FCC ID: XMR202112EC200AAU LTE Module

EC200A Series Hardware Design LTE Standard Module Series Version: 1.0.0 Date: 2021-11-12 Status: Preliminary LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. LTE Standard Module Series Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

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Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved. LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergent help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. LTE Standard Module Series About the Document Revision History Version Date Author Description

2021-11-12 Creation of the document 1.0.0 2021-11-12 Preliminary Anthony LIU/

Kexiang ZHANG Anthony LIU/

Kexiang ZHANG LTE Standard Module Series Contents Safety Information .................................................................................................................................... 3 About the Document ................................................................................................................................ 4 Contents .................................................................................................................................................... 5 Table Index ............................................................................................................................................... 7 Figure Index .............................................................................................................................................. 9 1 Introduction ..................................................................................................................................... 11 Special Marks ........................................................................................................................11 1.1. 2 Product Overview ............................................................................................................................ 12 Frequency Bands and Functions .......................................................................................... 13 Key Features ........................................................................................................................ 14 Pin Assignment ..................................................................................................................... 17 Pin Description ..................................................................................................................... 18 EVB ...................................................................................................................................... 23 2.1. 2.2. 2.3. 2.4. 2.5. 3.3. 3.4. 3.1. 3.2. 3 Operating Characteristics .............................................................................................................. 24 Operating Modes .................................................................................................................. 24 Sleep Mode .......................................................................................................................... 25 3.2.1. UART Application ......................................................................................................... 25 3.2.2. USB Application with USB Remote Wakeup Function ................................................. 25 USB Application with USB Suspend/Resume and RI Function .................... 27 3.2.2.1. 3.2.2.2. USB Application without USB Suspend Function ......................................... 27 Airplane Mode ...................................................................................................................... 28 Power Supply ....................................................................................................................... 29 3.4.1. Power Supply Pins ....................................................................................................... 29 3.4.2. Reference Design for Power Supply ............................................................................ 29 3.4.3. Requirements for Voltage Stability ............................................................................... 30 Turn On ................................................................................................................................. 32 Turn on the Module with PWRKEY .............................................................................. 32 Turn Off ................................................................................................................................. 33 Turn off the Module with PWRKEY .............................................................................. 34 Turn off the Module with AT Command ........................................................................ 34 Reset .................................................................................................................................... 34 3.6.1. 3.6.2. 3.5.1. 3.7. 3.5. 3.6. 4 Application Interfaces ..................................................................................................................... 37 USB Interface ....................................................................................................................... 37 USB_BOOT Interface ........................................................................................................... 39

(U)SIM Interface ................................................................................................................... 40 PCM and I2C Interface ......................................................................................................... 42 UART Interface ..................................................................................................................... 45 SDIO Interface ...................................................................................................................... 47 4.1. 4.2. 4.3. 4.4. 4.5. 4.6. LTE Standard Module Series 4.7. 4.8. 4.9. ADC Interface ....................................................................................................................... 48 Indication Signal ................................................................................................................... 49 4.8.1. Network Status Indication ............................................................................................ 50 4.8.2. STATUS ....................................................................................................................... 50 Behaviors of the MAIN_RI .................................................................................................... 51 5.1. 5 RF Specifications ............................................................................................................................ 53 Cellular Network ................................................................................................................... 53 5.1.1. Antenna Interface & Frequency Bands ........................................................................ 53 5.1.2. Tx Power ..................................................................................................................... 57 5.1.3. Rx Sensitivity ............................................................................................................... 57 5.1.4. Reference Design ........................................................................................................ 60 Reference Design of RF Routing .......................................................................................... 61 Requirements for Antenna Design ........................................................................................ 63 RF Connector Recommendation .......................................................................................... 64 5.2. 5.3. 5.4. 6 Electrical Characteristics and Reliability ...................................................................................... 66 Absolute Maximum Ratings .................................................................................................. 66 Power Supply Ratings .......................................................................................................... 67 Power Consumption ............................................................................................................. 68 Digital I/O Characteristic ....................................................................................................... 78 ESD ...................................................................................................................................... 79 Operating and Storage Temperatures ................................................................................... 80 6.1. 6.2. 6.3. 6.4. 6.5. 6.6. 7 Mechanical Information .................................................................................................................. 81 7.1. Mechanical Dimensions ........................................................................................................ 81 Recommended Footprint ...................................................................................................... 83 7.2. Top and Bottom Views .......................................................................................................... 84 7.3. 8 Storage, Manufacturing and Packaging ........................................................................... 85 8.1. Storage Conditions ............................................................................................................... 85 8.2. Manufacturing and Soldering ................................................................................................ 87 Packaging Specifications ...................................................................................................... 88 8.3. 8.3.1. Carrier Tape ................................................................................................................. 88 8.3.2. Plastic Reel .................................................................................................................. 89 8.3.3. Packaging Process ...................................................................................................... 90 9 Appendix References ..................................................................................................................... 91 10 Warnings sentences ....................................................................................................................... 94 LTE Standard Module Series Table Index Table 1: Special Marks ............................................................................................................................. 11 Table 2: Brief Introduction of the Module ................................................................................................. 12 Table 3: Wireless Network Type .............................................................................................................. 13 Table 4: Key Features ............................................................................................................................. 14 Table 5: I/O Parameters Definition ........................................................................................................... 18 Table 6: Pin Description ........................................................................................................................... 18 Table 7: Overview of Operating Modes ................................................................................................... 24 Table 8: Pin Definition of Power Supply ................................................................................................... 29 Table 9: Pin Definition of PWRKEY ......................................................................................................... 32 Table 10: Pin Definition of RESET ........................................................................................................... 35 Table 11: Functions of the USB Interface ................................................................................................ 37 Table 12: Pin Definition of USB Interface ................................................................................................ 37 Table 13: Pin Definition of USB_BOOT Interface .................................................................................... 39 Table 14: Pin Definition of (U)SIM Interface ............................................................................................ 40 Table 15: Pin Definition of PCM Interface ................................................................................................ 43 Table 16: Pin Definition of I2C Interface .................................................................................................. 43 Table 17: Pin Definition of Main UART Interface ..................................................................................... 45 Table 18: Pin Definition of Debug UART Interface ................................................................................... 45 Table 19: Pin Definition of SD Card Interface .......................................................................................... 47 Table 20: Pin Definition of ADC Interface ................................................................................................ 48 Table 21: Characteristics of ADC Interface .............................................................................................. 49 Table 22: Pin Definition of Indication Signal ............................................................................................ 49 Table 23: Working State of the Network Connection Status/Activity Indication ........................................ 50 Table 24: Behaviors of the MAIN_RI ....................................................................................................... 52 Table 25: Pin Definition of Cellular Network Interface .............................................................................. 53 Table 26: Operating Frequency of EC200A-CN....................................................................................... 53 Table 27: Operating Frequency of EC200A-AU ....................................................................................... 54 Table 28: Operating Frequency of EC200A-EU ....................................................................................... 55 Table 29: Tx Power .................................................................................................................................. 57 Table 30: Conducted RF Receiving Sensitivity of EC200A-CN ............................................................... 58 Table 31: Conducted RF Receiving Sensitivity of EC200A-AU ............................................................... 58 Table 32: Conducted RF Receiving Sensitivity of EC200A-EU ............................................................... 59 Table 33: Requirements for Antenna Design ........................................................................................... 63 Table 34: Absolute Maximum Ratings ..................................................................................................... 66 Table 35: The Modules Power Supply Ratings ....................................................................................... 67 Table 36: The Module Power Consumption ............................................................................................. 68 Table 37: 1.8 V I/O Requirements ........................................................................................................... 78 Table 38: (U)SIM 1.8 V I/O Requirements ............................................................................................... 78 Table 39: (U)SIM 3.0 V I/O Requirements ............................................................................................... 78 Table 40: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity) .............................. 79 Table 41: Operating and Storage Temperatures ...................................................................................... 80 LTE Standard Module Series Table 42: Recommended Thermal Profile Parameters ............................................................................ 87 Table 43: Carrier Tape Dimension Table (Unit: mm) ................................................................................ 89 Table 44: Plastic Reel Dimension Table (Unit: mm) ............................................................................ 90 Table 45: Related Documents ................................................................................................................. 91 Table 46: Terms and Abbreviations .......................................................................................................... 91 LTE Standard Module Series Figure Index Figure 2: Pin Assignment (Top View) ....................................................................................................... 17 Figure 3: Sleep Mode Application via UART ............................................................................................ 25 Figure 4: Sleep Mode Application with USB Remote Wakeup ................................................................. 26 Figure 5: Sleep Mode Application with MAIN_RI ..................................................................................... 27 Figure 6: Sleep Mode Application without Suspend Function .................................................................. 28 Figure 7: Reference Design of Power Supply ......................................................................................... 30 Figure 8: Power Supply Limits during Burst Transmission ...................................................................... 30 Figure 9: Star Structure of the Power Supply .......................................................................................... 31 Figure 10: Reference Circuit of Turning on the Module Using Driving Circuit .......................................... 32 Figure 11: Reference Circuit of Turning on the Module with button ......................................................... 32 Figure 12: Power-up Timing .................................................................................................................... 33 Figure 13: Timing of Turning off Module .................................................................................................. 34 Figure 14: Reference Circuit of RESET_N with Driving Circuit ............................................................... 35 Figure 15: Reference Circuit of RESET_N with Button ........................................................................... 35 Figure 16: Timing of Resetting Module .................................................................................................... 36 Figure 17: Reference Circuit of USB Application ..................................................................................... 38 Figure 18: Reference Circuit of USB_BOOT Interface ............................................................................ 39 Figure 19: Timing Sequence for Entering Emergency Download Mode .................................................. 40 Figure 20: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector ......................... 41 Figure 21: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector ........................... 42 Figure 22Timing Sequence for Short frame mode ............................................................................... 43 Figure 23: PCM and I2C Interface Circuit Reference Design ............................................................. 44 Figure 24: Reference Circuit with Translator Chip ................................................................................... 46 Figure 25: Reference Circuit with Transistor Circuit ................................................................................ 46 Figure 26: Reference Circuit of SD Card Interface .................................................................................. 47 Figure 27: Reference Circuit of the Network Status Indication ................................................................ 50 Figure 28: Reference Circuits of STATUS ............................................................................................... 51 Figure 29: Reference Circuit for RF Antenna Interfaces .......................................................................... 60 Figure 30: Microstrip Design on a 2-layer PCB ....................................................................................... 61 Figure 31: Coplanar Waveguide Design on a 2-layer PCB ...................................................................... 61 Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ................... 62 Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ................... 62 Figure 34: Dimensions of U.FL-R-SMT Connector (Unit: mm) ................................................................ 64 Figure 35: Mechanicals of U.FL-LP Connectors ...................................................................................... 64 Figure 36: Space Factor of Mated Connector (Unit: mm) ........................................................................ 65 Figure 37: Module Top and Side Dimensions (Unit: mm) ........................................................................ 81 Figure 38: Module Bottom Dimensions View (Unit: mm) ......................................................................... 82 Figure 39: Recommended Footprint (Bottom View) ................................................................................ 83 Figure 40: Top and Bottom View of the Module ....................................................................................... 84 Figure 41: Recommended Reflow Soldering Thermal Profile .................................................................. 87 Figure 42: Carrier Tape Dimension Drawing ....................................................................................... 89 LTE Standard Module Series Figure 43: Plastic Reel Dimension Drawing ........................................................................................ 89 Figure 44: Packaging Process................................................................................................................. 90 LTE Standard Module Series 1 Introduction This document defines the EC200A series module and describes its air interfaces and hardware interfaces which are connected with customers applications. It can help customers quickly understand interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, customers can use this module to design and to set up mobile applications easily. This document is applicable to the following modules:

