FCC ID: XMR2023EG912UGL LTE Module

WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/6382156.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case EG912U-GL Hardware Design LTE Standard Module Version: 1.0.0 Date: 2022-08-04 Status: Preliminary LTE Standard Module At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. EG912U-GL_Hardware_Design 1 / 90 LTE Standard Module Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties

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Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved. EG912U-GL_Hardware_Design 2 / 90 LTE Standard Module Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. EG912U-GL_Hardware_Design 3 / 90 LTE Standard Module About the Document Revision History Version Date Author Description

2022-08-04 Anla HUANGA Creation of the document 1.0.0 2022-08-04 Anla HUANG/Nathan LIU Preliminary EG912U-GL_Hardware_Design 4 / 90 LTE Standard Module Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents ....................................................................................................................................................... 5 Table Index ................................................................................................................................................... 8 Figure Index ............................................................................................................................................... 10 1 Introduction ........................................................................................................................................ 12 Special Mark ................................................................................................................... 12 1.1. 2 Product Overview .............................................................................................................................. 13 Frequency Bands and Functions ................................................................................... 13 Key Features .................................................................................................................. 14 Pin Assignment .............................................................................................................. 16 Pin Description ............................................................................................................... 17 EVB Kit ........................................................................................................................... 23 2.1. 2.2. 2.3. 2.4. 2.5. 3.2.2.1. 3.2.2.2. 3.2.2.3. 3 Operating Characteristics ................................................................................................................. 24 3.1. Operating Modes ............................................................................................................ 24 3.2. Sleep Mode .................................................................................................................... 24 UART Application Scenario ............................................................................................ 25 3.2.1 3.2.2. USB Application Scenario .............................................................................................. 26 USB Application with USB Remote Wakeup Function ................................... 26 USB Application with USB Suspend/Resume and MAIN_RI Function .......... 26 USB Application without USB Suspend Function .......................................... 27 3.3. Airplane Mode ................................................................................................................ 28 3.3.1. Hardware ........................................................................................................................ 28 3.3.2. Software ......................................................................................................................... 29 3.4. Power Supply ................................................................................................................. 29 3.4.1. Power Supply Pins ......................................................................................................... 29 3.4.2. Reference Design for Power Supply .............................................................................. 30 3.4.3. Voltage Stability Requirements ...................................................................................... 30 Turn On .......................................................................................................................... 32 3.5. Turn On with PWPKEY .................................................................................................. 32 3.5.1. Turn Off .......................................................................................................................... 33 3.6. Turn Off with PWPKEY .................................................................................................. 34 3.6.1. Turn Off with AT Command ............................................................................................ 34 3.6.2. Reset ....................................................................................................................................... 35 3.7. 4 Application Interfaces ....................................................................................................................... 37 4.1. Analog Audio Interfaces ................................................................................................. 37 4.1.1. Audio Interfaces Design Considerations........................................................................ 37 EG912U-GL_Hardware_Design 5 / 90 LTE Standard Module 4.3. 4.4. 4.5. 4.6. 4.7. 4.8. 4.9. 4.10. 4.1.2. Microphone Interface Design ......................................................................................... 38 4.1.3. Earpiece Interface Design .............................................................................................. 38 USB Interface ................................................................................................................. 39 4.2. USB_BOOT Interface .............................................................................................................. 41

(U)SIM Interfaces .................................................................................................................... 42 I2C and PCM Interfaces .......................................................................................................... 44 UART Interfaces ...................................................................................................................... 46 ADC Interfaces ........................................................................................................................ 48 SPI Interface ............................................................................................................................ 49 PSM Interface* ........................................................................................................................ 50 Indication Signals .................................................................................................................... 50 NET_STATUS ......................................................................................................... 51 STATUS .................................................................................................................. 52 MAIN_RI.................................................................................................................. 52 4.10.1. 4.10.2. 4.10.3. 5 Antenna Interfaces ............................................................................................................................. 54 Main Antenna and Bluetooth/Wi-Fi Scan Antenna Interfaces........................................ 54 5.1. 5.1.1. Pin Definition .................................................................................................................. 54 5.1.2. Operating Frequency ..................................................................................................... 54 5.1.3. Reference Design of Antenna Interfaces ....................................................................... 55 GNSS Antenna Interface ......................................................................................................... 56 5.2.1. RF Routing Guidelines ................................................................................................... 58 5.3. Antenna Installation ........................................................................................................ 60 5.3.1. Antenna Design Requirement ........................................................................................ 60 5.3.2. RF Connector Recommendation ................................................................................... 60 5.2. 6 Reliability, Radio, and Electrical Characteristics ........................................................................... 62 Absolute Maximum Ratings ........................................................................................... 62 Power Supply Ratings .................................................................................................... 62 Power Consumption ....................................................................................................... 63 Tx Power ........................................................................................................................ 66 Rx Sensitivity .................................................................................................................. 67 Digital I/O Characteristic ................................................................................................ 68 ESD ................................................................................................................................ 69 Operating and Storage Temperatures ............................................................................ 69 6.1. 6.2. 6.3. 6.4. 6.5. 6.6. 6.7. 6.8. 7 Mechanical Information ..................................................................................................................... 71 Mechanical Dimensions ................................................................................................. 71 Recommended Footprint ............................................................................................... 73 Top and Bottom Views ................................................................................................... 74 7.1. 7.2. 7.3. 8 Storage, Manufacturing, and Packaging ......................................................................................... 75 8.1. Storage Conditions ......................................................................................................... 75 8.2. Manufacturing and Soldering ......................................................................................... 76 Packaging Specifications ............................................................................................... 78 8.3. 8.3.1. Carrier Tape .................................................................................................................... 78 EG912U-GL_Hardware_Design 6 / 90 LTE Standard Module 8.3.2. Plastic Reel .................................................................................................................... 79 8.3.3. Packaging Process ........................................................................................................ 79 9 Appendix References ........................................................................................................................ 81 EG912U-GL_Hardware_Design 7 / 90 LTE Standard Module Table Index Table 1: Special Mark ................................................................................................................................. 12 Table 2: Brief Introduction of the Module ................................................................................................... 13 Table 3: Frequency Bands ......................................................................................................................... 13 Table 4: Key Features ................................................................................................................................ 14 Table 5: I/O Parameters Definition ............................................................................................................. 17 Table 6: Pin Description ............................................................................................................................. 17 Table 7: Overview of Operating Modes ...................................................................................................... 24 Table 8: Pin Definition of Power Supply ..................................................................................................... 29 Table 9: Pin Definition of PWRKEY ............................................................................................................ 32 Table 10: Pin Description of RESET_N ...................................................................................................... 35 Table 11: Pin Definition of Analog Audio Interfaces ................................................................................... 37 Table 12: Functions of USB Interface ........................................................................................................ 39 Table 13: Pin Definition of USB Interface ................................................................................................... 40 Table 14: Pin Definition of USB_BOOT Interface ...................................................................................... 41 Table 15: Pin Definition of (U)SIM Interfaces ............................................................................................. 42 Table 16: Pin Definition of I2C and PCM Interfaces .................................................................................. 45 Table 17: Pin Definition of Main UART Interface ....................................................................................... 46 Table 18: Pin Definition of Debug UART Interface ..................................................................................... 46 Table 19: Auxiliary UART Interface ............................................................................................................ 47 Table 20: Pin Definition of ADC Interfaces ................................................................................................. 48 Table 21: Characteristics of ADC Interfaces .............................................................................................. 49 Table 22: Pin Definition of SPI Interface .................................................................................................... 49 Table 23: Pin Definition of PSM Interface .................................................................................................. 50 Table 24: Pin Definition of Indication Signals ............................................................................................. 50 Table 25: Pin Definition of Network Connection Status/Activity Indication ................................................ 51 Table 26: Working States of Network Connection Status/Activity Indication ............................................. 51 Table 27: Pin Definition of STATUS ............................................................................................................ 52 Table 28: Behaviors of MAIN_RI ................................................................................................................ 52 Table 29: Pin Definition of RF Antennas .................................................................................................... 54 Table 30: Operating Frequency .................................................................................................................. 54 Table 31: Pin Definition of GNSS Antenna Interface ................................................................................. 56 Table 32: GNSS Frequency ....................................................................................................................... 56 Table 33: Requirements for Antenna Design ............................................................................................. 60 Table 34: Absolute Maximum Ratings ........................................................................................................ 62 Table 35: Power Supply Ratings ................................................................................................................ 62 Table 36: Current Consumption ................................................................................................................. 63 Table 37: RF Output Power (Unit: dBm) .................................................................................................... 66 Table 38: Conducted RF Receiving Sensitivity (Unit: dBm)....................................................................... 67 Table 39: 1.8 V I/O Requirements .............................................................................................................. 68 Table 40: (U)SIM 1.8 V I/O Requirements ................................................................................................. 68 Table 41: (U)SIM 3.0 V I/O Requirements ................................................................................................. 69 EG912U-GL_Hardware_Design 8 / 90 LTE Standard Module Table 42: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity) ............................... 69 Table 43: Operating and Storage Temperatures ........................................................................................ 69 Table 44: Recommended Thermal Profile Parameters .............................................................................. 77 Table 45: Carrier Tape Dimension Table (Unit: mm) .................................................................................. 78 Table 46: Plastic Reel Dimension Table (Unit: mm) ................................................................................... 79 Table 47: Related Documents .................................................................................................................... 81 Table 48: Terms and Abbreviations ............................................................................................................ 81 EG912U-GL_Hardware_Design 9 / 90 LTE Standard Module Figure Index Figure 1: Pin Assignment (Top View) ......................................................................................................... 16 Figure 2: Sleep Mode Application via UART .............................................................................................. 25 Figure 3: Sleep Mode Application with USB Remote Wakeup .................................................................. 26 Figure 4: Sleep Mode Application with MAIN_RI ....................................................................................... 27 Figure 5: Sleep Mode Application without Suspend Function ................................................................... 28 Figure 6: Reference Design of Power Supply ............................................................................................ 30 Figure 7: Power Supply Limits during Burst Transmission ........................................................................ 31 Figure 8: Power Supply .............................................................................................................................. 31 Figure 9: Turning on the Module Using Driving Circuit .............................................................................. 32 Figure 10: Turning on the Module Using Button ........................................................................................ 32 Figure 11: Power-up Timing ....................................................................................................................... 33 Figure 12: Timing of Turning off the Module .............................................................................................. 34 Figure 13: Reference Circuit of RESET_N by Using Driving Circuit .................................................. 35 Figure 14: Reference Circuit of RESET_N by Using Button...................................................................... 35 Figure 15: Timing of Resetting the Module ................................................................................................ 36 Figure 16: Reference Design for Microphone Interface ............................................................................. 38 Figure 17: Reference Design for Earpiece Interface ................................................................................. 39 Figure 18: Reference Circuit of USB Application ....................................................................................... 40 Figure 19: Reference Circuit of USB_BOOT Interface .............................................................................. 41 Figure 20: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector ......................... 43 Figure 21: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector ........................... 43 Figure 22: Timing of PCM mode ................................................................................................................ 44 Figure 23: Reference Circuit of I2C and PCM Application with Audio Codec ........................................... 45 Figure 24: Reference Circuit with Translator Chip ..................................................................................... 47 Figure 25: Reference Circuit with Transistor Circuit .................................................................................. 48 Figure 26: Reference Circuit of Network Status Indication ........................................................................ 51 Figure 27: Reference Circuit of STATUS ................................................................................................... 52 Figure 28: Reference Circuit of RF Antennas ....................................................................................... 56 Figure 29: Reference Circuit of GNSS Antenna .................................................................................... 57 Figure 30: Microstrip Design on a 2-layer PCB ......................................................................................... 58 Figure 31: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 58 Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 59 Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 59 Figure 34: Dimensions of Receptacle (Unit: mm) ...................................................................................... 60 Figure 35: Specifications of Mated Plugs ................................................................................................... 61 Figure 36: Space Factor of Mated Connector (Unit: mm) .......................................................................... 61 Figure 37: Module Top and Side Dimensions (Unit: mm) .......................................................................... 71 Figure 38: Bottom Dimension (Bottom View) ............................................................................................. 72 Figure 39: Recommended Footprint (Top View) ........................................................................................ 73 Figure 40: Top and Bottom Views .............................................................................................................. 74 Figure 41: Recommended Reflow Soldering Thermal Profile ................................................................... 76 EG912U-GL_Hardware_Design 10 / 90 LTE Standard Module Figure 42: Carrier Tape Dimension Drawing ......................................................................................... 78 Figure 43: Plastic Reel Dimension Drawing .......................................................................................... 79 Figure 44: Packaging Process ................................................................................................................... 80 EG912U-GL_Hardware_Design 11 / 90 LTE Standard Module 1 Introduction This document defines the EG912U-GL module and describes its air interfaces and hardware interfaces which relate to customers applications. It can help customers quickly understand interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, customers can use this module to design and to set up mobile applications easily. 1.1. Special Mark Table 1: Special Mark Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of such model is currently unavailable. EG912U-GL_Hardware_Design 12 / 90 LTE Standard Module 2 Product Overview The EG912U-GL is a wireless communication module, which supports LTE-FDD, LTE-TDD, GSM/GPRS network data connection. It provides voice function for your special applications and also supports GNSS. Related information and details are listed in the table below:

Table 2: Brief Introduction of the Module Categories Packaging and Number of Pins LGA; 126-pin Dimensions Weight

(25 0.2) mm (29 0.2) mm (2.4 0.2) mm 3.6 0.2 g Wireless Network Functions LTE/GSM/GNSS/Bluetooth/Wi-Fi Scan 1 2.1. Frequency Bands and Functions Table 3: Frequency Bands Wireless Network Type EG912U-GL LTE-FDD LTE-TDD GSM GNSS 2 Bluetooth and Wi-Fi Scan 1 B1/B2/B3/B4/B5/B7/B8/B12/B13/

B17/B18/B19/B20/ B25/B26/B28/B66 B34/B38/B39/B40/B41 GSM850/EGSM900/DCS1800/PCS1900 GPS, GLONASS, BDS, Galileo, QZSS Bluetooth 4.2 (BR/EDR + BLE) 2.4GHz 802.11b (Rx) 1 EG912U-GL support Bluetooth and Wi-Fi Scan functions. Due to the shared antenna interface, the two functions cannot be used simultaneously. Bluetooth and Wi-Fi Scan functions are optional (both supported or not), please contact Quectel Technical Support for details. 2 GNSS function is optional. EG912U-GL_Hardware_Design 13 / 90 LTE Standard Module 2.2. Key Features Table 4: Key Features Features Description Power Supply Transmitting Power Supply voltage: 3.34.3 V Typical supply voltage: 3.8 V Class 4 for GSM850 Class 4 for EGSM900 Class 1 for DCS1800 Class 1 for PCS1900 Class 3 for LTE-FDD bands Class 3 for LTE-TDD bands LTE Features GSM Features Supports up to Cat 1 FDD/TDD Supports 1.4/3/5/10/15/20 MHz RF bandwidth Supports uplink QPSK and 16QAM Supports downlink QPSK, 16QAM, and 64QAM Max. transmission data rates:

FDD: 10 Mbps (DL)/5 Mbps (UL) TDD: 8.96 Mbps (DL)/3.1 Mbps (UL) GPRS:

Supports GPRS multi-slot class 12 Coding scheme: CS-1/CS-2/CS-3/CS-4 Max. transmission data rates: 85.6 kbps (DL)/85.6 kbps (UL) Supports TCP/UDP/PPP/NTP/NITZ/FTP/HTTP/PING/CMUX/HTTPS/

Internet Protocol Features FTPS/SSL/FILE/MQTT/MMS protocols Support PAP and CHAP for PPP connections SMS Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: (U)SIM card and ME; ME by default

(U)SIM Interfaces Supports USIM/SIM card: 1.8/3.0 V USB Interface UART Interfaces Compliant with USB 2.0 specification (slave mode only), with maximum transmission rate up to 480 Mbps Used for AT command communication, data transmission, software debugging, firmware upgrade Supports USB serial drivers for Windows 7/8/8.1/10, Linux 2.65.18, and Android 4.x12.x Main UART Used for AT command communication and data transmission Baud rates: up to 921600 bps; 115200 bps by default EG912U-GL_Hardware_Design 14 / 90 LTE Standard Module Supports RTS and CTS hardware flow control Debug UART Used for log output Baud rate: 921600 bps Cannot be used as a general-purpose serial port Auxiliary UART The baud rate is the same as that of the Main UART SPI Interface Supports one SPI interface (master mode only) I2C Interface Supports one I2C interface PCM Interface Supports one PCM interface (slave mode only) Audio Features Supports one analog audio input and one analog audio output GSM: HR/FR/EFR/AMR/AMR-WB Supports echo cancellation and noise suppression ADC Interfaces Supports two ADC Interfaces Network Indication NET_STATUS used to indicate the network connectivity status AT Commands Compliant with 3G PP TS 27.007 and 3G PP TS 27.005 Quectel enhanced AT commands USB_BOOT Interface Supports one download control interface Antenna Interfaces Main antenna interface (ANT_MAIN) Bluetooth and Wi-Fi Scan antenna interface (ANT_BT/WIFI_SCAN) GNSS antenna interface (ANT_GNSS 2) 50 impedance Position Fixing Supports Wi-Fi Scan/GNSS 2 Temperature Range Operating temperature range: -35 to +75 C 3 Extended temperature range: -40 to +85 C 4 Storage temperature range: -40 to +90 C Firmware Upgrade Via USB interface and DFOTA RoHS All hardware components are fully compliant with EU RoHS Directive 3 Within operating temperature range, the module meets 3GPP specifications. 4 Within extended temperature range, the module remains the ability to establish and maintain functions such as voice, SMS, and data transmission, without any unrecoverable malfunction. Radio spectrum and radio network are not influenced, while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature range, the module meets 3GPP specifications again. EG912U-GL_Hardware_Design 15 / 90 LTE Standard Module 2.3. Pin Assignment The following figure illustrates the pin assignment of the module. 2 6 D N G 1 6 D N G 0 6 I N A M _ T N A 9 5 D N G 8 5 D N G D E V R E S E R 7 5 N A C S _ I F W I

T B _ T N A 6 5 D N G 5 5 D N G 4 5 3 5 F R _ T A B V 2 5 F R _ T A B V 1 5 D E V R E S E R 0 5 D N G 1 PSM_IND 2 ADC1 3 GND 4 PCM_CLK 5 PCM_SYNC 6 PCM_DIN 7 PCM_DOUT 8 US B_VBUS 9 US B_DP 10 USB_DM 11 RE SERVED 12 RE SERVED 13 RE SERVED 14 RESERVED 15 PWRK EY 16 RESERVED 17 RESET_N 18 W_DISABLE#

103 103 RE SERVED 114 RE SERVED 82 GND 81 GND 80 GND 79 GND 103 113 RESERVED 112 RE SERVED 104 RE SERVED 115 RE SERVED 102 GND 101 GND 100 GND 99 RESERVED 118 RE SERVED 2 111 RESERVED 63 RESERVED 83 USIM2_DE T 98 RESERVED 78 RESERVED 64 SPI_DOUT 84 USIM2_CLK 119 MIC_N 126 MIC_P 97 RESERVED 77 GRFC 2 65 RE SERVED 85 USIM2_RS T 120 MICBIAS 125 RE SERVED 96 PSM_EINT 76 GRFC1 66 RESERVED 86 US IM2_DATA 121 SPK_P 124 RE SERVED 95 RESERVED 75 US B_BOOT 67 GND 68 GND 87 USIM2_VDD 88 SPI_DIN 122 SPK_N 123 RE SERVED 94 RESERVED 93 RESERVED 74 GND 73 GND 105 103 RESERVED 116 RE SERVED 106 RESERVED 107 RE SERVED 89 GND 69 GND 90 GND 70 GND 91 GND 71 GND 92 RESERVED 117 103 RESERVED 110 RE SERVED 72 GND 108 RESERVED 109 RESERVED 9 1 Y D A E R _ P A 0 2 S U T A T S S U T A T S _ T E N 1 2 2 2 D X R _ G B D 3 2 D X T _ G B D 4 2 0 C D A 5 2 S C _ PI S 6 2 K L C _ PI S 7 2 D X T _ X U A 8 2 D X R _ X U A 9 2 T X E _ D D V 0 3 R T D _ N A M I 1 3 D N G 49 ANT_GNSS 48 GND 47 USIM1_GND 46 USIM1_CLK 45 USIM1_DATA 44 US IM1_RST 43 USIM1_VDD 42 US IM1_DET 41 I2C_SDA 40 I2C_SCL 39 MAIN_RI 38 MAIN_DCD 37 MAIN_RTS 36 MAIN_CTS 35 MAIN_TXD 34 MAIN_RX D 33 VBAT_BB 32 VBAT_BB PSM ADC PCM/I2C Signal SPI ANT Audio Power RESERVED USB UART

