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EG915U Series Hardware Design LTE Standard Module Series Version: 1.0 Date: 2022-01-05 Status: Released LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:
http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. EG915U_Series_Hardware_Design 1 / 90 LTE Standard Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties
(third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved. EG915U_Series_Hardware_Design 2 / 90 LTE Standard Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. EG915U_Series_Hardware_Design 3 / 90 LTE Standard Module Series About the Document Revision History Version Date Author Description
1.0 2021-12-20 2022-01-05 Len CHEN/ Manimo YANG/
Ailsa WANG/Yunsheng LI Len CHEN/Manimo YANG/
Ailsa WANG/Yunsheng LI Creation of the document First official release EG915U_Series_Hardware_Design 4 / 90 LTE Standard Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents ....................................................................................................................................................... 5 Table Index ................................................................................................................................................... 7 Figure Index ................................................................................................................................................. 9 1 Introduction ........................................................................................................................................ 11 Special Mark ............................................................................................................................ 11 1.1. 2 Product Overview .............................................................................................................................. 12 Frequency Bands and Functions ............................................................................................ 12 Key Features ........................................................................................................................... 13 Functional Diagram ................................................................................................................. 15 Pin Assignment ........................................................................................................................ 17 Pin Description ........................................................................................................................ 18 EVB ......................................................................................................................................... 26 2.1. 2.2. 2.3. 2.4. 2.5. 2.6. 3.3. 3 Operating Characteristics ................................................................................................................. 27 3.1. Operating Modes ..................................................................................................................... 27 Sleep Mode ............................................................................................................................. 27 3.2. 3.2.1 UART Application Scenario ............................................................................................ 28 3.2.2. USB Application Scenario .............................................................................................. 29 USB Application with USB Remote Wakeup Function .................................... 29 3.2.2.1. USB Application with USB Suspend/Resume and MAIN_RI Function ........... 29 3.2.2.2. USB Application without USB Suspend Function ........................................... 30 3.2.2.3. Airplane Mode ......................................................................................................................... 31 3.3.1. Hardware ........................................................................................................................ 31 3.3.2. Software ......................................................................................................................... 32 Power Supply .......................................................................................................................... 32 3.4.1. Power Supply Pins ......................................................................................................... 32 3.4.2. Reference Design for Power Supply .............................................................................. 33 3.4.3. Voltage Stability Requirements ...................................................................................... 33 Turn On ................................................................................................................................... 35 3.5.1. Turn On with PWPKEY .................................................................................................. 35 Turn Off .................................................................................................................................... 36 3.6.1. Turn Off with PWPKEY .................................................................................................. 37 3.6.2. Turn Off with AT Command ............................................................................................ 37 Reset ....................................................................................................................................... 38 3.6. 3.5. 3.4. 3.7. 4.1. 4 Application Interfaces ....................................................................................................................... 40 Analog Audio Interfaces .......................................................................................................... 40 4.1.1. Audio Interfaces Design Considerations........................................................................ 40 4.1.2. Microphone Interface Design ......................................................................................... 41 EG915U_Series_Hardware_Design 5 / 90 LTE Standard Module Series 4.2. 4.3. 4.4. 4.5. 4.6. 4.7. 4.8. 4.9. 4.10. 4.1.3. Receiver Interface Design .............................................................................................. 41 USB Interface .......................................................................................................................... 42 USB_BOOT Interface .............................................................................................................. 44
(U)SIM Interfaces .................................................................................................................... 45 I2C and PCM Interfaces .......................................................................................................... 47 UART Interfaces ...................................................................................................................... 48 ADC Interfaces ........................................................................................................................ 51 SPI Interface ............................................................................................................................ 52 PSM Interface* ........................................................................................................................ 52 Indication Signals .................................................................................................................... 53 NET_STATUS ......................................................................................................... 53 STATUS .................................................................................................................. 54 MAIN_RI.................................................................................................................. 55 4.10.1. 4.10.2. 4.10.3. 5 Antenna Interfaces ............................................................................................................................. 56 5.1. Main Antenna and Bluetooth/Wi-Fi Scan Antenna Interfaces ................................................. 56 5.1.1. Pin Definition .................................................................................................................. 56 5.1.2. Operating Frequency ..................................................................................................... 56 5.1.3. Reference Design of Antenna Interfaces ....................................................................... 58 5.1.4. RF Routing Guidelines ................................................................................................... 59 Antenna Installation ................................................................................................................. 61 5.2.1. Antenna Design Requirement ........................................................................................ 61 5.2.2. RF Connector Recommendation ................................................................................... 61 5.2. 6 Reliability, Radio, and Electrical Characteristics ........................................................................... 64 6.1. Absolute Maximum Ratings .................................................................................................... 64 6.2. Power Supply Ratings ............................................................................................................. 64 6.3. Power Consumption ................................................................................................................ 65 6.4. Tx Power ................................................................................................................................. 73 6.5. Rx Sensitivity ........................................................................................................................... 74 ESD ......................................................................................................................................... 76 6.6. 6.7. Operating and Storage Temperatures ..................................................................................... 76 7 Mechanical Information ..................................................................................................................... 77 7.1. Mechanical Dimensions .......................................................................................................... 77 Recommended Footprint ......................................................................................................... 79 7.2 Top and Bottom Views............................................................................................................. 80 7.3 8.1 8.2 8.3 8 Storage, Manufacturing, and Packaging ......................................................................................... 81 Storage Conditions .................................................................................................................. 81 Manufacturing and Soldering .................................................................................................. 82 Packaging Specifications ........................................................................................................ 84 8.1.1. Carrier Tape .................................................................................................................... 84 8.1.2. Plastic Reel .................................................................................................................... 85 8.1.3. Packaging Process ........................................................................................................ 85 9 Appendix References ........................................................................................................................ 87 EG915U_Series_Hardware_Design 6 / 90 LTE Standard Module Series Table Index Table 1: Special Mark ..................................................................................................................................11 Table 2: Brief Introduction of the Module ................................................................................................... 12 Table 3: Frequency Bands ......................................................................................................................... 12 Table 4: Key Features ................................................................................................................................ 13 Table 5: I/O Parameters Definition ............................................................................................................. 18 Table 6: Pin Description ............................................................................................................................. 18 Table 7: Overview of Operating Modes ...................................................................................................... 27 Table 8: Pin Definition of Power Supply ..................................................................................................... 32 Table 9: Pin Definition of PWRKEY ............................................................................................................ 35 Table 10: Pin Description of RESET_N ...................................................................................................... 38 Table 11: Pin Definition of Analog Audio Interfaces ................................................................................... 40 Table 12: Functions of USB Interface ........................................................................................................ 42 Table 13: Pin Definition of USB Interface ................................................................................................... 43 Table 14: Pin Definition of USB_BOOT Interface ...................................................................................... 44 Table 15: Pin Definition of (U)SIM Interfaces ............................................................................................. 45 Table 16: Pin Definition of I2C and PCM Interfaces .................................................................................. 47 Table 17: Pin Definition of Main UART Interface ....................................................................................... 49 Table 18: Pin Definition of Debug UART Interface ..................................................................................... 49 Table 19: Auxiliary UART Interface ............................................................................................................ 49 Table 20: Pin Definition of ADC Interfaces ................................................................................................. 51 Table 21: Characteristics of ADC Interfaces .............................................................................................. 51 Table 22: Pin Definition of SPI Interface .................................................................................................... 52 Table 23: Pin Definition of PSM Interface .................................................................................................. 53 Table 24: Pin Definition of Indication Signals ............................................................................................. 53 Table 25: Pin Definition of Network Connection Status/Activity Indication ................................................ 