EC200A-CN EC200A-AU EC200A-EU 1.1. Special Marks Table 1: Special Marks Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of such model is currently unavailable. Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SD_SDIO_DATA[0:3] refers to all four SD_SDIO_DATA pins, SD_SDIO_DATA0, SD_SDIO_DATA1, SD_SDIO_DATA2, and SD_SDIO_DATA3. LTE Standard Module Series 2 Product Overview EC200A is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity, which provides data connectivity on LTE-FDD, LTE-TDD, HSDPA, HSUPA, HSPA+, WCDMA, EDGE and GPRS network data connection. It also provides voice functionality for your specific applications. EC200A series contains 3 variants: EC200A-CN, EC200A-AU, and EC200A-EU. You can choose a dedicated type based on the region or operator. The following table shows the frequency bands of EC200A series module. Table 2: Brief Introduction of the Module Categories Dimensions Weight Packaging and pins number LCC 80-pin; LGA 64-pin

(29.0 0.15) mm (32.0 0.15) mm (2.4 0.2) mm 4.4 g Wireless network functions LTE/WCDMA/GSM Variants EC200A-CN, EC200A-AU, EC200A-EU LTE Standard Module Series 2.1. Frequency Bands and Functions Table 3: Wireless Network Type Wireless Network Type EC200A-CN EC200A-AU EC200A-EU LTE-FDD B1/B3/B5/B8 B1/B3/B5/B7/B8/B20/B28 B1/B2/B3/B4/B5/B7/B8/

B28/B66 LTE-TDD B34/B38/B39/B40/B41 B40 B38/B40/B41 WCDMA B1/B5/B8 B1/B2/B4/B5/B8 B1/B5/B8 GSM 900/1800 MHz 850/900/1800/1900 MHz 900/1800 MHz LTE Standard Module Series 2.2. Key Features Table 4: Key Features Features Power Supply SMS Details Supply voltage: 3.44.5 V Typical supply voltage: 3.8 V Text and PDU mode. Point-to-point MO and MT. SMS cell broadcast. SMS storage: ME by default.

(U)SIM Interface Supports (U)SIM card: 1.8/3.0 V Supports one digital audio interface: PCM Interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Supports echo cancellation and noise suppression. Used for audio function with external codec Supports 16 format Supports short frame Supports master and slave modes Supports one digital I2C interface. Complies with I2C bus protocol specifications 100/400 kHz. The multi-host mode is not supported. Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480 Mbps Used for AT command communication, data transmission, software debugging and firmware upgrade Supports USB serial driver for Windows 7/8/8.1/10, Linux 2.65.14 and Android 4.x11.x systems Main UART:

Used for AT command communication and data transmission. Baud rate: 115200 bps by default, Max 921600 bps. Supports RTS and CTS hardware flow control. Debug UART:

Used for the output of partial logs SD Interface Supports SD 3.0 protocol. Audio Features PCM Interface I2C Interface USB Interface UART Interfaces LTE Standard Module Series Baud rate: 115200 bps. Network Indication AT Commands NET_MODE and NET_STATUS to indicate network connectivity status. Compliant with 3GPP TS 27.007, 3GPP TS 27.005 and Quectel enhanced AT commands. Rx-diversity Supports LTE Rx-diversity Antenna Interface antenna interface (ANT_DRX) Main antenna interface (ANT_MAIN) and Rx-diversity 50 impedance GSM850: Class 4 (33 dBm 2 dB) EGSM900: Class 4 (33 dBm 2 dB) DCS1800: Class 1 (30 dBm 2 dB) PCS1900: Class 1 (30 dBm 2 dB) GSM850 8-PSK: Class E2 (27 dBm 3 dB) EGSM900 8-PSK: Class E2 (27 dBm 3 dB) DCS1800 8-PSK: Class E2 (26 dBm 3 dB) PCS1900 8-PSK: Class E2 (26 dBm 3 dB) WCDMA: Class 3 (24 dBm +1/-3 dB) LTE-FDD: Class 3 (23 dBm 2 dB) LTE-TDD: Class 3 (23 dBm 2 dB) Supports 3GPP R9 non-CA Cat 4 FDD and TDD Supports 1.4/3/5/10/15 to 20 MHz RF bandwidth Supports MIMO in DL direction Supports uplink QPSK, 16-QAM modulation Supports downlink QPSK, 16-QAM and 64-QAM modulation FDD: Max 150 Mbps (DL)/ 50 Mbps (UL) TDD: Max 130 Mbps (DL)/ 30 Mbps (UL) Supports 3GPP R7 HSPA+/HSDPA/HSUPA and WCD MA Supports QPSK/16-QAM/ 64-QAM modulation HSPA+: Max 21 Mbps (DL) HSUPA: Max 5.76 Mbps (UL) WCDMA: Max 384 kbps (DL)/384 kbps (UL) GPRS:

Supports GPRS multi-slot class 12 Coding scheme: CS 1-4 Max 85.6 kbps (DL)/85.6 kbps (UL) EDGE:

Supports EDGE multi-slot class 12 Supports GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: MCS 1-9 Transmitting Power LTE Features UMTS Features GSM Features LTE Standard Module Series Internet Protocol Features Temperature Range Uplink coding schemes: MCS 1-9 Max 236.8 kbps (DL)/236.8 kbps (UL) Supports TCP/UDP/PPP/NTP/NITZ/FTP/HTTP/PING/CM UX/HTTPS/FTPS/SSL/FILE/MQTT/MMS/SMTP/SMTPS protocols. Supports PAP and CHAP for PPP connections Operating temperature range 1: -35 to +75 C Extended temperature range 2: -40 to +85 C Storage temperature range: -40 to +90 C Firmware Upgrade Use USB interface or DFOTA to upgrade. RoHS All hardware components are fully compliant with EU RoHS directive. 1 Within the operating temperature range, the module meets 3GPP specifications. 2 Within the extended temperature range, the module remains the ability to establish and maintain functions such as voice, SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. LTE Standard Module Series 2.3. Pin Assignment The following figure illustrates the pin assignment of the module. Figure 1: Pin Assignment (Top View) NOTE network. 1. USB_BOOT cannot be pulled up before startup. 2. Other unused and RESERVED pins are kept open, and all GND pins are connected to the ground WAKEUP_INAP_READYRESERVEDW_DISABLE#NET_MODENET_STATUSVDD_EXT100101102106107111112103104109105110899498889397869196859095998792108RESERVEDRESERVED14114211812345678GND9GND10USIM_GND1112DBG_TXD13USIM_DET14USIM_VDD15USIM_DATA16USIM_CLK17USIM_RST18RESERVEDDBG_RXDRESERVED130RESERVED129RESERVED117RESERVED131RESERVED119132RESERVED120RESERVED133RESERVED121RESERVED134RESERVED122RESERVED135RESERVED123RESERVED136RESERVED124RESERVED137RESERVED125RESERVED138RESERVED126RESERVED139127RESERVED140RESERVED128RESERVED116RESERVED115USB_BOOTGND19RESET_N20PWRKEY21GND22SD_DET23PCM_DIN24PCM_DOUT25PCM_SYNC26PCM_CLK27SD_SDIO_DATA328SD_SDIO_DATA229SD_SDIO_DATA130SD_SDIO_DATA031SD_SDIO_CLK32SD_SDIO_CMD33SD_SDIO_VDD34ANT_DRX35GND36GNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDANT_MAINGND144143545352515049484746GND45ADC04443RESERVED42I2C_SDA4140RESERVED393837ADC1I2C_SCLRESERVEDRESERVEDRESERVED114RESERVED113RESERVEDGND72USB_VBUS71USB_DM70USB_DP69MAIN_RXD68676665646362STATUS6160595857GND56RESERVED55828384798081767377747875RESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDMAIN_TXDMAIN_DTRMAIN_RTSMAIN_CTSMAIN_DCDMAIN_RIVBAT_BBVBAT_BBVBAT_RFVBAT_RFSignal PinsPower PinsDebugMainRESERVED(U)USIMSDANTPCM PinsI2CADCUSBRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDGND LTE Standard Module Series 2.4. Pin Description The following table shows the DC characteristics and pin descriptions. Table 5: I/O Parameters Definition Type Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output AI AO AIO DI DO DIO OD PI PO Table 6: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 59, 60 PI Power supply for the modules baseband part VBAT_RF 57, 58 PI Power supply for the modules RF part VDD_EXT 7 PO Provide 1.8 V for external circuit Vnom = 1.8 V IOmax = 50 mA Vmax = 4.5 V Vmin = 3.4 V Vnom = 3.8 V Vmax = 4.5 V Vmin = 3.4 V Vnom = 3.8 V It must be provided with sufficient current up to 0.8 A. It must be provided with sufficient current up to 1.8 A. It can provide a pull-up power to the external LTE Standard Module Series GND 8, 9, 10,19, 22, 36, 46, 48, 5054, 56, 72, 85112 Turn On/Off Pin Name Pin No. I/O Description PWRKEY 21 DI Turn on/off the module DC Characteristics VILmax = 0.5 V RESET_N 20 DI Reset the module Indication Interface Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 61 OD Indicate the module's operation status NET_STATUS 6 DO Indicate the module's network activity status VOHmin = 1.35 V VOLmax = 0.45 V NET_MODE 5 DO Indicate the modules network registration mode VOHmin = 1.35 V VOLmax = 0.45 V USB Interface Pin Name Pin No. I/O Description USB_VBUS AI USB connection detect USB_DP AIO USB differential data (+) 71 69 USB_DM 70 AIO USB differential data (-) DC Characteristics Vmax = 5.25 V Vmin = 3.0 V Vnom = 5.0 V GPIO. If unused, keep it open. Comment VBAT power domain. Active low. 1.8 V power domain. Active low after turn-on. External pull to 1.8 V. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Comment Typ. 5.0 V. If unused, keep it open. 90 differential impedance. USB 2.0 compliant. If unused, keep it open. LTE Standard Module Series

(U)SIM Interface Pin Name Pin No. I/O Description USIM_VDD 14 PO

(U)SIM card power supply USIM_DATA 15 DIO

(U)SIM card data USIM_CLK 16 DO

(U)SIM card clock USIM_RST 17 DO

(U)SIM card reset Comment Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. DC Characteristics 1.8 V (U)SIM Vmax = 1.9 V Vmin = 1.7 V 3.0 V (U)SIM Vmax = 3.05 V Vmin = 2.7 V 1.8 V (U)SIM VILmax = 0.6 V VIHmin = 1.2 V VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM VILmax = 1.0 V VIHmin = 1.95 V VOLmax = 0.45 V VOHmin = 2.55 V 1.8 V (U)SIM VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM VOLmax = 0.45 V VOHmin = 2.55 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V USIM_DET 13 DI

(U)SIM card hot-plug detect SD Interface Pin Name Pin No. I/O Description DC Characteristics Comment SD_SDIO_CLK 32 DO SD card SDIO clock SD_SDIO_CMD 33 DIO SD card SDIO command SD_SDIO_DATA0 31 DIO SD card SDIO bit 0 SD_SDIO_DATA1 30 DIO SD card SDIO bit 1 1.8 V power domain. If unused, keep it open. 1.8/2.8 V power domain. If unused, keep it open. LTE Standard Module Series SD_SDIO_DATA2 29 DIO SD card SDIO bit 2 SD_SDIO_DATA3 28 DIO SD card SDIO bit 3 SD_SDIO_VDD 34 PO SD card SDIO power supply SD_DET*

23 DI SD card hot-plug detect Main UART Interface Pin Name Pin No. I/O Description Comment MAIN_RI MAIN_DCD 62 63 DO DO Main UART ring indication Main UART data carrier detect VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. DC Characteristics VOLmax = 0.45 V VOHmin = 1.35 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V DC Characteristics VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V MAIN_CTS 64 DO MAIN_RTS 65 DI DTE clear to send signal from DCE (Connect to DTEs CTS) DTE request to send signal to DCE (Connect to DTEs RTS) MAIN_DTR DI Main UART data terminal ready MAIN_RXD DI Main UART receive MAIN_TXD DO Main UART transmit 66 68 67 Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_RXD 11 DI Debug UART transmit DBG_TXD 12 DO Debug UART receive I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SCL 41 OD I2C serial clock Used for external codec. An external 1.8 V pull-up resistor is needed. 1.8 V power domain. In master mode, it serves as an output signal. In slave mode, it is used as an input signal. If unused, keep it open. 1.8 V power domain. If unused, keep it open. VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V LTE Standard Module Series I2C_SDA 42 OD I2C serial data PCM Interface Pin Name Pin No. I/O Description DC Characteristics Comment PCM_SYNC 26 DIO PCM data frame sync PCM_CLK 27 DIO PCM clock PCM_DIN 24 DI PCM data input PCM_DOUT 25 DO PCM data output RF Antenna Interface Pin Name Pin No. I/O Description ANT_DRX AI Diversity antenna interface ANT_MAIN AIO Main antenna interface DC Characteristics Comment 50 impedance. Pin Name Pin No. I/O Description DC Characteristics Comment AI AI General-purpose ADC interface Voltage Range:

0 VVBAT_BB If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment 35 49 45 44 ADC Interface ADC0 ADC1 Other Interface LTE Standard Module Series USB_BOOT 115 DI Forces the module to enter download mode WAKEUP_IN*

1 DI Wake up the module AP_READY 2 DI Application processor ready W_DISABLE#

4 DI Airplane mode control RESERVED Pins Pin Name Pin No. RESERVED 3,18, 3740,43, 47, 55, 7384,113, 114, 116144 VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. Active High. It is recommended to reserve test points. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. Pull-up by default. In low voltage level, module can enter into airplane mode. If unused, keep it open. Comment Keep these pins unconnected. 2.5. EVB In order to help customers to develop applications with the module conveniently, Quectel supplies an evaluation board (EVB), USB data cable, earphone, antenna, and other peripherals to control or to test the module. For more details, please refer to document [1]. LTE Standard Module Series 3 Operating Characteristics 3.1. Operating Modes The table below outlines operating modes of the module. Table 7: Overview of Operating Modes Mode Details Normal Operation Idle Talk/Data Software is active. The module is registered on the network and ready to send and receive data. Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. Minimum Functionality Mode AT+CFUN=0 command can set the module to a minimum functionality mode. In this case, both RF function and (U)SIM card will be invalid. Airplane Mode AT+CFUN=4 command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. Sleep Mode In this mode, current consumption of the module will be reduced to the minimal level. In this mode, the module can still receive paging, SMS, voice call and TCP/UDP data from network. Power Down Mode In this mode, the VBAT power supply is constantly turned on and the software stops working. LTE Standard Module Series 3.2. Sleep Mode In sleep mode, the module can reduce power consumption to a very low level, the following section describes power saving procedures of EC200A series module. 3.2.1. UART Application If the host communicates with module via UART interface, the following preconditions should be met to enable the module enter sleep mode. Execute AT+QSCLK=1 to enable sleep mode. Drive MAIN_DTR to high level. The following figure shows the connection between the module and the host. Figure 2: Sleep Mode Application via UART Driving MAIN_DTR to low level by host will wake up the module. When the module has a URC to report, the URC will trigger the behavior of MAIN_RI pin. Please refer to Chapter 4.9 for details about MAIN_RI behavior. 3.2.2. USB Application with USB Remote Wakeup Function If the host supports USB Suspend/Resume and remote wakeup functions, the following three preconditions must be met to let the module enter sleep mode. Execute AT+QSCLK=1 command to enable the sleep mode. Ensure the MAIN_DTR is kept at high level or kept open. MAIN_RXDMAIN_TXDMAIN_RIMAIN_DTRAP_READYTXDRXDEINTGPIOGPIOModuleHostGNDGND LTE Standard Module Series The hosts USB bus, which is connected with the modules USB interface, enters Suspend state. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application with USB Remote Wakeup Sending data to the module through USB will wake up the module. When the module has a URC to report, the module will send remote wakeup signals via USB bus to wake up the host. NOTE The AP_READY is active low and the default state is high. USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostGNDGND LTE Standard Module Series 3.2.2.1. USB Application with USB Suspend/Resume and RI Function If the host supports USB Suspend/Resume, but does not support remote wakeup function, the MAIN_RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode. Execute AT+QSCLK=1 to enable the sleep mode. Ensure the MAIN_DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters Suspend state. The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application with MAIN_RI Sending data to EC200A series through USB will wake up the module. When EC200A series has a URC to report, the URC will trigger the behavior of MAIN_RI pin. Please refer to Chapter 4.9 for details about MAIN_RI behavior. 3.2.2.2. USB Application without USB Suspend Function If the host does not support USB Suspend function, please disconnect USB_VBUS with additional control circuit to let the module enter into sleep mode. Execute AT+QSCLK=1 command to enable the sleep mode. Ensure the MAIN_DTR is held at high level or keep it open. Disconnect USB_VBUS. USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostGNDGNDMAIN_RIEINT LTE Standard Module Series The following figure shows the connection between the module and the host. Figure 5: Sleep Mode Application without Suspend Function Turn on the power switch and supply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and the host. 3.3. Airplane Mode When the module enters into airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. This mode can be set via the following ways. Hardware:

The W_DISABLE# pin is pulled up by default. Its control function for airplane mode is disabled by default, and AT+QCFG=airplanecontrol,1 can be used to enable the function. Driving the pin to low level can make the module enter airplane mode. Software:

AT+CFUN=<fun> command provides choices of the functionality level through setting <fun> into 0, 1 or 4. AT+CFUN=0: Minimum functionality mode (Both (U)SIM and RF functions are disabled.). AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode (RF function is disabled.). USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostMAIN_RIEINTPower SwitchGPIOGNDGND LTE Standard Module Series 3.4. Power Supply 3.4.1. Power Supply Pins The module provides four VBAT pins dedicated to the connection with the external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for modules RF part Two VBAT_BB pins for modules baseband part The following table shows the details of power supply and GND pins. Table 8: Pin Definition of Power Supply Pin Name Pin No. I/O Description Comment VBAT_BB 59, 60 PI VBAT_RF 57, 58 PI VDD_EXT 7 PO Power supply for the modules baseband part Power supply for the modules RF part Provide 1.8V for external circuit It must be provided with sufficient current up to 0.8 A. It must be provided with sufficient current up to 1.8 A. It can provide a pull-up power to the external GPIO. If unused, keep it open. 3.4.2. Reference Design for Power Supply The performance of the module largely depends on the power source. The power supply of the module should be able to provide sufficient current of 3 A at least. If the voltage drops between input and output is not too high, it is suggested that an LDO should be used to supply power to the module. If there is a big voltage difference between input and the desired output VBAT, a buck converter is preferred as the power supply. The following figure shows a reference design for +5 V input power source. The design uses the LDO MIC29302WU from Micrel company. The typical output of the power supply is about 3.8 V and the maximum load current is 3.0 A. LTE Standard Module Series Figure 6: Reference Design of Power Supply NOTE 1. 2. If you use the module that does not support the GSM band, a power supply capable of providing at least 2 A can be used in the design. It is recommended to design switch control for power supply. 3.4.3. Requirements for Voltage Stability The power supply range of the module is from 3.4 V to 4.5 V. Please make sure the input voltage will never drop below 3.4 V. Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100 F with low ESR (ESR = 0.7 ) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to the VBAT_BB and VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star DC_INMIC29302WUINOUTENGNDADJ24135VBAT 100 nF470 F100 nF100K47K470 F330R51K1%1%4.7K47KVBAT_ENVBATRippleDropBurst TransmissionBurst Transmission LTE Standard Module Series structure. The width of VBAT_BB trace should be no less than 1 mm; and the width of VBAT_RF trace should be no less than 2 mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to ensure the stability of power source, it is suggested that a TVS diode of which reverse stand-off voltage is 4.7 V and peak pulse power is up to 2550 W should be used. The following figure shows the star structure of the power supply. Figure 8: Star Structure of the Power Supply ModuleVBAT_RFVBAT_BBVBATC1100FC6100nFC733pFC810pF++C2100nFC5100FC333pFC410pFD1WS4.5D3HV LTE Standard Module Series 3.5. Turn On 3.5.1. Turn on the Module with PWRKEY Table 9: Pin Definition of PWRKEY Pin Name Pin No. I/O Description Comment PWRKEY 21 DI Turn on/off the module VBAT power domain. Active low. When the module is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY. A simple reference circuit is illustrated in the following figure. Figure 9: Reference Circuit of Turning on the Module Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the button, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 10: Reference Circuit of Turning on the Module with button PWRKEY4.7K47K10 nFTurn-on pulse 500 msPWRKEYModuleS1Close to S1TVSTurn-on pulse LTE Standard Module Series The power-up scenario is illustrated in the following figure. Figure 11: Power-up Timing 1. Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time difference between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2. PWRKEY can be pulled down directly to GND with a recommended 4.7 k resistor if module needs to be powered on automatically and shutdown is not needed. 3.6. Turn Off The following procedures can be used to turn off the module:

