FCC ID: XMR2023CC200ALB Satellite Communication Module

CC200A-LB Hardware Design Satellite Communication Module Series Version: 1.0.0 Date: 2023-05-26 Status: Preliminary Satellite Communication Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters:

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http://www.quectel.com/support/technical.htm. Or email us at: support@quectel.com. Legal Notices We offer information as a service to you. The provided information is based on your requirements and we make every effort to ensure its quality. You agree that you are responsible for using independent analysis and evaluation in designing intended products, and we provide reference designs for illustrative purposes only. Before using any hardware, software or service guided by this document, please read this notice carefully. Even though we employ commercially reasonable efforts to provide the best possible experience, you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis. We may revise or restate this document from time to time at our sole discretion without any prior notice to you. Use and Disclosure Restrictions License Agreements Documents and information provided by us shall be kept confidential, unless specific permission is granted. They shall not be accessed or used for any purpose except as expressly provided herein. Copyright Our and third-party products hereunder may contain copyrighted material. Such copyrighted material shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior written consent. We and the third party have exclusive rights over copyrighted material. No license shall be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal non-

exclusive, royalty-free license to use the material. We reserve the right to take legal action for noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of the material. CC200A-LB_Hardware_Design 1 / 58 Satellite Communication Module Series Trademarks Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects. Third-Party Rights This document may refer to hardware, software and/or documentation owned by one or more third parties (third-party materials). Use of such third-party materials shall be governed by all restrictions and obligations applicable thereto. We make no warranty or representation, either express or implied, regarding the third-party materials, including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any third-

party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell, offer for sale, or otherwise maintain production of any our products or any other hardware, software, device, tool, information, or product. We moreover disclaim any and all warranties arising from the course of dealing or usage of trade. Privacy Policy To implement module functionality, certain device data are uploaded to Quectels or third-partys servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws. Before data interaction with third parties, please be informed of their privacy and data security policy. Disclaimer a) We acknowledge no liability for any injury or damage arising from the reliance upon the information. b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the information contained herein. c) While we have made every effort to ensure that the functions and features under development are free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless otherwise provided by valid agreement, we make no warranties of any kind, either implied or express, and exclude all liability for any loss or damage suffered in connection with the use of features and functions under development, to the maximum extent permitted by law, regardless of whether such loss or damage may have been foreseeable. d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright Quectel Wireless Solutions Co., Ltd. 2023. All rights reserved. CC200A-LB_Hardware_Design 2 / 58 Satellite Communication Module Series Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Quectel assumes no liability for customers failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on an aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in such conditions, use emergency call if the device supports it. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. In an emergency, the device with emergency call function cannot be used as the only contact method considering network connection cannot be guaranteed under all circumstances. The cellular terminal or mobile contains a transceiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. In locations with explosive or potentially explosive atmospheres, obey all posted signs and turn off wireless devices such as mobile phone or other cellular terminals. Areas with explosive or potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust or metal powders. CC200A-LB_Hardware_Design 3 / 58 Satellite Communication Module Series About the Document Revision History Version Date Author Description

2023-03-17 1.0.0 2023-05-26 Xu LI/

Angela HE/

Ramos ZHANG Xu LI/

Angela HE/

Ramos ZHANG Creation of the document Preliminary CC200A-LB_Hardware_Design 4 / 58 Satellite Communication Module Series Contents Safety Information ....................................................................................................................................... 3 About the Document ................................................................................................................................... 4 Contents ....................................................................................................................................................... 5 Table Index ................................................................................................................................................... 7 Figure Index ................................................................................................................................................. 8 1 Introduction .......................................................................................................................................... 9 Special Mark .............................................................................................................................. 9 1.1. 2 Product Overview .............................................................................................................................. 10 Key Features ........................................................................................................................... 10 Functional Diagram ................................................................................................................. 12 Pins Assignment ...................................................................................................................... 13 Pins Description ...................................................................................................................... 14 EVB Kit .................................................................................................................................... 17 2.1. 2.2. 2.3. 2.4. 2.5. 3 Operating Characteristics ................................................................................................................. 18 3.1. Operating Modes ..................................................................................................................... 18 Power Supply .......................................................................................................................... 19 3.2. 3.2.1. Power Supply Pins ......................................................................................................... 19 3.2.2. Reference Design for Power Supply .............................................................................. 19 3.2.3. Requirements for Voltage Stability ................................................................................. 19 Turn on .................................................................................................................................... 21 V_BCKP* ................................................................................................................................. 21 3.3. 3.4. 4.1. 4.2. 4.3. 4.4. 4 Application Interfaces ....................................................................................................................... 23 UART Interface ........................................................................................................................ 23 I2C Interface* .......................................................................................................................... 24 1PPS* ...................................................................................................................................... 25 System Pins ............................................................................................................................ 25 4.4.1. WAKEUP_IN .................................................................................................................. 25 4.4.2. BOOT ............................................................................................................................. 26 4.4.3. RESET_N ....................................................................................................................... 27 ADC Interface .......................................................................................................................... 29 Indication Signal ...................................................................................................................... 30 4.6.1. Network Status Indication* ............................................................................................. 30 4.6.2. STATUS .......................................................................................................................... 31 4.6.3. EVENT_IND* .................................................................................................................. 31 4.5. 4.6. 5.1. 5 RF Specifications ............................................................................................................................... 33 Antenna Interface .................................................................................................................... 33 5.1.1. Antenna Interface & Frequency Bands .......................................................................... 33 5.1.2. Reference Design of Passive Antenna .......................................................................... 34 5.1.3. Requirements for Antenna Design ................................................................................. 34 CC200A-LB_Hardware_Design 5 / 58 Satellite Communication Module Series 5.2. Satellite LBand Network ........................................................................................................ 35 5.2.1. Transmitting Power ........................................................................................................ 35 5.2.2. Receiver Parameter ....................................................................................................... 35 5.3. GNSS ...................................................................................................................................... 35 5.3.1. GNSS Performance ....................................................................................................... 35 5.3.2. AGNSS .......................................................................................................................... 37 EASY ........................................................................................................... 37 5.3.2.1. 5.3.2.2. EPO ............................................................................................................. 37 RF Routing Guidelines ............................................................................................................ 37 RF Connector Recommendation ............................................................................................ 39 5.4. 5.5. 6 Electrical Characteristics and Reliability ........................................................................................ 41 Absolute Maximum Ratings .................................................................................................... 41 6.1. Power Supply Ratings ............................................................................................................. 42 6.2. 6.3. Operating and Storage Temperatures ..................................................................................... 42 Power Consumption ................................................................................................................ 42 6.4. Digital I/O Characteristics ........................................................................................................ 43 6.5. ESD Protection ........................................................................................................................ 44 6.6. Thermal Dissipation................................................................................................................. 44 6.7. 7 Mechanical Information ..................................................................................................................... 46 7.1. Mechanical Dimensions .......................................................................................................... 46 Recommended Footprint ......................................................................................................... 48 7.2. Top and Bottom Views............................................................................................................. 49 7.3. 8 Storage, Manufacturing & Packaging .............................................................................................. 50 8.1. Storage Conditions .................................................................................................................. 50 8.2. Manufacturing and Soldering .................................................................................................. 51 Packaging Specification .......................................................................................................... 53 8.3. 8.3.1. Carrier Tape .................................................................................................................... 53 8.3.2. Plastic Reel .................................................................................................................... 54 8.3.3. Mounting Direction ......................................................................................................... 54 8.3.4. Packaging Process ........................................................................................................ 55 9 Appendix References ........................................................................................................................ 56 CC200A-LB_Hardware_Design 6 / 58 Satellite Communication Module Series Table Index Table 1: Special Mark ................................................................................................................................... 9 Table 2: Basic Information .......................................................................................................................... 10 Table 3: Key Features ................................................................................................................................ 10 Table 4: Parameters Definition ................................................................................................................... 14 Table 5: Pins Description ............................................................................................................................ 14 Table 6: VBAT and GND Pins .................................................................................................................... 19 Table 7: UART Information ......................................................................................................................... 23 Table 8: Pin Description of UART............................................................................................................... 23 Table 9: Pin Description of I2C Interface.................................................................................................... 25 Table 10: Pin Description of WAKEUP_IN Interface .................................................................................. 26 Table 11: Pin Description of BOOT ............................................................................................................ 26 Table 12: Operating Modes ........................................................................................................................ 26 Table 13: Pin Description of RESET_N ...................................................................................................... 27 Table 14: Pin Description of ADC Interface ................................................................................................ 29 Table 15: Characteristics of ADC Interface ................................................................................................ 29 Table 16: Pins Description of Indication Signal .......................................................................................... 30 Table 17: Network Status Indication Pin Level and Module Network Status ............................................. 30 Table 18: Pins Description of Antenna Interface ........................................................................................ 33 Table 19: LBand Frequency (Unit: MHz) .................................................................................................. 33 Table 20: GNSS Frequency (Unit: MHz) .................................................................................................... 33 Table 21: Requirements for Antenna Design ............................................................................................. 34 Table 22: RF Transmitting Power ............................................................................................................... 35 Table 23: C/No and Rx gain ....................................................................................................................... 35 Table 24: GNSS Performance .................................................................................................................... 35 Table 25: Absolute Maximum Ratings ........................................................................................................ 41 Table 26: Modules Power Supply Ratings ................................................................................................. 42 Table 27: Recommended Operating Temperature ..................................................................................... 42 Table 28: Power Consumption ................................................................................................................... 42 Table 29: Common I/O Characteristics (Unit: V) ........................................................................................ 43 Table 30: VDD_EXT I/O Characteristics (Unit: V) ...................................................................................... 43 Table 31: ESD Characteristics (Temperature: 2530 C, Humidity: 40 5 %; Unit: kV) ............................ 44 Table 32: Recommended Junction Operating Temperature Range for Main Chips (Unit: C) .................. 45 Table 33: Recommended Thermal Profile Parameters .............................................................................. 52 Table 34: Carrier Tape Dimension Table (Unit: mm) .................................................................................. 53 Table 35: Plastic Reel Dimension Table (Unit: mm) ................................................................................... 54 Table 36: Related Documents .................................................................................................................... 56 Table 37: Terms and Abbreviations ............................................................................................................ 56 CC200A-LB_Hardware_Design 7 / 58 Satellite Communication Module Series Figure Index Figure 1: Functional Diagram ........................................................................................... !

Figure 2: Pins Assignment ......................................................................................................................... 13 Figure 3: Reference Design of Power Input ............................................................................................... 19 Figure 4: Power Supply Limits During Burst Transmission ........................................................................ 20 Figure 5: Reference Design of Power Supply ............................................................................................ 20 Figure 6: Timing of Turn On ....................................................................................................................... 21 Figure 7: Reference Charging Circuit with Rechargeable Backup Battery ............................................... 22 Figure 8: Reference Design of UART ........................................................................................................ 24 Figure 9: Reference Design of UART with Transistor Level-shifting Circuit .............................................. 24 Figure 10: I2C Interface Reference Design ............................................................................................... 25 Figure 11: WAKEUP_IN Reference Design ............................................................................................... 26 Figure 12: BOOT Pin State (Normal Operating Mode) .............................................................................. 27 Figure 13: BOOT Pin Control Sequence (Boot Download Mode) ............................................................. 27 Figure 14: Reference Design of Reset with Driving Circuit ....................................................................... 28 Figure 15: Reference Design of Reset with Button.................................................................................... 28 Figure 16: Timing of Reset ......................................................................................................................... 28 Figure 17: Reference Design of Network Status Indication ....................................................................... 30 Figure 18: Reference Design of STATUS .................................................................................................. 31 Figure 19: Reference Design of EVENT_IND ............................................................................................ 31 Figure 20: Behavior of EVENT_IND as RI Signal ...................................................................................... 32 Figure 21: Reference Design of Passive Antenna ..................................................................................... 34 Figure 22: Microstrip Design on a 2-layer PCB ......................................................................................... 38 Figure 23: Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 38 Figure 24: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 38 Figure 25: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 38 Figure 26: Dimensions of the Receptacle (Unit: mm) ................................................................................ 39 Figure 27: Specifications of Mated Plugs (Unit: mm) ................................................................................ 40 Figure 28: Placement and Fixing of the Heatsink ...................................................................................... 45 Figure 29: Top and Side Dimensions ......................................................................................................... 46 Figure 30: Bottom Dimensions ................................................................................................................... 47 Figure 31: Recommended Footprint .......................................................................................................... 48 Figure 32: Top and Bottom Views .............................................................................................................. 49 Figure 33: Recommended Reflow Soldering Thermal Profile ................................................................... 51 Figure 34: Carrier Tape Dimension Drawing .............................................................................................. 53 Figure 35: Plastic Reel Dimension Drawing .............................................................................................. 54 Figure 36: Mounting Direction .................................................................................................................... 54 Figure 37: Packaging Process ................................................................................................................... 55 CC200A-LB_Hardware_Design 8 / 58 Satellite Communication Module Series 1 Introduction This document introduces CC200A-LB module and describes its hardware interfaces which are connected to your applications. This document helps you quickly understand the interface specifications, RF characteristics, electrical and mechanical details, as well as other related information of the module. 1.1. Special Mark Table 1: Special Mark Marks Definitions

Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk

(*) after a model indicates that the sample of the model is currently unavailable. Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [CC200A-LB] is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: http://www.quectel.com/support/technical.htm The device could be used with a separation distance of 20cm to the human body. CC200A-LB_Hardware_Design 9 / 58 Satellite Communication Module Series 2 Product Overview CC200A-LB is a satellite communication module designed to provide communications in remote areas without cellular network coverage. The module can be applied to the following fields:

Transportation Maritime Heavy Equipment Mining Oil and Gas Agriculture Table 2: Basic Information CC200A-LB Packaging type LCC + LGA Pin counts Dimensions Weight 177

(37.0 0.15) mm (38.0 0.15) mm (3.35 0.2) mm approx. 9.4 g 2.1. Key Features Table 3: Key Features Categories Descriptions Power Supply Message UART Interfaces VBAT_BB: 5.56.5 V, typ. 6.0 V VBAT_RF: 5.56.5 V, typ. 6.0 V Supports sending and receiving messages between terminals and servers Main UART:

Used for AT command communication and data transmission CC200A-LB_Hardware_Design 10 / 58 Satellite Communication Module Series Baud rate: 115200 bps Debug UART:

Used for debug log output Baud rate: 115200 bps STATUS:

Used for the module's operation status indication NET_STATUS*:

Used for satellite network connectivity status indication EVENT_IND*:

Used for URC output status indication Indication Interface AT Commands Complies with Quectel AT commands Antenna Interfaces Satellite and GNSS share the same antenna interface (ANT_SAT) 50 characteristic impedance Satellite Service Inmarsat GEO; two-way communication, lsatData Pro (IDP) 1 Satellite Frequency Range L-Band Tx Frequency: 1626.51660.5 MHz Rx Frequency: 1518.01559.0 MHz GNSS Features GPS L1/BDS B1/GLONASS L1/Galileo E1 The data update rate is 1 Hz by default and can support a maximum Temperature Ranges value of 10 Hz Normal operating temperature 2: -35 C to +75 C Extended temperature 2: -40 C to +85 C Storage temperature: -40 C to +90 C Firmware Upgrade UART interface RoHS All hardware components are fully compliant with EU RoHS directive 1 IsatData Pro (IDP) service is provided by Orbcomm. 2 To meet this operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. CC200A-LB_Hardware_Design 11 / 58 Satellite Communication Module Series 2.2. Functional Diagram The following figure shows a block diagram of the module. Power management Baseband 4 MB flash Radio frequency Peripheral interfaces CC200A-LB_Hardware_Design 12 / 58 Satellite Communication Module Series 2.3. Pins Assignment Figure 1: Pins Assignment NOTE Keep all RESERVED pins unconnected. CC200A-LB_Hardware_Design 13 / 58 PowerRESERVED Signal129GND136119118117116115114113112959697989910010110214315015716417113013714415115816517213113814515215916617313213914615316016717413314014715416116817513414114815516216917613514214915616317017712112212312412512612712812011111010910810710610510410324RESET_N25RESERVED26BOOT27GND28DBG_RXD29DBG_TXD30GND31ADC132GND33ADC034GND35RESERVED37GND39RESERVED41RESERVED431PPS45GND46RESERVED47RESERVED42V_BCKP44RESERVED36RESERVED38RESERVED40RESERVED1RESERVED2GND3STATUS4WAKEUP_IN5GPIO06GPIO17NET_STATUS8GND9RESERVED10EVENT_IND11GND12I2C_SDA13I2C_SCL14GND15RESERVED17MAIN_RXD19RESERVED21RESERVED23VDD_EXT22RESERVED16GND18MAIN_TXD20RESERVED94GND93GND92VBAT_BB91VBAT_BB72RESERVED90GND89VBAT_RF88VBAT_RF87GND86GND85RESERVED84RESERVED83GND82RESERVED81RESERVED79GND77RESERVED75RESERVED73RESERVED74GND71RESERVED80RESERVED78RESERVED76RESERVEDANT70GND69RESERVED68GND67GND66RESERVED65GND64GND63RESERVED62GND61GND60RESERVED59GND58GND56GND54RESERVED52GND50GND48GND51ANT_SAT49RESERVED57RESERVED55GND53GND Satellite Communication Module Series 2.4. Pins Description Table 4: Parameters Definition Parameters AI AO AIO DI DO DIO OD PI PO Descriptions Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output DC characteristics include power domain and rate current in the table below. Table 5: Pins Description Power Supply Input Pin Name Pin No. I/O Description DC Characteristics Comment VBAT_BB 91, 92 PI VBAT_RF 88, 89 PI Power supply for the modules baseband part Power supply for the modules RF part Vmax = 6.5 V Vmin = 5.5 V Vnom = 6.0 V Vmax = 6.5 V Vmin = 5.5 V Vnom = 6.0 V V_BCKP*

42 PI Backup power supply for backup domain Vmin = 1.65 V Vnom = 3.3 V Vmax = 3.6 V Internally connected to 3.3 V. It should always be powered by an external battery if hot (warm) start is required, if not, CC200A-LB_Hardware_Design 14 / 58 Satellite Communication Module Series Power Output Pin Name Pin No. I/O Description DC Characteristics Comment keep it unconnected. VDD_EXT 23 PO Provide 3.3 V for external circuit Vnom = 3.3 V Imax = 50 mA Power supply for external GPIO's pull-up circuits. A test point is recommended to be reserved. GND Pin Name Pin No. 2, 8, 11, 14, 16, 27, 30, 32, 34, 37, 45, 48, 50, 52, 53, 55, 56, 58, 59, 61, 62, 64, 65 67, 68, 70, 74, 79, 83, 86, 87, 90, 93, 94, 112119, 129177 GND Reset Pin Name Pin No. I/O Description DC Characteristics Comment RESET_N 24 DI Reset the module VDD_EXT Internally pulled up to 3.3 V. Active low. A test point is recommended to be reserved if unused. Indication Interface Pin Name Pin No. I/O Description DC Characteristics Comment STATUS 3 DO NET_STATUS* 7 DO EVENT_IND*

10 DO Main UART Interface Indicate the modules operation status Indicate the modules network activity status Indicate the modules URC output status VDD_EXT VDD_EXT VDD_EXT Pin Name Pin No. I/O Description DC Characteristics Comment MAIN_RXD MAIN_TXD 17 18 DI Main UART receive VDD_EXT DO Main UART transmit VDD_EXT CC200A-LB_Hardware_Design 15 / 58 Satellite Communication Module Series Debug UART Interface Pin Name Pin No. I/O Description DC Characteristics Comment DBG_RXD DBG_TXD 28 29 I2C Interface*

DI DO Debug UART receive Debug UART transmit VDD_EXT VDD_EXT Test points must be reserved. Pin Name Pin No. I/O Description DC Characteristics Comment I2C_SDA 12 OD I2C serial data I2C_SCL 13 OD I2C serial clock RF Antenna Interface External pull-up resistor is required. 3.3 V only. If unused, keep it open. Pin Name Pin No. I/O Description DC Characteristics Comment ANT_SAT 51 AIO Satellite & GNSS antenna interface 50 characteristic impedance. ADC Interface Pin Name Pin No. I/O Description DC Characteristics Comment ADC0 ADC1 33 31 AI AI Other Interfaces General-purpose ADC interface General-purpose ADC interface 03.3 V 03.3 V Max input 3.3 V. If unused, connect it to GND directly. Pin Name Pin No. I/O Description DC Characteristics Comment BOOT 26 DI WAKEUP_IN GPIO0 GPIO1 4 5 6 DI DIO DIO Pull up to force the module into boot download mode Pull down to wake up the module General-purpose input/output General-purpose input/output VDD_EXT Internally pulled down to GND. VDD_EXT Internally pulled up. VDD_EXT VDD_EXT 1PPS*

43 DO One pulse per second 03.3 V Synchronized on rising edge. If unused, keep the CC200A-LB_Hardware_Design 16 / 58 Satellite Communication Module Series pin unconnected. Reserved Pins Pin Name Pin No. RESERVED 1, 9, 15, 1922, 25, 35, 36, 3841, 44, 46, 47, 49, 54, 57, 60, 63, 66, 69, 7173 7578, 8082, 84, 85, 95111, 120128 2.5. EVB Kit Quectel supplies an evaluation board (SAT-A EVB) with accessories to control or test the module. For more details, see document [1]. CC200A-LB_Hardware_Design 17 / 58 Satellite Communication Module Series 3 Operating Characteristics 3.1. Operating Modes The following table briefly outlines the operating modes of the module. Mode Details Working Mode GNSS Mode Periodic Sleep Mode By default, the module is in working mode upon powering on, allowing it to process data from the host at any time. The internal satellite and GNSS modems, as well as the power supply and RF circuit, operate periodically based on business needs. The working cycle of the modems can be configured using relevant AT commands. See document [2] for more details. The module's main UART will continuously output NMEA sentences. The main control chip of the module and the GNSS modem, as well as related circuits, will work continuously. The satellite modem will be turned off. To exit GNSS mode, send CTRL+Z to the module. In this mode, the module periodically checks for any pending data to process, and enters sleep mode when idle. The internal RTC alarm clock wakes up the module at set intervals to process satellite downlink messages. The module supports waking up via the default WAKEUP_IN pin pull-down, or by using AT commands to configure UART wake-up. See document [2] for more details. Deep Sleep Mode When the module's data service or location information is not used for a long time, the module can be configured to enter deep sleep mode. In deep sleep mode, the module can only be awakened by pulling the WAKEUP_IN pin low. When the module is in working mode, it can be switched to any other mode. However, switching between GNSS mode, periodic sleep mode, and deep sleep mode is not supported. When exiting from GNSS mode, periodic sleep mode, and deep sleep mode, the module returns to working mode. If you want to switch from one non-working mode to another, you need to first exit the current mode and let the module enter working mode, and then switch to another mode by sending AT commands. CC200A-LB_Hardware_Design 18 / 58 Satellite Communication Module Series 3.2. Power Supply 3.2.1. Power Supply Pins The module provides 4 VBAT pins for connection with the external power supply. There are two separate voltages for VABT. Table 6: VBAT and GND Pins Pin Name Pin No. VBAT_BB 91, 92 VBAT_RF 88, 89 I/O PI PI Description Power supply for the modules baseband part Power supply for the modules RF part GND 2, 8, 11, 14, 16, 27, 30, 32, 34, 37, 45, 48, 50, 52, 53, 55, 56, 58, 59, 61, 62, 64, 65 67, 68, 70, 74, 79, 83, 86, 87, 90, 93, 94, 112119, 129177 3.2.2. Reference Design for Power Supply Power design for the module is essential. The power supply of the module should be able to provide sufficient continue current of 2.5 A at least. If the voltage difference between input voltage and the supply voltage is small, it is suggested to use an LDO; If the voltage difference is big, a buck converter is recommended. Figure 2: Reference Design of Power Input 3.2.3. Requirements for Voltage Stability The power supply range of the module is from 5.5 V to 6.5 V. Ensure the input voltage never drops below 5.5 V. CC200A-LB_Hardware_Design 19 / 58 PMICINOUTENGNDADJ24135R1R251K1%1%4.7K47KVBAT_ENDC_IN100 F470 FD1VBAT 33 pF100 nF22 F22 FCFB100 nF10 F22 F100 nF Satellite Communication Module Series Figure 3: Power Supply Limits During Burst Transmission To decrease the voltage drop, use a bypass capacitor of about 100 F with low ESR and reserve a multi-layer ceramic chip (MLCC) capacitor array with ultra-low ESR. Use 3 ceramic capacitors for composing the MLCC array, and place these capacitors close to the VBAT pins. The main power supply from an external application should be a single voltage source and can be expanded to two sub paths with the star configuration. The width of VBAT_BB trace and VBAT_RF trace should be at least 1 mm and 1.5 mm respectively. As per design rules, the longer the VBAT trace is, the wider it should be. To avoid the ripple and surge and to ensure the stability of the power supply to the module, add a high-power rated TVS component at the front end of the power supply. Figure 4: Reference Design of Power Supply CC200A-LB_Hardware_Design 20 / 58 Power Supply (V)Burst TransmissionRippleDropBurst TransmissionLoad (A)ModuleVBAT_RFVBAT_BBVBATC1100FCnFCpFCpF++CnFC100FCpFCpFD1C2100nF6.8220683456789C1068220nF1006.8 Satellite Communication Module Series 3.3. Turn on After powering on the module, the module can turn on automatically. No other operation is required. Figure 5: Timing of Turn On 3.4. V_BCKP*

The V_BCKP pin supplies the backup domain, which includes RTC and RAM. To achieve quick startup and improve TTFF, the backup domain power supply should be valid during the interval. If the VBAT is not valid, the V_BCKP supplies RAM that contains all the necessary GNSS data and some of the user configuration variables. If there is a constant power supply in your system, it can be used to provide a suitable voltage to power V_BCKP. It is recommended to use an external rechargeable battery for V_BCKP and place the battery with a TVS, a diode and a combination of a 4.7 F, a 100 nF and a 33 pF capacitor near the V_BCKP pin. The reference charging circuit is illustrated below. CC200A-LB_Hardware_Design 21 / 58 VBATRESET_NActiveUART 200 msSTATUS 120 msInactive Satellite Communication Module Series Figure 6: Reference Charging Circuit with Rechargeable Backup Battery NOTE 2. 1. V_BCKP pin is internally connected to 3.3 V, but it will lose power when VBAT is not connected. It should always be powered by an external battery if a hot (warm) start is required, if not, keep it unconnected. In working mode and GNSS mode, the maximum current consumption of V_BCKP exceeds 100 A, with a portion of the current potentially sourced from an external battery. When the module is not connected to VBAT and relies on an external battery, the maximum current consumption of V_BCKP with external battery is 1 A, which will deplete the battery. Therefore, when useing an external battery, it is recommended to configure a rechargeable battery for V_BCKP. If V_BCKP is below the minimum value of the recommended operating voltage, the module cannot work normally. 3. 4. A diode is needed between the battery and V_BCKP pin because of the inside design of this pin. 5. A 1 k resistor should be used, and the resistance value of the current-limiting resistor is related to the battery selected by your application. In order to maintain the performance of the rechargeable battery, it is necessary to select 1 k resistor to limit the charging current. It is recommended to control the V_BCKP of the module via MCU to restart the module when the module enters an abnormal state. 6. CC200A-LB_Hardware_Design 22 / 58 3.3 V Always on PowerBackup Domain1KV_BCKPRechargeableBackup Battery4.7 F100 nFModule33 pFTVS Satellite Communication Module Series 4 Application Interfaces 4.1. UART Interface The module provides two UARTs with the following features, and see the table below for details. Table 7: UART Information UART Type Baud Rate (Typ.) Functions Main UART 115200 bps Data transmission, AT command communication and firmware upgrade Debug UART 115200 bps debug log output Table 8: Pin Description of UART Pin Name Pin No. I/O Description Comment MAIN_RXD MAIN_TXD DBG_RXD DBG_TXD 17 18 28 29 DI Main UART receive DO Main UART transmit DI Debug UART receive DO Debug UART transmit 3.3 V voltage domain. If the external circuit voltage does not match, a level-shifting circuit is needed. CC200A-LB_Hardware_Design 23 / 58 Satellite Communication Module Series A reference design is shown in the figure below. Figure 7: Reference Design of UART The module provides 3.3 V UART. You can use level-shifting circuit between the module and hosts UART if the host is equipped with a 1.8 V UART. Figure 8: Reference Design of UART with Transistor Level-shifting Circuit 4.2. I2C Interface*

The module provides one I2C interface. Support fast mode with bit rates up to 400 kbps Operate as a master only. CC200A-LB_Hardware_Design 24 / 58 RXDTXDRXDTXDModuleGNDMCUGNDMCU/ARMTXDRXDVDD_MCU10 KVDD_MCU4.7 K10 KVDD_EXTMAIN_TXDMAIN_RXDGNDModuleVDD_MCU4.7 KGND1 nF1 nF Satellite Communication Module Series Table 9: Pin Description of I2C Interface Pin Name Pin No. I/O Description Comment I2C_SDA I2C_SCL 12 13 OD I2C serial data OD I2C serial clock External pull-up resistor is required. 3.3 V only. If unused, keep it open. A reference design is shown in the figure below. Figure 9: I2C Interface Reference Design 4.3. 1PPS*

The 1PPS output pin generates a one pulse per second periodic signal, synchronized to GNSS time grid with intervals. Pulse accuracy is better than 100 ns. Thus, it may be used as a low frequency time synchronization pulse or as a high frequency reference signal. Maintaining high accuracy of 1PPS requires visible satellites in an open sky environment and powered VBAT. 4.4. System Pins 4.4.1. WAKEUP_IN The WAKEUP_IN pin can be used to wake up the module from sleep mode. Drive WAKEUP_IN to low voltage level and keep it low to wake up the module from sleep mode. The WAKEUP_IN pin is internally pulled up by default. CC200A-LB_Hardware_Design 25 / 58 I2C_SDAI2C_SCLGNDI2C_SDAI2C_SCL GNDSensorVDD_EXT4.7k4.7kModule Satellite Communication Module Series Table 10: Pin Description of WAKEUP_IN Interface Pin Name Pin No. I/O Description Comment WAKEUP_IN 4 DI Pull down to wake up the module Internally pulled up. A reference design is shown in the figure below. Figure 10: WAKEUP_IN Reference Design 4.4.2. BOOT The BOOT pin can be used to set the module to the boot download mode. It is pulled down internally by default. While keeping the pin floating during startup, the module enters the normal operating mode. If the pin is kept at high level for about 100 ms during startup, the module enters the boot download mode. Table 11: Pin Description of BOOT Pin Name Pin No. I/O Description Comment BOOT 26 DI Pull up to force the module into boot download mode Internally pulled down to GND Table 12: Operating Modes Voltage Level Operating Mode Comment Low High Normal Default Boot download If the pin is kept at high level more than 100 ms during startup, the module enters the boot download mode. CC200A-LB_Hardware_Design 26 / 58 WAKEUP_INMCUGPIOModuleWake up trigger4.7K47KQ1 Satellite Communication Module Series Figure 11: BOOT Pin State (Normal Operating Mode) Figure 12: BOOT Pin Control Sequence (Boot Download Mode) 4.4.3. RESET_N Drive RESET_N low at least 100 ms and then releasing it can reset the module. RESET_N signal is sensitive to interference, consequently it is recommended to route the trace as short as possible and surround it with ground. Table 13: Pin Description of RESET_N Pin Name Pin No. I/O Description Comment RESET_N 24 DI Reset the module Internally pulled up to 3.3 V. Active low. Test point is recommended to be reserved if unused. You can use an open drain/collector driver or a button to control RESET_N. CC200A-LB_Hardware_Design 27 / 58 VBATBOOTHighLowVBATBOOT100 msHighLow Satellite Communication Module Series Figure 13: Reference Design of Reset with Driving Circuit Figure 14: Reference Design of Reset with Button Figure 15: Timing of Reset CC200A-LB_Hardware_Design 28 / 58 RESET_N 100 msMCUGPIOModuleReset pulse4.7K47KQ1C1RESET_NModuleS2Close to S2TVS1KReset pulseR1C1Pull down 100 msRESET_NUARTValidValidInvalidInvalidVBAT 0 s Satellite Communication Module Series NOTE Ensure the capacitance on RESET_N is no more than 10 nF. 4.5. ADC Interface The module provides 2 ADC interfaces. To improve the accuracy of ADC, the trace of ADC interface should be surrounded by ground. Table 14: Pin Description of ADC Interface Pin Name Pin No. I/O Description Comment ADC0 ADC1 33 31 AI AI General-purpose ADC interface General-purpose ADC interface Max input 3.3 V. If unused, connect it to GND directly. Table 15: Characteristics of ADC Interface Parameters Min. Typ. Max. Units ADC0 voltage range ADC1 voltage range ADC input resistance ADC resolution NOTE 0 0

14 3.3 3.3 1000

V V bits 1. The input voltage of every ADC interface should not exceed its corresponding voltage range. 2. It is prohibited to directly supply any voltage to ADC interface when the module is not powered by the VBAT. It is recommended to use resistor divider circuit for ADC interface application. Resistance of the external resistor divider should not exceed 1 k, or the measurement accuracy of ADC would be significantly reduced. 3. CC200A-LB_Hardware_Design 29 / 58 Satellite Communication Module Series 4.6. Indication Signal Table 16: Pins Description of Indication Signal Pin Name Pin No. NET_STATUS*

STATUS EVENT_IND*

7 3 10 I/O DO DO DO Description Indicate the modules network activity status Indicate the modules operation status Indicate the modules URC output status 4.6.1. Network Status Indication*

The module provides the NET_STATUS for the modules satellite network operation status indication. This is a digital output pin which can be used to indicate the connection status and communication status between the module and the communication satellite. Table 17: Network Status Indication Pin Level and Module Network Status Pin Name NET_STATUS Level Status Module Network Status NET_STATUS TBD TBD A reference design is shown in the figure below. Figure 16: Reference Design of Network Status Indication CC200A-LB_Hardware_Design 30 / 58 ModuleNET_STATUS4.7K47KQ1VBAT2.2K Satellite Communication Module Series 4.6.2. STATUS The STATUS is used for indicating modules operation status. It will output high level when the module is turned on. A reference design is shown in the figure below. Figure 17: Reference Design of STATUS 4.6.3. EVENT_IND*

The EVENT_IND is used as RI signal to notify the host when module has URC output. The module provides 3.3 V EVENT_IND signal. A voltage-level translator should be used if your application is equipped with a 1.8 V host GPIO interface. Figure 18: Reference Design of EVENT_IND CC200A-LB_Hardware_Design 31 / 58 ModuleSTATUS4.7K47KQ1VBAT2.2KModule EVENT_INDGPIOMCUVDD_MCU10 KVDD_MCU4.7 K1 nF Satellite Communication Module Series When module has URC output, the EVENT_IND pin will generate a low-level pulse to notify the host for processing. To avoid the failure of the host to receive URC in a sleep state, the URC output will be delayed by 120 ms after the RI signal wakes up the host. Figure 19: Behavior of EVENT_IND as RI Signal CC200A-LB_Hardware_Design 32 / 58 HIGHLOW120 msURC output Satellite Communication Module Series 5 RF Specifications 5.1. Antenna Interface 5.1.1. Antenna Interface & Frequency Bands Table 18: Pins Description of Antenna Interface Pin Name Pin No. I/O Description Comment ANT_SAT 51 AIO Satellite & GNSS antenna interface 50 characteristic impedance Table 19: LBand Frequency (Unit: MHz) Operating Frequency Transmit Receive LBand 1626.51660.5 15181559 Table 20: GNSS Frequency (Unit: MHz) Type GPS Frequency 1575.42 1.023 (L1) GLONASS 1597.51605.8 (L1) BDS Galileo 1561.098 2.046 (B1I) 1575.42 2.046 (E1) CC200A-LB_Hardware_Design 33 / 58 Satellite Communication Module Series 5.1.2. Reference Design of Passive Antenna Figure 20: Reference Design of Passive Antenna NOTE 1. To improve receiver sensitivity, ensure that the clearance among antennas is appropriate. 2. Use a type matching circuit for all the antenna interfaces for better RF performance and debugging. 3. Capacitors are not mounted by default. 4. Place the type matching components (C1, R1, C2) to antennas as close as possible. 5. Junction capacitance of ESD protection components on the antenna interface should not exceed 0.05 pF. 6. Passive antenna is recommended. If Active antenna is required, please contact Quectel Technical Support. 5.1.3. Requirements for Antenna Design Table 21: Requirements for Antenna Design Antenna Types Requirements Satellite & GNSS Frequency range:

Satellite Tx: 1626.51660.5 MHz Satellite Rx: 15181559 MHz GNSS Rx: 15591606 MHz RHCP polarization VSWR: < TBD (Typ.) For passive antenna usage:

Passive antenna gain: < TBD dBic CC200A-LB_Hardware_Design 34 / 58 ANT_SATR1 0RC1ModulePassiveAntennaNMC2NMESD Satellite Communication Module Series 5.2. Satellite LBand Network 5.2.1. Transmitting Power Table 22: RF Transmitting Power Band LBand Frequency (MHz) Typ. 1626.51660.5 32 dBm 1 dB Averaged power, tested with random modulated signal. CW power =31 dBm 1 dBm 5.2.2. Receiver Parameter Table 23: C/No and Rx gain Frequency (MHz) C/No (Typ.) Rx gain (Typ.) 39 dB/Hz 39.5 dB/Hz 39.5 dB/Hz 87 dB 87 dB 87 dB 1518 1538.5 1559 5.3. GNSS GNSS information of the module is as follows:

Supports GP S , GLONASS, BDS, Galileo positioning system. Supports NMEA 0183 protocol and outputs NMEA sentences via UART interface (data update rate for positioning: 110 Hz, 1 Hz by default). 5.3.1. GNSS Performance Table 24: GNSS Performance Parameter Specification Power Consumption 3

(GPS + GLONASS + Galileo + BDS) Acquisition Tracking Typ. TBD TBD Unit mA mA CC200A-LB_Hardware_Design 35 / 58 Satellite Communication Module Series Parameter Sensitivity

(GPS + GLONASS + Galileo + BDS) Specification Backup Mode Acquisition Reacquisition Tracking Cold Start TTFF 3 (without AGNSS) Warm Start Hot Start Cold Start TTFF 4 (with EASYTM) Warm Start Hot Start TTFF 4 (with Flash EPOTM) Cold Start Horizontal Position Accuracy 5 Accuracy of 1PPS Signal 3

Velocity Accuracy 3 Without Aid Acceleration Accuracy 3 Without Aid Dynamic Performance 3 Maximum Velocity Maximum Altitude Typ. TBD

-146

-158

-164 32 3 2 TBD TBD TBD TBD 2 TBD TBD TBD TBD TBD Maximum Acceleration TBD Unit A dBm dBm dBm s s s s s s s m ns m/s m/s m m/s g

. NOTE 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock of navigation signals (keep positioning for at least 3 minutes continuously). 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock of navigation signals within 3 minutes after loss of lock. 3. Acquisition sensitivity: the minimum GNSS signal power at which the module can fix position of navigation signals successfully within 3 minutes after executing cold start command. 4. Junction capacitance of ESD protection components on the antenna interface should not exceed 4 Open-sky. 5 CEP, 50 %, 24 hours static, -130 dBm, more than 6 SVs. CC200A-LB_Hardware_Design 36 / 58 Satellite Communication Module Series 5. 0.05 pF. It is recommended to use a passive GNSS antenna, as the use of active antenna may generate harmonics which will affect the GNSS performance. 5.3.2. AGNSS The module supports AGNSS feature that significantly reduces the modules TTFF, especially under lower signal conditions. To implement the AGNSS feature, the module should get the assistance data including the current time and rough position. 5.3.2.1. EASY The module supports the EASYTM technology to improve TTFF by providing ancillary information, such as ephemeris and almanac. The EASYTM technology works as an embedded software to accelerate TTFF by predicting satellite navigation messages from the received ephemeris. After receiving the broadcast ephemeris for the first time, the GNSS engine automatically calculates and predicts the orbit information for up to 3 subsequent days, and saves the predicted information in the internal memory. The GNSS engine will use the information for positioning if there is not enough information from satellites, resulting in improved positioning and TTFF. The EASYTM function reduces TTFF to 2 s in warm start. In this case, the backup domain should still be valid. To obtain enough broadcast ephemeris information from GNSS satellites, in strong-signal environments the GNSS module should keep tracking the information for at least 5 minutes after fixing the position. The EASYTM function is enabled by default. 5.3.2.2. EPO The module features a leading AGNSS technology called EPOTM, which assists the receiver to reduce the TTFF for up to 14 days. 5.4. RF Routing Guidelines When designing PCB, characteristic impedance of all RF traces should be controlled to 50 . Generally, the impedance of RF traces is determined by materials dielectric constant, trace width (W), spacing between RF traces and grounds (S) and height from the reference ground to the signal layer (H). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures when characteristic impedance of RF traces is controlled to 50 . CC200A-LB_Hardware_Design 37 / 58 Satellite Communication Module Series Figure 21: Microstrip Design on a 2-layer PCB Figure 22: Coplanar Waveguide Design on a 2-layer PCB Figure 23: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 24: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure better RF performance and reliability, the following conditions should be complied with in RF CC200A-LB_Hardware_Design 38 / 58 Satellite Communication Module Series layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 . GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. Clearance between RF pins and RF connector should be as short as possible, and all right-angle

(90) traces should be changed to the ones with the angle of 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, ground vias around RF traces and the reference ground can improve RF performance. The clearance between ground vias and RF traces should be at least twice the width of RF signal traces (2 W). Keep RF traces away from interference sources, and avoid intersection and paralleling between any traces on adjacent layers. For more details about RF layout, see document [3]. 5.5. RF Connector Recommendation If the RF connector is used for antenna connection, it is recommended to use MHF 4L receptacle provided by I-PEX. Figure 25: Dimensions of the Receptacle (Unit: mm) CC200A-LB_Hardware_Design 39 / 58 Satellite Communication Module Series MHF 4L series mated plugs listed in the following figure can be used to match the MHF 4L Receptacle. Figure 26: Specifications of Mated Plugs (Unit: mm) For more details, please visit http://www.i-pex.com. CC200A-LB_Hardware_Design 40 / 58 Satellite Communication Module Series 6 Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital pins of CC200A-LB module are listed in the table below. Table 25: Absolute Maximum Ratings Parameter VBAT_BB VBAT_RF Voltage at digital pins Voltage at ADC0 Voltage at ADC1 NOTE Min. Max. Unit

-0.3

-0.3

-0.3

-0.3

-0.3 8.0 8.0 3.63 3.63 3.63 V V V V V Stresses in excess of "Absolute Maximum Ratings" to the device may cause permanent damage. This product does not provide overvoltage or reverse voltage protection. Therefore, it is necessary to use appropriate protection diodes to keep the voltage spikes within the parameters given in the table above. CC200A-LB_Hardware_Design 41 / 58 Satellite Communication Module Series 6.2. Power Supply Ratings Table 26: Modules Power Supply Ratings Parameter Description Min. Typ. Max. Unit VBAT_BB Power supply for the modules baseband part 5.5 6.0 6.5 VBAT_RF Power supply for the modules RF part 5.5 6.0 6.5 V V 6.3. Operating and Storage Temperatures All specifications are based on an ambient temperature of +25 C. Extreme operating temperatures can significantly affect the specified values. Applications operating near the temperature limits should be tested to ensure the validity of the specification. Table 27: Recommended Operating Temperature Parameter Normal Operating Temperature 6 Extended Operating Temperature 6 Storage Temperature Min.

-35

-40

-40 Typ.

+25

+25

Max.

+75

+85

+90 6.4. Power Consumption Table 28: Power Consumption Modes Conditions OFF state Power off Working Mode Power on Avg. TBD TBD Max. TBD TBD Units A mA 6 To meet this operating temperature range requirements, it is necessary to ensure effective thermal dissipation, e.g., by adding passive or active heatsinks, heat pipes, vapor chambers, etc. CC200A-LB_Hardware_Design 42 / 58 Satellite Communication Module Series GNSS Mode AT+QMOD=2 Periodic Sleep Mode AT+QMOD=3 Deep Sleep Mode Satellite data transmission AT+QSCLK=1

& WAKEUP_IN HIGH

@ 31 dBm Satellite data reception

@ -132 dBm 42 TBD 200 1.3 180 48 TBD 2000 1.8 180 mA mA A A mA NOTE 1. The power consumption data above is for reference only, which may vary among different modules. For detailed information, contact Quectel Technical Support for the power consumption test report of the specific module. 2. When the module is in working mode, it can be switched to other modes. You cannot switch between GNSS mode, periodic sleep mode and deep sleep mode. See document [2] for more details. 6.5. Digital I/O Characteristics Table 29: Common I/O Characteristics (Unit: V) Parameter Description Min. Typ. Max. IO_Domain Digital IO Pin Domain Voltage VIL VIH VOL VOH Digital IO Pin Low-Level Input Voltage Digital IO Pin High-Level Input Voltage 2.31 Digital IO Pin Low-Level Output Voltage

Digital IO Pin High-Level Output Voltage 2.4 0 0 3.3 3.63

1.08 3.63 0.4 3.3 Table 30: VDD_EXT I/O Characteristics (Unit: V) Parameters Descriptions Min. Max. VIH High-level input voltage 0.7 VDD_EXT VDD_EXT + 0.3 CC200A-LB_Hardware_Design 43 / 58 Satellite Communication Module Series VIL VOH VOL Low-level input voltage

-0.3 0.3 VDD_EXT High-level output voltage VDD_EXT - 0.4 Low-level output voltage

0.4 6.6. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly, and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design. Table 31: ESD Characteristics (Temperature: 2530 C, Humidity: 40 5 %; Unit: kV) Test Point VBAT & GND ANT_SAT Other interfaces Contact Discharge Air Discharge 5 4 0.5 10 8 1 6.7. Thermal Dissipation The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and functions (such as RF output power, data rate, etc.) will be affected to a certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference:

Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. Follow the principles below when the heatsink is necessary:

- Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.

- Attach the heatsink to the shielding cover of the module; In general, the base plate area of the CC200A-LB_Hardware_Design 44 / 58 Satellite Communication Module Series heatsink should be larger than the module area to cover the module completely;

- Choose the heatsink with adequate fins to dissipate heat;

- Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module;

- Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. Figure 27: Placement and Fixing of the Heatsink Table 32: Recommended Junction Operating Temperature Range for Main Chips (Unit: C) BB PMU RFIC PA

-40 to +105

-40 to +125

-40 to +95

-40 to +175 CC200A-LB_Hardware_Design 45 / 58 PCBHeatsinkTIMModuleScrewTIMModuleHeatsinkPCB Satellite Communication Module Series 7 Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 28: Top and Side Dimensions CC200A-LB_Hardware_Design 46 / 58 Satellite Communication Module Series Figure 29: Bottom Dimensions NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. CC200A-LB_Hardware_Design 47 / 58 Satellite Communication Module Series 7.2. Recommended Footprint Figure 30: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. CC200A-LB_Hardware_Design 48 / 58 Satellite Communication Module Series 7.3. Top and Bottom Views Figure 31: Top and Bottom Views NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. CC200A-LB_Hardware_Design 49 / 58 Satellite Communication Module Series 8 Storage, Manufacturing & Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended storage condition: the temperature should be 23 5 C and the relative humidity should be 3560 %. 2. Shelf life (in a vacuum-sealed packaging): 12 months in recommended storage condition. The module is managed on a first-in, first-out basis. 3. Floor life: 168 hours 7 in a factory where the temperature is 23 5 C and relative humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow soldering or other high-temperature operations within 168 hours, and if the relative humidity is above 60 %, it is recommended to store the module for only 24 hours, so as to avoid the module being placed in the air for a long time and getting damp, which will affect the soldering quality. Otherwise, the module should be stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet) or requires vacuum-sealed packaging again. 4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the following circumstances:

The module is not stored in recommended storage condition;

Violation of the third requirement mentioned above;

Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;

Before module repairing. 5. If needed, the pre-baking should follow the requirements below:

The module should be baked for 24 hours at 120 5 C;

The module must be soldered to PCB within 24 hours after the baking, otherwise it should be 7 This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033. Do not unpack the modules in large quantities until they are ready for soldering. CC200A-LB_Hardware_Design 50 / 58 Satellite Communication Module Series put in a dry environment such as in a dry cabinet. NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the module. 8.2. Manufacturing and Soldering Since CC200A-LB is a two-piece module, the cover will be warped during the second SMT process. The current reflow soldering thermal profile is modified as follows based on that of smart modules. For more details, see document [4]. Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the module is recommended to be 0.150.2 mm. For more details, see document [4]. The recommended peak reflow temperature should be 235246 C, with 246 C as the absolute maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is suggested that the module should be mounted only after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below:

Figure 32: Recommended Reflow Soldering Thermal Profile CC200A-LB_Hardware_Design 51 / 58 Temp. (C)Reflow ZoneSoak Zone246200217235CDBA150100 Ramp-to-soak slope:02 C/s Cool-down slope:-10 C/s Ramp-up slope:01 C/s Satellite Communication Module Series Table 33: Recommended Thermal Profile Parameters Factor Soak Zone Recommended Value Ramp-to-soak slope 02 C/s Soak time (between A and B: 150 C and 200 C) 70120 s Reflow Zone 217235 C ramp-up slope Reflow time (D: over 217C) Max temperature 235217 C cool-down slope Reflow Cycle Max reflow cycle NOTE 01 C/s 4065 s 235246 C

-10 C/s 1 1. The above profile parameter requirements are for the measured temperature of the solder joints. Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements. 2. Due to the large-size form factor, to avoid excessive temperature change, which may cause excessive thermal deformation of the metal shielding frame and cover, it is recommended to reduce the ramp-up and cool-down slopes in the liquid phase of the solder paste. If possible, please choose a reflow oven with more than 10 temperature zones during production so that there are more temperature zones to set up to meet the optimal temperature curve. If a conformal coating is necessary for the module, do not use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 3. 4. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 5. Due to the complexity of the SMT process, contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective wave soldering, ultrasonic soldering) that is not mentioned in document [4]. CC200A-LB_Hardware_Design 52 / 58 Satellite Communication Module Series 8.3. Packaging Specification This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow:

8.3.1. Carrier Tape Dimension details are as follow:

Figure 33: Carrier Tape Dimension Drawing Table 34: Carrier Tape Dimension Table (Unit: mm) W 56 P 48 T A0 B0 0.4 38.5 37.5 K0 4.6 K1 5.6 F E 26.2 1.75 CC200A-LB_Hardware_Design 53 / 58 Satellite Communication Module Series 8.3.2. Plastic Reel Figure 34: Plastic Reel Dimension Drawing Table 35: Plastic Reel Dimension Table (Unit: mm) D1 330 D2 100 W 56.5 8.3.3. Mounting Direction Figure 35: Mounting Direction CC200A-LB_Hardware_Design 54 / 58 Satellite Communication Module Series 8.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use for protection. 1 plastic reel can load 200 modules. the protective tape Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 800 modules. Figure 36: Packaging Process CC200A-LB_Hardware_Design 55 / 58 Satellite Communication Module Series 9 Appendix References Table 36: Related Documents Document Name

[1] Quectel_SAT-A_EVB_User_Guide

[2] Quectel_CC200A-LB_Operating_Mode_Application_Note

[3] Quectel_RF_Layout_Application_Note

[4] Quectel_Module_SMT_Application_Note

[5] Quectel_CC200A-LB_AT_Commands_Manual Table 37: Terms and Abbreviations Abbreviation Description ADC AGNSS BDS bps C/No EASY EPO ESD PMOS GNSS GPS Analog-to-Digital Converter Assisted GNSS (Global Navigation Satellite System) BeiDou Navigation Satellite System Bits Per Second Carrier-to-noise Ratio Embedded Assist System Extended Prediction Orbit Electrostatic Discharge Positive channel MOSFET Global Navigation Satellite System Global Positioning System CC200A-LB_Hardware_Design 56 / 67 Satellite Communication Module Series GLONASS Global Navigation Satellite System (Russia) Galileo Galileo Satellite Navigation System (EU) IC I2C I/O Inom LED LGA LNA MCU PA PCB RAM RF Rx Tx UART VBAT Vmax Vnom Vmin VIHmax VIHmin VILmax VILmin Integrated Circuit Inter-Integrated Circuit Input/Output Nominal Current Light Emitting Diode Land Grid Array Low Noise Amplifier Microcontroller Unit Power Amplifier Printed Circuit Board Random Access Memory Radio Frequency Receive Transmit Universal Asynchronous Receiver Transmitter Voltage at Battery (Pin) Maximum Voltage Nominal Voltage Minimum Voltage Maximum High-level Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Minimum Low-level Input Voltage CC200A-LB_Hardware_Design 57 / 67 Satellite Communication Module Series VImax VImin VOHmax VOHmin VOLmax VOLmin Absolute Maximum Input Voltage Absolute Minimum Input Voltage Maximum High-level Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Minimum Low-level Output Voltage CC200A-LB_Hardware_Design 58 / 67 Satellite Communication Module Series OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k):

The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application End Product Labeling When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text:

Contains FCC ID: XMR2023CC200ALB Contains IC: 10224A-023CC200ALB. The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met. CC200A-LB_Hardware_Design 59 / 67 Satellite Communication Module Series Antenna

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-

location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed CC200A-LB_Hardware_Design 60 / 67 Satellite Communication Module Series Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual CC200A-LB_Hardware_Design 61 / 67 Satellite Communication Module Series Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. List of applicable FCC rules This module has been tested and found to comply with part 25 requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. CC200A-LB_Hardware_Design 62 / 67 Satellite Communication Module Series This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body. CC200A-LB_Hardware_Design 63 / 67 Satellite Communication Module Series Industry Canada Statement This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions:

(1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes:

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement."

Radiation Exposure Statement This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 30 cm between the radiator & your body Dclaration d'exposition aux radiations:

Cet quipement est conforme aux limites d'exposition aux rayonnements ISED tablies pour un environnement non contrl. Cet quipement doit tre install et utilis avec un minimum de 30 cm de distance entre la source de rayonnement et votre corps. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 30 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. CC200A-LB_Hardware_Design 64 / 67 Satellite Communication Module Series Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit tre installe de telle sorte qu'une distance de 30 cm est respecte entre l'antenne et les utilisateurs, et 2) Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:

In the event that these conditions cannot be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:

Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 30 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains IC: 10224A-023CC200ALB. Plaque signaltique du produit final CC200A-LB_Hardware_Design 65 / 67 Satellite Communication Module Series Ce module metteur est autoris uniquement pour une utilisation dans un dispositif o l'antenne peut tre installe de telle sorte qu'une distance de 30cm peut tre maintenue entre l'antenne et les utilisateurs. Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante:

"Contient des IC: 10224A-023CC200ALB ". CC200A-LB_Hardware_Design 66 / 67 Satellite Communication Module Series Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. CC200A-LB_Hardware_Design 67 / 67

QUECTEL append LB: .a1-c0ox CC200ALBAA-NO3-SGNNA ce FCC ID: XMR2023CC200ALB 1C:10224A-023CC200ALB SN:MP34567B90XXXXX Mobile 1D:01724816SKYCEOD it BUTUT nee it |! t} RR |

| at 0 OF A 09 OL Of 20 Nvdvf NI 30WW VANS TF 30 40 5

QUECCTEL Federal Communications Commission 7435 Oakland Mills Road Columbia MD 21046 Subject: Certification designating a U.S. agent for service of process pursuant to Part 2.911(d)(7) To whom it may concern, Quectel Wireless Solutions Company Limited, FRN: 0018988279, Grantee Code: XMR (the applicant) certifies that, as of the date of the filing of application, Ikotek USA, Inc., FRN: 0033350331 (the agent) is designated as the U.S. agent for the purpose of accepting service of process on behalf of the applicant. The physical U.S. address and email for the designated agent are:

Physical U.S. address: 9920 Pacific Heights Blvd., Ste. 150, #7025, San Diego, CA 92121 Email: compliance@ikotek.com The applicant accepts to maintain an agent for service of process in the United States for no less than one year after either the grantee has permanently terminated all marketing and importation of the applicable equipment within the U.S., or the conclusion of any Commission-related administrative or judicial proceeding involving the equipment, whichever is later. The agent accepts the designation by (the applicant) as the U.S. agent to accept service of process includes, but is not limited to, delivery of any correspondence, notices, orders, decisions, and requirements of administrative, legal, or judicial process related to Commission proceedings. Signed by the Applicant Signed by the Agent (if different from the Applicant) 7 he! Jean Hu Name: eterson Title Certification Manager Title: CEO. Email: Jean.hu@quectel.com Email: joe.peterson@ikotek.com Date: 07 July, 2023 Date: 07 July, 2023

< Quectel Wireless Solutions Co., Ltd >

Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: 2023-09-13 Ref: Attestation Statements Part 2.911(d)(5)(i) Filing and Part 2.911(d)(5)(ii) Filing FCC ID: XMR2023CC200ALB 1. Quectel Wireless Solutions Co., Ltd (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. 2. Quectel Wireless Solutions Co., Ltd (the applicant) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List (as a specifically named entity or any of its subsidiaries of affiliates) as an entity producing covered equipment. Sincerely, Name: Jean Hu Title: Certification Section Manager Email: jean.hu@quectel.com Date: 2023/11/06

Quectel Wireless Solutions Co., Ltd Confidentiality Request Letter Federal Communications Commission Authorization and Evaluation Division FCC ID: XMR2023CC200ALB Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, we hereby request confidential treatment of information accompanying this application as outlined below:

1. Block Diagram 2. Schematics 3. Operational Description 4. BOM List 5. Tune-up Procedure The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Rule 0.457, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely, _________________ Name: Jean Hu Title: Certification Section Manager Email: jean.hu@quectel.com Date:2023/11/14

Quectel Wireless Solutions Co., Ltd Declaration of Authorization We Name: Quectel Wireless Solutions Co., Ltd Address: Building 5, Shanghai Business Park PhaseIII (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China,200233 Declare that:

Name Representative of agent: Marlin Chen Agent Company name:

Address:

MRT Technology (Suzhou) Co., Ltd D8 Building, Youxin Industrial Park, No.2 Tian'edang Rd., Wuzhong Economic Development Zone Suzhou China City:

Country:

is authorized to apply for Certification of the following product(s):

Satellite Communication Module XMR2023CC200ALB CC200A-LB Product:

FCC ID:

Model No.:

Sincerely, ________________ Name: Jean Hu Title: Certification Section Manager Email: jean.hu@quectel.com Date:2023/11/06

Quectel Wireless Solutions Company Limited Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Request for Modular/Limited Modular Approval Date: 2023.11.06 Subject: Manufacturers Declaration for

- Modular Approval

- Split Modular Approval

- Limited Modular Approval - Limited Split Modular Approval FCC ID: XMR2023CC200ALB 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i) Requirement Met

- YES - NO(*) Details: <example The module contains a metal shield which covers all RF components and circuitry. The shield is located on the top of the board next to antenna connector>

2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii)

- YES - NO(*) Details: <example Data to the modulation circuit is buffered as described in the operational description provided with the application>

3. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii)

- YES - NO(*) Details: <example The module contains its own power supply regulation. Please refer to schematic filed with this application>

4. The modular transmitter must comply with the antenna and transmission system requirements of 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv)

- YES - NO(*) Details: <example The module connects to its antenna using an UFL connector which is considered a non-

standard connector. A list of antennas tested and approved with this device may be found in users manual provided with the application>

5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v)

- YES - NO(*) Details: <example The module was tested stand-alone as shown in test setup photographs filed with this application>

6. The modular transmitter must be labeled with its own FCC ID number, or use an electron display (see KDB Publication 784748). Modular Approval Requirement Requirement Met If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID:

XMR2023CC200ALB or Contains FCC ID: XMR2023CC200ALB Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi)

- YES - NO(*) Details: <example There is a label on the module as shown in the labeling exhibit filed with this application. Host specific labeling instructions are shown in the installation manual .filed with this application.>

7. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii)

- YES - NO(*) Details: <example The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application.>

8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1)(viii) Details: < The module meets RF exposure in mobile configuration.>

- YES - NO(*) 070920-02b Limited Module Description When Applicable

* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval

(LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA; the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: <example - N/A>

Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) Requirement 1. For non-Software Defined Radio transmitter modules where software is used to ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Requirement Met

- Provided in Separate Cover Letter

- N/A Details: <example The firmware of the device can not be modified or adjusted by the end user as described in a separate cover letter filed with this application. >

2. For Software Defined Radio (SDR) devices, transmitter module applications must provide a software security description; see KDB Publication 442812.

- Provided in Separate Cover Letter

- N/A Details: <example N/A>

Split Modular Requirements Requirement 1. For split modular transmitters, specific descriptions for secure communications between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained. Provided in Manual

- Provided in Separate Cover Letter

- N/A Details: <example N/A >

070920-02b OEM Integration Manual Guidance KDB 996369 D03 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. Requirement Is this module intended for sale to third parties?

- YES

- No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Items required to be in the manual See KDB 996369 D03, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 point systems, professional installation info a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for design verification, and production test procedures for ensuring compliance. If confidential, the method used to keep confidential must be identified and information provided in the operational description. 5. RF exposure considerations. KDB 996369 D03, Section 2.6 a. Clearly and explicitly state conditions that allow host manufacturers to use the module. Two types of instructions are necessary: first to the host manufacturer to define conditions (mobile, portable xx cm from body) and second additional text needed to be provided to the end user in the host product manuals. 6. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc note that omni-directional is not considered a type) 7. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product 8. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 a. Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. b. Provide information on how to configure test modes for evaluation 9. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10

- All Items shown to the left are provided in the Modular Integration Guide (or UM) for Full Modular Approval (MA) or LMA.

- An LMA applies and is approved ONLY for use by the grantee in their own products, and not intended for sale to 3rd parties as provided in a separate cover letter. Therefore the information shown to the left is found in the theory of operation. _____________ Name: Jean Hu Title: Certification Section Manager Email: jean.hu@quectel.com Date:2023/11/6 070920-02b

Quectel Wireless Solutions Co., Ltd Declaration of Conformity Federal Communications Commission Authorization and Evaluation Division FFCCCC IIDD:: XXMMRR22002233CCCC220000AALLBB Please be notified that we, the undersigned, QQuueecctteell WWiirreelleessss SSoolluuttiioonnss CCoo..,, LLttdd declares that the product which bears the above FCC ID is also compliant with the FCC requirements for sDOC. And the sDOC procedure shall be carried out prior to marketing the device in the US. Sincerely, _________________ Name: Jean Hu Title: Certification Section Manager Email: jean.hu@quectel.com Date:2023/11/06