53 Table 26: Working States of Network Connection Status/Activity Indication ............................................. 53 Table 27: Pin Definition of STATUS ............................................................................................................ 54 Table 28: Behaviors of MAIN_RI ................................................................................................................ 55 Table 29: Pin Definition of RF Antennas .................................................................................................... 56 Table 30: Operating Frequency of EG915U-CN ........................................................................................ 56 Table 31: Operating Frequency of EG915U-EU ........................................................................................ 57 Table 32: Operating Frequency of EG915U-LA ......................................................................................... 57 Table 33: Requirements for Antenna Design ............................................................................................. 61 Table 34: Absolute Maximum Ratings ........................................................................................................ 64 Table 35: Power Supply Ratings ................................................................................................................ 64 Table 36: EG915U-CN Current Consumption ............................................................................................ 65 Table 37: EG915U-EU Current Consumption ............................................................................................ 67 Table 38: EG915U-LA Current Consumption ............................................................................................. 70 Table 39: EG915U-CN RF Output Power .................................................................................................. 73 Table 40: EG915U-EU RF Output Power................................................................................................... 73 Table 41: EG915U-LA RF Output Power ................................................................................................... 73 EG915U_Series_Hardware_Design 7 / 90 LTE Standard Module Series Table 42: EG915U-CN Conducted RF Receiving Sensitivity..................................................................... 74 Table 43: EG915U-EU Conducted RF Receiving Sensitivity ..................................................................... 74 Table 44: EG915U-LA Conducted RF Receiving Sensitivity...................................................................... 75 Table 45: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity) ............................... 76 Table 46: Operating and Storage Temperatures ........................................................................................ 76 Table 47: Recommended Thermal Profile Parameters .............................................................................. 83 Table 48: Carrier Tape Dimension Table (Unit: mm) .................................................................................. 84 Table 49: Plastic Reel Dimension Table (Unit: mm) ................................................................................... 85 Table 50: Related Documents .................................................................................................................... 87 Table 51: Terms and Abbreviations ............................................................................................................ 87 EG915U_Series_Hardware_Design 8 / 90 LTE Standard Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 16 Figure 2: Pin Assignment (Top View) ......................................................................................................... 17 Figure 3: Sleep Mode Application via UART .............................................................................................. 28 Figure 4: Sleep Mode Application with USB Remote Wakeup .................................................................. 29 Figure 5: Sleep Mode Application with MAIN_RI ....................................................................................... 30 Figure 6: Sleep Mode Application without Suspend Function ................................................................... 31 Figure 7: Reference Design of Power Supply ............................................................................................ 33 Figure 8: Power Supply Limits during Burst Transmission ........................................................................ 34 Figure 9: Power Supply .............................................................................................................................. 34 Figure 10: Turning on the Module Using Driving Circuit ............................................................................ 35 Figure 11: Turning on the Module Using Button ........................................................................................ 35 Figure 12: Power-up Timing ....................................................................................................................... 36 Figure 13: Timing of Turning off the Module .............................................................................................. 37 Figure 14: Reference Circuit of RESET_N by Using Driving Circuit ......................................................... 38 Figure 15: Reference Circuit of RESET_N by Using Button...................................................................... 38 Figure 16: Timing of Resetting the Module ................................................................................................ 39 Figure 17: Reference Design for Microphone Interface ............................................................................. 41 Figure 18: Reference Design for Receiver Interface ................................................................................. 42 Figure 19: Reference Circuit of USB Application ....................................................................................... 43 Figure 20: Reference Circuit of USB_BOOT Interface .............................................................................. 44 Figure 21: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector ......................... 46 Figure 22: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector ........................... 46 Figure 23: Reference Circuit of I2C and PCM Application with Audio Codec ........................................... 48 Figure 24: Reference Circuit with Translator Chip ..................................................................................... 50 Figure 25: Reference Circuit with Transistor Circuit .................................................................................. 50 Figure 26: Reference Circuit of Network Status Indication ........................................................................ 54 Figure 27: Reference Circuit of STATUS ................................................................................................... 55 Figure 28: Reference Circuit of RF Antennas ............................................................................................ 59 Figure 29: Microstrip Design on a 2-layer PCB ......................................................................................... 59 Figure 30: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 60 Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 60 Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 60 Figure 33: Dimensions of U.FL-R-SMT Connector (Unit: mm) .................................................................. 62 Figure 34: Mechanicals of U.FL-LP Connectors ........................................................................................ 62 Figure 35: Space Factor of Mated Connector (Unit: mm) .......................................................................... 63 Figure 36: Module Top and Side Dimensions (Unit: mm) .......................................................................... 77 Figure 37: Module Bottom Dimensions ...................................................................................................... 78 Figure 38: Recommended Footprint (Top View) ........................................................................................ 79 Figure 39: Top and Bottom Views .............................................................................................................. 80 Figure 40: Recommended Reflow Soldering Thermal Profile ................................................................... 82 Figure 41: Carrier Tape Dimension Drawing .............................................................................................. 84 EG915U_Series_Hardware_Design 9 / 90 LTE Standard Module Series Figure 42: Plastic Reel Dimension Drawing .............................................................................................. 85 Figure 43: Packaging Process ................................................................................................................... 86 EG915U_Series_Hardware_Design 10 / 90 LTE Standard Module Series 1 Introduction This document defines the EG915U series module and describes its air interfaces and hardware interfaces which relate to customers applications. It can help customers quickly understand interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, customers can use this module to design and to set up mobile applications easily. 1.1. Special Mark Table 1: Special Mark Mark Definition
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of such model is currently unavailable. EG915U_Series_Hardware_Design 11 / 90 LTE Standard Module Series 2 Product Overview EG915U series module is an LTE-FDD, LTE-TDD, and GSM wireless communication module, which provides data connectivity on LTE-FDD, LTE-TDD, and GPRS networks. It also provides voice functionality, Bluetooth and Wi-Fi Scan 1 to meet your specific application demands. Related information and details are listed in the table below:
Table 2: Brief Introduction of the Module Categories Packaging and Number of Pins LGA; 126-pin Dimensions Weight
(23.6 0.2) mm (19.9 0.2) mm (2.4 0.2) mm 2.5 0.2 g Wireless Network Functions LTE/GSM/Bluetooth/Wi-Fi Scan 1 Variants EG915U-CN 2; EG915U-EU; EG915U-LA 2.1. Frequency Bands and Functions Table 3: Frequency Bands Wireless Network Type EG915U-CN EG915U-EU EG915U-LA LTE-FDD B1/B3/B5/B8 B1/B3/B5/B7/B8/B20/
B28 B2/B3/B4/B5/B7/B8/B28
/B66 LTE-TDD GSM B34/B38/B39/B40/
B41
900/1800 MHz 850/900/1800/1900 MHz 850/900/1800/1900 MHz 1 EG915U series support Bluetooth and Wi-Fi Scan functions. Due to the shared antenna interface, the two functions cannot be used simultaneously. Bluetooth and Wi-Fi Scan functions are optional (both supported or not), please contact Quectel Technical Support for details. 2 Only EG915U-CN provides LTE-TDD, please consult Quectel Technical Support for details. EG915U_Series_Hardware_Design 12 / 90 LTE Standard Module Series Bluetooth and Wi-Fi Scan 1 2.4 GHz 2.4 GHz 2.4 GHz 2.2. Key Features The following table describes the detailed features of EG915U series module. Table 4: Key Features Features Description Power Supply Supply voltage: 3.34.3 V Typical supply voltage: 3.8 V Transmitting Power LTE Features GSM Features EG915U-CN:
GSM900: Class 4 (33 dBm 2 dB) DCS1800: Class 1 (30 dBm 2 dB) LTE-FDD: Class 3 (23 dBm 2 dB) LTE-TDD: Class 3 (23 dBm 2 dB) EG915U-EU & EG915U-LA:
GSM850/GSM900 : Class 4 (33 dBm 2 dB) DCS1800/PCS1900: Class 1 (30 dBm 2 dB) LTE-FDD: Class 3 (23 dBm 2 dB) EG915U-CN:
Supports up to Cat 1 FDD/TDD Supports 1.4/3/5/10/15/20 MHz RF bandwidth Supports uplink QPSK and 16QAM Supports downlink QPSK, 16QAM, and 64QAM Max. transmission data rates:
FDD: 10 Mbps (DL)/5 Mbps (UL) TDD: 8.96 Mbps (DL)/3.1 Mbps (UL) EG915U-EU & EG915U-LA:
Supports up to Cat 1 FDD Supports 1.4/3/5/10/15/20 MHz RF bandwidth Supports uplink QPSK and 16QAM Supports downlink QPSK, 16QAM, and 64QAM Max. transmission data rates: 10 Mbps (DL)/5 Mbps (UL) GPRS:
Supports GPRS multi-slot class 12 Coding scheme: CS-1/CS-2/CS-3/CS-4 Max. transmission data rates: 85.6 kbps (DL)/85.6 kbps (UL) Internet Protocol Features Supports TCP/UDP/PPP/NTP/NITZ/FTP/HTTP/PING/CMUX/HTTPS/
EG915U_Series_Hardware_Design 13 / 90 LTE Standard Module Series FTPS/SSL/FILE/MQTT/MMS protocols Supports PAP and CHAP protocols, which are usually used for PPP connection Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: (U)SIM card and ME; ME by default SMS
(U)SIM Interfaces Supports USIM/SIM card: 1.8/3.0 V USB Interface UART Interfaces Compliant with USB 2.0 specification (slave mode only), with maximum transmission rate up to 480 Mbps Used for AT command communication, data transmission, software debugging, firmware upgrade Supports USB serial drivers for Windows 7/8/8.1/10, Linux 2.65.14, and Android 4.x11.x Main UART Used for AT command communication and data transmission Baud rates: up to 921600 bps; 115200 bps by default Supports RTS and CTS hardware flow control Debug UART Used for log output Baud rate: 921600 bps Cannot be used as a general-purpose serial port Auxiliary UART SPI Interface Supports one SPI interface (master mode only) I2C Interface Supports one I2C interface PCM Interface Supports one PCM interface (slave mode only) Audio Features Supports one analog audio input and one analog audio output GSM: HR/FR/EFR/AMR/AMR-WB Supports echo cancellation and noise suppression ADC Interfaces Supports two ADC Interfaces Network Indication NET_STATUS used to indicate the network connectivity status AT Commands Compliant with 3G PP TS 27.007, 27.005 and Quectel enhanced AT commands USB_BOOT Interface Supports one download control interface Antenna Interfaces Main antenna interface (ANT_MAIN) Bluetooth and Wi-Fi Scan antenna interface (ANT_BT/WIFI_SCAN) 50 impedance Position Fixing Supports Wi-Fi Scan EG915U_Series_Hardware_Design 14 / 90 LTE Standard Module Series Temperature Range Operating temperature range: -35 to +75 C 3 Extended temperature range: -40 to +85 C 4 Storage temperature range: -40 to +90 C Firmware Upgrade Via USB interface and DFOTA RoHS All hardware components are fully compliant with EU RoHS Directive 2.3. Functional Diagram The following figure shows a block diagram of the module and illustrates the major functional parts. Power management Baseband Memory Radio frequency Peripheral interfaces 3 Within operating temperature range, the module meets 3GPP specifications. 4 Within extended temperature range, the module remains the ability to establish and maintain functions such as voice, SMS, and data transmission, without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. EG915U_Series_Hardware_Design 15 / 90 LTE Standard Module Series 2.4. Pin Assignment The following figure illustrates the pin assignment of the module. Figure 2: Pin Assignment (Top View) NOTE 1. USB_BOOT cannot be pulled up before the modules startup. 2. Keep NC and RESERVED pins unconnected, and connect all GND pins to ground. 3. The module supports Dual SIM Single Standby. For details, please contact Quectel Technical Support. 