. NOTE VIL 0.5 VVBATPWRKEY 500 msRESET_NSTATUS(OD)InactiveActiveUARTNOTE 1InactiveActiveUSB 10 sVDD_EXTUSB_BOOT 100 ms. After this time, the pin can be set high level by an external circuit. About 22 msAbout 5 ms 10 s 10 s LTE Standard Module Series 3.6.1. Turn off the Module with PWRKEY Driving the PWRKEY to a low-level voltage for at least 650 ms, then the module will execute power-down procedure after the PWRKEY is released. The timing of turning off the module is illustrated in the following figure. Figure 12: Timing of Turning off Module 3.6.2. Turn off the Module with AT Command It is safe to use AT+QPOWD command to turn off the module, which is equal to turn off the module via PWRKEY Pin. Please refer to document [2] for details about AT+QPOWD command. 1. To avoid damaging internal flash, do not switch off the power supply when the module works normally. Only after shutting down the module with PWRKEY or AT command can you cut off the power supply. 2. When turning off module with the AT command, please keep PWRKEY at high level after the execution of the command. Otherwise, the module will be turned on again after successfully turn-off. 3.7. Reset The module can be reset by driving the RESET_N low for at least 300 ms and then releasing it. The

. NOTE VBATPWRKEY 2 s 650 msRunningPower-down procedureOFFModuleStatusSTATUS(OD) LTE Standard Module Series RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground. Table 10: Pin Definition of RESET Pin Name Pin No. I/O Description Comment RESET_N 20 DI Reset the module 1.8 V power domain. Active low after turn-on. The recommended circuit is equal to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 13: Reference Circuit of RESET_N with Driving Circuit Figure 14: Reference Circuit of RESET_N with Button The timing of resetting module is illustrated in the following figure. Reset pulseRESET_N4.7K47K 300 msRESET_NS2Close to S2TVS LTE Standard Module Series Figure 15: Timing of Resetting Module NOTE and RESET_N pins. management chip. 1. Please ensure that there is no large capacitance with the max value exceeding 10 nF on PWRKEY 2. RESET_N only resets the internal baseband chip of the module and does not reset the power VIL 0.5 VVBATModule StatusRunningRESET_NBaseband restart Baseband resetting 300 ms LTE Standard Module Series 4 Application Interfaces 4.1. USB Interface EC200A series provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports full-speed (12 Mbps) and high-speed (480 Mbps) modes. The USB interface can only serve as a slave device and is used for AT command communication, data transmission, software debugging and firmware upgrade. The following table shows the pin definition of USB interface. Table 11: Functions of the USB Interface Functions AT command communication Data transmission Software debugging Firmware upgrade Pin definition of the USB interface is here as follows:

Table 12: Pin Definition of USB Interface YES YES YES YES Pin Name Pin No. I/O Description Comment USB_VBUS AI USB connection detect USB_DP USB_DM 71 69 70 AIO USB differential data (+) AIO USB differential data (-) Typ. 5.0 V. If unused, keep it open. 90 differential impedance. USB 2.0 compliant. If unused, keep it open. For more details about the USB 2.0 specifications, please visit http://www.usb.org/home. LTE Standard Module Series It is recommended to reserve test points for debugging and firmware upgrade in your designs. The following figure shows a reference circuit of USB interface. Figure 16: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and your MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R1 and R2) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1, R1 and R2 components must be placed close to the module, and also resistors R1 and R2 should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when designing the USB interface, to meet USB specifications. It is important to route the USB signal traces as differential pairs with ground surrounded. The impedance of USB differential trace is 90 . Do not route signal traces under crystals, oscillators, magnetic devices, PCIe and RF signal traces. It is important to route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that layer and ground planes above and below. Junction capacitance of the ESD protection device might cause influences on USB data lines, so please pay attention to the selection of the device. Typically, the stray capacitance should be less than 2 pF for USB. If possible, reserve a 0 resistor on USB_DP and USB_DM lines respectively. For more details about the USB specifications, please visit http://www.usb.org/home. USB_DPUSB_DMGNDUSB_DPUSB_DMGNDL1Close to ModuleR1R2Test PointsESD ArrayNM_0 RNM_0 RMinimize these stubsModuleMCUUSB_VBUSVDD LTE Standard Module Series 4.2. USB_BOOT Interface The module provides a USB_BOOT pin. You can pull up USB_BOOT to VDD_EXT before powering on the module, thus the module will enter emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface. Table 13: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 115 DI Forces the module to enter download mode The following figure shows a reference circuit of USB_BOOT interface. 1.8 V power domain. Active High. It is recommended to reserve test points. Figure 17: Reference Circuit of USB_BOOT Interface ModuleUSB_BOOTVDD_EXT4.7KTest pointTVSClose to test point LTE Standard Module Series Figure 18: Timing Sequence for Entering Emergency Download Mode 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2. When using MCU to control module to enter the emergency download mode, please follow the above timing sequence. It is not recommended to pull up FORCE_USB_BOOT to 1.8 V before powering up VBAT. Directly connect the test points as shown in Figure 17 can manually force the module into download mode. 3. USB_BOOT cannot be pulled up before startup. 4.3. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported. Table 14: Pin Definition of (U)SIM Interface Pin Name Pin No. Description Comment USIM_VDD 14

(U)SIM card power supply Either 1.8 V or 3.0 V I/O PO

. NOTE VIL 0.5VVBATPWRKEY 500 msRESET_NNOTE 1VDD_EXTAbout 5 msUSB_BOOTUSB_BOOT can be pulled up to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on.About 22 ms LTE Standard Module Series USIM_DATA DIO

(U)SIM card data USIM_CLK USIM_RST USIM_DET 15 16 17 13 DO DO

(U)SIM card clock

(U)SIM card reset DI

(U)SIM card hot-plug detect

(U)SIM card is supported and can be identified automatically by the module. 1.8 V power domain. If unused, keep it open. The module supports (U)SIM card hot-plug via the USIM_DET pin, The function supports low level and high level detections. By default, It is disabled, and can be configured via AT+QSIMDET command. Please refer to document [2] for details about the command. The reference circuit of the 8-pin (U)SIM interface is as follows. Figure 19: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. ModuleUSIM_VDDUSIM_GNDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_DET0R0R0RVDD_EXT51K100 nFGNDGND33 pF33 pF33 pFVCCRSTCLKIOVPPGNDGNDUSIM_VDD15K(U)SIM Card Connector LTE Standard Module Series Figure 20: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design. Keep (U)SIM card connector as close as possible to the module. Keep the trace length as less than 200 mm as possible. Keep (U)SIM card signal traces away from RF and VCC traces. USIM_VDD maximum bypass capacitor does not exceed 1uF. Ensure the ground between the module and the (U)SIM card connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5 mm to maintain the same electric potential. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with ground surrounded. In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should not be more than 15 pF. The 0 resistors should be added in series between the module and the (U)SIM card to facilitate debugging. The 33 pF capacitors on the USIM_DATA, USIM_CLK and USIM_RST trances are used for filtering interference. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA can improve anti-jamming capability of the (U)SIM card. If the

(U)SIM card traces are too long, or the interference source is relatively close, it is recommended to add a pull-up resistor near the (U)SIM card connector. 4.4. PCM and I2C Interface The module provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the primary mode (short frame synchronization) and the module works as both master and slave. The module can only be used as primary devices in applications related to I2C interfaces. ModuleUSIM_VDDUSIM_GNDUSIM_RSTUSIM_CLKUSIM_DATA0R0R0R100 nFGND33 pF33 pF33 pFVCCRSTCLKIOVPPGNDGND15KUSIM_VDD(U)SIM Card Connector LTE Standard Module Series In short frame mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256 kHz, 512 kHz, 1024, 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4069 kHz PCM_CLK at 16 kHz PCM_SYNC. The module supports a 16-bit linear encoding format. The following figure shows the sequence diagram of short frame mode. (PCM_SYNC = 8 kHz, PCM_CLK = 2048 kHz). Figure 21Timing Sequence for Short frame mode Table 15: Pin Definition of PCM Interface Pin Name Pin No. I/O Description Comment PCM_SYNC 26 DIO PCM data frame sync PCM_CLK 27 DIO PCM clock PCM_DIN PCM_DOUT 24 25 DI PCM data input DO PCM data output 1.8 V power domain. In master mode, it serves as an output signal. In slave mode, it is used as an input signal. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Table 16: Pin Definition of I2C Interface Pin Name Pin No. I/O Description Comment PCM_CLKPCM_SYNCPCM_DOUTMSBLSBMSB125 s12256255PCM_DINMSBLSBMSB LTE Standard Module Series I2C_SCL I2C_SDA 41 42 OD OD I2C serial clock I2C serial data Used for external codec. An external 1.8 V pull-up resistor is needed. Clock and mode can be configured by AT command, and the default configuration is short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. The following is a reference design for the PCM and I2C interfaces with external Codec chip Figure 22: PCM and I2C Interface Circuit Reference Design NOTE It is recommended to reserve the RC (R = 22 , C = 33 pF) circuit on the PCM signal line and the capacitor should be placed close to the module, especially on PCM_CLK. PCM_DINPCM_DOUTPCM_SYNCPCM_CLKI2C_SCLI2C_SDAModule1.8 V4.7K4.7KBCLKLRCKDACADCSCLSDABIASMICBIASINPINNLOUTPLOUTNCodec22R33 pF22R22R33 pF22R33 pF LTE Standard Module Series 4.5. UART Interface The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. The main UART interface supports 4800 bps, 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps, 230400 bps, 460800 bps, 921600 bps baud rates, and the baud rate is 115200 bps by default. This interface is used for data transmission and AT command communication. Also, it supports RTS and CTS hardware flow control. The debug UART interface supports 115200 bps baud rate. It is used for the output of partial logs. Table 17: Pin Definition of Main UART Interface Pin Name Pin No. I/O Description Comment DO Main UART ring indication 1.8 V power domain. If unused, keep it open. Main UART data carrier detect DTE clear to send signal from DCE (Connect to DTEs CTS) DTE request to send signal to DCE (Connect to DTEs RTS) Main UART data terminal ready Main UART receive DO Main UART transmit DO DO DI DI DI I/O DI Table 18: Pin Definition of Debug UART Interface Pin Name Pin No. Description Comment DBG_RXD DBG_TXD 11 12 Debug UART transmit DO Debug UART receive 1.8 V power domain. If unused, keep it open. The module provides a 1.8 V UART interface. A level translator should be used if the application is equipped with a 3.3 V UART interface. A level translator TXS0108EPWR provided by Texas Instruments MAIN_RI MAIN_DCD MAIN_CTS MAIN_RTS MAIN_DTR MAIN_RXD MAIN_TXD 62 63 64 65 66 68 67 LTE Standard Module Series is recommended. The following figure shows a reference design. Figure 23: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor circuit is shown as below. For the design of circuits shown in dotted lines, please refer to that shown in solid lines, but pay attention to the direction of connection. Figure 24: Reference Circuit with Transistor Circuit 1. Transistor circuit solution is not suitable for applications with baud rates exceeding 460 kbps. 2. Please note that the module CTS is connected to the host CTS, and the module RTS is connected NOTE VCCAVCCBOEA1A2A3A4A5A6A7A8GNDB1B2B3B4B5B6B7B8VDD_EXTMAIN_RIMAIN_DCDMAIN_RTSMAIN_RXDMAIN_DTRMAIN_CTSMAIN_TXD51K51K0.1 F0.1 FRI_MCUDCD_MCURTS_MCUTXD_MCUDTR_MCUCTS_MCURXD_MCUVDD_MCUTranslator10K120KMCU/ARMTXDRXDVDD_EXT10KVCC_MCU4.7K10KVDD_EXTMAIN_TXDMAIN_RXDMAIN_RTSMAIN_CTSMAIN_DTRMAIN_RIRTSCTSGNDGPIOMAIN_DCDModuleGPIOEINTVDD_EXT4.7KGND1 nF1 nF LTE Standard Module Series to the host RTS. 4.6. SDIO Interface The module provides one SD card interface which supports SD 3.0 protocol. Table 19: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SD_SDIO_CLK SD_SDIO_CMD SD_SDIO_DATA0 SD_SDIO_DATA1 SD_SDIO_DATA2 SD_SDIO_DATA3 SD_SDIO_VDD SD_DET*