(U)SI M GRFC USB_BOOT GND Figure 1: Pin Assignment (Top View) NOTE 1. USB_BOOT cannot be pulled up before the modules startup. 2. Keep NC and RESERVED pins unconnected, and connect all GND pins to ground. 3. The module supports Dual SIM Single Standby. For details, please contact Quectel Technical EG912U-GL_Hardware_Design 16 / 90 LTE Standard Module Support. 4. When using pins 18, 19, 30, 38, and 39, please note that these pins will have a period of variable level state (not controllable by software) after the module is powered on: first high level (3 V) for 2 s and then low level (0 V) for 1.2 s, before they can be configured as 1.8 V input or output. Please evaluate whether the unstable output state on power-up meets your application design requirements based on the specific usage scenario and circuit design. 2.4. Pin Description The following tables show the pin definition of the module. Table 5: I/O Parameters Definition Type AI AO AIO DI DO DIO OD PI PO Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Table 6: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 32, 33 PI Power supply for the modules baseband part Vmax = 4.3 V Vmin = 3.3 V Vnom = 3.8 V It must be provided with sufficient current of 1 A at least. EG912U-GL_Hardware_Design 17 / 90 LTE Standard Module VBAT_RF 52, 53 PI Power supply for the modules RF part VDD_EXT 29 PO Provides 1.8 V for external circuit Vnom = 1.8 V IOmax = 50 mA It must be provided with sufficient current up to 2.5 A. Power supply for external GPIOs pull-up circuits. Used with a 2.2 F bypass capacitor. If unused, keep it open. Power On/Off Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 15 DI Turns on/off the module RESET_N 17 DI Resets the module VILmax = 0.5 V VBAT power domain Active low. Active low. If unused, keep it open. Indication Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 20 DO NET_STATUS 21 DO Indicates the modules operation status Indicates the modules network activity status USB Interface 1.8 V power domain If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment USB_VBUS USB_DP 8 9 AI USB connection detect AIO USB differential data (+) Vmax = 5.25 V Vmin = 3.5 V Vnom = 5.0 V USB_DM 10 AIO USB differential data (-)

(U)SIM Interface If unused, keep it open. USB 2.0 compliant. Requires differential impedance of 90 . If unused, keep them open. EG912U-GL_Hardware_Design 18 / 90 LTE Standard Module Pin Name Pin No. I/O Description DC Characteristics Comment USIM1_VDD 43 PO

(U)SIM1 card power supply IOmax = 50 mA USIM1_DATA 45 DIO

(U)SIM1 card data USIM1_CLK USIM1_RST 46 44 DO

(U)SIM1 card clock DO

(U)SIM1 card reset USIM1_DET 42 DI

(U)SIM1 card hot-plug detect 1.8 V power domain USIM1_GND 47

Ground USIM2_VDD 87 PO

(U)SIM2 card power supply IOmax = 50 mA Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. If unused, keep it open. If unused, keep it open. Specified ground for (U)SIM1 card Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. USIM2_DATA 86 DIO

(U)SIM2 card data USIM2_CLK USIM2_RST 84 85 DO

(U)SIM2 card clock DO

(U)SIM2 card reset USIM2_DET 83 DI

(U)SIM2 card hot-plug detect 1.8 V power domain If unused, keep it open. Main UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment MAIN_CTS 36 DO DTE clear to send signal to DCE 1.8 V power domain MAIN_RTS 37 DI DTE request to send signal to DCE Connect to DTEs CTS. If unused, keep it open. Connect to DTEs RTS. If unused, keep it EG912U-GL_Hardware_Design 19 / 90 LTE Standard Module MAIN_RXD MAIN_DCD MAIN_TXD MAIN_RI 34 38 35 39 DI Main UART receive DO Main UART data carrier detect DO Main UART transmit DO Main UART ring indication MAIN_DTR 30 DI Main UART data terminal ready Auxiliary UART Interface open. If unused, keep them open. Pin Name Pin No. I/O Description DC Characteristics Comment AUX_TXD AUX_RXD 27 28 DO Auxiliary UART transmit DI Auxiliary UART receive 1.8 V power domain If unused, keep them open. Debug UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment DBG_RXD DBG_TXD 22 23 I2C Interface DI Debug UART receive DO Debug UART transmit 1.8 V power domain If unused, keep them open. Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SCL 40 OD I2C serial clock I2C_SDA 41 OD I2C serial data External pull-up resistor is required. 1.8 V power domain only. If unused, keep them open. PCM Interface Pin Name Pin No. I/O Description DC Characteristics Comment PCM_SYNC PCM_CLK PCM_DIN 5 4 6 DI DI DI PCM data frame sync PCM clock 1.8 V power domain PCM data input If unused, keep them open. Support slave mode only. EG912U-GL_Hardware_Design 20 / 90 LTE Standard Module PCM_DOUT 7 DO PCM data output RF Antenna Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment ANT_MAIN 60 AIO Main antenna interface ANT_BT/

WIFI_SCAN 56 AIO The shared interface for Bluetooth and Wi-Fi Scan ANT_GNSS 49 AI GNSS antenna interface GRFC Antenna Tuner Control Interface*

50 impedance. Bluetooth and Wi-Fi Scan cannot be used at the same time. Wi-Fi Scan antenna can only receive but not transmit. 50 impedance. If unused, keep it open. 50 impedance. Pin Name Pin No. I/O Description DC Characteristics Comment GRFC1 GRFC2 76 77 DO DO SPI Interface Generic RF Controller If unused, keep them open. Pin Name Pin No. I/O Description DC Characteristics Comment SPI_CLK SPI_CS SPI_DIN SPI_DOUT ADC Interface 26 25 88 64 DO SPI clock DO SPI chip select DI SPI master mode input DO SPI master mode output 1.8 V power domain If unused, keep them open. Pin Name Pin No. I/O Description DC Characteristics Comment ADC0 ADC1 24 2 AI AI Analog Audio Interfaces General-purpose ADC interfaces Voltage range:

0 V to VBAT If unused, keep them open. EG912U-GL_Hardware_Design 21 / 90 LTE Standard Module Pin Name Pin No. I/O Description DC Characteristics Comment MIC_N 119 AI MICBIAS 120 PO SPK_P 121 AO SPK_N 122 AO MIC_P 126 AI USB_BOOT Microphone analog input

(-) Bias voltage output for microphone Analog audio differential output (+) Analog audio differential output (-) Microphone analog input

(+) Vmax = 3.0 V Vmin = 2.2 V Vnom = 2.2 V Pin Name Pin No. I/O Description DC Characteristics Comment USB_BOOT 75 DI Control pin for module to enter the download mode 1.8 V power domain. VILmin = -0.3 V VILmax = 0.6 V VIHmin = 1.26 V VIHmax = 2.0 V A circuit that enables the module to enter the download mode must be reserved. If unused, keep it open.Active high. PSM Interface*

Pin Name Pin No. I/O Description DC Characteristics Comment PSM_IND 1 DO Indicates the modules power saving mode. PSM_EINT 96 DI External interrupt pin. Wakes up the module from PSM. If unused, keep them open. Pull this pin high externally to exit power saving mode. If unused, keep them open. Other Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment W_DISABLE#

18 DI Airplane mode control 1.8 V power domain Pulled up by default. When it is in low voltage EG912U-GL_Hardware_Design 22 / 90 LTE Standard Module level, the module can enter the airplane mode. If unused, keep it open. If unused, keep it open. AP_READY 19 DI Application processor ready 1.8 V power domain GND Pin Name Pin No. GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 6774, 7982, 8991, 100102 RESERVED Pin Name Pin No. RESERVED 1114, 16, 51, 57, 63, 65, 66, 78, 9295, 9799, 103118, 123125 NOTE 1. The functions of PSM and GRFC are under development and it is currently not recommended to use them. Please consult Quectel Technical Support for details. 2. When using pins 18, 19, 30, 38, and 39, please note that these pins will have a period of variable level state (not controllable by software) after the module is powered on: first high level (3 V) for 2 s and then low level (0 V) for 1.2 s, before they can be configured as 1.8 V input or output. Please evaluate whether the unstable output state on power-up meets your application design requirements based on the specific usage scenario and circuit design. 2.5. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (UMTS&LTE EVB) with accessories to control or test the module. For more details, see document [1]. EG912U-GL_Hardware_Design 23 / 90 LTE Standard Module 3 Operating Characteristics 3.1. Operating Modes The following table briefly outlines the operating modes referred in the following chapters. Table 7: Overview of Operating Modes Mode Details Full Functionality Mode Idle Voice/Data Software is active. The module remains registered on the network and is ready to send and receive data. Network connection the power consumption is decided by network setting and data transfer rate. is ongoing. this mode, In Minimum Functionality Mode AT+CFUN=0 can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. Airplane Mode AT+CFUN=4 or W_DISABLE# pin can set the module to airplane mode. In this mode, RF function will be invalid. Sleep Mode Power Down Mode In this mode, current consumption of the module is reduced to a low level. The module remains the ability to receive paging message, SMS, voice calls and TCP/UDP data from network normally. PMU shuts down the power supply. Software is not active and serial interfaces are not accessible. However, operating voltage connected to VBAT pins remain applied. NOTE For more details about AT commands, see document [2]. 3.2. Sleep Mode The module is able to reduce its current consumption to an ultra-low value in the sleep mode. The EG912U-GL_Hardware_Design 24 / 90 LTE Standard Module following chapters describe power saving procedures of the module. 3.2.1 UART Application Scenario If the host communicates with module via UART interface, the following preconditions should be met to make the module enter sleep mode. Execute AT+QSCLK=1 to enable sleep mode. Drive MAIN_DTR to high level. The following figure shows the connection between the module and the host. Module MAIN_RXD MAIN_TXD MAIN_RI MAIN_DTR AP_READY GND Host TXD RXD EINT GPIO GPIO GND Figure 2: Sleep Mode Application via UART Driving MAIN_DTR low will wake up the module. When the module has a URC to report, the URC will trigger the behavior of MAIN_RI pin. See Chapter 4.10.3 for details about MAIN_RI behaviors. NOTE When using AP_READY, MAIN_DTR, and MAIN_RI (pins 19, 30, and 39), please note that these pins will have a period of variable level state (not controllable by software) after the module is powered on:

first high level (3 V) for 2 s and then low level (0 V) for 1.2 s, before they can be configured as 1.8 V input or output. Please evaluate whether the unstable output state on power-up meets your application design requirements based on the specific usage scenario and circuit design. EG912U-GL_Hardware_Design 25 / 90 LTE Standard Module 3.2.2. USB Application Scenario 3.2.2.1. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup function, three preconditions must be met to make the module enter the sleep mode:

Execute AT+QSCLK=1 command to enable the sleep mode. Ensure the MAIN_DTR is held at a high level or keep it open. Ensure the hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure illustrates the connection between the module and the host. Module USB_VBUS USB_DP USB_DM AP_READY GND MCU VDD USB_DP USB_DM GPIO GND Figure 3: Sleep Mode Application with USB Remote Wakeup You can wake up the module by sending data to it through USB. When the module has a URC to report, the module will send remote wake-up signals to USB bus to wake up the host. NOTE USB suspend is supported on Linux system but not on Windows system. 3.2.2.2. USB Application with USB Suspend/Resume and MAIN_RI Function If the host supports USB suspend/resume, but does not support remote wake-up function, the MAIN_RI signal is needed to wake up the host. EG912U-GL_Hardware_Design 26 / 90 LTE Standard Module In this case, three preconditions can make the module enter the sleep mode. Execute AT+QSCLK=1 to enable sleep mode. Ensure the MAIN_DTR is held at high level or keep it open. Ensure the hosts USB bus, which is connected with the modules USB interface, enters suspend state. The following figure illustrates the connection between the module and the host. Module USB_VBUS USB_DP USB_DM AP_READY MAIN_RI GND MCU VDD USB_DP USB_DM GPIO EINT GND Figure 4: Sleep Mode Application with MAIN_RI You can wake up the module by sending data to it through USB. When the module has a URC to report, the URC will trigger the behaviors of MAIN_RI pin. See Chapter 4.10.3 for details about MAIN_RI behaviors. NOTE USB suspend is supported on Linux system but not on Windows system. 3.2.2.3. USB Application without USB Suspend Function If the host does not support USB suspend function, disconnect USB_VBUS with an external control circuit to make the module enter into sleep mode. Execute AT+QSCLK=1 command to enable sleep mode. Ensure the MAIN_DTR is held at a high level or keep it open. Disconnect the USB_VBUS. The following figure illustrates the connection between the module and the host. EG912U-GL_Hardware_Design 27 / 90 LTE Standard Module Module Host Power Switch USB_VBUS USB_DP USB_DM MAIN_RI AP_READY GND GPIO VDD USB_DP USB_DM EINT GPIO GND Figure 5: Sleep Mode Application without Suspend Function You can wake up the module by turning on the power switch to supply power to USB_VBUS. NOTE 1. Please pay attention to the level match shown in dotted line between the module and the host. 2. When using AP_READY, MAIN_DTR, and MAIN_RI (pins 19, 30, and 39), please note that these pins will have a period of variable level state (not controllable by software) after the module is powered on: first high level (3 V) for 2 s and then low level (0 V) for 1.2 s, before they can be configured as 1.8 V input or output. Please evaluate whether the unstable output state on power-up meets your application design requirements based on the specific usage scenario and circuit design. 3.3. Airplane Mode When the module enters airplane mode, the RF function will be disabled and all AT commands related to it will be inaccessible. This mode can be set via the following ways. 3.3.1. Hardware The W_DISABLE# pin is pulled up by default. Its control function for airplane mode, which is disabled by default, can be enabled through AT+QCFG="airplanecontrol",1. When such a control function is enabled, you can drive it to low level to make the module enter airplane mode. EG912U-GL_Hardware_Design 28 / 90 LTE Standard Module NOTE When using W_DISABLE# (pin 18), please note that it will have a period of variable level state (not controllable by software) after the module is powered on: first high level (3 V) for 2 s and then low level

(0 V) for 1.2 s, before it can be configured as 1.8 V input or output. Please evaluate whether the unstable output state on power-up meets your application design requirements based on the specific usage scenario and circuit design. 3.3.2. Software AT+CFUN=<fun> provides the choice of functionality level through setting <fun> to 0, 1 or 4. AT+CFUN=0: Minimum functionality. Both RF function and (U)SIM functions are disabled. AT+CFUN=1: Full functionality (by default). AT+CFUN=4: RF function is disables (airplane mode). NOTE For more details about AT command, see document [2]. 3.4. Power Supply 3.4.1. Power Supply Pins The module provides 4 VBAT pins for connection with an external power supply. Two VBAT_RF pins for RF part. Two VBAT_BB pins for BB part. Table 8: Pin Definition of Power Supply Pin Name Pin No. I/O Description Min. Typ. Max. Unit VBAT_BB 32, 33 PI VBAT_RF 52, 53 PI Power supply for the modules baseband part Power supply for the modules RF part 3.3 3.8 4.3 3.3 3.8 4.3 V V EG912U-GL_Hardware_Design 29 / 90 LTE Standard Module GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 6774, 7982, 8991, 100102 3.4.2. Reference Design for Power Supply The power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of the module should be able to provide sufficient current of 3.0 A at least for the GSM or GSM & LTE and 2.0 A for the LTE only. If the voltage drops between input and output is not too high, it is suggested that an LDO should be used to supply power to the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is recommended. The following figure illustrates a reference design for +5 V input power source. The typical output of the power supply is about 3.8 V and the maximum load current is 3.0 A. Figure 6: Reference Design of Power Supply 3.4.3. Voltage Stability Requirements The power supply range of the module is from 3.3 V to 4.3 V. Please make sure the input voltage never drops below 3.3 V. EG912U-GL_Hardware_Design 30 / 90 LTE Standard Module Burst Transmission Burst Transmission Load (A) Power Supply (V) Drop Ripple Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100 F with low ESR (ESR = 0.7 ) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to the VBAT_BB and VBAT_RF pins. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT_BB trace should be no less than 2 mm; and the width of VBAT_RF trace should be no less than 2.5 mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to ensure the stability of power source, it is suggested that a TVS array of which reverse stand-off voltage is 4.7 V and peak pulse power is up to 2550 W should be used. The reference circuit is shown as below. Figure 8: Power Supply EG912U-GL_Hardware_Design 31 / 90 LTE Standard Module 3.5. Turn On 3.5.1. Turn On with PWPKEY Table 9: Pin Definition of PWRKEY Pin Name Pin No. PWRKEY 15 I/O DI Description Comment Turns on/off the module VBAT power domain. When the module is in power down mode, you can turn it on to normal mode by driving the PWRKEY pin low for at least 2 s. It is recommended to use an open drain/collector driver to control the PWRKEY. A simple reference circuit is illustrated in the following figure. PWRKEY 10 nF 2 s Turn-on pulse 4.7K 47K Figure 9: Turning on the Module Using Driving Circuit Another way to control the PWRKEY is using a button directly. When you are pressing the key, electrostatic strike may be generated from finger. Therefore, you must place a TVS component nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 10: Turning on the Module Using Button EG912U-GL_Hardware_Design 32 / 90 LTE Standard Module The power-up scenario is illustrated in the following figure. NOTE 1 VBAT 2 s PWRKEY VDD_EXT RESET_N UART USB VIL 0.5 V About 1.15 s 4 s Inactive 2.23 s I nactive Active Active Figure 11: Power-up Timing

. NOTE 1. Make sure that the VBAT is stable before pulling down PWRKEY pin. It is recommended that the time difference between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2. PWRKEY can be pulled down directly to GND with a recommended 1 k resistor if the module needs to be powered on automatically and shutdown is not needed. 3.6. Turn Off The following procedures can be used to turn off the module:

Use the PWRKEY pin. Use AT+QPOWD. EG912U-GL_Hardware_Design 33 / 90 LTE Standard Module 3.6.1. Turn Off with PWPKEY Drive the PWRKEY pin low for at least 3 s and then release PWRKEY. After this, the module executes power-down procedure. The power-down scenario is illustrated in the following figure. VBA T PWRKEY Module Status 3 s 30 s Running Power-down procedure OFF Figure 12: Timing of Turning off the Module 3.6.2. Turn Off with AT Command It is also a safe way to use AT+QPOWD to turn off the module, which is similar to turning off the module via the PWRKEY pin. Please refer to document [2] for details about AT+QPOWD command. NOTE 1. To avoid damaging internal flash, do not switch off the power supply when the module works normally. Only after shutting down the module with PWRKEY or AT command can you cut off the power supply. 2. When the PWRKEY pin has been kept pulled down directly to GND, the module will not boot automatically after being turned off with the AT command. In this case, it is necessary to forcibly disconnect the VBAT power supply and power on the module again. Therefore, we recommend to use a control circuit to drive the PWEKEY high/low to turn on/off the module instead of keeping the PWRKEY connected to GND. 3. When being turned off, the module will log out of the network. The time for logging out relates to its network status. Thus, please pay attention to the shutdown time in your design because the actual shutdown time varies according to the network status. EG912U-GL_Hardware_Design 34 / 90 LTE Standard Module 3.7. Reset The RESET_N pin can be used to reset the module. The module can be reset by driving the RESET_N pin low for at least 100 ms and then releasing it. The RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground. Table 10: Pin Description of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 17 DI Resets the module VBAT power domain. If unused, keep it open. The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. RESET_N 100 ms Reset pulse 4.7K 47K Figure 13: Reference Circuit of RESET_N by Using Driving Circuit Figure 14: Reference Circuit of RESET_N by Using Button EG912U-GL_Hardware_Design 35 / 90 LTE Standard Module The reset scenario is illustrated in the following figure. VBAT RESET_N Module Status 100 ms VIL 0.5 V Running Baseband resetting Baseband rest art Figure 15: Timing of Resetting the Module NOTE 1. Ensure that there is no large capacitance exceeding 10 nF on PWRKEY and RESET_N pins. 2. It is recommended to use RESET_N only when you fail to turn off the module with the AT+QPOWD or PWRKEY pin. EG912U-GL_Hardware_Design 36 / 90 LTE Standard Module 4 Application Interfaces 4.1. Analog Audio Interfaces The module provides one analog audio input channel and one analog audio output channel. The pin definitions are shown in the following table. Table 11: Pin Definition of Analog Audio Interfaces Pin Name Pin No. MIC_N MICBIAS SPK_P SPK_N MIC_P 119 120 121 122 126 I/O AI PO AO AO AI Description Microphone analog input (-) Bias voltage output for microphone Analog audio differential output (+) Analog audio differential output (-) Microphone analog input (+) AI channels are differential input channels, which can be applied for input of microphone (usually an electret microphone is used). AO channels are differential output channels, which can be applied for output of handset, earpiece and loudspeaker. (The module has no built-in PA, the analog audio output SPK can be directly used as handset function, and if connected with external PA, it can be used as loudspeaker function.) 4.1.1. Audio Interfaces Design Considerations It is recommended to use the electret microphone with dual built-in capacitors (e.g., 10 pF and 33 pF) for filtering out RF interference, thus reducing TDD noise. The 33 pF capacitor is applied for filtering out RF interference when the module is transmitting at EGSM900. Without placing this capacitor, TDD noise could be heard. The 10 pF capacitor here is used for filtering out RF interference at DCS1800. Note that the resonant frequency point of a capacitor largely depends on the material and production technique. Therefore, you would have to discuss with your capacitor vendors to choose the most suitable capacitor for filtering out high-frequency noises. EG912U-GL_Hardware_Design 37 / 87 LTE Standard Module The filter capacitors on the PCB board should be placed as close to the audio devices or audio interfaces as possible, and the traces should be as short as possible. They should go through the filter capacitors before arriving at other connection points. To reduce radio or other signal interference, RF antennas should be placed away from audio interfaces and audio traces. Power traces should not be parallel with and also should be far away from the audio traces. The differential audio traces must be routed according to the differential signal layout rule. 4.1.2. Microphone Interface Design The microphone channel reference circuit is shown in the following figure. Close to Module Close to Microphone MIC_BI AS 510R MIC_P 1K Module MIC_N 1K 1.5K 100 nF 2.2 F 100 nF 1.5K 510R Differential layout 10 pF 33 pF 10 pF 33 pF 10 pF 33 pF TVS 0R 0R TVS Electret Microphone Figure 16: Reference Design for Microphone Interface NOTE MIC channel is sensitive to ESD, so it is not recommended to remove the ESD components used for protecting the MIC. 4.1.3. Earpiece Interface Design The earpiece channel reference circuit is shown in the following figure:

EG912U-GL_Hardware_Design 38 / 87 LTE Standard Module Figure 17: Reference Design for Earpiece Interface 4.2. USB Interface The module provides an integrated Universal Serial Bus (USB) interface compliant with the USB 2.0 specification and supporting full-speed (12 Mbps) and high-speed (480 Mbps) modes. The USB interface can only serve as a slave device. Table 12: Functions of USB Interface Functions AT command communication Data transmission Software debugging Firmware upgrade EG912U-GL_Hardware_Design 39 / 87 LTE Standard Module Table 13: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment Typ. 5.0 V Min. 3.5 V USB_VBUS USB_DP 8 9 AI USB connection detect AIO USB differential data (+) USB 2.0 compliant. USB_DM 10 AIO USB differential data (-) Requires differential impedance of 90 . If unused, keep them open. For more details about the USB 2.0 specifications, visit http://www.usb.org/home. Reserve test points for debugging and firmware upgrade in your design. The following figure shows a reference circuit of USB interface. Figure 18: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and your MCU to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. To ensure the signal integrity of USB data lines, L1, R3, and R4 must be placed close to the module, and resistors R3 and R4 should be placed close to each other. The extra stubs of trace must be as short as possible. When designing the USB interface, you should follow the following principles to meet USB 2.0 specification. Route the USB signal traces as differential pairs with ground surrounded. The impedance of USB differential trace is 90 . Do not route signal traces under or near crystals, oscillators, magnetic devices, and RF signal traces. Route the USB differential traces in inner-layer of the PCB, and surround the traces with ground on EG912U-GL_Hardware_Design 40 / 87 LTE Standard Module that layer and ground planes above and below. Pay attention to the selection of the ESD component on the USB data line. Its stray capacitance should not exceed 2 pF and should be placed as close as possible to the USB connector. 4.3. USB_BOOT Interface The module provides a USB_BOOT interface. Pull up USB_BOOT to VDD_EXT before powering on the module, which will enter the download mode when it is turned on. In this mode, the module supports firmware upgrade over USB interface. Table 14: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 75 DI Force the module into emergency download mode 1.8 V power domain. Active high. A circuit that enables the module to enter the download mode must be reserved. If unused, keep it open. The following figure shows a reference circuit of USB_BOOT interface. Module USB_BOOT VDD_EXT Test point 2 1 3 4.7K GND TVS Close to test point Figure 19: Reference Circuit of USB_BOOT Interface EG912U-GL_Hardware_Design 41 / 87 LTE Standard Module 4.4. (U)SIM Interfaces The module provides two (U)SIM interfaces that supports Dual SIM Single Standby. The (U)SIM interfaces circuitry meets ETSI requirement and IMT-2000 specification. Either 1.8 V or 3.0 V (U)SIM card is supported. Table 15: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM1_VDD 43 PO

(U)SIM1 card power supply USIM1_DATA 45 DIO

(U)SIM1 card data USIM1_CLK 46 DO

(U)SIM1 card clock USIM1_RST 44 DO

(U)SIM1 card reset Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. USIM1_DET 42 DI

(U)SIM1 card hot-plug detect 1.8 V power domain. If unused, keep it open. USIM1_GND 47

Ground Specified ground for (U)SIM1 card USIM2_VDD 87 PO

(U)SIM2 card power supply USIM2_DATA 86 IO

(U)SIM2 card data USIM2_CLK 84 DO

(U)SIM2 card clock USIM2_RST 85 DO

(U)SIM2 card reset Either 1.8 V or 3.0 V (U)SIM card is supported and can be identified automatically by the module. USIM2_DET 83 DI

(U)SIM2 card hot-plug detect 1.8 V power domain. If unused, keep it open The module supports (U)SIM card hot-plug via the USIM_DET pin and both high- and low-level detections are supported. By default, the function is disabled, and see AT+QSIMDET in document [2] for more details. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. EG912U-GL_Hardware_Design 42 / 87 LTE Standard Module VDD_EXT USIM_VDD 51K 15K Module GND USIM_VDD USIM_RST USIM_CLK USIM1_DET USIM_DATA 0R 0R 0R 100 nF

(U)SIM Card Connector VCC RST CLK GND VPP IO Switch 33 pF 33 pF 33 pF GND GND GND Figure 20: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. USIM_VDD GND USIM_VDD USIM_RST USIM_CLK USIM_DATA 15K 0R 0R 0R Module 100 nF

(U)SIM Card Connector VCC RST CLK GND VPP IO 33 pF 33 pF 33 pF GND GND Figure 21: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector To enhance the reliability and availability of the (U)SIM card in applications, follow the criteria below in

(U)SIM circuit design:

Place (U)SIM card connector as close to the module as possible. Keep the trace length as short as possible, at most 200 mm. Keep (U)SIM card signals away from RF and VBAT traces. Ensure the bypass capacitor between USIM_VDD and GND is less than 1 F, and the capacitor should be close to the (U)SIM card connector. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and EG912U-GL_Hardware_Design 43 / 87 LTE Standard Module shield them with surrounded ground. To offer good ESD protection, it is recommended to add a TVS array of which the parasitic capacitance should be less than 15 pF. Add 0 resistors in series between the module and the

(U)SIM card to facilitate debugging. The 33 pF capacitors are used for filtering interference of EGSM900. Additionally, keep the (U)SIM peripheral circuit close to the (U)SIM card connector. The pull-up resistor on USIM_DATA can improve anti-jamming capability of the (U)SIM card. If the

(U)SIM card traces are too long, or the interference source is relatively close, it is recommended to add a pull-up resistor near the (U)SIM card connector. 4.5. I2C and PCM Interfaces The module provides one I2C interface and one pulse code modulation (PCM) interface. The PCM interface of the module only supports slave mode; therefore, the clock signal of the codec IC needs to be provided externally. PCM interface supports the short frame mode and the module can be used as the slave mode only. In short frame mode, PCM_CLK = the number of channels PCM_SYNC 16 bit, where the number of channels supports 1~4 channels, but the module will only take the data on the first channel; PCM_SYNC is equal to the audio sampling rate, which supports 8~44.1kHz. Figure 22: Timing of PCM mode EG912U-GL_Hardware_Design 44 / 87 LTE Standard Module NOTE The clocks of PCM_SYNC and PCM_CLK are provided by the codec of master device, but the provided PCM_SYNC frequency must be equal to the sampling frequency of the audio file played by the module. Table 16: Pin Definition of I2C and PCM Interfaces Pin Name Pin No. I/O Description Comment I2C_SCL I2C_SDA PCM_DIN PCM_DOUT PCM_SYNC PCM_CLK 40 41 6 7 5 4 OD I2C serial clock OD I2C serial data DI PCM data input DO PCM data output DI DI PCM data frame sync PCM clock External pull-up resistor is required. 1.8 V power domain only. If unused, keep them open. 1.8 V power domain. If unused, keep them open. The following figure shows a reference design of I2C and PCM interfaces with an external codec IC. 0R PCM_MCLK PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN I2C_SCL I2C_SDA MCLK BCLK LRCK DAC ADC SCL SDA MICBIAS INP INN LOUTP LOUTN Module K 7

. 4 K 7

. 4 1.8 V Codec S A B I Figure 23: Reference Circuit of I2C and PCM Application with Audio Codec NOTE 1. It is recommended to reserve an RC (R = 22 , C = 22 pF) circuit on the PCM traces, especially for PCM_CLK. 2. The I2C interface supports simultaneous connection of multiple peripherals except for codec IC. In EG912U-GL_Hardware_Design 45 / 87 LTE Standard Module other words, if a codec IC has been mounted on the I2C bus, no other peripherals can be mounted; if there is no codec IC on the bus, multiple peripherals can be mounted. 3. For PCM external Codec solution, it is recommended to use the clock solution provided by the module. However, if the pin 95 (configured as PCM_MCLK) provides the clock signal of audio Codec chip, it cannot be for other functions. 4.6. UART Interfaces The module provides three UART interfaces: main UART, debug UART, and auxiliary UART. Their features are described as follows. Main UART interface supports baud rates of 4800 bps, 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps, 230400 bps, 460800 bps, and 921600 bps, and the default setting is 115200 bps. It supports RTS and CTS hardware flow control. This interface is used for data transmission and AT command communication. Debug UART interface supports 921600 bps baud rate. It is used for log output. Auxiliary UART: The baud rate is the same as that of the Main UART. Table 17: Pin Definition of Main UART Interface Pin Name Pin No. I/O Description Comment MAIN_CTS MAIN_RTS MAIN_RXD MAIN_DCD MAIN_TXD MAIN_RI MAIN_DTR 36 37 34 38 35 39 30 DO DI DI DTE clear to send signal to DCE (connect to DTEs CTS) DTE request to send signal to DCE (connect to DTEs RTS) Main UART receive DO Main UART data carrier detect DO Main UART transmit DO Main UART ring indication DI Main UART data terminal ready 1.8 V power domain. If unused, keep them open. Table 18: Pin Definition of Debug UART Interface Pin Name Pin No. I/O Description Comment DBG_RXD 22 DI Debug UART receive 1.8 V power domain. EG912U-GL_Hardware_Design 46 / 87 LTE Standard Module DBG_TXD 23 DO Debug UART transmit If unused, keep them open. Table 19: Auxiliary UART Interface Pin Name Pin No. I/O Description Comment AUX_TXD AUX_RXD 27 28 DO DI Auxiliary UART transmit Auxiliary UART receive 1.8 V power domain. If unused, keep them open. The module provides 1.8 V UART interfaces. Use a level shifter if the application is equipped with a 3.3 V UART interface. A level shifter TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. VDD_EXT 0.1 F 1 0 K 120K MAIN_RI MAIN_DCD MAIN_CTS MAIN_RTS MAIN_DTR MAIN_TXD MAIN_RXD 51K VCCA VCCB 0.1 F VDD_MCU OE A1 A2 A3 A4 A5 A6 A7 A8 Translator GND B1 B2 B3 B4 B5 B6 B7 B8 RI_MCU DCD_MCU CTS_MCU Connect to the CTS of MCU Connect to the RTS of MCU RTS_MCU DTR_MCU RXD_MCU Connect to the RXD of MCU TXD_MCU Connect to the TXD of MCU 51K Figure 24: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor circuit is shown as follows. For the design of circuits in dotted lines, please refer to that of the circuits in solid lines, but please pay attention to the direction of connection. EG912U-GL_Hardware_Design 47 / 87 LTE Standard Module Figure 25: Reference Circuit with Transistor Circuit NOTE 1. Transistor circuit solution is not suitable for applications with baud rates exceeding 460 kbps. 2. Please note that the module CTS is connected to the host CTS, and the module RTS is connected to the host RTS. 3. When using pins 30, 38, and 39, please note that these pins will have a period of variable level state (not controllable by software) after the module is powered on: first high level (3 V) for 2 s and then low level (0 V) for 1.2 s, before they can be configured as 1.8 V input or output. Please evaluate whether the unstable output state on power-up meets your application design requirements based on the specific usage scenario and circuit design. 4.7. ADC Interfaces The module provides two analog-to-digital converter (ADC) interfaces. You can use AT+QADC=0 and AT+QADC=1 to read the voltage values on ADC0 and ADC1 respectively. See document [2] for more details. To improve the accuracy of ADC, surround the trace of ADC with ground. Table 20: Pin Definition of ADC Interfaces Pin Name Pin No. I/O Description Comment EG912U-GL_Hardware_Design 48 / 87 LTE Standard Module ADC0 ADC1 24 2 AI AI General-purpose ADC interfaces A 1 k series resistor is required for use. If unused, keep them open. Table 21: Characteristics of ADC Interfaces Parameter Min. Typ. ADC0 Voltage Range 0 ADC1 Voltage Range 0 ADC Resolution

12 Max. VBAT VBAT

Unit V V bits NOTE 1. The input voltage of ADC should not exceed its corresponding voltage range. 2. Do not supply any voltage to ADC pins when VBAT is removed. 3. Considering the difference of ADC voltage range among Quectel modules, when it is necessary to use ADC pins, it is strongly recommended to reserve the voltage divider circuit for better compatibility with other Quectel modules. The resistance of the divider must be less than 100 k, otherwise the measurement accuracy of the ADC will be significantly reduced. When the divider circuit is not used, the ADC pins require 1 k resistance in series. 4.8. SPI Interface The module provides an SPI interface that only supports master mode. It has a working voltage of 1.8 V and a maximum clock frequency of 25 MHz. Table 22: Pin Definition of SPI Interface Pin Name Pin No. I/O Description Comment SPI_CLK SPI_CS SPI_DIN SPI_DOUT 26 25 88 64 DO DO DI SPI clock SPI chip select SPI master mode input DO SPI master mode output 1.8 V power domain. If unused, keep them open. EG912U-GL_Hardware_Design 49 / 87 LTE Standard Module NOTE When the 4-wire SPI interface is connected to NOR Flash, it supports basic flash read, write, erase, and other operations, but you need to perform wear leveling. It does not support file system and can only be used for storage purpose. 4.9. PSM Interface*

The module supports power saving mode (PSM). It enters the PSM through the following AT commands when working normally. AT+CFUN=4: Enter airplane mode. AT+QSCLK=3: Enable PSM. AT+CFUN=1: Exit airplane mode. Pulling up the PSM_EINT pin externally or setting the timer by software will enable the module to exit PSM. Table 23: Pin Definition of PSM Interface Pin Name Pin No. I/O Description PSM_IND PSM_EINT 1 96 DO DI Indicates the modules power saving mode. External interrupt pin. Wakes up the module from PSM. 4.10. Indication Signals Table 24: Pin Definition of Indication Signals Pin Name Pin No. I/O Description Comment STATUS MAIN_RI NET_STATUS 20 39 21 DO Indicates the modules operation status DO Main UART ring indication DO Indicates the modules network activity status 1.8 V power domain. If unused, keep them open. EG912U-GL_Hardware_Design 50 / 87 LTE Standard Module 4.10.1. NET_STATUS The network indication pin NET_STATUS can drive the network status indicator. The following table describes its pin definition and working states in different network status. Table 25: Pin Definition of Network Connection Status/Activity Indication Pin Name Pin No. I/O Description DC Characteristics Comment NET_STATUS 21 DO Indicates the modules network activity status VOHmin = 1.35 V VOLmax = 0.45 V 1.8 V power domain. If unused, keep it open. Table 26: Working States of Network Connection Status/Activity Indication Pin Name State Network Status Flicker slowly (200 ms high/1800 ms low) Network searching NET_STATUS Flicker quickly (234 ms high/266 ms low) Registered on network and idle Flicker rapidly (63 ms low /62 ms high) Data transfer is ongoing Always high Voice calling Module VBAT NET_STATUS 4.7K 2.2K 47K Figure 26: Reference Circuit of Network Status Indication EG912U-GL_Hardware_Design 51 / 87 LTE Standard Module 4.10.2. STATUS The STATUS pin is an open drain output for indicating the modules operation status. It will output high level when module is powered on successfully. Table 27: Pin Definition of STATUS Pin Name Pin No. I/O Description Comment STATUS 20 DO Indicates the modules operation status 1.8 V power domain. If unused, keep it open. A reference circuit is shown as below. Figure 27: Reference Circuit of STATUS 4.10.3. MAIN_RI You can configure MAIN_RI behaviors with AT+QCFG="risignaltype","physical". No matter on which port a URC is presented, the URC will trigger the behaviors of MAIN_RI. MAIN_RI behavior can be configured flexibly. The default behaviors of the MAIN_RI are shown as below. Table 28: Behaviors of MAIN_RI State Idle Response MAIN_RI keeps at high level. EG912U-GL_Hardware_Design 52 / 87 LTE Standard Module URC MAIN_RI outputs 120 ms low pulse when a new URC returns. The MAIN_RI behaviors can be changed via AT+QCFG="urc/ri/ring". See document [2] for details. NOTE 1. The URC can be output via UART port, USB AT port, and USB modem port, which can be set by AT+QURCCFG. The default setting is USB AT port. 2. When using AP_READY and MAIN_RI (pins 19 and 39), please note that they will have a period of variable level state (not controllable by software) after the module is powered on: first high level (3 V) for 2 s and then low level (0 V) for 1.2 s, before they can be configured as 1.8 V input or output. Please evaluate whether the unstable output state on power-up meets your application design requirements based on the specific usage scenario and circuit design. EG912U-GL_Hardware_Design 53 / 87 LTE Standard Module 5 Antenna Interfaces The module provides a main antenna interface, a Wi-Fi Scan/Bluetooth antenna interface and a GNSS antenna interface. The antenna ports have an impedance of 50 . 5.1. Main Antenna and Bluetooth/Wi-Fi Scan Antenna Interfaces 5.1.1. Pin Definition Table 29: Pin Definition of RF Antennas Pin Name Pin No. I/O Description Comment ANT_GNSS ANT_MAIN 49 60 AI GNSS antenna interface 50 impedance. AIO Main antenna interface 50 impedance. ANT_BT/WIFI_SCAN 56 AIO The shared interface for Bluetooth and Wi-Fi Scan Bluetooth and Wi-Fi Scan cannot be used simultaneously; Wi-Fi Scan can only receive but not transmit. 50 impedance. If unused, keep it open. 5.1.2. Operating Frequency Table 30: Operating Frequency Operating Frequency Transmit (MHz) Receive (MHz) GSM850 EGSM900 DCS1800 PCS1900 824849 880915 17101785 18501910 869894 925960 18051880 19301990 EG912U-GL_Hardware_Design 54 / 87 LTE Standard Module LTE-FDD B1 LTE-FDD B2 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B17 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B25 LTE-FDD B26 LTE-FDD B28 LTE-FDD B66 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40 LTE-TDD B41 19201980 18501910 17101785 17101755 824849 25002570 880915 699716 777787 704716 815830 830845 832862 21102170 1930-1990 18051880 21102155 869894 26202690 925960 729746 746756 734746 860875 875890 791821 18501915 19301995 814850 703748 17101780 20102025 25702620 18801920 23002400 24962690 859894 758803 21102180 20102025 25702620 18801920 23002400 24962690 5.1.3. Reference Design of Antenna Interfaces A reference design of ANT_MAIN pin and ANT_BT/WIFI_SACN pin are shown as below. A -type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. EG912U-GL_Hardware_Design 55 / 87 LTE Standard Module Module ANT_MAIN R1 0R C1 NM ANT_BT/

WIFI_SCAN R2 0R C3 NM Main Antenna Bluetooth/

Wi-Fi Scan C2 NM C4 NM Figure 28: Reference Circuit of RF Antennas 5.2. GNSS Antenna Interface The following tables list the pin definition and frequency characteristics of the GNSS antenna interface respectively. Table 31: Pin Definition of GNSS Antenna Interface Pin Name Pin No. ANT_GNSS 49 I/O AI Description Comment GNSS antenna interface 50 impedance. If unused, keep it open. Table 32: GNSS Frequency Type GPS GLONASS Galileo Frequency 1575.42 1.023 1597.51605.8 1575.42 2.046 BDS (Compass) 1561.098 2.046 Unit MHz MHz MHz MHz EG912U-GL_Hardware_Design 56 / 87 LTE Standard Module QZSS 1575.42 MHz A reference design of GNSS antenna is shown as below:

VDD 0.1 uF 10R GNSS Antenna 47 nH 100 pF 0R NM NM Module ANT_GNSS Figure 29: Reference Circuit of GNSS Antenna NOTE 1. An external LDO can be selected to supply power according to the active antenna requirement. 2. The VDD circuit is not needed if you select a passive antenna. EG912U-GL_Hardware_Design 57 / 87 LTE Standard Module 5.2.1. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled as 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between the RF traces and the ground (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 30: Microstrip Design on a 2-layer PCB Figure 31: Coplanar Waveguide Design on a 2-layer PCB EG912U-GL_Hardware_Design 58 / 87 LTE Standard Module Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [3]. EG912U-GL_Hardware_Design 59 / 87 LTE Standard Module 5.3. Antenna Installation 5.3.1. Antenna Design Requirement Table 33: Requirements for Antenna Design Type Requirements GSM/LTE VSWR: 2 Efficiency: > 30 %

Max input power: 50 W Input impedance: 50 Cable insertion loss:

< 1 dB: LB (< 1 GHz)

< 1.5 dB: MB (12.3 GHz)

< 2 dB: HB (> 2.3 GHz) 5.3.2. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT receptacle provided by Hirose. Figure 34: Dimensions of Receptacle (Unit: mm) U.FL-LP serial mated plugs listed in the following figure can be used to match the U.FL-R-SMT. EG912U-GL_Hardware_Design 60 / 87 LTE Standard Module Figure 35: Specifications of Mated Plugs The following figure describes the space factor of mated connector. Figure 36: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com. EG912U-GL_Hardware_Design 61 / 87 LTE Standard Module 6 Reliability, Radio, and Electrical Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 34: Absolute Maximum Ratings Parameter VBAT_RF/VBAT_BB USB_VBUS Peak Current of VBAT_BB Peak Current of VBAT_RF Min.

-0.3

-0.3

Voltage on Digital Pins

-0.3 Voltage at ADC0 Voltage at ADC1 0 0 6.2. Power Supply Ratings Table 35: Power Supply Ratings Max. Unit 6.0 5.5 1.0 2.5 2.3 VBAT VBAT V V A A V V V Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT_BB and VBAT_RF The actual input voltages must be kept between the minimum 3.3 3.8 4.3 V EG912U-GL_Hardware_Design 62 / 87 LTE Standard Module and maximum values. Voltage drop during transmitting burst Maximum power control level at EGSM900 IVBAT Peak supply current

(during transmission slot) Maximum power control level at EGSM900 USB_VBUS USB connection detection

400 mV 1.7 2.5 A 3.5 5.0 5.25 V 6.3. Power Consumption Table 36: Current Consumption Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) AT+CFUN=0 (USB connected) AT+CFUN=4 (USB disconnected) AT+CFUN=4 (USB connected) 34 1.4 2.5 1.5 2.6 Sleep state EGSM900 @ DRX = 2 (USB disconnected) 2.3 EGSM900 @ DRX = 5 (USB disconnected) 1.8 EGSM900 @ DRX = 5 (USB connected) 3.3 EGSM900 @ DRX = 9 (USB disconnected) 1.6 DCS1800 @ DRX = 2 (USB disconnected) 2.3 DCS1800 @ DRX = 5 (USB disconnected) DCS1800 @ DRX = 5 (USB connected) 1.8 3.3 DCS1800 @ DRX = 9 (USB disconnected) 1.6 LTE-FDD @ PF = 32 (USB disconnected) LTE-FDD @ PF = 64 (USB disconnected) 2.9 2.1 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA EG912U-GL_Hardware_Design 63 / 87 LTE Standard Module LTE-FDD @ PF = 64 (USB connected) 3.6 LTE-FDD @ PF = 128 (USB disconnected) 1.7 LTE-FDD @ PF = 256 (USB disconnected) 1.5 LTE-TDD @ PF = 32 (USB disconnected) LTE-TDD @ PF = 64 (USB disconnected) LTE-TDD @ PF = 64 (USB connected) 3.0 2.1 3.6 LTE-TDD @ PF = 128 (USB disconnected) 1.7 LTE-TDD @ PF = 256 (USB disconnected) 1.5 EGSM900 @ DRX = 5 (USB disconnected) 14.1 EGSM900 @ DRX = 5 (USB connected) 30 LTE-FDD @ PF = 64 (USB disconnected) 14.2 LTE-FDD @ PF = 64 (USB connected) 30.2 LTE-TDD @ PF = 64 (USB disconnected) 14.3 LTE-TDD @ PF = 64 (USB connected) 30.2 LTE-FDD B1 @ 23.20 dBm LTE-FDD B2 @ 22.24 dBm LTE-FDD B3 @ 23.20 dBm LTE-FDD B4 @ 22.80 dBm LTE-FDD B5 @ 22.01 dBm LTE-FDD B7 @ 22.62 dBm LTE-FDD B8 @ 23.21 dBm LTE-FDD B12 @ 24.13 dBm LTE-FDD B13 @ 23.39 dBm LTE-FDD B17 @ 23.53 dBm LTE-FDD B18 @ 22.33 dBm LTE-FDD B19 @ 22.05 dBm 635 604 634 694 622 919 710 656 605 649 608 596 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Idle state LTE data transmission EG912U-GL_Hardware_Design 64 / 87 LTE Standard Module LTE-FDD B20 @ 23.01 dBm LTE-FDD B25 @ 22.62 dBm LTE-FDD B26 @ 23.17 dBm LTE-FDD B28 @ 23.43 dBm LTE-FDD B66 @ 22.45 dBm LTE-TDD B34 @ 22.91 dBm LTE-TDD B38 @ 23.19 dBm LTE-TDD B39 @ 23.41 dBm LTE-TDD B40 @ 23.71 dBm LTE-TDD B41 @ 23.71 dBm GSM850 4DL/1UL @ 32.95 dBm GSM850 3DL/2UL @ 30.94 dBm GSM850 2DL/3UL @ 29.02 dBm GSM850 1DL/4UL @ 27.03 dBm EGSM900 4DL/1UL @ 32.27 dBm EGSM900 3DL/2UL @ 31.01 dBm EGSM900 2DL/3UL @ 29.20 dBm EGSM900 1DL/4UL @ 27.41 dBm DCS1800 4DL/1UL @ 30.95 dBm DCS1800 3DL/2UL @ 28.76 dBm DCS1800 2DL/3UL @ 26.64 dBm DCS1800 1DL/4UL @ 24.35 dBm PCS1900 4DL/1UL @ 30.17 dBm PCS1900 3DL/2UL @ 28.08 dBm PCS1900 2DL/3UL @ 26.13 dBm PCS1900 1DL/4UL @ 24.10 dBm 652 624 658 666 732 274 407 255 394 384 234 338 396 417 230 378 447 488 189 272 310 322 168 238 276 288 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA GPRS data transmission EG912U-GL_Hardware_Design 65 / 87 LTE Standard Module GSM850 PCL = 5 @ 32.88 dBm GSM850 PCL = 12 @ 18.87 dBm GSM850 PCL = 19 @ 4.77 dBm EGSM900 PCL = 5 @ 32.72 dBm EGSM900 PCL = 12 @ 19.35 dBm EGSM900 PCL = 19 @ 4.82 dBm DCS1800 PCL = 0 @ 30.35 dBm DCS1800 PCL = 7 @ 16.39 dBm DCS1800 PCL = 15 @ 1.29 dBm PCS1900 PCL = 0 @ 30.06 dBm PCS1900 PCL = 7 @ 16.01 dBm PCS1900 PCL = 15 @ 1.29 dBm 239 90 63 257 99 64 188 80 61 172 78 61 mA mA mA mA mA mA mA mA mA mA mA mA GSM voice call 6.4. Tx Power Table 37: RF Output Power (Unit: dBm) Parameters Max. RF Output Power Receiver Sensitivity GSM850 EGSM900 DCS1800 PCS1900 LTE FDD LTE TDD BR EDR (8-DPSK) 33 dBm 2 dB 33 dBm 2 dB 30 dBm 2 dB 30 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 6 dBm 6 dBm NA NA NA NA NA NA

-89

-90 EG912U-GL_Hardware_Design 66 / 87 LTE Standard Module BLE 6 dBm

-89 6.5. Rx Sensitivity Table 38: Conducted RF Receiving Sensitivity (Unit: dBm) Receiver Sensitivity (Typ.) Primary 3GPP (SIMO) Frequency GSM850 EGSM900 DCS1800 PCS1900 LTE-FDD B1 (10 MHz) LTE-FDD B2 (10 MHz) LTE-FDD B3 (10 MHz) LTE-FDD B4 (10 MHz) LTE-FDD B5 (10 MHz) LTE-FDD B7 (10 MHz) LTE-FDD B8 (10 MHz) LTE-FDD B12 (10 MHz) LTE-FDD B13 (10 MHz) LTE-FDD B17 (10 MHz)

-108.6

-108.4

-108.1

-108.3

-98.2

-98.9

-99.0

-98.2

-99.3

-96.3

-99.2

-98.0

-99.1

-97.5 LTE-FDD B18 (10 MHz)

-99.0 LTE-FDD B19 (10 MHz) LTE-FDD B20 (10 MHz) LTE-FDD B25 (10 MHz)

-99.5

-98.9

-98.3

-102.0

-102.0

-102.0

-102.0

-96.3

-94.3

-93.3

-96.3

-94.3

-94.3

-93.3

-93.3

-93.3

-93.3

-96.3

-96.3

-93.3

-92.8 EG912U-GL_Hardware_Design 67 / 87 LTE Standard Module LTE-FDD B26 (10 MHz) LTE-FDD B28 (10 MHz) LTE-FDD B66 (10 MHz) LTE-TDD B34 (10 MHz) LTE-TDD B38 (10 MHz) LTE-TDD B39 (10 MHz)

-98.9

-99.4

-98.1

-99.0

-99.0

-99.7 LTE-TDD B40 (10 MHz)

-99.2 LTE-TDD B41 (10 MHz)

-98.6 6.6. Digital I/O Characteristic Table 39: 1.8 V I/O Requirements Parameter Description Min. 1.26

-0.3 Min. 1.7 1.26 Input high voltage Input low voltage Output high voltage 1.35 Output low voltage

Table 40: (U)SIM 1.8 V I/O Requirements Parameter Description USIM_VDD Power supply Input high voltage Input low voltage

Output high voltage 1.35 Output low voltage

VIH VIL VOH VOL VIH VIL VOH VOL

-93.8

-94.8

-96.5

-96.3

-96.3

-96.3

-96.3

-94.3 Max. Unit 2.0 0.6

0.45 Max. 1.9 0.6

0.45 V V V V Unit V V V V V EG912U-GL_Hardware_Design 68 / 87 LTE Standard Module Table 41: (U)SIM 3.0 V I/O Requirements Parameter Description USIM_VDD Power supply Min. 2.7 VIH VIL VOH VOL Input high voltage 1.95 Input low voltage

Output high voltage 2.55 Output low voltage

6.7. ESD Max. 3.05

1.0

0.45 Unit V V V V V If the static electricity generated by various ways discharges to the module, the module maybe damaged to a certain extent. Thus, please take proper ESD countermeasures and handling methods. For example, wearing anti-static gloves during the development, production, assembly and testing of the module;

adding ESD protective component to the ESD sensitive interfaces and points in the product design. The following table shows the electrostatics discharge characteristics of the module. Table 42: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND 5 All Antenna Interfaces 4 Other Interfaces 0.5 10 8 1 kV kV kV 6.8. Operating and Storage Temperatures Table 43: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit EG912U-GL_Hardware_Design 69 / 87 LTE Standard Module Operating Temperature Range 5

-35 Extended Operation Range 6 Storage Temperature Range

-40

-40

+25

+25

+25

+75

+85

+90 C C C 5 Within operating temperature range, the module is 3GPP compliant. 6 Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. EG912U-GL_Hardware_Design 70 / 87 LTE Standard Module 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 37: Module Top and Side Dimensions (Unit: mm) EG912U-GL_Hardware_Design 71 / 87 LTE Standard Module Figure 38: Bottom Dimension (Bottom View) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. EG912U-GL_Hardware_Design 72 / 87 LTE Standard Module 7.2. Recommended Footprint Figure 39: Recommended Footprint (Top View)

. NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. EG912U-GL_Hardware_Design 73 / 87 LTE Standard Module 7.3. Top and Bottom Views Figure 40: Top and Bottom Views NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EG912U-GL_Hardware_Design 74 / 87 LTE Standard Module 8 Storage, Manufacturing, and Packaging 8.1. Storage Conditions Module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity should be 3560 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition. 3. The floor life of the module is 168 hours 7 in a plant where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in Recommended Storage Condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a dry environment such as in a drying oven. 7 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. EG912U-GL_Hardware_Design 75 / 87 LTE Standard Module NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.130.15 mm. For more details, see document [4]. The peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 41: Recommended Reflow Soldering Thermal Profile EG912U-GL_Hardware_Design 76 / 87 LTE Standard Module Table 44: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 13 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE 13 C/s 4070 s 235246 C

-1.5 to -3 C/s 1 1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 3. 4. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 5. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g., selective soldering, ultrasonic soldering) that is not mentioned in document [4]. EG912U-GL_Hardware_Design 77 / 87 LTE Standard Module 8.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

8.3.1. Carrier Tape Dimension details are as follow:

Figure 42: Carrier Tape Dimension Drawing Table 45: Carrier Tape Dimension Table (Unit: mm) W 44 P 32 T A0 B0 0.35 25.5 29.5 K0 3.2 K1 5.8 F E 20.2 1.75 EG912U-GL_Hardware_Design 78 / 87 LTE Standard Module 8.3.2. Plastic Reel Figure 43: Plastic Reel Dimension Drawing Table 46: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 44.5 8.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules. Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. EG912U-GL_Hardware_Design 79 / 87 LTE Standard Module Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 cartoon box and seal it. 1 cartoon box can pack 1000 modules. Figure 44: Packaging Process EG912U-GL_Hardware_Design 80 / 87 LTE Standard Module 9 Appendix References Table 47: Related Documents Document Name

[1] Quectel_UMTS&LTE_EVB_User_Guide

[2] Quectel_EC200U&EG912U-GL_AT_Commands_Manual

[3] Quectel_RF_Layout_Application_Note

[4] Quectel_Module_SMT_User_Guide Table 48: Terms and Abbreviations Abbreviation Description ADC Analog-to-Digital Converter AMR-WB Adaptive Multi-Rate Wideband AP bps CA Application Processor Bits Per Second Carrier Aggregation CHAP Challenge Handshake Authentication Protocol CS CTS DCE Coding Scheme Clear To Send Data Communications Equipment DFOTA Delta Firmware Upgrade Over The Air DL DRX Downlink Discontinuous Reception EG912U-GL_Hardware_Design 81 / 87 LTE Standard Module DRX DTE DTR EFR ESD FDD GNSS GPS GRFC HB HR I/O LB LGA LTE MB MCU MT PA PAP PC PCB PCM PDU QAM Diversity Receive Data Terminal Equipment Data Terminal Ready Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Global Navigation Satellite System Global Positioning System General RF Control High Band Half Rate Input/Output Low Band Land Grid Array Long Term Evolution Middle Band Microcontroller Unit Mobile Terminated Power Amplifier Password Authentication Protocol Personal Computer Printed Circuit Board Pulse Code Modulation Protocol Data Unit Quadrature Amplitude Modulation EG912U-GL_Hardware_Design 82 / 87 LTE Standard Module QPSK Quadrature Phase Shift Keying RI RF Rx SIMO SMS SPI TDD Tx UART UL UMTS URC USB Ring Indicator Radio Frequency Receive Single Input Multiple Output Short Message Service Serial Peripheral Interface Time Division Duplexing Transmit Universal Asynchronous Receiver/Transmitter Uplink Universal Mobile Telecommunications System Unsolicited Result Code Universal Serial Bus

(U)SIM Universal Subscriber Identity Module VBAT Vmax Vnom Vmin VIHmax VIHmin VILmax VILmin VImax VImin Voltage at Battery (Pin) Maximum Voltage Value Nominal Voltage Value Minimum Voltage Value Maximum High-level Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Minimum Low-level Input Voltage Absolute Maximum Input Voltage Absolute Minimum Input Voltage EG912U-GL_Hardware_Design 83 / 87 LTE Standard Module VOHmax VOHmin VOLmax VOLmin VSWR Maximum High-level Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Minimum Low-level Output Voltage Voltage Standing Wave Ratio EG912U-GL_Hardware_Design 84 / 87 LTE Standard Module Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [EG912U-GL] is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: http://www.quectel.com/support/technical.htm The device could be used with a separation distance of 20cm to the human body. FCC OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. End Product Labeling When the module is installed in the host device, the FCC ID label must be visible through a window on the EG912U-GL_Hardware_Design 85 / 87 LTE Standard Module final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID:

XMR2023EG912UGL The FCC ID can be used only when all FCC compliance requirements are met. Antenna Installation

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna.

(3) Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation. Antenna type Dipole for WWAN Folded Dipole for BT GSM Peak Gain (dBi) GSM850: 2.53 GSM1900: 1.59 Bluetooth Peak Gain (dBi) BT: 0.47 LTE Peak Gain (dBi) B2: 1.59 B4: 2.00 B5: 2.53 B7: 3.00 B12: 3.95 B13: 4.45 B17: 3.95 B25: 1.59 B26: 2.53 B38: 3.00 B41: 3.00 B66: 2.00 In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful EG912U-GL_Hardware_Design 86 / 87 LTE Standard Module interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. List of applicable FCC rules This module has been tested and found to comply with part 22, part 24, part 27, part 90, 15.247 requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator &

your body. EG912U-GL_Hardware_Design 87 / 87