FCC ID: XMR201808BC66 NB-IoT Module

BC66 Hardware Design NB-IoT Module Series Rev. BC66_Hardware_Design_V1.1 Date: 2018-11-14 Status: Released www.quectel.com NB-IoT Module Series BC66 Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd. 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright Quectel Wireless Solutions Co., Ltd. 2018. All rights reserved. BC66_Hardware_Design 1 / 57 NB-IoT Module Series BC66 Hardware Design About the Document History Revision Date Author Description 1.0 1.1 2018-08-24 Speed SUN/

Newgate HUA Initial 2018-11-14 Newgate HUA Updated supported bands and involved RF parameters of BC66. BC66_Hardware_Design 2 / 57 NB-IoT Module Series BC66 Hardware Design Contents About the Document ................................................................................................................................ 2 Contents .................................................................................................................................................... 3 Table Index ............................................................................................................................................... 5 Figure Index .............................................................................................................................................. 6 1 Introduction ....................................................................................................................................... 7 1.1. Safety Information .................................................................................................................... 8 2 Product Concept ............................................................................................................................... 9 2.1. General Description .................................................................................................................. 9 2.2. Key Features .......................................................................................................................... 10 2.3. Functional Diagram .................................................................................................................11 2.4. Development Board ................................................................................................................ 12 3 Application Interfaces ..................................................................................................................... 13 3.1. General Description ................................................................................................................ 13 3.2. Pin Assignment ....................................................................................................................... 14 3.3. Pin Description ....................................................................................................................... 15 3.4. Operating Modes .................................................................................................................... 18 3.5. Power Saving Mode (PSM) .................................................................................................... 19 3.6. Power Supply ......................................................................................................................... 20 3.6.1. Power Supply Pins ....................................................................................................... 20 3.6.2. Reference Design for Power Supply ............................................................................ 21 3.7. Power up/Power down Scenarios ........................................................................................... 21 3.7.1. Turn on ........................................................................................................................ 21 3.7.2. Turn off ........................................................................................................................ 23 3.7.3. Reset the Module ......................................................................................................... 24 3.8. UART Interfaces ..................................................................................................................... 25 3.8.1. Main UART Port ........................................................................................................... 26 3.8.2. Debug UART Port ........................................................................................................ 26 3.8.3. Auxiliary UART Port ..................................................................................................... 27 3.8.4. UART Application ......................................................................................................... 27 3.9. SPI Interface ........................................................................................................................... 29 3.10. USIM Interface ....................................................................................................................... 30 3.11. ADC Interface ......................................................................................................................... 32 3.12. RI Behaviors* ......................................................................................................................... 32 3.13. Network Status Indication* ...................................................................................................... 32 4 Antenna Interface ............................................................................................................................ 34 4.1. Pin Definition .......................................................................................................................... 34 4.2. Operating Frequencies ........................................................................................................... 34 4.3. RF Antenna Reference Design ............................................................................................... 35 4.4. Reference Design of RF Layout ............................................................................................. 36 BC66_Hardware_Design 3 / 57 NB-IoT Module Series BC66 Hardware Design 4.5. Antenna Requirements ........................................................................................................... 38 4.6. RF Output Power .................................................................................................................... 39 4.7. RF Receiving Sensitivity ......................................................................................................... 40 4.8. Recommended RF Connector for Antenna Installation ........................................................... 41 5 Electrical and Reliability Characteristics ...................................................................................... 43 5.1. Operation and Storage Temperatures ..................................................................................... 43 5.2. Current Consumption ............................................................................................................. 43 5.3. Electrostatic Discharge ........................................................................................................... 45 6 Mechanical Dimensions.................................................................................................................. 47 6.1. Mechanical Dimensions of the Module ................................................................................... 47 6.2. Recommended Footprint ........................................................................................................ 49 6.3. Top and Bottom Views of the Module ..................................................................................... 50 7 Storage, Manufacturing and Packaging ........................................................................................ 51 7.1. Storage ................................................................................................................................... 51 7.2. Manufacturing and Soldering .................................................................................................. 52 7.3. Packaging ............................................................................................................................... 53 7.3.1. Tape and Reel Packaging ............................................................................................ 53 8 Appendix A References .................................................................................................................. 55 BC66_Hardware_Design 4 / 57 NB-IoT Module Series BC66 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF BC66 MODULE ........................................................................................ 9 TABLE 2: BC66 KEY FEATURES ..................................................................................................................... 10 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 15 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 15 TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 18 TABLE 6: POWER SUPPLY PINS ..................................................................................................................... 20 TABLE 7: PWRKEY PIN .................................................................................................................................... 21 TABLE 8: RESET PIN ........................................................................................................................................ 24 TABLE 9: PIN DEFINITION OF UART INTERFACES ....................................................................................... 25 TABLE 10: PIN DEFINITION OF SPI INTERFACE ........................................................................................... 30 TABLE 11: PIN DEFINITION OF USIM INTERFACE ........................................................................................ 31 TABLE 12: PIN DEFINITION OF ADC INTERFACE ......................................................................................... 32 TABLE 13: PIN DEFINITION OF NB-IOT ANTENNA INTERFACE ................................................................... 34 TABLE 14: MODULE OPERATING FREQUENCIES ........................................................................................ 34 TABLE 15: ANTENNA CABLE INSERTION LOSS REQUIREMENTS ............................................................. 38 TABLE 16: REQUIRED ANTENNA PARAMETERS .......................................................................................... 38 TABLE 17: RF CONDUCTED OUTPUT POWER ............................................................................................. 39 TABLE 18: RECEIVING SENSITIVITY (WITH RF RETRANSMISSIONS) ....................................................... 40 TABLE 19: OPERATION AND STORAGE TEMPERATURES .......................................................................... 43 TABLE 20: MODULE CURRENT CONSUMPTION .......................................................................................... 44 TABLE 21: ELECTROSTATIC DISCHARGE CHARACTERISTICS (25C, 45% RELATIVE HUMIDITY) ........ 46 TABLE 22: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................... 52 TABLE 23: RELATED DOCUMENTS ................................................................................................................ 55 TABLE 24: TERMS AND ABBREVIATIONS ...................................................................................................... 55 BC66_Hardware_Design 5 / 57 NB-IoT Module Series BC66 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 12 FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 14 FIGURE 3: MODULE POWER CONSUMPTION IN DIFFERENT MODES ...................................................... 19 FIGURE 4: TIMING OF WAKING UP MODULE FROM PSM ........................................................................... 20 FIGURE 5: REFERENCE CIRCUIT FOR POWER SUPPLY ............................................................................ 21 FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................... 22 FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 22 FIGURE 8: POWER UP TIMING ....................................................................................................................... 22 FIGURE 9: POWER DOWN TIMING (POWER OFF BY AT COMMAND) ........................................................ 23 FIGURE 10: POWER DOWN TIMING (POWER OFF BY DISCONNECTING VBAT) ...................................... 23 FIGURE 11: REFERENCE CIRCUIT OF RESET BY USING DRIVING CIRCUIT ........................................... 24 FIGURE 12: REFERENCE CIRCUIT OF RESET BY USING BUTTON ........................................................... 24 FIGURE 13: RESET TIMING ............................................................................................................................. 25 FIGURE 14: REFERENCE DESIGN FOR MAIN UART PORT ........................................................................ 26 FIGURE 15: REFERENCE DESIGN OF DEBUG UART PORT ....................................................................... 27 FIGURE 16: REFERENCE DESIGN OF AUXILIARY UART PORT .................................................................. 27 FIGURE 17: REFERENCE CIRCUIT WITH VOLTAGE LEVEL TRANSLATOR CHIP ...................................... 28 FIGURE 18: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 28 FIGURE 19: SKETCH MAP FOR RS-232 INTERFACE MATCH ...................................................................... 29 FIGURE 20: SPI INTERFACE REFERENCE CIRCUIT WITH TRANSLATOR CHIP ....................................... 30 FIGURE 21: REFERENCE CIRCUIT FOR USIM INTERFACE WITH A 6-PIN USIM CARD CONNECTOR ... 31 FIGURE 22: REFERENCE DESIGN FOR NETLIGHT ..................................................................................... 33 FIGURE 23: REFERENCE DESIGN OF NB-IOT ANTENNA INTERFACE ...................................................... 36 FIGURE 24: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 36 FIGURE 25: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 37 FIGURE 26: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND) .................................................................................................................................................. 37 FIGURE 27: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND) .................................................................................................................................................. 37 FIGURE 28: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 41 FIGURE 29: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 41 FIGURE 30: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 42 FIGURE 31: TOP VIEW OF THE MODULE ...................................................................................................... 50 FIGURE 32: BOTTOM VIEW OF THE MODULE .............................................................................................. 50 FIGURE 33: TAPE DIMENSIONS (UNIT: MM) .................................................................................................. 54 FIGURE 34: REEL DIMENSIONS (UNIT: MM) ................................................................................................. 54 BC66_Hardware_Design 6 / 57 NB-IoT Module Series BC66 Hardware Design 1 Introduction This document defines the BC66 module and describes its air interface and hardware interface which are connected with the customers applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, customers can use BC66 to design and set up mobile applications easily. BC66_Hardware_Design 7 / 57 NB-IoT Module Series BC66 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating BC66 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. BC66_Hardware_Design 8 / 57 NB-IoT Module Series BC66 Hardware Design 2 Product Concept 2.1. General Description BC66 is a high-performance NB-IoT module with extremely low power consumption. It is designed to communicate with infrastructures of mobile network operators through NB-IoT radio protocols (3GPP Rel.13 and 3GPP Rel.14*). BC66 supports a broad range of frequency bands as listed below. Table 1: Frequency Bands of BC66 Module Mode H-FDD BC66 B1/B2/B3/B4/B5/B8/B12/B13/B17/B18/B19/B20/B25/B26*/B28/B66 BC66 is an SMD type module with LCC package, and has an ultra-compact profile of 17.7mm 15.8mm 2.0mm. These make it can be easily embedded into size-constrained applications and provide reliable connectivity with the applications. BC66 provides abundant external interfaces (UART, SPI*, ADC*, NETLIGHT*, etc.) and protocol stacks

(UDP/TCP, LwM2M, MQTT, etc.), which provide great convenience for customers' applications. Due to compact form factor, ultra-low power consumption and extended temperature range, BC66 is a best choice for a wide range of IoT applications, such as smart metering, bike sharing, smart wearables, smart parking, smart city, home appliances, security and asset tracking, agricultural and environmental monitoring, etc. It is able to provide a complete range of SMS* and data transmission services to meet customers demands. The module fully complies with the RoHS directive of the European Union. NOTE

* means under development. BC66_Hardware_Design 9 / 57 NB-IoT Module Series BC66 Hardware Design 2.2. Key Features The following table describes the detailed features of BC66 module. Table 2: BC66 Key Features Feature Details Power Supply Power Saving Frequency bands Supply voltage: 2.1V ~ 3.63V Typical supply voltage: 3.3V Maximum power consumption: 5A Typical power consumption: 3.5A LTE Cat NB1:

B1/B2/B3/B4/B5/B8/B12/B13/B17/B18/B19/B20/B25/B26*/B28/B66 Transmitting Power 23dBm2dB USIM Interface Support 1.8V USIM card Main UART Port:

Used for AT command communication and data transmission. By default, the module is in auto-baud mode, and it supports automatic baud rates not exceeding 115200bps. When powering on the module, the MCU has to send AT command consecutively to synchronize baud rate with the module. When OK is returned, it indicates the baud rate has been synchronized successfully. When the module is woken up from PSM or idle mode, the baud rate synchronized during start-up will be used directly. Also can be used for firmware upgrade, and in such case, the baud rate is UART Interfaces 921600bps by default. Debug UART Port:

Used for firmware debugging Default baud rate: 115200bps Auxiliary UART Port:

Used for firmware debugging Default baud rate: 115200bps Network Protocols UDP/TCP/LwM2M/MQTT/CoAP*/PPP*/TLS*/DTLS*/HTTP*/HTTPS*

SMS*

Text/PDU Mode Data Transmission Features AT Commands Single-tone: 25.5kbps (DL)/16.7kbps (UL) Multi-tone: 25.5kbps (DL )/62.5kbps (UL) 3GPP TS 27.005/3GPP TS 27.007 AT commands (3GPP Rel. 13/Rel.14*) and Quectel Enhanced AT commands Firmware Update Upgrade firmware via main UART port or DFOTA BC66_Hardware_Design 10 / 57 NB-IoT Module Series BC66 Hardware Design Real Time Clock Supported Physical Characteristics Temperature Range Size: (17.70.15)mm (15.80.15)mm (2.00.2)mm Weight: 1.2g0.2g Operation temperature range: -35C ~ +75C 1) Extended temperature range: -40C ~ +85C 2) Storage temperature range: -40C ~ +90C Antenna Interface 50 impedance control All hardware components are fully compliant with EU RoHS directive RoHS NOTES 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain an SMS*, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again.

"*" means under development. 1. 2. 3. 2.3. Functional Diagram The following figure shows a block diagram of BC66 and illustrates the major functional parts. Radio frequency Baseband Power management Peripheral interfaces BC66_Hardware_Design 11 / 57 NB-IoT Module Series BC66 Hardware Design Figure 1: Functional Diagram NOTE

* means under development. 2.4. Development Board Quectel provides a complete set of development tools to facilitate the use and testing of BC66 module. The development tool kit includes the TE-B board, USB cable, antenna and other peripherals. For more details, please refer to document [1]. BC66_Hardware_Design 12 / 57 NB-IoT Module Series BC66 Hardware Design 3 Application Interfaces 3.1. General Description BC66 is equipped with a total of 58 pins, including 44 LCC pins and 14 LGA pins. The subsequent chapters will provide detailed descriptions of the following functions/pins/interfaces:

PSM Power Supply RESET PWRKEY UART Interfaces SPI Interface USIM Interface ADC Interface Network Status Indication*

Antenna Interface NOTE

* means under development. BC66_Hardware_Design 13 / 57 NB-IoT Module Series BC66 Hardware Design 3.2. Pin Assignment Figure 2: Pin Assignment NOTES 1. Keep all reserved pins unconnected. 2.

* means under development. BC66_Hardware_Design 14 / 57 NB-IoT Module Series BC66 Hardware Design 3.3. Pin Description Table 3: I/O Parameters Definition Type IO DI DO PI PO AI AO Description Bidirectional Digital input Digital output Power input Power output Analog input Analog output Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 42 VBAT_RF 43 PI PI Power supply for the modules baseband part Power supply for the modules RF part Vmax=3.63V Vmin=2.1V Vnorm=3.3V Vmax=3.63V Vmin=2.1V Vnorm=3.3V VDD_ EXT 24 PO 1.8V output power supply Vnorm=1.8V No voltage output in PSM mode. It is intended to supply power for the modules pull-up circuits, and is thus not recommended to be used as the power supply for external circuits. GND 1, 27, 34, 36, 37, 40, 41 GND BC66_Hardware_Design 15 / 57 NB-IoT Module Series BC66 Hardware Design Power Key Interface Pin Name Pin No. I/O Description DC Characteristics Comment PWRKEY 7 DI Reset Interface Pull down PWRKEY to turn on the module VILmax=0.3*VBAT VIHmin=0.7*VBAT Pin Name Pin No. I/O Description DC Characteristics Comment RESET 15 DI Reset the module Active low. PSM_EINT Interface Pin Name Pin No. I/O Description DC Characteristics Comment Dedicated external interrupt pin. Used to wake up the module from PSM. PSM_EINT 19 DI Network Status Indication Pin Name Pin No. I/O Description DC Characteristics Comment NETLIGHT* 16 ADC Interface DO Network status indication Pin Name Pin No. I/O Description DC Characteristics Comment ADC0*

9 AI Main UART Port General purpose analog to digital converter interface Voltage range:

0V~1.4V Pin Name Pin No. I/O Description DC Characteristics Comment RXD TXD 18 17 DI Receive data DO Transmit data Auxiliary UART Port 1.8V power domain. BC66_Hardware_Design 16 / 57 NB-IoT Module Series BC66 Hardware Design Pin Name Pin No. I/O Description DC Characteristics Comment RXD_AUX TXD_AUX 28 29 Debug UART Port DI Receive data DO Transmit data 1.8V power domain. Pin Name Pin No. I/O Description DC Characteristics Comment RXD_DBG TXD_DBG 38 39 Ringing Signal DI Receive data DO Transmit data 1.8V power domain. Pin Name Pin No. I/O Description DC Characteristics Comment RI*

20 DO Ring indicator 1.8V power domain. USIM Interface Pin Name Pin No. I/O Description DC Characteristics Comment SIM_VDD 14 SIM_RST 12 DO DO SIM_DATA 11 IO SIM_CLK 13 DO SIM_GND 10 GND Antenna Interface USIM card power supply USIM card reset signal USIM card data signal USIM card clock signal Specified ground for USIM card Vnorm=1.8V VOLmax=0.15SIM_VDD VOHmin=0.85SIM_VDD VILmax=0.25SIM_VDD VIHmin=0.75SIM_VDD VOLmax=0.15SIM_VDD VOHmin=0.85SIM_VDD VOLmax=0.15SIM_VDD VOHmin=0.85SIM_VDD Pin Name Pin No. I/O Description DC Characteristics Comment RF_ANT 35 SPI Interface IO RF antenna interface 50 characteristic impedance Pin Name Pin No. I/O Description DC Characteristics Comment BC66_Hardware_Design 17 / 57 NB-IoT Module Series BC66 Hardware Design SPI_MISO*

3 SPI_MOSI*

4 SPI_SCLK*

5 SPI_CS*

6 Reserved Pins DI DO DO DO Master input slave output of SPI interface Master output slave input of SPI interface Serial clock signal of SPI interface Chip select of SPI interface 1.8V power domain. Pin Name Pin No. I/O Description DC Characteristics Comment Keep these pins unconnected. 2, 8, 21~23, 25~26, 30~33, 44~58 RESERVED NOTES 1. Keep all unused pins unconnected. 2.

* means under development. 3.4. Operating Modes The following table briefly describes the three operating modes of the module. Table 5: Overview of Operating Modes Mode Function Normal Operation Active Idle In active mode, all functions of the module are available and all processors are active; radio transmission and reception can be performed. Transitions to idle mode or PSM can be initiated in active mode. In idle mode, the module is in light sleep and network connection is maintained in DRX/eDRX state; paging messages can be received. Transitions to active mode or PSM can be initiated in idle mode. BC66_Hardware_Design 18 / 57 NB-IoT Module Series BC66 Hardware Design PSM In PSM, only the 32kHz RTC is working, and the network is disconnected. The module will exit from PSM and enter into active mode when the timer T3412 times out, and it can also be woken up from PSM by PSM_EINT. For more details, please refer to Chapter 3.5. 3.5. Power Saving Mode (PSM) Based on system performance, the module consumes an ultra-low current (maximally 5A power consumption) in PSM. PSM is designed to reduce power consumption of the module and improve battery life. The following figure shows the power consumption of the module in different modes. Figure 3: Module Power Consumption in Different Modes The procedure for entering PSM is as follows: the module requests to enter PSM in ATTACH REQUEST message during attach/TAU (Tracking Area Update) procedure. Then the network accepts the request and provides an active time value (T3324) to the module and the mobile reachable timer starts. When the T3324 timer expires, the module enters PSM for duration of T3412 (periodic TAU timer). Please note that the module cannot request PSM when it is establishing an emergency attachment or initializing the PDN

(Public Data Network) connection. When the module is in PSM, it cannot be paged and stops access stratum activities such as cell reselection, but T3412 is still active. Either of the following methods can make the module exit from PSM:

After the T3412 timer expires, the module will exit PSM automatically. Pulling down PSM_EINT (falling edge) will wake the module up from PSM. The timing of waking up the module from PSM is illustrated below. BC66_Hardware_Design 19 / 57 NB-IoT Module Series BC66 Hardware Design Figure 4: Timing of Waking up Module from PSM NOTE Among all GPIO interrupts, only the dedicated external interrupt pin PSM_EINT can successfully wake up the module from PSM. The module cannot be woken up by any other general purpose GPIO interrupts. 3.6. Power Supply 3.6.1. Power Supply Pins BC66 provides two VBAT pins for connection with an external power supply. The table below describes the module's VBAT and ground pins. Table 6: Power Supply Pins Pin Name Pin No. VBAT_BB 42 VBAT_RF 43 Description Power supply for the modules baseband part Power supply for the modules RF part 1, 27, 34, 36, 37, 40, 41 GND GND Min. Typ. Max. Unit 2.1 2.1 3.3 3.3 3.63 3.63 V V BC66_Hardware_Design 20 / 57 NB-IoT Module Series BC66 Hardware Design 3.6.2. Reference Design for Power Supply Power design for a module is critical to its performance. It is recommended to use a low quiescent current LDO with output current capacity of 0.5A as the power supply for BC66. A Li-MnO2/2S alkaline battery can also be used as the power supply. The supply voltage of the module ranges from 2.1V to 3.63V. When the module is working, please make sure its input voltage will never drop below 2.1V; otherwise the module will be abnormal. For better power performance, it is recommended to place a 100uF tantalum capacitor with low ESR

(ESR=0.7) and three ceramic capacitors (100nF, 100pF and 22pF) near the VBAT pins. Also, it is recommended to add a TVS diode on the VBAT trace (near VBAT pins) to improve surge voltage withstand capability. In principle, the longer the VBAT trace is, the wider it should be. A reference circuit for power supply is illustrated in the following figure. Figure 5: Reference Circuit for Power Supply 3.7. Power up/Power down Scenarios 3.7.1. Turn on BC66 will be powered up after driving the PWRKEY pin to a low level voltage for at least 500ms. Table 7: PWRKEY Pin Pin Name Pin No. Description PWRKEY Pull-down Time PWRKEY 7 Pull down PWRKEY to power up the module 500ms BC66_Hardware_Design 21 / 57 NB-IoT Module Series BC66 Hardware Design It is recommended use an open drain/collector driver to control the PWRKEY. A simple reference circuit is illustrated in the following figure. Figure 6: Turn on the Module Using Driving Circuit Another way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from the finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 7: Turn on the Module Using Keystroke The power up timing is illustrated in the following figure. Figure 8: Power up Timing BC66_Hardware_Design 22 / 57 NB-IoT Module Series BC66 Hardware Design NOTE PWRKEY cannot be pulled down all the time, otherwise the module will not be able to enter into PSM. 3.7.2. Turn off BC66 can be powered off though any of the following methods:

Power off by AT+QPOWD=0. The module will be powered off automatically when VBAT drops below 2.1V. In emergent conditions, the module can be powered off through disconnecting VBAT power supply. Figure 9: Power down Timing (Power off by AT Command) Figure 10: Power down Timing (Power off by Disconnecting VBAT) BC66_Hardware_Design 23 / 57 NB-IoT Module Series BC66 Hardware Design 3.7.3. Reset the Module Driving the RESET pin to a low level voltage for at least 50ms will reset the module. Table 8: Reset Pin Pin Name Pin No. Description Reset Pull-down Time RESET 15 Reset the module. Active low. 50ms The recommended circuits of resetting the module are shown below. An open drain/collector driver or button can be used to control the RESET pin. Figure 11: Reference Circuit of RESET by Using Driving Circuit Figure 12: Reference Circuit of RESET by Using Button The reset scenario is illustrated in the following figure. BC66_Hardware_Design 24 / 57 NB-IoT Module Series BC66 Hardware Design Figure 13: Reset Timing 3.8. UART Interfaces The module provides three UART ports: main UART port, debug UART port and auxiliary UART port. The module is designed as DCE (Data Communication Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection. Table 9: Pin Definition of UART Interfaces Interface Pin Name Pin No. Description Comment Main UART Port TXD RXD 17 18 Send data to RXD of DTE Receive data from TXD of DTE Debug UART Port RXD_DBG 38 Send data to RXD of DTE TXD_DBG 39 Receive data from TXD of DTE Auxiliary UART Port RXD_AUX 28 Send data to RXD of DTE TXD_AUX 29 Receive data from TXD of DTE Ringing Signal RI*

20 Ring indicator (when there is a SMS or URC output, the module will inform DTE with the RI* pin) 1.8V power domain BC66_Hardware_Design 25 / 57 NB-IoT Module Series BC66 Hardware Design NOTE

* means under development. 3.8.1. Main UART Port The main UART port supports AT command communication, data transmission and firmware upgrade. By default, the module is in auto-baud mode and it supports automatic baud rates not exceeding 115200bps. When powering on the module, the MCU has to send AT command consecutively to synchronize baud rate with the module. When OK is returned, it indicates the baud rate has been synchronized successfully. When the module is woken up from PSM or idle mode, the baud rate synchronized during start-up will be used directly. When the port is used for firmware upgrade, the baud rate is 921600bps by default. The figure below shows the connection between DCE and DTE. Figure 14: Reference Design for Main UART Port 3.8.2. Debug UART Port Through debug tools, the debug UART port can be used to output logs for firmware debugging. Its baud rate is 115200bps by default. The following is a reference design of debug UART port. BC66_Hardware_Design 26 / 57 NB-IoT Module Series BC66 Hardware Design Figure 15: Reference Design of Debug UART Port 3.8.3. Auxiliary UART Port The auxiliary UART port is designed as a general purpose UART for communication with DTE. It also supports log output for firmware debugging, and hardware flow control*. Its baud rate is 115200bps by default. The following is a reference design of auxiliary UART port. Figure 16: Reference Design of Auxiliary UART Port 3.8.4. UART Application The module provides 1.8V UART interfaces. A level translator should be used if the application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments

(please visit http://www.ti.com for more information) is recommended. The following figure shows a reference design. BC66_Hardware_Design 27 / 57 NB-IoT Module Series BC66 Hardware Design Figure 17: Reference Circuit with Voltage Level Translator Chip Another example with transistor translation circuit is shown as below. The circuit design of dotted line section can refer to the design of solid line section, in terms of both module input and output circuit designs, but please pay attention to the direction of connection. Figure 18: Reference Circuit with Transistor Circuit The following circuit shows a reference design for the communication between the module and a PC with standard RS-232 interface. Please make sure the I/O voltage of level shifter which connects to module is 1.8V. BC66_Hardware_Design 28 / 57 NB-IoT Module Series BC66 Hardware Design Figure 19: Sketch Map for RS-232 Interface Match Please visit vendors websites to select a suitable RS-232 transceiver, such as: http://www.exar.com and http://www.maximintegrated.com. 1. Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 2. represents the test point of UART interfaces. It is also recommended to reserve the test points of VBAT and PWRKEY, for convenient firmware upgrade and debugging when necessary.

* means under development. NOTES 3. 3.9. SPI Interface BC66 provides one SPI master interface. The following table shows the pin definition of SPI interface. BC66_Hardware_Design 29 / 57 NB-IoT Module Series BC66 Hardware Design Table 10: Pin Definition of SPI Interface Pin Name Pin No. I/O Description Comment SPI_MISO 3 DI Master input slave output of SPI interface SPI_MOSI 4 DO Master output slave input of SPI interface SPI_SCLK 5 DO Clock signal of SPI interface SPI_CS 6 DO Chip select of SPI interface 1.8V power domain The module provides a 1.8V SPI interface. A level translator between the module and host should be used if the application is equipped with a 3.3V processor or device interface. A voltage level translator that supports SPI data rate is recommended. The following figure shows a reference design. Figure 20: SPI Interface Reference Circuit with Translator Chip 3.10. USIM Interface The module provides a USIM interface compliant to ISO/IEC 7816-3, enabling the module to access to an external 1.8V USIM card. The external USIM card is powered by an internal regulator in the module and supports 1.8V power supply. BC66_Hardware_Design 30 / 57 NB-IoT Module Series BC66 Hardware Design Table 11: Pin Definition of USIM Interface Pin Name Pin No. Description Comment SIM_VDD 14 Power supply for USIM card SIM_CLK 13 Clock signal of USIM card SIM_DATA SIM_RST 11 12 Data signal of USIM card Reset signal of USIM card SIM_GND 10 Specified ground for USIM card Voltage accuracy: 1.8V5%. Maximum supply current: about 60mA. A reference circuit design for USIM interface with a 6-pin USIM card connector is illustrated below. Figure 21: Reference Circuit for USIM Interface with a 6-pin USIM Card Connector information of USIM card connector, please visit http://www.amphenol.com or For more http://www.molex.com. In order to enhance the reliability and availability of USIM card in application, please follow the criteria below in USIM circuit design:

Keep the placement of USIM card connector as close as possible to the module. Keep the trace length as less than 200mm as possible. Keep USIM card signals away from RF and VBAT traces. Assure the trace between the ground of module and that of USIM card connector is short and wide. Keep the trace width of ground no less than 0.5mm to maintain the same electric potential. The decouple capacitor between SIM_VDD and GND should be not more than 1F and be placed close to the USIM card connector. To avoid cross talk between SIM_DATA and SIM_CLK, keep them away from each other and shield them separately with surrounded ground. BC66_Hardware_Design 31 / 57 NB-IoT Module Series BC66 Hardware Design In order to offer good ESD protection, it is recommended to add a TVS diode array. For more information of TVS diode, please visit http://www.onsemi.com. The ESD protection device should be placed as close to USIM card connector as possible, and make sure the USIM card signal lines go through the ESD protection device first and then to the module. The 22 resistors should be connected in series between the module and the USIM card connector so as to suppress EMI spurious transmission and enhance ESD protection. Please note that the USIM peripheral circuit should be close to the USIM card connector. Place the RF bypass capacitors (33pF) close to the USIM card connector on all signal traces to improve EMI suppression. 3.11. ADC Interface The module provides a 10-bit ADC input channel to read the voltage value. The interface is available in both active and idle modes. Table 12: Pin Definition of ADC Interface Pin Name Pin No. Description ADC0 9 Analog to digital converter interface 3.12. RI Behaviors*

When there is a SMS or URC output, the module will inform DTE with the RI pin. More details will be added in the future version of this document. NOTE

* means under development. 3.13. Network Status Indication*

The NETLIGHT signal can be used to drive a network status indicator LED. A reference circuit is shown as below. BC66_Hardware_Design 32 / 57 NB-IoT Module Series BC66 Hardware Design Figure 22: Reference Design for NETLIGHT NOTE

* means under development. BC66_Hardware_Design 33 / 57 NB-IoT Module Series BC66 Hardware Design 4 Antenna Interface The pin 35 is the RF antenna pad. The antenna port has an impedance of 50. 4.1. Pin Definition Table 13: Pin Definition of NB-IoT Antenna Interface Pin Name RF_ANT GND Pin No. 35 34, 36, 37 Description RF antenna interface Ground 4.2. Operating Frequencies Table 14: Module Operating Frequencies Frequency Band Receiving Frequency Transmitting Frequency B1 B2 B3 B4 B5 B8 B12 2110MHz~2170MHz 1920MHz~1980MHz 1930MHz~1990MHz 1850MHz~1910MHz 1805MHz~1880MHz 1710MHz~1785MHz 2110MHz~2155MHz 1710MHz~1755MHz 869MHz~894MHz 824MHz~849MHz 925MHz~960MHz 880MHz~915 MHz 729MHz~746MHz 699MHz~716MHz BC66_Hardware_Design 34 / 57 NB-IoT Module Series BC66 Hardware Design B13 B17 B18 B19 B20 B25 B26*

B28 B66 NOTE 746MHz~756MHz 777MHz~787MHz 734MHz~746MHz 704MHz~716MHz 860MHz~875MHz 815MHz~830MHz 875MHz~890MHz 830MHz~845MHz 791MHz~821MHz 832MHz~862MHz 1930MHz~1995MHz 1850MHz~1915MHz 859MHz~894MHz 814MHz~849MHz 758MHz~803MHz 703MHz~748MHz 2110MHz~2200MHz 1710MHz~1780MHz

* means under development. 4.3. RF Antenna Reference Design BC66 provides an RF antenna pad for external NB-IoT antenna connection. The RF trace on host PCB connected to the modules RF antenna pad should be coplanar waveguide or microstrip, whose characteristic impedance should be close to 50. BC66 comes with ground pads which are next to the antenna pad in order to give a better grounding. In order to achieve better RF performance, it is recommended to reserve a type matching circuit and place the -type matching components (R1/C1/C2) as close to the antenna as possible. By default, the capacitors (C1/C2) are not mounted and a 0 resistor is mounted on R1. BC66_Hardware_Design 35 / 57 NB-IoT Module Series BC66 Hardware Design A reference design of the RF interface is shown as below. Figure 23: Reference Design of NB-IoT Antenna Interface 4.4. Reference Design of RF Layout For users PCB, the characteristic impedance of all RF traces should be controlled as 50. The impedance of the RF traces is usually determined by the trace width (W), the materials dielectric constant, the height between signal layer and reference ground (H), and the clearance between RF trace and ground (S). Microstrip line or coplanar waveguide line is typically used in RF layout for characteristic impedance control. The following are reference designs of microstrip line or coplanar waveguide line with different PCB structures. Figure 24: Microstrip Line Design on a 2-layer PCB BC66_Hardware_Design 36 / 57 NB-IoT Module Series BC66 Hardware Design Figure 25: Coplanar Waveguide Line Design on a 2-layer PCB Figure 26: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 27: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:

BC66_Hardware_Design 37 / 57 NB-IoT Module Series BC66 Hardware Design Use impedance simulation tool to control the characteristic impedance of RF traces as 50. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. The distance between the RF pins and the RF connector should be as short as possible, and all the right angle traces should be changed to curved ones. There should be clearance area under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W). For more details, please refer to document [2]. 4.5. Antenna Requirements To minimize the loss on RF trace and RF cable, please pay attention to the antenna design. The following tables show the requirements on NB-IoT antenna. Table 15: Antenna Cable Insertion Loss Requirements Band Requirements LTE B5/B8/B12/B13/B17/B18/B19/B20/B26*/B28 Cable Insertion loss: <1dB LTE B1/B2/B3/B4/B25/B66 Cable Insertion loss: <1.5dB NOTE

* means under development. Table 16: Required Antenna Parameters Parameters Requirements Frequency Range 699MHz~2200MHz VSWR Efficiency Max Input Power (W) 2

> 30%

50 BC66_Hardware_Design 38 / 57 NB-IoT Module Series BC66 Hardware Design Input Impedance () 50 4.6. RF Output Power Table 17: RF Conducted Output Power Frequency Band Max. B1 B2 B3 B4 B5 B8 B12 B13 B17 B18 B19 B20 B25 B26*

B28 B66 NOTES 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB 23dBm2dB TBD 23dBm2dB 23dBm2dB Min.

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm

<-39dBm TBD

<-39dBm

<-39dBm 1. The design conforms to the NB-IoT radio protocols in 3GPP Rel.13 and 3GPP Rel.14. 2.

* means under development. BC66_Hardware_Design 39 / 57 NB-IoT Module Series BC66 Hardware Design 4.7. RF Receiving Sensitivity Table 18: Receiving Sensitivity (with RF Retransmissions) Frequency Band Receiving Sensitivity

-129dBm

-129dBm

-129dBm

-129dBm

-129dBm

-129dBm

-129dBm

-129dBm

-129dBm

-129dBm

-129dBm

-129dBm

-129dBm TBD

-129dBm

-129dBm B1 B2 B3 B4 B5 B8 B12 B13 B17 B18 B19 B20 B25 B26*

B28 B66 NOTE

* means under development. BC66_Hardware_Design 40 / 57 NB-IoT Module Series BC66 Hardware Design 4.8. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by HIROSE. Figure 28: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 29: Mechanicals of U.FL-LP Connectors BC66_Hardware_Design 41 / 57 NB-IoT Module Series BC66 Hardware Design The following figure describes the space factor of mated connector. Figure 30: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. BC66_Hardware_Design 42 / 57 NB-IoT Module Series BC66 Hardware Design 5 Electrical and Reliability Characteristics 5.1. Operation and Storage Temperatures The following table lists the operation and storage temperatures of BC66. Table 19: Operation and Storage Temperatures Parameter Operation Temperature Range 1) Extended Temperature Range 2) Storage Temperature Range Min.

-35

-40

-40 Typ.

+25 Max.

+75

+85

+90 Unit C C C NOTES 1) Within operation temperature range, the module is 3GPP compliant. 2) Within extended temperature range, the module remains the ability to establish and maintain an SMS*, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again. 1. 2. 5.2. Current Consumption The table below lists the current consumption of BC66 under different states. BC66_Hardware_Design 43 / 57 NB-IoT Module Series BC66 Hardware Design Table 20: Module Current Consumption Parameter Mode Description Min. Typ. Max. Unit PSM Sleep mode eDRX=81.92s, PTW=40.96s Idle

@DRX=1.28s

@DRX=2.56s B1 @23dBm B2 @23dBm B3 @23dBm B4 @23dBm B5 @23dBm B8 @23dBm B12 @23dBm B13 @23dBm B17 @23dBm B18 @23dBm B19 @23dBm B20 @23dBm B25 @23dBm B26* @23dBm B28 @23dBm B66 @23dBm B1 @23dBm B2 @23dBm B3 @23dBm IVBAT Single-tone

(15kHz subcarrier spacing) Active 1) Single-tone

(3.75kHz subcarrier spacing) 3.5 288 541 434 100 103 107 5 285 294 308 TBD TBD 107 113 134 111 133 110 109 109 103 303 325 393 319 392 316 311 301 293 TBD TBD 128 109 193 187 215 375 312 302 296 335 A A A A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA BC66_Hardware_Design 44 / 57 NB-IoT Module Series BC66 Hardware Design Parameter Mode Description Min. Typ. Max. Unit B4 @23dBm B5 @23dBm B8 @23dBm B12 @23dBm B13 @23dBm B17 @23dBm B18 @23dBm B19 @23dBm B20 @23dBm B25 @23dBm B26* @23dBm B28 @23dBm B66 @23dBm TBD TBD 215 224 250 203 258 198 198 215 187 330 344 395 316 409 313 314 329 297 mA mA mA mA mA mA mA mA mA mA TBD TBD mA 250 200 398 316 mA mA NOTES 1) Current consumption under instrument test condition.

* means under development. 1. 2. 5.3. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the modules electrostatic discharge characteristics. BC66_Hardware_Design 45 / 57 NB-IoT Module Series BC66 Hardware Design Table 21: Electrostatic Discharge Characteristics (25C, 45% Relative Humidity) Test VBAT, GND Antenna interface Other interfaces Contact Discharge Air Discharge 5 5 0.5 10 10 1 Unit kV kV kV BC66_Hardware_Design 46 / 57 NB-IoT Module Series BC66 Hardware Design 6 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimetre (mm), and the tolerances for dimensions without tolerance values are 0.05mm. 6.1. Mechanical Dimensions of the Module Figure 31: BC66 Top and Side Dimensions (Unit: mm) BC66_Hardware_Design 47 / 57 NB-IoT Module Series BC66 Hardware Design Figure 32: Module Bottom Dimension (Bottom View) BC66_Hardware_Design 48 / 57 NB-IoT Module Series BC66 Hardware Design 6.2. Recommended Footprint 36 1 23 14 Figure 33: Recommended Footprint (Unit: mm) NOTE The module should be kept about 3mm away from other components on the host PCB. BC66_Hardware_Design 49 / 57 NB-IoT Module Series BC66 Hardware Design 6.3. Top and Bottom Views of the Module Figure 31: Top View of the Module Figure 32: Bottom View of the Module NOTE These are renderings of BC66 module. For authentic dimension and appearance, please refer to the module that you receive from Quectel. BC66_Hardware_Design 50 / 57 NB-IoT Module Series BC66 Hardware Design 7 Storage, Manufacturing and Packaging 7.1. Storage BC66 module is stored in a vacuum-sealed bag. It is rated at MSL 3, and storage restrictions are shown as below. 1. Shelf life in the vacuum-sealed bag: 12 months at <40C/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be:

Mounted within 168 hours at the factory environment of 30C/60%RH. Stored at <10%RH. 3. Devices require baking before mounting, if any circumstance below occurs. When the ambient temperature is 23C5C and the humidity indication card shows the humidity is >10% before opening the vacuum-sealed bag. Device mounting cannot be finished within 168 hours at factory conditions of 30C/60%. If baking is required, devices may be baked for 8 hours at 120C5C. 4. NOTE As the plastic package cannot be subjected to high temperature, it should be removed from devices before high to temperature (120C) baking. IPC/JEDECJ-STD-033 for baking procedure. is desired, please refer If shorter baking time BC66_Hardware_Design 51 / 57 NB-IoT Module Series BC66 Hardware Design 7.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.15mm~0.18mm. For more details, please refer to document [4]. It is suggested that the peak reflow temperature is 240~245C, and the absolute maximum reflow temperature is 245C. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below. Figure 36: Recommended Reflow Soldering Thermal Profile Table 22: Recommended Thermal Profile Parameters Factor Soak Zone Max slope Recommendation 1 to 3C/sec Soak time (between A and B: 150C and 200C) 60 to 120 sec BC66_Hardware_Design 52 / 57 NB-IoT Module Series BC66 Hardware Design Reflow Zone Max slope Reflow time (D: over 220C) Max temperature Cooling down slope Reflow Cycle Max reflow cycle NOTES 2 to 3C/sec 40 to 60 sec 240C ~ 245C 1 to 4C/sec 1 1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the modules shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted. 2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found. 7.3. Packaging The modules are stored in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. 7.3.1. Tape and Reel Packaging The reel is 330mm in diameter and each reel contains 250 modules. BC66_Hardware_Design 53 / 57 NB-IoT Module Series BC66 Hardware Design Figure 33: Tape Dimensions (Unit: mm) Figure 34: Reel Dimensions (Unit: mm) BC66_Hardware_Design 54 / 57 NB-IoT Module Series BC66 Hardware Design 8 Appendix A References Table 23: Related Documents SN Document Name Remark

[1] Quectel_BC66-TE-B_User_Guide BC66-TE-B User Guide

[2] Quectel_RF_Layout_Application_Note RF Layout Application Note

[3] Quectel_BC66_AT_Commands_Manual BC66 AT Commands Manual

[4] Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide Table 24: Terms and Abbreviations Abbreviation Description ADC CoAP DCE DTE DTLS EMI ESD FTP H-FDD HTTP HTTPS I/O Analog-to-Digital Converter Constrained Application Protocol Data Communications Equipment (typically module) Data Terminal Equipment (typically computer, external controller) Datagram Transport Layer Security Electromagnetic Interference Electrostatic Discharge File Transfer Protocol Half Frequency Division Duplexing Hyper Text Transfer Protocol Hyper Text Transfer Protocol over Secure Socket Layer Input/Output BC66_Hardware_Design 55 / 57 NB-IoT Module Series BC66 Hardware Design kbps LED Kilo Bits Per Second Light Emitting Diode Li-MnO2 Lithium-manganese Dioxide Li-2S LTE Lithium Sulfur Long Term Evolution LwM2M Lightweight M2M MQTT NB-IoT PCB PDU PPP PSM RF RTC RXD SMS SSL TCP TE TXD UART UDP URC USIM Message Queuing Telemetry Transport Narrow Band- Internet of Things Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Power Save Mode Radio Frequency Real Time Clock Receive Data Short Message Service Secure Sockets Layer Transmission Control Protocol Terminal Equipment Transmitting Data Universal Asynchronous Receiver & Transmitter User Datagram Protocol Unsolicited Result Code Universal Subscriber Identification Module VSWR Voltage Standing Wave Ratio BC66_Hardware_Design 56 / 57 NB-IoT Module Series BC66 Hardware Design Maximum Voltage Value Normal Voltage Value Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Absolute Normal Input Voltage Value Absolute Minimum Input Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value Vmax Vnorm Vmin VIHmax VIHmin VILmax VILmin VImax VInorm VImin VOHmax VOHmin VOLmax VOLmin BC66_Hardware_Design 57 / 57 NB-IoT Module Series BC66 Hardware Design FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met:

1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time-

averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the users body and must not transmit simultaneously with any other antenna or transmitter. 3.A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR201808BC66. 4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed:

LTE Band2/25:8dBi LTE Band4/66:4dBi LTE Band5:9.42dBi LTE Band12:8.73dBi LTE Band13:9.17dBi LTE Band17:8.73dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 BC66_Hardware_Design 58 / 57 NB-IoT Module Series BC66 Hardware Design If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the modules FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:Contains Transmitter Module FCC ID: XMR201808BC66 or Contains FCC ID: XMR201808BC66 must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The users manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

BC66_Hardware_Design 59 / 57 NB-IoT Module Series BC66 Hardware Design

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the users authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Suppliers Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. IC Statement IRSS-GEN

"This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1) lappareil ne doit pas produire de brouillage; 2) lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement."

Dclaration sur l'exposition aux rayonnements RF L'autre utilis pour l'metteur doit tre install pour fournir une distance de sparation d'au moins 20 cm de toutes les personnes et ne doit pas tre colocalis ou fonctionner conjointement avec une autre antenne ou un autre metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word Contains or similar wording expressing the same meaning, as follows:

Contains IC: 10224A-201808BC66 or where: 10224A-201808BC66 is the modules certification number. Le produit hte doit tre correctement tiquet pour identifier les modules dans le produit hte. BC66_Hardware_Design 60 / 57 NB-IoT Module Series BC66 Hardware Design L'tiquette de certification d'Innovation, Sciences et Dveloppement conomique Canada d'un module doit tre clairement visible en tout temps lorsqu'il est installdans le produit hte; sinon, le produit hte doit porter une tiquette indiquant le numro de certification d'Innovation, Sciences et Dveloppement conomique Canada pour le module, prcd du mot Contient ou d'un libell semblable exprimant la mme signification, comme suit:

"Contient IC: 10224A-201808BC66 " ou "o: 10224A-201808BC66 est le numro de certification du module". BC66_Hardware_Design 61 / 57 NB-IoT Module Series BC66 Hardware Design CE Statement The minimum distance between the user and/or any bystander and the radiating structure of the transmitter is 20cm. Hereby, Quectel Wireless Solutions Co., Ltd. declares that the radio equipment type BC66 is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address:

http://www.quectel.com/support/downloadb/TechnicalDocuments.htm 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China BC66_Hardware_Design 62 / 57

Quectel Wireless Solutions Co., Ltd POWER OF ATTORNEY DATE: July 22, 2021 To:

Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD 21046 We, the undersigned, hereby authorize TA Technology (Shanghai) Co., Ltd.

/jinnan han on our behalf, to apply to FCC on our equipment for FCC ID:

XMR201808BC66 . Any and all acts carried out by TA Technology (Shanghai) Co., Ltd. / jinnan han on our behalf shall have the same effect as acts of our own. Sincerely, Signature:

Print name: Jean Hu Company: Quectel Wireless Solutions Company Limited

Quectel Wireless Solutions Co., Ltd

Quectel Wireless

Statement

declare the following models.

We Quectel Wireless Solutions Co., Ltd

Quectel Wireless Solutions Co., Ltd declare the following models

Module

Product Name: NB Module

Model Number: BC66

Refer to below table

Hardware version: Refer to below table

Model

BC66

Certified

HW Version A

New

HW Version B

HW Version B

R2.1

R2.5

bove series models share the same hardware and software design. Here we need

Above series models share the same hardware and software design. Here we need

bove series models share the same hardware and software design. Here we need

to update the hardware to replace

There are some differences

replace the previous power chip. There are some differences

Certified HW Version A and New HW Version B on PCB design which

on PCB design which are

between Certified HW Version A

the power chip and its peripheral

requency range changes by

peripheral components. And frequency range changes by

narrower the bandwidth via SW.The details are shown as following picture

narrower the bandwidth via SW

pictures and table.

The left is HW Version A

HW Version A and the right is New HW Version B.

Quectel Wireless Solutions Co., Ltd

Quectel Wireless

Designator

R2.1Position

(mm, mm)

PMIC DC-DC BOOST

1.8-5V ADJ 2.0A

WL-CSP-16B 1.67 x 1.67

mm H0.6mm RO

CAP X5R 10uF +/-20%

6.3V CH0402 RO

IND LOW 1.5uH +/-20%

0.095ohm 2.0A 2.0x1.6mm

H1.0mm RO

NONE

NONE

CAP X5R 22uF +/-20%

6.3V CH0603 RO

CAP X5R 22uF +/-20%

6.3V CH0603 RO

NOT MOUNTED

NOT MOUNTED

NOT MOUNTED

-5.5V 1MHz 1A

Position

R2.5 Position

(mm, mm)

PMIC DCDC BOOST

PMIC DCDC BOOST

0.7-5.5V 1.8-

1μA DFN2*2

1μA DFN2*2-6 2x2mm

H0.8mm RO

H0.8mm RO

CAP X5R 4.7uF +/-20%

CAP X5R 4.7uF +/

6.3V CH0402 H0.65mm RO

6.3V CH0402 H0.65mm RO

LOW 2.2uH +/-20%

IND LOW 2.2uH +/

1.60A 2.0x1.6mm

0.135ohm 1.60A 2.0x1.6mm

H1.0mm RO

H1.0mm RO

RES MF 100K +/

RES MF 100K +/-1%

1/20W CH0201 RO

1/20W CH0201 RO

RES MF 43K +/-1% 1/20W

RES MF 43K +/

CH0201 RO

CAP X5R 47uF +/-20%

CAP X5R 47uF +/

CH0603 H1.0mm RO

6.3V CH0603 H1.0mm RO

CAP X5R 47uF +/

CAP X5R 47uF +/-20%

6.3V CH0603 H1.0mm RO

6.3V CH0603 H1.0mm RO

NONE

NONE

NONE

We hereby state that there is n

hereby state that there is no any other internal difference between them and t

difference between them and the

t affect the RF portions and the

change is layout part of power supply BB which won’t affect the RF portions and the

change is layout part of power supply BB which won

original RF data can be re-

-used.

Your assistance on this matter is highly appreciated.

Your assistance on this matter is highly appreciated.

Sincerely,

Name:Jean Hu

Certification Section

Title:Certification Section

U201

C215

L204

R203

R204

C216

C220

U202

C221

R205

Quectel Wireless Solutions Company Limited

Quectel Wireless Solutions Company Limited

Quectel Wireless Solutions Company Limited

XMR202106EG91NAL

original date of grant ：11/27/2018,

XMR202106EG91N original date of grant

ertificate number :182181379AA00

Certificate number :182181379AA00

Model

BC66

Certified

HW Version A

R2.1

New

HW Version B

HW Version B

R2.5

are

are

Above series models share the same hardware and software design. Here we need

Above series models share the same hardware and software design. Here we need

Above series models share the same hardware and software design. Here we need

some

There

There

chip.

to replace the previous power chip.

some

to update the hardware to

New HW Version B on PCB design

Certified HW Version A and New HW Version B

differences between Certified HW Version A

The details are shown as

chip and its peripheral components. The details are shown as

which are the power chip

and table.

following pictures and table.

As compared to the original reported info, modification are made beyond what has

As compared to the original reported info, modification are made beyond what has

As compared to the original reported info, modification are made beyond what has

been described in the letter that frequency range is narrowed innerward by 0.1MHz.

been described in the letter that frequency range is narrowed innerward by 0.1MHz.

been described in the letter that frequency range is narrowed innerward by 0.1MHz.

Test values partial duplicated from Original for variant. There is only tested RF power

Test values partial duplicated from Original for variant. There is only tested RF power

Test values partial duplicated from Original for variant. There is only tested RF power

output and Effective Radiated Power, Frequency Stability, Occupied Bandwidth, Band

output and Effective Radiated Power, Frequency Stability, Occupied Bandwidth, Band

output and Effective Radiated Power, Frequency Stability, Occupied Bandwidth, Band

Edge Compliance, Receiver Spurious Emissions and AC Power Line Conducted

Edge Compliance, Receiver Spurious Emissions and AC Power Line Conducted

Edge Compliance, Receiver Spurious Emissions and AC Power Line Conducted

r variant in this report.

Emissions for variant in this report.

The left is HW Version A and the right is

and the right is New HW Version B.

Designator

R2.1 Position

(mm, mm)

Position

R2.5 Position

(mm, mm)

PMIC DC-DC BOOST 1.8-5V

ADJ 2.0A WL-CSP-16B 1.67

x 1.67 mm H0.6mm RO

CAP X5R 10uF +/-20% 6.3V

CH0402 RO

IND LOW 1.5uH +/-20%

0.095ohm 2.0A 2.0x1.6mm

H1.0mm RO

NONE

NONE

CAP X5R 22uF +/-20% 6.3V

CH0603 RO

CAP X5R 22uF +/-20% 6.3V

CH0603 RO

NOT MOUNTED

NOT MOUNTED

NOT MOUNTED

PMIC DCDC BOOST 0.7-5.5V

PMIC DCDC BOOST 0.7

5.5V 1MHz 1A 1μA

1.8-5.5V 1MHz 1A 1μA

6 2x2mm H0.8mm

DFN2*2-6 2x2mm H0.8mm

RO

CAP X5R 4.7uF +/

CAP X5R 4.7uF +/-20% 6.3V

CH0402 H0.65mm RO

CH0402 H0.65mm RO

LOW 2.2uH +/-20%

IND LOW 2.2uH +/

0.135ohm 1.60A 2.0x1.6mm

0.135ohm 1.60A 2.0x1.6mm

H1.0mm RO

RES MF 100K +/-1% 1/20W

RES MF 100K +/

CH0201 RO

RES MF 43K +/-1% 1/20W

RES MF 43K +/

CH0201 RO

CAP X5R 47uF +/

CAP X5R 47uF +/-20% 6.3V

CH0603 H1.0mm RO

CH0603 H1.0mm RO

CAP X5R 47uF +/-20% 6.3V

CAP X5R 47uF +/

CH0603 H1.0mm RO

CH0603 H1.0mm RO

NONE

NONE

NONE

We hereby state that there is n

hereby state that there is no any other internal difference between them and t

difference between them and the

t affect the RF portions and the

change is layout part of power supply BB which won’t affect the RF portions and the

change is layout part of power supply BB

original RF data can be re-

-used.

Your assistance on this matter is highly appreciated.

Your assistance on this matter is highly appreciated.

U201

C215

L204

R203

R204

C216

C220

U202

C221

R205

Sincerely,

Signature:

Print name:Jean Hu

Date: July 22, 2021

Quectel Wireless Solutions Co., Ltd.

Company:Quectel Wireless Solutions Co., Ltd.

Email: jean.hu@quectel.com