32 33 31 30 29 28 34 23 DO DIO DIO DIO DIO DIO PO DI SD card SDIO clock SD card SDIO command SD card SDIO bit 0 SD card SDIO bit 1 SD card SDIO bit 2 SD card SDIO bit 3 SD card SDIO power supply SD card hot-plug detect 1.8/2.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. The following figure illustrates a reference design of SD card interface with the module. Figure 25: Reference Circuit of SD Card Interface SD Card ConnectorDAT2CD/DAT3CMDVDDCLKVSSDAT0DAT1DETECTIVEModuleSD_SDIO_DATA3SD_SDIO_DATA2SD_SDIO_DATA1SD_SDIO_VDDSD_SDIO_DATA0SD_SDIO_CLKSD_SDIO_CMDSD_DETR1 0RR7NMR8NMR9NMR10NMR11NMVDD_3VR2 0RR3 0RR4 0RR5 0RR6 0RC2NMD2C3NMD3C4NMD4C5NMD5C6NMD6C1NMD1C710 pFD7C833 pFC9100 nFC10100 uF+

LTE Standard Module Series In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with:

The voltage range of SD card power supply VDD_3V is 2.73.6 V and a sufficient current up to 0.8 A should be provided. The maximum output current of SD_SDIO_VDD is 50 mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card. To avoid jitter of bus, resistors R7R11 are needed to pull up the SDIO to SD_SDIO_VDD. Value of these resistors is among 10 k to 100 k and the recommended value is 100 k. SD_SDIO_VDD should be used as the pull-up power. In order to improve signal quality, it is recommended to add 0 resistors R1 to R6 in series between the module and the SD card. The bypass capacitors C1 to C6 are reserved and not mounted by default. All resistors and bypass capacitors should be placed close to the module. In order to offer good ESD protection, it is recommended to add a TVS diode on SD card pins near the SD card connector with junction capacitance less than 15 pF. It is important to route the SDIO signal traces with ground surrounded. The impedance of SDIO data trace is 50 (10 %). Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. It is recommended to keep the traces of SD_SDIO_CLK, SD_SDIO_DATA [0:3] and SD_SDIO_CMD with equal length (the difference among them is less than 1 mm) and the total routing length needs to be less than 50 mm. Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of SDIO Bus should be less than 15 pF. 4.7. ADC Interface The module provides two Analog-to-Digital Converter (ADC) interfaces. In order to improve the accuracy of ADC, the trace of ADC interfaces should be surrounded by ground. Table 20: Pin Definition of ADC Interface Pin Name Pin No. I/O Description Comment ADC0 ADC1 45 44 AI AI General-purpose ADC interface If unused, keep it open. The voltage value on ADC pins can be read via AT+QADC=<port> command:

AT+QADC=0: read the voltage value on ADC0 AT+QADC=1: read the voltage value on ADC1 LTE Standard Module Series For more details about the AT command, please refer to document [2]. The resolution of the ADC is up to 12 bits. The following table describes the characteristic of the ADC interface. Table 21: Characteristics of ADC Interface Name Min. Typ. Max. ADC0 Voltage Range ADC1 Voltage Range ADC Resolution 0 0

12 VBAT_BB VBAT_BB

Unit V V bits NOTE 1. The input voltage of ADC should not exceed its corresponding voltage range. It is prohibited to supply any voltage to ADC pin when VBAT is removed. 2. It is recommended to use resistor divider circuit for ADC application and the divider resistance should 3. not exceed 100K. 4.8. Indication Signal The pin definition of indication signal is as follows:

Table 22: Pin Definition of Indication Signal Pin Name Pin No. I/O Description Comment NET_MODE NET_STATUS 5 6 DO DO Indicate the modules network registration mode 1.8 V power domain. If unused, keep it open. Indicate the module's network activity status 1.8 V power domain. If unused, keep it open. LTE Standard Module Series 4.8.1. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two network indication pins: NET_MODE and NET_STATUS. The following tables describe pin definition and logic level changes in different network status. Table 23: Working State of the Network Connection Status/Activity Indication Pin Name Status NET_MODE Always High Always Low Flicker slowly (200 ms High/1800 ms Low) Network searching Flicker slowly (1800 ms High/200 ms Low) Idle NET_STATUS Flicker quickly (125 ms High/125 ms Low) Always High Description Registered on LTE network Others Data transfer is ongoing Voice calling Figure 26: Reference Circuit of the Network Status Indication 4.8.2. STATUS The STATUS pin is an open drain output for modules operation status indication. It can be connected to a GPIO of DTE with a pulled-up resistor, or as an LED indication circuit as below. When the module is 4.7 K47 KVBAT2.2 KModuleNET_STATUS LTE Standard Module Series turned on normally, the STATUS will present the low state. Except for this, the STATUS will present high-impedance state. The following figure shows different circuit designs of STATUS, and you can choose either one according to the application demands. Figure 27: Reference Circuits of STATUS The status pin cannot be used as indication of module shutdown status when VBAT is removed. 4.9. Behaviors of the MAIN_RI AT+QCFG="risignaltype","physical" can be used to configure MAIN_RI behaviors. No matter on which port a URC is presented, the URC will trigger the behaviors of MAIN_RI pin. The URC can be outputted via UART port, USB AT port and USB modem port, which can be set by AT+QURCCFG. The default port is USB AT port. In addition, MAIN_RI behavior can be configured flexibly. The default behavior of the MAIN_RI is shown as below. NOTE NOTE VDD_MCU33 KModuleSTATUSMCU_GPIOModuleSTATUSVBAT2.2 K LTE Standard Module Series Table 24: Behaviors of the MAIN_RI State Idle URC Response MAIN_RI keeps at high level MAIN_RI outputs 120 ms low pulse when a new URC returns The MAIN_RI behavior can be changed via AT+QCFG. Please refer to document [2] for details. LTE Standard Module Series 5 RF Specifications 5.1. Cellular Network 5.1.1. Antenna Interface & Frequency Bands The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 25: Pin Definition of Cellular Network Interface Pin Name Pin No. Description Comment ANT_DRX ANT_MAIN 35 49 Diversity antenna interface 50 impedance. AIO Main antenna interface I/O AI Only passive antennas are supported. Considering authentication requirements, it is recommended to reserve diversity positions for overseas versions. Table 26: Operating Frequency of EC200A-CN Operating Frequency Transmit (MHz) Receive (MHz) 880915 17101785 19221978 826847 882913 925960 18051880 21122168 871892 927958 NOTE EGSM900 DCS1800 WCDMA B1 WCDMA B5 WCDMA B8 LTE Standard Module Series 19201980 17101785 824849 880915 20102025 25702620 18801920 23002400 25352675 824849 880915 17101785 18501910 19221978 18521908 17121753 826847 882913 21102170 18051880 869894 925960 20102025 25702620 18801920 23002400 25352675 869894 925960 18051880 19301990 21122168 19321988 21122153 871892 927958 B41 only support 140M (25352675 MHz). Table 27: Operating Frequency of EC200A-AU Operating Frequency Transmit (MHz) Receive (MHz) LTE-FDD B1 LTE-FDD B3 LTE-FDD B5 LTE-FDD B8 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40 LTE-TDD B41 NOTE GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 LTE-FDD B1 19201980 21102170 LTE Standard Module Series Table 28: Operating Frequency of EC200A-EU Operating Frequency Transmit (MHz) Receive (MHz) 18501910 17101785 17101755 824849 25002570 880915 703748 17101780 23002400 880915 17101785 19221978 826847 882913 19201980 17101785 824849 25002570 880915 832862 703748 19301990 18051880 21102155 869894 26202690 925960 758803 21102180 23002400 925960 18051880 21122168 871892 927958 21102170 18051880 869894 26202690 925960 791821 758803 25702620 25702620 LTE FDD B2 LTE-FDD B3 LTE FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B28 LTE-FDD B66 LTE-TDD B40 EGSM900 DCS1800 WCDMA B1 WCDMA B5 WCDMA B8 LTE-FDD B1 LTE-FDD B3 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B20 LTE-FDD B28 LTE-TDD B38 LTE Standard Module Series LTE-TDD B40 LTE-TDD B41 23002400 25352675 23002400 25352675 LTE Standard Module Series 5.1.2. Tx Power Table 29: Tx Power Frequency GSM850 EGSM900 DCS1800 PCS1900 The following table shows the RF output power of the module. Max. Tx Power Comments 33 dBm 2 dB 5 dBm 5 dB 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB GSM850(8-PSK) 27 dBm 3 dB 5 dBm 5 dB GSM900 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB DCS1800 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB PCS1900(8-PSK) 26 dBm 3 dB 0 dBm 5 dB WCDMA B1/B2/B4/B5/B8 24 dBm +1/-3 dB

< -49 dBm LTE-FDD B1/B2/B3/B4/B5/B7/B8/B20/B28/B66 23 dBm 2 dB

< -39 dBm LTE-TDD B34/B38/B39/B40/B41 23 dBm 2 dB

< -39 dBm NOTE In GPRS 4 slots Tx mode, the maximum output power is reduced by 4 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 5.1.3. Rx Sensitivity The following table shows conducted Rx sensitivity of the module. LTE Standard Module Series Table 30: Conducted RF Receiving Sensitivity of EC200A-CN Frequency Receiving Sensitivity (Typ.) Primary Diversity SIMO

-98.4

-98.1

-99.7

-99.2

-98.7

-96.2

-98

-98.9

-95.8

-101.3

-100.8

-101.9

-101.9

-100.5

-98.9

-100.3

-101.4

-99.1

3GPP Requirement

(SIMO)

-102 dBm

-102 dBm

-106.7 dBm

-104.7 dBm

-103.7 dBm

-96.3 dBm

-93.3 dBm

-94.3 dBm

-93.3 dBm

-96.3 dBm

-96.3 dBm

-96.3 dBm

-96.3 dBm

-94.3 dBm 3GPP Requirement

(SIMO)