4. When using pins 18, 19, 30, 38, and 39, please note that these pins will have a period of variable level state (not controllable by software) after the module is powered on: first high level (3 V) for 2 s and then low level (0 V) for 1.2 s, before they can be configured as 1.8 V input or output. Please EG915U_Series_Hardware_Design 17 / 90 123456711121314151617185051525354555859606162313029282726232221201910984948474645444340414239383736353433322425575663646566676883848586878898979695949378777675747391928990717269708079828110099102101PSM_INDADC1RESERVEDSPI_CSSPI_CLKANT_MAINAP_READYSTATUSNET_STATUSPCM_CLKPCM_SYNCPCM_DINPCM_DOUTW_DISABLE#GNDUSB_VBUSUSB_DPUSB_DMRESERVEDRESERVEDRESERVEDRESERVEDPWRKEYDBG_RXDDBG_TXDADC0VDD_EXTMAIN_DTRGNDMAIN_RIMAIN_DCDMAIN_RTSMAIN_TXDMAIN_RXDVBAT_BBMAIN_CTSI2C_SCLI2C_SDAVBAT_BBGNDGNDGNDRESERVEDVBAT_RFVBAT_RFGNDGNDANT_BT/WIFI_SCANGNDGNDAUX_TXDAUX_RXDRESET_NUSB_BOOTUSIM2_DETUSIM2_CLKUSIM2_RSTUSIM2_DATAUSIM2_VDDSPI_DINSPI_DOUTRESERVEDRESERVEDPSM_EINTRESERVEDRESERVEDGRFC1GRFC21031041031151141031181132112111103106105107116103108117109110RESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVED119126120121122123124125MIC_NMIC_PSPK_PSPK_NRESERVEDRESERVEDRESERVEDMICBIASPower PinsGND PinsSignal PinsRESERVED Pins(U)SIM PinsUSB PinsADC PinsUART2 PinsUART1 PinsDebug UART PinsSPI PinsAudio PinsPCM PinsUSIM1_CLKUSIM1_DATAUSIM1_RSTUSIM1_VDDUSIM1_GNDUSIM1_DETRESERVEDGNDPSM PinsI2C PinsRESERVEDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGND LTE Standard Module Series evaluate whether the unstable output state on power-up meets your application design requirements based on the specific usage scenario and circuit design. 2.5. Pin Description The following tables show the pin definition of the module. Table 5: I/O Parameters Definition Type AI AO AIO DI DO DIO OD PI PO Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Table 6: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 32, 33 PI Power supply for the modules baseband part VBAT_RF 52, 53 PI Power supply for the modules RF part Vmax = 4.3 V Vmin = 3.3 V Vnom = 3.8 V It must be provided with sufficient current of 1 A at least. It must be provided with sufficient current up to 2.5 A. EG915U_Series_Hardware_Design 18 / 90 LTE Standard Module Series VDD_EXT 29 PO Provides 1.8 V for external circuit Vnom = 1.8 V IOmax = 50 mA Power supply for external GPIOs pull-up circuits. Used with a 2.2 F bypass capacitor. If unused, keep it open. Power On/Off Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 15 DI Turns on/off the module RESET_N 17 DI Resets the module VILmax = 0.5 V VBAT power domain. VBAT power domain. Active low. If unused, keep it open. Indication Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 20 DO Indicates the modules operation status VOHmin = 1.35 V VOLmax = 0.45 V NET_STATUS 21 DO Indicates the modules network activity status VOHmin = 1.35 V VOLmax = 0.45 V 1.8 V power domain. If unused, keep it open 1.8 V power domain. If unused, keep it open. USB Interface Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS USB_DP 8 9 AI USB connection detect AIO USB differential data (+) Vmax = 5.25 V Vmin = 3.5 V Vnom = 5.0 V USB_DM 10 AIO USB differential data (-) If unused, keep it open. USB 2.0 compliant. Requires differential impedance of 90 . If unused, keep them open. EG915U_Series_Hardware_Design 19 / 90 LTE Standard Module Series
(U)SIM Interface Pin Name Pin No. I/O Description DC Characteristics Comment USIM1_VDD 43 PO
(U)SIM1 card power supply USIM1_DATA 45 DIO
(U)SIM1 card data USIM1_CLK 46 DO
(U)SIM1 card clock USIM1_RST 44 DO
(U)SIM1 card reset USIM1_DET 42 DI
(U)SIM1 card hot-plug detect IOmax = 50 mA 1.8 V (U)SIM:
Vmax = 1.9 V Vmin = 1.7 V 3.0 V (U)SIM:
Vmax = 3.05 V Vmin = 2.7 V 1.8 V (U)SIM:
VILmax = 0.6 V VIHmin = 1.26 V VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM:
VILmax = 1.0 V VIHmin = 1.95 V VOLmax = 0.45 V VOHmin = 2.55 V 1.8 V (U)SIM:
VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM:
VOLmax = 0.45 V VOHmin = 2.55 V 1.8 V (U)SIM:
VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM:
VOLmax = 0.45 V VOHmin = 2.55 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V USIM1_GND 47
Ground
Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. 1.8 V power domain. If unused, keep it open. Specified ground for (U)SIM1 card EG915U_Series_Hardware_Design 20 / 90 LTE Standard Module Series USIM2_VDD 87 PO
(U)SIM2 card power supply USIM2_DATA 86 DIO
(U)SIM2 card data USIM2_CLK 84 DO
(U)SIM2 card clock USIM2_RST 85 DO
(U)SIM2 card reset USIM2_DET 83 DI
(U)SIM2 card hot-plug detect Main UART Interface Iomax = 50 mA 1.8 V (U)SIM:
Vmax = 1.9 V Vmin = 1.7 V 3.0 V (U)SIM:
Vmax = 3.05 V Vmin = 2.7 V 1.8 V (U)SIM:
VILmax = 0.6 V VIHmin = 1.26 V VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM:
VILmax = 1.0 V VIHmin = 1.95 V VOLmax = 0.45 V VOHmin = 2.55 V 1.8 V (U)SIM:
VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM:
VOLmax = 0.45 V VOHmin = 2.55 V 1.8 V (U)SIM:
VOLmax = 0.45 V VOHmin = 1.35 V 3.0 V (U)SIM:
VOLmax = 0.45 V VOHmin = 2.55 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. 1.8 V power domain. If unused, keep it open Pin Name Pin No. I/O Description DC Characteristics Comment MAIN_CTS 36 DO DTE clear to send signal to DCE (connect to DTEs CTS) VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep EG915U_Series_Hardware_Design 21 / 90 LTE Standard Module Series them open. MAIN_RTS 37 DI DTE request to send signal to DCE (connect to DTEs RTS) MAIN_RXD 34 DI Main UART receive MAIN_DCD 38 DO Main UART data carrier detect MAIN_TXD 35 DO Main UART transmit MAIN_RI 39 DO Main UART ring indication MAIN_DTR 30 DI Main UART data terminal ready Auxiliary UART Interface VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V VOLmax = 0.45 V VOHmin = 1.35 V VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V Pin Name Pin No. I/O Description DC Characteristics Comment AUX_TXD 27 DO Auxiliary UART transmit AUX_RXD 28 DI Auxiliary UART receive VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V 1.8 V power domain. If unused, keep it open. 1.8 V power domain. If unused, keep it open. Debug UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment DBG_RXD 22 DI Debug UART receive DBG_TXD 23 DO Debug UART transmit I2C Interface VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep them open. Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SCL 40 OD I2C serial clock External pull-up EG915U_Series_Hardware_Design 22 / 90 LTE Standard Module Series I2C_SDA 41 OD I2C serial data resistor is required. 1.8 V power domain only. If unused, keep them open. PCM Interface Pin Name Pin No. I/O Description DC Characteristics Comment PCM_SYNC 5 DI PCM data frame sync PCM_CLK 4 DI PCM clock PCM_DIN 6 DI PCM data input PCM_DOUT 7 DO PCM data output RF Antenna Interfaces VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. If unused, keep them open. Support slave mode only. Pin Name Pin No. I/O Description DC Characteristics Comment ANT_MAIN 60 AIO Main antenna interface ANT_BT/
WIFI_SCAN 56 AIO The shared interface for Bluetooth and Wi-Fi Scan GRFC Antenna Tuner Control Interface*
50 impedance. 50 impedance. If unused, keep it open Pin Name Pin No. I/O Description DC Characteristics Comment GRFC1 GRFC2 76 77 DO DO SPI Interface Generic RF Controller If unused, keep them open. Pin Name Pin No. I/O Description DC Characteristics Comment SPI_CLK 26 DO SPI clock VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain. EG915U_Series_Hardware_Design 23 / 90 LTE Standard Module Series SPI_CS 25 DO SPI chip select SPI_DIN 88 DI SPI master mode input SPI_DOUT 64 DO SPI master mode output ADC Interface If unused, keep them open. VOLmax = 0.45 V VOHmin = 1.35 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VOLmax = 0.45 V VOHmin = 1.35 V Pin Name Pin No. I/O Description DC Characteristics Comment ADC0 ADC1 24 2 AI AI Analog Audio Interfaces General-purpose ADC interfaces Voltage range:
0.1 V to VBAT If unused, keep them open. Pin Name Pin No. I/O Description DC Characteristics Comment MIC_N 119 AI Microphone analog input
(-) MICBIAS 120 PO Bias voltage output for microphone Vo = 2.23.0 V Vnom = 2.2 V SPK_P 121 AO SPK_N 122 AO MIC_P 126 AI USB_BOOT Analog audio differential output (+) Analog audio differential output (-) Microphone analog input
(+) Pin Name Pin No. I/O Description DC Characteristics Comment USB_BOOT 75 DI Control pin for module to enter the download mode VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V PSM Interface*
1.8 V power domain. Active high. A circuit that enables the module to enter the download mode must be reserved. EG915U_Series_Hardware_Design 24 / 90 LTE Standard Module Series Pin Name Pin No. I/O Description DC Characteristics Comment PSM_IND 1 DO PSM_EINT 96 DI Other Interfaces Indicates the modules power saving mode. External interrupt pin. Wakes up the module from PSM. Pin Name Pin No. I/O Description DC Characteristics Comment 1.8 V power domain. Pulled up by default. When it is in low voltage level, the module can enter the airplane mode. If unused, keep it open. 1.8 V power domain. If unused, keep it open. VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V W_DISABLE#
18 DI Airplane mode control AP_READY 19 DI Application processor ready GND Pin Name Pin No. GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 6774, 7982, 8991, 100102 RESERVED Pin Name Pin No. RESERVED 1114, 16, 49, 51, 57, 65, 66, 78, 9295, 9799, 103118, 123125 NOTE 1. The functions of PSM and GRFC are under development and it is currently not recommended to use them. Please consult Quectel Technical Support for details. 2. When using pins 18, 19, 30, 38, and 39, please note that these pins will have a period of variable level state (not controllable by software) after the module is powered on: first high level (3 V) for 2 s and then low level (0 V) for 1.2 s, before they can be configured as 1.8 V input or output. Please evaluate whether the unstable output state on power-up meets your application design EG915U_Series_Hardware_Design 25 / 90 LTE Standard Module Series requirements based on the specific usage scenario and circuit design. 2.6. EVB To help customers develop applications with EG915U series module. Quectel provides an evaluation board (UMTS<E EVB), USB to RS-232 converter cable, earphone, antennas and other peripherals to control or test the module. For more details, please refer to document [1]. EG915U_Series_Hardware_Design 26 / 90 LTE Standard Module Series 3 Operating Characteristics 3.1. Operating Modes The following table briefly outlines the operating modes referred in the following chapters. Table 7: Overview of Operating Modes Mode Details Normal Operation Idle Talk/Data Software is active. The module remains registered on the network and is ready to send and receive data. Network connection the power consumption is decided by network setting and data transfer rate. is ongoing. this mode, In Minimum Functionality Mode AT+CFUN=0 can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card are invalid. Airplane Mode AT+CFUN=4 or W_DISABLE# pin can set the module to airplane mode where RF function will be invalid. Sleep Mode In this mode, current consumption of the module is reduced to a low level. The module remains the ability to receive paging message, SMS, voice calls and TCP/UDP data from network normally. In this mode, the modules power supply is cut off by its power management unit Power Down Mode
(PMU). The software is inactive and the serial interfaces are inaccessible, while the VBAT pins are still powered. NOTE For more details about AT commands, see document [2]. 3.2. Sleep Mode The module is able to reduce its current consumption to an ultra-low value in the sleep mode. The EG915U_Series_Hardware_Design 27 / 90 LTE Standard Module Series following chapters describe power saving procedures of the module. 3.2.1 UART Application Scenario If the host communicates with module via UART interface, the following preconditions should be met to make the module enter sleep mode. Execute AT+QSCLK=1 to enable sleep mode. Drive MAIN_DTR to high level. The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART Driving MAIN_DTR low will wake up the module. When the module has a URC to report, the URC will trigger the behavior of MAIN_RI pin. See Chapter 4.10.3 for details about MAIN_RI behaviors. NOTE When using AP_READY, MAIN_DTR, and MAIN_RI (pins 19, 30, and 39), please note that these pins will have a period of variable level state (not controllable by software) after the module is powered on:
first high level (3 V) for 2 s and then low level (0 V) for 1.2 s, before they can be configured as 1.8 V input or output. Please evaluate whether the unstable output state on power-up meets your application design requirements based on the specific usage scenario and circuit design. EG915U_Series_Hardware_Design 28 / 90 MAIN_RXDMAIN_TXDMAIN_RIMAIN_DTRAP_READYTXDRXDEINTGPIOGPIOModuleHostGNDGND LTE Standard Module Series 3.2.2. USB Application Scenario 3.2.2.1. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup function, three preconditions must be met to make the module enter the sleep mode:
Execute AT+QSCLK=1 command to enable the sleep mode. Ensure the MAIN_DTR is held at a high level or keep it open. Ensure the hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure illustrates the connection between the module and the host. Figure 4: Sleep Mode Application with USB Remote Wakeup You can wake up the module by sending data to it through USB. When the module has a URC to report, the module will send remote wake-up signals to USB bus to wake up the host. NOTE USB suspend is supported on Linux system but not on Windows system. 3.2.2.2. USB Application with USB Suspend/Resume and MAIN_RI Function If the host supports USB suspend/resume, but does not support remote wake-up function, the MAIN_RI signal is needed to wake up the host. EG915U_Series_Hardware_Design 29 / 90 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleMCUGNDGND LTE Standard Module Series In this case, three preconditions can make the module enter the sleep mode. Execute AT+QSCLK=1 to enable sleep mode. Ensure the MAIN_DTR is held at high level or keep it open. Ensure the hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure illustrates the connection between the module and the host. Figure 5: Sleep Mode Application with MAIN_RI You can wake up the module by sending data to it through USB. When the module has a URC to report, the URC will trigger the behaviors of MAIN_RI pin. See Chapter 4.10.3 for details about MAIN_RI behaviors. NOTE USB suspend is supported on Linux system but not on Windows system. 3.2.2.3. USB Application without USB Suspend Function If the host does not support USB suspend function, disconnect USB_VBUS with an external control circuit to make the module enter into sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the MAIN_DTR is held at a high level or keep it open. Disconnect the USB_VBUS. The following figure illustrates the connection between the module and the host. EG915U_Series_Hardware_Design 30 / 90 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleMCUGNDGNDMAIN_RIEINT LTE Standard Module Series Figure 6: Sleep Mode Application without Suspend Function You can wake up the module by turning on the power switch to supply power to USB_VBUS. NOTE 1. Please pay attention to the level match shown in dotted line between the module and the host. 2. When using AP_READY, MAIN_DTR, and MAIN_RI (pins 19, 30, and 39), please note that these pins will have a period of variable level state (not controllable by software) after the module is powered on: first high level (3 V) for 2 s and then low level (0 V) for 1.2 s, before they can be configured as 1.8 V input or output. Please evaluate whether the unstable output state on power-up meets your application design requirements based on the specific usage scenario and circuit design. 3.3. Airplane Mode When the module enters airplane mode, the RF function will be disabled and all AT commands related to it will be inaccessible. This mode can be set via the following ways. 3.3.1. Hardware The W_DISABLE# pin is pulled up by default. Its control function for airplane mode, which is disabled by default, can be enabled through AT+QCFG="airplanecontrol",1. When such a control function is enabled, you can drive it to low level to make the module enter airplane mode. EG915U_Series_Hardware_Design 31 / 90 USB_VBUSUSB_DPUSB_DMAP_READYVDDUSB_DPUSB_DMGPIOModuleHostMAIN_RIEINTPower SwitchGPIOGNDGND LTE Standard Module Series NOTE When using W_DISABLE# (pin 18), please note that it will have a period of variable level state (not controllable by software) after the module is powered on: first high level (3 V) for 2 s and then low level
