FCC ID: XMR2021EC21ADL LTE Module

 

EC21 Series Hardware Design LTE Standard Module Series Version: 1.9 Date: 2021-08-17 Status: Released LTE Standard Module Series Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to support@quectel.com. Quectel offers the information as a service to its customers. The information provided is based upon customers requirements. Quectel makes every effort to ensure the quality of the information it makes available. Quectel does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information. All information supplied herein is subject to change without prior notice. General Notes Disclaimer it is possible that While Quectel has made efforts to ensure that the functions and features under development are free from errors, these functions and features could contain errors, inaccuracies and omissions. Unless otherwise provided by valid agreement, Quectel makes no warranties of any kind, features and functions under development. To the implied or express, with respect maximum extent permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with the use of the functions and features under development, regardless of whether such loss or damage may have been foreseeable. to the use of Duty of Confidentiality The Receiving Party shall keep confidential all documentation and information provided by Quectel, except when the specific permission has been granted by Quectel. The Receiving Party shall not access or use Quectels documentation and information for any purpose except as expressly provided herein. Furthermore, the Receiving Party shall not disclose any of the Quectel's documentation and information to any third party without the prior written consent by Quectel. For any noncompliance to the above requirements, unauthorized use, or other illegal or malicious use of the documentation and information, Quectel will reserve the right to take legal action. EC21_Series_Hardware_Design 1 / 118 LTE Standard Module Series Copyright The information contained here is proprietary technical information of Quectel Wireless Solutions Co., Ltd. Transmitting, reproducing, disseminating and editing this document as well as using the content without permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. Copyright Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved. EC21_Series_Hardware_Design 2 / 118 LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation interference with of wireless appliances in an aircraft communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. is forbidden to prevent Wireless devices may cause interference on sensitive medical equipment, so the restrictions on the use of wireless devices when in please be aware of hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or EC21_Series_Hardware_Design 3 / 118 metal powders. LTE Standard Module Series EC21_Series_Hardware_Design 4 / 118 LTE Standard Module Series About the Document Revision History Version Date Author Description 1.0 2016-04-15 Yeoman CHEN Initial 1.1 2016-09-22 Yeoman CHEN/

Frank WANG/

Lyndon LIU 1. Updated frequency bands in Table 1. 2. Updated transmitting power, supported maximum baud rate of main UART, supported internet protocols, supported USB drivers of USB interface, and temperature range in Table 2. 3. Updated timing of turning on module in Figure 12. 4. Updated timing of turning off module in Figure 13. 5. Updated timing of resetting module in Figure 16. 6. Updated main UART supports baud rate in Chapter 7. Added notes for ADC interface in Chapter 3.13. 8. Updated GNSS Performance in Table 21. 9. Updated operating frequencies of module in Table 10. Added current consumption in Chapter 6.4. 11. Updated RF output power in Chapter 6.5. 12. Added RF receiving sensitivity in Chapter 6.6. 1. Added SGMII and WLAN interfaces in Table 2. 2. Updated function diagram in Figure 1. 3. Updated pin assignment (Top View) in Figure 2. 4. Added description of SGMII and WLAN interfaces in 5. Added SGMII interface in Chapter 3.17. 6. Added WLAN interface in Chapter 3.18. 7. Added USB_BOOT interface in Chapter 3.19. 8. Added reference design of RF layout in Chapter 9. Added current consumption of EC21-V in Chapter 3.11. 23. Table 4. 5.1.4. 6.4 1.2 2016-11-04 Lyndon LIU/

Michael ZHANG EC21_Series_Hardware_Design 5 / 118 1.3 2017-01-24 Lyndon LIU/

Rex WANG 1.4 2017-03-01 Geely YANG Deleted the LTE band TDD B41 of EC21-CT 1.5 2018-03-05 Annice ZHANG/

Lyndon LIU/

Frank WANG LTE Standard Module Series 10. Added note about SIMO in Chapter 6.6. 1. Updated frequency bands in Table 1. 2. Updated function diagram in Figure 1. 3. Updated pin assignment (top view) in Figure 2. 4. Added BT interface in Chapter 3.18.2. 5. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29. 6. Updated GNSS performance in Table 24. 7. Updated module operating frequencies in Table 26. 8. Added EC21-AUV current consumption in Table 38. 9. Updated EC21-A conducted RF receiving sensitivity 10. Added EC21-J conducted RF receiving sensitivity in of in Table 42. Table 48. 1. Updated functional diagram in Figure 1. 2. Updated frequency bands in Table 1. 3. Updated UMTS and GSM features in Table 2. 4. Updated description of pin 40/136/137/138. 5. Updated PWRKEY pulled down time to 500ms in chapter 3.7.1 and reference circuit in Figure 10. 6. Updated reference circuit of (U)SIM interface in Figure 17&18. 7. Updated reference circuit of USB interface in Figure 19. 3.20. 8. Updated PCM mode in Chapter 3.12. 9. Updated USB_BOOT reference circuit in Chapter 10. Added SD card interface in Chapter 3.13. 11. Updated module operating frequencies in Table 26. 12. Updated EC21 series modules current consumption in Chapter 6.5. 13. Updated EC21 series modules conducted RF receiving sensitivity in Chapter 6.6. 14. Added thermal consideration description in Chapter 15. Updated dimension tolerance information in 16. Added storage temperature range in Table 2 and 6.8. Chapter 7. Chapter 6.3. 17. Updated RF output power in Table 42. 18. Updated antenna requirements in Table 29. 19. Updated GPRS multi-slot classes in Table 55. EC21_Series_Hardware_Design 6 / 118 1.6 2019-04-30 Woody WU/

Nathan LIU/

Frank WANG LTE Standard Module Series 20. Updated storage information in Chapter 8.1 1. Added new variants EC21-EU and related information. 8. Figure 20. 2. Updated star structure of the power supply in Figure 3. Updated power-on scenario of module in Figure 12. 4. Updated reference circuit with translator chip in 5. Added timing sequence for entering emergency download mode of USB_BOOT interface in Figure 32. 6. Updated GNSS frequency in Table 29. 7. Updated antenna requirements in Table 30. 8. Added EC21-EU current consumption in Table 41. 9. Added EC21-EC current consumption in Table 42. 10. Updated EC21-E conducted RF receiving sensitivity 11. Updated EC21-A conducted RF receiving sensitivity 12. Updated EC21-V conducted RF receiving sensitivity 13. Updated EC21-AUT conducted RF receiving 14. Updated EC21-AU conducted RF receiving sensitivity in Table 47. sensitivity in Table 51. 15. Added EC21-EU conducted RF receiving sensitivity 16. Added EC21-EC conducted RF receiving sensitivity 17. Updated recommended stencil thickness as 0.18mm0.20mm and reflow soldering thermal profile in Chapter 8.2. 1. Added ThreadX variant EC21-AUX and updated related information in Table 1 and Chapter 2.1. 2. Deleted the information of GNSS supported on EC21-EC in Table 1 3. Updated supported protocols and USB serial driver 4. Updated functional diagram in Figure 1. 5. Updated notes in Chapter 3.7.1. 6. Updated EC21-E current consumption (GSM voice call) in Table 34. 7. Updated EC21-EU current consumption in Table in Table 44. in Table 45. in Table 46. in Table 52. in Table 53. 1.7 2019-08-19 in Table 2. Ward WANG/

Owen WEI EC21_Series_Hardware_Design 7 / 118 LTE Standard Module Series 41. 42. 8. Updated EC21-EC current consumption in Table 9. Added EC21-AUX current consumption in Table 43. 10. Updated EC21-EU conducted RF receiving 11. Added EC21-AUX conducted RF receiving sensitivity in Table 53. sensitivity in Table 55. in Figure 45. 12. Updated module bottom dimensions (bottom view) 13. Added tape and reel directions in Figure 51. 1. Removed related information of ThreadX OS because the baseline has been updated. 2. Updated the supported protocols and USB serial drivers in Table 2. 3. AT command AT+QCFG="airplanecontrol" has been fully developed in Chapter 3.5. 4. Updated the notes for GNSS performance in Chapter 4.2. 5. Updated the AT command be used to disable the receive diversity in Chapter 5.1.3. 1. Added the related information of EC21-EUX. 2. Added the Wi-Fi&Bluetooth module FC21 for use with EC21 series module. 3. Deleted the related information of EC21-EC and 4. Updated the USB serial drivers (Chapter 2.2). 5. Added the power consumption of EC21-AU (Table EC21-AUV. 48). 6. Updated all unmarked dimension tolerances from 0.05 mm to 0.2 mm (Chapter 6). 7. Updated the information of storage, manufacturing and packaging; added the description of spraying, ultrasonic cleaning and soldering process (Chapter 7.1&7.2). 1.8 2019-11-26 Fanny CHEN 1.9 2021-08-17 Barret XIONG EC21_Series_Hardware_Design 8 / 118 LTE Standard Module Series Contents Safety Information...................................................................................................................................................... 3 About the Document..................................................................................................................................................5 Contents........................................................................................................................................................................9 Table Index.................................................................................................................................................................12 Figure Index............................................................................................................................................................... 14 1 2 3 Introduction....................................................................................................................................................... 16 Special Marks........................................................................................................................................ 18 1.1. Product Overview.............................................................................................................................................19 Frequency Bands and Functions....................................................................................................... 19 2.1. Key Features......................................................................................................................................... 20 2.2. Functional Diagram.............................................................................................................................. 23 2.3. EVB......................................................................................................................................................... 24 2.4. 3.6. 3.5.2. 3.5.1. 3.5.1.1. 3.5.1.2. 3.5.1.3. 3.5.1.4. Application Interfaces.....................................................................................................................................25 General Description..............................................................................................................................25 3.1. Pin Assignment..................................................................................................................................... 26 3.2. Pin Description...................................................................................................................................... 27 3.3. Operating Modes.................................................................................................................................. 37 3.4. Power Saving........................................................................................................................................ 37 3.5. Sleep Mode................................................................................................................................. 37 UART Application Scenario........................................................................................... 37 USB Application with USB Remote Wakeup Function............................................. 38 USB Application with USB Suspend/Resume and RI Function.............................. 39 USB Application Without USB Suspend Function.....................................................39 Airplane Mode.............................................................................................................................40 Power Supply........................................................................................................................................ 41 Power Supply Pins.....................................................................................................................41 3.6.1. Voltage Stability Requirements................................................................................................41 3.6.2. Reference Design for Power Supply.......................................................................................42 3.6.3. 3.6.4. Monitor the Power Supply.........................................................................................................43 Power-on/off Scenarios....................................................................................................................... 43 Turn on with PWRKEY.............................................................................................................. 43 Turn off Module...........................................................................................................................45 Turn off with PWRKEY...................................................................................................46 Turn off with AT Command............................................................................................ 46 Reset.......................................................................................................................................................46 3.8. 3.9.

(U)SIM Interface....................................................................................................................................48 3.10. USB Interface........................................................................................................................................ 51 3.11. UART Interfaces....................................................................................................................................52 3.12. PCM and I2C Interfaces...................................................................................................................... 54 3.13. SD Card Interface................................................................................................................................. 57 3.7.2.1. 3.7.2.2. 3.7.1. 3.7.2. 3.7. EC21_Series_Hardware_Design 9 / 118 LTE Standard Module Series 3.14. Interfaces for WLAN & Bluetooth Applications................................................................................ 58 3.14.1. WLAN Application Interface......................................................................................................61 3.14.2. Bluetooth Application Interface................................................................................................ 61 3.15. ADC Interfaces...................................................................................................................................... 61 3.16. SGMII Interface..................................................................................................................................... 62 3.17. Network Status Indication....................................................................................................................64 3.18. STATUS.................................................................................................................................................. 66 3.19. RI............................................................................................................................................................. 67 3.20. USB_BOOT Interface...........................................................................................................................67 4.2. RF Specifications............................................................................................................................................. 69 Cellular Network....................................................................................................................................69 4.1. 4.1.1. Antenna Interfaces & Frequency Bands................................................................................ 69 4.1.2. Operating Frequency.................................................................................................................69 Tx Power......................................................................................................................................71 4.1.3. Rx Sensitivity...............................................................................................................................71 4.1.4. Reference Design...................................................................................................................... 77 4.1.5. GNSS......................................................................................................................................................78 4.2.1. Antenna Interface and Frequency Bands.............................................................................. 78 4.2.2. GNSS Performance................................................................................................................... 79 Reference Design...................................................................................................................... 80 4.2.3. Layout Guidelines...................................................................................................................... 80 4.2.4. RF Routing Guidelines.........................................................................................................................80 Antenna Design Requirements.......................................................................................................... 83 RF Connector Recommendation....................................................................................................... 83 4.3. 4.4. 4.5. Electrical Characteristic and Reliability.....................................................................................................86 Absolute Maximum Ratings................................................................................................................ 86 5.1. Power Supply Ratings..........................................................................................................................87 5.2. Operating and Storage Temperatures...............................................................................................87 5.3. Power Consumption............................................................................................................................. 88 5.4. ESD.......................................................................................................................................................104 5.5. Thermal Dissipation........................................................................................................................... 104 5.6. 6 Mechanical Information................................................................................................................................107 Mechanical Dimensions.................................................................................................................... 107 Recommended Footprint...................................................................................................................109 Top and Bottom Views....................................................................................................................... 110 6.1. 6.2. 6.3. Storage, Manufacturing and Packaging.................................................................................................. 111 Storage Conditions............................................................................................................................. 111 7.1. Manufacturing and Soldering............................................................................................................112 7.2. Packaging Specifications.................................................................................................................. 113 7.3. Carrier Tape...............................................................................................................................113 Plastic Reel................................................................................................................................114 Packaging Process.................................................................................................................. 115 7.3.1. 7.3.2. 7.3.3. 4 5 7 EC21_Series_Hardware_Design 10 / 118 8 Appendix References....................................................................................................................................116 LTE Standard Module Series EC21_Series_Hardware_Design 11 / 118 LTE Standard Module Series Table Index Table 1: Special Marks..............................................................................................................................................18 Table 2: Supported Frequency Bands and GNSS Function of EC21 Series Module.................................... 19 Table 3: Key Features of EC21 Series Module.................................................................................................... 20 Table 4: I/O Parameters Definition..........................................................................................................................27 Table 5: Pin Description............................................................................................................................................27 Table 6: Overview of Operating Modes..................................................................................................................37 Table 7: VBAT and GND Pins..................................................................................................................................41 Table 8: Pin Definition of PWRKEY........................................................................................................................ 44 Table 9: Pin Definition of RESET_N....................................................................................................................... 47 Table 10: Pin Definition of (U)SIM Interface..........................................................................................................48 Table 11: Pin Description of USB Interface........................................................................................................... 51 Table 12: Pin Definition of Main UART Interface..................................................................................................52 Table 13: Pin Definition of Debug UART Interface...............................................................................................53 Table 14: Pin Definition of PCM and I2C Interfaces............................................................................................ 56 Table 15: Pin Definition of SD Card Interface....................................................................................................... 57 Table 16: Pin Definition of Interfaces for WLAN & Bluetooth Applications...................................................... 58 Table 17: Pin Definition of ADC Interfaces............................................................................................................ 62 Table 18: Characteristic of ADC.............................................................................................................................. 62 Table 19: Pin Definition of SGMII Interface........................................................................................................... 63 Table 20: Pin Definition of Network Connection Status/Activity Indicator........................................................65 Table 21: Working State of Network Connection Status/Activity Indicator...................................................... 65 Table 22: Pin Definition of STATUS........................................................................................................................ 66 Table 23: Behaviors of RI......................................................................................................................................... 67 Table 24: Pin Definition of USB_BOOT Interface.................................................................................................67 Table 25: Pin Definition of RF Antennas................................................................................................................ 69 Table 26: Module Operating Frequencies............................................................................................................. 69 Table 27: RF Output Power......................................................................................................................................71 Table 28: EC21-E Conducted RF Receiving Sensitivity..................................................................................... 71 Table 29: EC21-A Conducted RF Receiving Sensitivity......................................................................................72 Table 30: EC21-V Conducted RF Receiving Sensitivity..................................................................................... 72 Table 31: EC21-AU Conducted RF Receiving Sensitivity.................................................................................. 73 Table 32: EC21-EU Conducted RF Receiving Sensitivity.................................................................................. 74 Table 33: EC21-AUT Conducted RF Receiving Sensitivity................................................................................ 74 Table 34: EC21-J Conducted RF Receiving Sensitivity...................................................................................... 75 Table 35: EC21-KL Conducted RF Receiving Sensitivity................................................................................... 75 Table 36: EC21-AUX Conducted RF Receiving Sensitivity................................................................................75 Table 37: EC21-EUX Conducted RF Receiving Sensitivity................................................................................76 Table 38: Pin Definition of GNSS Antenna Interface........................................................................................... 78 Table 39: GNSS Frequency..................................................................................................................................... 78 Table 40: GNSS Performance................................................................................................................................. 79 Table 41: Antenna Requirements............................................................................................................................83 EC21_Series_Hardware_Design 12 / 118 LTE Standard Module Series Table 42: Absolute Maximum Ratings....................................................................................................................86 Table 43: Power Supply Ratings............................................................................................................................. 87 Table 44: Operating and Storage Temperatures.................................................................................................. 87 Table 45: EC21-E Current Consumption............................................................................................................... 88 Table 46: EC21-A Current Consumption............................................................................................................... 90 Table 47: EC21-V Current Consumption............................................................................................................... 91 Table 48: EC21-AU Current Consumption............................................................................................................ 91 Table 49: EC21-EU Current Consumption............................................................................................................ 94 Table 50: EC21-AUT Current Consumption..........................................................................................................96 Table 51: EC21-J Current Consumption................................................................................................................97 Table 52: EC21-KL Current Consumption............................................................................................................. 98 Table 53: EC21-AUX Current Consumption......................................................................................................... 98 Table 54: EC21-EUX Current Consumption....................................................................................................... 102 Table 55: GNSS Current Consumption of EC21 Series Module.....................................................................104 Table 56: Electrostatics Discharge Characteristics (Temperature: 25 C, Humidity: 45 %)....................... 104 Table 57: Recommended Thermal Profile Parameters..................................................................................... 113 Table 58: Carrier Tape Dimension Table (Unit: mm)..........................................................................................114 Table 59: Plastic Reel Dimension Table (Unit: mm)...........................................................................................115 Table 60: Related Documents............................................................................................................................... 116 Table 61: Terms and Abbreviations.......................................................................................................................116 EC21_Series_Hardware_Design 13 / 118 LTE Standard Module Series Figure Index Figure 1: Functional Diagram.................................................................................................................................. 23 Figure 2: Pin Assignment (Top View)..................................................................................................................... 26 Figure 3: Sleep Mode Application via UART.........................................................................................................38 Figure 4: Sleep Mode Application with USB Remote Wakeup.......................................................................... 38 Figure 5: Sleep Mode Application with RI..............................................................................................................39 Figure 6: Sleep Mode Application Without Suspend Function...........................................................................40 Figure 7: Power Supply Limits during Burst Transmission.................................................................................42 Figure 8: Star Structure of the Power Supply....................................................................................................... 42 Figure 9: Reference Circuit of Power Supply....................................................................................................... 43 Figure 10: Turn on the Module by Using Driving Circuit..................................................................................... 44 Figure 11: Turn on the Module by Using a Button............................................................................................... 44 Figure 12: Power-up Timing.....................................................................................................................................45 Figure 13: Power-down Timing............................................................................................................................... 46 Figure 14: Reference Circuit of RESET_N by Using Driving Circuit................................................................ 47 Figure 15: Reference Circuit of RESET_N by Using a Button...........................................................................47 Figure 16: Reset Timing........................................................................................................................................... 48 Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector............................. 49 Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector............................... 50 Figure 19: Reference Circuit of USB Application................................................................................................. 51 Figure 20: Reference Circuit with Translator Chip............................................................................................... 53 Figure 21: Reference Circuit with Transistor Circuit............................................................................................ 54 Figure 22: Primary Mode Timing.............................................................................................................................55 Figure 23: Auxiliary Mode Timing............................................................................................................................55 Figure 24: Reference Circuit of PCM and I2C Application with Audio Codec.................................................56 Figure 25: Reference Circuit of SD Card Interface..............................................................................................57 Figure 26: Reference Design of WLAN & Bluetooth Applications Interfaces with FC20 Series/FC21....... 60 Figure 27: Brief Block Diagram for Ethernet Application.................................................................................... 63 Figure 28: Reference Design of SGMII Interface with PHY AR8033 Application........................................... 64 Figure 29: Reference Circuit of the Network Indicator........................................................................................ 65 Figure 30: Reference Design of STATUS..............................................................................................................66 Figure 31: Reference Circuit of USB_BOOT Interface....................................................................................... 68 Figure 32: Timing Sequence for Entering Emergency Download Mode..........................................................68 Figure 33: Reference Circuit of RF Antenna Interface........................................................................................ 77 Figure 34: Reference Circuit of GNSS Antenna...................................................................................................80 Figure 35: Microstrip Design on a 2-layer PCB....................................................................................................81 Figure 36: Coplanar Waveguide Design on a 2-layer PCB................................................................................81 Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground).......................81 Figure 38: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground).......................82 Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm)................................................................... 84 Figure 40: Mechanicals of U.FL-LP Connectors.................................................................................................. 84 Figure 41: Space Factor of Mated Connector (Unit: mm).................................................................................. 85 EC21_Series_Hardware_Design 14 / 118 LTE Standard Module Series Figure 42: Referenced Heatsink Design (Heatsink at the Top of the Module)............................................. 105 Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers PCB)..........................105 Figure 44: Module Top and Side Dimensions.....................................................................................................107 Figure 45: Module Bottom Dimensions (Bottom View).....................................................................................108 Figure 46: Recommended Footprint (Top View)................................................................................................ 109 Figure 47: Top and Bottom Views of the Module............................................................................................... 110 Figure 48: Reflow Soldering Thermal Profile...................................................................................................... 112 Figure 49: Carrier Tape Dimension Drawing.......................................................................................................114 Figure 50: Plastic Reel Dimension Drawing........................................................................................................114 Figure 51: Packaging Process.............................................................................................................................. 115 EC21_Series_Hardware_Design 15 / 118 LTE Standard Module Series 1 Introduction This document defines EC21 series module and describes its air interface and hardware interfaces which are connected with customers applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC21 series module. To facilitate its fields, relevant reference design is also provided for customers reference. application in different Associated with application note and user guide, customers can use EC21 series module to design and set up mobile applications easily. FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-

based timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2021EC21ADL 4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

LTE Band 2 :9.500dBi LTE Band 4:6.500dBi LTE Band 12 :10.197dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a EC21_Series_Hardware_Design 16 / 118 LTE Standard Module Series permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: XMR2021EC21ADL or Contains FCC ID: XMR2021EC21ADL must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF EC21_Series_Hardware_Design 17 / 118 LTE Standard Module Series L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A- 2021EC21ADL or where: 10224A- 2021EC21ADL is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A- 2021EC21ADL " ou "o: 10224A- 2021EC21ADL est le numro de certification du module". LTE Band 2 :9.500dBi LTE Band 4:6.500dBi LTE Band 12 :7.11dBi 1.1. Special Marks Table 1: Special Marks Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of such model is currently unavailable. Brackets ([]) used after a pin enclosing a range of numbers indicate all pins of the same type. For example, SDC2_DATA[0:3] refers to all four SDC2_DATA pins: SDC2_DATA0, SDC2_DATA1, SDC2_DATA2, and SDC2_DATA3. EC21_Series_Hardware_Design 18 / 118 LTE Standard Module Series 2 Product Overview 2.1. Frequency Bands and Functions EC21 series module is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It also provides GNSS 1 and voice functionality 2 for customers specific applications. EC21 series module contains 12 variants: EC21-E, EC21-A, EC21-V, EC21-AU, EC21-EU, EC21-AUT, EC21-J, EC21-KL, EC21-AUX and EC21-EUX. Customers can choose a dedicated type based on the region or operator. The following table shows the frequency bands of EC21 series module. Table 2: Supported Frequency Bands and GNSS Function of EC21 Series Module EC21 Series 2 LTE WCDMA GSM EC21-E B1/B5/B8 900/1800 MHz FDD:

B1/B3/B5/B7/B8/B20 Rx-

diversity GNSS 1 EC21-A FDD: B2/B4/B12 B2/B4/B5 EC21-V FDD: B4/B13

EC21-AU B1/B2/B5/

B8 850/900/1800/

1900 MHz FDD:

B1/B2 3/B3/B4/B5/B7/

B8/B28 TDD: B40 FDD:

B1/B3/B7/B8/B20/

B28A EC21-EU B1/B8 900/1800 MHz GPS, GLONASS, BeiDou

(COMPASS), Galileo, QZSS 1 GNSS function is optional. 2 EC21 series module contains Data + Voice version and Data-only version. Data + Voice version supports voice and data functions, while Data-only version only supports data function. 3 B2 of EC21-AU and EC21-AUX module does not support Rx-diversity. EC21_Series_Hardware_Design 19 / 118 LTE Standard Module Series EC21-AUT B1/B5 EC21-J EC21-KL EC21-AUX 3

B1/B2/B4/

B5/B8 850/900/1800/

1900 MHz

FDD:

B1/B3/B5/B7/B28 FDD:

B1/B3/B8/B18/B19/

B26 FDD:

B1/B3/B5/B7/B8 FDD:

B1/B2/B3/B4/B5/B7/

B8/B28 TDD: B40 FDD:

B1/B3/B7/B8/B20/

B28A EC21-EUX B1/B8 900/1800 MHz

With a compact profile of 29.0 mm 32.0 mm 2.4 mm, EC21 series module can meet almost all requirements for M2M applications such as metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EC21 series module is an SMD type module which can be embedded into applications through its 144 pins, including 80 LCC pins and 64 LGA pins. NOTE means supported. 2.2. Key Features The following table describes the detailed features of EC21 series module. Table 3: Key Features of EC21 Series Module Features Description Power Supply Supply voltage: 3.34.3 V Typical supply voltage: 3.8 V Transmitting Power Class 4 (33 dBm 2 dB) for GSM850 Class 4 (33 dBm 2 dB) for EGSM900 Class 1 (30 dBm 2 dB) for DCS1800 Class 1 (30 dBm 2 dB) for PCS1900 Class E2 (27 dBm 3 dB) for GSM850 8-PSK EC21_Series_Hardware_Design 20 / 118 LTE Standard Module Series Support 3GPP Rel-8 DC-HSDPA, HSPA+, HSDPA, HSUPA and Class E2 (27 dBm 3 dB) for EGSM900 8-PSK Class E2 (26 dBm 3 dB) for DCS1800 8-PSK Class E2 (26 dBm 3 dB) for PCS1900 8-PSK Class 3 (24 dBm +1/-3 dB) for WCDMA bands Class 3 (23 dBm 2 dB) for LTE-FDD bands Class 3 (23 dBm 2 dB) for LTE-TDD bands Support up to non-CA Cat 1 FDD and TDD Support 1.4/3/5/10/15/20 MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max. 10 Mbps (DL)/Max. 5 Mbps (UL) LTE-TDD: Max. 8.96 Mbps (DL)/Max. 3.1 Mbps (UL) WCDMA Support QPSK, 16QAM and 64QAM modulation DC-HSDPA: Max. 42 Mbps (DL) HSUPA: Max. 5.76 Mbps (UL) WCDMA: Max. 384 kbps (DL)/Max. 384 kbps (UL) GPRS:

Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max. 107 kbps (DL)/Max. 85.6 kbps (UL) EDGE:

Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: MCS 1-9 Uplink coding schemes: MCS 1-9 Max. 296 kbps (DL)/Max. 236.8 kbps (UL) Internet Protocol Features Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/

NITZ/SMTP/SSL/MQTT/CMUX/SMTPS/MMS*/FILE* protocols Support PAP and CHAP for PPP connections Text and PDU mode Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default

(U)SIM Interface Supports USIM/SIM card: 1.8 V, 3.0 V Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Used for audio function with external codec Supports 16-bit linear data format EC21_Series_Hardware_Design 21 / 118 LTE Features UMTS Features GSM Features SMS Audio Features PCM Interface LTE Standard Module Series Supports long frame synchronization and short frame synchronization Supports master and slave modes, but must be the master in long Compliant with USB 2.0 specification (slave only); the data transfer rate frame synchronization can reach up to 480 Mbps Used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.65.12, Android 4.x11.x, etc. Main UART:

Used for AT command communication and data transmission Baud rates reach up to 921600 bps, 115200 bps by default Support RTS and CTS hardware flow control Debug UART:

Used for Linux console and log output 115200 bps baud rate by default USB Interface UART Interfaces SD Card Interface Supports SD 3.0 protocol SGMII Interface Supports 10M/100M/1000M Ethernet work mode Supports Max. 10 Mbps (DL)/Max. 5 Mbps (UL) for 4G network Interfaces WLAN and Bluetooth Applications Support a low-power SDIO 3.0 interface for WLAN Support UART & PCM interfaces for Bluetooth Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Network Status Indication Antenna Interfaces Protocol: NMEA 0183 Data update rate: 1 Hz by default Compliant with 3GPP TS 27.007, 3GPP TS 27.005 Quectel enhanced AT commands Two pins including NET_MODE and NET_STATUS to indicate network connectivity status Main antenna interface (ANT_MAIN) Rx-diversity antenna interface (ANT_DIV) GNSS antenna interface (ANT_GNSS) Physical Characteristics Size: (29.0 0.15) mm (32.0 0.15) mm (2.4 0.2) mm Weight: approx. 4.9 g Temperature Range Operating temperature range: -35 C to +75 C 4 Extended temperature range: -40 C to +85 C 5 Storage temperature range: -40 C to +90 C 4 Within operating temperature range, the module is 3GPP compliant. 5 Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call*, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again. EC21_Series_Hardware_Design 22 / 118 LTE Standard Module Series Firmware Upgrade USB 2.0 interface or DFOTA RoHS All hardware components are fully compliant with EU RoHS directive The following figure shows a block diagram of EC21 series and illustrates the major functional parts. 2.3. Functional Diagram Power management Baseband DDR+NAND flash Radio frequency Peripheral interfaces Figure 1: Functional Diagram EC21_Series_Hardware_Design 23 / 118 LTE Standard Module Series 2.4. EVB To help customers develop applications with EC21 series, Quectel supplies an evaluation board

(UMTS&LTE EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module. For more details, see document [1]. EC21_Series_Hardware_Design 24 / 118 LTE Standard Module Series 3 Application Interfaces 3.1. General Description EC21 series module is equipped with 80 LCC pins plus 64 LGA pins that can be connected to cellular the following application platform. The subsequent chapters will provide detailed descriptions of interfaces/functions. Power supply

(U)SIM interface USB interface UART interfaces PCM and I2C interfaces SD card interface Interfaces for WLAN & Bluetooth applications ADC interface Network status indication SGMII interface USB_BOOT interface EC21_Series_Hardware_Design 25 / 118 LTE Standard Module Series 3.2. Pin Assignment The following figure shows the pin assignment of EC21 series module. WAKEUP_IN AP_READY RESERVED W_DISABLE#

NET_MODE NET_ST ATUS VDD_EXT RESERVED RESERVED GND GND USIM_GND DBG_RXD DBG_TXD USIM_VDD USIM_DATA USIM_CLK USIM_RST RESERVED 141 142 8 1 2 3 4 5 6 7 9 10 11 12 13 14 15 16 17 18 USIM_PRESENCE R E S E R V E D 1 1 4 R E S E R V E D 1 1 3 129 117 130 118 131 119 132 120 133 121 134 122 135 123 136 124 137 125 138 126 139 127 140 128 1 1 6 1 1 5 R E S E R V E D U S B _ B O O T U S B _ V B U S G N D U S B _ D M U S B _ D P R X D T X D D T R R T S C T S D C D R I S T A T U S V B A T _ B B V B A T _ B B V B A T _ R F V B A T _ R F G N D R E S E R V E D 7 2 7 1 7 0 6 9 6 8 6 7 6 6 6 5 6 4 6 3 6 2 6 1 6 0 5 9 5 8 5 7 5 6 5 5 108 103 99 95 90 85 109 104 100 96 91 86 110 105 92 87 82 83 84 79 80 81 76 77 78 73 74 75 111 106 101 97 93 88 112 107 102 98 94 89 GND GND GND GND GND GND ANT_MAIN 144 143 47 RESERVED RESERVED ANT_GNSS GND ADC0 ADC1 RESERVED I2C_SDA I2C_SCL BT_CTS BT_RXD BT_TXD BT_RTS 54 53 52 51 50 49 48 46 45 44 43 42 41 40 39 38 37 1 9 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 2 3 3 3 4 3 5 3 6 G N D G N D R E S E T _ N P W R K E Y I S D _ N S _ D E T P C M _ N I P C M _ O U T P C M _ C L K P C M _ S Y N C S D C 2 _ D A T A 3 S D C 2 _ D A T A 2 S D C 2 _ D A T A 1 S D C 2 _ D A T A 0 S D C 2 _ C L K S D C 2 _ C M D V D D _ S D O I G N D A N T _ D V I Power Pins Signal Pins WLAN Pins RESERVED Pins GND Pins Bluetooth Pins SGMII Pins Figure 2: Pin Assignment (Top View) NOTE 1. WAKEUP_IN, NET_MODE, WLAN_EN, COEX_UART_RX, COEX_UART_TX, USB_BOOT and BT_CTS cannot be pulled up before startup. 2. PWRKEY output voltage is 0.8 V because of the diode drop in the baseband chipset. 3. Digital audio (PCM) is only supported on Data + Voice version. 4. Pins 3740, 118, 127 and 129139 are used for WLAN & Bluetooth application interfaces, among which pins 118, 127 and 129138 are WLAN function pins, and the rest of pins are Bluetooth EC21_Series_Hardware_Design 26 / 118 LTE Standard Module Series function pins. Bluetooth function is under development. 5. Pins 119126 and pin 128 are used for SGMII interface. 6. Pins 2427 for PCM function are used for audio design on EC21 series module and Bluetooth function on FC20 series/FC21 modules. 7. Keep all RESERVED pins and unused pins unconnected. 8. GND pins 85112 should be connected to ground in the design. RESERVED pins 7384 should not be designed in schematic and PCB decal, and these pins should be served as a keepout area. 3.3. Pin Description The following tables show the pin definition of EC21 series module. Table 4: I/O Parameters Definition Type AI AO AIO DI DO DIO OD PI PO Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Table 5: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 59, 60 PI Power supply for modules baseband part Vmax = 4.3 V Vmin = 3.3 V Vnom = 3.8 V It must be provided with sufficient current up to 0.8 A. EC21_Series_Hardware_Design 27 / 118 VBAT_RF 57, 58 PI Power supply for modules RF part Vmax = 4.3 V Vmin = 3.3 V Vnom = 3.8 V VDD_EXT 7 PO Provide 1.8 V for external circuit Vnom = 1.8 V IOmax = 50 mA LTE Standard Module Series It must be provided with sufficient current up to 1.8 A in a burst transmission. Power supply for external GPIOs pull-

up circuits. When used with FC20 series/FC21 modules, it also defaults to supply power to the VIO pin of FC20 series/FC21 modules. If unused, keep it open. GND 8, 9, 19, 22, 36, 46, 48, 5054, 56, 72, 85112 Power-on/off Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 21 DI VH = 0.8 V Turn on/off the module The output voltage is 0.8 V because of the diode drop in the baseband chipset. If unused, keep it open. VIHmax = 2.1 V VIHmin = 1.3 V VILmax = 0.5 V RESET_N 20 DI Reset the module Status Indication Interface Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 61 OD Indicate the module's operation status NET_MODE 5 DO Indicate the modules network registration mode VOHmin = 1.35 V VOLmax = 0.45 V The driving current should be less than 0.9 mA. An external pull-up resistor is required. If unused, keep it open. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. EC21_Series_Hardware_Design 28 / 118 LTE Standard Module Series NET_STATUS 6 DO USB Interface Indicate the modules network activity status VOHmin = 1.35 V VOLmax = 0.45 V 1.8 V power domain. If unused, keep it open. Pin Name Pin No. I/O Description Comment USB_VBUS 71 DI USB_DP USB_DM 69 70 AIO AIO USB connection detect USB differential data (+) USB differential data (-)

(U)SIM Interface Pin Name Pin No. I/O Description USIM_GND 10 Specified ground for

(U)SIM card USIM_ PRESENCE 13 DI

(U)SIM card insertion detect USIM_VDD 14 PO

(U)SIM card power supply USIM_DATA 15 DIO

(U)SIM card data DC Characteristics Comment USB 2.0 Compliant. Require differential impedance of 90 . If unused, keep them open. 1.8 V power domain. If unused, keep it open. Either 1.8 V or 3.0 V is supported by the module automatically. DC Characteristics Vmax = 5.25 V Vmin = 3.0 V Vnom = 5.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V Iomax = 50 mA 1.8 V (U)SIM Vmax = 1.9 V Vmin = 1.7 V 3.0 V (U)SIM Vmax = 3.05 V Vmin = 2.7 V 1.8 V (U)SIM VILmax = 0.6 V VIHmin = 1.2 V VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM VILmax = 1.0 V VIHmin = 1.95 V VOLmax = 0.45 V EC21_Series_Hardware_Design 29 / 118 LTE Standard Module Series USIM_CLK 16 DO

(U)SIM card clock USIM_RST 17 DO

(U)SIM card reset VOHmin = 2.55 V 1.8 V (U)SIM VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM VOLmax = 0.45 V VOHmin = 2.55 V 1.8 V (U)SIM VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM VOLmax = 0.45 V VOHmin = 2.55 V Main UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment RI DCD CTS 62 63 64 DO Ring indication DO Data carrier detect DO DTE clear to send signal from DCE RTS 65 DI DTE request to send signal from DCE DTE Data terminal ready, sleep mode control DTR 66 DI TXD 67 DO Transmit RXD 68 DI Receive Debug UART Interface VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep them open. VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. 1.8 V power domain. Pulled up by default. Low level can wake up the module. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. EC21_Series_Hardware_Design 30 / 118 Pin Name Pin No. I/O Description Comment Pin Name Pin No. I/O Description Comment DBG_TXD 12 DO DBG_RXD 11 DI Debug UART transmit Debug UART receive ADC Interface ADC0 ADC1 45 44 AI AI PCM Interface 6 General-purpose ADC interface General-purpose ADC interface PCM_IN 24 DI PCM data input PCM_OUT DO PCM data output PCM_SYNC DIO PCM data frame sync 25 26 PCM_CLK 27 DIO PCM clock LTE Standard Module Series DC Characteristics VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V DC Characteristics Voltage range:

0.3 V to VBAT_BB Voltage range:

0.3 V to VBAT_BB DC Characteristics VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep them open. If unused, keep them open. 1.8 V power domain. If unused, keep them open. 1.8 V power domain. Serve as output signal in master mode. Serve as input signal in slave mode. If unused, keep them open. Pin Name Pin No. I/O Description Comment I2C Interface I2C_SCL I2C_SDA 41 42 SD Card Interface Pin Name Pin No. I/O Description DC Characteristics Comment OD OD I2C serial clock (for external codec) I2C serial data (for external codec) An external 1.8 V pull-

up resistor is required. If unused, keep them open. 6 The pins of PCM interface are used for audio design on EC21 series module and Bluetooth function on FC20 series/FC21 modules. EC21_Series_Hardware_Design 31 / 118 Pin Name Pin No. I/O Description Comment LTE Standard Module Series SDC2_DATA3 28 DIO SDC2_DATA2 29 DIO SDC2_DATA1 30 DIO SD card SDIO data bit 3 SD card SDIO data bit 2 SD card SDIO data bit 1 SDC2_DATA0 31 DIO SD card SDIO data bit 0 SDC2_CLK 32 DO SD card SDIO clock SDC2_CMD 33 DIO SD card SDIO command DC Characteristics 1.8 V signaling:

VOLmax = 0.45 V VOHmin = 1.4 V VILmin = -0.3 V VILmax = 0.58 V VIHmin = 1.27 V VIHmax = 2.0 V 3.0 V signaling:

VOLmax = 0.38 V VOHmin = 2.01 V VILmin = -0.3 V VILmax = 0.76 V VIHmin = 1.72 V VIHmax = 3.34 V 1.8 V signaling:

VOLmax = 0.45 V VOHmin = 1.4 V 3.0 V signaling:

VOLmax = 0.38 V VOHmin = 2.01 V 1.8 V signaling:

VOLmax = 0.45 V VOHmin = 1.4 V VILmin = -0.3 V VILmax = 0.58 V VIHmin = 1.27 V VIHmax = 2.0 V 3.0 V signaling:

VOLmax = 0.38 V VOHmin = 2.01 V VILmin = -0.3 V VILmax = 0.76 V VIHmin = 1.72 V VIHmax = 3.34 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V SDIO signal level can be selected according to the signal level supported by SD card, see SD 3.0 protocol for more details. If unused, keep them open. SDIO signal level can be selected according to the signal level supported by SD card, see SD 3.0 protocol for more details. If unused, keep it open. SDIO signal level can be selected according to the signal level supported by SD card, see SD 3.0 protocol for more details. If unused, keep it open. 1.8 V power domain. If unused, keep it open. SD_INS_DET 23 DI SD card insertion detect EC21_Series_Hardware_Design 32 / 118 VDD_SDIO 34 PO IOmax = 50 mA SD card SDIO pull-

up power SGMII Interface Pin Name Pin No. I/O Description Comment EPHY_RST_N 119 DO Ethernet PHY reset EPHY_INT_N 120 DI Ethernet PHY interrupt SGMII_MDATA 121 DIO SGMII MDIO data LTE Standard Module Series Configurable power supply. 1.8/2.85 V power domain. Cannot be used for SD card power supply. If unused, keep it open. DC Characteristics 1.8 V:

VOLmax = 0.45 V VOHmin = 1.4 V 2.85 V:

VOLmax = 0.35 V VOHmin = 2.14 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V 1.8 V VILmax = 0.58 V VIHmin = 1.27 V VOLmax = 0.45 V VOHmin = 1.4 V 2.85 V VILmax = 0.71 V VIHmin = 1.78 V VOLmax = 0.35 V VOHmin = 2.14 V 1.8 V:

VOLmax = 0.45 V VOHmin = 1.4 V 2.85 V:

VOLmax = 0.35 V VOHmin = 2.14 V 1.8/2.85 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8/2.85 V power domain. If unused, keep it open. 1.8/2.85 V power domain. If unused, keep it open. SGMII_MCLK 122 DO SGMII MDIO clock SGMII_TX_M 123 AO SGMII transmit (-) Connect it with a EC21_Series_Hardware_Design 33 / 118 SGMII_TX_P 124 AO SGMII transmit (+) SGMII_RX_P 125 AI SGMII receive (+) SGMII_RX_M 126 AI SGMII receive (-) USIM2_VDD 128 PO SGMII_MDATA pull-

up power supply LTE Standard Module Series 0.1 F capacitor, and close to the PHY side. If unused, keep them open. Connect it with a 0.1 F capacitor, and close to the module. If unused, keep them open. Configurable power supply. 1.8/2.85 V power domain. If unused, keep it open. Interfaces for WLAN and Bluetooth Applications Pin Name Pin No. I/O Description DC Characteristics Comment SDC1_DATA3 129 DIO SDC1_DATA2 130 DIO SDC1_DATA1 131 DIO SDC1_DATA0 132 DIO WLAN SDIO data bit 3 WLAN SDIO data bit 2 WLAN SDIO data bit 1 WLAN SDIO data bit 0 VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V SDC1_CLK 133 DO WLAN SDIO clock SDC1_CMD 134 DIO VOLmax = 0.45 V VOHmin = 1.35 V WLAN SDIO command WLAN power control PM_ENABLE 127 DO WAKE_ON_ WIRELESS 135 DI WLAN wake up the module VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V WLAN_EN 136 DO WLAN function enable VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep them open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Active high. 1.8 V power domain. Active low. If unused, keep it open. 1.8 V power domain. Active high. Cannot be pulled up EC21_Series_Hardware_Design 34 / 118 COEX_UART_ RX 137 DI VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V LTE/WLAN &

Bluetooth coexistence receive LTE/WLAN &

Bluetooth coexistence transmit COEX_UART_ TX 138 DO VOLmax = 0.45 V VOHmin = 1.35 V WLAN_SLP_ CLK 118 DO WLAN sleep clock BT_RTS*

37 DI BT_TXD*

38 DO DTE request to send signal from DCE VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V Bluetooth UART transmit VOLmax = 0.45 V VOHmin = 1.35 V BT_RXD*

39 DI Bluetooth UART receive VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V BT_CTS*

40 DO DTE clear to send signal from DCE VOLmax = 0.45 V VOHmin = 1.35 V BT_EN*

139 DO Bluetooth function enable VOLmax = 0.45 V VOHmin = 1.35 V Antenna Interface ANT_DIV ANT_MAIN ANT_GNSS 35 49 47 AI AIO AI Diversity antenna interface Main antenna interface GNSS antenna interface LTE Standard Module Series before startup. If unused, keep it open. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. If unused, keep it open. 1.8 V power domain. If unused, keep them open. 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 50 impedance. If unused, keep it open. 50 impedance. 50 impedance. If unused, keep it Pin Name Pin No. I/O Description DC Characteristics Comment EC21_Series_Hardware_Design 35 / 118 LTE Standard Module Series open. Other Interface Pins Pin Name Pin No. I/O Description DC Characteristics Comment WAKEUP_IN 1 DI Sleep mode control W_DISABLE#

4 DI Airplane mode control AP_READY 2 DI USB_BOOT Interface Application processor sleep state detection VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V USB_BOOT 115 DI Force the module to enter emergency download mode. VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.2 V VIHmax = 2.0 V RESERVED Pins Pin Name Pin No. RESERVED 3, 18, 43, 55, 7384, 113, 114, 116, 117, 140144 1.8 V power domain. Cannot be pulled up before startup. Low level can wake up the module. If unused, keep it open. 1.8 V power domain. Pull-up by default. At low level, module can enter airplane mode. If unused, keep it open. 1.8 V power domain. If unused, keep it open. 1.8 V power domain. Cannot be pulled up before startup. Active high. It is recommended to reserve test point. Comment Keep these pins unconnected. Pin Name Pin No. I/O Description DC Characteristics Comment EC21_Series_Hardware_Design 36 / 118 LTE Standard Module Series The following table briefly outlines the operating modes to be mentioned in the following chapters. 3.4. Operating Modes Table 6: Overview of Operating Modes Mode Details Normal Operation Airplane Mode Minimum Functionality Mode Sleep Mode Power Down Mode Idle The module remains registered on the network, and is ready to send and receive data. In this mode, the software is active. Talk/Data The module is connected to network. Its current consumption varies with the network setting and data transfer rate. AT+CFUN=4 or W_DISABLE# pin can set the module into airplane mode where the RF function is invalid. the module into a minimum functionality mode without AT+CFUN=0 can set removing the power supply. In this mode, both RF function and (U)SIM card are invalid. The module remains the ability to receive paging message, SMS, voice call and TCP/UDP data from the network normally. In this mode, the current consumption of the module is reduced to a very low level. The modules power supply is cut off by its power management unit. In this mode, the software is inactive, the serial interfaces are inaccessible, while the operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. For details of the command, see document [2]. 3.5. Power Saving 3.5.1. Sleep Mode EC21 series can reduce its current consumption to a minimum value during the sleep mode. The following section describes power saving procedures of the module. 3.5.1.1. UART Application Scenario If the host communicates with module via UART interface, the following preconditions can let the module enter sleep mode. Execute AT+QSCLK=1 to enable sleep mode. For details of the command, see document [2]. Drive DTR to high level. EC21_Series_Hardware_Design 37 / 118 The following figure shows the connection between the module and the host. LTE Standard Module Series Figure 3: Sleep Mode Application via UART Driving the modules DTR to low level will wake up the module. When module has a URC to report, RI signal will wake up the host. See Chapter 3.19 for details about RI behaviors. AP_READY will detect the sleep state of the host (can be configured to high level or low level detection). For more details about AT+QCFG="apready", see document [3]. 3.5.1.2. USB Application with USB Remote Wakeup Function the host supports USB suspend/resume and remote wakeup functions, If preconditions must be met to let the module enter sleep mode. the following three Execute AT+QSCLK=1 to enable sleep mode. Ensure DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. Figure 4: Sleep Mode Application with USB Remote Wakeup EC21_Series_Hardware_Design 38 / 118 Sending data to module via USB will wake up the module. When module has a URC to report, the module will send remote wake-up signals via USB bus to wake up the host. LTE Standard Module Series 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend and resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter sleep mode. Execute AT+QSCLK=1 to enable sleep mode. Ensure DTR is held at high level or keep it open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure shows the connection between the module and the host. Figure 5: Sleep Mode Application with RI Sending data to module via USB will wake up the module. When module has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application Without USB Suspend Function the host does not support USB suspend function, USB_VBUS should be disconnected via an If additional control circuit to let the module enter sleep mode. Execute AT+QSCLK=1 to enable sleep mode. Ensure the DTR is held at high level or keep it open. Disconnect USB_VBUS. EC21_Series_Hardware_Design 39 / 118 The following figure shows the connection between the module and the host. LTE Standard Module Series Figure 6: Sleep Mode Application Without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. Pay attention to the voltage-level matching of the circuit in dotted line between the module and the host. For more details about EC21 series power management application, see document [4]. 3.5.2. Airplane Mode When the module enters airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. This mode can be set via the following ways. The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. NOTE Hardware:

Software:

AT+CFUN=<fun> provides the choice of the functionality level through setting <fun> into 0, 1 or 4. AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled. AT+CFUN=1: Full functionality mode (by default). AT+CFUN=4: Airplane mode. RF function is disabled. EC21_Series_Hardware_Design 40 / 118 LTE Standard Module Series NOTE 1. The W_DISABLE# control function is disabled in firmware by default. It can be enabled by AT+QCFG="airplanecontrol". For details of the command, see document [2]. 2. The execution of AT+CFUN will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EC21 series provides four VBAT pins for connection with the external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for modules RF part. Two VBAT_BB pins for modules baseband part. The following table shows the details of VBAT pins and ground pins. Table 7: VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 57, 58 VBAT_BB 59, 60 Power supply for modules RF part. Power supply for modules baseband part. 3.3 3.3 3.8 4.3 3.8 4.3 V V GND 8, 9, 19, 22, 36, 46, 48, 5054, 56, 72, 85112 3.6.2. Voltage Stability Requirements The power supply range of the module is from 3.34.3 V. Make sure that the input voltage will never drop below 3.3 V. The following figure shows the voltage drop during burst transmission in 2G network. The voltage drop will be less in 3G and 4G networks. EC21_Series_Hardware_Design 41 / 118 LTE Standard Module Series Figure 7: Power Supply Limits during Burst Transmission To decrease voltage-drop, use bypass capacitors of at least 100 F with low ESR, and reserve a multi-

layer ceramic chip capacitor (MLCC) array due to their low ESR. It is recommended to use at least three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to VBAT_BB and VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 1 mm; and the width of VBAT_RF trace should be no less than 2 mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to avoid the damage caused by electric surge and ESD, it is suggested that a TVS diode with suggested low reverse stand-off voltage VRWM 4.5 V, low clamping voltage VC and high reverse peak pulse current IPP should be used. The following figure shows the star structure of the power supply. Figure 8: Star Structure of the Power Supply 3.6.3. Reference Design for Power Supply The performance of the module largely depends on the power source. The power supply should be able EC21_Series_Hardware_Design 42 / 118 LTE Standard Module Series to provide sufficient current up to 2.0 A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply. The following figure shows a reference design for +5.0 V input power source. The typical output of the power supply is about 3.8 V and the maximum load current is 3.0 A. MIC29302WU 2 IN N E 1 4 OUT J D A D N G 3 5 DC_IN VBAT 51K 4.7K 470 F 100 nF VBAT_EN 47K 100K 1 %

47K 1 %

470R 470 F 100 nF Figure 9: Reference Circuit of Power Supply NOTE To avoid damaging internal flash, do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 3.6.4. Monitor the Power Supply AT+CBC can be used to monitor the VBAT_BB voltage value. For details of document [2].. the command, see 3.7. Power-on/off Scenarios 3.7.1. Turn on with PWRKEY The following table shows the pin definition of PWRKEY. EC21_Series_Hardware_Design 43 / 118 LTE Standard Module Series Table 8: Pin Definition of PWRKEY Pin Name Pin No. I/O Description Comment PWRKEY 21 DI Turn on/off the module The output voltage is 0.8 V because of the diode drop in the baseband chipset. When the module is in power down mode, it can be turned on by driving the PWRKEY pin low for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY. After STATUS pin (require external pull-up resistor) outputs a low level, PWRKEY pin can be released. A simple reference circuit is illustrated in the following figure. Figure 10: Turn on the Module by Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the button, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 11: Turn on the Module by Using a Button EC21_Series_Hardware_Design 44 / 118 The power-up scenario is illustrated in the following figure. LTE Standard Module Series Figure 12: Power-up Timing NOTE 1. Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2. PWRKEY can be pulled down directly to GND with a recommended 10 k resistor if the module needs to be powered on automatically and shutdown is not needed. 3.7.2. Turn off Module The following procedures can be used to turn off the module normally:

Turn off the module using the PWRKEY pin. EC21_Series_Hardware_Design 45 / 118 Turn off the module using AT+QPOWD. For details of the command, see document [2]. LTE Standard Module Series 3.7.2.1. Turn off with PWRKEY Driving the PWRKEY pin low for at least 650 ms, the module will execute power-off procedure after the PWRKEY is released. The power-down scenario is illustrated in the following figure. Figure 13: Power-down Timing 3.7.2.2. Turn off with AT Command It is also a safe way to use AT+QPOWD to turn off the module, which is similar to turning off the module via PWRKEY pin. 1. To avoid damaging internal flash, do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off. 2. When turning off module with the AT command, keep PWRKEY at high level after the execution of the command. Otherwise, the module will be turned on again after successfully turn-off. NOTE 3.8. Reset The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N low EC21_Series_Hardware_Design 46 / 118 LTE Standard Module Series for 150460 ms. Table 9: Pin Definition of RESET_N Pin Name Pin No. Description Comment RESET_N 20 Reset the module 1.8 V power domain I/O DI The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 14: Reference Circuit of RESET_N by Using Driving Circuit Figure 15: Reference Circuit of RESET_N by Using a Button The reset scenario is illustrated in the following figure. EC21_Series_Hardware_Design 47 / 118 LTE Standard Module Series Figure 16: Reset Timing NOTE 1. Use RESET_N only when failed to turn off the module by AT+QPOWD and PWRKEY pin. 2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported. Table 10: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Description Comment USIM_VDD PO

(U)SIM card power supply USIM_DATA DIO (U)SIM card data USIM_CLK DO

(U)SIM card clock Either 1.8 V or 3.0 V is supported by the module automatically. USIM_RST USIM_ PRESENCE DO

(U)SIM card reset DI

(U)SIM card insertion detect 1.8 V power domain. If unused, keep it open. 14 15 16 17 13 EC21_Series_Hardware_Design 48 / 118 LTE Standard Module Series USIM_GND 10 Specified ground for (U)SIM card EC21 series supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections. By default, it is disabled, and can be configured via AT+QSIMDET. See document [2] for more details about the command. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. VDD_EXT USIM_VDD 51K 15K Module USIM_GND USIM_VDD USIM_RST USIM_CLK USIM_PRESENCE USIM_DATA 0R 0R 0R 100 nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33 pF 33 pF 33 pF GND GND GND Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. EC21_Series_Hardware_Design 49 / 118 LTE Standard Module Series USIM_VDD USIM_GND USIM_VDD USIM_RST USIM_CLK USIM_DATA 15K 0R 0R 0R Module 100 nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33 pF 33 pF 33 pF GND GND Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector To enhance the reliability and availability of the (U)SIM card in customers applications, please follow the criteria below in (U)SIM circuit design:

Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200 mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1 F, and place it as close to (U)SIM card connector as possible. If the ground is complete on customers PCB, USIM_GND can be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. For better ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should not be more than 15 pF. The 0 resistors should be added in series between the module and the (U)SIM card to facilitate debugging. The 33 pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA trace can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. EC21_Series_Hardware_Design 50 / 118 LTE Standard Module Series 3.10. USB Interface EC21 series contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface can only serve as a slave device. EC21 series module can be used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface. Table 11: Pin Description of USB Interface Pin Name Pin No. I/O Description Comment USB_DP AIO USB differential data (+) USB_DM AIO USB differential data (-) USB 2.0 Compliant. Require differential impedance of 90 . If unused, keep them open. USB_VBUS 71 USB connection detect Typical 5.0 V GND 72 Ground

For more details about the USB 2.0 specifications, visit http://www.usb.org/home. 69 70 DI

The USB interface is recommended to be reserved for firmware upgrade in customers designs. The following figure shows a reference circuit of USB interface. Figure 19: Reference Circuit of USB Application EC21_Series_Hardware_Design 51 / 118 LTE Standard Module Series A common mode choke L1 is recommended to be added in series between the module and customers MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data trace signal, L1 & R3 & R4 components must be placed close to the module, and these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. To meet USB 2.0 specification, the following principles should be complied with when design the USB interface. It is important to route the USB signal impedance of USB differential trace is 90 . traces as differential pairs with total grounding. The Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. Route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. Junction capacitance of the ESD protection component might cause influences on USB data traces, so pay attention to the selection of the component. Typically, the stray capacitance should be less than 2 pF. Keep the ESD protection components to the USB connector as close as possible. 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. The main UART interface supports 4800 bps, 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps, 230400 bps, 460800 bps and 921600 bps baud rates, and the default is 115200 bps. It also supports RTS and CTS hardware flow control, and can be used for data transmission and AT command communication. The debug UART interface supports 115200 bps baud rate. It is used for Linux console and log output. The following tables show the pin definition of the UART interfaces. Table 12: Pin Definition of Main UART Interface Pin Name Pin No. I/O Description Comment RI DCD 62 63 DO Ring indication DO Data carrier detect 1.8 V power domain If unused, keep them open. EC21_Series_Hardware_Design 52 / 118 LTE Standard Module Series DO DTE clear to send signal from DCE DI DTE request to send signal from DCE CTS RTS TXD RXD 64 65 67 68 DTR 66 DI Data terminal ready, sleep mode control DO Transmit DI Receive 1.8 V power domain. Pulled up by default. Driving it low can wake up the module. If unused, keep it open. 1.8 V power domain. If unused, keep them open. Table 13: Pin Definition of Debug UART Interface Pin Name Pin No. Description Comment DBG_TXD DBG_RXD 12 11 Debug UART transmit Debug UART receive 1.8 V power domain If unused, keep them open. I/O DO DI The module provides 1.8 V UART interface. A voltage-level translator should be used if customers application is equipped with a 3.3 V UART interface. A voltage-level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. VDD_EXT VCCA VCCB 0.1uF VDD_MCU 0.1uF 1 0 K 120K RI DCD CTS RTS DTR TXD RXD OE A1 A2 A3 A4 A5 A6 A7 A8 Translator GND B1 B2 B3 B4 B5 B6 B7 B8 51K 51K Figure 20: Reference Circuit with Translator Chip RI_MCU DCD_MCU CTS_MCU RTS_MCU DTR_MCU TXD_MCU RXD_MCU Visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. For the design of circuits in dotted lines, please refer to that of circuits in solid lines, but please pay attention to the direction of connection. EC21_Series_Hardware_Design 53 / 118 LTE Standard Module Series Figure 21: Reference Circuit with Transistor Circuit NOTE to the host RTS. 1. Transistor circuit solution is not suitable for applications with high baud rates exceeding 460 kbps. 2. Please note that the module CTS is connected to the host CTS, and the module RTS is connected 3.12. PCM and I2C Interfaces EC21 series provides one Pulse Code Modulation (PCM) digital supports the following modes and one I2C interface:

interface for audio design, which Primary mode (short frame synchronization, works as both master and slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256 kHz, 512 kHz, 1024 kHz or 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4096 kHz PCM_CLK at 16 kHz PCM_SYNC. In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256 kHz, 512 kHz, 1024 kHz or 2048 kHz PCM_CLK and an 8 kHz, 50 % duty cycle PCM_SYNC. EC21_Series_Hardware_Design 54 / 118 EC21 series supports 16-bit linear data format. The following figures show the primary modes timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary modes timing relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK. LTE Standard Module Series Figure 22: Primary Mode Timing Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. EC21_Series_Hardware_Design 55 / 118 LTE Standard Module Series Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_IN DI PCM data input PCM_OUT DO PCM data output PCM_SYNC 26 DIO PCM data frame sync PCM_CLK DIO PCM clock I2C_SCL I2C_SDA OD OD I2C serial clock (for external codec) I2C serial data (for external codec) 24 25 27 41 42 1.8 V power domain If unused, keep them open. 1.8 V power domain. Serve as output signal in master mode. Serve as input signal in slave mode. If unused, keep them open. An external 1.8 V pull-up resistor is required. If unused, keep them open. Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. See document [2]

for more details about AT+QDAI. The following figure shows a reference design of PCM and I2C interfaces with external codec IC. Figure 24: Reference Circuit of PCM and I2C Application with Audio Codec NOTE 1. It is recommended to reserve an RC (R = 22 , C = 22 pF) circuits on the PCM lines, especially for PCM_CLK. 2. EC21 series only works as a master device pertaining to I2C interface. EC21_Series_Hardware_Design 56 / 118 LTE Standard Module Series 3.13. SD Card Interface EC21 series module supports SDIO 3.0 interface for SD card. The following table shows the pin definition of SD card interface. Table 15: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SDC2_DATA3 DIO SD card SDIO data bit 3 SDC2_DATA2 DIO SD card SDIO data bit 2 SDC2_DATA1 DIO SD card SDIO data bit 1 SDC2_DATA0 DIO SD card SDIO data bit 0 SDC2_CLK DO SD card SDIO clock SDC2_CMD DIO SD card SDIO command 28 29 30 31 32 33 VDD_SDIO 34 PO SD card SDIO pull-up power SD_INS_DET 23 DI SD card insertion detect The following figure shows a reference design of SD card. SDIO signal output voltage can be selected according to the signal output voltage supported by SD card, see SD 3.0 protocol for more details. If unused, keep them open. 1.8/2.85 V power domain. Configurable power supply. Cannot be used for SD card power supply. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Figure 25: Reference Circuit of SD Card Interface EC21_Series_Hardware_Design 57 / 118 LTE Standard Module Series In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with:

SD_INS_DET must be connected. The voltage range of SD card power supply VDD_3V is 2.73.6 V and sufficient current up to 0.8 A should be provided. As the maximum output current of VDD_SDIO is 50 mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card. To avoid jitter of bus, resistors R7R11 are needed to pull up the SDIO to VDD_SDIO. The value of these resistors is among 10100 k and the recommended value is 100 k. VDD_SDIO should be used as the pull-up power. In order to adjust signal quality, it is recommended to add 0 resistors R1R6 in series between the module and the SD card. The bypass capacitors C1C6 are reserved and not mounted by default. All resistors and bypass capacitors should be placed close to the module. In order to offer good ESD protection, it is recommended to add a TVS diode on SD card pins near the SD card connector with junction capacitance less than 15 pF. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of trace is 50 (10 %). SDIO bus should be less than 15 pF. It is recommended to keep the trace length difference between SDC2_CLK and SDC2_DATA[0:3]/

SDC2_CMD less than 1 mm and the total routing length less than 50 mm. The total trace length inside the module is 27 mm, so the exterior total trace length should be less than 23 mm. 3.14. Interfaces for WLAN & Bluetooth Applications EC21 series supports a low-power SDIO 3.0 interface for WLAN and UART/PCM interfaces for Bluetooth function. The following table shows the pin definition of WLAN & Bluetooth application interfaces. Table 16: Pin Definition of Interfaces for WLAN & Bluetooth Applications Pin Name Pin No. I/O Description Comment WLAN Application Interface SDC1_DATA3 129 DIO WLAN SDIO data bit 3 SDC1_DATA2 130 DIO WLAN SDIO data bit 2 1.8 V power domain. If unused, keep them open. EC21_Series_Hardware_Design 58 / 118 SDC1_DATA1 131 DIO WLAN SDIO data bit 1 SDC1_DATA0 132 DIO WLAN SDIO data bit 0 SDC1_CLK DO WLAN SDIO clock SDC1_CMD DIO WLAN SDIO command 133 134 WLAN_EN 136 DO WLAN function enable Coexistence and Control Interface PM_ENABLE 127 DO WLAN power control LTE Standard Module Series 1.8 V power domain Active high. Cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain. Active high. If unused, keep it open. 1.8 V power domain. Active low. If unused, keep it open. WAKE_ON_ WIRELESS 135 WLAN wake up the module DI DI COEX_UART_RX 137 COEX_UART_TX 138 DO LTE/WLAN & Bluetooth coexistence receive LTE/WLAN & Bluetooth coexistence transmit 1.8 V power domain. Cannot be pulled up before startup. If unused, keep them open. WLAN_SLP_CLK 118 DO WLAN sleep clock If unused, keep it open. Bluetooth Application Interface BT_RTS BT_TXD BT_RXD BT_CTS DI DTE request to send signal from DCE DO Bluetooth UART transmit DI Bluetooth UART receive DO DTE clear to send signal from DCE BT_EN 139 DO Bluetooth function enable PCM Interface 7 PCM_IN DI PCM data input 37 38 39 40 24 25 1.8 V power domain. If unused, keep them open. 1.8 V power domain Cannot be pulled up before startup. If unused, keep it open. 1.8 V power domain Active high. If unused, keep them open. PCM_OUT DO PCM data output 7 The PCM function of pins 2427 can be used for audio design on EC21 series module and Bluetooth function on FC20 series/FC21 modules. 1.8 V power domain. If unused, keep them open. EC21_Series_Hardware_Design 59 / 118 PCM_SYNC DIO PCM data frame sync 26 27 PCM_CLK DIO PCM clock LTE Standard Module Series 1.8 V power domain. Serve as output signal in master mode. Serve as input signal in slave mode. If unused, keep them open. The following figure shows a reference design of interfaces for WLAN and Bluetooth application with Quectel FC20 series/FC21 modules. Figure 26: Reference Design of WLAN & Bluetooth Applications Interfaces with FC20 Series/FC21 NOTE EC21_Series_Hardware_Design 60 / 118 LTE Standard Module Series 1. FC20 series/FC21 modules can only be used as a slave device. 2. When Bluetooth function is enabled on EC21 series module, PCM_SYNC and PCM_CLK pins are only used to output signals. Bluetooth function is under development. 3. For more information about interfaces for WLAN and Bluetooth applications, see document [6]. 3.14.1. WLAN Application Interface EC21 series provides a low power SDIO 3.0 interface and a control interface for WLAN design. SDIO interface supports the SDR mode, and the maximum frequency is up to 50 MHz. As SDIO signals are high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles:

It is important to route the SDIO signal traces with total grounding. The impedance of SDIO signal trace is 50 10 %. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. It is recommended to keep matching length between SDC1_CLK and SDC1_DATA[0:3]/SDC1_CMD less than 1 mm and total routing length less than 50 mm. Keep termination resistors within 1524 on SDC1_CLK signal traces near the module and keep the routing distance from the modules SDC1_CLK pin to termination resistors less than 5 mm. Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than 15 pF. 3.14.2. Bluetooth Application Interface EC21 series module supports a dedicated UART interface and a PCM interface for Bluetooth application. And Bluetooth functions are under development. Further information about Bluetooth application interface will be provided in future version of document. this 3.15. ADC Interfaces The module provides two analog-to-digital converter (ADC) interfaces. AT+QADC=0 can be used to read the voltage value on ADC0 pin. AT+QADC=1 can be used to read the voltage value on ADC1 pin. For more details about these AT commands, see document [2]. To improve the accuracy of ADC, the trace of ADC should be surrounded by ground. EC21_Series_Hardware_Design 61 / 118 LTE Standard Module Series Table 17: Pin Definition of ADC Interfaces Pin Name Pin No. Description Comment ADC0 ADC1 45 44 General-purpose ADC interface General-purpose ADC interface If unused, keep them open. The following table describes the characteristic of ADC function. Table 18: Characteristic of ADC Parameter Min. Typ. Max. ADC0 Voltage Range ADC1 Voltage Range ADC Resolution 0.3 0.3

15 VBAT_BB VBAT_BB

Unit V V bits NOTE 1. ADC input voltage must not exceed that of VBAT_BB. 2. 3. It is prohibited to supply any voltage to ADC pins when VBAT power supply is removed. It is recommended to use a resistor divider circuit for ADC application. 3.16. SGMII Interface EC21 series module includes an integrated Ethernet MAC with an SGMII interface and two management interfaces. The key features of the SGMII interface are shown below:

IEEE802.3 compliant Support 10M/100M/1000M Ethernet work mode Support maximum 10 Mbps (DL)/5 Mbps (UL) for 4G network Support VLAN tagging Support IEEE1588 and PTP Can be used to connect to external Ethernet PHY like AR8033, or to an external switch Management interfaces support dual voltage 1.8/2.85 V The following table shows the pin definition of SGMII interface. EC21_Series_Hardware_Design 62 / 118 LTE Standard Module Series Table 19: Pin Definition of SGMII Interface Pin No. Control Signal Interface Pin Name I/O Description Comment EPHY_RST_N 119 DO Ethernet PHY reset EPHY_INT_N 120 DI Ethernet PHY interrupt SGMII_MDATA 121 DIO SGMII MDIO data SGMII_MCLK 122 DO SGMII MDIO clock 1.8/2.85 V power domain. If unused, keep them open. USIM2_VDD 128 PO SGMII Data Interface SGMII_MDATA pull-up power supply Configurable power supply. 1.8/2.85 V power domain. If unused, keep it open. SGMII_TX_M 123 AO SGMII transmit (-) SGMII_TX_P 124 AO SGMII transmit (+) SGMII_RX_P 125 SGMII receive (+) SGMII_RX_M 126 SGMII receive (-) Connect it with a 0.1 F capacitor, and close to the PHY side. If unused, keep them open. Connect it with a 0.1 F capacitor, and close to the module. If unused, keep them open. The following figure shows the simplified block diagram for Ethernet application. AI AI SGMII Control Module AR8033 MDI Ethernet Transformer RJ45 Figure 27: Brief Block Diagram for Ethernet Application The following figure shows a reference design of SGMII interface with PHY AR8033 application. EC21_Series_Hardware_Design 63 / 118 LTE Standard Module Series Figure 28: Reference Design of SGMII Interface with PHY AR8033 Application To enhance the reliability and availability in customers applications, please follow the criteria below in the Ethernet PHY circuit design:

Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc. Keep the maximum trace length less than 25.4 cm and keep the length difference on the differential The differential impedance of SGMII data trace is 100 10%, and the reference ground of the area pairs less than 0.5 mm. should be complete. Make sure the trace spacing between SGMII_TX and corresponding SGMII_TX is at least 3 times of the trace width, and the same to the adjacent signal traces. 3.17. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two pins which are NET_MODE and NET_STATUS. The following tables describe the pin definition and logic level changes in different network status. EC21_Series_Hardware_Design 64 / 118 LTE Standard Module Series Table 20: Pin Definition of Network Connection Status/Activity Indicator Pin Name I/O Description Comment Pin No. NET_MODE 5 DO Indicate the modules network registration mode 1.8 V power domain. Cannot be pulled up before startup. If unused, keep it open. NET_STATUS 6 DO Indicate the modules network activity status 1.8 V power domain If unused, keep it open. Table 21: Working State of Network Connection Status/Activity Indicator Pin Name Logic Level Changes Network Status NET_MODE Always High Always Low Registered on LTE network Others Flicker slowly (200 ms High/1800 ms Low) Network searching NET_STATUS Flicker slowly (1800 ms High/200 ms Low) Idle Flicker quickly (125 ms High/125 ms Low) Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure. Figure 29: Reference Circuit of the Network Indicator EC21_Series_Hardware_Design 65 / 118 LTE Standard Module Series 3.18. STATUS It can be The STATUS pin is an open drain output connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present high-impedance state. for indicating the modules operation status. Table 22: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 61 OD Indicate the modules operation status The driving current should be less than 0.9 mA. An external pull-up resistor is required. If unused, keep it open. The following figure shows different circuit designs of STATUS, and customers can choose either one according to customers application demands. Figure 30: Reference Design of STATUS NOTE The status pin cannot be used as indication of module shutdown status when VBAT power supply is removed. EC21_Series_Hardware_Design 66 / 118 LTE Standard Module Series 3.19. RI NOTE AT+QCFG="risignaltype","physical" can be used to configure RI behavior. No matter on which port a URC is presented, the URC will trigger the behaviors of RI pin. See document [3] for details. URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG. The default port is USB AT port. See document [2] for details. In addition, RI behavior can be configured flexibly. The default behaviors of the RI is shown as below. Table 23: Behaviors of RI State Idle URC Response RI keeps at high level RI outputs 120 ms low pulse when a new URC returns The RI behavior can be changed by AT+QCFG="urc/ri/ring". See document [2] for details. 3.20. USB_BOOT Interface EC21 series provides a USB_BOOT pin. Customers can pull up USB_BOOT to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface. Table 24: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 115 DI Force the module to enter emergency download mode 1.8 V power domain. Cannot be pulled up before startup. Active high. It is recommended to reserve test point. EC21_Series_Hardware_Design 67 / 118 The following figure shows a reference circuit of USB_BOOT interface. LTE Standard Module Series Module VDD_EXT USB_BOOT Test points 4.7K Close to test points TVS Figure 31: Reference Circuit of USB_BOOT Interface Figure 32: Timing Sequence for Entering Emergency Download Mode NOTE 1. Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2. When using MCU to control module to enter the emergency download mode, please follow the above timing sequence. It is not recommended to pull up USB_BOOT to 1.8 V before powering up VBAT. Connect the test points as shown in Figure 31 can manually force the module to enter download mode. EC21_Series_Hardware_Design 68 / 118 LTE Standard Module Series 4 RF Specifications EC21 series antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high-speed movement and multipath effect, and a GNSS antenna interface. The impedance of antenna ports is 50 . 4.1. Cellular Network 4.1.1. Antenna Interfaces & Frequency Bands The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 25: Pin Definition of RF Antennas Pin Name Pin No. I/O Description Comment ANT_MAIN ANT_DIV 49 35 AIO Main antenna interface 50 impedance AI Diversity antenna interface 50 impedance. If unused, keep it open. 4.1.2. Operating Frequency Table 26: Module Operating Frequencies 3GPP Band Transmit GSM850 EGSM900 DCS1800 PCS1900 824849 880915 17101785 18501910 WCDMA B1 19201980 Receive 869894 925960 18051880 19301990 21102170 Unit MHz MHz MHz MHz MHz EC21_Series_Hardware_Design 69 / 118 LTE Standard Module Series WCDMA B2 18501910 WCDMA B4 17101755 WCDMA B5 WCDMA B8 824849 880915 LTE-FDD B1 19201980 LTE-FDD B2 18501910 LTE-FDD B3 17101785 LTE-FDD B4 17101755 LTE-FDD B5 824849 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B26 LTE-FDD B28 880915 699716 777787 815830 830845 832862 814849 703748 19301990 21102155 869894 925960 21102170 19301990 18051880 21102155 869894 925960 729746 746756 860875 875890 791821 859894 758803 LTE-FDD B7 25002570 26202690 LTE-TDD B40 23002400 23002400 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EC21_Series_Hardware_Design 70 / 118 LTE Standard Module Series The following table shows the RF output power of EC21 series module. 4.1.3. Tx Power Table 27: RF Output Power Frequency Max. RF output power Min. RF output power GSM850/EGSM900 33 dBm 2 dB DCS1800/PCS1900 30 dBm 2 dB GSM850/EGSM900 (8-PSK) 27 dBm 3 dB DCS1800/PCS1900 (8-PSK) 26 dBm 3 dB WCDMA bands 24 dBm +1/-3 dB LTE-FDD bands 23 dBm 2 dB LTE-TDD bands 23 dBm 2 dB 5 dBm 5 dB 0 dBm 5 dB 5 dBm 5 dB 0 dBm 5 dB

< -49 dBm

< -39 dBm

< -39 dBm In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. NOTE 4.1.4. Rx Sensitivity The following tables show the conducted RF receiving sensitivity of EC21 series module. Table 28: EC21-E Conducted RF Receiving Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO 8 Receiving Sensitivity (Typ.) EGSM900

-109.0 dBm

-102.0 dBm 8 SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. EC21_Series_Hardware_Design 71 / 118

DCS1800

-109.0 dBm WCDMA B1

-110.5 dBm WCDMA B5

-110.5 dBm WCDMA B8

-110.5 dBm

LTE Standard Module Series

-102.0 dBm

-106.7 dBm

-104.7 dBm

-103.7 dBm LTE-FDD B1 (10 MHz)

-98.0 dBm

-98.0 dBm

-101.5 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-96.5 dBm

-98.5 dBm

-101.5 dBm

-93.3 dBm LTE-FDD B5 (10 MHz)

-98.0 dBm

-98.5 dBm

-101.0 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97.0 dBm

-97.0 dBm

-99.5 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-97.0 dBm

-97.0 dBm

-101.0 dBm

-93.3 dBm LTE-FDD B20 (10 MHz)

-97.5 dBm

-99.0 dBm

-102.5 dBm

-93.3 dBm Table 29: EC21-A Conducted RF Receiving Sensitivity Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO 8 WCDMA B2

-110.0 dBm WCDMA B4

-110.0 dBm WCDMA B5

-110.5 dBm

3GPP (SIMO)

-104.7 dBm

-106.7 dBm

-104.7 dBm LTE-FDD B2 (10 MHz)

-98.0 dBm

-98.0 dBm

-101.0 dBm

-94.3 dBm LTE-FDD B4 (10 MHz)

-97.5 dBm

-99.0 dBm

-101.0 dBm

-96.3 dBm LTE-FDD B12 (10 MHz)

-97.2 dBm

-98.0 dBm

-101.0 dBm

-93.3 dBm Table 30: EC21-V Conducted RF Receiving Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO 8 Receiving Sensitivity (Typ.) LTE-FDD B4 (10 MHz)

-97.5 dBm

-99.0 dBm

-101.0 dBm

-96.3 dBm EC21_Series_Hardware_Design 72 / 118 LTE Standard Module Series LTE-FDD B13 (10 MHz)

-97.7 dBm

-97.0 dBm

-100.0 dBm

-93.3 dBm Table 31: EC21-AU Conducted RF Receiving Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO 8 Receiving Sensitivity (Typ.)

-102.0 dBm

-102.0 dBm

-102.0 dBm

-102.0 dBm

-106.7 dBm

-104.7 dBm

-104.7 dBm

-103.7 dBm GSM850

-109.0 dBm EGSM900

-109.0 dBm DCS1800 PCS1900

-109.0 dBm

-109.0 dBm WCDMA B1

-110.0 dBm WCDMA B2

-110.0 dBm WCDMA B5

-111.0 dBm WCDMA B8

-111.0 dBm

LTE-FDD B1 (10 MHz)

-97.2 dBm

-97.5 dBm

-100.2 dBm

-96.3 dBm LTE-FDD B2 (10 MHz)

-98.2 dBm

-94.3 dBm LTE-FDD B3 (10 MHz)

-98.7 dBm

-98.6 dBm

-102.2 dBm

-93.3 dBm LTE-FDD B4 (10 MHz)

-97.7 dBm

-97.4 dBm

-100.2 dBm

-96.3 dBm LTE-FDD B5 (10 MHz)

-98.0 dBm

-98.2 dBm

-101.0 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97.7 dBm

-97.7 dBm

-101.2 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-99.2 dBm

-98.2 dBm

-102.2 dBm

-93.3 dBm LTE-FDD B28 (10 MHz)

-98.6 dBm

-98.7 dBm

-102.0 dBm

-94.8 dBm LTE-TDD B40 (10 MHz)

-97.2 dBm

-98.4 dBm

-101.2 dBm

-96.3 dBm EC21_Series_Hardware_Design 73 / 118 LTE Standard Module Series Table 32: EC21-EU Conducted RF Receiving Sensitivity Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO 8 EGSM900 DCS1800

-109.0 dBm

-109.0 dBm WCDMA B1

-110.5 dBm WCDMA B8

-110.5 dBm

3GPP (SIMO)

-102.0 dBm

-102.0 dBm

-106.7 dBm

-103.7 dBm LTE-FDD B1 (10 MHz)

-98.2 dBm

-99 dBm

-101.7 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-98.7 dBm

-99.5 dBm

-101.2 dBm

-93.3 dBm LTE-FDD B7 (10 MHz)

-96.8 dBm

-98.5 dBm

-100.7 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-98.7 dBm

-100 dBm

-101.7 dBm

-93.3 dBm LTE-FDD B20 (10 MHz)

-98.2 dBm

-99.5 dBm

-101.8 dBm

-93.3 dBm LTE-FDD B28A (10 MHz)

-98.8 dBm

-100 dBm

-101.5 dBm

-94.8 dBm Table 33: EC21-AUT Conducted RF Receiving Sensitivity Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO 8 WCDMA B1

-110.0 dBm WCDMA B5

-110.5 dBm

3GPP (SIMO)

-106.7 dBm

-104.7 dBm LTE-FDD B1 (10 MHz)

-98.5 dBm

-98.0 dBm

-101.0 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-98.0 dBm

-97.0 dBm

-100.0 dBm

-93.3 dBm LTE-FDD B5 (10 MHz)

-98.0 dBm

-99.0 dBm

-102.5 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97.0 dBm

-97.0 dBm

-98.5 dBm

-94.3 dBm LTE-FDD B28 (10 MHz)

-97.0 dBm

-99.0 dBm

-102.0 dBm

-94.8 dBm EC21_Series_Hardware_Design 74 / 118 LTE Standard Module Series Table 34: EC21-J Conducted RF Receiving Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO 8 Receiving Sensitivity (Typ.) LTE-FDD B1 (10 MHz)

-97.5 dBm

-98.7 dBm

-100.2 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-96.5 dBm

-97.1 dBm

-100.5 dBm

-93.3 dBm LTE-FDD B8 (10 MHz)

-98.4 dBm

-99.0 dBm

-101.2 dBm

-93.3 dBm LTE-FDD B18 (10 MHz)

-99.5 dBm

-99.0 dBm

-101.7 dBm

-96.3 dBm LTE-FDD B19 (10 MHz)

-99.2 dBm

-99.0 dBm

-101.4 dBm

-96.3 dBm LTE-FDD B26 (10 MHz)

-99.5 dBm

-99.0 dBm

-101.5 dBm

-93.8 dBm Table 35: EC21-KL Conducted RF Receiving Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO 8 Receiving Sensitivity (Typ.) LTE-FDD B1 (10 MHz)

-98.0 dBm

-99.5 dBm

-100.5 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-97.0 dBm

-97.5 dBm

-99.5 dBm

-93.3 dBm LTE-FDD B5 (10 MHz)

-98.0 dBm

-99.5 dBm

-100.5 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-96.0 dBm

-96.0 dBm

-98.5 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-97.0 dBm

-99.0 dBm

-101.0 dBm

-93.3 dBm Table 36: EC21-AUX Conducted RF Receiving Sensitivity Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO 8 GSM850 EGSM900 DCS1800

-109.0 dBm

-109.0 dBm

-109.0 dBm

3GPP (SIMO)

-102.0 dBm

-102.0 dBm

-102.0 dBm EC21_Series_Hardware_Design 75 / 118 LTE Standard Module Series

PCS1900

-109.0 dBm

-102.0 dBm WCDMA B1

-110.0 dBm

-109.5 dBm

-112 dBm

-106.7 dBm WCDMA B2

-110.5 dBm

-104.7 dBm

WCDMA B4

-110.0 dBm

-110 dBm

-112 dBm

-104.7 dBm WCDMA B5

-111.0 dBm

-112 dBm

-113 dBm

-104.7 dBm WCDMA B8

-111.0 dBm

-112 dBm

-113 dBm

-103.7 dBm LTE-FDD B1 (10 MHz)

-98.0 dBm

-97.7 dBm

-101.2 dBm

-96.3 dBm LTE-FDD B2 (10 MHz)

-98.5 dBm

-94.3 dBm LTE-FDD B3 (10 MHz)

-99.0 dBm

-98.8 dBm

-102.2 dBm

-93.3 dBm LTE-FDD B4 (10 MHz)

-97.7 dBm

-97.6 dBm

-100.2 dBm

-96.3 dBm LTE-FDD B5 (10 MHz)

-98.5 dBm

-98.2 dBm

-101.0 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97.7 dBm

-97.7 dBm

-101.2 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-99.0 dBm

-98.5 dBm

-102.2 dBm

-93.3 dBm LTE-FDD B28 (10 MHz)

-98.0 dBm

-98.7 dBm

-101.5 dBm

-94.8 dBm LTE-TDD B40 (10 MHz)

-97.5 dBm

-98.2 dBm

-101.2 dBm

-96.3 dBm Table 37: EC21-EUX Conducted RF Receiving Sensitivity Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO 8 EGSM900 DCS1800

-109.0 dBm

-109.0 dBm WCDMA B1

-110.5 dBm WCDMA B8

-110.5 dBm

3GPP (SIMO)

-102.0 dBm

-102.0 dBm

-106.7 dBm

-103.7 dBm LTE-FDD B1 (10 MHz)

-98.0 dBm

-98.0 dBm

-101.0 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-98.5 dBm

-98.5 dBm

-101.0 dBm

-93.3 dBm EC21_Series_Hardware_Design 76 / 118 LTE Standard Module Series LTE-FDD B7 (10 MHz)

-97.0 dBm

-96.0 dBm

-99.5 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-98.5 dBm

-97.0 dBm

-101.0 dBm

-93.3 dBm LTE-FDD B20 (10 MHz)

-97.5 dBm

-99.0 dBm

-100.5 dBm

-93.3 dBm LTE-FDD B28 (10 MHz)

-98.0 dBm

-98.7 dBm

-101.0 dBm

-94.8 dBm 4.1.5. Reference Design A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A -type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 33: Reference Circuit of RF Antenna Interface NOTE receiving sensitivity. 1. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the 2. ANT_DIV function is enabled by default. AT+QCFG="divctl",0 can be used to disable receive 3. Place the -type matching components (R1 & C1 & C2, R2 & C3 & C4) as close to the antenna as diversity. See document [3] for details. possible. EC21_Series_Hardware_Design 77 / 118 LTE Standard Module Series 4.2. GNSS 4.2.1. Antenna Interface and Frequency Bands EC21 series includes a fully integrated global navigation satellite system solution that supports GPS, GLONASS, BeiDou (COMPASS), Galileo and QZSS. EC21 series supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, EC21 series GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, see document [5]. The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 38: Pin Definition of GNSS Antenna Interface Pin Name Pin No. I/O Description Comment ANT_GNSS 47 AI GNSS antenna 50 impedance. If unused, keep it open. Table 39: GNSS Frequency Type GPS Frequency 1575.42 1.023 GLONASS 1597.51605.8 Galileo 1575.42 2.046 BeiDou (COMPASS) 1561.098 2.046 QZSS 1575.42 Unit MHz MHz MHz MHz MHz EC21_Series_Hardware_Design 78 / 118 4.2.2. GNSS Performance The following table shows the GNSS performance of EC21 series. Table 40: GNSS Performance Parameter Description Conditions Sensitivity

(GNSS) Cold start Autonomous Reacquisition Autonomous Tracking Autonomous TTFF

(GNSS) Warm start

@ open sky Cold start

@ open sky Hot start

@ open sky CEP-50 Accuracy

(GNSS) NOTE Autonomous XTRA enabled Autonomous XTRA enabled Autonomous XTRA enabled Autonomous

@ open sky LTE Standard Module Series Typ.

-146

-157

-157 35 18 26 2.2 2.5 1.8 Unit dBm dBm dBm s s s s s s

< 2.5 m 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock positioning for at least 3 minutes continuously). within 3 minutes after loss of lock. 3. Cold start sensitivity:

the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command. EC21_Series_Hardware_Design 79 / 118 LTE Standard Module Series 4.2.3. Reference Design A reference design of GNSS antenna is shown as below. Figure 34: Reference Circuit of GNSS Antenna NOTE 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. If the module is designed with a passive antenna, then the VDD circuit is not needed. 4.2.4. Layout Guidelines The following layout guidelines should be taken into account in customers designs. Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna. Digital circuits such as (U)SIM card, USB interface, camera module and display connector should be Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar kept away from the antennas. isolation and protection. Keep 50 characteristic impedance for the ANT_GNSS trace. 4.3. RF Routing Guidelines the characteristic impedance of all RF traces should be controlled to 50 . The For users PCB, impedance of the RF traces is usually determined by the trace width (W), the materials dielectric layer (H), and the spacing between RF constant, the height from the reference ground to the signal EC21_Series_Hardware_Design 80 / 118 traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. LTE Standard Module Series

. Figure 35: Microstrip Design on a 2-layer PCB Figure 36: Coplanar Waveguide Design on a 2-layer PCB Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EC21_Series_Hardware_Design 81 / 118 LTE Standard Module Series Figure 38: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be 50 . fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [7]. EC21_Series_Hardware_Design 82 / 118 LTE Standard Module Series 4.4. Antenna Design Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 41: Antenna Requirements Type Requirements Frequency range: 15591609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0 dBi Active antenna noise figure: < 1.5 dB Active antenna gain: > 0 dBi Active antenna embedded LNA gain: < 17 dB VSWR: 2 Efficiency: > 30 %

Max input power: 50 W Input impedance: 50 Cable insertion loss:

< 1 dB: LB (<1 GHz)

< 1.5 dB: MB (12.3 GHz)

< 2 dB: HB (> 2.3 GHz) GNSS 9 NOTE GSM/WCDMA/LTE When the module supports LTE B13 or B14, it is recommended to use passive GNSS antennas, since active antennas may cause harmonics that affect GNSS performance. 4.5. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. 9 It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. EC21_Series_Hardware_Design 83 / 118 LTE Standard Module Series Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. EC21_Series_Hardware_Design 84 / 118 LTE Standard Module Series Figure 41: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. EC21_Series_Hardware_Design 85 / 118 LTE Standard Module Series 5 Electrical Characteristic and Reliability 5.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 42: Absolute Maximum Ratings Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Voltage at ADC0 Voltage at ADC1 Min.

-0.3

-0.3 0 0 0 0 Voltage at Digital Pins

-0.3 Max. Unit 4.7 5.5 0.8 1.8 2.3 VBAT_BB VBAT_BB V V A A V V V EC21_Series_Hardware_Design 86 / 118 LTE Standard Module Series 5.2. Power Supply Ratings Table 43: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit The actual input voltages must be kept between the minimum and maximum values. VBAT_BB and VBAT_RF 3.3 3.8 4.3 V VBAT IVBAT Voltage drop during burst transmission Maximum power control level on EGSM900 Peak supply current

(during transmission slot) Maximum power control level on EGSM900

400 mV 1.8 2.0 A V USB_VBUS USB connection detection

3.0 5.0 5.25 5.3. Operating and Storage Temperatures The operating and storage temperatures are listed in the following table. Table 44: Operating and Storage Temperatures Parameter Min. Max. Unit Operating Temperature Range 10

-35 Extended Temperature Range 11

-40 Storage Temperature Range

-40 Typ.

+25

+75

+85

+90 C C C 10 Within operation temperature range, the module is 3GPP compliant. 11 Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call*, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operation temperature levels, the module will meet 3GPP specifications again. EC21_Series_Hardware_Design 87 / 118 LTE Standard Module Series 5.4. Power Consumption The values of current consumption are shown below. Table 45: EC21-E Current Consumption Description Conditions Typ. Unit OFF state Power down Idle state

(GNSS OFF) Sleep state WCDMA PF = 64 (USB disconnected) AT+CFUN=0 (USB disconnected) EGSM900 @ DRX = 9 (USB disconnected) DCS1800 @ DRX = 9 (USB disconnected) WCDMA PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) EGSM900 @ DRX = 5 (USB connected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) EGSM900 4DL/1UL @ 32.3 dBm EGSM900 3DL/2UL @ 32.18 dBm 13 1.4 1.8 1.8 2.4 1.9 3.2 2.1 22.0 32.0 22.5 32.7 22.5 32.5 220 387 467 555 185 305 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA GPRS data transfer

(GNSS OFF) EGSM900 2DL/3UL @ 30.3 dBm EGSM900 1DL/4UL @ 29.4 dBm DCS1800 4DL/1UL @ 29.6 dBm DCS1800 3DL/2UL @ 29.1 dBm EC21_Series_Hardware_Design 88 / 118 EDGE data transfer

(GNSS OFF) DCS1800 2DL/3UL @ 28.8 dBm DCS1800 1DL/4UL @ 29.1 dBm EGSM900 4DL/1UL @ 26 dBm EGSM900 3DL/2UL @ 26 dBm EGSM900 2DL/3UL @ 25 dBm EGSM900 1DL/4UL @ 25 dBm DCS1800 4DL/1UL @ 26 dBm DCS1800 3DL/2UL @ 25 dBm DCS1800 2DL/3UL @ 25 dBm DCS1800 1DL/4UL @ 25 dBm WCDMA B1 HSDPA @ 22.5 dBm WCDMA B1 HSUPA @ 21.11 dBm WCDMA B8 HSDPA @ 22.41 dBm WCDMA B8 HSUPA @ 21.2 dBm LTE-FDD B1 @ 23.45 dBm LTE-FDD B3 @ 23.4 dBm LTE-FDD B5 @ 23.4 dBm LTE-FDD B7 @ 23.86 dBm LTE-FDD B8 @ 23.5 dBm LTE-FDD B20 @ 23.57 dBm EGSM900 PCL = 5 @ 33.08 dBm DCS1800 PCL = 0 @ 29.75 dBm WCDMA data transfer

(GNSS OFF) WCDMA B5 HSDPA @ 23.5 dBm WCDMA B5 HSUPA @ 21.4 dBm LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call WCDMA B1 @ 23.69 dBm LTE Standard Module Series 431 540 148 245 338 432 150 243 337 430 659 545 767 537 543 445 807 825 786 887 675 770 264.0 190.0 683 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Series_Hardware_Design 89 / 118 LTE Standard Module Series WCDMA B5 @ 23.61 dBm WCDMA B8 @ 23.35 dBm Table 46: EC21-A Current Consumption OFF state Power down Description Conditions Unit Sleep state WCDMA PF = 128 (USB disconnected) AT+CFUN=0 (USB disconnected) WCDMA PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) WCDMA B2 HSDPA @ 21.54 dBm WCDMA B2 HSUPA @ 22.19 dBm WCDMA B4 HSDPA @ 22.15 dBm WCDMA B4 HSUPA @ 21.82 dBm WCDMA B5 HSDPA @ 22.22 dBm WCDMA B5 HSUPA @ 21.45 dBm LTE-FDD B2 @ 23.11 dBm LTE-FDD B4 @ 23.16 dBm LTE-FDD B12 @ 23.25 dBm Idle state

(GNSS OFF) WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) WCDMA voice call WCDMA B2 @ 22.97 dBm EC21_Series_Hardware_Design 90 / 118 741 564 Typ. 10 1.25 2.03 1.65 2.31 1.85 23.1 32.8 22.8 32.8 479.0 530.0 539.0 531.0 454.0 433.0 721.0 748.0 668.0 565.0 mA mA A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE Standard Module Series WCDMA B4 @ 22.91 dBm WCDMA B5 @ 23.06 dBm 590.0 493.0 mA mA Table 47: EC21-V Current Consumption Description Conditions OFF state Power down AT+CFUN = 0 (USB disconnected) Sleep state LTE-FDD PF = 64 (USB disconnected) Idle state

(GNSS OFF) LTE data transfer

(GNSS OFF) LTE-FDD PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) LTE-FDD B4 @ 22.77 dBm LTE-FDD B13 @ 23.05 dBm Table 48: EC21-AU Current Consumption Description Conditions OFF state Power down Sleep state AT+CFUN = 0 (USB disconnected) EGSM DRX = 2 (USB disconnected) EGSM DRX = 5 (USB disconnected) EGSM DRX = 5 (USB suspend) DCS DRX = 2 (USB disconnected) DCS DRX = 5 (USB disconnected) DCS DRX = 5 (USB suspend) WCDMA PF = 64 (USB disconnected) Typ. 10 1.07 2.85 2.26 22.0 32.0 762.0 533.0 Typ. 11 0.97 1.93 1.41 1.64 1.82 1.31 1.55 1.85 Unit A mA mA mA mA mA mA mA Unit A mA mA mA mA mA mA mA mA EC21_Series_Hardware_Design 91 / 118 LTE Standard Module Series WCDMA PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) LTE-TDD PF = 64 (USB disconnected) LTE-TDD PF = 128 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) EGSM900 @ DRX = 5 (USB connected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) LTE-TDD PF = 64 (USB connected) LTE-TDD PF = 64 (USB connected) GSM850 4DL/1UL @ 32.45 dBm GSM850 3DL/2UL @ 32.3 dBm GSM850 2DL/3UL @ 30.1 dBm GSM850 1DL/4UL @ 28.8 dBm EGSM900 4DL/1UL @ 32.67 dBm EGSM900 3DL/2UL @ 32.56 dBm EGSM900 2DL/3UL @ 30.56 dBm EGSM900 1DL/4UL @ 29.23 dBm DCS1800 4DL/1UL @ 29.47 dBm DCS1800 3DL/2UL @ 29.34 dBm DCS1800 2DL/3UL @ 29.2 dBm DCS1800 1DL/4UL @ 27.05 dBm 1.34 2.01 1.41 2.31 1.68 19.8 29.6 19.5 29.4 20.3 30.4 20.0 30.4 220.8 385.4 446.5 513.4 227.7 404.8 472.9 545.8 169.1 289 396.1 502.7 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle state

(GNSS OFF) GPRS data transfer

(GNSS OFF) EC21_Series_Hardware_Design 92 / 118 PCS1900 4DL/1UL @ 29.73 dBm PCS1900 3DL/2UL @ 29.67 dBm PCS1900 2DL/3UL @ 29.53 dBm PCS1900 1DL/4UL @ 29.36 dBm EGSM900 4DL/1UL @ 26.99 dBm EGSM900 3DL/2UL @ 26.91 dBm EGSM900 2DL/3UL @ 26.77 dBm EGSM900 1DL/4UL @ 26.69 dBm DCS1800 4DL/1UL @ 25.76 dBm DCS1800 3DL/2UL @ 25.56 dBm DCS1800 2DL/3UL @ 25.44 dBm DCS1800 1DL/4UL @ 25.40 dBm GSM850 4DL/1UL @ 26.5 dBm GSM850 3DL/2UL @ 26.35 dBm GSM850 2DL/3UL @ 26.33 dBm GSM850 1DL/4UL @ 26.1 dBm PCS1900 4DL/1UL @ 25.93 dBm PCS1900 3DL/2UL @ 25.68 dBm PCS1900 2DL/3UL @ 25.6 dBm PCS1900 1DL/4UL @ 25.47 dBm WCDMA B1 HSDPA @ 22.13 dBm WCDMA B1 HSUPA @ 21.69 dBm WCDMA B2 HSDPA @ 22.1 dBm WCDMA 2 HSUPA @ 21.75 dBm WCDMA B5 HSDPA @ 22.9 dBm LTE Standard Module Series 164 280.1 388 490.9 146.5 245.0 341.2 439.3 140.8 231.6 322.6 411.1 140.6 230.0 323.0 410.8 135.9 227.7 313.7 401.0 564.4 559.3 568.6 554.7 537.5 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EDGE data transfer

(GNSS OFF) WCDMA data transfer

(GNSS OFF) EC21_Series_Hardware_Design 93 / 118 WCDMA B5 HSUPA @ 21.2 dBm WCDMA B8 HSDPA @ 22.14 dBm WCDMA B8 HSUPA @ 21.78 dBm LTE-FDD B1 @ 22.85 dBm LTE-FDD B2 @ 22.5 dBm LTE-FDD B3 @ 23.00 dBm LTE-FDD B4 @ 22.7 dBm LTE-FDD B5 @ 23.16 dBm LTE-FDD B7 @ 22.91 dBm LTE-FDD B8 @ 23.09 dBm LTE-FDD B28 @ 23.24 dBm LTE-TDD B40 @ 22.66 dBm GSM900 PCL = 5 @ 32.85 dBm GSM850 PCL = 5 @ 32.57 dBm PCS1900 PCL = 0 @ 29.7 dBm DCS1800 PCL = 0 @ 29.68 dBm WCDMA B1 @ 22.90 dBm WCDMA B2 @ 23.03 dBm WCDMA B5 @ 23.03 dBm WCDMA B8 @ 23.04 dBm LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call Table 49: EC21-EU Current Consumption Description Conditions OFF state Power down Sleep state AT+CFUN = 0 (USB disconnected) GSM DRX = 2 (USB disconnected) EC21_Series_Hardware_Design LTE Standard Module Series 496.2 553.2 559.7 742.2 770.6 770.1 684.3 649.5 731.9 633.6 769.8 390.8 244.0 231.7 170.9 180.1 598.1 630.4 563.4 605.0 Typ. 12.8 1.8 3.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Unit A mA mA 94 / 118 LTE Standard Module Series GSM DRX = 9 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) EGSM900 @ DRX = 5 (USB connected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) EGSM900 4DL/1UL @ 33.80 dBm EGSM900 3DL/2UL @ 32.57 dBm EGSM900 2DL/3UL @ 30.26 dBm EGSM900 1DL/4UL @ 28.94 dBm DCS1800 4DL/1UL @ 31.13 dBm DCS1800 3DL/2UL @ 30.28 dBm DCS1800 2DL/3UL @ 28.21 dBm DCS1800 1DL/4UL @ 27.05 dBm EGSM900 4DL/1UL @ 27.08 dBm EGSM900 3DL/2UL @ 25.91 dBm EGSM900 2DL/3UL @ 23.83 dBm EGSM900 1DL/4UL @ 22.73 dBm DCS1800 4DL/1UL @ 26.65 dBm DCS1800 3DL/2UL @ 25.61 dBm 2.2 3.1 2.6 3.3 2.6 17.6 27.7 17.9 27.9 17.9 28.0 264.3 419.8 481.5 553.2 178.3 293.6 354.3 424.7 147.1 240.0 296.2 357.1 138.7 227.4 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle state

(GNSS OFF) GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) EC21_Series_Hardware_Design 95 / 118 DCS1800 2DL/3UL @ 23.46 dBm DCS1800 1DL/4UL @ 22.19 dBm WCDMA B1 HSDPA @ 23.26 dBm WCDMA B1 HSUPA @ 23.09 dBm WCDMA B8 HSDPA @ 23.27 dBm WCDMA B8 HSUPA @ 22.67 dBm LTE-FDD B1 @ 24.50 dBm LTE-FDD B3 @ 23.67 dBm LTE-FDD B7 @ 23.75 dBm LTE-FDD B8 @ 22.81 dBm LTE-FDD B20 @ 24.08 dBm LTE-FDD B28A @ 23.34 dBm GSM900 PCL = 5 @ 33.85 dBm DCS1800 PCL = 0 @ 31.20 dBm WCDMA B1 @ 24.06 dBm WCDMA B8 @ 24.17 dBm WCDMA data transfer

(GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call Table 50: EC21-AUT Current Consumption Description Conditions OFF state Power down AT+CFUN = 0 (USB disconnected) WCDMA PF = 64 (USB disconnected) Sleep state WCDMA PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) LTE Standard Module Series 302.8 381.7 605.0 615.3 544.0 536.1 798.7 751.8 878.7 592.6 777.8 748.1 279.9 189.5 681.0 593.0 Typ. 10 0.99 2.1 1.7 2.9 2.4 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Unit A mA mA mA mA mA EC21_Series_Hardware_Design 96 / 118 Idle state

(GNSS OFF) WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) WCDMA B1 HSDPA @ 22.59 dBm WCDMA B1 HSUPA @ 22.29 dBm WCDMA B5 HSDPA @ 22.22 dBm WCDMA B5 HSUPA @ 21.64 dBm LTE-FDD B1 @ 23.38 dBm LTE-FDD B3 @ 22.87 dBm LTE-FDD B5 @ 23.12 dBm LTE-FDD B7 @ 22.96 dBm LTE-FDD B28 @ 23.31 dBm WCDMA voice call WCDMA B1 @ 24.21 dBm WCDMA B5 @ 23.18 dBm Table 51: EC21-J Current Consumption Description Conditions OFF state Power down LTE Standard Module Series 22.0 32.0 23.6 33.6 589.0 623.0 511.0 503.0 813.0 840.0 613.0 761.0 650.0 687.0 535.0 Typ. 10 0.85 2.20 1.46 23.5 33.8 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Unit A mA mA mA mA mA mA AT+CFUN = 0 (USB disconnected) Sleep state LTE-FDD PF = 64 (USB disconnected) Idle state

(GNSS OFF) LTE data transfer (GNSS OFF) LTE-FDD PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) LTE-FDD B1 @ 23.35 dBm 734.0 EC21_Series_Hardware_Design 97 / 118 LTE Standard Module Series LTE-FDD B3 @ 22.95 dBm LTE-FDD B8 @ 22.81 dBm LTE-FDD B18 @ 23.15 dBm LTE-FDD B19 @ 23.17 dBm LTE-FDD B26 @ 23.37 dBm Table 52: EC21-KL Current Consumption Description Conditions OFF state Power down AT+CFUN = 0 (USB disconnected) Sleep state LTE-FDD PF = 64 (USB disconnected) Idle state

(GNSS OFF) LTE-FDD PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) LTE data transfer (GNSS OFF) LTE-FDD B1 @ 23.0 dBm LTE-FDD B3 @ 23.36 dBm LTE-FDD B5 @ 23.56 dBm LTE-FDD B7 @ 23.32 dBm LTE-FDD B8 @ 23.33 dBm Table 53: EC21-AUX Current Consumption Description Conditions OFF state Power down Sleep state AT+CFUN=0 (USB disconnected) GSM DRX = 2 (USB disconnected) 778.0 722.0 677.0 688.0 723.0 Typ. 10 1.08 2.1 1.4 24.8 33.5 771.0 780.0 628.0 754.0 680.0 Typ. 7 1.00 1.91 Unit mA mA mA mA mA A mA mA mA mA mA mA mA mA mA mA Unit A mA mA EC21_Series_Hardware_Design 98 / 118 GSM DRX = 9 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) LTE-TDD PF = 64 (USB disconnected) LTE-TDD PF = 128 (USB disconnected) GSM DRX = 5 (USB disconnected) GSM DRX = 5 (USB connected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) LTE-TDD PF = 64 (USB disconnected) LTE-TDD PF = 64 (USB connected) GSM850 4DL/1UL @ 32.41 dBm GSM850 3DL/2UL @ 31.48 dBm GSM850 2DL/3UL @ 29.31 dBm GSM850 1DL/4UL @ 28.21 dBm EGSM900 4DL/1UL @ 33.06 dBm EGSM900 3DL/2UL @ 31.74 dBm EGSM900 2DL/3UL @ 29.32 dBm EGSM900 1DL/4UL @ 28.30 dBm DCS1800 4DL/1UL @ 29.20 dBm DCS1800 3DL/2UL @ 28.16 dBm Idle state

(GNSS OFF) GPRS data transfer

(GNSS OFF) LTE Standard Module Series 1.31 2.19 1.91 2.74 2.12 2.68 2.16 16.6 33.7 16.7 33.7 16.9 34.0 17.0 34.0 236.2 380.2 446.2 527.7 259.0 398.0 448.0 532.0 149.0 225.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Series_Hardware_Design 99 / 118 DCS1800 2DL/3UL @ 26.05 dBm DCS1800 1DL/4UL @ 25.14 dBm PCS1900 4DL/1UL @ 29.39 dBm PCS1900 3DL/2UL @ 28.06 dBm PCS1900 2DL/3UL @ 26.01 dBm PCS1900 1DL/4UL @ 25.20 dBm GSM850 4DL/1UL PCL = 8 @ 26.86 dBm GSM850 3DL/2UL PCL = 8 @ 25.76 dBm GSM850 2DL/3UL PCL = 8 @ 23.68 dBm GSM850 1DL/4UL PCL = 8 @ 22.39 dBm EGSM900 4DL/1UL PCL = 8 @ 27.01 dBm EGSM900 3DL/2UL PCL = 8 @ 25.82 dBm EGSM900 2DL/3UL PCL = 8 @ 23.64 dBm EGSM900 1DL/4UL PCL = 8 @ 22.46 dBm DCS1800 4DL/1UL PCL = 2 @ 25.90 dBm DCS1800 3DL/2UL PCL = 2 @ 24.98 dBm DCS1800 2DL/3UL PCL = 2 @ 22.92 dBm DCS1800 1DL/4UL PCL = 2 @ 21.82 dBm PCS1900 4DL/1UL PCL = 2 @ 25.36 dBm PCS1900 3DL/2UL PCL = 2 @ 25.07 dBm PCS1900 2DL/3UL PCL = 2 @ 23.13 dBm PCS1900 1DL/4UL PCL = 2 @ 21.82 dBm EDGE data transfer

(GNSS OFF) LTE Standard Module Series 283.0 357.0 159.7 234.6 289.0 363.9 169.9 284.1 387.2 498.7 171.0 286.0 389.0 500.0 133.0 220.0 308.0 403.0 132.4 220.9 307.2 402.8 530.0 542.0 556.3 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA data transfer

(GNSS OFF) WCDMA B1 HSDPA @ 22.78 dBm WCDMA B1 HSUPA @ 22.12 dBm WCDMA B2 HSDPA @ 22.54 dBm EC21_Series_Hardware_Design 100 / 118 WCDMA B2 HSUPA @ 22.17 dBm WCDMA B4 HSDPA @ 23.27 dBm WCDMA B4 HSUPA @ 23.19 dBm WCDMA B5 HSDPA @ 23.18 dBm WCDMA B5 HSUPA @ 22.90 dBm WCDMA B8 HSDPA @ 22.32 dBm WCDMA B8 HSUPA @ 22.26 dBm LTE-FDD B1 @ 23.48 dBm LTE-FDD B2 @ 22.85 dBm LTE-FDD B3 @ 23.45 dBm LTE-FDD B4 @ 23.16 dBm LTE-FDD B5 @ 23.61 dBm LTE-FDD B7 @ 23.40 dBm LTE-FDD B8 @ 23.57 dBm LTE-FDD B28A @ 23.49 dBm LTE-FDD B28B @ 23.65 dBm LTE-TDD B40 @ 23.66 dBm GSM850 PCL = 5 @ 32.45 dBm EGSM900 PCL = 5 @ 32.81 dBm DCS1800 PCL = 0 @ 29.28 dBm PCS1900 PCL = 0 @ 29.47 dBm WCDMA B1 @ 23.44 dBm WCDMA B2 @ 23.15 dBm WCDMA B4 @ 23.20 dBm WCDMA B5 @ 23.23 dBm LTE data transfer

(GNSS OFF) GSM voice call WCDMA voice call LTE Standard Module Series 542.4 491.0 504.0 480.4 490.0 504.0 528.0 690.0 696.7 655.0 603.0 558.0 704.0 663.0 763.0 780.0 340.3 234.9 249.0 143.0 154.5 568.0 614.0 497.0 492.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Series_Hardware_Design 101 / 118 LTE Standard Module Series WCDMA B8 @ 23.05 dBm 553.0 mA Table 54: EC21-EUX Current Consumption Description Conditions OFF state Power down AT+CFUN=0 (USB disconnected) AT+CFUN=0 (USB suspend) EGSM DRX = 2 (USB disconnected) EGSM DRX = 9 (USB disconnected) DCS 698 DRX = 2 (USB disconnected) DCS 698 DRX = 9 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB connected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB connected) GSM900 4DL/1UL @ 32.70 dBm GSM900 3DL/2UL @ 31.89 dBm Sleep state Idle state

(GNSS OFF) GPRS data transfer

(GNSS OFF) GSM900 2DL/3UL @ 29.38 dBm GSM900 1DL/4UL @ 28.71 dBm DCS1800 4DL/1UL @ 30.18 dBm DCS1800 3DL/2UL @ 29.51 dBm Typ. 7 1.03 1.27 1.89 1.30 1.89 1.32 1.70 1.44 2.18 1.64 14.08 23.69 14.02 23.81 218.7 368.9 421.8 505.8 146.2 246.0 Unit A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Series_Hardware_Design 102 / 118 DCS1800 2DL/3UL @ 27.56 dBm DCS1800 1DL/4UL @ 26.39 dBm GSM900 4DL/1UL @ 24.75 dBm GSM900 3DL/2UL @ 24.37 dBm GSM900 2DL/3UL @ 22.68 dBm GSM900 1DL/4UL @ 21.85 dBm DCS1800 4DL/1UL @ 26.02 dBm DCS1800 3DL/2UL @ 25.39 dBm DCS1800 2DL/3UL @ 22.81 dBm DCS1800 1DL/4UL @ 22.21 dBm WCDMA B1 HSDPA @ 22.83 dBm WCDMA B1 HSUPA @ 22.80 dBm WCDMA B8 HSDPA @ 22.29 dBm WCDMA B8 HSUPA @ 21.32 dBm LTE-FDD B1 @ 23.89 dBm LTE-FDD B3 @ 23.75 dBm EDGE data transfer

(GNSS OFF) WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) LTE-FDD B7 @ 23.81 dBm LTE-FDD B8 @ 23.68 dBm LTE-FDD B20 @ 23.63 dBm LTE-FDD B28A @ 23.80 dBm GSM voice call GSM900 PCL = 5 @ 32.74 dBm DCS1800 PCL = 0 @ 29.82 dBm WCDMA voice call WCDMA B1 @ 23.02 dBm WCDMA B8 @ 22.41 dBm LTE Standard Module Series 307.0 375.5 150.9 269.4 380.0 489.7 128.0 221.2 311.3 404.9 495.7 488.1 501.8 475.7 629.1 680.0 734.1 651.2 680.6 796.0 236.0 155.2 505.4 521.3 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Series_Hardware_Design 103 / 118 Table 55: GNSS Current Consumption of EC21 Series Module Description Conditions Typ. Unit LTE Standard Module Series Cold start @ Passive Antenna Lost state @ Passive Antenna Instrument Environment Open Sky @ Passive Antenna Open Sky @ Active Antenna 58 58 33 35 43 mA mA mA mA mA Searching

(AT+CFUN=0) Tracking

(AT+CFUN=0) 5.5. ESD The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and the processing, handling and operation of any packaging procedures must be applied throughout application that incorporates the module. The following table shows the modules electrostatics discharge characteristics. Table 56: Electrostatics Discharge Characteristics (Temperature: 25 C, Humidity: 45 %) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND All Antenna Interfaces Other Interfaces 5 4 0.5 10 8 1 kV kV kV 5.6. Thermal Dissipation In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:

On customers PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc. EC21_Series_Hardware_Design 104 / 118 LTE Standard Module Series Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary. Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Make sure the ground pads of the module and PCB are fully connected. According to customers application demands, the heatsink can be mounted on the top of the module, or the opposite side of the PCB area where the module is mounted, or both of them. The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB. The following shows two kinds of heatsink designs for reference and customers can choose one or both of them according to their application structure. EC21 Series Module Heatsink Heatsink Thermal Pad Shielding Cover Application Board Application Board Figure 42: Referenced Heatsink Design (Heatsink at the Top of the Module) Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers PCB) EC21_Series_Hardware_Design 105 / 118 LTE Standard Module Series NOTE 1. The module offers the best performance when the internal baseband chip stays below 105 C. When the maximum temperature of the BB chip reaches or exceeds 105 C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115 C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115 C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105 C. Customers can execute AT+QTEMP and get the maximum BB chip temperature from the first returned value. For details of the command ,see document [3]. 2. For more detailed guidelines on thermal design, see document [8]. EC21_Series_Hardware_Design 106 / 118 LTE Standard Module Series 6 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the dimensional tolerances are 0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions 32.00.15 2.40.2 Pin 1Pin 1 5 1

. 0 0

. 9 2 Figure 44: Module Top and Side Dimensions 0.8 EC21_Series_Hardware_Design 107 / 118 1.90 1.30 3.85 32.0/-0.15 5.96 2.0 4

. 3 1.1 1.8 2.15 1.15 1.05 3.0 0.87 4.82 1.6 6.8 1.7 LTE Standard Module Series Pin 1 1.30 5

. 3 1.1 2.0 2.0 3.0 1.8

. 5 1 0

0

. 9 2 2.8 8 4

. 4.37 3.2 3.4 3.2 3.4 3.2 0.8 5

. 3 1.5 2.49 1.9 2.4 3.45 Figure 45: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. EC21_Series_Hardware_Design 108 / 118 6.2. Recommended Footprint LTE Standard Module Series Figure 46: Recommended Footprint (Top View) NOTE on the motherboard. 1. The keepout area (pin 7384) should not be designed. 2. For easy maintenance of the module, keep about 3 mm between the module and other components EC21_Series_Hardware_Design 109 / 118 6.3. Top and Bottom Views LTE Standard Module Series Figure 47: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EC21_Series_Hardware_Design 110 / 118 LTE Standard Module Series 7 Storage, Manufacturing and Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity should be 3560 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3. The floor life of the module is 168 hours 12 in a plant where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a dry environment such as in a drying oven. 12 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. EC21_Series_Hardware_Design 111 / 118 LTE Standard Module Series NOTE the air is forbidden. 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking the drying oven. procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 7.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.180.20 mm. For more details, see document [9]. The peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 48: Reflow Soldering Thermal Profile EC21_Series_Hardware_Design 112 / 118 Table 57: Recommended Thermal Profile Parameters LTE Standard Module Series Soak time (between A and B: 150 C and 200 C) 70120 s Factor Soak Zone Max slope Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE Recommendation 13 C/sec 23C/s 4070 s 235 C to 246 C

-1.5 to -3 C/s 1 1. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 2. Avoid using ultrasonic technology for module cleaning and soldering since it can damage crystals inside the module. 3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering) that is not mentioned in document [9]. 7.3. Packaging Specifications The module adopts carrier tape packaging and details are as follow:

7.3.1. Carrier Tape Dimension details are as follow:

EC21_Series_Hardware_Design 113 / 118 LTE Standard Module Series Figure 49: Carrier Tape Dimension Drawing Table 58: Carrier Tape Dimension Table (Unit: mm) W 44 P 44 T A0 B0 0.35 32.5 29.5 K0 3.0 K1 3.8 F E 20.2 1.75 7.3.2. Plastic Reel Figure 50: Plastic Reel Dimension Drawing EC21_Series_Hardware_Design 114 / 118 LTE Standard Module Series Table 59: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 44.5 7.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the vacuum-packed plastic reel into the pizza box. Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, vacuumize it. Put 4 packaged pizza boxes into 1 cartoon box and seal it. 1 cartoon box can pack 1000 modules. Figure 51: Packaging Process EC21_Series_Hardware_Design 115 / 118 LTE Standard Module Series 8 Appendix References Table 60: Related Documents Document Name

[1] Quectel_UMTS&LTE_EVB_User_Guide

[2] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_AT_Commands_Manual

[3] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_QCFG_AT_Commands_Manual

[4] Quectel_EC2x&EG9x_Power_Management_Application_Note

[5] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_GNSS_Application_Note

[6] Quectel_EC21_Reference_Design

[7] Quectel_RF_Layout_Application_Note

[8] Quectel_LTE_Module_Thermal_Design_Guide

[9] Quectel_Module_Secondary_SMT_Application_Guide Table 61: Terms and Abbreviations Abbreviation Description 3GPP ADC AMR APT bps CHAP CMUX 3rd Generation Partnership Project Analog-to-Digital Converter Adaptive Multi-rate Average Power Tracking Bits Per Second Challenge Handshake Authentication Protocol Connection Multiplexing EC21_Series_Hardware_Design 116 / 118 LTE Standard Module Series DC-HSPA+

Dual-carrier High Speed Packet Access CS CSD CTS DCE DCS DFOTA DL DTE DTR DTX EDGE EFR EGSM ESD ESR FDD FR FTPS Galileo GMSK GNSS GPRS GPS Coding Scheme Circuit Switched Data Clear To Send Data Communications Equipment Digital Communication System Delta Firmware Upgrade Over The Air Enhanced Data Rates for GSM Evolution Downlink Data Terminal Equipment Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSM Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplex Full Rate FTP over SSL Gaussian Minimum Shift Keying Global Navigation Satellite System General Packet Radio Service Global Positioning System Galileo Satellite Navigation System (EU) GLONASS Russian Global Navigation Satellite System EC21_Series_Hardware_Design 117 / 118 LTE Standard Module Series GSM HR HSPA HSDPA HSUPA HTTP HTTPS I/O Inom LCC LDO LED LGA LNA LSB LTE M2M MCS MDIO MIMO MLCC MMS MO MQTT MS Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Downlink Packet Access High Speed Uplink Packet Access Hypertext Transfer Protocol Hypertext Transfer Protocol Secure Input/Output Nominal Current Leadless Chip Carrier (package) Low-dropout Regulator Light Emitting Diode Land Grid Array Low Noise Amplifier Least Significant Bit Long Term Evolution Machine to Machine Modulation and Coding Scheme Management Data Input/Output Multiple Input Multiple Output Multi-layer Ceramic Chip Multimedia Messaging Service Mobile Originated Message Queuing Telemetry Transport Mobile Station (GSM engine) EC21_Series_Hardware_Design 118 / 118 LTE Standard Module Series Most Significant Bit Mobile Terminated Network Identity and Time Zone / Network Informed Time Zone NMEA (National Marine Electronics Association) 0183 Interface Standard MSB MT NITZ NMEA NTP PA PAM PAP PCB PCM PCS PDA PDU PING PMIC POS PPP PTP QAM QPSK QZSS RF RHCP RoHS Rx Network Time Protocol Power Amplifier Power Amplifier Module Password Authentication Protocol Printed Circuit Board Pulse Code Modulation Personal Communication System Personal Digital Assistant Protocol Data Unit Packet Internet Groper Power Management IC Point of Sale Point-to-Point Protocol Precision Time Protocol Quadrature Amplitude Modulation Quadrature Phase Shift Keying Quasi-Zenith Satellite System Radio Frequency Right Hand Circularly Polarized Restriction of Hazardous Substances Receive EC21_Series_Hardware_Design 119 / 118 LTE Standard Module Series SMTPS Simple Mail Transfer Protocol Secure TD-SCDMA Time Division-Synchronous Code Division Multiple Access SAW SDR SGMII SIM SIMO SMS SMTP SSL TCP TDD TDMA TX UART UDP UL UMTS URC USB

(U)SIM Vmax Vnom Vmin VIHmax Surface Acoustic Wave Software-Defined Radio Serial Gigabit Media Independent Interface Subscriber Identification Module Single Input Multiple Output Short Message Service Simple Mail Transfer Protocol Secure Sockets Layer Transmission Control Protocol Time Division Duplexing Time Division Multiple Access Transmitting Direction Universal Asynchronous Receiver/Transmitter Universal Mobile Telecommunications System User Datagram Protocol Uplink Unsolicited Result Code Universal Serial Bus Maximum Voltage Nominal Voltage Minimum Voltage

(Universal) Subscriber Identity Module Maximum High-level Input Voltage EC21_Series_Hardware_Design 120 / 118 LTE Standard Module Series VIHmin VILmax VILmin VImax VImin VOHmax VOHmin VOLmax VOLmin VLAN VSWR WCDMA WLAN Minimum High-level Input Voltage Maximum Low-level Input Voltage Minimum Low-level Input Voltage Absolute Maximum Input Voltage Absolute Minimum Input Voltage Maximum High-level Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Minimum Low-level Output Voltage Virtual Local Area Network Voltage Standing Wave Ratio Wideband Code Division Multiple Access Wireless Local Area Network EC21_Series_Hardware_Design 121 / 118

 

 

EC21 Series Mini PCIe Hardware Design LTE Standard Module Series Version: 1.5 Date: 2021-08-20 Status: Released LTE Standard Module Series Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@ quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to support@ quectel.com. Quectel offers the information as a service to its customers. The information provided is based upon customers requirements. Quectel makes every effort to ensure the quality of the information it makes available. Quectel does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information. All information supplied herein is subject to change without prior notice. General Notes Disclaimer it is possible that While Quectel has made efforts to ensure that the functions and features under development are free from errors, these functions and features could contain errors, inaccuracies and omissions. Unless otherwise provided by valid agreement, Quectel makes no warranties of any kind, features and functions under development. To the implied or express, with respect maximum extent permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with the use of the functions and features under development, regardless of whether such loss or damage may have been foreseeable. to the use of Duty of Confidentiality The Receiving Party shall keep confidential all documentation and information provided by Quectel, except when the specific permission has been granted by Quectel. The Receiving Party shall not access or use Quectels documentation and information for any purpose except as expressly provided herein. Furthermore, the Receiving Party shall not disclose any of the Quectel's documentation and information to any third party without the prior written consent by Quectel. For any noncompliance to the above requirements, unauthorized use, or other illegal or malicious use of the documentation and information, Quectel will reserve the right to take legal action. EC21_Series_Mini_PCIe_Hardware_Design 1 / 75 LTE Standard Module Series Copyright The information contained here is proprietary technical information of Quectel. Transmitting, reproducing, disseminating and editing this document as well as using the content without permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. Copyright Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved. EC21_Series_Mini_PCIe_Hardware_Design 2 / 75 LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation interference with of wireless appliances in an aircraft communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. is forbidden to prevent Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or EC21_Series_Mini_PCIe_Hardware_Design 3 / 75 metal powders. LTE Standard Module Series EC21_Series_Mini_PCIe_Hardware_Design 4 / 75 LTE Standard Module Series About the Document Revision History Version Date Author Description 1.0 2016-06-07 Yeoman CHEN/

Frank WANG Initial 1.1 2017-01-24 Lyndon LIU/

Rex WANG 1.2 2019-04-30 Woody WU/

Nathan LIU/

Frank WANG 1. Deleted description of EC21-AUTL and EC21-CT Mini PCIe in Table 1. 2. Updated key features of EC21 Mini PCIe in Table 2. 3. Added current consumption of EC21 Mini PCIe in 4. Updated mechanical dimensions of EC21 Mini PCIe 5. Updated conducted RF output power in Table 16. 6. Updated conducted RF receiving sensitivity of EC21-A in Table 18. 7. Added conducted RF receiving sensitivity of EC21-

Chapter 4.7. in Figure 15. KL in Table 21. in Table 22. 8. Added conducted RF receiving sensitivity of EC21-J 1. Added new variants EC21-EU Mini PCIe/EC21-EC Mini PCIe and related information. 2. Added pin definition and description of pin 44 in Figure 2 and Table 4. 3. Updated mechanical dimensions in Figure 18. 4. Added USIM_PRESENCE in (U)SIM interface and updated the reference circuit in Chapter 3.4. 5. Updated reference circuit of USB interface in 6. Modified description of W_DISABLE# signal in 7. Modified description of LED_WWAN# signal in Chapter 3.5. Chapter 3.8.3. Chapter 3.8.5. 8. Added thermal consideration in Chapter 6.7. 9. Updated UMTS and GSM features and added EC21_Series_Mini_PCIe_Hardware_Design 5 / 75 LTE Standard Module Series storage temperature range in Table 2. 10. Added operating frequencies in Table 15 11. Added GNSS frequency in Table 16. 12. Updated antenna requirements in Table 17. 13. Updated EC21 Mini PCIe conducted RF output power in Table 20. 14. Updated conducted RF receiving sensitivity of EC21-E Mini PCIe in Table 21. 15. Updated conducted RF receiving sensitivity of EC21-A Mini PCIe in Table 22. 16. Updated conducted RF receiving sensitivity of EC21-V Mini PCIe in Table 23 17. Updated conducted RF receiving sensitivity of EC21-AUT Mini PCIe in Table 24. 18. Added conducted RF receiving sensitivity of EC21-

19. Added conducted RF receiving sensitivity of EC21-

20. Added conducted RF receiving sensitivity of EC21-

AU Mini PCIe in Table 27. EU Mini PCIe in Table 28. EC Mini PCIe in Table 29. in Table 34. 21. Added current consumption of EC21-EC Mini PCIe 1. Deleted the information of GNSS supported on EC21-EC Mini PCIe in Table 1. 2. Added ThreadX variant EC21-AUX Mini PCIe and updated related contents in Table 1. 3. Updated supported protocols and USB serial driver in Table 2. 4. Updated conducted RF receiving sensitivity of EC21-EU Mini PCIe in Table 29. 5. Added conducted RF receiving sensitivity of EC21-

AUX Mini PCIe in Table 31. PCIe in Table 36. 7. Added current consumption of EC21-EU Mini PCIe 8. Added current consumption of EC21-AU Mini PCIe 9. Added note 2 for antenna requirement in Chapter in Table 37. in Table 38. 5.4.1. 10. Deleted current consumption of EC21-EC Mini PCIe, and the data will be updated in the future version. 1.3 2019-08-19 6. Added current consumption of EC21-AUX Mini Ward WANG/

Owen WEI EC21_Series_Mini_PCIe_Hardware_Design 6 / 75 1.4 2019-11-26 Fanny CHEN 3.10.3. LTE Standard Module Series 1. Removed related information of ThreadX OS because the baseline has been updated. 2. Updated the supported protocols and USB serial drivers in Table 2. 3. Added operating modes of module in Chapter 3.3. 4. Updated description of W_DISABLE# in Chapter 5. Updated the notes for GNSS performance in 6. Added current consumption of EC21-J Mini PCIe in 7. Updated the Mini PCI Express connector in Chapter 1. Added the related information of EC21-EUX Mini 2. Deleted the related information of EC21-EC Mini Chapter 4.2. Table 40. 7.3. PCIe. PCIe. 6.7). 5. Updated all unmarked dimension tolerances from 0.05 mm to 0.2 mm (Chapter 7). 6. Updated the information of packaging specifications

(Chapter 7.4). 1.5 2021-08-20 Barret XIONG 3. Updated the USB serial drivers (Chapter 2.3). 4. Added the power consumption of EC21-E (Chapter EC21_Series_Mini_PCIe_Hardware_Design 7 / 75 LTE Standard Module Series Contents Safety Information...................................................................................................................................................... 3 About the Document..................................................................................................................................................5 Contents........................................................................................................................................................................8 Table Index.................................................................................................................................................................10 Figure Index............................................................................................................................................................... 12 1 2 3 Introduction....................................................................................................................................................... 13 Special Mark.......................................................................................................................................... 15 1.1. Product Overview.............................................................................................................................................16 General Description..............................................................................................................................16 2.1. Description of Module Series..............................................................................................................16 2.2. Key Features......................................................................................................................................... 18 2.3. Functional Diagram.............................................................................................................................. 20 2.4. 3.4.1. 3.4.2. Application Interfaces.....................................................................................................................................21 Pin Assignment..................................................................................................................................... 21 3.1. Pin Description...................................................................................................................................... 22 3.2. Operating Modes.................................................................................................................................. 25 3.3. Power Saving........................................................................................................................................ 26 3.4. Sleep Mode................................................................................................................................. 26 Airplane Mode.............................................................................................................................26 Power Supply........................................................................................................................................ 26 3.5.

(U)SIM Interface....................................................................................................................................27 3.6. USB Interface........................................................................................................................................ 29 3.7. UART Interface......................................................................................................................................31 3.8. 3.9. PCM and I2C Interfaces...................................................................................................................... 32 3.10. Control and Indication Interfaces....................................................................................................... 34 3.10.1. RI...................................................................................................................................................35 3.10.2. DTR...............................................................................................................................................35 3.10.3. W_DISABLE#............................................................................................................................. 35 3.10.4. PERST#....................................................................................................................................... 36 3.10.5. LED_WWAN#............................................................................................................................. 36 3.10.6. WAKE#.........................................................................................................................................37 4 GNSS....................................................................................................................................................................39 General Description..............................................................................................................................39 GNSS Performance..............................................................................................................................39 GNSS Frequency..................................................................................................................................40 4.1. 4.2. 4.3. 5 Antenna Connection........................................................................................................................................41 Antenna Connectors............................................................................................................................ 41 5.1. 5.1.1. Operating Frequency.................................................................................................................41 Antenna Design Requirements.......................................................................................................... 42 5.2. EC21_Series_Mini_PCIe_Hardware_Design 8 / 75 LTE Standard Module Series 5.3. Recommended Mating Plugs for Antenna Connection.................................................................. 43 6 Reliability, Radio and Electrical Characteristics.....................................................................................45 General Description..............................................................................................................................45 6.1. Power Supply Requirements.............................................................................................................. 45 6.2. Digital I/O Characteristic......................................................................................................................46 6.3. Tx Power................................................................................................................................................ 46 6.4. Rx Sensitivity......................................................................................................................................... 47 6.5. ESD......................................................................................................................................................... 52 6.6. Power Consumption............................................................................................................................. 53 6.7. Thermal Dissipation..............................................................................................................................68 6.8. Notification............................................................................................................................................. 69 6.9. Coating.........................................................................................................................................69 Cleaning.......................................................................................................................................69 6.9.1. 6.9.2. 7.1. 7.2. 7.3. 7.4. 7 Mechanical Information.................................................................................................................................. 70 General Description..............................................................................................................................70 Mechanical Dimensions.......................................................................................................................70 Standard Dimensions of Mini PCI Express...................................................................................... 71 Packaging Specifications.................................................................................................................... 72 Blister Tray...................................................................................................................................72 Packaging Process.................................................................................................................... 74 7.4.1. 7.4.2. 8 Appendix References......................................................................................................................................75 EC21_Series_Mini_PCIe_Hardware_Design 9 / 75 LTE Standard Module Series Table Index Table 1: Special Mark................................................................................................................................................15 Table 2: Description of EC21 Series Mini PCIe....................................................................................................16 Table 3: Key Features of EC21 Series Mini PCIe................................................................................................ 18 Table 4: I/O Parameters Definition..........................................................................................................................22 Table 5: Pin Description............................................................................................................................................22 Table 6: Overview of Operating Modes..................................................................................................................25 Table 7: Pin Definition of VCC_3V3 and GND Pins.............................................................................................26 Table 8: Pin Definition of (U)SIM Interface............................................................................................................ 27 Table 9: Pin Definition of USB Interface................................................................................................................ 29 Table 10: Pin Definition of Main UART Interface..................................................................................................31 Table 11: Pin Definition of PCM and I2C Interfaces.............................................................................................32 Table 12: Pin Definition of Control and Indication Interfaces............................................................................. 34 Table 13: Airplane Mode Controlled by Hardware Method.................................................................................35 Table 14: Airplane Mode Controlled by Software Method.................................................................................. 36 Table 15: Indications of Network Status (AT+QCFG="ledmode",0, Default Setting)..................................... 37 Table 16: Indications of Network Status (AT+QCFG="ledmode",2)..................................................................37 Table 17: GNSS Performance................................................................................................................................. 39 Table 18: GNSS Frequency..................................................................................................................................... 40 Table 19: Operating Frequencies............................................................................................................................41 Table 20: Antenna Requirements............................................................................................................................42 Table 21: Power Supply Requirements..................................................................................................................45 Table 22: I/O Requirements..................................................................................................................................... 46 Table 23: Conducted RF Output Power of EC21 Series Mini PCIe.................................................................. 46 Table 24: Conducted RF Receiving Sensitivity of EC21-E Mini PCIe.............................................................. 47 Table 25: Conducted RF Receiving Sensitivity of EC21-A Mini PCIe.............................................................. 48 Table 26: Conducted RF Receiving Sensitivity of EC21-V Mini PCIe.............................................................. 48 Table 27: Conducted RF Receiving Sensitivity of EC21-AUT Mini PCIe.........................................................48 Table 28: Conducted RF Receiving Sensitivity of EC21-AU Mini PCIe........................................................... 49 Table 29: Conducted RF Receiving Sensitivity of EC21-J Mini PCIe...............................................................50 Table 30: Conducted RF Receiving Sensitivity of EC21-KL Mini PCIe............................................................ 50 Table 31: Conducted RF Receiving Sensitivity of EC21-EU Mini PCIe........................................................... 50 Table 32: Conducted RF Receiving Sensitivity of EC21-AUX Mini PCIe.........................................................51 Table 33: Conducted RF Receiving Sensitivity of EC21-EUX Mini PCIe.........................................................52 Table 34: ESD Characteristics of EC21 Series Mini PCIe..................................................................................53 Table 35: Power Consumption of EC21-E Mini PCIe.......................................................................................... 53 Table 36: Power Consumption of EC21-A Mini PCIe.......................................................................................... 55 Table 37: Power Consumption of EC21-V Mini PCIe.......................................................................................... 56 Table 38: Power Consumption of EC21-AU Mini PCIe....................................................................................... 56 Table 39: Power Consumption of EC21-J Mini PCIe...........................................................................................59 Table 40: Power Consumption of EC21-KL Mini PCIe........................................................................................ 60 Table 41: Power Consumption of EC21-EU Mini PCIe....................................................................................... 60 EC21_Series_Mini_PCIe_Hardware_Design 10 / 75 LTE Standard Module Series Table 42: Power Consumption of EC21-AUX Mini PCIe.................................................................................... 62 Table 43: Power Consumption of EC21-EUX Mini PCIe.................................................................................... 65 Table 44: GNSS Power Consumption of EC21 Series Mini PCIe Module.......................................................67 Table 45: Related Documents................................................................................................................................. 75 Table 46: Terms and Abbreviations.........................................................................................................................75 EC21_Series_Mini_PCIe_Hardware_Design 11 / 75 LTE Standard Module Series Figure Index Figure 1: Functional Diagram.................................................................................................................................. 20 Figure 2: Pin Assignment......................................................................................................................................... 21 Figure 3: Reference Circuit of Power Supply....................................................................................................... 27 Figure 4: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector............................... 28 Figure 5: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector................................. 28 Figure 6: Reference Circuit of USB Interface....................................................................................................... 30 Figure 7: Reference Circuit of Power Supply....................................................................................................... 31 Figure 8: Timing in Primary Mode...........................................................................................................................33 Figure 9: Timing in Auxiliary Mode..........................................................................................................................33 Figure 10: Reference Circuit of PCM Application with Audio Codec................................................................ 34 Figure 11: RI Behaviors............................................................................................................................................ 35 Figure 12: Reset Timing........................................................................................................................................... 36 Figure 13: LED_WWAN# Signal Reference Circuit Diagram............................................................................ 37 Figure 14: WAKE# Behaviors..................................................................................................................................38 Figure 15: Dimensions of the Receptacle RF Connectors (Unit: mm)............................................................. 43 Figure 16: Mechanicals of U.FL-LP Mating Plugs............................................................................................... 44 Figure 17: Space Factor of Mating Plugs (Unit: mm).......................................................................................... 44 Figure 18: Referenced Heatsink Design................................................................................................................68 Figure 19: Mechanical Dimensions of EC21 Series Mini PCIe......................................................................... 70 Figure 20: Standard Dimensions of Mini PCI Express........................................................................................71 Figure 21: Dimensions of the Mini PCI Express Connector (Molex 679105700)...........................................72 Figure 22: Blister Tray Dimension Drawing...........................................................................................................73 Figure 23: Packaging Process................................................................................................................................ 74 EC21_Series_Mini_PCIe_Hardware_Design 12 / 75 LTE Standard Module Series 1 Introduction This document defines EC21 series Mini PCIe module, and describes its air interfaces and hardware interfaces which are connected with customers applications. This document helps customers quickly understand module interface specifications, electrical characteristics, mechanical specifications and other related information of the module. To facilitate application designs, it also includes some reference designs for customers reference. The document, coupled with application notes and user guides, makes it easy to design and set up wireless applications with EC21 series Mini PCIe. FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-

based timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2021EC21ADL 4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

LTE Band 2 :9.500dBi LTE Band 4:6.500dBi LTE Band 12 :10.197dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling EC21_Series_Mini_PCIe_Hardware_Design 13 / 75 LTE Standard Module Series requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: XMR2021EC21ADL or Contains FCC ID: XMR2021EC21ADL must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. EC21_Series_Mini_PCIe_Hardware_Design 14 / 75 LTE Standard Module Series The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A- 2021EC21ADL or where: 10224A- 2021EC21ADLis the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A- 2021EC21ADL" ou "o: 10224A- 2021EC21ADLest le numro de certification du module". LTE Band 2 :9.500dBi LTE Band 4:6.500dBi LTE Band 12 :7.11dBi 1.1. Special Mark Table 1: Special Mark Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of such model is currently unavailable. EC21_Series_Mini_PCIe_Hardware_Design 15 / 75 LTE Standard Module Series 2 Product Overview 2.1. General Description EC21 series Mini PCIe module provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks with PCI Express Mini Card 1.2 standard interface. It supports embedded operating systems such as Linux, Android etc., and also provides audio, high-speed data transmission and GNSS functionalities for customers applications. EC21 series Mini PCIe module can be applied in the following fields:

PDA and laptop computer Remote monitor system Wireless POS system Intelligent meter reading system Wireless router and switch Other wireless terminal devices NOTE EC21 series Mini PCIe contains Data + Voice version and Data-only version. Data + Voice version supports voice and data functions, while Data-only version only supports data function. 2.2. Description of Module Series EC21 series Mini PCIe series contains 10 variants, and are listed in the following table. Table 2: Description of EC21 Series Mini PCIe Module Series Description EC21-E Mini PCIe Supports GSM: 900/1800 Supports WCDMA: B1/B5/B8 Supports LTE-FDD: B1/B3/B5/B7/B8/B20 Supports LTE/WCDMA receive diversity EC21_Series_Mini_PCIe_Hardware_Design 16 / 75 LTE Standard Module Series EC21-A Mini PCIe EC21-V Mini PCIe EC21-AUT Mini PCIe EC21-AU Mini PCIe 1 EC21-J Mini PCIe EC21-KL Mini PCIe EC21-EU Mini PCIe EC21-AUX Mini PCIe 1 Supports GNSS Supports digital audio Supports WCDMA: B2/B4/B5 Supports LTE-FDD: B2/B4/B12 Supports LTE/WCDMA receive diversity Supports GNSS Supports digital audio Supports LTE-FDD: B4/B13 Supports LTE receive diversity Supports GNSS Supports digital audio Supports WCDMA: B1/B5 Supports LTE-FDD: B1/B3/B5/B7/B28 Supports LTE/WCDMA receive diversity Supports GNSS Supports digital audio Supports GSM: 850/900/1800/1900 Supports WCDMA: B1/B2/B5/B8 Supports LTE-FDD: B1/B2/B3/B4/B5/B7/B8/B28 Supports LTE-TDD: B40 Supports LTE/WCDMA receive diversity Supports GNSS Supports digital audio Supports LTE-FDD: B1/B3/B8/B18/B19/B26 Supports LTE receive diversity Supports digital audio Supports LTE-FDD: B1/B3/B5/B7/B8 Supports LTE receive diversity Supports digital audio Supports GSM: 900/1800 Supports WCDMA: B1/B8 Supports LTE-FDD: B1/B3/B7/B8/B20/B28A Supports LTE/WCDMA receive diversity Supports GNSS Supports digital audio Supports GSM: 850/900/1800/1900 Supports WCDMA: B1/B2/B4/B5/B8 Supports LTE-FDD: B1/B2/B3/B4/B5/B7/B8/B28 Supports LTE-TDD: B40 Supports LTE/WCDMA receive diversity Supports GNSS Supports digital audio 1 B2 of EC21-AU Mini PCIe and EC21-AUX Mini PCIe module does not support Rx-diversity. EC21_Series_Mini_PCIe_Hardware_Design 17 / 75 LTE Standard Module Series Supports LTE-FDD: B1/B3/B7/B8/B20/B28A Supports WCDMA: B1/B8 Supports GSM: 900/1800 Supports LTE/WCDMA receive diversity Supports GNSS Supports digital audio EC21-EUX Mini PCIe NOTE 2.3. Key Features 1. The GNSS function of EC21 series Mini PCIe is optional. 2. Digital audio (PCM) function is only supported on Data +Voice version. Table 3: Key Features of EC21 Series Mini PCIe Features Description Function Interface PCI Express Mini Card 1.2 Standard Interface Power Supply Supply voltage: 3.03.6 V Typical supply voltage: 3.3 V Class 4 (33 dBm 2 dB) for GSM850 Class 4 (33 dBm 2 dB) for EGSM900 Class 1 (30 dBm 2 dB) for DCS1800 Class 1 (30 dBm 2 dB) for PCS1900 Class E2 (27 dBm 3 dB) for GSM850 8-PSK Class E2 (27 dBm 3 dB) for EGSM900 8-PSK Class E2 (26 dBm 3 dB) for DCS1800 8-PSK Class E2 (26 dBm 3 dB) for PCS1900 8-PSK Class 3 (24 dBm +1/-3 dB) for WCDMA bands Class 3 (23 dBm 2 dB) for LTE-FDD bands Class 3 (23 dBm 2 dB) for LTE-TDD bands Support up to non-CA Cat 1 FDD and TDD Support 1.4/3/5/10/15/20 MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max. 10 Mbps (DL)/Max. 5 Mbps (UL) LTE-TDD: Max. 8.96 Mbps (DL)/Max. 3.1 Mbps (UL) Transmitting Power LTE Features Support 3GPP Rel-8 DC-HSDPA, HSPA+, HSDPA, HSUPA and UMTS Features WCDMA Support QPSK, 16QAM and 64QAM modulation DC-HSDPA: Max. 42 Mbps (DL) EC21_Series_Mini_PCIe_Hardware_Design 18 / 75 LTE Standard Module Series HSUPA: Max. 5.76 Mbps (UL) WCDMA: Max. 384 kbps (DL)/Max. 384 kbps (UL) GPRS:

Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max. 107 kbps (DL)/Max. 85.6 kbps (UL) EDGE:

Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: MCS 1-9 Uplink coding schemes: MCS 1-9 Max. 296 kbps (DL)/Max. 236.8 kbps (UL) Internet Protocol Features Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/

NITZ/SMTP/SSL/MQTT/CMUX/SMTPS/MMS*/FILE* protocols Support PAP and CHAP for PPP connections Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default

(U)SIM Interface Support USIM/SIM card: 1.8 V, 3.0 V Main UART:

Support RTS and CTS hardware flow control Baud rate can reach up to 230400 bps, 115200 bps by default Used for AT command communication and data transmission Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long Compliant with USB 2.0 specification (slave only); the data transfer frame synchronization rate can reach up to 480 Mbps Used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA output and voice over USB. Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.65.12, Android 4.x11.x, etc. Antenna Connectors Include main antenna, diversity antenna and GNSS antenna receptacle connectors EC21_Series_Mini_PCIe_Hardware_Design 19 / 75 GSM Features SMS UART Interface Audio Features PCM Interface USB Interface LTE Standard Module Series Rx-diversity (Optional) Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Physical Characteristics Temperature Range Protocol: NMEA 0183 Data update rate: 1 Hz by default Compliant with 3GPP TS 27.007 and 3GPP TS 27.005 Quectel enhanced AT commands Size: (51.0 0.15) mm (30.0 0.15) mm (4.9 0.2) mm Weight: approx. 9.8 g Operating temperature range: -35 C to +75 C 2 Extended temperature range: -40 C to +80 C 3 Storage temperature range: -40 C to +90 C Firmware Upgrade USB interface or DFOTA*

RoHS All hardware components are fully compliant with EU RoHS directive 2.4. Functional Diagram The following figure shows the block diagram of EC21 series Mini PCIe. Figure 1: Functional Diagram 2 Within operating temperature range, the module is 3GPP compliant. 3 Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again. EC21_Series_Mini_PCIe_Hardware_Design 20 / 75 LTE Standard Module Series 3 Application Interfaces The physical connections and signal levels of EC21 series Mini PCIe comply with PCI Express Mini Card Electromechanical Specification. This chapter mainly describes the definition and application of the following interfaces/pins of EC21 series Mini PCIe. Power supply

(U)SIM interface USB interface UART interface PCM and I2C interfaces Control and indication interfaces 3.1. Pin Assignment The following figure shows the pin assignment of EC21 series Mini PCIe module. The top side contains EC21 series module and antenna connectors. Figure 2: Pin Assignment EC21_Series_Mini_PCIe_Hardware_Design 21 / 75 LTE Standard Module Series The following tables show the pin definition and description of the 52 pins on EC21 series Mini PCIe. 3.2. Pin Description Table 4: I/O Parameters Definition Description Analog Input/Output Digital Input Digital Output Digital Input/Output Open Collector Power Input Power Output Table 5: Pin Description Pin No. Mini PCI Express Standard Name EC21 Series Mini PCIe Pin Name I/O Description Comment WAKE#

WAKE#

OC Wake up the host 3.3Vaux VCC_3V3 PI 3.03.6 V, typ. 3.3 V DC supply COEX1 RESERVED Reserved GND GND Mini card ground COEX2 RESERVED Reserved 1.5V NC Not connected CLKREQ#

RESERVED Reserved It is prohibited to be pulled up to high level before startup. It is prohibited to be pulled up to high level before startup. EC21_Series_Mini_PCIe_Hardware_Design 22 / 75 Type AIO DI DO DIO OC PI PO 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 23 24 25 26 27 28 29 30 LTE Standard Module Series UIM_PWR USIM_VDD PO

(U)SIM card power supply GND GND Mini card ground UIM_DATA USIM_DATA DIO

(U)SIM card data REFCLK-

UART_RX DI UART receive UIM_CLK USIM_CLK DO

(U)SIM card clock REFCLK+

UART_TX DO UART transmit UIM_RESET USIM_RST DO

(U)SIM card reset GND GND Mini card ground UIM_VPP RESERVED Reserved RESERVED RI DO Ring indication GND GND Mini card ground RESERVED RESERVED Reserved 20 W_DISABLE#

W_DISABLE#

DI Airplane mode control 21 GND GND Mini card ground 22 PERST#

PERST#

DI Fundamental reset PERn0 UART_CTS DI DCE clear to send signal from DTE 3.3Vaux RESERVED Reserved PERp0 UART_RTS DO DCE request to send signal from DTE Connect to DTEs CTS GND GND 1.5V GND GND GND NC GND Mini card ground Mini card ground Not connected Mini card ground I2C serial clock

(for external codec) SMB_CLK I2C_SCL DO Require external pull-up EC21_Series_Mini_PCIe_Hardware_Design 23 / 75 Connect to DTEs Tx. Connect to DTEs Rx. Pulled up by default. Active LOW. Pulled up by default. Active LOW. Connect to DTEs RTS 31 PETn0 DTR DI Sleep mode control 32 SMB_DATA I2C_SDA DIO I2C serial data

(for external codec) PETp0 RESERVED Reserved GND GND GND GND Mini card ground Mini card ground 36 USB_D-

USB_DM AIO USB differential data (-) 37 GND GND Mini card ground 38 USB_D+

USB_DP AIO USB differential data (+) LTE Standard Module Series to 1.8 V. Require external pull-up to 1.8 V. Require differential impedance of 90 . Require differential impedance of 90 . 42 LED_WWAN#

LED_WWAN#

OC Active LOW. 3.3Vaux VCC_3V3 3.03.6 V, typically 3.3 V DC supply GND GND Mini card ground 3.3Vaux VCC_3V3 PI PI 3.03.6 V, typically 3.3 V DC supply LED signal for indicating the network status of the module GND GND Mini card ground LED_WLAN#

DI

(U)SIM card insertion detect USIM_ PRESENCE RESERVED PCM_CLK 4 DIO PCM clock LED_WPAN#

RESERVED Reserved RESERVED PCM_DOUT 4 DO PCM data output 1.5V NC Not connected 33 34 35 39 40 41 43 44 45 46 47 48 4 The digital audio (PCM) function is only supported on Data + Voice version. EC21_Series_Mini_PCIe_Hardware_Design 24 / 75 LTE Standard Module Series RESERVED PCM_DIN 4 DI PCM data input GND GND Mini card ground RESERVED PCM_SYNC 4 DIO PCM frame sync 3.3Vaux VCC_3V3 PI 3.03.6 V, typically 3.3 V DC supply 49 50 51 52 NOTE Keep all NC, RESERVED and unused pins unconnected. 3.3. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters. Table 6: Overview of Operating Modes Mode Details Normal Operation Airplane Mode Minimum Functionality Mode Sleep Mode Idle The module remains registered on the network, and is ready to send and receive data. In this mode, the software is active. Talk/Data The module is connected to network. Its current consumption varies with the network setting and data transfer rate. AT+CFUN=4 or W_DISABLE# pin can set the module to airplane mode where the RF function is invalid. AT+CFUN=0 can set the module into a minimum functionality mode without removing the power supply. In this mode, both RF function and (U)SIM card are invalid. The module remains the ability to receive paging message, SMS, voice call and TCP/UDP data from the network normally. In this mode, the current consumption of the module is reduced to a very low level. For details of the command, see document !. EC21_Series_Mini_PCIe_Hardware_Design 25 / 75 LTE Standard Module Series 3.4. Power Saving 3.4.1. Sleep Mode 3.4.2. Airplane Mode 3.5. Power Supply EC21 series Mini PCIe is able to reduce its current consumption to a minimum value in sleep mode. There are three preconditions must be met to make the module enter sleep mode. Execute AT+QSCLK=1 to enable sleep mode. For more details, see document [1]. Ensure DTR is kept at high level or be kept open. The hosts USB bus, which is connected with the modules USB interface, enters suspend state. When the module enters airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. For more details, refer to Chapter 3.10.3. The following table shows pin definition of VCC_3V3 pins and ground pins. Table 7: Pin Definition of VCC_3V3 and GND Pins Pin Name Pin No. I/O Power Domain Description VCC_3V3 2, 39, 41, 52 PI 3.03.6 V Typ. 3.3 V DC supply GND 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 The typical supply voltage of EC21 series Mini PCIe is 3.3 V. In the 2G network, the input peak current may reach 2.7 A during the transmitting time. Therefore, the power supply must be able to provide a rated output current of 2.7 A at least, and a bypass capacitor of no less than 470 F with low ESR should be used to prevent the voltage from dropping. If the switching power supply is used to supply power to the module, the power device and power supply routing traces of the switching power supply should avoid the antennas as much as possible to prevent EMI interference. The following figure shows a reference design of power supply where R2 and R3 are 1 % tolerance resistors and C3 is a low-ESR capacitor (470 F). EC21_Series_Mini_PCIe_Hardware_Design 26 / 75 LTE Standard Module Series Figure 3: Reference Circuit of Power Supply 3.6. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported. The following table shows the pin definition of (U)SIM interface. Table 8: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Power Domain Description USIM_VDD USIM_DATA USIM_CLK USIM_RST 8 10 12 14 PO DIO DO DO DI 1.8/3.0 V

(U)SIM card power supply 1.8/3.0 V

(U)SIM card data 1.8/3.0 V

(U)SIM card clock 1.8/3.0 V

(U)SIM card reset USIM_PRESENCE 44 1.8 V

(U)SIM card insertion detect EC21 series Mini PCIe supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low-level and high-level detections. By default, is disabled, and can be configured via AT+QSIMDET. See document [1] for details about the command. it The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. EC21_Series_Mini_PCIe_Hardware_Design 27 / 75 LTE Standard Module Series Figure 4: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 5: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers applications, please follow the criteria below in (U)SIM circuit design:

EC21_Series_Mini_PCIe_Hardware_Design 28 / 75 LTE Standard Module Series Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200 mm as possible. Keep (U)SIM card signals away from RF and power supply traces. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and For better ESD protection, it is recommended to add a TVS diode with parasitic capacitance not shield them with surrounded ground. exceeding 15 pF. The 0 resistors should be added in series between the module and the (U)SIM card connector to facilitate debugging. The 33 pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA trace can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 3.7. USB Interface EC21 series Mini PCIe provides one integrated Universal Serial Bus (USB) interface which complies with USB 2.0 specification. It can only be used as a slave device. EC21 series Mini PCIe supports high-speed

(480 Mbps) mode and full-speed (12 Mbps) mode. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface. Table 9: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_DM USB_DP 36 38 AIO AIO USB differential data (-) Require differential impedance of 90 . USB differential data (+) Require differential impedance of 90 . EC21_Series_Mini_PCIe_Hardware_Design 29 / 75 LTE Standard Module Series Minimize these stubs Test Points Module USB_DM USB_DP GND NM_0R NM_0R R3 R4 L1 ESD Array Close to Module MCU USB_DM USB_DP GND Figure 6: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customers MCU to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data trace signal, L1 & R3 & R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. To meet USB 2.0 specification, the following principles should be complied with when design the USB interface. Route the USB signal traces as differential pairs with ground surrounded. The impedance of USB differential trace is 90 . Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. Route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on that layer and with ground planes above and below. Junction capacitance of the ESD protection device might cause influences on USB data traces, so you should pay attention to the selection of the device. Typically, the capacitance value should be less than 2 pF. Keep the ESD protection devices as close to the USB connector as possible. EC21_Series_Mini_PCIe_Hardware_Design 30 / 75 LTE Standard Module Series 3.8. UART Interface EC21 series Mini PCIe module provides one main UART interface. The main UART interface supports 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps and 230400 bps baud rates, and the default is 115200 bps. The main UART interface supports RTS and CTS hardware flow control, and be used for AT command communication and data transmission. The following table shows the pin definition of the main UART interface. Table 10: Pin Definition of Main UART Interface Pin Name Pin No. I/O Description Power Domain UART_RX DI UART receive UART_TX DO UART transmit 3.3 V 3.3 V UART_CTS DI DCE clear to send signal from DTE 3.3 V UART_RTS DO DCE request to send signal from DTE 3.3 V 11 13 23 25 The signal customers need to pay attention to the signal direction. The reference circuit is shown as below:

level of main UART interface is 3.3 V. When connecting to the peripheral MCU/RAM, Figure 7: Reference Circuit of Power Supply EC21_Series_Mini_PCIe_Hardware_Design 31 / 75 LTE Standard Module Series NOTE AT+IPR can be used to set the baud rate of the main UART, and AT+IFC can be used to set the hardware flow control (hardware flow control is disabled by default). See document [1] for details. 3.9. PCM and I2C Interfaces EC21 series Mini PCIe provides one Pulse Code Modulation (PCM) digital interface. interface and one I2C The following table shows the pin definition of PCM and I2C interfaces that can be applied in audio codec design. Table 11: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_CLK 5 DIO PCM clock PCM_DOUT 5 PCM_DIN 5 I2C_SCL I2C_SDA 45 47 49 51 30 32 DO DI DO DIO PCM data output PCM data input I2C serial clock

(for external codec) I2C serial data

(for external codec) PCM_SYNC 5 DIO PCM frame sync 1.8 V 1.8 V 1.8 V 1.8 V Require external pull-up to 1.8 V. Require external pull-up to 1.8 V. EC21 series Mini PCIe provides one PCM digital interface, which supports 16-bit linear data format and the following modes:

Primary mode (short frame synchronization, works as either master or slave) Auxiliary mode (long frame synchronization, works as master only) In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256 kHz, 512 kHz, 1024 kHz or 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4096 kHz PCM_CLK at 16 kHz PCM_SYNC. 5 The digital audio (PCM) function is only supported on Data + Voice version. EC21_Series_Mini_PCIe_Hardware_Design 32 / 75 The following figure shows the timing relationship in primary mode with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK. LTE Standard Module Series Figure 8: Timing in Primary Mode In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256 kHz, 512 kHz, 1024 kHz or 2048 kHz PCM_CLK and an 8 kHz, 50 % duty cycle PCM_SYNC. The following figure shows the timing relationship in auxiliary mode with 8 kHz PCM_SYNC and 256 kHz PCM_CLK. Figure 9: Timing in Auxiliary Mode EC21_Series_Mini_PCIe_Hardware_Design 33 / 75 LTE Standard Module Series Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. In addition, EC21 series Mini PCIes firmware has integrated the configuration on some PCM codecs application with I2C interface. See document [1] for details about AT+QDAI. The following figure shows a reference design of PCM interface with an external codec IC. Figure 10: Reference Circuit of PCM Application with Audio Codec 3.10. Control and Indication Interfaces The following table shows the pin definition of control and indication interfaces. Table 12: Pin Definition of Control and Indication Interfaces Pin Name Pin No. I/O Description Comment RI DTR 17 31 DO Ring indication 3.3 V power domain. Sleep mode control 3.3 V power domain. W_DISABLE#

20 Airplane mode control DI DI 3.3 V power domain. Pulled up by default. Active LOW. 3.3 V power domain. Pulled up by default. Active LOW. PERST#

22 DI Fundamental reset LED_WWAN#

42 OC LED signal for indicating the network status of the module Active LOW. WAKE#

1 OC Wake up the host EC21_Series_Mini_PCIe_Hardware_Design 34 / 75 LTE Standard Module Series 3.10.1. RI The RI signal can be used to wake up the host. When a URC returns, there will be the following behaviors on the RI pin after executing AT+QCFG="risignaltype","physical". See document !

for details. Figure 11: RI Behaviors The DTR signal is used for sleep mode control. It is pulled up by default. When the module is in sleep mode, driving DTR low can wake up the module. For more details about the preconditions for the module to enter sleep mode, refer to Chapter 3.4.1. 3.10.2. DTR 3.10.3. W_DISABLE#

EC21 series Mini PCIe provides a W_DISABLE# signal to disable or enable the RF function (excluding GNSS). The W_DISABLE# pin is pulled up by default. The W_DISABLE# control function for airplane mode is disabled in firmware by default, it can be enabled by AT+QCFG=airplanecontrol,1. Driving it low can make the module enter airplane mode. See document !for details. Table 13: Airplane Mode Controlled by Hardware Method W_DISABLE#

RF Function Status Module Operation Mode High level Low level RF enabled RF disabled Normal mode Airplane mode The RF function can also be enabled or disabled through AT+CFUN, and the details are as follows. EC21_Series_Mini_PCIe_Hardware_Design 35 / 75 LTE Standard Module Series Table 14: Airplane Mode Controlled by Software Method AT+CFUN=?

RF Function Status Module Operation Mode 0 1 4 RF and (U)SIM card disabled Minimum functionality mode RF enabled RF disabled Normal mode Airplane mode 3.10.4. PERST#

The PERST# signal can be used to force a hardware reset on the card. The module can be reset by driving the PERST# signal low for 150460 ms and then releasing it. The PERST# signal is sensitive to interference. The traces should be as short as possible and be surrounded with ground. The reset scenario is illustrated in the following figure. VCC_3V3 PERST#

Module Status 150 ms 460 ms VIL 0.5 V VIH 2.3 V Running Resetting Restart Figure 12: Reset Timing 3.10.5. LED_WWAN#

LED_WWAN# is an open collector output signal, it is used to indicate the network status of the module, and maximum input current can up to 40 mA. According to the following circuit, in order to reduce the current of the LED, a resistor must be placed in series with the LED. The resistance value can be adjusted according to the brightness of the LED light. The LED is emitting light when the LED_WWAN# output signal is active LOW. EC21_Series_Mini_PCIe_Hardware_Design 36 / 75 LTE Standard Module Series Figure 13: LED_WWAN# Signal Reference Circuit Diagram There are two indication modes for LED_WWAN# signal switched through following AT commands:

to indicate network status, which can be AT+QCFG="ledmode",0 (Default setting) AT+QCFG="ledmode",2 The following tables show the detailed network status indications of the LED_WWAN# signal. Table 15: Indications of Network Status (AT+QCFG="ledmode",0, Default Setting) Pin Status Description Flicker slowly (200 ms Low/1800 ms High) Network searching Flicker slowly (1800 ms Low/200 ms High) Idle Flicker quickly (125 ms Low/125 ms High) Data transfer is ongoing Always Low Voice calling Table 16: Indications of Network Status (AT+QCFG="ledmode",2) Pin Status Description Low Level (Light ON) Registered on network successfully High-Impedance (Light OFF) No network coverage or not registered W_DISABLE# signal is at low level. (Disable the RF) AT+CFUN=0, AT+CFUN=4 input 3.10.6. WAKE#

The WAKE# signal is an open collector signal which is similar to RI signal, but a pull-up resistor and AT+QCFG="risignaltype","physical" are required. When a URC returns, a 120 ms low level pulse will be outputted. The state of WAKE# signal is shown as below. EC21_Series_Mini_PCIe_Hardware_Design 37 / 75 LTE Standard Module Series Figure 14: WAKE# Behaviors EC21_Series_Mini_PCIe_Hardware_Design 38 / 75 LTE Standard Module Series 4 GNSS 4.1. General Description EC21 series Mini PCIe includes a fully integrated global navigation satellite system solution that supports GPS, GLONASS, BeiDou (COMPASS), Galileo and QZSS. Additionally, it supports standard NMEA-

0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, EC21 series Mini PCIe GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, see document [3]. 4.2. GNSS Performance The following table shows the GNSS performance of EC21 series Mini PCIe. Table 17: GNSS Performance Parameter Description Conditions Sensitivity

(GNSS) Cold start Autonomous Reacquisition Autonomous Tracking Autonomous TTFF

(GNSS) Warm start

@ open sky Cold start

@ open sky Hot start

@ open sky Autonomous XTRA enabled Autonomous XTRA enabled Autonomous XTRA enabled Typ.

-146

-157

-157 35 18 26 2.2 2.5 1.8 Unit dBm dBm dBm s s s s s s EC21_Series_Mini_PCIe_Hardware_Design 39 / 75 LTE Standard Module Series CEP-50

< 2.5 m Autonomous

@ open sky Accuracy

(GNSS) NOTE 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock positioning for at least 3 minutes continuously). within 3 minutes after loss of lock. 3. Cold start sensitivity:

the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command. 4.3. GNSS Frequency The following table shows the GNSS frequency of EC21 series Mini PCIe. Table 18: GNSS Frequency Type GPS GLONASS Galileo Frequency 1575.42 1.023 1597.51605.8 1575.42 2.046 BeiDou (COMPASS) 1561.098 2.046 QZSS 1575.42 Unit MHz MHz MHz MHz MHz EC21_Series_Mini_PCIe_Hardware_Design 40 / 75 LTE Standard Module Series 5 Antenna Connection 5.1. Antenna Connectors EC21 series Mini PCIe is mounted with three antenna connectors for external antenna connection: a main antenna connector, an Rx-diversity antenna connector, and a GNSS antenna connector. And Rx-

diversity function is enabled by default. The impedance of the antenna connectors is 50 . The following table shows the operating frequencies of EC21 series Mini PCIe. 5.1.1. Operating Frequency Table 19: Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 LTE-FDD B1 LTE-FDD B2 Transmit 824849 880915 17101785 18501910 19201980 18501910 17101755 824849 880915 19201980 18501910 Receive 869894 925960 18051880 19301990 21102170 19301990 21102155 869894 925960 21102170 19301990 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EC21_Series_Mini_PCIe_Hardware_Design 41 / 75 LTE-FDD B3 LTE-FDD B4 17101785 17101755 LTE-FDD B5 824849 LTE-FDD B7 25002570 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B26 LTE-FDD B28 880915 699716 777787 815830 830845 832862 814849 703748 LTE Standard Module Series 18051880 21102155 869894 26202690 925960 729746 746756 860875 875890 791821 859894 758803 MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz LTE-TDD B40 23002400 23002400 5.2. Antenna Design Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 20: Antenna Requirements Type Requirements GNSS GSM/UMTS/LTE Frequency range: 15591609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0 dBi Active antenna noise figure: < 1.5 dB Active antenna gain: > 0 dBi Active antenna embedded LNA gain: <17 dB VSWR: 2 Efficiency: > 30 %

Max input power: 50 W EC21_Series_Mini_PCIe_Hardware_Design 42 / 75 LTE Standard Module Series Input impedance: 50 Cable insertion loss:

< 1 dB: LB (<1 GHz)

< 1.5 dB: MB (12.3 GHz)

< 2 dB: HB (> 2.3 GHz) NOTE 1. It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 2. Since the GNSS port has a 2.85 V voltage output, a passive antenna that causes shorting to GND, such as PIFA antenna is not recommended. 5.3. Recommended Mating Plugs for Antenna Connection EC21 series Mini PCIe is mounted with RF connectors (receptacles) for convenient antenna connection. The dimensions of the antenna connectors are shown as below. Figure 15: Dimensions of the Receptacle RF Connectors (Unit: mm) EC21_Series_Mini_PCIe_Hardware_Design 43 / 75 U.FL-LP mating plugs listed in the following figure can be used to match the receptacles. LTE Standard Module Series Figure 16: Mechanicals of U.FL-LP Mating Plugs The following figure describes the space factor of mating plugs. Figure 17: Space Factor of Mating Plugs (Unit: mm) For more details of the recommended mating plugs, please visit http://www.hirose.com. EC21_Series_Mini_PCIe_Hardware_Design 44 / 75 LTE Standard Module Series 6 Reliability, Radio and Electrical Characteristics This chapter mainly describes the following electrical and radio characteristics of EC21 series Mini PCIe:

6.1. General Description Power supply requirements Digital I/O characteristic Tx power Rx sensitivity ESD Power consumption Thermal dissipation 6.2. Power Supply Requirements The input voltage of EC21 series Mini PCIe is 3.03.6 V, as specified by PCI Express Mini Card Electromechanical Specification Revision 1.2. The following table shows the power supply requirements of EC21 series Mini PCIe. Table 21: Power Supply Requirements Parameter Description VCC_3V3 Power supply Min. 3.0 Typ. 3.3 Max. 3.6 Unit V EC21_Series_Mini_PCIe_Hardware_Design 45 / 75 LTE Standard Module Series 6.3. Digital I/O Characteristic The following table shows the I/O requirements of EC21 series Mini PCIe. Table 22: I/O Requirements Parameter Description Min. Max. Unit Input high voltage 0.7 VCC_3V3 VCC_3V3 + 0.3 Input low voltage

-0.3 0.3 VCC_3V3 Output high voltage VCC_3V3 - 0.5 VCC_3V3 Output low voltage 0 0.4 V V V V 1. The PCM and I2C interfaces are 1.8 V power domain and other I/O interfaces are VCC_3V3 power 2. The maximum voltage value of VIL for PERST# and W_DISABLE# is 0.5 V. VIH VIL VOH VOL NOTE domain. 6.4. Tx Power The following tables show the conducted RF output power of EC21 series Mini PCIe module. Table 23: Conducted RF Output Power of EC21 Series Mini PCIe Frequency Bands Max. RF Output Power Min. RF Output Power GSM850/EGSM900 33 dBm 2 dB 5 dBm 5 dB DCS1800/PCS1900 30 dBm 2 dB 0 dBm 5 dB GSM850/EGSM900 (8-PSK) 27 dBm 3 dB 5 dBm 5 dB DCS1800/PCS1900 (8-PSK) 26 dBm 3 dB 0 dBm 5 dB WCDMA bands LTE-FDD bands 24 dBm +1/-3 dB

< -49 dBm 23 dBm 2 dB

< -39 dBm EC21_Series_Mini_PCIe_Hardware_Design 46 / 75 LTE-TDD bands 23 dBm 2 dB

< -39 dBm LTE Standard Module Series In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. NOTE 6.5. Rx Sensitivity Table 24: Conducted RF Receiving Sensitivity of EC21-E Mini PCIe Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO 6 EGSM900

-109.0 dBm DCS1800

-109.0 dBm WCDMA B1

-110.5 dBm WCDMA B5

-110.5 dBm WCDMA B8

-110.5 dBm

3GPP (SIMO)

-102.0 dBm

-102.0 dBm

-106.7 dBm

-104.7 dBm

-103.7 dBm LTE-FDD B1 (10 MHz)

-98.0 dBm

-98.0 dBm

-101.5 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-96.5 dBm

-98.5 dBm

-101.5 dBm

-93.3 dBm LTE-FDD B5 (10 MHz)

-98.0 dBm

-98.5 dBm

-101.0 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97.0 dBm

-97.0 dBm

-99.5 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-97.0 dBm

-97.0 dBm

-101.0 dBm

-93.3 dBm LTE-FDD B20 (10 MHz)

-97.5 dBm

-99.0 dBm

-102.5 dBm

-93.3 dBm 6 SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve Rx performance. EC21_Series_Mini_PCIe_Hardware_Design 47 / 75 LTE Standard Module Series Table 25: Conducted RF Receiving Sensitivity of EC21-A Mini PCIe Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO 6 WCDMA B2

-110.0 dBm WCDMA B4

-110.0 dBm WCDMA B5

-110.5 dBm

3GPP (SIMO)

-104.7 dBm

-106.7 dBm

-104.7 dBm LTE-FDD B2 (10 MHz)

-98.0 dBm

-98.0 dBm

-101.0 dBm

-94.3 dBm LTE-FDD B4 (10 MHz)

-97.5 dBm

-99.0 dBm

-101.0 dBm

-96.3 dBm LTE-FDD B12 (10 MHz)

-97.2 dBm

-98.0 dBm

-101.0 dBm

-93.3 dBm Table 26: Conducted RF Receiving Sensitivity of EC21-V Mini PCIe Frequency Bands 3GPP (SIMO) Receiving Sensitivity (Typ.) Primary Diversity SIMO 6 LTE-FDD B4 (10 MHz)

-97.5 dBm

-99.0 dBm

-101.0 dBm

-96.3 dBm LTE-FDD B13 (10 MHz)

-97.7 dBm

-97.0 dBm

-100.0 dBm

-93.3 dBm Table 27: Conducted RF Receiving Sensitivity of EC21-AUT Mini PCIe Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO 6 WCDMA B1

-110.0 dBm WCDMA B5

-110.5 dBm

3GPP (SIMO)

-106.7 dBm

-104.7 dBm LTE-FDD B1 (10 MHz)

-98.5 dBm

-98.0 dBm

-101.0 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-98.0 dBm

-97.0 dBm

-100.0 dBm

-93.3 dBm LTE-FDD B5 (10 MHz)

-98.0 dBm

-99.0 dBm

-102.5 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97.0 dBm

-97.0 dBm

-98.5 dBm

-94.3 dBm

EC21_Series_Mini_PCIe_Hardware_Design 48 / 75 LTE Standard Module Series LTE-FDD B28 (10 MHz)

-97.0 dBm

-99.0 dBm

-102.0 dBm

-94.8 dBm Table 28: Conducted RF Receiving Sensitivity of EC21-AU Mini PCIe Frequency Bands 3GPP (SIMO) Primary Diversity SIMO 6 Receiving Sensitivity (Typ.)

-102.0 dBm

-102.0 dBm

-102.0 dBm

-102.0 dBm

-106.7 dBm

-104.7 dBm

-104.7 dBm

-103.7 dBm GSM850

-109.0 dBm EGSM900

-109.0 dBm DCS1800 PCS1900

-109.0 dBm

-109.0 dBm WCDMA B1

-110.0 dBm WCDMA B2

-110.0 dBm WCDMA B5

-111.0 dBm WCDMA B8

-111.0 dBm

LTE-FDD B1 (10 MHz)

-97.2 dBm

-97.5 dBm

-100.2 dBm

-96.3 dBm LTE-FDD B2 (10 MHz)

-98.2 dBm

-94.3 dBm LTE-FDD B3 (10 MHz)

-98.7 dBm

-98.6 dBm

-102.2 dBm

-93.3 dBm LTE-FDD B4 (10 MHz)

-97.7 dBm

-97.4 dBm

-100.2 dBm

-96.3 dBm LTE-FDD B5 (10 MHz)

-98.0 dBm

-98.2 dBm

-101.0 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-97.7 dBm

-97.7 dBm

-101.2 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-99.2 dBm

-98.2 dBm

-102.2 dBm

-93.3 dBm LTE-FDD B28 (10 MHz)

-98.6 dBm

-98.7 dBm

-102.0 dBm

-94.8 dBm LTE-TDD B40 (10 MHz)

-97.2 dBm

-98.4 dBm

-101.2 dBm

-96.3 dBm EC21_Series_Mini_PCIe_Hardware_Design 49 / 75 LTE Standard Module Series Table 29: Conducted RF Receiving Sensitivity of EC21-J Mini PCIe Frequency Bands 3GPP (SIMO) Receiving Sensitivity (Typ.) Primary Diversity SIMO 6 LTE-FDD B1 (10 MHz)

-97.5 dBm

-98.7 dBm

-100.2 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-96.5 dBm

-97.1 dBm

-100.5 dBm

-93.3 dBm LTE-FDD B8 (10 MHz)

-98.4 dBm

-99.0 dBm

-101.2 dBm

-93.3 dBm LTE-FDD B18 (10 MHz)

-99.5 dBm

-99.0 dBm

-101.7 dBm

-96.3 dBm LTE-FDD B19 (10 MHz)

-99.2 dBm

-99.0 dBm

-101.4 dBm

-96.3 dBm LTE-FDD B26 (10 MHz)

-99.5 dBm

-99.0 dBm

-101.5 dBm

-93.8 dBm Table 30: Conducted RF Receiving Sensitivity of EC21-KL Mini PCIe Frequency Bands 3GPP (SIMO) Primary Diversity SIMO 6 Receiving Sensitivity (Typ.) LTE-FDD B1 (10 MHz)

-98.0 dBm

-99.5 dBm

-100.5 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-97.0 dBm

-97.5 dBm

-99.5 dBm

-93.3 dBm LTE-FDD B5 (10 MHz)

-98.0 dBm

-99.5 dBm

-100.5 dBm

-94.3 dBm LTE-FDD B7 (10 MHz)

-96.0 dBm

-96.0 dBm

-98.5 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-97.0 dBm

-99.0 dBm

-101.0 dBm

-93.3 dBm Table 31: Conducted RF Receiving Sensitivity of EC21-EU Mini PCIe Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO 6 EGSM900 DCS1800 WCDMA B1

-108.5 dBm

-108.5 dBm

-110 dBm

3GPP (SIMO)

-102.0 dBm

-102.0 dBm

-106.7 dBm EC21_Series_Mini_PCIe_Hardware_Design 50 / 75 LTE Standard Module Series WCDMA B8

-110 dBm

-103.7 dBm LTE-FDD B1 (10 MHz)

-99 dBm

-101.2 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-99.7 dBm

-101.7 dBm

-93.3 dBm LTE-FDD B7 (10 MHz)

-98.5 dBm

-99.7 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-100 dBm

-102.2 dBm

-93.3 dBm LTE-FDD B20 (10 MHz)

-99.5 dBm

-102.2 dBm

-93.3 dBm LTE-FDD B28A (10 MHz)

-100 dBm

-102.2 dBm

-94.8 dBm

-98.5 dBm

-97.8 dBm

-96.7 dBm

-98.7 dBm

-98.7 dBm

-99 dBm Table 32: Conducted RF Receiving Sensitivity of EC21-AUX Mini PCIe Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO 6 GSM850 EGSM900 DCS1800 PCS1900

-109.0 dBm

-109.0 dBm

-109.0 dBm

-109.0 dBm 3GPP (SIMO)

-102.0 dBm

-102.0 dBm

-102.0 dBm

-102.0 dBm WCDMA B1

-110.0 dBm

-109.5 dBm

-112 dBm

-106.7 dBm WCDMA B2

-110.5 dBm

-104.7 dBm WCDMA B4

-110.0 dBm

-110 dBm

-112 dBm

-104.7 dBm WCDMA B5

-111.0 dBm

-112 dBm

-113 dBm

-104.7 dBm WCDMA B8

-111.0 dBm

-112 dBm

-113 dBm

-103.7 dBm LTE-FDD B1 (10 MHz)

-98.0 dBm

-97.7 dBm

-101.2 dBm

-96.3 dBm LTE-FDD B2 (10 MHz)

-98.5 dBm

-94.3 dBm LTE-FDD B3 (10 MHz)

-99.0 dBm

-98.8 dBm

-102.2 dBm

-93.3 dBm LTE-FDD B4 (10 MHz)

-97.7 dBm

-97.6 dBm

-100.2 dBm

-96.3 dBm LTE-FDD B5 (10 MHz)

-98.5 dBm

-98.2 dBm

-101.0 dBm

-94.3 dBm

EC21_Series_Mini_PCIe_Hardware_Design 51 / 75 LTE Standard Module Series LTE-FDD B7 (10 MHz)

-97.7 dBm

-97.7 dBm

-101.2 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-99.0 dBm

-98.5 dBm

-102.2 dBm

-93.3 dBm LTE-FDD B28 (10 MHz)

-98.0 dBm

-98.7 dBm

-101.5 dBm

-94.8 dBm LTE-TDD B40 (10 MHz)

-97.5 dBm

-98.2 dBm

-101.2 dBm

-96.3 dBm Table 33: Conducted RF Receiving Sensitivity of EC21-EUX Mini PCIe Frequency Bands Receiving Sensitivity (Typ.) Primary Diversity SIMO 6 EGSM900 DCS1800

-109.0 dBm

-109.0 dBm WCDMA B1

-110.5 dBm WCDMA B8

-110.5 dBm

3GPP (SIMO)

-102.0 dBm

-102.0 dBm

-106.7 dBm

-103.7 dBm LTE-FDD B1 (10 MHz)

-98.0 dBm

-98.0 dBm

-101.0 dBm

-96.3 dBm LTE-FDD B3 (10 MHz)

-98.5 dBm

-98.5 dBm

-101.0 dBm

-93.3 dBm LTE-FDD B7 (10 MHz)

-97.0 dBm

-96.0 dBm

-99.5 dBm

-94.3 dBm LTE-FDD B8 (10 MHz)

-98.5 dBm

-97.0 dBm

-101.0 dBm

-93.3 dBm LTE-FDD B20 (10 MHz)

-97.5 dBm

-99.0 dBm

-100.5 dBm

-93.3 dBm LTE-FDD B28A (10 MHz)

-98.0 dBm

-98.7 dBm

-101.0 dBm

-94.8 dBm 6.6. ESD The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. You must apply proper ESD handling and packaging procedures throughout the processing, handling and operation of any application that incorporates the module. The following table shows the ESD characteristics of EC21 series Mini PCIe. EC21_Series_Mini_PCIe_Hardware_Design 52 / 75 Table 34: ESD Characteristics of EC21 Series Mini PCIe Tested Interfaces Contact Discharge Air Discharge Unit LTE Standard Module Series Power Supply and GND Antenna Interfaces USB Interface

(U)SIM Interface Others 5 4 4 4 0.5 6.7. Power Consumption 10 8 8 8 1 kV kV kV kV kV The following tables describe the power consumption of EC21 series Mini PCIe series module. Table 35: Power Consumption of EC21-E Mini PCIe Description Conditions AT+CFUN=0 (USB Disconnected) AT+CFUN=0 (USB Suspend) EGSM900 DRX = 2 (USB Disconnected) EGSM900 DRX = 9 (USB Disconnected) WCDMA PF = 64 (USB Disconnected) WCDMA PF = 128 (USB Disconnected) LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 128 (USB Disconnected) EGSM900 DRX = 5 (USB Disconnected) EGSM900 DRX = 5 (USB Active) WCDMA PF = 64 (USB Disconnected) WCDMA PF = 64 (USB Active) Typ. 2.54 2.75 4.46 4.24 3.74 3.23 4.8 3.92 29.5 43.2 29.4 43.1 Unit mA mA mA mA mA mA mA mA mA mA mA mA Sleep state Idle state EC21_Series_Mini_PCIe_Hardware_Design 53 / 75 LTE Standard Module Series LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 64 (USB Active) EGSM900 4DL/1UL @ 33.01 dBm EGSM900 3DL/2UL @ 32.99 dBm EGSM900 2DL/3UL @ 30.75 dBm EGSM900 1DL/4UL @ 29.42 dBm DCS1800 4DL/1UL @ 30.04 dBm DCS1800 3DL/2UL @ 29.99 dBm DCS1800 2DL/3UL @ 29.86 dBm DCS1800 1DL/4UL @ 29.69 dBm GPRS data transfer

(GNSS OFF) EGSM900 4DL/1UL PCL = 8 @ 27.09 dBm 207.7 EGSM900 3DL/2UL PCL = 8 @ 26.98 dBm 342.5 EGSM900 2DL/3UL PCL = 8 @ 26.78 dBm 464.5 EDGE data transfer

(GNSS OFF) EGSM900 1DL/4UL PCL = 8 @ 26.74 dBm 588.9 DCS1800 4DL/1UL PCL = 2 @ 25.91 dBm 199.8 DCS1800 3DL/2UL PCL = 2 @ 25.83 dBm 324 DCS1800 2DL/3UL PCL = 2 @ 25.53 dBm 436.8 DCS1800 1DL/4UL PCL = 2 @ 26.39 dBm 545.5 WCDMA B1 HSDPA @ 22.19 dBm WCDMA B1 HSUPA @ 21.91 dBm WCDMA data transfer

(GNSS OFF) WCDMA B5 HSDPA @ 22.87 dBm WCDMA B5 HSUPA @ 21.76 dBm WCDMA B8 HSDPA @ 22.24 dBm WCDMA B8 HSUPA @ 21.57 dBm LTE-FDD B1 @ 23.68 dBm LTE data transfer

(GNSS OFF) 29.9 43.4 342.1 601.7 661.4 758 245.3 408.2 556.2 995.9 820.1 840.1 876.8 824.5 704.9 667.1 978.2 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Series_Mini_PCIe_Hardware_Design 54 / 75 LTE Standard Module Series Description Conditions Typ. Unit LTE-FDD B3 @ 22.84 dBm LTE-FDD B5 @ 23.36 dBm LTE-FDD B7 @ 22.90 dBm LTE-FDD B8 @ 23.40 dBm LTE-FDD B20 @ 23.44 dBm WCDMA B1 @ 22.91 dBm WCDMA voice call WCDMA B5 @ 23.15 dBm WCDMA B8 @ 23.15 dBm Table 36: Power Consumption of EC21-A Mini PCIe Sleep state WCDMA PF = 128 (USB Disconnected) AT+CFUN=0 (USB Disconnected) WCDMA PF = 64 (USB Disconnected) LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 128 (USB Disconnected) WCDMA PF = 64 (USB Disconnected) WCDMA PF = 64 (USB Connected) LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 64 (USB Connected) WCDMA B2 HSDPA @ 21.59 dBm WCDMA B2 HSUPA @ 22.17 dBm Idle state WCDMA data transfer

(GNSS OFF) WCDMA B4 HSDPA @ 21.47 dBm WCDMA B4 HSUPA @ 21.73 dBm WCDMA B5 HSDPA @ 20.02 dBm WCDMA B5 HSUPA @ 20.18 dBm 1018.6 1025.8 1073.4 882.0 940.2 901.8 904.7 741.2 3.5 5.0 4.4 5.3 4.5 32.0 45.0 32.0 45.0 582.0 675.0 575.0 637.0 686.0 577.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Series_Mini_PCIe_Hardware_Design 55 / 75 LTE Standard Module Series LTE data transfer

(GNSS OFF) LTE-FDD B2 @ 22.93 dBm LTE-FDD B4 @ 22.72 dBm LTE-FDD B12 @ 23.26 dBm WCDMA B2 @ 22.88 dBm WCDMA voice call WCDMA B4 @ 23.21 dBm WCDMA B5 @ 23.13 dBm 926.0 934.0 835.0 610.0 743.0 643.0 3.8 5.3 4.9 30.0 42.0 997.0 724.0 2.8 4.3 3.3 3.5 3.1 4.6 3.9 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Table 37: Power Consumption of EC21-V Mini PCIe Description Conditions Typ. Unit AT+CFUN=0 (USB Disconnected) Sleep state LTE-FDD PF = 64 (USB Disconnected) Idle state LTE-FDD PF = 128 (USB Disconnected) LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 64 (USB Connected) LTE data transfer

(GNSS OFF) LTE-FDD B4 @ 23.59 dBm LTE-FDD B13 @ 24.05 dBm Table 38: Power Consumption of EC21-AU Mini PCIe Description Conditions Typ. Unit Sleep state WCDMA PF = 64 (USB Disconnected) AT+CFUN=0 (USB Disconnected) GSM850 DRX = 2 (USB Disconnected) GSM850 DRX = 9 (USB Disconnected) WCDMA PF = 128 (USB Disconnected) LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 128 (USB Disconnected) EC21_Series_Mini_PCIe_Hardware_Design 56 / 75 Idle state GPRS data transfer

(GNSS OFF) LTE-TDD PF = 64 (USB Disconnected) LTE-TDD PF = 128 (USB Disconnected) GSM850 DRX = 5 (USB Disconnected) GSM850 DRX = 5 (USB Connected) WCDMA PF = 64 (USB Disconnected) WCDMA PF = 64 (USB Connected) LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 64 (USB Connected) LTE-TDD PF = 64 (USB Disconnected) LTE-TDD PF = 64 (USB Connected) GSM850 4DL/1UL @ 32.62 dBm GSM850 3DL/2UL @ 32.52 dBm GSM850 2DL/3UL @ 30.53 dBm GSM850 1DL/4UL @ 29.27 dBm EGSM900 4DL/1UL @ 32.76 dBm EGSM900 3DL/2UL @ 32.80 dBm EGSM900 2DL/3UL @ 30.52 dBm EGSM900 1DL/4UL @ 29.49 dBm DCS1800 4DL/1UL @ 30.05 dBm DCS1800 3DL/2UL @ 30.02 dBm DCS1800 2DL/3UL @ 29.73 dBm DCS1800 1DL/4UL @ 29.62 dBm PCS1900 4DL/1UL @ 29.82 dBm PCS1900 3DL/2UL @ 29.92 dBm PCS1900 2DL/3UL @ 29.76 dBm LTE Standard Module Series 4.7 3.9 24.1 37.4 25.4 38.4 25.4 38.8 25.8 39.0 312.8 530.6 602.5 686.0 344.5 590.8 657.3 752.4 229.1 365.2 501.5 637.5 228.2 366.9 496.2 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Series_Mini_PCIe_Hardware_Design 57 / 75 EDGE data transfer

(GNSS OFF) PCS1900 1DL/4UL @ 29.35 dBm GSM850 4DL/1UL PCL = 8 @ 26.62 dBm GSM850 3DL/2UL PCL = 8 @ 26.56 dBm GSM850 2DL/3UL PCL = 8 @ 26.39 dBm GSM850 1DL/4UL PCL = 8 @ 26.25 dBm EGSM900 4DL/1UL PCL = 8 @ 26.74 dBm EGSM900 3DL/2UL PCL = 8 @ 26.91 dBm EGSM900 2DL/3UL PCL = 8 @ 26.78 dBm EGSM900 1DL/4UL PCL = 8 @ 26.67 dBm DCS1800 4DL/1UL PCL = 2 @ 26.33 dBm DCS1800 3DL/2UL PCL = 2 @ 26.65 dBm DCS1800 2DL/3UL PCL = 2 @ 26.33 dBm DCS1800 1DL/4UL PCL = 2 @ 26.35 dBm PCS1900 4DL/1UL PCL = 2 @ 26.01 dBm PCS1900 3DL/2UL PCL = 2 @ 26.45 dBm PCS1900 2DL/3UL PCL = 2 @ 26.12 dBm PCS1900 1DL/4UL PCL = 2 @ 26.09 dBm WCDMA B1 HSDPA @ 22.30 dBm WCDMA B1 HSUPA @ 21.62 dBm WCDMA B2 HSDPA @ 21.93 dBm LTE Standard Module Series 628.4 191.0 303.0 414.2 537.2 196.3 343.9 449.6 570.8 199.2 306.3 419.8 540.1 186.5 315.3 406.6 524.5 758.3 755.7 792.0 799.1 746.5 741.1 625.1 647.4 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA data transfer

(GNSS OFF) WCDMA B2 HSUPA @ 21.99 dBm WCDMA B5 HSDPA @ 22.44 dBm WCDMA B5 HSUPA @ 22.14 dBm WCDMA B8 HSDPA @ 21.62 dBm WCDMA B8 HSUPA @ 21.65 dBm EC21_Series_Mini_PCIe_Hardware_Design 58 / 75 LTE-FDD B1 @ 23.71 dBm LTE-FDD B2 @ 23.00 dBm LTE-FDD B3 @ 23.34 dBm LTE-FDD B4 @ 23.05 dBm LTE-FDD B5 @ 22.84 dBm LTE-FDD B7 @ 22.77 dBm LTE-FDD B8 @ 23.04 dBm LTE-FDD B28 @ 23.54 dBm LTE-TDD B40 @ 23.79 dBm GSM850 PCL = 5 @ 32.80 dBm EGSM900 PCL = 5 @ 33.16 dBm DCS1800 PCL = 0 @ 29.81 dBm PCS1900 PCL = 0 @ 29.79 dBm WCDMA B1 @ 23.27 dBm WCDMA B2 @ 22.89 dBm WCDMA B5 @ 22.87 dBm WCDMA B8 @ 22.89 dBm LTE data transfer

(GNSS OFF) GSM voice call WCDMA voice call LTE Standard Module Series 1025.4 996.0 950.1 892.1 816.1 1198.1 807.4 932.0 585.2 316.2 348.7 216.8 214.9 823.4 898.7 776.9 685.6 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Table 39: Power Consumption of EC21-J Mini PCIe Description Conditions Typ. Unit AT+CFUN=0 (USB Disconnected) Sleep state LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 128 (USB Disconnected) LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 64 (USB Connected) LTE-FDD B1 @ 22.97 dBm Idle state LTE data transfer

(GNSS OFF) 2.5 4.0 3.3 27.0 38.4 859.7 mA mA mA mA mA mA EC21_Series_Mini_PCIe_Hardware_Design 59 / 75 LTE-FDD B3 @ 22.67 dBm LTE-FDD B8 @ 23.00 dBm LTE-FDD B18 @ 23.54 dBm LTE-FDD B19 @ 23.61 dBm LTE-FDD B26 @ 22.64 dBm LTE Standard Module Series 841.1 752.3 758.6 760.4 741.2 3.5 5.6 4.7 35.0 49.0 972.0 974.0 764.0 959.0 839.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Table 40: Power Consumption of EC21-KL Mini PCIe Description Conditions Typ. Unit AT+CFUN=0 (USB Disconnected) Sleep state LTE-FDD PF = 64 (USB Disconnected) Idle state LTE data transfer

(GNSS OFF) LTE-FDD PF = 128 (USB Disconnected) LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 64 (USB Connected) LTE-FDD B1 @ 22.78 dBm LTE-FDD B3 @ 23.03 dBm LTE-FDD B5 @ 23.03 dBm LTE-FDD B7 @ 22.89 dBm LTE-FDD B8 @ 22.86 dBm Table 41: Power Consumption of EC21-EU Mini PCIe Description Conditions Typ. Unit Sleep state EGSM900 DRX = 9 (USB Disconnected) AT+CFUN=0 (USB Disconnected) EGSM900 DRX = 2 (USB Disconnected) WCDMA PF = 64 (USB Disconnected) WCDMA PF = 128 (USB Disconnected) 3.6 5.3 4.2 5.1 4.5 mA mA mA mA mA EC21_Series_Mini_PCIe_Hardware_Design 60 / 75 LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 128 (USB Disconnected) EGSM900 DRX = 5 (USB Disconnected) EGSM900 DRX = 5 (USB Connected) WCDMA PF = 64 (USB Disconnected) WCDMA PF = 64 (USB Connected) LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 64 (USB Connected) EGSM900 4DL/1UL @ 33.39 dBm EGSM900 3DL/2UL @ 32.47 dBm EGSM900 2DL/3UL @ 29.49 dBm EGSM900 1DL/4UL @ 28.05 dBm DCS1800 4DL/1UL @ 31.44 dBm DCS1800 3DL/2UL @ 30.38 dBm DCS1800 2DL/3UL @ 28.27 dBm DCS1800 1DL/4UL @ 27.01 dBm EGSM900 4DL/1UL PCL = 8 @ 26.39 dBm EGSM900 3DL/2UL PCL = 8 @ 25.39 dBm EGSM900 2DL/3UL PCL = 8 @ 23.34 dBm EGSM900 1DL/4UL PCL = 8 @ 22.26 dBm DCS1800 4DL/1UL PCL = 2 @ 26.49 dBm DCS1800 3DL/2UL PCL = 2 @ 25.23 dBm DCS1800 2DL/3UL PCL = 2 @ 22.96 dBm DCS1800 1DL/4UL PCL = 2 @ 22.08 dBm Idle state GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) WCDMA data transfer WCDMA B1 HSDPA @ 23.00 dBm LTE Standard Module Series 5.6 4.8 24.7 38.0 25.3 38.0 26.0 37.0 389.3 593.6 611.6 682.1 260.9 391.2 464.2 550.5 198.6 303.9 372.8 451.4 190.5 300.4 394.8 496.9 754.6 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Series_Mini_PCIe_Hardware_Design 61 / 75 LTE Standard Module Series LTE data transfer

(GNSS OFF) LTE-FDD B7 @ 22.21 dBm 1036.0 WCDMA B1 HSUPA @ 22.57 dBm WCDMA B8 HSDPA @ 22.97 dBm WCDMA B8 HSUPA @ 22.52 dBm LTE-FDD B1 @ 22.09 dBm LTE-FDD B3 @ 22.42 dBm LTE-FDD B8 @ 23.37 dBm LTE-FDD B20 @ 22.72 dBm LTE-FDD B28A @ 21.72 dBm GSM voice call EGSM900 PCL = 5 @ 33.53 dBm DCS1800 PCL = 0 @ 31.20 dBm WCDMA voice call WCDMA B1 @ 23.45 dBm WCDMA B8 @ 23.51 dBm Table 42: Power Consumption of EC21-AUX Mini PCIe Description Conditions Sleep state WCDMA PF = 128 (USB Disconnected) AT+CFUN=0 (USB Disconnected) GSM850 DRX = 2 (USB Disconnected) GSM850 DRX = 9 (USB Disconnected) WCDMA PF = 64 (USB Disconnected) LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 128 (USB Disconnected) LTE-TDD PF = 64 (USB Disconnected) LTE-TDD PF = 128 (USB Disconnected) 662.3 749.9 662.5 875.2 938.3 897.5 913.0 898.8 385.0 256.0 794.6 792.0 Typ. 1.79 3.06 2.36 3.70 3.28 4.41 3.59 4.45 3.68 mA mA mA mA mA mA mA mA mA mA mA mA mA Unit mA mA mA mA mA mA mA mA mA EC21_Series_Mini_PCIe_Hardware_Design 62 / 75 Idle state GPRS data transfer

(GNSS OFF) GSM850 DRX = 5 (USB Disconnected) GSM850 DRX = 5 (USB Connected) WCDMA PF = 64 (USB Disconnected) WCDMA PF = 64 (USB Connected) LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 64 (USB Connected) LTE-TDD PF = 64 (USB Disconnected) LTE-TDD PF = 64 (USB Connected) GSM850 4DL/1UL @ 32.50 dBm GSM850 3DL/2UL @ 31.69 dBm GSM850 2DL/3UL @ 29.48 dBm GSM850 1DL/4UL @ 28.35 dBm EGSM900 4DL/1UL @ 33.50 dBm EGSM900 3DL/2UL @ 32.04 dBm EGSM900 2DL/3UL @ 29.52 dBm EGSM900 1DL/4UL @ 28.45 dBm DCS1800 4DL/1UL @ 29.72 dBm DCS1800 3DL/2UL @ 28.82 dBm DCS1800 2DL/3UL @ 26.79 dBm DCS1800 1DL/4UL @ 25.71 dBm PCS1900 4DL/1UL @ 29.44 dBm PCS1900 3DL/2UL @ 28.60 dBm PCS1900 2DL/3UL @ 26.46 dBm PCS1900 1DL/4UL @ 25.36 dBm LTE Standard Module Series 22.4 42.8 23.1 43.4 30.7 43.5 31.2 43.8 335.0 537.0 605.0 701.0 386.0 563.0 606.0 703.0 194.0 291.0 361.0 450.0 202.0 306.0 370.0 456.0 223.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EDGE data transfer

(GNSS OFF) GSM850 4DL/1UL PCL = 8 @ 27.08 dBm EC21_Series_Mini_PCIe_Hardware_Design 63 / 75 LTE Standard Module Series GSM850 3DL/2UL PCL = 8 @ 25.80 dBm GSM850 2DL/3UL PCL = 8 @ 23.80 dBm GSM850 1DL/4UL PCL = 8 @ 22.60 dBm EGSM900 4DL/1UL PCL = 8 @ 27.42 dBm EGSM900 3DL/2UL PCL = 8 @ 26.23 dBm EGSM900 2DL/3UL PCL = 8 @ 24.10 dBm EGSM900 1DL/4UL PCL = 8 @ 22.80 dBm DCS1800 4DL/1UL PCL = 2 @ 26.50 dBm DCS1800 3DL/2UL PCL = 2 @ 25.50 dBm DCS1800 2DL/3UL PCL = 2 @ 23.60 dBm DCS1800 1DL/4UL PCL = 2 @ 22.37 dBm PCS1900 4DL/1UL PCL = 2 @ 26.26 dBm PCS1900 3DL/2UL PCL = 2 @ 25.30 dBm PCS1900 2DL/3UL PCL = 2 @ 23.10 dBm PCS1900 1DL/4UL PCL = 2 @ 21.97 dBm WCDMA B1 HSDPA @ 21.57 dBm WCDMA B1 HSUPA @ 21.79 dBm WCDMA B2 HSDPA @ 22.00 dBm WCDMA B2 HSUPA @ 21.98 dBm WCDMA B5 HSDPA @ 22.90 dBm WCDMA B5 HSUPA @ 22.66 dBm WCDMA B8 HSDPA @ 21.59 dBm WCDMA B8 HSUPA @ 21.37 dBm 370.0 492.0 623.0 227.0 371.0 492.0 626.0 171.0 280.0 387.0 504.0 170.0 280.0 389.0 508.0 650.0 667.0 706.0 715.0 617.0 633.0 624.0 654.0 938.0 953.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) LTE-FDD B1 @ 23.36 dBm LTE-FDD B2 @ 23.18 dBm EC21_Series_Mini_PCIe_Hardware_Design 64 / 75 LTE-FDD B3 @ 23.13 dBm LTE-FDD B4 @ 23.25 dBm LTE-FDD B5@ 23.06 dBm LTE-FDD B7 @ 23.17 dBm LTE-FDD B8 @ 22.89 dBm LTE-FDD B28 @ 22.55 dBm LTE-TDD B40 @ 23.27 dBm GSM850 PCL = 5 @ 32.40 dBm EGSM900 PCL = 5 @ 33.58 dBm DCS1800 PCL = 0 @ 29.45 dBm PCS1900 PCL = 0 @ 29.56 dBm WCDMA B1 @ 22.15 dBm WCDMA B2 @ 22.77 dBm WCDMA B5 @ 23.16 dBm WCDMA B8 @ 22.62 dBm GSM voice call WCDMA voice call Table 43: Power Consumption of EC21-EUX Mini PCIe Description Conditions Typ. Unit Sleep state EGSM900 CH62 DRX = 5 (USB Disconnected) AT+CFUN=0 (USB Disconnected) AT+CFUN=0 (USB Suspend) EGSM900 CH62 DRX = 2 (USB Disconnected) EGSM900 CH62 DRX = 9 (USB Disconnected) DCS1800 698 DRX = 2 (USB Disconnected) DCS1800 698 DRX = 5 (USB Disconnected) EC21_Series_Mini_PCIe_Hardware_Design 65 / 75 LTE Standard Module Series 814.0 778.0 697.0 886.0 852.0 939.0. 421.0 322.0 379.0 182.0 195.0 714.0 780.0 658.0 698.0 3.1 3.3 4.3 3.8 3.5 4.4 3.8 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE Standard Module Series DCS1800 698 DRX = 9 (USB Disconnected) WCDMA PF = 64 (USB Disconnected) WCDMA PF = 128 (USB Disconnected) FDD-LTE PF = 64 (USB Disconnected) FDD-LTE PF = 128 (USB Disconnected) EGSM900 CH62 DRX = 5 (USB Disconnected) EGSM900 CH62 DRX = 5 (USB Active) WCDMA PF = 64 (USB Disconnected) WCDMA PF = 64 (USB Active) LTE-FDD PF = 64 (USB Disconnected) LTE-FDD PF = 64 (USB Active) EGSM900 4DL/1UL @ 32.3 dBm EGSM900 3DL/2UL @ 31.6 dBm EGSM900 2DL/3UL @ 29.7 dBm EGSM900 1DL/4UL @ 28.8 dBm DCS1800 4DL/1UL @ 29.7 dBm DCS1800 3DL/2UL @ 29.1 dBm DCS1800 2DL/3UL @ 27.3 dBm DCS1800 1DL/4UL @ 26.2 dBm EGSM900 4DL/1UL PCL = 8 @ 25.6 dBm EGSM900 3DL/2UL PCL = 8 @ 25.2 dBm EGSM900 2DL/3UL PCL = 8 @ 23.4 dBm EGSM900 1DL/4UL PCL = 8 @ 22.6 dBm DCS1800 4DL/1UL PCL = 2 @ 25.6 dBm DCS1800 3DL/2UL PCL = 2 @ 25.6 dBm Idle state GPRS data transfer

(GNSS OFF) EDGE data transfer

(GNSS OFF) 3.5 4.4 3.9 4.5 3.8 21.9 25.4 22.2 35.7 22.6 36.0 292.2 488.9 576.5 682.8 191.6 318.2 393.0 476.6 203.3 356.3 488.0 620.2 169.6 287.3 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EC21_Series_Mini_PCIe_Hardware_Design 66 / 75 LTE Standard Module Series WCDMA data transfer

(GNSS OFF) LTE data transfer

(GNSS OFF) DCS1800 2DL/3UL PCL = 2 @ 22.9 dBm DCS1800 1DL/4UL PCL = 2 @ 22.4 dBm WCDMA B1 HSDPA @ 22.8 dBm WCDMA B1 HSUPA @ 22.6 dBm WCDMA B8 HSDPA @ 22.1 dBm WCDMA B8 HSUPA @ 21.8 dBm LTE-FDD B1 @ 23.2 dBm LTE-FDD B3 @ 23.0 dBm LTE-FDD B7 @ 23.5 dBm LTE-FDD B8 @ 23.2 dBm LTE-FDD B20 @ 22.9 dBm LTE-TDD B28A @ 23.0 dBm GSM voice call EGSM900 PCL = 5 @ 32.2 dBm DCS1800 PCL = 0 @ 29.7 dBm WCDMA voice call WCDMA B1 @ 22.8 dBm WCDMA B8 @ 22.6 dBm Table 44: GNSS Power Consumption of EC21 Series Mini PCIe Module Description Conditions Searching

(AT+CFUN=0) Tracking

(AT+CFUN=0) Cold start @ Passive antenna Lost state @ Passive antenna Instrument environment Open sky @ Passive antenna Open sky @ Active antenna 393.5 506.5 636.0 691.0 633.2 667.8 796.7 875.1 1026.7 843.2 878.1 1023.4 308.2 207.0 641.4 657.6 Typ. 75.0 74.0 44.0 53.0 58.0 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Unit mA mA mA mA mA EC21_Series_Mini_PCIe_Hardware_Design 67 / 75 LTE Standard Module Series 6.8. Thermal Dissipation In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:

On customers PCB design, please keep placement of the PCI Express Mini Card away from Do not place components on the PCB area where the module is mounted, in order to facilitate Do not apply solder mask on the PCB area where the module is mounted, so as to ensure better heating sources. adding of heatsink. heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Add a heatsink on the top of the module and the heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module. Add a thermal pad with appropriate thickness at the bottom of the module to conduct the heat to PCB. The following figure shows the referenced heatsink design. Figure 18: Referenced Heatsink Design NOTE 1. The module offers the best performance when the internal BB chip stays below 105 C. When the EC21_Series_Mini_PCIe_Hardware_Design 68 / 75 LTE Standard Module Series maximum temperature of the BB chip reaches or exceeds 105 C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115 C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115 C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105 C. Customers can execute AT+QTEMP and get the maximum BB chip temperature from the first returned value. 2. For more detailed guidelines on thermal design, see document [4]. Please follow the principles below in module application. 6.9. Notification 6.9.1. Coating 6.9.2. Cleaning If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. EC21_Series_Mini_PCIe_Hardware_Design 69 / 75 LTE Standard Module Series 7 Mechanical Information 7.1. General Description This chapter mainly describes mechanical dimensions as well as packaging specification of EC21 series Mini PCIe module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 7.2. Mechanical Dimensions 30.000.15 24.200.20 3x3.000.10 5.980.10 2x2.600.1 0.610.05 2.350.10 8.250.10 5.450.10 6.380.10 6.350.10 34.300.20 48.050.20 50.950.15 4.900.20 1.400.10 9.900.10 4.000.10 Pin1 Pin51 Top View 10.350.10 7.260.10 1.000.10 Side View Figure 19: Mechanical Dimensions of EC21 Series Mini PCIe EC21_Series_Mini_PCIe_Hardware_Design 70 / 75 LTE Standard Module Series NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. 7.3. Standard Dimensions of Mini PCI Express The following figure shows the standard dimensions of Mini PCI Express. See PCI Express Mini Card Electromechanical Specification Revision 1.2 for Detail A and Detail B. Figure 20: Standard Dimensions of Mini PCI Express EC21_Series_Mini_PCIe_Hardware_Design 71 / 75 EC21 series Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives and standards listed in the PCI Express Mini Card Electromechanical Specification Revision 1.2. The following figure takes the Molex 679105700 as an example. LTE Standard Module Series Figure 21: Dimensions of the Mini PCI Express Connector (Molex 679105700) 7.4. Packaging Specifications The module adopts blister tray packaging and details are as follow:

7.4.1. Blister Tray Dimension details are as follow:

EC21_Series_Mini_PCIe_Hardware_Design 72 / 75 LTE Standard Module Series Figure 22: Blister Tray Dimension Drawing EC21_Series_Mini_PCIe_Hardware_Design 73 / 75 7.4.2. Packaging Process LTE Standard Module Series Each blister tray packs 10 modules. Stack 10 blister trays with modules together, and put 1 empty blister tray on the top. Packing 11 blister trays together and then put blister trays into conductive bag, seal and pack the conductive bag. Put the seal-packed blister trays into the mini box. 1 mini box can pack 100 modules. Put 4 packaged mini boxes into 1 cartoon box and then seal it. 1 cartoon box can pack 400 modules. Figure 23: Packaging Process EC21_Series_Mini_PCIe_Hardware_Design 74 / 75 LTE Standard Module Series 8 Appendix References Table 45: Related Documents Document Name

[1] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_AT_Commands_Manual

[2] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_QCFG_AT_Commands_Manual

[3] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_GNSS_Application_Note

[4] Quectel_LTE_Module_Thermal_Design_Guide Table 46: Terms and Abbreviations Abbreviation Description AMR bps CHAP CMUX CS CTS DCE DCS DFOTA DL DTE Adaptive Multi-rate Bits Per Second Challenge Handshake Authentication Protocol Connection Multiplexing Coding Scheme Clear to Send Data Communications Equipment Digital Communication System Delta Firmware Upgrade Over the Air Down Link Data Terminal Equipment DC-HSPA+

Dual-carrier High Speed Packet Access EC21_Series_Mini_PCIe_Hardware_Design 75 / 75 LTE Standard Module Series FTPS FTP over SSL GLONASS GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System DTR EDGE EFR EGSM EMI ESD ESR FDD FR GMSK GNSS GPS GSM HR HSPA HSDPA HSUPA HTTP HTTPS kbps LED LTE Mbps Data Terminal Ready Enhanced Data Rates for GSM Evolution Enhanced Full Rate Enhanced GSM Electro Magnetic Interference Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplexing Full Rate Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Downlink Packet Access High Speed Uplink Packet Access Hypertext Transfer Protocol Hypertext Transfer Protocol Secure Kilo Bits Per Second Light Emitting Diode Long-Term Evolution Million Bits Per Second EC21_Series_Mini_PCIe_Hardware_Design 76 / 75 LTE Standard Module Series MCS MCU ME MIMO MMS MO MQTT MT NMEA PAP PCM PDA PDU PIFA PING POS PPP QAM QPSK QZSS RF RHCP RoHS RTS Rx Modulation and Coding Scheme Micro Control Unit Mobile Equipment Multiple-Input Multiple-Output Multimedia Messaging Service Mobile Originated Message Queuing Telemetry Transport Mobile Terminated National Marine Electronics Association Password Authentication Protocol Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Planar Inverted F Antenna Packet Internet Groper Point of Sale Point-to-Point Protocol Quadrature Amplitude Modulation Quadrature Phase Shift Keying Quasi-Zenith Satellite System Radio Frequency Right Hand Circularly Polarized Restriction of Hazardous Substances Ready To Send Receive EC21_Series_Mini_PCIe_Hardware_Design 77 / 75 LTE Standard Module Series SMTPS Simple Mail Transfer Protocol Secure TD-SCDMA Time Division-Synchronous Code Division Multiple Access Single Input Multiple Output Short Message Service Simple Mail Transfer Protocol Transmission Control Protocol Time Division Duplexing Time Division Multiple Access Transmitting Direction Transient Voltage Suppressor Uplink Unsolicited Result Code Universal Serial Bus Universal Asynchronous Receiver & Transmitter

(Universal) Subscriber Identification Module Voltage Standing Wave Ratio Wideband Code Division Multiple Access Wireless Local Area Network SIMO SMS SMTP TCP TDD TDMA TX TVS UART UL URC USB

(U)SIM VSWR WCDMA WLAN EC21_Series_Mini_PCIe_Hardware_Design 78 / 75

 

 

 

 

 

 

 

 

 

 

QWEecret EC21-ADL Q1-A8744 FA EC21ADLFA-512-STD FCC ID:XMR2021EC21ADL IC:10224A-2021EC21ADL SN:XXXXXXXXXXXXKXX IMEI: XXXXXXXXXXXXXXX era. \8) cron

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Quectel Wireless Solutions Company Limited Declaration of the Modular Approval Applicant / Grantee FCC ID:

Model:

Quectel Wireless Solutions Company Limited XMR2021EC21ADL EC21-ADL, EC21-ADL MINIPCIE The single module transmitter has been evaluated then tested meeting the requirements under Part 15C Section 212 as below:

Modular approval requirement EUT Condition

(a) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. The radio elements of the modular transmitter have their own shielding. Com ply YES

(b) The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation. The modular has buffered data inputs, it is integrated in chip. Please see schematic.pdf YES

(c)The modular transmitter must have its own powersupply regulation. All power lines derived from the host device are regulated before energizing other circuits internal to the EC21-ADL, EC21-ADL MINIPCIE. Please see schematic.pdf YES Quectel Wireless Solutions Company Limited

(d) The modular transmitter must comply with the antenna and transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section.

(e)The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see Section 15.31(i))mustnotbeinsideanotherdeviceduringtesting.

(f)The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number.

(g) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any suchrequirements. A copy of these instructions must be included in the application for equipmentauthorizationrequirements,whicharebasedonthei ntendeduse/configurations. A permanently attached antenna or unique antenna connector is not a requirement for licensed modules. YES The EC21-ADL, EC21-ADL MINIPCIEwas tested in a standalone configuration via a PCMCIA extender. Please see spurious setup YES The label position of EC21-ADL, EC21-

ADL MINIPCIEis clearly indicated. If the FCC ID of the module cannot be seen when it is installed, then the host label must include the text: Contains FCC ID:

XMR2021EC21ADL. Please see the label.pdf The EC21-ADL, EC21-ADL MINIPCIE is compliant with all applicable FCC rules. Detail instructions are given in the User Manual. YES YES

(h)The modular transmitter must comply with any applicable RF exposure requirements in its final The EC21-ADL, EC21-ADL MINIPCIE is approved to comply with the applicable RF YES Quectel Wireless Solutions Company Limited configuration. Dated By:

exposure requirement, please see the MPE evaluation with 20cm as the distance restriction. 2022/01/07 Jean Hu Signature Printed Title: Project Manager

 

 

Quectel Wireless Solutions Co., Ltd POWER OF ATTORNEY DATE: January 6, 2022 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/Jinnan Han on our behalf, to apply to FCC on our equipment for FCC ID:

XMR2021EC21ADL. Any and all acts carried out by TA Technology (Shanghai) Co., Ltd. / Jinnan Han on our behalf shall have the same effect as acts of our own. Sincerely, Signature:

Print name:

Jean Hu Company: Quectel Wireless Solutions Co., Ltd

 

 

Quectel Wireless Solutions Co., Ltd Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD21046 Subject; Request for Long Term Confidentiality FCC ID: XMR2021EC21ADL To Whom It May Concern, Pursuant to the provisions of the Commissions rules Title 47 Sections 0.457 and 0.459, we are requesting the Commission to withhold the following attachment(s) as confidential documents from public disclosure indefinitely. These documents contain detailed system and equipment descriptions and are considered as proprietary information in operation of the equipment. The public disclosure of these documents might be harmful to our company and would give competitors an unfair advantage in the market. Schematic Diagram Block Diagram Parts List Operational Description Tune up procedure It is our understanding that all measurement test reports, FCC ID label format and correspondence during the certification review process cannot be granted as confidential documents and this information will be available for public review once the grant of equipment authorization is issued. Signature :

Print name:

Jean Hu Company: Quectel Wireless Solutions Co., Ltd