-102 dBm

-102 dBm

-102 dBm

-102 dBm

-106.7 dBm EGSM900 DCS1800

-109

-107 WCDMA B1

-109.4 WCDMA B5

-109.7 WCDMA B8

-110.2 LTE-FDD B1

-98.1 LTE-FDD B3

-97.1 LTE-FDD B5

-98.9 LTE-FDD B8

-97.4 LTE-TDD B34

-96.6 LTE-TDD B38

-96.7 LTE-TDD B39

-97.6 LTE-TDD B40

-97.4 LTE-TDD B41

-95 GSM850

-109.3 EGSM900

-108.2 DCS1800

-106.8 PCS1900

-107 WCDMA B1

-109.2 Table 31: Conducted RF Receiving Sensitivity of EC200A-AU Frequency Receiving Sensitivity (Typ.) Primary Diversity SIMO LTE Standard Module Series

-97.8

-97.8

-97.5

-97.4

-99.2

-97.3

-98.6

-99.3

-97.7

-98.5

-97

-96.8

-99

-101

-100.2

-100.9

-101.1

-101.7

-99.9

-100.2

-102.4

-100

-101.3

-100.8

-100.4

-102.2

-104.7 dBm

-106.7 dBm

-104.7 dBm

-103.7 dBm

-96.3 dBm

-94.3 dBm

-93.3 dBm

-96.3 dBm

-94.3 dBm

-94.3 dBm

-93.3 dBm

-94.8 dBm

-95.8 dBm

-96.3 dBm 3GPP Requirement

(SIMO)

-102 dBm

-102 dBm

-106.7 dBm

-104.7 dBm

-103.7 dBm

-96.3 dBm

-93.3 dBm

-94.3 dBm WCDMA B2

-107.7 WCDMA B4

-109.2 WCDMA B5

-110.7 WCDMA B8

-110.2 LTE-FDD B1

-97.8 LTE FDD B2

-96.1 LTE-FDD B3

-96.7 LTE FDD B4

-96.6 LTE-FDD B5

-98.2 LTE-FDD B7

-95.8 LTE-FDD B8

-96.9 LTE-FDD B28

-98.5 LTE-FDD B66

-95.5 LTE-TDD B40

-96.9 EGSM900

-108.7 DCS1800

-107 WCDMA B1

-109.7 WCDMA B5

-111 WCDMA B8

-110.5 LTE-FDD B1

-96.9 LTE-FDD B3

-95.9 LTE-FDD B5

-98.3 Table 32: Conducted RF Receiving Sensitivity of EC200A-EU Frequency Receiving Sensitivity (Typ.) Primary Diversity SIMO LTE Standard Module Series LTE-FDD B7

-94.4 LTE-FDD B8

-96.7 LTE-FDD B20

-98.1 LTE-FDD B28

-98.9 LTE-TDD B38

-96.5 LTE-TDD B40

-97.3 LTE-TDD B41

-94.9 5.1.4. Reference Design

-95.8

-98.9

-99.3

-99.5

-95.2

-97.3

-95.1

-98

-100.1

-101.4

-102.6

-99.3

-100.5

-97.8

-94.3 dBm

-93.3 dBm

-93.3 dBm

-94.8 dBm

-96.3 dBm

-96.3 dBm

-94.3 dBm The module provides two RF antenna interfaces for antenna connection. It is recommended to reserve a -type matching circuit for better RF performance, and the -type matching components (C1, R1, C2 and C3, R2, C4) should be placed as close to the antenna as possible. The capacitors are not mounted by default. Figure 28: Reference Circuit for RF Antenna Interfaces ANT_MAINR1 0 RC1ModuleMainantennaNMC2NMR2 0 RC3Diversity antennaNMC4NMANT_DRX LTE Standard Module Series 5.2. Reference Design of RF Routing For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 29: Microstrip Design on a 2-layer PCB Figure 30: Coplanar Waveguide Design on a 2-layer PCB LTE Standard Module Series Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully 50 . connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right-angle traces should be changed to curved ones. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, ground vias around RF traces and the reference ground improves RF performance. The distance between the ground vias and RF traces should be more than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between LTE Standard Module Series traces on adjacent layers. For more details about RF layout, please refer to document [3]. 5.3. Requirements for Antenna Design Table 33: Requirements for Antenna Design Antenna Type Requirements GSM/UMTS/LTE VSWR: 2 Efficiency: > 30 %

Gain: 1dBi Max. input power: 50 W Input impedance: 50 Cable insertion loss:

< 1 dBLB< 1 GHz

< 1.5 dBMB1~2.3 GHz

< 2 dBHB> 2.3 GHz LTE Standard Module Series 5.4. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 33: Dimensions of U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 34: Mechanicals of U.FL-LP Connectors LTE Standard Module Series The following figure describes the space factor of mated connector. Figure 35: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com. LTE Standard Module Series 6 Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Parameter Max. Unit Table 34: Absolute Maximum Ratings VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage on Digital Pins

-0.3 Voltage at ADC0 Voltage at ADC1 Min.

-0.3

-0.3

0 0 5.5 5.5 0.8 1.8 2.3 VBAT_BB VBAT_BB V V A A V V V LTE Standard Module Series 6.2. Power Supply Ratings Table 35: The Modules Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB and VBAT_RF The actual input voltages must stay between the minimum and maximum values. 3.4 3.8 4.5 V Maximum power control level at EGSM 900 0 0 400 mV Maximum power control level at EGSM 900

1.8 2.0 A USB_VBUS 3.0 5.0 5.25 V VBAT IVBAT Voltage drop during transmitting burst Peak supply current