(0 V) for 1.2 s, before it can be configured as 1.8 V input or output. Please evaluate whether the unstable output state on power-up meets your application design requirements based on the specific usage scenario and circuit design. 3.3.2. Software AT+CFUN=<fun> provides the choice of functionality level through setting <fun> to 0, 1 or 4. AT+CFUN=0: Minimum functionality. Both RF function and (U)SIM functions are disabled. AT+CFUN=1: Full functionality (by default). AT+CFUN=4: RF function is disables (airplane mode). NOTE For more details about AT command, see document [2]. 3.4. Power Supply 3.4.1. Power Supply Pins The module provides 4 VBAT pins for connection with an external power supply. Two VBAT_RF pins for RF part. Two VBAT_BB pins for BB part. Table 8: Pin Definition of Power Supply Pin Name Pin No. I/O Description Min. Typ. Max. Unit VBAT_BB 32, 33 PI VBAT_RF 52, 53 PI Power supply for the modules baseband part Power supply for the modules RF part 3.3 3.8 4.3 3.3 3.8 4.3 V V EG915U_Series_Hardware_Design 32 / 90 LTE Standard Module Series GND 3, 31, 48, 50, 54, 55, 5862, 6774, 7982, 8991, 100102 3.4.2. Reference Design for Power Supply The power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of the module should be able to provide sufficient current of 3.0 A at least. If the voltage drops between input and output is not too high, it is suggested that an LDO should be used to supply power to the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is recommended. The following figure illustrates a reference design for +5 V input power source. The typical output of the power supply is about 3.8 V and the maximum load current is 3.0 A. Figure 7: Reference Design of Power Supply 3.4.3. Voltage Stability Requirements The power supply range of the module is from 3.3 V to 4.3 V. Please make sure the input voltage never drops below 3.3 V. EG915U_Series_Hardware_Design 33 / 90 DC_INMIC29302WUINOUTENGNDADJ24135VBAT 100K47K470R51K 1 %4.7K47KVBAT_EN470 F470 F100 nF100 nF1 %
LTE Standard Module Series Figure 8: Power Supply Limits during Burst Transmission To decrease the voltage drop, use bypass capacitors of about 100 F with low ESR (ESR = 0.7 ) and reserve a multi-layer ceramic chip (MLCC) capacitor array due to their ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to the VBAT_BB and VBAT_RF pins. When the external power supply is connected to the module, VBAT_BB and VBAT_RF need to be routed in star structure. The width of the VBAT_BB trace should not be less than 2 mm and VBAT_RF trace should not be less than 2.5 mm. In addition, to avoid the surge, use a TVS diode of which reverse working voltage is 4.7 V and peak pulse power is up to 2550 W. The reference circuit is shown as below. Figure 9: Power Supply EG915U_Series_Hardware_Design 34 / 90 VBATBurst TransmissionRippleDropBurst TransmissionModuleVBAT_RFVBAT_BBVBATC1100FC6100nFC733pFC810pF++C2100nFC5100FC333pFC410pFD1WS4.5D3HV LTE Standard Module Series 3.5. Turn On 3.5.1. Turn On with PWPKEY Table 9: Pin Definition of PWRKEY Pin Name Pin No. PWRKEY 15 I/O DI Description Comment Turns on/off the module VBAT power domain. When the module is in power down mode, you can turn it on to normal mode by driving the PWRKEY pin low for at least 2 s. It is recommended to use an open drain/collector driver to control the PWRKEY. A simple reference circuit is illustrated in the following figure. Figure 10: Turning on the Module Using Driving Circuit Another way to control the PWRKEY is using a button directly. When you are pressing the key, electrostatic strike may be generated from finger. Therefore, you must place a TVS component nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 11: Turning on the Module Using Button EG915U_Series_Hardware_Design 35 / 90 PWRKEY4.7K47KTurn-on pulse 2 s10 nFPWRKEYS1Close to S1TVS LTE Standard Module Series The power-up scenario is illustrated in the following figure. Figure 12: Power-up Timing
. NOTE 1. Make sure that the VBAT is stable before pulling down PWRKEY pin. It is recommended that the time difference between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2. PWRKEY can be pulled down directly to GND with a recommended 1 k resistor if the module needs to be powered on automatically and shutdown is not needed. 3.6. Turn Off The following procedures can be used to turn off the module:
Use the PWRKEY pin. Use AT+QPOWD. EG915U_Series_Hardware_Design 36 / 90 VIL 0.5 VVBATPWRKEY 2 sRESET_NInactiveActiveUARTNOTE 1InactiveActiveUSBVDD_EXTAbout 1.15 s 4 s 2.23 s LTE Standard Module Series 3.6.1. Turn Off with PWPKEY Drive the PWRKEY pin low for at least 3 s and then release PWRKEY. After this, the module executes power-down procedure. The power-down scenario is illustrated in the following figure. Figure 13: Timing of Turning off the Module 3.6.2. Turn Off with AT Command It is also a safe way to use AT+QPOWD to turn off the module, which is similar to turning off the module via the PWRKEY pin. Please refer to document [2] for details about AT+QPOWD command. NOTE 1. To avoid damaging internal flash, do not switch off the power supply when the module works normally. Only after shutting down the module with PWRKEY or AT command can you cut off the power supply. 2. When the PWRKEY pin has been kept pulled down directly to GND, the module will not boot automatically after being turned off with the AT command. In this case, it is necessary to forcibly disconnect the VBAT power supply and power on the module again. Therefore, we recommend to use a control circuit to drive the PWEKEY high/low to turn on/off the module instead of keeping the PWRKEY connected to GND. 3. When being turned off, the module will log out of the network. The time for logging out relates to its network status. Thus, please pay attention to the shutdown time in your design because the actual shutdown time varies according to the network status. EG915U_Series_Hardware_Design 37 / 90 VBATPWRKEY 30 s 3 sRunningPower-down procedureOFFModuleStatus LTE Standard Module Series 3.7. Reset The RESET_N pin can be used to reset the module. The module can be reset by driving the RESET_N pin low for at least 100 ms and then releasing it. The RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground. Table 10: Pin Description of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 17 DI Resets the module VBAT power domain. If unused, keep it open. The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. Figure 14: Reference Circuit of RESET_N by Using Driving Circuit Figure 15: Reference Circuit of RESET_N by Using Button EG915U_Series_Hardware_Design 38 / 90 Reset pulseRESET_N4.7K47K 100 msRESET_NS2Close to S2TVS LTE Standard Module Series The reset scenario is illustrated in the following figure. Figure 16: Timing of Resetting the Module NOTE 1. Ensure that there is no large capacitance exceeding 10 nF on PWRKEY and RESET_N pins. 2. It is recommended to use RESET_N only when you fail to turn off the module with the AT+QPOWD or PWRKEY pin. EG915U_Series_Hardware_Design 39 / 90 VIL 0.5 VVBATModule StatusRunningRESET_NBaseband restart Baseband resetting 100 ms LTE Standard Module Series 4 Application Interfaces 4.1. Analog Audio Interfaces The module provides one analog audio input channel and one analog audio output channel. The pin definitions are shown in the following table. Table 11: Pin Definition of Analog Audio Interfaces Pin Name Pin No. MIC_N MICBIAS SPK_P SPK_N MIC_P 119 120 121 122 126 I/O AI PO AO AO AI Description Microphone analog input (-) Bias voltage output for microphone Analog audio differential output (+) Analog audio differential output (-) Microphone analog input (+) AI channels are differential input channels, which can be applied for input of microphone (usually an electret microphone is used). AO channels are differential output channels, which can be applied for output of receiver. The modules internal PA is configured as Class AB by default. 4.1.1. Audio Interfaces Design Considerations It is recommended to use the electret microphone with dual built-in capacitors (e.g., 10 pF and 33 pF) for filtering out RF interference, thus reducing TDD noise. The 33 pF capacitor is applied for filtering out RF interference when the module is transmitting at GSM900. Without placing this capacitor, TDD noise could be heard. The 10 pF capacitor here is used for filtering out RF interference at DCS1800. Note that the resonant frequency point of a capacitor largely depends on the material and production technique. Therefore, you would have to discuss with your capacitor vendors to choose the most suitable capacitor for filtering out high-frequency noises. The filter capacitors on the PCB board should be placed as close to the audio devices or audio interfaces EG915U_Series_Hardware_Design 40 / 90 LTE Standard Module Series as possible, and the traces should be as short as possible. They should go through the filter capacitors before arriving at other connection points. To reduce radio or other signal interference, RF antennas should be placed away from audio interfaces and audio traces. Power traces should not be parallel with and also should be far away from the audio traces. The differential audio traces must be routed according to the differential signal layout rule. 4.1.2. Microphone Interface Design The microphone channel reference circuit is shown in the following figure. Figure 17: Reference Design for Microphone Interface NOTE MIC channel is sensitive to ESD, so it is not recommended to remove the ESD components used for protecting the MIC. 4.1.3. Receiver Interface Design The receiver channel reference circuit is shown in the following figure:
EG915U_Series_Hardware_Design 41 / 90 MIC_PDifferential layoutModule10 pF33 pF33 pF33 pFElectret Microphone10 pF10 pFTVSTVSClose to ModuleMIC_NMIC_BIASClose to Microphone2.2 F100 nF1K0R0R100 nF1K510R510R1.5K1.5K LTE Standard Module Series Figure 18: Reference Design for Receiver Interface 4.2. USB Interface The module provides an integrated Universal Serial Bus (USB) interface compliant with the USB 2.0 specification and supporting full-speed (12 Mbps) and high-speed (480 Mbps) modes. The USB interface can only serve as a slave device. Table 12: Functions of USB Interface Functions AT command communication Data transmission Software debugging Firmware upgrade EG915U_Series_Hardware_Design 42 / 90 SPK_N0R0RSPK_PModuleClose to ReceiverNF33 pF10 pF33 pFDifferential layout0603TVSTVS0R0R LTE Standard Module Series Table 13: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment Typ. 5.0 V Min. 3.5 V USB_VBUS USB_DP 8 9 AI USB connection detect AIO USB differential data (+) USB 2.0 compliant. USB_DM 10 AIO USB differential data (-) Requires differential impedance of 90 . If unused, keep them open. For more details about the USB 2.0 specifications, visit http://www.usb.org/home. Reserve test points for debugging and firmware upgrade in your design. The following figure shows a reference circuit of USB interface. Figure 19: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and your MCU to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. To ensure the signal integrity of USB data lines, L1, R3, and R4 must be placed close to the module, and resistors R3 and R4 should be placed close to each other. The extra stubs of trace must be as short as possible. When designing the USB interface, you should follow the following principles to meet USB 2.0 specification. Route the USB signal traces as differential pairs with ground surrounded. The impedance of USB differential trace is 90 . Do not route signal traces under or near crystals, oscillators, magnetic devices, and RF signal traces. Route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on EG915U_Series_Hardware_Design 43 / 90 USB_DPUSB_DMGNDUSB_DPUSB_DMGNDL1Close to ModuleR3R4Test PointsESD ArrayNM_0RNM_0RMinimize these stubsModuleMCUUSB_VBUSUSB_VBUS LTE Standard Module Series that layer and ground planes above and below. Pay attention to the selection of the ESD component on the USB data line. Its stray capacitance should not exceed 2 pF and should be placed as close as possible to the USB connector. 4.3. USB_BOOT Interface The module provides a USB_BOOT interface. Pull up USB_BOOT to VDD_EXT before powering on the module, which will enter the download mode when it is turned on. In this mode, the module supports firmware upgrade over USB interface. Table 14: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 75 DI Control pin for module to enter the download mode 1.8 V power domain. Active high. A circuit that enables the module to enter the download mode must be reserved. The following figure shows a reference circuit of USB_BOOT interface. Figure 20: Reference Circuit of USB_BOOT Interface EG915U_Series_Hardware_Design 44 / 90 ModuleUSB_BOOTVDD_EXT4.7KTest pointTVSClose to test pointGND213 LTE Standard Module Series 4.4. (U)SIM Interfaces The module provides 2 (U)SIM interfaces that supports Dual SIM Single Standby. The (U)SIM interfaces circuitry meets ETSI requirement and IMT-2000 specification. Either 1.8 V or 3.0 V (U)SIM card is supported. Table 15: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM1_VDD 43 PO
(U)SIM1 card power supply USIM1_DATA 45 DIO
(U)SIM1 card data USIM1_CLK 46 DO
(U)SIM1 card clock USIM1_RST 44 DO
(U)SIM1 card reset Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. USIM1_DET 42 DI
(U)SIM1 card hot-plug detect 1.8 V power domain. If unused, keep it open. USIM1_GND 47
Ground Specified ground for (U)SIM1 card USIM2_VDD 87 PO
(U)SIM2 card power supply USIM2_DATA 86 IO
(U)SIM2 card data USIM2_CLK 84 DO
(U)SIM2 card clock USIM2_RST 85 DO
(U)SIM2 card reset Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. USIM2_DET 83 DI
(U)SIM2 card hot-plug detect 1.8 V power domain. If unused, keep it open The module supports (U)SIM card hot-plug via the USIM1_DET pin and both high- and low-level detections are supported. By default, the function is disabled, and see AT+QSIMDET in document [2] for more details. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. EG915U_Series_Hardware_Design 45 / 90 LTE Standard Module Series Figure 21: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM1_DET unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 22: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector To enhance the reliability and availability of the (U)SIM card in applications, follow the criteria below in
