBm DCS1800 4DL/1UL @ 29.74 dBm DCS1800 3DL/2UL @ 29.82 dBm DCS1800 2DL/3UL @ 28.35 dBm DCS1800 1DL/4UL @ 26.35 dBm EGSM900 4DL/1UL @ 26.09 dBm EGSM900 3DL/2UL @ 25.45 dBm EGSM900 2DL/3UL @ 23.43 dBm EGSM900 1DL/4UL @ 20.82 dBm DCS1800 4DL/1UL @ 25.27 dBm DCS1800 3DL/2UL @ 25.14 dBm DCS1800 2DL/3UL @ 23.49 dBm DCS1800 1DL/4UL @ 20.92 dBm WCDMA B1 HSDPA @ 23.79 dBm WCDMA data transfer WCDMA B1 HSUPA @ 23.29 dBm WCDMA B8 HSDPA @ 23.71 dBm WCDMA B8 HSUPA @ 22.87 dBm EC200T_Series_Mini_PCIe_Hardware_Design 50 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design LTE-FDD B1 @ 23.08 dBm LTE-FDD B3 @ 23.69 dBm LTE-FDD B7 @ 23.98 dBm LTE-FDD B8 @ 23.16 dBm LTE-FDD B20 @ 23.18 dBm LTE-FDD B28 @ 23.21 dBm LTE-TDD B38 @ 23.13 dBm LTE-TDD B40 @ 22.72 dBm LTE-TDD B41 @ 23.29 dBm EGSM900 PCL=5 @ 33.14 dBm EGSM900 PCL=12 @ 19.51 dBm EGSM900 PCL=19 @ 5.59 dBm DCS1800 PCL=0 @ 30.20 dBm DCS1800 PCL=7 @ 17.04 dBm DCS1800 PCL=15 @ 1.08 dBm LTE data transfer GSM voice call WCDMA voice call WCDMA B1 @ 23.51 dBm WCDMA B8 @ 23.32 dBm 1016 961.1 1089 865.1 876.7 967.6 484.7 513.8 510.9 363.7 164.1 133.6 296.7 154.3 128.7 822.5 726.5 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC200T_Series_Mini_PCIe_Hardware_Design 51 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 6 Dimensions and Packaging 6.1. General Description This chapter mainly describes mechanical dimensions as well as packaging specification of EC200T Series Mini PCIe module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.05mm unless otherwise specified. 6.2. Mechanical Dimensions of EC200T Series Mini PCIe 30.000.15 24.200.20 3x3.000.10 5.980.10 2x2.600.1 0.610.05 2.350.10 8.250.10 5.450.10 6.380.10 6.350.10 34.300.20 48.050.20 4.900.20 50.950.15 1.400.10 9.900.10 7.260.10 1.000.10 Side View 4.000.10 Pin1 Pin51 Top View 10.350.10 Figure 17: Mechanical Dimensions of EC200T Series Mini PCIe EC200T_Series_Mini_PCIe_Hardware_Design 52 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 6.3. Standard Dimensions of Mini PCI Express The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1]

for Detail A and Detail B. Figure 18: Standard Dimensions of Mini PCI Express EC200T_Series_Mini_PCIe_Hardware_Design 53 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design EC200T Series Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives and standards listed in the document [1]. The following figure takes the Molex 679105700 as an example. Figure 19: Dimensions of the Mini PCI Express Connector (Molex 679105700) 6.4. Packaging Specifications EC200T Series Mini PCIe modules are packaged in a tray. Each tray contains 10 modules. The smallest package of EC200T Series Mini PCIe contains 100 modules. EC200T_Series_Mini_PCIe_Hardware_Design 54 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design 7 Appendix References Table 30: Related Documents SN. Document Name Remark

[1]

PCI Express Mini Card Electromechanical Specification Revision 1.2 PCI Express Mini Card Electromechanical Specification

[2]

Quectel_EC200T-CN_AT_Commands_Manual_v1.0 EC200T AT commands manual Table 31: Terms and Abbreviations Abbreviation Description AMR bps CS CTS FOTA DL DTE DTR EFR EMI ESD ESR FDD Adaptive Multi-rate Bits Per Second Coding Scheme Clear to Send Firmware Upgrade Over-The-Air Down Link Data Terminal Equipment Data Terminal Ready Enhanced Full Rate Electro Magnetic Interference Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplexing EC200T_Series_Mini_PCIe_Hardware_Design 55 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Full Rate Gaussian Minimum Shift Keying Global System for Mobile Communications Half Rate High Speed Packet Access HSUPA High Speed Uplink Packet Access FR GMSK GSM HR HSPA kbps LED LTE Mbps MCU ME MIMO MMS MO MT PCM PDA PDU POS PPP RF RTS Rx Kilo Bits Per Second Light Emitting Diode Long-Term Evolution Million Bits Per Second Micro Control Unit Mobile Equipment Multiple-Input Multiple-Output Multimedia Messaging Service Mobile Originated Mobile Terminated Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Point of Sale Point-to-Point Protocol Radio Frequency Ready To Send Receive SIMO Single Input Multiple Output EC200T_Series_Mini_PCIe_Hardware_Design 56 / 54 LTE Standard Module Series EC200T Series Mini PCIe Hardware Design Short Message Service Transmitting Direction Transient Voltage Suppressor Uplink Unsolicited Result Code Universal Serial Bus Universal Asynchronous Receiver & Transmitter

(Universal) Subscriber Identification Module Wideband Code Division Multiple Access Wireless Local Area Networks SMS TX TVS UART UL URC USB

(U)SIM WCDMA WLAN EC200T_Series_Mini_PCIe_Hardware_Design 57 / 54

EC200T-AU Series Hardware Design LTE Standard Module Series Version: 1.1 Date: 2020-08-10 Status: Released www.quectel.com LTE Standard Module Series EC200T Series Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm or email to support@quectel.com. GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. DISCLAIMER WHILE QUECTEL HAS MADE EFFORTS TO ENSURE THAT THE FUNCTIONS AND FEATURES UNDER DEVELOPMENT ARE FREE FROM ERRORS, IT IS POSSIBLE THAT THESE FUNCTIONS AND FEATURES COULD CONTAIN ERRORS, INACCURACIES AND OMISSIONS. UNLESS OTHERWISE PROVIDED BY VALID AGREEMENT, QUECTEL MAKES NO WARRANTIES OF ANY KIND, IMPLIED OR EXPRESS, WITH RESPECT TO THE USE OF FEATURES AND FUNCTIONS UNDER DEVELOPMENT. TO THE MAXIMUM EXTENT PERMITTED BY LAW, QUECTEL EXCLUDES ALL LIABILITY FOR ANY LOSS OR DAMAGE SUFFERED IN CONNECTION WITH THE USE OF THE FUNCTIONS AND FEATURES UNDER DEVELOPMENT, REGARDLESS OF WHETHER SUCH LOSS OR DAMAGE MAY HAVE BEEN FORESEEABLE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCING, DISSEMINATING AND EDITING THIS DOCUMENT AS WELL AS USING THE CONTENT WITHOUT PERMISSION ARE FORBIDDEN. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved. EC200T_Series_Hardware_Design 1 / 90 LTE Standard Module Series EC200T Series Hardware Design About the Document Revision History Version Date Author Description 1.0 2019-09-12 Jaye SANG/

Niko WU Initial 1.1 2020-08-10 Jaye SANG/

Owen WEI

(Chapter 3.12). 8. The AT command used for configuring MAIN_RI 1. Added related information of EC200T-AU. 2. Deleted B5 of EC200T-EU. 3. Updated the storage of SMS (Table 2) 4. Updated the pin assignment diagram (Figure 2). 5. Updated the pin description (Table 5). 6. Added the note of connecting between RTS and CTS pins between module and MCU for hardware flow control (Chapter 3.10). 7. Updated the comments of SD card interface pins behavior (Chapter 3.17). 9. Updated the electrostatics discharge characteristics (25 C, 45% Relative Humidity) of VBAT, GND pins and all antenna interfaces (Table 41). 10. Updated the description of module storage

(Chapter 7.1) 11. Update the description of manufacturing and soldering (Chapter 7.2). EC200T_Series_Hardware_Design 2 / 90 LTE Standard Module Series EC200T Series Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 3 Table Index ............................................................................................................................................... 5 Figure Index .............................................................................................................................................. 7 Introduction ....................................................................................................................................... 9 1 1.1. Safety Information ................................................................................................................. 12 2 Product Concept ............................................................................................................................. 14 2.1. General Description .............................................................................................................. 14 Key Features ......................................................................................................................... 15 2.2. Functional Diagram ............................................................................................................... 18 2.3. 2.4. Evaluation Board ................................................................................................................... 18 3 Application Interfaces ..................................................................................................................... 19 3.1. General Description .............................................................................................................. 19 3.2. Pin Assignment ..................................................................................................................... 20 3.3. Pin Description ...................................................................................................................... 21 3.4. Operating Modes .................................................................................................................. 29 3.5. Power Saving ........................................................................................................................ 29 3.5.1. Sleep Mode.................................................................................................................. 29 3.5.1.1. UART Application ............................................................................................... 30 3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 30 3.5.1.3. USB Application with USB Suspend/Resume and MAIN_RI Wakeup Function . 31 3.5.1.4. USB Application without USB Suspend Function ............................................... 32 3.5.2. Airplane Mode .............................................................................................................. 32 Power Supply ........................................................................................................................ 33 3.6.1. Power Supply Pins ....................................................................................................... 33 3.6.2. Decrease Voltage Drop ................................................................................................ 33 3.6.3. Reference Design for Power Supply ............................................................................ 34 Power-on/off/Reset Scenarios .............................................................................................. 35 Turn on Module Using the PWRKEY ........................................................................... 35 Turn off Module ............................................................................................................ 37 Turn off Module Using the PWRKEY Pin ........................................................... 38 Turn off Module Using AT Command ................................................................. 38 3.7.3. Reset the Module ......................................................................................................... 38

(U)SIM Interface .................................................................................................................... 40 3.8. 3.9. USB Interface ........................................................................................................................ 43 3.10. UART Interfaces .................................................................................................................... 44 3.11. PCM and I2C Interfaces ........................................................................................................ 47 3.12. SD Card Interface ................................................................................................................. 49 3.13. WLAN Interface* ................................................................................................................ 51 3.14. ADC Interfaces ...................................................................................................................... 52 3.15. Network Status Indication ...................................................................................................... 53 3.16. STATUS ................................................................................................................................ 54 3.7.2.1. 3.7.2.2. 3.7.1. 3.7.2. 3.6. 3.7. EC200T_Series_Hardware_Design 3 / 90 LTE Standard Module Series EC200T Series Hardware Design 4.2. 3.17. Behaviors of the MAIN_RI ..................................................................................................... 55 3.18. FORCE_USB_BOOT Interface ............................................................................................. 55 4 Antenna Interfaces .......................................................................................................................... 58 4.1. Main/Rx-diversity Antenna Interfaces .................................................................................... 58 4.1.1. Pin Definition ................................................................................................................ 58 4.1.2. Operating Frequency ................................................................................................... 58 4.1.3. Reference Design of RF Antenna Interface ................................................................. 61 4.1.4. Reference Design of RF Layout ................................................................................... 61 Antenna Installation ............................................................................................................... 63 4.2.1. Antenna Requirement .................................................................................................. 63 4.2.2. Recommended RF Connector for Antenna Installation ................................................ 64 5 Electrical, Reliability and Radio Characteristics .......................................................................... 66 5.1. Absolute Maximum Ratings .................................................................................................. 66 5.2. Power Supply Ratings ........................................................................................................... 67 5.3. Operating and Storage Temperatures ................................................................................... 67 Current Consumption ............................................................................................................ 68 5.4. 5.5. RF Output Power .................................................................................................................. 79 RF Receiving Sensitivity ....................................................................................................... 81 5.6. 5.7. Electrostatic Discharge ......................................................................................................... 83 6 Mechanical Dimensions.................................................................................................................. 85 6.1. Mechanical Dimensions of the Module.................................................................................. 85 Recommended Footprint ....................................................................................................... 87 6.2. 6.3. Design Effect Drawings of the Module .................................................................................. 88 7 Storage, Manufacturing and Packaging ........................................................................................ 89 7.1. Storage.................................................................................................................................. 89 7.2. Manufacturing and Soldering ................................................................................................ 90 7.3. Packaging ............................................................................................................................. 92 8 Appendix A References .................................................................................................................. 94 9 Appendix B GPRS Coding Schemes ............................................................................................. 98 10 Appendix C GPRS Multi-slot Classes ............................................................................................ 99 11 Appendix D EDGE Modulation and Coding Schemes ................................................................ 101 EC200T_Series_Hardware_Design 4 / 90 LTE Standard Module Series EC200T Series Hardware Design Table Index Table 1: Frequency Bands of EC200T-CN Module .................................................................................. 14 Table 2: Frequency Bands of EC200T-EU Module .................................................................................. 14 Table 3: Frequency Bands of EC200T-AU* Module ................................................................................. 15 Table 4: Key Features of EC200T series Module .................................................................................... 15 Table 5: I/O Parameters Definition ........................................................................................................... 21 Table 6: Pin Description ........................................................................................................................... 21 Table 7: Overview of Operating Modes ................................................................................................... 29 Table 8: Power Supply and GND Pins ..................................................................................................... 33 Table 9: Pin Description of PWRKEY ...................................................................................................... 35 Table 10: Pin Description of RESET_N ................................................................................................... 39 Table 11: Pin Definition of (U)SIM Interface ............................................................................................. 40 Table 12: Pin Description of USB Interface ............................................................................................. 43 Table 13: Pin Definition of Main UART Interface ..................................................................................... 44 Table 14: Pin Definition of Debug UART Interface ................................................................................... 45 Table 15: Logic Levels of Digital I/O ........................................................................................................ 45 Table 16: Pin Definition of PCM and I2C Interfaces ................................................................................. 48 Table 17: Pin Definition of SD Card Interface .......................................................................................... 49 Table 18: Pin Definition of WLAN Interface ............................................................................................. 51 Table 19: Pin Definition of ADC Interfaces ............................................................................................... 52 Table 20: Characteristic of the ADC ......................................................................................................... 52 Table 21: Pin Definition of Network Connection Status/Activity Indication ............................................... 53 Table 22: Working State of Network Connection Status/Activity Indication .............................................. 53 Table 23: Pin Definition of STATUS ......................................................................................................... 54 Table 24: Behaviors of the MAIN_RI ....................................................................................................... 55 Table 25: Pin Definition of FORCE_USB_BOOT Interface ...................................................................... 56 Table 26: Pin Definition of RF Antennas .................................................................................................. 58 Table 27: EC200T-CN Operating Frequencies ........................................................................................ 58 Table 28: EC200T-EU Operating Frequencies ........................................................................................ 59 Table 29: EC200T-AU* Operating Frequencies ....................................................................................... 60 Table 30: Antenna Requirements ............................................................................................................ 63 Table 31: Absolute Maximum Ratings ..................................................................................................... 66 Table 32: The Module Power Supply Ratings .......................................................................................... 67 Table 33: Operating and Storage Temperatures ...................................................................................... 67 Table 34: EC200T-CN Current Consumption .......................................................................................... 68 Table 35EC200T-EU Current Consumption ......................................................................................... 71 Table 36EC200T-AU Current Consumption ......................................................................................... 75 Table 37: EC200T-CN RF Output Power ................................................................................................. 79 Table 38: EC200T-EU RF Output Power ................................................................................................. 80 Table 39: EC200T-AU* RF Output Power ................................................................................................ 80 EC200T_Series_Hardware_Design 5 / 90 LTE Standard Module Series EC200T Series Hardware Design Table 40: EC200T-CN Conducted RF Receiving Sensitivity .................................................................... 81 Table 41: EC200T-EU Conducted RF Receiving Sensitivity .................................................................... 82 Table 42: EC200T-AU* Conducted RF Receiving Sensitivity .................................................................. 82 Table 43: Electrostatics Discharge Characteristics (25 C, 45% Relative Humidity) ................................ 84 Table 44: Recommended Thermal Profile Parameters ............................................................................ 91 Table 45: Related Documents ................................................................................................................. 94 Table 46: Terms and Abbreviations .......................................................................................................... 94 Table 47: Description of Different Coding Schemes ................................................................................ 98 Table 48: GPRS Multi-slot Classes .......................................................................................................... 99 Table 49: EDGE Modulation and Coding Schemes ............................................................................... 101 EC200T_Series_Hardware_Design 6 / 90 LTE Standard Module Series EC200T Series Hardware Design Figure Index Figure 2: EC200T Series Module Pin Assignment (Top View) ................................................................. 20 Figure 3: Sleep Mode Application via UART ............................................................................................ 30 Figure 4: Sleep Mode Application with USB Remote Wakeup ................................................................. 31 Figure 5: Sleep Mode Application with MAIN_RI ..................................................................................... 31 Figure 6: Sleep Mode Application without Suspend Function .................................................................. 32 Figure 7: Power Supply Limits during Burst Transmission ...................................................................... 34 Figure 8: Star Structure of Power Supply ................................................................................................ 34 Figure 9: Reference Circuit of Power Supply .......................................................................................... 35 Figure 10: Reference Circuit of Turing on the Module Using Driving Circuit ............................................ 36 Figure 11: Reference Circuit of Turing on the Module Using Keystroke .................................................. 36 Figure 12: Timing of Turning on Module .................................................................................................. 37 Figure 13: Timing of Turning off Module .................................................................................................. 38 Figure 14: Reference Circuit of Resetting the Module by Using Driving Circuit ....................................... 39 Figure 15: Reference Circuit of Resetting the Module by Using Keystroke ............................................. 39 Figure 16: Timing of Resetting Module .................................................................................................... 40 Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector ......................... 41 Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector ........................... 42 Figure 19: Reference Circuit of USB Application ..................................................................................... 43 Figure 20: Reference Circuit with Translator Chip ................................................................................... 46 Figure 21: Reference Circuit with Transistor Circuit ................................................................................ 46 Figure 22: Primary Mode Timing ............................................................................................................. 47 Figure 23: Reference Circuit of PCM Application with Audio Codec ........................................................ 48 Figure 24: Reference Circuit of SD Card Interface .................................................................................. 50 Figure 25: Reference Circuit of Network Status Indication ...................................................................... 54 Figure 26: Reference Circuits of STATUS ............................................................................................... 54 Figure 27: Reference Circuit of FORCE_USB_BOOT Interface .............................................................. 56 Figure 28: Timing Sequence for Entering Emergency Download Mode .................................................. 56 Figure 29: Reference Circuit of RF Antenna Interface ............................................................................. 61 Figure 30: Microstrip Design on a 2-layer PCB ....................................................................................... 62 Figure 31: Coplanar Waveguide Design on a 2-layer PCB ...................................................................... 62 Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ................... 62 Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ................... 63 Figure 34: Dimensions of U.FL-R-SMT Connector (Unit: mm) ................................................................ 64 Figure 35: Mechanicals of U.FL-LP Connectors ...................................................................................... 65 Figure 36: Space Factor of Mated Connector (Unit: mm) ........................................................................ 65 Figure 37: Module Top and Side Dimensions .......................................................................................... 85 Figure 38: Module Bottom Dimensions (Bottom View) ............................................................................ 86 Figure 39: Recommended Footprint (Top View) ...................................................................................... 87 Figure 40: Top View of the Module .......................................................................................................... 88 Figure 41: Bottom View of the Module .................................................................................................... 88 Figure 42: Recommended Reflow Soldering Thermal Profile .................................................................. 90 EC200T_Series_Hardware_Design 7 / 90 LTE Standard Module Series EC200T Series Hardware Design Figure 43: Tape Specifications ................................................................................................................. 92 Figure 44: Reel Specifications ................................................................................................................. 92 Figure 45: Tape and Reel Directions ....................................................................................................... 93 EC200T_Series_Hardware_Design 8 / 90 LTE Standard Module Series EC200T Series Hardware Design 1 Introduction This document defines the EC200T series module and describes its air interface and hardware interfaces which are connected with your applications. This document can help you quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC200T series module. Associated with application note and user guide, you can use EC200T series module to design and set up wireless applications easily. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202011EC200TAU. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

GSM850 :8.571dBi GSM1900 :10.03dBi LTE Band2/25:11.000dBi EC200T_Series_Hardware_Design 9 / 90 LTE Standard Module Series EC200T Series Hardware Design WCDMA Band II/LTE Band2/ LTE Band 7 :8.000dBi WCDMA Band IV/ LTE Band 4 / LTE Band 66:5.000dBi WCDMA Band V / LTE Band 5:9.541dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 configurations. If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR202011EC200TAU or Contains FCC ID: XMR202011EC200TAU must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. EC200T_Series_Hardware_Design 10 / 90 LTE Standard Module Series EC200T Series Hardware Design The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. EC200T_Series_Hardware_Design 11 / 90 LTE Standard Module Series EC200T Series Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC200T series module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergent help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. EC200T_Series_Hardware_Design 12 / 90 LTE Standard Module Series EC200T Series Hardware Design In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as mobile phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders. EC200T_Series_Hardware_Design 13 / 90 LTE Standard Module Series EC200T Series Hardware Design 2 Product Concept 2.1. General Description EC200T is a series of LTE-FDD, LTE-TDD, WCDMA and GSM wireless communication module with receive diversity, which provides data connectivity on LTE-FDD, LTE-TDD, HSDPA, HSUPA, HSPA+, WCDMA, EDGE and GPRS networks. It also provides voice functionality for your specific applications. EC200T series contains 3 variants: EC200T-CN, EC200T-EU and EC200T-AU*. You can choose a dedicated type based on the region or operator. The following table shows the frequency bands of EC200T series module. Table 1: Frequency Bands of EC200T-CN Module Network Type Bands LTE-FDD (with Rx-diversity)1) B1/B3/B5/B8 LTE-TDD (with Rx-diversity)1) B34/B38/B39/B40/B41 WCDMA GSM B1/B5/B8 900/1800MHz Table 2: Frequency Bands of EC200T-EU Module Network Type Bands LTE-FDD (with Rx-diversity)1) B1/B3/B7/B8/B20/B28 LTE-TDD (with Rx-diversity)1) B38/B40/B41 WCDMA GSM B1/B8 900/1800MHz EC200T_Series_Hardware_Design 14 / 90 LTE Standard Module Series EC200T Series Hardware Design Table 3: Frequency Bands of EC200T-AU* Module Network Type Bands LTE-FDD (with Rx-diversity)1) B1/B2/B3/B4/B5/B7/B8/B28/B66 LTE-TDD (with Rx-diversity)1) B40 WCDMA GSM B1/B2/B4/B5/B8 850/900/1800/1900 MHz With a compact profile of 29.0 mm 32.0 mm 2.4 mm, EC200T series can meet almost all requirements for M2M applications such as automotive, metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EC200T series is an SMD type module which can be embedded into applications through its 144-pin pads, including 80 LCC signal pads and 64 LGA pads. NOTES 1. 2. 1) Rx-diversity is optional.

* means under development. 2.2. Key Features The following table describes the detailed features of EC200T series module. Table 4: Key Features of EC200T series Module Feature Details Power Supply Supply voltage: 3.44.5 V Typical supply voltage: 3.8 V Transmitting Power Class 4 (33 dBm 2 dB) for EGSM900/GSM850 Class 1 (30 dBm 2 dB) for DCS1800/PCS1900 Class E2 (27 dBm 3 dB) for EGSM900/850 8-PSK Class E2 (26 dBm 3 dB) for DCS1800/PCS1900 8-PSK Class 3 (24 dBm +1/-3 dB) for WCDMA bands Class 3 (23 dBm 2 dB) for LTE-FDD bands Class 3 (23 dBm 2 dB) for LTE-TDD bands EC200T_Series_Hardware_Design 15 / 90 LTE Standard Module Series EC200T Series Hardware Design LTE Features UMTS Features GSM Features Internet Protocol Features SMS Audio Features PCM Interface USB Interface Supports up to non-CA Cat 4 FDD and TDD Supports 1.4/3/5/10/15/20 MHz RF bandwidth Supports MIMO in DL direction FDD: Max. 150 Mbps (DL), Max. 50 Mbps (UL) TDD: Max. 130 Mbps (DL), Max. 30 Mbps (UL) Supports 3GPP R7 HSDPA, HSUPA, HSPA+ and WCDMA Supports QPSK, 16-QAM modulation HSPA+: Max. 21 Mbps (DL) HSUPA: Max. 5.76 Mbps (UL) WCDMA: Max. 384 kbps (DL), Max. 384 kbps (UL) GPRS:

Supports GPRS multi-slot class 12 Coding scheme: CS-1/CS-2/CS-3/CS-4 Max. 85.6 kbps (DL), Max. 85.6 kbps (UL) EDGE:

Supports EDGE multi-slot class 12 Supports GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: MCS 1-9 Uplink coding schemes: MCS 1-9 Max. 236.8 Kbps (DL), Max. 236.8 Kbps (UL) Supports TCP/UDP/PPP/NTP/NITZ/FTP/HTTP/PING/CMUX/HTTPS/FTPS/

SSL/FILE/MQTT/MMS/SMTP*/SMTPS* protocols Supports PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connection Supports one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB Supports echo cancellation and noise suppression Used for audio function with external codec Supports 16-bit linear data format Supports short frame synchronization Supports master and slave modes Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480 Mbps Used debugging, firmware upgrade for AT command communication, data transmission, software Text and PDU mode Point-to-point MO and MT SMS cell broadcast SMS storage: ME&SM

(U)SIM Interface Supports USIM/SIM card: 1.8 V, 3.0 V EC200T_Series_Hardware_Design 16 / 90 LTE Standard Module Series EC200T Series Hardware Design Supports USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6/3.x/4.14.14, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc. Main UART:

Used for AT command communication and data transmission Baud rates reach up to 1 Mbps, 115200 bps by default Supports RTS and CTS hardware flow control UART Interfaces Debug UART:

Used for the output of partial logs 115200 bps baud rate SD Card Interface Supports SD 3.0 protocol WLAN Interface*

Supports SDIO 3.0 interface for WLAN Rx-diversity Supports LTE Rx-diversity AT Commands Network Indication Antenna Interfaces Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands NET_MODE and NET_STATUS used to indicate the network connectivity status Main antenna interface (ANT_MAIN) and Rx-diversity antenna interface

(ANT_DIV) 50 impedance Physical Characteristics Temperature Range Size: (29.0 0.15) mm (32.0 0.15) mm (2.4 0.2) mm Weight: approx. 4.4 g Operation temperature range: -35 C to +75 C1) Extended temperature range: -40 C to +85 C2) Storage temperature range: -40 C to +90 C Firmware Upgrade USB interface or FOTA RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 1) Within operating temperature range, the module is 3GPP compliant. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain functions such as voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again.

* means under development. 3. EC200T_Series_Hardware_Design 17 / 90 LTE Standard Module Series EC200T Series Hardware Design 2.3. Functional Diagram The following figure shows a block diagram of EC200T series and illustrates the major functional parts. Power management Baseband Flash Radio frequency Peripheral interfaces 2.4. Evaluation Board In order to help you develop applications with EC200T series, Quectel provides an evaluation board

(UMTS & LTE EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module. For more details, see document [4]. EC200T_Series_Hardware_Design 18 / 90 LTE Standard Module Series EC200T Series Hardware Design 3 Application Interfaces 3.1. General Description

(U)SIM interface EC200T series is equipped with 80 LCC pins plus 64 LGA pins that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following interfaces. Power supply USB interface UART interfaces PCM and I2C interfaces SD card interface WLAN interface*

ADC interfaces Status indication FORCE_USB_BOOT interface NOTE

* means under development. EC200T_Series_Hardware_Design 19 / 90 LTE Standard Module Series EC200T Series Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC200T series module. Figure 1: EC200T Series Module Pin Assignment (Top View) NOTES network. 1) Pin FORCE_USB_BOOT cannot be pulled up before startup. 1. 2. Other unused and RESERVED pins are kept open, and all GND pins are connected to the ground 3. GND pins 85112 should be connected to ground in the design. RESERVED pins 7384 should not be designed in schematic and PCB decal, and should be served as a keepout area. 4. The WLAN interface function is under development. EC200T_Series_Hardware_Design 20 / 90 LTE Standard Module Series EC200T Series Hardware Design 3.3. Pin Description The following tables show the pin definition of EC200T series module. Table 5: I/O Parameters Definition Type AI AO DI DO IO OD PI PO Description Analog Input Analog Output Digital Input Digital Output Bidirectional Open Drain Power Input Power Output Pin Name Pin No. I/O Description VBAT_BB 59, 60 PI VBAT_RF 57, 58 PI Power supply for modules baseband part Power supply for modules RF part DC Characteristics Comment Vmax = 4.5 V Vmin = 3.4 V Vnorm = 3.8 V Vmax = 4.5 V Vmin = 3.4 V Vnorm = 3.8 V It must be provided with sufficient current up to 0.8 A. It must be provided with sufficient current up to 1.8 A. GND Ground Table 6: Pin Description Power Supply Input 8, 9, 19, 22, 36, 46, 48, 5054, 56, 72, 85112 Power Supply Output EC200T_Series_Hardware_Design 21 / 90 LTE Standard Module Series EC200T Series Hardware Design Pin Name Pin No. I/O Description DC Characteristics Comment VDD_EXT 7 PO Provide 1.8 V for external circuit Vnorm = 1.8 V IOmax = 50 mA Power supply for external GPIOs pull-up circuits. If unused, keep it open. Power on/off Status Indication Pin Name Pin No. I/O Description DC Characteristics Comment RESET_N 20 DI Reset the module VILmax = 0.5 V If unused, keep it open. PWRKEY 21 DI VILmax = 0.5 V VBAT power domain. Turn on/off the module Pin Name Pin No. I/O Description DC Characteristics Comment NET_MODE 5 DO Indicate the modules network registration mode VOHmin = 1.35 V VOLmax = 0.45 V NET_ STATUS 6 DO Indicate the modules network activity status VOHmin = 1.35 V VOLmax = 0.45 V Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 61 OD Indicate the modules operation status USB Interface USB_DP 69 IO USB differential data

(+) USB_DM 70 IO USB differential data

(-) USB_VBUS 71 AI USB connection detect Vmax = 5.25 V Vmin = 3.0 V Vnorm = 5.0 V 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. An external pull-up resistor is required. If unused, keep it open. Require differential impedance of 90 . USB 2.0 compliant. If unused, keep it open. Require differential impedance of 90 . USB 2.0 compliant. If unused, keep it open. Typical: 5.0 V If unused, keep it open. EC200T_Series_Hardware_Design 22 / 90 LTE Standard Module Series EC200T Series Hardware Design

(U)SIM Interface Pin Name Pin No. I/O Description DC Characteristics Comment USIM_GND 10 Specified ground for

(U)SIM USIM_DET 13 DI

(U)SIM card hot-plug detect Connect (U)SIM card connector GND. 1.8 V power domain. If unused, keep it open. Either 1.8 V or 3.0 V

(U)SIM card is supported and can be identified automatically by the module. USIM_VDD 14 PO

(U)SIM card power supply USIM_DATA 15 IO

(U)SIM card data USIM_CLK 16 DO

(U)SIM card clock USIM_RST 17 DO

(U)SIM card reset VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V IOmax = 50 mA For 1.8 V (U)SIM:

Vmax = 1.9 V Vmin = 1.7 V For 3.0 V (U)SIM:

Vmax= 3.05 V Vmin = 2.7 V For 1.8 V (U)SIM:

VILmax = 0.6 V VIHmin = 1.2 V VOLmax = 0.45 V VOHmin = 1.35 V For 3.0 V (U)SIM:

VILmax = 1.0 V VIHmin = 1.95 V VOLmax = 0.45 V VOHmin = 2.55 V For 1.8 V (U)SIM:

VOLmax = 0.45 V VOHmin = 1.35 V For 3.0 V (U)SIM:

VOLmax = 0.45 V VOHmin = 2.55 V For 1.8 V (U)SIM:

VOLmax = 0.45 V VOHmin = 1.35 V For 3.0 V (U)SIM:

VOLmax = 0.45 V VOHmin = 2.55 V EC200T_Series_Hardware_Design 23 / 90 LTE Standard Module Series EC200T Series Hardware Design Main UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment MAIN_RI 62 DO Main UART ring indication VOLmax = 0.45 V VOHmin = 1.35 V MAIN_DCD 63 DO Main UART data carrier detect VOLmax = 0.45 V VOHmin = 1.35 V MAIN_CTS 64 DO Main UART clear to send VOLmax = 0.45 V VOHmin = 1.35 V MAIN_RTS 65 DI Main UART request to send MAIN_DTR 66 DI Main UART data terminal ready MAIN_TXD 67 DO Main UART transmit MAIN_RXD 68 DI Main UART receive Debug UART Interface VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment DBG_RXD 11 DI Debug UART receive DBG_TXD 12 DO Debug UART transmit ADC Interfaces VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment ADC1 44 AI General-purpose ADC interface Voltage range:

0 V to VBAT_BB If unused, keep it open. EC200T_Series_Hardware_Design 24 / 90 LTE Standard Module Series EC200T Series Hardware Design ADC0 45 AI General-purpose ADC interface Voltage range:

0 V to VBAT_BB If unused, keep it open. PCM & I2C Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment PCM_DIN 24 DI PCM data input PCM_DOUT 25 DO PCM data output PCM_SYNC 26 IO PCM data frame sync PCM_CLK 27 IO PCM clock I2C_SCL 41 OD I2C serial clock I2C_SDA 42 OD I2C serial data VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. In master mode, it serves as an output signal. In slave mode, it is used as an input signal. If unused, keep it open. 1.8 V power domain. In master mode, it serves as an output signal. In slave mode, it is used as an input signal. If unused, keep it open. Used for external codec. An external 1.8 V pull-up resistor is required. If unused, keep it open. Used for external codec. An external 1.8 V pull-up resistor is required. If unused, keep it EC200T_Series_Hardware_Design 25 / 90 LTE Standard Module Series EC200T Series Hardware Design SD Card Interface Pin Name Pin No. I/O Description DC Characteristics Comment SD_DET*

23 DI SD card detect SD_SDIO_ DATA3 28 IO SD card SDIO data bit 3 SD_SDIO_ DATA2 29 IO SD card SDIO data bit 2 SD_SDIO_ DATA1 30 IO SD card SDIO data bit 1 SD_SDIO_ DATA0 31 IO SD card SDIO data bit 0 SD_SDIO_ CLK 32 DO SD card SDIO clock SD_SDIO_ CMD 33 IO SD card SDIO command SD_SDIO_ VDD 34 PO SD card SDIO power supply WLAN Interface*

open. 1.8/2.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment WLAN_SLP_ CLK 118 DO WLAN sleep clock If unused, keep it open. EC200T_Series_Hardware_Design 26 / 90 LTE Standard Module Series EC200T Series Hardware Design WLAN_PWR_ EN 127 DO WLAN power supply enable control VOLmax = 0.45 V VOHmin = 1.35 V WLAN_SDIO_ DATA3 129 IO WLAN SDIO data bit 3 WLAN_SDIO_ DATA2 130 IO WLAN SDIO data bit 2 WLAN_SDIO_ DATA1 131 IO WLAN SDIO data bit 1 WLAN_SDIO_ DATA0 132 IO WLAN SDIO data bit 0 WLAN_SDIO_ CLK 133 DO WLAN SDIO clock WLAN_SDIO_ CMD 134 DO WLAN SDIO command VOLmax = 0.45 V VOHmin = 1.35 V WLAN_WAKE 135 DI Wake up the host

(module) WLAN_EN 136 DO WLAN function enable control VOLmax = 0.45 V VOHmin = 1.35 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Wake up the host

(module) by an external Wi-Fi module. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. EC200T_Series_Hardware_Design 27 / 90 LTE Standard Module Series EC200T Series Hardware Design RF Interface Pin Name Pin No. I/O Description DC Characteristics Comment Pin Name Pin No. I/O Description DC Characteristics Comment ANT_DIV 35 AI ANT_MAIN 49 IO Other Interfaces Diversity antenna interface Main antenna interface WAKEUP_IN* 1 DI Wake up the module AP_READY 2 DI Application processor ready W_DISABLE# 4 DI Airplane mode control FORCE_ USB_BOOT 115 DI Force the module into emergency download mode RESERVED Pins VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 50 impedance. If unused, keep it open. 50 impedance. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. Pull-up by default. In low voltage level, module can enter into airplane mode. If unused, keep it open. 1.8 V power domain. Active high. It is recommended to reserve test points. Pin Name Pin No. I/O Description DC Characteristics Comment RESERVED Reserved Keep these pins unconnected. 3, 18, 3740, 43, 47, 55, 7384, 113, 114, 116, 117, 119126, 128, 137144 EC200T_Series_Hardware_Design 28 / 90 LTE Standard Module Series EC200T Series Hardware Design NOTE

* means under development. 3.4. Operating Modes Table 7: Overview of Operating Modes Modes Details The following table briefly outlines the operating modes to be mentioned in the following chapters. Normal Operation Minimum Functionality Mode Airplane Mode Sleep Mode Power Down Mode Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. AT+CFUN=0 can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. AT+CFUN=4 or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. In this mode, the current consumption of the module will be reduced to the minimal level. In this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. In this mode, the power management unit (PMU) shuts down the power supply, software goes inactive and the serial interfaces are not accessible. However, the VBAT_RF and VBAT_BB pins are still powered. 3.5. Power Saving 3.5.1. Sleep Mode EC200T series is able to reduce its current consumption to an ultra-low value in the sleep mode. The following section describes power saving procedures of EC200T series module. EC200T_Series_Hardware_Design 29 / 90 LTE Standard Module Series EC200T Series Hardware Design 3.5.1.1. UART Application If the host communicates with module via UART interface, the following preconditions should be met to let the module enter sleep mode. Execute AT+QSCLK=1 to enable sleep mode. Drive MAIN_DTR to high level. The following figure shows the connection between the module and the host. Module MAIN_RXD MAIN_TXD MAIN_RI MAIN_DTR AP_READY GND Host TXD RXD EINT GPIO GPIO GND Figure 2: Sleep Mode Application via UART Driving MAIN_DTR to low level by host will wake up the module. When EC200T series has a URC to report, the URC will trigger the behavior of MAIN_RI pin. Please refer to Chapter 3.17 for details about MAIN_RI behavior. 3.5.1.2. USB Application with USB Remote Wakeup Function If the host supports USB Suspend/Resume and remote wakeup functions, the following three preconditions must be met to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable the sleep mode. Ensure the MAIN_DTR is kept at high level or kept open. The hosts USB bus, which is connected with the modules USB interface, enters Suspend state. The following figure shows the connection between the module and the host. EC200T_Series_Hardware_Design 30 / 90 LTE Standard Module Series EC200T Series Hardware Design Figure 3: Sleep Mode Application with USB Remote Wakeup Sending data to EC200T series through USB will wake up the module. When EC200T series has a URC to report, the module will send remote wakeup signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and MAIN_RI Wakeup Function If the host supports USB Suspend/Resume, but does not support remote wakeup function, the MAIN_RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode. Execute AT+QSCLK=1 to enable the sleep mode. Ensure the MAIN_DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters Suspend state. The following figure shows the connection between the module and the host. Module USB_VBUS USB_DP USB_DM AP_READY MAIN_RI GND Host VDD USB_DP USB_DM GPIO EINT GND Figure 4: Sleep Mode Application with MAIN_RI Sending data to EC200T series through USB will wake up the module. When EC200T series has a URC to report, the URC will trigger the behavior of MAIN_RI pin. EC200T_Series_Hardware_Design 31 / 90 LTE Standard Module Series EC200T Series Hardware Design 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB Suspend function, please disconnect USB_VBUS with additional control circuit to let the module enter into sleep mode. Execute AT+QSCLK=1 command to enable the sleep mode. Ensure the MAIN_DTR is held at high level or keep it open. Disconnect USB_VBUS. The following figure shows the connection between the module and the host. Module Host Power Switch USB_VBUS USB_DP USB_DM MAIN_RI AP_READY GND GPIO VDD USB_DP USB_DM EINT GPIO GND Figure 5: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. Please pay attention to the level match shown in dotted line between the module and the host. NOTE Hardware:

3.5.2. Airplane Mode When the module enters airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. This mode can be set via the following ways. The W_DISABLE# pin is pulled up by default. Its control function for airplane mode is disabled by default, and AT+QCFG=airplanecontrol,1 can be used to enable the function. Driving it to low level can make the module enter airplane mode. EC200T_Series_Hardware_Design 32 / 90 LTE Standard Module Series EC200T Series Hardware Design Software:

AT+CFUN=<fun> command provides the choice of the functionality level through setting <fun> into 0, 1 or 4. AT+CFUN=0: Minimum functionality mode; both (U)SIM and RF functions are disabled. AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode. RF function is disabled. 3.6. Power Supply 3.6.1. Power Supply Pins EC200T series provides four VBAT pins dedicated to connecting with the external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for modules RF part Two VBAT_BB pins for modules baseband part The following table shows the details of power supply and GND pins. Table 8: Power Supply and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 57, 58 3.4 3.8 4.5 VBAT_BB 59, 60 3.4 3.8 4.5 Power supply for modules RF part Power supply for modules baseband part Ground

0

V V V 8, 9, 19, 22, 36, 46, 48, 5054, 56, 72, 85112 GND 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.4 V to 4.5 V. Please make sure that the input voltage will never drop below 3.4 V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. EC200T_Series_Hardware_Design 33 / 90 LTE Standard Module Series EC200T Series Hardware Design Figure 6: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100 F with low ESR (ESR = 0.7 ) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to the VBAT_BB and VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm; and the width of VBAT_RF trace should be no less than 2 mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to ensure the stability of power source, it is suggested that a TVS diode of which reverse stand-off voltage is 4.7 V and peak pulse power is up to 2550 W should be used. The following figure shows the star structure of the power supply. Figure 7: Star Structure of Power Supply 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2.0 A at least to the module. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. EC200T_Series_Hardware_Design 34 / 90 LTE Standard Module Series EC200T Series Hardware Design The following figure shows a reference design for +5 V input power source. The typical output of the power supply is about 3.8 V and the maximum load current is 3.0 A. Figure 8: Reference Circuit of Power Supply 3.7. Power-on/off/Reset Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 9: Pin Description of PWRKEY I/O DI Pin Name Pin No. Description Comment PWRKEY 21 Turn on/off the module VBAT power domain When EC200T series is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY. A simple reference circuit is illustrated in the following figure. EC200T_Series_Hardware_Design 35 / 90 LTE Standard Module Series EC200T Series Hardware Design Figure 9: Reference Circuit of Turing on the Module Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 10: Reference Circuit of Turing on the Module Using Keystroke EC200T_Series_Hardware_Design 36 / 90 LTE Standard Module Series EC200T Series Hardware Design The timing of turning on the module is illustrated in the following figure. NOTE 1 VBAT 500 ms VIL 0.5 V About 5 ms PWRKEY VDD_EXT RESET_N STATUS

(OD) UART USB FORCE_USB_BOOT About 22 ms 100 ms. After this time, the pin can be set high level by an external circuit. 10 s 10 s 10 s I nactive Inactive Active Active Figure 11: Timing of Turning on Module NOTES no less than 30 ms. 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is 2. PWRKEY can be pulled down directly to GND with a recommended 4.7 k resistor if module needs to be powered on automatically and shutdown is not needed. 3.7.2. Turn off Module The following procedures can be used to turn off the module:

Using the PWRKEY pin. Using AT+QPOWD command. EC200T_Series_Hardware_Design 37 / 90 LTE Standard Module Series EC200T Series Hardware Design 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650 ms, the module will execute power-down procedure after the PWRKEY is released. The timing of turning off the module is illustrated in the following figure. Figure 12: Timing of Turning off Module NOTES 1. 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to the procedure of turning off the module via PWRKEY pin. Please refer to document [2] for details about AT+QPOWD command. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off. 2. When turning off module with the AT command, please keep PWRKEY at a high level after the execution of the command. Otherwise, the module will turn itself back on after being shut down. 3.7.3. Reset the Module The RESET_N pin can be used to reset the module. The module can be reset by pulling the RESET_N pin low for at least 300 ms and then releasing it. The RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground. EC200T_Series_Hardware_Design 38 / 90 LTE Standard Module Series EC200T Series Hardware Design Table 10: Pin Description of RESET_N Pin Name Pin No. Description Comment RESET_N 20 Reset the module 1.8 V power domain The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. RESET_N I/O DI 4.7K 300 ms Reset pulse 47K Figure 13: Reference Circuit of Resetting the Module by Using Driving Circuit Figure 14: Reference Circuit of Resetting the Module by Using Keystroke EC200T_Series_Hardware_Design 39 / 90 LTE Standard Module Series EC200T Series Hardware Design The timing of resetting module is illustrated in the following figure. Figure 15: Timing of Resetting Module NOTES 3. 1. Please ensure that there is no large capacitance with the max value exceeding 10 nF on 2. RESET_N only resets the internal baseband chip of the module and does not reset the power PWRKEY and RESET_N pins. management chip. It is recommended to use RESET_N only when failing to turn off the module by AT+QPOWD command or PWRKEY pin. 3.8. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported. Table 11: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Description Comment USIM_GND 10 Specified ground for (U)SIM USIM_DET 13 DI

(U)SIM card detect USIM_VDD 14 PO

(U)SIM card power supply 1.8 V power domain. If unused, keep it open. Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. EC200T_Series_Hardware_Design 40 / 90 LTE Standard Module Series EC200T Series Hardware Design USIM_DATA 15 IO

(U)SIM card data USIM_CLK 16 DO

(U)SIM card clock USIM_RST 17 DO

(U)SIM card reset EC200T series supports (U)SIM card hot-plug via the USIM_DET pin. The function supports low level and high level detections. By default, It is disabled, and can be configured via AT+QSIMDET command. Please refer to document [2] for details about the command. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. Figure 16: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector EC200T_Series_Hardware_Design 41 / 90 LTE Standard Module Series EC200T Series Hardware Design If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 17: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in your applications, please follow the criteria below in (U)SIM circuit design:

Keep placement of (U)SIM card connector as close to the module as possible. Keep the trace length less than 200 mm as far as possible. Keep (U)SIM card signals away from RF and VBAT traces. Assure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5 mm to maintain the same electric potential. If the ground is complete on your PCB, USIM_GND can be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should not be more than 15 pF. The 0 resistors should be added in series between the module and the (U)SIM card to facilitate debugging. The 33 pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the

(U)SIM card connector. The pull-up resistor on USIM_DATA can improve anti-jamming capability of the (U)SIM card. If the

(U)SIM card traces are too long, or the interference source is relatively close, it is recommended to add a pull-up resistor near the (U)SIM card connector. EC200T_Series_Hardware_Design 42 / 90 LTE Standard Module Series EC200T Series Hardware Design 3.9. USB Interface EC200T series provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports full-speed (12 Mbps) and high-speed (480 Mbps) modes. The USB interface can only serves as a slave device and is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface. Table 12: Pin Description of USB Interface IO IO AI Pin Name Pin No. I/O Description Comment USB_DP 69 USB differential data (+) USB_DM 70 USB differential data (-) Require differential impedance of 90 Require differential impedance of 90 USB_VBUS 71 USB connection detect Typical 5.0 V GND 72 Ground For more details about the USB 2.0 specifications, please visit http://www.usb.org/home. It is recommended to reserve test points for debugging and firmware upgrade in your designs. The following figure shows a reference circuit of USB interface. Figure 18: Reference Circuit of USB Application EC200T_Series_Hardware_Design 43 / 90 LTE Standard Module Series EC200T Series Hardware Design A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1, R3 and R4 components must be placed close to the module, and also resistors R3 and R4 should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90 . Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that layer and ground planes above and below. Please pay attention to the selection of the ESD component on the USB data line. Its parasitic capacitance should not exceed 2 pF and should be placed as close as possible to the USB interface. 3.10. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. The main UART interface supports 4800 bps, 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps, 230400 bps, 460800 bps, 921600 bps and 1 Mbps baud rates, and the default is 115200 bps. This interface is used for data transmission and AT command communication. Also, it supports RTS and CTS hardware flow control. The debug UART interface supports 115200 bps baud rate. It is used for the output of partial logs. The following tables show the pin definition of main UART interface. Table 13: Pin Definition of Main UART Interface Pin Name Pin No. I/O Description Comment MAIN_RI 62 MAIN_DCD 63 DO DO DO MAIN_CTS 64 Main UART clear to send Main UART ring indication Main UART data carrier detect 1.8 V power domain. If unused, keep it open. EC200T_Series_Hardware_Design 44 / 90 LTE Standard Module Series EC200T Series Hardware Design Main UART request to send Main UART data terminal ready Main UART transmit Main UART receive DI DI DO DI MAIN_RTS 65 MAIN_DTR 66 MAIN_TXD MAIN_RXD 67 68 Table 14: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_RXD DBG_TXD 11 12 DI DO Debug UART receive Debug UART transmit 1.8 V power domain. If unused, keep it open. The logic levels are described in the following table. Table 15: Logic Levels of Digital I/O Parameter VIL VIH VOL VOH Min.

-0.3 1.2 0 1.35 Max. 0.6 2.0 0.45 1.8 Unit V V V V The module provides a 1.8 V UART interface. A level translator should be used if the application is equipped with a 3.3 V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. EC200T_Series_Hardware_Design 45 / 90 LTE Standard Module Series EC200T Series Hardware Design Figure 19: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. For the design of circuits in dotted lines, see that of the circuits in solid lines, but please pay attention to the direction of connection. Figure 20: Reference Circuit with Transistor Circuit NOTES to the host RTS. 1. Transistor circuit solution is not suitable for applications with baud rates exceeding 460 kbps. 2. Please note that the module CTS is connected to the host CTS, and the module RTS is connected EC200T_Series_Hardware_Design 46 / 90 LTE Standard Module Series EC200T Series Hardware Design 3.11. PCM and I2C Interfaces EC200T series provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the primary mode (short frame synchronization) and EC200T series works as both master and slave. EC200T series works as a master device pertaining to I2C interface. In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256 kHz, 512 kHz, 1024 kHz or 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4096 kHz PCM_CLK at 16 kHz PCM_SYNC. EC200T series supports 16-bit linear data format. The following figure shows the primary modes timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK. Figure 21: Primary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. EC200T_Series_Hardware_Design 47 / 90 LTE Standard Module Series EC200T Series Hardware Design Table 16: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_DIN 24 DI PCM data input PCM_DOUT 25 DO PCM data output 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. PCM_SYNC 26 IO PCM data frame sync PCM_CLK 27 IO PCM clock I2C_SCL 41 OD I2C serial clock I2C_SDA 42 OD I2C serial data 1.8 V power domain. In master mode, it serves as an output signal. In slave mode, it is used as an input signal. If unused, keep it open. 1.8 V power domain. In master mode, it serves as an output signal. In slave mode, it is used as an input signal. If unused, keep it open. Used for external codec. An external 1.8 V pull-up resistor is required. If unused, keep it open. Used for external codec. An external 1.8 V pull-up resistor is required. If unused, keep it open. Clock and mode can be configured by AT command, and the default configuration is short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. The following figure shows a reference design of PCM interface with external codec IC. Figure 22: Reference Circuit of PCM Application with Audio Codec EC200T_Series_Hardware_Design 48 / 90 LTE Standard Module Series EC200T Series Hardware Design NOTE It is recommended to reserve an RC (R=22 , C=22 pF) circuit on the PCM lines, especially for PCM_CLK. 3.12. SD Card Interface EC200T series provides an SD card interface, which complies with SD 3.0 specification. The following table shows the pin definition of SD card interface. Table 17: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SD_DET*

DI SD card detect SD_SDIO_DATA3 IO SD card SDIO data bit 3 SD_SDIO_DATA2 IO SD card SDIO data bit 2 SD_SDIO_DATA1 IO SD card SDIO data bit 1 SD_SDIO_DATA0 IO SD card SDIO data bit 0 SD_SDIO_CLK DO SD card SDIO clock SD_SDIO_CMD IO SD card SDIO command SD_SDIO_VDD PO SD card SDIO power supply The following figure shows a reference design of SD card interface. 23 28 29 30 31 32 33 34 1.8/2.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. EC200T_Series_Hardware_Design 49 / 90 LTE Standard Module Series EC200T Series Hardware Design Figure 23: Reference Circuit of SD Card Interface In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with:

The voltage range of SD card power supply VDD_3V is 2.73.6 V and a sufficient current up to 0.8 A should be provided. As the maximum output current of SD_SDIO_VDD is 50 mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card. To avoid jitter of bus, resistors R7R11 are needed to pull up the SDIO to SD_SDIO_VDD. Value of these resistors is among 10 k to 100 k and the recommended value is 100 k. SD_SDIO_VDD should be used as the pull-up power. In order to adjust signal quality, it is recommended to add 0 resistors R1R6 in series between the module and the SD card. The bypass capacitors C1C6 are reserved and not mounted by default. All resistors and bypass capacitors should be placed close to the module. In order to offer good ESD protection, it is recommended to add a TVS diode on SD card pins near the SD card connector with junction capacitance less than 15 pF. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data trace is 50 10%. Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of SDIO bus should be less than 15 pF. It is recommended to keep the traces of SD_SDIO_CLK, SD_SDIO_DATA[0:3] and SD_SDIO_CMD with equal length (the difference among them is less than 1 mm) and the total routing length needs to be less than 50 mm. EC200T_Series_Hardware_Design 50 / 90 LTE Standard Module Series EC200T Series Hardware Design 3.13. WLAN Interface*

EC200T series supports a SDIO 3.0 interface for WLAN. The following table shows the pin definition of WLAN interface Table 18: Pin Definition of WLAN Interface Pin Name Pin No. I/O Description Comment WLAN_SLP_CLK 118 DO WLAN sleep clock If unused, keep it open. WLAN_PWR_EN 127 DO WLAN power supply enable control WLAN_SDIO_DATA3 129 WLAN SDIO data bit 3 WLAN_SDIO_DATA2 130 WLAN SDIO data bit 2 WLAN_SDIO_DATA1 131 WLAN SDIO data bit 1 1.8 V power domain If unused, keep it open. IO IO IO IO WLAN_SDIO_DATA0 132 WLAN SDIO data bit 0 WLAN_SDIO_CLK DO WLAN SDIO clock WLAN_SDIO_CMD DO WLAN SDIO command 133 134 Wake up the host

(module) by an external Wi-Fi module. 1.8 V power domain. If unused, keep it open. 1.8 V power domain If unused, keep it open. WLAN_WAKE 135 DI Wake up the host (module) WLAN_EN 136 DO WLAN function enable control As SDIO signals are very high-speed, in order to ensure the SDIO interface design meets SDIO 3.0 specification, please comply with the following principles:

It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 50 10%. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. It is recommended to keep the traces of WLAN_SDIO_CLK, WLAN_SDIO_DATA[0:3] and WLAN_SDIO_CMD with equal length (the difference among them is less than 1 mm) and the total routing length needs to be less than 50 mm. EC200T_Series_Hardware_Design 51 / 90 LTE Standard Module Series EC200T Series Hardware Design Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than 15 pF. NOTE

* means under development. means only QuecOpen scheme support 3.14. ADC Interfaces The module provides two analog-to-digital converter (ADC) interfaces. AT+QADC=0 can be used to read the voltage value on ADC0 pin. AT+QADC=1 can be used to read the voltage value on ADC1 pin. For more details about these AT commands, see document [2]. In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground. Table 19: Pin Definition of ADC Interfaces Pin Name Pin No. Description Comment ADC1 ADC0 44 45 General-purpose ADC interface If unused, keep it open. General-purpose ADC interface If unused, keep it open. The following table describes the characteristic of the ADC function. Table 20: Characteristic of the ADC Parameter Min. Typ. Max. ADC1 Voltage Range ADC0 Voltage Range VBAT_BB VBAT_BB ADC Resolution 12 0 0 Unit V V bits EC200T_Series_Hardware_Design 52 / 90 LTE Standard Module Series EC200T Series Hardware Design 3.15. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two pins which are NET_MODE and NET_STATUS for network status indication. The following tables describe pin definition and logic level changes in different network status. Table 21: Pin Definition of Network Connection Status/Activity Indication Pin Name Pin No. I/O Description Comment NET_MODE 5 DO Indicate the modules network registration mode NET_STATUS 6 DO Indicate the modules network activity status 1.8 V power domain If unused, keep it open. 1.8 V power domain If unused, keep it open. Table 22: Working State of Network Connection Status/Activity Indication Pin Name Logic Level Changes Network Status NET_MODE Always high Always low Registered on LTE network Others Flicker slowly (200 ms high/1800 ms low) Network searching NET_STATUS Flicker slowly (1800 ms high/200 ms low) Idle Flicker quickly (125 ms high/125 ms low) Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure. EC200T_Series_Hardware_Design 53 / 90 LTE Standard Module Series EC200T Series Hardware Design Figure 24: Reference Circuit of Network Status Indication 3.16. STATUS The STATUS pin is an open drain output for modules operation status indication. It can be connected to a GPIO of DTE with a pulled-up resistor, or as an LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 23: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 61 OD Indicate the modules operation status An external pull-up resistor is required. If unused, keep it open. The following figure shows different circuit designs of STATUS, and you can choose either one according to the application demands. Figure 25: Reference Circuits of STATUS EC200T_Series_Hardware_Design 54 / 90 LTE Standard Module Series EC200T Series Hardware Design NOTE NOTE State Idle URC The status pin cannot be used as indication of module shutdown status when VBAT is removed. 3.17. Behaviors of the MAIN_RI AT+QCFG="risignaltype","physical" can be used to configure MAIN_RI behaviors. No matter on which port a URC is presented, the URC will trigger the behaviors of MAIN_RI pin. The URC can be outputted via UART port, USB AT port and USB modem port, which can be set by AT+QURCCFG command. The default port is USB AT port. In addition, MAIN_RI behavior can be configured flexibly. The default behavior of the MAIN_RI is shown as below. Table 24: Behaviors of the MAIN_RI Response MAIN_RI keeps at high level MAIN_RI outputs 120ms low pulse when a new URC returns The MAIN_RI behavior can be changed via AT+QCFG="urc/ri/ring". Please refer to document [2] for details. 3.18. FORCE_USB_BOOT Interface EC200T series provides a FORCE_USB_BOOT pin. You can pull up FORCE_USB_BOOT to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface. EC200T_Series_Hardware_Design 55 / 90 LTE Standard Module Series EC200T Series Hardware Design Table 25: Pin Definition of FORCE_USB_BOOT Interface Pin Name Pin No. I/O Description Comment FORCE_ USB_BOOT 115 DI Force the module into emergency download mode 1.8 V power domain. Active high. It is recommended to reserve test points. The following figure shows a reference circuit of FORCE_USB_BOOT interface. Figure 26: Reference Circuit of FORCE_USB_BOOT Interface NOTE 1 VBAT 500 ms PWRKEY VIL 0.5V VDD_EXT FORCE_ USB_BOOT RESET_N About 5 ms FORCE_USB_BOOT can be pulled up to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. About 22 ms Figure 27: Timing Sequence for Entering Emergency Download Mode EC200T_Series_Hardware_Design 56 / 90 LTE Standard Module Series EC200T Series Hardware Design NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2. When using MCU to control module to enter the emergency download mode, please follow the above timing sequence. It is not recommended to pull up FORCE_USB_BOOT to 1.8 V before powering up VBAT. Directly connect the test points as shown in Figure 27 can manually force the module to enter download mode. EC200T_Series_Hardware_Design 57 / 90 LTE Standard Module Series EC200T Series Hardware Design 4 Antenna Interfaces EC200T series antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect. The antenna ports have an impedance of 50 . 4.1. Main/Rx-diversity Antenna Interfaces 4.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 26: Pin Definition of RF Antennas Pin Name Pin No. I/O Description Comment ANT_DIV 35 Diversity antenna interface 50 impedance If unused, keep it open. ANT_MAIN 49 Main antenna interface 50 impedance AI IO 4.1.2. Operating Frequency Table 27: EC200T-CN Operating Frequencies 17101785 18051880 WCDMA B1 19201980 21102170 3GPP Band EGSM900 DCS1800 WCDMA B5 WCDMA B8 Transmit 880915 824849 880915 Receive 925960 869894 925960 LTE-FDD B1 19201980 21102170 Unit MHz MHz MHz MHz MHz MHz EC200T_Series_Hardware_Design 58 / 90 LTE Standard Module Series EC200T Series Hardware Design LTE-FDD B3 17101785 18051880 LTE-FDD B5 LTE-FDD B8 824849 880915 869894 925960 LTE-TDD B34 20102025 20102025 LTE-TDD B38 25702620 25702620 LTE-TDD B39 18801920 18801920 LTE-TDD B40 23002400 23002400 LTE-TDD B41 25552655 25552655 Table 28: EC200T-EU Operating Frequencies 3GPP Band EGSM900 DCS1800 Transmit 880915 Receive 925960 17101785 18051880 WCDMA B1 19201980 21102170 WCDMA B8 880915 925960 LTE-FDD B1 19201980 21102170 LTE-FDD B3 17101785 18051880 LTE-FDD B7 25002570 26202690 LTE-FDD B8 LTE-FDD B20 LTE-FDD B28 880915 832862 703748 925960 791821 758803 LTE-TDD B38 25702620 25702620 LTE-TDD B40 23002400 23002400 LTE-TDD B41 25552655 25552655 MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EC200T_Series_Hardware_Design 59 / 90 LTE Standard Module Series EC200T Series Hardware Design Table 29: EC200T-AU* Operating Frequencies 3GPP Band Transmit EGSM900 GSM850 DCS1800 PCS1900 880915 824849 Receive 925960 869894 17101785 18051880 18501910 19301990 WCDMA B1 19201980 21102170 WCDMA B2 18501910 19301990 WCDMA B4 17101755 21102155 WCDMA B5 WCDMA B8 824849 880915 869894 925960 LTE-FDD B1 19201980 21102170 LTE-FDD B2 18501910 19301990 LTE-FDD B3 17101785 18051880 LTE-FDD B4 17101755 21102155 LTE-FDD B5 824849 869894 LTE-FDD B7 25002570 26202690 LTE-FDD B8 LTE-FDD B28 880915 703748 925960 758803 LTE-TDD B40 23002400 23002400

* means under development. NOTE Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EC200T_Series_Hardware_Design 60 / 90 LTE Standard Module Series EC200T Series Hardware Design 4.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A -type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 28: Reference Circuit of RF Antenna Interface NOTES receiving sensitivity. as possible. 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the 2. Place the -type matching components (R1 & C1 & C2 and R2 & C3 & C4) as close to the antenna 4.1.4. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled as 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, height from the reference ground to the signal layer (H), and the space between the RF trace and the ground (S). Microstrip and coplanar waveguide are typically used in RF layout to control characteristic impedance. The following figures are reference designs of microstrip or coplanar waveguide with different PCB structures. EC200T_Series_Hardware_Design 61 / 90 LTE Standard Module Series EC200T Series Hardware Design

. Figure 29: Microstrip Design on a 2-layer PCB Figure 30: Coplanar Waveguide Design on a 2-layer PCB Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EC200T_Series_Hardware_Design 62 / 90 LTE Standard Module Series EC200T Series Hardware Design Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:

Use impedance simulation tool to control the characteristic impedance of RF traces as 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right angle traces should be changed to curved ones. There should be clearance area under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). For more details about RF layout, see Document [3]. 4.2. Antenna Installation 4.2.1. Antenna Requirement The following table shows the requirements on main antenna and RX-diversity antenna. Table 30: Antenna Requirements Type Requirements GSM/UMTS/LTE VSWR: 2 Efficiency: > 30%

Max. input power: 50 W EC200T_Series_Hardware_Design 63 / 90 LTE Standard Module Series EC200T Series Hardware Design Input impedance: 50 Cable insertion loss: < 1 dB

(EGSM900, WCDMA B5, WCDMA B8, LTE-FDD B5/B8/B20/B28) Cable insertion loss: < 1.5 dB

(DCS1800, WCDMA B1, LTE B1/B3/B34/B39) Cable insertion loss: < 2 dB

(LTE-TDD B7/B38/B40/B41) 4.2.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 33: Dimensions of U.FL-R-SMT Connector (Unit: mm) EC200T_Series_Hardware_Design 64 / 90 LTE Standard Module Series EC200T Series Hardware Design U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 34: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. Figure 35: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com. EC200T_Series_Hardware_Design 65 / 90 LTE Standard Module Series EC200T Series Hardware Design 5 Electrical, Reliability and Radio Characteristics 5.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage at ADC0 Voltage at ADC1 Min.

-0.3

-0.3 0 0 0 0 Voltage at Digital Pins

-0.3 Max. Unit 6.0 5.5 0.8 1.8 2.3 VBAT_BB VBAT_BB V V A A V V V EC200T_Series_Hardware_Design 66 / 90 LTE Standard Module Series EC200T Series Hardware Design 5.2. Power Supply Ratings Table 32: The Module Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum and maximum values. Voltage drop during burst transmission Maximum power control level on EGSM900. Peak supply current

(during transmission slot) Maximum power control level on EGSM900. VBAT IVBAT 3.4 3.8 4.5 V 400 mV 1.8 2.0 A USB_VBUS USB connection detection 3.0 5.0 5.25 V 5.3. Operating and Storage Temperatures The operating and storage temperatures are listed in the following table. Table 33: Operating and Storage Temperatures Parameter Min. Max. Unit Operation Temperature Range1)

-35 Extended Operation Range2) Storage Temperature Range

-40

-40 Typ.

+25

+75

+85

+90 C C C EC200T_Series_Hardware_Design 67 / 90 LTE Standard Module Series EC200T Series Hardware Design NOTES 1. 2. 1) Within operating temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. 5.4. Current Consumption The following table shows the current consumption of EC200T-CN. Table 34: EC200T-CN Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down IVBAT Sleep state DCS1800 @ DRX = 5 (USB disconnected) AT+CFUN=0 (USB disconnected) EGSM900 @ DRX = 2 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) EGSM900 @ DRX = 5 (USB suspend) EGSM900 @ DRX = 9 (USB disconnected) DCS1800 @ DRX = 2 (USB disconnected) DCS1800 @ DRX = 5 (USB suspend) DCS1800 @ DRX = 9 (USB disconnected) WCDMA @ PF = 64 (USB disconnected) WCDMA @ PF = 64 (USB suspend) WCDMA @ PF = 128 (USB disconnected) WCDMA @ PF = 256 (USB disconnected) 11 1.67 3.04 1.94 2.11 1.64 3.01 1.93 2.08 1.61 3.93 4.08 2.70 2.12 uA mA mA mA mA mA mA mA mA mA mA mA mA mA EC200T_Series_Hardware_Design 68 / 90 LTE Standard Module Series EC200T Series Hardware Design WCDMA @ PF = 512 (USB disconnected) LTE-FDD @ PF = 32 (USB disconnected) LTE-FDD @ PF = 64 (USB disconnected) LTE-FDD @ PF = 64 (USB suspend) LTE-FDD @ PF = 128 (USB disconnected) LTE-FDD @ PF = 256 (USB disconnected) LTE-TDD @ PF = 32 (USB disconnected) LTE-TDD @ PF = 64 (USB disconnected) LTE-TDD @ PF = 64 (USB suspend) LTE-TDD @ PF = 128 (USB disconnected) LTE-TDD @ PF = 256 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) 30.55 EGSM00 @ DRX = 5 (USB connected) WCDMA @ PF = 64 (USB disconnected) WCDMA @ PF = 64 (USB connected) Idle state LTE-FDD @ PF = 64 (USB disconnected) 31.58 LTE-FDD @ PF = 64 (USB connected) 31.68 LTE-TDD @ PF = 64 (USB disconnected) 31.78 LTE-TDD @ PF = 64 (USB connected) EGSM900 4DL/1UL @ 32.25 dBm EGSM900 3DL/2UL @ 32.17 dBm GPRS data transfer EGSM900 2DL/3UL @ 31.18 dBm EGSM900 1DL/4UL @ 29.18 dBm DCS1800 4DL/1UL @ 29.95 dBm DCS1800 3DL/2UL @ 29.94 dBm 1.75 4.21 2.59 2.79 1.78 1.49 4.99 3.26 3.52 2.43 2.01 30.64 30.85 31.44 31.99 249.1 407.3 511.1 534.8 233.6 372.1 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC200T_Series_Hardware_Design 69 / 90 LTE Standard Module Series EC200T Series Hardware Design DCS1800 2DL/3UL @ 28.45 dBm DCS1800 1DL/4UL @ 26.53 dBm EGSM900 4DL/1UL @ 28.21 dBm EGSM900 3DL/2UL @ 27.51 dBm EGSM900 2DL/3UL @ 25.46 dBm EGSM900 1DL/4UL @ 23.28 dBm DCS1800 4DL/1UL @ 27.31 dBm DCS1800 3DL/2UL @ 26.84 dBm DCS1800 2DL/3UL @ 25.56 dBm DCS1800 1DL/4UL @ 22.87 dBm WCDMA B1 HSDPA @ 23.57 dBm WCDMA B1 HSUPA @ 22.91 dBm WCDMA B5 HSDPA @ 23.06 dBm WCDMA B5 HSUPA @ 22.73 dBm WCDMA B8 HSDPA @ 23.36 dBm WCDMA B8 HSUPA @ 22.97 dBm LTE-FDD B1 @ 22.54 dBm LTE-FDD B3 @ 22.22 dBm LTE-FDD B5 @ 22.39 dBm LTE-FDD B8 @ 22.42 dBm LTE-TDD B34 @ 23.01 dBm LTE-TDD B38 @ 22.81 dBm LTE-TDD B39 @ 22.87 dBm LTE-TDD B40 @ 23.12 dBm LTE-TDD B41 @ 23.37 dBm EDGE data transfer WCDMA data transfer LTE data transfer 445.9 470.3 221.8 351.8 470.2 582.1 195.8 301.1 393.9 476.3 675.2 657.9 574.5 575.9 673.2 669.2 684.1 690.1 613.2 676.8 336.5 405.2 334.1 469.3 428.5 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC200T_Series_Hardware_Design 70 / 90 LTE Standard Module Series EC200T Series Hardware Design GSM voice call EGSM900 PCL = 5 @ 32.27 dBm EGSM900 PCL = 12 @ 19.64 dBm EGSM900 PCL = 19 @ 5.75 dBm DCS1800 PCL = 0 @ 29.95 dBm DCS1800 PCL = 7 @ 16.27 dBm DCS1800 PCL = 15 @ 1.11 dBm WCDMA voice call WCDMA B1 @ 23.57 dBm WCDMA B5 @ 23.07 dBm WCDMA B8 @ 23.21 dBm 242.2 120.1 94.2 223.6 116.2 92.2 646.9 556.1 653.1 mA mA mA mA mA mA mA mA mA NOTE

* means under development. Table 35EC200T-EU Current Consumption Parameter Description Conditions OFF state Power down IVBAT Sleep state EGSM900 @ DRX = 5USB suspend 3.15 Typ. 11 1.02 AT+CFUN=0USB disconnected EGSM900 @ DRX = 2USB disconnected 3.67 EGSM900 @ DRX = 5USB disconnected 3.00 EGSM900 @ DRX = 9USB disconnected 3.47 DCS1800 @ DRX = 2USB disconnected 3.55 DCS1800 @ DRX = 5USB disconnected 3.24 Unit uA mA mA mA mA mA mA mA EC200T_Series_Hardware_Design 71 / 90 LTE Standard Module Series EC200T Series Hardware Design DCS1800 @ DRX = 5USB suspend 3.12 DCS1800 @ DRX = 9USB disconnected 3.38 WCDMA @ PF = 64USB disconnected 4.18 WCDMA @ PF = 64USB suspend 3.89 WCDMA @ PF = 128USB disconnected 2.64 WCDMA @ PF = 256USB disconnected 2.61 WCDMA @ PF = 512USB disconnected 4.63 LTE-FDD @ PF = 32USB disconnected 4.38 LTE-FDD @ PF = 64USB disconnected 2.99 LTE-FDD @ PF = 64USB suspend 3.48 LTE-FDD @ PF = 128USB disconnected 2.58 LTE-FDD @ PF = 256USB disconnected 3.41 LTE-TDD @ PF = 32USB disconnected 5.11 LTE-TDD @ PF = 64USB disconnected 3.53 LTE-TDD @ PF = 64USB suspend 3.72 LTE-TDD @ PF = 128USB disconnected 2.93 LTE-TDD @ PF = 256USB disconnected 3.60 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle state EGSM900 @ DRX = 5USB disconnected 29.18 EGSM900 @ DRX = 5USB connected 37.19 WCDMA @ PF = 64USB disconnected 30.26 WCDMA @ PF = 64USB connected 38.28 EC200T_Series_Hardware_Design 72 / 90 LTE Standard Module Series EC200T Series Hardware Design LTE-FDD @ PF = 64USB disconnected 30.20 LTE-FDD @ PF = 64USB connected 40 LTE-TDD @ PF = 64USB disconnected 30.6 LTE-TDD @ PF = 64USB connected 49.83 EGSM900 4DL/1UL @ 33.07 dBm EGSM900 3DL/2UL @ 33.04 dBm EGSM900 2DL/3UL @ 31.29 dBm EGSM900 1DL/4UL @ 29.16 dBm DCS1800 4DL/1UL @ 31.52 dBm DCS1800 3DL/2UL @ 31.55 dBm DCS1800 2DL/3UL @ 30.21 dBm DCS1800 1DL/4UL @ 28.25 dBm EGSM900 4DL/1UL @ 26.88 dBm EGSM900 3DL/2UL @ 26.61 dBm EGSM900 2DL/3UL @ 24.91 dBm EGSM900 1DL/4UL @ 23.15 dBm DCS1800 4DL/1UL @ 26.73 dBm DCS1800 3DL/2UL @ 26.59 dBm DCS1800 2DL/3UL @ 25.10 dBm DCS1800 1DL/4UL @ 22.70 dBm WCDMA B1 HSDPA @ 23.07 dBm WCDMA B1 HSUPA @ 22.24 dBm WCDMA B8 HSDPA @ 23.22 dBm WCDMA B8 HSUPA @ 22.50 dBm GPRS data transfer EDGE data transfer WCDMA data transfer 274 459 529 545 230 371 449 473 216 346 471 586 188 293 389 479 659 640 612 600 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC200T_Series_Hardware_Design 73 / 90 LTE Standard Module Series EC200T Series Hardware Design LTE-FDD B1 @ 23.10 dBm LTE-FDD B3 @ 23.17 dBm LTE-FDD B7 @ 24.41 dBm LTE-FDD B8 @ 22.76 dBm LTE-FDD B20 @ 24.09 dBm LTE-FDD B28 @ 23.9 dBm LTE-TDD B38 @ 23.13 dBm LTE-TDD B40 @ 23.23 dBm LTE-TDD B41 @ 23.81 dBm EGSM900 PCL = 5 @ 33.00 dBm EGSM900 PCL = 12 @ 19.53 dBm EGSM900 PCL = 19 @ 5.71 dBm DCS1800 PCL = 0 @ 31.47 dBm DCS1800 PCL = 7 @ 18.37 dBm DCS1800 PCL = 15 @ 2.74 dBm LTE data transfer GSM voice call WCDMA voice cal WCDMA B1 @ 23.06 dBm WCDMA B8 @ 23.34 dBm 704 670 890 630 703 738 360 393 391 270 123 97 226 116 94 636 597 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA

* means under development. EC200T_Series_Hardware_Design 74 / 90 LTE Standard Module Series EC200T Series Hardware Design Table 36EC200T-AU Current Consumption Parameter Description Conditions Unit OFF state Power down Typ. 9 1.07 IVBAT Sleep state DCS1800 @ DRX = 9USB disconnected 3.03 WCDMA @ PF = 64USB disconnected 3.89 AT+CFUN=0USB disconnected EGSM900 @ DRX = 2USB disconnected 3.55 EGSM900 @ DRX = 5USB disconnected 2.45 EGSM900 @ DRX = 5USB suspend 2.80 EGSM900 @ DRX = 9USB disconnected 2.87 DCS1800 @ DRX = 2USB disconnected 3.60 DCS1800 @ DRX = 5USB disconnected 2.77 DCS1800 @ DRX = 5USB suspend 2.85 WCDMA @ PF = 64USB suspend 3.90 WCDMA @ PF = 128USB disconnected 3.31 WCDMA @ PF = 256USB disconnected 2.74 WCDMA @ PF = 512USB disconnected 4.42 LTE-FDD @ PF = 32USB disconnected 5.48 LTE-FDD @ PF = 64USB disconnected 3.62 LTE-FDD @ PF = 64USB suspend 3.58 LTE-FDD @ PF = 128USB disconnected 2.92 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC200T_Series_Hardware_Design 75 / 90 LTE Standard Module Series EC200T Series Hardware Design LTE-FDD @ PF = 256USB disconnected 2.34 LTE-TDD @ PF = 32USB disconnected 5.76 LTE-TDD @ PF = 64USB disconnected 3.72 LTE-TDD @ PF = 64USB suspend 3.92 LTE-TDD @ PF = 128USB disconnected 2.76 LTE-TDD @ PF = 256USB disconnected 2.72 EGSM900 @ DRX = 5USB disconnected 30.12 EGSM900 @ DRX = 5USB connected 49.22 WCDMA @ PF = 64USB disconnected 31.07 WCDMA @ PF = 64USB connected 50.13 LTE-FDD @ PF = 64USB disconnected 30.82 LTE-FDD @ PF = 64USB connected 49.90 LTE-TDD @ PF = 64USB disconnected 31.34 LTE-TDD @ PF = 64USB connected 50.31 EGSM900 4DL/1UL @ 33.44 dBm EGSM900 3DL/2UL @ 33.39 dBm EGSM900 2DL/3UL @ 31.44 dBm EGSM900 1DL/4UL @ 29.45 dBm DCS1800 4DL/1UL @ 30.29 dBm DCS1800 3DL/2UL @ 30.31 dBm DCS1800 2DL/3UL @ 28.85 dBm DCS1800 1DL/4UL @ 26.88 dBm 268.3 467.8 543.9 567.6 217.0 364.4 437.5 464 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle state GPRS data transfer EC200T_Series_Hardware_Design 76 / 90 LTE Standard Module Series EC200T Series Hardware Design PCS1900 4DL/1UL @ 30.10 dBm PCS1900 3DL/2UL @ 30.10 dBm PCS1900 2DL/3UL @ 28.65 dBm PCS1900 1DL/4UL @ 26.72 dBm EGSM850 4DL/1UL @ 33.01 dBm EGSM850 3DL/2UL @ 32.97 dBm EGSM850 2DL/3UL @ 31.48 dBm EGSM850 1DL/4UL @ 29.37 dBm EGSM900 4DL/1UL @ 28.69 dBm EGSM900 3DL/2UL @ 28.49 dBm EGSM900 2DL/3UL @ 25.67 dBm EGSM900 1DL/4UL @ 23.43 dBm DCS1800 4DL/1UL @ 26.93 dBm DCS1800 3DL/2UL @ 26.80 dBm DCS1800 2DL/3UL @ 25.29 dBm DCS1800 1DL/4UL @ 22.88 dBm PCS1800 4DL/1UL @ 26.38 dBm PCS1800 3DL/2UL @ 26.29 dBm PCS1800 2DL/3UL @ 24.88 dBm PCS1800 1DL/4UL @ 22.62 dBm EGSM850 4DL/1UL @ 27.18 dBm EGSM850 3DL/2UL @ 26.68 dBm EGSM850 2DL/3UL @ 24.94 dBm EGSM850 1DL/4UL @ 22.60 dBm 212.5 355.6 425.4 450.9 265.2 459.4 554.3 580.2 215.2 366.1 489.6 610.4 179.7 296.2 394.7 495.4 176.2 288.6 389.7 490.7 214.0 359.6 487.2 606.3 740.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EDGE data transfer WCDMA data WCDMA B1 HSDPA @ 23.77 dBm EC200T_Series_Hardware_Design 77 / 90 LTE Standard Module Series EC200T Series Hardware Design transfer WCDMA B1 HSUPA @ 23.10 dBm WCDMA B2 HSDPA @ 23.73 dBm WCDMA B2 HSUPA @ 22.24 dBm WCDMA B4 HSDPA @ 24.29 dBm WCDMA B4 HSUPA @ 22.59 dBm WCDMA B5 HSDPA @23.65dBm WCDMA B5 HSUPA @ 22.79 dBm WCDMA B8 HSDPA @ 23.94 dBm WCDMA B8 HSUPA @ 23.22 dBm LTE-FDD B1 @ 22.89 dBm LTE-FDD B2 @ 22.29 dBm LTE-FDD B3 @ 23.21 dBm LTE-FDD B4 @ 22.49 dBm LTE-FDD B8 @ 22.12 dBm LTE-FDD B28 @ 23.67 dBm LTE-FDD B66 @ 22.71 dBm LTE-TDD B40 @ 23.25 dBm EGSM900 PCL = 5 @ 33.49 dBm EGSM900 PCL = 12 @ 19.79 dBm EGSM900 PCL = 19 @ 7.03 dBm DCS1800 PCL = 0 @ 30.33 dBm DCS1800 PCL = 7 @ 16.97 dBm DCS1800 PCL = 15 @ 1.45 dBm LTE data transfer LTE-FDD B5 @ 23.41 dBm LTE-FDD B7 @ 23.18 dBm GSM voice call 729.1 835.1 761.2 767.6 689.6 643.5 631.4 677.2 653.1 737.4 780.8 729.4 717.3 677.3 895.5 676.4 744.8 722.7 423.9 280.2 126.4 98.9 226.2 117.6 96.6 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC200T_Series_Hardware_Design 78 / 90 LTE Standard Module Series EC200T Series Hardware Design PCS1900 PCL = 0 @ 30.16 dBm PCS1900 PCL = 7 @ 16.78 dBm PCS1900 PCL = 15 @ 1.63 dBm EGSM850 PCL = 5 @ 32.97 dBm EGSM850 PCL = 12 @ 19.79 dBm EGSM850 PCL = 19 @ 6.73 dBm WCDMA B1 @ 23.42 dBm WCDMA B2 @ 23.44 dBm WCDMA B4 @ 24.02 dBm WCDMA B5 @ 23.38 dBm WCDMA B8 @ 23.57 dBm 220.2 117.3 97.5 276.1 128.5 100.0 718.3 818.6 752.1 625.6 658.3 mA mA mA mA mA mA mA mA mA mA mA WCDMA voice call

* means under development. 5.5. RF Output Power The following table shows the RF output power of EC200T series module. Table 37: EC200T-CN RF Output Power Frequency EGSM900 DCS1800 Max. Min. 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB EGSM900 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB DCS1800 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB EC200T_Series_Hardware_Design 79 / 90 LTE Standard Module Series EC200T Series Hardware Design WCDMA B1/B5/B8 24 dBm +1/-3 dB

< -49 dBm LTE-FDD B1/B3/B5/B8 23 dBm 2 dB

< -39 dBm LTE-TDD B34/B38/B39/B40/B41 23 dBm 2 dB

< -39 dBm Table 38: EC200T-EU RF Output Power Frequency EGSM900 DCS1800 Max. Min. 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB EGSM900 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB DCS1800 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB WCDMA B1/B8 24 dBm +1/-3 dB

< -49 dBm LTE-FDD B1/B3/B7/B8/B20/B28 23 dBm 2 dB

< -39 dBm LTE-TDD B38/B40/B41 23 dBm 2 dB

< -39 dBm Table 39: EC200T-AU* RF Output Power Frequency EGSM900 GSM850 DCS1800 PCS1900 Max. Min. 33 dBm 2 dB 5 dBm 5 dB 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB EGSM900 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB EGSM850 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB DCS1800 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB PCS1900 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB WCDMA B1/B2/B4/B5/B8 24 dBm +1/-3 dB

< -49 dBm EC200T_Series_Hardware_Design 80 / 90 LTE Standard Module Series EC200T Series Hardware Design LTE-FDD B1/B2/B3/B4/B5/B7/B8/B28 23 dBm 2 dB

< -39 dBm LTE-TDD B40 23 dBm 2 dB

< -39 dBm In GPRS 4 slots Tx mode, the maximum output power is reduced by 2.5 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1.

* means under development. NOTES 1. 2. 5.6. RF Receiving Sensitivity The following table shows conducted RF receiving sensitivity of EC200T-CN module. And the data for EC200T-EU and EC200T-AU* will be supplemented in subsequent versions of this document. Table 40: EC200T-CN Conducted RF Receiving Sensitivity Frequency EGSM900 DCS1800 Receiving Sensitivity (Typ.) Primary Diversity SIMO

-108 dBm NA

-108 dBm NA WCDMA B1

-108 dBm NA WCDMA B5

-109 dBm NA WCDMA B8

-110 dBm NA 3GPP (SIMO)

-102 dBm

-102 dBm

-106.7 dBm

-104.7 dBm

-103.7 dBm NA NA NA NA NA LTE-FDD B1 (10 MHz)

-97 dBm

-98.5 dBm

-100 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-97.5 dBm

-97.5 dBm

-100.5 dBm

-93.3 dBm LTE-FDD B5 (10 MHz)

-98 dBm

-99 dBm

-101 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-98 dBm

-98 dBm

-101 dBm

-93.3 dBm LTE-TDD B34 (10 MHz)

-96.5 dBm

-97 dBm

-100 dBm

-96.3 dBm LTE-TDD B38 (10 MHz)

-97 dBm

-97.5 dBm

-100 dBm

-96.3 dBm EC200T_Series_Hardware_Design 81 / 90 LTE Standard Module Series EC200T Series Hardware Design LTE-TDD B39 (10 MHz)

-97 dBm

-97.5 dBm

-100 dBm

-96.3 dBm LTE-TDD B40 (10 MHz)

-97 dBm

-97 dBm

-100 dBm

-96.3 dBm LTE-TDD B41 (10 MHz)

-96 dBm

-97 dBm

-99 dBm

-94.3 dBm Table 41: EC200T-EU Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) Primary Diversity SIMO 3GPP (SIMO) Frequency EGSM900 DCS1800 WCDMA B1 WCDMA B8 TBD TBD TBD TBD LTE-FDD B1 (10 MHz) TBD LTE-FDD B3 (10 MHz) TBD LTE-FDD B7 (10 MHz) TBD LTE-FDD B8 (10 MHz) TBD LTE-TDD B20 (10 MHz) TBD LTE-TDD B28 (10 MHz) TBD LTE-TDD B38 (10 MHz) TBD LTE-TDD B40 (10 MHz) TBD LTE-TDD B41 (10 MHz) TBD NA NA NA NA TBD TBD TBD TBD TBD TBD TBD TBD TBD NA NA NA NA TBD TBD TBD TBD TBD TBD TBD TBD TBD

-102 dBm

-102 dBm

-106.7 dBm

-103.7 dBm

-96.3 dBm

-93.3 dBm

-94.3 dBm

-93.3 dBm

-93.3 dBm

-94.8 dBm

-96.3 dBm

-96.3 dBm

-94.3 dBm Table 42: EC200T-AU* Conducted RF Receiving Sensitivity Frequency GSM850 EGSM900 Receiving Sensitivity (Typ.) Primary Diversity SIMO 3GPP (SIMO) TBD TBD NA NA NA NA

-102 dBm

-102 dBm EC200T_Series_Hardware_Design 82 / 90 LTE Standard Module Series EC200T Series Hardware Design NA NA NA NA NA NA NA TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD NA NA NA NA NA NA NA TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

-102 dBm

-102 dBm

-106.7 dBm

-104.7 dBm

-106.7 dBm

-104.7 dBm

-103.7 dBm

-96.3 dBm

-94.3 dBm

-93.3 dBm

-96.3 dBm

-94.3 dBm

-94.3 dBm

-93.3 dBm

-94.8 dBm

-96.3 dBm

-96.3 dBm DCS1800 DCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 TBD TBD TBD TBD TBD TBD TBD LTE-FDD B1 (10 MHz) TBD LTE-FDD B2 (10 MHz) TBD LTE-FDD B3 (10 MHz) TBD LTE-FDD B4 (10 MHz) TBD LTE-FDD B5 (10 MHz) TBD LTE-FDD B7 (10 MHz) TBD LTE-FDD B8 (10 MHz) TBD LTE-TDD B28 (10 MHz) TBD LTE-TDD B40 (10 MHz) TBD LTE-TDD B66 (10 MHz) TBD NOTE

* means under development. 5.7. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. EC200T_Series_Hardware_Design 83 / 90 LTE Standard Module Series EC200T Series Hardware Design The following table shows the module electrostatics discharge characteristics. Table 43: Electrostatics Discharge Characteristics (25 C, 45% Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND All Antenna Interfaces 8 8 Other Interfaces 0.5 10 10 1 kV kV kV EC200T_Series_Hardware_Design 84 / 90 LTE Standard Module Series EC200T Series Hardware Design 6 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.05 mm unless otherwise specified. 6.1. Mechanical Dimensions of the Module Figure 36: Module Top and Side Dimensions EC200T_Series_Hardware_Design 85 / 90 LTE Standard Module Series EC200T Series Hardware Design 32.0/-0.15 1.90 1.30 3.85 5.96 2.0

. 4 3 1.1 1.8 2.15 1.15 1.05 3.0 0.87 4.82 1.6 6.8 1.7 Pin 1 1.30 5 3

. 1.1 2.0 2.0 3.0 1.8 5 1

. 0

0

. 9 2 2.8 8 4

. 4.37 3.2 3.4 3.2 3.4 3.2 2.49 1.9 2.4 3.45 0.8 5

. 3 1.5 Figure 37: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. EC200T_Series_Hardware_Design 86 / 90 LTE Standard Module Series EC200T Series Hardware Design 6.2. Recommended Footprint Figure 38: Recommended Footprint (Top View) 1. The keepout area should not be designed. 2. For easy maintenance of the module, please keep about 3 mm between the module and other components in the host PCB. NOTES EC200T_Series_Hardware_Design 87 / 90 LTE Standard Module Series EC200T Series Hardware Design 6.3. Design Effect Drawings of the Module Figure 39: Top View of the Module Figure 40: Bottom View of the Module NOTE These are renderings of EC200T series module. For authentic appearance, please refer to the module that you receive from Quectel. EC200T_Series_Hardware_Design 88 / 90 LTE Standard Module Series EC200T Series Hardware Design 7 Storage, Manufacturing and Packaging 7.1. Storage The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. should be 35%60%. 3. The floor life of the module is 168 hours 1) in a plant where the temperature is 23 5 C and relative humidity is below 60%. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10% (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a dry environment such as in a drying oven. 5. EC200T_Series_Hardware_Design 89 / 90 LTE Standard Module Series EC200T Series Hardware Design NOTES 1. 1) This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. 2. To avoid blistering, layer separation and other soldering issues, it is forbidden to expose the modules to the air for a long time. If the temperature and moisture do not conform to IPC/JEDEC J-STD-033 or the relative moisture is over 60%, It is recommended to start the solder reflow process within 24 hours after the package is removed. And do not remove the packages of tremendous modules if they are not ready for soldering. 3. Please take the module out of the packaging and put it on high-temperature resistant fixtures before the baking. If shorter baking time is desired, please refer to IPC/JEDEC J-STD-033 for baking procedure. 7.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.180.20 mm. For more details, see document [1]. It is suggested that the peak reflow temperature is 238246 C, and the absolute maximum reflow temperature is 246 C. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Temp. (C) 246 238 220 200 150 100 Soak Zone A Max slope: 1 to 3C/s Reflow Zone Max slope:

2 to 3C/s C Cooling down slope:

-1.5 to -3C/s B D Figure 41: Recommended Reflow Soldering Thermal Profile EC200T_Series_Hardware_Design 90 / 90 LTE Standard Module Series EC200T Series Hardware Design Table 44: Recommended Thermal Profile Parameters Soak time (between A and B: 150 C and 200 C) 70120 s Recommendation 13 C/s 23 C/s 4570 s 238 C to 246 C

-1.5 to -3 C/s 1 1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. Factor Soak Zone Max slope Reflow Zone Max slope Reflow time (D: over 220C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTES EC200T_Series_Hardware_Design 91 / 90 LTE Standard Module Series EC200T Series Hardware Design 7.3. Packaging EC200T series is packaged in tape and reel carriers. One reel is 11.88 m long and contains 250 modules. The figure below shows the package details, measured in mm. 44.00 0.1 2.00 0.1 4.00 0.1 0.1 1.5 0 0.35 0.05 1

. 0 5 7

. 1 5 1

. 0 0 2

. 0 2 3

. 0 0 0

. 4 4 5 1

. 0 3

. 9 2 5 1

. 0 3

. 0 3 5 1

. 0 3

. 0 3 4.2 0.15 3.1 0.15 Cover tape Direction of feed 32.5 0.15 33.5 0.15 Figure 42: Tape Specifications 32.5 0.15 33.5 0.15 48.5 0 0 1 13 44.5+0.20

-0.00 Figure 43: Reel Specifications EC200T_Series_Hardware_Design 92 / 90 LTE Standard Module Series EC200T Series Hardware Design 1083 Carrier tape packing module Carrier tape unfolding Figure 44: Tape and Reel Directions EC200T_Series_Hardware_Design 93 / 90 LTE Standard Module Series EC200T Series Hardware Design 8 Appendix A References Table 45: Related Documents SN Document Name Remark Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide Quectel_EC200T-CN_AT_Commands_Manual EC200T-CN AT Commands Manual Quectel_RF_Layout_Application_Note RF Layout Application Note Quectel_UMTS&LTE_EVB_User_Guide UMTS&LTE EVB user guide for UMTS&LTE modules Table 46: Terms and Abbreviations Abbreviation Description CHAP Challenge Handshake Authentication Protocol Analog-to-Digital Converter Adaptive Multi-rate Bits Per Second Coding Scheme Clear To Send Downlink Data Terminal Equipment Data Terminal Ready Enhanced Full Rate

[1]

[2]

[3]

[4]

ADC AMR bps CS CTS DL DTE DTR EFR EGSM Extended GSM900 Band (including standard GSM900 band) EC200T_Series_Hardware_Design 94 / 90 LTE Standard Module Series EC200T Series Hardware Design ESD FDD FR FTP FTPS GMSK GSM HR HSDPA HSPA HSUPA HTTP HTTPS LED LTE MIMO MMS MQTT MSL NITZ NTP PAP PCB PDU PF Electrostatic Discharge Frequency Division Duplex Full Rate File Transfer Protocol FTP over SSL Gaussian Minimum Shift Keying Global System for Mobile Communications Half Rate High Speed Downlink Packet Access High Speed Packet Access High Speed Uplink Packet Access Hyper Text Transfer Protocol Light Emitting Diode Long Term Evolution Multiple Input Multiple Output Multimedia Messaging Service Message Queuing Telemetry Transport Moisture Sensitivity Level Network Identity and Time Zone Network Time Protocol Password Authentication Protocol Printed Circuit Board Protocol Data Unit Paging Frame Hyper Text Transfer Protocol over Secure Socket Layer EC200T_Series_Hardware_Design 95 / 90 LTE Standard Module Series EC200T Series Hardware Design SMTPS Simple Mail Transfer Protocol Secure PPP PSK QAM QPSK RF SIMO SM SMS SMTP SSL TCP TDD UART UDP UL UMTS URC

(U)SIM Vmax Vnorm Vmin VIHmax VIHmin VILmax Point-to-Point Protocol Phase Shift Keying Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Single Input Multiple Output Smart Media Short Message Service Simple Mail Transfer Protocol Secure Sockets Layer Transmission Control Protocol Time Division Duplexing User Datagram Protocol Uplink Universal Asynchronous Receiver &Transmitter Universal Mobile Telecommunications System Unsolicited Result Code

(Universal )Subscriber Identity Module Maximum Voltage Value Normal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value EC200T_Series_Hardware_Design 96 / 90 LTE Standard Module Series EC200T Series Hardware Design VILmin VImax VOHmax VOHmin VOLmax VOLmin VSWR WCDMA WLAN Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Voltage Standing Wave Ratio Wideband Code Division Multiple Access Wireless Local Area Network EC200T_Series_Hardware_Design 97 / 90 LTE Standard Module Series EC200T Series Hardware Design 9 Appendix B GPRS Coding Schemes Table 47: Description of Different Coding Schemes Scheme Code Rate USF Pre-coded USF BCS Tail Coded Bits Punctured Bits Data Rate Kb/s Radio Block excl.USF and BCS 181 268 CS-1 CS-2 CS-3 CS-4 2/3 3/4 1/2 3 3 40 4 456 0 3 6 16 4 588 132 9.05 13.4 1 3 12 428 16 456

21.4 3 6 312 16 4 676 220 15.6 EC200T_Series_Hardware_Design 98 / 90 LTE Standard Module Series EC200T Series Hardware Design 10 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3 + 1 or 2 + 2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 48: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 2 3 4 5 6 7 8 9 10 11 12 13 1 2 2 3 2 3 3 4 3 4 4 4 3 1 1 2 1 2 2 3 1 2 2 3 4 3 2 3 3 4 4 4 4 5 5 5 5 5 NA EC200T_Series_Hardware_Design 99 / 90 LTE Standard Module Series EC200T Series Hardware Design 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 4 5 6 7 8 6 6 6 6 6 8 8 8 8 8 8 5 5 5 5 4 5 6 7 8 2 3 4 4 6 2 3 4 4 6 8 1 2 3 4 NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA 6 6 6 6 EC200T_Series_Hardware_Design 100 /

90 LTE Standard Module Sires EC200T Hardware Design 11 Appendix D EDGE Modulation and Coding Schemes Table 49: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family Timeslot 1 Timeslot 2 Timeslot 4 GMSK GMSK GMSK GMSK 8-PSK 8-PSK 8-PSK 8-PSK 8-PSK C B A C B A B A A 8.80 kbps 17.60 kbps 35.20 kbps 11.2 kbps 22.4 kbps 44.8 kbps 14.8 kbps 29.6 kbps 59.2 kbps 17.6 kbps 35.2 kbps 70.4 kbps 22.4 kbps 44.8 kbps 89.6 kbps 29.6 kbps 59.2 kbps 118.4 kbps 44.8 kbps 89.6 kbps 179.2 kbps 54.4 kbps 108.8 kbps 217.6 kbps 59.2 kbps 118.4 kbps 236.8 kbps MCS-1 MCS-2 MCS-3 MCS-4 MCS-5 MCS-6 MCS-7 MCS-8 MCS-9 EC200T_Series_Hardware_Design 101 /

101

QUEeEcrTret EC200T-AU Q1-A1914 EC200TAUAA-NO6-SNASA FCC ID: XMR202011EC200TAU SN:MPA1 7L81 AXXXXX1 IMEI: 8671 8403XXXXXXO

QuectelWirelessSolutionsCompanyLimited Declaration of the Modular Approval Applicant / Grantee FCC ID:

Model:

The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:

QuectelWirelessSolutionsCo.,Ltd XMR202011EC200TAU EC200TAU,EC200TAUMINIPCIE Modular approval requirement EUT Condition

(a) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. The radio elements of the modular transmitter have their own shielding. Comply YES

(b) The modular has buffered data inputs, it is integrated in chip. Please see schematic.pdf YES All power lines derived from the host device are regulated before energizing other circuits internal to EC200T-AU, EC200T-AU MINIPCIE. Please see schematic.pdf Device uses a micro-strip trace on the hosts printed circuit board to an antenna connector on the host circuit board. YES YES The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation.

(c)The modular transmitter must have its ownpowersupplyregulation.

(d) The modular antenna must transmitter must the antenna and comply with transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section. either

(e)The modular be transmitter must tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with line conducted the AC EC200T-AU, EC200T-AU MINIPCIE was tested in a stand alone configuration via a PCMCIA extender. Please see spurious setup YES QuectelWirelessSolutionsCompanyLimited requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available

(see Section 15.31(i)) must not be in side another device during testing. supporting and

(f)The modular transmitter be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. must

(g) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any suchrequirements. A copy of these instructions must be included in the application for equipmentauthorizationrequirements,whicharebas edon theintendeduse/configurations.

(h)The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. YES YES The label position of EC200TAU, EC200TAUMINIPCIE is clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text: Contains FCC ID: XMR202011EC200TAU. Please see the label.pdf EC200T-AU, EC200T-AU MINIPCIE is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. EC200T-AU, EC200T-AU MINIPCIE is approved to comply with the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance restriction. YES Quect telWirele essSolutio onsComp panyLimi ited 2020/1 11/27 Sign nature Jea n Hu Pri rinted Title:

Project M Manager On beh half of :

Quectel Wireless S olutions Co ompany Lim mited Teleph one:

+86-2 21-51086236 6 ext 6511 Dated By:

Quectel Wireless Solutions Co., Ltd POWER OF ATTORNEY We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/Jinnan Han on our behalf, to apply to FCC on our equipment for FCC ID:

XMR202011EC200TAU. Any and all acts carried out by TA Technology

(Shanghai) Co., Ltd. / Jinnan Han on our behalf shall have the same effect as DATE:November 27, 2020 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 acts of our own. Sincerely, Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Company Limited

Quectel Wireless Solutions Co., Ltd Request for Confidentiality Date: _2020/11/27_ Subject: Confidentiality Request for: _____ FCC ID: XMR202011EC200TAU ______ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent*1 Permanent Permanent Permanent Permanent Permanent*

Permanent Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual Quectel_RF_Layout

*Note: ______(Insert Explanation as Necessary)______ ______ FCC ID: XMR202011EC200TAU _____ has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:

(Signature/Title2) Jean Hu

(Print name)