(during transmission slot) USB connection detection LTE Standard Module Series 6.3. Power Consumption Table 36: The Module Power Consumption EC200A-CN OFF state Power down Description Conditions Unit Typ. 11 0.86 AT+CFUN=0 (USB disconnected) EGSM900 @ DRX = 2 (USB disconnected) 1.71 EGSM900 @ DRX = 5 (USB disconnected) 1.27 EGSM900 @ DRX = 5 (USB suspend) 1.43 EGSM900 @ DRX = 9 (USB disconnected) 1.14 DCS1800 @ DRX = 2 (USB disconnected) 1.70 DCS1800 @ DRX = 5 (USB disconnected) 1.26 DCS1800 @ DRX = 5 (USB suspend) 1.41 DCS1800 @ DRX = 9 (USB disconnected) 1.13 WCDMA @ PF = 64 (USB disconnected) 2.37 WCDMA @ PF = 64 (USB suspend) 2.53 WCDMA @ PF = 128 (USB disconnected) 1.66 WCDMA @ PF = 256 (USB disconnected) 1.31 WCDMA @ PF = 512 (USB disconnected) 1.14 LTE-FDD @ PF = 32 (USB disconnected) 2.04 LTE-FDD @ PF = 64 (USB disconnected) 1.46 LTE-FDD @ PF = 64 (USB suspend) 1.60 LTE-FDD @ PF = 128 (USB disconnected) 1.19 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Sleep state LTE Standard Module Series LTE-FDD @ PF = 256 (USB disconnected) 1.06 LTE-TDD @ PF = 32 (USB disconnected) 2.09 LTE-TDD @ PF = 64 (USB disconnected) 1.48 LTE-TDD @ PF = 64 (USB suspend) 1.64 LTE-TDD @ PF = 128 (USB disconnected) 1.20 LTE-TDD @ PF = 256 (USB disconnected) 1.06 EGSM900 @ DRX = 5 (USB disconnected) 20.35 EGSM900 @ DRX = 5 (USB connected) 36.52 WCDMA @ PF = 64 (USB disconnected) 20.99 WCDMA @ PF = 64 (USB connected) 37.15 LTE-FDD @ PF = 64 (USB disconnected) 20.52 LTE-FDD @ PF = 64 (USB connected) 36.69 LTE-TDD @ PF = 64 (USB disconnected) 20.51 LTE-TDD @ PF = 64 (USB connected) 36.66 EGSM900 4DL/1UL @ 32.34 dBm EGSM900 3DL/2UL @ 32.31 dBm EGSM900 2DL/3UL @ 31.08 dBm EGSM900 1DL/4UL @ 29.28 dBm DCS1800 4DL/1UL @ 29.65 dBm DCS1800 3DL/2UL @ 29.58 dBm DCS1800 2DL/3UL @ 28.03 dBm DCS1800 1DL/4UL @ 26.16 dBm EGSM900 4DL/1UL @ 27.06 dBm EGSM900 3DL/2UL @ 26.87 dBm EGSM900 2DL/3UL @ 25.01 dBm 197.6 364.8 468.8 523.2 134.3 242.3 281.8 298.5 136.6 243.3 314.2 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle state GPRS data transfer EDGE data transfer LTE Standard Module Series EGSM900 1DL/4UL @ 22.87 dBm DCS1800 4DL/1UL @ 25.66 dBm DCS1800 3DL/2UL @ 25.50 dBm DCS1800 2DL/3UL @ 23.95 dBm DCS1800 1DL/4UL @ 21.93 dBm 359.2 119.4 214.1 289.1 344.8 WCDMA B1 HSDPA @ 22.06 dBm 511.97 WCDMA B5 HSDPA @ 21.68 dBm 443.02 WCDMA data transfer WCDMA B8 HSDPA @ 21.64 dBm 483.22 WCDMA B1 HSUPA @ 21.30 dBm 489.72 WCDMA B5 HSUPA @ 20.02 dBm 405.29 WCDMA B8 HSUPA @ 21.03 dBm 451.78 LTE data transfer LTE-TDD B34 @ 22.83 dBm LTE-FDD B1 @ 22.78 dBm LTE-FDD B3 @ 23.39 dBm LTE-FDD B5 @ 23.19 dBm LTE-FDD B8 @ 23.87 dBm LTE-TDD B38 @ 23.55 dBm LTE-TDD B39 @ 23.09 dBm LTE-TDD B40 @ 23.19 dBm LTE-TDD B41 @ 23.44 dBm EGSM900 PCL = 5 @ 32.24 dBm 202.3 EGSM900 PCL = 12 @ 19.09 dBm GSM voice call EGSM900 PCL = 19 @ 5.82 dBm DCS1800 PCL = 0 @ 29.40 dBm DCS1800 PCL = 7 @ 15.75 dBm 563.82 583.24 530.15 578.26 228.47 357.07 236.27 333.39 381.70 74.5 47.2 134.9 59.4 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE Standard Module Series DCS1800 PCL = 15 @ -0.43 dBm 46.8 WCDMA B1 @ 22.77 dBm WCDMA voice call WCDMA B5 @ 22.42 dBm WCDMA B8 @ 22.43 dBm EC200A-AU Description Conditions OFF state Power down 557.69 483.34 529.50 Typ. 10 0.95 AT+CFUN=0 (USB disconnected) EGSM900 @ DRX = 2 (USB disconnected) 1.67 EGSM900 @ DRX = 5 (USB disconnected) 1.29 EGSM900 @ DRX = 5 (USB suspend) TBD EGSM900 @ DRX = 9 (USB disconnected) 1.28 DCS1800 @ DRX = 2 (USB disconnected) 1.66 DCS1800 @ DRX = 5 (USB disconnected) 1.30 DCS1800 @ DRX = 5 (USB suspend) TBD DCS1800 @ DRX = 9 (USB disconnected) 1.19 WCDMA @ PF = 64 (USB disconnected) 2.30 WCDMA @ PF = 64 (USB suspend) TBD WCDMA @ PF = 128 (USB disconnected) 2.29 WCDMA @ PF = 256 (USB disconnected) 1.67 WCDMA @ PF = 512 (USB disconnected) 1.36 LTE-FDD @ PF = 32 (USB disconnected) TBD LTE-FDD @ PF = 64 (USB disconnected) TBD LTE-FDD @ PF = 64 (USB suspend) TBD LTE-FDD @ PF = 128 (USB disconnected) TBD Sleep state mA mA mA mA Unit uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE Standard Module Series LTE-FDD @ PF = 256 (USB disconnected) TBD LTE-TDD @ PF = 32 (USB disconnected) TBD LTE-TDD @ PF = 64 (USB disconnected) TBD LTE-TDD @ PF = 64 (USB suspend) TBD LTE-TDD @ PF = 128 (USB disconnected) TBD LTE-TDD @ PF = 256 (USB disconnected) TBD EGSM900 @ DRX = 5 (USB disconnected) 62.62 EGSM900 @ DRX = 5 (USB connected) 38.93 WCDMA @ PF = 64 (USB disconnected) 14.55 WCDMA @ PF = 64 (USB connected) 39.48 LTE-FDD @ PF = 64 (USB disconnected) TBD LTE-FDD @ PF = 64 (USB connected) TBD LTE-TDD @ PF = 64 (USB disconnected) TBD LTE-TDD @ PF = 64 (USB connected) TBD GSM850 4DL/1UL @ 31.77 dBm GSM850 3DL/2UL @ 31.79 dBm GSM850 2DL/3UL @ 30.80 dBm GSM850 1DL/4UL @ 29.19 dBm EGSM900 4DL/1UL @ 31.61 dBm EGSM900 2DL/3UL @ 30.58 dBm EGSM900 1DL/4UL @ 28.99 dBm DCS1800 4DL/1UL @ 28.53 dBm DCS1800 3DL/2UL @ 28.42 dBm DCS1800 2DL/3UL @ 27.54 dBm 231 389 497 548 189 357 466 522 144 270 331 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA GPRS data transfer EGSM900 3DL/2UL @ 31.59 dBm Idle state LTE Standard Module Series DCS1800 1DL/4UL @ 25.85 dBm PCS1900 4DL/1UL @ 27.61 dBm PCS1900 3DL/2UL @ 27.33 dBm PCS1900 2DL/3UL @ 27.17 dBm PCS1900 1DL/4UL @ 26.20 dBm GSM850 4DL/1UL @ 26.38 dBm GSM850 3DL/2UL @ 24.64 dBm GSM850 2DL/3UL @ 22.53 dBm GSM850 1DL/4UL @ 20.50 dBm EGSM900 4DL/1UL @ 26.74 dBm EGSM900 3DL/2UL @ 24.71 dBm EGSM900 2DL/3UL @ 22.57 dBm EGSM900 1DL/4UL @ 20.29 dBm DCS1800 4DL/1UL @ 25.81 dBm DCS1800 3DL/2UL @ 24.29 dBm DCS1800 2DL/3UL @ 22.24 dBm DCS1800 1DL/4UL @ 19.89 dBm PCS1900 4DL/1UL @ 25.93 dBm PCS1900 3DL/2UL @ 24.34 dBm PCS1900 2DL/3UL @ 22.31 dBm PCS1900 1DL/4UL @ 20.09 dBm WCDMA B1 HSDPA @ 21.98 dBm WCDMA B2 HSDPA @ 21.78 dBm WCDMA B4 HSDPA @ 21.96 dBm WCDMA B5 HSDPA @ 21.70 dBm 351 218 361 435 427 133 217 283 350 136 223 288 351 122 211 282 354 121 207 280 354 530 547 552 501 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EDGE data transfer WCDMA data transfer LTE data transfer LTE-TDD B34 @ 23.00 dBm LTE Standard Module Series WCDMA B8 HSDPA @ 21.64 dBm WCDMA B1 HSUPA @ 21.99 dBm WCDMA B2 HSUPA @ 21.61 dBm WCDMA B4 HSUPA @ 20.68 dBm WCDMA B5 HSUPA @ 21.42 dBm WCDMA B8 HSUPA @ 21.45 dBm LTE-FDD B1 @ 22.88 dBm LTE-FDD B3 @ 23.63 dBm LTE-FDD B5 @ 22.82 dBm LTE-FDD B8 @ 22.80 dBm LTE-TDD B38 @ 22.45 dBm LTE-TDD B39 @ 23.05 dBm LTE-TDD B40 @ 23.02 dBm LTE-TDD B41 @ 23.35 dBm EGSM900 PCL = 5 @ 31.55 dBm EGSM900 PCL = 12 @ 18.87 dBm EGSM900 PCL = 19 @ 5.58 dBm DCS1800 PCL = 0 @ 28.50 dBm DCS1800 PCL = 7 @ 15.62 dBm DCS1800 PCL = 15 @ 0.32 dBm WCDMA B1 @ 23.08 dBm WCDMA B2 @ 22.72 dBm WCDMA B4 @ 23.28 dBm WCDMA B5 @ 22.69 dBm 534 484 535 501 481 523 TBD TBD TBD TBD TBD TBD TBD TBD TBD 234 111 81 183 97 77 587 602 602 552 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA GSM voice call WCDMA voice call LTE Standard Module Series WCDMA B8 @ 22.61 dBm 593 mA EC200A-EU Description Conditions Unit OFF state Power down Typ. 10 0.78 Sleep state WCDMA @ PF = 64 (USB suspend) 2.25 AT+CFUN=0 (USB disconnected) EGSM900 @ DRX = 2 (USB disconnected) 1.50 EGSM900 @ DRX = 5 (USB disconnected) 1.12 EGSM900 @ DRX = 5 (USB suspend) 1.28 EGSM900 @ DRX = 9 (USB disconnected) 1.01 DCS1800 @ DRX = 2 (USB disconnected) 1.50 DCS1800 @ DRX = 5 (USB disconnected) 1.11 DCS1800 @ DRX = 5 (USB suspend) 1.28 DCS1800 @ DRX = 9 (USB disconnected) 1.00 WCDMA @ PF = 64 (USB disconnected) 2.11 WCDMA @ PF = 128 (USB disconnected) 1.47 WCDMA @ PF = 256 (USB disconnected) 1.15 WCDMA @ PF = 512 (USB disconnected) 0.99 LTE-FDD @ PF = 32 (USB disconnected) 1.85 LTE-FDD @ PF = 64 (USB disconnected) 1.28 LTE-FDD @ PF = 64 (USB suspend) 1.43 LTE-FDD @ PF = 128 (USB disconnected) 1.02 LTE-FDD @ PF = 256 (USB disconnected) 0.89 LTE-TDD @ PF = 32 (USB disconnected) 1.88 LTE-TDD @ PF = 64 (USB disconnected) 1.29 uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE Standard Module Series LTE-TDD @ PF = 64 (USB suspend) 1.45 LTE-TDD @ PF = 128 (USB disconnected) 1.02 LTE-TDD @ PF = 256 (USB disconnected) 0.90 EGSM900 @ DRX = 5 (USB disconnected) 18.06 EGSM900 @ DRX = 5 (USB connected) 32.65 WCDMA @ PF = 64 (USB disconnected) 18.57 WCDMA @ PF = 64 (USB connected) 33.17 LTE-FDD @ PF = 64 (USB disconnected) 18.31 LTE-FDD @ PF = 64 (USB connected) 33.11 LTE-TDD @ PF = 64 (USB disconnected) 18.29 LTE-TDD @ PF = 64 (USB connected) 33.10 EGSM900 4DL/1UL @ 32.44 dBm EGSM900 3DL/2UL @ 32.39 dBm EGSM900 2DL/3UL @ 31.23 dBm EGSM900 1DL/4UL @ 29.53 dBm DCS1800 4DL/1UL @ 29.77 dBm DCS1800 3DL/2UL @ 29.65 dBm DCS1800 2DL/3UL @ 28.31 dBm DCS1800 1DL/4UL @ 26.40 dBm EGSM900 4DL/1UL @ 27.01 dBm EGSM900 3DL/2UL @ 26.98 dBm EGSM900 2DL/3UL @ 25.27 dBm EGSM900 1DL/4UL @ 23.13 dBm DCS1800 4DL/1UL @ 25.96 dBm DCS1800 3DL/2UL @ 25.77 dBm 199 372 478 533 136 244 293 309 137 246 315 375 121 215 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle state GPRS data transfer EDGE data transfer LTE Standard Module Series DCS1800 2DL/3UL @ 24.24 dBm DCS1800 1DL/4UL @ 22.10 dBm WCDMA B1 HSDPA @ 21.99 dBm WCDMA B5 HSDPA @ 21.76 dBm WCDMA B8 HSDPA @ 21.81 dBm WCDMA B1 HSUPA @ 21.21 dBm WCDMA B5 HSUPA @ 21.13 dBm WCDMA B8 HSUPA @ 21.49 dBm LTE-FDD B1 @ 23.61 dBm LTE-FDD B3 @ 23.71 dBm LTE-FDD B5 @ 23.70 dBm LTE-FDD B7 @ 23.56 dBm LTE-FDD B8 @ 24.11 dBm LTE-FDD B20 @ 23.20 dBm LTE-FDD B28 @ 23.77 dBm LTE-TDD B38 @ 18.12 dBm LTE-TDD B40 @ 18.68 dBm LTE-TDD B41 @ 19.18 dBm EGSM900 PCL = 5 @ 32.34 dBm EGSM900 PCL = 12 @ 19.11 dBm EGSM900 PCL = 19 @ 6.05 dBm DCS1800 PCL = 0 @ 29.50 dBm DCS1800 PCL = 7 @ 16.07 dBm DCS1800 PCL = 15 @ -1.14 dBm WCDMA B1 @ 22.29 dBm 289 360 520 474 496 504 454 497 607 636 568 813 591 592 559 230 233 242 206 76 48 136 61 48 543 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA data transfer LTE data transfer GSM voice call LTE Standard Module Series WCDMA voice call WCDMA B5 @ 22.26 dBm WCDMA B8 @ 22.25 dBm 496 533 mA mA Parameter Description Max. Unit 6.4. Digital I/O Characteristic Table 37: 1.8 V I/O Requirements Input high voltage Input low voltage Output high voltage 1.35 Output low voltage

-0.3 Min. 1.2

-0.3 Min. 1.7 1.2

-0.3 Table 38: (U)SIM 1.8 V I/O Requirements Parameter Description Max. Unit USIM_VDD Power supply Input high voltage Input low voltage Output high voltage 1.35 Output low voltage

-0.3 0.45 2.0 0.6 1.8 0.45 1.9 2.0 0.6 1.8 Max. 3.05 3.05 V V V V V V V V V Unit V V Table 39: (U)SIM 3.0 V I/O Requirements Parameter Description USIM_VDD Power supply Min. 2.7 VIH Input high voltage 1.95 VIH VIL VOH VOL VIH VIL VOH VOL LTE Standard Module Series VIL VOH VOL Input low voltage

-0.3 Output high voltage 2.55 Output low voltage

-0.3 1.0 3.0 0.45 V V V 6.5. ESD If the static electricity generated by various ways discharges to the module, the module maybe damaged to a certain extent. Thus, please take proper ESD countermeasures and handling methods. For example, wearing anti-static gloves during the development, production, assembly and testing of the module;

adding ESD protective component to the ESD sensitive interfaces and points in the product design of the module. ESD characteristics of the modules pins are as follows:

Table 40: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND 8 All Antenna Interfaces 8 Other Interfaces 0.5 10 10 1 kV kV kV LTE Standard Module Series 6.6. Operating and Storage Temperatures Parameter Max. Unit Table 41: Operating and Storage Temperatures Operating Temperature Range 3 Extended Operating Temperature Range 4 Storage temperature range Min.

