FCC ID: XMR202111EG915ULA LTE Module

OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: XMR202111EG915ULA. The FCC ID/IC ID can be used only when all FCC compliance requirements are met. Antenna

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed Test Mode GSM850 PCS1900 LTE B2 LTE B4 Antenna Gain (dBi) Test Mode Antenna Gain (dBi) 6.00 10.00 6.30 6.30 LTE B5 LTE B7 LTE B66 Bluetooth 6.30 6.30 6.30 Dipole Antenna, 5.38 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. List of applicable FCC rules This module has been tested and found to comply with part 22, part 24, part 27, part 15 requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-

radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement your body. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator &

EG915U Series Hardware Design LTE Standard Module Series Version: 1.0 Date: 2021-11-23 Status: Released LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:

http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. EG915U_Series_Hardware_Design 1 / 81 LTE Standard Module Series Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Trademarks Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

(third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved. EG915U_Series_Hardware_Design 2 / 81 LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. EG915U_Series_Hardware_Design 3 / 81 LTE Standard Module Series About the Document Revision History Version Date Author Description

1.0 2021-11-23 2021-11-23 Len CHEN/Reuben WANG/

Frank WANG/Ailsa WANG Len CHEN/Reuben WANG/

Frank WANG/Ailsa WANG Creation of the document First official release EG915U_Series_Hardware_Design 4 / 81 LTE Standard Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents ....................................................................................................................................................... 5 Table Index ................................................................................................................................................... 7 Figure Index ................................................................................................................................................. 8 1 Introduction ........................................................................................................................................ 10 Special Mark ............................................................................................................................ 10 1.1. 2 Product Overview .............................................................................................................................. 11 Frequency Bands and Functions ............................................................................................ 11 Key Features ........................................................................................................................... 12 Functional Diagram ................................................................................................................. 14 Pin Assignment ........................................................................................................................ 15 Pin Description ........................................................................................................................ 16 EVB ......................................................................................................................................... 24 2.1. 2.2. 2.3. 2.4. 2.5. 2.6. 3.3. 3 Operating Characteristics ................................................................................................................. 25 3.1. Operating Modes ..................................................................................................................... 25 Sleep Mode ............................................................................................................................. 26 3.2. 3.2.1 UART Application Scenario ............................................................................................ 26 3.2.2. USB Application Scenario .............................................................................................. 27 USB Application with USB Remote Wakeup Function ................................... 27 USB Application with USB Suspend/Resume and MAIN_RI Wakeup Function 29 3.2.2.1. 3.2.2.2. Airplane Mode ......................................................................................................................... 30 3.3.1. Hardware ........................................................................................................................ 30 3.3.2. Software ......................................................................................................................... 30 Power Supply .......................................................................................................................... 30 3.4.1. Power Supply Pins ......................................................................................................... 30 3.4.2. Reference Design for Power Supply .............................................................................. 31 3.4.3. Requirements for Voltage Stability ................................................................................. 31 Turn on .................................................................................................................................... 32 3.5.1. Turn on with PWPKEY ................................................................................................... 32 Turn off .................................................................................................................................... 34 3.6.1. Turn off with PWPKEY ................................................................................................... 35 3.6.2. Turn off with AT Command ............................................................................................. 35 Reset ....................................................................................................................................... 36 3.6. 3.7. 3.4. 3.5. 4.1. 4 Application Interfaces ....................................................................................................................... 38 Analog Audio Interfaces .......................................................................................................... 38 4.1.1. Audio Interfaces Design Considerations........................................................................ 38 4.1.2. Microphone Interface Design ......................................................................................... 39 EG915U_Series_Hardware_Design 5 / 81 LTE Standard Module Series 4.2. 4.3. 4.4. 4.5. 4.6. 4.7. 4.8. 4.9. 4.10. 4.1.3. Receiver Interface Design .............................................................................................. 39 USB Interface .......................................................................................................................... 40 USB_BOOT Interface .............................................................................................................. 42

(U)SIM Interface ...................................................................................................................... 43 I2C and PCM Interfaces ....................................................................................................... 45 UART Interfaces ...................................................................................................................... 46 ADC Interface .......................................................................................................................... 48 SPI Interface ............................................................................................................................ 50 PSM Interface* ........................................................................................................................ 50 Indication Signal ...................................................................................................................... 51 Network Status Indication ....................................................................................... 52 STATUS .................................................................................................................. 52 MAIN_RI.................................................................................................................. 53 4.11. Control Signal .......................................................................................................................... 54 4.10.1. 4.10.2. 4.10.3. 5 Antenna Interfaces ............................................................................................................................. 55 5.1. Main Antenna Interface ........................................................................................................... 55 5.1.1. Pin Definition .................................................................................................................. 55 5.1.2. Operating Frequency ..................................................................................................... 55 5.1.3. Reference Design of Antenna Interface ......................................................................... 57 5.1.4. Operating Frequency ..................................................................................................... 58 Antenna Installation ................................................................................................................. 60 5.2.1. Antenna Design Requirement ........................................................................................ 60 5.2.2. RF Connector Recommendtion ..................................................................................... 60 5.2. 6 Electrical Characteristics & Reliability ............................................................................................ 63 6.1. Absolute Maximum Ratings .................................................................................................... 63 Power Supply Ratings ............................................................................................................. 63 6.2. 6.3. Operation and Storage Temperatures ..................................................................................... 64 Power Consumption ................................................................................................................ 64 6.4. Tx Power ................................................................................................................................. 72 6.5. Rx Sensitivity ........................................................................................................................... 73 6.6. ESD ......................................................................................................................................... 75 6.7. 7 Mechanical Information ..................................................................................................................... 76 Mechanical Dimensions .......................................................................................................... 76 7.2 7.3 Recommended Footprint ......................................................................................................... 78 7.3 Top and Bottom Views ................................................................................................................... 79 8 Storage, Manufacturing & Packaging ........................................................................................... 80 Storage Conditions .................................................................................................................. 80 Manufacturing and Soldering .................................................................................................. 81 Packaging Specifications ........................................................................................................ 82 Packaging Process ....................................................................................................................... 84 8.1 8.2 8.3 9 Appendix References ........................................................................................................................ 86 EG915U_Series_Hardware_Design 6 / 81 LTE Standard Module Series Table Index Table 1: Special Mark ................................................................................................................................. 10 Table 2: Wireless Network Type ..................................................................................................................11 Table 3: I/O Parameters Definition ............................................................................................................. 16 Table 4: Pin Description ............................................................................................................................. 16 Table 5: Overview of Operating Modes ...................................................................................................... 25 Table 6: Pin Definition of Power Supply ..................................................................................................... 30 Table 7: Pin Definition of PWRKEY ............................................................................................................ 32 Table 8: Pin Description of RESET_N ........................................................................................................ 36 Table 9: Pin Definition of Analog Audio Interfaces ..................................................................................... 38 Table 10: Functions of the USB Interface .................................................................................................. 40 Table 11: Pin Definition of USB Interface ................................................................................................... 41 Table 12: Pin Definition of USB_BOOT Interface ...................................................................................... 42 Table 13: Pin Definition of I2C and PCM Interfaces ................................................................................ 45 Table 14: Pin Definition of Main UART Interface ....................................................................................... 46 Table 15: Pin Definition of Debug UART Interface ..................................................................................... 47 Table 16: Auxiliary UART............................................................................................................................ 47 Table 17: Pin Definition of ADC Interface ................................................................................................... 49 Table 18: Pin Definition of PSM Interface .................................................................................................. 51 Table 19: Pin Definition of Indication Signal ............................................................................................... 51 Table 20: Working State of Network Connection Status/Activity Indication ............................................... 52 Table 21: Pin Definition of STATUS ............................................................................................................ 53 Table 22: Behaviors of the MAIN_RI .......................................................................................................... 54 Table 23: Pin Definition of Control Signal .................................................................................................. 54 Table 24: Pin Definition of RF Antennas .................................................................................................... 55 Table 25: Operating Frequency of EG915U-CN ........................................................................................ 55 Table 26: Operating Frequency of EG915U-EU ........................................................................................ 56 Table 27: Operating Frequency of EG915U-LA ......................................................................................... 57 Table 28: Requirements for Antenna Design ............................................................................................. 60 Table 30: Operating and Storage Temperatures ........................................................................................ 64 Table 32: EG915U-EU Current Consumption ............................................................................................ 67 Table 33: EG915U-LA Current Consumption ............................................................................................. 70 Table 34: EG915U-CN RF Output Power .................................................................................................. 72 Table 35: EG915U-EU RF Output Power................................................................................................... 72 Table 36: EG915U-LA RF Output Power ................................................................................................... 73 Table 37: EG915U-CN Conducted RF Receiving Sensitivity..................................................................... 73 Table 40: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity) ............................... 75 Table 41: Recommended Thermal Profile Parameters .............................................................................. 82 Table 42: Related Documents .................................................................................................................... 86 Table 43: Terms and Abbreviations ............................................................................................................ 86 EG915U_Series_Hardware_Design 7 / 81 LTE Standard Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 14 Figure 2: EG915U Series Module Pin Assignment (Top View) .................................................................. 15 Figure 3: Sleep Mode Application via UART .............................................................................................. 26 Figure 4: Sleep Mode Application with USB Remote Wakeup .................................................................. 27 Figure 5: Sleep Mode Application with MAIN_RI ....................................................................................... 29 Figure 6: Reference Design of Power Supply ............................................................................................ 31 Figure 7: Power Supply Limits during Burst Transmission ........................................................................ 32 Figure 8: Power Supply .............................................................................................................................. 32 Figure 9: Turing on the Module Using Driving Circuit ................................................................................ 33 Figure 10: Turing on the Module Using Button .......................................................................................... 33 Figure 11: Power-up Timing ....................................................................................................................... 34 Figure 12: Timing of Turning off Module .................................................................................................... 35 Figure 13: Reference Circuit of RESET_N by Using Driving Circuit ......................................................... 36 Figure 14: Reference Circuit of RESET_N by Using Button...................................................................... 36 Figure 15: Timing of Resetting the Module ................................................................................................ 37 Figure 16: Reference Design for Microphone Interface ............................................................................. 39 Figure 17: Reference Design for Receiver Interface ................................................................................. 40 Figure 18: Reference Circuit of USB Application ....................................................................................... 41 Figure 19: Reference Circuit of USB_BOOT Interface .............................................................................. 42 Figure 20: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector ......................... 44 Figure 21: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector ........................... 44 Figure 22: Reference Circuit of I2 C and PCM Application with Audio Codec .......................................... 46 Figure 23: Reference Circuit with Translator Chip ..................................................................................... 48 Figure 24: Reference Circuit with Transistor Circuit .................................................................................. 48 Figure 25: Reference Circuit of Wake up Module from PSM ..................................................................... 51 Figure 26: Reference Circuit of Network Status Indication ........................................................................ 52 Figure 27: Reference Circuits of STATUS ................................................................................................. 53 Figure 28: Reference Circuit of RF Antenna .............................................................................................. 58 Figure 29: Microstrip Design on a 2-layer PCB ......................................................................................... 58 Figure 30: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 59 Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 59 Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 59 Figure 33: Dimensions of U.FL-R-SMT Connector (Unit: mm) .................................................................. 61 Figure 34: Mechanicals of U.FL-LP Connectors ........................................................................................ 61 Figure 35: Space Factor of Mated Connector (Unit: mm) .......................................................................... 62 Figure 36: Module Top and Side Dimensions (Unit: mm) .......................................................................... 76 Figure 37: Module Bottom Dimensions ...................................................................................................... 77 Figure 38: Recommended Footprint (TOP View) ....................................................................................... 78 Figure 39: Top & Bottom Views of the Module ........................................................................................... 79 Figure 40: Recommended Reflow Soldering Thermal Profile ................................................................... 81 Figure 41: Tape Specifications ................................................................................................................... 83 EG915U_Series_Hardware_Design 8 / 81 LTE Standard Module Series Figure 42: Reel Specifications ................................................................................................................... 83 Figure 43: Tape and Reel Directions .......................................................................................................... 84 EG915U_Series_Hardware_Design 9 / 81 LTE Standard Module Series 1 Introduction This document defines the EG915U series module and describes its air interfaces and hardware interfaces which are connected with relate to customers applications. It can help customers quickly understand interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, customers can use this module to design and to set up mobile applications easily. 1.1. Special Mark Table 1: Special Mark Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of such model is currently unavailable. EG915U_Series_Hardware_Design 10 / 81 LTE Standard Module Series 2 Product Overview EG915U series module is an LTE-FDD, LTE-TDD and GSM wireless communication module, which provides data connectivity on LTE-FDD, LTE-TDD and GPRS networks. It also provides voice functionality, Bluetooth and Wi-Fi Scan 1 to meet your specific application demands. Related information and details are listed in the table below:

Table 2: Brief Introduction of the Module Categories Dimensions Weight Variants Packaging and pins number 126-pin; LGA

(23.6 0.2 ) mm (19.9 0.2 ) mm (2.40.2 )mm 2.5 0.2 g Wireless network functions LTE/GSM/Bluetooth/Wi-Fi Scan 1 EG915U-CN 2; EG915U-EU; EG915U-LA 2.1. Frequency Bands and Functions Table 2: Wireless Network Type Wireless Network Type EG915U-CN EG915U-EU EG915U-LA LTE-FDD B1/B3/B5/B8 B1/B3/B5/B7/B8/B20/B28 B2/B3/B4/B5/B7/B8/B28

/B66 LTE-TDD B34/B38/B39/B40/B41

GSM 900/1800 MHz 850/900/1800/1900 MHz 850/900/1800/1900 MHz Bluetooth and Wi-Fi Scan 1 2.4 GHz 2.4 GHz 2.4 GHz 1 EG915U series support Bluetooth and Wi-Fi Scan functions. Due to the shared antenna interface, the two functions cannot be used simultaneously. Bluetooth and Wi-Fi Scan functions are optional (both supported or not), please contact Quectel Technical Support for details. 2 Only EG915U-CN provides LTE-TDD, please consult Quectel Technical Support for details. EG915U_Series_Hardware_Design 11 / 81 LTE Standard Module Series 2.2. Key Features The following table describes the detailed features of EG915U series module. Table 4: Key Features of EG915U Series Module Features Description Power Supply Supply voltage: 3.34.3 V Typical supply voltage: 3.8 V Transmitting Power LTE Features EG915U-CN:

EGSM900: Class 4 (33 dBm 2 dB) DCS1800: Class 1 (30 dBm 2 dB) LTE-FDD: Class 3 (23 dBm 2 dB) LTE-TDD: Class 3 (23 dBm 2 dB) EG915U-EU:

GSM850/EGSM900: Class 4 (33 dBm 2 dB) DCS1800/PCS1900: Class 1 (30 dBm 2 dB) LTE-FDD: Class 3 (23 dBm 2 dB) EG915U-LA:

GSM850/EGSM900: Class 4 (33 dBm 2 dB) DCS1800/PCS1900: Class 1 (30 dBm 2 dB) LTE-FDD: Class 3 (23 dBm 2 dB) EG915U-CN:

Supports up to Cat 1 FDD/TDD. Supports 1.4/3/5/10/15/20 MHz RF bandwidth. Supports uplink QPSK, 16QAM. Supports downlink QPSK, 16QAM and 64QAM. FDD: Max 10 Mbps (DL)/5 Mbps (UL). TDD: Max 8.96 Mbps (DL)/3.1 Mbps (UL). EG915U-EU:

Supports up to Cat 1 FDD. Supports 1.4/3/5/10/15/20 MHz RF bandwidth. Supports uplink QPSK, 16QAM. Supports downlink QPSK, 16QAM and 64QAM. FDD: Max 10 Mbps (DL)/5 Mbps (UL). EG915U-LA:

Supports up to Cat 1 FDD. Supports 1.4/3/5/10/15/20 MHz RF bandwidth. Supports uplink QPSK, 16QAM. Supports downlink QPSK, 16QAM and 64QAM. EG915U_Series_Hardware_Design 12 / 81 LTE Standard Module Series GSM Features FDD: Max 10 Mbps (DL)/5 Mbps (UL). GPRS:

Supports GPRS multi-slot class 12 Coding scheme: CS-1/CS-2/CS-3/CS-4 Max 85.6 Kbps (DL)/85.6 Kbps (UL) Supports TCP/UDP/PPP/NTP/NITZ/FTP/HTTP/PING/CMUX/HTTPS/

FTPS/SSL/FILE/MQTT/MMS protocols Internet Protocol Features Support PAP (Password Authentication Protocol) and CHAP

(U)SIM Interface Supports USIM/SIM card: 1.8/3.0 V SMS UART Interfaces

(Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connection Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: Stored in (U)SIM card and ME, stored in ME by default Main UART Used for AT command communication and data transmission Baud rates reach up to 921600 bps; 115200 bps by default Supports RTS and CTS hardware flow control Debug UART Used for the output of partial logs Baud rate: 921600 bps Only used for debug UART, cannot be used for universal UART Auxiliary UART SPI Interface Supports one SPI Interface (master mode only) I2C Interface Supports one I2C Interface PCM Interface Supports one PCM Interface Audio Features Supports one analog audios input and one analog audios output GSM: HR/FR/EFR/AMR/AMR-WB Supports echo cancellation and noise suppression ADC Interfaces Supports two ADC Interfaces Network Indication NET_STATUS used to indicate the network connectivity status AT Commands commands Compliant with 3G PP TS 27.007, 27.005 and Quectel enhanced AT USB_BOOT Interface Supports one download control interface Antenna Interfaces Main antenna interface (ANT_MAIN) Bluetooth and Wi-Fi Scan antenna interface (ANT_BT/WIFI_SCAN) 50 impedance EG915U_Series_Hardware_Design 13 / 81 LTE Standard Module Series Position Fixing Support Wi-Fi Scan Temperature Range Operation temperature range: -35 to +75 C 4 Extended temperature range: -40 to +85 C 5 Storage temperature range: -40 to +90 C Firmware Upgrade USB interface and DFOTA All hardware components are fully compliant with EU RoHS directive RoHS 2.3. Functional Diagram The following figure shows a block diagram of the module and illustrates the major functional parts. Power management Baseband Flash Radio frequency Peripheral interfaces Figure 1: Functional Diagram 4 Within operating temperature range, the module meets 3GPP specifications. 5 Within extended temperature range, the module remains the ability to establish and maintain functions such as voice, SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. EG915U_Series_Hardware_Design 14 / 81 BasebandPMICTransceiverPAPAMANT_MAINVBAT_RFPWRKEYADCsVDD_EXT2x(U)SIMPCMUARTsI2CControlDuplexTxPRxSTATUSRESET_NSAWANT_BT/WIFI_SCAN26 MHzDCXOSPI Nor Flash (64Mb) PSRAM (128Mb)MIC32 kHz ClockUSBSPI SPKControlVBAT_BB LTE Standard Module Series 2.4. Pin Assignment The following figure illustrates the pin assignment of the module. Figure 2: EG915U Series Module Pin Assignment (Top View) 1. USB_BOOT cannot be pulled up before startup. 2. Keep NC and RESERVED pins unconnected, all GND pins shall be connected to the ground. 3. The function of PSM is under development and it is not recommended to use it right now. 4. The module supports dual-SIM single stand by. For details, please contact Quectel Technical NOTE Support. EG915U_Series_Hardware_Design 15 / 81 123456711121314151617185051525354555859606162313029282726232221201910984948474645444340414239383736353433322425575663646566676883848586878898979695949378777675747391928990717269708079828110099102101PSM_INDADC1RESERVEDSPI_CSSPI_CLKANT_MAINAP_READYSTATUSNET_STATUSPCM_CLKPCM_SYNCPCM_DINPCM_DOUTW_DISABLE#GNDUSB_VBUSUSB_DPUSB_DMRESERVEDRESERVEDRESERVEDRESERVEDPWRKEYDBG_RXDDBG_TXDADC0VDD_EXTMAIN_DTRGNDMAIN_RIMAIN_DCDMAIN_RTSMAIN_TXDMAIN_RXDVBAT_BBMAIN_CTSI2C_SCLI2C_SDAVBAT_BBGNDGNDGNDRESERVEDVBAT_RFVBAT_RFGNDGNDANT_BT/WIFI_SCANGNDGNDAUX_TXDAUX_RXDRESET_NUSB_BOOTUSIM2_DETUSIM2_CLKUSIM2_RSTUSIM2_DATAUSIM2_VDDSPI_DINSPI_DOUTRESERVEDRESERVEDPSM_EINTRESERVEDRESERVEDGRFC1GRFC21031041031151141031181132112111103106105107116103108117109110RESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVED119126120121122123124125MIC_NMIC_PSPK_PSPK_NRESERVEDRESERVEDRESERVEDMICBIASPower PinsGND PinsSignal PinsRESERVED Pins(U)SIM PinsUSB PinsADC PinsUART2 PinsUART1 PinsDebug UART PinsSPI PinsAudio PinsPCM PinsUSIM1_CLKUSIM1_DATAUSIM1_RSTUSIM1_VDDUSIM1_GNDUSIM1_DETRESERVEDGNDPSM PinsIIC PinsRESERVEDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGND LTE Standard Module Series 2.5. Pin Description The following tables show the pin definition of the module. Table 3: I/O Parameters Definition Type AI AO AIO DI DO DIO OD PI PO Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 32, 33 PI Power supply for the modules baseband part VBAT_RF 52, 53 PI Power supply for the modules RF part Vmax = 4.3 V Vmin = 3.3 V Vnom = 3.8 V VDD_EXT 29 PO Provide 1.8 V for external circuit Vnom = 1.8 V IOmax = 50 mA It must be provided with sufficient current up to 1 A It must be provided with sufficient current up to 2.5 A Power supply for external GPIOs pull-up circuits. Add 2.2 F bypass capacitor when in use. EG915U_Series_Hardware_Design 16 / 81 LTE Standard Module Series Power On/Off Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 15 DI Turn on/off the module RESET_N 17 DI Reset the module VILmax = 0.5 V Indication Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 20 DO Indicate the module's operation status VOHmin = 1.35 V VOLmax = 0.45 V NET_STATUS 21 DO Indicate the module's network activity status VOHmin = 1.35 V VOLmax = 0.45 V USB Interface Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS AI USB connection detect USB_DP AIO USB differential data (+) 8 9 Vmax = 5.25 V Vmin = 3.5 V Vnom = 5.0 V USB_DM 10 AIO USB differential data (-) If unused, keep it open. VBAT power domain. VBAT power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open 1.8 V power domain. If unused, keep it open. Typical: 5.0 V If unused, keep it open. USB 2.0 compliant. Require differential impedance of 90 . If unused, keep it open.

(U)SIM Interface Pin Name Pin No. I/O Description DC Characteristics Comment USIM1_VDD 43 PO

(U)SIM1 card power supply IOmax = 50 mA For 1.8 V (U)SIM:

Vmax = 1.9 V Either 1.8 V or 3.0 V (U)SIM card is supported and EG915U_Series_Hardware_Design 17 / 81 LTE Standard Module Series can be identified automatically by the module. Vmin = 1.7 V For 3.0 V (U)SIM:

Vmax = 3.05 V Vmin = 2.7 V For 1.8 V (U)SIM:

VILmax = 0.6 V VIHmin = 1.26 V VOLmax = 0.45 V VOHmin = 1.35 V For 3.0 V (U)SIM:

VILmax = 1.0 V VIHmin = 1.95 V VOLmax = 0.45 V VOHmin = 2.55 V For 1.8 V (U)SIM:

VOLmax = 0.45 V VOHmin = 1.35 V For 3.0 V (U)SIM:

VOLmax = 0.45 V VOHmin = 2.55 V For 1.8 V (U)SIM:

VOLmax = 0.45 V VOHmin = 1.35 V For 3.0 V (U)SIM:

VOLmax = 0.45 V VOHmin = 2.55 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V Iomax = 50 mA 1.8 V (U)SIM Vmax = 1.9 V Vmin = 1.7 V 3.0 V (U)SIM Vmax = 3.05 V Vmin = 2.7 V 1.8 V power domain. If unused, keep this pin open Specified ground for (U)SIM1 card Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. USIM1_DATA 45 DIO

(U)SIM1 card data USIM1_CLK 46 DO

(U)SIM1 card clock USIM1_RST 44 DO

(U)SIM1 card reset USIM1_DET 42 DI

(U)SIM1 card hot-plug detect USIM1_GND 47

Ground

USIM2_VDD 87 PO

(U)SIM2 card power supply EG915U_Series_Hardware_Design 18 / 81 LTE Standard Module Series 1.8 V (U)SIM VILmax = 0.6 V VIHmin = 1.26 V VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM VILmax = 1.0 V VIHmin = 1.95 V VOLmax = 0.45 V VOHmin = 2.55 V 1.8 V (U)SIM VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM VOLmax = 0.45 V VOHmin = 2.55 V 1.8 V (U)SIM VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM VOLmax = 0.45 V VOHmin = 2.55 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V USIM2_DATA 86 DIO

(U)SIM2 card data USIM2_CLK 84 DO

(U)SIM2 card clock USIM2_RST 85 DO

(U)SIM2 card reset USIM2_DET 83 DI

(U)SIM2 card hot-plug detect Main UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment MAIN_CTS 36 DO DTE clear to send signal to DCE (connect to DTEs CTS) VOLmax = 0.45 V VOHmin = 1.35 V MAIN_RTS 37 DI DTE request to send signal to DCE (connect to DTEs RTS) MAIN_RXD 34 DI Main UART receive 1.8 V power domain. If unused, keep it open 1.8 V power domain. If unused, keep it open. MAIN_DTR&

MAIN_DCD&

MAIN_RI will have a period of time when the module is powered on. EG915U_Series_Hardware_Design 19 / 81 LTE Standard Module Series MAIN_DCD 38 DO Main UART data carrier detect MAIN_TXD 35 DO Main UART transmit MAIN_RI 39 DO Main UART ring indication MAIN_DTR 30 DI Main UART data terminal ready VOLmax = 0.45 V VOHmin = 1.35 V VOLmax = 0.45 V VOHmin = 1.35 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V Auxiliary UART Interface Pin Name Pin No. I/O Description DC Characteristics comment AUX_TXD 27 DO Auxiliary UART transmit AUX_RXD 28 DI Auxiliary UART receive VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep it open. Debug UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment DBG_RXD 22 DI Debug UART receive DBG_TXD 23 DO Debug UART transmit I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2C _SCL 40 OD I2C serial clock I2C _SDA 41 OD I2C serial data External pull-up resistor is required. 1.8 V only. If unused, keep it open. The I2 C interface supports simultaneous EG915U_Series_Hardware_Design 20 / 81 LTE Standard Module Series PCM Interface Pin Name Pin No. I/O Description DC Characteristics Comment PCM_SYNC 5 DI PCM data frame sync PCM_CLK 4 DI PCM clock PCM_DIN 6 DI PCM data input PCM_DOUT 7 DO PCM data output RF Antenna Interface ANT_MAIN 60 AIO Main antenna interface ANT_BT/

WIFI_SCAN 56 AIO The shared interface for Bluetooth and Wi-Fi Scan GRFC Antenna Tuner Control Interface*

Pin Name Pin No. I/O Description DC Characteristics Comment connection of multiple peripherals except for codec IC 1.8 V power domain. If unused, keep it open. Support slave mode only. 50 impedance 50 impedance. If unused, keep it open VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V Pin Name Pin No. I/O Description DC Characteristics Comment DO DO Generic RF Controller If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment SPI_CLK DO SPI clock SPI_CS DO SPI chip select VOLmax = 0.45 V VOHmin = 1.35 V VOLmax = 0.45 V VOHmin = 1.35 V Master mode only. GRFC1 GRFC2 SPI Interface 76 77 26 25 EG915U_Series_Hardware_Design 21 / 81 LTE Standard Module Series SPI_DIN 88 DI SPI master mode input SPI_DOUT 64 DO SPI master mode output VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V Pin Name Pin No. I/O Description DC Characteristics Comment General-purpose ADC interface Voltage range:

0.1 V to VBAT If unused, keep it open. ADC Interface ADC0 ADC1 24 2 AI AI Analog Audio Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment MIC_N 119 AI Microphone analog input

(-) MICBIAS 120 PO Bias voltage output for microphone Vo = 2.23.0 V Vnom = 2.2 V SPK_P 121 AO SPK_N 122 AO MIC_P 126 AI USB_BOOT Analog audio differential output (+) Analog audio differential output (-) Microphone analog input

(+) Pin Name Pin No. I/O Description DC Characteristics Comment USB_BOOT 75 DI Control pin for module to enter download mode VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V PSM Interface*

Pin Name Pin No. I/O Description DC Characteristics Comment 1.8 V power domain. Active high. A circuit that enables the module to enter the download mode must be reserved. EG915U_Series_Hardware_Design 22 / 81 1.8 V power domain. Pulled up by default. When it is in low voltage level, the module can enter airplane mode. If unused, keep it open. When the pin is powered on, there will be a period of time when the level status is uncertain. 1.8 V power domain. If unused, keep it open. When the PIN pin is powered on, there will be a period of time when the level status is uncertain. LTE Standard Module Series PSM_IND 1 DO PSM_EINT 96 DI Other Interfaces Indicate the modules power saving mode External interrupt pin;

wake up the module from PSM Pin Name Pin No. I/O Description DC Characteristics Comment W_DISABLE#

18 DI Airplane mode control VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V AP_READY 19 DI Application processor ready VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V Pin Name Pin No. GND GND RESERVED Pin Name Pin No. 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67, 68, 69, 70, 71, 72, 73, 74, 79, 80, 81, 82, 89, 90, 91, 100, 101, 102 EG915U_Series_Hardware_Design 23 / 81 LTE Standard Module Series RESERVED NOTE 11, 12, 13, 14, 16, 49, 51, 57, 65, 66, 78, 92, 93, 94, 95, 97, 98, 99, 103, 104, 105, 106, 107, 108, 109, 110, 111, 112, 113, 114, 115, 116, 117, 118, 123, 124, 125 1. The functions of PSM and GRFC are under development and it is not recommended to use them right now, please consult Quectel Technical Support for details. 5. PIN18( MAIN_W_DISABLE)&PIN19( AP_READY)&PIN30( MAIN_DTR)

&PIN38( MAIN_DCD)&PIN39( MAIN_RI) When the module is powered on, there will be a period of time when the power level is indeterminate. First, high level 3V lasts for 2 seconds, then low power Ping lasts for 1.2 seconds, and then it is configured as 1.8V input/output. According to specific usage scenarios and circuit design, please evaluate whether the output stage that is indeterminate when the power is just turned on meets the customer's application design requirements. 2.6. EVB In order to help customers develop applications with EG915U series moduel. Quectel provides an evaluation board (UMTS&LTE EVB), USB to RS-232 converter cable, earphone, antennas and other peripherals to control or test the module. For more details, please refer to document [1]. EG915U_Series_Hardware_Design 24 / 81 LTE Standard Module Series 3 Operating Characteristics

(U)SIM interface EG915U series module have a total of 126 pins, The subsequent chapters will provide detailed descriptions of the following interfaces. Power supply USB interface UART interfaces SPI interface PCM and I2C interfaces Analog audio interfaces ADC interfaces PSM interface*

Status indication USB_BOOT interface 3.1. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters. Table 5: Overview of Operating Modes Mode Details Normal Operation Idle Talk/Data Software is active. The module is registered on the network and ready to send and receive data. Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. Minimum Functionality Mode AT+CFUN=0 command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. Airplane Mode AT+CFUN=4 command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. Sleep Mode In this mode, current consumption of the module will be reduced to the minimal EG915U_Series_Hardware_Design 25 / 81 LTE Standard Module Series level. In this mode, the module can still receive paging, SMS, voice call and TCP/UDP data from network normally. Power Down Mode In this mode, the VBAT power supply is constantly turned on and the software stops working. 3.2. Sleep Mode The module is able to reduce its current consumption to an ultra-low value in the sleep mode. The following section describes power saving procedures of EG915U series module. 3.2.1 UART Application Scenario If the host communicates with module via UART interface, the following preconditions should be met to let the module enter sleep mode. Execute AT+QSCLK=1 to enable sleep mode. Drive MAIN_DTR to high level. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART Driving MAIN_DTR low will wake up the module. When EG915U series has a URC to report, the URC will trigger the behavior of MAIN_RI pin. See Chapter 4.10.3 for details about MAIN_RI behavior. EG915U_Series_Hardware_Design 26 / 81 MAIN_RXDMAIN_TXDMAIN_RIMAIN_DTRAP_READYTXDRXDEINTGPIOGPIOModuleHostGNDGND LTE Standard Module Series 3.2.2. USB Application Scenario If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions can make the module enter the sleep mode. Execute AT+QSCLK=1 to enable the sleep mode. Ensure the MAIN_DTR is kept at high level or kept open. Ensure the hosts USB Bus, which is connected with the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. 3.2.2.1. USB Application with USB Remote Wakeup Function The host supports USB Suspend/Resume and remote wakeup function. The following figure illustrates the connection between the module and the host. Figure 4: Sleep Mode Application with USB Remote Wakeup You can wake up the module by sending data to it through USB. When the module has a URC to report, the module will send remote wakeup signals via USB bus so as to wake up the host. NOTE EG915U_Series_Hardware_Design 27 / 81 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostGNDGND LTE Standard Module Series 1. Under Linux OS, USB support Suspend, under Windows OS nonsupport Suspend. 2. Pay attention to the level match shown in dotted line between the module and the host. EG915U_Series_Hardware_Design 28 / 81 LTE Standard Module Series 3.2.2.2. USB Application with USB Suspend/Resume and MAIN_RI Wakeup Function If the host supports USB Suspend/Resume, but does not support remote wakeup function, the MAIN_RI signal is needed to wake up the host. The following figure shows the connection between the module and the host. Figure 5: Sleep Mode Application with MAIN_RI Sending data to the module through USB will wake up the module. When the module has a URC to report, the URC will trigger the behavior of MAIN_RI pin. EG915U_Series_Hardware_Design 29 / 81 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostGNDGNDMAIN_RIEINT LTE Standard Module Series 3.3. Airplane Mode When the module enters into airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. This mode can be set via the following ways. The W_DISABLE# pin is pulled up by default. Its control function for airplane mode is disabled by default and AT+QCFG=airplanecontrol,1 can be used to enable the function. Driving it low will set the module enter airplane mode. 3.3.1. Hardware 3.3.2. Software AT+CFUN=<fun> provides choices of the functionality level through setting <fun> into 0, 1 or 4. AT+CFUN=0: Minimum functionality (disable RF function and (U)SIM function). AT+CFUN=1: Full functionality (default). AT+CFUN=4: Airplane mode (disable RF function). 3.4. Power Supply 3.4.1. Power Supply Pins The module provides 4 VBAT pins for connection with an external power supply. Two VBAT_RF pins for RF part. Two VBAT_BB pins for BB part. Table 6: Pin Definition of Power Supply Pin Name Pin No. I/O Description Min. Typ. Max. Unit VBAT_BB 32, 33 PI 3.3 3.8 4.3 VBAT_RF 52, 53 PI 3.3 3.8 4.3 Power supply for the modules baseband part Power supply for the modules RF part V V GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67, 68, 69, 70, 71, 72, 73, 74, 79, 80, 81, 82, 89, 90, EG915U_Series_Hardware_Design 30 / 81 LTE Standard Module Series 91, 100, 101, 102 3.4.2. Reference Design for Power Supply The power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of the module should be able to provide sufficient current of 3.0 A at least. If the voltage drops between input and output is not too high, it is suggested that an LDO should be used to supply power to the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is recommended. The following figure illustrates a reference design for +5 V input power source. The typical output of the power supply is about 3.8 V and the maximum load current is 3.0 A. Figure 6: Reference Design of Power Supply 3.4.3. Requirements for Voltage Stability The power supply range of the module is from 3.3 V to 4.3 V. Please make sure the input voltage will never drop below 3.3 V. EG915U_Series_Hardware_Design 31 / 81 DC_INMIC29302WUINOUTENGNDADJ24135VBAT 100K47K470R51K 1 %4.7K47KVBAT_EN470 F470 F100 nF100 nF1 %VBATBurst TransmissionRippleDropBurst Transmission LTE Standard Module Series Figure 7: Power Supply Limits during Burst Transmission To decrease the voltage drop, use bypass capacitors of about 100 F with low ESR (ESR = 0.7 ) and reserve a multi-layer ceramic chip (MLCC) capacitor array due to their ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to the VBAT_SENSE and VBAT_RF pins. When the external power supply is connected to the module, VBAT_SENSE and VBAT_RF need to be routed in star structure. The width of the VBAT_RF trace should not be less than 2.5 mm. When used as a power supply pin (that is, without charging function), the width of the VBAT_SENSE trace should not be less than 1 mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, to avoid the surge, use a TVS diode of which reverse working voltage is 4.7 V and peak pulse power is up to 2550 W. The reference circuit is shown as below:

Figure 8: Power Supply 3.5. Turn on 3.5.1. Turn on with PWPKEY Table 7: Pin Definition of PWRKEY Pin Name Pin No. Description Comment PWRKEY 15 Turn on/off the module VBAT power domain. When the module is in power down mode, you can turn it on to normal mode by driving the PWRKEY pin low for at least 2 s. It is recommended to use an open drain/collector driver to control the PWRKEY. A I/O DI EG915U_Series_Hardware_Design 32 / 81 ModuleVBAT_RFVBAT_BBVBATC1100FC6100nFC733pFC810pF++C2100nFC5100FC333pFC410pFD1WS4.5D3HV LTE Standard Module Series simple reference circuit is illustrated in the following figure. Figure 9: Turing on the Module Using Driving Circuit Another way to control the PWRKEY is using a button directly. When you are pressing the key, electrostatic strike may be generated from finger. Therefore, you must place a TVS component nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 10: Turing on the Module Using Button The power-up scenario is illustrated in the following figure. EG915U_Series_Hardware_Design 33 / 81 PWRKEY4.7K47KTurn-on pulse 2 s10 nFPWRKEYS1Close to S1TVS LTE Standard Module Series Figure 11: Power-up Timing NOTE

. 1. Make sure that the VBAT is stable before pulling down PWRKEY pin. It is recommended that the time difference between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2. PWRKEY can be pulled down directly to GND with a recommended 1 k resistor if the module needs to be powered on automatically and shutdown is not needed. 3.6. Turn off The following procedures can be used to turn off the module:

Using the PWRKEY pin. Using AT+QPOWD. EG915U_Series_Hardware_Design 34 / 81 VIL 0.5 VVBATPWRKEY 2 sRESET_NInactiveActiveUARTNote 1InactiveActiveUSBVDD_EXTAbout 1.15 s 4 s 2.23 s LTE Standard Module Series 3.6.1. Turn off with PWPKEY Drive the PWRKEY pin low for at least 3 s and then release PWRKEY. After this, the module executes power-down procedure. The power-down scenario is illustrated in the following figure. Figure 12: Timing of Turning off Module 3.6.2. Turn off with AT Command It is also a safe way to use AT+QPOWD to turn off the module, which is similar to turning off the module via the PWRKEY pin. Please refer to document [2] for details about AT+QPOWD command. NOTE 1. To avoid damaging internal flash, do not switch off the power supply when the module works normally. Only after shutting down the module with PWRKEY or AT command can you cut off the power supply. 2. When keeping the PWRKEY to the ground and the AT command cannot be used to turn off, the module can only be forced to turn off by cutting off the VBAT power supply. Therefore, we recommend that you can turn on or turn off the module by pulling up and pulling down the PWEKEY instead of keeping the PWRKEY to the ground. 3. The time for the module to log out of the network is related to the current network status, so the specific shutdown time is related to the network status, please pay attention to the shutdown time in the design. EG915U_Series_Hardware_Design 35 / 81 VBATPWRKEY 30 s 3 sRunningPower-down procedureOFFModuleStatus LTE Standard Module Series 3.7. Reset The RESET_N pin can be used to reset the module. The module can be reset by pulling the RESET_N pin low for at least 100 ms and then releasing it. The RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground. Table 8: Pin Description of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 17 DI Reset the module VBAT power domain. If unused, keep it open. The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 13: Reference Circuit of RESET_N by Using Driving Circuit Figure 14: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure. EG915U_Series_Hardware_Design 36 / 81 Reset pulseRESET_N4.7K47K 100 msRESET_NS2Close to S2TVS LTE Standard Module Series Figure 15: Timing of Resetting the Module NOTE 1. Ensure that there is no large capacitance exceeding 10 nF on PWRKEY and RESET_N pins. 2. It is recommended to use RESET_N only when you fail to turn off the module with the AT+QPOWD or PWRKEY pin. EG915U_Series_Hardware_Design 37 / 81 VIL 0.5 VVBATModule StatusRunningRESET_NBaseband restart Baseband resetting 100 ms LTE Standard Module Series 4 Application Interfaces 4.1. Analog Audio Interfaces The module provides one analog audio input channel and one analog audio output channel. The pin definitions are shown in the following table. Table 9: Pin Definition of Analog Audio Interfaces Pin Name Pin No. Description MIC_N MICBIAS SPK_P SPK_N MIC_P 119 120 121 122 126 I/O AI PO AO AO AI Microphone analog input (-) Bias voltage output for microphone Analog audio differential output (+) Analog audio differential output (-) Microphone analog input (+) AI channels are differential input channels, which can be applied for input of microphone (usually an electret microphone is used). AO channels are differential output channels, which can be applied for output receiver. The module's internal audio amplifier is configured as a class AB amplifier by default. 4.1.1. Audio Interfaces Design Considerations It is recommended to use the electret microphone with dual built-in capacitors (e.g., 10 pF and 33 pF) for filtering out RF interference, thus reducing TDD noise. The 33 pF capacitor is applied for filtering out RF interference when the module is transmitting at EGSM900. Without placing this capacitor, TDD noise could be heard. The 10 pF capacitor here is used for filtering out RF interference at DCS1800. Note that the resonant frequency point of a capacitor largely depends on the material and production technique. Therefore, you would have to discuss with your capacitor vendors to choose the most suitable capacitor for filtering out high-frequency noises. The filter capacitors on the PCB board should be placed as close to the audio devices or audio interfaces EG915U_Series_Hardware_Design 38 / 81 LTE Standard Module Series as possible, and the traces should be as short as possible. They should go through the filter capacitors before arriving at other connection points. To reduce radio or other signal interference, RF antennas should be placed away from audio interfaces and audio traces. Power traces should not be parallel with and also should be far away from the audio traces. The differential audio traces must be routed according to the differential signal layout rule. 4.1.2. Microphone Interface Design The microphone channel reference circuit is shown in the following figure. Figure 16: Reference Design for Microphone Interface NOTE MIC channel is sensitive to ESD, so it is not recommended to remove the ESD components used for protecting the MIC. 4.1.3. Receiver Interface Design The receiver channel reference circuit is shown in the following figure:

EG915U_Series_Hardware_Design 39 / 81 MIC_PDifferential layoutModule10 pF33 pF33 pF33 pFElectret Microphone10 pF10 pFTVSTVSClose to ModuleMIC_NMIC_BIASClose to Microphone2.2uF100nF1K0R0R100nF1K510R510R1.5K1.5K LTE Standard Module Series Figure 17: Reference Design for Receiver Interface 4.2. USB Interface EG915U series module provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports full-speed (12 Mbps) and high-speed (480 Mbps) modes. The USB interface can only serve as a slave device and is used for AT command communication, data transmission, software debugging and firmware upgrade. Table 10: Functions of the USB Interface Functions Data communication with external AP AT command communication Data transmission GNSS NMEA output Software debugging Firmware upgrade Voice over USB Y Y Y N Y Y N EG915U_Series_Hardware_Design 40 / 81 SPK_N0R0RSPK_PModuleClose to ReceiverNF33 pF10 pF33 pFDifferential layout0603TVSTVS0R0R LTE Standard Module Series Table 11: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_VBUS AI USB connection detect USB_DP USB_DM 8 9 10 AIO USB differential data (+) AIO USB differential data (-) Typical 5.0 V Minimum 3.5 V USB 2.0 compliant. Require differential impedance of 90 . If unused, keep it open. For more details about the USB 2.0 specifications, visit http://www.usb.org/home. It is recommended to reserve test points for debugging and firmware upgrade in your design. The following figure shows a reference circuit of USB interface. Figure 18: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and your MCU to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4 ) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. To ensure the signal integrity of USB data lines, L1, R3 and R4 must be placed close to the module, and resistors R3 and R4 should be placed close to each other. The extra stubs of trace must be as short as possible. When designing the USB interface, you should follow the following principles to meet USB 2.0 specification. Route the USB signal traces as differential pairs with ground surrounded. The impedance of USB differential trace is 90 . Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. Route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that EG915U_Series_Hardware_Design 41 / 81 USB_DPUSB_DMGNDUSB_DPUSB_DMGNDL1Close to ModuleR3R4Test PointsESD ArrayNM_0RNM_0RMinimize these stubsModuleMCUUSB_VBUSUSB_VBUS LTE Standard Module Series layer and ground planes above and below. Pay attention to the selection of the ESD component on the USB data line. Its stray capacitance should not exceed 2 pF and should be placed as close as possible to the USB connector. 4.3. USB_BOOT Interface The module provides a USB_BOOT pin. You can pull up USB_BOOT to VDD_EXT before power-up and the module will enter download mode when it is turned on. In this mode, the module supports firmware upgrade over USB interface. Table 12: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 75 DI Control pin for module to enter download mode The following figure shows a reference circuit of USB_BOOT interface. 1.8 V power domain. Active high. A circuit that enables the module to enter the download mode must be reserved. Figure 19: Reference Circuit of USB_BOOT Interface EG915U_Series_Hardware_Design 42 / 81 ModuleUSB_BOOTVDD_EXT4.7KTest pointTVSClose to test pointGND213 LTE Standard Module Series 4.4. (U)SIM Interface The module provides 2 (U)SIM interfaces, dual SIM single stand by. The (U)SIM interfaces circuitry meets ETSI requirement. Both 1.8 V and 3.0 V (U)SIM cards are supported. Table 15: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. USIM1_VDD 43 PO

(U)SIM1 card power supply USIM1_DATA 45 DIO

(U)SIM1 card data USIM1_CLK 46 DO

(U)SIM1 card clock USIM1_RST 44 DO

(U)SIM1 card reset USIM1_DET 42 DI

(U)SIM1 card hot-plug detect 1.8 V power domain. If unused, keep this pin open USIM1_GND 47 Specified ground for (U)SIM1 card USIM2_VDD 87 PO

(U)SIM2 card power supply Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. USIM2_DATA 86 IO

(U)SIM2 card data USIM2_CLK 84 DO

(U)SIM2 card clock USIM2_RST 85 DO

(U)SIM2 card reset USIM2_DET 83 DI

(U)SIM2 card hot-plug detect 1.8 V power domain. If unused, keep it open EG915U series module supports (U)SIM card hot-plug via the USIM_DET pin and both high and low level detections are supported. By default, the function is disabled, please see AT+QSIMDET in document [2]

for more details. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. EG915U_Series_Hardware_Design 43 / 81 LTE Standard Module Series Figure 20: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 21: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector To enhance the reliability and availability of the (U)SIM card in applications, follow the criteria below in

(U)SIM circuit design:

Place (U)SIM card connector as close to the module as possible. Keep the trace length less than Keep (U)SIM card signals away from RF and VBAT traces. Ensure the USIM_VDD has a bypass capacitor less than 1 F, and the capacitor should be close to 200 mm as far as possible. the (U)SIM card connector. EG915U_Series_Hardware_Design 44 / 81 ModuleUSIM_VDDGNDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_DET0R0R0RVDD_EXT51K100 nFGNDGND33 pF33 pF33 pFVCCRSTCLKIOVPPGNDGNDUSIM_VDD15K(U)SIM Card ConnectorSwitchModuleUSIM_VDDGNDUSIM_RSTUSIM_CLKUSIM_DATA0R0R0R100 nFGND33 pF33 pF33 pFVCCRSTCLKIOVPPGNDGND15KUSIM_VDD(U)SIM Card Connector LTE Standard Module Series To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. To offer good ESD protection, it is recommended to add a TVS diode array of which the parasitic capacitance should be less than 15 pF. Add 0 resistors in series between the module and the

(U)SIM card to facilitate debugging. The 33 pF capacitors are used for filtering interference of EGSM900. Additionally, keep the (U)SIM peripheral circuit close to the (U)SIM card connector. The pull-up resistor on USIM_DATA can improve anti-jamming capability of the (U)SIM card. If the

(U)SIM card traces are too long, or the interference source is relatively close, it is recommended to add a pull-up resistor near the (U)SIM card connector. 4.5. I2C and PCM Interfaces The module provides one I2C interface and one pulse code modulation (PCM) interface. The PCM interface of the module only supports slave mode; therefore, the clock signal of the codec IC needs to be provided externally. Table 13: Pin Definition of I2C and PCM Interfaces Pin Name Pin No. I/O Description Comment I2C _SCL 40 OD I2C serial clock External pull-up resistor is required. 1.8 V only. If unused, keep it open. If the I2C interface is used to connect to external codec, it cannot connect to other external devices. 1.8 V power domain. If unused, keep it open. Support slave mode only. I2C _SDA 41 OD I2C serial data PCM_DIN DI PCM data input PCM_DOUT DO PCM data output PCM_SYNC PCM_CLK DI DI PCM data frame sync PCM clock 6 7 5 4 The following figure shows a reference design of PCM interface with external codec IC. EG915U_Series_Hardware_Design 45 / 81 LTE Standard Module Series Figure 22: Reference Circuit of I2 C and PCM Application with Audio Codec NOTE 1. It is recommended to reserve an RC (R = 22 , C = 22 pF) circuit on the PCM traces, especially for PCM_CLK. 2. The I2 C interface supports simultaneous connection of multiple peripherals except for codec IC. In other words, if a codec IC has been mounted on the I2 C bus, no other peripherals can be mounted; if there is no codec IC on the bus, multiple peripherals can be mounted. 4.6. UART Interfaces The module provides three UART interfaces: the main UART interface and the debug UART interface and auxiliary UART. Their features are described as follows. Main UART interface supports 4800 bps, 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps, 230400 bps, 460800 bps and 921600 bps baud rates, and the default is 115200 bps. This interface is used for data transmission and AT command communication. Debug UART interface supports 921600 bps baud rate. It is used for the output of partial logs. Auxiliary UART. Table 14: Pin Definition of Main UART Interface Pin Name Pin No. I/O Description Comment MAIN_CTS 36 DO DTE clear to send signal to DCE (connect to DTEs CTS) 1.8 V power domain. If unused, keep it EG915U_Series_Hardware_Design 46 / 81 PCM_DINPCM_DOUTPCM_SYNCPCM_CLKI2C_SCLI2C_SDAModule4.7K4.7KBCLKLRCKDACADCSCLSDABIASMICBIASINPINNLOUTPLOUTNCodec1.8 VExternal 26MHz Crystal0RNM 0RCAM_MCLKMCLK LTE Standard Module Series MAIN_RTS MAIN_RXD MAIN_DCD MAIN_TXD MAIN_RI MAIN_DTR 37 34 38 35 39 30 DI DI DTE request to send signal to DCE (connect to DTEs RTS) open. Main UART receive DO Main UART data carrier detect DO Main UART transmit DO Main UART ring indication DI Main UART data terminal ready Table 15: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_RXD DBG_TXD 22 23 DI DO Debug UART receive Debug UART transmit 1.8 V power domain. If unused, keep it open. Table 16: Auxiliary UART Pin Name Pin No. I/O Description Comment AUX_TXD AUX_RXD 27 28 DO DI Auxiliary UART transmit Auxiliary UART receive 1.8 V power domain. If unused, keep it open. The module provides 1.8 V UART interfaces. Use a level shifter if the application is equipped with a 3.3 V UART interface. A level shifter TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. EG915U_Series_Hardware_Design 47 / 81 VCCAVCCBOEA1A2A3A4A5A6A7A8GNDB1B2B3B4B5B6B7B8VDD_EXTMAIN_RIMAIN_DCDMAIN_RTSMAIN_RXDMAIN_DTRMAIN_CTSMAIN_TXD51K51K0.1 F0.1 FRI_MCUDCD_MCURTS_MCUTXD_MCUDTR_MCUCTS_MCURXD_MCUVDD_MCUTranslator10K120KConnect the MCU CTS pinConnect the MCU RTS pinConnect the MCU RXD pinConnect the MCU TXD pin LTE Standard Module Series Figure 23: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as follows. For the design of circuits in dotted lines, please refer to that of the circuits in solid lines, but please pay attention to the direction of connection. Figure 24: Reference Circuit with Transistor Circuit NOTE 1. Transistor circuit solution is not suitable for applications with baud rates exceeding 460 kbps. 2. Please note that the module CTS is connected to the host CTS, and the module RTS is connected to the host RTS. 4.7. ADC Interface The module provides two analog-to-digital converter (ADC) interfaces. You can use AT+QADC=0 to read the voltage value on ADC0 pin, AT+QADC=1 to read the voltage value on ADC1, See document [2] for more details. In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground. EG915U_Series_Hardware_Design 48 / 81 MCU/ARMTXDRXDVDD_EXT10KVCC_MCU4.7K10KVDD_EXTMAIN_TXDMAIN_RXDMAIN_RTSMAIN_CTSMAIN_DTRMAIN_RIRTSCTSGNDGPIOMAIN_DCDModuleGPIOEINTVDD_EXT4.7KGND1 nF1 nF LTE Standard Module Series Table 17: Pin Definition of ADC Interface Pin Name Pin No. I/O Description Comment ADC0 ADC1 24 2 AI AI General-purpose ADC interface A 1 k series resistor is required for use. If unused, keep it open. Table 21: Characteristics of ADC Interface Name Min. Typ. ADC0 Voltage Range 0.1 ADC1 Voltage Range 0.1 ADC Resolution

12 Max. VBAT VBAT

Unit V V bits NOTE 1. The input voltage of ADC should not exceed its corresponding voltage range. It is prohibited to supply any voltage to ADC pin when VBAT is removed. 2. It is recommended to use resistor divider circuit for ADC application. 3. If input voltage of ADC interface is designed with a resistor divider circuit, the resistance value of the 4. external divider resistor must be less than 100 k, otherwise the measurement accuracy of the ADC will be reduced significantly. EG915U_Series_Hardware_Design 49 / 81 SPI_CLK SPI_CS SPI_DIN NOTE LTE Standard Module Series 4.8. SPI Interface The module provides one SPI interface that only supports master mode. It has a working voltage of 1.8 V and a maximum clock frequency of 25 MHz. Table 22: Pin Definition of SPI Interface Pin Name Pin No. I/O Description Comment 26 25 88 64 DO SPI clock DO SPI chip select DI SPI master mode input Just master mode only. 1.8 V power domain. If unused, keep it open. SPI_DOUT DO SPI master mode output When the universal 4-wire SPI interface is connected to NOR Flash, it supports basic Flash reading, writing, erasing and other operations, but you need to perform wear leveling. It does not support file system and can only be used for storage purpose. 4.9. PSM Interface*

The module supports power saving mode (PSM). It enters the PSM mode through the following AT commands when working normally. AT+CFUN=4: Enter airplane mode. AT+QSCLK=3: Enable PSM. AT+CFUN=1: Exit airplane mode. Pulling the PSM_EINT pin up externally or setting the timer in software will enable the module to exit PSM. EG915U_Series_Hardware_Design 50 / 91 LTE Standard Module Series Table 18: Pin Definition of PSM Interface Pin Name Pin No. I/O Description PSM_IND PSM_EINT 1 96 DO DI A reference circuit is shown in the following figure. Indicate the modules power saving mode External interrupt pin; Wake up the module from PSM. Comment VRTC power domain VRTC power domain Figure 25: Reference Circuit of Wake up Module from PSM 4.10. Indication Signal Table 19: Pin Definition of Indication Signal Pin Name Pin No. I/O Description Comment STATUS DO Indicate the module's operation status AP_READY DI Application processor ready NET_STATUS DO Indicate the module's network activity status 20 19 21 1.8 V power domain. If unused, keep it open. EG915U_Series_Hardware_Design 51 / 91 TVSTVSS1ModulePSM_EXT_INTVRTC2.2KClose to S1 LTE Standard Module Series 4.10.1. Network Status Indication The network indication pins NET_STATUS can drive the network status indicators. The following tables describe pin definition and logic level changes in different network status. Table 20: Working State of Network Connection Status/Activity Indication Pin Name Status Network Status Flicker slowly (200 ms high/1800 ms low) Network searching NET_STATUS Flicker quickly (234 ms high/266 ms low) Idle Flicker rapidly (63 ms low /62 ms high) Data transfer is ongoing Always high Voice calling Figure 26: Reference Circuit of Network Status Indication 4.10.2. STATUS The STATUS pin is an open drain output for indicating the modules operation status. It will output high level when module is powered ON successfully. EG915U_Series_Hardware_Design 52 / 91 4.7K470KVBAT2.2KModuleNET_STATUS LTE Standard Module Series Table 21: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment A reference circuit is shown as below. Figure 27: Reference Circuits of STATUS NOTE NOTE 4.10.3. MAIN_RI AT+QCFG= risignaltype, physical command can be used to configure MAIN_RI behavior. No matter on which port a URC is presented, the URC will trigger the behavior of MAIN_RI. The URC can be outputted via UART port, USB AT port and USB modem port, which can be set by AT+QURCCFG command. The default port is USB AT port. In addition, MAIN_RI behavior can be configured flexibly. The default behavior of the MAIN_RI is shown as below. EG915U_Series_Hardware_Design 53 / 91 4.7K47KVBAT2.2KModule STATUS LTE Standard Module Series Table 22: Behaviors of the MAIN_RI State Idle URC Response MAIN_RI keeps at high level. MAIN_RI outputs 120 ms low pulse when a new URC return. The MAIN_RI behavior can be changed via AT+QCFG="urc/ri/ring"*. Please refer to document [2] for details. 4.11. Control Signal Table 23: Pin Definition of Control Signal Pin Name Pin No. I/O Description Comment W_DISABLE#

18 DI Airplane mode control 1.8 V power domain. Pulled up by default. When it is in low voltage level, the module can enter airplane mode. If unused, keep this pin open. The module provides a W_DISABLE# pin to enable or disable airplane mode through hardware operation. W_DISABLE# is pulled up by default, and driving it low will set the module to airplane mode. Its control function for airplane mode is disabled by default and AT+QCFG= airplanecontrol, 1 can be used to enable the function. AT+CFUN=<fun> command provides the choice of the functionality level through setting <fun> into 0, 1 or 4. AT+CFUN=0: Minimum functionality mode (RF functions are disabled). AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: RF function is disabled (Airplane mode). EG915U_Series_Hardware_Design 54 / 91 LTE Standard Module Series 5 Antenna Interfaces EG915U series module provides a main antenna interface, a Bluetooth/Wi-Fi Scan antenna interface. The impedance of antenna ports is 50 . 5.1. Main Antenna Interface 5.1.1. Pin Definition Table 24: Pin Definition of RF Antennas Pin Name Pin No. I/O Description Comment ANT_MAIN 60 AIO Main antenna interface 50 impedance. ANT_BT/WIFI_SCAN 56 AIO The shared interface for Bluetooth and Wi-Fi Scan Bluetooth and Wi-Fi Scan cannot be used simultaneously; Wi-Fi Scan can only receive but not transmit. 50 impedance. If unused, keep it open. NOTE Only passive antennas are supported. 5.1.2. Operating Frequency Table 25: Operating Frequency of EG915U-CN Operating Frequency Transmit (MHz) Receive (MHz) EG915U_Series_Hardware_Design 55 / 91 LTE Standard Module Series EGSM900 DCS1800 LTE-B1 LTE-B3 LTE-B5 LTE-B8 LTE-B34 LTE-B38 LTE-B39 LTE-B40 LTE-B41 GSM850 PCS1900 EGSM900 DCS1800 LTE-B1 LTE-B3 LTE-B5 LTE-B7 LTE-B8 LTE-B20 LTE-B28 880-915 1710-1785 1920-1980 1710-1785 824-849 880-915 2010-2025 2570-2620 1880-1920 2300-2400 2535-2675 824-849 1850-1910 880-915 1710-1785 1920-1980 1710-1785 824-849 2500-2570 880-915 832-862 703-748 925-960 1805-1880 2110-2170 1805-1880 869-894 925-960 2010-2025 2570-2620 1880-1920 2300-2400 2535-2675 869-894 1930-1990 925-960 1805-1880 2110-2170 1805-1880 869-894 2620-2690 925-960 791-821 758-803 Table 26: Operating Frequency of EG915U-EU Operating Frequency Transmit (MHz) Receive (MHz) EG915U_Series_Hardware_Design 56 / 91 LTE Standard Module Series Table 27: Operating Frequency of EG915U-LA Operating Frequency Transmit (MHz) Receive (MHz) 824-849 1850-1910 880-915 1710-1785 1850-1910 1710-1785 1710-1755 824-849 2500-2570 880-915 703-748 869-894 1930-1990 925-960 1805-1880 1930-1990 1805-1880 2110-2155 869-894 2620-2690 925-960 758-803 1710-1780 2110-2200 GSM850 PCS1900 EGSM900 DCS1800 LTE-B2 LTE-B3 LTE-B4 LTE-B5 LTE-B7 LTE-B8 LTE-B28 LTE-B66 NOTE Only EG915U-CN supports LTE-TDD. 5.1.3. Reference Design of Antenna Interface A reference design of ANT_MAIN pin and ANT_BT/WIFI_SACN pin are shown as below. A -type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. EG915U_Series_Hardware_Design 57 / 91 LTE Standard Module Series Figure 28: Reference Circuit of RF Antenna 5.1.4. Operating Frequency For users PCB, the characteristic impedance of all RF traces should be controlled as 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between the RF traces and the ground (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 29: Microstrip Design on a 2-layer PCB EG915U_Series_Hardware_Design 58 / 91 ANT_MAINR1 0RC1ModuleMain antennaNMC2NMR2 0RC3Wi-Fi Scan/antennaNMC4NMANT_BT/WIFI_SCAN LTE Standard Module Series Figure 30: Coplanar Waveguide Design on a 2-layer PCB Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

EG915U_Series_Hardware_Design 59 / 91 LTE Standard Module Series Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . connected to ground. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [3]. GSM/LTE 5.2. Antenna Installation 5.2.1. Antenna Design Requirement Table 28: Requirements for Antenna Design Type Requirements VSWR: 2 Efficiency: > 30 %

Max input power: 50 W Input impedance: 50 Cable insertion loss:

< 1 dB: LB< 1 GHz

< 1.5 dB: MB12.3 GHz

< 2 dB: HB> 2.3 GHz 5.2.2. RF Connector Recommendtion If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. EG915U_Series_Hardware_Design 60 / 91 LTE Standard Module Series Figure 33: Dimensions of U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 34: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. EG915U_Series_Hardware_Design 61 / 91 LTE Standard Module Series Figure 35: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com. EG915U_Series_Hardware_Design 62 / 91 LTE Standard Module Series 6 Electrical Characteristics & Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 32: Absolute Maximum Ratings Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage on Digital Pins

-0.3 Voltage at ADC0 Voltage at ADC1 Min.

-0.3

-0.3 0 0 0 0 6.2. Power Supply Ratings Max. Unit 6.0 5.5 1.0 2.5 2.3 VBAT VBAT V V A A V V V Table 29: The Modules Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF VBAT The actual input voltages must stay between the minimum and maximum values. 3.3 3.8 4.3 V Voltage drop during transmitting burst Maximum power control level at EGSM 900

400 mV EG915U_Series_Hardware_Design 63 / 91 LTE Standard Module Series Voltage drop during peak data rate Peak supply current

(during transmission slot) USB connection detection

IVBAT USB_VBUS Maximum power control level at EGSM 900 1.7 2.5 A

mV

3.5 5.0 5.25 V 6.3. Operation and Storage Temperatures Table 30: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit Operating Temperature Range 6

-35 Extended Operation Range 7 Storage Temperature Range

-40

-40

+25

+25

+25

+75

+85

+90 C C C 6.4. Power Consumption Table 31: EG915U-CN Current Consumption EG915U-CN Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) Sleep state AT+CFUN=0 (USB connected) AT+CFUN=4 (USB disconnected) 32 1.0 2.2 1.0 A mA mA mA 6 Within operating temperature range, the module is 3GPP compliant. 7 Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. EG915U_Series_Hardware_Design 64 / 91 LTE Standard Module Series AT+CFUN=4 (USB connected) 2.3 EGSM @ DRX = 2 (USB disconnected) 2.0 EGSM @ DRX = 5 (USB disconnected) 1.5 EGSM @ DRX = 5 (USB connected) 2.7 EGSM @ DRX = 9 (USB disconnected) 1.3 DCS @ DRX = 2 (USB disconnected) DCS @ DRX = 5 (USB disconnected) DCS @ DRX = 5 (USB connected) DCS @ DRX = 9 (USB disconnected) 2.0 1.5 2.7 1.3 LTE-FDD @ PF = 32 (USB disconnected) 2.5 LTE-FDD @ PF = 64 (USB disconnected) 1.8 LTE-FDD @ PF = 64 (USB connected) 3.0 LTE-FDD @ PF = 128 (USB disconnected) 1.4 LTE-FDD @ PF = 256 (USB disconnected) 1.2 LTE-TDD @ PF = 32 (USB disconnected) 2.5 LTE-TDD @ PF = 64 (USB disconnected) 1.8 LTE-TDD @ PF = 64 (USB connected) 3.1 LTE-TDD @ PF = 128 (USB disconnected) 1.4 LTE-TDD @ PF = 256 (USB disconnected) 1.2 EGSM @ DRX = 5 (USB disconnected) 12.2 EGSM @ DRX = 5 (USB connected) 28.5 LTE-FDD @ PF = 64 (USB disconnected) 12.5 LTE-FDD @ PF = 64 (USB connected) 29.0 LTE-TDD @ PF = 64 (USB disconnected) 12.5 LTE-TDD @ PF = 64 (USB connected) 29.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle state LTE data transfer LTE-FDD B1 @ 22.93 dBm 571 EG915U_Series_Hardware_Design 65 / 91 LTE Standard Module Series LTE-FDD B3 @ 22.86 dBm LTE-FDD B5 @ 23.51 dBm LTE-FDD B8 @ 22.79 dBm LTE-FDD B34 @ 23.32 dBm LTE-FDD B38 @ 23.29 dBm LTE-FDD B39 @ 23.15 dBm LTE-FDD B40 @ 22.97 dBm LTE-FDD B41 @ 23.06 dBm GSM900 4DL/1UL @ 32.86 dBm GSM900 3DL/2UL @ 30.86 dBm GSM900 2DL/3UL @ 28.81 dBm GSM900 1DL/4UL @ 26.63 dBm DCS1800 4DL/1UL @ 30.13 dBm DCS1800 3DL/2UL @ 28.12 dBm DCS1800 2DL/3UL @ 26.01 dBm DCS1800 1DL/4UL @ 23.94 dBm GSM900 PCL=5 @ 32.83 dBm GSM900 PCL=12 @ 18.94 dBm GSM900 PCL=19 @ 6.18 dBm DCS1800P CL=0 @ 30.12 dBm DCS1800P CL=7 @ 15.97 dBm DCS1800P CL=15 @ 0.28 dBm GSM900 PCL=5 @ 32.83 dBm GSM900 PCL=12 @ 18.94 dBm GSM900 PCL=19 @ 6.18 dBm DCS1800P CL=0 @ 30.12 dBm 583 527 568 268 300 241 284 296 226 343 392 405 160 221 249 258 245 90 63 176 75 57 1.77 0.44 0.18 1.18 GPRS data transfer GSM voice call GSM voice call

(Max. Current) mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA A A A A EG915U_Series_Hardware_Design 66 / 91 LTE Standard Module Series DCS1800P CL=7 @ 15.97 dBm DCS1800P CL=15 @ 0.28 dBm 0.3 0.15 A A Table 32: EG915U-EU Current Consumption EG915U-EU Description Conditions OFF state Power down Sleep state DCS @ DRX = 2 (USB disconnected) Typ. 43 1.01 2.2 1.02 2.21 2.09 1.55 2.67 1.39 2.1 1.5 2.78 1.36 AT+CFUN=0 (USB disconnected) AT+CFUN=0 (USB connected) AT+CFUN=4 (USB disconnected) AT+CFUN=4 (USB connected) EGSM @ DRX = 2 (USB disconnected) EGSM @ DRX = 5 (USB disconnected) EGSM @ DRX = 5 (USB connected) EGSM @ DRX = 9 (USB disconnected) DCS @ DRX = 5 (USB disconnected) DCS @ DRX = 5 (USB connected) DCS @ DRX = 9 (USB disconnected) LTE-FDD @ PF = 32 (USB disconnected) 3.49 LTE-FDD @ PF = 64 (USB disconnected) 2.22 LTE-FDD @ PF = 64 (USB connected) 3.48 LTE-FDD @ PF = 128 (USB disconnected) 1.63 LTE-FDD @ PF = 256 (USB disconnected) 1.34 Unit A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle state EGSM @ DRX = 5 (USB disconnected) 12.05 EG915U_Series_Hardware_Design 67 / 91 LTE Standard Module Series EGSM @ DRX = 5 (USB connected) 27.3 LTE-FDD @ PF = 64 (USB disconnected) 12.38 LTE-FDD @ PF = 64 (USB connected) 27.58 LTE data transfer LTE-FDD B7 @ 22.95 dBm LTE-FDD B1 @ 22.29 dBm LTE-FDD B3 @ 22.88 dBm LTE-FDD B5 @ 23.01 dBm LTE-FDD B8 @ 23.17 dBm LTE-FDD B20 @ 23.05 dBm LTE-FDD B28 @ 23.06 dBm GSM850 4DL/1UL @ 32.96 dBm GSM850 3DL/2UL @ 30.7 dBm GSM850 2DL/3UL @ 28.66 dBm GSM850 1DL/4UL @ 26.41 dBm GSM900 4DL/1UL @ 32.31 dBm GSM900 3DL/2UL @ 30.7 dBm GSM900 2DL/3UL @ 28.66 dBm DCS1800 4DL/1UL @ 29.84 dBm DCS1800 3DL/2UL @ 27.89 dBm DCS1800 2DL/3UL @ 25.85 dBm DCS1800 1DL/4UL @ 23.78 dBm PCS1900 4DL/1UL @ 29.68 dBm PCS1900 3DL/2UL @ 27.74 dBm PCS1900 2DL/3UL @ 25.66 dBm 638 617 637 793 696 516 559 266 394 457 464 245 371 445 452 171 242 269 279 171 247 279 GPRS data transfer GSM900 1DL/4UL @ 26.63 dBm mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG915U_Series_Hardware_Design 68 / 91 LTE Standard Module Series PCS1900 1DL/4UL @ 23.59 dBm GSM850 PCL=5 @ 32.82 dBm GSM850 PCL=12 @ 19.08 dBm GSM850 PCL=19 @ 6.12 dBm GSM900 PCL=5 @ 32.34 dBm GSM900 PCL=12 @ 19.06 dBm GSM900 PCL=19 @ 5.39 dBm DCS1800P CL=0 @ 29.89 dBm DCS1800P CL=7 @ 15.96 dBm DCS1800P CL=15 @ 0.95 dBm PCS1900P CL=0 @ 29.66 dBm PCS1900P CL=7 @ 15.59 dBm PCS1900P CL=15 @ 0.58 dBm GSM850 PCL=5 @ 32.82 dBm GSM850 PCL=12 @ 19.08 dBm GSM850 PCL=19 @ 6.12 dBm GSM900 PCL=5 @ 32.34 dBm GSM900 PCL=12 @ 19.06 dBm GSM900 PCL=19 @ 5.39 dBm DCS1800P CL=0 @ 29.89 dBm DCS1800P CL=7 @ 15.96 dBm DCS1800P CL=15 @ 0.95 dBm PCS1900P CL=0 @ 29.66 dBm PCS1900P CL=7 @ 15.59 dBm PCS1900P CL=15 @ 0.58 dBm GSM voice call GSM voice call

(Max. Current) 295 289 111 80 261 109 79 196 91 75 193 93 75 1.88 0.46 0.19 1.72 0.44 0.19 1.13 0.30 0.16 1.10 0.33 0.15 mA mA mA mA mA mA mA mA mA mA mA mA mA A A A A A A A A A A A A EG915U_Series_Hardware_Design 69 / 91 LTE Standard Module Series Table 33: EG915U-LA Current Consumption EG915U-LA Description Conditions OFF state Power down Sleep state DCS @ DRX = 2 (USB disconnected) Typ. 40 0.98 2.38 1.06 2.43 2.22 1.63 3.03 1.48 AT+CFUN=0 (USB disconnected) AT+CFUN=0 (USB connected) AT+CFUN=4 (USB disconnected) AT+CFUN=4 (USB connected) EGSM @ DRX = 2 (USB disconnected) 2.20 EGSM @ DRX = 5 (USB disconnected) 1.65 EGSM @ DRX = 5 (USB connected) 3.07 EGSM @ DRX = 9 (USB disconnected) 1.47 DCS @ DRX = 5 (USB disconnected) DCS @ DRX = 5 (USB connected) DCS @ DRX = 9 (USB disconnected) LTE-FDD @ PF = 32 (USB disconnected) 3.54 LTE-FDD @ PF = 64 (USB disconnected) 2.25 LTE-FDD @ PF = 64 (USB connected) 3.74 LTE-FDD @ PF = 128 (USB disconnected) 1.61 LTE-FDD @ PF = 256 (USB disconnected) 1.32 EGSM @ DRX = 5 (USB disconnected) 13.06 Idle state EGSM @ DRX = 5 (USB connected) 28.73 LTE-FDD @ PF = 64 (USB disconnected) 13.05 LTE-FDD @ PF = 64 (USB connected) 28.61 LTE data transfer LTE-FDD B2 @ 22.63d Bm 694 EG915U_Series_Hardware_Design 70 / 91 Unit uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE Standard Module Series LTE-FDD B3 @ 22.88 dBm LTE-FDD B4 @ 22.94d Bm LTE-FDD B5 @ 23.01 dBm LTE-FDD B7 @ 22.95 dBm LTE-FDD B8 @ 23.17 dBm LTE-FDD B28 @ 23.06 dBm LTE-FDD B66 @ 22.81d Bm GSM850 4DL/1UL @ 32.96 dBm GSM850 3DL/2UL @ 30.7 dBm GSM850 2DL/3UL @ 28.66 dBm GSM850 1DL/4UL @ 26.41 dBm GSM900 4DL/1UL @ 32.31 dBm GSM900 3DL/2UL @ 30.7 dBm GSM900 2DL/3UL @ 28.66 dBm GSM900 1DL/4UL @ 26.63 dBm DCS1800 4DL/1UL @ 29.84 dBm DCS1800 3DL/2UL @ 27.89 dBm DCS1800 2DL/3UL @ 25.85 dBm DCS1800 1DL/4UL @ 23.78 dBm PCS1900 4DL/1UL @ 29.68 dBm PCS1900 3DL/2UL @ 27.74 dBm PCS1900 2DL/3UL @ 25.66 dBm PCS1900 1DL/4UL @ 23.59 dBm GSM850 PCL=5 @ 32.82 dBm 667 718 622 797 644 627 725 269 394 463 473 257 372 456 452 174 244 270 280 179 250 289 295 288 113 80 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA GSM voice call GSM850 PCL=12 @ 19.08 dBm GSM850 PCL=19 @ 6.12 dBm EG915U_Series_Hardware_Design 71 / 91 GPRS data transfer LTE Standard Module Series GSM900 PCL=5 @ 32.34 dBm GSM900 PCL=12 @ 19.06 dBm GSM900 PCL=19 @ 5.39 dBm DCS1800P CL=0 @ 29.89 dBm DCS1800P CL=7 @ 15.96 dBm DCS1800P CL=15 @ 0.95 dBm PCS1900P CL=0 @ 29.66 dBm PCS1900P CL=7 @ 15.59 dBm PCS1900P CL=15 @ 0.58 dBm 261 112 79 187 91 72 196 94 72 mA mA mA mA mA mA mA mA mA 6.5. Tx Power Table 34: EG915U-CN RF Output Power Frequency Bands Max. RF Output Power Min. RF Output Power EGSM900 DCS1800 LTE-FDD LTE-TDD 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB 23 dBm 2 dB

< -39 dBm 23 dBm 2 dB

< -39 dBm Table 35: EG915U-EU RF Output Power Frequency Bands Max. RF Output Power Min. RF Output Power GSM850/EGSM900 33 dBm 2 dB 5 dBm 5 dB DCS1800/PCS1900 30 dBm 2 dB 0 dBm 5 dB LTE-FDD B1/B3/B5/B7/B8/B20/B28 23 dBm 2 dB

< -39 dBm EG915U_Series_Hardware_Design 72 / 91 LTE Standard Module Series Table 36: EG915U-LA RF Output Power Frequency Bands Max. RF Output Power Min. RF Output Power GSM850/EGSM900 33 dBm 2 dB 5 dBm 5 dB DCS1800/PCS1900 30 dBm 2 dB 0 dBm 5 dB LTE-FDD B2/B3/B4/B5/B7/B8/B28/B66 23 dBm 2 dB

< -39 dBm Table 37: EG915U-CN Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary Primary+ Diversity 6.6. Rx Sensitivity Frequency EGSM900 DCS1800 LTE-FDD B1 (10 MHz) LTE-FDD B3 (10 MHz) LTE-FDD B5 (10 MHz) LTE-FDD B8 (10 MHz) LTE-TDD B34 (10 MHz) LTE-TDD B38 (10 MHz) LTE-TDD B39 (10 MHz) LTE-TDD B40 (10 MHz) LTE-TDD B41 (10 MHz)

-108.0

-107.5

-97.3

-98

-99

-99

-98

-97.6

-98.4

-98.3

-97

-102 dBm

-102 dBm

-96.3 dBm

-93.3 dBm

-94.3 dBm

-93.3 dBm

-96.3 dBm

-96.3 dBm

-96.3 dBm

-96.3 dBm

-94.3 dBm EG915U_Series_Hardware_Design 73 / 91 LTE Standard Module Series Table 38: EG915U-EU Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary+ Diversity Frequency GSM850 EGSM900 DCS1800 PCS1900 LTE-FDD B1 (10 MHz) LTE-FDD B3 (10 MHz) LTE-FDD B5 (10 MHz) LTE-FDD B7 (10 MHz) LTE-FDD B8 (10 MHz) LTE-FDD B20 (10 MHz) LTE-FDD B28 (10 MHz) Frequency GSM850 EGSM900 DCS1800 PCS1900 LTE-FDD B2 (10 MHz) LTE-FDD B3 (10 MHz) LTE-FDD B4 (10 MHz) Primary

-108

-106.5

-107.5

-107

-97

-98.3

-97.4

-96.1

-97

-98.3

-98.6

-108

-106.8

-107.5

-107.2

-98.1

-98.2

-97.5

-102 dBm

-102 dBm

-102 dBm

-102 dBm

-96.3 dBm

-93.3 dBm

-94.3 dBm

-94.3 dBm

-93.3 dBm

-93.3 dBm

-94.8 dBm

-102 dBm

-102 dBm

-102 dBm

-102 dBm

-94.3 dBm

-93.3 dBm

-96.3 dBm Table 39: EG915U-LA Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) 3GPP (SIMO) Primary Primary+ Diversity EG915U_Series_Hardware_Design 74 / 91 LTE Standard Module Series

-97.4

-96.1

-97.5

-99.4

-97.9 LTE-FDD B5 (10 MHz) LTE-FDD B7 (10 MHz) LTE-FDD B8 (10 MHz) LTE-TDD B28 (10 MHz) LTE-TDD B66 (10 MHz) 6.7. ESD

-94.3 dBm

-94.3 dBm

-93.3 dBm

-93.3 dBm

-95.8 dBm If the static electricity generated by various ways discharges to the module, the module maybe damaged to a certain extent. Thus, please take proper ESD countermeasures and handling methods. For example, wearing anti-static gloves during the development, production, assembly and testing of the module;

adding ESD protective component to the ESD sensitive interfaces and points in the product design of the module. The following table shows the electrostatics discharge characteristics of the module. Table 40: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND 5 All Antenna Interfaces 4 Other Interfaces 0.5 10 8 1 kV kV kV EG915U_Series_Hardware_Design 75 / 91 LTE Standard Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 7.2 Mechanical Dimensions Figure 36: Module Top and Side Dimensions (Unit: mm) EG915U_Series_Hardware_Design 76 / 91 LTE Standard Module Series Figure 37: Module Bottom Dimensions The package warpage level of the module conforms to the JEITA ED-7306 standard. NOTE EG915U_Series_Hardware_Design 77 / 91 LTE Standard Module Series 7.3 Recommended Footprint Figure 38: Recommended Footprint (TOP View)

. NOTE on the motherboard. 1.2 mm 1. For easy maintenance of the module, keep about 3 mm between the module and other components 2. To keep the reliability of the mounting and soldering, keep the motherboard thickness as at least EG915U_Series_Hardware_Design 78 / 91 LTE Standard Module Series 7.3 Top and Bottom Views Figure 39: Top & Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EG915U_Series_Hardware_Design 79 / 91 LTE Standard Module Series 8 Storage, Manufacturing &

Packaging 5. 8.1 Storage Conditions Module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity should be 3560%. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3. The floor life of the module is 168 8 hours in a plant where the temperature is 23 5 C and relative humidity is below 60%. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a dry environment such as in a drying oven. 8 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. EG915U_Series_Hardware_Design 80 / 91 LTE Standard Module Series NOTE the air is forbidden. 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. 8.2 8.2 Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.180.20 mm. For more details, see document [4]. The peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 40: Recommended Reflow Soldering Thermal Profile EG915U_Series_Hardware_Design 81 / 91 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Max slope: 1~3 C/s Cooling down slope: -1.5 ~ -3 C/s Max slope: 2~3 C/s LTE Standard Module Series Table 41: Recommended Thermal Profile Parameters Soak time (between A and B: 150 C and 200 C) 70120 s Factor Soak Zone Max slope Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE Recommendation 13 C/s 23 C/s 4070 s 235246 C

-1.5 to -3 C/s 1 1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 3. 4. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 5. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g., selective soldering, ultrasonic soldering) that is not mentioned in document [4]. 8.3 Packaging Specifications The module is packaged in tape and reel carriers. One reel is 300 mm long and contains 250 modules. EG915U_Series_Hardware_Design 82 / 91 LTE Standard Module Series The figures below show the package details, measured in mm. Figure 41: Tape Specifications Table 39:Tape Sizemm W 44 P 32 B0 24 T A0 K0 K1 F E 0.35 20.2 3.15 6.65 20.2 1.75 Figure 42: Reel Specifications EG915U_Series_Hardware_Design 83 / 91 LTE Standard Module Series Figure 43: Tape and Reel Directions Packaging Process Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, vacuumize it. Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the vacuum-packed plastic reel into the pizza box. EG915U_Series_Hardware_Design 84 / 91 LTE Standard Module Series Put 4 packaged pizza boxes into 1 cartoon box and seal it. 1 cartoon box can pack 1000 modules. Figure 43: Packaging Process EG915U_Series_Hardware_Design 85 / 91 LTE Standard Module Series 9 Appendix References Table 42: Related Documents Document Name

[1] Quectel_UMTS&LTE_EVB_User_Guide

[2] Quectel_EG915U-EU_Series_AT_Commands_Manual

[3] Quectel_RF_Layout_Application_Note

[4] Quectel_Module_SMT_User_Guide Table 43: Terms and Abbreviations Abbreviation Description ADC Analog-to-Digital Converter AMR-WB Adaptive Multi-Rate Wideband AON AP bps BPSK BW CA CS CSD CS2 Active Optical Network Application Processor Bits Per Second Binary Phase Shift Keying Bandwidth Carrier Aggregation Coding Scheme Circuit Switched Data Commercial Sample II CHAP Challenge Handshake Authentication Protocol EG915U_Series_Hardware_Design 86 / 91 LTE Standard Module Series DC-HSDPA Dual-carrier High Speed Downlink Packet Access CTS DAI DCE DDR DFOTA DL DRX DRX DTE DTR EFR ESD FDD FEM FR GMSK GNSS GPS GRFC HB HPUE HR Clear To Send Digital Audio Interface Data Communications Equipment Double Data Rate Delta Firmware Upgrade Over The Air Downlink Discontinuous Reception Diversity Receive Data Terminal Equipment Data Terminal Ready Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Front-End Module Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System General RF Control High Band High Power User Equipment Half Rate GLONASS Global Navigation Satellite System (Russia) HSDPA High Speed Downlink Packet Access EG915U_Series_Hardware_Design 87 / 91 LTE Standard Module Series I2C Inter-Integrated Circuit HSPA HSUPA IC I2S I/O Inorm LAA LB LED LGA LMHB LNA LTE MAC MB MCU MDC MDIO MHB MIMO MO MS MT NR High Speed Packet Access High Speed Uplink Packet Access Integrated Circuit Inter-IC Sound Input/Output Normal Current License Assisted Access Low Band Light Emitting Diode Land Grid Array Low/Middle/High Band Low Noise Amplifier Long Term Evolution Media Access Control Middle Band Microcontroller Unit Management Data Clock Management Data Input/Output Middle/High Band Multiple Input Multiple Output Mobile Originated Mobile Station Mobile Terminated New Radio EG915U_Series_Hardware_Design 88 / 91 LTE Standard Module Series NSA PA PAP PC PCB PCIe PCM PDA PDU PHY PMIC PRX QAM QPSK QZSS RI RF RGMII RHCP Rx SA SCS SD SIMO SMD Non-Stand Alone Power Amplifier Password Authentication Protocol Personal Computer Printed Circuit Board Peripheral Component Interconnect Express Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Physical Layer Power Management Integrated Circuit Primary Receive Quadrature Amplitude Modulation Quadrature Phase Shift Keying Quasi-Zenith Satellite System Ring Indicator Radio Frequency Reduced Gigabit Media Independent Interface Right Hand Circularly Polarized Receive Stand Alone Sub-Carrier Space Secure Digital Single Input Multiple Output Surface Mount Device EG915U_Series_Hardware_Design 89 / 91 LTE Standard Module Series SMS Short Message Service TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access SoC SPI STB TDD TRX Tx UART UHB UL UMTS URC USB VBAT Vmax Vnom Vmin VIHmax VIHmin VILmax VILmin VImax System on a Chip Serial Peripheral Interface Set Top Box Time Division Duplexing Transmit & Receive Transmit Ultra High Band Uplink Unsolicited Result Code Universal Serial Bus Voltage at Battery (Pin) Maximum Voltage Value Nominal Voltage Value Minimum Voltage Value Universal Asynchronous Receiver/Transmitter Universal Mobile Telecommunications System Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value

(U)SIM Universal Subscriber Identity Module EG915U_Series_Hardware_Design 90 / 91 LTE Standard Module Series Absolute Minimum Input Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Voltage Standing Wave Ratio Wireless Local Area Network Wireless Wide Area Network WCDMA Wideband Code Division Multiple Access VImin VOHmax VOHmin VOLmax VOLmin VSWR WLAN WWAN EG915U_Series_Hardware_Design 91 / 91

QUECT EE EG915U-LA = at-asso7 AB EG91 5ULAAB-NO5-SNNSA SN:E1A1 7JDOAXXXXX1 IMEI:86370303XXXXXX0O FCC 1ID:XMR2021 11EGS15ULA

I 0 5 Hin

1 Q

Quectel Wireless Solutions Co., Ltd Statement We Quectel Wireless Solutions Co., Ltd. declare the following models. Product Name: LTE Module Model Number: EG915-LA Hardware Version: R1.1 The revised R1.1 version of EG915U-LA has no changes in frequency bands. There are three small changes as follows. 1. PCB laminated structure change: from 8 layers 1 step to 10 layers 1 step. Old: New:

2. There was wiring on the bottom surface before, now delete the wiring on the bottom surface. Old: New:

Quectel Wireless Solutions Co., Ltd 3. The device position is changed. Old: New:

Request for Class II Permissive Change FCC ID: XMR202111EG915ULA / Grant Date: 12/02/2021 Pursuant to CFR2.104, Quectel Wireless Solutions Co., Ltd hereby requests a Class III Permissive Change Your assistance on this matter is highly appreciated. Printed Name Jean Hu Signature Date: 2022-02-18 Title:

Tel:

Pursuant to FCC 47 CRF 0.457(d) and 0.459, we request that a part of the subject FCC application listed below be held permanently confidential and permanently withheld from public review due to materials that contain trade secrets and proprietary information not Further, the Applicant has spent substantial effort in developing this product, some aspects of which are deemed to be trade secret and proprietary. Having the subject information easily available to our competitors in this market would negate the advantage we have achieved by developing this product. Not protecting the details of Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Confidentiality Letter Date: 2022.05.13 Federal Communications Commission Authorization and Evaluation Division FCC ID: XMR202111EG915ULA Confidentiality Request customarily released to the public. Schematics the design will result in financial hardship. Sincerely yours, Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511

Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Declaration of authorization Date: 2022.05.13 Product Name: LTE Module Model No.: EG915U-LA FCC ID: XMR202111EG915ULA We, the undersigned, hereby authorize MRT Technology (Suzhou) Co., Ltd to act on our behalf, to act on our behalf in all manners relating to FCC approval of our products: report submittal, related correspondence, the signing of all documents relating to these matters, and any other lawful activity necessary to obtain such certification. Any act carried out by MRT Technology (Suzhou) Co., Ltd within the scope of this authorization shall have the same effects as our own. Name Representative of agent: Marlin Chen Agent Company name: MRT Technology (Suzhou) Co., Ltd Address: D8 Building, Youxin Industrial Park, No.2 Tian'edang Rd., Wuzhong Economic Development Zone, City: Suzhou Country: China If you have any questions regarding the authorization, please dont hesitate to contact us. Sincerely yours, Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511

Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Request for Modular/Limited Modular Approval Date: May 13, 2022 Subject: Manufacturers Declaration for Confidentiality Request for: XMR202111EG915ULA

- Modular Approval

- Split Modular Approval

- Limited Modular Approval - Limited Split Modular Approval 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i) Details: <example The module contains a metal shield which covers all RF components and circuitry. The shield is located on the top of the board next to antenna connector>

Requirement Met

- YES - NO(*) 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii) Details: <example Data to the modulation circuit is buffered as described in the operational description provided with the application>

- YES - NO(*) 3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii) Details: <example The module contains its own power supply regulation. Please refer to schematic filed with this application>

- YES - NO(*) 4. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv) Details: <example The module connects to its antenna using an UFL connector which is considered a non-

standard connector. A list of antennas tested and approved with this device may be found in users manual provided with the application>

- YES - NO(*) 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v) Details: <example The module was tested stand-alone as shown in test setup photographs filed with this application>

- YES - NO(*) 6. The modular transmitter must be labeled with its own FCC ID number, or use an electron Modular Approval Requirement Requirement Met display (see KDB Publication 784748). If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID:

XMR202111EG915ULA or Contains FCC ID: XMR202111EG915ULA Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi) Details: <example There is a label on the module as shown in the labeling exhibit filed with this application. Host specific labeling instructions are shown in the installation manual .filed with this application.>

- YES - NO(*) 7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii) Details: <example The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application.>

- YES - NO(*) 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1)(viii) Details: < The module meets RF exposure in mobile configuration.>

- YES - NO(*) 070920-02b Limited Module Description When Applicable

* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval

(LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA; the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: <example - N/A>

Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Details: <example The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. >

- Provided in Separate Cover Letter Requirement Met

- N/A 2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.

- Provided in Separate Cover Letter

- N/A Details: <example N/A>

Requirement 1. For split modular transmitters, specific descriptions for secure communications Provided in Manual Split Modular Requirements between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained. Details: <example N/A >

- Provided in Separate Cover Letter

- N/A 070920-02b OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?

- YES

- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 D03, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 point systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D03, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc note that omni-directional is not considered a type) 7. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product 8. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 a. Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. b. Provide information on how to configure test modes for evaluation 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10 Sincerely,

- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.

- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511 070920-02b

Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Request for Modular/Limited Modular Approval Date: November 22, 2021 Subject: Manufacturers Declaration for Confidentiality Request for: XMR202111EG915ULA

- Modular Approval

- Split Modular Approval

- Limited Modular Approval - Limited Split Modular Approval 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i) Details: <example The module contains a metal shield which covers all RF components and circuitry. The shield is located on the top of the board next to antenna connector>

Requirement Met

- YES - NO(*) 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii) Details: <example Data to the modulation circuit is buffered as described in the operational description provided with the application>

- YES - NO(*) 3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii) Details: <example The module contains its own power supply regulation. Please refer to schematic filed with this application>

- YES - NO(*) 4. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv) Details: <example The module connects to its antenna using an UFL connector which is considered a non-

standard connector. A list of antennas tested and approved with this device may be found in users manual provided with the application>

- YES - NO(*) 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v) Details: <example The module was tested stand-alone as shown in test setup photographs filed with this application>

- YES - NO(*) 6. The modular transmitter must be labeled with its own FCC ID number, or use an electron Modular Approval Requirement Requirement Met display (see KDB Publication 784748). If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID:

XMR202111EG915ULA or Contains FCC ID: XMR202111EG915ULA Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi) Details: <example There is a label on the module as shown in the labeling exhibit filed with this application. Host specific labeling instructions are shown in the installation manual .filed with this application.>

- YES - NO(*) 7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii) Details: <example The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application.>

- YES - NO(*) 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1)(viii) Details: < The module meets RF exposure in mobile configuration.>

- YES - NO(*) 070920-02b Limited Module Description When Applicable

* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval

(LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA; the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: <example - N/A>

Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Details: <example The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. >

- Provided in Separate Cover Letter Requirement Met

- N/A 2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.

- Provided in Separate Cover Letter

- N/A Details: <example N/A>

Requirement 1. For split modular transmitters, specific descriptions for secure communications Provided in Manual Split Modular Requirements between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained. Details: <example N/A >

- Provided in Separate Cover Letter

- N/A 070920-02b OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?

- YES

- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 D03, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 point systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D03, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc note that omni-directional is not considered a type) 7. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product 8. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 a. Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. b. Provide information on how to configure test modes for evaluation 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10 Sincerely,

- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.

- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511 070920-02b

Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Declaration of authorization Date: 2021.11.21 Product Name: LTE Module Model No.: EG915U-LA FCC ID: XMR202111EG915ULA We, the undersigned, hereby authorize MRT Technology (Suzhou) Co., Ltd to act on our behalf, to act on our behalf in all manners relating to FCC approval of our products: report submittal, related correspondence, the signing of all documents relating to these matters, and any other lawful activity necessary to obtain such certification. Any act carried out by MRT Technology (Suzhou) Co., Ltd within the scope of this authorization shall have the same effects as our own. Name Representative of agent: Marlin Chen Agent Company name: MRT Technology (Suzhou) Co., Ltd Address: D8 Building, Youxin Industrial Park, No.2 Tian'edang Rd., Wuzhong Economic Development Zone, City: Suzhou Country: China If you have any questions regarding the authorization, please dont hesitate to contact us. Sincerely yours, Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511