(U)SIM circuit design:
Place (U)SIM card connector as close to the module as possible. Keep the trace length as short as possible, at most 200 mm. Keep (U)SIM card signals away from RF and VBAT traces. Ensure the bypass capacitor between USIM_VDD and GND is less than 1 F, and the capacitor should be close to the (U)SIM card connector. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and EG915U_Series_Hardware_Design 46 / 90 ModuleUSIM_VDDGNDUSIM_RSTUSIM_CLKUSIM_DATAUSIM1_DET0R0R0RVDD_EXT51K100 nFGNDGND33 pF33 pF33 pFVCCRSTCLKIOVPPGNDGNDUSIM_VDD15K(U)SIM Card ConnectorSwitchModuleUSIM_VDDGNDUSIM_RSTUSIM_CLKUSIM_DATA0R0R0R100 nFGND33 pF33 pF33 pFVCCRSTCLKIOVPPGNDGND15KUSIM_VDD(U)SIM Card Connector LTE Standard Module Series shield them with surrounded ground. To offer good ESD protection, it is recommended to add a TVS diode array of which the parasitic capacitance should be less than 15 pF. Add 0 resistors in series between the module and the
(U)SIM card to facilitate debugging. The 33 pF capacitors are used for filtering interference of GSM900. Additionally, keep the (U)SI M peripheral circuit close to the (U)SIM card connector. The pull-up resistor on USIM_DATA can improve anti-jamming capability of the (U)SIM card. If the
(U)SIM card traces are too long, or the interference source is relatively close, it is recommended to add a pull-up resistor near the (U)SIM card connector. 4.5. I2C and PCM Interfaces The module provides one I2C interface and one pulse code modulation (PCM) interface. The PCM interface of the module only supports slave mode; therefore, the clock signal of the codec IC needs to be provided externally. Table 16: Pin Definition of I2C and PCM Interfaces Pin Name Pin No. I/O Description Comment I2C_SCL I2C_SDA PCM_DIN PCM_DOUT PCM_SYNC PCM_CLK 40 41 6 7 5 4 OD I2C serial clock OD I2C serial data DI PCM data input DO PCM data output DI DI PCM data frame sync PCM clock External pull-up resistor is required. 1.8 V power domain only. If unused, keep them open. 1.8 V power domain. If unused, keep them open. The following figure shows a reference design of I2C and PCM interfaces with an external codec IC. EG915U_Series_Hardware_Design 47 / 90 LTE Standard Module Series Figure 23: Reference Circuit of I2C and PCM Application with Audio Codec NOTE 1. It is recommended to reserve an RC (R = 22 , C = 22 pF) circuit on the PCM traces, especially for PCM_CLK. 2. The I2C interface supports simultaneous connection of multiple peripherals except for codec IC. In other words, if a codec IC has been mounted on the I2C bus, no other peripherals can be mounted; if there is no codec IC on the bus, multiple peripherals can be mounted. 4.6. UART Interfaces The module provides three UART interfaces: main UART, debug UART, and auxiliary UART. Their features are described as follows. Main UART interface supports baud rates of 4800 bps, 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps, 230400 bps, 460800 bps, and 921600 bps, and the default setting is 115200 bps. It supports RTS and CTS hardware flow control. This interface is used for data transmission and AT command communication. Debug UART interface supports 921600 bps baud rate. It is used for log output. Auxiliary UART. EG915U_Series_Hardware_Design 48 / 90 PCM_DINPCM_DOUTPCM_SYNCPCM_CLKI2C_SCLI2C_SDAModule4.7K4.7KBCLKLRCKDACADCSCLSDABIASMICBIASINPINNLOUTPLOUTNCodec1.8 VExternal 26MHz Crystal0RNM 0RCAM_MCLKMCLK LTE Standard Module Series Table 17: Pin Definition of Main UART Interface Pin Name Pin No. I/O Description Comment MAIN_CTS MAIN_RTS MAIN_RXD MAIN_DCD MAIN_TXD MAIN_RI MAIN_DTR 36 37 34 38 35 39 30 DO DI DI DTE clear to send signal to DCE (connect to DTEs CTS) DTE request to send signal to DCE (connect to DTEs RTS) Main UART receive DO Main UART data carrier detect DO Main UART transmit DO Main UART ring indication DI Main UART data terminal ready 1.8 V power domain. If unused, keep them open. Table 18: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_RXD DBG_TXD 22 23 DI DO Debug UART receive Debug UART transmit 1.8 V power domain. If unused, keep them open. Table 19: Auxiliary UART Interface Pin Name Pin No. I/O Description Comment AUX_TXD AUX_RXD 27 28 DO DI Auxiliary UART transmit Auxiliary UART receive 1.8 V power domain. If unused, keep them open. The module provides 1.8 V UART interfaces. Use a level shifter if the application is equipped with a 3.3 V UART interface. A level shifter TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. EG915U_Series_Hardware_Design 49 / 90 LTE Standard Module Series Figure 24: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor circuit is shown as follows. For the design of circuits in dotted lines, please refer to that of the circuits in solid lines, but please pay attention to the direction of connection. Figure 25: Reference Circuit with Transistor Circuit NOTE 1. Transistor circuit solution is not suitable for applications with baud rates exceeding 460 kbps. 2. Please note that the module CTS is connected to the host CTS, and the module RTS is connected to the host RTS. 3. When using pins 30, 38, and 39, please note that these pins will have a period of variable level state (not controllable by software) after the module is powered on: first high level (3 V) for 2 s and EG915U_Series_Hardware_Design 50 / 90 VCCAVCCBOEA1A2A3A4A5A6A7A8GNDB1B2B3B4B5B6B7B8VDD_EXTMAIN_RIMAIN_DCDMAIN_RTSMAIN_RXDMAIN_DTRMAIN_CTSMAIN_TXD51K51K0.1 F0.1 FRI_MCUDCD_MCURTS_MCUTXD_MCUDTR_MCUCTS_MCURXD_MCUVDD_MCUTranslator10K120KConnect to the CTS of MCUConnect to the RTS of MCUConnect to the RXD of MCUConnect to the TXD of MCUMCU/ARMTXDRXDVDD_EXT10KVCC_MCU4.7K10KVDD_EXTMAIN_TXDMAIN_RXDMAIN_RTSMAIN_CTSMAIN_DTRMAIN_RIRTSCTSGNDGPIOMAIN_DCDModuleGPIOEINTVDD_EXT4.7KGND1 nF1 nF LTE Standard Module Series then low level (0 V) for 1.2 s, before they can be configured as 1.8 V input or output. Please evaluate whether the unstable output state on power-up meets your application design requirements based on the specific usage scenario and circuit design. 4.7. ADC Interfaces The module provides two analog-to-digital converter (ADC) interfaces. You can use AT+QADC=0 and AT+QADC=1 to read the voltage values on ADC0 and ADC1 respectively. See document [2] for more details. To improve the accuracy of ADC, surround the trace of ADC with ground. Table 20: Pin Definition of ADC Interfaces Pin Name Pin No. I/O Description Comment ADC0 ADC1 24 2 AI AI General-purpose ADC interfaces A 1 k series resistor is required for use. If unused, keep them open. Table 21: Characteristics of ADC Interfaces Parameter Min. Typ. ADC0 Voltage Range 0.1 ADC1 Voltage Range 0.1 ADC Resolution
12 Max. VBAT VBAT
Unit V V bits NOTE 1. The input voltage of ADC should not exceed its corresponding voltage range. 2. Do not supply any voltage to ADC pins when VBAT is removed. 3. Resistor divider circuit for ADC application is recommended. If the input voltage of ADC interfaces is designed with a resistor divider circuit, the resistance value of the external divider resistor must be less than 100 k. Otherwise, the ADC measurement accuracy will be reduced significantly. EG915U_Series_Hardware_Design 51 / 90 LTE Standard Module Series 4.8. SPI Interface The module provides an SPI interface that only supports master mode. It has a working voltage of 1.8 V and a maximum clock frequency of 25 MHz. Table 22: Pin Definition of SPI Interface Pin Name Pin No. I/O Description Comment 26 25 88 64 DO DO DI SPI clock SPI chip select SPI master mode input DO SPI master mode output 1.8 V power domain. If unused, keep them open. SPI_CLK SPI_CS SPI_DIN SPI_DOUT NOTE When the 4-wire SPI interface is connected to NOR Flash, it supports basic flash read, write, erase, and other operations, but you need to perform wear leveling. It does not support file system and can only be used for storage purpose. 4.9. PSM Interface*
The module supports power saving mode (PSM). It enters the PSM through the following AT commands when working normally. AT+CFUN=4: Enter airplane mode. AT+QSCLK=3: Enable PSM. AT+CFUN=1: Exit airplane mode. Pulling up the PSM_EINT pin externally or setting the timer by software will enable the module to exit PSM. EG915U_Series_Hardware_Design 52 / 90 LTE Standard Module Series Table 23: Pin Definition of PSM Interface Pin Name Pin No. I/O Description PSM_IND PSM_EINT 1 96 DO DI Indicates the modules power saving mode. External interrupt pin. Wakes up the module from PSM. 4.10. Indication Signals Table 24: Pin Definition of Indication Signals Pin Name Pin No. I/O Description Comment STATUS AP_READY NET_STATUS 20 19 21 DO Indicates the modules operation status DI Application processor ready DO Indicates the modules network activity status 1.8 V power domain. If unused, keep them open. 4.10.1. NET_STATUS The network indication pin NET_STATUS can drive the network status indicator. The following table describes its pin definition and working states in different network status. Table 25: Pin Definition of Network Connection Status/Activity Indication Pin Name Pin No. I/O Description DC Characteristics Comment NET_STATUS 21 DO Indicates the modules network activity status VOHmin = 1.35 V VOLmax = 0.45 V 1.8 V power domain. If unused, keep it open. Table 26: Working States of Network Connection Status/Activity Indication Pin Name State Network Status NET_STATUS Flicker slowly (200 ms high/1800 ms low) Network searching EG915U_Series_Hardware_Design 53 / 90 LTE Standard Module Series Flicker quickly (234 ms high/266 ms low) Registered on network and idle Flicker rapidly (63 ms low /62 ms high) Data transfer is ongoing Always high Voice calling Figure 26: Reference Circuit of Network Status Indication 4.10.2. STATUS The STATUS pin is an open drain output for indicating the modules operation status. It will output high level when module is powered on successfully. Table 27: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 20 DO Indicates the modules operation status 1.8 V power domain. If unused, keep it open. A reference circuit is shown as below. EG915U_Series_Hardware_Design 54 / 90 4.7K47KVBAT2.2KModuleNET_STATUS LTE Standard Module Series Figure 27: Reference Circuit of STATUS 4.10.3. MAIN_RI You can configure MAIN_RI behaviors with AT+QCFG="risignaltype","physical". No matter on which port a URC is presented, the URC will trigger the behaviors of MAIN_RI. MAIN_RI behavior can be configured flexibly. The default behaviors of the MAIN_RI are shown as below. Table 28: Behaviors of MAIN_RI State Idle URC Response MAIN_RI keeps at high level. MAIN_RI outputs 120 ms low pulse when a new URC returns. The MAIN_RI behaviors can be changed via AT+QCFG="urc/ri/ring". See document [2] for details. NOTE 1. The URC can be output via UART port, USB AT port, and USB modem port, which can be set by AT+QURCCFG. The default setting is USB AT port. 2. When using AP_READY and MAIN_RI (pins 19 and 39), please note that they will have a period of variable level state (not controllable by software) after the module is powered on: first high level (3 V) for 2 s and then low level (0 V) for 1.2 s, before they can be configured as 1.8 V input or output. Please evaluate whether the unstable output state on power-up meets your application design requirements based on the specific usage scenario and circuit design. EG915U_Series_Hardware_Design 55 / 90 4.7K47KVBAT2.2KModule STATUS LTE Standard Module Series 5 Antenna Interfaces The module provides a main antenna interface and a Bluetooth/Wi-Fi Scan antenna interface. The impedance of antenna ports is 50 . 5.1. Main Antenna and Bluetooth/Wi-Fi Scan Antenna Interfaces 5.1.1. Pin Definition Table 29: Pin Definition of RF Antennas Pin Name Pin No. I/O Description Comment ANT_MAIN 60 AIO Main antenna interface 50 impedance. ANT_BT/WIFI_SCAN 56 AIO The shared interface for Bluetooth and Wi-Fi Scan Bluetooth and Wi-Fi Scan cannot be used simultaneously; Wi-Fi Scan can only receive but not transmit. 50 impedance. If unused, keep it open. 5.1.2. Operating Frequency Table 30: Operating Frequency of EG915U-CN Operating Frequency Transmit (MHz) Receive (MHz) GSM900 DCS1800 LTE-FDD B1 LTE-FDD B3 LTE-FDD B5 880-915 1710-1785 1920-1980 1710-1785 824-849 925-960 1805-1880 2110-2170 1805-1880 869-894 EG915U_Series_Hardware_Design 56 / 90 LTE Standard Module Series LTE-FDD B8 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40 LTE-TDD B41 880-915 2010-2025 2570-2620 1880-1920 2300-2400 2535-2675 925-960 2010-2025 2570-2620 1880-1920 2300-2400 2535-2675 Table 31: Operating Frequency of EG915U-EU Operating Frequency Transmit (MHz) Receive (MHz) GSM850 PCS1900 GSM900 DCS1800 LTE-FDD B1 LTE-FDD B3 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B20 LTE-FDD B28 824-849 1850-1910 880-915 1710-1785 1920-1980 1710-1785 824-849 2500-2570 880-915 832-862 703-748 869-894 1930-1990 925-960 1805-1880 2110-2170 1805-1880 869-894 2620-2690 925-960 791-821 758-803 Table 32: Operating Frequency of EG915U-LA Operating Frequency Transmit (MHz) Receive (MHz) GSM850 PCS1900 824-849 1850-1910 869-894 1930-1990 EG915U_Series_Hardware_Design 57 / 90 LTE Standard Module Series GSM900 DCS1800 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B28 LTE-FDD B66 NOTE 880-915 1710-1785 1850-1910 1710-1785 1710-1755 824-849 2500-2570 880-915 703-748 925-960 1805-1880 1930-1990 1805-1880 2110-2155 869-894 2620-2690 925-960 758-803 1710-1780 2110-2200 Only EG915U-CN supports LTE-TDD. 5.1.3. Reference Design of Antenna Interfaces A reference design of ANT_MAIN pin and ANT_BT/WIFI_SACN pin are shown as below. A -type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. EG915U_Series_Hardware_Design 58 / 90 LTE Standard Module Series Figure 28: Reference Circuit of RF Antennas 5.1.4. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled as 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between the RF traces and the ground (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 29: Microstrip Design on a 2-layer PCB EG915U_Series_Hardware_Design 59 / 90 ANT_MAINR1 0RC1ModuleMain AntennaNMC2NMR2 0RC3Bluetooth/Wi-Fi ScanNMC4NMANT_BT/WIFI_SCAN LTE Standard Module Series Figure 30: Coplanar Waveguide Design on a 2-layer PCB Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:
EG915U_Series_Hardware_Design 60 / 90 LTE Standard Module Series Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [3]. 5.2. Antenna Installation 5.2.1. Antenna Design Requirement Table 33: Requirements for Antenna Design Type Requirements GSM/LTE VSWR: 2 Efficiency: > 30 %
Max input power: 50 W Input impedance: 50 Cable insertion loss:
< 1 dB: LB (< 1 GHz)
< 1.5 dB: MB (12.3 GHz)
< 2 dB: HB (> 2.3 GHz) 5.2.2. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. EG915U_Series_Hardware_Design 61 / 90 LTE Standard Module Series Figure 33: Dimensions of U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 34: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. EG915U_Series_Hardware_Design 62 / 90 LTE Standard Module Series Figure 35: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com. EG915U_Series_Hardware_Design 63 / 90 LTE Standard Module Series 6 Reliability, Radio, and Electrical Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 34: Absolute Maximum Ratings Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Min.
