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Users Manual | Users Manual | 3.52 MiB | September 28 2022 / November 12 2022 | delayed release | ||
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Internal Photos | Internal Photos | 285.53 KiB | September 28 2022 / November 12 2022 | delayed release | ||
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External Photo | External Photos | 643.39 KiB | September 28 2022 / November 12 2022 | delayed release | ||
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Label and Location | ID Label/Location Info | 48.97 KiB | September 28 2022 | |||
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Appendix LTE Band12 | Test Report | 3.97 MiB | September 28 2022 | |||
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1 2 3 4 | BOM | Parts List/Tune Up Info | September 28 2022 | confidential | ||||
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BLE Test Report | Test Report | 2.80 MiB | September 28 2022 | |||
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Test Setup Photos | Test Setup Photos | 544.53 KiB | September 28 2022 / November 12 2022 | delayed release | ||
1 2 3 4 | Tune up procedure | Parts List/Tune Up Info | September 28 2022 | confidential | ||||
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DFS Test Report | Test Report | 1.85 MiB | September 28 2022 | |||
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Test Report 5G WIFI part1 | Test Report | 4.18 MiB | September 28 2022 | |||
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Test Report 5G WIFI part3 | Test Report | 3.22 MiB | September 28 2022 | |||
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Test Report | Test Report | 5.84 MiB | September 28 2022 |
1 2 3 4 | Users Manual | Users Manual | 3.52 MiB | September 28 2022 / November 12 2022 | delayed release |
SC206E Series Hardware Design Smart Module Series Version: 1.0 Date: 2022-04-22 Status: Released Smart Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:
http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-
exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. SC206E_Series_Hardware_Design 1 / 115 Smart Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties (third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-
party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved. SC206E_Series_Hardware_Design 2 / 115 Smart Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergent help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. SC206E_Series_Hardware_Design 3 / 115 Smart Module Series About the Document Revision History Version Date Author Description
2021-11-25 1.0 2022-04-22 Dorian MENG/
Waller GUO Dorian MENG/
Waller GUO Creation of the document First official release SC206E_Series_Hardware_Design 4 / 115 Smart Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents ....................................................................................................................................................... 5 Table Index ................................................................................................................................................... 8 Figure Index ............................................................................................................................................... 10 1 Introduction ........................................................................................................................................ 12 Special Mark ............................................................................................................................ 15 1.1. 2 Product Overview .............................................................................................................................. 16 Frequency Bands and Functions ............................................................................................. 16 Key Features ........................................................................................................................... 18 Functional Diagram ................................................................................................................. 22 EVB Kit..................................................................................................................................... 22 2.1. 2.2. 2.3. 2.4. 3.5. 3 Application Interfaces ....................................................................................................................... 23 3.1. General Description ................................................................................................................. 23 Pin Assignment ........................................................................................................................ 24 3.2. Pin Description ......................................................................................................................... 25 3.3. Power Supply ........................................................................................................................... 36 3.4. 3.4.1. Power Supply Pins ......................................................................................................... 36 3.4.2. Voltage Stability Requirements ...................................................................................... 36 3.4.3. Reference Design for Power Supply .............................................................................. 37 Turn On/Off .............................................................................................................................. 38 3.5.1. Turn On with PWRKEY .................................................................................................. 38 3.5.2. Turn Off .......................................................................................................................... 40 VRTC ....................................................................................................................................... 40 3.6. Power Output ........................................................................................................................... 41 3.7. 3.8. Charging Interface ................................................................................................................... 41 3.9. USB Interface (Type-C) ........................................................................................................... 43 3.10. UART Interfaces ...................................................................................................................... 45 3.11.
(U)SIM Interfaces..................................................................................................................... 47 3.12. SD Card Interface .................................................................................................................... 49 3.13. GPIO Interfaces ....................................................................................................................... 51 3.14. I2C Interfaces .......................................................................................................................... 52 3.15. ADC Interface .......................................................................................................................... 53 3.16. Motor Drive Interface ............................................................................................................... 53 3.17. LCM Interface .......................................................................................................................... 54 3.18. Flash Interface ......................................................................................................................... 56 3.19. Touch Panel Interface .............................................................................................................. 57 3.20. Camera Interfaces ................................................................................................................... 58 3.20.1. MIPI Design Considerations .......................................................................................... 61 3.21. Sensor Interface ...................................................................................................................... 62 SC206E_Series_Hardware_Design 5 / 115 Smart Module Series 3.22. Audio Interfaces ....................................................................................................................... 63 3.22.1. Reference Circuit Design for Microphone Interfaces ..................................................... 64 3.22.2. Reference Circuit Design for Earpiece Interface ........................................................... 65 3.22.3. Reference Circuit Design for Headset Interface ............................................................ 65 3.22.4. Reference Circuit Design for Lineout Interface .............................................................. 66 3.22.5. Audio Signal Design Considerations ............................................................................. 66 3.23. USB_BOOT ............................................................................................................................. 67 4 Wi-Fi/Bluetooth ................................................................................................................................... 68 4.1. Wi-Fi ......................................................................................................................................... 68 4.1.1. Wi-Fi Performance ......................................................................................................... 68 Bluetooth .................................................................................................................................. 70 4.2.1. Bluetooth Performance .................................................................................................. 71 4.2. 5 GNSS ................................................................................................................................................... 72 5.1. GNSS Performance ................................................................................................................. 72 5.2. GNSS RF Design Guidelines .................................................................................................. 73 6 Antenna Interfaces ............................................................................................................................. 74 6.1. Main Antenna and Rx-diversity Antenna Interfaces ................................................................ 74 6.1.1. Operating Frequency ..................................................................................................... 74 6.1.2. Reference Design .......................................................................................................... 77 6.2. Wi-Fi/Bluetooth Antenna Interface ........................................................................................... 77 6.3. GNSS Antenna Interface ......................................................................................................... 78 6.3.1. Reference Circuit Design for Passive GNSS Antenna .................................................. 79 6.3.2. Reference Circuit Design for Active GNSS Antenna ..................................................... 80 6.4. RF Routing Guidelines ............................................................................................................ 80 Antenna Installation ................................................................................................................. 82 6.5. 6.5.1. Antenna Requirements .................................................................................................. 82 6.5.2. RF Connector Recommendation ................................................................................... 83 7 Reliability, Radio and Electrical Characteristics ............................................................................ 85 Absolute Maximum Ratings ..................................................................................................... 85 7.1. 7.2. Power Supply Ratings ............................................................................................................. 85 7.3. Digital I/O Characteristics ........................................................................................................ 86 7.4. Operating and Storage Temperatures ..................................................................................... 87 Power Consumption ................................................................................................................ 88 7.5. Tx Power .................................................................................................................................. 94 7.6. 7.7. Rx Sensitivity ........................................................................................................................... 97 ESD Protection ........................................................................................................................ 99 7.8. 8 Mechanical Information ................................................................................................................... 100 8.1. Mechanical Dimensions ......................................................................................................... 100 8.2. Recommended Footprint ....................................................................................................... 102 Top and Bottom Views ........................................................................................................... 103 8.3. 9 Storage, Manufacturing & Packaging ............................................................................................ 104 SC206E_Series_Hardware_Design 6 / 115 Smart Module Series Storage Conditions ................................................................................................................ 104 9.1. 9.2. Manufacturing and Soldering ................................................................................................ 105 Packaging Specification ........................................................................................................ 107 9.3. 9.3.1. Plastic Reel .................................................................................................................. 107 9.3.2. Packaging Process ...................................................................................................... 108 10 Appendix References ...................................................................................................................... 109 SC206E_Series_Hardware_Design 7 / 115 Smart Module Series Table Index Table 1: Special Mark ................................................................................................................................. 15 Table 2: SC206E-CE Frequency Bands and GNSS Functions ................................................................. 16 Table 3: SC206E-EM Frequency Bands and GNSS Functions ................................................................. 17 Table 4: SC206E-NA Frequency Bands and GNSS Functions ................................................................. 17 Table 5: Key Features ................................................................................................................................ 18 Table 6: I/O Parameter Definition ............................................................................................................... 25 Table 7: Pin Description ............................................................................................................................. 25 Table 8: Power Description ........................................................................................................................ 41 Table 9: Pin Definition of Charging Interface ............................................................................................. 42 Table 10: Pin Definition of USB Interface ................................................................................................... 43 Table 11: USB Trace Length Inside the Module ......................................................................................... 45 Table 12: Pin Definition of UART Interfaces ............................................................................................... 45 Table 13: Pin Definition of (U)SIM Interfaces ............................................................................................. 47 Table 14: Pin Definition of SD Card Interface ............................................................................................ 49 Table 15: SD Card Trace Length Inside the Module .................................................................................. 50 Table 16: Pin Definition of GPIO Interfaces ............................................................................................... 51 Table 17: Pin Definition of I2C Interfaces ................................................................................................... 52 Table 18: Pin Definition of ADC Interface ................................................................................................... 53 Table 19: Pin Definition of Motor Drive Interface ....................................................................................... 53 Table 20: Pin Definition of LCM Interface .................................................................................................. 54 Table 21: Pin Definition of Flash Interface ................................................................................................. 56 Table 22: Pin Definition of Touch Panel Interface ...................................................................................... 57 Table 23: Pin Definition of Camera Interfaces ........................................................................................... 58 Table 24: MIPI Trace Length Inside the Module ........................................................................................ 61 Table 25: Pin Definition of Sensor Interface ............................................................................................... 62 Table 26: Pin Definition of Audio Interfaces ............................................................................................... 63 Table 27: Pin Definition of USB_BOOT Interface ...................................................................................... 67 Table 28: Wi-Fi Transmitting Performance ................................................................................................. 68 Table 29: Wi-Fi Receiving Performance ..................................................................................................... 69 Table 30: Bluetooth Data Rate and Version ............................................................................................... 71 Table 31: Bluetooth Transmitting and Receiving Performance .................................................................. 71 Table 32: GNSS Performance .................................................................................................................... 72 Table 33: Pin Definition of Main/Rx-diversity Antenna Interfaces .............................................................. 74 Table 34: SC206E-CE Operating Frequency ............................................................................................. 74 Table 35: SC206E-EM Operating Frequency ............................................................................................ 75 Table 36: SC206E-NA Operating Frequency ............................................................................................. 76 Table 37: Pin Definition of Wi-Fi/Bluetooth Antenna Interface ................................................................... 77 Table 38: Wi-Fi/Bluetooth Frequency ......................................................................................................... 78 Table 39: Pin Definition of GNSS Antenna Interface ................................................................................. 78 Table 40: GNSS Frequency ....................................................................................................................... 79 Table 41: Antenna Requirements ............................................................................................................... 82 SC206E_Series_Hardware_Design 8 / 115 Smart Module Series Table 42: Absolute Maximum Ratings ........................................................................................................ 85 Table 43: Power Supply Ratings ................................................................................................................ 85 Table 44: 1.8 V Digital I/O Requirements ................................................................................................... 86 Table 45: (U)SIM 1.8 V I/O Requirements ................................................................................................. 86 Table 46: (U)SIM 2.95 V I/O Requirements ............................................................................................... 86 Table 47: SD Card 1.8 V I/O Requirements ............................................................................................... 87 Table 48: SD Card 2.95 V I/O Requirements ............................................................................................. 87 Table 49: Operating and Storage Temperatures ........................................................................................ 87 Table 50: SC206E-CE Power Consumption .............................................................................................. 88 Table 51: SC206E-EM Power Consumption .............................................................................................. 90 Table 52: SC206E-NA Power Consumption .............................................................................................. 93 Table 53: SC206E-CE RF Tx Power .......................................................................................................... 94 Table 54: SC206E-EM RF Tx Power ......................................................................................................... 95 Table 55: SC206E-NA RF Tx Power .......................................................................................................... 96 Table 56: SC206E-CE RF Rx Sensitivity ................................................................................................... 97 Table 57: SC206E-EM RF Rx Sensitivity ................................................................................................... 97 Table 58: SC206E-NA RF Rx Sensitivity.................................................................................................... 98 Table 59: Electrostatic Discharge Characteristics (Temperature: 25 C, Humidity: 45 %) ........................ 99 Table 60: Recommended Thermal Profile Parameters ............................................................................ 106 Table 61: Recommended Thermal Profile Parameters ............................................................................ 107 Table 62: Plastic Reel Dimension Table (Unit: mm) ................................................................................. 108 Table 63: Related Documents .................................................................................................................. 109 Table 64: Terms and Abbreviations .......................................................................................................... 109 SC206E_Series_Hardware_Design 9 / 115 Smart Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 22 Figure 2: Pin Assignment (Top View) ......................................................................................................... 24 Figure 3: Voltage Drop Sample .................................................................................................................. 36 Figure 4: Reference Circuit for the Power Supply ..................................................................................... 37 Figure 5: Reference Circuit of Power Supply ............................................................................................. 37 Figure 6: Turn On the Module with Open Collector Driver ......................................................................... 38 Figure 7: Turn On the Module Using Button .............................................................................................. 38 Figure 8: Turn-on Timing ............................................................................................................................ 39 Figure 9: Forced Turn-off Timing ................................................................................................................ 40 Figure 10: RTC Powered by Coin Cell ....................................................................................................... 40 Figure 11: Reference Design for Battery Charging Circuit ........................................................................ 42 Figure 12: USB Interface Reference Design (OTG Supported) ................................................................ 44 Figure 13: Reference Circuit with Level Translator Chip for UART0 ......................................................... 46 Figure 14: RS-232 Level Match Circuit for UART0 .................................................................................... 46 Figure 15: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector ........................ 48 Figure 16: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector .......................... 48 Figure 17: Reference Circuit for the SD Card Interface ............................................................................. 50 Figure 18: Reference Circuit for Motor Connection ................................................................................... 54 Figure 19: Reference Circuit Design for LCM Interface ............................................................................. 55 Figure 20: Reference Design for LCM External Backlight Driving Circuit ................................................. 56 Figure 21: Reference Circuit Design for the Touch Panel Interface .......................................................... 57 Figure 22: Reference Circuit Design for 3-Camera Applications ............................................................... 60 Figure 23: Reference Circuit Design for ECM Microphone Interface ........................................................ 64 Figure 24: Reference Circuit Design for MEMS Microphone Interface ..................................................... 64 Figure 25: Reference Circuit Design for Earpiece Interface ...................................................................... 65 Figure 26: Reference Circuit Design for Headset Interface ....................................................................... 65 Figure 27: Reference Circuit Design for Lineout Interface ........................................................................ 66 Figure 28: Reference Circuit Design for Emergency Download Interface ................................................. 67 Figure 29: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces ................................. 77 Figure 30: Reference Circuit Design for Wi-Fi/Bluetooth Antenna ............................................................ 78 Figure 31: Reference Circuit Design for Passive GNSS Antenna ............................................................. 79 Figure 32: Reference Circuit Design for Active GNSS Antenna ................................................................ 80 Figure 33: Microstrip Design on a 2-layer PCB ......................................................................................... 81 Figure 34: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 81 Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 81 Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 81 Figure 37: Dimensions of the U.FL-R-SMT Receptacle (Unit: mm) .......................................................... 83 Figure 38: Mechanicals of U.FL-LP Plugs ................................................................................................. 84 Figure 39: Space Factor of Mated Connectors (Unit: mm) ........................................................................ 84 Figure 40: Module Top and Side Dimensions .......................................................................................... 100 Figure 41: Module Bottom Dimensions (Bottom View) ............................................................................ 101 SC206E_Series_Hardware_Design 10 / 115 Smart Module Series Figure 42: Recommended Footprint (Top View) ...................................................................................... 102 Figure 43: Top and Bottom Views of the Module ..................................................................................... 103 Figure 44: Recommended Reflow Soldering Thermal Profile ................................................................. 105 Figure 45: Carrier Tape Dimension Drawing ............................................................................................ 107 Figure 46: Plastic Reel Dimension Drawing ............................................................................................ 107 Figure 47: Packaging Process ................................................................................................................. 108 SC206E_Series_Hardware_Design 11 / 115 Smart Module Series 1 Introduction This document, describing SC206E series and its air and hardware interfaces connected to your applications, informs you of the interface specifications, electrical and mechanical details, as well as other related information of the module. With the application notes and user guides provided separately, you can easily use the module to design and set up mobile applications. Product Marketing NameQuectel SC206E-NA FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-
based timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2022SC206ENA 4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:
radiation, maximum antenna gain (including cable loss) must not exceed: Operating Band FCC Max Antenna Gain dBi IC Max Antenna GaindBi LTE BAND 2 LTE BAND 4 LTE BAND 5 LTE BAND 7 LTE BAND 12 LTE BAND 13 LTE BAND 14 LTE BAND 17 LTE BAND 25 LTE BAND 26(814-824) LTE BAND 26(824-849) 8.00 5.00 9.41 8.00 7.62 7.62 7.62 7.62 8.00 9.35 9.41 8.00 5.00 6.12 8.00 5.64 5.96 6.00 5.66 8.00 NA 6.12 SC206E_Series_Hardware_Design 12 / 115 Smart Module Series LTE BAND 41 LTE BAND 66 LTE BAND 71 BT WIFI 8.00 5.00 7.62 NA 8.00 5.00 5.49 NA 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;
then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: XMR2022SC206ENA or Contains FCC ID: XMR2022SC206ENA must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring SC206E_Series_Hardware_Design 13 / 115 Smart Module Series that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN
"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :
1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."
Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:
Contains IC: 10224A- 22SC206ENA or where: 10224A- 22SC206ENA is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:
"Contient IC: 10224A- 22SC206ENA" ou "o: 10224A- 22SC206ENA est le numro de certification du module". i. the device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;
ii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit;
iii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate;
iv. Omnidirectional antenna is recommended SC206E_Series_Hardware_Design 14 / 115 Smart Module Series 1.1. Special Mark Table 1: Special Mark Mark Definition
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of the model is currently unavailable. SC206E_Series_Hardware_Design 15 / 115 Smart Module Series 2 Product Overview 2.1. Frequency Bands and Functions SC206E series is a series of Smart LTE modules based on Linux operating system, and provides industrial grade performance. Its general features are listed below:
Supports worldwide LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EV-DO/CDMA, EDGE and GPRS coverage. Supports short-range wireless communication via Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0 1. Integrates GPS/GLONASS/BDS/Galileo/QZSS/SBAS/NavIC satellite positioning systems. Supports multiple audio and video codecs. Built-in high performance AdrenoTM 702 graphics processing unit. Provides multiple audio and video input/output interfaces as well as abundant GPIO interfaces. The module is available in four variants: SC206E-CE, SC206E-EM, SC206E-NA, SC206E-WF. The following tables show the supported frequency bands and network standards of the module. Table 2: SC206E-CE Frequency Bands and GNSS Functions Mode LTE-FDD LTE-TDD WCDMA EV-DO/CDMA GSM Wi-Fi 802.11a/b/g/n/ac Frequency Bands B1/B3/B5/B8 B34/B38/B39/B40/B41 B1/B8 BC0 EGSM900/DCS1800 24022482 MHz 51805825 MHz 1 The module is compliant with all mandatory Bluetooth 5.0 features, but does not support Bluetooth 5.0 optional features like 2 Mbps BLE, Advanced Advertising Extension, etc. SC206E_Series_Hardware_Design 16 / 115 Smart Module Series Bluetooth 5.0 24022480 MHz GNSS GPS: 1575.42 1.023 MHz (L1) GLONASS: 1597.51605.8 MHz (L1) BDS: 1561.098 2 .046 MHz (B1I) Galileo: 1575.42 2.046 MHz (E1) QZSS: 1575.42 1.023 MHz (L1) SBAS: 1575.42 1.023 MHz (L1) Table 3: SC206E-EM Frequency Bands and GNSS Functions Mode LTE-FDD LTE-TDD WCDMA GSM Wi-Fi 802.11a/b/g/n/ac Bluetooth 5.0 GNSS Frequency Bands B1/B2/B3/B4/B5/B7/B8/B20/B28 B38/B40/B41 B1/B2/B4/B5/B8 GSM850/EGSM900/DCS1800/PCS1900 24022482 MHz 51805825 MHz 24022480 MHz GPS: 1575.42 1.023 MHz (L1) GLONASS: 1597.51605.8 MHz (L1) BDS: 1561.098 2 .046 MHz (B1I) Galileo: 1575.42 2.046 MHz (E1) QZSS: 1575.42 1.023 MHz (L1) SBAS: 1575.42 1.023 MHz (L1) Table 4: SC206E-NA Frequency Bands and GNSS Functions Mode LTE-FDD LTE-TDD Wi-Fi 802.11a/b/g/n/ac Bluetooth 5.0 GNSS Frequency Bands B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71 B41 24022482 MHz 51805825 MHz 24022480 MHz GPS:
SC206E_Series_Hardware_Design 17 / 115 Smart Module Series 1575.42 1.023 MHz (L1) 1176.45 10.23 MHz (L5) GLONASS: 1597.51605.8 MHz (L1) BDS: 1561.098 2 .046 MHz (B1I) Galileo:
1575.42 2.046 MHz (E1) 1176.45 10.23 MHz (E5a) QZSS:
1575.42 1.023 MHz (L1) 1176.45 10.23 MHz (L5) SBAS:
1575.42 1.023 MHz (L1) 1176.45 10.23 MHz (L5) NavIC: 1176.45 10.23 (L5) Table 5: SC206E-WF Frequency Bands and GNSS Functions Mode Wi-Fi 802.11a/b/g/n/ac Bluetooth 5.0 Frequency Bands 24022482 MHz 51805825 MHz 24022480 MHz The module is a series of SMD type modules, which can be embedded into applications through its 274 pins, including 146 LCC pins and 128 LGA pins. With a compact profile of 40.5 mm 40.5 mm 2.85 mm, the module can meet most of the requirements for M2M applications such as edge device, edge computing, CPE, wireless POS, smart metering, router, data card, automotive, smart phone, digital signage, alarm panel, security and industry PDA, etc. 2.2. Key Features The following table describes the detailed features of the module. Table 5: Key Features Feature Application Processor Details 64-bit quad-core ARM Cortex-A53 microprocessor, up to 2.0 GHz 512 KB L2 cache Modem DSP Hexagon DSP v66k core SC206E_Series_Hardware_Design 18 / 115 Smart Module Series 512 KB L2 cache GPU AdrenoTM 702 GPU with 64-bit addressing, up to 845 MHz Memory (Optional) 32 GB eMMC + 2 GB LPDDR4X 32 GB eMMC + 3 GB LPDDR4X Operating System Linux*
Power Supply Supply voltage: 3.54.4 V Typical supply voltage: 3.8 V Class 4 (33 dBm 2 dB) for GSM850 Class 4 (33 dBm 2 dB) for EGSM900 Class 1 (30 dBm 2 dB) for DCS1800 Class 1 (30 dBm 2 dB) for PCS1900 Class E2 (27 dBm 3 dB) for GSM850 8-PSK Class E2 (27 dBm 3 dB) for EGSM900 8-PSK Class E2 (26 dBm 3 dB) for DCS1800 8-PSK Class E2 (26 dBm 3 dB) for PCS1900 8-PSK Class 3 (24 dBm +3/-1 dB) for EV-DO/CDMA BC0 Class 3 (24 dBm +1/-3 dB) for WCDMA bands Class 3 (23 dBm 2 dB) for LTE-FDD bands Class 3 (23 dBm 2 dB) for LTE-TDD bands SC206E-CE/EM/NA:
Supports 3GPP Rel-10 Cat 4 Supports 1.4/3/5/10/15/20 MHz RF bandwidth Supports Multiuser MIMO in DL direction Data rate (Max.):
Cat 4 FDD: 150 Mbps (DL)/ 50 Mbps (UL) Cat 4 TDD: 130 Mbps (DL)/ 30 Mbps (UL) Transmitting Power LTE Features SC206E-CE/EM:
Supports 3GPP Rel-9 DC-HSDPA, HSPA+, HSDPA. HSUPA and WCDMA Supports QPSK, 16QAM and 64QAM modulations Data rate (Max.):
UMTS Features DC-HSDPA: 42 Mbps (DL) HSUPA: 5.76 Mbps (UL) WCDMA: 384 kbps (DL)/ 384 kbps (UL) CDMA2000 Features SC206E-CE:
Supports 3GPP2 CDMA2000 1X Advanced and 1xEV-DO Rev.A EV-DO: Max 3.1 Mbps (DL)/Max 1.8 Mbps (UL) 1X Advanced: Max 307.2 kbps (DL)/Max 307.2 kbps (UL) GSM Features SC206E-CE/EM:
R99 CSD: 9.6 kbps, 14.4 kbps GPRS Supports GPRS multi-slot class 33 (33 by default) SC206E_Series_Hardware_Design 19 / 115 Smart Module Series Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max. 107 kbps (DL), 85.6 kbps (UL) EDGE Supports EDGE multi-slot class 33 (33 by default) Supports GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: MCS 19 Uplink coding schemes: MCS 19 Max. 296 kbps (DL), 236.8 kbps (UL) 2.4 GHz, 802.11b/g/n, up to 150 Mbps 5 GHz, 802.11a/n/ac, up to 433 Mbps Supports AP mode and STA mode WLAN Features Bluetooth Feature 2 Bluetooth 5.0 GNSS Features 3 SMS SC206E-CE/EM:
GPS/GLONASS/BDS/Galileo/QZSS/SBAS, L1 SC206E-NA:
GPS/GLONASS/BDS/Galileo/QZSS/SBAS/NavIC, L1 + L5 Text and PDU mode Point-to-point MO and MT SMS cell broadcast LCM Interface Supports one group of 4-lane MIPI DSI Supports up to HD+ (1680 720) @ 60 fps Camera Interfaces Supports two groups of 4-lane MIPI CSI, up to 2.5 Gbps/lane Supports two cameras (4-lane + 4-lane) or three cameras (4-lane + 2-lane
+ 1-lane) Supports up to 25 MP or 13 MP + 13 MP with dual ISP Video Codec Video encoding + decoding: 720P @ 30 fps + 1080P @ 30 fps Encoding: up to 1080P @ 30 fps; Decoding: up to 1080P @ 30 fps Audio Interfaces Audio Codec Audio inputs:
Two differential microphone inputs One single-ended microphone input Audio outputs:
Class AB stereo headphone output Class AB earpiece differential output Class AB line out differential output EVS, EVRC, EVRC-B, EVRC-WB G.711, G.729A, and G.729AB GSM-FR, GSM-EFR, GSM-HR AMR-NB, AMR-WB USB Interface Type-C interface type:
Complies with both USB 3.1 or 2.0 specifications, with transmission rating 2 The module is compliant with all mandatory Bluetooth 5.0 features, but does not support Bluetooth 5.0 optional features like 2 Mbps BLE, Advanced Advertising Extension, etc. 3 SC206E-WF does no support GNSS. SC206E_Series_Hardware_Design 20 / 115 Smart Module Series up to 5 Gbps on USB 3.1 and 480 Mbps on USB 2.0 Supports USB OTG Used for AT command communication, data transmission, software debugging, and firmware upgrade Three UART interfaces: UART0, UART1, and UART4 (debug UART) UART0: four-wire UART interface supporting RTS and CTS hardware flow control UART1: two-wire UART interface UART4 (debug UART): two-wire UART interface used for debugging by default Supports SD 3.0 Supports SD card hot-plug Two (U)SIM interfaces Supports USIM/SIM cards: 1.8/2.95 V Supports Dual SIM Dual Standby (supported by default) UART Interfaces SD Card Interface
(U)SIM Interfaces I2C Interfaces Four I2C interfaces Used for peripherals such as camera, sensor, touch panel, etc. ADC Interface One generic ADC interface, up to 15-bit resolution Real Time Clock Supported Antenna Interfaces SC206E-CE/EM/NA:
Main antenna, Rx-diversity antenna, GNSS antenna and Wi-Fi/Bluetooth antenna interfaces SC206E-WF:
Wi-Fi/Bluetooth antenna interface Physical Characteristics Temperature Range Size: (40.5 0.15) mm (40.5 0.15) mm (2.85 0.2) mm Package: LCC + LGA Weight: Approx. 10.3 g Operating temperature range 4: -35 C to +75 C Storage temperature range: -40 C to +90 C Firmware Upgrade USB interface OTA RoHS All hardware components are fully compliant with EU RoHS directive. 4 Within operating temperature range, the module meets 3GPP specifications. SC206E_Series_Hardware_Design 21 / 115 Smart Module Series 2.3. Functional Diagram The following figure shows a block diagram of the module and illustrates the major functional parts. Power management Radio frequency Baseband LPDDR4X + eMMC flash Peripheral interfaces 2.4. EVB Kit Figure 1: Functional Diagram To help you develop applications with the module conveniently, Quectel supplies an evaluation board with accessories to control or to test the module. For details, see document [1]. SC206E_Series_Hardware_Design 22 / 115 Smart Module Series 3 Application Interfaces 3.1. General Description SC206E is a series of SMD type modules with 146 LCC pins and 128 LGA pins. The following interfaces and functions are described in detail in these subsequent chapters:
Power supply VRTC Power output Charging interface USB interface UART interfaces
(U)SIM interfaces SD card interface GPIO interfaces I2C interfaces ADC interface Motor drive interface LCM interface Flash interface Touch panel interface Camera interfaces Sensor interface Audio interfaces USB_BOOT Interface SC206E_Series_Hardware_Design 23 / 115 Smart Module Series 3.2. Pin Assignment The following figure shows the pin assignment of the module. Figure 2: Pin Assignment (Top View) SC206E_Series_Hardware_Design 24 / 115 24146VBAT145VBAT144GND143GND142USB_VBUS141USB_VBUS140GND139HS_DET138HPH_L137HPH_GND136HPH_R135GND134BAT_THERM133BAT_P132GND131ANT_DRX130GND129VDD_2V8128ADC127PMU_GPIO08126VRTC125LDO_IOVDD124PMU_GPIO03123GPIO_60122GND121ANT_GNSS120GND119GPIO_15118GPIO_14117GPIO_17116GPIO_16115PMU_GPIO04114PWRKEY113GPIO_58112GPIO_57111LDO15A_1V81VBAT2VBAT3GND4MIC1_P5MIC1_M6MIC2_P7GND8EAR_P9EAR_M10LINEOUT_P11LINEOUT_M12GND13USB_DM14USB_DP15GND16RESERVED17USIM2_DET18USIM2_RST19USIM2_CLK20USIM2_DATA21USIM2_VDD22USIM1_DET23USIM1_RST24USIM1_CLK25USIM1_DATA26USIM1_VDD27GND28VIB_DRV_P29PWM30TP_INT31TP_RST32 SD_LDO433GPIO_2834UART0_TXD35UART0_RXD36UART0_CTS37UART0_RTS110GPIO_36109GPIO_34108GPIO_33107GPIO_35106GPIO_56105GPIO_99104GPIO_102103GPIO_103102GPIO_105101GPIO_104100GPIO_5599GPIO_3298GPIO_10797GPIO_3196VOL_DOWN95VOL_UP94DBG_TXD93DBG_RXD92SENSOR_I2C_SDA91SENSOR_I2C_SCL90GPIO_10689GND88GND87ANT_MAIN86GND85GND84CAM0_I2C_SDA83CAM0_I2C_SCL82CAM1_PWDN81CAM1_RST80CAM0_PWDN79CAM0_RST78GND77ANT_WIFI/BT76GND75CAM1_MCLK74CAM0_MCLK38SD_LDO2139SD_CLK40SD_CMD41SD_DATA042SD_DATA143SD_DATA244SD_DATA345SD_DET46USB_BOOT47TP_I2C_SCL48TP_I2C_SDA49LCD_RST50LCD_TE51GND52DSI_CLK_N53DSI_CLK_P54DSI_LN0_N55DSI_LN0_P56DSI_LN1_N57DSI_LN1_P58DSI_LN2_N59DSI_LN2_P60DSI_LN3_N61DSI_LN3_P62GND63CSI1_CLK_N64CSI1_CLK_P65CSI1_LN0_N66CSI1_LN0_P67CSI1_LN1_N68CSI1_LN1_P69GND70CSI1_LN3_N71CSI1_LN3_P72CSI1_LN2_N73CSI1_LN2_P186CBL_PWR_N185BAT_ID184VPH_PWR183BAT_M182GPIO_86181NFC_CLK180FLASH_LED179RESERVED178RESERVED177GPIO_112147MIC_BIAS1187GND222GND221GND220GND219GND218GND217GND216GND215GND214GND176GND148MIC3_P188GND223GND250GND249USB_CC1248GND247GND246USB_CC2245GND244GND213GND175RESERVED149MIC3_M189GND224GND251GND270USB_SS1_RX_M269GND268GND267GPIO_111266GND243GND212GND174RESERVED150USB_SS2_TX_P190GND225RESET_N252USB_SS1_RX_P265GPIO_98242RESERVED211GND173GRFC_13151USB_SS2_TX_M191GND226GND253USB_SS1_TX_M264GPIO_100241GND210GND172GND152USB_SS2_RX_P192USB_SS2_RX_M227GND254263RESERVED240GND209GND171GND153UART1_RXD193RESERVED228GND255GND262GRFC_15239GPIO_101208GND170RESERVED154UART1_TXD194GNSS_LNA_EN229GND256GND257RESERVED258GND259GND260GRFC_14261GND238GND207GND169RESERVED155MIC_BIAS3195CHG_LED230GND231GND232RESERVED233GND234GND235GND236GND237GND206GND168RESERVED156LDO17A_3V0196CSI0_CLK_P197CSI0_LN0_P198CSI0_LN1_P199CSI0_LN2_P200CSI0_LN3_P201PMU_GPIO07202GND203GND204GND205CAM1_I2C_SDA167RESERVED157CSI0_CLK_N158CSI0_LN0_N159CSI0_LN1_N160CSI0_LN2_N161CSI0_LN3_N162GND163CAM2_PWDN164CAM2_RST165CAM2_MCLK166CAM1_I2C_SCL272GND271GND273GND274GND254USB_SS1_TX_PPOWER pinsGND pinsAUDIO pinsUSB pinsUSIM pinsUART pinsGPIO pinsANT pinsTP pinsLCM pinsCAMERA pinsOTHERSRESERVED pinsSD card pins Smart Module Series 3.3. Pin Description Table 6: I/O Parameter Definition Type AI AO AIO DI DO DIO OD PI PO PIO Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Power Input/Output Table 7: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT 1, 2, 145, 146 PIO Power supply for the module VPH_PWR 184 PO Power supply for peripherals LDO15A_1V8 111 PO 1.8 V output Vmin = 3.5 V Vnom = 3.8 V Vmax = 4.4 V Vmin = 3.5 V Vnom = 3.8 V Vmax = 4.4 V Vnom = 1.8 V IOmax = 200 mA Provide sufficient current up to 3 A. It is suggested to use a TVS for surge protection. This pin is used to power peripheral devices. Maximum output current is 1 A. The power supply for LCM, sensor, cameras and I2C pull-up circuits. LDO17A_3V0 156 PO 3.0 V output Vnom = 3.0 V The power supply for TP IOmax = 192 mA and sensor. SC206E_Series_Hardware_Design 25 / 115 LDO_IOVDD 125 PO 1.8 V output Smart Module Series Vnom = 1.8 V The power is reserved for LCM and camera's IOmax = 300 mA IOVDD. This voltage is not adjustable. Vomax = 3.2 V VRTC 126 PIO Power supply for RTC VImin = 2.5 V If unused, keep it open. VDD_2V8 129 PO 2.8 V output Audio Interfaces VImax = 3.2 V Vnom = 2.8 V IOmax = 500 mA The power supply for cameras AVDD. This voltage is not adjustable. Pin Name Pin No. I/O Description DC Characteristics Comment MIC_BIAS1 147 PO Bias voltage 1 Vomin = 1.6 V The rated output current output for microphone Vomax = 2.85 V is 3 mA. MIC1_P MIC1_M MIC2_P 4 5 6 AI AI AI MIC3_P 148 AI MIC3_M 149 AI Microphone input for channel 1 (+) Microphone input for channel 1 (-) Microphone input for headset (+) Microphone input for channel 3 (+) Microphone input for channel 3 (-) MIC_BIAS3 155 PO Bias voltage 3 output for microphone Vnom = 1.8 V EAR_P EAR_M 8 9 AO Earpiece output (+) AO Earpiece output (-) LINEOUT_P 10 AO LINEOUT_M 11 AO HPH_R 136 AO HPH_GND 137 AO HPH_L 138 AO Audio line differential output (+) Audio line differential output (-) Headphone right channel output Headphone reference ground Headphone left channel output The rated output current is 3 mA. The output voltage is fixed at 1.8 V and cannot be adjusted. The typical output voltage is 2 Vrms. HS_DET 139 AI Headset hot-plug detect High level by default. SC206E_Series_Hardware_Design 26 / 115 USB Interface Pin Name Pin No. I/O Description DC Characteristics Comment Smart Module Series The maximum output current is 500 mA. 90 differential impedance. USB 2.0 standard compliant. 90 differential impedance. USB 3.1 standard compliant. USB_VBUS 141, 142 PIO OTG device. Vmin = 4.0 V Charging power input. Power supply output for Vmax = 6.0 V USB/adaptor insertion Vnom = 5.0 V detection USB_DM 13 AIO USB differential data (-) USB_DP 14 AIO USB differential data (+) USB_SS1_RX_P 252 AI USB_SS1_RX_M 270 AI USB_SS1_TX_P 254 AO USB_SS1_TX_M 253 AO USB_SS2_RX_P 152 AI USB_SS2_RX_M 192 AI USB_SS2_TX_P 150 AO USB_SS2_TX_M 151 AO USB 3.1 channel 1 superspeed receive (+) USB 3.1 channel 1 superspeed receive (-) USB 3.1 channel 1 superspeed transmit (+) USB 3.1 channel 1 superspeed transmit (-) USB 3.1 channel 2 superspeed receive (+) USB 3.1 channel 2 superspeed receive (-) USB 3.1 channel 2 superspeed transmit (+) USB 3.1 channel 2 superspeed transmit (-) USB_CC1 249 AI USB Type-C detect 1 USB_CC2 246 AI USB Type-C detect 2
(U)SIM Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment USIM1_VDD 26 PO
(U)SIM1 card power supply IOmax = 67 mA 1.8 V (U)SIM:
Vmax = 1.85 V Vmin = 1.75 V 2.95 V (U)SIM:
Vmax = 3.1 V Vmin = 2.8 V Either 1.8 V or 2.95 V
(U)SIM card is supported. SC206E_Series_Hardware_Design 27 / 115 USIM1_DATA 25 DIO
(U)SIM1 card data VILmax = 0.2 USIM1_VDD VIHmin = 0.7 USIM1_VDD VOLmax = 0.4 V VOHmin = 0.8 USIM1_VDD USIM1_CLK USIM1_RST 24 23 DO
(U)SIM1 card clock VOLmax = 0.4 V DO
(U)SIM1 card reset VOHmin = 0.8 USIM1_VDD USIM1_DET 22 DI
(U)SIM1 card hot-plug VILmax = 0.63 V detect VIHmin = 1.17 V USIM2_VDD 21 PO
(U)SIM2 card power supply USIM2_DATA 20 DIO
(U)SIM2 card data IOmax = 67 mA 1.8 V (U)SIM:
Vmax = 1.85 V Vmin = 1.75 V 2.95 V (U)SIM:
Vmax = 3.1 V Vmin = 2.8 V VILmax = 0.2 USIM2_VDD VIHmin = 0.7 USIM2_VDD VOLmax = 0.4 V VOHmin = 0.8 USIM2_VDD USIM2_CLK USIM2_RST 19 18 DO
(U)SIM2 card clock VOLmax = 0.4 V DO
(U)SIM2 card reset VOHmin = 0.8 USIM2_VDD USIM2_DET 17 DI
(U)SIM2 card hot-plug VILmax = 0.63 V detect VIHmin = 1.17 V Smart Module Series Cannot be multiplexed into a generic GPIO. Active low. Externally pull it up to 1.8 V. If unused, keep it open. Either 1.8 V or 2.95 V
(U)SIM card is supported. Cannot be multiplexed into a generic GPIO. Active low. Externally pull it up to 1.8 V. If unused, keep it open. SD Card Interface Pin Name Pin No. I/O Description DC Characteristics Comment SD_CLK SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 SD_DET SD_LDO21 39 40 41 42 43 44 45 38 DO SD card clock DO SD card command DIO SDIO data bit 0 DIO SDIO data bit 1 DIO SDIO data bit 2 DIO SDIO data bit 3 50 characteristic impedance. DI SD card hot-plug detect VILmax = 0.63 V VIHmin = 1.17 V Active low. PO SD card power supply 2.95 V/841 mA SC206E_Series_Hardware_Design 28 / 115 Smart Module Series SD_LDO4 32 PO for SD card pull-up 1.8/2.95 V output power circuits 1.8/2.95 V 22 mA Touch Panel Interface Pin Name Pin No. I/O Description DC Characteristics Comment TP_RST 31 DO TP reset TP_INT TP_I2C_SCL 30 47 DI TP interrupt OD TP I2C clock TP_I2C_SDA 48 OD TP I2C data LCM Interface VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V 1.8 V power domain. Active low. 1.8 V power domain. Need to be pulled up to 1.8 V externally. Can be used for other I2C devices. Pin Name Pin No. I/O Description DC Characteristics Comment LCD_RST 49 DO LCD reset VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V 1.8 V power domain. DI LCD tearing effect AO LCD MIPI clock (-) AO LCD MIPI clock (+) AO LCD MIPI lane 0 data (-) AO LCD MIPI lane 0 data (+) AO LCD MIPI lane 1 data (-) AO LCD MIPI lane 1 data (+) AO LCD MIPI lane 2 data (-) AO LCD MIPI lane 2 data (+) AO LCD MIPI lane 3 data (-) AO LCD MIPI lane 3 data (+) DO PWM output 1.8 V power domain. LCD_TE DSI_CLK_N DSI_CLK_P DSI_LN0_N DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N DSI_LN2_P DSI_LN3_N DSI_LN3_P PWM 50 52 53 54 55 56 57 58 59 60 61 29 Camera Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment CSI1_CLK_N CSI1_CLK_P 63 64 AI MIPI CSI1 clock (-) AI MIPI CSI1 clock (+) SC206E_Series_Hardware_Design 29 / 115 CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN2_N CSI1_LN2_P CSI1_LN3_N CSI1_LN3_P 65 66 67 68 72 73 70 71 AI MIPI CSI1 lane 0 data (-) AI MIPI CSI1 lane 0 data
(+) AI MIPI CSI1 lane 1 data (-) AI MIPI CSI1 lane 1 data
(+) AI MIPI CSI1 lane 2 data (-) AI MIPI CSI1 lane 2 data
(+) AI MIPI CSI1 lane 3 data (-) AI MIPI CSI1 lane 3 data
(+) CSI0_CLK_N 157 AI MIPI CSI0 clock (-) CSI0_CLK_P 196 AI MIPI CSI0 clock (+) CSI0_LN0_N 158 AI MIPI CSI0 lane 0 data (-) CSI0_LN0_P 197 AI MIPI CSI0 lane 0 data
(+) CSI0_LN1_N 159 AI MIPI CSI0 lane 1 data (-) CSI0_LN1_P 198 AI MIPI CSI0 lane 1 data
(+) CSI0_LN2_N 160 AI MIPI CSI0 lane 2 data (-) CSI0_LN2_P 199 AI MIPI CSI0 lane 2 data
(+) CSI0_LN3_N 161 AI MIPI CSI0 lane 3 data (-) CSI0_LN3_P 200 AI MIPI CSI0 lane 3 data
(+) CAM0_I2C_SCL 83 OD I2C clock of camera 0 CAM0_I2C_SDA 84 OD I2C data of camera 0 CAM0_PWDN CAM1_PWDN 80 82 DO Power down of camera 0 DO Power down of camera 1 CAM2_PWDN 163 DO Power down of camera 2 VOLmax = 0.45 V CAM0_MCLK 74 DO CAM1_MCLK 75 DO Master clock of camera VOHmin = 1.35 V 0 Master clock of camera 1 Smart Module Series Need to be pulled up to 1.8 V externally. Can only be used for camera I2C devices. 1.8 V power domain. SC206E_Series_Hardware_Design 30 / 115 CAM2_MCLK 165 DO Master clock of camera 2 CAM0_RST CAM1_RST 79 81 DO Reset of camera 0 DO Reset of camera 1 CAM2_RST 164 DO Reset of camera 2 CAM1_I2C_SCL 166 OD I2C clock of camera 1 CAM1_I2C_SDA 205 OD I2C data of camera 1 Flash & Torch Interface Smart Module Series Need to be pulled up to 1.8 V externally. Can only be used for camera I2C devices. Pin Name Pin No. I/O Description DC Characteristics Comment FLASH_LED 180 AO Flash/torch driver output IOmax = 1 A Supports flash and torch modes. Indication Interface Pin Name Pin No. I/O Description DC Characteristics Comment CHG_LED 195 AI Indicate the module's charging status IImax = 5 mA Keypad Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 114 DI Turn on/off the module VOL_UP 95 DI Volume up VOL_DOWN 96 DI Volume down VILmax = 0.63 V VIHmin = 1.17 V VILmax = 0.63 V VIHmin = 1.17 V RESET_N 225 DI Reset the module UART Interfaces Pulled up to 1.1 V internally. Active low. If unused, keep it open. Cannot be externally pulled up. 1.8 V power domain. Disabled by default and it can be enabled via software configuration. Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD 94 DO Debug UART transmit DBG_RXD 93 DI Debug UART receive UART0_TXD 34 DO UART0 transmit UART0_RXD 35 DI UART0 receive VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V 1.8 V power domain. If unused, keep it open. SC206E_Series_Hardware_Design 31 / 115 Smart Module Series DCE request to send VOLmax = 0.45 V signal to DTE VOHmin = 1.35 V DCE clear to send signal VILmax = 0.63 V UART0_RTS 37 DO UART0_CTS 36 DI from DTE UART1_TXD 154 DO UART1 transmit UART1_RXD 153 DI UART1 receive Sensor I2C Interface VIHmin = 1.17 V VOLmax = 0.45 V VOHmin = 1.35 V VILmax = 0.63 V VIHmin = 1.17 V Pin Name Pin No. I/O Description DC Characteristics Comment SENSOR_I2C_ SCL SENSOR_I2C_ SDA 91 OD 92 OD I2C clock for external sensor I2C data for external sensor RF Antenna Interfaces Need to be pulled up to 1.8 V externally. Can only be used for sensors. Pin Name Pin No. I/O Description DC Characteristics Comment ANT_MAIN 87 AIO Main antenna interface ANT_GNSS 121 AI GNSS antenna interface ANT_DRX 131 AI ANT_WIFI/BT 77 AIO Antenna Tuner Control Interfaces Diversity antenna interface Wi-Fi/Bluetooth antenna interface 50 impedance. Pin Name Pin No. I/O Description DC Characteristics Comment GRFC_13 173 DIO Generic RF controller GRFC_14 260 DIO Generic RF controller GRFC_15 262 DIO Generic RF controller ADC Interface Cannot be multiplexed into a generic GPIO. Cannot be pulled up when the module is turning on. Cannot be multiplexed into a generic GPIO. Pin Name Pin No. I/O Description DC Characteristics Comment ADC 128 AI General-purpose ADC interface The maximum input voltage is 1.875 V. Charging Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment BAT_P 133 AI Battery voltage detect Cannot be kept open. SC206E_Series_Hardware_Design 32 / 115
(+) BAT_M 183 AI Battery voltage detect (-) BAT_ID 185 AI Battery type detect VImin = 0 V VImax = 1.875 V BAT_THERM 134 AI Battery temperature detect Smart Module Series Internally pulled down with a 100 k resistor. If unused, keep it open. Internally pull up by default. Supports 47 k NTC thermistor by default. If unused, connect it to GND with a 47 k resistor. Vibration Motor Driver Interface Pin Name Pin No. I/O Description DC Characteristics Comment VIB_DRV_P 28 PO Other Interfaces Vibration motor driver output control VOmin = 1.5 V VOmax = 3.3 V IOmax = 100 mA Connect it to the positive pole of the motor. Pin Name Pin No. I/O Description DC Characteristics Comment USB_BOOT 46 DI emergency download Force the module into mode GNSS_LNA_EN 194 DO GNSS LNA enable control NFC_CLK 181 DO NFC clock CBL_PWR_N 186 DI Initiate power-on when grounded GPIO Interfaces Force the module to enter emergency download mode by pulling this pin up to LDO15A_1V8 when the module is turning on. The default output frequency is 38.4 MHz. The module cannot be turned off when this pin is pulled down. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment GPIO_28 33 DIO GPIO_31 GPIO_32 97 99 General-purpose input/output General-purpose input/output DIO DIO General-purpose SC206E_Series_Hardware_Design 33 / 115 Smart Module Series Cannot be pulled up when the module is turning on. GPIO_33 108 DIO GPIO_34 109 DIO GPIO_35 107 DIO GPIO_36 110 DIO GPIO_55 100 DIO GPIO_56 106 DIO GPIO_57 112 DIO GPIO_58 113 DIO GPIO_60 123 DIO GPIO_86 182 DIO GPIO_112 177 DIO GPIO_111 267 DIO GPIO_98 265 DIO GPIO_99 105 DIO GPIO_100 264 DIO GPIO_101 239 DIO GPIO_102 104 DIO GPIO_103 103 DIO GPIO_104 101 DIO GPIO_105 102 DIO input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output GPIO_106 90 DIO General-purpose SC206E_Series_Hardware_Design 34 / 115 Smart Module Series input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output GPIO_107 98 DIO GPIO_14 118 DIO GPIO_15 119 DIO GPIO_16 116 DIO GPIO_17 117 DIO PMU_GPIO03 124 DIO PMU_GPIO04 115 DIO PMU_GPIO08 127 DIO PMU_GPIO07 201 DIO GND Pin Name Pin No. 3, 7, 12, 15, 27, 51, 62, 69, 76, 78, 85, 86, 88, 89, 120, 122, 130, 132, 135, 140, 143, 144, 162, 171, GND 172, 176, 187191, 202204, 206224, 226231, 233238, 240, 241, 243245, 247, 248, 250, 251, 255, 256, 258, 259, 261, 266, 268, 269, 271274 RESERVED Pin Name Pin No. RESERVED 16, 167, 168, 169, 170, 174, 175, 178, 179, 193, 232, 242, 257, 263 NOTE 1. Keep all RESERVED and unused pins unconnected. 2. Connect all GND pins to ground. SC206E_Series_Hardware_Design 35 / 115 Smart Module Series 3.4. Power Supply 3.4.1. Power Supply Pins The module provides four VBAT pins for connection with external power supply. 3.4.2. Voltage Stability Requirements The power supply range of the module is 3.54.4 V, and the recommended value is 3.8 V. The power supply performance, such as load capacity, voltage ripple, etc. will directly influences the modules performance and stability. Under ultimate conditions, the transient peak current of the module may surge up to 3 A. If the power supply capacity is not sufficient, there will be the risk that the voltage drops below 3.4 V and as a result the module powers off automatically. Therefore, make sure the input voltage never drops below 3.4 V. Figure 3: Voltage Drop Sample To decrease voltage drop, use a bypass capacitor of about 100 F with low ESR (ESR 0.7 ), and reserve a multi-layer ceramic chip capacitor (MLCC) array due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) to compose the MLCC array and place these capacitors close to VBAT pins. Additionally, add a 4.7 F capacitor in parallel. The main power supply from an external application has to be a single voltage source and can be expanded to two sub paths with star structure. The width of VBAT trace should be no less than 3 mm. In principle, the longer the VBAT trace is, the wider it should be. In addition, to guarantee the stability of the power source, please use a TVS and place it as close to the VBAT pins as possible to enhance surge protection. The following figure shows the star configuration of the power supply. SC206E_Series_Hardware_Design 36 / 115 Voltage3.8 V3 AInput current Smart Module Series Figure 4: Reference Circuit for the Power Supply 3.4.3. Reference Design for Power Supply The power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of the module should be able to provide sufficient current of 3 A at least. If the voltage difference between the input and output is not too big, use an LDO when supplying power to the module. If there is a big voltage difference between the input source and the desired output
(VBAT), a buck converter is recommended. The following figure shows a reference design for +5 V input power source. The typical output voltage is 3.8 V and the maximum load current is 5.0 A. Figure 5: Reference Circuit of Power Supply NOTE 1. In an abnormal state, it is recommended to restart the module by switching off and then switching back on the power supply. SC206E_Series_Hardware_Design 37 / 115 ModuleVBATVBATC1100 F+C3100 nFC433 pFC510 pFD1C24.7 FGNDVCC_5VU1PGNDPGNDPGNDPVINPVINPVINENSS/TRSWSWSWVOSPGFBFSWDEFGND3V8_ENDC_3V8D1C1C3C2R1Q1R2R3L1R4R5R6C5C6C4 2. The module supports battery charging by default. If the above power supply design is adopted, disable the charging function by software, or connect VBAT to a Schottky diode in series to avoid the reverse current to the power supply IC. Smart Module Series 3.5. Turn On/Off 3.5.1. Turn On with PWRKEY The module can be turned on by driving the PWRKEY pin low for at least 1.6 s. The PWRKEY pin is pulled up to 1.1 V internally. It is recommended to use an open collector driver to control PWRKEY. A simple reference circuit is illustrated in the following figure. Figure 6: Turn On the Module with Open Collector Driver Another way to control PWRKEY is by using a button directly. You must place a TVS component nearby the button for ESD protection. A reference circuit is shown by the following figure. Figure 7: Turn On the Module Using Button SC206E_Series_Hardware_Design 38 / 115 Turn on pulsePWRKEY4.7K47K>1.6 sR1R2Q1R31KPWRKEYS1Close to S1TVS1K The turning-on scenario is illustrated in the following figure. Smart Module Series Figure 8: Turn-on Timing NOTE 1. When the module is turned on for the first time, the turn-on timing may be different from that shown above. 2. Make sure that VBAT is stable before pulling down PWRKEY. It is recommended to wait until VBAT is stable at 3.8 V for at least 30 ms before pulling down PWRKEY. Additionally, do not keep pulling PWRKEY down all the time. SC206E_Series_Hardware_Design 39 / 115 VBAT(Typ. 3.8 V)PWRKEY> 1.6 sOthersLDO15A_1V847 s132 msSoftware controlledLDO17A_3V0ActiveNote2Software controlled Smart Module Series 3.5.2. Turn Off Drive the PWRKEY pin low for at least 1 s, and then choose to turn off the module when the prompt window comes up. You can also force the module to turn off by driving PWRKEY low for at least 8 s. The force-turn-off timing is illustrated by the following figure. Figure 9: Forced Turn-off Timing 3.6. VRTC The RTC (Real Time Clock) can be powered by an external power source through VRTC when the module is powered down and there is no power supplied to VBAT. The external power source can be a rechargeable battery (such as a coin cell) according to application demands. A reference circuit design is shown below. Figure 10: RTC Powered by Coin Cell If RTC is ineffective, it can be synchronized through the network after the module is turned on. The recommended input voltage range for VRTC is 2.53.2 V and the recommended typical value is 3.0 V. SC206E_Series_Hardware_Design 40 / 115 VBATPWRKEYOthers> 8 sPower downCoin CellModuleRTC CoreVRTC Smart Module Series 3.7. Power Output The module supports output of regulated voltages for peripheral circuits. In applications, it is recommended to use a 33 pF and a 10 pF capacitor in parallel in the circuit to suppress high-frequency noise. Table 8: Power Description Pin Name Pin No. Default Voltage (V) Driving Current (mA) @ Idle State LDO15A_1V8 111 LDO_IOVDD 125 VDD_2V8 129 LDO17A_3V0 156 SD_LDO21 SD_LDO4 USIM1_VDD USIM2_VDD 38 32 26 21 1.8 1.8 2.8 3.0 2.95 1.8/2.95 1.8/2.95 1.8/2.95 3.8. Charging Interface 200 300 500 192 841 22 67 67 Keeps ON
The module supports battery charging. The battery charger IC in the module supports trickle charging, constant current charging and constant voltage charging modes, which optimize the charging procedure for Li-ion batteries. Trickle charging: There are two steps in this mode. When the battery voltage is below 2.1 V, a 90 mA trickle charging current is applied to the battery. When the battery voltage is charged up and is between 2.1 V and 3.4 V, the charging current can be set to 400 mA maximally. Constant current mode (CC mode): When the battery is increased to 3.4 to 4.2 V, the system will switch to CC mode. The maximum charging current is 1.85 A when an adapter is used for battery charging, and the maximum charging current is 450 mA for USB charging. Constant voltage mode (CV mode): When the battery voltage reaches the final value 4.35 V, the system will switch to CV mode and the charging current will decrease gradually. When the battery level reaches 100 %, charging is completed. SC206E_Series_Hardware_Design 41 / 115 Smart Module Series Table 9: Pin Definition of Charging Interface Pin Name Pin No. I/O Description Comment BAT_P BAT_M 133 183 AI Battery voltage detect (+) AI Battery voltage detect (-) Cannot be kept open. BAT_THERM 134 AI Battery temperature detect BAT_ID 185 AI Battery type detect Internal pull up by default. Supports 47 k NTC thermistor by default. If unused, connect it to GND with a 47 k resistor. Internally pulled down with a 100 k resistor. If unused, keep it open. The module supports battery temperature detection in the condition that the battery integrates a thermistor (47 k 1 % NTC thermistor with a B-constant of 4050 K by default) and the thermistor is connected to BAT_THERM pin. If the BAT_THERM pin is not connected, there will be malfunctions such as battery charging failure, battery level display error, etc. The battery charge temperature range varies with different types of batteries. A reference design for the battery charging circuit is shown below. Figure 11: Reference Design for Battery Charging Circuit Mobile devices such as mobile phones or handheld POS systems are powered by batteries. For different batteries, you should modify the charging and discharging curve correspondingly to achieve the best performance. SC206E_Series_Hardware_Design 42 / 115 GNDBAT_PBAT_THERMVBAT100 FNTCVBAT33 pF4.7 FESDESD123USB_VBUSAdapter or USBModuleBatteryBAT_MC1C2C3D1D2C2NM_1 nFC4GND Smart Module Series If the thermistor is not available in the battery, or an adapter is utilized to power the module, you must connect BAT_THERM to GND via a 47 k resistor. Otherwise, the system may mistakenly judge that the battery temperature is abnormal, and therefore cause battery charging failure. BAT_P and BAT_M must be connected. Otherwise, exceptions in voltage detection will be caused, with associated problems of turn-on/off and battery charging/discharging. 3.9. USB Interface (Type-C) The module provides one USB interface which complies with both USB 3.1 and USB 2.0 specifications and supports superspeed (5 Gbps) and high-speed (480 Mbps), and full-speed (12 Mbps) modes. The USB interface supports USB OTG and is used for AT command transmission, data transmission, software debugging and firmware upgrade. The module only supports USB Type-C. The USB interface has one USB 2.0 compliant high-speed differential channel (USB_DP, USB_DM) and one USB 3.1 compliant superspeed differential channel
(USB_SS1_RX_P/M, USB_SS1_TX_P/M and USB_SS2_RX_P/M, USB_SS2_TX_P/M). When Type-C is plugged in with one side up, the external device is detected by USB_CC1, and the data will be transmitted through USB_SS1; when it is plugged in with the other side up, the external device is detected by USB_CC2, and the data will be transmitted through USB_SS2. The following table shows the pin definition of USB interface. Table 10: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_VBUS USB_DM USB_DP 141, 142 13 14 PIO Charging power input. Power supply output for OTG device. USB/adaptor insertion detection AIO USB differential data (-) AIO USB differential data (+) USB_SS1_RX_P 252 USB_SS1_RX_M 270 AI AI USB 3.1 channel 1 superspeed receive (+) USB 3.1 channel 1 superspeed receive (-) USB_SS1_TX_P 254 AO USB 3.1 channel 1 superspeed transmit (+) USB_SS1_TX_M 253 AO USB 3.1 channel 1 superspeed transmit (-) Maximum output current is 500 mA. 90 differential impedance. USB 2.0 standard compliant. 90 differential impedance. USB 3.1 standard compliant. SC206E_Series_Hardware_Design 43 / 115 Smart Module Series USB_SS2_RX_P 152 USB_SS2_RX_M 192 AI AI USB 3.1 channel 2 superspeed receive (+) USB 3.1 channel 2 superspeed receive (-) USB_SS2_TX_P 150 AO USB 3.1 channel 2 superspeed transmit (+) USB_SS2_TX_M 151 AO USB 3.1 channel 2 superspeed transmit (-) USB_CC1 USB_CC2 249 246 AI AI USB Type-C detect 1 USB Type-C detect 2
Figure 12: USB Interface Reference Design (OTG Supported) In order to ensure USB performance, comply with the following principles when designing the USB interface. Route the USB signal traces as a differential pair with total grounding. The impedance of USB differential trace should be controlled to 90 . Keep the ESD protection component as close as possible to the USB connector. Pay attention to the influence of junction capacitance of ESD protection component on USB data lines. Typically, the capacitance value should be less than 2 pF for USB 2.0 and less than 0.5 pF for USB 3.1. Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. Route the USB differential traces in inner-layer with ground shielding on not only the upper and lower layers but also the right and left sides. Make sure the intra-pair length difference within USB 2.0 differential pair does not exceed 2 mm, and that within USB 3.1 Rx or Tx differential pair does not exceed 0.7 mm. The spacing between USB signals and all other signals should be at least 4 times the trace width while the signals between Rx and Tx should be at least 3 times the trace width. SC206E_Series_Hardware_Design 44 / 115 USB_DMModuleUSB_SS1_RX_PRX2+RX2-VBUSCC1D-D+TX2-TX2+CC2USB_CC1USB_CC2RX1+RX1-TX1+TX1-USB Type-CC3C4C7C8USB_DPUSB_VBUSUSB_SS1_RX_MUSB_SS1_TX_PUSB_SS1_TX_MUSB_SS2_RX_PUSB_SS2_RX_MUSB_SS2_TX_PUSB__TX_MSS2C1C2C5C6 For USB 3.1, it is suggested to do simulation after the design is completed. If the cable is too long or there are too many vias, a redriver needs to be added to ensure the quality of signal transmission if necessary. Smart Module Series Table 11: USB Trace Length Inside the Module Pin No. Signal Length (mm) Length Difference (DP - DM) 0.24
-0.17
-0.07
-0.28 0.3 13 14 252 270 254 253 152 192 150 151 USB_DM USB_DP 24.13 24.37 USB_SS1_RX_P 16.33 USB_SS1_RX_M 16.50 USB_SS1_TX_P 10.07 USB_SS1_TX_M 10.14 USB_SS2_RX_P 17.74 USB_SS2_RX_M 18.02 USB_SS2_TX_P 20.84 USB_SS2_TX_M 20.54 3.10. UART Interfaces The module provides three UART interfaces:
UART0: four-wire UART interface, supports RTS and CTS hardware flow control UART4 (debug UART): two-wire UART interface, used for debugging by default UART1: two-wire UART interface Table 12: Pin Definition of UART Interfaces Pin Name Pin No. I/O Description Comment UART0_TXD 34 DO UART0 transmit UART0_RXD 35 DI UART0 receive 1.8 V power domain. If unused, keep it open. SC206E_Series_Hardware_Design 45 / 115 Smart Module Series UART0_RTS 37 DO DCE request to send signal to DTE UART0_CTS 36 DI DCE clear to send signal from DTE DBG_TXD DBG_RXD 94 93 DO Debug UART transmit DI Debug UART receive UART1_TXD 154 DO UART1 transmit UART1_RXD 153 DI UART1 receive UART0 is a four-wire UART interface with 1.8 V power domain. You should use a level translator if your application is equipped with a 3.3 V UART interface. The following figure shows a reference design. Figure 13: Reference Circuit with Level Translator Chip for UART0 The following figure presents an example of connection between the module and a PC. It is recommended to add a level translator and an RS-232 level translator chip between the module and the PC. Figure 14: RS-232 Level Match Circuit for UART0 SC206E_Series_Hardware_Design 46 / 115 VCCAVCCBOEA1A2A3A4GNDB1B2B3B4LDO15A_1V8UART0_RTSUART0_RXDUART0_CTSUART0_TXDRTS_3.3VRXD_3.3VCTS_3.3VTXD_3.3VVDD_3.3VC1100 pFC2U1100 pFRTS_3.3VRXD_3.3VCTS_3.3VTXD_3.3VRTS_1.8VRXD_1.8VCTS_1.8VTXD_1.8VVCCAModuleGNDGND1.8 VVCCB3.3 VDIN1ROUT3ROUT2ROUT1DIN4DIN3DIN2DIN5R1OUTBFORCEON/FORCEOFF/INVALID3.3 VDOUT1DOUT2DOUT3DOUT4DOUT5RIN3RIN2RIN1VCCGNDOEDB-9RTSTXDCTSRXDGNDUART0_RXDUART0_TXDUART0_RTSUART0_CTS Smart Module Series NOTE UART4 (debug UART) and UART1 are similar to UART0. Please refer to the reference design of UART0 for the designs of the two UARTs. 3.11. (U)SIM Interfaces The module provides two (U)SIM interfaces that meet ETSI and IMT-2000 requirements. Dual SIM Dual Standby is supported by default. Either 1.8 V or 2.95 V (U)SIM card is supported, and the (U)SIM card is powered by the internal power supply of the module. Table 13: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment PO
(U)SIM1 card power supply Either 1.8 V or 2.95 V (U)SIM card is supported. USIM1_VDD USIM1_DATA USIM1_CLK USIM1_RST 26 25 24 23 DIO
(U)SIM1 card data DO
(U)SIM1 card clock DO
(U)SIM1 card reset USIM1_DET 22 DI
(U)SIM1 card hot-plug detect USIM2_VDD USIM2_DATA USIM2_CLK USIM2_RST 21 20 19 18 PO
(U)SIM2 card power supply DIO
(U)SIM2 card data DO
(U)SIM2 card clock DO
(U)SIM2 card reset USIM2_DET 17 DI
(U)SIM2 card hot-plug detect Cannot be multiplexed into a generic GPIO. Active low. Externally pull it up to 1.8 V. If unused, keep it open. Either 1.8 V or 2.95 V (U)SIM card is supported. Cannot be multiplexed into a generic GPIO. Active low. Externally pull it up to 1.8 V. If unused, keep it open. SC206E_Series_Hardware_Design 47 / 115 The module supports (U)SIM card hot-plug via the USIM_DET pins. This function is disabled by default via software. To enable it, contact Quectel Technical Support to change the software configuration. A reference circuit for (U)SIM interface with an 8-pin (U)SIM card connector is shown below. Smart Module Series Figure 15: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector If you do not need hot-plug detection, keep USIM1_DET and USIM2_DET pins open. The following is a reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector when hot-plug detection is not needed. Figure 16: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector SC206E_Series_Hardware_Design 48 / 115 USIM_VDDUSIM_RSTUSIM_CLKUSIM_DATAUSIM_DET22RLDO15A_1V8100K100nF(U)SIM Card ConnectorTVS array22pFVCCRSTCLKIOVPPGNDUSIM_VDD10KModuleR1R2C122pF22pFC2C3C4D122R22RR3R4R5ModuleUSIM_VDDUSIM_RSTUSIM_CLKUSIM_DATA22R22R22R100 nF(U)SIM card connectorTVS array22 pFVCCRSTCLKIOVPPGND10KUSIM_VDD22 pF22 pFR1C1D1R2R3R4C2C3C4 Smart Module Series To enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design:
Place the (U)SIM card connector as close to the module as possible. Keep the trace length as short as possible, at most 200 mm. Keep (U)SIM card signals away from RF and VBAT traces. Reserve a filter capacitor for USIM_VDD, and its maximum capacitance should not exceed 1 F. Additionally, place the capacitor near the (U)SIM card connector. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with ground. USIM_RST also needs ground protection. To ensure better ESD protection, it is recommended to add a TVS array with a parasitic capacitance not exceeding 10 pF. Add 22 resistors in series between the module and (U)SIM card to suppress EMI such as spurious transmission. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. Add 22 pF capacitors in parallel on USIM_DATA, USIM_CLK and USIM_RST signal lines to filter RF interference, and place them as close to the (U)SIM card connector as possible. 3.12. SD Card Interface SD Card interface of the module supports SD 3.0 protocol. The pin definition of SD card interface is shown below. Table 14: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SD_CLK SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 SD_DET SD_LDO21 SD_LDO4 39 40 41 42 43 44 45 38 32 DO SD card clock DO SD card command DIO SDIO data bit 0 DIO SDIO data bit 1 DIO SDIO data bit 2 DIO SDIO data bit 3 50 characteristic impedance. DI SD card hot-plug detect Active low. PO SD card power supply PO 1.8/2.95 V output power for SD card pull-up circuits
SC206E_Series_Hardware_Design 49 / 115 A reference circuit for the SD card interface is shown below. Smart Module Series Figure 17: Reference Circuit for the SD Card Interface SD_LDO21 is the power supply for the SD card and can provide up to 841 mA output current. Due to the high output current, it is recommended that the trace width should be at least 0.8 mm. To ensure output current stability, add a 4.7 F and a 33 pF capacitor in parallel near the SD card connector. SD_CMD, SD_CLK, SD_DATA0, SD_DATA1, SD_DATA2, and SD_DATA3 are all high-speed signal lines. In PCB design, control the characteristic impedance of them to 50 , and do not cross them with other traces. It is recommended to route the traces on the inner layer of the PCB and keep them of the same length. Additionally, SD_CLK needs ground shielding separately. Trace length requirements:
Control the impedance to 50 10 % and add ground shielding. Keep the trace length difference among SD_CLK, SD_CMD and SD_DATA less than 2 mm. Table 15: SD Card Trace Length Inside the Module Pin No. 39 40 41 42 43 Signal SD_CLK SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 Length (mm) 35.01 35.12 34.98 35.04 34.98 SC206E_Series_Hardware_Design 50 / 115 SD_CMD120KNM_51KSD_DATA3SD_DATA2SD_CLKSD_DATA0SD_DETSD_DATA1P1-DAT2P2-CD/DAT3P3-CMDP4-VDDP5-CLKP8-DAT1GNDP6-VSSP7-DAT0DETECTIVEGNDGNDGND12345678910111213SD_LDO2133R33R33R33R33R33R1K33 pF4.7 FSD_LDO4ModuleR1R2R3R4R5R6NM_51KNM_10KNM_51KNM_51KR7R8R9R10R11R12R13D1D2D3D4D5D6D7D8C1C2SD Card ConnectorLDO15A_1V8GNDR140R Smart Module Series 44 SD_DATA3 35.10 3.13. GPIO Interfaces The module has abundant GPIO interfaces with a power domain of 1.8 V. The pin definition is listed below. Table 16: Pin Definition of GPIO Interfaces Pin Name Pin No. I/O Description Comment GPIO_28 GPIO_31 GPIO_32 GPIO_33 GPIO_34 GPIO_35 GPIO_36 GPIO_55 GPIO_56 33 97 99 108 109 107 110 100 106 DIO DIO DIO DIO DIO DIO DIO DIO DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output GPIO_57 112 DIO General-purpose input/output Cannot be pulled up when the module is turning on. GPIO_58 GPIO_60 GPIO_86 GPIO_112 GPIO_111 GPIO_98 GPIO_99 GPIO_100 GPIO_101 113 123 182 177 267 265 105 264 239 DIO DIO DIO DIO DIO DIO DIO DIO DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output SC206E_Series_Hardware_Design 51 / 115 Smart Module Series DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output GPIO_102 GPIO_103 GPIO_104 GPIO_105 GPIO_106 GPIO_107 GPIO_14 GPIO_15 GPIO_16 GPIO_17 104 103 101 102 90 98 118 119 116 117 PMU_GPIO03 124 PMU_GPIO04 115 PMU_GPIO08 127 PMU_GPIO07 201 NOTE For more details about GPIO configuration, see document [2]. 3.14. I2C Interfaces The module provides four I2C interfaces. All I2C interfaces are open drain signals and therefore you must pull them up externally. The reference power domain is 1.8 V. The sensor I2C interface only supports sensors of ADSP architecture. CAM0 I2C and CAM1 I2C signals are controlled by the Kernel code and support connection to radio-output-related devices. Table 17: Pin Definition of I2C Interfaces Pin Name Pin No. I/O Description Comment TP_I2C_SCL 47 OD TP I2C clock Need to be pulled up to SC206E_Series_Hardware_Design 52 / 115 TP_I2C_SDA CAM0_I2C_SCL CAM0_I2C_SDA 48 83 84 OD TP I2C data OD I2C clock of camera 0 OD I2C data of camera 0 CAM1_I2C_SCL 166 OD I2C clock of camera 1 CAM1_I2C_SDA 205 OD I2C data of camera 1 Smart Module Series 1.8 V externally. Can be used for other I2C devices. Can only be used for camera I2C devices. SENSOR_I2C_SCL 91 OD I2C clock for external sensor SENSOR_I2C_SDA 92 OD I2C data for external sensor Can only be used to for sensors. 3.15. ADC Interface The module supports one Analog-to-Digital Converter (ADC) interface. The ADC interface supports resolution of up to 15 bits. The pin definition is shown below. Table 18: Pin Definition of ADC Interface Pin Name Pin No. I/O Description Comment ADC 128 AI General-purpose ADC interface The maximum input voltage is 1.875 V. 3.16. Motor Drive Interface The pin definition of the motor drive interface is listed below. Table 19: Pin Definition of Motor Drive Interface Pin Name Pin No. I/O Description Comment VIB_DRV_P 28 PO Vibration motor driver output control Connect it to the positive pole of the motor. SC206E_Series_Hardware_Design 53 / 115 The motor is driven by an exclusive circuit, and a reference circuit is shown below. Smart Module Series Figure 18: Reference Circuit for Motor Connection When the motor stops working and the VIB_DRV_P is disconnected, the redundant electricity on the motor can be discharged from the circuit loop formed by diodes, thus avoiding damage to components. 3.17. LCM Interface The module provides one LCM interface, which is MIPI DSI standard compliant. The interface supports high-speed differential data transmission and supports HD+ display (1680 720 @ 60 fps). The pin definition of the LCM interface is shown below. Table 20: Pin Definition of LCM Interface Pin Name Pin No. I/O Description Comment LCD_RST LCD_TE DSI_CLK_N DSI_CLK_P DSI_LN0_N DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N 49 50 52 53 54 55 56 57 58 DO LCD reset 1.8 V power domain. DI AO AO AO AO AO AO AO LCD tearing effect LCD MIPI clock (-) LCD MIPI clock (+) LCD MIPI lane 0 data (-) LCD MIPI lane 0 data (+) LCD MIPI lane 1 data (-) LCD MIPI lane 1 data (+) LCD MIPI lane 2 data (-)
SC206E_Series_Hardware_Design 54 / 115 ModuleVIB+MotorVIB-C1VIB_DRV_PD133 pF Smart Module Series DSI_LN2_P DSI_LN3_N DSI_LN3_P PWM 59 60 61 29 AO AO AO LCD MIPI lane 2 data (+) LCD MIPI lane 3 data (-) LCD MIPI lane 3 data (+)
DO PWM output 1.8 V power domain. A reference circuit for the LCM interface is shown below. Figure 19: Reference Circuit Design for LCM Interface MIPI are high-speed signal lines. It is recommended to add common-mode filters in series near the LCM connector, to improve protection against electromagnetic radiation interference. SC206E_Series_Hardware_Design 55 / 115 DSI_CLK_PLEDANCLEDKLPTENC (SDA-TP) VIO18NC (VTP-TP) DSI_LN3_PLCD_TELCD_RSTDSI_LN3_NDSI_LN2_P_CLK_NDSI_LN2_NRESETLCD_IDNC (SCL-TP) NC (RST-TP) NC (EINT-TP) GNDVCC28GNDMIPI_TDP3MIPI_TDN3GNDMIPI_TDP2MIPI_TDN2GNDMIPI_TDP1MIPI_TDN1GNDLDO15A_1V8LCM_LED+LCM_LED-1234567891012131415161718192021222324252627MIPI_TDP0MIPI_TDN0GNDMIPI_TCPMIPI_TCN2928303456345634563456DSI_LN1_NDSI_LN1_PDSI_LN0_NDSI_LN0_P1234561112121212100nF4.7F1FModuleLCMFL1FL2FL3FL4FL5EMI filterC3C2C1NCGNDGNDGNDGNDADC31323334DSIGNDLDO_IOVDDNMLCM_2V8OUTGNDINENLDOVPH_PWRGPIO1FC4 Smart Module Series It is recommended to read the LCM ID register through MIPI when compatible design with other displays is required. If several LCMs share the same IC, it is recommended that the LCM factory should burn an OTP register to distinguish different screens. You can also connect the LCD_ID pin of LCM to the ADC pin of the module, but you need to make sure that the output voltage of LCD_ID should not exceed the voltage range of the ADC pin. You can design the external backlight driving circuit for LCM according to actual requirements. A reference circuit design is shown in the following figure, in which the PWM pin is used to adjust the backlight brightness. Figure 20: Reference Design for LCM External Backlight Driving Circuit 3.18. Flash Interface The module supports one flash LED driver, with maximum output current up to 1 A. Table 21: Pin Definition of Flash Interface Pin Name Pin No. I/O Description Comment FLASH_LED 180 AO Flash/torch driver output Supports flash and torch modes. NOTE Flash current is programmable in step 12.5 mA (max. 1 A) or 5 mA (max. 640 mA). SC206E_Series_Hardware_Design 56 / 115 LCM_LED+PWMModule2.2 FBacklight driverLCM_LED-VPH_PWRC1R110K Smart Module Series 3.19. Touch Panel Interface The module provides one I2C interface for the connection to a Touch Panel (TP), and also provides the corresponding power supply and interrupt pins. The definition of TP interface pin is illustrated below. Table 22: Pin Definition of Touch Panel Interface Pin Name Pin No. I/O Description Comment TP_RST TP_INT 31 30 DO TP reset 1.8 V voltage domain. Active low. DI TP interrupt 1.8 V voltage domain. TP_I2C_SCL 47 OD TP I2C clock TP_I2C_SDA 48 OD TP I2C data Need to be pulled up to 1.8 V externally. Can be used for other I2C devices. A reference circuit for the TP interface is shown below. Figure 21: Reference Circuit Design for the Touch Panel Interface SC206E_Series_Hardware_Design 57 / 115 TP_RSTTP_I2C_SCLTP_I2C_SDATP_INT1234562.2K2.2KLDO15A_1V84.7 F100 nFModuleRESET SCLSDA INTGNDVDDTPR2R1C1C2D1D2D3D4D5LDO17A_3V0GND Smart Module Series 3.20. Camera Interfaces Based on MIPI CSI standard, the module supports two cameras (4-lane + 4-lane) or three cameras (4-
lane + 2-lane + 1-lane), and the maximum pixel of the camera can be up to 25 MP. The video and photo quality are determined by various factors such as the camera sensor and camera lens specifications. Table 23: Pin Definition of Camera Interfaces Pin Name Pin No. I/O Description Comment CSI1_CLK_N CSI1_CLK_P CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN2_N CSI1_LN2_P CSI1_LN3_N CSI1_LN3_P 63 64 65 66 67 68 72 73 70 71 CSI0_CLK_N 157 CSI0_CLK_P 196 CSI0_LN0_N 158 CSI0_LN0_P 197 CSI0_LN1_N 159 CSI0_LN1_P 198 CSI0_LN2_N 160 CSI0_LN2_P 199 CSI0_LN3_N 161 AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI AI MIPI CSI1 clock (-) MIPI CSI1 clock (+) MIPI CSI1 lane 0 data (-) MIPI CSI1 lane 0 data (+) MIPI CSI1 lane 1 data (-) MIPI CSI1 lane 1 data (+) MIPI CSI1 lane 2 data (-) MIPI CSI1 lane 2 data (+) MIPI CSI1 lane 3 data (-) MIPI CSI1 lane 3 data (+) MIPI CSI0 clock (-) MIPI CSI0 clock (+) MIPI CSI0 lane 0 data (-) MIPI CSI0 lane 0 data (+) MIPI CSI0 lane 1 data (-) MIPI CSI0 lane 1 data (+) MIPI CSI0 lane 2 data (-) MIPI CSI0 lane 2 data (+) MIPI CSI0 lane 3 data (-)
SC206E_Series_Hardware_Design 58 / 115 Smart Module Series CSI0_LN3_P 200 AI MIPI CSI0 lane 3 data (+)
CAM0_I2C_SCL 83 OD I2C clock of camera 0 CAM0_I2C_SDA 84 OD I2C data of camera 0 CAM0_PWDN 80 DO Power down of camera 0 CAM1_PWDN 82 DO Power down of camera 1 CAM2_PWDN 163 DO Power down of camera 2 Need to be pulled up to 1.8 V externally. Can only be used for camera I2C devices. CAM0_MCLK CAM1_MCLK 74 75 DO Master clock of camera 0 DO Master clock of camera 1 1.8 V power domain. CAM2_MCLK 165 DO Master clock of camera 2 CAM0_RST CAM1_RST 79 81 DO Reset of camera 0 DO Reset of camera 1 CAM2_RST 164 DO Reset of camera 2 CAM1_I2C_SCL 166 OD I2C clock of camera 1 CAM1_I2C_SDA 205 OD I2C data of camera 1 Need to be pulled up to 1.8 V externally. Can only be used for camera I2C devices. SC206E_Series_Hardware_Design 59 / 115 The following is a reference circuit design for 3-camera applications. Smart Module Series Figure 22: Reference Circuit Design for 3-Camera Applications NOTE In 3-camera applications, CSI1_LN3_P and CSI1_LN3_N are used as MIPI clock signals of camera 2. CSI1_LN2_P and CSI1_LN2_N are used as MIPI data signals of camera 2. SC206E_Series_Hardware_Design 60 / 115 camera0 connectorCAM0_PWDNCAM0_MCLKCAM0_I2C_SDACAM0_I2C_SCL_CSI0_LN3_PCSI0_LN3_NCSI0_LN2_PCSI0_LN2_NCSI0_LN1_PCSI0_LN1_NCSI0_LN0_PCSI0_LN0_NCAM1_RSTCAM1_PWDNCAM1_MCLKCSI1_LN3_PCSI1_LN3_NCSI1_LN2_PCSI1_LN2_NCSI1_LN1_PCSI1_LN1_NCSI1_LN0_PCSI1_LN0_NCSI0_CLK_PCSI0_CLK_NCSI1_CLK_PCSI1_CLK_NLDO15A_1V82.2K2.2K camera1 connector1 F4.7F4.7F1F1F4.7FCAM0_RSTCAM2_PWDNCAM2_MCLKCAM1_I2C_SDA_CAM1_I2C_SCLCAM2_RSTcamera2 connector AVDDDVDDDOVDDEMIEMIEMIEMIEMIEMIEMIEMI1F2.2K2.2KDVDDEMIEMI4.71FFAVDDDOVDDOUTGNDINENLDOVPH_PWR1FAF_VDDOUTGNDINENLDOVPH_PWRGPIO1FVDD_2V8GPIOOUTGNDINENLDO1FGPIOVPH_PWR Smart Module Series 3.20.1. MIPI Design Considerations Special attention should be paid to the pin definition of LCM and camera connectors. Make sure the module and the connectors are correctly connected. MIPI lines are high-speed signal lines for DSI-supported maximum data rate of up to 1.5 Gbps and CSI-supported maximum data rate of up to 2.5 Gbps. The differential impedance should be controlled to 100 . Additionally, it is recommended to route the trace on the inner layer of PCB, and do not cross it with other traces. For the same group of DSI or CSI signals, keep all the MIPI traces of the same length. In order to avoid crosstalk, keep a distance of 1.5 times the trace width among MIPI signal lines. During impedance matching, do not connect GND on different planes to ensure impedance consistency. It is recommended to select a low-capacitance TVS for ESD protection and the recommended parasitic capacitance should be below 1 pF. Route MIPI traces according to the following rules:
a) The total trace length should not exceed 240 mm;
b) Control the differential impedance to 100 10 %;
c) Control intra-lane length difference within 0.7 mm;
d) Control inter-lane length difference within 1.4 mm. Table 24: MIPI Trace Length Inside the Module Pin Name Pin No. Length (mm) Length Difference (P - N) DSI_CLK_N DSI_CLK_P DSI_LN0_N DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N DSI_LN2_P DSI_LN3_N DSI_LN3_P CSI1_CLK_N CSI1_CLK_P CSI1_LN0_N 52 53 54 55 56 57 58 59 60 61 63 64 65 38.53 38.30 38.59 38.43 38.22 38.47 38.84 38.56 38.74 38.48 18.87 18.84 19.42 0.23 0.16
-0.25 0.28 0.26
-0.03 0.24 SC206E_Series_Hardware_Design 61 / 115 Smart Module Series CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN2_N CSI1_LN2_P CSI1_LN3_N CSI1_LN3_P CSI0_CLK_N CSI0_CLK_P CSI0_LN0_N CSI0_LN0_P CSI0_LN1_N CSI0_LN1_P CSI0_LN2_N CSI0_LN2_P CSI0_LN3_N CSI0_LN3_P 66 67 68 72 73 70 71 157 196 158 197 159 198 160 199 161 200 19.18 19.02 19.28 19.53 19.23 18.93 18.82 20.94 20.73 18.74 18.40 17.18 17.37 8.28 8.15 4.97 4.70
-0.26 0.3 0.11 0.21 0.34
-0.19 0.13 0.27 3.21. Sensor Interface The module supports communication with sensors via I2C interfaces, and it supports ALS/PS, BDS, accelerometer, gyroscope, etc. Table 25: Pin Definition of Sensor Interface Pin Name Pin No. I/O Description Comment SENSOR_I2C_SCL 91 OD I2C clock for external sensor SENSOR_I2C_SDA 92 OD I2C data for external sensor Need to be pulled up to 1.8 V externally. Can only be used to connect sensor devices. SC206E_Series_Hardware_Design 62 / 115 Smart Module Series 3.22. Audio Interfaces The module provides three analog input channels and three analog output channels. The following table shows the pin definition. Table 26: Pin Definition of Audio Interfaces Pin Name Pin No. I/O Description Comment MIC_BIAS1 147 PO Bias voltage 1 output for microphone The rated output current is 3 mA. MIC1_P MIC1_M MIC2_P 4 5 6 AI Microphone input for channel 1 (+) -
AI Microphone input for channel 1 (-)
AI Microphone input for headset (+)
MIC3_P 148 AI Microphone input for channel 3 (+) -
MIC3_M 149 AI Microphone input for channel 3 (-)
MIC_BIAS3 155 PO Bias voltage 3 output for microphone The rated output current is 3 mA. The output voltage is fixed to 1.8 V and cannot be adjusted. EAR_P EAR_M 8 9 AO Earpiece output (+) AO Earpiece output (-)
LINEOUT_P 10 AO Audio line differential output (+) The typical output voltage is 2 Vrms. LINEOUT_M 11 AO Audio line differential output (-) HPH_R 136 AO Headphone right channel output HPH_GND 137 AO Headphone reference ground HPH_L 138 AO Headphone left channel output
HS_DET 139 AI Headset hot-plug detect High level by default. The module offers three audio input channels. The output voltage range of MIC_BIAS1 is programmable between 1.6 V and 2.85 V, and the maximum output current is 3 mA. MIC_BIAS3 supports 1.8 V pull-up output only and is not programmable. The earpiece interface uses differential output. SC206E_Series_Hardware_Design 63 / 115 Smart Module Series The lineout interface uses differential output, lineout is used as audio PA input. The headphone interface features stereo left and right channel output, and supports headphone insertion detection. 3.22.1. Reference Circuit Design for Microphone Interfaces Figure 23: Reference Circuit Design for ECM Microphone Interface Figure 24: Reference Circuit Design for MEMS Microphone Interface SC206E_Series_Hardware_Design 64 / 115 MIC1_PECM MICModuleMIC1_MC2C3MIC_BIAS1R3R1C1R42.2K0R0RMIC1_PECM MICModuleMIC1_MC2C3MIC_BIAS1R3R1R2C1R42.2K0R0R0R100 nF33 pF33 pFD1MIC3_PMEMS MICR2R1C2ModuleC1MIC_BIAS31234F1OUTGNDGNDVDDMIC3_MD1C3D233 pF100 nF0R0R33 pF 3.22.2. Reference Circuit Design for Earpiece Interface Smart Module Series Figure 25: Reference Circuit Design for Earpiece Interface 3.22.3. Reference Circuit Design for Headset Interface Figure 26: Reference Circuit Design for Headset Interface SC206E_Series_Hardware_Design 65 / 115 EAR_PEAR_MR233 pF33 pF33 pFC2C3C1R1ModuleD1D20R0R20KESDMIC2_PHPH_LHS_DETHPH_RHPH_GND33 pFModule63452133 pF33 pFC3C4C5F3F2F1D1D2D3D4F4R2R30R 3.22.4. Reference Circuit Design for Lineout Interface Smart Module Series Figure 27: Reference Circuit Design for Lineout Interface 3.22.5. Audio Signal Design Considerations It is recommended to use the ECM microphone with dual built-in capacitors (e.g., 10 pF and 33 pF) to filter out RF interference, thus reducing TDD noise. The 33 pF capacitor is applied to filter out RF interference when the module is transmitting at EGSM900. The 10 pF capacitor is used to filter out RF interference at DCS1800. Without this capacitor, TDD noise could be heard during voice calls. Please note that the resonant frequency point of a capacitor largely depends on its material and manufacturing technique. Therefore, you should consult the capacitor vendors to choose the most suitable capacitor to filter out the high-frequency noises. The severity of RF interference in the voice channel during GSM transmitting largely depends on the application design. In some cases, EGSM900 TDD noise is more severe; while in other cases, DCS1800 TDD noise is more obvious. Therefore, you should select a suitable capacitor according to the test results. Sometimes, even no RF filtering capacitor is required. In order to decrease radio or other signal interference, place RF antennas away from audio interfaces and audio traces. Additionally, keep power traces far away from the audio traces and do not route them in parallel. Route the differential audio traces according to the differential signal layout rule. SC206E_Series_Hardware_Design 66 / 115 ENPA_ENC2D1D2NC+IN-INVO2GNDVDDVO1F2F1C1R2R3R1C3C4C5C7C6Audio PALINEOUT_PLINEOUT_MVPH_PWR10 F10 F100K100K10K22 F1 F33 pF33 pF100 pF Smart Module Series 3.23. USB_BOOT USB_BOOT is an emergency download interface. You can force the module to enter emergency download mode by pulling it up to LDO15A_1V8 when the module is turning on. This is an emergency option when failures such as abnormal start-up or running occur. For firmware upgrade and debugging in the future, reserve the following reference design. Table 27: Pin Definition of USB_BOOT Interface Pin Name Pin No. I/O Description Comment USB_BOOT 46 DI Force the module into emergency download mode Force the module to enter emergency download mode by pulling this pin up to LDO15A_1V8 when the module is turning on. Figure 28: Reference Circuit Design for Emergency Download Interface SC206E_Series_Hardware_Design 67 / 115 LDO15A_1V8S1 ModuleUSB_BOOTR110K Smart Module Series 4 Wi-Fi/Bluetooth The module provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth functions. The interface impedance should be controlled to 50 . You can connect external antennas such as PCB antenna, sucker antenna, and ceramic antenna to the module via the interface to achieve Wi-Fi and Bluetooth functions. Bluetooth and WLAN (both 5G and 2.4 G) are operating in TDD under coex mode. 4.1. Wi-Fi The module supports 2.4 GHz and 5 GHz dual-band WLAN based on IEEE 802.11a/b/g/n/ac standard protocols. The maximum data rate is up to 150 Mbps in 2.4 GHz bands, and 433 Mbps in 5 GHz bands. The features are as below:
Supports Wake-on-WLAN (WoWLAN) Supports ad hoc mode Supports WAPI SMS4 hardware encryption Supports AP and STA mode Supports Wi-Fi Direct Supports MCS 07 for HT20 and HT40 Supports MCS 08 for VHT20 Supports MCS 09 for VHT40 and VHT80 4.1.1. Wi-Fi Performance The following table lists the Wi-Fi transmitting and receiving performance of the module. Table 28: Wi-Fi Transmitting Performance Frequency Bands Standard Rate Output Power 802.11b 1 Mbps 16.5 dBm 3 dB 2.4 GHz 802.11b 11 Mbps 16.5 dBm 3 dB 802.11g 6 Mbps 16.5 dBm 3 dB SC206E_Series_Hardware_Design 68 / 115 Smart Module Series 802.11g 54 Mbps 14.5 dBm 3 dB 802.11n HT20 MCS0 15 dBm 3 dB 802.11n HT20 MCS7 14.5 dBm 3 dB 802.11n HT40 MCS0 15 dBm 3 dB 802.11n HT40 MCS7 13.5 dBm 3 dB 802.11a 802.11a 6 Mbps 54 Mbps 15.5 dBm 3 dB 13 dBm 3 dB 802.11n HT20 MCS0 15.5 dBm 3 dB 802.11n HT20 MCS7 13 dBm 3 dB 802.11n HT40 MCS0 15.5 dBm 3 dB 802.11n HT40 MCS7 13 dBm 3 dB 802.11ac VHT20 MCS0 15.5 dBm 3 dB 802.11ac VHT20 MCS8 12.5 dBm 3 dB 802.11ac VHT40 MCS0 802.11ac VHT40 MCS9 15 dBm 3 dB 12 dBm 3 dB 802.11ac VHT80 MCS0 14.5 dBm 3 dB 802.11ac VHT80 MCS9 11 dBm 3 dB 5 GHz Table 29: Wi-Fi Receiving Performance Frequency Bands Standard Rate Sensitivity 802.11b 802.11b 2.4 GHz 802.11g 802.11g 1 Mbps 11 Mbps 6 Mbps 54 Mbps 802.11n HT20 MCS0
-96 dBm
-87 dBm
-90 dBm
-74 dBm
-90 dBm SC206E_Series_Hardware_Design 69 / 115 Smart Module Series 802.11n HT20 802.11n HT40 802.11n HT40 802.11a 802.11a 802.11n HT20 802.11n HT20 802.11n HT40 802.11n HT40 802.11ac VHT20 802.11ac VHT20 802.11ac VHT40 802.11ac VHT40 802.11ac VHT80 802.11ac VHT80 MCS7 MCS0 MCS7 6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 MCS0 MCS8 MCS0 MCS9 MCS0 MCS9 5 GHz
-71 dBm
-87 dBm
-70 dBm
-90 dBm
-74 dBm
-90 dBm
-70 dBm
-87 dBm
-68 dBm
-90 dBm
-68 dBm
-87 dBm
-63 dBm
-83 dBm
-59 dBm Reference specifications are listed below:
IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY, June 2007 IEEE Std 802.11a, IEEE Std 802.11b, IEEE Std 802.11g: IEEE 802.11-2007 WLAN MAC and PHY, June 2007 4.2. Bluetooth The module supports Bluetooth 5.0 (BR/EDR + BLE) specification, as well as GFSK, 8-DPSK, /4-
DQPSK modulation modes. Maximally supports up to 7 wireless connections. Maximally supports up to 3.5 piconets at the same time. Support one SCO or eSCO connection. SC206E_Series_Hardware_Design 70 / 115 The BR/EDR channel bandwidth is 1 MHz, and can accommodate 79 channels. The BLE channel bandwidth is 2 MHz, and can accommodate 40 channels. Smart Module Series Table 30: Bluetooth Data Rate and Version Version 1.2 2.0 + EDR 3.0 + HS 4.0 5.0 Data Rate Maximum Application Throughput 1 Mbit/s 3 Mbit/s 24 Mbit/s 24 Mbit/s 24 Mbit/s
> 80 kbit/s
> 80 kbit/s Reference 3.0 + HS Reference 4.0 LE Reference 5.0 LE Reference specifications are listed below:
Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1 + EDR/3.0/3.0 +
HS, August 6, 2009 Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009 4.2.1. Bluetooth Performance The following table lists the Bluetooth transmitting and receiving performance of the module. Table 31: Bluetooth Transmitting and Receiving Performance Transmitter Performance Packet Types DH5 2-DH5 3-DH5 Transmitting Power 7 dBm 3 dB 6.5 dBm 3 dB 6.5 dBm 3 dB Receiver Performance Packet Types DH5 2-DH5 Receiving Sensitivity
-93 dBm
-93 dBm 3-DH5
-86 dBm SC206E_Series_Hardware_Design 71 / 115 Smart Module Series 5 GNSS The module integrates a IZat GNSS engine (GEN 8C) which supports multiple positioning and navigation systems including GPS, GLONASS, Galileo, BDS, QZSS, SBAS and NavIC 5 . With an embedded LNA, the positioning accuracy of the module has been significantly improved. 5.1. GNSS Performance The following table lists the GNSS performance of the module in conduction mode. Table 32: GNSS Performance Parameter Description Acquisition Sensitivity Reacquisition Tracking Cold start TTFF Warm start Hot start CEP-50 Accuracy NOTE Typ.
-147
-159
-159 31.2 24.7 1.32 1.95 Unit dBm dBm dBm s s s m 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock
(keep positioning for at least 3 minutes continuously). 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock. 3. Acquisition sensitivity: the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command. 5 SC206E-WF does not support GNSS and NavIC is supported by SC206E-NA only. SC206E_Series_Hardware_Design 72 / 115 Smart Module Series 5.2. GNSS RF Design Guidelines Bad design of antenna and layout may cause reduced GNSS receiving sensitivity, longer GNSS positioning time, or reduced positioning accuracy. In order to avoid this, follow the reference design rules as below:
Maximize the distance between the GNSS RF part and the GPRS RF part (including trace routing and antenna layout) to avoid mutual interference. In user systems, place GNSS RF signal lines and RF components far away from high-speed circuits, switch-mode power supplies, power inductors, the clock circuit of single-chip microcomputers, etc. For applications with harsh electromagnetic environment or high ESD-protection requirements, it is recommended to add ESD protective diodes for the antenna interface. The junction capacitance of the diodes should be less than 0.5 pF. Otherwise, it will influence the impedance characteristic of RF circuit loop, or cause attenuation of bypass RF signals. Control the impedance of feeder lines and PCB traces to 50 , and keep the trace as short as possible. See Chapter 6.3 for reference circuit designs of GNSS antenna. SC206E_Series_Hardware_Design 73 / 115 Smart Module Series 6 Antenna Interfaces SC206E-CE/EM/NA provides four antenna interfaces for the main, Rx-diversity, Wi-Fi/Bluetooth, and GNSS antennas respectively, while SC206E-WF provides one antenna interface for Wi-Fi/Bluetooth antenna only. The impedance of the antenna ports should be controlled to 50 . 6.1. Main Antenna and Rx-diversity Antenna Interfaces Table 33: Pin Definition of Main/Rx-diversity Antenna Interfaces Pin Name Pin No. I/O Description Comment ANT_MAIN 87 AIO Main antenna interface ANT_DRX 131 AI Diversity antenna interface 50 impedance 6.1.1. Operating Frequency The operating frequencies of the modules are listed in the following tables. Table 34: SC206E-CE Operating Frequency 3GPP Bands EGSM900 DCS1800 Receive 925960 Transmit 880915 18051880 17101785 WCDMA B1 21102170 19201980 WCDMA B8 925960 EV-DO/CDMA BC0 869894 880915 824849 LTE-FDD B1 21102170 19201980 Unit MHz MHz MHz MHz MHz MHz SC206E_Series_Hardware_Design 74 / 115 Smart Module Series LTE-FDD B3 18051880 17101785 LTE-FDD B5 LTE-FDD B8 869894 925960 824849 880915 LTE-TDD B34 20102025 20102025 LTE-TDD B38 25702620 25702620 LTE-TDD B39 18801920 18801920 LTE-TDD B40 23002400 23002400 LTE-TDD B41 25352675 25352675 Table 35: SC206E-EM Operating Frequency 3GPP Bands GSM850 EGSM900 DCS1800 PCS1900 Receive 869894 925960 Transmit 824849 880915 18051880 17101785 19301990 18501910 WCDMA B1 21102170 19201980 WCDMA B2 19301990 18501910 WCDMA B4 21102155 17101755 WCDMA B5 WCDMA B8 869894 925960 824849 880915 LTE-FDD B1 21102170 19201980 LTE-FDD B2 19301990 18501910 LTE-FDD B3 18051880 17101785 LTE-FDD B4 21102155 17101755 LTE-FDD B5 869894 824849 MHz MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz SC206E_Series_Hardware_Design 75 / 115 Smart Module Series LTE-FDD B7 26202690 25002570 LTE-FDD B8 LTE-FDD B20 LTE-FDD B28 925960 791821 758803 880915 832862 703748 LTE-TDD B38 25702620 25702620 LTE-TDD B40 23002400 23002400 LTE-TDD B41 24962690 24962690 Table 36: SC206E-NA Operating Frequency 3GPP Bands Receive Transmit LTE-FDD B2 19301990 18501910 LTE-FDD B4 21102155 17101755 LTE-FDD B5 869894 824849 LTE-FDD B7 26202690 25002570 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 729746 746756 758768 734746 699716 777787 788798 704716 LTE-FDD B25 19301995 18501915 LTE-FDD B26 859894 814849 LTE-FDD B66 21102180 17101780 LTE-FDD B71 617652 663698 LTE-TDD B41 24962690 24962690 MHz MHz MHz MHz MHz MHz MHz Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz SC206E_Series_Hardware_Design 76 / 115 Smart Module Series 6.1.2. Reference Design A reference circuit design for the main and Rx-diversity antenna interfaces is shown below. Reserve a -
type matching circuit for each antenna to achieve better RF performance, and place the -type matching components (R1/C1/C2 and R2/C3/C4) as close to the antennas as possible. The capacitors are not mounted by default and the resistors are 0 . Figure 29: Reference Circuit Design for Main and Rx-diversity Antenna Interfaces 6.2. Wi-Fi/Bluetooth Antenna Interface The following tables show the pin definition and frequency specification of the Wi-Fi/Bluetooth antenna interface. Table 37: Pin Definition of Wi-Fi/Bluetooth Antenna Interface Pin Name Pin No. I/O Description Comment ANT_WIFI/BT 77 AIO Wi-Fi/Bluetooth antenna interface 50 impedance SC206E_Series_Hardware_Design 77 / 115 ANT_MAINR1 0 C1ModuleNMC2NMMainAntennaANT_DIVR2 0 C3NMC4NMDiversityAntenna Table 38: Wi-Fi/Bluetooth Frequency Type Wi-Fi (2.4 GHz) Wi-Fi (5 GHz) Bluetooth 5.0 Frequency 24022482 51805825 24022480 Smart Module Series Unit MHz MHz MHz A reference circuit design for Wi-Fi/Bluetooth antenna interface is shown as below. C1 and C2 are not mounted by default and the resistor is 0 . Figure 30: Reference Circuit Design for Wi-Fi/Bluetooth Antenna 6.3. GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface. Table 39: Pin Definition of GNSS Antenna Interface Pin Name Pin No. ANT_GNSS 121 I/O AI Description Comment GNSS antenna interface 50 impedance SC206E_Series_Hardware_Design 78 / 115 ANT_WIFI/BTR1 0 C1ModuleNMC2NMWi-Fi/Bluetooth antenna Table 40: GNSS Frequency Type GPS L1 GPS L5 Frequency 1575.42 1.023 1176.45 10.23 GLONASS L1 1597.51605.8 BDS B1I Galileo E1 1561.098 2.046 1575.42 2.046 Galileo E5a 1176.45 10.23 QZSS L1 QZSS L5 SBAS L1 SBAS L5 NavlC L5 1575.42 1.023 1176.45 10.23 1575.42 1.023 1176.45 10.23 1176.45 10.23 Smart Module Series Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz 6.3.1. Reference Circuit Design for Passive GNSS Antenna GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. A reference circuit design is given below. Figure 31: Reference Circuit Design for Passive GNSS Antenna NOTE It is not recommended to add an external LNA when using a passive GNSS antenna. SC206E_Series_Hardware_Design 79 / 115 Passive AntennaModuleANT_GNSSNMC1C2C3NMR10 Smart Module Series 6.3.2. Reference Circuit Design for Active GNSS Antenna The active antenna is powered by a 56 nH inductor through the antenna's signal path. The common power supply voltage ranges from 3.3 V to 5.0 V. Despite its low power consumption, the active antenna still requires stable and clean power supplies. Therefore, it is recommended to use high-performance LDO as the power supply. A reference design for active GNSS antenna is shown below. Figure 32: Reference Circuit Design for Active GNSS Antenna NOTE It is recommended to use a passive antenna. If active antennas are required, it is strongly recommended to reserve a -type attenuation and ensure that the total gain of the external GNSS RF path of the module is not greater than 0 dB. At the same time, this may compromise the GNSS performance, depending on the performance of the active antenna. 6.4. RF Routing Guidelines For users PCB, the characteristic impedance of all RF traces should be controlled to 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. SC206E_Series_Hardware_Design 80 / 115 Active Antenna3V3ModuleANT_GNSS56 nH10 1 F100 pFC1R1L1C3C2100 pFR3R4R50 NMNM Smart Module Series Figure 33: Microstrip Design on a 2-layer PCB Figure 34: Coplanar Waveguide Design on a 2-layer PCB Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) SC206E_Series_Hardware_Design 81 / 115 Smart Module Series In order to ensure RF performance and reliability, follow the principles below in RF layout design:
Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers. For more details about RF layout, see document [3]. 6.5. Antenna Installation 6.5.1. Antenna Requirements The following table shows the requirements for the main antenna, Rx-diversity antenna, Wi-Fi/Bluetooth antenna, and GNSS antenna. Table 41: Antenna Requirements Type Requirements GSM/WCDMA/LTE Wi-Fi/Bluetooth VSWR: 2 Gain: 1 dBi Max Input Power: 50 W Input Impedance: 50 Polarization Type: Vertical Cable insertion loss:
< 1 dB: LB (< 1 GHz)
< 1.5 dB: MB (12.3 GHz)
< 2 dB: HB (> 2.3 GHz) VSWR: 2 Gain: 1 dBi Max Input Power: 50 W Input Impedance: 50 SC206E_Series_Hardware_Design 82 / 115 Smart Module Series Polarization Type: Vertical Cable Insertion Loss: < 1 dB Frequency range (L1): 15591609 MHz Frequency range (L5): 11661187 MHz (SC206E-NA only) Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0 dBi Active antenna noise figure: < 1.5 dB (Typ.) Active antenna gain: > -2 dBi Active antenna embedded LNA gain: < 17 dB (Typ.) Active antenna total gain: < 17 dBi (Typ.) Total gain of the GNSS RF trace outside the module: 0 dB (Typ.) GNSS NOTE It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 6.5.2. RF Connector Recommendation If you use an RF connector for antenna connection, it is recommended to use the U.FL-R-SMT receptacle provided by Hirose. Figure 37: Dimensions of the U.FL-R-SMT Receptacle (Unit: mm) SC206E_Series_Hardware_Design 83 / 115 U.FL-LP serial plugs listed in the following figure can be used to match U.FL-R-SMT. Smart Module Series Figure 38: Mechanicals of U.FL-LP Plugs The following figure describes the space factor of mated connectors. Figure 39: Space Factor of Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com. SC206E_Series_Hardware_Design 84 / 115 Smart Module Series 7 Reliability, Radio and Electrical Characteristics 7.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 42: Absolute Maximum Ratings Parameter VBAT USB_VBUS Peak Current of VBAT Voltage on Digital Pins Min.
-0.5
-0.5
-0.3 Max. Unit 6 16 3 2.16 V V A V 7.2. Power Supply Ratings Table 43: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT The actual input voltages must stay between the minimum and maximum values Voltage drop during transmitting burst Maximum power control level at EGSM900 IVBAT Peak supply current
(during transmission slot) Maximum power control level at EGSM900 3.5 3.8 4.4 V
400 mV 1.8 3.0 A SC206E_Series_Hardware_Design 85 / 115 USB_VBUS Charging power input
4.0 5.0 6.0 V Smart Module Series VIH VIL VOH VOL VIH VIL VOH VOL Min. 1.17
-0.3 Min. 1.75 1.26
-0.3 7.3. Digital I/O Characteristics Table 44: 1.8 V Digital I/O Requirements Parameter Description Input high voltage Input low voltage Output high voltage 1.35 Output low voltage 0 Table 45: (U)SIM 1.8 V I/O Requirements Parameter Description USIM_VDD Power supply Input high voltage Input low voltage Output high voltage 1.44 Output low voltage 0 Table 46: (U)SIM 2.95 V I/O Requirements Parameter Description USIM_VDD Power supply Min. 2.8 VIH VIL Input high voltage 2.065 Input low voltage
-0.3 Max. Unit 2.1 0.63 1.8 0.45 V V V V Max. Unit 1.85 2.1 0.36 1.8 0.4 Max. 3.1 3.25 0.59 V V V V V Unit V V V SC206E_Series_Hardware_Design 86 / 115 VOH VOL Output high voltage 2.36 Output low voltage 0 Table 47: SD Card 1.8 V I/O Requirements Parameter Description Input high voltage Input low voltage Output high voltage Output low voltage
Table 48: SD Card 2.95 V I/O Requirements Parameter Description Input high voltage Input low voltage Output high voltage 2.21 Output low voltage 0 Min. 1.27
-0.3 1.4 Min. 1.84
-0.3 VIH VIL VOH VOL VIH VIL VOH VOL Smart Module Series 2.95 0.4 Max. 2 0.58
0.45 Max. 3.25 0.74 2.95 0.37 V V Unit V V V V Unit V V V V 7.4. Operating and Storage Temperatures The operating and storage temperatures are listed in the following table. Table 49: Operating and Storage Temperatures Parameter Min. Operating temperature range 6
-35 Storage Temperature Range
-40 Typ.
+25
Max. Unit
+75
+90 C C 6 Within operating temperature range, the module meets 3GPP specifications. SC206E_Series_Hardware_Design 87 / 115 Smart Module Series 7.5. Power Consumption The values of current consumption are shown below. Table 50: SC206E-CE Power Consumption Description Conditions Typ. Unit OFF state Power off 42 Sleep state (USB disconnected) @ DRX = 2 4.93 GSM/GPRS supply current Sleep state (USB disconnected) @ DRX = 5 4.26 WCDMA supply current CDMA supply current LTE-FDD supply current LTE-TDD supply current Sleep state (USB disconnected) @ DRX = 9 3.85 Sleep state (USB disconnected) @ DRX = 6 4.65 Sleep state (USB disconnected) @ DRX = 7 4.21 Sleep state (USB disconnected) @ DRX = 8 4.11 Sleep state (USB disconnected) @ DRX = 9 3.87 BC0 CH283 @ Slot Cycle Index = 1 BC0 CH283 @ Slot Cycle Index = 7 4.94 3.71 Sleep state (USB disconnected) @ DRX = 5 6.27 Sleep state (USB disconnected) @ DRX = 6 5 Sleep state (USB disconnected) @ DRX = 7 4.28 Sleep state (USB disconnected) @ DRX = 8 4.17 Sleep state (USB disconnected) @ DRX = 5 6.3 Sleep state (USB disconnected) @ DRX = 6 5.1 Sleep state (USB disconnected) @ DRX = 7 4.43 Sleep state (USB disconnected) @ DRX = 8 3.99 GSM voice call EGSM900 @ PCL 5 EGSM900 @ PCL 12 287 143 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC206E_Series_Hardware_Design 88 / 115 WCDMA voice call GPRS data transmission EDGE data transmission EGSM900 @ PCL 19 DCS1800 @ PCL 0 DCS1800 @ PCL 7 DCS1800 @ PCL 15 B1 @ max. power B8 @ max. power EGSM900 (1UL/4DL) @ PCL 5 EGSM900 (2UL/3DL) @ PCL 5 EGSM900 (3UL/2DL) @ PCL 5 EGSM900 (4UL/1DL) @ PCL 5 DCS1800 (1UL/4DL) @ PCL 0 DCS1800 (2UL/3DL) @ PCL 0 DCS1800 (3UL/2DL) @ PCL 0 DCS1800 (4UL/1DL) @ PCL 0 EGSM900 (1UL/4DL) @ PCL 8 EGSM900 (2UL/3DL) @ PCL 8 EGSM900 (3UL/2DL) @ PCL 8 EGSM900 (4UL/1DL) @ PCL 8 DCS1800 (1UL/4DL) @ PCL 2 DCS1800 (2UL/3DL) @ PCL 2 DCS1800 (3UL/2DL) @ PCL 2 DCS1800 (4UL/1DL) @ PCL 2 B1 (HSDPA) @ max power WCDMA data transmission B8 (HSDPA) @ max power B1 (HSUPA) @ max power Smart Module Series 87 190 137 85 586 640 282 451 528 613 190 297 356 439 202 326 436 556 178 278 374 476 552 596 573 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC206E_Series_Hardware_Design 89 / 115 B8 (HSUPA) @ max power EV-DO/CDMA data transmission BC0 @ max power LTE-FDD B1 @ max power LTE-FDD B3 @ max power LTE-FDD B5 @ max power LTE-FDD B8 @ max power LTE data transmission LTE-TDD B34 @ max power LTE-TDD B38 @ max power LTE-TDD B39 @ max power LTE-TDD B40 @ max power LTE-TDD B41 @ max power Smart Module Series 614 614 654 653 587 638 307 407 325 401 433 mA mA mA mA mA mA mA mA mA mA mA Table 51: SC206E-EM Power Consumption Description Conditions Typ. Unit OFF state Power off 39 Sleep state (USB disconnected) @ DRX = 2 4.99 GSM/GPRS supply current Sleep state (USB disconnected) @ DRX = 5 4.24 WCDMA supply current LTE-FDD supply current Sleep state (USB disconnected) @ DRX = 9 4.01 Sleep state (USB disconnected) @ DRX = 6 4.57 Sleep state (USB disconnected) @ DRX = 7 4.17 Sleep state (USB disconnected) @ DRX = 8 3.97 Sleep state (USB disconnected) @ DRX = 9 3.85 Sleep state (USB disconnected) @ DRX = 5 6.26 Sleep state (USB disconnected) @ DRX = 6 4.98 Sleep state (USB disconnected) @ DRX = 7 4.31 Sleep state (USB disconnected) @ DRX = 8 4.01 A mA mA mA mA mA mA mA mA mA mA mA SC206E_Series_Hardware_Design 90 / 115 Smart Module Series LTE-TDD supply current Sleep state (USB disconnected) @ DRX = 5 6.36 Sleep state (USB disconnected) @ DRX = 6 5.03 Sleep state (USB disconnected) @ DRX = 7 4.38 Sleep state (USB disconnected) @ DRX = 8 4.02 GSM voice call GSM850 @ PCL 5 GSM850 @ PCL 12 GSM850 @ PCL 19 EGSM900 @ PCL 5 EGSM900 @ PCL 12 EGSM900 @ PCL 19 DCS1800 @ PCL 0 DCS1800 @ PCL 7 DCS1800 @ PCL 15 PCS1900 @ PCL 0 PCS1900 @ PCL 7 PCS1900 @ PCL 15 B1 @ max power B2 @ max power WCDMA voice call B4 @ max power B5 @ max power B8 @ max power GSM850 (1UL/4DL) @ PCL 5 GSM850 (2UL/3DL) @ PCL 5 GSM850 (3UL/2DL) @ PCL 5 GSM850 (4UL/1DL) @ PCL 5 EGSM900 (1UL/4DL) @ PCL 5 EGSM900 (2UL/3DL) @ PCL 5 GPRS data transmission 274 139 83 291 138 83 181 133 81 190 135 81 590 590 630 550 630 267 417 490 579 287 451 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC206E_Series_Hardware_Design 91 / 115 EGSM900 (3UL/2DL) @ PCL 5 EGSM900 (4UL/1DL) @ PCL 5 DCS1800 (1UL/4DL) @ PCL 0 DCS1800 (2UL/3DL) @ PCL 0 DCS1800 (3UL/2DL) @ PCL 0 DCS1800 (4UL/1DL) @ PCL 0 PCS1900 (1UL/4DL) @ PCL 0 PCS1900 (2UL/3DL) @ PCL 0 PCS1900 (3UL/2DL) @ PCL 0 PCS1900 (4UL/1DL) @ PCL 0 GSM850 (1UL/4DL) @ PCL 8 GSM850 (2UL/3DL) @ PCL 8 GSM850 (3UL/2DL) @ PCL 8 GSM850 (4UL/1DL) @ PCL 8 EGSM900 (1UL/4DL) @ PCL 8 EGSM900 (2UL/3DL) @ PCL 8 EGSM900 (3UL/2DL) @ PCL 8 EGSM900 (4UL/1DL) @ PCL 8 DCS1800 (1UL/4DL) @ PCL 2 DCS1800 (2UL/3DL) @ PCL 2 DCS1800 (3UL/2DL) @ PCL 2 DCS1800 (4UL/1DL) @ PCL 2 PCS1900 (1UL/4DL) @ PCL 2 PCS1900 (2UL/3DL) @ PCL 2 PCS1900 (3UL/2DL) @ PCL 2 PCS1900 (4UL/1DL) @ PCL 2 EDGE data transmission WCDMA data transmission B1 (HSDPA) @ max power Smart Module Series 524 617 188 277 344 426 193 291 352 435 194 318 430 550 200 325 438 554 173 275 376 491 171 274 373 480 560 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC206E_Series_Hardware_Design 92 / 115 Smart Module Series B2 (HSDPA) @ max power B4 (HSDPA) @ max power B5 (HSDPA) @ max power B8 (HSDPA) @ max power B1 (HSUPA) @ max power B2 (HSUPA) @ max power B4 (HSUPA) @ max power B5 (HSUPA) @ max power B8 (HSUPA) @ max power LTE-FDD B1 @ max power LTE-FDD B2 @ max power LTE-FDD B3 @ max power LTE-FDD B4 @ max power LTE-FDD B5 @ max power LTE-FDD B7 @ max power LTE-FDD B8 @ max power LTE-FDD B20 @ max power LTE-FDD B28 @ max power LTE-TDD B38 @ max power LTE-TDD B40 @ max power LTE-TDD B41 @ max power LTE data transmission Table 52: SC206E-NA Power Consumption Description Conditions OFF state Power off 550 590 515 610 575 565 600 530 600 645 600 630 670 580 650 585 605 570 370 370 400 Typ. 36.0 LTE-FDD supply current Sleep state (USB disconnected) @ DRX = 5 6.25 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Unit A mA SC206E_Series_Hardware_Design 93 / 115 Smart Module Series mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Sleep state (USB disconnected) @ DRX = 6 4.85 Sleep state (USB disconnected) @ DRX = 7 4.19 Sleep state (USB disconnected) @ DRX = 8 3.96 Sleep state (USB disconnected) @ DRX = 5 6.34 Sleep state (USB disconnected) @ DRX = 6 5.07 Sleep state (USB disconnected) @ DRX = 7 4.33 Sleep state (USB disconnected) @ DRX = 8 4.04 LTE-TDD supply current 671 649 670 822 722 742 639 705 707 660 673 634 423 LTE-FDD B2 @ max power LTE-FDD B4 @ max power LTE-FDD B5 @ max power LTE-FDD B7 @ max power LTE-FDD B12 @ max power LTE-FDD B13 @ max power LTE data transmission LTE-FDD B14 @ max power LTE-FDD B17@ max power LTE-FDD B25 @ max power LTE-FDD B26 @ max power LTE-FDD B66 @ max power LTE-FDD B71 @ max power LTE-TDD B41 @ max power 7.6. Tx Power The following tables show the RF output power of the module. Table 53: SC206E-CE RF Tx Power Frequency Bands Max. RF Output Power Min. RF Output Power SC206E_Series_Hardware_Design 94 / 115 Smart Module Series EGSM900 DCS1800 WCDMA B1 WCDMA B8 33 dBm 2 dB 30 dBm 2 dB 24 dBm +1/-3 dB 24 dBm +1/-3 dB EV-DO/CDMA BC0 24 dBm +3/-1 dB LTE-FDD B1 LTE-FDD B3 LTE-FDD B5 LTE-FDD B8 LTE-TDD B34 LTE-TDD B38 LTE-TDD B39 LTE-TDD B40 LTE-TDD B41 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 5 dBm 5 dB 0 dBm 5 dB
< -49 dBm
< -49 dBm
< -49 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm Table 54: SC206E-EM RF Tx Power Frequency Bands Max. RF Output Power Min. RF Output Power GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8 LTE-FDD B1 LTE-FDD B2 33 dBm 2 dB 33 dBm 2 dB 30 dBm 2 dB 30 dBm 2 dB 24 dBm +1/-3 dB 24 dBm +1/-3 dB 24 dBm +1/-3 dB 24 dBm +1/-3 dB 24 dBm +1/-3 dB 23 dBm 2 dB 23 dBm 2 dB 5 dBm 5 dB 5 dBm 5 dB 0 dBm 5 dB 0 dBm 5 dB
< -49 dBm
< -49 dBm
< -49 dBm
< -49 dBm
< -49 dBm
< -39 dBm
< -39 dBm SC206E_Series_Hardware_Design 95 / 115 Smart Module Series LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B20 LTE-FDD B28 LTE-TDD B38 LTE-TDD B40 LTE-TDD B41 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm Table 55: SC206E-NA RF Tx Power Frequency Bands Max. RF Output Power Min. RF Output Power LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B17 LTE-FDD B25 LTE-FDD B26 LTE-FDD B66 LTE-FDD B71 LTE-TDD B41 NOTE 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB 23 dBm 2 dB
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm
< -39 dBm SC206E_Series_Hardware_Design 96 / 115 In GPRS and EDGE 4-slot Tx mode, the maximum output power is reduced by 3 dB. This design conforms to the GSM specification as described in 3GPP TS 51.010-1 subclause 13.16 and subclause 13.17. Smart Module Series 7.7. Rx Sensitivity The following table shows the RF receiving sensitivity of the module. Table 56: SC206E-CE RF Rx Sensitivity Frequency Bands Receiving Sensitivity (dBm) (Typ.) Primary Diversity SIMO 3GPP (SIMO) EGSM900 DCS1800 WCDMA B1 WCDMA B8
-109.5
-109
-110.5
-111 EV-DO/CDMA BC0
-108.5 LTE-FDD B1 (10 MHz)
-98 LTE-FDD B3 (10 MHz)
-98.5 LTE-FDD B5 (10 MHz)
-99.5 LTE-FDD B8 (10 MHz) LTE-TDD B34 (10 MHz) LTE-TDD B38 (10 MHz) LTE-TDD B39 (10 MHz)
-99
-98
-97
-98 LTE-TDD B40 (10 MHz)
-97.5 LTE-TDD B41 (10 MHz)
-96
-112
-112
-100
-98.5
-99.5
-100
-99
-98
-99
-98.5
-98
TBD TBD
-102
-101.5
-102.5
-102.5
-101.5
-99.6
-101.5
-101
-99.5
-102.4
-102.4
-106.7
-103.7
-104
-96.3
-93.3
-94.3
-93.3
-96.3
-96.3
-96.3
-96.3
-94.3 Table 57: SC206E-EM RF Rx Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO Receiving Sensitivity (dBm) (Typ.) SC206E_Series_Hardware_Design 97 / 115 GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B8
-109.9
-108.9
-109.8
-108.6
-109.3
-109.2
-108.4
-111
-110.9 LTE-FDD B1 (10 MHz)
-97.5 LTE-FDD B2 (10 MHz)
-97 LTE-FDD B3 (10 MHz)
-98.5 LTE-FDD B4 (10 MHz) LTE-FDD B5 (10 MHz) LTE-FDD B7 (10 MHz) LTE-FDD B8 (10 MHz)
-97
-99
-97
-99 LTE-FDD B20 (10 MHz)
-99 LTE-FDD B28 (10 MHz)
-99 LTE-TDD B38 (10 MHz)
-97 LTE-TDD B40 (10 MHz)
-97.5 LTE-TDD B41 (10 MHz)
-96 Smart Module Series
-102.4
-102.4
-102.4
-102.4
-106.7
-104.7
-106.7
-104.7
-103.7
-96.3
-94.3
-93.3
-96.3
-94.3
-94.3
-93.3
-93.3
-94.8
-96.3
-96.3
-94.3
-111.2
-110.3
-111.2
-111
-112
-99
-98
-98
-99
-99.2
-97.4
-99.5
-100
-99.5
-97
-98.5
-97 TBD TBD TBD TBD TBD
-101.5
-100.5
-101.5
-101
-102
-100
-102
-102.5
-102
-100
-100.5
-99.5 Table 58: SC206E-NA RF Rx Sensitivity Frequency Bands 3GPP (SIMO) Primary Diversity SIMO Receiving Sensitivity (dBm) (Typ.) LTE-FDD B2 (10 MHz) LTE-FDD B4 (10 MHz) LTE-FDD B5 (10 MHz) TBD TBD TBD TBD TBD TBD TBD TBD TBD
-94.3
-96.3
-94.3 SC206E_Series_Hardware_Design 98 / 115 Smart Module Series TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
-94.3
-93.3
-93.3
-93.3
-93.3
-92.8
-93.8
-95.8
-93.5
-94.3 LTE-FDD B7 (10 MHz) TBD LTE-FDD B12 (10 MHz) TBD LTE-FDD B13 (10 MHz) TBD LTE-FDD B14 (10 MHz) TBD LTE-FDD B17 (10 MHz) TBD LTE-FDD B25 (10 MHz) TBD LTE-FDD B26 (10 MHz) TBD LTE-FDD B66 (10 MHz) TBD LTE-FDD B71 (10 MHz) TBD LTE-TDD B41 (10 MHz) TBD 7.8. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. The following table shows the electrostatic discharge characteristics of the module. Table 59: Electrostatic Discharge Characteristics (Temperature: 25 C, Humidity: 45 %) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND Antenna Interfaces 5 5 Other Interfaces 0.5 10 10 1 kV kV kV SC206E_Series_Hardware_Design 99 / 115 Smart Module Series 8 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 8.1. Mechanical Dimensions Figure 40: Module Top and Side Dimensions SC206E_Series_Hardware_Design 100 / 115 Smart Module Series Figure 41: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. SC206E_Series_Hardware_Design 101 / 115 8.2. Recommended Footprint Smart Module Series Figure 42: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. SC206E_Series_Hardware_Design 102 / 115 8.3. Top and Bottom Views Smart Module Series Figure 43: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. SC206E_Series_Hardware_Design 103 / 115 Smart Module Series 9 Storage, Manufacturing & Packaging 9.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition. 3. Floor life: 168 hours 7 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:
The module is not stored in Recommended Storage Condition;
Violation of the third requirement mentioned above;
Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
Before module repairing. 5. If needed, the pre-baking should follow the requirements below:
The module should be baked for 8 hours at 120 5 C;
The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put in a dry environment such as in a dry cabinet. 7 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. SC206E_Series_Hardware_Design 104 / 115 Smart Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 9.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.180.20 mm. For more details, see document [4]. The peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 44: Recommended Reflow Soldering Thermal Profile SC206E_Series_Hardware_Design 105 / 115 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Max slope: 13 C/s Cooling down slope: -1.5 to -3 C/s Max slope: 13 C/s Smart Module Series Table 60: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 13 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE 13 C/s 4070 s 235 C to 246 C
-1.5 to -3 C/s 1 1. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g., selective soldering, ultrasonic soldering) that is not mentioned in document [4]. SC206E_Series_Hardware_Design 106 / 115 Smart Module Series 9.3. Packaging Specification Dimension details are as follow:
Figure 45: Carrier Tape Dimension Drawing Table 61: Recommended Thermal Profile Parameters W 72 P 56 T A0 B0 0.4 41.2 41.2 K0 4 K1 4.6 F E 34.2 1.75 9.3.1. Plastic Reel Figure 46: Plastic Reel Dimension Drawing SC206E_Series_Hardware_Design 107 / 115 Smart Module Series Table 62: Plastic Reel Dimension Table (Unit: mm) D1 380 D2 180 W 72.5 9.3.2. Packaging Process Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, then vacuumize it. Place the module into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. One plastic reel can load 200 modules. Place the vacuum-packed plastic reel into a pizza box. Put 4 pizza boxes into 1 carton and seal it. One carton can load 800 modules. Figure 47: Packaging Process SC206E_Series_Hardware_Design 108 / 115 Smart Module Series 10 Appendix References Table 63: Related Documents Document Name
[1] Quectel_Smart_EVB_G2_User_Guide
[2] Quectel_SC206E_Series_GPIO_Configuration
[3] Quectel_RF_Layout_Application_Note
[4] Quectel_Module_Secondary_SMT_Application_Note Table 64: Terms and Abbreviations Abbreviation Description 3GPP ADC ADSP ALS 3rd Generation Partnership Project Analog-to-Digital Converter Audio Digital Signal Processor Ambient Light Sensor AMR-NB Adaptive Multi Rate-Narrow Band Speech Codec AMR-WB Adaptive Multi-Rate Wideband AP ARM BDS BLE bps BR Access Point/Application Processor Advanced RISC Machine BeiDou Navigation Satellite System Bluetooth Low Energy Bits per Second Basic Rate SC206E_Series_Hardware_Design 109 / 115 Smart Module Series CDMA Code Division Multiple Access CEP CPE CS CSD CSI CTS DC Circular Error Probable Customer-Premise Equipment Coding Scheme Circuit Switched Data Camera Serial Interface Clear to Send Dual Carrier DC-HSPA+
Dual Carrier High Speed Packet Access Plus DCE DCS DL DPSK DQPSK DRX DSI DSP DTE ECM EDGE EDR EFR EGSM eMMC eSCO Data Communications Equipment/Data Circuit terminating Equipment Digital Cellular System Downlink Differential Phase Shift Keying Differential Quadrature Reference Phase Shift Keying Discontinuous Reception Display Serial Interface Digital Signal Processor Data Terminal Equipment Electret Condenser Microphone Enhanced Data Rate for GSM Evolution Enhanced Data Rate Enhanced Full Rate Extended GSM Embedded Multimedia Card Extended Synchronous Connection Oriented SC206E_Series_Hardware_Design 110 / 115 Smart Module Series ESD ESR ETSI EVB EV-DO EVRC FDD fps FR Galileo GFSK Electrostatic Discharge Equivalent Series Resistance European Telecommunications Standards Institute Evaluation Board Evolution-Data Optimized Enhanced Variable Rate Codec Frequency Division Duplex Frame per Second Full Rate Galileo Satellite Navigation System (EU) Gaussian Frequency Shift Keying GLONASS Global Navigation Satellite System (Russia) GMSK GND GNSS GPIO GPRS GPS GPU GRFC GSM G.W. HR HS Gaussian Minimum Shift Keying Ground Global Navigation Satellite System General Purpose Input/Output General Packet Radio Service Global Positioning System Graphics Processing Unit Generic RF control Global System for Mobile Communications Gross Weight Half Rate High Speed HSDPA High Speed Downlink Packet Access SC206E_Series_Hardware_Design 111 / 115 Smart Module Series HSPA+
HSUPA HT I2C IC IEEE High-Speed Packet Access+
High Speed Uplink Packet Access High Throughput Inter-Integrated Circuit Integrated Circuit Institute of Electrical and Electronics Engineers IMT-2000 International Mobile Telecommunications for the year 2000 I/O IImax IOmax ISP LCC LCD LCM LDO LE LED LGA LNA Input/Output Maximum Input Load Current Maximum Output Load Current Image Signal Processor/Internet Service Provider Leadless Chip Carrier Liquid Crystal Display LCD Module Low Dropout Regulator Low Energy Light Emitting Diode Land Grid Array Low Noise Amplifier LPDDR Low-Power Double Data Rate LTE M2M MAC MCS Long-Term Evolution Machine to Machine Media Access Control Modulation and Coding Scheme MEMS Micro-Electro-Mechanical System SC206E_Series_Hardware_Design 112 / 115 Smart Module Series MIC MIMO MIPI MP MO MOQ MSL MT Microphone Multi-Input Multi-Output / Multiple Input Multiple Output Mobile Industry Processor Interface Megapixel Mobile Originating/Originated Minimum Order Quantity Moisture Sensitivity Levels Mobile Terminating/Terminated NavIC Indian Regional Navigation Satellite System N.W. NFC NTC OTA OTG OTP PA PC PCB PCL PCS PDA PDU PHY PMU POS Net Weight Near Field Communication Negative Temperature Coefficient Over-the-Air Upgrade On-The-Go One Time Programable Power Amplifier Personal Computer Printed Circuit Board Power Control Level Personal Communication Service Personal Digital Assistant Protocol Data Unit Physical Layer Power Management Unit Point of Sale SC206E_Series_Hardware_Design 113 / 115 Smart Module Series PWM PSK QAM QPSK QZSS RF RHCP RoHS RTC RTS SBAS SCO SD SIMO SMD SMS SMT STA TDD TP TTFF TVS UART UL UMTS Pulse Width Modulation Phase Shift Keying Quadrature Amplitude Modulation Quadrature Phase Shift Keying Quasi-Zenith Satellite System Radio Frequency Right Hand Circular Polarization Restriction of Hazardous Substances Real Time Clock Request to Send Satellite-Based Augmentation System Synchronous Connection Oriented Secure Digital Single Input Multiple Output Surface Mounting Device Short Message Service Surface Mount Technology Station Time-Division Duplex Touch Panel Time to First Fix Transient Voltage Suppressor Universal Asynchronous Receiver & Transmitter Uplink Universal Mobile Telecommunications System SC206E_Series_Hardware_Design 114 / 115 Smart Module Series USB
(U)SIM VBAT VHT Vmax Vmin Vnom VImax VImin VIHmin VILmax VOmax VOHmin VOLmax Vrms VSWR WAPI Universal Serial Bus
(Universal) Subscriber Identity Module Voltage at Battery (Pin) Very High Throughput Maximum Voltage Minimum Voltage Nominal Voltage Absolute Maximum Input Voltage Absolute Minimum Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Maximum Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Root Mean Square Voltage Voltage Standing Wave Ratio WLAN Authentication and Privacy Infrastructure WCDMA Wideband Code Division Multiple Access Wi-Fi WLAN Wireless Fidelity Wireless Local Area Network SC206E_Series_Hardware_Design 115 / 115
1 2 3 4 | Internal Photos | Internal Photos | 285.53 KiB | September 28 2022 / November 12 2022 | delayed release |
1 2 3 4 | External Photo | External Photos | 643.39 KiB | September 28 2022 / November 12 2022 | delayed release |
1 2 3 4 | Label and Location | ID Label/Location Info | 48.97 KiB | September 28 2022 |
QUELCTEL SC206E-NA O1-AXXXK NA SC206ENANA-ES5-UGNDA FCC ID:XMIR20225C205ENA. IC :10224A-22SC206ENA SN:E186719750XXXxX IMEI1:861 1080300X000X IMEI2:861 1080300XXXXX Label Location
1 2 3 4 | Test Setup Photos PCB | Test Setup Photos | 491.88 KiB | September 28 2022 / November 12 2022 | delayed release |
1 2 3 4 | Confidentiality Letter rev | Cover Letter(s) | 73.48 KiB | September 28 2022 |
Quectel Wireless Solutions Co., Ltd. Federal Communications Commission Authorization and Evaluation Division Confidentiality Request regarding application for certification of FCC ID: XMR2022SC206ENA. Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:
Exhibit Type
(1.Block Diagram.pdf; 4.MB_P4_sch.pdf;
3.Operation Description.pdf; 2.BOM.pdf; 8. Tuneup.pdf;) File Name
(Block Diagram, SCH, Operational description, BOM, Tune Up) The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Section 0.457 of the Rules, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. We are requesting the commission to grant short-term confidentiality request on the following attachment(s) for 45 days after the grant as outlined in Public Notice DA 04-1705. Exhibit Type
(External Photos, Internal Photos, Test Setup Photos, Manual) File Name
(Appendix A.4-External Photos.pdf; Appendix A.5-Internal Photos.pdf; Appendix A.2 -
DSS_DTS_NII Setup Photos; Appendix A.3 -
PCB Setup Photos; DFS Test Setup Photos, User Manual;) Sincerely, Name: Jean Hu Title: Certification Manager Rev 11/20/07
1 2 3 4 | Test Setup Photos | Test Setup Photos | 544.53 KiB | September 28 2022 / November 12 2022 | delayed release |
1 2 3 4 | DFS Test Setup Photos | Test Setup Photos | 759.62 KiB | September 28 2022 / November 12 2022 | delayed release |
1 2 3 4 | FCC change of ID Request Letter | Cover Letter(s) | 22.57 KiB | September 28 2022 |
Quectel Wireless Solutions Co., Ltd. Sep. 19, 2022 Federal Communications Commission Authorization & Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 RE: CHANGE IN IDENTIFICATION OF EQUIPMENT Dear Sir or Madam:
We, Quectel Wireless Solutions Co., Ltd., hereby request a new FCC ID as established in 47CFR2.933(b) for a currently approved device. This request is to establish the new FCC ID: XMR2022SC206ENA. Original FCC ID: XMR2022SC200ENA Original Model: SC200E-NA Original Grant Date: 07/05/2022 New FCC ID: XMR2022SC206ENA Model: SC206E-NA Brand(s): Quectel The equipment is the identical design and construction, and in an entirely unmodified condition, with respect to the original FCC Grant cited above, only the operating system is changed from the OS system to the Linux system. The equipment is the identical design and construction, and in an entirely unmodified condition, with respect to the original. (based on the original version LPDDR4X.) The original test results continue to be representative of and applicable to the new equipment. If you have any questions, please contact Rolando Torricella via phone +8602150086326 / 800 or email at jean.hu@quectel.com Sincerely, Jean hu Manager
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2022-09-28 | 2510 ~ 2560 | PCB - PCS Licensed Transmitter | Change in Identification |
2 | 2412 ~ 2462 | DTS - Digital Transmission System | ||
3 | 5745 ~ 5825 | NII - Unlicensed National Information Infrastructure TX | ||
4 | 2402 ~ 2480 | DSS - Part 15 Spread Spectrum Transmitter |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 2 3 4 | Effective |
2022-09-28
|
||||
1 2 3 4 | Applicant's complete, legal business name |
Quectel Wireless Solutions Company Limited
|
||||
1 2 3 4 | FCC Registration Number (FRN) |
0018988279
|
||||
1 2 3 4 | Physical Address |
Building 5, Shanghai Business Park PhaseIII (Area B),No.1016 Tianlin Road, Minhang District
|
||||
1 2 3 4 |
Building 5, Shanghai Business Park PhaseIII
|
|||||
1 2 3 4 |
Shanghai, N/A
|
|||||
1 2 3 4 |
China
|
|||||
app s | TCB Information | |||||
1 2 3 4 | TCB Application Email Address |
T******@timcoengr.com
|
||||
1 2 3 4 | TCB Scope |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
||||
1 2 3 4 |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
|||||
app s | FCC ID | |||||
1 2 3 4 | Grantee Code |
XMR
|
||||
1 2 3 4 | Equipment Product Code |
2022SC206ENA
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 2 3 4 | Name |
J****** H********
|
||||
1 2 3 4 | Telephone Number |
+8602******** Extension:
|
||||
1 2 3 4 | Fax Number |
+8621********
|
||||
1 2 3 4 |
j******@quectel.com
|
|||||
app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 2 3 4 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 3 4 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 3 4 | If so, specify the short-term confidentiality release date (MM/DD/YYYY format) | 11/12/2022 | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 2 3 4 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 2 3 4 | Equipment Class | PCB - PCS Licensed Transmitter | ||||
1 2 3 4 | DTS - Digital Transmission System | |||||
1 2 3 4 | NII - Unlicensed National Information Infrastructure TX | |||||
1 2 3 4 | DSS - Part 15 Spread Spectrum Transmitter | |||||
1 2 3 4 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | Multi-mode Smart LTE Module | ||||
1 2 3 4 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 2 3 4 | Modular Equipment Type | Single Modular Approval | ||||
1 2 3 4 | Purpose / Application is for | Change in Identification | ||||
1 2 3 4 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
1 2 3 4 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 2 3 4 | Grant Comments | Output power listed is conducted. Single Modular Approval for mobile or fixed RF Exposure condition. The module antenna(s) (as described in this filing) must be installed to meet the RF exposure compliance separation distance of 20 cm and any additional testing and authorization process as required. Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the FCC multi-transmitter procedures. Approved for OEM integration only. The grantee must provide OEM integrators, or end-users if marketed directly to end-users, with installation and operating instructions for satisfying FCC multi-transmitter product guidelines. This grant is valid only when the device is sold to OEM integrators and the OEM integrators are instructed to ensure that the end user has no manual instructions to remove or install the device. This device supports LTE of 1.4, 3, 5, 10, 15 and 20 MHz bandwidth modes for FDD LTE Bands 2, 4, 25 and 66; LTE of 5, 10, 15 and 20 MHz bandwidth modes for FDD LTE Bands 7 and 71; LTE of 1.4, 3, 5 and 10 MHz bandwidth modes for FDD LTE Bands 5,12 and 26; LTE of 5 and 10 MHz bandwidth modes for FDD LTE Bands 13, 14 and 17; LTE of 1.4, 3, 5, 10 and 15 MHz bandwidth modes for FDD LTE Band 26; and LTE of 5, 10, 15 and 20 MHz bandwidth modes for TDD LTE Band 41. This device also supports LTE uplink intra-band carrier aggregation as described in this filing. This device contains functions that are not operational in U.S. Territories; this filing is applicable only for U.S. operations. | ||||
1 2 3 4 | Output power listed is conducted. Single Modular Approval for mobile RF Exposure condition. The module antenna(s) must be installed to meet the RF exposure compliance separation distance of 20 cm and any additional testing and authorization process as required. Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the FCC multi-transmitter procedures. Approved for OEM integration only. The grantee must provide OEM integrators, or end-users if marketed directly to end-users, with installation and operating instructions for satisfying FCC multi-transmitter product guidelines. This grant is valid only when the device is sold to OEM integrators and the OEM integrators are instructed to ensure that the end user has no manual instructions to remove or install the device. This device supports 20 and 40 MHz bandwidth modes. | |||||
1 2 3 4 | Output power listed is conducted. Single Modular Approval for mobile RF Exposure condition. The module antenna(s) must be installed to meet the RF exposure compliance separation distance of 20 cm and any additional testing and authorization process as required. Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the FCC multi-transmitter procedures. Approved for OEM integration only. The grantee must provide OEM integrators, or end-users if marketed directly to end-users, with installation and operating instructions for satisfying FCC multi-transmitter product guidelines. This grant is valid only when the device is sold to OEM integrators and the OEM integrators are instructed to ensure that the end user has no manual instructions to remove or install the device. This device supports 20, 40 and 80 MHz modes. | |||||
1 2 3 4 | Output power listed is conducted. Single Modular Approval for mobile RF Exposure condition. The module antenna(s) must be installed to meet the RF exposure compliance separation distance of 20 cm and any additional testing and authorization process as required. Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the FCC multi-transmitter procedures. Approved for OEM integration only. The grantee must provide OEM integrators, or end-users if marketed directly to end-users, with installation and operating instructions for satisfying FCC multi-transmitter product guidelines. This grant is valid only when the device is sold to OEM integrators and the OEM integrators are instructed to ensure that the end user has no manual instructions to remove or install the device. | |||||
1 2 3 4 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 2 3 4 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 2 3 4 | Firm Name |
SGS-CSTC Standards Technical Services (Suzhou) Co.
|
||||
1 2 3 4 | Name |
V******** C********
|
||||
1 2 3 4 | Telephone Number |
+86 1********
|
||||
1 2 3 4 |
V******@sgs.com
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 24E | 1860 | 1900 | 0.211 | 0.1 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
1 | 2 | 24E | 1860 | 1900 | 0.179 | 0.1 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
1 | 3 | 24E | 1855 | 1905 | 0.181 | 0.1 ppm | 8M90W7D | ||||||||||||||||||||||||||||||||||
1 | 4 | 27 | 1720 | 1745 | 0.214 | 0.1 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
1 | 5 | 27 | 1720 | 1745 | 0.179 | 0.1 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
1 | 6 | 27 | 1715 | 1750 | 0.236 | 0.1 ppm | 8M93G7D | ||||||||||||||||||||||||||||||||||
1 | 7 | 27 | 1711.5 | 1753.5 | 0.188 | 0.1 ppm | 2M69W7D | ||||||||||||||||||||||||||||||||||
1 | 8 | 22H | 829 | 844 | 0.229 | 0.1 ppm | 8M93G7D | ||||||||||||||||||||||||||||||||||
1 | 9 | 22H | 829 | 844 | 0.195 | 0.1 ppm | 8M91W7D | ||||||||||||||||||||||||||||||||||
1 | 1 | 27 | 2510 | 2560 | 0.207 | 0.1 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
1 | 11 | 27 | 2510 | 2560 | 0.18 | 0.1 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
1 | 12 | 27 | 2505 | 2565 | 0.208 | 0.1 ppm | 8M93G7D | ||||||||||||||||||||||||||||||||||
1 | 13 | 27 | 704 | 711 | 0.22 | 0.1 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
1 | 14 | 27 | 704 | 711 | 0.183 | 0.1 ppm | 8M92G7D | ||||||||||||||||||||||||||||||||||
1 | 15 | 27 | 782 | 782 | 0.21 | 0.1 ppm | 8M90G7D | ||||||||||||||||||||||||||||||||||
1 | 16 | 27 | 782 | 782 | 0.2 | 0.1 ppm | 8M88W7D | ||||||||||||||||||||||||||||||||||
1 | 17 | 9 | 793 | 793 | 0.224 | 0.1 ppm | 8M93G7D | ||||||||||||||||||||||||||||||||||
1 | 18 | 9 | 793 | 793 | 0.187 | 0.1 ppm | 8M92W7D | ||||||||||||||||||||||||||||||||||
1 | 19 | 27 | 709 | 711 | 0.219 | 0.1 ppm | 8M93G7D | ||||||||||||||||||||||||||||||||||
1 | 2 | 27 | 709 | 711 | 0.185 | 0.1 ppm | 8M91W7D | ||||||||||||||||||||||||||||||||||
1 | 21 | 24E | 1860 | 1905 | 0.212 | 0.1 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
1 | 22 | 24E | 1860 | 1905 | 0.187 | 0.1 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
1 | 23 | 24E | 1852.5 | 1912.5 | 0.243 | 0.1 ppm | 4M47G7D | ||||||||||||||||||||||||||||||||||
1 | 24 | 9 | 819 | 819 | 0.218 | 0.1 ppm | 8M93G7D | ||||||||||||||||||||||||||||||||||
1 | 25 | 9 | 819 | 819 | 0.19 | 0.1 ppm | 8M91W7D | ||||||||||||||||||||||||||||||||||
1 | 26 | 22H | 831.5 | 841.5 | 0.235 | 0.1 ppm | 13M5G7D | ||||||||||||||||||||||||||||||||||
1 | 27 | 22H | 831.5 | 841.5 | 0.204 | 0.1 ppm | 13M5W7D | ||||||||||||||||||||||||||||||||||
1 | 28 | 27 | 2506 | 2680 | 0.201 | 0.1 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
1 | 29 | 27 | 2506 | 2680 | 0.166 | 0.1 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
1 | 3 | 27 | 2498.5 | 2687.5 | 0.207 | 0.1 ppm | 4M47G7D | ||||||||||||||||||||||||||||||||||
1 | 31 | 27 | 2501 | 2685 | 0.182 | 0.1 ppm | 8M93W7D | ||||||||||||||||||||||||||||||||||
1 | 32 | 27 | 1720 | 1770 | 0.215 | 0.1 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
1 | 33 | 27 | 1720 | 1770 | 0.179 | 0.1 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
1 | 34 | 27 | 1717.5 | 1772.5 | 0.211 | 0.1 ppm | 13M4W7D | ||||||||||||||||||||||||||||||||||
1 | 35 | 27 | 673 | 688 | 0.198 | 0.1 ppm | 17M8G7D | ||||||||||||||||||||||||||||||||||
1 | 36 | 27 | 673 | 688 | 0.168 | 0.1 ppm | 17M8W7D | ||||||||||||||||||||||||||||||||||
1 | 37 | 27 | 670.5 | 690.5 | 0.224 | 0.1 ppm | 13M5G7D | ||||||||||||||||||||||||||||||||||
1 | 38 | 27 | 670.5 | 690.5 | 0.185 | 0.1 ppm | 13M5W7D | ||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
2 | 1 | 15C | CC | 2402 | 2480 | 0.001 | |||||||||||||||||||||||||||||||||||
2 | 2 | 15C | CC | 2412 | 2462 | 0.218 | |||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
3 | 1 | 15E | CC | 5180 | 5240 | 0.036 | |||||||||||||||||||||||||||||||||||
3 | 2 | 15E | CC | 5260 | 5320 | 0.039 | |||||||||||||||||||||||||||||||||||
3 | 3 | 15E | CC | 5500 | 5700 | 0.042 | |||||||||||||||||||||||||||||||||||
3 | 4 | 15E | CC | 5745 | 5825 | 0.043 | |||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
4 | 1 | 15C | CC | 2402.00000000 | 2480.00000000 | 0.0100000 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC