FCC ID: XMR2022SC690ANA Multi-mode Smart LTE Module

SC690A Series Hardware Design Smart Module Series Version: 1.0.0 Date: 2021-12-07 Status: Preliminary Smart Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local offices. For more information, please visit:

http://www.quectel.com/support/sales.htm. For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-

exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. SC690A_Series_Hardware_Design 1 / 105 Smart Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties (third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-

party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved. SC690A_Series_Hardware_Design 2 / 105 Smart Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. SC690A_Series_Hardware_Design 3 / 105 Smart Module Series About the Document Revision History Revision Date Author Description

2021-12-07 Mary SHEN/Kevin ZHOU Creation of the document 1.0.0 2021-12-07 Mary SHEN/Kevin ZHOU Preliminary SC690A_Series_Hardware_Design 4 / 105 Smart Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents ....................................................................................................................................................... 5 Table Index ................................................................................................................................................... 8 Figure Index ............................................................................................................................................... 10 1 Introduction ........................................................................................................................................ 12 Special Marks .......................................................................................................................... 15 1.1. 2 Product Overview .............................................................................................................................. 16 Frequency Bands and Functions ............................................................................................ 16 Key Features ........................................................................................................................... 17 Functional Diagram ................................................................................................................. 20 Pin Assignment ........................................................................................................................ 21 Pin Description ........................................................................................................................ 22 EVB ......................................................................................................................................... 35 2.1. 2.2. 2.3. 2.4. 2.5. 2.6. 3.1. 3 Operating Characteristics ................................................................................................................. 36 Power Supply .......................................................................................................................... 36 3.1.1. Power Supply Pins ......................................................................................................... 36 3.1.2. Battery Charge and Management .................................................................................. 36 3.1.3. Reference Design for Power Supply .............................................................................. 38 3.1.4. Requirements for Voltage Stability ................................................................................. 38 Turn on .................................................................................................................................... 40 Turn off .................................................................................................................................... 41 VRTC Interface ........................................................................................................................ 42 Power Output .......................................................................................................................... 43 3.2. 3.3. 3.4. 3.5. 4 Application Interfaces ....................................................................................................................... 44 USB Interfaces ........................................................................................................................ 44 4.1. UART Interfaces ...................................................................................................................... 47 4.2.

(U)SIM Interfaces .................................................................................................................... 49 4.3. 4.4. SD Card Interface .................................................................................................................... 51 4.5. GPIO Interfaces ....................................................................................................................... 52 I2C Interfaces .......................................................................................................................... 54 4.6. I2S Interfaces .......................................................................................................................... 55 4.7. ADC Interface .......................................................................................................................... 56 4.8. 4.9. LCM Interfaces ........................................................................................................................ 56 4.10. Touch Panel Interface ............................................................................................................. 59 4.11. Camera Interfaces ................................................................................................................... 60 4.12. Sensor Interfaces .................................................................................................................... 67 4.13. Flash Interfaces ....................................................................................................................... 67 4.14. Keypad Interfaces ................................................................................................................... 68 4.15. Vibration Driver Motor Interfaces ............................................................................................ 68 SC690A_Series_Hardware_Design 5 / 105 Smart Module Series 4.16. JTAG Interface ........................................................................................................................ 69 4.17. LED Driver Interface ................................................................................................................ 70 4.18. Audio Interfaces ...................................................................................................................... 70 Reference Circuit Design for Microphone Interfaces ............................................. 72 Reference Circuit Design for Receiver Interface .................................................... 73 Reference Circuit Design for Headset Interface ..................................................... 73 Reference Circuit Design for Loudspeaker Interface ............................................. 74 Audio Interfaces Design Considerations ................................................................ 74 4.19. Emergency Download Interface .............................................................................................. 74 4.18.1. 4.18.2. 4.18.3. 4.18.4. 4.18.5. 5.1. 5 RF Specifications ............................................................................................................................... 75 Cellular Network ...................................................................................................................... 75 5.1.1. Antenna Interface & Frequency Bands .......................................................................... 75 5.1.2. Tx Power ........................................................................................................................ 76 5.1.3. Reference Design .......................................................................................................... 77 5.2. GNSS ...................................................................................................................................... 77 5.2.1. Antenna Interface & Frequency Bands .......................................................................... 78 5.2.2. Reference Design .......................................................................................................... 78 Recommended Circuit for Passive Antenna................................................... 78 Recommended Circuit for Active Antenna...................................................... 79 GNSS RF Design Guidelines ......................................................................... 79 5.3. Wi-Fi/Bluetooth ........................................................................................................................ 80 5.3.1. Wi-Fi Overview ............................................................................................................... 80 5.3.2. Bluetooth Overview ........................................................................................................ 83 5.3.3. Reference Design .......................................................................................................... 84 Reference Design of RF Routing ............................................................................................ 84 Requirements for Antenna Design .......................................................................................... 86 RF Connector Recommendation ............................................................................................ 87 5.2.2.1. 5.2.2.2. 5.2.2.3. 5.4. 5.5. 5.6. 6 Electrical Characteristics & Reliability ............................................................................................ 90 Absolute Maximum Ratings .................................................................................................... 90 6.1. Power Supply Ratings ............................................................................................................. 91 6.2. Power Consumption ................................................................................................................ 91 6.3. Digital I/O Characteristic ......................................................................................................... 93 6.4. 6.5. ESD ......................................................................................................................................... 94 6.6. Operating and Storage Temperatures ..................................................................................... 94 7 Mechanical Information ..................................................................................................................... 95 7.1. Mechanical Dimensions .......................................................................................................... 95 Recommended Footprint ......................................................................................................... 97 7.2. Top and Bottom Views............................................................................................................. 98 7.3. 8 Storage, Manufacturing & Packaging .............................................................................................. 99 8.1. Storage Conditions .................................................................................................................. 99 8.2. Manufacturing and Soldering ................................................................................................ 100 Packaging Specifications ...................................................................................................... 102 8.3. SC690A_Series_Hardware_Design 6 / 105 Smart Module Series 8.3.1. Carrier Tape .................................................................................................................. 102 8.3.2. Plastic Reel .................................................................................................................. 102 8.3.3. Packaging Process ...................................................................................................... 103 9 Appendix References ...................................................................................................................... 104 SC690A_Series_Hardware_Design 7 / 105 Smart Module Series Table Index Table 1: Special Marks ............................................................................................................................... 15 Table 2: Brief Introduction of the Module ................................................................................................... 16 Table 3: Wireless Network Type ................................................................................................................. 16 Table 4: Key Features ................................................................................................................................ 17 Table 5: I/O Parameters Definition ............................................................................................................. 22 Table 6: Pin Description ............................................................................................................................. 22 Table 7: Pin Definition of Charging Interface ............................................................................................. 36 Table 8: Pin Definition of PWRKEY ............................................................................................................ 40 Table 9: Power Description ........................................................................................................................ 43 Table 10: Functions of the USB Interface .................................................................................................. 44 Table 11: Pin Definition of USB Interface ................................................................................................... 45 Table 12: USB Trace Length Inside the Module ........................................................................................ 46 Table 13: Pin Definition of UART Interfaces ............................................................................................... 47 Table 14: Pin Definition of (U)SIM Interface ............................................................................................... 49 Table 15: Pin Definition of SD Card Interface ............................................................................................ 51 Table 16: SD Card Signal Trace Length Inside the Module ....................................................................... 52 Table 17: Pin Definition of GPIO Interfaces ............................................................................................... 52 Table 18: Pin Definition of I2C Interfaces ................................................................................................... 55 Table 19: Pin Definition of I2S Interfaces ................................................................................................... 55 Table 20: Pin Definition of ADC Interfaces ................................................................................................. 56 Table 21: Pin Definition of LCM Interfaces ................................................................................................. 56 Table 22: Pin Definition of Touch Panel Interfaces .................................................................................... 59 Table 23: Pin Definition of Camera Interfaces ........................................................................................... 61 Table 24: MIPI Trace Length Inside the Module ........................................................................................ 65 Table 25: Pin Definition of Sensor Interfaces ............................................................................................. 67 Table 26: Pin Definition of Flash Interfaces ............................................................................................... 67 Table 27: Pin Definition of Keypad Interfaces ............................................................................................ 68 Table 28: Pin Definition of Vibration Driver Motor Interfaces ..................................................................... 68 Table 29: Pin Definition of JTAG Interface ................................................................................................. 69 Table 30: Pin Definition of LED Driver Interface ........................................................................................ 70 Table 31: Pin Definition of Audio Interfaces ............................................................................................... 70 Table 32: Pin Definition of Cellular Network Interface ............................................................................... 75 Table 33: Operating Frequency of SC690A-NA ......................................................................................... 75 Table 34: Operating Frequency of SC690A-EM ........................................................................................ 76 Table 35: Tx Power ..................................................................................................................................... 76 Table 36: Pin Definition of GNSS Antenna Interface ................................................................................. 78 Table 37: GNSS Frequency ....................................................................................................................... 78 Table 38: Pin Definition of Wi-Fi/Bluetooth Application Interfaces ............................................................. 80 Table 39: Wi-Fi/Bluetooth Frequency ......................................................................................................... 80 Table 40: Wi-Fi Transmitting Performance ................................................................................................. 81 Table 41: Wi-Fi Receiving Performance ..................................................................................................... 82 SC690A_Series_Hardware_Design 8 / 105 Smart Module Series Table 42: Bluetooth Data Rate and Version ............................................................................................... 83 Table 43: Bluetooth Transmitting and Receiving Performance .................................................................. 84 Table 44: Requirements for Antenna Design ............................................................................................. 86 Table 45: Absolute Maximum Ratings ........................................................................................................ 90 Table 46: The Modules Power Supply Ratings ......................................................................................... 91 Table 47: SC690A-NA Power Consumption .............................................................................................. 91 Table 48: SC690A-EM Power Consumption .............................................................................................. 92 Table 49: 1.8 V I/O Requirements .............................................................................................................. 93 Table 50: (U)SIM 1.8 V I/O Requirements ................................................................................................. 93 Table 51: (U)SIM 2.95 V I/O Requirements ............................................................................................... 93 Table 52: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity) ............................... 94 Table 53: Operating and Storage Temperatures ........................................................................................ 94 Table 54: Recommended Thermal Profile Parameters ............................................................................ 101 Table 55: Carrier Tape Dimension Table (Unit: mm) ................................................................................ 102 Table 56: Plastic Reel Dimension Table (Unit: mm) ................................................................................. 103 Table 57: Related Documents .................................................................................................................. 104 Table 58: Terms and Abbreviations .......................................................................................................... 104 SC690A_Series_Hardware_Design 9 / 105 Smart Module Series Figure Index Figure 1: Functional Diagram ..................................................................................................................... 21 Figure 2: Pin Assignment (Top View) ......................................................................................................... 21 Figure 3: Reference Design for Battery Charging Circuit .......................................................................... 37 Figure 4: Reference Circuit of Power Supply ............................................................................................. 38 Figure 5: Voltage Drop Sample .................................................................................................................. 39 Figure 6: Structure of Power Supply .......................................................................................................... 39 Figure 7: Turn on the Module Using Driving Circuit ................................................................................... 40 Figure 8: Turn on the Module Using Keystroke ......................................................................................... 40 Figure 9: Timing of Turning on Module ...................................................................................................... 41 Figure 10: Timing of Turning off Module .................................................................................................... 42 Figure 11: RTC Powered by Coin Cell ....................................................................................................... 42 Figure 12: USB Type-C Interface Reference Design ................................................................................. 46 Figure 13: Reference Circuit with Level Translator Chip (for UART5) ....................................................... 48 Figure 14: RS-232 Level Match Circuit (for UART5) ................................................................................. 48 Figure 15: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector ......................... 50 Figure 16: Reference Circuit for SD Card Interface ................................................................................... 51 Figure 17: Reference Circuit Design for LCM Interface ............................................................................. 58 Figure 18: LCM External Backlight Driver Reference Circuit..................................................................... 59 Figure 19: Reference Circuit Design for TP Interface ................................................................................ 60 Figure 20: Reference Circuit Design for Three-Camera Applications ....................................................... 63 Figure 21: Reference Circuit Design for Camera Power Supply ............................................................... 64 Figure 22: Reference Circuit for Vibrator Connection ................................................................................ 69 Figure 23: Reference Circuit Design for LED Interfaces ........................................................................... 70 Figure 24: Reference Circuit Design for ECM Microphone Interfaces ...................................................... 72 Figure 25: Reference Circuit Design for MEMS Microphone Interfaces ................................................... 72 Figure 26: Reference Circuit Design for Receiver Interface ...................................................................... 73 Figure 27: Reference Circuit Design for Headset Interface ....................................................................... 73 Figure 28: Reference Circuit Design for Loudspeaker Interface ............................................................... 74 Figure 29: Reference Circuit Design for Emergency Download Interface ................................................. 74 Figure 30: Reference Circuit for RF Antenna Interfaces ............................................................................ 77 Figure 31: Reference Circuit Design for GNSS Passive Antenna ............................................................. 78 Figure 32: Reference Circuit Design for GNSS Active Antenna ................................................................ 79 Figure 33: Reference Circuit Design for Wi-Fi/Bluetooth Antenna ............................................................ 84 Figure 34: Microstrip Design on a 2-layer PCB ......................................................................................... 85 Figure 35: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 85 Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 85 Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 86 Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm) ............................................................ 88 Figure 39: Mechanicals of U.FL-LP Connectors ........................................................................................ 88 Figure 40: Space Factor of Mated Connector (Unit: mm) .......................................................................... 89 Figure 41: Module Top and Side Dimensions (Unit: mm) .......................................................................... 95 SC690A_Series_Hardware_Design 10 / 105 Smart Module Series Figure 42: Module Bottom Dimensions (TOP View, Unit: mm) .................................................................. 96 Figure 43: Recommended Footprint (TOP View) ....................................................................................... 97 Figure 44: Top & Bottom Views of the Module ........................................................................................... 98 Figure 45: Recommended Reflow Soldering Thermal Profile ................................................................. 100 Figure 46: Carrier Tape Dimension Drawing ............................................................................................ 102 Figure 47: Plastic Reel Dimension Drawing ............................................................................................ 102 Figure 48: Packaging Process ................................................................................................................. 103 SC690A_Series_Hardware_Design 11 / 105 Smart Module Series 1 Introduction This document defines the SC690A series and describes its air interfaces and hardware interfaces which relate to your applications. It can help you quickly understand interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, you can use this module to design and to set up mobile applications easily. FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-

based timeaveraging duty factor, antenna gain, and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2022SC690ANA 4. This module must not transmit simultaneously with any other antenna or transmitter 5. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

SC690A_Series_Hardware_Design 12 / 105 Smart Module Series then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: XMR2022SC690ANA or Contains FCC ID: XMR2022SC690ANA must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes, or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes:

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled SC690A_Series_Hardware_Design 13 / 105 Smart Module Series to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-22SC690ANA or where: 10224A-22SC690ANA is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A-22SC690ANA " ou "o: 10224A-22SC690ANA est le numro de certification du module". i. the device for operation in the band 51505250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

ii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the e.i.r.p. limit;

iii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate;

iv. Omnidirectional antenna is recommended CE Statement Regulatory Conformance Hereby, we (Quectel Wireless Solutions Co., Ltd.) declares that the radio equipment type SC690A series are in compliance with Directive 2014/53/EU. RF exposure This equipment complies with CE radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance of 20 cm between the radiator and your body. This device may be operated in all member states of the EU. Observe national and local regulations where the device is used. SC690A_Series_Hardware_Design 14 / 105 Smart Module Series This device is restricted to indoor use only when operating in the 5150 to 5350 MHz,frequency range in the following countries:

AT BE BG HR CY CZ DK EE FI FR DE EL HU IE IT LV LT LU MT NL PL PT RO SK SI ES SE UK UK Regulations Regulations 2017 (SI 2017/1206) Declaration of Conformity Quectel Wireless Solutions Co., Ltd. hereby declares that this WCDMA / LTE with Bluetooth, Wi-Fi and GNSS functions, SC690A series are in compliance with the essential requirements and other relevant provisions of the UK Radio Equipment Regulations 2017 (SI 2017/1206). 1.1. Special Mark Table 1: Special Mark Mark Definition

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of such model is currently unavailable. SC690A_Series_Hardware_Design 15 / 105 Smart Module Series 2 Product Overview The module is a series of smart LTE modules based on Android operating system and provides industrial grade performance. It supports multiple audio and video codecs, built-in high performance AdrenoTM GPU 610 graphics processing unit and multiple audio and video input/output interfaces as well as abundant GPIO interfaces. Its general features are listed below:

Table 2: Brief Introduction of the Module Categories Packaging and pins number LCC + LGA; 323 Dimensions Weight Wireless network functions 44 mm 43 mm 2.85 mm 12.24 g LTE-FDD Wi-Fi & Bluetooth functions Wi-Fi 802.11a/b/g/n/ac & BT 5.1 GNSS functions Variants GNSS SC690A-NA, SC690A-EM 2.1. Frequency Bands and Functions Table 3: Wireless Network Type Wireless Network Type SC690A-NA SC690A-EM LTE-FDD LTE-TDD WCDMA B2/B4/B5/B7/B12/B13/B14/B17/

B25/B26/B66 B1/B3/B7/B8/B20/B28

B1/B3/B8 SC690A_Series_Hardware_Design 16 / 105 Smart Module Series GSM

GNSS GPS: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz Galileo: 1573.51577.5MHz GPS: 1575.42 1.023 MHz GLONASS: 1597.51605.8 MHz BeiDou: 1561.098 2.046 MHz Galileo: 1573.51577.5MHz Wi-Fi 24022482 MHz; 51805825 MHz 24022482 MHz; 51805825 MHz Bluetooth 24022480 MHz 24022480 MHz 2.2. Key Features Table 4: Key Features Features Details Application Processors Quad-core Kryo 260 64-bit CPU @ 2.0 GHz Gold cluster: Kryo cores at 2 GHz with 1 MB L2 cache Silver cluster: Kryo cores at 1.8 GHz with 512 KB L2 cache Modem DSP Hexagon DSP, dual-HVX at 1.0 GHz GPU Memory Adreno GPU610 at 950 MHz, 3D graphics accelerator with 64-bit addressing 64 GB eMMC + 4 GB LPDDR4X SDRAM (default) 32 GB eMMC + 3 GB LPDDR4X SDRAM (optional) Operating System Android 11/12 Power Supply LCM Interfaces Supply voltage: 3.554.4 V Typical supply voltage: 3.8 V Supports one group of 4-lane MIPI_DSI, up to 1.5 Gbps/lane. Supports FHD+ (1080 2520) @ 60 fps. Supports 3 groups of 4-lane MIPI_CSI, up to 2.5 Gbps/lane Supports 3 cameras (4-lane + 4-lane + 4-lane) or 4 cameras (4-

Camera Interfaces lane + 4-lane + 2-lane + 1-lane) Video Codec Supports triple ISP Up to 25 MP with dual ISP EVS, EVRC, EVRC-B, EVRC-WB G.711 and G7.729A/AB GSM-FR, GSM-EFR and GSM-HR AMR-NB, AMR-WB Video encoding and decoding: up to 1080P at 60 fps SC690A_Series_Hardware_Design 17 / 105 Smart Module Series Audio Interfaces Audio Inputs 3 analog microphone inputs 2 digital microphone inputs Audio Outputs Class AB stereo headphone output Class AB earpiece differential output Class AB LINE_OUT output Audio Codec Supports MP3; AAC; HE AAC v1, v2; FLAC; APE; ALAC; AIFF

(U)SIM Interface I2C Interface ADC Interfaces 2 (U)SIM interfaces Supports USIM/SIM card: 1.8/2.95 V Supports Dual SIM Dual Standby (supported by default) 5 I2C interfaces, used for peripherals such as TP, camera, sensor, etc. 1 generic ADC interface Supports up to 15-bit resolution Real Time Clock Supported USB Interface SD Card Interface UART Interfaces Compliant with USB 3.1 and 2.0 specifications, with transmission rates up to 5 Gbps on USB 3.1 Gen1 and 480 Mbps on USB 2.0 Supports USB OTG Used for AT command communication, data transmission, software debugging, firmware upgrade. Supports SD 3.0 protocol Supports SD card hot-plug Supports 1.8/2.95 V SD card UART5:

Supports RTS and CTS hardware flow control UART1:

Supports RTS and CTS hardware flow control Debug UART:

Used for debugging Default baud rate: 115200 bps Vibrator drive interface Drive ERM vibrator Flashlight Interface Charging Interface Bluetooth Features 2 high current flash and torch LED driver:

1 A for flash mode and 300 mA for torch mode by default Maximum 1.5 A combined Used for battery voltage detection, fuel gauge, battery temperature detection Supports Bluetooth 5.1 Supports BR/EDR/BLE GNSS Features GPS/GLONASS/BeiDou/Galileo Antenna Interface ANT_MAIN SC690A_Series_Hardware_Design 18 / 105 Smart Module Series ANT_DRX ANT_WIFI/BT ANT_GNSS WCDMA: Class 3 (24 dBm + 1/ -3 dB) LTE-FDD: Class 3 (23 dBm 2 dB) Supports 3GPP Rel-10 Cat 4 FDD Supports 1.4 to 20 MHz RF bandwidth Supports DL 2 2 MIMO Supports uplink QPSK, 16QAM and 64QAM modulation Supports downlink QPSK, 16QAM modulation FDD: Max 150 Mbps (DL)/ 50 Mbps (UL) Supports 3GPP Rel-8/DC-HSDPA/HSPA+/HSDPA/HSUPA/

WCDMA Supported modulation: QPSK/16QAM/64QAM DC-HSDPA: Max 42 Mbps (DL) DC-HSUPA: Max 5.76 Mbps (UL) WCDMA: Max 384 kbps (DL)/384 kbps (UL) 2.4 GHz; 5 GHz, Supports 802.11a/b/g/n/ac, maximally up to 433 Mbps Supports AP and STA modes Operating temperature range 1: -35 to +75 C Storage temperature range: -40 to +90 C Transmitting Power LTE Features UMTS Features WLAN Features Temperature Range Firmware Upgrade Use USB interface RoHS All hardware components are fully compliant with EU RoHS directive 1 Within operating temperature range, the module is 3GPP compliant. SC690A_Series_Hardware_Design 19 / 105 Smart Module Series 2.3. Functional Diagram The following figure shows a block diagram of the module and illustrates the major functional parts. Power management Baseband LPDDR4X + EMMC flash Radio frequency Peripheral interface

-- USB interfaces

-- (U)SIM interfaces

-- UART interfaces

-- SD card interface

-- I2C interfaces

-- ADC interfaces

-- LCM (MIPI) interfaces

-- TP (touch panel) interfaces

-- Camera (MIPI) interfaces

-- Audio interfaces SC690A_Series_Hardware_Design 20 / 105 BasebandTranceiverWCNLPDDReMMCUSB_VBUSBatteryFlashLCM_BIASMotorDIPANT_GNSSANT_WiFi/BTGPIOsI2CSD 3.0UART 2(U)SIMUSB2.0&3.1CAMTPLCMSPIEARLine_outMICsADCCODECPowerSignalPowerFunctionSAW5G FEMDuplexsQPASwitchSAWLNASAWSwitchSAWANT_DRXANT_MAINPMUHeadsetVBATAPTLEDsPWRKEYPMII2SVRTCUSIM1_VDDUSIM2_VDDLDO9_1V8SD_LDO5SD_LDO22PWM Smart Module Series Figure 1: Functional Diagram 2.4. Pin Assignment The following figure illustrates the pin assignment of the module. Figure 2: Pin Assignment (Top View) NOTE SC690A_Series_Hardware_Design 21 / 105 116CSI2_CLK_N115CSI2_CLK_P77CSI0_CLK_P75CAM_I2C_SCL76CAM_I2C_SDA38VBAT24152ADC151GPIO_02C150GND149ANT_DRX148GND147VOL_DOWN146VOL_UP145USIM1_DET144USIM1_RST143USIM1_CLK142USIM1_DATA141USIM1_VDD140TP_I2C_SCL139TP_INT138TP_RST137GPIO_33136GPIO_93135GND134ANT_GNSS133GND132SENSOR_I2C_SDA131SENSOR_I2C_SCL130GND129ANT_WIFI/BT128GND127DCAM_RST126DCAM_PWDN125GND124CSI2_LN3_N123CSI2_LN3_P122CSI2_LN2_N121CSI2_LN2_P120CSI2_LN1_N119CSI2_LN1_P118CSI2_LN0_N117CSI2_LN0_P1RESERVED2RESERVED3GND4GND5DBG_TXD6DBG_RXD7UART5_TXD8UART5_RXD9LDO9_1V810GPIO_2511GPIO_2612GPIO_09B13GPIO_5514GPIO_5615GPIO_10716VRTC17BAT_ID18GND19ANT_MAIN20GND21LCD_BIAS_P22LCD_BIAS_N23LED_RED24LED_GRN25LED_BLU26FLASH1_LED27BAT_P28BAT_M29BAT_THERM30PWM31GND32 USB_DP33 USB_DM34GND35GND36VBAT37VBAT114LCD_TE113LCD_RST112GND111DSI_LN3_N110DSI_LN3_P109DSI_LN2_N108DSI_LN2_P107DSI_LN1_N106DSI_LN1_P105DSI_LN0_N104DSI_LN0_P103DSI_CLK_N102DSI_CLK_P101GND100SCAM_MCLK99MCAM_MCLK98GND97CSI1_LN3_N96CSI1_LN3_P95CSI1_LN2_N94CSI1_LN2_P93CSI1_LN1_N92CSI1_LN1_P91CSI1_LN0_N90CSI1_LN0_P89CSI1_CLK_N88CSI1_CLK_P87GND86CSI0_LN3_N85CSI0_LN3_P84CSI0_LN2_N83CSI0_LN2_P82CSI0_LN1_N81CSI0_LN1_P80CSI0_LN0_N79CSI0_LN0_P78CSI0_CLK_N39PWRKEY40GND41USB_VBUS42USB_VBUS43GND44MIC_BIAS145DMIC1_DATA46DMIC1_CLK47GND48HS_DET49HPH_L50HPH_GND51HPH_R52EAR_M53EAR_P54LPI_MI2S1_DATA055LPI_MI2S1_SCLK56GND57USB_BOOT58GPIO_459GPIO_560UART1_TXD61UART1_RXD62GND63SD_LDO2264SD_DET65SD_DATA366SD_DATA267SD_DATA168SD_DATA069SD_CMD70SD_CLK71SCAM_PWDN72SCAM_RST73MCAM_PWDN74MCAM_RSTPower PinsGND PinsAudio PinsUSB Pins(U)SIM PinsUART PinsGPIO PinsAntenna PinsTP PinsLCM PinsCamera PinsOthersRESERVED PinsSD Card Pins264GND265GND154GPIO_62313GND314GND315GND316GND317GND318GND319GND306GND307GND308GND309GND310GND311GND312GND299GND300GND301GND302GND303GND304GND305GND292GND293GND294GND295GND296GND297GND298GND285GND286GND287GND288GND289GND290GND291GND278GND279GND280GND281GND282GND283GND284GND271GND272GND273GND274GND275GND276GND277GND266GND268GND269GND270GND267GND257GND258GND261GND259GND262GND263GND260GND153GPIO_31156LPI_MI2S1_WS155LPI_MI2S1_DATA1158WLED_EN157RESERVED160GND159GND162USB_SS2_RX_P161USB_SS2_RX_M164USB_SS2_TX_M163GND166RESERVED165USB_SS2_TX_P168DMIC2_DATA167MIC_BIAS3170GND169DMIC2_CLK172USB_SS1_RX_M171USB_SS1_RX_P174USB_SS1_TX_P173GND176GND175USB_SS1_TX_M178GPIO_66177GPIO_65180LINE_OUT_M179SD_LDO5181LINE_OUT_P194DCAM_MCLK195GND192RESERVED193GND190RESERVED191RESERVED188JTAG_TCLK189JTAG_RST_N186JTAG_TDO187JTAG_TDI184JTAG_TRST185JTAG_TMS182GND183JTAG_PS_HOLD209USIM2_DATA210USIM2_VDD207USIM2_RST208USIM2_CLK205GPIO_97206TP_I2C_SDA203LPI_GPIO_21204LPI_GPIO_22201I2C0_SDA202GNSS_LNA_EN199GPIO_111200I2C0_SCL197 DCAM_I2C_SDA198GPIO_112196DCAM_I2C_SCL223USB_CC2222RESERVED225SS_DIR_OUT224USB_CC1227GND226VIB_DRV229GPIO_86228FLASH2_LED231GPIO_85230GPIO_106233MIC_BIAS2232GPIO_84255SS_DIR_IN256USIM2_DET253GPIO_35254GPIO_34251GPIO_14252RESERVED249GPIO_15250RESERVED247GPIO_3248GPIO_2245GPIO_83246GPIO_68211OPTION213MIC3_M212RESERVED215MIC2_M214MIC3_P217MIC1_M216MIC2_P219GND218MIC1_P221VPH_PWR220VPH_PWR244RESERVED242GRFC_9243GND240GPIO_64241GRFC_10238GPIO_96239GPIO_60236CAM4_CLK237GPIO_32234I2S_MCLK235GPIO_67320GND321GND322GND323GND Smart Module Series Keep all RESERVED and unused pins open. 2.5. Pin Description The following table shows the DC characteristics and pin descriptions. Table 5: I/O Parameters Definition Type AI AO AIO DI DO DIO OD PI PO PIO PU PD Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Power Input/Output Pull Up Pull Down Table 6: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT 36, 37, 38 PIO Power supply for the module Vmax = 4.4 V Vmin = 3.55 V Vnom = 3.8 V It must be able to provide sufficient current up to 3.0 A. SC690A_Series_Hardware_Design 22 / 105 Smart Module Series It is suggested to use a TVS to increase voltage surge withstand capability. Power supply for external GPIOs pull up circuits and level shift circuit. LDO9_1V8 9 PO 1.8 V output VPH_PWR 220, 221 PO VRTC 16 PIO Power supply for peripherals Power supply for RTC Vnom = 1.8 V IOmax = 300 mA Vmax = 4.4 V Vmin = 3.55 V Vnom = 3.8 V Vmax = 3.2 V VI = 2.03.25 V GND 3, 4, 18, 20, 31, 34, 35, 40, 43, 47, 56, 62, 87, 98, 101, 112, 125, 128,130, 133, 135, 148, 150, 159, 160, 163, 170, 173, 176, 182, 193, 195, 219, 227, 243, 257 323 Analog Audio Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment Vmin = 1.0 V Vmax = 2.85 V Used for headset mic by default. MIC_BIAS1 44 MIC_BIAS2 233 MIC_BIAS3 167 MIC1_P MIC1_M MIC2_P MIC2_M MIC3_P MIC3_M EAR_P EAR_M 218 217 216 215 214 213 53 52 AO AO AO AI AI AI AI AI AI Microphone bias output voltage 1 Microphone bias output voltage 2 Microphone bias output voltage 3 Microphone input for channel 1 (+) Microphone input for channel 1 (-) Microphone input for channel 2 (+) Microphone input for channel 2 (-) Microphone input for channel 3 (+) Microphone input for channel 3 (-) AO Earpiece output (+) AO Earpiece output (-) LINE_OUT_P 181 AO Aux amplifier output

(+) SC690A_Series_Hardware_Design 23 / 105 Smart Module Series LINE_OUT_M 180 HPH_R HPH_L HPH_GND HS_DET DMIC Interface*

51 49 50 48 AO AO AO AI AI Aux amplifier output

(-) Headphone right channel output Headphone left channel output Headphone reference ground Headset hot-plug detect Pulled up internally. Pin Name Pin No. I/O Description DC Characteristics Comment DMIC1_DATA DMIC1_CLK 45 46 DIO DO DMIC2_DATA 168 DIO DMIC2_CLK 169 DO LED Driver Interface Digital microphone 1 data Digital microphone 1 clock Digital microphone 2 data Digital microphone 2 clock 1.8 V power domain Pin Name Pin No. I/O Description DC Characteristics Comment LED_RED LED_GRN LED_BLU USB Interfaces 23 24 25 AO AO AO Current source for the red LED. Current source for the green LED. Current source for the blue LED. Pin Name Pin No. I/O Description USB_VBUS 41, 42 PIO USB_DM USB_DP 33 32 AIO AIO Charging power input. Power supply for OTG device. USB/adaptor insertion detection. USB 2.0 differential data (-) USB 2.0 differential data (+) Sources up to 12 mA max per channel. DC Characteristics Comment Vmax = 10 V Vmin = 4 V Vnom = 5.0 V USB On-The-Go

(OTG) supports up to 1.0 A. USB 2.0 standard compliant. 90 differential impedance. SC690A_Series_Hardware_Design 24 / 105 Smart Module Series USB_SS1_RX_P 171 AI USB_SS1_RX_M 172 AI USB_SS1_TX_P 174 AO USB_SS1_TX_M 175 AO USB_SS2_RX_M 161 AI USB_SS2_RX_P 162 AI USB_SS2_TX_M 164 AO USB_SS2_TX_P 165 AO USB_CC1 USB_CC2 224 223 AI AI USB 3.1 Channel 1 super-speed receive (+) USB 3.1 Channel 1 super-speed receive (-) USB 3.1 Channel 1 super-speed transmit (+) USB 3.1 Channel 1 super-speed transmit (-) USB 3.1 Channel 2 super-speed receive (-) USB 3.1 Channel 2 super-speed receive (+) USB 3.1 Channel 2 super-speed transmit (-) USB 3.1 Channel 2 super-speed transmit (+) USB Type-C detect 1 USB Type-C detect 2 SS_DIR_IN 255 AI CC status detect SS_DIR_OUT 225 AO CC status output OPTION 211 AI USB mode select USB 3.1 Gen1 standard compliant. 90 differential impedance. USB PHY port select. Select either micro-USB mode or Type-C mode.

(U)SIM Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment USIM1_VDD 141 PO

(U)SIM1 card power supply USIM1_DATA 142 DIO

(U)SIM1 card data Either 1.8 V or 2.95 V (U)SIM card is supported. SC690A_Series_Hardware_Design 25 / 105 Smart Module Series USIM1_CLK USIM1_RST 143 144 DO

(U)SIM1 card clock DO

(U)SIM1 card reset USIM1_DET 145 DI

(U)SIM1 card hot-

plug detect USIM2_VDD 210 PO

(U)SIM2 card power supply USIM2_DATA USIM2_CLK USIM2_RST 209 208 207 DIO

(U)SIM2 card data DO

(U)SIM2 card clock DO

(U)SIM2 card reset USIM2_DET 256 DI

(U)SIM2 card detect Active Low. Require external pull-up to 1.8 V. If unused, keep this pin open. Disabled by default, and can be enabled through software configuration. Either 1.8 V or 2.95 V (U)SIM card is supported. Active Low. Need external pull-up to 1.8 V. If unused, keep this pin open. Disabled by default, and can be enabled through software configuration. SD Card Interface Pin Name Pin No. I/O Description DC Characteristics Comment SD_CLK SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 70 69 68 67 66 65 DO SD card clock DIO SD card command DIO SDIO data bit 0 DIO SDIO data bit 1 DIO SDIO data bit 2 DIO SDIO data bit 3 SC690A_Series_Hardware_Design 26 / 105 Smart Module Series SD_DET SD_LDO22 64 63 DI PO SD_LDO5 179 PO Touch Panel Interfaces Active low. SD card hot-plug detect SD card power supply 1.8/2.95 V output power for SD card pull-up circuits Vnom = 2.95 V IOmax = 600 mA Vnom = 1.8/2.95 V IOmax = 50 mA Pin Name Pin No. I/O Description DC Characteristics Comment TP_RST TP_INT TP_I2C_SCL TP_I2C_SDA LCM Interface 138 139 140 206 DO TP reset DI TP interrupt OD TP I2C clock OD TP I2C data Pin Name Pin No. I/O Description LCD_BIAS_P 21 PO LCD_BIAS_N 22 PO LCD display bias

(+) LCD display bias

(-). PWM 30 DO PWM output WLED_EN 158 DO LCD backlight enable LCD_RST 113 DO LCD reset LCD_TE DSI_CLK_P DSI_CLK_N DSI_LN0_P 114 102 103 104 DSI_LN0_N 105 AIO DI LCD tearing effect AIO LCD MIPI clock (+) AIO LCD MIPI clock (-) AIO LCD MIPI lane 0 data (+) LCD MIPI lane 0 data (-) 1.8 V power domain. DC Characteristics Vnom = 5.5 V Vmin = 4.0 V Vmax = 6.0 V Vnom = -5.5 V Vmin = -6.0 V Vmax = -4.0 V Comment Positive LCD regulated output. Negative LCD regulated output. 1.8 V power domain. 1.8 V power domain. 1.8 V power domain. Active low. 1.8 V power domain. SC690A_Series_Hardware_Design 27 / 105 Smart Module Series DSI_LN1_P 106 AIO DSI_LN1_N 107 AIO DSI_LN2_P 108 AIO DSI_LN2_N 109 AIO DSI_LN3_P 110 AIO DSI_LN3_N 111 AIO Camera Interface LCD MIPI lane 1 data (+) LCD MIPI lane 1 data (-) LCD MIPI lane 2 data (+) LCD MIPI lane 2 data (-) LCD MIPI lane 3 data (+) LCD MIPI lane 3 data (-) Pin Name Pin No. I/O Description DC Characteristics Comment CSI0_CLK_P CSI0_CLK_N CSI0_LN0_P CSI0_LN0_N CSI0_LN1_P CSI0_LN1_N CSI0_LN2_P CSI0_LN2_N CSI0_LN3_P CSI0_LN3_N CSI1_CLK_P CSI1_CLK_N CSI1_LN0_P CSI1_LN0_N 77 78 79 80 81 82 83 84 85 86 88 89 90 91 AIO AIO AIO AIO AIO AIO AIO AIO AIO AIO AIO AIO AIO AIO MIPI clock of rear camera (+) MIPI clock of rear camera (-) MIPI lane 0 data of rear camera (+) MIPI lane 0 data of rear camera (-) MIPI lane 1 data of rear camera (+) MIPI lane 1 data of rear camera (-) MIPI lane 2 data of rear camera (+) MIPI lane 2 data of rear camera (-) MIPI lane 3 data of rear camera (+) MIPI lane 3 data of rear camera (-) MIPI clock of front camera (+) MIPI clock of front camera (-) MIPI lane 0 data of front camera (+) MIPI lane 0 data of front camera (-) SC690A_Series_Hardware_Design 28 / 105 Smart Module Series CSI1_LN1_P CSI1_LN1_N CSI1_LN2_P CSI1_LN2_N CSI1_LN3_P CSI1_LN3_N 92 93 94 95 96 97 AIO AIO AIO AIO AIO AIO CSI2_CLK_P 115 AIO CSI2_CLK_N 116 AIO CSI2_LN0_P 117 AIO CSI2_LN0_N 118 AIO CSI2_LN1_P 119 AIO CSI2_LN1_N 120 AIO CSI2_LN2_P 121 AIO CSI2_LN2_N 122 AIO CSI2_LN3_P 123 AIO CSI2_LN3_N 124 AIO SCAM_MCLK 100 SCAM_RST 72 SCAM_PWDN 71 MCAM_MCLK 99 MCAM_RST 74 MCAM_PWDN 73 DO DO DO DO DO DO MIPI lane 1 data of front camera (+) MIPI lane 1 data of front camera (-) MIPI lane 2 data of front camera (+) MIPI lane 2 data of front camera (-) MIPI lane 3 data of front camera (+) MIPI lane 3 data of front camera (-) MIPI clock of depth camera (+) MIPI clock of depth camera (-) MIPI lane 0 data of depth camera (+) MIPI lane 0 data of depth camera (-) MIPI lane 1 data of depth camera (+) MIPI lane 1 data of depth camera (-) MIPI lane 2 data of depth camera (+) MIPI lane 2 data of depth camera (-) MIPI lane 3 data of depth camera (+) MIPI lane 3 data of depth camera (-) Master clock of front camera Reset of front camera Power down of front camera Master clock of rear camera Reset of rear camera Power down of rear camera 1.8 V power domain. SC690A_Series_Hardware_Design 29 / 105 Smart Module Series DCAM_MCLK 194 DCAM_RST 127 DCAM_PWDN 126 CAM4_MCLK 236 CAM_I2C_SCL 75 CAM_I2C_ SDA DCAM_I2C_ SDA DCAM_I2C_ SCL Flash Interfaces 76 197 196 DO DO DO DO OD OD OD OD Master clock of depth camera Reset of depth camera Power down of depth camera Master clock of fourth camera I2C clock of front and rear cameras I2C data of front and rear cameras I2C data of depth camera I2C clock of depth camera Pin Name Pin No. I/O Description FLASH1_LED 26 AO FLASH2_LED 228 AO Flash/torch driver output Flash/torch driver output PWRKEY 39 DI Turn on/off the module VOL_UP 146 DI Volume up VOL_DOWN 147 DI Volume down UART Interface Pin Name Pin No. I/O Description DBG_TXD DBG_RXD 5 6 DO DI Debug UART transmit. Debug UART receive. 1.8 V power domain. 1.8 V power domain. 1.8 V power domain. 1.8 V power domain. DC Characteristics Comment Support flash and torch modes. 2 1.5 A

(maximum 1.5 A combined) Comment Pull up to 1.8 V internally. Active low. If unused, keep this pin open. If unused, keep this pin open. DC Characteristics Comment 1.8 V power domain. Keypad Interfaces Pin Name Pin No. I/O Description DC Characteristics SC690A_Series_Hardware_Design 30 / 105 Smart Module Series UART5_TXD UART5_RXD UART1_TXD UART1_RXD I2C Interfaces 7 8 60 61 DO UART5 transmit DI UART5 receive DO UART1 transmit DI UART1 receive Pin Name Pin No. I/O Description DC Characteristics Comment SENSOR_I2C_ SCL SENSOR_I2C_ SDA I2C0_SCL I2C0_SDA I2S Interface 131 132 200 201 OD OD OD OD I2C clock for external sensor I2C data for external sensor I2C clock for external device I2C data for external device 1.8 V power domain. Pin Name Pin No. I/O Description DC Characteristics Comment I2S_MCLK 234 DO I2S master clock LPI_MI2S1_ SCLK LPI_MI2S1_ WS LPI_MI2S1_ DATA0 LPI_MI2S1_ DATA1 55 156 DO DO 54 DIO 155 DIO LPI I2S1 serial clock LPI I2S1 word select LPI I2S1 data channel 0 LPI I2S1 data channel 1 RF Antenna Interface Pin Name Pin No. I/O Description ANT_GNSS 134 AI ANT_MAIN 19 AIO ANT_DRX 149 AI ANT_WIFI/BT 129 AIO GNSS antenna interface Main antenna interface Diversity antenna interface Wi-Fi/Bluetooth antenna interface 1.8 V power domain. DC Characteristics Comment 50 impedance 50 impedance 50 impedance 50 impedance SC690A_Series_Hardware_Design 31 / 105 Smart Module Series Antenna Tuner Control Interface Pin Name Pin No. I/O Description GRFC_10 241 DIO GRFC_9 242 DIO Generic RF controller Generic RF controller ADC Interface Pin Name Pin No. I/O Description DC Characteristics Comment DC Characteristics Comment ADC 152 AI General-purpose ADC interface Maximum input voltage: 1.875 V. Charging Interface Pin Name Pin No. I/O Description BAT_P BAT_M 27 28 AI AI Battery voltage detect (+) Battery voltage detect (-) DC Characteristics BAT_THERM 29 AI Battery temperature detect BAT_ID 17 AI Battery type detect Vibration Motor Driver Interface Pin Name Pin No. I/O Description VIB_DRV 226 PO Vibration motor driver output control Other Interfaces DC Characteristics Vmin = 1.504 V Vmax = 3.544 V Imax = 300 mA Comment Cannot be kept open. Cannot be kept open. Internally pulled up. Externally connected to GND via a 10 k NTC resistor. Maximum input voltage: 1.875 V. Maximum input voltage: 1.875 V. If unused, keep this pin open. Comment Pin Name Pin No. I/O Description DC Characteristics Comment SC690A_Series_Hardware_Design 32 / 105 Smart Module Series USB_BOOT 57 DI GNSS_LNA_EN 202 DO JTAG Interface Force the module into emergency download mode GNSS LNA enable control Pulled up to LDO9_1V8 during power-up will force the module into emergency download mode. If unused, keep this pin open. Pin Name Pin No. I/O Description DC Characteristics Comment JTAG_PS_ HOLD JTAG_TRST JTAG_TCLK JTAG_TMS JTAG_TDO JTAG_TDI 183 184 188 185 186 187 DO DI DI DI JTAG power-supply hold JTAG reset JTAG clock input JTAG mode-select input DO JTAG data output DI JTAG data input JTAG_RST_N 189 DI JTAG reset for debug Reserved Interface Pin Name Pin No. RESERVED 1, 2, 157, 166, 190, 191, 192, 212, 222, 244, 250, 252 1.8 V power domain Comment Keep these pins open. GPIO Interfaces Pin Name Pin No. I/O Description GPIO_2 248 DIO GPIO_3 247 DIO GPIO_4 GPIO_5 58 59 DIO DIO GPIO_14 251 DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output DC Characteristics Comment 1.8 V power domain. SC690A_Series_Hardware_Design 33 / 105 Smart Module Series GPIO_15 249 DIO GPIO_25 GPIO_26 10 11 DIO DIO GPIO_31 153 DIO GPIO_32 237 DIO GPIO_33 137 DIO GPIO_34 254 DIO GPIO_35 253 DIO GPIO_55 GPIO_56 13 14 DIO DIO GPIO_60 239 DIO GPIO_62 154 DIO GPIO_64 240 DIO GPIO_65 177 DIO GPIO_66 178 DIO GPIO_67 235 DIO GPIO_68 246 DIO GPIO_83 245 DIO GPIO_84 232 DIO GPIO_85 231 DIO GPIO_86 229 DIO GPIO_93 136 DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output 1.8 V power domain. SC690A_Series_Hardware_Design 34 / 105 Smart Module Series GPIO_96 238 DIO GPIO_97 205 DIO GPIO_106 230 DIO GPIO_107 15 DIO GPIO_111 199 DIO GPIO_112 198 DIO LPI_GPIO_21 203 DIO LPI_GPIO_22 204 DIO GPIO_09B 12 DO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose output of PM1 GPIO_02C 151 DIO General-purpose input/output of PM2 Only used for audio and sensor, cannot be used as ordinary GPIO port PMUs GPIO Used for enabling some power only. Power domain:

1.8 V or VPH_PWR 2.6. EVB To help you to develop applications with the module conveniently, Quectel supplies an evaluation board (EVB), USB data cable, earphone, antenna, and other peripherals to control or to test the module. For more details, see document [1]. SC690A_Series_Hardware_Design 35 / 105 Smart Module Series 3 Operating Characteristics 3.1. Power Supply 3.1.1. Power Supply Pins The module provides 3 VBAT pins, and 2 VPH_PWR pins. VBAT pins must be connected to an external power supply to power the module. VPH_PWR pins are used to power other devices. 3.1.2. Battery Charge and Management The module can recharge batteries. The battery charger in the module supports trickle charging, constant current charging and constant voltage charging modes, which optimize the charging procedure for Li-ion batteries. Trickle charging: When the battery voltage is below 2.1 V, a 75 mA trickle charging current is applied to the battery. Pre-charge mode: When the battery voltage is charged up and is between 2.1 V and 3.0 V (the maximum pre-charge voltage is 2.43.0 V programmable, 3.0 V by default), the system will enter into pre-charge mode. The charging current is 450 mA (100450 mA programmable, 450 mA by default). Constant current mode (CC mode): When the battery is increased to 3 V, the system will switch to CC mode. The maximum charging current is 3000 mA when an adapter is used for battery charging, and the maximum charging current is 500 mA for USB charging. Constant voltage mode (CV mode): When the battery voltage reaches the final value 4.35 V, the system will switch to CV mode and the charging current will decrease gradually. When the battery level reaches 100 %, the charging is completed. Table 7: Pin Definition of Charging Interface Pin Name Pin No. I/O Description Comment USB_VBUS 41, 42 PIO Charging power input. Power supply for OTG device. USB/adaptor insertion detection. USB On-The-Go (OTG) supports up to 1.0 A. SC690A_Series_Hardware_Design 36 / 105 Smart Module Series 36, 37, 38 PIO Power supply for the module It must be able to provide sufficient current up to 3.0 A. It is suggested to use a TVS to increase voltage surge withstand capability. 27 28 AI AI Battery voltage detect (+) Cannot be kept open. Battery voltage detect (-) Cannot be kept open. VBAT BAT_P BAT_M BAT_THERM 29 AI Battery temperature detect BAT_ID 17 AI Battery type detect Internally pulled up. Externally connected to GND via a 10 k NTC resistor. Maximum input voltage: 1.875 V. Maximum input voltage: 1.875 V. If unused, keep this pin open. The module supports battery temperature detection in the condition that the battery integrates a thermistor (10 k 1 % NTC thermistor with a B-constant of 4050 by default; and the thermistor is connected to BAT_THERM pin, or there will be malfunctions such as battery charging failure, battery level display error, etc. A reference design for the battery charging circuit is shown below. Figure 3: Reference Design for Battery Charging Circuit Mobile devices such as mobile phones and handheld POS systems are powered by batteries. When different batteries are utilized, the charging and discharging curve must be modified correspondingly to achieve the best effect. If the thermistor is not available in the battery, or an adapter is utilized for powering the module, then there is only a need for connecting VBAT and GND. In this case, the system may mistakenly judge that SC690A_Series_Hardware_Design 37 / 105 GNDBAT_PBAT_THERMVBATTEMPVBAT123USB_VBUSAdapter or USBModuleBatteryGNDC1C2C3R1D1D2BAT_M0 R0 RR233 pFR3NM_10 K22 F1 F Smart Module Series the battery temperature is abnormal, which will cause battery charging failure. To avoid this, BAT_THERM should be connected to GND via a 10 k resistor. If BAT_THERM is unconnected, the system will be unable to detect the battery, and the battery will not be charged. BAT_P/M must be connected. Otherwise, the module will have trouble in voltage detection, as well as associated power on/off issues and battery charging/discharging issues. 3.1.3. Reference Design for Power Supply The power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of the module should be able to provide sufficient current of at least 3 A. If the voltage drop between the input and output is not too big, it is suggested to use an LDO to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is recommended. The following figure shows a reference design for +5V input power source. The designed output of the power supply is about 3.8 V and the maximum rated current is 5 A. Figure 4: Reference Circuit of Power Supply NOTE To avoid damaging internal flash, do not switch off the power supply when the module works normally. Only after shutting down the module with PWRKEY or AT command can you cut off the power supply. 3.1.4. Requirements for Voltage Stability The power supply range of the module is from 3.55 V to 4.4 V, and the recommended value is 3.8 V. The power supply performance, such as load capacity, voltage ripple, etc. directly influences the modules performance and stability. Under ultimate conditions, the module may have a transient peak current of SC690A_Series_Hardware_Design 38 / 105 VCC_5VU1PGNDPGNDPGNDPVINPVINPVINENSS/TRSWSWSWVOSPGFBFSWDEFGND3V8_ENDC_3V8D1C1C3C2R1Q1R2R3L1R4R5R6C5C6C4470 F10 F100 nF4.7 K47K51K3.3 nF2.2 uH100 K75 K20 K22 F100 nF Smart Module Series up to 3 A. If the power supply capability is not sufficient, there will be voltage drops, and if the voltage drops below 3.1 V, the module will power off automatically. Therefore, ensure that the input voltage never drops below 3.1 V. Figure 5: Voltage Drop Sample To prevent the voltage from dropping below 3.1 V, use a bypass capacitor of about 100 F with low ESR

(ESR = 0.7 ), and reserve a multi-layer ceramic chip capacitor (MLCC) array due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) to compose the MLCC array, and place these capacitors close to VBAT pins. Additionally, add a 4.7 F capacitor in parallel. The width of VBAT trace should be no less than 3 mm. In principle, the longer the VBAT trace is, the wider it should be. In addition, to get a stable power source, it is suggested to use a 2000 W TVS and place it as close to the VBAT pins as possible to enhance surge protection. The following figure shows the structure of the power supply. Figure 6: Structure of Power Supply SC690A_Series_Hardware_Design 39 / 105 Voltage3.8VInput current3AModuleVBATVBATC1+C2C3C4D1C5GND100 F4.7 F100 nF33 pF10 pF Smart Module Series 3.2. Turn on Table 8: Pin Definition of PWRKEY Pin Name Pin No. I/O Description Comment PWRKEY 39 DI Turn on/off the module Pull up to 1.8 V internally. Active low. The module can be turned on by driving the PWRKEY pin to a low level for at least 1.6 s. PWRKEY pin is pulled to 1.8 V internally. It is recommended to use an open drain/collector driver to control the PWRKEY. A simple reference circuit is illustrated in the following figure. Figure 7: Turn on the Module Using Driving Circuit The other way to control the PWRKEY is by using a button directly. A TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 8: Turn on the Module Using Keystroke SC690A_Series_Hardware_Design 40 / 105 PWRKEY> 1.6 sMCUGPIOModuleTurn on pulseR1R2Q1PWRKEYModuleS1Close to S1TVSTurn-on pulse1 K The turning on the scenario is illustrated in the following figure. Smart Module Series Figure 9: Timing of Turning on Module NOTE 1. When the module is powered on for the first time, its timing of turning on may be different from that shown above. 2. Ensure that VBAT is stable before pulling down the PWRKEY pin. It is recommended to wait until VBAT to be stable at 3.8 V for at less 30 ms before pulling down PWRKEY. Additionally, PWRKEY cannot be pulled down all the time. 3.3. Turn off Set the PWRKEY pin low for at least 1 s, and then choose to turn off the module when the prompt window comes up. The other way to turn off the module is to drive PWRKEY to a low level for at least 8 s. The module will execute the forced shutdown. The forced power-down scenario is illustrated in the following figure. SC690A_Series_Hardware_Design 41 / 105 VBAT(Typ:3.8 V)PWRKEY> 1.6 sOthersLDO9_1V838 s165.4 msSoftware controlledLDO5_2V96ActiveNote2Software controlled Smart Module Series Figure 10: Timing of Turning off Module 3.4. VRTC Interface The RTC (Real Time Clock) can be powered by an external power source through VRTC when the module is powered down and there is no power supply for the VBAT. The external power source can be a capacitor according to application demands. The following figure shows the reference circuit when an external battery is utilized for powering RTC. Figure 11: RTC Powered by Coin Cell When VBAT is disconnected, the recommended input voltage range for VRTC is 2.03.25 V and the recommended typical value is 3.0 V. When powered by VBAT, the RTC error is 50 ppm. When powered by VRTC, the RTC error is about 200 ppm. If a rechargeable battery is used, ESR of the battery should be less than 2 k. If RTC function is not needed, it is recommended to connect a 0.1 F capacitor to VRTC. SC690A_Series_Hardware_Design 42 / 105 VBATPWRKEYOthers> 8 sPower downCoin CellModuleRTC CoreVRTCC Smart Module Series 3.5. Power Output The module supports output of regulated voltages for peripheral circuits. During application, it is recommended to connect a 33 pF and a 10 pF capacitor in parallel to suppress high-frequency noise. Table 9: Power Description Pin Name Default Voltage (V) Drive Current (mA) Standby LDO9_1V8 1.8 SD_LDO5 1.8/2.95 SD_LDO22 2.95 USIM1_VDD 1.8/2.95 USIM2_VDD 1.8/2.95 300 50 600 50 50 Keeps ON

VPH_PWR VBAT 2000 Keeps ON SC690A_Series_Hardware_Design 43 / 105 Smart Module Series 4 Application Interfaces 4.1. USB Interfaces The module provides one USB interface(s): USB Type-C. The USB interface complies with the USB 3.1 Gen1 and USB 2.0 specifications, and supports SuperSpeed (5 Gbps) for USB 3.1 Gen1, High-

Speed (480 Mbps), Full-Speed (12 Mbps) and Low-Speed (1.5 Mbps) for USB 2.0. The USB interface supports USB OTG function, and is used for AT command communication, data transmission, software debugging and firmware upgrade. Table 10: Functions of the USB Interface Functions Data communication with external AP AT command communication Data transmission GNSS NMEA output Software debugging Firmware upgrade Voice over USB NOTE means supported; - means not supported.

SC690A_Series_Hardware_Design 44 / 105 Smart Module Series Table 11: Pin Definition of USB Interface Pin Name Pin No. I/O Description Comment USB_VBUS 41, 42 PIO Charging power input. Power supply for OTG device. USB/adaptor insertion detection. AIO USB 2.0 differential data (-) AIO USB 2.0 differential data (+) USB_DM USB_DP 33 32 USB_SS1_RX_P 171 USB_SS1_RX_M 172 USB_SS1_TX_P 174 USB_SS1_TX_M 175 USB_SS2_RX_M 161 USB_SS2_RX_P 162 USB_SS2_TX_M 164 USB_SS2_TX_P 165 USB_CC1 USB_CC2 SS_DIR_IN 224 223 255 USB 3.1 Channel 1 super-

speed receive (+) USB 3.1 Channel 1 super-

speed receive (-) USB 3.1 Channel 1 super-

speed transmit (+) USB 3.1 Channel 1 super-

speed transmit (-) USB 3.1 Channel 2 super-

speed receive (-) USB 3.1 Channel 2 super-

speed receive (+) USB 3.1 Channel 2 super-

speed transmit (-) USB 3.1 Channel 2 super-

speed transmit (+) USB Type-C detect 1 USB Type-C detect 2 AI AI AO AO AI AI AO AO AI AI AI USB On-The-Go (OTG) supports up to 1.0 A. USB 2.0 standard compliant. 90 differential impedance. Compliant with USB 3.1 Gen1 specification. 90 differential impedance. CC status detect USB PHY port select. SS_DIR_OUT 225 AO CC status output OPTION 211 AI USB mode select Select either micro-USB mode or Type-C mode. SC690A_Series_Hardware_Design 45 / 105 Smart Module Series Figure 12: USB Type-C Interface Reference Design To ensure USB performance, please comply with the following principles while designing USB interface. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90 . Pay attention to the influence of junction capacitance of ESD protection devices on USB data traces. Typically, the capacitance value should be less than 2 pF for USB 2.0 and less than 0.5 pF for USB 3.1 Gen1. Do not route signal traces under crystals, oscillators, magnetic devices, and RF signal traces. It is important to route the USB differential traces in inner-layer with ground shielding on not only upper and lower layers but also right and left sides. Keep the ESD protection devices as close as possible to the USB connector. Ensure the trace length difference between USB_DM/DP and that between USB 3.1 Gen1 RX/TX differential pairs do not exceed 0.7 mm. If micro USB is supported, R1 = NM, R2 = 10 K, R3 = 1 K. If USB Type-C is supported, R2/R3 = NM, R1 = 0 R. Table 12: USB Trace Length Inside the Module Pin No. Signal Length (mm) Length Difference (DP-DM) 33 32 USB_DM USB_DP 38.16 38.38

-0.22 SC690A_Series_Hardware_Design 46 / 105 ModuleUSB Type-CUSB_VBUSR1USB_HS_DPUSB_HS_DMUSB_CC1USB_CC2SS_DIR_OUTSS_DIR_INUSB_SS1_RX_PVBUSUSB_SS1_RX_MUSB_SS2_RX_PUSB_SS2_RX_MUSB_SS1_TX_PUSB_SS1_TX_MUSB_SS2_TX_MUSB_SS2_TX_POPTIOND+D-CC1CC2RX1+RX1-TX1+TX1-RX2+RX2-TX2+TX2-GNDC8C7C6C5C4C3C1C2R2R3NM_10 K0 RNM_1 K330 nF330 nF220 nF220 nF330 nF220 nF220 nF330 nF220 K 220 K 220 K 220 K R4R5R6R7 Smart Module Series 171 172 174 175 161 162 164 165 USB_SS1_RX_P USB_SS1_RX_M USB_SS1_TX_P USB_SS1_TX_M USB_SS2_RX_M USB_SS2_RX_P USB_SS2_TX_M USB_SS2_TX_P 26.12 25.80 25.53 25.51 30.25 30.58 35.50 35.25 0.32 0.02

-0.33 0.25 4.2. UART Interfaces The module provides 3 UART interfaces:

UART5: 4-wire UART interface, hardware flow control supported. UART1: 4-wire UART interface, hardware flow control supported. Debug UART : 2-wire UART interface; used for debugging by default. Pin definition of the UART interfaces is here as follows:

Table 13: Pin Definition of UART Interfaces Pin Name Pin No. I/O Description Comment DBG_TXD DBG_RXD UART5_TXD UART5_RXD 5 6 7 8 DO Debug UART transmit. DI Debug UART receive. DO UART5 transmit DI UART5 receive 1.8 V power domain. GPIO_15 249 DO GPIO_14 251 DI General-purpose input/output General-purpose input/output Can be multiplexed into UART5_RTS. Can be multiplexed into UART5_CTS. UART1_TXD 60 DO UART1 transmit SC690A_Series_Hardware_Design 47 / 105 Smart Module Series UART1_RXD GPIO_4 GPIO_5 61 58 59 DI DI DO UART1 receive General-purpose input/output General-purpose input/output Can be multiplexed into UART1_CTS. Can be multiplexed into UART1_RTS. UART5 is a 4-wire UART interface with 1.8 V power domain. A level translator chip should be used if your application is equipped with a 3.3 V UART interface. A level translator chip is recommended. The following figure shows a reference design. Figure 13: Reference Circuit with Level Translator Chip (for UART5) The following figure is an example of connection between the module and PC. A voltage level translator and an RS-232 level translator chip are recommended to be added between the module and PC, as shown below:

Figure 14: RS-232 Level Match Circuit (for UART5) NOTE The reference circuit of debug UART and UART1 is similar to that of UART5. SC690A_Series_Hardware_Design 48 / 105 VCCAVCCBOEA1A2A3A4GNDB1B2B3B4LDO9_1V8UART5_RTSUART5_RXDUART5_CTSUART5_TXDRXD_3.3VCTS_3.3VTXD_3.3VVDD_3.3VU1RTS_3.3VC1C2RXD_3.3VCTS_3.3VVCCAModuleGNDGND1.8VVCCB3.3VDIN1ROUT3ROUT2ROUT1DIN4DIN3DIN2DIN5FORCEON3.3VDOUT1DOUT2DOUT3DOUT4DOUT5RIN3RIN2RIN1VCCGNDOEDB-9RTSTXDCTSRXDGNDRTS_3.3VUART5_TXDUART5_RTSUART5_RXDUART5_CTSTXD_1.8VRTS_1.8VRXD_1.8VCTS_1.8V/FORCEOFF/INVALIDR1OUTBTXD_3.3VU1U2 Smart Module Series 4.3. (U)SIM Interfaces The module provides two (U)SIM interfaces which meet ETSI and IMT-2000 requirements. Dual SIM Dual Standby is supported by default. Either 1.8 V or 2.95 V (U)SIM card is supported, and the (U)SIM interfaces are powered by the dedicated low dropout regulators in the module. Table 14: Pin Definition of (U)SIM Interface Pin Name Pin No. I/O Description Comment USIM1_VDD 141 PO

(U)SIM1 card power supply Either 1.8 V or 2.95 V

(U)SIM card is supported. USIM1_DATA USIM1_CLK USIM1_RST 142 143 144 DIO

(U)SIM1 card data DO DO

(U)SIM1 card clock

(U)SIM1 card reset USIM1_DET 145 DI

(U)SIM1 card hot-plug detect USIM2_VDD 210 PO

(U)SIM2 card power supply USIM2_DATA USIM2_CLK USIM2_RST 209 208 207 DIO

(U)SIM2 card data DO DO

(U)SIM2 card clock

(U)SIM2 card reset USIM2_DET 256 DI

(U)SIM2 card detect Active Low. Require external pulled up to 1.8 V. If unused, keep this pin open. Disabled by default, and can be enabled through software configuration. Either 1.8 V or 2.95 V

(U)SIM card is supported. Active Low. Require external pulled up to 1.8 V. If unused, keep this pin open. Disabled by default, and can be enabled through software configuration. SC690A_Series_Hardware_Design 49 / 105 Smart Module Series The module supports (U)SIM card hot-plug via the USIM_DET pin, which is disabled by default and can be enabled through software configuration. A reference circuit for (U)SIM interface with an 8-pin (U)SIM card connector is shown below. Figure 15: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector To enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design. Keep (U)SIM card connector as close as possible to the module. Keep the trace length as less than 200 mm as possible. Keep (U)SIM card signal traces away from RF and VBAT traces. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with ground surrounded. For better ESD protection, it is recommended to add a TVS diode array with a parasitic capacitance not exceeding 50 pF. The 22 resistors should be added in series between the module and the

(U)SIM card connector to suppress EMI spurious transmission and enhance ESD protection. The pull-up resistor on USIM_DATA trace improves anti-jamming capability and should be placed close to the (U)SIM card connector. Add 22 pF capacitors parallel on USIM_DATA, USIM_CLK and USIM_RST signal traces to filter RF interference, and place them as close to the (U)SIM card connector as possible. SC690A_Series_Hardware_Design 50 / 105 ModuleUSIM_VDD(U)SIM Card ConnectorUSIM_RSTUSIM_CLKUSIM_DATAUSIM_DETGNDSIM_RSTSIM_CLKSIM_DATASIM_DETGNDSIM_VDD100 K10 KC1C2C3C4ESDLDO9_1V8USIM_VDDR3R4R5R1R222 R22 R22 R22 pF22 pF22 pF100 nF Smart Module Series 4.4. SD Card Interface The module supports SD 3.0 specifications. The pin definition of the SD card interface is shown below. Table 15: Pin Definition of SD Card Interface Pin Name Pin No. I/O Description Comment SD_CLK SD_CMD 70 69 SD_DATA0 68 SD_DATA1 67 SD_DATA2 66 SD_DATA3 65 SD_DET 64 SD_LDO22 63 DO DIO DIO DIO DIO DIO DI PO SD_LDO5 179 PO SD card clock SD card command SDIO data bit 0 SDIO data bit 1 SDIO data bit 2 SDIO data bit 3 SD card hot-plug detect Active low. SD card power supply 1.8/2.95 V output power for SD card pull-up circuits A reference circuit for SD card interface is shown below. Figure 16: Reference Circuit for SD Card Interface SC690A_Series_Hardware_Design 51 / 105 SD_CMDSD_DATA3SD_DATA2SD_CLKSD_DATA0SD_DETSD_DATA1P1-DAT2P2-CD/DAT3P3-CMDP4-VDDP5-CLKP8-DAT1P6-VSSP7-DAT0DETECTIVEGNDModuleD1D2D3D4D5D6D7D8C1C2SD Card ConnectorLDO9_1V8SD_LDO22SD_LDO5GNDR1R2R3R4R5R6R74.7 F33 pF33 R33 R33 R33 R33 R33 R1 K R10R11R12R13R9R8120 K NM_51 KNM_51 KNM_51 KNM_51 KNM_10 KR140 R Smart Module Series SD_LDO22 is a peripheral driver power supply for SD card. The maximum drive current is 600 mA. Because of the high drive current, it is recommended that the trace width is 0.5 mm or above. To ensure the stability of drive power, add a 4.7 F and a 33 pF capacitor in parallel near the SD card connector. SD_CMD, SD_CLK, SD_DATA0, SD_DATA1, SD_DATA2 and SD_DATA3 are all high-speed signal traces. In PCB design, control the characteristic impedance of them as 50 , and do not cross them with other traces. It is recommended to route these traces on the inner layer of PCB, and keep them of the same length. Additionally, SD_CLK needs separate ground shielding. Layout guidelines:

Control impedance to 50 10 %, and add ground shielding. The trace length difference between SD_CLK and other traces like SD_CMD and SD_DATA should be less than 1 mm. Table 16: SD Card Signal Trace Length Inside the Module Pin No. 70 69 68 67 66 65 Signal SD_CLK SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 4.5. GPIO Interfaces Length (mm) 48.98 48.82 48.42 48.54 48.60 50.34 The module has abundant GPIO interfaces with power domain of 1.8 V. The pin definition is listed below. Table 17: Pin Definition of GPIO Interfaces Pin Name Pin No. I/O Description Comment GPIO_2 248 DIO General-purpose input/output SC690A_Series_Hardware_Design 52 / 105 GPIO_3 GPIO_4 GPIO_5 GPIO_14 GPIO_15 GPIO_25 GPIO_26 GPIO_31 GPIO_32 GPIO_33 GPIO_34 GPIO_35 GPIO_55 GPIO_56 GPIO_60 GPIO_62 GPIO_64 GPIO_65 GPIO_66 GPIO_67 GPIO_68 GPIO_83 Smart Module Series 247 58 59 251 249 10 11 153 237 137 254 253 13 14 239 154 240 177 178 235 246 245 DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output 1.8 V power domain. 1.8 V power domain. SC690A_Series_Hardware_Design 53 / 105 Smart Module Series GPIO_84 GPIO_85 GPIO_86 GPIO_93 GPIO_96 GPIO_97 GPIO_106 GPIO_107 GPIO_111 GPIO_112 LPI_GPIO_21 LPI_GPIO_22 232 231 229 136 238 205 230 15 199 198 203 204 DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO DIO GPIO_09B 12 DO General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose input/output General-purpose output of PM1 Only used for audio and sensor. PMUs GPIO Used for enabling some power only. GPIO_02C 151 DIO General-purpose input/output of PM2 Power domain:

1.8 V or VPH_PWR 4.6. I2C Interfaces The module provides up to five I2C Interfaces. All I2C interfaces are open drain signals and therefore you must pull them up externally. The reference power domain is 1.8 V. The SENSOR_I2C interface only supports sensors of the DSP architecture. The CAM_I2C interface supports connection with video output related devices. SC690A_Series_Hardware_Design 54 / 105 Smart Module Series Table 18: Pin Definition of I2C Interfaces Pin Name Pin No. I/O Description Comment SENSOR_I2C_SCL 131 OD I2C clock for external sensor SENSOR_I2C_SDA 132 OD I2C data for external sensor I2C0_SCL 200 OD I2C clock for external device I2C0_SDA 201 OD I2C data for external device CAM_I2C_SCL CAM_I2C_SDA 75 76 OD OD I2C clock of front and rear cameras I2C data of front and rear cameras DCAM_I2C_SCL 196 OD I2C clock of depth camera DCAM_I2C_SDA 197 OD I2C data of depth camera TP_I2C_SCL 140 OD TP I2C clock TP_I2C_SDA 206 OD TP I2C data 1.8 V power domain. 4.7. I2S Interfaces The module provides two I2S interfaces, which are low-power I2S. Data signals of both interfaces can be configured as input or output, and the reference power domain of the interfaces is 1.8 V. LPI_MI2S0 interface is multiplexed from DMIC interface*. Table 19: Pin Definition of I2S Interfaces Pin Name Pin No. I/O Description Comment I2S_MCLK LPI_MI2S1_SCLK LPI_MI2S1_WS 234 55 156 DO I2S master clock DO LPI I2S1 serial clock DO LPI I2S1 word select LPI_MI2S1_DATA0 54 DIO LPI I2S1 data channel 0 LPI_MI2S1_DATA1 155 DIO LPI I2S1 data channel 1 LPI_MI2S0_CLK 46 DO LPI I2S0 serial clock 1.8 V power domain. SC690A_Series_Hardware_Design 55 / 105 Smart Module Series LPI_MI2S0_WS LPI_MI2S0_DATA0 LPI_MI2S0_DATA1 45 169 168 DO LPI I2S0 word select DIO LPI I2S0 data channel 0 DIO LPI I2S0 data channel 1 4.8. ADC Interface The module provides one analog-to-digital converter (ADC) interface which support up to 15-bit resolution, and the pin definition is shown below. Table 20: Pin Definition of ADC Interfaces Pin Name Pin No. I/O Description Comment ADC 152 AI General-purpose ADC interface Maximum input voltage: 1.875 V. 4.9. LCM Interfaces The module provides an LCM interface, which is MIPI_DSI standard compliant. The interface supports high-speed differential data transmission and supports FHD+ display (1080 2520 @ 60 fps). The maximum rate up to 1.5 Gbps/lane. The pin definition of the LCM interface is shown below. Table 21: Pin Definition of LCM Interfaces Pin Name Pin No. I/O Description Comment LCD_BIAS_P LCD_BIAS_N PWM WLED_EN LCD_RST LCD_TE 21 22 30 158 113 114 PO PO DO DO LCD display bias (+) Positive LCD regulated output. LCD display bias (-). Negative LCD regulated output. PWM output 1.8 V power domain. LCD backlight enable 1.8 V power domain. DO LCD reset 1.8 V power domain. Active low. DI LCD tearing effect 1.8 V power domain. SC690A_Series_Hardware_Design 56 / 105 Smart Module Series DSI_CLK_P DSI_CLK_N DSI_LN0_P DSI_LN0_N DSI_LN1_P DSI_LN1_N DSI_LN2_P DSI_LN2_N DSI_LN3_P DSI_LN3_N 102 103 104 105 106 107 108 109 110 111 AIO LCD MIPI clock (+) AIO LCD MIPI clock (-) AIO LCD MIPI lane 0 data (+) AIO LCD MIPI lane 0 data (-) AIO LCD MIPI lane 1 data (+) AIO LCD MIPI lane 1 data (-) AIO LCD MIPI lane 2 data (+) AIO LCD MIPI lane 2 data (-) AIO LCD MIPI lane 3 data (+) AIO LCD MIPI lane 3 data (-) SC690A_Series_Hardware_Design 57 / 105 The following figures show the reference design for LCM interface. Smart Module Series Figure 17: Reference Circuit Design for LCM Interface MIPI are high speed signal lines. It is recommended to add common-mode filters in series near the LCM connector to improve protection against electromagnetic radiation interference. It is recommended to read the LCM ID register through MIPI when compatible design with other displays is required. If several LCMs share the same IC, it is recommended that LCM module factory should burn an OTP register to distinguish different screens. You can also connect the LCD_ID pin of LCM to the ADC pin of the module, but please note that the output voltage of LCD_ID should not exceed the voltage range of the ADC pin. SC690A_Series_Hardware_Design 58 / 105 DSI_CLK_PLEDANCLEDKLPTENC (SDA-TP) VIO18NC (VTP-TP) DSI_LN3_PDSI_LN3_NDSI_LN2_PDSI_CLK_NDSI_LN2_NRESETLCD_IDNC (SCL-TP) NC (RST-TP) NC (EINT-TP) GNDVCC28GNDMIPI_TDP3MIPI_TDN3GNDMIPI_TDP2MIPI_TDN2GNDMIPI_TDP1MIPI_TDN1GNDLCD_VDD_2V8LDO9_1V8LCD_BL_ALCD_BL_K11234567891012131415161718192021222324252627MIPI_TDP0MIPI_TDN0GNDMIPI_TCPMIPI_TCN2928303456345634563456DSI_LN1_NDSI_LN1_PDSI_LN0_NDSI_LN0_P1234561112121212ModuleLCMFL1FL2FL3FL4FL5EMI filterC3C2C1NCGNDGNDGNDGNDADC31323334GNDLCD_BL_K2LCD_TELCD_RSTINENOUTBP/FBGNDC1R1C2C3B1VPH_PWRGPIO_09BLCD_VDD_2V8U1100 nF4.7 F1 F4.7 F10 K1 F100 nF Smart Module Series You can design external backlight drive circuit for LCM according to actual requirement. The reference designs are shown in the figures below, in which PWM is used for backlight brightness adjustment. Figure 18: LCM External Backlight Driver Reference Circuit NOTE LCM is powered by LCD_VDD_2V8, which is an external LDO power supply. 4.10. Touch Panel Interface The module provides one I2C interface for connection with touch panel (TP), and provides the corresponding power supply and interrupt pins. The pin definition of touch panel interfaces is illustrated below. Table 22: Pin Definition of Touch Panel Interfaces Pin Name Pin No. I/O Description Comment TP_RST TP_INT TP_I2C_SCL TP_I2C_SDA 138 139 140 206 DO TP reset DI TP interrupt OD TP I2C clock OD TP I2C data 1.8 V power domain. SC690A_Series_Hardware_Design 59 / 105 LCD_BL_A ModuleBacklight DriverVPH_PWRC1PWMGNDLCD_BL_K1 LCD_BL_K2 A reference design for TP interface is shown below. Smart Module Series Figure 19: Reference Circuit Design for TP Interface NOTE TP is powered by TP_VDD_2V8, which is an external LDO power supply. 4.11. Camera Interfaces Based on the standard MIPI CSI video input interface, the module supports 3 cameras (4-lane + 4-lane+

4-lane) or 4 cameras (4-lane + 4-lane + 2-lane+ 1-lane), and the maximum pixel of the camera can be up to 25 MP. The video and photo quality are determined by various factors such as the camera sensor, camera lens quality, etc. SC690A_Series_Hardware_Design 60 / 105 TP_RSTTP_I2C_SCLTP_I2C_SDATP_INT123456ModuleRESET SCL SDA INT GNDVDD TPC1C2D1D2D3D4D5TP_VDD_2V8LDO9_1V8GNDINENOUTBP/FBGNDC1R1C2C3B1VPH_PWRGPIO_26TP_VDD_2V8U12.2 K2.2 KR2R34.7 F100 nF4.7 F10 K10 nF1 F Smart Module Series Table 23: Pin Definition of Camera Interfaces Pin Name Pin No. I/O Description Comment CSI0_CLK_P 77 AIO MIPI clock of rear camera (+) CSI0_CLK_N 78 AIO MIPI clock of rear camera (-) CSI0_LN0_P 79 AIO MIPI lane 0 data of rear camera (+) CSI0_LN0_N 80 AIO MIPI lane 0 data of rear camera (-) CSI0_LN1_P 81 AIO MIPI lane 1 data of rear camera (+) CSI0_LN1_N 82 AIO MIPI lane 1 data of rear camera (-) CSI0_LN2_P 83 AIO MIPI lane 2 data of rear camera (+) CSI0_LN2_N 84 AIO MIPI lane 2 data of rear camera (-) CSI0_LN3_P 85 AIO MIPI lane 3 data of rear camera (+) CSI0_LN3_N 86 AIO MIPI lane 3 data of rear camera (-) CSI1_CLK_P 88 AIO MIPI clock of front camera (+) CSI1_CLK_N 89 AIO MIPI clock of front camera (-) CSI1_LN0_P 90 AIO MIPI lane 0 data of front camera (+) CSI1_LN0_N 91 AIO MIPI lane 0 data of front camera (-) CSI1_LN1_P 92 AIO MIPI lane 1 data of front camera (+) CSI1_LN1_N 93 AIO MIPI lane 1 data of front camera (-) CSI1_LN2_P 94 AIO MIPI lane 2 data of front camera (+) CSI1_LN2_N 95 AIO MIPI lane 2 data of front camera (-) CSI1_LN3_P 96 AIO MIPI lane 3 data of front camera (+) CSI1_LN3_N 97 AIO MIPI lane 3 data of front camera (-) CSI2_CLK_P 115 AIO MIPI clock of depth camera (+) CSI2_CLK_N 116 AIO MIPI clock of depth camera (-) CSI2_LN0_P 117 AIO MIPI lane 0 data of depth camera (+) CSI2_LN0_N 118 AIO MIPI lane 0 data of depth camera (-) SC690A_Series_Hardware_Design 61 / 105 Smart Module Series CSI2_LN1_P 119 AIO MIPI lane 1 data of depth camera (+) CSI2_LN1_N 120 AIO MIPI lane 1 data of depth camera (-) CSI2_LN2_P 121 AIO MIPI lane 2 data of depth camera (+) CSI2_LN2_N 122 AIO MIPI lane 2 data of depth camera (-) CSI2_LN3_P 123 AIO MIPI lane 3 data of depth camera (+) CSI2_LN3_N 124 AIO MIPI lane 3 data of depth camera (-) SCAM_MCLK 100 DO Master clock of front camera SCAM_RST 72 DO Reset of front camera SCAM_PWDN 71 DO Power down of front camera MCAM_MCLK 99 DO Master clock of rear camera MCAM_RST 74 DO Reset of rear camera MCAM_PWDN 73 DO Power down of rear camera DCAM_MCLK 194 DO Master clock of depth camera DCAM_RST 127 DO Reset of depth camera DCAM_PWDN 126 DO Power down of depth camera CAM4_MCLK 236 DO Master clock of fourth camera 1.8 V power domain. CAM_I2C_SCL 75 OD I2C clock of front and rear cameras 1.8 V power domain. CAM_I2C_ SDA DCAM_I2C_ SDA DCAM_I2C_ SCL 76 OD I2C data of front and rear cameras 1.8 V power domain. 197 OD I2C data of depth camera 1.8 V power domain. 196 OD I2C clock of depth camera 1.8 V power domain. SC690A_Series_Hardware_Design 62 / 105 The following is a reference circuit design for three-camera applications. Smart Module Series Figure 20: Reference Circuit Design for Three-Camera Applications SC690A_Series_Hardware_Design 63 / 105 Rear camera connectorMCAM_PWDNMCAM_MCLKCAM_I2C_SDACAM_I2C_SCL_CSI0_LN3_PCSI0_LN3_NCSI0_LN2_PCSI0_LN2_NCSI0_LN1_PCSI0_LN1_NCSI0_LN0_PCSI0_LN0_NSCAM_RSTSCAM_PWDNSCAM_MCLKCSI1_LN3_PCSI1_LN3_NCSI1_LN2_PCSI1_LN2_NCSI1_LN1_PCSI1_LN1_NCSI1_LN0_PCSI1_LN0_NCSI0_CLK_PCSI0_CLK_NCSI1_CLK_PCSI1_CLK_NAVDD_2V8Front camera connectorC6MCAM_RSTDCAM_PWDNDCAM_MCLKDCAM_I2C_SDADCAM_I2C_SCLDCAM_RSTDepth camera connector AFVDD_2V8EMIEMIEMIEMIEMIEMIEMIEMIDVDD_1V2DVDDEMIEMIAVDDDOVDDLDO9_1V8DVDD_1V2GNDC1C2C3C4R1R2C8C7C9C10R3R42.2 K2.2 K4.7 F1 F1 F1 F4.7 F2.2 K2.2 K1 F1 F4.7 F4.7 F Smart Module Series NOTE CSI0 is used for rear camera, CSI1 for front camera and depth camera. Refer to the reference circuit of CSI0 for that of CSI2. The camera interfaces are powered by an external power supply. The reference circuit design is as follows:

Figure 21: Reference Circuit Design for Camera Power Supply Special attention should be paid to the pin definition of LCM/camera connectors. Ensure the module and the connectors are correctly connected. MIPI is high speed signal traces, supporting maximum data rate up to 2.5 Gbps. The differential SC690A_Series_Hardware_Design 64 / 105 VINRUNSWVFB/VOUTGNDC1R1C3VPH_PWRGPIODVDD_1V2U1INENOUTBP/FBGNDC1R1C2C3B1VPH_PWRGPIOAVDD_2V8U1INENOUTBP/FBGNDC1R1C2C3B1VPH_PWRGPIOAFVDD_2V8U1B1L14.7 F10 K22 F2.2 H1 F100 nF4.7 F10 K10K4.7 F100 nF1 F Smart Module Series impedance should be controlled to 85 . Additionally, it is recommended to route the trace on the inner layer of PCB, and do not cross it with other traces. For the same group of DSI or CSI signals, all the MIPI traces should keep the same length. To avoid crosstalk, a distance of 1.5 times the trace width among MIPI signal traces is recommended. During impedance matching, do not connect GND on different planes to ensure impedance consistency. It is recommended to select a low capacitance TVS for ESD protection and the recommended parasitic capacitance should be below 1 pF. Route MIPI traces according to the following rules:

a) The total trace length should not exceed 150 mm;

b) Control the differential impedance to 85 10 %;

c) Control intra-pair length difference within 0.7 mm;

d) Control inter-pair length difference within 1.4 mm. Table 24: MIPI Trace Length Inside the Module Pin Name Pin No Length (mm) Length Difference (P-N) DSI_CLK_N DSI_CLK_P DSI_LN0_N DSI_LN0_P DSI_LN1_N DSI_LN1_P DSI_LN2_N DSI_LN2_P DSI_LN3_N DSI_LN3_P CSI0_CLK_N CSI0_CLK_P CSI0_LN0_N CSI0_LN0_P CSI0_LN1_N 103 102 105 104 107 106 109 108 111 110 78 77 80 79 82 50.71 50.37 50.28 50.58 50.32 50.00 50.20 50.49 50.43 50.16 20.54 20.26 20.75 20.74 20.79 0.35

-0.30 0.32

-0.29 0.27 0.28 0.00 0.35 SC690A_Series_Hardware_Design 65 / 105 Smart Module Series CSI0_LN1_P CSI0_LN2_N CSI0_LN2_P CSI0_LN3_N CSI0_LN3_P CSI1_CLK_N CSI1_CLK_P CSI1_LN0_N CSI1_LN0_P CSI1_LN1_N CSI1_LN1_P CSI1_LN2_N CSI1_LN2_P CSI1_LN3_N CSI1_LN3_P CSI2_CLK_N CSI2_CLK_P CSI2_LN0_N CSI2_LN0_P CSI2_LN1_N CSI2_LN1_P CSI2_LN2_N CSI2_LN2_P CSI2_LN3_N CSI2_LN3_P 81 84 83 86 85 89 88 91 90 93 92 95 94 97 96 116 115 118 117 120 119 122 121 124 123 20.45 20.84 20.65 21.17 21.01 13.17 13.10 12.82 12.82 12.97 12.68 12.82 12.99 13.02 12.6 29.77 29.54 29.65 29.40 29.64 29.36 29.37 29.53 29.76 29.45 0.20 0.16 0.06 0.00 0.29

-0.17 0.34 0.23 0.25 0.28

-0.16 0.31 SC690A_Series_Hardware_Design 66 / 105 Smart Module Series 4.12. Sensor Interfaces The module supports communication with sensors via I2C interface, and it supports various sensors such as acceleration sensor, gyroscopic sensor, compass, light sensor, temperature sensor, etc. Table 25: Pin Definition of Sensor Interfaces Pin Name Pin No. I/O Description Comment SENSOR_I2C_SCL 131 OD I2C clock signal of external sensor 1.8 V power domain. SENSOR_I2C_SDA 132 OD I2C data signal of external sensor 1.8 V power domain. GPIO_35 253 DI GPIO_34 254 DI GPIO_33 137 DI GPIO_32 237 DI Can be multiplexed into ALPS_INT, used as light sensor interrupt Can be multiplexed into MAG_INT, used as geomagnetic sensor interrupt Can be multiplexed into GYRO_INT, used as gyroscopic sensor interrupt Can be multiplexed into ACCEL_INT, used as acceleration sensor interrupt 4.13. Flash Interfaces The module supports 2 flash LED drivers, with maximal output current up to 1.5 A per channel. The default output current is 1000 mA in flash mode and 300 mA in torch mode. Table 26: Pin Definition of Flash Interfaces Pin Name Pin No. I/O Description Comment FLASH1_LED 26 AO Flash/torch driver output FLASH2_LED 228 AO Flash/torch driver output Support flash and torch modes. 2 1.5 A (maximum 1.5 A combined) SC690A_Series_Hardware_Design 67 / 105 A reference circuit design is shown below. Smart Module Series Figure 26: Reference Circuit Design for Flashlight Interfaces 4.14. Keypad Interfaces The module supports three keypads: PWRKEY for turning module on/off and VOL_UP and VOL_DOWN to adjust the volume. Table 27: Pin Definition of Keypad Interfaces Pin Name Pin No. I/O Description Comment PWRKEY VOL_UP 39 146 VOL_DOWN 147 DI Turn on/off the module Pull up to 1.8 V internally. Active low. DI DI Volume up If unused, keep this pin open. Volume down If unused, keep this pin open. 4.15. Vibration Driver Motor Interfaces The module supports eccentric rotating machines (ERM). The pin definition of vibrator drive interface is listed below. Table 28: Pin Definition of Vibration Driver Motor Interfaces Pin Name Pin No. I/O Description Comment VIB_DRV 226 PO Vibration motor driver SC690A_Series_Hardware_Design 68 / 105 FLASH2_LEDFLASH1_LEDModuleD1D2 Smart Module Series output control The vibrator is driven by an exclusive circuit, and a reference circuit design is shown below. Figure 22: Reference Circuit for Vibrator Connection 4.16. JTAG Interface Table 29: Pin Definition of JTAG Interface Pin Name Pin No. I/O Description Comment JTAG_PS_HOLD JTAG_TRST JTAG_TCLK JTAG_TMS JTAG_TDO JTAG_TDI JTAG_RST_N 183 184 188 185 186 187 189 DO JTAG power-supply hold DI DI DI JTAG reset JTAG clock input JTAG mode-select input DO JTAG data output DI DI JTAG data input JTAG reset for debug SC690A_Series_Hardware_Design 69 / 105 ModuleVIB+MotorVIB-C1VIB_DRVD133 pF Smart Module Series 4.17. LED Driver Interface The following is the pin definition of LED driver interfaces. Table 30: Pin Definition of LED Driver Interface Pin Name Pin No. I/O Description Comment LED_RED LED_GRN LED_BLU 23 24 25 AO Current source for the red LED. AO Current source for the green LED. AO Current source for the blue LED. Sources up to 12 mA max per channel. A reference circuit design for LED interfaces is shown below. Figure 23: Reference Circuit Design for LED Interfaces 4.18. Audio Interfaces The module provides three pairs of analog input/output channels and two digital input/output channels. channels. The following table shows the pin definition. Table 31: Pin Definition of Audio Interfaces Pin Name Pin No. I/O Description Comment DMIC1_DATA 45 DIO Digital microphone 1 data SC690A_Series_Hardware_Design 70 / 105 LED_GRNLED_REDModuleLED_BLUR1D3R30 RD10 RR2D20 R Smart Module Series DMIC1_CLK 46 DO Digital microphone 1 clock DMIC2_DATA 168 DIO Digital microphone 2 data DMIC2_CLK 169 DO Digital microphone 2 clock MIC_BIAS1 44 AO Microphone bias output voltage 1 MIC_BIAS2 233 AO Microphone bias output voltage 2 MIC_BIAS3 167 AO Microphone bias output voltage 3 MIC1_P 218 AI Microphone input for channel 1 (+) MIC1_M 217 AI Microphone input for channel 1 (-) MIC2_P 216 AI Microphone input for channel 2 (+) MIC2_M 215 AI Microphone input for channel 2 (-) MIC3_P 214 AI Microphone input for channel 3 (+) MIC3_M 213 AI Microphone input for channel 3 (-) EAR_P EAR_M 53 52 AO AO Earpiece output (+) Earpiece output (-) LINE_OUT_P 181 AO Aux amplifier output (+) LINE_OUT_M 180 AO Aux amplifier output (-) Used for ECM microphone by default. MIC1_P require pulled up to MIC_BIAS1. Used for headset microphone by default. MIC2_P require pulled up to MIC_BIAS2. Used for MEMS microphone by default. MIC3_P require pulled up to MIC_BIAS3. HPH_R HPH_L HPH_GND HS_DET 51 49 50 48 AO AO AI AI Headphone right channel output Headphone left channel output Headphone reference ground Headset hot-plug detect Pulled up internally. The module offers five audio input/output channels, including two digital channels and three analog channels. The output voltage range of MIC_BIAS is programmable between 1.0 V and 2.85 V, and the maximum output current is 3 mA. The earpiece interface uses differential output. LINE_OUT for audio external speaker amplifier. The headset interface features stereo left and right channel output, and headset insert detection function is supported. SC690A_Series_Hardware_Design 71 / 105 Smart Module Series 4.18.1. Reference Circuit Design for Microphone Interfaces Figure 24: Reference Circuit Design for ECM Microphone Interfaces Figure 25: Reference Circuit Design for MEMS Microphone Interfaces SC690A_Series_Hardware_Design 72 / 105 MIC1_PECM MICModuleMIC1_MC2C3MIC_BIAS1R3D1C1R42.2 K0 RR1R2D22.2 KNM_0 R100 nF33 pF33 pFMIC3_PMEMS MICR2R1C2ModuleC1MIC_BIAS31234F1OUTGNDGNDVDDMIC3_MD1C3D233 pF100 nF0 R0 R33 pF Smart Module Series 4.18.2. Reference Circuit Design for Receiver Interface Figure 26: Reference Circuit Design for Receiver Interface 4.18.3. Reference Circuit Design for Headset Interface Figure 27: Reference Circuit Design for Headset Interface SC690A_Series_Hardware_Design 73 / 105 EAR_PEAR_MF2C2C3C1F1ModuleD1D233 pF33 pF33 pFESDMIC2_MMIC2_PHPH_LHS_DETHPH_RHPH_GNDModule364521C1C2C3F4F3F2D1D2D3D4F5R3R4MIC_BAIS2R2R1F1C40 R100 nF33 pF33 pF33 pF20 K2.2 K2.2 K Smart Module Series 4.18.4. Reference Circuit Design for Loudspeaker Interface Figure 28: Reference Circuit Design for Loudspeaker Interface 4.18.5. Audio Interfaces Design Considerations To decrease radio or other signal interference, RF antennas should be placed away from audio interfaces and audio traces. Additionally, keep power traces far away from the audio traces and do not route them in parallel. The differential audio traces must be routed according to the differential signal layout rule. 4.19. Emergency Download Interface USB_BOOT is an emergency download interface. Pull up to LDO9_1V8 during power-up will force the module to enter emergency download mode. There is an emergency option when start-up failures or operational abnormalities occur. For firmware upgrade and debugging in the future, please reverse the following reference circuit design. Figure 29: Reference Circuit Design for Emergency Download Interface SC690A_Series_Hardware_Design 74 / 105 ENGPIO_100C2D1D2NC+IN-INVO2GNDVDDVO1F2F1C1R2R3R1C3C4C5C7C6Audio PALINE_OUT_PLINE_OUT_MVPH_PWR10 F10 F82 K82 K10 K22 F1 F33 pF33 pF100 pFLDO9_1V8S1 ModuleUSB_BOOTR110K Smart Module Series 5 RF Specifications 5.1. Cellular Network 5.1.1. Antenna Interface & Frequency Bands Table 32: Pin Definition of Cellular Network Interface Pin Name Pin No. I/O Description Comment ANT_MAIN ANT_DRX 19 149 AIO Main antenna interface 50 impedance AI Diversity antenna interface 50 impedance NOTE Only passive antennas are supported. Table 33: Operating Frequency of SC690A-NA Operating Frequency Receive (MHz) Transmit (MHz) LTE-FDD B2 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 19301990 21102155 869894 26202690 729746 746756 758768 18501910 17101755 824849 25002570 699716 777787 788798 SC690A_Series_Hardware_Design 75 / 105 Smart Module Series LTE-FDD B17 LTE-FDD B25 LTE-FDD B26 LTE-FDD B66 734746 19301995 859894 21102200 704716 18501915 814849 17101780 Table 34: Operating Frequency of SC690A-EM Operating Frequency Receive (MHz) Transmit (MHz) WCDMA B1 WCDMA B3 WCDMA B8 LTE-FDD B1 LTE-FDD B3 LTE-FDD B7 LTE-FDD B8 LTE-FDD B20 LTE-FDD B28 21102170 18051880 925960 21102170 18051880 26202690 925960 791821 758803 19201980 17101785 880915 19201980 17101785 25002570 880915 832862 703748 5.1.2. Tx Power The following table shows the RF output power of the module. Table 35: Tx Power Frequency Max. WCDMA bands 24 dBm +1/-3 dB LTE-FDD bands 23 dBm 2 dB Min.

<-49 dBm

<-39 dBm SC690A_Series_Hardware_Design 76 / 105 Smart Module Series 5.1.3. Reference Design The module provides main and Rx-diversity RF antenna interfaces for antenna connection. It is recommended to reserve a -type matching circuit for better RF performance, and the -type matching components (R1/C1/C2, R2/C3/C4) should be placed as close to the antenna as possible. The capacitors are not mounted by default. Figure 30: Reference Circuit for RF Antenna Interfaces 5.2. GNSS The module integrates the IZat GNSS engine (Gen 8) which supports multiple positioning and navigation systems including GPS, GLONASS, BeiDou and so on. With an embedded LNA, the module provides greatly improved positioning accuracy. SC690A_Series_Hardware_Design 77 / 105 ANT_MAINR1 0 RC1ModuleMainantennaNMC2NMR2 0 RC3Diversity antennaNMC4NMANT_DRX Smart Module Series 5.2.1. Antenna Interface & Frequency Bands The following table shows the pin definition, frequency, and performance of GNSS antenna interface. Table 36: Pin Definition of GNSS Antenna Interface Pin Name Pin No. ANT_GNSS 134 I/O AI Description Comment GNSS antenna interface 50 impedance Table 37: GNSS Frequency Type GPS Frequency 1575.42 1.023 GLONASS 1597.51605.8 BeiDou Galileo 1561.098 2.046 1573.51577.5 5.2.2. Reference Design 5.2.2.1. Recommended Circuit for Passive Antenna Unit MHz GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. A reference circuit design is given below. Figure 31: Reference Circuit Design for GNSS Passive Antenna NOTE SC690A_Series_Hardware_Design 78 / 105 Passive AntennaModuleANT_GNSSNMC1C2R1C4NM0R Smart Module Series When the passive antenna is placed far away from the module (that is, the antenna trace is long), it is recommended to add an external LNA circuit for better GNSS receiving performance, and the LNA should be placed close to the antenna. 5.2.2.2. Recommended Circuit for Active Antenna The active antenna is powered by a 56 nH inductor through the antenna's signal path. The common power supply voltage ranges from 3.3 V to 5.0 V. Although featuring low power consumption, the active antenna still requires stable and clean power supplies. It is recommended to use high-performance LDO as the power supply. A reference design of the GNSS active antenna is shown below. Figure 32: Reference Circuit Design for GNSS Active Antenna NOTE When using external active antennas or external LNA circuits, we recommend reserving type attenuation networks (R3, R4, R5) to improve GNSS reception performance. 5.2.2.3. GNSS RF Design Guidelines Improper design of antenna and layout may cause reduced GNSS receiving sensitivity, longer GNSS positioning time, or reduced positioning accuracy. To avoid these, please follow the reference design rules as below:

Maximize the distance between the GNSS RF part and the GPRS RF part (including trace routing and antenna layout) to avoid mutual interference. SC690A_Series_Hardware_Design 79 / 105 Active Antenna3V3ModuleANT_GNSS56 nH10R1 F100 pFNMNMC4C1R1L1R20RC5C3C2100 pFR4R3R5 Smart Module Series In user systems, GNSS RF signal lines and RF components should be placed far away from high-

speed circuits, switched-mode power supplies, power inductors, the clock circuit of single-chip microcomputers, etc. For applications with a harsh electromagnetic environment or with high requirement on ESD protection, it is recommended to add ESD protection diodes for the antenna interface. Only diodes with ultra-low junction capacitance such as 0.5 pF can be selected. Otherwise, it will influence the impedance characteristic of RF circuit loop or cause attenuation of bypass RF signals. Control the impedance of either feeder line or PCB trace to 50 , and keep the trace length as short as possible. 5.3. Wi-Fi/Bluetooth The module provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth functions. The interface impedance is 50 . You can connect external antennas such as PCB antenna, sucker antenna and ceramic antenna to the module via these interfaces to achieve Wi-Fi and Bluetooth functions. Table 38: Pin Definition of Wi-Fi/Bluetooth Application Interfaces Pin Name Pin No. GPIO No. Default Status Comment ANT_WIFI/BT 129 AIO Wi-Fi/Bluetooth antenna interface 50 impedance Table 39: Wi-Fi/Bluetooth Frequency Type 802.11a/b/g/n/ac Bluetooth 5.1 Frequency 24022482 51805825 24022480 5.3.1. Wi-Fi Overview Unit MHz MHz The module supports 2.4 GHz/5 GHz double-band WLAN wireless communication based on IEEE 802.11a/b/g/n/ac standard protocols. The maximum data rate is up to 433 Mbps. The features are as below:

Support Wake-on-WLAN (WoWLAN) Support ad hoc mode Support WAPI SMS4 hardware encryption SC690A_Series_Hardware_Design 80 / 105 Smart Module Series Support AP mode Support Wi-Fi Direct Support MCS 0-7 for HT20 and HT40 Support MCS 0~8 for VHT20 Support MCS 0~9 for VHT40VHT80 The following table lists the Wi-Fi transmitting and receiving performance of the module. Table 40: Wi-Fi Transmitting Performance 2.4 GHz 5 GHz Standard 802.11b 802.11b 802.11g 802.11g 802.11n HT20 802.11n HT20 802.11n HT40 802.11n HT40 802.11a 802.11a 802.11n HT20 802.11n HT20 802.11n HT40 802.11n HT40 802.11ac VHT20 802.11ac VHT20 802.11ac VHT40 802.11ac VHT40 Rate 1 Mbps Output Power 16 dBm 2.5 dB 11 Mbps 16 dBm 2.5 dB 6 Mbps 16 dBm 2.5 dB 54 Mbps 14 dBm 2.5 dB MCS0 MCS7 MCS0 MCS7 15 dBm 2.5 dB 13 dBm 2.5 dB 14 dBm 2.5 dB 13 dBm 2.5 dB 6 Mbps 15 dBm 2.5 dB 54 Mbps 13 dBm 2.5 dB MCS0 MCS7 MCS0 MCS7 MCS0 MCS8 MCS0 MCS9 14 dBm 2.5 dB 12 dBm 2.5 dB 14 dBm 2.5 dB 12 dBm 2.5 dB 14 dBm 2.5 dB 13 dBm 2.5 dB 13 dBm 2.5 dB 12 dBm 2.5 dB SC690A_Series_Hardware_Design 81 / 105 Smart Module Series 802.11ac VHT80 802.11ac VHT80 MCS0 MCS9 13 dBm 2.5 dB 12 dBm 2.5 dB Table 41: Wi-Fi Receiving Performance 2.4 GHz 5 GHz Standard 802.11b 802.11b 802.11g 802.11g 802.11n HT20 802.11n HT20 802.11n HT40 802.11n HT40 802.11a 802.11a 802.11n HT20 802.11n HT20 802.11n HT40 802.11n HT40 802.11ac VHT20 802.11ac VHT20 802.11ac VHT40 802.11ac VHT40 802.11ac VHT80 802.11ac VHT80 Rate 1 Mbps 11 Mbps 6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 MCS0 MCS8 MCS0 MCS9 MCS0 MCS9 Sensitivity

-96

-88

-90

-74

-90

-71

-89

-70

-88

-73

-88

-68

-86

-67

-89 dBm

-67 dBm

-87 dBm

-62 dBm

-83 dBm

-58 dBm SC690A_Series_Hardware_Design 82 / 105 Smart Module Series

. NOTE The product conforms to the IEEE specifications. 5.3.2. Bluetooth Overview The module supports Bluetooth 5.1 (BR/EDR+BLE) specification, as well as GFSK, 8-DPSK, /4-

DQPSK modulation modes. Maximally support up to 7 wireless connections. Maximally support up to 3.5 PICONETs at the same time. Support one SCO (Synchronous Connection Oriented) or eSCO connection. The BR/EDR channel bandwidth is 1 MHz, and can accommodate 79 channels. The BLE channel bandwidth is 2 MHz, and can accommodate 40 channels. Table 42: Bluetooth Data Rate and Version Version Data rate Maximum Application Throughput 1.2 1 Mbit/s

> 80 Kbit/s 2.0+EDR 3 Mbit/s

> 80 Kbit/s 3.0+HS 24 Mbit/s Reference 3.0 + HS 4.0 5.0 5.1 24 Mbit/s Reference 4.0 LE 48 Mbit/s Reference 5.0 LE TBD TBD Referenced specifications are listed below:

Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1+ EDR/3.0/3.0 + HS, August 6, 2009 Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009 Bluetooth 5.0 RF-PHY Cover Standard: RF-PHY.TS.5.0.0, December 06, 2016 The following table lists the Bluetooth transmitting and receiving performance of the module. SC690A_Series_Hardware_Design 83 / 105 Smart Module Series Table 43: Bluetooth Transmitting and Receiving Performance Transmitter Performance Packet Types DH5 2-DH5 3-DH5 Transmitting Power 7 2.5 dBm 6 2.5 dBm 6 2.5 dBm Receiver Performance Packet Types DH5 Receiving Sensitivity

-91 dBm 5.3.3. Reference Design 2-DH5

-91 dBm 3-DH5

-85 dBm A reference circuit design for Wi-Fi/Bluetooth antenna interface is shown as below. C1 and C2 are not mounted and a 0 resistor is mounted on R1 by default. Figure 33: Reference Circuit Design for Wi-Fi/Bluetooth Antenna 5.4. Reference Design of RF Routing For users PCB, the characteristic impedance of all RF traces should be controlled as 50 . The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the distance between signal layer and reference ground (H), and the clearance between RF trace and ground (S). Microstrip line or coplanar waveguide line is typically used in RF layout for characteristic impedance control. The following are reference designs of microstrip line or coplanar waveguide line with different PCB structures.. SC690A_Series_Hardware_Design 84 / 105 ANT_WIFI/BTR1 0RC1ModuleNMC2NMWi-Fi/Bluetooth antenna Smart Module Series Figure 34: Microstrip Design on a 2-layer PCB Figure 35: Coplanar Waveguide Design on a 2-layer PCB Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) SC690A_Series_Hardware_Design 85 / 105 Smart Module Series Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . Design the GND pins adjacent to RF pins as thermal relief pads, and fully connect them to ground. Keep the distance between the RF pins and the RF connector as short as possible. Change all the right-angle traces to curved ones and the recommended trace angle is 135. Reserve clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, ground vias around RF traces and the reference ground improves RF performance. The distance between the ground vias and RF traces should be more than two times the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers For more details about RF layout, see document [3]. 5.5. Requirements for Antenna Design Table 44: Requirements for Antenna Design Antenna Type Requirements GNSS Frequency range: 15591609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0 dBi Active antenna noise figure: < 1.5 dB Active antenna gain: > -2 dBi SC690A_Series_Hardware_Design 86 / 105 Smart Module Series Active antenna embedded LNA gain: 17 dB VSWR: 2 Efficiency: > 30 %

Gain: 1 dBi Max input power: 50 W Input impedance: 50 Polarization: Vertical Cable insertion loss:

< 1 dB: LB (<1 GHz)

< 1.5 dB: MB (12.3 GHz)

< 2 dB: HB (> 2.3 GHz) VSWR: 2 Gain: 1 dBi Max Input Power: 50 W Input Impedance: 50 Polarization Type: Vertical Cable Insertion Loss: < 1 dB GSM/EVDO/CDMA/UMTS/TD-SCDMA/LTE Wi-Fi/Bluetooth NOTE It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 5.6. RF Connector Recommendation If you use RF connector for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by HIROSE. SC690A_Series_Hardware_Design 87 / 105 Smart Module Series Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 39: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. SC690A_Series_Hardware_Design 88 / 105 Smart Module Series Figure 40: Space Factor of Mated Connector (Unit: mm) For more details, visit http://www.hirose.com. SC690A_Series_Hardware_Design 89 / 105 Smart Module Series 6 Electrical Characteristics &

Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 45: Absolute Maximum Ratings Parameter VBAT USB_VBUS Min.

-0.3

-0.3 Peak Current of VBAT

Max. 4.75 16 3 Voltage on Digital Pins

-0.3 2.09 Unit V V A V SC690A_Series_Hardware_Design 90 / 105 Smart Module Series 6.2. Power Supply Ratings Table 46: The Modules Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT VBAT_BB USB_VBUS USB connection detection The actual input voltages must stay between the minimum and maximum values. 3.55 3.8 4.4 V 3.6

10 V 6.3. Power Consumption Table 47: SC690A-NA Power Consumption Description Conditions OFF state Power down LTE-FDD supply current Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 Typ. 90 TBD TBD TBD TBD LTE-FDD B2 @ max power TBD LTE-FDD B4 @ max power TBD LTE-FDD B5 @ max power TBD LTE data transfer LTE-FDD B7 @ max power TBD LTE-FDD B12 @ max power TBD LTE-FDD B13 @ max power TBD LTE-FDD B14 @ max power TBD Unit A mA mA mA mA mA mA mA mA mA mA mA SC690A_Series_Hardware_Design 91 / 105 Smart Module Series LTE-FDD B17 @ max power TBD LTE-FDD B25 @ max power TBD LTE-FDD B26 @ max power TBD LTE-FDD B66 @ max power TBD mA mA mA mA Table 48: SC690A-EM Power Consumption Description Conditions Typ. Unit OFF state Power down WCDMA data transfer

(GNSS OFF) LTE-FDD supply current Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 Sleep (USB disconnected)

@ DRX = 9 Sleep (USB disconnected)

@ DRX = 5 Sleep (USB disconnected)

@ DRX = 6 Sleep (USB disconnected)

@ DRX = 7 Sleep (USB disconnected)

@ DRX = 8 79 TBD TBD TBD TBD TBD TBD TBD TBD LTE-FDD B1 @ max power TBD LTE-FDD B3 @ max power TBD LTE data transfer LTE-FDD B7 @ max power TBD LTE-FDD B8 @ max power TBD LTE-FDD B20 @ max power TBD B1 (HSDPA) @ max power TBD WCDMA data transfer B3 (HSDPA) @ max power TBD B8 (HSDPA) @ max power TBD A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA SC690A_Series_Hardware_Design 92 / 105 Smart Module Series B1 (HSUPA) @ max power TBD B3 (HSUPA) @ max power TBD B8 (HSUPA) @ max power TBD mA mA mA VIH VIL VOH VOL VIH VIL VOH VOL Min. 1.17

-0.3 Min. 1.7 1.26

-0.3 6.4. Digital I/O Characteristic Table 49: 1.8 V I/O Requirements Parameter Description Input high voltage Input low voltage Output high voltage 1.35 Output low voltage 0 Table 50: (U)SIM 1.8 V I/O Requirements Parameter Description USIM_VDD Power supply Input high voltage Input low voltage Output high voltage 1.44 Output low voltage 0 Table 51: (U)SIM 2.95 V I/O Requirements Parameter Description USIM_VDD Power supply Min. 2.7 VIH Input high voltage 2.065 Max. Unit 2.1 0.63 1.8 0.45 V V V V Max. Unit 1.9 2.1 0.36 1.8 0.4 Max. 3.1 3.25 V V V V V Unit V V SC690A_Series_Hardware_Design 93 / 105 Smart Module Series VIL VOH VOL Input low voltage

-0.3 Output high voltage 2.36 Output low voltage 0 0.59 2.95 0.4 V V V 6.5. ESD If the static electricity generated by various ways discharges to the module, the module maybe damaged to a certain extent. Thus, please take proper ESD countermeasures and handling methods. For example, wearing anti-static gloves during the development, production, assembly and testing of the module;

adding ESD protective component to the ESD sensitive interfaces and points in the product design of the module. Table 52: Electrostatics Discharge Characteristics (25 C, 45 % Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND 5 All Antenna Interfaces 5 Other Interfaces 0.25 10 10

kV kV kV 6.6. Operating and Storage Temperatures Table 53: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit Operating Temperature Range 2 Storage temperature range

-35

-40

+25

+75

+90 C C 2 Within operating temperature range, the module is 3GPP compliant. SC690A_Series_Hardware_Design 94 / 105 Smart Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 41: Module Top and Side Dimensions (Unit: mm) SC690A_Series_Hardware_Design 95 / 105 Smart Module Series Pin 1 Figure 42: Module Bottom Dimensions (TOP View, Unit: mm) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. SC690A_Series_Hardware_Design 96 / 105 Smart Module Series 7.2. Recommended Footprint Figure 43: Recommended Footprint (TOP View)

. NOTE 1. Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. 2. To keep the reliability of the mounting and soldering, keep the motherboard thickness as at least 1.2 mm. SC690A_Series_Hardware_Design 97 / 105 Smart Module Series 7.3. Top and Bottom Views Figure 44: Top & Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. SC690A_Series_Hardware_Design 98 / 105 Smart Module Series 8 Storage, Manufacturing & Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 5 C and the relative humidity should be 3560 %. 2. The storage life (in vacuum-sealed packaging) is 12 months in recommended storage condition. 3. The floor life of the module is 168 hours 4 in a plant where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g. a drying cabinet). 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in recommended storage condition;

Violation of the third requirement above occurs;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 8 hours at 120 5 C;

All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be put in a dry environment such as in a drying oven. 4 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not ready for soldering. SC690A_Series_Hardware_Design 99 / 105 Smart Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules. 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.180.20mm. For more details, see document [4]. The peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 45: Recommended Reflow Soldering Thermal Profile SC690A_Series_Hardware_Design 100 / 105 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Max slope: 1~3 C/s Cooling down slope: -1.5 ~ -3 C/s Max slope: 2~3 C/s Smart Module Series Table 54: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 13 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone Max slope Reflow time (D: over 217 C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTE 23 C/s 4070 s 235246 C

-1.5 to -3 C/s 1 1. If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [4]. SC690A_Series_Hardware_Design 101 / 105 Smart Module Series 8.3. Packaging Specifications The module adopts carrier tape packaging and details are as follow:

8.3.1. Carrier Tape Dimension details are as follow:

Figure 46: Carrier Tape Dimension Drawing Table 55: Carrier Tape Dimension Table (Unit: mm) W 72 P 56 T A0 B0 0.35 44.5 43.5 K0 4.1 K1 5.4 F E 34.2 1.75 8.3.2. Plastic Reel Figure 47: Plastic Reel Dimension Drawing SC690A_Series_Hardware_Design 102 / 105 Smart Module Series Table 56: Plastic Reel Dimension Table (Unit: mm) D1 380 D2 180 W 72.5 8.3.3. Packaging Process Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, then vacuumize it. Place the module into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. One plastic reel can load 200 modules. Place the vacuum-packed plastic reel into a pizza box. Put 4 pizza boxes into 1 carton and seal it. One carton can pack 800 modules. Figure 48: Packaging Process SC690A_Series_Hardware_Design 103 / 105 Smart Module Series 9 Appendix References Table 57: Related Documents Document Name

[1] Quectel_Smart_EVB-G2_User_Guide

[2] Quectel_SC690A_Series_GPIO_Configuration

[3] Quectel_RF_Layout_Application_Note

[4] Quectel_Module_Secondary_SMT_ User_Guide

[5] Quectel_SC690A_Series_Reference_Design Table 58: Terms and Abbreviations Abbreviation Description ADC Analog-to-Digital Converter AMR-WB Adaptive Multi-Rate Wideband AON AP bps BPSK BW CA CHAP CS CSD Active Optical Network Application Processor Bits Per Second Binary Phase Shift Keying Bandwidth Carrier Aggregation Challenge Handshake Authentication Protocol Coding Scheme Circuit Switched Data SC690A_Series_Hardware_Design 104 / 105 Smart Module Series CS2 CTS DAI DCE Commercial Sample II Clear To Send Digital Audio Interface Data Communications Equipment DC-HSDPA Dual-carrier High Speed Downlink Packet Access DDR DFOTA DL DRX DRX DTE DTR EFR ESD FDD FEM FR Double Data Rate Delta Firmware Upgrade Over The Air Downlink Discontinuous Reception Diversity Receive Data Terminal Equipment Data Terminal Ready Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Front-End Module Full Rate GLONASS Global Navigation Satellite System (Russia) GMSK GNSS GPS GRFC HB HPUE HR Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System General RF Control High Band High Power User Equipment Half Rate SC690A_Series_Hardware_Design 105 / 105 Smart Module Series HSDPA HSPA HSUPA IC I2C I2S I/O High Speed Downlink Packet Access High Speed Packet Access High Speed Uplink Packet Access Integrated Circuit Inter-Integrated Circuit Inter-IC Sound Input/Output Inorm Normal Current LAA LB LED LGA License Assisted Access Low Band Light Emitting Diode Land Grid Array LMHB Low/Middle/High Band LNA LTE MAC MB MCU MDC MDIO MHB MIMO MO MS MT Low Noise Amplifier Long Term Evolution Media Access Control Middle Band Microcontroller Unit Management Data Clock Management Data Input/Output Middle/High Band Multiple Input Multiple Output Mobile Originated Mobile Station Mobile Terminated SC690A_Series_Hardware_Design 106 / 105 Smart Module Series NR NSA PA PAP PC PCB PCIe PCM PDA PDU PHY PMIC PRX QAM QPSK QZSS RI RF RGMII RHCP Rx SA SCS SD SIMO New Radio Non-Stand Alone Power Amplifier Password Authentication Protocol Personal Computer Printed Circuit Board Peripheral Component Interconnect Express Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Physical Layer Power Management Integrated Circuit Primary Receive Quadrature Amplitude Modulation Quadrature Phase Shift Keying Quasi-Zenith Satellite System Ring Indicator Radio Frequency Reduced Gigabit Media Independent Interface Right Hand Circularly Polarized Receive Stand Alone Sub-Carrier Space Secure Digital Single Input Multiple Output SC690A_Series_Hardware_Design 107 / 105 Smart Module Series SMD SMS SoC STB Surface Mount Device Short Message Service System on a Chip Set Top Box TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access TRX Tx UART UHB UL UMTS URC USB Transmit & Receive Transmit Universal Asynchronous Receiver/Transmitter Ultra High Band Uplink Universal Mobile Telecommunications System Unsolicited Result Code Universal Serial Bus

(U)SIM Universal Subscriber Identity Module VBAT Vmax Vnom Vmin VIHmax VIHmin VILmax VILmin VImax VImin Voltage at Battery (Pin) Maximum Voltage Nominal Voltage Minimum Voltage Maximum High-level Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Minimum Low-level Input Voltage Absolute Maximum Input Voltage Absolute Minimum Input Voltage SC690A_Series_Hardware_Design 108 / 105 Smart Module Series VOHmax VOHmin VOLmax VOLmin VSWR Maximum High-level Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Minimum Low-level Output Voltage Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WLAN WWAN Wireless Local Area Network Wireless Wide Area Network SC690A_Series_Hardware_Design 109 / 105

QUECCTEL nigga trots Q1-A9270 SC6S80ANAPA-E61 -UGADA Cc. FCC ID:XMR2022SC690ANA IC :10224A-22SC690ANA el SN:MP34567890XXXxX IMEI1:8672690590XXXXX IMEI2:86726905900XxX Label Location

Quectel Wireless Solutions Co., Ltd. Federal Communications Commission Authorization and Evaluation Division Confidentiality Request regarding application for certification of FCC ID: XMR2022SC690ANA. Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:

Exhibit Type

(1. Block Diagram.pdf; 2.SCH.pdf; 3. Operation Description.pdf; 4.BOM.pdf; 5. Tune up.pdf;) File Name

(Block Diagram, SCH, Operation Description, BOM, Tune Up Procedure) The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Section 0.457 of the Rules, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. We are requesting the commission to grant short-term confidentiality request on the following attachment(s) for 45 days after the grant as outlined in Public Notice DA 04-1705. Exhibit Type

(External Photos, Internal Photos, Test Setup Photos, Manual) File Name

(Appendix A.4-External Photos.pdf; Appendix A.5-Internal Photos.pdf; Appendix A.2 -

DSS_DTS_NII Setup Photos; Appendix A.3 -

PCB Setup Photos; Manual;) Sincerely, Name: Jean Hu Title: Certification Manager Rev 11/20/07

FCC FEDERAL COMMUNICATIONS COMMISSION Suppliers Declaration of Conformity (SDoC) Trademark(s) and Model(s): Quectel / SC690A-NA Equipment: Multi-mode Smart LTE Module Manufacturer: Quectel Wireless Solutions Co., Ltd. FCC ID in case other parts of this equipment are subject to certification:

XMR2022SC690ANA This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1)

(2) this device may not cause harmful interference, and this device must accept any interference received, including interference that may cause undesired operation. The following test reports are subject to this declaration:

Test report number:

SEWA2204000011RG06 Issue date:

2022-9-5 The following manufacturer/importer/entity (located in the USA) is responsible for this declaration:

Date:

City:

Name:

Email:

2022/9/22.. Shanghai .. Jean hu .. jean.hu@quectel.com. Signature:

RF_734_02 04 April 16 Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) FCC ID: XMR2022SC690ANA Items to be covered by Single modular transmitters. 1. The modular transmitter must have its own RF shielding. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. Answer from applicant Yes, please see exhibition external photos Yes, the modular has buffer modulation /data inputs 3. The modular transmitter must have its own power supply regulation. Yes, please see the SCH.pdf 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. Yes, the requirements of antenna connector and spurious emission have been fulfilled. Please refer to the test report exhibition. Yes, please refer to the setup photo exhibition for the stand-alone configuration Yes, the module will be label with its own FCC ID, and the instruction on the labelling rule of the end product has been stated in the user manual of this module. Please refer to the label and user manual exhibition. Yes, the required FCC rule has been fulfilled and all the instruction for maintaining compliance have been clearly stated in the user manual. Yes, please refer exhibition RF exposure for the compliance of MPE RF exposure rule. Note: A limited modular approval (LMA) may be granted for single modular transmitters that comply partially with the requirements above. RF_734_02 04 April 16 Name and surname of applicant (or authorized representative):

Signature:

Date:

2022/9/22.. City:

Name:

Email:

Shanghai .. Jean hu .. jean.hu@quectel.com. Signature:

RF_160, Issue 04 Quectel Wireless Solutions Co., Ltd. Declaration of Authorization We Name:

Address:

Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China, 200233 City:

Country:

Shanghai China Declare that:

Name Representative of agent: Well Wei Agent Company name:

Address:

Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone City:

Country Suzhou China SGS-CSTC Standards Technical Services (Suzhou) Co., Ltd South of No. 6 Plant, No. 1, Runsheng Road, Suzhou Industrial is authorized to apply for Certification of the following product(s):

Product description: Multi-mode Smart LTE Module Type designation: SC690A-NA Trademark:

Quectel on our behalf. Date:

City:

Name:

Email:

2022/9/22.. Shanghai .. Jean hu .. (2) jean.hu@quectel.com. Signature:

. Notes:

(1): Required for FCC application

(2): For FCC it must be the Grantee Code owner or the authorized agent.