-0.3
-0.3
Voltage on Digital Pins
-0.3 Voltage at ADC0 Voltage at ADC1 0 0 6.2. Power Supply Ratings Table 35: Power Supply Ratings Max. Unit 6.0 5.5 1.0 2.5 2.3 VBAT VBAT V V A A V V V Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum 3.3 3.8 4.3 V EG915U_Series_Hardware_Design 64 / 90 LTE Standard Module Series and maximum values. Voltage drop during transmitting burst Maximum power control level at GSM 900 IVBAT Peak supply current
(during transmission slot) Maximum power control level at GSM 900 USB_VBUS USB connection detection
400 mV 1.7 2.5 A 3.5 5.0 5.25 V 6.3. Power Consumption Table 36: EG915U-CN Current Consumption Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) AT+CFUN=0 (USB connected) AT+CFUN=4 (USB disconnected) AT+CFUN=4 (USB connected) 32 1.0 2.2 1.0 2.3 GSM 900 @ DRX = 2 (USB disconnected) 2.0 GSM 900 @ DRX = 5 (USB disconnected) 1.5 Sleep state GSM 900 @ DRX = 5 (USB connected) 2.7 GSM 900 @ DRX = 9 (USB disconnected) 1.3 DCS1800 @ DRX = 2 (USB disconnected) 2.0 DCS1800 @ DRX = 5 (USB disconnected) 1.5 DCS1800 @ DRX = 5 (USB connected) 2.7 DCS1800 @ DRX = 9 (USB disconnected) 1.3 LTE-FDD @ PF = 32 (USB disconnected) 2.5 LTE-FDD @ PF = 64 (USB disconnected) 1.8 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG915U_Series_Hardware_Design 65 / 90 LTE Standard Module Series LTE-FDD @ PF = 64 (USB connected) 3.0 LTE-FDD @ PF = 128 (USB disconnected) 1.4 LTE-FDD @ PF = 256 (USB disconnected) 1.2 LTE-TDD @ PF = 32 (USB disconnected) 2.5 LTE-TDD @ PF = 64 (USB disconnected) 1.8 LTE-TDD @ PF = 64 (USB connected) 3.1 LTE-TDD @ PF = 128 (USB disconnected) 1.4 LTE-TDD @ PF = 256 (USB disconnected) 1.2 GSM 900 @ DRX = 5 (USB disconnected) 12.2 GSM 900 @ DRX = 5 (USB connected) 28.5 LTE-FDD @ PF = 64 (USB disconnected) 12.5 LTE-FDD @ PF = 64 (USB connected) 29.0 LTE-TDD @ PF = 64 (USB disconnected) 12.5 LTE-TDD @ PF = 64 (USB connected) 29.0 Idle state LTE-FDD B1 @ 22.93 dBm LTE-FDD B3 @ 22.86 dBm LTE-FDD B5 @ 23.51 dBm LTE-FDD B8 @ 22.79 dBm LTE data transfer LTE-FDD B34 @ 23.32 dBm LTE-FDD B38 @ 23.29 dBm LTE-FDD B39 @ 23.15 dBm LTE-FDD B40 @ 22.97 dBm LTE-FDD B41 @ 23.06 dBm GSM900 4DL/1UL @ 32.86 dBm GPRS data transfer GSM900 3DL/2UL @ 30.86 dBm GSM900 2DL/3UL @ 28.81 dBm 571 583 527 568 268 300 241 284 296 226 343 392 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG915U_Series_Hardware_Design 66 / 90 LTE Standard Module Series GSM900 1DL/4UL @ 26.63 dBm DCS1800 4DL/1UL @ 30.13 dBm DCS1800 3DL/2UL @ 28.12 dBm DCS1800 2DL/3UL @ 26.01 dBm DCS1800 1DL/4UL @ 23.94 dBm GSM900 PCL=5 @ 32.83 dBm GSM900 PCL=12 @ 18.94 dBm GSM900 PCL=19 @ 6.18 dBm DCS1800 PCL=0 @ 30.12 dBm DCS1800 PCL=7 @ 15.97 dBm DCS1800 PCL=15 @ 0.28 dBm GSM900 PCL=5 @ 32.83 dBm GSM900 PCL=12 @ 18.94 dBm GSM900 PCL=19 @ 6.18 dBm DCS1800 PCL=0 @ 30.12 dBm DCS1800 PCL=7 @ 15.97 dBm DCS1800 PCL=15 @ 0.28 dBm GSM voice call GSM voice call
(Max. Current) Table 37: EG915U-EU Current Consumption Description Conditions OFF state Power down AT+CFUN=0 (USB disconnected) AT+CFUN=0 (USB connected) Sleep state AT+CFUN=4 (USB disconnected) AT+CFUN=4 (USB connected) 405 160 221 249 258 245 90 63 176 75 57 1.77 0.44 0.18 1.18 0.3 0.15 Typ. 43 1.01 2.2 1.02 2.21 GSM 900 @ DRX = 2 (USB disconnected) 2.09 mA mA mA mA mA mA mA mA mA mA mA A A A A A A Unit A mA mA mA mA mA EG915U_Series_Hardware_Design 67 / 90 LTE Standard Module Series GS M900 @ DRX = 5 (USB disconnected) 1.55 GSM 900 @ DRX = 5 (USB connected) 2.67 GSM 900 @ DRX = 9 (USB disconnected) 1.39 DCS1800 @ DRX = 2 (USB disconnected) 2.1 DCS1800 @ DRX = 5 (USB disconnected) 1.5 DCS1800 @ DRX = 5 (USB connected) 2.78 DCS1800 @ DRX = 9 (USB disconnected) 1.36 LTE-FDD @ PF = 32 (USB disconnected) 3.49 LTE-FDD @ PF = 64 (USB disconnected) 2.22 LTE-FDD @ PF = 64 (USB connected) 3.48 LTE-FDD @ PF = 128 (USB disconnected) 1.63 LTE-FDD @ PF = 256 (USB disconnected) 1.34 GSM 900 @ DRX = 5 (USB disconnected) 12.05 GSM 900 @ DRX = 5 (USB connected) 27.3 LTE-FDD @ PF = 64 (USB disconnected) 12.38 LTE-FDD @ PF = 64 (USB connected) 27.58 Idle state LTE-FDD B1 @ 22.29 dBm LTE-FDD B3 @ 22.88 dBm LTE-FDD B5 @ 23.01 dBm LTE data transfer LTE-FDD B7 @ 22.95 dBm LTE-FDD B8 @ 23.17 dBm LTE-FDD B20 @ 23.05 dBm LTE-FDD B28 @ 23.06 dBm GPRS data transfer GSM850 4DL/1UL @ 32.96 dBm GSM850 3DL/2UL @ 30.7 dBm 638 617 637 793 696 516 559 266 394 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG915U_Series_Hardware_Design 68 / 90 LTE Standard Module Series GSM850 2DL/3UL @ 28.66 dBm GSM850 1DL/4UL @ 26.41 dBm GSM900 4DL/1UL @ 32.31 dBm GSM900 3DL/2UL @ 30.7 dBm GSM900 2DL/3UL @ 28.66 dBm GSM900 1DL/4UL @ 26.63 dBm DCS1800 4DL/1UL @ 29.84 dBm DCS1800 3DL/2UL @ 27.89 dBm DCS1800 2DL/3UL @ 25.85 dBm DCS1800 1DL/4UL @ 23.78 dBm PCS1900 4DL/1UL @ 29.68 dBm PCS1900 3DL/2UL @ 27.74 dBm PCS1900 2DL/3UL @ 25.66 dBm PCS1900 1DL/4UL @ 23.59 dBm GSM850 PCL = 5 @ 32.82 dBm GSM850 PCL = 12 @ 19.08 dBm GSM850 PCL = 19 @ 6.12 dBm GSM900 PCL = 5 @ 32.34 dBm GSM900 PCL = 12 @ 19.06 dBm GSM voice call GSM900 PCL = 19 @ 5.39 dBm DCS1800 PCL = 0 @ 29.89 dBm DCS1800 PCL = 7 @ 15.96 dBm DCS1800 PCL = 15 @ 0.95 dBm PCS1900 PCL = 0 @ 29.66 dBm PCS1900 PCL = 7 @ 15.59 dBm 457 464 245 371 445 452 171 242 269 279 171 247 279 295 289 111 80 261 109 79 196 91 75 193 93 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG915U_Series_Hardware_Design 69 / 90 LTE Standard Module Series GSM voice call
(Max. Current) PCS1900 PCL = 15 @ 0.58 dBm GSM850 PCL = 5 @ 32.82 dBm GSM850 PCL = 12 @ 19.08 dBm GSM850 PCL = 19 @ 6.12 dBm GSM900 PCL = 5 @ 32.34 dBm GSM900 PCL = 12 @ 19.06 dBm GSM900 PCL = 19 @ 5.39 dBm DCS1800 PCL = 0 @ 29.89 dBm DCS1800 PCL = 7 @ 15.96 dBm DCS1800 PCL = 15 @ 0.95 dBm PCS1900 PCL = 0 @ 29.66 dBm PCS1900 PCL = 7 @ 15.59 dBm PCS1900 PCL = 15 @ 0.58 dBm Table 38: EG915U-LA Current Consumption Description Conditions OFF state Power down AT+CFUN=0 (USB disconnected) AT+CFUN=0 (USB connected) AT+CFUN=4 (USB disconnected) AT+CFUN=4 (USB connected) 75 1.88 0.46 0.19 1.72 0.44 0.19 1.13 0.30 0.16 1.10 0.33 0.15 Typ. 40 0.98 2.38 1.06 2.43 Sleep state GSM 900 @ DRX = 2 (USB disconnected) 2.20 GSM 900 @ DRX = 5 (USB disconnected) 1.65 GSM 900 @ DRX = 5 (USB connected) 3.07 GSM 900 @ DRX = 9 (USB disconnected) 1.47 DCS1800 @ DRX = 2 (USB disconnected) 2.22 mA A A A A A A A A A A A A Unit uA mA mA mA mA mA mA mA mA mA EG915U_Series_Hardware_Design 70 / 90 LTE Standard Module Series DCS1800 @ DRX = 5 (USB disconnected) 1.63 DCS1800 @ DRX = 5 (USB connected) 3.03 DCS1800 @ DRX = 9 (USB disconnected) 1.48 LTE-FDD @ PF = 32 (USB disconnected) 3.54 LTE-FDD @ PF = 64 (USB disconnected) 2.25 LTE-FDD @ PF = 64 (USB connected) 3.74 LTE-FDD @ PF = 128 (USB disconnected) 1.61 LTE-FDD @ PF = 256 (USB disconnected) 1.32 GSM 900 @ DRX = 5 (USB disconnected) 13.06 GSM 900 @ DRX = 5 (USB connected) 28.73 LTE-FDD @ PF = 64 (USB disconnected) 13.05 LTE-FDD @ PF = 64 (USB connected) 28.61 LTE-FDD B2 @ 22.63d Bm LTE-FDD B3 @ 22.88 dBm LTE-FDD B4 @ 22.94d Bm LTE-FDD B5 @ 23.01 dBm LTE-FDD B7 @ 22.95 dBm LTE-FDD B8 @ 23.17 dBm LTE-FDD B28 @ 23.06 dBm LTE-FDD B66 @ 22.81d Bm GSM850 4DL/1UL @ 32.96 dBm GSM850 3DL/2UL @ 30.7 dBm GSM850 2DL/3UL @ 28.66 dBm GSM850 1DL/4UL @ 26.41 dBm GSM900 4DL/1UL @ 32.31 dBm GSM900 3DL/2UL @ 30.7 dBm 694 667 718 622 797 644 627 725 269 394 463 473 257 372 Idle state LTE data transfer GPRS data transfer mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG915U_Series_Hardware_Design 71 / 90 LTE Standard Module Series GSM900 2DL/3UL @ 28.66 dBm GSM900 1DL/4UL @ 26.63 dBm DCS1800 4DL/1UL @ 29.84 dBm DCS1800 3DL/2UL @ 27.89 dBm DCS1800 2DL/3UL @ 25.85 dBm DCS1800 1DL/4UL @ 23.78 dBm PCS1900 4DL/1UL @ 29.68 dBm PCS1900 3DL/2UL @ 27.74 dBm PCS1900 2DL/3UL @ 25.66 dBm PCS1900 1DL/4UL @ 23.59 dBm GSM850 PCL = 5 @ 32.82 dBm GSM850 PCL = 12 @ 19.08 dBm GSM850 PCL = 19 @ 6.12 dBm GSM900 PCL = 5 @ 32.34 dBm GSM900 PCL = 12 @ 19.06 dBm GSM900 PCL = 19 @ 5.39 dBm DCS1800 PCL = 0 @ 29.89 dBm DCS1800 PCL = 7 @ 15.96 dBm DCS1800 PCL = 15 @ 0.95 dBm PCS1900 PCL = 0 @ 29.66 dBm PCS1900 PCL = 7 @ 15.59 dBm PCS1900 PCL = 15 @ 0.58 dBm 456 452 174 244 270 280 179 250 289 295 288 113 80 261 112 79 187 91 72 196 94 72 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA GSM voice call EG915U_Series_Hardware_Design 72 / 90 LTE Standard Module Series 6.4. Tx Power Table 39: EG915U-CN RF Output Power Frequency Bands Max. RF Output Power Min. RF Output Power GSM900 DCS1800 33 dBm 2 dB 5 dBm 5 dB 30 dBm 2 dB 0 dBm 5 dB LTE-FDD B1/B3/B5/B8 23 dBm 2 dB
< -39 dBm LTE-TDD B34/B38/B39/B40/B41 23 dBm 2 dB
< -39 dBm Table 40: EG915U-EU RF Output Power Frequency Bands Max. RF Output Power Min. RF Output Power GSM850/GSM900 33 dBm 2 dB 5 dBm 5 dB DCS1800/PCS1900 30 dBm 2 dB 0 dBm 5 dB LTE-FDD B1/B3/B5/B7/B8/B20/B28 23 dBm 2 dB
< -39 dBm Table 41: EG915U-LA RF Output Power Frequency Bands Max. RF Output Power Min. RF Output Power GSM850/GSM900 33 dBm 2 dB 5 dBm 5 dB DCS1800/PCS1900 30 dBm 2 dB 0 dBm 5 dB LTE-FDD B2/B3/B4/B5/B7/B8/B28/B66 23 dBm 2 dB
< -39 dBm EG915U_Series_Hardware_Design 73 / 90 LTE Standard Module Series 6.5. Rx Sensitivity Table 42: EG915U-CN Conducted RF Receiving Sensitivity Frequency GSM900 DCS1800 LTE-FDD B1 (10 MHz) LTE-FDD B3 (10 MHz) LTE-FDD B5 (10 MHz) LTE-FDD B8 (10 MHz) LTE-TDD B34 (10 MHz) LTE-TDD B38 (10 MHz) LTE-TDD B39 (10 MHz) LTE-TDD B40 (10 MHz) LTE-TDD B41 (10 MHz) Receiving Sensitivity (Typ.) Primary 3GPP (SIMO) Primary + Diversity
-108.0
-107.5
-97.3
-98
-99
-99
-98
-97.6
-98.4
-98.3
-97
-102 dBm
-102 dBm
-96.3 dBm
-93.3 dBm
-94.3 dBm
-93.3 dBm
-96.3 dBm
-96.3 dBm
-96.3 dBm
-96.3 dBm
-94.3 dBm Table 43: EG915U-EU Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency GSM850 GSM900 DCS1800 PCS1900 LTE-FDD B1 (10 MHz) Primary
-108
-106.5
-107.5
-107
-97 3GPP (SIMO) Primary + Diversity
-102 dBm
-102 dBm
-102 dBm
-102 dBm
-96.3 dBm EG915U_Series_Hardware_Design 74 / 90 LTE Standard Module Series LTE-FDD B3 (10 MHz) LTE-FDD B5 (10 MHz) LTE-FDD B7 (10 MHz) LTE-FDD B8 (10 MHz) LTE-FDD B20 (10 MHz) LTE-FDD B28 (10 MHz)
-98.3
-97.4
-96.1
-97
-98.3
-98.6 Table 44: EG915U-LA Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency GSM850 GSM900 DCS1800 PCS1900 LTE-FDD B2 (10 MHz) LTE-FDD B3 (10 MHz) LTE-FDD B4 (10 MHz) LTE-FDD B5 (10 MHz) LTE-FDD B7 (10 MHz) LTE-FDD B8 (10 MHz) LTE-TDD B28 (10 MHz) LTE-TDD B66 (10 MHz) Primary
-108
-106.8
-107.5
-107.2
-98.1
-98.2
