FCC ID: XMR202012EC25T LTE Module

 

EC25 MINIPCIE Hardware Design LTE Standard Module Series Rev. EC25_Mini_PCIe_Hardware_Design_V2.4 Date: 2019-12-18 Status: Released www.quectel.com LTE Standard Module Series EC25 Mini PCIe Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. EC25_Mini_PCIe_Hardware_Design 1 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design About the Document Revision History Revision Date Author Description 1.0 2016-06-07 Mountain ZHOU/

Frank WANG Initial 1.1 2017-01-24 Table 2. Lyndon LIU/

Frank WANG 2.0 2019-04-30 Nathan LIU/

Frank WANG/

Ward WANG/

Ethan SHAN 1. Deleted description of EC25-AUT Mini PCIe in Table 1. 2. Added description of EC25-AU and EC25-J Mini PCIe in Table 1. 3. Updated key features of EC25 Mini PCIe in 4. Added current consumption in Chapter 4.7. 5. Updated conducted RF receiving sensitivity of EC25-A Mini PCIe in Table 17. 6. Added conducted RF receiving sensitivity of EC25-J Mini PCIe in Table 18. 1. Added new variants EC25-AF Mini PCIe, EC25-EU Mini PCIe, EC25-EC Mini PCIe, EC25-EUX Mini PCIe, EC25-MX Mini PCIe and their related information. 2. Updated LTEUMTS and GSM features, and added storage temperature range in Table 2. 3. Added pin definition and description of pin 3, 5, 44 in Figure 2 and Table 4. 4. Modified the reference circuit of USB interface in Figure 6. 5. Updated the mechanical dimension of EC25 Mini PCIe in Figure 18. 6. Added USIM_PRESENCE in (U)SIM interface and updated the reference circuit in Chapter 3.4. 7. Added COEX UART interface

(under EC25_Mini_PCIe_Hardware_Design 2 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design development) as UART interface in Chapter 3.6. 8. Modified description of W_DISABLE# signal 9. Modified description of LED_WWAN# signal in Chapter 3.8.3. in Chapter 3.8.5. Chapter 5. 10. Updated description of antenna connection in 11. Added thermal consideration in Chapter 6.7. 12. Added operating frequencies in Table 16. 13. Added GNSS frequency in Table 17. 14. Updated antenna requirements in Table 18. 15. Updated EC25 Mini PCIe conducted RF output power in Table 21. 16. Updated conducted RF receiving sensitivity of EC25-A Mini PCIe in Table 22. 17. Added conducted RF receiving sensitivity of EC25-AU Mini PCIe in Table 23. 18. Updated conducted RF receiving sensitivity of EC25-J Mini PCIe in Table 24. 19. Updated conducted RF receiving sensitivity of EC25-E Mini PCIe in Table 25. 20. Updated conducted RF receiving sensitivity of EC25-V Mini PCIe in Table 26. 21. Added conducted RF receiving sensitivity of EC25-AF Mini PCIe in Table 27. 22. Added conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 28. 23. Added conducted RF receiving sensitivity of EC25-EC Mini PCIe in Table 29. 24. Added conducted RF receiving sensitivity of EC25-EUX Mini PCIe in Table 30. 25. Added current consumption of EC25-AU Mini 26. Added current consumption of EC25-J Mini PCIe in Table 33. PCIe in Table 34. PCIe in Table 37. PCIe in Table 38. 27. Added current consumption of EC25-AF Mini 28. Added current consumption of EC25-EC Mini 29. Added current consumption of EC25-EUX 1. Added EC25-AFX/-AUX Mini PCIe and Mini PCIe in Table 39. related information. 2.1 2019-07-05 Fanny CHEN/

Ethan SHAN EC25_Mini_PCIe_Hardware_Design 3 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 2. Updated supported protocols and USB serial drivers in Table 2. 3. Added EC25-AFX Mini PCIe conducted RF receiving sensitivity in Table 28. 4. Updated conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 29. 5. Updated EC25-AF Mini PCIe current consumption in Table 39. 6. Added EC25-AFX Mini PCIe current consumption in Table 42. 7. Added EC25-MX Mini PCIe conducted RF receiving sensitivity in Table 32. 8. Added EC25-MX Mini PCIe current consumption in Table 43. 1. Deleted the information of GNSS supported on EC25-EC Mini PCIe in Table 1. 2. Updated conducted RF receiving sensitivity of EC25-AU Mini PCIe in Table 24. 3. Updated conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 30. 4. Added conducted RF receiving sensitivity of EC25-AUX Mini PCIe in Table 34. 6. Added current consumption of EC25-AUX PCIe in Table 38. Mini PCIe in Table 45. PCIe in Table 46. 7. Added current consumption of EC25-EU Mini 8. Deleted current consumption of EC21-EC Mini PCIe, and the data will be updated in the future version. 1. Removed the related information of ThreadX OS because the baseline has been updated. 2. Updated the supported protocols and USB serial drivers in Table 2. 3. Added operating modes of module in Chapter 3.3. Chapter 3.10.3. Chapter 4.2. in Figure 21. 5. Updated the notes for GNSS performance in 6. Updated the Mini PCI Express connector type 2.2 2019-08-19 5. Updated current consumption of EC25-J Mini Ward WANG/

Owen WEI 2.3 2019-11-26 Fanny CHEN 4. Updated description of W_DISABLE#

in EC25_Mini_PCIe_Hardware_Design 4 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 2.4 2019-12-18 Ward WANG Barret Xiong Cody Zhou 1. Modified the I/O parameters definition of the I2C interface as OD in Table 4 and 11. 2. Modified the current consumption of EC25-EUX Mini PCIe in Table 43. 3. Deleted related information of EC25-EC Mini 4. Added related information of EC25-T Mini 5. Added related information of EC25-EX Mini PCIe PCIe PCIe EC25_Mini_PCIe_Hardware_Design 5 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 6 Table Index ................................................................................................................................................... 8 Figure Index ................................................................................................................................................. 9 1 Introduction ........................................................................................................................................ 10 1.1. FCC Certification Requirements. ............................................................................................ 10 Safety Information.................................................................................................................... 13 1.2. 2 Product Concept ................................................................................................................................ 14 2.1. General Description ................................................................................................................. 14 2.2. Description of Module Series .................................................................................................. 15 2.3. Key Features ........................................................................................................................... 17 3 Application Interfaces ....................................................................................................................... 20 Pin Assignment ........................................................................................................................ 20 3.1. Pin Description ......................................................................................................................... 21 3.2. 3.3. Operating Modes ..................................................................................................................... 24 3.4. Power Saving ........................................................................................................................... 24 3.4.1. Sleep Mode .................................................................................................................... 24 3.4.2. Airplane Mode ................................................................................................................ 25 Power Supply ........................................................................................................................... 25 3.5. 3.6.

(U)SIM Interface ...................................................................................................................... 26 3.7. USB Interface .......................................................................................................................... 28 3.8. UART Interfaces ...................................................................................................................... 29 3.8.1. Main UART Interface ...................................................................................................... 29 3.8.2. COEX UART Interface* .................................................................................................. 30 3.9. PCM and I2C Interfaces .......................................................................................................... 31 3.10. Control and Indication Signals ................................................................................................. 34 3.10.1. RI Signal ......................................................................................................................... 34 3.10.2. DTR Signal ..................................................................................................................... 35 3.10.3. W_DISABLE# Signal ...................................................................................................... 35 3.10.4. PERST# Signal .............................................................................................................. 35 3.10.5. LED_WWAN# Signal ..................................................................................................... 36 3.10.6. WAKE# Signal ................................................................................................................ 37 4 GNSS Receiver ................................................................................................................................... 38 4.1. General Description ................................................................................................................. 38 4.2. GNSS Performance ................................................................................................................. 38 4.3. GNSS Frequency..................................................................................................................... 39 5 Antenna Connection .......................................................................................................................... 40 EC25_Mini_PCIe_Hardware_Design 6 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 5.1. Antenna Connectors ................................................................................................................ 40 5.1.1. Operating Frequency ..................................................................................................... 40 5.2. Antenna Requirements ............................................................................................................ 42 5.3. Recommended Mating Plugs for Antenna Connection ........................................................... 43 6 Electrical, Reliability and Radio Characteristics ............................................................................ 45 6.1. General Description ................................................................................................................. 45 6.2. Power Supply Requirements ................................................................................................... 45 6.3. I/O Requirements..................................................................................................................... 46 6.4. RF Characteristics ................................................................................................................... 46 6.5. ESD Characteristics ................................................................................................................ 54 6.6. Current Consumption .............................................................................................................. 55 6.7. Thermal Consideration ............................................................................................................ 75 7 Dimensions and Packaging .............................................................................................................. 77 7.1. General Description ................................................................................................................. 77 7.2. Mechanical Dimensions of EC25 Mini PCIe ............................................................................ 77 7.3. Standard Dimensions of Mini PCI Express ............................................................................. 78 Packaging Specifications ......................................................................................................... 79 7.4. 8 Appendix A References ..................................................................................................................... 80 EC25_Mini_PCIe_Hardware_Design 7 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Table Index TABLE 1: DESCRIPTION OF EC25 MINI PCIE ................................................................................................ 15 TABLE 2: KEY FEATURES OF EC25 MINI PCIE ............................................................................................. 17 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 21 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 21 TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 24 TABLE 6: DEFINITION OF VCC_3V3 AND GND PINS .................................................................................... 25 TABLE 7: PIN DEFINITION OF (U)SIM INTERFACE ....................................................................................... 26 TABLE 8: PIN DEFINITION OF USB INTERFACE ........................................................................................... 28 TABLE 9: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................... 30 TABLE 10: PIN DEFINITION OF COEX UART INTERFACE ............................................................................ 30 TABLE 11: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 31 TABLE 12: PIN DEFINITION OF CONTROL AND INDICATION SIGNALS ...................................................... 34 TABLE 13: AIRPLANE MODE CONTROLLED BY HARDWARE METHOD ..................................................... 35 TABLE 14: AIRPLANE MODE CONTROLLED BY SOFTWARE METHOD ..................................................... 35 TABLE 15: INDICATIONS OF NETWORK STATUS (AT+QCFG="LEDMODE",0, DEFAULT SETTING) ......... 37 TABLE 16: INDICATIONS OF NETWORK STATUS (AT+QCFG="LEDMODE",2) ........................................... 37 TABLE 17: GNSS PERFORMANCE ................................................................................................................. 38 TABLE 18: GNSS FREQUENCY ....................................................................................................................... 39 TABLE 19: OPERATING FREQUENCIES ........................................................................................................ 40 TABLE 20: ANTENNA REQUIREMENTS .......................................................................................................... 42 TABLE 21: POWER SUPPLY REQUIREMENTS .............................................................................................. 45 TABLE 22: I/O REQUIREMENTS ...................................................................................................................... 46 TABLE 23: CONDUCTED RF OUTPUT POWER OF EC25 MINI PCIE ........................................................... 46 TABLE 24: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-A MINI PCIE .......................................... 47 TABLE 25: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-AU MINI PCIE ....................................... 47 TABLE 26: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-J MINI PCIE .......................................... 48 TABLE 27: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-E MINI PCIE .......................................... 48 TABLE 28: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-V MINI PCIE .......................................... 49 TABLE 29: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-AF MINI PCIE ........................................ 49 TABLE 30: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-AFX MINI PCIE ..................................... 50 TABLE 31: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-EU MINI PCIE ....................................... 50 TABLE 33: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-EUX MINI PCIE ..................................... 51 TABLE 34: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-MX MINI PCIE ....................................... 52 TABLE 35: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-AUX MINI PCIE ..................................... 52 TABLE 36: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-EX MINI PCIE ....................................... 53 EC25_Mini_PCIe_Hardware_Design 8 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure Index FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 20 FIGURE 3: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 26 FIGURE 4: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR 27 FIGURE 5: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR ... 27 FIGURE 6: REFERENCE CIRCUIT OF USB INTERFACE .............................................................................. 29 FIGURE 7: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 30 FIGURE 8: TIMING IN PRIMARY MODE .......................................................................................................... 32 FIGURE 9: TIMING IN AUXILIARY MODE........................................................................................................ 33 FIGURE 10: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 33 FIGURE 11: RI BEHAVIORS ............................................................................................................................. 34 FIGURE 12: TIMING OF RESETTING MODULE ............................................................................................. 36 FIGURE 13: LED_WWAN# SIGNAL REFERENCE CIRCUIT DIAGRAM ........................................................ 36 FIGURE 14: WAKE# BEHAVIOR ...................................................................................................................... 37 FIGURE 15: DIMENSIONS OF THE RECEPTACLE RF CONNECTORS (UNIT: MM) .................................... 43 FIGURE 16: MECHANICALS OF U.FL-LP MATING PLUGS ........................................................................... 43 FIGURE 17: SPACE FACTOR OF MATING PLUGS (UNIT: MM) ..................................................................... 44 FIGURE 18: REFERENCED HEATSINK DESIGN ........................................................................................... 76 FIGURE 19: MECHANICAL DIMENSIONS OF EC25 MINI PCIE .................................................................... 77 FIGURE 20: STANDARD DIMENSIONS OF MINI PCI EXPRESS ................................................................... 78 FIGURE 21: DIMENSIONS OF THE MINI PCI EXPRESS CONNECTOR (MOLEX 679105700) .................... 79 EC25_Mini_PCIe_Hardware_Design 9 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 1 Introduction This document defines EC25 Mini PCIe module, and describes its air interfaces and hardware interfaces which are connected with customers applications. This document helps customers quickly understand module interface specifications, electrical characteristics, mechanical specifications and other related information of the module. To facilitate application designs, it also includes some reference designs for customers reference. The document, coupled with application notes and user guides, makes it easy to design and set up wireless applications with EC25 Mini PCIe. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a 1.1. FCC Certification Requirements. mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202012EC25T 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

EC25_Mini_PCIe_Hardware_Design 10 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE Band2:11.000dBi LTE Band 4 / LTE Band 66:5.000dBi LTE Band 5:9.541dBi LTE Band 12:8.734dBi LTE Band 71:8.545dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 configurations. If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR202012EC25T or Contains FCC ID: XMR202012EC25T must be used. The host OEM user EC25_Mini_PCIe_Hardware_Design 11 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. EC25_Mini_PCIe_Hardware_Design 12 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 1.2. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 Mini PCIe module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. EC25_Mini_PCIe_Hardware_Design 13 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 2 Product Concept 2.1. General Description EC25 Mini PCIe module provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks with PCI Express Mini Card 1.2 standard interface. It supports embedded operating systems such as Linux, Android, etc., and also provides audio, high-speed data transmission and GNSS functionalities for customers applications. EC25 Mini PCIe module can be applied in the following fields:

PDA and Laptop Computer Remote Monitor System Vehicle System Wireless POS System Wireless Router and Switch Other Wireless Terminal Devices This chapter generally introduces the following aspects of EC25 Mini PCIe module:

Product Series Key Features Functional Diagram Intelligent Meter Reading System NOTE EC25 Mini PCIe contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. EC25_Mini_PCIe_Hardware_Design 14 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 2.2. Description of Module Series EC25 Mini PCIe series contains 12 variants, and are listed in the following table. Table 1: Description of EC25 Mini PCIe Module Series Description EC25-A Mini PCIe EC25-AU Mini PCIe3) EC25-J Mini PCIe EC25-E Mini PCIe EC25-V Mini PCIe EC25-AF Mini PCIe Support LTE-FDD: B2/B4/B12 Support WCDMA: B2/B4/B5 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B2/B3/B4/B5/B7/B8/B28 Support LTE-TDD: B40 Support WCDMA: B1/B2/B5/B8 Support GSM: 850/900/1800/1900MHz Support LTE/WCDMA receive diversity3) Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B3/B8/B18/B19/B26 Support LTE-TDD: B41 Support WCDMA: B1/B6/B8/B19 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B3/B5/B7/B8/B20 Support LTE-TDD: B38/B40/B41 Support WCDMA: B1/B5/B8 Support GSM: 900/1800MHz Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B4/B13 Support LTE receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B2/B4/B5/B12/B13/B14/B66/B71 Support WCDMA: B2/B4/B5 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) EC25_Mini_PCIe_Hardware_Design 15 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Support LTE-FDD: B1/B3/B7/B8/B20/B28A Support LTE-TDD: B38/B40/B41 Support WCDMA: B1/B8 Support GSM: 900/1800MHz Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B3/B7/B8/B20/B28A Support LTE-TDD: B38/B40/B41 Support WCDMA: B1/B8 Support GSM: 900/1800MHz Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B2/B4/B5/B7/B28/B66 Support WCDMA: B2/B4/B5 Support LTE/WCDMA receive diversity Support digital audio2) Support LTE-FDD: B2/B4/B5/B12/B13/B14/B66/B71 Support WCDMA: B2/B4/B5 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B2/B3/B4/B5/B7/B8/B283) Support LTE-TDD: B40 Support WCDMA: B1/B2/B4/B5/B8 Support GSM: 850/900/1800/1900MHz Support LTE/WCDMA receive diversity3) Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B3/B5/B7/B8/B20 Support LTE-TDD: B38/B40/B41 Support WCDMA: B1/B5/B8 Support GSM: 900/1800MHz Support digital audio2) Support LTE-FDD: B2/B4/B5/B12/ B66/B71 Support LTE receive diversity Support GNSS1) Support digital audio2) EC25-EU Mini PCIe EC25-EUX Mini PCIe EC25-MX Mini PCIe EC25-AFX Mini PCIe EC25-AUX Mini PCIe3) EC25-EX Mini PCIe EC25-T Mini PCIe EC25_Mini_PCIe_Hardware_Design 16 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design NOTES 1. 2. 3. 1) GNSS function is optional. 2) Digital audio (PCM) function is only supported on Telematics version. 3) B2 on EC25-AU and EC25-AUX Mini PCIe does not support Rx-diversity. 2.3. Key Features The following table describes the detailed features of EC25 Mini PCIe module. Table 2: Key Features of EC25 Mini PCIe Features Description Function Interface PCI Express Mini Card 1.2 Standard Interface Power Supply Supply voltage: 3.0V~3.6V Typical supply voltage: 3.3V Class 4 (33dBm2dB) for GSM850 Class 4 (33dBm2dB) for EGSM900 Class 1 (30dBm2dB) for DCS1800 Class 1 (30dBm2dB) for PCS1900 Class E2 (27dBm3dB) for GSM850 8-PSK Class E2 (27dBm3dB) for EGSM900 8-PSK Class E2 (26dBm3dB) for DCS1800 8-PSK Class E2 (26dBm3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm2dB) for LTE-FDD bands Class 3 (23dBm2dB) for LTE-TDD bands Support up to 3GPP R8 non-CA Cat 4 FDD and TDD Support 1.4/3/5/10/15/20MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max 150Mbps (DL)/Max 50Mbps (UL) LTE-TDD: Max 130Mbps (DL)/Max 30Mbps (UL) Transmitting Power LTE Features UMTS Features Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL) GSM Features GPRS:

Support GPRS multi-slot class 33 (33 by default) EC25_Mini_PCIe_Hardware_Design 17 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL)/Max 85.6Kbps (UL) EDGE:

Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL)/Max 236.8Kbps (UL) Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/NITZ/

SMTP/SSL/MQTT/CMUX/SMTPS/MMS*/FILE* protocols Support protocols PAP (Password Authentication Protocol) and CHAP

(Challenge Handshake Authentication Protocol) which are usually used for PPP connection Internet Protocol Features SMS Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default

(U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V UART Interfaces Audio Features PCM Interface USB Interface Antenna Connectors Main UART:

Support RTS and CTS hardware flow control Baud rate can reach up to 230400bps, 115200bps by default Used for AT command communication and data transmission COEX UART*:

LTE/WLAN&BT coexistence UART Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA output and voice over USB. Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6~5.4, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc. Include main antenna, diversity antenna and GNSS antenna receptacle connectors EC25_Mini_PCIe_Hardware_Design 18 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Rx-diversity (Optional) Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Gen8C Lite of Qualcomm Protocol: NMEA 0183 Data update rate: 1Hz by default Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Physical Characteristics Size: (51.00.15)mm (30.00.15)mm (4.90.2)mm Weight: approx. 9.8g Temperature Range Operation temperature range: -35C to +75C1) Extended temperature range: -40C to +80C2) Storage temperature range: -40C to +90C Firmware Upgrade Upgrade via USB interface or DFOTA RoHS All hardware components are fully compliant with EU RoHS directive NOTES 1. 2. 3. 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call*, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again.

* means under development. EC25_Mini_PCIe_Hardware_Design 19 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 3 Application Interfaces The physical connections and signal levels of EC25 Mini PCIe comply with PCI Express Mini Card Electromechanical Specification. This chapter mainly describes the definition and application of the following interfaces/pins of EC25 Mini PCIe. Power supply USB interface UART interfaces PCM and I2C interfaces Control and indication pins

(U)SIM interface 3.1. Pin Assignment The following figure shows the pin assignment of EC25 Mini PCIe module. The top side contains EC25 module and antenna connectors. Figure 1: Pin Assignment EC25_Mini_PCIe_Hardware_Design 20 / 80 PIN1 PIN2 TOP BOT PIN51 PIN52 Pin No. Pin Name WAKE#

COEX_UART_RX COEX_UART_TX RESERVED 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 GND UART_RX UART_TX GND RESERVED RI GND UART_CTS UART_RTS GND GND DTR GND GND RESERVED VCC_3V3 VCC_3V3 GND PCM_CLK PCM_DOUT PCM_DIN PCM_SYNC Pin No. Pin Name VCC_3V3 GND NC USIM_VDD USIM_DATA USIM_CLK USIM_RST RESERVED GND W_DISABLE#

PERST#

RESERVED GND NC I2C_SCL I2C_SDA GND USB_DM USB_DP GND LED_WWAN#

USIM_PRESENCE RESERVED NC GND VCC_3V3 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 LTE Standard Module Series EC25 Mini PCIe Hardware Design 3.2. Pin Description The following tables show the pin definition and description of the 52 pins on EC25 Mini PCIe. Table 3: I/O Parameters Definition Description Digital Input Digital Output Bidirectional Open Collector Power Input Power Output Open drain Type DI DO IO OC PI PO OD 1 2 3 4 5 6 7 Table 4: Pin Description Pin No. Mini PCI Express Standard Name EC25 Mini PCIe Pin Name I/O Description Comment WAKE#

WAKE#

3.3Vaux VCC_3V3 OC PI Output signal used to wake up the host. 3.0V~3.6V, typically 3.3V DC supply COEX1 COEX_UART_RX DI GND GND Mini card ground COEX2 COEX_UART_TX DO 1.5V NC Not connected CLKREQ#

RESERVED Reserved LTE/WLAN&BT coexistence receive signal It is prohibited to be pulled up high before startup. LTE/WLAN&BT coexistence transmitting signal It is prohibited to be pulled up high before startup. EC25_Mini_PCIe_Hardware_Design 21 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design UIM_PWR USIM_VDD PO GND GND Mini card ground UIM_DATA USIM_DATA IO Power supply for the

(U)SIM card Data signal of (U)SIM card REFCLK-

UART_RX DI UART receive data UIM_CLK USIM_CLK DO Clock signal of (U)SIM card REFCLK+

UART_TX DO UART transmit data UIM_RESET USIM_RST DO Reset signal of (U)SIM card GND GND Mini card ground UIM_VPP RESERVED Reserved RESERVED RI DO Ring indication GND GND Mini card ground RESERVED RESERVED Reserved 20 W_DISABLE#

W_DISABLE#

DI Airplane mode control 21 GND GND Mini card ground 22 PERST#

PERST#

DI Fundamental reset signal PERn0 UART_CTS DI UART clear to send 3.3Vaux RESERVED Reserved PERp0 UART_RTS DO UART request to send GND GND 1.5V GND GND GND NC GND Mini card ground Mini card ground Not connected Mini card ground 8 9 10 11 12 13 14 15 16 17 18 19 23 24 25 26 27 28 29 Connect to DTEs TX. Connect to DTEs RX. Pulled up by default. Active low. Pulled up by default. Active low. Connect to DTEs RTS. Connect to DTEs CTS. EC25_Mini_PCIe_Hardware_Design 22 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 30 SMB_CLK I2C_SCL OD I2C serial clock 31 PETn0 DTR DI Sleep mode control 32 SMB_DATA I2C_SDA OD I2C serial data PETp0 RESERVED Reserved GND GND GND GND Mini card ground Mini card ground 36 USB_D-

USB_DM IO USB differential data (-) 37 GND GND Mini card ground 38 USB_D+

USB_DP IO USB differential data (+) Require external pull-up to 1.8V. Require external pull-up to 1.8V. Require differential impedance of 90. Require differential impedance of 90. 42 LED_WWAN#

LED_WWAN#

OC Active low 3.3Vaux VCC_3V3 PI 3.0V~3.6V, typically 3.3V DC supply GND GND Mini card ground 3.3Vaux VCC_3V3 PI 3.0V~3.6V, typically 3.3V DC supply LED signal for indicating the network status of the module GND GND Mini card ground LED_WLAN#

USIM_PRESENCE DI

(U)SIM card insertion detection RESERVED PCM_CLK1) IO PCM clock signal LED_WPAN#

RESERVED Reserved RESERVED PCM_DOUT1) DO PCM data output 1.5V NC Not connected RESERVED PCM_DIN1) DI PCM data input 33 34 35 39 40 41 43 44 45 46 47 48 49 EC25_Mini_PCIe_Hardware_Design 23 / 80 50 51 52 NOTES LTE Standard Module Series EC25 Mini PCIe Hardware Design GND GND Mini card ground RESERVED PCM_SYNC1) 3.3Vaux VCC_3V3 IO PI PCM frame synchronization 3.0V~3.6V, typically 3.3V DC supply 1) The digital audio (PCM) function is only supported on Telematics version. 1. 2. Keep all NC, reserved and unused pins unconnected. 3.3. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters. Table 5: Overview of Operating Modes Mode Details Normal Operation Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. Minimum Functionality Mode AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. Airplane Mode AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. Sleep Mode In this mode, the current consumption of the module will be reduced to the minimal level. In this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. 3.4. Power Saving 3.4.1. Sleep Mode EC25 Mini PCIe is able to reduce its current consumption to a minimum value in sleep mode. There are three preconditions must be met to make the module enter sleep mode. EC25_Mini_PCIe_Hardware_Design 24 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Execute AT+QSCLK=1 to enable sleep mode. Ensure the DTR is kept at high level or be kept open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. 3.4.2. Airplane Mode When the module enters airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. For more details, please refer to Chapter 3.10.3. 3.5. Power Supply The following table shows pin definition of VCC_3V3 pins and ground pins. Table 6: Definition of VCC_3V3 and GND Pins Pin Name Pin No. I/O Power Domain Description VCC_3V3 2, 39, 41, 52 PI 3.0V~3.6V Typically 3.3V DC supply GND Mini card ground 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 The typical supply voltage of EC25 Mini PCIe is 3.3V. In the 2G network, the input peak current may reach 2.7A during the transmitting time. Therefore, the power supply must be able to provide a rated output current of 2.7A at least, and a bypass capacitor of no less than 470F with low ESR should be used to prevent the voltage from dropping. If the switching power supply is used to supply power to the module, the power device and power supply routing traces of the switching power supply should avoid the antennas as much as possible to prevent EMI interference. The following figure shows a reference design of power supply where R2 and R3 are 1% tolerance resistors and C3 is a low-ESR capacitor. EC25_Mini_PCIe_Hardware_Design 25 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 2: Reference Circuit of Power Supply 3.6. (U)SIM Interface EC25 Mini PCIes (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V

(U)SIM cards are supported. The following table shows the pin definition of (U)SIM interface. Table 7: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Power Domain Description USIM_VDD USIM_DATA USIM_CLK USIM_RST 8 10 12 14 PO 1.8V/3.0V Power supply for (U)SIM card IO DO 1.8V/3.0V Data signal of (U)SIM card 1.8V/3.0V Clock signal of (U)SIM card DO 1.8V/3.0V Reset signal of (U)SIM card USIM_PRESENCE 44 DI 1.8V

(U)SIM card insertion detection EC25 Mini PCIe supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections. By default, It is disabled, and can be configured via AT+QSIMDET command. Please refer to document [2] for details about the command. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. EC25_Mini_PCIe_Hardware_Design 26 / 80 LDO_IN VCC_3V3 MIC29302WU U1 2 IN R1 N E OUT 4 J D A D N G D1 C1 C2 TVS 470F 100nF 51K 1 3 5 82K 1%

R4 R2 R3 47K 1%

C3 C4 C5 C6 470R 470F 100nF 33pF 10pF R5 4.7K MCU_POWER _ON/OFF R6 47K LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 3: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 4: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector EC25_Mini_PCIe_Hardware_Design 27 / 80 USIM_VDD 15K Module GND USIM_VDD USIM_RST USIM_CLK USIM_PRESENCE USIM_DATA 0R 0R 0R 100nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33pF 33pF 33pF GND GND GND USIM_VDD 15K Module GND USIM_VDD USIM_RST USIM_CLK USIM_DATA 0R 0R 0R 100nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33pF 33pF 33pF GND GND LTE Standard Module Series EC25 Mini PCIe Hardware Design In order to enhance the reliability and availability of the (U)SIM card in customers applications, please follow the criteria below in (U)SIM circuit design:

Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and power supply traces. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode with parasitic capacitance not exceeding 15pF. The 0 resistors should be added in series between the module and the (U)SIM card connector so as to facilitate debugging. The 33pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 3.7. USB Interface EC25 Mini PCIe provides one integrated Universal Serial Bus (USB) interface which complies with USB 2.0 specification. It can only be used as a slave device. Meanwhile, it supports high speed (480Mbps) mode and full speed (12Mbps) mode. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface. Table 8: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_DM USB_DP 36 38 IO USB differential data (-) Require differential impedance of 90 IO USB differential data (+) Require differential impedance of 90 The following figure shows a reference circuit of USB interface. EC25_Mini_PCIe_Hardware_Design 28 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 5: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner layer with ground shielding on not only upper and lower layers but also right and left sides. Keep the ESD protection components to the USB connector as close as possible. 3.8. UART Interfaces The following table shows the pin definition of the main UART and COEX UART* interfaces. 3.8.1. Main UART Interface The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps and 230400bps baud rates, and the default is 115200bps. This interface supports RTS and CTS hardware flow control, and be used for AT command communication and data transmission. EC25_Mini_PCIe_Hardware_Design 29 / 80 Minimize these stubs Test Points Module USB_DM USB_DP GND NM_0R NM_0R R3 R4 L1 ESD Array Close to Module MCU USB_DM USB_DP GND LTE Standard Module Series EC25 Mini PCIe Hardware Design The following table shows the pin definition of the main UART interface. Table 9: Pin Definition of Main UART Interface Pin Name Pin No. I/O Power Domain Description UART_RX UART_TX UART_CTS UART_RTS 11 13 23 25 DI 3.3V UART receive data DO 3.3V UART transmit data DI DO 3.3V 3.3V UART clear to send UART request to send The signal level of main UART interface is 3.3V. When connecting to the peripheral MCU/RAM, customers need to pay attention to the signal direction. The reference circuit is as follows:

Figure 6: Reference Circuit of Power Supply 3.8.2. COEX UART Interface*

The following table shows the pin definition of the COEX UART interface. Table 10: Pin Definition of COEX UART Interface Pin No. Pin Name I/O Power Domain Description 3 COEX_UART_RX DI 1.8V LTE/WLAN&BT coexistence receive signal. EC25_Mini_PCIe_Hardware_Design 30 / 80 MCU/ARM TXD RXD RTS CTS GND Module UART_TXD UART_RXD UART_RTS UART_CTS GND Voltage level: 3.3V Voltage level: 3.3V LTE Standard Module Series EC25 Mini PCIe Hardware Design It is prohibited to be pulled up high before startup. LTE/WLAN&BT coexistence transmitting signal. It is prohibited to be pulled up high before startup. 5 COEX_UART_TX DO 1.8V NOTES 1. AT+IPR command can be used to set the baud rate of the main UART, and AT+IFC command can be used to set the hardware flow control (hardware flow control is disabled by default). Please refer to document [2] for details. 2. * means under development. 3.9. PCM and I2C Interfaces EC25 Mini PCIe provides one Pulse Code Modulation (PCM) digital interface and one I2C interface. The following table shows the pin definition of PCM and I2C interfaces that can be applied in audio codec design. Table 11: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Power Domain Description PCM_CLK PCM_DOUT PCM_DIN PCM_SYNC I2C_SCL I2C_SDA 45 47 49 51 30 32 IO DO DI IO 1.8V 1.8V 1.8V 1.8V OD 1.8V OD 1.8V PCM clock signal PCM data output PCM data input PCM frame synchronization I2C serial clock. Require external pull-up to 1.8V. I2C serial data. Require external pull-up to 1.8V. EC25 Mini PCIe provides one PCM digital interface, which supports 16-bit linear data format and the following modes:

EC25_Mini_PCIe_Hardware_Design 31 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Primary mode (short frame synchronization, works as either master or slave) Auxiliary mode (long frame synchronization, works as master only) NOTE The digital audio (PCM) function is only supported on Telematics version. In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK at 8kHz PCM_SYNC, and also supports 4096kHz PCM_CLK at 16kHz PCM_SYNC. The following figure shows the timing relationship in primary mode with 8kHz PCM_SYNC and 2048kHz PCM_CLK. Figure 7: Timing in Primary Mode In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK and an 8KHz, 50% duty cycle PCM_SYNC. The following figure shows the timing relationship in auxiliary mode with 8kHz PCM_SYNC and 256kHz PCM_CLK. EC25_Mini_PCIe_Hardware_Design 32 / 80 125us PCM_CLK 1 2 255 256 PCM_SYNC PCM_DOUT PCM_DIN MSB LSB MSB MSB LSB MSB LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 8: Timing in Auxiliary Mode Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. In addition, EC25 Mini PCIes firmware has integrated the configuration on some PCM codecs application with I2C interface. Please refer to document [2] for details about AT+QDAI command. The following figure shows a reference design of PCM interface with an external codec IC. Figure 9: Reference Circuit of PCM Application with Audio Codec NOTE Digital audio (PCM) function is only supported on Telematics version. EC25_Mini_PCIe_Hardware_Design 33 / 80 125us PCM_CLK 1 2 31 32 PCM_SYNC PCM_DOUT PCM_DIN MSB MSB LSB LSB PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN I2C_SCL I2C_SDA Module K 2

. 2 K 2

. 2 1.8V S A B I BCLK FS DACIN ADCOUT SCLK SDIN MIC_BIAS MIC+

MIC-

SPKOUT+

SPKOUT-

Codec LTE Standard Module Series EC25 Mini PCIe Hardware Design 3.10. Control and Indication Signals The following table shows the pin definition of control and indication signals. Table 12: Pin Definition of Control and Indication Signals Pin Name Pin No. I/O Power Domain Description RI DTR 17 31 DO 3.3V Output signal used to wake up the host DI 3.3V Sleep mode control W_DISABLE#

20 DI 3.3V PERST#

22 DI 3.3V LED_WWAN#

42 OC Airplane mode control;

Pulled up by default;

Active low. Fundamental reset signal;

Active low. LED signal for indicating the network status of the module;

Active low. WAKE#

1 OC Output signal to wake up the host. 3.10.1. RI Signal The RI signal can be used to wake up the host. When a URC returns, there will be the following behaviors on the RI pin after executing AT+QCFG="risignaltype","physical". Figure 10: RI Behaviors EC25_Mini_PCIe_Hardware_Design 34 / 80 High Low 120ms URC return LTE Standard Module Series EC25 Mini PCIe Hardware Design 3.10.2. DTR Signal The DTR signal is used for sleep mode control. It is pulled up by default. When module is in sleep mode, driving it to low level can wake up the module. For more details about the preconditions for module to enter sleep mode, please refer to Chapter 3.4.1. 3.10.3. W_DISABLE# Signal EC25 Mini PCIe provides a W_DISABLE# signal to disable or enable the RF function (excluding GNSS). The W_DISABLE# pin is pulled up by default. Its control function for airplane mode is disabled by default, and AT+QCFG=airplanecontrol,1 can be used to enable the function. Driving it to low level can make the module enter airplane mode. The RF function can also be enabled or disabled through AT commands AT+CFUN, and the details are as follows. Table 13: Airplane Mode Controlled by Hardware Method W_DISABLE#

RF Function Status Module Operation Mode High level Low level RF enabled Normal mode RF disabled Airplane mode Software method can be controlled by AT+CFUN, and the details are as follows. Table 14: Airplane Mode Controlled by Software Method AT+CFUN=?

RF Function Status Module Operation Mode 0 1 4 RF and (U)SIM disabled Minimum functionality mode RF enabled Normal mode RF disabled Airplane mode 3.10.4. PERST# Signal The PERST# signal can be used to force a hardware reset on the card. The module can be reset by driving the PERST# signal low for 150ms~460ms and then releasing it. The PERST# signal is sensitive to interference. The traces should be as short as possible and be surrounded with ground. The reset scenario is illustrated in the following figure. EC25_Mini_PCIe_Hardware_Design 35 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 11: Timing of Resetting Module 3.10.5. LED_WWAN# Signal The LED_WWAN# signal of EC25 Mini PCIe is used to indicate the network status of the module, and can absorb a current up to 40mA. According to the following circuit, in order to reduce the current of the LED, a resistor must be placed in series with the LED. The LED is emitting light when the LED_WWAN# output signal is low. Figure 12: LED_WWAN# Signal Reference Circuit Diagram There are two indication modes for LED_WWAN# signal to indicate network status, which can be switched through following AT commands:

AT+QCFG="ledmode",0 (Default setting) AT+QCFG="ledmode",2 The following tables show the detailed network status indications of the LED_WWAN# signal. EC25_Mini_PCIe_Hardware_Design 36 / 80 VCC_3V3 PERST#

Module Status 150ms 460ms VIL0.5V VIH2.3V Running Resetting Restart LED_WWAN#

R VCC LTE Standard Module Series EC25 Mini PCIe Hardware Design Table 15: Indications of Network Status (AT+QCFG="ledmode",0, Default Setting) Pin Status Description Flicker slowly (200ms Low/1800ms High) Network searching Flicker slowly (1800ms Low/200ms High) Idle Flicker quickly (125ms Low/125ms High) Data transfer is ongoing Always Low Voice calling Table 16: Indications of Network Status (AT+QCFG="ledmode",2) Pin Status Description Low Level (Light ON) Registered on network successfully High Impedance (Light OFF) No network coverage or not registered W_DISABLE# signal is at low level. (Disable RF) AT+CFUN=0, AT+CFUN=4 3.10.6. WAKE# Signal The WAKE# signal is an open collector signal which is similar to RI signal, but a host pull-up resistor and AT+QCFG="risignaltype","physical" command are required. When a URC returns, a 120ms low level pulse will be outputted. The state of WAKE# signal is shown as below. Figure 13: WAKE# Behavior EC25_Mini_PCIe_Hardware_Design 37 / 80 High

(external pull-up) Low 120ms URC return LTE Standard Module Series EC25 Mini PCIe Hardware Design 4 GNSS Receiver 4.1. General Description EC25 Mini PCIe includes a fully integrated global navigation satellite system solution that supports Qualcomm Gen8C Lite (GPS, GLONASS, BeiDou/Compass, Galileo and QZSS). Additionally, it supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC25 Mini PCIe GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows the GNSS performance of EC25 Mini PCIe. Table 17: GNSS Performance Parameter Description Conditions Sensitivity

(GNSS) Cold start Autonomous Reacquisition Autonomous Tracking Autonomous TTFF

(GNSS) Warm start

@open sky Cold start

@open sky Hot start

@open sky Autonomous XTRA enabled Autonomous XTRA enabled Autonomous XTRA enabled Typ.

-146

-157

-157 35 18 26 2.2 2.5 1.8 Unit dBm dBm dBm s s s s s s EC25_Mini_PCIe_Hardware_Design 38 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design CEP-50

<2.5 m Autonomous

@open sky 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock. 3. Cold start sensitivity: the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command. Accuracy

(GNSS) NOTES 4.3. GNSS Frequency The following table shows the GNSS frequency of EC25 Mini PCIe. Table 18: GNSS Frequency Frequency 1575.421.023 GLONASS 1597.5~1605.8 Galileo 1575.422.046 BeiDou (Compass) 1561.0982.046 1575.42 Type GPS QZSS Unit MHz MHz MHz MHz MHz EC25_Mini_PCIe_Hardware_Design 39 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 5 Antenna Connection 5.1. Antenna Connectors EC25 Mini PCIe is mounted with three antenna connectors for external antenna connection: a main antenna connector, an Rx-diversity antenna connector, and a GNSS antenna connector. And Rx-diversity function is enabled by default. The impedance of the antenna connectors is 50. 5.1.1. Operating Frequency Table 19: Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 WCDMA B19 LTE-FDD B1 LTE-FDD B2 Transmit 824~849 880~915 1710~1785 1850~1910 1920~1980 1850~1910 1710~1755 824~849 830~840 880~915 830~845 1920~1980 1850~1910 Receive 869~894 925~960 1805~1880 1930~1990 2110~2170 1930~1990 2110~2155 869~894 875~885 925~960 875~890 2110~2170 1930~1990 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EC25_Mini_PCIe_Hardware_Design 40 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B3 LTE-FDD B4 1710~1785 1710~1755 LTE-FDD B5 824~849 LTE-FDD B7 2500~2570 2620~2690 1805~1880 2110~2155 869~894 925~960 729~746 746~756 758~768 860~875 875~890 791~821 859~894 758~803 2570~2620 2300~2400 2555~2655 2100~2200 617~652 MHz MHz MHz MHz MHz MHz MHz MHZ MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B26 LTE-FDD B28 880~915 699~716 777~787 788~798 815~830 830~845 832~862 814~849 703~748 LTE-TDD B38 2570~2620 LTE-TDD B40 2300~2400 LTE-TDD B41 2555~2655 LTE-FDD B66 1710~1780 LTE-FDD B71 663~698 EC25_Mini_PCIe_Hardware_Design 41 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 5.2. Antenna Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 20: Antenna Requirements Type Requirements Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain: < 17dB VSWR: 2 Efficiency: > 30%

Max input power: 50W Input impedance: 50 Cable insertion loss: < 1dB

(GSM850, EGSM900, WCDMA B5/B6/B8/B19, LTE-FDD B5/B8/B12/B13/B14/B18/B19/B20/B26/B28/B71) Cable insertion loss: < 1.5dB

(DCS1800, PCS1900, WCDMA B1/B2/B4, LTE-FDD B1/B2/B3/B4/B66) Cable insertion loss: < 2dB

(LTE-FDD B7, LTE-TDD B38/B40/B41) 1. It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 2. Since the GNSS port has a 2.85V voltage output, a passive antenna that causes shorting to GND, such as PIFA antenna is not recommended. GSM/UMTS/LTE GNSS1) NOTES EC25_Mini_PCIe_Hardware_Design 42 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 5.3. Recommended Mating Plugs for Antenna Connection EC25 Mini PCIe is mounted with RF connectors (receptacles) for convenient antenna connection. The dimensions of the antenna connectors are shown as below. Figure 14: Dimensions of the Receptacle RF Connectors (Unit: mm) U.FL-LP mating plugs listed in the following figure can be used to match the receptacles. Figure 15: Mechanicals of U.FL-LP Mating Plugs EC25_Mini_PCIe_Hardware_Design 43 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design The following figure describes the space factor of mating plugs. Figure 16: Space Factor of Mating Plugs (Unit: mm) For more details of the recommended mating plugs, please visit http://www.hirose.com. EC25_Mini_PCIe_Hardware_Design 44 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. General Description I/O requirements This chapter mainly describes the following electrical and radio characteristics of EC25 Mini PCIe:

Power supply requirements RF characteristics ESD characteristics Current consumption Thermal consideration 6.2. Power Supply Requirements The input voltage of EC25 Mini PCIe is 3.0V~3.6V, as specified by PCI Express Mini CEM Specifications 1.2. The following table shows the power supply requirements of EC25 Mini PCIe. Table 21: Power Supply Requirements Parameter Description Min. Typ. Max. VCC_3V3 Power Supply 3.0 3.3 3.6 Unit V EC25_Mini_PCIe_Hardware_Design 45 / 80 VIH VIL VOH VOL NOTES LTE Standard Module Series EC25 Mini PCIe Hardware Design 6.3. I/O Requirements The following table shows the I/O requirements of EC25 Mini PCIe. Table 22: I/O Requirements Parameter Description Min. Max. Unit Input High Voltage 0.7 VCC_3V3 VCC_3V3 + 0.3 Input Low Voltage

-0.3 0.3 VCC_3V3 Output High Voltage VCC_3V3 - 0.5 VCC_3V3 Output Low Voltage 0 0.4 V V V V 1. The PCM and I2C interfaces belong to 1.8V power domain and other I/O interfaces belong to VCC_3V3 power domain. 2. The maximum voltage value of VIL for PERST# signal and W_DISABLE# signal is 0.5V. 6.4. RF Characteristics The following tables show the conducted RF output power and receiving sensitivity of EC25 Mini PCIe module. Table 23: Conducted RF Output Power of EC25 Mini PCIe Frequency Bands Max. Min. GSM850/EGSM900 33dBm2dB 5dBm5dB DCS1800/PCS1900 30dBm2dB 0dBm5dB GSM850/EGSM900 (8-PSK) 27dBm3dB 5dBm5dB DCS1800/PCS1900 (8-PSK) 26dBm3dB 0dBm5dB WCDMA bands 24dBm+1/-3dB

< -49dBm EC25_Mini_PCIe_Hardware_Design 46 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD bands LTE-TDD bands 23dBm2dB

< -39dBm 23dBm2dB

< -39dBm Table 24: Conducted RF Receiving Sensitivity of EC25-A Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-110.0dBm WCDMA B4

-110.0dBm WCDMA B5

-110.5dBm

-104.7dBm

-106.7dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98.0dBm

-98.0dBm

-101.0dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.5dBm

-99.0dBm

-101.0dBm

-96.3dBm LTE-FDD B12 (10MHz)

-97.2dBm

-98.0dBm

-101.0dBm

-93.3dBm Table 25: Conducted RF Receiving Sensitivity of EC25-AU Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO)

-102.0dBm

-102.0dBm

-102.0dBm

-102.0dBm

-104.7dBm GSM850

-109.0dBm EGSM900

-109.0dBm DCS1800

-109.0dBm PCS1900

-109.0dBm WCDMA B2

-110.0dBm

WCDMA B1

-110.0dBm

-109dBm

-112dBm

-106.7dBm WCDMA B5

-111.0dBm

-112dBm

-113dBm

-104.7dBm WCDMA B8

-111.0dBm

-111dBm

-113dBm

-103.7dBm LTE-FDD B1 (10MHz)

-97.2dBm

-97.5dBm

-100.2dBm

-96.3dBm LTE-FDD B2 (10MHz)

-98.2dBm

-94.3dBm LTE-FDD B3 (10MHz)

-98.7dBm

-98.6dBm

-102.2dBm

-93.3dBm

EC25_Mini_PCIe_Hardware_Design 47 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B4 (10MHz)

-97.7dBm

-97.4dBm

-100.2dBm

-96.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.2dBm

-101.0dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.7dBm

-97.7dBm

-101.2dBm

-94.3dBm LTE-FDD B8 (10MHz)

-99.2dBm

-98.2dBm

-102.2dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.6dBm

-98.7dBm

-102.0dBm

-94.8dBm LTE-TDD B40 (10MHz)

-97.2dBm

-98.4dBm

-101.2dBm

-96.3dBm Table 26: Conducted RF Receiving Sensitivity of EC25-J Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B1

-110.0dBm WCDMA B6

-110.5dBm WCDMA B8

-110.5dBm WCDMA B19

-110.5dBm

-106.7dBm

-106.7dBm

-103.7dBm

-106.7dBm LTE-FDD B1 (10MHz)

-97.5dBm

-98.7dBm

-100.2dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-97.1dBm

-100.5dBm

-93.3dBm LTE-FDD B8 (10MHz)

-98.4dBm

-99.0dBm

-101.2dBm

-93.3dBm LTE-FDD B18 (10MHz)

-99.5dBm

-99.0dBm

-101.7dBm

-96.3dBm LTE-FDD B19 (10MHz)

-99.2dBm

-99.0dBm

-101.4dBm

-96.3dBm LTE-FDD B26 (10MHz)

-99.5dBm

-99.0dBm

-101.5dBm

-93.8dBm LTE-TDD B41 (10MHz)

-95.0dBm

-95.7dBm

-99.0dBm

-94.3dBm Table 27: Conducted RF Receiving Sensitivity of EC25-E Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-109.0dBm DCS1800

-109.0dBm

-102.0dBm

-102.0dbm

EC25_Mini_PCIe_Hardware_Design 48 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA B1

-110.5dBm WCDMA B5

-110.5dBm WCDMA B8

-110.5dBm

-106.7dBm

-104.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-98.0dBm

-101.5dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-98.5dBm

-101.5dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.5dBm

-101.0dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-97.0dBm

-99.5dBm

-94.3dBm LTE-FDD B8 (10MHz)

-97.0dBm

-97.0dBm

-101.0dBm

-93.3dBm LTE-FDD B20 (10MHz)

-97.5dBm

-99.0dBm

-102.5dBm

-93.3dBm LTE-TDD B38 (10MHz)

-95.0dBm

-97.0dBm

-98.9dBm

-96.3dBm LTE-TDD B40 (10MHz)

-96.3dBm

-98.0dBm

-101.0dBm

-96.3dBm LTE-TDD B41 (10MHz)

-94.5dBm

-97.0dBm

-98.5dBm

-94.3dBm Table 28: Conducted RF Receiving Sensitivity of EC25-V Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B4 (10MHz)

-97.5dBm

-99.0dBm

-101.0dBm

-96.3dBm LTE-FDD B13 (10MHz)

-97.7dBm

-97.0dBm

-100.0dBm

-93.3dBm Table 29: Conducted RF Receiving Sensitivity of EC25-AF Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-109.5dBm

-110dBm

-110.4dBm

-104.7dBm WCDMA B4

-109.6dBm

-110dBm

-110.6dBm

-106.7dBm WCDMA B5

-110.5dBm

-110dBm

-110.7dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98.0dBm

-98.5dBm

-100.5dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.5dBm

-98.2dBm

-99.5dBm

-93.3dBm EC25_Mini_PCIe_Hardware_Design 49 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B5 (10MHz)

-98.0dBm

-98.5dBm

-100.5dBm

-94.3dBm LTE-FDD B12 (10MHz)

-99.0dBm

-99.5dBm

-100.5dBm

-93.3dBm LTE-FDD B13 (10MHz)

-98.5dBm

-99.5dBm

-100.7dBm

-93.3dBm LTE-FDD B14 (10MHz)

-99.4dBm

-99.5dBm

-100.9dBm

-93.3dBm LTE-FDD B66 (10MHz)

-97.5dBm

-98.5dBm

-99.6dBm

-95.8dBm LTE-FDD B71 (10MHz)

-98.6dBm

-99.5dBm

-100dBm

-93.5dBm Table 30: Conducted RF Receiving Sensitivity of EC25-AFX Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-109.6dBm

-110dBm

-110.4dBm

-104.7dBm WCDMA B4

-109.6dBm

-110dBm

-110.6dBm

-106.7dBm WCDMA B5

-110.5dBm

-110dBm

-110.7dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98.0dBm

-98.5dBm

-100.5dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.6dBm

-98.2dBm

-99.5dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.5dBm

-100.5dBm

-94.3dBm LTE-FDD B12 (10MHz)

-99.0dBm

-99.5dBm

-100.5dBm

-93.3dBm LTE-FDD B13 (10MHz)

-98.5dBm

-99.7dBm

-100.8dBm

-93.3dBm LTE-FDD B14 (10MHz)

-99.4dBm

-99.5dBm

-100.9dBm

-93.3dBm LTE-FDD B66 (10MHz)

-97.5dBm

-98.5dBm

-99.6dBm

-95.8dBm LTE-FDD B71 (10MHz)

-98.8dBm

-99.7dBm

-100.5dBm

-93.5dBm Table 31: Conducted RF Receiving Sensitivity of EC25-EU Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-108dBm DCS1800

-108.6dBm

-102.0dBm

-102.0dbm EC25_Mini_PCIe_Hardware_Design 50 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design

WCDMA B1

-110dBm

-109dBm WCDMA B8

-110dBm

-111dBm

-106.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.2dBm

-99.0dBm

-101.2dBm

-96.3dBm LTE-FDD B3 (10MHz)

-97.7dBm

-99.8dBm

-101.0dBm

-93.3dBm LTE-FDD B7 (10MHz)

-96.7dBm

-98.5dBm

-100.2dBm

-94.3dBm LTE-FDD B8 (10MHz)

-98.2dBm

-100.4dBm

-101.7 dBm

-93.3dBm LTE-FDD B20 (10MHz)

-98.2dBm

-100.8dBm

-101.7dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.2dBm

-100.5dBm

-101.7dBm

-94.8dBm LTE-TDD B38 (10MHz)

-95dBm

-97.0dBm

-99.7dBm

-96.3dBm LTE-TDD B40 (10MHz)

-95.9dBm

-98.0dBm

-100.2dBm

-96.3dBm LTE-TDD B41 (10MHz)

-94.8dBm

-97.0dBm

-99.7dBm

-94.3dBm Table 32: Conducted RF Receiving Sensitivity of EC25-EUX Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-109.0dBm DCS1800

-109.0dBm WCDMA B1

-110.5dBm WCDMA B8

-110.5dBm

-102.0dBm

-102.0dbm

-106.7dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-98.0dBm

-101dBm

-96.3dBm LTE-FDD B3 (10MHz)

-96.5dBm

-98.5dBm

-99.5dBm

-93.3dBm LTE-FDD B7 (10MHz)

-97.0dBm

-94.5dBm

-99.5dBm

-94.3dBm LTE-FDD B8 (10MHz)

-97.0dBm

-97.0dBm

-100.0dBm

-93.3dBm LTE-FDD B20 (10MHz)

-97.5dBm

-99.0dBm

-101.5dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.6dBm

-98.7dBm

-101.0dBm

-94.8dBm LTE-TDD B38 (10MHz)

-96.3dBm

-97dBm

-98.5dBm

-96.3dBm EC25_Mini_PCIe_Hardware_Design 51 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-TDD B40 (10MHz)

-96.9dBm

-98.0dBm

-99.1dBm

-96.3dBm LTE-TDD B41 (10MHz)

-95.3dBm

-97.5dBm

-98.0dBm

-94.3dBm Table 33: Conducted RF Receiving Sensitivity of EC25-MX Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-110dBm

-110dBm WCDMA B4

-109.5dBm

-110dBm WCDMA B5

-110dBm

-110dBm

-104.7dBm

-106.7dBm

-104.7dBm LTE-FDD B2 (10MHz)

-98.2dBm

-99.1dBm

-101.5dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.2dBm

-98.2dBm

-101.2dBm

-96.3dBm LTE-FDD B5 (10MHz)

-98.2dBm

-99.2dBm

-102.2dBm

-94.3dBm LTE-FDD B7 (10MHz)

-95.7dBm

-98.5dBm

-100.2dBm

-94.3dBm LTE-FDD B28 (10MHz)

-97.2dBm

-99.3dBm

-101.7dBm

-94.8dBm LTE-FDD B66 (10MHz)

-97.2dBm

-98.4dBm

-101.2dBm

-95.8dBm Table 34: Conducted RF Receiving Sensitivity of EC25-AUX Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) GSM850

-109.0dBm EGSM900

-109.0dBm DCS1800

-109.0dBm PCS1900

-109.0dBm WCDMA B2

-110.5dBm

-102.0dBm

-102.0dBm

-102.0dBm

-102.0dBm

-104.7dBm WCDMA B1

-110.0dBm

-109.5dBm

-112dBm

-106.7dBm WCDMA B4

-110.0dBm

-110dBm

-112dBm

-104.7dBm WCDMA B5

-111.0dBm

-112dBm

-113dBm

-104.7dBm EC25_Mini_PCIe_Hardware_Design 52 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA B8

-111.0dBm

-112dBm

-113dBm

-103.7dBm LTE-FDD B1 (10MHz)

-98.0dBm

-97.7dBm

-101.2dBm

-96.3dBm LTE-FDD B2 (10MHz)

-98.5dBm

-94.3dBm LTE-FDD B3 (10MHz)

-99.0dBm

-98.8dBm

-102.2dBm

-93.3dBm LTE-FDD B4 (10MHz)

-97.7dBm

-97.6dBm

-100.2dBm

-96.3dBm LTE-FDD B5 (10MHz)

-98.5dBm

-98.2dBm

-101.0dBm

-94.3dBm LTE-FDD B7 (10MHz)

-97.7dBm

-97.7dBm

-101.2dBm

-94.3dBm LTE-FDD B8 (10MHz)

-99.0dBm

-98.5dBm

-102.2dBm

-93.3dBm LTE-FDD B28 (10MHz)

-98.0dBm

-98.7dBm

-101.5dBm

-94.8dBm LTE-TDD B40 (10MHz)

-97.5dBm

-98.2dBm

-101.2dBm

-96.3dBm Table 35: Conducted RF Receiving Sensitivity of EC25-EX Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-109.0dBm DCS1800

-109.0dBm WCDMA B1

-110.0dBm WCDMA B5

-110.0dBm WCDMA B8

-110.0dBm LTE-FDD B1 (10MHz)

-98.0dBm LTE-FDD B3 (10MHz)

-98.2dBm LTE-FDD B5 (10MHz)

-98.5dBm LTE-FDD B7 (10MHz)

-95.8dBm LTE-FDD B8 (10MHz)

-98.5dBm LTE-FDD B20 (10MHz)

-98.0dBm LTE-TDD B38 (10MHz)

-97.0dBm

-102.0dBm

-102.0dbm

-106.7dBm

-104.7dBm

-103.7dBm

-96.3dBm

-93.3dBm

-94.3dBm

-94.3dBm

-93.3dBm

-93.3dBm

-96.3dBm EC25_Mini_PCIe_Hardware_Design 53 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-TDD B40 (10MHz)

-96.9dBm LTE-TDD B41 (10MHz)

-97.0dBm

-96.3dBm

-94.3dBm Table 37: Conducted RF Receiving Sensitivity of EC25-T Mini PCIe Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B2 (10MHz)

-98.0dBm

-98.5dBm

-99.5dBm

-94.3dBm LTE-FDD B4 (10MHz)

-97.5dBm

-98.2dBm

-99.5dBm

-93.3dBm LTE-FDD B5 (10MHz)

-98.0dBm

-98.5dBm

-99.5dBm

-94.3dBm LTE-FDD B12 (10MHz)

-98.5.0dBm

-98.5dBm

-99.5dBm

-93.3dBm LTE-FDD B66 (10MHz)

-97.5dBm

-98.5dBm

-99.6dBm

-95.8dBm LTE-FDD B71 (10MHz)

-98.6dBm

-98.5dBm

-99.5dBm

-93.5dBm NOTE 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.5. ESD Characteristics The following table shows the ESD characteristics of EC25 Mini PCIe. Table 38: ESD Characteristics of EC25 Mini PCIe Tested Interfaces Contact Discharge Air Discharge Unit Power Supply and GND Antenna Interfaces USB Interface

(U)SIM Interface

+/-5

+/-4

+/-4

+/-4

+/-10

+/-8

+/-8

+/-8 kV kV kV kV EC25_Mini_PCIe_Hardware_Design 54 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Others

+/-0.5

+/-1 kV 6.6. Current Consumption The following tables describe the current consumption of EC25 Mini PCIe series module. Table 39: Current Consumption of EC25-A Mini PCIe Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) Idle state IVBAT 3.6 4.4 3.8 5.9 4.8 27.0 40.0 43.0 59.0 mA mA mA mA mA mA mA mA mA WCDMA B2 HSDPA @22.63dBm 764.0 mA WCDMA B2 HSUPA @23.19dBm 741.0 mA WCDMA data transfer

(GNSS OFF) WCDMA B4 HSDPA @22.45dBm 745.0 mA WCDMA B4 HSUPA @22.57dBm 752.0 mA WCDMA B5 HSDPA @22.49dBm 616.0 mA WCDMA B5 HSUPA @22.43dBm 637.0 mA LTE-FDD B2 @22.92dBm LTE-FDD B4 @23.42dBm LTE data transfer

(GNSS OFF) 977.0 mA 1094.0 mA LTE-FDD B12 @23.39dBm 847.0 mA EC25_Mini_PCIe_Hardware_Design 55 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA voice call WCDMA B2 @23.59dBm WCDMA B4 @23.47dBm WCDMA B5 @23.46dBm 861.0 mA 812.0 mA 683.0 mA Table 40: Current Consumption of EC25-AU Mini PCIe Parameter Description Conditions Typ. Unit IVBAT GSM DRX=5 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) Idle state GPRS data transfer

(GNSS OFF) EGSM900 4DL/1UL @33.10dBm EGSM900 3DL/2UL @32.93dBm 2.6 4.3 3.1 3.8 3.3 4.2 3.5 4.5 3.7 22.0 34.0 22.0 33.0 29.0 42.0 30.0 42.0 385.0 631.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Mini_PCIe_Hardware_Design 56 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design EGSM900 2DL/3UL @31.15dBm EGSM900 1DL/4UL @29.94dBm DCS1800 4DL/1UL @30.35dBm DCS1800 3DL/2UL @30.25dBm DCS1800 2DL/3UL @30.18dBm DCS1800 1DL/4UL @29.93dBm GSM850 1UL/4DL @32.53dBm GSM850 2UL/3DL @32.34dBm GSM850 3UL/2DL @30.28dBm GSM850 4UL/1DL @29.09dBm PCS1900 1UL/4DL @29.61dBm PCS1900 2UL/3DL @29.48dBm PCS1900 3UL/2DL @29.32dBm PCS1900 4UL/1DL @29.19dBm EGSM900 4DL/1UL @27.54dBm EGSM900 3DL/2UL @27.38dBm EGSM900 2DL/3UL @27.27dBm EGSM900 1DL/4UL @27.17dBm EDGE data transfer

(GNSS OFF) DCS1800 4DL/1UL @27.64dBm DCS1800 3DL/2UL @27.45dBm DCS1800 2DL/3UL @27.34dBm DCS1800 1DL/4UL @27.29dBm GSM850 1UL/4DL @27.09dBm GSM850 2UL/3DL @26.94dBm GSM850 3UL/2DL @26.64dBm 730.0 830.0 255.0 392.0 527.0 667.0 232.0 384.0 441.0 511.0 174.0 273.0 367.0 465.0 264.0 368.0 498.0 634.0 223.0 333.0 449.0 573.0 154.0 245.0 328.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Mini_PCIe_Hardware_Design 57 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design GSM850 4UL/1DL @26.53dBm PCS1900 1UL/4DL @25.65dBm PCS1900 2UL/3DL @25.63dBm PCS1900 3UL/2DL @25.54dBm PCS1900 4UL/1DL @25.26dBm WCDMA B1 HSDPA @22.45dBm WCDMA B1 HSUPA @21.75dBm WCDMA B2 HSDPA @22.51dBm WCDMA B2 HSUPA @22. 14dBm WCDMA B5 HSDPA @22.41dBm WCDMA B5 HSUPA @22.13dBm WCDMA B8 HSDPA @21.34dBm WCDMA B8 HSUPA @21.07dBm LTE-FDD B1 @23.28dBm LTE-FDD B2 @23.34dBm LTE-FDD B3 @23.2dBm LTE-FDD B4 @22.9dBm LTE-FDD B5 @23.45dBm LTE-FDD B7 @22.84dBm LTE-FDD B8 @22.92dBm LTE-FDD B28 @23.23dBm LTE-TDD B40 @23.3dBm GSM850 PCL5 @32.66dBm EGSM900 PCL5 @32.59dBm DCS1800 PCL0 @29.72dBm WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) GSM voice call 416.0 148.0 232.0 313.0 401.0 815.0 804.0 610.0 594.0 755.0 775.0 619.0 634.0 817.0 803.0 785.0 774.0 687.0 843.0 689.0 804.0 429.0 228.0 235.0 178.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Mini_PCIe_Hardware_Design 58 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Parameter Description Conditions Typ. Unit PCS1900 PCL0 @29.82dBm WCDMA B1 @23.27dBm WCDMA B2 @23.38dBm WCDMA B5 @23.38dBm WCDMA B8 @23.32dBm WCDMA voice call Table 41: Current Consumption of EC25-J Mini PCIe IVBAT WCDMA PF=64 (USB connected) Sleep state LTE-FDD PF=64 (USB disconnected) AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) Idle state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) WCDMA data transfer

(GNSS OFF) WCDMA B1 HSDPA @22.55dBm WCDMA B1 HSUPA @22.25dBm WCDMA B6 HSDPA @22.79dBm WCDMA B6 HSUPA @22.59dBm 170.0 687.0 668.0 592.0 595.0 3.2 4.3 3.8 5.0 4.4 5.1 4.4 31.5 43.5 32.3 45.4 32.3 43.3 829.0 848.2 649.2 661.4 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Mini_PCIe_Hardware_Design 59 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA B8 HSDPA @22.71dBm WCDMA B8 HSUPA @22.63dBm WCDMA B19 HSDPA @22.77dBm WCDMA B19 HSUPA @22.53dBm LTE-FDD B1 @23.15dBm 1045.0 mA LTE-FDD B3 @23.29dBm 1070.0 mA LTE data transfer

(GNSS OFF) LTE-FDD B8 @23.29dBm LTE-FDD B18 @23.82dBm LTE-FDD B19 @23.78dBm LTE-FDD B26 @23.22dBm LTE-TDD B41 @22.95dBm WCDMA B1 @23.39dBm WCDMA voice call WCDMA B6 @23.36dBm WCDMA B8 @23.54dBm WCDMA B19 @23.29dBm Table 42: Current Consumption of EC25-E Mini PCIe Parameter Description Conditions Typ. Unit IVBAT Sleep state WCDMA PF=64 (USB disconnected) AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) EC25_Mini_PCIe_Hardware_Design 60 / 80 691.0 700.0 644.2 657.6 867.3 947.7 955.1 924.9 609.6 969.6 692.3 763.9 682.1 3.9 5.1 4.3 5.5 4.8 5.8 5.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) 5.8 4.9 30.0 43.0 31.0 45.0 31.0 44.0 32.0 44.0 mA mA mA mA mA mA mA mA mA mA EGSM900 4DL/1UL @33.08dBm 372.0 mA EGSM900 3DL/2UL @31.03dBm 626.0 mA EGSM900 2DL/3UL @29.86dBm 706.0 mA EGSM900 1DL/4UL @29.44dBm 767.0 mA DCS1800 4DL/1UL @30.39dBm 262.0 mA DCS1800 3DL/2UL @30.19dBm 417.0 mA DCS1800 2DL/3UL @30.02dBm 564.0 mA DCS1800 1DL/4UL @29.86dBm 709.0 mA EGSM900 4DL/1UL @27.59dBm 233.0 mA EGSM900 3DL/2UL @27.45dBm 370.0 mA EGSM900 2DL/3UL @27.31dBm 500.0 mA EGSM900 1DL/4UL @27.14dBm 623.0 mA DCS1800 4DL/1UL @26.24dBm 224.0 mA DCS1800 3DL/2UL @26.13dBm 334.0 mA DCS1800 2DL/3UL @25.97dBm 440.0 mA Idle state GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) EC25_Mini_PCIe_Hardware_Design 61 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design DCS1800 1DL/4UL @25.82dBm 553.0 mA WCDMA B1 HSDPA @22.49dBm 798.0 mA WCDMA B1 HSUPA @21.87dBm 788.0 mA WCDMA data transfer

(GNSS OFF) WCDMA B5 HSDPA @22.66dBm 781.0 mA WCDMA B5 HSUPA @21.99dBm 770.0 mA WCDMA B8 HSDPA @22.23dBm 655.0 mA WCDMA B8 HSUPA @21.68dBm 659.0 mA LTE-FDD B1 @23.12dBm LTE-FDD B3 @22.75dBm LTE-FDD B5 @22.92dBm LTE-FDD B7 @23.42dBm LTE-FDD B8 @22.97dBm LTE data transfer

(GNSS OFF) GSM voice call LTE-FDD B20 @22.51dBm 946.0 mA LTE-TDD B38 @22.58dBm 686.0 mA LTE-TDD B40 @22.31dBm 576.0 mA LTE-TDD B41 @22.03dBm 611.0 mA EGSM900 PCL=5 @33.31dBm 367.0 mA DCS1800 PCL=0 @29.48dBm 248.0 mA 940.0 mA 989.0 mA 962.0 mA 1188.0 mA 911.0 mA 868.0 mA 808.0 mA 728.0 mA WCDMA voice call WCDMA B1 @23.18dBm WCDMA B5 @22.62dBm WCDMA B8 @23.02dBm Table 43: Current Consumption of EC25-T Mini PCIe Parameter Description Conditions Typ. Unit IVBAT Sleep state AT+CFUN=0 (USB disconnected) 1.7 mA EC25_Mini_PCIe_Hardware_Design 62 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design AT+CFUN=0 (USB suspend) AT+CFUN=4 (USB disconnected) AT+CFUN=4 (USB suspend) LTE-FDD PF=32 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB suspend) LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=256 (USB disconnected) LTE-FDD PF=64 (USB disconnected) 1.9 1.8 2.0 5.0 3.4 3.7 2.8 2.4 25.9 37.7 mA mA mA mA mA mA mA mA mA mA Idle state LTE-FDD PF=64 (USB active) LTE data transfer

(GNSS OFF) LTE-FDD B2 @23.82dBm LTE-FDD B4 @23.28dBm LTE-FDD B5 @23.82dBm 839.6 mA 883.0 mA 742.2 mA LTE-FDD B12 @23.69dBm 814.3 mA LTE-FDD B66 @23.57dBm 956.5 mA LTE-FDD B71 @22.95dBm 788.3 mA IVBAT Table 44: Current Consumption of EC25-V Mini PCIe Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) Idle state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) 3.4 4.8 4.3 30.0 42.0 mA mA mA mA mA LTE data LTE-FDD B4 @23.3dBm 873.0 mA EC25_Mini_PCIe_Hardware_Design 63 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design transfer

(GNSS OFF) Table 45: Current Consumption of EC25-AF Mini PCIe LTE-FDD B13 @22.13dBm 638.0 mA Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) Idle state 2.2 3.1 2.8 3.7 3.1 21.7 32.5 25.0 38.0 mA mA mA mA mA mA mA mA mA WCDMA B2 HSDPA @22.63dBm 560.0 mA IVBAT WCDMA B2 HSUPA @22.49dBm 564.0 mA WCDMA data transfer

(GNSS OFF) WCDMA B4 HSDPA @22.45dBm 601.0 mA WCDMA B4 HSUPA @22.57dBm 610.0 mA WCDMA B5 HSDPA @22.49dBm 603.0 mA WCDMA B5 HSUPA @22.43dBm 617.0 mA LTE data transfer

(GNSS OFF) LTE-FDD B2 @22.92dBm LTE-FDD B4 @23.12dBm LTE-FDD B5 @22.98dBm 758.0 mA 770.0 mA 700.0 mA LTE-FDD B12 @23.42dBm 808.0 mA LTE-FDD B13 @22.92dBm 790.0 mA LTE-FDD B14 @23.42dBm 795.0 mA EC25_Mini_PCIe_Hardware_Design 64 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B66 @23.35dBm 816.0 mA LTE-FDD B71 @23.39dBm 801.0 mA WCDMA voice call WCDMA B2 @23.59dBm WCDMA B4 @23.47dBm WCDMA B5 @23.46dBm 585.0 mA 610.0 mA 605.0 mA Table 46: Current Consumption of EC25-EUX Mini PCIe Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) IVBAT LTE-TDD PF=64 (USB disconnected) 1.69 2.59 1.97 2.52 2.25 3.01 2.4 3.08 2.46 mA mA mA mA mA mA mA mA mA Idle state LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) 18.51 mA GSM DRX=5 (USB connected) 37.56 mA WCDMA PF=64 (USB disconnected) 20.5 mA WCDMA PF=64 (USB connected) 38.42 mA LTE-FDD PF=64 (USB disconnected) 19.29 mA LTE-FDD PF=64 (USB connected) 38.46 mA EC25_Mini_PCIe_Hardware_Design 65 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-TDD PF=64 (USB disconnected) 19.41 mA LTE-TDD PF=64 (USB connected) 37.21 mA EGSM900 4DL/1UL @32.5dBm 293.0 mA EGSM900 3DL/2UL @31.56dBm 464.0 mA EGSM900 2DL/3UL @29.63dBm 534.5 mA GPRS data transfer

(GNSS OFF) EGSM900 1DL/4UL @28.76dBm 644.6 mA DCS1800 4DL/1UL @29.06dBm 182.5 mA DCS1800 3DL/2UL @28.33dBm 283.4 mA DCS1800 2DL/3UL @26.88dBm 368.3 mA DCS1800 1DL/4UL @25.74dBm 455.8 mA EGSM900 4DL/1UL @25.54dBm 200.1 mA EGSM900 3DL/2UL @25.41dBm 343.4 mA EGSM900 2DL/3UL @23.51dBm 471.5 mA EGSM900 1DL/4UL @22.94dBm 607.8 mA DCS1800 4DL/1UL @25.05dBm 183.1 mA DCS1800 3DL/2UL @25.07dBm 291.0 mA DCS1800 2DL/3UL @22.54dBm 392.0 mA DCS1800 1DL/4UL @21.92dBm 502.2 mA WCDMA B1 HSDPA @21.72dBm 681.1 mA WCDMA B1 HSUPA @21.52dBm 728.0 mA WCDMA B8 HSDPA @21.87dBm 638.0 mA WCDMA B8 HSUPA @20.79dBm 636.0 mA LTE-FDD B1 @20.81dBm 879.0 mA LTE-FDD B3 @20.73dBm 955.4 mA LTE-FDD B7 @20.04dBm 970.8 mA EDGE data transfer

(GNSS OFF) WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) EC25_Mini_PCIe_Hardware_Design 66 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B8 @21.05dBm 815.3 mA LTE-FDD B20 @21.01dBm 952.1 mA LTE-FDD B28A @20.92dBm 1007.0 mA LTE-TDD B38 @20.65dBm 458.3 mA LTE-TDD B40 @20.52dBm 409.0 mA LTE-TDD B41 @20.64dBm 451.4 mA EGSM900 PCL=5 @32.17dBm 276.9 mA DCS1800 PCL=0 @29.09dBm 174.3 mA WCDMA B1 @22.64dBm 762.1 mA WCDMA B8 @22.17dBm 689.3 mA GSM voice call WCDMA voice call Table 47: Current Consumption of EC25-AFX Mini PCIe Parameter Description Conditions Typ. Unit Sleep state WCDMA PF=512 (USB disconnected) IVBAT AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) WCDMA PF=128 (USB disconnected) WCDMA PF=256 (USB disconnected) LTE-FDD PF=32 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=256 (USB disconnected) 1.67 2.51 2.93 2.16 2.07 1.88 4.29 3.04 3.23 2.39 2.06 22.0 mA mA mA mA mA mA mA mA mA mA mA mA Idle state WCDMA PF=64 (USB disconnected) EC25_Mini_PCIe_Hardware_Design 67 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) 43.0 22.0 42.8 mA mA mA WCDMA B2 HSDPA @22.45dBm 691.0 mA WCDMA B2 HSUPA @22.23dBm 605.0 mA WCDMA data transfer

(GNSS OFF) WCDMA B4 HSDPA @22.42dBm 628.0 mA WCDMA B4 HSUPA @22.11dBm 630.0 mA WCDMA B5 HSDPA @22.02dBm 618.0 mA WCDMA B5 HSUPA @22.10dBm 634.0 mA LTE-FDD B2 @23.01dBm 743.0 mA LTE-FDD B4 @22.58dBm 816.0 mA LTE-FDD B5 @23.2dBm 751.0 mA LTE data transfer

(GNSS OFF) LTE-FDD B12 @22.94dBm 825.0 mA LTE-FDD B13 @23.18dBm 815.0 mA LTE-FDD B14 @23.44dBm 849.0 mA LTE-FDD B66 @23.2dBm 850.0 mA LTE-FDD B71 @22.82dBm 788.0 mA WCDMA voice call WCDMA B2 @23.27dBm 672.0 mA WCDMA B4 @23.22dBm 663.0 mA WCDMA B5 @23.02dBm 680.0 mA Table 48: Current Consumption of EC25-MX Mini PCIe Parameter Description Conditions IVBAT Sleep state AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) Typ. Unit 1.55 2.82 mA mA EC25_Mini_PCIe_Hardware_Design 68 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA PF=64 (USB connected) WCDMA PF=128 (USB disconnected) WCDMA PF=256 (USB disconnected) WCDMA PF=512 (USB disconnected) LTE-FDD PF=32 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=256 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) 2.98 2.33 2.13 1.97 4.36 3.14 3.33 2.55 2.38 20.0 41.1 20.5 40.7 mA mA mA mA mA mA mA mA mA mA mA mA mA Idle state WCDMA B2 HSDPA @22.75dBm 848.0 mA WCDMA B2 HSUPA @22.3dBm 818.0 mA WCDMA data transfer

(GNSS OFF) WCDMA B4 HSDPA @23.34dBm 813.0 mA WCDMA B4 HSUPA @23.11dBm 774.0 mA WCDMA B5 HSDPA @22.53dBm 759.0 mA WCDMA B5 HSUPA @22.58dBm 717.0 mA LTE-FDD B2 @23.09dBm 918.0 mA LTE-FDD B4 @23.12dBm 933.0 mA LTE data transfer

(GNSS OFF) LTE-FDD B5 @22.28dBm 706.0 mA LTE-FDD B7 @22.56dBm 1011.0 mA LTE-FDD B28 @22.41dBm 793.0 mA LTE-FDD B66 @23.94dBm 937.0 mA EC25_Mini_PCIe_Hardware_Design 69 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA voice call WCDMA B2 @23.97dBm 967.0 mA WCDMA B4 @23.92dBm 825.0 mA WCDMA B5 @23.00dBm 844.0 mA Table 49: Current Consumption of EC25-AUX Mini PCIe Parameter Description Conditions Typ. Unit IVBAT GSM DRX=5 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) Idle state GPRS data transfer

(GNSS OFF) GSM850 4DL/1UL @32.88dBm GSM850 3DL/2UL @31.99dBm 1.9 2.9 2.4 3.8 3.4 4.5 3.9 4.5 3.7 23.4 43.4 24.2 45.6 28.7 43.7 30.4 43.9 368.0 565.5 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Mini_PCIe_Hardware_Design 70 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design GSM850 2DL/3UL @29.94dBm GSM850 1DL/4UL @28.73dBm EGSM900 4DL/1UL @33.75dBm EGSM900 3DL/2UL @32.18dBm EGSM900 2DL/3UL @29.90dBm EGSM900 1DL/4UL @28.70dBm DCS1800 4DL/1UL @30.02dBm DCS1800 3DL/2UL @29.12dBm DCS1800 2DL/3UL @26.98dBm DCS1800 1DL/4UL @25.80dBm PCS1900 4DL/1UL @30.22dBm PCS1900 3DL/2UL @28.93dBm PCS1900 2DL/3UL @27.00dBm PCS1900 1DL/4UL @25.86dBm GSM850 4DL/1UL @27.45dBm GSM850 3DL/2UL @26.29dBm GSM850 2DL/3UL @23.96dBm GSM850 1DL/4UL @22.72dBm EDGE data transfer

(GNSS OFF) EGSM900 4DL/1UL @27.63dBm EGSM900 3DL/2UL @26.45dBm EGSM900 2DL/3UL @24.27dBm EGSM900 1DL/4UL @22.99dBm DCS1800 4DL/1UL @26.55dBm DCS1800 3DL/2UL @25.90dBm DCS1800 2DL/3UL @23.91dBm 636.7 733.7 419.3 591.5 631.4 725.3 221.8 319.6 384.8 468.3 243.2 336.9 398.3 478.0 253.6 389.8 515.4 647.6 257.2 399.1 515.3 642.0 196.7 304.4 408.8 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Mini_PCIe_Hardware_Design 71 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design DCS1800 1DL/4UL @22.61dBm PCS1900 4DL/1UL @26.67dBm PCS1900 3DL/2UL @25.88dBm PCS1900 2DL/3UL @23.85dBm PCS1900 1DL/4UL @22.73dBm WCDMA B1 HSDPA @21.54dBm WCDMA B1 HSUPA @21.82dBm WCDMA B2 HSDPA @22.10dBm WCDMA B2 HSUPA @21.84dBm WCDMA B5 HSDPA @23.27dBm WCDMA B5 HSUPA @22.93dBm WCDMA B8 HSDPA @21.70dBm WCDMA B8 HSUPA @21.12dBm LTE-FDD B1 @23.50dBm LTE-FDD B2 @22.95dBm LTE-FDD B3 @23.27dBm LTE-FDD B4 @23.28dBm LTE-FDD B5 @23.09dBm LTE-FDD B7 @23.09dBm LTE-FDD B8 @23.64dBm LTE-FDD B28 @22.79dBm LTE-TDD B40 @23.70dBm GSM850 PCL5 @32.75dBm EGSM900 PCL5 @33.53dBm DCS1800 PCL0 @30.03dBm WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) GSM voice call 524.3 194.7 299.1 399.7 510.1 679.4 721.1 723.0 708.6 672.6 672.0 667.9 674.5 963.9 941.7 856.4 817.1 724.5 945.2 888.3 964.5 428.9 346.9 385.3 210.2 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Mini_PCIe_Hardware_Design 72 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design PCS1900 PCL0 @29.94dBm WCDMA B1 @23.75dBm WCDMA B2 @23.07dBm WCDMA B5 @23.31dBm WCDMA B8 @22.65dBm WCDMA voice call Table 50: Current Consumption of EC25-EU Mini PCIe Parameter Description Conditions Typ. Unit IVBAT Sleep state WCDMA PF=128 (USB disconnected) AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) Idle state WCDMA PF=64 (USB connected) 219.6 785.1 804.5 701.8 739.7 3.4 5.2 4.1 4.9 4.4 5.3 4.6 5.3 4.5 23.3 35.4 23.9 36.3 24.1 36.4 24.1 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Mini_PCIe_Hardware_Design 73 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design GPRS data transfer

(GNSS OFF) LTE-TDD PF=64 (USB connected) 36.3 mA EGSM900 4DL/1UL @32.54dBm 379.0 mA EGSM900 3DL/2UL @31.96dBm 610.0 mA EGSM900 2DL/3UL @29.59dBm 654.0 mA EGSM900 1DL/4UL @28.34dBm 734.0 mA DCS1800 4DL/1UL @29.63dBm 236.0 mA DCS1800 3DL/2UL @28.59dBm 343.0 mA DCS1800 2DL/3UL @26.62dBm 413.0 mA DCS1800 1DL/4UL @25.29dBm 498.0 mA EGSM900 4DL/1UL @27.51dBm 234.0 mA EGSM900 3DL/2UL @27.23dBm 372.0 mA EGSM900 2DL/3UL @27.08dBm 501.0 mA EDGE data transfer

(GNSS OFF) EGSM900 1DL/4UL @26.81dBm 628.0 mA DCS1800 4DL/1UL @26.29dBm 199.0 mA DCS1800 3DL/2UL @26.18dBm 309.0 mA DCS1800 2DL/3UL @26.05dBm 415.0 mA DCS1800 1DL/4UL @25.35dBm 503.0 mA WCDMA B1 HSDPA @22.01dBm 755.0 mA WCDMA B1 HSUPA @22.79dBm 776.0 mA WCDMA B8 HSDPA @22.21dBm 670.6 mA WCDMA B8 HSUPA @22.04dBm 692.6 mA LTE-FDD B1 @23.63dBm LTE-FDD B3 @22.78dBm LTE-FDD B7 @22.31dBm LTE-FDD B8 @23.35dBm 918.7 mA 914.0 mA 985.2 mA 886.5 mA WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) EC25_Mini_PCIe_Hardware_Design 74 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B20 @22.71dBm 909.1 mA LTE-FDD B28A @21.79dBm 898.1 mA LTE-TDD B38 @22.85dBm 587.8 mA LTE-TDD B40 @22.96dBm 460.6 mA LTE-TDD B41 @22.69dBm 571.2 mA GSM voice call EGSM900 PCL=5 @32.80dBm 370.0 mA DCS1800 PCL=0 @29.51dBm 221.0 mA WCDMA voice call WCDMA B1 @22.96dBm WCDMA B8 @23.21dBm 829.5 mA 752.9 mA Table 51: GNSS Current Consumption of EC25 Mini PCIe Series Module Parameter Description Conditions Typ. Unit IVBAT

(GNSS) Searching

(AT+CFUN=0) Cold start @Passive Antenna Lost state @Passive Antenna Tracking

(AT+CFUN=0) Instrument environment Open Sky @Passive Antenna Open Sky @Active Antenna 75.0 74.0 44.0 53.0 58.0 mA mA mA mA mA 6.7. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:

On customers PCB design, please keep placement of the PCI Express Mini Card away from heating Do not place components on the PCB area where the module is mounted, in order to facilitate adding Do not apply solder mask on the PCB area where the module is mounted, so as to ensure better heat The reference ground of the area where the module is mounted should be complete, and add ground sources. of heatsink. dissipation performance. EC25_Mini_PCIe_Hardware_Design 75 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design vias as many as possible for better heat dissipation. Add a heatsink on the top of the module and the heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module. Add a thermal pad with appropriate thickness at the bottom of the module to conduct the heat to PCB. The following figure shows the referenced heatsink design. Figure 17: Referenced Heatsink Design NOTES 1. The module offers the best performance when the internal BB chip stays below 105C. When the maximum temperature of the BB chip reaches or exceeds 105C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. 2. For more detailed guidelines on thermal design, please refer to document [4]. EC25_Mini_PCIe_Hardware_Design 76 / 80 EC25 Mini PCIe EC25 Module Thermal Pad Heatsink Thermal Pad Heatsink Shielding Cover PCI Express Mini Card Connector Application Board Application Board LTE Standard Module Series EC25 Mini PCIe Hardware Design 7 Dimensions and Packaging 7.1. General Description This chapter mainly describes mechanical dimensions as well as packaging specification of EC25 Mini PCIe module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.05mm unless otherwise specified. 7.2. Mechanical Dimensions of EC25 Mini PCIe Figure 18: Mechanical Dimensions of EC25 Mini PCIe EC25_Mini_PCIe_Hardware_Design 77 / 80 30.000.15 24.200.20 3x3.000.10 5.980.10 2x2.600.1 0.610.05 2.350.10 8.250.10 5.450.10 6.380.10 6.350.10 34.300.20 48.050.20 50.950.15 4.900.20 1.400.10 9.900.10 4.000.10 Pin1 Pin51 Top View 10.350.10 7.260.10 1.000.10 Side View LTE Standard Module Series EC25 Mini PCIe Hardware Design 7.3. Standard Dimensions of Mini PCI Express The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1]

for Detail A and Detail B. Figure 19: Standard Dimensions of Mini PCI Express EC25_Mini_PCIe_Hardware_Design 78 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design EC25 Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives and standards listed in the document [1]. The following figure takes the Molex 679105700 as an example. Figure 20: Dimensions of the Mini PCI Express Connector (Molex 679105700) 7.4. Packaging Specifications EC25 Mini PCIe modules are packaged in a tray. Each tray contains 10 modules. The smallest package of EC25 Mini PCIe contains 100 modules. EC25_Mini_PCIe_Hardware_Design 79 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 8 Appendix A References Table 52: Related Documents SN Document Name Remark PCI Express Mini Card Electromechanical Specification Revision 1.2 PCI Express Mini Card Electromechanical Specification Quectel_LTE_Standard_AT_Commands_ Manual AT commands manual for LTE Standard modules

[3]

Quectel_LTE_Standard_GNSS_Application_Note

[4]

Quectel_LTE_Module_Thermal_Design_Guide GNSS application note for LTE Standard modules Thermal design guide for LTE standard, LTE-A and Automotive modules Table 53: Terms and Abbreviations Abbreviation Description DC-HSPA+

Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over-The-Air Adaptive Multi-rate Bits Per Second Bluetooth Coding Scheme Clear to Send Down Link Data Terminal Equipment Data Terminal Ready Enhanced Full Rate

[1]

[2]

AMR bps BT CS CTS DL DTE DTR EFR EC25_Mini_PCIe_Hardware_Design 80 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design GLONASS GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System EMI ESD ESR FDD FR GMSK GNSS GPS GSM HR HSPA HSUPA kbps LED LTE Mbps MCU ME MIMO MMS MO MT NMEA PCM Electro Magnetic Interference Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplexing Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Uplink Packet Access Kilo Bits Per Second Light Emitting Diode Long-Term Evolution Million Bits Per Second Micro Control Unit Mobile Equipment Multiple-Input Multiple-Output Multimedia Messaging Service Mobile Originated Mobile Terminated National Marine Electronics Association Pulse Code Modulation EC25_Mini_PCIe_Hardware_Design 81 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design PDA PDU POS PPP RF RTS Rx SIMO SMS TX TVS UART UL URC USB

(U)SIM WCDMA WLAN Personal Digital Assistant Protocol Data Unit Point of Sale Point-to-Point Protocol Radio Frequency Ready To Send Receive Single Input Multiple Output Short Message Service Transmitting Direction Transient Voltage Suppressor Uplink Unsolicited Result Code Universal Serial Bus Universal Asynchronous Receiver & Transmitter

(Universal) Subscriber Identification Module Wideband Code Division Multiple Access Wireless Local Area Networks EC25_Mini_PCIe_Hardware_Design 82 / 80

 

 

EC25 Series Hardware Design LTE Standard Module Series Rev. EC25_Series_Hardware_Design_V2.4 Date: 2020-12-21 Status: Released www.quectel.com LTE Standard Module Series EC25 Series Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved. EC25_Series_Hardware_Design 1 / 126 LTE Standard Module Series EC25 Series Hardware Design About the Document Revision History Version Date Author Description 1.0 2016-04-01 Woody WU Initial 1.1 2016-09-22 Lyndon LIU/

Frank WANG 1.2 2016-11-04 Lyndon LIU/

Michael ZHANG 1. Updated EC25 series frequency bands in Table 1. 2. Updated transmitting power, supported maximum baud rate of main UART/internal protocols/USB drivers of USB interface, firmware upgrade and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4. Updated timing of turning off module in Figure 13. 5. Updated timing of resetting module in Figure 16. 6. Updated supported baud rates of main UART in Chapter 3.11. 7. Added notes for ADC interface in Chapter 3.13. 8. Updated GNSS performance in Table 21. 9. Updated operating frequencies of module in Table 23. 10. Added current consumption in Chapter 6.4. 11. Updated RF output power in Chapter 6.5. 12. Added RF receiving sensitivity in Chapter 6.6. 1. Added SGMII and WLAN interfaces in Table 2. 2. Updated function diagram in Figure 1. 3. Updated pin assignment (Top View) in Figure 2. 4. Added description of SGMII and WLAN interfaces in 5. Added SGMII interface in Chapter 3.17. 6. Added WLAN interface in Chapter 3.18. 7. Added USB_BOOT interface in Chapter 3.19. 8. Added reference design of RF layout in Chapter Table 4. 5.1.4. 9. Added note about SIMO in Chapter 6.6. EC25_Series_Hardware_Design 1 / 126 LTE Standard Module Series EC25 Series Hardware Design 1.3 2017-01-24 Lyndon LIU/

Frank WANG 1.4 2018-03-05 AnniceZHANG/

Lyndon LIU/

Frank WANG 1. Updated function diagram in Figure 1. 2. Updated pin assignment (top view) in Figure 2. 3. Added BT interface in Chapter 3.18.2. 4. Updated GNSS performance in Table 24. 5. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29. 6. Updated current consumption of EC25-E module in 7. Updated EC25-A conducted RF receiving sensitivity 8. Added EC25-J conducted RF receiving sensitivity in Table 33. in Table 38. Table 40. 1. Updated functional diagram in Figure 1. 2. Updated LTE, UMTS and GSM features in Table 2. 3. Updated description of pin 40/136/137/138. 4. Updated PWRKEY pulled down time to 500 ms in Chapter 3.7.1 and reference circuit in Figure 10. 5. Updated reference circuit of (U)SIM interface in Figure 17 & 18. 6. Updated reference circuit of USB interface in Figure 7. Updated PCM mode in Chapter 3.12. 8. Added SD card interface in Chapter 3.13. 9. Updated USB_BOOT reference circuit in Chapter 19. 3.20. 10. Updated module operating frequencies in Table 26. 11. Updated antenna requirements in Table 30. 12. Updated EC25 series module current consumption in 13. Updated EC25 series module conducted RF receiving sensitivity in Chapter 6.6. 14. Added thermal consideration description in Chapter 15. Added dimension tolerance information in Chapter 7. 16. Added storage temperature range in Table 2 and Chapter 6.4. 6.8. Chapter 6.3. 17. Updated RF output power in Table 41. 18. Updated GPRS multi-slot classes in Table 53. 19. Updated storage information in Chapter 8.1. 1. Added information of EC25-AF in Table 1. 2. Updated module operating frequencies in Table 27. 3. Added current consumption of EC25-AF module in Table 40. 4. Changed GNSS current consumption of EC25 series 1.5 2018-04-20 Kinsey ZHANG EC25_Series_Hardware_Design 2 / 126 LTE Standard Module Series EC25 Series Hardware Design 8. module into Table 41. 5. Added EC25-AF conducted RF receiving sensitivity 1. Added new variants EC25-EU/-EC/-EUX/-MX and in Table 50. related information. 2. Updated functional diagram in Figure 1. 3. Updated star structure of the power supply in Figure 4. Updated power-on scenario of module in Figure 12. 5. Updated reference circuit with translator chip in Figure 20. 6. Added timing sequence for entering into emergency download mode of USB_BOOT interface in Figure 32. 7. Updated general description in Table 1. 8. Updated module operating frequencies in Table 27. 9. Updated GNSS frequency in Table 29. 10. Updated antenna requirements in Table 30. 11. Updated EC25-V current consumption in Table 36. 12. Added EC25-EU current consumption in Table 41 13. Added EC25 EC current consumption in Table 42. 14. Added EC25-EUX current consumption in Table 43. 15. Added EC25-MX current consumption in Table 44. 16. Updated EC25-E conducted RF receiving sensitivity 17. Updated EC25-A conducted RF receiving sensitivity 18. Updated EC25-V conducted RF receiving sensitivity 19. Updated EC25-AUT conducted RF receiving 20. Updated EC25-AUTL conducted RF receiving sensitivity in Table 52. sensitivity in Table 53. 21. Added EC25-EU conducted RF receiving sensitivity in 22. Added EC25 EC conducted RF receiving sensitivity in Added EC25-EUX conducted RF receiving sensitivity in Table 57. 23. Added EC25-MX conducted RF receiving sensitivity 24. Updated recommended thickness as 0.180.20 mm and reflow soldering thermal profile in Chapter 8.2. stencil in Table 47. in Table 48. in Table 49. Table 55. Table 56 in Table 58. 2.0 2019-04-30 Nathan LIU/

Frank WANG/

Ward WANG/

Ethan SHAN EC25_Series_Hardware_Design 3 / 126 2.2 2019-08-19 Ward WANG/

Owen WEI/

Frank WANG LTE Standard Module Series EC25 Series Hardware Design 2.1 2019-07-05 Fanny CHEN/

Ethan SHAN 4. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 26. information. modules. in Table 2. in Table 56. Figure 45. 1. Added new variants EC25-AFX/-AUX and related 2. Added notes for interfaces not supported by ThreadX 3. Updated supported protocols and USB serial drivers 5. Added EC25-AFX current consumption in Table 41. 6. Added EC25-AFX conducted RF receiving sensitivity 7. Updated mechanical dimensions of the module in 8. Added tape and reel directions in Figure 51. 1. Updated EC25-J current consumption in Table 37. 2. Deleted the LTE-TDD bands information of EC25-AUT current consumption in Table 39. 3. Updated EC25-EC current consumption in Table 43. Updated EC25-EUX current consumption in Table 44. 4. Added EC25-AUX current consumption in Table 46. 5. Updated EC25-AU conducted RF receiving sensitivity 6. Updated EC25-EU conducted RF receiving sensitivity 7. Added EC25-AUX conducted RF receiving sensitivity in Table 53. in Table 58. in Tbale 62. 1. Removed related information of ThreadX OS because the baseline has been updated. 2. Updated the supported protocols and USB serial drivers in Table 2. 3. AT command AT+QCFG="airplanecontrol" has been 4. Updated the notes for GNSS performance in Chapter 4.2. 5. Updated the AT command be used to disable the receive diversity in Chapter 5.1.3. 6. Updated EC25-J current consumption in Table 37. 1. Updated EC25-EUX conducted RF receiving sensitivity in Table 58. 2. Updated the storage and manufacturing information 3. Deleted related information of EC25-EC. 4. Added related information of EC25-T 5. Added related information of EC25-EX 2.3 2019-11-26 Fanny CHEN fully developed in Chapter 3.5. 2.4 2020-12-21 in Chapter 8. Owen WEI/

Barret Xiong Cody Zhou EC25_Series_Hardware_Design 4 / 126 LTE Standard Module Series EC25 Series Hardware Design EC25_Series_Hardware_Design 5 / 126 LTE Standard Module Series EC25 Series Hardware Design Contents About the Document ................................................................................................................................... 1 Contents ....................................................................................................................................................... 6 Table Index ................................................................................................................................................... 9 Figure Index ............................................................................................................................................... 11 1 Introduction ........................................................................................................................................ 13 FCC Certification Requirements. ............................................................................................ 13 1.1. 1.2. Safety Information.................................................................................................................... 16 2 Product Concept ................................................................................................................................ 17 2.1. General Description ................................................................................................................. 17 Key Features ........................................................................................................................... 18 2.2. 2.3. Evaluation Board ..................................................................................................................... 21 3.6. 3 Application Interfaces ....................................................................................................................... 22 3.1. General Description ................................................................................................................. 22 3.2. Pin Assignment ........................................................................................................................ 23 3.3. Pin Description ......................................................................................................................... 24 3.4. Operating Modes ..................................................................................................................... 36 3.5. Power Saving ........................................................................................................................... 36 3.5.1. Sleep Mode .................................................................................................................... 36 3.5.1.1. UART Application ................................................................................................. 36 3.5.1.2. USB Application with USB Remote Wakeup Function ........................................ 37 3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 38 3.5.1.4. USB Application without USB Suspend Function ................................................ 38 3.5.2. Airplane Mode ................................................................................................................ 39 Power Supply ........................................................................................................................... 40 3.6.1. Power Supply Pins ......................................................................................................... 40 3.6.2. Decrease Voltage Drop .................................................................................................. 40 3.6.3. Reference Design for Power Supply .............................................................................. 41 3.6.4. Monitor the Power Supply .............................................................................................. 41 Power-on/off Scenarios ........................................................................................................... 42 3.7.1. Turn on Module Using the PWRKEY ............................................................................. 42 3.7.2. Turn off Module .............................................................................................................. 44 3.7.2.1. Turn off Module Using the PWRKEY Pin ............................................................ 45 3.7.2.2. Turn off Module Using AT Command .................................................................. 45 3.8. Reset Module ........................................................................................................................... 45 3.9.

(U)SIM Interface ...................................................................................................................... 47 3.10. USB Interface .......................................................................................................................... 49 3.11. UART Interfaces ...................................................................................................................... 50 3.12. PCM and I2C Interfaces .......................................................................................................... 53 3.7. EC25_Series_Hardware_Design 6 / 126 LTE Standard Module Series EC25 Series Hardware Design 3.13. SD Card Interface .................................................................................................................... 55 3.14. Wireless Connectivity Interfaces ............................................................................................. 57 3.14.1. WLAN Interface .............................................................................................................. 59 3.14.2. BT Interface* .................................................................................................................. 60 3.15. ADC Interfaces ........................................................................................................................ 60 3.16. SGMII Interface ........................................................................................................................ 61 3.17. Network Status Indication ........................................................................................................ 63 3.18. STATUS ................................................................................................................................... 65 3.19. Behaviors of RI ........................................................................................................................ 65 3.20. USB_BOOT Interface .............................................................................................................. 66 4 GNSS Receiver ................................................................................................................................... 68 4.1. General Description ................................................................................................................. 68 4.2. GNSS Performance ................................................................................................................. 68 Layout Guidelines .................................................................................................................... 69 4.3. 5 Antenna Interfaces ............................................................................................................................. 70 5.1. Main/Rx-diversity Antenna Interfaces...................................................................................... 70 5.1.1. Pin Definition .................................................................................................................. 70 5.1.2. Operating Frequency ..................................................................................................... 70 5.1.3. Reference Design of RF Antenna Interface ................................................................... 72 5.1.4. Reference Design of RF Layout..................................................................................... 72 5.2. GNSS Antenna Interface ......................................................................................................... 74 5.3. Antenna Installation ................................................................................................................. 76 5.3.1. Antenna Requirement .................................................................................................... 76 5.3.2. Recommended RF Connector for Antenna Installation ................................................. 77 6 Electrical, Reliability and Radio Characteristics ............................................................................ 79 Absolute Maximum Ratings ..................................................................................................... 79 6.1. 6.2. Power Supply Ratings ............................................................................................................. 80 6.3. Operating and Storage Temperatures .................................................................................... 80 6.4. Current Consumption .............................................................................................................. 81 6.5. RF Output Power ................................................................................................................... 105 6.6. RF Receiving Sensitivity ........................................................................................................ 105 Electrostatic Discharge .......................................................................................................... 113 6.7. 6.8. Thermal Consideration .......................................................................................................... 114 7 Mechanical Dimensions .................................................................................................................. 116 7.1. Mechanical Dimensions of the Module.................................................................................. 116 7.2. Recommended Footprint ....................................................................................................... 118 7.3. Design Effect Drawings of the Module .................................................................................. 119 8 Storage, Manufacturing and Packaging ........................................................................................ 120 8.1. Storage .................................................................................................................................. 120 8.2. Manufacturing and Soldering ................................................................................................ 121 Packaging .............................................................................................................................. 122 8.3. EC25_Series_Hardware_Design 7 / 126 LTE Standard Module Series EC25 Series Hardware Design 9 Appendix A References ................................................................................................................... 124 10 Appendix B GPRS Coding Schemes ............................................................................................. 128 11 Appendix C GPRS Multi-slot Classes ............................................................................................ 129 12 Appendix D EDGE Modulation and Coding Schemes ................................................................. 131 EC25_Series_Hardware_Design 8 / 126 LTE Standard Module Series EC25 Series Hardware Design Table Index Table 1: Supported Frequency Bands and GNSS Function of EC25 Series Module ....................................... 17 Table 2: Key Features of EC25 Series Module ................................................................................................. 18 Table 3: I/O Parameters Definition .................................................................................................................... 24 Table 4: Pin Description .................................................................................................................................... 24 Table 5: Overview of Operating Modes ............................................................................................................. 36 Table 6: VBAT and GND Pins ........................................................................................................................... 40 Table 7: Pin Definition of PWRKEY ................................................................................................................... 42 Table 8: Pin Definition of RESET_N .................................................................................................................. 46 Table 9: Pin Definition of (U)SIM Interface ........................................................................................................ 47 Table 10: Pin Description of USB Interface ....................................................................................................... 49 Table 11: Pin Definition of Main UART Interface ............................................................................................... 51 Table 12: Pin Definition of Debug UART Interface ............................................................................................ 51 Table 13: Logic Levels of Digital I/O .................................................................................................................. 51 Table 14: Pin Definition of PCM and I2C Interfaces .......................................................................................... 54 Table 15: Pin Definition of SD Card Interface ................................................................................................... 55 Table 16: Pin Definition of Wireless Connectivity Interfaces ............................................................................. 57 Table 17: Pin Definition of ADC Interfaces ........................................................................................................ 60 Table 18: Characteristic of ADC ........................................................................................................................ 61 Table 19: Pin Definition of SGMII Interface ....................................................................................................... 61 Table 20: Pin Definition of Network Connection Status/Activity Indicator ......................................................... 64 Table 21: Working State of Network Connection Status/Activity Indicator ........................................................ 64 Table 22: Pin Definition of STATUS .................................................................................................................. 65 Table 23: Behaviors of RI .................................................................................................................................. 66 Table 24: Pin Definition of USB_BOOT Interface .............................................................................................. 66 Table 25: GNSS Performance ........................................................................................................................... 68 Table 26: Pin Definition of RF Antennas ........................................................................................................... 70 Table 27: Module Operating Frequencies ......................................................................................................... 70 Table 28: Pin Definition of GNSS Antenna Interface ......................................................................................... 74 Table 29: GNSS Frequency .............................................................................................................................. 75 Table 30: Antenna Requirements ...................................................................................................................... 76 Table 31: Absolute Maximum Ratings ............................................................................................................... 79 Table 32: Power Supply Ratings ....................................................................................................................... 80 Table 33: Operating and Storage Temperatures ............................................................................................... 80 Table 34: EC25-E Current Consumption ........................................................................................................... 81 Table 35: EC25-EX Current Consumption ........................................................................................................ 83 Table 36: EC25-A Current Consumption ........................................................................................................... 85 Table 37: EC25-V Current Consumption ........................................................................................................... 86 Table 38: EC25-J Current Consumption ........................................................................................................... 87 Table 39: EC25-AU Current Consumption ........................................................................................................ 88 Table 40: EC25-AUT Current Consumption ...................................................................................................... 91 Table 41: EC25-AF Current Consumption......................................................................................................... 92 EC25_Series_Hardware_Design 9 / 126 LTE Standard Module Series EC25 Series Hardware Design Table 42: EC25-AFX Current Consumption ...................................................................................................... 94 Table 43: EC25-EU Current Consumption ........................................................................................................ 95 Table 44: EC25-EUX Current Consumption ...................................................................................................... 97 Table 45: EC25-MX Current Consumption ........................................................................................................ 99 Table 46: EC25-AUX Current Consumption .................................................................................................... 100 Table 47: EC25-T Current Consumption ......................................................................................................... 103 Table 48: GNSS Current Consumption of EC25 Series Module ..................................................................... 104 Table 49: RF Output Power ............................................................................................................................. 105 Table 50: EC25-E Conducted RF Receiving Sensitivity .................................................................................. 105 Table 51: EC25-A Conducted RF Receiving Sensitivity .................................................................................. 106 Table 52: EC25-V Conducted RF Receiving Sensitivity .................................................................................. 106 Table 53: EC25-J Conducted RF Receiving Sensitivity .................................................................................. 107 Table 54: EC25-AU Conducted RF Receiving Sensitivity ............................................................................... 107 Table 55: EC25-AUT Conducted RF Receiving Sensitivity ............................................................................. 108 Table 56: EC25-AUTL Conducted RF Receiving Sensitivity ........................................................................... 108 Table 57: EC25-AF Conducted RF Receiving Sensitivity ............................................................................... 109 Table 58: EC25-AFX Conducted RF Receiving Sensitivity ............................................................................. 109 Table 59: EC25-EU Conducted RF Receiving Sensitivity ............................................................................... 110 Table 60: EC25-EUX Conducted RF Receiving Sensitivity ............................................................................ 110 Table 61: EC25-MX Conducted RF Receiving Sensitivity............................................................................... 111 Table 62: EC25-AUX Conducted RF Receiving Sensitivity ............................................................................ 111 Table 63: EC25-EX Conducted RF Receiving Sensitivity ............................................................................... 112 EC25_Series_Hardware_Design 10 / 126 LTE Standard Module Series EC25 Series Hardware Design Figure Index Figure 2: Pin Assignment (Top View) ................................................................................................................ 23 Figure 3: Sleep Mode Application via UART ..................................................................................................... 37 Figure 4: Sleep Mode Application with USB Remote Wakeup .......................................................................... 37 Figure 5: Sleep Mode Application with RI.......................................................................................................... 38 Figure 6: Sleep Mode Application without Suspend Function ........................................................................... 39 Figure 7: Power Supply Limits during Burst Transmission ................................................................................ 40 Figure 8: Star Structure of the Power Supply .................................................................................................... 41 Figure 9: Reference Circuit of Power Supply .................................................................................................... 41 Figure 10: Turn on the Module by Using Driving Circuit .................................................................................... 42 Figure 11: Turn on the Module by Using Keystroke .......................................................................................... 43 Figure 12: Timing of Turning on Module............................................................................................................ 44 Figure 13: Timing of Turning off Module............................................................................................................ 45 Figure 14: Reference Circuit of RESET_N by Using Driving Circuit ................................................................. 46 Figure 15: Reference Circuit of RESET_N by Using Button ............................................................................. 46 Figure 16: Timing of Resetting Module.............................................................................................................. 47 Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector ................................. 48 Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector ................................... 48 Figure 19: Reference Circuit of USB Application .............................................................................................. 50 Figure 20: Reference Circuit with Translator Chip ............................................................................................ 52 Figure 21: Reference Circuit with Transistor Circuit .......................................................................................... 52 Figure 22: Primary Mode Timing ....................................................................................................................... 53 Figure 23: Auxiliary Mode Timing ...................................................................................................................... 54 Figure 24: Reference Circuit of PCM and I2C Application with Audio Codec ................................................... 55 Figure 25: Reference Circuit of SD Card Interface ............................................................................................ 56 Figure 26: Reference Circuit of Wireless Connectivity Interfaces with FC20 Module ....................................... 59 Figure 27: Simplified Block Diagram for Ethernet Application ........................................................................... 62 Figure 28: Reference Circuit of SGMII Interface with PHY AR8033 Application .............................................. 63 Figure 29: Reference Circuit of the Network Indicator ...................................................................................... 64 Figure 30: Reference Circuits of STATUS......................................................................................................... 65 Figure 31: Reference Circuit of USB_BOOT Interface ...................................................................................... 67 Figure 32: Timing Sequence for Entering Emergency Download Mode ........................................................... 67 Figure 33: Reference Circuit of RF Antenna Interface ...................................................................................... 72 Figure 34: Microstrip Design on a 2-layer PCB ................................................................................................. 73 Figure 35: Coplanar Waveguide Design on a 2-layer PCB ............................................................................... 73 Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ............................ 73 Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ............................ 74 Figure 38: Reference Circuit of GNSS Antenna ................................................................................................ 75 Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) ................................................................... 77 Figure 40: Mechanicals of U.FL-LP Connectors ............................................................................................... 77 Figure 41: Space Factor of Mated Connector (Unit: mm) ................................................................................. 78 Figure 42: Referenced Heatsink Design (Heatsink at the Top of the Module) ................................................ 115 EC25_Series_Hardware_Design 11 / 126 LTE Standard Module Series EC25 Series Hardware Design Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers PCB) .............................. 115 Figure 44: Module Top and Side Dimensions ................................................................................................. 116 Figure 45: Module Bottom Dimensions (Bottom View) .................................................................................... 117 Figure 46: Recommended Footprint (Top View) ............................................................................................. 118 Figure 47: Top View of the Module .................................................................................................................. 119 Figure 48: Bottom View of the Module ............................................................................................................ 119 Figure 49: Reflow Soldering Thermal Profile ................................................................................................... 121 Figure 50: Tape Specifications ........................................................................................................................ 122 Figure 51: Reel Specifications ......................................................................................................................... 123 Figure 52: Tape and Reel Directions ............................................................................................................... 123 EC25_Series_Hardware_Design 12 / 126 LTE Standard Module Series EC25 Series Hardware Design 1 Introduction This document defines EC25 series module and describes its air interface and hardware interfaces which are connected with customers applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC25 series module. To facilitate its application in different fields, relevant reference design is also provided for customers reference. Associated with application note and user guide, customers can use EC25 series module to design and set up mobile applications easily. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a 1.1. FCC Certification Requirements. mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR202012EC25T . 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

EC25_Series_Hardware_Design 13 / 126 LTE Standard Module Series EC25 Series Hardware Design LTE Band2:11.000dBi LTE Band 4 / LTE Band 66:5.000dBi LTE Band 5:9.541dBi LTE Band 12:8.734dBi LTE Band 71:8.545dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 configurations. If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR202012EC25T or Contains FCC ID: XMR202012EC25T must be used. The host OEM EC25_Series_Hardware_Design 14 / 126 LTE Standard Module Series EC25 Series Hardware Design user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. EC25_Series_Hardware_Design 15 / 126 LTE Standard Module Series EC25 Series Hardware Design 1.2. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 series module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. EC25_Series_Hardware_Design 16 / 126 LTE Standard Module Series EC25 Series Hardware Design 2 Product Concept 2.1. General Description EC25 module is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides GNSS1) and voice functionality2) for customers specific applications. EC25 series contain 13 variants: EC25-E, EC25-A, EC25-V, EC25-J, EC25-AU, EC25-AUX, EC25-AUT, EC25-AF, EC25-AFX, EC25-EU, EC25-EUX, EC25-AUTL and EC25-MX. Customers can choose a dedicated type based on the region or operator. The following table shows the frequency bands of EC25 series module. Table 1: Supported Frequency Bands and GNSS Function of EC25 Series Module Modules2) LTE Bands WCDMA Bands GSM Bands Rx-

diversity GNSS1) EC25-E FDD: B1/B3/B5/B7/B8/B20 TDD: B38/B40/B41 B1/B5/B8 900/1800 MHz Y EC25-A FDD: B2/B4/B12 B2/B4/B5 EC25-V FDD: B4/B13 N EC25-AU3) B1/B2/B5/B8 EC25-J EC25-AUX FDD: B1/B3/B8/B18/B19/

B26 TDD: B41 FDD: B1/B2/B3/B4/B5/B7/

TDD: B40 B8/B28 FDD: B1/B23)/B3/B4/B5/

B7/B8/B28 TDD: B40 B1/B6/B8/

B19 B1/B2/B4/B5/

B8 850/900/

1800/1900 MHz 850/900/

1800/1900 MHz EC25-AUT FDD: B1/B3/B5/B7/B28 B1/B5 EC25-AF FDD: B2/B4/B5/B12/B13/

B14/B66/B71 B2/B4/B5 N N N N N Y Y Y Y Y Y Y GPS, GLONASS, BeiDou/

Compass, Galileo, QZSS EC25_Series_Hardware_Design 17 / 126 LTE Standard Module Series EC25 Series Hardware Design EC25-AFX FDD: B2/B4/B5/B12/B13/

B14/B66/B71 B2/B4/B5 N Y EC25-EU B1/B8 900/1800 MHz Y EC25-EUX B1/B8 900/1800 MHz Y FDD: B1/B3/B7/B8/B20/

B28A TDD: B38/B40/B41 FDD: B1/B3/B7/B8/B20/

B28A TDD: B38/B40/B41 FDD:

B2/B4/B5/B12/B66/B71 EC25-AUTL FDD: B3/B7/B28 EC25-MX EC25-EX FDD: B2/B4//B5/B7/B28/

B66 FDD:B1/B3/B5/B7/B8/B20 TDD: B38/B40/B41 N N B2/B4/B5 N N N Y Y Y B1/B5/B8 900/1800 MHz N N N N EC25-T NOTES 1. 2. 1) GNSS function is optional. 2) EC25 series module contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. 3) B2 band on EC25-AU and EC25-AUX modules do not support Rx-diversity. 3. 4. Y = Supported. N = Not supported. With a compact profile of 29.0 mm 32.0 mm 2.4 mm, EC25 series can meet almost all requirements for M2M applications such as automotive, metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EC25 series are an SMD type module which can be embedded into applications through its 144-pin pads, including 80 LCC signal pads and 64 LGA pads. 2.2. Key Features The following table describes the detailed features of EC25 series module. Table 2: Key Features of EC25 Series Module Features Description EC25_Series_Hardware_Design 18 / 126 LTE Standard Module Series EC25 Series Hardware Design Power Supply Supply voltage: 3.34.3 V Typical supply voltage: 3.8 V Transmitting Power LTE Features UMTS Features GSM Features Class 4 (33 dBm 2 dB) for GSM850 Class 4 (33 dBm 2 dB) for EGSM900 Class 1 (30 dBm 2 dB) for DCS1800 Class 1 (30 dBm 2 dB) for PCS1900 Class E2 (27 dBm 3 dB) for GSM850 8-PSK Class E2 (27 dBm 3 dB) for EGSM900 8-PSK Class E2 (26 dBm 3 dB) for DCS1800 8-PSK Class E2 (26 dBm 3 dB) for PCS1900 8-PSK Class 3 (24 dBm + 1/-3 dB) for WCDMA bands Class 3 (23 dBm 2 dB) for LTE-FDD bands Class 3 (23 dBm 2 dB) for LTE-TDD bands Support up to non-CA Cat 4 FDD and TDD Support 1.4/3/5/10/15/20 MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max 150 Mbps (DL)/Max 50 Mbps (UL) LTE-TDD: Max 130 Mbps (DL)/Max 30 Mbps (UL) Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation DC-HSDPA: Max 42 Mbps (DL) HSUPA: Max 5.76 Mbps (UL) WCDMA: Max 384 kbps (DL)/Max 384 kbps (UL) GPRS:

Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107 kbps (DL)/Max 85.6 kbps (UL) EDGE:

Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: MCS 1-9 Uplink coding schemes: MCS 1-9 Max 296 kbps (DL)/Max 236.8 kbps (UL) Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/NITZ/

SMTP/SSL/MQTT/FILE/CMUX/SMTPS/MMS/FILE protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connections Internet Protocol Features SMS Text and PDU mode Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default EC25_Series_Hardware_Design 19 / 126 LTE Standard Module Series EC25 Series Hardware Design

(U)SIM Interface Support USIM/SIM card: 1.8 V, 3.0 V Audio Features PCM Interface USB Interface UART Interfaces Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480 Mbps Used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.65.4, Android 4.x9.x, etc. Main UART:

Used for AT command communication and data transmission Baud rates reach up to 921600 bps, 115200 bps by default Support RTS and CTS hardware flow control Debug UART:

Used for Linux console and log output 115200 bps baud rate SD Card Interface Support SD 3.0 protocol SGMII Interface Support 10 Mbps/100 Mbps/1000 Mbps Ethernet work mode Support maximum 150 Mbps (DL)/50 Mbps (UL) for 4G network Wireless Connectivity Interfaces Support a low-power SDIO 3.0 interface for WLAN and UART/PCM interfaces for Bluetooth Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Network Indication Antenna Interfaces Gen8C Lite of Qualcomm Protocol: NMEA 0183 Data update rate: 1 Hz by default Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands Two pins including NET_MODE and NET_STATUS to indicate network connectivity status Including main antenna interface (ANT_MAIN), Rx-diversity antenna interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS) Physical Characteristics Size: (29.0 0.15) mm (32.0 0.15) mm (2.4 0.2) mm Weight: approx. 4.9 g EC25_Series_Hardware_Design 20 / 126 LTE Standard Module Series EC25 Series Hardware Design Temperature Range Operating temperature range: -35 to +75 C1) Extended temperature range: -40 to +85 C2) Storage temperature range: -40 to +90 C Firmware Upgrade USB interface or DFOTA RoHS All hardware components are fully compliant with EU RoHS directive 1) Within operating temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operating temperature levels, the module will meet 3GPP specifications again.

* means under development. NOTES 1. 2. 3. 2.3. Evaluation Board In order to help customers develop applications with EC25 series, Quectel supplies an evaluation board

(UMTS & LTE EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module. For more details, please refer to document [8]. EC25_Series_Hardware_Design 21 / 126 LTE Standard Module Series EC25 Series Hardware Design 3 Application Interfaces 3.1. General Description

(U)SIM interface EC25 series are equipped with 80 LCC pads and 64 LGA pads that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following interfaces/functions. Power supply USB interface UART interfaces PCM and I2C interfaces SD card interface ADC interfaces Status indication SGMII interface Wireless connectivity interfaces USB_BOOT interface EC25_Series_Hardware_Design 22 / 126 LTE Standard Module Series EC25 Series Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC25 series module. Figure 1: Pin Assignment (Top View) NOTES 1. 1) means pins WAKEUP_IN, NET_MODE, WLAN_EN, COEX_UART_RX, COEX_UART_TX, USB_BOOT and BT_CTS cannot be pulled up before startup. 2) PWRKEY output voltage is 0.8 V because of the diode drop in the Qualcomm chipset. 3) means digital audio (PCM) is only supported on Telematics version. 2. 3. 4. Pins 3740, 118, 127 and 129139 are used for wireless connectivity interfaces, among which pins 118, 127 and 129138 are WLAN function pins, and the rest are Bluetooth (BT) function pins. BT function is under development. EC25_Series_Hardware_Design 23 / 126 RESERVED RESERVED 14 1 14 2 WAKEUP_IN1) AP_READY RESERVED W_DISABLE#

NET_MODE1) NET_ST ATUS VDD_EXT GND GND USIM_GND DBG_RXD DBG_TXD USIM_VDD USIM_DATA USIM_CLK USIM_RST RESERVED 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 USIM_PRESENCE R E S E R V E D R E S E R V E D 1 1 4 1 1 3 129 117 130 118 131 119 132 120 133 121 134 122 135 123 1361) 124 1371) 125 1381) 126 139 127 140 128 1 1 6 1 1 5 R E S E R V E D U S B _ B O O T 1

) U S B _ V B U S G N D U S B _ D M U S B _ D P R X D T X D D T R R T S C T S D C D R I S T A T U S V B A T _ B B V B A T _ B B V B A T _ R F V B A T _ R F G N D R E S E R V E D 7 2 7 1 7 0 6 9 6 8 6 7 6 6 6 5 6 4 6 3 6 2 6 1 6 0 5 9 5 8 5 7 5 6 5 5 108 103 99 95 90 85 109 104 100 96 91 86 110 105 92 87 82 83 84 79 80 81 76 77 78 73 74 75 111 106 101 97 93 88 112 107 102 98 94 89 48 14 4 14 3 54 53 52 51 50 49 47 46 45 44 43 42 41 40 39 38 37 GND GND GND GND GND GND ANT_MAIN RESERVED RESERVED ANT_GNSS GND ADC0 ADC1 RESERVED I2C_SDA I2C_SCL BT_CTS1) BT_RXD BT_TXD BT_RTS 1 9 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 2 3 3 3 4 3 5 3 6 G N D G N D R E S E T _ N P W R K E Y 2

) S D _ I N S _ D E T P C M _ I N 3

) P C M _ O U T 3

) P C M _ C L K 3

) P C M _ S Y N C 3

) S D C 2 _ D A T A 3 S D C 2 _ D A T A 2 S D C 2 _ D A T A 1 S D C 2 _ D A T A 0 S D C 2 _ C L K S D C 2 _ C M D V D D _ S D O I G N D A N T _ D V I Power Pins Signal Pins WLAN Pins RESERVED Pins GND Pins Bluetooth Pins SGMII Pins LTE Standard Module Series EC25 Series Hardware Design 5. Pins 119126 and 128 are used for SGMII interface. 6. Pins 2427 for PCM function are used for audio design on EC25 series module and BT function on FC20 module. 7. Keep all RESERVED pins and unused pins unconnected. 8. GND pins 85112 should be connected to ground in the design. RESERVED pins 7384 should not be designed in schematic and PCB decal, and these pins should be served as a keepout area. 3.3. Pin Description The following tables show the pin definition of EC25 series module. Table 3: I/O Parameters Definition Type AI AO DI DO IO OD PI PO Description Analog Input Analog Output Digital Input Digital Output Bidirectional Open Drain Power Input Power Output Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 59, 60 PI VBAT_RF 57, 58 PI Power supply for modules baseband part Vmax = 4.3 V Vmin = 3.3 V Vnorm = 3.8 V Power supply for modules RF part Vmax = 4.3 V Vmin = 3.3 V It must be provided with sufficient current up to 0.8 A. It must be provided with sufficient current up to EC25_Series_Hardware_Design 24 / 126 LTE Standard Module Series EC25 Series Hardware Design Vnorm = 3.8 V VDD_EXT 7 PO Provide 1.8 V for external circuit Vnorm = 1.8 V IOmax = 50 mA GND Ground 8, 9, 19, 22, 36, 46, 48, 5054, 56, 72, 85112 Power-on/off Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 21 DI VH = 0.8 V Turn on/off the module RESET_N 20 DI Status Indication Reset signal of the module VIHmax = 2.1 V VIHmin = 1.3 V VILmax = 0.5 V Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 61 OD Indicate the module operating status The drive current should be less than 0.9 mA. NET_MODE 5 DO NET_ STATUS 6 DO USB Interface Indicate the modules network registration mode Indicate the modules network activity status VOHmin = 1.35 V VOLmax = 0.45 V VOHmin = 1.35 V VOLmax = 0.45 V 1.8 A in a burst transmission. Power supply for external GPIOs pull-up circuits. If unused, keep it open. The output voltage is 0.8 V because of the diode drop in the Qualcomm chipset. If unused, keep it open. An external pull-up resistor is required. If unused, keep it open. 1.8 V power domain. It cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS 71 PI USB connection detection Vmax = 5.25 V Vmin = 3.0 V Vnorm = 5.0 V Typical: 5.0 V. If unused, keep it open. EC25_Series_Hardware_Design 25 / 126 LTE Standard Module Series EC25 Series Hardware Design USB 2.0 Compliant. Require differential impedance of 90 . If unused, keep it open. USB 2.0 Compliant. Require differential impedance of 90 . If unused, keep it open. 1.8 V power domain. If unused, keep it open. Either 1.8 V or 3.0 V is supported by the module automatically. Pin Name Pin No. I/O Description DC Characteristics Comment USB_DP 69 IO USB differential data bus (+) USB_DM 70 IO USB differential data bus (-)

(U)SIM Interface USIM_GND 10 Specified ground for

(U)SIM card USIM_ PRESENCE 13 DI

(U)SIM card insertion detection USIM_VDD 14 PO Power supply for

(U)SIM card USIM_DATA 15 IO Data signal of

(U)SIM card USIM_CLK 16 DO Clock signal of

(U)SIM card VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V IOmax = 50 mA For 1.8 V(U)SIM:

Vmax = 1.9 V Vmin = 1.7 V For 3.0 V(U)SIM:

Vmax = 3.05 V Vmin = 2.7 V For 1.8 V (U)SIM:

VILmax = 0.6 V VIHmin = 1.2 V VOLmax = 0.45 V VOHmin = 1.35 V For 3.0 V (U)SIM:

VILmax = 1.0 V VIHmin = 1.95 V VOLmax = 0.45 V VOHmin = 2.55 V For 1.8 V (U)SIM:

VOLmax = 0.45 V VOHmin = 1.35 V EC25_Series_Hardware_Design 26 / 126 LTE Standard Module Series EC25 Series Hardware Design USIM_RST 17 DO Reset signal of

(U)SIM card Main UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment RI 62 DO Ring indicator VOLmax = 0.45 V VOHmin = 1.35 V DCD 63 DO Data carrier detection VOLmax = 0.45 V VOHmin = 1.35 V For 3.0 V (U)SIM:

VOLmax = 0.45 V VOHmin = 2.55 V For 1.8 V (U)SIM:

VOLmax = 0.45 V VOHmin = 1.35 V For 3.0 V (U)SIM:

VOLmax = 0.45 V VOHmin = 2.55 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. Pulled up by default. Low level wakes up the module. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. CTS 64 DO Clear to send RTS 65 DI Request to send DTR 66 DI Data terminal ready, sleep mode control TXD 67 DO Transmit data RXD 68 DI Receive data Debug UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment EC25_Series_Hardware_Design 27 / 126 LTE Standard Module Series EC25 Series Hardware Design DBG_TXD 12 DO Transmit data DBG_RXD 11 DI Receive data VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment General-purpose analog to digital converter General-purpose analog to digital converter Voltage range:

0.3 V to VBAT_BB If unused, keep it open. Voltage range:

0.3 V to VBAT_BB If unused, keep it open. ADC Interfaces ADC0 45 AI ADC1 44 AI PCM Interface1) Pin Name Pin No. I/O Description DC Characteristics Comment PCM_IN 24 DI PCM data input PCM_OUT 25 DO PCM data output PCM_SYNC 26 IO PCM data frame synchronization signal PCM_CLK 27 IO PCM clock I2C Interface VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. 1.8 V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. EC25_Series_Hardware_Design 28 / 126 LTE Standard Module Series EC25 Series Hardware Design Pin Name Pin No. I/O Description DC Characteristics Comment I2C serial clock. Used for external codec. I2C serial data. Used for external codec. I2C_SCL 41 OD I2C_SDA 42 OD SD Card Interface Pin Name Pin No. I/O Description DC Characteristics Comment An external 1.8 V pull-up resistor is required. If unused, keep it open. An external 1.8 V pull-up resistor is required. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. 1.8 V signaling:

VOLmax = 0.45 V VOHmin = 1.4 V VILmin = -0.3 V VILmax = 0.58 V VIHmin = 1.27 V VIHmax = 2.0 V 3.0 V signaling:

VOLmax = 0.38 V VOHmin = 2.01 V VILmin = -0.3 V VILmax = 0.76 V VIHmin = 1.72 V VIHmax = 3.34 V 1.8 V signaling:

VOLmax = 0.45 V VOHmin = 1.4 V VILmin = -0.3 V VILmax = 0.58 V VIHmin = 1.27 V VIHmax = 2.0 V 3.0 V signaling:

VOLmax = 0.38 V VOHmin = 2.01 V VILmin = -0.3 V VILmax = 0.76 V VIHmin = 1.72 V SDC2_ DATA3 28 IO SD card SDIO bus DATA3 SDC2_ DATA2 29 IO SD card SDIO bus DATA2 EC25_Series_Hardware_Design 29 / 126 LTE Standard Module Series EC25 Series Hardware Design VIHmax = 3.34 V 1.8 V signaling:

VOLmax = 0.45 V VOHmin = 1.4 V VILmin = -0.3 V VILmax = 0.58 V VIHmin = 1.27 V VIHmax = 2.0 V 3.0 V signaling:

VOLmax = 0.38 V VOHmin = 2.01 V VILmin = -0.3 V VILmax = 0.76 V VIHmin = 1.72 V VIHmax = 3.34 V 1.8 V signaling:

VOLmax = 0.45 V VOHmin = 1.4 V VILmin = -0.3 V VILmax = 0.58 V VIHmin = 1.27 V VIHmax = 2.0 V 3.0 V signaling:

VOLmax = 0.38 V VOHmin = 2.01 V VILmin = -0.3 V VILmax = 0.76 V VIHmin = 1.72 V VIHmax = 3.34 V 1.8 V signaling:

VOLmax = 0.45 V VOHmin = 1.4 V 3.0 V signaling:

VOLmax = 0.38 V VOHmin = 2.01 V 1.8V signaling:

VOLmax = 0.45 V VOHmin = 1.4 V VILmin = -0.3 V SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to SD card supported level, please refer to SDC2_ DATA1 30 IO SD card SDIO bus DATA1 SDC2_ DATA0 31 IO SD card SDIO bus DATA0 SDC2_CLK 32 DO SD card SDIO bus clock SDC2_CMD 33 IO SD card SDIO bus command EC25_Series_Hardware_Design 30 / 126 LTE Standard Module Series EC25 Series Hardware Design VILmax = 0.58 V VIHmin = 1.27 V VIHmax = 2.0 V 3.0 V signaling:

VOLmax = 0.38 V VOHmin = 2.01 V VILmin = -0.3 V VILmax = 0.76 V VIHmin = 1.72 V VIHmax = 3.34 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V For 1.8 V:

VOLmax = 0.45 V VOHmin = 1.4 V For 2.85 V:

VOLmax = 0.35 V VOHmin = 2.14 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V For 1.8 V:

VOLmax = 0.45 V VOHmin = 1.4 V VILmax = 0.58 V VIHmin = 1.27 V For 2.85 V:

VOLmax = 0.35 V SD 3.0 protocol for more details. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8/2.85 V configurable. Cannot be used for SD card power. If unused, keep it open. 1.8/2.85 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8/2.85 V power domain. If unused, keep it open. SD_INS_ DET 23 DI SD card insertion detect VDD_SDIO 34 PO IOmax = 50 mA SD card SDIO bus pull-up power SGMII Interface Pin Name Pin No. I/O Description DC Characteristics Comment EPHY_RST_ N 119 DO Ethernet PHY reset EPHY_INT_N 120 DI Ethernet PHY interrupt SGMII_ MDATA 121 IO SGMII MDIO

(Management Data Input/Output) data EC25_Series_Hardware_Design 31 / 126 LTE Standard Module Series EC25 Series Hardware Design VOHmin = 2.14 V VILmax = 0.71 V VIHmin = 1.78 V For 1.8 V:

VOLmax = 0.45 V VOHmin = 1.4 V For 2.85 V:

VOLmax = 0.35 V VOHmin = 2.14 V SGMII_ MCLK 122 DO SGMII MDIO

(Management Data Input/Output) clock SGMII_TX_M 123 AO SGMII transmission

- minus SGMII_TX_P 124 AO SGMII transmission

- plus SGMII_RX_P 125 AI SGMII receiving

- plus SGMII_RX_M 126 AI SGMII receiving

- minus USIM2_VDD 128 PO SGMII MDIO pull-up power source 1.8/2.85 V power domain. If unused, keep it open. Connect with a 0.1 F capacitor, and is close to the PHY side. If unused, keep it open. Connect with a 0.1 F capacitor, and is close to the PHY side. If unused, keep it open. Connect with a 0.1 F capacitor, and is close to EC25 series module. If unused, keep it open. Connect with a 0.1 F capacitor, and is close to EC25 series module. If unused, keep it open. Configurable power source. 1.8/2.85 V power domain. If unused, keep it open. Wireless Connectivity Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment SDC1_ DATA3 129 IO WLAN SDIO data bus D3 VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep it EC25_Series_Hardware_Design 32 / 126 LTE Standard Module Series EC25 Series Hardware Design VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V SDC1_ DATA2 130 IO WLAN SDIO data bus D2 SDC1_ DATA1 131 IO WLAN SDIO data bus D1 SDC1_ DATA0 132 IO WLAN SDIO data bus D0 SDC1_CLK 133 DO WLAN SDIO bus clock VOLmax = 0.45 V VOHmin = 1.35 V SDC1_CMD 134 DO WLAN SDIO bus command VOLmax = 0.45 V VOHmin = 1.35 V PM_ENABLE 127 DO WLAN power control VOLmax = 0.45 V VOHmin = 1.35 V WAKE_ON_ WIRELESS 135 DI Wake up the host

(EC25 series module) by FC20 module VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V WLAN_EN 136 DO WLAN function control via FC20 module VOLmax = 0.45 V VOHmin = 1.35 V COEX_UART _RX 137 DI LTE/WLAN & BT coexistence signal VILmin = -0.3 V VILmax = 0.6 V open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. Active low. If unused, keep it open. 1.8 V power domain. Active high. Cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain. Cannot be pulled up EC25_Series_Hardware_Design 33 / 126 LTE Standard Module Series EC25 Series Hardware Design VIHmin = 1.2 V VIHmax = 2.0 V before startup. If unused, keep it open. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 50 impedance. If unused, keep it open. 50 impedance. 50 impedance. If unused, keep it open. COEX_UART _TX 138 DO LTE/WLAN & BT coexistence signal VOLmax = 0.45 V VOHmin = 1.35 V WLAN_SLP_ CLK 118 DO WLAN sleep clock BT_RTS 37 DI BT UART request to send VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V BT_TXD 38 DO BT UART transmit data VOLmax = 0.45 V VOHmin = 1.35 V BT_RXD 39 DI BT UART receive data BT_CTS 40 DO BT UART clear to send VOLmax = 0.45 V VOHmin = 1.35 V BT_EN 139 DO BT function control via FC20 module VOLmax = 0.45 V VOHmin = 1.35 V RF Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment ANT_DIV 35 AI Diversity antenna ANT_MAIN 49 IO Main antenna ANT_GNSS 47 AI GNSS antenna Other Interface Pins EC25_Series_Hardware_Design 34 / 126 LTE Standard Module Series EC25 Series Hardware Design Pin Name Pin No. I/O Description DC Characteristics Comment WAKEUP_IN 1 DI Sleep mode control W_DISABLE# 4 DI Airplane mode control AP_READY 2 DI Application processor sleep state detection USB_BOOT Interface VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. Cannot be pulled up before startup. Low level wakes up the module. If unused, keep it open. 1.8 V power domain. Pull-up by default. At low voltage level, module can enter airplane mode. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment Force the module to enter emergency download mode VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. Cannot be pulled up before startup. It is recommended to reserve test point. Pin Name Pin No. I/O Description DC Characteristics Comment RESERVED Reserved Keep these pins unconnected. USB_BOOT 115 DI RESERVED Pins 3, 18, 43, 55, 7384, 113, 114, 116, 117, 140-144. NOTES module. 2. BT function is under development. 1. 1) PCM interface pins are used for audio design on EC25 series module and BT function on FC20 EC25_Series_Hardware_Design 35 / 126 LTE Standard Module Series EC25 Series Hardware Design 3.4. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters. Table 5: Overview of Operating Modes Mode Details Normal Operation Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. Minimum Functionality Mode AT+CFUN=0 command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. Airplane Mode AT+CFUN=4 command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. In this mode, the power management unit shuts down the power supply. Software goes inactive. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. EC25 series are able to reduce its current consumption to a minimum value during the sleep mode. The following section describes power saving procedures of EC25 module. If the host communicates with module via UART interface, the following preconditions can let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Drive DTR to high level. EC25_Series_Hardware_Design 36 / 126 Sleep Mode Power Down Mode 3.5. Power Saving 3.5.1. Sleep Mode 3.5.1.1. UART Application LTE Standard Module Series EC25 Series Hardware Design The following figure shows the connection between the module and the host. Figure 2: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module. When EC25 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.19 for details about RI behaviors. AP_READY will detect the sleep state of the host (can be configured to high level or low level detection). Please refer to AT+QCFG="apready" command for details. 3.5.1.2. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application with USB Remote Wakeup EC25_Series_Hardware_Design 37 / 126 Module Host RXD TXD RI DTR GND AP_READY TXD RXD EINT GPIO GPIO GND Module USB_VBUS USB_DP USB_DM AP_READY GND Host VDD USB_DP USB_DM GPIO GND LTE Standard Module Series EC25 Series Hardware Design Sending data to EC25 via USB will wake up the module. When EC25 has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend and resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application with RI Sending data to EC25 via USB will wake up the module. When EC25 has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected via an additional control circuit to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. Disconnect USB_VBUS. The following figure shows the connection between the module and the host. EC25_Series_Hardware_Design 38 / 126 Module USB_VBUS USB_DP USB_DM AP_READY RI GND Host VDD USB_DP USB_DM GPIO EINT GND LTE Standard Module Series EC25 Series Hardware Design Figure 5: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. Please pay attention to the level match shown in dotted line between the module and the host. For more details about EC25 power management application, please refer to document [1]. NOTE 3.5.2. Airplane Mode When the module enters airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. This mode can be set via the following ways. Hardware:

The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. Software:

AT+CFUN command provides the choice of the functionality level through setting <fun> into 0, 1 or 4. AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled. AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode. RF function is disabled. NOTES 1. The W_DISABLE# control function is disabled in firmware by default. It can be enabled by AT+QCFG="airplanecontrol" command. 2. The execution of AT+CFUN command will not affect GNSS function. EC25_Series_Hardware_Design 39 / 126 Module Host Power Switch USB_VBUS USB_DP USB_DM RI AP_READY GND GPIO VDD USB_DP USB_DM EINT GPIO GND LTE Standard Module Series EC25 Series Hardware Design 3.6. Power Supply 3.6.1. Power Supply Pins EC25 provides four VBAT pins for connection with the external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for modules RF part Two VBAT_BB pins for modules baseband part The following table shows the details of VBAT pins and ground pins. Table 6: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 57, 58 3.3 3.8 4.3 VBAT_BB 59, 60 3.3 3.8 4.3 Power supply for modules RF part Power supply for modules baseband part Ground

0

V V V 8, 9, 19, 22, 36, 46, 48, 5054, 56, 72, 85112 GND 3.6.2. Decrease Voltage Drop The power supply range of EC25 is from 3.3 V to 4.3 V. Please make sure that the input voltage will never drop below 3.3 V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks.

Figure 6: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100 F with low ESR (ESR = 0.7 ) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to VBAT_BB/VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1 mm; and the width of VBAT_RF trace should be no less than 2 mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to avoid the damage caused by electric surge and ESD, it is suggested that a TVS EC25_Series_Hardware_Design 40 / 126 LTE Standard Module Series EC25 Series Hardware Design diode with suggested low reverse stand-off voltage VRWM 4.5 V, low clamping voltage VC and high reverse peak pulse current IPP should be used. The following figure shows the star structure of the power supply.

Figure 7: Star Structure of the Power Supply 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2.0 A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5.0 V input power source. The typical output of the power supply is about 3.8 V and the maximum load current is 3.0 A. Figure 8: Reference Circuit of Power Supply NOTE In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 3.6.4. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. EC25_Series_Hardware_Design 41 / 126 DC_IN VBAT MIC29302WU 2 IN N E 1 4 OUT J D A D N G 51K 3 5 100K 1%

47K 1%

470 F 100 nF 4.7K VBAT_EN 47K 470R 470 F 100 nF LTE Standard Module Series EC25 Series Hardware Design 3.7. Power-on/off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name Pin No. I/O Description Comment PWRKEY 21 DI Turn on/off the module The output voltage is 0.8 V because of the diode drop in the Qualcomm chipset. When EC25 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY. After STATUS pin (require external pull-up resistor) outputs a low level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. Figure 9: Turn on the Module by Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. EC25_Series_Hardware_Design 42 / 126 PWRKEY 10 nF 500 ms Turn on pulse 4.7K 47K LTE Standard Module Series EC25 Series Hardware Design Figure 10: Turn on the Module by Using Keystroke The power-on scenario is illustrated in the following figure. EC25_Series_Hardware_Design 43 / 126 S1 PWRKEY TVS Close to S1 LTE Standard Module Series EC25 Series Hardware Design Figure 11: Timing of Turning on Module NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2. PWRKEY can be pulled down directly to GND with a recommended 10 k resistor if module needs to be powered on automatically and shutdown is not needed. 3.7.2. Turn off Module The following procedures can be used to turn off the module normally:

Use the PWRKEY pin. Use AT+QPOWD command. EC25_Series_Hardware_Design 44 / 126 VBA T 500 ms VH=0.8 V VIL 0.5 V Abo ut 100 ms NOTE 1 PWRKEY VDD_EXT RESET_N STATUS

(OD) BOO T_CONFIG &

USB_BOO T Pin s 2.5 s 12 s 13 s UART Inactive USB Inactive Active Active 100 ms. Over th is time, BOO T_CONFIG pins can be pu lled up external ly. LTE Standard Module Series EC25 Series Hardware Design 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650 ms, the module will execute power-off procedure after the PWRKEY is released. The power-off scenario is illustrated in the following figure. Figure 12: Timing of Turning off Module NOTES 1. 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the module via PWRKEY pin. Please refer to document [2] for details about AT+QPOWD command. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 2. When turning off module with the AT command, please keep PWRKEY at high level after the execution of the command. Otherwise, the module will be turned on again after successfully turn-off. 3.8. Reset Module The RESET_N pin can be used to reset the module. And module can be reset by driving RESET_N low for 150460 ms. EC25_Series_Hardware_Design 45 / 126 VBA T PWRKEY STATUS

(OD) Module Status 650 ms 29.5 s RUNNING Power-down procedure OFF LTE Standard Module Series EC25 Series Hardware Design Table 8: Pin Definition of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 20 DI Reset the module 1.8 V power domain The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 13: Reference Circuit of RESET_N by Using Driving Circuit Figure 14: Reference Circuit of RESET_N by Using Button EC25_Series_Hardware_Design 46 / 126 RESET_N 150460 ms Reset pulse 4.7K 47K S2 RESET_N TVS Close to S2 LTE Standard Module Series EC25 Series Hardware Design The reset scenario is illustrated in the following figure. Figure 15: Timing of Resetting Module NOTES 1. Use RESET_N only when failed to turn off the module by AT+QPOWD command and PWRKEY pin. 2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported. Table 9: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Description Comment USIM_VDD 14 PO Power supply for (U)SIM card Either 1.8 V or 3.0 V is supported by the module automatically. USIM_DATA 15 IO Data signal of (U)SIM card USIM_CLK 16 DO Clock signal of (U)SIM card USIM_RST 17 DO Reset signal of (U)SIM card USIM_ PRESENCE 13 DI

(U)SIM card insertion detection 1.8 V power domain. If unused, keep it open. USIM_GND 10 Specified ground for (U)SIM card EC25_Series_Hardware_Design 47 / 126 VBAT RESET_N Module Status 150 ms 460 ms VIL 0.5 V VIH 1.3 V Running Resetting Restart LTE Standard Module Series EC25 Series Hardware Design EC25 supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections. By default, it is disabled, and can be configured via AT+QSIMDET command. Please refer to document [2] for more details about the command The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. Figure 16: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 17: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers applications, please follow the criteria below in (U)SIM circuit design:

EC25_Series_Hardware_Design 48 / 126 VDD_EXT USIM_VDD 51K 15K Module USIM_GND USIM_VDD USIM_RST USIM_CLK USIM_PRESENCE USIM_DATA 0R 0R 0R 100 nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33 pF 33 pF 33 pF GND GND GND USIM_VDD USIM_GND USIM_VDD USIM_RST USIM_CLK USIM_DATA 15K 0R 0R 0R Module 100 nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33 pF 33 pF 33 pF GND GND LTE Standard Module Series EC25 Series Hardware Design Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200 mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1 F, and place it as close to (U)SIM card connector as possible. If the ground is complete on customers PCB, USIM_GND can be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should not be more than 15 pF. The 0 resistors should be added in series between the module and the (U)SIM card to facilitate debugging. The 33 pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the

(U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 3.10. USB Interface EC25 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface can only serve as a slave device and is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface. Table 10: Pin Description of USB Interface Pin Name Pin No. I/O Description Comment USB_DP 69 USB differential data bus (+) USB_DM 70 USB differential data bus (-) USB_VBUS 71 USB connection detectionUSB detection IO IO PI Require differential impedance of 90 Require differential impedance of 90 Typical 5.0 V GND 72 Ground For more details about the USB 2.0 specifications, please visit http://www.usb.org/home. The USB interface is recommended to be reserved for firmware upgrade in customers designs. The following figure shows a reference circuit of USB interface. EC25_Series_Hardware_Design 49 / 126 LTE Standard Module Series EC25 Series Hardware Design Figure 18: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with ground surrounded. The impedance of USB differential trace is 90 . Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. Junction capacitance of the ESD protection device might cause influences on USB data lines, so please pay attention to the selection of the device. Typically, the stray capacitance should be less than 2 pF. Keep the ESD protection devices to the USB connector as close as possible. 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. EC25_Series_Hardware_Design 50 / 126 Minimize these stubs Test Points Module VDD NM_0R NM_0R R3 R4 L1 Close to Module ESD Array USB_VBUS USB_DM USB_DP GND MCU USB_DM USB_DP GND LTE Standard Module Series EC25 Series Hardware Design The main UART interface supports 4800 bps, 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps, 230400 bps, 460800 bps and 921600 bps baud rates, and the default is 115200 bps. It also supports RTS and CTS hardware flow control, and can be used for data transmission and AT command communication. The debug UART interface supports 115200 bps baud rate. It is used for Linux console and log output. The following tables show the pin definition of the UART interfaces. Table 11: Pin Definition of Main UART Interface Pin Name Pin No. I/O Description Comment RI DCD CTS RTS DTR TXD RXD 62 63 64 65 66 67 68 DO DO DO DI DI DO DI Ring indicator Data carrier detection Clear to send Data terminal ready, sleep mode control Transmit data Receive data Request to send 1.8 V power domain Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_TXD DBG_RXD 12 11 DO DI Transmit data Receive data The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O 1.8 V power domain Parameter VIL Min.

-0.3 Max. 0.6 Unit V EC25_Series_Hardware_Design 51 / 126 LTE Standard Module Series EC25 Series Hardware Design VIH VOL VOH 1.2 0 1.35 2.0 0.45 1.8 V V V The module provides 1.8 V UART interface. A level translator should be used if customers application is equipped with a 3.3 V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. Figure 19: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. For the design of circuits shown in dotted lines, please refer to that shown in solid lines, but please pay attention to the direction of connection. Figure 20: Reference Circuit with Transistor Circuit EC25_Series_Hardware_Design 52 / 126 VDD_EXT VCCA VCCB 0.1 F VDD_MCU 0.1 F 1 0 K 120K RI DCD CTS RTS DTR TXD RXD OE A1 A2 A3 A4 A5 A6 A7 A8 Translator GND B1 B2 B3 B4 B5 B6 B7 B8 51K 51K RI_MCU DCD_MCU CTS_MCU RTS_MCU DTR_MCU TXD_MCU RXD_MCU VDD_EXT VDD_EXT 4.7K 1 nF MCU/ARM 10K Module 10K 1 nF VCC_MCU 4.7K VDD_EXT TXD RXD RTS CTS GPIO EINT GPIO GND RXD TXD RTS CTS DTR RI DCD GND LTE Standard Module Series EC25 Series Hardware Design NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460 kbps. 3.12. PCM and I2C Interfaces EC25 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface:

Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256 kHz, 512 KHz, 1024 kHz or 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4096 kHz PCM_CLK at 16 kHz PCM_SYNC. In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256 kHz, 512 kHz, 1024 kHz or 2048 kHz PCM_CLK and an 8 kHz, 50% duty cycle PCM_SYNC. EC25 supports 16-bit linear data format. The following figures show the primary modes timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary modes timing relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK. Figure 21: Primary Mode Timing EC25_Series_Hardware_Design 53 / 126 125us PCM_CLK 1 2 255 256 PCM_SYNC PCM_OUT PCM_IN MSB LSB MSB MSB LSB MSB LTE Standard Module Series EC25 Series Hardware Design Figure 22: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_SYNC 26 PCM_IN PCM_OUT PCM_CLK I2C_SCL I2C_SDA 24 25 27 41 42 DI DO IO IO OD OD PCM data input 1.8 V power domain PCM data output 1.8 V power domain PCM data frame synchronization signal 1.8 V power domain PCM data bit clock 1.8 V power domain I2C serial clock Require external pull-up to 1.8 V I2C serial data Require external pull-up to 1.8 V Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. Please refer to document [2] for more details about AT+QDAI command. The following figure shows a reference design of PCM and I2C interfaces with external codec IC. EC25_Series_Hardware_Design 54 / 126 125us PCM_CLK 1 2 31 32 PCM_SYNC PCM_OUT PCM_IN MSB MSB LSB LSB LTE Standard Module Series EC25 Series Hardware Design Figure 23: Reference Circuit of PCM and I2C Application with Audio Codec NOTES 1. It is recommended to reserve an RC (R = 22 , C = 22 pF) circuits on the PCM lines, especially for PCM_CLK. 2. EC25 works as a master device pertaining to I2C interface. 3.13. SD Card Interface EC25 supports SDIO 3.0 interface for SD card. The following table shows the pin definition of SD card interface. Table 15: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SDC2_DATA3 28 IO SD card SDIO bus DATA3 SDC2_DATA2 29 SD card SDIO bus DATA2 SDC2_DATA1 30 SD card SDIO bus DATA1 IO IO SDC2_DATA0 31 IO SD card SDIO bus DATA0 SDIO signal level can be selected according to SD card supported level, please refer to SD 3.0 protocol for more details. If unused, keep it open. EC25_Series_Hardware_Design 55 / 126 PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN I2C_SCL I2C_SDA S A B I MICBIAS INP INN LOUTP LOUTN BCLK LRCK DAC ADC SCL SDA Module K 7

. 4 K 7

. 4 1.8 V Codec LTE Standard Module Series EC25 Series Hardware Design SDC2_CLK DO SD card SDIO bus clock SDC2_CMD IO SD card SDIO bus command 32 33 VDD_SDIO 34 PO SD card SDIO bus pull up power SD_INS_DET 23 DI SD card insertion detection The following figure shows a reference design of SD card. 1.8/2.85 V configurable. Cannot be used for SD card power. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Figure 24: Reference Circuit of SD Card Interface In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with:

SD_INS_DET must be connected. The voltage range of SD card power supply VDD_3 V is 2.73.6 V and a sufficient current up to 0.8 A should be provided. As the maximum output current of VDD_SDIO is 50 mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card. To avoid jitter of bus, resistors R7R11 are needed to pull up the SDIO to VDD_SDIO. Value of these resistors is among 10100 k and the recommended value is 100 k. VDD_SDIO should be used as the pull-up power. In order to adjust signal quality, it is recommended to add 0 resistors R1R6 in series between the module and the SD card. The bypass capacitors C1C6 are reserved and not mounted by default. All resistors and bypass capacitors should be placed close to the module. In order to offer good ESD protection, it is recommended to add a TVS diode on SD card pins near the SD card connector with junction capacitance less than 15 pF. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data EC25_Series_Hardware_Design 56 / 126 R7 NM R8 NM R9 NM R10 NM R11 NM R12 470K C10 100uF C9 100nF C8 33pF C7 10pF VDD_EXT

VDD_3V SD Card Connector Module VDD_SDIO SDC2_DATA3 SDC2_DATA2 SDC2_DATA1 SDC2_DATA0 SDC2_CLK SDC2_CMD SD_INS_DET R1 0R R2 0R R3 0R R4 0R R5 0R R6 0R C1 NM D1 C2 NM D2 C3 NM D3 C4 NM D4 C5 NM D5 D7 D6 C6 NM CD/DAT3 VDD DAT2 DAT1 DAT0 CLK CMD VSS DETECTIVE LTE Standard Module Series EC25 Series Hardware Design trace is 50 ( 10%). Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of SDIO bus should be less than 15 pF. It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1 mm and the total routing length less than 50 mm. The total trace length inside the module is 27 mm, so the exterior total trace length should be less than 23 mm. 3.14. Wireless Connectivity Interfaces EC25 supports a low-power SDIO 3.0 interface for WLAN and UART/PCM interfaces for BT function. The following table shows the pin definition of wireless connectivity interfaces. Table 16: Pin Definition of Wireless Connectivity Interfaces Pin Name Pin No. I/O Description Comment WLAN Part SDC1_DATA3 129 IO WLAN SDIO data bus D3 1.8 V power domain SDC1_DATA2 130 IO WLAN SDIO data bus D2 1.8 V power domain SDC1_DATA1 131 IO WLAN SDIO data bus D1 1.8 V power domain SDC1_DATA0 132 IO WLAN SDIO data bus D0 1.8 V power domain SDC1_CLK 133 DO WLAN SDIO bus clock 1.8 V power domain SDC1_CMD 134 IO WLAN SDIO bus command 1.8 V power domain WLAN_EN 136 DO WLAN function control via FC20 module. Coexistence and Control Part PM_ENABLE 127 DO WLAN power control WAKE_ON_ WIRELESS 135 DI Wake up the host (EC25 module) by FC20 module 1.8 V power domain. Active high. Cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain Active high. 1.8 V power domain COEX_UART_RX 137 DI LTE/WLAN & BT coexistence signal 1.8 V power domain. EC25_Series_Hardware_Design 57 / 126 LTE Standard Module Series EC25 Series Hardware Design COEX_UART_TX 138 DO LTE/WLAN & BT coexistence signal WLAN_SLP_CLK 118 DO WLAN sleep clock BT Part BT_RTS BT_TXD BT_RXD DI BT UART request to send 1.8 V power domain DO BT UART transmit data 1.8 V power domain DI BT UART receive data 1.8 V power domain BT_CTS 40 DO BT UART clear to send Cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. PCM_IN1) DI PCM data input 1.8 V power domain PCM_OUT1) DO PCM data output 1.8 V power domain PCM_SYNC1) IO PCM data frame synchronization signal 1.8 V power domain PCM_CLK1) IO PCM data bit clock 1.8 V power domain BT_EN 139 DO BT function control via FC20 module. 1.8 V power domain Active high. The following figure shows a reference design of wireless connectivity interfaces with Quectel FC20 module. 37 38 39 24 25 26 27 EC25_Series_Hardware_Design 58 / 126 LTE Standard Module Series EC25 Series Hardware Design Figure 25: Reference Circuit of Wireless Connectivity Interfaces with FC20 Module NOTES 1. FC20 module can only be used as a slave device. 2. When BT function is enabled on EC25 module, PCM_SYNC and PCM_CLK pins are only used to 3. output signals. BT function is under development. 1) Pins 2427 for PCM function are used for audio design on EC25 module and BT function on FC20 module. 4. For more information about wireless connectivity interfaces, please refer to document [5]. 3.14.1. WLAN Interface EC25 provides a low-power SDIO 3.0 interface and control interface for WLAN design. SDIO interface supports SDR mode, and the maximum frequency is up to 50 MHz. As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles:

EC25_Series_Hardware_Design 59 / 126 Module FC20 Module PM_ENABL E DCDC/LDO VDD_3V3 POWER WLAN Bluetooth WLAN_SLP_CLK WAKE_ON_WIREL ESS COEX COEX_UART_RX COEX_UART_TX VDD_EXT SDC1_DATA3 SDC1_DATA2 SDC1_DATA1 SDC1_DATA0 SDC1_CLK SDC1_CMD WLAN_EN BT_EN BT_RTS BT_CTS BT_TXD BT_RXD PCM_IN PCM_OUT PCM_SYNC PCM_CLK WAKE_ON_WIREL ESS VIO SDIO_D3 SDIO_D2 SDIO_D1 SDIO_D0 SDIO_CLK SDIO_CMD WLAN_EN 32KHZ_IN LTE_UART_TXD LTE_UART_RXD BT_EN BT_UART_RTS BT_UART_CTS BT_UART_RXD BT_UART_TXD PCM_OUT PCM_IN PCM_SYNC PCM_CLK LTE Standard Module Series EC25 Series Hardware Design It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 50 10%. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. It is recommended to keep matching length between CLK and DATA/CMD less than 1 mm and total routing length less than 50 mm. Keep termination resistors within 1524 on clock lines near the module and keep the route distance from the module clock pins to termination resistors less than 5 mm. Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than EC25 supports a dedicated UART interface and a PCM interface for BT application. Further information about BT interface will be provided in future version of this document. 15 pF. 3.14.2. BT Interface*

NOTE

* means under development. 3.15. ADC Interfaces The module provides two analog-to-digital converter (ADC) interfaces. AT+QADC=0 command can be used to read the voltage value on ADC0 pin. AT+QADC=1 command can be used to read the voltage value on ADC1 pin. For more details about these AT commands, please refer to document [2]. In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground. Table 17: Pin Definition of ADC Interfaces Pin Name Pin No. Description ADC0 ADC1 45 44 General-purpose analog to digital converter General-purpose analog to digital converter The following table describes the characteristic of ADC function. EC25_Series_Hardware_Design 60 / 126 LTE Standard Module Series EC25 Series Hardware Design Table 18: Characteristic of ADC Parameter Min. Typ. Max. ADC0 Voltage Range ADC1 Voltage Range 0.3 0.3 ADC Resolution 15 VBAT_BB VBAT_BB Unit V V bits NOTES 1. ADC input voltage must not exceed that of VBAT_BB. 2. 3. It is prohibited to supply any voltage to ADC pins when VBAT power supply is removed. It is recommended to use a resistor divider circuit for ADC application. 3.16. SGMII Interface IEEE802.3 compliant EC25 includes an integrated Ethernet MAC with an SGMII interface and two management interfaces. The key features of the SGMII interface are shown below:

Support 10 Mbps/100 Mbps/1000 Mbps Ethernet work mode Support maximum 150 Mbps (DL)/50 Mbps (UL) for 4G network Support VLAN tagging Support IEEE1588 and Precision Time Protocol (PTP) Can be used to connect to external Ethernet PHY like AR8033, or to an external switch Management interfaces support dual voltage 1.8/2.85 V The following table shows the pin definition of SGMII interface. Table 19: Pin Definition of SGMII Interface Pin Name Pin No. I/O Description Comment Control Signal Part EPHY_RST_N 119 DO Ethernet PHY reset 1.8/2.85 V power domain EC25_Series_Hardware_Design 61 / 126 LTE Standard Module Series EC25 Series Hardware Design EPHY_INT_N 120 DI Ethernet PHY interrupt 1.8 V power domain SGMII_MDATA 121 IO 1.8/2.85 V power domain SGMII MDIO (Management Data Input/Output) data SGMII MDIO (Management Data Input/Output) clock SGMII_MCLK 122 DO 1.8/2.85 V power domain USIM2_VDD 128 PO SGMII MDIO pull-up power source Configurable power source. 1.8/2.85 V power domain. SGMII Signal Part SGMII_TX_M 123 AO SGMII transmission - minus SGMII_TX_P 124 AO SGMII transmission - plus SGMII_RX_P 125 SGMII receiving - plus SGMII_RX_M 126 SGMII receiving - minus AI AI Connect with a 0.1 F capacitor, and is close to the PHY side. Connect with a 0.1 F capacitor, and is close to EC25 module. The following figure shows the simplified block diagram for Ethernet application. Figure 26: Simplified Block Diagram for Ethernet Application EC25_Series_Hardware_Design 62 / 126 Module AR8033 MDI Ethernet Transformer RJ45 SGMII Control LTE Standard Module Series EC25 Series Hardware Design The following figure shows a reference design of SGMII interface with PHY AR8033 application. Figure 27: Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in customers applications, please follow the criteria below in the Ethernet PHY circuit design:

Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. Keep the maximum trace length less than 10-inch and keep skew on the differential pairs less than The differential impedance of SGMII data trace is 100 10%, and the reference ground of the area Make sure the trace spacing between SGMII RX and TX is at least 3 times of the trace width, and the 20 mil. should be complete. same to the adjacent signal traces. 3.17. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two pins which are NET_MODE and NET_STATUS. The following tables describe the pin definition and logic level changes in different network status. EC25_Series_Hardware_Design 63 / 126 R1 R2 10K 1.5K VDD_EXT USIM2_VDD AR8033 Module EPHY_INT_N EPHY_RST_N Control SGMII_MDATA SGMII_MCLK SGMII Data SGMII_RX_P SGMII_RX_M SGMII_TX_P SGMII_TX_M USIM2_VDD USIM2_VDD Close to Module C1 0.1uF C2 0.1uF 0.1uF C3 0.1uF C4 Close to AR8033 INT RSTN MDIO MDC SOP SON SIP SIN LTE Standard Module Series EC25 Series Hardware Design Table 20: Pin Definition of Network Connection Status/Activity Indicator Pin Name Pin No. I/O Description Comment NET_MODE 5 DO Indicate the modules network registration mode NET_STATUS 6 DO Indicate the modules network activity status 1.8 V power domain Cannot be pulled up before startup 1.8 V power domain Table 21: Working State of Network Connection Status/Activity Indicator Pin Name Logic Level Changes Network Status NET_MODE Always High Always Low Registered on LTE network Others Flicker slowly (200 ms High/1800 ms Low) Network searching NET_STATUS Flicker slowly (1800 ms High/200 ms Low) Idle Flicker quickly (125 ms High/125 ms Low) Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure. Figure 28: Reference Circuit of the Network Indicator EC25_Series_Hardware_Design 64 / 126 Module VBAT Network Indicator 4.7K 2.2K 47K LTE Standard Module Series EC25 Series Hardware Design 3.18. STATUS The STATUS pin is an open drain output for indicating the modules operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. Table 22: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 61 OD Indicate the modules operation status An external pull-up resistor is required. If unused, keep it open. The following figure shows different circuit designs of STATUS, and customers can choose either one according to customers application demands. Figure 29: Reference Circuits of STATUS NOTE The status pin cannot be used as indication of module shutdown status when VBAT power supply is removed. 3.19. Behaviors of RI AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. No matter on which port a URC is presented, the URC will trigger the behaviors of RI pin. EC25_Series_Hardware_Design 65 / 126 Module VDD_MCU Module VBAT 10K STATUS MCU_GPIO STATUS 2.2K LTE Standard Module Series EC25 Series Hardware Design URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. In addition, RI behavior can be configured flexibly. The default behaviors of the RI is shown as below. Table 23: Behaviors of RI Response RI keeps at high level RI outputs 120 ms low pulse when a new URC returns The RI behavior can be changed by AT+QCFG="urc/ri/ring" command. Please refer to document [2]

for details. 3.20. USB_BOOT Interface EC25 provides a USB_BOOT pin. Customers can pull up USB_BOOT to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface. Table 24: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 115 DI Force the module to enter emergency download mode 1.8 V power domain. Active high. It is recommended to reserve test points. NOTE State Idle URC EC25_Series_Hardware_Design 66 / 126 LTE Standard Module Series EC25 Series Hardware Design The following figure shows a reference circuit of USB_BOOT interface. Figure 30: Reference Circuit of USB_BOOT Interface Figure 31: Timing Sequence for Entering Emergency Download Mode NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2. When using MCU to control module to enter the emergency download mode, please follow the above timing sequence. It is not recommended to pull up USB_BOOT to 1.8 V before powering up VBAT. Connect the test points as shown in Figure 31 can manually force the module to enter download mode. EC25_Series_Hardware_Design 67 / 126 Module VDD_EXT USB_BOOT Test points 4.7K Close to test points TVS NOTE 1 VBAT 500 ms VH = 0.8 V VIL 0.5 V About 100 ms USB_BOOT can be pulled up to 1.8 V before VDD_EXT Is powered up, and the module will enter emerge ncy download mode wh en i t is powered on. PWRKEY VDD_EXT USB_BOOT RESET_N LTE Standard Module Series EC25 Series Hardware Design 4 GNSS Receiver 4.1. General Description EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, EC25 GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows the GNSS performance of the module. Table 25: GNSS Performance Parameter Description Conditions Sensitivity

(GNSS) TTFF

(GNSS) Cold start Autonomous Reacquisition Autonomous Tracking Autonomous Cold start

@ open sky Warm start

@ open sky Autonomous XTRA enabled Autonomous XTRA enabled Typ.

-146

-157

-157 35 18 26 2.2 Unit dBm dBm dBm s s s s EC25_Series_Hardware_Design 68 / 126 LTE Standard Module Series EC25 Series Hardware Design Hot start

@ open sky CEP-50 Autonomous XTRA enabled Autonomous

@ open sky 2.5 1.8

<2.5 s s m Accuracy

(GNSS) NOTES 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock positioning for at least 3 minutes continuously). within 3 minutes after loss of lock. 3. Cold start sensitivity: the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command. 4.3. Layout Guidelines The following layout guidelines should be taken into account in customers designs. Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna. Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar kept away from the antennas. isolation and protection. Keep 50 characteristic impedance for the ANT_GNSS trace. Please refer to Chapter 5 for GNSS antenna reference design and antenna installation information. EC25_Series_Hardware_Design 69 / 126 LTE Standard Module Series EC25 Series Hardware Design 5 Antenna Interfaces EC25 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna ports have an impedance of 50 . 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1. Pin Definition The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 26: Pin Definition of RF Antennas Pin Name Pin No. Description Comment ANT_MAIN Main antenna 50 impedance I/O IO 49 35 ANT_DIV AI Receive diversity antenna 50 impedance. If unused, keep it open. 5.1.2. Operating Frequency Table 27: Module Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 Transmit 824849 880915 17101785 18501910 19201980 Receive 869894 925960 18051880 19301990 21102170 Unit MHz MHz MHz MHz MHz EC25_Series_Hardware_Design 70 / 126 LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B5 824849 LTE-FDD B7 25002570 26202690 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 WCDMA B19 LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B26 LTE-FDD B28 18501910 17101755 824849 830840 880915 830845 19201980 18501910 17101785 17101755 880915 699716 777787 788798 815830 830845 832862 814 849 703748 LTE-TDD B38 25702620 LTE-TDD B40 23002400 LTE-TDD B41 25552655 LTE-FDD B66 17101780 19301990 21102155 869894 875885 925 960 875890 21102170 19301990 18051880 21102155 869894 925960 729 746 746756 758768 860875 875890 791821 859894 758803 25702620 23002400 25552655 21002200 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHZ MHz MHz MHz MHz MHz MHz MHz MHz MHz EC25_Series_Hardware_Design 71 / 126 LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B71 663698 617652 MHz 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A -type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 32: Reference Circuit of RF Antenna Interface NOTES receiving sensitivity. possible. 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the 2. ANT_DIV function is enabled by default. AT+QCFG="divctl",0 command can be used to disable receive diversity. Please refer to document [2] for details. 3. Place the -type matching components (R1 & C1 & C2, R2 & C3 & C4) as close to the antenna as 5.1.4. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled as 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, height from the reference ground to the signal layer (H), and the space between the RF trace and the ground (S). Microstrip and coplanar waveguide are typically used in RF layout to control characteristic impedance. The following figures are reference designs of microstrip or coplanar waveguide with different PCB structures. EC25_Series_Hardware_Design 72 / 126 Main Antenna Diversity Antenna Module ANT_MAIN R1 0R ANT_DIV R2 0R C1 NM C3 NM C2 NM C4 NM LTE Standard Module Series EC25 Series Hardware Design

. Figure 33: Microstrip Design on a 2-layer PCB Figure 34: Coplanar Waveguide Design on a 2-layer PCB Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EC25_Series_Hardware_Design 73 / 126 LTE Standard Module Series EC25 Series Hardware Design Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:

Please use an impedance simulation tool to control the characteristic impedance of RF traces as 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right angle traces should be changed to curved ones. There should be clearance area under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). For more details about RF layout, please refer to document [6]. 5.2. GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 28: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 47 AI GNSS antenna 50 impedance. If unused, keep it open. EC25_Series_Hardware_Design 74 / 126 LTE Standard Module Series EC25 Series Hardware Design Table 29: GNSS Frequency Type GPS Frequency 1575.42 1.023 GLONASS 1597.51605.8 Galileo 1575.42 2.046 BeiDou (Compass) 1561.098 2.046 QZSS 1575.42 A reference design of GNSS antenna is shown as below. Unit MHz MHz MHz MHz MHz Figure 37: Reference Circuit of GNSS Antenna 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. If the module is designed with a passive antenna, then the VDD circuit is not needed. NOTES EC25_Series_Hardware_Design 75 / 126 VDD 0.1 F 10R GNSS Antenna Module ANT_GNSS 47nH 100 pF 0R NM NM LTE Standard Module Series EC25 Series Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement Table 30: Antenna Requirements Type Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Frequency range: 15591609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0 dBi Active antenna noise figure: < 1.5 dB Active antenna gain: > 0 dBi Active antenna embedded LNA gain: < 17 dB VSWR: 2 Efficiency: > 30%

Max input power: 50 W Input impedance: 50 Cable insertion loss: < 1 dB

(GSM850, EGSM900, WCDMA B5/B6/B8/B19, LTE-FDD B5/B8/B12/B13/B14/B18/B19/B20/B26/B28/B71) Cable insertion loss: < 1.5 dB

(DCS1800, PCS1900, WCDMA B1/B2/B4, LTE-FDD B1/B2/B3/B4/B66) Cable insertion loss: < 2 dB

(LTE-FDD B7, LTE-TDD B38/B40/B41) 1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. GSM/WCDMA/LTE GNSS1) NOTE EC25_Series_Hardware_Design 76 / 126 LTE Standard Module Series EC25 Series Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 39: Mechanicals of U.FL-LP Connectors EC25_Series_Hardware_Design 77 / 126 LTE Standard Module Series EC25 Series Hardware Design The following figure describes the space factor of mated connector. Figure 40: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. EC25_Series_Hardware_Design 78 / 126 LTE Standard Module Series EC25 Series Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage at ADC0 Voltage at ADC1 Min.

-0.3

-0.3 0 0 0 0 Voltage at Digital Pins

-0.3 Max. Unit 4.7 5.5 0.8 1.8 2.3 VBAT_BB VBAT_BB V V A A V V V EC25_Series_Hardware_Design 79 / 126 LTE Standard Module Series EC25 Series Hardware Design 6.2. Power Supply Ratings Table 32: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum and maximum values. Voltage drop during burst transmission Maximum power control level on EGSM900. Peak supply current

(during transmission slot) USB connection detection Maximum power control level on EGSM900. 3.3 3.8 4.3 V 400 mV 1.8 2.0 A USB_VBUS 3.0 5.0 5.25 V 6.3. Operating and Storage Temperatures The operating and storage temperatures are listed in the following table. Table 33: Operating and Storage Temperatures Parameter Min. Max. Unit Operating Temperature Range1)

-35 Extended Temperature Range2)

-40 Storage Temperature Range

-40 Typ.

+25

+75

+85

+90 C C C VBAT IVBAT NOTES 1. 2. 1) Within operating temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal EC25_Series_Hardware_Design 80 / 126 LTE Standard Module Series EC25 Series Hardware Design operating temperature levels, the module will meet 3GPP specifications again.

* means under development. 3. 6.4. Current Consumption The values of current consumption are shown below. Table 34: EC25-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX = 2 (USB disconnected) GSM DRX = 9 (USB disconnected) WCDMA PF = 64 (USB disconnected) Sleep state WCDMA PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) IVBAT LTE-TDD PF = 64 (USB disconnected) Idle state WCDMA PF = 64 (USB connected) LTE-TDD PF = 128 (USB disconnected) GSM DRX = 5 (USB disconnected) GSM DRX = 5 (USB connected) WCDMA PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) LTE-TDD PF = 64 (USB disconnected) 11 1.16 2.74 2.00 2.15 1.67 2.60 1.90 2.79 2.00 19.5 29.5 21.0 31.0 20.7 30.8 20.8 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Series_Hardware_Design 81 / 126 LTE Standard Module Series EC25 Series Hardware Design GPRS data transfer

(GNSS OFF) LTE-TDD PF = 64 (USB connected) 32.0 mA EGSM900 4DL/1UL @ 33.22 dBm 271.0 mA EGSM900 3DL/2UL @ 33.0 dBm 464.0 mA EGSM900 2DL/3UL @ 30.86 dBm 524.0 mA EGSM900 1DL/4UL @ 29.58 dBm 600.0 mA DCS1800 4DL/1UL @ 29.92 dBm 192.0 mA DCS1800 3DL/2UL @ 29.84 dBm 311.0 mA DCS1800 2DL/3UL @ 29.67 dBm 424.0 mA DCS1800 1DL/4UL @ 29.48 dBm 539.0 mA EGSM900 4DL/1UL PCL = 8 @ 27.40 dBm 174.0 mA EGSM900 3DL/2UL PCL = 8 @ 27.24 dBm 281.0 mA EGSM900 2DL/3UL PCL = 8 @ 27.11 dBm 379.0 mA EDGE data transfer

(GNSS OFF) EGSM900 1DL/4UL PCL = 8 @ 26.99 dBm 480.0 mA DCS1800 4DL/1UL PCL = 2 @ 25.82 dBm 159.0 mA DCS1800 3DL/2UL PCL = 2 @ 25.85 dBm 251.0 mA DCS1800 2DL/3UL PCL = 2 @ 25.68 dBm 340.0 mA DCS1800 1DL/4UL PCL = 2 @ 25.57 dBm 433.0 mA WCDMA B1 HSDPA @ 22.47 dBm 613.0 mA WCDMA B1 HSUPA @ 22.44 dBm 609.0 mA WCDMA B5 HSDPA @ 23.07 dBm 671.0 mA WCDMA B5 HSUPA @ 23.07 dBm 669.0 mA WCDMA B8 HSDPA @ 22.67 dBm 561.0 mA WCDMA B8 HSUPA @ 22.39 dBm 557.0 mA LTE-FDD B1 @ 23.27 dBm 754.0 mA LTE-FDD B3 @ 23.54 dBm 774.0 mA WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) EC25_Series_Hardware_Design 82 / 126 LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B5 @ 22.83 dBm 762.0 mA LTE-FDD B7 @ 23.37 dBm 842.0 mA LTE-FDD B8 @ 23.48 dBm 720.0 mA LTE-FDD B20 @ 22.75 dBm 714.0 mA LTE-TDD B38 @ 23.05 dBm 481.0 mA LTE-TDD B40 @ 23.17 dBm 431.8 mA LTE-TDD B41 @ 23.02 dBm 480.0 mA GSM voice call WCDMA voice call EGSM900 PCL = 5 @ 33.08 dBm 264.0 mA DCS1800 PCL = 0 @ 29.75 dBm 190.0 mA WCDMA B1 @ 23.22 dBm 680.0 mA WCDMA B5 @ 23.18 dBm 677.0 mA WCDMA B8 @ 23.54 dBm 618.0 mA Table 35: EC25-EX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down IVBAT Sleep state DCS 698 DRX = 9 (USB disconnected) AT+CFUN=0 (USB disconnected) GSM DRX = 2 (USB disconnected) GSM DRX = 9 (USB disconnected) DCS 698 DRX = 2 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) 7 0.71 1.51 0.94 1.58 1.01 1.41 1.11 1.82 1.32 A mA mA mA mA mA mA mA mA mA EC25_Series_Hardware_Design 83 / 126 LTE Standard Module Series EC25 Series Hardware Design LTE-TDD PF = 64 (USB disconnected) LTE-TDD PF = 128 (USB disconnected) 1.95 1.39 mA mA GSM DRX = 5 (USB disconnected) 15.37 mA GSM DRX = 5 (USB connected) 24.83 mA WCDMA PF = 64 (USB disconnected) 15.68 mA Idle state WCDMA PF = 64 (USB connected) 25.02 mA LTE-FDD PF = 64 (USB disconnected) 14.71 mA LTE-FDD PF = 64 (USB connected) 23.87 mA LTE-TDD PF = 64 (USB disconnected) 14.66 mA LTE-TDD PF = 64 (USB connected) 23.97 mA EGSM900 4DL/1UL @ 32.15 dBm 216.8 mA EGSM900 3DL/2UL @ 30.88 dBm 359.1 mA EGSM900 2DL/3UL @ 29.15 dBm 451.7 mA EGSM900 1DL/4UL @ 28.7 dBm 570.3 mA DCS1800 4DL/1UL @ 28.90 dBm 152.0 mA DCS1800 3DL/2UL @28.28 dBm 262.5 mA DCS1800 2DL/3UL @26.85 dBm 357.6 mA DCS1800 1DL/4UL @ 25.74 dBm 454.1 mA EGSM900 4DL/1UL PCL = 8 @ 25.86 dBm 159.5 mA EGSM900 3DL/2UL PCL = 8 @ 24.69 dBm 270.5 mA EGSM900 2DL/3UL PCL = 8 @ 22.96 dBm 386.6 mA EGSM900 1DL/4UL PCL = 8 @ 22.26 dBm 500.1 mA DCS1800 4DL/1UL PCL = 2 @ 25.23 dBm 138.6 mA DCS1800 3DL/2UL PCL = 2 @ 24.69 dBm 245.6 mA DCS1800 2DL/3UL PCL = 2 @ 22.01 dBm 345.8 mA GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) EC25_Series_Hardware_Design 84 / 126 LTE Standard Module Series EC25 Series Hardware Design DCS1800 1DL/4UL PCL = 2 @ 21.32 dBm 444.3 mA WCDMA B1 HSDPA @ 22.08 dBm 504.0 mA WCDMA B1 HSUPA @ 21.46 dBm 498.4 mA WCDMA data transfer

(GNSS OFF) WCDMA B5 HSDPA @ 22.65 dBm 531.9 mA WCDMA B5 HSUPA @ 22.36 dBm 500.4 mA WCDMA B8 HSDPA @ 22.13 dBm 544.5 mA WCDMA B8 HSUPA @ 21.12 dBm 504.1 mA LTE-FDD B1 @ 22.38 dBm 622.8 mA LTE-FDD B3 @ 22.31 dBm 666.0 mA LTE-FDD B5 @ 22.77 dBm 549.9 mA LTE-FDD B7 @ 22.31 dBm 740.8 mA LTE-FDD B8 @ 22.69 dBm 631.5 mA LTE-FDD B20 @ 22.84dBm 741.5 mA LTE-TDD B38 @ 22.11 dBm 334.1 mA LTE-TDD B40 @ 22.33 dBm 390.2 mA LTE-TDD B41 @ 22.26dBm 367.6 mA EGSM900 PCL = 5 @ 31.79 dBm 228.1 mA DCS1800 PCL = 0 @ 28.96 dBm 166.7 mA WCDMA B1 @ 22.23 dBm 512.3 mA WCDMA B5 @ 22.88 dBm 546.3 mA WCDMA B8 @ 22.32 dBm 567.1 mA LTE data transfer

(GNSS OFF) GSM voice call WCDMA voice call Table 36: EC25-A Current Consumption Parameter Description Conditions IVBAT OFF state Power down Typ. Unit 10 A EC25_Series_Hardware_Design 85 / 126 LTE Standard Module Series EC25 Series Hardware Design AT+CFUN=0 (USB disconnected) WCDMA PF = 64 (USB disconnected) Sleep state WCDMA PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) 1.1 1.8 1.5 2.2 1.6 21.0 31.0 21.0 31.0 mA mA mA mA mA mA mA mA mA Idle state WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) WCDMA voice call WCDMA B2 HSDPA @ 21.9 dBm 591.0 mA WCDMA B2 HSUPA @ 21.62 dBm 606.0 mA WCDMA B4 HSDPA @ 22.02 dBm 524.0 mA WCDMA B4 HSUPA @ 21.67 dBm 540.0 mA WCDMA B5 HSDPA @ 22.71 dBm 490.0 mA WCDMA B5 HSUPA @ 22.58 dBm 520.0 mA LTE-FDD B2 @ 22.93 dBm 715.0 mA LTE-FDD B4 @ 22.96 dBm 738.0 mA LTE-FDD B12 @ 23.35 dBm 663.0 mA WCDMA B2 @ 22.93 dBm 646.0 mA WCDMA B4 @ 23 dBm 572.0 mA WCDMA B5 @ 23.78 dBm 549.0 mA Table 37: EC25-V Current Consumption Parameter Description Conditions IVBAT OFF state Power down Typ. Unit 10 A EC25_Series_Hardware_Design 86 / 126 LTE Standard Module Series EC25 Series Hardware Design AT+CFUN=0 (USB disconnected) Sleep state LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) Idle state LTE data transfer

(GNSS OFF) LTE-FDD B4 @ 23.14 dBm 770.0 mA LTE-FDD B13 @ 23.48 dBm 531.0 mA Table 38: EC25-J Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 128 (USB disconnected) Sleep state LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) LTE-TDD PF = 64 (USB disconnected) IVBAT LTE-TDD PF = 128 (USB disconnected) Idle state WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) LTE-TDD PF = 64 (USB disconnected) LTE-TDD PF = 64 (USB connected) WCDMA data WCDMA B1 HSDPA @ 22.32 dBm 549.0 mA EC25_Series_Hardware_Design 87 / 126 0.85 2.0 1.5 20.0 31.0 10 1.1 1.9 1.5 2.5 1.8 2.6 1.9 21.0 31.0 21.0 32.0 21.0 32.0 mA mA mA mA mA A mA mA mA mA mA mA mA mA mA mA mA mA mA LTE Standard Module Series EC25 Series Hardware Design transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) WCDMA B1 HSUPA @ 21.79 dBm 533.0 mA WCDMA B6 HSDPA @ 22.64 dBm 515.0 mA WCDMA B6 HSUPA @ 22.33 dBm 520.0 mA WCDMA B19 HSDPA @ 22.67 dBm 516.0 mA WCDMA B19 HSUPA @ 22.33 dBm 521.0 mA LTE-FDD B1 @ 23.16 dBm 685.0 mA LTE-FDD B3 @ 23.22 dBm 765.0 mA LTE-FDD B8 @ 23.22 dBm 640.0 mA LTE-FDD B18 @ 23.35 dBm 660.0 mA LTE-FDD B19 @ 23.16 dBm 676.0 mA LTE-FDD B26 @ 22.87 dBm 689.0 mA LTE-TDD B41 @ 22.52 dBm 438.0 mA WCDMA B1 @ 23.33 dBm 604.0 mA WCDMA voice call WCDMA B6 @ 23.28 dBm 548.0 mA WCDMA B19 @ 23.28 dBm 548.0 mA Table 39: EC25-AU Current Consumption OFF state Power down AT+CFUN=0 Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) 1.46 mA IVBAT GSM850 DRX = 5 (USB disconnected) Sleep state EGSM900 DRX = 5 (USB disconnected) DCS1800 DRX = 5 (USB disconnected) PCS1900 DRX = 5 (USB disconnected) 11 1.3 1.8 2.0 1.9 1.9 A mA mA mA mA mA EC25_Series_Hardware_Design 88 / 126 LTE Standard Module Series EC25 Series Hardware Design WCDMA PF = 64 (USB disconnected) WCDMA PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) LTE-TDD PF = 64 (USB disconnected) LTE-TDD PF = 128 (USB disconnected) 2.0 1.6 2.2 1.6 2.3 1.6 mA mA mA mA mA mA EGSM900 DRX = 5 (USB disconnected) 22.0 mA EGSM900 DRX = 5 (USB connected) 34.0 mA WCDMA PF = 64 (USB disconnected) 22.0 mA WCDMA PF = 64 (USB connected) 33.0 mA LTE-FDD PF = 64 (USB disconnected) 24.0 mA LTE-FDD PF = 64 (USB connected) 35.0 mA GSM850 1UL/4DL @ 32.53 dBm 232.0 mA GSM850 2UL/3DL @ 32.34 dBm 384.0 mA GSM850 3UL/2DL @ 30.28 dBm 441.0 mA GSM850 4UL/1DL @ 29.09 dBm 511.0 mA EGSM900 1UL/4DL @ 32.34 dBm 241.0 mA EGSM900 2UL/3DL @ 32.19 dBm 397.0 mA EGSM900 3UL/2DL @ 30.17 dBm 459.0 mA EGSM900 4UL/1DL @ 28.96 dBm 533.0 mA DCS1800 1UL/4DL @ 29.71 dBm 183.0 mA DCS1800 2UL/3DL @ 29.62 dBm 289.0 mA DCS1800 3UL/2DL @ 29.49 dBm 392.0 mA DCS1800 4UL/1DL @ 29.32 dBm 495.0 mA PCS1900 1UL/4DL @ 29.61 dBm 174.0 mA Idle state GPRS data transfer

(GNSS OFF) EC25_Series_Hardware_Design 89 / 126 LTE Standard Module Series EC25 Series Hardware Design PCS1900 2UL/3DL @ 29.48 dBm 273.0 mA PCS1900 3UL/2DL @ 29.32 dBm 367.0 mA PCS1900 4UL/1DL @ 29.19 dBm 465.0 mA GSM850 1UL/4DL @ 27.09 dBm 154.0 mA GSM850 2UL/3DL @ 26.94 dBm 245.0 mA GSM850 3UL/2DL @ 26.64 dBm 328.0 mA GSM850 4UL/1DL @ 26.53 dBm 416.0 mA EGSM900 1UL/4DL @ 26.64 dBm 157.0 mA EGSM900 2UL/3DL @ 26.95 dBm 251.0 mA EGSM900 3UL/2DL @ 26.57 dBm 340.0 mA EGSM900 4UL/1DL @ 26.39 dBm 431.0 mA DCS1800 1UL/4DL @ 26.03 dBm 152.0 mA DCS1800 2UL/3DL @ 25.62 dBm 240.0 mA DCS1800 3UL/2DL @ 25.42 dBm 325.0 mA DCS1800 4UL/1DL @ 25.21 dBm 415.0 mA PCS1900 1UL/4DL @ 25.65 dBm 148.0 mA PCS1900 2UL/3DL @ 25.63 dBm 232.0 mA PCS1900 3UL/2DL @ 25.54 dBm 313.0 mA PCS1900 4UL/1DL @ 25.26 dBm 401.0 mA WCDMA B1 HSDPA @ 22.34 dBm 625.0 mA WCDMA B1 HSUPA @ 21.75 dBm 617.0 mA EDGE data transfer

(GNSS OFF) WCDMA data transfer

(GNSS OFF) WCDMA B2 HSDPA @ 22.51 dBm 610.0 mA WCDMA B2 HSUPA @ 22. 14 dBm 594.0 mA WCDMA B5 HSDPA @ 22.98 dBm 576.0 mA WCDMA B5 HSUPA @ 22.89 dBm 589.0 mA EC25_Series_Hardware_Design 90 / 126 LTE Standard Module Series EC25 Series Hardware Design WCDMA B8 HSDPA @ 22.31 dBm 556.0 mA WCDMA B8 HSUPA @ 22.11 dBm 572.0 mA LTE-FDD B1 @ 23.28 dBm 817.0 mA LTE-FDD B2 @ 23.34 dBm 803.0 mA LTE-FDD B3 @ 23.2 dBm LTE-FDD B4 @ 22.9 dBm 785.0 mA 774.0 mA LTE-FDD B5 @ 23.45 dBm 687.0 mA LTE-FDD B7 @ 22.84 dBm 843.0 mA LTE data transfer

(GNSS OFF) GSM voice call WCDMA voice call LTE-FDD B8 @ 22.92 dBm LTE-FDD B28 @ 23.23 dBm LTE-TDD B40 @ 23.3 dBm GSM850 PCL5 @ 32.66 dBm DCS1800 PCL0 @ 29.72 dBm PCS1900 PCL0 @ 29.82 dBm WCDMA B1 @ 23.27 dBm WCDMA B2 @ 23.38 dBm WCDMA B5 @ 23.38 dBm WCDMA B8 @ 23.32 dBm 689.0 mA 804.0 mA 429.0 mA 228.0 mA 178.0 mA 170.0 mA 687.0 mA 668.0 mA 592.0 mA 595.0 mA EGSM900 PCL5 @ 32.59 dBm 235.0 mA IVBAT Table 40: EC25-AUT Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) Sleep state WCDMA PF = 64 (USB disconnected) WCDMA PF = 128 (USB disconnected) 10 1.0 1.9 1.5 A mA mA mA EC25_Series_Hardware_Design 91 / 126 LTE Standard Module Series EC25 Series Hardware Design Idle state WCDMA data transfer

(GNSS OFF) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) 2.3 1.9 23.0 33.0 17.0 29.0 mA mA mA mA mA mA WCDMA B1 HSDPA @ 22.24 dBm 500.0 mA WCDMA B1 HSUPA @ 22.05 dBm 499.0 mA WCDMA B5 HSDPA @ 22.39 dBm 418.0 mA WCDMA B5 HSUPA @ 22 dBm 486.0 mA LTE-FDD B1 @ 23.28 dBm 707.0 mA LTE-FDD B3 @ 23.36 dBm 782.0 mA LTE data transfer

(GNSS OFF) LTE-FDD B5 @ 23.32 dBm 588.0 mA LTE-FDD B7 @ 23.08 dBm 692.0 mA LTE-FDD B28A @ 23.37 dBm 752.0 mA LTE-FDD B28B @ 23.48 dBm 770.0 mA WCDMA B1 @ 23.22 dBm 546.0 mA WCDMA B5 @ 23.01 dBm 511.0 mA WCDMA voice call IVBAT Table 41: EC25-AF Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) Sleep state WCDMA PF = 64 (USB disconnected) WCDMA PF = 128 (USB disconnected) 10 1.0 1.8 1.4 A mA mA mA EC25_Series_Hardware_Design 92 / 126 LTE Standard Module Series EC25 Series Hardware Design Idle state WCDMA data transfer

(GNSS OFF) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) WCDMA B2 HSDPA @ 22.63 dBm WCDMA B2 HSUPA @ 22.49 dBm WCDMA B4 HSDPA @ 22.45 dBm WCDMA B4 HSUPA @ 22.57 dBm WCDMA B5 HSDPA @ 22.49 dBm WCDMA B5 HSUPA @ 22.43 dBm LTE-FDD B2 @ 22.92 dBm LTE-FDD B4 @ 23.12 dBm LTE-FDD B5 @ 22.98 dBm LTE data transfer

(GNSS OFF) LTE-FDD B12 @ 23.42 dBm LTE-FDD B13 @ 22.92 dBm LTE-FDD B14 @ 23.42 dBm LTE-FDD B66 @ 23.35 dBm LTE-FDD B71 @ 23.39 dBm WCDMA B2 @ 23.59 dBm WCDMA B4 @ 23.47 dBm WCDMA B5 @ 23.46 dBm WCDMA voice call 2.2 1.8 23.3 33.4 17.6 29.4 560.0 564.0 601.0 610.0 603.0 617.0 698.0 710.0 650.0 648.0 690.0 685.0 715.0 689.0 585.0 610.0 605.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Series_Hardware_Design 93 / 126 LTE Standard Module Series EC25 Series Hardware Design Table 42: EC25-AFX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down Sleep state WCDMA PF = 512 (USB disconnected) AT+CFUN=0 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 128 (USB disconnected) WCDMA PF = 256 (USB disconnected) LTE-FDD PF = 32 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) LTE-FDD PF = 256 (USB disconnected) WCDMA PF = 64 (USB disconnected) IVBAT WCDMA PF = 64 (USB connected) Idle state LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) 8 0.83 1.55 1.24 1.07 1.00 2.97 1.93 1.43 1.17 14.9 34.2 15.2 34.8 A mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA B2 HSDPA @ 22.1 dBm 548.0 mA WCDMA B2 HSUPA @ 22.28 dBm 545.0 mA WCDMA B4 HSDPA @ 22.2 dBm 580.0 mA WCDMA B4 HSUPA @ 22.2 dBm 596.0 mA WCDMA B5 HSDPA @ 22.1 dBm 498.0 mA WCDMA B5 HSUPA @ 22.0 dBm 500.0 mA LTE-FDD B2 @ 23.36 dBm 621.0 mA LTE-FDD B4 @ 22.7 dBm 702.0 mA LTE-FDD B5 @ 22.7 dBm 564.0 mA WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) EC25_Series_Hardware_Design 94 / 126 LTE Standard Module Series EC25 Series Hardware Design WCDMA voice call Table 43: EC25-EU Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down LTE-FDD B12 @ 22.66 dBm 648.0 mA LTE-FDD B13 @ 22.79 dBm 617.0 mA LTE-FDD B14 @ 22.72 dBm 622.0 mA LTE-FDD B66 @ 22.86 dBm 698.0 mA LTE-FDD B71 @ 22.73 dBm 628.0 mA WCDMA B2 @ 22.63 dBm 578.0 mA WCDMA B4 @ 22.74 dBm 581.0 mA WCDMA B5 @ 22.6 dBm 561.0 mA AT+CFUN=0 (USB disconnected) GSM DRX = 2 (USB disconnected) GSM DRX = 9 (USB disconnected) WCDMA PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) LTE-TDD PF = 64 (USB disconnected) LTE-TDD PF = 128 (USB disconnected) GSM DRX = 5 (USB disconnected) GSM DRX = 5 (USB connected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) 11 1.16 2.74 2.0 2.15 1.67 2.60 1.90 2.79 2.00 19.5 29.5 21.0 31.0 A mA mA mA mA mA mA mA mA mA mA mA mA mA Sleep state WCDMA PF = 128 (USB disconnected) IVBAT Idle state EC25_Series_Hardware_Design 95 / 126 LTE Standard Module Series EC25 Series Hardware Design GPRS data transfer

(GNSS OFF) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) LTE-TDD PF = 64 (USB disconnected) LTE-TDD PF = 64 (USB connected) 20.7 30.8 20.8 32.0 mA mA mA mA EGSM900 4DL/1UL @ 33.23 dBm 243.0 mA EGSM900 3DL/2UL @ 31.96 dBm 388.0 mA EGSM900 2DL/3UL @ 29.73 dBm 453.0 mA EGSM900 1DL/4UL @ 28.5 dBm 522 mA DCS1800 4DL/1UL @ 30.49 dBm 172.0 mA DCS1800 3DL/2UL @ 29.24 dBm 274.0 mA DCS1800 2DL/3UL @ 27.15 dBm 337.0 mA DCS1800 1DL/4UL @ 25.88 dBm 406.0 mA EGSM900 4DL/1UL PCL = 8 @ 26.60 dBm 142.0 mA EGSM900 3DL/2UL PCL = 8 @ 25.43 dBm 229.0 mA EGSM900 2DL/3UL PCL = 8 @ 23.4 dBm 286.0 mA EDGE data transfer

(GNSS OFF) EGSM900 1DL/4UL PCL = 8 @ 22.36 dBm 348.0 mA DCS1800 4DL/1UL PCL = 2 @ 25.59 dBm 136.0 mA DCS1800 3DL/2UL PCL = 2 @ 24.54 dBm 225.0 mA DCS1800 2DL/3UL PCL = 2 @ 22.38 dBm 300.0 mA DCS1800 1DL/4UL PCL = 2 @ 21.24 dBm 379.0 mA WCDMA B1 HSDPA @ 22.93 dBm 504.0 mA WCDMA data transfer

(GNSS OFF) WCDMA B1 HSUPA @ 22.62 dBm 512.0 mA WCDMA B8 HSDPA @ 22.88 dBm 562.0 mA WCDMA B8 HSUPA @ 22.14 dBm 535.0 mA LTE data LTE-FDD B1 @ 23.6 dBm 664.0 mA EC25_Series_Hardware_Design 96 / 126 LTE Standard Module Series EC25 Series Hardware Design transfer

(GNSS OFF) LTE-FDD B3 @ 23.67 dBm 728.0 mA LTE-FDD B7 @ 23.83 dBm 821.0 mA LTE-FDD B8 @ 23.82 dBm 695.0 mA LTE-FDD B20 @ 23.88 dBm 649.0 mA LTE-FDD B28A @ 23.43 dBm 689.0 mA LTE-TDD B38 @ 22.82 dBm 438.0 mA LTE-TDD B40 @ 23.43 dBm 355.0 mA LTE-TDD B41 @ 23.46 dBm 451.0 mA GSM voice call WCDMA voice call EGSM900 PCL = 5 @ 33.25 dBm 258.0 mA DCS1800 PCL = 0 @ 30.23 dBm 178.0 mA WCDMA B1 @ 23.88 dBm 548.0 mA WCDMA B8 @ 23.8 dBm 615.0 mA Table 44: EC25-EUX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down IVBAT Sleep state WCDMA PF = 128 (USB disconnected) AT+CFUN=0 (USB disconnected) GSM DRX = 2 (USB disconnected) GSM DRX = 9 (USB disconnected) WCDMA PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) LTE-TDD PF = 64 (USB disconnected) LTE-TDD PF = 128 (USB disconnected) 9 0.9 1.8 1.3 1.6 1.3 2.2 1.6 2.2 1.6 A mA mA mA mA mA mA mA mA mA EC25_Series_Hardware_Design 97 / 126 LTE Standard Module Series EC25 Series Hardware Design Idle state GPRS data transfer

(GNSS OFF) GSM DRX = 5 (USB disconnected) GSM DRX = 5 (USB connected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) LTE-TDD PF = 64 (USB disconnected) LTE-TDD PF = 64 (USB connected) 14.5 34.3 14.7 35.3 15.0 36.5 15.0 36.5 mA mA mA mA mA mA mA mA EGSM900 4DL/1UL @ 33.02 dBm 270.7 mA EGSM900 3DL/2UL @ 32.24 dBm 444.3 mA EGSM900 2DL/3UL @ 30.08 dBm 509.8 mA EGSM900 1DL/4UL @ 29.50 dBm 629.3 mA DCS1800 4DL/1UL @ 29.63 dBm 157.4 mA DCS1800 3DL/2UL @ 28.96 dBm 246.3 mA DCS1800 2DL/3UL @ 27.49 dBm 310.6 mA DCS1800 1DL/4UL @ 26.44 dBm 377.7 mA EGSM900 4DL/1UL PCL = 8 @ 27.27 dBm 175.4 mA EGSM900 3DL/2UL PCL = 8 @ 26.13 dBm 292.1 mA EGSM900 2DL/3UL PCL = 8 @ 24.03 dBm 386.8 mA EDGE data transfer

(GNSS OFF) EGSM900 1DL/4UL PCL = 8 @ 23.35 dBm 494.7 mA DCS1800 4DL/1UL PCL = 2 @ 25.92 dBm 134.5 mA DCS1800 3DL/2UL PCL = 2 @ 25.63 dBm 222.9 mA DCS1800 2DL/3UL PCL = 2 @ 23.14 dBm 301.2 mA DCS1800 1DL/4UL PCL = 2 @ 22.60 dBm 391.8 mA WCDMA data WCDMA B1 HSDPA @ 22.01 dBm 534.8 mA EC25_Series_Hardware_Design 98 / 126 LTE Standard Module Series EC25 Series Hardware Design transfer

(GNSS OFF) WCDMA B1 HSUPA @ 21.38 dBm 526.7 mA WCDMA B8 HSDPA @ 22.21 dBm 459.8 mA WCDMA B8 HSUPA @ 21.85 dBm 471.6 mA LTE-FDD B1 @ 23.38 dBm 743.4 mA LTE-FDD B3 @ 22.87 dBm 674.6 mA LTE-FDD B7 @ 22.08 dBm 658.8 mA LTE-FDD B8 @ 23.49 dBm 607.3 mA LTE-FDD B20 @ 23.01 dBm 711.0 mA LTE-FDD B28A @ 23.18 dBm 788.2 mA LTE-TDD B38 @ 23.38 dBm 446.6 mA LTE-TDD B40 @ 23.56 dBm 344.4 mA LTE-TDD B41 @ 23.17 dBm 483.2 mA EGSM900 PCL = 5 @ 32.81 dBm 262.2 mA DCS1800 PCL = 0 @ 29.62 dBm 151.2 mA WCDMA B1 @ 23.09 dBm 594.2 mA WCDMA B8 @ 23.18 dBm 504.3 mA LTE data transfer

(GNSS OFF) GSM voice call WCDMA voice call Table 45: EC25-MX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF = 64 (USB disconnected) Sleep state WCDMA PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) 19 1.0 2.3 1.7 2.5 2.2 A mA mA mA mA mA EC25_Series_Hardware_Design 99 / 126 LTE Standard Module Series EC25 Series Hardware Design IVBAT Idle state WCDMA data transfer

(GNSS OFF) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) 12.9 32.0 13.7 32.6 mA mA mA mA WCDMA B2 HSDPA @ 22.27 dBm 581.9 mA WCDMA B2 HSUPA @ 22.15 dBm 603.0 mA WCDMA B4 HSDPA @ 22.5 dBm 578.0 mA WCDMA B4 HSUPA @ 22.5 dBm 571.0 mA WCDMA B5 HSDPA @ 22.4 dBm 499.0 mA WCDMA B5 HSUPA @ 22.17 dBm 515.0 mA LTE-FDD B2 @ 23.2 dBm 685.0 mA LTE-FDD B4 @ 23.4 dBm 744.0 mA LTE data transfer

(GNSS OFF) LTE-FDD B5 @ 23.2 dBm 578.0 mA LTE-FDD B7 @ 24.3 dBm 868.0 mA LTE-FDD B28 @ 23.45 dBm 631.0 mA LTE-FDD B66 @ 22.68 dBm 781.0 mA WCDMA B2 @ 23.47 dBm 643.0 mA WCDMA voice call WCDMA B4 @ 23.5 dBm WCDMA B5 @ 23.5 dBm 633.0 mA 551.0 mA Table 46: EC25-AUX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down IVBAT AT+CFUN=0 (USB disconnected) Sleep state GSM DRX = 2 (USB disconnected) 9 0.9 2.4 A mA mA EC25_Series_Hardware_Design 100 / 126 LTE Standard Module Series EC25 Series Hardware Design Idle state GPRS data transfer

(GNSS OFF) GSM850 4DL/1UL @ 32.48 dBm 240.1 mA LTE-FDD PF = 128 (USB disconnected) LTE-TDD PF = 64 (USB disconnected) GSM DRX = 5 (USB disconnected) GSM DRX = 5 (USB connected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) LTE-TDD PF = 64 (USB disconnected) LTE-TDD PF = 64 (USB connected) GSM850 3DL/2UL @ 31.59 dBm GSM850 2DL/3UL @ 29.51 dBm GSM850 1DL/4UL @ 28.41 dBm EGSM900 4DL/1UL @ 33.27 dBm EGSM900 3DL/2UL @ 31.99 dBm EGSM900 2DL/3UL @ 29.67 dBm EGSM900 1DL/4UL @ 28.44 dBm DCS1800 4DL/1UL @ 29.44 dBm DCS1800 3DL/2UL @ 28.47 dBm DCS1800 2DL/3UL @ 26.29 dBm DCS1800 1DL/4UL @ 25.26 dBm PCS1900 4DL/1UL @ 29.44 dBm PCS1900 3DL/2UL @ 28.59 dBm PCS1900 2DL/3UL @ 26.51 dBm 2.5 3.4 16.9 34.5 17.9 35.2 18.3 35.1 18.4 35.1 384.8 452.1 542.1 272.7 406.9 470.2 547.1 164.5 235.7 292.2 363.8 162.9 246.8 300.6 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Series_Hardware_Design 101 / 126 LTE Standard Module Series EC25 Series Hardware Design PCS1900 1DL/4UL @ 25.34 dBm GSM850 4DL/1UL @ 26.94 dBm GSM850 3DL/2UL @ 25.90 dBm GSM850 2DL/3UL @ 23.70 dBm GSM850 1DL/4UL @ 22.47 dBm EGSM900 4DL/1UL @ 27.18 dBm EGSM900 3DL/2UL @ 26.03 dBm EGSM900 2DL/3UL @ 23.97 dBm EGSM900 1DL/4UL @ 22.68 dBm DCS1800 4DL/1UL @ 26.01 dBm DCS1800 3DL/2UL @ 25.02 dBm DCS1800 2DL/3UL @ 23.04 dBm DCS1800 1DL/4UL @ 22.11 dBm PCS1900 4DL/1UL @ 26.24 dBm PCS1900 3DL/2UL @ 25.46 dBm PCS1900 2DL/3UL @ 23.45 dBm PCS1900 1DL/4UL @ 22.38 dBm WCDMA B1 HSDPA @ 22.60 dBm WCDMA B1 HSUPA @ 22.48 dBm WCDMA B2 HSDPA @ 21.60 dBm WCDMA B2 HSUPA @ 22.06 dBm WCDMA B4 HSDPA @ 22.97 dBm WCDMA B4 HSUPA @ 23.20 dBm WCDMA B5 HSDPA @ 22.63 dBm WCDMA B5 HSUPA @ 22.98 dBm EDGE data transfer

(GNSS OFF) WCDMA data transfer

(GNSS OFF) 370.5 177.5 290.8 394.0 504.5 176.6 289.6 390.7 502.1 141.0 227.5 316.3 411.0 143.3 231.4 316.1 411.0 534.6 541.3 572.9 560.0 495.8 512.4 493.1 504.7 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC25_Series_Hardware_Design 102 / 126 LTE Standard Module Series EC25 Series Hardware Design WCDMA B8 HSDPA @ 22.46 dBm WCDMA B8 HSUPA @ 21.89 dBm LTE-FDD B1 @ 22.91 dBm LTE-FDD B2 @ 22.85 dBm LTE-FDD B3 @ 23.12 dBm LTE-FDD B4 @ 22.52 dBm LTE-FDD B5 @ 23.12 dBm LTE-FDD B7 @ 22.95 dBm LTE-FDD B8 @ 23.55 dBm LTE-FDD B28 @ 23.23 dBm LTE-TDD B40 @ 23.54 dBm GSM850 PCL5 @ 32.36 dBm EGSM900 PCL5 @ 33.15 dBm DCS1800 PCL0 @ 29.38 dBm PCS1900 PCL0 @ 29.47 dBm WCDMA B1 @ 23.13 dBm WCDMA B2 @ 22.99 dBm WCDMA B4 @ 22.90 dBm WCDMA B5 @ 23.10 dBm WCDMA B8 @ 22.90 dBm LTE data transfer

(GNSS OFF) GSM voice call WCDMA voice call 545.5 541.1 713.5 713.4 675.7 607.8 563.1 702.9 728.8 769.3 335.5 240.3 260.9 153.0 160.3 568.9 628.4 506.3 507.5 581.5 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA IVBAT Table 47: EC25-T Current Consumption Parameter Description Conditions OFF state Power down Sleep state AT+CFUN=0 (USB disconnected) Typ. Unit 7 0.79 A mA EC25_Series_Hardware_Design 103 / 126 LTE Standard Module Series EC25 Series Hardware Design AT+CFUN=0 (USB Suspend) AT+CFUN=4 (USB disconnected) AT+CFUN=4 (USB Suspend) LTE-FDD PF = 32 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB Suspend) LTE-FDD PF = 128 (USB disconnected) LTE-FDD PF = 256 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB active) LTE-FDD B2 @ 23.23 dBm LTE-FDD B4@ 23.67 dBm LTE-FDD B5 @ 23.39 dBm LTE-FDD B12 @ 23.55 dBm LTE-FDD B66 @ 22.94 dBm LTE-FDD B71 @ 23.03 dBm Idle state LTE data transfer

(GNSS OFF) Table 48: GNSS Current Consumption of EC25 Series Module Parameter Description Conditions Typ. Unit Searching

(AT+CFUN=0) Cold start @ Passive Antenna Lost state @ Passive Antenna IVBAT

(GNSS) Tracking

(AT+CFUN=0) Instrument Environment Open Sky @ Passive Antenna Open Sky @ Active Antenna EC25_Series_Hardware_Design 104 / 126 1.01 0.88 1.09 3.05 2.11 2.17 1.68 1.13 18.71 27.74 683.1 725.0 582.8 667.2 729.6 712.2 54.0 53.9 30.5 33.2 40.8 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE Standard Module Series EC25 Series Hardware Design 6.5. RF Output Power The following table shows the RF output power of EC25 series module. Table 49: RF Output Power Frequency Max. Output Power Min. Output Power GSM850/EGSM900 33 dBm 2 dB 5 dBm 5 dB DCS1800/PCS1900 30 dBm 2 dB 0 dBm 5 dB GSM850/EGSM900 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB DCS1800/PCS1900 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB WCDMA bands 24 dBm + 1/-3 dB

< -49 dBm LTE-FDD bands 23 dBm 2 dB

< -39 dBm LTE-TDD bands 23 dBm 2 dB

< -39 dBm NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EC25 series module. Table 50: EC25-E Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-109.0 dBm DCS1800

-109.0 dBm WCDMA B1

-110.5 dBm

-102.0 dBm

-102.0dbm

-106.7 dBm EC25_Series_Hardware_Design 105 / 126 LTE Standard Module Series EC25 Series Hardware Design

WCDMA B5

-110.5 dBm WCDMA B8

-110.5 dBm

-104.7 dBm

-103.7 dBm LTE-FDD B1 (10 MHz)

-98.0 dBm

-98.0 dBm

-101.5 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-96.5 dBm

-98.5 dBm

-101.5 dBm

-93.3 dBm LTE-FDD B5 (10 MHz)

-98.0 dBm

-98.5 dBm

-101.0 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97.0 dBm

-97.0 dBm

-99.5 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-97.0 dBm

-97.0 dBm

-101.0 dBm

-93.3 dBm LTE-FDD B20 (10 MHz)

-97.5 dBm

-99.0 dBm

-102.5 dBm

-93.3 dBm LTE-TDD B38 (10 MHz)

-95 dBm

-97.0 dBm

-98.9 dBm

-96.3 dBm LTE-TDD B40 (10 MHz)

-96.3 dBm

-98.0 dBm

-101.0 dBm

-96.3 dBm LTE-TDD B41 (10 MHz)

-94.5 dBm

-97.0 dBm

-98.5 dBm

-94.3 dBm Table 51: EC25-A Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-110.0 dBm WCDMA B4

-110.0 dBm WCDMA B5

-110.5 dBm

-104.7 dBm

-106.7 dBm

-104.7 dBm LTE-FDD B2 (10 MHz)

-98.0 dBm

-98.0 dBm

-101.0 dBm

-94.3 dBm LTE-FDD B4 (10 MHz)

-97.5 dBm

-99.0 dBm

-101.0 dBm

-96.3 dBm LTE-FDD B12 (10 MHz)

-97.2 dBm

-98.0 dBm

-101.0 dBm

-93.3 dBm Table 52: EC25-V Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B4 (10 MHz)

-97.5 dBm

-99.0 dBm

-101.0 dBm

-96.3 dBm LTE-FDD B13 (10 MHz)

-97.7 dBm

-97.0 dBm

-100.0 dBm

-93.3 dBm EC25_Series_Hardware_Design 106 / 126 LTE Standard Module Series EC25 Series Hardware Design Table 53: EC25-J Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B1

-110.0 dBm

-110.5 dBm

-111.0 dBm

-106.7 dBm WCDMA B6

-110.5 dBm

-110.5 dBm

-111.0 dBm

-106.7 dBm WCDMA B8

-110.5 dBm

-111.0 dBm

-111.0 dBm

-103.7 dBm WCDMA B19

-110.5 dBm

-110.5 dBm

-111.0 dBm

-106.7 dBm LTE-FDD B1 (10 MHz)

-97.5 dBm

-98.7 dBm

-100.2 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-96.5 dBm

-97.1 dBm

-100.5 dBm

-93.3 dBm LTE-FDD B8 (10 MHz)

-98.4 dBm

-99.0 dBm

-101.2 dBm

-93.3 dBm LTE-FDD B18 (10 MHz)

-99.5 dBm

-99.0 dBm

-101.7 dBm

-96.3 dBm LTE-FDD B19 (10 MHz)

-99.2 dBm

-99.0 dBm

-101.4 dBm

-96.3 dBm LTE-FDD B26 (10 MHz)

-99.5 dBm

-99.0 dBm

-101.5 dBm

-93.8 dBm LTE-TDD B41 (10 MHz)

-95.0 dBm

-95.7 dBm

-99.0 dBm

-94.3 dBm Table 54: EC25-AU Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) GSM850

-109.0 dBm EGSM900

-109.0 dBm DCS1800 PCS1900

-109.0 dBm

-109.0 dBm

WCDMA B1

-110.0 dBm

-109 dBm

-112 dBm

-106.7 dBm WCDMA B2

-110.0 dBm

-104.7 dBm WCDMA B5

-111.0 dBm

-112 dBm

-113 dBm

-104.7 dBm WCDMA B8

-111.0 dBm

-111 dBm

-113 dBm

-103.7 dBm

-102.0 dBm

-102.0 dBm

-102.0 dBm

-102.0 dBm EC25_Series_Hardware_Design 107 / 126 LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B1 (10 MHz)

-97.2 dBm

-97.5 dBm

-100.2 dBm

-96.3 dBm LTE-FDD B2 (10 MHz)

-98.2 dBm

-94.3 dBm LTE-FDD B3 (10 MHz)

-98.7 dBm

-98.6 dBm

-102.2 dBm

-93.3 dBm LTE-FDD B4 (10 MHz)

-97.7 dBm

-97.4 dBm

-100.2 dBm

-96.3 dBm LTE-FDD B5 (10 MHz)

-98.0 dBm

-98.2 dBm

-101.0 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97.7 dBm

-97.7 dBm

-101.2 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-99.2 dBm

-98.2 dBm

-102.2 dBm

-93.3 dBm LTE-FDD B28 (10 MHz)

-98.6 dBm

-98.7 dBm

-102.0 dBm

-94.8 dBm LTE-TDD B40 (10 MHz)

-97.2 dBm

-98.4 dBm

-101.2 dBm

-96.3 dBm Table 55: EC25-AUT Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B1

-110.0 dBm WCDMA B5

-110.5 dBm

-106.7 dBm

-104.7 dBm LTE-FDD B1 (10 MHz)

-98.5 dBm

-98.0 dBm

-101.0 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-98.0 dBm

-97.0 dBm

-100.0 dBm

-93.3 dBm LTE-FDD B5 (10 MHz)

-98.0 dBm

-99.0 dBm

-102.5 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97.0 dBm

-97.0 dBm

-98.5 dBm

-94.3 dBm LTE-FDD B28 (10 MHz)

-97.0 dBm

-99.0 dBm

-102.0 dBm

-94.8 dBm Table 56: EC25-AUTL Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B3 (10 MHz)

-98.0 dBm

-97.0 dBm

-100.0 dBm

-93.3 dBm LTE-FDD B7 (10 MHz)

-97.0 dBm

-97.0 dBm

-98.5 dBm

-94.3 dBm LTE-FDD B28 (10 MHz)

-97.0 dBm

-99.0 dBm

-102.0 dBm

-94.8 dBm EC25_Series_Hardware_Design 108 / 126 LTE Standard Module Series EC25 Series Hardware Design Table 57: EC25-AF Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-109.5 dBm

-110 dBm

-110.4 dBm

-104.7 dBm WCDMA B4

-109.6 dBm

-110 dBm

-110.6 dBm

-106.7 dBm WCDMA B5

-110 dBm

-110 dBm

-110.7 dBm

-104.7 dBm LTE-FDD B2 (10 MHz)

-98.0 dBm

-98.5 dBm

-100.5 dBm

-94.3 dBm LTE-FDD B4 (10 MHz)

-97.5 dBm

-98.2 dBm

-99.5 dBm

-96.3 dBm LTE-FDD B5 (10 MHz)

-98.0 dBm

-98.5 dBm

-100.5 dBm

-94.3 dBm LTE-FDD B12 (10 MHz)

-99.0 dBm

-99.5 dBm

-100.5 dBm

-93.3 dBm LTE-FDD B13 (10 MHz)

-98.5 dBm

-99.5 dBm

-100.7 dBm

-93.3 dBm LTE-FDD B14 (10 MHz)

-99.4 dBm

-99.5 dBm

-100.9 dBm

-93.3 dBm LTE-FDD B66 (10 MHz)

-97.5 dBm

-98.5 dBm

-99.6 dBm

-95.8 dBm LTE-FDD B71 (10 MHz)

-98.6 dBm

-99.5 dBm

-100 dBm

-93.5 dBm Table 58: EC25-AFX Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-109.5 dBm

-110 dBm

-110.4 dBm

-104.7 dBm WCDMA B4

-109.6 dBm

-110 dBm

-110.6 dBm

-106.7 dBm WCDMA B5

-110 dBm

-110 dBm

-110.7 dBm

-104.7 dBm LTE-FDD B2 (10 MHz)

-98.0 dBm

-98.5 dBm

-100.5 dBm

-94.3 dBm LTE-FDD B4 (10 MHz)

-97.5 dBm

-98.2 dBm

-99.5 dBm

-96.3 dBm LTE-FDD B5 (10 MHz)

-98.0 dBm

-98.5 dBm

-100.5 dBm

-94.3 dBm LTE-FDD B12 (10 MHz)

-99.0 dBm

-99.5 dBm

-100.5 dBm

-93.3 dBm LTE-FDD B13 (10 MHz)

-98.5 dBm

-99.5 dBm

-100.7 dBm

-93.3 dBm LTE-FDD B14 (10 MHz)

-99.4 dBm

-99.5 dBm

-100.9 dBm

-93.3 dBm EC25_Series_Hardware_Design 109 / 126 LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B66 (10 MHz)

-97.5 dBm

-98.5 dBm

-99.6 dBm

-95.8 dBm LTE-FDD B71 (10 MHz)

-98.6 dBm

-99.5 dBm

-100 dBm

-93.5 dBm Table 59: EC25-EU Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-108.5 dBm DCS1800

-108.5 dBm WCDMA B1

-109.5 dBm

-109.5 dBm WCDMA B8

-110.0 dBm

-111.5 dBm

-102.0 dBm

-102.0dbm

-106.7 dBm

-103.7 dBm LTE-FDD B1 (10 MHz)

-98.5 dBm

-99.0 dBm

-101.7 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-98.2 dBm

-99.8 dBm

-102 dBm

-93.3 dBm LTE-FDD B7 (10 MHz)

-96.7 dBm

-98.5 dBm

-100.7 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-98.5 dBm

-100.4 dBm

-102.4 dBm

-93.3 dBm LTE-FDD B20 (10 MHz)

-98.7 dBm

-100.2 dBm

-102.7 dBm

-93.3 dBm LTE-FDD B28 (10 MHz)

-98.7 dBm

-100.5 dBm

-102.5 dBm

-94.8 dBm LTE-TDD B38 (10 MHz)

-95.2 dBm

-97.0 dBm

-100.2 dBm

-96.3 dBm LTE-TDD B40 (10 MHz)

-95.7 dBm

-98.2 dBm

-101.2 dBm

-96.3 dBm LTE-TDD B41 (10 MHz)

-95.0 dBm

-97.1 dBm

-100.2 dBm

-94.3 dBm Table 60: EC25-EUX Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-109.0 dBm DCS1800

-109.0 dBm

-102.0 dBm

-102.0 dbm WCDMA B1

-110.5 dBm

-110.5 m

-111.0 dBm

-106.7 dBm WCDMA B8

-110.5 dBm

-110.5 dBm

-111.0 dBm

-103.7 dBm

EC25_Series_Hardware_Design 110 / 126 LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B1 (10 MHz)

-98.0 dBm

-98.0 dBm

-101 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-96.5 dBm

-98.5 dBm

-99.5 dBm

-93.3 dBm LTE-FDD B7 (10 MHz)

-97.0 dBm

-94.5 dBm

-99.5 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-97.0 dBm

-97.0 dBm

-100.0 dBm

-93.3 dBm LTE-FDD B20 (10 MHz)

-97.5 dBm

-99.0 dBm

-101.5 dBm

-93.3 dBm LTE-FDD B28 (10 MHz)

-98.6 dBm

-98.7 dBm

-101.0 dBm

-94.8 dBm LTE-TDD B38 (10 MHz)

-96.3 dBm

-97 dBm

-98.5 dBm

-96.3 dBm LTE-TDD B40 (10 MHz)

-96.9 dBm

-98.0 dBm

-99.1 dBm

-96.3 dBm LTE-TDD B41 (10 MHz)

-95.3 dBm

-97.5 dBm

-98.0 dBm

-94.3 dBm Table 61: EC25-MX Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) WCDMA B2

-109 dBm

-110.5 dBm WCDMA B4

-109.5 dBm

-110 dBm WCDMA B5

-110 dBm

-111 dBm

-104.7 dBm

-106.7 dBm

-104.7 dBm LTE-FDD B2 (10 MHz)

-98 dBm

-99.1 dBm

-101.5 dBm

-94.3 dBm LTE-FDD B4 (10 MHz)

-98.5 dBm

-98.2 dBm

-101.5 dBm

-96.3 dBm LTE-FDD B5 (10 MHz)

-99 dBm

-99.2 dBm

-102.5 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97 dBm

-98.5 dBm

-101.5 dBm

-94.3 dBm LTE-FDD B28 (10 MHz)

-98 dBm

-99.3 dBm

-102 dBm

-94.8 dBm LTE-FDD B66 (10 MHz)

-98 dBm

-98.4 dBm

-101.5 dBm

-95.8 dBm Table 62: EC25-AUX Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) GSM850

-109.0 dBm

-102.0 dBm EC25_Series_Hardware_Design 111 / 126 LTE Standard Module Series EC25 Series Hardware Design

EGSM900

-109.0 dBm DCS1800 PCS1900

-109.0 dBm

-109.0 dBm

-102.0 dBm

-102.0 dBm

-102.0 dBm WCDMA B1

-110.0 dBm

-109.5 dBm

-112 dBm

-106.7 dBm WCDMA B2

-110.5 dBm

-104.7 dBm WCDMA B4

-110.0 dBm

-110 dBm

-112 dBm

-104.7 dBm WCDMA B5

-111.0 dBm

-112 dBm

-113 dBm

-104.7 dBm WCDMA B8

-111.0 dBm

-112 dBm

-113 dBm

-103.7 dBm LTE-FDD B1 (10 MHz)

-98.0 dBm

-97.7 dBm

-101.2 dBm

-96.3 dBm LTE-FDD B2 (10 MHz)

-98.5 dBm

-94.3 dBm LTE-FDD B3 (10 MHz)

-99.0 dBm

-98.8 dBm

-102.2 dBm

-93.3 dBm LTE-FDD B4 (10 MHz)

-97.7 dBm

-97.6 dBm

-100.2 dBm

-96.3 dBm LTE-FDD B5 (10 MHz)

-98.5 dBm

-98.2 dBm

-101.0 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97.7 dBm

-97.7 dBm

-101.2 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-99.0 dBm

-98.5 dBm

-102.2 dBm

-93.3 dBm LTE-FDD B28 (10 MHz)

-98.0 dBm

-98.7 dBm

-101.5 dBm

-94.8 dBm LTE-TDD B40 (10 MHz)

-97.5 dBm

-98.2 dBm

-101.2 dBm

-96.3 dBm Table 63: EC25-EX Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) EGSM900

-108.8 dBm DCS1800

-108.8 dBm WCDMA B1

-110.0 dBm WCDMA B5

-110.0 dBm WCDMA B8

-110.0 dBm

-102.0 dBm

-102.0dbm

-106.7 dBm

-104.7 dBm

-103.7 dBm EC25_Series_Hardware_Design 112 / 126 LTE Standard Module Series EC25 Series Hardware Design LTE-FDD B1 (10 MHz)

-98.0 dBm LTE-FDD B3 (10 MHz)

-98.4 dBm LTE-FDD B5 (10 MHz)

-99.0dBm LTE-FDD B7 (10 MHz)

-96.5 dBm LTE-FDD B8 (10 MHz)

-98.8 dBm LTE-FDD B20 (10 MHz)

-98.0 dBm LTE-TDD B38 (10 MHz)

-97.3 dBm LTE-TDD B40 (10 MHz)

-97.3 dBm LTE-TDD B41 (10 MHz)

-97.3 dBm

-96.3 dBm

-93.3 dBm

-94.3 dBm

-94.3 dBm

-93.3 dBm

-93.3 dBm

-96.3 dBm

-96.3 dBm

-94.3 dBm Table 64: EC25-T Conducted RF Receiving Sensitivity Frequency Bands Primary Diversity SIMO1) 3GPP (SIMO) LTE-FDD B2 (10 MHz)

-98.0 dBm

-98.5 dBm

-99.5 dBm

-94.3 dBm LTE-FDD B4 (10 MHz)

-97.5 dBm

-98.2 dBm

-99.3 dBm

-96.3 dBm LTE-FDD B5 (10 MHz)

-98.0 dBm

-98.5 dBm

-99.8 dBm

-94.3 dBm LTE-FDD B12 (10 MHz)

-98.6 dBm

-98.5 dBm

-99.6 dBm

-93.3 dBm LTE-FDD B66 (10 MHz)

-97.5 dBm

-98.2 dBm

-99.3 dBm

-95.8 dBm LTE-FDD B71 (10 MHz)

-98.6 dBm

-99.5 dBm

-99.9 dBm

-93.5 dBm NOTE 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.7. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. EC25_Series_Hardware_Design 113 / 126 LTE Standard Module Series EC25 Series Hardware Design The following table shows the modules electrostatics discharge characteristics. Table 65: Electrostatics Discharge Characteristics (25 C, 45% Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND All Antenna Interfaces 5 4 Other Interfaces 0.5 6.8. Thermal Consideration 10 8 1 kV kV kV In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:

On customers PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc. Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary. Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Make sure the ground pads of the module and PCB are fully connected. According to customers application demands, the heatsink can be mounted on the top of the module, or the opposite side of the PCB area where the module is mounted, or both of them. The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB. The following shows two kinds of heatsink designs for reference and customers can choose one or both of them according to their application structure. EC25_Series_Hardware_Design 114 / 126 LTE Standard Module Series EC25 Series Hardware Design Figure 41: Referenced Heatsink Design (Heatsink at the Top of the Module) NOTES Figure 42: Referenced Heatsink Design (Heatsink at the Backside of Customers PCB) 1. The module offers the best performance when the internal BB chip stays below 105 C. When the maximum temperature of the BB chip reaches or exceeds 105 C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115 C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115 C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105 C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. 2. For more detailed guidelines on thermal design, please refer to document [7]. EC25_Series_Hardware_Design 115 / 126 EC25 Module Heatsink Heatsink Thermal Pad Shielding Cover Application Board Application Board EC25 Module Thermal Pad Thermal Pad Heatsink Application Board Shielding Cover Application Board Heatsink LTE Standard Module Series EC25 Series Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.05 mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module Figure 43: Module Top and Side Dimensions EC25_Series_Hardware_Design 116 / 126 32.0 0.15 2.4 0.2 5 1

. 0 0

. 9 2 0.8 LTE Standard Module Series EC25 Series Hardware Design Figure 44: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. EC25_Series_Hardware_Design 117 / 126 1.90 1.30 3.85 32.0/-0.15 5.96 2.0 4

. 3 1.1 1.8 2.15 1.15 1.05 3.0 0.87 4.82 1.6 6.8 1.7 Pin 1 1.30 5

. 3 1.1 2.0 2.0 3.0 1.8 5 1

. 0

0

. 9 2 2.8 8

. 4 4.37 3.2 3.4 3.2 3.4 3.2 0.8 5

. 3 1.5 2.49 1.9 2.4 3.45 LTE Standard Module Series EC25 Series Hardware Design 7.2. Recommended Footprint Figure 45: Recommended Footprint (Top View) NOTES 1. The keepout area should not be designed. 2. For easy maintenance of this module, please keep about 3 mm between the module and other components on the motherboard. EC25_Series_Hardware_Design 118 / 126 LTE Standard Module Series EC25 Series Hardware Design 7.3. Design Effect Drawings of the Module Figure 46: Top View of the Module Figure 47: Bottom View of the Module NOTE These are renderings of EC25 series module. For authentic appearance, please refer to the module received from Quectel. EC25_Series_Hardware_Design 119 / 126 LTE Standard Module Series EC25 Series Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EC25 is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. should be 3560%. 3. The floor life of the module is 24 hours in a plant where the temperature is 23 5 C and relative humidity is below 60%. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 24 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10% (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

5. The module is not stored in Recommended Storage Condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a dry environment such as in a drying oven. EC25_Series_Hardware_Design 120 / 126 LTE Standard Module Series EC25 Series Hardware Design NOTE As the plastic package cannot be subjected to high temperature, it should be removed from devices before high temperature (120 C) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033 for baking procedure. 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.180.20 mm. For more details, please refer to document [4]. It is suggested that the peak reflow temperature is 238245 C, and the absolute maximum reflow temperature is 245 C. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 48: Reflow Soldering Thermal Profile EC25_Series_Hardware_Design 121 / 126 Temp. (C) 245 238 220 200 150 100 Soak Zone A Max slope: 1~3 C/sec Reflow Zone Max slope:

2~3 C/sec C C ooling dow n slope:

-1 to -4 C /s B D LTE Standard Module Series EC25 Series Hardware Design Table 66: Recommended Thermal Profile Parameters Soak time (between A and B: 150 C and 200 C) 70120 s Factor Soak Zone Max slope Reflow Zone Max slope Reflow time (D: over 220 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle 8.3. Packaging Recommendation 13 C/s 1 23 C/s 4570 s 238246 C

-1 to -4 C/s EC25 is packaged in tap and reel carriers. Each reel is 11.88 m long and contains 250 modules. The figure below shows the package details, measured in mm. Figure 49: Tape Specifications EC25_Series_Hardware_Design 122 / 126 1

. 0 5 7

. 1 5 1

. 0 0 2

. 0 2 3

. 0 0 0

. 4 4 44.000.1 2.000.1 4.000.1 0.1 1.5 0 0.350.05 5 1

. 0 3

. 9 2 5 1

. 0 3

. 0 3 5 1

. 0 3

. 0 3 32.50.15 33.50.15 4.20.15 3.10.15 32.50.15 33.50.15 LTE Standard Module Series EC25 Series Hardware Design Figure 50: Reel Specifications Figure 51: Tape and Reel Directions EC25_Series_Hardware_Design 123 / 126 Cover tape Direction of feed 48.5 0 0 1 13 44.5+0.20

-0.00 1083 Carrier tape packing module Carrier tape unfolding LTE Standard Module Series EC25 Series Hardware Design 9 Appendix A References Table 67: Related Documents SN Document Name Remark Quectel_EC2x&EGxx_Power_Management_ Application_Note Power management application note for EC25, EC21, EC20 R2.0, EC20 R2.1, EG95, EG91 and EG25-G modules Quectel_LTE_Standard_AT_Commands_ Manual AT commands manual for LTE Standard modules Quectel_LTE_Standard_GNSS_AT_Commands_ Manual GNSS AT Commands Manual for LTE Standard modules

[4]

Quectel_Module_Secondary_SMT_User_Guide Module secondary SMT user guide

[5]

Quectel_EC25_Reference_Design EC25 reference design

[6]

Quectel_RF_Layout_Application_Note RF layout application note

[7]

Quectel_LTE_Module_Thermal_Design_Guide

[8]

Quectel_UMTS&LTE_EVB_User_Guide Thermal design guide for LTE standard, LTE-A and Automotive modules UMTS & LTE EVB user guide for UMTS

& LTE modules

[1]

[2]

[3]

Table 68: Terms and Abbreviations Abbreviation Description AMR bps CHAP CS CSD Adaptive Multi-rate Bits Per Second Coding Scheme Circuit Switched Data Challenge Handshake Authentication Protocol EC25_Series_Hardware_Design 124 / 126 LTE Standard Module Series EC25 Series Hardware Design CTS Clear to Send DC-HSPA+

Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over-The-Air GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System DL DTR DTX EFR ESD FDD FR GMSK GNSS GPS GSM HR HSPA HSDPA HSUPA I/O Inorm LED LNA LTE MIMO Downlink Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Downlink Packet Access High Speed Uplink Packet Access Input/Output Normal Current Light Emitting Diode Low Noise Amplifier Long Term Evolution Multiple Input Multiple Output EC25_Series_Hardware_Design 125 / 126 LTE Standard Module Series EC25 Series Hardware Design MO MS MT PAP PCB PDU PPP QAM QPSK RF RHCP Rx SGMII SIM SIMO SMS TDD TX UL UMTS URC

(U)SIM Vmax Mobile Originated Mobile Station (GSM engine) Mobile Terminated Password Authentication Protocol Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Right Hand Circularly Polarized Receive Subscriber Identification Module Single Input Multiple Output Short Message Service Time Division Duplexing Serial Gigabit Media Independent Interface Transmitting Direction Uplink Universal Mobile Telecommunications System Unsolicited Result Code

(Universal) Subscriber Identity Module Maximum Voltage Value TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access EC25_Series_Hardware_Design 126 / 126 LTE Standard Module Series EC25 Series Hardware Design Normal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Absolute Minimum Input Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Voltage Standing Wave Ratio Wideband Code Division Multiple Access Wireless Local Area Network Vnorm Vmin VIHmax VIHmin VILmax VILmin VImax VImin VOHmax VOHmin VOLmax VOLmin VSWR WCDMA WLAN EC25_Series_Hardware_Design 127 / 126 LTE Standard Module Series EC25 Series Hardware Design 10 Appendix B GPRS Coding Schemes Table 69: Description of Different Coding Schemes Radio Block excl.USF and BCS 181 268 CS-1 CS-2 CS-3 CS-4 2/3 3/4 1/2 3 3 40 4 456 0 3 6 16 4 588 132 3 6 312 16 4 676 220 15.6 9.05 13.4 1 3 12 428 16 456

21.4 Scheme Code Rate USF Pre-coded USF BCS Tail Coded Bits Punctured Bits Data Rate Kb/s EC25_Series_Hardware_Design 128 / 126 LTE Standard Module Series EC25 Series Hardware Design 11 Appendix C GPRS Multi-slot Classes Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3 + 1 or 2 + 2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table. Table 70: GPRS Multi-slot Classes Multislot Class Downlink Slots Uplink Slots Active Slots 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1 2 2 3 2 3 3 4 3 4 4 4 3 4 2 3 3 4 4 4 4 5 5 5 5 5 NA NA 1 1 2 1 2 2 3 1 2 2 3 4 3 4 EC25_Series_Hardware_Design 129 / 126 LTE Standard Module Series EC25 Series Hardware Design 5 6 7 8 2 3 4 4 6 2 3 4 4 6 8 1 2 3 4 NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA 6 6 6 6 5 6 7 8 6 6 6 6 6 8 8 8 8 8 8 5 5 5 5 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 EC25_Series_Hardware_Design 130 / 126 LTE Standard Module Sires EC25 Hardware Design 12 Appendix D EDGE Modulation and Coding Schemes Table 71: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot GMSK GMSK GMSK GMSK 8-PSK 8-PSK 8-PSK 8-PSK 8-PSK C B A C B A B A A 8.80 kbps 17.60 kbps 35.20 kbps 11.2 kbps 22.4 kbps 44.8 kbps 14.8 kbps 29.6 kbps 59.2 kbps 17.6 kbps 35.2 kbps 70.4 kbps 22.4 kbps 44.8 kbps 89.6 kbps 29.6 kbps 59.2 kbps 118.4 kbps 44.8 kbps 89.6 kbps 179.2 kbps 54.4 kbps 108.8 kbps 217.6 kbps 59.2 kbps 118.4 kbps 236.8 kbps MCS-1 MCS-2 MCS-3 MCS-4 MCS-5 MCS-6 MCS-7 MCS-8 MCS-9 EC25_Hardware_Design 131 / 131

 

 

 

 

 

 

 

 

 

 

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Quectel Wireless Solutions Co., Ltd Request for Confidentiality Date: _2020/12/16_ Subject: Confidentiality Request for: _____ FCC ID: XMR202012EC25T ______ Pursuant to FCC 47 CRF 0.457(d) and 0.459 and IC RSP-100, Section 10, the applicant requests that a part of the subject FCC application be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Short Term Permanent Permanent*1 Permanent Permanent Permanent Permanent Permanent*

Exhibit Block Diagrams External Photos Internal Photos Operation Description/Theory of Operation Parts List & Placement/BOM Tune-Up Procedure Schematics Test Setup Photos Users Manual

*Note: ______(Insert Explanation as Necessary)______ ______ FCC ID: XMR202012EC25T _____ has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:

The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality:

The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of ______ days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify TCB in the event information regarding the product or the product is made available to the public. TCB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. NOTE for Industry Canada Applications:

The applicant understands that until such time that IC distinguishes between Short Term and Permanent Confidentiality, either type of marked exhibit above will simply be marked Confidential when submitted to IC. Sincerely, By:

Jean Hu

(Signature/Title2)

(Print name)

 

 

EC25-AF FCC ID :XMR2018EC25AF date of Grant 08/03/2018 Module Category Supported Band EC25--AF CAT4 WCDMA: B2/B4/B5 LTE:B2/B4/B5/B12/B13/B14/B66/B71 EC25-T CAT4 LTE:B2/B4/B5/B12/B13/B66/B71 EC25-AF&EC25-AF MINIPCIE and EC25-T&EC25-T MINIPCIE share the same HW design, EC25-T&EC25-T MINIPCIE reduce B13and B14 and GPSIC on the basis of EC25-AF&EC25-AF MINIPCIE. The details are shown as following pictures and table. The detailed product change description please refers to Statement letter_EC25-AF&EC25-T file. The test contents of all EC25-T&EC25-T MINIPCIE reports are as follows:

EC25-T, EC25-T MINIPCIE (Report No.: R2011A0762-R1) is a variant model of EC25-AF, EC25-AF MINIPCIE (Report No.: R1806A0301-R1V1). There is only tested RF Power Output and Effective Radiated Power, Occupied Bandwidth, Band Edge Compliance and Radiates Spurious Emission for variant in this report. Other test items please refer to the model of EC25-AF, EC25-AF MINIPCIE (Report No.: R1806A0301-R1V1). EC25-T, EC25-T MINIPCIE (Report No.: R2011A0762-R2) is a variant model of EC25-AF, EC25-AF MINIPCIE (Report No.: R1806A0301-R2V1). There is only tested RF Power Output and Effective Isotropic Radiated Power, Occupied Bandwidth, Band Edge Compliance and Radiates Spurious Emission for variant in this report. Other test items please refer to the model of EC25-AF, EC25-AF MINIPCIE (Report No.: R1806A0301-R2V1). EC25-T, EC25-T MINIPCIE (Report No.: R2011A0762-R3) is a variant model of EC25-AF, EC25-AF MINIPCIE (Report No.: R1806A0301-R3V1). There is only tested RF Power Output and Effective Isotropic Radiated Power, Occupied Bandwidth, Band Edge Compliance and Radiates Spurious Emission for variant in this report. Other test items please refer to the model of EC25-AF, EC25-AF MINIPCIE (Report No.: R1806A0301-R3V1). Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Company Limited

 

 

 

 

 

 

Quectel Wireless Solutions Company Limited Declaration of the Modular Approval Applicant / Grantee FCC ID:

Model:

The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:

Quectel Wireless Solutions Co., Ltd XMR202012EC25T EC25-T, EC25-T MINIPCIE Modular approval requirement EUT Condition

(a) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. The radio elements of the modular transmitter have their own shielding. Comply YES

(b) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation.

(c)The modular transmitter must have its own power supply regulation.

(d) The modular antenna must transmitter must the antenna and comply with transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section. either

(e)The modular be transmitter must tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with line conducted requirements found in Section 15.207. AC or DC the AC The modular has buffered data inputs, it is integrated in chip. Please see schematic.pdf YES All power lines derived from the host device are regulated before energizing other circuits internal to EC25-T, EC25-T MINIPCIE. Please see schematic.pdf Device uses a micro-strip trace on the hosts printed circuit board to an antenna connector on the host circuit board. YES YES YES EC25-T, EC25-T MINIPCIE was tested in a standalone configuration via a PCMCIA extender. Please see spurious setup Quectel Wireless Solutions Company Limited power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available

(see Section 15.31(i)) must not be in side another device during testing. equipment. supporting and

(f)The modular transmitter be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. must

(g) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any suchrequirements. A copy of these instructions must be included in the application for equipmentauthorizationrequirements,whicharebas edon theintendeduse/configurations.

(h)The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. The label position of EC25-T, EC25-T MINIPCIE is clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text: Contains FCC ID: XMR202012EC25T. Please see the label.pdf EC25-T, EC25-T MINIPCIE is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. EC25-T, EC25-T MINIPCIE is approved to comply with the applicable RF exposure requirement, please see the MPE evaluation with 20cm as the distance restriction. YES YES YES Quectel Wireless Solutions Company Limited 2020/12/16 Signature Title: Project Manager Dated By:

Jean Hu Printed On behalf of :

Quectel Wireless Solutions Company Limited Telephone:

+86-21-51086236 ext 6511

 

 

Quectel Wireless Solutions Co., Ltd POWER OF ATTORNEY DATE:December 16, 2020 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/Jinnan Han on our behalf, to apply to FCC on our equipment for FCC ID:

XMR202012EC25T. Any and all acts carried out by TA Technology

(Shanghai) Co., Ltd. / Jinnan Han on our behalf shall have the same effect as acts of our own. Sincerely, Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Company Limited