-35

-40

-40 Typ.

+25

+75

+85

+95 C C C 3 Within operating temperature range, the module is 3GPP compliant. 4 Within the extended temperature range, the module remains the ability to establish and maintain functions such as voice, SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. LTE Standard Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 36: Module Top and Side Dimensions (Unit: mm) LTE Standard Module Series Figure 37: Module Bottom Dimensions View (Unit: mm) The flatness of EC200A series module of Remote Communication meets the requirements of JEITA ED-7306 standard. NOTE LTE Standard Module Series 7.2. Recommended Footprint Figure 38: Recommended Footprint (Bottom View) For convenient maintenance of the module, please keep about 3 mm between the module and other components on the host PCB. NOTE LTE Standard Module Series 7.3. Top and Bottom Views Figure 39: Top and Bottom View of the Module NOTE These are renderings of the module. For authentic appearance, please refer to the module that you receive from Quectel. LTE Standard Module Series 8 Storage, Manufacturing and Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed package. MSL of the module is rated as 3, and its storage restrictions are shown as below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity should be 3560 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3. The floor life of the module is 168 hours 5 in a plant where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 24 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be 5 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. 5. LTE Standard Module Series put in a dry environment such as in a drying oven. NOTE the air is forbidden. 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. LTE Standard Module Series 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.180.20 mm. For more details, please refer to document [4]. It is suggested that the peak reflow temperature is 235246 C, and the absolute maximum reflow temperature is 246 C. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 40: Recommended Reflow Soldering Thermal Profile Table 42: Recommended Thermal Profile Parameters Recommendation 1 to 3 C/s Factor Soak Zone Max slope Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Max slope: 1 to 3C/s Cooling down slope: -1.5 to -3C/s Max slope: 2 to 3C/s LTE Standard Module Series Soak time (between A and B: 150 C and 200 C) 70 to 120 s Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE 2 to 3 C/s 45 to 70 s 235 to 246 C

-1.5 ~ -3 C/s 1 1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 3. 4. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 5. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [4]. 8.3. Packaging Specifications The module adopts carrier tape packaging and details are as follow:

8.3.1. Carrier Tape Dimension details are as follow:

LTE Standard Module Series Figure 41: Carrier Tape Dimension Drawing Table 43: Carrier Tape Dimension Table (Unit: mm) W 44 P 44 T A0 B0 0.35 32.5 29.5 K0 3.0 K1 3.8 F E 20.2 1.75 8.3.2. Plastic Reel Figure 42: Plastic Reel Dimension Drawing LTE Standard Module Series Table 44: Plastic Reel Dimension Table (Unit: mm) D2 100 W 44.5 D1 330 8.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. One plastic reel can load 250 modules. Place the vacuum-packed plastic reel into a pizza box. Place the packaged plastic reel, humidity into a indicator card and desiccant bag vacuum bag, then vacuumize it. Put 4 pizza boxes into 1 carton and seal it. One carton can pack 1000 modules. Figure 43: Packaging Process LTE Standard Module Series 9 Appendix References Table 45: Related Documents Document Name

[1] Quectel_UMTS&LTE_EVB_User_Guide

[2] Quectel_EC200x&EG912Y_Series_AT_Commands_Manual

[3] Quectel_RF_Layout_Application_Note

[4] Quectel_Module_Secondary_SMT_Application_Note Table 46: Terms and Abbreviations Abbreviation Description Adaptive Multi-Rate BeiDou Navigation Satellite System Bytes per second Code Division Multiple Access Coding Scheme Clear To Send Discontinuous Reception Data Terminal Equipment Enhanced Full Rate Enhanced GSM Electrostatic Discharge AMR BeiDou bps CDMA CS CTS DRX DTE EFR EGSM ESD LTE Standard Module Series Evaluation Board Frequency Division Duplexing Full Rate File Transfer Protocol FTP over SSL Gaussian Filtered Minimum Shift Keying Ground Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate High Speed Downlink Packet Access Hypertext Transfer Protocol Secure Land Grid Array Long Term Evolution Modulation and Coding Scheme Multimedia Messaging Service Network Time Protocol Password Authentication Protocol Printed Circuit Board Pulse Code Modulation Packet Internet Groper Point-to-Point Protocol Phase Shift Keying Quadrature Amplitude Modulation EVB FDD FR FTP FTPS GMSK GND GNSS GPS GSM HR HSDPA HTTPS LGA LTE MCS MMS NTP PAP PCB PCM PING PPP PSK QAM LTE Standard Module Series SMTPS Simple Mail Transfer Protocol Secure Quadrature Phase Shift Keying Radio Frequency Restriction of Hazardous Substances Request To Send Secure Digital Input and Output Card Short Message Service Simple Mail Transfer Protocol Secure Sockets Layer Transmission Control Protocol Time Division Duplexing User Datagram Protocol Universal Mobile Telecommunications System Universal Serial Bus

(Universal) Subscriber Identity Module Maximum Voltage Value Nominal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Voltage Standing Wave Ratio QPSK RF RoHS RTS SDIO SMS SMTP SSL TCP TDD UDP UMTS USB

(U)SIM Vmax Vnom Vmin VIHmax VIHmin VILmax VILmin VOHmin VOLmax VSWR LTE Standard Module Series WCDMA Wideband Code Division Multiple Access 10 Warnings sentences 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different Part 2.1091(b). antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. End Product Labeling When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text:

Contains FCC ID: XMR202112EC200AAU The FCC ID can be used only when all FCC compliance requirements are met. LTE Standard Module Series In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving

- Increase the separation between the equipment antenna. and receiver. connected.

- Consult the dealer or an experienced radio/TV

- Connect the equipment into an outlet on a circuit different from that to which the receiver is LTE Standard Module Series technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation,maximum antenna gain (including cable loss)must not exceed:

SM850/WCDMA Band5/LTE Band 5: 7.0dBi GSM1900/WCDMA Band2/LTE Band 2: 8.0dBi WCDMA Band 4/LTE Band 4/ LTE Band 66 5.0dBi LTE Band 7: 8.0dBi Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.

Quectel Wireless Solutions Company Limited Date: 2021-11-18 Federal Communications Commission Authorization and Evaluation Division Confidentiality Request regarding application for certification of FCC ID: XMR202112EC200AAU Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:

Block Diagram Schematics Operational Description Part Lists and Tune-up information The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Section 0.457 of the Rules, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely,

Grantee Contacts Signature Quectel Wireless Solutions Company Limited Jean Hu

Quectel Wireless Solutions Company Limited Declaration of Authorization We Name: Quectel Wireless Solutions Company Limited Address: Building 5, Shanghai Business Park PhaseIII, (Area B), No.1016 Tianlin Road, Minhang District, Shanghai China, 200233 Declare that:

Name Representative of agent: Ms. Riley Wei Agent Company name: BTL Inc. Address: No. 29, Jintang Road, Tangzhen Industry Park Pudong New Area City: Shanghai Country: China is authorized to apply for Certification of the following product(s) and signing all the related documents including 731 forms:

Product description: LTE Module Type designation: EC200A-AU Trademark: Quectel FCC ID: XMR202112EC200AAU on our behalf. Date: 2021-11-18 City: Shanghai Name: Jean Hu Function: Certification Section Signature:

Quectel Wireless Solutions Company Limited FCC Modular Approval Statement Receiver Federal Communication Commission Equipment Authorization Devision, Application Processing Branch 7435 Oakland Mills Road Columbia, MD 21048 Subject:

Modular Approval Statement Date: 2021-11-18 FCC Certification Number: XMR202112EC200AAU Model Name/Number: LTE Module/ EC200A-AU TO WHOM IT MAY CONCERN Pursuant to Paragraphs CFR 15.212, we herewith declare for our module. Modular approval requirement Yes No *

(a) The radio elements must have the radio frequency circuitry be shielded. Physical/discrete and tuning capacitors may be located external to the shield, but must be on the module assembly.

*Please provide a detailed explanation if the answer is No.:

(b) The module shall have buffered modulation/data input(s) (if such inputs are provided) to ensure that the module will comply with the requirements set out in the applicable standard under conditions of excessive data rates or over-

modulation.

*Please provide a detailed explanation if the answer is No.:

(c) The module shall have its own power supply regulation on the module. This is to ensure that the module will comply with the requirements set out in the applicable standard regardless of the design of the power supplying circuitry in the host device which houses the module.

*Please provide a detailed explanation if the answer is No.:

(d) The module shall comply with the provisions for external power amplifiers and antennas detailed in this standard. The equipment certification submission shall contain a detailed description of the configuration of all antennas that will be used with the module.

*Please provide a detailed explanation if the answer is No.:

(e) The module shall be tested for compliance with the applicable standard in a stand-alone configuration, i.e. the module must not be inside another device during testing.

*Please provide a detailed explanation if the answer is No.:

(f) The module shall comply with the Category I equipment labeling requirements and CFR 15.212(a)(1)(vi).

*Please provide a detailed explanation if the answer is No.:

1 Yes Yes Yes Yes Yes Yes Quectel Wireless Solutions Company Limited FCC Modular Approval Statement

(g) The module shall comply with applicable RSS-102 exposure requirements and any applicable FCC RF exposure requirement which are based on the intended use/configurations.

*Please provide a detailed explanation if the answer is No.:

(i) The modular transmitter complies with all applicable FCC rules. Instructions for maintaining compliance are given in the user instructions. If you have any questions, please feel free to contact us at the address shown below Best Regards, Yes Yes ___________________

(Signed) Name / Title: Jean Hu / Certification Section 2