-97.5
-97.4
-96.1
-97.5
-99.4
-97.9
-93.3 dBm
-94.3 dBm
-94.3 dBm
-93.3 dBm
-93.3 dBm
-94.8 dBm 3GPP (SIMO) Primary + Diversity
-102 dBm
-102 dBm
-102 dBm
-102 dBm
-94.3 dBm
-93.3 dBm
-96.3 dBm
-94.3 dBm
-94.3 dBm
-93.3 dBm
-93.3 dBm
-95.8 dBm EG915U_Series_Hardware_Design 75 / 90 LTE Standard Module Series 6.6. ESD If the static electricity generated by various ways discharges to the module, the module maybe damaged to a certain extent. Thus, please take proper ESD countermeasures and handling methods. For example, wearing anti-static gloves during the development, production, assembly and testing of the module;
adding ESD protective component to the ESD sensitive interfaces and points in the product design. The following table shows the electrostatics discharge characteristics of the module. Table 45: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND 5 All Antenna Interfaces 4 Other Interfaces 0.5 10 8 1 kV kV kV 6.7. Operating and Storage Temperatures Table 46: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit Operating Temperature Range 5
-35 Extended Operation Range 6 Storage Temperature Range
-40
-40
+25
+25
+25
+75
+85
+90 C C C 5 Within operating temperature range, the module is 3GPP compliant. 6 Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. EG915U_Series_Hardware_Design 76 / 90 LTE Standard Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 36: Module Top and Side Dimensions (Unit: mm) EG915U_Series_Hardware_Design 77 / 90 LTE Standard Module Series Figure 37: Module Bottom Dimensions NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. EG915U_Series_Hardware_Design 78 / 90 LTE Standard Module Series 7.2 Recommended Footprint Figure 38: Recommended Footprint (Top View)
. NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. EG915U_Series_Hardware_Design 79 / 90 LTE Standard Module Series 7.3 Top and Bottom Views Figure 39: Top and Bottom Views NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EG915U_Series_Hardware_Design 80 / 90 LTE Standard Module Series 8 Storage, Manufacturing, and Packaging 8.1 Storage Conditions Module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity should be 3560 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3. The floor life of the module is 168 hours 7 in a plant where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
The module is not stored in Recommended Storage Condition;
Violation of the third requirement above occurs;
Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
Before module repairing. 5. If needed, the pre-baking should follow the requirements below:
The module should be baked for 8 hours at 120 5 C;
All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a dry environment such as in a drying oven. 7 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. EG915U_Series_Hardware_Design 81 / 90 LTE Standard Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 8.2 Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.130.15 mm. For more details, see document [4]. The peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 40: Recommended Reflow Soldering Thermal Profile EG915U_Series_Hardware_Design 82 / 90 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Max slope: 1~3 C/s Cooling down slope: -1.5 ~ -3 C/s Max slope: 2~3 C/s LTE Standard Module Series Table 47: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 13 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE 23 C/s 4070 s 235246 C
-1.5 to -3 C/s 1 1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 3. 4. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 5. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g., selective soldering, ultrasonic soldering) that is not mentioned in document [4]. EG915U_Series_Hardware_Design 83 / 90 LTE Standard Module Series 8.3 Packaging Specifications The module adopts carrier tape packaging and details are as follow:
8.1.1. Carrier Tape Dimension details are as follow:
Figure 41: Carrier Tape Dimension Drawing Table 48: Carrier Tape Dimension Table (Unit: mm) W 44 P 32 T A0 0.35 20.2 B0 24 K0 K1 F E 3.15 6.65 20.2 1.75 EG915U_Series_Hardware_Design 84 / 90 LTE Standard Module Series 8.1.2. Plastic Reel Figure 42: Plastic Reel Dimension Drawing Table 49: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 44.5 8.1.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. One plastic reel can load 250 modules. Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, then vacuumize it. EG915U_Series_Hardware_Design 85 / 90 LTE Standard Module Series Place the vacuum-packed plastic reel into a pizza box. Put 4 pizza boxes into 1 carton and seal it. One carton can pack 1000 modules. Figure 43: Packaging Process EG915U_Series_Hardware_Design 86 / 90 LTE Standard Module Series 9 Appendix References Table 50: Related Documents Document Name
[1] Quectel_UMTS<E_EVB_User_Guide
[2] Quectel_EC200U&EG915U_Series_AT_Commands_Manual
[3] Quectel_RF_Layout_Application_Note
[4] Quectel_Module_SMT_User_Guide Table 51: Terms and Abbreviations Abbreviation Description ADC Analog-to-Digital Converter AMR-WB Adaptive Multi-Rate Wideband AP bps CA Application Processor Bits Per Second Carrier Aggregation CHAP Challenge Handshake Authentication Protocol CS CTS DCE Coding Scheme Clear To Send Data Communications Equipment DFOTA Delta Firmware Upgrade Over The Air DL DRX Downlink Discontinuous Reception EG915U_Series_Hardware_Design 87 / 90 LTE Standard Module Series DRX DTE DTR EFR ESD FDD GNSS GPS GRFC HB HR I/O LB LGA LTE MB MCU MT PA PAP PC PCB PCM PDU QAM Diversity Receive Data Terminal Equipment Data Terminal Ready Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Global Navigation Satellite System Global Positioning System General RF Control High Band Half Rate Input/Output Low Band Land Grid Array Long Term Evolution Middle Band Microcontroller Unit Mobile Terminated Power Amplifier Password Authentication Protocol Personal Computer Printed Circuit Board Pulse Code Modulation Protocol Data Unit Quadrature Amplitude Modulation EG915U_Series_Hardware_Design 88 / 90 LTE Standard Module Series QPSK Quadrature Phase Shift Keying RI RF Rx SIMO SMS SPI TDD Tx UART UL UMTS URC USB Ring Indicator Radio Frequency Receive Single Input Multiple Output Short Message Service Serial Peripheral Interface Time Division Duplexing Transmit Universal Asynchronous Receiver/Transmitter Uplink Universal Mobile Telecommunications System Unsolicited Result Code Universal Serial Bus
(U)SIM Universal Subscriber Identity Module VBAT Vmax Vnom Vmin VIHmax VIHmin VILmax VILmin VImax VImin Voltage at Battery (Pin) Maximum Voltage Value Nominal Voltage Value Minimum Voltage Value Maximum High-level Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Minimum Low-level Input Voltage Absolute Maximum Input Voltage Absolute Minimum Input Voltage EG915U_Series_Hardware_Design 89 / 90 LTE Standard Module Series VOHmax VOHmin VOLmax VOLmin VSWR Maximum High-level Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Minimum Low-level Output Voltage Voltage Standing Wave Ratio EG915U_Series_Hardware_Design 90 / 90 OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: XMR2021EM121RGL. The FCC ID/IC ID can be used only when all FCC compliance requirements are met. Antenna
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. List of applicable FCC rules This module has been tested and found to comply with part 22, part 24, part 27, part 15 requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-
radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 30 cm between the radiator &
your body. Antenna Information
1 | Label & Label Location | ID Label/Location Info | 182.61 KiB | October 20 2022 |
QUELCTEE EG915U-LA at-axxxx XX EG91 SULAXX -XXXXXXXXK SNEXXXXXXKXKKXXAAXKK IMEI: XXXXXXXXXXXXXXX FCC ID:XMR202210EG91 SULA
-EG91SULAAC-NO5-SNNSA |
SN:MPY22HV6C000059
| IMEI:865413050002392 liee|iccsl aang ie
= | 2 & eee SuilvivlinlinliviatelialanvealTaalivale
1 | Confidentiality Letter | Cover Letter(s) | 24.23 KiB | October 20 2022 |
Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Confidentiality Letter Date: 2022.09.28 Federal Communications Commission Authorization and Evaluation Division FCC ID: XMR202210EG915ULA Confidentiality Request Pursuant to FCC 47 CRF 0.457(d) and 0.459, we request that a part of the subject FCC application listed below be held permanently confidential and permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Operational Description BOM List Tune up procedure Block Diagram Schematics Further, the Applicant has spent substantial effort in developing this product, some aspects of which are deemed to be trade secret and proprietary. Having the subject information easily available to our competitors in this market would negate the advantage we have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Sincerely yours, Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511
1 | Modular Approval Request Letter | Cover Letter(s) | 212.12 KiB | October 20 2022 |
Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Request for Modular/Limited Modular Approval Date: September 29, 2022 Subject: Manufacturers Declaration for
- Modular Approval
- Split Modular Approval
- Limited Modular Approval - Limited Split Modular Approval Confidentiality Request for: XMR202210EG915ULA 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i) Requirement Met
- YES - NO(*) Details: <example The module contains a metal shield which covers all RF components and circuitry. The shield is located on the top of the board next to antenna connector>
2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii)
- YES - NO(*) Details: <example Data to the modulation circuit is buffered as described in the operational description provided with the application>
3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii)
- YES - NO(*) Details: <example The module contains its own power supply regulation. Please refer to schematic filed with this application>
4. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv)
- YES - NO(*) Details: <example The module connects to its antenna using an UFL connector which is considered a non-
standard connector. A list of antennas tested and approved with this device may be found in users manual provided with the application>
5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v)
- YES - NO(*) Details: <example The module was tested stand-alone as shown in test setup photographs filed with this application>
6. The modular transmitter must be labeled with its own FCC ID number, or use an electron display (see KDB Publication 784748). Modular Approval Requirement Requirement Met If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID:
XMR202210EG915ULA or Contains FCC ID: XMR202210EG915ULA Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi)
- YES - NO(*) Details: <example There is a label on the module as shown in the labeling exhibit filed with this application. Host specific labeling instructions are shown in the installation manual .filed with this application.>
7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii)
- YES - NO(*) Details: <example The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application.>
8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1)(viii) Details: < The module meets RF exposure in mobile configuration.>
- YES - NO(*) 070920-02b Limited Module Description When Applicable
* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval
(LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA; the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: <example - N/A>
Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Requirement Met
- Provided in Separate Cover Letter
- N/A Details: <example The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. >
2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.
- Provided in Separate Cover Letter
- N/A Details: <example N/A>
Split Modular Requirements Requirement 1. For split modular transmitters, specific descriptions for secure communications between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained. Provided in Manual
- Provided in Separate Cover Letter
- N/A Details: <example N/A >
070920-02b OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?
- YES
- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 D03, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 point systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D03, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc note that omni-directional is not considered a type) 7. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product 8. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 a. Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. b. Provide information on how to configure test modes for evaluation 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10 Sincerely,
- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.
- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511 070920-02b
1 | Power of Attorney Letter | Cover Letter(s) | 63.43 KiB | October 20 2022 |
Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Declaration of authorization Date: 2022.09.28 Product Name: LTE Module Model No.: EG915U-LA FCC ID: XMR202210EG915ULA We, the undersigned, hereby authorize MRT Technology (Suzhou) Co., Ltd to act on our behalf, to act on our behalf in all manners relating to FCC approval of our products: report submittal, related correspondence, the signing of all documents relating to these matters, and any other lawful activity necessary to obtain such certification. Any act carried out by MRT Technology (Suzhou) Co., Ltd within the scope of this authorization shall have the same effects as our own. Name Representative of agent: Marlin Chen Agent Company name: MRT Technology (Suzhou) Co., Ltd Address: D8 Building, Youxin Industrial Park, No.2 Tian'edang Rd., Wuzhong Economic Development Zone, City: Suzhou Country: China If you have any questions regarding the authorization, please dont hesitate to contact us. Sincerely yours, Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511
1 | Test Data Reuse Cover Letter | Cover Letter(s) | 177.04 KiB | October 20 2022 |
Quectel Wireless Solutions Company Limited Test Data Reuse Letter This application is intended to reuse previous test data (from FCC ID: XMR202111EG915ULA, certified on 12/02/2021 of initial application), due to the fact that the two models of products are hardware-wise identical and only the following changes have been made:
FCC ID: XMR202210EG915ULA, FCC ID: XMR202111EG915ULA, two versions of FDD IDs share the same software and hardware design. They both support CAT1. One version of EG915U-LA supports Bluetooth, Wi-Fi Scan functions, the other version doesnt support it. And all the others are the same. New version of EG915U-LA, FCC ID: XMR202210EG915ULA just Change BB chip from UIS8910DM to UIS8910DM-C1, and delete Bluetooth and Wi-Fi Scan related components, as below picture shows. Quectel Wireless Solutions Company Limited Verification test items with 1 sample:
Conducted Power Conducted Band Edge & Spurious Emission please refers to included exhibit Test Reports.pdf for detail Reuse data test items Conducted Power / EIRP/ ERP / PAPR / OBW / Modulation characteristics / Frequency stability Radiated Emission Also, both the referenced application and this new application are all subject to the same FCC rule and there is no new rule update for related rules. Accordingly, we believe that the reuse data from previous certified filing is justifiable. Thank you for your attention and please feel free to contact us, if you should have any questions. Sincerely yours, Jean Hu Quectel Wireless Solutions Company Limited. TEL: +86-21-51086236 ext 6511
1 | Tune up procedure | Parts List/Tune Up Info | 70.85 KiB | October 20 2022 |
Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Test Mode GSM850 PCS1900 LTE B2 LTE B4 LTE B5 LTE B7 LTE B66 Tune-Up Procedure Frequency Band (MHz) 824 ~ 849 1850 ~ 1910 1850 ~ 1910 1710 ~ 1755 824 ~ 849 2500 ~ 2570 1710 ~ 1780 Maximum Conducted Power (dBm) 36.00 32.00 25.70 25.70 25.70 25.70 25.70 Tune-up
(dBm) 332.0 302.0 232.7 232.7 232.7 232.7 232.7
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2022-10-20 | 2510 ~ 2560 | PCB - PCS Licensed Transmitter | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 | Effective |
2022-10-20
|
||||
1 | Applicant's complete, legal business name |
Quectel Wireless Solutions Company Limited
|
||||
1 | FCC Registration Number (FRN) |
0018988279
|
||||
1 | Physical Address |
Building 5, Shanghai Business Park PhaseIII (Area B),No.1016 Tianlin Road, Minhang District
|
||||
1 |
Building 5, Shanghai Business Park PhaseIII
|
|||||
1 |
Shanghai, N/A
|
|||||
1 |
China
|
|||||
app s | TCB Information | |||||
1 | TCB Application Email Address |
T******@timcoengr.com
|
||||
1 | TCB Scope |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
||||
app s | FCC ID | |||||
1 | Grantee Code |
XMR
|
||||
1 | Equipment Product Code |
202210EG915ULA
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
J**** H******
|
||||
1 | Telephone Number |
+8602******** Extension:
|
||||
1 | Fax Number |
+8621********
|
||||
1 |
j******@quectel.com
|
|||||
app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | PCB - PCS Licensed Transmitter | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | LTE Module | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Single Modular Approval | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Grant Comments | Output power listed is conducted. Single Modular Approval for mobile RF exposure conditions. The module antenna(s) must be installed to meet the RF exposure compliance separation distance of 20 cm and are limited in gain as described in the filing. This module can only be used with a host antenna circuit trace layout design in strict compliance with the OEM instructions provided. Integrator is responsible for any additional testing and authorization process as required. Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the FCC multi-transmitter procedures. Approved for OEM integration only. The grantee must provide OEM integrators, or end-users if marketed directly to end-users, with installation and operating instructions for satisfying FCC multi-transmitter product guidelines. This grant is valid only when the device is sold to OEM integrators and the OEM integrators are instructed to ensure that the end-user has no manual instructions to remove or install the device. This device supports LTE of 1.4, 3, 5, 10, 15 and 20 MHz bandwidth modes for FDD LTE Bands 2, 4 and 66; LTE of 5, 10, 15 and 20 MHz bandwidth modes for FDD LTE Band 7; and LTE of 1.4, 3, 5 and 10 MHz bandwidth modes for FDD LTE Band 5. This device contains functions that are not operational in U.S. Territories; this filing is applicable only for U.S. operations. | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
MRT Technology (Suzhou) Co., Ltd.
|
||||
1 | Name |
M****** C******
|
||||
1 | Telephone Number |
+86-5******** Extension:
|
||||
1 |
m******@mrt-cert.com
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 24E | 1851.5 | 1908.5 | 0.2377 | 0.0232 ppm | 2M68G7D | ||||||||||||||||||||||||||||||||||
1 | 2 | 24E | 1860 | 1900 | 0.2208 | 0.0232 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
1 | 3 | 24E | 1851.5 | 1908.5 | 0.1875 | 0.0232 ppm | 2M66W7D | ||||||||||||||||||||||||||||||||||
1 | 4 | 24E | 1860 | 1900 | 0.1871 | 0.0232 ppm | 5M47W7D | ||||||||||||||||||||||||||||||||||
1 | 5 | 27 | 1711.5 | 1778.5 | 0.2393 | 0.0205 ppm | 2M68G7D | ||||||||||||||||||||||||||||||||||
1 | 6 | 27 | 1720 | 1770 | 0.2218 | 0.0205 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
1 | 7 | 27 | 1711.5 | 1753.5 | 0.1897 | 0.0205 ppm | 2M67W7D | ||||||||||||||||||||||||||||||||||
1 | 8 | 27 | 1720 | 1745 | 0.1803 | 0.0205 ppm | 5M41W7D | ||||||||||||||||||||||||||||||||||
1 | 9 | 22H | 825.5 | 847.5 | 0.2328 | 0.0139 ppm | 2M68G7D | ||||||||||||||||||||||||||||||||||
1 | 1 | 22H | 829 | 844 | 0.2032 | 0.0139 ppm | 8M88G7D | ||||||||||||||||||||||||||||||||||
1 | 11 | 22H | 825.5 | 847.5 | 0.1945 | 0.0139 ppm | 2M67W7D | ||||||||||||||||||||||||||||||||||
1 | 12 | 22H | 829 | 844 | 0.1663 | 0.0139 ppm | 4M87W7D | ||||||||||||||||||||||||||||||||||
1 | 13 | 27 | 2510 | 2560 | 0.2344 | 0.0137 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
1 | 14 | 27 | 2510 | 2560 | 0.2234 | 0.0137 ppm | 5M16W7D | ||||||||||||||||||||||||||||||||||
1 | 15 | 22H | 824.2 | 848.8 | 1.8493 | 0.0055 ppm | 238KGXW | ||||||||||||||||||||||||||||||||||
1 | 16 | 24E | 1850.2 | 1909.8 | 0.8185 | 0.0127 ppm | 238KGXW |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC